寻找硅胶。用在投影仪的光学元件上。

  参数参考 Ulhk$CPA  
Curing W"724fwu&  
Pre-cure:    100oC for 15 minutes $v,dz_O*\  
Full cure:    100oC for 1 hour (minimum) 2`.cK 3  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin c~6>1w7SZ4  
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Mechanical Data }p=Jm)y  
1. Tensile strength:    800 psi (min) BMhy=+\  
2. Lap shear strength:    250 psi (min) H/,gro  
3. Elongation:        80% (min) R{RwTN<  
4. Hardness:        50 Shore D <m:m &I 8@  
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Thermal and Optical Data: ~a%Z;Aj  
1.  Working temperature range: -40oC – 230oC $J4 *U  
2.    Decomposition temperature:    onset at 3000C (by TGA) J5*tJoCYS  
3.    No change in modulus with temperature 8m5p_\&  
4.    CTE ~ 200 ppm/oC Q)"C&)`l  
5.    Refractive index:        1.43 WegtyO  
6.    Transmittance(%)    >90  @260-700nm n-5W*zk1  
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