寻找硅胶。用在投影仪的光学元件上。

  参数参考 O
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Curing 2QL?]Vo  
Pre-cure:    100oC for 15 minutes 6A?8tm/0  
Full cure:    100oC for 1 hour (minimum) IT18v[-G  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin x9&p!&*&IT  
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Mechanical Data `c9'0*-  
1. Tensile strength:    800 psi (min) -=a[J;'q  
2. Lap shear strength:    250 psi (min) nE$ f  
3. Elongation:        80% (min) zqf[Z3  
4. Hardness:        50 Shore D T pD;  
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Thermal and Optical Data: !W /C[$E  
1.  Working temperature range: -40oC – 230oC Bzw19S6y
 
2.    Decomposition temperature:    onset at 3000C (by TGA) ?A&%Cwj  
3.    No change in modulus with temperature {E~Xd  
4.    CTE ~ 200 ppm/oC %J!NL0x_  
5.    Refractive index:        1.43 [,b)YjO~Xd  
6.    Transmittance(%)    >90  @260-700nm @vt$MiOi  
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