寻找硅胶。用在投影仪的光学元件上。

  参数参考 HdRwDW@7=  
Curing -_BX\iP{  
Pre-cure:    100oC for 15 minutes PQ2rNY6  
Full cure:    100oC for 1 hour (minimum) ;sAe#b  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin >{[  
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Mechanical Data N<XMSt  
1. Tensile strength:    800 psi (min) ^t?vv;@}  
2. Lap shear strength:    250 psi (min) <6&Z5mpm$w  
3. Elongation:        80% (min) D*'sOB(  
4. Hardness:        50 Shore D =w7+Yt  
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Thermal and Optical Data: Q_`EKz;N{  
1.  Working temperature range: -40oC – 230oC b+$E*}  
2.    Decomposition temperature:    onset at 3000C (by TGA) +5Ju `Z  
3.    No change in modulus with temperature piFZu/~Gq\  
4.    CTE ~ 200 ppm/oC gOr%N!5  
5.    Refractive index:        1.43 "gt1pf~y  
6.    Transmittance(%)    >90  @260-700nm h0")NBRV&  
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