寻找硅胶。用在投影仪的光学元件上。

  参数参考 LAos0bc)w\  
Curing h\2}875  
Pre-cure:    100oC for 15 minutes dGa@<hg  
Full cure:    100oC for 1 hour (minimum) %-k(&T3&  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin !b'IfDp[-!  
gDMAc/V`l  
Mechanical Data a/QIJ*0  
1. Tensile strength:    800 psi (min) s?5d  
2. Lap shear strength:    250 psi (min) 6G$/NW=L  
3. Elongation:        80% (min) u9 %;{:]h  
4. Hardness:        50 Shore D i{P%{hVb  
~U/8 @gR  
Thermal and Optical Data: .$UTH@;7  
1.  Working temperature range: -40oC – 230oC U>bP}[&S  
2.    Decomposition temperature:    onset at 3000C (by TGA) \3L$I-]m  
3.    No change in modulus with temperature M&eQ=vew.  
4.    CTE ~ 200 ppm/oC Q})t<l+L  
5.    Refractive index:        1.43 icU"Vyu  
6.    Transmittance(%)    >90  @260-700nm QXsfp  
JXlTN[O  
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