寻找硅胶。用在投影仪的光学元件上。

  参数参考 -p.*<y  
Curing V0Z7o\-J  
Pre-cure:    100oC for 15 minutes n6-Ic',;  
Full cure:    100oC for 1 hour (minimum) ~snF20  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin M6'C3,y0  
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Mechanical Data +qj*P9  
1. Tensile strength:    800 psi (min) P"x-7>c>Y  
2. Lap shear strength:    250 psi (min) eqZ+no  
3. Elongation:        80% (min) nbASpa(  
4. Hardness:        50 Shore D )c*k_/4  
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Thermal and Optical Data: v$m[#&O^V?  
1.  Working temperature range: -40oC – 230oC *sB-scD  
2.    Decomposition temperature:    onset at 3000C (by TGA) 7+a%ehwU  
3.    No change in modulus with temperature ~y
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4.    CTE ~ 200 ppm/oC :pDY  
5.    Refractive index:        1.43 >I& jurU#  
6.    Transmittance(%)    >90  @260-700nm q Iy^N:C2'  
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