寻找硅胶。用在投影仪的光学元件上。

  参数参考 -=v/p*v0o  
Curing d=c1WK  
Pre-cure:    100oC for 15 minutes *h5ldP  
Full cure:    100oC for 1 hour (minimum) Aspj*CDu  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 8)ebXc  
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Mechanical Data  5K_N  
1. Tensile strength:    800 psi (min) p8}5x 2F  
2. Lap shear strength:    250 psi (min) H*:r>
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3. Elongation:        80% (min) =4w^)'/  
4. Hardness:        50 Shore D )ZuQ;p  
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Thermal and Optical Data: 04T*\G^:=  
1.  Working temperature range: -40oC – 230oC LYxlo<f  
2.    Decomposition temperature:    onset at 3000C (by TGA) F%ylR^H>  
3.    No change in modulus with temperature l#5k8+s  
4.    CTE ~ 200 ppm/oC Sv^'CpQ  
5.    Refractive index:        1.43 [gg7Z|Hu  
6.    Transmittance(%)    >90  @260-700nm >sl1 cC  

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