寻找硅胶。用在投影仪的光学元件上。

  参数参考 ZzY6M"eUXD  
Curing BRT2=}A  
Pre-cure:    100oC for 15 minutes fQ@["b  
Full cure:    100oC for 1 hour (minimum) DBRT
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Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin +Aq}BjD#  
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Mechanical Data 2zAS \Y  
1. Tensile strength:    800 psi (min) '?nhpT^  
2. Lap shear strength:    250 psi (min) mi+I)b=  
3. Elongation:        80% (min) q0o6%c:gW  
4. Hardness:        50 Shore D pAYuOk9n  
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Thermal and Optical Data: juM?y'A  
1.  Working temperature range: -40oC – 230oC }5|uA/B  
2.    Decomposition temperature:    onset at 3000C (by TGA) :7maN^  
3.    No change in modulus with temperature 5E]I  
4.    CTE ~ 200 ppm/oC d+kI
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5.    Refractive index:        1.43 fa)G$Q  
6.    Transmittance(%)    >90  @260-700nm +Z+]Tqo  
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