寻找硅胶。用在投影仪的光学元件上。

  参数参考 e` Z;}& ,  
Curing (Gr8JpV  
Pre-cure:    100oC for 15 minutes j|gQe .,1  
Full cure:    100oC for 1 hour (minimum) wvBx]$SC  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin )8VrGg?  
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Mechanical Data u&yAMWl  
1. Tensile strength:    800 psi (min) }
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2. Lap shear strength:    250 psi (min) [* ,k  
3. Elongation:        80% (min) Wjc1EW!2x  
4. Hardness:        50 Shore D ~Mbo`:>(4v  
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Thermal and Optical Data: 8z0j}xY%  
1.  Working temperature range: -40oC – 230oC rCU f,)  
2.    Decomposition temperature:    onset at 3000C (by TGA) T;K@3]FbX  
3.    No change in modulus with temperature 4Xi _[ Xf  
4.    CTE ~ 200 ppm/oC Wj.f
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5.    Refractive index:        1.43 @{*z1{  
6.    Transmittance(%)    >90  @260-700nm by!1L1[JTt  
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