寻找硅胶。用在投影仪的光学元件上。

  参数参考 ~u&gU1}  
Curing &dtst??  
Pre-cure:    100oC for 15 minutes ]@ruizb8  
Full cure:    100oC for 1 hour (minimum) 9)wYSz'  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 0si1:+t-[+  
DKf(igw  
Mechanical Data >@7$=Y>D  
1. Tensile strength:    800 psi (min) [W3X$r~-  
2. Lap shear strength:    250 psi (min) Qyw
@ r  
3. Elongation:        80% (min) lpXGsKH2  
4. Hardness:        50 Shore D [gT}<W  
pVc+}Wzh  
Thermal and Optical Data: j&X&&=   
1.  Working temperature range: -40oC – 230oC =803rNe  
2.    Decomposition temperature:    onset at 3000C (by TGA) x*H#?.E  
3.    No change in modulus with temperature m[eqTh4*  
4.    CTE ~ 200 ppm/oC 9s<4`oa  
5.    Refractive index:        1.43 1 !_p  
6.    Transmittance(%)    >90  @260-700nm H$Kc~#=  
1_t+lJI9j  
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