寻找硅胶。用在投影仪的光学元件上。

  参数参考 y?_tSnDK  
Curing g#Zb}^  
Pre-cure:    100oC for 15 minutes nITr
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Full cure:    100oC for 1 hour (minimum) ]9R?2{"K  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin T_5 E  
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Mechanical Data ?#,\,  
1. Tensile strength:    800 psi (min) gA" =so  
2. Lap shear strength:    250 psi (min) \n`UkxZn+  
3. Elongation:        80% (min) ~ Z%>N  
4. Hardness:        50 Shore D #)my)}o\p  
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Thermal and Optical Data: |+suGqo  
1.  Working temperature range: -40oC – 230oC Da?0B9'  
2.    Decomposition temperature:    onset at 3000C (by TGA) m4>v S  
3.    No change in modulus with temperature @<>](4D  
4.    CTE ~ 200 ppm/oC Qy0bp;V/  
5.    Refractive index:        1.43 G1$DVGo  
6.    Transmittance(%)    >90  @260-700nm fCx~K'UWn  
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