寻找硅胶。用在投影仪的光学元件上。

  参数参考 dk4D+*R  
Curing %%x0w^  
Pre-cure:    100oC for 15 minutes !3?~#e{_  
Full cure:    100oC for 1 hour (minimum) \d$Rd")w  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin .r*#OUC  
a'^0.1  
Mechanical Data xx6S`R6:  
1. Tensile strength:    800 psi (min) ,N;v~D$Y  
2. Lap shear strength:    250 psi (min) 2@5A&b  
3. Elongation:        80% (min) +<B|qcT!  
4. Hardness:        50 Shore D :4]J
2U\@  
mOSCkp{<e  
Thermal and Optical Data: tKX}Ok:V%  
1.  Working temperature range: -40oC – 230oC 1::LN(`<  
2.    Decomposition temperature:    onset at 3000C (by TGA) \
@:j  
3.    No change in modulus with temperature |87W
*  
4.    CTE ~ 200 ppm/oC [^Q&suy  
5.    Refractive index:        1.43 -UTV:^  
6.    Transmittance(%)    >90  @260-700nm ef,F[-2^o  
$BaK'7=3*  
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