寻找硅胶。用在投影仪的光学元件上。

  参数参考 5/ee&sJR  
Curing &H`AS6  
Pre-cure:    100oC for 15 minutes "Y> #=>8  
Full cure:    100oC for 1 hour (minimum) L/U^1=Wi*O  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin z!<X{& e  
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Mechanical Data =@%Ukrd@  
1. Tensile strength:    800 psi (min) 'fqX^v5n  
2. Lap shear strength:    250 psi (min) nSM8o<)H  
3. Elongation:        80% (min) v%=@_`Ht  
4. Hardness:        50 Shore D IgsK7wn  
m@z.H;  
Thermal and Optical Data: ~T{^7"q\  
1.  Working temperature range: -40oC – 230oC c89+}]mGq  
2.    Decomposition temperature:    onset at 3000C (by TGA) X(`wj~45VX  
3.    No change in modulus with temperature zv^km5by  
4.    CTE ~ 200 ppm/oC W@vt6v  
5.    Refractive index:        1.43 8)wxc1  
6.    Transmittance(%)    >90  @260-700nm @]rl2Qqe  
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