寻找硅胶。用在投影仪的光学元件上。

  参数参考 Zi<Y?Vm/,O  
Curing h mC.5mY  
Pre-cure:    100oC for 15 minutes cv})^E$x  
Full cure:    100oC for 1 hour (minimum) ,U
NCBnv1  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin <$7HX/P  
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Mechanical Data I?<5 %  
1. Tensile strength:    800 psi (min) plc
z m 2  
2. Lap shear strength:    250 psi (min) [C
TE"@A  
3. Elongation:        80% (min) ~\B1\ G  
4. Hardness:        50 Shore D k
]K][[s`  
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Thermal and Optical Data: v50w}w'  
1.  Working temperature range: -40oC – 230oC -9W)|toWb"  
2.    Decomposition temperature:    onset at 3000C (by TGA) P_6JweN  
3.    No change in modulus with temperature *i3\`;^=  
4.    CTE ~ 200 ppm/oC )nE=H,U?y  
5.    Refractive index:        1.43 :E`/z@I  
6.    Transmittance(%)    >90  @260-700nm O1]L4V1iH  
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