寻找硅胶。用在投影仪的光学元件上。

  参数参考 bjvi`jyL3k  
Curing }'@*Olj  
Pre-cure:    100oC for 15 minutes [6/%ynlP  
Full cure:    100oC for 1 hour (minimum) ~V./*CQ\c  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin ;c;;cJc!  
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Mechanical Data 9]7^/g*!  
1. Tensile strength:    800 psi (min) \7/xb{z|  
2. Lap shear strength:    250 psi (min) $hEX,  
3. Elongation:        80% (min) !MGQ+bD6  
4. Hardness:        50 Shore D 5,mb]v0k  
5k\61(*s  
Thermal and Optical Data: `q5*VqIhs  
1.  Working temperature range: -40oC – 230oC Z>X-ueV  
2.    Decomposition temperature:    onset at 3000C (by TGA) 54'z"S:W  
3.    No change in modulus with temperature h,#AY[Q  
4.    CTE ~ 200 ppm/oC `Zk?.1*2/  
5.    Refractive index:        1.43 TnKe"TA|9  
6.    Transmittance(%)    >90  @260-700nm 6~2
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