寻找硅胶。用在投影仪的光学元件上。

  参数参考 QWOPCoUet  
Curing et+lL"&

 
Pre-cure:    100oC for 15 minutes {*O%A  
Full cure:    100oC for 1 hour (minimum) w317]-n  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin >;4q  
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Mechanical Data I4N7wnBp  
1. Tensile strength:    800 psi (min) ?IAu,s*u  
2. Lap shear strength:    250 psi (min) `e,}7zGR  
3. Elongation:        80% (min) Z(6.e8fK  
4. Hardness:        50 Shore D `$f`55e  
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Thermal and Optical Data: #`3Q4  
1.  Working temperature range: -40oC – 230oC X&zGgP/  
2.    Decomposition temperature:    onset at 3000C (by TGA) ~JT2el2W7p  
3.    No change in modulus with temperature xK6`|/e  
4.    CTE ~ 200 ppm/oC + -Rf@  
5.    Refractive index:        1.43 {nmu(EP  
6.    Transmittance(%)    >90  @260-700nm y7UU'k`  
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