寻找硅胶。用在投影仪的光学元件上。

  参数参考 E#F/88(  
Curing pBw0"ff  
Pre-cure:    100oC for 15 minutes @'=Uq  
Full cure:    100oC for 1 hour (minimum) TFuR@KaBR  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin OaL\w D^  
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Mechanical Data ~gu3g^<0v  
1. Tensile strength:    800 psi (min) Sua[O$  
2. Lap shear strength:    250 psi (min) ~i.k$XGA  
3. Elongation:        80% (min) VAXT{s&4>  
4. Hardness:        50 Shore D V"!G2&  
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Thermal and Optical Data: |{@FMxn|q  
1.  Working temperature range: -40oC – 230oC wRrnniqf8  
2.    Decomposition temperature:    onset at 3000C (by TGA) 5?Wto4j  
3.    No change in modulus with temperature Lq>&d,F06)  
4.    CTE ~ 200 ppm/oC +NFzSal  
5.    Refractive index:        1.43 Dn>%%K@0  
6.    Transmittance(%)    >90  @260-700nm C^)
*Dsp  
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