寻找硅胶。用在投影仪的光学元件上。

  参数参考 e4V4%Q
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Curing ~
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Pre-cure:    100oC for 15 minutes tj ,*-).4%  
Full cure:    100oC for 1 hour (minimum) NW`.RGLI<  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin av(d0E}}b  
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Mechanical Data &rX..l  
1. Tensile strength:    800 psi (min) -}m#uUqI  
2. Lap shear strength:    250 psi (min) UlHRA[SCv  
3. Elongation:        80% (min) Hut au^l  
4. Hardness:        50 Shore D .[hQ#3)W  
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Thermal and Optical Data: mAFqA  
1.  Working temperature range: -40oC – 230oC /vl]Oa&U  
2.    Decomposition temperature:    onset at 3000C (by TGA) uD&!]E3  
3.    No change in modulus with temperature h94SLj]  
4.    CTE ~ 200 ppm/oC O/wl";-  
5.    Refractive index:        1.43
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6.    Transmittance(%)    >90  @260-700nm @^y/V@lDm  
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