寻找硅胶。用在投影仪的光学元件上。

  参数参考 e_c;D2'F  
Curing _RL-6jw#o  
Pre-cure:    100oC for 15 minutes !HjNx%o5<  
Full cure:    100oC for 1 hour (minimum) DGZY~(]  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin %^5@z1d,  
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Mechanical Data 51M^yG&M  
1. Tensile strength:    800 psi (min) 1:x
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2. Lap shear strength:    250 psi (min) <VaMUm<2  
3. Elongation:        80% (min) Pb8Z))9j  
4. Hardness:        50 Shore D "8muMa8Q%  
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Thermal and Optical Data: &u1g7# #  
1.  Working temperature range: -40oC – 230oC y /:T(tk$  
2.    Decomposition temperature:    onset at 3000C (by TGA) xOL)Pjo/m  
3.    No change in modulus with temperature CC>fm1#i\  
4.    CTE ~ 200 ppm/oC uB<F.!3  
5.    Refractive index:        1.43 4
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6.    Transmittance(%)    >90  @260-700nm ljJz#+H2_  
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