寻找硅胶。用在投影仪的光学元件上。

  参数参考 |qpFR)l  
Curing y:Aha#<
 
Pre-cure:    100oC for 15 minutes Ru4M7%  
Full cure:    100oC for 1 hour (minimum) #x \YA#~  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin "G@(Cb*+T  
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Mechanical Data svtqX-Vj"  
1. Tensile strength:    800 psi (min) Tt4Q|"CJA  
2. Lap shear strength:    250 psi (min) -FW
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3. Elongation:        80% (min) eu'~(_2  
4. Hardness:        50 Shore D 8y;gs1d;A  
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Thermal and Optical Data: 3rX40>Cs8  
1.  Working temperature range: -40oC – 230oC p!K^Q3kO  
2.    Decomposition temperature:    onset at 3000C (by TGA) GU]kgwSfi  
3.    No change in modulus with temperature I8k+Rk*  
4.    CTE ~ 200 ppm/oC uw(Ml=  
5.    Refractive index:        1.43 "bz]5c~  
6.    Transmittance(%)    >90  @260-700nm -B#K}xL|x  
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