寻找硅胶。用在投影仪的光学元件上。

  参数参考 Vr^n1sgE}r  
Curing 7Z\--=;|[:  
Pre-cure:    100oC for 15 minutes <b`E_  
Full cure:    100oC for 1 hour (minimum) P3)Nl^/  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin  @Z\,q's  
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Mechanical Data {f2S/$q  
1. Tensile strength:    800 psi (min) clL2k8VS  
2. Lap shear strength:    250 psi (min)
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3. Elongation:        80% (min) Y&d00  
4. Hardness:        50 Shore D jv%kOovj  
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Thermal and Optical Data: t\{'F7  
1.  Working temperature range: -40oC – 230oC ktFhc3);!  
2.    Decomposition temperature:    onset at 3000C (by TGA) \Zqng  
3.    No change in modulus with temperature
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4.    CTE ~ 200 ppm/oC lOuHVa*}  
5.    Refractive index:        1.43 +;N2p1ZBf  
6.    Transmittance(%)    >90  @260-700nm E_])E`BJ  
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