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真空术语 "?S#vUS+ 2
!8A5Y[(XD
1.标准环境条件 standard ambient condition: 9td(MZ%i~N
2.气体的标准状态 standard reference conditions forgases: >2C;5ba
3.压力(压强)p pressure: h2BD?y
4.帕斯卡Pa pascal: BM3)`40[]
5.托Torr torr: i&bttSRNV
6.标准大气压atm standard atmosphere: z+\>e~U6J}
7.毫巴mbar millibar: 49kY]z|"w
8.分压力 partial pressure: hnY^Z_v!
9.全压力 total pressure: Y*AHwc<w`
10.真空 vacuum: A!^,QRkRN
11.真空度 degree of vacuum: 5?I]\Tb
12.真空区域 ranges of vacuum: 8?)Da&+f
13.气体 gas: -u9{R \S
14.非可凝气体 non-condensable gas: S%T1na^x
15.蒸汽vapor: hB^"GYZ
16.饱和蒸汽压saturation vapor pressure: 9B%"7MVn
17.饱和度degree of saturation: jgO{DNe(=
18.饱和蒸汽saturated vapor: ER|5_
19.未饱和蒸汽unsaturated vapor: Q;^([39DI
20.分子数密度n,m-3 number density of molecules: c9ZoO;
21.平均自由程ι、λ,m mean free path: -51L!x}1c
22.碰撞率ψ collision rate: IM@Qe|5
23.体积碰撞率χ volume collision rate: HL!-4kN
<$
24.气体量G quantity of gas: \o3i9Q9C
25.气体的扩散 diffusion of gas: I7Eg$J&
26.扩散系数D diffusion coefficient; diffusivity: }0!\%7-Q
27.粘滞流 viscous flow: woR)E0'qx
28.粘滞系数η viscous factor: O;zW'*c+
29.泊肖叶流 poiseuille flow: dZYS5_wr
30.中间流 intermediate flow: $zbg
31.分子流 molecular flow: xGH%4J\
32克努曾数 number of knudsen: L_A|
33.分子泻流 molecular effusion; effusive flow: p1D-Q7F
34.流逸 transpiration: "?il07+w%
35.热流逸 thermal transpiration: Nyo6R9^
36.分子流率qN molecular flow rate; molecular flux: ilHj%h*z
37.分子流率密度 molecular flow rate density; density of molecular flux: # K-Q/*
38.质量流率qm mass flow rare: rms&U)?
39.流量qG throughput of gas: ,onv
`
40.体积流率qV volume flow rate: );*GOLka
41.摩尔流率qυ molar flow rate: {:dE_tqo
42.麦克斯韦速度分布 maxwellian velocity distribution: dG|\geD
43.传输几率Pc transmission probability: %8-S>'g'
44.分子流导CN,UN molecular conductance: 5QT9
45.流导C,U conductance: mR{0*<
46.固有流导Ci,Ui intrinsic conductance: Gmc"3L
47.流阻W resistance: LnL<WI*Pq
48.吸附 sorption: 1|]-F;b
49.表面吸附 adsorption: D\TL6"wo
50.物理吸附physisorption: V{*9fB#4L
51.化学吸附 chemisorption: \"*l:x-u
52.吸收absorption: ILpB:g
53.适应系数α accommodation factor: 1`uIjXr(
54.入射率υ impingement rate: !hc7i=V?
55.凝结率condensation rate: aL`pvsnF
56.粘着率 sticking rate: <)&ykcB
57.粘着几率Ps sticking probability: {.2C>p
58.滞留时间τ residence time: uu/MXID
59.迁移 migration: }s|v-gRM{
60.解吸 desorption: )I<.DN&
61.去气 degassing: K0v,d~+]
62.放气 outgassing: w_Ls.K5"
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 6`s[PKP.
64.蒸发率 evaporation rate: ^aC[ZP:
65.渗透 permeation: BkJcT
66.渗透率φ permeability: Vz,WPm$I
67.渗透系数P permeability coefficient E=B9FIx~<
2. 1.真空泵 vacuum pumps }I;W
1-1.容积真空泵 positive displacement pump: Du{]r[[C
⑴.气镇真空泵 gas ballast vacuum pump: <FJ#Hy+
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: v#X? KqD
⑶.干封真空泵 dry-sealed vacuum pump: PM|K*,3J
⑷.往复真空泵 piston vacuum pump: (5I]um tge
⑸.液环真空泵 liquid ring vacuum pump: OW.ckYt%
⑹.旋片真空泵 sliding vane rotary vacuum pump: PFc02 w
⑺.定片真空泵 rotary piston vacuum pump: Fivv#4YO
⑻.滑阀真空泵 rotary plunger vacuum pump: v3/cNd3
⑼.余摆线真空泵 trochoidal vacuum pump: vZKo&jUk
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ooq>/OI0
⑾.罗茨真空泵 roots vacuum pump: V-
vVb
1-2.动量传输泵 kinetic vacuum pump: a2i
⑴.牵引分子泵molecular drag pump: l^vq'<kI
⑵.涡轮分子泵turbo molecular pump: +j<Nu)0iY
⑶.喷射真空泵ejector vacuum pump: sv[)?1S
⑷.液体喷射真空泵liquid jet vacuum pump: SUx0!_f*R
⑸.气体喷射真空泵gas jet vacuum pump: -{w&ya4X
⑹.蒸汽喷射真空泵vapor jet vacuum pump : J3'"-,Hv
⑺.扩散泵diffusion pump : rd"]$_P8O
⑻.自净化扩散泵self purifying diffusion pump: <ya3|ycnS
⑼.分馏扩散泵 fractionating diffusion pump : EmH{G
⑽.扩散喷射泵diffusion ejector pump : hZFbiGQr\
⑾.离子传输泵ion transfer pump: %mq]M
1-3.捕集真空泵 entrapment vacuum pump: o0/03O
⑴吸附泵adsorption pump: Sb`>IlT\#
⑵.吸气剂泵 getter pump: '[HFIJ0K!
⑶.升华(蒸发)泵 sublimation (evaporation)pump : X=JSqO6V9
⑷.吸气剂离子泵getter ion pump: m$o|s1t
⑸.蒸发离子泵 evaporation ion pump: w&H
?; 1
⑹.溅射离子泵sputter ion pump: w7
QIKsI0
⑺.低温泵cryopump: $'&5gFr9
T#( s2
2.真空泵零部件 $+mmqc8
2-1.泵壳 pump case: IlE!
zRA
2-2.入口 inlet: '`RCNk5l
2-3.出口outlet: +<iw|vr
2-4.旋片(滑片、滑阀)vane; blade : 4@bL` L)
2-5.排气阀discharge valve: IOJ fv8
2-6.气镇阀gas ballast valve: >S~ #E,Tg
2-7.膨胀室expansion chamber: Q~]R#S
2-8.压缩室compression chamber: qV^H vZJ
2-9.真空泵油 vacuum pump oil: qBpY3]/
2-10.泵液 pump fluid: uwIZzz
2-11.喷嘴 nozzle: w3& F e=c
2-13.喷嘴扩张率nozzle expansion rate: )jH"6my_
2-14.喷嘴间隙面积 nozzle clearance area : Zj},VB*T
2-15.喷嘴间隙nozzle clearance: K.cNx
2-16.射流jet: |e9}G,1
2-17.扩散器diffuser: Yd,*LYd2EL
2-18.扩散器喉部diffuser thoat: ;Y~;G7
2-19.蒸汽导管vapor tube(pipe;chimney): w@"|S_E
2-20.喷嘴组件nozzle assembly: r^@*Cir
2-21.下裙skirt: 3v {GP>
G,XFS8{%
3.附件 8kqxr&,[
3-1阱trap: }^QY<Cp|
⑴.冷阱 cold trap: UdY9*k
⑵.吸附阱sorption trap: -_2=NA?t
⑶.离子阱ion trap: P#yS]F/
⑷.冷冻升华阱 cryosublimation trap: TX*P*-'
3-2.挡板baffle: Z|7Y1W[
3-3.油分离器oil separator: LAr6J
3-4.油净化器oil purifier: Q0r_+0[7j
3-5.冷凝器condenser: l&C%oW
;bZ)q
4.泵按工作分类 :H?p^d
e
4-1.主泵main pump: {o]OxqE@
4-2.粗抽泵roughing vacuum pump: a.gu
4-3.前级真空泵backing vacuum pump: E]gKJVf9[
4-4.粗(低)真空泵 roughing(low)vacuum pump:
e%qMrR
4-5.维持真空泵holding vacuum pump: 7f`jl/
4-6.高真空泵high vacuum pump: plp).Gq
4-7.超高真空泵ultra-high vacuum pump: C4n5U^
4-8.增压真空泵booster vacuum pump: `j<'*v
zo
7{b|+0W
5.真空泵特性 Z1>pOJm
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: qV(Plt%
5-2.真空泵的抽气量Q throughput of vacuum pump:。 Kj-`ru
5-3.起动压力starting pressure: <(
MBs$b
5-4.前级压力 backing pressure : [szwPNQ_
5-5.临界前级压力 critical backing pressure: !E*-\}[
5-6.最大前级压力maximum backing pressure: iBc(
@EJ
5-7.最大工作压力maximum working pressure:
0.Iw/e
5-8.真空泵的极限压力ultimate pressure of a pump: eDy}_By^
5-9.压缩比compression ratio: 2x`#
f0[
5-10.何氏系数Ho coefficient: V^f'4*~'
5-11.抽速系数speed factor: H%/$Rqg
5-12.气体的反扩散back-diffusion of gas: `yxk
Sb
5-13.泵液返流back-streaming of pump fluid: FS20OD
5-14.返流率back-streaming rate ?49wq4L;a
5-15.返迁移back-migration: - BocWq\
5-16.爆腾bumping: TM"i9a? ;
5-17.水蒸气允许量qm water vapor tolerable load: S#ven&
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: 'T.> oP0>
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: "r|O /
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 4[5Z>2w
3. 1.一般术语 a#mdD:,cF
1-1.压力计pressure gauge: GHoPv-#
1-2.真空计vacuum gauge: K{0mb
⑴.规头(规管)gauge head: @5kN
L~2
⑵.裸规nude gauge : tw.%'oJ7
⑶.真空计控制单元gauge control unit : M ,<%j
⑷.真空计指示单元gauge indicating unit : m@yaF:
R
Pl 5+Oo
2.真空计一般分类 mT~:k}u~W
2-1.压差式真空计differential vacuum gauge: m2 OP=z@)
2-2.绝对真空计 absolute vacuum gauge: (apAUIE
2-3.全压真空计total pressure vacuum gauge: VNMhtwmK,
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: D'</eJ
2-5.相对真空计relative vacuum gauge : <iTaJa$0m
578Dl(I#)
3.真空计特性 / P{f#rV5
3-1.真空计测量范围pressure range of vacuum gauge: 2Ejs{KUj
3-2.灵敏度系数sensitivity coefficient: P+]39p{
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): M>'-P
3-5.规管光电流photon current of vacuum gauge head: [y'jz~9c
3-6.等效氮压力equivalent nitrogen pressure : kWr*+3Xq
3-7.X射线极限值 X-ray limit: )+ S" `
3-8.逆X射线效应anti X-ray effect: Q PGssQR6
3-9.布利尔斯效应blears effect: s=28.
o{:D
4.全压真空计 ##FN0|e&
4-1.液位压力计liquid level manometer: AR)&W/S)7,
4-2.弹性元件真空计elastic element vacuum gauge: &&tQ,5H5
4-3.压缩式真空计compression gauge: *X,vu2(I-=
4-4.压力天平pressure balance: in%+)`'nH7
4-5.粘滞性真空计viscosity gauge : YwKY3kL
4-6.热传导真空计thermal conductivity vacuum gauge : f9#B(4Tgi
4-7.热分子真空计thermo-molecular gauge: =WN6Fj`
4-8.电离真空计ionization vacuum gauge: ~C[R%%Gu
4-9.放射性电离真空计radioactive ionization gauge: `33+OW
4-10.冷阴极电离真空计cold cathode ionization gauge: |~'{ [?a*
4-11.潘宁真空计penning gauge: Oa*/jZjr
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: F!.@1Fi1
4-13.放电管指示器discharge tube indicator: ncu>
@K$n
4-14.热阴极电离真空计hot cathode ionization gauge: B9+oI cO
4-15.三极管式真空计triode gauge: Inr ~9hz
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: "WK.sBFz4
4-17.B-A型电离真空计Bayard-Alpert gauge: jb77uH_
4-18.调制型电离真空计modulator gauge: Th@L68
4-19.抑制型电离真空计suppressor gauge: {KODwP'~
4-20.分离型电离真空计extractor gauge: II),m8G
4-21.弯注型电离真空计bent beam gauge: ?2Bp^3ytJ
4-22.弹道型电离真空计 orbitron gauge : `qX'9e3VP+
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ^2Op?J
CM7j^t
5.分压真空计(分压分析器) '9i:b]Hru
5-1.射频质谱仪radio frequency mass spectrometer: e}7qZ^
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: h/PWi<R
i
5-3.单极质谱仪momopole mass spectrometer: 5$N4<Lo7
5-4.双聚焦质谱仪double focusing mass spectrometer: :#b[gWl0Ru
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: u\>Ed9^
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: /k7`TUK
5-7.回旋质谱仪omegatron mass spectrometer: Pbz-I3+66
5-8.飞行时间质谱仪time of flight mass spectrometer: F*hs3b0Db
$JcU0tPq0
6.真空计校准 _RhCVoeB
6-1.标准真空计reference gauges: ~)WE
6-2.校准系统system of calibration: l6)*u[}E
6-3.校准系数K calibration coefficient: 3\6jzD
6-4.压缩计法meleod gauge method: fz,8 <
6-5.膨胀法expansion method: Q +qN`
6-6.流导法flow method: 6`F_js.a
4. 1.真空系统vacuum system dZv-lMYBE
1-1.真空机组pump system: XKMJsEPsW
1-2.有油真空机组pump system used oil : 4uDz=B+8y
1-3.无油真空机组oil free pump system \'j%q\Bl;
1-4.连续处理真空设备continuous treatment vacuum plant: #2Mz.=#G
1-5.闸门式真空系统vacuum system with an air-lock: jr'O4bo%
1-6.压差真空系统differentially pumped vacuum system: YdIV_&-W
1-7.进气系统gas admittance system: ~pwp B2c
jG8ihi
2.真空系统特性参量 R (4 :_ xc
2-1.抽气装置的抽速volume flow rate of a pumping unit : c5^i5de
2-2.抽气装置的抽气量throughput of a pumping unit : Vk8:;Hj
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: (;cbgHo%}
2-4.真空系统的漏气速率leak throughput of a vacuum system: ,I'Y)SLx
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: #^#N%_8
2-6.极限压力ultimate pressure: ;V`~'357%
2-7.残余压力residual pressure: 8v c4J5
2-8.残余气体谱residual gas spectrum: 1+Ja4`o,iS
2-9.基础压力base pressure: Y~bp:FkS
2-10.工作压力working pressure: wGAN"K:e
2-11.粗抽时间roughing time: Ewu 7tq Z
2-12.抽气时间pump-down time: Ow mI*`
2-13.真空系统时间常数time constant of a vacuum system: SIzW3y[
2-14.真空系统进气时间venting time: CP/`ON
aCy2.Qn
3.真空容器 W<k) '|
3-1.真空容器;真空室vacuum chamber: 8`9!ocrM
3-2.封离真空装置sealed vacuum device: e-\J!E'1F
3-3.真空钟罩vacuum bell jar: T3+hxS
3-4.真空容器底板vacuum base plate: J'Gn M?M
3-5.真空岐管vacuum manifold: o^7}H{AE
3-6.前级真空容器(贮气罐)backing reservoir: x~A""*B~
3-7.真空保护层outer chamber: )T
3y ,*
3-8.真空闸室vacuum air lock: P g7W:L7
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: ?OlYJ/!z3
pOGVD
4.真空封接和真空引入线 &+JV\
4-1.永久性真空封接permanent seal : GS \-
4.2.玻璃分级过渡封接graded seal : }JAg<qy}
4-3.压缩玻璃金属封接compression glass-to-metal seal: S\s1}`pNm
4-4.匹配式玻璃金属封接matched glass-to-metal seal: ub./U@1
4-5.陶瓷金属封接ceramic-to-metal seal: Qx'a+kLu9
4-6.半永久性真空封接semi-permanent seal : ;]+kC
4-7.可拆卸的真空封接demountable joint: =-`X61];M
4-8.液体真空封接liquid seal n"d~UV^Uw
4-9.熔融金属真空封接molten metal seal: /V-7 u
4-10.研磨面搭接封接ground and lapped seal: e2k!5OS
4-11.真空法兰连接vacuum flange connection: rJKX4,M
4-12.真空密封垫vacuum-tight gasket: (Q\QZu@
4-13.真空密封圈ring gasket: 23&;28)8
4-14.真空平密封垫flat gasket: :n{rVn}G
4-15.真空引入线feedthrough leadthrough: NNb17=q_v
4-16.真空轴密封shaft seal: hjaI&?w
4-17.真空窗vacuum window: a{el1_DIGK
4-18.观察窗viewing window: rh/3N8[6
Z9 }qds6 y
5.真空阀门 =}u;>[3
5-1.真空阀门的特性characteristic of vacuum valves: }a-ikFQ]
⑴.真空阀门的流导conductance of vacuum valves: I)O%D3wfMW
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: IcI y
5-2.真空调节阀regulating valve: |4x&f!%m
5-3.微调阀 micro-adjustable valve: VqbMFr<k
5-4.充气阀charge valve: Su-LZ'C\
5-5.进气阀gas admittance valve: ;m@>v?zE
5-6.真空截止阀break valve: L&q~5 9
5-7.前级真空阀backing valve: ;@
%~eIlu
5-8.旁通阀 by-pass valve: 31<hn+pE&
5-9.主真空阀main vacuum valve: E&GUg/d
5-10.低真空阀low vacuum valve: +!'6:F
5-11.高真空阀high vacuum valve: ;(TBg-LEK
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: &h8+-
5-13.手动阀manually operated valve: =KMd! $J\
5-14.气动阀pneumatically operated valve: |`E\$|\p
5-15.电磁阀electromagnetically operated valve: eW0:&*.vMj
5-16.电动阀valve with electrically motorized operation: nU||Jg
5-17.挡板阀baffle valve: jQ1~B1(
5-18.翻板阀flap valve: %[Ia#0'Y@
5-19.插板阀gate valve: [&3G `8hY
5-20.蝶阀butterfly valve: laKMQLtv
wC..LdSR
6.真空管路 daY^{u3
6-1.粗抽管路roughing line: 6(<AuhFu
6-2.前级真空管路backing line: 0'c<EJ
6-3.旁通管路;By-Pass管路 by-pass line: H /*^$>0Uo
6-4.抽气封口接头pumping stem: <),FI <~
6-5.真空限流件limiting conductance: }us%G&A2u
6-6.过滤器filter: ,r:.
3.
5. 1.一般术语 OKxPf]~4E
1-1真空镀膜vacuum coating: {(7C=)8):
1-2基片substrate: OBF5Tl4
1-3试验基片testing substrate: (:vY:-\ bO
1-4镀膜材料coating material: 6n45]?
1-5蒸发材料evaporation material: |P>>
^,iUn
1-6溅射材料sputtering material: 1!0BE8s"@
1-7膜层材料(膜层材质)film material: c]t=#
1-8蒸发速率evaporation rate: aG`G$3 _wx
1-9溅射速率sputtering rate: O9:vPbn
1-10沉积速率deposition rate: e
J2wK3R
1-11镀膜角度coating angle: =/Vr,y$
P=(\3ok
2.工艺 Gk'J'9*
2-1真空蒸膜vacuum evaporation coating: w!8h4U.
;
(1).同时蒸发simultaneous evaporation: r6*0H/*
(2).蒸发场蒸发evaporation field evaporation: )7*Apy==x
(3).反应性真空蒸发reactive vacuum evaporation: ~?+Jt3?,
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: _lu.@IX-
(5).直接加热的蒸发direct heating evaporation: Q0Dw2>~_K
(6).感应加热蒸发induced heating evaporation: P_lk40X
(7).电子束蒸发electron beam evaporation: y=G
(8).激光束蒸发laser beam evaporation: L`yS'
(9).间接加热的蒸发indirect heating evaporation: *"q ~z
(10).闪蒸flash evaportion: (LkGBnXE
2-2真空溅射vacuum sputtering: ^#vWdOlt
(1).反应性真空溅射 reactive vacuum sputtering: H [R|U
(2).偏压溅射bias sputtering: cuW$%$F
(3).直流二级溅射direct current diode sputtering: Pdrz lu
(4).非对称性交流溅射asymmtric alternate current sputtering: ceyZ4M
(5).高频二极溅射high frequency diode sputtering: +'y$XR~W {
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ]geO%m
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: j]M$>2;
(8).离子束溅射ion beam sputtering: ppmDmi~X
(9).辉光放电清洗glow discharge cleaning: =uMoX
-
2-3物理气相沉积PVD physical vapor deposition: ZMy,<wk
2-4化学气相沉积CVD chemical vapor deposition: AL3zE=BL
2-5磁控溅射magnetron sputtering: }Q/xBC)
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: @0-<|,^]
2-7空心阴极离子镀HCD hollow cathode discharge deposition: )Uo)3FAn
2-8电弧离子镀arc discharge deposition: ?.,..p
/2~qm/%Q
3.专用部件 bt-y6,> +E
3-1镀膜室coating chamber: vqJiMa j@Z
3-2蒸发器装置evaporator device: g()YP
3-3蒸发器evaporator: l"*zr ;#
3-4直接加热式蒸发器evaporator by direct heat: vRVQ:fw
3-5间接加热式蒸发器evaporator by indirect heat: ./rNq!*a
3-7溅射装置sputtering device: OF2*zU7M
3-8靶target: ? R#-gvX%
3-10时控挡板timing shutter: ,4)zn6tC
3-11掩膜mask: |9@?8\
3-12基片支架substrate holder: <;=?~QK%-
3-13夹紧装置clamp: 8%U+y0j6b
3-14换向装置reversing device: Y'DI@
3-15基片加热装置substrate heating device: >
CZ|Vx
3-16基片冷却装置substrate colding device: tF
O27z@
ApG_Gd.
4.真空镀膜设备 X8GIRL)lJ
4-1真空镀膜设备vacuum coating plant: ^R!
qxSj
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 9V9K3xWn
(2).真空溅射镀膜设备vacuum sputtering coating plant: HX7"w
4-2连续镀膜设备continuous coating plant: +YI/(ko=
4-3半连续镀膜设备semi- continuous coating plant gC>
A*~J;
6. 1.漏孔 %8DU}}Rj
1-1漏孔leaks: }[ld=9p(
1-2通道漏孔channel leak: )4bBR@QM
1-3薄膜漏孔membrane leak: #||^l_
1-4分子漏孔molecular leak: 9B{,q6
1-5粘滞漏孔vixcous leak: &l/2[>D%4
1-6校准漏孔calibrated leak: pi7W8y
1-7标准漏孔reference leak : L 1H!o!*
1-8虚漏virtual leak: SRRqIQz
1-9漏率leak rate: |~Z.l
1-10标准空气漏率standard air leak rate: @aAB#,
1-11等值标准空气漏率equivalent standard air leak rate: }i ^]uW*h
1-12探索(示漏)气体: F;kY5+a7~e
&z+nNkr?yN
2.本底 $^?Mip
2-1本底background: 64fa0j~<*M
2-2探索气体本底search gas background : 7;2j^qPr
2-3漂移drift: b8r?Dd"T8
2-4噪声noise: |D~mLs;&
bC{}&a
3.检漏仪 "3(""0Q
3-1检漏仪leak detector: iP]KV.e'/C
3-2高频火花检漏仪H.F. spark leak detector: ~k^rI jR
3-3卤素检漏仪halide leak detector: 3X=9$xw_
3-4氦质谱检漏仪helium mass spectrometer leak detector: lmi,P-Q
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: LP-~;
T~8= =Z{[
4.检漏 -GCC
4-1气泡检漏leak detection by bubbles: MHeUh[%(
4-2氨检漏leak detection by ammonia: IW?).%F
4-3升压检漏leak detection of rise pressure: {p[{5k 0
4-4放射性同位素检漏radioactive isotope leak detection: Ti$G2dBO
4-5荧光检漏fluorescence leak detection 2Tec#eYe
7. 1.一般术语 aMe]6cWHV>
1-1真空干燥vacuum drying: r'/&{?Je/
1-2冷冻干燥freeze drying : z6)b XL[f
1-3物料material: `<2k.aW4e8
1-4待干燥物料material to be dried: lqe|1vN
1-5干燥物料dried material : `u$
Rd
1-6湿气moisture;humidity: +pXYBwH
7Q
1-7自由湿气free moisture: "\cDSiD
1-8结合湿气bound moisture: c!*yxzs\
1-9分湿气partial moisture: .ZQD`SRrI
1-10含湿量moisture content: p!B&&)&db
1-11初始含湿量initial moisture content: q!iTDg*$
1-12最终含湿量final residual moisture: gB|>[6
1-13湿度degree of moisture ,degree of humidity : FjR/_GPo6
1-14干燥物质dry matter : xY4g2Q
J
1-15干燥物质含量content of dry matter: S52'!WTq
.8e]-^Z
2.干燥工艺 cq+G 0F+H
2-1干燥阶段stages of drying : u_H=Xm)9
(1).预干燥preliminary dry: i<@"+~n~GK
(2).一次干燥(广义)primary drying(in general): A0X'|4I
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): G\&9.@`k
(4).二次干燥secondary drying: ~wYGTm=(n
2-2.(1).接触干燥contact drying: epN>;e z
(2).辐射干燥 drying by radiation : E+z),"QA
(3).微波干燥microwave drying: S!WG|75B
(4).气相干燥vapor phase drying: kZ<0|b
(5).静态干燥static drying: J;HYGu:
(6).动态干燥dynamic drying: ]bxBo
2-3干燥时间drying time: YYNh|
2
2-4停留时间length of stay(in the drying chamber): !ZNirvk
2-5循环时间cycle time: wnUuoX(
2-6干燥率 dessication ratio : tV?-
2-7去湿速率mass flow rate of humidity: )R6h
1
2-8单位面积去湿速率mass flow rate of humidity per surface area: HQ /D )D
2-9干燥速度 drying speed : )XCG4-1
2-10干燥过程drying process: xmVW6 ,<?
2-11加热温度heating temperature: GmhfBW?
2-12干燥温度temperature of the material being dried : I]GGmN
2-13干燥损失loss of material during the drying process : o8 _))
2-14飞尘lift off (particles): 5PY4PT=G
2-15堆层厚度thickness of the material: /cHUqn30a
OSoIH`tA
3.冷冻干燥 uA-1VwW+N
3-1冷冻freezing: tTEw"DL_-
(1).静态冷冻static freezing: tJBj9{
(2).动态冷冻dynamic freezing: '+EtnWHs
(3).离心冷冻centrifugal freezing: f \ E9u}
(4).滚动冷冻shell freezing: ='A VI-go5
(5).旋转冷冻spin-freezing: =[JstiT?E
(6).真空旋转冷冻vacuum spin-freezing: ^4/
(7).喷雾冷冻spray freezing: eI,'7u4q
(8).气流冷冻air blast freezing: |j}D2q=
3-2冷冻速率rate of freezing: F8H4R7
8>;
3-3冷冻物料frozen material: /a,"b8
3-4冰核ice core: h"0)g:\
3-5干燥物料外壳envelope of dried matter: jOUM+QO
3-6升华表面sublimation front: Qm_IU!b
3-7融化位置freezer burn: L"KKW
c
^>Vl@cW0uz
4.真空干燥设备;真空冷冻干燥设备 7D(Eo{ue
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: *82+GY]
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: CCHGd&\Z
4-3加热表面heating surface: E3hXs6P
4-4物品装载面shelf : |)VNf.aJZ
4-5干燥器的处理能力throughput (of the vacuum drying chamber): a yYl3
4-6单位面积干燥器处理能力throughput per shelf area: Ec9%RAxl
4-7冰冷凝器ice condenser: 9dVHh?E
4-8冰冷凝器的负载load of the ice condenser: _-|/$ jZ
4-9冰冷凝器的额定负载rated load of the ice condenser mzf~qV^T
8. 1.一般术语 &w!(.uDO
1-1试样sample : R ;k1(p
(1).表面层surface layer: 2c*w{\X
(2).真实表面true surface: 6E@TcN~,!
(3).有效表面积effective surface area: R
X N0v@V
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: WA6reZ
(5).表面粒子密度surface particle density: S5BS![-QK
(6).单分子层monolayer: dQn,0
(7).表面单分子层粒子密度monolayer density: `pb=y}
(8).覆盖系数coverage ratio: w=_q<1a
1-2激发excitation: ToK=`0#LNK
(1).一次粒子primary particle: -zg 6^f_pW
(2).一次粒子通量primary particle flux: c(b2f-0!4
(3).一次粒子通量密度density of primary particle flux: (:P#l&f
(4).一次粒子负荷primary particle load: mEmgr(W
(5).一次粒子积分负荷integral load of primary particle: w~C\5 i
(6).一次粒子的入射能量energy of the incident primary particle: =pZ$oTR
(7).激发体积excited volume: K=!
C\T"I%
(8).激发面积excited area: +~>cAWZq_
(9).激发深度excited death: llN/
(10).二次粒子secondary particles: 7{tU'`P>
(11).二次粒子通量secondary particle flux: m\oxS;fxWi
(12).二次粒子发射能energy of the emitted secondary particles: -FF#+Z$
(13).发射体积emitting volume: V%(T#_E/6
(14).发射面积emitting area: >Hu3Guik]
(15).发射深度emitting depth: Aj8zFt]
(16).信息深度information depth: 63(XCO
(17).平均信息深度mean information depth: ?bH`
1-3入射角angle of incidence: 5yyc0UG
1-4发射角angle of emission: 5)Z:J
1-5观测角observation: O5MV&Zb(
1-6分析表面积analyzed surface area: )<%CI#s#
1-7产额 yield : QFK'r\3pU
1-8表面层微小损伤分析minimum damage surface analysis: $O&N
1-9表面层无损伤分析non-destructive surface analysis: #@' B\!<@=
1-10断面深度分析 profile analysis in depth; depth profile analysis : DUSQh+C
1-11可观测面积observable area: 1pK(tm
1-12可观测立体角observable solid angle : P2&0bNY
1-13接受立体角;观测立体角angle of acceptance: mPF<2:)wv
1-14角分辨能力angular resolving power: e,xJ%f
1-15发光度luminosity: G6}!PEwM
1-16二次粒子探测比detection ratio of secondary particles: ykRd+H-t
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: EERCb%M8Z
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: L#?mPF
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: ![!,i\x
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: X(O:y^sX}
1-21本底压力base pressure: a ]:xsJ~
1-22工作压力working pressure: B8unF=u
7^V`B^Vu
2.分析方法 '0^lMQMg
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: +f$
{r7
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : S}VN(g
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: pHowioFx
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: iMv):1p>8
2-3离子散射表面分析ion scattering spectroscopy: 7xM4=\~OG
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 1Q=L/keP
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: &lID6{7 9Z
2-6离子散射谱仪ion scattering spectrometer: \PD%=~
2-7俄歇效应Auger process: WZn"I&Z
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: DxD\o+:r
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: 39m8iI%w[
2-10光电子谱术photoelectron spectroscopy : ^?_MIS`4N
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: d}
5
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: PdEPDyFk h
2-11光电子谱仪photoelectron spectrometer: E^Ch;)j|
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: W0;QufV
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: +U<.MVOo.
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): KYy oN
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus