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真空术语 lpl8h4d
t6'61*)|0
1.标准环境条件 standard ambient condition: hq/J6 M
2.气体的标准状态 standard reference conditions forgases: c%|vUAq*
3.压力(压强)p pressure: J0^{,eY<
4.帕斯卡Pa pascal: i(Ip(n
5.托Torr torr: _ Ry_K3K
6.标准大气压atm standard atmosphere: 1s#yWQ
7.毫巴mbar millibar: mD9STuA$H
8.分压力 partial pressure: j~M#Ss-H8
9.全压力 total pressure: x}tKewdOSe
10.真空 vacuum: H4M{_2DO
11.真空度 degree of vacuum: s~S?D{!
12.真空区域 ranges of vacuum: z>4D~HX
13.气体 gas: 8AT;8I<K
14.非可凝气体 non-condensable gas: JNh=fvO2i
15.蒸汽vapor: j((hqJr
16.饱和蒸汽压saturation vapor pressure: _h0-
17.饱和度degree of saturation: PC*m%
?+
18.饱和蒸汽saturated vapor: y L*LJ
19.未饱和蒸汽unsaturated vapor: 2q)T y9
20.分子数密度n,m-3 number density of molecules: ?qk@cKS
21.平均自由程ι、λ,m mean free path: !G7h9CF|{
22.碰撞率ψ collision rate: LO"_NeuL
23.体积碰撞率χ volume collision rate: }l~]b3@qu
24.气体量G quantity of gas: as>:\hjP##
25.气体的扩散 diffusion of gas: 82lr4
26.扩散系数D diffusion coefficient; diffusivity: 5^\m`gS
27.粘滞流 viscous flow: cp$.,V
28.粘滞系数η viscous factor: \CcmePTN#x
29.泊肖叶流 poiseuille flow: IuNkfBe4m
30.中间流 intermediate flow: H{ZLk,
31.分子流 molecular flow: #nKRTb+{
32克努曾数 number of knudsen: X]qCS0GD'
33.分子泻流 molecular effusion; effusive flow: 5N\+@grp
34.流逸 transpiration: Ba<ngG
!
35.热流逸 thermal transpiration: d!o.ASL{
36.分子流率qN molecular flow rate; molecular flux: sp|q((z{
37.分子流率密度 molecular flow rate density; density of molecular flux: &]w#z=5SXi
38.质量流率qm mass flow rare: 1Yud~[c
39.流量qG throughput of gas: &GuF\wJ{7
40.体积流率qV volume flow rate: VSh !4z1
41.摩尔流率qυ molar flow rate: .>P~uZiX!
42.麦克斯韦速度分布 maxwellian velocity distribution: hHpx?9O+!
43.传输几率Pc transmission probability: B$ui:R/ t
44.分子流导CN,UN molecular conductance: ?4,@,
ae&
45.流导C,U conductance: dgXg kB'
46.固有流导Ci,Ui intrinsic conductance: 2xDQ:=ec
47.流阻W resistance: rsWQHHkO
48.吸附 sorption: 7R: WX:
49.表面吸附 adsorption: [eyb7\#
50.物理吸附physisorption: ' PELf
P8
51.化学吸附 chemisorption: L_^`k4ct
52.吸收absorption: 3!aEClRtq
53.适应系数α accommodation factor: GWgd8x*V
54.入射率υ impingement rate: X<Z(]`i
55.凝结率condensation rate: Vb2\/e:k
56.粘着率 sticking rate: 0 sZwdO
57.粘着几率Ps sticking probability: Twx{' S
58.滞留时间τ residence time: \7yJ\I
59.迁移 migration: q3+I<qsAz
60.解吸 desorption: EY~7oNfc`R
61.去气 degassing: 6+iK!&+=
62.放气 outgassing: Hq?& Qo
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: w,Q)@]_
64.蒸发率 evaporation rate: `_GO=QQ
65.渗透 permeation: DcN"=Y
66.渗透率φ permeability: e8{^f]5
67.渗透系数P permeability coefficient '*4iqPR;
2. 1.真空泵 vacuum pumps p5-<P?B
1-1.容积真空泵 positive displacement pump: y:.?5KsPI
⑴.气镇真空泵 gas ballast vacuum pump: &U&Zo@ot"x
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: 6}ftBmv
⑶.干封真空泵 dry-sealed vacuum pump: x9%-plP
⑷.往复真空泵 piston vacuum pump: j{)~QD ?
⑸.液环真空泵 liquid ring vacuum pump: .Vmtx
⑹.旋片真空泵 sliding vane rotary vacuum pump: kbhX?; <`
⑺.定片真空泵 rotary piston vacuum pump: +`| mJa
⑻.滑阀真空泵 rotary plunger vacuum pump: !R74J=#(
⑼.余摆线真空泵 trochoidal vacuum pump: i
j/o;_
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: z?kd'j`FG
⑾.罗茨真空泵 roots vacuum pump: _s*!
t
1-2.动量传输泵 kinetic vacuum pump: MKC$;>i
⑴.牵引分子泵molecular drag pump: kon5+g9q
⑵.涡轮分子泵turbo molecular pump: .b,~f
⑶.喷射真空泵ejector vacuum pump: WNa3^K/W{
⑷.液体喷射真空泵liquid jet vacuum pump: f>niFPW"
⑸.气体喷射真空泵gas jet vacuum pump: 0wFh%/:
⑹.蒸汽喷射真空泵vapor jet vacuum pump : nhewDDu
⑺.扩散泵diffusion pump : `VZZ^K9zR
⑻.自净化扩散泵self purifying diffusion pump: VhvTBo<cw
⑼.分馏扩散泵 fractionating diffusion pump : >)^NJ2Fd
⑽.扩散喷射泵diffusion ejector pump : kwlC[G$j7
⑾.离子传输泵ion transfer pump: :G 5C ]'t
1-3.捕集真空泵 entrapment vacuum pump: 1~@|eWr|
⑴吸附泵adsorption pump: Szts<n5
⑵.吸气剂泵 getter pump: %K zbO0
⑶.升华(蒸发)泵 sublimation (evaporation)pump : ~C|,b"
⑷.吸气剂离子泵getter ion pump: s@~/x5jwCs
⑸.蒸发离子泵 evaporation ion pump: /cfHYvnz
⑹.溅射离子泵sputter ion pump: HN68!v}C|
⑺.低温泵cryopump: '#H")i
Vv4H:BK$
2.真空泵零部件 \Yq0 zVol
2-1.泵壳 pump case: c&*l"
2-2.入口 inlet: kOipH |.x
2-3.出口outlet: %ek"!A
2-4.旋片(滑片、滑阀)vane; blade : Ea]T>4
2-5.排气阀discharge valve: b[srG6{ &
2-6.气镇阀gas ballast valve: TatMf;?h&
2-7.膨胀室expansion chamber: ^f|<R8 `
2-8.压缩室compression chamber: B{aU;{1
2-9.真空泵油 vacuum pump oil: yp+F<5o
2-10.泵液 pump fluid: X+iK<F$
2-11.喷嘴 nozzle: iyj3QLqE
2-13.喷嘴扩张率nozzle expansion rate: s}(X]Gx1
2-14.喷嘴间隙面积 nozzle clearance area : ;SY.WfVA7
2-15.喷嘴间隙nozzle clearance: Z`s!dV]e9
2-16.射流jet: 1lcnRHO
2-17.扩散器diffuser: g1@wf
2-18.扩散器喉部diffuser thoat: *1bzg/T<
2-19.蒸汽导管vapor tube(pipe;chimney): s.:r;%a
2-20.喷嘴组件nozzle assembly: s;1e0n
2-21.下裙skirt: cPuHLwwYf
_{Y$o'*#I
3.附件 _~A~+S}
3-1阱trap: tjxvN 4l
⑴.冷阱 cold trap: ? )_7U
⑵.吸附阱sorption trap: 0d4cE10
⑶.离子阱ion trap: G{o+R]Us
⑷.冷冻升华阱 cryosublimation trap: j=ihbR^]Tl
3-2.挡板baffle: 31}W6l88c
3-3.油分离器oil separator: /U*yw5
3-4.油净化器oil purifier: "={L+di:M
3-5.冷凝器condenser: bulboyA
$Nu)E
4.泵按工作分类 uD(t`W"
4-1.主泵main pump: L~eAQR
4-2.粗抽泵roughing vacuum pump: |zpx)8Q
4-3.前级真空泵backing vacuum pump: S$O,] @)
4-4.粗(低)真空泵 roughing(low)vacuum pump: <xlm
K(
4-5.维持真空泵holding vacuum pump: r1Z<:}ZwK
4-6.高真空泵high vacuum pump: [H,u)8)
4-7.超高真空泵ultra-high vacuum pump: =i6:puf
4-8.增压真空泵booster vacuum pump: O<GF>
wiE]z
5.真空泵特性 zZ,Yfd|W
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 7Fl-(Nv`
5-2.真空泵的抽气量Q throughput of vacuum pump:。 l!IGc:
5-3.起动压力starting pressure: =.b Y#4
5-4.前级压力 backing pressure : 7lU.Nit
5-5.临界前级压力 critical backing pressure: KzVTkDn,
5-6.最大前级压力maximum backing pressure: 0M8.U
5-7.最大工作压力maximum working pressure: D$nK`r
5-8.真空泵的极限压力ultimate pressure of a pump: 5@P-g
5-9.压缩比compression ratio: te'*<HM
5-10.何氏系数Ho coefficient: X/+OF'po
5-11.抽速系数speed factor: ;fGx;D
5-12.气体的反扩散back-diffusion of gas: 'm O2t~n
5-13.泵液返流back-streaming of pump fluid: XP;x@I#l
5-14.返流率back-streaming rate (vQ+e
5-15.返迁移back-migration: yVS\Q,:J9
5-16.爆腾bumping: de YyaV
5-17.水蒸气允许量qm water vapor tolerable load: s;{K!L@
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: zj%cQkZ
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: E*|tOj9`1n
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump VJ{pN ~_1
3. 1.一般术语 HFS+QwHW
1-1.压力计pressure gauge: onl>54M^
1-2.真空计vacuum gauge: ~m`!;rE
⑴.规头(规管)gauge head: {$fsS&aPg
⑵.裸规nude gauge : A/ 0qk
⑶.真空计控制单元gauge control unit : s#^pC*,'
⑷.真空计指示单元gauge indicating unit : 1r571B*O
+v15[^F
2.真空计一般分类 >V!LitdJ
2-1.压差式真空计differential vacuum gauge: &1Fply7(Ay
2-2.绝对真空计 absolute vacuum gauge: xjq0D[
2-3.全压真空计total pressure vacuum gauge: 0ar=cuDm
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: qY# d+F,t
2-5.相对真空计relative vacuum gauge : jJ++h1
K
`="v>qN2\
3.真空计特性 aqr!oxn?t
3-1.真空计测量范围pressure range of vacuum gauge: ;V.vfar
3-2.灵敏度系数sensitivity coefficient:
yP\Up
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): o^ h(#%O
3-5.规管光电流photon current of vacuum gauge head: 7Dt"]o"+
3-6.等效氮压力equivalent nitrogen pressure : P*G+eqX
3-7.X射线极限值 X-ray limit: @]'SeiNp
3-8.逆X射线效应anti X-ray effect: RJc%,
]:
3-9.布利尔斯效应blears effect: xb$yu.c
\*"`L3
4.全压真空计 TzM=LvA
4-1.液位压力计liquid level manometer: 9P"iuU
4-2.弹性元件真空计elastic element vacuum gauge: PZM42"[&
4-3.压缩式真空计compression gauge: 7g6RiH}
4-4.压力天平pressure balance: Lko`F$5X
4-5.粘滞性真空计viscosity gauge : 8tQ|-l*
4-6.热传导真空计thermal conductivity vacuum gauge : .3wY\W8Dr-
4-7.热分子真空计thermo-molecular gauge: Iql5T#K+
4-8.电离真空计ionization vacuum gauge: 0BTLcEqgZ
4-9.放射性电离真空计radioactive ionization gauge: ^M
Ey,
4-10.冷阴极电离真空计cold cathode ionization gauge: 3"rkko?A
4-11.潘宁真空计penning gauge: Y}.Ystem
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: F?4Sz#
4-13.放电管指示器discharge tube indicator: I/s.xk_i
4-14.热阴极电离真空计hot cathode ionization gauge: $qm~c[x%
4-15.三极管式真空计triode gauge: }uQ${]&D
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: 3g'+0tEl
4-17.B-A型电离真空计Bayard-Alpert gauge: >q(6,Mmb
4-18.调制型电离真空计modulator gauge: f7+Cz>R
4-19.抑制型电离真空计suppressor gauge: x9V {R9_gf
4-20.分离型电离真空计extractor gauge: '_o@VO
4-21.弯注型电离真空计bent beam gauge: ^:DyT@hQB5
4-22.弹道型电离真空计 orbitron gauge : #T%zfcUj
4-23.热阴极磁控管真空计hot cathode magnetron gauge: 0.DQO;
"ahvNx;x
5.分压真空计(分压分析器) Y@} FL;3
5-1.射频质谱仪radio frequency mass spectrometer: -p8e
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: nem@sB;v#
5-3.单极质谱仪momopole mass spectrometer: r_2btpL^
5-4.双聚焦质谱仪double focusing mass spectrometer: iJP{|-h
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: +,_c/(P
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: B8~=RmWLl
5-7.回旋质谱仪omegatron mass spectrometer: *K)0UKBr
5-8.飞行时间质谱仪time of flight mass spectrometer: 1xTTJyoq
%#k,6;m
6.真空计校准 zM59UQU;
6-1.标准真空计reference gauges: )N)ljA3]
6-2.校准系统system of calibration: GZ3/S|SMP
6-3.校准系数K calibration coefficient: D/s?i[lb
6-4.压缩计法meleod gauge method: IJPgFZ7
6-5.膨胀法expansion method: C1QWU5c v
6-6.流导法flow method: &O tAAE
4. 1.真空系统vacuum system ']?=[`#NL
1-1.真空机组pump system: JEHK:1^
1-2.有油真空机组pump system used oil : v*r9j8
1-3.无油真空机组oil free pump system ,F:=(21
1-4.连续处理真空设备continuous treatment vacuum plant: cyMs(21
1-5.闸门式真空系统vacuum system with an air-lock: ;BI)n]L
1-6.压差真空系统differentially pumped vacuum system: xNgt[fLpS
1-7.进气系统gas admittance system: ]^@0+!
yWHne~!
2.真空系统特性参量 p@tp]u`7
2-1.抽气装置的抽速volume flow rate of a pumping unit : %dmfBf Ev
2-2.抽气装置的抽气量throughput of a pumping unit : ;0j*>fb\q7
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: `d*b]2
2-4.真空系统的漏气速率leak throughput of a vacuum system: e2Jp'93o'
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: 0QoLS|voA/
2-6.极限压力ultimate pressure: h7?.2Q&S
2-7.残余压力residual pressure: QymD-A"P
2-8.残余气体谱residual gas spectrum: :[?!\m%0
2-9.基础压力base pressure: E@pFTvo
2-10.工作压力working pressure: FpzP#;
2-11.粗抽时间roughing time: 3!Bj{;A
2-12.抽气时间pump-down time: DHzkRCM
2-13.真空系统时间常数time constant of a vacuum system: p&5S|![\
2-14.真空系统进气时间venting time: k7Oy5$##
3bts7<K=
3.真空容器 -S$$/sR
3-1.真空容器;真空室vacuum chamber: m!Af LSlwm
3-2.封离真空装置sealed vacuum device: T.@sq
3-3.真空钟罩vacuum bell jar: /f&By
p
3-4.真空容器底板vacuum base plate: @?/\c:cp
3-5.真空岐管vacuum manifold: c[{UI
3-6.前级真空容器(贮气罐)backing reservoir: ('d{t:TsY
3-7.真空保护层outer chamber: PYieD}'
3-8.真空闸室vacuum air lock: wOcg4HlW
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: ]fC7%"nB
ND*]gM
4.真空封接和真空引入线 b~as64
4-1.永久性真空封接permanent seal : \`gEu{
4.2.玻璃分级过渡封接graded seal : +H}e)1^I
4-3.压缩玻璃金属封接compression glass-to-metal seal: u]*5Ex (?
4-4.匹配式玻璃金属封接matched glass-to-metal seal: M=+M8M`Iy
4-5.陶瓷金属封接ceramic-to-metal seal: [;@):28"
4-6.半永久性真空封接semi-permanent seal : >0V0i%inmF
4-7.可拆卸的真空封接demountable joint: ;]@exp5
4-8.液体真空封接liquid seal 4\1;A`2%0
4-9.熔融金属真空封接molten metal seal: [B,p,Q"
4-10.研磨面搭接封接ground and lapped seal: b,Lw7MY}[
4-11.真空法兰连接vacuum flange connection: (H-cDsh;c
4-12.真空密封垫vacuum-tight gasket: {F!v+W>
4-13.真空密封圈ring gasket: C8MWIX}
4-14.真空平密封垫flat gasket: i[_|%'p
4-15.真空引入线feedthrough leadthrough: !x_t`78T
4-16.真空轴密封shaft seal: h0XH`v
4-17.真空窗vacuum window: "Q?_ EE n
4-18.观察窗viewing window: xgs@gw7!n0
$WClpvVj
5.真空阀门 ucM.Ro=@
5-1.真空阀门的特性characteristic of vacuum valves: )JX$/-
RD-
⑴.真空阀门的流导conductance of vacuum valves: B _tQeM
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 0BDoBR
5-2.真空调节阀regulating valve: *|poxT G
5-3.微调阀 micro-adjustable valve: tQ[]Rc
5-4.充气阀charge valve: 2_N/wR#=&
5-5.进气阀gas admittance valve: qp@m&GH
5-6.真空截止阀break valve: u
GIr&`S
5-7.前级真空阀backing valve: mR,O0O}&
5-8.旁通阀 by-pass valve: ^Po,(iIn
5-9.主真空阀main vacuum valve: <S{7Ro
5-10.低真空阀low vacuum valve: AZBC P
5-11.高真空阀high vacuum valve: 0V7 _n
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: '$*[SauAG
5-13.手动阀manually operated valve: 19&)Yd1
5-14.气动阀pneumatically operated valve: f| =# q
5-15.电磁阀electromagnetically operated valve: F-tFet
5-16.电动阀valve with electrically motorized operation: uAT/6@
5-17.挡板阀baffle valve: |Q6h/"2
5-18.翻板阀flap valve: %GVN4y&
5-19.插板阀gate valve: o"4E+1qwM
5-20.蝶阀butterfly valve: l_ b_-p
h[,XemwX
6.真空管路 #@q1Ko!NZ
6-1.粗抽管路roughing line: <K,[sy&Qy
6-2.前级真空管路backing line: S2bexbp0o
6-3.旁通管路;By-Pass管路 by-pass line: w_!%'9m>
6-4.抽气封口接头pumping stem:
Z:TFOnJ
6-5.真空限流件limiting conductance: )WclV~
6-6.过滤器filter: FNlx1U[
5. 1.一般术语 =G*z
53
1-1真空镀膜vacuum coating: K?JV]^
1-2基片substrate: 01o [!n T
1-3试验基片testing substrate: Ta^.$O=F
1-4镀膜材料coating material: MU*It"@}2
1-5蒸发材料evaporation material: Cg7)S[zl
1-6溅射材料sputtering material: $i -zMa
1-7膜层材料(膜层材质)film material: eN4t1$
1-8蒸发速率evaporation rate: :U8k|,~f
1-9溅射速率sputtering rate: &rcdr+'
1-10沉积速率deposition rate: s*eyTm
1-11镀膜角度coating angle: _C5n Apb
E;$$+rA
2.工艺 ] .`_,
IO
2-1真空蒸膜vacuum evaporation coating: r\B"?oqC
(1).同时蒸发simultaneous evaporation: /0-\ek ye
(2).蒸发场蒸发evaporation field evaporation: 8,H~4Ce3
(3).反应性真空蒸发reactive vacuum evaporation: zNwc((
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: xmOM<0T
(5).直接加热的蒸发direct heating evaporation: m$)YYpX
(6).感应加热蒸发induced heating evaporation: 1S&0
(7).电子束蒸发electron beam evaporation: 3+j^E6@
(8).激光束蒸发laser beam evaporation: PH[4y:^DN
(9).间接加热的蒸发indirect heating evaporation: z41D^}b
(10).闪蒸flash evaportion: 0+rW;-_(
2-2真空溅射vacuum sputtering: >r~|1kQ.
(1).反应性真空溅射 reactive vacuum sputtering: qA04Vc[2
(2).偏压溅射bias sputtering: 51z /
(3).直流二级溅射direct current diode sputtering: !*9FKDB{
(4).非对称性交流溅射asymmtric alternate current sputtering: X&/(x
(5).高频二极溅射high frequency diode sputtering: 2G H)iUmc
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: o;E(Kj
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: YN$`y1V
(8).离子束溅射ion beam sputtering: &hO$4q tN
(9).辉光放电清洗glow discharge cleaning: *XHj)DC;
2-3物理气相沉积PVD physical vapor deposition: $@68=
2-4化学气相沉积CVD chemical vapor deposition: RZ<.\N
(M
2-5磁控溅射magnetron sputtering: $G)&J2zL
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: \Ec
X!aC
2-7空心阴极离子镀HCD hollow cathode discharge deposition: ` 4OMZMq
2-8电弧离子镀arc discharge deposition:
am3V9"\
UC.8DaIPN
3.专用部件 I{Rz,D uAL
3-1镀膜室coating chamber: N=.}h\{0
3-2蒸发器装置evaporator device: GsI[N%
3-3蒸发器evaporator: wQ@Zwbx
3-4直接加热式蒸发器evaporator by direct heat: e5QOB/e&
3-5间接加热式蒸发器evaporator by indirect heat: 7(H?k
3-7溅射装置sputtering device: ybC-f'0
3-8靶target: SCqu,
3-10时控挡板timing shutter: e#K rgUG
3-11掩膜mask: F_K
3-12基片支架substrate holder: K6ciqwUO
3-13夹紧装置clamp: gfV]^v
3-14换向装置reversing device: \A` gK\/h
3-15基片加热装置substrate heating device: $ V3n~.=
3-16基片冷却装置substrate colding device: y|$vtD%c
u<x[5xH+
4.真空镀膜设备 {`($Q$Q1
4-1真空镀膜设备vacuum coating plant: *Rz!i m|
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 5aa}FdUq
(2).真空溅射镀膜设备vacuum sputtering coating plant:
b$PT_!d
4-2连续镀膜设备continuous coating plant: /5&3WG&<u
4-3半连续镀膜设备semi- continuous coating plant O 0Vn";Q 4
6. 1.漏孔 7ZL,p:f
1-1漏孔leaks: 4
`j,&=
1-2通道漏孔channel leak: i-|/2I9 %
1-3薄膜漏孔membrane leak: y?[5jL|Ue
1-4分子漏孔molecular leak: MX"A@p~H
1-5粘滞漏孔vixcous leak: u}Lc|_ea`
1-6校准漏孔calibrated leak: b0!*mrF]6
1-7标准漏孔reference leak : B?$S~5
}
1-8虚漏virtual leak: &19lk
1-9漏率leak rate: ?ykVf O'
1-10标准空气漏率standard air leak rate: (7M^-_q]D
1-11等值标准空气漏率equivalent standard air leak rate: A9NOeE
1-12探索(示漏)气体: d4b 9rtM
VaOpO8y`
2.本底
iK$Vd+Lgc
2-1本底background: .CIbpV?T
2-2探索气体本底search gas background : r)) $XM
2-3漂移drift: A@9U;8k
2-4噪声noise: |Ba4 G`
Fr1;)WV
3.检漏仪 lCM6T;2ID
3-1检漏仪leak detector: |#Yu.c*
3-2高频火花检漏仪H.F. spark leak detector: tI/mE[W
3-3卤素检漏仪halide leak detector: 2U-#0,ll]
3-4氦质谱检漏仪helium mass spectrometer leak detector: 6n2Vx1b
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: ,-w-su=J_
K,`).YK
4.检漏 R[mH35D/
4-1气泡检漏leak detection by bubbles: 7j9D;_(.^$
4-2氨检漏leak detection by ammonia: 0"wbcAh)
4-3升压检漏leak detection of rise pressure: C:|q'"F
4-4放射性同位素检漏radioactive isotope leak detection: WZ-4^WM=!
4-5荧光检漏fluorescence leak detection L8,H9T#e
7. 1.一般术语 B:R7[G;1
1-1真空干燥vacuum drying: @d8&3@{R^
1-2冷冻干燥freeze drying : clPZd
1-3物料material: sR7{ i
1-4待干燥物料material to be dried: .y/NudD
1-5干燥物料dried material : [ZL r:2+z
1-6湿气moisture;humidity: ;o~+2Fir
1-7自由湿气free moisture: 8GF[)z&|P:
1-8结合湿气bound moisture: .N2nJ/
1-9分湿气partial moisture: $sd3h\P&R
1-10含湿量moisture content: ,d9%Ce.$2
1-11初始含湿量initial moisture content: a"v"n$
1-12最终含湿量final residual moisture: lOowMlf@2
1-13湿度degree of moisture ,degree of humidity : ?{ 8sT-Z-L
1-14干燥物质dry matter : 'O\d<F.c$2
1-15干燥物质含量content of dry matter: Z9;nC zHm
|k['wqn"
2.干燥工艺 } kh/mq
2-1干燥阶段stages of drying : }iiG$?|.
(1).预干燥preliminary dry: z[0LU]b<
(2).一次干燥(广义)primary drying(in general): Q G=-LXv:@
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): T@d_t
(4).二次干燥secondary drying: XNkQk0i;g&
2-2.(1).接触干燥contact drying: =
C$@DNEc
(2).辐射干燥 drying by radiation : 5'{qEZs^QU
(3).微波干燥microwave drying: 4z-,M7iP
(4).气相干燥vapor phase drying: .yFg$|y G
(5).静态干燥static drying: \>aa8LOe
(6).动态干燥dynamic drying: 1drqWI~
2-3干燥时间drying time: (>+k 3
2-4停留时间length of stay(in the drying chamber): WacU@L $A
2-5循环时间cycle time: LS2ek*FJO
2-6干燥率 dessication ratio : _x,-d|9bd
2-7去湿速率mass flow rate of humidity: Ht=6P)
2-8单位面积去湿速率mass flow rate of humidity per surface area: 4}r\E,`*X
2-9干燥速度 drying speed : BRSgB-Rr7
2-10干燥过程drying process: |)!k@?_
2-11加热温度heating temperature: dEAAm=K,<
2-12干燥温度temperature of the material being dried : 1"4nmw}
2-13干燥损失loss of material during the drying process : :xAe<Pq
2-14飞尘lift off (particles): 5 vu_D^Q
2-15堆层厚度thickness of the material: =?`y(k4a
c9ov;Bw6S
3.冷冻干燥 %x'bo>h@
3-1冷冻freezing: nY"rqILX?
(1).静态冷冻static freezing: 6ljRV)
(2).动态冷冻dynamic freezing: :>er^\
(3).离心冷冻centrifugal freezing: _/z)&0DO
(4).滚动冷冻shell freezing: sJHy=z0m
(5).旋转冷冻spin-freezing: _A~~L6C
(6).真空旋转冷冻vacuum spin-freezing: ai;gca_P#
(7).喷雾冷冻spray freezing: x>8}|ou
(8).气流冷冻air blast freezing: eN2k8=
3-2冷冻速率rate of freezing: B;D:9K
3-3冷冻物料frozen material: n|4D#Bd1w
3-4冰核ice core: 1$3XKw'
3-5干燥物料外壳envelope of dried matter: >m_p\$_
3-6升华表面sublimation front: _'v }=:X
3-7融化位置freezer burn: Y+"hu2aPkY
^b|Nw:
4.真空干燥设备;真空冷冻干燥设备 Z.Y;[Y
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: @L>NN>?SGQ
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: }JpslY*aS
4-3加热表面heating surface: G
&rYz
4-4物品装载面shelf : GHgEbiY:
4-5干燥器的处理能力throughput (of the vacuum drying chamber): )R
a/
4-6单位面积干燥器处理能力throughput per shelf area: cJ(zidf_$
4-7冰冷凝器ice condenser: 2t`9_zqLw
4-8冰冷凝器的负载load of the ice condenser: `9Q,=D+
4-9冰冷凝器的额定负载rated load of the ice condenser ! MF"e|W
8. 1.一般术语 {,-5k.P[
1-1试样sample : x}8T[
(1).表面层surface layer: ,0<F3h
(2).真实表面true surface: :86luLFm
(3).有效表面积effective surface area: sh))[V"8
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: )r6SGlE[Y
(5).表面粒子密度surface particle density: UN
.[,%<s
(6).单分子层monolayer: D -+)M8bt
(7).表面单分子层粒子密度monolayer density: CXP $bt}
(8).覆盖系数coverage ratio: 4pTuP /
1-2激发excitation: k.%W8C<Pa
(1).一次粒子primary particle: tm36Lw
(2).一次粒子通量primary particle flux: m9<[bEO<$
(3).一次粒子通量密度density of primary particle flux: LG@c)H74
(4).一次粒子负荷primary particle load: LOb'<R\p
(5).一次粒子积分负荷integral load of primary particle: M?4r 5R
(6).一次粒子的入射能量energy of the incident primary particle: 6quWO2x
(7).激发体积excited volume: #ZnX6=;X
(8).激发面积excited area: kx:lk+Tx
(9).激发深度excited death: m)]fJ_
(10).二次粒子secondary particles: \|>`z,;
(11).二次粒子通量secondary particle flux: 3f2Hjk7,d
(12).二次粒子发射能energy of the emitted secondary particles: oQjB&0k4
(13).发射体积emitting volume: :_YG/0%I
(14).发射面积emitting area: gc8PA_bFz
(15).发射深度emitting depth: y[5P<:&s
(16).信息深度information depth: Iv|WeSL.
(17).平均信息深度mean information depth: WoWM
1-3入射角angle of incidence: ;
# ?0#):-
1-4发射角angle of emission: gjN!_^_
1-5观测角observation: >\oJ&gdc
1-6分析表面积analyzed surface area: at(p,+ %
1-7产额 yield : .gkPG'm[
1-8表面层微小损伤分析minimum damage surface analysis: zf;[nz
1-9表面层无损伤分析non-destructive surface analysis: )w
8lusa
1-10断面深度分析 profile analysis in depth; depth profile analysis : *I1W+W`G
1-11可观测面积observable area: >8fz ?A
1-12可观测立体角observable solid angle : k| cI!
1-13接受立体角;观测立体角angle of acceptance: .fh?=B[o#
1-14角分辨能力angular resolving power: ut5!2t$c
1-15发光度luminosity: W*DIW;8p
1-16二次粒子探测比detection ratio of secondary particles: ~md|k
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: 1 l*(8!_
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: WT!\X["FI$
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: I~]mX;
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: FR6I+@ oX~
1-21本底压力base pressure: K#sb"x`
1-22工作压力working pressure: F#bo4'&>@
DMxS-hl
2.分析方法 Di"9 M(6vf
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: XQY&4tK
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : )?IA`7X
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: _5S$mc8K0
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: F*].
2-3离子散射表面分析ion scattering spectroscopy: .&} 4
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: u`Qcw|R+
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: wfTv<WG,.E
2-6离子散射谱仪ion scattering spectrometer: hYv 6-5_
2-7俄歇效应Auger process: Aag)c~D
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: jv=f@:[`I
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: IS4K$Ac.
2-10光电子谱术photoelectron spectroscopy : Y6%OV?}v!
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: vG_v89t!ex
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: "/Q(UV<d
2-11光电子谱仪photoelectron spectrometer: yxUVM`.~
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: <H@!Xw;
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: WCl;#=
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): F20-!b
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus