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真空术语 #0?3RP
Apj[z2nr
1.标准环境条件 standard ambient condition: w/:ibG@
2.气体的标准状态 standard reference conditions forgases: 4V;-*:
3.压力(压强)p pressure: '14 86q@[$
4.帕斯卡Pa pascal: <,Pl31g^
5.托Torr torr: hYh~%^0dt
6.标准大气压atm standard atmosphere: .K1wp G[4
7.毫巴mbar millibar: 1:Ff#Eq,s
8.分压力 partial pressure: v}id/brl
9.全压力 total pressure: f|ERZN`uB
10.真空 vacuum: F("|SOhc
11.真空度 degree of vacuum: =dwy 4
12.真空区域 ranges of vacuum: 4T$DQK@e
13.气体 gas: n1aOpz6`
14.非可凝气体 non-condensable gas: 2a;[2':
15.蒸汽vapor: Z?d][zGw
16.饱和蒸汽压saturation vapor pressure: sgnc$x"
17.饱和度degree of saturation: `4?|yp.|L
18.饱和蒸汽saturated vapor: mN>(n+ly
19.未饱和蒸汽unsaturated vapor: NB5lxaL
20.分子数密度n,m-3 number density of molecules: OO'zIC<z
21.平均自由程ι、λ,m mean free path: GXk
|p8
22.碰撞率ψ collision rate: qu^~K.I"
23.体积碰撞率χ volume collision rate: a_]l?t
24.气体量G quantity of gas: \%9QE
25.气体的扩散 diffusion of gas: Q5l+-
26.扩散系数D diffusion coefficient; diffusivity: u/NcX
27.粘滞流 viscous flow: +~*e B
28.粘滞系数η viscous factor: F>5b[q6~4
29.泊肖叶流 poiseuille flow: Sn^M[}we
30.中间流 intermediate flow: g7lPQ_A*
31.分子流 molecular flow: ;Wa&Dg/5`
32克努曾数 number of knudsen: k2.k}?w!JO
33.分子泻流 molecular effusion; effusive flow: |WpJen*?Y
34.流逸 transpiration: A`Rs
n\
35.热流逸 thermal transpiration: rVRv*W
36.分子流率qN molecular flow rate; molecular flux: rg=Ym.
37.分子流率密度 molecular flow rate density; density of molecular flux: $~j9{*]5
38.质量流率qm mass flow rare: W`P>vK@=
39.流量qG throughput of gas: B#}EYY
40.体积流率qV volume flow rate: yhI;FNSf
41.摩尔流率qυ molar flow rate: xn@oNKD0
42.麦克斯韦速度分布 maxwellian velocity distribution: 0P!Fci/t
43.传输几率Pc transmission probability: Ino]::ZJ/
44.分子流导CN,UN molecular conductance: HV7f%U
45.流导C,U conductance: rQ6>*0xL_
46.固有流导Ci,Ui intrinsic conductance: G1*,~1i
47.流阻W resistance: Ed{sC[j=
48.吸附 sorption: g$vOWSI+
49.表面吸附 adsorption: \rO!lvX
50.物理吸附physisorption: ori[[~OyB
51.化学吸附 chemisorption: F~hH>BH9
52.吸收absorption: .TDg`O24c,
53.适应系数α accommodation factor: VR%*8=
54.入射率υ impingement rate: ykH@kv Qt
55.凝结率condensation rate: xP;>p|
M
56.粘着率 sticking rate: 1C]BaPbL
57.粘着几率Ps sticking probability: Xy`'h5
58.滞留时间τ residence time: Y*O
Bky
59.迁移 migration: rhX?\_7o
60.解吸 desorption: L@_o*"&j
61.去气 degassing: WS?Y8~+{5
62.放气 outgassing: ;Bw3@c
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: ,H<nNBv3M
64.蒸发率 evaporation rate: .u=|h3&
65.渗透 permeation:
;O5Iu
66.渗透率φ permeability: Iz;^D!
67.渗透系数P permeability coefficient jxt]Z3a ~0
2. 1.真空泵 vacuum pumps VVpJ +
1-1.容积真空泵 positive displacement pump: @v!#_%J
⑴.气镇真空泵 gas ballast vacuum pump: cS2]?zI
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: MZh?MaBz06
⑶.干封真空泵 dry-sealed vacuum pump: y\[* mgl:
⑷.往复真空泵 piston vacuum pump: 84i0h$ZZo
⑸.液环真空泵 liquid ring vacuum pump: kA)`i`gt
⑹.旋片真空泵 sliding vane rotary vacuum pump: =W2I0nr.
⑺.定片真空泵 rotary piston vacuum pump: hd[t&?{=
⑻.滑阀真空泵 rotary plunger vacuum pump: rOj(THoc{
⑼.余摆线真空泵 trochoidal vacuum pump: I3i zLi
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: %K7;ePu
⑾.罗茨真空泵 roots vacuum pump: aGws?<1$
1-2.动量传输泵 kinetic vacuum pump: :_nGh]%
⑴.牵引分子泵molecular drag pump: %K06owV(S)
⑵.涡轮分子泵turbo molecular pump: qV,x )y:V
⑶.喷射真空泵ejector vacuum pump: %da-/[
⑷.液体喷射真空泵liquid jet vacuum pump: Y?zo")
⑸.气体喷射真空泵gas jet vacuum pump: l8_RA
⑹.蒸汽喷射真空泵vapor jet vacuum pump : _\=
/~>Xl
⑺.扩散泵diffusion pump : II[-6\d!
⑻.自净化扩散泵self purifying diffusion pump: /11CC \
⑼.分馏扩散泵 fractionating diffusion pump : Qw|y%Td8r
⑽.扩散喷射泵diffusion ejector pump : PL!dkaD^y>
⑾.离子传输泵ion transfer pump: +^J;ic
1-3.捕集真空泵 entrapment vacuum pump: 'YYT1H)
⑴吸附泵adsorption pump: 4!-R&<TLve
⑵.吸气剂泵 getter pump: BO6XY90(
⑶.升华(蒸发)泵 sublimation (evaporation)pump : Gl6:2
⑷.吸气剂离子泵getter ion pump: 9>vB,8
⑸.蒸发离子泵 evaporation ion pump: =}u?1~V
⑹.溅射离子泵sputter ion pump: cS@p`A7Tpo
⑺.低温泵cryopump: i=pfjC
MBU4Awj
2.真空泵零部件 EU'rdG*t/R
2-1.泵壳 pump case: $?VYHkX
2-2.入口 inlet: U2~|AkL
2-3.出口outlet: [ :Sl~
2-4.旋片(滑片、滑阀)vane; blade : ]gF=I5jn]
2-5.排气阀discharge valve: vBM<M3
2-6.气镇阀gas ballast valve: m6 Y0,9
2-7.膨胀室expansion chamber: 9#~jlq(
2-8.压缩室compression chamber: BGOS(
2-9.真空泵油 vacuum pump oil: 1]A\@(
2-10.泵液 pump fluid: YhooD,[.
2-11.喷嘴 nozzle: =*>.z@WQ
2-13.喷嘴扩张率nozzle expansion rate: %zDi|WZ
2-14.喷嘴间隙面积 nozzle clearance area : fjuPGg~
2-15.喷嘴间隙nozzle clearance: vkM_a}%<
2-16.射流jet: 6{g&9~V
2-17.扩散器diffuser: wsc=6/#u
2-18.扩散器喉部diffuser thoat: U^DR'X=
2-19.蒸汽导管vapor tube(pipe;chimney): A8AeM`
2-20.喷嘴组件nozzle assembly: KF!d?
2-21.下裙skirt: AXnKhYlu
%rEP.T\i
3.附件 /c4$m3?]
3-1阱trap: ="Azg8W
⑴.冷阱 cold trap: U9Q[K `
⑵.吸附阱sorption trap: r/0AM}[!*j
⑶.离子阱ion trap: /7Q9(}
⑷.冷冻升华阱 cryosublimation trap: oJ#;X R
3-2.挡板baffle: rg]z
3-3.油分离器oil separator: 8)83j6VF
3-4.油净化器oil purifier: ec*Ni|`Z'
3-5.冷凝器condenser: hQvI}
\Il?$Kb/
4.泵按工作分类 1$:O9{F
4-1.主泵main pump: R4zOiBi'B
4-2.粗抽泵roughing vacuum pump: OF; "%IW~}
4-3.前级真空泵backing vacuum pump: XXD4T9Wy
4-4.粗(低)真空泵 roughing(low)vacuum pump: ofgNL .u
4-5.维持真空泵holding vacuum pump: fj9&J[
4-6.高真空泵high vacuum pump: +HD2]~{EkL
4-7.超高真空泵ultra-high vacuum pump: YhN:t?
4-8.增压真空泵booster vacuum pump: 58`Dcx,yJ
$H/: -v
5.真空泵特性 X2P8Zq=%a
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ]IDhE{
5-2.真空泵的抽气量Q throughput of vacuum pump:。 Fa{[kJ8z
5-3.起动压力starting pressure: KmWd$Qy,
5-4.前级压力 backing pressure : 'c
>^Aai
5-5.临界前级压力 critical backing pressure: :01B)~^
5-6.最大前级压力maximum backing pressure: 3b`#)y^y?%
5-7.最大工作压力maximum working pressure: IL?"g{w
5-8.真空泵的极限压力ultimate pressure of a pump: y7'9KQ
5-9.压缩比compression ratio:
?dk)2
5-10.何氏系数Ho coefficient: BXytAz3
5-11.抽速系数speed factor: zIr-Rx'dL^
5-12.气体的反扩散back-diffusion of gas: 9pk-#/ag
5-13.泵液返流back-streaming of pump fluid: uE..1N&*
5-14.返流率back-streaming rate [3x*47o "z
5-15.返迁移back-migration: fEGnI\
5-16.爆腾bumping: lj+&3<E
5-17.水蒸气允许量qm water vapor tolerable load: LF+E5{=:R
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: N7)K\)DS!z
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: $"6Gv
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump H}8kku>7
3. 1.一般术语 {qs>yQ6a:-
1-1.压力计pressure gauge: xlc2,L;i
1-2.真空计vacuum gauge: ws$kwSHq
⑴.规头(规管)gauge head: fOP3`G^\
⑵.裸规nude gauge : )vY )Mg
⑶.真空计控制单元gauge control unit : w,0OO
f
⑷.真空计指示单元gauge indicating unit : {CX06BP
\J-D@b;
2.真空计一般分类 B& 5Md.h
2-1.压差式真空计differential vacuum gauge: s;[WN.
2-2.绝对真空计 absolute vacuum gauge: g?@fHFct
2-3.全压真空计total pressure vacuum gauge: 74c5\UxA
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: L3s"L.G
2-5.相对真空计relative vacuum gauge : hK %FpGYA
;RMevVw|
3.真空计特性 o,/w E
3-1.真空计测量范围pressure range of vacuum gauge: e`K{
3-2.灵敏度系数sensitivity coefficient: o76{;Bl\O
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 6yC4rX!a
3-5.规管光电流photon current of vacuum gauge head: |:L}/onK
3-6.等效氮压力equivalent nitrogen pressure : K :>O X
3-7.X射线极限值 X-ray limit: '{)Jhl47
3-8.逆X射线效应anti X-ray effect: +.-mqtM
3-9.布利尔斯效应blears effect: ezS@`_pR;
t"vkd
4.全压真空计 uSH_=^yTQ
4-1.液位压力计liquid level manometer: j?\z5i""f
4-2.弹性元件真空计elastic element vacuum gauge: N%)q.'M
4-3.压缩式真空计compression gauge: $M$-c{>s
4-4.压力天平pressure balance: z00,Vr^m
4-5.粘滞性真空计viscosity gauge : =}Yz[-I
4-6.热传导真空计thermal conductivity vacuum gauge : HKVtO%&
4-7.热分子真空计thermo-molecular gauge: }q,d JE
4-8.电离真空计ionization vacuum gauge: StiWa<"c
4-9.放射性电离真空计radioactive ionization gauge: oFsV0 {x%)
4-10.冷阴极电离真空计cold cathode ionization gauge: ~"8r=8|
4-11.潘宁真空计penning gauge: :BB=E'293
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: hUEA)c
4-13.放电管指示器discharge tube indicator: dq0!.gBT2
4-14.热阴极电离真空计hot cathode ionization gauge: Ml'lZ)
4-15.三极管式真空计triode gauge: dZ4c!3'F
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: msQ?V&+<
4-17.B-A型电离真空计Bayard-Alpert gauge: iV!V!0- @
4-18.调制型电离真空计modulator gauge: YdN]Tqc
4-19.抑制型电离真空计suppressor gauge: {HFx+<JG
4-20.分离型电离真空计extractor gauge: 'LR|DS[Ne
4-21.弯注型电离真空计bent beam gauge: >Sb3]$$
4-22.弹道型电离真空计 orbitron gauge : bRr3:"=sE
4-23.热阴极磁控管真空计hot cathode magnetron gauge: h05<1>?|
x0lAJaG
5.分压真空计(分压分析器) e%IbME]x
5-1.射频质谱仪radio frequency mass spectrometer: ` }B,w-,io
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: IsDwa qd|
5-3.单极质谱仪momopole mass spectrometer: 8Y:x+v5
5-4.双聚焦质谱仪double focusing mass spectrometer:
*U`R<mV\
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: )_6W@s
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: [GcW*v
5-7.回旋质谱仪omegatron mass spectrometer: g8@F/$HY
5-8.飞行时间质谱仪time of flight mass spectrometer: DVDzYR**4
|7${E^u
6.真空计校准 x~K79Mya
6-1.标准真空计reference gauges: AJ)&+H
6-2.校准系统system of calibration: Mq_P'/
6-3.校准系数K calibration coefficient: $VF$Ok>
6-4.压缩计法meleod gauge method: 9TwKd0AT$&
6-5.膨胀法expansion method: #WS>Z3AY
6-6.流导法flow method: Qj$w7*U
4. 1.真空系统vacuum system L~RFI&b
1-1.真空机组pump system: #)3 B
1-2.有油真空机组pump system used oil : ?]o(cz
1-3.无油真空机组oil free pump system A4rkwM
1-4.连续处理真空设备continuous treatment vacuum plant: '*Ld,`
1-5.闸门式真空系统vacuum system with an air-lock: l=x(
1-6.压差真空系统differentially pumped vacuum system: M+b?qw
1-7.进气系统gas admittance system: /Z[HU{4
X#zp,7j?
2.真空系统特性参量 T6."j_
2-1.抽气装置的抽速volume flow rate of a pumping unit :
:6/$/`I0W
2-2.抽气装置的抽气量throughput of a pumping unit : Ty#sY'%
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: hDQk zqW
2-4.真空系统的漏气速率leak throughput of a vacuum system: ZB}A^X
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: JpxQS~VX
2-6.极限压力ultimate pressure: t0Jqr)9}6
2-7.残余压力residual pressure: >8b%*f8R
2-8.残余气体谱residual gas spectrum: mI]gDL1
2-9.基础压力base pressure: 'sE["eC
2-10.工作压力working pressure: mkrVeBp
2-11.粗抽时间roughing time: lD-2 5~YV
2-12.抽气时间pump-down time: ap2g^lQXq
2-13.真空系统时间常数time constant of a vacuum system: "h|kf%
W
2-14.真空系统进气时间venting time: ?[P>2oz
9,JWi{lIv
3.真空容器 +L@\/=;G
3-1.真空容器;真空室vacuum chamber: w'E?L`c
3-2.封离真空装置sealed vacuum device: $cU7)vmK`
3-3.真空钟罩vacuum bell jar: rm-;Z<
3-4.真空容器底板vacuum base plate: tGzp=PyA
3-5.真空岐管vacuum manifold: B<HN$/
3-6.前级真空容器(贮气罐)backing reservoir: [rL 8L6,!
3-7.真空保护层outer chamber: /Z,hQ>/
3-8.真空闸室vacuum air lock: S_ UAz
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: \Hf/8!q
7B\Q5fLQ
4.真空封接和真空引入线 ;tF&r1
4-1.永久性真空封接permanent seal : Nwe-7/Q
4.2.玻璃分级过渡封接graded seal : ZKq#PB/.
4-3.压缩玻璃金属封接compression glass-to-metal seal: M'F<1(
4-4.匹配式玻璃金属封接matched glass-to-metal seal: &]shBvzl^
4-5.陶瓷金属封接ceramic-to-metal seal: B2a#:E,6
4-6.半永久性真空封接semi-permanent seal : VR\}*@pNp
4-7.可拆卸的真空封接demountable joint: pLys%1hg
4-8.液体真空封接liquid seal WtaOf_
4-9.熔融金属真空封接molten metal seal: -GM"gkz
4-10.研磨面搭接封接ground and lapped seal: ~"<^4h
4-11.真空法兰连接vacuum flange connection: i5&,Bpfo-
4-12.真空密封垫vacuum-tight gasket:
;NrPMz
4-13.真空密封圈ring gasket: )Y9\>Xj7
4-14.真空平密封垫flat gasket: =LKM)d=1
4-15.真空引入线feedthrough leadthrough: =N8_S$nx(
4-16.真空轴密封shaft seal: cc:$$_'L
4-17.真空窗vacuum window: &%;n9K
4-18.观察窗viewing window: -ZyY95E<
Q'JK *.l
5.真空阀门 *'-t_F';
5-1.真空阀门的特性characteristic of vacuum valves: e+D]9wM8
⑴.真空阀门的流导conductance of vacuum valves: "tK|/R+
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: m7C!}l]9
5-2.真空调节阀regulating valve: ,D]g]#Lq
5-3.微调阀 micro-adjustable valve: BW}M/
5-4.充气阀charge valve: C&R U
5-5.进气阀gas admittance valve:
3bR%#G%
5-6.真空截止阀break valve: R!lug;u#
5-7.前级真空阀backing valve: nc\2A>f`
5-8.旁通阀 by-pass valve: Li"+`
5-9.主真空阀main vacuum valve: P=6d<no&<
5-10.低真空阀low vacuum valve: <VutwtA
5-11.高真空阀high vacuum valve: #z<#oC5
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: )tnbl"0
5-13.手动阀manually operated valve: f}p`<z
5-14.气动阀pneumatically operated valve: odC"#Rb
5-15.电磁阀electromagnetically operated valve: \7>*ULP
5-16.电动阀valve with electrically motorized operation: ^y KkWB*
5-17.挡板阀baffle valve: s=F[.X9lp
5-18.翻板阀flap valve: F",TP,X
5-19.插板阀gate valve: iyd$_CJ z
5-20.蝶阀butterfly valve: q=D8 Nz
u[Si=)`VPk
6.真空管路 D~U RY_[A
6-1.粗抽管路roughing line: C"B'Dj
6-2.前级真空管路backing line: }!R*Q`m
6-3.旁通管路;By-Pass管路 by-pass line: R!
On
6-4.抽气封口接头pumping stem: Y:L[Iz95o
6-5.真空限流件limiting conductance: _cj=}!I
6-6.过滤器filter: #D|%r-:"
5. 1.一般术语 o3GkTn O
1-1真空镀膜vacuum coating: 19c_=$mV
1-2基片substrate: _aF8Us
1-3试验基片testing substrate: ir>h3Zk
1-4镀膜材料coating material: N3aqNRwlk
1-5蒸发材料evaporation material: l U4 I*
1-6溅射材料sputtering material: m-ibS:
1-7膜层材料(膜层材质)film material: }LKD9U5;8
1-8蒸发速率evaporation rate: FQ1B%u|
1-9溅射速率sputtering rate: a:`<=^:4,
1-10沉积速率deposition rate: |iX>hJSl
1-11镀膜角度coating angle: dcD#!v\0
Q"nw.FjUG
2.工艺 dE_"|,:
2-1真空蒸膜vacuum evaporation coating: b1jDbiH&
(1).同时蒸发simultaneous evaporation: SQn.`0HT
(2).蒸发场蒸发evaporation field evaporation: _*%K!%}l=
(3).反应性真空蒸发reactive vacuum evaporation: =~Qg(=U0U
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ^v'0\(H?P
(5).直接加热的蒸发direct heating evaporation: g?Nk-cg
(6).感应加热蒸发induced heating evaporation: US(RWXyg
(7).电子束蒸发electron beam evaporation:
DuR9L'
(8).激光束蒸发laser beam evaporation: CEaAtAM
(9).间接加热的蒸发indirect heating evaporation: v[{7\Hha
(10).闪蒸flash evaportion: k{{3nenAG
2-2真空溅射vacuum sputtering: v<g=uEpN
(1).反应性真空溅射 reactive vacuum sputtering: +Ln^<!P
(2).偏压溅射bias sputtering: oe2*$\?.
(3).直流二级溅射direct current diode sputtering: B5vLV@>]
(4).非对称性交流溅射asymmtric alternate current sputtering: fpf,gb8[$n
(5).高频二极溅射high frequency diode sputtering: Qg~w 3~
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: WysWg7,r
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: <N$ Hb2b
(8).离子束溅射ion beam sputtering: :r hB=
(9).辉光放电清洗glow discharge cleaning: ~ZSX84~@u
2-3物理气相沉积PVD physical vapor deposition: jX8)Ov5Mv
2-4化学气相沉积CVD chemical vapor deposition: {d;z3AB
2-5磁控溅射magnetron sputtering: T$%QK?B
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: GdNhEv
2-7空心阴极离子镀HCD hollow cathode discharge deposition: :i?6#_2IC
2-8电弧离子镀arc discharge deposition: M'<% d[
>!s<JKhI
3.专用部件 tzGQo5\
3-1镀膜室coating chamber: OZe&p
3-2蒸发器装置evaporator device: R@z`
3-3蒸发器evaporator: YW&K,)L@
3-4直接加热式蒸发器evaporator by direct heat: /7Pqy2sgE
3-5间接加热式蒸发器evaporator by indirect heat: YX-j|m|
3-7溅射装置sputtering device: g=Xy{Vm
3-8靶target: 9t)Hi qj
3-10时控挡板timing shutter: eS@j? Y0y
3-11掩膜mask: 4s9@4
3-12基片支架substrate holder: iJ^}{-
3-13夹紧装置clamp: p|A ?F0
3-14换向装置reversing device: ou~$XZ7oi
3-15基片加热装置substrate heating device: eT3!"+p-F
3-16基片冷却装置substrate colding device: WA43}CyAe
.x,y[/[[)
4.真空镀膜设备 IAwS39B
4-1真空镀膜设备vacuum coating plant: ud5}jyJ
(1).真空蒸发镀膜设备vacuum evaporation coating plant: CZu=/8?
(2).真空溅射镀膜设备vacuum sputtering coating plant:
6A]I" E]5
4-2连续镀膜设备continuous coating plant: [O&}Qk
4-3半连续镀膜设备semi- continuous coating plant J QnaXjW2
6. 1.漏孔 RIXeV*ix
1-1漏孔leaks: Q\kWQOB_
1-2通道漏孔channel leak: #UL75
1-3薄膜漏孔membrane leak: T*%GeY
[
1-4分子漏孔molecular leak: SN ?Z7
1-5粘滞漏孔vixcous leak: axvZA:l
1-6校准漏孔calibrated leak: c YgJ}(>}
1-7标准漏孔reference leak : Y=G`~2Pr=
1-8虚漏virtual leak: kOD=H-vSi
1-9漏率leak rate: ydO+=R0M
1-10标准空气漏率standard air leak rate: }#ta3 x
1-11等值标准空气漏率equivalent standard air leak rate: 06 %-tAq:
1-12探索(示漏)气体: o
[V8h@K)
Qe_{<E
2.本底 EG`AkWy
2-1本底background: 5wx~QV=Hh
2-2探索气体本底search gas background : fb `x1Q
2-3漂移drift: d%qi~koN_
2-4噪声noise: c:0n/DC
+vxf_*0;
3.检漏仪 /fb}]e]N
3-1检漏仪leak detector: iTAj${ >
3-2高频火花检漏仪H.F. spark leak detector: E!1\9wzM{
3-3卤素检漏仪halide leak detector: e_Hpai<b
3-4氦质谱检漏仪helium mass spectrometer leak detector: I@Hx
LEGj
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: >JE+g[$@
lPxhqF5pP
4.检漏 yXDjM2oR/2
4-1气泡检漏leak detection by bubbles: uCB9;+ Hjw
4-2氨检漏leak detection by ammonia: E-C]<{`O
4-3升压检漏leak detection of rise pressure: a5t&{ajJ
4-4放射性同位素检漏radioactive isotope leak detection: |X:`o;Uma
4-5荧光检漏fluorescence leak detection =l/Dc=[
7. 1.一般术语 v LN KX;9
1-1真空干燥vacuum drying: z*jaA;#
1-2冷冻干燥freeze drying : {Dl@/fz
1-3物料material: i4i9EvWp
1-4待干燥物料material to be dried: &Hp*A^M
1-5干燥物料dried material : 4y3c=L
No
1-6湿气moisture;humidity: ^uUA41o`eJ
1-7自由湿气free moisture: DmuQE~DV
1-8结合湿气bound moisture: zCo$YP#5_
1-9分湿气partial moisture: )r{Wj*u
1-10含湿量moisture content: @br)m](@
1-11初始含湿量initial moisture content: K2x2Y=
1-12最终含湿量final residual moisture: DVhBZ!u9
1-13湿度degree of moisture ,degree of humidity : +u$JMp
1-14干燥物质dry matter : KZ[TW,Gw
1-15干燥物质含量content of dry matter: Yh1nXkA!V
{f`Y\_r$@
2.干燥工艺 9Jh&C5\\
2-1干燥阶段stages of drying : P!f0&W
(1).预干燥preliminary dry: Za!KM
(2).一次干燥(广义)primary drying(in general): tDL.+6/
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): C=o-3w
(4).二次干燥secondary drying: k;cX,*DIn
2-2.(1).接触干燥contact drying: TPBQfp%HU
(2).辐射干燥 drying by radiation : ._tEDY/1m
(3).微波干燥microwave drying: QObVJg,GD
(4).气相干燥vapor phase drying: [Lje?M* r
(5).静态干燥static drying: QAxy?m,'
(6).动态干燥dynamic drying: {0F/6GwUC
2-3干燥时间drying time: wg)Bx#>\L:
2-4停留时间length of stay(in the drying chamber): BZ.l[LMp
2-5循环时间cycle time: {~O4*2zg;K
2-6干燥率 dessication ratio : #KoI8U"
2-7去湿速率mass flow rate of humidity: OW};i|
2-8单位面积去湿速率mass flow rate of humidity per surface area: ~
2Hw\fx
2-9干燥速度 drying speed : ui)mYR[8X
2-10干燥过程drying process: 7c(j1:Ku-
2-11加热温度heating temperature: FNraof @Oy
2-12干燥温度temperature of the material being dried : ;6hoG(3
+
2-13干燥损失loss of material during the drying process : v=G*K11@
2-14飞尘lift off (particles):
5TpvJ1G
2-15堆层厚度thickness of the material: 3xz~##
/_J{JGp9
3.冷冻干燥 <& PU%^Ha
3-1冷冻freezing: '6NrL;
(1).静态冷冻static freezing: u
`xQC/
(2).动态冷冻dynamic freezing: 2Cy,#X%j>
(3).离心冷冻centrifugal freezing: o%j?}J7y
(4).滚动冷冻shell freezing: \Db`RvEmR
(5).旋转冷冻spin-freezing: ]'%
iR
(6).真空旋转冷冻vacuum spin-freezing: >F7HKwg}Z
(7).喷雾冷冻spray freezing: rQT%~oM:
(8).气流冷冻air blast freezing: #J/RI[a
3-2冷冻速率rate of freezing: FYFlh^}
3-3冷冻物料frozen material: :I&y@@UG
3-4冰核ice core: nU{Qi;0
3-5干燥物料外壳envelope of dried matter: >ryA:TO{
3-6升华表面sublimation front: 3HuocwWbz
3-7融化位置freezer burn: L7<30"7
$}b)EMMM
4.真空干燥设备;真空冷冻干燥设备 kdGq\k,
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: l*hWws[
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: om`B:=+
4-3加热表面heating surface: 8*b{8%<K
4-4物品装载面shelf : j<!dpt
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 1mtYap4
4-6单位面积干燥器处理能力throughput per shelf area: $LuU
4-7冰冷凝器ice condenser: AEj%8jh
4-8冰冷凝器的负载load of the ice condenser: :+\sKEzL
4-9冰冷凝器的额定负载rated load of the ice condenser Bt")RG
8. 1.一般术语 {ly <%Q7j
1-1试样sample : I:DAn!N-A*
(1).表面层surface layer: CzreX3i
(2).真实表面true surface: whw+
(3).有效表面积effective surface area: 7&P70DO
(4).宏观表面;几何表面macroscopic surface area; geometric surface area:
I__b$
(5).表面粒子密度surface particle density: 7P2(q
(6).单分子层monolayer: F|+B8&-v
(7).表面单分子层粒子密度monolayer density: a(yWIgD\\
(8).覆盖系数coverage ratio: o`QH8
1-2激发excitation: aJ=)5%$6kc
(1).一次粒子primary particle: H1?C:R
(2).一次粒子通量primary particle flux: ~kV>nx2
(3).一次粒子通量密度density of primary particle flux: k1g-%DB
(4).一次粒子负荷primary particle load: $ Lfbt=f
(5).一次粒子积分负荷integral load of primary particle: 8q]"CFpa
(6).一次粒子的入射能量energy of the incident primary particle: H~#$AD+H
(7).激发体积excited volume: #"r_ 3
(8).激发面积excited area: D0bpD
(9).激发深度excited death: :/SGB3gb1t
(10).二次粒子secondary particles: *B@#A4f"
(11).二次粒子通量secondary particle flux: ,if~%'9j
(12).二次粒子发射能energy of the emitted secondary particles: _&gO>G,uy
(13).发射体积emitting volume: ZR=i*y
(14).发射面积emitting area: l{3zlXk3z
(15).发射深度emitting depth: i4> M
(16).信息深度information depth: z7?SuJ
(17).平均信息深度mean information depth: )R<93`q
1-3入射角angle of incidence: lBG=jOS
1-4发射角angle of emission: v h)CB8
1-5观测角observation: R86i2',
1-6分析表面积analyzed surface area: QYDI-<.(
1-7产额 yield : 9k62_]w@6
1-8表面层微小损伤分析minimum damage surface analysis: IY!.j5q8
1-9表面层无损伤分析non-destructive surface analysis: 5IzCQqOPgX
1-10断面深度分析 profile analysis in depth; depth profile analysis : 0wqw5KC
1-11可观测面积observable area: s+ *LVfau
1-12可观测立体角observable solid angle : ;mD!8<~z.
1-13接受立体角;观测立体角angle of acceptance: \N|}V.r
1-14角分辨能力angular resolving power: Hxac#(,7
1-15发光度luminosity: e$QMR.'
1-16二次粒子探测比detection ratio of secondary particles: z\,
lPwB2
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ~3Qa-s;g
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: G]xN#O;
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: K0'p*[yO/j
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: ODpAMt"
1-21本底压力base pressure: JB5%\
1-22工作压力working pressure: )2d1@]6#
)9/iH(
2.分析方法 753gcY#i
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: lxD~l#)^ln
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : t=:5?}J.Q$
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: SMB&sl
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: F|VHr@%
2-3离子散射表面分析ion scattering spectroscopy: 1:DA{ejS
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 0#8lg@e8
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: rOUQg_y
2-6离子散射谱仪ion scattering spectrometer: eln$,zK/b
2-7俄歇效应Auger process: L1 k
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: 3-;<G
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: =NK'xPr
2-10光电子谱术photoelectron spectroscopy : Om7 '_}
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 9w0v?%%_
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: n
sN n>{
2-11光电子谱仪photoelectron spectrometer: pK>/c>de
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: \G/ZA) t
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 8<6@O
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): $_a/!)bP
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus