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真空术语 ?-9uf\2_
7\nXJ381
1.标准环境条件 standard ambient condition: 'YbE%i}
2.气体的标准状态 standard reference conditions forgases: # SJJ@SM
3.压力(压强)p pressure: 8*B+@`
4.帕斯卡Pa pascal: $txF|Fj]^A
5.托Torr torr: 7D 3-/_ v
6.标准大气压atm standard atmosphere: rADzJ#CU\
7.毫巴mbar millibar: p__N6a
8.分压力 partial pressure: <*u^8lCA
9.全压力 total pressure: Kf$(7FT'`
10.真空 vacuum: (LXYx<
11.真空度 degree of vacuum: !SnLvW89Z
12.真空区域 ranges of vacuum: #D{Eq8dp
13.气体 gas: s0x/2z
14.非可凝气体 non-condensable gas: ${wp}<u_
15.蒸汽vapor: ~mK+Q%G5
16.饱和蒸汽压saturation vapor pressure: >YF=6zq.`
17.饱和度degree of saturation: fWri7|"0h
18.饱和蒸汽saturated vapor: GGhk`z
19.未饱和蒸汽unsaturated vapor: q j9q
20.分子数密度n,m-3 number density of molecules: BE~-0g$W
21.平均自由程ι、λ,m mean free path: @}{uibLD\
22.碰撞率ψ collision rate: 9^Web~yi#
23.体积碰撞率χ volume collision rate: 9pS:#hg
24.气体量G quantity of gas: bt.3#aj
25.气体的扩散 diffusion of gas: Hmx.BBz
26.扩散系数D diffusion coefficient; diffusivity: TVSCjI
27.粘滞流 viscous flow: vMJ(Ll7/
28.粘滞系数η viscous factor: 4Xt`L"f
29.泊肖叶流 poiseuille flow: alNn(0MG
30.中间流 intermediate flow: U:c0s
31.分子流 molecular flow: ^si[L52BZ
32克努曾数 number of knudsen: 1:@ScHS
33.分子泻流 molecular effusion; effusive flow: utC^wA5U~
34.流逸 transpiration: s6_i>
35.热流逸 thermal transpiration: 9!Xp+<
36.分子流率qN molecular flow rate; molecular flux: C6@*l~j
37.分子流率密度 molecular flow rate density; density of molecular flux: oZl%0Uy?9I
38.质量流率qm mass flow rare: = iDd{$
39.流量qG throughput of gas: n^5Q
f\ o
40.体积流率qV volume flow rate: Hfo<EB2Y9N
41.摩尔流率qυ molar flow rate: mV4gw'.;7
42.麦克斯韦速度分布 maxwellian velocity distribution: &0%B3
43.传输几率Pc transmission probability: EQ :>]O
44.分子流导CN,UN molecular conductance: S0r+Y0J]<
45.流导C,U conductance: -O-?hsV)y
46.固有流导Ci,Ui intrinsic conductance: &_hEM~{
47.流阻W resistance: E_Y!in
70
48.吸附 sorption: Iu >4+6
49.表面吸附 adsorption: #
kNp);
50.物理吸附physisorption: r{SDJa
51.化学吸附 chemisorption: nvNF~)mu
52.吸收absorption: V*Xr}FE
53.适应系数α accommodation factor: &k-NDh3
54.入射率υ impingement rate: fM*?i"j;Y
55.凝结率condensation rate: hJir_=
56.粘着率 sticking rate: RQ^
\|+_
57.粘着几率Ps sticking probability: U^U
hZ!
58.滞留时间τ residence time: V3d$C&<(
59.迁移 migration: ?<8c
60.解吸 desorption: e L}X().
61.去气 degassing: FCKyKn
62.放气 outgassing: KHJ wCv
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: [/ertB
64.蒸发率 evaporation rate: ~82 {Y
_{/
65.渗透 permeation: s| Q1;%Tj
66.渗透率φ permeability: Sl<1Rme=w
67.渗透系数P permeability coefficient Z'}%Mkm`i}
2. 1.真空泵 vacuum pumps h.l.da1#
1-1.容积真空泵 positive displacement pump: 19!;0fe=
⑴.气镇真空泵 gas ballast vacuum pump: .c__T{<)[
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ?cKTeGrS
⑶.干封真空泵 dry-sealed vacuum pump: 9$C?)XKXB
⑷.往复真空泵 piston vacuum pump: :)tsz;
⑸.液环真空泵 liquid ring vacuum pump: 3Lq9pdM>2@
⑹.旋片真空泵 sliding vane rotary vacuum pump: >lzXyT6x8
⑺.定片真空泵 rotary piston vacuum pump: ?.lo[X<,*
⑻.滑阀真空泵 rotary plunger vacuum pump: U0{)goN.
⑼.余摆线真空泵 trochoidal vacuum pump: dn Sb}J
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump:
_VmXs&4
⑾.罗茨真空泵 roots vacuum pump: Ryxu#]s
1-2.动量传输泵 kinetic vacuum pump: &?Q^i">cZ
⑴.牵引分子泵molecular drag pump: &rPAW V'v
⑵.涡轮分子泵turbo molecular pump: #:/27
⑶.喷射真空泵ejector vacuum pump: #Er"i
⑷.液体喷射真空泵liquid jet vacuum pump: :eJJL,v
⑸.气体喷射真空泵gas jet vacuum pump: A,=>
|&*
⑹.蒸汽喷射真空泵vapor jet vacuum pump : y'>JT/Q5
⑺.扩散泵diffusion pump : !y'>sAf
⑻.自净化扩散泵self purifying diffusion pump: F[!%,-*
⑼.分馏扩散泵 fractionating diffusion pump : tns8B
⑽.扩散喷射泵diffusion ejector pump : *p#@W-:9E
⑾.离子传输泵ion transfer pump: Z2H bAI8
1-3.捕集真空泵 entrapment vacuum pump: U?5lqq
⑴吸附泵adsorption pump: v2p0EOS
⑵.吸气剂泵 getter pump: -/0\_zq7
⑶.升华(蒸发)泵 sublimation (evaporation)pump : M* Ej*#
⑷.吸气剂离子泵getter ion pump: m.! M#x2!
⑸.蒸发离子泵 evaporation ion pump: 1sonDBd0@;
⑹.溅射离子泵sputter ion pump: 84WcaH
⑺.低温泵cryopump: XuHR
(c^ {T)
2.真空泵零部件 <p/2 hHfiD
2-1.泵壳 pump case: "19#{yX4
2-2.入口 inlet: {x_cgsn
2-3.出口outlet: -qHG*v,
2-4.旋片(滑片、滑阀)vane; blade : |0}7/^
2-5.排气阀discharge valve: .y3E@0a
2-6.气镇阀gas ballast valve: CYwV]lq:s
2-7.膨胀室expansion chamber: 3(,m(+J[S
2-8.压缩室compression chamber: HpfZgkC+
2-9.真空泵油 vacuum pump oil: -;&I S
2-10.泵液 pump fluid: 'g'RXC}D>
2-11.喷嘴 nozzle: \b8#xT}
2-13.喷嘴扩张率nozzle expansion rate: k<+Sj
h$
2-14.喷嘴间隙面积 nozzle clearance area : m6$&yKQ-=h
2-15.喷嘴间隙nozzle clearance: RjPkH$u'Pj
2-16.射流jet: Hc8He!X*#
2-17.扩散器diffuser: ^H1m8=
2-18.扩散器喉部diffuser thoat: u~Po5W/i
2-19.蒸汽导管vapor tube(pipe;chimney): <*dcl2xS
2-20.喷嘴组件nozzle assembly: Qzo -Yw`=
2-21.下裙skirt: ~_N,zw{x
f5b|,JJ
3.附件 _5~|z$GW
3-1阱trap: Fw{@RQf8
⑴.冷阱 cold trap: j%-Ems*H
⑵.吸附阱sorption trap: ecoI-@CAI
⑶.离子阱ion trap: bn8maYUZ
⑷.冷冻升华阱 cryosublimation trap: /#(IV_Eol
3-2.挡板baffle: i$@xb_
3-3.油分离器oil separator: {k-_+#W"
3-4.油净化器oil purifier: F~
\ONO5
3-5.冷凝器condenser: fDplYn#
S Z/yijf
4.泵按工作分类 p5vQ.Ni*\-
4-1.主泵main pump: #0uu19+}
4-2.粗抽泵roughing vacuum pump: X1a~l|$h
4-3.前级真空泵backing vacuum pump: a{^z= =
4-4.粗(低)真空泵 roughing(low)vacuum pump: A:GqR;;"x>
4-5.维持真空泵holding vacuum pump: CLVT5pj='
4-6.高真空泵high vacuum pump: )j~{P
4-7.超高真空泵ultra-high vacuum pump: iQ8{N:58DN
4-8.增压真空泵booster vacuum pump: %7aJSuQN%
knG:6tQ
5.真空泵特性 9"+MZ$
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: %N~c9B
5-2.真空泵的抽气量Q throughput of vacuum pump:。 @-\=`#C**
5-3.起动压力starting pressure: +pYwc0~
5-4.前级压力 backing pressure : F9K`N8wlu
5-5.临界前级压力 critical backing pressure: LTo!DUi`
5-6.最大前级压力maximum backing pressure: D})/2O p
5-7.最大工作压力maximum working pressure: ]wEI*c(
5-8.真空泵的极限压力ultimate pressure of a pump: :.XlAQR~b
5-9.压缩比compression ratio: &&P9T/Zks
5-10.何氏系数Ho coefficient: g_P98_2f.k
5-11.抽速系数speed factor: 50-7L,
5-12.气体的反扩散back-diffusion of gas: #t(/wa4
5-13.泵液返流back-streaming of pump fluid: |^UQVNJ
5-14.返流率back-streaming rate w`f66*@Q1
5-15.返迁移back-migration:
lqL5V"2Y
5-16.爆腾bumping: {S9gOg
5-17.水蒸气允许量qm water vapor tolerable load: 9=]HOUn
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: [#Gu?L_W
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: %po;ih$jr*
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump `Kf@<=
3. 1.一般术语 6:B,ir
_
1-1.压力计pressure gauge: hDW_a y4
1-2.真空计vacuum gauge: .$x}~Sw
⑴.规头(规管)gauge head: !]g[u3O
⑵.裸规nude gauge : l:eC+[_;>
⑶.真空计控制单元gauge control unit : *v K~t|z
⑷.真空计指示单元gauge indicating unit : lV^:2I/
6c-'CW
2.真空计一般分类 XA;PWl5!
2-1.压差式真空计differential vacuum gauge: dO1m
2-2.绝对真空计 absolute vacuum gauge: uchQv]VB
2-3.全压真空计total pressure vacuum gauge: (n?f016*%d
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: XfVdYmii
2-5.相对真空计relative vacuum gauge : .txtt?ZF2
U9b[t
3.真空计特性 S>(x x"Ia
3-1.真空计测量范围pressure range of vacuum gauge: T$2A2gb`
3-2.灵敏度系数sensitivity coefficient: DGCvH)Q
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 5!Y\STn
3-5.规管光电流photon current of vacuum gauge head: dazML|1ow
3-6.等效氮压力equivalent nitrogen pressure : &(,&mE
3-7.X射线极限值 X-ray limit: (EWGX |QA
3-8.逆X射线效应anti X-ray effect: |&MoQxw@
3-9.布利尔斯效应blears effect: R,PN?aj
DeF`#a0E
4.全压真空计 WeH_1$n5
4-1.液位压力计liquid level manometer: pn(i18x
4-2.弹性元件真空计elastic element vacuum gauge: ,#,K_oz
4-3.压缩式真空计compression gauge: !\%JOf}
4-4.压力天平pressure balance: H'YK j'
4-5.粘滞性真空计viscosity gauge : 8w[O%
4-6.热传导真空计thermal conductivity vacuum gauge : 1/:vFX
4-7.热分子真空计thermo-molecular gauge: *lLCH,
4-8.电离真空计ionization vacuum gauge: ]6`K
4-9.放射性电离真空计radioactive ionization gauge: -nC&t~sD
4-10.冷阴极电离真空计cold cathode ionization gauge: @Nh}^D >j
4-11.潘宁真空计penning gauge: YiuV\al
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: "OI$PLK
4-13.放电管指示器discharge tube indicator: 2RNee@!JJP
4-14.热阴极电离真空计hot cathode ionization gauge: 2Q@na@s
4-15.三极管式真空计triode gauge: [O_5`X9|
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: 6<S-o|Xw
4-17.B-A型电离真空计Bayard-Alpert gauge: 6q>iPK Jt
4-18.调制型电离真空计modulator gauge: 420K6[
4-19.抑制型电离真空计suppressor gauge: oP56f"BE(
4-20.分离型电离真空计extractor gauge: Y_y!$jd(N
4-21.弯注型电离真空计bent beam gauge: By7lSbj
4-22.弹道型电离真空计 orbitron gauge : (NR( )2
4-23.热阴极磁控管真空计hot cathode magnetron gauge: *.wj3'wV
LNk :PD0m
5.分压真空计(分压分析器) DUu:et&c1
5-1.射频质谱仪radio frequency mass spectrometer: ]=-=D9ZS3
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: W%^!<bFk}m
5-3.单极质谱仪momopole mass spectrometer: o!+'<IQ'
5-4.双聚焦质谱仪double focusing mass spectrometer: 3)=ix. wW
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: O_2o/
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 58#nYt
5-7.回旋质谱仪omegatron mass spectrometer:
P6> C+T1
5-8.飞行时间质谱仪time of flight mass spectrometer: lbovwj
UJL'4 t/
6.真空计校准 _ti^i\8~
6-1.标准真空计reference gauges: }eZ\~2
6-2.校准系统system of calibration: 4pXY7+e2'
6-3.校准系数K calibration coefficient: s1W n.OGR4
6-4.压缩计法meleod gauge method: 8b7I\J`
6-5.膨胀法expansion method: k3B_M9>!
6-6.流导法flow method: 5X];?(VTsb
4. 1.真空系统vacuum system NkGtZ.!pk
1-1.真空机组pump system: &I'J4gk[
1-2.有油真空机组pump system used oil : Lhg
1-3.无油真空机组oil free pump system (Lz|o!>
1-4.连续处理真空设备continuous treatment vacuum plant: V[WZ#u-p
1-5.闸门式真空系统vacuum system with an air-lock: 5WfZd
1-6.压差真空系统differentially pumped vacuum system: w0$+v/
1-7.进气系统gas admittance system: ^5~x*=_
PEjd
2.真空系统特性参量 gk8v{'0Er
2-1.抽气装置的抽速volume flow rate of a pumping unit : k-^^Ao*@
2-2.抽气装置的抽气量throughput of a pumping unit : 1 <T|
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 7W4m&+
2-4.真空系统的漏气速率leak throughput of a vacuum system: dVLrA`'P*
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: k??CXW
2-6.极限压力ultimate pressure: {y@8E>y5$
2-7.残余压力residual pressure: N|)e {|k
2-8.残余气体谱residual gas spectrum: t6-fG/Kc
2-9.基础压力base pressure: _[&.`jTFn
2-10.工作压力working pressure: 9CwtBil<#g
2-11.粗抽时间roughing time: /03Wst
2-12.抽气时间pump-down time: wt@TR~a
2-13.真空系统时间常数time constant of a vacuum system: QRl+7V
2-14.真空系统进气时间venting time: U_aI!`WXd
;QG8@ms|
3.真空容器 oIj/V|ByK
3-1.真空容器;真空室vacuum chamber: /u]#dX5
3-2.封离真空装置sealed vacuum device: Kt]vTn7!9
3-3.真空钟罩vacuum bell jar: L?8OWLjRy
3-4.真空容器底板vacuum base plate: L*6<h
3-5.真空岐管vacuum manifold: CUC]-]8
3-6.前级真空容器(贮气罐)backing reservoir: 9'|k@i:
3-7.真空保护层outer chamber: I}y6ke!
3-8.真空闸室vacuum air lock: xo
^|d3
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: dW5r]D[Cx
7}c[GC)F
4.真空封接和真空引入线 86qQ"=v
4-1.永久性真空封接permanent seal : Ik5-ooZ&{
4.2.玻璃分级过渡封接graded seal : ~tW<]l7
4-3.压缩玻璃金属封接compression glass-to-metal seal: ^l
;Bo3^_
4-4.匹配式玻璃金属封接matched glass-to-metal seal: I-J%yutB
4-5.陶瓷金属封接ceramic-to-metal seal: &DtI+)[|
4-6.半永久性真空封接semi-permanent seal : _E-{*,7bZS
4-7.可拆卸的真空封接demountable joint: gLo&~|=L-
4-8.液体真空封接liquid seal
}7fzEo`g
4-9.熔融金属真空封接molten metal seal: I~"l9Jc!"
4-10.研磨面搭接封接ground and lapped seal: W S9:*YH
4-11.真空法兰连接vacuum flange connection: Q>w)b]d~c
4-12.真空密封垫vacuum-tight gasket: p ~+sk1[.
4-13.真空密封圈ring gasket: Ft :_6T%
4-14.真空平密封垫flat gasket: dKchQsgCg
4-15.真空引入线feedthrough leadthrough: ~<Wa$~oY
4-16.真空轴密封shaft seal: @\-*aS_8>
4-17.真空窗vacuum window: Rdd9JJsVd
4-18.观察窗viewing window: Bz:Hp{7&
_m#TL60m
5.真空阀门 *z~J ]
5-1.真空阀门的特性characteristic of vacuum valves: <A\g*ld
⑴.真空阀门的流导conductance of vacuum valves: n*|8(fD
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 0U.Ld:
5-2.真空调节阀regulating valve: [P)](8nR[
5-3.微调阀 micro-adjustable valve: eIPk$j{e
5-4.充气阀charge valve: |VM=:}s&
5-5.进气阀gas admittance valve: C<^S$
5-6.真空截止阀break valve: &Dp&
5-7.前级真空阀backing valve: [a^<2V!vMn
5-8.旁通阀 by-pass valve: D[YdPg@-
5-9.主真空阀main vacuum valve: fl_a@QdB#
5-10.低真空阀low vacuum valve: F*:H&,
5-11.高真空阀high vacuum valve: >u
.u#d e
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 6,R<8a;Wn
5-13.手动阀manually operated valve: fv>Jn`
5-14.气动阀pneumatically operated valve: ^ilgd
5-15.电磁阀electromagnetically operated valve: LzB*d
5-16.电动阀valve with electrically motorized operation: dW^#}kN7V
5-17.挡板阀baffle valve: eo"XHP7ja
5-18.翻板阀flap valve: TQ {8 ee{
5-19.插板阀gate valve: lrMkp@f.
5-20.蝶阀butterfly valve: GsqO^SV
*9r 32]i;
6.真空管路 ;:)u
rI?
6-1.粗抽管路roughing line: N71^ I"@HH
6-2.前级真空管路backing line: U!nNT==
6-3.旁通管路;By-Pass管路 by-pass line: Y$3liDeL=
6-4.抽气封口接头pumping stem: o3OJI_
v&
6-5.真空限流件limiting conductance: bG)6p05Oa
6-6.过滤器filter: SQw"mO
5. 1.一般术语 .d4&s7n0
1-1真空镀膜vacuum coating: %NL7XU[~
1-2基片substrate: JQ\o[t
1-3试验基片testing substrate: ljh,%#95=
1-4镀膜材料coating material: 5pE@Ww
1-5蒸发材料evaporation material: wqXo]dX
1-6溅射材料sputtering material: yv5c0G.D
1-7膜层材料(膜层材质)film material: XToYtdt2
1-8蒸发速率evaporation rate: _x7>d:C
1-9溅射速率sputtering rate: 3SOrM
1-10沉积速率deposition rate: [rhK2fr:i
1-11镀膜角度coating angle: ??P>HVx
hN1{?PQ
2.工艺 7q^a@5f BG
2-1真空蒸膜vacuum evaporation coating: .-p?skm=a
(1).同时蒸发simultaneous evaporation: t\<*Q3rl-
(2).蒸发场蒸发evaporation field evaporation: d8f S79
(3).反应性真空蒸发reactive vacuum evaporation: Jz_`dLL^w
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: tpKQ$)ed
(5).直接加热的蒸发direct heating evaporation: ?eR^\-e
(6).感应加热蒸发induced heating evaporation: @,q<][q
(7).电子束蒸发electron beam evaporation: O@KAh5EB
(8).激光束蒸发laser beam evaporation: $D#eD.
(9).间接加热的蒸发indirect heating evaporation: XZPq4(,9}
(10).闪蒸flash evaportion: a^9}ceu?
2-2真空溅射vacuum sputtering: RXbZaje$
(1).反应性真空溅射 reactive vacuum sputtering: }9&~+Q2
(2).偏压溅射bias sputtering: _5768G`P
(3).直流二级溅射direct current diode sputtering: &eX^ll
(4).非对称性交流溅射asymmtric alternate current sputtering: l8!n!sC[,
(5).高频二极溅射high frequency diode sputtering: HBgt!D0MZ
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ^(yU)k3pu
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: sX=_|<[
(8).离子束溅射ion beam sputtering: >K;C?gHo
(9).辉光放电清洗glow discharge cleaning: #c2JWDH1F
2-3物理气相沉积PVD physical vapor deposition: as@I0e((
2-4化学气相沉积CVD chemical vapor deposition: j&=!F3[
2-5磁控溅射magnetron sputtering: k%ckV`y
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: '\Hh
2-7空心阴极离子镀HCD hollow cathode discharge deposition: |Ns[{/
2-8电弧离子镀arc discharge deposition: EWoGdH|
&1Idv}@!
3.专用部件 r;&rc:?A
3-1镀膜室coating chamber: B976{;QvXV
3-2蒸发器装置evaporator device: X9n},}bJ"
3-3蒸发器evaporator: ^<'=]?xr
3-4直接加热式蒸发器evaporator by direct heat: h{M.+I$}C
3-5间接加热式蒸发器evaporator by indirect heat: OLxiY r
3-7溅射装置sputtering device: Y[ toN9,
3-8靶target: /*{s1Zcb
3-10时控挡板timing shutter: x AR9* <-
3-11掩膜mask: .
[\S=K|/
3-12基片支架substrate holder: H!dg(d^
3-13夹紧装置clamp: skn];%[v\
3-14换向装置reversing device: 5J8U] :Y)
3-15基片加热装置substrate heating device: @phb5
3-16基片冷却装置substrate colding device: cYp]zn+6
SdBo sB3v>
4.真空镀膜设备 ;3WVrYe
4-1真空镀膜设备vacuum coating plant: L+y90 T6?
(1).真空蒸发镀膜设备vacuum evaporation coating plant: '\.fG\xD
(2).真空溅射镀膜设备vacuum sputtering coating plant: =;^#5dpt$
4-2连续镀膜设备continuous coating plant: 3 ]}wZY0
4-3半连续镀膜设备semi- continuous coating plant 8DP] C9
6. 1.漏孔 Kr'5iFK7
1-1漏孔leaks: 7LY4q/
1-2通道漏孔channel leak: BliL1"".
1-3薄膜漏孔membrane leak: DkGC+Dw
1-4分子漏孔molecular leak: n$}Cj}eju
1-5粘滞漏孔vixcous leak: 7 xm>+(
1-6校准漏孔calibrated leak: xA>O4SD
1-7标准漏孔reference leak : 7R`:^}'>
1-8虚漏virtual leak: 8n^v,s >
1-9漏率leak rate: fB3W} dr
1-10标准空气漏率standard air leak rate: qkN{l88
1-11等值标准空气漏率equivalent standard air leak rate: oO8V0VE\
1-12探索(示漏)气体: L<**J\=7M
z tLP {q#
2.本底 K7H`Yt
2-1本底background: Wp<4F6C$@
2-2探索气体本底search gas background : \-B8`ah
2-3漂移drift: Wq1%
2-4噪声noise: t)Mi,ljY[
h{&}p-X&[
3.检漏仪 {@c)!%2$
3-1检漏仪leak detector: \]eB(&nq
3-2高频火花检漏仪H.F. spark leak detector: QK3j.Ss
3-3卤素检漏仪halide leak detector: n2$(MDdL`
3-4氦质谱检漏仪helium mass spectrometer leak detector: S~mpXH@
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: pO.+hy
fYuz39#*
4.检漏 #PpmR_IX
4-1气泡检漏leak detection by bubbles: xu _:
4-2氨检漏leak detection by ammonia: prx)Cfv
4-3升压检漏leak detection of rise pressure: w{1DwCLKq
4-4放射性同位素检漏radioactive isotope leak detection: b]Xc5Dp{
4-5荧光检漏fluorescence leak detection *uq;O*s
7. 1.一般术语 t_PAXj
1-1真空干燥vacuum drying: @3hA\3ot^
1-2冷冻干燥freeze drying : 6WEYg
1-3物料material: HH+$rrTT
1-4待干燥物料material to be dried: Q$NT>d6Q
1-5干燥物料dried material : hqA6%Y^k
1-6湿气moisture;humidity: kCWaji_x%
1-7自由湿气free moisture: Ne)H*DT
1-8结合湿气bound moisture: u"*@k^}(
1-9分湿气partial moisture: ep-~;?
1-10含湿量moisture content: 9b8ZOk'9_
1-11初始含湿量initial moisture content: ppjS|l*`
1-12最终含湿量final residual moisture: 0Y8Si^T
1-13湿度degree of moisture ,degree of humidity : Vnu*+
1-14干燥物质dry matter : M7|k"izv
1-15干燥物质含量content of dry matter: DRC2U%[
([y 2x.kd
2.干燥工艺 $y\\?
2-1干燥阶段stages of drying : Dl2`b">u
(1).预干燥preliminary dry: 9 -\.|5;:
(2).一次干燥(广义)primary drying(in general): GS%ACk
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): l
cHqg
(4).二次干燥secondary drying: >8$]g
2-2.(1).接触干燥contact drying: .]_
(>^6
(2).辐射干燥 drying by radiation : h7iI=[_V
(3).微波干燥microwave drying: "Cz8nG
(4).气相干燥vapor phase drying: XN@F6Gj
(5).静态干燥static drying: ^{3,ok*Nf
(6).动态干燥dynamic drying: DdY89R 6
2-3干燥时间drying time: Z Sj[GI
2-4停留时间length of stay(in the drying chamber): Hy _ (
2-5循环时间cycle time: U,?[x2LF
2-6干燥率 dessication ratio : 7$8YBcZ6
2-7去湿速率mass flow rate of humidity: vR X_}`m8#
2-8单位面积去湿速率mass flow rate of humidity per surface area: Sz.sX w;
2-9干燥速度 drying speed : 95
7Cr
2-10干燥过程drying process: 7q2G/_
2-11加热温度heating temperature: 8ug\GlZc
2-12干燥温度temperature of the material being dried :
}pOem}
2-13干燥损失loss of material during the drying process : \t6k(5J
2-14飞尘lift off (particles): _sEkKh8x
2-15堆层厚度thickness of the material: sYQ=nL
IUt/V^
3.冷冻干燥 ,i>{yrsOh
3-1冷冻freezing: PyOj{WX>W
(1).静态冷冻static freezing: g%P6 f
(2).动态冷冻dynamic freezing: ^W&qTSjh
(3).离心冷冻centrifugal freezing: O$=[m9V
(4).滚动冷冻shell freezing: X,)`<
>=O
(5).旋转冷冻spin-freezing: ^EK]z8;|
(6).真空旋转冷冻vacuum spin-freezing: [8F1rZ&
(7).喷雾冷冻spray freezing: {tq.c9+!d
(8).气流冷冻air blast freezing: >5rb4
3-2冷冻速率rate of freezing: EDMuQu/D8
3-3冷冻物料frozen material: WInfn f+'
3-4冰核ice core: /i'dhiG
3-5干燥物料外壳envelope of dried matter: FaNr}$Pe
3-6升华表面sublimation front: pX5#!)
3-7融化位置freezer burn: ^lB=O
UcZ20inj0
4.真空干燥设备;真空冷冻干燥设备 (#uz_/xXa
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: O;bnyB$
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: E}7@?o7u}
4-3加热表面heating surface: 2pKkg>/S
4-4物品装载面shelf : cPFs K*w
4-5干燥器的处理能力throughput (of the vacuum drying chamber): avJ%J"j8z
4-6单位面积干燥器处理能力throughput per shelf area: it
Byw1/
4-7冰冷凝器ice condenser: g4Y1*`}2f
4-8冰冷凝器的负载load of the ice condenser: P2U^%_~
4-9冰冷凝器的额定负载rated load of the ice condenser ~F gxhK2+
8. 1.一般术语 fV b~j ;
1-1试样sample : 4^3}+cJ7j
(1).表面层surface layer: S!'Y:AeD&
(2).真实表面true surface: s7"NK"
(3).有效表面积effective surface area: Pv- i.
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: /2%646
(5).表面粒子密度surface particle density: UDBMf2F]
(6).单分子层monolayer: MBeubS
(7).表面单分子层粒子密度monolayer density: v-
793pr
(8).覆盖系数coverage ratio: q9)]R
1-2激发excitation: 8>\tD
(1).一次粒子primary particle: SauX C
(2).一次粒子通量primary particle flux: 7?U)V03
(3).一次粒子通量密度density of primary particle flux: (:g ZZG
(4).一次粒子负荷primary particle load: jN[P$}#b`
(5).一次粒子积分负荷integral load of primary particle: xaPaK-
(6).一次粒子的入射能量energy of the incident primary particle: zJ"`40V*;
(7).激发体积excited volume: I34|<3t$
(8).激发面积excited area: QPc4bg\J~t
(9).激发深度excited death: dH5 Go9`~R
(10).二次粒子secondary particles: ,/oqLI\
(11).二次粒子通量secondary particle flux: WQJnWe
(12).二次粒子发射能energy of the emitted secondary particles: G\X}gqe(OJ
(13).发射体积emitting volume: C2X$ bX"
(14).发射面积emitting area: yH9(ru
(15).发射深度emitting depth: 3xhGmD\SKO
(16).信息深度information depth: jTeHI|b
(17).平均信息深度mean information depth: O`M6=\
1-3入射角angle of incidence: Lrrc&;
1-4发射角angle of emission: n'5LY9"
1-5观测角observation: h4 X=d5qd
1-6分析表面积analyzed surface area: [C>>j;q%
1-7产额 yield : EE{]EW(
1-8表面层微小损伤分析minimum damage surface analysis: =._V$:a6o
1-9表面层无损伤分析non-destructive surface analysis: ZC99/NWN
1-10断面深度分析 profile analysis in depth; depth profile analysis : 3i*HwEh
1-11可观测面积observable area: cF2!By3M
1-12可观测立体角observable solid angle : hw @)W
1-13接受立体角;观测立体角angle of acceptance: /WxCsQn
1-14角分辨能力angular resolving power: :{g;J
1-15发光度luminosity: '{ $7Dbo
1-16二次粒子探测比detection ratio of secondary particles: b] 5i`
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ?LwBF;Y
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: Sc.@u3
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: >z"\l
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: 0XSMby?t`
1-21本底压力base pressure: oAxRI+&|.
1-22工作压力working pressure: qexnsL
: Yb_
2.分析方法 +{r~-Rn3
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: w$evAPuz^
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : O30eq 7(
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: l^cz&k=+
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: p=d,kY
2-3离子散射表面分析ion scattering spectroscopy: 59l9^<{A
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: K_Q-9j
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: y0R9[;b07
2-6离子散射谱仪ion scattering spectrometer: /S #Z.T~~
2-7俄歇效应Auger process: w;wgh`ur
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: nK8IW3fX9)
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: 1C5~GI `
2-10光电子谱术photoelectron spectroscopy : <1pRAN0
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: =^5#o)~BB
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: v[b|J7k
2-11光电子谱仪photoelectron spectrometer: j9d^8)O,
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: DUMC4+i
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: wqasI@vyu
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): o]<@E u G
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus