“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 /U@Y2$TOF
--------------------------------------------------- 6_O3/
真空术语 5U<;6s
wU/BRz8I
1.标准环境条件 standard ambient condition: l&uBEYx
2.气体的标准状态 standard reference conditions forgases: i"
>kF@]c8
3.压力(压强)p pressure: ZGQz@H5
4.帕斯卡Pa pascal: H]VoXJ\*
5.托Torr torr: U t.#h="
6.标准大气压atm standard atmosphere: `*--vSi
7.毫巴mbar millibar: obSLy
Ed
8.分压力 partial pressure: YH'j"|{
9.全压力 total pressure: @;h$!w<
10.真空 vacuum: '*n2<y
11.真空度 degree of vacuum: \Qei}5P,
12.真空区域 ranges of vacuum: a_o99lP
13.气体 gas: El|Y]f
14.非可凝气体 non-condensable gas: -)p| i~j^A
15.蒸汽vapor: lH%-#2]
16.饱和蒸汽压saturation vapor pressure: |TCg`ZS`cZ
17.饱和度degree of saturation: GbJVw\5Z*
18.饱和蒸汽saturated vapor: )UAkg
19.未饱和蒸汽unsaturated vapor: nsy eid*
20.分子数密度n,m-3 number density of molecules: S~Yu;
21.平均自由程ι、λ,m mean free path: &T\,kq>)
22.碰撞率ψ collision rate: :x36Z4:
23.体积碰撞率χ volume collision rate: C}(9SASs%
24.气体量G quantity of gas: R6-Z]Hu
25.气体的扩散 diffusion of gas: Q7XlFjzcm
26.扩散系数D diffusion coefficient; diffusivity: ]$i~;f 8I
27.粘滞流 viscous flow: i[m-&
28.粘滞系数η viscous factor: >IE`, fe
29.泊肖叶流 poiseuille flow: 8&UwnEk<
30.中间流 intermediate flow: s!WI:E7
31.分子流 molecular flow: wUcp_)aE|
32克努曾数 number of knudsen: ~=Q Tv8
33.分子泻流 molecular effusion; effusive flow: H:.l:PJ
34.流逸 transpiration: .0iHI3i^
35.热流逸 thermal transpiration: zoHFTD4 g
36.分子流率qN molecular flow rate; molecular flux: ?qR11A};tG
37.分子流率密度 molecular flow rate density; density of molecular flux: l[M?"<Ot;
38.质量流率qm mass flow rare: s[#ww
=T\
39.流量qG throughput of gas: IHvrx:7
40.体积流率qV volume flow rate: ^ 9 FRI9?
41.摩尔流率qυ molar flow rate: tW}At
42.麦克斯韦速度分布 maxwellian velocity distribution: 6;#Rd|
43.传输几率Pc transmission probability: B dKD%CJ[
44.分子流导CN,UN molecular conductance: pDM95.6
45.流导C,U conductance: rxQ&N[r2
46.固有流导Ci,Ui intrinsic conductance: >!%F$$
47.流阻W resistance: <^fvTb &*
48.吸附 sorption: f'%Pkk
49.表面吸附 adsorption: ^>m"j6`h,
50.物理吸附physisorption: K5EU?J&
51.化学吸附 chemisorption: ":V,&o9n
52.吸收absorption: HAc1w]{(
53.适应系数α accommodation factor: J0,;F9<C#X
54.入射率υ impingement rate: .ly K
,p
55.凝结率condensation rate: =Bw2{]w
56.粘着率 sticking rate: *PF=dx<8
57.粘着几率Ps sticking probability: vw[i.af
58.滞留时间τ residence time: POt8G
59.迁移 migration: ]Ofs,U^
60.解吸 desorption: Qs7*_=+h
61.去气 degassing: B8.uzX'p
62.放气 outgassing: #7|73&u(
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: feG#*m2g
64.蒸发率 evaporation rate: )k6kK}
65.渗透 permeation: ^]ig*oS\`
66.渗透率φ permeability: pT'jX^BU
67.渗透系数P permeability coefficient -mY,nMDb
2. 1.真空泵 vacuum pumps @tg4rl
1-1.容积真空泵 positive displacement pump: ]8dzTEjk
⑴.气镇真空泵 gas ballast vacuum pump: Y[Eq;a132
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: c[X:vDUX
⑶.干封真空泵 dry-sealed vacuum pump: 6gTc)rhRT
⑷.往复真空泵 piston vacuum pump: 0UOjk.~b
⑸.液环真空泵 liquid ring vacuum pump: _q=ua;I&
⑹.旋片真空泵 sliding vane rotary vacuum pump: <Xl/U^B
⑺.定片真空泵 rotary piston vacuum pump: NNw0
G&
⑻.滑阀真空泵 rotary plunger vacuum pump: l" +q&3Zx
⑼.余摆线真空泵 trochoidal vacuum pump: `PS>"-AY2
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: /nB|Fo_&Q
⑾.罗茨真空泵 roots vacuum pump: ?z0N-A2C2
1-2.动量传输泵 kinetic vacuum pump: lL"ANlX-P
⑴.牵引分子泵molecular drag pump: oUx%ra{
⑵.涡轮分子泵turbo molecular pump: SkyX\&
⑶.喷射真空泵ejector vacuum pump: G-eSHv
⑷.液体喷射真空泵liquid jet vacuum pump: ciGJtD&P
⑸.气体喷射真空泵gas jet vacuum pump: Js/QL=,
⑹.蒸汽喷射真空泵vapor jet vacuum pump : {pk]p~
⑺.扩散泵diffusion pump :
e"&QQ-q
⑻.自净化扩散泵self purifying diffusion pump: E_T!|Q.
⑼.分馏扩散泵 fractionating diffusion pump :
IA680^
⑽.扩散喷射泵diffusion ejector pump : i6 )HC
⑾.离子传输泵ion transfer pump: _(F8}s
1-3.捕集真空泵 entrapment vacuum pump: 4}F~h
⑴吸附泵adsorption pump: =Hx]K8N )
⑵.吸气剂泵 getter pump: P$5K[Y4f
⑶.升华(蒸发)泵 sublimation (evaporation)pump : xq<X:\O
⑷.吸气剂离子泵getter ion pump: 4Be\5Byr
⑸.蒸发离子泵 evaporation ion pump: ~}RfepM
⑹.溅射离子泵sputter ion pump: ~DP_1V?
⑺.低温泵cryopump: /X%+z5
_)[UartKx
2.真空泵零部件 "NtY[sT{V
2-1.泵壳 pump case: ,-[z?dvO
2-2.入口 inlet: 0t7vg#v|
2-3.出口outlet: t ^~Qv
2-4.旋片(滑片、滑阀)vane; blade : VG|FjD
2-5.排气阀discharge valve: q![`3m-d.
2-6.气镇阀gas ballast valve: L :Ldk
2-7.膨胀室expansion chamber: W_lXY Z<
2-8.压缩室compression chamber: zD;k|"e
2-9.真空泵油 vacuum pump oil: Uj)Wbe[)p0
2-10.泵液 pump fluid: ZQ{-6VCjl
2-11.喷嘴 nozzle: v?0F
2-13.喷嘴扩张率nozzle expansion rate: nt8&Mf
2-14.喷嘴间隙面积 nozzle clearance area : u=t.1eS5
2-15.喷嘴间隙nozzle clearance: g
cb6*@u!
2-16.射流jet: 0+F--E4
2-17.扩散器diffuser: U=PTn(2
2-18.扩散器喉部diffuser thoat: yt<h!k$ _P
2-19.蒸汽导管vapor tube(pipe;chimney): !RSJb
2-20.喷嘴组件nozzle assembly: G`RQl@W>)(
2-21.下裙skirt: bE?X?[K
f$ 7C 5
3.附件 7 j6<
3-1阱trap: <QD[hO^/
⑴.冷阱 cold trap: :l&Yq!5
⑵.吸附阱sorption trap: Q89fXi0Ivb
⑶.离子阱ion trap: ?AK`M #M
⑷.冷冻升华阱 cryosublimation trap: jl5&T{z
3-2.挡板baffle: +t3o5&
3-3.油分离器oil separator: ["[v
3-4.油净化器oil purifier: L~AU4Q0o
3-5.冷凝器condenser: 3OFI>x,h
l=ZD&uK
4.泵按工作分类 |}b~YHTs
4-1.主泵main pump: %j.n^7i]^:
4-2.粗抽泵roughing vacuum pump: T^vhhfCUr
4-3.前级真空泵backing vacuum pump: >wb Uxl%{5
4-4.粗(低)真空泵 roughing(low)vacuum pump: 3g3f87[
4-5.维持真空泵holding vacuum pump: Bj<s!}i{[
4-6.高真空泵high vacuum pump: cQ
|Q-S
4-7.超高真空泵ultra-high vacuum pump:
1D_&n@
4-8.增压真空泵booster vacuum pump: Cz
&3=),G
E^A S65%bL
5.真空泵特性 [:uHe#L
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: Ec@cW6g(%
5-2.真空泵的抽气量Q throughput of vacuum pump:。 .N( X.C
5-3.起动压力starting pressure: a~ dgf:e`
5-4.前级压力 backing pressure : L9-Jwy2(>
5-5.临界前级压力 critical backing pressure: Ft?eqDS1
5-6.最大前级压力maximum backing pressure: )Xa_ry7
5-7.最大工作压力maximum working pressure: x"!`JDsS
5-8.真空泵的极限压力ultimate pressure of a pump: ]|tR8`DGZ%
5-9.压缩比compression ratio: U$Z<lx2P
5-10.何氏系数Ho coefficient: u /]P
5-11.抽速系数speed factor: ` FOCX;
5-12.气体的反扩散back-diffusion of gas: `mA;1S
5-13.泵液返流back-streaming of pump fluid: i&?\Pp;5-j
5-14.返流率back-streaming rate )K$YL='kX
5-15.返迁移back-migration: Lq;T\m_de
5-16.爆腾bumping: lX.-qCV"B
5-17.水蒸气允许量qm water vapor tolerable load: \Y>b#*m(4
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: n}t9Nf_
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ,H%[R+)
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump b
b.UtoPz
3. 1.一般术语 RMiDV^.u`
1-1.压力计pressure gauge: 4.^T~n G
1-2.真空计vacuum gauge: E- [Eg
⑴.规头(规管)gauge head: yjsj+K
pL
⑵.裸规nude gauge : tGU~G&
⑶.真空计控制单元gauge control unit : Je,o(:
⑷.真空计指示单元gauge indicating unit : ptrwZ8'
a"Xh
2.真空计一般分类 x;<0Gg~jB
2-1.压差式真空计differential vacuum gauge: = pn;b1=
2-2.绝对真空计 absolute vacuum gauge: `+rwx
2-3.全压真空计total pressure vacuum gauge: Z,O*p,Gzn
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: E*`PD<:)H
2-5.相对真空计relative vacuum gauge : rZ|p{ym
oyr b.lu/
3.真空计特性 L9N}lH
3-1.真空计测量范围pressure range of vacuum gauge: i1XRBC9
3-2.灵敏度系数sensitivity coefficient: tH4q*\U
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): w^Yo)"6
3-5.规管光电流photon current of vacuum gauge head: A]TEs)#*7)
3-6.等效氮压力equivalent nitrogen pressure : wN58uV '
3-7.X射线极限值 X-ray limit: _cE_\Ay
3-8.逆X射线效应anti X-ray effect: ('7$K
3-9.布利尔斯效应blears effect: yQMwt|C4
;N?(R\*8
4.全压真空计 &l3(+4Sh
4-1.液位压力计liquid level manometer: fLqjBG]<
4-2.弹性元件真空计elastic element vacuum gauge: !^&VZh
4-3.压缩式真空计compression gauge: FR[I~unqD
4-4.压力天平pressure balance: ^8_yJ=~V
4-5.粘滞性真空计viscosity gauge : 2|=hF9
4-6.热传导真空计thermal conductivity vacuum gauge : jLM([t
4-7.热分子真空计thermo-molecular gauge: =\|,hg)c
4-8.电离真空计ionization vacuum gauge: u*):
D~A
4-9.放射性电离真空计radioactive ionization gauge: ZnRT$ l O
4-10.冷阴极电离真空计cold cathode ionization gauge: "+T`{$Z=C
4-11.潘宁真空计penning gauge: |T@SlNi]
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: JRw,${W
4-13.放电管指示器discharge tube indicator: {0w2K82
4-14.热阴极电离真空计hot cathode ionization gauge: :;.^r,QAI
4-15.三极管式真空计triode gauge: )~)l^0X
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: w2UEU5%
4-17.B-A型电离真空计Bayard-Alpert gauge: $8rnf
4-18.调制型电离真空计modulator gauge: \fUX_0k9,
4-19.抑制型电离真空计suppressor gauge: h?p_jI
4-20.分离型电离真空计extractor gauge: @;` 's
4-21.弯注型电离真空计bent beam gauge: &>C+5`bg
4-22.弹道型电离真空计 orbitron gauge : .Y{x!Q"
4-23.热阴极磁控管真空计hot cathode magnetron gauge: P%lD9<jED
'fl< ac,.
5.分压真空计(分压分析器) "A"YgD#t
5-1.射频质谱仪radio frequency mass spectrometer: \?
)S{
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: n|)((W
5-3.单极质谱仪momopole mass spectrometer: T>'O[=UWh
5-4.双聚焦质谱仪double focusing mass spectrometer: .FHk1~\%z^
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: &`@YdZtd"
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: XQ9W
y
5-7.回旋质谱仪omegatron mass spectrometer: D$K'Qk
5-8.飞行时间质谱仪time of flight mass spectrometer: #WSqh +
OyVP_Yx,V
6.真空计校准 #jW -&a
6-1.标准真空计reference gauges: i7-~"g
6-2.校准系统system of calibration: OU/}cu
6-3.校准系数K calibration coefficient: }LS8q
6-4.压缩计法meleod gauge method: fMg9h9U
6-5.膨胀法expansion method: pQBn8H|Y
6-6.流导法flow method: UjQz
4. 1.真空系统vacuum system \/YRhQ
1-1.真空机组pump system: nH?6o#]N
1-2.有油真空机组pump system used oil : 0|FxSc
1-3.无油真空机组oil free pump system Rtz~:v%
1-4.连续处理真空设备continuous treatment vacuum plant: dhob]8b
1-5.闸门式真空系统vacuum system with an air-lock: wDh]vH[
1-6.压差真空系统differentially pumped vacuum system: %rG4X
1-7.进气系统gas admittance system: rL1yq|]I
Sp5:R75vI
2.真空系统特性参量 N'VTdf?
2-1.抽气装置的抽速volume flow rate of a pumping unit : 6whPW
.
2-2.抽气装置的抽气量throughput of a pumping unit : 1*u]v{JJ(
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 'wk,t^)
2-4.真空系统的漏气速率leak throughput of a vacuum system: K<*6E@+i
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: }x`Cnn
2-6.极限压力ultimate pressure: MGm*({%
2-7.残余压力residual pressure: I{cH$jt<
2-8.残余气体谱residual gas spectrum: rgzra"u)
2-9.基础压力base pressure: W+#Q>^ Q>
2-10.工作压力working pressure: \L(cFjLIl
2-11.粗抽时间roughing time: l; _IH|A
2-12.抽气时间pump-down time: /S"jO[n9b
2-13.真空系统时间常数time constant of a vacuum system: ?d-w#<AiV
2-14.真空系统进气时间venting time: GLtd<M"
)~wKRyQff
3.真空容器 1OMXg=Y
3-1.真空容器;真空室vacuum chamber: =WT$\KYGv
3-2.封离真空装置sealed vacuum device: =|z:wlOs
3-3.真空钟罩vacuum bell jar: T<pG$4_
3-4.真空容器底板vacuum base plate: Sc[#]2 }
3-5.真空岐管vacuum manifold: #
-luE
3-6.前级真空容器(贮气罐)backing reservoir: Dhn7N8(LF!
3-7.真空保护层outer chamber: J;>epM;*
3-8.真空闸室vacuum air lock: "iK=
8
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: HXa[0VOx
dR]-R/1|
4.真空封接和真空引入线 E)$>t}$
4-1.永久性真空封接permanent seal : gUru=p
4.2.玻璃分级过渡封接graded seal : D8wf`RUt
4-3.压缩玻璃金属封接compression glass-to-metal seal: pNb2t/8%%
4-4.匹配式玻璃金属封接matched glass-to-metal seal: 6/8K2_UeoW
4-5.陶瓷金属封接ceramic-to-metal seal: xc#t8`
4-6.半永久性真空封接semi-permanent seal : x8rg/y
4-7.可拆卸的真空封接demountable joint: 5U~KYy^v
4-8.液体真空封接liquid seal {h+8^
4-9.熔融金属真空封接molten metal seal: G(a5@9F
4-10.研磨面搭接封接ground and lapped seal: MT&aH~YB
4-11.真空法兰连接vacuum flange connection: =8T!ldVxES
4-12.真空密封垫vacuum-tight gasket: v]V N'Hs?
4-13.真空密封圈ring gasket: skcyLIb
4-14.真空平密封垫flat gasket: 2xLtJR4L
4-15.真空引入线feedthrough leadthrough: 9i5?J ]o^
4-16.真空轴密封shaft seal: +-<G(^
4-17.真空窗vacuum window: _U^[h !
4-18.观察窗viewing window: [nO3%7t@
v@Uk% O/
5.真空阀门 1<BKTMBq?{
5-1.真空阀门的特性characteristic of vacuum valves: w[-)c6J yE
⑴.真空阀门的流导conductance of vacuum valves: <t"T'\3
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: LIcc0w3
5-2.真空调节阀regulating valve: 5I2,za&e
5-3.微调阀 micro-adjustable valve: Qfm$q~`D^W
5-4.充气阀charge valve: A7X
a
5-5.进气阀gas admittance valve: g3$'Ghf
5-6.真空截止阀break valve: Czjb.c:a.Y
5-7.前级真空阀backing valve: %VO+\L8Fs
5-8.旁通阀 by-pass valve: 4{uQ}ea
5-9.主真空阀main vacuum valve: @Ul3J )=m
5-10.低真空阀low vacuum valve: :VT%d{Vp_
5-11.高真空阀high vacuum valve: 44ty,M3
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 72sqt5C]
5-13.手动阀manually operated valve: Nu"v
.]Y2
5-14.气动阀pneumatically operated valve: {6ZSf[Y6B
5-15.电磁阀electromagnetically operated valve: ;l*%IMB
5-16.电动阀valve with electrically motorized operation: /q IQE&V-
5-17.挡板阀baffle valve: "] V\ Y!
5-18.翻板阀flap valve: f]/2uUsg%
5-19.插板阀gate valve: q%4X1 W
5-20.蝶阀butterfly valve: S.!,qv z
Y#9W]78He
6.真空管路 "'z}oS
6-1.粗抽管路roughing line: F\DiT|?}
6-2.前级真空管路backing line: :01d9|#
6-3.旁通管路;By-Pass管路 by-pass line: yI:
;+K
6-4.抽气封口接头pumping stem: r/sSkF F
6-5.真空限流件limiting conductance: `}?;Ow&2CY
6-6.过滤器filter: O6G\0o
5. 1.一般术语 m%[e_eS
1-1真空镀膜vacuum coating: w.x&3aG
1-2基片substrate: Q-oDmjU
1-3试验基片testing substrate: %/Wk+r9uu
1-4镀膜材料coating material: (fF8)4l
1-5蒸发材料evaporation material: UOZ+&DL,L
1-6溅射材料sputtering material: ]:gW+6w"C
1-7膜层材料(膜层材质)film material: sQ}|Lu9hZ
1-8蒸发速率evaporation rate: * 1;4&/93o
1-9溅射速率sputtering rate: x &R9m,
1-10沉积速率deposition rate: i{6&/TBnr
1-11镀膜角度coating angle: [on_=N{W[
,H{9`a#+:
2.工艺 ,4Q4{Tx
2-1真空蒸膜vacuum evaporation coating: N#ggT9>X
(1).同时蒸发simultaneous evaporation: %nZ:)J>kz
(2).蒸发场蒸发evaporation field evaporation: #sw4)*v
(3).反应性真空蒸发reactive vacuum evaporation: <<0sv9qw1
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: "TA0--6
(5).直接加热的蒸发direct heating evaporation: d=vuy
(6).感应加热蒸发induced heating evaporation: 712nD ?>
(7).电子束蒸发electron beam evaporation: V?M(exN
(8).激光束蒸发laser beam evaporation: D}?p>e|<D
(9).间接加热的蒸发indirect heating evaporation: G(7%*@SX
(10).闪蒸flash evaportion: Cy[G7A%
2-2真空溅射vacuum sputtering: EHC7b^|3}
(1).反应性真空溅射 reactive vacuum sputtering: Tgz=I4g
(2).偏压溅射bias sputtering: ^m#tWb)f
(3).直流二级溅射direct current diode sputtering: q!c=f!U?\l
(4).非对称性交流溅射asymmtric alternate current sputtering: Jc#D4e1#
(5).高频二极溅射high frequency diode sputtering: G!6b
)4L-
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 6nL^"3@S!
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: CGi;M=xr
(8).离子束溅射ion beam sputtering: !i"zM}
(9).辉光放电清洗glow discharge cleaning: M.Yp'Av
2-3物理气相沉积PVD physical vapor deposition: !h.hJt
2-4化学气相沉积CVD chemical vapor deposition: U823q-x
2-5磁控溅射magnetron sputtering: w-n}&f
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: [#Qf#T%5h
2-7空心阴极离子镀HCD hollow cathode discharge deposition: \\R}3 >Wc
2-8电弧离子镀arc discharge deposition: (xb2H~WrN
1d< b\P0
3.专用部件 wOf8\s1
3-1镀膜室coating chamber: fmixWL7.Zg
3-2蒸发器装置evaporator device: D&):2F^9.
3-3蒸发器evaporator: N0p6xg~
3-4直接加热式蒸发器evaporator by direct heat: p}QDX*/sSu
3-5间接加热式蒸发器evaporator by indirect heat: r-y;"h'
3-7溅射装置sputtering device: ]VjvG};
3-8靶target: 5mZ2CDV
3-10时控挡板timing shutter: o-=|}u]mz
3-11掩膜mask: /0/ouA>+
3-12基片支架substrate holder: bo|THS
3-13夹紧装置clamp: O(/~cQ
3-14换向装置reversing device: Tdcc<T
3-15基片加热装置substrate heating device: 5?^#v
3-16基片冷却装置substrate colding device: vxZ'-&;t
E<jajYj
4.真空镀膜设备 p-iFe\+
4-1真空镀膜设备vacuum coating plant: 67(s\
(1).真空蒸发镀膜设备vacuum evaporation coating plant: NF&Sv
(2).真空溅射镀膜设备vacuum sputtering coating plant: \ivxi<SR
4-2连续镀膜设备continuous coating plant: ;M.Q=#;E
4-3半连续镀膜设备semi- continuous coating plant v Z9OJrF
6. 1.漏孔 zcP=+Y)YA
1-1漏孔leaks: \#,2#BmO"E
1-2通道漏孔channel leak: ?z.?(xZ 6
1-3薄膜漏孔membrane leak: #KiJ{w'
1-4分子漏孔molecular leak: Z{B
e
1-5粘滞漏孔vixcous leak: ?"Ez
1-6校准漏孔calibrated leak: $BdwKk
!k
1-7标准漏孔reference leak : 1%v6d
!
1-8虚漏virtual leak: ." xP{
1-9漏率leak rate: oMEW5.VX
1-10标准空气漏率standard air leak rate: Tow=B
1-11等值标准空气漏率equivalent standard air leak rate: Pdf-2
Tx
1-12探索(示漏)气体: 66&uK|
2jyWkAP'
2.本底 &<;T$Y
2-1本底background: vQ}ZfP
2-2探索气体本底search gas background : @*eY~
2-3漂移drift: 8H4NNj Oy
2-4噪声noise: :Dty([
&za
}THm
3.检漏仪 )7 & -DI1
3-1检漏仪leak detector: |N`0G.#
3-2高频火花检漏仪H.F. spark leak detector: +g
g_C'"
3-3卤素检漏仪halide leak detector: 4z(~)#'^
3-4氦质谱检漏仪helium mass spectrometer leak detector:
b WNa6x
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: K[icVT2v~
G*4I;'6
4.检漏 W\~ie}D{
4-1气泡检漏leak detection by bubbles: Wo
"s ;Z
4-2氨检漏leak detection by ammonia: fM ID}S
4-3升压检漏leak detection of rise pressure: ms0V1`
4-4放射性同位素检漏radioactive isotope leak detection: P4#i]7%
4-5荧光检漏fluorescence leak detection 7y=O!?*
7. 1.一般术语 ESB^"|9
1-1真空干燥vacuum drying: W On<;'}M&
1-2冷冻干燥freeze drying : R>0[w$
1-3物料material: uLzE'ZmV
1-4待干燥物料material to be dried: DP),~8
1-5干燥物料dried material : %e]G]B%
1-6湿气moisture;humidity: 7K.75%}
1-7自由湿气free moisture: ^W$R{`
1-8结合湿气bound moisture: z0rYzn?MR
1-9分湿气partial moisture: b,+Sa\j)(
1-10含湿量moisture content: _O}m0c
1-11初始含湿量initial moisture content: K@7%i|H
1-12最终含湿量final residual moisture: %nkP" Z#
1-13湿度degree of moisture ,degree of humidity : oYN"L
1-14干燥物质dry matter : 8n5~K.;<
1-15干燥物质含量content of dry matter: :6(\:
le \f:
2.干燥工艺 Kzn1ct{65!
2-1干燥阶段stages of drying : "Vq=
Ph
(1).预干燥preliminary dry: <OEIG0
(2).一次干燥(广义)primary drying(in general): Bug.>ln1
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): ')v,<{
(4).二次干燥secondary drying: ]t)N3n6Bc
2-2.(1).接触干燥contact drying: <<01@Q <