“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 pXq5|,aC
--------------------------------------------------- xGo,x+U*
真空术语 B&4NdL/
rd!4u14
1.标准环境条件 standard ambient condition: h-=lZ~W~
2.气体的标准状态 standard reference conditions forgases: [Z{0|NR
3.压力(压强)p pressure: 0Nq6>^
%
4.帕斯卡Pa pascal: +oR wXO3W
5.托Torr torr: U+'h~P'4
6.标准大气压atm standard atmosphere: _Sn7z?
7.毫巴mbar millibar: 7~7_T#dTh
8.分压力 partial pressure: `=VN\W^&
9.全压力 total pressure: J#jx)K!
10.真空 vacuum: [+z*&~'
11.真空度 degree of vacuum: Bd-@@d.H<
12.真空区域 ranges of vacuum: 2]/[
13.气体 gas: dMjAG7U
14.非可凝气体 non-condensable gas: ucgp=bye
15.蒸汽vapor: "[p-Iy1
16.饱和蒸汽压saturation vapor pressure: 18kzR6(W
17.饱和度degree of saturation: ieG%D
HN
18.饱和蒸汽saturated vapor: 6A*k
19.未饱和蒸汽unsaturated vapor: QzX|c&&>u2
20.分子数密度n,m-3 number density of molecules: L[cl$pYV
21.平均自由程ι、λ,m mean free path: O'~;|-Z<
22.碰撞率ψ collision rate: Q
R<q[@)F
23.体积碰撞率χ volume collision rate: 3F|#nq
24.气体量G quantity of gas: x,>r}I>^Q
25.气体的扩散 diffusion of gas: Y> f 6
26.扩散系数D diffusion coefficient; diffusivity: c&n.JV
27.粘滞流 viscous flow: 6;vfl*
28.粘滞系数η viscous factor: |*-&x:p7O
29.泊肖叶流 poiseuille flow: QocR)aN=+
30.中间流 intermediate flow: v35=4>Y
31.分子流 molecular flow: H:>i:\J/M9
32克努曾数 number of knudsen: (_'Efpg|
33.分子泻流 molecular effusion; effusive flow: {t1;icu
34.流逸 transpiration: Aq:1
35.热流逸 thermal transpiration: l=?G"1
36.分子流率qN molecular flow rate; molecular flux: L!
DK2,
37.分子流率密度 molecular flow rate density; density of molecular flux: K,Z_lP_~Vw
38.质量流率qm mass flow rare: Y6r<+#V
39.流量qG throughput of gas: +ZK12D}
40.体积流率qV volume flow rate: uDXRw*rTv
41.摩尔流率qυ molar flow rate: %an&lcoX
42.麦克斯韦速度分布 maxwellian velocity distribution: \>@QJ
43.传输几率Pc transmission probability: K:\db'``
44.分子流导CN,UN molecular conductance: j`A 3N7;
45.流导C,U conductance: 6o!Y^^/U
46.固有流导Ci,Ui intrinsic conductance: B6gn(w3
47.流阻W resistance: n~|sMpd,M1
48.吸附 sorption: ^B`*4
49.表面吸附 adsorption: !<2%N3l
50.物理吸附physisorption: :]g>8sWL
51.化学吸附 chemisorption: Tz{f5c&
52.吸收absorption: N(@B3%H2/J
53.适应系数α accommodation factor: ^a+H`RD
54.入射率υ impingement rate: Iurb?
55.凝结率condensation rate: W|e$@u9
56.粘着率 sticking rate: :kz"Wya.
57.粘着几率Ps sticking probability: wz{]CQ 7"
58.滞留时间τ residence time: krI@N}OU
59.迁移 migration: Oj~4uT&"
60.解吸 desorption: ,8^QV3
61.去气 degassing: LWp#i8,
62.放气 outgassing: c^ifHCt|
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: |}Wm,J
64.蒸发率 evaporation rate: "cVJqW
65.渗透 permeation: o,yP9~8\
66.渗透率φ permeability: ZN `D!e6
67.渗透系数P permeability coefficient (_aM26s
2. 1.真空泵 vacuum pumps \2Atm,#4
1-1.容积真空泵 positive displacement pump: +J<igb!S
⑴.气镇真空泵 gas ballast vacuum pump: PUJkC
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: F&= X/
⑶.干封真空泵 dry-sealed vacuum pump: ap y#8]
⑷.往复真空泵 piston vacuum pump: 5U!yc7eBI/
⑸.液环真空泵 liquid ring vacuum pump: i
SD?y#
⑹.旋片真空泵 sliding vane rotary vacuum pump: Y)oF;ko:
⑺.定片真空泵 rotary piston vacuum pump: "0ZBPp1q
⑻.滑阀真空泵 rotary plunger vacuum pump: 'W2B**}
⑼.余摆线真空泵 trochoidal vacuum pump: B
!}/4"
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: u{ +z?N
⑾.罗茨真空泵 roots vacuum pump: q{:]D(
1-2.动量传输泵 kinetic vacuum pump: n
9X:s?B/
⑴.牵引分子泵molecular drag pump: `BOG e;pl
⑵.涡轮分子泵turbo molecular pump: Q?uHdmY*X
⑶.喷射真空泵ejector vacuum pump: #D2.RN
⑷.液体喷射真空泵liquid jet vacuum pump: Q]v><
⑸.气体喷射真空泵gas jet vacuum pump: K#>@T<
⑹.蒸汽喷射真空泵vapor jet vacuum pump : -cL{9r&X
⑺.扩散泵diffusion pump : aHR&6zj4
⑻.自净化扩散泵self purifying diffusion pump: LI`H,2Km
⑼.分馏扩散泵 fractionating diffusion pump : <T|?`;K
⑽.扩散喷射泵diffusion ejector pump : ^^FqN;
⑾.离子传输泵ion transfer pump: A0f98?j^
1-3.捕集真空泵 entrapment vacuum pump: ys~oJb~
⑴吸附泵adsorption pump: }S,KUH.
⑵.吸气剂泵 getter pump: lK0pr
⑶.升华(蒸发)泵 sublimation (evaporation)pump : lI*uF~ 'D
⑷.吸气剂离子泵getter ion pump: z 7
s&7)a
⑸.蒸发离子泵 evaporation ion pump: nA)KRCi
⑹.溅射离子泵sputter ion pump: bAVlL&^@|
⑺.低温泵cryopump: h:3^FV
LeTOVgjA|
2.真空泵零部件 @?!&M c2
2-1.泵壳 pump case: WPpS?
2-2.入口 inlet: OoqA`%
2-3.出口outlet: r;C
BA'Z
2-4.旋片(滑片、滑阀)vane; blade : dum(T
2-5.排气阀discharge valve: w$1B|7tX;2
2-6.气镇阀gas ballast valve: XK=-$2n
2-7.膨胀室expansion chamber: #x|IEjoa
2-8.压缩室compression chamber: &s>E~M0+J
2-9.真空泵油 vacuum pump oil: E# UAC2Q
2-10.泵液 pump fluid: %~$coZY^
2-11.喷嘴 nozzle: &RL
j^A!
2-13.喷嘴扩张率nozzle expansion rate: 4;D>s8dgG
2-14.喷嘴间隙面积 nozzle clearance area : Bl1^\[#
2-15.喷嘴间隙nozzle clearance: qvN`46c
2-16.射流jet: _>=QZ`!r
2-17.扩散器diffuser: ?Zv>4+Y'
2-18.扩散器喉部diffuser thoat: i~sW_f+
2-19.蒸汽导管vapor tube(pipe;chimney): vZJu=t
2-20.喷嘴组件nozzle assembly: p/WE[8U
2-21.下裙skirt: d"U'\ID2y
RJ0:O
3.附件 tB/'3#o
3-1阱trap: 2[QyH'"^E
⑴.冷阱 cold trap: NS3qNj
⑵.吸附阱sorption trap: FNy-&{P2
⑶.离子阱ion trap: YU6D;
⑷.冷冻升华阱 cryosublimation trap: 4E0 Y=
3-2.挡板baffle: O;CC(
3-3.油分离器oil separator: e.l3xwt>$
3-4.油净化器oil purifier: r
t\eze_5A
3-5.冷凝器condenser: 25wvB@0&
;/s##7qf
4.泵按工作分类 trm-&e7q?;
4-1.主泵main pump: y??^[ sB
4-2.粗抽泵roughing vacuum pump: gWLhO|y
4-3.前级真空泵backing vacuum pump: 5JggU
4-4.粗(低)真空泵 roughing(low)vacuum pump: :9Mqwgk,;3
4-5.维持真空泵holding vacuum pump: v~`'!N8
4-6.高真空泵high vacuum pump: m!LJK`gA
4-7.超高真空泵ultra-high vacuum pump: m$!Ex}2
4-8.增压真空泵booster vacuum pump: *DS>#x@3*i
OkfnxknZ|
5.真空泵特性 w3E#v&"=Y
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ] GH_;
5-2.真空泵的抽气量Q throughput of vacuum pump:。 yDmx)^En
5-3.起动压力starting pressure: ibL
5-4.前级压力 backing pressure : _sX@BE
5-5.临界前级压力 critical backing pressure: "R
%3v.Z
5-6.最大前级压力maximum backing pressure: Kk|4
5-7.最大工作压力maximum working pressure: >#EOCo
5-8.真空泵的极限压力ultimate pressure of a pump: 1%Su~Z"W>
5-9.压缩比compression ratio: m>&:)K}m
5-10.何氏系数Ho coefficient: Gq0Q}[53
5-11.抽速系数speed factor: F$nc9x[S
5-12.气体的反扩散back-diffusion of gas: 2Mw^EjR
5-13.泵液返流back-streaming of pump fluid: s^zX9IVnp
5-14.返流率back-streaming rate i=AQ1X\s
5-15.返迁移back-migration: uB>OS1=
5-16.爆腾bumping: 7L !$hk
5-17.水蒸气允许量qm water vapor tolerable load: fZ[uNe[|
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: _]6n]koD,
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 8/BWe
;4
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump C<yjGtVD
3. 1.一般术语 `w
K6B5>
1-1.压力计pressure gauge: zya2 O?s
1-2.真空计vacuum gauge: wq
=Ef
⑴.规头(规管)gauge head: >}) W5Y+
⑵.裸规nude gauge : :>3/*"vx?G
⑶.真空计控制单元gauge control unit : n1PV/ Z
⑷.真空计指示单元gauge indicating unit : AZf$XHP2
7 DW_G
2.真空计一般分类 ?my2dd,|
2-1.压差式真空计differential vacuum gauge: C|-QU
2-2.绝对真空计 absolute vacuum gauge: `g^b Qx
2-3.全压真空计total pressure vacuum gauge: Pt\GVWi_t
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: [I2vg<my
2-5.相对真空计relative vacuum gauge : s]'EIw}mo
FfpP<(4
3.真空计特性 !.@F,wZvY
3-1.真空计测量范围pressure range of vacuum gauge: [|tlTk
3-2.灵敏度系数sensitivity coefficient: YF68Ax]
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): I'e`?H t
3-5.规管光电流photon current of vacuum gauge head: ,}a'h4C
3-6.等效氮压力equivalent nitrogen pressure : Ck>{7Gw
3-7.X射线极限值 X-ray limit: 1dl(`=^X
3-8.逆X射线效应anti X-ray effect: UJ7{FN=@t
3-9.布利尔斯效应blears effect: {N'<_%cu
>eucQ]
4.全压真空计 I08W I u
4-1.液位压力计liquid level manometer: 49-wFF
4-2.弹性元件真空计elastic element vacuum gauge: O%*:fd,o-
4-3.压缩式真空计compression gauge: JN> h:
4-4.压力天平pressure balance: ~U+W4%f8
4-5.粘滞性真空计viscosity gauge : q:<vl^<j
4-6.热传导真空计thermal conductivity vacuum gauge : !~fy".|x
4-7.热分子真空计thermo-molecular gauge: 0@/C5 v
4-8.电离真空计ionization vacuum gauge: (g3@3.Kk)
4-9.放射性电离真空计radioactive ionization gauge: ,?(U4pzX
4-10.冷阴极电离真空计cold cathode ionization gauge: g66x;2Q
4-11.潘宁真空计penning gauge: ^k5# {?I
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 9^1li2z k{
4-13.放电管指示器discharge tube indicator: 5 nS}h76mZ
4-14.热阴极电离真空计hot cathode ionization gauge: !eA6Ejf
4-15.三极管式真空计triode gauge: M%v 6NxN
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: bA02)?L
4-17.B-A型电离真空计Bayard-Alpert gauge: a+,zXJQYq
4-18.调制型电离真空计modulator gauge: %6cbHH
4-19.抑制型电离真空计suppressor gauge: Mt\.?V:
4-20.分离型电离真空计extractor gauge: C8AR^FW
4-21.弯注型电离真空计bent beam gauge: X3R:^ff\
4-22.弹道型电离真空计 orbitron gauge : }dpE>
4-23.热阴极磁控管真空计hot cathode magnetron gauge: bEB9J-
Q
Xz\ X 8I
5.分压真空计(分压分析器) Rgb&EnVW
5-1.射频质谱仪radio frequency mass spectrometer: rbc7CPq_^
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 7Y6b<:4j
5-3.单极质谱仪momopole mass spectrometer: 8/zv3.+[
5-4.双聚焦质谱仪double focusing mass spectrometer: wj 15Og?
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: 0;tu}]jnN
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: Q9{f'B
5-7.回旋质谱仪omegatron mass spectrometer: )*nZ6Cg'
5-8.飞行时间质谱仪time of flight mass spectrometer: tOxTiaa=
&}!AjA)
6.真空计校准 h.4FY<
6-1.标准真空计reference gauges: ui<Mnm_T;d
6-2.校准系统system of calibration: }.r)
6-3.校准系数K calibration coefficient: (CrP6]=
6-4.压缩计法meleod gauge method: F!zGk(Pu
6-5.膨胀法expansion method: n*r Xj{Kt
6-6.流导法flow method: (kL(:P/
4. 1.真空系统vacuum system @BMuov
1-1.真空机组pump system: c]A @'{7
1-2.有油真空机组pump system used oil : tu6<>
1-3.无油真空机组oil free pump system .s\_H,
1-4.连续处理真空设备continuous treatment vacuum plant: Dn:1Mtj-
1-5.闸门式真空系统vacuum system with an air-lock: TF~cDn
1-6.压差真空系统differentially pumped vacuum system: "1%\Fi l
1-7.进气系统gas admittance system: FXh*!%"*
TFDzTD
2.真空系统特性参量 kJpr:4;@_
2-1.抽气装置的抽速volume flow rate of a pumping unit : lY[\eQ
1:
2-2.抽气装置的抽气量throughput of a pumping unit : Wn&9R
j
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: hCob^o
2-4.真空系统的漏气速率leak throughput of a vacuum system: FZtT2Z4&i
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: D*t[5,~j
2-6.极限压力ultimate pressure: iHeu<3O
2-7.残余压力residual pressure: tY%T
2-8.残余气体谱residual gas spectrum: #@m6ag.
2-9.基础压力base pressure: }fL
] }&
2-10.工作压力working pressure: `.3{
2-11.粗抽时间roughing time: 4"#F=f0
2-12.抽气时间pump-down time: &Xi]0\M)
2-13.真空系统时间常数time constant of a vacuum system: ~~}8D"
2-14.真空系统进气时间venting time: 8^!ib/@v"
|}Mt hj9n
3.真空容器 L~*nI d
3-1.真空容器;真空室vacuum chamber: 6\USeZh
3-2.封离真空装置sealed vacuum device: g=jB'h?
3-3.真空钟罩vacuum bell jar: t(1gJZs>kX
3-4.真空容器底板vacuum base plate: zICAV -&
3-5.真空岐管vacuum manifold: ??z&w`Yy,
3-6.前级真空容器(贮气罐)backing reservoir: 8=u88?Bh
3-7.真空保护层outer chamber: ]l^"A~va
3-8.真空闸室vacuum air lock: >=/DCQ$
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: <`Qbb=*
*1h@Jb34
4.真空封接和真空引入线 m@"p#pt(_
4-1.永久性真空封接permanent seal : wcW7k(+0
4.2.玻璃分级过渡封接graded seal : :PNhX2F
4-3.压缩玻璃金属封接compression glass-to-metal seal: @ 1FWBH~
4-4.匹配式玻璃金属封接matched glass-to-metal seal: 2XyC;RWJ%
4-5.陶瓷金属封接ceramic-to-metal seal: #>2cfZ`6'J
4-6.半永久性真空封接semi-permanent seal : rges`&0
4-7.可拆卸的真空封接demountable joint: zS'{F>w
4-8.液体真空封接liquid seal s8SCEpz
4-9.熔融金属真空封接molten metal seal: Y4N)yMSl"
4-10.研磨面搭接封接ground and lapped seal: ]F #0to
4-11.真空法兰连接vacuum flange connection: ?ZYj5[op,H
4-12.真空密封垫vacuum-tight gasket: AmK g;9LS
4-13.真空密封圈ring gasket: #J~xKyJi'
4-14.真空平密封垫flat gasket: GQ}R xu]
4-15.真空引入线feedthrough leadthrough: |WSmpuf
4-16.真空轴密封shaft seal: vj"['6Xa
4-17.真空窗vacuum window: w:2yFC
4-18.观察窗viewing window: 6C!TXV'
O^IS:\JX&
5.真空阀门 ([]\7}+8
5-1.真空阀门的特性characteristic of vacuum valves: 40$9./fe)
⑴.真空阀门的流导conductance of vacuum valves: n1)]. `
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: USH>`3
5-2.真空调节阀regulating valve: `+(4t4@ew
5-3.微调阀 micro-adjustable valve: 4MRN{W6
5-4.充气阀charge valve: =Ds&ArG
5-5.进气阀gas admittance valve: Ryn@">sVI
5-6.真空截止阀break valve: k[\JT[Mp
5-7.前级真空阀backing valve: :<uCi\9(
5-8.旁通阀 by-pass valve: A+VzpJ~
5-9.主真空阀main vacuum valve: Kr%`L/%
5-10.低真空阀low vacuum valve: ZVz*1]}
5-11.高真空阀high vacuum valve: w[J.?v&^
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: eNrwkV^
5-13.手动阀manually operated valve: h([qq<Lzs
5-14.气动阀pneumatically operated valve: *oAnG:J+M
5-15.电磁阀electromagnetically operated valve: ._<gc;G
5-16.电动阀valve with electrically motorized operation: XQcE
ZJ2
5-17.挡板阀baffle valve: Rk}=SB-
5-18.翻板阀flap valve: i|fkwV,5
5-19.插板阀gate valve: LP) IL~
5-20.蝶阀butterfly valve: e*o:ltP./
fa,;Sw
6.真空管路 \oO&c
6-1.粗抽管路roughing line: mWuhXY^Q
6-2.前级真空管路backing line: <n0j'P>1
6-3.旁通管路;By-Pass管路 by-pass line: f0g&=k{OD
6-4.抽气封口接头pumping stem: n;k
B_i*l
6-5.真空限流件limiting conductance: ]CgZt'h{
6-6.过滤器filter: $B`bsJ
5. 1.一般术语 ~AR0 ,lak
1-1真空镀膜vacuum coating: S.^x)5/,,T
1-2基片substrate: [}y"rs`!
1-3试验基片testing substrate: "~T06!F45
1-4镀膜材料coating material: fw0Z- 9*
1-5蒸发材料evaporation material: EiWd =jDm
1-6溅射材料sputtering material: s_76)7
1-7膜层材料(膜层材质)film material: /P*ph0S-
1-8蒸发速率evaporation rate: @4jPaqa(
1-9溅射速率sputtering rate: Y4*?QBYA
1-10沉积速率deposition rate: AmcBu"
1-11镀膜角度coating angle: @fd{5 >\
QM'>)!8
2.工艺 0vM,2:kf*
2-1真空蒸膜vacuum evaporation coating: bc\?y2
3
(1).同时蒸发simultaneous evaporation: ^7C,GaDsn
(2).蒸发场蒸发evaporation field evaporation: v9Ez0 :)
(3).反应性真空蒸发reactive vacuum evaporation: yj9Ad*.
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: 1JN/oq;
(5).直接加热的蒸发direct heating evaporation: =4Wjb
(6).感应加热蒸发induced heating evaporation: \>4x7mF!
(7).电子束蒸发electron beam evaporation: zxvowM
(8).激光束蒸发laser beam evaporation: iPrAB*
(9).间接加热的蒸发indirect heating evaporation: <(Ktf0'__
(10).闪蒸flash evaportion: I)4NCjcCw
2-2真空溅射vacuum sputtering: Fi"TY^-E;
(1).反应性真空溅射 reactive vacuum sputtering: ooT~R2u
(2).偏压溅射bias sputtering: RTTEAh:.
(3).直流二级溅射direct current diode sputtering: el,n5OZ7
(4).非对称性交流溅射asymmtric alternate current sputtering: RQ[6svfP
(5).高频二极溅射high frequency diode sputtering: ,YmTx
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: sg,9{R ^
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: k!m9
l1x
(8).离子束溅射ion beam sputtering: H/O v8|
(9).辉光放电清洗glow discharge cleaning: ^os|yRzV*M
2-3物理气相沉积PVD physical vapor deposition: ,T7(!)dR
2-4化学气相沉积CVD chemical vapor deposition: SL>0 _
2-5磁控溅射magnetron sputtering: $-f(.S
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: xsXf_gGu
2-7空心阴极离子镀HCD hollow cathode discharge deposition: on0>_-n)
2-8电弧离子镀arc discharge deposition: 6-uB[$ko
g
[+_T{
3.专用部件 R~(_m#6`:
3-1镀膜室coating chamber: )9>E} SU/
3-2蒸发器装置evaporator device: '>r"+X^W
3-3蒸发器evaporator: o^~KAB7
3-4直接加热式蒸发器evaporator by direct heat: pc<A
,?
3-5间接加热式蒸发器evaporator by indirect heat: @0q*50
3-7溅射装置sputtering device: +jX.::UPm
3-8靶target: \+sP<'~M
3-10时控挡板timing shutter: xGymQ|y84
3-11掩膜mask: CT#N9
3-12基片支架substrate holder: *7 >K" j
3-13夹紧装置clamp: > v ]-B"Y
3-14换向装置reversing device: :[7.YQ
3-15基片加热装置substrate heating device: L\X2Olfz1
3-16基片冷却装置substrate colding device: { Sn
J
q3R?8Mb
4.真空镀膜设备 .=4k'99,
4-1真空镀膜设备vacuum coating plant: k/V:QdD Sb
(1).真空蒸发镀膜设备vacuum evaporation coating plant: J2~oIe2!+
(2).真空溅射镀膜设备vacuum sputtering coating plant: uSK<{UT~3
4-2连续镀膜设备continuous coating plant: yTL<S '
4-3半连续镀膜设备semi- continuous coating plant #:3~I
6. 1.漏孔 G=%SMl>[
1-1漏孔leaks: m;KD@E!
1-2通道漏孔channel leak: `@|Kx\y4=j
1-3薄膜漏孔membrane leak: \d{S3\7
1-4分子漏孔molecular leak: /*5lO;!s{
1-5粘滞漏孔vixcous leak: T)PH8 "
1-6校准漏孔calibrated leak: Fr ryZe=
1-7标准漏孔reference leak : iu6NIy7D
1-8虚漏virtual leak: yjxv D
1-9漏率leak rate: }Ii5[nRN
1-10标准空气漏率standard air leak rate: ,\n%e'
1-11等值标准空气漏率equivalent standard air leak rate: seo.1.Da2
1-12探索(示漏)气体: ygquQhf5
~!{y3thZ
2.本底 Yn }Ivg
2-1本底background: EAM2t|MG.
2-2探索气体本底search gas background : w(Hio-l=
2-3漂移drift: <v=T31aS
2-4噪声noise: "FT(U{^7d
b^]@8I[M
3.检漏仪 <rpXhcR
3-1检漏仪leak detector: Da"GYEC
3-2高频火花检漏仪H.F. spark leak detector: G;3N"az
3-3卤素检漏仪halide leak detector: ,a/<t"
3-4氦质谱检漏仪helium mass spectrometer leak detector: t!,GI&
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: c$HZvv
Y^@Nvt$<K
4.检漏 Iz[ T.$9
4-1气泡检漏leak detection by bubbles: Iib39?D W
4-2氨检漏leak detection by ammonia: i+HHOT
4-3升压检漏leak detection of rise pressure: " ~&d=f0m
4-4放射性同位素检漏radioactive isotope leak detection: 9>k-";
4-5荧光检漏fluorescence leak detection b)Px
7. 1.一般术语 +sc--e?
1-1真空干燥vacuum drying: >AT T<U=
1-2冷冻干燥freeze drying : Gv3AJ'NL
1-3物料material: <..|:0Q&~
1-4待干燥物料material to be dried: (G3S+T 9
1-5干燥物料dried material : !DUC#)F
1-6湿气moisture;humidity: ry%Fs&V*>
1-7自由湿气free moisture: ZBAtRs
1-8结合湿气bound moisture: P@z,[,sy"$
1-9分湿气partial moisture: y=)xo7(
1-10含湿量moisture content: 1ZF>e`t8
1-11初始含湿量initial moisture content: e):rr*
1-12最终含湿量final residual moisture: H_CX5=Nq^
1-13湿度degree of moisture ,degree of humidity : mt(2HBNoz
1-14干燥物质dry matter : qJZ5w}
1-15干燥物质含量content of dry matter: )6
_+
T1Q c?5K^
2.干燥工艺 M@/Hd0$
2-1干燥阶段stages of drying : dNL<O
(1).预干燥preliminary dry: oJEUNgY&
(2).一次干燥(广义)primary drying(in general): BL^8gtdn
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): Cg!]x
o
(4).二次干燥secondary drying: pjP
R3
r
2-2.(1).接触干燥contact drying: Z1gZn)7
(2).辐射干燥 drying by radiation : |#. J
(3).微波干燥microwave drying: (7qdrAeP
(4).气相干燥vapor phase drying: +$F_7Hx
(5).静态干燥static drying: J!GWP:b3
(6).动态干燥dynamic drying: f2y:K6$'l*
2-3干燥时间drying time: hi30|^l-
2-4停留时间length of stay(in the drying chamber): ?Gq|OT8
2-5循环时间cycle time: I;<aJo6Yl
2-6干燥率 dessication ratio : LT3ViCZ-n
2-7去湿速率mass flow rate of humidity: 1[;~>t@C
2-8单位面积去湿速率mass flow rate of humidity per surface area: :sY pZX1
2-9干燥速度 drying speed : u`]J]gE
2-10干燥过程drying process: H?(I-vO
2-11加热温度heating temperature: 5k^UZw
2-12干燥温度temperature of the material being dried : JPt=~e(
2-13干燥损失loss of material during the drying process : a\Ond#1p
2-14飞尘lift off (particles): Oa'DVfw2J
2-15堆层厚度thickness of the material: ^atX/
7jZ=+2
3.冷冻干燥 / ao|v
3-1冷冻freezing: $bd&$@sA
(1).静态冷冻static freezing: kT+Idu
(2).动态冷冻dynamic freezing: tC,R^${#
(3).离心冷冻centrifugal freezing: &ZRriqsQg
(4).滚动冷冻shell freezing: ,y+}0q-Ou
(5).旋转冷冻spin-freezing: k yFq
(6).真空旋转冷冻vacuum spin-freezing: Oz[]]`C1
(7).喷雾冷冻spray freezing: J(
(8).气流冷冻air blast freezing: ugwZAC
3-2冷冻速率rate of freezing:
6tPgFa#N
3-3冷冻物料frozen material: B3lP#ckh
3-4冰核ice core: Sl8A=Ez
3-5干燥物料外壳envelope of dried matter: /2!Wy6p
3-6升华表面sublimation front: k-$5H~(PZ
3-7融化位置freezer burn: \!erP!$x.
QD6in>+B@
4.真空干燥设备;真空冷冻干燥设备 Y'YvVI
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: S<f]Y4A&
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: W]]@pbG"H\
4-3加热表面heating surface: PE IUKlX
4-4物品装载面shelf : %V +hm5Q
4-5干燥器的处理能力throughput (of the vacuum drying chamber): P,|%7'? Y
4-6单位面积干燥器处理能力throughput per shelf area: VuOZZ7y
4-7冰冷凝器ice condenser: 7Z#r9Vr
4-8冰冷凝器的负载load of the ice condenser:
;PO{
ips
4-9冰冷凝器的额定负载rated load of the ice condenser Qd %U(|
8. 1.一般术语 RZtY3:FBx|
1-1试样sample : \lJCBb+k
(1).表面层surface layer: L*Gk1'
(2).真实表面true surface: s7A3CY]->
(3).有效表面积effective surface area: dOm@cs
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: DHUK_#!
(5).表面粒子密度surface particle density: tJ{3Z}K
(6).单分子层monolayer: J-6l<%962%
(7).表面单分子层粒子密度monolayer density: 5 (Lw-_y#
(8).覆盖系数coverage ratio: &DX&*Xq2
1-2激发excitation: (Q_J{[F
(1).一次粒子primary particle: i;u#<y{E
(2).一次粒子通量primary particle flux: qSg#:;(O
(3).一次粒子通量密度density of primary particle flux: T\(w}
(4).一次粒子负荷primary particle load: S~~G0GiW
(5).一次粒子积分负荷integral load of primary particle: ^~3u|u
(6).一次粒子的入射能量energy of the incident primary particle: ;.O#|Z[
(7).激发体积excited volume: 9vQI
~rz?
(8).激发面积excited area: LFzL{rny!U
(9).激发深度excited death: Yq6e=?-
(10).二次粒子secondary particles: 1Mf tq4nq
(11).二次粒子通量secondary particle flux: D%=VhKq
(12).二次粒子发射能energy of the emitted secondary particles: ma +iIt;
(13).发射体积emitting volume: Ix-bJE6+I,
(14).发射面积emitting area: ?5N7,|K)
(15).发射深度emitting depth: N)kZ2|oD
(16).信息深度information depth: >1}RiOd3
(17).平均信息深度mean information depth: qhdY<[6
1-3入射角angle of incidence: f: j9ze
1-4发射角angle of emission: FZvh]ZX
1-5观测角observation: \]j{
1-6分析表面积analyzed surface area: \E(Negt7
1-7产额 yield : | 61W-9;
1-8表面层微小损伤分析minimum damage surface analysis: >/r^l)`9_f
1-9表面层无损伤分析non-destructive surface analysis: UABaS(f3
1-10断面深度分析 profile analysis in depth; depth profile analysis : c#ahFpsnlw
1-11可观测面积observable area: 'n>v}__&|
1-12可观测立体角observable solid angle : ,ln=kj
1-13接受立体角;观测立体角angle of acceptance: c'wxCqnE
1-14角分辨能力angular resolving power: \ah.@s
1-15发光度luminosity: TFQX}kr]
1-16二次粒子探测比detection ratio of secondary particles: 8_d>=*(
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: lYF~CNvE
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ajy+%sXf=
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 4x2
;@Pd
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: S'h{["P~
0
1-21本底压力base pressure: 7f$ hg8
1-22工作压力working pressure: )YtdU(^J$
^$!H|
2.分析方法 ?2q;`Nb
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: SHAC(3o/e
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : {o."T/?d'
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: )S8 fFV
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: `y^tCJ2u*
2-3离子散射表面分析ion scattering spectroscopy: ~S85+OJ;M
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: <o aVI?
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: hhM?I$t:
2-6离子散射谱仪ion scattering spectrometer: yUyx&Y/
2-7俄歇效应Auger process: RBA{!
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: <`f~Z|/-_(
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: )B!64'|M
2-10光电子谱术photoelectron spectroscopy : ,rU>)X
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: Rxf.@E
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: [PhT
zXt
2-11光电子谱仪photoelectron spectrometer: EOn[!
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: M>yt\qbkA
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: )LdS1%
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): k-;A9!^h
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus