“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 'G#T 6B!
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真空术语 }~akVh`3
h{5K9$9=
1.标准环境条件 standard ambient condition: qs|{
2.气体的标准状态 standard reference conditions forgases: ?x\tE]
3.压力(压强)p pressure: C||9u}Q<
4.帕斯卡Pa pascal: {!/ha$(
5.托Torr torr:
W>HGB
6.标准大气压atm standard atmosphere: Ed>Dhy6\r
7.毫巴mbar millibar: GdlzpBl
8.分压力 partial pressure: Rn4Bl8z'>
9.全压力 total pressure: J?1U'/Wx2
10.真空 vacuum: )o;oOPT!
11.真空度 degree of vacuum: 5j{jbo=!
12.真空区域 ranges of vacuum: xIlo@W6
13.气体 gas: H?a1XEY/
14.非可凝气体 non-condensable gas: h;lg^zlTb
15.蒸汽vapor: d$?sS9"8(
16.饱和蒸汽压saturation vapor pressure: &|
guPZ
17.饱和度degree of saturation: Z+%w|Sx
18.饱和蒸汽saturated vapor: !%lcn
O
19.未饱和蒸汽unsaturated vapor: 26D,(Y$*
20.分子数密度n,m-3 number density of molecules: ALO0yc
21.平均自由程ι、λ,m mean free path: ]E:K8E
22.碰撞率ψ collision rate: :MF F*1
23.体积碰撞率χ volume collision rate: 5dNM:1VoE
24.气体量G quantity of gas: o]jPG
25.气体的扩散 diffusion of gas: cN&]JS,
26.扩散系数D diffusion coefficient; diffusivity: >Hd0l L
27.粘滞流 viscous flow: 6]D%|R,Q#}
28.粘滞系数η viscous factor: 4[P]+Z5b+
29.泊肖叶流 poiseuille flow: ih[!v"bv
30.中间流 intermediate flow: ^F? }MY>
31.分子流 molecular flow: L#>^R
32克努曾数 number of knudsen: 6A;,Ph2
33.分子泻流 molecular effusion; effusive flow:
{}A1[Y|
34.流逸 transpiration: ;J&p17~T9
35.热流逸 thermal transpiration: CwL8-z0 Jn
36.分子流率qN molecular flow rate; molecular flux: Al0ls
37.分子流率密度 molecular flow rate density; density of molecular flux: p "Cxe
38.质量流率qm mass flow rare: }NgevsV>;
39.流量qG throughput of gas: 9()d7Y#d/`
40.体积流率qV volume flow rate: v*[oe
41.摩尔流率qυ molar flow rate: )%6h9xyXt
42.麦克斯韦速度分布 maxwellian velocity distribution: QO;OeMQv%
43.传输几率Pc transmission probability:
4Y/kf%]]A
44.分子流导CN,UN molecular conductance: 8rEUZk
45.流导C,U conductance: \v]esIP5R'
46.固有流导Ci,Ui intrinsic conductance: 5IJm_oy
47.流阻W resistance: +~{Honj[
48.吸附 sorption: |3SM
49.表面吸附 adsorption: d&x #9ka
50.物理吸附physisorption: a^xt9o`
51.化学吸附 chemisorption: :g~X"C1s
52.吸收absorption: lB<
kf1[
53.适应系数α accommodation factor: E/:mO~1< c
54.入射率υ impingement rate: xJ(}?0h-X
55.凝结率condensation rate: >oHgs
56.粘着率 sticking rate: }1}L&M@
57.粘着几率Ps sticking probability: ^Q9;ro*;ck
58.滞留时间τ residence time: )xxpO$
59.迁移 migration: CEXD0+\q
60.解吸 desorption: \&jmSa=]l
61.去气 degassing: ~\]lMsk+
62.放气 outgassing: Iss)7I
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: >2BWie?T
64.蒸发率 evaporation rate: ygo4.
65.渗透 permeation: ~C31=\$
66.渗透率φ permeability: Zjq( ]y
67.渗透系数P permeability coefficient g=)OcTd#
2. 1.真空泵 vacuum pumps h( V:-D
1-1.容积真空泵 positive displacement pump: CxbGL
⑴.气镇真空泵 gas ballast vacuum pump: HD~o]l=H
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: oQL$X3S
⑶.干封真空泵 dry-sealed vacuum pump: T?e(m
⑷.往复真空泵 piston vacuum pump: DV!10NqUr
⑸.液环真空泵 liquid ring vacuum pump: 30fqD1_{
⑹.旋片真空泵 sliding vane rotary vacuum pump: C
&~s<tcn
⑺.定片真空泵 rotary piston vacuum pump: 'Z}3XVZEN
⑻.滑阀真空泵 rotary plunger vacuum pump: J-U5_>S
⑼.余摆线真空泵 trochoidal vacuum pump: !l|fzS8g
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ZFFKv
⑾.罗茨真空泵 roots vacuum pump: A8T75?lL(
1-2.动量传输泵 kinetic vacuum pump: #O,;3S
⑴.牵引分子泵molecular drag pump: SCq:jI
⑵.涡轮分子泵turbo molecular pump: /3KPK4!m
⑶.喷射真空泵ejector vacuum pump: S(ky:
⑷.液体喷射真空泵liquid jet vacuum pump: YW7Pimks
⑸.气体喷射真空泵gas jet vacuum pump: 6+LBs.vl}
⑹.蒸汽喷射真空泵vapor jet vacuum pump : 8:gUo8
⑺.扩散泵diffusion pump : kD\7wz,ui
⑻.自净化扩散泵self purifying diffusion pump: A V]7l}-
⑼.分馏扩散泵 fractionating diffusion pump : m4_ZGjmJM
⑽.扩散喷射泵diffusion ejector pump : (,XbxDfM
⑾.离子传输泵ion transfer pump: es!>u{8)
1-3.捕集真空泵 entrapment vacuum pump: 0U&@;/?
⑴吸附泵adsorption pump: ttd
^jT
⑵.吸气剂泵 getter pump: TJ_pMU
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 8~j1
⑷.吸气剂离子泵getter ion pump: %/}46z9\
⑸.蒸发离子泵 evaporation ion pump: E5QQI9ea
⑹.溅射离子泵sputter ion pump: vT{+Z\LL=
⑺.低温泵cryopump: A81'ca/
(8td0zq
2.真空泵零部件 +[B@83
2-1.泵壳 pump case: +cwuj
2-2.入口 inlet: BIY"{"hJ
2-3.出口outlet: &[W53Lqa
2-4.旋片(滑片、滑阀)vane; blade : G/N 1[)
2-5.排气阀discharge valve: /*1p|c ^
2-6.气镇阀gas ballast valve: &B?*|M`)k
2-7.膨胀室expansion chamber: 5#U=x ,7e
2-8.压缩室compression chamber: 9,cMb)=0
2-9.真空泵油 vacuum pump oil: qtlcY8!
2-10.泵液 pump fluid: n`.JI(|
2-11.喷嘴 nozzle: _~.S~;o!b
2-13.喷嘴扩张率nozzle expansion rate: 3Q!)bMv \
2-14.喷嘴间隙面积 nozzle clearance area : Y|nC_7&Bv
2-15.喷嘴间隙nozzle clearance: 5*\]F}
2-16.射流jet: &j?+%Y1n@
2-17.扩散器diffuser: a98J_^ n
2-18.扩散器喉部diffuser thoat: ((AIrE>Rr
2-19.蒸汽导管vapor tube(pipe;chimney): fJD+GvV$x
2-20.喷嘴组件nozzle assembly: 7-VP)|L#G
2-21.下裙skirt: N1yx|g:
["WWaCcx
3.附件 f-`C1|\w
3-1阱trap: a)QSq<2*
⑴.冷阱 cold trap: uN@El1ouY
⑵.吸附阱sorption trap: 4`/Td?THx
⑶.离子阱ion trap: srK9B0I
⑷.冷冻升华阱 cryosublimation trap: ^i!I0Q2yd
3-2.挡板baffle: a`6R}|ZB
3-3.油分离器oil separator: Oh5aJ)"D
3-4.油净化器oil purifier: ST1c`0e
3-5.冷凝器condenser: +'9E4Lpx
"0aJE1)p:
4.泵按工作分类 dLbSvK<(I
4-1.主泵main pump: s<{) X$
4-2.粗抽泵roughing vacuum pump: k!py*noy
4-3.前级真空泵backing vacuum pump: _c>8y
4-4.粗(低)真空泵 roughing(low)vacuum pump: pEq }b+-
4-5.维持真空泵holding vacuum pump: o&MOcy D
4-6.高真空泵high vacuum pump: 9@>Q7AUCQ
4-7.超高真空泵ultra-high vacuum pump: ,}/6Za
4-8.增压真空泵booster vacuum pump: *~kHH
?$.JgG%Z+g
5.真空泵特性 oVQbc\P3
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: u;9a/RI
5-2.真空泵的抽气量Q throughput of vacuum pump:。 (*Z:ByA
5-3.起动压力starting pressure: 'x<o{Hi"\B
5-4.前级压力 backing pressure : s)G?5Gz
5-5.临界前级压力 critical backing pressure: a=
(v S
5-6.最大前级压力maximum backing pressure: @_0tq {
5-7.最大工作压力maximum working pressure: NH<~BC]I
5-8.真空泵的极限压力ultimate pressure of a pump: .u:aX$t+
5-9.压缩比compression ratio: K(#O@Wmjq
5-10.何氏系数Ho coefficient: dWP<,Z>
5-11.抽速系数speed factor: (,D:6(R7t
5-12.气体的反扩散back-diffusion of gas: O>d
[;Q
5-13.泵液返流back-streaming of pump fluid: et=i@PB)
5-14.返流率back-streaming rate jI%glO'2
5-15.返迁移back-migration: rE%HNPO
5-16.爆腾bumping: -tA_"q'^
5-17.水蒸气允许量qm water vapor tolerable load: NqM=Nu\
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: '"T9y=9]s
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ;KgDVq5
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump .Bojb~zt
3. 1.一般术语 ;tC$O~X
1-1.压力计pressure gauge: 0ax;Q[z2
1-2.真空计vacuum gauge: JnLF61
⑴.规头(规管)gauge head: bnZ H
⑵.裸规nude gauge : \. a 7F4h
⑶.真空计控制单元gauge control unit : 40G'3HOp
⑷.真空计指示单元gauge indicating unit : S0`u!l89(
9XhcA
2.真空计一般分类 #^{%jlmHxJ
2-1.压差式真空计differential vacuum gauge: \_x~lRqJJ
2-2.绝对真空计 absolute vacuum gauge: W3jwc{lj
2-3.全压真空计total pressure vacuum gauge: VniU:A
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: -""(>$b2
2-5.相对真空计relative vacuum gauge : q6}KOO)
5?m4B:W
3.真空计特性 :eIQF7-
3-1.真空计测量范围pressure range of vacuum gauge: PMT}fg
3-2.灵敏度系数sensitivity coefficient: $LVzhQlD
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 1A[(R T]
3-5.规管光电流photon current of vacuum gauge head: n`V? n
3-6.等效氮压力equivalent nitrogen pressure : K>TEt5
3-7.X射线极限值 X-ray limit: e,MgR \F}
3-8.逆X射线效应anti X-ray effect: $Z3{D:-)
3-9.布利尔斯效应blears effect: W#2} EX
5_1\{lP
4.全压真空计 u4$R ZTC
4-1.液位压力计liquid level manometer: /D964VR1M\
4-2.弹性元件真空计elastic element vacuum gauge: I&`aGnr^^
4-3.压缩式真空计compression gauge: 4s@Tn>%SP
4-4.压力天平pressure balance: 0rvBjlFT
4-5.粘滞性真空计viscosity gauge : v3{%U1>}v
4-6.热传导真空计thermal conductivity vacuum gauge : N`~f77G
4-7.热分子真空计thermo-molecular gauge: %/
"yt}"|
4-8.电离真空计ionization vacuum gauge: N 1ydL
4-9.放射性电离真空计radioactive ionization gauge: X#HH7V>
4-10.冷阴极电离真空计cold cathode ionization gauge: O[\mPFu5
4-11.潘宁真空计penning gauge: %cBOi_}}~
4-12.冷阴极磁控管真空计cold cathode magnetron gauge:
: 76zRF
4-13.放电管指示器discharge tube indicator: =~5N/!
4-14.热阴极电离真空计hot cathode ionization gauge: -/2B fIq
4-15.三极管式真空计triode gauge: j{D tjV8
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: w OOu/Y
4-17.B-A型电离真空计Bayard-Alpert gauge: E#,\[<pc
4-18.调制型电离真空计modulator gauge: 4sW'pH
4-19.抑制型电离真空计suppressor gauge: UA(4mbz+
4-20.分离型电离真空计extractor gauge: 5A<}*T
4-21.弯注型电离真空计bent beam gauge: xGFbh4H=8p
4-22.弹道型电离真空计 orbitron gauge : qoZ)"M
4-23.热阴极磁控管真空计hot cathode magnetron gauge: !2>@:CKX
LzDRy L
5.分压真空计(分压分析器) /8!n7a7
5-1.射频质谱仪radio frequency mass spectrometer: +v$W$s&b-h
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: OMM5ALc(F
5-3.单极质谱仪momopole mass spectrometer: w=3
j'y{f
5-4.双聚焦质谱仪double focusing mass spectrometer: yz,0
S' U
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ?1zGs2Qs
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: pe<T"[X
5-7.回旋质谱仪omegatron mass spectrometer: :LlZ#V2
5-8.飞行时间质谱仪time of flight mass spectrometer: V.6pfL
*?$M=tH
6.真空计校准 5SZa,+]
6-1.标准真空计reference gauges: "Q:h[) a
6-2.校准系统system of calibration: ~ch%mI~
6-3.校准系数K calibration coefficient: c&,q`_t
6-4.压缩计法meleod gauge method: JVxja<43
6-5.膨胀法expansion method: Gs,e8ri!
6-6.流导法flow method: f/s" 2r
4. 1.真空系统vacuum system k"C'8<T)'
1-1.真空机组pump system: \Rb:t}
1-2.有油真空机组pump system used oil : 9_?e, Q
1-3.无油真空机组oil free pump system !|j|rYi-
1-4.连续处理真空设备continuous treatment vacuum plant: qj `C6_?
1-5.闸门式真空系统vacuum system with an air-lock: DycXJ3eQ
1-6.压差真空系统differentially pumped vacuum system: ~I9o* cq
1-7.进气系统gas admittance system: M<*WC{
U=7nz|
2.真空系统特性参量 qVI0?B
x
2-1.抽气装置的抽速volume flow rate of a pumping unit : JZ~wacDd
2-2.抽气装置的抽气量throughput of a pumping unit : Yi)s=Q :
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 8e^u KYR<
2-4.真空系统的漏气速率leak throughput of a vacuum system: .gzfaxi
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: G
"!v)o
2-6.极限压力ultimate pressure: SH#*Lc
2-7.残余压力residual pressure: FvYciU!
2-8.残余气体谱residual gas spectrum: rZcSG(d`53
2-9.基础压力base pressure: RgW#z-PZF
2-10.工作压力working pressure: X/90S2=P
2-11.粗抽时间roughing time: F#M(#!)Y"
2-12.抽气时间pump-down time: Lq1?Y
2-13.真空系统时间常数time constant of a vacuum system: *,%$l+\h
2-14.真空系统进气时间venting time: gujP{Z
f8aY6o"i
3.真空容器 z6rT<~xZtu
3-1.真空容器;真空室vacuum chamber: LkP
:l
3-2.封离真空装置sealed vacuum device: Ir5|H|b<
3-3.真空钟罩vacuum bell jar: `CC=?E
3-4.真空容器底板vacuum base plate: DW78SoyedZ
3-5.真空岐管vacuum manifold: \v5;t9uBZ
3-6.前级真空容器(贮气罐)backing reservoir: 6>)nkD32g
3-7.真空保护层outer chamber: Dg"szJ-
3-8.真空闸室vacuum air lock: esQ$.L
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: ^jUw4Dj~-q
GN9kCyPK
4.真空封接和真空引入线 XZM@Rys
4-1.永久性真空封接permanent seal : J=gFiBw
4.2.玻璃分级过渡封接graded seal : xy4+
[u
4-3.压缩玻璃金属封接compression glass-to-metal seal: tl\<:8pI"
4-4.匹配式玻璃金属封接matched glass-to-metal seal: J 7 G-qF\
4-5.陶瓷金属封接ceramic-to-metal seal: |#M|"7;2z
4-6.半永久性真空封接semi-permanent seal : V>,=%r4f
4-7.可拆卸的真空封接demountable joint: _ZFEo< `'
4-8.液体真空封接liquid seal +xU( {/
4-9.熔融金属真空封接molten metal seal: vJ=Q{_D=\
4-10.研磨面搭接封接ground and lapped seal: t89Tt @cf
4-11.真空法兰连接vacuum flange connection: lw[c+F7
4-12.真空密封垫vacuum-tight gasket: <F(2D<d{;)
4-13.真空密封圈ring gasket: Y&8,f|{R
4-14.真空平密封垫flat gasket: #0Y_!'j
4-15.真空引入线feedthrough leadthrough: <F;+A{M)
4-16.真空轴密封shaft seal: # Q,EL73;
4-17.真空窗vacuum window: ' h<(
4-18.观察窗viewing window: 0V21_".S
7`&ISRU4
5.真空阀门 {7@*cBqN
5-1.真空阀门的特性characteristic of vacuum valves: B(94; ,(
⑴.真空阀门的流导conductance of vacuum valves: ^.\O)K {h
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: d[J_iD{ &
5-2.真空调节阀regulating valve: MuQ)F-GSUu
5-3.微调阀 micro-adjustable valve: PnaiSt9p?r
5-4.充气阀charge valve: 5B4/2q=
5-5.进气阀gas admittance valve: G$MEVfd"
5-6.真空截止阀break valve: F]UH\1
5-7.前级真空阀backing valve: Q= fl!>P
5-8.旁通阀 by-pass valve: xk%
62W
5-9.主真空阀main vacuum valve: )%MC*Z:^
5-10.低真空阀low vacuum valve: )y;7\-K0
5-11.高真空阀high vacuum valve: ;l0dx$w
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: $HsNV6
5-13.手动阀manually operated valve: ],S {?!'1
5-14.气动阀pneumatically operated valve: L/exR6M7
5-15.电磁阀electromagnetically operated valve: \|HNFx T`
5-16.电动阀valve with electrically motorized operation:
Wu'qpJ
5-17.挡板阀baffle valve: _UPfqC ?
5-18.翻板阀flap valve: ~"#HHaBO#
5-19.插板阀gate valve: ;%^=V#
5-20.蝶阀butterfly valve: LlO8]b!P-^
PC<_1!M]
6.真空管路 ]2qKc
6-1.粗抽管路roughing line: \rzMgR$/rj
6-2.前级真空管路backing line: >20dK
6-3.旁通管路;By-Pass管路 by-pass line: [i ~qVn2vT
6-4.抽气封口接头pumping stem: lYJSg70P
6-5.真空限流件limiting conductance: 3dj|jw5
6-6.过滤器filter: bNVeL$'
5. 1.一般术语 tLa%8@;'$
1-1真空镀膜vacuum coating: ~Ss,he]Er
1-2基片substrate: I*3}erT
1-3试验基片testing substrate: QR'# ]k;>%
1-4镀膜材料coating material: ;VAyH('~
1-5蒸发材料evaporation material: 7\,9Gcv1
1-6溅射材料sputtering material: Lm2)3;ei
1-7膜层材料(膜层材质)film material: ($[+dR
1-8蒸发速率evaporation rate: ,Q7;(&x~
1-9溅射速率sputtering rate: @|DQZt
1-10沉积速率deposition rate: e@ZM&iR
1-11镀膜角度coating angle: mA+:)?e5~
2icQ (H;
2.工艺 U\tx{CsSz
2-1真空蒸膜vacuum evaporation coating: yW=+6@A4
(1).同时蒸发simultaneous evaporation: WXY'%G
(2).蒸发场蒸发evaporation field evaporation: WJnGF3G>
(3).反应性真空蒸发reactive vacuum evaporation: }QE*-GVv]
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: V)>?[
(5).直接加热的蒸发direct heating evaporation: ngl +`|u
(6).感应加热蒸发induced heating evaporation: @i; )`k5b
(7).电子束蒸发electron beam evaporation: uwSSrT
(8).激光束蒸发laser beam evaporation: z m$Sw0#(
(9).间接加热的蒸发indirect heating evaporation: >9dD7FH
(10).闪蒸flash evaportion: lt&(S)
2-2真空溅射vacuum sputtering: P$#: $U@
(1).反应性真空溅射 reactive vacuum sputtering: kY~4AH
(2).偏压溅射bias sputtering: yEI@^8]s
(3).直流二级溅射direct current diode sputtering: Ct w <-'
(4).非对称性交流溅射asymmtric alternate current sputtering: ,dCEy+
(5).高频二极溅射high frequency diode sputtering: i#`q<+/q
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: wc4BSJa,19
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: *c94'T cl
(8).离子束溅射ion beam sputtering: S-7&$n
(9).辉光放电清洗glow discharge cleaning: .PUp3X-
2-3物理气相沉积PVD physical vapor deposition: jfY7ich
2-4化学气相沉积CVD chemical vapor deposition: /q]rA
2-5磁控溅射magnetron sputtering:
<Kv$3y
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: !B}9gT
2-7空心阴极离子镀HCD hollow cathode discharge deposition: 6p)AQTh>
2-8电弧离子镀arc discharge deposition: MxIa,M<
9_?xAJ
3.专用部件 W8^m-B&
3-1镀膜室coating chamber: "^n,(l*4x
3-2蒸发器装置evaporator device: {7OHEArv
3-3蒸发器evaporator: GBbnR:hM
3-4直接加热式蒸发器evaporator by direct heat: a4__1N^Qj
3-5间接加热式蒸发器evaporator by indirect heat: PC#^L$cg}
3-7溅射装置sputtering device: IT_I.5*A2
3-8靶target: Go)$LC0Mi
3-10时控挡板timing shutter: 9qB0F_xl
3-11掩膜mask: I4X9RYB6c
3-12基片支架substrate holder: T$xBH
3-13夹紧装置clamp: V*uE83x1
3-14换向装置reversing device: !wfW0?eu
3-15基片加热装置substrate heating device: FQDf?d5
3-16基片冷却装置substrate colding device: fORkH^Y(&
FvxM
4.真空镀膜设备 .:r~?$(
4-1真空镀膜设备vacuum coating plant: H4w\e#|
(1).真空蒸发镀膜设备vacuum evaporation coating plant: ) CP
(2).真空溅射镀膜设备vacuum sputtering coating plant: (90/,@66l
4-2连续镀膜设备continuous coating plant: D0r viO
4-3半连续镀膜设备semi- continuous coating plant EO&Q
6. 1.漏孔 <W"W13*j!
1-1漏孔leaks: ^a4z*#IOr
1-2通道漏孔channel leak: Pb#M7=J/
1-3薄膜漏孔membrane leak: ^}_Ka //k
1-4分子漏孔molecular leak: hJ@vlMW
1-5粘滞漏孔vixcous leak: 6Yj{%
G
1-6校准漏孔calibrated leak: ? nd:
:O
1-7标准漏孔reference leak : J?QS7#!%
1-8虚漏virtual leak: 08`|C)Z!
1-9漏率leak rate: u5(8k_7
1-10标准空气漏率standard air leak rate: wGc7
1-11等值标准空气漏率equivalent standard air leak rate: ?l0eU@rwQ
1-12探索(示漏)气体: x#>V50E
NBYJ'nA%;f
2.本底 +xFn~b/
2-1本底background: Lgg,K//g
2-2探索气体本底search gas background : CJ IuMsZ
2-3漂移drift: @NiuT%#c
2-4噪声noise: Jj"{C]
$5R2QNg n
3.检漏仪 pH1!6X
3-1检漏仪leak detector: g^'h4qOa
3-2高频火花检漏仪H.F. spark leak detector: gxv^=;2C
3-3卤素检漏仪halide leak detector: z0[XI 7KK
3-4氦质谱检漏仪helium mass spectrometer leak detector: *NmY]
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: q<JCgO-F<
}aZuCe_
4.检漏 qs5>`skX
4-1气泡检漏leak detection by bubbles: ~]?:v,UIm(
4-2氨检漏leak detection by ammonia: p)y5[HX
4-3升压检漏leak detection of rise pressure: +[7~:e}DZ
4-4放射性同位素检漏radioactive isotope leak detection: >t+U`6xK
4-5荧光检漏fluorescence leak detection 6hxZ5&;(*
7. 1.一般术语 ;CYoc4e
1-1真空干燥vacuum drying: IOy0WHl|
1-2冷冻干燥freeze drying : ?b
(iWq
1-3物料material: `q^#u
1-4待干燥物料material to be dried: mci> MEb
1-5干燥物料dried material : tn]nl!_@
1-6湿气moisture;humidity: v"USD<
1-7自由湿气free moisture: U\KMeaF5e-
1-8结合湿气bound moisture: ]juPm8eF
1-9分湿气partial moisture: 2c `m=
1-10含湿量moisture content: X?5{2ulrI
1-11初始含湿量initial moisture content: Ar`+x5
1-12最终含湿量final residual moisture: A3jxjQ
1-13湿度degree of moisture ,degree of humidity : X0/slOT
1-14干燥物质dry matter : (8duV
1-15干燥物质含量content of dry matter: @!sK@&ow@%
a>wCBkD
2.干燥工艺 W0qR?jc
2-1干燥阶段stages of drying : ?Nos;_/
(1).预干燥preliminary dry: =8AT[.Hh
(2).一次干燥(广义)primary drying(in general): l5[5Y6c>
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): to={q
CqU
(4).二次干燥secondary drying: <!OBpAq
2-2.(1).接触干燥contact drying: LOh2eZ"n
(2).辐射干燥 drying by radiation : <DF3!r
(3).微波干燥microwave drying: PTQ#8(_,
(4).气相干燥vapor phase drying: 50,'z?-_
(5).静态干燥static drying: OM86C
(6).动态干燥dynamic drying: [h/T IGE\
2-3干燥时间drying time: B
`(jTL
2-4停留时间length of stay(in the drying chamber): _D '(R
2-5循环时间cycle time: {)[o*+9
2-6干燥率 dessication ratio : 2~4:rEPJ:
2-7去湿速率mass flow rate of humidity: /0s1;?
2-8单位面积去湿速率mass flow rate of humidity per surface area: 3BFOZV+
2-9干燥速度 drying speed : O)'CU1vMb
2-10干燥过程drying process: f1 ;
2-11加热温度heating temperature: F.9}jd{
2-12干燥温度temperature of the material being dried : ~tDYo)hH8
2-13干燥损失loss of material during the drying process : ~k"+5bHa*
2-14飞尘lift off (particles): broLC5hbQU
2-15堆层厚度thickness of the material: z0z@LA4k6@
r&gvP|W%
3.冷冻干燥 2HX/@ERhmu
3-1冷冻freezing: p.DQ|?
(1).静态冷冻static freezing: 6Yu:v
(2).动态冷冻dynamic freezing: V6]6KP#D
(3).离心冷冻centrifugal freezing: wlS/(:02
(4).滚动冷冻shell freezing: q m3\)9C
(5).旋转冷冻spin-freezing: P}R:o
(6).真空旋转冷冻vacuum spin-freezing: nm^HL|
(7).喷雾冷冻spray freezing: E~!$&9\
(8).气流冷冻air blast freezing: i8]EIXbMX
3-2冷冻速率rate of freezing: &K ~k'P~m
3-3冷冻物料frozen material: ?nU<cx h
3-4冰核ice core: 8mI(0m'
3-5干燥物料外壳envelope of dried matter: $:9t(X)H
3-6升华表面sublimation front: kAftW
'
3-7融化位置freezer burn: inut'@=G/
#<{v~sVp&
4.真空干燥设备;真空冷冻干燥设备 `TrWtSwv
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ~?Zib1f)
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: [doEArwn
4-3加热表面heating surface: .#[ 9q-
4-4物品装载面shelf : HD j6E"
4-5干燥器的处理能力throughput (of the vacuum drying chamber): hnj\|6L
4-6单位面积干燥器处理能力throughput per shelf area: Y_Yf'z1>[
4-7冰冷凝器ice condenser: @]3\*&R}
4-8冰冷凝器的负载load of the ice condenser: n`Q@<op
4-9冰冷凝器的额定负载rated load of the ice condenser \8vP"Kr
8. 1.一般术语 CPz<iU
1-1试样sample : /%@;t@BK4
(1).表面层surface layer: epy2}TI
(2).真实表面true surface: C}huU
(3).有效表面积effective surface area: 'I[?R&j$G
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: ,\4]uZ<
(5).表面粒子密度surface particle density: mLCDN1UO{
(6).单分子层monolayer: &
3#7>oQ
(7).表面单分子层粒子密度monolayer density: 3>O|i2U
(8).覆盖系数coverage ratio: #2tmi1
ya
1-2激发excitation: f{BF%;
(1).一次粒子primary particle: ztp|FUi
(2).一次粒子通量primary particle flux: H 0l1=y
(3).一次粒子通量密度density of primary particle flux: !~#zd]0x;
(4).一次粒子负荷primary particle load: U>S
(5).一次粒子积分负荷integral load of primary particle: 0eY!Z._^
(6).一次粒子的入射能量energy of the incident primary particle: gOF^?M11x
(7).激发体积excited volume: sJ6.3=
c
(8).激发面积excited area: d |17G
(9).激发深度excited death: ASqYA1p.
(10).二次粒子secondary particles: )+.=z
(11).二次粒子通量secondary particle flux: -Vn#Ab_C
(12).二次粒子发射能energy of the emitted secondary particles: R)NSJ-A!2
(13).发射体积emitting volume: R1];P*>%gZ
(14).发射面积emitting area: VD=H=Ju
(15).发射深度emitting depth: F#Lo^ 8
(16).信息深度information depth: PTe L3L
(17).平均信息深度mean information depth: n!)$e;l
1-3入射角angle of incidence: BJ|l
1-4发射角angle of emission: -WC0W
1-5观测角observation: q/O2E<=w*c
1-6分析表面积analyzed surface area: ;;0'BdsL`
1-7产额 yield : Fh #QS'[
1-8表面层微小损伤分析minimum damage surface analysis: ;(C<gt,r}
1-9表面层无损伤分析non-destructive surface analysis: *,\v|]fc
1-10断面深度分析 profile analysis in depth; depth profile analysis : X^\D"fmE.
1-11可观测面积observable area: +_GS@)L`%
1-12可观测立体角observable solid angle : ?I+L
1-13接受立体角;观测立体角angle of acceptance: ">}6i9o
1-14角分辨能力angular resolving power: W!{RJWe
1-15发光度luminosity: o/pw=R/):
1-16二次粒子探测比detection ratio of secondary particles: (b25g!
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ale'-V)5
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: }c/p;<
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: f-%M~:
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: 2KLMFI.F
1-21本底压力base pressure: %"WENa/t
1-22工作压力working pressure: IkCuw./
1 Pk+zBJ$
2.分析方法 7FC!^)x1
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: BA@E
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : u/=hueR<^
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: ^r~[3NT
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: }3
xkA
2-3离子散射表面分析ion scattering spectroscopy: M7=,J;@
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: t;* zr*
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: 8~Cmn%
2-6离子散射谱仪ion scattering spectrometer: K(;qd Ir
2-7俄歇效应Auger process: )Zq'r L<
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: 63l3WvoK
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: E'x"EN
2-10光电子谱术photoelectron spectroscopy : g89@>?Mn
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 8iIp[9~=
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: D{(}&8a9
2-11光电子谱仪photoelectron spectrometer: #/oH #/?
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: En\@d@j<u
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: y3~`qq
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): 2uj
.*
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus