“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 2.!1kije
--------------------------------------------------- j/~VP2R`
真空术语 ^M[#^wv,
U
7EHBW
1.标准环境条件 standard ambient condition: "IOC[ #&G
2.气体的标准状态 standard reference conditions forgases: a^%8QJW
3.压力(压强)p pressure: @;g`+:=
4.帕斯卡Pa pascal: ix(U:'{
5.托Torr torr: ;tXB46
6.标准大气压atm standard atmosphere: K<RmaXZ
7.毫巴mbar millibar: )o86lH"z
8.分压力 partial pressure: >-UD]?>
9.全压力 total pressure: \)uy"+ Z`
10.真空 vacuum: CM`x>J
11.真空度 degree of vacuum: >F,$;y52
12.真空区域 ranges of vacuum: h_AJI\{"
13.气体 gas: ZYrKG+fkl
14.非可凝气体 non-condensable gas: ^xzE^"G6
15.蒸汽vapor: ~o}moE/
;O
16.饱和蒸汽压saturation vapor pressure: bta0?O
#
17.饱和度degree of saturation: k,a,h^{}j
18.饱和蒸汽saturated vapor: YN_X0+b3C
19.未饱和蒸汽unsaturated vapor: A$%@fO.b
20.分子数密度n,m-3 number density of molecules: GTT5<diw
21.平均自由程ι、λ,m mean free path: xWd9%,mDNR
22.碰撞率ψ collision rate: p
Z0=
23.体积碰撞率χ volume collision rate: b$;HI7)/K
24.气体量G quantity of gas: 5}<.1ab3V
25.气体的扩散 diffusion of gas: 8W(<q|t
26.扩散系数D diffusion coefficient; diffusivity: m]bL)]Z
27.粘滞流 viscous flow: z~GVvgd
28.粘滞系数η viscous factor: OJnPP>
29.泊肖叶流 poiseuille flow: ['/;'NhdlY
30.中间流 intermediate flow: e@='Q H
31.分子流 molecular flow: Rh!L'?C
32克努曾数 number of knudsen: ?y+\v'3v
33.分子泻流 molecular effusion; effusive flow: U;x99Go:
34.流逸 transpiration: p*A^0DN'Fn
35.热流逸 thermal transpiration: $I?=.:<+
36.分子流率qN molecular flow rate; molecular flux: k/$Ja;
37.分子流率密度 molecular flow rate density; density of molecular flux: Rh wt<
38.质量流率qm mass flow rare: "r5'lQI
39.流量qG throughput of gas: 4U}.Skzq
40.体积流率qV volume flow rate: n,CD4Nv
41.摩尔流率qυ molar flow rate: -0=}|$H.
42.麦克斯韦速度分布 maxwellian velocity distribution: ,apd3X%g
43.传输几率Pc transmission probability: jEC'l]l
44.分子流导CN,UN molecular conductance: 9OrA9r
45.流导C,U conductance: @t{{Q1
46.固有流导Ci,Ui intrinsic conductance: AlPL;^Y_l
47.流阻W resistance: 9'L1KQ
48.吸附 sorption: O[i2A(
49.表面吸附 adsorption: O+CF/ipX/
50.物理吸附physisorption: eukX#0/^
51.化学吸附 chemisorption: r< d?
52.吸收absorption: (H|%?F;{l
53.适应系数α accommodation factor: fS;m+ D!j@
54.入射率υ impingement rate: VZ9e~){xA
55.凝结率condensation rate: T>AI0R3
56.粘着率 sticking rate: 7)ES!C
57.粘着几率Ps sticking probability: `<]P"G
58.滞留时间τ residence time: '=@-aVp
59.迁移 migration: {,nd_3"Vq
60.解吸 desorption: 0lvb{Zd
61.去气 degassing: hr/xpQW
62.放气 outgassing: $6Q2)^LJ
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: E-*>f"<h
64.蒸发率 evaporation rate: UgOGBj,&5W
65.渗透 permeation: 'ugR!o1
66.渗透率φ permeability: brpN>\
67.渗透系数P permeability coefficient &;uGIk>s
2. 1.真空泵 vacuum pumps xc3Ov9`8%
1-1.容积真空泵 positive displacement pump: !VJT"Ds_
⑴.气镇真空泵 gas ballast vacuum pump: H4K(SGx
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: zD#+[XI]K
⑶.干封真空泵 dry-sealed vacuum pump: RPScP
⑷.往复真空泵 piston vacuum pump: $w2[5|^S
⑸.液环真空泵 liquid ring vacuum pump: 3!ajvSOI9j
⑹.旋片真空泵 sliding vane rotary vacuum pump: Px^<2Q%Fs
⑺.定片真空泵 rotary piston vacuum pump: o$qFa9|Ec?
⑻.滑阀真空泵 rotary plunger vacuum pump: A ydy=sj
⑼.余摆线真空泵 trochoidal vacuum pump: (<5'ceF)X
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ]9~#;M%1
⑾.罗茨真空泵 roots vacuum pump: !T&u2=`D
1-2.动量传输泵 kinetic vacuum pump: $yR{ZFo
⑴.牵引分子泵molecular drag pump: s525`Q;
⑵.涡轮分子泵turbo molecular pump: //4p1^%
⑶.喷射真空泵ejector vacuum pump:
t`&s
⑷.液体喷射真空泵liquid jet vacuum pump: \a~;8):q=i
⑸.气体喷射真空泵gas jet vacuum pump: mtHi9).,y|
⑹.蒸汽喷射真空泵vapor jet vacuum pump : Ri%Of:zZ
⑺.扩散泵diffusion pump : CM@"lV_
⑻.自净化扩散泵self purifying diffusion pump: s>"WQ|;6
⑼.分馏扩散泵 fractionating diffusion pump : n=#[Mi $Y
⑽.扩散喷射泵diffusion ejector pump : st1M.}
⑾.离子传输泵ion transfer pump: ":ws~Zep
1-3.捕集真空泵 entrapment vacuum pump:
:jN;l
⑴吸附泵adsorption pump:
M\$<g
⑵.吸气剂泵 getter pump: B=nx8s
⑶.升华(蒸发)泵 sublimation (evaporation)pump : ./5MsHfbxt
⑷.吸气剂离子泵getter ion pump: vp9E}ga
⑸.蒸发离子泵 evaporation ion pump: \[hrG?A
⑹.溅射离子泵sputter ion pump: H]]>sE
⑺.低温泵cryopump: =fu_ Jau}
J3!k*"P
2.真空泵零部件 07HX5 Hd
2-1.泵壳 pump case: ]T28q/B;k
2-2.入口 inlet: 6b1 Uj<
2-3.出口outlet: Q=9VuTE
2-4.旋片(滑片、滑阀)vane; blade : n
B|C-.F
2-5.排气阀discharge valve: 0$dY;,Q .
2-6.气镇阀gas ballast valve: 0^tJX1L
2-7.膨胀室expansion chamber: 7C6BZ$(
2-8.压缩室compression chamber: =*O9)$b
2-9.真空泵油 vacuum pump oil: ~NJL S-
2-10.泵液 pump fluid: epm8N /
2-11.喷嘴 nozzle: 5Qe}v
2-13.喷嘴扩张率nozzle expansion rate: =F;^^VX
2-14.喷嘴间隙面积 nozzle clearance area : :O2v0Kx
2-15.喷嘴间隙nozzle clearance: ?(XX
2-16.射流jet: (j\UoKLRt
2-17.扩散器diffuser: s!zr>N"
2-18.扩散器喉部diffuser thoat: m0K2 p~
2-19.蒸汽导管vapor tube(pipe;chimney): ieK'<%dxF
2-20.喷嘴组件nozzle assembly: .cnw?EI
2-21.下裙skirt: A 5\"e^>
4?6'~G$k
3.附件 "\P~Re"EH
3-1阱trap: iS^^Z ZyR
⑴.冷阱 cold trap: sZ(Q4)r
⑵.吸附阱sorption trap: N_~Wu
⑶.离子阱ion trap: MDXQj5s^
⑷.冷冻升华阱 cryosublimation trap: NhaeAD
$e
3-2.挡板baffle: LB 5EGw
3-3.油分离器oil separator: S}oF7;'Ga
3-4.油净化器oil purifier: W!Os ci
3-5.冷凝器condenser: D_`)T;<Sp
a~+WL
4.泵按工作分类 5L'@WB|{4u
4-1.主泵main pump: X([n>w
4-2.粗抽泵roughing vacuum pump: ?>Ci`XlLr
4-3.前级真空泵backing vacuum pump: U8 @*I>vA
4-4.粗(低)真空泵 roughing(low)vacuum pump: SOY#, Zu
4-5.维持真空泵holding vacuum pump: {d5ur@G1
4-6.高真空泵high vacuum pump: `rFGSq$9
4-7.超高真空泵ultra-high vacuum pump: oA^
]x>
4-8.增压真空泵booster vacuum pump: x[<#mt
D}C*8s bC}
5.真空泵特性 c;fyUi
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: m_W.r+s~C4
5-2.真空泵的抽气量Q throughput of vacuum pump:。 4zvU"np
5-3.起动压力starting pressure: 6O?S r,
5-4.前级压力 backing pressure : '48|f`8$
5-5.临界前级压力 critical backing pressure: BJ;c F"Kp
5-6.最大前级压力maximum backing pressure: `Y9}5p
5-7.最大工作压力maximum working pressure: #hiDZ>nr
5-8.真空泵的极限压力ultimate pressure of a pump: xH.q
5-9.压缩比compression ratio: <.]& FPJ
5-10.何氏系数Ho coefficient: jT_Tx\k
5-11.抽速系数speed factor: gG|1$
5-12.气体的反扩散back-diffusion of gas: |Szr=[
5-13.泵液返流back-streaming of pump fluid: -"b3q
5-14.返流率back-streaming rate x6mq['_
5-15.返迁移back-migration: Qpu2RfP
5-16.爆腾bumping: Wam?(!{mOf
5-17.水蒸气允许量qm water vapor tolerable load: C)dYAq3,8
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: |L#r)$n{1
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: "PP0PL^5F
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump Al;oI3
3. 1.一般术语 ]t0S_UH$
1-1.压力计pressure gauge: T[II;[EiE
1-2.真空计vacuum gauge: U-N/Z\QD
⑴.规头(规管)gauge head: H%jIjf
⑵.裸规nude gauge : FO3*[O
⑶.真空计控制单元gauge control unit : "+C\f)
⑷.真空计指示单元gauge indicating unit : |xC
TX
V&nJT~k
2.真空计一般分类 SQ.Wj?W)
2-1.压差式真空计differential vacuum gauge: WM7/|.HQ
2-2.绝对真空计 absolute vacuum gauge: tUnVdh6L.B
2-3.全压真空计total pressure vacuum gauge: 69w"$Vk
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: +opN\`
2-5.相对真空计relative vacuum gauge : `^Sq>R!;
zIm!8a
3.真空计特性 jCa;g{#@
3-1.真空计测量范围pressure range of vacuum gauge: ~&jCz4M
3-2.灵敏度系数sensitivity coefficient: 3Q"+
#Ob
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): XsMphZnK
3-5.规管光电流photon current of vacuum gauge head: +u)$o
3-6.等效氮压力equivalent nitrogen pressure : )}lV41u
3-7.X射线极限值 X-ray limit: M- A}(r +J
3-8.逆X射线效应anti X-ray effect: I=-;*3g6
3-9.布利尔斯效应blears effect: K?I&,t_*R
=f|a?j,f~
4.全压真空计 Um|Tf]q
4-1.液位压力计liquid level manometer: XOFaS '.
4-2.弹性元件真空计elastic element vacuum gauge: )o,0aGo>Of
4-3.压缩式真空计compression gauge: ,_-*/- 7;8
4-4.压力天平pressure balance: ^!tI+F{n{
4-5.粘滞性真空计viscosity gauge : fL:Fn"Nv
4-6.热传导真空计thermal conductivity vacuum gauge : 6S&YL
4-7.热分子真空计thermo-molecular gauge: VG7#6)sQoK
4-8.电离真空计ionization vacuum gauge: |
Ylk`<
4-9.放射性电离真空计radioactive ionization gauge: ?V)6`St#C
4-10.冷阴极电离真空计cold cathode ionization gauge: xb;mm9H
4-11.潘宁真空计penning gauge: Mb!^_cS(
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 1MSu])
W
4-13.放电管指示器discharge tube indicator: SW,Po>Y
4-14.热阴极电离真空计hot cathode ionization gauge: 5Yr$dNe
4-15.三极管式真空计triode gauge: PTqS L]
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: Puh&F< B
4-17.B-A型电离真空计Bayard-Alpert gauge: <rF
4-18.调制型电离真空计modulator gauge: .9QQ]fLs
4-19.抑制型电离真空计suppressor gauge: b>EUa> h
4-20.分离型电离真空计extractor gauge: EC/R|\d?Un
4-21.弯注型电离真空计bent beam gauge: Uc2#so$9
4-22.弹道型电离真空计 orbitron gauge : RkM! BcB
4-23.热阴极磁控管真空计hot cathode magnetron gauge: bc-)y3gHU
m8'1@1d|
5.分压真空计(分压分析器) b5R*]
5-1.射频质谱仪radio frequency mass spectrometer: ;{20Heuz
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: p-k qX
5-3.单极质谱仪momopole mass spectrometer: W@=ilW3RD
5-4.双聚焦质谱仪double focusing mass spectrometer: [l:.Q?? )|
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Hq$|j,&?
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 1L7,x @w
5-7.回旋质谱仪omegatron mass spectrometer: eo[^ij
5-8.飞行时间质谱仪time of flight mass spectrometer: ] fB{
iI7~9SCE
6.真空计校准 QeoDq
6-1.标准真空计reference gauges: (#qVtN`t
6-2.校准系统system of calibration: <Z;BB)I&C`
6-3.校准系数K calibration coefficient: AtI,&S#{
6-4.压缩计法meleod gauge method: .VT,,0
6-5.膨胀法expansion method: 1\uS~RR
6-6.流导法flow method: EK_^#b
4. 1.真空系统vacuum system J;dFmZOk
1-1.真空机组pump system: #4>F%_
1-2.有油真空机组pump system used oil : dGe
1-3.无油真空机组oil free pump system &@+;]t
1-4.连续处理真空设备continuous treatment vacuum plant: \mloR
'
1-5.闸门式真空系统vacuum system with an air-lock: +L6d$+
1-6.压差真空系统differentially pumped vacuum system: (n\
cs$
1-7.进气系统gas admittance system: ;Lu|fQ#u*
\ :.p8`
2.真空系统特性参量 b8&9pLl
2-1.抽气装置的抽速volume flow rate of a pumping unit : dQ]j
r.
2-2.抽气装置的抽气量throughput of a pumping unit : 7Z_iQ1
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: O/Vue
2-4.真空系统的漏气速率leak throughput of a vacuum system: 3Daq5(fLP
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: ?$Pj[O^hl
2-6.极限压力ultimate pressure: 6%-2G@6d
2-7.残余压力residual pressure: Ai;Pht9qi
2-8.残余气体谱residual gas spectrum: R#>E{[9
2-9.基础压力base pressure: [aC(Ga}
2-10.工作压力working pressure: 1Jt%I'C?
2-11.粗抽时间roughing time: Alz#zBGb
2-12.抽气时间pump-down time: =[kv@p
2-13.真空系统时间常数time constant of a vacuum system: S5JnJkNn
2-14.真空系统进气时间venting time: zPe .
x/~M=][tN
3.真空容器 5|Qr"c$p
3-1.真空容器;真空室vacuum chamber: ]CjODa
3-2.封离真空装置sealed vacuum device: .kVga+la?
3-3.真空钟罩vacuum bell jar: A:f+x|[
3-4.真空容器底板vacuum base plate: ryN-d%t?
3-5.真空岐管vacuum manifold: UWHC]V?
3-6.前级真空容器(贮气罐)backing reservoir: |@RO&F
3-7.真空保护层outer chamber: bHCd|4e,2
3-8.真空闸室vacuum air lock: W3b\LnUa
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: 2r,fF<WQ
TR |; /yJ
4.真空封接和真空引入线 e(Verd:c
4-1.永久性真空封接permanent seal : #qWEyb2UZ
4.2.玻璃分级过渡封接graded seal : qF?S[Z;
4-3.压缩玻璃金属封接compression glass-to-metal seal: (_* a4xGF
4-4.匹配式玻璃金属封接matched glass-to-metal seal: dx^3(#B
4-5.陶瓷金属封接ceramic-to-metal seal: ;1KhUf;&F
4-6.半永久性真空封接semi-permanent seal : (w*$~p
4-7.可拆卸的真空封接demountable joint: ="`y<J P
4-8.液体真空封接liquid seal <FP-]R)
4-9.熔融金属真空封接molten metal seal: Po5}Vh
4-10.研磨面搭接封接ground and lapped seal: [kCn6\_<V
4-11.真空法兰连接vacuum flange connection: eMs`t)rQ
4-12.真空密封垫vacuum-tight gasket: 7?Fl [FW$
4-13.真空密封圈ring gasket: wgrYZ^]
4-14.真空平密封垫flat gasket: &>-Cz%IV
4-15.真空引入线feedthrough leadthrough: ?NL2|8
4-16.真空轴密封shaft seal: ,#crtX
4-17.真空窗vacuum window: =c|Bu^(Ctw
4-18.观察窗viewing window: HN:{rAIfc
gVGq
5.真空阀门 #\}hN~@F
5-1.真空阀门的特性characteristic of vacuum valves: 7cC$)
⑴.真空阀门的流导conductance of vacuum valves: -$7Jc=:>
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: ?F-,4Ox{/
5-2.真空调节阀regulating valve: |k8;[+
5-3.微调阀 micro-adjustable valve: '&"7(8E}
*
5-4.充气阀charge valve: og>f1NwS[
5-5.进气阀gas admittance valve: VAq:q8(K
5-6.真空截止阀break valve: oR+Fn}mG
5-7.前级真空阀backing valve: I0Vm^\8
5-8.旁通阀 by-pass valve: /fX]Yu
5-9.主真空阀main vacuum valve: @y,p-##e
5-10.低真空阀low vacuum valve: w(vf>L6(
5-11.高真空阀high vacuum valve: )T>a|.
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: bc+'n
5-13.手动阀manually operated valve: 4o%hH
5-14.气动阀pneumatically operated valve: 4EOu)#
5-15.电磁阀electromagnetically operated valve: b^ v.FK46G
5-16.电动阀valve with electrically motorized operation: F*a+&% Q
5-17.挡板阀baffle valve: *@O;IiSE
5-18.翻板阀flap valve: 4F'@yi^Gt
5-19.插板阀gate valve: '8dqJ`Gj
5-20.蝶阀butterfly valve: }%VHBkuc
7|{QAv
6.真空管路 f`?|A
6-1.粗抽管路roughing line: C}M0KDF
6-2.前级真空管路backing line: Fr3Q"(
6-3.旁通管路;By-Pass管路 by-pass line: m8FKr/Z-
6-4.抽气封口接头pumping stem: 2+|[e_
6-5.真空限流件limiting conductance: blLX ncyD
6-6.过滤器filter: W7.]V)$wM
5. 1.一般术语 $Q?UyEi
1-1真空镀膜vacuum coating: (j2]:BVu
1-2基片substrate: @.%ll n
1-3试验基片testing substrate: }@x0@sI9
1-4镀膜材料coating material: u!t'J+:
1-5蒸发材料evaporation material: ^D!UF(H
1-6溅射材料sputtering material: b6#V0bDXHD
1-7膜层材料(膜层材质)film material: J&lQ,T!?B
1-8蒸发速率evaporation rate: Jr#ptf"Wu
1-9溅射速率sputtering rate: grv 3aa@
1-10沉积速率deposition rate: Zu5`-[mw
1-11镀膜角度coating angle: UA{A G;
6Z7{|B5}Y
2.工艺 P}cGWfj
2-1真空蒸膜vacuum evaporation coating: gPDc6{/C<
(1).同时蒸发simultaneous evaporation: vRm;H|[%S
(2).蒸发场蒸发evaporation field evaporation: J.~$^-&!
(3).反应性真空蒸发reactive vacuum evaporation: @*F
NWT6
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: [IiwpC
(5).直接加热的蒸发direct heating evaporation: n`}vcVL;
(6).感应加热蒸发induced heating evaporation: si)920?E&
(7).电子束蒸发electron beam evaporation: 4SmhtC
(8).激光束蒸发laser beam evaporation: tM~R?9OaJ
(9).间接加热的蒸发indirect heating evaporation: qRTy}FU1
(10).闪蒸flash evaportion: ,b2Cl[
2-2真空溅射vacuum sputtering: EWbFy"=
(1).反应性真空溅射 reactive vacuum sputtering: 7v#sr<
(2).偏压溅射bias sputtering: EFV'hMjS)
(3).直流二级溅射direct current diode sputtering: !5pnl0D K*
(4).非对称性交流溅射asymmtric alternate current sputtering: eqYa`h@g^
(5).高频二极溅射high frequency diode sputtering: e3&R3{
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ij/ |~-!
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: F $B_;G
(8).离子束溅射ion beam sputtering: c}lUP(Ss
(9).辉光放电清洗glow discharge cleaning: 5_{C \S`T
2-3物理气相沉积PVD physical vapor deposition: 98G>I(Cw%
2-4化学气相沉积CVD chemical vapor deposition: |R DPx6!V
2-5磁控溅射magnetron sputtering: h8Kri}z; M
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: $GEY*uIOa
2-7空心阴极离子镀HCD hollow cathode discharge deposition: /qEoiL###
2-8电弧离子镀arc discharge deposition: Kh}#At^C8e
mm'Pe4*
3.专用部件 :,% vAI
3-1镀膜室coating chamber: e%SQ~n=H 9
3-2蒸发器装置evaporator device: eNpGa0 eG
3-3蒸发器evaporator: Ac|IBXGa=
3-4直接加热式蒸发器evaporator by direct heat: N
=)9O
3-5间接加热式蒸发器evaporator by indirect heat: P;{f+I|`
3-7溅射装置sputtering device: `q".P]wtKN
3-8靶target: g&) XaF[!
3-10时控挡板timing shutter: _|`S9Nms
3-11掩膜mask: i_Ab0vye
3-12基片支架substrate holder: >d&B:
3-13夹紧装置clamp: 0DV
.1
3-14换向装置reversing device: ;i@,TU
3-15基片加热装置substrate heating device: ilHZx2k
3-16基片冷却装置substrate colding device: txw:m*(%
]^$3S
4.真空镀膜设备 p~6/
4-1真空镀膜设备vacuum coating plant: iG^o@*}a
(1).真空蒸发镀膜设备vacuum evaporation coating plant: s,)Z8H
(2).真空溅射镀膜设备vacuum sputtering coating plant: Qk*`9
4-2连续镀膜设备continuous coating plant: 2r]80sWY
4-3半连续镀膜设备semi- continuous coating plant -J[*fv@
6. 1.漏孔 FIDV5Y/f
1-1漏孔leaks: tI ~.3+F
1-2通道漏孔channel leak: !8(:G6Ne
1-3薄膜漏孔membrane leak: uzr(gFd
1-4分子漏孔molecular leak: S=@.<gS
1-5粘滞漏孔vixcous leak: DY/xBwIF
1-6校准漏孔calibrated leak: ~7IXJeon
1-7标准漏孔reference leak : Q$^oIFb
1-8虚漏virtual leak: w9Bbvr6
1-9漏率leak rate: YzNSZJPD
1-10标准空气漏率standard air leak rate: ,4M7:=gf
1-11等值标准空气漏率equivalent standard air leak rate: XvETys@d
1-12探索(示漏)气体: '@i0~
B+:/!_
2.本底 p#go<Y#
2-1本底background: [T<nTB# w
2-2探索气体本底search gas background : E<]O,z;F
2-3漂移drift: e:D8.h+&}
2-4噪声noise: |WwC@3)
sxkWg>
3.检漏仪 yyB;'4Af
3-1检漏仪leak detector: P|*c7+q
3-2高频火花检漏仪H.F. spark leak detector: W;!OxOWZJ
3-3卤素检漏仪halide leak detector: N@6+DHt
3-4氦质谱检漏仪helium mass spectrometer leak detector: wyJ+~
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: G'<:O(Imu
z-ns@y(f@X
4.检漏 W<|
M0S{
4-1气泡检漏leak detection by bubbles: i[_B~/_
4-2氨检漏leak detection by ammonia: c_wvuKa
4-3升压检漏leak detection of rise pressure: 2t
7':X
4-4放射性同位素检漏radioactive isotope leak detection: ZEa31[@B[
4-5荧光检漏fluorescence leak detection
.Nt;J,U
7. 1.一般术语 >J(._K
1-1真空干燥vacuum drying: a8nqzuI
1-2冷冻干燥freeze drying : ~;$,h ET
1-3物料material: ;GQCq@)-
1-4待干燥物料material to be dried: *WMI<w~_
1-5干燥物料dried material : >V1vw7Pa
1-6湿气moisture;humidity: Hw29V //
1-7自由湿气free moisture: Jj%"
1-8结合湿气bound moisture: k6eh$*!
1-9分湿气partial moisture: r c++c,=
1-10含湿量moisture content: D]tI's1
1-11初始含湿量initial moisture content: `4IZ4sPi
1-12最终含湿量final residual moisture: +q*WY*gX
1-13湿度degree of moisture ,degree of humidity : vo(riHH
1-14干燥物质dry matter : =)b!M^=X-a
1-15干燥物质含量content of dry matter: !U::kr=t
'_ZiZ4O
2.干燥工艺 +%Z#!1u
2-1干燥阶段stages of drying :
NW]zMU{c
(1).预干燥preliminary dry: UA4="/
(2).一次干燥(广义)primary drying(in general): '`+8'3K~E
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): /tdRUX
(4).二次干燥secondary drying: ^k J>4
2-2.(1).接触干燥contact drying: 2`d KnaF|
(2).辐射干燥 drying by radiation : fM/~k>wl
(3).微波干燥microwave drying: Q Uy7Q$W
(4).气相干燥vapor phase drying: G]v BI=
(5).静态干燥static drying: ?kM2/a"{G
(6).动态干燥dynamic drying: ^=Dz)95c
2-3干燥时间drying time: Phq"A[4=O
2-4停留时间length of stay(in the drying chamber): f/PqkHF
2-5循环时间cycle time: je;C}4
2-6干燥率 dessication ratio : H~$*R7~
2-7去湿速率mass flow rate of humidity: M"\Iw'5$
2-8单位面积去湿速率mass flow rate of humidity per surface area: XgI;2Be+&a
2-9干燥速度 drying speed : -kk0zg
&|i
2-10干燥过程drying process: JIc(hRf9>
2-11加热温度heating temperature: t7-6A
2-12干燥温度temperature of the material being dried : P+L#p(K
2-13干燥损失loss of material during the drying process : B@j2^Dr~!
2-14飞尘lift off (particles): NoOrQ m
2-15堆层厚度thickness of the material: gWD46+A){
T{So2@_&
3.冷冻干燥 *$]50 \W
3-1冷冻freezing: v?Zo5uVoq
(1).静态冷冻static freezing: &K*Kr=9N
(2).动态冷冻dynamic freezing: v\lKY*@f
(3).离心冷冻centrifugal freezing: Y(RB@+67
(4).滚动冷冻shell freezing: 9ls*L!Jw
(5).旋转冷冻spin-freezing: ??#SQSU
(6).真空旋转冷冻vacuum spin-freezing: RNo~}#
(7).喷雾冷冻spray freezing: sTS/]"l
(8).气流冷冻air blast freezing: M ]Hf>7p
3-2冷冻速率rate of freezing: 6e>P!bo
3-3冷冻物料frozen material: !aB~G}'
3-4冰核ice core: i@`qam
3-5干燥物料外壳envelope of dried matter: 2#(dfEAy
3-6升华表面sublimation front: vw6>eT
3-7融化位置freezer burn: +!Q*ie+q
,!H`@Kl
4.真空干燥设备;真空冷冻干燥设备 BgT(~8'
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: [*J?TNk
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: SM8f"H28
4-3加热表面heating surface: + )n}n5
4-4物品装载面shelf : !bIE%cq
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 704_ehrlE
4-6单位面积干燥器处理能力throughput per shelf area: <Nk:C1Op}
4-7冰冷凝器ice condenser: Wl7S<>hg4
4-8冰冷凝器的负载load of the ice condenser: .ah[!O
4-9冰冷凝器的额定负载rated load of the ice condenser ]D&U}n
8. 1.一般术语 &+0?Xip{Z
1-1试样sample : e3mFO+
(1).表面层surface layer: #-i#mbZ e
(2).真实表面true surface: 6p9 {z42
(3).有效表面积effective surface area: ]!]B7|JFJ
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: LJ6L#es2
(5).表面粒子密度surface particle density: _T_6Yl&cf)
(6).单分子层monolayer: a!EW[|[Q
(7).表面单分子层粒子密度monolayer density: F`La_]f?b\
(8).覆盖系数coverage ratio: \.'[!GE *c
1-2激发excitation: p, T4BO
(1).一次粒子primary particle: naM~>N
(2).一次粒子通量primary particle flux: Wecxx^vtv6
(3).一次粒子通量密度density of primary particle flux: _pmo
6O
(4).一次粒子负荷primary particle load: R.?PD$;_M
(5).一次粒子积分负荷integral load of primary particle: |/ji'Bh
(6).一次粒子的入射能量energy of the incident primary particle: )HcLpoEi
(7).激发体积excited volume: cm0$v8
(8).激发面积excited area: p~NHf\
(9).激发深度excited death: )PkW,214#
(10).二次粒子secondary particles: LJ6l3)tpD
(11).二次粒子通量secondary particle flux: {1_<\~J
(12).二次粒子发射能energy of the emitted secondary particles: xYZ,.
(13).发射体积emitting volume: s(?%A
(14).发射面积emitting area: (xE |T f
(15).发射深度emitting depth: .Cf!5[0E
(16).信息深度information depth: ]9PG"<^k
(17).平均信息深度mean information depth: $o0.oY#
1-3入射角angle of incidence: yh/JHo;
1-4发射角angle of emission: O c.fvP^ZD
1-5观测角observation: r\cY R}v
1-6分析表面积analyzed surface area: {\vVzy,t7
1-7产额 yield : x4/{XRQ
1-8表面层微小损伤分析minimum damage surface analysis: E%(s=YhW
1-9表面层无损伤分析non-destructive surface analysis: 3 yw$<lm
1-10断面深度分析 profile analysis in depth; depth profile analysis : QT5pn5+ z
1-11可观测面积observable area: UCXRF
1-12可观测立体角observable solid angle : r{B28'f[
1-13接受立体角;观测立体角angle of acceptance: WNZYs
1-14角分辨能力angular resolving power: N:CQ$7T{ j
1-15发光度luminosity: vaJl}^T
1-16二次粒子探测比detection ratio of secondary particles: l p(D@FT
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: BY&{fWUo
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ][b|^V
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: GXIzAB(
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: }n
"5r(*^@
1-21本底压力base pressure: h@Jg9AM
1-22工作压力working pressure: :b*7TJ\grN
q7<d|s
2.分析方法 Hq+QsplG
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: e&2,cQRFV
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : &AOGg\
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: }6BXa
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 1r};cY6
2-3离子散射表面分析ion scattering spectroscopy: / Y od
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: j
RcE241
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: (~%NRH<\
2-6离子散射谱仪ion scattering spectrometer: gL-kI*Ra
2-7俄歇效应Auger process: <i4]qO(0u
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: qH5nw}]
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: 0j;ZPqEf3
2-10光电子谱术photoelectron spectroscopy : ;HH%OfQq
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: (9oo8&GG
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 4# PxJG6m
2-11光电子谱仪photoelectron spectrometer: s9a`2Wm
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: m [^)Q9o}
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: Zs{7km
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): BC/5 bA
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus