“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 jH4,-
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真空术语 oxs0)B
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1.标准环境条件 standard ambient condition: P^wDt14>
2.气体的标准状态 standard reference conditions forgases: ~,*=j~#h
3.压力(压强)p pressure: >I9w|zFA
4.帕斯卡Pa pascal: 2j9+ f{ l
5.托Torr torr: XZ|%9#6
6.标准大气压atm standard atmosphere: 4pYscB
7.毫巴mbar millibar: .(RX;.lw
8.分压力 partial pressure: vlygS(Y_7
9.全压力 total pressure: B+8lp4V9%
10.真空 vacuum: B) 5QI
11.真空度 degree of vacuum: OoG Nij
12.真空区域 ranges of vacuum: "@P)
13.气体 gas: xI'sprNa_1
14.非可凝气体 non-condensable gas: |a>W9Y m
15.蒸汽vapor: )~u<u:N
16.饱和蒸汽压saturation vapor pressure: _4Ciai2Ql
17.饱和度degree of saturation: W8@o7svrh
18.饱和蒸汽saturated vapor: %%7~<=rk
19.未饱和蒸汽unsaturated vapor: _LYI#D
20.分子数密度n,m-3 number density of molecules: VL[}
21.平均自由程ι、λ,m mean free path: &jbZL5
22.碰撞率ψ collision rate: h(<2{%j
23.体积碰撞率χ volume collision rate: WbIf)\
24.气体量G quantity of gas: V|vKYEFry
25.气体的扩散 diffusion of gas: +*'^T)sj/
26.扩散系数D diffusion coefficient; diffusivity: q_J)68B R
27.粘滞流 viscous flow: sI&|qK-(
28.粘滞系数η viscous factor: AW6 "1(D
29.泊肖叶流 poiseuille flow: 3Z taj^v
30.中间流 intermediate flow: IP#?$X
31.分子流 molecular flow: "8BZj;yS
32克努曾数 number of knudsen: "DpgX8lG_
33.分子泻流 molecular effusion; effusive flow: [ST,/<?0
34.流逸 transpiration: w~}*MsB
35.热流逸 thermal transpiration: `dGcjLsIz
36.分子流率qN molecular flow rate; molecular flux: =IIB~h[TB
37.分子流率密度 molecular flow rate density; density of molecular flux: =
Ff 2
38.质量流率qm mass flow rare: eeix-Wt*E
39.流量qG throughput of gas: oP%'8%tk
40.体积流率qV volume flow rate: ZLN79r{T
41.摩尔流率qυ molar flow rate: (E*pM$
42.麦克斯韦速度分布 maxwellian velocity distribution: t,v=~LE
43.传输几率Pc transmission probability: UtpK"U$XOU
44.分子流导CN,UN molecular conductance: `P(Otr[6
45.流导C,U conductance: GIs
*;ps7w
46.固有流导Ci,Ui intrinsic conductance: DJ]GM|?
47.流阻W resistance: '1f:8
48.吸附 sorption: n0T>sE-9
49.表面吸附 adsorption: RaX:&PE
50.物理吸附physisorption: /XeCJxo8
51.化学吸附 chemisorption: u/,ng&!
52.吸收absorption: ^! r<-J
53.适应系数α accommodation factor: K+F]a]kld
54.入射率υ impingement rate: "QV?C
55.凝结率condensation rate: $Fr>'H+i
56.粘着率 sticking rate: 5Mb5t;4b
57.粘着几率Ps sticking probability: Vs:x3)m5j
58.滞留时间τ residence time: UpoTXAD}k
59.迁移 migration: c]OK)i-{l
60.解吸 desorption: ]K^#'[
61.去气 degassing: f:!b0j
62.放气 outgassing: B=,j$uH
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: C5ia9LpRX
64.蒸发率 evaporation rate: #]MV
65.渗透 permeation: X1N*}@:/
66.渗透率φ permeability: w~lxWgaY7
67.渗透系数P permeability coefficient \-2O&v'}
2. 1.真空泵 vacuum pumps 1P
'_EJ]M
1-1.容积真空泵 positive displacement pump: Q=}U
⑴.气镇真空泵 gas ballast vacuum pump: `;\<Fr
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: `yXJaTbo
⑶.干封真空泵 dry-sealed vacuum pump: vf&Sk`
⑷.往复真空泵 piston vacuum pump: Mu>WS)1lS
⑸.液环真空泵 liquid ring vacuum pump: l`M7a9*U
⑹.旋片真空泵 sliding vane rotary vacuum pump: j3kcNb
⑺.定片真空泵 rotary piston vacuum pump: \ld{Z;e
⑻.滑阀真空泵 rotary plunger vacuum pump: A2xfNY<
⑼.余摆线真空泵 trochoidal vacuum pump: >oOZDuj
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: K[G=J
⑾.罗茨真空泵 roots vacuum pump: U 5f<4I
1-2.动量传输泵 kinetic vacuum pump: &i8UPp%
⑴.牵引分子泵molecular drag pump: c1CUG1i
⑵.涡轮分子泵turbo molecular pump: O>~ozW&
⑶.喷射真空泵ejector vacuum pump: k>aWI
⑷.液体喷射真空泵liquid jet vacuum pump: C EMe2~
⑸.气体喷射真空泵gas jet vacuum pump: 9-6E(D-ux
⑹.蒸汽喷射真空泵vapor jet vacuum pump : ZR"BxE0_k
⑺.扩散泵diffusion pump : ML= :&M!ao
⑻.自净化扩散泵self purifying diffusion pump: oDvE0"Sz
⑼.分馏扩散泵 fractionating diffusion pump : 9yA? 82)E
⑽.扩散喷射泵diffusion ejector pump : Y{v\m(D
⑾.离子传输泵ion transfer pump: lA1l
1-3.捕集真空泵 entrapment vacuum pump: ex}6(;7)O
⑴吸附泵adsorption pump: Oj`I=O6
⑵.吸气剂泵 getter pump: ^CtA@4
⑶.升华(蒸发)泵 sublimation (evaporation)pump : uz8Y)b
⑷.吸气剂离子泵getter ion pump: ]>%M%B
⑸.蒸发离子泵 evaporation ion pump: g5,Bj
⑹.溅射离子泵sputter ion pump: 5kju{2`GF
⑺.低温泵cryopump: due'c!wW
=Kh1HU.F
2.真空泵零部件 54geU?p0
2-1.泵壳 pump case: MRn;D|Q
2-2.入口 inlet: ~Y3"vdd
2-3.出口outlet: ? 016
2-4.旋片(滑片、滑阀)vane; blade : D$W09ng-
2-5.排气阀discharge valve: 2TxHY|4
2-6.气镇阀gas ballast valve: pndAXO:v
2-7.膨胀室expansion chamber: 41'|~3\X
2-8.压缩室compression chamber: q=+AN</
2-9.真空泵油 vacuum pump oil: x+V@f~2F
2-10.泵液 pump fluid: X$4MpXx
2-11.喷嘴 nozzle: DGY?4r7>y
2-13.喷嘴扩张率nozzle expansion rate: c&rS7%
2-14.喷嘴间隙面积 nozzle clearance area : hDsSOpj
2-15.喷嘴间隙nozzle clearance: LaolAqU
2-16.射流jet: <Jwx|
2-17.扩散器diffuser: `r$c53|<u
2-18.扩散器喉部diffuser thoat: +LEU|#
2-19.蒸汽导管vapor tube(pipe;chimney): dRXEF6G
2-20.喷嘴组件nozzle assembly: y~ZYI]`
J
2-21.下裙skirt: aVXk8zuL
4{Q{>S*h
3.附件 |_ u
3-1阱trap: FO/[7ZH
⑴.冷阱 cold trap: s;[OR
⑵.吸附阱sorption trap: y {PUklq
⑶.离子阱ion trap: 2U
Q&n` A
⑷.冷冻升华阱 cryosublimation trap: <RFT W}f!
3-2.挡板baffle: aGRD`ra
3-3.油分离器oil separator: 6k@(7Mw8A
3-4.油净化器oil purifier: #@cOyxUt
3-5.冷凝器condenser: hfBZ:es+
$ZEwz;HNo
4.泵按工作分类 {"x>ewAf
4-1.主泵main pump: rbEUq.Yk]~
4-2.粗抽泵roughing vacuum pump: /l)|B
4-3.前级真空泵backing vacuum pump: !eH9LRp
4-4.粗(低)真空泵 roughing(low)vacuum pump: ~g_]Sskf7
4-5.维持真空泵holding vacuum pump: (>
{CwtH][
4-6.高真空泵high vacuum pump: #,4CeD|(D,
4-7.超高真空泵ultra-high vacuum pump: F}C.F
4-8.增压真空泵booster vacuum pump: 2VgDM6h
X4bB
5.真空泵特性
8FmRD
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 6_.K9;Gd
5-2.真空泵的抽气量Q throughput of vacuum pump:。 S.#IC
lV
5-3.起动压力starting pressure: `]q>A']Dl
5-4.前级压力 backing pressure : UDUj
5-5.临界前级压力 critical backing pressure: 6hvmp
5-6.最大前级压力maximum backing pressure: 6*({ZE
5-7.最大工作压力maximum working pressure: Y4 <
5-8.真空泵的极限压力ultimate pressure of a pump: I5$@1+B
5-9.压缩比compression ratio: :{YOJDtR
5-10.何氏系数Ho coefficient: ;<9 dND
5-11.抽速系数speed factor: =%\y E0#
5-12.气体的反扩散back-diffusion of gas: >>nt3q
5-13.泵液返流back-streaming of pump fluid: sr*3uI-)L
5-14.返流率back-streaming rate '0juZ~>}
5-15.返迁移back-migration: 4 )U,A~!
5-16.爆腾bumping: r z
5-17.水蒸气允许量qm water vapor tolerable load: !|1GraiS
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: k^vsQ'TD
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: iLyJ7zby
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump iO 9fg
3. 1.一般术语 <1L?Xhoc6
1-1.压力计pressure gauge: aUBGp: (
1-2.真空计vacuum gauge: *u|bmt
⑴.规头(规管)gauge head: 9~En;e
⑵.裸规nude gauge : .YT&V
⑶.真空计控制单元gauge control unit : Rpi@^~aPE
⑷.真空计指示单元gauge indicating unit : zh<[/'l
sUki|lP
2.真空计一般分类 b\dzB\,&
2-1.压差式真空计differential vacuum gauge: *&m{)cTs
2-2.绝对真空计 absolute vacuum gauge: )<vU F]e~
2-3.全压真空计total pressure vacuum gauge: @
z{E
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: b&i0)/;
2-5.相对真空计relative vacuum gauge : 0rjH`H]M
6;:s N8M+1
3.真空计特性 $GR 3tLzK:
3-1.真空计测量范围pressure range of vacuum gauge: $jL{l8x
3-2.灵敏度系数sensitivity coefficient: 4Hk eXS.
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): xP3v65Q1
3-5.规管光电流photon current of vacuum gauge head: O=9mLI6
3-6.等效氮压力equivalent nitrogen pressure : !D_Qat
3-7.X射线极限值 X-ray limit: -j6&W`
3-8.逆X射线效应anti X-ray effect: _9^
3-9.布利尔斯效应blears effect: lhyWlO
C`uZr k/
4.全压真空计 {NS6y \,
4-1.液位压力计liquid level manometer: RwG@C|sG
4-2.弹性元件真空计elastic element vacuum gauge: AaVj^iy/X
4-3.压缩式真空计compression gauge: EEU)eltI
4-4.压力天平pressure balance: ?3x7_=4t@
4-5.粘滞性真空计viscosity gauge : I1IuvH6
4-6.热传导真空计thermal conductivity vacuum gauge : U|Du9_0
4-7.热分子真空计thermo-molecular gauge: ~BSIp
.
4-8.电离真空计ionization vacuum gauge: z^KMYvH
g
4-9.放射性电离真空计radioactive ionization gauge: [+q':T1W-
4-10.冷阴极电离真空计cold cathode ionization gauge: d^0vaX6e}
4-11.潘宁真空计penning gauge: -UHa;WH
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: ;{zgp
4-13.放电管指示器discharge tube indicator: B``)
4-14.热阴极电离真空计hot cathode ionization gauge: Vm_waa
4-15.三极管式真空计triode gauge: E*uz|w3S)Y
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: !c;Z<@
4-17.B-A型电离真空计Bayard-Alpert gauge: K%+[2Hj2
4-18.调制型电离真空计modulator gauge:
<|Pw*L$
4-19.抑制型电离真空计suppressor gauge: kb27$4mm
4-20.分离型电离真空计extractor gauge: )YP"\E
4-21.弯注型电离真空计bent beam gauge: zNu>25/)(
4-22.弹道型电离真空计 orbitron gauge : GkhaB(btk'
4-23.热阴极磁控管真空计hot cathode magnetron gauge: vy
<(1\
JD Q7
5.分压真空计(分压分析器) lji&]^1
5-1.射频质谱仪radio frequency mass spectrometer: ) r8yt}
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: W'>"E/Tx#O
5-3.单极质谱仪momopole mass spectrometer: Z'vic#
5-4.双聚焦质谱仪double focusing mass spectrometer: {hS9FdWA;
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: !`3q9RT3."
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: cTU%=/gbc<
5-7.回旋质谱仪omegatron mass spectrometer: rv75R}.6R^
5-8.飞行时间质谱仪time of flight mass spectrometer: ;^Q- 1
j~|pSu.<
6.真空计校准 P6n9yJ$,cb
6-1.标准真空计reference gauges: z
qM:'x*
6-2.校准系统system of calibration: w?r
6-3.校准系数K calibration coefficient: 'zEmg}
6-4.压缩计法meleod gauge method: KA=cIm
6-5.膨胀法expansion method: deRnP$u0
6-6.流导法flow method: $jpAnZR- /
4. 1.真空系统vacuum system W?`%it5
1-1.真空机组pump system: lK}W%hzU
1-2.有油真空机组pump system used oil : TqvgCk-
1-3.无油真空机组oil free pump system 0|RFsJ"
1-4.连续处理真空设备continuous treatment vacuum plant: |#y+iXTJ
1-5.闸门式真空系统vacuum system with an air-lock: +"u6+[E
1-6.压差真空系统differentially pumped vacuum system: ?89K
[D|
1-7.进气系统gas admittance system: @v#]+9F
Pjs
L{,
2.真空系统特性参量 7a,/DI2o
2-1.抽气装置的抽速volume flow rate of a pumping unit : u%o2BLx
2-2.抽气装置的抽气量throughput of a pumping unit : lURL;h
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: =i`#0i2(
2-4.真空系统的漏气速率leak throughput of a vacuum system: \:'|4D]'I
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: )IFzal}o
2-6.极限压力ultimate pressure: 4Ou|4WjnL
2-7.残余压力residual pressure: Z=L~W,0'
2-8.残余气体谱residual gas spectrum: sX8?U,u
2-9.基础压力base pressure: U_X /
2-10.工作压力working pressure: @@?P\jv~
2-11.粗抽时间roughing time: G2
2-12.抽气时间pump-down time: (jV_L1D
2-13.真空系统时间常数time constant of a vacuum system: uxxS."~
2-14.真空系统进气时间venting time: rZ|!y ~S|
)kBN]>&R
3.真空容器 l"C)Ia&/
3-1.真空容器;真空室vacuum chamber: VGHy|5K$
3-2.封离真空装置sealed vacuum device: A6 D@#(D
3-3.真空钟罩vacuum bell jar: /^m3?q[a
3-4.真空容器底板vacuum base plate: YH:murJMZ
3-5.真空岐管vacuum manifold: 'Q^P#<<
3-6.前级真空容器(贮气罐)backing reservoir: i*T>,z
3-7.真空保护层outer chamber: )[w_LHKI
3-8.真空闸室vacuum air lock: K}r@O"6*\
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: g[#4`Q<.
I^CKq?V?:
4.真空封接和真空引入线 rA"><pH
4-1.永久性真空封接permanent seal : B. J_(V+
4.2.玻璃分级过渡封接graded seal : =:4vRq
[
4-3.压缩玻璃金属封接compression glass-to-metal seal: #dd-rooQuD
4-4.匹配式玻璃金属封接matched glass-to-metal seal: ZRK1UpP
4-5.陶瓷金属封接ceramic-to-metal seal: KMhEU**
4-6.半永久性真空封接semi-permanent seal : cAL*Md8+
4-7.可拆卸的真空封接demountable joint: 5Tb3Yy< .
4-8.液体真空封接liquid seal 9b8kRz[ c
4-9.熔融金属真空封接molten metal seal: ]+OHxCj:
4-10.研磨面搭接封接ground and lapped seal: snl$v
4-11.真空法兰连接vacuum flange connection:
Uu<Tn#nb
4-12.真空密封垫vacuum-tight gasket: o#X=1us
4-13.真空密封圈ring gasket: $69ef[b
4-14.真空平密封垫flat gasket: jRCf!RO
4-15.真空引入线feedthrough leadthrough: |x
Nd^
4-16.真空轴密封shaft seal: ThvVLK
4-17.真空窗vacuum window: aDae0$lc.S
4-18.观察窗viewing window: ,.g9HO/R1
9rCvnP=
5.真空阀门 .3tyNjsn\
5-1.真空阀门的特性characteristic of vacuum valves: G;'=#c
^
⑴.真空阀门的流导conductance of vacuum valves: -f4>4@y
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: +FYQ7UE
5-2.真空调节阀regulating valve: !6d6b@Mv
5-3.微调阀 micro-adjustable valve: " iKX-VIl
5-4.充气阀charge valve: x'uxSeH$
5-5.进气阀gas admittance valve: w`77E=
5-6.真空截止阀break valve: #Q6.r.3@x
5-7.前级真空阀backing valve: #wvmVB. 5~
5-8.旁通阀 by-pass valve: ](z?zDk
5-9.主真空阀main vacuum valve: iJr 1w&GL$
5-10.低真空阀low vacuum valve: ?eU=xO
5-11.高真空阀high vacuum valve: h/AL`$
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: v4YY6?4
5-13.手动阀manually operated valve: bM9:h
5-14.气动阀pneumatically operated valve: 2&k5X-Y
5-15.电磁阀electromagnetically operated valve: fG^#G/n2
5-16.电动阀valve with electrically motorized operation: Y(`# J[
5-17.挡板阀baffle valve: Z6`oGFq
5-18.翻板阀flap valve: =>_k ;x
5-19.插板阀gate valve: RjOQSy3
5-20.蝶阀butterfly valve: 1l~(J:DT
c'678!r9 P
6.真空管路 og! d
6-1.粗抽管路roughing line: hZudVBn
6-2.前级真空管路backing line: 0D\b;ju<
6-3.旁通管路;By-Pass管路 by-pass line: TsX(=N_
6-4.抽气封口接头pumping stem: XQH
wu
6-5.真空限流件limiting conductance: D+y_&+&,t
6-6.过滤器filter: !GNLq.rQ
5. 1.一般术语 !aVwmd'9
1-1真空镀膜vacuum coating: @`hnp:
1-2基片substrate: `2j \(N,
1-3试验基片testing substrate: X5M{No>z
1-4镀膜材料coating material: *>ilT5q
1-5蒸发材料evaporation material: ?;//%c8,.
1-6溅射材料sputtering material: @t;WdbxB%
1-7膜层材料(膜层材质)film material: Dn}Wsd=
1-8蒸发速率evaporation rate: e2onR~Cf
1-9溅射速率sputtering rate: S!/N
lSr<
1-10沉积速率deposition rate: 77:s=)
1-11镀膜角度coating angle: nhUL{ER
oQkY@)3.w
2.工艺 F$;vPAxbK"
2-1真空蒸膜vacuum evaporation coating: 1 o;*`
(1).同时蒸发simultaneous evaporation: @rTAbEk{U
(2).蒸发场蒸发evaporation field evaporation: ]{[8$|Mg
(3).反应性真空蒸发reactive vacuum evaporation: 0>E0}AvkT
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: Ww
}qK|D
(5).直接加热的蒸发direct heating evaporation: h,D6MP
(6).感应加热蒸发induced heating evaporation: s`bC?wr5h
(7).电子束蒸发electron beam evaporation: xyoh
B#'W
(8).激光束蒸发laser beam evaporation: [~
Wiy3n
(9).间接加热的蒸发indirect heating evaporation: [\j@_YYd
(10).闪蒸flash evaportion: &SzLEbU!
2-2真空溅射vacuum sputtering: T%Vg0Y)P;
(1).反应性真空溅射 reactive vacuum sputtering: wR"4slY_%
(2).偏压溅射bias sputtering: |?t6h 5Mt"
(3).直流二级溅射direct current diode sputtering: wc-ll&0Z
(4).非对称性交流溅射asymmtric alternate current sputtering: /!r#=enG7
(5).高频二极溅射high frequency diode sputtering: 0'DlsC/`*
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: Qe~2'Hw#9
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: W[dMf!(
(8).离子束溅射ion beam sputtering: Dm3/i|Y
(9).辉光放电清洗glow discharge cleaning: is3nLm(
2-3物理气相沉积PVD physical vapor deposition: e<wRA["
2-4化学气相沉积CVD chemical vapor deposition: %7_c|G1
2-5磁控溅射magnetron sputtering: NjTVinz
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: "dKYJ&$
2-7空心阴极离子镀HCD hollow cathode discharge deposition: .
k6)
2-8电弧离子镀arc discharge deposition: )P{I<TBI;
UL/|!(s
3.专用部件 yqg&dq
3-1镀膜室coating chamber: HzO6hb{jJO
3-2蒸发器装置evaporator device: =,aWO7Pz
3-3蒸发器evaporator: [n`SXBi+n
3-4直接加热式蒸发器evaporator by direct heat: 5 i1T?
3-5间接加热式蒸发器evaporator by indirect heat: h=q%h8
3-7溅射装置sputtering device: U`j[Ni}"
3-8靶target: IH$R XGL
3-10时控挡板timing shutter: 3X+uJb2
3-11掩膜mask: !lSxBr[dQ
3-12基片支架substrate holder: ;|2h&8yX(/
3-13夹紧装置clamp: 2u[:3K-@,
3-14换向装置reversing device: nP9@yI*7
3-15基片加热装置substrate heating device: mGQgy[gX
3-16基片冷却装置substrate colding device: gyW*-:C
@-z#vJ5Qe{
4.真空镀膜设备 M y:9
4-1真空镀膜设备vacuum coating plant: N*PF&MyB
(1).真空蒸发镀膜设备vacuum evaporation coating plant: imx/hz!
(2).真空溅射镀膜设备vacuum sputtering coating plant: XUD/\MoV
4-2连续镀膜设备continuous coating plant: )e)@_0
4-3半连续镀膜设备semi- continuous coating plant /`iBv8!
6. 1.漏孔 mx#H+:}&r
1-1漏孔leaks: ,w.`(?I/
1-2通道漏孔channel leak: h(,SAY_
1-3薄膜漏孔membrane leak: Ozk^B{{o
1-4分子漏孔molecular leak: Yx_[vLm
1-5粘滞漏孔vixcous leak: q8:Z.<%8
1-6校准漏孔calibrated leak: PmtBu`OkV
1-7标准漏孔reference leak : UarU.~Uqi
1-8虚漏virtual leak: }2Lh'0 xY
1-9漏率leak rate: XpzdvR1
1-10标准空气漏率standard air leak rate: bQ-5uFe~$B
1-11等值标准空气漏率equivalent standard air leak rate: 5Wj+ey^^w
1-12探索(示漏)气体: PN{l)&K2.
oZO6J-ea
2.本底 28[dTsd%
2-1本底background: ]JX0:'x^
2-2探索气体本底search gas background : ?Z @FxW
2-3漂移drift: {~yj]+Im
2-4噪声noise: QdKxuG
z_#B 4
3.检漏仪 EXDtVa Ot
3-1检漏仪leak detector: "(}xIsy
3-2高频火花检漏仪H.F. spark leak detector: ZdEeY|j
3-3卤素检漏仪halide leak detector: 0s = h*"[
3-4氦质谱检漏仪helium mass spectrometer leak detector: XD`QU m
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: 0lNVQxG
U,C
L*qTF
4.检漏 ?)#dP8n
4-1气泡检漏leak detection by bubbles: P>=~\v nN#
4-2氨检漏leak detection by ammonia: [L1pDICoy
4-3升压检漏leak detection of rise pressure: pmyHto"
4-4放射性同位素检漏radioactive isotope leak detection: Q5e ,[1
4-5荧光检漏fluorescence leak detection T0W B
7. 1.一般术语 )5lo^Qb
1-1真空干燥vacuum drying: l=5(5\
1-2冷冻干燥freeze drying : w:Fi
2aJ
1-3物料material: tRYMK+
1-4待干燥物料material to be dried: &0Zn21q
1-5干燥物料dried material : ~V?O%1)k?\
1-6湿气moisture;humidity: Q3#-q>;7
1-7自由湿气free moisture: W|@EK E.k
1-8结合湿气bound moisture: 4-[L^1%S[
1-9分湿气partial moisture: KO(+%>^R
1-10含湿量moisture content: QP|Ou*Qm)
1-11初始含湿量initial moisture content: chsjY]b
1-12最终含湿量final residual moisture: irCS}Dbw
1-13湿度degree of moisture ,degree of humidity : v'B++-%
1-14干燥物质dry matter : SN|EWe^
1-15干燥物质含量content of dry matter: ll{jE
.-+_>br~
2.干燥工艺 |XxA Fje
2-1干燥阶段stages of drying : cb l@V 1
(1).预干燥preliminary dry: Q44Pg$jp
(2).一次干燥(广义)primary drying(in general): 80cBLGG
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): ~oI7TP
(4).二次干燥secondary drying: < vU<:S
2-2.(1).接触干燥contact drying: ^ Sx0t
(2).辐射干燥 drying by radiation : 4EzmH)4G
(3).微波干燥microwave drying: D;)Tm|XizW
(4).气相干燥vapor phase drying: JwbC3t):@
(5).静态干燥static drying: s
bd;Kn
(6).动态干燥dynamic drying: w4pU^&O
2-3干燥时间drying time: ,v:m
2-4停留时间length of stay(in the drying chamber): .MuS"R{y
2-5循环时间cycle time: <3z]d?u
2-6干燥率 dessication ratio : bL
(g$Yi
2-7去湿速率mass flow rate of humidity: !8vHN=)z
2-8单位面积去湿速率mass flow rate of humidity per surface area: +ex@[grsGT
2-9干燥速度 drying speed : ^8aj\xe(
2-10干燥过程drying process: tfj6#{M5
2-11加热温度heating temperature: 8qn1?Lb
2-12干燥温度temperature of the material being dried : !v^D}P 3Y
2-13干燥损失loss of material during the drying process : 9 )u*IGj
2-14飞尘lift off (particles): JpE4 o2
2-15堆层厚度thickness of the material: `@ULG>
jdQ`Y+BC
3.冷冻干燥 zu<b#W v
3-1冷冻freezing: 4)+MvKxjS
(1).静态冷冻static freezing: X>2_Gol!
(2).动态冷冻dynamic freezing: (E59)z -
(3).离心冷冻centrifugal freezing: < i*v
(4).滚动冷冻shell freezing: r#*kx# "
(5).旋转冷冻spin-freezing: xRW~xr2h@
(6).真空旋转冷冻vacuum spin-freezing: 33|>u+
(7).喷雾冷冻spray freezing: /K2VSj3\
(8).气流冷冻air blast freezing: M~w
=ZJ@
3-2冷冻速率rate of freezing: 2}>jq8Y47
3-3冷冻物料frozen material: z`((l#(
3-4冰核ice core: t>f<4~%MJ
3-5干燥物料外壳envelope of dried matter: <Bb$d@c
3-6升华表面sublimation front: V0z.w:-
3-7融化位置freezer burn: !HL7a]PB
;rJR+wpNa
4.真空干燥设备;真空冷冻干燥设备 fLL_{o0T
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: \%=\_"^?
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: MPA<?
4-3加热表面heating surface: Ek(.
["
4-4物品装载面shelf : _KC)f'Cx
4-5干燥器的处理能力throughput (of the vacuum drying chamber): qI\qpWS\
4-6单位面积干燥器处理能力throughput per shelf area: Z+)R%Z'aL
4-7冰冷凝器ice condenser: %)8`(9J*
4-8冰冷凝器的负载load of the ice condenser: d*Dq=.F(
4-9冰冷凝器的额定负载rated load of the ice condenser 7kO5hlKeo
8. 1.一般术语 +I#4+0f
1-1试样sample : X0J@c "%0
(1).表面层surface layer: @26H;
(2).真实表面true surface: 7g_:Gv~v
(3).有效表面积effective surface area: &Eg>[gAIlp
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: JLm0[1Lzd
(5).表面粒子密度surface particle density: H7?C>+ay
(6).单分子层monolayer: 1.!rq,+>1
(7).表面单分子层粒子密度monolayer density: S9}P5;u
(8).覆盖系数coverage ratio: P!:Y<p{=>
1-2激发excitation: GM|gm-t<@
(1).一次粒子primary particle: |Y|{9Osus
(2).一次粒子通量primary particle flux: RS!~5nk5
(3).一次粒子通量密度density of primary particle flux: AJ` b-$Q
(4).一次粒子负荷primary particle load: lb5Y$ZC
(5).一次粒子积分负荷integral load of primary particle: D`0II=
(6).一次粒子的入射能量energy of the incident primary particle: Um]>B`."wK
(7).激发体积excited volume: a h>k=t8(
(8).激发面积excited area: G*2bYsnhX
(9).激发深度excited death: E8J`7sa
(10).二次粒子secondary particles: +"6_rbeuO
(11).二次粒子通量secondary particle flux: /Z HuT=j1
(12).二次粒子发射能energy of the emitted secondary particles: A>(m}P
(13).发射体积emitting volume: 7)S`AQ2:)
(14).发射面积emitting area: d$8rzd
(15).发射深度emitting depth: &^FCp'J-
(16).信息深度information depth: !/ TeTmo
(17).平均信息深度mean information depth: j!GJ$yd=-6
1-3入射角angle of incidence: hc2[,Hju{O
1-4发射角angle of emission: YW9 [^
1-5观测角observation: eG9tn{
1-6分析表面积analyzed surface area: Q]Q i
1-7产额 yield : Y*;Z(W.V#
1-8表面层微小损伤分析minimum damage surface analysis: BRYhL|d~.
1-9表面层无损伤分析non-destructive surface analysis: #P=rP=
1-10断面深度分析 profile analysis in depth; depth profile analysis : <iunDL0
1-11可观测面积observable area: "pdmz+k8S
1-12可观测立体角observable solid angle : ?Z
{4iF
1-13接受立体角;观测立体角angle of acceptance: $r *7)/
1-14角分辨能力angular resolving power: cOcF VPQ
1-15发光度luminosity: ;0O3b
1-16二次粒子探测比detection ratio of secondary particles: dX{|-;6vm
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: 8<t6_* f
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: xK 9"t;!C&
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: )a.Y$![
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: _Sy-&}c+
+
1-21本底压力base pressure: Z0g3> iItM
1-22工作压力working pressure: W_9-JM(r
\~d|MP}"F:
2.分析方法 {[hH:
\
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: /+pbO-r W*
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : $cEl6(66iX
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: r-v;A
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: R nt&<|8G
2-3离子散射表面分析ion scattering spectroscopy: W76K/A<h>
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: ^5j|
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: T`7;Rl'Q
2-6离子散射谱仪ion scattering spectrometer: JO\Tf."a \
2-7俄歇效应Auger process: oGx OJyD
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: @G[P|^B
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: eyf\j,xP&
2-10光电子谱术photoelectron spectroscopy : LvgNdVJDP|
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: 1OK,r`
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: -hj@^Auf
2-11光电子谱仪photoelectron spectrometer: u"XqWLTV
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: a_XM2dc%
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: p0~=
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): e}y oy+9
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus