“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 /kr|}`#
Z
--------------------------------------------------- B7qi|Fw
真空术语 LR.]&(kyd
z{BgAI,
1.标准环境条件 standard ambient condition: aW_Y
2.气体的标准状态 standard reference conditions forgases: OSuQ7V
3.压力(压强)p pressure: g3'dkS!
4.帕斯卡Pa pascal: q@S\R
7R
5.托Torr torr: p) ;[;S
6.标准大气压atm standard atmosphere: HqqMX`Rof
7.毫巴mbar millibar: ;K l'[~z
8.分压力 partial pressure: w$s6NBF7
9.全压力 total pressure: ;L76V$&
10.真空 vacuum: oJ5n*[qUI
11.真空度 degree of vacuum: d$\n@}8eZp
12.真空区域 ranges of vacuum: x/]G"?Uix
13.气体 gas: &N7q9t
14.非可凝气体 non-condensable gas: (i{ZxWW&
15.蒸汽vapor: RI'}C`%v
16.饱和蒸汽压saturation vapor pressure: bly `mp8#
17.饱和度degree of saturation: sw1gpkX
18.饱和蒸汽saturated vapor: =j w?*
19.未饱和蒸汽unsaturated vapor: .+8#&Uy
20.分子数密度n,m-3 number density of molecules: !RLXB$@`
21.平均自由程ι、λ,m mean free path: ]n1#8T&<*z
22.碰撞率ψ collision rate: _o?aO C
23.体积碰撞率χ volume collision rate: ulg= ,+%r
24.气体量G quantity of gas: V@z/%=PJ
25.气体的扩散 diffusion of gas: .j)DE}[q>
26.扩散系数D diffusion coefficient; diffusivity: /3Y"F"`M.
27.粘滞流 viscous flow: kG4])qxC'
28.粘滞系数η viscous factor: (G{:O
29.泊肖叶流 poiseuille flow: .pxUO3g
30.中间流 intermediate flow: x^`P[>
31.分子流 molecular flow: V@G|2ZI
32克努曾数 number of knudsen: ;)f,A)(Z
33.分子泻流 molecular effusion; effusive flow: B;iJ$gt]
34.流逸 transpiration: P"Q6 wdm
35.热流逸 thermal transpiration: F6DVq8f9
36.分子流率qN molecular flow rate; molecular flux: @GweNo`p7
37.分子流率密度 molecular flow rate density; density of molecular flux: ze8 MFz'm
38.质量流率qm mass flow rare: |P9Mhf N
39.流量qG throughput of gas: btC<>(kl&
40.体积流率qV volume flow rate: ER!s
41.摩尔流率qυ molar flow rate: ?`
ebi|6
42.麦克斯韦速度分布 maxwellian velocity distribution: [p0_I7
43.传输几率Pc transmission probability: E_D@7a
44.分子流导CN,UN molecular conductance: xOxyz6B\
45.流导C,U conductance: m=iKu(2xRq
46.固有流导Ci,Ui intrinsic conductance: *g'%5i1ed
47.流阻W resistance: ki`ur%h
48.吸附 sorption: 5
r<cna
49.表面吸附 adsorption: ?6\A$?
50.物理吸附physisorption: ? R[GSS1
51.化学吸附 chemisorption: sx[mbKj<
52.吸收absorption: 7O=7lQ
53.适应系数α accommodation factor: bV)h\:oC
54.入射率υ impingement rate: >"]t4]GVf
55.凝结率condensation rate: }p9#Bzc
56.粘着率 sticking rate: "Q.C1#W}.
57.粘着几率Ps sticking probability: +q432ZG
58.滞留时间τ residence time: iqd7
59.迁移 migration: ,0,&
L
60.解吸 desorption: /T&+vzCF
61.去气 degassing: )q{e L$
62.放气 outgassing: \rbvlO?}
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: )Y1+F,C
64.蒸发率 evaporation rate: cR6#$-a
65.渗透 permeation: uF*tlaV6
66.渗透率φ permeability: ]INt9Pvqm
67.渗透系数P permeability coefficient !*k'3rKOW
2. 1.真空泵 vacuum pumps |' kC9H[>
1-1.容积真空泵 positive displacement pump: Jj1lAg0
⑴.气镇真空泵 gas ballast vacuum pump: riglEA[^
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: I'R|B\
⑶.干封真空泵 dry-sealed vacuum pump: srU*1jD)
⑷.往复真空泵 piston vacuum pump: 2DBFY1[Pk
⑸.液环真空泵 liquid ring vacuum pump: ]A_A4=[w
⑹.旋片真空泵 sliding vane rotary vacuum pump: .X4UDZQg
⑺.定片真空泵 rotary piston vacuum pump: /-ewCCzZV
⑻.滑阀真空泵 rotary plunger vacuum pump: b~rlh=(o#_
⑼.余摆线真空泵 trochoidal vacuum pump: Zr!CT5C5
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: >lK:~~1
⑾.罗茨真空泵 roots vacuum pump: Ve\!:,(Y_
1-2.动量传输泵 kinetic vacuum pump: LtDGu})1
⑴.牵引分子泵molecular drag pump: .uo:fxbd2
⑵.涡轮分子泵turbo molecular pump: <qx qlEQT
⑶.喷射真空泵ejector vacuum pump: =:^f6"p&Z
⑷.液体喷射真空泵liquid jet vacuum pump: PrEfJ?
⑸.气体喷射真空泵gas jet vacuum pump: m&6I@S2
⑹.蒸汽喷射真空泵vapor jet vacuum pump : +oa>k
0
⑺.扩散泵diffusion pump : }~NWOJ3;
⑻.自净化扩散泵self purifying diffusion pump: RjHKFB2
⑼.分馏扩散泵 fractionating diffusion pump : z
2Ao6*%
⑽.扩散喷射泵diffusion ejector pump : % ELf7~
⑾.离子传输泵ion transfer pump: 8&y3oxA,
1-3.捕集真空泵 entrapment vacuum pump: >56;M7b(K
⑴吸附泵adsorption pump: vo'{phtF)M
⑵.吸气剂泵 getter pump: u6p
nO
⑶.升华(蒸发)泵 sublimation (evaporation)pump : PKNpR
⑷.吸气剂离子泵getter ion pump: LsV?b*^(p
⑸.蒸发离子泵 evaporation ion pump: 6:Zd,N=
⑹.溅射离子泵sputter ion pump: 0p \,}t\E
⑺.低温泵cryopump: :P\RiaZAT
P/~kX_
2.真空泵零部件 l`<u\],
2-1.泵壳 pump case: fK9wr@1
2-2.入口 inlet: ( |Xc_nC
2-3.出口outlet: bQ_N^[oxQ
2-4.旋片(滑片、滑阀)vane; blade : R)5zHCwOw
2-5.排气阀discharge valve: ~_yz\;#
2-6.气镇阀gas ballast valve: .:+&2#b
2-7.膨胀室expansion chamber: IqmQQ_KH
2-8.压缩室compression chamber: GH6ozWA
2-9.真空泵油 vacuum pump oil: C'//(gjQ-G
2-10.泵液 pump fluid: ! ^U!T\qDi
2-11.喷嘴 nozzle: bp(X\:zAy
2-13.喷嘴扩张率nozzle expansion rate: 5Og=`T
2-14.喷嘴间隙面积 nozzle clearance area : gK"E4{y_@
2-15.喷嘴间隙nozzle clearance: 08 aZU
2-16.射流jet: ' +[fJ> Le
2-17.扩散器diffuser: NYN(2J
2-18.扩散器喉部diffuser thoat: d"4J)+q
2-19.蒸汽导管vapor tube(pipe;chimney): j.y8H
2-20.喷嘴组件nozzle assembly: 79Si^n1\
2-21.下裙skirt: D|R,$v:
p7Q
%)5o
3.附件 9"mcN3x:\e
3-1阱trap: roG f
&
⑴.冷阱 cold trap: 0hx EI
⑵.吸附阱sorption trap: <gc\,P<ru
⑶.离子阱ion trap: M%Dv-D{
⑷.冷冻升华阱 cryosublimation trap: h;8^vB y
3-2.挡板baffle: h4dT N}
3-3.油分离器oil separator: mg7Q~SLL{
3-4.油净化器oil purifier: FYu=e?L
3-5.冷凝器condenser: T*sB Wn'am
X`FFI6pb
4.泵按工作分类 O
E56J-*}x
4-1.主泵main pump: ~$3X>?Q
4-2.粗抽泵roughing vacuum pump: _3?7iH
4-3.前级真空泵backing vacuum pump: WAt | J2
4-4.粗(低)真空泵 roughing(low)vacuum pump: 5PU$D`7it
4-5.维持真空泵holding vacuum pump: Yhkn(k2
4-6.高真空泵high vacuum pump: ,k5b,}tN
4-7.超高真空泵ultra-high vacuum pump: %4rPkPAtrp
4-8.增压真空泵booster vacuum pump: hJ1: #%Qe.
LxC"j1wfl
5.真空泵特性 4TW>BA
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: (qM(~4|`
5-2.真空泵的抽气量Q throughput of vacuum pump:。 <n:j@a\up0
5-3.起动压力starting pressure: hhVyz{u
5-4.前级压力 backing pressure : d,9YrwbD
5-5.临界前级压力 critical backing pressure: 'cx&:s
5-6.最大前级压力maximum backing pressure: :7+E
fu
5-7.最大工作压力maximum working pressure: p;VHg
5-8.真空泵的极限压力ultimate pressure of a pump: AK*F,H9
5-9.压缩比compression ratio: ` E2@GX+,
5-10.何氏系数Ho coefficient: !@x'?+
5-11.抽速系数speed factor: V:w=h>z8
5-12.气体的反扩散back-diffusion of gas: $`&uu
5-13.泵液返流back-streaming of pump fluid: iX{Lc+u3
5-14.返流率back-streaming rate ['SZe0
5-15.返迁移back-migration: MQv2C@K9F
5-16.爆腾bumping: 'y?(s+
5-17.水蒸气允许量qm water vapor tolerable load: u~9gR @e2{
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: /J"U`/
{4
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 6(`Bl$M9
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump W1
qE,%cx
3. 1.一般术语 G3&l|@5
1-1.压力计pressure gauge: pv2u.qg5z
1-2.真空计vacuum gauge: V@xlm
h,
⑴.规头(规管)gauge head: J \@yP
⑵.裸规nude gauge : buRK\C
⑶.真空计控制单元gauge control unit : {T]^C
⑷.真空计指示单元gauge indicating unit : 6^]Y])
EfR3$sp
2.真空计一般分类 iJza zQ
2-1.压差式真空计differential vacuum gauge: *@|EaH/
2-2.绝对真空计 absolute vacuum gauge: ?
D?XaRb
2-3.全压真空计total pressure vacuum gauge: fr1/9E;
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: K0i[D"
2-5.相对真空计relative vacuum gauge : X~O2!F
xYJ|G=h&A
3.真空计特性 I3A@0'Vm;L
3-1.真空计测量范围pressure range of vacuum gauge: ^uu)|
3-2.灵敏度系数sensitivity coefficient: Z[DiLXHL
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Ed%8| M3
3-5.规管光电流photon current of vacuum gauge head: g$\Z-!(
3-6.等效氮压力equivalent nitrogen pressure : 75t\= 6#
3-7.X射线极限值 X-ray limit: YJlpP0;++
3-8.逆X射线效应anti X-ray effect: :n:Gr?
3-9.布利尔斯效应blears effect: Q-X<zn
4&Uq\,nx
4.全压真空计 z@nJ-*'U8
4-1.液位压力计liquid level manometer: y~ JCSzpU
4-2.弹性元件真空计elastic element vacuum gauge: ^&'&Y>
4-3.压缩式真空计compression gauge: \k{UqU+s
4-4.压力天平pressure balance: abq$OI
4-5.粘滞性真空计viscosity gauge : p=Nord
4-6.热传导真空计thermal conductivity vacuum gauge : S?W!bkfn
4-7.热分子真空计thermo-molecular gauge: H}OOkzwrA
4-8.电离真空计ionization vacuum gauge: 5V5E,2+
0
4-9.放射性电离真空计radioactive ionization gauge: a$7}_kb
4-10.冷阴极电离真空计cold cathode ionization gauge: vpy_piG|
4-11.潘宁真空计penning gauge: HCh;Xi
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: XCNfogl
4-13.放电管指示器discharge tube indicator: Xj/U~
4-14.热阴极电离真空计hot cathode ionization gauge: f&w8o5=|I
4-15.三极管式真空计triode gauge: q][{?
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: =|lKB;
4-17.B-A型电离真空计Bayard-Alpert gauge: &95iGL28Q
4-18.调制型电离真空计modulator gauge: qHGXs@*M&
4-19.抑制型电离真空计suppressor gauge: P&@:''
4-20.分离型电离真空计extractor gauge: $td=h)S^`
4-21.弯注型电离真空计bent beam gauge: *^XfEO
4-22.弹道型电离真空计 orbitron gauge : 8#OcrJzC
4-23.热阴极磁控管真空计hot cathode magnetron gauge: 0W|}5(C
X]J]7\4tF\
5.分压真空计(分压分析器) xS) njuq4
5-1.射频质谱仪radio frequency mass spectrometer: A4,tv#z
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: =X(8[ e
5-3.单极质谱仪momopole mass spectrometer: D}SYv})Ti
5-4.双聚焦质谱仪double focusing mass spectrometer: ESk<*-
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: pSQ)DqW
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 3@ a
5-7.回旋质谱仪omegatron mass spectrometer: LFsrqdzJ
5-8.飞行时间质谱仪time of flight mass spectrometer: 7Vf2Qx1_
Ex'6 WN~kD
6.真空计校准 \bze-|C
6-1.标准真空计reference gauges: CKShz]1
6-2.校准系统system of calibration: as1ZLfN.
6-3.校准系数K calibration coefficient: pKf]&?FX
6-4.压缩计法meleod gauge method: oT7=
6-5.膨胀法expansion method: 6&pI{
6-6.流导法flow method: olNgtSX
4. 1.真空系统vacuum system
uqy b
1-1.真空机组pump system: %RE-_~GF
1-2.有油真空机组pump system used oil : 8Wn;U!qT
1-3.无油真空机组oil free pump system Ca[H<nyj
1-4.连续处理真空设备continuous treatment vacuum plant: ~{,U%B
1-5.闸门式真空系统vacuum system with an air-lock: '-sAi
1-6.压差真空系统differentially pumped vacuum system: j)K[A%(
1-7.进气系统gas admittance system: =yv_i]9AN
~$1Zw&X
2.真空系统特性参量 NZ(c>r6
2-1.抽气装置的抽速volume flow rate of a pumping unit : ;b=3iT-2"
2-2.抽气装置的抽气量throughput of a pumping unit : `T H0*:aI
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: cd36f26`"w
2-4.真空系统的漏气速率leak throughput of a vacuum system: rlEp&"+|M
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: mX78Av.z!
2-6.极限压力ultimate pressure: I g/SaEF
2-7.残余压力residual pressure: |1GR:b24
2-8.残余气体谱residual gas spectrum: 5!2^|y4r
2-9.基础压力base pressure: KX e/i~AS
2-10.工作压力working pressure: }]1=?:tX%
2-11.粗抽时间roughing time: +u1meh3u
2-12.抽气时间pump-down time: >#}MDwKZD
2-13.真空系统时间常数time constant of a vacuum system: <qD/ #$
2-14.真空系统进气时间venting time: P q\m8iS,w
c[:OK9TH
3.真空容器 Z^i=51
3-1.真空容器;真空室vacuum chamber: 6Q<^,`/T
3-2.封离真空装置sealed vacuum device: | ,bCYK
3-3.真空钟罩vacuum bell jar: Y>KRI2](<
3-4.真空容器底板vacuum base plate: 1eC1Cyw
3-5.真空岐管vacuum manifold: ^h+,Kn0@
3-6.前级真空容器(贮气罐)backing reservoir: 8(R%?>8
3-7.真空保护层outer chamber: w
^ v*1KA&
3-8.真空闸室vacuum air lock: OhmKjY/}
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: W2L:
t^HQ=*c
4.真空封接和真空引入线 7XKPC+)1ya
4-1.永久性真空封接permanent seal : c\i`=>%b@
4.2.玻璃分级过渡封接graded seal : e0O2>w
4-3.压缩玻璃金属封接compression glass-to-metal seal: 1O
bxQ_x
4-4.匹配式玻璃金属封接matched glass-to-metal seal: Txkmt$h
4-5.陶瓷金属封接ceramic-to-metal seal: 2@``=0z
4-6.半永久性真空封接semi-permanent seal : RZm}%6##ZC
4-7.可拆卸的真空封接demountable joint: t^0^He$Ot
4-8.液体真空封接liquid seal >
Y
<in/
4-9.熔融金属真空封接molten metal seal: V[-4cu,Ph^
4-10.研磨面搭接封接ground and lapped seal: Mq-QWx"P
4-11.真空法兰连接vacuum flange connection: 3F' {JP
4-12.真空密封垫vacuum-tight gasket: <vx/pH)f
4-13.真空密封圈ring gasket: L8K=Q
4-14.真空平密封垫flat gasket: 7n*,L5%?]4
4-15.真空引入线feedthrough leadthrough: s`*
'JM<
4-16.真空轴密封shaft seal: ?Xm!;sS0
4-17.真空窗vacuum window: 'P{0K?{H-4
4-18.观察窗viewing window: ;Ee!vqD2
T9r"vw
5.真空阀门 `oP<mLxle
5-1.真空阀门的特性characteristic of vacuum valves:
%"GF+
⑴.真空阀门的流导conductance of vacuum valves: %,$Ms?,n`
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: "0o1M\6Z
5-2.真空调节阀regulating valve: a.+2h%b
5-3.微调阀 micro-adjustable valve: -<kl d+
5-4.充气阀charge valve: fMe "r*SU
5-5.进气阀gas admittance valve: " , c1z\
5-6.真空截止阀break valve: >$,A [|R
5-7.前级真空阀backing valve: =a>a A Z
5-8.旁通阀 by-pass valve: `YTagUq7
5-9.主真空阀main vacuum valve: x\t)uM%
5-10.低真空阀low vacuum valve: T'9I&h%\
5-11.高真空阀high vacuum valve: )(~s-x^\z@
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 8Xpf|?.
5-13.手动阀manually operated valve: \u@4eBAV
5-14.气动阀pneumatically operated valve: tydD~a
5-15.电磁阀electromagnetically operated valve: hS]g^S==2h
5-16.电动阀valve with electrically motorized operation: 2XhtK
5-17.挡板阀baffle valve: yidUtSv=,
5-18.翻板阀flap valve: :5!>h8p;
5-19.插板阀gate valve: J2cqnwUV
5-20.蝶阀butterfly valve: K*;e>{p
)i8Hdtn
6.真空管路 ;xFx%^M}br
6-1.粗抽管路roughing line: IXb]\ )
6-2.前级真空管路backing line: Z;kRQ
6-3.旁通管路;By-Pass管路 by-pass line: *yJCnoF
6-4.抽气封口接头pumping stem: x)eYqH~i
6-5.真空限流件limiting conductance: 1e`/N+6u
6-6.过滤器filter: Q!DH8'|4?L
5. 1.一般术语 Wyu$J
1-1真空镀膜vacuum coating: /]H6'
1-2基片substrate: .kpL?_
1-3试验基片testing substrate: tpe:]T/xh
1-4镀膜材料coating material: PW(4-H
1-5蒸发材料evaporation material: pvL)BD
1-6溅射材料sputtering material: f49pIcAq
1-7膜层材料(膜层材质)film material: Jy&O4g/'5
1-8蒸发速率evaporation rate: q$)$?"
1-9溅射速率sputtering rate: P" +!mSe^~
1-10沉积速率deposition rate: /DOV/>@5%
1-11镀膜角度coating angle: *Ag</g@ h
.?7u'%6x?{
2.工艺 ,|hM`<"?
2-1真空蒸膜vacuum evaporation coating: qfp,5@p
(1).同时蒸发simultaneous evaporation: ~jdvxoX-
(2).蒸发场蒸发evaporation field evaporation: _'9("m V
(3).反应性真空蒸发reactive vacuum evaporation: i#/,Q1yEn
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: <CrNDY
(5).直接加热的蒸发direct heating evaporation: oej5bAi
(6).感应加热蒸发induced heating evaporation: 0zrgK;9
(7).电子束蒸发electron beam evaporation: '6l4MR$j&m
(8).激光束蒸发laser beam evaporation: VC%{qal;q
(9).间接加热的蒸发indirect heating evaporation: @Qw~z0PE<l
(10).闪蒸flash evaportion: e~#;ux
2-2真空溅射vacuum sputtering: \)Sa!XLfT
(1).反应性真空溅射 reactive vacuum sputtering: 6&8 ([J
(2).偏压溅射bias sputtering: l ;"v&?
(3).直流二级溅射direct current diode sputtering: [?rK9I&
(4).非对称性交流溅射asymmtric alternate current sputtering: @tQu3Rq@
(5).高频二极溅射high frequency diode sputtering: I9S=VFhZ`
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: P%?|V_m
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: ^%(HZ'$wC
(8).离子束溅射ion beam sputtering: p<b//^
(9).辉光放电清洗glow discharge cleaning: G-`4TQ
2-3物理气相沉积PVD physical vapor deposition: *'5)CC
2-4化学气相沉积CVD chemical vapor deposition: C:S*juK
2-5磁控溅射magnetron sputtering: tHF-OarUO
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: !cP2,l'f
2-7空心阴极离子镀HCD hollow cathode discharge deposition: %UIR GI
2-8电弧离子镀arc discharge deposition: ;Du+C%
AY]dwKw
3.专用部件 2tz%A~}4
3-1镀膜室coating chamber: t%@sz
3-2蒸发器装置evaporator device: {Ju
3-3蒸发器evaporator: &PY~m<F
3-4直接加热式蒸发器evaporator by direct heat: ~s.~X5
3-5间接加热式蒸发器evaporator by indirect heat: W?y7mw_S
3-7溅射装置sputtering device: kKbq?}W[
3-8靶target: |wF_CZ*1
3-10时控挡板timing shutter: bf1Tky=/
3-11掩膜mask: 0,~f"Dyqy
3-12基片支架substrate holder: 9a\H+Y~
3-13夹紧装置clamp: \o-9~C\c*
3-14换向装置reversing device: a%\6L
3-15基片加热装置substrate heating device: m]C|8b7Y
3-16基片冷却装置substrate colding device: WiDl[l"{9
C\%T|ZDE
4.真空镀膜设备 s98Jh(~
4-1真空镀膜设备vacuum coating plant: E
P1f6ps
(1).真空蒸发镀膜设备vacuum evaporation coating plant: h"~i&T
h
(2).真空溅射镀膜设备vacuum sputtering coating plant: MW^(
4-2连续镀膜设备continuous coating plant: :bBLP7eyV
4-3半连续镀膜设备semi- continuous coating plant 9W^sq<tR
6. 1.漏孔 'p%aHK{
1-1漏孔leaks: m Acny$u
1-2通道漏孔channel leak: g]kM7,/M
1-3薄膜漏孔membrane leak: g.L~Z1-
1-4分子漏孔molecular leak: isU7nlc!
1-5粘滞漏孔vixcous leak: -cDS+*[
1-6校准漏孔calibrated leak: z1dSZ0NoA
1-7标准漏孔reference leak : h%4aL38
1-8虚漏virtual leak: uD'yzR!]+
1-9漏率leak rate: TA2HAMx)
1-10标准空气漏率standard air leak rate: O|Sbe%[*wW
1-11等值标准空气漏率equivalent standard air leak rate: !H)$_d \uj
1-12探索(示漏)气体: |3LD"!rEx
@;\2 PD
2.本底 rV{:'"=y-
2-1本底background: DIsK+1
2-2探索气体本底search gas background : kSW=DE|#}
2-3漂移drift: G909R>
2-4噪声noise: r4YiXss
" V[=U13
3.检漏仪 BZJ\tPSR
3-1检漏仪leak detector: ko-3`hX`
3-2高频火花检漏仪H.F. spark leak detector: "0*yD[2
3-3卤素检漏仪halide leak detector: QR+xPY~
3-4氦质谱检漏仪helium mass spectrometer leak detector: "Wz8f
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: pyHU+B
$7bLw)7
4.检漏 %
w\
4-1气泡检漏leak detection by bubbles: 8
x=J&d
4-2氨检漏leak detection by ammonia: _sp,,gz
4-3升压检漏leak detection of rise pressure: )2z<5 `
4-4放射性同位素检漏radioactive isotope leak detection: Oy}^|MFfA
4-5荧光检漏fluorescence leak detection W8blHw"
7. 1.一般术语 8k( zU>^
1-1真空干燥vacuum drying: 8+f{ /
1-2冷冻干燥freeze drying : }nEa9h
1-3物料material: `Wl_yC_*G;
1-4待干燥物料material to be dried: G_m $?0\
1-5干燥物料dried material : (6}[y\a+
1-6湿气moisture;humidity: `p!&>,lrk
1-7自由湿气free moisture: N>TmaUk
1-8结合湿气bound moisture: xNrPj8V<Y
1-9分湿气partial moisture: h6CAd-\x\
1-10含湿量moisture content: &6feR#~A
1-11初始含湿量initial moisture content: 3# g"Z7/
1-12最终含湿量final residual moisture: Wtwo1pp
1-13湿度degree of moisture ,degree of humidity : 6N49q-.Lg
1-14干燥物质dry matter : X!b+Dk
1-15干燥物质含量content of dry matter: 9T\uOaC"
40e(p/Qka
2.干燥工艺 qnu<"$
2-1干燥阶段stages of drying : vw'xmzgA
(1).预干燥preliminary dry: *5QN:
(2).一次干燥(广义)primary drying(in general): [S~/lm
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): zb]e{$q2C
(4).二次干燥secondary drying: UF&B7r
2-2.(1).接触干燥contact drying: &%UZ"CcA
(2).辐射干燥 drying by radiation : q"48U.}T
(3).微波干燥microwave drying: ]x1;uE?1J
(4).气相干燥vapor phase drying: AqA.,;G
(5).静态干燥static drying: NR>&1aRbyb
(6).动态干燥dynamic drying: Iq0[Kd0.j
2-3干燥时间drying time: ptc.JB6
2-4停留时间length of stay(in the drying chamber): _4f=\
2-5循环时间cycle time: @*16agGg
2-6干燥率 dessication ratio : dO1h1yJJ
2-7去湿速率mass flow rate of humidity: {X\%7Zef+
2-8单位面积去湿速率mass flow rate of humidity per surface area: *@VS^JB
2-9干燥速度 drying speed : 1gA^Qv~?
2-10干燥过程drying process: .GSK!1{@
2-11加热温度heating temperature: qyKI.X3n*
2-12干燥温度temperature of the material being dried : 4C#r=Uw`
2-13干燥损失loss of material during the drying process : |2Y/l~
2-14飞尘lift off (particles): aD&4C-,1
2-15堆层厚度thickness of the material: WK.K-bd
cq`!17"k
3.冷冻干燥 Al3*? H&
3-1冷冻freezing: 3Q#Tut
(1).静态冷冻static freezing: `Hx JE"/
(2).动态冷冻dynamic freezing: N!//m?}
(3).离心冷冻centrifugal freezing: hcqg94R#_
(4).滚动冷冻shell freezing: /u&7!>,
(5).旋转冷冻spin-freezing: hz+O.k],?
(6).真空旋转冷冻vacuum spin-freezing: vn+~P9SHQ
(7).喷雾冷冻spray freezing: $qR<_6j
(8).气流冷冻air blast freezing: xV0:K=
3-2冷冻速率rate of freezing: M9QYYo@
3-3冷冻物料frozen material: (F j"<
3-4冰核ice core: FfX*bqy
3-5干燥物料外壳envelope of dried matter: nK)hv95i_
3-6升华表面sublimation front: V}MRdt7
3-7融化位置freezer burn: 9'=ZxV
gF2,Jm@"6
4.真空干燥设备;真空冷冻干燥设备 =D`:2k~
,
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ;lQ>>[*
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: M1q_gHA
4-3加热表面heating surface: ydTd.`
4-4物品装载面shelf : 7.*Mmx~]=
4-5干燥器的处理能力throughput (of the vacuum drying chamber): Y6`^E
4-6单位面积干燥器处理能力throughput per shelf area: P9o=G=i
4-7冰冷凝器ice condenser: (@Kc(>(: Y
4-8冰冷凝器的负载load of the ice condenser: <2e[; $
4-9冰冷凝器的额定负载rated load of the ice condenser M2nWvU$
8. 1.一般术语 2@!B;6*8q
1-1试样sample : [7\x(W-:@>
(1).表面层surface layer: \iA.{,VX
(2).真实表面true surface: [a!)w@I:
(3).有效表面积effective surface area: 3=("vR`!
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: 0}"'A[xE
(5).表面粒子密度surface particle density: :rU,7`sE/
(6).单分子层monolayer: q $=[v
(7).表面单分子层粒子密度monolayer density: e8eNef L$
(8).覆盖系数coverage ratio: )~CNh5z6Y
1-2激发excitation: 25;(`Td5
(1).一次粒子primary particle: FY)US>
(2).一次粒子通量primary particle flux: N<O<wtXIj
(3).一次粒子通量密度density of primary particle flux: cEIs9;
(4).一次粒子负荷primary particle load: )S`=y-L$
(5).一次粒子积分负荷integral load of primary particle: txiX1o!/L
(6).一次粒子的入射能量energy of the incident primary particle: */OKg;IMi
(7).激发体积excited volume: i}O.,iH
(8).激发面积excited area: *mkVk7]c
(9).激发深度excited death: !ou;yE&<,
(10).二次粒子secondary particles: Nj.;mr<
(11).二次粒子通量secondary particle flux: w8bvqTQ
(12).二次粒子发射能energy of the emitted secondary particles: /@1pm/>ZaN
(13).发射体积emitting volume: LvMA('4
(14).发射面积emitting area: {TvB3QOsj
(15).发射深度emitting depth: mRy0zN>?
(16).信息深度information depth: xKkXr-yb`f
(17).平均信息深度mean information depth: m:c0S8#:
1-3入射角angle of incidence: VHG}'r9KC%
1-4发射角angle of emission: >=86*U~
1-5观测角observation: lHFk~Qp[
1-6分析表面积analyzed surface area: "|BSGV!8
1-7产额 yield : uQ%3?bx)T
1-8表面层微小损伤分析minimum damage surface analysis: \x|8
1-9表面层无损伤分析non-destructive surface analysis: Q)=2%X
1-10断面深度分析 profile analysis in depth; depth profile analysis : y@r0"cvz9
1-11可观测面积observable area: Os*s{2OvO
1-12可观测立体角observable solid angle : 2|&SG3e+(I
1-13接受立体角;观测立体角angle of acceptance: "8Lv
1-14角分辨能力angular resolving power: QZ+G2$
1-15发光度luminosity: JL[!8NyU
1-16二次粒子探测比detection ratio of secondary particles: i]Bu7Fuu
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: z3{Cp:Mn
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: #8$"84&N.
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 7~SnY\B|
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: B}J0d
1-21本底压力base pressure: fX2OH)6U
1-22工作压力working pressure: >uYU_/y$2
0es\
j6c
2.分析方法 %/d1x
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ,20l` :
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : f@k.4aS
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: ^b4i9n,t1
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: Tv9\`F[
2-3离子散射表面分析ion scattering spectroscopy: tO?-@Qf/9<
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: -`NzBuV$2,
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: dK4w$~j{k
2-6离子散射谱仪ion scattering spectrometer: q8H nPXV
2-7俄歇效应Auger process: F:~@e(
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: `lrNH]B
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: y8Rq2jI;(e
2-10光电子谱术photoelectron spectroscopy : Y ` Z,52
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: nX\mCO4T
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: FF;Fo}no-
2-11光电子谱仪photoelectron spectrometer: _h 6c[*
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 06?d#{?M1o
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: Er
-rm
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): (/E@.z[1
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus