寻找硅胶。用在投影仪的光学元件上。

  参数参考 ^mb*w)-p?  
Curing U.9nHo{  
Pre-cure:    100oC for 15 minutes X-WvKH(=w  
Full cure:    100oC for 1 hour (minimum) !f2>6}hE  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin f3&//h8  
r_CN/a  
Mechanical Data 3W WxpTU  
1. Tensile strength:    800 psi (min) @"5u~o')@v  
2. Lap shear strength:    250 psi (min) Z ' 96d  
3. Elongation:        80% (min) *wx^mB9  
4. Hardness:        50 Shore D :Fk&2WsW:  
, |B\[0p  
Thermal and Optical Data: _!Q\Xn  
1.  Working temperature range: -40oC – 230oC f}uCiV!?v  
2.    Decomposition temperature:    onset at 3000C (by TGA) QVhBHAw  
3.    No change in modulus with temperature mTbPzZ4  
4.    CTE ~ 200 ppm/oC R-|]GqS}L  
5.    Refractive index:        1.43 HC}C_Q5c91  
6.    Transmittance(%)    >90  @260-700nm `215Llzk;  
hkc_>F]Hx  
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