寻找硅胶。用在投影仪的光学元件上。

  参数参考 @c,=c+-  
Curing 6y@o[=m  
Pre-cure:    100oC for 15 minutes F2=#\U$  
Full cure:    100oC for 1 hour (minimum) @d[)i,d:G  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin @y# u!}  
\'nE{  
Mechanical Data ~^eC?F(  
1. Tensile strength:    800 psi (min) IS!]!s'EI  
2. Lap shear strength:    250 psi (min) >PygUY d  
3. Elongation:        80% (min) bgmOX&`G  
4. Hardness:        50 Shore D Cz4l  
8 A#\V  
Thermal and Optical Data: As#/ln$nE  
1.  Working temperature range: -40oC – 230oC d8f S79  
2.    Decomposition temperature:    onset at 3000C (by TGA) Sj4@pMh4  
3.    No change in modulus with temperature MXY!N/  
4.    CTE ~ 200 ppm/oC E>}3MfL  
5.    Refractive index:        1.43 N8]d0  
6.    Transmittance(%)    >90  @260-700nm 8DlRD$_:&  
RYX=;n  
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