CIOE2013:Aifotec AG携Wafer-level die bonding参展

发布:abjames 2013-08-20 16:46 阅读:1568
CIOE2013:Aifotec AG携带Wafer-level die bonding参展 !U2Wiks  
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Technology evaluation LBkAi(0rd  
BOM analysis EFYyr f@  
Contract studies MCcWRbE5#  
Design for Manufacturability, analysis and planning H!+T2<F9R  
Production roadmapping across hybrid technologies gqi|k6V/  
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Aifotec AG Nhm)bdv]  
展位号: 1A09-9 ]1XJQW@gF  
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Aifotec AG is an independent provider of photonic design and manufacturing services. 6*:mc  
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We offer industry-proven experience in a variety of Photonic Development (PDS) and Photonic Manufacturing Services (PMS) for high-precision optical devices in applications such as Data Communications, Consumer, Automotive and Military. Aifotec AG offers Hybrid Integration Technology experience, which allows packaging solutions across leading-edge process benches such as glass, ceramic, polymer and silicon, using either laser bonding, as well as different gluing technologies. bz=B&YR  
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Aifotec AG originates from Aifotec Fiberoptics GmbH, which was founded in 2002 out of an MBO from Finisar Europe GmbH, and has meanwhile advanced to one of the leading providers of design and manufacturing services for high-precision (+/- 0.5um) and yet cost effective photonic modules and components. \D]H>i$  
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Together with our strategic partner FOCUZ, a Thai volume manufacturer of fibre-coupled modules we offer a powerful combination of forces, highly unique in the industry.
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