1 backplane 背板 6k ]+DbT
2 Band gap voltage reference 带隙电压参考 Xc
G
3 benchtop supply 工作台电源 h,i=Y+1
4 Block Diagram 方块图 5 Bode Plot 波特图 lMjeq.5nP
6 Bootstrap 自举 (S63:q&g
7 Bottom FET Bottom FET D.w6/DxaXa
8 bucket capcitor 桶形电容
A4TW`g_zm
9 chassis 机架 >ZnnGX6$(
10 Combi-sense Combi-sense #sf1,k5'
11 constant current source 恒流源 $69d9g8-(!
12 Core Sataration 铁芯饱和 ByjgM`
13 crossover frequency 交叉频率 edfb7prfTl
14 current ripple 纹波电流 :LTjV"f
15 Cycle by Cycle 逐周期 F<2qwP
16 cycle skipping 周期跳步 }Y3*X:i7
17 Dead Time 死区时间 !<5Wi)*
18 DIE Temperature 核心温度 <im<0;i&e
19 Disable 非使能,无效,禁用,关断 !=v d:,
20 dominant pole 主极点 )p
8P\Rl
21 Enable 使能,有效,启用 F@-8J?Hl:
22 ESD Rating ESD额定值 W@vCMy!
23 Evaluation Board 评估板 ]
N7(<EV/
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. \{}5VVw-S?
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 |I=GI]I
25 Failling edge 下降沿 V6^=[s R
26 figure of merit 品质因数 \|R\pS}4
27 float charge voltage 浮充电压 _j\8u`^n
28 flyback power stage 反驰式功率级 _qSVYVJ u
29 forward voltage drop 前向压降 6oq/\D$6~
30 free-running 自由运行 s[u*~A
31 Freewheel diode 续流二极管 -b'/}zz
32 Full load 满负载 33 gate drive 栅极驱动 :eR\0cn
34 gate drive stage 栅极驱动级 EnYEAjX
35 gerber plot Gerber 图 srd\Mf_Ej
36 ground plane 接地层 ^J&}C
37 Henry 电感单位:亨利 $8NM[R.8^4
38 Human Body Model 人体模式 O?qM=W
39 Hysteresis 滞回 OC Wyp
40 inrush current 涌入电流 bMN]co
41 Inverting 反相 wl%I(Cw{]
42 jittery 抖动 1<pb=H
43 Junction 结点 {[r}gS%
44 Kelvin connection 开尔文连接 NV;T*I8O
45 Lead Frame 引脚框架 )xYGJq4
46 Lead Free 无铅 g,\O}jT\'
47 level-shift 电平移动 NxN~"bfh
48 Line regulation 电源调整率 dY.NQ1@"
49 load regulation 负载调整率 k$w#:Sx
50 Lot Number 批号 )bK3%>H#
51 Low Dropout 低压差 ME'LZ"VT
52 Miller 密勒 53 node 节点 _/h<4G6A
54 Non-Inverting 非反相 fOz.kK[]
55 novel 新颖的 wRe2sjM
56 off state 关断状态 JYa3xeC;
57 Operating supply voltage 电源工作电压 3u1\zse
58 out drive stage 输出驱动级 \-{2E
59 Out of Phase 异相 kFQx7m
60 Part Number 产品型号 7G
3e
61 pass transistor pass transistor QT[4\)
62 P-channel MOSFET P沟道MOSFET r5PZ=+F
63 Phase margin 相位裕度 ;~Q`TWC
64 Phase Node 开关节点 MZdj!(hO
65 portable electronics 便携式电子设备 PS` F
66 power down 掉电 a- 7RJ.
67 Power Good 电源正常 rVDOco+w
68 Power Groud 功率地 [&:dPd1_
69 Power Save Mode 节电模式 DWk2=cO
70 Power up 上电 g ~>nT>6
71 pull down 下拉 F&D,y-CQ
72 pull up 上拉 LCok4N$o
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 71,GrUV:
74 push pull converter 推挽转换器 OA&r8WK3
75 ramp down 斜降 }}4uLGu)
76 ramp up 斜升 eY3<LVAX
77 redundant diode 冗余二极管 4+F@BxpB
78 resistive divider 电阻分压器 C@9K`N[*
79 ringing 振 铃 Ej$oRo{IG
80 ripple current 纹波电流 k~=P0";
81 rising edge 上升沿 X@%4N<
82 sense resistor 检测电阻 OZ2faf
83 Sequenced Power Supplys 序列电源 ^6PKSEba
84 shoot-through 直通,同时导通 E^x/v_,$w!
85 stray inductances. 杂散电感 >9X+\eg-
86 sub-circuit 子电路 ZKVM9ofXRi
87 substrate 基板 }C5Fvy6uz
88 Telecom 电信 ez[$;>
89 Thermal Information 热性能信息 C0H@
90 thermal slug 散热片 <E7y:%L[Go
91 Threshold 阈值 1A N)%
92 timing resistor 振荡电阻 M#xol/)h
93 Top FET Top FET :-cqC|Y
94 Trace 线路,走线,引线 :<xf'.
95 Transfer function 传递函数 ro18%'RRI
96 Trip Point 跳变点 #QiNSS
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) &IkHP/
98 Under Voltage Lock Out (UVLO) 欠压锁定 \d
QRQL{LL
99 Voltage Reference 电压参考 )H%RwV#
100 voltage-second product 伏秒积 14p{V}f3
101 zero-pole frequency compensation 零极点频率补偿 0D}k ^W
102 beat frequency 拍频 c)SQ@B@q
103 one shots 单击电路 M&0U@ r-
104 scaling 缩放 0|]qWcD
105 ESR 等效串联电阻 [Page] /X?%K't2r
106 Ground 地电位 Q8NrbMrl
107 trimmed bandgap 平衡带隙 |O[ I=!
108 dropout voltage 压差 |kqRhR(Ei
109 large bulk capacitance 大容量电容 EP6@5PNZ
110 circuit breaker 断路器 k(_^Lq f-
111 charge pump 电荷泵 ky[ ^uQ>0
112 overshoot 过冲 ! Y'~?BI
UZu.B!4
印制电路printed circuit @gm!D`YL
印制线路 printed wiring *.+N?%sAP)
印制板 printed board Qe]aI7Ei
印制板电路 printed circuit board 2.&%mSN
印制线路板 printed wiring board k<%y+v
印制元件 printed component (o1o);AO
印制接点 printed contact Gvc/o$_
印制板装配 printed board assembly ]{= qdgJ
板 board #6nuiSF
刚性印制板 rigid printed board TGI`}#
挠性印制电路 flexible printed circuit sb</-']a
挠性印制线路 flexible printed wiring 0#/Pc`zC
齐平印制板 flush printed board ePTN^#|W
金属芯印制板 metal core printed board h~k+!\
金属基印制板 metal base printed board b
R9iqRbn
多重布线印制板 mulit-wiring printed board .'S_9le
塑电路板 molded circuit board u(4o#m
散线印制板 discrete wiring board MG74,D.f
微线印制板 micro wire board ='<*mT<
积层印制板 buile-up printed board >!#or- C
表面层合电路板 surface laminar circuit i^V3u
埋入凸块连印制板 B2it printed board JiRfLB
载芯片板 chip on board $GIup5
埋电阻板 buried resistance board [ejl #'*5
母板 mother board G_6!w//
子板 daughter board (2r808^2
背板 backplane - _BjzA|
裸板 bare board w/Wd^+IIn
键盘板夹心板 copper-invar-copper board |JTDwmR
动态挠性板 dynamic flex board qz|xow/ns@
静态挠性板 static flex board -FQS5Zb.!
可断拼板 break-away planel DcEGIaW
电缆 cable zc!q a"4yM
挠性扁平电缆 flexible flat cable (FFC) gdG#;T'
薄膜开关 membrane switch ~lH2#u>g
混合电路 hybrid circuit _ Zzne
厚膜 thick film n)R[T.E)+
厚膜电路 thick film circuit i&JI"Dd7
薄膜 thin film {D4N=#tl
薄膜混合电路 thin film hybrid circuit N~9zQ
互连 interconnection ]}nX$xy
导线 conductor trace line 9a{9|p>L
齐平导线 flush conductor [P%'p-Hg_
传输线 transmission line XI;F=r}'
跨交 crossover fl<j]{*v
板边插头 edge-board contact }Z% j=c"d
增强板 stiffener E# *`u
基底 substrate #,rP1#?
基板面 real estate p *GAs
C
导线面 conductor side ~}s0~j ~
元件面 component side vXibg
焊接面 solder side ,~7+r#q7
导电图形 conductive pattern BmCBC,j<v>
非导电图形 non-conductive pattern mH!\]fmR~
基材 base material y?8V'.f|
层压板 laminate LH>h]OTQF
覆金属箔基材 metal-clad bade material *|)O
覆铜箔层压板 copper-clad laminate (CCL) bs_rw+
复合层压板 composite laminate }r:8w*47
薄层压板 thin laminate ph@2[rUp
基体材料 basis material $kn"S>jV
预浸材料 prepreg KPdlg.
粘结片 bonding sheet )iCg,?SSw=
预浸粘结片 preimpregnated bonding sheer a`S3v
环氧玻璃基板 epoxy glass substrate +c\uBrlZQ;
预制内层覆箔板 mass lamination panel [N1[khY`
内层芯板 core material 3H,>[&d
粘结层 bonding layer M,bcTa8
粘结膜 film adhesive [,q^\T
无支撑胶粘剂膜 unsupported adhesive film u&$1XZ!es
覆盖层 cover layer (cover lay) n_-k <3
增强板材 stiffener material
-(|}:J
铜箔面 copper-clad surface |~YhN'OJ
去铜箔面 foil removal surface
3vF-SgCV
层压板面 unclad laminate surface d(6&kXK
基膜面 base film surface @RLlkWGc
胶粘剂面 adhesive faec R5'_il
原始光洁面 plate finish T2i\S9X
粗面 matt finish 5C"A*Fg?;
剪切板 cut to size panel S-G#+Ue2
超薄型层压板 ultra thin laminate fFd"21>
A阶树脂 A-stage resin Zz56=ZX*_
B阶树脂 B-stage resin ceNJXK
C阶树脂 C-stage resin StM)lVeF
环氧树脂 epoxy resin T( sEk
酚醛树脂 phenolic resin 4t0-L]v4.*
聚酯树脂 polyester resin }#9 |au`
聚酰亚胺树脂 polyimide resin nokMS
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin >
V%3w7
丙烯酸树脂 acrylic resin [NguQ]B.
三聚氰胺甲醛树脂 melamine formaldehyde resin )\,hc$<=m
多官能环氧树脂 polyfunctional epoxy resin '2c4
4F)i
溴化环氧树脂 brominated epoxy resin ]e]hA@4
环氧酚醛 epoxy novolac 5b%zpx0Y
氟树脂 fluroresin z;[Z'_B
硅树脂 silicone resin Rj{D#5
硅烷 silane K2t|d[r
聚合物 polymer ?&r>`H E
无定形聚合物 amorphous polymer _JXb|FIp
结晶现象 crystalline polamer ($:JI3e[;
双晶现象 dimorphism %'<m[wf^ o
共聚物 copolymer D_Cd^;b
合成树脂 synthetic h_ J|uu
热固性树脂 thermosetting resin [Page] |Xa|%f
热塑性树脂 thermoplastic resin hOF>Dj
感光性树脂 photosensitive resin )z2hyGX
环氧值 epoxy value Se&%Dr3Nv
双氰胺 dicyandiamide %#b+ =J
粘结剂 binder AJ-~F>gn
胶粘剂 adesive #ui7YUR=2
固化剂 curing agent <=7^D
阻燃剂 flame retardant 6d|%8.q1
遮光剂 opaquer sBD\;\I
增塑剂 plasticizers NI%
()
不饱和聚酯 unsatuiated polyester @ei:/~y3
聚酯薄膜 polyester OPwO`pN
聚酰亚胺薄膜 polyimide film (PI) t"Djh^=y
聚四氟乙烯 polytetrafluoetylene (PTFE) RVb}R<yU+
增强材料 reinforcing material bLi>jE.%.
折痕 crease ~`x<;Ts
云织 waviness @^93q
鱼眼 fish eye <y5f[HjLy
毛圈长 feather length B$cx
'_zF
厚薄段 mark 80qe5WC.2u
裂缝 split I@9k+JB
捻度 twist of yarn 2d Px s:8&
浸润剂含量 size content zMQ|j_l9E
浸润剂残留量 size residue UHW;e}O5
处理剂含量 finish level :i ft{XR'
偶联剂 couplint agent &`4v,l^Zi6
断裂长 breaking length 7A[`%.!F6
吸水高度 height of capillary rise y1:#0
湿强度保留率 wet strength retention kKg%[zXS
白度 whitenness SZQ4e
导电箔 conductive foil 27Ve $Q8]v
铜箔 copper foil U
i ~*]
压延铜箔 rolled copper foil SRx `m,535
光面 shiny side /K]<7
粗糙面 matte side Q.G6y,KR
处理面 treated side sS|N.2*
防锈处理 stain proofing &Kgl\;}
双面处理铜箔 double treated foil >HXmpu.O
模拟 simulation `Dco!ih
逻辑模拟 logic simulation i%)Nn^a;T
电路模拟 circit simulation v/yt C/WH"
时序模拟 timing simulation =K2mR}n\;
模块化 modularization cCH2=v4hU
设计原点 design origin &% \`Lwh
优化(设计) optimization (design) I5J9,j
供设计优化坐标轴 predominant axis
"cUCB
表格原点 table origin s$ 2@ |;
元件安置 component positioning T=QV =21qn
比例因子 scaling factor ~y(-j[
扫描填充 scan filling 3yfq*\_uXw
矩形填充 rectangle filling Lh5d2}tcO
填充域 region filling ,??%["R
实体设计 physical design 4F+n`{~
逻辑设计 logic design {~"6/L
逻辑电路 logic circuit WwF4`kxT
层次设计 hierarchical design (fjAsbT
自顶向下设计 top-down design O0gLu1*1v
自底向上设计 bottom-up design ?X.MKNbp
费用矩阵 cost metrix i>C:C>~
元件密度 component density eiaLzI,O
自由度 degrees freedom ^{T3lQvt
出度 out going degree LA.xLU3
入度 incoming degree r%g?.4o*b
曼哈顿距离 manhatton distance ''f07R
欧几里德距离 euclidean distance Uaho.(_GP
网络 network N'nqVYTU
阵列 array }'KVi=qnHb
段 segment VzR(OB
逻辑 logic YolO-5
逻辑设计自动化 logic design automation _ s]=g
分线 separated time *8uSy/l
分层 separated layer v^h
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定顺序 definite sequence ?N,'1I
导线(通道) conduction (track) @]#0jiS
导线(体)宽度 conductor width b&;1b<BwD
导线距离 conductor spacing wr=h=vXU[
导线层 conductor layer :H$D-pbJ4
导线宽度/间距 conductor line/space (c<Krc
h
第一导线层 conductor layer No.1 wR?M2*ri
圆形盘 round pad h7-!q@
方形盘 square pad lMX 2O2 o
菱形盘 diamond pad $C UmRi{T
长方形焊盘 oblong pad $S Q8,Y,
子弹形盘 bullet pad n7"e 79
泪滴盘 teardrop pad FBM 73D@`
雪人盘 snowman pad n2Oi< )
形盘 V-shaped pad V VJX{2$L
环形盘 annular pad x7X"'1U
非圆形盘 non-circular pad oVsj
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隔离盘 isolation pad s7CoUd2
非功能连接盘 monfunctional pad |#x;}_>7
偏置连接盘 offset land Rla4XN=mf
腹(背)裸盘 back-bard land HM])m>KeT
盘址 anchoring spaur *Rv eR?kO
连接盘图形 land pattern kyQ%qBv ^
连接盘网格阵列 land grid array k[l+~5ix
孔环 annular ring )""i"/Mn
元件孔 component hole 8{HeHU
安装孔 mounting hole jGzs; bE
支撑孔 supported hole M#J OX/
非支撑孔 unsupported hole 6y,M+{
导通孔 via ,@=qaU
镀通孔 plated through hole (PTH) N5rY*S
余隙孔 access hole _F^k>Lq&