1 backplane 背板 b}DxD1*nsI
2 Band gap voltage reference 带隙电压参考 &jJj6
+P\
3 benchtop supply 工作台电源 %fY\vd2
4 Block Diagram 方块图 5 Bode Plot 波特图 kk6Af\NZ
6 Bootstrap 自举 r+6=b"
7 Bottom FET Bottom FET oWg"f*
8 bucket capcitor 桶形电容 k+
Shhe1
9 chassis 机架 JHN{vB
10 Combi-sense Combi-sense O,m0Xb2s]~
11 constant current source 恒流源 neN #Mo'A
12 Core Sataration 铁芯饱和 G.CkceWRn
13 crossover frequency 交叉频率 d\% |!ix
14 current ripple 纹波电流 X?PcEAi;w
15 Cycle by Cycle 逐周期 Li[ :L
16 cycle skipping 周期跳步 `ceetr=
17 Dead Time 死区时间 |Tn+Aq7
18 DIE Temperature 核心温度 !Z f<
j
19 Disable 非使能,无效,禁用,关断 xaQO=[
20 dominant pole 主极点 wjLtLtK?
21 Enable 使能,有效,启用 i8CO+Iv*{
22 ESD Rating ESD额定值 8t4o}3>
23 Evaluation Board 评估板 /l o;:)AiP
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. AUZ^XiK
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ]iP
+Y
25 Failling edge 下降沿 ;Mzy>*#$Q
26 figure of merit 品质因数 N@Fof(T&
27 float charge voltage 浮充电压 OsQB`
D
28 flyback power stage 反驰式功率级 %kB84dE
29 forward voltage drop 前向压降 AmSrc.
30 free-running 自由运行 2y"]rUS`
31 Freewheel diode 续流二极管 Qq,w6ekr
32 Full load 满负载 33 gate drive 栅极驱动 $CT2E
34 gate drive stage 栅极驱动级 -u!{8S~wA
35 gerber plot Gerber 图 U]!~C 1cmw
36 ground plane 接地层 /XfE6SBz
37 Henry 电感单位:亨利 B!>hHQ2
38 Human Body Model 人体模式 {,kA'Px)
39 Hysteresis 滞回 zTP|H5HyK
40 inrush current 涌入电流 ga BVD*>
41 Inverting 反相 C"X; ,F<
42 jittery 抖动 h!>K[*
43 Junction 结点 |}hV_
44 Kelvin connection 开尔文连接 >m66j2(H*Z
45 Lead Frame 引脚框架 H_ecb;|mP
46 Lead Free 无铅 mpcO-%a
47 level-shift 电平移动 S.^/Cl;aj
48 Line regulation 电源调整率 j>D[iHrH
49 load regulation 负载调整率 Z4@%0mFll
50 Lot Number 批号 0m`{m'B4n
51 Low Dropout 低压差 J 'qhY'te
52 Miller 密勒 53 node 节点 1m c'=S{
54 Non-Inverting 非反相 @nPXu2c?u7
55 novel 新颖的 Y/|wOm;|
56 off state 关断状态 $7\!
57 Operating supply voltage 电源工作电压 G]DSwtB?D
58 out drive stage 输出驱动级 86_`Z$ s
59 Out of Phase 异相 ^seb8o7
60 Part Number 产品型号 M.*3qWM
61 pass transistor pass transistor Q^p>hda
62 P-channel MOSFET P沟道MOSFET `Z)]mH\X
63 Phase margin 相位裕度 GxFmw:
64 Phase Node 开关节点 A9:dHOmT^U
65 portable electronics 便携式电子设备 f`^\v
66 power down 掉电 ?G|*=-8
67 Power Good 电源正常 c)5d-3"
68 Power Groud 功率地 oZ
CvEVUk
69 Power Save Mode 节电模式 &O&;v|!9
70 Power up 上电 ZSs)AB_Pe/
71 pull down 下拉 ()[j<KX{.
72 pull up 上拉 Uu}a! V
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) cq?&edjP
74 push pull converter 推挽转换器 F4o)6+YM
75 ramp down 斜降 aC2cyUuaN
76 ramp up 斜升 e7# B?
77 redundant diode 冗余二极管 Ei$@)qS/
78 resistive divider 电阻分压器 S(&]?!
79 ringing 振 铃 +?&|p0
80 ripple current 纹波电流 n"Gow/-;
81 rising edge 上升沿 =x QLf4>
82 sense resistor 检测电阻 nKR=/5a4Y
83 Sequenced Power Supplys 序列电源 *'BA#
/@
84 shoot-through 直通,同时导通 Hea76P5$P+
85 stray inductances. 杂散电感
B#Q=Fo 6
86 sub-circuit 子电路 px7<;(I
87 substrate 基板 mW+QJ` 3
88 Telecom 电信 <0%X:q<
89 Thermal Information 热性能信息 |^&j'k+A
90 thermal slug 散热片 z]\CI:
91 Threshold 阈值 ]CL9N
92 timing resistor 振荡电阻 +6i~Rx>
93 Top FET Top FET
AhNy+p{
94 Trace 线路,走线,引线 ^y1P~4w?
95 Transfer function 传递函数 7y/Pch
96 Trip Point 跳变点 -_4ZT^.Lna
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 2u=Nb0
98 Under Voltage Lock Out (UVLO) 欠压锁定 O]/BNacS
99 Voltage Reference 电压参考 p3f>;|uh_
100 voltage-second product 伏秒积 L)mb.U$`c|
101 zero-pole frequency compensation 零极点频率补偿 :t'*fHi~
102 beat frequency 拍频 }BR@vY'd
103 one shots 单击电路 {&qB!axj
104 scaling 缩放
<dd(i
105 ESR 等效串联电阻 [Page] qh]ILE87(
106 Ground 地电位
)ld !(d=
107 trimmed bandgap 平衡带隙 sz?/4tY
108 dropout voltage 压差 E+tV7xa~
109 large bulk capacitance 大容量电容 8'nxc#&
110 circuit breaker 断路器 4/Wqeq,E8
111 charge pump 电荷泵 faqh }4
112 overshoot 过冲 L FncY(b
X
(0`"rjg
印制电路printed circuit {,Py%.vvR
印制线路 printed wiring i#RT4}l"a
印制板 printed board z4UJo!{S
印制板电路 printed circuit board x9lG$0k:V
印制线路板 printed wiring board X
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印制元件 printed component }ag
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印制接点 printed contact tt%lDr1A)
印制板装配 printed board assembly ;`(l)X+7
板 board :RqTbE4B
刚性印制板 rigid printed board hG8!aJo
挠性印制电路 flexible printed circuit <"SOH;w
挠性印制线路 flexible printed wiring b5Sgf'B^
齐平印制板 flush printed board AfV
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金属芯印制板 metal core printed board )q>mt/,
金属基印制板 metal base printed board r^2>60q'
多重布线印制板 mulit-wiring printed board p^yuz (
塑电路板 molded circuit board YR\pt8(z?
散线印制板 discrete wiring board P_:~!+W,
微线印制板 micro wire board ;<?mMi@<E
积层印制板 buile-up printed board $vQ#ah/k
表面层合电路板 surface laminar circuit LKx<hl$O
埋入凸块连印制板 B2it printed board $7~T+fmF
载芯片板 chip on board 555*IT3b
埋电阻板 buried resistance board e2@{Ab
母板 mother board }r)T75_1
子板 daughter board 4,yS7l
背板 backplane G[[hC[}I
裸板 bare board k|-P&g
键盘板夹心板 copper-invar-copper board !}[,ODJ4 d
动态挠性板 dynamic flex board ='p&T|&
静态挠性板 static flex board =D@+_7\?
可断拼板 break-away planel XLeQxp=
电缆 cable B,f4<
挠性扁平电缆 flexible flat cable (FFC) ];n3H~2
薄膜开关 membrane switch 7"iUyZ(
混合电路 hybrid circuit )uJu.foE
厚膜 thick film ]l~TI8gC
厚膜电路 thick film circuit z(yJ/~m
薄膜 thin film &.ENcEic
薄膜混合电路 thin film hybrid circuit {okx*]PIc
互连 interconnection SMMsXH
导线 conductor trace line jEkO#xI
齐平导线 flush conductor R}S@u@mOE
传输线 transmission line Rb8wq.LqD
跨交 crossover <EHgPlQn
板边插头 edge-board contact G';yb^DB
增强板 stiffener n&j@7R
基底 substrate x'c%w:
基板面 real estate <x^Ab#K"
导线面 conductor side -%5O:n
元件面 component side J2ryYdo>
焊接面 solder side C(Bh<c0@
导电图形 conductive pattern WLB@]JvTBY
非导电图形 non-conductive pattern }K8W%h<3S
基材 base material `o;E
层压板 laminate &:3uK`
覆金属箔基材 metal-clad bade material )e1&[0
覆铜箔层压板 copper-clad laminate (CCL) ]V4Fm{]
复合层压板 composite laminate XlPi)3m4/S
薄层压板 thin laminate >3v
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基体材料 basis material iFypKpHg~
预浸材料 prepreg PU"C('AP
粘结片 bonding sheet }#0i1]n$D
预浸粘结片 preimpregnated bonding sheer D (>,#F
环氧玻璃基板 epoxy glass substrate G1vg2'A
预制内层覆箔板 mass lamination panel WaaF;|,(
内层芯板 core material R[%ZyQ_
粘结层 bonding layer
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粘结膜 film adhesive O:'ENoQ:&
无支撑胶粘剂膜 unsupported adhesive film d;<gwCc
覆盖层 cover layer (cover lay) $P{|^ou3a#
增强板材 stiffener material K]
铜箔面 copper-clad surface mn>$K"_k
去铜箔面 foil removal surface #%=6DHsK
层压板面 unclad laminate surface D<DSK~
基膜面 base film surface 9HtzBS
胶粘剂面 adhesive faec =tS1|_
原始光洁面 plate finish W$I^Ej}>$
粗面 matt finish Al0
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剪切板 cut to size panel 323zR*\m
超薄型层压板 ultra thin laminate .:`+4n
A阶树脂 A-stage resin #D qVh!t"
B阶树脂 B-stage resin T&ECGF;Y/
C阶树脂 C-stage resin 6ojEEM
环氧树脂 epoxy resin hhqSfafUX
酚醛树脂 phenolic resin EGY'a*]cU
聚酯树脂 polyester resin ~$bkWb*RJ
聚酰亚胺树脂 polyimide resin E/OJ}3Rf
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Ci}v +
丙烯酸树脂 acrylic resin 3Y
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三聚氰胺甲醛树脂 melamine formaldehyde resin _N-.=86*
多官能环氧树脂 polyfunctional epoxy resin -Tzp;o
溴化环氧树脂 brominated epoxy resin Ji#"PE/Pt
环氧酚醛 epoxy novolac "L(4 EcO@
氟树脂 fluroresin (D?%(f
硅树脂 silicone resin "\n,vNk
硅烷 silane `ZC{<eVJ}=
聚合物 polymer 4GiHp7Y&A
无定形聚合物 amorphous polymer CSA.6uIT
结晶现象 crystalline polamer 5*q!:$
W
双晶现象 dimorphism BJ
c'4>
共聚物 copolymer E!,+#%O>
合成树脂 synthetic V[w Y;wj
热固性树脂 thermosetting resin [Page] w`N|e0G@
热塑性树脂 thermoplastic resin cEP!DUo
感光性树脂 photosensitive resin a/nKKhXaM
环氧值 epoxy value 0L
^WTq
双氰胺 dicyandiamide {hXIP`
粘结剂 binder tfSY(cXg'T
胶粘剂 adesive R.Plfm06Ue
固化剂 curing agent A<1:vV
阻燃剂 flame retardant &V.\Svm8]
遮光剂 opaquer $RFy9(>
增塑剂 plasticizers <;O-N=
不饱和聚酯 unsatuiated polyester Y`O"+Jr
聚酯薄膜 polyester 3!&PI
聚酰亚胺薄膜 polyimide film (PI) wc&`/'<p
聚四氟乙烯 polytetrafluoetylene (PTFE) d>RoH]K4
增强材料 reinforcing material ="k9
y
折痕 crease (O$PJLI
云织 waviness P
,%IZ.
鱼眼 fish eye ,C=Lu9
毛圈长 feather length GH6 HdZ
厚薄段 mark f>*D@TrU
裂缝 split (P+TOu-y\
捻度 twist of yarn \1[=t+/
浸润剂含量 size content aB=&X