1 backplane 背板 _~umE/tz
2 Band gap voltage reference 带隙电压参考 8n2;47 a
3 benchtop supply 工作台电源 >Sw?F&
4 Block Diagram 方块图 5 Bode Plot 波特图 E&t8nlTx
6 Bootstrap 自举 |}YxxeAk
7 Bottom FET Bottom FET WQ:Y NmQ1p
8 bucket capcitor 桶形电容 (5:pHX`P
9 chassis 机架 Ke:EL;*8k
10 Combi-sense Combi-sense =\ 5f_g2M
11 constant current source 恒流源 :?ZrD,D
12 Core Sataration 铁芯饱和 ]^wr+9zd
13 crossover frequency 交叉频率 @\oZ2sB
14 current ripple 纹波电流 |Go$z3bx
15 Cycle by Cycle 逐周期 [x=(:soEqC
16 cycle skipping 周期跳步 n?D/bX p
17 Dead Time 死区时间 xbcmvJrG
18 DIE Temperature 核心温度 bJ6C7-w:wa
19 Disable 非使能,无效,禁用,关断 e~'z;%O~
20 dominant pole 主极点 Tz9 (</y
21 Enable 使能,有效,启用 -nUK%a"(D
22 ESD Rating ESD额定值 SEi\H$!
23 Evaluation Board 评估板 )ryP K"V
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. D ZZRu8~
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 SS_6VE*sI
25 Failling edge 下降沿 ~g#/q~UE
26 figure of merit 品质因数 H)&iFq
27 float charge voltage 浮充电压 x11r iK
28 flyback power stage 反驰式功率级 ld({1jpX,
29 forward voltage drop 前向压降 7042?\\=
30 free-running 自由运行 \WdSj
31 Freewheel diode 续流二极管 h|Qb:zEP,
32 Full load 满负载 33 gate drive 栅极驱动 >X:!Y[N
34 gate drive stage 栅极驱动级 2Ir*}s2{
35 gerber plot Gerber 图 Ets6tM`
36 ground plane 接地层 ]8$H 'u(C
37 Henry 电感单位:亨利 &IRM<A!8
38 Human Body Model 人体模式 ;0?OBUDO
39 Hysteresis 滞回 Ml?KnSb
40 inrush current 涌入电流 ;+o6"ky5
41 Inverting 反相 D Vg$rm`
42 jittery 抖动 4eSFpy1
43 Junction 结点 $II~tO
44 Kelvin connection 开尔文连接 nsV=
45 Lead Frame 引脚框架 eFA,xzp
46 Lead Free 无铅 w0H#M)c
47 level-shift 电平移动 ;GOu'34j
48 Line regulation 电源调整率 @y * TVy
49 load regulation 负载调整率 L5|g\Y`
50 Lot Number 批号 fshG ~L7S9
51 Low Dropout 低压差 '<ZHzDW@
52 Miller 密勒 53 node 节点 +`V<&
Y-5l
54 Non-Inverting 非反相 X+,0;% p
55 novel 新颖的 =_@) KWeX$
56 off state 关断状态 cuy9QBB
:
57 Operating supply voltage 电源工作电压 8)"lCIf
58 out drive stage 输出驱动级 8uW%jG3/
59 Out of Phase 异相 5~2_wWjX
60 Part Number 产品型号 ;g2UIb?{6
61 pass transistor pass transistor Y2dml!QM
62 P-channel MOSFET P沟道MOSFET Ar?ZU ASJ
63 Phase margin 相位裕度 !
jDopE0L
64 Phase Node 开关节点 w?N>3`Jnf
65 portable electronics 便携式电子设备 nr}Ols
66 power down 掉电 @k'V`ZQF
67 Power Good 电源正常 Ix@B*Xz:`
68 Power Groud 功率地 ,D<U PtPQ
69 Power Save Mode 节电模式 a+~b3
70 Power up 上电 5U]@
Y?
71 pull down 下拉 oj'YDQ^uj
72 pull up 上拉 VUHf-bKl
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) T
7qHw!)
74 push pull converter 推挽转换器 $bZ-b1{c C
75 ramp down 斜降 #O8=M(- V
76 ramp up 斜升 \\Q){\S
77 redundant diode 冗余二极管 }?+tX <j
78 resistive divider 电阻分压器 L?&&4%%
79 ringing 振 铃 A9"!=/~
80 ripple current 纹波电流 `cN8AcRHP
81 rising edge 上升沿 BTG_c_?]e
82 sense resistor 检测电阻 m9&%A0
83 Sequenced Power Supplys 序列电源 jWh)bsqI!
84 shoot-through 直通,同时导通 Zp<#( OIu
85 stray inductances. 杂散电感 X*5N&AJ
86 sub-circuit 子电路 f4+wP/n&
87 substrate 基板 W_3BL]^=
88 Telecom 电信 bH'2iG
89 Thermal Information 热性能信息 Bm%|WQK
90 thermal slug 散热片 /nX_Q?mo
91 Threshold 阈值 8?: 2<
92 timing resistor 振荡电阻 ~.0'v [N
93 Top FET Top FET ^L7!lzyo
94 Trace 线路,走线,引线 ) vVf- zU
95 Transfer function 传递函数 $}z/BV1I
96 Trip Point 跳变点 h5-yhG
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) h9iQn<lp4.
98 Under Voltage Lock Out (UVLO) 欠压锁定 F8Mf,jnPs
99 Voltage Reference 电压参考 m!P<#
|V
100 voltage-second product 伏秒积 X{ 6a
101 zero-pole frequency compensation 零极点频率补偿 elpTak@
102 beat frequency 拍频 sdyNJh7Jr
103 one shots 单击电路 v*<rNZI
104 scaling 缩放 `P*BW,P'T
105 ESR 等效串联电阻 [Page] =20
+(<
106 Ground 地电位 lB_X mI1t
107 trimmed bandgap 平衡带隙 pQC|_T#u
108 dropout voltage 压差 v'^}zO
109 large bulk capacitance 大容量电容 8IBr#+0
110 circuit breaker 断路器 9nFWJn
111 charge pump 电荷泵 ~
L>M-D4o
112 overshoot 过冲 :2C
<;o
Tm7LaM
印制电路printed circuit Y>
}\'$\b
印制线路 printed wiring unbIfl=
印制板 printed board Y"yrc0'&T
印制板电路 printed circuit board Ck"db30.
印制线路板 printed wiring board C+5X8
印制元件 printed component WXDo`_{R
印制接点 printed contact ;fN^MW@&[
印制板装配 printed board assembly {d0-.
板 board d~h;|Bl[
刚性印制板 rigid printed board iDhC_F|
挠性印制电路 flexible printed circuit n4}e!
挠性印制线路 flexible printed wiring ZU+_nWnl
齐平印制板 flush printed board g#7Q-n3^
金属芯印制板 metal core printed board aIrM-c8.O
金属基印制板 metal base printed board FH$q,BI!R
多重布线印制板 mulit-wiring printed board u4m8^fj+T
塑电路板 molded circuit board >kmgYWG
散线印制板 discrete wiring board B
I3fk
微线印制板 micro wire board *,*O.#<6
积层印制板 buile-up printed board @EyB^T/
表面层合电路板 surface laminar circuit "Jg.)1Jw
埋入凸块连印制板 B2it printed board V`W ']
载芯片板 chip on board iSW<7pNq0
埋电阻板 buried resistance board Iwh0PfWJ
母板 mother board d%epM5
子板 daughter board a l6y=;\jZ
背板 backplane l"DHG`kb
裸板 bare board r)K5<[\r
键盘板夹心板 copper-invar-copper board $8AW
动态挠性板 dynamic flex board )|k#cT{=M
静态挠性板 static flex board ~w|h;*Bj
可断拼板 break-away planel ,9_O4O%
电缆 cable kS9;Tj cx
挠性扁平电缆 flexible flat cable (FFC) z9g6%RbwX
薄膜开关 membrane switch )Ho"b
混合电路 hybrid circuit 4 dLnX3 v
厚膜 thick film M6^
\LtFt
厚膜电路 thick film circuit ]FIIs58IM
薄膜 thin film K9p<PLy+
薄膜混合电路 thin film hybrid circuit NqNU:_}
互连 interconnection l}/&6hI+d
导线 conductor trace line pL`Q+}c}
齐平导线 flush conductor J[hmY= ,
传输线 transmission line vTK8t:JQ~
跨交 crossover bGK*1FlH
板边插头 edge-board contact d
ePk}Sn
增强板 stiffener DLqH*U
基底 substrate 7wPI)]$
基板面 real estate dJJq]^|
导线面 conductor side _;Xlw{FN^
元件面 component side 0R[fH
焊接面 solder side y"'p#j
导电图形 conductive pattern a7F_{Mm
非导电图形 non-conductive pattern :9%e:-
基材 base material ?b{y#du2a
层压板 laminate ?E|=eO"I1
覆金属箔基材 metal-clad bade material U1E@pDH
覆铜箔层压板 copper-clad laminate (CCL) F --b,,
复合层压板 composite laminate wCR! bZ w
薄层压板 thin laminate fR'!p: ~
基体材料 basis material :l!sKT?:d!
预浸材料 prepreg k3@d
=k
粘结片 bonding sheet a=A12<
预浸粘结片 preimpregnated bonding sheer 0a8\{(w
环氧玻璃基板 epoxy glass substrate .KC V|x;QW
预制内层覆箔板 mass lamination panel GIc q|Pe
内层芯板 core material izaqEz
粘结层 bonding layer V:J|shRo
粘结膜 film adhesive V6HZvuXV!
无支撑胶粘剂膜 unsupported adhesive film 1hgIR^;[b
覆盖层 cover layer (cover lay) a{^z= =
增强板材 stiffener material A:GqR;;"x>
铜箔面 copper-clad surface CLVT5pj='
去铜箔面 foil removal surface kc P ZIP:
层压板面 unclad laminate surface rg
k1.0U0
基膜面 base film surface Sk!' 2y*@&
胶粘剂面 adhesive faec ht ]n*
原始光洁面 plate finish !-470J
粗面 matt finish :f39)g5>
剪切板 cut to size panel )e`9U.C
超薄型层压板 ultra thin laminate xZ;eV76
A阶树脂 A-stage resin 0=6mb]VUi=
B阶树脂 B-stage resin iv6G9e{cx
C阶树脂 C-stage resin U+ik& R#
环氧树脂 epoxy resin MZ-;'w&Z
酚醛树脂 phenolic resin ]wEI*c(
聚酯树脂 polyester resin :.XlAQR~b
聚酰亚胺树脂 polyimide resin &&P9T/Zks
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin *<:X3|3E
丙烯酸树脂 acrylic resin Ib{l$#
三聚氰胺甲醛树脂 melamine formaldehyde resin (:`4*xK
多官能环氧树脂 polyfunctional epoxy resin @S}j=k
溴化环氧树脂 brominated epoxy resin Ua
6O~,\
环氧酚醛 epoxy novolac :LNZC,-f}5
氟树脂 fluroresin %#v$d
硅树脂 silicone resin &ZC{ _t
硅烷 silane 85Yi2+8f4
聚合物 polymer V'W*'wo
无定形聚合物 amorphous polymer nKr'cb
结晶现象 crystalline polamer ^"
g?m
双晶现象 dimorphism ]J!#"m-]
共聚物 copolymer $#s5y~z
合成树脂 synthetic 9v*y&V9/
热固性树脂 thermosetting resin [Page] U+B"$yBR
热塑性树脂 thermoplastic resin ~zac.:a8
感光性树脂 photosensitive resin a B MV6'
环氧值 epoxy value ejkUNCKQt
双氰胺 dicyandiamide =lk'[P/p`
粘结剂 binder R--s
u:
胶粘剂 adesive PDA9.b<q0
固化剂 curing agent T3
ie-G@<
阻燃剂 flame retardant _zM?"16I}
遮光剂 opaquer YQd($
增塑剂 plasticizers yy8BkG(
不饱和聚酯 unsatuiated polyester @^ YXE,
聚酯薄膜 polyester H.{Fw j4
聚酰亚胺薄膜 polyimide film (PI) uIO,9> ee
聚四氟乙烯 polytetrafluoetylene (PTFE) tg#jjXV\0p
增强材料 reinforcing material ;0oL*d[1Z
折痕 crease &(,&mE
云织 waviness GiuE\J9i
鱼眼 fish eye 'h6G"=+
毛圈长 feather length 86-Rm
厚薄段 mark +,)k@OI
裂缝 split ,JK0N_=
捻度 twist of yarn af>i
浸润剂含量 size content z5iCQ4C<
浸润剂残留量 size residue !BkE-9v?w
处理剂含量 finish level vW*Mf}=
偶联剂 couplint agent Vfy@?x=
&
断裂长 breaking length 13v`rK`7o
吸水高度 height of capillary rise z$%8'
湿强度保留率 wet strength retention ,WOCG2h
白度 whitenness ~?b1x+soV
导电箔 conductive foil eza"<uBr
铜箔 copper foil <HRPloVKo
压延铜箔 rolled copper foil ]$s)6)kW
光面 shiny side ]rY9t@
粗糙面 matte side DU"Gz!X]Jd
处理面 treated side HiK+}?I
防锈处理 stain proofing CT|0KB&
双面处理铜箔 double treated foil 5TuwXz1v
模拟 simulation MYara;k
逻辑模拟 logic simulation uQ[,^Ee&/
电路模拟 circit simulation wj}LVyV
时序模拟 timing simulation iC iKr aW
模块化 modularization |/l] ]+
设计原点 design origin UIf#Gy|l
优化(设计) optimization (design) R#~l[S8u^
供设计优化坐标轴 predominant axis *:
FS/ir
表格原点 table origin %{r3"Q=;W
元件安置 component positioning Hc\@{17
比例因子 scaling factor B!quj!A
扫描填充 scan filling yxpv;v:)=
矩形填充 rectangle filling dT 7fyn
填充域 region filling MNe/H\
实体设计 physical design BRu}"29
逻辑设计 logic design x{w|Hy
逻辑电路 logic circuit F^Jz
层次设计 hierarchical design Q
Rr9|p{
自顶向下设计 top-down design S#p_Y^A
自底向上设计 bottom-up design S m=ln)G=
费用矩阵 cost metrix
}+/Vk
元件密度 component density R>:D&$[RD
自由度 degrees freedom ynMYf
出度 out going degree 8lqmd1v
入度 incoming degree 8b7I\J`
曼哈顿距离 manhatton distance k3B_M9>!
欧几里德距离 euclidean distance 5X];?(VTsb
网络 network NkGtZ.!pk
阵列 array &I'J4gk[
段 segment Lhg
逻辑 logic X{!,j}
逻辑设计自动化 logic design automation =m (u=|N3
分线 separated time rf+}J_
分层 separated layer E,?IIRg&
定顺序 definite sequence `:r-&QdU o
导线(通道) conduction (track) lAA6tlc#C
导线(体)宽度 conductor width l>
H'PP~
导线距离 conductor spacing ckP AH E@
导线层 conductor layer SbL7e#!!
导线宽度/间距 conductor line/space ti1R6oSn
第一导线层 conductor layer No.1 $;ny`^8
圆形盘 round pad a $'U?%
方形盘 square pad A9ld9R
菱形盘 diamond pad _hJ+8B^`
长方形焊盘 oblong pad {GT5
子弹形盘 bullet pad _[&.`jTFn
泪滴盘 teardrop pad >HwVP.~HN
雪人盘 snowman pad Snmv
形盘 V-shaped pad V pg,JYn
环形盘 annular pad H[pvC=O=
非圆形盘 non-circular pad Xs$a^zZ
隔离盘 isolation pad @m`H~]AU
非功能连接盘 monfunctional pad qycf;Kl:6
偏置连接盘 offset land Q8l vwip
腹(背)裸盘 back-bard land &y73^"%
盘址 anchoring spaur ft{i6}
连接盘图形 land pattern ZK2&l8
连接盘网格阵列 land grid array [Ax:gj
孔环 annular ring ?AxB0d9z
元件孔 component hole zJ1M$U
安装孔 mounting hole 9$[MM*r
支撑孔 supported hole {s6#h #U
非支撑孔 unsupported hole u0? TMy.%
导通孔 via %O[1yZh
\
镀通孔 plated through hole (PTH) dn42'(p@G
余隙孔 access hole Q-G8Fo%#,E
盲孔 blind via (hole) 2|RxowXZ"
埋孔 buried via hole Eoo[H2=^H
埋,盲孔 buried blind via ,_7m<(/f
任意层内部导通孔 any layer inner via hole ' _K`1U
全部钻孔 all drilled hole _m
a;b<I/<
定位孔 toaling hole g?j^d:
无连接盘孔 landless hole w*@9:+
中间孔 interstitial hole %M^Q{`
:5
无连接盘导通孔 landless via hole ~% ]V,-4
引导孔 pilot hole i6;rh-M?.
端接全隙孔 terminal clearomee hole v{1g`E
准尺寸孔 dimensioned hole [Page] MD4mh2
在连接盘中导通孔 via-in-pad ? )IH#kL
孔位 hole location 3|3ad'
孔密度 hole density #t# S(A9)
孔图 hole pattern wc}x
[cS
钻孔图 drill drawing v=uQ8_0~N
装配图assembly drawing xTcY&
参考基准 datum referan ,gkWksl9
1) 元件设备 ">fRM=fl
&
}"I!
三绕组变压器:three-column transformer ThrClnTrans \
sz ](X
双绕组变压器:double-column transformer DblClmnTrans I;$tBgOWq
电容器:Capacitor !HXsxNe
并联电容器:shunt capacitor !([ v=O#
电抗器:Reactor QqeF
母线:Busbar b3GTsX\2|
输电线:TransmissionLine Xh~oDnP
发电厂:power plant 1&=2"
断路器:Breaker FY+@fy
刀闸(隔离开关):Isolator IL*MB;0>
分接头:tap 9/#b1NGv
电动机:motor wlP%
U
(2) 状态参数 >Mm.MNU
98{n6$\
有功:active power $K|2k7
无功:reactive power n2F*a
电流:current D2:ShyYAS
容量:capacity 0 R&7vn
电压:voltage OXoEA a
档位:tap position 4 T/ ~erc
有功损耗:reactive loss *Hh*!ePp
无功损耗:active loss aJ]t1
功率因数:power-factor @$!"}xDR'
功率:power \/y&l\ k)
功角:power-angle B,4GxoX`
电压等级:voltage grade ; Oz
p
空载损耗:no-load loss
yW_goS0
铁损:iron loss R*vfp?x
铜损:copper loss H[r6 4~Sth
空载电流:no-load current 4)N~*+~\h
阻抗:impedance ].gC9@C:$i
正序阻抗:positive sequence impedance `
-<S13
负序阻抗:negative sequence impedance iW?NxP
零序阻抗:zero sequence impedance )YLZ"@
电阻:resistor O=Vj*G,
电抗:reactance `zcpaE.@
电导:conductance mj2sbRiSR=
电纳:susceptance wqXo]dX
无功负载:reactive load 或者QLoad yv5c0G.D
有功负载: active load PLoad wmX * n'l
遥测:YC(telemetering) JCITIjD7=
遥信:YX k0DX|O8mXV
励磁电流(转子电流):magnetizing current ".fnx8v,
定子:stator &gvX<X4e
功角:power-angle 4-xg+*()
上限:upper limit maQOU1
下限:lower limit Y3luU&'
并列的:apposable Bq\WG=Fd
高压: high voltage ]G=^7O]`C!
低压:low voltage 'KNUPi|
中压:middle voltage qI\B;&hr(
电力系统 power system <UJ5n) }"\
发电机 generator `&A-m8X
励磁 excitation P-\T BS_O
励磁器 excitor 55x.Q
电压 voltage p:|p?
电流 current <ZeZq
母线 bus oVnHbvP1X
变压器 transformer !2]G.|5/A
升压变压器 step-up transformer 9'\*Ip^
高压侧 high side )XD$YI
输电系统 power transmission system uacVF[9|W
输电线 transmission line x$V[xX
固定串联电容补偿fixed series capacitor compensation 8~h.i1L
稳定 stability If. hA}
电压稳定 voltage stability ]3yaIlpD1
功角稳定 angle stability [Q20c<,
暂态稳定 transient stability {UEZ:a
电厂 power plant 0o&7l%Y/
能量输送 power transfer ?|we.{
交流 AC Aj2yAg
装机容量 installed capacity lV<j?I~?Q
电网 power system ,O"zz7
落点 drop point EWoGdH|
开关站 switch station &1Idv}@!
双回同杆并架 double-circuit lines on the same tower r;&rc:?A
变电站 transformer substation B976{;QvXV
补偿度 degree of compensation vC!}%sxVw_
高抗 high voltage shunt reactor ~G`(=\_0
无功补偿 reactive power compensation t[ ^68]
故障 fault mE_?E&T`|
调节 regulation *.NVc
裕度 magin 1'[_J
三相故障 three phase fault Ja#ti y
故障切除时间 fault clearing time FFqqAT5
极限切除时间 critical clearing time }Z}4_/E
切机 generator triping rQPV@J]:
高顶值 high limited value XQL]I$?
强行励磁 reinforced excitation elm]e2)F
线路补偿器 LDC(line drop compensation) >`c-Fqk
机端 generator terminal '0>w_ge4
静态 static (state) +&hd3
动态 dynamic (state) 8;]U:tv
单机无穷大系统 one machine - infinity bus system ojZvgF
机端电压控制 AVR c2<JS:!*
电抗 reactance F2RU7o'f.
电阻 resistance 3 ]}wZY0
功角 power angle b7h0V4w
有功(功率) active power Kr'5iFK7
无功(功率) reactive power o72G oUfs
功率因数 power factor =h9&`iwiu
无功电流 reactive current ht%:e?@i
下降特性 droop characteristics zDO`w0N
斜率 slope [1{uK&$e
额定 rating vEIDf{
变比 ratio ;y"quJ'O
参考值 reference value X8 (,
,>_
电压互感器 PT w{;esU
分接头 tap !4B($]t
下降率 droop rate t1)Qa(#]
仿真分析 simulation analysis *^q%b/ f
传递函数 transfer function PYp<eo\
框图 block diagram 4=E9$.3a
受端 receive-side (\<