1 backplane 背板 <
R@&<E6
2 Band gap voltage reference 带隙电压参考 71&`6#
3 benchtop supply 工作台电源 Q"xDRQA
4 Block Diagram 方块图 5 Bode Plot 波特图 _x#r,1V+D
6 Bootstrap 自举 ";0-9*I
7 Bottom FET Bottom FET Q%GLT,f1.
8 bucket capcitor 桶形电容 SR)@'-Wd
9 chassis 机架 |("5 :m
10 Combi-sense Combi-sense 78b9Sdi&
11 constant current source 恒流源 A@k=Mk
12 Core Sataration 铁芯饱和 x~yd/ R
13 crossover frequency 交叉频率 HZ2 zL17
14 current ripple 纹波电流 ~b4fk^u`+
15 Cycle by Cycle 逐周期 [7)#3
16 cycle skipping 周期跳步 8>:2li
17 Dead Time 死区时间 IZ4jFgpR
18 DIE Temperature 核心温度 M[T!AO-S$
19 Disable 非使能,无效,禁用,关断 9>@"W-
20 dominant pole 主极点 Sag\wKV8
21 Enable 使能,有效,启用 h"nv[0!)
22 ESD Rating ESD额定值 QaEXk5>e
23 Evaluation Board 评估板 7@VR:~n}k
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. w@f_TG"Vt
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 WHF:>0B
25 Failling edge 下降沿 Fn%:0j
26 figure of merit 品质因数 ==j39
27 float charge voltage 浮充电压 f.r-,%^6{
28 flyback power stage 反驰式功率级 0P53dF
29 forward voltage drop 前向压降 54LCoG/
30 free-running 自由运行 C{S6Ri
31 Freewheel diode 续流二极管 Z=sAR(n}~
32 Full load 满负载 33 gate drive 栅极驱动 1Kebl
34 gate drive stage 栅极驱动级 <~8W>Y\m
35 gerber plot Gerber 图 ')FNudsC
36 ground plane 接地层 [K9q+
37 Henry 电感单位:亨利
Q{Bj(f
38 Human Body Model 人体模式 bm7$D Kp#
39 Hysteresis 滞回 -)<Nd:A
40 inrush current 涌入电流 f%auz4CZz
41 Inverting 反相 ]g+(#x_.?
42 jittery 抖动 pV-.r-P
43 Junction 结点 +l3
vIN
44 Kelvin connection 开尔文连接 sQH.}W$C
45 Lead Frame 引脚框架 i|d41u;@
46 Lead Free 无铅 Vgm{=$
47 level-shift 电平移动 J<zg 'Jk^
48 Line regulation 电源调整率 ,wEM
49 load regulation 负载调整率 >\p}UPx
50 Lot Number 批号 Ul@'z|
51 Low Dropout 低压差 y! 1NS
52 Miller 密勒 53 node 节点 <?nr"V
54 Non-Inverting 非反相 <*5D0q#~"
55 novel 新颖的 |m EJJg`"7
56 off state 关断状态 0UB'6wRVo
57 Operating supply voltage 电源工作电压 U&a]gkr
58 out drive stage 输出驱动级 nMbV{h ,
59 Out of Phase 异相 E|Lh$9XONA
60 Part Number 产品型号 nW%c95E
61 pass transistor pass transistor u1kbWbHu(
62 P-channel MOSFET P沟道MOSFET MR6vr.~
63 Phase margin 相位裕度 wb9zJAsc
64 Phase Node 开关节点 ! O>mu6:Rf
65 portable electronics 便携式电子设备 M*{e e0\`r
66 power down 掉电 RGKJO_*J2
67 Power Good 电源正常 |3cR'|<Ual
68 Power Groud 功率地 ,?f(~<Aj
69 Power Save Mode 节电模式 g?+P&FL#I
70 Power up 上电 Stw6%T-
71 pull down 下拉 8ksDXf`.
72 pull up 上拉 8UZEC-K
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) *Ee# x!O
74 push pull converter 推挽转换器 ixkg,
75 ramp down 斜降 %~[F^
76 ramp up 斜升 / L8=8
77 redundant diode 冗余二极管 0nuFWV
78 resistive divider 电阻分压器 [6tQv<}^
79 ringing 振 铃 K&h|r`W(
80 ripple current 纹波电流 Y#5S;?bR
81 rising edge 上升沿 Q&LkST-i
82 sense resistor 检测电阻 +Snjb0
83 Sequenced Power Supplys 序列电源 (^4%Fk&I-
84 shoot-through 直通,同时导通 s_8!x
85 stray inductances. 杂散电感 \#}%E h
b
86 sub-circuit 子电路 wDG4rN9x
87 substrate 基板 sOW|TN>y\
88 Telecom 电信 ] ge-b\
89 Thermal Information 热性能信息 kgu+q\?
90 thermal slug 散热片 b +_E)4
91 Threshold 阈值 h^)2:0#{I
92 timing resistor 振荡电阻 o_5@R+&
93 Top FET Top FET U|QDV16f
94 Trace 线路,走线,引线 -d~'tti
95 Transfer function 传递函数 WveFB%@`;
96 Trip Point 跳变点 "8I4]'
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) !]nCeo
98 Under Voltage Lock Out (UVLO) 欠压锁定 ublY!Af
99 Voltage Reference 电压参考 A.FI] K@
100 voltage-second product 伏秒积 +A3H#'
101 zero-pole frequency compensation 零极点频率补偿 VGq]id{*$
102 beat frequency 拍频 {mQJ6
G'ny
103 one shots 单击电路 y()( 8L
104 scaling 缩放 1d"P) 3dQ
105 ESR 等效串联电阻 [Page] BSY#xe V
106 Ground 地电位 -iHhpD9"X
107 trimmed bandgap 平衡带隙 U{Z>y?V/
108 dropout voltage 压差 @6SSk=9_S
109 large bulk capacitance 大容量电容 ^b~5zhY&
110 circuit breaker 断路器 `<n:D`{dZ
111 charge pump 电荷泵 kes'q8k
112 overshoot 过冲 e{,/
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印制电路printed circuit s$_#T
印制线路 printed wiring G;;~xfE'
印制板 printed board I'C,'
印制板电路 printed circuit board wW4S@m
印制线路板 printed wiring board qu%s 7+
印制元件 printed component 'Ap5Aq
印制接点 printed contact %U7B0-
印制板装配 printed board assembly @gc"-V*-/
板 board Vvj]2V3
刚性印制板 rigid printed board Tjqn::~D
挠性印制电路 flexible printed circuit fLAF/#\2
挠性印制线路 flexible printed wiring (Nahtx!/9
齐平印制板 flush printed board xJhbGK
金属芯印制板 metal core printed board F{,O+\
金属基印制板 metal base printed board
P+0xi
多重布线印制板 mulit-wiring printed board `9l\~t(M
塑电路板 molded circuit board KF)i66
散线印制板 discrete wiring board z<>_*Lfj
微线印制板 micro wire board t^5_;sJQ
积层印制板 buile-up printed board }nl)*l
表面层合电路板 surface laminar circuit $wTX
埋入凸块连印制板 B2it printed board HV.7IyBA^
载芯片板 chip on board P1n@E*~V5
埋电阻板 buried resistance board F948%?a
母板 mother board =jt_1L4
子板 daughter board 1`{ib
背板 backplane h6 i{5\7.
裸板 bare board @`D6F;R
键盘板夹心板 copper-invar-copper board 8A .7=C' z
动态挠性板 dynamic flex board _4$DnQ6&
静态挠性板 static flex board sIsu >eL
可断拼板 break-away planel .<%M8rcj
电缆 cable /p0LtUMu
挠性扁平电缆 flexible flat cable (FFC) Rn_c9p
薄膜开关 membrane switch ,IE0+!I
混合电路 hybrid circuit 9K<a}QJP
厚膜 thick film gUA}%YXe
厚膜电路 thick film circuit Zd ,=
薄膜 thin film J
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薄膜混合电路 thin film hybrid circuit -d'|X`^nE
互连 interconnection "lf3hWGw
导线 conductor trace line Ai18]QD-
齐平导线 flush conductor 6~WE#z_
传输线 transmission line wf%Ep#^6}
跨交 crossover f*}E\,V"&
板边插头 edge-board contact %)Dd{|c
增强板 stiffener GuvF
基底 substrate 79g>7<vp
基板面 real estate Po.BcytM
导线面 conductor side :OaQq@V
元件面 component side Ky$G$H
焊接面 solder side ]_8I_VcQ
导电图形 conductive pattern [_b='/8
非导电图形 non-conductive pattern '/g+;^_cB
基材 base material ,D,f9
层压板 laminate ilpZ/Rs
覆金属箔基材 metal-clad bade material *%'7~58ObS
覆铜箔层压板 copper-clad laminate (CCL) yuDd%
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复合层压板 composite laminate ItE~MJ5p
薄层压板 thin laminate _C=[bI@
基体材料 basis material iGVb.=)
预浸材料 prepreg eh4"_t
粘结片 bonding sheet WV"QY/e3
预浸粘结片 preimpregnated bonding sheer VQMd[/
环氧玻璃基板 epoxy glass substrate *[:CbFE0y
预制内层覆箔板 mass lamination panel luk2fi<$
内层芯板 core material k+GnF00N^8
粘结层 bonding layer BV?N_/DXp
粘结膜 film adhesive sNmC#,
无支撑胶粘剂膜 unsupported adhesive film @i-@mxk6<
覆盖层 cover layer (cover lay) FKnQwX.0
增强板材 stiffener material oHd0
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铜箔面 copper-clad surface
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去铜箔面 foil removal surface )Q/`o,Vm
层压板面 unclad laminate surface aw%vu
基膜面 base film surface 6@;L$QYY-V
胶粘剂面 adhesive faec QYw4kD}
原始光洁面 plate finish yPG\ &Bo
粗面 matt finish LY:?OGh
剪切板 cut to size panel `+Z#*lj|@
超薄型层压板 ultra thin laminate 7C7(bg,7^
A阶树脂 A-stage resin @^6OV)
B阶树脂 B-stage resin (`.qG
&6p
C阶树脂 C-stage resin X3L[y\
环氧树脂 epoxy resin f<4q ]HCa
酚醛树脂 phenolic resin cW\Y?x
聚酯树脂 polyester resin !XA%[u
聚酰亚胺树脂 polyimide resin AnE_<sPA
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin qs1.@l("
丙烯酸树脂 acrylic resin bW.zxQ:
三聚氰胺甲醛树脂 melamine formaldehyde resin wp*&&0O!
多官能环氧树脂 polyfunctional epoxy resin To{G#QEgG
溴化环氧树脂 brominated epoxy resin K(KP3Q
环氧酚醛 epoxy novolac 2n;;Tso"
氟树脂 fluroresin CSqb)\8Oi*
硅树脂 silicone resin ~EWfEHf*BJ
硅烷 silane <bXWkj
聚合物 polymer qb&NS4#
无定形聚合物 amorphous polymer 1L=Qg4 H
结晶现象 crystalline polamer 6O@ ^`T
双晶现象 dimorphism lJ] \
共聚物 copolymer +'Y(V&
合成树脂 synthetic
uC*:#[
热固性树脂 thermosetting resin [Page] #JR ,C
-w
热塑性树脂 thermoplastic resin (6#yw`\
感光性树脂 photosensitive resin U[e8K
环氧值 epoxy value vV\F^
双氰胺 dicyandiamide LVFsd6:h
粘结剂 binder $aPHl
胶粘剂 adesive 3auJ^B}
固化剂 curing agent g=g.GpFt
阻燃剂 flame retardant iraRB~
遮光剂 opaquer ~eV!!38
J
增塑剂 plasticizers MLD>"W
不饱和聚酯 unsatuiated polyester /mBBeg^a
聚酯薄膜 polyester PVS<QN%
聚酰亚胺薄膜 polyimide film (PI) vXM/nw|5
聚四氟乙烯 polytetrafluoetylene (PTFE) &kjwIg{
增强材料 reinforcing material n:^"[Le
折痕 crease Fx[A8G
云织 waviness <X I35\^
鱼眼 fish eye #C,f/PXfaB
毛圈长 feather length ci_v7Jnwo
厚薄段 mark e=n{f*KG`
裂缝 split Y:"v=EhB
捻度 twist of yarn |`Oa/\U
浸润剂含量 size content ADv"_bB:h
浸润剂残留量 size residue 'K@{vB
处理剂含量 finish level ,7fc41O3V
偶联剂 couplint agent e9Ul A
断裂长 breaking length q~Q)'*m
吸水高度 height of capillary rise qv0
DrL,3
湿强度保留率 wet strength retention ~
S?-{X+
白度 whitenness *e-ptgO
导电箔 conductive foil ULNAH`{D
铜箔 copper foil BheEI;}
压延铜箔 rolled copper foil [6_Du6\h
光面 shiny side `J=1&ae