1 backplane 背板 N y_d
2 Band gap voltage reference 带隙电压参考 N!R>L{H>
3 benchtop supply 工作台电源 'qR)f\em
4 Block Diagram 方块图 5 Bode Plot 波特图 *?sdWRbu}l
6 Bootstrap 自举 MrXmX[1-
7 Bottom FET Bottom FET ;vM&se63
8 bucket capcitor 桶形电容 lu~<pfg
9 chassis 机架 nf#;]FijB
10 Combi-sense Combi-sense G 3))3]
11 constant current source 恒流源 9<qAf`
12 Core Sataration 铁芯饱和 a,<l_#'
13 crossover frequency 交叉频率 )b^yAzL?
14 current ripple 纹波电流 ^0oOiZs
15 Cycle by Cycle 逐周期 #mhR^60,
16 cycle skipping 周期跳步 u.!}s2wT#
17 Dead Time 死区时间 {8b6M
18 DIE Temperature 核心温度 } a#RX$d&
19 Disable 非使能,无效,禁用,关断 @smjXeFo
20 dominant pole 主极点 L1P.@hJ
21 Enable 使能,有效,启用 S\$=b_.
22 ESD Rating ESD额定值 )"W__U0
23 Evaluation Board 评估板 0hJ,l.
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ]70V
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 TVy\%FP^L
25 Failling edge 下降沿 Tj0qq .
26 figure of merit 品质因数 [ PXv8K%]p
27 float charge voltage 浮充电压 Sv&_LZ-"P
28 flyback power stage 反驰式功率级 ScN'|Ia.-
29 forward voltage drop 前向压降 [wp(s2=
30 free-running 自由运行 "d1~(0=6<m
31 Freewheel diode 续流二极管 eI20)t`j
32 Full load 满负载 33 gate drive 栅极驱动 *@;Pns]L-
34 gate drive stage 栅极驱动级 KK-}&N8
35 gerber plot Gerber 图 .J?cV;:`
36 ground plane 接地层 Ql 2zC9C
37 Henry 电感单位:亨利 ~m`j=ot
38 Human Body Model 人体模式 pi?$h"y7Q
39 Hysteresis 滞回 i
n$~(+
40 inrush current 涌入电流 mbSG
41 Inverting 反相 tk]>\}%
42 jittery 抖动 qYba%g9RN(
43 Junction 结点 !>E$2}Q|]
44 Kelvin connection 开尔文连接 d8N{sT
45 Lead Frame 引脚框架 l$1
]
46 Lead Free 无铅 WdtZ{H
47 level-shift 电平移动 GXk]u
48 Line regulation 电源调整率 Sbzx7 *X
49 load regulation 负载调整率 h*X5Oh6
50 Lot Number 批号 K9\r2w'T'
51 Low Dropout 低压差 ;T-`~
52 Miller 密勒 53 node 节点 zCz"[9k
54 Non-Inverting 非反相 ]Lb Fh5;s
55 novel 新颖的 8uh^%La8b.
56 off state 关断状态 ZovF]jf k
57 Operating supply voltage 电源工作电压 xLN$!9t
58 out drive stage 输出驱动级 #(Xv\OE
59 Out of Phase 异相 nO#a|~-))
60 Part Number 产品型号 ~DJI Lc
61 pass transistor pass transistor !c2<-3e
62 P-channel MOSFET P沟道MOSFET s:/Wz39SY3
63 Phase margin 相位裕度 NflwmMJ
64 Phase Node 开关节点 xR~9|H9a
65 portable electronics 便携式电子设备 P7`RAz
66 power down 掉电 BV"l;&F[
67 Power Good 电源正常 vV
PK
68 Power Groud 功率地 >~}}*yp
69 Power Save Mode 节电模式 H`T8ydNXa
70 Power up 上电 j|-{*t{/x
71 pull down 下拉 DeK&_)g| Z
72 pull up 上拉 xoe/I[P]U
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ^1w<wB\B
74 push pull converter 推挽转换器 MkK6.qV\z
75 ramp down 斜降 qsG}A
76 ramp up 斜升 HrK7qLw7
77 redundant diode 冗余二极管 16-1&WuY@
78 resistive divider 电阻分压器 QHHj.ZY
79 ringing 振 铃 *KYh_i
80 ripple current 纹波电流 ]^>RBegJBO
81 rising edge 上升沿 7X{@$>+S
82 sense resistor 检测电阻 =Sjf-o1V
83 Sequenced Power Supplys 序列电源 y F;KyY{
84 shoot-through 直通,同时导通 zqCr'$
85 stray inductances. 杂散电感 v;.w*x8Jw
86 sub-circuit 子电路
qZ<|A%WQ
87 substrate 基板
[1Q:
88 Telecom 电信 {36QZV*P
89 Thermal Information 热性能信息 Dzr(Fb
90 thermal slug 散热片 Bk;/>gD
91 Threshold 阈值 os[i
92 timing resistor 振荡电阻 6^QSV@N|
93 Top FET Top FET gR76g4|=;
94 Trace 线路,走线,引线 3kW%,d*_
95 Transfer function 传递函数 BJP^?FUd=,
96 Trip Point 跳变点 undH{w=
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) R<Uu(-O-
98 Under Voltage Lock Out (UVLO) 欠压锁定 k vF[d{l
99 Voltage Reference 电压参考 N"Cd{3
100 voltage-second product 伏秒积 lPA:ho/`:
101 zero-pole frequency compensation 零极点频率补偿 zbZN-j#
102 beat frequency 拍频 g0k{b
103 one shots 单击电路 {C'9?4&
104 scaling 缩放 jRBKy8?[C
105 ESR 等效串联电阻 [Page] *@E&O^%cO
106 Ground 地电位 ,R*YI
107 trimmed bandgap 平衡带隙 4"et4Y7
108 dropout voltage 压差 F* _ytL
109 large bulk capacitance 大容量电容 |>v8yS5
110 circuit breaker 断路器 l0BYv&tu
111 charge pump 电荷泵 rrrn8b6
112 overshoot 过冲 '/GZ/$a_l
nV_[40KP_
印制电路printed circuit *n*po.Xr
印制线路 printed wiring O[5u6heNMr
印制板 printed board Senb_?
印制板电路 printed circuit board w1,6%?p(O
印制线路板 printed wiring board P~@.(hed
印制元件 printed component qlg?'l$03)
印制接点 printed contact /_ RrNzqy
印制板装配 printed board assembly D {N,7kT
板 board ~+&Z4CYb
刚性印制板 rigid printed board l.%[s6
挠性印制电路 flexible printed circuit +`+r\*C5
挠性印制线路 flexible printed wiring QN8.FiiD
齐平印制板 flush printed board wh#x`Nc
金属芯印制板 metal core printed board TIVrbO\!o
金属基印制板 metal base printed board $@eFSA5k,7
多重布线印制板 mulit-wiring printed board *GC9o/
塑电路板 molded circuit board ~IS3i'bh
散线印制板 discrete wiring board ]GmXZi
微线印制板 micro wire board QvDD
积层印制板 buile-up printed board X0BBJ( e
表面层合电路板 surface laminar circuit *:,y`!F=y
埋入凸块连印制板 B2it printed board i3<ZFR
载芯片板 chip on board (I ~r~5^
埋电阻板 buried resistance board "a]Ff&T-
母板 mother board mAuN* (
子板 daughter board 6#(rWW"_
背板 backplane /u pDbP.O
裸板 bare board a{4RG(I_
键盘板夹心板 copper-invar-copper board jbs)]fqC;
动态挠性板 dynamic flex board }x+s5a;!3/
静态挠性板 static flex board (nt=
可断拼板 break-away planel \"=b8x
电缆 cable 0RkiD8U5
挠性扁平电缆 flexible flat cable (FFC) V"W)u#4,
薄膜开关 membrane switch k%h%mz
混合电路 hybrid circuit w<G'gi]
厚膜 thick film
A9C
厚膜电路 thick film circuit ">'`{mXew
薄膜 thin film H<C+rAIb
薄膜混合电路 thin film hybrid circuit PP!}w
互连 interconnection Jsw%.<
导线 conductor trace line lPOcX'3\
齐平导线 flush conductor Nh+ZSV4WJ:
传输线 transmission line 3PRK.vf
跨交 crossover IWP[?U=
板边插头 edge-board contact /+{1;}AT
增强板 stiffener 9/4Bx!~A
基底 substrate "6xTh0D
基板面 real estate zR6^rq*
导线面 conductor side {,
zg
元件面 component side I+FQ2\J*H
焊接面 solder side &dvL`
导电图形 conductive pattern a!*K)x,"<
非导电图形 non-conductive pattern |c3Yh,Sv
基材 base material [y1
x`WOk9
层压板 laminate vGI?X#w3
覆金属箔基材 metal-clad bade material UWW_[dJr
覆铜箔层压板 copper-clad laminate (CCL) YRs32vVz
复合层压板 composite laminate &Ez]pKjB
薄层压板 thin laminate Q(7M_2e7
基体材料 basis material M,/{ 53
预浸材料 prepreg (d$ksf_[%f
粘结片 bonding sheet M`gr*p
预浸粘结片 preimpregnated bonding sheer O/bpm-h`8c
环氧玻璃基板 epoxy glass substrate ey! {
预制内层覆箔板 mass lamination panel ~@N0$S
内层芯板 core material }5a$Ka-
粘结层 bonding layer Hsi<!g.
粘结膜 film adhesive \ws^L,h
无支撑胶粘剂膜 unsupported adhesive film iJem9XXb
覆盖层 cover layer (cover lay) 1)N{!w`
增强板材 stiffener material {wyf>L0j
铜箔面 copper-clad surface /8tF7Mmr
去铜箔面 foil removal surface eK'ztqQ
层压板面 unclad laminate surface v#o<.
Ig
基膜面 base film surface H_+F~P5RC
胶粘剂面 adhesive faec q'4qSu
原始光洁面 plate finish (b4;c=<[{
粗面 matt finish 7l|D!`BS
剪切板 cut to size panel :c^9\8S
超薄型层压板 ultra thin laminate 2$%E:J+2:$
A阶树脂 A-stage resin Y~ ( <H e?
B阶树脂 B-stage resin FQGh+.U
C阶树脂 C-stage resin R6/vhze4L2
环氧树脂 epoxy resin sPUn"7
酚醛树脂 phenolic resin +/Q?<*[
聚酯树脂 polyester resin a>/cVu'kz
聚酰亚胺树脂 polyimide resin ?f ]!~
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Bq) aA)gF
丙烯酸树脂 acrylic resin 1X$hwkof
三聚氰胺甲醛树脂 melamine formaldehyde resin c
DO<z
多官能环氧树脂 polyfunctional epoxy resin X__>r ?oJ
溴化环氧树脂 brominated epoxy resin H&3i[D!p
环氧酚醛 epoxy novolac k6PHyt`3'
氟树脂 fluroresin ~[d |:]
硅树脂 silicone resin \4r?=5v*
硅烷 silane c<J/I_!
聚合物 polymer Bm&% N?9
无定形聚合物 amorphous polymer _ZD8/?2QV
结晶现象 crystalline polamer KW5u.phv
双晶现象 dimorphism !;ipLC;e}
共聚物 copolymer 0nV|(M0lu?
合成树脂 synthetic PK7
kpC
热固性树脂 thermosetting resin [Page] rS/}!|uAu
热塑性树脂 thermoplastic resin &T)h9fyc
感光性树脂 photosensitive resin c _faW
环氧值 epoxy value g<"k\qs7
双氰胺 dicyandiamide Jf|6 FQo&
粘结剂 binder E8QY6 gKF
胶粘剂 adesive :4,
OA
固化剂 curing agent /"*eMe!=
阻燃剂 flame retardant [J71aH
遮光剂 opaquer @p}"B9h*^
增塑剂 plasticizers bPHqZ*f
不饱和聚酯 unsatuiated polyester wqyrs|P
聚酯薄膜 polyester uh_2yw_
聚酰亚胺薄膜 polyimide film (PI) 2UGnRZ8:1Y
聚四氟乙烯 polytetrafluoetylene (PTFE) lImg+r T{
增强材料 reinforcing material 16N+
折痕 crease zjVQ \L
云织 waviness <h7FS90S
鱼眼 fish eye !^EdB}@yS
毛圈长 feather length 0cxk)l%
厚薄段 mark Yo$
xz
裂缝 split g.re`m|Aj
捻度 twist of yarn c7fQ{"f 3B
浸润剂含量 size content "o
^cv
浸润剂残留量 size residue '3MCb
处理剂含量 finish level ozr82
偶联剂 couplint agent
")cJA f
断裂长 breaking length 6YCFSvA#/
吸水高度 height of capillary rise %tRQK$]c
湿强度保留率 wet strength retention ZLRAiL
白度 whitenness M((]> *g
导电箔 conductive foil n,E=eNc
铜箔 copper foil zu@5,AH
压延铜箔 rolled copper foil RXF%A5FXh
光面 shiny side 609_ZW;)
粗糙面 matte side UD@u hL
处理面 treated side ;F:~HrxT}
防锈处理 stain proofing ue;o:>G
双面处理铜箔 double treated foil @\|W#,~
模拟 simulation ,GH;jw)P
逻辑模拟 logic simulation |dxcEjcY_
电路模拟 circit simulation WLe9m02r
时序模拟 timing simulation pDg_^|
模块化 modularization Fu%%:3_
设计原点 design origin AKbrXKx
优化(设计) optimization (design) |<q9Ee
供设计优化坐标轴 predominant axis K3WhF
表格原点 table origin q|23l1PI
元件安置 component positioning 4CT _MAj
比例因子 scaling factor +TQMA>@g<
扫描填充 scan filling
EGKj1_ml
矩形填充 rectangle filling %SX)Z
i=O
填充域 region filling {B_pjs
实体设计 physical design y
;$8C
逻辑设计 logic design 6_s_2cr
逻辑电路 logic circuit HZHzjrx
层次设计 hierarchical design APC,p,"
自顶向下设计 top-down design E(;V.=I
自底向上设计 bottom-up design bJz}\[z
费用矩阵 cost metrix q*^F"D:?k
元件密度 component density fW,,@2P
自由度 degrees freedom 7%E]E,f/#
出度 out going degree Q--VZqn
入度 incoming degree R6N+c\W
曼哈顿距离 manhatton distance  conduction (track) 4a&*?=GG
导线(体)宽度 conductor width ,.cNs5[t
导线距离 conductor spacing Oh\+cvbG
导线层 conductor layer #s!q(Rc
导线宽度/间距 conductor line/space qOusO6
第一导线层 conductor layer No.1 /%#LA
圆形盘 round pad >|"mhNF
方形盘 square pad FuiEy=+
菱形盘 diamond pad P?y3YxS
长方形焊盘 oblong pad (&w'"-`
子弹形盘 bullet pad M%3 \]&
泪滴盘 teardrop pad d"1DE
雪人盘 snowman pad u]B15mT?
形盘 V-shaped pad V P~>E
环形盘 annular pad ^&AhWm7\
非圆形盘 non-circular pad S~8w- lG!
隔离盘 isolation pad =?*6lS}gy
非功能连接盘 monfunctional pad T[z]~MJL
偏置连接盘 offset land cmzu
@zq
腹(背)裸盘 back-bard land y;!q E~!3
盘址 anchoring spaur PP{CK4
连接盘图形 land pattern $Vi[195]2
连接盘网格阵列 land grid array hdw-ge m{?
孔环 annular ring ,s%1#cbR
元件孔 component hole aw0;
安装孔 mounting hole X" hoDg
支撑孔 supported hole BVKr 2v
非支撑孔 unsupported hole Wz}8O]#/.
导通孔 via .HM1c
镀通孔 plated through hole (PTH) uB(16|W>S
余隙孔 access hole Zy}Qc")Z
盲孔 blind via (hole) RGeM.
埋孔 buried via hole 23lLoyN
埋,盲孔 buried blind via p)t1]<,Of
任意层内部导通孔 any layer inner via hole LDj'L~H
全部钻孔 all drilled hole d 6$,iw@>^
定位孔 toaling hole UBmD
3|Zo
无连接盘孔 landless hole -/#VD&MJO=
中间孔 interstitial hole `A]CdgA
无连接盘导通孔 landless via hole *H"IW0I
引导孔 pilot hole -+'fn$
端接全隙孔 terminal clearomee hole 19Cs
3B \4
准尺寸孔 dimensioned hole [Page] @R5jUPUVV
在连接盘中导通孔 via-in-pad Bf72 .gx{0
孔位 hole location pJ` M5pF
孔密度 hole density 'IorjR@40
孔图 hole pattern O8;`6r
钻孔图 drill drawing F:PaVr3q
装配图assembly drawing Z~g I )
参考基准 datum referan b7
pD#v
1) 元件设备 N1lhlw6
n{>Ge,enP0
三绕组变压器:three-column transformer ThrClnTrans m;=wQYFr{I
双绕组变压器:double-column transformer DblClmnTrans Xq3n7d.
电容器:Capacitor dLtSa\2Hn
并联电容器:shunt capacitor bIFKP
电抗器:Reactor TZ`@pDi
母线:Busbar nkKiYr
输电线:TransmissionLine bv.DW,l%'
发电厂:power plant ^2gDhoO_
断路器:Breaker [0_JS 2KE
刀闸(隔离开关):Isolator 6sRe. ct<