1 backplane 背板 Pz[UAJ
2 Band gap voltage reference 带隙电压参考 Dt> tTU 6
3 benchtop supply 工作台电源 -s!J3DB
4 Block Diagram 方块图 5 Bode Plot 波特图 5z9hcQAS
6 Bootstrap 自举 -:pVDxO
7 Bottom FET Bottom FET D
"5|\
8 bucket capcitor 桶形电容
04&S.#+(
9 chassis 机架 (T$cw(!
10 Combi-sense Combi-sense ;dMr2y`6
11 constant current source 恒流源 H! 5Ka#B
12 Core Sataration 铁芯饱和 y9]7LETv\M
13 crossover frequency 交叉频率 aMGh$\Pg
14 current ripple 纹波电流 G7|d$!%
15 Cycle by Cycle 逐周期 ,/GFD[SQ
16 cycle skipping 周期跳步 h.]^ o*DJ
17 Dead Time 死区时间 |f$ws R`&
18 DIE Temperature 核心温度 =,q/FY:
19 Disable 非使能,无效,禁用,关断 pfIK9>i
20 dominant pole 主极点 ks("(
nU
21 Enable 使能,有效,启用 )m3emMO2
22 ESD Rating ESD额定值 eY`9J4o '
23 Evaluation Board 评估板 :h(3Ep
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. sk<S`J,M/_
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 "%+||IyW
25 Failling edge 下降沿 xzA!,75@U
26 figure of merit 品质因数 :Zkjtr.\
27 float charge voltage 浮充电压 tDah@_
28 flyback power stage 反驰式功率级 !`7evV:
29 forward voltage drop 前向压降 FN/l/OSb
30 free-running 自由运行 y7CXE6Y
31 Freewheel diode 续流二极管 l{.PyU5)
32 Full load 满负载 33 gate drive 栅极驱动 ~,};FI
34 gate drive stage 栅极驱动级 .#Z'CZO|
35 gerber plot Gerber 图 #K@!jh)y^
36 ground plane 接地层 bv(+$YR
37 Henry 电感单位:亨利 "N_@q2zF
38 Human Body Model 人体模式 UtJfO`m9P
39 Hysteresis 滞回 BR?DW~7J j
40 inrush current 涌入电流 )'g4Ty
41 Inverting 反相 +h/OQ]`/m
42 jittery 抖动 p=eSJ*
43 Junction 结点 RrrlfF ms
44 Kelvin connection 开尔文连接 SeS ZMv
45 Lead Frame 引脚框架 %
q!i
46 Lead Free 无铅 )BI%cD
47 level-shift 电平移动 IcQpbF0
48 Line regulation 电源调整率 W7~_XI
49 load regulation 负载调整率 muF&t'k
50 Lot Number 批号
*L>usLh
51 Low Dropout 低压差 }*%=C!m4R!
52 Miller 密勒 53 node 节点 C"`\[F`.k
54 Non-Inverting 非反相 ^t<L
55 novel 新颖的 ;,TT!vea
56 off state 关断状态 FMn|cO.vEP
57 Operating supply voltage 电源工作电压 ]Hi1^Y<
58 out drive stage 输出驱动级 AVU'rsXA
59 Out of Phase 异相 +/n]9l]#h
60 Part Number 产品型号 tRc3<>
61 pass transistor pass transistor ASMItT
62 P-channel MOSFET P沟道MOSFET knHrMD;
63 Phase margin 相位裕度 cdH`#X
64 Phase Node 开关节点 ^mI`P}5Y
65 portable electronics 便携式电子设备 @q]!C5
66 power down 掉电 *kF/yN
67 Power Good 电源正常 ,g?M[(wtc
68 Power Groud 功率地 `Has3AX8
69 Power Save Mode 节电模式 /i Xl]<
70 Power up 上电 )PU\|I0|)e
71 pull down 下拉 0{o 8-#
72 pull up 上拉 R*W1<W%q=
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Ue,eEer
74 push pull converter 推挽转换器 R*LPwJuv
75 ramp down 斜降 2y8FP#
76 ramp up 斜升 p((. (fx
77 redundant diode 冗余二极管 u|EJ)dT?
78 resistive divider 电阻分压器 6OPNP0@r
79 ringing 振 铃 Kb5}M/8
80 ripple current 纹波电流 /Z#AHfKF
81 rising edge 上升沿 n],cs
82 sense resistor 检测电阻 @N>rOA
83 Sequenced Power Supplys 序列电源 [vY)y\W{
84 shoot-through 直通,同时导通 SFsT^f<
85 stray inductances. 杂散电感 ^H<VH
86 sub-circuit 子电路 5y0LkuRR:
87 substrate 基板 6w{""K.{
88 Telecom 电信 ahM?;p
89 Thermal Information 热性能信息 [ CU8%%7
90 thermal slug 散热片 Ai)Q(]
91 Threshold 阈值 lu1T+@t
92 timing resistor 振荡电阻 Ja\B%f
93 Top FET Top FET {=R
vFA
94 Trace 线路,走线,引线 X/Fip0i
95 Transfer function 传递函数 ;lTgihW-
96 Trip Point 跳变点 u<j.XPK
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) )In;nc
98 Under Voltage Lock Out (UVLO) 欠压锁定 F>@z&a}(
99 Voltage Reference 电压参考 S |@
Y !
100 voltage-second product 伏秒积 dwzk+@]8
101 zero-pole frequency compensation 零极点频率补偿 u8y('\(
102 beat frequency 拍频 <sGioMr
103 one shots 单击电路 &j{IG`Trl
104 scaling 缩放 )@.ODW;`
105 ESR 等效串联电阻 [Page] OW> >6zM
106 Ground 地电位 {`L,F
107 trimmed bandgap 平衡带隙 jJ_6_8#
108 dropout voltage 压差 WPu%{/[
109 large bulk capacitance 大容量电容 E@="n<uS
110 circuit breaker 断路器 $~A\l@xAG
111 charge pump 电荷泵 oX/#Mct{s
112 overshoot 过冲 U.WMu%
*OKve
印制电路printed circuit AlgVsE%Va
印制线路 printed wiring xU9^8,6
印制板 printed board T5 BoOVgO
印制板电路 printed circuit board P'Jb')m
印制线路板 printed wiring board 4Gy3s|{
印制元件 printed component O}Do4>02
印制接点 printed contact C9T-4o1
印制板装配 printed board assembly X^0jS
板 board E|B1h!!\c
刚性印制板 rigid printed board U3c !*i
挠性印制电路 flexible printed circuit NsSl|m
挠性印制线路 flexible printed wiring !P _'n
齐平印制板 flush printed board !un_JZD
金属芯印制板 metal core printed board w{ x=e
金属基印制板 metal base printed board $4TawFf"nc
多重布线印制板 mulit-wiring printed board UDa\*
塑电路板 molded circuit board TUO#6
散线印制板 discrete wiring board !r0 z3^*N
微线印制板 micro wire board cFG%Ew@
积层印制板 buile-up printed board opxPK=kJ
表面层合电路板 surface laminar circuit SRk-3 :
埋入凸块连印制板 B2it printed board kI$X~s$r
载芯片板 chip on board s0'Xih sw6
埋电阻板 buried resistance board \6Hu&WHy
母板 mother board %G~%:uJ5
子板 daughter board gB#$"mq,
背板 backplane ch}(v'xv(
裸板 bare board .aR$ou,7
键盘板夹心板 copper-invar-copper board r+Y]S-o:
动态挠性板 dynamic flex board uwb>q"M
静态挠性板 static flex board 3gmu-tv
可断拼板 break-away planel 7Y'.yn
电缆 cable qUp DmH
挠性扁平电缆 flexible flat cable (FFC) `L}Irt}
薄膜开关 membrane switch -U_<:
混合电路 hybrid circuit 8DNGqaH;dt
厚膜 thick film jvos)$;L-
厚膜电路 thick film circuit [kq+a]q
薄膜 thin film %"RgW\s[R
薄膜混合电路 thin film hybrid circuit Wj.
_{
互连 interconnection axi%5:I
导线 conductor trace line #9Dixsl*Q
齐平导线 flush conductor w-MnJ(r
传输线 transmission line Ndx ]5
跨交 crossover Nb;Yti@Y.
板边插头 edge-board contact c=HL
6v<
增强板 stiffener )Ikx0vDFQ
基底 substrate <El6?ml@
基板面 real estate A@"CrVE
导线面 conductor side r&ex<(I{
元件面 component side 47XQZ-}4
焊接面 solder side tpi63<N
导电图形 conductive pattern j^Z3
非导电图形 non-conductive pattern "^ cn9AG{
基材 base material -xf=dzm)
层压板 laminate ~3 z10IG
覆金属箔基材 metal-clad bade material 7nHlDPps)
覆铜箔层压板 copper-clad laminate (CCL) C'}8
复合层压板 composite laminate G l*C"V
薄层压板 thin laminate vrIM!~*W
基体材料 basis material eESJk14
预浸材料 prepreg P
A9
]L
粘结片 bonding sheet a4! AvG
预浸粘结片 preimpregnated bonding sheer n2H2G_-L[
环氧玻璃基板 epoxy glass substrate {N$G|bm]u<
预制内层覆箔板 mass lamination panel wLC|mByq
内层芯板 core material PF-
sb&q
粘结层 bonding layer -K)P|'-?m
粘结膜 film adhesive '?k*wEu
无支撑胶粘剂膜 unsupported adhesive film ~z!U/QR2
覆盖层 cover layer (cover lay) Piz/vH6M}
增强板材 stiffener material d&0^AvM@
铜箔面 copper-clad surface &`63"^y
去铜箔面 foil removal surface A_@#V)D2
层压板面 unclad laminate surface t
<#Yr%a
基膜面 base film surface NPEs0|
胶粘剂面 adhesive faec 7Q.?]k&
原始光洁面 plate finish z>hG'
粗面 matt finish "Gxf[6B
剪切板 cut to size panel kf$0}T`
超薄型层压板 ultra thin laminate u<\/T&S
A阶树脂 A-stage resin hC8'6h
B阶树脂 B-stage resin 7@rrAs-"Z
C阶树脂 C-stage resin Jh[fFg]
环氧树脂 epoxy resin (a1 s~
酚醛树脂 phenolic resin hun/H4f|
聚酯树脂 polyester resin Y]nY.5irL
聚酰亚胺树脂 polyimide resin o$YL\ <qp
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin O- &>Dc
丙烯酸树脂 acrylic resin o% !a
三聚氰胺甲醛树脂 melamine formaldehyde resin w.Ft-RXA W
多官能环氧树脂 polyfunctional epoxy resin H5=-b@(
溴化环氧树脂 brominated epoxy resin (3"V5r`*;
环氧酚醛 epoxy novolac \ey3i((L
氟树脂 fluroresin Uw][ U
硅树脂 silicone resin dGcG7*EX
硅烷 silane UMw1&"0:
聚合物 polymer 3m?3I2k
无定形聚合物 amorphous polymer _y),C
结晶现象 crystalline polamer $q{-)=-BXQ
双晶现象 dimorphism j#0@%d
共聚物 copolymer i}+K;,Da:8
合成树脂 synthetic _Y*]'?g`
热固性树脂 thermosetting resin [Page] <`a!%_LC
[
热塑性树脂 thermoplastic resin
grnlJ=
感光性树脂 photosensitive resin qv=i eU
环氧值 epoxy value Z@ *^4Ve
双氰胺 dicyandiamide 6<R!`N 6
粘结剂 binder {KE858
胶粘剂 adesive =\?KC)F*e
固化剂 curing agent e&E""ye
阻燃剂 flame retardant U*=ebZno
遮光剂 opaquer zN {'@B
增塑剂 plasticizers 9dr\=e6) C
不饱和聚酯 unsatuiated polyester .T/\5_Bx
聚酯薄膜 polyester +EJIYvkFm
聚酰亚胺薄膜 polyimide film (PI) Q'&oSPXSDd
聚四氟乙烯 polytetrafluoetylene (PTFE) AY{caM
增强材料 reinforcing material +hRAU@RA
折痕 crease tD.md_E
云织 waviness jX!,xS%(
鱼眼 fish eye Uo<d]4p $
毛圈长 feather length )&<BQIv9/
厚薄段 mark JVFn=Mw
裂缝 split Qq(/TA0$-
捻度 twist of yarn 6+e@)[l.zc
浸润剂含量 size content `[w:l[i
浸润剂残留量 size residue )}1J.>5
处理剂含量 finish level M;,Q8z%
偶联剂 couplint agent iZB?5|*
断裂长 breaking length lzN\~5a}
吸水高度 height of capillary rise Oj6 -
湿强度保留率 wet strength retention a1_7plg
白度 whitenness Zx7Y ,0
导电箔 conductive foil lO9ML-8C1
铜箔 copper foil V lXUrJ9&
压延铜箔 rolled copper foil oEd+
光面 shiny side _<|NVweFS
粗糙面 matte side (V)nHF*<>
处理面 treated side U@!e&QPn
防锈处理 stain proofing <T+)~&g$
双面处理铜箔 double treated foil \L-o>O
模拟 simulation <<W{nSm#
逻辑模拟 logic simulation ]
hGU.C"(
电路模拟 circit simulation $+!/=8R)
时序模拟 timing simulation x4Mq{MrWp
模块化 modularization x}$SB%9/
设计原点 design origin 9^,MC&eb
优化(设计) optimization (design) E4GtJ`{X
供设计优化坐标轴 predominant axis @r^a/]5D
表格原点 table origin Stq&^S\x69
元件安置 component positioning L}pMjyM
比例因子 scaling factor $014/IB
扫描填充 scan filling -/Pg[Lx7Pb
矩形填充 rectangle filling _SC{nZ[
填充域 region filling oOlqlv
实体设计 physical design GuPxN}n
5
逻辑设计 logic design $8vZiB!"
逻辑电路 logic circuit eW,{E)x:
层次设计 hierarchical design U1}-]^\
自顶向下设计 top-down design 7)tkqfb]
自底向上设计 bottom-up design ^pruQp1X
费用矩阵 cost metrix N"1o>
!
元件密度 component density S=B?bD_,c
自由度 degrees freedom $(/=Wn
出度 out going degree UKV0xl
入度 incoming degree (3~h)vaJ
曼哈顿距离 manhatton distance }W^%5o87{
欧几里德距离 euclidean distance {Z0(V"Q
网络 network r==d^
阵列 array RC'4%++Nz
段 segment Cp4 U`]
逻辑 logic `Y>'*4a\
逻辑设计自动化 logic design automation Z0HfrK#oU
分线 separated time uF,F<%d
分层 separated layer X5@+M!`
定顺序 definite sequence Cw6\'p%l-\
导线(通道) conduction (track) @oE^(
导线(体)宽度 conductor width (7Su{tq
导线距离 conductor spacing M3 MB{cA2
导线层 conductor layer q@k/"ee*?
导线宽度/间距 conductor line/space }huj%Pnk)
第一导线层 conductor layer No.1 )`
~"o*M
圆形盘 round pad czNi)4x
方形盘 square pad
ac
菱形盘 diamond pad >NLG"[\
长方形焊盘 oblong pad 3v\69s
子弹形盘 bullet pad a',6WugIP
泪滴盘 teardrop pad _y:-_q
雪人盘 snowman pad kjAARW
形盘 V-shaped pad V Z~R7 G
环形盘 annular pad S7pf
QF
非圆形盘 non-circular pad pmda9V4
隔离盘 isolation pad X83,fCCl5
非功能连接盘 monfunctional pad Uh[MBwK
偏置连接盘 offset land wwh1aV *
腹(背)裸盘 back-bard land 3(&k4
盘址 anchoring spaur Wo)$*?
连接盘图形 land pattern 2<$pai"yl
连接盘网格阵列 land grid array o3 b=)E
孔环 annular ring D6+^Qmu"p
元件孔 component hole 3CL1Z\8To
安装孔 mounting hole eX`wQoV%
支撑孔 supported hole z)tULnR8
非支撑孔 unsupported hole x%h4'Sm
导通孔 via >EE}P|=-
镀通孔 plated through hole (PTH) v']Tusmg
余隙孔 access hole ,9,cN-/a
盲孔 blind via (hole) S\76`Ot
埋孔 buried via hole t@X{qm:%Z
埋,盲孔 buried blind via :m]KVcF.
任意层内部导通孔 any layer inner via hole '=AqC,\#
全部钻孔 all drilled hole <C1w?d$9I
定位孔 toaling hole C#qF&n
无连接盘孔 landless hole z}BuR*WSY{
中间孔 interstitial hole +{~cX]|
无连接盘导通孔 landless via hole ;t~Y>,
引导孔 pilot hole SfSWjq
端接全隙孔 terminal clearomee hole W3+;1S$k
准尺寸孔 dimensioned hole [Page] )7c/i+FsC
在连接盘中导通孔 via-in-pad mzO5&h7
孔位 hole location q$7w?(Lk
孔密度 hole density @\U;?N~k
孔图 hole pattern (usFT_
钻孔图 drill drawing g3|k-
装配图assembly drawing !w1acmo<_
参考基准 datum referan hKVb#|$
1) 元件设备 jXPf}{^
/np05XhEa
三绕组变压器:three-column transformer ThrClnTrans 0g8ykGyx
双绕组变压器:double-column transformer DblClmnTrans 4V<.:.k
电容器:Capacitor y$Fk0s*>
并联电容器:shunt capacitor KzZfpdI92
电抗器:Reactor qrHCr:~
母线:Busbar bblEZ%
输电线:TransmissionLine ~%eZQgqA*
发电厂:power plant &>n:7
断路器:Breaker 5X PoQ^
刀闸(隔离开关):Isolator \J(kevX
分接头:tap $~e55X'!+
电动机:motor 63`5A3rii
(2) 状态参数 TO&^%d
M1z ?E@kz
有功:active power :jy}V'bn$
无功:reactive power (%j V[Q
电流:current qXprD.; }
容量:capacity EG8%X "p
电压:voltage 4`Cgz#v
{
档位:tap position C%#w1k
有功损耗:reactive loss J``5;%TJp
无功损耗:active loss lSfPOx;*
功率因数:power-factor ),>whCtsI
功率:power }#q0K
功角:power-angle naiQ$uq0
电压等级:voltage grade ~#jnkD
空载损耗:no-load loss fh*7VuAc
铁损:iron loss |H(i)yu"5'
铜损:copper loss d};[^q6X
空载电流:no-load current >Qqxn*O
阻抗:impedance 6<%b}q9Mo
正序阻抗:positive sequence impedance Z,-J
tl
负序阻抗:negative sequence impedance ta@fNS4
零序阻抗:zero sequence impedance |hS^eK_
电阻:resistor y1h3Ch>Y
电抗:reactance } rX)A\ g6
电导:conductance 0h
kZ
电纳:susceptance l\"CHwN?Y
无功负载:reactive load 或者QLoad bN&DotG
有功负载: active load PLoad I^)_rOgM
遥测:YC(telemetering) Xyu0np;@
遥信:YX TtrV
-X>L
励磁电流(转子电流):magnetizing current \maj5VlJ
定子:stator cm8co
功角:power-angle kT % m`
上限:upper limit S\ K[l/
下限:lower limit FzOlM-)m
并列的:apposable 2q
UX"a4
高压: high voltage *x)u9rO]
低压:low voltage 7:zoF],s
中压:middle voltage sC ?e%B
电力系统 power system &k`/jl;u
发电机 generator hXD`OlX
励磁 excitation ,g 1~4,hqQ
励磁器 excitor ?k=)T]-}
电压 voltage E Uq6)
K
电流 current _7R6%^
母线 bus y#P_ }Kfo
变压器 transformer "AlR%:]24~
升压变压器 step-up transformer [U$`nnp
高压侧 high side F ~e}=Nb
输电系统 power transmission system M=fhRCUB
输电线 transmission line ~iIFe+6
固定串联电容补偿fixed series capacitor compensation VrKLEN\
稳定 stability W6)XMl}n
电压稳定 voltage stability Sq5}v]k@&
功角稳定 angle stability Va4AE)[/*
暂态稳定 transient stability Snq0OxS[v
电厂 power plant qL$\[(
能量输送 power transfer fc<,kRp
交流 AC cef:>>6_
装机容量 installed capacity MnQ 6 !1Z
电网 power system k#2b3}(,
落点 drop point Wt=%.Y(x
开关站 switch station <^+&A7Q-_
双回同杆并架 double-circuit lines on the same tower FC4hvO(/m
变电站 transformer substation dCWq~[[
补偿度 degree of compensation &!*p>Ns)e
高抗 high voltage shunt reactor .4!wp&
无功补偿 reactive power compensation orEb+
故障 fault wh3Wuh?x
调节 regulation ^J@
Xsl
裕度 magin G[ q<P
三相故障 three phase fault 2bf#L?5g/
故障切除时间 fault clearing time "9RW<+
极限切除时间 critical clearing time V^\b"1X7N
切机 generator triping |vj!,b88n#
高顶值 high limited value s
~i,R
强行励磁 reinforced excitation =I$:-[(
线路补偿器 LDC(line drop compensation) ?`B6I!S0[
机端 generator terminal n* z;%'0
静态 static (state) &qV_|f;
动态 dynamic (state) i;#AW($+a
单机无穷大系统 one machine - infinity bus system VKr
oikz@]
机端电压控制 AVR 2!a~YT
电抗 reactance tY?evsVgz
电阻 resistance O.?q8T)n82
功角 power angle =V^8RlBi
有功(功率) active power >;X^+JH!)
无功(功率) reactive power Bs-MoT!
功率因数 power factor U}W7[f lc
无功电流 reactive current 8=3$U+
下降特性 droop characteristics n(\VP!u5r
斜率 slope jE$]Z(Ab
额定 rating M-5zsN
变比 ratio 3UGdXufw
参考值 reference value <-|g>
电压互感器 PT L;'v,s
分接头 tap gjy:o5{vA*
下降率 droop rate Y;8.(0r/
仿真分析 simulation analysis t2z@"e
传递函数 transfer function c6HH%|
框图 block diagram ;4(FS
受端 receive-side GnW_^$Fs
裕度 margin Y.o-e)zX
同步 synchronization f>+:UGmP
失去同步 loss of synchronization ;<v9i#K5
阻尼 damping @,TCg1@QJ
摇摆 swing cK2Us+h
保护断路器 circuit breaker 7A>glZ/x
电阻:resistance G;bE_O
电抗:reactance 5,?Au
阻抗:impedance YRP$tz+
_
电导:conductance @33-UP9o
电纳:susceptance