1 backplane 背板 xIM,0xM2
2 Band gap voltage reference 带隙电压参考 Za|7gt];l
3 benchtop supply 工作台电源 _H+]G"k/r
4 Block Diagram 方块图 5 Bode Plot 波特图 o0H^J,6gV
6 Bootstrap 自举 -KiPqE%&G
7 Bottom FET Bottom FET Xb_
V\b0
8 bucket capcitor 桶形电容 S<mZs;
9 chassis 机架 -X.#Y6(
10 Combi-sense Combi-sense 2q?/aw ;Z
11 constant current source 恒流源 U2VEFm6
12 Core Sataration 铁芯饱和 A(y6]E!
13 crossover frequency 交叉频率 X5)D [aE6
14 current ripple 纹波电流 /`PYk]mJh
15 Cycle by Cycle 逐周期 VUP|j/qD
16 cycle skipping 周期跳步 N*IroT3
17 Dead Time 死区时间 1c$pz:$vX
18 DIE Temperature 核心温度 V.~kG ,Ht
19 Disable 非使能,无效,禁用,关断 \8{SQ%
20 dominant pole 主极点 ?JuJu1
21 Enable 使能,有效,启用 1$*8F
22 ESD Rating ESD额定值 +t7HlAXB#
23 Evaluation Board 评估板 579Q&|L.
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 8lF9LZ8
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 [L%Ltmx
25 Failling edge 下降沿 mR0`wrt
26 figure of merit 品质因数 WBjJ)vCA.
27 float charge voltage 浮充电压 Jz8P':6[
28 flyback power stage 反驰式功率级 }8O9WS
29 forward voltage drop 前向压降 NEBhVh
30 free-running 自由运行 6i/unwe!`)
31 Freewheel diode 续流二极管 H1N@E}> |
32 Full load 满负载 33 gate drive 栅极驱动 e~vO
34 gate drive stage 栅极驱动级 }9OMXLbRv
35 gerber plot Gerber 图 1jC85^1Taq
36 ground plane 接地层 )<x9t@$
37 Henry 电感单位:亨利 |~9jO/&r
38 Human Body Model 人体模式 2CC"Z
39 Hysteresis 滞回 @]Q4K%1^"
40 inrush current 涌入电流 S^s-md>
41 Inverting 反相 !}=eXDn;A_
42 jittery 抖动 <"Y>|X
43 Junction 结点 cS.@02~f"
44 Kelvin connection 开尔文连接 G4
7^xR
45 Lead Frame 引脚框架 >?+Rtg|${
46 Lead Free 无铅 o[;P@F
47 level-shift 电平移动 |$
PA
48 Line regulation 电源调整率 /JNG}*
49 load regulation 负载调整率 p\zqZ=s
50 Lot Number 批号 |q4=*X q
51 Low Dropout 低压差 BA
a:!p
52 Miller 密勒 53 node 节点 x8lBpr
54 Non-Inverting 非反相 u6C_*i{2
55 novel 新颖的 Uz ;^R@
56 off state 关断状态 v&:[?<6-
57 Operating supply voltage 电源工作电压 t[|rp&xG
58 out drive stage 输出驱动级 or-k~1D
59 Out of Phase 异相 |
.+P ;g
60 Part Number 产品型号 SU%O \4Ty
61 pass transistor pass transistor oyVT
62 P-channel MOSFET P沟道MOSFET QMMpB{FZ`o
63 Phase margin 相位裕度 +[}y`
-t
64 Phase Node 开关节点 GW
{tZaB
65 portable electronics 便携式电子设备 cc${[yj)
66 power down 掉电 #X]*kxQ<
67 Power Good 电源正常
]Zb9F[
68 Power Groud 功率地 u?>},M/
69 Power Save Mode 节电模式 } W]A`-Jv
70 Power up 上电 w&@tP^`
71 pull down 下拉 ,DEq"VW_
72 pull up 上拉 0d[O/Q`
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) LR&MhG7
74 push pull converter 推挽转换器 :r{-:
75 ramp down 斜降 Ry[7PLn]
76 ramp up 斜升 Q`i@['?p
77 redundant diode 冗余二极管 &zYQH@
78 resistive divider 电阻分压器 J5a8U&A
79 ringing 振 铃 `n,RC2yo
80 ripple current 纹波电流 ]Mq-67
81 rising edge 上升沿 {X?Aj >l
82 sense resistor 检测电阻 /Ey%aA4v
83 Sequenced Power Supplys 序列电源 ,{IDf
84 shoot-through 直通,同时导通 uP4yJ/]
85 stray inductances. 杂散电感 l_k:OZ
86 sub-circuit 子电路 9ad`q+kY
87 substrate 基板 Vu_oxL}
88 Telecom 电信 W.
d',4)
89 Thermal Information 热性能信息 +PPQ"#1pS
90 thermal slug 散热片 <=CABWO.
91 Threshold 阈值 '(iPI
92 timing resistor 振荡电阻 54{E&QvL8o
93 Top FET Top FET [vI ;A!
94 Trace 线路,走线,引线 P}'B~~9W
95 Transfer function 传递函数 (KO]>!t
96 Trip Point 跳变点 t=lDN'\P
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) m
+A4aQ9
98 Under Voltage Lock Out (UVLO) 欠压锁定 i^WY/ OhL
99 Voltage Reference 电压参考 NxJnU<g-
100 voltage-second product 伏秒积 $,Q]GIC
101 zero-pole frequency compensation 零极点频率补偿 jNbVp{%/S}
102 beat frequency 拍频 ^vm6JWwN0B
103 one shots 单击电路 S9DXd]6q_
104 scaling 缩放 b1^wK"#
105 ESR 等效串联电阻 [Page] RaLV@>jPm
106 Ground 地电位 0fj C>AS
107 trimmed bandgap 平衡带隙 C}9GrIi
108 dropout voltage 压差 !Th5x2
109 large bulk capacitance 大容量电容 zWPX
110 circuit breaker 断路器 ,g'>Ib%
111 charge pump 电荷泵 ,J 2qLH1
112 overshoot 过冲 [PXq<ST
xA^E+f:W_
印制电路printed circuit 8@ f!,!Wn
印制线路 printed wiring 7"Nda3
印制板 printed board C-ORI}o
印制板电路 printed circuit board d@^%fVhG
印制线路板 printed wiring board O\uIIuy
印制元件 printed component l4mRNYv)z
印制接点 printed contact /\Cf*cJ
印制板装配 printed board assembly He8]Eb
板 board Xm< _!=
刚性印制板 rigid printed board erv94acq
挠性印制电路 flexible printed circuit VJ
h]j(
挠性印制线路 flexible printed wiring pC,Z=+:
齐平印制板 flush printed board g/l:q&Q<
金属芯印制板 metal core printed board 4cy,'B
金属基印制板 metal base printed board ]jI<Js*F
多重布线印制板 mulit-wiring printed board H_XspiB@
塑电路板 molded circuit board `z q+Xl
散线印制板 discrete wiring board K@:omT
微线印制板 micro wire board |Wa.W0A
积层印制板 buile-up printed board YH+(N
表面层合电路板 surface laminar circuit H}_R `S
埋入凸块连印制板 B2it printed board cGm?F,/`
载芯片板 chip on board V=&M\58
埋电阻板 buried resistance board /Q)I5sL@E
母板 mother board "uL~D5!f
子板 daughter board yaG:}=.3
背板 backplane ]zAwKuIK
裸板 bare board jPo,mz&^
键盘板夹心板 copper-invar-copper board :J@3:+sr
动态挠性板 dynamic flex board kf<c[ su
静态挠性板 static flex board s8's(*]
可断拼板 break-away planel h|PC?@jp
电缆 cable w2s06`g
挠性扁平电缆 flexible flat cable (FFC) wC%qS y'
薄膜开关 membrane switch vw:GNpg'R6
混合电路 hybrid circuit ~a4Y8r
厚膜 thick film rqp]{?33
厚膜电路 thick film circuit \ `z%5/@f;
薄膜 thin film 31 <0Nw;l
薄膜混合电路 thin film hybrid circuit ?Bq^#i|m
互连 interconnection <@GO]vY
导线 conductor trace line xR
kw+
齐平导线 flush conductor Xm|~1 k_3
传输线 transmission line ?%~^PHgZ|
跨交 crossover CLmo%"\s
板边插头 edge-board contact rp"5176
增强板 stiffener jTg~]PQ^
基底 substrate PW5)") z
基板面 real estate =NY55t.
导线面 conductor side X=1o$:7
元件面 component side $mAC8a_Zu
焊接面 solder side #Ff8_xhP 2
导电图形 conductive pattern ?Be}{Qqlg
非导电图形 non-conductive pattern opm_|0
基材 base material &b^~0Z
层压板 laminate (K8Ob3zN_
覆金属箔基材 metal-clad bade material `C|];mf(#
覆铜箔层压板 copper-clad laminate (CCL) /W*Z.
复合层压板 composite laminate ORF:~5[YS`
薄层压板 thin laminate *U%3[6hm
基体材料 basis material OE0G*`m
预浸材料 prepreg :] U\{;q2
粘结片 bonding sheet 0,m]W)
预浸粘结片 preimpregnated bonding sheer +'5I8FE-
环氧玻璃基板 epoxy glass substrate 8kdJtEW3
预制内层覆箔板 mass lamination panel vK+reXE
内层芯板 core material EZjtZMnj
粘结层 bonding layer Bf#cBI
粘结膜 film adhesive >w7KOVbN3
无支撑胶粘剂膜 unsupported adhesive film ZQfPDH=
覆盖层 cover layer (cover lay) JrY*K|YdW
增强板材 stiffener material rq!*unJ
铜箔面 copper-clad surface NZ i3U
去铜箔面 foil removal surface $Z;/Sh
层压板面 unclad laminate surface 2IM31 .
基膜面 base film surface :8oJG8WH
胶粘剂面 adhesive faec %c\kLSe
原始光洁面 plate finish w$9LcN
粗面 matt finish gELG/6l
剪切板 cut to size panel KgkRs?'z
超薄型层压板 ultra thin laminate {]}94T~/k
A阶树脂 A-stage resin ZfqN4
B阶树脂 B-stage resin [yk-<}#B
C阶树脂 C-stage resin m#8[")a$"
环氧树脂 epoxy resin 4LB8p7$|a3
酚醛树脂 phenolic resin `ROHB@-
聚酯树脂 polyester resin ,I5SAd|dX
聚酰亚胺树脂 polyimide resin lTq"j?#E]m
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 300w\9fn&
丙烯酸树脂 acrylic resin <C(o0u&/
三聚氰胺甲醛树脂 melamine formaldehyde resin ;XawEG7" U
多官能环氧树脂 polyfunctional epoxy resin X)~wB7_0G
溴化环氧树脂 brominated epoxy resin 'n,V*9
环氧酚醛 epoxy novolac "EMW'>&m