1 backplane 背板 K}MlC}oIt
2 Band gap voltage reference 带隙电压参考 R+t]]n6#
3 benchtop supply 工作台电源 E^gN]Z"O
4 Block Diagram 方块图 5 Bode Plot 波特图 &*E! %57
6 Bootstrap 自举 $BT[fJ'k
7 Bottom FET Bottom FET >6[d&SM6
8 bucket capcitor 桶形电容 ho)JY
$#6
9 chassis 机架 i`Qa7
10 Combi-sense Combi-sense 15En$6>
11 constant current source 恒流源 c<lEFk!g
12 Core Sataration 铁芯饱和 jt(GXgm
13 crossover frequency 交叉频率 ay||yn:
14 current ripple 纹波电流 K<r5jb
15 Cycle by Cycle 逐周期 I;1)a4Xc4R
16 cycle skipping 周期跳步 =}@1Z~
17 Dead Time 死区时间 '/9q7?[E!
18 DIE Temperature 核心温度 KX3A|
19 Disable 非使能,无效,禁用,关断 v,8Q9<=O
20 dominant pole 主极点 x%O6/rl
21 Enable 使能,有效,启用 `8tstWYa]Y
22 ESD Rating ESD额定值 OHW|?hI=[
23 Evaluation Board 评估板 @Kn@j D;
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. *z#du*f[
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 QC!SgV
25 Failling edge 下降沿 1G67#L)USq
26 figure of merit 品质因数 %C@p4
27 float charge voltage 浮充电压 3TZ:
28 flyback power stage 反驰式功率级 )FmIL(vu
29 forward voltage drop 前向压降 'x<oILOG
30 free-running 自由运行 #6~Bg)7AM
31 Freewheel diode 续流二极管 AlG5n'
32 Full load 满负载 33 gate drive 栅极驱动 |:Maa6(W
34 gate drive stage 栅极驱动级 $TS97'$
35 gerber plot Gerber 图 kj.9\
36 ground plane 接地层 ms!|a_H7r
37 Henry 电感单位:亨利 U* c'xoP
38 Human Body Model 人体模式 Wv9L}@J
39 Hysteresis 滞回 &cJ?mSI
40 inrush current 涌入电流 ~'0ZW<X.
41 Inverting 反相 61_-G#W
42 jittery 抖动 7-Oa34ba+
43 Junction 结点 x,cvAbwS
44 Kelvin connection 开尔文连接 R*FDg;t4
45 Lead Frame 引脚框架 bq8Wvlv04
46 Lead Free 无铅 D^V)$ME
47 level-shift 电平移动 lUA-ug! ^
48 Line regulation 电源调整率 Cz$q"U
49 load regulation 负载调整率 ^c>Bh[
50 Lot Number 批号 ZBFn
51 Low Dropout 低压差 ~b!la
52 Miller 密勒 53 node 节点 vceD/ N8
54 Non-Inverting 非反相 P,a9B2
55 novel 新颖的 _uL[
Z
56 off state 关断状态 J .TK<!
57 Operating supply voltage 电源工作电压 dFhyT.Y?
58 out drive stage 输出驱动级 R".$x{{
59 Out of Phase 异相 -^(KGu&L&u
60 Part Number 产品型号 =au!rda
61 pass transistor pass transistor *}';q`u}
62 P-channel MOSFET P沟道MOSFET 9Li&0E
63 Phase margin 相位裕度 l?rLadvc
64 Phase Node 开关节点 Rm79mh9
65 portable electronics 便携式电子设备 mk^,{D
66 power down 掉电 \=[j9'N>
67 Power Good 电源正常 Xdl
dUK[
68 Power Groud 功率地 z$}9f*W}B
69 Power Save Mode 节电模式 4[JF.O6}
70 Power up 上电 Lccy~2v>
71 pull down 下拉 q#Q %p+
72 pull up 上拉 &WL::gy_S
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) zJl;|E".
74 push pull converter 推挽转换器 3A[<LnKR^E
75 ramp down 斜降 HS
]c~
76 ramp up 斜升 E
i>GhvRM
77 redundant diode 冗余二极管 ;H`@x Lv*
78 resistive divider 电阻分压器 =<m!%/I
79 ringing 振 铃 )ZBNw{nh
80 ripple current 纹波电流 :) -`
81 rising edge 上升沿 zS|4@t\__
82 sense resistor 检测电阻 -K(d]-yv
83 Sequenced Power Supplys 序列电源 :).NA
]
84 shoot-through 直通,同时导通 kaiK1/W0;
85 stray inductances. 杂散电感 /\uopa
86 sub-circuit 子电路 Z!^>!'Z
87 substrate 基板 -sZ'<(3
88 Telecom 电信 9[&ByEAK
89 Thermal Information 热性能信息 "+Ys}t~2
90 thermal slug 散热片 7CSz
91 Threshold 阈值 Im!b-1
92 timing resistor 振荡电阻 :4Nv6X61
93 Top FET Top FET Y<(7u`F
94 Trace 线路,走线,引线 GYiL}itD=3
95 Transfer function 传递函数 r79P|)\
96 Trip Point 跳变点 2yZ~j_AF[
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ebNRZJ?C,
98 Under Voltage Lock Out (UVLO) 欠压锁定 VS ;y
99 Voltage Reference 电压参考 vV$^`WY4
100 voltage-second product 伏秒积 &"gX
7cK8
101 zero-pole frequency compensation 零极点频率补偿 )\VuN-d
102 beat frequency 拍频 <Opw"yY&q]
103 one shots 单击电路 TbT/ 5W3
104 scaling 缩放 '0)`.
105 ESR 等效串联电阻 [Page] F?]J`F\I
106 Ground 地电位 %e0X-tXcmX
107 trimmed bandgap 平衡带隙 UR=s=G|
108 dropout voltage 压差 \9tJ/~
109 large bulk capacitance 大容量电容 #>\SK
110 circuit breaker 断路器 `Npo|.?=
111 charge pump 电荷泵
8IWT;%
112 overshoot 过冲 8v8-5N
n3&h1-
印制电路printed circuit hCF_pt+
印制线路 printed wiring KnA BFH
印制板 printed board ":qHDL3
印制板电路 printed circuit board }~PG]A
印制线路板 printed wiring board Ja4M@z
印制元件 printed component D_$N2>I-
印制接点 printed contact ?u:mscb
印制板装配 printed board assembly ~MC5rOA
板 board }vOg9/[{
刚性印制板 rigid printed board 2Q]W
挠性印制电路 flexible printed circuit ~vA8I#.
挠性印制线路 flexible printed wiring (jhi<eV
齐平印制板 flush printed board 0-{E% k
金属芯印制板 metal core printed board ar,v/l>d4N
金属基印制板 metal base printed board YcwDNsk
多重布线印制板 mulit-wiring printed board 4guR8 elM
塑电路板 molded circuit board ~,KrL(jC
散线印制板 discrete wiring board &[j9Up'
微线印制板 micro wire board w6h83m
3
积层印制板 buile-up printed board Q(aNa!
表面层合电路板 surface laminar circuit ,xrA2
埋入凸块连印制板 B2it printed board v@SHR0
载芯片板 chip on board Sw; kUJ
埋电阻板 buried resistance board 8(y%]#n
母板 mother board .=<s@Sg,t
子板 daughter board e1JHN
背板 backplane
"$J5cco
裸板 bare board N#RC;
键盘板夹心板 copper-invar-copper board XRQ1Uh6
动态挠性板 dynamic flex board G4'Ee5(o
静态挠性板 static flex board )6X-m9.X
可断拼板 break-away planel AY<L8
电缆 cable 6LCR ;~
]
挠性扁平电缆 flexible flat cable (FFC) 1BW 9,Xr
薄膜开关 membrane switch -}j(_]t
混合电路 hybrid circuit X 5}=|%Y
厚膜 thick film +$VDV4l
厚膜电路 thick film circuit /=AFle2(
薄膜 thin film oHv.EO
薄膜混合电路 thin film hybrid circuit ia;osqW
互连 interconnection 1i.3P$F
导线 conductor trace line 3dbaCusT$
齐平导线 flush conductor )16+Pm8
传输线 transmission line 1'(";
0I
跨交 crossover ;~$Q;m1
板边插头 edge-board contact F;_o `h
增强板 stiffener TJW8 l[M
基底 substrate M;3q.0MU
基板面 real estate {:_*P
TVk
导线面 conductor side J"GsdLG.-
元件面 component side 5izpQ'>
焊接面 solder side j1->w8
导电图形 conductive pattern -}sMOy`
非导电图形 non-conductive pattern B:UPSX)A
基材 base material ZlE=P4`X:
层压板 laminate d_&pxy?
>
覆金属箔基材 metal-clad bade material F 2zUz[
覆铜箔层压板 copper-clad laminate (CCL) 4G;KT~Cgb
复合层压板 composite laminate >d"\
薄层压板 thin laminate "SQyy
基体材料 basis material et/l7+/'
预浸材料 prepreg
(6mw@gzr
粘结片 bonding sheet h:C:opa-=
预浸粘结片 preimpregnated bonding sheer c2:,
环氧玻璃基板 epoxy glass substrate NRP)'E
预制内层覆箔板 mass lamination panel JgP%4)]LV
内层芯板 core material 4Wa$>vz
粘结层 bonding layer 0LzS #J+
粘结膜 film adhesive DoO
;VF
无支撑胶粘剂膜 unsupported adhesive film dQ_'8
)
覆盖层 cover layer (cover lay) . uGne
增强板材 stiffener material gN(kRhp
铜箔面 copper-clad surface 5%V(eR
去铜箔面 foil removal surface ('j'>"1H
层压板面 unclad laminate surface 5?Q5cD2]\6
基膜面 base film surface x30|0EHYl[
胶粘剂面 adhesive faec jgXr2JQ<
原始光洁面 plate finish ,-k?"|tQ
粗面 matt finish .`J*l=u$
剪切板 cut to size panel 7.2 !g}E
超薄型层压板 ultra thin laminate IQ~Anp^R
A阶树脂 A-stage resin 0;=]MEk?
B阶树脂 B-stage resin HpUJ_pZ
C阶树脂 C-stage resin @V1FBw9S!@
环氧树脂 epoxy resin ^b$G.h{o!E
酚醛树脂 phenolic resin .}+3A~
聚酯树脂 polyester resin P92pQ_W
聚酰亚胺树脂 polyimide resin [5-IkT0
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin i
Pl/I
丙烯酸树脂 acrylic resin rP"Y.;s
三聚氰胺甲醛树脂 melamine formaldehyde resin q%f90
多官能环氧树脂 polyfunctional epoxy resin rAW7Zp~KK
溴化环氧树脂 brominated epoxy resin R\5fl[
环氧酚醛 epoxy novolac <~v4BiQ3l^
氟树脂 fluroresin qQo*:3/];
硅树脂 silicone resin Pjvb}q=
硅烷 silane =Ov,7<8o
聚合物 polymer F>n_k
无定形聚合物 amorphous polymer Wie0r@5E
结晶现象 crystalline polamer .v+J@Y a
双晶现象 dimorphism uV}GUE%W
共聚物 copolymer "la0@/n
合成树脂 synthetic GuL0:,
热固性树脂 thermosetting resin [Page] S}0-2T[
热塑性树脂 thermoplastic resin )G]J@36
感光性树脂 photosensitive resin g3%x"SlIU
环氧值 epoxy value t)k;5B`> &
双氰胺 dicyandiamide AOL=;z9c#
粘结剂 binder 7hMh%d0d(_
胶粘剂 adesive lY,9bSF$
固化剂 curing agent ,1<6=vL
阻燃剂 flame retardant 9T`YHA'g
遮光剂 opaquer ev/)#i#s{
增塑剂 plasticizers UaQW<6+
不饱和聚酯 unsatuiated polyester ]PL\;[b>
聚酯薄膜 polyester $SFreyI;Uf
聚酰亚胺薄膜 polyimide film (PI) SjJ$Oinc
聚四氟乙烯 polytetrafluoetylene (PTFE) I7'v;*
增强材料 reinforcing material /Q#eP m
折痕 crease AtAu$"ue
云织 waviness >oEFuwE
鱼眼 fish eye "8(8]GgYx
毛圈长 feather length juM~X5b
厚薄段 mark ?h#F& y
裂缝 split Z~|%asjFE
捻度 twist of yarn fG.6S"|M
浸润剂含量 size content
~Z#\f5yv@
浸润剂残留量 size residue SwrzW'%A
处理剂含量 finish level _qt
偶联剂 couplint agent |
ObA=[j
断裂长 breaking length vZ=dlu_t
吸水高度 height of capillary rise ^tjM1uaZ5(
湿强度保留率 wet strength retention ^QHgc_oDm
白度 whitenness !|ic{1!_
导电箔 conductive foil 7eZwpg?K
铜箔 copper foil EW]8k@&g
压延铜箔 rolled copper foil w5Ucj*A\
光面 shiny side XwU1CejP0
粗糙面 matte side w0<1=;_%
处理面 treated side <
r b5'
防锈处理 stain proofing Q5Mn=
双面处理铜箔 double treated foil <<YH4}wZ
模拟 simulation 4QNwu7TeR
逻辑模拟 logic simulation [e:ccm
电路模拟 circit simulation Zjc0R
时序模拟 timing simulation $V_w4!:Q
模块化 modularization hrfSe $8
设计原点 design origin
2&o3OKt
优化(设计) optimization (design) b|@f!lA
供设计优化坐标轴 predominant axis v}^uN+a5
表格原点 table origin "#%9dWy
元件安置 component positioning A_J!VXq
比例因子 scaling factor 8 }Maj
扫描填充 scan filling pM!cF
矩形填充 rectangle filling eE0nW+i
填充域 region filling 6WLq>Jo
实体设计 physical design VK}H;
逻辑设计 logic design s8r[U, }(
逻辑电路 logic circuit P>*`<$FR
层次设计 hierarchical design dda*gq/p
自顶向下设计 top-down design f+QDjJ?z
自底向上设计 bottom-up design 5@i(pVWZ
费用矩阵 cost metrix 9\6ZdnEKu,
元件密度 component density ;|Rrtf9
自由度 degrees freedom DpL|aRdbK
出度 out going degree <a
D}Ko(
入度 incoming degree [Ue"#w
曼哈顿距离 manhatton distance r$!
欧几里德距离 euclidean distance XO/JnJ^B
网络 network {w9GMqq
阵列 array \!r,>P
段 segment ^JB5-EtL(
逻辑 logic ?NUDHUn_
逻辑设计自动化 logic design automation nqib`U@"
分线 separated time =l}XKl->
分层 separated layer E.Arq6
定顺序 definite sequence glNXamo
导线(通道) conduction (track) ;5aAnvgW
导线(体)宽度 conductor width 59a7%w
导线距离 conductor spacing +~EFRiP]
导线层 conductor layer a0B,[i
导线宽度/间距 conductor line/space 9M .cTIO{
第一导线层 conductor layer No.1 Q\Nz^~dQ:Y
圆形盘 round pad {UOR_Vt!*
方形盘 square pad 9,AHC2kn%
菱形盘 diamond pad 3*<~;Z' z4
长方形焊盘 oblong pad pQBhheiM
子弹形盘 bullet pad ?Ns aZ
泪滴盘 teardrop pad CDRz3Hu U
雪人盘 snowman pad /m*+N9)
形盘 V-shaped pad V .RWKZB
环形盘 annular pad IdL~0;W7
非圆形盘 non-circular pad P%kJq^&
隔离盘 isolation pad 7|pF(sb0
非功能连接盘 monfunctional pad 7E)*]7B%
偏置连接盘 offset land os`#:Ao5
腹(背)裸盘 back-bard land c_.4~>qw
盘址 anchoring spaur 2S_7!|j
连接盘图形 land pattern &^b mZj!
连接盘网格阵列 land grid array soB5sFt&]
孔环 annular ring !>QD42
元件孔 component hole (n~GKcA
安装孔 mounting hole WH0$v#8`v
支撑孔 supported hole WB>M7MI%
非支撑孔 unsupported hole >=3ay^(Y2D
导通孔 via x[eho,6)
镀通孔 plated through hole (PTH) D7(kkr:r
余隙孔 access hole orr6._xw
盲孔 blind via (hole) SXm Hn.?
埋孔 buried via hole ; Uf]-uS
埋,盲孔 buried blind via 9A9yZl t
任意层内部导通孔 any layer inner via hole 6 2#dSd}HG
全部钻孔 all drilled hole HCVMqG!
定位孔 toaling hole jM|-(Es.)
无连接盘孔 landless hole %oN5 jt
中间孔 interstitial hole " ll
TVB
无连接盘导通孔 landless via hole aYPD4yX"/
引导孔 pilot hole [%yCnt
端接全隙孔 terminal clearomee hole y6 _,U/9
准尺寸孔 dimensioned hole [Page] aMycvYzH
在连接盘中导通孔 via-in-pad o+.LG($+U
孔位 hole location w%Tjn^ d
孔密度 hole density *we*IhIP
孔图 hole pattern DAt Zp%
钻孔图 drill drawing C%\.
装配图assembly drawing 9 54O=9PQ
参考基准 datum referan lQnqPQY
1) 元件设备 mk&`dr
O!#bM< *
三绕组变压器:three-column transformer ThrClnTrans mtg3}etA
双绕组变压器:double-column transformer DblClmnTrans o+T%n1$+V
电容器:Capacitor d%='W|i\p&
并联电容器:shunt capacitor | ?])]F
电抗器:Reactor (*\*7dIo
母线:Busbar d~-Cr-s4
输电线:TransmissionLine @u}1 S1
发电厂:power plant 5 U{}A\q
断路器:Breaker #:n:3]t
刀闸(隔离开关):Isolator EvEI5/z
分接头:tap wnoL<p
电动机:motor &>&UqWL
(2) 状态参数 c O[Hr
.q^+llM
有功:active power (lBwkQNQGd
无功:reactive power 8LM 91
电流:current 9EqU
2~
容量:capacity MTxe5ob`$Q
电压:voltage 2En^su$
档位:tap position |Q)c{9sD
有功损耗:reactive loss Tf1G827
无功损耗:active loss wN4N2
功率因数:power-factor gnPu{-Ec*
功率:power r#CQCq
功角:power-angle P5^<c\Mr,Y
电压等级:voltage grade }b5If7
空载损耗:no-load loss Z}Ld!Byz
铁损:iron loss c8cPGm#i
铜损:copper loss jRCG}'
空载电流:no-load current ui\yY3?
阻抗:impedance
|wFfVDp
正序阻抗:positive sequence impedance =5jng.
负序阻抗:negative sequence impedance "}(g3Iy
零序阻抗:zero sequence impedance Anu`F%OzB
电阻:resistor +jPs0?}s
电抗:reactance ;Iu}Q-b*
电导:conductance 1\'zq;I~
电纳:susceptance 9nrH
6]
无功负载:reactive load 或者QLoad @d]a#ypU
有功负载: active load PLoad nA#FGfZ{Ge
遥测:YC(telemetering) O-D${==
遥信:YX U)n+j}vi
励磁电流(转子电流):magnetizing current lSu\VCG
定子:stator L\u6EMyV
功角:power-angle iVg3=R)[1
上限:upper limit M@=eW Z<
下限:lower limit gh{Z=_
并列的:apposable `(rnD
高压: high voltage @FBlF$vG
低压:low voltage ?!4xtOA
中压:middle voltage [Pnk@jIk4
电力系统 power system G2A^+R0\
发电机 generator GV1SKa
励磁 excitation I|27%i
励磁器 excitor >8*J ;(:W
电压 voltage +l "z
电流 current (rM-~h6g
母线 bus i^2yq&uT(
变压器 transformer l^B PTg)X@
升压变压器 step-up transformer y]5c!N %8
高压侧 high side Kn!n}GtR
输电系统 power transmission system f`dQ $Kh
输电线 transmission line ve [*t `
固定串联电容补偿fixed series capacitor compensation z,"fr%*,N
稳定 stability ?Z]5
[
电压稳定 voltage stability X
\1grM
功角稳定 angle stability 0KQDw
暂态稳定 transient stability tocZO
电厂 power plant sSM^net0
能量输送 power transfer _|!FhZ
交流 AC }5 2]
装机容量 installed capacity M+mO4q6
电网 power system bP4<q?FKcN
落点 drop point @w H+,]xE
开关站 switch station :j}]nS
双回同杆并架 double-circuit lines on the same tower yO7xAb
变电站 transformer substation jI-\~
补偿度 degree of compensation '_nJ DM
高抗 high voltage shunt reactor 01 vEt
无功补偿 reactive power compensation `pHlGbrW
故障 fault Y~|C]O
调节 regulation o:E_k#Fi
裕度 magin 4!%TY4bJ
三相故障 three phase fault Q9UBxpDV:
故障切除时间 fault clearing time zi-;7lT
极限切除时间 critical clearing time HH\6gs]u
切机 generator triping VeJM=s.y7
高顶值 high limited value 3(Y#*f|
强行励磁 reinforced excitation [%8t~zg
线路补偿器 LDC(line drop compensation) Hq[vh7Lux
机端 generator terminal %,l+?fF
静态 static (state) 2W}f|\8MX
动态 dynamic (state) M:!Twz$
单机无穷大系统 one machine - infinity bus system M=mzl750M
机端电压控制 AVR `eF&|3!IYQ
电抗 reactance $qoh0$
电阻 resistance
*$t<H-U-
功角 power angle aetK<9L$
有功(功率) active power ;oKN 8vI#7
无功(功率) reactive power ?f\;z<e|
功率因数 power factor *@XJ7G[
无功电流 reactive current AjTkQ)
下降特性 droop characteristics -R~!N#y
斜率 slope Au q)
额定 rating "|2|Vju%
变比 ratio hU:M]O0uw
参考值 reference value 3Ishe"
电压互感器 PT HG1)q\Xd
分接头 tap DE{tpN
下降率 droop rate muAI$IRR
仿真分析 simulation analysis y%y F34
传递函数 transfer function rQ^X3J*`
框图 block diagram Hcp)Q76X
受端 receive-side A,tmy',d"
裕度 margin >O{U4_j@(
同步 synchronization S(K}.C1x
失去同步 loss of synchronization M@G <I]\
阻尼 damping
h:[8$]
摇摆 swing %s+H& vfQs
保护断路器 circuit breaker igoXMsifT+
电阻:resistance ;"*\R5a
电抗:reactance 7XZ5CX&
阻抗:impedance ,qx;kJJ
电导:conductance 0@FZQ$-
电纳:susceptance