1 backplane 背板 y<?kzt
2 Band gap voltage reference 带隙电压参考 sGi"rg#
3 benchtop supply 工作台电源 2POXj!N
4 Block Diagram 方块图 5 Bode Plot 波特图 ./-5R|fN
6 Bootstrap 自举 hcgMZT!<5
7 Bottom FET Bottom FET s6H]J{1F
8 bucket capcitor 桶形电容 wVX[)E\J
9 chassis 机架 8LyD7P1\
10 Combi-sense Combi-sense ]q;Emy
11 constant current source 恒流源 HU1h8E$-
12 Core Sataration 铁芯饱和 O(#)m>A
13 crossover frequency 交叉频率 #pT"BSz]
14 current ripple 纹波电流 c'^?/$H|
15 Cycle by Cycle 逐周期 fX(3H1$"
16 cycle skipping 周期跳步 ]}Mj)J" m
17 Dead Time 死区时间 (iBNZ7sJ
18 DIE Temperature 核心温度 3r<~Q7e
19 Disable 非使能,无效,禁用,关断 NvD7Krqwa
20 dominant pole 主极点 +M./@U*g
21 Enable 使能,有效,启用 o@r7
n>G
22 ESD Rating ESD额定值 5 f@)z"j
23 Evaluation Board 评估板 bbtGXfI+SB
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. g$":D
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 /1Qr#OJ(]
25 Failling edge 下降沿 (jnzT=y
26 figure of merit 品质因数 LSm$dK
27 float charge voltage 浮充电压 zbXI%
28 flyback power stage 反驰式功率级 0Be<X
29 forward voltage drop 前向压降 N"pc,Q\xU
30 free-running 自由运行 *!4Z#Y
31 Freewheel diode 续流二极管 3YeG$^y"
32 Full load 满负载 33 gate drive 栅极驱动
H_B4
34 gate drive stage 栅极驱动级 %G3h?3
35 gerber plot Gerber 图 Hta y-PB }
36 ground plane 接地层 gD0eFTN
37 Henry 电感单位:亨利 l3KVW5-!gS
38 Human Body Model 人体模式 dl.N.P7}4
39 Hysteresis 滞回 P!~MZ+7#&
40 inrush current 涌入电流 Yw22z #K
41 Inverting 反相 4ae`pAu
42 jittery 抖动 ,oORW/0iS
43 Junction 结点 Z_PNI#h*
44 Kelvin connection 开尔文连接 CHdX;'`*
45 Lead Frame 引脚框架 8&;UO{
46 Lead Free 无铅 }elc `jj
47 level-shift 电平移动 @v$Y7mw3D
48 Line regulation 电源调整率 qsF<!'m7`
49 load regulation 负载调整率 _ftI*ni:<
50 Lot Number 批号 ~fBtQGdX
51 Low Dropout 低压差 $[9%QQk5<L
52 Miller 密勒 53 node 节点 -B>++r2A^
54 Non-Inverting 非反相 /Y*WBTV'
55 novel 新颖的 1 da@3xaF
56 off state 关断状态 JBD7h5|Lc
57 Operating supply voltage 电源工作电压 _geWE0
E
58 out drive stage 输出驱动级 BmBj7
59 Out of Phase 异相 @M<|:Z %.@
60 Part Number 产品型号 anuL1fXO
61 pass transistor pass transistor ^le<}
62 P-channel MOSFET P沟道MOSFET iF*:d
63 Phase margin 相位裕度 #:%&x@@c3P
64 Phase Node 开关节点 ?J'Y&
65 portable electronics 便携式电子设备 Pih tf4i
66 power down 掉电 m9)p-1y@5
67 Power Good 电源正常
7;u
e
68 Power Groud 功率地 `+`Z7
69 Power Save Mode 节电模式 BK*x] zG$
70 Power up 上电 .\K_@M
71 pull down 下拉 Tb A}BFT`
72 pull up 上拉 kM!kD4&
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Pnw]Tm}g
74 push pull converter 推挽转换器 PEN\-*Pv
75 ramp down 斜降 o-;E>N7t
76 ramp up 斜升 6L:x^bM
77 redundant diode 冗余二极管 m 2-Sx
78 resistive divider 电阻分压器 R= a|Blp
79 ringing 振 铃 )js)2L~
80 ripple current 纹波电流 8][nmjk0
81 rising edge 上升沿 ?xK8#
82 sense resistor 检测电阻 P<oehw'>
83 Sequenced Power Supplys 序列电源 #1J &7F1
84 shoot-through 直通,同时导通 U!T~!C^
85 stray inductances. 杂散电感 Wi>!{.}%A
86 sub-circuit 子电路 /{|EAd{
87 substrate 基板 UsgK
88 Telecom 电信 <Q$@r?Mu]
89 Thermal Information 热性能信息 wU8Mt#D!
90 thermal slug 散热片 ]I-Z]m"
91 Threshold 阈值 !P ~_Dl2d
92 timing resistor 振荡电阻 PEc,l>u9
93 Top FET Top FET Qg^cf<X{i
94 Trace 线路,走线,引线 2<li7c59
95 Transfer function 传递函数 &
SiP\65N
96 Trip Point 跳变点 Yj%U
>),8
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ^<;V]cY`
98 Under Voltage Lock Out (UVLO) 欠压锁定 Fd#?\r.
99 Voltage Reference 电压参考 KN$}tCU
100 voltage-second product 伏秒积 _\=`6`b)
101 zero-pole frequency compensation 零极点频率补偿 d#6`&MR
102 beat frequency 拍频 '"y|p+=j:
103 one shots 单击电路 $m7?3/YG
104 scaling 缩放 )64@2~4y
105 ESR 等效串联电阻 [Page] ttXXy3G#
106 Ground 地电位 yPM3a7-Bm
107 trimmed bandgap 平衡带隙 `{,Dy!rL
108 dropout voltage 压差 XXbqQhf
109 large bulk capacitance 大容量电容 ilK-?@u+
110 circuit breaker 断路器 cQG
+$0(
111 charge pump 电荷泵 1[kMOp
112 overshoot 过冲 O#&c6MDB:
CxGx8*<X
印制电路printed circuit M@h|bN
印制线路 printed wiring :!/gk8F|dI
印制板 printed board hbU+Usx
印制板电路 printed circuit board -<Hu!V`+
印制线路板 printed wiring board [FK<96.nt
印制元件 printed component ;g6M%;1-
印制接点 printed contact b5,x1`#7k
印制板装配 printed board assembly &GNxo$CG
板 board jlp:lX
刚性印制板 rigid printed board xAafm<L@!
挠性印制电路 flexible printed circuit Wf>zDW^"R
挠性印制线路 flexible printed wiring ";BlIovT=R
齐平印制板 flush printed board p7);uF^O%
金属芯印制板 metal core printed board ;`l'2
z@N
金属基印制板 metal base printed board \Z^TXyu
多重布线印制板 mulit-wiring printed board $k0kk
塑电路板 molded circuit board |UP `B|
散线印制板 discrete wiring board H(2!1?N+
微线印制板 micro wire board |_}2f
积层印制板 buile-up printed board Kh(ZU^{n
表面层合电路板 surface laminar circuit D,;\o7V
埋入凸块连印制板 B2it printed board !E,A7s
载芯片板 chip on board mK[)mC
_8
埋电阻板 buried resistance board 994`ua+
母板 mother board M(RZ/x
子板 daughter board `
L>
背板 backplane <WjF*x p
裸板 bare board hj
键盘板夹心板 copper-invar-copper board d cLA1sN,
动态挠性板 dynamic flex board 0E?jW7yr
静态挠性板 static flex board #
S}Z8
可断拼板 break-away planel O@MGda9_;
电缆 cable vy_D>tp
挠性扁平电缆 flexible flat cable (FFC) ET _W-
薄膜开关 membrane switch bKj%s@x
混合电路 hybrid circuit %@;6^=
厚膜 thick film I/M _p^
厚膜电路 thick film circuit s"9`s_p`d
薄膜 thin film Y7#-Fra0W
薄膜混合电路 thin film hybrid circuit O:TlIJwW
互连 interconnection |fxA|/s[<
导线 conductor trace line 6lkl7zm
齐平导线 flush conductor nt;haeJ
传输线 transmission line _$wmI/_JM
跨交 crossover `(v='$6}
板边插头 edge-board contact t|9 GS|
增强板 stiffener `6 /$M!4$
基底 substrate tniDF>Rb
基板面 real estate xY+VyOUs
导线面 conductor side #O$
元件面 component side /CuXa%Ci^
焊接面 solder side T21ky>8E
导电图形 conductive pattern HS{(v;
非导电图形 non-conductive pattern 4J;-Dq
基材 base material >ELlnE8
层压板 laminate )uK{uYQl
覆金属箔基材 metal-clad bade material K`/`|1
覆铜箔层压板 copper-clad laminate (CCL) 'eo
KZX+
复合层压板 composite laminate ME;n^y\8
薄层压板 thin laminate VR+<v
基体材料 basis material Z|_K6v/c
预浸材料 prepreg qOSg!aft{Q
粘结片 bonding sheet @g2cC
预浸粘结片 preimpregnated bonding sheer KhCzD[tf
环氧玻璃基板 epoxy glass substrate 2pzF5h
预制内层覆箔板 mass lamination panel `(1K
内层芯板 core material #6AFdNy
粘结层 bonding layer HDda@Jy
粘结膜 film adhesive fwrJ!j
无支撑胶粘剂膜 unsupported adhesive film -zp0S*iP7
覆盖层 cover layer (cover lay)
B3H|+
增强板材 stiffener material :(a]V"(&Eq
铜箔面 copper-clad surface y"6y!
去铜箔面 foil removal surface 7_.11$E=H
层压板面 unclad laminate surface Rl qQ
基膜面 base film surface -b9;5eS!
胶粘剂面 adhesive faec UPc<gB
原始光洁面 plate finish 1iX)d)(b
粗面 matt finish 3' ~gviI
剪切板 cut to size panel Mn$]I) $
超薄型层压板 ultra thin laminate ot`%*
A阶树脂 A-stage resin J[A14z]#`
B阶树脂 B-stage resin ? Zc"C
C阶树脂 C-stage resin V7Z4T6j4
环氧树脂 epoxy resin t~e<z81p
酚醛树脂 phenolic resin EyI}{6~F
聚酯树脂 polyester resin d{3@h+zL
聚酰亚胺树脂 polyimide resin 'Q
=7/dY3I
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin }<>~sy
丙烯酸树脂 acrylic resin /^$UhX9v
三聚氰胺甲醛树脂 melamine formaldehyde resin tV_t6x_.
多官能环氧树脂 polyfunctional epoxy resin yf?h#G%24
溴化环氧树脂 brominated epoxy resin HxBm~Lcqy
环氧酚醛 epoxy novolac m6MOW&
氟树脂 fluroresin RP2_l$
硅树脂 silicone resin .MVY B\6Q0
硅烷 silane 6vp *9
聚合物 polymer 8>7RxSF
无定形聚合物 amorphous polymer +B'8|5tPX
结晶现象 crystalline polamer g
^!C
双晶现象 dimorphism '=E3[0W
共聚物 copolymer K*IxUz(
合成树脂 synthetic [L6w1b,
热固性树脂 thermosetting resin [Page] o7TN,([W
热塑性树脂 thermoplastic resin l{:a1^[>y
感光性树脂 photosensitive resin cO\-
环氧值 epoxy value y8s!M
双氰胺 dicyandiamide ]&ixhW
粘结剂 binder 0l=+$&D
胶粘剂 adesive E"%2)
固化剂 curing agent 'JdkUhq1V
阻燃剂 flame retardant x lsqj`=
遮光剂 opaquer fa&-. *
增塑剂 plasticizers ~1*A
不饱和聚酯 unsatuiated polyester B/J>9||g
聚酯薄膜 polyester -/x
W
聚酰亚胺薄膜 polyimide film (PI) C{Asp
聚四氟乙烯 polytetrafluoetylene (PTFE) X 6lH|R
增强材料 reinforcing material '~ 4pl0TWc
折痕 crease tu>{
云织 waviness `p0ypi3hn
鱼眼 fish eye n;8 '`s
毛圈长 feather length x1gx$P
厚薄段 mark _TUt9}
裂缝 split "BKeot[""p
捻度 twist of yarn >r)X:K+I
浸润剂含量 size content <&pKc6+{
浸润剂残留量 size residue `W `0Fwu9
处理剂含量 finish level ]DvO:tM
偶联剂 couplint agent H^~.mBP
n
断裂长 breaking length K'1~^)*
吸水高度 height of capillary rise ]~>K\i
湿强度保留率 wet strength retention m,>
白度 whitenness h(B,d,q"
导电箔 conductive foil a$9A(Pte
铜箔 copper foil j2M+]Zp.
压延铜箔 rolled copper foil b[@VYa
光面 shiny side w%c
粗糙面 matte side U@Tj B
处理面 treated side JR9$.fGJ
防锈处理 stain proofing D H^T x
双面处理铜箔 double treated foil ogeL[7
模拟 simulation 64j|}wJ$
逻辑模拟 logic simulation ;`v% sx#
电路模拟 circit simulation 6<Hu8$G|
时序模拟 timing simulation p|XAlia
模块化 modularization J?n<ydZSH
设计原点 design origin &hV Zx
优化(设计) optimization (design) {13!vS%5
供设计优化坐标轴 predominant axis b!$ }ma;B
表格原点 table origin x`Fjf/1T*m
元件安置 component positioning >qn/<??
比例因子 scaling factor N;HIsOT}t
扫描填充 scan filling
BRbV7&
矩形填充 rectangle filling $R^AEa7
填充域 region filling h4fLl3%H
实体设计 physical design F9XT
lA
逻辑设计 logic design r;iV$Rq!
逻辑电路 logic circuit TSL9ax4j
层次设计 hierarchical design cs_}&!c{
自顶向下设计 top-down design uD>z@J-v
自底向上设计 bottom-up design beZ(o?uK
费用矩阵 cost metrix oP,9#FC|(
元件密度 component density GlR~%q-jiQ
自由度 degrees freedom UP2.]B!d
出度 out going degree *]s&8/Gmb
入度 incoming degree Mth6-^g5
曼哈顿距离 manhatton distance #Ogt(5Sd
欧几里德距离 euclidean distance 6J%iZ
网络 network 3gfimD$ _E
阵列 array ;RN8\re
段 segment =^h~!ovj:
逻辑 logic o;`!kIQ
逻辑设计自动化 logic design automation Jp;k+"<q
分线 separated time 8&}~'4[b[$
分层 separated layer 'pP-rdx
定顺序 definite sequence @?&Wm3x9
导线(通道) conduction (track) $W!]fcZlB
导线(体)宽度 conductor width hSqMaX%G
导线距离 conductor spacing P#G.lft"O
导线层 conductor layer zp=!8Av
导线宽度/间距 conductor line/space o;J;*~g
第一导线层 conductor layer No.1 RTd^ImV
圆形盘 round pad ~v:#zU
方形盘 square pad 8?jxDW
a
菱形盘 diamond pad p/|(,)'+jx
长方形焊盘 oblong pad :d'65KMi
子弹形盘 bullet pad c<qe[iyt/
泪滴盘 teardrop pad PHR#>ZD
雪人盘 snowman pad EI`vVI
形盘 V-shaped pad V _J"mR]I+
环形盘 annular pad sp8[cO=
非圆形盘 non-circular pad {HZS:AV0
隔离盘 isolation pad (iDBhC;/B
非功能连接盘 monfunctional pad 0#|7U_n
偏置连接盘 offset land ySruAkw%
腹(背)裸盘 back-bard land LZ&uj{ <
盘址 anchoring spaur k@qWig
连接盘图形 land pattern l]vohLz
3!
连接盘网格阵列 land grid array %yw=[]Vjze
孔环 annular ring ;?im(9h"v!
元件孔 component hole pv$tTWk
安装孔 mounting hole 1*R_"#
支撑孔 supported hole 4%bTj,H#
非支撑孔 unsupported hole \JU ~k5j
导通孔 via _'*DT=H'U
镀通孔 plated through hole (PTH) P06.1
余隙孔 access hole q0|ZoP
盲孔 blind via (hole) |[wyc!nY).
埋孔 buried via hole
8xo;E=`
埋,盲孔 buried blind via lS{4dvr?w
任意层内部导通孔 any layer inner via hole `!kL1oUYE
全部钻孔 all drilled hole U+!UL5k
定位孔 toaling hole RdkU2Y}V
无连接盘孔 landless hole 9 x [X<
中间孔 interstitial hole FH
-p!4+]
无连接盘导通孔 landless via hole tMG@K
引导孔 pilot hole /Hk07:"c
端接全隙孔 terminal clearomee hole s*{mT6s+T
准尺寸孔 dimensioned hole [Page] K50t%yu#T]
在连接盘中导通孔 via-in-pad (wlfMiO
孔位 hole location *K!7R2Rat
孔密度 hole density le2/Zs$
孔图 hole pattern {3SdX
钻孔图 drill drawing b7f0#*(?
装配图assembly drawing xc*!W*04
参考基准 datum referan x?>!UqgkY
1) 元件设备 3#<'[TF00t
BGA%"b
三绕组变压器:three-column transformer ThrClnTrans ?k
w/S4
双绕组变压器:double-column transformer DblClmnTrans )T<D6l
Lt
电容器:Capacitor 4d6%
t2
并联电容器:shunt capacitor T"A^[r*
电抗器:Reactor ox
JGJ
母线:Busbar :D^Y?
输电线:TransmissionLine johmJLC
发电厂:power plant Ku&*`dME
断路器:Breaker oEPNN'~3
刀闸(隔离开关):Isolator xK=J.>h3
分接头:tap rN'.&;Y5
电动机:motor d"p2Kx'*3
(2) 状态参数 [M<{P5q
)j(fWshP
有功:active power mj,qQ=n;p
无功:reactive power !}j,TPpG
电流:current v?%0~!
容量:capacity T!&jFy*W
电压:voltage HcDyD0;L.
档位:tap position 5@CpP-W#
有功损耗:reactive loss v s w7|
无功损耗:active loss s|BX>1
功率因数:power-factor D'85VZEFyo
功率:power 3[iSF5%V*p
功角:power-angle QQSH +
电压等级:voltage grade Y+OYoI
空载损耗:no-load loss KWtu,~O_u
铁损:iron loss ;*"!:GR%h
铜损:copper loss olHH9R9:
空载电流:no-load current IMw
"eV
阻抗:impedance '?z9,oW{
正序阻抗:positive sequence impedance 1Q0%7zRirI
负序阻抗:negative sequence impedance @-}D7?
零序阻抗:zero sequence impedance !k%l+I3J[
电阻:resistor 9PUa?Bc`=
电抗:reactance n=;';(wR[
电导:conductance b-,]A2.
电纳:susceptance X9DM^tt
无功负载:reactive load 或者QLoad y4 dp1<t%
有功负载: active load PLoad wK2yt?
遥测:YC(telemetering) <!$dp9y.
遥信:YX 'E@2I9Kj
励磁电流(转子电流):magnetizing current >~.Zr3P6kC
定子:stator d?Ia#K93G
功角:power-angle :~WPY9i`
上限:upper limit d'x<-l9
下限:lower limit =I+l=;05Rd
并列的:apposable )PsN_ 42~
高压: high voltage DxE^#=7iH;
低压:low voltage "sz.v<F0:s
中压:middle voltage 6#OL
;Y]_
电力系统 power system $'WapxF
发电机 generator ?"5~Wwp.T
励磁 excitation 200L
励磁器 excitor ._8xY$l$
电压 voltage BUcaj.S
电流 current R>/QARX
母线 bus M"k3zK,
变压器 transformer fF8a 1XV
升压变压器 step-up transformer \f8P`oET~
高压侧 high side vgU hN_rK
输电系统 power transmission system P-/XYZ]`
输电线 transmission line j CTQsV
固定串联电容补偿fixed series capacitor compensation +Q@/F~1@6@
稳定 stability D[?k ,*
电压稳定 voltage stability |V5 $'/Y
功角稳定 angle stability ]+^;vc 1r
暂态稳定 transient stability m1~qaD<DZ$
电厂 power plant oG4w8+N
能量输送 power transfer 2N8rM}?90
交流 AC c n\k`8
装机容量 installed capacity Oz4,Y+[#
电网 power system 2VoEQ
落点 drop point 6Tm
Rc
开关站 switch station Q0
uP8I}n
双回同杆并架 double-circuit lines on the same tower TnbGO;
变电站 transformer substation c+,7Zu!
补偿度 degree of compensation !=~s/{$PE
高抗 high voltage shunt reactor -13P 2<i+
无功补偿 reactive power compensation +cPE4(d
故障 fault )OW(T^>_'I
调节 regulation fPh}l
裕度 magin (T>?8K_d
三相故障 three phase fault 2uJNc!&
故障切除时间 fault clearing time ? 6yF{!F*
极限切除时间 critical clearing time Wx']tFn"
切机 generator triping 7- *(a
高顶值 high limited value rL!_&|
强行励磁 reinforced excitation UX-_{I
QW
线路补偿器 LDC(line drop compensation) [*Aqy76Qa
机端 generator terminal 4Vb}i[</
静态 static (state) v&[X&Hu[
动态 dynamic (state) ';;p8bv+
单机无穷大系统 one machine - infinity bus system LK
机端电压控制 AVR
d'Ik@D]I
电抗 reactance v -|P_O&z