1 backplane 背板 Slc\&Eb
2 Band gap voltage reference 带隙电压参考 "fOV^B
3 benchtop supply 工作台电源 jAlv`uB|G"
4 Block Diagram 方块图 5 Bode Plot 波特图 63IM]J
6 Bootstrap 自举 R.<g3"Lm>
7 Bottom FET Bottom FET 4{|"7/PE1
8 bucket capcitor 桶形电容 SOA,kwHRe
9 chassis 机架 pOoEI+t
10 Combi-sense Combi-sense uW
%#
11 constant current source 恒流源 {]4LULq
12 Core Sataration 铁芯饱和 ]3Sp W{=^(
13 crossover frequency 交叉频率 ,r_Gf5c
14 current ripple 纹波电流 5]:U9ts#
15 Cycle by Cycle 逐周期 =41?^1\
16 cycle skipping 周期跳步 X|]AT9W
17 Dead Time 死区时间 (KZ{^X?a
18 DIE Temperature 核心温度 _7_Y={4=`
19 Disable 非使能,无效,禁用,关断 1T
n}
20 dominant pole 主极点 E|shs=I
21 Enable 使能,有效,启用 SNk=b6`9
22 ESD Rating ESD额定值 Z6MO^_m2
23 Evaluation Board 评估板 QS;f\'1bb
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 'i|YlMFI g
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 /PXzwP_(A
25 Failling edge 下降沿 b^vQpiz
26 figure of merit 品质因数 tw)mepwB
27 float charge voltage 浮充电压 mgU<htMr1
28 flyback power stage 反驰式功率级 aV0"~5
29 forward voltage drop 前向压降 Xne1gms
30 free-running 自由运行 vo{--+{ky!
31 Freewheel diode 续流二极管 9QJyZ
32 Full load 满负载 33 gate drive 栅极驱动 :e+jU5;]3
34 gate drive stage 栅极驱动级 ,zY{
35 gerber plot Gerber 图 rEz^
36 ground plane 接地层 k$:|-_(w
37 Henry 电感单位:亨利 p!AAFmc
38 Human Body Model 人体模式 &_8947
39 Hysteresis 滞回 h'nY3GrU
40 inrush current 涌入电流 [0("Q;Ec[j
41 Inverting 反相 {Qj~M<@3
42 jittery 抖动 (S Yln>o
43 Junction 结点 Bk{]g=DO
44 Kelvin connection 开尔文连接 H3oFORh
45 Lead Frame 引脚框架 P16~Qj
46 Lead Free 无铅 SSzIih@u
47 level-shift 电平移动 NDokSw-
48 Line regulation 电源调整率 Zx>=tx}
49 load regulation 负载调整率 $3kH~3{]
50 Lot Number 批号 Q\0'lQJdy
51 Low Dropout 低压差 ?:9"X$XR
52 Miller 密勒 53 node 节点 V>3X\)qu
54 Non-Inverting 非反相 hOK8(U0
55 novel 新颖的 4s
oJ.j8
56 off state 关断状态 E=O\0!F|b
57 Operating supply voltage 电源工作电压 [()koU#w.
58 out drive stage 输出驱动级 )fAUum
59 Out of Phase 异相 |k00Z+O(
60 Part Number 产品型号 1Ai^cf:S
61 pass transistor pass transistor j B{8u&kz)
62 P-channel MOSFET P沟道MOSFET f*
wx<
63 Phase margin 相位裕度 %\:Wi#w>
64 Phase Node 开关节点 ^xk'Z
65 portable electronics 便携式电子设备 |JsZJ9W+J
66 power down 掉电 ;<4a*;IO
67 Power Good 电源正常 %B?=q@!QWn
68 Power Groud 功率地 RT8 ?7xFc
69 Power Save Mode 节电模式 *qpSXmOz
70 Power up 上电 Z4bNV?OH
71 pull down 下拉 "$vRMpW:
72 pull up 上拉 x.4m|f0;
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) y8xE
6i
74 push pull converter 推挽转换器 cm+P]8o%{
75 ramp down 斜降 \z ) %$#I
76 ramp up 斜升 B`sAk
%
77 redundant diode 冗余二极管 62NsJ<#>
78 resistive divider 电阻分压器 pQQH)`J|t
79 ringing 振 铃 /g.U&oI]D
80 ripple current 纹波电流 asqV~n
81 rising edge 上升沿 b\5F ]r
82 sense resistor 检测电阻 "ocyK}l.?
83 Sequenced Power Supplys 序列电源 tQ601H>o
84 shoot-through 直通,同时导通 yIE!j%u
85 stray inductances. 杂散电感 IAyp 2
86 sub-circuit 子电路 ez[Vm:2K
87 substrate 基板 0tJZ4(0
88 Telecom 电信 s,_m{ to
89 Thermal Information 热性能信息 /zox$p$?h
90 thermal slug 散热片 vw@S>GlGg
91 Threshold 阈值 qcRs$-J
92 timing resistor 振荡电阻 :~SyL !
93 Top FET Top FET uEx-]F
94 Trace 线路,走线,引线 UGatWj
95 Transfer function 传递函数 3iU=c&P
96 Trip Point 跳变点 hCo|HB
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) -ze J#B)C
98 Under Voltage Lock Out (UVLO) 欠压锁定 0IWf!Sk
]
99 Voltage Reference 电压参考 e~(5%CO>#j
100 voltage-second product 伏秒积 IvNT6]6 P
101 zero-pole frequency compensation 零极点频率补偿 |&4/n6;P$0
102 beat frequency 拍频 .eC1qWZJpd
103 one shots 单击电路 ,]/X\t5]D
104 scaling 缩放 /Gfw8g\}
105 ESR 等效串联电阻 [Page] :MDKC /mC
106 Ground 地电位 'O-"\J\
107 trimmed bandgap 平衡带隙 M'l ;:
108 dropout voltage 压差 nT)vNWT=
109 large bulk capacitance 大容量电容 o<!?7g{
110 circuit breaker 断路器 .o}v#W+st
111 charge pump 电荷泵 @[v~y"tE}
112 overshoot 过冲 {Hk}Kow
W(/h Vt
印制电路printed circuit lUMdrt0@z
印制线路 printed wiring %N_%JK\{@
印制板 printed board )WFr</z5bA
印制板电路 printed circuit board hFBe,'3M
印制线路板 printed wiring board xe$_aBU
印制元件 printed component YA5g';$H*
印制接点 printed contact Yz93'HDB
印制板装配 printed board assembly @|T'0_'
板 board yaV|AB$v
刚性印制板 rigid printed board v(%*b,^
挠性印制电路 flexible printed circuit l9H!au=
挠性印制线路 flexible printed wiring +qdEq_m
齐平印制板 flush printed board Uoix
金属芯印制板 metal core printed board BfiD9ka-z
金属基印制板 metal base printed board '/%H3A#L
多重布线印制板 mulit-wiring printed board z([</D?
塑电路板 molded circuit board 9-m=*|p
散线印制板 discrete wiring board Oa>Ppldeg
微线印制板 micro wire board XRQ4\bMA8
积层印制板 buile-up printed board 7 Fsay+a
表面层合电路板 surface laminar circuit }l9llu
埋入凸块连印制板 B2it printed board 5Jnlz@P9
载芯片板 chip on board 6D_D' ;o
埋电阻板 buried resistance board ZSm3 XXk
母板 mother board oe~b}:
子板 daughter board #A8sLkY
背板 backplane ( &x['IR
裸板 bare board `~q <N
键盘板夹心板 copper-invar-copper board Rbv;?'O$L
动态挠性板 dynamic flex board T^]}Oy@e,J
静态挠性板 static flex board ~WV"SaA)*U
可断拼板 break-away planel jb!i$/%w
电缆 cable El"Q'(:/U
挠性扁平电缆 flexible flat cable (FFC) '@P^0+B!(.
薄膜开关 membrane switch +X]vl=0
混合电路 hybrid circuit ENY+^7
厚膜 thick film -d:Jta!}{
厚膜电路 thick film circuit l%i+cO D
薄膜 thin film %D "I
薄膜混合电路 thin film hybrid circuit o2\8OxcA
互连 interconnection \xoP)Ub>
导线 conductor trace line &b& ,
齐平导线 flush conductor E8&TO~"a]e
传输线 transmission line }*"p?L^p{
跨交 crossover \1Em`nvOX
板边插头 edge-board contact b>JDH1)
增强板 stiffener ^K@C"j?M/
基底 substrate ]e@Oiq
基板面 real estate $ L]lHji
导线面 conductor side jWfa;&Ra
元件面 component side S|+o-[e8O
焊接面 solder side jEJT-*I1+
导电图形 conductive pattern
M\Kx'N
非导电图形 non-conductive pattern UW
EV^ &"x
基材 base material Ooy7*W';
层压板 laminate v|2T%y_
u
覆金属箔基材 metal-clad bade material <Q?F?.^e
覆铜箔层压板 copper-clad laminate (CCL) du^J2m{f
复合层压板 composite laminate *c+ (-
薄层压板 thin laminate
3?
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基体材料 basis material 7D5]G-}x.
预浸材料 prepreg P7~ >mm+
粘结片 bonding sheet #>+ HlT
预浸粘结片 preimpregnated bonding sheer b|W=pSTY
环氧玻璃基板 epoxy glass substrate 6!FQzFCZq
预制内层覆箔板 mass lamination panel pyvSwD5t
内层芯板 core material C;urBsC
粘结层 bonding layer *;*r8[U}q
粘结膜 film adhesive h'F=YF$o
无支撑胶粘剂膜 unsupported adhesive film Tnm.A?
覆盖层 cover layer (cover lay) 0lR5<^B
增强板材 stiffener material c!9nnTap
铜箔面 copper-clad surface [cp+i^f
去铜箔面 foil removal surface v_-dx
层压板面 unclad laminate surface IO-Ow!
基膜面 base film surface }`~+]9<
胶粘剂面 adhesive faec &.?'i1!
原始光洁面 plate finish ea')$gR
粗面 matt finish d/DB nZN
剪切板 cut to size panel <UQbt N-B\
超薄型层压板 ultra thin laminate [hj6N*4y
A阶树脂 A-stage resin @sC`!Rmy'-
B阶树脂 B-stage resin n7-6-
#
C阶树脂 C-stage resin [IhYh<i
环氧树脂 epoxy resin Y0-n\|
酚醛树脂 phenolic resin e^D]EA]%
聚酯树脂 polyester resin 3/n5#&c\4
聚酰亚胺树脂 polyimide resin N<injx
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin )I.$=s
丙烯酸树脂 acrylic resin "LTad`]<Ro
三聚氰胺甲醛树脂 melamine formaldehyde resin L/G6Fjg^
多官能环氧树脂 polyfunctional epoxy resin ,DkNLE
溴化环氧树脂 brominated epoxy resin QMb Ouw
环氧酚醛 epoxy novolac C>*u()q>4h
氟树脂 fluroresin *bA.zmzM
硅树脂 silicone resin O@C@eW#
硅烷 silane ;;N9>M?b
聚合物 polymer NHZz _a=
无定形聚合物 amorphous polymer !d0kV,F:
结晶现象 crystalline polamer ;MdlwQ$`
双晶现象 dimorphism FQ5U$x.[P
共聚物 copolymer
Z>5b;8
合成树脂 synthetic ~FG]wNgS
热固性树脂 thermosetting resin [Page] v
z '&%(
热塑性树脂 thermoplastic resin PxDh7{
感光性树脂 photosensitive resin kL"2=7m;
环氧值 epoxy value fS78>*K
双氰胺 dicyandiamide 'AH0ww_)n
粘结剂 binder @r/nF5
胶粘剂 adesive ^,T(mKS
固化剂 curing agent ?2Py_gkf
阻燃剂 flame retardant 2a Q[zK
遮光剂 opaquer P\rg"
3
增塑剂 plasticizers UrEs4R1#
不饱和聚酯 unsatuiated polyester k_nql8H
聚酯薄膜 polyester RdRp.pb8
聚酰亚胺薄膜 polyimide film (PI) ;@Y;g(bw:
聚四氟乙烯 polytetrafluoetylene (PTFE) 5taT5?n2
增强材料 reinforcing material _^%,x
折痕 crease _.Uh)-yR
云织 waviness L>4"(
鱼眼 fish eye 68WO~*
毛圈长 feather length n[Y~]
厚薄段 mark ZeaA%y67U
裂缝 split cB}D^O
捻度 twist of yarn fHd#u%63K
浸润剂含量 size content E92KP?i
浸润剂残留量 size residue K^<BW(s
处理剂含量 finish level N~zdWnSZ@G
偶联剂 couplint agent U>}w2bZ*
断裂长 breaking length ?QdWrE_
吸水高度 height of capillary rise :(*V?WI
湿强度保留率 wet strength retention )cMh0SGcM1
白度 whitenness
&powy7rR
导电箔 conductive foil @>Km_Ax
铜箔 copper foil 3K0A)W/YEs
压延铜箔 rolled copper foil 5f K_Aq{
光面 shiny side aNspMJ
粗糙面 matte side DAr1C+Dy
处理面 treated side 4yA+h2
防锈处理 stain proofing ^'{Fh"5
双面处理铜箔 double treated foil l L@XM2"
模拟 simulation gu.}M:u
逻辑模拟 logic simulation eiaFaYe\
电路模拟 circit simulation -3Z,EaG^
时序模拟 timing simulation a fW@T2
模块化 modularization ['tY4$L(
设计原点 design origin uGK.\PB$
优化(设计) optimization (design) ?Z[[2\DR
供设计优化坐标轴 predominant axis
=ncVnW{
表格原点 table origin tpQ(g%
元件安置 component positioning r1{@Ucw2
比例因子 scaling factor 0)e\`Bv
扫描填充 scan filling Zaf:fsj>
矩形填充 rectangle filling .2Elr(&*h
填充域 region filling yEoF4bt
实体设计 physical design LxSpctiNx
逻辑设计 logic design q01wbO3-"
逻辑电路 logic circuit w4{<n/"
层次设计 hierarchical design x}I+Iggi
自顶向下设计 top-down design Ee%%d
自底向上设计 bottom-up design 5 ,B_u%bb
费用矩阵 cost metrix ,~@X{7U
元件密度 component density WUXx;9 >
自由度 degrees freedom '"/=f\)u
出度 out going degree &>W$6>@
入度 incoming degree ep)n_!$OH"
曼哈顿距离 manhatton distance dhf!o0'1M
欧几里德距离 euclidean distance x,@B(9No
网络 network DGn;m\B
阵列 array Eib5
段 segment a;qryUyG
逻辑 logic ~#[yJNYQ
逻辑设计自动化 logic design automation i0kak`x0
分线 separated time Q}K"24`=
分层 separated layer m{cGK`/\
定顺序 definite sequence 1N#|
}ad
导线(通道) conduction (track) *:LK8U
导线(体)宽度 conductor width /1V xc 6
导线距离 conductor spacing ^]0Pfna+N
导线层 conductor layer o!Ieb
导线宽度/间距 conductor line/space {14fA)`%
第一导线层 conductor layer No.1 p\tm:QWD;
圆形盘 round pad *-=(Q`3
方形盘 square pad bL+_j}{:N
菱形盘 diamond pad _~J
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长方形焊盘 oblong pad `O!X((
子弹形盘 bullet pad e L^|v
泪滴盘 teardrop pad oAJM]%g{
雪人盘 snowman pad s_OF( o
形盘 V-shaped pad V BB!THj69a6
环形盘 annular pad ,,&*:<Q
非圆形盘 non-circular pad .B]MpmpK
隔离盘 isolation pad vkx7paY_
非功能连接盘 monfunctional pad 7cT~oV !G_
偏置连接盘 offset land Xq]w<$
腹(背)裸盘 back-bard land qYjce]c
盘址 anchoring spaur "fCu=@i
连接盘图形 land pattern Is)u }
连接盘网格阵列 land grid array Hz1%x
孔环 annular ring +\c5]`
元件孔 component hole mAj?>;R2$2
安装孔 mounting hole fF$<7O)+]
支撑孔 supported hole ?GoR^p #p
非支撑孔 unsupported hole %S@ZXf~:
导通孔 via ,]ma+(|
镀通孔 plated through hole (PTH) 'EEJU/"u
余隙孔 access hole 0d"[l@UU0
盲孔 blind via (hole) nwB_8mN|
埋孔 buried via hole 4n!aW?%
埋,盲孔 buried blind via 4$iz4U:P
任意层内部导通孔 any layer inner via hole LqoB 10Kc\
全部钻孔 all drilled hole F3v!AvA|
定位孔 toaling hole B:;pvW]
无连接盘孔 landless hole U0
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中间孔 interstitial hole b8`)y<