1 backplane 背板 =?UCtYN,P
2 Band gap voltage reference 带隙电压参考 E)|_7x<u
3 benchtop supply 工作台电源 ug!DL=ZW
4 Block Diagram 方块图 5 Bode Plot 波特图 .E|Hk,c9
6 Bootstrap 自举 "|pNS)
7 Bottom FET Bottom FET ~uRG~,{rH
8 bucket capcitor 桶形电容 :bMCmY
9 chassis 机架 wL,b.]
10 Combi-sense Combi-sense MGIpo[
11 constant current source 恒流源 2X2,(D!
12 Core Sataration 铁芯饱和 NUBzm nA>8
13 crossover frequency 交叉频率 ?}sh@;]*h
14 current ripple 纹波电流 W5*%n]s~
15 Cycle by Cycle 逐周期 B?c9cS5Mj
16 cycle skipping 周期跳步 th8f
17 Dead Time 死区时间 ^z3-$98=A
18 DIE Temperature 核心温度 w[PWJ! <
19 Disable 非使能,无效,禁用,关断 ~*-ar 6
20 dominant pole 主极点 NtMK+y
21 Enable 使能,有效,启用 M*| y&XBe
22 ESD Rating ESD额定值 ^a|$z$spf
23 Evaluation Board 评估板 }.|\<8_
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. .EVy?-
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 vBsd.2t~
25 Failling edge 下降沿 _GK^ 7}u
26 figure of merit 品质因数 -i|qk`Y
27 float charge voltage 浮充电压 m`
cw:
28 flyback power stage 反驰式功率级 ;nG"y:qq
29 forward voltage drop 前向压降 Ojp)OeF\
30 free-running 自由运行 rKq/=Avv
31 Freewheel diode 续流二极管 %*P59%
32 Full load 满负载 33 gate drive 栅极驱动 !c:Q+:,H
34 gate drive stage 栅极驱动级 a8aEZ724
35 gerber plot Gerber 图 8^=g$;g
36 ground plane 接地层 bJe*J\){
37 Henry 电感单位:亨利 evPr~_
38 Human Body Model 人体模式 Pgg6(O9}B^
39 Hysteresis 滞回 NAhV8
40 inrush current 涌入电流 La?q>
41 Inverting 反相 {
yU1db^
42 jittery 抖动 I})la!9
43 Junction 结点 _:0<]<x?
44 Kelvin connection 开尔文连接 *=dFTd"#
45 Lead Frame 引脚框架 4NbX!"0
46 Lead Free 无铅 noe1*2*T E
47 level-shift 电平移动 ^4]#Ri=U
48 Line regulation 电源调整率 m_~
p G
49 load regulation 负载调整率 &/R@cS6}'
50 Lot Number 批号 xBU\$ToC
51 Low Dropout 低压差 P]T(I/\g
52 Miller 密勒 53 node 节点 Y5=~>*e
54 Non-Inverting 非反相 &KgR;.R^J
55 novel 新颖的 :gY$/1SYD
56 off state 关断状态 *wP8)yv7
57 Operating supply voltage 电源工作电压 cO<]%L0
58 out drive stage 输出驱动级 sl|s#+Z
59 Out of Phase 异相 %@ $h?HP
60 Part Number 产品型号 Dqe)8 r
61 pass transistor pass transistor &/=>:ay+#
62 P-channel MOSFET P沟道MOSFET UT [7 J
63 Phase margin 相位裕度 PB4E_0}h
64 Phase Node 开关节点 xq=+M!V
65 portable electronics 便携式电子设备 wQ!~c2a<8
66 power down 掉电 3/:O8H
67 Power Good 电源正常 1O45M/5\o
68 Power Groud 功率地 +-'qI_xo
69 Power Save Mode 节电模式 [{N
i94:d
70 Power up 上电 KpC)A5u6
71 pull down 下拉 64s+
0}
72 pull up 上拉 COFs?L.`
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) =nFT0];
74 push pull converter 推挽转换器 P~_CDh.N
75 ramp down 斜降 )(*A1C[
76 ramp up 斜升 9~zh]deH
77 redundant diode 冗余二极管 x`PIJE
78 resistive divider 电阻分压器 dJ?VN!B0
79 ringing 振 铃 _@;2h`q ?
80 ripple current 纹波电流 +^gh3Y
81 rising edge 上升沿 52m^jT Sx
82 sense resistor 检测电阻 r4JXbh6Tt
83 Sequenced Power Supplys 序列电源 3{Ze>yFE
84 shoot-through 直通,同时导通 5h1!E
85 stray inductances. 杂散电感 BArsj
86 sub-circuit 子电路 \qQ5x
87 substrate 基板 2F!K
}aw
88 Telecom 电信 7;;W{W%
89 Thermal Information 热性能信息 k(=\&T
90 thermal slug 散热片 jCW>=1:JGY
91 Threshold 阈值 'nP'MA9b;a
92 timing resistor 振荡电阻 7zr\AgV9
93 Top FET Top FET Qat%<;P2
94 Trace 线路,走线,引线 )g:UH
Ns
95 Transfer function 传递函数 78+H|bH8
96 Trip Point 跳变点 Mn>dI@/gM
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) T_Z@uZom.
98 Under Voltage Lock Out (UVLO) 欠压锁定 x@DXW(
99 Voltage Reference 电压参考 X]cB`?vR
100 voltage-second product 伏秒积 M42Zpb].
101 zero-pole frequency compensation 零极点频率补偿 X$/3
102 beat frequency 拍频 {tOuKnnS
103 one shots 单击电路 7b+OIZB
104 scaling 缩放 ~Zl`Ap
105 ESR 等效串联电阻 [Page] -J[zJ4z#
106 Ground 地电位 Cb=r 8C
107 trimmed bandgap 平衡带隙 n ^n'lgUT
108 dropout voltage 压差 0#K@^a
109 large bulk capacitance 大容量电容 (n" )
110 circuit breaker 断路器 @kvp2P+O
111 charge pump 电荷泵 OOl{
112 overshoot 过冲 vR,HCI
t)cG_+rJ
印制电路printed circuit a:zx&DwM
印制线路 printed wiring `Z|sp
印制板 printed board
@KOa5-u
印制板电路 printed circuit board ~lDLdUs
印制线路板 printed wiring board X&wK<
印制元件 printed component x ?^c:`.
印制接点 printed contact &tWWb`
印制板装配 printed board assembly #cdLg-v
板 board =v:_N.Fh-c
刚性印制板 rigid printed board zNE!m:s
挠性印制电路 flexible printed circuit #> CN,eiZ
挠性印制线路 flexible printed wiring .kC}. Q_
齐平印制板 flush printed board ,<EmuEw |
金属芯印制板 metal core printed board d[~c-G6
金属基印制板 metal base printed board J3:P/n&
多重布线印制板 mulit-wiring printed board am%qlN<
塑电路板 molded circuit board g,,cV+
散线印制板 discrete wiring board \W=
微线印制板 micro wire board 1'aS2vB9
积层印制板 buile-up printed board l$zNsf.
表面层合电路板 surface laminar circuit <ht>>
埋入凸块连印制板 B2it printed board uXhp+q\
载芯片板 chip on board `4k;`a
埋电阻板 buried resistance board 2~ 'Q#(
母板 mother board s|,]Nb=z/
子板 daughter board G!rcY5!J
背板 backplane \&TTe8
裸板 bare board cU{LyZp
键盘板夹心板 copper-invar-copper board 3M@>kIT8
动态挠性板 dynamic flex board OW-+23)sj
静态挠性板 static flex board z9D2,N.
可断拼板 break-away planel ^k_!+8"q{
电缆 cable wSAm[.1i
挠性扁平电缆 flexible flat cable (FFC) QlXy9-oJ"
薄膜开关 membrane switch %1=W#jz
混合电路 hybrid circuit =pk'a_P8-
厚膜 thick film
:lE7v~!Z
厚膜电路 thick film circuit I7uYsjh@u
薄膜 thin film ko5\*!|:lj
薄膜混合电路 thin film hybrid circuit #e|eWi>
互连 interconnection ~(Tz <
导线 conductor trace line +\W"n_PPy
齐平导线 flush conductor 26Yg?:kP
传输线 transmission line Fj]S8wI
跨交 crossover RF;N]A?*
板边插头 edge-board contact 'P~ *cr ?A
增强板 stiffener mD=?C
基底 substrate $<aBawLZO
基板面 real estate CD[7h
导线面 conductor side ^#=L?e
元件面 component side 7q\c\qL
焊接面 solder side p0tv@8C>
导电图形 conductive pattern .H>Rqikj
非导电图形 non-conductive pattern ~'U;).C
基材 base material JNu - z:J
层压板 laminate -
a=yid
覆金属箔基材 metal-clad bade material Kz<xu ulr
覆铜箔层压板 copper-clad laminate (CCL) w1}[lq@
复合层压板 composite laminate .U1dcL6
薄层压板 thin laminate .Gv~e!a8
基体材料 basis material n -=\n6"P
预浸材料 prepreg +p[~hM6?
粘结片 bonding sheet ?k3b\E3
预浸粘结片 preimpregnated bonding sheer ,S5#Kka~a
环氧玻璃基板 epoxy glass substrate
1y@-
预制内层覆箔板 mass lamination panel ?UxY4m%R;
内层芯板 core material T9$U./69-L
粘结层 bonding layer 9F-k:hD |
粘结膜 film adhesive y H'\<bT
无支撑胶粘剂膜 unsupported adhesive film ;CvGIp&y
覆盖层 cover layer (cover lay) E??%)q
增强板材 stiffener material |4c==7.
铜箔面 copper-clad surface eeDhTw9
去铜箔面 foil removal surface J{Ay(
层压板面 unclad laminate surface o2|(0uN'
基膜面 base film surface RasoOj$
胶粘剂面 adhesive faec l6WcnJ
原始光洁面 plate finish P$QjDu-
粗面 matt finish |HEw~x<=
剪切板 cut to size panel 9s!/y iP5
超薄型层压板 ultra thin laminate H|Nw)*.
A阶树脂 A-stage resin IN"vi|1
B阶树脂 B-stage resin Jt)~h,68
C阶树脂 C-stage resin t#q>U%!
环氧树脂 epoxy resin vqs~a7E-P
酚醛树脂 phenolic resin W"*R#:Q
聚酯树脂 polyester resin ZX0c_Mk=
聚酰亚胺树脂 polyimide resin m7"f6zSo(
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin }-vBRY
丙烯酸树脂 acrylic resin {eXYl[7n
三聚氰胺甲醛树脂 melamine formaldehyde resin /Ow?nWSt
多官能环氧树脂 polyfunctional epoxy resin m=9N^_
溴化环氧树脂 brominated epoxy resin Q*8-d9C
环氧酚醛 epoxy novolac 4yA`);r62
氟树脂 fluroresin f+920/>!Z
硅树脂 silicone resin -b$OHFL
硅烷 silane caP
聚合物 polymer |FFC8R%@]u
无定形聚合物 amorphous polymer d.AjH9 jg
结晶现象 crystalline polamer (*ng$zZ$
双晶现象 dimorphism OGFKc#
共聚物 copolymer @NIypi$T
合成树脂 synthetic
SoX V
热固性树脂 thermosetting resin [Page] ]cr;PRyv
热塑性树脂 thermoplastic resin 7j:{rCp3J
感光性树脂 photosensitive resin J$Epj
环氧值 epoxy value Q8x{V_Pot
双氰胺 dicyandiamide /;4MexgB%
粘结剂 binder Q.1ohj0)
胶粘剂 adesive X2[cR;;'
固化剂 curing agent HWhKX:`l
阻燃剂 flame retardant 0vp I#q
遮光剂 opaquer ?~.&Y
增塑剂 plasticizers ?nW#qy!R
不饱和聚酯 unsatuiated polyester b..$5
聚酯薄膜 polyester pG
@iR*?
聚酰亚胺薄膜 polyimide film (PI) IFxI>6<&
聚四氟乙烯 polytetrafluoetylene (PTFE) 1VFqT'
增强材料 reinforcing material 2[po~}2-0
折痕 crease 5@$4.BGcF
云织 waviness .Qt3!ek
鱼眼 fish eye a1SOC=.M;
毛圈长 feather length Hz8`)cv`
厚薄段 mark C8:"+;
裂缝 split 'cN#rHPB6
捻度 twist of yarn P@YL.'KU)
浸润剂含量 size content Td*Oljj._U
浸润剂残留量 size residue sK0VT"7K
处理剂含量 finish level 4P!DrOB
偶联剂 couplint agent h&bV!M
断裂长 breaking length V^I/nuy
吸水高度 height of capillary rise t3$gwO$
湿强度保留率 wet strength retention ~C'nBV
白度 whitenness Ts .Zl{B
导电箔 conductive foil kA!(}wRL
铜箔 copper foil cl{W]4*$
压延铜箔 rolled copper foil k!=GNRRZE
光面 shiny side lmKq xs4
粗糙面 matte side L59oh
处理面 treated side =zeLs0s;
防锈处理 stain proofing SRN9(LN
双面处理铜箔 double treated foil `?^w
模拟 simulation DXW?;|8)O
逻辑模拟 logic simulation >x
ghq
电路模拟 circit simulation e[mhbFf-
时序模拟 timing simulation Q5nyD/k4c
模块化 modularization o?K|[gNi
设计原点 design origin O6,"#BX
优化(设计) optimization (design) n/oipiYx
供设计优化坐标轴 predominant axis =veOVv[Q&/
表格原点 table origin >B /&V|E
元件安置 component positioning ^FM9} t/U,
比例因子 scaling factor i
`QK'=h[
扫描填充 scan filling ASZ5;N4u
矩形填充 rectangle filling KV}U{s+U8
填充域 region filling b+].Uc
实体设计 physical design hYc{9$
逻辑设计 logic design c48J!,jCd'
逻辑电路 logic circuit _$\5ZVe
层次设计 hierarchical design 8V|jL?a~
自顶向下设计 top-down design BX(d"z b<
自底向上设计 bottom-up design \1mM5r~
费用矩阵 cost metrix yC0f/O
元件密度 component density {L4>2rF
自由度 degrees freedom ]~00=nXFM/
出度 out going degree j%Z{.>mJ
入度 incoming degree _8b]o~[Z+
曼哈顿距离 manhatton distance XDdcq ]*|
欧几里德距离 euclidean distance PR@4' r|a
网络 network x)VIA]
阵列 array `)=A!x y
段 segment ?3,64[
逻辑 logic i\Pr3
7
"
逻辑设计自动化 logic design automation 2Cd
--W+=
分线 separated time r` `iC5Ii
分层 separated layer ?[S
>&Vq
定顺序 definite sequence nN=:#4
>Y
导线(通道) conduction (track) u1)TG"+0
导线(体)宽度 conductor width K>R;~
o
导线距离 conductor spacing qSoBj&6y
导线层 conductor layer r($_>TS&"
导线宽度/间距 conductor line/space B2G5hbaA
第一导线层 conductor layer No.1 K rr?`n
圆形盘 round pad 0?F@iB~1F
方形盘 square pad oBj>9I;
菱形盘 diamond pad X4} `>
长方形焊盘 oblong pad Jn[q<e"
子弹形盘 bullet pad Lk`k>Nn)
泪滴盘 teardrop pad !
[|vx!p
雪人盘 snowman pad iijd$Tv
形盘 V-shaped pad V ~*mOt7G
环形盘 annular pad ,dZ#,<
非圆形盘 non-circular pad s0)qlm*
隔离盘 isolation pad
N8kb-2
非功能连接盘 monfunctional pad )7I.N]=
偏置连接盘 offset land DO1 JPeIi
腹(背)裸盘 back-bard land qX
p,d
盘址 anchoring spaur =nvAOvP{?
连接盘图形 land pattern @cu}3>
连接盘网格阵列 land grid array tB ,.
孔环 annular ring !$p2z_n$@.
元件孔 component hole 7~kpRa@\P
安装孔 mounting hole })zB".
支撑孔 supported hole _b!;(~@p
非支撑孔 unsupported hole h/1nm U]
导通孔 via m]0^
镀通孔 plated through hole (PTH) Siz!/O!'
余隙孔 access hole GP{$v:RG
盲孔 blind via (hole) PTzp;.
埋孔 buried via hole z;bH<cQ
埋,盲孔 buried blind via ~mXZfG/D
任意层内部导通孔 any layer inner via hole Sv7>IVC?@
全部钻孔 all drilled hole (>rS
_#^
定位孔 toaling hole @ate49W
无连接盘孔 landless hole 2vqmsl?
中间孔 interstitial hole $Yx6#m}[M
无连接盘导通孔 landless via hole 7>PF ~=
引导孔 pilot hole 1Lm].tq
端接全隙孔 terminal clearomee hole r^w\9a_
准尺寸孔 dimensioned hole [Page] $[M}K
在连接盘中导通孔 via-in-pad NJ|NJp&0
孔位 hole location C.yY8?|
孔密度 hole density )Lc<;=w'9
孔图 hole pattern W{fULl
钻孔图 drill drawing HA^jk%53
装配图assembly drawing -+3be(u
参考基准 datum referan ]]p19 [4s
1) 元件设备 \LO_Nu9
=bs.2aN&^
三绕组变压器:three-column transformer ThrClnTrans !
Q|J']|
双绕组变压器:double-column transformer DblClmnTrans My]+?.Ru
电容器:Capacitor [2GXAvXsT
并联电容器:shunt capacitor S|K|rDr0n
电抗器:Reactor ~In{lQ[QX
母线:Busbar G 2%
输电线:TransmissionLine G$;>ueM
发电厂:power plant ./ "mn3U
断路器:Breaker l `fW{lh
刀闸(隔离开关):Isolator TK;\_yN
分接头:tap ftYR,!&
电动机:motor -W|*fKN`3
(2) 状态参数 98ca[.ui
`t{D7I7
有功:active power d^KBIz8$5l
无功:reactive power !(kX~S
电流:current zc6Ho
容量:capacity 5a=nF9/
电压:voltage wl7 M fyU
档位:tap position qTyg~]e9(
有功损耗:reactive loss E^b
pckP
无功损耗:active loss o;ik Z*+*
功率因数:power-factor +VSZhg,Np8
功率:power ?Wwh
_TO
功角:power-angle rs[?v*R74
电压等级:voltage grade _FL<egK
空载损耗:no-load loss sS
C?io
铁损:iron loss 98BYtxa
铜损:copper loss ^[ET&"
空载电流:no-load current Y{,2X~ 7
阻抗:impedance j h;
9
[
正序阻抗:positive sequence impedance ^fkCyE;=
负序阻抗:negative sequence impedance fucUwf\_
零序阻抗:zero sequence impedance 66oK3%[
电阻:resistor E::L?#V
电抗:reactance bX7EO 8
电导:conductance fk+1# 7{
电纳:susceptance LFCTr/,
无功负载:reactive load 或者QLoad p?Z(rCp
有功负载: active load PLoad hO#HvW
遥测:YC(telemetering) !d\t:0;
遥信:YX Q`N18I3
励磁电流(转子电流):magnetizing current S2ark,sp6
定子:stator /^J2B8y
功角:power-angle .\$Wy$ d
上限:upper limit iDZrK%fl
下限:lower limit y
$:yz;
并列的:apposable *]5z^>
q;7
高压: high voltage !&W|myN^
低压:low voltage A
6 :Q<
中压:middle voltage USprsaj
电力系统 power system $)Wb#B
发电机 generator 5Yl6?
励磁 excitation +i+tp8T+7
励磁器 excitor -)X{n?i
电压 voltage q&Q/?g>f
电流 current U M@naU
母线 bus Yr+d1(
变压器 transformer V7P6zAJy
升压变压器 step-up transformer SWT:frki`
高压侧 high side M2dmG<
输电系统 power transmission system *.8JP
输电线 transmission line IK3qE!,&U
固定串联电容补偿fixed series capacitor compensation j$+gq*I&E
稳定 stability A]j}'
电压稳定 voltage stability g&bwtEZ
功角稳定 angle stability e[}],W
暂态稳定 transient stability IdF$Ml#[h
电厂 power plant [g +y_@9s
能量输送 power transfer $:e)$Xnn-
交流 AC A';n6ne%i
装机容量 installed capacity H-Pq!9[DB
电网 power system ^T{8uJ'kn
落点 drop point b{BaQ>.(`
开关站 switch station u%xDsTDP
双回同杆并架 double-circuit lines on the same tower b"t")U==
变电站 transformer substation ~6kJ~R4
补偿度 degree of compensation -Un=TX
高抗 high voltage shunt reactor )
oxIzF
无功补偿 reactive power compensation E3f9<hm
故障 fault P% Q@9kO>
调节 regulation (`pNXQ0n
裕度 magin WO@H*
三相故障 three phase fault iD<6t_8),
故障切除时间 fault clearing time jXWNHIl)@
极限切除时间 critical clearing time D
M}s0O$0
切机 generator triping JR)/c6j
高顶值 high limited value 7
5|pp
强行励磁 reinforced excitation 7WP%J-
线路补偿器 LDC(line drop compensation) E+z18Lf?
机端 generator terminal -E]Sk&4Gj
静态 static (state) {y b D
动态 dynamic (state) <5I1 DF[
单机无穷大系统 one machine - infinity bus system 5U~OP
机端电压控制 AVR y
AOg\+
电抗 reactance ]~8v^A7u
电阻 resistance &n|*uLn
功角 power angle J\{$ot
有功(功率) active power T(V8;!
无功(功率) reactive power rrcwtLNbu
功率因数 power factor `L\)ahM
无功电流 reactive current f>z`i\1oO
下降特性 droop characteristics b=1%pX_
斜率 slope Fu%X
额定 rating 4uUs7T
变比 ratio AW/wI6[T
参考值 reference value Qci$YTwl>
电压互感器 PT "yW&<7u1
分接头 tap [4XC#OgA
下降率 droop rate |1l&@#j!2
仿真分析 simulation analysis `
8UWE {
传递函数 transfer function l E^*t`+
框图 block diagram .*!#98pT
受端 receive-side 5m7b\Mak
裕度 margin ue6d~8&
同步 synchronization \QT9HAdd@
失去同步 loss of synchronization ;'HF'Z
阻尼 damping !)c=1EX]"
摇摆 swing X>t3|h
保护断路器 circuit breaker BS7J#8cu
电阻:resistance :Q-oV8t{
电抗:reactance @Tr&`Hi
阻抗:impedance 7F(5)Utt
电导:conductance 6>,#
6{?jl
电纳:susceptance