1 backplane 背板 aH%tD!%,o
2 Band gap voltage reference 带隙电压参考 8 rE`
3 benchtop supply 工作台电源 9\Rk(dd
4 Block Diagram 方块图 5 Bode Plot 波特图 |@b|Q,
6 Bootstrap 自举 bZK`]L[
7 Bottom FET Bottom FET J+0
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8 bucket capcitor 桶形电容 >~_>.R+{
9 chassis 机架 uU$/4{
10 Combi-sense Combi-sense |1!|SarM{B
11 constant current source 恒流源 n|=yw6aV'
12 Core Sataration 铁芯饱和 *WzPxQ_
13 crossover frequency 交叉频率 ZFX}=?+
14 current ripple 纹波电流 4K;0.W;~|
15 Cycle by Cycle 逐周期 biV|W@JM
16 cycle skipping 周期跳步 "lA$;\&
17 Dead Time 死区时间 c}=[r1M*
18 DIE Temperature 核心温度 NJ}xqg
19 Disable 非使能,无效,禁用,关断 Tnf&32IA
20 dominant pole 主极点 WpI5C,3Z!l
21 Enable 使能,有效,启用 EG=U](8T
22 ESD Rating ESD额定值 r!>=G%
23 Evaluation Board 评估板 A1zV5-E/
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. @*T8>
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 [daR)C
25 Failling edge 下降沿 D 5Z7?Y
26 figure of merit 品质因数 S +73 /Vs
27 float charge voltage 浮充电压 |SJ%Myy
28 flyback power stage 反驰式功率级 Y'6P ~C;v
29 forward voltage drop 前向压降 _cfAJ)8=
30 free-running 自由运行 jP3 ~O
31 Freewheel diode 续流二极管 aQ 6T2bQ
32 Full load 满负载 33 gate drive 栅极驱动 /oM&29 jy
34 gate drive stage 栅极驱动级 8p~[8}
35 gerber plot Gerber 图 |])Ko08*tE
36 ground plane 接地层 G
in
37 Henry 电感单位:亨利 OnW,R3eg
38 Human Body Model 人体模式 Q6X}R,KA1
39 Hysteresis 滞回 H:1F=$0I9
40 inrush current 涌入电流 QmPHf*w[
41 Inverting 反相 @yPI$"Ma
42 jittery 抖动 &19z|Id
43 Junction 结点 a5g1.6hF
44 Kelvin connection 开尔文连接 7.^1I7O
45 Lead Frame 引脚框架 EX3;|z@5;
46 Lead Free 无铅 7 Uu
47 level-shift 电平移动 C\[g>_J
48 Line regulation 电源调整率 g'eJN
49 load regulation 负载调整率 )i.\q
50 Lot Number 批号 ?=Z0N&}[
51 Low Dropout 低压差 37,)/8]lG
52 Miller 密勒 53 node 节点 a)L=+Z
54 Non-Inverting 非反相 ==7=1QfP
55 novel 新颖的 WgV[,(
56 off state 关断状态 %}Ob~m>P
57 Operating supply voltage 电源工作电压 0jefV*3qpB
58 out drive stage 输出驱动级 bzMs\rj\
59 Out of Phase 异相 }5;3c %
60 Part Number 产品型号 2ld0w=?+eu
61 pass transistor pass transistor 5HbPS%^.
62 P-channel MOSFET P沟道MOSFET f['pHR%l2$
63 Phase margin 相位裕度 %1]Lc=[j
64 Phase Node 开关节点 K*
0]*am|v
65 portable electronics 便携式电子设备 o{QPW
66 power down 掉电 Op<|Oz$Q|l
67 Power Good 电源正常 6sRKbp|r7
68 Power Groud 功率地 ! XNTk]!
69 Power Save Mode 节电模式 9=^4p=1J
70 Power up 上电 @)wNINvD
71 pull down 下拉 Wr;?t!
72 pull up 上拉 <wt9K2,
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) +4p gPv
74 push pull converter 推挽转换器 d `+cNKf
75 ramp down 斜降 ze%)fZI0f
76 ramp up 斜升 J$<g"z3
77 redundant diode 冗余二极管 5/{gY{
78 resistive divider 电阻分压器 VlFDMw.4.+
79 ringing 振 铃 "Q@ZS2;A
80 ripple current 纹波电流 #
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81 rising edge 上升沿 vo DTU]pf
82 sense resistor 检测电阻 cS1BB#N0
83 Sequenced Power Supplys 序列电源 wq&TU'O
84 shoot-through 直通,同时导通
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85 stray inductances. 杂散电感 s8N\cOd#i
86 sub-circuit 子电路 Me*]Bh
87 substrate 基板 ,
88 Telecom 电信 2L_ts=
89 Thermal Information 热性能信息 Y|iALrx
90 thermal slug 散热片 $r=Ud >
91 Threshold 阈值 ! Q5ip'L
92 timing resistor 振荡电阻 Y;'7Ek)
93 Top FET Top FET O8:,XTAN
94 Trace 线路,走线,引线 ]jS+ItL@
95 Transfer function 传递函数 ojH-;|f
96 Trip Point 跳变点 xem:#>&r
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) .<`Rq'
98 Under Voltage Lock Out (UVLO) 欠压锁定 :xT=uE.I
99 Voltage Reference 电压参考 9f4#b8
100 voltage-second product 伏秒积 =r:-CRq(
101 zero-pole frequency compensation 零极点频率补偿 7L:$Amb_F
102 beat frequency 拍频 pJ#R :#P
103 one shots 单击电路 ,2%> e"%
104 scaling 缩放 uNYHEs6%T$
105 ESR 等效串联电阻 [Page] B6b {hsO
106 Ground 地电位 x+9aTsZ
107 trimmed bandgap 平衡带隙 hQfxz,X
108 dropout voltage 压差 =kvYE,,g_
109 large bulk capacitance 大容量电容 =e,2/Ep{i
110 circuit breaker 断路器 ` 0k
111 charge pump 电荷泵 &?<o692
112 overshoot 过冲 *5#Y[c
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印制电路printed circuit #9Z*.
印制线路 printed wiring /*lSpsBn
印制板 printed board bewi.$E{
印制板电路 printed circuit board %o+VZEH3
印制线路板 printed wiring board *Gm%Dn
印制元件 printed component PU^Z7T);
印制接点 printed contact ;o#R(m@Lx
印制板装配 printed board assembly ET`;TfqM
板 board &k?Mt#J
刚性印制板 rigid printed board iCIu]6
挠性印制电路 flexible printed circuit ~J6c1jG
挠性印制线路 flexible printed wiring dO e|uQXyD
齐平印制板 flush printed board #IP<4"Hf
金属芯印制板 metal core printed board '+|{4-V
金属基印制板 metal base printed board s]r"-^eS3
多重布线印制板 mulit-wiring printed board ![iAALPNl
塑电路板 molded circuit board ;ePmN|rq;
散线印制板 discrete wiring board ge[+/$(1
微线印制板 micro wire board U&/Jh^Yy
积层印制板 buile-up printed board h"')D
表面层合电路板 surface laminar circuit q7wd9 6G:
埋入凸块连印制板 B2it printed board It4J\S
载芯片板 chip on board /9WR>NUAO
埋电阻板 buried resistance board g/4.^c
母板 mother board d3(T=9;f2
子板 daughter board g0^%X9s
背板 backplane 2`l$uEI3oJ
裸板 bare board ^m{kn8
键盘板夹心板 copper-invar-copper board L;'+O
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动态挠性板 dynamic flex board XWbe|K!e
静态挠性板 static flex board #:3E.=
可断拼板 break-away planel pscCXk(|A`
电缆 cable fdN-Zq@'
挠性扁平电缆 flexible flat cable (FFC) t.>vLzrU
薄膜开关 membrane switch PZRpH
混合电路 hybrid circuit V2'(}k
厚膜 thick film ^Yn{Vi2.
厚膜电路 thick film circuit 7k:}9M~
薄膜 thin film {JzX`Z30l
薄膜混合电路 thin film hybrid circuit z$`=7 afp
互连 interconnection
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导线 conductor trace line 6pQ#Zg()vp
齐平导线 flush conductor o_EXbS]C
传输线 transmission line |]]Xee]
跨交 crossover >\$qF
板边插头 edge-board contact abCcZ<=|b
增强板 stiffener w=3@IW
基底 substrate ^&DHBx"J
基板面 real estate NwuME/C7#
导线面 conductor side Om{[ <tL
元件面 component side 2[Q*?N
焊接面 solder side 6,0pkx&Nv
导电图形 conductive pattern ZsUxO%jP
非导电图形 non-conductive pattern _pKW($\
基材 base material v)+wr[Qs
层压板 laminate 2,;+)
覆金属箔基材 metal-clad bade material V4 Pf?g
覆铜箔层压板 copper-clad laminate (CCL) l0u6nGkh
复合层压板 composite laminate .7Ys@;>B
薄层压板 thin laminate Y1Bj++?2
基体材料 basis material Uz\B^"i|
预浸材料 prepreg or~o'
粘结片 bonding sheet WUdKj
预浸粘结片 preimpregnated bonding sheer OcMd'fwO
环氧玻璃基板 epoxy glass substrate us4.-L
预制内层覆箔板 mass lamination panel 5}~*,_J2Z
内层芯板 core material Y+V*$73`
粘结层 bonding layer [FC7+
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粘结膜 film adhesive }`Q'!_`
无支撑胶粘剂膜 unsupported adhesive film m^O:k"+ !
覆盖层 cover layer (cover lay) KcfW+>W3
增强板材 stiffener material 23y7l=.b/
铜箔面 copper-clad surface ,u{d@U^)3@
去铜箔面 foil removal surface [={pFq`
层压板面 unclad laminate surface WMZa6cH
基膜面 base film surface ()(@Qcc
胶粘剂面 adhesive faec <=cj)
原始光洁面 plate finish LlRvm/
粗面 matt finish HHCsWe-
剪切板 cut to size panel @o44b!i
超薄型层压板 ultra thin laminate g;\zD_":l
A阶树脂 A-stage resin ]NuY{T&:
B阶树脂 B-stage resin u-pE
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C阶树脂 C-stage resin g84~d(\?
环氧树脂 epoxy resin *2 4P T7
酚醛树脂 phenolic resin f&ZxG,]Hi
聚酯树脂 polyester resin Gc4N)oq)}b
聚酰亚胺树脂 polyimide resin h^~eTi;c]Q
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin AT+|}B!
丙烯酸树脂 acrylic resin H4KwbTT"+
三聚氰胺甲醛树脂 melamine formaldehyde resin _xAdvr' W
多官能环氧树脂 polyfunctional epoxy resin 8:$kFy\A'
溴化环氧树脂 brominated epoxy resin 23pHB|X
环氧酚醛 epoxy novolac vp4!p~C{
氟树脂 fluroresin *0l^/jqn:
硅树脂 silicone resin W}WGg|ug
硅烷 silane 7SXi#{
聚合物 polymer w^p
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无定形聚合物 amorphous polymer i{ T0[\4
结晶现象 crystalline polamer kdQ=%
双晶现象 dimorphism QCa$<~c
共聚物 copolymer {TzKHnP
合成树脂 synthetic 0OEyJ|g
热固性树脂 thermosetting resin [Page] =:6Y<ftC
热塑性树脂 thermoplastic resin mV`Z]-$$i
感光性树脂 photosensitive resin [ #A!B#`
环氧值 epoxy value #rzxFMA"
双氰胺 dicyandiamide (LTm!"Q
粘结剂 binder M)I&^mm39
胶粘剂 adesive WsJ3zZc
固化剂 curing agent YqR
MVWcnk
阻燃剂 flame retardant :5U(}\dL{
遮光剂 opaquer ;'}1
增塑剂 plasticizers Xn$]DE/r}N
不饱和聚酯 unsatuiated polyester wR nt$1
聚酯薄膜 polyester "]*0)h_
聚酰亚胺薄膜 polyimide film (PI) bX|Z||img
聚四氟乙烯 polytetrafluoetylene (PTFE) HP. j.
增强材料 reinforcing material 1U@qRU
折痕 crease l]T|QhiVd
云织 waviness <z %zzc1s
鱼眼 fish eye
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毛圈长 feather length N:d`L+tcc
厚薄段 mark cEve70MV
裂缝 split bH3-#mw5w
捻度 twist of yarn 22}J.'Zb
浸润剂含量 size content 9"=:\PE
浸润剂残留量 size residue d@7
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处理剂含量 finish level tE3!;
偶联剂 couplint agent o`M7:8G
断裂长 breaking length 8.{5c6G
吸水高度 height of capillary rise !wJ~p:vRdY
湿强度保留率 wet strength retention 'Xxt[Jy
白度 whitenness )(PA:j
导电箔 conductive foil 8!b#ez
铜箔 copper foil ~-A5h(
压延铜箔 rolled copper foil x}AWWmXv
光面 shiny side eDX{}Dq(
粗糙面 matte side z1T.\mzfX
处理面 treated side (t>BO`,
防锈处理 stain proofing SEIGs_^'\
双面处理铜箔 double treated foil p r(:99~3
模拟 simulation ~U~KUL|
逻辑模拟 logic simulation .N5}JUj
电路模拟 circit simulation Jq<&`6hn
时序模拟 timing simulation ;pBSGr9
模块化 modularization vtCt6M
设计原点 design origin [,8@oM#
优化(设计) optimization (design) -%5*c61
供设计优化坐标轴 predominant axis ?\(E+6tpP
表格原点 table origin %%G2w63M
元件安置 component positioning &Jk0SUk MP
比例因子 scaling factor owmV7E1
扫描填充 scan filling +a"MSPC4w
矩形填充 rectangle filling A=I]1r
填充域 region filling 1bYc^(z0
实体设计 physical design C6M|A3^T
逻辑设计 logic design g.SFl
逻辑电路 logic circuit R',Q)<
层次设计 hierarchical design *q=pv8&*s
自顶向下设计 top-down design Nm\0>}
自底向上设计 bottom-up design |XtN\9V.
费用矩阵 cost metrix *_!nil 3(i
元件密度 component density A'c0zWV2
自由度 degrees freedom Kxn/@@z>u
出度 out going degree -ce N}Cb3
入度 incoming degree /v
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曼哈顿距离 manhatton distance jdK~]eld=
欧几里德距离 euclidean distance 0x4Xs
网络 network ~ZweP$l
阵列 array Cf91#%:cN
段 segment &;&i#ZO
逻辑 logic lr=? &>MXj
逻辑设计自动化 logic design automation D\}^<HW
分线 separated time x{*g^f
分层 separated layer t:eZ`6o$T\
定顺序 definite sequence }JeGjpAcV
导线(通道) conduction (track) COH0aNp;
导线(体)宽度 conductor width sG=D(n1
导线距离 conductor spacing -Ds}kdxw
导线层 conductor layer [ %cW ?@
导线宽度/间距 conductor line/space ZNuz%VO
第一导线层 conductor layer No.1 zq>pK_WG
圆形盘 round pad |F=!0Id<
方形盘 square pad F=7X,hK
菱形盘 diamond pad A5S9F8Q/]
长方形焊盘 oblong pad B5GT^DaT
子弹形盘 bullet pad , ;W6wj
泪滴盘 teardrop pad "9'~6b
雪人盘 snowman pad oM G8?p
形盘 V-shaped pad V Iojyku\W.
环形盘 annular pad |L}zB,
非圆形盘 non-circular pad x4r8^,K3Zn
隔离盘 isolation pad Dt%Gv0
非功能连接盘 monfunctional pad VUpa^R
偏置连接盘 offset land %PRG;kR
腹(背)裸盘 back-bard land P"Lk(gY
盘址 anchoring spaur #` Q3Z}C
连接盘图形 land pattern X;lL$
连接盘网格阵列 land grid array =iW!Mq
孔环 annular ring 'r~,~AI
元件孔 component hole sD H^l)4h
安装孔 mounting hole w#vSZbh
支撑孔 supported hole &_Z