1 backplane 背板 qUob?|
^
2 Band gap voltage reference 带隙电压参考 w35J.zn
3 benchtop supply 工作台电源 2.l Z:VLN
4 Block Diagram 方块图 5 Bode Plot 波特图 YW_Q\|p]M
6 Bootstrap 自举 E[@ u
3i8
7 Bottom FET Bottom FET rvbLyv;~
8 bucket capcitor 桶形电容 :U3kW8;UMP
9 chassis 机架 t<z`N-5*
10 Combi-sense Combi-sense q_g+Jf
P-D
11 constant current source 恒流源 F`Q[6"<a
12 Core Sataration 铁芯饱和 r? NznNVU
13 crossover frequency 交叉频率 #\.,? A}9
14 current ripple 纹波电流 Po__-xN>Q
15 Cycle by Cycle 逐周期 j53*E
)d
16 cycle skipping 周期跳步 4'g;TI^
17 Dead Time 死区时间 }z _
18 DIE Temperature 核心温度 Bm.:^:&k
19 Disable 非使能,无效,禁用,关断 E:JJ3X|
20 dominant pole 主极点 KxYwJ
21 Enable 使能,有效,启用 hyCh9YOu)
22 ESD Rating ESD额定值 #(#Wv?r6
23 Evaluation Board 评估板 wQP^WzNE
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 9[b<5Llt
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 _=Z,E.EN
25 Failling edge 下降沿 8/i!' 0r\
26 figure of merit 品质因数 m?pstuUK(
27 float charge voltage 浮充电压 P&9Gga^I
28 flyback power stage 反驰式功率级 L;VoJf
29 forward voltage drop 前向压降 xO^:_8=&:
30 free-running 自由运行 ,0*&OXt
31 Freewheel diode 续流二极管 zVXC1u9B
32 Full load 满负载 33 gate drive 栅极驱动 }.3nthgz
34 gate drive stage 栅极驱动级 0E,8R{e
35 gerber plot Gerber 图 -=)+dCyB^
36 ground plane 接地层 i]Fp..`v~
37 Henry 电感单位:亨利 u<3HQ.:;
38 Human Body Model 人体模式 P3cR l']
39 Hysteresis 滞回 4
Y;Nm1@
40 inrush current 涌入电流 A<5ZF27
41 Inverting 反相 co~Pyj
42 jittery 抖动 ?WF/|/
43 Junction 结点 %X4xv_o`f
44 Kelvin connection 开尔文连接 xC*6vH]?
45 Lead Frame 引脚框架 Bg&i63XL$$
46 Lead Free 无铅 1<BX]-/tP
47 level-shift 电平移动 )~+E[|
48 Line regulation 电源调整率 /tP|b_7O
49 load regulation 负载调整率 UUzYbuS>&l
50 Lot Number 批号 lJu;O/
51 Low Dropout 低压差 ]Y2RqXA*
52 Miller 密勒 53 node 节点 h\5OrD@L
54 Non-Inverting 非反相 @x"0_Qw
55 novel 新颖的 d]:I(9K
56 off state 关断状态 Y' %^NP}o
57 Operating supply voltage 电源工作电压 ,_Z5m;
58 out drive stage 输出驱动级 u+'tfFds&
59 Out of Phase 异相 .QA }u ,EN
60 Part Number 产品型号 bn^{c
61 pass transistor pass transistor BFL`!^
62 P-channel MOSFET P沟道MOSFET 5]n[]FW
63 Phase margin 相位裕度 J4Nln
64 Phase Node 开关节点 Qa.<K{m#?
65 portable electronics 便携式电子设备 2$?C7(kW
66 power down 掉电 IB[)TZ2m
67 Power Good 电源正常 y^%n'h{
68 Power Groud 功率地 &?q/1vLa
69 Power Save Mode 节电模式 +)y^'Qs
70 Power up 上电 t^6dzrF
71 pull down 下拉 h{ AII
72 pull up 上拉 MC<PM6w
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) kL$!E9
74 push pull converter 推挽转换器 xL{a
75 ramp down 斜降 Pb?$t
76 ramp up 斜升 eu(:`uu
77 redundant diode 冗余二极管 c&AygqN
78 resistive divider 电阻分压器 !Cr(Pe]
79 ringing 振 铃 kg'o&^/=
80 ripple current 纹波电流 ch0{+g&
81 rising edge 上升沿 qNYN-f~@,
82 sense resistor 检测电阻 a{R%#e\n
83 Sequenced Power Supplys 序列电源 B)qWtMZx
84 shoot-through 直通,同时导通 m^bNuo
85 stray inductances. 杂散电感
[N/"5
[
86 sub-circuit 子电路 K#pNec
87 substrate 基板 DP3PYJ%+B
88 Telecom 电信 8$0rR55
89 Thermal Information 热性能信息 FQqI<6;
90 thermal slug 散热片 FLGk?.x$\
91 Threshold 阈值 {&\jW!&n
92 timing resistor 振荡电阻 ZuS0DPS`L
93 Top FET Top FET vTJ}8
94 Trace 线路,走线,引线 p$PKa.Y3
95 Transfer function 传递函数 ~v6OsH%vx
96 Trip Point 跳变点 mg*qiScfW
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) [3{W^WSOz
98 Under Voltage Lock Out (UVLO) 欠压锁定 a{
?`t|
99 Voltage Reference 电压参考 A29gz:F(
100 voltage-second product 伏秒积
0tEYU:Qu
101 zero-pole frequency compensation 零极点频率补偿 _nbBIaHN{
102 beat frequency 拍频 DX"xy
103 one shots 单击电路 6~1|qEe6I
104 scaling 缩放 ?kB2iU_f+
105 ESR 等效串联电阻 [Page] E
,|xJjh
106 Ground 地电位 FRg^c
kb"
107 trimmed bandgap 平衡带隙 }>VG~u8
108 dropout voltage 压差 d5D$&5Ec
109 large bulk capacitance 大容量电容 Q4f/Z
110 circuit breaker 断路器 dt`{!lts'
111 charge pump 电荷泵 `"&da#N]
112 overshoot 过冲 ML(
Eo
Y6Lf@}2(i
印制电路printed circuit k;w- E
印制线路 printed wiring BPdfYu,il
印制板 printed board N1|$$9G+
印制板电路 printed circuit board 20Z8HwQi
印制线路板 printed wiring board 3WUTI(
印制元件 printed component ub;ZtsM,%
印制接点 printed contact :j]vf8ec
印制板装配 printed board assembly
jz5qQt]^
板 board 1$%V{4bJ
刚性印制板 rigid printed board _c,'>aH=
挠性印制电路 flexible printed circuit 2U; t(,dn'
挠性印制线路 flexible printed wiring Z| V`B `
齐平印制板 flush printed board DM}YJ
金属芯印制板 metal core printed board p\JfFfC
金属基印制板 metal base printed board nSkPM5\TI
多重布线印制板 mulit-wiring printed board wAxrc+
塑电路板 molded circuit board 4( 1(e
散线印制板 discrete wiring board DXa-rk8
微线印制板 micro wire board <_XWWT%
积层印制板 buile-up printed board 4qYUoCR&
表面层合电路板 surface laminar circuit UGuxV+Nwf
埋入凸块连印制板 B2it printed board QC X8IIHG
载芯片板 chip on board E5N{j4\F
埋电阻板 buried resistance board )I$q 5%q8
母板 mother board vsr[ur[eP
子板 daughter board FN%m0"/Z{t
背板 backplane WN_pd%m
裸板 bare board |7}CQU
键盘板夹心板 copper-invar-copper board ^4`Px/&
动态挠性板 dynamic flex board [w&$| h:;
静态挠性板 static flex board ^-[ ?#]
可断拼板 break-away planel |R#"Th6mH!
电缆 cable &g~ wS@
挠性扁平电缆 flexible flat cable (FFC) jD`d#R
薄膜开关 membrane switch }LijnHH.
混合电路 hybrid circuit f}@jFhr'<
厚膜 thick film e4z1`YLsG
厚膜电路 thick film circuit *mMEl]+
薄膜 thin film `/MvQ/
薄膜混合电路 thin film hybrid circuit p!<$vE
互连 interconnection DmBS0NyR7Y
导线 conductor trace line Cc, `}SP
齐平导线 flush conductor ]wWPXx[>/
传输线 transmission line W{rt8^1
跨交 crossover 8B#GbS
K
板边插头 edge-board contact PT5AA8F
增强板 stiffener hAjM1UQ,Y
基底 substrate s9>(Jzcf9
基板面 real estate I6s3+x;O
导线面 conductor side W7\&~IWub
元件面 component side 03iv3/{H
焊接面 solder side ,~);EC=`
导电图形 conductive pattern -dO'~all
非导电图形 non-conductive pattern wHem5E
基材 base material @YH+cG|
层压板 laminate {h KjD"?
覆金属箔基材 metal-clad bade material Go&D[#
覆铜箔层压板 copper-clad laminate (CCL) n3`&zY
复合层压板 composite laminate rO:u6."_
薄层压板 thin laminate DS-fjH\
基体材料 basis material o1/lZm{\~n
预浸材料 prepreg 3~qR
粘结片 bonding sheet U5]pi+r
预浸粘结片 preimpregnated bonding sheer 5eA8niq#
环氧玻璃基板 epoxy glass substrate AC.A'|"]i
预制内层覆箔板 mass lamination panel lI/0:|l
内层芯板 core material zLD|/`
粘结层 bonding layer &VBd~4|p
粘结膜 film adhesive XIWm>IQ[)
无支撑胶粘剂膜 unsupported adhesive film Cj*-[EL<
覆盖层 cover layer (cover lay) G^(}a]>9
增强板材 stiffener material /"ymZI!k\
铜箔面 copper-clad surface ==cd>03()
去铜箔面 foil removal surface >bUj*#<
层压板面 unclad laminate surface Y?#i{ixX6n
基膜面 base film surface = zl=SLe
胶粘剂面 adhesive faec -K[782Q
原始光洁面 plate finish &)pK%SAM
粗面 matt finish ap}5ElMR
剪切板 cut to size panel 0
3~Ikll
超薄型层压板 ultra thin laminate y)F!c29
A阶树脂 A-stage resin {5%/ T,
B阶树脂 B-stage resin y@wF_WX2
C阶树脂 C-stage resin #ycL'T`X%
环氧树脂 epoxy resin %So]3;'
酚醛树脂 phenolic resin MF[z-7
聚酯树脂 polyester resin %q_Miu@
聚酰亚胺树脂 polyimide resin Ewo*yY>
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin D{'#er
丙烯酸树脂 acrylic resin r-w2\ 2
三聚氰胺甲醛树脂 melamine formaldehyde resin !ax;5 @J
多官能环氧树脂 polyfunctional epoxy resin 83.E0@$
溴化环氧树脂 brominated epoxy resin NE"jh_m-
环氧酚醛 epoxy novolac _eLVBG35z
氟树脂 fluroresin ?kt=z4h9(
硅树脂 silicone resin !;>(ie\
硅烷 silane .9LL+d
聚合物 polymer ;^l_i4A
无定形聚合物 amorphous polymer c!&Qj
结晶现象 crystalline polamer ~hURs;Sb
双晶现象 dimorphism t ,qul4y}
共聚物 copolymer 1a9w(X
合成树脂 synthetic rbk<z\pc
热固性树脂 thermosetting resin [Page]
U
5`y
热塑性树脂 thermoplastic resin yBz>0I3
感光性树脂 photosensitive resin {e]NU<G ,
环氧值 epoxy value +Z?[M1g
双氰胺 dicyandiamide PW_`qP:
粘结剂 binder PI7IBI
胶粘剂 adesive |}qjqtZ
固化剂 curing agent bNvAyKc-
阻燃剂 flame retardant "2h5m4
遮光剂 opaquer 4/L>&%8V
增塑剂 plasticizers 7b.U!Ju
不饱和聚酯 unsatuiated polyester rrQ0qg
聚酯薄膜 polyester b~!om
聚酰亚胺薄膜 polyimide film (PI) 11*"d#
聚四氟乙烯 polytetrafluoetylene (PTFE) (G5T%[/U
增强材料 reinforcing material q[boWW
折痕 crease z\[(g
云织 waviness ~'f8L#[M
鱼眼 fish eye SY6r 8RK
毛圈长 feather length T` ;k!F46
厚薄段 mark #5d8?n
裂缝 split gY\mXM*^
捻度 twist of yarn ew"m!F#
浸润剂含量 size content )tPl<lb
浸润剂残留量 size residue `Y\QUj
处理剂含量 finish level +GPd
偶联剂 couplint agent ~mcZUiP9
断裂长 breaking length Et0&E
吸水高度 height of capillary rise [5LMt*Y
湿强度保留率 wet strength retention 3d U#Ueu
白度 whitenness "sIN86pCs
导电箔 conductive foil >;.*
铜箔 copper foil 4`G=q^GL,
压延铜箔 rolled copper foil &u4Ve8#
光面 shiny side o(nHB
g
粗糙面 matte side V"U~Q=`K
处理面 treated side "D!Dr1
防锈处理 stain proofing :9O|l)N)W=
双面处理铜箔 double treated foil PJ6$);9}6
模拟 simulation X?_v+'G
逻辑模拟 logic simulation 'iDu0LX
电路模拟 circit simulation 1[#
=,
时序模拟 timing simulation
z8tt+AU
模块化 modularization KD9Ca $-
设计原点 design origin n_ OUWvs
优化(设计) optimization (design) I>8Bc
供设计优化坐标轴 predominant axis np&HEh 6
表格原点 table origin hXBqz9
元件安置 component positioning DvU~%%(0^
比例因子 scaling factor ],!pp3U
扫描填充 scan filling OHQ3+WJ
矩形填充 rectangle filling Vc{/o=1u
填充域 region filling rHR5,N:
实体设计 physical design xDNw/'
逻辑设计 logic design g9! dpP
逻辑电路 logic circuit Rf&^th}TH
层次设计 hierarchical design V}p*HB@:
自顶向下设计 top-down design :s? y,
自底向上设计 bottom-up design s 0 =@ &/
费用矩阵 cost metrix %Tk}s fx
元件密度 component density dVK@Fgo
自由度 degrees freedom 3Ro7M=]
出度 out going degree \0xzBs1!
入度 incoming degree 0R.Gjz*Q
曼哈顿距离 manhatton distance #IcT
@(
欧几里德距离 euclidean distance 9L UP{(uq
网络 network 9p!d Q x
阵列 array =rE`ib
段 segment OqUE4.vIP
逻辑 logic ZzwZ,(
逻辑设计自动化 logic design automation 1mkQ"E4
分线 separated time +X4ttv
分层 separated layer ]&; G\9$y
定顺序 definite sequence "y3dwSS
导线(通道) conduction (track) \Mh4X`<e
导线(体)宽度 conductor width as\)S?0`.
导线距离 conductor spacing oc,U4+T
导线层 conductor layer INeWi= 1
导线宽度/间距 conductor line/space UwzE'#Q-
第一导线层 conductor layer No.1 cftn`:(&8
圆形盘 round pad 8O}A/*1FJ
方形盘 square pad 'bQs_
菱形盘 diamond pad C=pPI
长方形焊盘 oblong pad P+D|_3j
子弹形盘 bullet pad ^y;OHo
泪滴盘 teardrop pad zrWq!F*-V\
雪人盘 snowman pad h)aWerzL
形盘 V-shaped pad V bsmoLT
环形盘 annular pad -;DE&~p
非圆形盘 non-circular pad K.sj"#D
隔离盘 isolation pad GurE7J^=
非功能连接盘 monfunctional pad WhVmycdv
偏置连接盘 offset land S'H0nJ3
腹(背)裸盘 back-bard land bx%hizb
盘址 anchoring spaur PSrt/y!
连接盘图形 land pattern |rms[1<_
连接盘网格阵列 land grid array iTtAj~dfZ
孔环 annular ring f%"_U'
元件孔 component hole R'a5,zEo/
安装孔 mounting hole NiQc2\4%
支撑孔 supported hole ;@ ! d!&
非支撑孔 unsupported hole `peJ s~V
导通孔 via 7 +W?Qo
镀通孔 plated through hole (PTH) N#6A>
余隙孔 access hole ch2e#Jf8
盲孔 blind via (hole) :e9jK[)h0
埋孔 buried via hole
4 d 1Y\
埋,盲孔 buried blind via JNz"lTt>[g
任意层内部导通孔 any layer inner via hole U8I~co:h
全部钻孔 all drilled hole ~uD;_Y=u)r
定位孔 toaling hole Wg;TXs/
无连接盘孔 landless hole jKi*3-&
中间孔 interstitial hole qt&"cw
无连接盘导通孔 landless via hole `"-!UkD+
引导孔 pilot hole UDi3dH=
端接全隙孔 terminal clearomee hole &CP@]
pi9L
准尺寸孔 dimensioned hole [Page] YQ`#C#Wb
在连接盘中导通孔 via-in-pad 0FR%<u
孔位 hole location 7[<sl35
孔密度 hole density $YQ&\[pDA
孔图 hole pattern iOXP\:mPo
钻孔图 drill drawing :
MmXH&yR
装配图assembly drawing |0!97*H5
参考基准 datum referan H+&w