1 backplane 背板 L|A}A[ P
2 Band gap voltage reference 带隙电压参考 0]p!
Bscaf
3 benchtop supply 工作台电源 _~]~ssn,1
4 Block Diagram 方块图 5 Bode Plot 波特图 Sc#B-4m
6 Bootstrap 自举 PT4Wox9U
7 Bottom FET Bottom FET 2:3-mWE
8 bucket capcitor 桶形电容 '#pY/,hVB
9 chassis 机架 z><uYO$
10 Combi-sense Combi-sense /P { Zo
11 constant current source 恒流源 3c#oK
12 Core Sataration 铁芯饱和 iZm#
"}VG
13 crossover frequency 交叉频率 FOz~iS\
14 current ripple 纹波电流 HGM ?
?=
15 Cycle by Cycle 逐周期 WZ,}]D
16 cycle skipping 周期跳步 #e)A
17 Dead Time 死区时间 6:_@ ;/03%
18 DIE Temperature 核心温度 J8IdQ:4^l
19 Disable 非使能,无效,禁用,关断 trlZ ^K
20 dominant pole 主极点 %c:v70*h=
21 Enable 使能,有效,启用 {EU?{#
22 ESD Rating ESD额定值 ~0/tU#&
23 Evaluation Board 评估板 r?Q`b2Q
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. f"i(+:la
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 $$'a
25 Failling edge 下降沿 gJ;jh7e@
26 figure of merit 品质因数 tf<}%4G
27 float charge voltage 浮充电压 V;}kgWc1
28 flyback power stage 反驰式功率级 }Rl^7h<!
29 forward voltage drop 前向压降 Q5Yy
\M
30 free-running 自由运行 [=/Yo1:v
31 Freewheel diode 续流二极管 bT93R8yp
32 Full load 满负载 33 gate drive 栅极驱动 F3uR:)4<M
34 gate drive stage 栅极驱动级
P}kBqMM
35 gerber plot Gerber 图 q-?
k=RX`
36 ground plane 接地层 XL=Y~7b
37 Henry 电感单位:亨利 3QM; K^$
38 Human Body Model 人体模式 ly_@dsU'
39 Hysteresis 滞回 `eZ
+Pf".
40 inrush current 涌入电流 /w[B,_ZKTk
41 Inverting 反相 cl\Gh
42 jittery 抖动 ''.P=
43 Junction 结点 (_2Iu%F
44 Kelvin connection 开尔文连接 M( euwy
45 Lead Frame 引脚框架 4DLp+6zP
46 Lead Free 无铅 t?&@bs5~g
47 level-shift 电平移动 Gz09#nFZk
48 Line regulation 电源调整率 nrFuhW\r
49 load regulation 负载调整率 /i!3Fr"
50 Lot Number 批号 :2v^pg|
51 Low Dropout 低压差 [l`_2{:
52 Miller 密勒 53 node 节点 @$:T]N3m
54 Non-Inverting 非反相 rHSA5.[1P
55 novel 新颖的 _U
Q|I|V#
56 off state 关断状态 UYw_k\
57 Operating supply voltage 电源工作电压 S2APqRg*
58 out drive stage 输出驱动级 c>~q2_}W(
59 Out of Phase 异相 P
}BU7`8
60 Part Number 产品型号
H8lh.K
61 pass transistor pass transistor H0dHW;U<1
62 P-channel MOSFET P沟道MOSFET Ire+r
"am
63 Phase margin 相位裕度 GF^)](xY+
64 Phase Node 开关节点 M'(4{4rC
65 portable electronics 便携式电子设备 cu|S|]g
66 power down 掉电 ?@@BIg-
67 Power Good 电源正常 "J.7@\^ h/
68 Power Groud 功率地 4hQ.RO
69 Power Save Mode 节电模式 &7 0o4~Fr
70 Power up 上电 'L k&iph
71 pull down 下拉 nuvRjd^N
72 pull up 上拉 t%k1=Ow5i
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) $T#yxx
74 push pull converter 推挽转换器 E\_Wpk
75 ramp down 斜降 O>vbAIu
76 ramp up 斜升 M= ]]kJ:I
77 redundant diode 冗余二极管 *X%dg$VcV
78 resistive divider 电阻分压器 xPcH]Gs^b
79 ringing 振 铃 DQ08dP((v
80 ripple current 纹波电流 3oo Tn-`{
81 rising edge 上升沿 arQEi
82 sense resistor 检测电阻 ;:`0:Ao.
83 Sequenced Power Supplys 序列电源 s.uw,x
84 shoot-through 直通,同时导通 ^7p>p8
85 stray inductances. 杂散电感 1s "/R
86 sub-circuit 子电路 B*
hW
87 substrate 基板 ,ve$bSp
88 Telecom 电信 ?|$IZ9
89 Thermal Information 热性能信息 gK%^}xU+
90 thermal slug 散热片 5H{dLZ],
91 Threshold 阈值 ^Gt9.
92 timing resistor 振荡电阻 l)P~#G+C
93 Top FET Top FET H)5V \
94 Trace 线路,走线,引线 Nn:>c<[
95 Transfer function 传递函数 l2.Lh<G
96 Trip Point 跳变点 /4xp?Lo:
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 6xC$R q
98 Under Voltage Lock Out (UVLO) 欠压锁定 <\6<-x(H5
99 Voltage Reference 电压参考
tqMOh R
100 voltage-second product 伏秒积 f8AgTw,K8
101 zero-pole frequency compensation 零极点频率补偿 {E3329t|'
102 beat frequency 拍频 9$iDK$%
103 one shots 单击电路 >cdxe3I\
104 scaling 缩放 n7$21*,
105 ESR 等效串联电阻 [Page] q\I2lZ
106 Ground 地电位 L2WH-XP=
107 trimmed bandgap 平衡带隙 #ouE,<
108 dropout voltage 压差 qiyX{J7Z
109 large bulk capacitance 大容量电容 Wf>P[6
110 circuit breaker 断路器 2c u?2_,
111 charge pump 电荷泵 `9>1 w d
112 overshoot 过冲 \~4IOu
"I
n[= 2w
印制电路printed circuit HuRq0/"
印制线路 printed wiring 4xl}kmvv
印制板 printed board &}."sGK
印制板电路 printed circuit board 1 Vq)& N
印制线路板 printed wiring board +m+v1(@
印制元件 printed component i^I
U)\
印制接点 printed contact 84|oqwZO
印制板装配 printed board assembly #y2IHO-
板 board 6 $*\%
刚性印制板 rigid printed board WKDa]({k%
挠性印制电路 flexible printed circuit KhFw%Z0s<
挠性印制线路 flexible printed wiring a}#8n^2
齐平印制板 flush printed board !7fL'
金属芯印制板 metal core printed board V
W2+ Bs}
金属基印制板 metal base printed board 56JvF*hP
多重布线印制板 mulit-wiring printed board x./l27}6
塑电路板 molded circuit board 6|HxBC#4
散线印制板 discrete wiring board kbcqUE
微线印制板 micro wire board ]Lz:oV^%
积层印制板 buile-up printed board tUXly|k
表面层合电路板 surface laminar circuit BK/~2u
埋入凸块连印制板 B2it printed board Yfa` }hQ
载芯片板 chip on board 3;t {V$
埋电阻板 buried resistance board wx]r{
母板 mother board grWmF3c#
子板 daughter board _f1~r^(/T0
背板 backplane \]7i-[
裸板 bare board 1Bl;.8he.)
键盘板夹心板 copper-invar-copper board hP$v,"$
动态挠性板 dynamic flex board
,fR /C
静态挠性板 static flex board O_bgrXg6x
可断拼板 break-away planel -rXo}I,VI
电缆 cable t_\;G~O9-M
挠性扁平电缆 flexible flat cable (FFC) 5 52U~t
薄膜开关 membrane switch ~REP@!\r^
混合电路 hybrid circuit TTQ(\l4
厚膜 thick film /jB0
厚膜电路 thick film circuit CA8N
薄膜 thin film K'tckJ#%
薄膜混合电路 thin film hybrid circuit 6vL+qOd x
互连 interconnection A."]6R<
导线 conductor trace line T x
6\
齐平导线 flush conductor NBaXfWh
传输线 transmission line `=FDNOwp
跨交 crossover 3`%U)gCT5
板边插头 edge-board contact C(jUM!m
增强板 stiffener 2"IsNbWV
基底 substrate 23|R $s>}i
基板面 real estate }(-2a*Z;Y
导线面 conductor side +[C><uP
元件面 component side "eOFp\vPr
焊接面 solder side pGHn
导电图形 conductive pattern FsTl@zN
非导电图形 non-conductive pattern g71|t7Q
基材 base material |on$)vm
层压板 laminate 78n`VmH~L
覆金属箔基材 metal-clad bade material 2nsW)bd
覆铜箔层压板 copper-clad laminate (CCL) ?$Tp|<tx#
复合层压板 composite laminate ;G\RGU~
薄层压板 thin laminate k}tTl 2
基体材料 basis material Fmo^ ?~b
预浸材料 prepreg O\=c&n~`
粘结片 bonding sheet fJ8Q\lb<_
预浸粘结片 preimpregnated bonding sheer s^6"qhTa
环氧玻璃基板 epoxy glass substrate oe,37xa4
预制内层覆箔板 mass lamination panel v[t*CpGd
内层芯板 core material W{js9$oJ
粘结层 bonding layer f;Uf=.#F
粘结膜 film adhesive 9d8bh4[
无支撑胶粘剂膜 unsupported adhesive film +GDT@,/
覆盖层 cover layer (cover lay) Oqy&V&-C
增强板材 stiffener material FXd><#U
铜箔面 copper-clad surface P{tH4V23T
去铜箔面 foil removal surface KDUa0$"
层压板面 unclad laminate surface 8H<:?D/tH
基膜面 base film surface 9X%H$>s
胶粘剂面 adhesive faec 9EI Oa/*
原始光洁面 plate finish g2t'u4>
粗面 matt finish b8$(j2B~
剪切板 cut to size panel L-V+ `![{
超薄型层压板 ultra thin laminate 4y$tp18
A阶树脂 A-stage resin E>2~cC*
B阶树脂 B-stage resin 10`]&v]T
C阶树脂 C-stage resin x+B7r&#:
环氧树脂 epoxy resin jcVK4jW
酚醛树脂 phenolic resin D1g
.Fek5
聚酯树脂 polyester resin 8 "5^mj
聚酰亚胺树脂 polyimide resin `zmjiC
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin i*9Bu;
丙烯酸树脂 acrylic resin E%tGwbi7
三聚氰胺甲醛树脂 melamine formaldehyde resin n$z+g>~N
多官能环氧树脂 polyfunctional epoxy resin NKJ+DD:'
溴化环氧树脂 brominated epoxy resin oBqWIXM
环氧酚醛 epoxy novolac p%?m|(4f
氟树脂 fluroresin 0Xx&Z8E
硅树脂 silicone resin 0ghW};[6
硅烷 silane g[ dI%
聚合物 polymer B!X;T9^d
无定形聚合物 amorphous polymer ehe;<A
结晶现象 crystalline polamer o1B8_$aYgc
双晶现象 dimorphism ` 0}z
;&:
共聚物 copolymer }_vUs jK
合成树脂 synthetic
W!.vP~ >
热固性树脂 thermosetting resin [Page] }63Qh}_Y
热塑性树脂 thermoplastic resin ,y%4QvG7a
感光性树脂 photosensitive resin X6`F<H`
环氧值 epoxy value {6, l#z
双氰胺 dicyandiamide -YD+xPD
粘结剂 binder (s?Rbd
胶粘剂 adesive c"H59 jE
固化剂 curing agent
7%g8&d
阻燃剂 flame retardant 0%f}w0]:
遮光剂 opaquer sH_5.+,`
增塑剂 plasticizers $wq[W,'#L
不饱和聚酯 unsatuiated polyester %D9,Femt
聚酯薄膜 polyester Xe:gH.}
聚酰亚胺薄膜 polyimide film (PI) LLlt9(^d
聚四氟乙烯 polytetrafluoetylene (PTFE) _RI!Z
增强材料 reinforcing material A\IQM^i
折痕 crease riuG,$EX
云织 waviness Rx\.x? &
鱼眼 fish eye l%^VBv>
2
毛圈长 feather length d=J$H<
厚薄段 mark g.9:R=JPT
裂缝 split +?I1Og
捻度 twist of yarn dY6A)[dAH'
浸润剂含量 size content pA|Z%aL
浸润剂残留量 size residue `mt.=d
处理剂含量 finish level C % d
偶联剂 couplint agent U|2*.''+Q
断裂长 breaking length S, g/2k*
吸水高度 height of capillary rise h'D-e5i
湿强度保留率 wet strength retention iT;~0XU7F
白度 whitenness k_$9cVA
导电箔 conductive foil JxlU=7cF
铜箔 copper foil 93+p~?
压延铜箔 rolled copper foil 14LOeo5O
光面 shiny side P}dhpU
粗糙面 matte side Uw:gJ9
处理面 treated side !rwe|"8m?u
防锈处理 stain proofing V_.n G;
双面处理铜箔 double treated foil 0w24lVR.
模拟 simulation Gs7#W:e7
逻辑模拟 logic simulation Kq. MmR!gl
电路模拟 circit simulation XX])B%*
时序模拟 timing simulation h%0hryGB
模块化 modularization xdqiogu e
设计原点 design origin &Fxw19[G
优化(设计) optimization (design) [`'[)B
供设计优化坐标轴 predominant axis :kMEL*
表格原点 table origin QL{{GQ_dn
元件安置 component positioning %M/rpEE"b%
比例因子 scaling factor Ev' BmDk
扫描填充 scan filling #^Io9dAh
矩形填充 rectangle filling dDeImSeV
填充域 region filling WOgPhJ
实体设计 physical design Q8^fgI |
逻辑设计 logic design vxmz3ht,Q
逻辑电路 logic circuit w)u6J,
层次设计 hierarchical design DQ a0S7I
自顶向下设计 top-down design n,.ZLuBEX
自底向上设计 bottom-up design <l,Kg
'v
费用矩阵 cost metrix EP;TfWc}1
元件密度 component density 5/m^9@A
自由度 degrees freedom G"~%[k
出度 out going degree nKP[U=ac
入度 incoming degree :vqfWK6mv
曼哈顿距离 manhatton distance fNkN
欧几里德距离 euclidean distance /%'>?8/
网络 network MK*WStY
阵列 array -5_[m@Vr
段 segment .@(+.G
逻辑 logic P%- @AmO^_
逻辑设计自动化 logic design automation qit D{;
分线 separated time .gPXW=r
分层 separated layer p%_m!
定顺序 definite sequence g'F{;Ur
导线(通道) conduction (track) W%)uKQha
导线(体)宽度 conductor width ?uq7K"B
导线距离 conductor spacing s?j` _B
导线层 conductor layer :())%Xu3
导线宽度/间距 conductor line/space ~jqG
第一导线层 conductor layer No.1 ~sd+ch*
圆形盘 round pad D{4Ehr "T
方形盘 square pad Rp!R&U/
菱形盘 diamond pad :YAxL J
长方形焊盘 oblong pad Fa!6*K\
子弹形盘 bullet pad (zm5
4
Vm
泪滴盘 teardrop pad WrS|$: 0
雪人盘 snowman pad `(RQh@H
形盘 V-shaped pad V ns{BU->f
环形盘 annular pad %Q0J$eC
非圆形盘 non-circular pad x9c/;Q&m
隔离盘 isolation pad X)tf3M
{J@
非功能连接盘 monfunctional pad JpFfO<uO
偏置连接盘 offset land gx*rxid
腹(背)裸盘 back-bard land k>N >_{\
盘址 anchoring spaur *i}Nb*Z3
连接盘图形 land pattern D`t }V
连接盘网格阵列 land grid array YRkp(}*!\
孔环 annular ring #\Q{?F!4
元件孔 component hole GCf3'u
安装孔 mounting hole J5J$qCJq
支撑孔 supported hole 7,\Uk|
非支撑孔 unsupported hole 2(,
`9
导通孔 via
qrFC4\q}
镀通孔 plated through hole (PTH) w_gPX0N}3n
余隙孔 access hole k#4%d1O}
盲孔 blind via (hole) a!;]9}u7
埋孔 buried via hole XYKWOrkQqa
埋,盲孔 buried blind via "]j GCo>9
任意层内部导通孔 any layer inner via hole &*}NN5Sv
全部钻孔 all drilled hole GS%i<HQ3
定位孔 toaling hole cR0RJ$[d
无连接盘孔 landless hole o4)^U t+
中间孔 interstitial hole {L!w/Ie X
无连接盘导通孔 landless via hole WhO;4-q)2
引导孔 pilot hole N}Ol`@@#h
端接全隙孔 terminal clearomee hole x,sMa*vd
准尺寸孔 dimensioned hole [Page] Wp0e?bK_
在连接盘中导通孔 via-in-pad x4PH-f-7
孔位 hole location blwdcdh
孔密度 hole density vZdn
孔图 hole pattern d2Z kchf
钻孔图 drill drawing h\ (z!7t*
装配图assembly drawing RP2MtP"M
参考基准 datum referan ?G5JAG`
1) 元件设备 G;n'c7BV
~zklrBn&
三绕组变压器:three-column transformer ThrClnTrans ;CU<\
双绕组变压器:double-column transformer DblClmnTrans _)J;PbK~
电容器:Capacitor KfU4#2}
并联电容器:shunt capacitor FtUO gL)|
电抗器:Reactor dQ=mg#(
母线:Busbar k,L ,
输电线:TransmissionLine Lp; {&=PIo
发电厂:power plant }lzyl*.
断路器:Breaker Y",Fs(
刀闸(隔离开关):Isolator uzO%+B!
分接头:tap U _~lpu
电动机:motor +$MNG
(2) 状态参数 ZQT14. $L
P@Wi^svj
有功:active power x%ZgLvdp,
无功:reactive power U!:Q|':=h
电流:current 8&6h()
容量:capacity \*}JdEHB
电压:voltage :X>%6Xj?RV
档位:tap position >EFjyhVE
有功损耗:reactive loss ]Dm'J%P0}
无功损耗:active loss p @@TOS
功率因数:power-factor Q 'R@'W9
功率:power s(Of
EzsH=
功角:power-angle aU]A#g
电压等级:voltage grade eRC
/Pr
空载损耗:no-load loss J4qFU^
铁损:iron loss *rO#UE2
铜损:copper loss n*6 b*fl
空载电流:no-load current +/60$60[z
阻抗:impedance n'D1s:W^B
正序阻抗:positive sequence impedance bk E4{P"
负序阻抗:negative sequence impedance g{@q
零序阻抗:zero sequence impedance hKw4 [wB]
电阻:resistor nB ?$W4
电抗:reactance N"2Ire
电导:conductance '>AOJaA
电纳:susceptance B$aA=+<S
无功负载:reactive load 或者QLoad ]KfjZ!Qh
有功负载: active load PLoad SxLu<
遥测:YC(telemetering) +K4d(!Sb
遥信:YX "d'D:>z]%
励磁电流(转子电流):magnetizing current )s6pOxWx
定子:stator "nXL7N0
功角:power-angle `}gjfu -'\
上限:upper limit T:aYv;#0
下限:lower limit <6`_Xr7)
并列的:apposable ^PIUA'
高压: high voltage ahNpHTPa
低压:low voltage !es?GJq`
中压:middle voltage G(F}o]
电力系统 power system q]3bGO;
发电机 generator Jg=[!j0(
励磁 excitation v*'dA^Q
励磁器 excitor ^ZX 71-
电压 voltage 59:Xu%Hp
电流 current H8+7rM
母线 bus VfOm#Ue0q
变压器 transformer 8^CdE*a
升压变压器 step-up transformer MXsSF|-
高压侧 high side Sw<@u+Z;%
输电系统 power transmission system
8%]o6'd4
输电线 transmission line ;
F% 3b47
固定串联电容补偿fixed series capacitor compensation ZI4[v>
稳定 stability F$P8"q+
电压稳定 voltage stability p`lv$ @q'
功角稳定 angle stability bhaIi>W~G
暂态稳定 transient stability e[f}L xln
电厂 power plant wP.b2X_V
能量输送 power transfer &U%AVD[
交流 AC hnag<=
装机容量 installed capacity SW|{)L,
电网 power system 1e.V%!Xk
落点 drop point fB+4mEG@
开关站 switch station .$5QM&
双回同杆并架 double-circuit lines on the same tower 4 {JoeIRyz
变电站 transformer substation _]btsv\)f
补偿度 degree of compensation &GF@9BXI3
高抗 high voltage shunt reactor XlPq>@4p
无功补偿 reactive power compensation o.IJ4'}aN
故障 fault }t }y
调节 regulation (27bNKr
裕度 magin
>5Y%4++(
三相故障 three phase fault ?-w<H!Y7
故障切除时间 fault clearing time %fB]N
极限切除时间 critical clearing time qScc~i Oq
切机 generator triping K*^3FO}JG
高顶值 high limited value gE$D#PZa
强行励磁 reinforced excitation ^ Q]I)U
线路补偿器 LDC(line drop compensation) EaaLN<i@0
机端 generator terminal k I
静态 static (state) wp7<0PP
动态 dynamic (state) 8D3|}z?
单机无穷大系统 one machine - infinity bus system SPfz/ q{
机端电压控制 AVR KwO;ICdJ
电抗 reactance yf3c-p
电阻 resistance
JmL{&
功角 power angle T%|{Qo<j
有功(功率) active power m,YBk<Bx
无功(功率) reactive power vz'/]E
功率因数 power factor ,gAa9
无功电流 reactive current yOHVL~F
下降特性 droop characteristics 1.29%O8V_
斜率 slope MvV\?Lzj
额定 rating 9 Z,K
变比 ratio +/+:D9j ,
参考值 reference value Z!HQ|')N5
电压互感器 PT =^a Ngq
分接头 tap Eod'Esye5
下降率 droop rate +9EG6"..@H
仿真分析 simulation analysis b ]A9$-
传递函数 transfer function hO8~Rg
框图 block diagram KV&4Ep#
受端 receive-side `^_c&y K
裕度 margin h"O4r8G}
同步 synchronization G,o5JL"t
失去同步 loss of synchronization );*:UzsC_
阻尼 damping 8NP|>uaj
摇摆 swing VY9o}J>,w
保护断路器 circuit breaker pE&'Xr#P>
电阻:resistance :c03"jvYE
电抗:reactance /:S&1'=
阻抗:impedance :{7gZ+*
电导:conductance vG X
L'k
电纳:susceptance