1 backplane 背板 gm8L5c
V
2 Band gap voltage reference 带隙电压参考 En+4@BC
3 benchtop supply 工作台电源 jnt0,y A
4 Block Diagram 方块图 5 Bode Plot 波特图 *La*j3|:
6 Bootstrap 自举 Wf13Ab
7 Bottom FET Bottom FET -,q&Zm
8 bucket capcitor 桶形电容 hnL"f[p@gC
9 chassis 机架 xZtA) Bp
10 Combi-sense Combi-sense -`]B4Nt6
11 constant current source 恒流源 j9%u&
12 Core Sataration 铁芯饱和 HoymGU`w
13 crossover frequency 交叉频率 $J[h(>-X
14 current ripple 纹波电流 :g'"*VXYB
15 Cycle by Cycle 逐周期 wGd8q xa
16 cycle skipping 周期跳步 t ?28s/?
17 Dead Time 死区时间 ~zRUJ2hD!
18 DIE Temperature 核心温度 T#J]%IDd
19 Disable 非使能,无效,禁用,关断 INW8Q`[F
20 dominant pole 主极点 [:a;|t
21 Enable 使能,有效,启用 ?F*gFW_k
22 ESD Rating ESD额定值 2{"Wa|o`
23 Evaluation Board 评估板 ,bmiIW%
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. vkE6e6,Qc
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 %&Z!-k(
25 Failling edge 下降沿 -}2q-
26 figure of merit 品质因数 x_v pds
27 float charge voltage 浮充电压 "FcA:7 +
28 flyback power stage 反驰式功率级 "pdG%$
29 forward voltage drop 前向压降 S#!PDg
30 free-running 自由运行 {\`#,[
31 Freewheel diode 续流二极管 9g"a`a?c
32 Full load 满负载 33 gate drive 栅极驱动 PQ@(p%
34 gate drive stage 栅极驱动级 PLg`\|
35 gerber plot Gerber 图 Hh$D:ZO
36 ground plane 接地层 $&n!j'C:
37 Henry 电感单位:亨利 `iv,aQ '
38 Human Body Model 人体模式 T$GhE
39 Hysteresis 滞回 $tj[*
40 inrush current 涌入电流 7 -gt V#
41 Inverting 反相 3 _:yHwkD
42 jittery 抖动 U;;vNzcn
43 Junction 结点 M,e_=aq
44 Kelvin connection 开尔文连接 b,D+1'
45 Lead Frame 引脚框架 O]m,zk
46 Lead Free 无铅 -}9ZZ#K
47 level-shift 电平移动 s~]Ri:7~
48 Line regulation 电源调整率 Jnb>u*7,
49 load regulation 负载调整率 _(<[!c!@0
50 Lot Number 批号 ocAoqjlT[
51 Low Dropout 低压差 u_e}m>[S
52 Miller 密勒 53 node 节点 #]:yCiA
54 Non-Inverting 非反相 uV52ko,
55 novel 新颖的 :v
Pzw!
56 off state 关断状态 a5?Rj~h!<
57 Operating supply voltage 电源工作电压 A"I:cw"KY
58 out drive stage 输出驱动级 `WC~cb\
59 Out of Phase 异相 pUYa1 =
60 Part Number 产品型号 A
99 .b
61 pass transistor pass transistor E>KV1P
62 P-channel MOSFET P沟道MOSFET f`RcfYt
63 Phase margin 相位裕度 t 4{{5U'\
64 Phase Node 开关节点 Xko[Z;4v8'
65 portable electronics 便携式电子设备 <{9E.6G`n
66 power down 掉电 Goz9"yazg
67 Power Good 电源正常 op"RrZAZBT
68 Power Groud 功率地 C \H%4p1r
69 Power Save Mode 节电模式 E{_p&FF
70 Power up 上电 (lwkg8WC
71 pull down 下拉 O>Xyl4U
72 pull up 上拉 or]8;eQ?
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) r_-iOxt~5
74 push pull converter 推挽转换器 c3`X19'%fM
75 ramp down 斜降 ?X]7jH<iw;
76 ramp up 斜升 U:#9!J?41
77 redundant diode 冗余二极管 1
BAnf9
78 resistive divider 电阻分压器 fN?HF'7V
79 ringing 振 铃 j Bl I^
80 ripple current 纹波电流 "So+
81 rising edge 上升沿 A>xFNem
82 sense resistor 检测电阻 G3OqRH
83 Sequenced Power Supplys 序列电源 |TkMrj0
84 shoot-through 直通,同时导通 F9]GEBLr
85 stray inductances. 杂散电感 Nf}G
"!
86 sub-circuit 子电路 zo7Hm]W`
87 substrate 基板 U5Q `r7
88 Telecom 电信 n3g3(}Q0
89 Thermal Information 热性能信息 c9= ;:E
90 thermal slug 散热片 &`Z>z T}
91 Threshold 阈值 =sG C
92 timing resistor 振荡电阻 /V2Ih
93 Top FET Top FET U9y[b82
94 Trace 线路,走线,引线 Mf<Pms\F
95 Transfer function 传递函数 H`9E_[
96 Trip Point 跳变点 `CUTb*{`
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) C^2Tql
98 Under Voltage Lock Out (UVLO) 欠压锁定 *<i
{
Mb Q
99 Voltage Reference 电压参考 w=rh@S]
100 voltage-second product 伏秒积 2Rc#{A
101 zero-pole frequency compensation 零极点频率补偿 ]pzf{8%
102 beat frequency 拍频 8)\ ?6C
103 one shots 单击电路 /Pxt f~$
104 scaling 缩放 KWLI7fTgj$
105 ESR 等效串联电阻 [Page] lN<vu#
106 Ground 地电位 DKPX_::
107 trimmed bandgap 平衡带隙 X<OwB -N
108 dropout voltage 压差
ry*b"SO
109 large bulk capacitance 大容量电容 %S.
_3`A
110 circuit breaker 断路器 =d!3_IZ
111 charge pump 电荷泵 VEkv
JX.
112 overshoot 过冲 ,@;",
,?3r-bM
印制电路printed circuit ] L"jt8E
印制线路 printed wiring jav7V"$
印制板 printed board ==RYf*d
印制板电路 printed circuit board }:])1!a
印制线路板 printed wiring board MD1n+FgTu
印制元件 printed component }G]6Rip3
印制接点 printed contact U6t>UE6k
印制板装配 printed board assembly Ovxs+mQ
板 board "iMuA
刚性印制板 rigid printed board sy.FMy+
挠性印制电路 flexible printed circuit *Ew`Fm H
挠性印制线路 flexible printed wiring DJdW$S7
齐平印制板 flush printed board }u5/
金属芯印制板 metal core printed board 1aP3oXLL
金属基印制板 metal base printed board D{x'k2=
多重布线印制板 mulit-wiring printed board w<!F& kQB
塑电路板 molded circuit board \uQ yp*P1s
散线印制板 discrete wiring board v,I4ozDx
微线印制板 micro wire board Sb+^~M
积层印制板 buile-up printed board J/mLmSx
表面层合电路板 surface laminar circuit *39Y1+=)$$
埋入凸块连印制板 B2it printed board >gRb.-{ux
载芯片板 chip on board M4w,J2_8MK
埋电阻板 buried resistance board i%_W{;e
母板 mother board 8oK*NB29
子板 daughter board <~@}r\
背板 backplane (u-K^xC
裸板 bare board v6uR[18
键盘板夹心板 copper-invar-copper board uD0T()J.P5
动态挠性板 dynamic flex board pX8TzmIB0
静态挠性板 static flex board Q'5]E{1<'n
可断拼板 break-away planel lD)ZMaaS3
电缆 cable K~$A2b95
挠性扁平电缆 flexible flat cable (FFC) Gf_Je
薄膜开关 membrane switch @{P<!x <Q
混合电路 hybrid circuit G8z.JX-7g
厚膜 thick film cc- liY"
厚膜电路 thick film circuit |L[/]@|
薄膜 thin film O?L6Ues
薄膜混合电路 thin film hybrid circuit aO)Cq5
互连 interconnection :%7y6V*
导线 conductor trace line v7gs
$'Q
齐平导线 flush conductor iY?J3nxD-:
传输线 transmission line UR?biq
跨交 crossover vX1 8
]
板边插头 edge-board contact + -~8t^
增强板 stiffener
PgIH(
基底 substrate ywQ[>itMa
基板面 real estate opsjei@
导线面 conductor side !xcLJ5^W
元件面 component side O/Cwm;&t
焊接面 solder side g]&7c:/
导电图形 conductive pattern f$1&)1W[
非导电图形 non-conductive pattern ^x2zMB\t
基材 base material hhWIwR
层压板 laminate *Tc lcu
覆金属箔基材 metal-clad bade material $0 ]xeD0X
覆铜箔层压板 copper-clad laminate (CCL) |?A:[C#X
复合层压板 composite laminate H j [!F%
薄层压板 thin laminate i&mcM_g32
基体材料 basis material 9UDanj P
预浸材料 prepreg )hG4,0hv&
粘结片 bonding sheet 9`y@2/!Y
预浸粘结片 preimpregnated bonding sheer {$qE>ic
环氧玻璃基板 epoxy glass substrate 4}4 cA\B:n
预制内层覆箔板 mass lamination panel Q~k5 }n8
内层芯板 core material O]_a$U*6
粘结层 bonding layer ~'1gX`o:
粘结膜 film adhesive @*e5(@R
无支撑胶粘剂膜 unsupported adhesive film C(CwsdlP
覆盖层 cover layer (cover lay) &?g!)O
增强板材 stiffener material sg`
铜箔面 copper-clad surface V#X#rDfJZ
去铜箔面 foil removal surface MHj
RPh
层压板面 unclad laminate surface #{_iNr a9
基膜面 base film surface Mc,3j~i
胶粘剂面 adhesive faec U}T{r%9
原始光洁面 plate finish Upw`|$1S
粗面 matt finish A(eB\qG
剪切板 cut to size panel hk+8s\%-
超薄型层压板 ultra thin laminate H #Hhi<2
A阶树脂 A-stage resin wxJu=#!M
B阶树脂 B-stage resin [[$dPa9
C阶树脂 C-stage resin uwl_TDc>%
环氧树脂 epoxy resin +>3jMs~&
酚醛树脂 phenolic resin 8Sxk[`qx\K
聚酯树脂 polyester resin CS'LW;#[
聚酰亚胺树脂 polyimide resin r[g
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin ,I6li7V
丙烯酸树脂 acrylic resin y0f:N
U
三聚氰胺甲醛树脂 melamine formaldehyde resin @U+#@6
多官能环氧树脂 polyfunctional epoxy resin 5o6X.sC8e
溴化环氧树脂 brominated epoxy resin 3iM7c.f*/
环氧酚醛 epoxy novolac "7q!u,u
氟树脂 fluroresin }1
,\*)5
硅树脂 silicone resin Upa F>,kM
硅烷 silane ?wP/l
聚合物 polymer `=V p 0tPI
无定形聚合物 amorphous polymer >{S
~(KxK
结晶现象 crystalline polamer '8Cg2v5&w
双晶现象 dimorphism {oSdVRI
共聚物 copolymer dBw7l}
合成树脂 synthetic 3{)!T;W d
热固性树脂 thermosetting resin [Page] fUMjLA|*I<
热塑性树脂 thermoplastic resin !\VzX
感光性树脂 photosensitive resin {p.^E5&
环氧值 epoxy value 3n,jrX75u
双氰胺 dicyandiamide d.|*sZ&3p
粘结剂 binder gky+.EP.
胶粘剂 adesive
)SZzA'
固化剂 curing agent J}NMF#w/;
阻燃剂 flame retardant +T\<oj%}2
遮光剂 opaquer u*f`\vs
增塑剂 plasticizers X1HEeJ|
不饱和聚酯 unsatuiated polyester -Ew>3Q
聚酯薄膜 polyester C7O8B;
聚酰亚胺薄膜 polyimide film (PI) Lk)I;;
聚四氟乙烯 polytetrafluoetylene (PTFE) yg.o?eML
增强材料 reinforcing material ebn3r:IU-
折痕 crease uK]-m
云织 waviness ZC]|s[
鱼眼 fish eye 9a[1s|>w-
毛圈长 feather length _\=x
A6!
厚薄段 mark r+8)<Xt+p
裂缝 split -4[eZ>$A|
捻度 twist of yarn r?itd)WC<X
浸润剂含量 size content mv>0j<C91
浸润剂残留量 size residue Gphy8~eS
处理剂含量 finish level qfG:vTm
偶联剂 couplint agent NE.h/+4
断裂长 breaking length lz!(OO,g
吸水高度 height of capillary rise R?zlZS.~
湿强度保留率 wet strength retention ,hH c
-%-
白度 whitenness N5{v;~Cm}V
导电箔 conductive foil \q?^DI:`
铜箔 copper foil :tBe/(e4#
压延铜箔 rolled copper foil ?N<,;~
光面 shiny side [n2zdiiBd
粗糙面 matte side B{b?j*fHJ
处理面 treated side {+zG.1o^
防锈处理 stain proofing O1UArD
双面处理铜箔 double treated foil #K0/ >W
模拟 simulation <THwl/a
逻辑模拟 logic simulation oi]XSh[_s
电路模拟 circit simulation %%F,G
时序模拟 timing simulation 1.M<u)1GU
模块化 modularization /O<~n%< G
设计原点 design origin ^ ^&H:q
优化(设计) optimization (design) =/}Rnl+c
供设计优化坐标轴 predominant axis K\wu9z8M
表格原点 table origin \s%g'g;
元件安置 component positioning 'Kk/
J+6U
比例因子 scaling factor Y(t/=3c[
扫描填充 scan filling :8(jhs
矩形填充 rectangle filling &',#j]I
填充域 region filling ia3Q1 9r
实体设计 physical design #q K.AZi
逻辑设计 logic design IqV" 4
逻辑电路 logic circuit pj<aMh
层次设计 hierarchical design *Lxt{z`9
自顶向下设计 top-down design sZ~03QvkT
自底向上设计 bottom-up design +_ /ys!
费用矩阵 cost metrix w,X)g{^T
元件密度 component density )Nqx=ms[(!
自由度 degrees freedom @`)>-k
出度 out going degree !yT=*Cj4
入度 incoming degree ^SsdM#E
曼哈顿距离 manhatton distance DLP@?]BBOA
欧几里德距离 euclidean distance .71ZeLv*
网络 network k-a1^K3
阵列 array G62;p#
段 segment 4i.&geXA.
逻辑 logic .?rs5[th*
逻辑设计自动化 logic design automation )5n0P
Zi
分线 separated time M*bsA/Z
分层 separated layer 1) K<x
定顺序 definite sequence qLN\>Z,3;
导线(通道) conduction (track) H>D sAHS
导线(体)宽度 conductor width p[o]ouTcS
导线距离 conductor spacing ;zze.kb&F
导线层 conductor layer G~DHNO6
导线宽度/间距 conductor line/space -~aG_Bp!($
第一导线层 conductor layer No.1 N<@K(?'
圆形盘 round pad rz,,ku4qt
方形盘 square pad dl[%C6
菱形盘 diamond pad 4[#)p}V
长方形焊盘 oblong pad {ZSAPq4)L
子弹形盘 bullet pad tV_3!7m0$
泪滴盘 teardrop pad |=v,^uo
雪人盘 snowman pad wl%ysM|x
形盘 V-shaped pad V eaNfCXHDN
环形盘 annular pad G /$+e
非圆形盘 non-circular pad @{{L1[~:0
隔离盘 isolation pad I$S*elveG
非功能连接盘 monfunctional pad ={v(me0ZPb
偏置连接盘 offset land }5 n\us
腹(背)裸盘 back-bard land ?$ov9U_
盘址 anchoring spaur m>48?%
连接盘图形 land pattern ,aD~7QX1:
连接盘网格阵列 land grid array ^!C
孔环 annular ring _VjaTw8iM
元件孔 component hole 88<d<)7t
安装孔 mounting hole )MSCyPp5
支撑孔 supported hole gx^_bHh
非支撑孔 unsupported hole w8~R=k
导通孔 via %).I&)i
镀通孔 plated through hole (PTH) hrD2-S
余隙孔 access hole w2V:x[
盲孔 blind via (hole) <,it<$f#
埋孔 buried via hole ?./fVoA]V
埋,盲孔 buried blind via `KLr!<i()
任意层内部导通孔 any layer inner via hole ?Fl O,|
全部钻孔 all drilled hole (w2lVL&
定位孔 toaling hole T%9t8?I
无连接盘孔 landless hole }6pr.-J
中间孔 interstitial hole x4>"m(&%
无连接盘导通孔 landless via hole *2N0r2t&
引导孔 pilot hole ]b>XN8y.
端接全隙孔 terminal clearomee hole ~|, "w90
准尺寸孔 dimensioned hole [Page] -IVWkA)7
在连接盘中导通孔 via-in-pad @:B}QxC
孔位 hole location pYm#iz
孔密度 hole density ReD]M@;
孔图 hole pattern K:qc
"Q=C
钻孔图 drill drawing nv+miyvvm
装配图assembly drawing jj;TS%
参考基准 datum referan Ake l .&
1) 元件设备 kI04<!
+:jv )4^O
三绕组变压器:three-column transformer ThrClnTrans +A1*e+/b\
双绕组变压器:double-column transformer DblClmnTrans K$GQc"
电容器:Capacitor _*g.U=u
并联电容器:shunt capacitor 3TeRZ=2:*x
电抗器:Reactor 7&HcrkP]
母线:Busbar v9,cL.0&
输电线:TransmissionLine w(Tr,BFF
发电厂:power plant eHKb`K7C.
断路器:Breaker /E{tNd^S
刀闸(隔离开关):Isolator -Vb5d!(
分接头:tap Isvb;VT9L
电动机:motor i"Hc( lg
(2) 状态参数 |{-?OOKj
w'_|X&@H
有功:active power Z
eY*5m
无功:reactive power ki2`gLK
电流:current x $[_ Hix
容量:capacity z19%!k
电压:voltage $%ND5uK
档位:tap position ">h$(WCK
有功损耗:reactive loss ndT_;==
无功损耗:active loss XV4aR3n{Q
功率因数:power-factor [e_csQ
功率:power ]Lg~I#/#
功角:power-angle ps8tr:T^=
电压等级:voltage grade yP} |8x
空载损耗:no-load loss [ g:cG
铁损:iron loss @qW$un:
铜损:copper loss xe(7q1
空载电流:no-load current @q>#]8
阻抗:impedance VM&Ref4
正序阻抗:positive sequence impedance l_9Z zN
负序阻抗:negative sequence impedance &;r'JIp
零序阻抗:zero sequence impedance LH @B\ mS
电阻:resistor m:~y:.
电抗:reactance 7F]Hq
电导:conductance
ZdY$NpR,
电纳:susceptance _\,lv
\u
无功负载:reactive load 或者QLoad 8KkN
"4'
有功负载: active load PLoad v+trHdSBYE
遥测:YC(telemetering) `D=d!!1eUi
遥信:YX l=Jw6F+5
励磁电流(转子电流):magnetizing current (Uu5$q(
定子:stator R47y/HG,
功角:power-angle lx2%=5+i;
上限:upper limit =oiz@Q @H
下限:lower limit T*C
F5S
并列的:apposable 5&_")k3$*
高压: high voltage z%JN| 5
低压:low voltage pXBh^
中压:middle voltage 0Krh35R_)F
电力系统 power system zLg$|@E&
发电机 generator (~5]1S}F
励磁 excitation 0Y0`$
励磁器 excitor X&rsWk
电压 voltage ci:|x =
电流 current ei=u$S.
母线 bus Rg46V-"d,@
变压器 transformer PQYJnx}
升压变压器 step-up transformer :P%?!'M
高压侧 high side FzCXA=m
输电系统 power transmission system 2~ETu&R:
输电线 transmission line r~oUln<[
固定串联电容补偿fixed series capacitor compensation 9&C8c\Y
稳定 stability 08k
电压稳定 voltage stability X_bB6A6
功角稳定 angle stability }vgM$o
暂态稳定 transient stability hBaG*J{
电厂 power plant hPGDN\#LD
能量输送 power transfer %gSmOW2.c^
交流 AC ,+C?UW
装机容量 installed capacity mF4OLG3L0
电网 power system U#PgkP[4
落点 drop point O*]}0*CT
开关站 switch station $83Qd
双回同杆并架 double-circuit lines on the same tower OR'e!{
变电站 transformer substation I3sfOU
补偿度 degree of compensation YD9vWk\/
高抗 high voltage shunt reactor [0kZyjCq@
无功补偿 reactive power compensation <m{#u4FC'
故障 fault 'Ce?!UO
调节 regulation \'('HFr,
裕度 magin R*k;4*1u
三相故障 three phase fault rxJl;!7G
故障切除时间 fault clearing time /!6 VP |
极限切除时间 critical clearing time #(a ;w
切机 generator triping ?
IlT[yMw
高顶值 high limited value Yb[)ETf^
强行励磁 reinforced excitation #hu`X6s"
线路补偿器 LDC(line drop compensation) K)Z~ iBRM
机端 generator terminal T-7(3#&
静态 static (state) i*&b@.7N
动态 dynamic (state) FLkZZ\
单机无穷大系统 one machine - infinity bus system <Zfh5AM
机端电压控制 AVR OH]45bd
&7
电抗 reactance QC]<`!
电阻 resistance G@T_o4t
功角 power angle hM="9]i.
有功(功率) active power yw7bIcs|#b
无功(功率) reactive power < %<nh`D
功率因数 power factor TC=>De2;
无功电流 reactive current #KHj.Vg
下降特性 droop characteristics V;)+v#4{
斜率 slope L/GVQjb
额定 rating P-yVc2YH
变比 ratio !Zc#E,
参考值 reference value tF<&R&=
电压互感器 PT n3eWqwQ$5
分接头 tap 0Am\02R.C,
下降率 droop rate zNn
仿真分析 simulation analysis +~
Y.m8
传递函数 transfer function Zk|PQfi+
框图 block diagram Y q|OX<i`K
受端 receive-side WigTNg4
裕度 margin h+YPyeAs
同步 synchronization ggfCfn
失去同步 loss of synchronization }~0}B[Rf
阻尼 damping o{hZjn-
摇摆 swing >*+n`"6
保护断路器 circuit breaker c0X1})q$
电阻:resistance Zba<|C
电抗:reactance W+s3rS2
阻抗:impedance L$, Kdpj
电导:conductance 889^P`Q5
电纳:susceptance