1 backplane 背板 #/2$+x
2 Band gap voltage reference 带隙电压参考 Dnf*7)X
3 benchtop supply 工作台电源 eLD|A=X?
4 Block Diagram 方块图 5 Bode Plot 波特图 eYX5(`c[
6 Bootstrap 自举
*f%>YxF
7 Bottom FET Bottom FET N_pUv
8 bucket capcitor 桶形电容 Ev"|FTI/
9 chassis 机架 {LHR!~d}5f
10 Combi-sense Combi-sense \!]hU%Un
11 constant current source 恒流源 :Y,BdU
12 Core Sataration 铁芯饱和 ) 0 W`
13 crossover frequency 交叉频率 M=qb^~ l
14 current ripple 纹波电流 }~K`/kvs
15 Cycle by Cycle 逐周期 \b=Pj!^gwb
16 cycle skipping 周期跳步 WI> P-D
17 Dead Time 死区时间 .iMN,+qP
18 DIE Temperature 核心温度 $j}OB6^I
19 Disable 非使能,无效,禁用,关断 |*/[`|*G
20 dominant pole 主极点 ew _-Eb
21 Enable 使能,有效,启用 {--0z3n>
22 ESD Rating ESD额定值 Z/;Xl~
23 Evaluation Board 评估板 5irwz4.4
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. c9qR'2
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 %p^.|Me7
25 Failling edge 下降沿 Q\ /uKQ
26 figure of merit 品质因数 "tFxhKf
27 float charge voltage 浮充电压 xv{O^Ie+S
28 flyback power stage 反驰式功率级 ML;*e "$
29 forward voltage drop 前向压降 =@,Q Dm]L
30 free-running 自由运行 m7EcnQf
31 Freewheel diode 续流二极管 ;Gx)Noo/>
32 Full load 满负载 33 gate drive 栅极驱动 /sM~Uq?
34 gate drive stage 栅极驱动级 xx{!3 F
35 gerber plot Gerber 图 J^R=dT!
36 ground plane 接地层 0Wa}<]:^
37 Henry 电感单位:亨利 o<IAeH {+
38 Human Body Model 人体模式 )-*5v
D
39 Hysteresis 滞回 cdqB,]"
40 inrush current 涌入电流 dL7E<?l
41 Inverting 反相 bVP"(H]
42 jittery 抖动 N7E$G{TT
43 Junction 结点 su*Pk|6%
44 Kelvin connection 开尔文连接 `qJw|u>YpJ
45 Lead Frame 引脚框架 @36u8pE
46 Lead Free 无铅 u:0aM}9A
47 level-shift 电平移动 w 4[{2
48 Line regulation 电源调整率 .920{G?l5
49 load regulation 负载调整率 2'=T[<nNB
50 Lot Number 批号
;7N{^"r
51 Low Dropout 低压差 `u>4\sv
52 Miller 密勒 53 node 节点 2 41*!
54 Non-Inverting 非反相 iq(
)8nxi
55 novel 新颖的 pTIf@n6I
56 off state 关断状态 .bBdQpF-
57 Operating supply voltage 电源工作电压 \%UkSO\nO3
58 out drive stage 输出驱动级 lHgs;>U$
59 Out of Phase 异相 45hF`b>%,
60 Part Number 产品型号 MSf;ZB
61 pass transistor pass transistor 8@so"d2e
62 P-channel MOSFET P沟道MOSFET {s. = )0V
63 Phase margin 相位裕度 z5ij(RE]
64 Phase Node 开关节点 Eke5Nb
65 portable electronics 便携式电子设备 Ua!aaq&
66 power down 掉电 boDt`2=
67 Power Good 电源正常 8M!:N(a
68 Power Groud 功率地 *_>Lmm.yh
69 Power Save Mode 节电模式 )"Ztlhs`#
70 Power up 上电 I`NjqyTW
71 pull down 下拉 ,VO2a mI
72 pull up 上拉 iY21Ql%
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) sr8cYLm5R
74 push pull converter 推挽转换器 '7O3/GDK
75 ramp down 斜降 lg^Z*&(
76 ramp up 斜升 !47n[Zs
77 redundant diode 冗余二极管 03C0L&
78 resistive divider 电阻分压器 y5!KX AQ%
79 ringing 振 铃 c38D}k^):
80 ripple current 纹波电流 2}8v(%s p
81 rising edge 上升沿 XI^QF;,
82 sense resistor 检测电阻 dAuJXGo
83 Sequenced Power Supplys 序列电源 s{1sE)_
84 shoot-through 直通,同时导通 1I:+MBGin
85 stray inductances. 杂散电感 ti
\wg
86 sub-circuit 子电路 p,#o<W
87 substrate 基板 4EY)!?;
88 Telecom 电信 -B +4+&{T
89 Thermal Information 热性能信息 V:y'Qf2M
90 thermal slug 散热片 B
{>7-0
91 Threshold 阈值 &Xf}8^T<V
92 timing resistor 振荡电阻 YPxM<Gfa8
93 Top FET Top FET .mR8q+I6
94 Trace 线路,走线,引线 VVlr*`
95 Transfer function 传递函数 -fDnA4;
96 Trip Point 跳变点 .[_L=_.
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Rb'|EiNPw
98 Under Voltage Lock Out (UVLO) 欠压锁定 LGn:c;
99 Voltage Reference 电压参考 5 aCgjA11
100 voltage-second product 伏秒积 |:gf lseE
101 zero-pole frequency compensation 零极点频率补偿 4%4 }5UYN
102 beat frequency 拍频 \.-bZ$
103 one shots 单击电路 Z.L c>7o
104 scaling 缩放 {tWf
105 ESR 等效串联电阻 [Page] D A\2rLs
106 Ground 地电位 m^zUmrj[
107 trimmed bandgap 平衡带隙 K|epPGRr
108 dropout voltage 压差 `x*Pof!Io
109 large bulk capacitance 大容量电容 nlc
"c5;jh
110 circuit breaker 断路器 z:wutqru
111 charge pump 电荷泵 ,5h)x"s
112 overshoot 过冲 iUN Ib
" )1V]}+m
印制电路printed circuit K|[*t~59
印制线路 printed wiring H:V2[y8\
印制板 printed board GB=X5<;
印制板电路 printed circuit board a!v1M2>
印制线路板 printed wiring board @J/K-.r
印制元件 printed component n"c[,k+R`U
印制接点 printed contact ]Gsv0Xk1
印制板装配 printed board assembly %iQD /iT5
板 board {ttysQ-
刚性印制板 rigid printed board A
PEE~
挠性印制电路 flexible printed circuit C&(N
I
挠性印制线路 flexible printed wiring do>wwgr
齐平印制板 flush printed board .[ICx
金属芯印制板 metal core printed board Q ~#Wf?
金属基印制板 metal base printed board &OH={Au
多重布线印制板 mulit-wiring printed board X4~y7
塑电路板 molded circuit board Fj2BnM3#
散线印制板 discrete wiring board )6Fok3u
微线印制板 micro wire board ]>5/PD,wWy
积层印制板 buile-up printed board 5@~
Q^r:%
表面层合电路板 surface laminar circuit 0Qf,@^zL*
埋入凸块连印制板 B2it printed board u0`S5?
载芯片板 chip on board ?67Y-\}
埋电阻板 buried resistance board cK( C&NK
母板 mother board )"7iJb<E
子板 daughter board ~qTx|",
背板 backplane *XIF)Q=<>
裸板 bare board at,XB.}Z]
键盘板夹心板 copper-invar-copper board <Zmg#
动态挠性板 dynamic flex board 'a@/vx&J
静态挠性板 static flex board ek*rp`y]
可断拼板 break-away planel *`5.|{<j{
电缆 cable Rl?_^dPx
挠性扁平电缆 flexible flat cable (FFC) c(xrP/yOwi
薄膜开关 membrane switch ;U+3w~
混合电路 hybrid circuit G[uK -U
厚膜 thick film h-`? {k&e
厚膜电路 thick film circuit #lL^?|M
薄膜 thin film P@V0Mi),
薄膜混合电路 thin film hybrid circuit K0|FY=#2y
互连 interconnection ymhtX6]
导线 conductor trace line 2} /aFR
齐平导线 flush conductor 0z6R'Kjy A
传输线 transmission line V^bwXr4f
跨交 crossover DEKP5?]
板边插头 edge-board contact dO!
kk"qn
增强板 stiffener s+$ Q}|?u
基底 substrate 6]WAUK%h
基板面 real estate Q{>+ft U
导线面 conductor side KQ!8ks]
元件面 component side 84& $^lNV
焊接面 solder side [}E='m}u9+
导电图形 conductive pattern FrGgga$
非导电图形 non-conductive pattern Bu~]ey1
基材 base material 2*;~S44
层压板 laminate HdUQCugxx:
覆金属箔基材 metal-clad bade material gwuI-d^
覆铜箔层压板 copper-clad laminate (CCL) q 376m-+
复合层压板 composite laminate pP&7rRhw
薄层压板 thin laminate [
)Iv^ U9
基体材料 basis material /K@XzwM
预浸材料 prepreg %rL.|q9
粘结片 bonding sheet -A^ _{4X
预浸粘结片 preimpregnated bonding sheer c <B/V0]
环氧玻璃基板 epoxy glass substrate dVtG/0
预制内层覆箔板 mass lamination panel %}SrL*
内层芯板 core material dd %6t
粘结层 bonding layer 8Z8gRcv{p
粘结膜 film adhesive u5`u>.!
无支撑胶粘剂膜 unsupported adhesive film c<:-T
覆盖层 cover layer (cover lay) xX&+WR
增强板材 stiffener material _YhES-Ff
铜箔面 copper-clad surface we//|fA<
去铜箔面 foil removal surface ].w4$OJ?
层压板面 unclad laminate surface y@S$^jk.
基膜面 base film surface S%;O+eFYb
胶粘剂面 adhesive faec V(I8=rVH
原始光洁面 plate finish ,aZ[R27rpL
粗面 matt finish {L{o]Ii?g
剪切板 cut to size panel :1QI8%L'$i
超薄型层压板 ultra thin laminate @1roe
G
A阶树脂 A-stage resin DN>[\hg
B阶树脂 B-stage resin EH J.T~X
C阶树脂 C-stage resin :%=Xm
环氧树脂 epoxy resin Ko<:Z)PS
酚醛树脂 phenolic resin ,f%S'(>w
聚酯树脂 polyester resin hn
GZ=
聚酰亚胺树脂 polyimide resin &-)N'
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 8b&/k8i:
丙烯酸树脂 acrylic resin JYI,N
三聚氰胺甲醛树脂 melamine formaldehyde resin AofKw
多官能环氧树脂 polyfunctional epoxy resin *w`sM%]Rq
溴化环氧树脂 brominated epoxy resin Woym/[i
环氧酚醛 epoxy novolac |tH4:%Q'
氟树脂 fluroresin ?(1y
硅树脂 silicone resin YoNDf39
硅烷 silane i>`%TW:g
聚合物 polymer 4SxX3Fw
无定形聚合物 amorphous polymer AO4U}?
结晶现象 crystalline polamer \';gvr|
双晶现象 dimorphism 9s
q
共聚物 copolymer dFB]~QEK
合成树脂 synthetic _
]ipajT
热固性树脂 thermosetting resin [Page] L~OvY
热塑性树脂 thermoplastic resin iOghb*aW
感光性树脂 photosensitive resin Dw.J2>uj
环氧值 epoxy value }j)e6>K])
双氰胺 dicyandiamide 194)QeoFw
粘结剂 binder NH4#
胶粘剂 adesive &K#M*B,*p
固化剂 curing agent )*J^K?!S
阻燃剂 flame retardant K($Npuu]
遮光剂 opaquer :P~6~
Kum
增塑剂 plasticizers JX;G<lev
不饱和聚酯 unsatuiated polyester WSB0~+
聚酯薄膜 polyester <iC(`J$D
聚酰亚胺薄膜 polyimide film (PI) z>Y-fN`,
聚四氟乙烯 polytetrafluoetylene (PTFE) .|70;
增强材料 reinforcing material =8.
,43+
折痕 crease T.BW H2gRP
云织 waviness aB&&YlR=n<
鱼眼 fish eye AQvudx)@"
毛圈长 feather length k="i;! Ge
厚薄段 mark jV1.Yz(`
裂缝 split 7Ovi{xd@
捻度 twist of yarn \ ~$#1D1f
浸润剂含量 size content
cdT7
@
浸润剂残留量 size residue "<1{9
处理剂含量 finish level VlsnL8DV
偶联剂 couplint agent #q=Efn'
断裂长 breaking length FvjPdN/L?R
吸水高度 height of capillary rise 0S!K{xyR
湿强度保留率 wet strength retention .W!i7
白度 whitenness zRr*7G
导电箔 conductive foil @q7I4
铜箔 copper foil VU3upy<
压延铜箔 rolled copper foil aEeodA<(
光面 shiny side 3F2w-+L
粗糙面 matte side 2fd{hJDq;5
处理面 treated side VpDbHAg
防锈处理 stain proofing {JMVV_}n
双面处理铜箔 double treated foil n{mfn*r.
模拟 simulation 6LIJQ
逻辑模拟 logic simulation "+G8d'%YV
电路模拟 circit simulation .#8 JCY
时序模拟 timing simulation rjYJs*#
模块化 modularization lRFYx?y
设计原点 design origin )jP1or
优化(设计) optimization (design) W/h[A3 `3N
供设计优化坐标轴 predominant axis ^<2p~h0
\
表格原点 table origin `X&gE,Ii
元件安置 component positioning zQd
2
比例因子 scaling factor UZ+<\+q3^
扫描填充 scan filling 2P0*NQ
矩形填充 rectangle filling #@Jq~$N|
填充域 region filling uKHxe~
实体设计 physical design r;N|)
逻辑设计 logic design H G^'I+Yn
逻辑电路 logic circuit +23xev
层次设计 hierarchical design h2d(?vOT
自顶向下设计 top-down design o>pJPV
自底向上设计 bottom-up design pW3^X=6
费用矩阵 cost metrix ISvpQ 3{)s
元件密度 component density fNFY$:4X
自由度 degrees freedom
}.6[qk
出度 out going degree UJ
入度 incoming degree Sdryol<
曼哈顿距离 manhatton distance 4.t-i5
欧几里德距离 euclidean distance 9\7en%( M
网络 network 3.y vvPFEM
阵列 array Gk6iIK
段 segment ep{FpB
逻辑 logic _oeS Uzq.
逻辑设计自动化 logic design automation G4"F+%.
分线 separated time fz
"Y CHe
分层 separated layer "^GGac.
定顺序 definite sequence )Pv%#P-<
导线(通道) conduction (track) 5nx1i
导线(体)宽度 conductor width Y.p;1"
导线距离 conductor spacing ^iV)MTT
导线层 conductor layer tKXIk9e
导线宽度/间距 conductor line/space sFRQe]zCcP
第一导线层 conductor layer No.1 yJIscwF
圆形盘 round pad 3u0RKLc\
方形盘 square pad cw
<l{A
菱形盘 diamond pad jmG~Un M
长方形焊盘 oblong pad c-sfg>0 ^
子弹形盘 bullet pad o ^uA">GH
泪滴盘 teardrop pad La[V$+Y
雪人盘 snowman pad K{+2G&i
形盘 V-shaped pad V )vlhN2iv
环形盘 annular pad 0w7DsPdS
非圆形盘 non-circular pad A,!-{/w c
隔离盘 isolation pad d&>^&>?$zh
非功能连接盘 monfunctional pad "\yT7?},
偏置连接盘 offset land 1< ?4\?j
腹(背)裸盘 back-bard land }^\oCR@
盘址 anchoring spaur I7]8Y=xf
连接盘图形 land pattern C;yZ
连接盘网格阵列 land grid array "#g}ve,
孔环 annular ring /PKN LK
元件孔 component hole -mh3DhJ,
安装孔 mounting hole g<qaXv
支撑孔 supported hole {_*yGK48n
非支撑孔 unsupported hole ~&uHbTq
导通孔 via 1|:KQl2q
镀通孔 plated through hole (PTH) c &c@M$
余隙孔 access hole 'Pbr
v
盲孔 blind via (hole) :k#HW6p
埋孔 buried via hole 2~[juWbz
埋,盲孔 buried blind via uQzXfOq
任意层内部导通孔 any layer inner via hole `WS&rmq&'
全部钻孔 all drilled hole D2O~kNd
定位孔 toaling hole K(|}dl:
无连接盘孔 landless hole ;kKyksxlD
中间孔 interstitial hole %a7$QF]
无连接盘导通孔 landless via hole k}rbim
引导孔 pilot hole F"mmLao
端接全隙孔 terminal clearomee hole [#iz/q~}
准尺寸孔 dimensioned hole [Page] N$tGQ@
在连接盘中导通孔 via-in-pad cZ3v=ke^
孔位 hole location ia?
c0xL
孔密度 hole density Iga024KR
孔图 hole pattern vih9KBT
钻孔图 drill drawing 4^d?D!j
装配图assembly drawing y1#1Ne_
参考基准 datum referan 2~2 O V
1) 元件设备 Ho]su?
:23P!^Y
三绕组变压器:three-column transformer ThrClnTrans 6S{l'!s'
双绕组变压器:double-column transformer DblClmnTrans -Qe'YBy:
电容器:Capacitor @(lh%@hO
并联电容器:shunt capacitor 'N(R_q6MW
电抗器:Reactor nr#|b`J]
母线:Busbar z(~_AN M4,
输电线:TransmissionLine $pz/?>!
发电厂:power plant 1.>m@Slr>
断路器:Breaker ji="DYtL
刀闸(隔离开关):Isolator 3(UVg!t
分接头:tap 6dYMwMH
电动机:motor Xwtqi@zlE
(2) 状态参数 2A!FDr~cdT
8?C5L8)
有功:active power FGkVqZ Y2?
无功:reactive power 4&iCht
=
电流:current Yr|4Fl~U
容量:capacity D43z9z-:L
电压:voltage
AOx[
档位:tap position w2J<WC+_<
有功损耗:reactive loss ," ql5Q4
无功损耗:active loss q cno^8R
功率因数:power-factor @%SQFu@FJ
功率:power D&zle~" J
功角:power-angle T^q
0'#/
电压等级:voltage grade sR8"3b<qA
空载损耗:no-load loss A %-6`>
铁损:iron loss 54qFfN8O
铜损:copper loss :v 4]D4\o
空载电流:no-load current 4GM6)"#d
阻抗:impedance XX~,>Q}H=
正序阻抗:positive sequence impedance ?X;RLpEc|A
负序阻抗:negative sequence impedance B/C,.?Or
零序阻抗:zero sequence impedance %XTI-B/K
电阻:resistor :@&/kyGH
电抗:reactance Q@H V- (A
电导:conductance OrG).^l
电纳:susceptance ']oQ]Yx0
无功负载:reactive load 或者QLoad J8D,ZfPN`d
有功负载: active load PLoad .e5Mnd%$M
遥测:YC(telemetering) &.ACd+Cd
遥信:YX %>s|j'{
励磁电流(转子电流):magnetizing current mA} "a<0
定子:stator A)KZa"EX
功角:power-angle =w^M{W.w
上限:upper limit mVmGg,
下限:lower limit I?NyM
并列的:apposable (iGTACoF
高压: high voltage $ulOp;~A%
低压:low voltage y?!"6t7&
中压:middle voltage \[nut;
电力系统 power system hzC>~Ub5
发电机 generator G/ 5%.Bf@
励磁 excitation YoE3<[KD(
励磁器 excitor /L#?zSt
电压 voltage CH/rp4NeSy
电流 current &?RQZHtg
母线 bus Ct|A:/z(
变压器 transformer 4/)k)gLI
升压变压器 step-up transformer J-4:H
gx
高压侧 high side l+0P
输电系统 power transmission system 3N:D6w-R
输电线 transmission line iR0y"Cii
固定串联电容补偿fixed series capacitor compensation Qei"'~1a
稳定 stability !VK|u8i
电压稳定 voltage stability cGD(.=
功角稳定 angle stability UZ$/Ni
暂态稳定 transient stability P
}uOJVQ_
电厂 power plant S@sO;-^+
能量输送 power transfer 07 $o;W@
交流 AC fn!KQ`,#
装机容量 installed capacity 39jG8zr=Z[
电网 power system RFH0
落点 drop point M@ZI\
开关站 switch station X8`Sf>
双回同杆并架 double-circuit lines on the same tower Lh<).<S
变电站 transformer substation FGQzoS
补偿度 degree of compensation E~:x(5'%d
高抗 high voltage shunt reactor &VcV$8k
无功补偿 reactive power compensation o`RKXfCq
故障 fault Y4(
调节 regulation .}*"Nv
裕度 magin [fIg{Q
三相故障 three phase fault Ic4H# w
故障切除时间 fault clearing time m#F`] {
极限切除时间 critical clearing time 8JD,u
切机 generator triping VD\=`r)nT
高顶值 high limited value b_):MQ1{
强行励磁 reinforced excitation gzg_>2Sj
线路补偿器 LDC(line drop compensation) zv"Z DRW
机端 generator terminal n-OL0$Xu
静态 static (state) \^%}M!tan
动态 dynamic (state) u~-8d;+?y
单机无穷大系统 one machine - infinity bus system !Rt>xD
机端电压控制 AVR H7j0K ~U0
电抗 reactance !?gKqx'T$
电阻 resistance SZ$Kz n
功角 power angle GM<-&s!Uj
有功(功率) active power 6JQ'Ik;$wX
无功(功率) reactive power tnG# IU
*
功率因数 power factor )>- =R5ZV
无功电流 reactive current K96<M);:g
下降特性 droop characteristics l/awS!Q/nF
斜率 slope ?I@W:#>o
额定 rating ""|Qtubv
变比 ratio ?3xzd P
参考值 reference value RdML3E
电压互感器 PT }Z,x~G
分接头 tap Wiu"k%Qsh
下降率 droop rate @{O`E^}-D
仿真分析 simulation analysis E\,-XH
传递函数 transfer function :4%k9BGAj"
框图 block diagram Ez=Olbk
受端 receive-side LE>]8[f6S
裕度 margin ^ovR7+V
同步 synchronization ]P?vdgEM&
失去同步 loss of synchronization xK\d4"
阻尼 damping xUistwq
摇摆 swing iW /}#
保护断路器 circuit breaker 5o8EC"
0
电阻:resistance /~f'}]W
电抗:reactance <3hRyG@vB
阻抗:impedance & 9 ?\b7
电导:conductance /Mu@,)''
电纳:susceptance