1 backplane 背板 *_K*GCy
2 Band gap voltage reference 带隙电压参考 A(+%DZ
3 benchtop supply 工作台电源 G
BM8:IG \
4 Block Diagram 方块图 5 Bode Plot 波特图 bv}e[yH
6 Bootstrap 自举 vU9:`@beu
7 Bottom FET Bottom FET "-Wb[*U;
8 bucket capcitor 桶形电容 D=}\]Krmay
9 chassis 机架 c-ql
10 Combi-sense Combi-sense k\-h-0[|
11 constant current source 恒流源 OU<v9`<
12 Core Sataration 铁芯饱和 8"o@$;C
13 crossover frequency 交叉频率 plM:7#eA
14 current ripple 纹波电流 '%y;{,g*
15 Cycle by Cycle 逐周期 M<P8u`)>4H
16 cycle skipping 周期跳步 ^p3W}D
17 Dead Time 死区时间 +tJ 7ZR%
18 DIE Temperature 核心温度 Qw<&N$
19 Disable 非使能,无效,禁用,关断 ^95njE`>t`
20 dominant pole 主极点 =X7_!vSv
21 Enable 使能,有效,启用 -L!lJ
22 ESD Rating ESD额定值 1o?uf,H7O
23 Evaluation Board 评估板 "6Z(0 iu:{
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. E@4/<;eKK
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 e/}4Pt
25 Failling edge 下降沿 9T0g%&
26 figure of merit 品质因数 \r"gqv)^
27 float charge voltage 浮充电压 zpZfsn!
28 flyback power stage 反驰式功率级 %a!gN
29 forward voltage drop 前向压降 G"h}6Za;DO
30 free-running 自由运行 wZWAx
31 Freewheel diode 续流二极管 MfO:BX@$
32 Full load 满负载 33 gate drive 栅极驱动 e0hY
34 gate drive stage 栅极驱动级 6w[EJ;=p_
35 gerber plot Gerber 图 *q+X?3
36 ground plane 接地层 me-uPm
37 Henry 电感单位:亨利 BAtjYPX'w
38 Human Body Model 人体模式 [pInF
Qh6
39 Hysteresis 滞回 P~%+KxwZQ
40 inrush current 涌入电流 5GGO:
41 Inverting 反相 _PSOT5{
42 jittery 抖动 L$,yEMCe
43 Junction 结点 [v`kqL~
44 Kelvin connection 开尔文连接 egVKAR-
45 Lead Frame 引脚框架 zE~Xxp
46 Lead Free 无铅 QQv%>=_`
47 level-shift 电平移动 hw(\3h()
48 Line regulation 电源调整率 I5 qrHBJ >
49 load regulation 负载调整率 Y=5P=wE
50 Lot Number 批号 ,e$6%R
51 Low Dropout 低压差 <~uzKs0
52 Miller 密勒 53 node 节点 buT6)~lw
54 Non-Inverting 非反相 %r8;i
55 novel 新颖的 <>728;/C
56 off state 关断状态 <_#2+7Qs
57 Operating supply voltage 电源工作电压 E;[Uhh|78!
58 out drive stage 输出驱动级 [bRE=Zr$Ry
59 Out of Phase 异相 ?'_6M4UKa
60 Part Number 产品型号 AQmHa2P
61 pass transistor pass transistor 216$,4i
62 P-channel MOSFET P沟道MOSFET O8SE)R~
63 Phase margin 相位裕度 {`,)<R>}
64 Phase Node 开关节点 X-#&]^d
65 portable electronics 便携式电子设备 ESYF4-d+
66 power down 掉电 >F s/Wet
67 Power Good 电源正常 *ifz@8C }
68 Power Groud 功率地 keFH
CC
69 Power Save Mode 节电模式 [c;#>UQMf
70 Power up 上电 FRQ0t!b<M1
71 pull down 下拉 %D5F7wB
72 pull up 上拉 _54gqD2C,
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) }pIn3B)
74 push pull converter 推挽转换器 Ih>s2nL
75 ramp down 斜降 Wky9wr:g
76 ramp up 斜升 ? ^W1WEBm
77 redundant diode 冗余二极管 Ri~$hs!
78 resistive divider 电阻分压器 AV7#,+p%G
79 ringing 振 铃 imeE&
80 ripple current 纹波电流 *@H\J e`
81 rising edge 上升沿 W"GW[~
h
82 sense resistor 检测电阻 *} ?
83 Sequenced Power Supplys 序列电源 6uT*Fg-G
84 shoot-through 直通,同时导通 {/H<_
85 stray inductances. 杂散电感 ft$RF
86 sub-circuit 子电路 CH&{x7$he
87 substrate 基板 a[ayr$Hk?
88 Telecom 电信 w jD<"p;P
89 Thermal Information 热性能信息 Fxc_s/^=t
90 thermal slug 散热片 Cs7ol-\)
91 Threshold 阈值 gWzslgO6
92 timing resistor 振荡电阻 P^Owgr=Y
93 Top FET Top FET t ^[fu,
94 Trace 线路,走线,引线 (:HT|gKoE
95 Transfer function 传递函数 P_w4
DU
96 Trip Point 跳变点 c!/+0[
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) v"W*@7<`S
98 Under Voltage Lock Out (UVLO) 欠压锁定 %1.F;-GdsW
99 Voltage Reference 电压参考 zX4RqI
100 voltage-second product 伏秒积 e6Y>Bk
101 zero-pole frequency compensation 零极点频率补偿 5af0- hj
102 beat frequency 拍频 d?T!)w
103 one shots 单击电路 xcU!bDV
104 scaling 缩放 ?5J#
105 ESR 等效串联电阻 [Page] J E7m5kTa
106 Ground 地电位 6{Q-]LOc[.
107 trimmed bandgap 平衡带隙 q]I aRho
108 dropout voltage 压差 )iQ^HZ
109 large bulk capacitance 大容量电容 3ie
k>'T
110 circuit breaker 断路器 (u} /(Ux
111 charge pump 电荷泵 #$x,PeG
112 overshoot 过冲 PPr Pj^%z=
#Uu,yHMv:;
印制电路printed circuit L_RVHvA=M/
印制线路 printed wiring bo/9k 4N3
印制板 printed board J\Pb/9M/
印制板电路 printed circuit board ws+ '*7
印制线路板 printed wiring board lz~^*\ F
印制元件 printed component 4,z|hY_*t
印制接点 printed contact gS5MoW1
印制板装配 printed board assembly <D ~hhGb
板 board A5TSbW']+5
刚性印制板 rigid printed board O5 73AA
挠性印制电路 flexible printed circuit e;"J,7@
挠性印制线路 flexible printed wiring jDpA>{O[
齐平印制板 flush printed board 9hfg/3t('
金属芯印制板 metal core printed board 8 O9^g4?
金属基印制板 metal base printed board dAx
? ,
多重布线印制板 mulit-wiring printed board Z%]K,9K
塑电路板 molded circuit board -smN}*3[
散线印制板 discrete wiring board XGR2L
DR
微线印制板 micro wire board _ZK^JS
积层印制板 buile-up printed board #Az#_0=
表面层合电路板 surface laminar circuit = IRot
埋入凸块连印制板 B2it printed board dX cbS<
载芯片板 chip on board B[GC@]HE
埋电阻板 buried resistance board Q_0+N3
母板 mother board fq6Obh=A#
子板 daughter board eTvWkpK+
背板 backplane Lz.khE<
裸板 bare board 0BlEt1e2T
键盘板夹心板 copper-invar-copper board .EL3}6"A
动态挠性板 dynamic flex board oxlor,lw/
静态挠性板 static flex board 1fS&KO{a
可断拼板 break-away planel >X$JeME3
电缆 cable S>~f.
挠性扁平电缆 flexible flat cable (FFC) I"88O4\@
薄膜开关 membrane switch 6+IhI?lI=
混合电路 hybrid circuit !Ud'(iGa
厚膜 thick film OR+qi*)
厚膜电路 thick film circuit w~b:9_reY
薄膜 thin film Q^Cm3|ZO
薄膜混合电路 thin film hybrid circuit Y0 a[Lb0
互连 interconnection SWV*w[X<X
导线 conductor trace line k56Qas+3=
齐平导线 flush conductor :S0!
传输线 transmission line iH }-
跨交 crossover &<BBPn@\
板边插头 edge-board contact *#XZ*Ga
增强板 stiffener x950,`zy
基底 substrate t^~vi'bB
基板面 real estate <b zzbR[F
导线面 conductor side ,*XB11P
元件面 component side "#r)NYq`"|
焊接面 solder side CLrX!JV>
导电图形 conductive pattern #{q.s[g*+1
非导电图形 non-conductive pattern T?pS2I~
基材 base material E{|B&6$[}
层压板 laminate o%t4WQ|bj
覆金属箔基材 metal-clad bade material ;|5-{+2 U%
覆铜箔层压板 copper-clad laminate (CCL) =9jK\ T^
复合层压板 composite laminate M,]|L c h
薄层压板 thin laminate o6[.$C
基体材料 basis material ^9[Q;=R
预浸材料 prepreg 2IJK0w@
粘结片 bonding sheet }L_YpG7
预浸粘结片 preimpregnated bonding sheer b"h'7 C/
环氧玻璃基板 epoxy glass substrate 2|je{
预制内层覆箔板 mass lamination panel 9=>fx
内层芯板 core material 1|MRXK
粘结层 bonding layer ,2S!$M
粘结膜 film adhesive k7CKl;Fck
无支撑胶粘剂膜 unsupported adhesive film F^u12R)
覆盖层 cover layer (cover lay) |sZqqgZ-
增强板材 stiffener material H$h#n~W~
铜箔面 copper-clad surface P1-eDHYw
去铜箔面 foil removal surface :-1|dE)U
层压板面 unclad laminate surface pZnp!!G
基膜面 base film surface +X=*>^G(-
胶粘剂面 adhesive faec g_Z
tDxz
原始光洁面 plate finish w>%@Ug["
粗面 matt finish _ox+5?>
剪切板 cut to size panel FJ;I1~??
超薄型层压板 ultra thin laminate h:?^0b!@
A阶树脂 A-stage resin oACAC+CP
B阶树脂 B-stage resin w 9dkJo
C阶树脂 C-stage resin .Kb3VNgwvm
环氧树脂 epoxy resin }UhYwJf89
酚醛树脂 phenolic resin u:l-qD9=(
聚酯树脂 polyester resin /|0-O''
聚酰亚胺树脂 polyimide resin jc5[r;#
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 3Qy@^"
丙烯酸树脂 acrylic resin W;vNmg}mn
三聚氰胺甲醛树脂 melamine formaldehyde resin G !q[NRu
多官能环氧树脂 polyfunctional epoxy resin ue_wuZi
溴化环氧树脂 brominated epoxy resin gQn%RPMh
环氧酚醛 epoxy novolac 1$>+rW{a
氟树脂 fluroresin m@Z#
硅树脂 silicone resin c7e,lgG-
硅烷 silane SI}s
聚合物 polymer %O"8|ZG9{
无定形聚合物 amorphous polymer cM#rus?)+
结晶现象 crystalline polamer b:dN )m
双晶现象 dimorphism F$7!j$
Z
共聚物 copolymer jf9+H!?^N
合成树脂 synthetic s<O$
Y
热固性树脂 thermosetting resin [Page] KF.{r
热塑性树脂 thermoplastic resin _ \D%
感光性树脂 photosensitive resin #{cy( &cz
环氧值 epoxy value r_T)|||v
双氰胺 dicyandiamide x)PW4{3qR
粘结剂 binder 39X~<\&'
胶粘剂 adesive A8)4nOXM
固化剂 curing agent Gw*Tz"
阻燃剂 flame retardant KdVKvs[
遮光剂 opaquer u^Q`xd1
增塑剂 plasticizers 8u[_t.y4m
不饱和聚酯 unsatuiated polyester w#"\*SKK
聚酯薄膜 polyester 9d5$cV
聚酰亚胺薄膜 polyimide film (PI) [YDSS/
聚四氟乙烯 polytetrafluoetylene (PTFE) 6D;N.wDZ
增强材料 reinforcing material da$FY7
折痕 crease n!jmxl$
云织 waviness 1JJsYX
鱼眼 fish eye >US*7m }
毛圈长 feather length H[=\_X1o(
厚薄段 mark yXJhOCa
裂缝 split fkV@3sj
捻度 twist of yarn 7Uenr9)M
浸润剂含量 size content ATs_d_Sz
浸润剂残留量 size residue &2tfj(ms
处理剂含量 finish level a|ufm^F
偶联剂 couplint agent zx.qN
断裂长 breaking length B8@mL-Z-;
吸水高度 height of capillary rise &LLU@ |
湿强度保留率 wet strength retention uFkl^2
白度 whitenness +:MSY p
导电箔 conductive foil ":!$Jnj,
铜箔 copper foil RZa/la*
压延铜箔 rolled copper foil 1Viz`y)^
光面 shiny side ~ ld.I4
粗糙面 matte side qmrT dG
处理面 treated side SDnl^a
防锈处理 stain proofing 3c<aI=$^
双面处理铜箔 double treated foil F y+NJSG
模拟 simulation 0Hnj<| HL
逻辑模拟 logic simulation \]X.f&u
电路模拟 circit simulation &jqaW2
时序模拟 timing simulation 6h:QSVfx
模块化 modularization E]V,
@
设计原点 design origin u?^V4 +V
优化(设计) optimization (design) MxE]EJZ
供设计优化坐标轴 predominant axis ^m\o(R
表格原点 table origin }[p{%:tP
元件安置 component positioning cx\"r
比例因子 scaling factor il0K ^i
扫描填充 scan filling ^FVdA1~/
矩形填充 rectangle filling x YS81
填充域 region filling "zEl2Xn28_
实体设计 physical design '/\
逻辑设计 logic design IiYL2JS;t|
逻辑电路 logic circuit L}Z.FqJ
层次设计 hierarchical design |XyX%5p*
自顶向下设计 top-down design FYAEM!dyy
自底向上设计 bottom-up design 6= ?0&Bx&
费用矩阵 cost metrix ]!hjKu"
元件密度 component density WogUILB
自由度 degrees freedom #CS>_qe.{
出度 out going degree M8},RR@{
入度 incoming degree k8gH#ENNK
曼哈顿距离 manhatton distance O
NabL.CV
欧几里德距离 euclidean distance rOJ>lPs
网络 network 4]d^L>
阵列 array 0seCQANd
段 segment yD9enYM
逻辑 logic -gn0@hS0
逻辑设计自动化 logic design automation vhe Y
F@
分线 separated time ni;_Un~
分层 separated layer 6N/(cUXJ
定顺序 definite sequence Cfi{%,em
导线(通道) conduction (track) oo'9ZE/%
导线(体)宽度 conductor width 66=[6U9 *
导线距离 conductor spacing x9lA';})
导线层 conductor layer &;PxDlY5
导线宽度/间距 conductor line/space /}:{(Go
第一导线层 conductor layer No.1 N_Us6X
圆形盘 round pad q"d9C)Md
方形盘 square pad TKZtoQP%
菱形盘 diamond pad a&s34Pd
长方形焊盘 oblong pad 6H#:rM
子弹形盘 bullet pad F`D$bE;|
泪滴盘 teardrop pad *|rdR2R!
雪人盘 snowman pad mxlh\'b
形盘 V-shaped pad V g/GI'8EMj
环形盘 annular pad 4.9qB
非圆形盘 non-circular pad JVAyiNIH>M
隔离盘 isolation pad )*KMU?
非功能连接盘 monfunctional pad *i"9D:
偏置连接盘 offset land 5`h 6oFxGp
腹(背)裸盘 back-bard land i/>k_mG$d
盘址 anchoring spaur OUv )`K
连接盘图形 land pattern ;&d#)&O"e
连接盘网格阵列 land grid array 4D65VgVDM
孔环 annular ring Ib(C`4%
元件孔 component hole vC]X>P5 Px
安装孔 mounting hole [$dVs16K
支撑孔 supported hole U,rI/'
非支撑孔 unsupported hole t{})6
导通孔 via sI,cX#h&Y
镀通孔 plated through hole (PTH) lm`*x=x
余隙孔 access hole := V?;
盲孔 blind via (hole) ?P9aXwc
埋孔 buried via hole dL42)HP5
埋,盲孔 buried blind via teok *'b:
任意层内部导通孔 any layer inner via hole }*x1e_m}H
全部钻孔 all drilled hole n_kwtWX(
定位孔 toaling hole CHnclT
无连接盘孔 landless hole E'6>3n
中间孔 interstitial hole Nl\`xl6y]
无连接盘导通孔 landless via hole {B$CqsvJ
引导孔 pilot hole hFV,FBsAO
端接全隙孔 terminal clearomee hole TQR5V\{&%
准尺寸孔 dimensioned hole [Page] ^O}a,
在连接盘中导通孔 via-in-pad M=,pn+}y>
孔位 hole location MlV(XG>'
孔密度 hole density QK_5gD`$a,
孔图 hole pattern k_pv6YrE
钻孔图 drill drawing y##h(y
装配图assembly drawing Y3 $jNuV
参考基准 datum referan QE]'Dc%
1) 元件设备 ]J Yz(m[
BlJiHz!
三绕组变压器:three-column transformer ThrClnTrans ~,lt^@a
双绕组变压器:double-column transformer DblClmnTrans Q<sqlh!h
电容器:Capacitor V%-hP~nyBx
并联电容器:shunt capacitor fe\lSGmf
电抗器:Reactor Us`=^\
母线:Busbar F5?S8=i
输电线:TransmissionLine p]aEC+q
发电厂:power plant oU=vl!\J
断路器:Breaker FC0fe_U(F
刀闸(隔离开关):Isolator g*$2qKm
分接头:tap jE0oLEg&
电动机:motor $PJ==N
(2) 状态参数 3?o4
7.
F'1oEf
有功:active power 'lIs`Zc5N
无功:reactive power ZthT('"a
电流:current 6]7csOE
容量:capacity vr;`h/
电压:voltage 56AC%_ g>
档位:tap position R+LKa Z
有功损耗:reactive loss qvn.uujYS
无功损耗:active loss 5RPG3ppS
功率因数:power-factor 15ailA&(Qm
功率:power W9SU1{*9
功角:power-angle :T-DxP/
电压等级:voltage grade 3)G~ud
空载损耗:no-load loss FWbp;v{
铁损:iron loss ,`t+X=#
铜损:copper loss F`g(vD>
空载电流:no-load current U[wx){[|
阻抗:impedance o[>d"Kp
正序阻抗:positive sequence impedance wR%Ta -
负序阻抗:negative sequence impedance um,f!ho-U
零序阻抗:zero sequence impedance cC~RW71
电阻:resistor aAjl
58
电抗:reactance 4aO/^Hl
电导:conductance +byOThuE
电纳:susceptance m?w_
]
无功负载:reactive load 或者QLoad SAP/jD$5]>
有功负载: active load PLoad gPd
K%"B@
遥测:YC(telemetering) AE rPd)yk0
遥信:YX P j
励磁电流(转子电流):magnetizing current -[=~!Qr:
定子:stator v@qP &4Sp
功角:power-angle c}(H*VY2n
上限:upper limit I=dG(?#7%
下限:lower limit xF8r+{_J)
并列的:apposable Znb={hh
高压: high voltage zud_BOq{f
低压:low voltage S;4:`?s=i
中压:middle voltage (=j;rfvP
电力系统 power system UWT%0t_T
发电机 generator GD4S/fn3
励磁 excitation yd;e;Bb7*
励磁器 excitor ovKM;cRs/
电压 voltage <YyE1|
电流 current v0DDim?cc
母线 bus -#ZvjEaey
变压器 transformer Qu|CXUk
升压变压器 step-up transformer 1_+ h"LE
高压侧 high side ?tLApy^`?
输电系统 power transmission system p@jw)xI
输电线 transmission line D?n6h\h\$%
固定串联电容补偿fixed series capacitor compensation `*s:[k5k
稳定 stability !Se0&Ob
电压稳定 voltage stability c5ij2X|I
功角稳定 angle stability DhE-g<
暂态稳定 transient stability LdZVXp^
电厂 power plant KW:N
6w
能量输送 power transfer t]HY@@0g
交流 AC #*g=F4>t
装机容量 installed capacity gkr9+
电网 power system D7hTn@I
落点 drop point 0GUJc}fgvN
开关站 switch station ~e}JqJ(97
双回同杆并架 double-circuit lines on the same tower n{gEIUo#
变电站 transformer substation {w2]
Is2F
补偿度 degree of compensation 3L&:
高抗 high voltage shunt reactor O=jLZ2os
无功补偿 reactive power compensation <Z^by;d|z
故障 fault PK+sGV
调节 regulation Uj5-x%~
裕度 magin
^.A*mMQ
三相故障 three phase fault .lcp5D[(
故障切除时间 fault clearing time @}
Ig*@
极限切除时间 critical clearing time :-RB< Lj
切机 generator triping cC-8.2
高顶值 high limited value Z!g6uV+.5
强行励磁 reinforced excitation *^-AOSVt,
线路补偿器 LDC(line drop compensation) VlV
X
机端 generator terminal lsax.uG5x
静态 static (state) $9G&
wH>{
动态 dynamic (state) "W(D0oy
单机无穷大系统 one machine - infinity bus system h`6 (Oo|
机端电压控制 AVR JvO1tA]ij
电抗 reactance `0Udg,KOs
电阻 resistance V#Wy`
ce
功角 power angle v6 5C
j2ec
有功(功率) active power s, Gl{
无功(功率) reactive power AMyg>n!
功率因数 power factor *q6XK_
无功电流 reactive current :Q`Of}#
下降特性 droop characteristics _}5vO$kdO
斜率 slope xUn"XkhP
额定 rating boojq{cvYA
变比 ratio 4v_Ac;2m&
参考值 reference value >
'R{,1# U
电压互感器 PT j-9)Sijj{
分接头 tap "1,*6(;:
下降率 droop rate ]he~KO[j<
仿真分析 simulation analysis Z1,rN#p9
传递函数 transfer function hNXZL>6
框图 block diagram ZS.=GjK
受端 receive-side |"}rdOV)
裕度 margin ,NGHv?.N
同步 synchronization ?-j/X6(\(
失去同步 loss of synchronization tl_3 %$s
阻尼 damping DzR,ou
摇摆 swing 5'set?
保护断路器 circuit breaker
?!Y_w2
电阻:resistance Un]wP`
电抗:reactance jj`#;Y
阻抗:impedance #]dm/WzY
电导:conductance 8-<F4^i_i
电纳:susceptance