1 backplane 背板 f<@`{oP@
2 Band gap voltage reference 带隙电压参考 rf$eg
3 benchtop supply 工作台电源 1.j;Xo/+:V
4 Block Diagram 方块图 5 Bode Plot 波特图 <9?`zo$y
6 Bootstrap 自举 b"~Ct}6f
7 Bottom FET Bottom FET BctU`.
8 bucket capcitor 桶形电容 XN'<H(G
9 chassis 机架 e&=T`
10 Combi-sense Combi-sense A#w*r-P
11 constant current source 恒流源 >zv}59M
12 Core Sataration 铁芯饱和 yrR,7vJ
13 crossover frequency 交叉频率 IN!IjInaT@
14 current ripple 纹波电流 w;T?m,"
15 Cycle by Cycle 逐周期 )<%IY&\
16 cycle skipping 周期跳步 7p,!<X}%
17 Dead Time 死区时间 $C6O<A
18 DIE Temperature 核心温度 {+|Em (M
19 Disable 非使能,无效,禁用,关断 {hKf
'd9E
20 dominant pole 主极点 \H.1I=<
21 Enable 使能,有效,启用 BoPJ;6?>}
22 ESD Rating ESD额定值 X1lL@ `r.5
23 Evaluation Board 评估板 'FGf#l<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 5> =Ia@I
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 x^6sjfAW
25 Failling edge 下降沿 VXu1Y xY
26 figure of merit 品质因数 [moz{Y
27 float charge voltage 浮充电压 q,_ 1?A)
28 flyback power stage 反驰式功率级 U~{sJwB
29 forward voltage drop 前向压降
=uIeur
30 free-running 自由运行 }G[Qm2k
31 Freewheel diode 续流二极管 OYNPZRu
32 Full load 满负载 33 gate drive 栅极驱动 JUC62s#_z
34 gate drive stage 栅极驱动级 +8q]O%B
35 gerber plot Gerber 图 4 O~zkg
36 ground plane 接地层 '~kAsn*/
37 Henry 电感单位:亨利 =Ev*Q[
38 Human Body Model 人体模式 8{J{)gF
39 Hysteresis 滞回 npdpKd+*K"
40 inrush current 涌入电流 1$~W~O
41 Inverting 反相 `$N AK
42 jittery 抖动 POc-`]6<F
43 Junction 结点 ?hwT{h
44 Kelvin connection 开尔文连接 ih/MW_t=m=
45 Lead Frame 引脚框架 lzStJ,NPqn
46 Lead Free 无铅 -!z,t7!
47 level-shift 电平移动 Fm{`?!
48 Line regulation 电源调整率 [1 gWc`#
49 load regulation 负载调整率 xQ7-4N,
50 Lot Number 批号 'Ijjk`d&c
51 Low Dropout 低压差 YDr/Cw>J
52 Miller 密勒 53 node 节点 Ok&u4'<
54 Non-Inverting 非反相 o w<.Dh
55 novel 新颖的 ~Fd<d[b?
56 off state 关断状态 jB!Q8#&Q
57 Operating supply voltage 电源工作电压 !|gln)|A
58 out drive stage 输出驱动级 GT} =(sD L
59 Out of Phase 异相 +gQoYlso
60 Part Number 产品型号 K\]ey;Bd
61 pass transistor pass transistor C~dD'Tq]
62 P-channel MOSFET P沟道MOSFET <kr%ylhIu
63 Phase margin 相位裕度 3mnq=.<(w
64 Phase Node 开关节点 i0-zGEMB.
65 portable electronics 便携式电子设备 -hIDL'5u-I
66 power down 掉电 Ju"*>66
67 Power Good 电源正常 amK.H"
68 Power Groud 功率地 {qHf%y&[
69 Power Save Mode 节电模式 kmXaLt2Z
70 Power up 上电 { f@k2^
71 pull down 下拉 2nGQD{
72 pull up 上拉 RvT>{G~
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) *@2?_b}A
^
74 push pull converter 推挽转换器 "##Ylq( "
75 ramp down 斜降 /HmD/E\
76 ramp up 斜升 r!vSYgee
77 redundant diode 冗余二极管 RRGCO+ )*
78 resistive divider 电阻分压器 ,U#$Qb 12
79 ringing 振 铃 h)qapC5z,
80 ripple current 纹波电流 E%vG#
81 rising edge 上升沿 .?YLD+\A
82 sense resistor 检测电阻 oX9rpTi
83 Sequenced Power Supplys 序列电源 L-lDvc?5c
84 shoot-through 直通,同时导通 P]4C/UDS-~
85 stray inductances. 杂散电感 {b^JH2,
86 sub-circuit 子电路 v<z%\`y
87 substrate 基板 {-(B
88 Telecom 电信 xxh(VQdg
89 Thermal Information 热性能信息 +)4_1i4"x
90 thermal slug 散热片 gL+8fX2G6
91 Threshold 阈值 C=6 Vd
92 timing resistor 振荡电阻 $6a55~h|(
93 Top FET Top FET ?6gC;B
94 Trace 线路,走线,引线 (bk~,n_
95 Transfer function 传递函数 #Cda8)jl(
96 Trip Point 跳变点 nZbfc;da
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 6jiz$x
98 Under Voltage Lock Out (UVLO) 欠压锁定 %hzl3>().
99 Voltage Reference 电压参考 ~97T0{E3
100 voltage-second product 伏秒积 `eat7O
101 zero-pole frequency compensation 零极点频率补偿 {VPF2JFB[
102 beat frequency 拍频 0#
D4;v
103 one shots 单击电路 tU02t#8
104 scaling 缩放 ptXLWv`
105 ESR 等效串联电阻 [Page] (dxkDS-G
106 Ground 地电位 h-Q3q:
107 trimmed bandgap 平衡带隙 ugtb`d{ Sl
108 dropout voltage 压差 Pd@y+|
109 large bulk capacitance 大容量电容 e{~s\G8g
110 circuit breaker 断路器 p
xrd D7
111 charge pump 电荷泵
2L~[dn.s
112 overshoot 过冲 %Bo/vB'
[WDtr8L
印制电路printed circuit I|?zSFa
印制线路 printed wiring }>\+eG
印制板 printed board XAV|xlfm
印制板电路 printed circuit board .6yC' 3~;o
印制线路板 printed wiring board iD)R*vnAi
印制元件 printed component 8kz7*AO
印制接点 printed contact LY%`O#i.
印制板装配 printed board assembly wD-(3ZVd4
板 board }\E2Z[
刚性印制板 rigid printed board \lVxlc0{?
挠性印制电路 flexible printed circuit F)mlCGv:R
挠性印制线路 flexible printed wiring 85P7I=`*d
齐平印制板 flush printed board %,-oxeM1u
金属芯印制板 metal core printed board 51Yq>'8
金属基印制板 metal base printed board }5Yd:%u5
多重布线印制板 mulit-wiring printed board Nb2]}; O
塑电路板 molded circuit board }|
BnG"8
散线印制板 discrete wiring board Tz H*?bpP
微线印制板 micro wire board ho#]i$b}f2
积层印制板 buile-up printed board L`%v#R
表面层合电路板 surface laminar circuit sEj?,1jk
埋入凸块连印制板 B2it printed board tl |Qw";I
载芯片板 chip on board Dz4fP;n
埋电阻板 buried resistance board ALqP;/
母板 mother board \Lxsg!wtJ
子板 daughter board zT[[WY4
背板 backplane -MrEJ
裸板 bare board P>/n!1c
键盘板夹心板 copper-invar-copper board 0p\cDrB?
动态挠性板 dynamic flex board 6mr5`5~w
静态挠性板 static flex board 1=x4m=wV
可断拼板 break-away planel ;6g &_6
电缆 cable ,}i`1E 1=
挠性扁平电缆 flexible flat cable (FFC) rmj?jBKQU
薄膜开关 membrane switch 3+gp_7L
混合电路 hybrid circuit 9*gD;) !
厚膜 thick film aZGX`;3
厚膜电路 thick film circuit #M;Cw}pW
薄膜 thin film }R#YO$J7
薄膜混合电路 thin film hybrid circuit q(0V#kKC
互连 interconnection q| p6UL9
导线 conductor trace line yDBS :
\
齐平导线 flush conductor -EV_=a8[y
传输线 transmission line l`x;Og>a
跨交 crossover ZzA4iT=KO
板边插头 edge-board contact 9/[3xhB4
增强板 stiffener HE911 lc:
基底 substrate tSK{Abw1B
基板面 real estate =vxiqRm
导线面 conductor side IP'gN-#i
元件面 component side ", b}-B
焊接面 solder side qF m=(J%
导电图形 conductive pattern H"8fnN=xB
非导电图形 non-conductive pattern Zi47)8
基材 base material rtr0 d
层压板 laminate ?[>+'6
覆金属箔基材 metal-clad bade material VkCv`E
覆铜箔层压板 copper-clad laminate (CCL) nlaJ
复合层压板 composite laminate G<9UL*HU
薄层压板 thin laminate trL:qD+{(
基体材料 basis material \M>}-j`v
预浸材料 prepreg tmF->~|
粘结片 bonding sheet uop|8n1
预浸粘结片 preimpregnated bonding sheer iJ
HOLz"!
环氧玻璃基板 epoxy glass substrate `RUOZ@r
预制内层覆箔板 mass lamination panel /PbN!r<1
内层芯板 core material Z)cGe1?q
粘结层 bonding layer h~rSM#7m
粘结膜 film adhesive |,c\R"8xS
无支撑胶粘剂膜 unsupported adhesive film ?9#}p
覆盖层 cover layer (cover lay) B`,4M&
增强板材 stiffener material w 8M,35b
铜箔面 copper-clad surface c`w YQUg(
去铜箔面 foil removal surface *C*n (the
层压板面 unclad laminate surface V=}AFGC85
基膜面 base film surface |IL..C
胶粘剂面 adhesive faec Iuk!A?XV
原始光洁面 plate finish |T: 'G
粗面 matt finish t><AaYij_
剪切板 cut to size panel X_Vj&{
超薄型层压板 ultra thin laminate / $7E
A阶树脂 A-stage resin
r=YprVX
B阶树脂 B-stage resin ;`IZ&m$
C阶树脂 C-stage resin Y#Pl)sRr
环氧树脂 epoxy resin QEIu}e6b
酚醛树脂 phenolic resin q1QrtJFPG
聚酯树脂 polyester resin z>$AZ>t%J$
聚酰亚胺树脂 polyimide resin *I7$\0Q
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin A7!!kR":
丙烯酸树脂 acrylic resin >D'Kt?L<]m
三聚氰胺甲醛树脂 melamine formaldehyde resin U JO
多官能环氧树脂 polyfunctional epoxy resin 6j9P`#Lt
溴化环氧树脂 brominated epoxy resin 8Qtd,
环氧酚醛 epoxy novolac )*_4=-8H
氟树脂 fluroresin ).HYW _Yih
硅树脂 silicone resin dZ'hTzw~
硅烷 silane HhkubG)\
聚合物 polymer zb/w^~J_i
无定形聚合物 amorphous polymer ^s<p5V
结晶现象 crystalline polamer cl s-x@
Kd
双晶现象 dimorphism o<T_Pjp
共聚物 copolymer z.itVQs$I
合成树脂 synthetic YGb&mD
热固性树脂 thermosetting resin [Page] %,Fx qw
热塑性树脂 thermoplastic resin _+z5~6>
感光性树脂 photosensitive resin /L,VZ?CmtK
环氧值 epoxy value "]|I;I"b
双氰胺 dicyandiamide 4#H~g
@
粘结剂 binder C]{:>= K
胶粘剂 adesive ^|KX)g
固化剂 curing agent pq0F!XmU
阻燃剂 flame retardant "Xq.b"N{*
遮光剂 opaquer HS!O;7s'
增塑剂 plasticizers /lBx}o'
不饱和聚酯 unsatuiated polyester 595P04
聚酯薄膜 polyester L$*sv.
聚酰亚胺薄膜 polyimide film (PI) )sg@HFhY'
聚四氟乙烯 polytetrafluoetylene (PTFE) Qx,jUL#2
增强材料 reinforcing material Zr`pOUk!4
折痕 crease H% c:f
云织 waviness "_Wv,CYmNr
鱼眼 fish eye XBi}hT
毛圈长 feather length '{9nQDgT
厚薄段 mark 4f+R}Ee7
裂缝 split 9Tbi_6[
捻度 twist of yarn Cf#[E~2 4
浸润剂含量 size content `em}vdY
浸润剂残留量 size residue J)R;NYl
处理剂含量 finish level >gNVL
(
偶联剂 couplint agent 0. _)X
断裂长 breaking length sYlA{Z"
吸水高度 height of capillary rise Q)}_S@v|%
湿强度保留率 wet strength retention 9Yg=4>#$
白度 whitenness <4!SQgL
导电箔 conductive foil e)I-|Q4^%
铜箔 copper foil ]mEY/)~7
压延铜箔 rolled copper foil Vo*38c2
光面 shiny side V>
K
sbPqR
粗糙面 matte side We]mm3M3
处理面 treated side vvEr}G
防锈处理 stain proofing ,U9gg-.Lp
双面处理铜箔 double treated foil Q9v
OY8
模拟 simulation ^(5Up=.EA
逻辑模拟 logic simulation v`i9LD0(
电路模拟 circit simulation [wS~.
时序模拟 timing simulation 4N&4TUIM
模块化 modularization +
k1|+zzS
设计原点 design origin 8sm8L\-
优化(设计) optimization (design) ZuV/!9qU
供设计优化坐标轴 predominant axis ,A`.u \f(:
表格原点 table origin Un{hI`3]
元件安置 component positioning !F3Y7R
比例因子 scaling factor `Oxo@G*@}W
扫描填充 scan filling mx`C6G5
矩形填充 rectangle filling HFV4S]U=
填充域 region filling V[&4Km9C
实体设计 physical design (7 i@@
逻辑设计 logic design D@:w/W
逻辑电路 logic circuit ZMs$C3
层次设计 hierarchical design ,dhSc<:LT
自顶向下设计 top-down design R7xKVS_MP
自底向上设计 bottom-up design iC]=S}
费用矩阵 cost metrix {<f_,Nlc
元件密度 component density # fvt:iE
自由度 degrees freedom *`
}Rt
出度 out going degree .<Y7,9;YEF
入度 incoming degree Rlvb@aXgy
曼哈顿距离 manhatton distance o&tETJ5Bhe
欧几里德距离 euclidean distance b(<#n6a}\
网络 network H=2sT +Sp
阵列 array dW
hU
o\>=
段 segment :q6j{C(
逻辑 logic di^E8egR$
逻辑设计自动化 logic design automation wvH=4TT=w"
分线 separated time EA@p]+P
分层 separated layer Jb.
V4
定顺序 definite sequence DIx!Sw7EC
导线(通道) conduction (track) TiiMX
导线(体)宽度 conductor width :__z?<?(
导线距离 conductor spacing [ 0?*J<d
导线层 conductor layer RLuA^ONI
导线宽度/间距 conductor line/space w}*2Hz&Q!
第一导线层 conductor layer No.1 W(
O)J$j
圆形盘 round pad Uy8r
!9O
方形盘 square pad Ko6>h
菱形盘 diamond pad *;(wtMg
长方形焊盘 oblong pad 4`(b(DL]
子弹形盘 bullet pad !JZ)6mtlr
泪滴盘 teardrop pad _ ^5w f
雪人盘 snowman pad 0Q\6GCzN\
形盘 V-shaped pad V
Tk(ciwB
环形盘 annular pad E1p?v!
非圆形盘 non-circular pad +&t`"lRl&
隔离盘 isolation pad GEJEhwO;H
非功能连接盘 monfunctional pad >lZ9Y{Y4v
偏置连接盘 offset land @9yY`\"ed
腹(背)裸盘 back-bard land @m*^v\q<u
盘址 anchoring spaur R*m=V{iu`
连接盘图形 land pattern
Yxe%:
连接盘网格阵列 land grid array |UA)s3Uhxb
孔环 annular ring D]NfA2B7
元件孔 component hole >]DnEF&
安装孔 mounting hole & ,KxE(C
支撑孔 supported hole +Usy
非支撑孔 unsupported hole P2lDi!q|
导通孔 via IhIPy~Hgt
镀通孔 plated through hole (PTH) u 3&9R)J1
余隙孔 access hole _0Mt*]L }
盲孔 blind via (hole) "?_r?~sJx
埋孔 buried via hole 9NX/OctFa'
埋,盲孔 buried blind via aTJs.y-I~
任意层内部导通孔 any layer inner via hole 3v oas
全部钻孔 all drilled hole *{}Y
:
定位孔 toaling hole f@:.bp8VB8
无连接盘孔 landless hole 8KQD
w:
中间孔 interstitial hole }jF67c->
无连接盘导通孔 landless via hole lRIS&9vA3
引导孔 pilot hole |$Y0VC4a
端接全隙孔 terminal clearomee hole "RZVv~BD
准尺寸孔 dimensioned hole [Page] 'IR2H{Q
在连接盘中导通孔 via-in-pad (%`R{Y
孔位 hole location @@&([f
孔密度 hole density &y164xn'h
孔图 hole pattern 9eA2v{!S
钻孔图 drill drawing <{
Z$!]i1
装配图assembly drawing r-Nv<oH;
参考基准 datum referan IaDN[:SX
1) 元件设备 Rd 4
z+G
A^ :/*
三绕组变压器:three-column transformer ThrClnTrans t-, =sV
双绕组变压器:double-column transformer DblClmnTrans *b<
a@
电容器:Capacitor jrOqspv
并联电容器:shunt capacitor :fxG]uf-P
电抗器:Reactor ;cye
'E
母线:Busbar jHP6d =
输电线:TransmissionLine VR/*h%
发电厂:power plant }ioHSkCD
断路器:Breaker #M9rt~4
刀闸(隔离开关):Isolator qB%?t.k7
分接头:tap Tc{n]TV
电动机:motor FZUN*5`
(2) 状态参数 @wzzI 7}C
OPYl#3I
有功:active power D7|=ev
无功:reactive power @zz4,,]
电流:current _trF /U<
容量:capacity 85QVj] nr
电压:voltage UK{6Rh ;
档位:tap position dZSv=UY)
有功损耗:reactive loss R~=_,JUW
无功损耗:active loss =TTk5(m
功率因数:power-factor 38I .1p9
功率:power /FP;Hsw%
功角:power-angle dI[hQxU
电压等级:voltage grade "r:i
空载损耗:no-load loss $i:wS=
w'
铁损:iron loss ^xBF$ua37)
铜损:copper loss YlF<S49loC
空载电流:no-load current :n@j"-HA
阻抗:impedance `^mPq?f
正序阻抗:positive sequence impedance =\t%U5
负序阻抗:negative sequence impedance i4',d#
零序阻抗:zero sequence impedance n0/H2>I[
电阻:resistor ?1+JBl~/d
电抗:reactance E{Gkq:
电导:conductance 9:JFG{M
电纳:susceptance aGl*h"&
无功负载:reactive load 或者QLoad 2}NWFM3C
有功负载: active load PLoad oNkASAd
遥测:YC(telemetering) qHAZ)Tz
遥信:YX zc}qAy'<
励磁电流(转子电流):magnetizing current t[L_n m5-
定子:stator @xO?SjH
功角:power-angle N2 vA/
上限:upper limit aJQx"6c?
下限:lower limit R a> k#pQ
并列的:apposable T7wy{;
高压: high voltage ~^6[SbVb
低压:low voltage qIO<\Yl
中压:middle voltage 'aq9]D_k
电力系统 power system 1XwW4cZ>:
发电机 generator & o2F4
励磁 excitation B4/0t:^I
励磁器 excitor UG]]Vk1d]
电压 voltage yB>5p]$P
电流 current 3!+N}[$iy
母线 bus x_C#ALq9
变压器 transformer u{H'evv0O
升压变压器 step-up transformer m|7lDfpb
高压侧 high side !I7bxDzK$
输电系统 power transmission system Usa
输电线 transmission line ftL>oOz[
固定串联电容补偿fixed series capacitor compensation X2Z
E9b
稳定 stability -T
s8y
电压稳定 voltage stability (c'=jJX
功角稳定 angle stability Sxj _gn
暂态稳定 transient stability rO_|_nV[
电厂 power plant
IjK
能量输送 power transfer v7V.,^6+
交流 AC Mp8FYPjZ
装机容量 installed capacity FXAP]iqo
电网 power system SP&Y|I$:
落点 drop point &_DRrp0CN
开关站 switch station Rk1B \L|M
双回同杆并架 double-circuit lines on the same tower ;yc|=I^
变电站 transformer substation l7.W2mg
补偿度 degree of compensation @V9qbr=Z
高抗 high voltage shunt reactor Ab"mX0n
无功补偿 reactive power compensation OG M9e!
故障 fault Cb{n4xKW6
调节 regulation P3due|4M
裕度 magin !uC`7a
三相故障 three phase fault af:wg]g
故障切除时间 fault clearing time UUzu`>upB
极限切除时间 critical clearing time z3RlD"F1
切机 generator triping np>RxiB^
高顶值 high limited value l~Em2@c
强行励磁 reinforced excitation v}$s,j3NO
线路补偿器 LDC(line drop compensation) v(HCnC
机端 generator terminal dHcGe{T^(
静态 static (state) rm-6Az V
动态 dynamic (state) ]h
Dy]
单机无穷大系统 one machine - infinity bus system c:a5pd7T
机端电压控制 AVR Esc*+}ck
电抗 reactance jq4'=L$4
电阻 resistance Is87
9_Z
功角 power angle ~7N>tjB
有功(功率) active power D^E+#a 1
无功(功率) reactive power l c<&f
功率因数 power factor LPg1 G+e
无功电流 reactive current jslfq@5v
下降特性 droop characteristics 5`ma#_zk|f
斜率 slope wU\3"!^h
额定 rating o9tvf|+z
变比 ratio tRqg')y
参考值 reference value Jb~nu
电压互感器 PT )u. ut8![T
分接头 tap `7;I*|
下降率 droop rate *-!&5~o/U
仿真分析 simulation analysis \2rCT~x
传递函数 transfer function 7[V6@K!Al[
框图 block diagram .kBZ(`K
受端 receive-side &DqeO8?Q
裕度 margin "hwG"3n1
同步 synchronization ;'o:1{Y
失去同步 loss of synchronization C,+Sv-
阻尼 damping @ =RH_NB
摇摆 swing wYf9&}k\4
保护断路器 circuit breaker YWfw%p?n"
电阻:resistance IZ2c<B5&
电抗:reactance (I bT5
阻抗:impedance uW.)(l
电导:conductance ^,Sl^ 9K
电纳:susceptance