1 backplane 背板 G )trG9 .a
2 Band gap voltage reference 带隙电压参考 0KcyLAJ
3 benchtop supply 工作台电源 3G)#5Lf<
4 Block Diagram 方块图 5 Bode Plot 波特图 jrlVvzZ
6 Bootstrap 自举 Jr
,;>
7 Bottom FET Bottom FET h-#6av:
8 bucket capcitor 桶形电容 QT<
}]
0
9 chassis 机架 nQX:T;WL@
10 Combi-sense Combi-sense *8yAG]z
11 constant current source 恒流源 0neoE
E
12 Core Sataration 铁芯饱和 h5{'Q$Erl
13 crossover frequency 交叉频率 j^j1
14 current ripple 纹波电流 * J7DY f
15 Cycle by Cycle 逐周期 H1pO!>M
16 cycle skipping 周期跳步 \Xt7`I<
17 Dead Time 死区时间 +qtJaYf/0
18 DIE Temperature 核心温度 dUeN*Nq&(,
19 Disable 非使能,无效,禁用,关断 %Q__!D[
20 dominant pole 主极点 RE7?KR>
21 Enable 使能,有效,启用 $<dH?%!7
22 ESD Rating ESD额定值 Z58X5"
23 Evaluation Board 评估板 {3>$[bT
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Yh@JXJ>
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ITE{@1
25 Failling edge 下降沿 4C6YO
26 figure of merit 品质因数 qOIyub
27 float charge voltage 浮充电压 )0.kv2o.
28 flyback power stage 反驰式功率级 Sxt"B
29 forward voltage drop 前向压降
acajHs
30 free-running 自由运行 ="1Ind@w!
31 Freewheel diode 续流二极管 fa
jGZyd0:
32 Full load 满负载 33 gate drive 栅极驱动 <$A
34 gate drive stage 栅极驱动级 Q04al=
35 gerber plot Gerber 图 VZp5)-!\
36 ground plane 接地层 ''A_[J `>
37 Henry 电感单位:亨利 /kZebNf6H
38 Human Body Model 人体模式 YFLZ %(
39 Hysteresis 滞回 dc+>m,3$
40 inrush current 涌入电流 &&5aM
41 Inverting 反相 BA @lk+aW
42 jittery 抖动 *<$*"p
43 Junction 结点 L4@K~8j7
44 Kelvin connection 开尔文连接 bQzZy5,
45 Lead Frame 引脚框架 f&NgS+<K$
46 Lead Free 无铅 GL>O4S<`
47 level-shift 电平移动 Hck]aKI+
48 Line regulation 电源调整率 2jA {SY-
49 load regulation 负载调整率 /7(W?xOe
50 Lot Number 批号 ^rB8? kt
51 Low Dropout 低压差 _>o:R$ %}
52 Miller 密勒 53 node 节点 -vAC"8)S
54 Non-Inverting 非反相 prUN)r@U
55 novel 新颖的 #>a\>iKQ2q
56 off state 关断状态 ")1:F>
57 Operating supply voltage 电源工作电压 ^)470K`%)
58 out drive stage 输出驱动级 2,y|EpG#
59 Out of Phase 异相 vRYQ{:
60 Part Number 产品型号 k`cfG\;r
61 pass transistor pass transistor <X#C)-.
62 P-channel MOSFET P沟道MOSFET 9sM!`Lz{
63 Phase margin 相位裕度 1>.Ev,X+e
64 Phase Node 开关节点 "syI#U{
65 portable electronics 便携式电子设备 A\*>TN>s
66 power down 掉电 ;_XFo&@
67 Power Good 电源正常 FBG4pb9=~
68 Power Groud 功率地 b35fs]}u-6
69 Power Save Mode 节电模式 #]-SJWf3
70 Power up 上电
>^O7
71 pull down 下拉 !@5 9)
72 pull up 上拉 1wii8B6
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) zWnX*2>b
74 push pull converter 推挽转换器 `T1
75 ramp down 斜降 6u?>M9
76 ramp up 斜升 ),_@WW;k
77 redundant diode 冗余二极管
)| ccX
78 resistive divider 电阻分压器 9FF0%*tGo
79 ringing 振 铃 "BAK !N$9
80 ripple current 纹波电流 SA:Zc^aV
81 rising edge 上升沿 2bz2KB5>
82 sense resistor 检测电阻 oE6tauQn
83 Sequenced Power Supplys 序列电源 2y75
84 shoot-through 直通,同时导通 )',R[|<
85 stray inductances. 杂散电感 fT|.@%"vc
86 sub-circuit 子电路 z>xmRs
87 substrate 基板 ~"gA,e-)
88 Telecom 电信 :S]%6gb8G
89 Thermal Information 热性能信息 b\f
O8{k
90 thermal slug 散热片 VCYwzB
91 Threshold 阈值 ]U?^hZ_
92 timing resistor 振荡电阻 XoK:N$\}t
93 Top FET Top FET *YI98
94 Trace 线路,走线,引线 VD AaYDi
95 Transfer function 传递函数 3F"lXguS
96 Trip Point 跳变点 D'>_I.
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) BX/8O<s0
98 Under Voltage Lock Out (UVLO) 欠压锁定 T}Tp$.gB
99 Voltage Reference 电压参考 i%iL[id:w
100 voltage-second product 伏秒积 !"AvY y9
101 zero-pole frequency compensation 零极点频率补偿 E#34Wh2z
102 beat frequency 拍频 k:i4=5^*GX
103 one shots 单击电路 E*&vy
104 scaling 缩放 >fG3K`
105 ESR 等效串联电阻 [Page] :]K4KFM
106 Ground 地电位 _~m5^Q&
107 trimmed bandgap 平衡带隙 2y\E[j A
108 dropout voltage 压差 umBICC]CU
109 large bulk capacitance 大容量电容 J`Q>3]wL
110 circuit breaker 断路器 iO$8:mxm0?
111 charge pump 电荷泵 ^S<Y>Nm]
112 overshoot 过冲 r+!YIk
$QF{iV@6d4
印制电路printed circuit ,]C;sN%~}
印制线路 printed wiring `cn#B
BV
印制板 printed board
x^qVw5{n
印制板电路 printed circuit board nUr5Qn?
印制线路板 printed wiring board ?PxP% $hS
印制元件 printed component KM0ru
印制接点 printed contact lgAoJ[
印制板装配 printed board assembly yf)%%&
板 board 0JS?; fk
刚性印制板 rigid printed board X #dmo/L8
挠性印制电路 flexible printed circuit M7\szv\Zc=
挠性印制线路 flexible printed wiring TprTWod2]t
齐平印制板 flush printed board # +>oZWVc
金属芯印制板 metal core printed board G>_*djUf
金属基印制板 metal base printed board +QavYqPF
多重布线印制板 mulit-wiring printed board YMyfL8bO
塑电路板 molded circuit board ]! &FKy
散线印制板 discrete wiring board tFn)aa~L
微线印制板 micro wire board (# c*M?g3
积层印制板 buile-up printed board V-P#1Kkh
表面层合电路板 surface laminar circuit 9=M$AB
埋入凸块连印制板 B2it printed board !TH)
+zi
载芯片板 chip on board SR
hiQ
埋电阻板 buried resistance board @7c?xQVd$
母板 mother board 6wRd<]C
子板 daughter board l4YbK np]
背板 backplane 0o4XUW
裸板 bare board g-k|>-h
键盘板夹心板 copper-invar-copper board 7+cO_3AB
动态挠性板 dynamic flex board qwcD`HV,
静态挠性板 static flex board xu%k~4cB,
可断拼板 break-away planel =Bey gT^
电缆 cable zk+9'r`-D
挠性扁平电缆 flexible flat cable (FFC) -ad{tJV|
薄膜开关 membrane switch ;1=1:S8
混合电路 hybrid circuit gg/-k;@ Rf
厚膜 thick film nF:4}qy\
厚膜电路 thick film circuit 3`?7<YJ
薄膜 thin film M0"_^?
薄膜混合电路 thin film hybrid circuit V &T~zh1
互连 interconnection 'oVx#w^mf
导线 conductor trace line W
i.&e
齐平导线 flush conductor >6-`}G+|
传输线 transmission line ty!`T+3
跨交 crossover (lqC[:
板边插头 edge-board contact 6|=f$a
增强板 stiffener e%M;?0j
基底 substrate 2tO,dx
基板面 real estate KF}hV9IU
导线面 conductor side = svN#q5s
元件面 component side 1GRCV8"Z^
焊接面 solder side >'$Mp <
导电图形 conductive pattern (WJRi:NP?
非导电图形 non-conductive pattern t?gic9
q
基材 base material r5/0u(\LB
层压板 laminate s8Q 5ui]
覆金属箔基材 metal-clad bade material qR{=pR
覆铜箔层压板 copper-clad laminate (CCL) Z{d^-
复合层压板 composite laminate J;e2&gB
薄层压板 thin laminate n@i HFBb
基体材料 basis material dT8S~-d%
预浸材料 prepreg Q&;9x? e
粘结片 bonding sheet _[3D
预浸粘结片 preimpregnated bonding sheer $%Kfq[Q
环氧玻璃基板 epoxy glass substrate ^
@5QP$.
预制内层覆箔板 mass lamination panel 3"i-o$P
内层芯板 core material 0d&6lqTo
粘结层 bonding layer )&O
%*@F
粘结膜 film adhesive 3$R1ipb
无支撑胶粘剂膜 unsupported adhesive film RqrdAkg
覆盖层 cover layer (cover lay) x9g#<2w8
增强板材 stiffener material dn3y\
铜箔面 copper-clad surface ki!0^t:9
去铜箔面 foil removal surface q9_OGd|P
层压板面 unclad laminate surface ;^*W+,4WB
基膜面 base film surface ?`ZUR&
20
胶粘剂面 adhesive faec tWRC$
原始光洁面 plate finish u6agoK|^9
粗面 matt finish S\=Nn7"
剪切板 cut to size panel eauF~md,
超薄型层压板 ultra thin laminate zF<R'XP
A阶树脂 A-stage resin ~?BXti<!
B阶树脂 B-stage resin bG#>uE J-
C阶树脂 C-stage resin ~>|ziHx
环氧树脂 epoxy resin Rm( "=(
酚醛树脂 phenolic resin e"<OELA
聚酯树脂 polyester resin L8B!u9%
聚酰亚胺树脂 polyimide resin bH~dJFj/
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 7<R E_/]
丙烯酸树脂 acrylic resin WsB ?C&>x
三聚氰胺甲醛树脂 melamine formaldehyde resin ZECfR>`x
多官能环氧树脂 polyfunctional epoxy resin Z T%5T}i
溴化环氧树脂 brominated epoxy resin M= (u]%\
环氧酚醛 epoxy novolac })%{AfDRF
氟树脂 fluroresin upmx $H>
硅树脂 silicone resin <hyKu
硅烷 silane gbA_DZ
聚合物 polymer 6gDN`e,@
无定形聚合物 amorphous polymer ^2rN>k,?
结晶现象 crystalline polamer
J&_n9$
双晶现象 dimorphism @0''k
共聚物 copolymer 8s@3hXD&
合成树脂 synthetic (bS&D/N.
热固性树脂 thermosetting resin [Page] d=/F}yP~?s
热塑性树脂 thermoplastic resin "AqB$^S9t
感光性树脂 photosensitive resin sI2^Qp@O1
环氧值 epoxy value c:('W16
双氰胺 dicyandiamide <P<z N~i9j
粘结剂 binder c+ie8Q!
胶粘剂 adesive i|kRK7[6B
固化剂 curing agent *T1_;4i
阻燃剂 flame retardant x+]"
遮光剂 opaquer (9)Q ' 'S
增塑剂 plasticizers 4+tEFxvX&
不饱和聚酯 unsatuiated polyester Z\sDUJ
聚酯薄膜 polyester zt%Mx>V@
聚酰亚胺薄膜 polyimide film (PI) K
8O|?x]
聚四氟乙烯 polytetrafluoetylene (PTFE) yhJ@(tu.Gd
增强材料 reinforcing material \U_@S.
折痕 crease !VpoZ
云织 waviness W,u:gzmhw
鱼眼 fish eye j8gdlIx
毛圈长 feather length K sCyFp
厚薄段 mark \M-OC5fQv
裂缝 split HaYo!.(Fv
捻度 twist of yarn 7HWmCaa[
浸润剂含量 size content \2z>?i)
浸润剂残留量 size residue }m8q}~>tL
处理剂含量 finish level y{Q
{'De
偶联剂 couplint agent a q-~B~c`g
断裂长 breaking length I^]nqK
吸水高度 height of capillary rise ^zr`;cJ+c
湿强度保留率 wet strength retention /wv0i3_e
白度 whitenness gGuO
导电箔 conductive foil EM_d8o)`B
铜箔 copper foil !x)R=Z/C
压延铜箔 rolled copper foil .)3 <Q}>
光面 shiny side (m$Y<{)2
粗糙面 matte side Nboaf
处理面 treated side \U0'P;em
防锈处理 stain proofing SX#&5Ka/
双面处理铜箔 double treated foil N>E_%]C h
模拟 simulation u&e~1?R
逻辑模拟 logic simulation {{1G`;|v9
电路模拟 circit simulation G/W>S,(
时序模拟 timing simulation g2]Qv@nxw
模块化 modularization 6~+emlD
设计原点 design origin (?];VG
优化(设计) optimization (design) @+DX.9
供设计优化坐标轴 predominant axis bMBLXk
表格原点 table origin MfkZ
元件安置 component positioning z!\*Y
=e
比例因子 scaling factor 62u4-}JzF
扫描填充 scan filling "jCu6Rj d
矩形填充 rectangle filling ,//S`j$S
填充域 region filling M\=2uKG#
实体设计 physical design L.IlBjD
逻辑设计 logic design @nf`Gw ;
逻辑电路 logic circuit DwF hK*
层次设计 hierarchical design M%#e1"n
自顶向下设计 top-down design b Zt3|
自底向上设计 bottom-up design ?ubro0F:
费用矩阵 cost metrix =c7;r]Ol
元件密度 component density B<-Wea
自由度 degrees freedom 7z-[f'EIUI
出度 out going degree ,?3G;-
入度 incoming degree ;kK/_%gN-G
曼哈顿距离 manhatton distance 05[SC}MCA
欧几里德距离 euclidean distance Dh*n!7lD`
网络 network T0
{L q:
阵列 array @pxcpXCy
段 segment Js;h%
逻辑 logic }\LQ3y"[
逻辑设计自动化 logic design automation W>LR\]Ti@
分线 separated time snJ129}A
分层 separated layer > P)w?:k
定顺序 definite sequence #/]nxW.S
导线(通道) conduction (track) =Sv/IXX\di
导线(体)宽度 conductor width [
3HfQ
导线距离 conductor spacing olcDt&xv]
导线层 conductor layer Q.[0ct
导线宽度/间距 conductor line/space @@%ataUSBT
第一导线层 conductor layer No.1 dRDnJc3
圆形盘 round pad a9 G8q>h]O
方形盘 square pad ww/Uzv
菱形盘 diamond pad _Y!IEAU/#
长方形焊盘 oblong pad *](iS
子弹形盘 bullet pad _j3f Ar(V
泪滴盘 teardrop pad 1"g<0
W
雪人盘 snowman pad a
=QCp4^
形盘 V-shaped pad V :%.D78&
环形盘 annular pad ]-q;4.
非圆形盘 non-circular pad ;aBG,dr}i
隔离盘 isolation pad #S(Hd?34,
非功能连接盘 monfunctional pad &o*A{
偏置连接盘 offset land 40/Y\
腹(背)裸盘 back-bard land '%D7C=;^
盘址 anchoring spaur Y7aqO5
连接盘图形 land pattern /\Ef%@
连接盘网格阵列 land grid array Z7#+pPt!
孔环 annular ring /ouPg=+Nl
元件孔 component hole _^;Z~/.
安装孔 mounting hole >bxS3FCX
支撑孔 supported hole ~`/V(r;o
非支撑孔 unsupported hole 9FvFhY
导通孔 via rZF*q2?
镀通孔 plated through hole (PTH) ;r8X.>P*
余隙孔 access hole gSgr6TH0
盲孔 blind via (hole) <UI
[%yXj
埋孔 buried via hole @oNXZRg6
埋,盲孔 buried blind via nu^436MSOa
任意层内部导通孔 any layer inner via hole >Q/Dk7 #
全部钻孔 all drilled hole :U\tv[
定位孔 toaling hole >7FHo-H/T
无连接盘孔 landless hole p 'k0#R$
中间孔 interstitial hole =vPj%oLp'a
无连接盘导通孔 landless via hole *#2h/Q.
引导孔 pilot hole FlQGgVN
端接全隙孔 terminal clearomee hole \!(zrfP{(
准尺寸孔 dimensioned hole [Page] >sF)BoLc
在连接盘中导通孔 via-in-pad BWNi [^]
孔位 hole location i1085ztN
孔密度 hole density 5N]"~w*
孔图 hole pattern i@q&5;%%
钻孔图 drill drawing 6LZCgdS{
装配图assembly drawing $j~RWfw-
参考基准 datum referan 0"R|..l/
1) 元件设备 z{543~Og59
Pfh mo $
三绕组变压器:three-column transformer ThrClnTrans 3R/bz0 V>
双绕组变压器:double-column transformer DblClmnTrans 6b,V;#Anj
电容器:Capacitor SJLis"8
并联电容器:shunt capacitor JC"z&ka
电抗器:Reactor :3PH8TL
母线:Busbar yauvXosX
输电线:TransmissionLine ]|@^1we
发电厂:power plant +_!QSU,@
断路器:Breaker + 3gp%`c4
刀闸(隔离开关):Isolator }\f0 A-
分接头:tap #4:?gfIj
电动机:motor Ef\-VKh
(2) 状态参数 $qiya[&G4
_`V'r#Qn
有功:active power wzA$'+Mb
无功:reactive power ~o(
电流:current NbobliC=
容量:capacity 4*L_)z&4;
电压:voltage F
[M,]?
档位:tap position 6863xOv{T
有功损耗:reactive loss \+etCo
无功损耗:active loss `uFdwO'DD
功率因数:power-factor !1k_PY5)
功率:power sK{e*[I>W
功角:power-angle 8}[).d160
电压等级:voltage grade dG{A~Z z
空载损耗:no-load loss :h$$J
lP
铁损:iron loss IPk4
;,
铜损:copper loss ixFi{_
空载电流:no-load current osRy e3
阻抗:impedance 8y L Y
正序阻抗:positive sequence impedance 3mgD(,(^
负序阻抗:negative sequence impedance BLttb
零序阻抗:zero sequence impedance G2D$aSh
电阻:resistor x4 yR8n(
电抗:reactance \<' ?8ri#
电导:conductance Ie_wHcM<
电纳:susceptance vt8By@]:
无功负载:reactive load 或者QLoad ~ a:
有功负载: active load PLoad qna8|3eP
遥测:YC(telemetering) NOva'qk
遥信:YX UVP vOtZj
励磁电流(转子电流):magnetizing current tA;}h7/Lc~
定子:stator \e;iT\=.(
功角:power-angle WcAkCH!L
上限:upper limit J zl6eo[;
下限:lower limit fVlB=8DNk&
并列的:apposable ^sw?gH*
高压: high voltage 0S"MC9beg
低压:low voltage icgfB-1|i
中压:middle voltage z_HdISy0
电力系统 power system #e"[^_C@!
发电机 generator AH^/V}9H
励磁 excitation d0D]Q
励磁器 excitor rp$'L7lrX
电压 voltage ;pAK_>
电流 current Ac@VGT:9
母线 bus qPNR`%}Q
变压器 transformer OXA7w.^
升压变压器 step-up transformer TOt dUO
高压侧 high side
];m_4
输电系统 power transmission system L0,'mS
输电线 transmission line 3`g^
固定串联电容补偿fixed series capacitor compensation =bOW~0Z1
稳定 stability fC`&g~yK'
电压稳定 voltage stability m0wDX*Qn
功角稳定 angle stability **%37
暂态稳定 transient stability T)/eeZ$
电厂 power plant fhiM U8(&
能量输送 power transfer ^q5#ihM
交流 AC afVT~Sf{
装机容量 installed capacity HPl<%%TI
电网 power system Z@HEj_n
落点 drop point B#A6v0Ta
开关站 switch station 9[4xFE?|
双回同杆并架 double-circuit lines on the same tower e'~3oqSvR
变电站 transformer substation c 9Mz]1@f
补偿度 degree of compensation ?,z}%p
高抗 high voltage shunt reactor Nn6%9PX_)
无功补偿 reactive power compensation J.a]K[ci
故障 fault )=+|i3]U
调节 regulation Gc?a +T
裕度 magin MgZ/(X E
三相故障 three phase fault -).C
故障切除时间 fault clearing time \bXa&Lq
极限切除时间 critical clearing time Rq -ZL{LR7
切机 generator triping 203s^K61
高顶值 high limited value }f ?y*
H
强行励磁 reinforced excitation ).O)p9
线路补偿器 LDC(line drop compensation) _`X:jj>
机端 generator terminal WJi]t9 3
静态 static (state) kh<2BOV
动态 dynamic (state) Ry&6p>-
单机无穷大系统 one machine - infinity bus system P}iE+Z3
机端电压控制 AVR !WlH'y-I
电抗 reactance 4+n\k
电阻 resistance gYj'(jB
功角 power angle 637:
oT_`O
有功(功率) active power g(g& TO
无功(功率) reactive power \8tsDG(1 '
功率因数 power factor +ZYn? #IQ
无功电流 reactive current )oZ dj`
下降特性 droop characteristics f$( e\++
斜率 slope buC{r,
额定 rating f1? >h\F8
变比 ratio A&{Nh` q
参考值 reference value =N@t'fOr
电压互感器 PT CTK;dM'uQ
分接头 tap k)u[0}
下降率 droop rate Xj*Wu_
仿真分析 simulation analysis ysN3
传递函数 transfer function AW .F3hN)
框图 block diagram k9R9Nz|J
受端 receive-side ^.tg 7%dJ
裕度 margin 0x7'^Z>-oe
同步 synchronization 3T
9j@N77
失去同步 loss of synchronization q4q6c")zp
阻尼 damping NI5``BwpO
摇摆 swing g`^x@rj`E
保护断路器 circuit breaker tkhCw/
电阻:resistance <VcQ{F
电抗:reactance >/\'zi]L
阻抗:impedance a?.=V
电导:conductance |}1dFp
电纳:susceptance