1 backplane 背板 I?KN7(9u?
2 Band gap voltage reference 带隙电压参考 ~cz}C("Z
3 benchtop supply 工作台电源 $+gQnI3w
4 Block Diagram 方块图 5 Bode Plot 波特图 !3Dq)ebBz
6 Bootstrap 自举 4^_6~ YP7
7 Bottom FET Bottom FET Rq4;{a/j
8 bucket capcitor 桶形电容 MB}nn&u#
9 chassis 机架 :cpj{v;s
10 Combi-sense Combi-sense J,a&"eOZ
11 constant current source 恒流源 <y 4(!z"
12 Core Sataration 铁芯饱和 *4O=4F)x
13 crossover frequency 交叉频率 y@LI miRG
14 current ripple 纹波电流 6#w>6g4V~R
15 Cycle by Cycle 逐周期 zcpL[@B
16 cycle skipping 周期跳步 , 3R=8
17 Dead Time 死区时间 X<ex
>sM
18 DIE Temperature 核心温度 2j\_svw'
19 Disable 非使能,无效,禁用,关断 <J%qzt}
20 dominant pole 主极点 1=VyD<dNG6
21 Enable 使能,有效,启用 QE]@xLz
22 ESD Rating ESD额定值 LUbhTc
23 Evaluation Board 评估板 3ML][|TR
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. eSPS3|YYn
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 vrn4yHoZ
25 Failling edge 下降沿 SA,~q&
26 figure of merit 品质因数 wl=tN{R
27 float charge voltage 浮充电压 ]aN9mT
N
28 flyback power stage 反驰式功率级 eAHY/Y!
29 forward voltage drop 前向压降 g 2Fg
30 free-running 自由运行 $-_" SWG.
31 Freewheel diode 续流二极管 \%-<O
32 Full load 满负载 33 gate drive 栅极驱动 j
}~?&yB
34 gate drive stage 栅极驱动级 {R$`YWk
35 gerber plot Gerber 图 (}#&HE<
36 ground plane 接地层 l;$F[/3a
37 Henry 电感单位:亨利 N$=YL
@m8
38 Human Body Model 人体模式 =^"Sx??V
39 Hysteresis 滞回 f/\!=sa:
40 inrush current 涌入电流 8X;?fjl`"
41 Inverting 反相 lM-\:Q!
42 jittery 抖动 z/Lb1ND8
43 Junction 结点 +U
fw
44 Kelvin connection 开尔文连接 >=k7#av
45 Lead Frame 引脚框架 Q`CuZkP(
46 Lead Free 无铅 Vjs2Yenx
47 level-shift 电平移动 k|fM9E
48 Line regulation 电源调整率 u5CSx'h]
49 load regulation 负载调整率 F6{g{
B
50 Lot Number 批号 ;NP-tA)
51 Low Dropout 低压差 <I,4Kc!
52 Miller 密勒 53 node 节点 K#FD$,c~
54 Non-Inverting 非反相 H UJqB0D
?
55 novel 新颖的 H )X[%+
56 off state 关断状态 4vg,g(qi<
57 Operating supply voltage 电源工作电压 &Vj@){
58 out drive stage 输出驱动级 CKw-HgXG
59 Out of Phase 异相 97c0bgI!+
60 Part Number 产品型号 qw+7.h#V
61 pass transistor pass transistor l@Lk+-[D
62 P-channel MOSFET P沟道MOSFET l,n_G/\
63 Phase margin 相位裕度 /cS8@)e4
64 Phase Node 开关节点 &0 QUObK
65 portable electronics 便携式电子设备 t%@iF
U;}
66 power down 掉电 |dIR v
67 Power Good 电源正常 9FEhl~&
68 Power Groud 功率地 SiNgV\('U
69 Power Save Mode 节电模式 !&%KJS6p4
70 Power up 上电 w+m7jn!$
71 pull down 下拉 cGE{dWz
72 pull up 上拉 l4gH]!/@
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) p5In9s
74 push pull converter 推挽转换器
u7!gF&tA
75 ramp down 斜降 (JU8F-/9
76 ramp up 斜升 NbWEP\dS'z
77 redundant diode 冗余二极管 $`xpn#lz
78 resistive divider 电阻分压器 oy[s])Tg
79 ringing 振 铃
Zl_sbIY
80 ripple current 纹波电流 5|0}bv O
81 rising edge 上升沿 l@4pZkdq
82 sense resistor 检测电阻 DzC`yWstP
83 Sequenced Power Supplys 序列电源 jS,Pu%fR
84 shoot-through 直通,同时导通 AB
$N`+&
85 stray inductances. 杂散电感 8hV]t'/;
86 sub-circuit 子电路 U/c+j{=~
87 substrate 基板 |@d(2f8
88 Telecom 电信 X&Oo[Z
89 Thermal Information 热性能信息 03?ADjO
90 thermal slug 散热片 :M6|V_Yp
91 Threshold 阈值 h`Jc%6o
92 timing resistor 振荡电阻 (R=ZI
93 Top FET Top FET 7Kym|Zg
94 Trace 线路,走线,引线 GS*O{u
95 Transfer function 传递函数 j1Ys8k%$l
96 Trip Point 跳变点 3 EAr=E]
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) LBio$67F
98 Under Voltage Lock Out (UVLO) 欠压锁定 $%U}k=-
99 Voltage Reference 电压参考 /A5=L<T6F
100 voltage-second product 伏秒积 8y<mHJ[B
101 zero-pole frequency compensation 零极点频率补偿 %n]jsdE^|
102 beat frequency 拍频 ]:ca=&>
103 one shots 单击电路 9u~C?w
104 scaling 缩放 [\F:NLjiUy
105 ESR 等效串联电阻 [Page] [voc_o7AI
106 Ground 地电位 -0uGzd+m*
107 trimmed bandgap 平衡带隙 9X[378f+(
108 dropout voltage 压差 '+_-r'2
109 large bulk capacitance 大容量电容 ,%Pn.E* r;
110 circuit breaker 断路器 &tkPZ*}#1
111 charge pump 电荷泵 06NiH-0O
112 overshoot 过冲 D~qi6@Ga
*3^7'^j<
印制电路printed circuit e_Zs4\^ef
印制线路 printed wiring y**L^uvr
印制板 printed board DN8I[5O
印制板电路 printed circuit board bO6z;D#
印制线路板 printed wiring board +VIEDV+
印制元件 printed component [3irr0D7l
印制接点 printed contact Pf8_6 z_
印制板装配 printed board assembly ,>g(%3C
板 board 0?R$>=u
刚性印制板 rigid printed board R||$Wi[$
挠性印制电路 flexible printed circuit G>Bgw>#_
挠性印制线路 flexible printed wiring 7d{xXJ-
齐平印制板 flush printed board B8cg[;e81
金属芯印制板 metal core printed board :A#'8xE/
金属基印制板 metal base printed board Gj#BG49g2
多重布线印制板 mulit-wiring printed board p-C{$5&
O1
塑电路板 molded circuit board wQ-BY"cK\
散线印制板 discrete wiring board -8:O?]+Q/
微线印制板 micro wire board 7|Qb}[s
积层印制板 buile-up printed board ABEEJQ
表面层合电路板 surface laminar circuit 823y;
埋入凸块连印制板 B2it printed board }zo-%#
载芯片板 chip on board Jx3a7CpX
埋电阻板 buried resistance board uPFbKSJj
母板 mother board 'o_ RC{k2"
子板 daughter board ),<h6$
背板 backplane 1_~'?'&^
裸板 bare board E?0RR'
键盘板夹心板 copper-invar-copper board /|Gz<nSc
动态挠性板 dynamic flex board PHsM)V+
静态挠性板 static flex board 11J:>A5zt
可断拼板 break-away planel DL_M#c`<
电缆 cable 4!glgEE*
挠性扁平电缆 flexible flat cable (FFC) Y\H4.$V
薄膜开关 membrane switch EU5(s*A
混合电路 hybrid circuit LQ$dT#z2A
厚膜 thick film p8y<:8I
厚膜电路 thick film circuit a`||ePb|W~
薄膜 thin film -r_ Pp}s
薄膜混合电路 thin film hybrid circuit /Wjf"dG}
互连 interconnection lr,i5n{6
导线 conductor trace line lKirc2
齐平导线 flush conductor .b%mr:nEt7
传输线 transmission line F fzY3r+
跨交 crossover wZ8LY;
板边插头 edge-board contact 'bef3P9`
增强板 stiffener t/"9LMKs?
基底 substrate lVb;,C%K
基板面 real estate @iz6)2z
导线面 conductor side {*|$@%y!
元件面 component side lce~6}
焊接面 solder side X<"#=u(
导电图形 conductive pattern Bsz;GnD|r
非导电图形 non-conductive pattern Bq:: 5,v
基材 base material \AR3DDm
层压板 laminate k.0pPl
覆金属箔基材 metal-clad bade material HQ|{!P\/?U
覆铜箔层压板 copper-clad laminate (CCL) _`94CC:
复合层压板 composite laminate ]_)=xF19
薄层压板 thin laminate *!(?=9[
基体材料 basis material )&elr,b/y
预浸材料 prepreg [TpW$E0H
粘结片 bonding sheet CV,[x[L#{
预浸粘结片 preimpregnated bonding sheer @}N;C..Y$
环氧玻璃基板 epoxy glass substrate ]| =#FFz
预制内层覆箔板 mass lamination panel 1<9m^9_ro
内层芯板 core material \RP=Gf
粘结层 bonding layer hta$k%2
粘结膜 film adhesive {Q~A;t
无支撑胶粘剂膜 unsupported adhesive film HaamLu
覆盖层 cover layer (cover lay) Y|i!\Ae
增强板材 stiffener material ;,&1
铜箔面 copper-clad surface =mk7'A>l
去铜箔面 foil removal surface `Tf<w+H
层压板面 unclad laminate surface k}Vu!+c z
基膜面 base film surface >7V&pH'
胶粘剂面 adhesive faec fx4X!(w!B
原始光洁面 plate finish aKCXV[PO
粗面 matt finish h:+>=~\
剪切板 cut to size panel C>7k|;BvF
超薄型层压板 ultra thin laminate KH&xu,I
A阶树脂 A-stage resin ,
v6[#NU_Z
B阶树脂 B-stage resin PFIL)D
|G
C阶树脂 C-stage resin L``K. DF
环氧树脂 epoxy resin Icf@uQ6
酚醛树脂 phenolic resin G#0 4h{
聚酯树脂 polyester resin Xl%&hM
聚酰亚胺树脂 polyimide resin tL4xHa6v]
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin WYE[H9x1?
丙烯酸树脂 acrylic resin " mE<r2=@
三聚氰胺甲醛树脂 melamine formaldehyde resin p.1|bXY`
多官能环氧树脂 polyfunctional epoxy resin !'C^qrh
溴化环氧树脂 brominated epoxy resin $NWI_F4
环氧酚醛 epoxy novolac NC2PW+(
氟树脂 fluroresin |v{a5|<E
硅树脂 silicone resin C`x>)wm:
硅烷 silane [H)p#x
聚合物 polymer 18!0Hl>
无定形聚合物 amorphous polymer %P9Zx!i>
结晶现象 crystalline polamer B)"WG7W E
双晶现象 dimorphism |xaA3UA
共聚物 copolymer ;comL29l2`
合成树脂 synthetic ziy~~J
热固性树脂 thermosetting resin [Page] 8DLMxG
热塑性树脂 thermoplastic resin 66%kq[
感光性树脂 photosensitive resin BiHBu8<
环氧值 epoxy value 15gI-Qb
双氰胺 dicyandiamide F+AShh
粘结剂 binder rReZ$U
胶粘剂 adesive I)O-i_}L&K
固化剂 curing agent *4[3?~_B#6
阻燃剂 flame retardant J74nAC%J^
遮光剂 opaquer ou-5iH?
增塑剂 plasticizers 5R,/X
不饱和聚酯 unsatuiated polyester `&>!a
聚酯薄膜 polyester eA_1?j]E3
聚酰亚胺薄膜 polyimide film (PI) !H,R$3~
聚四氟乙烯 polytetrafluoetylene (PTFE) yZ+o7?(2p
增强材料 reinforcing material A0WQZt!FEN
折痕 crease f=J#mmHw$
云织 waviness q^dI!93n|
鱼眼 fish eye ipKkz
毛圈长 feather length poHDA=#
3
厚薄段 mark /sdkQ{J!.
裂缝 split F{f "xM
捻度 twist of yarn ;nv4lxm
浸润剂含量 size content |g4!Yd
浸润剂残留量 size residue bU:"dqRm<
处理剂含量 finish level :d!.E$S
偶联剂 couplint agent ZwF_hm=/[
断裂长 breaking length &2#x(v
吸水高度 height of capillary rise F+L q
湿强度保留率 wet strength retention /5r[M=_ihr
白度 whitenness F=^vu7rf
导电箔 conductive foil o~^hsm[44J
铜箔 copper foil ]Wv\$JXI
压延铜箔 rolled copper foil FQ(=Fnqn
光面 shiny side '1r:z, o|
粗糙面 matte side \&AmX8" [
处理面 treated side KY"W{D9ib
防锈处理 stain proofing <h7C_^L10\
双面处理铜箔 double treated foil /2?GRwU~P
模拟 simulation &g@?{5FP
逻辑模拟 logic simulation 2J|Yc^b6
电路模拟 circit simulation R^_/iy
时序模拟 timing simulation /k}vm3
模块化 modularization Z^`>;n2
设计原点 design origin Yw+_( 2
9=
优化(设计) optimization (design) 0-4WLMx
供设计优化坐标轴 predominant axis UO<%|{W+
表格原点 table origin Z10#6v
元件安置 component positioning }e9:2
比例因子 scaling factor O-bC+vB]M
扫描填充 scan filling D,1S-<
矩形填充 rectangle filling &Cdk%@Tj]B
填充域 region filling Y@^MU->+
实体设计 physical design 3Xf}vdgdM$
逻辑设计 logic design T6-e
逻辑电路 logic circuit $N5}N\C:a
层次设计 hierarchical design M.!U;U<?
自顶向下设计 top-down design
+<AX
0(
自底向上设计 bottom-up design @;d(>_n
费用矩阵 cost metrix H-0A&oG
元件密度 component density ;9 XM
s)
自由度 degrees freedom OES+BXGX
出度 out going degree nvsuF)%9hZ
入度 incoming degree QSEf
曼哈顿距离 manhatton distance MBDu0
[c
欧几里德距离 euclidean distance z+NXD4
网络 network ~ N_\V
阵列 array $0sUh]7y
段 segment HRje4=:
逻辑 logic m/%sBw\rx
逻辑设计自动化 logic design automation O^4:4tRpt
分线 separated time SAc}5.
分层 separated layer 4 K{4=uU
定顺序 definite sequence B]InOlc47
导线(通道) conduction (track) p^7ZFUP
导线(体)宽度 conductor width US0)^TKrj
导线距离 conductor spacing vXRfsv y
导线层 conductor layer do7 [Nj
导线宽度/间距 conductor line/space *#+XfOtF
第一导线层 conductor layer No.1 Iz!Blk
圆形盘 round pad N
0&h5
方形盘 square pad R.*KaCA
菱形盘 diamond pad u0#q)L8
长方形焊盘 oblong pad l)HF4#Bs
子弹形盘 bullet pad KE&Y~y8O\
泪滴盘 teardrop pad n4qj"xQ
雪人盘 snowman pad 6}n>Nb;L"
形盘 V-shaped pad V ^'*9,.ltd
环形盘 annular pad d1 D{wZ3g
非圆形盘 non-circular pad kdITh9nx<r
隔离盘 isolation pad I/_`/mQ
非功能连接盘 monfunctional pad 2zh?]if
偏置连接盘 offset land QrHI}r
腹(背)裸盘 back-bard land W$v5o9\Px
盘址 anchoring spaur 'kL>F&|
连接盘图形 land pattern ?o"wyF A*
连接盘网格阵列 land grid array ~z ^VMr
孔环 annular ring
$F`jM/B6
元件孔 component hole P+wV.pF|
安装孔 mounting hole ~aNK)<Fznd
支撑孔 supported hole k6QQoLb$V
非支撑孔 unsupported hole ~:D}L
导通孔 via |k{?\ (h;
镀通孔 plated through hole (PTH) 8AOJ'~$
余隙孔 access hole $e_A( |
盲孔 blind via (hole) b-@6w(j
埋孔 buried via hole NELQo#kjZ
埋,盲孔 buried blind via \3hhM}6)DM
任意层内部导通孔 any layer inner via hole `QC{}Oo^
全部钻孔 all drilled hole "/[-U;ck
定位孔 toaling hole a 9(1 6k
无连接盘孔 landless hole 8tK 8|t5+
中间孔 interstitial hole PBTGN;y
无连接盘导通孔 landless via hole nG1mx/w
引导孔 pilot hole #^"\WG7{
端接全隙孔 terminal clearomee hole l=`)yc.
准尺寸孔 dimensioned hole [Page] @c,}\"(
在连接盘中导通孔 via-in-pad 5-0
孔位 hole location #%il+3J
孔密度 hole density =4/LixsV|
孔图 hole pattern 0e^j :~*
钻孔图 drill drawing
F=EAD3
装配图assembly drawing B)Hs>Mh|W
参考基准 datum referan cmmH)6c>
1) 元件设备 403%~
ZsirX~W<
三绕组变压器:three-column transformer ThrClnTrans eOt T*
双绕组变压器:double-column transformer DblClmnTrans K8$Hg:Ky-/
电容器:Capacitor xC9^x7%3O
并联电容器:shunt capacitor 8 *;G\$+
电抗器:Reactor 6+_)(+c
母线:Busbar i%GjtYjS
输电线:TransmissionLine :+|b7fF
发电厂:power plant 43W>4fsc
断路器:Breaker ?"$W=*P\o
刀闸(隔离开关):Isolator WIb\+!
分接头:tap {6!Mf+Xq
电动机:motor \7nlwFAO
(2) 状态参数 Is` S
i,NN"
有功:active power %np b.C|+
无功:reactive power LDN'o1$qo
电流:current 7 6~x|6)
容量:capacity L}ud+Wfox
电压:voltage z%Ywjfn'
档位:tap position .L0pS.=LT
有功损耗:reactive loss L01R.3Z+
无功损耗:active loss s03DL
功率因数:power-factor 2lDgvug
功率:power LyhLPU0^q
功角:power-angle %L+/GtxK
电压等级:voltage grade 8RbtI4
空载损耗:no-load loss !s/ij'T
铁损:iron loss >V;JI;[
铜损:copper loss xojy[c#
空载电流:no-load current u|<Z};a
阻抗:impedance NDglse
正序阻抗:positive sequence impedance ={ c=8G8T
负序阻抗:negative sequence impedance l"p%]\tZ
零序阻抗:zero sequence impedance O66\s q
电阻:resistor 9aD6mp
电抗:reactance d~tG#<^`
电导:conductance e<dFvMO
电纳:susceptance ,GS8Gu
无功负载:reactive load 或者QLoad I&3L1rl3{*
有功负载: active load PLoad jb$sIZ%i
遥测:YC(telemetering) t(VG#}
遥信:YX AGQCk*dm
励磁电流(转子电流):magnetizing current 3!`Pv ?|o
定子:stator P.$U6cq
功角:power-angle zNuiBLxDs
上限:upper limit h ^g"FSzP
下限:lower limit zL5r8mD3
并列的:apposable s$YKdtR
高压: high voltage Qf0$Z.-
低压:low voltage 2x{@19w)C
中压:middle voltage T5)Xl 'Q
电力系统 power system {H#1wu^]O$
发电机 generator Za}*6N=?*
励磁 excitation f/H rO6~k%
励磁器 excitor ?t$sju(\
电压 voltage HWT0oh]
电流 current aDb@u3X@
母线 bus Y}7'OM
变压器 transformer {J%Na&D
升压变压器 step-up transformer p<?~~7V
高压侧 high side p<Wb^BE
输电系统 power transmission system YR'?fr
输电线 transmission line q<o*rcwf^
固定串联电容补偿fixed series capacitor compensation Z^`&