1 backplane 背板 U {!{5l:
2 Band gap voltage reference 带隙电压参考 ^i1:PlW]
3 benchtop supply 工作台电源 o^6 j(~
4 Block Diagram 方块图 5 Bode Plot 波特图 Mwk_SCy
6 Bootstrap 自举 #vwXx r
7 Bottom FET Bottom FET HN@)/5BY
8 bucket capcitor 桶形电容 ?{")Wt
9 chassis 机架 Wy )g449
10 Combi-sense Combi-sense }"k(kH
11 constant current source 恒流源 uNBhVsM6<
12 Core Sataration 铁芯饱和 X0TGJ,yW(
13 crossover frequency 交叉频率 H2cc).8"
14 current ripple 纹波电流 >AFpO*q"
15 Cycle by Cycle 逐周期 'A2"&6m)28
16 cycle skipping 周期跳步 .w)t<7 y
17 Dead Time 死区时间 K a|\gl;V
18 DIE Temperature 核心温度 1 to<at-NN
19 Disable 非使能,无效,禁用,关断 6LQ O>k
20 dominant pole 主极点 ?\r3
_
21 Enable 使能,有效,启用 S,%HW87
22 ESD Rating ESD额定值 XePBA
J
23 Evaluation Board 评估板 nP31jm+A
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. !,"G/}'^;
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 5Vqvb|
25 Failling edge 下降沿 s$6#3%h
26 figure of merit 品质因数 _,~zy9{,
27 float charge voltage 浮充电压 bf(&N-"A
28 flyback power stage 反驰式功率级 HArYL}l
29 forward voltage drop 前向压降 [G/X
30 free-running 自由运行 2jC\yY |PN
31 Freewheel diode 续流二极管 }iAi`_\0;
32 Full load 满负载 33 gate drive 栅极驱动 c Zr4
34 gate drive stage 栅极驱动级 4iW2hV@m
35 gerber plot Gerber 图 k]g\`
gc
36 ground plane 接地层 _AHVMsz@
37 Henry 电感单位:亨利 =1capix 1r
38 Human Body Model 人体模式 pC8i&_A
39 Hysteresis 滞回 `_)dEu
40 inrush current 涌入电流 KW<CU'
41 Inverting 反相 (J*0/7
eX
42 jittery 抖动 XU7bWafy
43 Junction 结点 yqwr0yDAl
44 Kelvin connection 开尔文连接 JM%#L *;
45 Lead Frame 引脚框架 &@-glF5
46 Lead Free 无铅 'h6RZKG T
47 level-shift 电平移动 _3S{n=9
48 Line regulation 电源调整率 1 Y&d%AA
49 load regulation 负载调整率 hg @Jpg
50 Lot Number 批号 jU$PO\UTk
51 Low Dropout 低压差 P+UK@~D+G
52 Miller 密勒 53 node 节点 Tp13V.|
54 Non-Inverting 非反相 sTz*tSwQv
55 novel 新颖的 u'p J9>sC
56 off state 关断状态 "Wp<^s sMo
57 Operating supply voltage 电源工作电压 HV(Kz
58 out drive stage 输出驱动级 #v-!GK_<
59 Out of Phase 异相 ,z3b2$
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60 Part Number 产品型号 _#:1Axx1
61 pass transistor pass transistor 9iE66N>z
62 P-channel MOSFET P沟道MOSFET _JH6bvbQ
63 Phase margin 相位裕度 YBP{4Rl
64 Phase Node 开关节点 DVl:s
65 portable electronics 便携式电子设备 |*$_eb
66 power down 掉电 7@?b _
67 Power Good 电源正常 8Yh2K}
68 Power Groud 功率地 T2{+fRvN
69 Power Save Mode 节电模式 0"N %Vm
70 Power up 上电
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71 pull down 下拉 NL 37Y{b
72 pull up 上拉 4SYN$?.Mp
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) _c2#
74 push pull converter 推挽转换器 FcA0 \`0M
75 ramp down 斜降 kXWx )v
76 ramp up 斜升 V_* ^2c)
77 redundant diode 冗余二极管 +,lD_{}_
78 resistive divider 电阻分压器 -)@.D>HsOt
79 ringing 振 铃 rxARJso
80 ripple current 纹波电流 qJ@?[|2R
81 rising edge 上升沿 _,^sI%
82 sense resistor 检测电阻 H &JKja}`
83 Sequenced Power Supplys 序列电源 DYS(ZY)4
84 shoot-through 直通,同时导通 |zMQe}R@%
85 stray inductances. 杂散电感 d:D2[
86 sub-circuit 子电路 ^4"_I
87 substrate 基板 'SmdU1]4BD
88 Telecom 电信 Li2)~4p><
89 Thermal Information 热性能信息 m_B5M0},
90 thermal slug 散热片 D fea<5~^z
91 Threshold 阈值 ($wYawz
92 timing resistor 振荡电阻 s@$AYZm_
93 Top FET Top FET X$*
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94 Trace 线路,走线,引线 JI&>w-~D
95 Transfer function 传递函数 vl<J-+|0C
96 Trip Point 跳变点 jhLh~.
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97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 9\8""-
98 Under Voltage Lock Out (UVLO) 欠压锁定 -n9e-0
99 Voltage Reference 电压参考 OjN]mp-q
100 voltage-second product 伏秒积 jnTl%aQYc
101 zero-pole frequency compensation 零极点频率补偿 HZT;7<
102 beat frequency 拍频 NQG"}=KA
103 one shots 单击电路 bbJa,}R
104 scaling 缩放 vzw\f
105 ESR 等效串联电阻 [Page] sR6(8
106 Ground 地电位 +3C
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107 trimmed bandgap 平衡带隙 L6a8%%`
108 dropout voltage 压差 Y%faf.$/9
109 large bulk capacitance 大容量电容 1pV"<,t
110 circuit breaker 断路器 C$bK!]a
111 charge pump 电荷泵 DB0xIP~i,?
112 overshoot 过冲 /Yh8r1^2tZ
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印制电路printed circuit ;Gi w7a)
印制线路 printed wiring ^{s)`j'I*
印制板 printed board ^Z*_@A _v
印制板电路 printed circuit board B$bsh.
印制线路板 printed wiring board v%1# y5
印制元件 printed component ]HRZ9oP
印制接点 printed contact
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印制板装配 printed board assembly '/j`j>'!^
板 board :* 'i\
刚性印制板 rigid printed board C?O{l%0
挠性印制电路 flexible printed circuit
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挠性印制线路 flexible printed wiring mK4a5H
齐平印制板 flush printed board <ESAoY"RPN
金属芯印制板 metal core printed board >eC^]#c
金属基印制板 metal base printed board `drvu?F
多重布线印制板 mulit-wiring printed board x!< C0N>?z
塑电路板 molded circuit board "K8qmggTq
散线印制板 discrete wiring board oqj3Q
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微线印制板 micro wire board alG}Aw#gS
积层印制板 buile-up printed board Cxh9rUe.
表面层合电路板 surface laminar circuit GB+G1w
埋入凸块连印制板 B2it printed board
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载芯片板 chip on board -X=f+4j
埋电阻板 buried resistance board ~DJ/sY2/
母板 mother board l- X|3 ,
子板 daughter board |!}$V
背板 backplane L^=>)\R2$[
裸板 bare board rh!4 1
键盘板夹心板 copper-invar-copper board L+,{*Uj[;
动态挠性板 dynamic flex board
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静态挠性板 static flex board pS%Az)3RZ
可断拼板 break-away planel }LM_VZj
电缆 cable &L/C:<.
挠性扁平电缆 flexible flat cable (FFC) j#*K[
薄膜开关 membrane switch V=YK3){>A
混合电路 hybrid circuit 9orza<#
厚膜 thick film @1>83-p"X
厚膜电路 thick film circuit }{lOsZA
薄膜 thin film JK1b68n
薄膜混合电路 thin film hybrid circuit n\ IVpgP
互连 interconnection o6q Qzk
导线 conductor trace line m:h]nm
齐平导线 flush conductor tHGK<rb
传输线 transmission line }n<dyX:a
跨交 crossover 4y knX%[
板边插头 edge-board contact S"Efp/-
增强板 stiffener mV;7SBoT
基底 substrate b*bR<|dT j
基板面 real estate 97
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导线面 conductor side 9`b*Y*d
元件面 component side We" "/X
焊接面 solder side BFMM6-Ve
导电图形 conductive pattern @p!["v&
非导电图形 non-conductive pattern `xtN+y F
基材 base material v!x=fjr<
层压板 laminate eQ*gnV}rE%
覆金属箔基材 metal-clad bade material C6Kz6_DQZ
覆铜箔层压板 copper-clad laminate (CCL) t >8t|t+
复合层压板 composite laminate ,@P3!|
薄层压板 thin laminate v.\&gn