1 backplane 背板 lNsdbyV'
2 Band gap voltage reference 带隙电压参考 ^?2zoS#iw
3 benchtop supply 工作台电源 O^!Bc}$
4 Block Diagram 方块图 5 Bode Plot 波特图 ~z\a:+
6 Bootstrap 自举 &Hyy .a
7 Bottom FET Bottom FET ~Zn|(
8 bucket capcitor 桶形电容 g=KvCqJN
9 chassis 机架 lGt:.p{NG
10 Combi-sense Combi-sense B]NcY&A
11 constant current source 恒流源 UpPl-jeT
12 Core Sataration 铁芯饱和 L]%!YP\<T
13 crossover frequency 交叉频率 *8_Dn}u?Jx
14 current ripple 纹波电流 psse^rFg
15 Cycle by Cycle 逐周期 \*&?o51!e
16 cycle skipping 周期跳步 U)M&AYb
17 Dead Time 死区时间 nLOK1@,4
18 DIE Temperature 核心温度 ^We}i
19 Disable 非使能,无效,禁用,关断 kl[(!"p
20 dominant pole 主极点 3:G$Y:#P
21 Enable 使能,有效,启用 %#o@ c
22 ESD Rating ESD额定值 VC0Tqk
23 Evaluation Board 评估板 d'&OEGb<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ;B;@MD,B
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 5
1N/XEk
25 Failling edge 下降沿 vS"h`pL
26 figure of merit 品质因数 k~Q
5Cs
27 float charge voltage 浮充电压 3AglvGK7{
28 flyback power stage 反驰式功率级 MkHkM
29 forward voltage drop 前向压降 rT=C/SKP
30 free-running 自由运行 HI{h>g T
31 Freewheel diode 续流二极管 Lq$ig8V:O7
32 Full load 满负载 33 gate drive 栅极驱动 f _$hK9I
34 gate drive stage 栅极驱动级 |h%HUau
35 gerber plot Gerber 图 tSux5yV
36 ground plane 接地层 v%c/eAF
37 Henry 电感单位:亨利 xAl8e
38 Human Body Model 人体模式 %6%mf>Guf
39 Hysteresis 滞回 g4Q' Fub+I
40 inrush current 涌入电流 pKpB
41 Inverting 反相 {* :^K\-
42 jittery 抖动 oc]:Ty
43 Junction 结点 ll1N`ke
44 Kelvin connection 开尔文连接 `d^Q!QxE
45 Lead Frame 引脚框架 IU5T5p
46 Lead Free 无铅 ke!
47 level-shift 电平移动 t)Cf]]dV
48 Line regulation 电源调整率 pdR\Ne0P*
49 load regulation 负载调整率 I]i(
B+D
50 Lot Number 批号 F\&{ >&
51 Low Dropout 低压差 M)!"R [V
52 Miller 密勒 53 node 节点 ~Kt1%&3{a?
54 Non-Inverting 非反相 Woj5
yr
55 novel 新颖的 y2#"\5dC
56 off state 关断状态 |1tpXpe
57 Operating supply voltage 电源工作电压 vK@UK"m
58 out drive stage 输出驱动级 9) ,|h
59 Out of Phase 异相 Ynvf;qs
60 Part Number 产品型号 ']>9/r#
61 pass transistor pass transistor +p63J
62 P-channel MOSFET P沟道MOSFET zCQP9oK!
63 Phase margin 相位裕度 NN2mOJ:-
64 Phase Node 开关节点 4_iA<}>|
65 portable electronics 便携式电子设备 =R'O5J
66 power down 掉电 {J
izCUo_'
67 Power Good 电源正常 fz`)CWo:
68 Power Groud 功率地 9Q}g
Vqn
69 Power Save Mode 节电模式 q4Wr$T$gs=
70 Power up 上电 hrq% { !Z
71 pull down 下拉 .{c7 I!8
72 pull up 上拉 [520!JhZY
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) U;WwEta ]
74 push pull converter 推挽转换器 jd-ccnR l
75 ramp down 斜降 7 s{vou
76 ramp up 斜升 ~tt\^:\3~S
77 redundant diode 冗余二极管 ` 6*]c n#(
78 resistive divider 电阻分压器 =k.%#h{
79 ringing 振 铃 ]vB\yQE
80 ripple current 纹波电流 Li}5aK
81 rising edge 上升沿 jk&xzJH.
82 sense resistor 检测电阻 vm[*+&\2
83 Sequenced Power Supplys 序列电源 Cs[d:T
84 shoot-through 直通,同时导通 1s@QsZ3
85 stray inductances. 杂散电感 @L~erg>8=
86 sub-circuit 子电路 #@OPi6.#!<
87 substrate 基板 -JF^`hBD-
88 Telecom 电信 {R-o8N
89 Thermal Information 热性能信息 "r_wgl%
90 thermal slug 散热片 o
?vGI=
91 Threshold 阈值 {eI'0==
92 timing resistor 振荡电阻 64mEZ_kG,
93 Top FET Top FET r9&m^,U
94 Trace 线路,走线,引线 I/tMFg
95 Transfer function 传递函数 vs=q<Uw)
96 Trip Point 跳变点 Rr%x;-
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) qjhV/fsfb
98 Under Voltage Lock Out (UVLO) 欠压锁定 hBpa"0F
99 Voltage Reference 电压参考 0=3)`v{S@
100 voltage-second product 伏秒积 u-,}ug|
101 zero-pole frequency compensation 零极点频率补偿 "E\mj'k
102 beat frequency 拍频 f\dfKNm6
103 one shots 单击电路 @9KW ]7
104 scaling 缩放 $ch`.$wx
105 ESR 等效串联电阻 [Page] B8T$<
106 Ground 地电位 #l4T/`u'9!
107 trimmed bandgap 平衡带隙 $~.YB\3
108 dropout voltage 压差 9D1WUUa
109 large bulk capacitance 大容量电容 |K Rt$t
110 circuit breaker 断路器 C$6FI`J
111 charge pump 电荷泵 T9Q3I
112 overshoot 过冲 aqI"4v]~b
T8z?_ *k
印制电路printed circuit w'(/dr
印制线路 printed wiring /9G72AD!
印制板 printed board !Yb !Au[
印制板电路 printed circuit board f;
|fS~
印制线路板 printed wiring board {:uv}4 Z
印制元件 printed component kaekH*m~
印制接点 printed contact d6QrB"J`
印制板装配 printed board assembly }psRgF
板 board }l7+W4~
刚性印制板 rigid printed board >[|N%9\
挠性印制电路 flexible printed circuit c]ARgrH-
挠性印制线路 flexible printed wiring X n!mdR
齐平印制板 flush printed board %/y=_G
金属芯印制板 metal core printed board ~SQxFAto
金属基印制板 metal base printed board +n;nvf}(
多重布线印制板 mulit-wiring printed board 6I@j$edZ
塑电路板 molded circuit board P{n#^4
散线印制板 discrete wiring board ?x #K:a?
微线印制板 micro wire board pVy=rS-
积层印制板 buile-up printed board TsaQR2J@
表面层合电路板 surface laminar circuit M/Yr0"%Q<.
埋入凸块连印制板 B2it printed board Xh;.T=/E|
载芯片板 chip on board yKV{V?h?
埋电阻板 buried resistance board Yao}Xo9}
母板 mother board ,\\ba_*z
子板 daughter board aP
背板 backplane 4$&l`yWU+
裸板 bare board MMFwT(l<1
键盘板夹心板 copper-invar-copper board \QK@wgu
动态挠性板 dynamic flex board wI_@
静态挠性板 static flex board p5fr}#en
可断拼板 break-away planel ResU5Ce~
电缆 cable }R['Zoh4I
挠性扁平电缆 flexible flat cable (FFC) Ocx"s\q(
薄膜开关 membrane switch %MjoY_<:_
混合电路 hybrid circuit yv[j
Pbe
厚膜 thick film
QPx5`{nN
厚膜电路 thick film circuit h$l/wn
薄膜 thin film njy2pDC@
薄膜混合电路 thin film hybrid circuit Iy9hBAg\y
互连 interconnection |qUGB.Q
导线 conductor trace line nTqU~'d'
齐平导线 flush conductor _AX9Mu]
传输线 transmission line ^}=)jLS
跨交 crossover sW]^YT>?
板边插头 edge-board contact >S +}
增强板 stiffener FbE/x$;~O
基底 substrate m;OvOc,
基板面 real estate d+JK")$9C
导线面 conductor side 2!/Kt
O)i^
元件面 component side N6y9'LGG`
焊接面 solder side EJkHPn
导电图形 conductive pattern wX"hUu
非导电图形 non-conductive pattern Ht
Fr(g\"$
基材 base material ~$HB}/
层压板 laminate X1|
+9
覆金属箔基材 metal-clad bade material EU?qLj':
覆铜箔层压板 copper-clad laminate (CCL) 2a$.S" ?
复合层压板 composite laminate EjR(AqZY
薄层压板 thin laminate 03 @aG
基体材料 basis material pr0X7 #_E5
预浸材料 prepreg 7]h %?W!
粘结片 bonding sheet y*i&p4Y*
预浸粘结片 preimpregnated bonding sheer Pp8S\%z~h
环氧玻璃基板 epoxy glass substrate +vh|m5"7I7
预制内层覆箔板 mass lamination panel S>yi D`v
内层芯板 core material n$/|r
粘结层 bonding layer &K9;GZS?
粘结膜 film adhesive v"bWVc~H
无支撑胶粘剂膜 unsupported adhesive film 7*5B
覆盖层 cover layer (cover lay) jdxHWkQ
增强板材 stiffener material iE~!?N|a3
铜箔面 copper-clad surface rQjk
去铜箔面 foil removal surface <>] DcA
层压板面 unclad laminate surface E`IXBI
基膜面 base film surface ;p(h!4E
胶粘剂面 adhesive faec Y=mr=]q
原始光洁面 plate finish >;fVuy
粗面 matt finish uBm"Xkxe|w
剪切板 cut to size panel ]&*POri&
超薄型层压板 ultra thin laminate Ds`e-X)O;\
A阶树脂 A-stage resin -H-U8/W C
B阶树脂 B-stage resin )pWgt5:7~
C阶树脂 C-stage resin !7N:cx'Qy
环氧树脂 epoxy resin E'QAsU8pP
酚醛树脂 phenolic resin FOTe,F.8
聚酯树脂 polyester resin KYFKH+d>m
聚酰亚胺树脂 polyimide resin kuEXNi1l
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin UUt"8]@[
丙烯酸树脂 acrylic resin F\:~^`
三聚氰胺甲醛树脂 melamine formaldehyde resin 37U8<
多官能环氧树脂 polyfunctional epoxy resin p*g Fr hm
溴化环氧树脂 brominated epoxy resin ='7m$,{(Q[
环氧酚醛 epoxy novolac y~9wxK
氟树脂 fluroresin ^h[6{F~J
硅树脂 silicone resin K.Xy:l*z
硅烷 silane 5GsmBf$RUb
聚合物 polymer 5nG\J
g7
无定形聚合物 amorphous polymer MP%#)O6
结晶现象 crystalline polamer BIx*t9wA
双晶现象 dimorphism F @PPhzZ
共聚物 copolymer NQdwj>_a
合成树脂 synthetic */aY$aWv
热固性树脂 thermosetting resin [Page] a"#t'\
热塑性树脂 thermoplastic resin Ua1&eCZi
感光性树脂 photosensitive resin Rh'z;Gyr
环氧值 epoxy value +:KZEFY?<
双氰胺 dicyandiamide )PYPlSQ*V
粘结剂 binder T\6Qr$t
胶粘剂 adesive ,1]UOQ>AP
固化剂 curing agent uyj!$}4
阻燃剂 flame retardant
NFT:$>83`
遮光剂 opaquer {wSi?;[Gq
增塑剂 plasticizers e{)giJY9
不饱和聚酯 unsatuiated polyester W|PAI[N
聚酯薄膜 polyester o@Ye_aM~?Y
聚酰亚胺薄膜 polyimide film (PI) jFSR+mP!
聚四氟乙烯 polytetrafluoetylene (PTFE) OM EwGr(
增强材料 reinforcing material Pf;OYWST
折痕 crease +t7HlAXB#
云织 waviness 579Q&|L.
鱼眼 fish eye 8lF9LZ8
毛圈长 feather length [L%Ltmx
厚薄段 mark :5kDc"
=Z|
裂缝 split (hc!!:N~q
捻度 twist of yarn >tg)F|@
浸润剂含量 size content Kw fd
S(
浸润剂残留量 size residue (:iMs)
iO{
处理剂含量 finish level 6i/unwe!`)
偶联剂 couplint agent H1N@E}> |
断裂长 breaking length e~vO
吸水高度 height of capillary rise g@H<Q('fJ
湿强度保留率 wet strength retention vn.5X
白度 whitenness R@\fqNq
导电箔 conductive foil zw<<st Bp
铜箔 copper foil 0:{W
t
压延铜箔 rolled copper foil 6~dAK3v5
光面 shiny side rJ/HIda
粗糙面 matte side 0akJv^^D
处理面 treated side _`2%)#^o
防锈处理 stain proofing [if(B\&
双面处理铜箔 double treated foil V9[_aP;
模拟 simulation 1d<?K7%^
逻辑模拟 logic simulation tB;PGk_6
电路模拟 circit simulation h7]+#U]mi
时序模拟 timing simulation 4"?`p;{Z
模块化 modularization &v:zS$m>
设计原点 design origin FBE|pG7
优化(设计) optimization (design) MR
"f)
供设计优化坐标轴 predominant axis 0Gu77&
表格原点 table origin `0upm%A
元件安置 component positioning b^R:q7ea
比例因子 scaling factor Q<>u)%92@
扫描填充 scan filling 7(/yyZQnZ
矩形填充 rectangle filling nOC\ =<Nsg
填充域 region filling L|[i<s;
实体设计 physical design 3Ei^WDJ
逻辑设计 logic design 9fp"r,aHN&
逻辑电路 logic circuit -zECxHjx
层次设计 hierarchical design \J:+Wl.9A
自顶向下设计 top-down design Rk9n,"xpv
自底向上设计 bottom-up design Bo:epus}\
费用矩阵 cost metrix j+!u=E
元件密度 component density T4x%3-4;
自由度 degrees freedom O+!4KNN.-
出度 out going degree 05F/&+V
入度 incoming degree !>(uhuTBF
曼哈顿距离 manhatton distance hw"2'{"II
欧几里德距离 euclidean distance ]MCH]/
网络 network gLMb,buqC
阵列 array Lginps[la
段 segment 14&| (M
逻辑 logic J@_M%eN
逻辑设计自动化 logic design automation
:%sG'_d
分线 separated time g?v/u:v>W
分层 separated layer Kmx4bp4
定顺序 definite sequence ;)ay uS sQ
导线(通道) conduction (track) *6JA&zj0B
导线(体)宽度 conductor width G;gsDn1t
导线距离 conductor spacing )EMlGM'2q
导线层 conductor layer jl59;.P
导线宽度/间距 conductor line/space !@!603Gy
第一导线层 conductor layer No.1 T6y~iNd<
圆形盘 round pad gZHgL7@
方形盘 square pad p#c41_?'e
菱形盘 diamond pad 4UbqYl3|a
长方形焊盘 oblong pad P^o@x,V!&
子弹形盘 bullet pad jR\pYRK
泪滴盘 teardrop pad b!t[PShw^
雪人盘 snowman pad e!Z}aOeE
形盘 V-shaped pad V ")ys!V9
环形盘 annular pad R?{_Q<17
非圆形盘 non-circular pad :V$\y up
隔离盘 isolation pad Jd `Qa+
非功能连接盘 monfunctional pad lOA
EM
偏置连接盘 offset land b4:{PD~Mh
腹(背)裸盘 back-bard land 9qa/f[G
盘址 anchoring spaur S/Ic=
连接盘图形 land pattern E$_zBD%
连接盘网格阵列 land grid array yIiVhI?X
孔环 annular ring !4v>|t q!
元件孔 component hole I_#5gq
安装孔 mounting hole %i7U+v(d
支撑孔 supported hole Y'1
KH}sH
非支撑孔 unsupported hole @|h9jx|
导通孔 via f0@*>
镀通孔 plated through hole (PTH) Sa)sDf1+`
余隙孔 access hole fAkfNH6
盲孔 blind via (hole) BN(=LQ2["
埋孔 buried via hole {zd[8TJ~xa
埋,盲孔 buried blind via ,e|"p[z~T
任意层内部导通孔 any layer inner via hole =LY`K#
全部钻孔 all drilled hole o]V.6Ge-
定位孔 toaling hole {1=|H$wKg
无连接盘孔 landless hole z-3.%P2g
中间孔 interstitial hole $+2QbEk&-
无连接盘导通孔 landless via hole v`L]dY4,
引导孔 pilot hole ).HA#!SE
端接全隙孔 terminal clearomee hole ].Bx"L!B
准尺寸孔 dimensioned hole [Page] zT}vaU6
在连接盘中导通孔 via-in-pad R68:=E4
孔位 hole location }.s%J\ckx
孔密度 hole density K:9AP{+
孔图 hole pattern ]Vj($O:
钻孔图 drill drawing An}RD73!w
装配图assembly drawing ;jx[ +
参考基准 datum referan | )
cJ
1) 元件设备 yQ^, >eh
|3FGMg%
三绕组变压器:three-column transformer ThrClnTrans WnGi;AGH=1
双绕组变压器:double-column transformer DblClmnTrans -Sh&x
电容器:Capacitor "N'W~XPG
并联电容器:shunt capacitor 22ySMtxn
电抗器:Reactor ho6hjhS|u
母线:Busbar A|K=>7n]U
输电线:TransmissionLine [< g9jX5
发电厂:power plant @x*xgf
断路器:Breaker L1+s0g>
刀闸(隔离开关):Isolator tz?3R#rM
分接头:tap n>,GmCo
电动机:motor k:V9_EI=
(2) 状态参数 T)<^S(57
o=!_.lDF:
有功:active power Q3hSWXq'
无功:reactive power fp(zd;BSQ
电流:current *otgI"y\
容量:capacity ]Hl{(v\HO
电压:voltage PepR]ym
档位:tap position [X /s^42
有功损耗:reactive loss >h:'Z*9
无功损耗:active loss ?Hdu=+ZV
功率因数:power-factor MBjAe!,-
功率:power [;yH.wn#5
功角:power-angle _U LzA
电压等级:voltage grade `<~=6H
空载损耗:no-load loss 9fs-|E[5
铁损:iron loss 2[=3-1c
铜损:copper loss !#%>,X#+
空载电流:no-load current 7.
$wK.
阻抗:impedance Wj!+
E{y<r
正序阻抗:positive sequence impedance NCT:!&
负序阻抗:negative sequence impedance a {x3FQ
零序阻抗:zero sequence impedance 6~jAh@-
电阻:resistor x8C\&ivn
电抗:reactance y'b*Dk{
电导:conductance bo DD?0.|
电纳:susceptance ex`T9j.=B
无功负载:reactive load 或者QLoad p-\->_9)y`
有功负载: active load PLoad 9MO=f^f-
遥测:YC(telemetering) S"?fa)~
遥信:YX 8 3/WWL }
励磁电流(转子电流):magnetizing current 2?6]Xbs{
定子:stator lw~
V
功角:power-angle J2
)h":2
上限:upper limit S:i#|T."
下限:lower limit 4sORp^t'Q
并列的:apposable (_@]-
高压: high voltage .`_iWfK
低压:low voltage p/nATvh$
中压:middle voltage HnjA78%i
电力系统 power system "P|n'Mx
发电机 generator #C.
励磁 excitation ,W[J@4.
励磁器 excitor )qMbk7:v\
电压 voltage mj9sX^$dE
电流 current Ua:@,};
母线 bus ^$%
Sg//
变压器 transformer <b *sn]l
升压变压器 step-up transformer U$OI]Dd9
高压侧 high side J;^ PM:6
输电系统 power transmission system P%Vq#5
输电线 transmission line z k}AGw
固定串联电容补偿fixed series capacitor compensation uY>M3h#qx
稳定 stability 0,m]W)
电压稳定 voltage stability +'5I8FE-
功角稳定 angle stability 8kdJtEW3
暂态稳定 transient stability vK+reXE
电厂 power plant EZjtZMnj
能量输送 power transfer Bf#cBI
交流 AC 8TAJ#Lm
装机容量 installed capacity [PUu9rz#
电网 power system eBxm
落点 drop point l"}_+5
开关站 switch station T_D] rMl
双回同杆并架 double-circuit lines on the same tower _ {wP:dI "
变电站 transformer substation |BZrV3;H
补偿度 degree of compensation 2'- "&d+O
高抗 high voltage shunt reactor *IWW,@0
无功补偿 reactive power compensation %aw.o*@:
故障 fault 4P1}XYD-2
调节 regulation *@PM,tS;
裕度 magin AnX<\7bc}
三相故障 three phase fault YK6'/2!
故障切除时间 fault clearing time yj_> G
极限切除时间 critical clearing time UQ0<sI=
切机 generator triping EZ|v,1`e
高顶值 high limited value ;9h;oB@
强行励磁 reinforced excitation DZC@^k \E
线路补偿器 LDC(line drop compensation) 8aW El%
机端 generator terminal n }A!aC
静态 static (state) |]@Pq[Hn|
动态 dynamic (state) YcDKRyrt
单机无穷大系统 one machine - infinity bus system !*"fWahv
机端电压控制 AVR HW~-GcU-o
电抗 reactance D%yY&q;
电阻 resistance u)<s*jk
功角 power angle jci,]*X4
有功(功率) active power 9>9EZ?4m
无功(功率) reactive power `wt so
功率因数 power factor 1]~w?)..'
无功电流 reactive current 3rKJ<(-2/
下降特性 droop characteristics L0!CHP/nRS
斜率 slope ;H~<.QW
额定 rating 9ZJ 8QH
变比 ratio %Rn*oV
参考值 reference value HVHv,:bPo
电压互感器 PT (VjU ,'h
分接头 tap _;;Zz&c
下降率 droop rate i}DS+~8v
仿真分析 simulation analysis 9ET1Er{4
传递函数 transfer function ,oA<xP-*
框图 block diagram LO{Axf%
受端 receive-side 4_=2|2Wz[
裕度 margin s<FBr,
同步 synchronization [MFnS",7c
失去同步 loss of synchronization 0Z8"f_GK
阻尼 damping I8
:e`L
摇摆 swing qtZ?
kJ
保护断路器 circuit breaker 6qH0]7m aI
电阻:resistance n^T,R
电抗:reactance bu]"?bc
阻抗:impedance HTOr
电导:conductance qy3@>
1G
电纳:susceptance