1 backplane 背板 X\?e=rUfn
2 Band gap voltage reference 带隙电压参考 Ou~|Q&f'
3 benchtop supply 工作台电源 ORPQ1%tu
4 Block Diagram 方块图 5 Bode Plot 波特图 S!0ocS!t
6 Bootstrap 自举 wl1JKiodg
7 Bottom FET Bottom FET k<xiP@b{y
8 bucket capcitor 桶形电容 i"}%ib*X
9 chassis 机架 nRpZ;X)'.
10 Combi-sense Combi-sense o|\0IG(\
11 constant current source 恒流源 V+/Vk1
12 Core Sataration 铁芯饱和 sK~d{)+T
13 crossover frequency 交叉频率 b?#k
14 current ripple 纹波电流 fL9R{=I%
15 Cycle by Cycle 逐周期 _ri1RK,
16 cycle skipping 周期跳步 l4oI5)w
17 Dead Time 死区时间 f
n9[Li
18 DIE Temperature 核心温度 -lM4 *+f
19 Disable 非使能,无效,禁用,关断 S/j~1q_|G
20 dominant pole 主极点 S0V%JY;Gv
21 Enable 使能,有效,启用 =]h 5RC
22 ESD Rating ESD额定值 RW!D!~
23 Evaluation Board 评估板 ipB*]B F[
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ;eznONNF
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 zmf`}j[
25 Failling edge 下降沿 "^j&
^sA+
26 figure of merit 品质因数 r2A(GUz
27 float charge voltage 浮充电压 3%Jg' Tr+
28 flyback power stage 反驰式功率级 5b9v`6Kq
29 forward voltage drop 前向压降 GWZ0!V
30 free-running 自由运行 \S(:O8_"68
31 Freewheel diode 续流二极管 k,>sBk8
32 Full load 满负载 33 gate drive 栅极驱动 ,bRvj8"M
34 gate drive stage 栅极驱动级 7dl]f#uZU
35 gerber plot Gerber 图 @`<v d@
36 ground plane 接地层 e-;$Iv
37 Henry 电感单位:亨利 @,i_
KN6C
38 Human Body Model 人体模式 ^Z7])arA
39 Hysteresis 滞回 jIx5_lFe
40 inrush current 涌入电流 pqPhtWi%PJ
41 Inverting 反相 IS0RhtGy/
42 jittery 抖动 uX*H2"A
43 Junction 结点 zR2'xE*
44 Kelvin connection 开尔文连接 5?),6o);
45 Lead Frame 引脚框架 riqv v1Nce
46 Lead Free 无铅 mjbr}9
47 level-shift 电平移动 (KaP=t}
48 Line regulation 电源调整率 yyJ4r}TE
49 load regulation 负载调整率 D'e'xU
50 Lot Number 批号 ~ g$Pb[V
51 Low Dropout 低压差 #z{9:o7[-
52 Miller 密勒 53 node 节点 iivuH2/~?[
54 Non-Inverting 非反相 T_CYSS|fX
55 novel 新颖的 $FEG0&
56 off state 关断状态 PdG:aGQ>
57 Operating supply voltage 电源工作电压 p(UUH3%W
58 out drive stage 输出驱动级 CW>f;
59 Out of Phase 异相 BgLK}p^
60 Part Number 产品型号 ^y"Rdv
61 pass transistor pass transistor YK#bzu ,!
62 P-channel MOSFET P沟道MOSFET (v*$ExF
63 Phase margin 相位裕度 c #+JG
64 Phase Node 开关节点 E!J;bX5
65 portable electronics 便携式电子设备 O.S(H1z<G
66 power down 掉电 IbAGnl {
67 Power Good 电源正常 v|~ yIywf
68 Power Groud 功率地 T'2(sHk
69 Power Save Mode 节电模式 X_XeI!,b
70 Power up 上电 v/6QE;BY&Q
71 pull down 下拉 /)?]vKMiI
72 pull up 上拉 ('!90
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) X"<t3l(+
74 push pull converter 推挽转换器 @~Z:W<X
75 ramp down 斜降 z-nhL=
76 ramp up 斜升 +.MHI
77 redundant diode 冗余二极管 A][\L[8X
78 resistive divider 电阻分压器 SLRQ3<0W_
79 ringing 振 铃 O
[GG<Um
80 ripple current 纹波电流 9/R|\
81 rising edge 上升沿 }ex2tkz
82 sense resistor 检测电阻 Ro`Hm8o/
83 Sequenced Power Supplys 序列电源 )y-y-B=+T
84 shoot-through 直通,同时导通 RP&H9>
85 stray inductances. 杂散电感 p;Kw$fQ?
86 sub-circuit 子电路 knZee!FA7
87 substrate 基板 jLc4D'
88 Telecom 电信 gTZ1LJ
89 Thermal Information 热性能信息 w$UWfL(
90 thermal slug 散热片 <T JUKznO
91 Threshold 阈值 a%DnRkRr
92 timing resistor 振荡电阻 x7 jE
Ns )
93 Top FET Top FET j.X3SQb4G
94 Trace 线路,走线,引线 rmutw~nHD
95 Transfer function 传递函数 1t/#ZT!X/
96 Trip Point 跳变点 "1_eZ `
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) SUxz &xH
98 Under Voltage Lock Out (UVLO) 欠压锁定 62Yi1<kV@
99 Voltage Reference 电压参考 QcG4~DEX4
100 voltage-second product 伏秒积 he;;p ="!*
101 zero-pole frequency compensation 零极点频率补偿 JSQNx2VqQ
102 beat frequency 拍频 IBr?6_\%"4
103 one shots 单击电路 #WlIH7J8Tc
104 scaling 缩放 B'B,,Mz
105 ESR 等效串联电阻 [Page] Hj"`z6@7
106 Ground 地电位 + |MHi C
107 trimmed bandgap 平衡带隙 DQY*0\
108 dropout voltage 压差 WPiQ+(pt
109 large bulk capacitance 大容量电容 a=\r~Z7E
110 circuit breaker 断路器 4vcUHa|4
111 charge pump 电荷泵 GBIa Ul
112 overshoot 过冲 0|n1O)>J
xpt*S~
印制电路printed circuit N=lFf+
印制线路 printed wiring x\!Q[
印制板 printed board <[Ae0UK
印制板电路 printed circuit board vx /NG$
印制线路板 printed wiring board }N!I|<"/
印制元件 printed component Va>~7
印制接点 printed contact ZAVj q;bq
印制板装配 printed board assembly H->J.5~,K
板 board Zoh[tO
刚性印制板 rigid printed board GV'Y'
挠性印制电路 flexible printed circuit ZW
n j-
挠性印制线路 flexible printed wiring XqMJe'%r
齐平印制板 flush printed board y`!~JL*
金属芯印制板 metal core printed board VeidB!GyP
金属基印制板 metal base printed board -bT1Qh
X
多重布线印制板 mulit-wiring printed board ) *ocX)AE
塑电路板 molded circuit board G4][`C]8c
散线印制板 discrete wiring board ;HRIB)wF
微线印制板 micro wire board 'Y{fah
积层印制板 buile-up printed board (mIw3d8Tz
表面层合电路板 surface laminar circuit ^w'y>uFM
埋入凸块连印制板 B2it printed board $Kn{x!,"(
载芯片板 chip on board $-'p6^5
埋电阻板 buried resistance board 1TeYA6 t
母板 mother board $lmGMljF
子板 daughter board hs< )<
背板 backplane =Is.T
裸板 bare board YNV4w{>FD
键盘板夹心板 copper-invar-copper board kKwb)i
动态挠性板 dynamic flex board cXu"-/
静态挠性板 static flex board oZTKG'
可断拼板 break-away planel (;-<
@~2
电缆 cable &|'k)6Rx
挠性扁平电缆 flexible flat cable (FFC) Y}BT|
"
薄膜开关 membrane switch X}C}
混合电路 hybrid circuit `MtI>x
c
厚膜 thick film ^6tGj+D9
厚膜电路 thick film circuit R,?7|x
薄膜 thin film v8Gm;~
薄膜混合电路 thin film hybrid circuit N9 yL(2
互连 interconnection `) s]T.-
导线 conductor trace line kX!TOlk3
齐平导线 flush conductor | wuUH
传输线 transmission line >DqV^%2l
跨交 crossover uaN0X"
板边插头 edge-board contact H|&[,&M>
增强板 stiffener CqGi
2<2
基底 substrate KLi&TmIB
基板面 real estate k4Ed 7T-
导线面 conductor side 5lehASBz
元件面 component side $2N)m:X0
焊接面 solder side @X\-c2=
导电图形 conductive pattern 5{?J5
非导电图形 non-conductive pattern ;G !JKg
基材 base material QEo
i9@3
层压板 laminate U'8+YAgc
覆金属箔基材 metal-clad bade material <2Q+? L{
覆铜箔层压板 copper-clad laminate (CCL) G}ZJ}5h
复合层压板 composite laminate T 2Uu/^
薄层压板 thin laminate znm3b8ns
基体材料 basis material p2Yc:9r9+A
预浸材料 prepreg .;#Wf@V
粘结片 bonding sheet Hg<d%7.
预浸粘结片 preimpregnated bonding sheer )xKZ)SxV
环氧玻璃基板 epoxy glass substrate LDilrG)
预制内层覆箔板 mass lamination panel tB-0wD=PR
内层芯板 core material i#c1ZC
粘结层 bonding layer A#/O~-O^
粘结膜 film adhesive vhe[:`=a
无支撑胶粘剂膜 unsupported adhesive film :5`=9_|
覆盖层 cover layer (cover lay) !>gi9z,
增强板材 stiffener material <7-Qn(m,
铜箔面 copper-clad surface ;A^Ii>`
去铜箔面 foil removal surface (.Q.S[<Y
层压板面 unclad laminate surface :Y/>] tS4
基膜面 base film surface \C<|yD
胶粘剂面 adhesive faec
5cY([4,
原始光洁面 plate finish X6hm,0[
粗面 matt finish R'M=`33M
剪切板 cut to size panel tCZ3n
超薄型层压板 ultra thin laminate -.XICKz
A阶树脂 A-stage resin %NH#8#';2
B阶树脂 B-stage resin ry^FJyjW
C阶树脂 C-stage resin \v|nRn,`-
环氧树脂 epoxy resin V $'~2v{_
酚醛树脂 phenolic resin k'H+l]=
聚酯树脂 polyester resin XEK% \o}
聚酰亚胺树脂 polyimide resin U7GgGMw
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin }.+{M.[}
丙烯酸树脂 acrylic resin LU'<EXUbY
三聚氰胺甲醛树脂 melamine formaldehyde resin 9
GEMmo3
多官能环氧树脂 polyfunctional epoxy resin r1vF/yt(
溴化环氧树脂 brominated epoxy resin -|Z[GN:
环氧酚醛 epoxy novolac )w3?o#@
氟树脂 fluroresin Y8$Y]2
硅树脂 silicone resin b@6hGiqx
硅烷 silane 5W%^g_I
聚合物 polymer q.xt%`@aA
无定形聚合物 amorphous polymer ^r4@C2#vzJ
结晶现象 crystalline polamer H]i.\2z
双晶现象 dimorphism 2L\}
共聚物 copolymer qIXo_H&\C
合成树脂 synthetic /#WRd}IjK
热固性树脂 thermosetting resin [Page] x?5D>M/Y
热塑性树脂 thermoplastic resin G3Z>,"w;=
感光性树脂 photosensitive resin .X2fu/}
环氧值 epoxy value >"Tivc5
双氰胺 dicyandiamide _SVIY@K|/
粘结剂 binder Vp"=8p#k
胶粘剂 adesive 3
VNPdXsh
固化剂 curing agent ,q[aV 6kO
阻燃剂 flame retardant 0j@nOj(3
遮光剂 opaquer o p{DPUO0
增塑剂 plasticizers ,tZJSfHB
不饱和聚酯 unsatuiated polyester g3fxf(iY(
聚酯薄膜 polyester ,Z_aZD4
聚酰亚胺薄膜 polyimide film (PI) P|0dZHpT
聚四氟乙烯 polytetrafluoetylene (PTFE) ->H4!FS
增强材料 reinforcing material `1O<UJX
折痕 crease HV*Dl$
云织 waviness <in#_Of{E
鱼眼 fish eye `lI(SS]w
毛圈长 feather length Oq[2<ept
厚薄段 mark bQTkW<7gh
裂缝 split x-hr64WFK
捻度 twist of yarn moop.}O<
浸润剂含量 size content
@
OSSqH
浸润剂残留量 size residue !PAuMj)P
处理剂含量 finish level F' NX
偶联剂 couplint agent /"q
wC
断裂长 breaking length D]P_tJI
吸水高度 height of capillary rise \E}YtN#
湿强度保留率 wet strength retention hN#A3FFo L
白度 whitenness #L3heb&9
导电箔 conductive foil S)n+E\c
铜箔 copper foil `jI$>{oa
压延铜箔 rolled copper foil cN{(XmX5n
光面 shiny side k'(d$;Jgr
粗糙面 matte side 1o
Z!Up0
处理面 treated side vJ&g3ky
防锈处理 stain proofing :"ta#g'
双面处理铜箔 double treated foil -g5o+RT@
模拟 simulation `l%)0)T
逻辑模拟 logic simulation @N(*1,s2
电路模拟 circit simulation c] '-:=
时序模拟 timing simulation :gwM$2vv
模块化 modularization ^9jrI
设计原点 design origin p-qt?A
优化(设计) optimization (design) 9/yE\p.
供设计优化坐标轴 predominant axis NKy Ksu
表格原点 table origin ^8z~`he=_J
元件安置 component positioning U8||)+
比例因子 scaling factor $2><4~T;|A
扫描填充 scan filling I1Jhvyd?$
矩形填充 rectangle filling $'I-z.G V
填充域 region filling UG~/
实体设计 physical design ;A\SbLM
逻辑设计 logic design Yg~$1b@
逻辑电路 logic circuit ukInS:7
层次设计 hierarchical design 5`3Wua
自顶向下设计 top-down design 0t^Tm0RzH
自底向上设计 bottom-up design ab@1JAgs
费用矩阵 cost metrix CRh.1-
元件密度 component density 'xG:v)(
自由度 degrees freedom o<\uHr3
出度 out going degree SQSPdR+
入度 incoming degree H,Y+n)5
曼哈顿距离 manhatton distance izvwXC
欧几里德距离 euclidean distance CI8bHY$
网络 network 0W6jF5T
阵列 array ?D,8lABkT
段 segment S^zt>
逻辑 logic GKg&lM!O$
逻辑设计自动化 logic design automation &BZjQK
分线 separated time nf2[hx@=U
分层 separated layer @dHQ}Ni
定顺序 definite sequence "NMSLqO
导线(通道) conduction (track) \Ctl(uj
导线(体)宽度 conductor width DKG99biJN
导线距离 conductor spacing !5VT[w
1
导线层 conductor layer eKv{N\E
导线宽度/间距 conductor line/space QIWfGVc-
第一导线层 conductor layer No.1 TGSkJ 1Lx
圆形盘 round pad n#dvBK0M
方形盘 square pad NGs@z^&V
菱形盘 diamond pad aS3Fvk0R{h
长方形焊盘 oblong pad >s;>"]
子弹形盘 bullet pad bMvHAtp
泪滴盘 teardrop pad ej;\a:JL
雪人盘 snowman pad -"}mmTa*<
形盘 V-shaped pad V 6qF9+r&e?
环形盘 annular pad ;3P~eeQR
非圆形盘 non-circular pad D>`lN
隔离盘 isolation pad ibqJ'@{=e
非功能连接盘 monfunctional pad =}xH6^It
偏置连接盘 offset land ;X}!;S%K
腹(背)裸盘 back-bard land ( kFg2kG
盘址 anchoring spaur |qq7vx
连接盘图形 land pattern iAn]hVW
连接盘网格阵列 land grid array $8;`6o`
孔环 annular ring @ r G=>??k
元件孔 component hole \ 0J&^C
安装孔 mounting hole {~0r3N4Zl
支撑孔 supported hole QG8X{'
非支撑孔 unsupported hole Pq<]`9/w^w
导通孔 via F&6Xo]?
镀通孔 plated through hole (PTH) H"vy[/UcR
余隙孔 access hole abw7{%2
盲孔 blind via (hole) Gi7p`F.
埋孔 buried via hole tGVC"a
埋,盲孔 buried blind via =*'K'e>P3
任意层内部导通孔 any layer inner via hole b!gvvg<
全部钻孔 all drilled hole +m]Kj3-z@
定位孔 toaling hole FI=]K8
无连接盘孔 landless hole =&-+{txs
中间孔 interstitial hole NA-)7i*>J
无连接盘导通孔 landless via hole 3OvQ,^[J4
引导孔 pilot hole IM 8lA
端接全隙孔 terminal clearomee hole 6JUjT]S%
准尺寸孔 dimensioned hole [Page] -8pQI
在连接盘中导通孔 via-in-pad ;%V)lP "o
孔位 hole location rL3 f%L
孔密度 hole density ]`H8r y2
孔图 hole pattern \ Q E?.Fx
钻孔图 drill drawing t{g7 :A
装配图assembly drawing SMIr@*R
参考基准 datum referan k=``Avp?
1) 元件设备 L>>Cx`ASi
M_ii
三绕组变压器:three-column transformer ThrClnTrans '\4 @
双绕组变压器:double-column transformer DblClmnTrans _I
A{I
电容器:Capacitor 5fuB((fd(
并联电容器:shunt capacitor [W,} &
电抗器:Reactor kr{eC/Q"
母线:Busbar wzNGL{3
输电线:TransmissionLine Pp~:e}
发电厂:power plant k*$[V17
断路器:Breaker ,5J}Wo?Q}
刀闸(隔离开关):Isolator am(jmf::
分接头:tap m|%ly
电动机:motor l
4e`-7
(2) 状态参数
TD6MP9L
;lU]ilYv
有功:active power 0.kQqy~5
无功:reactive power r?:xD(}Q
电流:current )D>= \Me
容量:capacity Di>B:=
电压:voltage Kjfpq!NYE
档位:tap position p6|RV(?8
有功损耗:reactive loss /KLs+^c5
无功损耗:active loss p*OpO&oodu
功率因数:power-factor gkRbb
功率:power "79"SSfOc
功角:power-angle i?D
KKjN$
电压等级:voltage grade ai@hQJ*
空载损耗:no-load loss 'pQ\BH
铁损:iron loss 9aKt (g6
铜损:copper loss ON
q =b I*
空载电流:no-load current b9cY
阻抗:impedance MbJ|6g99
正序阻抗:positive sequence impedance Z`{ZV5
负序阻抗:negative sequence impedance X|wg7>kh*`
零序阻抗:zero sequence impedance K! e51P
电阻:resistor $Q'S8TU
电抗:reactance G
;fc8a[X
电导:conductance .^aqzA=]
电纳:susceptance 2uy<wJE>
无功负载:reactive load 或者QLoad 7'1 +i
有功负载: active load PLoad qG?svt
遥测:YC(telemetering) #[ZNiaWT
遥信:YX @?YO_</
励磁电流(转子电流):magnetizing current KE*8Y4#9
定子:stator \\{+t<?J
功角:power-angle :$5$H
上限:upper limit /@`kM'1:
下限:lower limit j8|N;;MN
并列的:apposable
SdM@7%UK
高压: high voltage V9cKl[
低压:low voltage ObIL w
中压:middle voltage zEN3Nn.8
电力系统 power system bz4TbGg]
发电机 generator 9fQFsI
励磁 excitation uE%$<o*#
励磁器 excitor j|X>:!4r
电压 voltage w_hN2eYo&e
电流 current =>en<#[\:
母线 bus \I[50eh|
变压器 transformer x!RpRq9
升压变压器 step-up transformer 7w?V0pLwn8
高压侧 high side p81Vt
输电系统 power transmission system V_p[mSKJv
输电线 transmission line UD}#c:I
固定串联电容补偿fixed series capacitor compensation gSn9L)k(O
稳定 stability `+?g96
电压稳定 voltage stability $7
FT0?kG
功角稳定 angle stability ;(I')[R"
暂态稳定 transient stability M>LgEc-v67
电厂 power plant 2n|]&D3V"'
能量输送 power transfer |jT^[q(z
交流 AC \[yg f6#[
装机容量 installed capacity XjINRC8^4
电网 power system B;=-h(E}vJ
落点 drop point X+LG Z4]D
开关站 switch station Fh0cOp(
双回同杆并架 double-circuit lines on the same tower e$=UA%
变电站 transformer substation }X?M6;$)
补偿度 degree of compensation |ryV7VJ8
高抗 high voltage shunt reactor W0_
pO
无功补偿 reactive power compensation Tc.k0n%W:b
故障 fault SNl% ?j|
f
调节 regulation HJ^SqSm
裕度 magin Pua|Z
x
三相故障 three phase fault ]~!?(d!J/
故障切除时间 fault clearing time {Z!x]}{M
极限切除时间 critical clearing time Ww)p&don
切机 generator triping :Y)jf
高顶值 high limited value 8DLj?M>N
强行励磁 reinforced excitation RF$2p4=[
线路补偿器 LDC(line drop compensation) vA"MTncv
机端 generator terminal +p"}F PIK
静态 static (state) [3|&!:4g6
动态 dynamic (state) *}<