1 backplane 背板 3)3$ L
2 Band gap voltage reference 带隙电压参考 qrkJ:
3 benchtop supply 工作台电源 SGUZ'}
4 Block Diagram 方块图 5 Bode Plot 波特图 OY,iz
6 Bootstrap 自举 5K {{o''
7 Bottom FET Bottom FET I9hZ&ed16
8 bucket capcitor 桶形电容 G%XjDxo$I
9 chassis 机架 iu'At7
10 Combi-sense Combi-sense ;hCUy=m.
11 constant current source 恒流源 _.+2sm
12 Core Sataration 铁芯饱和 ~pPj
13 crossover frequency 交叉频率 pe>[Ts`2F
14 current ripple 纹波电流 *x@.$=NF"
15 Cycle by Cycle 逐周期 `Oe"s_O#
16 cycle skipping 周期跳步 2SJ|$VsLaE
17 Dead Time 死区时间 #OVS]Asn}
18 DIE Temperature 核心温度 ]?UK98uS\A
19 Disable 非使能,无效,禁用,关断 gbT1d:T
20 dominant pole 主极点 ;, ^AR{+x
21 Enable 使能,有效,启用 KCi0v
22 ESD Rating ESD额定值 18AlQ+')?w
23 Evaluation Board 评估板 "4WwiI9
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. f;]C8/ W
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 0<u(!iL
25 Failling edge 下降沿 .M>g`UW
26 figure of merit 品质因数 0jMS!"k
27 float charge voltage 浮充电压 bI+ TFOP
28 flyback power stage 反驰式功率级 6a4-VX5
29 forward voltage drop 前向压降 MOIMW+n
30 free-running 自由运行 sg8j}^VI
31 Freewheel diode 续流二极管 vhL/L?NB$
32 Full load 满负载 33 gate drive 栅极驱动 3GM9ZPeN:
34 gate drive stage 栅极驱动级 b9"HTQHl
35 gerber plot Gerber 图 `+ 5,=S
36 ground plane 接地层 fB`7f
$[
37 Henry 电感单位:亨利 lzK,VZ=mM
38 Human Body Model 人体模式 *s (L!+
39 Hysteresis 滞回 %]fi;Z
40 inrush current 涌入电流 ]udH`{]
41 Inverting 反相 hg+0!DVx
42 jittery 抖动 c-=z<:Kf
43 Junction 结点 6+W`:0je
44 Kelvin connection 开尔文连接 #GIjU1-
45 Lead Frame 引脚框架 <iNxtD0
46 Lead Free 无铅 C#:L.qK
47 level-shift 电平移动 2M*84oh8P
48 Line regulation 电源调整率 y9X1X{
49 load regulation 负载调整率 x|U[|i,;
50 Lot Number 批号 1wt(pkNk
51 Low Dropout 低压差 xv~EwT)
52 Miller 密勒 53 node 节点 7R=A]@
54 Non-Inverting 非反相 TmUN@h
55 novel 新颖的 TRku(w1f
56 off state 关断状态 !z|a+{
57 Operating supply voltage 电源工作电压 ,&0iFUwN_
58 out drive stage 输出驱动级 9t_N9@
59 Out of Phase 异相 Nj$h/P
60 Part Number 产品型号 V J]S"
61 pass transistor pass transistor @%4tWE
62 P-channel MOSFET P沟道MOSFET nW!pOTJq21
63 Phase margin 相位裕度 &*;E wfgZ
64 Phase Node 开关节点 !R3ZyZcX
65 portable electronics 便携式电子设备 Iv51,0A
66 power down 掉电 *S] K@g
67 Power Good 电源正常 5<mGG;F
68 Power Groud 功率地 WQ)vu&;
69 Power Save Mode 节电模式 #({ 9M
70 Power up 上电 92=huV
71 pull down 下拉 *;Gn od<
72 pull up 上拉 wfrSI:+>
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) }TsND6Ws3
74 push pull converter 推挽转换器 X'.*I])
75 ramp down 斜降 AlhPT (
76 ramp up 斜升 |QxT"`rT
77 redundant diode 冗余二极管 9P\R?~3
78 resistive divider 电阻分压器 v 8NoD_
79 ringing 振 铃 $\vTiS'
80 ripple current 纹波电流 ZFa<{J<2
81 rising edge 上升沿 M\)(_I)V=
82 sense resistor 检测电阻 )sG/H8
83 Sequenced Power Supplys 序列电源 CZ}%\2>-v
84 shoot-through 直通,同时导通 N9X`81)t
85 stray inductances. 杂散电感 2y@y<38
86 sub-circuit 子电路 9t o2V
87 substrate 基板 ]n (:X
88 Telecom 电信 >%Nqgn$V
89 Thermal Information 热性能信息 82A[[^`
90 thermal slug 散热片 /4bHN:I]M
91 Threshold 阈值 %xhA2
92 timing resistor 振荡电阻 YCS8qEP&
93 Top FET Top FET $C`YVv%?0
94 Trace 线路,走线,引线 ,e!9WKJ
B
95 Transfer function 传递函数 v&}^8j
96 Trip Point 跳变点 1zlBkK
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 4j VFzO%.
98 Under Voltage Lock Out (UVLO) 欠压锁定 #SIIhpjA(
99 Voltage Reference 电压参考 4I7;/ZgALQ
100 voltage-second product 伏秒积 >TB Rp,;r
101 zero-pole frequency compensation 零极点频率补偿 xa$p,_W:'
102 beat frequency 拍频 O[v(kH'
103 one shots 单击电路 'c&S%Ra[3G
104 scaling 缩放 VMgO1-F
105 ESR 等效串联电阻 [Page] ~Lf>/w
106 Ground 地电位 Hsvu&>[`S
107 trimmed bandgap 平衡带隙 (5R_q.Wu
108 dropout voltage 压差 n|Smy\0
109 large bulk capacitance 大容量电容 $<v{$UOh
110 circuit breaker 断路器 R4q)FXW29
111 charge pump 电荷泵 oH]"F
112 overshoot 过冲 V{+5Fas^l
mmx;Vt$i
印制电路printed circuit f<}>*xH/k
印制线路 printed wiring ua
HB\Uc
印制板 printed board 8zWKKcf7t
印制板电路 printed circuit board aFtL_#
U
印制线路板 printed wiring board v''F\V )
印制元件 printed component XTPf~Te,=
印制接点 printed contact z3Ro*yJU
印制板装配 printed board assembly #Y;tobB
板 board @l^BW*BCo
刚性印制板 rigid printed board &<\i37y
挠性印制电路 flexible printed circuit 8@Hl0{q
挠性印制线路 flexible printed wiring $ ";NS6 1
齐平印制板 flush printed board !3T,{:gyrI
金属芯印制板 metal core printed board 1@p'><\
金属基印制板 metal base printed board 4E~!$Ustx
多重布线印制板 mulit-wiring printed board `(6g87h
塑电路板 molded circuit board 2pn8PQfg)
散线印制板 discrete wiring board Md(h-wYr
微线印制板 micro wire board cs6I
K6wo
积层印制板 buile-up printed board Y~C;M6(P
表面层合电路板 surface laminar circuit h:l4:{A64
埋入凸块连印制板 B2it printed board ^s[OvJb
载芯片板 chip on board .W1i3Z 6g
埋电阻板 buried resistance board ^,WXvOy
母板 mother board jpI=B
子板 daughter board /\C5`>x
背板 backplane ^DWhIxBh
裸板 bare board 6<N Q/*(/
键盘板夹心板 copper-invar-copper board "{Jq6):mp
动态挠性板 dynamic flex board [H&Z /.{F
静态挠性板 static flex board <oP"kh<D4
可断拼板 break-away planel cJ#|mzup
电缆 cable B9(e"cMm
挠性扁平电缆 flexible flat cable (FFC) PShluhY
薄膜开关 membrane switch wjnQK
混合电路 hybrid circuit wS%aN@ay3
厚膜 thick film whdoG{/
厚膜电路 thick film circuit 'X@>U6s
薄膜 thin film "FfIq;
薄膜混合电路 thin film hybrid circuit u/g4s (a
互连 interconnection dB%q`7O
导线 conductor trace line wdzZ41y1
齐平导线 flush conductor xKW`m
传输线 transmission line /ig'p53jL
跨交 crossover \~bx%VWW4
板边插头 edge-board contact Pe<}kS
m 4
增强板 stiffener ^geC?m
基底 substrate L4?)N&V
基板面 real estate uxsfQ%3`#
导线面 conductor side =n73bm
元件面 component side Vv J]*D+e
焊接面 solder side E`aAPk_y
导电图形 conductive pattern vE=)qn= a
非导电图形 non-conductive pattern [sF
z ;Py]
基材 base material }'.k
层压板 laminate ZlxJY%oeu
覆金属箔基材 metal-clad bade material s)<^YASg
覆铜箔层压板 copper-clad laminate (CCL) Am&PH(}L
复合层压板 composite laminate +#IsRiH%>
薄层压板 thin laminate qJ8@A}}8
基体材料 basis material c6"hk_
预浸材料 prepreg @+(TM5Ub
粘结片 bonding sheet 7UzbS,$x
预浸粘结片 preimpregnated bonding sheer M^twD*
环氧玻璃基板 epoxy glass substrate *'&mcEpg
预制内层覆箔板 mass lamination panel j9XRC9
内层芯板 core material z/&2Se:
粘结层 bonding layer L@t}UC
粘结膜 film adhesive ; M%n=+[O
无支撑胶粘剂膜 unsupported adhesive film ds9L4zfO
覆盖层 cover layer (cover lay) ]J
aV +b'O
增强板材 stiffener material vsU1Lzna6@
铜箔面 copper-clad surface gPrIu+|F
去铜箔面 foil removal surface t:?8I9d
层压板面 unclad laminate surface bw\a\/Dw
基膜面 base film surface },@1i<Bb
胶粘剂面 adhesive faec NrrnG]#p1
原始光洁面 plate finish +zz\*
粗面 matt finish vUa&9Y
剪切板 cut to size panel /v^1/i
超薄型层压板 ultra thin laminate Rl2*oOVz
A阶树脂 A-stage resin $%ts#56*
B阶树脂 B-stage resin Vs0T*4C=n
C阶树脂 C-stage resin j>KJgSs]&\
环氧树脂 epoxy resin ?k7z5ow
酚醛树脂 phenolic resin Hi{1C"%
聚酯树脂 polyester resin J4Tc q
聚酰亚胺树脂 polyimide resin (g8<"<
N?
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 1dg y-$H~
丙烯酸树脂 acrylic resin ,( ?q
三聚氰胺甲醛树脂 melamine formaldehyde resin QlmZ4fT[r
多官能环氧树脂 polyfunctional epoxy resin t|ih{0
溴化环氧树脂 brominated epoxy resin &1:_+
环氧酚醛 epoxy novolac $aFCe}3b<
氟树脂 fluroresin uR:@7n
硅树脂 silicone resin @D3Y}nR:
硅烷 silane xpb,Nzwt^
聚合物 polymer }{(dG7G+
无定形聚合物 amorphous polymer -/O_wqm#
结晶现象 crystalline polamer e[(XR_EY
双晶现象 dimorphism G; *jL4
共聚物 copolymer PDEeb.(.
合成树脂 synthetic S3G9/
热固性树脂 thermosetting resin [Page] yG`J3++
S
热塑性树脂 thermoplastic resin 2qF
?%
感光性树脂 photosensitive resin S-$N! G~!
环氧值 epoxy value (pl|RmmDz
双氰胺 dicyandiamide el;ey Ga
粘结剂 binder ])sIQ{P
胶粘剂 adesive g{_wMf
固化剂 curing agent 7t@r}rC,K
阻燃剂 flame retardant gC+PpY#2h
遮光剂 opaquer vl"l
增塑剂 plasticizers )M!6y%b67
不饱和聚酯 unsatuiated polyester Nzo;j0 [
聚酯薄膜 polyester 122%KS
聚酰亚胺薄膜 polyimide film (PI) i`Tp +e@a>
聚四氟乙烯 polytetrafluoetylene (PTFE) m4<5jC`-M
增强材料 reinforcing material 7l%]/`Y-
折痕 crease R.FC3<TTv
云织 waviness 8{t^< j$n
鱼眼 fish eye i Sm
.E
毛圈长 feather length X &z|im'd
厚薄段 mark *" ("^_x\
裂缝 split gyt[ZN_2
捻度 twist of yarn %l#i9$s
浸润剂含量 size content /:YM{,]
浸润剂残留量 size residue <yw6Om:n<
处理剂含量 finish level G=.vo3
偶联剂 couplint agent vH^6O:V
断裂长 breaking length "zn<\z$l
吸水高度 height of capillary rise .]0u#fz0y
湿强度保留率 wet strength retention $ e<1 08)]
白度 whitenness Cm~Pn"K_]
导电箔 conductive foil *u i!|;
铜箔 copper foil 1^x"P #u
压延铜箔 rolled copper foil PLkwtDi+&
光面 shiny side RWe$ZZSz!
粗糙面 matte side ,#u"$Hz8p
处理面 treated side v/fo`]zP
防锈处理 stain proofing
xe~lV
双面处理铜箔 double treated foil _XO3ml\x@
模拟 simulation e6
R<V]g
逻辑模拟 logic simulation Mx3MNX/
电路模拟 circit simulation iB]xYfQ&@V
时序模拟 timing simulation @Nm; lZK
模块化 modularization y.O%
设计原点 design origin O7M8!3Eqm
优化(设计) optimization (design) :?2@qWaL
供设计优化坐标轴 predominant axis b.LMJ'1
表格原点 table origin &!xePKvO6k
元件安置 component positioning J|uxn<E<>
比例因子 scaling factor l8XgzaW
扫描填充 scan filling mM[!g'*
矩形填充 rectangle filling OzVCqq"]
填充域 region filling Q|DVB
实体设计 physical design u\jQe@j
'
逻辑设计 logic design + Z7 L&BI
逻辑电路 logic circuit F1Jd-3ei
层次设计 hierarchical design rwJCVkF
自顶向下设计 top-down design L[|($vQ"
自底向上设计 bottom-up design (mNNTMe
费用矩阵 cost metrix 6D=9J%;
元件密度 component density uuD|%-Ng
自由度 degrees freedom hLv~N}
出度 out going degree Yq$KYB j
入度 incoming degree 2ncD,@ij
曼哈顿距离 manhatton distance ^Uj\s /
欧几里德距离 euclidean distance _5t~g_(1OK
网络 network uPmK:9]3R
阵列 array Ug VLHwkvk
段 segment !nBE[&
逻辑 logic )V6Bzn}9
逻辑设计自动化 logic design automation XY_zFF
分线 separated time :Zs i5>MT
分层 separated layer \Nvu[P
定顺序 definite sequence 5~pQ$-
导线(通道) conduction (track) ]g3RVA%\l
导线(体)宽度 conductor width >!U oS
导线距离 conductor spacing nT;Rwz$3
导线层 conductor layer KBe\)Vs
导线宽度/间距 conductor line/space N<$dbqoT|
第一导线层 conductor layer No.1 M2$.Yom[
圆形盘 round pad S`\03(zDA
方形盘 square pad yx@%x?B
菱形盘 diamond pad 2`[iTBZ=^
长方形焊盘 oblong pad M MQ^&!H
子弹形盘 bullet pad x A&RMu&
泪滴盘 teardrop pad e#5LBSP
雪人盘 snowman pad j_\?ampF
形盘 V-shaped pad V zc`gm~@
环形盘 annular pad lWR".
非圆形盘 non-circular pad 6dNW2_
隔离盘 isolation pad Bp7`W:?#"
非功能连接盘 monfunctional pad !jySID?q
偏置连接盘 offset land [J{M'+a
腹(背)裸盘 back-bard land Q|6lp
盘址 anchoring spaur PX} ~
连接盘图形 land pattern S.I3m-
连接盘网格阵列 land grid array -PG81F&K
孔环 annular ring UZV\]Y
元件孔 component hole NKSK+ll2
安装孔 mounting hole F%]ZyO9
支撑孔 supported hole #B^A"?*S
非支撑孔 unsupported hole cm'`u&S
导通孔 via , S
}
镀通孔 plated through hole (PTH) Z)7|m
余隙孔 access hole !bq3c(d
盲孔 blind via (hole) s2X<b
`
埋孔 buried via hole DH>>u
埋,盲孔 buried blind via w<P$)~6
任意层内部导通孔 any layer inner via hole J-k/#A4o
全部钻孔 all drilled hole rP7[{'%r
定位孔 toaling hole Od,P,t9
无连接盘孔 landless hole 5fT"`FL?
中间孔 interstitial hole "8-;Dq'+
无连接盘导通孔 landless via hole -Gyj]v5y`c
引导孔 pilot hole V#P`FX
端接全隙孔 terminal clearomee hole %*A|hK+G:W
准尺寸孔 dimensioned hole [Page] }t FRl
在连接盘中导通孔 via-in-pad Qf
.ASC
孔位 hole location )ZQ>h{}D
孔密度 hole density C]bre^q
孔图 hole pattern y!kU0
钻孔图 drill drawing m+a\NXWR?N
装配图assembly drawing ( Ev=kO
参考基准 datum referan J6C/`)+w
1) 元件设备 |b+ZKRW
MV?#g-5
三绕组变压器:three-column transformer ThrClnTrans ^aONuG9
双绕组变压器:double-column transformer DblClmnTrans JnY.]:
电容器:Capacitor L>>RboR}
并联电容器:shunt capacitor N+9W2n
电抗器:Reactor yW)&jZb"(
母线:Busbar w~%Rxdh?8W
输电线:TransmissionLine Ds<~JfVl
发电厂:power plant QSNPraT
断路器:Breaker E |K|AdL
刀闸(隔离开关):Isolator sq45fRAi
分接头:tap 9{cpxJ
电动机:motor )7jJ3G*
(2) 状态参数 6>Z)w}x^
4/?@ %
有功:active power ;xQNa}"V
无功:reactive power WZQ
EBXs
电流:current uf/4vz,
容量:capacity 5kx-s6`!
电压:voltage qGXY
档位:tap position B~h3naSe
有功损耗:reactive loss /=K(5Xd
无功损耗:active loss C)?tf[!_6
功率因数:power-factor bP)(4+t~
功率:power }Sr=|j
功角:power-angle n|N?[)^k
电压等级:voltage grade bn#'o(Lp
空载损耗:no-load loss =3dR-3
铁损:iron loss /_[?i"GW
铜损:copper loss eq6>C7.$
空载电流:no-load current E'cI} q
阻抗:impedance I
R|[&} z
正序阻抗:positive sequence impedance V~
q
b2$
负序阻抗:negative sequence impedance QF4)@ r{2x
零序阻抗:zero sequence impedance ;@FCaj&
电阻:resistor s`2q(`}
电抗:reactance HDYWDp
电导:conductance {X EX0|TZ
电纳:susceptance fda)t1u\8
无功负载:reactive load 或者QLoad 1'YUK"i
有功负载: active load PLoad [C`LKA$t
遥测:YC(telemetering) +:kMYL3
遥信:YX &hcD/*_Z
励磁电流(转子电流):magnetizing current -~Chf4?<4
定子:stator VD~
%6AjyN
功角:power-angle fl}!V4
上限:upper limit k!"6mo@rd
下限:lower limit w'6sJ#ba(
并列的:apposable +.-g`Vyz*
高压: high voltage dlRTxb^Y>u
低压:low voltage @gnLY
中压:middle voltage \gFV6 H?`
电力系统 power system 2(2UAB"u
发电机 generator _ -|+k
励磁 excitation x8o/m$[,=u
励磁器 excitor 0WSOA[R%[b
电压 voltage ] B?NDxU
电流 current 8gxo{<,9
母线 bus Jbn^G7vH<6
变压器 transformer V<ii
升压变压器 step-up transformer _%wB*u,X
高压侧 high side `Jj q5:\&
输电系统 power transmission system ~X(2F#{<{
输电线 transmission line 69S*\'L
固定串联电容补偿fixed series capacitor compensation Q%:Z&lgy
稳定 stability INEE
37%
电压稳定 voltage stability 5VSc5*[
功角稳定 angle stability (tCBbPW6T?
暂态稳定 transient stability wlFK#iK
电厂 power plant _H"_&m$aDm
能量输送 power transfer :7?n)=Tx
交流 AC ,B#*<_?E5
装机容量 installed capacity X#o<))
电网 power system }ag;yf;
落点 drop point 9\VV++}s>o
开关站 switch station Oe21noL
双回同杆并架 double-circuit lines on the same tower i1 c[Gk.o
变电站 transformer substation QIfP%,LT
补偿度 degree of compensation aA]wFZ
高抗 high voltage shunt reactor Pa'N)s<
无功补偿 reactive power compensation r72zWpF!Ss
故障 fault pf&U$oR4
调节 regulation i_:#][nWX
裕度 magin P2F8[o!<
三相故障 three phase fault QJSi|&Rx&?
故障切除时间 fault clearing time [QIQpBL
极限切除时间 critical clearing time P8[k1"c!
切机 generator triping s_3a#I
高顶值 high limited value a4mRu|x
强行励磁 reinforced excitation kDG?/j90D
线路补偿器 LDC(line drop compensation) :<v@xOzxx
机端 generator terminal uANpqT}!
静态 static (state) T^ - - :1
动态 dynamic (state) ^iWJqpLe
单机无穷大系统 one machine - infinity bus system }L
@~!=q*
机端电压控制 AVR 6,!$S2(zT
电抗 reactance Dis kGq@T
电阻 resistance _zkTx7H
功角 power angle "jf_xZ$H-
有功(功率) active power MkWbPm)
无功(功率) reactive power J&bMox
功率因数 power factor I%{ 1K+V/
无功电流 reactive current t]T't='
下降特性 droop characteristics &[
,*
斜率 slope rP#&WSLVj
额定 rating >-y}t9[/
变比 ratio +1r><do;
参考值 reference value (+}44Ldt
电压互感器 PT 4 ]ko
分接头 tap 2Z ?l,M~
下降率 droop rate "-\8Y>E
仿真分析 simulation analysis ikO9p|J
传递函数 transfer function FD5OO;$
框图 block diagram -;Te+E_
受端 receive-side l5D4?`|
裕度 margin Fzt7@VNxc
同步 synchronization qC3PKlhv6
失去同步 loss of synchronization 4ves|pLET
阻尼 damping Tfx-h)oP3
摇摆 swing 53?Ati\Y)
保护断路器 circuit breaker LYiIJAZ.
电阻:resistance x`I"%pG
电抗:reactance `XM0Mm%
阻抗:impedance +|H,N7a<
电导:conductance 3S1{r
)[j
电纳:susceptance