1 backplane 背板 ;`9f<d#\
2 Band gap voltage reference 带隙电压参考 R+sT
&d
3 benchtop supply 工作台电源 WKf<%
E$
4 Block Diagram 方块图 5 Bode Plot 波特图 od;-D~
6 Bootstrap 自举 -!\3;/
7 Bottom FET Bottom FET T?9D?u?]
8 bucket capcitor 桶形电容 ,CO2d)}
9 chassis 机架 yTaMlT|
10 Combi-sense Combi-sense > =>/~dIb
11 constant current source 恒流源 m:_#kfC&K"
12 Core Sataration 铁芯饱和 YznL+TD
13 crossover frequency 交叉频率 %PW-E($o<
14 current ripple 纹波电流 ui]iOp
15 Cycle by Cycle 逐周期 hB?#b`i^
16 cycle skipping 周期跳步 C&O8fNB_
17 Dead Time 死区时间 %Tp9GGt
18 DIE Temperature 核心温度 ?Ld),A/c
19 Disable 非使能,无效,禁用,关断 eDd&vf
20 dominant pole 主极点 QW..=}pL
21 Enable 使能,有效,启用 R6~6b&-8
22 ESD Rating ESD额定值 /X8a3Eqp9
23 Evaluation Board 评估板 74_?@Z(
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. kn#?+Q
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 %/eG{oh-
25 Failling edge 下降沿 2e6P?pX~2
26 figure of merit 品质因数 qMaO1cE\
27 float charge voltage 浮充电压 v9T3=
28 flyback power stage 反驰式功率级 5a |[cR
29 forward voltage drop 前向压降 51:5rN(_
30 free-running 自由运行 IO7z}![V;
31 Freewheel diode 续流二极管 ~'*23]j
32 Full load 满负载 33 gate drive 栅极驱动 4n#u?)
34 gate drive stage 栅极驱动级 /}u:N:HA%
35 gerber plot Gerber 图 H_g]q
36 ground plane 接地层 Y1o[|ytW
37 Henry 电感单位:亨利 #h.N#{9
38 Human Body Model 人体模式 ~ESw* 6s9
39 Hysteresis 滞回 3 EAr=E]
40 inrush current 涌入电流 Tw \@]fw
41 Inverting 反相 Ov"wcJ
42 jittery 抖动 A._CCou
43 Junction 结点 )g=mv*9>
44 Kelvin connection 开尔文连接 6cg,L:j#
45 Lead Frame 引脚框架 x~'_;>]r_
46 Lead Free 无铅 zt2#K
47 level-shift 电平移动 B^19![v3T
48 Line regulation 电源调整率 l="(Hp%b
49 load regulation 负载调整率 yI=nu53BV
50 Lot Number 批号 )fXxkOd
51 Low Dropout 低压差 -/3h&g
52 Miller 密勒 53 node 节点 nUY)LnI
54 Non-Inverting 非反相 E;yr46
55 novel 新颖的 Zy Df@(z`
56 off state 关断状态 DN8I[5O
57 Operating supply voltage 电源工作电压 !d0$cF):
58 out drive stage 输出驱动级 p;[.&oJ
59 Out of Phase 异相 x8z6 <
60 Part Number 产品型号 4o''C |ND
61 pass transistor pass transistor XffHF^l9F
62 P-channel MOSFET P沟道MOSFET ?@A@;`0Y
63 Phase margin 相位裕度 %jUZc:06
64 Phase Node 开关节点 GDj_+G;tO\
65 portable electronics 便携式电子设备 $sL+k 'dY
66 power down 掉电 &xj40IZ
67 Power Good 电源正常 -Hi_g@i*XW
68 Power Groud 功率地 WOYZ
69 Power Save Mode 节电模式 C#&b`
70 Power up 上电 8}z PDs
71 pull down 下拉 L7II>^"B
72 pull up 上拉 I%?M9y.u6
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) N9c#N%cu
74 push pull converter 推挽转换器 *nM.`7g*[
75 ramp down 斜降 G4F~V't
76 ramp up 斜升 qyIy xJ
77 redundant diode 冗余二极管 e mq%"
;.
78 resistive divider 电阻分压器 ,!~U5~
79 ringing 振 铃 e?aSM
80 ripple current 纹波电流 (ds*$]
81 rising edge 上升沿 RvW>kATb_F
82 sense resistor 检测电阻 a
8jG')zg
83 Sequenced Power Supplys 序列电源 `Q^Vm3h
84 shoot-through 直通,同时导通 m<9W#
85 stray inductances. 杂散电感 [s!c c:JR
86 sub-circuit 子电路 V[|k:($
87 substrate 基板 Z*5]qh2r8
88 Telecom 电信 J0Y-e39 `
89 Thermal Information 热性能信息 [h
:FJ
90 thermal slug 散热片 8j%lM/ v
91 Threshold 阈值 LZ9IE>sj
92 timing resistor 振荡电阻 Ks7kaX
93 Top FET Top FET PDh1*bf{u
94 Trace 线路,走线,引线
XN'X&J
95 Transfer function 传递函数 CV,[x[L#{
96 Trip Point 跳变点 K[|d7e
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) UUql"$q
98 Under Voltage Lock Out (UVLO) 欠压锁定 zPoIs@
99 Voltage Reference 电压参考 <Gu dx>I
100 voltage-second product 伏秒积 Y6@A@VJ
101 zero-pole frequency compensation 零极点频率补偿 yYTiAvN
102 beat frequency 拍频 'uOp?g' 7
103 one shots 单击电路 _^ @}LVv+E
104 scaling 缩放 \+w -{"u$
105 ESR 等效串联电阻 [Page] aKCXV[PO
106 Ground 地电位 h:+>=~\
107 trimmed bandgap 平衡带隙 C>7k|;BvF
108 dropout voltage 压差 eVWnD,'
109 large bulk capacitance 大容量电容 aI8K*D )@
110 circuit breaker 断路器 LNU9M>
111 charge pump 电荷泵 Xl%&hM
112 overshoot 过冲 ni]gS0/
: C;=<$
印制电路printed circuit { l LUZM
印制线路 printed wiring +kl@`&ga
印制板 printed board ?z60b=f8
印制板电路 printed circuit board 15gI-Qb
印制线路板 printed wiring board )f'cy@b
印制元件 printed component (85F1"Jp
印制接点 printed contact crC];LMl/
印制板装配 printed board assembly `&>!a
板 board 8c3X9;a
刚性印制板 rigid printed board Q_1EAxt
挠性印制电路 flexible printed circuit &ze'V
, :
挠性印制线路 flexible printed wiring <H E'5b
齐平印制板 flush printed board mrd(\&EhA
金属芯印制板 metal core printed board R{6.O+j`
金属基印制板 metal base printed board ;nv4lxm
多重布线印制板 mulit-wiring printed board c#`Z[
塑电路板 molded circuit board XUUS N
散线印制板 discrete wiring board +|(
eP_
微线印制板 micro wire board WE`Y!
积层印制板 buile-up printed board .6OE8w
1
表面层合电路板 surface laminar circuit o *I-~k
埋入凸块连印制板 B2it printed board Vv=d*
载芯片板 chip on board Nc]oAY
埋电阻板 buried resistance board UmQ 9_H 7
母板 mother board $+[HJ{
子板 daughter board rMf& HX
背板 backplane jPA?0h
裸板 bare board ycCEXu2F
键盘板夹心板 copper-invar-copper board >48zRi\N
动态挠性板 dynamic flex board S <|e/![@
静态挠性板 static flex board tM]qR+
可断拼板 break-away planel ,1F3";`n[
电缆 cable b\VY)=U
挠性扁平电缆 flexible flat cable (FFC) u&
:-&gva
薄膜开关 membrane switch [al$7R&
混合电路 hybrid circuit b^5rV5d
厚膜 thick film gnB%/g[_
厚膜电路 thick film circuit M.!U;U<?
薄膜 thin film }3^t,>I=,6
薄膜混合电路 thin film hybrid circuit aeE9dV~
互连 interconnection Y R#_<o
导线 conductor trace line QSEf
齐平导线 flush conductor MBDu0
[c
传输线 transmission line Gv6EJV1i
跨交 crossover xC!, v 0&
板边插头 edge-board contact Q6kkMLh
增强板 stiffener 8KT|ixs
基底 substrate Y-@K@Zu]?
基板面 real estate N ~g'Z
`
导线面 conductor side ;&^S-+
元件面 component side S#_i<u$$
焊接面 solder side Y*B}^!k6
导电图形 conductive pattern Yep(,J~'
非导电图形 non-conductive pattern z';p275
基材 base material XNf%vC>
层压板 laminate mn?<
Zz
覆金属箔基材 metal-clad bade material J/M1#sE
覆铜箔层压板 copper-clad laminate (CCL) AAxY{Z-4
复合层压板 composite laminate PDzVXLpC
薄层压板 thin laminate DU4NPys]y
基体材料 basis material X'IW&^kI
预浸材料 prepreg `\(Fax
粘结片 bonding sheet ~z ^VMr
预浸粘结片 preimpregnated bonding sheer
$F`jM/B6
环氧玻璃基板 epoxy glass substrate tB'F`HM:mq
预制内层覆箔板 mass lamination panel 7y&Fb
内层芯板 core material }>6=(!
粘结层 bonding layer mfIY7DP
粘结膜 film adhesive KaZ*HPe(
无支撑胶粘剂膜 unsupported adhesive film lnEc5J@c>i
覆盖层 cover layer (cover lay) 8h78Zb&[
增强板材 stiffener material "$;=8O5O
铜箔面 copper-clad surface ^g$k4
去铜箔面 foil removal surface /KO!s,Nk
层压板面 unclad laminate surface &-470Z%/
基膜面 base film surface ;m,lS_[c
胶粘剂面 adhesive faec 5-0
原始光洁面 plate finish <bDjAVq
粗面 matt finish .1XZ9M
剪切板 cut to size panel 3x#=@i
超薄型层压板 ultra thin laminate xO`w|k
A阶树脂 A-stage resin |qE"60&"}
B阶树脂 B-stage resin 4r\Sbh
C阶树脂 C-stage resin JR<#el
环氧树脂 epoxy resin &kB[jz_[A
酚醛树脂 phenolic resin T?I&n[Y|
聚酯树脂 polyester resin U59uP
7n
聚酰亚胺树脂 polyimide resin ?>N82#9Q
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin WIb\+!
丙烯酸树脂 acrylic resin L,!Z
三聚氰胺甲醛树脂 melamine formaldehyde resin 6d&BN7B
多官能环氧树脂 polyfunctional epoxy resin g^26Gb.
溴化环氧树脂 brominated epoxy resin w;vp X>
环氧酚醛 epoxy novolac 0|nvi=4~e|
氟树脂 fluroresin 2-ev7:
硅树脂 silicone resin xG
7;Ps4L
硅烷 silane WW2VW-Hk
聚合物 polymer MeW8aLr
无定形聚合物 amorphous polymer JAj<*TB.%
结晶现象 crystalline polamer XtRfzqg?K
双晶现象 dimorphism w:I^iI.
共聚物 copolymer Ih!UL:Ckh
合成树脂 synthetic ELeR5xT
热固性树脂 thermosetting resin [Page] |tP1,[w">
热塑性树脂 thermoplastic resin d~tG#<^`
感光性树脂 photosensitive resin oJVpNE[3]
环氧值 epoxy value ~j" aJ /
双氰胺 dicyandiamide p+@Wh3
粘结剂 binder b{)9?%_
胶粘剂 adesive D "j
=|4S#
固化剂 curing agent 5F+5J)h
阻燃剂 flame retardant BoG/Hd.S
遮光剂 opaquer 4JKB6~Y
增塑剂 plasticizers Qf0$Z.-
不饱和聚酯 unsatuiated polyester ?^mgK9^v@
聚酯薄膜 polyester N*$<Kjw
聚酰亚胺薄膜 polyimide film (PI) ]|<PV5SY3.
聚四氟乙烯 polytetrafluoetylene (PTFE) *E+2E^B
增强材料 reinforcing material m>k
j @^SQ
折痕 crease p%+ 0^]v1
云织 waviness >Bq;Z}EV
鱼眼 fish eye 4%LG9hS
毛圈长 feather length PwQW5,,h0
厚薄段 mark 9xP{#Qa
裂缝 split 3hab51J
捻度 twist of yarn f)H6 nl7r
浸润剂含量 size content Gg|'T}0X
浸润剂残留量 size residue Z2)f$ c
处理剂含量 finish level LO[1xE9
偶联剂 couplint agent yc|C}oQF
断裂长 breaking length n{d}]V@
吸水高度 height of capillary rise DalQ.
湿强度保留率 wet strength retention wXPNfV<(2
白度 whitenness G]E$U]=9r:
导电箔 conductive foil *yKsgH
铜箔 copper foil N~{0QewMI'
压延铜箔 rolled copper foil + L;[-]E8
光面 shiny side q~p,A>K
粗糙面 matte side MVg`6&oH
处理面 treated side ZLyJ
防锈处理 stain proofing )&1yt4
x6%
双面处理铜箔 double treated foil T?!^-PD9*
模拟 simulation Xx[
LK
逻辑模拟 logic simulation
2_vE
电路模拟 circit simulation E}lU?U5i
时序模拟 timing simulation V[wEn9
模块化 modularization L$zT`1Hy
设计原点 design origin Oh6;o1UI
优化(设计) optimization (design) 8xj4N%PA
供设计优化坐标轴 predominant axis ?)<zrE5p
表格原点 table origin ?4Lb *{R
元件安置 component positioning iN*d84KTP
比例因子 scaling factor !s.G$ JS<
扫描填充 scan filling MVjc.^
矩形填充 rectangle filling $qD8vu )|j
填充域 region filling j8?$Hk
实体设计 physical design b;]'Bo0K
逻辑设计 logic design (sS[F-2R7
逻辑电路 logic circuit *0 i
层次设计 hierarchical design B5#a
4G.
自顶向下设计 top-down design fdho`juFa
自底向上设计 bottom-up design 9V?MJZ@aG
费用矩阵 cost metrix 86/CA[Y-
元件密度 component density :|<D(YA
自由度 degrees freedom a: iIfdd4'
出度 out going degree $MKx\qx}
入度 incoming degree dmP*2
曼哈顿距离 manhatton distance 1k2Ck
欧几里德距离 euclidean distance ex'd^y
网络 network @MtF^y
阵列 array =zVbZ7
段 segment $msT,$NJ
逻辑 logic LN?T$H
逻辑设计自动化 logic design automation j0=`Jf
分线 separated time @WhcY*R2
分层 separated layer XS9k&~)*
定顺序 definite sequence uAzVa!)
导线(通道) conduction (track) ~l CG37
导线(体)宽度 conductor width z9h`sY~
导线距离 conductor spacing IZJV6clM
导线层 conductor layer +;Cq>1x,
导线宽度/间距 conductor line/space {zbH.V[
第一导线层 conductor layer No.1 ji A$6dZU
圆形盘 round pad 4I:Jb;k>
方形盘 square pad SwC,=S
菱形盘 diamond pad m|24)%Vj;=
长方形焊盘 oblong pad ><\mt
子弹形盘 bullet pad LE1&atq
泪滴盘 teardrop pad 1)u=&t,
雪人盘 snowman pad w$Dp m.0(
形盘 V-shaped pad V ,:>>04O
环形盘 annular pad ]YevO(
非圆形盘 non-circular pad uAVV4)
隔离盘 isolation pad gl]{mUZz}
非功能连接盘 monfunctional pad ocdXzk`
偏置连接盘 offset land C,tlp
腹(背)裸盘 back-bard land cB -XmX/
盘址 anchoring spaur "ajZ&{Z
连接盘图形 land pattern lJ7k4ua\
连接盘网格阵列 land grid array ,{'~J @
孔环 annular ring ReSP)%oW
元件孔 component hole +BzKO >
安装孔 mounting hole xFg=Tyq:
支撑孔 supported hole } k5pfz
非支撑孔 unsupported hole %#7M~RB[
导通孔 via .':SD{
镀通孔 plated through hole (PTH) /x$ jd)C
余隙孔 access hole x!I7vs~~zW
盲孔 blind via (hole) uO"@YX/
埋孔 buried via hole ]j1BEO!Bg
埋,盲孔 buried blind via bzUc;&WDz
任意层内部导通孔 any layer inner via hole T*YdGIFO
全部钻孔 all drilled hole @Chj0wWZ>
定位孔 toaling hole u=ENf1{ $>
无连接盘孔 landless hole ty-4yK#
中间孔 interstitial hole o^7NZ]m
无连接盘导通孔 landless via hole !_x-aro3<
引导孔 pilot hole T \0e8"iZ
端接全隙孔 terminal clearomee hole 2H]&3kM3X
准尺寸孔 dimensioned hole [Page] C}+(L3Z
在连接盘中导通孔 via-in-pad Dhef|E<
孔位 hole location -sc@SoS
孔密度 hole density /jS
孔图 hole pattern c-s ~q/
钻孔图 drill drawing *a$z!Ma3h
装配图assembly drawing 2OK%eVba
参考基准 datum referan M%$zor
1) 元件设备 :k(aH Ua
%PkJ7-/b|^
三绕组变压器:three-column transformer ThrClnTrans t%8*$"~X
双绕组变压器:double-column transformer DblClmnTrans DoImWNLo
电容器:Capacitor :L\@+}{(c
并联电容器:shunt capacitor !JrVh$K
电抗器:Reactor ZEApE+m
母线:Busbar s6KZV@1
输电线:TransmissionLine iLS'47
发电厂:power plant meIY00
断路器:Breaker [m('Y0fwO^
刀闸(隔离开关):Isolator d3Y#_!)
分接头:tap A:;KU
电动机:motor .O lq_wuH
(2) 状态参数 )8LCmvQ
ot,<iE#za
有功:active power GS)l{bS#[O
无功:reactive power "CLd_H*)c
电流:current -
d>)
容量:capacity <K 4zH<y
电压:voltage )7J@A%u
档位:tap position *4+;Ey
有功损耗:reactive loss 2&5"m;<
无功损耗:active loss K4l,YR;r
功率因数:power-factor :Fm+X[n
功率:power #PtV=Ee1
功角:power-angle t
ZFG`'/
电压等级:voltage grade $7PFos%@
空载损耗:no-load loss 2:2rwH }e
铁损:iron loss )2FS9h.t
铜损:copper loss 9h~>7VeZ)
空载电流:no-load current PsLuyGR.<
阻抗:impedance OGh bH a
正序阻抗:positive sequence impedance %.<w8ag
负序阻抗:negative sequence impedance rXfQ_
零序阻抗:zero sequence impedance :2
电阻:resistor :9K5zD
电抗:reactance 875V{fvPBU
电导:conductance c+-L>dsss
电纳:susceptance _X;5ORH"
无功负载:reactive load 或者QLoad Dth<hS,2J
有功负载: active load PLoad zneK)C8&q3
遥测:YC(telemetering) $NJi]g|<3
遥信:YX Z/56JYt!~
励磁电流(转子电流):magnetizing current &