1 backplane 背板 RB IOdz
2 Band gap voltage reference 带隙电压参考 x7HA722w
3 benchtop supply 工作台电源 5\xr?`VZ
4 Block Diagram 方块图 5 Bode Plot 波特图 P8<hvMF
6 Bootstrap 自举 %Uf'+!4l`
7 Bottom FET Bottom FET [z2eCH
8 bucket capcitor 桶形电容 |U EC
9 chassis 机架 a_MFQf&KV
10 Combi-sense Combi-sense VtWT{y5Ec
11 constant current source 恒流源 G0Hs,B@5?
12 Core Sataration 铁芯饱和 g>yry}>04%
13 crossover frequency 交叉频率 &8n?
14 current ripple 纹波电流 "oe!M'aj`1
15 Cycle by Cycle 逐周期 *!w25t
16 cycle skipping 周期跳步 Ev{MCu1!6
17 Dead Time 死区时间 hXc}r6<B
18 DIE Temperature 核心温度 @y5= J`@=
19 Disable 非使能,无效,禁用,关断 |g!`\@O
20 dominant pole 主极点 eIJ[0c b}
21 Enable 使能,有效,启用 2QL?]Vo
22 ESD Rating ESD额定值 +j.qZ8
23 Evaluation Board 评估板 ]+ZM/'X
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. WFem#hq
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 @D]lgq[
25 Failling edge 下降沿 W~yLl%
26 figure of merit 品质因数 Im+7<3Z
27 float charge voltage 浮充电压 j`9Qzi1
28 flyback power stage 反驰式功率级 7h`^N5H.q
29 forward voltage drop 前向压降 P$OUi!"
30 free-running 自由运行 A?r^V2+j
31 Freewheel diode 续流二极管 {[P!$
/
32 Full load 满负载 33 gate drive 栅极驱动 G|*G9nQ
34 gate drive stage 栅极驱动级 qe%V#c
35 gerber plot Gerber 图 -?z\5z
36 ground plane 接地层 nmg{%P
37 Henry 电感单位:亨利 |z*>ixK
38 Human Body Model 人体模式 mf9hFy*<4
39 Hysteresis 滞回 WqQU@sA
40 inrush current 涌入电流 7 >bMzdH
41 Inverting 反相 iD714+N(
42 jittery 抖动 V&iS~V0.
43 Junction 结点 |IN[uQ
44 Kelvin connection 开尔文连接 8kH<$9
45 Lead Frame 引脚框架 1qZG`Vz
46 Lead Free 无铅 |'$ l7
47 level-shift 电平移动 P,ydt
48 Line regulation 电源调整率 =?/&u<
49 load regulation 负载调整率 Y{+3}drJE
50 Lot Number 批号 dp<$Zw8BE
51 Low Dropout 低压差 9go))&`PJL
52 Miller 密勒 53 node 节点 X!c?CL
54 Non-Inverting 非反相 fEwifSp.
55 novel 新颖的 ;7j,MbU
56 off state 关断状态 `tVy_/3(9
57 Operating supply voltage 电源工作电压 MUwxgAG`G
58 out drive stage 输出驱动级 d.AC%&W
59 Out of Phase 异相 aq$q
~,E
60 Part Number 产品型号 KUKI qAA
61 pass transistor pass transistor M1{(OY(G
62 P-channel MOSFET P沟道MOSFET 2(+P[( N1,
63 Phase margin 相位裕度 GHG,!C
64 Phase Node 开关节点 30d#Lq
65 portable electronics 便携式电子设备 }#/lN
66 power down 掉电 JDlBVZ!
67 Power Good 电源正常 {SdO9Yy?@7
68 Power Groud 功率地 hB>^'6h+
69 Power Save Mode 节电模式 1tGgDbJU
70 Power up 上电 ix*muVBj.
71 pull down 下拉 B;W(iI
72 pull up 上拉 :0I
l|aB
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Hi8Y6|y$D
74 push pull converter 推挽转换器 C:j]43`
75 ramp down 斜降 &*gbK6JB
76 ramp up 斜升 &,MFB
77 redundant diode 冗余二极管 Ct!S Tk[2
78 resistive divider 电阻分压器 5@f5S0 Y
79 ringing 振 铃 l"\uf(0K
80 ripple current 纹波电流 YgimJsm
81 rising edge 上升沿 :1_mfX
82 sense resistor 检测电阻 (Ilsk{aB;A
83 Sequenced Power Supplys 序列电源 vpLMhf`
84 shoot-through 直通,同时导通 doLNz4W
85 stray inductances. 杂散电感 "DpKrVuG
86 sub-circuit 子电路 nzuF]vo
87 substrate 基板 ;?~
9hN!
88 Telecom 电信 7I
>J$"
89 Thermal Information 热性能信息 (STx$cya
90 thermal slug 散热片 fp;a5||5
91 Threshold 阈值 !y*oF{RZ
92 timing resistor 振荡电阻 d G0 VBE
93 Top FET Top FET 0>@[o8
94 Trace 线路,走线,引线 9@y3IiZ"}
95 Transfer function 传递函数 XU9'Rfp
96 Trip Point 跳变点 %VJW@S>j/
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) QO,+ps<
98 Under Voltage Lock Out (UVLO) 欠压锁定 '[fZt#
99 Voltage Reference 电压参考 c0[k T
100 voltage-second product 伏秒积 a.,_4;'UE1
101 zero-pole frequency compensation 零极点频率补偿 i@,]Z~]
102 beat frequency 拍频 }N,>A-P
103 one shots 单击电路 xZ+]QDKC
104 scaling 缩放 >S.91!x
105 ESR 等效串联电阻 [Page] !G+u j(
106 Ground 地电位 KyLp?!|>
107 trimmed bandgap 平衡带隙 c#pj :f*H
108 dropout voltage 压差 GYoseqZM
109 large bulk capacitance 大容量电容 fA^SD"xf
110 circuit breaker 断路器 r\xXU~$9v
111 charge pump 电荷泵 ~ 5"J(
112 overshoot 过冲 mHs:t{q
Pz`hX$
印制电路printed circuit MGybGbd
印制线路 printed wiring }4h0bI
印制板 printed board 3_zSp.E\l
印制板电路 printed circuit board gp/YjUH7k8
印制线路板 printed wiring board KB+]eI-h
印制元件 printed component D]u=PqHk2
印制接点 printed contact 4bI*jEc\[
印制板装配 printed board assembly JIV8q HC
板 board fSI %c3
刚性印制板 rigid printed board @T7PZB&xnl
挠性印制电路 flexible printed circuit 'vlrc[|/
挠性印制线路 flexible printed wiring tcOnM w
齐平印制板 flush printed board E em
g
金属芯印制板 metal core printed board |!Ists
金属基印制板 metal base printed board x6e +7"#~
多重布线印制板 mulit-wiring printed board 61:9(*4~!F
塑电路板 molded circuit board x'i0KF
散线印制板 discrete wiring board MaErx\
微线印制板 micro wire board P)1EA;
积层印制板 buile-up printed board kl<g;3
表面层合电路板 surface laminar circuit 2AK}D%jfc
埋入凸块连印制板 B2it printed board Q52bh'cuU
载芯片板 chip on board !Uy>eji}
埋电阻板 buried resistance board ^PQM;"
母板 mother board or.\)(m#(
子板 daughter board z2~87fv+
背板 backplane -tyaE
裸板 bare board ]M\q0>HoJ
键盘板夹心板 copper-invar-copper board e5OVq
,
动态挠性板 dynamic flex board U>A6eWhH
静态挠性板 static flex board P`
]ps?l
可断拼板 break-away planel j_c+.iET
电缆 cable OjATSmZ@@
挠性扁平电缆 flexible flat cable (FFC) +WLD
薄膜开关 membrane switch 4J}3,+
混合电路 hybrid circuit Tf[dZ(+\
厚膜 thick film b1)\Zi
厚膜电路 thick film circuit [*HiI=
薄膜 thin film OG}KqG!n
薄膜混合电路 thin film hybrid circuit 0WXVc
互连 interconnection ]_#SAhOR)
导线 conductor trace line Yb9cW\lr
齐平导线 flush conductor iT$d;5_pU
传输线 transmission line e~
BJvZ}Q
跨交 crossover {(0Id !
板边插头 edge-board contact LG6I_[
增强板 stiffener PUKVn+h
基底 substrate . s-5N\
基板面 real estate xVTo4-[p
导线面 conductor side Hz? ,#>{
元件面 component side u\3ZIb
焊接面 solder side >~wu3q
导电图形 conductive pattern GhiHA9.
非导电图形 non-conductive pattern ^'YHJEK
基材 base material |*1xrM:v~
层压板 laminate R8ZD#,;
覆金属箔基材 metal-clad bade material
%mL5+d-oP
覆铜箔层压板 copper-clad laminate (CCL) D 2$^"
复合层压板 composite laminate _.-#E$6s#q
薄层压板 thin laminate ?RJdn]`4j
基体材料 basis material oX{@'B
预浸材料 prepreg ^XNw$@&',
粘结片 bonding sheet Z9f/-|r5
预浸粘结片 preimpregnated bonding sheer Y{j7Q4{
环氧玻璃基板 epoxy glass substrate e# <4/FR
预制内层覆箔板 mass lamination panel %2YN,a4
内层芯板 core material Rdj8*f
粘结层 bonding layer `GS cRhbh
粘结膜 film adhesive '}CN?f|.
无支撑胶粘剂膜 unsupported adhesive film UQnBqkE
覆盖层 cover layer (cover lay) PY\W
增强板材 stiffener material j@CKO cn2
铜箔面 copper-clad surface R.O
去铜箔面 foil removal surface lJlhl7
层压板面 unclad laminate surface wBE7Bv45
基膜面 base film surface W[fT
R?n
胶粘剂面 adhesive faec H7}g!n?
原始光洁面 plate finish GI?PGAT
粗面 matt finish IqXBz.p
剪切板 cut to size panel \#2
s4RCji
超薄型层压板 ultra thin laminate %rw}u"3T
A阶树脂 A-stage resin "R8.P/ 3
B阶树脂 B-stage resin 3? };
C阶树脂 C-stage resin U Q)!|@&
环氧树脂 epoxy resin .Nk}Z9L]k
酚醛树脂 phenolic resin },v&rkwR
聚酯树脂 polyester resin G"{4'LlA
聚酰亚胺树脂 polyimide resin e) ]RA?bF
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin W oWBs)E
丙烯酸树脂 acrylic resin a^(2q{*
三聚氰胺甲醛树脂 melamine formaldehyde resin l\_x(BH
多官能环氧树脂 polyfunctional epoxy resin 8<Xq=*J+
溴化环氧树脂 brominated epoxy resin }|SIHz!R
环氧酚醛 epoxy novolac 3hH>U%`-
氟树脂 fluroresin %pH)paRAP
硅树脂 silicone resin C/bxfp{?
硅烷 silane *^uGvJXF
聚合物 polymer jmSt?M0.xV
无定形聚合物 amorphous polymer !ZX&r{pJp
结晶现象 crystalline polamer "cNg:
双晶现象 dimorphism
[A|(A$jl
共聚物 copolymer Jb7iBQ2%
合成树脂 synthetic zUJx&5/
热固性树脂 thermosetting resin [Page] IeH^Wm&^
热塑性树脂 thermoplastic resin +)?, {eE|
感光性树脂 photosensitive resin 'frWu6]<
4
环氧值 epoxy value ~m!#FTc*
双氰胺 dicyandiamide ' 4,y
粘结剂 binder b-2pzcK{#
胶粘剂 adesive hI*`> 9l
固化剂 curing agent 6={IMkmA
阻燃剂 flame retardant b By'v/
遮光剂 opaquer J_|7$
l/
增塑剂 plasticizers o1Ne+Jt
不饱和聚酯 unsatuiated polyester !X%S)VSMU
聚酯薄膜 polyester WUzSlZq
聚酰亚胺薄膜 polyimide film (PI) cW=Qh-`jU;
聚四氟乙烯 polytetrafluoetylene (PTFE) MST:.x ;
增强材料 reinforcing material 04P.p6
折痕 crease Fs?( UM
云织 waviness tp7oc_s?.
鱼眼 fish eye C?8PT/
毛圈长 feather length #,t2*tM
厚薄段 mark K1/
U
(A
裂缝 split L7X7Zt8%
捻度 twist of yarn "v@);\-V
浸润剂含量 size content TFNUv<>X
浸润剂残留量 size residue 4A;[sm^f
处理剂含量 finish level yVT&rQ"{
偶联剂 couplint agent jMTRcj];(
断裂长 breaking length o1
jk=
吸水高度 height of capillary rise b*cW<vX}~
湿强度保留率 wet strength retention )gr}<}X)B
白度 whitenness km9Gwg/zT
导电箔 conductive foil {F<)z%^
铜箔 copper foil -)p@BtMS
压延铜箔 rolled copper foil hT.4t,wa8
光面 shiny side f;e_04K
粗糙面 matte side th5
X?so
处理面 treated side dz{#"No0
防锈处理 stain proofing Dq{:R
双面处理铜箔 double treated foil (}9cD^F0n
模拟 simulation +G<}JJ'V
逻辑模拟 logic simulation &/ \O2Aw8
电路模拟 circit simulation E7V38Z
时序模拟 timing simulation qsD?dHi7
模块化 modularization G%xb0%oi]%
设计原点 design origin lq;
优化(设计) optimization (design) B0 6s6Q
供设计优化坐标轴 predominant axis C/SapX
表格原点 table origin &B?@@6
元件安置 component positioning [Bl
$IfU
比例因子 scaling factor n;e."^5
扫描填充 scan filling ;gZwQ6)i
矩形填充 rectangle filling VI(RT-S6
填充域 region filling kEp.0wL'
实体设计 physical design += X).X0K
逻辑设计 logic design !x`;>0
逻辑电路 logic circuit &mX5&e
层次设计 hierarchical design ^wvH,>Yo
自顶向下设计 top-down design :&xz5c`"04
自底向上设计 bottom-up design T+`xr0
费用矩阵 cost metrix Hlz'a1\:O]
元件密度 component density ;M%oQ>].[
自由度 degrees freedom r~8D\_=s
出度 out going degree ^>3tYg&7
入度 incoming degree 5x:Ift
*
曼哈顿距离 manhatton distance *jYHd#UZx4
欧几里德距离 euclidean distance Dm7Y#)%8
网络 network ST[2]
阵列 array O<}ep)mr
段 segment 17J} uXA
逻辑 logic ~5lKL5w
逻辑设计自动化 logic design automation Yh}zt
H
分线 separated time !F=|*j
分层 separated layer
N BV}4
定顺序 definite sequence !7ei1
导线(通道) conduction (track) M'pb8jf
导线(体)宽度 conductor width OpW eW
导线距离 conductor spacing '"!z$i~G=
导线层 conductor layer ]jHh7> D
导线宽度/间距 conductor line/space ZA*b9W
第一导线层 conductor layer No.1 i_j9/k
圆形盘 round pad F Q8RK~?`
方形盘 square pad >2l13^Y
菱形盘 diamond pad v7s]
长方形焊盘 oblong pad @rnp- +kq
子弹形盘 bullet pad (|yRo
泪滴盘 teardrop pad FK4nz2&4
雪人盘 snowman pad u=p ;A1oy
形盘 V-shaped pad V /e-ka{WS
环形盘 annular pad 8>C;
>v
非圆形盘 non-circular pad 8zP:*|D
隔离盘 isolation pad oV0LJ%
非功能连接盘 monfunctional pad k #1`
偏置连接盘 offset land }-REBrb-
腹(背)裸盘 back-bard land 3a'Rs{qxn
盘址 anchoring spaur {0NsDi>(2
连接盘图形 land pattern 9@KUqoX
连接盘网格阵列 land grid array fhBO~o+K>
孔环 annular ring yt/20a
元件孔 component hole sDLVYD
安装孔 mounting hole ]`#xR*a
支撑孔 supported hole uM6CG0
非支撑孔 unsupported hole O,F]\
导通孔 via W~XV
镀通孔 plated through hole (PTH) v`[Tl
余隙孔 access hole =:xV(GK}
盲孔 blind via (hole) 2*~JMbm
埋孔 buried via hole R-r+=x&
埋,盲孔 buried blind via %Y)PH-z
任意层内部导通孔 any layer inner via hole Zu2m%=J`
全部钻孔 all drilled hole fZka%[B
定位孔 toaling hole ?$"x^=te7
无连接盘孔 landless hole Hrd5p+j
中间孔 interstitial hole H(5S Kv5
无连接盘导通孔 landless via hole ]p4`7@@)*
引导孔 pilot hole f7EIDFX>pt
端接全隙孔 terminal clearomee hole 8Pr&F
准尺寸孔 dimensioned hole [Page] ?6gDbE%
在连接盘中导通孔 via-in-pad Q%,o8E2~
孔位 hole location 1S*8v 7
孔密度 hole density >:Rt>po8|w
孔图 hole pattern \N#
HPrv}
钻孔图 drill drawing h/0<:eZ*
装配图assembly drawing .c=$ bQ>^
参考基准 datum referan ^]#Ptoz^(l
1) 元件设备 p\\P50(-
! /|0:QQi
三绕组变压器:three-column transformer ThrClnTrans nhVK?
双绕组变压器:double-column transformer DblClmnTrans LW83Y/7
电容器:Capacitor m6~ sKJV
并联电容器:shunt capacitor Z`-)1!
电抗器:Reactor ?J^IAFy
母线:Busbar O+(. 29
输电线:TransmissionLine K^z5x#Yj
发电厂:power plant .XV]<)<K$
断路器:Breaker C&gOA8nf
刀闸(隔离开关):Isolator 9}%~w(P
分接头:tap yBYuDfeZ
电动机:motor g[=\KrTSg
(2) 状态参数 JqVBT+:
mFgb_Cd
有功:active power $4$?M[
无功:reactive power s]nGpA[!
电流:current <eud#v
容量:capacity C1#o<pv
电压:voltage BRo
R"#'
档位:tap position DU*g~{8T$
有功损耗:reactive loss MYDf`0{$_a
无功损耗:active loss k$$S!qi#
功率因数:power-factor E5Snl#Gl\0
功率:power &;NNUT>Q
功角:power-angle J]=aI>Ow
电压等级:voltage grade l(krUv
空载损耗:no-load loss ,z0~mN
铁损:iron loss UijuJ(Tle
铜损:copper loss QN2*]+/h
空载电流:no-load current ;i-D~Np|
阻抗:impedance &geOFe}R
正序阻抗:positive sequence impedance oSu|Yn
负序阻抗:negative sequence impedance .swgXiRvs
零序阻抗:zero sequence impedance >n$EeJ
电阻:resistor , IMT '*
电抗:reactance _Ssv:xc,
电导:conductance A_6/umF[ZA
电纳:susceptance |04}zU%N
无功负载:reactive load 或者QLoad hZss
有功负载: active load PLoad eBSn1n
遥测:YC(telemetering) WoClTb>F
遥信:YX W)$|Hm:H
励磁电流(转子电流):magnetizing current xyz\;3
定子:stator VxPTh\O*[
功角:power-angle 8eS@<[[F#
上限:upper limit K;ry4/Vap
下限:lower limit ?Qo_
KQ%sn
并列的:apposable iaa (ce
高压: high voltage I).^,%>Z)
低压:low voltage P5
<85t
中压:middle voltage Ow($\,
电力系统 power system +NzD/.gq
发电机 generator _,K>u6N&
励磁 excitation gk_X u
励磁器 excitor 1CS]~1Yp:
电压 voltage bb
O;AiHD
电流 current V"2AN3~&
母线 bus qed!C
变压器 transformer zhR_qW+
升压变压器 step-up transformer JI[rIL\Ey
高压侧 high side 9TXm Z
输电系统 power transmission system i*cE
输电线 transmission line qI V`zZc
固定串联电容补偿fixed series capacitor compensation d~z<,_r5c
稳定 stability Tm~#wL
+r
电压稳定 voltage stability {7pE9R 5
功角稳定 angle stability RfKxwo|M<
暂态稳定 transient stability v\?\(Y55Y
电厂 power plant vS*0CR\
能量输送 power transfer um0}`Xq ^
交流 AC EH!EyNNb
装机容量 installed capacity yS.fe[
电网 power system }&C!^v
o
落点 drop point g9lg
开关站 switch station |z<wPJ,;2
双回同杆并架 double-circuit lines on the same tower ^)0{42!]
变电站 transformer substation 2G:{ FY
补偿度 degree of compensation !,(bXa\^
高抗 high voltage shunt reactor x_H7=\pX]
无功补偿 reactive power compensation n`I
jG
故障 fault OTFu4"]M
调节 regulation 8Jy1=R*S
裕度 magin 3xCA\*
三相故障 three phase fault %ucmJ-<y#
故障切除时间 fault clearing time }HQT@&=
极限切除时间 critical clearing time szsZFyW)+
切机 generator triping zH\;pmWiN9
高顶值 high limited value CR<pB)F?a
强行励磁 reinforced excitation gZ=9Y:$
线路补偿器 LDC(line drop compensation) T[! q&kFB
机端 generator terminal buM>^A"
静态 static (state) "}x70q'>S
动态 dynamic (state) 3<'Q`H >
单机无穷大系统 one machine - infinity bus system Vqp.jF1|
机端电压控制 AVR L!8?2 \5
电抗 reactance I(kIHjV|
电阻 resistance !
{o+B^^
功角 power angle h}:5hi Jw
有功(功率) active power ?yM/j7Xn
无功(功率) reactive power b
yreleWo
功率因数 power factor Nm:<rI,^
无功电流 reactive current :)V0zHo&(
下降特性 droop characteristics %Ja{IWz9L
斜率 slope md
+`#-D\O
额定 rating fF]&{b~wk
变比 ratio F-\8f(\
参考值 reference value z^HlDwsbm
电压互感器 PT !J?=nSu
分接头 tap pYvF}8
下降率 droop rate te4"+[ $|
仿真分析 simulation analysis wm`"yNbD
传递函数 transfer function F1[[fH
框图 block diagram |/Q. "d
受端 receive-side ~4X!8b_
裕度 margin J2k'Ke97o
同步 synchronization NeZYchR
失去同步 loss of synchronization }~,cCtg:o
阻尼 damping !<^j!'2
摇摆 swing t:@A)ip
保护断路器 circuit breaker =xWW+w!r
电阻:resistance SSM>
ID
电抗:reactance "uERa(i
阻抗:impedance YZtA:>;p
电导:conductance [ Zqg"`
电纳:susceptance