1 backplane 背板 h^F^|WT$
2 Band gap voltage reference 带隙电压参考 J /3qJst
3 benchtop supply 工作台电源 2@``=0z
4 Block Diagram 方块图 5 Bode Plot 波特图 RZm}%6##ZC
6 Bootstrap 自举 t^0^He$Ot
7 Bottom FET Bottom FET ]>R|4K_
8 bucket capcitor 桶形电容 V[-4cu,Ph^
9 chassis 机架 Mq-QWx"P
10 Combi-sense Combi-sense 3F' {JP
11 constant current source 恒流源 TRwlUC3hQ
12 Core Sataration 铁芯饱和 M17oAVN7D
13 crossover frequency 交叉频率 Z$R6'EUb1
14 current ripple 纹波电流 NG-Wn+W@b
15 Cycle by Cycle 逐周期 ]3tg|?%B
16 cycle skipping 周期跳步 P(I`^x
17 Dead Time 死区时间 ,1'9l)zP
18 DIE Temperature 核心温度 ~F8M_
19 Disable 非使能,无效,禁用,关断 )Lht}I ]:
20 dominant pole 主极点 Ov1$7 r@
21 Enable 使能,有效,启用 ]>fAV(ix
22 ESD Rating ESD额定值 tx}}Kd
23 Evaluation Board 评估板 %4#,y(dO
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. {UpHHH:X#
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 (vm&&a@
25 Failling edge 下降沿 w=EUwt
26 figure of merit 品质因数 zx"'WM*
27 float charge voltage 浮充电压 DA)+)PhY7K
28 flyback power stage 反驰式功率级 * z|i{=W
F
29 forward voltage drop 前向压降 5b
X*8H
D
30 free-running 自由运行 Bw-<xwD
31 Freewheel diode 续流二极管 \F]X!#&+
32 Full load 满负载 33 gate drive 栅极驱动 pKDP1S#<
34 gate drive stage 栅极驱动级 m+p}Qi8i)
35 gerber plot Gerber 图 s(56aE
36 ground plane 接地层 7Iu^l4=2
37 Henry 电感单位:亨利 OjxaA[$
38 Human Body Model 人体模式 Qs2E>C
39 Hysteresis 滞回 s(*LV2fa
40 inrush current 涌入电流 J2cqnwUV
41 Inverting 反相 WAPN,WuW
42 jittery 抖动 =}N&c4I[j
43 Junction 结点 fl| 8#\r
44 Kelvin connection 开尔文连接 oh+Q}Fa:
45 Lead Frame 引脚框架 $o
rN>M42
46 Lead Free 无铅 Fu4LD-#
47 level-shift 电平移动 :uhU<H<,f
48 Line regulation 电源调整率 Ed[ tmaEuV
49 load regulation 负载调整率 8A/;a{
50 Lot Number 批号 <p"[jC2zF;
51 Low Dropout 低压差 n1OxT"tD
52 Miller 密勒 53 node 节点 ;,T3C:S?
54 Non-Inverting 非反相 6<sd6SM
55 novel 新颖的 U M$\{$
56 off state 关断状态 N3?hyR<T
57 Operating supply voltage 电源工作电压 o>rsk
6lNi
58 out drive stage 输出驱动级 i^j1i
59 Out of Phase 异相 lSv?!2
60 Part Number 产品型号 f,:SI&c\
61 pass transistor pass transistor i0`<`qSQh
62 P-channel MOSFET P沟道MOSFET S9~X#tpKe
63 Phase margin 相位裕度 C^ngdba\
64 Phase Node 开关节点 +_Nr a
65 portable electronics 便携式电子设备 %:I\M)t}k
66 power down 掉电 U ObI&*2
67 Power Good 电源正常 #/fh_S'Z
68 Power Groud 功率地 6*`KC)a
69 Power Save Mode 节电模式 gycjIy@t
70 Power up 上电 aRSGI ja<L
71 pull down 下拉 Xup rl2+
72 pull up 上拉 VOc_7q_=
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) O;RsYs9
74 push pull converter 推挽转换器 {"Xn`@Y
75 ramp down 斜降 7_Yxz$m
76 ramp up 斜升 t)|*-=
77 redundant diode 冗余二极管 E6"+\-e
78 resistive divider 电阻分压器 "`P/j+-rt
79 ringing 振 铃 hV5Aw;7C
80 ripple current 纹波电流 r{y&}gA
81 rising edge 上升沿 N$1ZA)M
82 sense resistor 检测电阻 AF ,*bb
83 Sequenced Power Supplys 序列电源 v+a$Xh3Y~
84 shoot-through 直通,同时导通 H4%2"w6|!
85 stray inductances. 杂散电感 0vN <0
86 sub-circuit 子电路 7!%/vO0m
87 substrate 基板 A-5xgp,
88 Telecom 电信 x*}41;j}C
89 Thermal Information 热性能信息 ~>C@n'\lv
90 thermal slug 散热片 YbaaX{7^
91 Threshold 阈值 ~)!yl. H
92 timing resistor 振荡电阻 8K: RoR
93 Top FET Top FET -$W#bqvz^
94 Trace 线路,走线,引线 p;;4b@
95 Transfer function 传递函数 a=(D`lQ8
96 Trip Point 跳变点 Z(Styn/x
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 0$RZ~
98 Under Voltage Lock Out (UVLO) 欠压锁定 Yj%hgb:)
99 Voltage Reference 电压参考 wOW#A}m'vj
100 voltage-second product 伏秒积 Z>=IP-,>
101 zero-pole frequency compensation 零极点频率补偿 #2*l"3.$.R
102 beat frequency 拍频 +tsF.Is!t
103 one shots 单击电路 5^kLNNum
104 scaling 缩放 VaYL#\;c<
105 ESR 等效串联电阻 [Page] r\#_b4-v3h
106 Ground 地电位 % zP]z
107 trimmed bandgap 平衡带隙 OIi8x?
.~]
108 dropout voltage 压差 ckn0I
109 large bulk capacitance 大容量电容 tK@|sZ>3\
110 circuit breaker 断路器 ;#'YO1`gf3
111 charge pump 电荷泵 )OjTn"
112 overshoot 过冲 ?D 8<}~Do
JmMB=}
<
印制电路printed circuit b&q!uFP
印制线路 printed wiring m+66x {M2c
印制板 printed board UZcsMMKH
印制板电路 printed circuit board e6?iQ0
印制线路板 printed wiring board ^\<nOzU?
印制元件 printed component :P,g,
印制接点 printed contact z{wW6sgPr
印制板装配 printed board assembly e}@VR<h
板 board }~W:3A{7;
刚性印制板 rigid printed board :/rl \woA>
挠性印制电路 flexible printed circuit zN3[W`q+m
挠性印制线路 flexible printed wiring eBlWwUy*6f
齐平印制板 flush printed board dO?zLc0f
金属芯印制板 metal core printed board /l.:GH36f
金属基印制板 metal base printed board '3%J hG)#
多重布线印制板 mulit-wiring printed board DIsK+1
塑电路板 molded circuit board { XI 0KiE
散线印制板 discrete wiring board }j+Af["W?
微线印制板 micro wire board `'W/uCpl
积层印制板 buile-up printed board aPU.fER
表面层合电路板 surface laminar circuit #%Hk-a=>)#
埋入凸块连印制板 B2it printed board -|z
]Ir
载芯片板 chip on board ;$a+ >
埋电阻板 buried resistance board KjWF;VN*[3
母板 mother board fyt ODsb>
子板 daughter board C8{bqmlm@
背板 backplane <x!q!;
裸板 bare board GG0H3MSc
键盘板夹心板 copper-invar-copper board bEQy5AX
动态挠性板 dynamic flex board <bSG|VqnH
静态挠性板 static flex board jF$bCbAUce
可断拼板 break-away planel DB~3(r?K
电缆 cable ^"dVz.
挠性扁平电缆 flexible flat cable (FFC) V8w7U:K
薄膜开关 membrane switch
%wFz4:
混合电路 hybrid circuit lpq)vKM}^
厚膜 thick film %>p[;>jW
厚膜电路 thick film circuit QJ
i5 H
薄膜 thin film fMpxe(
薄膜混合电路 thin film hybrid circuit |~K 5]
互连 interconnection ZZs@P#]
导线 conductor trace line 5VS};&f
齐平导线 flush conductor /M :7
传输线 transmission line ^cUmLzM
跨交 crossover M2kvj'WWq
板边插头 edge-board contact ,59G6o
增强板 stiffener k!Ym<RD%N
基底 substrate |2Vhj<6
基板面 real estate 3 as~yF0
导线面 conductor side #ORZk6e
元件面 component side G?M<B~}
焊接面 solder side %K`th&331
导电图形 conductive pattern }s7@0#j@a
非导电图形 non-conductive pattern XnwVK
基材 base material JRw<v4pZ
层压板 laminate QGCg~TV;
覆金属箔基材 metal-clad bade material > `1K0?_
覆铜箔层压板 copper-clad laminate (CCL) =ea'G>;[H
复合层压板 composite laminate {xD\w^
薄层压板 thin laminate =.`:jZG
基体材料 basis material `K7UWtp
预浸材料 prepreg D_N0j{E
粘结片 bonding sheet [+F6C
预浸粘结片 preimpregnated bonding sheer (+CNs
环氧玻璃基板 epoxy glass substrate |C"zK
预制内层覆箔板 mass lamination panel G$^u2wz.
内层芯板 core material SHc?C&^S
粘结层 bonding layer Zg*XbX
粘结膜 film adhesive S.zY0
无支撑胶粘剂膜 unsupported adhesive film sv.?C pE
覆盖层 cover layer (cover lay) s||c#+j"8
增强板材 stiffener material mz2 v2ma
铜箔面 copper-clad surface O:]e4r,'
去铜箔面 foil removal surface yMz dM&a!*
层压板面 unclad laminate surface [t6Y,yo&h4
基膜面 base film surface oO3X>y{gN
胶粘剂面 adhesive faec Ueu~803~
原始光洁面 plate finish qOTo p-
粗面 matt finish !gm@QO cF
剪切板 cut to size panel i*]$_\yl"
超薄型层压板 ultra thin laminate ZBkbr
A阶树脂 A-stage resin S"cim\9xP
B阶树脂 B-stage resin Ihd{tmr<
C阶树脂 C-stage resin Pil_zQ4
环氧树脂 epoxy resin ?$ Dc>
酚醛树脂 phenolic resin y&W3CW\:
聚酯树脂 polyester resin +gyGA/5:d$
聚酰亚胺树脂 polyimide resin z41v5rB4
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin
/ M@[ 8
丙烯酸树脂 acrylic resin *=}\cw\A
三聚氰胺甲醛树脂 melamine formaldehyde resin <74r
多官能环氧树脂 polyfunctional epoxy resin b&*)C#7/T
溴化环氧树脂 brominated epoxy resin T8BewO=}
环氧酚醛 epoxy novolac ATWa/"l(H-
氟树脂 fluroresin Zet80|q
硅树脂 silicone resin ":_~(?1+
硅烷 silane +,_%9v?3
聚合物 polymer 0m,q3
无定形聚合物 amorphous polymer aF{1V\e
结晶现象 crystalline polamer #=T^XHjQ
双晶现象 dimorphism P9o=G=i
共聚物 copolymer (@Kc(>(: Y
合成树脂 synthetic <2e[; $
热固性树脂 thermosetting resin [Page] M2nWvU$
热塑性树脂 thermoplastic resin gle<{
`
感光性树脂 photosensitive resin [7\x(W-:@>
环氧值 epoxy value \iA.{,VX
双氰胺 dicyandiamide d
f
j;e%H
粘结剂 binder =PjxMC._
胶粘剂 adesive 1'%n?\OK66
固化剂 curing agent HPXJRQBE
阻燃剂 flame retardant iHT=ROL
遮光剂 opaquer =u`tlN5pOT
增塑剂 plasticizers B"rO
不饱和聚酯 unsatuiated polyester v"l8[::
聚酯薄膜 polyester XE8%t=V!c$
聚酰亚胺薄膜 polyimide film (PI) E5IS<.
聚四氟乙烯 polytetrafluoetylene (PTFE) LMNmG]#!
增强材料 reinforcing material mgTzwE_\
折痕 crease )S`=y-L$
云织 waviness txiX1o!/L
鱼眼 fish eye #fDM{f0]R
毛圈长 feather length \cdns;
厚薄段 mark RgVnx] IF
裂缝 split !tSh9L;<O
捻度 twist of yarn +q%b'!&Q
浸润剂含量 size content 9TZ 6c
浸润剂残留量 size residue 4N5\sdi
处理剂含量 finish level _h I81Lzq
偶联剂 couplint agent /z)Nz2W
断裂长 breaking length p~v0pi
吸水高度 height of capillary rise ? U* `!-
湿强度保留率 wet strength retention M6j~`KSE
白度 whitenness 3:>hHQi
导电箔 conductive foil 3U'l'H,
铜箔 copper foil >=86*U~
压延铜箔 rolled copper foil 7M~/[f7Z{
光面 shiny side `i!fg\qnK
粗糙面 matte side T_d)1m fl
处理面 treated side J(SGa Hm@
防锈处理 stain proofing }^
=f%EjV
双面处理铜箔 double treated foil ,'n`]@0?\
模拟 simulation @p@b6iLpO
逻辑模拟 logic simulation z 'V$)U$f
电路模拟 circit simulation dsg-;*%
时序模拟 timing simulation W^pf 1I8[
模块化 modularization z0UtKE^b
设计原点 design origin RN$>!b/
优化(设计) optimization (design) Yq'D-$@
供设计优化坐标轴 predominant axis Ph)>;jU
表格原点 table origin 1--Ka& H
元件安置 component positioning >qPP_^]
比例因子 scaling factor TkVqv v
扫描填充 scan filling %LuA:{EVD
矩形填充 rectangle filling wG73GD38
填充域 region filling HM#|&_gV
实体设计 physical design B=%x#em
逻辑设计 logic design j.[W] EfL~
逻辑电路 logic circuit r5y*SoD!
层次设计 hierarchical design Tv9\`F[
自顶向下设计 top-down design >uDC!0)R
自底向上设计 bottom-up design {w@9\LsU
费用矩阵 cost metrix !3{;oU%*
元件密度 component density <`?%Cz AO
自由度 degrees freedom d5`D[,]d
出度 out going degree ay#f\P!1
入度 incoming degree cgO<%_l3`
曼哈顿距离 manhatton distance wB:<ICm
欧几里德距离 euclidean distance AY;[v.Ff4
网络 network yq1G6hw
阵列 array '<>?gE0Cd
段 segment c7.M\f P
逻辑 logic Gzs$0Ki=
逻辑设计自动化 logic design automation 7*
[
分线 separated time L2wX?NA
分层 separated layer 'dqecmB
定顺序 definite sequence nFWiS~(#sW
导线(通道) conduction (track) c|K:oi,z
导线(体)宽度 conductor width qC5IV}9`
导线距离 conductor spacing x[u6_6=q9
导线层 conductor layer oArXP\#
导线宽度/间距 conductor line/space Ug384RzHN
第一导线层 conductor layer No.1 q,> C^p|2b
圆形盘 round pad 9aX!<Z
方形盘 square pad :98:U~d1
菱形盘 diamond pad y(#6nG@S
长方形焊盘 oblong pad skU
}BUK6
子弹形盘 bullet pad d\zUtcJwC
泪滴盘 teardrop pad ~,Yd.?.TI
雪人盘 snowman pad nPDoK!r'
形盘 V-shaped pad V ]re}EB\Rs
环形盘 annular pad c?KIHZ0
非圆形盘 non-circular pad itg"dGDk
隔离盘 isolation pad `5"3Cj"M
非功能连接盘 monfunctional pad GB;_!69I
偏置连接盘 offset land x&"P^gh)
腹(背)裸盘 back-bard land wEN[o18{
盘址 anchoring spaur CNhLp#
连接盘图形 land pattern 3w"_Onwk
连接盘网格阵列 land grid array i|xz
孔环 annular ring NNwGRoDco
元件孔 component hole F)Z9Qlo
安装孔 mounting hole oKH+Q6S:
支撑孔 supported hole Z$B%V t
非支撑孔 unsupported hole PIdGis5G
导通孔 via !Rgj'{
镀通孔 plated through hole (PTH) dK0H.|
余隙孔 access hole -f1lu*3\
盲孔 blind via (hole) ~)zxIO!
埋孔 buried via hole $=`d[04
埋,盲孔 buried blind via <_]W1V:0
任意层内部导通孔 any layer inner via hole WQ9Q:F2
全部钻孔 all drilled hole _^`V0>Mh:
定位孔 toaling hole eKo=g|D
无连接盘孔 landless hole j)#yyK{k2s
中间孔 interstitial hole V-E 77u6{0
无连接盘导通孔 landless via hole -F 9xPw
引导孔 pilot hole E25w^x2
端接全隙孔 terminal clearomee hole 'Sesh'2
/
准尺寸孔 dimensioned hole [Page] 5:#|Op N
在连接盘中导通孔 via-in-pad (_6JQn
孔位 hole location id" l"
孔密度 hole density jQ7-M4qO/
孔图 hole pattern a5/Dz&>j6
钻孔图 drill drawing #?,"/Btq
装配图assembly drawing NciIqF
参考基准 datum referan >yVp1Se
1) 元件设备 Do5.
0c8_&
三绕组变压器:three-column transformer ThrClnTrans EziGkbpd@
双绕组变压器:double-column transformer DblClmnTrans h%NM%;"H/
电容器:Capacitor ,yvS c
并联电容器:shunt capacitor ReL+V
电抗器:Reactor ~B?Wg!
母线:Busbar B !wr} ]
输电线:TransmissionLine Hs_7oy|P
发电厂:power plant b'z\|jY
断路器:Breaker SLUQFoz}
刀闸(隔离开关):Isolator E@#<p-@~
分接头:tap wh2E$b(-
电动机:motor JG7K-W|!c
(2) 状态参数 Q1x15pVku/
F2ISg'
有功:active power m(^N8k1K;
无功:reactive power g!o2vTt5
电流:current euW
容量:capacity TCIbPsE
电压:voltage ;*ULrX4[
档位:tap position K5t.OAA:
有功损耗:reactive loss ]0MuXiR
无功损耗:active loss ckv8QAm
功率因数:power-factor H
SGz-
功率:power s&<76kwl
功角:power-angle $<Y%4LI
电压等级:voltage grade 3-)}.8F
空载损耗:no-load loss e&Q
w\Ze
铁损:iron loss <"xqt7f
铜损:copper loss (<-m|H};
空载电流:no-load current M%W#0
阻抗:impedance b`,Sd.2=('
正序阻抗:positive sequence impedance .+<Ka0
负序阻抗:negative sequence impedance xU6dRjYhH9
零序阻抗:zero sequence impedance K{V.N<