1 backplane 背板 .6V}3q$-@
2 Band gap voltage reference 带隙电压参考 qv*^fiT
3 benchtop supply 工作台电源 j)GtEP<n#
4 Block Diagram 方块图 5 Bode Plot 波特图 {V-v-f
6 Bootstrap 自举 @vB!u[{
7 Bottom FET Bottom FET )0R'(#
8 bucket capcitor 桶形电容 eIo7F m
9 chassis 机架 ^KELKv,_
10 Combi-sense Combi-sense Ow077v?
11 constant current source 恒流源 h-D}'R
12 Core Sataration 铁芯饱和 JLJ;TM'4=
13 crossover frequency 交叉频率 9I/N4sou
14 current ripple 纹波电流 5^KWCS7@
15 Cycle by Cycle 逐周期 T n}s*<=V
16 cycle skipping 周期跳步 eN~=*Mn(za
17 Dead Time 死区时间 O#u=c1
?:
18 DIE Temperature 核心温度 ^BL"wk
19 Disable 非使能,无效,禁用,关断 6(e>P)
20 dominant pole 主极点 PzR[KUK
21 Enable 使能,有效,启用 -R6)ROGl
22 ESD Rating ESD额定值 g>9kXP+
23 Evaluation Board 评估板 6u}</>}
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ;Q&5,<
N)j
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 yH}s<@y;7
25 Failling edge 下降沿 M:6"H%h,W
26 figure of merit 品质因数 ^Q^_?~h*!
27 float charge voltage 浮充电压 _{Hj^}+$
28 flyback power stage 反驰式功率级 Rx|;=-8zg
29 forward voltage drop 前向压降 jZ3fKyp#
30 free-running 自由运行 8h4'(yGQQW
31 Freewheel diode 续流二极管 {
buy"X4
32 Full load 满负载 33 gate drive 栅极驱动 r(2uu
34 gate drive stage 栅极驱动级 4 N7^?
35 gerber plot Gerber 图
gRT00
36 ground plane 接地层 LYg-
.~<I
37 Henry 电感单位:亨利 3<zp
38 Human Body Model 人体模式 ~| 6[j<ziL
39 Hysteresis 滞回 C{XmVc.
40 inrush current 涌入电流 D#/Bx[
41 Inverting 反相 a+PzI x2
42 jittery 抖动 9!DQ~k%
43 Junction 结点 @Pzu^
44 Kelvin connection 开尔文连接 9?3&?i2-
45 Lead Frame 引脚框架 /Qk4
46 Lead Free 无铅 O5t[
47 level-shift 电平移动 t@Nyr&|D
48 Line regulation 电源调整率 2Q"K8=s
49 load regulation 负载调整率 .q 3/_*
50 Lot Number 批号 }Ys>(w
51 Low Dropout 低压差 iRi-cQVy
52 Miller 密勒 53 node 节点 FtC^5{V+V
54 Non-Inverting 非反相 8&Y^""#e)
55 novel 新颖的 [,KXze_m
56 off state 关断状态 R+,u^;\
57 Operating supply voltage 电源工作电压 R n*L
58 out drive stage 输出驱动级 78%~N`x7
59 Out of Phase 异相 Nm>A'bLM
60 Part Number 产品型号 }<y7bqA
61 pass transistor pass transistor J{&H+rd
62 P-channel MOSFET P沟道MOSFET }k
G9!sf
63 Phase margin 相位裕度 Km6YP!i
64 Phase Node 开关节点 ^Zy%fv,
65 portable electronics 便携式电子设备 _W'-+,
66 power down 掉电 td3D=Y
67 Power Good 电源正常 e2W".+B1
68 Power Groud 功率地 3J438M.ka
69 Power Save Mode 节电模式 6;qy#\}2
70 Power up 上电 {LQ#y/H?
71 pull down 下拉 Z@@K[$
72 pull up 上拉 x*&|0n.D
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) A^EE32kbm
74 push pull converter 推挽转换器 2Jmz(cH%
75 ramp down 斜降 FzXJ]H
76 ramp up 斜升 A4<Uu~
77 redundant diode 冗余二极管 f_Av3
78 resistive divider 电阻分压器 n`&U~s8w
79 ringing 振 铃 TSWM
|#u':
80 ripple current 纹波电流 GU8sO@S5#
81 rising edge 上升沿 WYYa/,{9.
82 sense resistor 检测电阻 "djw>|,N<
83 Sequenced Power Supplys 序列电源 W$2C47i
84 shoot-through 直通,同时导通 ,47Y9Kz9
85 stray inductances. 杂散电感 ^7KH _t8
86 sub-circuit 子电路 X~,aNRy
87 substrate 基板 r7,t";?>
88 Telecom 电信 LRG6:&
89 Thermal Information 热性能信息 Yv!a88+A8M
90 thermal slug 散热片 QM#4uI55B
91 Threshold 阈值 P{+T<bk|
92 timing resistor 振荡电阻 /U)D5ot<
93 Top FET Top FET V2|aN<Sx<
94 Trace 线路,走线,引线 YLE!m?
95 Transfer function 传递函数 i`$*Ty"x
96 Trip Point 跳变点 8- %TC\:
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) `o8/(`a
98 Under Voltage Lock Out (UVLO) 欠压锁定 KOuCHqCfq
99 Voltage Reference 电压参考 xJ)n4)
100 voltage-second product 伏秒积 hL;(C)(
101 zero-pole frequency compensation 零极点频率补偿 b4ONh%
102 beat frequency 拍频 ,1CIBFY
103 one shots 单击电路 6U,O*WJ%e
104 scaling 缩放 "z=SO1
105 ESR 等效串联电阻 [Page] Z%/=|[9i
106 Ground 地电位 A/KJqiag
107 trimmed bandgap 平衡带隙 #"\gLr_:m
108 dropout voltage 压差 ~C`^6UQr/?
109 large bulk capacitance 大容量电容 $LFYoovX
110 circuit breaker 断路器 g($DdKc|g
111 charge pump 电荷泵 M`i\VG
112 overshoot 过冲 ],a 5)kV
1@1U/ss1
印制电路printed circuit Rt!FPoN,y
印制线路 printed wiring (/j/>9iro
印制板 printed board 4 k _vdz
印制板电路 printed circuit board C$D-Pt"+
印制线路板 printed wiring board !F1N~6f
印制元件 printed component ,+xB$e
印制接点 printed contact #[~pD:qqM
印制板装配 printed board assembly /}
WDU
板 board =4PV;>X
刚性印制板 rigid printed board r^paD2&}
挠性印制电路 flexible printed circuit DBD%6o>]K
挠性印制线路 flexible printed wiring &*G#H~\
齐平印制板 flush printed board <Fc;_GG
金属芯印制板 metal core printed board ,N[7/kT|
金属基印制板 metal base printed board 71gT.E
多重布线印制板 mulit-wiring printed board ~SF<,-Kg
塑电路板 molded circuit board 1@R
Db)<V
散线印制板 discrete wiring board b+6\JE^Mz
微线印制板 micro wire board a\E:sPM'>
积层印制板 buile-up printed board g/+C@_&m
表面层合电路板 surface laminar circuit FrYqaP
埋入凸块连印制板 B2it printed board ve/<=IR
Zo
载芯片板 chip on board u!X|A`o5i
埋电阻板 buried resistance board 48qV>Gwf
母板 mother board 2Mmz %S'd
子板 daughter board (Dl$k Gn
背板 backplane xt%7@/hiE
裸板 bare board
!0@Yplj
键盘板夹心板 copper-invar-copper board >eB\(EP
动态挠性板 dynamic flex board G) 7;;
静态挠性板 static flex board ()+<)hg}2
可断拼板 break-away planel ,Pjew%
电缆 cable 3#&7-o
挠性扁平电缆 flexible flat cable (FFC) }\#Rot>Y
薄膜开关 membrane switch DV-;4AxxRq
混合电路 hybrid circuit lfz2~Si5A
厚膜 thick film -[!P!d=
厚膜电路 thick film circuit O8u j`G 9
薄膜 thin film PuT@}tw
薄膜混合电路 thin film hybrid circuit vbBc}G"w
互连 interconnection m~u5kbHOi=
导线 conductor trace line r{ef .^&:
齐平导线 flush conductor %_L\z*+
传输线 transmission line A1#%`^W9
跨交 crossover $!(pF
板边插头 edge-board contact J}+6UlD
增强板 stiffener tj4VWJK
基底 substrate !Kj,9NX{U
基板面 real estate M&Uj^K1
导线面 conductor side @$c\dvO
元件面 component side }'/`2!lY
焊接面 solder side b e-~\ @
导电图形 conductive pattern lM{
+!-G,
非导电图形 non-conductive pattern 5v}8org
基材 base material ^8Q62
层压板 laminate M8Z2Pg\0
覆金属箔基材 metal-clad bade material >U*T0FL7
覆铜箔层压板 copper-clad laminate (CCL) q+]h=:5=I
复合层压板 composite laminate [uls8
"^/j
薄层压板 thin laminate
Mo @C9Y0
基体材料 basis material *"n vX2iz
预浸材料 prepreg l0cA6b
粘结片 bonding sheet [tA;l+Q\&
预浸粘结片 preimpregnated bonding sheer ,o,I5>`
环氧玻璃基板 epoxy glass substrate \y)
预制内层覆箔板 mass lamination panel tAte)/0C
内层芯板 core material *nsAgGKKM^
粘结层 bonding layer O1*NzY0Y%-
粘结膜 film adhesive S. q].a
无支撑胶粘剂膜 unsupported adhesive film _DNHc*
覆盖层 cover layer (cover lay) G\r?f&
增强板材 stiffener material +g]yA3
铜箔面 copper-clad surface mP P`xL?T
去铜箔面 foil removal surface $.v5~UGb{\
层压板面 unclad laminate surface 7{qy7,Gp
基膜面 base film surface .j>hI="b
胶粘剂面 adhesive faec a5!Fv54
原始光洁面 plate finish eI:C{0p=
粗面 matt finish +d!v}aJ
剪切板 cut to size panel Za8#$`zq
超薄型层压板 ultra thin laminate J8)#PY[i4
A阶树脂 A-stage resin 'n$%Ls}S
B阶树脂 B-stage resin ? Cg>h
C阶树脂 C-stage resin wz.6du6-
环氧树脂 epoxy resin '@CR\5 @
酚醛树脂 phenolic resin iVTGF<
聚酯树脂 polyester resin ?Wt$6{)
聚酰亚胺树脂 polyimide resin i'wAE:Xe
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin d[^~'V
丙烯酸树脂 acrylic resin JPWOPB'H
三聚氰胺甲醛树脂 melamine formaldehyde resin X'% ;B
多官能环氧树脂 polyfunctional epoxy resin B0!"A
溴化环氧树脂 brominated epoxy resin O
Wj@<N
环氧酚醛 epoxy novolac H0R&2#YD
氟树脂 fluroresin VZ](uF BY
硅树脂 silicone resin !o+_T?
硅烷 silane @b~fIW_3>
聚合物 polymer #\ n8M
无定形聚合物 amorphous polymer e$uiJNS2
结晶现象 crystalline polamer @L:>!<
双晶现象 dimorphism -cm$[,b6
共聚物 copolymer u% n*gcY
合成树脂 synthetic /?1nHBYPM
热固性树脂 thermosetting resin [Page] Gkxj?)`
热塑性树脂 thermoplastic resin m7GR[MR
感光性树脂 photosensitive resin JS>Gd/Jd
环氧值 epoxy value +@K09ge
双氰胺 dicyandiamide &gE 75B
粘结剂 binder STw#lU) %(
胶粘剂 adesive ^3FE\V/=
固化剂 curing agent ~ Yngkt
阻燃剂 flame retardant Tl|:9_:t
遮光剂 opaquer LtKI3ou
增塑剂 plasticizers JHJ~X v
不饱和聚酯 unsatuiated polyester -tI'3oT1
聚酯薄膜 polyester Yl$SW;@
聚酰亚胺薄膜 polyimide film (PI) gOK\%&S]
聚四氟乙烯 polytetrafluoetylene (PTFE) ?cEskafb>
增强材料 reinforcing material ed_FiQd
折痕 crease %F*|;o7 s
云织 waviness 1#4PG'H
鱼眼 fish eye {Pu\?Cq
毛圈长 feather length T'aec]u
厚薄段 mark k') E/n
裂缝 split 2',w[I
捻度 twist of yarn ?kz+R'
浸润剂含量 size content yj(vkifEB
浸润剂残留量 size residue b4""|P?L
处理剂含量 finish level fn/7wO$!
偶联剂 couplint agent S"hTE7`
断裂长 breaking length tDCw-
吸水高度 height of capillary rise d@3}U6,
湿强度保留率 wet strength retention EK$Kee}~
白度 whitenness =?(~aV
导电箔 conductive foil !HJ$UG/\
铜箔 copper foil cbu@*NzY,
压延铜箔 rolled copper foil 'XUKN/.
光面 shiny side q(5+xSg"gK
粗糙面 matte side lw(e3j
处理面 treated side *I?Eb-!t
防锈处理 stain proofing ow' lRHZ
双面处理铜箔 double treated foil 56Z\-=KAU
模拟 simulation )*d W=r/$V
逻辑模拟 logic simulation Wi}FY }f
电路模拟 circit simulation `ZaT}#Y
时序模拟 timing simulation xT)psM'CL
模块化 modularization 1lnU77;
设计原点 design origin DBs*Fx[
优化(设计) optimization (design) @E53JKYhY
供设计优化坐标轴 predominant axis <d7V<&@o=
表格原点 table origin 2spg?]
元件安置 component positioning Sm2>'C
比例因子 scaling factor Fequm+
扫描填充 scan filling do
^RF<G
矩形填充 rectangle filling a/uo}[Y
填充域 region filling %AnW~v
实体设计 physical design -)y%~Zn
逻辑设计 logic design Pu>N_^ C
逻辑电路 logic circuit Ut)r&?
层次设计 hierarchical design t=#Pya
自顶向下设计 top-down design S2VVv$r_6
自底向上设计 bottom-up design ARfRsPxr
费用矩阵 cost metrix AP\ofLmq
元件密度 component density VZIR4J[\.
自由度 degrees freedom \BI/G
出度 out going degree =BZ?- mIU
入度 incoming degree mEuHl>
曼哈顿距离 manhatton distance Yp4c'Zk
欧几里德距离 euclidean distance 5H:@8,B
网络 network 7>
Pgc
阵列 array ; W7Y2Md
段 segment Y+/lX 6'
逻辑 logic G;oFTP>o
逻辑设计自动化 logic design automation (a6?s{(
分线 separated time b]]N{: I
分层 separated layer NgB 7?]vu
定顺序 definite sequence WIh@y2&R
导线(通道) conduction (track) `$z)$VuP
导线(体)宽度 conductor width aP>37s
导线距离 conductor spacing rFL$QC2
导线层 conductor layer cVq}c?
导线宽度/间距 conductor line/space }+Vv0jX|V
第一导线层 conductor layer No.1 yD)"c.
圆形盘 round pad ;' e@t8i6
方形盘 square pad ad`_>lA4Lp
菱形盘 diamond pad ^i:\@VA:
长方形焊盘 oblong pad Nl8 gK{
子弹形盘 bullet pad
c!uW}U_z
泪滴盘 teardrop pad fV ZW[9[
雪人盘 snowman pad QlW=_Ymv{
形盘 V-shaped pad V f8:$G.}i
环形盘 annular pad -0,4egj3
非圆形盘 non-circular pad xT F=Y_
隔离盘 isolation pad :nQp.N*p
非功能连接盘 monfunctional pad ?|t/mo|K?
偏置连接盘 offset land h#3m4<w(9
腹(背)裸盘 back-bard land a]VGUW-
盘址 anchoring spaur a`Z{
xme=
连接盘图形 land pattern g<[rH%\6fg
连接盘网格阵列 land grid array (clU$m+oXX
孔环 annular ring Y~"9L|`f/
元件孔 component hole Ud3""C5B
安装孔 mounting hole S>ugRasZ$
支撑孔 supported hole MMD<I6Iyv
非支撑孔 unsupported hole H|+tC=]4IZ
导通孔 via i@$-0%,
镀通孔 plated through hole (PTH) wR7aQg
余隙孔 access hole ;1LG&h,K
盲孔 blind via (hole) "r-l8r,
埋孔 buried via hole o?!uX|Fy
埋,盲孔 buried blind via [b5(XIGUN}
任意层内部导通孔 any layer inner via hole bc}dYK3$q
全部钻孔 all drilled hole 56s*A*z$
;
定位孔 toaling hole /Antb6E
无连接盘孔 landless hole /{G/|a
中间孔 interstitial hole 4
10:%WGc
无连接盘导通孔 landless via hole dB`b9)Tk0z
引导孔 pilot hole Mj~${vj
端接全隙孔 terminal clearomee hole Y(GW0\<
准尺寸孔 dimensioned hole [Page] C.E[6$oVc
在连接盘中导通孔 via-in-pad B/Ba5z"r$
孔位 hole location
~R!gJTO9
孔密度 hole density uiK:*[
孔图 hole pattern Jn,w)Els
钻孔图 drill drawing {aJz. `u\
装配图assembly drawing %vc'{`P
参考基准 datum referan nO@+s
F
1) 元件设备 slSR=XOG
@9_)On9hZ
三绕组变压器:three-column transformer ThrClnTrans j_pw^I$C
双绕组变压器:double-column transformer DblClmnTrans FR' b`Xv:
电容器:Capacitor \UtS>4w\
并联电容器:shunt capacitor {Tx 3$eU
电抗器:Reactor Y\u_+CG*
母线:Busbar l\U*sro<
输电线:TransmissionLine 3"B+xbe=
发电厂:power plant 3*\8p6G
断路器:Breaker k6g|7^es2
刀闸(隔离开关):Isolator U]j&cFbn5_
分接头:tap 8OBF^r44R
电动机:motor {Pvr??"r
(2) 状态参数 2))t*9;h
'WzUu MCx
有功:active power u~)%tL
无功:reactive power y7;
5xF?q
电流:current s7Qyfe&>
容量:capacity Wy,"cT
电压:voltage dp< auA
档位:tap position &U0WkW
有功损耗:reactive loss s'AQUUrb<
无功损耗:active loss j@V$Mbv
功率因数:power-factor eu=|t&FKk
功率:power Znq(R8BMW
功角:power-angle I~'gK8<e7
电压等级:voltage grade j%GbgJ
空载损耗:no-load loss C[W5d~@;E
铁损:iron loss ;y,NC2Xj
铜损:copper loss (>r|j4$
空载电流:no-load current 5EfY9}dl
阻抗:impedance Z#LUez;&t#
正序阻抗:positive sequence impedance EUXV/QV{
负序阻抗:negative sequence impedance ty9rH=1
零序阻抗:zero sequence impedance %)dI2 J^Xf
电阻:resistor %8g$T6E[<2
电抗:reactance Cd9t{pQD4
电导:conductance r)%4-XeV
电纳:susceptance @ p"NJx"
无功负载:reactive load 或者QLoad _dY:)%[]
有功负载: active load PLoad Cea"qNq=k
遥测:YC(telemetering) 6e&g$R
v
遥信:YX ]uJM6QuQ
励磁电流(转子电流):magnetizing current 0vcET(
定子:stator +%x^ RV}
功角:power-angle 4=UI3 2v3
上限:upper limit @#1cx
下限:lower limit zAu}hVcW
并列的:apposable O<Jwaap
高压: high voltage B_b8r7Vn`
低压:low voltage i:R!T,
中压:middle voltage t0+t9w/fTP
电力系统 power system - =yTAx
发电机 generator Bac?'ypm
励磁 excitation # e$\~c Pd
励磁器 excitor |@OJ~5H/{
电压 voltage yi&?d&rK
电流 current }t}38%1i
母线 bus q^u6f?B
变压器 transformer [6oq##
升压变压器 step-up transformer i:\bqK
高压侧 high side ,7QBJ_-;QJ
输电系统 power transmission system Bfu/9ad
输电线 transmission line T27:"LVw
固定串联电容补偿fixed series capacitor compensation KPD@b=F
稳定 stability osI- o~#>
电压稳定 voltage stability (tgEa{rPAP
功角稳定 angle stability xAFek;GY?
暂态稳定 transient stability (di)`D5Q
电厂 power plant (}VuiNY<