1 backplane 背板
7!^Zsp^+
2 Band gap voltage reference 带隙电压参考 >o!5)\F
3 benchtop supply 工作台电源 zd?uMq;w
4 Block Diagram 方块图 5 Bode Plot 波特图 'Jl3%axR
6 Bootstrap 自举 F7U$7(I2G
7 Bottom FET Bottom FET :[bpMP<bz;
8 bucket capcitor 桶形电容 (zIF2qY
9 chassis 机架 Zl{DqC^
10 Combi-sense Combi-sense ~
ve
11 constant current source 恒流源 *KDwl<^A
12 Core Sataration 铁芯饱和 ZG1 {"J/z
13 crossover frequency 交叉频率 \vp^[,SI
14 current ripple 纹波电流 )C%S`d<%,
15 Cycle by Cycle 逐周期 \\$wg
16 cycle skipping 周期跳步 @S?D}myD
17 Dead Time 死区时间 Z]=9=S|
.4
18 DIE Temperature 核心温度 .oz(,$CS"
19 Disable 非使能,无效,禁用,关断 1L<X+,]@
20 dominant pole 主极点 q]OgT4ly
21 Enable 使能,有效,启用
4B'-tV
22 ESD Rating ESD额定值 }Fb966 $
23 Evaluation Board 评估板 I_On0@%T5b
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. !l~3K(&4
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 T*zy^we
25 Failling edge 下降沿 J|N>}di
26 figure of merit 品质因数 -|`E'b81
27 float charge voltage 浮充电压 m9Hdg^L
28 flyback power stage 反驰式功率级 A&=`?4>
29 forward voltage drop 前向压降 <(B: "wI
30 free-running 自由运行 KAm$^N5
31 Freewheel diode 续流二极管 H263<^
32 Full load 满负载 33 gate drive 栅极驱动 r9$7P?zm
34 gate drive stage 栅极驱动级 YveNsn
35 gerber plot Gerber 图 'kk
B>g7B
36 ground plane 接地层 l8By2{pN
37 Henry 电感单位:亨利 J]qx4c
38 Human Body Model 人体模式 G?v]|wdI
39 Hysteresis 滞回 * ;<>@*
40 inrush current 涌入电流 xI^nA2g
41 Inverting 反相 L+TM3*a*
42 jittery 抖动 E]%&)3O[
43 Junction 结点 7"$9js 2
44 Kelvin connection 开尔文连接 19;F+%no#
45 Lead Frame 引脚框架 MI*@^{G
46 Lead Free 无铅 @4%x7%+[c
47 level-shift 电平移动 A.(xa+z?
48 Line regulation 电源调整率 'tun;Y
49 load regulation 负载调整率 Ar1X
mHq
50 Lot Number 批号 ,v>|Ub,
51 Low Dropout 低压差 ~VaO,8&+L
52 Miller 密勒 53 node 节点
6+x>g
54 Non-Inverting 非反相 VU(#5X%Pn
55 novel 新颖的 J5*( PxDF
56 off state 关断状态 YOY{f:ew
57 Operating supply voltage 电源工作电压 _:.'\d(
58 out drive stage 输出驱动级 cS#m\O
59 Out of Phase 异相 R9O[`~BA2
60 Part Number 产品型号 1J O@G3,
61 pass transistor pass transistor 0vi\o`**Mj
62 P-channel MOSFET P沟道MOSFET L+d4&x
63 Phase margin 相位裕度 ?)'+l
64 Phase Node 开关节点 <[<]+r&*
65 portable electronics 便携式电子设备 ]>k>Z#8E*
66 power down 掉电 iJ 8I#
j+N
67 Power Good 电源正常 `KzNBH,W
68 Power Groud 功率地 /2AeJH\-
69 Power Save Mode 节电模式 %eLf6|1x
70 Power up 上电 h?`'%m?_b
71 pull down 下拉 +hKH\]
72 pull up 上拉 oEnCe
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) PvB-Cqc
74 push pull converter 推挽转换器 g;PZ$|%&s>
75 ramp down 斜降 M>"J5yqR
76 ramp up 斜升 T^n0 =|
77 redundant diode 冗余二极管 |_`wC
78 resistive divider 电阻分压器 QX&1BKqWn
79 ringing 振 铃 xlU:&=|
80 ripple current 纹波电流 gCc::[}\Y
81 rising edge 上升沿 #ysSfM6
82 sense resistor 检测电阻 g7nqe~`{
83 Sequenced Power Supplys 序列电源 Zi~-m]9U
84 shoot-through 直通,同时导通 @8s:,Y_
85 stray inductances. 杂散电感 (DrDWD4_
86 sub-circuit 子电路 $Hbd:1%i
{
87 substrate 基板 nPo YjQi
88 Telecom 电信 }_"<2|~_
89 Thermal Information 热性能信息 8.R~Ys*
90 thermal slug 散热片 +^v]d_~w_
91 Threshold 阈值 mzh7E[S_,i
92 timing resistor 振荡电阻 J|GEt@o3
93 Top FET Top FET YR}
P;
94 Trace 线路,走线,引线 dqo&3^px
95 Transfer function 传递函数 l4`HuNR1
96 Trip Point 跳变点 }iCcXZ&5^
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 0-a[[hL?
98 Under Voltage Lock Out (UVLO) 欠压锁定 Y<oDv`aZ0
99 Voltage Reference 电压参考 &fuJ%
100 voltage-second product 伏秒积 vynchZ+g]
101 zero-pole frequency compensation 零极点频率补偿 e#jkp'
102 beat frequency 拍频 ($A0umW1%
103 one shots 单击电路 <>|/U `
104 scaling 缩放 yQM<(;\O
105 ESR 等效串联电阻 [Page] =
7TK&
106 Ground 地电位 e[AwR?=
107 trimmed bandgap 平衡带隙 $2+(|VG4F
108 dropout voltage 压差 y%^TZ[S
109 large bulk capacitance 大容量电容 Msea kF
110 circuit breaker 断路器 MY `V0
111 charge pump 电荷泵 yJ!x`RD),w
112 overshoot 过冲 )RE~=*?d
_pS!sY~d
印制电路printed circuit &XE eJ
印制线路 printed wiring 5EqC.g.
印制板 printed board Q N$Ac.F
印制板电路 printed circuit board /,cyp.
印制线路板 printed wiring board Udbz;^(
印制元件 printed component Kgw_c:/'
印制接点 printed contact %SSBXWP
印制板装配 printed board assembly q
VcZF7
板 board ~GZpAPg*
刚性印制板 rigid printed board 'E#;`}&Ah
挠性印制电路 flexible printed circuit r=o\!sh[
挠性印制线路 flexible printed wiring P:8P>#L
齐平印制板 flush printed board ehCZhi~
金属芯印制板 metal core printed board ka$oUB)iQ
金属基印制板 metal base printed board $NG|z0
多重布线印制板 mulit-wiring printed board ahJu+y
塑电路板 molded circuit board ID1/N)56
散线印制板 discrete wiring board hi(uL>\
微线印制板 micro wire board ,\cO>y@
积层印制板 buile-up printed board c3NUJ~>=y
表面层合电路板 surface laminar circuit OY>0qj
埋入凸块连印制板 B2it printed board $6 A91|ZSQ
载芯片板 chip on board A_vf3 *q
埋电阻板 buried resistance board R?K[O
母板 mother board !e"TWO*X
子板 daughter board uI*2}Q
背板 backplane xf?6_=
裸板 bare board 9uL="z$\
键盘板夹心板 copper-invar-copper board ;0!rq^JG
动态挠性板 dynamic flex board ~
[4oA$[a|
静态挠性板 static flex board $_P*Bk)
可断拼板 break-away planel u(`,7 o "
电缆 cable WO=,NQOw
挠性扁平电缆 flexible flat cable (FFC) kj4t![o+
薄膜开关 membrane switch z2GT9
混合电路 hybrid circuit "7T9d)
厚膜 thick film DY~zi
厚膜电路 thick film circuit qAF.i^
薄膜 thin film Z}
8m]I
薄膜混合电路 thin film hybrid circuit ZTwCFn
互连 interconnection %+y92'GqG/
导线 conductor trace line ?H.7
WtTC
齐平导线 flush conductor &74*CO9B9
传输线 transmission line uWSfr(loX
跨交 crossover =H\ig%%E@
板边插头 edge-board contact ]_ON\v1
增强板 stiffener CAPPOh
基底 substrate oNfNe^/T
基板面 real estate 07?| "c.
导线面 conductor side [MkXQwY
元件面 component side #
[0>wEq
焊接面 solder side o|v_+<zD!
导电图形 conductive pattern mJ3|UClPS
非导电图形 non-conductive pattern 0y"Ra%Y
基材 base material ny. YkN2
层压板 laminate 6,*o;<k[
覆金属箔基材 metal-clad bade material !PFc)J
覆铜箔层压板 copper-clad laminate (CCL) 6tBh`nYB=
复合层压板 composite laminate @sV6g?{tI
薄层压板 thin laminate UUF;Q0X
基体材料 basis material fs=W(~"
预浸材料 prepreg H#LlxD)q
粘结片 bonding sheet AxOn~fZ!
预浸粘结片 preimpregnated bonding sheer {I2qnTN_a
环氧玻璃基板 epoxy glass substrate >J \} &!8,
预制内层覆箔板 mass lamination panel TZ]D6.mD
内层芯板 core material Z3)l5JG)
粘结层 bonding layer MMI7FlfY
粘结膜 film adhesive K`25G_Y3@
无支撑胶粘剂膜 unsupported adhesive film >$.lM~k
覆盖层 cover layer (cover lay) UUlrfur~
增强板材 stiffener material Hz&.]yts2J
铜箔面 copper-clad surface G%V*+Ond
去铜箔面 foil removal surface ~S],)E1w
层压板面 unclad laminate surface &D|wc4+
基膜面 base film surface %:P&!F\?
胶粘剂面 adhesive faec ,MtN_V-
原始光洁面 plate finish KV!!D{VS`@
粗面 matt finish lP!`lhc-^
剪切板 cut to size panel B@Ae2_;
超薄型层压板 ultra thin laminate T =l4Vb{>
A阶树脂 A-stage resin V ?10O
B阶树脂 B-stage resin rdFeDZo&Z)
C阶树脂 C-stage resin d +]Gw
环氧树脂 epoxy resin vB :_|B
酚醛树脂 phenolic resin d0`5zd@S
聚酯树脂 polyester resin RSNukg
聚酰亚胺树脂 polyimide resin bOi`JJ^
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin `xO9xo#
丙烯酸树脂 acrylic resin jH1!'1s|
三聚氰胺甲醛树脂 melamine formaldehyde resin N*C"+2
多官能环氧树脂 polyfunctional epoxy resin gX}(6RP_!
溴化环氧树脂 brominated epoxy resin Uv(THxVh
环氧酚醛 epoxy novolac H'L~8>
氟树脂 fluroresin oM=Ltxv}
硅树脂 silicone resin >lo,0oG
硅烷 silane kT!Y~c
聚合物 polymer \`|*i$
无定形聚合物 amorphous polymer #8!xIy
结晶现象 crystalline polamer -N')LY
双晶现象 dimorphism 6o_t;cpT
共聚物 copolymer 8H>: C(h
合成树脂 synthetic S
z3@h"
热固性树脂 thermosetting resin [Page] fNVNx~E
热塑性树脂 thermoplastic resin >taC_f06
感光性树脂 photosensitive resin Ol,Tw=?
环氧值 epoxy value X0=#e54
双氰胺 dicyandiamide ;xnJ+$//U
粘结剂 binder -NG`mfu
胶粘剂 adesive Lh%>>
Ht{
固化剂 curing agent Z2yZz:.'
阻燃剂 flame retardant 0 ttM_]#q
遮光剂 opaquer PXZZPW/
增塑剂 plasticizers 1k5o?'3&
不饱和聚酯 unsatuiated polyester *Ge2P3
聚酯薄膜 polyester W2F %E
聚酰亚胺薄膜 polyimide film (PI) ( aGwe@AS
聚四氟乙烯 polytetrafluoetylene (PTFE) A~CQ@
增强材料 reinforcing material -?A,N,nnX
折痕 crease o%+8.Tx6wT
云织 waviness N5ityJIgQ
鱼眼 fish eye AXV+8$ :R
毛圈长 feather length +gG6(7&+=
厚薄段 mark zCdQI
裂缝 split Z|YiYQl[)
捻度 twist of yarn >Lh+(M;+F
浸润剂含量 size content : QK )Ym
浸润剂残留量 size residue SArSi6vF
处理剂含量 finish level SBnwlM"AN
偶联剂 couplint agent /( /)nYAjk
断裂长 breaking length T@[(FVA N
吸水高度 height of capillary rise 2=3pV!)4}
湿强度保留率 wet strength retention =?U"#a
白度 whitenness sv<U$M~)X
导电箔 conductive foil QRs!B!Fn0
铜箔 copper foil C:77~f-+rQ
压延铜箔 rolled copper foil ~.;S>o[
光面 shiny side (fc
/"B-
粗糙面 matte side P
+U=/$o
处理面 treated side qB`zyd8yu
防锈处理 stain proofing 3,@I`
M
双面处理铜箔 double treated foil TI{W(2O *
模拟 simulation rrGsam\.
逻辑模拟 logic simulation V9:h4]
电路模拟 circit simulation 6e1/h@p\7
时序模拟 timing simulation ~/hyf] *j
模块化 modularization A^PCI*SN[
设计原点 design origin eMPkk=V
优化(设计) optimization (design) CwKo'PAJ
供设计优化坐标轴 predominant axis 4}:a"1P"
表格原点 table origin eGrC0[SH
元件安置 component positioning <Z^t^ O
比例因子 scaling factor qRMH[F$`
扫描填充 scan filling @D!KFJ
矩形填充 rectangle filling &8R %W"<K
填充域 region filling gkdd#Nrk
实体设计 physical design ,nqG*
o
逻辑设计 logic design "]}+QK_
逻辑电路 logic circuit VmLV:"P}^
层次设计 hierarchical design |A_yr/f
自顶向下设计 top-down design %k8} IBL
自底向上设计 bottom-up design uJ<sa;
费用矩阵 cost metrix =4z:Df
元件密度 component density KsM2?aqwf_
自由度 degrees freedom S$q:hXZ#e
出度 out going degree g:/l5~b
入度 incoming degree =/@c9QaVB
曼哈顿距离 manhatton distance 4&IBNc,sn
欧几里德距离 euclidean distance Cj?X+#J/@d
网络 network \>NjeMuWU
阵列 array gd>Op
段 segment FHVZ/ e
逻辑 logic WDr'w'
逻辑设计自动化 logic design automation m|<j9.iJ
分线 separated time "|{O%X
分层 separated layer Y|FJ1x$r
定顺序 definite sequence unqX<6hu
导线(通道) conduction (track) MR$Bl"d
导线(体)宽度 conductor width +:4J~Cuf
导线距离 conductor spacing ,?;q$Xoi
导线层 conductor layer (,eH*/~/
导线宽度/间距 conductor line/space w=Xil
第一导线层 conductor layer No.1 hv
18V>8
圆形盘 round pad Uv,_VS(
方形盘 square pad T$/6qZew
菱形盘 diamond pad 0R~{|RHM
长方形焊盘 oblong pad :_YpSw<Q
子弹形盘 bullet pad olzP=08aaV
泪滴盘 teardrop pad :.B};;N
雪人盘 snowman pad D\8 ~3S'd
形盘 V-shaped pad V !n4p*<Y6
环形盘 annular pad '|n-w\
>Wv
非圆形盘 non-circular pad p{7"a
隔离盘 isolation pad aF4vNUeG
非功能连接盘 monfunctional pad cCN[c)[c|
偏置连接盘 offset land E<;C@B
腹(背)裸盘 back-bard land >IO}}USm
盘址 anchoring spaur Wbc*x
连接盘图形 land pattern N<ww&GXBX
连接盘网格阵列 land grid array HXF5fs
孔环 annular ring 9 aT#7B
元件孔 component hole -p =b5L
安装孔 mounting hole
Z+ [Nco
支撑孔 supported hole b`E'MX_ m
非支撑孔 unsupported hole az3rK4g
导通孔 via 6bCC6G
镀通孔 plated through hole (PTH) o|G.tBpKg
余隙孔 access hole 1lu_<?O
盲孔 blind via (hole) M
H }4F
埋孔 buried via hole H"f%\'
埋,盲孔 buried blind via )6dvWK
任意层内部导通孔 any layer inner via hole RS@*/.]o
全部钻孔 all drilled hole uN V(r"
定位孔 toaling hole ;1K[N0xE
无连接盘孔 landless hole D t\F]\6sd
中间孔 interstitial hole y8jk9Tv
无连接盘导通孔 landless via hole >_h*N H
引导孔 pilot hole {4tJT25
端接全隙孔 terminal clearomee hole B@dA?w.x
准尺寸孔 dimensioned hole [Page] cMxTv4|wui
在连接盘中导通孔 via-in-pad L2Uk/E
孔位 hole location Y(
n# =
孔密度 hole density XEMi~L+
孔图 hole pattern NK'awv),pM
钻孔图 drill drawing y)?Sn
装配图assembly drawing K:/%7A_{
参考基准 datum referan G^J|_!.a
1) 元件设备 9r%O
hb7H- Z2
三绕组变压器:three-column transformer ThrClnTrans X2!vC!4P?L
双绕组变压器:double-column transformer DblClmnTrans k_.%(ZE
电容器:Capacitor n\&[^Q#b|
并联电容器:shunt capacitor .0;Z:x_3
电抗器:Reactor '"Q;54S**
母线:Busbar &^^zm9{
输电线:TransmissionLine 9.f/d4
发电厂:power plant wN8-Me
断路器:Breaker H\AJLk2E
刀闸(隔离开关):Isolator GGsDR%U
分接头:tap WjtmV2b<7
电动机:motor S1NM9xHJ
(2) 状态参数 85YE6^y
Mp9wYM*
有功:active power _n(O?M&x
无功:reactive power n#,|C`2r
电流:current w=I8f}(
容量:capacity B/g.bh~)q
电压:voltage Hrm^@3
档位:tap position }$r/#F/Fn
有功损耗:reactive loss q-O=Em <*
无功损耗:active loss >p Y0f }
功率因数:power-factor @13vn x
功率:power uFNVV;~RFI
功角:power-angle &wr0HrE\
电压等级:voltage grade $+qJ#0OE$
空载损耗:no-load loss 8C3oj
铁损:iron loss 21x?TZa
铜损:copper loss +DFG762
空载电流:no-load current sA=WU(4^
阻抗:impedance z6#~B&