1 backplane 背板 B_R
J;.oH
2 Band gap voltage reference 带隙电压参考 WzG]9$v &
3 benchtop supply 工作台电源 8_byS<b8
4 Block Diagram 方块图 5 Bode Plot 波特图 :5|'C
6 Bootstrap 自举 7X
4/6]*
7 Bottom FET Bottom FET [PG#5.jwQ
8 bucket capcitor 桶形电容 E)w6ZwV
9 chassis 机架 WV5z~[
10 Combi-sense Combi-sense lw+Y_;
11 constant current source 恒流源 ,w-=8>5lrj
12 Core Sataration 铁芯饱和 _G3L+St
13 crossover frequency 交叉频率 K/WnK:LU
14 current ripple 纹波电流 o]T-7Gs4p
15 Cycle by Cycle 逐周期 stGk*\>U'
16 cycle skipping 周期跳步 t&|M@Ouet
17 Dead Time 死区时间 TwPpZ@
18 DIE Temperature 核心温度 7`eg;s^
19 Disable 非使能,无效,禁用,关断 ,~8&0p
20 dominant pole 主极点 6sceymq
21 Enable 使能,有效,启用 W5i{W'
22 ESD Rating ESD额定值 @yV.Yx"p_
23 Evaluation Board 评估板 +"J2k9E
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. '`s\_Q)hG_
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 T{WJf-pI
25 Failling edge 下降沿 /Ne;Kdp
26 figure of merit 品质因数 CgT5sk}
27 float charge voltage 浮充电压 A-"2 sp*t
28 flyback power stage 反驰式功率级 -Cn x!g}
29 forward voltage drop 前向压降 C2e.RTxc
30 free-running 自由运行 j(aok5:e
31 Freewheel diode 续流二极管 QC\r|RXW
32 Full load 满负载 33 gate drive 栅极驱动 m8}c(GwcP
34 gate drive stage 栅极驱动级 % 9Jx|
35 gerber plot Gerber 图 M=rH*w{^
36 ground plane 接地层 ( JMk0H3u
37 Henry 电感单位:亨利 r4MPs-}oF
38 Human Body Model 人体模式 Yt]Y(
39 Hysteresis 滞回 A4K8DP
40 inrush current 涌入电流 o|7ztpr
41 Inverting 反相 M{GT$Q
42 jittery 抖动 Pzt5'O@dA
43 Junction 结点 idzc4jR6BT
44 Kelvin connection 开尔文连接 x*'2%3C~
45 Lead Frame 引脚框架 Mi^/`1
46 Lead Free 无铅 wXR7Ifrv
47 level-shift 电平移动 #'y4UN
48 Line regulation 电源调整率 5,_DM
49 load regulation 负载调整率 R6m6bsZ`
50 Lot Number 批号 R)ep1X^
51 Low Dropout 低压差 ,vDSY N6
52 Miller 密勒 53 node 节点 )#os!Ns_A
54 Non-Inverting 非反相 5ho!}K
55 novel 新颖的 >mAi/TZC
56 off state 关断状态 E$"`|Df
57 Operating supply voltage 电源工作电压 Vq&}i~
58 out drive stage 输出驱动级 2 xE+"?0
59 Out of Phase 异相 F+<e9[
60 Part Number 产品型号 g:oB j6$
q
61 pass transistor pass transistor 4s@oj
62 P-channel MOSFET P沟道MOSFET QnJd}(yN
63 Phase margin 相位裕度 f7_V ]
64 Phase Node 开关节点 ~J:qG9|]}
65 portable electronics 便携式电子设备 %/n#{;c#
66 power down 掉电 XpH d"(*
67 Power Good 电源正常 OC6v%@xa
68 Power Groud 功率地 2F&VG|"
69 Power Save Mode 节电模式 <dWms`QcO
70 Power up 上电 -|DBO0q
71 pull down 下拉 [gaB}aLn
72 pull up 上拉 P=<>H9p:o
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ()MUyW"S#`
74 push pull converter 推挽转换器 0/5{v6_rG
75 ramp down 斜降 b3.}m[]
76 ramp up 斜升 xLShMv}
77 redundant diode 冗余二极管 `E2RW{$A
78 resistive divider 电阻分压器 7`J= PG$A
79 ringing 振 铃 9dCf@5]
80 ripple current 纹波电流 0'Uo3jAB
81 rising edge 上升沿 "'3QKeM1
82 sense resistor 检测电阻 =/m$ayG
83 Sequenced Power Supplys 序列电源 ubs>(\`q"
84 shoot-through 直通,同时导通 ;9;jUQ]MyG
85 stray inductances. 杂散电感 .b|!FWHNS
86 sub-circuit 子电路 .+A2\F.^
87 substrate 基板
myOdf'=
88 Telecom 电信 yPoa04!{=
89 Thermal Information 热性能信息 F\2<q$Zn+
90 thermal slug 散热片 m;cgX#k5
91 Threshold 阈值 T+j-MR}{\
92 timing resistor 振荡电阻 Ake$M^Bz
93 Top FET Top FET XK{K FB-
94 Trace 线路,走线,引线 ,1
^IFBJ
95 Transfer function 传递函数 @5j3[e
96 Trip Point 跳变点 g[L}puN
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) @[v4[yq-
98 Under Voltage Lock Out (UVLO) 欠压锁定 Ex+E66bE
99 Voltage Reference 电压参考 /5Tp)h|
100 voltage-second product 伏秒积 8
3Tv-X
101 zero-pole frequency compensation 零极点频率补偿 >@0U B@
102 beat frequency 拍频 kYZj^tR
103 one shots 单击电路 GK&R,q5}
104 scaling 缩放 ~m3Tq.sYrY
105 ESR 等效串联电阻 [Page] T9?8@p\}(
106 Ground 地电位 |t6 :4']
107 trimmed bandgap 平衡带隙 Ksf f]##H
108 dropout voltage 压差 2*@@Bw.XA
109 large bulk capacitance 大容量电容 wCt!.<, .
110 circuit breaker 断路器 o(stXa
111 charge pump 电荷泵 :yFmCLZaQ
112 overshoot 过冲 PouWRGS_
#k
t+
)>
印制电路printed circuit QV>hQ]L
印制线路 printed wiring ]$)U~)T
iW
印制板 printed board [5-3PuT&9
印制板电路 printed circuit board TFO4jjiC"
印制线路板 printed wiring board h\/T b8
印制元件 printed component %\B@!4]
印制接点 printed contact ldWrv7.P
印制板装配 printed board assembly om{aws;
板 board i:2eJ.
刚性印制板 rigid printed board '_l5Br73=
挠性印制电路 flexible printed circuit #{g6'9PMz
挠性印制线路 flexible printed wiring jm0v=m7
齐平印制板 flush printed board Vrt*,R&
金属芯印制板 metal core printed board F.iJz4ya_
金属基印制板 metal base printed board &%;K_asV;
多重布线印制板 mulit-wiring printed board !h70 <Q^
塑电路板 molded circuit board 15_Px9
散线印制板 discrete wiring board _ykT(`.#
微线印制板 micro wire board rLE5fl5W
积层印制板 buile-up printed board >JHQA1mX
表面层合电路板 surface laminar circuit J3y4D}
埋入凸块连印制板 B2it printed board !"SuE)WM
载芯片板 chip on board #@:GLmD%
埋电阻板 buried resistance board /TScYE:$HE
母板 mother board -"5r-q q*
子板 daughter board "qhQJql
背板 backplane XXy&1C
裸板 bare board 7gQ2dp
键盘板夹心板 copper-invar-copper board \@$V^;OP/
动态挠性板 dynamic flex board -Q"
N;&'[&
静态挠性板 static flex board \+>g"';f
可断拼板 break-away planel N*'d]P2P`J
电缆 cable ?@H/;hB[|
挠性扁平电缆 flexible flat cable (FFC) 9uW\~DwsZ%
薄膜开关 membrane switch w">-r}HnJ
混合电路 hybrid circuit v4VP7h6uD)
厚膜 thick film }TG=ZVi
厚膜电路 thick film circuit +K:hetv
薄膜 thin film ]]50c
薄膜混合电路 thin film hybrid circuit :,Mg1Zf
互连 interconnection `J-&Y2_/k
导线 conductor trace line :y^%I xs{1
齐平导线 flush conductor )<vuv9=k\%
传输线 transmission line hIFfvUl
跨交 crossover mH9_HK.C
板边插头 edge-board contact i|CAN,'
增强板 stiffener +J7xAyv_Oz
基底 substrate &5Huv?^a'
基板面 real estate ,rWej;CzN
导线面 conductor side v|wO qS
元件面 component side cc:,,T/i
焊接面 solder side lH"4"r
导电图形 conductive pattern Iz9b5
非导电图形 non-conductive pattern G'(8/os{
基材 base material ,_I#+XiXY
层压板 laminate E\vW>g*W
覆金属箔基材 metal-clad bade material A x'o|RE)x
覆铜箔层压板 copper-clad laminate (CCL) DgKe!w$
复合层压板 composite laminate !@9G9<NK
薄层压板 thin laminate {qb2!}FQ
基体材料 basis material jn+BH3e
预浸材料 prepreg W5R /
粘结片 bonding sheet 9K4Jg]?
预浸粘结片 preimpregnated bonding sheer vu`,:/|h
环氧玻璃基板 epoxy glass substrate Y1 *8&xT
预制内层覆箔板 mass lamination panel X*e<g=
内层芯板 core material |6!L\/}M%
粘结层 bonding layer 8Lr&-w8J
粘结膜 film adhesive tlcNGPa
无支撑胶粘剂膜 unsupported adhesive film #9(L/)^
覆盖层 cover layer (cover lay) %SJFuw"
增强板材 stiffener material Rp_)LA
铜箔面 copper-clad surface Q$8K-5U%
去铜箔面 foil removal surface #SqU>R
层压板面 unclad laminate surface B-W8Zq#4>
基膜面 base film surface um*!+Q
胶粘剂面 adhesive faec ';3#t(J;
原始光洁面 plate finish !Hx[
`3
粗面 matt finish >6A8+=
剪切板 cut to size panel nP#|JRn=
超薄型层压板 ultra thin laminate L<0eIw
A阶树脂 A-stage resin I:edLg1T
B阶树脂 B-stage resin 6Ej.X)~'K
C阶树脂 C-stage resin Z&Xp9"j,@;
环氧树脂 epoxy resin w=QW8q?
酚醛树脂 phenolic resin Qgxpq{y
聚酯树脂 polyester resin =>X"
聚酰亚胺树脂 polyimide resin m.w.h^f$&
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Uq^-km#a
丙烯酸树脂 acrylic resin 89\DS!\x9
三聚氰胺甲醛树脂 melamine formaldehyde resin :4/37R(~l8
多官能环氧树脂 polyfunctional epoxy resin u:M)JG
溴化环氧树脂 brominated epoxy resin ]h?p3T$h
环氧酚醛 epoxy novolac uc]`^,`2/
氟树脂 fluroresin f8S! FGiNc
硅树脂 silicone resin [(m+Ejzi%
硅烷 silane ?XB[awTD~
聚合物 polymer z~Is
E8
无定形聚合物 amorphous polymer Xhp={p;
结晶现象 crystalline polamer # "!q_@b,D
双晶现象 dimorphism Q|(G -
共聚物 copolymer \`Ow)t:
合成树脂 synthetic Z\>mAtm
热固性树脂 thermosetting resin [Page] rObg:(z&\
热塑性树脂 thermoplastic resin LGq
T$ O|
感光性树脂 photosensitive resin >*Ctp +X@
环氧值 epoxy value <3!Q Xc
双氰胺 dicyandiamide T&+y~c[au
粘结剂 binder Eal*){"<,?
胶粘剂 adesive 1Uk Gjw1J
固化剂 curing agent T7?cnK"
阻燃剂 flame retardant RiiwsnjC
遮光剂 opaquer 7~!F3WT{
增塑剂 plasticizers 5F$~ZDu
不饱和聚酯 unsatuiated polyester >!WH%J
聚酯薄膜 polyester OQiyAyX
聚酰亚胺薄膜 polyimide film (PI) ):7mK03J
聚四氟乙烯 polytetrafluoetylene (PTFE) x &*2R#Ai
增强材料 reinforcing material x};sti R
折痕 crease d[`vd^hI
云织 waviness _*fOn@Vwo
鱼眼 fish eye JVR,Py:%G
毛圈长 feather length V,&A?
Y
厚薄段 mark y&6 pc
裂缝 split D\^\_r):
捻度 twist of yarn sw+vyBV)r
浸润剂含量 size content *9tRhRc
浸润剂残留量 size residue w@x||K= Z
处理剂含量 finish level cf,^7,-`"
偶联剂 couplint agent 6h?)x
断裂长 breaking length <lTLz$QE
吸水高度 height of capillary rise 7x#."6>Dy
湿强度保留率 wet strength retention ).IK[5Q`
白度 whitenness ?,w9e|
导电箔 conductive foil gN.n_!
铜箔 copper foil 65U&P5W
压延铜箔 rolled copper foil eS/Au[wS
光面 shiny side B{!*OC{l
粗糙面 matte side >E9 k5
处理面 treated side Igh=Z %
防锈处理 stain proofing @t2S"s$m
双面处理铜箔 double treated foil rIeOli:<
模拟 simulation c7A]\1 ~
逻辑模拟 logic simulation 6cXZ3;a
电路模拟 circit simulation ZoR6f\2M
时序模拟 timing simulation yb) a
模块化 modularization w+gPU1|(r
设计原点 design origin GDYFhH7H
优化(设计) optimization (design) cC]lO
供设计优化坐标轴 predominant axis b<j*;n.
表格原点 table origin PO*0jO;%
元件安置 component positioning `\yQn7 Oq
比例因子 scaling factor RMlx[nsq
扫描填充 scan filling ),XDY_9K
矩形填充 rectangle filling BHt9$$Z|
填充域 region filling `JcWH_[
实体设计 physical design 0t%`jY~%
逻辑设计 logic design xwojjiV
逻辑电路 logic circuit AI]lG]q8
层次设计 hierarchical design ak\[+wQ
自顶向下设计 top-down design @3`Pq2<
自底向上设计 bottom-up design -nqq;|%
费用矩阵 cost metrix 3&zcdwPj
元件密度 component density y.gjs<y
自由度 degrees freedom |!L0X@>
出度 out going degree ~z'Y(qG
入度 incoming degree \m#{{SGm
曼哈顿距离 manhatton distance m8Rt>DY
欧几里德距离 euclidean distance {R?VB!dR
网络 network S5[}kfe
阵列 array MB+a?u0\
段 segment ufJHC06
逻辑 logic (w` j?c1
逻辑设计自动化 logic design automation ?hKpJA'%
分线 separated time 4VhKV JX
分层 separated layer Jk57| )/
定顺序 definite sequence ?u>A2Vc!
导线(通道) conduction (track) l:*.0Tj
导线(体)宽度 conductor width Mp06A.j[
导线距离 conductor spacing ]v l?J
导线层 conductor layer \lF-]vz*
导线宽度/间距 conductor line/space _Uhl4Mh
第一导线层 conductor layer No.1 v G~JK[
圆形盘 round pad IU\h,Ug
方形盘 square pad ~0rvrDDg
菱形盘 diamond pad MH=Ld=i
长方形焊盘 oblong pad 9yp'-RKjw
子弹形盘 bullet pad JZ/T:Hsh4
泪滴盘 teardrop pad d(C5i8d
雪人盘 snowman pad '^(qlCI
形盘 V-shaped pad V ]{18-=
环形盘 annular pad L=&}s[5
非圆形盘 non-circular pad :XB^IyO-A
隔离盘 isolation pad aa}U87]k
非功能连接盘 monfunctional pad a~Yq0 d?`D
偏置连接盘 offset land ~)*uJ wW/a
腹(背)裸盘 back-bard land ?N&s.
盘址 anchoring spaur !ezy
v`
连接盘图形 land pattern 4jW <*jM
连接盘网格阵列 land grid array
pzb`M'Z?C
孔环 annular ring *RFBLCt
元件孔 component hole =nv/
r
安装孔 mounting hole ne%(`XY{Q]
支撑孔 supported hole NtkZ\3
非支撑孔 unsupported hole [0lO0ik>G
导通孔 via 0P;\ :-&p
镀通孔 plated through hole (PTH) ]>[0DX]j
余隙孔 access hole 7#C3E$gn?
盲孔 blind via (hole) av~kF
埋孔 buried via hole ~R~eQ=8
埋,盲孔 buried blind via '?T<o
任意层内部导通孔 any layer inner via hole G4uA&"OE
全部钻孔 all drilled hole .\8LL,zT
定位孔 toaling hole V5p->X2#
无连接盘孔 landless hole 9>;CvR
中间孔 interstitial hole
%$=2tfR
无连接盘导通孔 landless via hole ~'N+O K
引导孔 pilot hole 'ql<R0g
端接全隙孔 terminal clearomee hole cyB2=,
准尺寸孔 dimensioned hole [Page] 1i;Cw/mr
在连接盘中导通孔 via-in-pad }O2P>Z?V
孔位 hole location pW_mS|
孔密度 hole density <t dsUh:?&
孔图 hole pattern _po5j;"_O
钻孔图 drill drawing -_bDbYL
装配图assembly drawing Fi#
9L
参考基准 datum referan s` =&l
1) 元件设备 N'Vj& DWC
PNH>LT^
三绕组变压器:three-column transformer ThrClnTrans omI"xx
双绕组变压器:double-column transformer DblClmnTrans a0's6C
电容器:Capacitor ysFp$!9Ux
并联电容器:shunt capacitor l7U<]i GL
电抗器:Reactor I>lblI$7
母线:Busbar 9Dd`x7$a
输电线:TransmissionLine A@e!~
发电厂:power plant j|@8VxZ
断路器:Breaker #I#_gjJkx
刀闸(隔离开关):Isolator @_?Uowc8
分接头:tap @{ L|&Mk!
电动机:motor YTg8Zg-Z
(2) 状态参数 dRUmC H
k0D):
有功:active power v!AfIcEV
无功:reactive power [d=BN ,?
电流:current #4V->I
容量:capacity ~J
>Jd
电压:voltage Eo@rrM:
档位:tap position n!U1cB{
有功损耗:reactive loss AR c
无功损耗:active loss &_' evZ8
功率因数:power-factor u $qazj
功率:power &:~9'-O
功角:power-angle %&eBkN!T
电压等级:voltage grade CIz_v.&:
空载损耗:no-load loss df/7u}>9
铁损:iron loss _5o5/@
铜损:copper loss h~q5GhY!9
空载电流:no-load current h<7@3Ur
阻抗:impedance xPJ@!ks9
正序阻抗:positive sequence impedance uCgJF@
负序阻抗:negative sequence impedance [@ NW
零序阻抗:zero sequence impedance QN#tj$x
电阻:resistor Nj +^;Y
电抗:reactance f||S?ns_
电导:conductance wdIJ?\/763
电纳:susceptance KK4rVb:-
无功负载:reactive load 或者QLoad bL|$\'S
有功负载: active load PLoad .-1'#Z1T
遥测:YC(telemetering) Gsy'':u
遥信:YX c=re(
励磁电流(转子电流):magnetizing current lInf,Q7W
定子:stator obGvd6\
功角:power-angle 9Z DbZc
上限:upper limit azG"Mt|7Z
下限:lower limit J2k4k
并列的:apposable gI/(hp3ob
高压: high voltage 34L1Gxf
低压:low voltage QFFFxaeJg
中压:middle voltage j%gle%_
电力系统 power system +5GPU 9k
发电机 generator z7pw~Tqlz
励磁 excitation m@YK8c#$
励磁器 excitor <Vh}d/
电压 voltage K*M1$@5
电流 current .u]d5z
BR
母线 bus 9{Igw"9ck
变压器 transformer "YVr/u
升压变压器 step-up transformer T>,[V:
高压侧 high side E0.o/3Gw6
输电系统 power transmission system BC#O.93`
输电线 transmission line PoLk{{l3
固定串联电容补偿fixed series capacitor compensation F:A Vik
稳定 stability +]Ev
电压稳定 voltage stability {9{PU&?(
功角稳定 angle stability pk6<wAs*?#
暂态稳定 transient stability wJu9.
电厂 power plant ;_0frX
能量输送 power transfer ^b
3nEcQn
交流 AC =&m;5R
装机容量 installed capacity ,lVQ-qw5
电网 power system Sa/]81aG
落点 drop point i/PL!'oq
开关站 switch station VFKFO9
双回同杆并架 double-circuit lines on the same tower z&\N^tBv
变电站 transformer substation CtZOIx.;|
补偿度 degree of compensation )!;20Po
高抗 high voltage shunt reactor #X0Xc2}{f
无功补偿 reactive power compensation fnIF<Zt
故障 fault >?.jN|
调节 regulation ~.z82m
裕度 magin KGmAnN
三相故障 three phase fault u(8dsgR
故障切除时间 fault clearing time t+M'05-U2
极限切除时间 critical clearing time ^-F#"i|Cn
切机 generator triping [kMWsiZ
高顶值 high limited value 1v*N]}`HU
强行励磁 reinforced excitation )5u#'5I>
线路补偿器 LDC(line drop compensation) h~O^~"jc
机端 generator terminal WP'.o
静态 static (state) :k2J
&@8
动态 dynamic (state) +}eK8>2
单机无穷大系统 one machine - infinity bus system =h.`
ey
机端电压控制 AVR 6q,CEm
电抗 reactance V{X/y N.u
电阻 resistance #"C!-kS'=
功角 power angle +W8kMuM!
有功(功率) active power +wZ|g6vMct
无功(功率) reactive power )S}.QrG
功率因数 power factor 0a1Mu>P,
无功电流 reactive current \Qq YH^M
下降特性 droop characteristics 4}Lui9
斜率 slope Ml/K~H
tN
额定 rating -h=wLYl@0i
变比 ratio 4\j1+&W
参考值 reference value uc LDl
电压互感器 PT t0Inf
[um
分接头 tap + -rSO"nc
下降率 droop rate i8%Z(@_`
仿真分析 simulation analysis r4fd@<=g
传递函数 transfer function n^nQrRIp
框图 block diagram yM7FR);
受端 receive-side 4L r,}tA
裕度 margin
iF_u/#
同步 synchronization TCi0]Y~a
失去同步 loss of synchronization =w<iYO
阻尼 damping #%{
摇摆 swing NOf{Xx<#k
保护断路器 circuit breaker i_nUyH%b
电阻:resistance bNHsjx@
电抗:reactance ,+x\NY2d
阻抗:impedance h7S;
4]
电导:conductance M7#CMLy
电纳:susceptance