1 backplane 背板 #:K=zV\
2 Band gap voltage reference 带隙电压参考 Ji4p6$ .j-
3 benchtop supply 工作台电源 zl0{lV
4 Block Diagram 方块图 5 Bode Plot 波特图 2+1ybOwb
6 Bootstrap 自举 I^NDJdxd
7 Bottom FET Bottom FET ,AP&N'
8 bucket capcitor 桶形电容 2t= =<x
9 chassis 机架 X\^nV
10 Combi-sense Combi-sense Et=Pr+Q{c
11 constant current source 恒流源 56V|=MzX]
12 Core Sataration 铁芯饱和 ?qh-#,O9B
13 crossover frequency 交叉频率 57\ 0MQO
14 current ripple 纹波电流 RvzZg%)
15 Cycle by Cycle 逐周期 }7 N6nZj`
16 cycle skipping 周期跳步 n`Q@<op
17 Dead Time 死区时间 \8vP"Kr
18 DIE Temperature 核心温度 i%2u>Ni^
19 Disable 非使能,无效,禁用,关断 /%@;t@BK4
20 dominant pole 主极点 /jv/qk3i
21 Enable 使能,有效,启用 GZ%vFje_
K
22 ESD Rating ESD额定值 'I[?R&j$G
23 Evaluation Board 评估板 =LW!$p
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. F};R
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 hU?DLl:bXF
25 Failling edge 下降沿 .j}]J:{%
26 figure of merit 品质因数 dN8Mfa)
27 float charge voltage 浮充电压 y`I>|5[`
28 flyback power stage 反驰式功率级 \YP,}_~
29 forward voltage drop 前向压降 U]PB)
30 free-running 自由运行 w h$bDTCj
31 Freewheel diode 续流二极管 c1YDln
32 Full load 满负载 33 gate drive 栅极驱动 fO<40!%9cQ
34 gate drive stage 栅极驱动级 J1w;m/oV
35 gerber plot Gerber 图 wgl <JO
36 ground plane 接地层 t G_4>-Y#w
37 Henry 电感单位:亨利 (bwD:G9
38 Human Body Model 人体模式 3?Pg
;
39 Hysteresis 滞回 0 QTI;3
40 inrush current 涌入电流 $n<a`PdH
41 Inverting 反相 Yy *=@qu>g
42 jittery 抖动 Ho &Q}<(
43 Junction 结点 g'.OzD
44 Kelvin connection 开尔文连接 PTe L3L
45 Lead Frame 引脚框架 n!)$e;l
46 Lead Free 无铅 7;jD>wp9D
47 level-shift 电平移动 ,i:?c
48 Line regulation 电源调整率 q/O2E<=w*c
49 load regulation 负载调整率 [LoQYDku
50 Lot Number 批号 pz%s_g'
51 Low Dropout 低压差 ;(C<gt,r}
52 Miller 密勒 53 node 节点 AtQ.H-8r
54 Non-Inverting 非反相 ! M^O\C)
55 novel 新颖的 +_GS@)L`%
56 off state 关断状态 UtQj<18<
57 Operating supply voltage 电源工作电压 ">}6i9o
58 out drive stage 输出驱动级 W!{RJWe
59 Out of Phase 异相 )Q 2IYCj{
60 Part Number 产品型号 "i0>>@NR'
61 pass transistor pass transistor Pn,I^Ej .
62 P-channel MOSFET P沟道MOSFET YR?Y:?(
63 Phase margin 相位裕度 B;k'J:-"
64 Phase Node 开关节点 .psb#4
65 portable electronics 便携式电子设备 * %D_\0;
66 power down 掉电 ]az(w&vqg2
67 Power Good 电源正常 #Y7jNrxE
68 Power Groud 功率地 I~4z%UG
69 Power Save Mode 节电模式 .a4,Lr#q.
70 Power up 上电 MK1\
71 pull down 下拉 "J(M. Y
72 pull up 上拉 YBt=8`r
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) q5;dQ8Y?
74 push pull converter 推挽转换器 (*S<2HN5
75 ramp down 斜降 VYG@_fd!x
76 ramp up 斜升 7zu\tCWb
77 redundant diode 冗余二极管 A@V$~&JCL5
78 resistive divider 电阻分压器 |
0
79 ringing 振 铃 s= %3`3Fo
80 ripple current 纹波电流 h>pu^ `hk
81 rising edge 上升沿 "OLg2O^
82 sense resistor 检测电阻 xfRp_;l+R
83 Sequenced Power Supplys 序列电源 Kd:l8%+
84 shoot-through 直通,同时导通 3x~7N
85 stray inductances. 杂散电感 e,%|sAs[
86 sub-circuit 子电路 r8 9o
87 substrate 基板 8T1`9ITl:
88 Telecom 电信 Ohm{m^VD"
89 Thermal Information 热性能信息 '+9<[]
90 thermal slug 散热片 6 f*:;
91 Threshold 阈值 ]IV{;{E)
92 timing resistor 振荡电阻 UT;%I_i!'
93 Top FET Top FET ;\K]~
94 Trace 线路,走线,引线 t3)6R(JC
95 Transfer function 传递函数 FX!KX/OE)
96 Trip Point 跳变点 6 byeO&d
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) h*Fv~j'p
98 Under Voltage Lock Out (UVLO) 欠压锁定 x?L0R{?WW
99 Voltage Reference 电压参考 VeQGdyhY
100 voltage-second product 伏秒积 ,U""m7
101 zero-pole frequency compensation 零极点频率补偿 {o~TbnC
102 beat frequency 拍频 e]~p:
103 one shots 单击电路 in>+D|q
c
104 scaling 缩放 )U~|QdZ
105 ESR 等效串联电阻 [Page] W&hW N9iR
106 Ground 地电位 riW9l6s'
107 trimmed bandgap 平衡带隙 8?Rp2n*o
108 dropout voltage 压差 'V]C.`9c
109 large bulk capacitance 大容量电容 2"D4q (@
110 circuit breaker 断路器 f1vD{M;
111 charge pump 电荷泵 F\eQV<
112 overshoot 过冲 }u;K<<h:
jSjC43lh
印制电路printed circuit 9J/[7TzSZ
印制线路 printed wiring f2e;N[D
印制板 printed board d5^^h<'
印制板电路 printed circuit board Y%;J/4dd
印制线路板 printed wiring board qur2t8gnxq
印制元件 printed component |y^=(|eM
印制接点 printed contact [xiqlb,8
印制板装配 printed board assembly +zh\W9
板 board
qNJc*@s
刚性印制板 rigid printed board S%- kN;
挠性印制电路 flexible printed circuit Gwk$<6E
挠性印制线路 flexible printed wiring
kt6)F&;$
齐平印制板 flush printed board v@EErF
金属芯印制板 metal core printed board V/#Ra
金属基印制板 metal base printed board !7DDPJ~
多重布线印制板 mulit-wiring printed board x$q} lJv_
塑电路板 molded circuit board ;t0q
?9
散线印制板 discrete wiring board W5Jw^,iPd
微线印制板 micro wire board sSU|N;"Y
积层印制板 buile-up printed board :\[l~S
表面层合电路板 surface laminar circuit _0+X32HjJ
埋入凸块连印制板 B2it printed board VpJKH\)Rt(
载芯片板 chip on board pg%(6dqK4
埋电阻板 buried resistance board uXc;!*
母板 mother board Z"VP<-
子板 daughter board iyn9[>je
背板 backplane q=pRe-{
裸板 bare board u)<]Pb})r
键盘板夹心板 copper-invar-copper board qb[hKp5K6
动态挠性板 dynamic flex board =!t;e~^8]
静态挠性板 static flex board x`g,>>&C
可断拼板 break-away planel %T]$kF++&
电缆 cable %tP*_d:
挠性扁平电缆 flexible flat cable (FFC) t+a.,$U
薄膜开关 membrane switch F` 7v
混合电路 hybrid circuit 8xENzTR
厚膜 thick film :.5l
厚膜电路 thick film circuit KRL.TLgq)
薄膜 thin film =p_*lC%N
薄膜混合电路 thin film hybrid circuit -gvfz&Lz
互连 interconnection :|n[z jK/S
导线 conductor trace line 9)7$U QY
齐平导线 flush conductor LWCFCkx%
传输线 transmission line :EOai%i
跨交 crossover TR3U<:
板边插头 edge-board contact Zp)=l Td
增强板 stiffener s|WwBT
基底 substrate R ABw(b
基板面 real estate <yipy[D
导线面 conductor side (T*$4KGV
元件面 component side &:l-;7d
焊接面 solder side Y'iI_cg
导电图形 conductive pattern u{DEOhtI4
非导电图形 non-conductive pattern s$Vv
基材 base material +51heuu[o
层压板 laminate cTGd<
覆金属箔基材 metal-clad bade material 36{GZDGQ
覆铜箔层压板 copper-clad laminate (CCL) b=r 3WkB6
复合层压板 composite laminate p=:Vpg<!
薄层压板 thin laminate U5kKT.M
基体材料 basis material *|S6iSn9R!
预浸材料 prepreg vS\ 2zwb}
粘结片 bonding sheet U,P>P+\@
预浸粘结片 preimpregnated bonding sheer -
]wT
环氧玻璃基板 epoxy glass substrate SO6)FiPy!n
预制内层覆箔板 mass lamination panel XSC=qg$
内层芯板 core material Y5tyFi#w[
粘结层 bonding layer f(pq`v^-n
粘结膜 film adhesive _;03R{e*
无支撑胶粘剂膜 unsupported adhesive film J-
S.m(
覆盖层 cover layer (cover lay) EQ273sdK
增强板材 stiffener material YTa
g|If
铜箔面 copper-clad surface 6 ]x?2P%
去铜箔面 foil removal surface K\2{SjL:B
层压板面 unclad laminate surface rD=D.1_
基膜面 base film surface 14 & KE3`
胶粘剂面 adhesive faec uj6'T Sl
原始光洁面 plate finish ?zBu`7j
粗面 matt finish ]i#p2?BR
剪切板 cut to size panel esJ7#Gxt
超薄型层压板 ultra thin laminate ! $$>D"
A阶树脂 A-stage resin \I!mzo
B阶树脂 B-stage resin 1x|3|snz)
C阶树脂 C-stage resin ]zlA<w8
环氧树脂 epoxy resin \Sd8PGl*'
酚醛树脂 phenolic resin nq{/fD(2
聚酯树脂 polyester resin L"&T3i
聚酰亚胺树脂 polyimide resin gNEcE9y2
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin :rL%,o"
丙烯酸树脂 acrylic resin 7Jlkn=9e:
三聚氰胺甲醛树脂 melamine formaldehyde resin n- 2X?<_Z
多官能环氧树脂 polyfunctional epoxy resin elR'e6Q
溴化环氧树脂 brominated epoxy resin _4N.]jr5
环氧酚醛 epoxy novolac J.yM@wPS>
氟树脂 fluroresin e\C-a4[C8P
硅树脂 silicone resin #r9+thyC
硅烷 silane [1vm~w'
聚合物 polymer -US:a8`
无定形聚合物 amorphous polymer vntJe^IaFd
结晶现象 crystalline polamer {J==y;dK
双晶现象 dimorphism `2 <:$]
共聚物 copolymer +fk*c[FG
合成树脂 synthetic 4<-Kd~uL
热固性树脂 thermosetting resin [Page] .rK0C)
热塑性树脂 thermoplastic resin QH-CZ6M
感光性树脂 photosensitive resin M )ET1ZM
环氧值 epoxy value %NQ%6B
双氰胺 dicyandiamide 6X@z(EEL
粘结剂 binder hH`x*:Qja
胶粘剂 adesive <2)AbI+3
固化剂 curing agent zgGysjV
阻燃剂 flame retardant r)|~Rs!y,
遮光剂 opaquer 4fKvB@O@.
增塑剂 plasticizers 9}6_B|
不饱和聚酯 unsatuiated polyester NIQ}A-b
聚酯薄膜 polyester w<H Xe
聚酰亚胺薄膜 polyimide film (PI) Rmw=~NP5
聚四氟乙烯 polytetrafluoetylene (PTFE) A1p~K*[[
增强材料 reinforcing material iW6O9~
折痕 crease \na$Sb+
云织 waviness sLA.bp.O
鱼眼 fish eye CC=I|/mBM
毛圈长 feather length "zcAYg^U
厚薄段 mark 7
{92_xRL
裂缝 split Tm`@5
捻度 twist of yarn ?r !kKMZ
浸润剂含量 size content kx(beaf
浸润剂残留量 size residue MUl`0H"tR
处理剂含量 finish level STwGp<8
偶联剂 couplint agent wG)e8,#
断裂长 breaking length MQP9^+f)O?
吸水高度 height of capillary rise OH>.N"IG
湿强度保留率 wet strength retention w<B
S
白度 whitenness tCrEcjT-
导电箔 conductive foil wK2$hsque
铜箔 copper foil x~5,v5R^]
压延铜箔 rolled copper foil c6F?#@?
光面 shiny side eA1g}ipm
粗糙面 matte side +1wEoU.l2
处理面 treated side h^(U:M=A
防锈处理 stain proofing e&x)g;bn
双面处理铜箔 double treated foil wxHd^b
模拟 simulation #+o$Tg
逻辑模拟 logic simulation c$1u
电路模拟 circit simulation QqF<HCO
时序模拟 timing simulation ]lA}5
模块化 modularization IrZjlnht
设计原点 design origin j(y<oxh
优化(设计) optimization (design) s#5#WNzP
供设计优化坐标轴 predominant axis rCa]T@=
表格原点 table origin fL|9/sojz
元件安置 component positioning <zqIq9}r
比例因子 scaling factor !!L'{beF
扫描填充 scan filling {qHQ_ _Bl
矩形填充 rectangle filling K-]) RIM
填充域 region filling L&+k`b
实体设计 physical design _kBmKE
逻辑设计 logic design >q;|
dn9
逻辑电路 logic circuit (^~a1@f,J
层次设计 hierarchical design pbG-uH^
自顶向下设计 top-down design =EVB?k
,
自底向上设计 bottom-up design (tA[] ne2
费用矩阵 cost metrix s[7$%|~W
元件密度 component density jk`U7G*
自由度 degrees freedom d1#lC*.Sg
出度 out going degree Wg %]
入度 incoming degree Bj{J&{
曼哈顿距离 manhatton distance "zw{m+7f,
欧几里德距离 euclidean distance !QdX+y<re
网络 network "
:e
<a?
阵列 array ]foS.D,
段 segment Fdl0V:<
逻辑 logic \0lQ1FrY
逻辑设计自动化 logic design automation 1?)h-aN
分线 separated time y=9fuGL6
分层 separated layer 0>m$e(Z
定顺序 definite sequence BT(eU*m-
导线(通道) conduction (track) L"0dB.
导线(体)宽度 conductor width lre(]oBXA
导线距离 conductor spacing nEUH; z
导线层 conductor layer ih("`//nP
导线宽度/间距 conductor line/space !}|'1HIC
第一导线层 conductor layer No.1 NfQQJ@*
圆形盘 round pad UK'8cz9
方形盘 square pad i*l=xW;bM
菱形盘 diamond pad -c8h!.Q$
长方形焊盘 oblong pad M.SF}U
子弹形盘 bullet pad TyO]|Q5
泪滴盘 teardrop pad D
Q4O
雪人盘 snowman pad SIM>Lz
形盘 V-shaped pad V fvta<
环形盘 annular pad on
hLhrZ
非圆形盘 non-circular pad 86KK Y2
隔离盘 isolation pad YpZuAJm<2_
非功能连接盘 monfunctional pad S^1ZsD.
偏置连接盘 offset land Jl\U~i
腹(背)裸盘 back-bard land Md9y:)P@Y
盘址 anchoring spaur 8fQfu'LyjY
连接盘图形 land pattern w}/+3z
连接盘网格阵列 land grid array wtL=^
孔环 annular ring owa&HW/_
元件孔 component hole g9Dynm5
安装孔 mounting hole HXh:83
支撑孔 supported hole ',+Zqog92
非支撑孔 unsupported hole \u6.*w5TI
导通孔 via xA;)02
镀通孔 plated through hole (PTH) d8Cd4qIXX
余隙孔 access hole WOgkv(5KN
盲孔 blind via (hole) e~he#o[%a
埋孔 buried via hole C!K&d,M
埋,盲孔 buried blind via sWTa;Qi
任意层内部导通孔 any layer inner via hole +u |SX/C
全部钻孔 all drilled hole
[g@Uc
定位孔 toaling hole `p)U6J
无连接盘孔 landless hole 1LSD,t|
中间孔 interstitial hole 1uyd+*/(xP
无连接盘导通孔 landless via hole N3Q
.4?
z9
引导孔 pilot hole r^E(GmW
端接全隙孔 terminal clearomee hole ^!O!HMX0
准尺寸孔 dimensioned hole [Page] o*~=NoR
在连接盘中导通孔 via-in-pad tJ7tZ~Ak
孔位 hole location $Ups9p Q
孔密度 hole density r~|7paX!
孔图 hole pattern $WRRCB/A6
钻孔图 drill drawing /A>nsN?:]
装配图assembly drawing [\ 0>@j}Z
参考基准 datum referan [Tvdchl OC
1) 元件设备 71IM`eL=ED
Om;`"5
三绕组变压器:three-column transformer ThrClnTrans Wj)v,v2&
双绕组变压器:double-column transformer DblClmnTrans M)JozD%
电容器:Capacitor klc$n07
并联电容器:shunt capacitor %LqT>HXJ
电抗器:Reactor sA+K?_
母线:Busbar 3C;;z
输电线:TransmissionLine IW}Wt{'m
发电厂:power plant [tC=P&<
断路器:Breaker 2H] 7 =j
刀闸(隔离开关):Isolator ,l,q;]C%
分接头:tap EKuLt*a/
电动机:motor VV[Fb9W ;
(2) 状态参数 AnE]
kq u
]W`M
<hEI
有功:active power z X+i2,
无功:reactive power 4B[uF/[
电流:current gL@]p
容量:capacity k5}Qx'/l
电压:voltage y\9#"=+
档位:tap position !4z vkJO
有功损耗:reactive loss (6
RWI#
无功损耗:active loss @bAuR
功率因数:power-factor e?o/H
功率:power &-My[t
功角:power-angle +T,0,^*
电压等级:voltage grade DdeKZ)8
空载损耗:no-load loss ^FTS'/Q
铁损:iron loss VTX6_&Hc1g
铜损:copper loss *k?y+}E_f
空载电流:no-load current v@fy*T\3
阻抗:impedance |v#rSVx
正序阻抗:positive sequence impedance
# xX
负序阻抗:negative sequence impedance Uu Zjf9}
零序阻抗:zero sequence impedance xNRMI!yv
电阻:resistor wq8&2(|Fc
电抗:reactance U{@2kg-
电导:conductance Zx: h)I
电纳:susceptance #oR@!?
无功负载:reactive load 或者QLoad .rX,*|1x
有功负载: active load PLoad ]1[:fQF7/L
遥测:YC(telemetering) ]{t!J^Xn
遥信:YX :+?rnb)N
励磁电流(转子电流):magnetizing current /*"pylm
定子:stator Jt}#,I,B
功角:power-angle \zDs3Hp
上限:upper limit 7e#|Iq:o
下限:lower limit HHs!6`R$0c
并列的:apposable 9pWSvalw9
高压: high voltage ZhC,nbM
低压:low voltage ttBqp|.?S
中压:middle voltage U+["b-c
电力系统 power system 8WKY 4nkj
发电机 generator bFH`wLW
励磁 excitation >V\^oh)t]t
励磁器 excitor <qI!Dj{
电压 voltage Pj!f^MN
电流 current $e uI
母线 bus xm=$D6O:
变压器 transformer V:+z 3)qF
升压变压器 step-up transformer _lm^v%J$
高压侧 high side )$d~HA@B
输电系统 power transmission system a#9pN?~
输电线 transmission line {r5OtYmpR
固定串联电容补偿fixed series capacitor compensation {&6i$4T
稳定 stability i;29*"
电压稳定 voltage stability ovi^bNQ
功角稳定 angle stability )ac!@slb^7
暂态稳定 transient stability M23r/eg]
电厂 power plant <zAYq=IU
能量输送 power transfer >Ml5QO$*.q
交流 AC d..JW{
装机容量 installed capacity ;=6EBP%
电网 power system jCIY(/
落点 drop point }-u%6KZ
开关站 switch station =([4pG
双回同杆并架 double-circuit lines on the same tower aEVy20wd
变电站 transformer substation <num!@2D
补偿度 degree of compensation }WBHuVcZG
高抗 high voltage shunt reactor >6)|>#Wi
无功补偿 reactive power compensation TgHUH>k
故障 fault $~%h4
调节 regulation L1y71+iqU
裕度 magin "{Y6.)x
三相故障 three phase fault ~CdW:t
故障切除时间 fault clearing time n.C5w8f
极限切除时间 critical clearing time :AI%{EV-L
切机 generator triping Q7tvpU
高顶值 high limited value (Fq:G) $
强行励磁 reinforced excitation tvq((2
线路补偿器 LDC(line drop compensation) M* {5> !\
机端 generator terminal #l3)3k*;
静态 static (state) ,(f W0d#
动态 dynamic (state) 8.+
yZTg
单机无穷大系统 one machine - infinity bus system 9QL%q;
#
机端电压控制 AVR GS}JyU
电抗 reactance nb6Y/`G
电阻 resistance SQ/HZ
功角 power angle ZE~zs~z|
有功(功率) active power ~l*<LXp8
无功(功率) reactive power |{_>H'
功率因数 power factor Xkg
无功电流 reactive current .0~uM!3y
下降特性 droop characteristics HPJHA ,
斜率 slope ~P;A
9A(k
额定 rating ;K%/sIIke
变比 ratio gU NWM^n
参考值 reference value 0r8Wv,7Bo
电压互感器 PT _mwt{D2r}
分接头 tap ~!cxRd5;F
下降率 droop rate fGRV]6?V
仿真分析 simulation analysis
r9L--#=z
传递函数 transfer function nj0]c`6rN@
框图 block diagram *c&|2EsZ
受端 receive-side rPqM&&+
裕度 margin =;b3i1'U
同步 synchronization '
2O@
失去同步 loss of synchronization =9,^Tu|
阻尼 damping Mw)6,O`
摇摆 swing #.$y
保护断路器 circuit breaker %\n|2*r
电阻:resistance As`=K$^Il.
电抗:reactance @qj]`}Gx'
阻抗:impedance M}f(-,9
电导:conductance \iP@|ay9
电纳:susceptance