1 backplane 背板 N:64Gko"K
2 Band gap voltage reference 带隙电压参考 z+oy#p6+F.
3 benchtop supply 工作台电源 vt"bB
4 Block Diagram 方块图 5 Bode Plot 波特图 ~b*|V
6 Bootstrap 自举 q}jh>`d
7 Bottom FET Bottom FET _0
43,
8 bucket capcitor 桶形电容 L}Sb0 o.
9 chassis 机架 LsGO~EiJ
10 Combi-sense Combi-sense `yl|NL
11 constant current source 恒流源 H;a) `R3
12 Core Sataration 铁芯饱和 g'k m*EV
13 crossover frequency 交叉频率 !b0A%1W;
14 current ripple 纹波电流 a%m>v,
15 Cycle by Cycle 逐周期 o:UNSr
16 cycle skipping 周期跳步 kn$SG
17 Dead Time 死区时间 ZX-A}
18 DIE Temperature 核心温度 4VF]tX?o
19 Disable 非使能,无效,禁用,关断 1)}hzA
20 dominant pole 主极点 8rJf2zL
21 Enable 使能,有效,启用 >G?*rg4
22 ESD Rating ESD额定值 3r^||(_u
23 Evaluation Board 评估板 c<q33dZ!*
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. R'F \9eyA
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 6C"${}SF`
25 Failling edge 下降沿 KX\=wFbP)
26 figure of merit 品质因数 \{*`-Pv
27 float charge voltage 浮充电压 W4qT]m
28 flyback power stage 反驰式功率级 OJydt; a
29 forward voltage drop 前向压降 t#f-3zd9
30 free-running 自由运行 yN[i6oe
31 Freewheel diode 续流二极管 9.
FXbNYg
32 Full load 满负载 33 gate drive 栅极驱动 Ao\ OU}
34 gate drive stage 栅极驱动级 ~_CZ1
35 gerber plot Gerber 图 j/wQ2"@a
36 ground plane 接地层 ou)0tX3j
37 Henry 电感单位:亨利 R'_F9\
38 Human Body Model 人体模式 LCIe1P2
39 Hysteresis 滞回 l9%ckC*q
40 inrush current 涌入电流 =mwAbh)[7n
41 Inverting 反相 u&`rK7J
42 jittery 抖动 w?fq%-6f*
43 Junction 结点 FD~uUZTM
44 Kelvin connection 开尔文连接 =yJc pj
45 Lead Frame 引脚框架 bjwl21;{
46 Lead Free 无铅 F`gK6;zp
47 level-shift 电平移动 #Ph8?
48 Line regulation 电源调整率 j~in%|^
49 load regulation 负载调整率 ^8ilUu
50 Lot Number 批号 P
2x.rukT|
51 Low Dropout 低压差 {v d+cE
52 Miller 密勒 53 node 节点 *g'%5i1ed
54 Non-Inverting 非反相 MnY}U",
55 novel 新颖的 G!F_Q7|-
56 off state 关断状态 nH?#_ 5F1
57 Operating supply voltage 电源工作电压 !_>/ r
58 out drive stage 输出驱动级 ?5 6;<%0
59 Out of Phase 异相 d_V7w4lK
60 Part Number 产品型号 hR[_1vuIu
61 pass transistor pass transistor qMqf7 .
62 P-channel MOSFET P沟道MOSFET SrWmV@"y
63 Phase margin 相位裕度 1X&scVw
64 Phase Node 开关节点 apxq] !
`
65 portable electronics 便携式电子设备 5NKyF
66 power down 掉电 <&1hJ)O
67 Power Good 电源正常 l@<Jp *|
68 Power Groud 功率地 q+4<"b+6G
69 Power Save Mode 节电模式 ?|<p^:
70 Power up 上电 Y$hLsM\%
71 pull down 下拉 q"g4fzCD
72 pull up 上拉 8fWIZ
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) sPX~>8}|VP
74 push pull converter 推挽转换器 kQ6YQsJ.*
75 ramp down 斜降 YMwL(m1
76 ramp up 斜升 lz#@_F|.*
77 redundant diode 冗余二极管 51s 3hX$
78 resistive divider 电阻分压器 kkT=g^D9j
79 ringing 振 铃 RL"hAUs_1
80 ripple current 纹波电流 G>2: WQ/
81 rising edge 上升沿 `g}en%5b\
82 sense resistor 检测电阻 ]4_)WUS.c
83 Sequenced Power Supplys 序列电源 *U,W4>(B
84 shoot-through 直通,同时导通 C !Lu`y
85 stray inductances. 杂散电感 ?+{qmqN
86 sub-circuit 子电路 3=lQZi<]%
87 substrate 基板 pN;T t+}
88 Telecom 电信 >ufN[ab
89 Thermal Information 热性能信息 Ve\!:,(Y_
90 thermal slug 散热片 wqQrby<
91 Threshold 阈值 !xC IvKW
92 timing resistor 振荡电阻 <qx qlEQT
93 Top FET Top FET S)@) @3
94 Trace 线路,走线,引线 N2EX`@_2
95 Transfer function 传递函数 GmN~e*x>p
96 Trip Point 跳变点 iS8yJRy
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) KJ6:ZTbW
98 Under Voltage Lock Out (UVLO) 欠压锁定 Bnd Y\
99 Voltage Reference 电压参考 aD?ySc}
100 voltage-second product 伏秒积 G9c2kX.Bf
101 zero-pole frequency compensation 零极点频率补偿 \v.YP19
102 beat frequency 拍频 ozG!OiRW
103 one shots 单击电路 -~=:tn)0
104 scaling 缩放 ]K>x:vMKH
105 ESR 等效串联电阻 [Page] j2!^iGS}
106 Ground 地电位 Z7?-c
107 trimmed bandgap 平衡带隙 * p,2>[e
108 dropout voltage 压差 +JBYGYN&K
109 large bulk capacitance 大容量电容 ! lm0zR
110 circuit breaker 断路器 wArtg'=X
111 charge pump 电荷泵 x4S0C[k
112 overshoot 过冲 kD4J{\
~VO?P fxZ
印制电路printed circuit
\]p[DYBY#
印制线路 printed wiring ^Ea^t.c}_
印制板 printed board q+Qrc]>-f
印制板电路 printed circuit board \kksZ4,
印制线路板 printed wiring board cvv(OkC
印制元件 printed component ~f!iz~
印制接点 printed contact P'CDV3+
印制板装配 printed board assembly %y2i1^
板 board bp(X\:zAy
刚性印制板 rigid printed board 5Og=`T
挠性印制电路 flexible printed circuit gK"E4{y_@
挠性印制线路 flexible printed wiring 08 aZU
齐平印制板 flush printed board ' +[fJ> Le
金属芯印制板 metal core printed board NYN(2J
金属基印制板 metal base printed board d"4J)+q
多重布线印制板 mulit-wiring printed board j.y8H
塑电路板 molded circuit board 79Si^n1\
散线印制板 discrete wiring board D|R,$v:
微线印制板 micro wire board p7Q
%)5o
积层印制板 buile-up printed board srfM"Lb'
表面层合电路板 surface laminar circuit IgU65p
埋入凸块连印制板 B2it printed board x*z$4)RP
载芯片板 chip on board d<^o@
埋电阻板 buried resistance board G8voqP
母板 mother board C
Ejf&n
子板 daughter board /\1MG>#K
背板 backplane :%vD
hMHa
裸板 bare board 9-?[%8
键盘板夹心板 copper-invar-copper board ZAcW@xfb
动态挠性板 dynamic flex board
)\r;|DN
静态挠性板 static flex board v %fRq!~
可断拼板 break-away planel 7|eD}=jy
电缆 cable V$XCe
挠性扁平电缆 flexible flat cable (FFC) V:8ph`1
薄膜开关 membrane switch /5c;,.hm1R
混合电路 hybrid circuit j?rq%rQd
厚膜 thick film XT
'v7
厚膜电路 thick film circuit {:r8X
薄膜 thin film 9&uWj'%ia
薄膜混合电路 thin film hybrid circuit n9Xs sl0
互连 interconnection v"dj%75O?e
导线 conductor trace line 92HxZ*t7km
齐平导线 flush conductor _~b$6Nf!83
传输线 transmission line JQ.w6aE
跨交 crossover 'v*Y7zZ#K
板边插头 edge-board contact N [iv.B
增强板 stiffener *q.qO )X}3
基底 substrate w;p!~o &
基板面 real estate m!-,K8
导线面 conductor side s&7,gWy}BE
元件面 component side 7VQk$im399
焊接面 solder side " %)zTH
导电图形 conductive pattern d;D8$q)8Q
非导电图形 non-conductive pattern iB,Nqs3i*
基材 base material [:!D.@h|
层压板 laminate s!d"(K9E
覆金属箔基材 metal-clad bade material S4?N_"m9
覆铜箔层压板 copper-clad laminate (CCL) TZ,kmk#
复合层压板 composite laminate >b.wk3g@>
薄层压板 thin laminate \y
G//
基体材料 basis material hh!^^emo
预浸材料 prepreg _g(4-\
粘结片 bonding sheet P|OjtI
预浸粘结片 preimpregnated bonding sheer AW+q#Is
环氧玻璃基板 epoxy glass substrate s2-p-n
预制内层覆箔板 mass lamination panel M)oy3y^&
内层芯板 core material G=lket6
粘结层 bonding layer noBGP/Av=:
粘结膜 film adhesive aBO%qmtt
无支撑胶粘剂膜 unsupported adhesive film ;*Cu >f7
覆盖层 cover layer (cover lay) q{W@J0U
增强板材 stiffener material *y;(c)_w/%
铜箔面 copper-clad surface fQ^45ulz
去铜箔面 foil removal surface \666{. a
层压板面 unclad laminate surface -nQ :RHnd
基膜面 base film surface iS{8cN3R
胶粘剂面 adhesive faec
j'V# =vH
原始光洁面 plate finish t6u01r{~`
粗面 matt finish ;@$B{/Q
剪切板 cut to size panel ]oN:MS4r
超薄型层压板 ultra thin laminate fr1/9E;
A阶树脂 A-stage resin K0i[D"
B阶树脂 B-stage resin X~O2!F
C阶树脂 C-stage resin xYJ|G=h&A
环氧树脂 epoxy resin I3A@0'Vm;L
酚醛树脂 phenolic resin ^uu)|
聚酯树脂 polyester resin Z[DiLXHL
聚酰亚胺树脂 polyimide resin .I@jt?6X
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin fBptjt_
丙烯酸树脂 acrylic resin <xm>_~,w
三聚氰胺甲醛树脂 melamine formaldehyde resin j z aC
多官能环氧树脂 polyfunctional epoxy resin szY=N7\S*
溴化环氧树脂 brominated epoxy resin $~|#Rz%v
环氧酚醛 epoxy novolac `2X#;{a:
氟树脂 fluroresin AiT&:'<UT
硅树脂 silicone resin pm-SDp>s
硅烷 silane a_UVb'z
聚合物 polymer )vFJx[a<n`
无定形聚合物 amorphous polymer e>Vr#a4
结晶现象 crystalline polamer ==[a7|q
双晶现象 dimorphism 2\xv Yf-
共聚物 copolymer `3Gjj&c
合成树脂 synthetic 6]%79?'A
热固性树脂 thermosetting resin [Page] B*+3A!{s
热塑性树脂 thermoplastic resin l@8UL</W
感光性树脂 photosensitive resin f((pRP
环氧值 epoxy value NM0[yh
双氰胺 dicyandiamide (LW4z8e#
粘结剂 binder ?d*0-mhQ,
胶粘剂 adesive xhAORhw#
固化剂 curing agent (Yzy;"iAu
阻燃剂 flame retardant Y~qv 0O6K
遮光剂 opaquer zW`$T88~
增塑剂 plasticizers *RQkL'tRf
不饱和聚酯 unsatuiated polyester ps#+i
聚酯薄膜 polyester gHLBtl/
聚酰亚胺薄膜 polyimide film (PI) 18|i{fE;
聚四氟乙烯 polytetrafluoetylene (PTFE) "x.|'
增强材料 reinforcing material ~:Jw2 P2z
折痕 crease a}Db9 =
云织 waviness 7gR8Wr ^
鱼眼 fish eye }t tiL
毛圈长 feather length [b:$sR;
厚薄段 mark x~Egax
裂缝 split :/N/u5.]
捻度 twist of yarn ]&za^%q0&
浸润剂含量 size content l[EnFbD6
浸润剂残留量 size residue y9?~^pTx
处理剂含量 finish level 3Zm'09A-.
偶联剂 couplint agent x&6SjlDb$K
断裂长 breaking length lMu}|d
吸水高度 height of capillary rise gO*:<B g
湿强度保留率 wet strength retention fUh7PF%
白度 whitenness UXz0HRRS0
导电箔 conductive foil y$VYWcFE
铜箔 copper foil I$K? ,
压延铜箔 rolled copper foil 5c btMNP
光面 shiny side ^`Tns6u>
粗糙面 matte side ?UC3ES
处理面 treated side =9UR~-`d\
防锈处理 stain proofing
~Qzb<^9]
双面处理铜箔 double treated foil Y<U"}}
模拟 simulation ?)$+W+vK
逻辑模拟 logic simulation @add'>)
电路模拟 circit simulation EG<YxNX,
时序模拟 timing simulation \atztC{-L>
模块化 modularization \ltA&}!
设计原点 design origin s)#8>s -
优化(设计) optimization (design) GY@-}p~it
供设计优化坐标轴 predominant axis 4\)"Ih
表格原点 table origin Wq_#46P-
元件安置 component positioning vEJ2d&
比例因子 scaling factor <}~`YU>=v
扫描填充 scan filling FgIL Q"+
矩形填充 rectangle filling ]Mu
+
DZ
填充域 region filling v:*t5M
>
实体设计 physical design $d1+ d;Mn
逻辑设计 logic design HZBU?{
逻辑电路 logic circuit ! 6kLL
层次设计 hierarchical design 7\sJ=*
自顶向下设计 top-down design ,f`435R
自底向上设计 bottom-up design Nf0'>`/
费用矩阵 cost metrix ~]HeoQK
元件密度 component density ?Z-(SC
自由度 degrees freedom $dAQ'\f7
出度 out going degree t.sbfLu
入度 incoming degree 2c>e Mfa
曼哈顿距离 manhatton distance i)nb^
欧几里德距离 euclidean distance YNc]x>
网络 network pK=$)<I"6
阵列 array ?{s!.U[T@
段 segment &61;v@
逻辑 logic UGuEZ-r
逻辑设计自动化 logic design automation c@RMy$RTF
分线 separated time Kq}/`P
分层 separated layer F|K=].
定顺序 definite sequence Z:3N*YkL
导线(通道) conduction (track) %T]NM3|U
导线(体)宽度 conductor width mQmn &:R
导线距离 conductor spacing J /3qJst
导线层 conductor layer D}|PBR
导线宽度/间距 conductor line/space
zzsQfI#
第一导线层 conductor layer No.1 0-H! \IB
圆形盘 round pad IUco
8
方形盘 square pad
`ReTfz;o
菱形盘 diamond pad -TKS`,#
长方形焊盘 oblong pad p F\~T>
子弹形盘 bullet pad rzJNHf=FVY
泪滴盘 teardrop pad ZV}"k_+-
雪人盘 snowman pad l6Hu(.Ls;j
形盘 V-shaped pad V 8$O=HE*
环形盘 annular pad H=E`4E#k
非圆形盘 non-circular pad yjZ]_.
隔离盘 isolation pad uU v yZ
非功能连接盘 monfunctional pad v. ,|#}0 o
偏置连接盘 offset land qms+s~oA
腹(背)裸盘 back-bard land QFOmnbJg
盘址 anchoring spaur 6e,|HV
连接盘图形 land pattern :34#z.O
连接盘网格阵列 land grid array C3kxw1*
孔环 annular ring |;2Y|>=
元件孔 component hole >jEn>H?
安装孔 mounting hole O)n LV~X
支撑孔 supported hole VuqN)CE^Uq
非支撑孔 unsupported hole EL!V\J`S_
导通孔 via &jCT-dj
镀通孔 plated through hole (PTH) dR"H,$UH
余隙孔 access hole E~?0Yrm F
盲孔 blind via (hole) o -tc}Aa
埋孔 buried via hole Zw+VcZz3
埋,盲孔 buried blind via <.j `n
任意层内部导通孔 any layer inner via hole ok;Y xp>
全部钻孔 all drilled hole `]^0lD=eI
定位孔 toaling hole WF0%zxg ]
无连接盘孔 landless hole cU8Rm\?
中间孔 interstitial hole Y 1a[HF^-
无连接盘导通孔 landless via hole }:u" ?v=|j
引导孔 pilot hole 7%?2>t3~
端接全隙孔 terminal clearomee hole 9{{QdN8
准尺寸孔 dimensioned hole [Page] 0yW#).D^b
在连接盘中导通孔 via-in-pad w~J 7|8Y
孔位 hole location IXb]\ )
孔密度 hole density T^LpoN/T
孔图 hole pattern X|+ o4R?
钻孔图 drill drawing n<
UuVu
装配图assembly drawing p2T%Zl_
参考基准 datum referan Q!DH8'|4?L
1) 元件设备 Wyu$J
/]H6'
三绕组变压器:three-column transformer ThrClnTrans .kpL?_
双绕组变压器:double-column transformer DblClmnTrans tpe:]T/xh
电容器:Capacitor PW(4-H
并联电容器:shunt capacitor :V1ttRW}52
电抗器:Reactor ^VsX9
母线:Busbar dQ6:c7hp>D
输电线:TransmissionLine lSv?!2
发电厂:power plant f,:SI&c\
断路器:Breaker i0`<`qSQh
刀闸(隔离开关):Isolator S9~X#tpKe
分接头:tap y<7C!E#b8
电动机:motor +_Nr a
(2) 状态参数 %:I\M)t}k
U ObI&*2
有功:active power #/fh_S'Z
无功:reactive power 6*`KC)a
电流:current gycjIy@t
容量:capacity ; MU8@?yN
电压:voltage *`~
woF
档位:tap position .!uXhF'
有功损耗:reactive loss eQh@.U*S)
无功损耗:active loss {)j~5m.,/o
功率因数:power-factor oRl~x^[%[-
功率:power t']d_Vcza
功角:power-angle h2kba6rwk
电压等级:voltage grade 8bQ\7jb
空载损耗:no-load loss !u@XEN>/
铁损:iron loss 9>gxJ7pY
铜损:copper loss D^cv
8 8<
空载电流:no-load current )?35!s6
阻抗:impedance up+W[#+
正序阻抗:positive sequence impedance sT.;*3{
负序阻抗:negative sequence impedance cM&5SyxiuE
零序阻抗:zero sequence impedance BJGL &N
电阻:resistor (Fc\*Vn
电抗:reactance RbPD3&.
电导:conductance Ore>j+
电纳:susceptance yW::`
无功负载:reactive load 或者QLoad ^)$(Fe<
有功负载: active load PLoad r)Q/YzXx*
遥测:YC(telemetering) ? yL3XB>
遥信:YX }DH3_M!
励磁电流(转子电流):magnetizing current T:
zO9C/
定子:stator 5`su^
功角:power-angle )8`7i{F
上限:upper limit HgH\2QL3&
下限:lower limit { +d](+$
并列的:apposable =T_E]>FF9
高压: high voltage ^L}ICm_#
低压:low voltage l&rS\TCkp
中压:middle voltage ZAe'lgS
电力系统 power system _5<d'fBd
发电机 generator \o-9~C\c*
励磁 excitation a%\6L
励磁器 excitor m]C|8b7Y
电压 voltage WiDl[l"{9
电流 current C\%T|ZDE
母线 bus s98Jh(~
变压器 transformer E
P1f6ps
升压变压器 step-up transformer h"~i&T
h
高压侧 high side MW^(
输电系统 power transmission system yT[CC>]l
输电线 transmission line 9f UD68Nob
固定串联电容补偿fixed series capacitor compensation 2xPkQOj3
稳定 stability 0r<?Ve
电压稳定 voltage stability X<:B"rPuK
功角稳定 angle stability ?=
G+L0t
暂态稳定 transient stability 0tA~Y26
电厂 power plant Sq#AnD6To
能量输送 power transfer 4XL$I*;4
交流 AC uD'yzR!]+
装机容量 installed capacity TA2HAMx)
电网 power system O|Sbe%[*wW
落点 drop point !H)$_d \uj
开关站 switch station _H{6{!=y
双回同杆并架 double-circuit lines on the same tower @;\2 PD
变电站 transformer substation E6 g]EE
补偿度 degree of compensation Whoqs_Mm{
高抗 high voltage shunt reactor kSW=DE|#}
无功补偿 reactive power compensation G909R>
故障 fault r4YiXss
调节 regulation " V[=U13
裕度 magin BZJ\tPSR
三相故障 three phase fault ko-3`hX`
故障切除时间 fault clearing time "0*yD[2
极限切除时间 critical clearing time QR+xPY~
切机 generator triping 9Wu c1#
高顶值 high limited value vR"?XqgZ
强行励磁 reinforced excitation q fc:%ks2
线路补偿器 LDC(line drop compensation) n8pvzlj1
机端 generator terminal 'iY~F 0U
静态 static (state) b]0]*<~y
动态 dynamic (state) )2z<5 `
单机无穷大系统 one machine - infinity bus system z6IOVQ*r
机端电压控制 AVR +N6IdDN3
电抗 reactance I45 kPfu
电阻 resistance D=+md
功角 power angle /"+CH\)
E
有功(功率) active power `Wl_yC_*G;
无功(功率) reactive power G_m $?0\
功率因数 power factor (6}[y\a+
无功电流 reactive current `p!&>,lrk
下降特性 droop characteristics N>TmaUk
斜率 slope us5<18M5
额定 rating Ie<H4G5Vh
变比 ratio qw?Wi%t(x8
参考值 reference value "h@=O
c
电压互感器 PT 'c&[ kMR
分接头 tap tG7F!um(
下降率 droop rate c;X%Ar
仿真分析 simulation analysis 58S qB
传递函数 transfer function u1}/SlCp
框图 block diagram $#z-b@s=B
受端 receive-side (jyT9'*wAT
裕度 margin bIWSNNV0F
同步 synchronization OXxgnn>W'
失去同步 loss of synchronization E"O6N.}.
阻尼 damping zb]e{$q2C
摇摆 swing UF&B7r
保护断路器 circuit breaker v~*Co}0OB
电阻:resistance oSf6J:?*e
电抗:reactance 2jVvK"C
阻抗:impedance !+k);;.+
电导:conductance sSLVR^
电纳:susceptance