1 backplane 背板 7>~iS@7GV
2 Band gap voltage reference 带隙电压参考 d:wAI|
3 benchtop supply 工作台电源 lLDHx3+
4 Block Diagram 方块图 5 Bode Plot 波特图 C {,d4KG
6 Bootstrap 自举 *FE<'+%
7 Bottom FET Bottom FET C`#N
Q*O
8 bucket capcitor 桶形电容 "Jwz.,Y\
9 chassis 机架 /vV 0$vg
10 Combi-sense Combi-sense B~ez>/H^
11 constant current source 恒流源 .F6#s
12 Core Sataration 铁芯饱和 b;O+QRa
13 crossover frequency 交叉频率 v6n(<0:
14 current ripple 纹波电流 a,E;R$[!
15 Cycle by Cycle 逐周期 jFc{$#g-
16 cycle skipping 周期跳步 s-ou ;S3s
17 Dead Time 死区时间 i:$g1
18 DIE Temperature 核心温度 zc{C+:3$^
19 Disable 非使能,无效,禁用,关断 Wm,,OioK
20 dominant pole 主极点 >@%!r
21 Enable 使能,有效,启用 ;'Q{ ywr
22 ESD Rating ESD额定值 GkC88l9z
23 Evaluation Board 评估板 !INr
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. h
P1|l
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 Rta P+6'X
25 Failling edge 下降沿 \wCL)t.cX
26 figure of merit 品质因数 aF=VJ+5
27 float charge voltage 浮充电压 :W&\})
28 flyback power stage 反驰式功率级 h`Mf;'P
29 forward voltage drop 前向压降 `WT7w']NT
30 free-running 自由运行 v uP1gem
31 Freewheel diode 续流二极管 k8JPu"R
32 Full load 满负载 33 gate drive 栅极驱动 Ll`apKr
34 gate drive stage 栅极驱动级 re!CF8
q
35 gerber plot Gerber 图 RW)C<g
36 ground plane 接地层 ;@
e|}Gk
37 Henry 电感单位:亨利 0#7dm9
38 Human Body Model 人体模式 72 6y/o
39 Hysteresis 滞回 ;4bu=<%
40 inrush current 涌入电流 #? *jdN:
41 Inverting 反相 +x2xQ8#|~~
42 jittery 抖动 hMQaT-v
43 Junction 结点 lrzW H0Q
44 Kelvin connection 开尔文连接 rij[ZrJ
45 Lead Frame 引脚框架 t|m3b~Oyv
46 Lead Free 无铅 Uww^Sq
47 level-shift 电平移动 1}pR')YL[
48 Line regulation 电源调整率 /b|sv$BN
49 load regulation 负载调整率 |3LMVN
50 Lot Number 批号 a?kQ2<@g
51 Low Dropout 低压差 c>Se Onf
52 Miller 密勒 53 node 节点 4Rn i7qH
54 Non-Inverting 非反相 K0\WN"ua;
55 novel 新颖的 nGVqVSxKT
56 off state 关断状态 Ydx5kUJV<
57 Operating supply voltage 电源工作电压 {JgN^R<5<f
58 out drive stage 输出驱动级 Kf4z*5Veqr
59 Out of Phase 异相 9 ?8`"v
60 Part Number 产品型号 Q [{vU
61 pass transistor pass transistor K?4(o u
62 P-channel MOSFET P沟道MOSFET R;o_ *
63 Phase margin 相位裕度 `{Jb{L@f
64 Phase Node 开关节点 kXr%73s
65 portable electronics 便携式电子设备 Nt8(
66 power down 掉电 ^n/uY94E)p
67 Power Good 电源正常 0 *\=Q$Yy
68 Power Groud 功率地 c0 |p34
69 Power Save Mode 节电模式 z@i4dC
70 Power up 上电 d
eg>m?Y
71 pull down 下拉 b nGA.b
72 pull up 上拉 J%)2,szn0
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) o[#a}5Y
74 push pull converter 推挽转换器 o__q)"^~-
75 ramp down 斜降 {76!
76 ramp up 斜升 oK6lCGM5
77 redundant diode 冗余二极管 /Hmo!"W`
78 resistive divider 电阻分压器 MlFvDy
79 ringing 振 铃 %j@FZ
)a[
80 ripple current 纹波电流 7&4,',0VL
81 rising edge 上升沿 %jkPrI
82 sense resistor 检测电阻 e`r;`a&
83 Sequenced Power Supplys 序列电源 ,X^_w
g
84 shoot-through 直通,同时导通 Pc'?p
85 stray inductances. 杂散电感 ydQS"]\g
86 sub-circuit 子电路 p0K;m%
87 substrate 基板 iC]lO
88 Telecom 电信 cAS_?"V
a
89 Thermal Information 热性能信息 3;NRW+
90 thermal slug 散热片 B! V{.p
91 Threshold 阈值 cqx1NWlY
92 timing resistor 振荡电阻 E6:p
93 Top FET Top FET "N]o5d
94 Trace 线路,走线,引线 {M/c!
95 Transfer function 传递函数 d&`j8O
96 Trip Point 跳变点 ;L2bC3
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) rzDJH:W{2
98 Under Voltage Lock Out (UVLO) 欠压锁定 )\vHIXnfJ1
99 Voltage Reference 电压参考 OU@x1G{Cy
100 voltage-second product 伏秒积 s.' \&B[
101 zero-pole frequency compensation 零极点频率补偿 tY=%@v'6?
102 beat frequency 拍频 Cw $^w
103 one shots 单击电路 AF]!wUKxy
104 scaling 缩放 P*`xiTA
105 ESR 等效串联电阻 [Page] Q/)ok$A&
106 Ground 地电位 on?/tHys
107 trimmed bandgap 平衡带隙 4/?}xD|?
108 dropout voltage 压差 KVxb"|[
109 large bulk capacitance 大容量电容 T+R I8.#o
110 circuit breaker 断路器 4Z9wzQ>
111 charge pump 电荷泵 b6&NzUt34V
112 overshoot 过冲 mndl~/
:)95 b fa.
印制电路printed circuit 3^>a TU<Z
印制线路 printed wiring "H<#91^|
印制板 printed board j#t8Krd] "
印制板电路 printed circuit board xY2_*#{.
印制线路板 printed wiring board ?i2Wst
印制元件 printed component bs EpET
印制接点 printed contact g)qnjeSs]
印制板装配 printed board assembly Wx$q:$h@q
板 board zI_GdQNfN
刚性印制板 rigid printed board 6L9[U^`@
挠性印制电路 flexible printed circuit Lo5@zNt%W
挠性印制线路 flexible printed wiring :gscW&k
齐平印制板 flush printed board w/5^R
金属芯印制板 metal core printed board |qcFmy
金属基印制板 metal base printed board ^z}lGu
多重布线印制板 mulit-wiring printed board c[_^bs>k
塑电路板 molded circuit board !]+Z%ed`%
散线印制板 discrete wiring board e>9Z:vY
微线印制板 micro wire board :5<9/
积层印制板 buile-up printed board F(9
Y/UXH
表面层合电路板 surface laminar circuit A]Tcj^#
埋入凸块连印制板 B2it printed board fGf-fh;s
载芯片板 chip on board 'z}M[h
K]
埋电阻板 buried resistance board 4z%#ZIy3
母板 mother board Q &7)vs
子板 daughter board o 7W Kh=
背板 backplane tQ/
#t<4D
裸板 bare board q%k(M[
键盘板夹心板 copper-invar-copper board I9un
动态挠性板 dynamic flex board nIQ&gbfO
静态挠性板 static flex board D`:d'ow~KQ
可断拼板 break-away planel k\sM;bCv7
电缆 cable '&:1?i)
挠性扁平电缆 flexible flat cable (FFC) 2FIR]@MQd
薄膜开关 membrane switch 7X{bB
混合电路 hybrid circuit *UBP]w
厚膜 thick film 3
t8 8AN=4
厚膜电路 thick film circuit ,ah*!Zm.kk
薄膜 thin film <2O7R}j7v
薄膜混合电路 thin film hybrid circuit
$.Q>M]xH
互连 interconnection WAB0e~e:|Q
导线 conductor trace line M?xpwqu\
齐平导线 flush conductor XQ3*
传输线 transmission line @>fO;*
跨交 crossover X') Zm+
板边插头 edge-board contact S1^nC tSF
增强板 stiffener -*%!q$:
基底 substrate ^+%tlX_+.
基板面 real estate U M( l%
导线面 conductor side %8bzs?QI
元件面 component side q)V1{B@
焊接面 solder side ]oeuIRyQ
导电图形 conductive pattern Q:kVCm/;
非导电图形 non-conductive pattern Y62u%':X
基材 base material TD{=L*{+
层压板 laminate _jTwiuMS-
覆金属箔基材 metal-clad bade material (7;J"2M
覆铜箔层压板 copper-clad laminate (CCL) 8wX+ZL:9
复合层压板 composite laminate vXWsF\g
薄层压板 thin laminate BjyXQ9D
基体材料 basis material NSS4vtA
预浸材料 prepreg J-tq8
粘结片 bonding sheet n</k/Mk}
预浸粘结片 preimpregnated bonding sheer s~LZOPN
环氧玻璃基板 epoxy glass substrate cophAP
预制内层覆箔板 mass lamination panel au~]
内层芯板 core material 9^PRX
粘结层 bonding layer *Mwfod
粘结膜 film adhesive )WVItqQKV
无支撑胶粘剂膜 unsupported adhesive film \5Vp6^
覆盖层 cover layer (cover lay) BbrT f"`
增强板材 stiffener material fW.GNX8
铜箔面 copper-clad surface `10X5V@hP
去铜箔面 foil removal surface &[5n0e[
层压板面 unclad laminate surface ]yAEjn9cN
基膜面 base film surface >*`>0Q4y
胶粘剂面 adhesive faec $5lW)q A
原始光洁面 plate finish ZcMj=#i
粗面 matt finish jby~AJf%
剪切板 cut to size panel S5~`T7Ra
超薄型层压板 ultra thin laminate L\b]k,Ksf
A阶树脂 A-stage resin X`yNR; >
B阶树脂 B-stage resin ~$4]HDg
C阶树脂 C-stage resin
!Ea&]G
环氧树脂 epoxy resin Vk-W8[W 7
酚醛树脂 phenolic resin I9}+(6
聚酯树脂 polyester resin T-9k<,>?
聚酰亚胺树脂 polyimide resin ^:4L6
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 'e.q
7Jpd
丙烯酸树脂 acrylic resin Nush`?]J"_
三聚氰胺甲醛树脂 melamine formaldehyde resin )=jT_?9b
多官能环氧树脂 polyfunctional epoxy resin \6 \hnP
溴化环氧树脂 brominated epoxy resin `'p`PyMt`
环氧酚醛 epoxy novolac Fn:.Y8%-
氟树脂 fluroresin 3sZ,|,ueD
硅树脂 silicone resin ]3L@$`ys
硅烷 silane ]alh_U
聚合物 polymer 5<89Af&&K8
无定形聚合物 amorphous polymer XzT78
结晶现象 crystalline polamer \ Y*h
双晶现象 dimorphism HEBqv+bG
共聚物 copolymer jg[5UTkcs
合成树脂 synthetic 8f?rEI\0GD
热固性树脂 thermosetting resin [Page] =/6p#d*0
热塑性树脂 thermoplastic resin I"ca+4]
感光性树脂 photosensitive resin 0iYP
环氧值 epoxy value WP5VcBC
双氰胺 dicyandiamide br0u@G
粘结剂 binder =G(*gx
胶粘剂 adesive LGIalf*7
固化剂 curing agent QU:EY'2
阻燃剂 flame retardant q*L
]
遮光剂 opaquer !\CG,E k
增塑剂 plasticizers 3 brb*gI_b
不饱和聚酯 unsatuiated polyester G%a] j
聚酯薄膜 polyester .i$,}wtw
聚酰亚胺薄膜 polyimide film (PI) 16I&7=S,
聚四氟乙烯 polytetrafluoetylene (PTFE) UqN{JG:#.
增强材料 reinforcing material [UM Lx
折痕 crease ?*[\UC
云织 waviness DU;[btK>
鱼眼 fish eye %c]nWR+/
毛圈长 feather length oEJaH
厚薄段 mark Bi e?M
裂缝 split A2y6UzLYD
捻度 twist of yarn eUt=n)*`
浸润剂含量 size content +UzXN$73
浸润剂残留量 size residue 4E2yH6l
处理剂含量 finish level YMT8p\#rp
偶联剂 couplint agent t9.,/o,
断裂长 breaking length #+9rjq:v#]
吸水高度 height of capillary rise %JQ~!3
湿强度保留率 wet strength retention X~lZ OVmS
白度 whitenness R:"+ #Sq
导电箔 conductive foil S?L#N
铜箔 copper foil 4r\*@rq
压延铜箔 rolled copper foil |xh&p(
光面 shiny side SBTPTb
粗糙面 matte side F;u7A]H^
处理面 treated side )u;JwFstX
防锈处理 stain proofing , 9mgYp2
双面处理铜箔 double treated foil `mzb(bE
模拟 simulation 4qt+uNe!
逻辑模拟 logic simulation
9RQU?
电路模拟 circit simulation U/Wrh($ #4
时序模拟 timing simulation eIg+PuQD]
模块化 modularization OUzR@$
设计原点 design origin bpW!iY/q3
优化(设计) optimization (design) 0x@A~!MoP
供设计优化坐标轴 predominant axis Q&xjF@I
表格原点 table origin 86%%n?"}
元件安置 component positioning Ry z?v<)h
比例因子 scaling factor f^p^Y
F+
扫描填充 scan filling 9@ndi u[
矩形填充 rectangle filling $2KK:{VX
填充域 region filling 6\4Z\82
实体设计 physical design
aG(hs J)
逻辑设计 logic design yl$F~e1W
逻辑电路 logic circuit GRT]aw
层次设计 hierarchical design ,}0$Tv\1
自顶向下设计 top-down design Z\Z,,g+WL
自底向上设计 bottom-up design &vkjmiAS
费用矩阵 cost metrix jY/ARBC}H
元件密度 component density BC! 6O/kr
自由度 degrees freedom Z~p!C/B
出度 out going degree Fu7M0X'p
入度 incoming degree +~Tu0?{Z 0
曼哈顿距离 manhatton distance E ]B7
欧几里德距离 euclidean distance H z@h0+h
网络 network :g2
}C
阵列 array x7dEo%j
段 segment pYo=oI
逻辑 logic qsI^oBD"
逻辑设计自动化 logic design automation p|3b/plZ
分线 separated time h?Nek+1'
分层 separated layer I{ ryD -!
定顺序 definite sequence
NF+<#*1
导线(通道) conduction (track) "3fBY\>a
导线(体)宽度 conductor width [Atc "X$
导线距离 conductor spacing @g-G
=Ba
导线层 conductor layer 2-dh;[4
导线宽度/间距 conductor line/space +C+<BzR~A.
第一导线层 conductor layer No.1 "R[l ZJ@
圆形盘 round pad 6e&$l-
方形盘 square pad ~_>cM c
菱形盘 diamond pad $dQIs:
长方形焊盘 oblong pad (ChD]PWQ
子弹形盘 bullet pad SV.z>p
泪滴盘 teardrop pad :,S98z#
雪人盘 snowman pad ])w[
形盘 V-shaped pad V /_t|Dry015
环形盘 annular pad \X|sU:g
非圆形盘 non-circular pad dNiH|-$an
隔离盘 isolation pad RWKH%C[Yd
非功能连接盘 monfunctional pad 3mO;JXd
偏置连接盘 offset land ~#PLAP3-
腹(背)裸盘 back-bard land h
Dk)Qg
盘址 anchoring spaur !eI2r
连接盘图形 land pattern $,fy$
Qk,S
连接盘网格阵列 land grid array 6C [E
孔环 annular ring < zOi4v0
元件孔 component hole CMW,slC_3
安装孔 mounting hole &GhPvrxI?
支撑孔 supported hole KxzYfH
非支撑孔 unsupported hole Z=?aEU$7
导通孔 via
4!.(|h@
镀通孔 plated through hole (PTH) (JUZCP/ \
余隙孔 access hole ZnW@YC#9
盲孔 blind via (hole) //f
埋孔 buried via hole g}x(hF
埋,盲孔 buried blind via
y<:<$22O
任意层内部导通孔 any layer inner via hole k;ZxY"^
全部钻孔 all drilled hole !do?~$Og
定位孔 toaling hole 9'[ N1Un.=
无连接盘孔 landless hole x,n,Qlb
中间孔 interstitial hole !bnyJA
无连接盘导通孔 landless via hole 1}%B%*N
引导孔 pilot hole aEt/NwgiQ
端接全隙孔 terminal clearomee hole aUU7{o_Z
准尺寸孔 dimensioned hole [Page] BlA[ T%
在连接盘中导通孔 via-in-pad 0Ua%DyJ
孔位 hole location , %9df+5k
孔密度 hole density K/=|8+IDL
孔图 hole pattern a<~77~"4wn
钻孔图 drill drawing he(A3{'
装配图assembly drawing P"/G
参考基准 datum referan ~;]W T
1) 元件设备 oU*45B`"
j|4C\~i
三绕组变压器:three-column transformer ThrClnTrans b^0}}12
双绕组变压器:double-column transformer DblClmnTrans iBTYY{-wF
电容器:Capacitor A/7{oB:a
并联电容器:shunt capacitor G<|8?6bq#
电抗器:Reactor 9iUr nG*
母线:Busbar !%)F J:p
输电线:TransmissionLine HlvuW(,x=
发电厂:power plant K%v1xZ
断路器:Breaker 0'YG6(h
刀闸(隔离开关):Isolator VHJM*&5
分接头:tap anMF-x4/*q
电动机:motor a`[uNgDO
(2) 状态参数 %w7u]-tR
?']5dD
有功:active power aE;le{|!({
无功:reactive power YG[;"QR
电流:current Q/>{f0
容量:capacity li~d?>
电压:voltage ]vWKR."4
档位:tap position 2'EUy@0
有功损耗:reactive loss nD5 gP
无功损耗:active loss $6OkIP.
功率因数:power-factor aT>'.*\ ]
功率:power l&iq5}[n&
功角:power-angle }by;F9&B
电压等级:voltage grade 5[0
O'%$
空载损耗:no-load loss h3LE>}6D
铁损:iron loss $,+O9Et
铜损:copper loss r\qj!
空载电流:no-load current V-<GT?
阻抗:impedance h$4Hw+Yxs]
正序阻抗:positive sequence impedance Zjbc3M5
负序阻抗:negative sequence impedance [<DZ*|+
零序阻抗:zero sequence impedance vnWWneeNr
电阻:resistor KMI_zhyB
电抗:reactance 3|.um_
电导:conductance B2-V@06
电纳:susceptance yKYTi3_(
无功负载:reactive load 或者QLoad /"eey(X
有功负载: active load PLoad 9E>xIJ@J2T
遥测:YC(telemetering) u%w`:v7Yo(
遥信:YX =c/wplv*
励磁电流(转子电流):magnetizing current Q09[[
定子:stator E_vq
功角:power-angle O3I8k\`
上限:upper limit emCM\|NQg&
下限:lower limit ?>I;34tL(
并列的:apposable ?VP8ycm
高压: high voltage 0g0i4IV
低压:low voltage N[s}qmPha
中压:middle voltage a)wJT`xu
电力系统 power system WZ.@UN,
发电机 generator zT!drq: x
励磁 excitation |&RU/ a
励磁器 excitor 6@rMtQfI
电压 voltage e" St_z(
电流 current O^oWG&Y;v
母线 bus ^s|6vd;PD=
变压器 transformer Z'"tB/=W
升压变压器 step-up transformer ["h5!vj
高压侧 high side YB-h.1T-
输电系统 power transmission system "wNJ
输电线 transmission line 7Zlw^'q$:L
固定串联电容补偿fixed series capacitor compensation eAE`#t
稳定 stability \O2Rhz
电压稳定 voltage stability Mu+0<>
功角稳定 angle stability '.:z&gSqx0
暂态稳定 transient stability vEJWFoeEFm
电厂 power plant uScMn/%
能量输送 power transfer a{L
d
交流 AC I}1NB3>^
装机容量 installed capacity #qK:J;Sn3
电网 power system G3Z)Z)N
落点 drop point &5yVxL:
开关站 switch station KV(Q;~8"X
双回同杆并架 double-circuit lines on the same tower vSEuk}pk
变电站 transformer substation #d6)#:uss
补偿度 degree of compensation 8X[:j&@
高抗 high voltage shunt reactor 1`=nWy='
无功补偿 reactive power compensation E|iQc8gr&
故障 fault qm/)ku0
调节 regulation N sXHO
裕度 magin Q+[n91ey**
三相故障 three phase fault RoPRQCE
故障切除时间 fault clearing time jIJ~QpNE
极限切除时间 critical clearing time AE[b},-[
切机 generator triping _852H$H\
高顶值 high limited value .P8&5i)'P,
强行励磁 reinforced excitation "&Y`+ 0S8
线路补偿器 LDC(line drop compensation) ;r<^a6B
机端 generator terminal Ayxkv)%:@)
静态 static (state) nT7%j{e=L
动态 dynamic (state) p M4 :#%V
单机无穷大系统 one machine - infinity bus system 0XE4<U
机端电压控制 AVR |-:()yxs
电抗 reactance "\w 7q
电阻 resistance rC5
p-B%
功角 power angle !>FYK}c7
有功(功率) active power >*35C`^
无功(功率) reactive power Bs^aI I$
功率因数 power factor d;boIP`M;
无功电流 reactive current Z^3rLCa
下降特性 droop characteristics >g1~CEMN#
斜率 slope 01t1Z}!y
额定 rating +$ 'Zf0U
变比 ratio hOjk3
k
参考值 reference value ZMQZs~;~d
电压互感器 PT NG+GEqx
分接头 tap 6m}Ev95
下降率 droop rate y%"{I7!A
仿真分析 simulation analysis mE+*)gb:Rd
传递函数 transfer function @0Ic3C[rH6
框图 block diagram igCZ|Ru\
受端 receive-side ?WGA?J %2
裕度 margin n(1l}TJy
同步 synchronization 0q()|y?}
失去同步 loss of synchronization 3c-GY:VkLM
阻尼 damping )|ju~qbf
摇摆 swing =W(Q34
保护断路器 circuit breaker - YEZ]:"
电阻:resistance q+yQwX{
电抗:reactance 8'HEms
阻抗:impedance BtkOnbz8X
电导:conductance i1 }:8Unxf
电纳:susceptance