1 backplane 背板 ^X6e\]yj
2 Band gap voltage reference 带隙电压参考 -J=6)
3 benchtop supply 工作台电源 i`52tH y_
4 Block Diagram 方块图 5 Bode Plot 波特图 u ]y[g
6 Bootstrap 自举 )n"0:"Ou
7 Bottom FET Bottom FET 9BP'[SM%),
8 bucket capcitor 桶形电容 2!LDrvPP
9 chassis 机架 KaMg[G
10 Combi-sense Combi-sense dSKvs"
11 constant current source 恒流源 P(yLRc
12 Core Sataration 铁芯饱和 _'mC*7+
13 crossover frequency 交叉频率 G0m$bi=z
14 current ripple 纹波电流 &0f/F:M
15 Cycle by Cycle 逐周期 /JRZ?/<1
16 cycle skipping 周期跳步 qi/k`T
17 Dead Time 死区时间 OmkJP
18 DIE Temperature 核心温度 IAzFwlO9
19 Disable 非使能,无效,禁用,关断 8pf]M&
20 dominant pole 主极点 #/Ob_~-?j
21 Enable 使能,有效,启用 U]+I P;YS
22 ESD Rating ESD额定值 E$z- |-{>
23 Evaluation Board 评估板 e}-fGtFx
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. (;=|2N>7
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 G:1QXwq\j
25 Failling edge 下降沿 lH?jqp
26 figure of merit 品质因数 <V}q8k
27 float charge voltage 浮充电压 Q}^Ip7T
28 flyback power stage 反驰式功率级 0827z
29 forward voltage drop 前向压降 4Th?q{X
30 free-running 自由运行 _'Jjt9@S
31 Freewheel diode 续流二极管 4$, W\d
32 Full load 满负载 33 gate drive 栅极驱动 $bp$[fX(e
34 gate drive stage 栅极驱动级 zqrqbqK5R
35 gerber plot Gerber 图 WI| -pzg
36 ground plane 接地层 gnzg(Y]5w
37 Henry 电感单位:亨利 IhK
SwT
38 Human Body Model 人体模式 Z" H; t\P
39 Hysteresis 滞回 &?Erkc~#
40 inrush current 涌入电流 i,"Xw[H*s
41 Inverting 反相 {S+?n[1r\
42 jittery 抖动 qZE3T:S
43 Junction 结点 )uAY_()/
44 Kelvin connection 开尔文连接 _vb'3~'S
45 Lead Frame 引脚框架 ts(u7CJd
46 Lead Free 无铅 rSt5@f?
47 level-shift 电平移动 hC8WRxEGq
48 Line regulation 电源调整率 `-CN\
49 load regulation 负载调整率 Z5oDj|&l}
50 Lot Number 批号 d0}(d Gl
51 Low Dropout 低压差 M]k Q{(
52 Miller 密勒 53 node 节点 !oXFDC3k
54 Non-Inverting 非反相 f?^-JZ
55 novel 新颖的 6ERMn"[_w
56 off state 关断状态 1yz%ud-l
57 Operating supply voltage 电源工作电压 [*It' J^
58 out drive stage 输出驱动级 NwOV2E6@OW
59 Out of Phase 异相 y@$E5sz
60 Part Number 产品型号 0+1!-Wo
61 pass transistor pass transistor zJ(DO>,p&
62 P-channel MOSFET P沟道MOSFET n6,YA2yZO
63 Phase margin 相位裕度 e <{d{
64 Phase Node 开关节点 *7Y#G8 s
65 portable electronics 便携式电子设备 (y?F8]TfM
66 power down 掉电 6&'kN2
67 Power Good 电源正常 {R63n
68 Power Groud 功率地 ;p~!('{P
69 Power Save Mode 节电模式 lr;ubBbT
70 Power up 上电 c\>I0HH;!
71 pull down 下拉 "|J6*s
72 pull up 上拉 aY,Bt
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) |uz<)
74 push pull converter 推挽转换器 toDi70o
75 ramp down 斜降 gfN=0Xj4
76 ramp up 斜升 XRkUv>Yk
77 redundant diode 冗余二极管 EUI*:JU-
78 resistive divider 电阻分压器 aB (pdW4
79 ringing 振 铃 SXl~lYUL
80 ripple current 纹波电流 Q3=5q w^
81 rising edge 上升沿 QPLWRZu@
82 sense resistor 检测电阻 H[s+.&^
83 Sequenced Power Supplys 序列电源 E=,b;S-
84 shoot-through 直通,同时导通 Hicd
-'
85 stray inductances. 杂散电感 @+zWLq!1pB
86 sub-circuit 子电路 3'6 UvAXFH
87 substrate 基板 Go:(R {P
88 Telecom 电信 j3%Wrt
89 Thermal Information 热性能信息 t {1 [Ip
90 thermal slug 散热片 2/t; }pw8
91 Threshold 阈值 4?@#w>(
92 timing resistor 振荡电阻 [~|k;\2 +
93 Top FET Top FET 6J JA"] `
94 Trace 线路,走线,引线 uUHWTyoO
95 Transfer function 传递函数 s}Go")p<:
96 Trip Point 跳变点 ]smu~t0\
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 5CcX'*P
98 Under Voltage Lock Out (UVLO) 欠压锁定 w0nbL^f
99 Voltage Reference 电压参考 .eVX/6,
100 voltage-second product 伏秒积 eJ<P
101 zero-pole frequency compensation 零极点频率补偿 iJ*Wsp
102 beat frequency 拍频 3k>#z%//
103 one shots 单击电路 :epB:r
104 scaling 缩放 e~)4v
105 ESR 等效串联电阻 [Page] W!.FnM5x
106 Ground 地电位 dVMl;{
107 trimmed bandgap 平衡带隙
7;'UC','
108 dropout voltage 压差 lU=VCuW!
109 large bulk capacitance 大容量电容 {W{;VJKQ2
110 circuit breaker 断路器 `%#_y67v
111 charge pump 电荷泵 OOIp)=4
112 overshoot 过冲 8/)q$zs
dn])6Xl;i
印制电路printed circuit TBJ?8W(
印制线路 printed wiring 7=X6_AD
印制板 printed board 5M'cOJ
印制板电路 printed circuit board @V^.eVM\R
印制线路板 printed wiring board O"TVxP:
印制元件 printed component .Xf_U.h$*@
印制接点 printed contact a9^})By&
印制板装配 printed board assembly Brs}
板 board $,r%@'= &
刚性印制板 rigid printed board S{2;PaK
挠性印制电路 flexible printed circuit RWM~7^JA
挠性印制线路 flexible printed wiring xo @|;Z>&F
齐平印制板 flush printed board lQ ki58.
金属芯印制板 metal core printed board _a"|
:kX
金属基印制板 metal base printed board CiHx.5TiC
多重布线印制板 mulit-wiring printed board B/lIn'=
塑电路板 molded circuit board xA:;wV
散线印制板 discrete wiring board )q4nyT>M
微线印制板 micro wire board />9`Mbg[G
积层印制板 buile-up printed board _O87[F1
表面层合电路板 surface laminar circuit ]x8Y]wAU&{
埋入凸块连印制板 B2it printed board :$yOic}y
载芯片板 chip on board 7g{JE^u
埋电阻板 buried resistance board h V`?,
~K
母板 mother board AZNo%!)o
子板 daughter board twldwuN
背板 backplane BOvJEs!UX
裸板 bare board V?^qW#AG
键盘板夹心板 copper-invar-copper board #LR6wEk
动态挠性板 dynamic flex board KdHkX+-R
静态挠性板 static flex board hTby:$aCg
可断拼板 break-away planel BBX/ &d8n
电缆 cable ny^uNIRPR
挠性扁平电缆 flexible flat cable (FFC) j&A9
&+w
薄膜开关 membrane switch G^|b*n!!
混合电路 hybrid circuit ~PF,[$?4n
厚膜 thick film l1 08.ao
厚膜电路 thick film circuit $`0^E#Nl
薄膜 thin film ~/SLGyu
薄膜混合电路 thin film hybrid circuit ^HP$r*
互连 interconnection "k [$euV
导线 conductor trace line 32J/
齐平导线 flush conductor 5$Kv%U
传输线 transmission line Gk58VODo
跨交 crossover \KpJIHkBRy
板边插头 edge-board contact 4TU\SP8sM
增强板 stiffener !m_y@~pV#u
基底 substrate MB>4Y]rtU
基板面 real estate xK1w->[
导线面 conductor side &V&beq4)p
元件面 component side 5>1c4u`x
焊接面 solder side V+0pvgS[
导电图形 conductive pattern Td^62D;
非导电图形 non-conductive pattern l_
x jsu
基材 base material qIzv|Nte
层压板 laminate cqZlpm$c
覆金属箔基材 metal-clad bade material u,YmCEd_V
覆铜箔层压板 copper-clad laminate (CCL) ZS_
z
复合层压板 composite laminate yswf2F
薄层压板 thin laminate .bh7
基体材料 basis material ~U8#yo
预浸材料 prepreg M6]:^;p'
粘结片 bonding sheet KV{
预浸粘结片 preimpregnated bonding sheer 4.kn,s
环氧玻璃基板 epoxy glass substrate 4 l+z
预制内层覆箔板 mass lamination panel !]7L9TGn
内层芯板 core material mSFA i
粘结层 bonding layer 5X]f}6kT
粘结膜 film adhesive brCL"g|}
无支撑胶粘剂膜 unsupported adhesive film mv*M2NuhT
覆盖层 cover layer (cover lay) }.=wQ_
增强板材 stiffener material )T(1oK(g
铜箔面 copper-clad surface K"Irg.
去铜箔面 foil removal surface }b<w \9AF
层压板面 unclad laminate surface 8jky-r
基膜面 base film surface Y{4nBu
胶粘剂面 adhesive faec 1':};}dCJ
原始光洁面 plate finish H}usL)0&&
粗面 matt finish RSjcOQ8&.w
剪切板 cut to size panel 2'ws@U}lR
超薄型层压板 ultra thin laminate
a(`"qS
A阶树脂 A-stage resin &" yoJ<L
B阶树脂 B-stage resin [-)BI|S:
C阶树脂 C-stage resin CA/Lv{[2
环氧树脂 epoxy resin 9I1i(0q
酚醛树脂 phenolic resin x+Ly,9nc$
聚酯树脂 polyester resin #K>Ue>hx
聚酰亚胺树脂 polyimide resin H5gcP11r
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin R&/"?&pfa
丙烯酸树脂 acrylic resin `,c~M
三聚氰胺甲醛树脂 melamine formaldehyde resin H,!yG5yF
多官能环氧树脂 polyfunctional epoxy resin ICWHEot
溴化环氧树脂 brominated epoxy resin IJZx$8&A
环氧酚醛 epoxy novolac Q'^$;X~-<
氟树脂 fluroresin b|.<rV'BTt
硅树脂 silicone resin }?U
#@ h
硅烷 silane N;cSR\Ng
聚合物 polymer P$/Y9o
无定形聚合物 amorphous polymer m\ @Q}
结晶现象 crystalline polamer soB_j
双晶现象 dimorphism [&p/7
共聚物 copolymer %W2
o`W$
合成树脂 synthetic wI[J> 9Qn
热固性树脂 thermosetting resin [Page]
kL -f@CD
热塑性树脂 thermoplastic resin HNX/#?3
感光性树脂 photosensitive resin 8(-N;<Ef2
环氧值 epoxy value ;l@Ge`&u
双氰胺 dicyandiamide t0ZaI E
粘结剂 binder !3*%-8bp
胶粘剂 adesive SXV
f&8
固化剂 curing agent 5lE9UoG[Q
阻燃剂 flame retardant zwlz zqV
遮光剂 opaquer X'7MW?
q@
增塑剂 plasticizers VQ2B|v
不饱和聚酯 unsatuiated polyester 7C@m(oK
聚酯薄膜 polyester xI5zP?
_v
聚酰亚胺薄膜 polyimide film (PI) ^%33&<mB}
聚四氟乙烯 polytetrafluoetylene (PTFE) 2
3A)^j
增强材料 reinforcing material 2cv=7!K4Uv
折痕 crease 1z8fhE iiE
云织 waviness `S]DHxS
鱼眼 fish eye 6?l|MU"Q.
毛圈长 feather length }pT>dbZ
厚薄段 mark XiyL563gh
裂缝 split MBFn s/
捻度 twist of yarn [g lhru=+
浸润剂含量 size content |OBZSk1jp
浸润剂残留量 size residue KC-@2,c9V
处理剂含量 finish level ru*}lDJ
偶联剂 couplint agent %wmbFj}
断裂长 breaking length )KN]"<jB
吸水高度 height of capillary rise ].x`Fq3
湿强度保留率 wet strength retention l`E KL2n
白度 whitenness kNUNh[
导电箔 conductive foil -lI6!a^
铜箔 copper foil =K6{AmG$
压延铜箔 rolled copper foil ']>/$[!
光面 shiny side 1lHBg
粗糙面 matte side }vX/55
处理面 treated side #Gu(h(Z s
防锈处理 stain proofing T:w %RF[v9
双面处理铜箔 double treated foil e:iqv?2t
模拟 simulation lT F#efcW
逻辑模拟 logic simulation vb]H$@0
电路模拟 circit simulation [7=?I.\Cr7
时序模拟 timing simulation uBxs`'C
模块化 modularization Q~$hx{foN
设计原点 design origin K}Rq<zW
优化(设计) optimization (design) bc*CP0t|
供设计优化坐标轴 predominant axis Gbc2\A\
表格原点 table origin ]*pro|
元件安置 component positioning ,
Y cF~
比例因子 scaling factor E'F87P ^>
扫描填充 scan filling ,Q>wcE6v
矩形填充 rectangle filling ?H(']3X5@
填充域 region filling +>o}
R?xj
实体设计 physical design iKe68kx
逻辑设计 logic design %&S :W%qm?
逻辑电路 logic circuit 5$"IUq*
层次设计 hierarchical design TWo.c _l
自顶向下设计 top-down design Wx F0LhM
自底向上设计 bottom-up design Vi\kB%
费用矩阵 cost metrix {t QZqqdn@
元件密度 component density oh^QW`#(
自由度 degrees freedom g.eMGwonTJ
出度 out going degree :,FI 6`
入度 incoming degree ];au!
_o
曼哈顿距离 manhatton distance s<fzk1LZ
欧几里德距离 euclidean distance #)EVi7UP
网络 network s_Gf7uC
阵列 array !ZTBiC5R
段 segment #H/suQZN"g
逻辑 logic 8YwSaBwO
逻辑设计自动化 logic design automation "}jv5j5
分线 separated time zUd{9B$
分层 separated layer tk,Vp3p
定顺序 definite sequence "gGv>]3
导线(通道) conduction (track) " )/febBS
导线(体)宽度 conductor width <&p0:S7
导线距离 conductor spacing rQ287y{
导线层 conductor layer \ q=Bbfzv
导线宽度/间距 conductor line/space ,lr\XhO
第一导线层 conductor layer No.1 tAH0o\1;
圆形盘 round pad 1JSKK.LuJV
方形盘 square pad Pvu*Y0_p
菱形盘 diamond pad k<!xOg
长方形焊盘 oblong pad g~Agy
子弹形盘 bullet pad )0p7d:%mV
泪滴盘 teardrop pad B0eKj=y;
雪人盘 snowman pad ~xV|<;
形盘 V-shaped pad V *HXx;:
环形盘 annular pad {/PiX1mn
非圆形盘 non-circular pad i4^1bd
隔离盘 isolation pad !_#2$J*s^D
非功能连接盘 monfunctional pad +LeM[XX
偏置连接盘 offset land Q=Y1kcTOn
腹(背)裸盘 back-bard land &WAJ;7f
盘址 anchoring spaur `u7"s'
连接盘图形 land pattern 5t-dvYgU
连接盘网格阵列 land grid array M~t;&po
孔环 annular ring qJf=f3
元件孔 component hole {|ChwM\x
安装孔 mounting hole qJPEq%'Q
支撑孔 supported hole (n3MbVi3LU
非支撑孔 unsupported hole Or*e$uMIY
导通孔 via 2P4$^G[
镀通孔 plated through hole (PTH) h,%b>JFo
余隙孔 access hole E{B=%ZNnm
盲孔 blind via (hole) =[T_`*s&
埋孔 buried via hole 9$oU6#U,h
埋,盲孔 buried blind via JVk"M=c
任意层内部导通孔 any layer inner via hole dE0p>4F
全部钻孔 all drilled hole &S|%>C{P.w
定位孔 toaling hole yCLDJ%8
无连接盘孔 landless hole t;e+WZkV
中间孔 interstitial hole `oUuAL
无连接盘导通孔 landless via hole H|i39XV
引导孔 pilot hole q=(.N>%
端接全隙孔 terminal clearomee hole |'" 17c&
准尺寸孔 dimensioned hole [Page] ~99DE78
在连接盘中导通孔 via-in-pad us
TPr
孔位 hole location "o.g}Pv
孔密度 hole density F1aI4H<(T
孔图 hole pattern ~i ImM|*0
钻孔图 drill drawing H^N
5yOj/
装配图assembly drawing [[sfuJD
参考基准 datum referan xesZ7{ o
1) 元件设备 mFdj+ &2\
~KF>Jow?Y
三绕组变压器:three-column transformer ThrClnTrans Fv(1A_~IS
双绕组变压器:double-column transformer DblClmnTrans GIGC,zP@k
电容器:Capacitor ~xSAR;8
并联电容器:shunt capacitor NiCB.a
电抗器:Reactor cXY;Tw45
母线:Busbar /:],bNb
输电线:TransmissionLine d5O_~xf&
发电厂:power plant 8Q2qroT
断路器:Breaker =Pu;wx9
刀闸(隔离开关):Isolator bm:"&U*tu'
分接头:tap @ZUrr_|
电动机:motor FhkS"y
(2) 状态参数 50l!f7
s
v}o%
有功:active power C%l+<wpXO
无功:reactive power 2GRdfX
电流:current E"l/r4*f@
容量:capacity 5i42o+'
电压:voltage fi.[a8w:W
档位:tap position &+v!mw >
有功损耗:reactive loss '!wI8f
无功损耗:active loss 8UahoNrSt
功率因数:power-factor =KctAR;
功率:power l9eCsVQ~V
功角:power-angle "7&DuF$s)
电压等级:voltage grade
!8V
空载损耗:no-load loss V{yP/X
铁损:iron loss Jiv%Opo/|
铜损:copper loss [m9Iz!E
空载电流:no-load current qQ%RnD9
阻抗:impedance >ARZ=x[
正序阻抗:positive sequence impedance th?w&;L
负序阻抗:negative sequence impedance 5UgxuuP4
零序阻抗:zero sequence impedance ev}ugRxt|k
电阻:resistor 1K`7
电抗:reactance f0lpwwe
电导:conductance OdrnPo{
电纳:susceptance (&)PlIi7
无功负载:reactive load 或者QLoad &*4C{N
有功负载: active load PLoad =5v=<, ]
遥测:YC(telemetering) LW$(;-rY
遥信:YX ?2zbZ
励磁电流(转子电流):magnetizing current yDil
定子:stator ~7$4w# of0
功角:power-angle 3iI 4yg
上限:upper limit 3m#/1=@o
下限:lower limit 'wg>=|Q5
并列的:apposable z{N~AaY
高压: high voltage $k,wA8OZ-
低压:low voltage 8`{)1.d5[
中压:middle voltage ?E*;fDEC
电力系统 power system P d"=&Az|
发电机 generator 7%Q?BH7{
励磁 excitation {%"n[DLps
励磁器 excitor y_7lSo8<
电压 voltage !G8=S'~~
电流 current lzE{e6
母线 bus }^@Q9<P^E
变压器 transformer )#H&lH
升压变压器 step-up transformer I+VL~'VlS
高压侧 high side s
IE2a0+
输电系统 power transmission system !'jZ
!NFO
输电线 transmission line LrGLIt`
固定串联电容补偿fixed series capacitor compensation ye-EJDZN
稳定 stability #aeKK7[
电压稳定 voltage stability 5vmc'Om
功角稳定 angle stability ]+
KN9
暂态稳定 transient stability U{JD\G8m
电厂 power plant b:M1P&R
能量输送 power transfer b5@sG^
交流 AC c&mLK1A6
装机容量 installed capacity NR6wNz&81
电网 power system l
10p'9n
落点 drop point sMn)[k
vX
开关站 switch station ]VCVV!G_=n
双回同杆并架 double-circuit lines on the same tower tpY]Mz[J
变电站 transformer substation $5]}]
补偿度 degree of compensation [B,w\PLub
高抗 high voltage shunt reactor UD!-.I]
无功补偿 reactive power compensation ){I0
故障 fault <l.l6okp
调节 regulation %6%~`((4
裕度 magin C$+z1z.!
三相故障 three phase fault ^xt @
故障切除时间 fault clearing time y v58~w*"
极限切除时间 critical clearing time k Xg&}n7
切机 generator triping LJc"T)>$`
高顶值 high limited value Xt.ca,`U
强行励磁 reinforced excitation X 3dXRDB'
线路补偿器 LDC(line drop compensation) 1o8C4?T&
机端 generator terminal #lY_XV.
静态 static (state) 3T= ?!|e
动态 dynamic (state) f'oO/0lx
单机无穷大系统 one machine - infinity bus system Ct<]('Hm(
机端电压控制 AVR 8)o%0#;0B
电抗 reactance CiNOGSlDj
电阻 resistance l"rX'g?
功角 power angle -\9K'8 C
有功(功率) active power +7KRoF |
无功(功率) reactive power `w_%HVw>"
功率因数 power factor ;xl0J*r
无功电流 reactive current 1s _N!a
下降特性 droop characteristics T\wfYuc&X
斜率 slope `9*
|Y 8:
额定 rating Tfz_h~D
变比 ratio 11((b
参考值 reference value
ogvB{R
电压互感器 PT F+SqJSa
分接头 tap A`:a
T{j
下降率 droop rate
I !J'
仿真分析 simulation analysis 0g`$Dap
传递函数 transfer function S
aH':UN
框图 block diagram OfK>-8
受端 receive-side KDS}"/
裕度 margin 7C9_;81_Dt
同步 synchronization vk4Q2P
失去同步 loss of synchronization G`Df'Yy
阻尼 damping |Zk2]eUO+
摇摆 swing nCS" l5
保护断路器 circuit breaker 3`TD>6rs
电阻:resistance >i_ #q$o
电抗:reactance %6W%-`
阻抗:impedance ^m/7TwD
电导:conductance Lb,wn{
电纳:susceptance