1 backplane 背板 )cnB>Qul
2 Band gap voltage reference 带隙电压参考 UXVjRY`M.\
3 benchtop supply 工作台电源 nS0K&MH6B
4 Block Diagram 方块图 5 Bode Plot 波特图 E%\j R
6 Bootstrap 自举 "ZDc$v:Qa
7 Bottom FET Bottom FET iha{(-
8 bucket capcitor 桶形电容 {dV#"+
9 chassis 机架 c#M'Mye
10 Combi-sense Combi-sense ]q DhGt
11 constant current source 恒流源 vr<6j/ty
12 Core Sataration 铁芯饱和 zXQo pQ1
13 crossover frequency 交叉频率 FN5*pVD;<
14 current ripple 纹波电流 nj99!"_
15 Cycle by Cycle 逐周期 OJn g
16 cycle skipping 周期跳步 ((wG
K|d
17 Dead Time 死区时间 i.Iiwe0G
18 DIE Temperature 核心温度 F|q-ZlpW-
19 Disable 非使能,无效,禁用,关断 |?6r&bT
20 dominant pole 主极点 L
DD^X@q
21 Enable 使能,有效,启用 d:C-
22 ESD Rating ESD额定值 YHN@?}T()
23 Evaluation Board 评估板 Q.Hy"~
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 7Wb:^.d
g
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 xg~q'>
25 Failling edge 下降沿 1J<Wth{
26 figure of merit 品质因数 r+fR^hv
27 float charge voltage 浮充电压 rMIr&T
28 flyback power stage 反驰式功率级 bj4cW\b(
29 forward voltage drop 前向压降 lj$\2B
30 free-running 自由运行 i,N U%be
31 Freewheel diode 续流二极管 /%Lj$]S7[4
32 Full load 满负载 33 gate drive 栅极驱动 Z.+-MN WV
34 gate drive stage 栅极驱动级 WmTSxneo
35 gerber plot Gerber 图 dxbP'2~
36 ground plane 接地层 xoI;s}*E
37 Henry 电感单位:亨利 S0nBX"$u
38 Human Body Model 人体模式 [8AGW7_
39 Hysteresis 滞回 az@{O4
40 inrush current 涌入电流 B
Jp\a7`;
41 Inverting 反相 Yz;Hu$/
42 jittery 抖动 WUx}+3eWv
43 Junction 结点 _?&$@c
44 Kelvin connection 开尔文连接 %E Jv!u*-
45 Lead Frame 引脚框架 sh(G{Yz@
46 Lead Free 无铅 |>a sGP
47 level-shift 电平移动 "M5P-l$p}
48 Line regulation 电源调整率 Ub=g<MYHV
49 load regulation 负载调整率 ~;O|$xL
50 Lot Number 批号 :U!kn b"/>
51 Low Dropout 低压差 mxsmW
52 Miller 密勒 53 node 节点 s@sRdoTdF
54 Non-Inverting 非反相 P3se"pP
55 novel 新颖的 )p'ZSXb
56 off state 关断状态 d)F~)}TFM
57 Operating supply voltage 电源工作电压 o
%sBU
58 out drive stage 输出驱动级 /,dcr*
59 Out of Phase 异相 rLO1Sv
60 Part Number 产品型号 <RY5ZP
61 pass transistor pass transistor /n;-f%dL
62 P-channel MOSFET P沟道MOSFET T X.YTU
63 Phase margin 相位裕度 ?_q
e
2R.
64 Phase Node 开关节点 X[b= 25Ct
65 portable electronics 便携式电子设备 <4SY'-w
66 power down 掉电 ;n_ |t/=
67 Power Good 电源正常 WGFp<R
68 Power Groud 功率地 W]MKc&R
69 Power Save Mode 节电模式 fCTdM+t
70 Power up 上电 LcS\#p#s]
71 pull down 下拉 s*{l}~fPkW
72 pull up 上拉 D+?/MrP
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) j:K>3?
74 push pull converter 推挽转换器 0A\OZ^P8
75 ramp down 斜降 NfizX!w&
76 ramp up 斜升 I\E`xkbBu
77 redundant diode 冗余二极管 ,K=\Y9l3
78 resistive divider 电阻分压器 ~pA_E!3W
79 ringing 振 铃 r'xZF~}k"~
80 ripple current 纹波电流 Rhh5r0 \5
81 rising edge 上升沿 ,.[T]37
82 sense resistor 检测电阻 8o43J;mA
83 Sequenced Power Supplys 序列电源 Yy`\??,
84 shoot-through 直通,同时导通 A g=>F5
85 stray inductances. 杂散电感 s<VNW
86 sub-circuit 子电路 }SYR)eE\
87 substrate 基板 mn;;wp
88 Telecom 电信 p>Dv&fX
89 Thermal Information 热性能信息 _$%.F|:
90 thermal slug 散热片 'fO[f}oa_.
91 Threshold 阈值 Zg1=g_xY
92 timing resistor 振荡电阻 9x@( K|
93 Top FET Top FET 0nUcUdIf+
94 Trace 线路,走线,引线 l&l&eOE
95 Transfer function 传递函数 rOd<nP^`\
96 Trip Point 跳变点 ?145^ w
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 5v6 x
98 Under Voltage Lock Out (UVLO) 欠压锁定 (os}s8cIh
99 Voltage Reference 电压参考 <$bM*5sHF>
100 voltage-second product 伏秒积 +bpUb0.W
101 zero-pole frequency compensation 零极点频率补偿 D^ZG-WR
102 beat frequency 拍频 ;8\w$SPP
103 one shots 单击电路 ssaEAm:
104 scaling 缩放 u6^cLQO+
105 ESR 等效串联电阻 [Page] .l?sYe64S
106 Ground 地电位 ~+w'b7T,=
107 trimmed bandgap 平衡带隙 ?O3E.!Q|
108 dropout voltage 压差 )H@"S]?7i"
109 large bulk capacitance 大容量电容 AyHhq8Y
110 circuit breaker 断路器 j"6r]nc&
111 charge pump 电荷泵 ybLl[K(D=
112 overshoot 过冲 KMC]<
Q@]~O-
印制电路printed circuit YaiogA
印制线路 printed wiring ]DVZeI03@
印制板 printed board 'J\nvNm
印制板电路 printed circuit board o
4G%m>$
印制线路板 printed wiring board #1fT\aP
印制元件 printed component q"){PRTm/
印制接点 printed contact >g7}JI&
印制板装配 printed board assembly r}351S5(
板 board /+^7lQo\]
刚性印制板 rigid printed board eC`} oEz
挠性印制电路 flexible printed circuit BG ,ln(Vz
挠性印制线路 flexible printed wiring I/YBL
齐平印制板 flush printed board SSG57N-T
金属芯印制板 metal core printed board S -$ L2N
金属基印制板 metal base printed board x\(@v
多重布线印制板 mulit-wiring printed board r7B.@+QK
塑电路板 molded circuit board wEd+Ds]$
散线印制板 discrete wiring board c;siMWw;
微线印制板 micro wire board @bs
YJ4-V
积层印制板 buile-up printed board t~vOm
表面层合电路板 surface laminar circuit P?|F+RoX$
埋入凸块连印制板 B2it printed board Jr|"QRC
载芯片板 chip on board P5$d#Y(=
埋电阻板 buried resistance board SURbH;[
母板 mother board S-x'nu$u
子板 daughter board %f[0&)1!.v
背板 backplane 581Jp'cje
裸板 bare board `)5,!QPQ7u
键盘板夹心板 copper-invar-copper board 2gP^+.
动态挠性板 dynamic flex board p;8I@~dh
静态挠性板 static flex board ])`+
78
可断拼板 break-away planel _0HCtx ;
电缆 cable \Af25Mcf:
挠性扁平电缆 flexible flat cable (FFC) r 0mA
薄膜开关 membrane switch : jgvg$fd
混合电路 hybrid circuit }
@r|o:I
厚膜 thick film J)R2O{ z
厚膜电路 thick film circuit T''PzY!Qf
薄膜 thin film 4pU|BL\j
薄膜混合电路 thin film hybrid circuit [=3f:>ssm
互连 interconnection *=G~26*!V
导线 conductor trace line W`^euBr7R>
齐平导线 flush conductor #B_Em$
传输线 transmission line W^U6O&-K
跨交 crossover @34Z/%A
板边插头 edge-board contact ^7b[spqE
增强板 stiffener 5&Y%N(
基底 substrate h>0R!Rl8
基板面 real estate Y9}5&#
导线面 conductor side dP[vXhc
元件面 component side 1#nR$
焊接面 solder side ]IF
QD
导电图形 conductive pattern ?HD
eiJkX
非导电图形 non-conductive pattern TNi4H:\
基材 base material sY|by\-c
层压板 laminate A(Tqf.,G
覆金属箔基材 metal-clad bade material zY11.!2
覆铜箔层压板 copper-clad laminate (CCL) YgiLfz iT
复合层压板 composite laminate YJ6y]r
K2,
薄层压板 thin laminate Z}X oWT2f
基体材料 basis material <[*%d~92z
预浸材料 prepreg $*k(h|XfwW
粘结片 bonding sheet >JSk/]"
预浸粘结片 preimpregnated bonding sheer
5yA1<&z
环氧玻璃基板 epoxy glass substrate )># Y,/q
预制内层覆箔板 mass lamination panel v8{ jEAK
内层芯板 core material So6ZNh9
粘结层 bonding layer DHI%R<
粘结膜 film adhesive +ConK>;
无支撑胶粘剂膜 unsupported adhesive film a9f!f %9
覆盖层 cover layer (cover lay) vk:k ~
增强板材 stiffener material OV~]-5gau
铜箔面 copper-clad surface h4iz(*
去铜箔面 foil removal surface rofGD9f
层压板面 unclad laminate surface A'zXbp:%
基膜面 base film surface pxGDzU
胶粘剂面 adhesive faec -(oFO'Lbg
原始光洁面 plate finish t[r<&1[&
粗面 matt finish {4C/ZA{|l
剪切板 cut to size panel d:<</ah
超薄型层压板 ultra thin laminate MBIlt
1P
A阶树脂 A-stage resin %pJRu-D
B阶树脂 B-stage resin vk1E!T9X
C阶树脂 C-stage resin t^k^e{,q#
环氧树脂 epoxy resin l-v(~u7
酚醛树脂 phenolic resin *UerLpf
聚酯树脂 polyester resin _N @h
聚酰亚胺树脂 polyimide resin ^CBc~um2
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Tr6J+hS
丙烯酸树脂 acrylic resin e=H,|)P
三聚氰胺甲醛树脂 melamine formaldehyde resin
S6d&w6
多官能环氧树脂 polyfunctional epoxy resin 1H-d<G0)
溴化环氧树脂 brominated epoxy resin H^d2|E[D
环氧酚醛 epoxy novolac hvFXYq_[O
氟树脂 fluroresin LvPcH
硅树脂 silicone resin VG=mA4Dd
硅烷 silane u4KP;_,m
聚合物 polymer &^7^7:Y=?
无定形聚合物 amorphous polymer 4Ou5Vp&y
结晶现象 crystalline polamer > N bb0T
双晶现象 dimorphism sw\O\%^
共聚物 copolymer cWU9mzsE
合成树脂 synthetic h>a/3a$g
热固性树脂 thermosetting resin [Page] zbL8
pp
热塑性树脂 thermoplastic resin Lw1aG;5
感光性树脂 photosensitive resin m~f J_
环氧值 epoxy value >WZ_) `R
双氰胺 dicyandiamide (DnrJ.QU}t
粘结剂 binder yQ03&{#
胶粘剂 adesive x
&
ZW
f?
固化剂 curing agent sX
c|++
阻燃剂 flame retardant J$>9UCk7B
遮光剂 opaquer r7zS4;b
增塑剂 plasticizers W1!Nq`
不饱和聚酯 unsatuiated polyester =>mx>R`S
聚酯薄膜 polyester !7>~=n_,L.
聚酰亚胺薄膜 polyimide film (PI) = }!4%.$
聚四氟乙烯 polytetrafluoetylene (PTFE) K;'s+ZD
增强材料 reinforcing material /@O$jlX5I
折痕 crease n#
4e1n+I
云织 waviness ]n
'FD|
鱼眼 fish eye +FBUB
毛圈长 feather length \:5M0
厚薄段 mark v?L`aj1ox
裂缝 split \s@7pM=(
捻度 twist of yarn ?.~hex#M@
浸润剂含量 size content y?-zQs0
浸润剂残留量 size residue 3*C|"|lJ
处理剂含量 finish level [B1h0IR
偶联剂 couplint agent Q~-M B]'
断裂长 breaking length ^V?W'~
吸水高度 height of capillary rise ^ fqco9^;
湿强度保留率 wet strength retention 2'-!9!C
白度 whitenness 5<77o|
导电箔 conductive foil JBMJR
铜箔 copper foil }{S pV
压延铜箔 rolled copper foil nsjrzO79L8
光面 shiny side Y7GHIzX
粗糙面 matte side n1Fp$9%
处理面 treated side 6!A+$"
防锈处理 stain proofing %4I13|<A`
双面处理铜箔 double treated foil tg"NWp6
模拟 simulation g&?RQ
逻辑模拟 logic simulation ++|vy~T
电路模拟 circit simulation (>
VD#n
时序模拟 timing simulation N6<G`k,
模块化 modularization *V[6ta'
设计原点 design origin @3Nvf}He
优化(设计) optimization (design) ~ \o
hH
供设计优化坐标轴 predominant axis 5-B % 08T
表格原点 table origin 7blo<|9
元件安置 component positioning 1MYA/l$
比例因子 scaling factor =LyRCrA
扫描填充 scan filling PCX X[N
矩形填充 rectangle filling oeA}b-Ct0
填充域 region filling 4<<T#oW.:G
实体设计 physical design v[!ZRwk4w3
逻辑设计 logic design _@A%t&l
逻辑电路 logic circuit jA,|.P>
层次设计 hierarchical design Q$:>yveR*
自顶向下设计 top-down design Kn`-5{1B|
自底向上设计 bottom-up design vcz?;lg
费用矩阵 cost metrix D"ecwx{%;C
元件密度 component density "]kq,j^]
自由度 degrees freedom 8I)}c1j`v
出度 out going degree ){FXonVP
入度 incoming degree met`f0jw
曼哈顿距离 manhatton distance S*Hv2sl
欧几里德距离 euclidean distance 4&_|myO&
网络 network QQW]j;'~
阵列 array cIB[D.
段 segment =2R0 g2n
逻辑 logic ~7O.}RP0
逻辑设计自动化 logic design automation $e/[!3CASP
分线 separated time bVW2Tjc:
分层 separated layer pUm|e5
定顺序 definite sequence >>R,P
Ow-
导线(通道) conduction (track) CMviR<.
导线(体)宽度 conductor width hw)#TEt
导线距离 conductor spacing vI5'npM
导线层 conductor layer x!;;;iS
导线宽度/间距 conductor line/space BQF7S<O+
第一导线层 conductor layer No.1 yd~}CF
圆形盘 round pad XFJz\'{
方形盘 square pad D\ kd6
菱形盘 diamond pad /~}<[6ZGCY
长方形焊盘 oblong pad
y8/+kn +
子弹形盘 bullet pad *jrQ-'<T
泪滴盘 teardrop pad 54>gr1B
雪人盘 snowman pad BU=;rz!;
形盘 V-shaped pad V ' "I-! +
环形盘 annular pad @*"H{xo.U
非圆形盘 non-circular pad Cy2)M(RW
隔离盘 isolation pad p{W'[A{J .
非功能连接盘 monfunctional pad C~q&
偏置连接盘 offset land )Nkf'&
腹(背)裸盘 back-bard land A#x_>fV
盘址 anchoring spaur Qzq3{%^x_
连接盘图形 land pattern L)-1( e<x
连接盘网格阵列 land grid array &eY&6I
孔环 annular ring L/7YI\C2
元件孔 component hole lm\~_ 4l1
安装孔 mounting hole \
ix&U
支撑孔 supported hole ^7,`6g
非支撑孔 unsupported hole #@8JYzMq%
导通孔 via zA%$l&QN]
镀通孔 plated through hole (PTH) !r %u@[(
余隙孔 access hole >8=rD
盲孔 blind via (hole) 3Sl2c
埋孔 buried via hole .xV^%e?H
埋,盲孔 buried blind via 2Wp)CI<\D
任意层内部导通孔 any layer inner via hole %Qy9X+N:
全部钻孔 all drilled hole [a!*m<
定位孔 toaling hole MVXy)9q
无连接盘孔 landless hole 3JXKpk?
中间孔 interstitial hole KreF\M%Ke
无连接盘导通孔 landless via hole }&Kl)2:O
引导孔 pilot hole NhF<2[mt
端接全隙孔 terminal clearomee hole I`4k5KB;
准尺寸孔 dimensioned hole [Page] <MzXTy3\
在连接盘中导通孔 via-in-pad i;I!Jc_b'
孔位 hole location LR Dj!{k{
孔密度 hole density c!Wj^
孔图 hole pattern <EM'|IR?
钻孔图 drill drawing EU4j'1!&g<
装配图assembly drawing j*#k%;c
参考基准 datum referan {1m.d;(1
1) 元件设备 'RzzLk|$
W'}^m*F
三绕组变压器:three-column transformer ThrClnTrans ;|AyP
双绕组变压器:double-column transformer DblClmnTrans hYY-Eq4TC
电容器:Capacitor <= Aqi9 1
并联电容器:shunt capacitor I_3{i`g
电抗器:Reactor 1rGi"kdf
母线:Busbar ew
4pAav
输电线:TransmissionLine RC+`sZE9
发电厂:power plant O~&j}WN
断路器:Breaker IW5N^J
刀闸(隔离开关):Isolator .$N8cYu0
分接头:tap R~H +.Vh
电动机:motor A`ScAzx5{
(2) 状态参数 sQgJ`+Y8_
H0?Vq8I?
有功:active power ,@r 0-gL
无功:reactive power ;`:A(yN]T
电流:current %w#8t#[,6
容量:capacity 7xoq:oP-}N
电压:voltage %hV]vm
档位:tap position Dio9'&DtC
有功损耗:reactive loss 3&"+)*/ m
无功损耗:active loss thrv_^A
功率因数:power-factor PpWdZ
功率:power *!&,)''
功角:power-angle BfdS3VrZ/
电压等级:voltage grade GRj#1OqL
空载损耗:no-load loss hhcO
]*
铁损:iron loss S7f"\[Aw
铜损:copper loss zsmlXyP'e!
空载电流:no-load current F%`O$uXA
阻抗:impedance s]Qo'q2
正序阻抗:positive sequence impedance 1CA%nqlng
负序阻抗:negative sequence impedance 23*OuY
零序阻抗:zero sequence impedance akV-|v_
电阻:resistor MVOWJaT(Aq
电抗:reactance 8 GW0w
电导:conductance h}yfL@
电纳:susceptance +5qY*$dn
无功负载:reactive load 或者QLoad (;cvLop
有功负载: active load PLoad C jZIBMGc
遥测:YC(telemetering) WIYWql>*
遥信:YX ^+rI=c 0
励磁电流(转子电流):magnetizing current N%fDgK
定子:stator Uo=_=.GQ
功角:power-angle LQXMGgp
上限:upper limit )bl^:C
下限:lower limit CQ/ps,~M
并列的:apposable (%SKTM
高压: high voltage ?C* }NM
低压:low voltage 0^mCj<g
中压:middle voltage NXSjN~aG2
电力系统 power system jWcfQ
发电机 generator E5
uk<e_
励磁 excitation @ w?,7i-S
励磁器 excitor {q.|UCg[L
电压 voltage DQ9}('^
电流 current ?d`j}
母线 bus t 4>\;
变压器 transformer n7(/ml+Q_
升压变压器 step-up transformer iPdR;O'
高压侧 high side mG.H=iw
输电系统 power transmission system bD<hzOa
输电线 transmission line \VHRI<$+5
固定串联电容补偿fixed series capacitor compensation Hd?#^X
稳定 stability U)] }EgpF
电压稳定 voltage stability Wh^wKF~%
功角稳定 angle stability A1F!I4p5
暂态稳定 transient stability - sL4tMP
电厂 power plant (Z?g^kjq)
能量输送 power transfer m\@ q2l-
交流 AC LZz]4Mf
装机容量 installed capacity YWhp 4`m
电网 power system uL
|O<
落点 drop point ASULg{
开关站 switch station sPRo=LB
双回同杆并架 double-circuit lines on the same tower j71RlS73
变电站 transformer substation =PIarUJ
补偿度 degree of compensation 3.w &e0Es
高抗 high voltage shunt reactor U)C>^ !Us
无功补偿 reactive power compensation b/obHB+:
故障 fault As>P(
调节 regulation Nbd[xs-lw
裕度 magin h]DzX8r}
三相故障 three phase fault gzEcdDD
故障切除时间 fault clearing time BoP,MpF
极限切除时间 critical clearing time Oj#/R?%,X
切机 generator triping <Y+>a#T
高顶值 high limited value m(CAXq-t
强行励磁 reinforced excitation BjV;/<bt
线路补偿器 LDC(line drop compensation) v%;Nyab6$
机端 generator terminal [ ]42$5eof
静态 static (state) e,Sxu[2
动态 dynamic (state) Bj*
M
W
单机无穷大系统 one machine - infinity bus system 5v"S v
机端电压控制 AVR
~RRS{\,
电抗 reactance mO&zE;/[
电阻 resistance CtE <9?
功角 power angle C^7M>i
有功(功率) active power 0`Y"xN`'i
无功(功率) reactive power fF.sT7Az+
功率因数 power factor `ZGKM>q`
无功电流 reactive current nHl{'|~
下降特性 droop characteristics zszx~LSvIT
斜率 slope mOntc6&]
额定 rating >j)y7DSE
变比 ratio [WO>}rGw4
参考值 reference value +u;RFY^
电压互感器 PT lf}%^od~6
分接头 tap &VT O9d
下降率 droop rate $PFE>=nM
仿真分析 simulation analysis Eg4_kp0Lq
传递函数 transfer function {ZKXT8'
框图 block diagram Xd5uF/w
受端 receive-side C=&;4In
裕度 margin Vr hd\
同步 synchronization `Hd~H
失去同步 loss of synchronization m.ejGm?
阻尼 damping YcN &\(
摇摆 swing NE+
;<mW
保护断路器 circuit breaker A$-\Er+f
电阻:resistance -;iCe7|Twf
电抗:reactance k:#u%Z
阻抗:impedance b)7v-1N
电导:conductance KN".0WU
电纳:susceptance