1 backplane 背板 {}:ToIp
2 Band gap voltage reference 带隙电压参考 'U'yC2BI n
3 benchtop supply 工作台电源 }^B6yWUN
4 Block Diagram 方块图 5 Bode Plot 波特图 -GLMmZJt
6 Bootstrap 自举 Xy%p "b<
7 Bottom FET Bottom FET ZoArQ(YFy
8 bucket capcitor 桶形电容 ^_lzZOhG
9 chassis 机架 <]G]W/eB'
10 Combi-sense Combi-sense %u;~kP|S%
11 constant current source 恒流源 ,]T2$?|
12 Core Sataration 铁芯饱和 XV^1tX>f{
13 crossover frequency 交叉频率 SM@QUAXO
14 current ripple 纹波电流 tnLAJ+-M
15 Cycle by Cycle 逐周期 ^wS5>lf7p
16 cycle skipping 周期跳步 >ooZj9:'
17 Dead Time 死区时间 zRPeNdX
18 DIE Temperature 核心温度
1!>Jpi0
19 Disable 非使能,无效,禁用,关断 sN5B7)Vc
20 dominant pole 主极点 "?mJqA
21 Enable 使能,有效,启用 H*9~yT'Q
22 ESD Rating ESD额定值 qoAj]
")
23 Evaluation Board 评估板 '}Ri`
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. w|Nz_3tI
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 |hr]>P1
25 Failling edge 下降沿 r;m)nRu
26 figure of merit 品质因数 n9s iX
27 float charge voltage 浮充电压 VsA'de!V4[
28 flyback power stage 反驰式功率级 >|;aIa@9
29 forward voltage drop 前向压降 ;`6^6p\p
30 free-running 自由运行 qpXWi
&g
31 Freewheel diode 续流二极管 E}ZJ)V7
32 Full load 满负载 33 gate drive 栅极驱动 ]KJj6xn
34 gate drive stage 栅极驱动级 ~jsLqY*(+
35 gerber plot Gerber 图 Ge<nxl<Bd
36 ground plane 接地层 a. z;t8
37 Henry 电感单位:亨利 <\;#jF%V
38 Human Body Model 人体模式 wg w(YU
39 Hysteresis 滞回 GH[wv<
40 inrush current 涌入电流 !fj(tPq
41 Inverting 反相 yBI'djL~>
42 jittery 抖动 }3?n~s\)6f
43 Junction 结点 M}!2H*
44 Kelvin connection 开尔文连接 ^+g$iM[`f
45 Lead Frame 引脚框架 x.q+uU$^
46 Lead Free 无铅 3$X'Y]5a
47 level-shift 电平移动 DY^;EZ!hb
48 Line regulation 电源调整率 w}=5ElB
49 load regulation 负载调整率 \<g*8?yFs
50 Lot Number 批号 a1@Y3MQ;i
51 Low Dropout 低压差 x*/S*!vx\
52 Miller 密勒 53 node 节点 p/h
Rk<K6
54 Non-Inverting 非反相 Q1+dCCY#F
55 novel 新颖的 ]KmO$4
56 off state 关断状态 s-v
57 Operating supply voltage 电源工作电压 nvPwngEQm
58 out drive stage 输出驱动级 g1(IR)U!z
59 Out of Phase 异相 >vA2A1WhW
60 Part Number 产品型号 AA7C$;Z15~
61 pass transistor pass transistor #_u~/jhX
62 P-channel MOSFET P沟道MOSFET Y0X-Zqk'
63 Phase margin 相位裕度 ?Ec7" hK
64 Phase Node 开关节点 G["c\Xux
65 portable electronics 便携式电子设备
XcjRO#s\
66 power down 掉电 :ijAqfX
67 Power Good 电源正常 v\{!THCSh
68 Power Groud 功率地 ^f(@gS}?
69 Power Save Mode 节电模式 ->V<DZK
70 Power up 上电 \P6$mh\T
71 pull down 下拉 VTH>
o>g
72 pull up 上拉 Nal9M[]c
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) &Udb9
74 push pull converter 推挽转换器 Cid
;z
75 ramp down 斜降 Z+=@<i''
76 ramp up 斜升 UNBH
77 redundant diode 冗余二极管 pJtex^{!:
78 resistive divider 电阻分压器 1 9CK+;b
79 ringing 振 铃 ^cuc.g)c$?
80 ripple current 纹波电流 =z
/dcC$r
81 rising edge 上升沿 r%+V8o
82 sense resistor 检测电阻 {Ja!~N;3
83 Sequenced Power Supplys 序列电源 - RU=z!{
84 shoot-through 直通,同时导通 _/tHD]um
85 stray inductances. 杂散电感 aSnFKB
86 sub-circuit 子电路 i ,/0/?)*_
87 substrate 基板 B]l)++~
88 Telecom 电信 HKUn`ng
89 Thermal Information 热性能信息 sdo[D
90 thermal slug 散热片 ;N?]eM}yf
91 Threshold 阈值 $F5 b
92 timing resistor 振荡电阻 #%h-[/
93 Top FET Top FET K>@+m
94 Trace 线路,走线,引线 Bn &Ws
95 Transfer function 传递函数 >: g3k
96 Trip Point 跳变点 N <Xq]!
K-
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) m+T;O/lG0{
98 Under Voltage Lock Out (UVLO) 欠压锁定 =7m)sxj]w
99 Voltage Reference 电压参考 "9Q40w\
100 voltage-second product 伏秒积 Fkd+pS\9g~
101 zero-pole frequency compensation 零极点频率补偿
c$yk s
102 beat frequency 拍频 z+n,uHs
103 one shots 单击电路 SR|`!
104 scaling 缩放 Vo'T!e- B
105 ESR 等效串联电阻 [Page] g0["^P1tV
106 Ground 地电位 $cU!m(SILQ
107 trimmed bandgap 平衡带隙 dx@-/^.
108 dropout voltage 压差 M]2]\km
109 large bulk capacitance 大容量电容 !'9Feoez
110 circuit breaker 断路器 VL` z[|e @
111 charge pump 电荷泵 =h5H~G5AT
112 overshoot 过冲 o9dY9o+Z
N@Uy=?)ZJ
印制电路printed circuit _v> }_S
印制线路 printed wiring f@|A[>"V
印制板 printed board Zm_UR*"
印制板电路 printed circuit board T~##,qQ
印制线路板 printed wiring board &keR~~/
印制元件 printed component FwkuC09tI
印制接点 printed contact [R^iF
印制板装配 printed board assembly U"^kH|
板 board 9 %I?).5
刚性印制板 rigid printed board Ni-xx9)=
挠性印制电路 flexible printed circuit oF1,QQ^dg
挠性印制线路 flexible printed wiring 9CWezI+
齐平印制板 flush printed board zv\kPfGDK
金属芯印制板 metal core printed board sg3OL/"
金属基印制板 metal base printed board 6"J?
#
多重布线印制板 mulit-wiring printed board @v)p<r^M">
塑电路板 molded circuit board gf
&Pn
散线印制板 discrete wiring board pUQ/03dp
微线印制板 micro wire board 3 09hn
积层印制板 buile-up printed board f$Fhf?'
表面层合电路板 surface laminar circuit L>aLqQ3
埋入凸块连印制板 B2it printed board j2StXq3
载芯片板 chip on board Kzm+GW3o[
埋电阻板 buried resistance board 3yU.& k
母板 mother board QLvHQtzwX
子板 daughter board bB1UZ O
背板 backplane ;RC{<wBTx
裸板 bare board UU;(rS/
键盘板夹心板 copper-invar-copper board EIf5(/jo
动态挠性板 dynamic flex board xSsa(b
静态挠性板 static flex board %InA+5s`
可断拼板 break-away planel $0>60<J
电缆 cable $j5K8Ad
挠性扁平电缆 flexible flat cable (FFC) BW}U%B^.
薄膜开关 membrane switch yW1)vD7
混合电路 hybrid circuit >>t@}F)
厚膜 thick film i1NY9br
厚膜电路 thick film circuit z<U-#k7nz
薄膜 thin film 7vrl'^ 1
薄膜混合电路 thin film hybrid circuit w[zjerH3
互连 interconnection v1+3}5b'uF
导线 conductor trace line IEsEdw]aZE
齐平导线 flush conductor 59Xi3KY
传输线 transmission line :t8b39
跨交 crossover Dwr)0nk
板边插头 edge-board contact ODNM+#}`
增强板 stiffener =[cS0Sy
基底 substrate n22zq6m
基板面 real estate bMg(B-uF7
导线面 conductor side 4:$4u@
元件面 component side 6}[I2F_^
焊接面 solder side cl[BF'.H
导电图形 conductive pattern hV8[@&Sx3
非导电图形 non-conductive pattern =.f-w0V
基材 base material 5cL83FQh
层压板 laminate |:q=T
~x
覆金属箔基材 metal-clad bade material e6R}0w~G
覆铜箔层压板 copper-clad laminate (CCL) (C-{B[Y
复合层压板 composite laminate )t0$qd ]
薄层压板 thin laminate *4Thd:7 `
基体材料 basis material m ZtCL
预浸材料 prepreg z;{iM/Xe
粘结片 bonding sheet );
!eow
预浸粘结片 preimpregnated bonding sheer s C%&cRQD
环氧玻璃基板 epoxy glass substrate `w#Oih!6A|
预制内层覆箔板 mass lamination panel W>Y@^U&x`
内层芯板 core material TJ_$vI
粘结层 bonding layer 0=@?ob7
粘结膜 film adhesive @=bLDTx;c)
无支撑胶粘剂膜 unsupported adhesive film ]/[FR 5>
覆盖层 cover layer (cover lay) A-Sv;/yD_
增强板材 stiffener material >kj`7GA
铜箔面 copper-clad surface (6?9B lH~
去铜箔面 foil removal surface 3oGt3F{gZ
层压板面 unclad laminate surface H*RC@O_hv
基膜面 base film surface BZ94NOOdw
胶粘剂面 adhesive faec dA@]!
原始光洁面 plate finish @|
M|+k3
粗面 matt finish A -H&
剪切板 cut to size panel mXRB7k
超薄型层压板 ultra thin laminate [-65PC4aN
A阶树脂 A-stage resin W98i[Q9A7
B阶树脂 B-stage resin <r.)hT"0
C阶树脂 C-stage resin tX9{hC^
环氧树脂 epoxy resin {@H6HqD
酚醛树脂 phenolic resin ,X[ktz
聚酯树脂 polyester resin wa<MRt W=
聚酰亚胺树脂 polyimide resin 9_# >aOqL
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin dsb `xw
丙烯酸树脂 acrylic resin 63q^ $I
三聚氰胺甲醛树脂 melamine formaldehyde resin 2 Wt> Mi
多官能环氧树脂 polyfunctional epoxy resin j~2{lCT
溴化环氧树脂 brominated epoxy resin 9oyE$S h]
环氧酚醛 epoxy novolac V, Z|tB^
氟树脂 fluroresin 7]U"Z*
硅树脂 silicone resin Ye"o6_U"
硅烷 silane Ttu2 skcv
聚合物 polymer 1Ce@*XBU
无定形聚合物 amorphous polymer (7mAt3n
k
结晶现象 crystalline polamer &vo--V1|
双晶现象 dimorphism S@jQX
共聚物 copolymer RY]#<9>M
合成树脂 synthetic EY^1Y3D w0
热固性树脂 thermosetting resin [Page] AsQ)q
热塑性树脂 thermoplastic resin \l'm[jy>
感光性树脂 photosensitive resin 3B1XZm
环氧值 epoxy value
RJL2J]*S
双氰胺 dicyandiamide W3]_m8,Z
粘结剂 binder 5m*iE*+
胶粘剂 adesive Pj#<K%Bz
固化剂 curing agent %7"q"A r[
阻燃剂 flame retardant `_BNy=`s*
遮光剂 opaquer K{x\4
增塑剂 plasticizers $yn];0$J
不饱和聚酯 unsatuiated polyester ~qcNEl\-y
聚酯薄膜 polyester q$ZHd
聚酰亚胺薄膜 polyimide film (PI) WzPTFw[
聚四氟乙烯 polytetrafluoetylene (PTFE) !S^AgZ~
增强材料 reinforcing material NO~*T?&
折痕 crease *S]Ci\{_
云织 waviness J}htu
鱼眼 fish eye 4H,`]B8(D
毛圈长 feather length D N'3QQn
厚薄段 mark
txJr;
裂缝 split ]p _L)
捻度 twist of yarn -9%:ilX~
浸润剂含量 size content WB?jRYp
浸润剂残留量 size residue %j:]^vqFA
处理剂含量 finish level 98j>1"8
偶联剂 couplint agent x^HGVWw_
断裂长 breaking length tR}MrM
吸水高度 height of capillary rise VeGL)
湿强度保留率 wet strength retention /,89p&h
白度 whitenness gcE|#1>
导电箔 conductive foil Uo-)pFN^
铜箔 copper foil !g?|9
压延铜箔 rolled copper foil VYu~26Zr
光面 shiny side =q>'19^Jx
粗糙面 matte side '= _/ 1F*q
处理面 treated side y-T| #
防锈处理 stain proofing %dRo^E1p
双面处理铜箔 double treated foil DQNnNsP:M-
模拟 simulation lphFhxJA{
逻辑模拟 logic simulation 3[\iQ*d }B
电路模拟 circit simulation Ky|88~}:C9
时序模拟 timing simulation 0@yXi
模块化 modularization TMAJb+@l:
设计原点 design origin }E+!91't.^
优化(设计) optimization (design) qHsUP;7
供设计优化坐标轴 predominant axis Ager$uC
表格原点 table origin 6o
|kIBte-
元件安置 component positioning Y&[1`:-~-
比例因子 scaling factor +1Vjw'P
扫描填充 scan filling @x9a?L.48
矩形填充 rectangle filling 6BY-^"W5`
填充域 region filling {FO;Yg'
实体设计 physical design XUM!Qv
逻辑设计 logic design iDN;m`a
逻辑电路 logic circuit Jpj}@,
层次设计 hierarchical design @En^wN
自顶向下设计 top-down design 2Gz}T _e
自底向上设计 bottom-up design 3b*cU}go
费用矩阵 cost metrix /d0K7F
元件密度 component density \qR7mI/*
自由度 degrees freedom oE<`VY|
出度 out going degree vh"R'o
入度 incoming degree ]p*l%(dhY
曼哈顿距离 manhatton distance +~'865 {
欧几里德距离 euclidean distance cmBB[pk\
网络 network w ihH?~]
阵列 array ~Cl){8o
段 segment `kOD[*
逻辑 logic zw+B9PYqX
逻辑设计自动化 logic design automation H70LhN
分线 separated time rE iKi
分层 separated layer #?5 (o
定顺序 definite sequence WF2}-NU"
导线(通道) conduction (track) <!L>Exh&r
导线(体)宽度 conductor width wDcj,:h`
导线距离 conductor spacing s<*XNNE7
导线层 conductor layer /rg*p
导线宽度/间距 conductor line/space if}-_E<F
第一导线层 conductor layer No.1 pR
`>b 3
圆形盘 round pad i7]4W
方形盘 square pad &?VQ,+[<
菱形盘 diamond pad Ae
mDJ8Y
长方形焊盘 oblong pad =3|O%\
子弹形盘 bullet pad anIAM
泪滴盘 teardrop pad Ks=>K(V6
雪人盘 snowman pad .9R
[*<
形盘 V-shaped pad V S7=Bd[4
环形盘 annular pad i\1TOP|h
非圆形盘 non-circular pad ~}F{vm
隔离盘 isolation pad dOqOw M.y
非功能连接盘 monfunctional pad e:DkGy`-s
偏置连接盘 offset land 9dFy"yxYa
腹(背)裸盘 back-bard land ;} und*q
盘址 anchoring spaur bx<RV7>0
连接盘图形 land pattern pcau}5 .
连接盘网格阵列 land grid array ' pm2n0
孔环 annular ring /3A^I{e74
元件孔 component hole Em?d*z
安装孔 mounting hole _8"O$w
支撑孔 supported hole ${+ @gJ+S
非支撑孔 unsupported hole &$"i,~q^b
导通孔 via W.z;B<
镀通孔 plated through hole (PTH) i%ZW3MrY~
余隙孔 access hole OC1I&",Ai|
盲孔 blind via (hole) -M%_\;"de
埋孔 buried via hole HOw-]JSP2
埋,盲孔 buried blind via r;>*_Oc7g
任意层内部导通孔 any layer inner via hole Z^V6K3GSz-
全部钻孔 all drilled hole ?z}=B
定位孔 toaling hole 4$qWiG~
无连接盘孔 landless hole jZh';M8"
中间孔 interstitial hole v[#9+6P=
无连接盘导通孔 landless via hole ,
FhekaA
引导孔 pilot hole !lEY=1nHOJ
端接全隙孔 terminal clearomee hole ()K " c#
准尺寸孔 dimensioned hole [Page] 7nHF@Y|*"
在连接盘中导通孔 via-in-pad [!} :KD2yX
孔位 hole location M>&%(4K
孔密度 hole density cs T2B[f9D
孔图 hole pattern 8#(Q_
钻孔图 drill drawing d@ Y}SWTB
装配图assembly drawing H,+I2tEs
参考基准 datum referan XEn*?.e
1) 元件设备 I?"q/Ub~h
z74in8]
三绕组变压器:three-column transformer ThrClnTrans !,[C]Q1
双绕组变压器:double-column transformer DblClmnTrans >y.%xK
电容器:Capacitor _Dym{!t
并联电容器:shunt capacitor Y]{
>^`G
电抗器:Reactor `kbSu}
母线:Busbar fQL"O}Z
输电线:TransmissionLine Mr?Xp(.}G
发电厂:power plant @)
s,{F
断路器:Breaker ]Tkc-ez
刀闸(隔离开关):Isolator *NkA8PC
分接头:tap .mDM[e@'
电动机:motor 8'<-:KG
(2) 状态参数 }:u~K;O87
p!sWYui
有功:active power pX&pLaF
无功:reactive power !PrwH;
电流:current o4*+T8[|5
容量:capacity 0G7K8`a
电压:voltage XK|R8rhg8`
档位:tap position
1WY/6[
有功损耗:reactive loss tjGd )
无功损耗:active loss dDm):Z*`b
功率因数:power-factor yHHt(GM|o
功率:power ]l'Y'z,}
功角:power-angle vhsk0$f
电压等级:voltage grade kqce[hgs<
空载损耗:no-load loss %Eb%V ($
铁损:iron loss 1AG=%F|.
铜损:copper loss e=4+$d
空载电流:no-load current 7<%<Ff@^)O
阻抗:impedance .so[I
正序阻抗:positive sequence impedance \[gReaI
负序阻抗:negative sequence impedance QmLF[\Oo_
零序阻抗:zero sequence impedance F1jglH/MF)
电阻:resistor Ps%qfL\
电抗:reactance 0Z0:,!
电导:conductance S,<EEtXQ
电纳:susceptance $aN-Y?U%
无功负载:reactive load 或者QLoad *uo'VJI7_,
有功负载: active load PLoad = M]iIWQ@`
遥测:YC(telemetering) g.'yZvaP
遥信:YX n|b5? 3
励磁电流(转子电流):magnetizing current H^.IY_I`U*
定子:stator -1ce<nN
功角:power-angle O!Oumw,$
上限:upper limit wk6NG/<
下限:lower limit E<C&Cjz:H
并列的:apposable E2cB U{x
高压: high voltage h$.:Uj8/
低压:low voltage >.'<J]
中压:middle voltage Qu}W/j|3
电力系统 power system =JKv:</.G
发电机 generator !-N6l6N
励磁 excitation ^|/](
励磁器 excitor Ma8_:7`>O
电压 voltage lu#LCG-.
电流 current ZTU&,1Y ;
母线 bus "y_#7K
变压器 transformer LJOr!rWi
升压变压器 step-up transformer 7zHh@ B:]
高压侧 high side /[ 6j)HIS
输电系统 power transmission system I! > \#K
输电线 transmission line mcn 2Wt
固定串联电容补偿fixed series capacitor compensation txcf=)@>V
稳定 stability HAv{R!*
电压稳定 voltage stability $2M#qkik-
功角稳定 angle stability ^2$ lJ
暂态稳定 transient stability 3/b;7\M
电厂 power plant =xNv\e
能量输送 power transfer ^S)cjH`P
交流 AC : C b&v07
装机容量 installed capacity I
j$lDJS
电网 power system
1~l
I8
落点 drop point 5*E#*H
开关站 switch station j:,NE(DF
双回同杆并架 double-circuit lines on the same tower 549jWG
变电站 transformer substation +=]!P#
补偿度 degree of compensation M)+$wp
高抗 high voltage shunt reactor wWSdTLX
无功补偿 reactive power compensation _>=L>*
故障 fault !<UJ6t}
调节 regulation hFk3[zTy
裕度 magin ~}!3G
三相故障 three phase fault +8v9flh
故障切除时间 fault clearing time 2-"0 ^n{
极限切除时间 critical clearing time MB%Q WU
切机 generator triping [tg^GOf '
高顶值 high limited value rz"txN
强行励磁 reinforced excitation xGU(n_Y
线路补偿器 LDC(line drop compensation) {
.*y
机端 generator terminal kKPi:G52F
静态 static (state) hzI|A~MFB
动态 dynamic (state) ALEnI@0
单机无穷大系统 one machine - infinity bus system Ov#=]t5
机端电压控制 AVR S.Z9$k%
电抗 reactance =
pI?A^
电阻 resistance 2P]L9'N{Y
功角 power angle @"Z7nJX
有功(功率) active power 7T"XPV|W6
无功(功率) reactive power h Xb%;GL
功率因数 power factor n!')wIk
无功电流 reactive current }U
SC1J
下降特性 droop characteristics ^/5XZ} *
斜率 slope dgDy5{_
额定 rating [HN|\afz
变比 ratio ? tfT8$
参考值 reference value ifo7%XPcg
电压互感器 PT 50
A^bbid
分接头 tap l ^d[EL+
下降率 droop rate ]r3Kg12Mi
仿真分析 simulation analysis DAwqo.m
传递函数 transfer function gr-fXZO
框图 block diagram <$N"q
受端 receive-side 2kv7UU#q2
裕度 margin ,+g&o^T
同步 synchronization \}~s2Y5j
失去同步 loss of synchronization %L [&,a
阻尼 damping VyRsPg[(
摇摆 swing f30Pi1/h=c
保护断路器 circuit breaker S!PzLTc
电阻:resistance wnTV|^Q
电抗:reactance %+ FG ,d
阻抗:impedance 8vuCc=
电导:conductance H'MJ{r0,
电纳:susceptance