1 backplane 背板 D_SXxP[! g
2 Band gap voltage reference 带隙电压参考 8k( zU>^
3 benchtop supply 工作台电源 K20,aWBq;3
4 Block Diagram 方块图 5 Bode Plot 波特图 pwF+ZNo
6 Bootstrap 自举 uBp,_V?
7 Bottom FET Bottom FET hD>]\u
8 bucket capcitor 桶形电容 %IA1Y>`
9 chassis 机架 8=K%7:b
10 Combi-sense Combi-sense a/\SPXQ/9
11 constant current source 恒流源 n%faD
12 Core Sataration 铁芯饱和 -R]Iu\
13 crossover frequency 交叉频率 V),wDyi
14 current ripple 纹波电流 GyC/39<P
15 Cycle by Cycle 逐周期 TS_5R>R3
16 cycle skipping 周期跳步 !1b}M/Wx
17 Dead Time 死区时间 I`~Giz7@
18 DIE Temperature 核心温度 ]KQv]'
19 Disable 非使能,无效,禁用,关断 opXxtYC@
20 dominant pole 主极点 lGlh/B%
21 Enable 使能,有效,启用 k~0#Iy_{M
22 ESD Rating ESD额定值 o5@d1A
23 Evaluation Board 评估板 OXxgnn>W'
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. bI-uF8"
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 Ao )\/AR'
25 Failling edge 下降沿 o&t*[#
26 figure of merit 品质因数 &%UZ"CcA
27 float charge voltage 浮充电压 q"48U.}T
28 flyback power stage 反驰式功率级 A=Y A #0
29 forward voltage drop 前向压降 |Q(3rcOrV"
30 free-running 自由运行 4-CGe
31 Freewheel diode 续流二极管 }>5R9
32 Full load 满负载 33 gate drive 栅极驱动 bJ"}-s+Dx
34 gate drive stage 栅极驱动级 tP:ER
35 gerber plot Gerber 图 -k?K|w*X
36 ground plane 接地层 SHc?C&^S
37 Henry 电感单位:亨利 [59g] ')
38 Human Body Model 人体模式 \wKnX]xGf
39 Hysteresis 滞回 B,q)<z6<
40 inrush current 涌入电流 zv-9z
41 Inverting 反相 d[\$a4G+
42 jittery 抖动 !b"2]Qv
43 Junction 结点 pJ3-f k"i
44 Kelvin connection 开尔文连接 4wkmgS
45 Lead Frame 引脚框架 * lJkk
46 Lead Free 无铅 /HE{8b7n3F
47 level-shift 电平移动 u}">b+{!
48 Line regulation 电源调整率 O[|_~v:^
49 load regulation 负载调整率 ;=UkTn}N?l
50 Lot Number 批号 e#AmtheZR
51 Low Dropout 低压差 +h)1NX;o1
52 Miller 密勒 53 node 节点 -kP$S qR~
54 Non-Inverting 非反相 J'E?Z0
55 novel 新颖的 H
-K%F_#
56 off state 关断状态 Kr'Yz!
57 Operating supply voltage 电源工作电压 Hmx
Y{KB
58 out drive stage 输出驱动级 K0{
,*>C
59 Out of Phase 异相 >g;995tG
60 Part Number 产品型号 #Q1
|]
61 pass transistor pass transistor <^w4+5sT/
62 P-channel MOSFET P沟道MOSFET aH&Efz^
63 Phase margin 相位裕度 ;0 4< 9i
64 Phase Node 开关节点 Q-?6o
65 portable electronics 便携式电子设备 uC! dy
66 power down 掉电 &X6hOc:``\
67 Power Good 电源正常 VBtdx`9
68 Power Groud 功率地 C)mR~Ey
69 Power Save Mode 节电模式 `< 82"cAT{
70 Power up 上电 =`k',V_
71 pull down 下拉 #0f6X,3
72 pull up 上拉 >x1yFwX}-f
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) p=[SDk`
74 push pull converter 推挽转换器 p4@0[z'
75 ramp down 斜降 489xoP
76 ramp up 斜升 48,uO!
77 redundant diode 冗余二极管 hvc3n>
Y[}
78 resistive divider 电阻分压器 I_Omv{&u
79 ringing 振 铃 wzF%R{;
80 ripple current 纹波电流 6@x^,SA
81 rising edge 上升沿 R:`)*=rL%
82 sense resistor 检测电阻 } 4ZWAzH
83 Sequenced Power Supplys 序列电源 z~th{4#E;
84 shoot-through 直通,同时导通 `|<? sjY
85 stray inductances. 杂散电感 1pz-jo,2'
86 sub-circuit 子电路 &
h\!#X0
87 substrate 基板 **.g^Pyc
88 Telecom 电信 ]wUH*\(y
89 Thermal Information 热性能信息 iB}*<~`.Eg
90 thermal slug 散热片 } "&Ye
91 Threshold 阈值 T930tX6"h
92 timing resistor 振荡电阻 Dqc2;>
93 Top FET Top FET UZ1Au;(|
94 Trace 线路,走线,引线 6MpV,2:>
95 Transfer function 传递函数 *mkVk7]c
96 Trip Point 跳变点 -6xh
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) c=D~hz N
98 Under Voltage Lock Out (UVLO) 欠压锁定 IN,=v+A
99 Voltage Reference 电压参考 r%9=75HA
100 voltage-second product 伏秒积 Fd#Zu.Np
101 zero-pole frequency compensation 零极点频率补偿 pV`/6
}
102 beat frequency 拍频 ovZ!}
103 one shots 单击电路 ,hWuAu6.L
104 scaling 缩放 r)Ja\;
105 ESR 等效串联电阻 [Page] 7#7AK}
106 Ground 地电位 qFI19`?8E
107 trimmed bandgap 平衡带隙 M[C)b\
108 dropout voltage 压差 %Iiu#- 'B
109 large bulk capacitance 大容量电容 t)mc~M9w
110 circuit breaker 断路器 iZ4"@G:,
111 charge pump 电荷泵 ^mouWw)a_
112 overshoot 过冲 p||mR
BDCyeC,Q3
印制电路printed circuit "y60YYn-#J
印制线路 printed wiring - LB} =
印制板 printed board QZ+G2$
印制板电路 printed circuit board JL[!8NyU
印制线路板 printed wiring board Hp*N%
印制元件 printed component nG-DtG^z
印制接点 printed contact k\r^GB
印制板装配 printed board assembly C#B|^A_
板 board F##xVmR~
刚性印制板 rigid printed board V{fG~19
挠性印制电路 flexible printed circuit Hzz v 6k
挠性印制线路 flexible printed wiring mNsd&Rk'
齐平印制板 flush printed board EeGTBVms
金属芯印制板 metal core printed board {B4.G8%Z
金属基印制板 metal base printed board viJP6fh
多重布线印制板 mulit-wiring printed board ^b4i9n,t1
塑电路板 molded circuit board Tv9\`F[
散线印制板 discrete wiring board >uDC!0)R
微线印制板 micro wire board {w@9\LsU
积层印制板 buile-up printed board !3{;oU%*
表面层合电路板 surface laminar circuit <`?%Cz AO
埋入凸块连印制板 B2it printed board MY^o0N
载芯片板 chip on board [
P,gEYk
埋电阻板 buried resistance board VB`% u=
母板 mother board csA-<}S5]b
子板 daughter board /&9R*xNST#
背板 backplane 3"sXN)j
裸板 bare board /.~zk(-&h
键盘板夹心板 copper-invar-copper board nb ?(zDJ8
动态挠性板 dynamic flex board v57<b&p26
静态挠性板 static flex board Xc4zUEO9
可断拼板 break-away planel < FY%QB)h
电缆 cable K &%8w
挠性扁平电缆 flexible flat cable (FFC) zN=s]b=/
薄膜开关 membrane switch ]^Xj!01~
混合电路 hybrid circuit >s )L(DHa"
厚膜 thick film !N!AO(Z
厚膜电路 thick film circuit li{!Jp5]1b
薄膜 thin film 'rq@9$h1W
薄膜混合电路 thin film hybrid circuit P#V}l'j(<a
互连 interconnection SE(c_ sX
导线 conductor trace line SM1L^M3)
齐平导线 flush conductor 4aW[`
传输线 transmission line :,
3S5!(y
跨交 crossover Z:^ S-h
板边插头 edge-board contact ~SmFDg$/m
增强板 stiffener Ktu~%)k%
基底 substrate ^+0>,-)F
基板面 real estate dkqyn"^
导线面 conductor side 4P"XT
元件面 component side V(g5Gn?
焊接面 solder side c|Z6p{)V
导电图形 conductive pattern 7#SfuZ0@
非导电图形 non-conductive pattern
d ^zuo
基材 base material abCxB^5VL
层压板 laminate H7k@Br
覆金属箔基材 metal-clad bade material sk*vmxClY
覆铜箔层压板 copper-clad laminate (CCL) 3sW!ya-VZ
复合层压板 composite laminate J#q^CWN3R
薄层压板 thin laminate |>1#)cONW
基体材料 basis material !}5rd\
预浸材料 prepreg IM,4Si2
粘结片 bonding sheet <;uM/vSi
预浸粘结片 preimpregnated bonding sheer oX'@,(6)
环氧玻璃基板 epoxy glass substrate fsWIz1K
预制内层覆箔板 mass lamination panel ;}M&fXFp"|
内层芯板 core material LOr( HgyC
粘结层 bonding layer B79~-,Yh
粘结膜 film adhesive <_]W1V:0
无支撑胶粘剂膜 unsupported adhesive film WQ9Q:F2
覆盖层 cover layer (cover lay) _^`V0>Mh:
增强板材 stiffener material zbGZ\pz
铜箔面 copper-clad surface )eqF21\
去铜箔面 foil removal surface w9mAeGyE
层压板面 unclad laminate surface P,(_y8
基膜面 base film surface X?;iSekI4
胶粘剂面 adhesive faec PHUeN]s#
原始光洁面 plate finish {B e9$$W,
粗面 matt finish M%RH4%NZ0
剪切板 cut to size panel Y\+LBbB8
超薄型层压板 ultra thin laminate 2+b}FVOe\
A阶树脂 A-stage resin TtH!5{$s
B阶树脂 B-stage resin l2YA/9.
C阶树脂 C-stage resin 2m} bddS
环氧树脂 epoxy resin O%6D2d
酚醛树脂 phenolic resin ?RW1%+[
聚酯树脂 polyester resin h%NM%;"H/
聚酰亚胺树脂 polyimide resin ,yvS c
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin ReL+V
丙烯酸树脂 acrylic resin G
\Nnw==v
三聚氰胺甲醛树脂 melamine formaldehyde resin )4.-6F7U?
多官能环氧树脂 polyfunctional epoxy resin .:GOKyr(~
溴化环氧树脂 brominated epoxy resin Hs_7oy|P
环氧酚醛 epoxy novolac +@H{H2J 4
氟树脂 fluroresin &FJr?hY%
硅树脂 silicone resin -yTIv*y
硅烷 silane UX<)hvKj
聚合物 polymer mdo$d-d&
无定形聚合物 amorphous polymer ^,)nuUy
结晶现象 crystalline polamer D;jbZ9
双晶现象 dimorphism z#rp8-HUDS
共聚物 copolymer Plhakngj
合成树脂 synthetic ,V^$Meh
热固性树脂 thermosetting resin [Page] o^MoU2c
热塑性树脂 thermoplastic resin @8+v6z
感光性树脂 photosensitive resin {"2CI^!/U.
环氧值 epoxy value E7_OI7C
双氰胺 dicyandiamide p=zTY7L
粘结剂 binder 4S[)5su
胶粘剂 adesive pYu6[
固化剂 curing agent @*- 6DG-f
阻燃剂 flame retardant E H%hL5(
遮光剂 opaquer !_;J@B
增塑剂 plasticizers >,I'S2_Zl
不饱和聚酯 unsatuiated polyester lC,~_Yb
聚酯薄膜 polyester 45$aq~%as
聚酰亚胺薄膜 polyimide film (PI) %+<1X?;,Fq
聚四氟乙烯 polytetrafluoetylene (PTFE) H*+7{;$
增强材料 reinforcing material 8xG"hJR
折痕 crease x5Fo?E
云织 waviness kHhku!CH
鱼眼 fish eye rLA-q||
毛圈长 feather length *[BtW56-
厚薄段 mark h@\HPYi#.
裂缝 split Y(2Z<d
捻度 twist of yarn t5u#[*
浸润剂含量 size content ='_3qn.
浸润剂残留量 size residue $bfmsCcHL
处理剂含量 finish level 5J1a8RBR
偶联剂 couplint agent ;Ru[^p.{
断裂长 breaking length Zk>m!F>,p
吸水高度 height of capillary rise @$
lX%p>
湿强度保留率 wet strength retention O=lRI)6w@e
白度 whitenness XW@C_@*J
导电箔 conductive foil /=A@O !l
铜箔 copper foil C>mFylN
压延铜箔 rolled copper foil p~""1m01,D
光面 shiny side H{Lt,#
粗糙面 matte side 7Kb&BF|Q
处理面 treated side Fp[49
防锈处理 stain proofing ^N
4Y*NtV7
双面处理铜箔 double treated foil QnS#"hc\a
模拟 simulation _@gg,2
u-
逻辑模拟 logic simulation 6E:H
电路模拟 circit simulation d6-q"
时序模拟 timing simulation L~by `q N_
模块化 modularization sG[qlzR=8
设计原点 design origin lN{>.q@V`r
优化(设计) optimization (design) %g3QE:(2@q
供设计优化坐标轴 predominant axis w'VuC82SZ
表格原点 table origin 4xg1[Z%:
元件安置 component positioning NWQ7%~#k*
比例因子 scaling factor 4^4T#f2=e
扫描填充 scan filling cz>)6#&O
矩形填充 rectangle filling ko'V8r`V
填充域 region filling _bg Zl
实体设计 physical design !r/~D |
逻辑设计 logic design Fi\)ka\u
逻辑电路 logic circuit `w8cV?
层次设计 hierarchical design \Cin%S.C
自顶向下设计 top-down design ;X0uA?
自底向上设计 bottom-up design N2k{@DY
费用矩阵 cost metrix LTH,a?lD
元件密度 component density XFl&(I4tB
自由度 degrees freedom hE'7M;
出度 out going degree oWi#?'
入度 incoming degree SkVah:cF-
曼哈顿距离 manhatton distance Z?3B1o9
欧几里德距离 euclidean distance \yxGE+~P
网络 network 4e;
le&
阵列 array Zy:q)'D=
段 segment nGc'xQy0
逻辑 logic ^T1caVb|>
逻辑设计自动化 logic design automation zcH"Kh&
分线 separated time kApD D[ N
分层 separated layer TlX:05/V8
定顺序 definite sequence {)!ua7GF0H
导线(通道) conduction (track) d7zZ~n
导线(体)宽度 conductor width tx`^'%GMA
导线距离 conductor spacing \_(0V"
导线层 conductor layer Zp6VH
导线宽度/间距 conductor line/space o_kZ
第一导线层 conductor layer No.1 v4uQ0~k~X
圆形盘 round pad P*PJ
方形盘 square pad H$Pf$D$
菱形盘 diamond pad p:{L fQ
长方形焊盘 oblong pad XtBEVqrhi
子弹形盘 bullet pad Az#kE.8b*A
泪滴盘 teardrop pad
/7,@q?v
雪人盘 snowman pad h<PS<
形盘 V-shaped pad V Nt?=0X|M
环形盘 annular pad :6EX-Xyj
非圆形盘 non-circular pad ]6|?H6'/`v
隔离盘 isolation pad (dO0`wfM
非功能连接盘 monfunctional pad REi"Aj=
偏置连接盘 offset land iS"6)#a72
腹(背)裸盘 back-bard land DZb0'+jQ
盘址 anchoring spaur M\IdQY-c
连接盘图形 land pattern Xqew~R^MP
连接盘网格阵列 land grid array mRGr+m
孔环 annular ring SNSoV3|k-
元件孔 component hole *p0n^XZ% ?
安装孔 mounting hole ]rg-=Y k
支撑孔 supported hole X(DP=C}v9
非支撑孔 unsupported hole QqBQ[<_
导通孔 via kXUJlLod
镀通孔 plated through hole (PTH) wGIRRM !b
余隙孔 access hole )
R\";{`M
盲孔 blind via (hole) Ep')@7^n
埋孔 buried via hole J\'f5)k
埋,盲孔 buried blind via h2:TbQ
任意层内部导通孔 any layer inner via hole #,})N*7
全部钻孔 all drilled hole rfSEL
57'
定位孔 toaling hole Tgi7RAY
无连接盘孔 landless hole - JFW ,8=8
中间孔 interstitial hole ~=oCou`XF
无连接盘导通孔 landless via hole K!E\v4
引导孔 pilot hole 16.?45
端接全隙孔 terminal clearomee hole +G7[(Wz(z
准尺寸孔 dimensioned hole [Page] ["ocZ? x
在连接盘中导通孔 via-in-pad pXh`o20I
孔位 hole location R /_vJHI
孔密度 hole density Zny9TP
孔图 hole pattern MD,BGO?C
钻孔图 drill drawing G#uB%:)&0u
装配图assembly drawing YX3NZW2i
参考基准 datum referan Fy.!amXu
1) 元件设备 7nW <kA
s(L!]d.S$y
三绕组变压器:three-column transformer ThrClnTrans "(';UFa
双绕组变压器:double-column transformer DblClmnTrans g0;6}n
电容器:Capacitor jr-9KxE
并联电容器:shunt capacitor &Fk|"f+
电抗器:Reactor l6IT o@&J
母线:Busbar 0Q
cJ Ek
输电线:TransmissionLine WBzPSnS2
发电厂:power plant F)/4#[
断路器:Breaker -ni@+Dy
刀闸(隔离开关):Isolator 9]/:B8k
分接头:tap j``Ku@/x0
电动机:motor QNXS.!\P
(2) 状态参数 /&c>*4)
X>]<rEh
有功:active power %y)hYLOJ
无功:reactive power 1h)K3cC
电流:current hOdU%
容量:capacity $"0`2C
电压:voltage wg:\$_Og
档位:tap position uOd1:\%*
有功损耗:reactive loss Zl]@;*u
无功损耗:active loss x{rjngp2
功率因数:power-factor 8#1o
功率:power -|=)
功角:power-angle ##1/{9ywy
电压等级:voltage grade n+vv
%
空载损耗:no-load loss Mdu\ci)lr
铁损:iron loss Sj8fo^K50
铜损:copper loss C 8d9(u
空载电流:no-load current jpMMnEVj6P
阻抗:impedance d9T:0A`M
正序阻抗:positive sequence impedance E?Qg'|+_
负序阻抗:negative sequence impedance Uqly|FS &n
零序阻抗:zero sequence impedance !y2yS/
电阻:resistor V*@&<x"E
电抗:reactance : 'pK
电导:conductance 8'v:26
电纳:susceptance B.gEV*@
无功负载:reactive load 或者QLoad xa{.hp?
有功负载: active load PLoad swLNNA.
遥测:YC(telemetering) %8P6l D
遥信:YX mQK3YoC)
励磁电流(转子电流):magnetizing current GQE7P()
定子:stator ]RF(0;
功角:power-angle &oFgZ .
上限:upper limit 5T'viG}%
下限:lower limit 2B_+5
并列的:apposable -Gm}i8;
高压: high voltage 'loko#6
低压:low voltage WO^]bR
中压:middle voltage J*^ i=y
电力系统 power system P(LiH
发电机 generator I3}I7oc_
励磁 excitation dzV2;
励磁器 excitor $:vS_#
电压 voltage C2DAsSw
电流 current KHeeB `V>J
母线 bus 1ZvXRJ)%
变压器 transformer B?
XK;*])
升压变压器 step-up transformer @?t+O'&
高压侧 high side tS,AS,vy]
输电系统 power transmission system =%b1EYk
输电线 transmission line N4WX}
固定串联电容补偿fixed series capacitor compensation (Q.I DDlr
稳定 stability ]l
电压稳定 voltage stability 5<7sVd.
功角稳定 angle stability %Bg>=C)^(1
暂态稳定 transient stability S*WLb/R2
电厂 power plant h+9~^<oFl
能量输送 power transfer RgzzbW
交流 AC &uf|Le4
装机容量 installed capacity h6;zAM}
电网 power system G
P '-
落点 drop point D\DwBZ>
开关站 switch station |HwEwL+
双回同杆并架 double-circuit lines on the same tower [X@JH6U
r
变电站 transformer substation veS)
j?4
补偿度 degree of compensation !0v3Lu~j
高抗 high voltage shunt reactor 6O*lZNN
无功补偿 reactive power compensation NK%Ok
故障 fault ]qEg5:yY
调节 regulation Q>L.
裕度 magin bj?=\u
三相故障 three phase fault J!@R0U.
故障切除时间 fault clearing time w)/~Gn676
极限切除时间 critical clearing time 6Z@T
/"mU(
切机 generator triping Ejyo
oO45
高顶值 high limited value 1_M}Dc+J
强行励磁 reinforced excitation =(v'8?--
线路补偿器 LDC(line drop compensation) =L{-Hu/j
机端 generator terminal 1buO&q!vn
静态 static (state) m'uFj !
动态 dynamic (state) 9)4_@rf%
单机无穷大系统 one machine - infinity bus system O5*3
qJp
机端电压控制 AVR q/qig5Ou
电抗 reactance gy"<[N
.?c
电阻 resistance hsYv=Tw3C
功角 power angle U/h@Q\~U
有功(功率) active power Z,8t!Y
无功(功率) reactive power #jPn7
功率因数 power factor BUyKiMW 49
无功电流 reactive current R
pT7Nr
下降特性 droop characteristics lZ)
qV!<
斜率 slope &{ZUY3
额定 rating w`gT]Rn
变比 ratio Bz>5OuOVS\
参考值 reference value dKa2_|k'
电压互感器 PT 7'|aEH
分接头 tap F]s:`4
下降率 droop rate x]t$Zb/Uxa
仿真分析 simulation analysis B_XX)y %V
传递函数 transfer function uhB
V)Qg
框图 block diagram kX+98?h-C
受端 receive-side as[! 9tB]
裕度 margin ieXi6^M$
同步 synchronization {*K$gH$
失去同步 loss of synchronization S7~HBgS<
阻尼 damping Af`Tr6)
摇摆 swing .-Dc%ap]
保护断路器 circuit breaker 6.6?Rp".
电阻:resistance 4^:$|\?]
电抗:reactance Q&/WVRD
阻抗:impedance `Io#440;
电导:conductance /NxuNi;5
电纳:susceptance