1 backplane 背板 $ a@T:zfe
2 Band gap voltage reference 带隙电压参考 '3i,^g0?t0
3 benchtop supply 工作台电源 QLPb5{>KDS
4 Block Diagram 方块图 5 Bode Plot 波特图 ^
gMkQYo(#
6 Bootstrap 自举 ~M c'~:{O
7 Bottom FET Bottom FET {+3
`{34e
8 bucket capcitor 桶形电容 ~cf*Oq
9 chassis 机架 ]\JLlQ}#H
10 Combi-sense Combi-sense -$ VP#%
11 constant current source 恒流源 ia9=&H y])
12 Core Sataration 铁芯饱和 _\2Ae\&c
13 crossover frequency 交叉频率 mhNX05D
14 current ripple 纹波电流 ro n-v"!
15 Cycle by Cycle 逐周期 `MLOf
16 cycle skipping 周期跳步 o){\ qhLp
17 Dead Time 死区时间 Nc da~h
Q
18 DIE Temperature 核心温度 *HONA> u
19 Disable 非使能，无效，禁用，关断 m{w'&\T
20 dominant pole 主极点 mf W}^mu
21 Enable 使能，有效，启用 hE h` cBO
22 ESD Rating ESD额定值 3LkcK1x.
23 Evaluation Board 评估板 mEZHrr J
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. w-j^jU>< 3
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 im&Nkk4 n@
25 Failling edge 下降沿 S{Q2 KD
26 figure of merit 品质因数 J+(B ]8aj
27 float charge voltage 浮充电压 mx!EuF$I
28 flyback power stage 反驰式功率级 n1 Wo<$#
29 forward voltage drop 前向压降 Bjp4:;Bb
30 free-running 自由运行 ~Fe$ /*v
31 Freewheel diode 续流二极管 h(/& ;\Cr
32 Full load 满负载 33 gate drive 栅极驱动 5$?)f&M
34 gate drive stage 栅极驱动级 KSY HG
35 gerber plot Gerber 图 |muZv!,E
36 ground plane 接地层 *-';ycOvr
37 Henry 电感单位：亨利 3sK^
(
38 Human Body Model 人体模式 1\X_B `xwD
39 Hysteresis 滞回 %HD0N&
40 inrush current 涌入电流 Y-s6Z \
41 Inverting 反相 'U l^V
42 jittery 抖动 @$| 8zPs
43 Junction 结点 UrmnHc>}c
44 Kelvin connection 开尔文连接 3+/^
45 Lead Frame 引脚框架 Ve ipM
46 Lead Free 无铅 8~}~ d}wW
47 level-shift 电平移动 eyzXHS*s;L
48 Line regulation 电源调整率 VZ]}9k
49 load regulation 负载调整率 Y '+mC
50 Lot Number 批号 =&" a:l
51 Low Dropout 低压差 |%g)H,6c
52 Miller 密勒 53 node 节点 mo D)^':.
54 Non-Inverting 非反相 $Xr4=9(|7
55 novel 新颖的 ILIv43QKM(
56 off state 关断状态 M#.dF{ %%
57 Operating supply voltage 电源工作电压 [85b+SKW
58 out drive stage 输出驱动级 }a"koL
59 Out of Phase 异相 _)Ad%LPsd7
60 Part Number 产品型号 r`Bm" xI
61 pass transistor pass transistor Kw =RqF
62 P-channel MOSFET P沟道MOSFET O &
1z-
63 Phase margin 相位裕度 ~hb; kc3
64 Phase Node 开关节点 . ^wBv
'Y
65 portable electronics 便携式电子设备 r@ c!M |m@
66 power down 掉电 c {3P|O&.
67 Power Good 电源正常 8K9RA<
68 Power Groud 功率地 #('GGzL6c
69 Power Save Mode 节电模式 J6mUU3F9f
70 Power up 上电 L>n^Q:M
71 pull down 下拉 zmhAeblA
72 pull up 上拉 nH}V:C
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） MP
p
74 push pull converter 推挽转换器 `4,]Mr1b
75 ramp down 斜降 6~O;t'd
76 ramp up 斜升 ]zz%gZz
77 redundant diode 冗余二极管 .\+c {
78 resistive divider 电阻分压器 -U{!'e8YiN
79 ringing 振 铃 TMD*-wYr
80 ripple current 纹波电流 rr SFmhQUk
81 rising edge 上升沿 GA"vJFQ
82 sense resistor 检测电阻 zbJ}@V
83 Sequenced Power Supplys 序列电源 l%
p4.CX
84 shoot-through 直通，同时导通 w>4( hGO
85 stray inductances. 杂散电感 H<"EE15
86 sub-circuit 子电路 ybv]wBpM:
87 substrate 基板 ;;N#'. xD
88 Telecom 电信 I9h{fB
89 Thermal Information 热性能信息 3uL$+F
90 thermal slug 散热片 y]g5S-G
91 Threshold 阈值 U45-R -
92 timing resistor 振荡电阻 .M s$)1
93 Top FET Top FET TVVu_ib
94 Trace 线路，走线，引线 ,x utI
95 Transfer function 传递函数 i r5eR}H
96 Trip Point 跳变点 =N2@H5+7
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） s$~H{za
98 Under Voltage Lock Out (UVLO) 欠压锁定 {KSy I#
99 Voltage Reference 电压参考 ]} pAZd
100 voltage-second product 伏秒积 ( !a\23
101 zero-pole frequency compensation 零极点频率补偿 :4)lmIu
102 beat frequency 拍频 A:\_ \B%<
103 one shots 单击电路 ,=2)1I]
104 scaling 缩放 @h\i <sh!^
105 ESR 等效串联电阻 [Page] ?lm<)y?I7+
106 Ground 地电位 x[R?hS,0 t
107 trimmed bandgap 平衡带隙 p
~)\!
108 dropout voltage 压差 ` (]mUW
109 large bulk capacitance 大容量电容 ]UrlFiR
110 circuit breaker 断路器 knzQ)iv&&
111 charge pump 电荷泵 u4xJ-Vu
112 overshoot 过冲 t&-c?&FO\;
xR;z!Tg)
印制电路printed circuit ~Fo`Pr_
印制线路 printed wiring '.e 5Ku
印制板 printed board ^ y~oXS(
印制板电路 printed circuit board &-x/c\jz
印制线路板 printed wiring board 7'5/T]Z
印制元件 printed component f5R%F ~
印制接点 printed contact [-\D C*6
印制板装配 printed board assembly )+.AgqxI
板 board :(I=z6
刚性印制板 rigid printed board |[!0ry*N%
挠性印制电路 flexible printed circuit {X W>3 "
挠性印制线路 flexible printed wiring .yb8<q s
齐平印制板 flush printed board -./ Y
金属芯印制板 metal core printed board /sVmQqVY
金属基印制板 metal base printed board 0q BXL;sE
多重布线印制板 mulit-wiring printed board fVZ_*'v
塑电路板 molded circuit board pe+m%;nzR
散线印制板 discrete wiring board XlGB`P>?KD
微线印制板 micro wire board Lya?b
积层印制板 buile-up printed board 5;9.&f
表面层合电路板 surface laminar circuit 6,]2;'
埋入凸块连印制板 B2it printed board L~_zR >
载芯片板 chip on board R xWD>:
埋电阻板 buried resistance board x_EU.924uY
母板 mother board 5a* Awv}
子板 daughter board tdC
kvVE
背板 backplane &HJ~\6r\
裸板 bare board ,7e 2M@=
键盘板夹心板 copper-invar-copper board U zk_ae
动态挠性板 dynamic flex board _xdttO^N
静态挠性板 static flex board uMBb=
可断拼板 break-away planel CzT_ $v_
电缆 cable <pUc(
tPoz
挠性扁平电缆 flexible flat cable (FFC) CjA}-ee
薄膜开关 membrane switch ;"%luQA<w
混合电路 hybrid circuit C%'eF`
厚膜 thick film 4 W+ nS v
厚膜电路 thick film circuit y)Lyo'`
薄膜 thin film /h@rL J)o>
薄膜混合电路 thin film hybrid circuit Rh7=,= u
互连 interconnection ;<`
导线 conductor trace line ^[zF IO
齐平导线 flush conductor ~0 n9In%
传输线 transmission line {XYf"ONi
跨交 crossover < YuI}d~'
板边插头 edge-board contact K9Pw10g'
增强板 stiffener g/,O51f'
基底 substrate .]Z,O>N
基板面 real estate ~#[ ZuMO?
导线面 conductor side "?sLi
元件面 component side R7 By=Y!t
焊接面 solder side Ia)^
导电图形 conductive pattern ;:gx;'dm5
非导电图形 non-conductive pattern >l5JwwG
基材 base material
] cI(||x
层压板 laminate M, U YDZ',
覆金属箔基材 metal-clad bade material GgjB Le=C
覆铜箔层压板 copper-clad laminate (CCL) gClDVO
复合层压板 composite laminate 8%9OB5?F6
薄层压板 thin laminate K#p&XIY,
基体材料 basis material 'w7{8^Z2
预浸材料 prepreg zphStiwIQ
粘结片 bonding sheet k)USLA
预浸粘结片 preimpregnated bonding sheer cl-i 6[F
环氧玻璃基板 epoxy glass substrate S[M\com'
预制内层覆箔板 mass lamination panel J h:-<x y)
内层芯板 core material 5 *>3(U
粘结层 bonding layer x]U (EX`t$
粘结膜 film adhesive N,_ej@L8
无支撑胶粘剂膜 unsupported adhesive film 9/|i. 2&
覆盖层 cover layer (cover lay) ]j:Ikb}
增强板材 stiffener material yQ8H-a.
铜箔面 copper-clad surface PZl(S}VY
去铜箔面 foil removal surface )+9D$m=P;
层压板面 unclad laminate surface ]R{=|
基膜面 base film surface cWM| COXL+
胶粘剂面 adhesive faec K+mtuB]yr
原始光洁面 plate finish `\P :rn95;
粗面 matt finish %jM|*^\%
剪切板 cut to size panel @w:sNXz -
超薄型层压板 ultra thin laminate tdr*>WL
A阶树脂 A-stage resin 3B "rI
B阶树脂 B-stage resin LGCL*Qbsg
C阶树脂 C-stage resin .< vg[
环氧树脂 epoxy resin T }] Ao
酚醛树脂 phenolic resin ^NLKX5Q
聚酯树脂 polyester resin (^Do#3
聚酰亚胺树脂 polyimide resin C 12 7he
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin k*c:%vC!
丙烯酸树脂 acrylic resin 1,`x1dcO!A
三聚氰胺甲醛树脂 melamine formaldehyde resin @#H{nj
Z
多官能环氧树脂 polyfunctional epoxy resin L{f P_DIa
溴化环氧树脂 brominated epoxy resin .Na>BR\F
环氧酚醛 epoxy novolac 3]Lk}0atpL
氟树脂 fluroresin Ef `LBAfOO
硅树脂 silicone resin 0_D~n0rq,v
硅烷 silane X7c*T /
聚合物 polymer v
V^ GIWK
无定形聚合物 amorphous polymer 3Yj}ra}
结晶现象 crystalline polamer X0Oq lAw
双晶现象 dimorphism S c~kO4
共聚物 copolymer |f? C*t',
合成树脂 synthetic UXk8nH
热固性树脂 thermosetting resin [Page] 5!ReW39c ;
热塑性树脂 thermoplastic resin 47K5[R
感光性树脂 photosensitive resin dju&Ku
环氧值 epoxy value NxX1 _d
双氰胺 dicyandiamide /l$noaskX
粘结剂 binder xf]4!zE
胶粘剂 adesive -X}R(.}x
固化剂 curing agent l *:p==
阻燃剂 flame retardant P/PS(`
遮光剂 opaquer \!V6` @0KC
增塑剂 plasticizers ;W*$<~_
不饱和聚酯 unsatuiated polyester -5ec8m8
聚酯薄膜 polyester 1aT$07G0
聚酰亚胺薄膜 polyimide film (PI) gq@."wHU
聚四氟乙烯 polytetrafluoetylene (PTFE) 6~/H#8Kdn
增强材料 reinforcing material U; q)01
折痕 crease X*yl% V
云织 waviness #dfW 1@m
鱼眼 fish eye 0?h .X= G
毛圈长 feather length u ?Xku8 1l
厚薄段 mark x/S% NySG
裂缝 split 5#F+-9r
捻度 twist of yarn Q8 ~pIv
浸润剂含量 size content N R[mzJv
浸润剂残留量 size residue LG MFv
处理剂含量 finish level Le'\x`B
偶联剂 couplint agent tj&A@\/
断裂长 breaking length 5nn*)vK {
吸水高度 height of capillary rise o_N02l4J)
湿强度保留率 wet strength retention -/qrEKQ0U?
白度 whitenness ?hu 9c
导电箔 conductive foil E{ ,O}
铜箔 copper foil }Tef;8d
压延铜箔 rolled copper foil 7A|jnm
光面 shiny side rN~`4mZ
粗糙面 matte side -&A[{m <,>
处理面 treated side e ](=)h|
防锈处理 stain proofing FS}z_G|4]
双面处理铜箔 double treated foil 9 $ S,P|
模拟 simulation tV cs r
逻辑模拟 logic simulation N9ufTlq
s
电路模拟 circit simulation ]
6gu
时序模拟 timing simulation aS7zG2R4H
模块化 modularization >D;hT*3
设计原点 design origin YC_^jRB8n
优化（设计） optimization (design) _YS+{0
Vq%
供设计优化坐标轴 predominant axis 0R]CI
表格原点 table origin C hup %F
元件安置 component positioning Mt Z(\&~
比例因子 scaling factor GXRjR\Ch
扫描填充 scan filling +*DX(v"BH
矩形填充 rectangle filling 9wA c&nl-Y
填充域 region filling 4Dia#1$:J
实体设计 physical design q': wSu u
逻辑设计 logic design dL`
+ ^E>
逻辑电路 logic circuit J4g;~#_19
层次设计 hierarchical design jQ)>XOok
自顶向下设计 top-down design bZXNo
自底向上设计 bottom-up design dE]"^O#Mc
费用矩阵 cost metrix >i%w'uU
元件密度 component density kU/=Du
自由度 degrees freedom J":9
出度 out going degree H=#Jg;_w
入度 incoming degree 72zuI4&
曼哈顿距离 manhatton distance +_dYfux
欧几里德距离 euclidean distance z)>{O 3
网络 network ["<(\v9P)
阵列 array 36a~!
段 segment YoJ'=z,e
逻辑 logic =7Vl{>*1N
逻辑设计自动化 logic design automation 9VE;I:NO3
分线 separated time uFWgq::\
分层 separated layer B ed jw =B
定顺序 definite sequence #L0I+ K,K\
导线（通道） conduction (track) jPNfLwVkl:
导线（体）宽度 conductor width ?l jod6
导线距离 conductor spacing Ib8i#D V
导线层 conductor layer 5ba[6\Af
导线宽度/间距 conductor line/space <WJ 0 St
第一导线层 conductor layer No.1 X); Zm7
圆形盘 round pad ^&H=dYcV>/
方形盘 square pad i q:Q$z&
菱形盘 diamond pad Sp,Q,Q4
长方形焊盘 oblong pad E$Pjp oQTf
子弹形盘 bullet pad jYX9; C;J
泪滴盘 teardrop pad OX/.v?c
雪人盘 snowman pad '5/}MMT
形盘 V-shaped pad V B kxhF
环形盘 annular pad DS}rFU
非圆形盘 non-circular pad #L:P
R>
隔离盘 isolation pad Y B~t|m65
非功能连接盘 monfunctional pad :V~*vLvR
偏置连接盘 offset land t}k'Ba3]:Y
腹（背）裸盘 back-bard land ~hslLUE
盘址 anchoring spaur v-fi9$#^
连接盘图形 land pattern K]!u@I* K"
连接盘网格阵列 land grid array l\;mP.!
孔环 annular ring Q@wq
}vc!
元件孔 component hole UX`DZb +^
安装孔 mounting hole 4F,Ql"ae(
支撑孔 supported hole (TNY2Ke2 8
非支撑孔 unsupported hole kj!7|1i2
导通孔 via Vnj/ >e 3
镀通孔 plated through hole (PTH) %Rep6=K*$
余隙孔 access hole h+~df(S.
盲孔 blind via (hole) ^L mc%y
埋孔 buried via hole w<e;rKr
埋,盲孔 buried blind via Q!Ow{(|
任意层内部导通孔 any layer inner via hole ]p&< nK,
全部钻孔 all drilled hole AY'?Xt
定位孔 toaling hole p;=kH{u u
无连接盘孔 landless hole g~c|~u(W
中间孔 interstitial hole
NJ)2+
无连接盘导通孔 landless via hole /rxltF 3
引导孔 pilot hole cia-OVX
端接全隙孔 terminal clearomee hole aXbNDj
][
准尺寸孔 dimensioned hole [Page] :~3{oZGX&
在连接盘中导通孔 via-in-pad H<Kk j
孔位 hole location EKeh>3;?
孔密度 hole density d&T6p&V$
孔图 hole pattern [AX"ne# M*
钻孔图 drill drawing gJ5wAK+?
装配图assembly drawing vdT+,x`
参考基准 datum referan (#B^Hyz!
1） 元件设备 g"]<J &
AuDR |;i
三绕组变压器：three-column transformer ThrClnTrans .D,?u"fk|
双绕组变压器：double-column transformer DblClmnTrans x , Vh
电容器：Capacitor HKiVE g
并联电容器：shunt capacitor _TO i
[G T
电抗器：Reactor 5+bFy.UW
母线：Busbar ?S@R~y0K
输电线：TransmissionLine EARfbb"SG7
发电厂：power plant ~+<xFi
断路器：Breaker #K#Mv /
刀闸(隔离开关)：Isolator ,.o a,sku
分接头：tap PPC Tc|G
电动机：motor $35,\ZO >
（2） 状态参数 q)?p $\
uGa (_ut
有功：active power VPM|Rj:d
无功：reactive power nGx ~) T
电流：current ~)wwX:;B_
容量：capacity =s0g2Zv"\
电压：voltage Q)G!Y
(g\
档位：tap position B 9LSxB
有功损耗：reactive loss K =tx5{V
无功损耗：active loss 3V/_I<y
功率因数：power-factor nOoKGT
功率：power }$|% /Y
功角：power-angle ..jq[(;N
电压等级：voltage grade }O.LPQ0
空载损耗：no-load loss N a.
nA
铁损：iron loss T/wM(pr'
铜损：copper loss
8> Du
空载电流：no-load current Bw 3F7W~l
阻抗：impedance NWJcFj_
正序阻抗：positive sequence impedance JlC<MQ?
负序阻抗：negative sequence impedance '!wPnYT@D
零序阻抗：zero sequence impedance %Lp2jyv .
电阻：resistor DYo <5^0
电抗：reactance PyC;f8n'(
电导：conductance W>Mse[6`c
电纳：susceptance (| g").L
无功负载：reactive load 或者QLoad C~ZE95 g
有功负载: active load PLoad VLh%XoQx[
遥测：YC(telemetering) t7|MkX1
遥信：YX 9 m\ )\/V
励磁电流(转子电流)：magnetizing current |.b%rVu
定子：stator 0 W~.WkD
功角：power-angle @A
[)hk&(R
上限:upper limit uX[O,l^}
下限：lower limit #0P! xZ'|{
并列的：apposable GFd Z`i
高压: high voltage 3TU'*w
&
低压：low voltage W[R]^2QAG
中压：middle voltage cP*c(k~ N
电力系统 power system !~K =#"T
发电机 generator K4j@j}zK9I
励磁 excitation M[h 1>}$Lz
励磁器 excitor >vQ6V'F
电压 voltage ra]!4Kd'
电流 current #" Fg%36Zd
母线 bus Hs[}l_gYn
变压器 transformer C!!mOAhJ
升压变压器 step-up transformer D3 %l4.h
高压侧 high side WYSc k&9
输电系统 power transmission system J#6LSD@ (O
输电线 transmission line 0fnZR$PB
固定串联电容补偿fixed series capacitor compensation t-!Rgg$9
稳定 stability i[^k.W3gf
电压稳定 voltage stability UskZ%J
功角稳定 angle stability r~)VGdB+
暂态稳定 transient stability .r ~'(g{qt
电厂 power plant oz%h)#;
能量输送 power transfer B^Xy0fq
交流 AC {hxW,mmA
装机容量 installed capacity 1 h<f Jzh
电网 power system azvDvEWCQZ
落点 drop point yrO?Np
开关站 switch station S&n [4 *
双回同杆并架 double-circuit lines on the same tower 9n_ eCb)H
变电站 transformer substation e@[9C(5E"
补偿度 degree of compensation "VV914*z
高抗 high voltage shunt reactor +jcdf }
无功补偿 reactive power compensation EtGH\?d~]
故障 fault DeA @0HOxh
调节 regulation %h0D)6 j
裕度 magin )j\r,9<K+5
三相故障 three phase fault `/c7h16
故障切除时间 fault clearing time '#H&:Htm;L
极限切除时间 critical clearing time ]X*YAPv
切机 generator triping KZECo1
高顶值 high limited value YjFWC!Qj$
强行励磁 reinforced excitation xYmdCf@H
线路补偿器 LDC(line drop compensation) E\w+ kAAf
机端 generator terminal Q5g,7ac8L
静态 static (state) <R>Q4&we(
动态 dynamic (state) 7 7`` 8,
单机无穷大系统 one machine - infinity bus system _O$t uC%
机端电压控制 AVR ^,Xa IP+[
电抗 reactance ?F1wh2o q
电阻 resistance -=}b;Kf -
功角 power angle 1c'79YU
有功（功率） active power B-$+UE>%
无功（功率） reactive power i9KTX%s5^
功率因数 power factor $;y1Q iel
无功电流 reactive current ` %uK0qw"
下降特性 droop characteristics INOH{`}Ew
斜率 slope B0v|{C
额定 rating E evw*;$x
变比 ratio ^ZR8s^X
参考值 reference value D
0
电压互感器 PT # aa1<-&H
分接头 tap MZ)T0|S_
下降率 droop rate O5O.><RP
仿真分析 simulation analysis pOKeEW<q
传递函数 transfer function \Y9I~8\ gB
框图 block diagram {f-XyF1`
受端 receive-side wajZqC2yg
裕度 margin ~*,Wj?~+7
同步 synchronization PzLJ/QER
失去同步 loss of synchronization 4 HW;
阻尼 damping qT$ )Rb&
摇摆 swing uN y!< u
保护断路器 circuit breaker 5.dl>,
电阻：resistance V7BsE w
电抗：reactance cg{Gc]'1#
阻抗：impedance >zFD $
电导：conductance zMr&1*CDX
电纳：susceptance
