1 backplane 背板 l J;wl|9
2 Band gap voltage reference 带隙电压参考 $2 ~A^#"0
3 benchtop supply 工作台电源 s)]i0+!
4 Block Diagram 方块图 5 Bode Plot 波特图 M2%<4(UwI
6 Bootstrap 自举 <y(>z*T;
7 Bottom FET Bottom FET n M,m#"AI
8 bucket capcitor 桶形电容 2
os&d|
9 chassis 机架 i1\xZ<|0
10 Combi-sense Combi-sense 6wIv7@Y
11 constant current source 恒流源 P[%
W[E<
12 Core Sataration 铁芯饱和 .e"De-u
13 crossover frequency 交叉频率 9%>H}7=
14 current ripple 纹波电流 dxUq5`#G,
15 Cycle by Cycle 逐周期 Hx62x X
16 cycle skipping 周期跳步 bx!Sy0PUJ
17 Dead Time 死区时间 91jv=>=DM
18 DIE Temperature 核心温度 v9u/<w68!
19 Disable 非使能,无效,禁用,关断
P\*-n"
20 dominant pole 主极点 V0c*M>V
21 Enable 使能,有效,启用 g@`14U/|
22 ESD Rating ESD额定值 ~}$:iyJV(>
23 Evaluation Board 评估板 %n=!H
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. }i|o":-x+
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 'nBJ[$2^
25 Failling edge 下降沿 :hjeltt
26 figure of merit 品质因数 3Ey#?
27 float charge voltage 浮充电压 M!;H3*
28 flyback power stage 反驰式功率级 EYcvD^!1g
29 forward voltage drop 前向压降 zPH1{|H+l
30 free-running 自由运行 * j:
31 Freewheel diode 续流二极管 4/~8zvz&3
32 Full load 满负载 33 gate drive 栅极驱动 2fFNJ
34 gate drive stage 栅极驱动级 M5: f^
35 gerber plot Gerber 图 W6E9
36 ground plane 接地层 0r_8/|N#
37 Henry 电感单位:亨利 7.hVbjy'-
38 Human Body Model 人体模式 lk1c2
39 Hysteresis 滞回 4(bV#
40 inrush current 涌入电流 aVO5zR./)
41 Inverting 反相 "n7rbh3VW
42 jittery 抖动 QKE$>G
43 Junction 结点 F2AM/m^!q
44 Kelvin connection 开尔文连接 va95/(
45 Lead Frame 引脚框架 Qh? E*9
46 Lead Free 无铅 j/#kO?
47 level-shift 电平移动 &z
1A-O
v
48 Line regulation 电源调整率 ]Qkto4DQ5
49 load regulation 负载调整率 &!N5}N&
50 Lot Number 批号 818</b<yn
51 Low Dropout 低压差 fP&F$"o8
52 Miller 密勒 53 node 节点 }rn}r4_a
54 Non-Inverting 非反相 %+Z0$Q
55 novel 新颖的 c<y.Y0
56 off state 关断状态 67<zBw2
57 Operating supply voltage 电源工作电压 .%U~ r2Y(
58 out drive stage 输出驱动级 ]BO{Q+?d2
59 Out of Phase 异相 #fk)Y1
60 Part Number 产品型号 nAoGG0$5
61 pass transistor pass transistor {iYu
x;(
62 P-channel MOSFET P沟道MOSFET v"F.<Q
63 Phase margin 相位裕度 ]^3_eHa^d
64 Phase Node 开关节点 x
+q"%9.c
65 portable electronics 便携式电子设备 })M$#%(
66 power down 掉电 PxfeU2^{0
67 Power Good 电源正常 fh b &_T
68 Power Groud 功率地 }2:bYpYQ
69 Power Save Mode 节电模式 0`h[|FYV
70 Power up 上电 d?v#gW
71 pull down 下拉 Bag2sk
72 pull up 上拉 $Y,,e3R3
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 6mep|![6
74 push pull converter 推挽转换器 P>)-uLc~W
75 ramp down 斜降 /raM\EyrlP
76 ramp up 斜升 SR*%-JbA
77 redundant diode 冗余二极管 N>/*)Frt
78 resistive divider 电阻分压器 PUltn}M
79 ringing 振 铃 (|'w$
80 ripple current 纹波电流 %,K |v
81 rising edge 上升沿 (e=ksah3>
82 sense resistor 检测电阻 V*=cNj
83 Sequenced Power Supplys 序列电源 H'q&1^w)
84 shoot-through 直通,同时导通 HAf.LdnzS
85 stray inductances. 杂散电感 !V+5$TsS
86 sub-circuit 子电路 KjZ^\lq'
87 substrate 基板 pvI(hjMYPk
88 Telecom 电信 $-=aqUU
89 Thermal Information 热性能信息 6lT1X)
90 thermal slug 散热片 Ook3B
91 Threshold 阈值 JV36@DVQ
92 timing resistor 振荡电阻 ,*E%D _
93 Top FET Top FET )N)ziAy}
94 Trace 线路,走线,引线 (PsA[>F
95 Transfer function 传递函数 nd3]&occ
96 Trip Point 跳变点 ZNOoyWYi5
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) c*RZbE9k
98 Under Voltage Lock Out (UVLO) 欠压锁定 S/~6%uJ
99 Voltage Reference 电压参考 3 [SN[faS
100 voltage-second product 伏秒积 reu[}k ~
101 zero-pole frequency compensation 零极点频率补偿 [cXu<vjFM
102 beat frequency 拍频 +GP"9S2%R
103 one shots 单击电路 >z>UtT:
104 scaling 缩放 qE$.a[
105 ESR 等效串联电阻 [Page] Wn0r[h5t
106 Ground 地电位 px//q4U
107 trimmed bandgap 平衡带隙 z6Su`
108 dropout voltage 压差 ua|qL! L+
109 large bulk capacitance 大容量电容 0qG[hxt%
110 circuit breaker 断路器 Xuh_bW&zF
111 charge pump 电荷泵 ]DmqhK`
112 overshoot 过冲 Q Aygr4\X^
'3+S5p8
印制电路printed circuit R3?~+y&
印制线路 printed wiring PO&xi9_
印制板 printed board ;2L=WR%
印制板电路 printed circuit board ^z[s;:-
印制线路板 printed wiring board t$l[ 4
R-
印制元件 printed component M#<x2ojW
印制接点 printed contact \M>AN
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印制板装配 printed board assembly U?$v1 ||
板 board )z/j5tnvm
刚性印制板 rigid printed board Ql&P1|&
挠性印制电路 flexible printed circuit L'aMXNO
挠性印制线路 flexible printed wiring cb'8Li8,j
齐平印制板 flush printed board X){F^1CT{
金属芯印制板 metal core printed board }-r"W7]k
金属基印制板 metal base printed board CvbY2_>Nh
多重布线印制板 mulit-wiring printed board 2mU}"gf[
塑电路板 molded circuit board u52;)"&=)
散线印制板 discrete wiring board Qbv)(&i#~
微线印制板 micro wire board (]7@0d88
积层印制板 buile-up printed board p-*BB_J"
表面层合电路板 surface laminar circuit M\`6H8aLn
埋入凸块连印制板 B2it printed board |I OTW=>
载芯片板 chip on board 3g-}k
埋电阻板 buried resistance board D"^ogY#LK
母板 mother board V{d"cs>9
子板 daughter board i3e|j(Gs4
背板 backplane >$R-:>~zN
裸板 bare board P92:}" )*>
键盘板夹心板 copper-invar-copper board "H G:by
动态挠性板 dynamic flex board 5~rs55W
静态挠性板 static flex board f_Wn[I{
可断拼板 break-away planel nF=Ig-NX^
电缆 cable /f# rN_4
挠性扁平电缆 flexible flat cable (FFC) H.>KYiv+
薄膜开关 membrane switch l" sR\`~
混合电路 hybrid circuit 0
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厚膜 thick film TzK?bbgr!
厚膜电路 thick film circuit %'g/4I
薄膜 thin film i^QcW!X&
薄膜混合电路 thin film hybrid circuit 8\I(a]kM`
互连 interconnection )9<)mV*EB(
导线 conductor trace line m|f|u3'z$
齐平导线 flush conductor )3G?5
OTS
传输线 transmission line Z>M*!mQi
跨交 crossover UI!EIZ*~
板边插头 edge-board contact koqH~>ZtD
增强板 stiffener 2l\Oufer"
基底 substrate K} ;uH,
基板面 real estate X;6X
K$"
导线面 conductor side GbL,k?ey
元件面 component side 7gJy xQ
焊接面 solder side GGLVv)
导电图形 conductive pattern wkIH<w|jb
非导电图形 non-conductive pattern aX~iY ~?_
基材 base material [6/%ynlP
层压板 laminate =3(
ZUV X
覆金属箔基材 metal-clad bade material ^3r2Q?d\
覆铜箔层压板 copper-clad laminate (CCL) g8qN+Gg
复合层压板 composite laminate Q0 ^?jh
薄层压板 thin laminate SQz>e
基体材料 basis material LXK+WB/s
预浸材料 prepreg 4Yn*q~f
粘结片 bonding sheet %*s[s0$c
预浸粘结片 preimpregnated bonding sheer E4{^[=}
环氧玻璃基板 epoxy glass substrate #v~5f;[AAs
预制内层覆箔板 mass lamination panel HX=`kkX
内层芯板 core material -AffKo
粘结层 bonding layer a{-}8f6
粘结膜 film adhesive 3ea6g5kX
无支撑胶粘剂膜 unsupported adhesive film |5FyfDaFBX
覆盖层 cover layer (cover lay) &