1 backplane 背板 ly( LMr
2 Band gap voltage reference 带隙电压参考 m4x8W2q
3 benchtop supply 工作台电源 ni~1)"U.
4 Block Diagram 方块图 5 Bode Plot 波特图 BBDt^$
6 Bootstrap 自举 ESi'3mbeC
7 Bottom FET Bottom FET B:rzM:BQ
8 bucket capcitor 桶形电容 J>N^ FR9
9 chassis 机架 MN<uIqG
10 Combi-sense Combi-sense *iiyU}x
11 constant current source 恒流源 K.r
"KxCm|
12 Core Sataration 铁芯饱和 s~>0<3{5
13 crossover frequency 交叉频率 :F`"CR^,
14 current ripple 纹波电流 \#7@"~<
15 Cycle by Cycle 逐周期 G3${\'<
16 cycle skipping 周期跳步 [oDu3Qn
17 Dead Time 死区时间 OKV/=]GS
18 DIE Temperature 核心温度 MHPh!
19 Disable 非使能,无效,禁用,关断 EK2mJCC|
20 dominant pole 主极点 S'}pUGDO
21 Enable 使能,有效,启用 u#)ARCx ,w
22 ESD Rating ESD额定值 "|nh=!L
23 Evaluation Board 评估板 ^E]y >Y
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. I4(z'C
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 @XQItc<
25 Failling edge 下降沿 mRT$@xa]J
26 figure of merit 品质因数 \V%l.P4>e
27 float charge voltage 浮充电压 pKkBAr,
28 flyback power stage 反驰式功率级 lN~u='Kc
29 forward voltage drop 前向压降 pE381Cw
30 free-running 自由运行 ZVni'ym
31 Freewheel diode 续流二极管 p5`={'>-
32 Full load 满负载 33 gate drive 栅极驱动 7p_B?r
34 gate drive stage 栅极驱动级 6rBP,\m
35 gerber plot Gerber 图 ICD;a
36 ground plane 接地层 O#n=mJ
37 Henry 电感单位:亨利 d7P'c!@+
38 Human Body Model 人体模式 XOT|:
39 Hysteresis 滞回 ~%!"!Z4
40 inrush current 涌入电流 Lq]t6o]
41 Inverting 反相 )R6-]TkA_
42 jittery 抖动 =-E%vnU
43 Junction 结点 m8<.TCIQ
44 Kelvin connection 开尔文连接 NudY9~
45 Lead Frame 引脚框架 0JU+v:J[=
46 Lead Free 无铅 N7UGgn=
47 level-shift 电平移动 o2R&s@%0@B
48 Line regulation 电源调整率 wo5fGQJ
49 load regulation 负载调整率 e)f!2'LL
50 Lot Number 批号 bBY7^k
51 Low Dropout 低压差 ub9,Wd"^
52 Miller 密勒 53 node 节点 ")i_{C,b^
54 Non-Inverting 非反相 (w1$m8`=
55 novel 新颖的 7bY N
56 off state 关断状态 {y`n_
57 Operating supply voltage 电源工作电压 guk{3<d:Jy
58 out drive stage 输出驱动级 !`0
El',gY
59 Out of Phase 异相 p-kug]qX
60 Part Number 产品型号 Mz: "p.
61 pass transistor pass transistor >~*}9y0$
62 P-channel MOSFET P沟道MOSFET I78Q8W(5
63 Phase margin 相位裕度 W%@0Y m`7
64 Phase Node 开关节点 -0>s`ruor
65 portable electronics 便携式电子设备 JYrOE"!h
66 power down 掉电 pcNpr`
67 Power Good 电源正常 0aa&13!5
68 Power Groud 功率地 |h-e+Wh1
69 Power Save Mode 节电模式 N)
'|l0x0
70 Power up 上电 =y0h\<[
71 pull down 下拉 >D_!d@Z
72 pull up 上拉 {sF;R.P&r
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Np@RK1}
74 push pull converter 推挽转换器 qo7jrY5G
75 ramp down 斜降 e'2w-^7
76 ramp up 斜升 GP0}I@>?
77 redundant diode 冗余二极管 ^_t7{z%sA[
78 resistive divider 电阻分压器 r#NR3_@9
79 ringing 振 铃 B3W2?5p
80 ripple current 纹波电流 D-Q54 "^3
81 rising edge 上升沿 IHwoG(A~<
82 sense resistor 检测电阻 o?5;l`.L}
83 Sequenced Power Supplys 序列电源 %mRnJgV5k
84 shoot-through 直通,同时导通 }BAe
85 stray inductances. 杂散电感 9a]J Q
86 sub-circuit 子电路 ONMR2J(
87 substrate 基板 DHVfb(H5e
88 Telecom 电信 eE" *c>I
89 Thermal Information 热性能信息 =8AL>:_
90 thermal slug 散热片 8qwPk4
91 Threshold 阈值 <~
?LU^
92 timing resistor 振荡电阻 <q:2' 4o
93 Top FET Top FET bA07zI2
94 Trace 线路,走线,引线 |?\2F
95 Transfer function 传递函数 P\&n0C~
96 Trip Point 跳变点 eA-$TSWh
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 8Ud.}<
Zi
98 Under Voltage Lock Out (UVLO) 欠压锁定 t: 03
99 Voltage Reference 电压参考 @=qWwt4~
100 voltage-second product 伏秒积 +r$VrNVs
101 zero-pole frequency compensation 零极点频率补偿 !RwMUnp
102 beat frequency 拍频 Cf.(/5X
103 one shots 单击电路 "@L|Z6U(
104 scaling 缩放 >S@><[C
105 ESR 等效串联电阻 [Page] )<`/Aaie
106 Ground 地电位 :oytJhxU
107 trimmed bandgap 平衡带隙 O
+Xu?W]
108 dropout voltage 压差 +kx#"L:
109 large bulk capacitance 大容量电容 *~^M_wej
110 circuit breaker 断路器 VKu|=m2vB
111 charge pump 电荷泵 U]"6KS
112 overshoot 过冲 hy"=)n(
{CQI*\O
印制电路printed circuit Q#pgl
印制线路 printed wiring rQ)I
印制板 printed board R:U!HE8j
印制板电路 printed circuit board 9^@#Ua
印制线路板 printed wiring board vs{xr*Ft
印制元件 printed component 4YA1~7R
印制接点 printed contact {i)FDdDGD
印制板装配 printed board assembly Thuwme
板 board sPRs;to-
刚性印制板 rigid printed board +K48c,gt?
挠性印制电路 flexible printed circuit 3-_`x9u*
挠性印制线路 flexible printed wiring t]+h.
齐平印制板 flush printed board v(l:N@L
金属芯印制板 metal core printed board v
K!vA-7
金属基印制板 metal base printed board }VqCyJu&{
多重布线印制板 mulit-wiring printed board vY]7oX+
塑电路板 molded circuit board E2Ec`o
散线印制板 discrete wiring board rhC
x&L
微线印制板 micro wire board 8>'vzc/*>
积层印制板 buile-up printed board J'*`K>wV
表面层合电路板 surface laminar circuit -NUA
埋入凸块连印制板 B2it printed board i)@H
载芯片板 chip on board Dj{=Y`Tw
埋电阻板 buried resistance board _@O.EksY3r
母板 mother board mBDzc(_\$'
子板 daughter board G],W{<Pe
背板 backplane U?j[
8z
裸板 bare board )@6iQ
键盘板夹心板 copper-invar-copper board ):nC&M\W~
动态挠性板 dynamic flex board ~X,ZZ 9H
静态挠性板 static flex board zZiga q"
可断拼板 break-away planel s[}cj+0
电缆 cable ~y1k2n
挠性扁平电缆 flexible flat cable (FFC) LuWY}ste
薄膜开关 membrane switch vpoJ{TPO
混合电路 hybrid circuit BoofJm
厚膜 thick film /;`-[
厚膜电路 thick film circuit 5c1{[
薄膜 thin film `A$zLqz)Vm
薄膜混合电路 thin film hybrid circuit p;)@R$*
互连 interconnection uOb}R
导线 conductor trace line &W
N
R{
齐平导线 flush conductor ~;I'.TW
传输线 transmission line ~Z5Wwp]a
跨交 crossover }M &hcw<
板边插头 edge-board contact RIq\IQ_|
增强板 stiffener z*`nfTw l
基底 substrate uk)D2.eS,
基板面 real estate hv )d
导线面 conductor side C0;:")6~
元件面 component side G,XUMZ
焊接面 solder side 1Wz5Iv#Ez
导电图形 conductive pattern 0|FQIhVuY
非导电图形 non-conductive pattern 6bUcrw/#
p
基材 base material NQ,2pM<*-
层压板 laminate #fxdZm,
覆金属箔基材 metal-clad bade material EkEQFd 5g
覆铜箔层压板 copper-clad laminate (CCL) `,Y/!(:;
复合层压板 composite laminate 1V;,ZGI*
薄层压板 thin laminate 1_z~<d
@?;
基体材料 basis material V0y_c^x
预浸材料 prepreg jiP^Hz"e
粘结片 bonding sheet P*kC>lvSv
预浸粘结片 preimpregnated bonding sheer [W=6NAd
环氧玻璃基板 epoxy glass substrate D>K=D"
预制内层覆箔板 mass lamination panel qIk(ei
内层芯板 core material XO}v8nWV
粘结层 bonding layer &\<?7Qj3U|
粘结膜 film adhesive
7?2<W-n
无支撑胶粘剂膜 unsupported adhesive film _OJ19 Ry
覆盖层 cover layer (cover lay) .%_=(C<E
增强板材 stiffener material q[%SF=~<k{
铜箔面 copper-clad surface ^'$P[
去铜箔面 foil removal surface P;ovPyoO
层压板面 unclad laminate surface xN44>3#
基膜面 base film surface =5#sB*
胶粘剂面 adhesive faec <Y ^)/ s
原始光洁面 plate finish EN)0b,ax
粗面 matt finish xd^9R<
剪切板 cut to size panel N@R?<a
超薄型层压板 ultra thin laminate hvF>Tu]^r
A阶树脂 A-stage resin #LfoG?k1K
B阶树脂 B-stage resin I->4Q&3
C阶树脂 C-stage resin >{k0N@_
环氧树脂 epoxy resin !p(N
DQm
酚醛树脂 phenolic resin rF=\H3`p3
聚酯树脂 polyester resin MO_;8v~0
聚酰亚胺树脂 polyimide resin _hi8mo
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin >\Ml\CyL
丙烯酸树脂 acrylic resin YbuS[l8
三聚氰胺甲醛树脂 melamine formaldehyde resin 1^ y^b{
多官能环氧树脂 polyfunctional epoxy resin Kl w9
溴化环氧树脂 brominated epoxy resin +D|E8sz8
环氧酚醛 epoxy novolac
~ P!%i9e_
氟树脂 fluroresin b!z kQ?h
硅树脂 silicone resin BS+=*3J
硅烷 silane fk(h*L|sI
聚合物 polymer '<&rMn
无定形聚合物 amorphous polymer N
m@UM*D
结晶现象 crystalline polamer Vnnl~|Xx
双晶现象 dimorphism ~A-D>.ZH
共聚物 copolymer zl!Y(o!@
合成树脂 synthetic kTm>`.kKJ=
热固性树脂 thermosetting resin [Page] a
VIh|v
热塑性树脂 thermoplastic resin d 8M8O3
感光性树脂 photosensitive resin X5c)T}pyv
环氧值 epoxy value yn.f?[G2
双氰胺 dicyandiamide 5U<;6s
粘结剂 binder Oi\,clR^[o
胶粘剂 adesive =\i{dj
固化剂 curing agent HMVyXulU
阻燃剂 flame retardant i"
>kF@]c8
遮光剂 opaquer ZGQz@H5
增塑剂 plasticizers H]VoXJ\*
不饱和聚酯 unsatuiated polyester GaLQ/V2R
聚酯薄膜 polyester !s(s^
聚酰亚胺薄膜 polyimide film (PI) d2O x:| <)
聚四氟乙烯 polytetrafluoetylene (PTFE) b1-'q^M
增强材料 reinforcing material zfm#yDf
折痕 crease x^/453Lk
云织 waviness aX|LEZ;D>
鱼眼 fish eye (zIIC"~5
毛圈长 feather length B"2#}HM
厚薄段 mark 5DnX8t+d
裂缝 split Bngvm9k3
捻度 twist of yarn 4>t=r\"4
浸润剂含量 size content vs(x;zpJ
浸润剂残留量 size residue Rge\8H/z
处理剂含量 finish level BHJS.o*j~
偶联剂 couplint agent */A ~lR|
断裂长 breaking length ) (l=_[1Z5
吸水高度 height of capillary rise _?a.S8LxJZ
湿强度保留率 wet strength retention MUvgmJsN
白度 whitenness w4j,t
导电箔 conductive foil xaW9Sj0ZM
铜箔 copper foil e~NF}9#A
压延铜箔 rolled copper foil \Ea(f**2B
光面 shiny side 5FwVR3,
粗糙面 matte side L3y`*&e>
处理面 treated side 9hdz<eFL
防锈处理 stain proofing {Q
AV
双面处理铜箔 double treated foil +l(lpp>,
模拟 simulation <F-W fR
逻辑模拟 logic simulation y rmi:=N(
电路模拟 circit simulation SB=%(]S
时序模拟 timing simulation _X]S`e1F
模块化 modularization ?$ 0t @E
设计原点 design origin p
_q]Rt
优化(设计) optimization (design) (bON[6OGm
供设计优化坐标轴 predominant axis >^zbDU1wT
表格原点 table origin .yb=I6D;<3
元件安置 component positioning ?$Ii_.
比例因子 scaling factor {x<yDDIv_
扫描填充 scan filling H:_R[u4r
矩形填充 rectangle filling \I
#}R4z
填充域 region filling )_\q)t"=
实体设计 physical design FFpG>+*3
逻辑设计 logic design j=n<s</V
逻辑电路 logic circuit jxTYW)E
层次设计 hierarchical design i'`[dwfS
自顶向下设计 top-down design R/?ZbMn]!
自底向上设计 bottom-up design lq}g*ih
费用矩阵 cost metrix )jHH-=JM
元件密度 component density Or,W2
自由度 degrees freedom [WW ~SOJe
出度 out going degree od RtJ[
入度 incoming degree pW1(1M)[%Z
曼哈顿距离 manhatton distance (V9 ;
欧几里德距离 euclidean distance DBk]2W|i
网络 network vbSycZ2M7
阵列 array Pj{Y
段 segment x5%x""VEK
逻辑 logic 6uKS!\EY|
逻辑设计自动化 logic design automation BSHtoD@e7
分线 separated time J `
KyS
分层 separated layer wi@Qf6(mn
定顺序 definite sequence [ %6(1$Ih
导线(通道) conduction (track) )Rr0f 8
导线(体)宽度 conductor width 7j8Ou3
导线距离 conductor spacing vz3#.a~2
导线层 conductor layer XWv;l)
导线宽度/间距 conductor line/space %2^wyVkq:
第一导线层 conductor layer No.1 QI*<MF,1
圆形盘 round pad 9#b/D&pX5
方形盘 square pad W?X3 :1c9:
菱形盘 diamond pad xvTz|Y
长方形焊盘 oblong pad *m*sg64Zw
子弹形盘 bullet pad @"__2\ 0
泪滴盘 teardrop pad (fcJp)D
雪人盘 snowman pad I@q(P>]X9
形盘 V-shaped pad V a<CACWsN.T
环形盘 annular pad Q%n$IQr4gM
非圆形盘 non-circular pad *:V+whBY
隔离盘 isolation pad MkX=34oc^
非功能连接盘 monfunctional pad !8OgaMngzF
偏置连接盘 offset land M*2
Nq=3
腹(背)裸盘 back-bard land SaSj9\o
盘址 anchoring spaur /MZ^;XG
连接盘图形 land pattern *=zv:!
连接盘网格阵列 land grid array lGpci
孔环 annular ring Cxra(!&
元件孔 component hole |(3"_
安装孔 mounting hole 5[Uv%A?H#_
支撑孔 supported hole 3 @%XR8ss
非支撑孔 unsupported hole ug^esB
导通孔 via ~Aw.=Yi=
镀通孔 plated through hole (PTH) HMmB90P`
余隙孔 access hole a6!|#rt
盲孔 blind via (hole) ]-cSTtO
埋孔 buried via hole DhD^w;f]
埋,盲孔 buried blind via hO; XJyv
任意层内部导通孔 any layer inner via hole -mw`f)?Ev
全部钻孔 all drilled hole R'Uf#.
定位孔 toaling hole aKz:hG
无连接盘孔 landless hole I`;SA~5
中间孔 interstitial hole y~^-I5!_ u
无连接盘导通孔 landless via hole odW K\e
引导孔 pilot hole {Bz E
端接全隙孔 terminal clearomee hole xQkvK=~$
准尺寸孔 dimensioned hole [Page] <.hutU*1
在连接盘中导通孔 via-in-pad _
o.j({S
孔位 hole location |dhKeg_
孔密度 hole density 9J$-E4G.M
孔图 hole pattern Y&-%
N
钻孔图 drill drawing *" +u^
装配图assembly drawing `#"xgOSP>
参考基准 datum referan Y`rli
1) 元件设备 J?C:@Q
'^M.;Giz
三绕组变压器:three-column transformer ThrClnTrans fwNj@fl_,e
双绕组变压器:double-column transformer DblClmnTrans X}H?*'-
电容器:Capacitor Q2[;H!"
并联电容器:shunt capacitor vUhgM'
电抗器:Reactor xJ9aFpTC
母线:Busbar t~|J2*9l
输电线:TransmissionLine lBGYZ--
发电厂:power plant -\n%K
断路器:Breaker xZA.<Yd^r
刀闸(隔离开关):Isolator u9fJ:a
分接头:tap Ll.P>LH
电动机:motor ?AK`M #M
(2) 状态参数 jl5&T{z
hLj7i?
有功:active power (AZAQ xt
无功:reactive power 8Qhj_
电流:current rn/~W[
容量:capacity gloJ;dEB
电压:voltage 6V*,nocL_+
档位:tap position N(V_P[]"*,
有功损耗:reactive loss ~LQzt@G4
无功损耗:active loss OrwVRqW-z
功率因数:power-factor KD.|oo
功率:power U7Oa
13Qz
功角:power-angle ?tA%A
电压等级:voltage grade dz!m8D0
空载损耗:no-load loss xpc{#/Nk
铁损:iron loss U~USwUzgY
铜损:copper loss -Aojk8tc
空载电流:no-load current No`*-> R
阻抗:impedance h'?v(k!
正序阻抗:positive sequence impedance <@P. 'rE
负序阻抗:negative sequence impedance @)U;hk)j;
零序阻抗:zero sequence impedance #k?. dWZ!
电阻:resistor .f"1(J8
电抗:reactance
HQ]mDo
电导:conductance HLOrDlj7
电纳:susceptance [>t;P,
无功负载:reactive load 或者QLoad @dx8 {oQ
有功负载: active load PLoad ;wkMa;%`g|
遥测:YC(telemetering) H]7bqr
遥信:YX YgdQC(ib
励磁电流(转子电流):magnetizing current 2vh }:A_
定子:stator `!$6F:d_l
功角:power-angle {xeJO:M3/
上限:upper limit `So/G
下限:lower limit AUu<@4R7
并列的:apposable 3!$+N\ #w
高压: high voltage bv VkN
低压:low voltage {*P[dyu
中压:middle voltage b.v +5=)B
电力系统 power system >lKu[nq;
发电机 generator `S0`3q}L3%
励磁 excitation *CPp U|
励磁器 excitor n_Qua|R
电压 voltage {Wi*B(
电流 current Np%Q-T\
母线 bus ]tf`[bINP
变压器 transformer JsNj!aeU%
升压变压器 step-up transformer NU3TXO
高压侧 high side Il Qk W<
输电系统 power transmission system :;eQ*{ `\
输电线 transmission line '%wSs,HD
固定串联电容补偿fixed series capacitor compensation @_?2iN?4Z
稳定 stability ^2);*X>
电压稳定 voltage stability [T,Hpt
功角稳定 angle stability v0VQ4>
暂态稳定 transient stability Rk7F;2
电厂 power plant ^lt2,x
能量输送 power transfer qZ'2M.;
交流 AC lg8@^Pm$r;
装机容量 installed capacity :"MHmm=uU8
电网 power system }Nd1'BVf
落点 drop point G%FZTA6a
开关站 switch station w%s];EE
双回同杆并架 double-circuit lines on the same tower v/9DD% An
变电站 transformer substation <D3mt Q
补偿度 degree of compensation r{^43g?
高抗 high voltage shunt reactor ?'Hd0)yZ
无功补偿 reactive power compensation yvj /u
c
故障 fault 2|=hF9
调节 regulation .|^Gde
裕度 magin sv?Fx;d
三相故障 three phase fault 0FtwDM))
故障切除时间 fault clearing time q)L4*O
极限切除时间 critical clearing time '~Cn+xf4]
切机 generator triping p]EugLEmG
高顶值 high limited value Q"C*j'n
强行励磁 reinforced excitation }x\#ul)
线路补偿器 LDC(line drop compensation) |Z94@uB
机端 generator terminal "gJ.mhHX
静态 static (state) Y(bB7tR
动态 dynamic (state) *U,JQ
单机无穷大系统 one machine - infinity bus system IH dA2d?.]
机端电压控制 AVR nAWb9Yk
电抗 reactance JPAjOcmU/
电阻 resistance r'jUB^E
功角 power angle 8T9s:/%
有功(功率) active power 4NW!{Vw ,
无功(功率) reactive power xi(1H1KN5B
功率因数 power factor Lv]%P.=[G
无功电流 reactive current a`n)aXU l
下降特性 droop characteristics N-?5[T"
斜率 slope 4pf@.ra,
额定 rating O*GF/ R8B
变比 ratio lUB?eQuN_
参考值 reference value \.}T_,I
电压互感器 PT &TBFt;
分接头 tap Q&xH
下降率 droop rate 8
E\zjT!#\
仿真分析 simulation analysis Lo1ySLo$G
传递函数 transfer function I2WP/
框图 block diagram ^J#*sn
受端 receive-side H" `'d
裕度 margin U%s@np
同步 synchronization )gdLb}
失去同步 loss of synchronization Z! O4hA4
阻尼 damping '*mZ/O-
摇摆 swing /HLI9
保护断路器 circuit breaker *lvADW5e
电阻:resistance uAeo&|&
电抗:reactance &&9|;0<
阻抗:impedance }W8A1-UF
电导:conductance ,{HQKHg
电纳:susceptance