1 backplane 背板 jmPnUn
2 Band gap voltage reference 带隙电压参考 +saXN6
3 benchtop supply 工作台电源 g[';1}/B4
4 Block Diagram 方块图 5 Bode Plot 波特图 {bHUZen
6 Bootstrap 自举
4A"3C
7 Bottom FET Bottom FET #9zpJ\E
8 bucket capcitor 桶形电容 Bs)'Gk`1
9 chassis 机架 <-;/,uu
10 Combi-sense Combi-sense 0Q?)?8_
11 constant current source 恒流源 B\S}*IE
12 Core Sataration 铁芯饱和 @QteC@k
13 crossover frequency 交叉频率 E@,m+
14 current ripple 纹波电流 2[j(C
15 Cycle by Cycle 逐周期 J/LsL
k
16 cycle skipping 周期跳步 d^MRu#]
17 Dead Time 死区时间 5C0![$W>
18 DIE Temperature 核心温度 `>)[UG!:|
19 Disable 非使能,无效,禁用,关断 ttOk6-
20 dominant pole 主极点 ]-8WM5\qJM
21 Enable 使能,有效,启用 e[
yN
22 ESD Rating ESD额定值 )Zf1%h~0r
23 Evaluation Board 评估板 ls7eypKR
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. !7Eodq-0
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 `+z^#3l
25 Failling edge 下降沿 i/j53towe
26 figure of merit 品质因数 -M/j&<;LW
27 float charge voltage 浮充电压 wU6sU]P
28 flyback power stage 反驰式功率级 Z_Wzm!:
29 forward voltage drop 前向压降 Q2/65$nW
30 free-running 自由运行 XeX\u3<D
31 Freewheel diode 续流二极管 |Dt_lQp#
32 Full load 满负载 33 gate drive 栅极驱动 sSd/\Ap
34 gate drive stage 栅极驱动级 FA%_jM
35 gerber plot Gerber 图 I4W@t4bZ
36 ground plane 接地层 1U%
/~
37 Henry 电感单位:亨利 jp_|pC'
38 Human Body Model 人体模式 fIl;qGz85
39 Hysteresis 滞回 GLgf%A`5/_
40 inrush current 涌入电流 aaP_^m O
41 Inverting 反相 {`QA.he.
42 jittery 抖动 oNZ_7tU
43 Junction 结点 yQuL[#p
44 Kelvin connection 开尔文连接 N_IKH)
45 Lead Frame 引脚框架 D|)a7_
46 Lead Free 无铅 3pg=9*{
47 level-shift 电平移动 Fvf|m7
48 Line regulation 电源调整率 S=(<m%f
49 load regulation 负载调整率 gVrQAcJj
50 Lot Number 批号 DY -5(6X
51 Low Dropout 低压差 H1I^Vij
52 Miller 密勒 53 node 节点 Jy5sZ}t[
54 Non-Inverting 非反相 baBBn%_V
55 novel 新颖的 B*N1)J\5
56 off state 关断状态 jMgXIK\
57 Operating supply voltage 电源工作电压 Hs*["zFc
58 out drive stage 输出驱动级 ,Cb3R|L8
59 Out of Phase 异相 |~r-VV(=
60 Part Number 产品型号 kk%3 2(By
61 pass transistor pass transistor ;xZjt4M1
62 P-channel MOSFET P沟道MOSFET '`3#FCg
63 Phase margin 相位裕度 )rq |t9kix
64 Phase Node 开关节点 C,An\lsT
65 portable electronics 便携式电子设备 yEq7ueJ'
66 power down 掉电 &E_a0*)e
67 Power Good 电源正常 )V\@N*L`ik
68 Power Groud 功率地 7
!$[XD
69 Power Save Mode 节电模式 h:nybLw?
70 Power up 上电 7~ PL8
71 pull down 下拉 p&h?p\IF
72 pull up 上拉 b,Oh8O;>
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) qx t0Jr8
74 push pull converter 推挽转换器 Iko]c_W0
75 ramp down 斜降 ]K"&Vd
76 ramp up 斜升 |'q%9#
77 redundant diode 冗余二极管 fbNzRXw
78 resistive divider 电阻分压器 /]_ t->
79 ringing 振 铃 64<;6*
80 ripple current 纹波电流 <eoie6@3
81 rising edge 上升沿 W6&vyOc
82 sense resistor 检测电阻 }(oeNPM8
83 Sequenced Power Supplys 序列电源 x@t?7 o\&
84 shoot-through 直通,同时导通 yO q@w!xz
85 stray inductances. 杂散电感 mHxR4%i5
86 sub-circuit 子电路 lH}KFFbp
87 substrate 基板 m1l6QcT1
88 Telecom 电信 7;s#QqG`I
89 Thermal Information 热性能信息 uh)S;3|
90 thermal slug 散热片 98>GHl'lM
91 Threshold 阈值 xG9Sk
92 timing resistor 振荡电阻 i"WYcF|
93 Top FET Top FET k, HC"?K
94 Trace 线路,走线,引线 {FNkPX
95 Transfer function 传递函数 ']r8q %
96 Trip Point 跳变点 0NXH449I=
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) J@s>Pe)
98 Under Voltage Lock Out (UVLO) 欠压锁定 Y{p$%
99 Voltage Reference 电压参考 *\sPHz.
100 voltage-second product 伏秒积 Y@Uk P+{f=
101 zero-pole frequency compensation 零极点频率补偿 zx3gz7>k;
102 beat frequency 拍频 CL|/I:%0
103 one shots 单击电路 |'Fe?~P`
104 scaling 缩放 V'Gal`
105 ESR 等效串联电阻 [Page] R4m{D
106 Ground 地电位 0!T`.UMI
107 trimmed bandgap 平衡带隙 @^P^-B
108 dropout voltage 压差 hF%M!otcJ-
109 large bulk capacitance 大容量电容 GJ+ ^t
110 circuit breaker 断路器 !%iHJwS#
111 charge pump 电荷泵 E/P~HE{
112 overshoot 过冲 `(e :H
M+)a6g e
印制电路printed circuit )cqD"> vs
印制线路 printed wiring l8\UO<^fY
印制板 printed board t|aV:x
印制板电路 printed circuit board t`Kbm''d[
印制线路板 printed wiring board >f(?Mxh2
印制元件 printed component M]x>u@JH
印制接点 printed contact |9CikLX)7
印制板装配 printed board assembly /jY
u-H+C
板 board J2YQdCL
刚性印制板 rigid printed board B5b:znW2@
挠性印制电路 flexible printed circuit ]&cnc8tC
挠性印制线路 flexible printed wiring fB+L%+mr8
齐平印制板 flush printed board w;z7vN~/O
金属芯印制板 metal core printed board XLNbV?
金属基印制板 metal base printed board ag-A}k>v
多重布线印制板 mulit-wiring printed board ~b f\fPm
塑电路板 molded circuit board H_+n_r*
散线印制板 discrete wiring board Cp8=8N(Xb
微线印制板 micro wire board [q<'ty
积层印制板 buile-up printed board E+f)Zg
:
表面层合电路板 surface laminar circuit XYEwn_Y
埋入凸块连印制板 B2it printed board ^L[:DB{Z
载芯片板 chip on board Nk|cU;?+
埋电阻板 buried resistance board jvzioFCt
母板 mother board iUx\3d,
子板 daughter board OQVrg2A%(
背板 backplane bsIG1&n'T
裸板 bare board >4:d)
键盘板夹心板 copper-invar-copper board }A#IBqf5
动态挠性板 dynamic flex board _P>YG<*"kQ
静态挠性板 static flex board ;_<R +w3-
可断拼板 break-away planel K7
e~%mY
电缆 cable 5xQ-f
挠性扁平电缆 flexible flat cable (FFC) | f#wbw
薄膜开关 membrane switch rQ;w{8J\t
混合电路 hybrid circuit dmFn0J-\
厚膜 thick film \Wbmmd}8
厚膜电路 thick film circuit L P<A q
薄膜 thin film ?#xl3Z ;I
薄膜混合电路 thin film hybrid circuit QV;o9j
互连 interconnection e#"h@kZP
导线 conductor trace line 2MkrVQQ9g
齐平导线 flush conductor qQ@| Cj
传输线 transmission line / f%mYL
跨交 crossover @/2Kfr
板边插头 edge-board contact 9T,/R1N8
增强板 stiffener Cux(v8=n
基底 substrate P3M$&::D-
基板面 real estate !Ok(mgV$/
导线面 conductor side )*')
元件面 component side JF~i.+{h
焊接面 solder side Up9{aX
导电图形 conductive pattern ^^y eC|~N:
非导电图形 non-conductive pattern c_lHj#A(l
基材 base material v^|U?
层压板 laminate jHLs
5%
覆金属箔基材 metal-clad bade material 5&]5*;Bv J
覆铜箔层压板 copper-clad laminate (CCL) 4aW@c<-r?
复合层压板 composite laminate m[hL
GD'Fi
薄层压板 thin laminate IqOg{#sm
基体材料 basis material 2
$>DX\h
预浸材料 prepreg 12$0-@U
粘结片 bonding sheet 8@3K, [Mo
预浸粘结片 preimpregnated bonding sheer QY\k3hiqn
环氧玻璃基板 epoxy glass substrate JA^o/%a^
预制内层覆箔板 mass lamination panel rK3kg2H
内层芯板 core material PEMkx"h +
粘结层 bonding layer ! 'zd(kv<
粘结膜 film adhesive c-Lz luWi
无支撑胶粘剂膜 unsupported adhesive film ?gH[la
覆盖层 cover layer (cover lay) hor7~u+
增强板材 stiffener material fFQ|dE;cF
铜箔面 copper-clad surface 7"(!]+BW!O
去铜箔面 foil removal surface m[DQ;`Y
层压板面 unclad laminate surface _Q V=3UWP
基膜面 base film surface +WX/4_STV
胶粘剂面 adhesive faec "c^! LV
原始光洁面 plate finish N0`9/lr|
粗面 matt finish SzULy
>e
剪切板 cut to size panel AGBV7Kk
超薄型层压板 ultra thin laminate )G[byBa
A阶树脂 A-stage resin m</m9h8
B阶树脂 B-stage resin {U4!sJSl1
C阶树脂 C-stage resin UwN Vvo
环氧树脂 epoxy resin W4^L_p>Tm^
酚醛树脂 phenolic resin j,IRUx13f
聚酯树脂 polyester resin n<?U6~F&~
聚酰亚胺树脂 polyimide resin ]5%0EE64
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin ^r}c&@
丙烯酸树脂 acrylic resin STKL
三聚氰胺甲醛树脂 melamine formaldehyde resin Zxk~X}K\P
多官能环氧树脂 polyfunctional epoxy resin FO{=^I5YA
溴化环氧树脂 brominated epoxy resin C.j+Zb1Z(
环氧酚醛 epoxy novolac \#sD`O
氟树脂 fluroresin 2"/MM2s
硅树脂 silicone resin OL'Ito
硅烷 silane JK,MK|
聚合物 polymer n#_B4UqW%
无定形聚合物 amorphous polymer hpdI5
结晶现象 crystalline polamer 8|&,JdT
双晶现象 dimorphism 7h'
C"rH
共聚物 copolymer ChBf:`e
合成树脂 synthetic F.s$Y+c!6
热固性树脂 thermosetting resin [Page] 8R~<$xz
热塑性树脂 thermoplastic resin XF`2*:7
感光性树脂 photosensitive resin ,p2UshOmd
环氧值 epoxy value _,3ljf?WQM
双氰胺 dicyandiamide _H] \
粘结剂 binder 1{uxpYAP=
胶粘剂 adesive 4.A^5J'W
固化剂 curing agent # :+Nr
阻燃剂 flame retardant 5epI'D
遮光剂 opaquer mh+T!v$[n)
增塑剂 plasticizers UmKE]1Yw4r
不饱和聚酯 unsatuiated polyester L!f~Am:#
聚酯薄膜 polyester Bfb~<rs[
聚酰亚胺薄膜 polyimide film (PI) }U]jy
聚四氟乙烯 polytetrafluoetylene (PTFE) ,05PYBc3
增强材料 reinforcing material c
r=Q39{
折痕 crease pwSgFc$z
云织 waviness f-U zFlU
鱼眼 fish eye )W\)37=.
毛圈长 feather length uHbg&eW
厚薄段 mark n,T
&n
裂缝 split H4M=&"ll}
捻度 twist of yarn s.1F=u9a
浸润剂含量 size content 7w
)?s@CD
浸润剂残留量 size residue S!K<kn`E3
处理剂含量 finish level 0aT:Gy;
偶联剂 couplint agent =4TQ*;V:
断裂长 breaking length ~M~DH-aX
吸水高度 height of capillary rise z']6C9m}
湿强度保留率 wet strength retention aZZ0eH
白度 whitenness 1UQ,V`y
导电箔 conductive foil /*C!]Z>.
铜箔 copper foil &YFe"C
压延铜箔 rolled copper foil S2X@t>u-
光面 shiny side xd?=#d
粗糙面 matte side !Uiq3s`1T
处理面 treated side Va!G4_OT
防锈处理 stain proofing n%Oi~7>
双面处理铜箔 double treated foil *qpFtBg
模拟 simulation jUT`V
ZK4&
逻辑模拟 logic simulation hqRC:p#9
电路模拟 circit simulation
zAB= >v
时序模拟 timing simulation ?mMM{{%(.
模块化 modularization lpi"@3
设计原点 design origin h!tpi`8\z
优化(设计) optimization (design) P"c@V,.
供设计优化坐标轴 predominant axis kBP?_ O
表格原点 table origin .AN1Yt
元件安置 component positioning MqJTRBs%
比例因子 scaling factor &5
7c!)
扫描填充 scan filling V|Bwle
矩形填充 rectangle filling l|q-kRRjn
填充域 region filling x,nl PU
实体设计 physical design Mi]^wCF
逻辑设计 logic design F .S^KK
逻辑电路 logic circuit r8"2C#
层次设计 hierarchical design bvD}N<>3N
自顶向下设计 top-down design `wa;@p+j8
自底向上设计 bottom-up design [kg^S`gc#
费用矩阵 cost metrix coCT]<
元件密度 component density 8Z!%rS
自由度 degrees freedom 08\w!!a:
出度 out going degree 9]Jv
>_W*
入度 incoming degree eA N{BPN[
曼哈顿距离 manhatton distance 1zRYd`IPoq
欧几里德距离 euclidean distance $yU
5WEX
网络 network 7U7!'xU
阵列 array 5V 2ZAYV
段 segment zk<V0NJIL*
逻辑 logic #91^1jyMf
逻辑设计自动化 logic design automation Tm^kZuT{
分线 separated time l/3=o}8q
分层 separated layer bo<P%$(D
定顺序 definite sequence *VsGa<V
导线(通道) conduction (track) _DxHJl
导线(体)宽度 conductor width -k + jMH
导线距离 conductor spacing hh4R
导线层 conductor layer ?22U0UF
导线宽度/间距 conductor line/space cr;:5D%_
第一导线层 conductor layer No.1 aEdA'>
圆形盘 round pad K/9Jx(I,qL
方形盘 square pad ]x)!Kd2>
菱形盘 diamond pad Hn >VPz+I
长方形焊盘 oblong pad "U^m~N9k{
子弹形盘 bullet pad rp\`uj*D
泪滴盘 teardrop pad RB4n>&Y
雪人盘 snowman pad HGAi2+&
形盘 V-shaped pad V he(K
环形盘 annular pad {|>'(iqH"w
非圆形盘 non-circular pad '( I0VJJ
隔离盘 isolation pad wa<k%_# M
非功能连接盘 monfunctional pad -]wEk%j
偏置连接盘 offset land 3;buC|ky
腹(背)裸盘 back-bard land Q u2
~wp<
盘址 anchoring spaur e-*@R#x8+
连接盘图形 land pattern {9(0s| pr
连接盘网格阵列 land grid array gcnX^[`S
孔环 annular ring .@): Uh
元件孔 component hole %GTFub0F
安装孔 mounting hole #b/L~Bw[
支撑孔 supported hole mrr]{K
非支撑孔 unsupported hole a0hBF4+6
导通孔 via q\@_L.tc[
镀通孔 plated through hole (PTH) &|Wqzdo?#
余隙孔 access hole %}(`?
盲孔 blind via (hole) $y6 <2w%b
埋孔 buried via hole A|LO!P,w
埋,盲孔 buried blind via n
UmyPQ~
任意层内部导通孔 any layer inner via hole I?Iz5e-
全部钻孔 all drilled hole -E1-(TS
定位孔 toaling hole WzstO}?P(
无连接盘孔 landless hole |8f }3R 9
中间孔 interstitial hole ,c:NdY(,)
无连接盘导通孔 landless via hole )!v"(i.5Xo
引导孔 pilot hole ~*bfS}F8I
端接全隙孔 terminal clearomee hole 7d
R?70Sz
准尺寸孔 dimensioned hole [Page] P@PF"{S
在连接盘中导通孔 via-in-pad O:#YLmbCN
孔位 hole location |K_%]1*riC
孔密度 hole density i{m!v6j:
孔图 hole pattern |kK5:\H
钻孔图 drill drawing $F^VtCx2&
装配图assembly drawing H?O5 "4a
参考基准 datum referan t$du|q(
1) 元件设备 Uj;JN}k
O)`L(
x
三绕组变压器:three-column transformer ThrClnTrans Xk.OyQ@
双绕组变压器:double-column transformer DblClmnTrans ;@=3
@v
电容器:Capacitor |l8=z*v<