1 backplane 背板 rLzW`
2 Band gap voltage reference 带隙电压参考 Lc]1$
3 benchtop supply 工作台电源 u]M\3V.
4 Block Diagram 方块图 5 Bode Plot 波特图 zsVcXBz
6 Bootstrap 自举 >3PMnI
7 Bottom FET Bottom FET @7W?8
8 bucket capcitor 桶形电容 6\n?48x}
9 chassis 机架 >b48>@~bY
10 Combi-sense Combi-sense j;\[pg MR/
11 constant current source 恒流源
$:EG%jl
12 Core Sataration 铁芯饱和 ^=+e?F`:{
13 crossover frequency 交叉频率 "|t!7hC
14 current ripple 纹波电流 G;s"h%Xw98
15 Cycle by Cycle 逐周期 =K(JqSw+M
16 cycle skipping 周期跳步 #{*LvI&
17 Dead Time 死区时间 c-B/~&
18 DIE Temperature 核心温度 fu R2S70d
19 Disable 非使能,无效,禁用,关断 Y:psZ
20 dominant pole 主极点 ?pG/m%[
21 Enable 使能,有效,启用 VEs5;]#<2D
22 ESD Rating ESD额定值 yMxTfR
23 Evaluation Board 评估板 {eQWO.C{
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. %;|0
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 W~ruN4q.
25 Failling edge 下降沿 YQd:M%$
26 figure of merit 品质因数 P:k+ y$
27 float charge voltage 浮充电压 89HsPB1"t
28 flyback power stage 反驰式功率级 3^wC<ZXcD
29 forward voltage drop 前向压降 S6sq#kcH
30 free-running 自由运行 opp!0:jS*
31 Freewheel diode 续流二极管 q3h'l,
32 Full load 满负载 33 gate drive 栅极驱动 x[i `S8D
34 gate drive stage 栅极驱动级 +Gh7^v|"
35 gerber plot Gerber 图 %
frfSGf.#
36 ground plane 接地层 Ew$I\j*
37 Henry 电感单位:亨利 -RMi8{
38 Human Body Model 人体模式 <)U4Xz ?
39 Hysteresis 滞回 U| 5-0 u5
40 inrush current 涌入电流 6BAW
41 Inverting 反相 fS=hpL6]@
42 jittery 抖动 (Rd$VYuf
43 Junction 结点 qP1FJ89H
44 Kelvin connection 开尔文连接 ;Vu5p#,O<M
45 Lead Frame 引脚框架 41Ve}%
46 Lead Free 无铅 P^)q=A8Z#
47 level-shift 电平移动 (=
;N{u
48 Line regulation 电源调整率 ;Ii1B{W
49 load regulation 负载调整率 %j+xgX/&
50 Lot Number 批号 ub K7B |p
51 Low Dropout 低压差 fU+Pn@'
52 Miller 密勒 53 node 节点 [L(hG a
54 Non-Inverting 非反相 nxo+?:**
55 novel 新颖的
t ls60h
56 off state 关断状态 X.FGBR7=q
57 Operating supply voltage 电源工作电压 FN^FvQ
58 out drive stage 输出驱动级 ynwG\V
59 Out of Phase 异相 :iUF7P1I
60 Part Number 产品型号 X}A'Cg0y
61 pass transistor pass transistor _[h8P9YI4
62 P-channel MOSFET P沟道MOSFET o:p
*_>&
63 Phase margin 相位裕度 /4irAG% Oj
64 Phase Node 开关节点 ](jFwxU
65 portable electronics 便携式电子设备 yj_4gxJ\
66 power down 掉电 tTanW2C
67 Power Good 电源正常 1AD]v<M
68 Power Groud 功率地 j/!H$0PN
69 Power Save Mode 节电模式 J'T=q/
70 Power up 上电 DAO]uh{6
71 pull down 下拉 *rh,"Zo
72 pull up 上拉 ZH 6\><My
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) jZ*WN|FK?
74 push pull converter 推挽转换器 |j~lkzPnV
75 ramp down 斜降 kg97S
76 ramp up 斜升 j\&pej
77 redundant diode 冗余二极管 I]`-|Q E
78 resistive divider 电阻分压器 7'lZg<z{~j
79 ringing 振 铃 `3_lI~=eH
80 ripple current 纹波电流 aSutM
81 rising edge 上升沿 Ond'R'3 \E
82 sense resistor 检测电阻 9jir*UI
83 Sequenced Power Supplys 序列电源 >QkP7Kb
84 shoot-through 直通,同时导通 98XVa\|tl
85 stray inductances. 杂散电感 Z u*K-ep"
86 sub-circuit 子电路 #q\x$
87 substrate 基板 %;xOB^H^
88 Telecom 电信 5Wx~ZQZ
89 Thermal Information 热性能信息 r' Z3
90 thermal slug 散热片 +-?/e-z")
91 Threshold 阈值 U9hS<}<Ki
92 timing resistor 振荡电阻 |a^U]
93 Top FET Top FET 4=8QZf0\
94 Trace 线路,走线,引线 /8'S1!zc
95 Transfer function 传递函数 uBrMk
96 Trip Point 跳变点 @R|'X
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 0%`4px4J
98 Under Voltage Lock Out (UVLO) 欠压锁定 Di.3113t
99 Voltage Reference 电压参考 %/%UX{8R
100 voltage-second product 伏秒积 l@Z6do
101 zero-pole frequency compensation 零极点频率补偿 Q>< 0[EPj3
102 beat frequency 拍频 *Mc7f ?H
103 one shots 单击电路 yR5XJ;Tct
104 scaling 缩放 Ol_q{^
105 ESR 等效串联电阻 [Page] "/{RhY<
106 Ground 地电位 XRN+`J
107 trimmed bandgap 平衡带隙 2BXy<BM @
108 dropout voltage 压差 3>M&D20Z
109 large bulk capacitance 大容量电容 )FN;+"IJ
110 circuit breaker 断路器 O`1!
111 charge pump 电荷泵 ,MPB/j^o5!
112 overshoot 过冲 (.Y/
26?W
nu60
印制电路printed circuit I{'f|+1
印制线路 printed wiring xgu `Q`~
印制板 printed board zw<p74DH
印制板电路 printed circuit board qFX~[h8i+
印制线路板 printed wiring board K kW;-{c
印制元件 printed component 9LnN$e
印制接点 printed contact Oc].@Jy
印制板装配 printed board assembly pW0dB_
板 board Xr63?N
刚性印制板 rigid printed board -/C)l)V}
挠性印制电路 flexible printed circuit ^g1f X1
挠性印制线路 flexible printed wiring R:-JkV>e:
齐平印制板 flush printed board >I
金属芯印制板 metal core printed board )4U>!KrY
金属基印制板 metal base printed board O%~jop7#6
多重布线印制板 mulit-wiring printed board dCe4u<so\
塑电路板 molded circuit board [H\:pP8t
散线印制板 discrete wiring board Zv_.na/^K
微线印制板 micro wire board .MW@;
积层印制板 buile-up printed board V-I(WzR9y
表面层合电路板 surface laminar circuit B&+`)E{KB
埋入凸块连印制板 B2it printed board _\PNr.D8
载芯片板 chip on board X:a`B(@S
埋电阻板 buried resistance board FsB^CxVg
母板 mother board )Au6Nf
子板 daughter board l.\re"Q
背板 backplane P7ph}mB
裸板 bare board \;-fi.Hrf$
键盘板夹心板 copper-invar-copper board "\Egs)\
动态挠性板 dynamic flex board h)1qp Qj
静态挠性板 static flex board oRKEJNps
可断拼板 break-away planel )#a[-.OI
电缆 cable <Llp\XcZ
挠性扁平电缆 flexible flat cable (FFC) M<SdPC(+
薄膜开关 membrane switch \\BCcr\l
混合电路 hybrid circuit Y={&5Mir
厚膜 thick film ,uw132<b
厚膜电路 thick film circuit o-xDh7v
薄膜 thin film x:vu'A
薄膜混合电路 thin film hybrid circuit <2!v(EkI
互连 interconnection 6C>_a*w
导线 conductor trace line ZKQ hbNT
齐平导线 flush conductor Ftw;Yz
传输线 transmission line i,V;xB2
跨交 crossover wxm:7$4C
板边插头 edge-board contact -yGDh+-
增强板 stiffener R1F5-#?'E
基底 substrate 6{[pou&
基板面 real estate _A<u#.yd
导线面 conductor side a9n^WOJ6
元件面 component side VL[R(a6c
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焊接面 solder side ;fw1
导电图形 conductive pattern x}U8zt)yD3
非导电图形 non-conductive pattern Wv__ wZ
基材 base material ve
~05mg
层压板 laminate mrm^e9*Z
覆金属箔基材 metal-clad bade material $F.([?)k?
覆铜箔层压板 copper-clad laminate (CCL) J};z85B
复合层压板 composite laminate d=,%=@
薄层压板 thin laminate 2,lqsd:xM
基体材料 basis material LG~S8u
预浸材料 prepreg ZpUCfS)|&
粘结片 bonding sheet 7 r|(}S
预浸粘结片 preimpregnated bonding sheer ^gVT$A
环氧玻璃基板 epoxy glass substrate c4_`Ew^k
预制内层覆箔板 mass lamination panel P5lqSA{6
内层芯板 core material iv phlw
粘结层 bonding layer t9&cE:n
粘结膜 film adhesive zkTp`>9R
无支撑胶粘剂膜 unsupported adhesive film #j@71]GI
覆盖层 cover layer (cover lay) :Rs^0F8)c
增强板材 stiffener material Xtwun
铜箔面 copper-clad surface %Pksv}
去铜箔面 foil removal surface i"|$(2
层压板面 unclad laminate surface 0-LpqX
基膜面 base film surface {]z4k[;.h
胶粘剂面 adhesive faec %/>xO3"T
原始光洁面 plate finish \4"S7.% |
粗面 matt finish {;2vmx9
剪切板 cut to size panel "cTncL
超薄型层压板 ultra thin laminate e4~>G?rM_
A阶树脂 A-stage resin }HE6aF62O
B阶树脂 B-stage resin :'aAZegQY
C阶树脂 C-stage resin LZ@|9!KDw
环氧树脂 epoxy resin {0! ~C=P
酚醛树脂 phenolic resin `mye}L2I
聚酯树脂 polyester resin Cf B.ZT
聚酰亚胺树脂 polyimide resin H+
h07\?
%
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin GE>[*zN
丙烯酸树脂 acrylic resin 9N%JP+<89
三聚氰胺甲醛树脂 melamine formaldehyde resin mMMQ|ea
多官能环氧树脂 polyfunctional epoxy resin %{6LUn
溴化环氧树脂 brominated epoxy resin <p;k)S2J
环氧酚醛 epoxy novolac Hi_G
氟树脂 fluroresin 'qdPw%d
硅树脂 silicone resin K[chjp!$l
硅烷 silane 47r_y\U h
聚合物 polymer jGrN\D?h
无定形聚合物 amorphous polymer .To;"D;j,
结晶现象 crystalline polamer g*w<*
双晶现象 dimorphism FgL,k
共聚物 copolymer Jc)^49Rf
合成树脂 synthetic 65ly2gl
热固性树脂 thermosetting resin [Page] ;n\= R 5.
热塑性树脂 thermoplastic resin r_EcMIuk
感光性树脂 photosensitive resin 9dMrgz&'
环氧值 epoxy value y2O4I'/5<
双氰胺 dicyandiamide |*RYq2y
粘结剂 binder p;?*}xa
胶粘剂 adesive 3:%QB9qc]'
固化剂 curing agent LQnkcV
阻燃剂 flame retardant bqanFQj
遮光剂 opaquer #d{=\$=
增塑剂 plasticizers iqnJ~g
不饱和聚酯 unsatuiated polyester %p&k5:4<"#
聚酯薄膜 polyester ~x{.jn
聚酰亚胺薄膜 polyimide film (PI) &'l>rD^o
聚四氟乙烯 polytetrafluoetylene (PTFE) zi~5l#I
增强材料 reinforcing material $8l({:*q0
折痕 crease `[zQf
云织 waviness pf4 ^Bk}e
鱼眼 fish eye iut`7
毛圈长 feather length P,ua<B}L
厚薄段 mark ]]}tdn _
裂缝 split t>B^q3\q?
捻度 twist of yarn uS&|"*pR
浸润剂含量 size content }FF W|f
浸润剂残留量 size residue B=
keBO](@
处理剂含量 finish level 2cu#lMq
偶联剂 couplint agent xUF_1hY
断裂长 breaking length ;X ,1I
吸水高度 height of capillary rise
5-)#f?
湿强度保留率 wet strength retention tweY'x.{
白度 whitenness _WX#a|4h{
导电箔 conductive foil s<x1>Q7X~
铜箔 copper foil /S:F)MO9
压延铜箔 rolled copper foil )m3q2W
光面 shiny side M.h`&8
粗糙面 matte side @?C#r.vgp
处理面 treated side rzp +:
防锈处理 stain proofing z9W`FBg
双面处理铜箔 double treated foil HaA1z}?n
模拟 simulation Y+/JsOD
逻辑模拟 logic simulation `ovtHl3Q
电路模拟 circit simulation \b[9ebME
时序模拟 timing simulation yV)m"j
模块化 modularization ,wwZI`>-
设计原点 design origin ~-a'v!
优化(设计) optimization (design) W:i?t8y\y
供设计优化坐标轴 predominant axis k\Q,h75
表格原点 table origin >-E<