1 backplane 背板 8s8q`_.)(
2 Band gap voltage reference 带隙电压参考 _wM[U`H}s
3 benchtop supply 工作台电源 H*|Bukgt/M
4 Block Diagram 方块图 5 Bode Plot 波特图 nL^6{I~
6 Bootstrap 自举 |NtT-T)7
7 Bottom FET Bottom FET #Vn=(U4}!_
8 bucket capcitor 桶形电容 23+6u{
9 chassis 机架 : ` F>B
10 Combi-sense Combi-sense fFXs:(
11 constant current source 恒流源 oD{V_/pdx
12 Core Sataration 铁芯饱和 /Re1QS
13 crossover frequency 交叉频率 &\sg~
14 current ripple 纹波电流 $$ _ uQf
15 Cycle by Cycle 逐周期 ThWZ>hyJ
16 cycle skipping 周期跳步 i )3Y\u
17 Dead Time 死区时间 f;u;hQxs
18 DIE Temperature 核心温度 WbH/K]/1)h
19 Disable 非使能,无效,禁用,关断 %n}fkj'
20 dominant pole 主极点 z('93vsO
21 Enable 使能,有效,启用 &%u,b~cL?
22 ESD Rating ESD额定值 c}Z,xop<P{
23 Evaluation Board 评估板 1I3u~J3]/
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. yF0,}
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 Si]Z `_
25 Failling edge 下降沿 N_pJE?
26 figure of merit 品质因数 [%l+
C~m
27 float charge voltage 浮充电压 Qk-y0
28 flyback power stage 反驰式功率级 Zz?+,-$_*&
29 forward voltage drop 前向压降 m_rR e\
30 free-running 自由运行 ' 1P_*
31 Freewheel diode 续流二极管 jn}6yXB
32 Full load 满负载 33 gate drive 栅极驱动 (!X:[Ah*$
34 gate drive stage 栅极驱动级 D{BH~IM
35 gerber plot Gerber 图 Qg6m
36 ground plane 接地层 fil6w</L
37 Henry 电感单位:亨利 Arp4$h
38 Human Body Model 人体模式 DA@
{ d-A
39 Hysteresis 滞回 8QC:ro
40 inrush current 涌入电流 W]Ph:O^5c
41 Inverting 反相 AU'{aC+p
42 jittery 抖动 L6 _Sc-sU
43 Junction 结点 6w1:3~a
44 Kelvin connection 开尔文连接 [c86b
45 Lead Frame 引脚框架 kIWQ`)'
46 Lead Free 无铅 /-|xxy
47 level-shift 电平移动 <Isr
48 Line regulation 电源调整率 kI[EG<N1k
49 load regulation 负载调整率 5,Q('t#J
50 Lot Number 批号 +Z;0"'K'e
51 Low Dropout 低压差 ,+'f unH
52 Miller 密勒 53 node 节点 9 oq(5BG,
54 Non-Inverting 非反相 3"L$*toRA
55 novel 新颖的 7gQt
k
56 off state 关断状态 !Aw.f!
57 Operating supply voltage 电源工作电压 n.1a1 Tf
58 out drive stage 输出驱动级 z0Zl'
59 Out of Phase 异相 ^E:;8h4$9
60 Part Number 产品型号 0e7v ?UT
61 pass transistor pass transistor sJM}p5V
62 P-channel MOSFET P沟道MOSFET T >-F~?7Sv
63 Phase margin 相位裕度 _v$mGZpGY
64 Phase Node 开关节点 t]&n_]`{.
65 portable electronics 便携式电子设备 k2+Z7#2n
66 power down 掉电 A,=l9hE'
67 Power Good 电源正常 *M`[YG19!e
68 Power Groud 功率地 RgRcW5VxK
69 Power Save Mode 节电模式 *v5y]E%aW
70 Power up 上电 /?6y2 t
71 pull down 下拉 6)bfd^JYn
72 pull up 上拉 SfR!q4b=
73 Pulse by Pulse 逐脉冲(Pulse by Pulse)
E;|\?>
74 push pull converter 推挽转换器 G:&Q)_
75 ramp down 斜降 ?b7vc^E&
76 ramp up 斜升 Xs?>6i@$$
77 redundant diode 冗余二极管 \Fe5<G'v
78 resistive divider 电阻分压器 ?t%5 /
79 ringing 振 铃 bFJn-g n
80 ripple current 纹波电流 hOC,Eo
81 rising edge 上升沿 :8QG$Ua1
82 sense resistor 检测电阻 b~~}(^Bg
83 Sequenced Power Supplys 序列电源 oDP|>yXC)
84 shoot-through 直通,同时导通 bQeYFY#^
85 stray inductances. 杂散电感 s3knh&'zb
86 sub-circuit 子电路 .LS.Z
4@
87 substrate 基板 _j2`#|oG
88 Telecom 电信 SMy&K[hJ[
89 Thermal Information 热性能信息 V('b|gsEo
90 thermal slug 散热片 [a
Z)*L
;
91 Threshold 阈值 QMsnfG
92 timing resistor 振荡电阻 EXi+pm
93 Top FET Top FET a&cV@~
94 Trace 线路,走线,引线 rLXn35O
95 Transfer function 传递函数 h7w<.zwu
t
96 Trip Point 跳变点 TDseWdA
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) .5z|g@
6
98 Under Voltage Lock Out (UVLO) 欠压锁定 tsa6: D
99 Voltage Reference 电压参考 u,]yd*
100 voltage-second product 伏秒积 oy'+n-
101 zero-pole frequency compensation 零极点频率补偿 xSUR<
102 beat frequency 拍频 />oU}m"k
103 one shots 单击电路 NR [VGZj
104 scaling 缩放 R.QcXz?d
105 ESR 等效串联电阻 [Page] Jzj~uz
106 Ground 地电位 JU6np 4
107 trimmed bandgap 平衡带隙 p?h;Sv/
108 dropout voltage 压差 @rF\6I
109 large bulk capacitance 大容量电容 YsDl2P
110 circuit breaker 断路器 >fdN`W}M
111 charge pump 电荷泵 &ar}6eO
112 overshoot 过冲 ;wF|.^_2
tv{.iM|V c
印制电路printed circuit sDC RL%0QK
印制线路 printed wiring {+EPE2X=C
印制板 printed board 2=|IOkY
印制板电路 printed circuit board n"
~*9'
印制线路板 printed wiring board ,ym;2hJ
印制元件 printed component M}<=~/k`j
印制接点 printed contact |{nI.>
印制板装配 printed board assembly y{sA[ "
板 board {?iqO?
刚性印制板 rigid printed board buFtLPe
挠性印制电路 flexible printed circuit :6 fQE#(s&
挠性印制线路 flexible printed wiring ,+RO 5n
齐平印制板 flush printed board r?TK@^z
金属芯印制板 metal core printed board *X #e
金属基印制板 metal base printed board ._3NqE;
多重布线印制板 mulit-wiring printed board Dfo9jYPf
塑电路板 molded circuit board Gpu?z-)
散线印制板 discrete wiring board YMd&+J`
微线印制板 micro wire board $^!w`>0C
积层印制板 buile-up printed board @FV;5M:I
表面层合电路板 surface laminar circuit yd~fC:_ ]
埋入凸块连印制板 B2it printed board B@=<'/S\7
载芯片板 chip on board E0Djo'64
埋电阻板 buried resistance board 12a #]E
母板 mother board d/&|%Z
r
子板 daughter board B,>Fh X>h
背板 backplane <&2,G5XA
裸板 bare board pYG,5+g
键盘板夹心板 copper-invar-copper board D2p6&HNT
动态挠性板 dynamic flex board ^IH1@
静态挠性板 static flex board {p
0'Lc<3n
可断拼板 break-away planel >B
电缆 cable aC:l;
挠性扁平电缆 flexible flat cable (FFC) nS4S[|w"
薄膜开关 membrane switch 8tMte!E
混合电路 hybrid circuit 02[II_< 1
厚膜 thick film ArYF\7P
厚膜电路 thick film circuit Y ,yaB)&Ih
薄膜 thin film o}A #-
薄膜混合电路 thin film hybrid circuit ~S6 {VK.
互连 interconnection T6$<o\g'
导线 conductor trace line D3xaR
齐平导线 flush conductor ;vdgF
传输线 transmission line LDeVNVM
跨交 crossover E+zn\v
板边插头 edge-board contact .M2&ad :
增强板 stiffener SZ{cno1`
基底 substrate GuWBl$|+b
基板面 real estate @3 c#\jx
导线面 conductor side dA/o4co
元件面 component side 4d
G-
焊接面 solder side "}p?pF<'0
导电图形 conductive pattern }!V<"d,!
非导电图形 non-conductive pattern 9Oyi:2A
基材 base material i(;-n_:,`
层压板 laminate >;v0zE
覆金属箔基材 metal-clad bade material N RSse"
覆铜箔层压板 copper-clad laminate (CCL) 03WRj+w
复合层压板 composite laminate ~4MjJKzA
薄层压板 thin laminate OeGuq.>w
基体材料 basis material W;dzLgc
预浸材料 prepreg [E
(M(w':
粘结片 bonding sheet X#,[2&17Fh
预浸粘结片 preimpregnated bonding sheer \C#b@xLnX
环氧玻璃基板 epoxy glass substrate MIF[u:&
预制内层覆箔板 mass lamination panel -_DiD^UcXn
内层芯板 core material $S8bp3)
粘结层 bonding layer kZ-~
;fBe
粘结膜 film adhesive BJxmW's/
无支撑胶粘剂膜 unsupported adhesive film r/sRXM:3cZ
覆盖层 cover layer (cover lay) !a(qqZ|s
增强板材 stiffener material *9Js:z7I
铜箔面 copper-clad surface S\g7wXH
去铜箔面 foil removal surface <S@mQJS!y
层压板面 unclad laminate surface HcVs(]tIW
基膜面 base film surface B4Af
胶粘剂面 adhesive faec ,
)pt_"-XA
原始光洁面 plate finish D.R|HqZ
粗面 matt finish efkie}
剪切板 cut to size panel [pgkY!R?)
超薄型层压板 ultra thin laminate G!LNP&~
A阶树脂 A-stage resin Pq\V($gN
B阶树脂 B-stage resin R
4QwWSBJ
C阶树脂 C-stage resin soQzIx
环氧树脂 epoxy resin ;
9&.QR(
酚醛树脂 phenolic resin {R!TUQ5
聚酯树脂 polyester resin *Gh8nQbh
聚酰亚胺树脂 polyimide resin A;j$rGx
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin #u5;utY:F
丙烯酸树脂 acrylic resin k=~pA iRDN
三聚氰胺甲醛树脂 melamine formaldehyde resin D3AtYt
多官能环氧树脂 polyfunctional epoxy resin _&Uo|T
溴化环氧树脂 brominated epoxy resin PSqtZN
环氧酚醛 epoxy novolac 5YG@[ic
氟树脂 fluroresin 2j/1@Z1j=
硅树脂 silicone resin '`~(Fkj
硅烷 silane UH,4b`b
聚合物 polymer P}WhE
无定形聚合物 amorphous polymer xVz -_z
结晶现象 crystalline polamer 2X;0z$
双晶现象 dimorphism ]#-/i2-K
共聚物 copolymer [(P[qEY
合成树脂 synthetic V?V)&y] 4
热固性树脂 thermosetting resin [Page] RQ)!KlY
热塑性树脂 thermoplastic resin KYmWfM3^
感光性树脂 photosensitive resin Z=Y_;dS9
环氧值 epoxy value z0Z\d
双氰胺 dicyandiamide 0e:QuV2X
粘结剂 binder 9s6>9hMb)
胶粘剂 adesive `_g?y)
固化剂 curing agent L!b0y7yR
阻燃剂 flame retardant C|~JPcl
遮光剂 opaquer VRQbf
增塑剂 plasticizers JU=\]E@8c
不饱和聚酯 unsatuiated polyester "G-0i KW;
聚酯薄膜 polyester L[D/#0qp
聚酰亚胺薄膜 polyimide film (PI)
vD)A)
聚四氟乙烯 polytetrafluoetylene (PTFE) x [{q&N!"`
增强材料 reinforcing material zEPx
折痕 crease Fb{`a[&
云织 waviness 23\j1?
鱼眼 fish eye N4` 9TN7
毛圈长 feather length _Dcc<-.
厚薄段 mark z Jo#3
裂缝 split At[n<8_|
捻度 twist of yarn Va/@#=,q]
浸润剂含量 size content ",aT<lw.
浸润剂残留量 size residue ! N"L`RWD
处理剂含量 finish level Ubw!/|mi
偶联剂 couplint agent ?<yq 2`\4O
断裂长 breaking length Puth8$
吸水高度 height of capillary rise K@j^gF/0B
湿强度保留率 wet strength retention v1X&p\[d
白度 whitenness zmL~]!~&
导电箔 conductive foil DvRA2(M
铜箔 copper foil 6PQJgki
压延铜箔 rolled copper foil mcz(,u}
光面 shiny side =6Kv`
粗糙面 matte side 4<3?al&
处理面 treated side {7Gx9(
防锈处理 stain proofing x,w`OMQ}c
双面处理铜箔 double treated foil |<$<L`xoe
模拟 simulation X4P}aC
逻辑模拟 logic simulation :9x084ESR)
电路模拟 circit simulation FG;<`4mY
时序模拟 timing simulation .y;\puNq
模块化 modularization e0|_Z])D
设计原点 design origin ~g
K-5}%!
优化(设计) optimization (design) WDoKbTv
供设计优化坐标轴 predominant axis mSw?2ba
表格原点 table origin /:Z~"Q*r
元件安置 component positioning =_?pOq
比例因子 scaling factor y[^k*,=
9
扫描填充 scan filling 6Bq~\b^
矩形填充 rectangle filling
,3J`ftCV
填充域 region filling }4\!7]FVYX
实体设计 physical design &Xn8oe
逻辑设计 logic design #E$Z[G]
逻辑电路 logic circuit z3vsz
层次设计 hierarchical design =;k+g?.@I
自顶向下设计 top-down design _@BRpLs:4
自底向上设计 bottom-up design Hlt8al3
费用矩阵 cost metrix %eutfM-?6
元件密度 component density kY'<u
自由度 degrees freedom 6HEqm>Yau
出度 out going degree ;Txv-lfS
入度 incoming degree )O2Nlk~l&
曼哈顿距离 manhatton distance j*eUF-J1
欧几里德距离 euclidean distance =$)4:
网络 network `\ W
阵列 array Z92iil;t
段 segment )y%jLiQv
逻辑 logic O:5Rp_?^
逻辑设计自动化 logic design automation *%OYAsc
分线 separated time O2`oe4."vd
分层 separated layer n2xLgK=
定顺序 definite sequence (<bm4MPf
导线(通道) conduction (track) |2
YubAIZ(
导线(体)宽度 conductor width F}6DB*
导线距离 conductor spacing #hD}S~
导线层 conductor layer {uaZ<4N.
导线宽度/间距 conductor line/space Yo~LckFF
第一导线层 conductor layer No.1 rP^TN^bd|
圆形盘 round pad G%P>Ag
方形盘 square pad )h>\05|T
菱形盘 diamond pad 7K>D@O
长方形焊盘 oblong pad L25kh}Q#7
子弹形盘 bullet pad
#gW /qJ
泪滴盘 teardrop pad k#axt
Sc
雪人盘 snowman pad h&=O-5
形盘 V-shaped pad V (~j,mk
环形盘 annular pad mQd4#LJ_
非圆形盘 non-circular pad ]>R`;"(
隔离盘 isolation pad aN^]bs?R
非功能连接盘 monfunctional pad *#&k+{a^2
偏置连接盘 offset land qj~flw1:
腹(背)裸盘 back-bard land >lD;0EN
盘址 anchoring spaur h4hN1<ky\
连接盘图形 land pattern K3vseor
连接盘网格阵列 land grid array z-EwXE
孔环 annular ring X,C*qw@
元件孔 component hole YSR mt/
安装孔 mounting hole sU) TXL'_!
支撑孔 supported hole (C8 U
非支撑孔 unsupported hole
]pW86L%
导通孔 via H~A"C'P3#
镀通孔 plated through hole (PTH) d]tv'|E13
余隙孔 access hole "w}-?:# j
盲孔 blind via (hole) +h0PR?
埋孔 buried via hole /y}"M
埋,盲孔 buried blind via -PNi^
K_
任意层内部导通孔 any layer inner via hole vU=9ydAj?
全部钻孔 all drilled hole bA}AD`5
定位孔 toaling hole /@ y;iJk;
无连接盘孔 landless hole aWyUu/g<A`
中间孔 interstitial hole ;B&^yj&;
无连接盘导通孔 landless via hole QBy{|sQ`
引导孔 pilot hole ,N53Iic
端接全隙孔 terminal clearomee hole 2t+D8 d|c<
准尺寸孔 dimensioned hole [Page] >_XOc
在连接盘中导通孔 via-in-pad Og,Y)a;=
孔位 hole location t#C,VwMe[
孔密度 hole density `/#f?Hk=
孔图 hole pattern '.?^uM
钻孔图 drill drawing f}^I=pS&
装配图assembly drawing yL0f1nS
参考基准 datum referan 7ftR4
1) 元件设备 sLb8*fak
H&M1>JtE
三绕组变压器:three-column transformer ThrClnTrans lC0~c=?J
双绕组变压器:double-column transformer DblClmnTrans !; IJ
电容器:Capacitor U^MuZ
并联电容器:shunt capacitor ]eE 1n2
电抗器:Reactor '"y}#h__T
母线:Busbar JIzY,%`\
输电线:TransmissionLine |,b2b2v?
发电厂:power plant z~,mRgc$B
断路器:Breaker ZWO)tVw9G
刀闸(隔离开关):Isolator lsk_P&M
分接头:tap iOX Z]Xj5
电动机:motor z
v>Oh#
(2) 状态参数 7paUpQit
#ZJMlJ:q`"
有功:active power aX;A==>
无功:reactive power I,b9t\(6
电流:current av-#)E
容量:capacity SxJ$b
电压:voltage nZfs=@w:y
档位:tap position we3tx{j
有功损耗:reactive loss mzX;s&N#
无功损耗:active loss kY"KD22a
功率因数:power-factor w/W7N
功率:power LN4qYp6)G
功角:power-angle B{C_hy-fw
电压等级:voltage grade Ve}[XqdS^p
空载损耗:no-load loss wd[eJcQ ,
铁损:iron loss LXj5R99S
铜损:copper loss j(iuz^I
空载电流:no-load current ^"9*
'vTtc
阻抗:impedance yEq#Dr
正序阻抗:positive sequence impedance fiVHRSX60
负序阻抗:negative sequence impedance qz!Ph5(
零序阻抗:zero sequence impedance ]IZ>2!6r
电阻:resistor !SO8O
电抗:reactance 4U=75!>
电导:conductance pj0fM{E
电纳:susceptance @Y}uZ'jt'
无功负载:reactive load 或者QLoad 24ux
有功负载: active load PLoad lT'9u,6
遥测:YC(telemetering) ^rL_C}YBj-
遥信:YX EF#QH
_X
励磁电流(转子电流):magnetizing current y7:tr
定子:stator [84F09HU
功角:power-angle Iy';x
上限:upper limit & ze>X
下限:lower limit z
x@$RS+]
并列的:apposable ; Y"N6%
高压: high voltage MV0Lq:# N
低压:low voltage a^t?vv
中压:middle voltage Tde0 ~j}
电力系统 power system c0_E_~
发电机 generator KVPR}qTP;
励磁 excitation KL [ek
励磁器 excitor Y
ya`&V
电压 voltage Ub_4yN;
电流 current QJn`WSw$_-
母线 bus "B{ECM;
变压器 transformer +/rH(Ni
升压变压器 step-up transformer HpVjee
高压侧 high side `y^sITr
输电系统 power transmission system -r<#rITH"
输电线 transmission line hePPxKQ-
固定串联电容补偿fixed series capacitor compensation Wht(O~F
稳定 stability g5Z#xszj+
电压稳定 voltage stability 1[;;sSp
功角稳定 angle stability t*G/]
暂态稳定 transient stability c~=B0K-
电厂 power plant ?F7o!B
能量输送 power transfer 17|np2~
交流 AC J=W0Xi!
装机容量 installed capacity 71fk.16
电网 power system W_`A"WdT.
落点 drop point ]y@F8$D!
开关站 switch station @+LfQY
双回同杆并架 double-circuit lines on the same tower )IL
#>2n?
变电站 transformer substation B@y(.
补偿度 degree of compensation &a,OfSz
高抗 high voltage shunt reactor A"v{~
无功补偿 reactive power compensation 5J2=`=FK
故障 fault <#M`5X.
调节 regulation ln!'_\{
裕度 magin BvD5SBa}"
三相故障 three phase fault o>Er_r
故障切除时间 fault clearing time D${={x
极限切除时间 critical clearing time d[D&J
切机 generator triping N8r*dadDd
高顶值 high limited value k S#
CEU7
强行励磁 reinforced excitation O81X;JdP3
线路补偿器 LDC(line drop compensation) laKuOx}
机端 generator terminal E
Y<8B3y
静态 static (state) BYrZEVM9
动态 dynamic (state) FR[ B v
单机无穷大系统 one machine - infinity bus system mmXm\]r>4
机端电压控制 AVR R6-n IY,
电抗 reactance xNK1h-t
电阻 resistance N2'qpxOLI
功角 power angle {c?JuV4q?
有功(功率) active power Ny- [9S-<
无功(功率) reactive power !$;a[Te
功率因数 power factor I04jjr:<
无功电流 reactive current RyJ 1mAC
下降特性 droop characteristics
-t2T(ha
斜率 slope a ]Eg!Q
额定 rating z4#(Ze@u~_
变比 ratio Kv'n:z7Md
参考值 reference value rl#vE's6.e
电压互感器 PT _@mRb^
分接头 tap )tHaB,
下降率 droop rate s=6}%%q6
仿真分析 simulation analysis GQQ.OvEc
传递函数 transfer function }v9\F-0>Q
框图 block diagram w%AcG~`j!B
受端 receive-side T<3BT
裕度 margin '^BV_ QQ
同步 synchronization H=*5ASc
失去同步 loss of synchronization Migd(uw'
阻尼 damping PNF?;*`-{7
摇摆 swing oI:o"T77sA
保护断路器 circuit breaker gWABY%!}
电阻:resistance I:bD~Fb3
电抗:reactance ?[<Tx-L
阻抗:impedance ?\KM5^eX
电导:conductance 7(M(7}EKA
电纳:susceptance