1 backplane 背板 hli10p$
2 Band gap voltage reference 带隙电压参考 kA__*b}8UK
3 benchtop supply 工作台电源 FRFAWK<
4 Block Diagram 方块图 5 Bode Plot 波特图 A+I&.\QAR
6 Bootstrap 自举 zXZ'nJ5OGG
7 Bottom FET Bottom FET vLuQe0l{
8 bucket capcitor 桶形电容 ,:4DN&<
9 chassis 机架 8[)]3K x
10 Combi-sense Combi-sense = O1;vc}AA
11 constant current source 恒流源 |*KS<iHr%
12 Core Sataration 铁芯饱和 /w M
13 crossover frequency 交叉频率 -j_I_
14 current ripple 纹波电流 0j(jJAE.
15 Cycle by Cycle 逐周期 nud=uJ"(
16 cycle skipping 周期跳步 ^,lZ58
2
17 Dead Time 死区时间 87KrSZ
18 DIE Temperature 核心温度
4|N\Q=,
19 Disable 非使能,无效,禁用,关断 p &>A5
20 dominant pole 主极点 .vS6_
21 Enable 使能,有效,启用 ]TgP!M&q
22 ESD Rating ESD额定值 \bm6/fhA:
23 Evaluation Board 评估板 4;RCPC
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. UZP6x2:=
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ~9r!m5ws
25 Failling edge 下降沿 cEc,eq|
26 figure of merit 品质因数 :z.Y$]F@
27 float charge voltage 浮充电压 <m,yFk
28 flyback power stage 反驰式功率级 _sR9
29 forward voltage drop 前向压降 UVc<C
1q
30 free-running 自由运行 f&}A!uLe4x
31 Freewheel diode 续流二极管 neh;`7~5@K
32 Full load 满负载 33 gate drive 栅极驱动 +'/}[1q1/T
34 gate drive stage 栅极驱动级 `E5"Pmg
35 gerber plot Gerber 图 e j%;%`C-
36 ground plane 接地层 Hpi%9SAM
37 Henry 电感单位:亨利 VS|("**
38 Human Body Model 人体模式 8A^jD(|
39 Hysteresis 滞回 ^mueFw}\
40 inrush current 涌入电流 1@^Ek8C
41 Inverting 反相 /%YiZ#
42 jittery 抖动 H [Lt%:r
43 Junction 结点 ZBmXaP[9
44 Kelvin connection 开尔文连接 a4(?]ND~6
45 Lead Frame 引脚框架 [z% ?MIT
46 Lead Free 无铅 pp]_/46nN
47 level-shift 电平移动 y[p$/$bgC5
48 Line regulation 电源调整率 #)0Tt>d6
49 load regulation 负载调整率 Bw<zc=%
50 Lot Number 批号 $54=gRo^
51 Low Dropout 低压差 0<@KDlF
52 Miller 密勒 53 node 节点 Vp$wHB&
54 Non-Inverting 非反相 tB7K&ssi
55 novel 新颖的 /Pn.)Lxfl
56 off state 关断状态 )p<fL
57 Operating supply voltage 电源工作电压 <s/<b*T
^
58 out drive stage 输出驱动级 |Vwc/9`t]>
59 Out of Phase 异相 NdsX*o@a
60 Part Number 产品型号 zD2.Q%`IM
61 pass transistor pass transistor 0^9:KZ.!
62 P-channel MOSFET P沟道MOSFET |vfujzRZ
63 Phase margin 相位裕度 =1*%>K
64 Phase Node 开关节点 R6q4 ["
65 portable electronics 便携式电子设备 N(:nF5>_
66 power down 掉电 H5Ux.]y
67 Power Good 电源正常 I{42'9
68 Power Groud 功率地 5'X74`
69 Power Save Mode 节电模式 ],\sRQbv&
70 Power up 上电 |,;twj[?4
71 pull down 下拉 O:;OR'N9
72 pull up 上拉 eb!s'@
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ,$h(fM8GC
74 push pull converter 推挽转换器 1Sg|3T8bGT
75 ramp down 斜降 N )zPxQ
76 ramp up 斜升 L/q]QgCoA
77 redundant diode 冗余二极管 -".kH<SWv
78 resistive divider 电阻分压器 JG@L5f
79 ringing 振 铃 EWb(uWC8h
80 ripple current 纹波电流 jVad)2D
81 rising edge 上升沿 4[TS4p
82 sense resistor 检测电阻 (@)2PO/
83 Sequenced Power Supplys 序列电源 n .f4z<
84 shoot-through 直通,同时导通 Q`S iV
85 stray inductances. 杂散电感 e^k!vk-SLF
86 sub-circuit 子电路 |P~O15V*Q
87 substrate 基板 By?nd)
88 Telecom 电信 -uA 3Y
89 Thermal Information 热性能信息 euV $2Fg
90 thermal slug 散热片 =[]x\&@t
91 Threshold 阈值 4l lD6&%
92 timing resistor 振荡电阻 /"""z=q
93 Top FET Top FET &|Lh38s@$#
94 Trace 线路,走线,引线 m$fQ `XzU
95 Transfer function 传递函数 0A#*4ap
96 Trip Point 跳变点 7_9+=.
+X5
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) {I0w`xe
98 Under Voltage Lock Out (UVLO) 欠压锁定 _urG_~q
99 Voltage Reference 电压参考 *8$>Whr
100 voltage-second product 伏秒积 3ty4D 2y
101 zero-pole frequency compensation 零极点频率补偿 (U|)xA]y!
102 beat frequency 拍频 (M ]XNn
103 one shots 单击电路 Mv.Ciyc
104 scaling 缩放 "^;#f+0
105 ESR 等效串联电阻 [Page] CO-Iar
106 Ground 地电位 t< sp%zXZ
107 trimmed bandgap 平衡带隙 {(rf/:X!p
108 dropout voltage 压差 [34zh="o
109 large bulk capacitance 大容量电容 }@Xh xZu
110 circuit breaker 断路器 C,o:
111 charge pump 电荷泵 /~40rXH2C
112 overshoot 过冲 pw@`}cM=
[6AHaOhR'
印制电路printed circuit 8r,9OM
印制线路 printed wiring ,H>W:O
印制板 printed board \UQ9MX _
印制板电路 printed circuit board N0+hejz
印制线路板 printed wiring board h`=r)D
印制元件 printed component @-0Fe9 n=
印制接点 printed contact k+FMZ,D|
印制板装配 printed board assembly 'gCJ[ ce
板 board :<L5sp
刚性印制板 rigid printed board *kP;{Cb`
挠性印制电路 flexible printed circuit O?CdAnhQc`
挠性印制线路 flexible printed wiring swttp`
齐平印制板 flush printed board R.K?
金属芯印制板 metal core printed board
:-z&Y492
金属基印制板 metal base printed board >-!r9"8@
多重布线印制板 mulit-wiring printed board Q4RpK(N
塑电路板 molded circuit board d$pYo)8o({
散线印制板 discrete wiring board `M&P[.9Pz
微线印制板 micro wire board z.
'Fv7
积层印制板 buile-up printed board _=pWG^a
表面层合电路板 surface laminar circuit )1WMlG
埋入凸块连印制板 B2it printed board ;_}~%-_
~
载芯片板 chip on board 7%e1cI
埋电阻板 buried resistance board ;AKwx|I$g
母板 mother board axX{6
子板 daughter board ]D O&x+Rb
背板 backplane 69>/@<
裸板 bare board PSPTL3_~
键盘板夹心板 copper-invar-copper board 'xIyGDe
动态挠性板 dynamic flex board zX98c
静态挠性板 static flex board I!P4(3skAB
可断拼板 break-away planel E>E*ZZuhj
电缆 cable (~JwLe@a
挠性扁平电缆 flexible flat cable (FFC) oB
p3JX9_f
薄膜开关 membrane switch qe<Hfp/p
混合电路 hybrid circuit yNBv-oe5
厚膜 thick film SAR=
{/
厚膜电路 thick film circuit 30s; }
薄膜 thin film :_v!#H)
薄膜混合电路 thin film hybrid circuit U9
#w
互连 interconnection V@[rf<,
导线 conductor trace line +
~"5!
齐平导线 flush conductor UbO4%YHt
传输线 transmission line |d[5l^6
跨交 crossover YScvyh?E
板边插头 edge-board contact P;73Hr[E#
增强板 stiffener M ,`w A
基底 substrate Nar>FR7ut
基板面 real estate +1QK}H~
导线面 conductor side 7\Co`J>p2
元件面 component side [KSH~:h:NR
焊接面 solder side V,Q4n%h1.
导电图形 conductive pattern Huc|6~X
非导电图形 non-conductive pattern Zyu/|Og
基材 base material X3',vey
层压板 laminate Br!9x{q*
覆金属箔基材 metal-clad bade material &n:{x}Uc
覆铜箔层压板 copper-clad laminate (CCL) _|A+) K
复合层压板 composite laminate b5<okICD
薄层压板 thin laminate 3#c3IZ-;
基体材料 basis material <.bRf
预浸材料 prepreg RO.U(T
粘结片 bonding sheet I`T1Pll
预浸粘结片 preimpregnated bonding sheer )"|||\Iv
环氧玻璃基板 epoxy glass substrate Be2lMC
预制内层覆箔板 mass lamination panel rOcg+5
内层芯板 core material I-DXb
M
粘结层 bonding layer U<^F4*G
粘结膜 film adhesive -_em%o3XC
无支撑胶粘剂膜 unsupported adhesive film @ }&_Dvf
覆盖层 cover layer (cover lay) ?s2^zT
增强板材 stiffener material VL\t>n
铜箔面 copper-clad surface lyv4fP
去铜箔面 foil removal surface '#.#$8l
层压板面 unclad laminate surface UG](go't
基膜面 base film surface y t5H oy
胶粘剂面 adhesive faec .UQE{.?
原始光洁面 plate finish 0^3+P%(o@
粗面 matt finish F9a^ED0l\
剪切板 cut to size panel D d,2;#_
超薄型层压板 ultra thin laminate *2e!M^K<
A阶树脂 A-stage resin ~TqT}:,H
B阶树脂 B-stage resin A6!F@Ic[
C阶树脂 C-stage resin ]PR#W_&q
环氧树脂 epoxy resin M'L;N!1A
酚醛树脂 phenolic resin .4-,_`T?
聚酯树脂 polyester resin /?*]lH.
聚酰亚胺树脂 polyimide resin S6g<M5^R
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin KC#/Z2A|<
丙烯酸树脂 acrylic resin !RH.|}
三聚氰胺甲醛树脂 melamine formaldehyde resin }D;WN@],
多官能环氧树脂 polyfunctional epoxy resin O9"/
kmB
溴化环氧树脂 brominated epoxy resin *F`A S>
环氧酚醛 epoxy novolac U*)m',
氟树脂 fluroresin JSr$-C
fH
硅树脂 silicone resin 4vWkT8HQ
硅烷 silane yN6>VD{F
聚合物 polymer ._PzYE|m2
无定形聚合物 amorphous polymer 8gy_Yj&{P
结晶现象 crystalline polamer !EIjN
双晶现象 dimorphism x@KZ]
共聚物 copolymer ~xLJe`"JUx
合成树脂 synthetic aZ|=(]
热固性树脂 thermosetting resin [Page] sN6N >{
热塑性树脂 thermoplastic resin ,9D+brm
感光性树脂 photosensitive resin O"G >wv
环氧值 epoxy value 04U")-\O
双氰胺 dicyandiamide }"^'%C8EX
粘结剂 binder >>{FzR
胶粘剂 adesive cV{o?3<:B
固化剂 curing agent ACq7dLys,B
阻燃剂 flame retardant @]aOyb@
遮光剂 opaquer 2L?!tBw?1
增塑剂 plasticizers tptN6Isuh
不饱和聚酯 unsatuiated polyester W ~f(::
聚酯薄膜 polyester ^=
0m-/
聚酰亚胺薄膜 polyimide film (PI) GL{57
聚四氟乙烯 polytetrafluoetylene (PTFE) {gbn/{
增强材料 reinforcing material :GpDg
折痕 crease T"7~AbgNU
云织 waviness *3/T;x.
鱼眼 fish eye e[_m<e
毛圈长 feather length zOgTQs"ZH
厚薄段 mark I/gjenUK
裂缝 split N-
H^lqD
捻度 twist of yarn /zDi9W*~1
浸润剂含量 size content %\|'%/"`2(
浸润剂残留量 size residue sm[94,26
处理剂含量 finish level w@JKl5
偶联剂 couplint agent 1$qh`<\
断裂长 breaking length w}Uhd,
吸水高度 height of capillary rise B(xN Gs
湿强度保留率 wet strength retention )XcOl7XLN
白度 whitenness 5%sE]Y#
导电箔 conductive foil _4^R9Bt
铜箔 copper foil B#/Q'V
压延铜箔 rolled copper foil oF(Lji?m
光面 shiny side ]BR,M4
粗糙面 matte side L|bwZ,M=}?
处理面 treated side ZaNQpH.
防锈处理 stain proofing 2^8%>,
双面处理铜箔 double treated foil a:QDBS2Llv
模拟 simulation _uc
hU=
逻辑模拟 logic simulation ,^#yo6-
电路模拟 circit simulation ,U(1NK8o
时序模拟 timing simulation "Ph^BUAb
模块化 modularization C8z{XSo
设计原点 design origin 8 r_>t2$
优化(设计) optimization (design) C z\Pp q
供设计优化坐标轴 predominant axis UTXSeNP
表格原点 table origin vWGwVH/K
元件安置 component positioning (}}S9 K
比例因子 scaling factor E[Cb|E
扫描填充 scan filling E Cyyl
矩形填充 rectangle filling GnvL'ESa@M
填充域 region filling V+O"j^Z_J
实体设计 physical design ..rOsg{
逻辑设计 logic design #8)*1?
逻辑电路 logic circuit @')[FEdW
层次设计 hierarchical design >$4d7.^hb/
自顶向下设计 top-down design I_RsYw
自底向上设计 bottom-up design _4g.j
费用矩阵 cost metrix W*2U="t
元件密度 component density 8@tV9+u
自由度 degrees freedom thhwN
A
出度 out going degree F i0GknQ+
入度 incoming degree jYKor7KTqT
曼哈顿距离 manhatton distance %$b:X5$Z
欧几里德距离 euclidean distance A{A\RSZ0
网络 network -,U3fts
阵列 array AJ=qn a
段 segment =zz~kon9
逻辑 logic =uS9JU^E
逻辑设计自动化 logic design automation :5{wf Am
分线 separated time MjU6/pO}L
分层 separated layer ;5)P6S.D
定顺序 definite sequence aeD ;5VV
导线(通道) conduction (track) ajEjZ6
导线(体)宽度 conductor width `G}TG(
导线距离 conductor spacing f.9SB
导线层 conductor layer }R{ts
导线宽度/间距 conductor line/space r [*Vqcz
第一导线层 conductor layer No.1 P(f0R8BE
圆形盘 round pad S Em Q@1
方形盘 square pad Eqj_m|@
菱形盘 diamond pad Ck)*&
长方形焊盘 oblong pad hbY5l}\5
子弹形盘 bullet pad oaIi2=Tf
泪滴盘 teardrop pad ++^l]8
雪人盘 snowman pad }F#okU
形盘 V-shaped pad V j3{D^|0bP
环形盘 annular pad xjKR R?
非圆形盘 non-circular pad I+tb[*X+
隔离盘 isolation pad N(Fp0
非功能连接盘 monfunctional pad *Qg _F6y
偏置连接盘 offset land 1ng!G 7g
腹(背)裸盘 back-bard land F9,DrB,B{
盘址 anchoring spaur YTUZoW2
连接盘图形 land pattern sT}.v*
连接盘网格阵列 land grid array V3^&oe%
孔环 annular ring +%ee8|\
元件孔 component hole K<>oa[B9
安装孔 mounting hole Z{]0jhUyNh
支撑孔 supported hole 3h$6t7=C
非支撑孔 unsupported hole .y!<t}
导通孔 via 1;Ou7T9w
镀通孔 plated through hole (PTH) XAF+0 x!
余隙孔 access hole &L'Dqew,*
盲孔 blind via (hole) U:^PC
x`
埋孔 buried via hole @~^5l
埋,盲孔 buried blind via Rh_np
任意层内部导通孔 any layer inner via hole t*Sa@$p
全部钻孔 all drilled hole u)}$~E>
定位孔 toaling hole +BETF;0D
无连接盘孔 landless hole '
aq!^!z
中间孔 interstitial hole _m5uDF?[
无连接盘导通孔 landless via hole =P't(<
引导孔 pilot hole ZX9T YN
端接全隙孔 terminal clearomee hole VVac:
准尺寸孔 dimensioned hole [Page] ,,%i;
在连接盘中导通孔 via-in-pad D$
dfNiCH
孔位 hole location ,|y:" s
孔密度 hole density &Sw%<N*r
孔图 hole pattern ,)Me
钻孔图 drill drawing ?!A7rb/tj
装配图assembly drawing _(%d(E2?
参考基准 datum referan I*{4rDt
1) 元件设备 6Ypc`
sFT.Oxg<
三绕组变压器:three-column transformer ThrClnTrans *W,]>v0%T
双绕组变压器:double-column transformer DblClmnTrans l{I6&^!KS
电容器:Capacitor eKE#Yr
d=x
并联电容器:shunt capacitor ,J,/."Y
电抗器:Reactor vQosPS_2L
母线:Busbar DS+}UO
输电线:TransmissionLine WIC/AL'
发电厂:power plant q)X$^oE!6
断路器:Breaker K1mPr^3rC
刀闸(隔离开关):Isolator zM bN;tu
分接头:tap IHam 4$~-
电动机:motor G18F&c~
(2) 状态参数 1O/+8yw
@e(o129
有功:active power @mOH"acGn?
无功:reactive power Sj]T
电流:current HW3 }uP\c
容量:capacity <sWprR
电压:voltage wQqb`l7+
档位:tap position $ 7O}S.x
有功损耗:reactive loss *7CV^mDm
无功损耗:active loss N4^-`
功率因数:power-factor f,h J~
功率:power S>h;K`
功角:power-angle nxUJN1b!N
电压等级:voltage grade Bp_$.!Qy
空载损耗:no-load loss <'qeXgi
铁损:iron loss veMH
铜损:copper loss l1T m`7}
空载电流:no-load current (U&tt]|
阻抗:impedance 'qZW,],5
正序阻抗:positive sequence impedance .u*0[N
负序阻抗:negative sequence impedance !TAlBkj
零序阻抗:zero sequence impedance Ja,wfRq
电阻:resistor
@G8lr
电抗:reactance {K+icTL3
电导:conductance 6N!Q:x^4(T
电纳:susceptance f$+,HB
无功负载:reactive load 或者QLoad 8K.R=
有功负载: active load PLoad SQ44
遥测:YC(telemetering) 2;zb\d
遥信:YX ti5mIW\
励磁电流(转子电流):magnetizing current (zgW%{V@
定子:stator -K
q5i
功角:power-angle ZIf
上限:upper limit /j4P9y^]=
下限:lower limit ,=UK}*e"
并列的:apposable U}6B*Xx'
高压: high voltage 24E}<N,g
低压:low voltage fa++MNf}3
中压:middle voltage \?Z{hmN
电力系统 power system lt
^GvWg
发电机 generator 4.Q} 1%ZN
励磁 excitation d9B]fi}
励磁器 excitor 8VeQ-#7M/
电压 voltage SO IHePmwK
电流 current d@ i}-;
母线 bus %6t2ohO"
变压器 transformer 7({]x*o*%
升压变压器 step-up transformer Q~OxH'>>(
高压侧 high side Jbjmv:db
输电系统 power transmission system tZ'|DCT
输电线 transmission line 6A>dhU
固定串联电容补偿fixed series capacitor compensation o<[#0T^K
稳定 stability oE+R3[D?r
电压稳定 voltage stability I$<<(VWH
功角稳定 angle stability P,xKZ{(
暂态稳定 transient stability v-#Q7T
电厂 power plant /JHc! D
能量输送 power transfer X' d9[).
交流 AC O!P H&;H
装机容量 installed capacity ?98("T|y;
电网 power system jFASX2.p
落点 drop point 3on7~*
开关站 switch station 6G
#}Q/
双回同杆并架 double-circuit lines on the same tower {U1?Et#
变电站 transformer substation l|/ep:x8
补偿度 degree of compensation vbb5f #WZ
高抗 high voltage shunt reactor F({HP)9b
无功补偿 reactive power compensation D)j(,vt
故障 fault qAn! Rk A
调节 regulation #~7ip\Uf[
裕度 magin 0s/w,?
三相故障 three phase fault >4#)r8;dx
故障切除时间 fault clearing time *~t6(v?
极限切除时间 critical clearing time OR%'K2C6S
切机 generator triping hp#W9@NR
高顶值 high limited value :c8&N-`
强行励磁 reinforced excitation -=~| ."O
线路补偿器 LDC(line drop compensation) n/Sw P
机端 generator terminal _a6[{_Pc
静态 static (state) ZUoxMm
动态 dynamic (state) 1guJG_;z
单机无穷大系统 one machine - infinity bus system ^>jwh
机端电压控制 AVR \/: {)T~
电抗 reactance bYEy<7)x
电阻 resistance jz
qyk^X
功角 power angle -I&m:A$4*
有功(功率) active power IF44F3(V4
无功(功率) reactive power k@/sn(x
功率因数 power factor 5*Y^\N
无功电流 reactive current v^#~98g]
下降特性 droop characteristics DNr@u/>vB
斜率 slope !HnXXVW
额定 rating B" !l2
变比 ratio xT
参考值 reference value U<DZ:ds?T
电压互感器 PT S/9DtXQ
分接头 tap n[G &ksQI
下降率 droop rate ?QFpv#4
仿真分析 simulation analysis G+X
Sfr
传递函数 transfer function ?d{Na=O\
框图 block diagram 5@+,Xh,H|t
受端 receive-side v":x4!kdX
裕度 margin 9s6U}a'c
同步 synchronization _V7r1fY:
失去同步 loss of synchronization 3E!|<q$z
阻尼 damping "nw;NIp!
摇摆 swing C-\S/yd
保护断路器 circuit breaker K`u(/kz/<
电阻:resistance BYVY)<v/
电抗:reactance D/vOs[X
o,
阻抗:impedance |wH5sjT
电导:conductance 59"UL\3
电纳:susceptance