1 backplane 背板 ,\ov$biL
2 Band gap voltage reference 带隙电压参考 g&&5F>mF
3 benchtop supply 工作台电源 =`u4xa#m
4 Block Diagram 方块图 5 Bode Plot 波特图 KYMz
6 Bootstrap 自举 }ufH![|[r
7 Bottom FET Bottom FET OTSbhI'v
8 bucket capcitor 桶形电容 H:2#/1Oz>
9 chassis 机架 V
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10 Combi-sense Combi-sense -FdhV%5]
11 constant current source 恒流源 8eQ 4[wJY
12 Core Sataration 铁芯饱和 d'q,:="c
13 crossover frequency 交叉频率 bfhap(F~(e
14 current ripple 纹波电流 h9$Ov`N(%
15 Cycle by Cycle 逐周期 $fL2w^ @
16 cycle skipping 周期跳步 Qn6'E
17 Dead Time 死区时间 SCZtHEl9
18 DIE Temperature 核心温度 qE!.C}L+
19 Disable 非使能,无效,禁用,关断 ^pIT,|myY7
20 dominant pole 主极点 ~}PB&`%7
21 Enable 使能,有效,启用 \= =rdW-
22 ESD Rating ESD额定值 tWT@%(2~0
23 Evaluation Board 评估板 -ich N/U]s
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. CWHTDao
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 r<
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25 Failling edge 下降沿 }y;s(4
26 figure of merit 品质因数 1>|2B&_^
27 float charge voltage 浮充电压 09HlL=0q
28 flyback power stage 反驰式功率级 J{`G=
29 forward voltage drop 前向压降 aOIE9wO
30 free-running 自由运行 $GB/}$fd&
31 Freewheel diode 续流二极管 @Ge\odfF:
32 Full load 满负载 33 gate drive 栅极驱动 *#\da]"{
34 gate drive stage 栅极驱动级 ;%{REa
35 gerber plot Gerber 图 U8m/L^zh
36 ground plane 接地层 %L, mj
37 Henry 电感单位:亨利 Xz4T_-X8d
38 Human Body Model 人体模式 HN?NY
39 Hysteresis 滞回 t4X:I&l-M:
40 inrush current 涌入电流 -C1,$mkj
41 Inverting 反相 j]~;|V5Z
42 jittery 抖动 INt]OPD
43 Junction 结点 2 ,RO
44 Kelvin connection 开尔文连接 ^~XsHmcQ
45 Lead Frame 引脚框架 pbJC A&
46 Lead Free 无铅 ;n`SF~CU
47 level-shift 电平移动 %PW_v~sg
48 Line regulation 电源调整率 x/7kcj!O
49 load regulation 负载调整率 mhpaPin*JS
50 Lot Number 批号 ,aq0Q<}~lc
51 Low Dropout 低压差 mqUn3F3
52 Miller 密勒 53 node 节点 -!4Mmp"2@u
54 Non-Inverting 非反相 u]RI,3Z
55 novel 新颖的 X2\1OWR0
56 off state 关断状态 )"KKBil0
57 Operating supply voltage 电源工作电压 KFZ2%:6>
58 out drive stage 输出驱动级 Pr|BhX
59 Out of Phase 异相 ^V,?n@c!
60 Part Number 产品型号 'ONCz
61 pass transistor pass transistor *5T^wZpj)
62 P-channel MOSFET P沟道MOSFET 2nz^%pLT
63 Phase margin 相位裕度 ePLpGT
64 Phase Node 开关节点 ZMa@/\pf1
65 portable electronics 便携式电子设备 ;xqN#mqq
66 power down 掉电 (t[sSl
67 Power Good 电源正常 FglW|Hwy
68 Power Groud 功率地 Es]:-TR
69 Power Save Mode 节电模式 3&`LVhx
70 Power up 上电 f(SK[+aqW
71 pull down 下拉 oyC5M+shP9
72 pull up 上拉 Tew?e&eO
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 7H=V|Btnc
74 push pull converter 推挽转换器 K)DpC* j
75 ramp down 斜降 ^?<gz!(-
76 ramp up 斜升 ; ,9:1.L
77 redundant diode 冗余二极管 k7ye,_&>
78 resistive divider 电阻分压器 g$S|CqRG
79 ringing 振 铃 rvEX;8TS
80 ripple current 纹波电流 "($"T v2
81 rising edge 上升沿 lf2Q
82 sense resistor 检测电阻 !a9`]c
83 Sequenced Power Supplys 序列电源 >a%C'H.A9
84 shoot-through 直通,同时导通 2UbTKN
85 stray inductances. 杂散电感 N1!O8"Q|*3
86 sub-circuit 子电路 Gv\39+9=
87 substrate 基板 Lqa|9|!
88 Telecom 电信 U,Q
89 Thermal Information 热性能信息 " i!Xiy~
90 thermal slug 散热片 2p|ed=ly%
91 Threshold 阈值 +Z7:(o<
92 timing resistor 振荡电阻 |X47&Y
93 Top FET Top FET e|1.-P@
94 Trace 线路,走线,引线 "rVf{
95 Transfer function 传递函数 a'!p^/6?
96 Trip Point 跳变点 M4}b lh#
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) -4Hf5!
98 Under Voltage Lock Out (UVLO) 欠压锁定 i&mt-
99 Voltage Reference 电压参考 eXA@J[-M:
100 voltage-second product 伏秒积 WzhY4"p
101 zero-pole frequency compensation 零极点频率补偿 *G&3NSM-
102 beat frequency 拍频
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103 one shots 单击电路 lY$9-Q(
104 scaling 缩放 \DMZ M
105 ESR 等效串联电阻 [Page] .o(S60iH!(
106 Ground 地电位 qw<~v?{|C
107 trimmed bandgap 平衡带隙 wG LSei-s
108 dropout voltage 压差 +bdjZD3
109 large bulk capacitance 大容量电容 wN]]t~K)Q
110 circuit breaker 断路器 ~{cG"
111 charge pump 电荷泵 b}HwvS:
112 overshoot 过冲 It#T\fU
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印制电路printed circuit rO[ Zx'a
印制线路 printed wiring wl5+VC*l0
印制板 printed board IeT1Jwe
印制板电路 printed circuit board _z6 " C8W
印制线路板 printed wiring board 5H!6m_,w
印制元件 printed component |%$mN{
印制接点 printed contact :{=2ih-}
印制板装配 printed board assembly _1ax6MwX
板 board -izZ D
刚性印制板 rigid printed board *pSD[E>SU
挠性印制电路 flexible printed circuit
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挠性印制线路 flexible printed wiring M
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齐平印制板 flush printed board D`
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金属芯印制板 metal core printed board !SAR/sdXf
金属基印制板 metal base printed board
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多重布线印制板 mulit-wiring printed board B&Iy_;
塑电路板 molded circuit board w,VUWja
散线印制板 discrete wiring board d>hLnz1O
微线印制板 micro wire board 4l?"zv1
积层印制板 buile-up printed board QHPC?a6CD
表面层合电路板 surface laminar circuit f9a_:]F
埋入凸块连印制板 B2it printed board BvqypLI
载芯片板 chip on board Evt&N)l!^
埋电阻板 buried resistance board wvz_)bN~A
母板 mother board @QbTO'UzK`
子板 daughter board O m5+j:YM
背板 backplane Al^h^ 9tJ
裸板 bare board !b{7gUjyI
键盘板夹心板 copper-invar-copper board ss'`[QhR2
动态挠性板 dynamic flex board C@OY)!x!
静态挠性板 static flex board 0oPcZ""X]
可断拼板 break-away planel `3'4_@7s9
电缆 cable \[Q* d
挠性扁平电缆 flexible flat cable (FFC) m!sMr^W
薄膜开关 membrane switch !9g>/9h
混合电路 hybrid circuit q-D|96>8
厚膜 thick film dW9Ci"~v
厚膜电路 thick film circuit dS)c~:&+
薄膜 thin film 'eg;)e:`b+
薄膜混合电路 thin film hybrid circuit L9^h.Y7
互连 interconnection 't#E-+o
导线 conductor trace line BkJNu_{m?
齐平导线 flush conductor @Rs3i;"W
传输线 transmission line s^>1rV]=(`
跨交 crossover s\io9'Ec
板边插头 edge-board contact eGk`Z>
增强板 stiffener n+H);Dg<8
基底 substrate -J(93@X9
基板面 real estate _28vf Bl?
导线面 conductor side 97\9!)`,
元件面 component side Kn4x_9
焊接面 solder side u
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导电图形 conductive pattern qV7nF
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非导电图形 non-conductive pattern /5r!Fhx
基材 base material HK4 *+
层压板 laminate ]`u_d}`
覆金属箔基材 metal-clad bade material U`)o$4Bq
覆铜箔层压板 copper-clad laminate (CCL) 1%k$9[!l%
复合层压板 composite laminate gFAtIx4
薄层压板 thin laminate ~spfQV~
基体材料 basis material zMbz_22*
预浸材料 prepreg 'bx$}w N
粘结片 bonding sheet &'A8R;b}-?
预浸粘结片 preimpregnated bonding sheer N3?@CM^hHw
环氧玻璃基板 epoxy glass substrate +/Qgl
预制内层覆箔板 mass lamination panel xq\A TON
内层芯板 core material WN9K*Tt~o&
粘结层 bonding layer 6\GL|#G
粘结膜 film adhesive MNVOlo A
无支撑胶粘剂膜 unsupported adhesive film g4NbzU[I
覆盖层 cover layer (cover lay) <L>$Y#wU
增强板材 stiffener material KQ2jeJ/pj
铜箔面 copper-clad surface Hribk[99
去铜箔面 foil removal surface !R"iV^?V
层压板面 unclad laminate surface k+`e0Jago
基膜面 base film surface |nq}#
胶粘剂面 adhesive faec 0zr Zrl
原始光洁面 plate finish .wJv_
粗面 matt finish Y=tx
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剪切板 cut to size panel 4pC.mRu
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超薄型层压板 ultra thin laminate _|}
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A阶树脂 A-stage resin JsyLWv@6xa
B阶树脂 B-stage resin = 6^phZ(
C阶树脂 C-stage resin }RN&w]<
环氧树脂 epoxy resin -1 <*mbb0
酚醛树脂 phenolic resin eZk4$y
聚酯树脂 polyester resin .7v
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聚酰亚胺树脂 polyimide resin L0dj 76'M
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin
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丙烯酸树脂 acrylic resin 9~6)u=4sS"
三聚氰胺甲醛树脂 melamine formaldehyde resin n2(@uT&>
多官能环氧树脂 polyfunctional epoxy resin K6nGC
溴化环氧树脂 brominated epoxy resin |}KNtIX\G
环氧酚醛 epoxy novolac NZ=`iA8)X
氟树脂 fluroresin 9>1Gj-S2:
硅树脂 silicone resin 4Y:[YlfD.
硅烷 silane flzHZH
聚合物 polymer ^*A8 NdaB
无定形聚合物 amorphous polymer M73d^z
结晶现象 crystalline polamer T~JE.Y3B3
双晶现象 dimorphism w|0w<