1 backplane 背板 W Bb*2
2 Band gap voltage reference 带隙电压参考 NK'@.=$
3 benchtop supply 工作台电源 i1'G_bo4F7
4 Block Diagram 方块图 5 Bode Plot 波特图 oxdX2"WwU
6 Bootstrap 自举 Nr).*]g@~
7 Bottom FET Bottom FET ?Iq{6O>D.
8 bucket capcitor 桶形电容 ) TRUx
9 chassis 机架 5"X@<;H%
10 Combi-sense Combi-sense +cKOIMu9
11 constant current source 恒流源 7p1B"%
12 Core Sataration 铁芯饱和 9ExI,
13 crossover frequency 交叉频率 &I%E8E
14 current ripple 纹波电流 _dmG#_1
15 Cycle by Cycle 逐周期 5:C>:pA V
16 cycle skipping 周期跳步 FZIC|uz
17 Dead Time 死区时间 yvnDS"0<
18 DIE Temperature 核心温度 xW2?\em
19 Disable 非使能,无效,禁用,关断 R1eWPtWs
20 dominant pole 主极点 *2rc Y
21 Enable 使能,有效,启用 X(\L1N
22 ESD Rating ESD额定值 WW2hwB(
23 Evaluation Board 评估板 )lz~Rt;1i
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ~qIr'?D
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 \Hf/8!q
25 Failling edge 下降沿 Bf6i{`!G
26 figure of merit 品质因数 c?REDj2
27 float charge voltage 浮充电压 *)Cr1d k
28 flyback power stage 反驰式功率级 ZKq#PB/.
29 forward voltage drop 前向压降 M'F<1(
30 free-running 自由运行 &]shBvzl^
31 Freewheel diode 续流二极管 B2a#:E,6
32 Full load 满负载 33 gate drive 栅极驱动 VR\}*@pNp
34 gate drive stage 栅极驱动级 7[UD;&\k
35 gerber plot Gerber 图
sFnR;
36 ground plane 接地层 @LSh=o+
37 Henry 电感单位:亨利 y.6/x?Qc
38 Human Body Model 人体模式 9v?@2sOoE
39 Hysteresis 滞回 L]u^$=rI
40 inrush current 涌入电流 &Yc'X+'4
41 Inverting 反相 5 jUy[w @
42 jittery 抖动 scYqU7$%T
43 Junction 结点 &U7h9o H
44 Kelvin connection 开尔文连接 i]L=M
5^C
45 Lead Frame 引脚框架 iz{TSU
46 Lead Free 无铅 os&FrtDg
47 level-shift 电平移动 lI+^}-<
48 Line regulation 电源调整率 +!!G0Zj/
49 load regulation 负载调整率 ByO?qft>u
50 Lot Number 批号 O&yAFiCd
51 Low Dropout 低压差 &I(\:|`o
52 Miller 密勒 53 node 节点 YbnXAi\y|
54 Non-Inverting 非反相 ts}OE
55 novel 新颖的 ewHs ]V+U
56 off state 关断状态 #f HnM+
57 Operating supply voltage 电源工作电压 $mE3 FJP>
58 out drive stage 输出驱动级 *Ms"{+C
59 Out of Phase 异相 g_N^Y
60 Part Number 产品型号 Li"+`
61 pass transistor pass transistor P=6d<no&<
62 P-channel MOSFET P沟道MOSFET :K"~PrHm
63 Phase margin 相位裕度 c))?9H
,e)
64 Phase Node 开关节点 mfS}+_ C
65 portable electronics 便携式电子设备 &[_@f#
66 power down 掉电 ~!Nw]lb!
67 Power Good 电源正常 Xo]2iQy
68 Power Groud 功率地 S' kgpF"bm
69 Power Save Mode 节电模式 BzkfB:wr
70 Power up 上电 gIusp917
71 pull down 下拉 a]xGzv5
72 pull up 上拉 `b] wyP
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) VZ=:`)
74 push pull converter 推挽转换器 K~I?i/P=z
75 ramp down 斜降 6vR6=@(`>
76 ramp up 斜升 XWQ `]m)
77 redundant diode 冗余二极管 R=&-nC5e
78 resistive divider 电阻分压器 !{+.)%d'g
79 ringing 振 铃 c@"FV,L>
80 ripple current 纹波电流
s2wDJ|
81 rising edge 上升沿 ,+4T7 U R
82 sense resistor 检测电阻 JbS[(+o
83 Sequenced Power Supplys 序列电源 aq8./^
84 shoot-through 直通,同时导通 QKB+mjMH#x
85 stray inductances. 杂散电感 P}UxA!
86 sub-circuit 子电路 UcOP 0_/
87 substrate 基板 \w>Rmf'|
88 Telecom 电信 UB~-$\.
89 Thermal Information 热性能信息 :KA)4[#;W
90 thermal slug 散热片 $/tj<++W
91 Threshold 阈值 b;5j awG
92 timing resistor 振荡电阻 -,T!/E
93 Top FET Top FET wet[f {c
94 Trace 线路,走线,引线 g,!.`[e'ex
95 Transfer function 传递函数 n%#3xoa
96 Trip Point 跳变点 "~._G5i.
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 7pQ5`;P
98 Under Voltage Lock Out (UVLO) 欠压锁定 bv'>4a
99 Voltage Reference 电压参考 {*TB }Xsr,
100 voltage-second product 伏秒积 bhIShk[
101 zero-pole frequency compensation 零极点频率补偿 m"'LT0nur
102 beat frequency 拍频 B["+7\c<~
103 one shots 单击电路
DuR9L'
104 scaling 缩放 3Il._]#
105 ESR 等效串联电阻 [Page] v[{7\Hha
106 Ground 地电位 k{{3nenAG
107 trimmed bandgap 平衡带隙 nKS*y*
108 dropout voltage 压差 6Aq]I$
109 large bulk capacitance 大容量电容 zow8 Q6f
110 circuit breaker 断路器 ,d38TN
111 charge pump 电荷泵 0XCAnMVo
112 overshoot 过冲 Z|Rc54Ct
n8=Dzv0
印制电路printed circuit jll:Rh(b
印制线路 printed wiring _cWuRvY
印制板 printed board +$nNYD
印制板电路 printed circuit board N>"L2E=z$|
印制线路板 printed wiring board 8h@L_*Kr
印制元件 printed component }F!Uu
KR
印制接点 printed contact ^uN[rHZ*u
印制板装配 printed board assembly kk6
!krZ
板 board `y^\c#k
刚性印制板 rigid printed board }Oc+EV-Z
挠性印制电路 flexible printed circuit OUF%DMl4
挠性印制线路 flexible printed wiring Nr `R3(X
齐平印制板 flush printed board d;0]xG?%=
金属芯印制板 metal core printed board ;*j
K!
金属基印制板 metal base printed board D6Aa5&rO+
多重布线印制板 mulit-wiring printed board `4'=&c9
塑电路板 molded circuit board %A'mXatk
散线印制板 discrete wiring board [BJzZ>cY
微线印制板 micro wire board FGHCHSqLq
积层印制板 buile-up printed board "``>ii
表面层合电路板 surface laminar circuit =RD>#' sUK
埋入凸块连印制板 B2it printed board 6',Hs
载芯片板 chip on board l1'v`!
埋电阻板 buried resistance board (?R!y -
母板 mother board w)zJ $l
子板 daughter board rDbtT*vN
背板 backplane {cOx0=
裸板 bare board Q c&Y|]p"
键盘板夹心板 copper-invar-copper board MQx1|>rG
动态挠性板 dynamic flex board z{\tn.67
静态挠性板 static flex board lW-h
@
可断拼板 break-away planel XWS]4MB+vm
电缆 cable YSt*uOZK
挠性扁平电缆 flexible flat cable (FFC) `G\Gk|4;2
薄膜开关 membrane switch saiXFM7J
混合电路 hybrid circuit gFHBIN;u
厚膜 thick film J QnaXjW2
厚膜电路 thick film circuit RIXeV*ix
薄膜 thin film Q\kWQOB_
薄膜混合电路 thin film hybrid circuit gs3(B/";c
互连 interconnection ZwLr>?0$
p
导线 conductor trace line C 4C/
齐平导线 flush conductor \L~^c1s3r
传输线 transmission line 6_QAE6A
跨交 crossover ph6'(,
板边插头 edge-board contact s)]T"87H'_
增强板 stiffener Os$E,4,py
基底 substrate OHBCanZZ,
基板面 real estate HYGd
:SeH
导线面 conductor side lCp6UkE
元件面 component side *6AV^^
焊接面 solder side GLecBF+>F
导电图形 conductive pattern 4sQm"XgE
非导电图形 non-conductive pattern 9M27;"gK
基材 base material 1 mJUlx
层压板 laminate ^`id/
覆金属箔基材 metal-clad bade material k6ry"W3
覆铜箔层压板 copper-clad laminate (CCL) !;*flr`/
复合层压板 composite laminate 83R s1}*
薄层压板 thin laminate mJ<`/p?:
基体材料 basis material Ly8=SIZ
预浸材料 prepreg }M% 3
粘结片 bonding sheet ^0| :
预浸粘结片 preimpregnated bonding sheer G-9i
环氧玻璃基板 epoxy glass substrate Mi|13[p{
预制内层覆箔板 mass lamination panel j#2Xw25
内层芯板 core material "o`?-bQ:
粘结层 bonding layer ZwsQ}5
粘结膜 film adhesive q C cLd7`$
无支撑胶粘剂膜 unsupported adhesive film P7=`P
覆盖层 cover layer (cover lay) o"BED!/
增强板材 stiffener material ;.sYE/ZVi
铜箔面 copper-clad surface m0ra
去铜箔面 foil removal surface h'&<A_C-7
层压板面 unclad laminate surface z;oia!9z
基膜面 base film surface 5)XUT`;'){
胶粘剂面 adhesive faec 8e>B>'nH
原始光洁面 plate finish ed',\+.uB
粗面 matt finish _"Ym]y28li
剪切板 cut to size panel .tG3g:
超薄型层压板 ultra thin laminate i*:QbMb
A阶树脂 A-stage resin )r{Wj*u
B阶树脂 B-stage resin e`={_R{N
C阶树脂 C-stage resin 1T|")D
环氧树脂 epoxy resin "*<vE7
酚醛树脂 phenolic resin =Mwuhk|*
聚酯树脂 polyester resin SJP3mq/^K
聚酰亚胺树脂 polyimide resin %8u9:Cl):
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin XV%R Mr6
丙烯酸树脂 acrylic resin iy]L"7&Z2
三聚氰胺甲醛树脂 melamine formaldehyde resin SF;\*]["f
多官能环氧树脂 polyfunctional epoxy resin 2qE_SSXn
溴化环氧树脂 brominated epoxy resin Cn5"zDK$
环氧酚醛 epoxy novolac 0`7yPq*
氟树脂 fluroresin :$u[1&6
硅树脂 silicone resin :tO4LEb
硅烷 silane )-[$m%
聚合物 polymer +d=f_@i
无定形聚合物 amorphous polymer ps2j ]g
结晶现象 crystalline polamer [Lje?M* r
双晶现象 dimorphism Z ;rM@x
共聚物 copolymer 5<*ES[S
合成树脂 synthetic wg)Bx#>\L:
热固性树脂 thermosetting resin [Page] 98u@X:3
热塑性树脂 thermoplastic resin {~O4*2zg;K
感光性树脂 photosensitive resin %$zak@3%'
环氧值 epoxy value [6RODp3')
双氰胺 dicyandiamide *GXPN0^Qjo
粘结剂 binder )tJaw#Mih
胶粘剂 adesive C)i8XX
固化剂 curing agent Tf5m
YCk
阻燃剂 flame retardant uVD^X*
遮光剂 opaquer bi}aVtG~z
增塑剂 plasticizers /
S' +
不饱和聚酯 unsatuiated polyester Sw E7U~
聚酯薄膜 polyester ,^e2ma|z
聚酰亚胺薄膜 polyimide film (PI) W"@'}y
聚四氟乙烯 polytetrafluoetylene (PTFE) h@O\j&#
增强材料 reinforcing material =\2gnk~
折痕 crease F5:xrcyC
云织 waviness jRiMWolLv
鱼眼 fish eye hzqgsmT)
毛圈长 feather length N,XjZ26
厚薄段 mark xF3FY0U[
裂缝 split ,\
1X\
捻度 twist of yarn S+.>{0!S"
浸润剂含量 size content U5j4iz'
浸润剂残留量 size residue &8i$`6wY
处理剂含量 finish level t=}]4&Yp
偶联剂 couplint agent +p>h` fc
断裂长 breaking length CB>W# P%
吸水高度 height of capillary rise "__)RHH:8
湿强度保留率 wet strength retention vde!k_,wZ
白度 whitenness $}b)EMMM
导电箔 conductive foil UmpHae
铜箔 copper foil yI|x
5f
压延铜箔 rolled copper foil 2>X yrG
光面 shiny side c0e[vrP:
粗糙面 matte side ,OwTi:yDr
处理面 treated side MXl_{8
防锈处理 stain proofing 7t<h 'g2
双面处理铜箔 double treated foil $2*_7_Qb
模拟 simulation qY%|Uo
逻辑模拟 logic simulation s%R,]q
电路模拟 circit simulation k*2khh-
时序模拟 timing simulation $s1/Rmw
模块化 modularization DFZ0~+rh
设计原点 design origin "@VYJ7.1
优化(设计) optimization (design) m.ka%h$
供设计优化坐标轴 predominant axis pFMjfWD,C
表格原点 table origin Tz6I7S-w
元件安置 component positioning *[
0,QEy
比例因子 scaling factor F|+B8&-v
扫描填充 scan filling RgH 6l2
矩形填充 rectangle filling go=xx.WJ
填充域 region filling #w5%^HwO
实体设计 physical design sbVEA
逻辑设计 logic design &Hf%Va[B
逻辑电路 logic circuit ;TDvk]:
层次设计 hierarchical design l%Ke>9C
自顶向下设计 top-down design X4\T=Q?uLx
自底向上设计 bottom-up design aUa+]H[
费用矩阵 cost metrix Qh8pOUD0l}
元件密度 component density T[e+iv<8j
自由度 degrees freedom
hFycSu
出度 out going degree /YPG_,lRA
入度 incoming degree k9H}nP$F
曼哈顿距离 manhatton distance $$p +~X
欧几里德距离 euclidean distance POl-S<QV
网络 network /oEDA^qx
阵列 array $; _{|{Yj
段 segment ZR=i*y
逻辑 logic %}N01P|X>
逻辑设计自动化 logic design automation a(fiW%eFb
分线 separated time dzbbFvG
分层 separated layer c^H#[<6p
定顺序 definite sequence gGCr~.5
导线(通道) conduction (track) b(U5n"cdA
导线(体)宽度 conductor width $_'<kH-eP
导线距离 conductor spacing nt&%
sM-X
导线层 conductor layer ?r)>SB3(e
导线宽度/间距 conductor line/space )!VJ\
第一导线层 conductor layer No.1 Z;+;_Cw
圆形盘 round pad 5IzCQqOPgX
方形盘 square pad ^j.3'}p
菱形盘 diamond pad p;o "i_!
长方形焊盘 oblong pad =C(BZ+-^
子弹形盘 bullet pad Kn1u1@&Xd
泪滴盘 teardrop pad 6&~Z3|<e
雪人盘 snowman pad &a\w+
形盘 V-shaped pad V )iIsnM
环形盘 annular pad oMM@{Jp
非圆形盘 non-circular pad 01
+#2~S
隔离盘 isolation pad BUi,+NdIk
非功能连接盘 monfunctional pad NODg_J~T
偏置连接盘 offset land RJ 4=AA|
腹(背)裸盘 back-bard land @pJ;L1sn
盘址 anchoring spaur T$FKn
连接盘图形 land pattern <ldArZ4C4
连接盘网格阵列 land grid array w0=/V[fs
孔环 annular ring {9P(U\]e]k
元件孔 component hole SMB&sl
安装孔 mounting hole F|VHr@%
支撑孔 supported hole ZV5IZ&V!
非支撑孔 unsupported hole j)Q}5M
导通孔 via ,Bx0
镀通孔 plated through hole (PTH) XH!n{Of
余隙孔 access hole [<^ '}-SJ
盲孔 blind via (hole) tmoclK-
埋孔 buried via hole .VmRk9Z
埋,盲孔 buried blind via %qrUP\rn
任意层内部导通孔 any layer inner via hole 4},Y0 QXw
全部钻孔 all drilled hole +WR'\15u
定位孔 toaling hole S n~P1C
无连接盘孔 landless hole \G/ZA) t
中间孔 interstitial hole 8<6@O
无连接盘导通孔 landless via hole `5x0p a
引导孔 pilot hole h6`VU`pPI
端接全隙孔 terminal clearomee hole ^{8CShUCv
准尺寸孔 dimensioned hole [Page] #MMp0
在连接盘中导通孔 via-in-pad *ZRk)
孔位 hole location Ka)aBU9
孔密度 hole density _-v$fDrz
孔图 hole pattern fpzEh}:H\
钻孔图 drill drawing ^MhMYA
装配图assembly drawing vON7~KA
参考基准 datum referan //$^~}wt
1) 元件设备 D iHj!tZN
Csgby(D*O
三绕组变压器:three-column transformer ThrClnTrans 7D8 pb0`;J
双绕组变压器:double-column transformer DblClmnTrans %f&Bt,xEo
电容器:Capacitor m60hTJ?N)
并联电容器:shunt capacitor h,fahbH-
电抗器:Reactor B.b sU
母线:Busbar 3c`
输电线:TransmissionLine iP^[xB~v
发电厂:power plant 54s90
断路器:Breaker MpJ3*$Dr
刀闸(隔离开关):Isolator #aP;a-Q|k
分接头:tap O15~\8#'
电动机:motor *li5/=UC5*
(2) 状态参数 *TxR2pC}
$iH
有功:active power 'Ze&
LQ
无功:reactive power Cq\{\!6[
电流:current WUx2CK2N
容量:capacity ]jmZ5h#[
电压:voltage '
#t1e]
档位:tap position $nf
%<Q
有功损耗:reactive loss Sc]h^B^7
无功损耗:active loss sY}0PB
功率因数:power-factor r)G)i;;~*
功率:power MLDAr dvK
功角:power-angle |;C;d"JC2
电压等级:voltage grade *unJd"<*&@
空载损耗:no-load loss R~dWblv
铁损:iron loss RHt~:D3*
铜损:copper loss lqoVfj'6M
空载电流:no-load current :|ytw=3>
阻抗:impedance 7'{Y7]+z+
正序阻抗:positive sequence impedance Ei@al>.\
负序阻抗:negative sequence impedance qyBo|AQ5
零序阻抗:zero sequence impedance !-B|x0fs
电阻:resistor iSMVV<7
电抗:reactance 3KKq1][
电导:conductance #t">tL
电纳:susceptance {\k:?w4
无功负载:reactive load 或者QLoad (rf8"T!"
有功负载: active load PLoad vrsOA@ee3H
遥测:YC(telemetering) lYrW"(2
遥信:YX yMb.~A^$J
励磁电流(转子电流):magnetizing current ':T"nORC
定子:stator 7<F{a"5P
功角:power-angle `9G1Bd8k
上限:upper limit g$Nsu:L
下限:lower limit 73E[O5?b
并列的:apposable qd
[Z\B
高压: high voltage rf2-owWN
低压:low voltage G4f%=Z
中压:middle voltage "3a_C,\
电力系统 power system g\?7M1~
发电机 generator _8?r!D#P;s
励磁 excitation -s6;IoG/
励磁器 excitor EMS$?"K
电压 voltage 'n!Sco)C
电流 current &PEw8: TX
母线 bus onUF@3V
变压器 transformer mk?F+gh
升压变压器 step-up transformer !r_2b! dy
高压侧 high side r1xhplHH@
输电系统 power transmission system |uln<nM9
输电线 transmission line >Co5_sCe
固定串联电容补偿fixed series capacitor compensation +dK;\wT
稳定 stability \;Q:a
/ur9
电压稳定 voltage stability f(*^zga,
功角稳定 angle stability ->U9u lTC
暂态稳定 transient stability 2NqO,B|R
电厂 power plant z_ia3k<
能量输送 power transfer +C9l7 q
交流 AC " [K>faV
装机容量 installed capacity oOy_2fwZPp
电网 power system @EB2I+[
落点 drop point %>k$'UWzK
开关站 switch station Q>>II|~;J
双回同杆并架 double-circuit lines on the same tower R;2
Z~P
变电站 transformer substation =xsTVT;sj
补偿度 degree of compensation 1mz72K
高抗 high voltage shunt reactor mA']*)L1
无功补偿 reactive power compensation .
,n>#lL
故障 fault X/`M'8v.%
调节 regulation xy1R_*.F^T
裕度 magin r4Jc9Tvd
三相故障 three phase fault c7(Lk"G8
故障切除时间 fault clearing time Ln5g"g8gb%
极限切除时间 critical clearing time A<s9c=d6
切机 generator triping nJ~5ICyd
高顶值 high limited value K)r|oW=6Y
强行励磁 reinforced excitation qFYM2
线路补偿器 LDC(line drop compensation) 5IiZnGu
机端 generator terminal MFm2p?zPm
静态 static (state) \ POQeZ
动态 dynamic (state) H{j
jA+0
单机无穷大系统 one machine - infinity bus system 6'1m3<G_
机端电压控制 AVR vmK`QPu2
电抗 reactance n|f Huv
电阻 resistance *.F4?i2D
功角 power angle :f5"w+
有功(功率) active power mR6hnKa_53
无功(功率) reactive power Z`Sbq{Kx
功率因数 power factor ^26}j uQ
无功电流 reactive current JE.s?k
下降特性 droop characteristics C;NG#4;'
斜率 slope dw]jF=u
额定 rating c.eA]m q
变比 ratio ct![eWsuB
参考值 reference value 79O'S du@
电压互感器 PT EgT?Hvx:
分接头 tap ,c9K]>8m`
下降率 droop rate \t^h|<`
仿真分析 simulation analysis % #$K P
传递函数 transfer function ,@4~:OY
框图 block diagram eT6T@C](
受端 receive-side
c
1o8
裕度 margin 8rY[Q(]
同步 synchronization Cmj+>$')0
失去同步 loss of synchronization
$I }k>F
阻尼 damping r>ca17
摇摆 swing )7s(]~z
保护断路器 circuit breaker ?,0 a#lG
电阻:resistance ]XhX aoqL
电抗:reactance qz6@'1
阻抗:impedance p]erk
电导:conductance 'sT7t&v~
电纳:susceptance