1 backplane 背板 eYS
2 Band gap voltage reference 带隙电压参考 Ih"f98lV
3 benchtop supply 工作台电源 ,/Xxj\i
4 Block Diagram 方块图 5 Bode Plot 波特图 $KtMv +m"
6 Bootstrap 自举 ~~h9yvW7&
7 Bottom FET Bottom FET SU x\qz)
8 bucket capcitor 桶形电容 g%^Zq"
9 chassis 机架 6`EyzB%.$
10 Combi-sense Combi-sense [rGR1>U?i
11 constant current source 恒流源 l1YyZ ^Z
12 Core Sataration 铁芯饱和 y<B "
13 crossover frequency 交叉频率 ]>x674H
14 current ripple 纹波电流 6s>PZh
15 Cycle by Cycle 逐周期 `SOaQ|H
16 cycle skipping 周期跳步 ZP?](RV>xg
17 Dead Time 死区时间 =(zk-J<nY
18 DIE Temperature 核心温度 (A"oMnjWd
19 Disable 非使能,无效,禁用,关断 _Z 9I')
20 dominant pole 主极点 N[=nh)m7b
21 Enable 使能,有效,启用 )v'3pTs2
22 ESD Rating ESD额定值 [_b10Z'{
23 Evaluation Board 评估板 =(v/pLLK?
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. \QYs(nm?k
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 'O2{0
25 Failling edge 下降沿 RU[{!E
26 figure of merit 品质因数 q-p4k`]
27 float charge voltage 浮充电压 XMuZ'I
28 flyback power stage 反驰式功率级 nj)M$'
29 forward voltage drop 前向压降 =g?r.;OO
30 free-running 自由运行 _3ZZ-=J:=*
31 Freewheel diode 续流二极管 o$2fML
32 Full load 满负载 33 gate drive 栅极驱动 v]vrD2L
34 gate drive stage 栅极驱动级 :qw:)i
35 gerber plot Gerber 图 O+(Z`,^
36 ground plane 接地层 %K?~$;Z.
37 Henry 电感单位:亨利 4oCnF+(
38 Human Body Model 人体模式 d0|Q1R+3
39 Hysteresis 滞回 ]+,Z()
40 inrush current 涌入电流 {:fyz#>>^
41 Inverting 反相 Rm6<"SLV
42 jittery 抖动 Cc9<ABv?
43 Junction 结点 +Hv%m8'0|
44 Kelvin connection 开尔文连接 vR#A7y @!
45 Lead Frame 引脚框架 )W uuU [(
46 Lead Free 无铅 R%}OZJ_
47 level-shift 电平移动 cLJ|VD7
48 Line regulation 电源调整率 \:^$ZBQr<n
49 load regulation 负载调整率 <9B43
50 Lot Number 批号 (S1$g ~t;
51 Low Dropout 低压差 L"#Tas\5
52 Miller 密勒 53 node 节点 babDLaC@
54 Non-Inverting 非反相 )HR'FlxOd
55 novel 新颖的 <K|_M)/9
56 off state 关断状态 )p ,-TtV
57 Operating supply voltage 电源工作电压 B*K%&w10~
58 out drive stage 输出驱动级 pHKj*Y
59 Out of Phase 异相 _d)w, ;m#
60 Part Number 产品型号 IjD:
hR@
61 pass transistor pass transistor #_4L/LV
62 P-channel MOSFET P沟道MOSFET 7|IW\
63 Phase margin 相位裕度 ^ !E;+o' t
64 Phase Node 开关节点 'U5
E{
65 portable electronics 便携式电子设备 KmpX^Se[
66 power down 掉电 u~%
m(
67 Power Good 电源正常 (w4#?_
68 Power Groud 功率地 5+giT5K*h
69 Power Save Mode 节电模式 vg
*+>lbA
70 Power up 上电
9JP{F
71 pull down 下拉 ! =I:Uc-Y
72 pull up 上拉 SO8Ej)m
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) UV@<55)K
74 push pull converter 推挽转换器 Eq'YtqU
75 ramp down 斜降 N f1) 5
76 ramp up 斜升 K\=bpc"Fy
77 redundant diode 冗余二极管 Ab8~'<F$B
78 resistive divider 电阻分压器 F1gDeLmJ
79 ringing 振 铃 {ZN{$Ad3/
80 ripple current 纹波电流 6R dfF$f
81 rising edge 上升沿 ukvz#hdE
82 sense resistor 检测电阻 \>1M?
83 Sequenced Power Supplys 序列电源 R0-ARq#0<
84 shoot-through 直通,同时导通 i1 C]bUXA
85 stray inductances. 杂散电感 ]!0 BMZmf
86 sub-circuit 子电路 c$@,*c
0n
87 substrate 基板 z[] AH#h
88 Telecom 电信 <N+l"Re#]
89 Thermal Information 热性能信息 I\`:(V
90 thermal slug 散热片 (|h<{ -L
91 Threshold 阈值 32YE%
92 timing resistor 振荡电阻 ?jz{fU
93 Top FET Top FET ?AYI
94 Trace 线路,走线,引线 t[)z/[m
95 Transfer function 传递函数 ]^ZC^z;H
96 Trip Point 跳变点 z[IG+2
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) /O/u5P{J
98 Under Voltage Lock Out (UVLO) 欠压锁定 iTqv=
99 Voltage Reference 电压参考 LP#CA^*S
100 voltage-second product 伏秒积 rx|/]NE;
101 zero-pole frequency compensation 零极点频率补偿 s13Iu#
102 beat frequency 拍频 R*VZ=i
103 one shots 单击电路 ~8}"X] 4
104 scaling 缩放 ~O|j*T
105 ESR 等效串联电阻 [Page] At +on9&=
106 Ground 地电位 %Xkynso~
107 trimmed bandgap 平衡带隙 y)Ip\.KV\
108 dropout voltage 压差 i|.!*/qF
109 large bulk capacitance 大容量电容 \#G`$JD
110 circuit breaker 断路器 $5%tGFh
111 charge pump 电荷泵 T*|?]k
8@*
112 overshoot 过冲 AUzJ:([V
'00DUUa
印制电路printed circuit .Uha %~%
印制线路 printed wiring &{ntx~Eq
印制板 printed board :,]%W $f=
印制板电路 printed circuit board ?8YHz
印制线路板 printed wiring board JFR,QUT
印制元件 printed component ]V><gZ
印制接点 printed contact 93[`1_q7\
印制板装配 printed board assembly HPtaW:J
板 board )<-kS
刚性印制板 rigid printed board ctH`71Y
挠性印制电路 flexible printed circuit 1B,RRHXn6
挠性印制线路 flexible printed wiring LW ntZ.
齐平印制板 flush printed board $].< /
金属芯印制板 metal core printed board _EjS(.e/=
金属基印制板 metal base printed board z$%ntN#eNA
多重布线印制板 mulit-wiring printed board VUagZ7p
塑电路板 molded circuit board cg$7`/U
散线印制板 discrete wiring board %+>I1G
微线印制板 micro wire board X
B65,l
积层印制板 buile-up printed board EC?!%iO`
表面层合电路板 surface laminar circuit vHJ ~~if
埋入凸块连印制板 B2it printed board )5'S=av9
载芯片板 chip on board +!.=M8[
埋电阻板 buried resistance board e?RHf_d3T-
母板 mother board ?6tuo:gP
子板 daughter board JF24~Q4P
背板 backplane GS<,adD
裸板 bare board is#?O5:2
键盘板夹心板 copper-invar-copper board kmo3<'j{
动态挠性板 dynamic flex board b`18y cVME
静态挠性板 static flex board c1jgBty
可断拼板 break-away planel )v0m7Lv#/
电缆 cable LT:KZ|U9
挠性扁平电缆 flexible flat cable (FFC) O_KL#xo
薄膜开关 membrane switch a8A8?:
混合电路 hybrid circuit b.j\=c
厚膜 thick film ]#+fQR$!
厚膜电路 thick film circuit ]U'KYrh
薄膜 thin film 1mf|:2,
薄膜混合电路 thin film hybrid circuit 0m51nw~B
互连 interconnection Ur]5AJ
导线 conductor trace line )jCAfdnCs
齐平导线 flush conductor YX@[z
5*
传输线 transmission line iMJ jWkk
跨交 crossover 'OkF.bs
板边插头 edge-board contact wArNWBM
增强板 stiffener qbcaiU`-^"
基底 substrate /BeA-\B
基板面 real estate \o}m]v
i
导线面 conductor side B.
'&[A
元件面 component side
Ne>yFl"u
焊接面 solder side 3,;;C(
导电图形 conductive pattern -CePtq`
非导电图形 non-conductive pattern gT3i{iU
基材 base material "%^T~Z(_j
层压板 laminate /*Xr^X6
覆金属箔基材 metal-clad bade material ;QZ}$8D 6Q
覆铜箔层压板 copper-clad laminate (CCL) Jw "fqr
复合层压板 composite laminate y8~/EyY|^
薄层压板 thin laminate m][i-|@M
基体材料 basis material }C6RgE.6<
预浸材料 prepreg ICq
粘结片 bonding sheet KYe@2 6
预浸粘结片 preimpregnated bonding sheer V+04X"
环氧玻璃基板 epoxy glass substrate +q*Cw>t /
预制内层覆箔板 mass lamination panel !mX-g]4E
内层芯板 core material '8RBR%)y
粘结层 bonding layer 6ooCg>9/Z
粘结膜 film adhesive
%4
无支撑胶粘剂膜 unsupported adhesive film v>S[}du
覆盖层 cover layer (cover lay) Eu;f~ V
增强板材 stiffener material b#
v+_7
铜箔面 copper-clad surface OH+kN/Fd
去铜箔面 foil removal surface acG4u+[ ]
层压板面 unclad laminate surface CSu}_$wC#
基膜面 base film surface Xo,}S\wcn
胶粘剂面 adhesive faec p1}m_
原始光洁面 plate finish CGYZEPRR
粗面 matt finish 5}v<?<l9\
剪切板 cut to size panel :9c[J$R4
超薄型层压板 ultra thin laminate 9|('*
A阶树脂 A-stage resin -(ev68'}W
B阶树脂 B-stage resin #Cy9E"lP
C阶树脂 C-stage resin 3kU4?D]
环氧树脂 epoxy resin +c&oF,=}!P
酚醛树脂 phenolic resin a%FM)/oI|T
聚酯树脂 polyester resin r0xmDJ@y
聚酰亚胺树脂 polyimide resin <r`^iR)%
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin cJ^:b4j
丙烯酸树脂 acrylic resin )P|&o%E
三聚氰胺甲醛树脂 melamine formaldehyde resin )c; YR}tC
多官能环氧树脂 polyfunctional epoxy resin -9f+O^x
溴化环氧树脂 brominated epoxy resin *PSUB{i(
环氧酚醛 epoxy novolac &-e@Et`Pg
氟树脂 fluroresin ,\]`X7r
硅树脂 silicone resin 8(jUCD
硅烷 silane _/\U
聚合物 polymer p$S\l] ,
无定形聚合物 amorphous polymer _{k-&I
结晶现象 crystalline polamer IH2V.>h
双晶现象 dimorphism qcWY8sYf
共聚物 copolymer igGg[I1?
合成树脂 synthetic m,3H]
热固性树脂 thermosetting resin [Page] D# Gf.c
热塑性树脂 thermoplastic resin z\F#td{ r
感光性树脂 photosensitive resin VMZUJ2Yj/&
环氧值 epoxy value ' 5F3,/r
双氰胺 dicyandiamide 26K sP .-
粘结剂 binder m ?)k&{I
胶粘剂 adesive Kn#CIFbBN
固化剂 curing agent ;"R1>tw3)
阻燃剂 flame retardant Cu\6VnW_6
遮光剂 opaquer g##yR/L
增塑剂 plasticizers x 8_nLZ
不饱和聚酯 unsatuiated polyester *mVQN1
聚酯薄膜 polyester 2d60o~E
聚酰亚胺薄膜 polyimide film (PI) D\@)*"
聚四氟乙烯 polytetrafluoetylene (PTFE) S
A\_U::T
增强材料 reinforcing material [11D7L%1t
折痕 crease \GP0FdpV
云织 waviness uH.1'bR?a
鱼眼 fish eye y$Rh$eK
毛圈长 feather length k
x?m "a%
厚薄段 mark r`OC5IoQ
裂缝 split Acl?w }Y
捻度 twist of yarn J=`2{
'l
浸润剂含量 size content s~tZN
浸润剂残留量 size residue f [DZ
处理剂含量 finish level +N>z|T<
偶联剂 couplint agent oQ{
X2\
断裂长 breaking length tso\bxiU
吸水高度 height of capillary rise ]fdxpqz
湿强度保留率 wet strength retention h(4&!x
白度 whitenness AK_,$'f
导电箔 conductive foil %8hx3N8>
铜箔 copper foil 12TX_ 0
压延铜箔 rolled copper foil v"v-c!k
光面 shiny side ? `+G0VT
粗糙面 matte side dm~Uj
处理面 treated side
$*S&i(z
防锈处理 stain proofing b.#0{*/G
双面处理铜箔 double treated foil WMXxP gik
模拟 simulation }7+`[g
逻辑模拟 logic simulation $a.,;:
电路模拟 circit simulation 3;<Vv*a"Dm
时序模拟 timing simulation NxGSs_7
模块化 modularization 3jzmiS]
设计原点 design origin t^|GcU]
优化(设计) optimization (design) iQ8T3cC+
供设计优化坐标轴 predominant axis xhw0YDGzf
表格原点 table origin 'S'Z-7h>0
元件安置 component positioning 6Q~(ibKx
比例因子 scaling factor ~RU-N%Kn
扫描填充 scan filling Dwa.ZY}-
矩形填充 rectangle filling XbYST%|.
填充域 region filling ]z#9)i_l3
实体设计 physical design {9;x\($&a
逻辑设计 logic design pkEx.R)
逻辑电路 logic circuit qbq.r&F&
层次设计 hierarchical design N;|:Ks#!
自顶向下设计 top-down design o56UlN
自底向上设计 bottom-up design OeYZLC(
费用矩阵 cost metrix ;4Wz0suf
元件密度 component density
0 ~^l*
自由度 degrees freedom >mUSRf4
出度 out going degree \}EJtux q
入度 incoming degree m;oCi}fL
曼哈顿距离 manhatton distance DPBWw[
欧几里德距离 euclidean distance ?atHZLF
网络 network w%uM=YmuT
阵列 array Sh;Z\nj
段 segment <gLq?~e|A
逻辑 logic 2"pFAQBw~i
逻辑设计自动化 logic design automation ,UATT]>
分线 separated time X 3(CY`HH[
分层 separated layer
PE&$2(
定顺序 definite sequence G"|c_qX
导线(通道) conduction (track) c-`izn]
导线(体)宽度 conductor width @E%fAC
导线距离 conductor spacing X(qs]:
导线层 conductor layer !vGJ7
导线宽度/间距 conductor line/space ?O.'_YS
第一导线层 conductor layer No.1 >)8<d3m
圆形盘 round pad ;9)A+bD]
方形盘 square pad Q4B(NYEu(
菱形盘 diamond pad ,#8H9<O9t
长方形焊盘 oblong pad (yv)zg9
子弹形盘 bullet pad jm&PGZ#n=R
泪滴盘 teardrop pad 3!Ca b/T
雪人盘 snowman pad AVi,+n
形盘 V-shaped pad V dz,4);Mg
环形盘 annular pad 5-.{RU=
非圆形盘 non-circular pad Mp_SL^g|
隔离盘 isolation pad 5D<"kT
非功能连接盘 monfunctional pad IcUE=J
偏置连接盘 offset land ,nGZ(EBD
腹(背)裸盘 back-bard land (5efNugc
盘址 anchoring spaur 8ps1Q2|
连接盘图形 land pattern .&;:X )
连接盘网格阵列 land grid array dhmrh5Uf
孔环 annular ring .s`7n
*xz
元件孔 component hole t`G<}t
安装孔 mounting hole @jT=SFf
支撑孔 supported hole i/aj;t
非支撑孔 unsupported hole JK^pb0ih
导通孔 via 3 adF) mh
镀通孔 plated through hole (PTH) 5@yBUwMSj
余隙孔 access hole r`A|2(h5B
盲孔 blind via (hole) 6bd{3@
埋孔 buried via hole YE[{Y(5;q
埋,盲孔 buried blind via .Dt.7 G
任意层内部导通孔 any layer inner via hole Cg&:+
全部钻孔 all drilled hole CQI\/oaO
定位孔 toaling hole TQsTL2a
无连接盘孔 landless hole TykY> cl
中间孔 interstitial hole <~P([5
无连接盘导通孔 landless via hole 8
_|"+Ze
引导孔 pilot hole R/ 3#(5
端接全隙孔 terminal clearomee hole mExJ--}
准尺寸孔 dimensioned hole [Page] pL`)^BJ
在连接盘中导通孔 via-in-pad ^9`~-w
孔位 hole location 0*50uK=5
孔密度 hole density yPT\9"/
孔图 hole pattern f1X]zk(=W
钻孔图 drill drawing -|(
q9B
装配图assembly drawing Qo])A6$IU
参考基准 datum referan 9}#9i^%}
1) 元件设备 GpGq' 8|(
BBHoD:l
三绕组变压器:three-column transformer ThrClnTrans C)|#z/"
双绕组变压器:double-column transformer DblClmnTrans ,Laz515
电容器:Capacitor ;-d2~1$
并联电容器:shunt capacitor YfJQ]tt1
电抗器:Reactor LhQidvCNJ
母线:Busbar '[Z.\
输电线:TransmissionLine ^/"2s}+
发电厂:power plant O^<\]_l
断路器:Breaker &C.m*^`^
刀闸(隔离开关):Isolator aT}?-CUxx
分接头:tap }`D-]/T8.
电动机:motor w02t9vz
(2) 状态参数 BTa#}LBZ+
-A)/CFIZ
有功:active power "j% L* J)
无功:reactive power 6d%)MEM
电流:current QI{<q<
容量:capacity &WHK|bl
电压:voltage t2#zQ[~X!
档位:tap position GL'zNQP-
有功损耗:reactive loss ;1L7+.A
无功损耗:active loss N3o
kN8d
功率因数:power-factor zZI7p[A[3
功率:power 0=c:O
功角:power-angle u\P)x~-TM
电压等级:voltage grade ZY-mUg
空载损耗:no-load loss Ops""#Zi
铁损:iron loss T8\%+3e.
铜损:copper loss #u$ Z/,
空载电流:no-load current n%I9l]
阻抗:impedance TDY =!
正序阻抗:positive sequence impedance 8I%N^G
负序阻抗:negative sequence impedance ky0,#ZOF
零序阻抗:zero sequence impedance Wm>AR? b
电阻:resistor Zm#qW2a]P
电抗:reactance Mp)|5<%
电导:conductance F >co#
电纳:susceptance 5HMDug;
无功负载:reactive load 或者QLoad ) kK" 1\m
有功负载: active load PLoad 4!0nM|~
遥测:YC(telemetering) tqT-9sEXX.
遥信:YX hSfLNvK
励磁电流(转子电流):magnetizing current Eumdv#Qg
定子:stator GN
?1dwI
功角:power-angle 8`;3`lZ
上限:upper limit A3mS Sc6
下限:lower limit dX;G[\
并列的:apposable q<!KtI4
高压: high voltage &{(8EvuDd
低压:low voltage u(P;) E"1
中压:middle voltage "U%jG`q
电力系统 power system ybgAyJ{J<
发电机 generator Cd51.Sk(l
励磁 excitation 2Ik@L,
励磁器 excitor ljRR{HOl
电压 voltage 5"8R|NU:\0
电流 current 6v9A7g;4.
母线 bus .Wq"
变压器 transformer *r]Mn~3
升压变压器 step-up transformer )uIHonXU
高压侧 high side tx{tIw^2;
输电系统 power transmission system PbN"+q M
输电线 transmission line +yYSp8>
固定串联电容补偿fixed series capacitor compensation x:WxEw>R
稳定 stability {uuvgFC
电压稳定 voltage stability w-(^w9_e
功角稳定 angle stability I\peO/w
暂态稳定 transient stability XG_Iq ,
电厂 power plant 0A>Fl*
能量输送 power transfer xtP=/B/
交流 AC yyVv@
装机容量 installed capacity lg!{?xM
电网 power system uSi/|
落点 drop point _Q3Ad>,U
开关站 switch station 1F_ 1bAh$
双回同杆并架 double-circuit lines on the same tower Z`lCS
o;
变电站 transformer substation ewb/Z[4
补偿度 degree of compensation hSyA;*)U
高抗 high voltage shunt reactor VIjsz42C
无功补偿 reactive power compensation o4g<[X)
故障 fault 8{Id+Q>Vo,
调节 regulation 6X.lncE@p
裕度 magin W!G2$e6
三相故障 three phase fault Ood'kAH1B
故障切除时间 fault clearing time Ug|o($CY
极限切除时间 critical clearing time Fl^}tC
切机 generator triping YOHYXhc{S
高顶值 high limited value "x$RTuWA9
强行励磁 reinforced excitation Kzd`|+?'`M
线路补偿器 LDC(line drop compensation) -j 6U{l
机端 generator terminal ]
x_WO_
静态 static (state) \PB ~6
动态 dynamic (state) g)Byd\DS
单机无穷大系统 one machine - infinity bus system ,3{z_Rax-
机端电压控制 AVR `+(|$?C u
电抗 reactance ceu}Lp^%/
电阻 resistance #j{!&4M
功角 power angle Eb<iR)e H=
有功(功率) active power "wPFQXU
无功(功率) reactive power a+CHrnU\;
功率因数 power factor Ur]~>-Z
无功电流 reactive current uUczD 8y
下降特性 droop characteristics &)p/cOiV
斜率 slope s2@}01QPo
额定 rating +jD{O @9
变比 ratio 6_wf $(im
参考值 reference value b:}`O!UBw
电压互感器 PT Pe !eID8
分接头 tap @: ~O
下降率 droop rate <(Wa8PY2(
仿真分析 simulation analysis e,}]K'!t
传递函数 transfer function {t$
vsR
框图 block diagram 3?vasL
受端 receive-side A2b
C5lA
裕度 margin I,r 3.2u
同步 synchronization rZy38Wo
失去同步 loss of synchronization o4b!U %
阻尼 damping O\T
摇摆 swing q)ygSOtj
保护断路器 circuit breaker In0kP"
电阻:resistance JqO#W1h~R|
电抗:reactance w49Wl>M
阻抗:impedance |Mp_qg?g
电导:conductance <)zh2UI
电纳:susceptance