1 backplane 背板 x 'mF&^
2 Band gap voltage reference 带隙电压参考 Sc{Tq\t;%
3 benchtop supply 工作台电源 "koo` J
4 Block Diagram 方块图 5 Bode Plot 波特图 a
ea0+,;
6 Bootstrap 自举 x0ne8NDP
7 Bottom FET Bottom FET hkF^?AJ
8 bucket capcitor 桶形电容 \447]<u
9 chassis 机架 ]!faA\1
10 Combi-sense Combi-sense ST%
T =_q
11 constant current source 恒流源 xl,ryc3J
12 Core Sataration 铁芯饱和 .
pP7"E4]
13 crossover frequency 交叉频率 | k}e&Q_/G
14 current ripple 纹波电流 ?Sw /(}|m
15 Cycle by Cycle 逐周期 !5~k:1=
16 cycle skipping 周期跳步 ?BsH{QRYQ
17 Dead Time 死区时间 _Jy,yMQ^[_
18 DIE Temperature 核心温度 |]tZ hI"3<
19 Disable 非使能,无效,禁用,关断 2vvh|?M
20 dominant pole 主极点 yW`e |!
21 Enable 使能,有效,启用 gwq`_/d}
22 ESD Rating ESD额定值 URQ@=W7
23 Evaluation Board 评估板 3HKxYvc C
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. C=[Ae,
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 {2EMz|&8
25 Failling edge 下降沿 t)'dF*L
26 figure of merit 品质因数 ^/<|f,2
27 float charge voltage 浮充电压 sUV>@UMnu
28 flyback power stage 反驰式功率级 LuL$v+`
29 forward voltage drop 前向压降 QoseS/
30 free-running 自由运行 *{nunb>WO
31 Freewheel diode 续流二极管 ib; yu_
32 Full load 满负载 33 gate drive 栅极驱动 oLw|uU-|
34 gate drive stage 栅极驱动级 ZRPy~wy>
35 gerber plot Gerber 图 Xb0!( (A
36 ground plane 接地层 dQK`sLChv
37 Henry 电感单位:亨利 yKlU6t&`
G
38 Human Body Model 人体模式 hLo>R'@uN
39 Hysteresis 滞回 ?S9Nm~vlt
40 inrush current 涌入电流 wHWma)}-z
41 Inverting 反相 ~QCA -Yud
42 jittery 抖动 xU:4Y0y8
43 Junction 结点 6Hl<,(vn
44 Kelvin connection 开尔文连接 <p/MyqZf
45 Lead Frame 引脚框架 +(y>qd
46 Lead Free 无铅 ` yYvYc
47 level-shift 电平移动 #h{Nz/h+
48 Line regulation 电源调整率 xG w?'\
49 load regulation 负载调整率 _aY.
50 Lot Number 批号 :G0+;[?N
51 Low Dropout 低压差 {lMqcK
52 Miller 密勒 53 node 节点 yf?W^{^|
54 Non-Inverting 非反相 DyIV/
55 novel 新颖的 .jaZ|nN8`
56 off state 关断状态 l#ZyB|
57 Operating supply voltage 电源工作电压 y{92Lym
58 out drive stage 输出驱动级 5;(0 $4I
59 Out of Phase 异相 nzWQQra|?
60 Part Number 产品型号 L^)qe^%3
61 pass transistor pass transistor s6/cL|Ex
62 P-channel MOSFET P沟道MOSFET 6i-*N[!U
63 Phase margin 相位裕度 "f<#.}8
64 Phase Node 开关节点 G:DSWW}
65 portable electronics 便携式电子设备 .*:h9AE7vo
66 power down 掉电 jr:drzr{I
67 Power Good 电源正常 oSmjs
68 Power Groud 功率地 _0m}z%rI
69 Power Save Mode 节电模式 7PA=)a\
70 Power up 上电 L&QtHSzy
71 pull down 下拉 oc:x&`j
72 pull up 上拉 M/l95fp
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) s.KOBNCFa
74 push pull converter 推挽转换器 u]0!|Jd0
75 ramp down 斜降 l@#b;M/
76 ramp up 斜升 8:<1|]]
77 redundant diode 冗余二极管 #r(a~
78 resistive divider 电阻分压器 Zikm?(J
79 ringing 振 铃 8;0^'Qr8
80 ripple current 纹波电流 9\:w8M X'
81 rising edge 上升沿 _Qg{ ;
82 sense resistor 检测电阻 C[g&F0 6
83 Sequenced Power Supplys 序列电源 Xj(>.E{~H
84 shoot-through 直通,同时导通 {o {#]fbO%
85 stray inductances. 杂散电感 'z~KTDX
86 sub-circuit 子电路 %uW<
87 substrate 基板 =O,e97
88 Telecom 电信 -CwWs~!
89 Thermal Information 热性能信息 tpE3|5dZF
90 thermal slug 散热片 6kC)\uy
91 Threshold 阈值 i6F P[6H1
92 timing resistor 振荡电阻 a0 qj[+
93 Top FET Top FET 'h k @>"
94 Trace 线路,走线,引线 5uzpTNAMM1
95 Transfer function 传递函数 [|jIC
96 Trip Point 跳变点 ijg,'a~3E
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) IN>TsTo
98 Under Voltage Lock Out (UVLO) 欠压锁定 =O;eY ?
99 Voltage Reference 电压参考 4">84,-N
100 voltage-second product 伏秒积 P^ by'b+zI
101 zero-pole frequency compensation 零极点频率补偿 _4O[[~
102 beat frequency 拍频 Of!|,2`(
103 one shots 单击电路 gl Li
104 scaling 缩放 D8W(CE^}
105 ESR 等效串联电阻 [Page] =w t-YM
106 Ground 地电位 /1U,+g^O>
107 trimmed bandgap 平衡带隙 m[{nm95QZ
108 dropout voltage 压差 =\*S'Ded
109 large bulk capacitance 大容量电容 7~:>WMv9
110 circuit breaker 断路器 dfnX!C~6 \
111 charge pump 电荷泵 eUYG96Jw
112 overshoot 过冲 qgh]@JJh
-g~iE]x6Y
印制电路printed circuit Fv<]mu
印制线路 printed wiring g}^4^88=a
印制板 printed board x>'?IJZ
印制板电路 printed circuit board S".owe$\
印制线路板 printed wiring board s8C:QC
印制元件 printed component ^BQ>vI'.4
印制接点 printed contact *'s&/vEy
印制板装配 printed board assembly @b4b{d5[
板 board MI?]8+l
刚性印制板 rigid printed board 9[B<rz
挠性印制电路 flexible printed circuit <ihhV e
挠性印制线路 flexible printed wiring I):m6y@
齐平印制板 flush printed board 4c~*hMry
金属芯印制板 metal core printed board [<,0A]m
金属基印制板 metal base printed board <1v{[F_
多重布线印制板 mulit-wiring printed board 2nVuz9h
塑电路板 molded circuit board \z<ws&z3`$
散线印制板 discrete wiring board vr5<LNCLQ
微线印制板 micro wire board XT\Td}>
积层印制板 buile-up printed board
zgZi
表面层合电路板 surface laminar circuit A632 :V
埋入凸块连印制板 B2it printed board \;4L~_2$q
载芯片板 chip on board i+kFL$N
埋电阻板 buried resistance board Tey,N^=ek
母板 mother board Tq_1wX'\
子板 daughter board t"jIfU>'a/
背板 backplane })h'""i&xn
裸板 bare board uMljH@xBc
键盘板夹心板 copper-invar-copper board 7/$nA<qM
动态挠性板 dynamic flex board PTfN+
静态挠性板 static flex board yL^M~lws
可断拼板 break-away planel o;Hd W
电缆 cable WMt&8W5
挠性扁平电缆 flexible flat cable (FFC) ]0at2
薄膜开关 membrane switch &6=TtTp"9
混合电路 hybrid circuit XY&]T'A
厚膜 thick film (Q*2dd>
厚膜电路 thick film circuit {m1t~ S
薄膜 thin film UtHmM,*I
薄膜混合电路 thin film hybrid circuit i!/h3%=
互连 interconnection 1t}
(+NNjH
导线 conductor trace line !07FsPI#{
齐平导线 flush conductor eWqVh[
传输线 transmission line VuYWb)@
跨交 crossover U)IsTk~}O
板边插头 edge-board contact A,-[/Z K/
增强板 stiffener 8Iqk%n~(
基底 substrate _"FbjQ"
基板面 real estate Y,<WX
v
导线面 conductor side o}j_eHl{
元件面 component side KBUAdpU8
焊接面 solder side `&"H*
Ie
导电图形 conductive pattern N7Z(lI|a;
非导电图形 non-conductive pattern J7&.>y1%
基材 base material Ynk><0g6
层压板 laminate jSOa
覆金属箔基材 metal-clad bade material wd2P/y42;;
覆铜箔层压板 copper-clad laminate (CCL) J"a2
@S&
复合层压板 composite laminate ZIGbwL
薄层压板 thin laminate X7imUy'.
基体材料 basis material @ B}c4,
预浸材料 prepreg &j
wnM
粘结片 bonding sheet CU7iva
预浸粘结片 preimpregnated bonding sheer ?$`1%Y9
环氧玻璃基板 epoxy glass substrate 3>:zo:;
预制内层覆箔板 mass lamination panel lL(}dbT~N
内层芯板 core material ,i$(yx?
粘结层 bonding layer !pFKC)
粘结膜 film adhesive =_H*fhXS
无支撑胶粘剂膜 unsupported adhesive film p0:&7,+a,
覆盖层 cover layer (cover lay) 8gu7f;H/k
增强板材 stiffener material f0fqDmn
铜箔面 copper-clad surface >k&lGF<nl
去铜箔面 foil removal surface qNuv?.7
层压板面 unclad laminate surface
@zq\z$
基膜面 base film surface @zVBn~=i
胶粘剂面 adhesive faec 0
6G[^
原始光洁面 plate finish Hi4@!]
粗面 matt finish SjNwT[.nr7
剪切板 cut to size panel 2kmna/Qa6
超薄型层压板 ultra thin laminate .-1{,o/&Q
A阶树脂 A-stage resin 6m;wO r
B阶树脂 B-stage resin 5e~{7{
C阶树脂 C-stage resin 2=UTH%1D
环氧树脂 epoxy resin ;MdK3c
酚醛树脂 phenolic resin /n<Ncf
聚酯树脂 polyester resin @Tm0T7C
聚酰亚胺树脂 polyimide resin =:R[gdA#1
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin pN^G[
丙烯酸树脂 acrylic resin QeOt;{_|
三聚氰胺甲醛树脂 melamine formaldehyde resin *F4G qX3
多官能环氧树脂 polyfunctional epoxy resin OB? 79l
溴化环氧树脂 brominated epoxy resin "l2N_xX;
环氧酚醛 epoxy novolac yI)RGOV
氟树脂 fluroresin KI?1(L
硅树脂 silicone resin q}76aa0e
硅烷 silane JwG5#CFu^
聚合物 polymer L^ jC&
dF
无定形聚合物 amorphous polymer ;r@R (Squ
结晶现象 crystalline polamer 3Jk?)Dy
双晶现象 dimorphism l8n[8AT1
共聚物 copolymer TQxc?o
合成树脂 synthetic 5F_:[H =
热固性树脂 thermosetting resin [Page] ^Ihdq89 t
热塑性树脂 thermoplastic resin B#V4
感光性树脂 photosensitive resin V44sNi
环氧值 epoxy value hcqmjqJ
双氰胺 dicyandiamide ]\b1~ki!F
粘结剂 binder gQzJ2LU(
胶粘剂 adesive T;pn -
固化剂 curing agent G QB^
阻燃剂 flame retardant `5 v51TpH
遮光剂 opaquer #L*@~M^]
增塑剂 plasticizers |(8Hk@\CT>
不饱和聚酯 unsatuiated polyester 6s"bstc{
聚酯薄膜 polyester }mS0{rxD4
聚酰亚胺薄膜 polyimide film (PI) B[m{2XzGH
聚四氟乙烯 polytetrafluoetylene (PTFE) 4sD:J-c
增强材料 reinforcing material t;~`Lm@hY
折痕 crease x jUH<LFxy
云织 waviness o4
OEA)k)=
鱼眼 fish eye `\FjO"
毛圈长 feather length fyoB]{$p8
厚薄段 mark l?<z1Acd&
裂缝 split N)I
T?
捻度 twist of yarn arH\QPaka'
浸润剂含量 size content hy`)]>9z~
浸润剂残留量 size residue 7|eSvC
处理剂含量 finish level aiX;D/t?
偶联剂 couplint agent O?J:+L(
断裂长 breaking length ,ce^"yG
吸水高度 height of capillary rise s/&]gj"
湿强度保留率 wet strength retention HkB<RsS$p_
白度 whitenness o)D+qiA3U
导电箔 conductive foil _CwQ}n*
铜箔 copper foil U=#ylQ
压延铜箔 rolled copper foil wdDHRW0Y
光面 shiny side U4I` xw'
粗糙面 matte side N'BctKL
处理面 treated side G(3la3\(
防锈处理 stain proofing w3cK:
C0
双面处理铜箔 double treated foil ]mT}
\b
模拟 simulation : )*Ge3
逻辑模拟 logic simulation ]M"'qC3g
电路模拟 circit simulation 4W-+k
时序模拟 timing simulation T[=cKYp8\
模块化 modularization YqCK#zT/
设计原点 design origin DN{G$$or
优化(设计) optimization (design) 6zZR:ej
供设计优化坐标轴 predominant axis g-gBg\y{v
表格原点 table origin %~(i[Ur;
元件安置 component positioning {hP&P
比例因子 scaling factor S&)
>w5*]U
扫描填充 scan filling +7OT`e
%q
矩形填充 rectangle filling 7Cp_41._
填充域 region filling IGV.0l
实体设计 physical design Afl'-
逻辑设计 logic design 9+Hb`
逻辑电路 logic circuit _%%"Y}
层次设计 hierarchical design Z_WTMs:x!
自顶向下设计 top-down design zW`koRH@
自底向上设计 bottom-up design X[Gk!dr#
费用矩阵 cost metrix GQBN-Qv
元件密度 component density ]lYEJ`
自由度 degrees freedom &nw~gSe
出度 out going degree u(`A?H:
入度 incoming degree ''07Km@x
曼哈顿距离 manhatton distance ;7*@Gf}R
欧几里德距离 euclidean distance 0!
%}
网络 network shvcc
阵列 array <&Xq`i/(
段 segment uL AXN
逻辑 logic 3m7V6##+
逻辑设计自动化 logic design automation l;kZS
分线 separated time -s "$I:v
分层 separated layer o_m.MMEU
定顺序 definite sequence -RDs{c`y%N
导线(通道) conduction (track) 0J</`/g H
导线(体)宽度 conductor width ID+k`nP
导线距离 conductor spacing IomJo
导线层 conductor layer Q
kpmPQK
导线宽度/间距 conductor line/space 8{t&8Ql n
第一导线层 conductor layer No.1 Bz~h-
圆形盘 round pad 3mz>Y*^?0
方形盘 square pad `:O.g9
菱形盘 diamond pad
,^C;1ph
长方形焊盘 oblong pad DK%eFCo<~
子弹形盘 bullet pad T
bWZw
泪滴盘 teardrop pad 4 Z)]Cq*3
雪人盘 snowman pad $O!<Zz
形盘 V-shaped pad V U8z"{
环形盘 annular pad 83*k.]S`
非圆形盘 non-circular pad !WnI`
隔离盘 isolation pad 1]`HX=cl
非功能连接盘 monfunctional pad ]~ UkD*Ct
偏置连接盘 offset land B(dL`]@Xm
腹(背)裸盘 back-bard land FR"^?z?}p
盘址 anchoring spaur KVy5/A/8c
连接盘图形 land pattern 5C?1`-&65V
连接盘网格阵列 land grid array ir#^5e@
孔环 annular ring *X=-^\G
元件孔 component hole Ka{Zoi]
安装孔 mounting hole E1_4\S*z
支撑孔 supported hole 0MPDD%TP
非支撑孔 unsupported hole )>p6h]]a
导通孔 via (B#|3o
镀通孔 plated through hole (PTH) T,>e\
余隙孔 access hole sAlgp2-
盲孔 blind via (hole) RoRVu,1
埋孔 buried via hole TD7ONa-,
埋,盲孔 buried blind via &r%3)Z8Et
任意层内部导通孔 any layer inner via hole DBDfBb
全部钻孔 all drilled hole T7'$A!c
定位孔 toaling hole ^+<uHd>
无连接盘孔 landless hole D IN
PAyY
中间孔 interstitial hole s'I$yJ)@2E
无连接盘导通孔 landless via hole ] plC
引导孔 pilot hole -2_$zk*n
端接全隙孔 terminal clearomee hole 5yI D%
准尺寸孔 dimensioned hole [Page] p.|;
k%c7
在连接盘中导通孔 via-in-pad m
Y0C7i
孔位 hole location UtrbkuT
孔密度 hole density A>puk2 s
孔图 hole pattern .YRSd
钻孔图 drill drawing C-Z,L#
装配图assembly drawing i$bBN$<b<
参考基准 datum referan M-gjS6c\3
1) 元件设备 9n'p 7(s%
+n dyR
三绕组变压器:three-column transformer ThrClnTrans %54![-@
双绕组变压器:double-column transformer DblClmnTrans `fyAV@X
电容器:Capacitor <~OyV5:6
并联电容器:shunt capacitor y]_DW6W
电抗器:Reactor (Q+3aEUE
母线:Busbar :83"t-O8[
输电线:TransmissionLine Zpmy)W]1
发电厂:power plant #UQ[8e
断路器:Breaker Xc^~|%+
刀闸(隔离开关):Isolator k|5nu-B0v
分接头:tap 7Go!W(8
电动机:motor icmDPq
(2) 状态参数 lLhCk>a
*$!LRmp?
有功:active power Ipe; %as#
无功:reactive power #,56vVY
电流:current iJBZnU:Mp
容量:capacity _c2#
电压:voltage ./d ( @@
档位:tap position YaU A}0cW
有功损耗:reactive loss XvdhPOMy
无功损耗:active loss zBbTj IFQ
功率因数:power-factor LHb{9x
功率:power 6D],275`J
功角:power-angle 2wd(0K}b
电压等级:voltage grade v6:DA#0
空载损耗:no-load loss )zN
)7
铁损:iron loss y^Lw7
铜损:copper loss XHr{\/4V
空载电流:no-load current o2~x'*A0I
阻抗:impedance FyEl@ }W
正序阻抗:positive sequence impedance ]^y}}y
负序阻抗:negative sequence impedance =%L^!//c
零序阻抗:zero sequence impedance _MU'he^W
电阻:resistor ( nh!tC
电抗:reactance <T wq{kt
电导:conductance #d~"bn q;c
电纳:susceptance L2qF@!Yy=
无功负载:reactive load 或者QLoad ;%1^k/b6t
有功负载: active load PLoad e([&Nr8h
遥测:YC(telemetering) g:Dg?_o
遥信:YX $sJn:
8z
励磁电流(转子电流):magnetizing current &a`-NRU#
定子:stator ?,j:Y0l.L
功角:power-angle dZW:Cf 9K
上限:upper limit 89paR[
下限:lower limit NQG"}=KA
并列的:apposable bbJa,}R
高压: high voltage vzw\f
低压:low voltage sR6(8
中压:middle voltage `Ao:}
电力系统 power system }DSz_^
发电机 generator O v-I2
励磁 excitation PT;$@q8
励磁器 excitor ^.(]i\V_
电压 voltage 7,1idY%cy
电流 current Z|W=.RdA;
母线 bus %Y@3)
变压器 transformer =9c24j
升压变压器 step-up transformer SCjACQ}-
高压侧 high side *M"wH_cd
输电系统 power transmission system rnr7t \a~]
输电线 transmission line h2q]!01XP
固定串联电容补偿fixed series capacitor compensation ^T5c^ M8o
稳定 stability /Hx\ gtV
电压稳定 voltage stability #'T|,xIr-Q
功角稳定 angle stability U|zW_dj
暂态稳定 transient stability 9qpH 8j+
电厂 power plant @:[/uqL
能量输送 power transfer 0XYxMN)
交流 AC v zn/waw
装机容量 installed capacity C>+UZ
电网 power system gor6c3i
落点 drop point .C#}g
开关站 switch station 9xWrz;tzo
双回同杆并架 double-circuit lines on the same tower Dihk8qJ/6
变电站 transformer substation $*PyzLS
补偿度 degree of compensation gFKQm(0g2
高抗 high voltage shunt reactor gQ?k}D
无功补偿 reactive power compensation D,hl+P{^K
故障 fault O^f@ g l
调节 regulation 0`x<sjG\q
裕度 magin WDZEnauE
三相故障 three phase fault <W?,n%
故障切除时间 fault clearing time 78X;ZMY
极限切除时间 critical clearing time u7/M>YJ`T
切机 generator triping K|B1jdzL
高顶值 high limited value E`i;9e'S
强行励磁 reinforced excitation ?832#a?FZ;
线路补偿器 LDC(line drop compensation) VHJr+BQ1K/
机端 generator terminal Xbz}pAnj
静态 static (state) p?}Rolk7
动态 dynamic (state) &~k/G
单机无穷大系统 one machine - infinity bus system +`[$w<I
机端电压控制 AVR os2yiF",
电抗 reactance +Kk6|+5u
电阻 resistance dWp4|r
功角 power angle ]\jhtC=2
有功(功率) active power ,^+3AT
无功(功率) reactive power F/!C=nS
功率因数 power factor $/D@=Pkc
无功电流 reactive current 5'o.v^l
下降特性 droop characteristics 7
724,+2N
斜率 slope hP7nt
额定 rating B^6P6,
变比 ratio -du+iOe?
参考值 reference value p*^O8o
电压互感器 PT @<};Bo'
分接头 tap UL oTPx@N
下降率 droop rate Tv(s?T6f
仿真分析 simulation analysis PKwx)!
Rz
传递函数 transfer function %o?fE4o'
框图 block diagram ^wX_@?aKtt
受端 receive-side I($u
L@$
裕度 margin ue`F|
同步 synchronization ;BI{v^()s
失去同步 loss of synchronization 9)=as/o
阻尼 damping Jus)cO#I
摇摆 swing {L8SDU{P
保护断路器 circuit breaker ]AN)M>
电阻:resistance m,*f6g
电抗:reactance SkK=VeD>8
阻抗:impedance bT8BJY%+
电导:conductance &Zf@vD
电纳:susceptance