1 backplane 背板 mpwh=
2 Band gap voltage reference 带隙电压参考
'Bt!X^
3 benchtop supply 工作台电源 4j'rbbs/
4 Block Diagram 方块图 5 Bode Plot 波特图 )eZuG S
6 Bootstrap 自举 _/P;`@
7 Bottom FET Bottom FET 8o,0='U
8 bucket capcitor 桶形电容 J7{D6@yLS
9 chassis 机架 CHqi5Z/+
10 Combi-sense Combi-sense 4PS|
11 constant current source 恒流源 Wy6a4oY
12 Core Sataration 铁芯饱和 q$v0sTk0Y
13 crossover frequency 交叉频率 #huh!Mn
14 current ripple 纹波电流 \+U;$.)3
15 Cycle by Cycle 逐周期 9&^5!R8
16 cycle skipping 周期跳步 IpzU=+h
17 Dead Time 死区时间 :f7!?^;y>
18 DIE Temperature 核心温度 \A\?7#9\
19 Disable 非使能,无效,禁用,关断 y[jp)&N`
20 dominant pole 主极点 "X?Zw$gRud
21 Enable 使能,有效,启用 jYAm}_?No
22 ESD Rating ESD额定值 jb/C\2U4)
23 Evaluation Board 评估板 oo]P}ra
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. DU*qhW`X
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 yNwSiZE X
25 Failling edge 下降沿 CcV@YST?
26 figure of merit 品质因数 751Qi
27 float charge voltage 浮充电压 #>~A-k)
28 flyback power stage 反驰式功率级 +Gy9K
29 forward voltage drop 前向压降 bY,dWNS:
30 free-running 自由运行 t Jtp1$h
31 Freewheel diode 续流二极管 _RzoXn{1e
32 Full load 满负载 33 gate drive 栅极驱动 G^L9[c= ,
34 gate drive stage 栅极驱动级 A`(Cuw-o
35 gerber plot Gerber 图 ;cL+=!
36 ground plane 接地层 rB(Q)N
37 Henry 电感单位:亨利 8>vNa
38 Human Body Model 人体模式 :D2GLq *\
39 Hysteresis 滞回 Jz&dC
40 inrush current 涌入电流 FoYs<aER
41 Inverting 反相 4V]xVma
42 jittery 抖动 Xooh00
43 Junction 结点 9"B;o
44 Kelvin connection 开尔文连接 1v3
45 Lead Frame 引脚框架 X>yE<ni
46 Lead Free 无铅 _E-{*,7bZS
47 level-shift 电平移动 gLo&~|=L-
48 Line regulation 电源调整率 "<&o;x<
49 load regulation 负载调整率 I~"l9Jc!"
50 Lot Number 批号 Ym
-U{a
51 Low Dropout 低压差 u0[O /G
52 Miller 密勒 53 node 节点 /K+;HAUTn
54 Non-Inverting 非反相 4>Q] \\Lc
55 novel 新颖的 ]5ibg"{S
56 off state 关断状态 ^Nav8dma
57 Operating supply voltage 电源工作电压 B<@a&QBTg
58 out drive stage 输出驱动级 0T$ `;~
59 Out of Phase 异相 }+[!h=Bx
60 Part Number 产品型号 X^m@*,[s
61 pass transistor pass transistor
#^-'q`)
62 P-channel MOSFET P沟道MOSFET U&$I!80.
63 Phase margin 相位裕度 chuJj
IY
64 Phase Node 开关节点 [5b[ztN%
65 portable electronics 便携式电子设备 s1%2({wP
66 power down 掉电 !+UXu]kA
67 Power Good 电源正常 iztF
68 Power Groud 功率地 2Qp]r+!
69 Power Save Mode 节电模式 @k:@mzB7R
70 Power up 上电 .'-t>(}v
71 pull down 下拉 NY[48H
72 pull up 上拉 <X97W\
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ~g~`,:Qc
74 push pull converter 推挽转换器 bhZ5-wo4%
75 ramp down 斜降 W^H[rX}=
76 ramp up 斜升 :2{ [f+
77 redundant diode 冗余二极管 cIuCuh0I`
78 resistive divider 电阻分压器 FklO#+<:
79 ringing 振 铃 +$^[r
80 ripple current 纹波电流 6p,}?6^
81 rising edge 上升沿 2|M,#2E-
82 sense resistor 检测电阻 r"5\\ qf5*
83 Sequenced Power Supplys 序列电源 ]<fZW"W<q
84 shoot-through 直通,同时导通
pG /g
85 stray inductances. 杂散电感 AZJ|.mV q
86 sub-circuit 子电路 _B}QS"A
87 substrate 基板 ~~ty9;KYL
88 Telecom 电信 c8cGIAOY)
89 Thermal Information 热性能信息 |ew:}e: k<
90 thermal slug 散热片 L#_QrR6Sny
91 Threshold 阈值 "MOmJYH
92 timing resistor 振荡电阻 SQw"mO
93 Top FET Top FET Z>'hNj)ju
94 Trace 线路,走线,引线 h{E9rc1,
95 Transfer function 传递函数 j8t_-sU9 i
96 Trip Point 跳变点 7H[.o~\
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) u,@x7a,z
98 Under Voltage Lock Out (UVLO) 欠压锁定 @Z~0!VY
99 Voltage Reference 电压参考 ^DR`!.ttr
100 voltage-second product 伏秒积 /Dk`?
101 zero-pole frequency compensation 零极点频率补偿 QVR-`d/
102 beat frequency 拍频 `[f IK,
103 one shots 单击电路 =Ajw(I[56
104 scaling 缩放 a'\fS7aE0l
105 ESR 等效串联电阻 [Page] Vao3D8
106 Ground 地电位 D_I_=0qNd
107 trimmed bandgap 平衡带隙 _3_o/I
108 dropout voltage 压差 IBv9xP]BZ
109 large bulk capacitance 大容量电容 s3 gT6
110 circuit breaker 断路器 xx%*85 <
111 charge pump 电荷泵 bEzy KrN\
112 overshoot 过冲 T:udw
:UsNiR=l
印制电路printed circuit )$FwB6^
印制线路 printed wiring (K>4^E8
印制板 printed board E`3[62C
印制板电路 printed circuit board UrB{jS?
印制线路板 printed wiring board _d3/="=
印制元件 printed component *IC9))PGJ
印制接点 printed contact }nNCgH
印制板装配 printed board assembly e&="5.ik
板 board "1$hfs
刚性印制板 rigid printed board ?u M2|Nk
挠性印制电路 flexible printed circuit Ob7F39):N
挠性印制线路 flexible printed wiring xV5eKV
齐平印制板 flush printed board fTA%HsvU:
金属芯印制板 metal core printed board uTUkRqtD!
金属基印制板 metal base printed board ?s{Pp
多重布线印制板 mulit-wiring printed board J.npv1F
塑电路板 molded circuit board QPwUW
散线印制板 discrete wiring board l,M?
微线印制板 micro wire board I!,FxOM|$
积层印制板 buile-up printed board >1d`G%KfG
表面层合电路板 surface laminar circuit c
]&|.~2 &
埋入凸块连印制板 B2it printed board z4c{W~}`
载芯片板 chip on board / CVhvK
埋电阻板 buried resistance board Y-c_ 2 )
母板 mother board t{ScK%S6
子板 daughter board `Jon^&^;|
背板 backplane ^Zw1X6C5~
裸板 bare board XhJbBVS|
键盘板夹心板 copper-invar-copper board i!EN/Bd
动态挠性板 dynamic flex board Ea[K$NC)#
静态挠性板 static flex board ]W 6!Xw)[
可断拼板 break-away planel "EC,#$e%ev
电缆 cable IG~d7rh"
挠性扁平电缆 flexible flat cable (FFC) C)`y<O
薄膜开关 membrane switch WMd5Y`y
混合电路 hybrid circuit FQCz_z
厚膜 thick film D[ (A`!)
厚膜电路 thick film circuit ;3WVrYe
薄膜 thin film L+y90 T6?
薄膜混合电路 thin film hybrid circuit '\.fG\xD
互连 interconnection {kgV3 [%>
导线 conductor trace line F2RU7o'f.
齐平导线 flush conductor 3 ]}wZY0
传输线 transmission line &'-ze,k}
跨交 crossover s@ vHU4
板边插头 edge-board contact 7LY4q/
增强板 stiffener v9s/!<j
基底 substrate =E''$b?Em
基板面 real estate !r*Ogv[
导线面 conductor side %-eags~sUC
元件面 component side Fm3B8Int
焊接面 solder side H$i4OQ2
导电图形 conductive pattern VdV18-ea
非导电图形 non-conductive pattern =tE7XC3X_
基材 base material yb:Xjg7
层压板 laminate B'Ll\<mq@
覆金属箔基材 metal-clad bade material 2-*zevPiG=
覆铜箔层压板 copper-clad laminate (CCL) V.*0k~
复合层压板 composite laminate
*CtOQ
薄层压板 thin laminate 'XHKhpm<
基体材料 basis material .A`Q!
预浸材料 prepreg 9'|NF<
粘结片 bonding sheet c~a:i=y67
预浸粘结片 preimpregnated bonding sheer @] `_+\y
环氧玻璃基板 epoxy glass substrate 0"_FQv
预制内层覆箔板 mass lamination panel xi2!__
内层芯板 core material jKI0d+U
粘结层 bonding layer Z;bg;@r|
粘结膜 film adhesive pIy+3&\e;
无支撑胶粘剂膜 unsupported adhesive film Hki
覆盖层 cover layer (cover lay) fH/J8<
增强板材 stiffener material 3"Y
|RSy
铜箔面 copper-clad surface 4iiW{rh4
去铜箔面 foil removal surface ir%?J&C+t
层压板面 unclad laminate surface ?UlAwxn
基膜面 base film surface bZ.q?Hlfk
胶粘剂面 adhesive faec OTNcNY
原始光洁面 plate finish ,Mp/Y>f
粗面 matt finish 11s*C #
剪切板 cut to size panel D/1f>sl
超薄型层压板 ultra thin laminate ,s*-2Sz
A阶树脂 A-stage resin s6|EvIVM
B阶树脂 B-stage resin Rs<li\GS
C阶树脂 C-stage resin G/:;Qig
环氧树脂 epoxy resin +&7D
;wj=
酚醛树脂 phenolic resin (c<MyuWb
聚酯树脂 polyester resin l H@hV
聚酰亚胺树脂 polyimide resin '<.@a"DnJ
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin yrnIQu*Uu
丙烯酸树脂 acrylic resin n9}3>~ll
三聚氰胺甲醛树脂 melamine formaldehyde resin k/&~8l.$
多官能环氧树脂 polyfunctional epoxy resin n -P)X<\
溴化环氧树脂 brominated epoxy resin fP>*EDn@xg
环氧酚醛 epoxy novolac f?OFMac
氟树脂 fluroresin Yz?4eSa/
硅树脂 silicone resin j`GL#J[wqQ
硅烷 silane b'Scoa7@'
聚合物 polymer t7"vAjZU
无定形聚合物 amorphous polymer y Q_lJIX
结晶现象 crystalline polamer lj{J w.t
双晶现象 dimorphism aB6F<"L,
共聚物 copolymer 2nL[P#r
合成树脂 synthetic dVh* a
热固性树脂 thermosetting resin [Page] Hp2ysU
热塑性树脂 thermoplastic resin ?=X G#we
感光性树脂 photosensitive resin o\oS_f:RD
环氧值 epoxy value bnb:4?d]
双氰胺 dicyandiamide DM3W99PWA
粘结剂 binder D\}A{I92F4
胶粘剂 adesive |#p`mc%f~\
固化剂 curing agent `@$qy&AJ
阻燃剂 flame retardant UE2!,Z,
遮光剂 opaquer b'1n1L
增塑剂 plasticizers kf3 u',}R
不饱和聚酯 unsatuiated polyester <<,YgRl2
聚酯薄膜 polyester afVl)2h
聚酰亚胺薄膜 polyimide film (PI) i$GL]0
聚四氟乙烯 polytetrafluoetylene (PTFE) o(=\FNe
增强材料 reinforcing material z@Klj qN
折痕 crease T)ZO+}
云织 waviness 8[zux 4<m
鱼眼 fish eye JVPl\I
毛圈长 feather length v##k,R.d
厚薄段 mark ]!JUiFj"uD
裂缝 split #bz#&vt$
捻度 twist of yarn O_yk<
浸润剂含量 size content j06q3N"
浸润剂残留量 size residue q2o`.f+I
处理剂含量 finish level N,Fmu
偶联剂 couplint agent ^EK]z8;|
断裂长 breaking length jea{BhdUr
吸水高度 height of capillary rise lr>P/W\
湿强度保留率 wet strength retention 8.9Z0
白度 whitenness ;7jszs.6%
导电箔 conductive foil yfq Vx$YL
铜箔 copper foil zGDLF`
压延铜箔 rolled copper foil Q{s9{
光面 shiny side `QpkD8
粗糙面 matte side -@6R`m=>
处理面 treated side 7r F )fKW
防锈处理 stain proofing qD@]FEw!O
双面处理铜箔 double treated foil 0X.(BRI~6p
模拟 simulation O;bnyB$
逻辑模拟 logic simulation E}7@?o7u}
电路模拟 circit simulation |@6t"P ]@
时序模拟 timing simulation cPFs K*w
模块化 modularization }XJA#@
设计原点 design origin 3}:(.K
优化(设计) optimization (design) g4Y1*`}2f
供设计优化坐标轴 predominant axis ]LcCom:]
表格原点 table origin b0QC91
元件安置 component positioning %\i
OX|F_
比例因子 scaling factor Q L0
扫描填充 scan filling {5%u G2g
矩形填充 rectangle filling FTVV+9.l:
填充域 region filling s7"NK"
实体设计 physical design Pv- i.
逻辑设计 logic design eflmD$]SW
逻辑电路 logic circuit w"A.*8Iu
层次设计 hierarchical design zv~dW4'
自顶向下设计 top-down design i?{cB!7
自底向上设计 bottom-up design z(00"ei
费用矩阵 cost metrix F(!9;O5J]
元件密度 component density /0.m|Th'm
自由度 degrees freedom {WYJQKs8
出度 out going degree cdBD.sg
入度 incoming degree ZGa;'
曼哈顿距离 manhatton distance fJiY~mQ
欧几里德距离 euclidean distance HLlp+;CF><
网络 network `>i8$q%
阵列 array Kc3BVZ71
段 segment 8@$`'h^6
逻辑 logic z CS.P.$
逻辑设计自动化 logic design automation 4l2/eh]Hc(
分线 separated time xF/u('A
分层 separated layer <5 ?
定顺序 definite sequence -:$#koW
导线(通道) conduction (track) *VuiEBG
导线(体)宽度 conductor width |TQ#[9C0
导线距离 conductor spacing iE6?Px9]
导线层 conductor layer nzcXL
=^r3
导线宽度/间距 conductor line/space e&R?9z-*
第一导线层 conductor layer No.1 Oq`CK f
圆形盘 round pad Lrrc&;
方形盘 square pad PLb[U(~
菱形盘 diamond pad k_o$ Ci
长方形焊盘 oblong pad 8q}955Nl
子弹形盘 bullet pad xWiR7~E
泪滴盘 teardrop pad ~W>3EJghR,
雪人盘 snowman pad v,[E*qMN
形盘 V-shaped pad V |E}-j;(
环形盘 annular pad q6]T;)U&
非圆形盘 non-circular pad Rj'Tu0l
隔离盘 isolation pad ehpU`vQz
非功能连接盘 monfunctional pad rk E;OU
偏置连接盘 offset land -eQ>3x&3r
腹(背)裸盘 back-bard land ^uV=|1<%
盘址 anchoring spaur }wIF$v?M
连接盘图形 land pattern ^o LMgz
连接盘网格阵列 land grid array "hbCP4
孔环 annular ring B7 #O>a
元件孔 component hole p.ks
jD
安装孔 mounting hole S/2lK*F
支撑孔 supported hole Qo5yfdR
非支撑孔 unsupported hole +~7x+6E
导通孔 via p0|PVn.^h
镀通孔 plated through hole (PTH) ja-,6*"k
余隙孔 access hole _?I6[Mz
盲孔 blind via (hole) aA6m5
埋孔 buried via hole j=up7395
埋,盲孔 buried blind via k9*6`w
任意层内部导通孔 any layer inner via hole <K:L.c!
全部钻孔 all drilled hole !>8/Xz~-
定位孔 toaling hole gj@>9
无连接盘孔 landless hole ty>9i]Y-
中间孔 interstitial hole \dHdL\f
无连接盘导通孔 landless via hole ,Qh9}I7;C
引导孔 pilot hole hU~up a<dD
端接全隙孔 terminal clearomee hole ?^by3\,VZ
准尺寸孔 dimensioned hole [Page] d(_;@%p1X
在连接盘中导通孔 via-in-pad N|3a(mtiZ'
孔位 hole location PiVp(; rtQ
孔密度 hole density O:{N5+HVG
孔图 hole pattern [W8"Mc|ve
钻孔图 drill drawing ev[!:*6P
装配图assembly drawing ml1My1
参考基准 datum referan
B;A< pNT
1) 元件设备 UfNcI[xr
"<$JU@P
三绕组变压器:three-column transformer ThrClnTrans Ywo=w:'
双绕组变压器:double-column transformer DblClmnTrans !CUy{nV
电容器:Capacitor }? :T*CJ
并联电容器:shunt capacitor XEL~y
电抗器:Reactor .P(Ax:g
母线:Busbar hcT5> w[
输电线:TransmissionLine V2B:
DIpr
发电厂:power plant i$g6C
断路器:Breaker ,opS)C$
刀闸(隔离开关):Isolator 9TUB3x^
分接头:tap m5%E1k$=
电动机:motor d9.I83SS
(2) 状态参数 ^fEer
\GdsQAF"
有功:active power ]A,Og_g
无功:reactive power ):st-I!o
电流:current Ro.br:'Bw
容量:capacity mum4Uj
电压:voltage 9!,f4&G`
档位:tap position ayZWt| iHA
有功损耗:reactive loss 8FJPw"9
无功损耗:active loss ,CP&o
功率因数:power-factor ?2<V./2F
功率:power I~&*8)xM
功角:power-angle Fvr$K*u
电压等级:voltage grade ,aU8.
J_U
空载损耗:no-load loss 1UN$eb7
铁损:iron loss >f:OU,"
铜损:copper loss .F]"%RK[
空载电流:no-load current ja%IGaH;s
阻抗:impedance 3Lm7{s?=Z-
正序阻抗:positive sequence impedance V5!mV_EoR@
负序阻抗:negative sequence impedance (L,>P`CR6
零序阻抗:zero sequence impedance a\xf\$Ym
电阻:resistor yaK4% k
电抗:reactance =p \eh?^
电导:conductance Gxw>.O){
电纳:susceptance Ih%LKFT
无功负载:reactive load 或者QLoad M!O &\2Q
有功负载: active load PLoad =PmIrvr'[5
遥测:YC(telemetering) ,F?O} ijk
遥信:YX 3z!^UA>q
励磁电流(转子电流):magnetizing current 9D
@}(t!
定子:stator ;BW-ag \9
功角:power-angle LYMb)=u]
上限:upper limit D%h_V>#z
下限:lower limit S20E}bS:>
并列的:apposable `e}6/~R`
高压: high voltage Wo,fHY
低压:low voltage <]u]rZc$
中压:middle voltage a9p6[qOcd
电力系统 power system 3|vZ`}
发电机 generator ]Vd1fkXO0
励磁 excitation {TC_
4Y|8
励磁器 excitor qR^i5JH}u
电压 voltage DC,]FmWs!+
电流 current GQ1m
h*4$
母线 bus )'e9(4[V1
变压器 transformer o(Q='kK
升压变压器 step-up transformer AxiCpAS;J
高压侧 high side Yzih-$g
输电系统 power transmission system )WbE -m
输电线 transmission line fK5iOj'Q
固定串联电容补偿fixed series capacitor compensation D*q:XO6b
稳定 stability xj.)iegQ
电压稳定 voltage stability f4+}k GJN
功角稳定 angle stability M<3m/l%`Y
暂态稳定 transient stability &` weW
电厂 power plant M%N_4j.
能量输送 power transfer r&O:Bt}x
交流 AC H 2UR
装机容量 installed capacity nm
!H<
电网 power system 7=@MnF`
落点 drop point 9I*i/fa
开关站 switch station NqZR*/BOz
双回同杆并架 double-circuit lines on the same tower J85Kgd1
\a
变电站 transformer substation 8@BN6
补偿度 degree of compensation ~MZ.988:<
高抗 high voltage shunt reactor ^A;(#5A]7
无功补偿 reactive power compensation
4d )Q
故障 fault RLUH[[
调节 regulation =d1R9O
裕度 magin i`vgD<}
三相故障 three phase fault 1/vcj~|)t
故障切除时间 fault clearing time Z=y^9]
极限切除时间 critical clearing time
?ubIh.d
切机 generator triping )jaNFJ
3
高顶值 high limited value \t+q1S1
强行励磁 reinforced excitation 9|&%"~6'
线路补偿器 LDC(line drop compensation) TDjjaO
机端 generator terminal nY=]KU
静态 static (state) uJ>_
2
动态 dynamic (state) f*GdHUZ*
单机无穷大系统 one machine - infinity bus system q@&.)sLPgO
机端电压控制 AVR ,?>:Cdz4
电抗 reactance l@nG?l #
电阻 resistance zoO9N oUHW
功角 power angle h2fTG
有功(功率) active power uY*|bD`6&
无功(功率) reactive power ]{E{ IW8
功率因数 power factor bhc
.UmH
无功电流 reactive current #e(P~'A0
下降特性 droop characteristics X~5kgq0"
斜率 slope I\oI"\}U
额定 rating pxO?:B
变比 ratio :Y>M//0
参考值 reference value eWwI@ASaA
电压互感器 PT yct^AN|%
分接头 tap .~fAcc{Qj
下降率 droop rate *Wmn!{\g
仿真分析 simulation analysis 0G"I}Jp{
传递函数 transfer function 7K}Sk
框图 block diagram f3Cjj]RFv
受端 receive-side $l!+SLK
裕度 margin 9t^Q_ [hG
同步 synchronization Q)b*;
@
失去同步 loss of synchronization ~i)IY1m"
阻尼 damping qOd*9AS'|M
摇摆 swing PgF7ug%,@C
保护断路器 circuit breaker 6KzdWT
电阻:resistance f MDM\&f
电抗:reactance VvTs87
阻抗:impedance H3Z"u
电导:conductance v5!G/TZ1
电纳:susceptance