1 backplane 背板 (nrrzOax
2 Band gap voltage reference 带隙电压参考 x
0
3 benchtop supply 工作台电源 | 4I x2GD
4 Block Diagram 方块图 5 Bode Plot 波特图 |Z;wk&
6 Bootstrap 自举 GtO5,d_
7 Bottom FET Bottom FET 2vnzB8"k
8 bucket capcitor 桶形电容 E|9LUPcb
9 chassis 机架 hkgPC-
10 Combi-sense Combi-sense v%<_Mh
11 constant current source 恒流源 t%z7#}9$
12 Core Sataration 铁芯饱和 [6S"iNiyKT
13 crossover frequency 交叉频率 =X X_Cnn
14 current ripple 纹波电流 bT-G<h*M
15 Cycle by Cycle 逐周期 lSyp
k-c
16 cycle skipping 周期跳步 zs"AYxr
17 Dead Time 死区时间 "tIf$z
18 DIE Temperature 核心温度 -R'p^cMA
19 Disable 非使能,无效,禁用,关断 UKK}$B
20 dominant pole 主极点 g}^/8rW
21 Enable 使能,有效,启用 e(
^9fg_SG
22 ESD Rating ESD额定值 ,:\2Lf
23 Evaluation Board 评估板 &up/`8
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. *Kzs(O
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ga^<_;5<
25 Failling edge 下降沿 0]oQ08
26 figure of merit 品质因数 :=L[kzX
27 float charge voltage 浮充电压 pjj
5
28 flyback power stage 反驰式功率级 E2*"~gL^,
29 forward voltage drop 前向压降 SbnVU[
30 free-running 自由运行 P'9aZd
31 Freewheel diode 续流二极管 J#V`W&\,6
32 Full load 满负载 33 gate drive 栅极驱动 IVNNiNN*5
34 gate drive stage 栅极驱动级 ?XOeMI
35 gerber plot Gerber 图 }2c}y7B,_
36 ground plane 接地层 c0G/irK
37 Henry 电感单位:亨利 <M'IRf/D
38 Human Body Model 人体模式 aJ)5 DlfLR
39 Hysteresis 滞回 [!R%yD;
40 inrush current 涌入电流 qk,cp},2K
41 Inverting 反相 T (2,iG8
42 jittery 抖动 }BogE$tc
43 Junction 结点 "}HQ)54&
44 Kelvin connection 开尔文连接 W=EO=}l#
45 Lead Frame 引脚框架 8&C(0H]1
46 Lead Free 无铅 +~fu-%,k
47 level-shift 电平移动 (Z"Xp{u
48 Line regulation 电源调整率 ESrWRO
f9
49 load regulation 负载调整率 E7eVg*Cvi
50 Lot Number 批号 `f'q /
51 Low Dropout 低压差 5ZKnxEW,(
52 Miller 密勒 53 node 节点 ewY[vbF
54 Non-Inverting 非反相 CLk Ve
55 novel 新颖的
^,KR 0
56 off state 关断状态 u3. PHZ
57 Operating supply voltage 电源工作电压 ai`:HhE
58 out drive stage 输出驱动级 F{"%ey">
59 Out of Phase 异相 I@S<D"af
60 Part Number 产品型号 F>b6fUtR
61 pass transistor pass transistor -KNJCcBJ
62 P-channel MOSFET P沟道MOSFET E7h}0DX
63 Phase margin 相位裕度 Qx,G3m[}
64 Phase Node 开关节点 p 5o;Rvr
65 portable electronics 便携式电子设备 &V:dcJ^Q
66 power down 掉电 ;:e,C@Fm
67 Power Good 电源正常 R]Yhuo9,&n
68 Power Groud 功率地 nDOIE)#
69 Power Save Mode 节电模式 Y@4vQm+
70 Power up 上电 )ED[cYGx
71 pull down 下拉 hrL<jcv|
72 pull up 上拉 V0AX1?H~ w
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) m5p~>]}fYF
74 push pull converter 推挽转换器 eLYFd,?9
75 ramp down 斜降 *=7[Ip<X
76 ramp up 斜升 %xfy\of+Nk
77 redundant diode 冗余二极管 Vx*q'~4y!|
78 resistive divider 电阻分压器 ;dFe >`~
79 ringing 振 铃 $ vjmW!
O
80 ripple current 纹波电流 $ B9=v
81 rising edge 上升沿 Yq^y"rw
82 sense resistor 检测电阻 ~ 9;GD4
83 Sequenced Power Supplys 序列电源 JgB# EoF
84 shoot-through 直通,同时导通 ~?&ijhZ
85 stray inductances. 杂散电感 f5a](&
86 sub-circuit 子电路 b
tu:@s8ci
87 substrate 基板 6-=_i)kzq
88 Telecom 电信 EC~t'v
89 Thermal Information 热性能信息 l17ZNDzLU
90 thermal slug 散热片 qc6IH9i`
91 Threshold 阈值 V3o AZ34)
92 timing resistor 振荡电阻 *[5
93 Top FET Top FET :65HMWy.
94 Trace 线路,走线,引线 @,MdvR+a
95 Transfer function 传递函数 eFio,
96 Trip Point 跳变点 E%^28}dN
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 0uz"}v)
98 Under Voltage Lock Out (UVLO) 欠压锁定 <n\.S
99 Voltage Reference 电压参考 [KH?5C
100 voltage-second product 伏秒积 mvgm o
101 zero-pole frequency compensation 零极点频率补偿 I5L7BTe
102 beat frequency 拍频 u,m-6@il
103 one shots 单击电路 vs. uq
104 scaling 缩放 [tzSr=,Cg
105 ESR 等效串联电阻 [Page] !T*B{+|
106 Ground 地电位 #FB>}:L{h*
107 trimmed bandgap 平衡带隙 W\,lII0
108 dropout voltage 压差 0'hx w3#
109 large bulk capacitance 大容量电容 .NT&>X~.V
110 circuit breaker 断路器 gn"&/M9E
111 charge pump 电荷泵 yU|ji?)e
112 overshoot 过冲 ?X'*
p<`
k^pu1g=6I
印制电路printed circuit A7C+&I!L
印制线路 printed wiring 2mZ/
3u
印制板 printed board 6Qb)Uq3}]
印制板电路 printed circuit board *$(CiyF!
印制线路板 printed wiring board pU ]{Z(
印制元件 printed component l,u{:JC
印制接点 printed contact #0u69
印制板装配 printed board assembly {0e{!v
板 board -mJ&N
刚性印制板 rigid printed board } qv-lO
挠性印制电路 flexible printed circuit dCP Tpm
挠性印制线路 flexible printed wiring 6B/"M-YME
齐平印制板 flush printed board 9Nu#&_2R
金属芯印制板 metal core printed board Q)BoWd
金属基印制板 metal base printed board 5"am>$rh
多重布线印制板 mulit-wiring printed board #L.}CzAz
塑电路板 molded circuit board pqN[G=0
散线印制板 discrete wiring board A9UaLSe
微线印制板 micro wire board 0juIkN#
积层印制板 buile-up printed board t!SQLgA
表面层合电路板 surface laminar circuit TDIOK
埋入凸块连印制板 B2it printed board iT5SuIv
载芯片板 chip on board -Y=c g;
埋电阻板 buried resistance board Zk#i9[g9*
母板 mother board bM^A9BxD
子板 daughter board 5?L:8kHsH
背板 backplane 0~b6wuFl
裸板 bare board kQd[E-b7
键盘板夹心板 copper-invar-copper board &NjZD4m`=
动态挠性板 dynamic flex board 8ex:OTzn|
静态挠性板 static flex board Y"kS!!C>[
可断拼板 break-away planel P .4b+9Tx
电缆 cable "!Oh#Vf
挠性扁平电缆 flexible flat cable (FFC) ;9p5YxD
薄膜开关 membrane switch ,DuZMGg
混合电路 hybrid circuit .cS,T<$
厚膜 thick film pt%~,M _
厚膜电路 thick film circuit q4GW=@eD
薄膜 thin film @GZa:(
薄膜混合电路 thin film hybrid circuit B"8JFf}"q
互连 interconnection T:%wX9W
导线 conductor trace line liw 9:@+V
齐平导线 flush conductor &tz%WW%D8
传输线 transmission line
e1^{
跨交 crossover *DCNu{6
板边插头 edge-board contact O;BMwg_7
增强板 stiffener !BQ ELB$0
基底 substrate 0S:!Gv+
基板面 real estate W|rFl]~a
导线面 conductor side # 1dTM-
元件面 component side %r
焊接面 solder side
_Kl{50}]
导电图形 conductive pattern O<Sc.@~
非导电图形 non-conductive pattern CDwIq>0j
基材 base material h}`&]2|]
层压板 laminate ok%a|Zz+]
覆金属箔基材 metal-clad bade material }Q r0T
覆铜箔层压板 copper-clad laminate (CCL) %{~mk[d3
复合层压板 composite laminate D0y,TF
薄层压板 thin laminate },EUcVXk
基体材料 basis material _h=<_Z
预浸材料 prepreg F `pyhc>1;
粘结片 bonding sheet BRU9LS
预浸粘结片 preimpregnated bonding sheer b8{h[YJL2
环氧玻璃基板 epoxy glass substrate U~#^ ^
预制内层覆箔板 mass lamination panel .)^3t~
内层芯板 core material G<u.+V
粘结层 bonding layer O{ %A&Ui
粘结膜 film adhesive ;TV'PJ
无支撑胶粘剂膜 unsupported adhesive film 9HNh*Gc=
覆盖层 cover layer (cover lay) ghobu}wuF
增强板材 stiffener material "Eok;io
铜箔面 copper-clad surface IJ_'w[k
去铜箔面 foil removal surface %YvSHh;c
层压板面 unclad laminate surface 9u7n/o&8v6
基膜面 base film surface AYPf)K;%
胶粘剂面 adhesive faec !: EW21m
原始光洁面 plate finish dJQ }{,+6
粗面 matt finish ttbQergS
剪切板 cut to size panel {F(-s"1;xO
超薄型层压板 ultra thin laminate 7\0|`{|R@
A阶树脂 A-stage resin Y6f+__O
B阶树脂 B-stage resin q(&^9"
C阶树脂 C-stage resin q0b`HD
环氧树脂 epoxy resin (J^Lqh_
酚醛树脂 phenolic resin ?`T6CRZhr
聚酯树脂 polyester resin 71L\t3fG
聚酰亚胺树脂 polyimide resin rq'##`H
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 6Y>,e;R
丙烯酸树脂 acrylic resin k;K>
,$F
三聚氰胺甲醛树脂 melamine formaldehyde resin TM/|K|_
多官能环氧树脂 polyfunctional epoxy resin jsqUMy-
溴化环氧树脂 brominated epoxy resin ^`TKvcgIc
环氧酚醛 epoxy novolac QSn;a 4f
氟树脂 fluroresin Z}LOy^TL
硅树脂 silicone resin c_-" Qo
硅烷 silane HoIKx_
聚合物 polymer hk"9D<&i>b
无定形聚合物 amorphous polymer &3 XFgHo
结晶现象 crystalline polamer "
g0-u(Y
双晶现象 dimorphism
CSG+bqUG
共聚物 copolymer s.p1L
合成树脂 synthetic _Qm7x>NT4
热固性树脂 thermosetting resin [Page] `uNvFlP
热塑性树脂 thermoplastic resin y?*[}S
感光性树脂 photosensitive resin >ggk>s|
环氧值 epoxy value %2Xus9;k#
双氰胺 dicyandiamide j1;_w
粘结剂 binder U!a!|s>
胶粘剂 adesive c#\ah}]Vo
固化剂 curing agent 1IOo?e=/bM
阻燃剂 flame retardant 8u:v:>D.'
遮光剂 opaquer 0.J1!RIK/
增塑剂 plasticizers Xc8= 2n
不饱和聚酯 unsatuiated polyester )tN?: l
聚酯薄膜 polyester fW5"4,
聚酰亚胺薄膜 polyimide film (PI) &prdlh=UE
聚四氟乙烯 polytetrafluoetylene (PTFE) ]/ZA/:Oa+
增强材料 reinforcing material $tDCS
折痕 crease cotxo?)Zv
云织 waviness B&4fYpn
鱼眼 fish eye B91S
h`
毛圈长 feather length 5T$9'5V7
厚薄段 mark iioct_7,g<
裂缝 split pPi YPfs
捻度 twist of yarn #L@} .Giz
浸润剂含量 size content 9atjK4+o
浸润剂残留量 size residue ]^yV`Z8
处理剂含量 finish level gZ`32fB%
偶联剂 couplint agent Eu`2w%qz
断裂长 breaking length cW81
吸水高度 height of capillary rise *1|YLy
湿强度保留率 wet strength retention ":UWowJO
白度 whitenness P3wU#qU
导电箔 conductive foil Ax5mP8S
铜箔 copper foil rQu
压延铜箔 rolled copper foil pr62:
光面 shiny side (TT3(|v
粗糙面 matte side HZQDe&
处理面 treated side fnLR
防锈处理 stain proofing [+hy_Nc$
双面处理铜箔 double treated foil XPHQAo[(s
模拟 simulation Gt^|+[gD
逻辑模拟 logic simulation Cp .1/
电路模拟 circit simulation NqiB8hZ~
时序模拟 timing simulation =&di4'`
模块化 modularization o|z+!,
设计原点 design origin ?o2;SY(-
优化(设计) optimization (design) c[(yU#@
供设计优化坐标轴 predominant axis :3111}>c
表格原点 table origin ;jRL3gAe)
元件安置 component positioning .+{nA}Bc
比例因子 scaling factor ?8Hn{3X
扫描填充 scan filling QRsqPh&-
矩形填充 rectangle filling r+imn&FK8
填充域 region filling x2
w8zT6M
实体设计 physical design <MPeh&_3#
逻辑设计 logic design =]=B}L`
逻辑电路 logic circuit lTa1pp
Zw
层次设计 hierarchical design R(M}0JRm
自顶向下设计 top-down design Hnfvo*6d.e
自底向上设计 bottom-up design Ivz+Jjw
费用矩阵 cost metrix XHWh'G9
元件密度 component density Jz~+J*r;]A
自由度 degrees freedom ;V|M3
出度 out going degree Jy]FrSm^
入度 incoming degree <'r0r/0g?
曼哈顿距离 manhatton distance Of1IdE6~
欧几里德距离 euclidean distance ;): 8yBMk
网络 network fUb1/-}
阵列 array Wr]O
段 segment "sFW~Y
逻辑 logic oUl=l}qnD
逻辑设计自动化 logic design automation VYL@RL'
分线 separated time _L$)2sl1R
分层 separated layer x7vq?fP0n
定顺序 definite sequence Lf5%M|o.)
导线(通道) conduction (track) 1Z\(:ab13
导线(体)宽度 conductor width +n@f'a">
导线距离 conductor spacing x^zdTMNhw
导线层 conductor layer IO}+[%ptc*
导线宽度/间距 conductor line/space TcR=GR*cJ
第一导线层 conductor layer No.1 /m97CC#+
圆形盘 round pad ZrFr`L5F;
方形盘 square pad &foD&
菱形盘 diamond pad 3Z_t%J5QZ$
长方形焊盘 oblong pad :9(3h"
子弹形盘 bullet pad [m~b[ZwES
泪滴盘 teardrop pad ^Y$QR]
雪人盘 snowman pad V@B7P{gH
形盘 V-shaped pad V 7*+Km'=M
环形盘 annular pad 7rH'1U
非圆形盘 non-circular pad R78!x*U}
隔离盘 isolation pad :_>\DJ'>
非功能连接盘 monfunctional pad g+e:@@ug
偏置连接盘 offset land 5i|s>pD4z1
腹(背)裸盘 back-bard land )X7e$<SU*
盘址 anchoring spaur $"/UK3|d
连接盘图形 land pattern -UJ?L
连接盘网格阵列 land grid array b2G2 cL-(
孔环 annular ring Ud$Q0m&
元件孔 component hole ~D*b3K8X
安装孔 mounting hole *U
M!(
支撑孔 supported hole |pBMrN+is
非支撑孔 unsupported hole &j3`
)N
导通孔 via nlaG<L#
镀通孔 plated through hole (PTH) n;%y
余隙孔 access hole w2k<)3 g~
盲孔 blind via (hole) Dzo{PstM%
埋孔 buried via hole FQ U\0<5
埋,盲孔 buried blind via ,E%1Uq"
任意层内部导通孔 any layer inner via hole Z*h43
全部钻孔 all drilled hole HF]EU!OT
定位孔 toaling hole Jff 79)f
无连接盘孔 landless hole ;8BA~,4l
中间孔 interstitial hole Hc M~
无连接盘导通孔 landless via hole `n6/ A)
引导孔 pilot hole 9WOu8Ia
端接全隙孔 terminal clearomee hole s\_l=v3
准尺寸孔 dimensioned hole [Page] !z?0 :Jg
在连接盘中导通孔 via-in-pad uWh|C9Y!A
孔位 hole location Vz'HM$
孔密度 hole density F,Q?s9s
孔图 hole pattern h!v/s=8c
钻孔图 drill drawing vmvFBzLR
装配图assembly drawing
C>4UbU
参考基准 datum referan wEE2a56L-
1) 元件设备 #XcU{5Qm5
eI0F!Yon
三绕组变压器:three-column transformer ThrClnTrans ]Dh1~k.Kp
双绕组变压器:double-column transformer DblClmnTrans O"\nR:\
电容器:Capacitor
aV<^IxE;
并联电容器:shunt capacitor BMdSf(l
电抗器:Reactor
fSjs?zd`
母线:Busbar {8 N=WZ
输电线:TransmissionLine vGMJ ^q
发电厂:power plant ;@9e\!%
断路器:Breaker 9^au$KoU
刀闸(隔离开关):Isolator pr$~8e=c
分接头:tap M'DWu|dIBA
电动机:motor Z2#`}GI_m
(2) 状态参数 ~H u"yAR
y+A{Y
有功:active power )yrAov\z*
无功:reactive power I(n }<)eF
电流:current 8bt53ta
容量:capacity \-c#jo.$8
电压:voltage 0yz~W(tsm
档位:tap position /=TH08
有功损耗:reactive loss 'y.JcS!|
无功损耗:active loss a8zZgIV
功率因数:power-factor iV!@bC,
功率:power nVXg,Jl
功角:power-angle 781]THY=
电压等级:voltage grade ) "[HZ/
空载损耗:no-load loss iX%n0i
铁损:iron loss GD&htob(
铜损:copper loss =JW[pRI5a
空载电流:no-load current 2d 8=h6
阻抗:impedance +I@cO&CY|
正序阻抗:positive sequence impedance U(*yL-
负序阻抗:negative sequence impedance (ND%}
零序阻抗:zero sequence impedance Xu6K%]i^
电阻:resistor `|EH[W&y
电抗:reactance s"coQ!e1.
电导:conductance 3;l "=#5
电纳:susceptance 4H-j
.|e
无功负载:reactive load 或者QLoad 88 l,&2q
有功负载: active load PLoad B.*"Xfr8
遥测:YC(telemetering) 'E -FO_N
遥信:YX \I:.<2i
励磁电流(转子电流):magnetizing current ezn`
_x_?
定子:stator )7Ixz1I9g
功角:power-angle .$0Pr%0pWI
上限:upper limit ne*#+Q{E
下限:lower limit Q'K$L9q
并列的:apposable 0hwj\{"
高压: high voltage H\#:,s {1
低压:low voltage
)Gb,^NGr
中压:middle voltage f4"4ZVcr
电力系统 power system :gf;}
发电机 generator hcyO97@r
励磁 excitation "Pj}E=!k
励磁器 excitor /M@PO"
电压 voltage 6/1$<!WH
电流 current zCV7%,H~
母线 bus ~O03Sit-
变压器 transformer -DCa
升压变压器 step-up transformer
RJ}#)cT
高压侧 high side h1f8ktF
输电系统 power transmission system ]JMl|e
输电线 transmission line _a5(s2wq+
固定串联电容补偿fixed series capacitor compensation 9M'DC^x*T
稳定 stability ,@.EpbB
电压稳定 voltage stability ^npJUa
功角稳定 angle stability !h: Q
暂态稳定 transient stability m@\ZHbq
电厂 power plant ;GOz>pg
能量输送 power transfer Cj^{9'0
交流 AC 2d`c!
装机容量 installed capacity 3Aj*\e0t
电网 power system Wi$dZOcSJ
落点 drop point %Q~CB7ILK
开关站 switch station tsv$ r$Se
双回同杆并架 double-circuit lines on the same tower x_!ZycEa
变电站 transformer substation o8ppMM8_R[
补偿度 degree of compensation o@k84+tn(
高抗 high voltage shunt reactor o~1 Kp!U
无功补偿 reactive power compensation H l<$a"K7\
故障 fault Ik~1:D]f
调节 regulation M_|> kp
裕度 magin Ns=AjhLc z
三相故障 three phase fault A-uB\ L
故障切除时间 fault clearing time n:4uA`Vg
极限切除时间 critical clearing time v(O=IUa
切机 generator triping i9m*g*"2
高顶值 high limited value 926Tl
强行励磁 reinforced excitation 9wh2f7k
线路补偿器 LDC(line drop compensation) 4c159wsnQ
机端 generator terminal 8)wt$b
静态 static (state) jd:B \%#![
动态 dynamic (state) `i fiL
单机无穷大系统 one machine - infinity bus system y%cO#P@
机端电压控制 AVR x0Z5zV9
电抗 reactance /:[2'_Xl
电阻 resistance e@n!x}t8
功角 power angle 0X9Y~TM%
有功(功率) active power <Q5Le dN
无功(功率) reactive power yL1CZ_
功率因数 power factor ~cqryr9
无功电流 reactive current -]S.<8<$
下降特性 droop characteristics 8;" *6vHZ
斜率 slope n&Yk<
额定 rating _*6v|Ed?
变比 ratio 11UB4CA
参考值 reference value kXc25y'blP
电压互感器 PT 9uYyfb:
,z
分接头 tap B0Xl+JIR#
下降率 droop rate :c]`D>
仿真分析 simulation analysis ,)fkr]`<
传递函数 transfer function Ee2c5C!|C
框图 block diagram K@:m/Z}|4
受端 receive-side z@VP:au
裕度 margin .$rC0<G[K
同步 synchronization ?mYYt]R
失去同步 loss of synchronization aT!;{+
阻尼 damping SO?8%s(
摇摆 swing
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保护断路器 circuit breaker >-)h|w i
电阻:resistance b ,^*mx=
电抗:reactance pa<qZZ
阻抗:impedance O'DW5hBL0
电导:conductance #exss=as/
电纳:susceptance