1 backplane 背板 .rj FhSr$
2 Band gap voltage reference 带隙电压参考 .kM74X=S
3 benchtop supply 工作台电源 d#T8|#O"
4 Block Diagram 方块图 5 Bode Plot 波特图 "r0z(j
6 Bootstrap 自举 ~B%EvG7:n
7 Bottom FET Bottom FET |7Z,z0 ?V
8 bucket capcitor 桶形电容 78tWzO
9 chassis 机架 ZNPzQ:I@
10 Combi-sense Combi-sense V"VWHAu*.w
11 constant current source 恒流源 D%LM"p
12 Core Sataration 铁芯饱和 ww"ihUX
13 crossover frequency 交叉频率 Ms?V1
14 current ripple 纹波电流 &sL5Pt_
15 Cycle by Cycle 逐周期 wxZnuCO%H8
16 cycle skipping 周期跳步 lwLK#_5u
17 Dead Time 死区时间 yz-IZt(
18 DIE Temperature 核心温度 !)tXN=(1a
19 Disable 非使能,无效,禁用,关断 c< gM
20 dominant pole 主极点 ,TU!W|($
21 Enable 使能,有效,启用 9#%(%s2+
22 ESD Rating ESD额定值 +7<{yP6wU
23 Evaluation Board 评估板 XzQ=8r>l
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 6__@?XzJ
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 #ITx[X89|
25 Failling edge 下降沿 fDq,
)~D
26 figure of merit 品质因数 ac.O#6&
27 float charge voltage 浮充电压 #I@]8U#,":
28 flyback power stage 反驰式功率级 X.s?=6}g
29 forward voltage drop 前向压降 P<kTjG
30 free-running 自由运行 &tZ?%sr
31 Freewheel diode 续流二极管 }Iub{30mp
32 Full load 满负载 33 gate drive 栅极驱动 )T#;1qNB
34 gate drive stage 栅极驱动级 U6X~]| o
35 gerber plot Gerber 图 ^iubqtT]
36 ground plane 接地层 S^)r,cC
37 Henry 电感单位:亨利 *D<S \6=
38 Human Body Model 人体模式 UVu"meZX
39 Hysteresis 滞回 LH4-b-
40 inrush current 涌入电流 !U>"H8}dv
41 Inverting 反相 p%IR4f
42 jittery 抖动 |f8by\Q86=
43 Junction 结点 [CPZj*|b
44 Kelvin connection 开尔文连接 C?rL>_+71
45 Lead Frame 引脚框架 fY=iQ?{/[
46 Lead Free 无铅 OJ UM Y<5
47 level-shift 电平移动 j %TYyL-
48 Line regulation 电源调整率 q~trn'X>
49 load regulation 负载调整率 Vu\|KL|
50 Lot Number 批号 }(E6:h;}~
51 Low Dropout 低压差 NJUYeim;
52 Miller 密勒 53 node 节点 1`O`!plD+
54 Non-Inverting 非反相 X3L9j(
55 novel 新颖的 uc Z(D|a
56 off state 关断状态 /F;*[JZIb
57 Operating supply voltage 电源工作电压 ?xQlX%&`6
58 out drive stage 输出驱动级 d@At-Z~M
59 Out of Phase 异相 $%r|V*5
60 Part Number 产品型号 zp4ru\
61 pass transistor pass transistor P+}qaup
62 P-channel MOSFET P沟道MOSFET CI{]o&Tf
63 Phase margin 相位裕度 bwVv#Z\r
64 Phase Node 开关节点 sQJM 4'8f
65 portable electronics 便携式电子设备 ZX'{o9+w5
66 power down 掉电 #-'}r}1ZT
67 Power Good 电源正常 2Fx<QRz
68 Power Groud 功率地 sxThz7#i)
69 Power Save Mode 节电模式 .yTk/x?
70 Power up 上电 Od&M^;BQ
71 pull down 下拉 mApn(&
72 pull up 上拉 2zFdKs,
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ]nX.zE|F
74 push pull converter 推挽转换器 e_1mO 5z
75 ramp down 斜降 f{AgKW9"
76 ramp up 斜升 @1]<LQ\\
77 redundant diode 冗余二极管 c6c^9*,V
78 resistive divider 电阻分压器 OM4s.BLY
79 ringing 振 铃 {6%uNT>|
80 ripple current 纹波电流 e<9nt [
81 rising edge 上升沿 m/eGnv;!
82 sense resistor 检测电阻 !5B9:p~-
83 Sequenced Power Supplys 序列电源 |Y'$+[TE
84 shoot-through 直通,同时导通 {t=Nnc15K
85 stray inductances. 杂散电感 Z$ftG7;P0
86 sub-circuit 子电路 =\XAD+
87 substrate 基板 U~H'c
p
88 Telecom 电信 21o_9=[^
89 Thermal Information 热性能信息 G0Wd"AV+
90 thermal slug 散热片 >`{i[60r
91 Threshold 阈值 y5Pw*?kn
92 timing resistor 振荡电阻 5ef&Ih.3
93 Top FET Top FET =k$d8g
ez
94 Trace 线路,走线,引线 WHN b.>
95 Transfer function 传递函数 _O!D*=I
96 Trip Point 跳变点 h[Iu_#HMa
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) N!h>fE`
98 Under Voltage Lock Out (UVLO) 欠压锁定 Ro<!n>H
99 Voltage Reference 电压参考 u^]yz&9V
100 voltage-second product 伏秒积 xJ"Zg]d{
101 zero-pole frequency compensation 零极点频率补偿 hf?^#=k^
102 beat frequency 拍频 )K?GAj]Pq
103 one shots 单击电路 lwY{rWo
104 scaling 缩放 KPR{5
105 ESR 等效串联电阻 [Page] M:I,j
106 Ground 地电位 cbwzT0
107 trimmed bandgap 平衡带隙 3FXMM&w
108 dropout voltage 压差 d|o"QYX
109 large bulk capacitance 大容量电容 pbzbh&Y
110 circuit breaker 断路器 aJ}sYf^
111 charge pump 电荷泵 J<BdIKCma
112 overshoot 过冲 I!(yU
W@ Z=1y
印制电路printed circuit }cPV_^{
印制线路 printed wiring >bZ#
印制板 printed board #KK(Z\;
印制板电路 printed circuit board e{}o:r
印制线路板 printed wiring board f.f4<_v'h
印制元件 printed component PaDT)RrEM
印制接点 printed contact d#d~t[=
印制板装配 printed board assembly xw-q)u
板 board RdDcMZ
刚性印制板 rigid printed board ZbrE m
挠性印制电路 flexible printed circuit =
]@xXVf/
挠性印制线路 flexible printed wiring ua[\npz5
齐平印制板 flush printed board !<LS4s;
金属芯印制板 metal core printed board qnS7z%H8
金属基印制板 metal base printed board ;VuB8cnL`
多重布线印制板 mulit-wiring printed board 1(?J>{-lw
塑电路板 molded circuit board kp6x6%{K\
散线印制板 discrete wiring board 5&kR1Bp#-
微线印制板 micro wire board qN QsU
积层印制板 buile-up printed board QVH_B+
Q
表面层合电路板 surface laminar circuit -J30g\
埋入凸块连印制板 B2it printed board y?JbJ
载芯片板 chip on board i3"sArP"|
埋电阻板 buried resistance board {S}@P~H=
母板 mother board q
kKABow
子板 daughter board Sy'>JHx
背板 backplane E\zhxiI
裸板 bare board bn`zI~WS
键盘板夹心板 copper-invar-copper board S|J8:-
动态挠性板 dynamic flex board -,;Ep'
静态挠性板 static flex board D1n2Z:9
可断拼板 break-away planel 3aqmK.`H
电缆 cable h+W^k+~(
挠性扁平电缆 flexible flat cable (FFC) d0=nAZZ
薄膜开关 membrane switch .'a |St
混合电路 hybrid circuit xY S%dLE"
厚膜 thick film [GP(r
厚膜电路 thick film circuit z3C^L
薄膜 thin film nKO&ffb'<
薄膜混合电路 thin film hybrid circuit %_[-[t3
互连 interconnection J:u|8>;
导线 conductor trace line )
G{v>Z,
齐平导线 flush conductor f UIs(}US
传输线 transmission line gAj)3T@
跨交 crossover j VZi_de
板边插头 edge-board contact vVW=1(QWI#
增强板 stiffener @5y(>>C}8%
基底 substrate z~H Gc"~
基板面 real estate N>R%0m<e
导线面 conductor side p.9v<I%0
元件面 component side 8j'*IRj*q
焊接面 solder side O0~d6Ba
导电图形 conductive pattern c-.>C)
非导电图形 non-conductive pattern m%[t&^b}T
基材 base material \uk #pL
层压板 laminate {K:Utdu($q
覆金属箔基材 metal-clad bade material O i0;.<kX
覆铜箔层压板 copper-clad laminate (CCL) +V@=G &Ou0
复合层压板 composite laminate ;}~=W!yz
薄层压板 thin laminate "Y!dn|3
基体材料 basis material 32iI :u
预浸材料 prepreg B@]7eVo
粘结片 bonding sheet J,O@T)S@
预浸粘结片 preimpregnated bonding sheer .A\ \v6@
环氧玻璃基板 epoxy glass substrate IDh`0/i]
预制内层覆箔板 mass lamination panel 6^|6V
内层芯板 core material \.c
)^QQ
粘结层 bonding layer x+cF1N2.
粘结膜 film adhesive GC[{=]}9U
无支撑胶粘剂膜 unsupported adhesive film b8.%? _?
覆盖层 cover layer (cover lay) ;J(,F:N
增强板材 stiffener material LJwM M
铜箔面 copper-clad surface 2 ?T:RB}
去铜箔面 foil removal surface *Zi%Q[0Me
层压板面 unclad laminate surface 9|?Lz
基膜面 base film surface !Blk=L+p
胶粘剂面 adhesive faec wYA/<0'yH
原始光洁面 plate finish 5|CiwQg|,p
粗面 matt finish (AG
剪切板 cut to size panel ;_/q>DR>,3
超薄型层压板 ultra thin laminate b0b9#9x
A阶树脂 A-stage resin qb4;l\SfT
B阶树脂 B-stage resin $Je"z]cy-
C阶树脂 C-stage resin &H&P)Px*_
环氧树脂 epoxy resin 5%+}rSn7
酚醛树脂 phenolic resin ^|GtO.
聚酯树脂 polyester resin [
5W#1 &
聚酰亚胺树脂 polyimide resin pPqN[OJ
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 5TneuG[OD
丙烯酸树脂 acrylic resin +n[wkgFd
三聚氰胺甲醛树脂 melamine formaldehyde resin Sz|CreFK16
多官能环氧树脂 polyfunctional epoxy resin )v=G}j^
溴化环氧树脂 brominated epoxy resin b8Rh|"J)d
环氧酚醛 epoxy novolac 7NB 9Vu|gD
氟树脂 fluroresin &}0wzcMg
硅树脂 silicone resin 0@K:Tq-mF
硅烷 silane [4Faq3T"
聚合物 polymer RzRvu]]8
无定形聚合物 amorphous polymer )H9*NB8%
结晶现象 crystalline polamer iM|"H..
双晶现象 dimorphism U|7Qw|I7
共聚物 copolymer N>fYH.c3Y
合成树脂 synthetic yVI;s|jG
热固性树脂 thermosetting resin [Page] X$ B]P7G7
热塑性树脂 thermoplastic resin -;)SER3Wq4
感光性树脂 photosensitive resin S@xsAib0J
环氧值 epoxy value zI&4k..4
双氰胺 dicyandiamide IR
dz(~CP
粘结剂 binder %<C
G|]W
胶粘剂 adesive |SP.S 0.y
固化剂 curing agent GoSWH2N
阻燃剂 flame retardant fuD1U}c
遮光剂 opaquer LAY)">*49H
增塑剂 plasticizers oT)VOkFq
不饱和聚酯 unsatuiated polyester gZ"{{#:}
聚酯薄膜 polyester KTK6#[8A
聚酰亚胺薄膜 polyimide film (PI) V2s}<uG
聚四氟乙烯 polytetrafluoetylene (PTFE) N9=r#![>,
增强材料 reinforcing material 5Ue^>8-
折痕 crease 3.<6;?
云织 waviness +B q}>
鱼眼 fish eye mU+FQX
毛圈长 feather length 12d}#G<q-
厚薄段 mark :@>br+S
裂缝 split an=+6lIl
捻度 twist of yarn 5Vqmv<F;$Z
浸润剂含量 size content ;Co[y=Z
浸润剂残留量 size residue bj7MzlGFy
处理剂含量 finish level oA;jy
偶联剂 couplint agent &&9c&xgzE
断裂长 breaking length ]PzTl {]
吸水高度 height of capillary rise P"=UI$HN
湿强度保留率 wet strength retention *2Vp4
白度 whitenness ?]\W8)
导电箔 conductive foil LA+$_U"Jk
铜箔 copper foil o?va#/fk
压延铜箔 rolled copper foil Wl !!5\
光面 shiny side $uUb$8Bu
粗糙面 matte side B)*#g
处理面 treated side 1>@]@ST[:
防锈处理 stain proofing F/h :&B:;
双面处理铜箔 double treated foil n.a=K2H:V
模拟 simulation => uVp
逻辑模拟 logic simulation GIC"-l1\
电路模拟 circit simulation ?BDlB0jxzi
时序模拟 timing simulation )"_Ff,9Z!
模块化 modularization c#n4zdQd]5
设计原点 design origin 5"}y\
优化(设计) optimization (design) B15O,sL&W
供设计优化坐标轴 predominant axis Lov.E3S6;
表格原点 table origin b
5F4+
元件安置 component positioning =MJ-s;raq
比例因子 scaling factor 8sR
扫描填充 scan filling Pu$kj"|q*[
矩形填充 rectangle filling co<2e#p;
填充域 region filling Zr.\`mG4f
实体设计 physical design +(z_"[l"
逻辑设计 logic design L,L ~
.E
逻辑电路 logic circuit (RDa,&
层次设计 hierarchical design d^Zo35X
自顶向下设计 top-down design Iuu<2#gb8"
自底向上设计 bottom-up design q'%[[<
费用矩阵 cost metrix G>=9gSLM
元件密度 component density PG^j}
自由度 degrees freedom '<?v:pb9
出度 out going degree #JL&]Z+X6
入度 incoming degree n&0mz1rw
曼哈顿距离 manhatton distance 3@PUg(M
欧几里德距离 euclidean distance 3R<ME c
网络 network d`?U!?Si
阵列 array -uv
9(r\P
段 segment M.xhVgFf)
逻辑 logic OX)#F'Sl}
逻辑设计自动化 logic design automation &TP:yA[
分线 separated time %w'/n>]j
分层 separated layer Tn4W\?R
定顺序 definite sequence !paN`Fz\a
导线(通道) conduction (track) ZL4l
(&"
导线(体)宽度 conductor width [Krm .)
导线距离 conductor spacing wO^$!zB W
导线层 conductor layer KjFZ
导线宽度/间距 conductor line/space BKE\SWu
第一导线层 conductor layer No.1 -TzI>Fz
圆形盘 round pad RNv{n
mf
方形盘 square pad bGZhUEq
菱形盘 diamond pad !dfS|BA]
长方形焊盘 oblong pad *F\T}k7
子弹形盘 bullet pad xb4Pt`x)rS
泪滴盘 teardrop pad <Jwi~I=^
雪人盘 snowman pad IvEMg2f}
形盘 V-shaped pad V ]regi- LGU
环形盘 annular pad y2z{rd
非圆形盘 non-circular pad "XGD:>Q.
隔离盘 isolation pad h]kn%?fpmB
非功能连接盘 monfunctional pad 42b. 7E
偏置连接盘 offset land "bD+/\ z
腹(背)裸盘 back-bard land "%{,T
盘址 anchoring spaur q%OcLZ<,
连接盘图形 land pattern 6uu^A9x
连接盘网格阵列 land grid array ad"'O]
孔环 annular ring FovE$Dj]
元件孔 component hole 4=u+ozCG
安装孔 mounting hole ;Ay>+M2O
支撑孔 supported hole hMNJ'i}
非支撑孔 unsupported hole bH'S.RWp=
导通孔 via ,9=gVW{
镀通孔 plated through hole (PTH) 6N9 c<JC
余隙孔 access hole c:=7lI
盲孔 blind via (hole) P7's8KOoS
埋孔 buried via hole &}vR(y*#c
埋,盲孔 buried blind via \:]DFZ= !
任意层内部导通孔 any layer inner via hole yOX&cZ[
全部钻孔 all drilled hole >F/XZC
定位孔 toaling hole xU@1!%l@
无连接盘孔 landless hole seu
~'s-
中间孔 interstitial hole j_!bT!8
无连接盘导通孔 landless via hole 1)$%Jr
引导孔 pilot hole MQwIPjk8
端接全隙孔 terminal clearomee hole J"diFz+20
准尺寸孔 dimensioned hole [Page] }P#Vsqe V
在连接盘中导通孔 via-in-pad d2RnQA
孔位 hole location 2ubmsbt$
孔密度 hole density _~tm7o+js
孔图 hole pattern &svx@wW
钻孔图 drill drawing $[[?;g
装配图assembly drawing RG&I\DTyt
参考基准 datum referan I`22Zwq:
1) 元件设备 Y^QKp"
-7k[Vg?
三绕组变压器:three-column transformer ThrClnTrans z(+&wa
双绕组变压器:double-column transformer DblClmnTrans gXLCRn!iR
电容器:Capacitor e,EK,,iY5
并联电容器:shunt capacitor /$;,F't#2M
电抗器:Reactor "\7 v
母线:Busbar E_~x==cb
输电线:TransmissionLine gdl| ^*tc
发电厂:power plant S"zk!2@C
断路器:Breaker xZX`%f-
刀闸(隔离开关):Isolator uM<|@`&b
分接头:tap (4~X}:
电动机:motor xPt*CB
(2) 状态参数 }7.#Dj/r6
'qjX$]H
有功:active power (qUK7$
无功:reactive power 3 -tO;GKb
电流:current N&"QKd l
容量:capacity Rv,82iEKs
电压:voltage sm1;MF]/u
档位:tap position 6JSY56v
有功损耗:reactive loss (%bE~Q2P*<
无功损耗:active loss 8"x9#kyU<3
功率因数:power-factor I FsE!oDs4
功率:power b
vRB
功角:power-angle FqwIJ|ct
电压等级:voltage grade vs+QbI6>-
空载损耗:no-load loss j9:/RJS
铁损:iron loss bG(x:Py&
铜损:copper loss za T_d/?J
空载电流:no-load current &iNS?1a%f=
阻抗:impedance b0 &
正序阻抗:positive sequence impedance qz`rL#W]
负序阻抗:negative sequence impedance Ad/($v5+
零序阻抗:zero sequence impedance r!kLV )_
电阻:resistor }~F~hf>s
电抗:reactance 9*\g`fWc}{
电导:conductance =2%VZE7Vm
电纳:susceptance +"8}R~`!
无功负载:reactive load 或者QLoad \,R!S /R#
有功负载: active load PLoad [/cIUQ
遥测:YC(telemetering) T`\]!>eb
遥信:YX o\4CoeG
励磁电流(转子电流):magnetizing current zT7"VbP
定子:stator UW6VHA>
功角:power-angle $3k
"WlRG
上限:upper limit :3^dF}>
下限:lower limit d; =u
并列的:apposable Efx=T$%^&
高压: high voltage `*aBRwvK~
低压:low voltage t`YWwI.
中压:middle voltage ,[X_]e;
电力系统 power system O9^T3~x[V
发电机 generator
WK==j1
励磁 excitation XQ?fJWLU
励磁器 excitor ^"x<)@X
电压 voltage qSTW b%
电流 current Z5B/|{
母线 bus uw33:G
变压器 transformer @?Zf-.
升压变压器 step-up transformer ETfF5i}
高压侧 high side HCj>,^<h
输电系统 power transmission system w2OsLi Sv
输电线 transmission line GoIQ>n
固定串联电容补偿fixed series capacitor compensation [b/o$zR
稳定 stability *5D3vB*S
电压稳定 voltage stability f*m[|0qI<X
功角稳定 angle stability _TUm$#@Y`
暂态稳定 transient stability Y:psZ
电厂 power plant _ym"m,,7?
能量输送 power transfer VEs5;]#<2D
交流 AC rF] +,4
装机容量 installed capacity aSL6zye
,
电网 power system +sf .PSz$
落点 drop point c}-(. eu
开关站 switch station dJD(\a>r.u
双回同杆并架 double-circuit lines on the same tower W5SN I>|E
变电站 transformer substation SK
R1E];4
补偿度 degree of compensation LZ<[ll#C
高抗 high voltage shunt reactor S6sq#kcH
无功补偿 reactive power compensation opp!0:jS*
故障 fault q3h'l,
调节 regulation (3;@^S4&w
裕度 magin ~<)vKk
三相故障 three phase fault u =J&~
故障切除时间 fault clearing time vzXag*0
极限切除时间 critical clearing time ss
iok LE
切机 generator triping (D7$$!}
高顶值 high limited value .L EY=j!-s
强行励磁 reinforced excitation iw\%h9
线路补偿器 LDC(line drop compensation) gzdG6"
机端 generator terminal Vn|1v4U!
静态 static (state) RMP9y$~3pU
动态 dynamic (state) 2@khSWV
单机无穷大系统 one machine - infinity bus system ke%pZ7{u
机端电压控制 AVR F)Oe9x\/
电抗 reactance 2k5/SV
X
电阻 resistance vmX"+sHz$]
功角 power angle %J~WC$=Qv
有功(功率) active power z|N3G E(.@
无功(功率) reactive power M 2q"dz
功率因数 power factor Vf $Dnu@}z
无功电流 reactive current ,}SCa'PB
下降特性 droop characteristics 3EK9,:<Cf
斜率 slope #hw>tA6
额定 rating Z(GfK0vU
变比 ratio (zcLx;N
参考值 reference value ](jFwxU
电压互感器 PT yj_4gxJ\
分接头 tap IV `%V+
f
下降率 droop rate !L24+ $
仿真分析 simulation analysis SA"8!soY3
传递函数 transfer function A1i!F?X
框图 block diagram >m6&bfy\q
受端 receive-side (k?7:h
裕度 margin $8~e}8dt|
同步 synchronization `[fxyg:u
失去同步 loss of synchronization
fV\]L4%
阻尼 damping rS8 w\`_
摇摆 swing y1f:?L-z
保护断路器 circuit breaker :iF%cy.
电阻:resistance # Su~`]
电抗:reactance gVR@&bi7
阻抗:impedance 9Ul(GI(
电导:conductance jp2Q9Z
电纳:susceptance