1 backplane 背板 xxy
(#j$
2 Band gap voltage reference 带隙电压参考 L/Tsq=
3 benchtop supply 工作台电源 2.p?gRO
4 Block Diagram 方块图 5 Bode Plot 波特图 xVnk]:c
6 Bootstrap 自举 FH3^@@Y%
7 Bottom FET Bottom FET e};\"^HH
8 bucket capcitor 桶形电容 npCiqO
9 chassis 机架 !#[B#DZc(
10 Combi-sense Combi-sense !=)b2}e/>
11 constant current source 恒流源 Sgp1p}
12 Core Sataration 铁芯饱和 6 Mc&gnN
13 crossover frequency 交叉频率 pLdZB9oD]C
14 current ripple 纹波电流 {D{'
\]+
15 Cycle by Cycle 逐周期 *DDqa?gQb
16 cycle skipping 周期跳步 )swu~Wb}U@
17 Dead Time 死区时间 V|\dnVQ'-%
18 DIE Temperature 核心温度 *`]#ntz9
19 Disable 非使能,无效,禁用,关断 ITssBB9
20 dominant pole 主极点 5jNDr`pnu
21 Enable 使能,有效,启用 \8^c"%v,:
22 ESD Rating ESD额定值 xfzGixA
23 Evaluation Board 评估板 /_(q7:<ZF
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 1CmjEAv%/
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 1 !8
b9
25 Failling edge 下降沿 q?##S'
26 figure of merit 品质因数 OF1fS\P<>
27 float charge voltage 浮充电压 .P:mYC
28 flyback power stage 反驰式功率级 Cs2F/M'
29 forward voltage drop 前向压降 5 (cgHr"
30 free-running 自由运行 Z#vU~1W
31 Freewheel diode 续流二极管 %G`GdG}T
32 Full load 满负载 33 gate drive 栅极驱动 |& Pa`=sp
34 gate drive stage 栅极驱动级 z)_h"y?H{%
35 gerber plot Gerber 图 qdNt2SO
36 ground plane 接地层 <=Z`]8
37 Henry 电感单位:亨利 ]jRaR~[UN
38 Human Body Model 人体模式 7=@3cw
H
39 Hysteresis 滞回 o+0x1Ct3P
40 inrush current 涌入电流 I.>SC
41 Inverting 反相 TgjM@ir
42 jittery 抖动 d:!A`sk7
43 Junction 结点 V;IV2HT0J"
44 Kelvin connection 开尔文连接 $6DA<v^=z
45 Lead Frame 引脚框架 "8l&m6`U-
46 Lead Free 无铅 =\FV_4)
47 level-shift 电平移动 MJ_]N+
48 Line regulation 电源调整率 |*5HNP
49 load regulation 负载调整率 U9t-(`[j?
50 Lot Number 批号 [XbNZ6
51 Low Dropout 低压差 o,gH*
52 Miller 密勒 53 node 节点 2A(?9
R9&h
54 Non-Inverting 非反相 ;)XB'
55 novel 新颖的 J/xbMMb
56 off state 关断状态 }UzRFIcv
57 Operating supply voltage 电源工作电压 ~YQH]
58 out drive stage 输出驱动级 vp4NH]fJ
59 Out of Phase 异相 _Squ%z:D
60 Part Number 产品型号 IBm"VCg{Ew
61 pass transistor pass transistor z@Uf@~+U
62 P-channel MOSFET P沟道MOSFET DFM~jlH
63 Phase margin 相位裕度 ;6655C
64 Phase Node 开关节点 Ftw;T|
65 portable electronics 便携式电子设备 `|`Qrv4}
66 power down 掉电 J.Fy0W@+k4
67 Power Good 电源正常 2H9;4>ss
68 Power Groud 功率地 dxi5p!^^9
69 Power Save Mode 节电模式 kNk$[Yfs
70 Power up 上电 Ba#wW
E
71 pull down 下拉 ,)35Vi;.
72 pull up 上拉 TsF>Y""*M
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Q4h6K7
74 push pull converter 推挽转换器 Op5S'
75 ramp down 斜降 '`sZo1x%f
76 ramp up 斜升 =berCV
77 redundant diode 冗余二极管 l|j}Ggen
78 resistive divider 电阻分压器 R5& R~1N
79 ringing 振 铃 60z8U#upM
80 ripple current 纹波电流 q+{$"s9v
81 rising edge 上升沿 Nv5)A=6#AA
82 sense resistor 检测电阻 A+41JMH
83 Sequenced Power Supplys 序列电源 B>UF dj]-
84 shoot-through 直通,同时导通 7'zXf)!
85 stray inductances. 杂散电感 W|CZA
86 sub-circuit 子电路 ?:DUsg
87 substrate 基板 /C
88 Telecom 电信 Xy]Pmt
89 Thermal Information 热性能信息 2+=:pc^
90 thermal slug 散热片 .K`EflN
91 Threshold 阈值 k9m9IE"9=$
92 timing resistor 振荡电阻 m <'&`B;
93 Top FET Top FET Bdr'd? u<A
94 Trace 线路,走线,引线 H&SoVi_V
95 Transfer function 传递函数 ^`?M~e2FZ8
96 Trip Point 跳变点 d#1yVdqRl
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Ox%p"xuP,
98 Under Voltage Lock Out (UVLO) 欠压锁定 h>"j!|#!s
99 Voltage Reference 电压参考 qV5lv-p
100 voltage-second product 伏秒积 N~|Z@pU"
101 zero-pole frequency compensation 零极点频率补偿 0vZ49}mb)
102 beat frequency 拍频 qO{Yr$V%
103 one shots 单击电路 B+2EIaI
104 scaling 缩放 G\(cnqHk
105 ESR 等效串联电阻 [Page] gP.PyYUV
106 Ground 地电位 b'%)?{E
107 trimmed bandgap 平衡带隙 g[Q+DT
108 dropout voltage 压差 H>]A|-rG#
109 large bulk capacitance 大容量电容 :Z&<5
110 circuit breaker 断路器 3|(<]@
$
111 charge pump 电荷泵 d1';d6.u\
112 overshoot 过冲 N?2C*|%f
`8/D$
印制电路printed circuit txik{' :
印制线路 printed wiring l i)
5o
印制板 printed board 3I G<Ot9
印制板电路 printed circuit board D{rM
印制线路板 printed wiring board \l1==,wk
印制元件 printed component Zo<j"FG
印制接点 printed contact K05U>151
印制板装配 printed board assembly Z(I=KBI
板 board Mp?L9
刚性印制板 rigid printed board nc^DFP
挠性印制电路 flexible printed circuit apgR[=Oy
挠性印制线路 flexible printed wiring g.pR4Mf=Z
齐平印制板 flush printed board h+ <Jv
金属芯印制板 metal core printed board /B<QYvv
金属基印制板 metal base printed board uN4e n,
多重布线印制板 mulit-wiring printed board `\$EPUM
塑电路板 molded circuit board y96HTQ32
散线印制板 discrete wiring board G8&/Ic
微线印制板 micro wire board |:]}u|O
积层印制板 buile-up printed board H[RX~Xk2E
表面层合电路板 surface laminar circuit yoH,4,! G
埋入凸块连印制板 B2it printed board &grqRt
载芯片板 chip on board ZeqsXz
埋电阻板 buried resistance board qTSe_Re
母板 mother board E>iN >
子板 daughter board 01~
nC@;
背板 backplane AsI\#wL)
裸板 bare board [2PPa9F
键盘板夹心板 copper-invar-copper board xp}M5|
动态挠性板 dynamic flex board =~>g--^U
静态挠性板 static flex board bXSAZWf
可断拼板 break-away planel ( 8X^pL
电缆 cable !Df>Q5~g
挠性扁平电缆 flexible flat cable (FFC) *-*SCA`E^=
薄膜开关 membrane switch )|/%]@` N
混合电路 hybrid circuit wjfq"7Q
厚膜 thick film @N]]Cf>x
厚膜电路 thick film circuit 6{quO#!
薄膜 thin film iK=QP+^VN
薄膜混合电路 thin film hybrid circuit Sc]G7_
互连 interconnection e%EO/ 2"
导线 conductor trace line !;;7:!)P
齐平导线 flush conductor W{c
Z7$d
传输线 transmission line m(D+!I9
跨交 crossover M@o^V(j
板边插头 edge-board contact KP&xk13)
增强板 stiffener q~^!Ck+#*
基底 substrate FGzKx9I9
基板面 real estate l0U23i
导线面 conductor side b:cy(6G(
元件面 component side <_c8F!K)T
焊接面 solder side IdM~'
Q>\
导电图形 conductive pattern wr5v-_7r,
非导电图形 non-conductive pattern 9F[_xe@
基材 base material 5+Ao.3Xn
层压板 laminate %DA&txX}w
覆金属箔基材 metal-clad bade material Ra"hdxH
覆铜箔层压板 copper-clad laminate (CCL) C57m{RH
复合层压板 composite laminate o{hX?,4i
薄层压板 thin laminate Au6Y]
基体材料 basis material u HW'F(;
预浸材料 prepreg [N12X7O3
粘结片 bonding sheet :yRv:`r3Lt
预浸粘结片 preimpregnated bonding sheer
G:3szz
环氧玻璃基板 epoxy glass substrate S+#|j
预制内层覆箔板 mass lamination panel lF_"{dS_6(
内层芯板 core material ?(n v_O
粘结层 bonding layer R1*4
粘结膜 film adhesive VFzIBgJ3
无支撑胶粘剂膜 unsupported adhesive film JHXkQz[Jb
覆盖层 cover layer (cover lay) qXhdU/
=
增强板材 stiffener material XMiu}w!
铜箔面 copper-clad surface Y%eq2%
去铜箔面 foil removal surface XT4Gz|k
层压板面 unclad laminate surface >lfuo
基膜面 base film surface GGf<9!:
胶粘剂面 adhesive faec .`Q^8|$-K
原始光洁面 plate finish #y[U2s Se
粗面 matt finish *\(z"B
剪切板 cut to size panel |-)8=QDz)r
超薄型层压板 ultra thin laminate yYaoA/0
A阶树脂 A-stage resin O =;jDWE
B阶树脂 B-stage resin tU5uL.( O
C阶树脂 C-stage resin {}$Zff
环氧树脂 epoxy resin ![sXR
酚醛树脂 phenolic resin 9Msy=qvYG
聚酯树脂 polyester resin :W5W
@8Y
聚酰亚胺树脂 polyimide resin 5mC"8N1)
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin hHGuD2%
丙烯酸树脂 acrylic resin Zk`yd8C
三聚氰胺甲醛树脂 melamine formaldehyde resin j:xC\b47"
多官能环氧树脂 polyfunctional epoxy resin vbVOWX6
溴化环氧树脂 brominated epoxy resin u*TC8!n
环氧酚醛 epoxy novolac N+h05`
氟树脂 fluroresin 15,JD
硅树脂 silicone resin TS#[[^!S
硅烷 silane Z &Ciy n
聚合物 polymer .w;kB}$YC
无定形聚合物 amorphous polymer >mai
v;
结晶现象 crystalline polamer 7/
?QZN
双晶现象 dimorphism ==& y9e
共聚物 copolymer o6d x\
合成树脂 synthetic d 8DU[p
热固性树脂 thermosetting resin [Page] UXs)$
热塑性树脂 thermoplastic resin BMy3tyO
感光性树脂 photosensitive resin m3gv %h
环氧值 epoxy value +.Ij%S[Px5
双氰胺 dicyandiamide 3iIy_nWC
粘结剂 binder z
-!w/Bv@
胶粘剂 adesive =o~GLbsER
固化剂 curing agent pK@=]K~l0
阻燃剂 flame retardant b7Jxv7$e
遮光剂 opaquer v6s,lC5qR
增塑剂 plasticizers !R"W2 Z4h
不饱和聚酯 unsatuiated polyester _ i}W1i
聚酯薄膜 polyester pYx,*kG:HW
聚酰亚胺薄膜 polyimide film (PI) ,VHqZ'6
聚四氟乙烯 polytetrafluoetylene (PTFE) \xj;{xc
增强材料 reinforcing material O=A2QykV(
折痕 crease ?B1Zfu0
云织 waviness iCE!TmDT
鱼眼 fish eye u3C_Xz
毛圈长 feather length Bchv1KF
厚薄段 mark ]7O<|8n!d
裂缝 split D &"D[|@
捻度 twist of yarn n7cy[%yT
浸润剂含量 size content x}yl Rg`[
浸润剂残留量 size residue :<t=??4m
处理剂含量 finish level \</!kY*3@t
偶联剂 couplint agent #GE]]7:Na
断裂长 breaking length <qwf"Ey
吸水高度 height of capillary rise -2M~KlYl
湿强度保留率 wet strength retention =~GP;=6
白度 whitenness }/F$73Xd
导电箔 conductive foil TI4Hu,rc
铜箔 copper foil @ph!3<(In,
压延铜箔 rolled copper foil OT%E|) 6'
光面 shiny side ?T/]w-q>
粗糙面 matte side z3jkxWAZ
处理面 treated side UqOBr2UmG
防锈处理 stain proofing u^~7[OkE
双面处理铜箔 double treated foil L~Gr,i
模拟 simulation .eR1\IAm
逻辑模拟 logic simulation >
S>*JP
电路模拟 circit simulation zj1~[$
(
时序模拟 timing simulation zuV%`n
模块化 modularization :\\NK/"
设计原点 design origin 0O9b
7F
优化(设计) optimization (design) Vxh39eW
供设计优化坐标轴 predominant axis d:@+dS
表格原点 table origin i6WH^IQ M
元件安置 component positioning Y%XF64)6
比例因子 scaling factor bj
pruJ`=
扫描填充 scan filling tk&AZb,sP
矩形填充 rectangle filling ;
oyV8P$
填充域 region filling 2R[v*i^S
实体设计 physical design >}+{;d
逻辑设计 logic design jE\G_>
逻辑电路 logic circuit gV2vwe
层次设计 hierarchical design ]n!V
自顶向下设计 top-down design HwUaaK
自底向上设计 bottom-up design 3iCe5VF
费用矩阵 cost metrix D&G6^ME
元件密度 component density Vu:ZG*^
自由度 degrees freedom CS7b3p!I
出度 out going degree 'J,UKK\5
入度 incoming degree g8<ODU0[g
曼哈顿距离 manhatton distance 1dQAo1
欧几里德距离 euclidean distance aZN?V}^+
网络 network >)kKP8l7
阵列 array b`jR("U
段 segment Ew/MSl6}
逻辑 logic .z>/A/&+
逻辑设计自动化 logic design automation n-Iz!;q
分线 separated time O[ma% E*0
分层 separated layer y2A\7&7
定顺序 definite sequence a*P v^Np-v
导线(通道) conduction (track) /5NWV#-
导线(体)宽度 conductor width 7=P)` @
导线距离 conductor spacing .]v>LsbhF
导线层 conductor layer b)diYsTH
导线宽度/间距 conductor line/space &FXf]9
_X
第一导线层 conductor layer No.1 T3wTMbZ!VK
圆形盘 round pad oGcgd$%ZB
方形盘 square pad ~7:q+\
菱形盘 diamond pad + -<8^y
长方形焊盘 oblong pad !db=Iz5)
子弹形盘 bullet pad Hn/t'D3
泪滴盘 teardrop pad TGJz[Ny
雪人盘 snowman pad q,P.)\0A
形盘 V-shaped pad V J67
thTGFq
环形盘 annular pad %J*1F
非圆形盘 non-circular pad '.v;/[0
隔离盘 isolation pad YWIA(p8Qkk
非功能连接盘 monfunctional pad vMzL+D2)
偏置连接盘 offset land + ~V%R{h
腹(背)裸盘 back-bard land 6tH}K
盘址 anchoring spaur +6WjOcu
连接盘图形 land pattern f#s 6 'g
连接盘网格阵列 land grid array 7ys' [G|}r
孔环 annular ring Ku[q#_7
元件孔 component hole [G_ ;78
安装孔 mounting hole fzJiW@-T
支撑孔 supported hole H:G``Vq;0m
非支撑孔 unsupported hole (%^C}`|EA
导通孔 via hC$e8t60
镀通孔 plated through hole (PTH) ie1~QQ
余隙孔 access hole {QEvc
盲孔 blind via (hole) L'wR$
埋孔 buried via hole %w&+o.k/
埋,盲孔 buried blind via 4rhHvp
任意层内部导通孔 any layer inner via hole 4-bM90&1t
全部钻孔 all drilled hole l"J#Pvi
定位孔 toaling hole nAQ[
-NbW,
无连接盘孔 landless hole
]!ZZRe
中间孔 interstitial hole (Nzh1ul\}
无连接盘导通孔 landless via hole #?Ix6 {R
引导孔 pilot hole JrBPx/?(,;
端接全隙孔 terminal clearomee hole ndQw>
准尺寸孔 dimensioned hole [Page] 3ML^ dZ'
在连接盘中导通孔 via-in-pad -o/Vp>_UOE
孔位 hole location nKE^km
孔密度 hole density f#c}}>V8
孔图 hole pattern gYt=_+-
钻孔图 drill drawing myo4`oH
装配图assembly drawing 1#Vd)vSP
参考基准 datum referan ZKI8x1>Iq
1) 元件设备 BiU>h.4=\(
/R|?v{S1
三绕组变压器:three-column transformer ThrClnTrans 2 4od74\
双绕组变压器:double-column transformer DblClmnTrans 3ko
h!q+
电容器:Capacitor +wj}x?ZeV
并联电容器:shunt capacitor 'z91aNG]
电抗器:Reactor O}C*weU
母线:Busbar ;-JF1p 7;
输电线:TransmissionLine s58dHnj5+
发电厂:power plant hGKQK
^bn
断路器:Breaker @CM5e!
刀闸(隔离开关):Isolator rX^uHq8
分接头:tap ]HWeVhG
电动机:motor 7oC8ID
(2) 状态参数 odL*_<Z
{JdXn
有功:active power $$ $[Vn_H<
无功:reactive power dOaOWMrfdf
电流:current |7K>`
容量:capacity `j{q
电压:voltage *QN,wBQ
档位:tap position xsU%?"r
有功损耗:reactive loss +6:
无功损耗:active loss a,fcKe&B
功率因数:power-factor J<0sT=/2$
功率:power d v4~CW%Td
功角:power-angle OeGLMDw
电压等级:voltage grade Ro{xprE1
空载损耗:no-load loss ;Mmu}
铁损:iron loss gDJ} <^
铜损:copper loss SP<(24zdd
空载电流:no-load current i\uj>;B
阻抗:impedance V}`ri~
正序阻抗:positive sequence impedance GsO(\hR6^
负序阻抗:negative sequence impedance ~zZOogM<
零序阻抗:zero sequence impedance NVQ.;" 2w
电阻:resistor tW!*W?
电抗:reactance Ze/\IBd
电导:conductance F7<u1Rx]
电纳:susceptance P@bPdw!JA
无功负载:reactive load 或者QLoad oumbJ7X=L
有功负载: active load PLoad X
遥测:YC(telemetering) @[v,q_^8
遥信:YX J3'q.Pc
励磁电流(转子电流):magnetizing current 1\{FK Ot
定子:stator eKuF7Oo
功角:power-angle Xn~\Vb
上限:upper limit %*K zP{
下限:lower limit J(8?6&=ck
并列的:apposable EXbZ9 o*
高压: high voltage #""T>+
低压:low voltage b{&'r~
中压:middle voltage )zy;!
电力系统 power system Xhyn! &H5
发电机 generator #%%!r$UL
励磁 excitation Af@\g-<W_
励磁器 excitor &E6V'*<93
电压 voltage
Oc,HnyV+
电流 current .*n*eeD,
母线 bus _KtV`bF
变压器 transformer }%c>Hh
升压变压器 step-up transformer MGK?FJn_?
高压侧 high side ue?3;BF 5
输电系统 power transmission system pyX:$j2R+%
输电线 transmission line 7K&Uu3m
固定串联电容补偿fixed series capacitor compensation #l`\'0`.
稳定 stability F+NX
[
电压稳定 voltage stability -da: j-_
功角稳定 angle stability KT 6ppo
暂态稳定 transient stability 3(t3r::&
电厂 power plant |Vlx:
能量输送 power transfer F/1m&1t
交流 AC +84
p/B#
装机容量 installed capacity !/a6;:_y
电网 power system h 2JmRO
落点 drop point l1`r%9gr
开关站 switch station gm-9 oA
X
双回同杆并架 double-circuit lines on the same tower )FG/
变电站 transformer substation jAcKSx$}y"
补偿度 degree of compensation R
i,_x
高抗 high voltage shunt reactor KJS-{ed
无功补偿 reactive power compensation x![.C,O
故障 fault !%t2ZQJq
调节 regulation 9@IL5 47V
裕度 magin %CnNu
三相故障 three phase fault QBi]gT@&g
故障切除时间 fault clearing time ZNDi;6e
极限切除时间 critical clearing time /:{4,aX2
切机 generator triping IsJx5GO
高顶值 high limited value n'q:L(`M
强行励磁 reinforced excitation ;!=i|"PG
线路补偿器 LDC(line drop compensation) Ahba1\,N$
机端 generator terminal sV5") /~
静态 static (state) ? EHheZ{
动态 dynamic (state) 4W49*Je
单机无穷大系统 one machine - infinity bus system f9},d1k
机端电压控制 AVR \RPwSx
电抗 reactance ^Z\"d#A
电阻 resistance 34"PtWbV>
功角 power angle %{3q=9ii
有功(功率) active power Ac*J;fI
无功(功率) reactive power n53c}^
功率因数 power factor [dz3k@ >0
无功电流 reactive current <Uj9~yVN]
下降特性 droop characteristics P zM yUv
斜率 slope 8HZ+r/j
额定 rating %QGw`E
变比 ratio 2P^qZDG 8I
参考值 reference value _/%,cYVc8!
电压互感器 PT gX-hYQrC
分接头 tap bi",DKU{l
下降率 droop rate )cP)HbOd=
仿真分析 simulation analysis v2:i'j6
传递函数 transfer function zA.0Sm
框图 block diagram wsH _pF
受端 receive-side 1kUlQ*[<|
裕度 margin y:Of~
]9@
同步 synchronization W\w#}kY
失去同步 loss of synchronization nfGI4ZE
阻尼 damping 7OG:G z+)x
摇摆 swing
Su?cC/
保护断路器 circuit breaker >nih:5J,ja
电阻:resistance kcg\f@d$
电抗:reactance &|RTLGwX
阻抗:impedance dkCUU
电导:conductance pz)>y&_o
电纳:susceptance