1 backplane 背板 fxOE]d8v
2 Band gap voltage reference 带隙电压参考 DUQ9AT#3
3 benchtop supply 工作台电源 pbFYiu+
4 Block Diagram 方块图 5 Bode Plot 波特图 8eN%sm
6 Bootstrap 自举 p^Agh
7 Bottom FET Bottom FET *n;>p_#
8 bucket capcitor 桶形电容 k5g@myb-
9 chassis 机架 :` ;(p{
10 Combi-sense Combi-sense "TUPYFK9
11 constant current source 恒流源 4xp j<
12 Core Sataration 铁芯饱和 <qr^Nyo4
13 crossover frequency 交叉频率 R^|!^[WE
14 current ripple 纹波电流 V3 qT<}y|
15 Cycle by Cycle 逐周期 HmFNE$k
16 cycle skipping 周期跳步 ` -yhl3si
17 Dead Time 死区时间 ^b:Xo"q#H
18 DIE Temperature 核心温度 V15q01bE#
19 Disable 非使能,无效,禁用,关断 QT7_x`#J~o
20 dominant pole 主极点 (%Ng'~J\|
21 Enable 使能,有效,启用 e7h\(`J0lj
22 ESD Rating ESD额定值 w}"!l G
23 Evaluation Board 评估板 /^~p~HKtx
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. pAMo
XJ`
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 U>bP}[&S
25 Failling edge 下降沿 :82?'aR
26 figure of merit 品质因数 f<^ScFVR
27 float charge voltage 浮充电压 kGruo5A
28 flyback power stage 反驰式功率级 9A(n_Rs7?
29 forward voltage drop 前向压降 FF8WTuzB+
30 free-running 自由运行 ?-4OfGN
31 Freewheel diode 续流二极管 }WA<=9e
32 Full load 满负载 33 gate drive 栅极驱动 /(y4V
34 gate drive stage 栅极驱动级 L,O>6~9:^1
35 gerber plot Gerber 图 Ia=&.,xub
36 ground plane 接地层 i_|h{JK)
37 Henry 电感单位:亨利 Pu1GCr(
38 Human Body Model 人体模式 <\+Po<)3j
39 Hysteresis 滞回 3e#x)H/dr
40 inrush current 涌入电流 zI1(F67d`
41 Inverting 反相 %f_FGh
42 jittery 抖动 ]~$c~*0g
43 Junction 结点 md.*
44 Kelvin connection 开尔文连接 ?`za-+<r<
45 Lead Frame 引脚框架 sV]i/B
46 Lead Free 无铅 ~}epq6L>
47 level-shift 电平移动 5%EaX?0h+
48 Line regulation 电源调整率 ZCj>MA
49 load regulation 负载调整率 Rd`{qW
50 Lot Number 批号 2Y9y5[K,F)
51 Low Dropout 低压差
11PLH0
52 Miller 密勒 53 node 节点 ;|Y2r^c
54 Non-Inverting 非反相 Ar\IZ_Q
55 novel 新颖的 I|GV
:D
56 off state 关断状态 TXA. 6e
57 Operating supply voltage 电源工作电压 .WxFm@]/\
58 out drive stage 输出驱动级 q]2}UuM|U
59 Out of Phase 异相 l_UXrnm/N
60 Part Number 产品型号 J,CJPUf&
61 pass transistor pass transistor FRb&@(;
62 P-channel MOSFET P沟道MOSFET r!"CH5dT
63 Phase margin 相位裕度 L%TxP6z4A
64 Phase Node 开关节点 \Mobq
65 portable electronics 便携式电子设备 l=Vowx.$2f
66 power down 掉电 "Nk`RsW
67 Power Good 电源正常 N )b|
68 Power Groud 功率地
\r:m({G
69 Power Save Mode 节电模式 A}az
m>
70 Power up 上电 k#{lt-a/
71 pull down 下拉 fx8y`8}_
72 pull up 上拉 X; e`y:9
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 1^n5CI|7u
74 push pull converter 推挽转换器 JS<e`#c&
75 ramp down 斜降 "~.8eKRQ
76 ramp up 斜升 \c5#\1<
77 redundant diode 冗余二极管 ,Y78Q
78 resistive divider 电阻分压器 r*~n`
79 ringing 振 铃 yHa:?u6
80 ripple current 纹波电流 V\e13cL]
81 rising edge 上升沿
@vVRF
Z
82 sense resistor 检测电阻 ?yK%]1O
83 Sequenced Power Supplys 序列电源 fRca"v V
84 shoot-through 直通,同时导通 j TB<E=WC
85 stray inductances. 杂散电感 TWl(\<&+)
86 sub-circuit 子电路 eSQzjR*
87 substrate 基板 v@}1WGY
88 Telecom 电信 2zmQp
89 Thermal Information 热性能信息 .3S\Rrv
90 thermal slug 散热片 1{;[q3a
91 Threshold 阈值 x
mrugNRg
92 timing resistor 振荡电阻 3Vb=6-|
93 Top FET Top FET RE(=! 8lGR
94 Trace 线路,走线,引线 B.C H9M
95 Transfer function 传递函数 KoxGxHz^Y3
96 Trip Point 跳变点 yhJA;&}>
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 4{Yy05PFS
98 Under Voltage Lock Out (UVLO) 欠压锁定 oF 1W}DtA
99 Voltage Reference 电压参考 b7>,-O
100 voltage-second product 伏秒积 {7ZtOe
101 zero-pole frequency compensation 零极点频率补偿 0C"PC:h5
102 beat frequency 拍频 l&e5_]+%
103 one shots 单击电路 i_jax)m%
104 scaling 缩放 _k"&EW{ Ii
105 ESR 等效串联电阻 [Page] >yPFL'
106 Ground 地电位 3_R
107 trimmed bandgap 平衡带隙 6B!j(R
108 dropout voltage 压差 h1G*y
109 large bulk capacitance 大容量电容 e$FAhwpon
110 circuit breaker 断路器 +*r**(-Dm
111 charge pump 电荷泵 Npf7 p
112 overshoot 过冲 tehI!->l
D~i@. k
印制电路printed circuit Wzf1-0t
印制线路 printed wiring 9wDBC~.
印制板 printed board +cE tm
印制板电路 printed circuit board mv9E{m
印制线路板 printed wiring board GP7)m
印制元件 printed component Gn2bZ%l
印制接点 printed contact G2[IO $
印制板装配 printed board assembly i?i7T`
板 board #<PA-
y
刚性印制板 rigid printed board Te U7W?M^
挠性印制电路 flexible printed circuit &[2Ej|o
挠性印制线路 flexible printed wiring Aa\=7
齐平印制板 flush printed board bVAgul=__
金属芯印制板 metal core printed board =p&'_a^$
金属基印制板 metal base printed board
6Qzu-
多重布线印制板 mulit-wiring printed board vwqN;|F
塑电路板 molded circuit board +=B}R
散线印制板 discrete wiring board ~y-vKCp|
微线印制板 micro wire board E;GR;i{t
积层印制板 buile-up printed board PhI6dB`
表面层合电路板 surface laminar circuit ZR01<V
埋入凸块连印制板 B2it printed board |au qj2
载芯片板 chip on board l3Bxi1k[C
埋电阻板 buried resistance board afP&+ 5t@O
母板 mother board wMPw/a;
子板 daughter board ==jw3_W
背板 backplane ~b6<uRnM.
裸板 bare board 7)(`
键盘板夹心板 copper-invar-copper board e
ka@?`
动态挠性板 dynamic flex board $ DZQdhv
静态挠性板 static flex board 1J{z}yPHc
可断拼板 break-away planel CAo )v,f
电缆 cable eE riv@v
挠性扁平电缆 flexible flat cable (FFC) YaJ{"'}
薄膜开关 membrane switch T
m@1q!G
混合电路 hybrid circuit gHh.|PysW
厚膜 thick film N>nvt.`P
厚膜电路 thick film circuit ?lwQne8/
薄膜 thin film EDidg"0p
薄膜混合电路 thin film hybrid circuit 3!oQmG_T
互连 interconnection :@@A
导线 conductor trace line Pdm6u73
齐平导线 flush conductor q
V
UUuyF
传输线 transmission line `F+x]<m!
跨交 crossover iZq@W3GL
C
板边插头 edge-board contact kW2nrkF
增强板 stiffener tId !C
基底 substrate 3Gd&=IJ
基板面 real estate 0-~6}
r$
导线面 conductor side %`\_l
元件面 component side *"QE1Fum'
焊接面 solder side t|U2ws#
导电图形 conductive pattern i(f;'fb*
非导电图形 non-conductive pattern !E:Vn *k;
基材 base material CpqSn/
层压板 laminate Qdr-GODx
覆金属箔基材 metal-clad bade material wAOVH].
覆铜箔层压板 copper-clad laminate (CCL) ~q T1<k
复合层压板 composite laminate U1HD~
薄层压板 thin laminate :k )<1ua
基体材料 basis material ?^$4)Y>Kf
预浸材料 prepreg 6j"I5,-~!
粘结片 bonding sheet WKIiJ{@L
预浸粘结片 preimpregnated bonding sheer 7fTg97eF
环氧玻璃基板 epoxy glass substrate ,f0g|5yDf
预制内层覆箔板 mass lamination panel \y )4`A
内层芯板 core material @oc%4~zl
粘结层 bonding layer E e\-q
粘结膜 film adhesive +j: Ld(
无支撑胶粘剂膜 unsupported adhesive film 8~Hs3\Hp
覆盖层 cover layer (cover lay) ryp$|?ckJ
增强板材 stiffener material rUpAiZfz >
铜箔面 copper-clad surface 8!%"/*P$
去铜箔面 foil removal surface AW&s-b%P
层压板面 unclad laminate surface (`y|AOs
基膜面 base film surface I.0P7eA-
胶粘剂面 adhesive faec W]}V<S$
原始光洁面 plate finish = 4WZr
粗面 matt finish 9PGR#!!F$
剪切板 cut to size panel RGA*7
超薄型层压板 ultra thin laminate ZFuJ2 :
A阶树脂 A-stage resin ;q&D,4r]
B阶树脂 B-stage resin XhD fI
&
C阶树脂 C-stage resin y'O{8Q8T
环氧树脂 epoxy resin MHyl=5
酚醛树脂 phenolic resin RowiSW
聚酯树脂 polyester resin 27 TZ+?
聚酰亚胺树脂 polyimide resin +M]8_kE=+l
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin v_h*:c
丙烯酸树脂 acrylic resin Heif FJn
三聚氰胺甲醛树脂 melamine formaldehyde resin k\<Ln
w
多官能环氧树脂 polyfunctional epoxy resin ;,-Vapz
溴化环氧树脂 brominated epoxy resin J'c9577$
环氧酚醛 epoxy novolac k Q(y^t W
氟树脂 fluroresin 5_C#_=E
硅树脂 silicone resin sfPN\^k2
硅烷 silane / lM~K:
聚合物 polymer Ib8{+j
无定形聚合物 amorphous polymer "jc)N46
结晶现象 crystalline polamer sK/"
双晶现象 dimorphism D=sc41]
共聚物 copolymer _";pk _
合成树脂 synthetic }~'Wz*Gm
热固性树脂 thermosetting resin [Page] de47O
热塑性树脂 thermoplastic resin *>$)#?t
感光性树脂 photosensitive resin 4^ 6L ])y
环氧值 epoxy value JsEEAM:w
双氰胺 dicyandiamide \\Tp40m+
粘结剂 binder eniR}
胶粘剂 adesive TC{Qu;`H+U
固化剂 curing agent *+Q*&-$
阻燃剂 flame retardant '0$[Ujc
遮光剂 opaquer Byj~\QMD|
增塑剂 plasticizers kD7(}N8YR
不饱和聚酯 unsatuiated polyester iQ"F`C
聚酯薄膜 polyester `#8R+c=$
聚酰亚胺薄膜 polyimide film (PI) gK\7^95
聚四氟乙烯 polytetrafluoetylene (PTFE) azc:C
增强材料 reinforcing material (b}7Yb]#c
折痕 crease mM{v>Em2K#
云织 waviness ucP MT0k
鱼眼 fish eye $QBUnLOek&
毛圈长 feather length `2+e\%f/0
厚薄段 mark g9Gy3zk=
裂缝 split '\\Cpc_g
捻度 twist of yarn BQ0\+
浸润剂含量 size content Ka\b_P&
浸润剂残留量 size residue xG/qDc
处理剂含量 finish level AK?j1Pk
偶联剂 couplint agent Z x%@wH~
断裂长 breaking length :]QxT8B
吸水高度 height of capillary rise NWK_(=n
湿强度保留率 wet strength retention :?k=Yr
白度 whitenness #'h CohL
导电箔 conductive foil r!,V_a4n
铜箔 copper foil 3*2pacHpE
压延铜箔 rolled copper foil U/o}{,$A
光面 shiny side s2=X>,kz?
粗糙面 matte side nn%xN\~<
处理面 treated side Qo *]l_UO;
防锈处理 stain proofing _ u2
双面处理铜箔 double treated foil 5305N!
模拟 simulation ye2Oh7
逻辑模拟 logic simulation PzDgl6C
电路模拟 circit simulation -V<"Ay
时序模拟 timing simulation jloyJ@ck
模块化 modularization {o%R~{6
设计原点 design origin )6+W6:
优化(设计) optimization (design) L]<4{8H.
供设计优化坐标轴 predominant axis 7'uc;5:
表格原点 table origin rNyK*Wjt
元件安置 component positioning V7_??L%Ct`
比例因子 scaling factor 0 %+k>(@R
扫描填充 scan filling ,m]q+7E
矩形填充 rectangle filling !;Nh7vG
填充域 region filling K*FAngIB
实体设计 physical design Ntiz-qW
逻辑设计 logic design G3?z.5,Q
逻辑电路 logic circuit c$fM6M
}
层次设计 hierarchical design -;"l5oX
自顶向下设计 top-down design =>*N W9c
自底向上设计 bottom-up design L9oZ7 o
费用矩阵 cost metrix $8r:&Iw
元件密度 component density 3k^jR1
自由度 degrees freedom ?9TogW>W
出度 out going degree 64fG,b
入度 incoming degree -m/4\D
曼哈顿距离 manhatton distance K^\9R
欧几里德距离 euclidean distance sc60:IxgI
网络 network Dm#k-y
阵列 array "QS7?=>*F
段 segment tO3 ;;%
逻辑 logic U2$T}/@
逻辑设计自动化 logic design automation '%N)(S`O7P
分线 separated time d*L'`BBsp
分层 separated layer CI{x/ e^(
定顺序 definite sequence yk2j&}M
导线(通道) conduction (track) :TI1tJS~*
导线(体)宽度 conductor width 8F1!9W7
导线距离 conductor spacing mM.&c5U
导线层 conductor layer =w-H )
导线宽度/间距 conductor line/space >qA&;M
第一导线层 conductor layer No.1 'zK*?= ^jk
圆形盘 round pad |=s3a5sl
方形盘 square pad :f;|^(]"
菱形盘 diamond pad aDuanGC/V
长方形焊盘 oblong pad 7ow1=%Q
子弹形盘 bullet pad +$5^+C\6A
泪滴盘 teardrop pad {wI0 =U
雪人盘 snowman pad n}{cs
形盘 V-shaped pad V l1WVt}
环形盘 annular pad {'!~j!1'j
非圆形盘 non-circular pad v<1;1m
隔离盘 isolation pad S##W_OlrI
非功能连接盘 monfunctional pad 6EY4@0%A
偏置连接盘 offset land 'Iu(lpF&
腹(背)裸盘 back-bard land `2B+8,{%
盘址 anchoring spaur *Y Ox`z!R
连接盘图形 land pattern whCv9)x
连接盘网格阵列 land grid array v0=~PN~E
孔环 annular ring 1 <+^$QL
元件孔 component hole vaL-Mi(_
安装孔 mounting hole 7~'@m(9e
支撑孔 supported hole iQF93:#
非支撑孔 unsupported hole X!Q"p$D4(
导通孔 via Gj=il-Po
镀通孔 plated through hole (PTH) srL,9)OC
余隙孔 access hole D#0}/
盲孔 blind via (hole) zVu}7v()
埋孔 buried via hole V 6F,X`7
埋,盲孔 buried blind via }_ E
任意层内部导通孔 any layer inner via hole <vs.Ucxx
全部钻孔 all drilled hole )1/O_N6C
定位孔 toaling hole Lst5
无连接盘孔 landless hole }R^{<{KVJ
中间孔 interstitial hole F/8y p<_r
无连接盘导通孔 landless via hole +Q.[W`goV
引导孔 pilot hole A@UnrbX:
端接全隙孔 terminal clearomee hole pN[i%\vh
准尺寸孔 dimensioned hole [Page] U|=y&a2Rb
在连接盘中导通孔 via-in-pad S:gP\Atf>
孔位 hole location X`&E,;bIb
孔密度 hole density Gx
m"HC
孔图 hole pattern F~EriO
钻孔图 drill drawing dSbV{*B;>
装配图assembly drawing =B 9U
参考基准 datum referan H,'c&
1) 元件设备 lI9 3{!+>
8MIHp[vm%
三绕组变压器:three-column transformer ThrClnTrans EOL03N
双绕组变压器:double-column transformer DblClmnTrans 8g\.1<~
电容器:Capacitor AOpfByw
并联电容器:shunt capacitor -Db(
电抗器:Reactor ~F WmT(S
母线:Busbar zC7;Zj*k
输电线:TransmissionLine ^#+9v
发电厂:power plant 3iB8QO;pp
断路器:Breaker ||qW'kNWM
刀闸(隔离开关):Isolator &A~ 1Q#4
分接头:tap m35G;
电动机:motor I/'>Bn+
(2) 状态参数 AK[c!mzx
;k>{I8L~
有功:active power tZJKB1#WbP
无功:reactive power |$Td-M^)
电流:current yDPek*#^"q
容量:capacity QFMS]
电压:voltage DGcd|>q
档位:tap position [X|P(&\hQd
有功损耗:reactive loss 2l9_$evK~
无功损耗:active loss `+U-oqs
功率因数:power-factor 8 _>R 'u[
功率:power `| fF)kI
功角:power-angle `|gCbs95
电压等级:voltage grade + EM '-
空载损耗:no-load loss h<?Vzl
铁损:iron loss _b+3;Dy
铜损:copper loss Gb"PMai
空载电流:no-load current PWTAy\
阻抗:impedance #VLTx!5o
正序阻抗:positive sequence impedance T+I|2HYqOj
负序阻抗:negative sequence impedance Ba"Z^(:
零序阻抗:zero sequence impedance h-<+Pj c
电阻:resistor >d=k-d
电抗:reactance y<)x`&pcD
电导:conductance wDn5|F}i&
电纳:susceptance U@H SU%H
无功负载:reactive load 或者QLoad E]bjI$j
有功负载: active load PLoad C3|M\[*fp
遥测:YC(telemetering) ^+-i7`|=
遥信:YX \5Hfe;ny-~
励磁电流(转子电流):magnetizing current 4]Krx
m`8
定子:stator )F:hv[iv
功角:power-angle y8\44WKW
上限:upper limit 1|2X0Xm{
下限:lower limit q?`bu:yS
并列的:apposable B7cXbUAQs
高压: high voltage dH8H<K~
低压:low voltage "/K44(^
中压:middle voltage ondF
电力系统 power system RK|C* TCnl
发电机 generator `Dj-(~x
励磁 excitation 7Kfh:0Ihhy
励磁器 excitor +g(QF
电压 voltage 9%|!+!j
电流 current <J\z6+,4E
母线 bus 8!1vsEqv
变压器 transformer 90;[5c
升压变压器 step-up transformer t|1?mH9
高压侧 high side NT:p6(s^
输电系统 power transmission system $Die~rPU
输电线 transmission line k<m{Wp;-
固定串联电容补偿fixed series capacitor compensation H.*XoktC]
稳定 stability k5(@n>p
电压稳定 voltage stability p;g$D=2
功角稳定 angle stability ]"^U
暂态稳定 transient stability WJ8i,7
电厂 power plant U5odSR$
能量输送 power transfer $`mxOcBmQ
交流 AC Ao(Xz$cQfW
装机容量 installed capacity 2}K7(y!?u
电网 power system \It8+^d@
落点 drop point !M6*A1g5
开关站 switch station tAefBFu
双回同杆并架 double-circuit lines on the same tower Pr9$(6MX
变电站 transformer substation XB
zcbS+
补偿度 degree of compensation :A>cf}
高抗 high voltage shunt reactor *zJ}=%)f
无功补偿 reactive power compensation )bXiw3'A
故障 fault >k5nU^|B1
调节 regulation YhRES]^
裕度 magin 6|L<?
X
三相故障 three phase fault [?^,,.Dd
故障切除时间 fault clearing time `$7.(.#s
极限切除时间 critical clearing time ,!Gw40t
切机 generator triping hvkLcpE
高顶值 high limited value gh#9<
强行励磁 reinforced excitation >:WnCkbp
线路补偿器 LDC(line drop compensation) h@&&.S`B
机端 generator terminal x[zt(kC0+
静态 static (state) ?Mtd3F^o?
动态 dynamic (state) 'gI q_t|^
单机无穷大系统 one machine - infinity bus system W$=Ad *
机端电压控制 AVR NJRk##Z
电抗 reactance *F[@lY\p
电阻 resistance 1^jGSB.%A
功角 power angle @lRTp
有功(功率) active power A!\g!*
无功(功率) reactive power Y j;KKgk
功率因数 power factor f%<kcM2
无功电流 reactive current {26/SY
下降特性 droop characteristics ~bC{R&p
斜率 slope h\k@7wgu
额定 rating O`<id+rx
变比 ratio dI};l
参考值 reference value tJ;<=.n
电压互感器 PT %ukFn
&-2@
分接头 tap >)\x\e
下降率 droop rate CY"&@v1
仿真分析 simulation analysis j51Wod<[
传递函数 transfer function %5Q5xw]w3
框图 block diagram
+uZ,}J
受端 receive-side o`,|{K$H
裕度 margin :s DE'o
同步 synchronization E{'{fo!#)
失去同步 loss of synchronization {xJq F4
阻尼 damping D+.<
kY.
摇摆 swing 7L)edR[
保护断路器 circuit breaker BWRAz*V
电阻:resistance uyZ
电抗:reactance T%zCAfx m
阻抗:impedance _kGJqyYV
电导:conductance q% *-4GP
电纳:susceptance