1 backplane 背板 ykJ+LS{+
2 Band gap voltage reference 带隙电压参考 rv(N0p/
3 benchtop supply 工作台电源 1$.svR
4 Block Diagram 方块图 5 Bode Plot 波特图 n*ShYsc
6 Bootstrap 自举 uF|_6~g
7 Bottom FET Bottom FET V sxI
8 bucket capcitor 桶形电容 5,oLl {S'
9 chassis 机架 _q1\8y
10 Combi-sense Combi-sense Zk lpnL*!
11 constant current source 恒流源 *P9" 1K+
12 Core Sataration 铁芯饱和 !4D?X\~"%
13 crossover frequency 交叉频率 )=()
14 current ripple 纹波电流 yQ[ ;.<%v
15 Cycle by Cycle 逐周期 gED|2%BXb
16 cycle skipping 周期跳步 -C(Yl=
17 Dead Time 死区时间 _EP]|DTfr
18 DIE Temperature 核心温度 WkE="E}
19 Disable 非使能,无效,禁用,关断 <XG]aYBR
20 dominant pole 主极点 )92(C
21 Enable 使能,有效,启用 IO9|o!&>
22 ESD Rating ESD额定值 t3?I4HQ
23 Evaluation Board 评估板
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24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. H[nBNz)C
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 u&c%L0)E&
25 Failling edge 下降沿 T(Q ~b
26 figure of merit 品质因数 `pCy:J?d>l
27 float charge voltage 浮充电压 \b$pH
28 flyback power stage 反驰式功率级 IAGY-+8e
29 forward voltage drop 前向压降 2]9
2J
30 free-running 自由运行 ~+0IFJ `}
31 Freewheel diode 续流二极管 G1e_pszD{o
32 Full load 满负载 33 gate drive 栅极驱动 $\vNSTE
34 gate drive stage 栅极驱动级 ps:`rVQ7
35 gerber plot Gerber 图 J^7M0A4K
36 ground plane 接地层 =^rp=
Az
37 Henry 电感单位:亨利 #k)z5vZ$h
38 Human Body Model 人体模式 R_g(6l"3R^
39 Hysteresis 滞回 )sdHJ
40 inrush current 涌入电流 Z}0xK6
41 Inverting 反相 ezL1,GT
42 jittery 抖动 '"\n,3h
43 Junction 结点 b\H&E{Gn|x
44 Kelvin connection 开尔文连接 i.W*Go+
45 Lead Frame 引脚框架 -N^Ah_9ek
46 Lead Free 无铅 *A8*FX>\F
47 level-shift 电平移动 Spx%`O<
48 Line regulation 电源调整率 ]g ;+7
49 load regulation 负载调整率 \/j,
50 Lot Number 批号 %JiF269
51 Low Dropout 低压差 s#aj5_G
52 Miller 密勒 53 node 节点 p&Qm[!
54 Non-Inverting 非反相 |hi,]D^Kc
55 novel 新颖的 J|^XD<Y
56 off state 关断状态 %5zIh[!1$
57 Operating supply voltage 电源工作电压 sCY
58 out drive stage 输出驱动级 k*6"!J%A
59 Out of Phase 异相 y7!&
60 Part Number 产品型号 )h 6 w@TF
61 pass transistor pass transistor :;hg :Q:
62 P-channel MOSFET P沟道MOSFET ,4'y(X<R
63 Phase margin 相位裕度 M \k[?i
64 Phase Node 开关节点 !lFNG:&`
65 portable electronics 便携式电子设备 H.>EO|p
66 power down 掉电 /0gr?I1wr7
67 Power Good 电源正常 ak_y:O|
68 Power Groud 功率地 Hc>yZ:c;
69 Power Save Mode 节电模式 Zazs".
70 Power up 上电 Z:AB(c
71 pull down 下拉 fa/o4S<
72 pull up 上拉 V[*>}XQER
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) [QQM/ ?
74 push pull converter 推挽转换器 /*BU5
75 ramp down 斜降 11#b%dT
76 ramp up 斜升 TW(X#T@Z6I
77 redundant diode 冗余二极管 /Ta-3Eh!
78 resistive divider 电阻分压器 /({oN1X>i
79 ringing 振 铃 N;-%:nC
80 ripple current 纹波电流 J
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81 rising edge 上升沿 )7+z/y+[n
82 sense resistor 检测电阻 2(~Zl\
83 Sequenced Power Supplys 序列电源 H{N},B
84 shoot-through 直通,同时导通 PknKzrEG:>
85 stray inductances. 杂散电感 ~4Fz A,,
86 sub-circuit 子电路 VO {z)_
87 substrate 基板 z?Z"*z
88 Telecom 电信 0',buJncV
89 Thermal Information 热性能信息 s1::\&`za
90 thermal slug 散热片 &{<hY|%
91 Threshold 阈值 b3[!1i
92 timing resistor 振荡电阻 S!$S'{f<
93 Top FET Top FET +UX~'t_'v
94 Trace 线路,走线,引线 _U4@W+lhX_
95 Transfer function 传递函数 5HHf3E [
96 Trip Point 跳变点 zvq}7,
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ,\&r\!=
98 Under Voltage Lock Out (UVLO) 欠压锁定 jLMy27Cn
99 Voltage Reference 电压参考 03zt^<
100 voltage-second product 伏秒积 ??.aLeF&
101 zero-pole frequency compensation 零极点频率补偿 |X XO0
102 beat frequency 拍频 J|
wk})?
103 one shots 单击电路 hPz=Ec<zW
104 scaling 缩放 WH39=)D%u
105 ESR 等效串联电阻 [Page] iQ2}*:Jc$
106 Ground 地电位 M"p%CbcI]
107 trimmed bandgap 平衡带隙 zx]r.V
108 dropout voltage 压差 C:^
:^y
109 large bulk capacitance 大容量电容 V*2*5hx
110 circuit breaker 断路器 [$d]U.
111 charge pump 电荷泵 k}nGgd6XD
112 overshoot 过冲 owA8hGF
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印制电路printed circuit }m^^6h
印制线路 printed wiring /!t:MK;
印制板 printed board [ypE[
印制板电路 printed circuit board M,ybj5:6
印制线路板 printed wiring board +IbV
印制元件 printed component b5]<!~Fv:`
印制接点 printed contact "0 %fR"
印制板装配 printed board assembly 9yTDuhJ6
板 board |k]]dP|:'
刚性印制板 rigid printed board :a2[d1
挠性印制电路 flexible printed circuit w;Fy/XQ
挠性印制线路 flexible printed wiring HfH_jnR*
齐平印制板 flush printed board ^q& Rl\
金属芯印制板 metal core printed board PcZ<JJ16F$
金属基印制板 metal base printed board bw/mF5AsW
多重布线印制板 mulit-wiring printed board \/SOpC
塑电路板 molded circuit board Yuf+d-%
散线印制板 discrete wiring board 9$9aBW
微线印制板 micro wire board 1~E4]Ef:W
积层印制板 buile-up printed board $gYGnh_,Q
表面层合电路板 surface laminar circuit vyWx{@
埋入凸块连印制板 B2it printed board 37?X@@Z=
载芯片板 chip on board NPO!J^^
埋电阻板 buried resistance board `.pd %\
母板 mother board Tyaqa0
子板 daughter board bYem0hzOe
背板 backplane )
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裸板 bare board u^]Gc p
键盘板夹心板 copper-invar-copper board vNdX
动态挠性板 dynamic flex board =Xid"$
静态挠性板 static flex board 9+<A7PM1T
可断拼板 break-away planel Df2$2VU
电缆 cable W;!V_-:
挠性扁平电缆 flexible flat cable (FFC) iKaS7lWH
薄膜开关 membrane switch wK fq'W{
混合电路 hybrid circuit \Jc}Hzug
厚膜 thick film %cDTq&Q
厚膜电路 thick film circuit p(4B"[ !S
薄膜 thin film .)%,R
薄膜混合电路 thin film hybrid circuit qSD`S1'2;
互连 interconnection "mU2^4q
导线 conductor trace line +G!#
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齐平导线 flush conductor *'M+oi
传输线 transmission line J%q)6&
跨交 crossover Mkt_pr
板边插头 edge-board contact Cl&)#
增强板 stiffener f0%'4t
基底 substrate #^|2PFh5
基板面 real estate
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导线面 conductor side M1 o@v 0
元件面 component side @_c&lToj_
焊接面 solder side /']`}*d
导电图形 conductive pattern N(J#<;!yb
非导电图形 non-conductive pattern <pG 4g
基材 base material d%q&[<'jf
层压板 laminate f`-vnh^+
覆金属箔基材 metal-clad bade material =\i%,YY
覆铜箔层压板 copper-clad laminate (CCL) \oGU6h<
复合层压板 composite laminate wXdt\@Qr
薄层压板 thin laminate \7$"i5
基体材料 basis material "9*MSsU
预浸材料 prepreg u!It';j
粘结片 bonding sheet OQg}E@LZ
预浸粘结片 preimpregnated bonding sheer +yk 0ez
环氧玻璃基板 epoxy glass substrate &h6 `hP_
预制内层覆箔板 mass lamination panel 7NvRZ!
内层芯板 core material >8vq`,e
粘结层 bonding layer 0oi.k;
粘结膜 film adhesive U
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无支撑胶粘剂膜 unsupported adhesive film #X{lV]Z
覆盖层 cover layer (cover lay) [;D1O;c'W.
增强板材 stiffener material 5yV>-XT+-
铜箔面 copper-clad surface HuSE6an
去铜箔面 foil removal surface ?f:0GE7
层压板面 unclad laminate surface [z;}^ 3b
基膜面 base film surface 1guiuR4
胶粘剂面 adhesive faec 7g o Rj
原始光洁面 plate finish k"/}9[6:U5
粗面 matt finish *|L;&XM&/
剪切板 cut to size panel w; f LnEz_
超薄型层压板 ultra thin laminate CA$|3m9)NM
A阶树脂 A-stage resin EQHCw<e
B阶树脂 B-stage resin :8+x&zn
C阶树脂 C-stage resin 7}&vEc@w&
环氧树脂 epoxy resin wIF'|"
酚醛树脂 phenolic resin }^n"t>Z8
聚酯树脂 polyester resin brqmi<*9"[
聚酰亚胺树脂 polyimide resin dg0WH_#
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 8f'r_,"
丙烯酸树脂 acrylic resin v806f8
三聚氰胺甲醛树脂 melamine formaldehyde resin CzDg?w b
多官能环氧树脂 polyfunctional epoxy resin n5fc_N/8O=
溴化环氧树脂 brominated epoxy resin 7s0y.i~
环氧酚醛 epoxy novolac ^8?px&B y:
氟树脂 fluroresin NVf_#p"h
硅树脂 silicone resin $c+:dO|Fb
硅烷 silane '8@4FXK
聚合物 polymer v//Drj
无定形聚合物 amorphous polymer uS xldc
结晶现象 crystalline polamer ~qA\u5sB9@
双晶现象 dimorphism |F~U
共聚物 copolymer .=Uu{F
合成树脂 synthetic bK!uR&i^l
热固性树脂 thermosetting resin [Page] /}d)g4\j
热塑性树脂 thermoplastic resin fLkC|
感光性树脂 photosensitive resin !(j<Y0xo:
环氧值 epoxy value b0N7[M1Xl
双氰胺 dicyandiamide nIUts?mB
粘结剂 binder ^'b\OUty-
胶粘剂 adesive j4#S/:Q<7
固化剂 curing agent ~Hb0)M@y7
阻燃剂 flame retardant ]<_v;Q<t
遮光剂 opaquer Qgo|\=
增塑剂 plasticizers _2}/rwVg
不饱和聚酯 unsatuiated polyester Z?eedVV@
聚酯薄膜 polyester B/JMH 1r
聚酰亚胺薄膜 polyimide film (PI) Y5mk*Q#q
聚四氟乙烯 polytetrafluoetylene (PTFE) Qb86*
增强材料 reinforcing material oPF
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折痕 crease 7U&<{U<
云织 waviness NV2$ >D
鱼眼 fish eye @Ps1.
毛圈长 feather length i)]^b{5nyB
厚薄段 mark EPEn"{;U
裂缝 split \LM{.gzT
捻度 twist of yarn _+0c<'
浸润剂含量 size content -x>2Wb~%
浸润剂残留量 size residue 7VfPS5se
处理剂含量 finish level GM0pHmC
偶联剂 couplint agent reNUIDt/c
断裂长 breaking length j>hBNz
吸水高度 height of capillary rise _J_QB]t
湿强度保留率 wet strength retention ]L\]Ll;
白度 whitenness gI+dyoh
导电箔 conductive foil YE-}1&8
铜箔 copper foil iis}=i7|
压延铜箔 rolled copper foil [XNDYaF8
光面 shiny side #b;TjnC5{$
粗糙面 matte side 'W p~8}i@
处理面 treated side I-/-k.
防锈处理 stain proofing qI2&a$Zb$
双面处理铜箔 double treated foil wJWofFz
模拟 simulation d!4:nvKx
逻辑模拟 logic simulation R)]+>M-.
电路模拟 circit simulation 90a!_8o
时序模拟 timing simulation -9q3]nmT(
模块化 modularization W;P8'_2Y
设计原点 design origin ^
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优化(设计) optimization (design) =$<