1 backplane 背板 8zO;=R A7%
2 Band gap voltage reference 带隙电压参考 %BwvA_T'Q
3 benchtop supply 工作台电源 Rn $TYCO
4 Block Diagram 方块图 5 Bode Plot 波特图 szs.B|3X@*
6 Bootstrap 自举 ZA7b;{o [
7 Bottom FET Bottom FET GUps\:ss
8 bucket capcitor 桶形电容 7Tc^}Q
9 chassis 机架 !!<H*9]+W;
10 Combi-sense Combi-sense n[gc`#7|{e
11 constant current source 恒流源 IMSLHwZ
12 Core Sataration 铁芯饱和 0i>>CvAl}
13 crossover frequency 交叉频率 Q"s]<MtdS
14 current ripple 纹波电流 @M*oq2U;
15 Cycle by Cycle 逐周期 $ vBFs]h
16 cycle skipping 周期跳步 Q%QIr
17 Dead Time 死区时间 ':7gYP*v
18 DIE Temperature 核心温度 ]64pb;w"$D
19 Disable 非使能,无效,禁用,关断 Xd@ d$
20 dominant pole 主极点 QKI g5I-
21 Enable 使能,有效,启用 @Yw>s9X
22 ESD Rating ESD额定值 6Zx)L|B
23 Evaluation Board 评估板 =<X4LO)C
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. zwJ\F '
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 x3l~k Z(
25 Failling edge 下降沿 Y;{(?0
s
26 figure of merit 品质因数 Z_4|L+i<{
27 float charge voltage 浮充电压 .|i/
a%J
28 flyback power stage 反驰式功率级 h,ipQ>
29 forward voltage drop 前向压降 J|u_45<
30 free-running 自由运行 eWr2UXv$
31 Freewheel diode 续流二极管 r<[G~n
32 Full load 满负载 33 gate drive 栅极驱动 BUUc9&f3o
34 gate drive stage 栅极驱动级 ^g=j`f[T
35 gerber plot Gerber 图 ap<r)<u
36 ground plane 接地层 i|xC#hV
37 Henry 电感单位:亨利 ub]s>aqy
38 Human Body Model 人体模式 %-L
T56T
39 Hysteresis 滞回 bh+m_$X~
40 inrush current 涌入电流 0|| 5r#
41 Inverting 反相 [ZL<Q
42 jittery 抖动 fLZ99?J
43 Junction 结点 <q`|,mc
44 Kelvin connection 开尔文连接 ZU;nXqjc
45 Lead Frame 引脚框架 _2WW0
46 Lead Free 无铅 6GoQJ
47 level-shift 电平移动 )T@?.J`
48 Line regulation 电源调整率 ?(Xy 2%v
49 load regulation 负载调整率 \s6VOR/
50 Lot Number 批号 z,RjQTd
51 Low Dropout 低压差 '>GPk5Nq77
52 Miller 密勒 53 node 节点 JvF0s}#4
54 Non-Inverting 非反相 w&*oWI$i
55 novel 新颖的 A&{eC
C
56 off state 关断状态 pp+z5
57 Operating supply voltage 电源工作电压 47)\\n_\z
58 out drive stage 输出驱动级 UlPhW~F)
59 Out of Phase 异相 _FCg5F2U
60 Part Number 产品型号 C[CNJ66
61 pass transistor pass transistor )O8w'4P5
62 P-channel MOSFET P沟道MOSFET ,M Ugww!.
63 Phase margin 相位裕度 SP;1XXlL
64 Phase Node 开关节点 |(=b
65 portable electronics 便携式电子设备 Oo/@A_JO@
66 power down 掉电 [*g'Y;W
67 Power Good 电源正常 }[y_Fr0
68 Power Groud 功率地 AG|:mQO
69 Power Save Mode 节电模式 v?l*jr1-2
70 Power up 上电 |=[._VH1
71 pull down 下拉 cvC 7#i[G
72 pull up 上拉 4MoxP
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) <CWOx&hr
74 push pull converter 推挽转换器 $49;\pBZl
75 ramp down 斜降 0GQKM~|H
76 ramp up 斜升 Pu(kCH{
77 redundant diode 冗余二极管 S<g~VK!Tt
78 resistive divider 电阻分压器 WH<\f|xR
79 ringing 振 铃 bp'\nso/
80 ripple current 纹波电流 k/i&e~! \
81 rising edge 上升沿 >6|Xvtf
82 sense resistor 检测电阻 FAq9G-\B
83 Sequenced Power Supplys 序列电源 >gDKkeLD
84 shoot-through 直通,同时导通 l4y>uZ>a
85 stray inductances. 杂散电感 5k;}I|rg %
86 sub-circuit 子电路 91UC>]}H
87 substrate 基板 TVK*l*
88 Telecom 电信 A27!I+M
89 Thermal Information 热性能信息 ->W rBO
90 thermal slug 散热片 Wf=hFc1_@
91 Threshold 阈值 d~y]7h |
92 timing resistor 振荡电阻 Zbf~E {
93 Top FET Top FET zANsv9R~
94 Trace 线路,走线,引线 sqO$ka{
95 Transfer function 传递函数 K<v:RbU|[1
96 Trip Point 跳变点 k)agbx
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) G4%dah 5
98 Under Voltage Lock Out (UVLO) 欠压锁定 < Q6
99 Voltage Reference 电压参考 ?>mpUH
100 voltage-second product 伏秒积 4{%-r[C9k
101 zero-pole frequency compensation 零极点频率补偿 W{t-UK
102 beat frequency 拍频 N~DO_^
103 one shots 单击电路 w}?,N
104 scaling 缩放 GK{~n
105 ESR 等效串联电阻 [Page] #66u<FaG
106 Ground 地电位 oTveY
107 trimmed bandgap 平衡带隙 ^39?@xc@
108 dropout voltage 压差 q)N^
109 large bulk capacitance 大容量电容 +<)H2
110 circuit breaker 断路器 [@0Hmd7
111 charge pump 电荷泵 eY_BECJ+OO
112 overshoot 过冲 6>[J^k%~w)
<<&SyP
印制电路printed circuit ew,g'$drD
印制线路 printed wiring NZ-57Ji
印制板 printed board y27MG
印制板电路 printed circuit board *Tq7[v{0*|
印制线路板 printed wiring board C^!~WFy
印制元件 printed component }BiA@n,
印制接点 printed contact uk3PoB^>
印制板装配 printed board assembly Lt{&v^y
板 board
CL5t6D9Qi
刚性印制板 rigid printed board 5G=fJAG
挠性印制电路 flexible printed circuit 9w-;d=(Q
挠性印制线路 flexible printed wiring c22L]Sxo
齐平印制板 flush printed board E :UJ"6
金属芯印制板 metal core printed board LHs^Xo18
金属基印制板 metal base printed board o:@A% *jg
多重布线印制板 mulit-wiring printed board ]E1|^[y
塑电路板 molded circuit board J74kK#uF=
散线印制板 discrete wiring board T/q*k)IoR
微线印制板 micro wire board C+0BV~7J<<
积层印制板 buile-up printed board #^w8Y'{?
表面层合电路板 surface laminar circuit JiGS[tR
埋入凸块连印制板 B2it printed board UC!"1)~mt`
载芯片板 chip on board =9A!5
埋电阻板 buried resistance board qR^+K@*|
母板 mother board u9{Z*w3L7
子板 daughter board (n2=.9k!
背板 backplane sX(rJLbD
裸板 bare board `LJ.NY pP
键盘板夹心板 copper-invar-copper board FwDEYG
动态挠性板 dynamic flex board
(!T\[6
静态挠性板 static flex board z[0t%]7l
可断拼板 break-away planel ;RW5XnVx
电缆 cable nu6v@<<F>
挠性扁平电缆 flexible flat cable (FFC) ]F4|@+\9
薄膜开关 membrane switch 6W)#FO`
混合电路 hybrid circuit PBAQ
KQ
厚膜 thick film oi%IHX(`
厚膜电路 thick film circuit D`PA@t
薄膜 thin film D/tFN+|P
薄膜混合电路 thin film hybrid circuit '^BTa6W}m
互连 interconnection <KZ J
导线 conductor trace line ;z9U_
齐平导线 flush conductor 1pTQMf a
传输线 transmission line ];Y tw6A
跨交 crossover jC'Diu4|Q
板边插头 edge-board contact 67 wq8|
增强板 stiffener D#11
N^-K
基底 substrate 3_Mynop
基板面 real estate MQVEO5
导线面 conductor side ?8$h%Ov-
元件面 component side (E \lLlN
焊接面 solder side 'l._00yu
导电图形 conductive pattern (?z"_\^n/
非导电图形 non-conductive pattern YF13&E2`\
基材 base material hJ(S]1B~G
层压板 laminate N)X51;+
覆金属箔基材 metal-clad bade material A )xfO-
覆铜箔层压板 copper-clad laminate (CCL) cnM`ywKW
复合层压板 composite laminate 0|~3\e/QV
薄层压板 thin laminate yu=(m~KX
基体材料 basis material I(+%`{Wv
预浸材料 prepreg Ml+O -
3T
粘结片 bonding sheet bYy7Ul6]
预浸粘结片 preimpregnated bonding sheer Pol
c.
环氧玻璃基板 epoxy glass substrate h5@JS1cY
预制内层覆箔板 mass lamination panel &MGM9
zm-]
内层芯板 core material 9w$+Qc
粘结层 bonding layer j6BFh=?D
粘结膜 film adhesive vtXZ`[D,l)
无支撑胶粘剂膜 unsupported adhesive film k
E-+#p
覆盖层 cover layer (cover lay) EV N:3
增强板材 stiffener material .Yxf0y?uv
铜箔面 copper-clad surface ;V4f6[<]'z
去铜箔面 foil removal surface 4|KtsAVp{
层压板面 unclad laminate surface # |,c3$
基膜面 base film surface Ve4@^Jy;
胶粘剂面 adhesive faec e",0Er FT
原始光洁面 plate finish @%[
VegT
粗面 matt finish >Q|S#(c
剪切板 cut to size panel PYW>
超薄型层压板 ultra thin laminate ?.,2EC=+
A阶树脂 A-stage resin 3 ~\S]
B阶树脂 B-stage resin -\}Ix>
C阶树脂 C-stage resin ]f3R;d
环氧树脂 epoxy resin A]OVmw
酚醛树脂 phenolic resin &y.6Hiy&
聚酯树脂 polyester resin "y=AVO
聚酰亚胺树脂 polyimide resin 4z!(!J)
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin iFaC[(1@a
丙烯酸树脂 acrylic resin Eb9{
三聚氰胺甲醛树脂 melamine formaldehyde resin -P=Hp/ELi
多官能环氧树脂 polyfunctional epoxy resin {&.?u1C.\
溴化环氧树脂 brominated epoxy resin (c9!:
环氧酚醛 epoxy novolac '0/[%Q
氟树脂 fluroresin oOHr~<
硅树脂 silicone resin f}+8m .g2
硅烷 silane |BA<> WE
聚合物 polymer p`3$NCJN
无定形聚合物 amorphous polymer XnV$}T:?X
结晶现象 crystalline polamer X1Y+ao 1)
双晶现象 dimorphism :faB7wduW;
共聚物 copolymer s@5r}6?M
合成树脂 synthetic x|<89o
L
热固性树脂 thermosetting resin [Page] #nJ&`woZt
热塑性树脂 thermoplastic resin !7aJfs2
感光性树脂 photosensitive resin IT\
x0b cv
环氧值 epoxy value ^ot9Q
双氰胺 dicyandiamide T'e
p&tNY
粘结剂 binder &p:GB_
胶粘剂 adesive >O}J*4A>+#
固化剂 curing agent ?$AWY\
阻燃剂 flame retardant
iU
a `<
遮光剂 opaquer Z1M{5E
增塑剂 plasticizers }A'Ro/n
不饱和聚酯 unsatuiated polyester D``>1IA]
聚酯薄膜 polyester o:Q.XWa@MG
聚酰亚胺薄膜 polyimide film (PI) ^_pJEX
聚四氟乙烯 polytetrafluoetylene (PTFE) S*?x|&a
增强材料 reinforcing material =CjN=FM
折痕 crease UvM_~qo
云织 waviness UJ6zgsD1b?
鱼眼 fish eye 5mB'\xGO2
毛圈长 feather length z+6%Ya&ls
厚薄段 mark TGu]6NzyZ
裂缝 split s+XDtO
捻度 twist of yarn }uk]1M2=
浸润剂含量 size content HVK./yqy
浸润剂残留量 size residue sn.&|)?Fi
处理剂含量 finish level xl;0&/7e
偶联剂 couplint agent keL!;q|r-)
断裂长 breaking length Ld3!2g2y7&
吸水高度 height of capillary rise B5fF\N^
湿强度保留率 wet strength retention mL[Y{t#N
白度 whitenness (w{C*iB
导电箔 conductive foil c-hhA%@Wq
铜箔 copper foil qI#ow_lL#
压延铜箔 rolled copper foil JLH,:2
光面 shiny side x$Tf IFy
粗糙面 matte side caC(KK#<
处理面 treated side F_C_K"[s
防锈处理 stain proofing ;m cu(J
双面处理铜箔 double treated foil f!aE/e\
模拟 simulation !E|k#c9
逻辑模拟 logic simulation SebJ}P1x
电路模拟 circit simulation I`8jJpGA
时序模拟 timing simulation 26<Wg7/,
模块化 modularization <tp#KZE
设计原点 design origin Wx-vWWx*Q
优化(设计) optimization (design) S2*ER
供设计优化坐标轴 predominant axis 6`l7saHXE
表格原点 table origin \w+a Q?e_
元件安置 component positioning Yl$Cj>FG
比例因子 scaling factor 1xE*quhrh
扫描填充 scan filling &i%1\o
矩形填充 rectangle filling $(U}#[Vie
填充域 region filling a#o6Nv
实体设计 physical design /l@h[}g+d-
逻辑设计 logic design 8QNd t
逻辑电路 logic circuit [#-!&>
层次设计 hierarchical design -*r]9f6x
自顶向下设计 top-down design ]J* y`jn
自底向上设计 bottom-up design &9F(uk=X
费用矩阵 cost metrix >hbT'Or@
元件密度 component density cXo^.u
自由度 degrees freedom `[zd
出度 out going degree 4]/i0\Vbam
入度 incoming degree ;&%G)f
曼哈顿距离 manhatton distance d$(>=gzBQ
欧几里德距离 euclidean distance XTOZ]H*^
网络 network oK3aW6
阵列 array \<R.F
段 segment 3Ta<7tEM
逻辑 logic f8'$Mn,
逻辑设计自动化 logic design automation HAr_z@#E
分线 separated time xFY<
ns
分层 separated layer (ATCP#lF
定顺序 definite sequence :xP$iEA`G
导线(通道) conduction (track) 11Hf)]M
导线(体)宽度 conductor width "Nn+Zw43
导线距离 conductor spacing e;/C}sK:
导线层 conductor layer >)IXc<"wq
导线宽度/间距 conductor line/space f YuM`O
第一导线层 conductor layer No.1 +#d}3^_]
圆形盘 round pad
(s\":5
C
方形盘 square pad @~l?hf
菱形盘 diamond pad "<J%@
长方形焊盘 oblong pad hIr$^%
子弹形盘 bullet pad Y/1,%8n
泪滴盘 teardrop pad M"t=0[0DM:
雪人盘 snowman pad ?$T39U^
形盘 V-shaped pad V khW9n*
环形盘 annular pad 9C{\=?e;
非圆形盘 non-circular pad Fc"&lk4e
隔离盘 isolation pad v 8`)h<:W?
非功能连接盘 monfunctional pad "n3i(sZ
偏置连接盘 offset land ;I+"MY7D
腹(背)裸盘 back-bard land Sp]i~#q_'
盘址 anchoring spaur o,sw[
连接盘图形 land pattern s;0eD5b>x
连接盘网格阵列 land grid array g}-Ch#
孔环 annular ring OZ$"P<X_"
元件孔 component hole kH43 T
安装孔 mounting hole WSY&\8
支撑孔 supported hole `>q|_w\e
非支撑孔 unsupported hole R "&(Ae?LR
导通孔 via f~.w2Cna
镀通孔 plated through hole (PTH) _0rHxh7}q
余隙孔 access hole 28j=q-9Z
盲孔 blind via (hole) IFX|"3[$
埋孔 buried via hole i~IQlyGr.
埋,盲孔 buried blind via lK?
Z38
任意层内部导通孔 any layer inner via hole /Jc?;@{
全部钻孔 all drilled hole ,Dz2cR6
定位孔 toaling hole E00zf3Jgv'
无连接盘孔 landless hole @x@w<e%
中间孔 interstitial hole 8O]U&A@
无连接盘导通孔 landless via hole =oF6|\]{;
引导孔 pilot hole I@=h|GM
端接全隙孔 terminal clearomee hole rI:KZ}GZ
准尺寸孔 dimensioned hole [Page] 1 ]@}+H
在连接盘中导通孔 via-in-pad )r2$/QF9
孔位 hole location Or9@ X=C
孔密度 hole density ^/W7Xd(s
孔图 hole pattern {I|k@
钻孔图 drill drawing K;f'&9-+i,
装配图assembly drawing n/"T7Y\2
参考基准 datum referan |<.b:e\4
1) 元件设备 1q!JpC^
c4LBlLv4
三绕组变压器:three-column transformer ThrClnTrans z#!xqIg0
双绕组变压器:double-column transformer DblClmnTrans DJE/u qE
电容器:Capacitor 9xg_M=72
并联电容器:shunt capacitor lO9{S=N
电抗器:Reactor ~zz |U!TG
母线:Busbar ISr~JQr
输电线:TransmissionLine B-[SUmHr
发电厂:power plant 33kI#45s
断路器:Breaker e![Q1!r
刀闸(隔离开关):Isolator 71tMX[x
分接头:tap ![5<\
电动机:motor wN)R !6
(2) 状态参数 Vk_*]wU
K74oRKv
有功:active power ,l<-*yMD
无功:reactive power &Jj> jCg
电流:current U!a"r8u|8q
容量:capacity G
7)D+],{Y
电压:voltage ~,e!t.339
档位:tap position >B~jPU
有功损耗:reactive loss >V(2Ke Y
无功损耗:active loss SEchF"KJQF
功率因数:power-factor ~+>M,LfK
功率:power LbR/it'}
功角:power-angle <J-OwO a-1
电压等级:voltage grade ?<frU ,{
空载损耗:no-load loss z K8#gif@
铁损:iron loss @\l>
<R9V
铜损:copper loss 5 J|;RtcR
空载电流:no-load current i`]M2Q
阻抗:impedance zFi+6I$
正序阻抗:positive sequence impedance wHZ!t,g
负序阻抗:negative sequence impedance `A
<yDy
零序阻抗:zero sequence impedance lO $M6l
电阻:resistor GP1>h.J
电抗:reactance H[N&Wiq/|
电导:conductance ^y6Pkb
P
电纳:susceptance Ql*/{#$
无功负载:reactive load 或者QLoad ($(1KE
有功负载: active load PLoad \>=YxB q
遥测:YC(telemetering) 3/rvSR!
遥信:YX K[sM)_I
励磁电流(转子电流):magnetizing current x}x@_w
定子:stator A}y1v;FB
功角:power-angle {t/!a0\HS
上限:upper limit u
F*cS&'Z
下限:lower limit ^YIOS]d>8#
并列的:apposable z~
u@N9M
高压: high voltage LVEVCpp@
低压:low voltage
18A&[6"!
中压:middle voltage '*,4F'
电力系统 power system ''v1Pv-
发电机 generator aY:(0en]&
励磁 excitation }ZmdX^xB
励磁器 excitor hYd8}BvA
电压 voltage :
m5u=:t
电流 current 1UM]$$:i
母线 bus *Ra")(RnDK
变压器 transformer iz^wBQ
升压变压器 step-up transformer 78QFaN$
高压侧 high side E+1j3Q;
输电系统 power transmission system CQ( @7
输电线 transmission line 0KQ8;&a|
固定串联电容补偿fixed series capacitor compensation Awh"SUOh0
稳定 stability `X^e}EGWu
电压稳定 voltage stability \34|9#*z-
功角稳定 angle stability W"-nzdAJ5
暂态稳定 transient stability Mc}x]j`f
电厂 power plant #wjBMR%
能量输送 power transfer M<p )@p
交流 AC Y+j KP*ri
装机容量 installed capacity kTk?[BK
电网 power system Np-D:G
落点 drop point Ksp;bfe
开关站 switch station iE Oyc59
双回同杆并架 double-circuit lines on the same tower *tO<wp&
变电站 transformer substation Y@4vQm+
补偿度 degree of compensation )ED[cYGx
高抗 high voltage shunt reactor hrL<jcv|
无功补偿 reactive power compensation V0AX1?H~ w
故障 fault m5p~>]}fYF
调节 regulation ;?o C=c
裕度 magin Td F<
三相故障 three phase fault 8
KkpXaz
故障切除时间 fault clearing time "QF083$
极限切除时间 critical clearing time }6bLukv
切机 generator triping I>5@s;
高顶值 high limited value ^"l$p,P+
强行励磁 reinforced excitation @iRVY|t/
线路补偿器 LDC(line drop compensation) |d 3agfS[n
机端 generator terminal `@eH4}L*
静态 static (state) l =yHx\
动态 dynamic (state) w?tKL0c
单机无穷大系统 one machine - infinity bus system 3-R3Qlr
机端电压控制 AVR hjG1fgEj
电抗 reactance EC~t'v
电阻 resistance l17ZNDzLU
功角 power angle ".)_kt[
有功(功率) active power 1 ~7_!
无功(功率) reactive power SHk[X ]Uo
功率因数 power factor f$>orVm%.
无功电流 reactive current EDo@J2A
下降特性 droop characteristics E%^28}dN
斜率 slope 0uz"}v)
额定 rating <n\.S
变比 ratio [KH?5C
参考值 reference value mvgm o
电压互感器 PT I5L7BTe
分接头 tap u,m-6@il
下降率 droop rate vs. uq
仿真分析 simulation analysis _o.Z`]
传递函数 transfer function ^PQV3\N
框图 block diagram %jxuH+L
受端 receive-side =b7&(x
裕度 margin BB.TrQM.#
同步 synchronization psC7IE<v
失去同步 loss of synchronization lAk1ncx
阻尼 damping AuTplO0_rE
摇摆 swing MI(i%$R-A
保护断路器 circuit breaker #'x?)AS
电阻:resistance kMl<
电抗:reactance S7a6ntei
阻抗:impedance W6O.E
电导:conductance 9@Sb! 9h
电纳:susceptance