1 backplane 背板 : fMQ,S0
2 Band gap voltage reference 带隙电压参考 ndg1E;>
3 benchtop supply 工作台电源 Z.'j7(tu
4 Block Diagram 方块图 5 Bode Plot 波特图 u_H=Xm)9
6 Bootstrap 自举 X
.,Lmh
7 Bottom FET Bottom FET &n$kVNE
8 bucket capcitor 桶形电容 E+z),"QA
9 chassis 机架 3E9 )~$
10 Combi-sense Combi-sense ?#s9@R1
11 constant current source 恒流源 [l44,!Z&
12 Core Sataration 铁芯饱和 }aO6%
13 crossover frequency 交叉频率 )R6h
1
14 current ripple 纹波电流 @};
vl
15 Cycle by Cycle 逐周期 mR,w~wP
16 cycle skipping 周期跳步 Lb]!TOl
17 Dead Time 死区时间 (A(j.[4a
18 DIE Temperature 核心温度 'Em3;`/C*+
19 Disable 非使能,无效,禁用,关断 Gh%R4)}
20 dominant pole 主极点 tJBj9{
21 Enable 使能,有效,启用 (aC~0
#4
22 ESD Rating ESD额定值 hY5GNYDh
23 Evaluation Board 评估板 K_!R
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. |j}D2q=
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 'p FK+j
25 Failling edge 下降沿 Bnp\G h
26 figure of merit 品质因数 e&@;hDmIX
27 float charge voltage 浮充电压 ^>Vl@cW0uz
28 flyback power stage 反驰式功率级 KvjsibI/Y
29 forward voltage drop 前向压降 Q~R% |Q{&
30 free-running 自由运行 (H^)wDb
31 Freewheel diode 续流二极管 Ec9%RAxl
32 Full load 满负载 33 gate drive 栅极驱动 YsO3( HS
34 gate drive stage 栅极驱动级 &=*sN`
35 gerber plot Gerber 图 Tw,|ZA4XH
36 ground plane 接地层 R
X N0v@V
37 Henry 电感单位:亨利 R]&lVXyH
38 Human Body Model 人体模式 dQn,0
39 Hysteresis 滞回 M3U?\g
40 inrush current 涌入电流 CKnPMvmz
41 Inverting 反相 `@xnpA]l
42 jittery 抖动 *(s0X[-
43 Junction 结点 w~C\5 i
44 Kelvin connection 开尔文连接 <a&w$Zc/
45 Lead Frame 引脚框架 %I=/
y
46 Lead Free 无铅 j[,XJ,5=
47 level-shift 电平移动 ;m=k
FZ?
48 Line regulation 电源调整率 +B[XTn,Cru
49 load regulation 负载调整率 xS4?M<|L63
50 Lot Number 批号 i#NtiZ.t=
51 Low Dropout 低压差 4/V;g%0uN;
52 Miller 密勒 53 node 节点 J%]5C}v \
54 Non-Inverting 非反相 ef7 BG(
55 novel 新颖的
wh#IQ.E-
56 off state 关断状态 Y <`X$
57 Operating supply voltage 电源工作电压 P2&0bNY
58 out drive stage 输出驱动级 4B9D
59 Out of Phase 异相 bk0<i*ju7(
60 Part Number 产品型号 K8/jfm
61 pass transistor pass transistor s",G
w]8
62 P-channel MOSFET P沟道MOSFET R, #szTu
63 Phase margin 相位裕度 <isU D6TC
64 Phase Node 开关节点 DR
@yd,
65 portable electronics 便携式电子设备 'pyIMB?x
66 power down 掉电 f,kV
67 Power Good 电源正常 D^xg2D
68 Power Groud 功率地 ^I9U<iNIL
69 Power Save Mode 节电模式 uJ=d!Kn
70 Power up 上电 DxD\o+:r
71 pull down 下拉 .AQTUd(_
72 pull up 上拉 GPizR|}h
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) z}iz~WZ
74 push pull converter 推挽转换器 ([|^3tM
75 ramp down 斜降 O3?^P"C
76 ramp up 斜升 nVr V6w
77 redundant diode 冗余二极管 elR1NhB|p
78 resistive divider 电阻分压器 qJJ
5o?'
79 ringing 振 铃 |z8_]o+|r1
80 ripple current 纹波电流 VU6+"2+'2
81 rising edge 上升沿 g6xQQ,q=l
82 sense resistor 检测电阻 -GCU6U|
83 Sequenced Power Supplys 序列电源 C8i4z
84 shoot-through 直通,同时导通 nET<u;
85 stray inductances. 杂散电感 `9k\~D=D~
86 sub-circuit 子电路 xOr"3;^
87 substrate 基板 G^z>2P
88 Telecom 电信 Pf;RJeD
89 Thermal Information 热性能信息 0C3Y =F
90 thermal slug 散热片 OlptO60{ ]
91 Threshold 阈值 1vAJ(O{-
92 timing resistor 振荡电阻 3g56[;Up?
93 Top FET Top FET I~E&::,
94 Trace 线路,走线,引线 !s !el;G
95 Transfer function 传递函数 tkff\W[JU
96 Trip Point 跳变点 /!.]Y8yEH
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) :T>OJ"p
98 Under Voltage Lock Out (UVLO) 欠压锁定 eYn/F~5-
99 Voltage Reference 电压参考 pcQkJF
100 voltage-second product 伏秒积 ,1.Td=lY$
101 zero-pole frequency compensation 零极点频率补偿 56u_viZ=8
102 beat frequency 拍频 [jxh$}?P
103 one shots 单击电路 }7K~-
104 scaling 缩放 ZN&9qw*
105 ESR 等效串联电阻 [Page] C1qlB8(Wh>
106 Ground 地电位 kY9$ M8b
107 trimmed bandgap 平衡带隙
YN7OQqa
108 dropout voltage 压差 H(O|y2
109 large bulk capacitance 大容量电容 b/\l\\$-
110 circuit breaker 断路器 Q4Qf/q;U
111 charge pump 电荷泵 .$Yp~
112 overshoot 过冲 [r9HYju=
-6X+:r`>u
印制电路printed circuit 7j(gW
印制线路 printed wiring L$"pk{'
印制板 printed board ?%D nIl>
印制板电路 printed circuit board 8o).q}>&
印制线路板 printed wiring board 4af^SZ)l
印制元件 printed component 7h:EU7
印制接点 printed contact wSdiF-ue
印制板装配 printed board assembly Adfnd
板 board ;E!] /oY<
刚性印制板 rigid printed board uu>R)iTQ%S
挠性印制电路 flexible printed circuit >66
`hZ
挠性印制线路 flexible printed wiring ^ ]+vtk
齐平印制板 flush printed board g&8-X?^Q
金属芯印制板 metal core printed board M!%|IKw
金属基印制板 metal base printed board vTWm_ed+^
多重布线印制板 mulit-wiring printed board Mp[2A uf
塑电路板 molded circuit board gkca{BJ
散线印制板 discrete wiring board pTncx%!W5
微线印制板 micro wire board ?N@[R];
积层印制板 buile-up printed board w02C1oGfx
表面层合电路板 surface laminar circuit L!`PM.:9
埋入凸块连印制板 B2it printed board &^Gp
载芯片板 chip on board Q|U
[|U
埋电阻板 buried resistance board Blj<|\igc
母板 mother board 7?);wh 7`
子板 daughter board CT'#~~QB
背板 backplane Pa$"c?QUy
裸板 bare board JBLh4c3
键盘板夹心板 copper-invar-copper board .SNg2.
动态挠性板 dynamic flex board Ue"pNjd|
静态挠性板 static flex board )HX(-"c
可断拼板 break-away planel ,3!4
D^
电缆 cable +/" \.wYv
挠性扁平电缆 flexible flat cable (FFC) NYzBfL
x
薄膜开关 membrane switch u*rHKZ9i
混合电路 hybrid circuit P.mlk>r
厚膜 thick film s%RG_"l
厚膜电路 thick film circuit o%0To{MAF-
薄膜 thin film 2(Aw
薄膜混合电路 thin film hybrid circuit
b #Llu$
互连 interconnection z*9 ke
导线 conductor trace line KleiX7
齐平导线 flush conductor O{Z${TC[
传输线 transmission line v2="j
跨交 crossover ~=|QPO(d
板边插头 edge-board contact qVjMflVoay
增强板 stiffener w"?RbA
基底 substrate Z#YNL-x
基板面 real estate G&"O)$h
导线面 conductor side b`F]oQ_*
元件面 component side >`0mn|+
焊接面 solder side T)',}=
导电图形 conductive pattern e*U6^Xex
非导电图形 non-conductive pattern 9PMIF9"
基材 base material 8 VhU)fY
层压板 laminate \N$)Q.M
覆金属箔基材 metal-clad bade material NB+/S ;`
覆铜箔层压板 copper-clad laminate (CCL) !e*T.
1Kz
复合层压板 composite laminate VKf&}u/
薄层压板 thin laminate ml /S|`Drk
基体材料 basis material a,r
B7aD
预浸材料 prepreg \Pcn D$L
粘结片 bonding sheet U3Z-1G~*r
预浸粘结片 preimpregnated bonding sheer 1 vtC4`
环氧玻璃基板 epoxy glass substrate f8`dJ5i
预制内层覆箔板 mass lamination panel XUD Ztxa
内层芯板 core material OHrzN']
粘结层 bonding layer yc`*zLWh
粘结膜 film adhesive KSHq0A6/q%
无支撑胶粘剂膜 unsupported adhesive film )ax>*
覆盖层 cover layer (cover lay) JbQY{z!
增强板材 stiffener material 1:>F{g
铜箔面 copper-clad surface "?<h,Hvi
去铜箔面 foil removal surface E+#<WK-
层压板面 unclad laminate surface $2RSYI`py
基膜面 base film surface _x|.\j
胶粘剂面 adhesive faec >k/cm3
原始光洁面 plate finish )^+hm+27v
粗面 matt finish e =r
b
剪切板 cut to size panel " 0m4&K(3,
超薄型层压板 ultra thin laminate z?( b|v
A阶树脂 A-stage resin t,IOq[Vtk
B阶树脂 B-stage resin ]5Dh<QY&.
C阶树脂 C-stage resin Iy&,1CI"]
环氧树脂 epoxy resin i^V(LGQF
酚醛树脂 phenolic resin #sDb611}#
聚酯树脂 polyester resin py+\e"s
聚酰亚胺树脂 polyimide resin :7mHPe}(
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin w( _42)v]g
丙烯酸树脂 acrylic resin Jazg n5
三聚氰胺甲醛树脂 melamine formaldehyde resin l;L_A@B<
多官能环氧树脂 polyfunctional epoxy resin :9Jy/7/
溴化环氧树脂 brominated epoxy resin {]Hv*{ ]
环氧酚醛 epoxy novolac qb/}&J7+
氟树脂 fluroresin H-U_
硅树脂 silicone resin eZN"t~\rX
硅烷 silane 7GWOJ^)
聚合物 polymer 7(N+'8
无定形聚合物 amorphous polymer 5j6`W?|q
结晶现象 crystalline polamer >%0$AW|Exu
双晶现象 dimorphism I[d<SHo
共聚物 copolymer Z6A-i@
合成树脂 synthetic
r[H8;&EL
热固性树脂 thermosetting resin [Page] ovBmo2W/
热塑性树脂 thermoplastic resin GNe^~
感光性树脂 photosensitive resin 2\QsF,@`YU
环氧值 epoxy value 8W?dWj
双氰胺 dicyandiamide l
$"hhI8
粘结剂 binder IA({RE
胶粘剂 adesive lM{f ld
固化剂 curing agent
2wHbhW[
阻燃剂 flame retardant ;}"Eqq:
遮光剂 opaquer {svo!pN:
增塑剂 plasticizers Jk6}hUH,
不饱和聚酯 unsatuiated polyester %S}uCqcAK
聚酯薄膜 polyester >( [,yMIY
聚酰亚胺薄膜 polyimide film (PI) qS FtQ4
聚四氟乙烯 polytetrafluoetylene (PTFE) 2R.LLE
增强材料 reinforcing material ~"CGur P
折痕 crease -4&
i t:
云织 waviness =4a:)g'
鱼眼 fish eye \'4~@
毛圈长 feather length ,1$F#Eh
厚薄段 mark ]MosiMJF
裂缝 split ;ryNfP%
捻度 twist of yarn tmooS7\a
浸润剂含量 size content |f#hGk6
浸润剂残留量 size residue }|Mwv
$`
处理剂含量 finish level EZ]4cd/i
偶联剂 couplint agent N+rU|iMa.
断裂长 breaking length ?YLq
iAA
吸水高度 height of capillary rise 0f.jW O
湿强度保留率 wet strength retention zqo0P~
白度 whitenness bj`\;_oo
导电箔 conductive foil ]HuB%G|t1V
铜箔 copper foil |JxVfX8^
压延铜箔 rolled copper foil *WQ?r&[_'
光面 shiny side )Y7H@e\1
粗糙面 matte side gHrs|6q9
处理面 treated side ?K>)bA&l'
防锈处理 stain proofing Yi*F;V
双面处理铜箔 double treated foil d+D~NA[M
模拟 simulation
?<EzILM
逻辑模拟 logic simulation z'EQdQ)
电路模拟 circit simulation `
kT\V'
时序模拟 timing simulation vW1^
模块化 modularization qk2E>
设计原点 design origin L0fe
优化(设计) optimization (design) -G~]e6:zD
供设计优化坐标轴 predominant axis u}[ a
表格原点 table origin |Vx[
元件安置 component positioning .N X9Ab
比例因子 scaling factor ws'e
扫描填充 scan filling {dpC;jsW1
矩形填充 rectangle filling 'Qy6m'esW
填充域 region filling MJXnAIG?2
实体设计 physical design !9;m~T7.
逻辑设计 logic design >1j#XA8
逻辑电路 logic circuit 7g\v (P
层次设计 hierarchical design {N4 'g_
自顶向下设计 top-down design "cKD#
自底向上设计 bottom-up design gk%nF
费用矩阵 cost metrix ,*|Q=
元件密度 component density ,a #>e
自由度 degrees freedom ~
WWhCRq
出度 out going degree w2
Y%yjCV
入度 incoming degree U@OdQAX
曼哈顿距离 manhatton distance ^Ps!
欧几里德距离 euclidean distance W=+n|1
网络 network YSP\+ZZ
阵列 array D$}hoM1
段 segment Fv^zSoi2
逻辑 logic 1>Sfv|ZP,
逻辑设计自动化 logic design automation pP| @Z{7d`
分线 separated time syl7i>P
分层 separated layer h4`8C]
定顺序 definite sequence I$;`^z
导线(通道) conduction (track) wn[)/*(,$(
导线(体)宽度 conductor width XDPR$u8hM
导线距离 conductor spacing ; J W]b]
导线层 conductor layer H$I~Vz[\yb
导线宽度/间距 conductor line/space VIAq$iu7
第一导线层 conductor layer No.1 apL$`{>US
圆形盘 round pad |4@cX<d.
方形盘 square pad v`|]57?A
菱形盘 diamond pad m9[ 7"I
长方形焊盘 oblong pad m*y&z'e\
子弹形盘 bullet pad 9y!0WZE{e
泪滴盘 teardrop pad PysDDU}v
雪人盘 snowman pad M(C">L]8
形盘 V-shaped pad V |ke0G
环形盘 annular pad { "]!zL
非圆形盘 non-circular pad lj<Sa
隔离盘 isolation pad chICc</l&
非功能连接盘 monfunctional pad ?}Zo~]7E
偏置连接盘 offset land Jr5S8c|"
腹(背)裸盘 back-bard land %,[,mW4l
盘址 anchoring spaur ^Laqq%PI
连接盘图形 land pattern F~Dof({:
连接盘网格阵列 land grid array b+~_/;Y9
孔环 annular ring Oi\ s
元件孔 component hole W` x.qumN
安装孔 mounting hole dfFw6R
支撑孔 supported hole cX9o'e:C
非支撑孔 unsupported hole [63\2{_^v
导通孔 via LuySa2,
镀通孔 plated through hole (PTH) ;a?<7LIx
余隙孔 access hole V0^{Ss1M
盲孔 blind via (hole) aL:|Dr3SX
埋孔 buried via hole i
bzY&f
埋,盲孔 buried blind via 4$iS@o|
任意层内部导通孔 any layer inner via hole P^OmJ;""D
全部钻孔 all drilled hole 3VLwY!2:
定位孔 toaling hole MFROAVPZ5
无连接盘孔 landless hole _#V&rY&@
中间孔 interstitial hole vb^fx$V
无连接盘导通孔 landless via hole Dn)yBA%
引导孔 pilot hole +q
pW"0[
端接全隙孔 terminal clearomee hole 0J+WCm`
准尺寸孔 dimensioned hole [Page] &pY'
在连接盘中导通孔 via-in-pad &.E/%pQ`
孔位 hole location W(]A^C=/
孔密度 hole density :6o%x0l
孔图 hole pattern 6?u`u t
钻孔图 drill drawing Fj`k3~tUw
装配图assembly drawing sgOau\E
参考基准 datum referan -F?97&G$
1) 元件设备 R[zN?
]r#b:W\
三绕组变压器:three-column transformer ThrClnTrans (eF[nfM
双绕组变压器:double-column transformer DblClmnTrans xS UpVK
电容器:Capacitor <n,QSy#
并联电容器:shunt capacitor w<H2#d>5!@
电抗器:Reactor `^Ll@Cx"
母线:Busbar 07Yak<+~
输电线:TransmissionLine ^.:&ZsqV
发电厂:power plant kBqgz|jE%
断路器:Breaker L*4"D4V
刀闸(隔离开关):Isolator Qw5-/p=t
分接头:tap ]*P9=!x|M
电动机:motor 1Du5Z9AM
(2) 状态参数 0\U*
adu6`2*$
有功:active power DTH}=r-
无功:reactive power -ysNo4#e&
电流:current L{VnsY V
容量:capacity 2H w7V3q
电压:voltage q]yw",muT
档位:tap position )C"ixZ>2xQ
有功损耗:reactive loss md<^x(h"<
无功损耗:active loss #w%-IhP
功率因数:power-factor ^[.}DNR95(
功率:power ;6 W[%{
功角:power-angle Rd7U5MBEF
电压等级:voltage grade 0?oL zw&
空载损耗:no-load loss pYzop4
铁损:iron loss d+G%\qpzQ
铜损:copper loss ZHjL8Iq
空载电流:no-load current ?o.d FKUe
阻抗:impedance ]B;`Jf
正序阻抗:positive sequence impedance )V~=B]
负序阻抗:negative sequence impedance yYGs]+
零序阻抗:zero sequence impedance Z8Ig,
电阻:resistor UFT JobU
电抗:reactance xi{r-D8Z
电导:conductance z H-a%$5
电纳:susceptance Nc(CGl:
无功负载:reactive load 或者QLoad 6\I^]\YO
有功负载: active load PLoad czIAx1R9
遥测:YC(telemetering) Z@dVK`nD
遥信:YX b4dviYI
励磁电流(转子电流):magnetizing current U!-Nx9
定子:stator l3p :}A
功角:power-angle I ?Dp*u*
上限:upper limit 2<B'PR-??y
下限:lower limit (eU 4{X7
并列的:apposable MZ$uWm`/
高压: high voltage 1UJ rPM%
低压:low voltage uU3A,-{-
中压:middle voltage =MQ/z#:-P
电力系统 power system qJ`:$U
发电机 generator xrvM}Il
励磁 excitation \AroSy9
励磁器 excitor }r@dZBp:
电压 voltage 1}a4AGAp
电流 current AcuF0KWw/
母线 bus e1-tpD:J
变压器 transformer _xv3UzD
升压变压器 step-up transformer !\4B.
高压侧 high side dWQsC|
输电系统 power transmission system ?MRY*[$
输电线 transmission line ;9OhK71}
固定串联电容补偿fixed series capacitor compensation Oh$:qu7o0&
稳定 stability e9[72V
电压稳定 voltage stability Z,#H\1v3lB
功角稳定 angle stability 0uDDaFS
暂态稳定 transient stability #_35bg4h{
电厂 power plant 'M >m$cCMZ
能量输送 power transfer '3672wF/
交流 AC QnVr)4"
装机容量 installed capacity x>[]Qk^?q
电网 power system }aRib{L
落点 drop point +>q#eUS)
开关站 switch station {o24A:M
双回同杆并架 double-circuit lines on the same tower DRQx5fgL
变电站 transformer substation sWYnoRxu
补偿度 degree of compensation *vaYI3{qN
高抗 high voltage shunt reactor : ZrJL&
无功补偿 reactive power compensation }9S}?R
故障 fault +%W8Juu
调节 regulation |HK:\)L%
裕度 magin C[^V\?3ly:
三相故障 three phase fault
*V6|
FU
故障切除时间 fault clearing time Xi&J%N'
极限切除时间 critical clearing time gN=.}$Kfu
切机 generator triping X.t4;
高顶值 high limited value lME>U_E
强行励磁 reinforced excitation D`LBv,n
线路补偿器 LDC(line drop compensation) k]@]a
机端 generator terminal A0DGDr PD
静态 static (state) TQ4@|S:OF
动态 dynamic (state) I/f\m}}ba
单机无穷大系统 one machine - infinity bus system J$3g3%t
机端电压控制 AVR @RoZd?
电抗 reactance ntW@Fm:bw>
电阻 resistance t7+A!7b{
功角 power angle C%XO|sP
有功(功率) active power 75^6?#GS
无功(功率) reactive power iQ)ydY a
功率因数 power factor ^dQ{vL@9b9
无功电流 reactive current w_(3{P[Iz
下降特性 droop characteristics @5%&wC
斜率 slope {a7~P0$
额定 rating Ww7Ya]b.k
变比 ratio " 9Gn/-V>
参考值 reference value ^xZh@e5
电压互感器 PT P$)g=/td1
分接头 tap [?!I*=*b
下降率 droop rate CXlbtpK2k
仿真分析 simulation analysis X]0>0=^
传递函数 transfer function F-yY(b]$
框图 block diagram 6%v9o?:~l
受端 receive-side 4<efj
裕度 margin #z `W ,^C
同步 synchronization t'qYM5
失去同步 loss of synchronization :D.0\.p
阻尼 damping P?54"$b
摇摆 swing '%Ng lC[J
保护断路器 circuit breaker 8t-GsjHb
电阻:resistance f-b],YE
电抗:reactance !gsvF\XDM
阻抗:impedance xUo6~9s7
电导:conductance OrY[
电纳:susceptance