1 backplane 背板 B.&q]CAv-
2 Band gap voltage reference 带隙电压参考 J0|/g2%0
3 benchtop supply 工作台电源 K6|*-Wo.
4 Block Diagram 方块图 5 Bode Plot 波特图 9LCV"xgX
6 Bootstrap 自举 5F
<zW-;
7 Bottom FET Bottom FET 7b'XQ/rs
8 bucket capcitor 桶形电容 v?d~H`L
9 chassis 机架 (A( d]l
10 Combi-sense Combi-sense Oo=}j
11 constant current source 恒流源 /=Q7RJ@P
12 Core Sataration 铁芯饱和 wU+ofj;
+I
13 crossover frequency 交叉频率 trgj]|?M
14 current ripple 纹波电流 {f3T !e{
15 Cycle by Cycle 逐周期 \[Rh\v&
16 cycle skipping 周期跳步 EJZl'CR
17 Dead Time 死区时间 dwAju:-H
18 DIE Temperature 核心温度 S ._9
19 Disable 非使能,无效,禁用,关断 Ij{{Z;o3
20 dominant pole 主极点 0v',+-
21 Enable 使能,有效,启用 tlvLbP*r
22 ESD Rating ESD额定值 2ht<"
23 Evaluation Board 评估板 5=Gq
d4&*
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Q[8L='E
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 Ibpk\a?A{
25 Failling edge 下降沿 H#wn3O
26 figure of merit 品质因数 .c~;/@{
27 float charge voltage 浮充电压 BnAia3z
28 flyback power stage 反驰式功率级
]km8M^P
29 forward voltage drop 前向压降 ot-!_w<
30 free-running 自由运行 3go!P])
31 Freewheel diode 续流二极管 zy5@K)
32 Full load 满负载 33 gate drive 栅极驱动 g-')|0py
34 gate drive stage 栅极驱动级 l+YpRx/T\
35 gerber plot Gerber 图 `iQyKZS/+
36 ground plane 接地层 d!w32Y,.
37 Henry 电感单位:亨利 JJ7-$h'0q
38 Human Body Model 人体模式 k)y0V:ZY]O
39 Hysteresis 滞回 9[$g;}w
40 inrush current 涌入电流 }$m_):t@@
41 Inverting 反相 "L{;=-e
42 jittery 抖动 Jq?ai8
43 Junction 结点 =X-$kk
44 Kelvin connection 开尔文连接 C{Aeud #5
45 Lead Frame 引脚框架 1Pn!{ bU3@
46 Lead Free 无铅 jC;XY !d6
47 level-shift 电平移动 > -k$:[l
48 Line regulation 电源调整率 Ct
#hl8b:
49 load regulation 负载调整率 G7zfyw}W
50 Lot Number 批号 "FG6R'
51 Low Dropout 低压差 hQHV]xW
52 Miller 密勒 53 node 节点 <}i\fJX6
54 Non-Inverting 非反相 "$
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55 novel 新颖的 ap_(/W
56 off state 关断状态 c;(}Ih(#
57 Operating supply voltage 电源工作电压 8kO|t!?:U
58 out drive stage 输出驱动级 $,'r}
%
59 Out of Phase 异相 c5O1h8
60 Part Number 产品型号 PT>,:zY
61 pass transistor pass transistor _0Wdm*
62 P-channel MOSFET P沟道MOSFET xa!@$w=U&
63 Phase margin 相位裕度 6,cyi|s
64 Phase Node 开关节点 S}fIZ1
65 portable electronics 便携式电子设备 <0&];5
on
66 power down 掉电 l^"gpO${K
67 Power Good 电源正常 !cWKY\lpv
68 Power Groud 功率地 _3kAN.g
69 Power Save Mode 节电模式 I /> .P
70 Power up 上电 ))306*X\
71 pull down 下拉 |%b' L.$4
72 pull up 上拉 p/SJt0
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) !aIIjWz]
74 push pull converter 推挽转换器 #?8'Z/1)
75 ramp down 斜降 Pm"
,7
76 ramp up 斜升 5n?fZ?6(
77 redundant diode 冗余二极管 Lo9+#ITyx
78 resistive divider 电阻分压器 5TzMv3;in2
79 ringing 振 铃 =]etw
80 ripple current 纹波电流 =Z%&jul
81 rising edge 上升沿 5k<HO _]
82 sense resistor 检测电阻 Y }e$5
83 Sequenced Power Supplys 序列电源 Uv5E$Y"e10
84 shoot-through 直通,同时导通 0 ,Bd,<3
85 stray inductances. 杂散电感 qItj`F)d
86 sub-circuit 子电路 8G(wYlxi
87 substrate 基板 `[CXxp
88 Telecom 电信 OG}0{?
89 Thermal Information 热性能信息 ~TurYvf
90 thermal slug 散热片 !k%Vw18
91 Threshold 阈值 %
sT=>\
92 timing resistor 振荡电阻 cl14FrpYu
93 Top FET Top FET e$Md?Pq
94 Trace 线路,走线,引线 !K6: W1
95 Transfer function 传递函数 &eg]8kV
96 Trip Point 跳变点 )mp0k%
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) |p3]9H
98 Under Voltage Lock Out (UVLO) 欠压锁定 *|hICTWL
99 Voltage Reference 电压参考 MqXA8D
100 voltage-second product 伏秒积 .>h|e_E
101 zero-pole frequency compensation 零极点频率补偿 CDR^xo5
dP
102 beat frequency 拍频 DF9Br
D0{
103 one shots 单击电路 !"p,9
104 scaling 缩放 /m9t2,KB
105 ESR 等效串联电阻 [Page] D:%$a]_f
106 Ground 地电位 H6e^"E
107 trimmed bandgap 平衡带隙 85Ms*[g
108 dropout voltage 压差 >TK`s@jdSV
109 large bulk capacitance 大容量电容 Fda<cS]
110 circuit breaker 断路器 RI-whA8+
111 charge pump 电荷泵 2t#9ih"9
112 overshoot 过冲 scN}eg:5
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印制电路printed circuit 24|:VxO
印制线路 printed wiring ];j8vts&
印制板 printed board x{RTI#a.
印制板电路 printed circuit board +.[#C5
印制线路板 printed wiring board Y5Ey%Mm6
印制元件 printed component 5%,n[qj4IT
印制接点 printed contact y\)bxmC
印制板装配 printed board assembly AGOK%[[Ws
板 board %Sxy!gGz%%
刚性印制板 rigid printed board j+Wgjf
挠性印制电路 flexible printed circuit aLhTaB-va
挠性印制线路 flexible printed wiring vT3LhN+1
齐平印制板 flush printed board ~5]AXi'e~
金属芯印制板 metal core printed board b@5&<V;r2
金属基印制板 metal base printed board uodO^5"-
多重布线印制板 mulit-wiring printed board xI_WkoI
塑电路板 molded circuit board zB 7wGl9
散线印制板 discrete wiring board E2%7 v
微线印制板 micro wire board $3"0w
积层印制板 buile-up printed board qF( ]Ce
表面层合电路板 surface laminar circuit h7(twct
埋入凸块连印制板 B2it printed board 7|65;jm+
载芯片板 chip on board EYG&~a>L*
埋电阻板 buried resistance board ed*=p
l3.
母板 mother board Re,0RM\
子板 daughter board h_y<A@[P}
背板 backplane x{Gih1
裸板 bare board QR79^A@5
键盘板夹心板 copper-invar-copper board ZOS{F_2.
动态挠性板 dynamic flex board Tz%l9aC
静态挠性板 static flex board Zad+)~@!tq
可断拼板 break-away planel #v~zf@<KLB
电缆 cable 8> O'_6Joj
挠性扁平电缆 flexible flat cable (FFC) QZQ@C# PR;
薄膜开关 membrane switch PS \QbA
混合电路 hybrid circuit @RT yCr
厚膜 thick film Fd|:7NRA<
厚膜电路 thick film circuit "fz-h
薄膜 thin film tk_y~-xz
薄膜混合电路 thin film hybrid circuit <2|x]b8
互连 interconnection =U|J{^ >I
导线 conductor trace line }qbz &%R
齐平导线 flush conductor 7_q"%xH
传输线 transmission line R Af+%h*
跨交 crossover gxt2Mq;q~}
板边插头 edge-board contact @/|sOF;8W
增强板 stiffener 15 nc
基底 substrate 7e}p:Vfp
基板面 real estate ?e&CbVc4
导线面 conductor side oJXZ}>>iT
元件面 component side L~vNW6#W
焊接面 solder side ,{zvGZ|
导电图形 conductive pattern Z AZQFr'*
非导电图形 non-conductive pattern Nnv&~D>
基材 base material :(I)+;M}P
层压板 laminate _k6N(c2Nd
覆金属箔基材 metal-clad bade material /Rt/Efu
覆铜箔层压板 copper-clad laminate (CCL) -pkeEuwv{
复合层压板 composite laminate zhYE#hv2
薄层压板 thin laminate
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基体材料 basis material j|+B|
预浸材料 prepreg }3)$aI_
粘结片 bonding sheet >@]E1Qfe
预浸粘结片 preimpregnated bonding sheer :5@7z9 >
环氧玻璃基板 epoxy glass substrate S :(1=@
预制内层覆箔板 mass lamination panel 1d-j_H`s
内层芯板 core material
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粘结层 bonding layer Qy4AuMU2
粘结膜 film adhesive |vEfE{
无支撑胶粘剂膜 unsupported adhesive film n7{1m$/
覆盖层 cover layer (cover lay) QKHm OVh]
增强板材 stiffener material Y]P
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铜箔面 copper-clad surface 17};I7
去铜箔面 foil removal surface A3 j>R477A
层压板面 unclad laminate surface UDp"+nS
基膜面 base film surface >E)UmO{S
胶粘剂面 adhesive faec Blaj07K
原始光洁面 plate finish B_}=v$
粗面 matt finish YK"({Z>U
剪切板 cut to size panel W>1\f0'
超薄型层压板 ultra thin laminate |mci-ZT
A阶树脂 A-stage resin hoU&'P8
B阶树脂 B-stage resin Snh\Fgdz
C阶树脂 C-stage resin Of:e6N
环氧树脂 epoxy resin oZOFZ-<
酚醛树脂 phenolic resin +cjNA2@
聚酯树脂 polyester resin CR,
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聚酰亚胺树脂 polyimide resin :%!SzI?
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin _Zb_9&
丙烯酸树脂 acrylic resin &dOV0y_
三聚氰胺甲醛树脂 melamine formaldehyde resin X}p4yR7'
多官能环氧树脂 polyfunctional epoxy resin @?gH3Y_
溴化环氧树脂 brominated epoxy resin XtQ3$0{*%
环氧酚醛 epoxy novolac e@F&/c
氟树脂 fluroresin y/kCzDT,
硅树脂 silicone resin Zc%S`zK`7
硅烷 silane * z{D}L-&
聚合物 polymer gb@!Co3
无定形聚合物 amorphous polymer !4*@H
结晶现象 crystalline polamer S!.xmc\
双晶现象 dimorphism bF B;N+>
共聚物 copolymer 1f}S:Z
合成树脂 synthetic ,QKG$F
热固性树脂 thermosetting resin [Page] +S3'ms
热塑性树脂 thermoplastic resin *wh'4i}u
感光性树脂 photosensitive resin nq6]?ZJ
环氧值 epoxy value "rAm6b-`
双氰胺 dicyandiamide MTLcLmdO
粘结剂 binder :ye)%UU"|:
胶粘剂 adesive J^t=.-a|
固化剂 curing agent @br%:Nt
阻燃剂 flame retardant *w@>zkBl
遮光剂 opaquer G&