1 backplane 背板 suzK)rJ9i
2 Band gap voltage reference 带隙电压参考 rFGPS%STS
3 benchtop supply 工作台电源 41]a{A7q
4 Block Diagram 方块图 5 Bode Plot 波特图 <S=(`D
6 Bootstrap 自举 3"zPG~fY{
7 Bottom FET Bottom FET o5j6(`#;
8 bucket capcitor 桶形电容 ",&QO7_
9 chassis 机架 zrqI^i"c
10 Combi-sense Combi-sense $ OG){'X
11 constant current source 恒流源 4/%fpU2
12 Core Sataration 铁芯饱和 qTK(sW
13 crossover frequency 交叉频率 }S8aR:'
14 current ripple 纹波电流 \gA<yz-;N
15 Cycle by Cycle 逐周期 X4]miUmh
16 cycle skipping 周期跳步 "-djA, `
17 Dead Time 死区时间 UOFb.FRP>
18 DIE Temperature 核心温度 4pl\qf
19 Disable 非使能,无效,禁用,关断 Y6&v&dA;
20 dominant pole 主极点 2Mk;r*FT
21 Enable 使能,有效,启用 "AZ|u#0P
22 ESD Rating ESD额定值 .8Bu%Sf
23 Evaluation Board 评估板 G^tazAEfo
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. P
JATRJ1.
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 xxyc^\$
25 Failling edge 下降沿 Wlxmp['Bh
26 figure of merit 品质因数 g<(!>:h
27 float charge voltage 浮充电压 wgIm{;T[u
28 flyback power stage 反驰式功率级 {f\wIZ-K A
29 forward voltage drop 前向压降 #2s}s<Sc;
30 free-running 自由运行 ;-8.~Sm
31 Freewheel diode 续流二极管 JH{/0x#+
32 Full load 满负载 33 gate drive 栅极驱动 =3c?W&:
34 gate drive stage 栅极驱动级 (D%vN&F
35 gerber plot Gerber 图 *~g*J^R}
36 ground plane 接地层 hcj]T?
37 Henry 电感单位:亨利 J}&U[ds p
38 Human Body Model 人体模式 0uIY6e0E
39 Hysteresis 滞回 )2RRa^=&
40 inrush current 涌入电流 vRH^en
41 Inverting 反相 r&m49N,d
42 jittery 抖动 rbnAC*y8'L
43 Junction 结点
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44 Kelvin connection 开尔文连接 t$(#$Z,RS
45 Lead Frame 引脚框架 j&,Gv@
46 Lead Free 无铅 _,!0_\+i
47 level-shift 电平移动 {PX,_
48 Line regulation 电源调整率 <zR{'7L/
49 load regulation 负载调整率 VS/M@y_./
50 Lot Number 批号 &n;*'M
51 Low Dropout 低压差 bw zx_F/
52 Miller 密勒 53 node 节点 <wk
54 Non-Inverting 非反相 /M%>M]
55 novel 新颖的 wv\K
56 off state 关断状态 =X?fA,
57 Operating supply voltage 电源工作电压 iq*im$9J
58 out drive stage 输出驱动级 |J,zU6t
59 Out of Phase 异相 . 2$J-<O
60 Part Number 产品型号 /^AH/,p
61 pass transistor pass transistor k7Bh[ ..!
62 P-channel MOSFET P沟道MOSFET %h@1lsm1+
63 Phase margin 相位裕度 :c~SH/qS
64 Phase Node 开关节点 La )M
65 portable electronics 便携式电子设备 Rpg g
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66 power down 掉电 U@NCN2I
67 Power Good 电源正常 q4[8\Ua
68 Power Groud 功率地 @KK6Jy OTQ
69 Power Save Mode 节电模式 3T8d?%.l
70 Power up 上电
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71 pull down 下拉 T4]2R
72 pull up 上拉 O3@DU#N&s
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) "G
[Nb:,CR
74 push pull converter 推挽转换器 ):'wxIVGI
75 ramp down 斜降 4`Ud\Jm[s
76 ramp up 斜升 llP
V{
77 redundant diode 冗余二极管 c'i5,\ #X
78 resistive divider 电阻分压器 g %mCgP
79 ringing 振 铃 |-x-CSN
80 ripple current 纹波电流 i8V\ x> 9
81 rising edge 上升沿 a2B71 RT~
82 sense resistor 检测电阻 E%bhd4$G
83 Sequenced Power Supplys 序列电源 ksC_F8Q+
84 shoot-through 直通,同时导通 3<&:av3
85 stray inductances. 杂散电感 >8_y-74
86 sub-circuit 子电路 UON=7}=$&
87 substrate 基板 9>&zOITTaL
88 Telecom 电信 QMBT8x/+_'
89 Thermal Information 热性能信息 Mwnr4$]
90 thermal slug 散热片 OM[MRZEh G
91 Threshold 阈值 ZU`9]7"87B
92 timing resistor 振荡电阻 Zu.hcDw1
93 Top FET Top FET -5b|nQuY
94 Trace 线路,走线,引线 ri{*\LV*@
95 Transfer function 传递函数 W_2;j)i
96 Trip Point 跳变点 9VxM1-8Gs
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) h.X4x2(.
98 Under Voltage Lock Out (UVLO) 欠压锁定 :EV.nD7
99 Voltage Reference 电压参考 9m
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100 voltage-second product 伏秒积
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101 zero-pole frequency compensation 零极点频率补偿 t,7%|
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102 beat frequency 拍频 5`.CzQVb
103 one shots 单击电路 ie6c/5
104 scaling 缩放 Xj\ToO
105 ESR 等效串联电阻 [Page] @wcF#?J
106 Ground 地电位 b]]8Vs)'
107 trimmed bandgap 平衡带隙 W<)P@_+-
108 dropout voltage 压差 0(7 IsG=t
109 large bulk capacitance 大容量电容 '(5GRI<
110 circuit breaker 断路器 49; 'K
111 charge pump 电荷泵 op}!1y$9P
112 overshoot 过冲 :/T\E\Qr
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印制电路printed circuit XYo,5-
印制线路 printed wiring rRq60A
印制板 printed board Bu(51wU8
印制板电路 printed circuit board !1)aie+p6
印制线路板 printed wiring board Q~(Gll;
印制元件 printed component g0grfGo2p
印制接点 printed contact bp?5GU&Uy
印制板装配 printed board assembly UTkPA2x
板 board XZIapT
刚性印制板 rigid printed board a!$kKOK
挠性印制电路 flexible printed circuit Y*c]C;%=
挠性印制线路 flexible printed wiring :oIBJ u%/
齐平印制板 flush printed board !rUP&DA
金属芯印制板 metal core printed board jA{5)-g
金属基印制板 metal base printed board jo:Z
多重布线印制板 mulit-wiring printed board efQ8jO
塑电路板 molded circuit board 5%Qxx\q
散线印制板 discrete wiring board 8zx]/>
微线印制板 micro wire board cT'Bp)a
积层印制板 buile-up printed board (GmBv
表面层合电路板 surface laminar circuit \(Sly&gL
埋入凸块连印制板 B2it printed board C^)Imr
载芯片板 chip on board 8S1@,O,
埋电阻板 buried resistance board x4^nT=?6_
母板 mother board 6|jZv~rS$
子板 daughter board /w?e(v<
背板 backplane a4,V(Hlm
裸板 bare board .==D?#bn
键盘板夹心板 copper-invar-copper board 9z#8K
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动态挠性板 dynamic flex board L)JB^cxf
静态挠性板 static flex board G WIsT\J
可断拼板 break-away planel fB$a)~
电缆 cable
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挠性扁平电缆 flexible flat cable (FFC) P=n_wE
薄膜开关 membrane switch [inlxJD
混合电路 hybrid circuit juHL$SGC
厚膜 thick film =*\.zr
厚膜电路 thick film circuit ?J:w,,4m
薄膜 thin film ftYJ 3/ WH
薄膜混合电路 thin film hybrid circuit kOQ)QX
互连 interconnection B"GC|}N)v
导线 conductor trace line o+1(N#?m9
齐平导线 flush conductor 7%^G]AFi
传输线 transmission line O)dnr8*
跨交 crossover wp?:@XM
板边插头 edge-board contact S8#0Vo$)a
增强板 stiffener -$Fj-pO\
基底 substrate
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基板面 real estate layxtECP(
导线面 conductor side xvTtA61Vp
元件面 component side mo| D
焊接面 solder side T~]~'+<Pi
导电图形 conductive pattern 9<Pg2#*N0
非导电图形 non-conductive pattern rRe5Q
基材 base material 0nwi5
层压板 laminate %%NoXW
覆金属箔基材 metal-clad bade material V8n {k'
覆铜箔层压板 copper-clad laminate (CCL) :=NXwY3~M
复合层压板 composite laminate g6Vkns4
薄层压板 thin laminate .Pm5nS
基体材料 basis material R{@saa5I(>
预浸材料 prepreg 7:UeE~uB:
粘结片 bonding sheet s 4`-mIa
预浸粘结片 preimpregnated bonding sheer WESD^FK
环氧玻璃基板 epoxy glass substrate UPfE\KN+p#
预制内层覆箔板 mass lamination panel E/:U,u{
内层芯板 core material `
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粘结层 bonding layer 8&@=Anc&q
粘结膜 film adhesive o-8{C0>:
无支撑胶粘剂膜 unsupported adhesive film 2|,$#V=
覆盖层 cover layer (cover lay) H:(B^uH
增强板材 stiffener material )U\i7[k>
铜箔面 copper-clad surface oKn$g[,SJh
去铜箔面 foil removal surface MRpMmu
层压板面 unclad laminate surface @D9O<x
基膜面 base film surface M XG>|
胶粘剂面 adhesive faec $>/d)o
原始光洁面 plate finish 8>C4w 5kF
粗面 matt finish ,Q"'q0hM=
剪切板 cut to size panel 0fqcPi
超薄型层压板 ultra thin laminate =IL\T8y09
A阶树脂 A-stage resin +-!3ruwSn
B阶树脂 B-stage resin ]t0o%w
C阶树脂 C-stage resin u#ya
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环氧树脂 epoxy resin )?jFz'<r
酚醛树脂 phenolic resin .B`$hxl*0c
聚酯树脂 polyester resin &E`Nu (e
聚酰亚胺树脂 polyimide resin !td!">r46e
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 0ca0-vY
丙烯酸树脂 acrylic resin I$"Z\c8;
三聚氰胺甲醛树脂 melamine formaldehyde resin H>+/k-n-
多官能环氧树脂 polyfunctional epoxy resin C@qWour
溴化环氧树脂 brominated epoxy resin 6m&GN4Ca
环氧酚醛 epoxy novolac *8)?ZZMM
氟树脂 fluroresin ?i<l7
硅树脂 silicone resin oRbWqN`F.
硅烷 silane nFni1cCD
聚合物 polymer hrniZ^
无定形聚合物 amorphous polymer Be{@ L
结晶现象 crystalline polamer U4d7-&U
双晶现象 dimorphism ^y>V-R/N
共聚物 copolymer C@-Hm
合成树脂 synthetic j}Tv/O,f
热固性树脂 thermosetting resin [Page] z_'^=9m
热塑性树脂 thermoplastic resin Oem1=QpaC
感光性树脂 photosensitive resin A ON
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环氧值 epoxy value }d5]N
双氰胺 dicyandiamide qK'mF#n0#
粘结剂 binder j"jssbu}
胶粘剂 adesive ewcFzlA@
固化剂 curing agent o*$KiD
阻燃剂 flame retardant nDn+lWA=g
遮光剂 opaquer ytj});,>
增塑剂 plasticizers 2[B bdg[O
不饱和聚酯 unsatuiated polyester 2]fTDKh
聚酯薄膜 polyester M.H!dZ
聚酰亚胺薄膜 polyimide film (PI) GIlaJ!/
聚四氟乙烯 polytetrafluoetylene (PTFE) OG#^d5(
增强材料 reinforcing material Z*Ffdh>*:&
折痕 crease 1'~+.92Y
云织 waviness E:rJi]
鱼眼 fish eye p7+{xXf
毛圈长 feather length 2@(+l*.Q
厚薄段 mark /,:cbpHsu
裂缝 split D0#U*tq;
捻度 twist of yarn 6ud?US(
浸润剂含量 size content ywm"{ U?8
浸润剂残留量 size residue 5JOfJ$(n
处理剂含量 finish level ULew ~j
偶联剂 couplint agent .;?ha'
断裂长 breaking length k8E2?kbF
吸水高度 height of capillary rise OC5oxL2HTe
湿强度保留率 wet strength retention !o|
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白度 whitenness G$zY&
导电箔 conductive foil =)y$&Y