1 backplane 背板
xmW~R*^
2 Band gap voltage reference 带隙电压参考
6@S6E(^
3 benchtop supply 工作台电源 sDY~jP[Oa
4 Block Diagram 方块图 5 Bode Plot 波特图 op,L3:R\Z
6 Bootstrap 自举 M>8J_{r^
7 Bottom FET Bottom FET M6Fo.eeK3
8 bucket capcitor 桶形电容 Szu s*YL7
9 chassis 机架 APQq F/
10 Combi-sense Combi-sense 5j%G7.S\
11 constant current source 恒流源 gv#\}/->4
12 Core Sataration 铁芯饱和 _T=g?0
q
13 crossover frequency 交叉频率 r~w.J+W
14 current ripple 纹波电流 '%)R}wgV
15 Cycle by Cycle 逐周期 VJh8`PVX
16 cycle skipping 周期跳步 4zug9kFK
17 Dead Time 死区时间 9>""xt
18 DIE Temperature 核心温度 Yo-}uTkw
19 Disable 非使能,无效,禁用,关断 Cs,H#L
20 dominant pole 主极点 YIU3}sJ!
21 Enable 使能,有效,启用 5E:$\z;
22 ESD Rating ESD额定值 pl[J!d.c
23 Evaluation Board 评估板 rr<E#w
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. t>"%exdoZ
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 x-^6U
25 Failling edge 下降沿 gT+/nSrLV
26 figure of merit 品质因数 xNP_>Qa~
27 float charge voltage 浮充电压 ITu19WG
28 flyback power stage 反驰式功率级 #el27"QP0
29 forward voltage drop 前向压降 '6KvB
30 free-running 自由运行 xo:kT )
31 Freewheel diode 续流二极管 >4 OXG7.&f
32 Full load 满负载 33 gate drive 栅极驱动 L74Mz]v
34 gate drive stage 栅极驱动级 CSk]c9=
35 gerber plot Gerber 图 [U\?+@E*
36 ground plane 接地层 5pO|^Gj1
37 Henry 电感单位:亨利 |"H 2'L$
38 Human Body Model 人体模式 1^iBS
39 Hysteresis 滞回 *O?c~UJhhV
40 inrush current 涌入电流 )P$(]{
41 Inverting 反相 `i7r]
42 jittery 抖动 8v:{BHX
43 Junction 结点 7
,Rg~L
44 Kelvin connection 开尔文连接 n|`3d~9$&
45 Lead Frame 引脚框架 0mw1CUx9K
46 Lead Free 无铅 @=J|%NO
47 level-shift 电平移动 '<Z[e`/
48 Line regulation 电源调整率 @Mk`Tl
49 load regulation 负载调整率 ]B8
A
50 Lot Number 批号 q76POytV|
51 Low Dropout 低压差 >1y6DC
52 Miller 密勒 53 node 节点 8*ZsR)!
54 Non-Inverting 非反相 ^?z%f_ri
55 novel 新颖的 Cj5mM[:s
56 off state 关断状态 J[ds.~ $
57 Operating supply voltage 电源工作电压 pwUXM?$R
58 out drive stage 输出驱动级 LQ0/oYmNc
59 Out of Phase 异相 #6sz@X fV
60 Part Number 产品型号 !Sq<_TO
61 pass transistor pass transistor Hl*vS
62 P-channel MOSFET P沟道MOSFET UA[`{rf
63 Phase margin 相位裕度 dZM^?rq
64 Phase Node 开关节点 V35Vi6*p
65 portable electronics 便携式电子设备 -[>de!
T3$
66 power down 掉电 CB@7XUR
67 Power Good 电源正常 =8^+M1I
68 Power Groud 功率地 !(sn9z#
69 Power Save Mode 节电模式 =Q#I@SVp2$
70 Power up 上电 _vQ52H,
71 pull down 下拉 K g@'mG
72 pull up 上拉 OATdmHW
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) #h5:b`fDF
74 push pull converter 推挽转换器 p|UL<M9{a]
75 ramp down 斜降 ?H{[u rLn
76 ramp up 斜升 {@Wv@H+4
77 redundant diode 冗余二极管 Hxu5Dx5![
78 resistive divider 电阻分压器 .hTqZvDa
79 ringing 振 铃 =u~nLL
80 ripple current 纹波电流 %&ejO=r
81 rising edge 上升沿 X-pbSq~5
82 sense resistor 检测电阻 %1z;l. c
83 Sequenced Power Supplys 序列电源 {I#_0Q,i
84 shoot-through 直通,同时导通 ]TV_p[L0B
85 stray inductances. 杂散电感 O&%'j
86 sub-circuit 子电路 16NHzAQ
87 substrate 基板 V>6klA}o
88 Telecom 电信 l.YE@EL
89 Thermal Information 热性能信息 ~o}:!y
90 thermal slug 散热片 -Cf)`/
91 Threshold 阈值 <'y<8gpM
92 timing resistor 振荡电阻 a[{$4JpK
93 Top FET Top FET \i.]-k
94 Trace 线路,走线,引线 Spm 0`
95 Transfer function 传递函数 /\J0)V
96 Trip Point 跳变点 6jE.X
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) yR[6s#F/h
98 Under Voltage Lock Out (UVLO) 欠压锁定 .qBc;u
99 Voltage Reference 电压参考 !pU$'1D
100 voltage-second product 伏秒积 *_V+K
101 zero-pole frequency compensation 零极点频率补偿 ]ua3I}_B6v
102 beat frequency 拍频 ]HKt7 %,
103 one shots 单击电路 ?d')#WnC
104 scaling 缩放 0B6!$) *-i
105 ESR 等效串联电阻 [Page] o|$D|E
106 Ground 地电位 d)%WaM%V
107 trimmed bandgap 平衡带隙 +{UY9_~\3
108 dropout voltage 压差 r"H::A
109 large bulk capacitance 大容量电容 ;QI9 OcE@/
110 circuit breaker 断路器 6v%yU3l
111 charge pump 电荷泵 )g5?5f;
112 overshoot 过冲 *>fr'jj1$
/VR~E'Cy%
印制电路printed circuit 1M ?BSH{
印制线路 printed wiring r. 82RoG?G
印制板 printed board MU<(O}
印制板电路 printed circuit board *V>?m6y/
印制线路板 printed wiring board qs4jUm
印制元件 printed component g 9,"u_
印制接点 printed contact @]uqC~a^
印制板装配 printed board assembly \w9}O2lL
板 board ]#0 (
刚性印制板 rigid printed board WjD885Xo
挠性印制电路 flexible printed circuit ;zCUx*{
挠性印制线路 flexible printed wiring RpdUR*K9x
齐平印制板 flush printed board `}X3f#eO&
金属芯印制板 metal core printed board |)x7qy`
金属基印制板 metal base printed board qxZIH
多重布线印制板 mulit-wiring printed board "*vrrY
塑电路板 molded circuit board 9a`LrB
散线印制板 discrete wiring board <q63?Ms'
微线印制板 micro wire board -CPtYG[s
积层印制板 buile-up printed board 8Vu@awz{L
表面层合电路板 surface laminar circuit ]b-2:M
埋入凸块连印制板 B2it printed board -^&=I3bp
载芯片板 chip on board SYJO3cY
埋电阻板 buried resistance board <Iw{fj|
母板 mother board dT|XcVKg
子板 daughter board zt.kNb
背板 backplane HxI6_ >n^I
裸板 bare board _i_='dsyW/
键盘板夹心板 copper-invar-copper board Ft5A(P >
动态挠性板 dynamic flex board @SX%q&-
静态挠性板 static flex board ki1(b]rf
可断拼板 break-away planel \ `Hp/D1
电缆 cable c^}G=Z1@
挠性扁平电缆 flexible flat cable (FFC) \Vc[/Qp7Bb
薄膜开关 membrane switch c5]Xqq,
混合电路 hybrid circuit ?Y"%BS+pt
厚膜 thick film 0 C4eer+D
厚膜电路 thick film circuit uq5?t
薄膜 thin film XgxE M1(
薄膜混合电路 thin film hybrid circuit gL<n?FG4b
互连 interconnection
ETZf
导线 conductor trace line ly[yn{
齐平导线 flush conductor ~ l}f@@u
传输线 transmission line EP:`l
跨交 crossover O_QDjxj^rZ
板边插头 edge-board contact \'|n.1Fr
增强板 stiffener |E+.y&0;
基底 substrate Q,?_;,I}
基板面 real estate BN*:*cmUl
导线面 conductor side i'fw>-0
元件面 component side 7FH(C`uKi
焊接面 solder side [>ghs_?dZ
导电图形 conductive pattern "ESc^28
非导电图形 non-conductive pattern APu$t$dmm
基材 base material 8eqTA8$?
层压板 laminate A f'&, 1=q
覆金属箔基材 metal-clad bade material h)Y] L#R
覆铜箔层压板 copper-clad laminate (CCL) rKgl:sj+
复合层压板 composite laminate |>Q>d8|k
薄层压板 thin laminate t/ \S9
基体材料 basis material z;JV3)E
预浸材料 prepreg $J1`.Q>)4
粘结片 bonding sheet ~z^?+MgZ2
预浸粘结片 preimpregnated bonding sheer )kep:-wm
环氧玻璃基板 epoxy glass substrate j]Gn\QF
预制内层覆箔板 mass lamination panel b<FE
内层芯板 core material O Z
./suR)
粘结层 bonding layer Bx45yaT
粘结膜 film adhesive !Yof%%m$;
无支撑胶粘剂膜 unsupported adhesive film nDnJ}`k
覆盖层 cover layer (cover lay) kk
fWiPO^
增强板材 stiffener material ;nSF\X(;{
铜箔面 copper-clad surface XFWpHe_ L
去铜箔面 foil removal surface T0 K!Msz
层压板面 unclad laminate surface E2DfG^sGV
基膜面 base film surface B:h<iU:'D
胶粘剂面 adhesive faec X]y:uD{
原始光洁面 plate finish ]bds~OY5 U
粗面 matt finish 88HqP!m%P:
剪切板 cut to size panel q>_<\|?%x
超薄型层压板 ultra thin laminate )tG. 9"<
A阶树脂 A-stage resin ;6/WjUDw<|
B阶树脂 B-stage resin WW:G(
\`
C阶树脂 C-stage resin .wNXvnWr
环氧树脂 epoxy resin ZLjAhd)
酚醛树脂 phenolic resin Sp>g77@
聚酯树脂 polyester resin 9a*#r;R
聚酰亚胺树脂 polyimide resin 5L3+KkX@
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin "Z&.m..gc
丙烯酸树脂 acrylic resin aL1%BGlmZ<
三聚氰胺甲醛树脂 melamine formaldehyde resin V'9.l6l
多官能环氧树脂 polyfunctional epoxy resin gqS9 {K(f
溴化环氧树脂 brominated epoxy resin mx^Ga=:
?
环氧酚醛 epoxy novolac w_{tS\
氟树脂 fluroresin ~| j
eNT
硅树脂 silicone resin tp`1S+'~j
硅烷 silane I)mB]j
聚合物 polymer MtkU]XKGT
无定形聚合物 amorphous polymer 9FDu{4:
结晶现象 crystalline polamer 4r(0+SO
双晶现象 dimorphism C8K2F5c5
共聚物 copolymer ^/BGOBK
合成树脂 synthetic wPg/.N9H
热固性树脂 thermosetting resin [Page] CH6 m
热塑性树脂 thermoplastic resin >Y>R1b%
感光性树脂 photosensitive resin %,bD|
NKp
环氧值 epoxy value 6*i**
双氰胺 dicyandiamide t5{P'v9J
粘结剂 binder Y,s EM%
胶粘剂 adesive Ef] Hpjvp
固化剂 curing agent X,Na4~JO(
阻燃剂 flame retardant w0!$ow.l
遮光剂 opaquer [v~,|N>w
增塑剂 plasticizers b,Wm]N
不饱和聚酯 unsatuiated polyester _:Qh1 &h
聚酯薄膜 polyester #,tT`{u1q
聚酰亚胺薄膜 polyimide film (PI) ?4':~;~
聚四氟乙烯 polytetrafluoetylene (PTFE) N|DfE{,
增强材料 reinforcing material H*0Y_H=
折痕 crease h'"m,(a
云织 waviness x*Z'i<;B
鱼眼 fish eye C@XS
毛圈长 feather length s#Dj>Fej
厚薄段 mark Om*QN]lGq
裂缝 split wsmgkg
捻度 twist of yarn os5$(
浸润剂含量 size content *$=i1w
浸润剂残留量 size residue T >8P1p@A,
处理剂含量 finish level f30J8n"k
偶联剂 couplint agent vK!`#W`X
断裂长 breaking length E !!,JnU
吸水高度 height of capillary rise x^K4&'</
湿强度保留率 wet strength retention ~YH?wdT
白度 whitenness P3"R2-
导电箔 conductive foil ,'
k?rQ
铜箔 copper foil F;Q,cg M
压延铜箔 rolled copper foil _r-LX"
光面 shiny side G|,&V0*
粗糙面 matte side |2do8z
处理面 treated side 2W+~{3[#
防锈处理 stain proofing YF{MXK}
双面处理铜箔 double treated foil 8$NVVw]2,
模拟 simulation OD)X7PU
逻辑模拟 logic simulation LhO\a
电路模拟 circit simulation 3%*igpj\)
时序模拟 timing simulation ,1ev2T
模块化 modularization ^BF}wQb:j
设计原点 design origin 1h@qcom9K_
优化(设计) optimization (design) :^y!z1\2(7
供设计优化坐标轴 predominant axis !R@LC
表格原点 table origin ehW [LRtq
元件安置 component positioning dBI-y6R
比例因子 scaling factor )=f}vHg$
扫描填充 scan filling kx&JY9(
矩形填充 rectangle filling }<WJR Y6j
填充域 region filling RQE]=N
实体设计 physical design 6La[( )
逻辑设计 logic design VgbNZ{qk@
逻辑电路 logic circuit OG}890$n
层次设计 hierarchical design h8(#\E
自顶向下设计 top-down design Ovt]3`U9J
自底向上设计 bottom-up design 4.,EKw3
费用矩阵 cost metrix d[t0K]
元件密度 component density ;^/ruf[t
自由度 degrees freedom $U[d#:]
出度 out going degree UC+Qn
入度 incoming degree ;
$rQ
曼哈顿距离 manhatton distance ?J2{6,}O*.
欧几里德距离 euclidean distance GQt5GOt
网络 network S#GxKMO%
阵列 array _ &, A
段 segment Iynks,ikA
逻辑 logic >7BP}5`.;
逻辑设计自动化 logic design automation &6\&McmkX
分线 separated time s:_hsmc"
分层 separated layer kZF]BPh.
定顺序 definite sequence CzV;{[?~;
导线(通道) conduction (track) ) k/&,J3
导线(体)宽度 conductor width 9i\}^ s2
导线距离 conductor spacing .6gx|V+
导线层 conductor layer !EIH"`>!
导线宽度/间距 conductor line/space 04U|Frc
第一导线层 conductor layer No.1 ~k34#j:J65
圆形盘 round pad /D"T\KNWr
方形盘 square pad bbjba36RO
菱形盘 diamond pad "c[> >t
长方形焊盘 oblong pad PSc=k0D
子弹形盘 bullet pad 6 :4GI
泪滴盘 teardrop pad wwl,F=| Y
雪人盘 snowman pad $2Wk#F2c=
形盘 V-shaped pad V SGl|{+(A
环形盘 annular pad }!^h2)'7
非圆形盘 non-circular pad b_Y+XXb<
隔离盘 isolation pad a >fA-@
非功能连接盘 monfunctional pad KJFQ)#SW!
偏置连接盘 offset land !po,Z&
腹(背)裸盘 back-bard land S+06pj4Ie
盘址 anchoring spaur W,~*pyLdO
连接盘图形 land pattern eSoX|2g
连接盘网格阵列 land grid array W\[E
孔环 annular ring Lx-%y'P
元件孔 component hole 6Y [&1c8
安装孔 mounting hole rv[BL.qV
支撑孔 supported hole >IQ&*Bb
非支撑孔 unsupported hole sA6Hk B.
导通孔 via _A]jiPq
镀通孔 plated through hole (PTH) xd3mAf
余隙孔 access hole )%jS9e{d
盲孔 blind via (hole) w8D8\`i!"
埋孔 buried via hole pW ~;B*hF
埋,盲孔 buried blind via IRM jL.q
任意层内部导通孔 any layer inner via hole DQhHU1
全部钻孔 all drilled hole ;7Qe m&
定位孔 toaling hole Rb<|
<D+
无连接盘孔 landless hole 3wN4kltt
中间孔 interstitial hole x/1FQ>n:9
无连接盘导通孔 landless via hole +]t9kr
引导孔 pilot hole Db2#QQ
端接全隙孔 terminal clearomee hole 5M\0t\uEn
准尺寸孔 dimensioned hole [Page] 4`~OxL
在连接盘中导通孔 via-in-pad 3=]/+{B
孔位 hole location qb nlD\
孔密度 hole density ' q9Ejig
孔图 hole pattern j 1'H|4
钻孔图 drill drawing ~b8.]Z^
装配图assembly drawing G%gdI3h1Z
参考基准 datum referan yzpa\[^
1) 元件设备 L,_U co
a:|]F|
三绕组变压器:three-column transformer ThrClnTrans [9?]|4
双绕组变压器:double-column transformer DblClmnTrans qjfv9sU
电容器:Capacitor Iy5W/QK6
并联电容器:shunt capacitor ,hK
=x
电抗器:Reactor LzXIqj'H7T
母线:Busbar #euOq
输电线:TransmissionLine hW,GsJ,
发电厂:power plant m$Tt y[0
断路器:Breaker ZbH6$2r
刀闸(隔离开关):Isolator ^R\5'9K!
分接头:tap /x-tl)(s=
电动机:motor (`n*d3
(2) 状态参数 -GgV&%'a
6w<p1qhW
有功:active power KJ?/]oLr0
无功:reactive power ^<yM0'0t
电流:current p*P0<01Z
容量:capacity xT9+l1_
电压:voltage !oV'
档位:tap position bVRxGn @l
有功损耗:reactive loss /9y'UKl7[
无功损耗:active loss RkdAzv!Y7
功率因数:power-factor /?j^Qu
功率:power >fR#U"KPAB
功角:power-angle 0@f7`D
电压等级:voltage grade "2"*3R<Y
空载损耗:no-load loss Sdmynuv
U
铁损:iron loss GLl@
6S>v
铜损:copper loss uuhvd h=
空载电流:no-load current .>zkS*oX4z
阻抗:impedance b!37:V\#}
正序阻抗:positive sequence impedance L3Q1az!Ct
负序阻抗:negative sequence impedance qj|B #dU
零序阻抗:zero sequence impedance ,TO&KO1;&
电阻:resistor cmh/a~vYaY
电抗:reactance .+AO3~Dg
电导:conductance m4P=,=%
电纳:susceptance nuv$B >
无功负载:reactive load 或者QLoad _jb"@TY
有功负载: active load PLoad &4MVk3SLx#
遥测:YC(telemetering) 48%a${Nvvj
遥信:YX Ll&5#q
励磁电流(转子电流):magnetizing current 1[`l`Truz
定子:stator +FVcrL@
功角:power-angle f4T-=` SO
上限:upper limit [76m gj!K
下限:lower limit &<i>)Ss
并列的:apposable =Jl1D*B*
高压: high voltage B
9]sSx
低压:low voltage N<Q}4%^c
中压:middle voltage kk5i{.?[
电力系统 power system -+I! (?
发电机 generator vDOeBw=
励磁 excitation dl$l5z\
励磁器 excitor <u($!ATb
电压 voltage .y[K =p3
电流 current z06pX$Q.<
母线 bus :* /``
变压器 transformer :U[_V4?7
升压变压器 step-up transformer yZ)ScB^
高压侧 high side +#H8d1^5
输电系统 power transmission system 01q7n`o#zf
输电线 transmission line WE~3(rs#X#
固定串联电容补偿fixed series capacitor compensation o-'i)pp
稳定 stability UZX)1?U
电压稳定 voltage stability n_ez6{
功角稳定 angle stability 17Gdu[E
暂态稳定 transient stability YL=k&QG
电厂 power plant /tv;W
能量输送 power transfer hA\8&pI;
交流 AC $xZk{ rK
装机容量 installed capacity zXf+ie o
电网 power system o%9>elOju
落点 drop point m[7:p{
开关站 switch station nG*6ic
双回同杆并架 double-circuit lines on the same tower fY"28#
变电站 transformer substation YXg
uw7%\
补偿度 degree of compensation \+~4t
高抗 high voltage shunt reactor v!U# C[a^
无功补偿 reactive power compensation aQmL=9
故障 fault qRGb3l
调节 regulation QF;<%QF:
裕度 magin lM1!2d'P
三相故障 three phase fault S'JeA>L
故障切除时间 fault clearing time ipp_?5TL
极限切除时间 critical clearing time g^4FzJ
切机 generator triping ^[Er%yr0
高顶值 high limited value _~(Xd@c(
强行励磁 reinforced excitation
Y)*lw
线路补偿器 LDC(line drop compensation) 9cmJD5OO
机端 generator terminal YPy))>Q>cK
静态 static (state) enz Q}^
动态 dynamic (state) 2!otVz!Mh
单机无穷大系统 one machine - infinity bus system $B?7u@>,
机端电压控制 AVR >C}RZdO~
电抗 reactance >oNk(.
%
电阻 resistance Bw=[g&+o1@
功角 power angle G!;[If:<e
有功(功率) active power )x7hhEk=^
无功(功率) reactive power C|zH {.H
功率因数 power factor X[~CLKH(
无功电流 reactive current ;2|H6IN"
下降特性 droop characteristics 7 f*_
斜率 slope w;$+7
额定 rating ,6S8s
变比 ratio oCYD@S>h
参考值 reference value y4L9Cxvs
电压互感器 PT K)@}Ok"#\4
分接头 tap iP%=Wo.
下降率 droop rate U}0/V
c26
仿真分析 simulation analysis zNf5OItx
传递函数 transfer function cj<@~[uw
框图 block diagram 9.=#4OH/
受端 receive-side ) :@%xoF5
裕度 margin UVJ(iNK"
同步 synchronization X8x>oV;8
失去同步 loss of synchronization lpUtNy
阻尼 damping 5Z,lWp2A
摇摆 swing __iyBaX
保护断路器 circuit breaker k#) .E X
电阻:resistance #+PbcL
电抗:reactance (d#Z-w-
阻抗:impedance rfi`Bp
电导:conductance Q9>]@DrAx
电纳:susceptance