1 backplane 背板 JOBz{;:R{
2 Band gap voltage reference 带隙电压参考 ,H>W:O
3 benchtop supply 工作台电源 i<%m Iq1L
4 Block Diagram 方块图 5 Bode Plot 波特图 0 _Q*E3
6 Bootstrap 自举 RX:R*{]-
7 Bottom FET Bottom FET A9
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8 bucket capcitor 桶形电容 pe|X@o
9 chassis 机架 oP/>ju
10 Combi-sense Combi-sense cZqfz
11 constant current source 恒流源 >Q;
g0\I_
12 Core Sataration 铁芯饱和 qQ^d9EK'?~
13 crossover frequency 交叉频率 yahAD.Xuo@
14 current ripple 纹波电流 lM>.@:
15 Cycle by Cycle 逐周期 %/5 1o6a
16 cycle skipping 周期跳步 14mf}"z\
17 Dead Time 死区时间 Zr=ib
18 DIE Temperature 核心温度 'e F%
19 Disable 非使能,无效,禁用,关断 '=VH6@vZ_'
20 dominant pole 主极点 OY: u',T
21 Enable 使能,有效,启用 [w!C*_V 9
22 ESD Rating ESD额定值 wb
b*nL|P
23 Evaluation Board 评估板 Z a!
gbt
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 6Lb{r4^
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 tww=~!
25 Failling edge 下降沿 kd yAl,
26 figure of merit 品质因数 G~"z_ (
27 float charge voltage 浮充电压 xA92C
28 flyback power stage 反驰式功率级 xk& NAB
29 forward voltage drop 前向压降 1Pm4.C)
30 free-running 自由运行 @K\o4\
31 Freewheel diode 续流二极管 .46#`4av
32 Full load 满负载 33 gate drive 栅极驱动 /hL\,x2
34 gate drive stage 栅极驱动级 /jM_mrpz
35 gerber plot Gerber 图 _BbvhWN&+
36 ground plane 接地层 9TC)
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37 Henry 电感单位:亨利 ioxbf6{
38 Human Body Model 人体模式 OVZP x%a
39 Hysteresis 滞回 vB.l0!c\e_
40 inrush current 涌入电流 /,!<Va;~
41 Inverting 反相 &:<, c12
42 jittery 抖动 EkjgNEXq
43 Junction 结点 @o6R[5(
44 Kelvin connection 开尔文连接 AotCX7T2T
45 Lead Frame 引脚框架 Fk{J@Y
46 Lead Free 无铅 sf$o(^P9\A
47 level-shift 电平移动 802H$P^ps
48 Line regulation 电源调整率 onwjn+"&
49 load regulation 负载调整率 L_~8"I_
50 Lot Number 批号 <YH=3[
51 Low Dropout 低压差 -jB3L:
52 Miller 密勒 53 node 节点 ^ *0'\/N&
54 Non-Inverting 非反相 yrnv!moc%t
55 novel 新颖的 \9`#]#1bx5
56 off state 关断状态 rh66_eV
57 Operating supply voltage 电源工作电压 7b, (\Fm
58 out drive stage 输出驱动级 1yMr~Fo
59 Out of Phase 异相 4jX3lq|
60 Part Number 产品型号 L0L2Ns
61 pass transistor pass transistor :S -";.:"
62 P-channel MOSFET P沟道MOSFET FQk!d$BG
63 Phase margin 相位裕度 ]n;1x1'
64 Phase Node 开关节点 H>XFz(LWh
65 portable electronics 便携式电子设备 Qs%B'9")
66 power down 掉电 2z\e\I
67 Power Good 电源正常 BEUK}T K4
68 Power Groud 功率地 Y1)!lTG
69 Power Save Mode 节电模式 Y%@hbUc}x9
70 Power up 上电 T7[NcZ:I
71 pull down 下拉 bWmw3w
72 pull up 上拉 ^nNitF
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 6@V~0DG
74 push pull converter 推挽转换器 =^tA_AxVw
75 ramp down 斜降 V
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76 ramp up 斜升 P6\6?am
77 redundant diode 冗余二极管 Hr^3`@}#1
78 resistive divider 电阻分压器 36vgX=}
79 ringing 振 铃 pr&=n;_ n
80 ripple current 纹波电流 |gx~gG<
81 rising edge 上升沿 ]{GDS! )
82 sense resistor 检测电阻 dg_G s>?2
83 Sequenced Power Supplys 序列电源 QI_4*
84 shoot-through 直通,同时导通 !q'
4D!I
85 stray inductances. 杂散电感 S\=1_LDx"
86 sub-circuit 子电路 AXPMnbUS
87 substrate 基板 h&;t.Gdf
88 Telecom 电信 Gh\q^?}
89 Thermal Information 热性能信息 =5x&8i
90 thermal slug 散热片 b~w=v_[(I
91 Threshold 阈值 WQ6"0*er
92 timing resistor 振荡电阻 !h`kX[:
93 Top FET Top FET _zMgoc7
94 Trace 线路,走线,引线 aG%,cQ 1
95 Transfer function 传递函数 -LW[7s$
96 Trip Point 跳变点 _S`o1^Ad
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) mJ}opy!{;
98 Under Voltage Lock Out (UVLO) 欠压锁定 >V$ Gx>I
99 Voltage Reference 电压参考 VIJ<``9[
100 voltage-second product 伏秒积 Wl-<HR!n
101 zero-pole frequency compensation 零极点频率补偿 [p;E~-S
102 beat frequency 拍频 y[?-@7i
103 one shots 单击电路 SF[FmN!^^
104 scaling 缩放 )]htm&q5
105 ESR 等效串联电阻 [Page] hA1-){aw3q
106 Ground 地电位 )B$;Vs]@i
107 trimmed bandgap 平衡带隙 {{yZ@>o6
108 dropout voltage 压差 4\M.6])_
109 large bulk capacitance 大容量电容 `bjizS'^
110 circuit breaker 断路器 ZJ*g))k7
111 charge pump 电荷泵 ]#2Y e7+
112 overshoot 过冲 qIMA6u/
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印制电路printed circuit |r%D\EB
印制线路 printed wiring 36.N>G,
印制板 printed board 6CbxuzYer
印制板电路 printed circuit board tptN6Isuh
印制线路板 printed wiring board D B E4&
印制元件 printed component [`RX*OH2
印制接点 printed contact H<EQu|f&x
印制板装配 printed board assembly c%m3}mrb
板 board \</b4iR)LT
刚性印制板 rigid printed board ?>"Yr,b?
挠性印制电路 flexible printed circuit ig}A9j?]
挠性印制线路 flexible printed wiring <FI-zca
齐平印制板 flush printed board ?';OD3-
金属芯印制板 metal core printed board ,\2:/>2
金属基印制板 metal base printed board G uQ=gN
多重布线印制板 mulit-wiring printed board z7GTaX$d
塑电路板 molded circuit board 3jB$2: #
散线印制板 discrete wiring board ' Z0r>.
微线印制板 micro wire board RPd}Wf
积层印制板 buile-up printed board 7\FXz'hA
表面层合电路板 surface laminar circuit I`KQ|h0%
埋入凸块连印制板 B2it printed board %\|'%/"`2(
载芯片板 chip on board ~w8JH2O
埋电阻板 buried resistance board ,<BbpIQ2o
母板 mother board 2_vbT!_
子板 daughter board LJk%#yV|_
背板 backplane K*UgX(xu4P
裸板 bare board ,1OyN]f3
键盘板夹心板 copper-invar-copper board w}Uhd,
动态挠性板 dynamic flex board l7# yZ*<v
静态挠性板 static flex board HK|ynBAo
可断拼板 break-away planel 26T "XW'_
电缆 cable
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挠性扁平电缆 flexible flat cable (FFC) +)o}c"P!
薄膜开关 membrane switch {:@tQdM:i8
混合电路 hybrid circuit ^P151*=D
厚膜 thick film Z87_ #5
厚膜电路 thick film circuit E|'h]NY
薄膜 thin film J+d1&Tw&
薄膜混合电路 thin film hybrid circuit ?T+q/lt4
互连 interconnection 7i&:DePM'q
导线 conductor trace line y6]vl=^L
齐平导线 flush conductor a:QDBS2Llv
传输线 transmission line \]$IDt(s
跨交 crossover x#Sqn#
板边插头 edge-board contact $!&*xrrNM
增强板 stiffener |$5[(6T|
基底 substrate AL>$HB$
基板面 real estate Sb~MQ_
导线面 conductor side da)NK!
元件面 component side Aq3}Ng
焊接面 solder side 2RSt)3!},
导电图形 conductive pattern _a1x\,R|DB
非导电图形 non-conductive pattern ..rOsg{
基材 base material VkZ7#
层压板 laminate }iuWAFZbGS
覆金属箔基材 metal-clad bade material iX)%Q
覆铜箔层压板 copper-clad laminate (CCL) hdrm!aBd
复合层压板 composite laminate R?]02Q
薄层压板 thin laminate ynbuN x*
基体材料 basis material /~3r;M
预浸材料 prepreg 6i}iAP|0
粘结片 bonding sheet F i0GknQ+
预浸粘结片 preimpregnated bonding sheer 6'Fd GS
环氧玻璃基板 epoxy glass substrate E~6c -Lw
预制内层覆箔板 mass lamination panel .0es3Rj
内层芯板 core material U*)8G
粘结层 bonding layer 9Q"'"b*?z
粘结膜 film adhesive R6(oZph
无支撑胶粘剂膜 unsupported adhesive film H-
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覆盖层 cover layer (cover lay) /FRm2m83
增强板材 stiffener material UeRj< \"Q
铜箔面 copper-clad surface ~;N^g4s
去铜箔面 foil removal surface OynXkH]0T+
层压板面 unclad laminate surface /{&tY:;m
基膜面 base film surface 62zYRs\Y)X
胶粘剂面 adhesive faec *6>.!&
原始光洁面 plate finish mGK|ihYu
粗面 matt finish o7$'cn
剪切板 cut to size panel .nVa[B|.
超薄型层压板 ultra thin laminate `7r@a
A阶树脂 A-stage resin R#I0|;q4|p
B阶树脂 B-stage resin ,LnII
C阶树脂 C-stage resin JT!9\i
环氧树脂 epoxy resin X<I+&Zi
酚醛树脂 phenolic resin h-[VH%
聚酯树脂 polyester resin J|qZ+A[z
聚酰亚胺树脂 polyimide resin H*r)Z90
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin +8Rg F
丙烯酸树脂 acrylic resin .?loO3 m
三聚氰胺甲醛树脂 melamine formaldehyde resin rp;b" q
多官能环氧树脂 polyfunctional epoxy resin z62;cv
溴化环氧树脂 brominated epoxy resin !*7 vFl
环氧酚醛 epoxy novolac y#3j`. $3p
氟树脂 fluroresin o%IA}e7PAa
硅树脂 silicone resin tg<EY!WY
硅烷 silane TOB]IrW
聚合物 polymer #
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无定形聚合物 amorphous polymer Q|#W#LV,K
结晶现象 crystalline polamer gMzcTmbc8
双晶现象 dimorphism )mF5Vw"
共聚物 copolymer vzim<;i
合成树脂 synthetic ,Y/ g2
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热固性树脂 thermosetting resin [Page] f,018]|
热塑性树脂 thermoplastic resin J1C3&t}
感光性树脂 photosensitive resin J4fi'
环氧值 epoxy value xLK<W"%0
双氰胺 dicyandiamide ww],y@da
粘结剂 binder ewctkI$,5
胶粘剂 adesive =A83W/4
固化剂 curing agent h4T5+~rw
阻燃剂 flame retardant XovRg,
遮光剂 opaquer iKX-myCz
增塑剂 plasticizers @$[?z9ck"
不饱和聚酯 unsatuiated polyester i3@)W4{
聚酯薄膜 polyester ahJ`$U4n
聚酰亚胺薄膜 polyimide film (PI) CxwoBuG=?
聚四氟乙烯 polytetrafluoetylene (PTFE) MygfT[_
增强材料 reinforcing material A#EDkU,
折痕 crease old(i:2
云织 waviness J IUx
鱼眼 fish eye pKpUXfQu
毛圈长 feather length TJK[ev};S
厚薄段 mark 9\_eK,*B
裂缝 split |}=acc/
捻度 twist of yarn X= 5xh
浸润剂含量 size content Ya3C#=
浸润剂残留量 size residue :~Wrf8UQ
处理剂含量 finish level Azl&m