1 backplane 背板 EeO{G*pq
2 Band gap voltage reference 带隙电压参考 FWg7e3
3 benchtop supply 工作台电源 !T*izMX}
4 Block Diagram 方块图 5 Bode Plot 波特图 Lmb<)YY
6 Bootstrap 自举 #=rR[:M
7 Bottom FET Bottom FET PO&`rr
8 bucket capcitor 桶形电容 yWzTHW`)Mr
9 chassis 机架 m|
Z)h{&
10 Combi-sense Combi-sense duI8^&|
11 constant current source 恒流源 .
fIodk
12 Core Sataration 铁芯饱和 |($pXVLH`
13 crossover frequency 交叉频率 Q *he%@w
14 current ripple 纹波电流 k;sUD mrO
15 Cycle by Cycle 逐周期 YdFC YSiS
16 cycle skipping 周期跳步 V;"'!dVX
17 Dead Time 死区时间 ^|Y!NHYH$Z
18 DIE Temperature 核心温度 -Q;
w4@
19 Disable 非使能,无效,禁用,关断 iaB5t<t1r
20 dominant pole 主极点 }49?Z 3
21 Enable 使能,有效,启用 pfT7
22 ESD Rating ESD额定值 mIyaoIE|$
23 Evaluation Board 评估板 )l=j,4nn
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. y{&,YV&_h
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 o! 8X< o
25 Failling edge 下降沿 X\;y;pmRH
26 figure of merit 品质因数 b|N EU-oy
27 float charge voltage 浮充电压 ?V0IryF;
28 flyback power stage 反驰式功率级 @9-qqU@
29 forward voltage drop 前向压降 R:Lu)d>=
30 free-running 自由运行 N$?q Aek
31 Freewheel diode 续流二极管 SC#
32 Full load 满负载 33 gate drive 栅极驱动 FQ5# v{
34 gate drive stage 栅极驱动级 \?j(U8mB>
35 gerber plot Gerber 图 e*tOXXY1
36 ground plane 接地层 m*1=-"P
37 Henry 电感单位:亨利 VD4(
38 Human Body Model 人体模式 ]?^mb n
39 Hysteresis 滞回 ?g 3sv5\u
40 inrush current 涌入电流 0:XmReO+k
41 Inverting 反相 ||hd(_W8
42 jittery 抖动 #r\uh\Cy
43 Junction 结点 8W{R&Z7aL
44 Kelvin connection 开尔文连接 :0J;^@
45 Lead Frame 引脚框架 PH6uP]
46 Lead Free 无铅 $3So`8Bm[$
47 level-shift 电平移动 e.[h
48 Line regulation 电源调整率 zR%#Q_
49 load regulation 负载调整率 r_QWt1K
50 Lot Number 批号 c5JxKU_
51 Low Dropout 低压差 #(%6urd
52 Miller 密勒 53 node 节点 J(0c#}d
54 Non-Inverting 非反相 i]P]o)
55 novel 新颖的 y&UsSS
56 off state 关断状态 [ACa<U/
57 Operating supply voltage 电源工作电压 ]c08`
58 out drive stage 输出驱动级 bFcI\Q{4
59 Out of Phase 异相 cG.4%Va@s_
60 Part Number 产品型号 'Ag?#vB
61 pass transistor pass transistor `,J\E<4J
62 P-channel MOSFET P沟道MOSFET SJ<nAX
63 Phase margin 相位裕度 ?Pa5skqR
64 Phase Node 开关节点 2vynz,^ET
65 portable electronics 便携式电子设备 )gZ yW
66 power down 掉电 D_g+O"];P
67 Power Good 电源正常 Ls( &.
68 Power Groud 功率地 J=
T!
69 Power Save Mode 节电模式 LKhUqW
70 Power up 上电 T{Av[>M
71 pull down 下拉 U<zOR=_
72 pull up 上拉 Gx!Y
4Q}-
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) uT_bA0jK
74 push pull converter 推挽转换器 &4LrV+`$V
75 ramp down 斜降 {q:6;yzxl
76 ramp up 斜升 v81<K*w`P
77 redundant diode 冗余二极管 p~qdkA<
78 resistive divider 电阻分压器 Zv-#v
79 ringing 振 铃 3>ytpXUEGx
80 ripple current 纹波电流 WOh?/F[@u
81 rising edge 上升沿 G22u+ua
82 sense resistor 检测电阻 *&XOzaVU
83 Sequenced Power Supplys 序列电源 `j9 ;9^
84 shoot-through 直通,同时导通 t~3!| @3i
85 stray inductances. 杂散电感 P9BShC5
86 sub-circuit 子电路 5LR
k)@t
87 substrate 基板 {;q
zz9 |
88 Telecom 电信 $/K<hT_
89 Thermal Information 热性能信息 U`z=!KI+g
90 thermal slug 散热片 51xiX90D
91 Threshold 阈值 L\aG.\
92 timing resistor 振荡电阻 eot%Th?[
93 Top FET Top FET =XVw{\#9 b
94 Trace 线路,走线,引线 X3@Uih}|
95 Transfer function 传递函数 .r4*?>
96 Trip Point 跳变点 y2cYRHN[X}
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Dr)B0]KG
98 Under Voltage Lock Out (UVLO) 欠压锁定 Vmt$]/
99 Voltage Reference 电压参考 jBb:)
100 voltage-second product 伏秒积 G
.NGS%v
101 zero-pole frequency compensation 零极点频率补偿 Cs))9'cD]
102 beat frequency 拍频 UyENzK<%u
103 one shots 单击电路 8MU+i%hd
104 scaling 缩放 #ozui-u>
105 ESR 等效串联电阻 [Page] VX0}x+LJ
106 Ground 地电位 DZ"'GQSg
107 trimmed bandgap 平衡带隙 ^M0
108 dropout voltage 压差 Xh+;$2l.B
109 large bulk capacitance 大容量电容 E%LUJx}
110 circuit breaker 断路器 ]lqLC
111 charge pump 电荷泵 Qco8m4n
112 overshoot 过冲 tnE),
^,}1^?*
印制电路printed circuit $t0o*i{
印制线路 printed wiring 2u Zb2O
印制板 printed board SMonJ;Y
印制板电路 printed circuit board 4K5
印制线路板 printed wiring board {>g{+Eq
印制元件 printed component xu\s2x$
印制接点 printed contact R"W5R-
印制板装配 printed board assembly Q<0X80w>
板 board OYSq)!:
刚性印制板 rigid printed board %:t! u&:q
挠性印制电路 flexible printed circuit jh(T?t$&
挠性印制线路 flexible printed wiring K
@RGvP
齐平印制板 flush printed board 1%ENgb:8
金属芯印制板 metal core printed board L>L IN 1A
金属基印制板 metal base printed board .exBU1Yk@
多重布线印制板 mulit-wiring printed board &+ "<ia(
塑电路板 molded circuit board DG?g~{Y~b
散线印制板 discrete wiring board #lR-?Uh
微线印制板 micro wire board fqjBor}
积层印制板 buile-up printed board S4\a"WYg
表面层合电路板 surface laminar circuit I3HO><of
埋入凸块连印制板 B2it printed board ,?P< =M
载芯片板 chip on board 4M#i_.`z
埋电阻板 buried resistance board zZ6m`]{B9?
母板 mother board <?s@-mpgN
子板 daughter board =^1jVaAL
背板 backplane eR%\_;}7;
裸板 bare board .' }jd#
键盘板夹心板 copper-invar-copper board 1w~PHH`~
动态挠性板 dynamic flex board 4sRM"w;
静态挠性板 static flex board 63'm
@oZ
可断拼板 break-away planel Ge_fU'F
电缆 cable HjIIhl?UY
挠性扁平电缆 flexible flat cable (FFC) fLnwA|n=
薄膜开关 membrane switch ?7}ybw3t]
混合电路 hybrid circuit C$q};7b1N
厚膜 thick film ^s6}[LDW>@
厚膜电路 thick film circuit %N)B8A9kh
薄膜 thin film Z#.1p'3qm1
薄膜混合电路 thin film hybrid circuit ^D<CoxG
互连 interconnection nfbR"E
jXr
导线 conductor trace line fcxg6W'
齐平导线 flush conductor 9dq"x[
传输线 transmission line eZEk$W%
跨交 crossover ").gPmC
板边插头 edge-board contact VwpC UW
增强板 stiffener <l(n)|H1P
基底 substrate 2TUV9Z
基板面 real estate U$mDAi$
导线面 conductor side .u>[m.
元件面 component side H1f='k]SZ
焊接面 solder side hs[x\:})/
导电图形 conductive pattern d\uN
非导电图形 non-conductive pattern 4d\^
基材 base material ?TeozhUY
层压板 laminate 5mQ@&E~#W
覆金属箔基材 metal-clad bade material t5%cpkgh4
覆铜箔层压板 copper-clad laminate (CCL) +l^tT&s;f
复合层压板 composite laminate 9v_s_QkL2
薄层压板 thin laminate f[1cN`|z
基体材料 basis material \o}T0YX
预浸材料 prepreg w+/`l*
粘结片 bonding sheet VxBBZsZO~
预浸粘结片 preimpregnated bonding sheer )i}j\";>L
环氧玻璃基板 epoxy glass substrate GA[Ebzi
预制内层覆箔板 mass lamination panel "Yh;3tI4*
内层芯板 core material \?;
`_E`j
粘结层 bonding layer YZ5,K6u
粘结膜 film adhesive W?5')
无支撑胶粘剂膜 unsupported adhesive film PFuhvw~?
覆盖层 cover layer (cover lay) Iz1x| EQ
增强板材 stiffener material [EDX@Kdq)
铜箔面 copper-clad surface N2O *g`YC
去铜箔面 foil removal surface Hl`OT5pNf
层压板面 unclad laminate surface tsAV46S
基膜面 base film surface ?>Sv_0
胶粘剂面 adhesive faec T[Zs{S
原始光洁面 plate finish &J)<1!|
粗面 matt finish .26mB
Xr
剪切板 cut to size panel -T,?'J0 2
超薄型层压板 ultra thin laminate 9a=Ll]=\
A阶树脂 A-stage resin nd]SI;<
B阶树脂 B-stage resin R3~,&ab
C阶树脂 C-stage resin C<
9x\JY%
环氧树脂 epoxy resin 8@;]@c)m
酚醛树脂 phenolic resin g%&E~V/g$
聚酯树脂 polyester resin se\f be ^0
聚酰亚胺树脂 polyimide resin >G:Q/3jh
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin @j^R+F
丙烯酸树脂 acrylic resin $AZYY\1
三聚氰胺甲醛树脂 melamine formaldehyde resin oT-gZedW(
多官能环氧树脂 polyfunctional epoxy resin f`n4'dG
溴化环氧树脂 brominated epoxy resin o/w3b8
环氧酚醛 epoxy novolac T&lgWOls
氟树脂 fluroresin 5p (zhfuG
硅树脂 silicone resin 2)n`Bd
硅烷 silane QWk3y"5n<
聚合物 polymer v>_@D@pr
无定形聚合物 amorphous polymer hm,{C
结晶现象 crystalline polamer ,WRm{v0f^
双晶现象 dimorphism E`.xu>Yyj
共聚物 copolymer {V6&((E8
合成树脂 synthetic --WQr]U/
热固性树脂 thermosetting resin [Page] riDb!oC
热塑性树脂 thermoplastic resin &Q3Fgj
感光性树脂 photosensitive resin 5dePpF D5
环氧值 epoxy value <0})%V?-
双氰胺 dicyandiamide sp,-JZD
粘结剂 binder r[S(VPo[()
胶粘剂 adesive Vh^y6U<
固化剂 curing agent 1Cw]~jh
阻燃剂 flame retardant e$Ksn_wEq
遮光剂 opaquer 4j#y?^s
增塑剂 plasticizers ZwkUd-=0i
不饱和聚酯 unsatuiated polyester BpZ~6WtBq
聚酯薄膜 polyester %T({;/
聚酰亚胺薄膜 polyimide film (PI) nGH6D2!F
聚四氟乙烯 polytetrafluoetylene (PTFE) G-d7}Uz?
增强材料 reinforcing material 'z ?Hv
折痕 crease wXIRn?z
云织 waviness $G".PWc
鱼眼 fish eye { ADd[V
毛圈长 feather length {DRk{>K,
厚薄段 mark gJQ#j~'
裂缝 split 6KMO*v
捻度 twist of yarn o-\h;aQJ
浸润剂含量 size content WC#6(H5t$
浸润剂残留量 size residue #EH=tJgO|J
处理剂含量 finish level \ %Mcvb.?
偶联剂 couplint agent o{PG&
}K
断裂长 breaking length Anz{u$0M[
吸水高度 height of capillary rise [d`E9&Hv3
湿强度保留率 wet strength retention -c_l
n K
白度 whitenness csy6_q(
导电箔 conductive foil ("8 Hku?
铜箔 copper foil K!6T8^JH
压延铜箔 rolled copper foil QP(0
光面 shiny side $
VT)
粗糙面 matte side ]l,D,d81
处理面 treated side ,b*?7R
防锈处理 stain proofing 1}d
F,e
双面处理铜箔 double treated foil =A'>1N
模拟 simulation t%:7W[_s
逻辑模拟 logic simulation t<45[~[
电路模拟 circit simulation p*Z<DEh#
时序模拟 timing simulation 287j,'vR
模块化 modularization JP>EW&M
设计原点 design origin zG9FO/@av
优化(设计) optimization (design) NNt n
供设计优化坐标轴 predominant axis 9^a|yyzL
表格原点 table origin `=(<!nXJx
元件安置 component positioning L1SX2F8
比例因子 scaling factor w){B$X
扫描填充 scan filling s ~Eo]e
矩形填充 rectangle filling rS [4Pey
填充域 region filling jj{:=lZB
实体设计 physical design RdX+:!lD
逻辑设计 logic design A[l
)>:
逻辑电路 logic circuit WsHDIp
层次设计 hierarchical design d:'{h"M6
自顶向下设计 top-down design TAYh#T=S
自底向上设计 bottom-up design tj;47UtH
费用矩阵 cost metrix 5iw\F!op:
元件密度 component density ^(q .f=I!a
自由度 degrees freedom -HF?1c
出度 out going degree Bl+\|[yd
入度 incoming degree jkk%zu
曼哈顿距离 manhatton distance -b!?9T?}
欧几里德距离 euclidean distance bc(MN8b ]j
网络 network PhAfEsD
阵列 array 5Ew( 0K[
段 segment 3eUi9_s+
逻辑 logic a4s't%
P
逻辑设计自动化 logic design automation cxR.:LD}
分线 separated time fM.#FT??
分层 separated layer Uh.swBC n
定顺序 definite sequence hJSvx
导线(通道) conduction (track) @fA{;@N
导线(体)宽度 conductor width aVR!~hvFs
导线距离 conductor spacing aj4ZS
导线层 conductor layer 6.]~7n
导线宽度/间距 conductor line/space l;q]z
第一导线层 conductor layer No.1 CzlG#?kU?2
圆形盘 round pad x_3B) &9
方形盘 square pad .5\@G b.8
菱形盘 diamond pad >a975R*g
长方形焊盘 oblong pad #H6YI3
`G
子弹形盘 bullet pad 3FvVM0l"
泪滴盘 teardrop pad ,=e.QAF!"
雪人盘 snowman pad {+lU 4u
形盘 V-shaped pad V 4rDVCXE
环形盘 annular pad Tv#d>ZSD
非圆形盘 non-circular pad ]\rQ{No
隔离盘 isolation pad *$O5.`]
非功能连接盘 monfunctional pad iY>P7Uvvz
偏置连接盘 offset land %oqKpD+
腹(背)裸盘 back-bard land |cd"cx+
盘址 anchoring spaur Yz;7g8HI
连接盘图形 land pattern !n;3jAl&$
连接盘网格阵列 land grid array &B5&:ib1D
孔环 annular ring /SJ><
元件孔 component hole B9,39rG/7+
安装孔 mounting hole fTpG>*{p
支撑孔 supported hole '`;=d<'
非支撑孔 unsupported hole COsy.$|4
导通孔 via </kuJh\
镀通孔 plated through hole (PTH) nP[Z6h
余隙孔 access hole 0xZ^ f}@L
盲孔 blind via (hole) 8d$|JN;)
埋孔 buried via hole :^W}$7$T
埋,盲孔 buried blind via T
9`AL
任意层内部导通孔 any layer inner via hole z4
=OR@ h
全部钻孔 all drilled hole &IXmy-w
定位孔 toaling hole xq.kH| bH
无连接盘孔 landless hole n><ad*|MX
中间孔 interstitial hole gaC4u,Zb
无连接盘导通孔 landless via hole tQG'f*4
引导孔 pilot hole <b'*GBw$
端接全隙孔 terminal clearomee hole T}{zh
准尺寸孔 dimensioned hole [Page] <}RD]Sc$1
在连接盘中导通孔 via-in-pad aoz+T h3
孔位 hole location +@uA
孔密度 hole density 4RctYMz
孔图 hole pattern <r <{4\%}
钻孔图 drill drawing ..Dm@m}
装配图assembly drawing 13 h,V]ak
参考基准 datum referan #9s)f R
1) 元件设备 -J=6)
i`52tH y_
三绕组变压器:three-column transformer ThrClnTrans u ]y[g
双绕组变压器:double-column transformer DblClmnTrans )n"0:"Ou
电容器:Capacitor h<M1q1)
并联电容器:shunt capacitor ,){#J"W
电抗器:Reactor @H$8;CRM
母线:Busbar M._E$y,5
输电线:TransmissionLine Q_p&~ PNy5
发电厂:power plant v6DjNyg<x
断路器:Breaker x~uDCbL
刀闸(隔离开关):Isolator O*/%zr
分接头:tap $aEv*{$y
电动机:motor G11KAq(
(2) 状态参数 U:99w
x] `F#5j
有功:active power L8n?F#q
无功:reactive power cQxUEY('+
电流:current G>:v1lde
容量:capacity &\ca ? #
电压:voltage prt(xr4@
档位:tap position <V}q8k
有功损耗:reactive loss b00$3,L
无功损耗:active loss zOA~<fhT
功率因数:power-factor }|/A &c
功率:power Y=|20Y\K
功角:power-angle /Z]nV2$n)V
电压等级:voltage grade [z\baL|
空载损耗:no-load loss } D!tB
铁损:iron loss b3_P??yp
铜损:copper loss PX?%}~
v
空载电流:no-load current .|u`s,\
阻抗:impedance \:s%;s51
正序阻抗:positive sequence impedance LEjq<t1&
负序阻抗:negative sequence impedance |AE{rvP{@
零序阻抗:zero sequence impedance x6JV@wA&
电阻:resistor l'Za"TL:
电抗:reactance |15!D
电导:conductance I)#8}[vK
电纳:susceptance GK-P6d
无功负载:reactive load 或者QLoad Z'9 |
有功负载: active load PLoad {HM[ )t0
遥测:YC(telemetering) \tvL<U"'
遥信:YX M]k Q{(
励磁电流(转子电流):magnetizing current !oXFDC3k
定子:stator >`&2]Wc)
功角:power-angle rZ+4kf6S
上限:upper limit Nz3+yxv1
下限:lower limit #>KiX84
并列的:apposable 2 <OU)rVE4
高压: high voltage a+J>
低压:low voltage Hmm0H6&u
中压:middle voltage 4x-,l1NMR
电力系统 power system n6,YA2yZO
发电机 generator @,= pG
励磁 excitation ]!!?gnPd5
励磁器 excitor (y?F8]TfM
电压 voltage -0q|AB<
电流 current 68bvbig
母线 bus 7neJV
变压器 transformer 4yqYs>
升压变压器 step-up transformer
*p9)5
高压侧 high side zOMxg00
输电系统 power transmission system ><IWF#kUA
输电线 transmission line /'.gZo
固定串联电容补偿fixed series capacitor compensation SXl~lYUL
稳定 stability Q3=5q w^
电压稳定 voltage stability S-\wX.`R1
功角稳定 angle stability -Wmb
M]Z
暂态稳定 transient stability re%XaL
电厂 power plant #6#n4`%ER
能量输送 power transfer SX'NFdY
交流 AC R#ZJLT
装机容量 installed capacity ]D5Maid+
电网 power system 3)CIqN
落点 drop point }&7kT7ogO
开关站 switch station F~E)w5?\O
双回同杆并架 double-circuit lines on the same tower }OnU32P
变电站 transformer substation 6J JA"] `
补偿度 degree of compensation uUHWTyoO
高抗 high voltage shunt reactor ??B!UXi4R
无功补偿 reactive power compensation ,)d`_AD+5
故障 fault DFZ@q=ZT
调节 regulation (ot56`,k
裕度 magin z]%@r 7
三相故障 three phase fault =,ax"C?pR
故障切除时间 fault clearing time kk<%VKC
极限切除时间 critical clearing time :epB:r
切机 generator triping RJ0,7E<B
高顶值 high limited value q[P> s{"
强行励磁 reinforced excitation wTR?8$
线路补偿器 LDC(line drop compensation) PCgr`($U
机端 generator terminal 52#
*{q}
静态 static (state) IMdp"
动态 dynamic (state) G6>sAOf
单机无穷大系统 one machine - infinity bus system r8*xp\/
机端电压控制 AVR Z>3~n
电抗 reactance 0Qeda@J
电阻 resistance (DvGA I
功角 power angle FdnLxw
有功(功率) active power @V^.eVM\R
无功(功率) reactive power M Tl
@#M
功率因数 power factor a9^})By&
无功电流 reactive current Z|UVH
下降特性 droop characteristics 6=JJ!`"<2
斜率 slope "#0P*3-c
额定 rating \pK&gdw
变比 ratio G.XxlI}
参考值 reference value
7|dm"%@
电压互感器 PT k
75 p
分接头 tap 6?US<<MQ
下降率 droop rate 3K~^H1l
仿真分析 simulation analysis r^"sZk#
传递函数 transfer function pcOi%D,o
框图 block diagram
&``nD
受端 receive-side 2w1Mf<IXPo
裕度 margin B3[X{n$px
同步 synchronization T$r/XAs
失去同步 loss of synchronization B&59c*K
阻尼 damping 'CqAjlj
摇摆 swing RDQ]_wsyKG
保护断路器 circuit breaker Dn#5H{D-d
电阻:resistance XZ$g~r
电抗:reactance Xu_1r8-|=b
阻抗:impedance .*YOyK3H
电导:conductance g9g ]X
电纳:susceptance