1 backplane 背板 gwOa$f%O
2 Band gap voltage reference 带隙电压参考 -l`f)0{
3 benchtop supply 工作台电源 YNLV9.P6
4 Block Diagram 方块图 5 Bode Plot 波特图 J@^8ko
6 Bootstrap 自举 R{WE\T '
7 Bottom FET Bottom FET qOe+ZAJ{%N
8 bucket capcitor 桶形电容 E.r>7`E
9 chassis 机架 1_o],?Q
10 Combi-sense Combi-sense :9O#ObFR
11 constant current source 恒流源 gi(H]|=a
12 Core Sataration 铁芯饱和 O;z,qo X
13 crossover frequency 交叉频率 M=%l}FSTw(
14 current ripple 纹波电流 '[U8}z3
15 Cycle by Cycle 逐周期 j K!Au
16 cycle skipping 周期跳步 bHPYp5UwN
17 Dead Time 死区时间 = 6tHsN23
18 DIE Temperature 核心温度 G,$PV
e*
19 Disable 非使能,无效,禁用,关断 !Nu<xq@!
20 dominant pole 主极点 NV)!7~r}:
21 Enable 使能,有效,启用 ~"!]
3C,L
22 ESD Rating ESD额定值 RS"H8P4W
23 Evaluation Board 评估板 0@yXi
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ?i)f^O
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 }E+!91't.^
25 Failling edge 下降沿 qHsUP;7
26 figure of merit 品质因数 Ager$uC
27 float charge voltage 浮充电压 6o
|kIBte-
28 flyback power stage 反驰式功率级 Y&[1`:-~-
29 forward voltage drop 前向压降 +1Vjw'P
30 free-running 自由运行 @x9a?L.48
31 Freewheel diode 续流二极管 6BY-^"W5`
32 Full load 满负载 33 gate drive 栅极驱动 nA?`BOe(
34 gate drive stage 栅极驱动级 3Vsc 9B"w
35 gerber plot Gerber 图 l\BVS)
36 ground plane 接地层 G %N
$C
37 Henry 电感单位:亨利 m$`RcwO
38 Human Body Model 人体模式 Jpj}@,
39 Hysteresis 滞回 YCdS!&^UN
40 inrush current 涌入电流 _]04lGx27
41 Inverting 反相 /|r^W\DV&x
42 jittery 抖动 BS /G("oZ[
43 Junction 结点 \qR7mI/*
44 Kelvin connection 开尔文连接 oE<`VY|
45 Lead Frame 引脚框架 vh"R'o
46 Lead Free 无铅 ]p*l%(dhY
47 level-shift 电平移动 +~'865 {
48 Line regulation 电源调整率 cmBB[pk\
49 load regulation 负载调整率 w ihH?~]
50 Lot Number 批号 ~Cl){8o
51 Low Dropout 低压差 `kOD[*
52 Miller 密勒 53 node 节点 lwHzj&/ ~
54 Non-Inverting 非反相 P#pn*L*"T
55 novel 新颖的 rE iKi
56 off state 关断状态 #?5 (o
57 Operating supply voltage 电源工作电压 WF2}-NU"
58 out drive stage 输出驱动级 <!L>Exh&r
59 Out of Phase 异相 0FGe=$vD
60 Part Number 产品型号 l-K9LTd
61 pass transistor pass transistor "XB[|#&
62 P-channel MOSFET P沟道MOSFET _Bj)r}~7#
63 Phase margin 相位裕度 SLO%7%>p
64 Phase Node 开关节点 q:l>O5
65 portable electronics 便携式电子设备 aki_RG>U'
66 power down 掉电 `%CtWJ(e
67 Power Good 电源正常 :Nu^
68 Power Groud 功率地 MA;1;uI,
69 Power Save Mode 节电模式 Q&MZN);.
70 Power up 上电 >^%7@i:@U
71 pull down 下拉 ^9^WuSq
72 pull up 上拉 I*LknU@
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Tg!i%v(-t
74 push pull converter 推挽转换器 ([
jF4/
75 ramp down 斜降 :/y1yM
76 ramp up 斜升 +cIUGFp}
77 redundant diode 冗余二极管 kdCUORMK
78 resistive divider 电阻分压器 %T X@I$Ba
79 ringing 振 铃 =jSb'Vu|
80 ripple current 纹波电流 =.y~f A!
81 rising edge 上升沿 xB_!>SqF1U
82 sense resistor 检测电阻 UQ'\7OS
83 Sequenced Power Supplys 序列电源 $P>`m$(8
84 shoot-through 直通,同时导通 zV:pQRbt.
85 stray inductances. 杂散电感 EPS={w$'s
86 sub-circuit 子电路 N*%@
87 substrate 基板 (EK"V';
88 Telecom 电信 ld3-C55
89 Thermal Information 热性能信息 $"0M U
90 thermal slug 散热片 Ae69>bkE0
91 Threshold 阈值 W- i&sUgy
92 timing resistor 振荡电阻 q2. XoCf
93 Top FET Top FET Mzsfo;kk+
94 Trace 线路,走线,引线 f:ZAG4B
95 Transfer function 传递函数 ELBa}h;
96 Trip Point 跳变点 ;FBUwR}
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) hfnN@Kg?B}
98 Under Voltage Lock Out (UVLO) 欠压锁定 '6Ay&A3N]
99 Voltage Reference 电压参考 SxdE?uCUS
100 voltage-second product 伏秒积 "
Om[~-31
101 zero-pole frequency compensation 零极点频率补偿 .%.9n\b
102 beat frequency 拍频 /TZOJE(2j
103 one shots 单击电路 T_sTC)&a
104 scaling 缩放 .jS~By|r
105 ESR 等效串联电阻 [Page] ^\\Tx*#i
106 Ground 地电位 V+Cwzc^j
107 trimmed bandgap 平衡带隙 ZN!4;
108 dropout voltage 压差 H,+I2tEs
109 large bulk capacitance 大容量电容 XEn*?.e
110 circuit breaker 断路器 I?"q/Ub~h
111 charge pump 电荷泵 z74in8]
112 overshoot 过冲 !,[C]Q1
>y.%xK
印制电路printed circuit &07]LF$]
印制线路 printed wiring 0GB:GBhZ
印制板 printed board Xv<B1
印制板电路 printed circuit board *GxTX3i}vc
印制线路板 printed wiring board g0>,%b
印制元件 printed component j6>.n49_
印制接点 printed contact r`AuvwHPs[
印制板装配 printed board assembly q6_u@:3u
板 board 5WC+guK7
刚性印制板 rigid printed board rFaF
Bd
挠性印制电路 flexible printed circuit Eq$&qV-?(
挠性印制线路 flexible printed wiring =
QQ5f5\l
齐平印制板 flush printed board `!Ds6
金属芯印制板 metal core printed board LEW'G"+
金属基印制板 metal base printed board _@
*+~9%8p
多重布线印制板 mulit-wiring printed board ;3\3q1oX
塑电路板 molded circuit board u}!@ ,/)
散线印制板 discrete wiring board si&S%4(
微线印制板 micro wire board Zm=(+
f
积层印制板 buile-up printed board OR}c)|1
表面层合电路板 surface laminar circuit )\6&12rj
埋入凸块连印制板 B2it printed board #{k|I$
载芯片板 chip on board cgl*t+o&
埋电阻板 buried resistance board A81ls#is
母板 mother board #<e\QE'!
子板 daughter board i/~1F_
背板 backplane `}BF${vF
裸板 bare board oI}kH=<,
键盘板夹心板 copper-invar-copper board U
f|>
(C
动态挠性板 dynamic flex board jy giG&H
静态挠性板 static flex board {?J/c{=/P
可断拼板 break-away planel SfJ./ny
电缆 cable w3=%*<
挠性扁平电缆 flexible flat cable (FFC) /e]'u&a
薄膜开关 membrane switch ?;vgUO
混合电路 hybrid circuit YqPQ%
厚膜 thick film )RO<o O
厚膜电路 thick film circuit qduWzxB
薄膜 thin film K'X2dG*
薄膜混合电路 thin film hybrid circuit taFn![}/!g
互连 interconnection :JfE QIN
导线 conductor trace line 9G{;?c
齐平导线 flush conductor _~q?_'kx
传输线 transmission line % ]I ZLJ
跨交 crossover rS4@1`/R
板边插头 edge-board contact .&9 i
增强板 stiffener PH>
b-n
基底 substrate '@jXbN
基板面 real estate H ,+?
t
导线面 conductor side Wx~k&[&E
元件面 component side ;5tazBy&:C
焊接面 solder side cs1l~bl
导电图形 conductive pattern +T=(6dr
非导电图形 non-conductive pattern 7\f\!e <
基材 base material d'/TdVM
层压板 laminate 5v?;PX
覆金属箔基材 metal-clad bade material c>/.
;p
覆铜箔层压板 copper-clad laminate (CCL) Pb8^ b
复合层压板 composite laminate q^A+<d
薄层压板 thin laminate 'Hi:
2Wh
基体材料 basis material Ya;9]k8,
预浸材料 prepreg H}H7lO
粘结片 bonding sheet d3W0-INL
预浸粘结片 preimpregnated bonding sheer iJZ/jCI
环氧玻璃基板 epoxy glass substrate n Ps7c %
预制内层覆箔板 mass lamination panel )ZBY* lk9
内层芯板 core material E\IlF 6
粘结层 bonding layer H(Q.a=&4!p
粘结膜 film adhesive -jn WZ5.
无支撑胶粘剂膜 unsupported adhesive film OM|Fwr$
覆盖层 cover layer (cover lay) F29va
增强板材 stiffener material 'yV?*a
铜箔面 copper-clad surface -0_d/'d
去铜箔面 foil removal surface K
=wBpLB
层压板面 unclad laminate surface sf]s",t~J
基膜面 base film surface c\ia6[3sX
胶粘剂面 adhesive faec hSK;V<$[Z
原始光洁面 plate finish mk3_
粗面 matt finish ' j6gG
剪切板 cut to size panel _:X|.W
超薄型层压板 ultra thin laminate *J+_|_0nlW
A阶树脂 A-stage resin u~3%bJ]
B阶树脂 B-stage resin z81esXl
C阶树脂 C-stage resin {q<03d~9|G
环氧树脂 epoxy resin A8q;q 2
酚醛树脂 phenolic resin m85WA
#
`
聚酯树脂 polyester resin B%KG3]
聚酰亚胺树脂 polyimide resin QT9n,lX
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Dk+&X-]6x5
丙烯酸树脂 acrylic resin kl"+YF5/
三聚氰胺甲醛树脂 melamine formaldehyde resin Qb!PRCHQ
多官能环氧树脂 polyfunctional epoxy resin !q-f9E4`
溴化环氧树脂 brominated epoxy resin gqR)IVk>%
环氧酚醛 epoxy novolac 2_ :n
氟树脂 fluroresin eeHP&1= 7
硅树脂 silicone resin yA)(*PFz
硅烷 silane >yXN,5d[
聚合物 polymer
.AYj'Y
无定形聚合物 amorphous polymer qim
'dp:
结晶现象 crystalline polamer =1P6Vk
双晶现象 dimorphism dB+N\HBY
共聚物 copolymer kPQtQh]y%
合成树脂 synthetic Yp0/Ab(v
热固性树脂 thermosetting resin [Page] d/}SAvtt
热塑性树脂 thermoplastic resin u7xDau(c
感光性树脂 photosensitive resin <BSc* 9Q
环氧值 epoxy value ]uspx[UIc
双氰胺 dicyandiamide gtYAHi
粘结剂 binder n39t}`WIl
胶粘剂 adesive ltkI}h,e
固化剂 curing agent ;SwMu@tg
阻燃剂 flame retardant X*Z8CM_
遮光剂 opaquer 4O:W#bx
增塑剂 plasticizers ~V/?H!r'{}
不饱和聚酯 unsatuiated polyester t6BHGX{o
聚酯薄膜 polyester <" @zn
聚酰亚胺薄膜 polyimide film (PI) H"Klj_<dH0
聚四氟乙烯 polytetrafluoetylene (PTFE) lc_E!"1
增强材料 reinforcing material W5^.-B,(K
折痕 crease fK&e7j`qO
云织 waviness {QbvR*gv
鱼眼 fish eye Iyd?|f"
毛圈长 feather length '+
xu#R
厚薄段 mark x!_<z''
裂缝 split NxVw!TsR
捻度 twist of yarn 7 Sa1;%R
浸润剂含量 size content N$xtHtz8"
浸润剂残留量 size residue 'TTUN=y
处理剂含量 finish level }<PxWZ`,\
偶联剂 couplint agent ^1Xt]T`e
断裂长 breaking length R.LL#u};
吸水高度 height of capillary rise px SX#S6I
湿强度保留率 wet strength retention 84i_k
白度 whitenness v`V7OD#:j]
导电箔 conductive foil ?0_7?yTR/
铜箔 copper foil eUl/o1~mXa
压延铜箔 rolled copper foil n6(i`{i
光面 shiny side JlKM+UE:
粗糙面 matte side
@HBEt^!
处理面 treated side M0|'f'
防锈处理 stain proofing 5j0{p$'9
双面处理铜箔 double treated foil /H:I 68~
模拟 simulation jKZt~I
逻辑模拟 logic simulation f'q 28lVf
电路模拟 circit simulation xyH/e*a
时序模拟 timing simulation q8:{Nk
模块化 modularization mp~{W
设计原点 design origin 'cNKjL;
优化(设计) optimization (design) cL8#S>>u.
供设计优化坐标轴 predominant axis wh:1PP
表格原点 table origin j#0j)k2Q
元件安置 component positioning 8h<ehNX ^I
比例因子 scaling factor OzT#1T1'c
扫描填充 scan filling ;NV'W]
矩形填充 rectangle filling O[9-:,B{w
填充域 region filling :Vg}V"QR
实体设计 physical design x90jw$\%7
逻辑设计 logic design d7cg&9+
逻辑电路 logic circuit _{jP;W
层次设计 hierarchical design 'SLE;_TD
自顶向下设计 top-down design M }0eu(_|
自底向上设计 bottom-up design uhV0J97
费用矩阵 cost metrix nK3k]gLc{
元件密度 component density :)jJge&^p
自由度 degrees freedom $jI>[%
出度 out going degree _,6f#t
入度 incoming degree Ufo>|A6;$
曼哈顿距离 manhatton distance BpO9As 1um
欧几里德距离 euclidean distance kC$&:\Rh
网络 network w:o-klKXY
阵列 array # x>g a
段 segment +:6Ii9GN
逻辑 logic iA!7E;o
逻辑设计自动化 logic design automation E)ugLluL
分线 separated time kllQca|$4
分层 separated layer 'f/Lv@]a
定顺序 definite sequence ql5x2n
导线(通道) conduction (track) W[NEe,.>
导线(体)宽度 conductor width +TeFt5[)h
导线距离 conductor spacing gLL-VvJ[
导线层 conductor layer iy\KzoB
导线宽度/间距 conductor line/space kE;O7sN
第一导线层 conductor layer No.1 ovf/;Q/}
圆形盘 round pad LF*Q!
方形盘 square pad pz_e =xr
菱形盘 diamond pad 1xnLB>jP#
长方形焊盘 oblong pad v|
z08\a[
子弹形盘 bullet pad SC#sax4N!=
泪滴盘 teardrop pad (}!C4S3#
雪人盘 snowman pad +rNkN:/L
形盘 V-shaped pad V OySy6IN]q
环形盘 annular pad #
Oup^ o@
非圆形盘 non-circular pad HTz+K6&
隔离盘 isolation pad Mo|wME#M
非功能连接盘 monfunctional pad TUp%FJXA|
偏置连接盘 offset land Cd#E"dY6
腹(背)裸盘 back-bard land qH%")7>
盘址 anchoring spaur 7N2\8kP
连接盘图形 land pattern w#G2-?aj
连接盘网格阵列 land grid array Aj"7q
孔环 annular ring 0?bA$y
元件孔 component hole KSs 1CF'i
安装孔 mounting hole 8{&["?
支撑孔 supported hole H5wb_yBQ+
非支撑孔 unsupported hole `?s.\Dh
导通孔 via 7CvD'QW /
镀通孔 plated through hole (PTH) c"gsB!xh
余隙孔 access hole _JGs}aQ
盲孔 blind via (hole) sDiHXDI_m
埋孔 buried via hole 1H4fJ3-
埋,盲孔 buried blind via cep$_Ja
任意层内部导通孔 any layer inner via hole c^I0y!
全部钻孔 all drilled hole ?Z %:
定位孔 toaling hole +p:Y=>bTj
无连接盘孔 landless hole c5i%(!>
中间孔 interstitial hole S0@T0y#
无连接盘导通孔 landless via hole )3?rXsSR
引导孔 pilot hole "/%89 HMD
端接全隙孔 terminal clearomee hole ;\b@)E}
准尺寸孔 dimensioned hole [Page] *FgJ|y6gk
在连接盘中导通孔 via-in-pad XYbyOM VI
孔位 hole location 5vZ#b\;#V
孔密度 hole density mv
Ov<x;l
孔图 hole pattern {E,SHh
钻孔图 drill drawing BD;H
装配图assembly drawing E)YVfM
参考基准 datum referan SX+RBVZU
1) 元件设备 #V 43=
E'dX)J9e$/
三绕组变压器:three-column transformer ThrClnTrans (6xDu.u?A
双绕组变压器:double-column transformer DblClmnTrans :\}U9QfCw
电容器:Capacitor L`K;IV%;
并联电容器:shunt capacitor Ky9W/dCR
电抗器:Reactor
C B}BQd
母线:Busbar T |"`8mG
输电线:TransmissionLine {sc[RRN~C
发电厂:power plant ubGs/Vzye
断路器:Breaker aw$Y`6,S
刀闸(隔离开关):Isolator -}<g-*m"q
分接头:tap f]_mzF=&
电动机:motor fD6GQ*
(2) 状态参数 ;) pl{_
jUY+3"?
有功:active power @phN|;?
无功:reactive power 9Q[>.):
电流:current ?JqjYI{$
容量:capacity Ph)|j&]
电压:voltage }: #dV
B+
档位:tap position nxRwWj57
有功损耗:reactive loss !t-K<'
无功损耗:active loss P/aDd@j
功率因数:power-factor %8D?$v"#Z
功率:power <aVfJd/fT
功角:power-angle #<#%>Y^
电压等级:voltage grade 6"%qv`.Fp
空载损耗:no-load loss P4%>k6X
铁损:iron loss LZV}U*
铜损:copper loss J:};n@<
空载电流:no-load current d.\PS9l
阻抗:impedance f)Y
正序阻抗:positive sequence impedance qX@9N=g`#O
负序阻抗:negative sequence impedance 1ih* gJPpj
零序阻抗:zero sequence impedance BJIQ
zn3
电阻:resistor IK?]PmN4}
电抗:reactance Zz")`hUG
电导:conductance $^$ECDOTB
电纳:susceptance uC[d% v`
无功负载:reactive load 或者QLoad )F
E8D
有功负载: active load PLoad #WEq-0L
遥测:YC(telemetering) FfXZ|o$;
遥信:YX oc;VIK)g]c
励磁电流(转子电流):magnetizing current [Yvsa,2
定子:stator UPO^V:.R4
功角:power-angle X%`KYo%
上限:upper limit ewQe/Fq
下限:lower limit [d:@1yc
并列的:apposable b7v dk
高压: high voltage %BICt @E
低压:low voltage "WP% REE!
中压:middle voltage y< ud('D
电力系统 power system >)sqh ~P
发电机 generator A;t
zRe
励磁 excitation ,RN|d0dE
励磁器 excitor T/Q==Q{W:
电压 voltage L]>4Nd
电流 current 3{q[q#"
母线 bus <?4cWp|i
变压器 transformer AA.Ys89V
升压变压器 step-up transformer ^Fvr
f`A'
高压侧 high side $kv[iI@
输电系统 power transmission system TU-c9"7M~
输电线 transmission line x_|>n<Z
固定串联电容补偿fixed series capacitor compensation ITQ9(W
Un
稳定 stability FK3Whe{KP{
电压稳定 voltage stability xXPUrv5zO
功角稳定 angle stability Zly-\z_
暂态稳定 transient stability ,5:![
电厂 power plant |Cq8%
能量输送 power transfer oB}K[3uB:t
交流 AC '2xcce#
装机容量 installed capacity 4JSZ0:O
电网 power system &/DOO ^
落点 drop point R(GmU4
开关站 switch station k%!VP=c4s
双回同杆并架 double-circuit lines on the same tower \N yr=<c
变电站 transformer substation .xo_}Vw
补偿度 degree of compensation soxfk+
9
高抗 high voltage shunt reactor pMDH
无功补偿 reactive power compensation r8F{A6i N
故障 fault 9PCa*,
调节 regulation ik1XGFy?
裕度 magin e@yx}:]h
三相故障 three phase fault sU0Stg8&b
故障切除时间 fault clearing time {9Xm<}%u]]
极限切除时间 critical clearing time MyqiBGTb
切机 generator triping iA&oLu[y3
高顶值 high limited value !^]q0x
强行励磁 reinforced excitation /t$*W\PL@
线路补偿器 LDC(line drop compensation) q$|0)}
机端 generator terminal wn{]#n=|l
静态 static (state) J+0/ :00(
动态 dynamic (state) EZ*t$3.T
单机无穷大系统 one machine - infinity bus system /[6:LnaE
机端电压控制 AVR h&q=I.3O|?
电抗 reactance K:uQ#W.&
电阻 resistance Yu1QcFuy
功角 power angle 7x%S](m%
有功(功率) active power XnPJC'
无功(功率) reactive power t(wZiK}
功率因数 power factor 7
TmK
无功电流 reactive current -ywX5B
下降特性 droop characteristics cB_pyX9Z
斜率 slope ~K_ ]N/ >
额定 rating XRtyC4f
变比 ratio gj[zka0_
参考值 reference value pmoGudaRF
电压互感器 PT g(KK9Unu
分接头 tap nrI"k2oA@
下降率 droop rate Y'2-yB
仿真分析 simulation analysis
!,Qm
传递函数 transfer function KUlB2Fqi
框图 block diagram j/~VP2R`
受端 receive-side N/(ofy
裕度 margin g%+ql[(4
同步 synchronization y9=t;qH@|
失去同步 loss of synchronization AL(n*,
阻尼 damping <=$rU232}
摇摆 swing ix(U:'{
保护断路器 circuit breaker 'lxLnX
电阻:resistance ~Ry
$>n*/
电抗:reactance .mC~Ry+t
阻抗:impedance ~wa%fM
电导:conductance -hQ96S8
电纳:susceptance