1 backplane 背板 gq"k<C0
2 Band gap voltage reference 带隙电压参考 L&-hXGx=7
3 benchtop supply 工作台电源 |xoF49
4 Block Diagram 方块图 5 Bode Plot 波特图 WS2osBc
6 Bootstrap 自举 O g%U
7 Bottom FET Bottom FET =N);v\ Q$!
8 bucket capcitor 桶形电容 !TAp+b
9 chassis 机架
@>x pYV
10 Combi-sense Combi-sense NDO\B,7
11 constant current source 恒流源 I =Wc&1g
12 Core Sataration 铁芯饱和 OTB$V k
13 crossover frequency 交叉频率 a4gi,pz$]
14 current ripple 纹波电流 ( #Z`
15 Cycle by Cycle 逐周期 $ XBAZ<"hd
16 cycle skipping 周期跳步 7{oe ->r
17 Dead Time 死区时间 E^ hHH?w+
18 DIE Temperature 核心温度 sP'0Sl~NU
19 Disable 非使能,无效,禁用,关断 r,(et
20 dominant pole 主极点 +]:2\TTGI
21 Enable 使能,有效,启用 WqrgRpM{
22 ESD Rating ESD额定值 zVv04_:
23 Evaluation Board 评估板 5~XN>>hp
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. JM.XH7k
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 .w6eJ4]
25 Failling edge 下降沿 *pzq.#
26 figure of merit 品质因数 E3/:.t
27 float charge voltage 浮充电压 d h^^G^
28 flyback power stage 反驰式功率级 kJs^ z
29 forward voltage drop 前向压降 lo&#(L+2
30 free-running 自由运行 =wi*Nd7L
31 Freewheel diode 续流二极管 |r RG=tG_'
32 Full load 满负载 33 gate drive 栅极驱动 T:asm1BC[
34 gate drive stage 栅极驱动级 \nrP$
35 gerber plot Gerber 图 c:M$m3Cs?
36 ground plane 接地层 IO.<q,pP!_
37 Henry 电感单位:亨利 3b[jwCt
38 Human Body Model 人体模式 ~<qt%W?
39 Hysteresis 滞回 _DPOyR2
40 inrush current 涌入电流 e yw'7
41 Inverting 反相 m:Go-tk
42 jittery 抖动 '_+9y5
43 Junction 结点 ts9pM~_~
44 Kelvin connection 开尔文连接 O';ew)tI
45 Lead Frame 引脚框架 IF
k
46 Lead Free 无铅 *j)M]
47 level-shift 电平移动 ;eB ~H[S/
48 Line regulation 电源调整率 }UyQ# U
49 load regulation 负载调整率 b 1^n KB
50 Lot Number 批号 Y\/gU8w/
51 Low Dropout 低压差 ?T:
jk4+
52 Miller 密勒 53 node 节点 -[#n+`M
54 Non-Inverting 非反相 1ywU@].6J]
55 novel 新颖的 u~ F;xQ
56 off state 关断状态 WNa0,
57 Operating supply voltage 电源工作电压 s0LA^2U
58 out drive stage 输出驱动级 T*q"N?/4
59 Out of Phase 异相 iT)WR90
60 Part Number 产品型号 _EYB
8e
61 pass transistor pass transistor IvBGpT"(I
62 P-channel MOSFET P沟道MOSFET V`a+Hi<P\
63 Phase margin 相位裕度 73NZ:h%=
64 Phase Node 开关节点 @O3/3vi1
65 portable electronics 便携式电子设备 0^ !Gib
66 power down 掉电 nZvU'k:
67 Power Good 电源正常 f_r0})
68 Power Groud 功率地 T.?k>Ak
69 Power Save Mode 节电模式 .5tg4%l
70 Power up 上电 ?p8Qx\%*
71 pull down 下拉 @6xGJ,s
72 pull up 上拉 &&RA4
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) KHj6Tg;)
74 push pull converter 推挽转换器 ~\_T5/I%
75 ramp down 斜降 2g`[u|
76 ramp up 斜升 )BV=|,j
77 redundant diode 冗余二极管 $@[)nvV\
78 resistive divider 电阻分压器 r:l96^xs
79 ringing 振 铃 pz}mF D&[
80 ripple current 纹波电流 pVokgUrC
81 rising edge 上升沿 s^C;>
82 sense resistor 检测电阻 saK;[&I*
83 Sequenced Power Supplys 序列电源 ;lfWuU%R
84 shoot-through 直通,同时导通 !ng\`
|8?
85 stray inductances. 杂散电感 @5Qoi~o
86 sub-circuit 子电路 w6,*9(;$Pk
87 substrate 基板 B\<ydN
88 Telecom 电信 /mbCP>bcG
89 Thermal Information 热性能信息 LF=c^9t
90 thermal slug 散热片 xUj2]Q>R+
91 Threshold 阈值 %jKH?%Ih
92 timing resistor 振荡电阻 W%8+t)
93 Top FET Top FET [yd6gH
94 Trace 线路,走线,引线 &6"P7X
95 Transfer function 传递函数 a&5g!;.
96 Trip Point 跳变点 dK# h<q1
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) OlcP(
98 Under Voltage Lock Out (UVLO) 欠压锁定 i:Mc(mW
99 Voltage Reference 电压参考 9/;{>RL=
100 voltage-second product 伏秒积 1i,4".h?M
101 zero-pole frequency compensation 零极点频率补偿 @\!!t{y
102 beat frequency 拍频 jU$Y>S>l
103 one shots 单击电路 k:0P+d
104 scaling 缩放 O)5#Fcp(
105 ESR 等效串联电阻 [Page] [
-12]3
106 Ground 地电位 xii$e
107 trimmed bandgap 平衡带隙 i[=C_+2
108 dropout voltage 压差 <d!6[,W;
109 large bulk capacitance 大容量电容 hAa[[%wPhU
110 circuit breaker 断路器 4I ,o&TK
111 charge pump 电荷泵 (t74a E pi
112 overshoot 过冲 uX0
Bp8P
[:pl-_.C
印制电路printed circuit ,kE=TR.|
印制线路 printed wiring \dNhzd#
印制板 printed board h]}`@M"
印制板电路 printed circuit board q!2<=:f
印制线路板 printed wiring board YX `%A6
印制元件 printed component C9Wojo.
印制接点 printed contact %MNk4UsV
印制板装配 printed board assembly RUc \u93n
板 board TolrEcI
刚性印制板 rigid printed board <UK5eVQn
挠性印制电路 flexible printed circuit w{P6i<J
挠性印制线路 flexible printed wiring Y UZKle
齐平印制板 flush printed board \*9Ua/H
金属芯印制板 metal core printed board &<{}8/x8(
金属基印制板 metal base printed board =+(Q.LmhC
多重布线印制板 mulit-wiring printed board XW:%vJu^`
塑电路板 molded circuit board -7L
散线印制板 discrete wiring board '_E c_F
微线印制板 micro wire board 0%;MVMH
积层印制板 buile-up printed board C,='3^Nc
表面层合电路板 surface laminar circuit M\jB)@)
埋入凸块连印制板 B2it printed board ]j1
vbk
载芯片板 chip on board K Dz]wNf
埋电阻板 buried resistance board D?J#u;h~f
母板 mother board !3?~#e{_
子板 daughter board ;r=?BbND?
背板 backplane M%;"c?g
裸板 bare board >gGil|I
键盘板夹心板 copper-invar-copper board cS
4T\{B;
动态挠性板 dynamic flex board Nc"NObe
静态挠性板 static flex board 1!s!wQgS
可断拼板 break-away planel @|]G0&gn&?
电缆 cable Xiw@
挠性扁平电缆 flexible flat cable (FFC) G)4SWu0<t
薄膜开关 membrane switch `
Rsl]
GB
混合电路 hybrid circuit tKX}Ok:V%
厚膜 thick film s!i:0} U
厚膜电路 thick film circuit ]
EV`dIk
薄膜 thin film U~hCn+0
薄膜混合电路 thin film hybrid circuit lkN'uZ
互连 interconnection [DL|Ht>
导线 conductor trace line `M6YblnJZ
齐平导线 flush conductor PgTDjEo
传输线 transmission line n8Q*
_?Z/
跨交 crossover m/KjJ"s,
板边插头 edge-board contact _Z0\`kba+
增强板 stiffener 'me:Zd
基底 substrate {[N?+ZJD*L
基板面 real estate |thad!?
导线面 conductor side a6P!Wzb
元件面 component side " C&x,Ic
焊接面 solder side $oc9
|Q 7
导电图形 conductive pattern BZ}`4W'
非导电图形 non-conductive pattern tz3]le|ml
基材 base material ;i}i5yv2
层压板 laminate <(Tiazg
覆金属箔基材 metal-clad bade material D|"sE>
覆铜箔层压板 copper-clad laminate (CCL) &6Ns7w6*z
复合层压板 composite laminate S>(z\`1qm
薄层压板 thin laminate 5W|u5AIw
基体材料 basis material d~3GV(M
预浸材料 prepreg wJ/~q)
粘结片 bonding sheet <TL])@da
预浸粘结片 preimpregnated bonding sheer 2S'AIuIew
环氧玻璃基板 epoxy glass substrate 8KZ$F>T]>
预制内层覆箔板 mass lamination panel y>%W;r)
内层芯板 core material ]u~Os<
粘结层 bonding layer 0}6QO
粘结膜 film adhesive .:T9pplq
无支撑胶粘剂膜 unsupported adhesive film R2SBhs,+R
覆盖层 cover layer (cover lay) 8b{U
tT
增强板材 stiffener material hl*MUD,
铜箔面 copper-clad surface M&eQ=vew.
去铜箔面 foil removal surface f>p; siR)
层压板面 unclad laminate surface {a[Uv
基膜面 base film surface icU"Vyu
胶粘剂面 adhesive faec QZ#3Bn%B5
原始光洁面 plate finish w<btv]X1
粗面 matt finish LPb]mC6#
剪切板 cut to size panel ,!jR:nApE
超薄型层压板 ultra thin laminate JThk Wx
A阶树脂 A-stage resin Pu1GCr(
B阶树脂 B-stage resin )_X;9%L7
C阶树脂 C-stage resin
4$..r4@
环氧树脂 epoxy resin >\Z lZ
酚醛树脂 phenolic resin G,+xT}@wu
聚酯树脂 polyester resin is64)2F](
聚酰亚胺树脂 polyimide resin $U\!q@'$
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin "sdcP8])d
丙烯酸树脂 acrylic resin nR(#F 9
三聚氰胺甲醛树脂 melamine formaldehyde resin @wg&6uQ
多官能环氧树脂 polyfunctional epoxy resin 5T7_[{
溴化环氧树脂 brominated epoxy resin |:~("rA+v
环氧酚醛 epoxy novolac unx;m$-c
氟树脂 fluroresin PY[Sz=[
硅树脂 silicone resin 2=i+L z^
硅烷 silane U+:S7z@j?
聚合物 polymer Pw0{.W~r
无定形聚合物 amorphous polymer <{3q{VW*
结晶现象 crystalline polamer =c
:lS&B
双晶现象 dimorphism ?psOj%
共聚物 copolymer K!pxDW}
合成树脂 synthetic ?IL!
X-xx
热固性树脂 thermosetting resin [Page] y.L|rRe@P
热塑性树脂 thermoplastic resin @hE7r-}]
感光性树脂 photosensitive resin B)_!F`9
环氧值 epoxy value Pc/.*kOT
双氰胺 dicyandiamide &f
(sfM_n
粘结剂 binder N )b|
胶粘剂 adesive
\r:m({G
固化剂 curing agent A}az
m>
阻燃剂 flame retardant k#{lt-a/
遮光剂 opaquer fx8y`8}_
增塑剂 plasticizers X; e`y:9
不饱和聚酯 unsatuiated polyester 1^n5CI|7u
聚酯薄膜 polyester JS<e`#c&
聚酰亚胺薄膜 polyimide film (PI) "~.8eKRQ
聚四氟乙烯 polytetrafluoetylene (PTFE) \c5#\1<
增强材料 reinforcing material )Mm;9UA
折痕 crease r*~n`
云织 waviness (ouRf;\6$8
鱼眼 fish eye a!s.850@
毛圈长 feather length GQEI f$
厚薄段 mark RZcx4fL}x
裂缝 split O c^6u
捻度 twist of yarn %fexuy4
浸润剂含量 size content ]%vGC^
浸润剂残留量 size residue ')Dp%"\?
处理剂含量 finish level p*(U*8Q
偶联剂 couplint agent D}k-2RM2k
断裂长 breaking length .:#_5K
吸水高度 height of capillary rise s[vPH8qb
湿强度保留率 wet strength retention W(]E04
白度 whitenness RE(=! 8lGR
导电箔 conductive foil B.C H9M
铜箔 copper foil |wyJh"4!
压延铜箔 rolled copper foil hi4h0\L!}
光面 shiny side "4Wp>B
粗糙面 matte side 7g4M/?H}K
处理面 treated side UIm[DYMS
防锈处理 stain proofing xPn'yo
双面处理铜箔 double treated foil Lk8W&|;0|
模拟 simulation hPEp0("
逻辑模拟 logic simulation YI? C-,
电路模拟 circit simulation x):k#cu[L
时序模拟 timing simulation ?-RoqF
模块化 modularization 8VAYIxRv
设计原点 design origin c"QkE*
优化(设计) optimization (design) X+'^Sp
供设计优化坐标轴 predominant axis /z.7:<gZ(
表格原点 table origin :!Y?j{sGU
元件安置 component positioning JYVxdvq1
比例因子 scaling factor %Mb(
c+7
扫描填充 scan filling F'Y2f6B
矩形填充 rectangle filling eD`
,
填充域 region filling f3%^-Uy*b
实体设计 physical design u]>>B>KOJ7
逻辑设计 logic design :DJ7d
逻辑电路 logic circuit 9$\;voo
层次设计 hierarchical design Ndug9j\2
自顶向下设计 top-down design [iO$ c]!H
自底向上设计 bottom-up design XYxm8ee"j
费用矩阵 cost metrix #$vhC u<I
元件密度 component density HIWmh4o/.
自由度 degrees freedom kS\.
出度 out going degree |)72E[lL
入度 incoming degree 7S~9E2N
曼哈顿距离 manhatton distance DS,FVh".|
欧几里德距离 euclidean distance DESViQM
网络 network D-b2E6o6
阵列 array 5shu76
段 segment A 4W
逻辑 logic ~QEXB*X-g'
逻辑设计自动化 logic design automation nTlv'_Y(
分线 separated time z
kX-"}$8
分层 separated layer 'Kso@St`o
定顺序 definite sequence &Lt$a_y>
导线(通道) conduction (track) U<,Kw6K
导线(体)宽度 conductor width wMPw/a;
导线距离 conductor spacing tMPXvE
导线层 conductor layer ,;=( )-
导线宽度/间距 conductor line/space 7)(`
第一导线层 conductor layer No.1 :C:N]6_{SZ
圆形盘 round pad $ DZQdhv
方形盘 square pad 1J{z}yPHc
菱形盘 diamond pad F#}1{$)%
/
长方形焊盘 oblong pad eE riv@v
子弹形盘 bullet pad %[\Ft
泪滴盘 teardrop pad Wru
Fp
雪人盘 snowman pad gHh.|PysW
形盘 V-shaped pad V &6^W%r
环形盘 annular pad Dy{`">a
非圆形盘 non-circular pad Uh|__DUkh
隔离盘 isolation pad )`+@j.75
非功能连接盘 monfunctional pad 8$<AxNR
偏置连接盘 offset land >K|G LP
腹(背)裸盘 back-bard land 7U[L\1zS
盘址 anchoring spaur h3d\MYO)B
连接盘图形 land pattern noUZ9M|hz
连接盘网格阵列 land grid array +S5_J&~
孔环 annular ring a6k(O8Ank3
元件孔 component hole 9X{nJ"
安装孔 mounting hole X-N$+[#
支撑孔 supported hole Rn~Xu)@e
非支撑孔 unsupported hole ?'/5%f`
导通孔 via G>ptwB81KM
镀通孔 plated through hole (PTH) h^_taAdS`
余隙孔 access hole if!`Qid
盲孔 blind via (hole) gUszMhHX
埋孔 buried via hole JJHvj=9'o
埋,盲孔 buried blind via {|J2clL
任意层内部导通孔 any layer inner via hole GWqY$YT
全部钻孔 all drilled hole `i)ePiE
定位孔 toaling hole wh m tEY
无连接盘孔 landless hole g\{! 21M
中间孔 interstitial hole b`W'M:$
无连接盘导通孔 landless via hole 'iISbOM
引导孔 pilot hole CygV_q
端接全隙孔 terminal clearomee hole -J7,Nw
准尺寸孔 dimensioned hole [Page] .SV3<)
在连接盘中导通孔 via-in-pad HFx"fT
孔位 hole location AB&wn>q
孔密度 hole density !4,xQ^
孔图 hole pattern o`8+#+@f7
钻孔图 drill drawing )4_6\VaM
装配图assembly drawing _t;VE06Xjs
参考基准 datum referan 'kg]|"M
1) 元件设备 #Xw[i
kq.h\[
三绕组变压器:three-column transformer ThrClnTrans ^\kHEM|5v
双绕组变压器:double-column transformer DblClmnTrans -%V-'X5
电容器:Capacitor OZ14-}Lr5
并联电容器:shunt capacitor *;yMD-=
电抗器:Reactor ODvpMt:+
母线:Busbar $~@096`QL<
输电线:TransmissionLine >Wit"p
发电厂:power plant p>tdJjnt
断路器:Breaker Ww
tQ>'R"
刀闸(隔离开关):Isolator hG;=ci3EE
分接头:tap @bCiaBdi
电动机:motor ZUJOBjb`
K
(2) 状态参数 UG'U
D"
H'\ EA(v+
有功:active power LP-Q'vb<=
无功:reactive power <.(/#=2
电流:current J$/BH\
容量:capacity :aqskeT
电压:voltage UR2)e{RXg
档位:tap position %e<dV\x?T
有功损耗:reactive loss Ry S{@=si
无功损耗:active loss ]bE?n.NwZ
功率因数:power-factor 7c]Ai
功率:power MVd
3*
功角:power-angle to|9)\
电压等级:voltage grade h}&IlDG
空载损耗:no-load loss >@Vr'kg+V
铁损:iron loss Dj.+5f'
铜损:copper loss XK-x*|
空载电流:no-load current T<?BIQz(}
阻抗:impedance 7<o;3gR7Kj
正序阻抗:positive sequence impedance vGHYB1=~
负序阻抗:negative sequence impedance DMN H?6
零序阻抗:zero sequence impedance >D4Ez
电阻:resistor X@q1;J
电抗:reactance >b?)WNk
电导:conductance P}QbxkS 8
电纳:susceptance X3O$Sd(D
无功负载:reactive load 或者QLoad SY)$2RC+}
有功负载: active load PLoad pDq_nx9
遥测:YC(telemetering) y+afUJT
遥信:YX i O|,,;_
励磁电流(转子电流):magnetizing current PSR`8z n
定子:stator +M&S
功角:power-angle oz-I/g3go
上限:upper limit O~'yP@&`
下限:lower limit ;O|63
并列的:apposable ,6Q-k4_
高压: high voltage yP4.Z9
低压:low voltage K61os&K
中压:middle voltage %{abRBny
电力系统 power system 4F6o
发电机 generator =T}uQ$X
励磁 excitation QXj(Urp
励磁器 excitor i4rF~'h@
电压 voltage 7zZ|=W?&{
电流 current RcP5].^T
母线 bus P$Ru NF
变压器 transformer |UO;StF
升压变压器 step-up transformer 7e[\0:Z
高压侧 high side n`Iy7X
输电系统 power transmission system h18y?e7MU
输电线 transmission line tgA
|Vwwk
固定串联电容补偿fixed series capacitor compensation 3~xOO*`o
稳定 stability :ygz/L
电压稳定 voltage stability "]Td^Nxi
功角稳定 angle stability ?}
tQaj
暂态稳定 transient stability 7"i*J6y*
电厂 power plant 9'h^59
能量输送 power transfer Asu"#sd
交流 AC 5K~6`
装机容量 installed capacity :K:gyVrC
电网 power system )6+W6:
落点 drop point L]<4{8H.
开关站 switch station rapca'
双回同杆并架 double-circuit lines on the same tower s9Z2EjQV
变电站 transformer substation #K w\r50
补偿度 degree of compensation 5VbNWrw
高抗 high voltage shunt reactor ]t;5kj/
无功补偿 reactive power compensation qDb}b d5
故障 fault uK5x[m
调节 regulation Mwc3@
裕度 magin ?='9YM
三相故障 three phase fault BG=_i#V
故障切除时间 fault clearing time LWV`xCr8R
极限切除时间 critical clearing time nTKfwIeg5
切机 generator triping ,$-PC=Ti(
高顶值 high limited value -1JHhRr]
强行励磁 reinforced excitation |Wk
G='02
线路补偿器 LDC(line drop compensation) hGV/P94
机端 generator terminal +(%[f W
静态 static (state) ;D:T
^4
动态 dynamic (state) _s8_i6 Y
单机无穷大系统 one machine - infinity bus system
?~IZ{!
机端电压控制 AVR M7 !"
t
电抗 reactance UXHFti/A<
电阻 resistance Shz;)0To
功角 power angle sKO
;p
有功(功率) active power e,8-P-h~T
无功(功率) reactive power Q,`kfxA`O
功率因数 power factor Q@n k T1o
无功电流 reactive current dZmq
下降特性 droop characteristics q3`t0eLZ
斜率 slope oVW?d]R
额定 rating lV'83
变比 ratio y{JkY\g
参考值 reference value ]XU#i#;c
电压互感器 PT to7)gOX(
分接头 tap Xk'.t|
下降率 droop rate =C|^C
仿真分析 simulation analysis JB<4m4-
传递函数 transfer function G\%hT5^
框图 block diagram
N=9lA0y+
受端 receive-side h6/Z_Y
裕度 margin J?'!8,RX
同步 synchronization UhK,H
失去同步 loss of synchronization cqudF=q
阻尼 damping 2|BE{91
摇摆 swing
sa* -B
保护断路器 circuit breaker tO7{g
电阻:resistance rej[G!
电抗:reactance uE(w$2Wi
阻抗:impedance )
|vFrR
电导:conductance A_%w(7o"
电纳:susceptance