1 backplane 背板 #Ob]]!y
2 Band gap voltage reference 带隙电压参考 #G;X' BN
3 benchtop supply 工作台电源 9K"JYJ
q2
4 Block Diagram 方块图 5 Bode Plot 波特图 fC<m^%*zgA
6 Bootstrap 自举 Fwfo2
7 Bottom FET Bottom FET v[ ,Src
8 bucket capcitor 桶形电容 trYTs,KV
9 chassis 机架 yI8tH!
10 Combi-sense Combi-sense W{Q)-y
11 constant current source 恒流源 _j ;3-m
12 Core Sataration 铁芯饱和 v,1F--v
13 crossover frequency 交叉频率 /9 hR
14 current ripple 纹波电流 zK5bO=0j
15 Cycle by Cycle 逐周期 f`P9ku#j}
16 cycle skipping 周期跳步 C7qYiSv
17 Dead Time 死区时间 YD_]!HK}
18 DIE Temperature 核心温度 D<):ZfUbI
19 Disable 非使能,无效,禁用,关断 By((,QpB
20 dominant pole 主极点 >L>+2z
21 Enable 使能,有效,启用 ;#QhQx
22 ESD Rating ESD额定值 zVaCXNcbo
23 Evaluation Board 评估板 RUXCq`)"<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. T@48 qg
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 _<Dt
z
25 Failling edge 下降沿 ?d-70pm
26 figure of merit 品质因数 "yh Pm
27 float charge voltage 浮充电压 F[E?A95W
28 flyback power stage 反驰式功率级 ><Z'D
29 forward voltage drop 前向压降 J=}F2C
30 free-running 自由运行 ?0vNEz[
31 Freewheel diode 续流二极管 fE25(wCz7
32 Full load 满负载 33 gate drive 栅极驱动 }T(z4P3
34 gate drive stage 栅极驱动级 SG'JE}jzO
35 gerber plot Gerber 图 ])T/sO#'
36 ground plane 接地层 V2 `>
]/|
37 Henry 电感单位:亨利 bBE+jqi2
38 Human Body Model 人体模式 []p"3i
39 Hysteresis 滞回 w~@[r4W
40 inrush current 涌入电流 `gguip-C
41 Inverting 反相 XAD3Z?
42 jittery 抖动 WZ~> BM
43 Junction 结点 OyVm(%Z
44 Kelvin connection 开尔文连接 P Jo
45 Lead Frame 引脚框架 kC$I2[ t!
46 Lead Free 无铅 Ft-6m%
47 level-shift 电平移动 km 5E)_]
48 Line regulation 电源调整率 Q7a(P
49 load regulation 负载调整率 oXGZK5w<l
50 Lot Number 批号 'mV:@].le
51 Low Dropout 低压差 6
=>G#
52 Miller 密勒 53 node 节点 ]VjLKFb~U
54 Non-Inverting 非反相 c> ~:dcy
55 novel 新颖的 dWpk='
56 off state 关断状态 d"&3Q_2CD
57 Operating supply voltage 电源工作电压 uxDLDA$;
58 out drive stage 输出驱动级 E(Gr0#8
59 Out of Phase 异相 5~}!@yzc
60 Part Number 产品型号 )I9aC~eAD
61 pass transistor pass transistor 0m=(W^c
62 P-channel MOSFET P沟道MOSFET u,9q<&,
63 Phase margin 相位裕度 qgexb\x\4
64 Phase Node 开关节点 nCaLdj?
65 portable electronics 便携式电子设备 }$aNOf%:
66 power down 掉电 "c
Pz|~
67 Power Good 电源正常 CeW7Ym
68 Power Groud 功率地 KH}t:m+h
69 Power Save Mode 节电模式 !S,pRS+
70 Power up 上电 _*`q(dYcf
71 pull down 下拉 GOr}/y;
72 pull up 上拉 9d\N[[Vu]R
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) gWu"91Y0>
74 push pull converter 推挽转换器 cU | _
75 ramp down 斜降
8 +(c 1
76 ramp up 斜升 ETelbj;0
77 redundant diode 冗余二极管 t)(v4^T
78 resistive divider 电阻分压器 Q8Te'1Ln!
79 ringing 振 铃 3B#!2|
80 ripple current 纹波电流 RV92qn
B
81 rising edge 上升沿 l<N?' &
82 sense resistor 检测电阻 [V5-%w^
83 Sequenced Power Supplys 序列电源 gKQ@!UU8
84 shoot-through 直通,同时导通 z7q%,yw3N
85 stray inductances. 杂散电感 :?#cDyW)
86 sub-circuit 子电路 gA+YtU{z
87 substrate 基板 m X:bA5db
88 Telecom 电信 Sip_~]hM
89 Thermal Information 热性能信息 t>oM%/H
90 thermal slug 散热片 {6tx,; r(F
91 Threshold 阈值 ca}S{"
92 timing resistor 振荡电阻 ~UW{)]_jox
93 Top FET Top FET Tw}z7U"
94 Trace 线路,走线,引线 .~,^u
95 Transfer function 传递函数 g&
>mP?
96 Trip Point 跳变点 GfNWP
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) opnkmM&[
98 Under Voltage Lock Out (UVLO) 欠压锁定 n|Ma&qs
99 Voltage Reference 电压参考 ee\Gl?VN
100 voltage-second product 伏秒积 $68 XZCx
101 zero-pole frequency compensation 零极点频率补偿 Esa6hU#
102 beat frequency 拍频 ] - h|]
103 one shots 单击电路 44|03Ty
104 scaling 缩放 +1f{_v
105 ESR 等效串联电阻 [Page] 4^BLSK~(
106 Ground 地电位 _!;\R7]
107 trimmed bandgap 平衡带隙 {4)5]62>u
108 dropout voltage 压差 J\GKqt;5@
109 large bulk capacitance 大容量电容 >rRjm+vg
110 circuit breaker 断路器 NIL^UN}
111 charge pump 电荷泵 N$*>suQ,
112 overshoot 过冲 T/Ez*iQW
v6(,Ax&
印制电路printed circuit cWc$yE'
印制线路 printed wiring [$H( CH`
印制板 printed board rZ 6@b
印制板电路 printed circuit board a6 * Y%?
印制线路板 printed wiring board h!~|6nj
印制元件 printed component `F@f?*s:
印制接点 printed contact roL]v\tr
印制板装配 printed board assembly Z%A<#%
板 board ua!D-0
刚性印制板 rigid printed board 7TR'zW2W
挠性印制电路 flexible printed circuit k0=|10bi
挠性印制线路 flexible printed wiring B1HQz@^
齐平印制板 flush printed board )/
n29]
金属芯印制板 metal core printed board +-",2d+g
金属基印制板 metal base printed board =b|)Wnt2f
多重布线印制板 mulit-wiring printed board 0L
7@2|a0
塑电路板 molded circuit board 7dsnv)(v
散线印制板 discrete wiring board RNl\`>Cz
微线印制板 micro wire board _4!7
zW^
积层印制板 buile-up printed board &<#/&Pq/i
表面层合电路板 surface laminar circuit Ho:}Bn
g
埋入凸块连印制板 B2it printed board E^'C" 6
载芯片板 chip on board ` 3vN R"
埋电阻板 buried resistance board *%z<P~}
母板 mother board J>/Ci\OB
子板 daughter board !~Ax
背板 backplane zl,bMtQ
裸板 bare board |ORmS&7
键盘板夹心板 copper-invar-copper board he_HVRpB
动态挠性板 dynamic flex board 8rnb
静态挠性板 static flex board ysQEJm^|-u
可断拼板 break-away planel
zd.1
电缆 cable wV]sGHu F}
挠性扁平电缆 flexible flat cable (FFC) ~mHXz
薄膜开关 membrane switch B6^w{eXN
混合电路 hybrid circuit \E>%W
厚膜 thick film q^Q|.&_k /
厚膜电路 thick film circuit 4Q&Xb <
薄膜 thin film cob9hj#&7
薄膜混合电路 thin film hybrid circuit Z5{*? 2
互连 interconnection eimA *0Cq
导线 conductor trace line ?Aj\1y4L1
齐平导线 flush conductor O1l4gduN|i
传输线 transmission line ,dGFX]P
跨交 crossover =<Zwv\U
板边插头 edge-board contact ghE?8&@ iq
增强板 stiffener 4Xa.r6T_N=
基底 substrate 1gf/#+$\
基板面 real estate 4Ub?*
导线面 conductor side !W(/Y9g#
元件面 component side &h_d|8
焊接面 solder side #S/pYP`7
导电图形 conductive pattern [)T$91
6I
非导电图形 non-conductive pattern dn:|m^<)
基材 base material IIYX|;1}X
层压板 laminate P\ Pc/[
Z7
覆金属箔基材 metal-clad bade material 3D[:Rf[
覆铜箔层压板 copper-clad laminate (CCL) <yX@@8
复合层压板 composite laminate A`+(VzZgJ
薄层压板 thin laminate UU;Ysj
基体材料 basis material '_Hb}'sFI
预浸材料 prepreg |hZ|+7
粘结片 bonding sheet eB} sg4
预浸粘结片 preimpregnated bonding sheer f@,hO5h(_|
环氧玻璃基板 epoxy glass substrate 61t-
预制内层覆箔板 mass lamination panel * wQZ'
内层芯板 core material .q~,.yI&j
粘结层 bonding layer Yg]FF`{p=
粘结膜 film adhesive ;
HR\R
无支撑胶粘剂膜 unsupported adhesive film s%0[DO3NV
覆盖层 cover layer (cover lay) K!$\REs
增强板材 stiffener material o} bj!h]N
铜箔面 copper-clad surface &?uzJx~
去铜箔面 foil removal surface ?45K%;.9Q
层压板面 unclad laminate surface 7,&3=R<
基膜面 base film surface gFH;bZU
胶粘剂面 adhesive faec oPC IlH
原始光洁面 plate finish 0t/z"
粗面 matt finish @EH4N%fH
剪切板 cut to size panel 'J&@jp
超薄型层压板 ultra thin laminate 1^Y:XJ73
A阶树脂 A-stage resin Z_hBd['!
B阶树脂 B-stage resin fmT3Afl5c
C阶树脂 C-stage resin <_FF~lj
环氧树脂 epoxy resin
^.><t+tM
酚醛树脂 phenolic resin Yg:74; .
聚酯树脂 polyester resin BLYk
<m
聚酰亚胺树脂 polyimide resin d/-0B<ts
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin FB^dp}
丙烯酸树脂 acrylic resin ?!Th-Cc&m
三聚氰胺甲醛树脂 melamine formaldehyde resin h&^/, G
多官能环氧树脂 polyfunctional epoxy resin ?\/dfK:!
溴化环氧树脂 brominated epoxy resin 3GuMiht5
环氧酚醛 epoxy novolac G~mB=]
氟树脂 fluroresin u9y-zhj_$
硅树脂 silicone resin dwsy(g7
硅烷 silane +{l3#Y
聚合物 polymer |Jx2"0:M
无定形聚合物 amorphous polymer [^"(%{H
结晶现象 crystalline polamer z2EI"'4\9
双晶现象 dimorphism (B?xq1Q
共聚物 copolymer Fr Q-v]c
合成树脂 synthetic e]L3=R;
热固性树脂 thermosetting resin [Page] pC?1gc1G
热塑性树脂 thermoplastic resin PrYWha=c-
感光性树脂 photosensitive resin hG0lR.:
环氧值 epoxy value JOoLHZQ1v
双氰胺 dicyandiamide
.ubbNp_LU
粘结剂 binder My43\p
胶粘剂 adesive <@;xV_`X+
固化剂 curing agent n46PQm%p
阻燃剂 flame retardant (>@syF%PB
遮光剂 opaquer Z ysUz
增塑剂 plasticizers 2ShlYW@~
不饱和聚酯 unsatuiated polyester :."n@sA@
聚酯薄膜 polyester H9a3rA>
聚酰亚胺薄膜 polyimide film (PI) nm%4L
聚四氟乙烯 polytetrafluoetylene (PTFE) uEi.nSp)S
增强材料 reinforcing material t1_y1!uQ
折痕 crease '_yk_[/
云织 waviness +^% &8<
鱼眼 fish eye (H|d 3
毛圈长 feather length uu46'aT
厚薄段 mark T>:g
ME
裂缝 split `[HoxCV3o
捻度 twist of yarn t2%bHIG}
浸润剂含量 size content /3:IE%o
浸润剂残留量 size residue K d|l\k!
处理剂含量 finish level "u$]q1S
偶联剂 couplint agent e+[J[<8
断裂长 breaking length mDt",#g
吸水高度 height of capillary rise Fl|&eO,e
湿强度保留率 wet strength retention j$ i8@]
白度 whitenness 7-0twq
导电箔 conductive foil -,CndRKx
铜箔 copper foil Jj _+YfIM
压延铜箔 rolled copper foil L08;z
光面 shiny side ,i((;/O6
粗糙面 matte side >IydXmTy
处理面 treated side ,%DAh
防锈处理 stain proofing Q~8&pP8I!
双面处理铜箔 double treated foil %!/liS
模拟 simulation ]KPg=@Q/
逻辑模拟 logic simulation O5n]4)<
电路模拟 circit simulation b(rBha|
时序模拟 timing simulation ^
cd5Zl
模块化 modularization yDBgSO{d
设计原点 design origin !urd
$Ta
优化(设计) optimization (design) F$.s6Hh.
供设计优化坐标轴 predominant axis Ku,A}5-6
表格原点 table origin Q
X5#$-H@
元件安置 component positioning rQ-z2Pw
比例因子 scaling factor o_+Qer=O6
扫描填充 scan filling gJfL$S'w
矩形填充 rectangle filling 38S&7>0@|q
填充域 region filling J_br%AG<p
实体设计 physical design 5v-;*
逻辑设计 logic design BGYm]b\j[
逻辑电路 logic circuit >qGR^yvb
层次设计 hierarchical design 5oy MR_yl
自顶向下设计 top-down design 7^e}|l
自底向上设计 bottom-up design #)eJz1~
费用矩阵 cost metrix (ZR"O8
元件密度 component density rnr8t]
自由度 degrees freedom e<wj5:M|
出度 out going degree *LQY6=H
入度 incoming degree |>V>6%>vK6
曼哈顿距离 manhatton distance 4 sgwQ$m)
欧几里德距离 euclidean distance o5A_j?t
网络 network D`ge3f8Wi
阵列 array
2Ab#uPBn
段 segment I*ni )Px
逻辑 logic xE[tD? M{
逻辑设计自动化 logic design automation {Ag}P0%'
分线 separated time ~ab_+%
分层 separated layer e-av@a3
定顺序 definite sequence SJr:
导线(通道) conduction (track) -H;y_^2
导线(体)宽度 conductor width _NW OSt
导线距离 conductor spacing f__WnW5h
导线层 conductor layer 6?x{-Zj^?
导线宽度/间距 conductor line/space *N+aZV}`Z
第一导线层 conductor layer No.1 S.4YC>E
圆形盘 round pad uk/+
i`=
方形盘 square pad >mltE$|
菱形盘 diamond pad <plR<iI.
长方形焊盘 oblong pad =KD*+.'\/
子弹形盘 bullet pad (6^k;j
泪滴盘 teardrop pad -$ft `Ih
雪人盘 snowman pad zQ_[wM-
形盘 V-shaped pad V \+A<s,x
环形盘 annular pad G{Q'N04RA
非圆形盘 non-circular pad v%Q7 \X(
隔离盘 isolation pad `3n*4Lz
非功能连接盘 monfunctional pad ZEJadR
偏置连接盘 offset land 8H b|'Q|^
腹(背)裸盘 back-bard land .ai9PsZ?V
盘址 anchoring spaur x)5v8kgf
连接盘图形 land pattern PFw"ICs
连接盘网格阵列 land grid array j06oAer 9
孔环 annular ring <\mc|p"
元件孔 component hole .AW*7Pp`f
安装孔 mounting hole :_zKUv]
支撑孔 supported hole M.Ik%nN#K0
非支撑孔 unsupported hole :.Sc[UI0
导通孔 via g3 rFJc
镀通孔 plated through hole (PTH) {`zF{AW8q
余隙孔 access hole *xC '
盲孔 blind via (hole) o$k$
埋孔 buried via hole %Q~Lk]B?t
埋,盲孔 buried blind via #4u; `j"4=
任意层内部导通孔 any layer inner via hole }(''|z#UE
全部钻孔 all drilled hole (RS:_]
定位孔 toaling hole A6L}5#7-
无连接盘孔 landless hole ?O?~|nI
中间孔 interstitial hole z\5Nni/~6D
无连接盘导通孔 landless via hole zl?N1>KS
引导孔 pilot hole ]f~YeOB@
端接全隙孔 terminal clearomee hole l$KcS&{w9
准尺寸孔 dimensioned hole [Page] KJfyh=AD(
在连接盘中导通孔 via-in-pad %"2B1^o>
孔位 hole location <k5~z(
孔密度 hole density t_Wn<)XA
孔图 hole pattern X_F= ;XF/
钻孔图 drill drawing #
GGmA.
装配图assembly drawing [\yI<^_a
参考基准 datum referan Hd`RR3J
1) 元件设备 U s5JnP 5
AK =k@hT
三绕组变压器:three-column transformer ThrClnTrans Nb1lawC
双绕组变压器:double-column transformer DblClmnTrans uBgHtjmae
电容器:Capacitor )Cl&"bX
并联电容器:shunt capacitor Of=z!|l2
电抗器:Reactor ZP<X#]$qb
母线:Busbar {IvCe0`
输电线:TransmissionLine Wg1WY}zG
发电厂:power plant op C11c/
断路器:Breaker NM Ajt>t
刀闸(隔离开关):Isolator '=@x2`U/
分接头:tap 9E+lriyY
电动机:motor Vi_|m?E
(2) 状态参数 @Q!j7I
L)5nb-qp
有功:active power ~^*tIIOX
无功:reactive power AtOB'=ph*
电流:current 2<|5zF
容量:capacity `39U I7
电压:voltage _HQa3wj
档位:tap position ]Y?$[+Y
有功损耗:reactive loss (I5ra_FVs
无功损耗:active loss @\R)k(F
功率因数:power-factor 5UbVg
功率:power qC&<U
功角:power-angle {UN z UaE
电压等级:voltage grade 5\J;EWTU
空载损耗:no-load loss 0&x)5^lG
铁损:iron loss Cu]X&l
铜损:copper loss +!(hd
空载电流:no-load current 7d*<'k]{,
阻抗:impedance Yy}aQF#M
正序阻抗:positive sequence impedance $j/F7.S
负序阻抗:negative sequence impedance GZw<Y+/V"5
零序阻抗:zero sequence impedance ))N^)HR
电阻:resistor [% jg;m
电抗:reactance ;ORy&H aKl
电导:conductance K&*FI (a
电纳:susceptance QI-3mqL
无功负载:reactive load 或者QLoad l
O^h)hrR
有功负载: active load PLoad 83a
Rq&(R
遥测:YC(telemetering) b/EvcN8 }
遥信:YX a#1X)ot
励磁电流(转子电流):magnetizing current M: 6cma5
定子:stator \Mi< ROp5
功角:power-angle ^:0?R/A
上限:upper limit 82vx:*Ip!}
下限:lower limit [I9d
并列的:apposable KlPH.R3MPO
高压: high voltage C*9m `xh
低压:low voltage [Dhc9
中压:middle voltage TwN8|ibVmP
电力系统 power system jd{J3s '%
发电机 generator m8?(.BJ%
励磁 excitation b}
*cw2
励磁器 excitor 'K1w.hC<
电压 voltage
Du/s
电流 current 4Zq5
母线 bus -=RXhE_{
变压器 transformer !ZVMx*1Cf
升压变压器 step-up transformer VtVnht1
高压侧 high side NJp;t[v.^
输电系统 power transmission system rcK*",>
输电线 transmission line ZBGI_9wZ
固定串联电容补偿fixed series capacitor compensation <3qbgn>}b
稳定 stability u{ng\d*KE}
电压稳定 voltage stability it,%T)2H
功角稳定 angle stability bk<3oI
暂态稳定 transient stability
_#_Ab8#
电厂 power plant Rq7ks To
能量输送 power transfer +[ F8>9o&
交流 AC QUNsS9
装机容量 installed capacity uxcj3xE#d
电网 power system fTeo,N
落点 drop point rT#QA=YB
开关站 switch station /sai}r1
双回同杆并架 double-circuit lines on the same tower $`
变电站 transformer substation EPI*~=Z.U
补偿度 degree of compensation o+na`ed
高抗 high voltage shunt reactor ";~#epPkX
无功补偿 reactive power compensation }S&{ &gh
故障 fault E.}Zmr#H
调节 regulation g41LpplX
裕度 magin 0,c
z&8
三相故障 three phase fault VltWY'\Wu;
故障切除时间 fault clearing time j@DyWm/7
极限切除时间 critical clearing time >M!>Hl/
切机 generator triping Q6BWax|
高顶值 high limited value >Cf`F{X'U
强行励磁 reinforced excitation \|(;q+n?k
线路补偿器 LDC(line drop compensation) +k>v^sz
机端 generator terminal =4I361oMf
静态 static (state) v/.2Z(sZ
动态 dynamic (state) /b*@dy
单机无穷大系统 one machine - infinity bus system bHP-Z9riv
机端电压控制 AVR _Sg29qFK
电抗 reactance $5A XE;~{
电阻 resistance ?YS`?Rr
功角 power angle BZj[C=#x
有功(功率) active power ]-6 G'i?
无功(功率) reactive power {ys_uS{c*
功率因数 power factor B8PF}Mf
无功电流 reactive current !y),| #7P
下降特性 droop characteristics :K&hGZ+5
斜率 slope h<j04fj
额定 rating FLWz7Rj
变比 ratio eQc!@*:8U
参考值 reference value 3.jwOFH$
电压互感器 PT }bHpFe
分接头 tap d/^^8XUK
下降率 droop rate D(&OyZ~Q+
仿真分析 simulation analysis i2*nYd`K
传递函数 transfer function t.w?OyO
框图 block diagram sJD"u4#y
受端 receive-side ABSeX
裕度 margin Ue%0.G|<W
同步 synchronization sq^,l6es>
失去同步 loss of synchronization Bj2rA.M
阻尼 damping r1\.Jz
摇摆 swing ?SpI^Wn)[
保护断路器 circuit breaker H5 -I}z
电阻:resistance N\0Sq-.
电抗:reactance *be+x RY
阻抗:impedance E|6|m8
电导:conductance jPd<h{js
电纳:susceptance