1 backplane 背板 fl+
[(x<
2 Band gap voltage reference 带隙电压参考 D='/-3f!F]
3 benchtop supply 工作台电源 !^G+@~U
4 Block Diagram 方块图 5 Bode Plot 波特图 }q27M
6 Bootstrap 自举 IN`05 Q
7 Bottom FET Bottom FET lHz:Iibt
8 bucket capcitor 桶形电容 Lj({
T'f(
9 chassis 机架 4d9iAN
10 Combi-sense Combi-sense Qn<J@%
11 constant current source 恒流源 {EZ
;
12 Core Sataration 铁芯饱和 t'0r4&\
13 crossover frequency 交叉频率 Yq<D(F#qx
14 current ripple 纹波电流 :NS;y-{^^y
15 Cycle by Cycle 逐周期 xzIs,i}U
16 cycle skipping 周期跳步 ZK3?"|vhC
17 Dead Time 死区时间 A$fd6+{
18 DIE Temperature 核心温度 LK/gG6n5M0
19 Disable 非使能,无效,禁用,关断 <hQ@]2w$
20 dominant pole 主极点 u|9^tHT>
21 Enable 使能,有效,启用 A
CJmy2
22 ESD Rating ESD额定值 <F>\Vl:
23 Evaluation Board 评估板 $fuFx8`2W
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. |5$9l#e
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 k/!Vv#8
25 Failling edge 下降沿 O)&xT2'J
26 figure of merit 品质因数 eJ$?T7aUf
27 float charge voltage 浮充电压 D@5&xd_@4
28 flyback power stage 反驰式功率级 ~>xn9vb=
29 forward voltage drop 前向压降 W"VN2
30 free-running 自由运行 ks
sXi6^
31 Freewheel diode 续流二极管 >Mrz$
z{x
32 Full load 满负载 33 gate drive 栅极驱动 XC0G5rtB
34 gate drive stage 栅极驱动级 -5kq9Dy\,
35 gerber plot Gerber 图 RYS]b[-xZz
36 ground plane 接地层 fx%'7/+
37 Henry 电感单位:亨利 ,N<;!6e
38 Human Body Model 人体模式 FbWkT4t|
39 Hysteresis 滞回 ZEUd?"gaR
40 inrush current 涌入电流 (al7/EhY
41 Inverting 反相 1:q55!b
42 jittery 抖动 ?2_u/x
43 Junction 结点 {3`#? q^o'
44 Kelvin connection 开尔文连接 SX/yY
45 Lead Frame 引脚框架 w*#TS8
\
46 Lead Free 无铅 (fm\kV
47 level-shift 电平移动 1S0Hc5vw
48 Line regulation 电源调整率 tN";o\!}
49 load regulation 负载调整率 D\N-ye1LE
50 Lot Number 批号 >UWLT;N/W
51 Low Dropout 低压差 PFUb\AY
52 Miller 密勒 53 node 节点 z`>a,X
54 Non-Inverting 非反相 r"Pj,}$A
55 novel 新颖的 2~ Gcoda
56 off state 关断状态 sB-c'`,w`
57 Operating supply voltage 电源工作电压 ;QREwT~H
58 out drive stage 输出驱动级 X\X
59 Out of Phase 异相 {5^'u^E
60 Part Number 产品型号 Nd^9.6,JU
61 pass transistor pass transistor H :d{Sru
62 P-channel MOSFET P沟道MOSFET )'DFDrY
63 Phase margin 相位裕度 3,3{wGvHHW
64 Phase Node 开关节点 CHN!o9f
65 portable electronics 便携式电子设备 N;Hrc6nin^
66 power down 掉电 4h:Oo
67 Power Good 电源正常 H<X4R
68 Power Groud 功率地 hLYSYMUb
69 Power Save Mode 节电模式 ^ylJ_lN&=1
70 Power up 上电 =h5&\4r=
71 pull down 下拉 Wy)|-Q7
72 pull up 上拉 zP
rT0
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) [M@i,d-;A
74 push pull converter 推挽转换器 pWbzBgM?nU
75 ramp down 斜降 UFouIS#L
76 ramp up 斜升 }@SZ!-t%rD
77 redundant diode 冗余二极管 @bfaAh~
78 resistive divider 电阻分压器 \
$X3n\
79 ringing 振 铃 A{y3yH`#h
80 ripple current 纹波电流 XOJ/$y
81 rising edge 上升沿 ItC*[
82 sense resistor 检测电阻 iWGgt]RJ
83 Sequenced Power Supplys 序列电源 JNuo+Pq
84 shoot-through 直通,同时导通 +g7Iu! cA
85 stray inductances. 杂散电感 j)'V_@
86 sub-circuit 子电路 W(~G^Xu
87 substrate 基板 vb{&T<
88 Telecom 电信 $J=9$.4"
89 Thermal Information 热性能信息 HR.S.(t[_
90 thermal slug 散热片 XMa(XOnX
91 Threshold 阈值 oel3H5Nz
92 timing resistor 振荡电阻
|cWW5\/
93 Top FET Top FET <W|{zAyv
94 Trace 线路,走线,引线 *)L%pH>`
95 Transfer function 传递函数 RTH dL
96 Trip Point 跳变点 T>kJB.V:oQ
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) fnL!@WF
98 Under Voltage Lock Out (UVLO) 欠压锁定 K&D
-1u
99 Voltage Reference 电压参考
&,{cm^*
100 voltage-second product 伏秒积 k-b_
<Tbo|
101 zero-pole frequency compensation 零极点频率补偿 _d
A-{
102 beat frequency 拍频 VqVP5nT'=
103 one shots 单击电路 s-*8=
104 scaling 缩放 -
Kj$A@~x
105 ESR 等效串联电阻 [Page] (ai E!c
106 Ground 地电位 )
;-AT^
107 trimmed bandgap 平衡带隙 Vnv<]D
zC
108 dropout voltage 压差 pc^(@eD
109 large bulk capacitance 大容量电容 &>i+2c~
110 circuit breaker 断路器 +@usJkxul
111 charge pump 电荷泵 DK*2d_
112 overshoot 过冲 ]*sXISg1
Ij@YOt
印制电路printed circuit <ynmA
印制线路 printed wiring 76zi)f1f
印制板 printed board .;/@k%>
印制板电路 printed circuit board yY`<t
印制线路板 printed wiring board SZ1+h TY7d
印制元件 printed component 7! <cU
印制接点 printed contact I&Yu=v/_
印制板装配 printed board assembly z=n"cE[KtB
板 board wH{lp/
刚性印制板 rigid printed board O'$0K0k3
挠性印制电路 flexible printed circuit !<((@*zU
挠性印制线路 flexible printed wiring d[-w&[iy
齐平印制板 flush printed board e|"`W`"-
金属芯印制板 metal core printed board )h2wwq0]
金属基印制板 metal base printed board 'S@h._q
多重布线印制板 mulit-wiring printed board M6pGf_qt
塑电路板 molded circuit board l'B`f)
散线印制板 discrete wiring board q:J,xC_sF(
微线印制板 micro wire board j9x}D;?n
积层印制板 buile-up printed board 0qw,R4YK
表面层合电路板 surface laminar circuit 1 /7H` O?
埋入凸块连印制板 B2it printed board *oZBv4Vh
载芯片板 chip on board oxH S7b
埋电阻板 buried resistance board :HMnU37m W
母板 mother board =WFMqBh<`
子板 daughter board wKXKc\r
背板 backplane ran
Q_\
裸板 bare board <CzH'!FJN
键盘板夹心板 copper-invar-copper board 2@uo2]o)
动态挠性板 dynamic flex board gqyQ Zew
静态挠性板 static flex board 9_5Fl,u
z
可断拼板 break-away planel NU I|4X
电缆 cable TP'EdzAT
挠性扁平电缆 flexible flat cable (FFC) xwTN\7f>
薄膜开关 membrane switch !yG{`#NZZ
混合电路 hybrid circuit 3xp%o5K
厚膜 thick film D!TS/J1S;u
厚膜电路 thick film circuit ]\sBl
薄膜 thin film Ia0.I " ,
薄膜混合电路 thin film hybrid circuit GT|=Apnwr%
互连 interconnection MftX~+
导线 conductor trace line efl6U/'Ij
齐平导线 flush conductor +>44'M^Z|(
传输线 transmission line zRL[.O9
跨交 crossover m`I6gnLj
板边插头 edge-board contact J+Q
;'J
增强板 stiffener QVb@/
基底 substrate "'^#I_*Mf
基板面 real estate -9.S?N'T>;
导线面 conductor side q 1Rk'k4+
元件面 component side $*9h\W-)`Q
焊接面 solder side '7u#uL,pa1
导电图形 conductive pattern m9wV#Ldu
非导电图形 non-conductive pattern |Y0BnyGK
基材 base material aq oT
层压板 laminate e~i
?E
覆金属箔基材 metal-clad bade material "
F~uTo
覆铜箔层压板 copper-clad laminate (CCL) vd9l1"S
复合层压板 composite laminate FC.y%P,
薄层压板 thin laminate w2@ `0
基体材料 basis material ~Q0jz/#c
预浸材料 prepreg ^ :6v-
Yx
粘结片 bonding sheet VkRvmKYl
预浸粘结片 preimpregnated bonding sheer UF|v=|*{#
环氧玻璃基板 epoxy glass substrate b_W0tiyv%
预制内层覆箔板 mass lamination panel )?K3nr
内层芯板 core material
Ae<v
粘结层 bonding layer ++5W_Ooep
粘结膜 film adhesive Pi40w+/
无支撑胶粘剂膜 unsupported adhesive film WG1UvPK
覆盖层 cover layer (cover lay) k$i76r
增强板材 stiffener material (TVzYm
y
铜箔面 copper-clad surface y4C_G?
去铜箔面 foil removal surface oz(<e
层压板面 unclad laminate surface wHx1CXC
基膜面 base film surface p*-o33Ve
胶粘剂面 adhesive faec '<^%>R2
原始光洁面 plate finish #hH "g
粗面 matt finish kbI:}b7H
剪切板 cut to size panel 0>)('Kv
超薄型层压板 ultra thin laminate Hh(_sewo
A阶树脂 A-stage resin S5-}u)XnH
B阶树脂 B-stage resin A%"mySW
C阶树脂 C-stage resin z%hB=V!~91
环氧树脂 epoxy resin ]mn(lK
酚醛树脂 phenolic resin Fm#4;'x5E
聚酯树脂 polyester resin pV=X
聚酰亚胺树脂 polyimide resin vAy`8Q
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin #?@k=e\
丙烯酸树脂 acrylic resin zEl@jK,{$
三聚氰胺甲醛树脂 melamine formaldehyde resin QDzFl1\P
多官能环氧树脂 polyfunctional epoxy resin Y 'Yoc
溴化环氧树脂 brominated epoxy resin so9h6K{qcp
环氧酚醛 epoxy novolac :y"Zc1_E
氟树脂 fluroresin ^;Nu\c
硅树脂 silicone resin @-NdgM<
硅烷 silane _W@q %L>
聚合物 polymer S=U*is
无定形聚合物 amorphous polymer u%Hegqn
结晶现象 crystalline polamer 9mEC|(m*WK
双晶现象 dimorphism `$JPF Z
共聚物 copolymer `9(TqcE
合成树脂 synthetic )|x)KY
热固性树脂 thermosetting resin [Page] _ncqd,&z
热塑性树脂 thermoplastic resin &DYHkG
感光性树脂 photosensitive resin J-:\^uP
环氧值 epoxy value Dr^#e
双氰胺 dicyandiamide f[6;)ZA
粘结剂 binder /VgA}[%y
胶粘剂 adesive Xjt/ G):L
固化剂 curing agent ~]*P/'-{#
阻燃剂 flame retardant ?dl7!I@<E<
遮光剂 opaquer (%rO'X
增塑剂 plasticizers :D-My28'
不饱和聚酯 unsatuiated polyester G +o)s
聚酯薄膜 polyester 6wYd)MDLL
聚酰亚胺薄膜 polyimide film (PI) npkE[JE:
聚四氟乙烯 polytetrafluoetylene (PTFE) jqPQ=X
增强材料 reinforcing material GPy+\P`
折痕 crease il(dVW
云织 waviness Q mT L-
鱼眼 fish eye +H,/W_/g
毛圈长 feather length 5}x^0
LY
厚薄段 mark ^w5`YI4<
裂缝 split E?l_*[G
捻度 twist of yarn Qr6[h!
浸润剂含量 size content g""1f%U_p
浸润剂残留量 size residue h2#G
处理剂含量 finish level X-|Lg.s
偶联剂 couplint agent oyZ}JTl(Q
断裂长 breaking length f}PT3
吸水高度 height of capillary rise cT'D2Yeq
湿强度保留率 wet strength retention 8%S5Fc#am
白度 whitenness I'{-T=R-q
导电箔 conductive foil .E-)R
铜箔 copper foil Q&}`( ]k
压延铜箔 rolled copper foil .uG|Vq1v
光面 shiny side ~5<-&Dyp7
粗糙面 matte side y#!8S{
处理面 treated side <t>"b|fW
防锈处理 stain proofing hg_@Ui@[z
双面处理铜箔 double treated foil QCIH1\`jW
模拟 simulation `h*)PitRa
逻辑模拟 logic simulation i1e|UR-wl
电路模拟 circit simulation Lt$LXE
时序模拟 timing simulation ZT:&j4A|0
模块化 modularization *~~ >?
设计原点 design origin I?}YS-2
优化(设计) optimization (design) <)ozbv Xk
供设计优化坐标轴 predominant axis -$WU-7`
表格原点 table origin X-%XZDB6
元件安置 component positioning RoCX*3 d
比例因子 scaling factor Q>]FO
扫描填充 scan filling _yw]Cacr\
矩形填充 rectangle filling l ?RsXC
填充域 region filling dr#g[}l'H
实体设计 physical design Z+!._uA
逻辑设计 logic design zRSIJ!A~
逻辑电路 logic circuit wiKUs0|
层次设计 hierarchical design s{\USD6
自顶向下设计 top-down design 4jMCE&<