1 backplane 背板 |1Dc!V'?"
2 Band gap voltage reference 带隙电压参考 T1B|w"In
3 benchtop supply 工作台电源 e"-X U@`k1
4 Block Diagram 方块图 5 Bode Plot 波特图 +y[@T6_
6 Bootstrap 自举 IC/(R! Crj
7 Bottom FET Bottom FET LCXO>MXN
8 bucket capcitor 桶形电容 )g|
BMmB
9 chassis 机架 ,F+B Wot4
10 Combi-sense Combi-sense 5OM?3M
11 constant current source 恒流源 zHB_{(o7
12 Core Sataration 铁芯饱和 Y izE5[*
13 crossover frequency 交叉频率 c- $Gpa}M
14 current ripple 纹波电流 k1z$e*u&r
15 Cycle by Cycle 逐周期 @
\.;b9
16 cycle skipping 周期跳步 y-?>*fNo
17 Dead Time 死区时间 TL= YQA
18 DIE Temperature 核心温度 sfp,Lq`
19 Disable 非使能,无效,禁用,关断 GYRYbiwqdi
20 dominant pole 主极点 D| I Ec?
21 Enable 使能,有效,启用 i< (s}wg
22 ESD Rating ESD额定值 J.*XXM- V
23 Evaluation Board 评估板 5FvOznK^e
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ${~|+zdB
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 gLD`wfZR
25 Failling edge 下降沿 Qx|H1_6
26 figure of merit 品质因数 CDMfa&;T
27 float charge voltage 浮充电压 ;sdN-mb
28 flyback power stage 反驰式功率级 ,reJ(s
29 forward voltage drop 前向压降 'iSAAwT2aj
30 free-running 自由运行 p?(L'q"WK
31 Freewheel diode 续流二极管 CF
y}r(q
32 Full load 满负载 33 gate drive 栅极驱动 HgBJf~q~U
34 gate drive stage 栅极驱动级 L/}iy}
35 gerber plot Gerber 图 +%J\y^09kr
36 ground plane 接地层 Ob +9W
37 Henry 电感单位:亨利 [um&X=1V8
38 Human Body Model 人体模式 \jW)Xy
39 Hysteresis 滞回 jX=lAs~6
40 inrush current 涌入电流 4C_c\;d
41 Inverting 反相 7D" %%|:
h
42 jittery 抖动 db=$zIB[:
43 Junction 结点 hp!d/X=J_
44 Kelvin connection 开尔文连接 n/e
BE q
45 Lead Frame 引脚框架 v vu<:16
46 Lead Free 无铅 `linG1mF
47 level-shift 电平移动 wjU.W5IR
48 Line regulation 电源调整率 H(u+#PIIw
49 load regulation 负载调整率 Hy;Hs#
50 Lot Number 批号 /4S;QEv
51 Low Dropout 低压差 'E;W
52 Miller 密勒 53 node 节点 ;Kxbg>U
54 Non-Inverting 非反相 i`U:gw
55 novel 新颖的 c|p,/L09L
56 off state 关断状态 uq7T{7~<
57 Operating supply voltage 电源工作电压 ,+/zH'U}
58 out drive stage 输出驱动级 @_'OyRd8
59 Out of Phase 异相 To"dG&h
60 Part Number 产品型号 g9tu%cIkR
61 pass transistor pass transistor Qez SJ
io
62 P-channel MOSFET P沟道MOSFET I %_MV
63 Phase margin 相位裕度 I?Y d
64 Phase Node 开关节点 3*S[eqMJc
65 portable electronics 便携式电子设备 0`hwmDiB"
66 power down 掉电 _uH9XGm
67 Power Good 电源正常 9V!-ZG
68 Power Groud 功率地 a_T,t'6
69 Power Save Mode 节电模式 :Z`4j
70 Power up 上电 iv%w!3#
71 pull down 下拉 -/{af
72 pull up 上拉 )na&"bJ
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) y>o>WN<q
74 push pull converter 推挽转换器 e$l6gY
75 ramp down 斜降 gtU1'p"
76 ramp up 斜升 R"xp%:li
77 redundant diode 冗余二极管 J%v5d*$.
78 resistive divider 电阻分压器 - V) R<
79 ringing 振 铃 [$\>~nj=
80 ripple current 纹波电流 ksI>IW
81 rising edge 上升沿 &~~s6
82 sense resistor 检测电阻 ~t/JCxa
83 Sequenced Power Supplys 序列电源 BA+_C]%ZJ
84 shoot-through 直通,同时导通 3{J.xWB@:
85 stray inductances. 杂散电感 ai ftlY
86 sub-circuit 子电路 /A(NuB<Pq
87 substrate 基板 uDG+SdyN@
88 Telecom 电信 2"/yEg*=
89 Thermal Information 热性能信息 *3Nn +T
90 thermal slug 散热片 rY70^<z
91 Threshold 阈值 2R@%Y/
92 timing resistor 振荡电阻 H^(L90
93 Top FET Top FET F>Jg~ FD*
94 Trace 线路,走线,引线 1kFjas`g
95 Transfer function 传递函数 YdOUv|tZC
96 Trip Point 跳变点 tHI*,
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) D s-`
98 Under Voltage Lock Out (UVLO) 欠压锁定 J/Q|uRpmqr
99 Voltage Reference 电压参考 Z;<ep@gy~
100 voltage-second product 伏秒积 moO_-@i
101 zero-pole frequency compensation 零极点频率补偿 LHi6:G"Y(
102 beat frequency 拍频 !WKk=ysFS
103 one shots 单击电路 *BOBH;s
104 scaling 缩放 h5onRa*7
105 ESR 等效串联电阻 [Page] km>o7V&4G
106 Ground 地电位 ~775soN
107 trimmed bandgap 平衡带隙 0n5UKtB
108 dropout voltage 压差 -V=arm\#z
109 large bulk capacitance 大容量电容 c^S&F9/U*
110 circuit breaker 断路器 ]h@{6N'oNS
111 charge pump 电荷泵 Dd/}Ya(Gi
112 overshoot 过冲 4
X`^{~
JSjYC0e
印制电路printed circuit lgT?{,>RkW
印制线路 printed wiring =lrN'$z?%
印制板 printed board OV|Z=EwJ
印制板电路 printed circuit board 79tJV
印制线路板 printed wiring board E~He~wHWe
印制元件 printed component &&C~@WY,r
印制接点 printed contact "6V_/u5M;=
印制板装配 printed board assembly ay[+2"
板 board w-:
D
刚性印制板 rigid printed board jOl 1_
挠性印制电路 flexible printed circuit 1URsHV!xcM
挠性印制线路 flexible printed wiring 4(m3c<'P
齐平印制板 flush printed board ?UK:sF|(O
金属芯印制板 metal core printed board d| \#?W&
金属基印制板 metal base printed board tc/ jY]'32
多重布线印制板 mulit-wiring printed board nHU3%%%cU
塑电路板 molded circuit board 7SHo%bA
散线印制板 discrete wiring board 7.|S>+Q
微线印制板 micro wire board \UQ],+H
积层印制板 buile-up printed board Qa?QbHc
表面层合电路板 surface laminar circuit tJ>d4A;8x
埋入凸块连印制板 B2it printed board rqC1
载芯片板 chip on board $K=z
埋电阻板 buried resistance board {G.{ad
母板 mother board J~2CD*v
子板 daughter board t^$Div_%G
背板 backplane rxkBg0Z`a
裸板 bare board Na;t#,
键盘板夹心板 copper-invar-copper board =+Tsknq
动态挠性板 dynamic flex board Ja=N@&Z#
静态挠性板 static flex board :wCC^Y]
可断拼板 break-away planel ]}_,U!`8
电缆 cable =0Y'f](2eW
挠性扁平电缆 flexible flat cable (FFC) zf")|9j
薄膜开关 membrane switch +}]wLM}\UF
混合电路 hybrid circuit tQnJS2V"{u
厚膜 thick film Q2R>lzB
厚膜电路 thick film circuit V,'FlU
薄膜 thin film B)d@RAk
薄膜混合电路 thin film hybrid circuit k7[)g]u
互连 interconnection F~P/*FFK
导线 conductor trace line Ko}7$2^
齐平导线 flush conductor { r X5
传输线 transmission line lc-*8eS
跨交 crossover pb=HVjW<
板边插头 edge-board contact <v-92?
增强板 stiffener 'Sk6U]E~
基底 substrate ,dq`EsHg`M
基板面 real estate <sF!]R&4
导线面 conductor side l?N`V2SuR
元件面 component side rr6"Y&v
焊接面 solder side n%Rjt!9
导电图形 conductive pattern ^:$j:w?j
非导电图形 non-conductive pattern n7'<3t
基材 base material -y<rM0"NE
层压板 laminate c'[( d5^|
覆金属箔基材 metal-clad bade material yO%VzjJhg
覆铜箔层压板 copper-clad laminate (CCL) t"FRLC
复合层压板 composite laminate wf^cyCR0
薄层压板 thin laminate EID(M.G
基体材料 basis material ; vhnA$'a
预浸材料 prepreg 0honHP
粘结片 bonding sheet ;+!xZOmm
预浸粘结片 preimpregnated bonding sheer Z 'Zd[."s
环氧玻璃基板 epoxy glass substrate gB'`I(q5.
预制内层覆箔板 mass lamination panel A`
oa|k!U
内层芯板 core material Ez wF`3RjK
粘结层 bonding layer cbY3m Sfn*
粘结膜 film adhesive <4S F~i
无支撑胶粘剂膜 unsupported adhesive film >4Fdxa
覆盖层 cover layer (cover lay) ROcY'-
增强板材 stiffener material ">0 /8] l
铜箔面 copper-clad surface g8B&u u #
去铜箔面 foil removal surface <:H
层压板面 unclad laminate surface -1dIZy
基膜面 base film surface [ )B@
胶粘剂面 adhesive faec _p?I{1O
原始光洁面 plate finish !k ;[^>
粗面 matt finish C5d/)aC
剪切板 cut to size panel Cf.WO %?P
超薄型层压板 ultra thin laminate XP3QBq
A阶树脂 A-stage resin ei(|5h
B阶树脂 B-stage resin F12S(5Z0%
C阶树脂 C-stage resin GWVEIZ
环氧树脂 epoxy resin sT@u3^>
酚醛树脂 phenolic resin UEk|8yq
聚酯树脂 polyester resin DWHOSXA4
聚酰亚胺树脂 polyimide resin NO%|c|B|
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin w`2_6[,9
丙烯酸树脂 acrylic resin i@sCMCu6
三聚氰胺甲醛树脂 melamine formaldehyde resin 4"rb&$E
多官能环氧树脂 polyfunctional epoxy resin )2
溴化环氧树脂 brominated epoxy resin F^J&g%ql
环氧酚醛 epoxy novolac 6uv'r;U]
氟树脂 fluroresin <5C=i:6%
硅树脂 silicone resin * <Nk%`
硅烷 silane OD>u$tI9
聚合物 polymer &^"s=g.
无定形聚合物 amorphous polymer :cIu?7A
结晶现象 crystalline polamer R
A-^!4tX
双晶现象 dimorphism :C}KI)
共聚物 copolymer OpbszSl"y
合成树脂 synthetic <<~lV5
热固性树脂 thermosetting resin [Page] HQjxJd5P
热塑性树脂 thermoplastic resin +^o3}`
感光性树脂 photosensitive resin 0$Qn#K
环氧值 epoxy value W\ZV0T;<]
双氰胺 dicyandiamide H"kc^G+(R"
粘结剂 binder P W0q71
胶粘剂 adesive m7bn%j-{$f
固化剂 curing agent 4C2>0O<^s
阻燃剂 flame retardant [U_Q 2<H
遮光剂 opaquer U/v"?pg[
增塑剂 plasticizers Z &ua,:5
不饱和聚酯 unsatuiated polyester htNL2N
聚酯薄膜 polyester Vf#oKPP1
聚酰亚胺薄膜 polyimide film (PI) 98<bF{#0WM
聚四氟乙烯 polytetrafluoetylene (PTFE) S:"z<O
增强材料 reinforcing material 4rGO8R
折痕 crease ZKiL-^dob
云织 waviness 3tx0y
鱼眼 fish eye _AsHw
毛圈长 feather length w7.?zb !N
厚薄段 mark C>\h?<s
裂缝 split hA&j?{
捻度 twist of yarn ".Q!8j"@f
浸润剂含量 size content -O5(%
浸润剂残留量 size residue 5r2ctde)Y
处理剂含量 finish level ;NN(CKZ9A
偶联剂 couplint agent T5X'D(\|
断裂长 breaking length 0|*UeM
吸水高度 height of capillary rise 071 E%u,
湿强度保留率 wet strength retention fTi{oY,zTg
白度 whitenness 4N0W& Dy
导电箔 conductive foil ,sQ0atk7ma
铜箔 copper foil zN8&M<mTl
压延铜箔 rolled copper foil AU${0#WV_
光面 shiny side
!EyGJa[i
粗糙面 matte side ^~*[~
处理面 treated side GXAk*vS=G
防锈处理 stain proofing iMY0xf8l
双面处理铜箔 double treated foil %o_0M^3W
模拟 simulation xSMp[j
逻辑模拟 logic simulation Wvzzjcr(j
电路模拟 circit simulation ~*Sbn~U
时序模拟 timing simulation ytcG6WN3
模块化 modularization 9^[5!SMzCj
设计原点 design origin X?k V1
优化(设计) optimization (design) s5Bmv\e.i5
供设计优化坐标轴 predominant axis Z2pN<S{5
表格原点 table origin JQVw6*u{
元件安置 component positioning r>:7${pF
比例因子 scaling factor X6"^:)&1M
扫描填充 scan filling `__?7"p
)\
矩形填充 rectangle filling b&V]|Z(
填充域 region filling Osvz 3UMY3
实体设计 physical design wDC/w[4:
逻辑设计 logic design #Ot*jb1
逻辑电路 logic circuit IP4b[|ef
层次设计 hierarchical design ~IJZM`gN
自顶向下设计 top-down design >cr_^(UW&
自底向上设计 bottom-up design ? 3E_KGI
费用矩阵 cost metrix yPxG`w'
元件密度 component density Dy!bj
自由度 degrees freedom ~)_ ?:.Da
出度 out going degree YO!7D5rV #
入度 incoming degree l1|,Lr
曼哈顿距离 manhatton distance xvz5\s|b
欧几里德距离 euclidean distance >a`zkl
网络 network 6L`+z
阵列 array meVVRFQ2+
段 segment ("M#R!3
逻辑 logic +` Y ?-
逻辑设计自动化 logic design automation 'rq#q)1MT
分线 separated time *e"GQd?
分层 separated layer p31rhe
定顺序 definite sequence $CYpO}u#
导线(通道) conduction (track) LkZo/K~
导线(体)宽度 conductor width BnnUUaE
导线距离 conductor spacing vaCdfO&
导线层 conductor layer ~FCSq:_
导线宽度/间距 conductor line/space "i<3}6/*
第一导线层 conductor layer No.1 1S.e5{
圆形盘 round pad E["t Ccg
方形盘 square pad
8JOht(m
菱形盘 diamond pad eYX_V6c
长方形焊盘 oblong pad wj:3
子弹形盘 bullet pad <{xAvN(:
泪滴盘 teardrop pad :AcNb
雪人盘 snowman pad po$ynp756
形盘 V-shaped pad V gwB>oi*OE
环形盘 annular pad RDZh>K
PG
非圆形盘 non-circular pad #vZ]2Ud=2
隔离盘 isolation pad ~Z/ `W`
非功能连接盘 monfunctional pad A=[f>8
偏置连接盘 offset land ^?.:}
腹(背)裸盘 back-bard land 88=FPEU
盘址 anchoring spaur ,4T$
连接盘图形 land pattern BNoCE!
连接盘网格阵列 land grid array <7-,`
孔环 annular ring V7'x?
pt
元件孔 component hole gsq[ 9
安装孔 mounting hole }/}`onRZ
支撑孔 supported hole KA{DN!
非支撑孔 unsupported hole .VEfd4+ni{
导通孔 via y^|3]G3
镀通孔 plated through hole (PTH) T( Gf~0HYF
余隙孔 access hole d*:qFq_
盲孔 blind via (hole) w,#W&>+&
埋孔 buried via hole Ty|c@X
埋,盲孔 buried blind via c&?H8G)x
任意层内部导通孔 any layer inner via hole Ri6 br
全部钻孔 all drilled hole }fMFQA)
定位孔 toaling hole >s?;2T2"yx
无连接盘孔 landless hole jqsktJw#i
中间孔 interstitial hole Y},GZ ^zqy
无连接盘导通孔 landless via hole LmdV@gR
引导孔 pilot hole [_G0kiI}W"
端接全隙孔 terminal clearomee hole FT<*
准尺寸孔 dimensioned hole [Page] Gz5@1CF
在连接盘中导通孔 via-in-pad f#Oz("d
孔位 hole location MC)W?
孔密度 hole density 0bL=l0N$W
孔图 hole pattern
m]}"FMH$
钻孔图 drill drawing OxGCpbh*7o
装配图assembly drawing Wv/5#_
参考基准 datum referan ~{$'s p0
1) 元件设备 7Bd_/A($
fTtSx_}3H
三绕组变压器:three-column transformer ThrClnTrans MCpK^7]k
双绕组变压器:double-column transformer DblClmnTrans I[IQFka}
电容器:Capacitor R*G>)YH
并联电容器:shunt capacitor a2_IF,p*?
电抗器:Reactor M@[gT?mv1
母线:Busbar 0]0M>vx
u
输电线:TransmissionLine DJjDKVO5t
发电厂:power plant ouZ9oy(}a
断路器:Breaker VOOThdR
刀闸(隔离开关):Isolator KCT"a:\
分接头:tap SFNd,(kB*z
电动机:motor PH &ms
(2) 状态参数 19`0)pzZ*P
-^Va]Lk
有功:active power 1Nu`@)D0
无功:reactive power ew ['9
电流:current ?S:_J!vX{
容量:capacity
o*1`, n
电压:voltage JY8pV+q @=
档位:tap position 3H%WB|
有功损耗:reactive loss ZWEzL$VWi
无功损耗:active loss %=eD)p7l-
功率因数:power-factor ~Nh7C b_
功率:power 5LH ]B
功角:power-angle eA^|B zU
电压等级:voltage grade +c_CYkHJ/
空载损耗:no-load loss kO"aE~
铁损:iron loss P*sCrGO%
铜损:copper loss >(a_9l;q
空载电流:no-load current '2oBi6|X
阻抗:impedance KphEw[4/
正序阻抗:positive sequence impedance SJ@_eir\o
负序阻抗:negative sequence impedance Xxw.{2Ji!q
零序阻抗:zero sequence impedance LK~0ck7
电阻:resistor "ET"dMxU
电抗:reactance Us.jyg7_c
电导:conductance IW*.B6Hw8
电纳:susceptance JpiKZG@L
无功负载:reactive load 或者QLoad 8G<.5!f7`N
有功负载: active load PLoad Pw.+DA
遥测:YC(telemetering) z8MYgn7
遥信:YX -&tiM
v
励磁电流(转子电流):magnetizing current Vd~k4
定子:stator <{uIB;P
功角:power-angle ')<$AMy1
上限:upper limit ;Yj&7k1
下限:lower limit Pw{+7b$
并列的:apposable ]uf_"D
高压: high voltage aR $P}]H
低压:low voltage p(%x&*)f
中压:middle voltage +__Rk1CVh
电力系统 power system `BY`ltW
发电机 generator &Y$rVBgQ
励磁 excitation Q5JeL6t
励磁器 excitor wS4wED&a
电压 voltage |{Q,,<C
电流 current *^ BE1-
母线 bus Jsl,r+'H
变压器 transformer RR|Eqm3)
升压变压器 step-up transformer e#^by(1@}
高压侧 high side oY:>pxSz<@
输电系统 power transmission system U>XGJQ<NS
输电线 transmission line ,5:86'p
固定串联电容补偿fixed series capacitor compensation +/tD$
稳定 stability ,zaveQ~l
电压稳定 voltage stability =|/b[Gd(
功角稳定 angle stability fCR;Fk2B
暂态稳定 transient stability huIr*)r&p
电厂 power plant Z(P#]jI]
能量输送 power transfer 6G],t)<A'-
交流 AC N8TO"`wdbs
装机容量 installed capacity o hCPNm
电网 power system H Vy^^$
落点 drop point I(e>ff
开关站 switch station rYJvI
双回同杆并架 double-circuit lines on the same tower \N)FUYoHg
变电站 transformer substation C
Qebb:y
补偿度 degree of compensation gMbvHlT
高抗 high voltage shunt reactor y:L|]p}huE
无功补偿 reactive power compensation F)G#\r
故障 fault t/CNxfY
调节 regulation jQhf)B
裕度 magin <4Fd~
三相故障 three phase fault x$E
l7=.
故障切除时间 fault clearing time qCMcN<:>
极限切除时间 critical clearing time -h}J%UV
切机 generator triping gE&f}M-
高顶值 high limited value "?!IPX2\S
强行励磁 reinforced excitation shB(kb{{
线路补偿器 LDC(line drop compensation) t9}XO M*
机端 generator terminal cD\Qt9EI
静态 static (state) tkmW\
动态 dynamic (state) k)J7) L
单机无穷大系统 one machine - infinity bus system S.z ;Bm
机端电压控制 AVR IO4 IaeM
电抗 reactance -'2.^a-8-g
电阻 resistance \r2w@F{C
功角 power angle fjb2-K
有功(功率) active power +2?[=g4;}
无功(功率) reactive power ocMf}"
功率因数 power factor DEBgb
无功电流 reactive current d dPJx<
下降特性 droop characteristics SCo9[EJ
斜率 slope qrdI"
额定 rating qhtc?A/0}
变比 ratio :X#(T-!t
参考值 reference value 3Rm$
电压互感器 PT Z6=!}a%
分接头 tap u0,~pJvX
下降率 droop rate +38t82%YWo
仿真分析 simulation analysis /c7j@=0
传递函数 transfer function \=@}(<4
框图 block diagram +%yh@X6
受端 receive-side d09GD[5
裕度 margin !"kvXxp^
同步 synchronization (#:Si~3
失去同步 loss of synchronization \S9z.!7v$
阻尼 damping 9#p^Z)[)-
摇摆 swing p#&6Ed*V
保护断路器 circuit breaker *,. {Xf
电阻:resistance H|^4e
电抗:reactance G`n-WP
阻抗:impedance ]:njP3r
电导:conductance %tMfOW
电纳:susceptance