1 backplane 背板 w_6h
$"^x
2 Band gap voltage reference 带隙电压参考 LvB -%@n
3 benchtop supply 工作台电源 \
3ha
4 Block Diagram 方块图 5 Bode Plot 波特图 7u0!Q\
6 Bootstrap 自举 ._#|h5
7 Bottom FET Bottom FET 7R ;!
8 bucket capcitor 桶形电容 Drc\$<9c@
9 chassis 机架 aabnlOVw
10 Combi-sense Combi-sense j$BM$q/c
11 constant current source 恒流源 VDBP]LRF
12 Core Sataration 铁芯饱和 2UA h^i-^
13 crossover frequency 交叉频率 FK0nQ{uB"
14 current ripple 纹波电流 ` O-$qT,_
15 Cycle by Cycle 逐周期 5yuR[VU
16 cycle skipping 周期跳步 CKyX Z
17 Dead Time 死区时间 Za5*HCo
18 DIE Temperature 核心温度 YEQ}<\B\&
19 Disable 非使能,无效,禁用,关断 cW%F%:b
20 dominant pole 主极点 ~#N^@a
21 Enable 使能,有效,启用 }3ty2D#/:
22 ESD Rating ESD额定值 Jk 0;<2j
23 Evaluation Board 评估板 EX=Q(} 9F<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. )FYz*:f>&
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 _=}Efy7
25 Failling edge 下降沿 )Yy`$`
26 figure of merit 品质因数 eE+zL~CE
27 float charge voltage 浮充电压 [PdatL2
28 flyback power stage 反驰式功率级 (ybKACx
29 forward voltage drop 前向压降 vA*!82
30 free-running 自由运行 RKx"
}<#+
31 Freewheel diode 续流二极管 N.l+9L0b
32 Full load 满负载 33 gate drive 栅极驱动 %TP0i#J
34 gate drive stage 栅极驱动级 ['Hl$2 j
35 gerber plot Gerber 图 ^3^n|T7le
36 ground plane 接地层 twq!@C
37 Henry 电感单位:亨利 ]`b/_LJN$F
38 Human Body Model 人体模式 9m/v^
39 Hysteresis 滞回 +' QX`
40 inrush current 涌入电流 "l"zbW WOH
41 Inverting 反相 km|;T!
42 jittery 抖动 cR*D)'/tl
43 Junction 结点 :dc>\kUIv
44 Kelvin connection 开尔文连接 P|Dw+lQj
45 Lead Frame 引脚框架 mR)Xq=
46 Lead Free 无铅 [2"a~o\
47 level-shift 电平移动 (Z fY/
48 Line regulation 电源调整率 F2saGpGH
49 load regulation 负载调整率 bx#GOK-
50 Lot Number 批号 IVjH.BzH9
51 Low Dropout 低压差 olB?"M=H
52 Miller 密勒 53 node 节点 v[E*K@6f
54 Non-Inverting 非反相 d,tGW
55 novel 新颖的 GWsvN&nr
56 off state 关断状态 kj{z;5-dl
57 Operating supply voltage 电源工作电压 $WED]X@X!
58 out drive stage 输出驱动级 Dp3&@M"^yY
59 Out of Phase 异相 *<c, x8\s9
60 Part Number 产品型号 #N.W8mq
61 pass transistor pass transistor D2z" Z@
62 P-channel MOSFET P沟道MOSFET gdPv,p19L
63 Phase margin 相位裕度 O~?H\2S
64 Phase Node 开关节点 ?Z9C}t]
65 portable electronics 便携式电子设备 .jA'BF.
66 power down 掉电 gi\2bzWkbX
67 Power Good 电源正常 b{%p
68 Power Groud 功率地 j")#"& m
69 Power Save Mode 节电模式 SaceIV%(
70 Power up 上电 {]BPSj{B
71 pull down 下拉 VRV*\*~$
72 pull up 上拉 |Ii[WfFA|J
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) jeXP|;#Una
74 push pull converter 推挽转换器 'Z5l'Ac
75 ramp down 斜降 /
VypN,
76 ramp up 斜升 (&t741DN|
77 redundant diode 冗余二极管 Fjch<gAofS
78 resistive divider 电阻分压器 n,/eT,48`
79 ringing 振 铃 50kjX}
80 ripple current 纹波电流 Jmg<mjq/G
81 rising edge 上升沿 Yz7H@Y2i
82 sense resistor 检测电阻 %Z_/MNI
83 Sequenced Power Supplys 序列电源 69/aP=
84 shoot-through 直通,同时导通 v%a)nv
85 stray inductances. 杂散电感 r*_z<^d
86 sub-circuit 子电路 WRrCrXP
87 substrate 基板 %EV\nwn6
88 Telecom 电信 $1lI6 =
,
89 Thermal Information 热性能信息 M~/7thP{
90 thermal slug 散热片 11Sflj
91 Threshold 阈值 >1uo5,wrF
92 timing resistor 振荡电阻 }9=X*'BO
93 Top FET Top FET 0>{&8:
94 Trace 线路,走线,引线 "}ibH{$lM
95 Transfer function 传递函数 v3\
|
96 Trip Point 跳变点 \"k[y+O],4
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 9|BH/&$
98 Under Voltage Lock Out (UVLO) 欠压锁定 3mef;!q
99 Voltage Reference 电压参考 5>CmWMQ
100 voltage-second product 伏秒积 \EI<1B
101 zero-pole frequency compensation 零极点频率补偿 NSs"I]
102 beat frequency 拍频 fL$U%I3
103 one shots 单击电路 ]]Bqte
104 scaling 缩放 R%Xhdcn7
105 ESR 等效串联电阻 [Page] *~Y$8!ad
106 Ground 地电位 2-G6I92d
107 trimmed bandgap 平衡带隙 2:[
-
108 dropout voltage 压差 yBKEw(1
109 large bulk capacitance 大容量电容 G42J
110 circuit breaker 断路器 ;[nomxu|?
111 charge pump 电荷泵 96ydcJY0'
112 overshoot 过冲 XS#Jy
n
KYw~(+gHv2
印制电路printed circuit a%nksuP3
印制线路 printed wiring oz8z%*9(
印制板 printed board vC#_PI
印制板电路 printed circuit board =1ltX+
印制线路板 printed wiring board Budo9z_w
印制元件 printed component h95a61a,Vy
印制接点 printed contact 1Jm'9iy3
印制板装配 printed board assembly etw.l~y
板 board , B90r7K:
刚性印制板 rigid printed board |-)2 D=P
挠性印制电路 flexible printed circuit CU`yi.)T{
挠性印制线路 flexible printed wiring +jD*Jtb<
齐平印制板 flush printed board \|@u)n_
金属芯印制板 metal core printed board ;15j\{r
金属基印制板 metal base printed board pZxuV(QP`
多重布线印制板 mulit-wiring printed board p[LPi5
塑电路板 molded circuit board ^WF/gup\hS
散线印制板 discrete wiring board Z:(Zy
微线印制板 micro wire board Qxb%P<`u
积层印制板 buile-up printed board hnYL<<AA
表面层合电路板 surface laminar circuit |7#S0Ca@
埋入凸块连印制板 B2it printed board q9
SV<qg
载芯片板 chip on board D`4>Wh/H
埋电阻板 buried resistance board DYf3>xh>xb
母板 mother board 1XppC[))
子板 daughter board #r,LV}*qg
背板 backplane *`]#ntz9
裸板 bare board 5mqwNAv
键盘板夹心板 copper-invar-copper board /LK,:6
动态挠性板 dynamic flex board -prc+G,qyp
静态挠性板 static flex board L#|6Lnp^
可断拼板 break-away planel 9 $&$Fe
电缆 cable :aHLr[%Mz
挠性扁平电缆 flexible flat cable (FFC) R3bHX%T
薄膜开关 membrane switch ?mi1PNps#
混合电路 hybrid circuit $n#NUPzG+
厚膜 thick film af-
厚膜电路 thick film circuit (5/>arDn
薄膜 thin film |Y tZOQu
薄膜混合电路 thin film hybrid circuit CT0 ~
互连 interconnection +tCNJ<S@l$
导线 conductor trace line bXNM.K
齐平导线 flush conductor (3VV(18
传输线 transmission line ix+sT|>
跨交 crossover V44M=c7E
板边插头 edge-board contact #d* )W3e2{
增强板 stiffener /idrbc
基底 substrate !Y,*Zc$R
基板面 real estate WKvG|YRDq
导线面 conductor side 'DdR2
元件面 component side y[A%EMd
焊接面 solder side O<>cuW(l
导电图形 conductive pattern vuoD~ =z
非导电图形 non-conductive pattern FzzV%
基材 base material FoKAF
&h7
层压板 laminate "CTK%be{q/
覆金属箔基材 metal-clad bade material pd\x^F`sk.
覆铜箔层压板 copper-clad laminate (CCL) |aX1PC)o_
复合层压板 composite laminate X3zpU7`Av+
薄层压板 thin laminate Z=.$mFE\
基体材料 basis material H"vkp~u]I
预浸材料 prepreg a,ZmDkzuv
粘结片 bonding sheet
#V-0-n,`
预浸粘结片 preimpregnated bonding sheer !v\_<8
环氧玻璃基板 epoxy glass substrate xgq
`l#
预制内层覆箔板 mass lamination panel \r`><d
内层芯板 core material W lHK
粘结层 bonding layer +i@{h9"6g
粘结膜 film adhesive I3hN7
无支撑胶粘剂膜 unsupported adhesive film =im7RgIBo
覆盖层 cover layer (cover lay) x_oiPu.V
增强板材 stiffener material ]
^s,
铜箔面 copper-clad surface PBOZ^%k
去铜箔面 foil removal surface U-ADdOh"q
层压板面 unclad laminate surface jnIf(a
基膜面 base film surface L/KiE+Y
胶粘剂面 adhesive faec ,LodP%%UV
原始光洁面 plate finish 4apaUP=Jp
粗面 matt finish 0^9%E61YR
剪切板 cut to size panel ^_ST#fFS
超薄型层压板 ultra thin laminate UfSqiu
A阶树脂 A-stage resin FMEW['
B阶树脂 B-stage resin 13aj fH
C阶树脂 C-stage resin <HB@j}qi
环氧树脂 epoxy resin ^-2|T__
酚醛树脂 phenolic resin yp?a7t M
聚酯树脂 polyester resin 6DT^:LHS
聚酰亚胺树脂 polyimide resin @;t6Slc"~
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin B&rw R/d
丙烯酸树脂 acrylic resin +rFAo00E|
三聚氰胺甲醛树脂 melamine formaldehyde resin c-oIP~,
多官能环氧树脂 polyfunctional epoxy resin
{,+MaH
溴化环氧树脂 brominated epoxy resin NbPNcjPL
环氧酚醛 epoxy novolac W,fXHYst
氟树脂 fluroresin 8;v/b3
硅树脂 silicone resin `'G1"CX
硅烷 silane yvIzgwN%s!
聚合物 polymer %EEQ^lm
无定形聚合物 amorphous polymer W)jtTC7
结晶现象 crystalline polamer ),(HCzK`
双晶现象 dimorphism wAKm]?zB>
共聚物 copolymer s2`Qh9R
合成树脂 synthetic <?FkwW\?
热固性树脂 thermosetting resin [Page] \e9rXh%
热塑性树脂 thermoplastic resin !hjA
感光性树脂 photosensitive resin 0sfb$3y
环氧值 epoxy value
$5\+QW
双氰胺 dicyandiamide bPA >xAH
粘结剂 binder 2bu > j1h
胶粘剂 adesive -]Y@_T.C
固化剂 curing agent p6X-P%s
阻燃剂 flame retardant $*+IsP!
遮光剂 opaquer W9!K~g_
增塑剂 plasticizers ^m['VK#?
不饱和聚酯 unsatuiated polyester n?:%>O s$
聚酯薄膜 polyester g[Q+DT
聚酰亚胺薄膜 polyimide film (PI) +3[8EM#g
聚四氟乙烯 polytetrafluoetylene (PTFE) '!<gPAVTzV
增强材料 reinforcing material ;<l#k7 /
折痕 crease t.Yf8Gy
云织 waviness } fJLY\
鱼眼 fish eye -pW*6??+?
毛圈长 feather length nArG
I}@
厚薄段 mark i:60|ngK
裂缝 split UY(\T8
捻度 twist of yarn 7yQw$zG,Iz
浸润剂含量 size content Hu$y8_Udw
浸润剂残留量 size residue $X,dQ]M
处理剂含量 finish level 8/k"A-m
偶联剂 couplint agent .'PS L
断裂长 breaking length s63!]LDr
吸水高度 height of capillary rise GK=b
湿强度保留率 wet strength retention 2(U;{;\n*
白度 whitenness d_7hh
导电箔 conductive foil xF6byTi
铜箔 copper foil s#H_QOE
压延铜箔 rolled copper foil K%ptRj$
光面 shiny side ]d~2WX Y
粗糙面 matte side MdDL?ev
处理面 treated side \Oxyc}&
防锈处理 stain proofing ^^B~v<uK
双面处理铜箔 double treated foil _<KUa\
模拟 simulation 0X:$ASocU
逻辑模拟 logic simulation [@_W-rA
电路模拟 circit simulation a}Z+"D
时序模拟 timing simulation e2yCWolmTS
模块化 modularization m/3,;P.6
设计原点 design origin xqb*;TBh*
优化(设计) optimization (design) F+ %l=
fs
供设计优化坐标轴 predominant axis bTt1y O
表格原点 table origin r{KQ3j9O
元件安置 component positioning 2ZEDyQM
比例因子 scaling factor DTlId~Dyq
扫描填充 scan filling d ehK#8
矩形填充 rectangle filling @b!W8c 6
填充域 region filling dNf:I,<DCf
实体设计 physical design Y5c[9\'\
逻辑设计 logic design x4K A8
逻辑电路 logic circuit Iz[ohn!f
层次设计 hierarchical design >a&IFi,j
自顶向下设计 top-down design
C TKeY
自底向上设计 bottom-up design {&J~P&,k
费用矩阵 cost metrix pxn@rN#*
元件密度 component density L{rd',
自由度 degrees freedom 'Y.6sB
出度 out going degree >p'{!k
入度 incoming degree p zZ+!d
曼哈顿距离 manhatton distance ~1{ppc+
欧几里德距离 euclidean distance m%=*3gH]&
网络 network 1m5*MY
阵列 array Q'Tg0,,S
段 segment w+wtr[;wwL
逻辑 logic .TCDv4?
逻辑设计自动化 logic design automation %/ctt_p0x
分线 separated time Nz}PcWF/
分层 separated layer q[GDK^-g
定顺序 definite sequence 7]9,J(:Ed
导线(通道) conduction (track) s94*uZ(C/
导线(体)宽度 conductor width eC94rcb}i{
导线距离 conductor spacing
kD0bdE|
导线层 conductor layer "8"aYD_
导线宽度/间距 conductor line/space 80ox$U
第一导线层 conductor layer No.1 OJd/#KFm
圆形盘 round pad +~~2OU L
方形盘 square pad }*C*!?pcd
菱形盘 diamond pad )*`h)`\y
长方形焊盘 oblong pad \2]_NU5.
子弹形盘 bullet pad ITg<u?z_
泪滴盘 teardrop pad jwUX?`6jX
雪人盘 snowman pad ]T'7+5w
形盘 V-shaped pad V a{@}vZx>3
环形盘 annular pad T];dFv-GT
非圆形盘 non-circular pad )XHn.>]nc
隔离盘 isolation pad LM+d3|gSV
非功能连接盘 monfunctional pad P8Wv&5A
偏置连接盘 offset land [Ky3WppR
腹(背)裸盘 back-bard land R8_I ASs
盘址 anchoring spaur Svb>s|D
连接盘图形 land pattern -i1 f
]Bd
连接盘网格阵列 land grid array NSBcYObX
孔环 annular ring 6]4#8tR1_
元件孔 component hole ]Axz}:
安装孔 mounting hole b\"w/'XX
支撑孔 supported hole AL.psw-Il
非支撑孔 unsupported hole b+|3nc!
导通孔 via #n}~u@,o_
镀通孔 plated through hole (PTH) WN<g _8QR
余隙孔 access hole .r2*tB).
盲孔 blind via (hole) *yaS^k\
埋孔 buried via hole 1`YU9?
埋,盲孔 buried blind via JXM]tV
任意层内部导通孔 any layer inner via hole yIrJaS-
全部钻孔 all drilled hole &w#!
定位孔 toaling hole Fs].Fa
无连接盘孔 landless hole AYgXqmH~+
中间孔 interstitial hole #c5jCy}n
无连接盘导通孔 landless via hole R(`:~@3\6
引导孔 pilot hole ^lAM /
端接全隙孔 terminal clearomee hole }f]Y^>-Ux
准尺寸孔 dimensioned hole [Page] OQ7 `n<I<)
在连接盘中导通孔 via-in-pad !
5NuFLOf
孔位 hole location ZZ7qSyBs?
孔密度 hole density *8WB($T}
孔图 hole pattern Qr9;CVW
钻孔图 drill drawing %IX)+
Lp`
装配图assembly drawing '*`#xNu[
参考基准 datum referan Jjm#ofv
1) 元件设备 gf1+yJ^d!
'gvR?[!t
三绕组变压器:three-column transformer ThrClnTrans o87kF!x
双绕组变压器:double-column transformer DblClmnTrans FO5a<6
电容器:Capacitor aL( hWE
并联电容器:shunt capacitor -cM1]soT
电抗器:Reactor p,goYF??
母线:Busbar S0)JIrrHC
输电线:TransmissionLine w y|^=#k
发电厂:power plant Q-n8~Ey1a
断路器:Breaker pYx,*kG:HW
刀闸(隔离开关):Isolator ,VHqZ'6
分接头:tap ^>?=L\[
电动机:motor dPwyiV0
(2) 状态参数 :-B+W9'5
@ M]_],
有功:active power !g9k9 l
无功:reactive power \&5V';
电流:current l! F$V;R
容量:capacity WJ25fTsG
电压:voltage r<ucHRO#
档位:tap position #cu{AdK
有功损耗:reactive loss =FrB{Eu
无功损耗:active loss 3R3H+W0{
功率因数:power-factor d_,5;M^k
功率:power t$18h2yOL
功角:power-angle e@Lxduq
电压等级:voltage grade IT1YF.i
空载损耗:no-load loss x,!Dd
铁损:iron loss n^Ca?|}
,
铜损:copper loss YV<y-,Io
空载电流:no-load current Lwr's'ao.
阻抗:impedance #$I@V4O;#
正序阻抗:positive sequence impedance j#1G?MF
负序阻抗:negative sequence impedance Yv5H41o"
零序阻抗:zero sequence impedance X0VSa{
电阻:resistor %.Ma_4o
Z
电抗:reactance vR!+ 8sy$
电导:conductance H#~gx_^U
电纳:susceptance iT>u&0B-
无功负载:reactive load 或者QLoad mG jB{Q+
有功负载: active load PLoad ; :P4~R
遥测:YC(telemetering) m2c'r3 UEu
遥信:YX jYHn J}<
励磁电流(转子电流):magnetizing current ^#HaH
定子:stator >fH0>W+!
功角:power-angle >R+-mP!nj
上限:upper limit j
uA@"SG
下限:lower limit ~U0%}Bbh
并列的:apposable EtKq.<SJ
高压: high voltage _MBhwNBxZ
低压:low voltage eV[{c %wN:
中压:middle voltage b=,BLe\
电力系统 power system #ibwD:{
发电机 generator BNfj0e 5b
励磁 excitation C !j3@EZ$
励磁器 excitor /4G1,T_,
电压 voltage Mg;pNK\n
电流 current rwRZGd *p
母线 bus L ;L:
变压器 transformer YThVG0I =
升压变压器 step-up transformer x>yqEdR=o
高压侧 high side (?jK|_
输电系统 power transmission system q)?%END
输电线 transmission line r&{8/ 5"
固定串联电容补偿fixed series capacitor compensation g:o/^_
稳定 stability * Gg7(cnpw
电压稳定 voltage stability OS(`H5D
功角稳定 angle stability y, l[v39
暂态稳定 transient stability AxH;psj
电厂 power plant .xT?%xSi/
能量输送 power transfer q+?&w'8
交流 AC hX.cdt_?
装机容量 installed capacity uY]';OtG
电网 power system \p4*Q}t
落点 drop point *k{Llq
开关站 switch station OrkcY39"~a
双回同杆并架 double-circuit lines on the same tower h4hAzFQ.s
变电站 transformer substation aTvyzr1
补偿度 degree of compensation )Te\6qM
高抗 high voltage shunt reactor <Wn~s=
无功补偿 reactive power compensation N[_T3(
故障 fault |! 9~
调节 regulation S7+>Mk
裕度 magin :Awwt0
三相故障 three phase fault Wg|6{'a
故障切除时间 fault clearing time G_F_TNO
极限切除时间 critical clearing time F*k
=JL
切机 generator triping Q9bnOvKe|
高顶值 high limited value -wn-PB@r
强行励磁 reinforced excitation iJ{axa &
线路补偿器 LDC(line drop compensation) )G2Bx+Z;L
机端 generator terminal T<uX[BO-a
静态 static (state) Zux L2W
动态 dynamic (state) V^s, 3C
单机无穷大系统 one machine - infinity bus system r Ea(1(I
机端电压控制 AVR MXA?rjd0
电抗 reactance 4@{;z4*`
电阻 resistance MT{1/A;`)
功角 power angle ]3v)3Wp
有功(功率) active power Hk}P
无功(功率) reactive power Ftyxz&-4$p
功率因数 power factor -RP{viGWK
无功电流 reactive current Z\0wQ;}
下降特性 droop characteristics 3o rSk
斜率 slope #VhdYDbW
额定 rating 4rhHvp
变比 ratio 4-bM90&1t
参考值 reference value ,LBj$U]e|E
电压互感器 PT EZj rX>"#
分接头 tap 94!}
Z>
下降率 droop rate {L$$"r,
仿真分析 simulation analysis #?Ix6 {R
传递函数 transfer function JrBPx/?(,;
框图 block diagram 2m $C;j!D
受端 receive-side $?ss5:
S
裕度 margin -o/Vp>_UOE
同步 synchronization nKE^km
失去同步 loss of synchronization f#c}}>V8
阻尼 damping gYt=_+-
摇摆 swing m+M^we*R
保护断路器 circuit breaker U R^r>
电阻:resistance .nY}_&
电抗:reactance &DW !$b
阻抗:impedance ?<J~SF Tt
电导:conductance /%g@ ;
电纳:susceptance