1 backplane 背板 E, ;'n
2 Band gap voltage reference 带隙电压参考 q?=_{oH9
3 benchtop supply 工作台电源 7i0;Ss*
4 Block Diagram 方块图 5 Bode Plot 波特图 ?,oE_H
6 Bootstrap 自举 <qjolMO`
7 Bottom FET Bottom FET o)sX?IiC
8 bucket capcitor 桶形电容 VdE$ig@
9 chassis 机架 _64<[2
10 Combi-sense Combi-sense 1(vcM
11 constant current source 恒流源 k!ac_}&NNv
12 Core Sataration 铁芯饱和 9RmdQ]1n4
13 crossover frequency 交叉频率 ^KjxQO6y3
14 current ripple 纹波电流 6r }w
15 Cycle by Cycle 逐周期 <I.{meDg
16 cycle skipping 周期跳步 ^.u
J]k0
17 Dead Time 死区时间 x%OJ3Qjj=
18 DIE Temperature 核心温度 `XK#sCC
19 Disable 非使能,无效,禁用,关断 ;s!GpO7 +
20 dominant pole 主极点 G&@vTcF
21 Enable 使能,有效,启用 }ZkGH}K_}
22 ESD Rating ESD额定值 Ie'iAY
23 Evaluation Board 评估板 g<s;uRA4O9
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 7~2V5@{<
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 A}MF>.!}C
25 Failling edge 下降沿 9ve)+Lk
26 figure of merit 品质因数 4ad-'
27 float charge voltage 浮充电压 1pZ[rM'}
28 flyback power stage 反驰式功率级 j38>5DM6L
29 forward voltage drop 前向压降 c'uDK>
30 free-running 自由运行 0*50uK=5
31 Freewheel diode 续流二极管 yPT\9"/
32 Full load 满负载 33 gate drive 栅极驱动 f1X]zk(=W
34 gate drive stage 栅极驱动级 -|(
q9B
35 gerber plot Gerber 图 Qo])A6$IU
36 ground plane 接地层 9}#9i^%}
37 Henry 电感单位:亨利 xG|n7w*
38 Human Body Model 人体模式 +9]CGYj
39 Hysteresis 滞回 Ep8 y
40 inrush current 涌入电流 wY_! s Qo
41 Inverting 反相 2hFOwI
42 jittery 抖动 y0\ = F
43 Junction 结点 D~r{(u~Ya
44 Kelvin connection 开尔文连接 8rM1kOCf
45 Lead Frame 引脚框架 \5R>+[n!
46 Lead Free 无铅 K?H(jP2mpM
47 level-shift 电平移动 Rkh
^|_<!
48 Line regulation 电源调整率 p0@l581
49 load regulation 负载调整率 ],w+4;+
50 Lot Number 批号 7U`8W\-
51 Low Dropout 低压差 +YnQOh%v0s
52 Miller 密勒 53 node 节点 Ct pc]lJ}
54 Non-Inverting 非反相 lCK|PY*
55 novel 新颖的 #b+>O+vx8
56 off state 关断状态 dY'>'1>P
9
57 Operating supply voltage 电源工作电压 QI{<q<
58 out drive stage 输出驱动级 &WHK|bl
59 Out of Phase 异相 t2#zQ[~X!
60 Part Number 产品型号 GL'zNQP-
61 pass transistor pass transistor ;1L7+.A
62 P-channel MOSFET P沟道MOSFET N3o
kN8d
63 Phase margin 相位裕度 zZI7p[A[3
64 Phase Node 开关节点 S<nbNSu6+
65 portable electronics 便携式电子设备 pb}4{]sI
66 power down 掉电 ~_W>ND
67 Power Good 电源正常 66MWOrr
68 Power Groud 功率地 q\T}jF\t
69 Power Save Mode 节电模式 #PZBh
70 Power up 上电 A^@,Ha
71 pull down 下拉 ~PiCA
72 pull up 上拉 '^~38=FA
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) vH/Y]Am
74 push pull converter 推挽转换器 of>}fJ_p
75 ramp down 斜降 /<it2=
76 ramp up 斜升 VIg=|Oe),
77 redundant diode 冗余二极管 <G#z;]N
78 resistive divider 电阻分压器 73tWeZ8rvx
79 ringing 振 铃 }I
^e:,{
80 ripple current 纹波电流 -K U@0G
81 rising edge 上升沿 4!0nM|~
82 sense resistor 检测电阻 tqT-9sEXX.
83 Sequenced Power Supplys 序列电源 hSfLNvK
84 shoot-through 直通,同时导通 UCS`09KNJ
85 stray inductances. 杂散电感 i*ji
86 sub-circuit 子电路 V9<CeTl'
87 substrate 基板 {uji7TB
88 Telecom 电信 kJ:zMVN
89 Thermal Information 热性能信息 Q2K)Nl >_
90 thermal slug 散热片 'w!8`LPu
91 Threshold 阈值 C;.+ kE
92 timing resistor 振荡电阻 ?,Zc{
93 Top FET Top FET Q5pm^X._j
94 Trace 线路,走线,引线 \|q.M0
95 Transfer function 传递函数 0fU^
96 Trip Point 跳变点 8WRxM%gsH
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Ehf3L |9
98 Under Voltage Lock Out (UVLO) 欠压锁定 4Q
FX
99 Voltage Reference 电压参考 ]#Q'~X W
100 voltage-second product 伏秒积 o;M-M(EZQ6
101 zero-pole frequency compensation 零极点频率补偿 M}W};~V2ng
102 beat frequency 拍频 /e4#DH
103 one shots 单击电路 9G=ZB^
104 scaling 缩放 8GFA}_(^R
105 ESR 等效串联电阻 [Page] I0]"o#LjT
106 Ground 地电位 DC8,ns]!y
107 trimmed bandgap 平衡带隙 ht@s!5\LK
108 dropout voltage 压差 w-(^w9_e
109 large bulk capacitance 大容量电容 O.~@V(7ah
110 circuit breaker 断路器 qvhol
111 charge pump 电荷泵 =| M[JPr
112 overshoot 过冲 8/* 6&#-
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印制电路printed circuit 2gb MUdpp
印制线路 printed wiring l#G }j^Q
印制板 printed board jt8%
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印制板电路 printed circuit board 8ncgTCH:
印制线路板 printed wiring board Al(u|LbQ
印制元件 printed component 9X PQ1LSx
印制接点 printed contact %*wOJx
印制板装配 printed board assembly zO07X*Bw
板 board IRW%*W#
刚性印制板 rigid printed board ,-[dr|.
挠性印制电路 flexible printed circuit 2eh j2T
挠性印制线路 flexible printed wiring ,0R2k `m!
齐平印制板 flush printed board (" +/ :
金属芯印制板 metal core printed board ^>f jURR
金属基印制板 metal base printed board !^*I?9P
多重布线印制板 mulit-wiring printed board L?5OWVX!v
塑电路板 molded circuit board Bz#K_S
散线印制板 discrete wiring board ,Cckp! 6
微线印制板 micro wire board bs_"Nn?
积层印制板 buile-up printed board y~N,=5>j
表面层合电路板 surface laminar circuit ]
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埋入凸块连印制板 B2it printed board \PB ~6
载芯片板 chip on board ii:h
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埋电阻板 buried resistance board #815h,nP+
母板 mother board Z 7M%}V%
子板 daughter board Oy!j `
背板 backplane \4.U.pKY
裸板 bare board H.ZmLB
键盘板夹心板 copper-invar-copper board 6!}tmdzR
动态挠性板 dynamic flex board kFG>Km(y}
静态挠性板 static flex board @Pc]qu
可断拼板 break-away planel i-EFq@xl
电缆 cable ~4~-^
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挠性扁平电缆 flexible flat cable (FFC) )A4WK+yD$z
薄膜开关 membrane switch s2@}01QPo
混合电路 hybrid circuit > Rbgg1^]5
厚膜 thick film <k^P>Irb3t
厚膜电路 thick film circuit bTn7$EG
薄膜 thin film t;@VsQ8
薄膜混合电路 thin film hybrid circuit G'<J8;B*
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互连 interconnection aO]0|<2
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导线 conductor trace line <M1XG7_I
齐平导线 flush conductor U$`)|/8
传输线 transmission line $3!j1
跨交 crossover ~nk'ZJ
板边插头 edge-board contact <~}t;ji
增强板 stiffener I,r 3.2u
基底 substrate {q1&4U~'>O
基板面 real estate w
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导线面 conductor side
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元件面 component side )-9G*3
焊接面 solder side 6?0^U 9
导电图形 conductive pattern 8IH&=3
非导电图形 non-conductive pattern W.ud<OKP90
基材 base material SrN;S kS
层压板 laminate 9Osjh G
覆金属箔基材 metal-clad bade material @$~ BU;kR
覆铜箔层压板 copper-clad laminate (CCL) ,$habq=;
复合层压板 composite laminate ~4wbIE_rN
薄层压板 thin laminate 9BGPq) #
基体材料 basis material <=V2~
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预浸材料 prepreg 7;C9V`
粘结片 bonding sheet <