1 backplane 背板 Y('#jU
2 Band gap voltage reference 带隙电压参考 ^|(LAjet
3 benchtop supply 工作台电源 `25yE/
4 Block Diagram 方块图 5 Bode Plot 波特图 ! E5HN :#
6 Bootstrap 自举 ]|ag
7 Bottom FET Bottom FET 4f@rv^f(X
8 bucket capcitor 桶形电容 uyWunpT
9 chassis 机架 O+]ZyHnB
10 Combi-sense Combi-sense
#A/
11 constant current source 恒流源 >T-u~i$s
12 Core Sataration 铁芯饱和 "m8^zg hL
13 crossover frequency 交叉频率 6l
x>>J!H
14 current ripple 纹波电流 :\c ^*K(9
15 Cycle by Cycle 逐周期 ]:- mbgW
16 cycle skipping 周期跳步 o#Dk&
cH
17 Dead Time 死区时间 n;_sG>N
18 DIE Temperature 核心温度 ZvX*t)VjTz
19 Disable 非使能,无效,禁用,关断 s^9Voi.y
20 dominant pole 主极点 ^
VyKd
21 Enable 使能,有效,启用 'GWN~5
22 ESD Rating ESD额定值 "+nRGEs6
23 Evaluation Board 评估板 Q"d^_z]K
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. RSRS wkC
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 4E+e}\r:6
25 Failling edge 下降沿 k]|~>9eY]
26 figure of merit 品质因数 J!(<y(l
27 float charge voltage 浮充电压 7xlkZF
28 flyback power stage 反驰式功率级 xLajso1g69
29 forward voltage drop 前向压降 my1@41
H
30 free-running 自由运行 rZ$O?K
31 Freewheel diode 续流二极管 I$G['`XX/
32 Full load 满负载 33 gate drive 栅极驱动 qYQl,w
34 gate drive stage 栅极驱动级 f'RX6$}\1X
35 gerber plot Gerber 图 ^[`%&uj!g
36 ground plane 接地层 h,N?Ab'S
37 Henry 电感单位:亨利 V1zmG y
38 Human Body Model 人体模式 Dx?,=~W9
39 Hysteresis 滞回 O=t_yy
40 inrush current 涌入电流 Nh|uO?&C6
41 Inverting 反相 uH^-R_tQ
42 jittery 抖动 vh%B[brUJ
43 Junction 结点 ,ZNq,$j
44 Kelvin connection 开尔文连接 oZgjQM$YP
45 Lead Frame 引脚框架 <n$'voR7]
46 Lead Free 无铅 PFjL1=7I
47 level-shift 电平移动 'H>^2C iM
48 Line regulation 电源调整率 C{rcs'
49 load regulation 负载调整率 ? OM!+O
50 Lot Number 批号 ;$|nrwhy
51 Low Dropout 低压差 'IQ0{&EI
52 Miller 密勒 53 node 节点 /{_:{G!Q0
54 Non-Inverting 非反相 cV6D<,)
55 novel 新颖的 C}Cs8eUn
56 off state 关断状态 mq.`X:e
57 Operating supply voltage 电源工作电压 K\r8g=U
58 out drive stage 输出驱动级 CAhXQ7w'Z
59 Out of Phase 异相 +O{*M9B
60 Part Number 产品型号 2/^3WY1U
61 pass transistor pass transistor ZLejcYS
62 P-channel MOSFET P沟道MOSFET #c!lS<z
63 Phase margin 相位裕度 M%m4i9~!?
64 Phase Node 开关节点 d7upz]K9g
65 portable electronics 便携式电子设备 CHX #^0m.
66 power down 掉电 /([kh~a
67 Power Good 电源正常 _B<X`L
=
68 Power Groud 功率地 k y7Gwc
69 Power Save Mode 节电模式 kTgEd]^&D
70 Power up 上电 x 9fip-
71 pull down 下拉 1Pu~X
\sO
72 pull up 上拉 8nV+e~-w
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) <]2w n
74 push pull converter 推挽转换器 T8$y[W-c
75 ramp down 斜降 R-$!9mnr
76 ramp up 斜升 CD~.z7,LC
77 redundant diode 冗余二极管 Vc Z3
X4/
78 resistive divider 电阻分压器 T0)@pt7>
79 ringing 振 铃 )Aqtew+A&
80 ripple current 纹波电流 DvvK^+-~
81 rising edge 上升沿 8l`*]1.W<
82 sense resistor 检测电阻 :$c
|
83 Sequenced Power Supplys 序列电源 k9!{IScq
84 shoot-through 直通,同时导通 ~c `l@:
85 stray inductances. 杂散电感 } q8ASYNc
86 sub-circuit 子电路 UaeXY+O
87 substrate 基板 Iefn$
88 Telecom 电信 e9B064
89 Thermal Information 热性能信息 S,he6zS
90 thermal slug 散热片 b]KBgZ
91 Threshold 阈值 \4fQMG
92 timing resistor 振荡电阻 9yP;@y*d
93 Top FET Top FET 3!]rmZ-W
94 Trace 线路,走线,引线 $!t4r
95 Transfer function 传递函数 G 3ptx!
D
96 Trip Point 跳变点 gcT%c|.
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) s$j,9uRr
98 Under Voltage Lock Out (UVLO) 欠压锁定 +I28|*K"
99 Voltage Reference 电压参考 i/Zd8+.n$
100 voltage-second product 伏秒积 [7y]n;Fy
101 zero-pole frequency compensation 零极点频率补偿 ckCE1e>s
102 beat frequency 拍频 ~t~|"u"P
103 one shots 单击电路 =I_'.b
104 scaling 缩放 3bI9Zt#J%&
105 ESR 等效串联电阻 [Page] ;$g?T~v7
106 Ground 地电位 Nh44]*
107 trimmed bandgap 平衡带隙 R:qW;n%AF
108 dropout voltage 压差 ~D>p0+-c
109 large bulk capacitance 大容量电容 S_H+WfIHV'
110 circuit breaker 断路器 m8[j #=h
111 charge pump 电荷泵 G3T]`Atf
112 overshoot 过冲 ");a3hD
Ny/MJ#Lq
印制电路printed circuit Q7CsJzk~)
印制线路 printed wiring ;O,jUiQ
印制板 printed board %W S+(0*1
印制板电路 printed circuit board @H8EWTZ
印制线路板 printed wiring board I&5!=kR
印制元件 printed component JucY[`|JV
印制接点 printed contact mt.))#1
印制板装配 printed board assembly aN3;`~{9
板 board HZZn'u
刚性印制板 rigid printed board owv[M6lbD
挠性印制电路 flexible printed circuit _yR^*}xJb
挠性印制线路 flexible printed wiring A=0'Ks
齐平印制板 flush printed board *LY8D<:zs
金属芯印制板 metal core printed board S+lqA-:
金属基印制板 metal base printed board )+Pus~w
多重布线印制板 mulit-wiring printed board I]q% 2ie
塑电路板 molded circuit board dj%!I:Q>u
散线印制板 discrete wiring board zm;C\s rF
微线印制板 micro wire board >yDZw!C
积层印制板 buile-up printed board qqU 64E
表面层合电路板 surface laminar circuit `Q,H|hp;k;
埋入凸块连印制板 B2it printed board j] [,J49L
载芯片板 chip on board dAj$1Ke
埋电阻板 buried resistance board yB6?`3A:
母板 mother board ?aMOZn?
子板 daughter board lu/
(4ED
背板 backplane &%Tj/ Qx
裸板 bare board |4`{]2C
键盘板夹心板 copper-invar-copper board g9F?z2^
动态挠性板 dynamic flex board 7K:PdF>/
静态挠性板 static flex board Z3!`J&
可断拼板 break-away planel "kF g
电缆 cable P!k{u^$L
挠性扁平电缆 flexible flat cable (FFC) ^<AwG=
薄膜开关 membrane switch x,V r=FB
混合电路 hybrid circuit BDVtSs<7
厚膜 thick film 6W
UrQFK
厚膜电路 thick film circuit ;A[Q2(w+
薄膜 thin film |Q>IrT
薄膜混合电路 thin film hybrid circuit /a o5FL
互连 interconnection :BTq!>s
导线 conductor trace line a[TMDU;(/4
齐平导线 flush conductor Z/J y'$x
传输线 transmission line 5kXYeP3:
跨交 crossover rrv%~giU
板边插头 edge-board contact rVsJ`+L
增强板 stiffener ig &Y
基底 substrate "zy7C*)>r
基板面 real estate gZ1?G-Q
导线面 conductor side @=kSo
-SX
元件面 component side BsJC0I(
焊接面 solder side 1-QS~)+
导电图形 conductive pattern igAtRX%Qx
非导电图形 non-conductive pattern g=o4Q<
#^y
基材 base material ;9g2?-svw
层压板 laminate >F&47Yn
覆金属箔基材 metal-clad bade material o _H`o&xr
覆铜箔层压板 copper-clad laminate (CCL) "
2Dngw
复合层压板 composite laminate 0SPk|kr
薄层压板 thin laminate N}YkMJy
基体材料 basis material Xn\jO>[Ef
预浸材料 prepreg G*v,GR
粘结片 bonding sheet jF*j0PkNdb
预浸粘结片 preimpregnated bonding sheer lb1Xsgm{
环氧玻璃基板 epoxy glass substrate 1ZRT:N<-
预制内层覆箔板 mass lamination panel dC4'{n|7
内层芯板 core material Ecx<OTo
粘结层 bonding layer >-{Hyx
粘结膜 film adhesive @xZR9Z8]L
无支撑胶粘剂膜 unsupported adhesive film /H+a0`/
覆盖层 cover layer (cover lay) PnG-h~Y3N
增强板材 stiffener material 61
~upQaR
铜箔面 copper-clad surface n{SJ_S#a.a
去铜箔面 foil removal surface 76` .Y
层压板面 unclad laminate surface dAe')N:KPI
基膜面 base film surface !5?<% *
胶粘剂面 adhesive faec z&^&K}
原始光洁面 plate finish T9q-,w/j;
粗面 matt finish KCDE{za
剪切板 cut to size panel NW)1#]gg%
超薄型层压板 ultra thin laminate FU<Jp3<%
A阶树脂 A-stage resin t );/'3|
B阶树脂 B-stage resin .XhrCiZ
C阶树脂 C-stage resin O<W_fx8_'
环氧树脂 epoxy resin G9@0@2aY8
酚醛树脂 phenolic resin w)jISu;RG
聚酯树脂 polyester resin 8sK9G`
k
聚酰亚胺树脂 polyimide resin Nl(Foya%)
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin RY*U"G0#w
丙烯酸树脂 acrylic resin maR"t+
三聚氰胺甲醛树脂 melamine formaldehyde resin y L~W.H
多官能环氧树脂 polyfunctional epoxy resin B48={
溴化环氧树脂 brominated epoxy resin dcWD(-
环氧酚醛 epoxy novolac -C&P%tt Y
氟树脂 fluroresin HiJE}V;Vq
硅树脂 silicone resin Y:)e(c"A
硅烷 silane *G9V'9
聚合物 polymer FN) $0
无定形聚合物 amorphous polymer U|j`e5)
结晶现象 crystalline polamer 9]o-O]7/
双晶现象 dimorphism ?#Q #u|~
共聚物 copolymer mUx+Y ]Ep
合成树脂 synthetic _2 osV[e
热固性树脂 thermosetting resin [Page] Xm2z}X(%
热塑性树脂 thermoplastic resin '(jG[ry&T
感光性树脂 photosensitive resin qA5r
环氧值 epoxy value Ef13Q]9|
双氰胺 dicyandiamide &Z|P2 dI
粘结剂 binder =zs`#-^8
胶粘剂 adesive }f7j8py
固化剂 curing agent 6/dI6C!
阻燃剂 flame retardant 7W.~
遮光剂 opaquer @49S`
增塑剂 plasticizers X+]G-
不饱和聚酯 unsatuiated polyester QUQ'3
聚酯薄膜 polyester 1D!<'`)AY
聚酰亚胺薄膜 polyimide film (PI) R0
聚四氟乙烯 polytetrafluoetylene (PTFE) hqkz^!rp
增强材料 reinforcing material m/EFHS49
折痕 crease l0i^uMS
云织 waviness @>H75
鱼眼 fish eye F`]2O:[
毛圈长 feather length D=&Me=$
厚薄段 mark t}/( b/VD
裂缝 split jsi!fx2Rm
捻度 twist of yarn @bP)406p
浸润剂含量 size content Jma1N;d
浸润剂残留量 size residue 5bpEYW+
处理剂含量 finish level BsYa3d=}
偶联剂 couplint agent
ls)%c
断裂长 breaking length (Px OE
吸水高度 height of capillary rise Xh;#
湿强度保留率 wet strength retention HT1!5
白度 whitenness "kgdbAZ
导电箔 conductive foil Hc(OI|z~
铜箔 copper foil o J;$sj
压延铜箔 rolled copper foil U}j0D2
光面 shiny side y9}>: pj4
粗糙面 matte side lQkQ9##*
处理面 treated side %FI E\9
防锈处理 stain proofing UFb)AnK
双面处理铜箔 double treated foil AbmAKA@
模拟 simulation WU=59gB+jL
逻辑模拟 logic simulation 3WIk
电路模拟 circit simulation G{%L B}2
时序模拟 timing simulation 0F><P?5
模块化 modularization Bh]P{H%
设计原点 design origin j]/RC(;?
优化(设计) optimization (design) RF0HjgP
供设计优化坐标轴 predominant axis _/5H l`
表格原点 table origin Aj+F
|l
元件安置 component positioning 7g}w+p>
比例因子 scaling factor _[ZO p ~
扫描填充 scan filling LOV)3{m
矩形填充 rectangle filling O55 xS+3^k
填充域 region filling XFV!S#yEZ
实体设计 physical design x0w4)Ic5
逻辑设计 logic design U2s /2 [.
逻辑电路 logic circuit 54li^
层次设计 hierarchical design pgZXJ
自顶向下设计 top-down design .gOL1`b*
自底向上设计 bottom-up design ysf~|r4s
费用矩阵 cost metrix Ng>h"H
元件密度 component density L<{i,'M
自由度 degrees freedom
yhA6i
出度 out going degree =D#bb<o
入度 incoming degree Lrq.Ab#
曼哈顿距离 manhatton distance *>qp:;,DKP
欧几里德距离 euclidean distance
oc0G|
网络 network z]D69O b
阵列 array PxkOT*
段 segment Y,t={HiclX
逻辑 logic SPmq4
逻辑设计自动化 logic design automation N7
$I^?<
分线 separated time 0$fpIz
分层 separated layer uw+M
定顺序 definite sequence bTs?!~q
导线(通道) conduction (track) k%QpegN
导线(体)宽度 conductor width -"60d
@.
导线距离 conductor spacing h
Pa_VrH
导线层 conductor layer :mn>0jK,N
导线宽度/间距 conductor line/space x-.?HS[
第一导线层 conductor layer No.1 _1 !OlQ
圆形盘 round pad 56-dD5{hxR
方形盘 square pad t+T4-1 3a
菱形盘 diamond pad .rqhi
长方形焊盘 oblong pad \WB<86+z
子弹形盘 bullet pad yx&51G$
泪滴盘 teardrop pad @8rx`9
雪人盘 snowman pad 4s{~r
形盘 V-shaped pad V q6`b26
环形盘 annular pad TXvI4"&
非圆形盘 non-circular pad 9=h'9Wo
隔离盘 isolation pad v+#}rUTF
非功能连接盘 monfunctional pad ;{tj2m,
偏置连接盘 offset land Ayw ;N
腹(背)裸盘 back-bard land 0+ ;bh
{Eu
盘址 anchoring spaur S<@7_I
连接盘图形 land pattern EkNunCls
连接盘网格阵列 land grid array 8MzVOF{"
孔环 annular ring 9}F*P669f
元件孔 component hole [dIXR
安装孔 mounting hole X1-'COQS%&
支撑孔 supported hole -^h' >.
非支撑孔 unsupported hole (w/T-*
导通孔 via "~7>\>UFh
镀通孔 plated through hole (PTH) eMY<uqdw
余隙孔 access hole 8sM|%<$=j
盲孔 blind via (hole) Ne{?:h.!
埋孔 buried via hole OJ5#4qJ[
埋,盲孔 buried blind via $jI3VB
任意层内部导通孔 any layer inner via hole jun_QiU:2
全部钻孔 all drilled hole jiS_G%G
定位孔 toaling hole "ZsOd>[/
无连接盘孔 landless hole \T :i{.i
中间孔 interstitial hole yiC^aY=-
无连接盘导通孔 landless via hole h"_;IUZ!
引导孔 pilot hole y8!4q
端接全隙孔 terminal clearomee hole ';jYOVe
准尺寸孔 dimensioned hole [Page] %9N7Ln|%
在连接盘中导通孔 via-in-pad Za3]d+qm
孔位 hole location :xv!N*Le
孔密度 hole density kJzoFFWo$
孔图 hole pattern T;y>>_,
钻孔图 drill drawing -$jEfi4I
装配图assembly drawing dDGgvi|[Mz
参考基准 datum referan vAh6+K.e
1) 元件设备 *@v)d[z_
6S*exw
三绕组变压器:three-column transformer ThrClnTrans IsM}'.
双绕组变压器:double-column transformer DblClmnTrans 1&)?JZhg
电容器:Capacitor 4Thn])%I
并联电容器:shunt capacitor 4@n1Uk
电抗器:Reactor _c*=4y
母线:Busbar f~y%%+{p
输电线:TransmissionLine sRx63{
发电厂:power plant Dhw(#{N
断路器:Breaker m)v"3ib
刀闸(隔离开关):Isolator 1V4s<m>#
分接头:tap O%(fx!c`
电动机:motor luuX2Mx>o
(2) 状态参数 =2zJ3&9
r(aLEJ"u?
有功:active power (-xS?8x$
无功:reactive power 57zSu3v4Y
电流:current v~V5`%
容量:capacity E^lvbLh'
电压:voltage W<$Z=(_v
档位:tap position ;8*`{F[
有功损耗:reactive loss d + / &?3
无功损耗:active loss wF,UE_
功率因数:power-factor @}OL9Ch
功率:power &7b|4a8B%
功角:power-angle `U)hjQ~pP
电压等级:voltage grade +5o8KYV
空载损耗:no-load loss hMUs"
<.
铁损:iron loss E4W -hq~
铜损:copper loss SHbtWq}T
空载电流:no-load current 0]=i}wL 8
阻抗:impedance QM
O!v;
正序阻抗:positive sequence impedance ;04Ldb1{|3
负序阻抗:negative sequence impedance X*39c
b(b
零序阻抗:zero sequence impedance SAK!z!t
电阻:resistor RGg(%.
电抗:reactance [*H N"
电导:conductance #qI= Z0Y
电纳:susceptance ~ !
3I2
无功负载:reactive load 或者QLoad 7,|c
有功负载: active load PLoad }YMy6eW4
遥测:YC(telemetering) |8=nL$u
遥信:YX 'fF;(?
励磁电流(转子电流):magnetizing current 4%}*&nsI-Z
定子:stator
\ 3?LqJ
功角:power-angle 9@52Fg;mj
上限:upper limit =%gRW5R%
下限:lower limit kc @[9eV
并列的:apposable .k9{Yv0
高压: high voltage K]|> Et`
低压:low voltage te
!S09(
中压:middle voltage I1\a[Xe8E
电力系统 power system !{)tSipd
发电机 generator 8J~1-;
励磁 excitation H5]^
6
HwX
励磁器 excitor dBe`p5Z
电压 voltage mG`e3X6@-
电流 current $dzy%lle
母线 bus Yd= a}T
变压器 transformer IS[thbzkZ
升压变压器 step-up transformer 7.@TK&
高压侧 high side 0iK;Egwm
输电系统 power transmission system ]Xf% ,iu
输电线 transmission line IWveW8qJ
固定串联电容补偿fixed series capacitor compensation 2@~M4YJf
稳定 stability 6{+{lBm=y
电压稳定 voltage stability f=!VsR2o
功角稳定 angle stability o{EC&-
暂态稳定 transient stability ~L_hZso4
电厂 power plant ;VNMD 6H
能量输送 power transfer Ns0cgCrhX
交流 AC FwY&/\J7V
装机容量 installed capacity T4 N~(Fi)
电网 power system T?1Du"d8
落点 drop point 0zCw>wBPW
开关站 switch station ?wF'<kEH
双回同杆并架 double-circuit lines on the same tower 0}FOV`n
变电站 transformer substation V$icWu
补偿度 degree of compensation x^y" <
高抗 high voltage shunt reactor f{i8w!O"~
无功补偿 reactive power compensation ;w-qHha
故障 fault Kryo}
调节 regulation xD /9F18
裕度 magin Ppt2A6W
三相故障 three phase fault sf| ke9-3
故障切除时间 fault clearing time )r
z+'|,
极限切除时间 critical clearing time wwoweztER
切机 generator triping npyAJp
高顶值 high limited value A@D2+fS
强行励磁 reinforced excitation [NIlbjYH
线路补偿器 LDC(line drop compensation) f%)zg(YlO
机端 generator terminal lz0TK)kuC
静态 static (state) A'K%WW*'U
动态 dynamic (state) rVa?JvDO=
单机无穷大系统 one machine - infinity bus system CWG6;NT6m
机端电压控制 AVR
kWb2F7m
电抗 reactance >'5_Y]h4m|
电阻 resistance 8W+gl=C~
功角 power angle <zy,5IlD
有功(功率) active power GF:`>u{C
无功(功率) reactive power GK}'R=
功率因数 power factor j0GMTri3
无功电流 reactive current 1w0OKaF5
下降特性 droop characteristics Hb(B?!M)
斜率 slope a7/-wk
额定 rating r-IVb&uFb
变比 ratio 0\~Z5k`IT
参考值 reference value X$\i{p9jw
电压互感器 PT 8; R|
分接头 tap Lru-u:
下降率 droop rate EQIo5
仿真分析 simulation analysis @[?!s%*2
传递函数 transfer function OR Wm
C!
框图 block diagram $hVYTy~}
受端 receive-side cZ+7.oDu
裕度 margin Tv]<SI<B[
同步 synchronization ";w}3+R
失去同步 loss of synchronization c<BO gNr
阻尼 damping HygY>s+3[
摇摆 swing ]G}B 0u3
保护断路器 circuit breaker desThnTw
电阻:resistance +wk`;0s A
电抗:reactance RF!1oZ
阻抗:impedance T\# *S0^
电导:conductance `C+HE$B
电纳:susceptance