1 backplane 背板 sl?> X)}
2 Band gap voltage reference 带隙电压参考
cih[A2lp
3 benchtop supply 工作台电源 @#m@ .
4 Block Diagram 方块图 5 Bode Plot 波特图 di$\\ Ah
6 Bootstrap 自举 }rK9M$2]u
7 Bottom FET Bottom FET O1]L4V1iH
8 bucket capcitor 桶形电容 3msb"|DG
9 chassis 机架 xDJ@MW#
10 Combi-sense Combi-sense !(2rU @.
11 constant current source 恒流源 {HoeK>rd
12 Core Sataration 铁芯饱和 CCx_|>
13 crossover frequency 交叉频率 b{4@~>i
14 current ripple 纹波电流 G)5R
iRcs
15 Cycle by Cycle 逐周期 'y_<O |-
16 cycle skipping 周期跳步 -|_#6-9
17 Dead Time 死区时间 pe%$(%@v
18 DIE Temperature 核心温度 nSR7$yS_
19 Disable 非使能,无效,禁用,关断 1j4tR#L
20 dominant pole 主极点 fib#)KE
21 Enable 使能,有效,启用 :qlcN @_
22 ESD Rating ESD额定值 .t53+<A
23 Evaluation Board 评估板 J[ 0o6
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. }[2
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 "wqN,}bj\
25 Failling edge 下降沿 L F<{/c9,
26 figure of merit 品质因数 X"hdCY%
27 float charge voltage 浮充电压 TjDDvXY
28 flyback power stage 反驰式功率级 Vd%%lv{v
29 forward voltage drop 前向压降 7# !RX3
30 free-running 自由运行
9$<1<
31 Freewheel diode 续流二极管 R"Ff(1m
32 Full load 满负载 33 gate drive 栅极驱动 ut/3?E1 Z
34 gate drive stage 栅极驱动级 kn5X:@{
35 gerber plot Gerber 图 )O}q{4,}
36 ground plane 接地层 D_s0)|j$cy
37 Henry 电感单位:亨利 "|k 4<"]
38 Human Body Model 人体模式 +wPXDN#R
39 Hysteresis 滞回 k4i*80
40 inrush current 涌入电流 (Mzv"F N]
41 Inverting 反相 Dt]N&E#\D
42 jittery 抖动 mc
FSWmq
43 Junction 结点 ^mp#7OL
44 Kelvin connection 开尔文连接 M0) q
45 Lead Frame 引脚框架 [}ayaXXQ5
46 Lead Free 无铅 2wX4e0cOI4
47 level-shift 电平移动 -/w#f&Y+]8
48 Line regulation 电源调整率 Sj(5xa[
49 load regulation 负载调整率 .Tm m
50 Lot Number 批号 ),!1B%
51 Low Dropout 低压差 <y`MUpf]
52 Miller 密勒 53 node 节点 v^0*{7N'
54 Non-Inverting 非反相 UgD|tuz]
55 novel 新颖的 mG\$W#+j
56 off state 关断状态 /BN_K8nb`
57 Operating supply voltage 电源工作电压 3bU(ea^e$
58 out drive stage 输出驱动级 5 *R{N
~>
59 Out of Phase 异相 NB^+Hcb$
60 Part Number 产品型号 <@448,9&
61 pass transistor pass transistor ,h<xL-
62 P-channel MOSFET P沟道MOSFET Q# Yba
63 Phase margin 相位裕度 d94Le/E
64 Phase Node 开关节点 .D8|_B
65 portable electronics 便携式电子设备 'X%5i2
66 power down 掉电 qdCcMcGt
67 Power Good 电源正常 ybY[2g2QJ
68 Power Groud 功率地 y&&%%3
69 Power Save Mode 节电模式 * "qS
70 Power up 上电 E:$EK_?:t
71 pull down 下拉 gJFx#s0?6.
72 pull up 上拉 |O';$a1S
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) kfW"vI+d
74 push pull converter 推挽转换器 3QF/{$65!
75 ramp down 斜降 ^Ay>%`hf*
76 ramp up 斜升 uB@~x Q_V
77 redundant diode 冗余二极管 ?:AD&Dn
78 resistive divider 电阻分压器 eJ
;a}{ 4%
79 ringing 振 铃 })F.Tjf*
80 ripple current 纹波电流 ?h|&kRq
81 rising edge 上升沿 :3N&&]
82 sense resistor 检测电阻 Abc%VRsT
83 Sequenced Power Supplys 序列电源 @,^c?v
84 shoot-through 直通,同时导通 1Qk]?R/DN
85 stray inductances. 杂散电感 '>:c:Tewy
86 sub-circuit 子电路 b2r]>*Vc
87 substrate 基板 UTS.o#d
88 Telecom 电信 wl.a|~-
89 Thermal Information 热性能信息 ^:cc3wt'3[
90 thermal slug 散热片 cp_<y)__
91 Threshold 阈值 p}e1!q;N
92 timing resistor 振荡电阻 xg;I::hE7X
93 Top FET Top FET ZJf:a}=h
94 Trace 线路,走线,引线 @>Bgld&vl
95 Transfer function 传递函数 5Y4#aq
96 Trip Point 跳变点 F%ffnEJg
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ]8+ D
98 Under Voltage Lock Out (UVLO) 欠压锁定 Q)[DSM
99 Voltage Reference 电压参考 KD* xFap
100 voltage-second product 伏秒积 L/c`t7
101 zero-pole frequency compensation 零极点频率补偿 HD_ #-M
102 beat frequency 拍频 i9+qU
103 one shots 单击电路 +R2+?v6
104 scaling 缩放 l.Q.G<ol
105 ESR 等效串联电阻 [Page] f`K[oCfu
106 Ground 地电位 {oftZXwf
107 trimmed bandgap 平衡带隙 s1>d)2lX
108 dropout voltage 压差 /e;E+
109 large bulk capacitance 大容量电容 3C
gmZ7[
110 circuit breaker 断路器 Ud& '*,
111 charge pump 电荷泵 &V(;zy4(R
112 overshoot 过冲 rbl7-xhC7
_Kwp8_kTr
印制电路printed circuit 92(P~Sdv
印制线路 printed wiring f\vMdY
印制板 printed board (yK@(euG
印制板电路 printed circuit board )#l&BV5
印制线路板 printed wiring board tjg?zlj
印制元件 printed component M(U<H;Csk
印制接点 printed contact @j<Q2z^
印制板装配 printed board assembly cd._q2
板 board Y(&rlL(sPK
刚性印制板 rigid printed board "lRxatM
挠性印制电路 flexible printed circuit -, uT8'
挠性印制线路 flexible printed wiring ZJ8"5RW
齐平印制板 flush printed board Y[0mTL4IO
金属芯印制板 metal core printed board e'A1%g)
金属基印制板 metal base printed board ^AF~k#R
多重布线印制板 mulit-wiring printed board N c(f+8
塑电路板 molded circuit board ?0tm{qP
散线印制板 discrete wiring board :MihVL F
微线印制板 micro wire board RxE.t[
积层印制板 buile-up printed board ?*^HZ~O1
表面层合电路板 surface laminar circuit t{-*@8Ke
埋入凸块连印制板 B2it printed board |OiM(E(
载芯片板 chip on board x~QZVL=:
埋电阻板 buried resistance board jG`,k*eUrJ
母板 mother board a0&L,7mu<'
子板 daughter board $ftxid8
背板 backplane _BoYyJQH
裸板 bare board \0n<6^y
键盘板夹心板 copper-invar-copper board qVssw* GDB
动态挠性板 dynamic flex board ~"VM_Lz]5
静态挠性板 static flex board = N^Ec[u(l
可断拼板 break-away planel l5nm.i<M
电缆 cable WD@v<Wx)
挠性扁平电缆 flexible flat cable (FFC) 9@8'*a{`m
薄膜开关 membrane switch 4\E1M[ 6
混合电路 hybrid circuit [jR>.H'
厚膜 thick film 8Z CR9%
厚膜电路 thick film circuit @E4ya$A)F
薄膜 thin film H8kB.D[7Q
薄膜混合电路 thin film hybrid circuit ++ZP
X'|
互连 interconnection T"3:dkQw
导线 conductor trace line 'cqY-64CJZ
齐平导线 flush conductor 26}fB
传输线 transmission line >d(:XP6J
跨交 crossover sI6I5
板边插头 edge-board contact g:s|D
hE[
增强板 stiffener J1w,;T\55
基底 substrate Dy*K;e-+
基板面 real estate 2UG>(R:
导线面 conductor side GX=U6n>
元件面 component side hU3sEOm>
焊接面 solder side XAN.Plk
导电图形 conductive pattern ~ike&k{
非导电图形 non-conductive pattern fohZ&f|>
基材 base material %]1te*_
层压板 laminate |\xTcS|d
覆金属箔基材 metal-clad bade material #O{cplh,
覆铜箔层压板 copper-clad laminate (CCL) 'Ck:=V%}g
复合层压板 composite laminate .u'MMe>^
薄层压板 thin laminate A2!pbeG
基体材料 basis material Yx&d\/9
预浸材料 prepreg MDZPp;\)
粘结片 bonding sheet KGGnypx`
预浸粘结片 preimpregnated bonding sheer Uz=ol.E
环氧玻璃基板 epoxy glass substrate rk47$36X
预制内层覆箔板 mass lamination panel 'w=aLu5dY
内层芯板 core material N8DouDq
粘结层 bonding layer E#Ol{6
粘结膜 film adhesive o;21|[z
无支撑胶粘剂膜 unsupported adhesive film qDcoccEf
覆盖层 cover layer (cover lay) ?zf3AZ9
增强板材 stiffener material $rJgBN
铜箔面 copper-clad surface A-, hm=?
去铜箔面 foil removal surface hj\A-Yf
层压板面 unclad laminate surface [{>3"XJ'
基膜面 base film surface KAi_+/]K_
胶粘剂面 adhesive faec @yj~5Gf(j
原始光洁面 plate finish gtIEpYN+
粗面 matt finish 5LZs_%#
剪切板 cut to size panel E:-~SH}
超薄型层压板 ultra thin laminate P4LiU2C
A阶树脂 A-stage resin /([a%,DI
B阶树脂 B-stage resin r?w>x`
C阶树脂 C-stage resin ]E)D})r`#
环氧树脂 epoxy resin u08j9)
,4
酚醛树脂 phenolic resin ,fhF-%Q!g
聚酯树脂 polyester resin eFotV.T!#
聚酰亚胺树脂 polyimide resin noLr185
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin I
Bko"|e@
丙烯酸树脂 acrylic resin 3dJiu
三聚氰胺甲醛树脂 melamine formaldehyde resin ArScJ\/Nwv
多官能环氧树脂 polyfunctional epoxy resin ^Nu j/
溴化环氧树脂 brominated epoxy resin qL
<@PC.5
环氧酚醛 epoxy novolac RR|X4h0.
氟树脂 fluroresin `sA xk
硅树脂 silicone resin ?a*w6,y.
硅烷 silane 138v{Z
聚合物 polymer -0TI7 @
无定形聚合物 amorphous polymer hi4-Z=pl
结晶现象 crystalline polamer )L7[;(gQ
双晶现象 dimorphism =*{7G*tS
共聚物 copolymer A-d<[@d0
合成树脂 synthetic [XH,~JZJj
热固性树脂 thermosetting resin [Page] ]o8yZ x
热塑性树脂 thermoplastic resin p8"C`bCf
感光性树脂 photosensitive resin &kn?=NW
环氧值 epoxy value q(csZ\e=
双氰胺 dicyandiamide Anqt:(
粘结剂 binder 'T(Q
胶粘剂 adesive e&E7_
固化剂 curing agent Vk2%yw>
阻燃剂 flame retardant ~*J
<lln
遮光剂 opaquer hTWZIW@
增塑剂 plasticizers ,%qP
不饱和聚酯 unsatuiated polyester X]n`YF7
聚酯薄膜 polyester wp'[AR}
聚酰亚胺薄膜 polyimide film (PI) !&cfX/y8
聚四氟乙烯 polytetrafluoetylene (PTFE) Y+kuj],h
增强材料 reinforcing material f,|;eF-Z
折痕 crease epG]$T![
云织 waviness BG)zkn$
鱼眼 fish eye 2Nx:Y+[
毛圈长 feather length [mNu m3e
厚薄段 mark 0LYf0^P
裂缝 split &
P%#
捻度 twist of yarn }D`ZWTjDay
浸润剂含量 size content Z15=vsV
浸润剂残留量 size residue &y7=tEV
处理剂含量 finish level !I\eIV>0b
偶联剂 couplint agent Pa#Jwo
断裂长 breaking length :4x6dYNU
吸水高度 height of capillary rise F_i"v5#
湿强度保留率 wet strength retention \So)g)K
白度 whitenness e>6W ^ )
导电箔 conductive foil 9V~hz (^
铜箔 copper foil 6xY6EC
压延铜箔 rolled copper foil qrjSG%i~J7
光面 shiny side #T8jHnI
粗糙面 matte side lxbC 7?O
处理面 treated side M= |is*t
防锈处理 stain proofing LNrM`3%2-
双面处理铜箔 double treated foil "=KFag
模拟 simulation >|gXE>
逻辑模拟 logic simulation O*lIZ,!n
电路模拟 circit simulation 7xY&7 x(v
时序模拟 timing simulation GMkni'pV
模块化 modularization {.0I!oWv
设计原点 design origin +fKV/tSWi
优化(设计) optimization (design) f}KV4'n
供设计优化坐标轴 predominant axis KY0<N9{
表格原点 table origin XMykUr e|
元件安置 component positioning A>315!d"
比例因子 scaling factor ;49sou
扫描填充 scan filling "pcr-?L
矩形填充 rectangle filling fZS'e{V
填充域 region filling H;@0L}Nu+}
实体设计 physical design k^cnNx
逻辑设计 logic design 6' \M:'<0e
逻辑电路 logic circuit k2 _y84;D
层次设计 hierarchical design *-.`Q
自顶向下设计 top-down design 69Z`mR
自底向上设计 bottom-up design j9w{=( MV
费用矩阵 cost metrix t$p%UyVE
元件密度 component density QNv5CQ&
自由度 degrees freedom AAuwE&Gg
出度 out going degree Tc>g+eS
入度 incoming degree G(o6/
曼哈顿距离 manhatton distance BT^=p
欧几里德距离 euclidean distance ()$m9%x
网络 network JlawkA
阵列 array 09 f;z
段 segment {w,<igh
逻辑 logic kmlO}0
逻辑设计自动化 logic design automation 33a}M;vx
分线 separated time a*_&[
分层 separated layer qI
tbY%
定顺序 definite sequence q$s)(D
导线(通道) conduction (track) iCGHcN^3
导线(体)宽度 conductor width Lm.N
{NV'
导线距离 conductor spacing `#r/L@QI
导线层 conductor layer $]W*;MTI}
导线宽度/间距 conductor line/space "jq6FT)O
第一导线层 conductor layer No.1 >* F#ZZv}p
圆形盘 round pad Qw_>
l}k/
方形盘 square pad MCIuP`sC|
菱形盘 diamond pad Y{@foIZ
长方形焊盘 oblong pad aW;)-0+
子弹形盘 bullet pad T
:^OW5 d
泪滴盘 teardrop pad f'7/Wj
雪人盘 snowman pad }N,v&B
形盘 V-shaped pad V y1Wb/ d
环形盘 annular pad V' i@N
非圆形盘 non-circular pad BvH I}=
隔离盘 isolation pad ycEp,V;[Z
非功能连接盘 monfunctional pad h CV(O2jL
偏置连接盘 offset land sebuuL.l0<
腹(背)裸盘 back-bard land 5-'Z.[ImB?
盘址 anchoring spaur OMab!
连接盘图形 land pattern V=PK)FJ
连接盘网格阵列 land grid array JuRWR0@`
孔环 annular ring dDA&\BuS
元件孔 component hole %RzkP}1>E
安装孔 mounting hole Ly1t'{"7
支撑孔 supported hole 5l(@p7_+
非支撑孔 unsupported hole |="Y3}a
导通孔 via })q8{Qj!
镀通孔 plated through hole (PTH) 9`@}KnvB?
余隙孔 access hole &4M,)Q (
盲孔 blind via (hole) `Cy;/95m
埋孔 buried via hole |h((SreO
埋,盲孔 buried blind via >=1UhHFNI
任意层内部导通孔 any layer inner via hole l~@ -oE
全部钻孔 all drilled hole X&@>M}
定位孔 toaling hole )sK_k
U{\
无连接盘孔 landless hole B7%m7GM
中间孔 interstitial hole
[Z1,~(3
无连接盘导通孔 landless via hole 9/R=_y-
引导孔 pilot hole 3#F"UG2,_
端接全隙孔 terminal clearomee hole [W dxMU
准尺寸孔 dimensioned hole [Page] wNh\pWA
在连接盘中导通孔 via-in-pad sd*NY
孔位 hole location w'mn O'%
孔密度 hole density [LbCG
孔图 hole pattern wc}4:~
钻孔图 drill drawing 1=~ ##/at
装配图assembly drawing aLQ]2m
参考基准 datum referan !;Ctz'wz
1) 元件设备 @ "CP@^
=RlAOgJ
三绕组变压器:three-column transformer ThrClnTrans lXnv(3j3*s
双绕组变压器:double-column transformer DblClmnTrans ag!q:6&
电容器:Capacitor ,twm)%caU
并联电容器:shunt capacitor Z22#lF\ N
电抗器:Reactor C3K")BO!
母线:Busbar """eU,"
输电线:TransmissionLine nfE4rIE4
发电厂:power plant TLz>|gr
断路器:Breaker <sjz_::V8R
刀闸(隔离开关):Isolator T{F
' Y%
分接头:tap 3nUC,T%
电动机:motor N_VWA.JHt
(2) 状态参数 8J2UUVA`1
y"w`yl{_
有功:active power ovvg"/>L
无功:reactive power &Z7 NF|
电流:current >T^BD'z@'
容量:capacity L@G~9{U>
电压:voltage <VT|R~
档位:tap position ~eekv5
有功损耗:reactive loss
.V l
无功损耗:active loss {9nH#yv
功率因数:power-factor A$::|2~
功率:power (Lkcx06e
功角:power-angle MQo/R,F }
电压等级:voltage grade h)X"<a++N
空载损耗:no-load loss 1X#gHstD
铁损:iron loss E*}1_,q)
铜损:copper loss QU)AgF[
空载电流:no-load current kAAD&t;w
阻抗:impedance l -6W]\v Z
正序阻抗:positive sequence impedance L:UPS&)
负序阻抗:negative sequence impedance iE"+-z\U
零序阻抗:zero sequence impedance nh/%0=S
电阻:resistor TK Ec^
电抗:reactance QG;V\2T2[
电导:conductance 5oOFl
电纳:susceptance Yj*!t1qm
无功负载:reactive load 或者QLoad %I%OHs
有功负载: active load PLoad JP6+h>ft
遥测:YC(telemetering) KU87WpjX
遥信:YX 1u_< 1X3
励磁电流(转子电流):magnetizing current OZ Hfd7K4A
定子:stator [d6TwKv
功角:power-angle ?.69nN
上限:upper limit OUtMel_
下限:lower limit RjGJfN{
并列的:apposable }r;#|=HR
高压: high voltage w(!COu
低压:low voltage GFYHt!&[\
中压:middle voltage x:`"tJa
电力系统 power system K,f-
w2!
发电机 generator H>|*D~RdT
励磁 excitation l1"*
励磁器 excitor s.>;(RiJd
电压 voltage $ I|K<slV
电流 current (L!#2Jy
母线 bus x^6b$>1
变压器 transformer kD_616
升压变压器 step-up transformer 7\EY&KI"0
高压侧 high side G"F:68
输电系统 power transmission system _F tI2G9
输电线 transmission line NFBhnNH+
固定串联电容补偿fixed series capacitor compensation $5J~4B"%3
稳定 stability !2]'S=Y
电压稳定 voltage stability 5>S)+p
功角稳定 angle stability &>3AL,
暂态稳定 transient stability 7H_*1_%ZQ
电厂 power plant "Rr650w[
能量输送 power transfer G[a&r
交流 AC OEXa^M4x
装机容量 installed capacity V})b.\"F
电网 power system p JM&R<i:
落点 drop point 2D'$
开关站 switch station ac#I$V-
双回同杆并架 double-circuit lines on the same tower U$wD'v3pw
变电站 transformer substation *dX
7
补偿度 degree of compensation G
q2@37U
高抗 high voltage shunt reactor 7uxUqM
无功补偿 reactive power compensation \CZD.2p#&
故障 fault 50NLguE
调节 regulation d\j[O9W>
裕度 magin 1'BC
R
三相故障 three phase fault 2#xz,RM.
故障切除时间 fault clearing time iJ!p9E*(
极限切除时间 critical clearing time [IPXU9&Q
切机 generator triping =~
[RG
高顶值 high limited value +L|-W9"@3
强行励磁 reinforced excitation
3 cF4xUIZ
线路补偿器 LDC(line drop compensation) \'-E[xNcWI
机端 generator terminal d9.~W5^fC
静态 static (state) !6l}s$1i|
动态 dynamic (state) T<K/bzB3z
单机无穷大系统 one machine - infinity bus system th`pf
机端电压控制 AVR aW;DfH
电抗 reactance &a?k1R>
电阻 resistance ,]_<8@R
功角 power angle 9;`E,w
有功(功率) active power cX4I+Mf
无功(功率) reactive power 3D2i32Y@!
功率因数 power factor Wr;9Mz&{
无功电流 reactive current u/(~ewI
下降特性 droop characteristics 7'idjcR
斜率 slope O7# 8g$ZIv
额定 rating ){$*<#&H
变比 ratio ISi^BFU
参考值 reference value ytyB:# J
电压互感器 PT +CXtTasP
分接头 tap pra0:oHN
下降率 droop rate NM0s*s42
仿真分析 simulation analysis ANq3r(
传递函数 transfer function IT:8k5(L5j
框图 block diagram -DL"Yw}
受端 receive-side nr- 32u
裕度 margin Fb\ E39
同步 synchronization 4{CeV7
失去同步 loss of synchronization ';KWHk8C
阻尼 damping 8\Kpc;zb
摇摆 swing KK,
t !a
保护断路器 circuit breaker w5*
Z\t5
电阻:resistance ~+CEek
电抗:reactance F-%Hw
阻抗:impedance e)*-<AGwC
电导:conductance i 2l/y,UX
电纳:susceptance