1 backplane 背板 }0y2k7^]
2 Band gap voltage reference 带隙电压参考 ?:sk [f6
3 benchtop supply 工作台电源 %0y_WIjz
4 Block Diagram 方块图 5 Bode Plot 波特图 i9RAbt Q}
6 Bootstrap 自举 o_i N(K
7 Bottom FET Bottom FET :637MD>5lO
8 bucket capcitor 桶形电容 8q}955Nl
9 chassis 机架 ij=_h_nA
10 Combi-sense Combi-sense *eF'<._[U
11 constant current source 恒流源 A$7j B4
12 Core Sataration 铁芯饱和 sB~ |V
<
13 crossover frequency 交叉频率 P]~apMi:
14 current ripple 纹波电流 762c`aP_(
15 Cycle by Cycle 逐周期 @mD$Z09~
16 cycle skipping 周期跳步 ?@>PKUv{
17 Dead Time 死区时间 j;7:aM"BQW
18 DIE Temperature 核心温度 I2&R+~ktR
19 Disable 非使能,无效,禁用,关断 >z"\l
20 dominant pole 主极点 PxvD0GTW
21 Enable 使能,有效,启用 ;%ng])w=;
22 ESD Rating ESD额定值 q*^m8
23 Evaluation Board 评估板 wni^qs.i@3
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. N 4!18{/2
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 \cr)O^&
25 Failling edge 下降沿 ?niv}/'%O
26 figure of merit 品质因数 u6t%*''
27 float charge voltage 浮充电压 znkc@8_4
28 flyback power stage 反驰式功率级 .rcXxV@f
29 forward voltage drop 前向压降 >53Hqzm&
30 free-running 自由运行 fi
tsu"G
31 Freewheel diode 续流二极管 d5YL=o
32 Full load 满负载 33 gate drive 栅极驱动 9< |nJt
34 gate drive stage 栅极驱动级 yt4sg/]:
35 gerber plot Gerber 图 N hY`_?)
36 ground plane 接地层 HOr.(gL!
37 Henry 电感单位:亨利 <1pRAN0
38 Human Body Model 人体模式 =^5#o)~BB
39 Hysteresis 滞回 %_L~"E 2e
40 inrush current 涌入电流 _qf$dGqc
41 Inverting 反相 M/abd 7q
42 jittery 抖动 8+n*S$
43 Junction 结点 _, r6t
44 Kelvin connection 开尔文连接 kZK1{
45 Lead Frame 引脚框架 mb?r{WCi
46 Lead Free 无铅 mD_sf_2>
47 level-shift 电平移动 C9j3|]nyL
48 Line regulation 电源调整率 Njmb{L]Cps
49 load regulation 负载调整率 aInh?-
50 Lot Number 批号 MFtC2*
51 Low Dropout 低压差 "MPr'3
52 Miller 密勒 53 node 节点 g@Z7f y7
54 Non-Inverting 非反相 E5X#9;U8E"
55 novel 新颖的 ($X2SIZh
56 off state 关断状态 g/W&Ap;qVL
57 Operating supply voltage 电源工作电压 #GfM!<q<
58 out drive stage 输出驱动级 (Rs|"];?Z
59 Out of Phase 异相 7csMk5NU'<
60 Part Number 产品型号 5?34<B
61 pass transistor pass transistor %%{f-\-7Ig
62 P-channel MOSFET P沟道MOSFET 3>#io^35
63 Phase margin 相位裕度 l,k.Jo5
64 Phase Node 开关节点 g?gF*^_0
65 portable electronics 便携式电子设备 K9_@[}Ge
66 power down 掉电 w gkY\Q
67 Power Good 电源正常 bNG7A[|B
68 Power Groud 功率地 E G J/r
69 Power Save Mode 节电模式 9zNMv-
70 Power up 上电 YfUo=ku
71 pull down 下拉 ``,q[|
72 pull up 上拉 Vif)e4{Pn
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) U1=]iG<%
74 push pull converter 推挽转换器 _ YcIGOL
75 ramp down 斜降 M6lNdK
76 ramp up 斜升 zxrbEE Q
77 redundant diode 冗余二极管 4CK$W`V
78 resistive divider 电阻分压器
, D}
79 ringing 振 铃 D9r4oRkP*
80 ripple current 纹波电流 2&0#'Tb
81 rising edge 上升沿 _}l7f
82 sense resistor 检测电阻 #^9a[ZLj0
83 Sequenced Power Supplys 序列电源 3a?dNwM@
84 shoot-through 直通,同时导通 *@fVog r^
85 stray inductances. 杂散电感 <.U(%`|
86 sub-circuit 子电路 W0LJXp-v
87 substrate 基板 +-PFISa<r
88 Telecom 电信 OP98 sd&T
89 Thermal Information 热性能信息 4v#A#5+O E
90 thermal slug 散热片 a/gr1
91 Threshold 阈值 "
XlXu
92 timing resistor 振荡电阻 T5+
(F z
93 Top FET Top FET >8EmfjUoc
94 Trace 线路,走线,引线 XSktbk
95 Transfer function 传递函数 |D~#9
96 Trip Point 跳变点 p sAr>:\3
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) '&F
PkT:5
98 Under Voltage Lock Out (UVLO) 欠压锁定 Eikt,
99 Voltage Reference 电压参考 <xwaFZ
100 voltage-second product 伏秒积 -f=4\3y3p
101 zero-pole frequency compensation 零极点频率补偿 $c];&)7q
102 beat frequency 拍频 nzl3<Ar
103 one shots 单击电路 4=ZN4=(_[
104 scaling 缩放 t}2M8ue(&
105 ESR 等效串联电阻 [Page] Ht7v+lY90^
106 Ground 地电位 (2'q~Z+>'
107 trimmed bandgap 平衡带隙 F>"B7:P1:Q
108 dropout voltage 压差 r^ +n06[
109 large bulk capacitance 大容量电容 f=Kt[|%'e
110 circuit breaker 断路器 N3|aNQ=X0
111 charge pump 电荷泵 RO8]R2A
112 overshoot 过冲 ZWy,NN1
4@"n7/<
印制电路printed circuit s AlOX`t
印制线路 printed wiring vf
h*`G$
印制板 printed board Z]k+dJ[-
印制板电路 printed circuit board Dlx-mm_
印制线路板 printed wiring board r95$( N
印制元件 printed component 3NlG,e'T2
印制接点 printed contact G~19Vv*;
印制板装配 printed board assembly y9-}LET3j
板 board ~.<}/GP] _
刚性印制板 rigid printed board OIrr'uNH
挠性印制电路 flexible printed circuit 2D"\Ox
挠性印制线路 flexible printed wiring {>zQW{!
齐平印制板 flush printed board 3R[,,WAj$
金属芯印制板 metal core printed board Ku;8Mx{
金属基印制板 metal base printed board <'92\O
多重布线印制板 mulit-wiring printed board c7/fQc)h4d
塑电路板 molded circuit board j WerX -$
散线印制板 discrete wiring board xXNLUP
微线印制板 micro wire board W*Ce1
积层印制板 buile-up printed board Y%YPR=j~ &
表面层合电路板 surface laminar circuit RiCzH
埋入凸块连印制板 B2it printed board XFcIBWS
载芯片板 chip on board E@S5|CM
埋电阻板 buried resistance board :~B'6b
母板 mother board b`X"yg+
子板 daughter board \I~9%QJ>
背板 backplane hxj[gE'R(
裸板 bare board nuLxOd *n
键盘板夹心板 copper-invar-copper board 6l?\iE
动态挠性板 dynamic flex board .="[In'
静态挠性板 static flex board D3kx&AR
可断拼板 break-away planel 6)Dp2
电缆 cable q)KLf\
挠性扁平电缆 flexible flat cable (FFC) m/>z}d05h
薄膜开关 membrane switch y3)R:h4AH
混合电路 hybrid circuit F ][QH\N
厚膜 thick film .LEn~ 8
厚膜电路 thick film circuit PU{7s
薄膜 thin film G~|Z(}H
薄膜混合电路 thin film hybrid circuit #e(P~'A0
互连 interconnection X~5kgq0"
导线 conductor trace line h?2 :'Vu]
齐平导线 flush conductor K)8N8Js(
传输线 transmission line F` gQ[
跨交 crossover oB]
板边插头 edge-board contact SPU_@ Pk
增强板 stiffener O)WduhlGQ
基底 substrate >XiTl;UU
基板面 real estate x1nqhSaD
导线面 conductor side C`>|D [
元件面 component side /?Fa<{
焊接面 solder side 9t^Q_ [hG
导电图形 conductive pattern Q)b*;
@
非导电图形 non-conductive pattern ~i)IY1m"
基材 base material qOd*9AS'|M
层压板 laminate PgF7ug%,@C
覆金属箔基材 metal-clad bade material om'DaG`A
覆铜箔层压板 copper-clad laminate (CCL) 0(~,U!g[=
复合层压板 composite laminate 2V 9vS
薄层压板 thin laminate tlz)V1L
基体材料 basis material v5!G/TZ1
预浸材料 prepreg d
%Z+.O
粘结片 bonding sheet K,\Bj/V(
预浸粘结片 preimpregnated bonding sheer ><Z`)}f
环氧玻璃基板 epoxy glass substrate G~;hD-D~.
预制内层覆箔板 mass lamination panel Sxw%6Va]p
内层芯板 core material p .^#mN
粘结层 bonding layer muqIh!nn
粘结膜 film adhesive NiTLQ"~e
无支撑胶粘剂膜 unsupported adhesive film 47 _";g@X
覆盖层 cover layer (cover lay) (e$/@3*
增强板材 stiffener material G[=8Ko0U+n
铜箔面 copper-clad surface d5ivtK?
去铜箔面 foil removal surface umD[4aP~;
层压板面 unclad laminate surface ,/ P)c*at5
基膜面 base film surface |2eF~tJqc
胶粘剂面 adhesive faec ssy+x;<x,
原始光洁面 plate finish C3
m#v[+
粗面 matt finish v<qiu>sbz}
剪切板 cut to size panel fm%1vM$[J
超薄型层压板 ultra thin laminate W~&PGmRI
A阶树脂 A-stage resin M;i4ss,}!
B阶树脂 B-stage resin ix=H=U]Q{
C阶树脂 C-stage resin I3ZbHb-)_,
环氧树脂 epoxy resin {} 11U0
酚醛树脂 phenolic resin i+z;tF`
聚酯树脂 polyester resin ? <.U,
聚酰亚胺树脂 polyimide resin Tpv]c
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin mjd9]HgN
丙烯酸树脂 acrylic resin -bHfo%"^TT
三聚氰胺甲醛树脂 melamine formaldehyde resin 68^5X"OGF
多官能环氧树脂 polyfunctional epoxy resin ]EzX$T
溴化环氧树脂 brominated epoxy resin JyBsOC3
环氧酚醛 epoxy novolac 8VwByk8
氟树脂 fluroresin <2Qh5umQ
硅树脂 silicone resin `ju r`^S|
硅烷 silane aTceGyWzl
聚合物 polymer kM`!'0kt
无定形聚合物 amorphous polymer
IiV#V
结晶现象 crystalline polamer |# zznT"
双晶现象 dimorphism .7HnWKUV
共聚物 copolymer Hlw0ia
合成树脂 synthetic E
Fx@O
热固性树脂 thermosetting resin [Page] &x(^=sTHI
热塑性树脂 thermoplastic resin Z-!W#
感光性树脂 photosensitive resin 79>8tOuo
环氧值 epoxy value 7Lr}Y/1=
双氰胺 dicyandiamide ^'|\8
粘结剂 binder 1z\>>N$7B
胶粘剂 adesive MO{6B#(<F
固化剂 curing agent `2Buf8|a,
阻燃剂 flame retardant N2"4dVV;
遮光剂 opaquer cXO_g!&2A
增塑剂 plasticizers b (,X3x*
不饱和聚酯 unsatuiated polyester o.}?K>5
聚酯薄膜 polyester $cLtAo^W
聚酰亚胺薄膜 polyimide film (PI) ?`hk0q X3
聚四氟乙烯 polytetrafluoetylene (PTFE) qR~s&SC#
增强材料 reinforcing material K%: :
折痕 crease "Iy @PR?>
云织 waviness %EuXL% B
鱼眼 fish eye p1=sDsLL
毛圈长 feather length ql%>)k /x
厚薄段 mark eTc0u;{V
裂缝 split r"a4;&mf
捻度 twist of yarn 2
AZ[gr@c
浸润剂含量 size content Xf.w(-
浸润剂残留量 size residue 5@+8*Fdk
处理剂含量 finish level 5Dy800.B2
偶联剂 couplint agent /:a~;i
断裂长 breaking length sa~.qmqu
吸水高度 height of capillary rise >sE5zj|V
湿强度保留率 wet strength retention Aa5IccR
白度 whitenness /hue]ZaQq
导电箔 conductive foil <dTo-P
铜箔 copper foil y?-wjJS>
压延铜箔 rolled copper foil #;
I8 aMb
光面 shiny side I3xx}^V
粗糙面 matte side 4QnJ;&~
处理面 treated side ?o h3t
防锈处理 stain proofing jZ <*XX
双面处理铜箔 double treated foil ^P-!pK*
模拟 simulation =>6Z"LD(
逻辑模拟 logic simulation ]?L?q2>&
电路模拟 circit simulation xA nAW
时序模拟 timing simulation K \}xb2s
模块化 modularization 5Mb1==/R
设计原点 design origin %Gn(b1X
优化(设计) optimization (design) %ma1LN[
供设计优化坐标轴 predominant axis {y|y68y0+
表格原点 table origin EIl _QV6
元件安置 component positioning O{rgZ/4Au
比例因子 scaling factor S8" h9|
扫描填充 scan filling SZ-% 0z
矩形填充 rectangle filling >L anuv)O
填充域 region filling Nuk\8C
实体设计 physical design FXFQ@q*}v
逻辑设计 logic design :Ke~b_$Uy-
逻辑电路 logic circuit p/WEQ2
层次设计 hierarchical design &adKKYN
自顶向下设计 top-down design ^!|BKH8>f%
自底向上设计 bottom-up design u~?]/-.TY
费用矩阵 cost metrix J3Q.6e=7
元件密度 component density G7C9FV bR
自由度 degrees freedom bTKzwNx
出度 out going degree SDV} bN
入度 incoming degree bt#=p7W
曼哈顿距离 manhatton distance .+aSa?h_
欧几里德距离 euclidean distance 1K,bmb xRt
网络 network 8(%iYs$
阵列 array F1?@tcr'
段 segment D?]aYCT
逻辑 logic b n^^|i
逻辑设计自动化 logic design automation K^H=E
分线 separated time CQ sVGn{x
分层 separated layer }(J6zo9(x
定顺序 definite sequence
~J"*ahl
导线(通道) conduction (track) CN:
36
导线(体)宽度 conductor width Jx_ OT C
导线距离 conductor spacing LP_!g
导线层 conductor layer t,R5FoV
导线宽度/间距 conductor line/space 4|Jy]
第一导线层 conductor layer No.1 k$o6~u 2&
圆形盘 round pad w0moC9#$?
方形盘 square pad k`.-PU
菱形盘 diamond pad Abce]-E
长方形焊盘 oblong pad 5nqj
子弹形盘 bullet pad &e_M \D
泪滴盘 teardrop pad
61T"K
雪人盘 snowman pad Lc*i[J<s
形盘 V-shaped pad V *BBP"_$
环形盘 annular pad L3X>v3CZ5
非圆形盘 non-circular pad nb'],({:9
隔离盘 isolation pad E'Egc4Z2=l
非功能连接盘 monfunctional pad |...T
4:^Y
偏置连接盘 offset land kYxn5+~
腹(背)裸盘 back-bard land >F,~ QHcz
盘址 anchoring spaur |??uVA)\X
连接盘图形 land pattern ]Rnr>_>x;
连接盘网格阵列 land grid array <+sv7"a
孔环 annular ring ]t7<$L
元件孔 component hole $CHri|
安装孔 mounting hole Uh?SDay
支撑孔 supported hole !K(0)~u
非支撑孔 unsupported hole =wU08}
导通孔 via H
<F6o-*
镀通孔 plated through hole (PTH) $+S'Boo
余隙孔 access hole u Dm=W36
盲孔 blind via (hole) ThwE1M
埋孔 buried via hole C#>c(-p>RC
埋,盲孔 buried blind via |nz,srr~
任意层内部导通孔 any layer inner via hole 0l^-[jK)
全部钻孔 all drilled hole -`iZBC50
定位孔 toaling hole (Pc:A!}
无连接盘孔 landless hole "-A@>*g
中间孔 interstitial hole uQ9P6w=Nt
无连接盘导通孔 landless via hole :%xiH%C>
引导孔 pilot hole v~ZdMQvwt
端接全隙孔 terminal clearomee hole s+C&\$E
准尺寸孔 dimensioned hole [Page] %{&yXi:mS
在连接盘中导通孔 via-in-pad id&;
孔位 hole location ~naL1o_FZ
孔密度 hole density Mh[;E'C6
孔图 hole pattern &'c1"%*%8>
钻孔图 drill drawing HWFo9as""v
装配图assembly drawing uUwwR(R
参考基准 datum referan <.s[x~b\`
1) 元件设备 #G$_\bt
+<|6y46
三绕组变压器:three-column transformer ThrClnTrans wb.47S8
双绕组变压器:double-column transformer DblClmnTrans 1 nX/5z_U
电容器:Capacitor @lDoMm,m'
并联电容器:shunt capacitor =d.Z:L9d
电抗器:Reactor -fT]}T6=
母线:Busbar 536H*HdN
输电线:TransmissionLine (.m0hN!~u
发电厂:power plant *s S7^OZ*
断路器:Breaker *Jmy:C<>
刀闸(隔离开关):Isolator R4]t D|
分接头:tap z6ArSLlZ
电动机:motor |.)oV;9
(2) 状态参数 2"c$#N
4nXS}bW f
有功:active power D7olu29
无功:reactive power f,k'gM{K
电流:current =UM30
P/
容量:capacity op/HZa
电压:voltage :hwZz2Dhi
档位:tap position l~!\<, !
有功损耗:reactive loss O!\P]W4r$
无功损耗:active loss 0.~QA+BD:S
功率因数:power-factor S c_*L<$
功率:power gieTkZ
功角:power-angle [C,<Q
电压等级:voltage grade i"r&CS)sT
空载损耗:no-load loss vjhd|
铁损:iron loss (l TM5qC
铜损:copper loss (es+VI2!&C
空载电流:no-load current FL,jlE_
阻抗:impedance ?nn`ud?f
正序阻抗:positive sequence impedance i"_)91RA
负序阻抗:negative sequence impedance mawomna
零序阻抗:zero sequence impedance \rF6"24t6
电阻:resistor <_dyUiT$J
电抗:reactance 4askQV &hj
电导:conductance (vB aem9
电纳:susceptance ~>VEg3#F
无功负载:reactive load 或者QLoad M$B9?N6
有功负载: active load PLoad 1y2D]h /'
遥测:YC(telemetering) _[<R<&jG
遥信:YX j#f+0
励磁电流(转子电流):magnetizing current w-C~
Ik
定子:stator GLp2
?fon
功角:power-angle ryB^$Kh,,
上限:upper limit o8-BTq8
下限:lower limit r/$+'~apTk
并列的:apposable 9TIyY`2!
高压: high voltage -icOg6%
低压:low voltage *`mPPts}
中压:middle voltage 2E33m*C2
电力系统 power system &Gp@,t
发电机 generator Z3g6?2w6
励磁 excitation *p`0dvXG2
励磁器 excitor AjKP -[
电压 voltage HgvgO\`]
电流 current Wb+^Ue
母线 bus l"5$6h
变压器 transformer r Lg(J|^
升压变压器 step-up transformer K_{f6c<
高压侧 high side w,bILv)
输电系统 power transmission system F[<EXLQ
输电线 transmission line }fpK{db
固定串联电容补偿fixed series capacitor compensation &tB|l_p_-p
稳定 stability Jkzt=6WZ0
电压稳定 voltage stability ?&I gD.
功角稳定 angle stability bZHuEh2w
暂态稳定 transient stability #+N\u*-S
电厂 power plant L>5VnzS I
能量输送 power transfer +0rMv
交流 AC guz{DBlK
装机容量 installed capacity u/Fa+S
电网 power system "u~l+aW0
落点 drop point QZB2yK3]h
开关站 switch station Q/m))!ikMt
双回同杆并架 double-circuit lines on the same tower .;yy=
Rj
变电站 transformer substation M>D 3NY[,
补偿度 degree of compensation IT!
a)d
高抗 high voltage shunt reactor )z&0 g2Am
无功补偿 reactive power compensation kT@RA}
故障 fault :@jhe8'w
调节 regulation )SQ*"X4"
裕度 magin d"<Q}Ay
三相故障 three phase fault U_v{Vs
故障切除时间 fault clearing time Sj]k5(&
极限切除时间 critical clearing time 0#lw?sv
切机 generator triping hLPg=8nJ_
高顶值 high limited value X|K"p(N
强行励磁 reinforced excitation Rq gH,AN
线路补偿器 LDC(line drop compensation) +Mc kR
机端 generator terminal ,mEFp_a+
静态 static (state) vCyvy^s-I
动态 dynamic (state) m^rgzx19?
单机无穷大系统 one machine - infinity bus system 5JW+&XA
机端电压控制 AVR }hrLM[
电抗 reactance R#i|n<x
电阻 resistance !<H[h4g
功角 power angle A"x1MjuqLM
有功(功率) active power Vo}3E]
无功(功率) reactive power v+U(
#"
功率因数 power factor oEbgyT gB
无功电流 reactive current &f'\9lO
下降特性 droop characteristics j2# nCU54Z
斜率 slope Qna
^Ry?6)
额定 rating /%C6e
)7BL
变比 ratio "u5Hm ^H
参考值 reference value xnmIo?
hC
电压互感器 PT :-ZE~bHJ
分接头 tap Y$b4Ga9j
下降率 droop rate CXks~b3SD
仿真分析 simulation analysis ;"SnCBt:>
传递函数 transfer function <8Ek-aNNt
框图 block diagram WLW'.
受端 receive-side /AV
[g^x2
裕度 margin =Xh^@OR
同步 synchronization _/ bF t6
失去同步 loss of synchronization F+,X%$A#?
阻尼 damping ljVtFm<
摇摆 swing []:;8fY
保护断路器 circuit breaker )QE7$|s
电阻:resistance .w/#S-at
电抗:reactance fL.;-
阻抗:impedance r?Jxl<
电导:conductance [tsi8r=T
电纳:susceptance