1 backplane 背板 6jy n,GU
2 Band gap voltage reference 带隙电压参考 JNA}EY^2I.
3 benchtop supply 工作台电源 X0r#,u
4 Block Diagram 方块图 5 Bode Plot 波特图 <=GzK:4L
6 Bootstrap 自举 9rvxp;
7 Bottom FET Bottom FET ,h)T(
8 bucket capcitor 桶形电容 w
_6Y+
9 chassis 机架 Xy(SzJ%
10 Combi-sense Combi-sense 5l7L@Ey
11 constant current source 恒流源 Xk9r"RmiOb
12 Core Sataration 铁芯饱和 \]e w@C
13 crossover frequency 交叉频率 xYkgNXGs5
14 current ripple 纹波电流 NcY0pAR*
15 Cycle by Cycle 逐周期 C,e$g
16 cycle skipping 周期跳步 fKK-c9F
17 Dead Time 死区时间 tEs[zo+DR-
18 DIE Temperature 核心温度 (A<sFw?
19 Disable 非使能,无效,禁用,关断 L|xen*O
20 dominant pole 主极点 +\(ay"+ d
21 Enable 使能,有效,启用 }W>[OY0^A
22 ESD Rating ESD额定值 d}B_ll#j-
23 Evaluation Board 评估板 ?0)XS<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. a.*j8T
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 V;+$/>J`vB
25 Failling edge 下降沿 ug3lMN4UX
26 figure of merit 品质因数 ah$7
Oudj
27 float charge voltage 浮充电压 +Gwe%p Q
28 flyback power stage 反驰式功率级 v>cE59('0
29 forward voltage drop 前向压降 ';T5[l,
30 free-running 自由运行 ~esEql=Q3'
31 Freewheel diode 续流二极管 $6x:aG*F
32 Full load 满负载 33 gate drive 栅极驱动 M[3w EX^
34 gate drive stage 栅极驱动级 k)GuMw
35 gerber plot Gerber 图 1AkHig,
36 ground plane 接地层 `m0Uj9)#
37 Henry 电感单位:亨利 5Yibv6:3a
38 Human Body Model 人体模式 YH+\rb_
39 Hysteresis 滞回 ^3@a0J=F
40 inrush current 涌入电流 $j2)_(<A%Q
41 Inverting 反相 6!D
42 jittery 抖动 /Rcd}rO
43 Junction 结点 la{:RlW
44 Kelvin connection 开尔文连接 W[Ew6)1T
45 Lead Frame 引脚框架 ^9f`3~!#bc
46 Lead Free 无铅 |l \/ {F
47 level-shift 电平移动 nX aX=
48 Line regulation 电源调整率 FveK|-
49 load regulation 负载调整率 +6Fdi*:
50 Lot Number 批号 jO
N}&/
51 Low Dropout 低压差 kvVz-PJy
52 Miller 密勒 53 node 节点 cb&In<q
54 Non-Inverting 非反相 "?(Fb_}i
55 novel 新颖的 ITY!=>S-
56 off state 关断状态 v?"ee&Y6
57 Operating supply voltage 电源工作电压 [?6D1b[
58 out drive stage 输出驱动级 Z/UVKJm>:
59 Out of Phase 异相 <>/MKMq!
60 Part Number 产品型号 g<tTZD\g
61 pass transistor pass transistor N}<U[nh'
62 P-channel MOSFET P沟道MOSFET `V2j[Fz
63 Phase margin 相位裕度 ~g6[ [
64 Phase Node 开关节点 t SLl'XeN
65 portable electronics 便携式电子设备 Z8n%=(He
66 power down 掉电 { RX|
67 Power Good 电源正常 hg/&[/eodm
68 Power Groud 功率地 9NXiCP9A
69 Power Save Mode 节电模式 (mr`?LI}
70 Power up 上电 l'8TA~
71 pull down 下拉 m)2hl~o_
72 pull up 上拉 s-S"\zX\D
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) MQMy Z:
74 push pull converter 推挽转换器 $5(%M8qmQ
75 ramp down 斜降 5!{g6=(
76 ramp up 斜升 aT1W]i
77 redundant diode 冗余二极管 `mTxtuid{
78 resistive divider 电阻分压器 yk6UuI^/
79 ringing 振 铃 r>@/XYK&\
80 ripple current 纹波电流 6U3@-+lF
81 rising edge 上升沿 uy\+#:44d
82 sense resistor 检测电阻 z`7C)p:
83 Sequenced Power Supplys 序列电源 ~}ZX^l&k{P
84 shoot-through 直通,同时导通 UimZ/\r
85 stray inductances. 杂散电感 S.>9tV2Ca
86 sub-circuit 子电路 6_><W"r:]
87 substrate 基板 o*BI^4
88 Telecom 电信 y9 '3vZ
89 Thermal Information 热性能信息 ~m&oa@*=y
90 thermal slug 散热片 e(N <Mf
91 Threshold 阈值 w'>v@`y
92 timing resistor 振荡电阻 )BrqE uX@"
93 Top FET Top FET -^"?a]B
94 Trace 线路,走线,引线 :m)?+
95 Transfer function 传递函数 ]}c=U@D,9
96 Trip Point 跳变点 }=4".V`-o
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) f#MN-1[67
98 Under Voltage Lock Out (UVLO) 欠压锁定 9}_f\Bs
99 Voltage Reference 电压参考 )fr\V."
100 voltage-second product 伏秒积 \~1+T
101 zero-pole frequency compensation 零极点频率补偿 bv];Gk*Z-
102 beat frequency 拍频 \./2Qc,
103 one shots 单击电路 2p[3Ap
104 scaling 缩放 |mA*[?ye@
105 ESR 等效串联电阻 [Page] yln.E vJjD
106 Ground 地电位 |{"7/~*[
107 trimmed bandgap 平衡带隙 B 1.@K }
108 dropout voltage 压差 8R D)yRJ
109 large bulk capacitance 大容量电容 :AGQkJb
110 circuit breaker 断路器 l!'iLq"K(
111 charge pump 电荷泵 K.zs;^
112 overshoot 过冲 }H.vH
((q(Q9(F
印制电路printed circuit :]jtV~E\
印制线路 printed wiring {`
印制板 printed board t9{EO#o'k
印制板电路 printed circuit board ajr8tp'
印制线路板 printed wiring board @ U|u _S@
印制元件 printed component (#`o>G(
印制接点 printed contact rP_)*)
印制板装配 printed board assembly z<*]h^!3
板 board (7
iMIY
刚性印制板 rigid printed board fXj
挠性印制电路 flexible printed circuit 5}ah%
挠性印制线路 flexible printed wiring $Yc9><i
齐平印制板 flush printed board e)7r
金属芯印制板 metal core printed board _=#mmZkq
金属基印制板 metal base printed board
x$I>e
多重布线印制板 mulit-wiring printed board $!w%=
塑电路板 molded circuit board EG6fC4rfC
散线印制板 discrete wiring board #n
r1- sf|
微线印制板 micro wire board 6 [E"
积层印制板 buile-up printed board h08T Q=n
表面层合电路板 surface laminar circuit 5 <poN)"
埋入凸块连印制板 B2it printed board y
6<tV.
载芯片板 chip on board k9]n/
埋电阻板 buried resistance board KG@hjO
母板 mother board ]ghPbS@
子板 daughter board *uR'eXW
背板 backplane RqR X
裸板 bare board (z{xd
键盘板夹心板 copper-invar-copper board e+U o-CO
动态挠性板 dynamic flex board V-0Y~T
静态挠性板 static flex board ;{RQ+ZX'[
可断拼板 break-away planel IZLX[y
电缆 cable @}:(t{>;e7
挠性扁平电缆 flexible flat cable (FFC) ;p8xL)mUP
薄膜开关 membrane switch 00+5a
TrE
混合电路 hybrid circuit TuL(
/
厚膜 thick film *6DKUCA/
厚膜电路 thick film circuit 3@*8\
薄膜 thin film uQCS%|8C
薄膜混合电路 thin film hybrid circuit yFjSvm6
互连 interconnection fmh]Y/UC
导线 conductor trace line 62) F
齐平导线 flush conductor vr$[
传输线 transmission line G].Z| Z9
跨交 crossover %VCHM GP=
板边插头 edge-board contact /DCUwg=0
增强板 stiffener c9V'Z d#
基底 substrate qM'5cxe
基板面 real estate *RhdoD|a
导线面 conductor side %BJ V$tO
元件面 component side E),T,
焊接面 solder side t [f]
导电图形 conductive pattern &I8ZVtg
非导电图形 non-conductive pattern ~Q5HM
基材 base material QMP:}
层压板 laminate %?ad.F+7
覆金属箔基材 metal-clad bade material p6p_B
覆铜箔层压板 copper-clad laminate (CCL) 7-)KTBFL
复合层压板 composite laminate *
-)aGL
薄层压板 thin laminate <pCZ+Yv E"
基体材料 basis material sy;~(rpg
预浸材料 prepreg |yr}g-m
粘结片 bonding sheet >K3Lww)Ln
预浸粘结片 preimpregnated bonding sheer =x>KA*O1
环氧玻璃基板 epoxy glass substrate '0+-Hit?
预制内层覆箔板 mass lamination panel >
ewcD{bt
内层芯板 core material Pg7/g=Va
粘结层 bonding layer Q =Z-vTD+
粘结膜 film adhesive 3$_wAt4w
无支撑胶粘剂膜 unsupported adhesive film 6;Bqu5_Cj
覆盖层 cover layer (cover lay) mSs%g L]g
增强板材 stiffener material gwyz)CUkL
铜箔面 copper-clad surface 9#+X?|p+0
去铜箔面 foil removal surface eG.?s;J0
层压板面 unclad laminate surface N]3XDd|q
基膜面 base film surface ^VD14V3
胶粘剂面 adhesive faec ;TYkJH"
原始光洁面 plate finish 8WMC ~
粗面 matt finish s&4Y+dk93
剪切板 cut to size panel IIzdCa{l
超薄型层压板 ultra thin laminate z?7pn}-
A阶树脂 A-stage resin b$hQB090
B阶树脂 B-stage resin ?(Nls.c
C阶树脂 C-stage resin /) N[tv2
环氧树脂 epoxy resin >5\rU[H>
酚醛树脂 phenolic resin
Re`= B
聚酯树脂 polyester resin i9Qx{f88
聚酰亚胺树脂 polyimide resin ffd yDUzQ
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 8D-g%Aj-
丙烯酸树脂 acrylic resin E8/P D
三聚氰胺甲醛树脂 melamine formaldehyde resin {B34^H:
多官能环氧树脂 polyfunctional epoxy resin =4G9ev
4
溴化环氧树脂 brominated epoxy resin \%UA6uj
环氧酚醛 epoxy novolac "~tEmMz
氟树脂 fluroresin /p~gm\5Z
硅树脂 silicone resin 1Ypru<.)W
硅烷 silane E=7~\7TE
聚合物 polymer "!2Fy-Y
无定形聚合物 amorphous polymer Xr-eDUEi
结晶现象 crystalline polamer KdUmetx1
双晶现象 dimorphism RDZl@ps8
共聚物 copolymer k@^)>J^
合成树脂 synthetic @X:P`?("^
热固性树脂 thermosetting resin [Page] QM
O OJA
热塑性树脂 thermoplastic resin %A04'dj`zQ
感光性树脂 photosensitive resin wJip{
环氧值 epoxy value {A{=RPL
双氰胺 dicyandiamide tJc9R2
粘结剂 binder -rUn4a
胶粘剂 adesive _jp8;M~Z
固化剂 curing agent uGOvZO^v
阻燃剂 flame retardant YoJN.],gf
遮光剂 opaquer &q>=6sQvf
增塑剂 plasticizers BDpeAF8z
不饱和聚酯 unsatuiated polyester xI$B",?(
聚酯薄膜 polyester .Gw;]s3
聚酰亚胺薄膜 polyimide film (PI) $5l 8V
聚四氟乙烯 polytetrafluoetylene (PTFE) lCDXFy(E
增强材料 reinforcing material \xwE4K
折痕 crease 9 u{#S}c`
云织 waviness 0Db#W6*^
鱼眼 fish eye Iq MXd K|
毛圈长 feather length Ji gc@@B.
厚薄段 mark iphe0QE[#}
裂缝 split r\Zz=~![<
捻度 twist of yarn s#>Bwn&b)
浸润剂含量 size content IZ"d s=w
浸润剂残留量 size residue 3DbS\jja
处理剂含量 finish level %R(1^lFI$
偶联剂 couplint agent }sZme3*J[
断裂长 breaking length __OD^?qa
吸水高度 height of capillary rise 7*`cWT_X
湿强度保留率 wet strength retention 7YrX3Hx8
白度 whitenness vzG(u_,9[
导电箔 conductive foil qdWsP9}q
铜箔 copper foil ;vnG
压延铜箔 rolled copper foil x
xWnB
光面 shiny side #}3$n/
粗糙面 matte side zQ&`|kS
处理面 treated side a~jM^b;VN
防锈处理 stain proofing q,A; d^g
双面处理铜箔 double treated foil $5Jo%K%
模拟 simulation X H,1\J-S
逻辑模拟 logic simulation jNBvy1
电路模拟 circit simulation Mt"j< ]EW
时序模拟 timing simulation
$ac
VJI?
模块化 modularization QE1DTU
设计原点 design origin F6`$5%$M;?
优化(设计) optimization (design) 4*&_h g)h
供设计优化坐标轴 predominant axis kO>F, M
表格原点 table origin MIGcV9hf
元件安置 component positioning .-Yhpw>f
比例因子 scaling factor fO|oV0Rw
扫描填充 scan filling kdcr*7w
矩形填充 rectangle filling Us P1bh4
填充域 region filling
!*5vXN
实体设计 physical design S3l$\X;6X
逻辑设计 logic design #-r,;
逻辑电路 logic circuit gTa6%GM>
层次设计 hierarchical design Fg;V6s/>ts
自顶向下设计 top-down design 3Uw}!>`%
自底向上设计 bottom-up design C7:;<<"P
费用矩阵 cost metrix VPBlU
元件密度 component density 9Kf# jZ
自由度 degrees freedom 8K$q6V%#
出度 out going degree _\uyS',
入度 incoming degree @
W[LA<
曼哈顿距离 manhatton distance '[V}]Z>-
欧几里德距离 euclidean distance ]n _OQ)VO
网络 network ruiAEC<Ej
阵列 array $ReoIU^<
段 segment !(QDhnx}9c
逻辑 logic av~dH=&=
逻辑设计自动化 logic design automation S &N[@G
分线 separated time X} <p|P+
分层 separated layer >..C^8 "
定顺序 definite sequence ;c};N(2
导线(通道) conduction (track) XpS].P9
导线(体)宽度 conductor width `0'Bg2'
导线距离 conductor spacing bLSXQStB
导线层 conductor layer bruM#T@}
导线宽度/间距 conductor line/space NFxs4:]
RT
第一导线层 conductor layer No.1 ':Avh|q3N
圆形盘 round pad lM/)<I\8
方形盘 square pad _ljdo`j#N
菱形盘 diamond pad 2g?O+'JD
长方形焊盘 oblong pad *% 6NuZ
子弹形盘 bullet pad vOMmsU F
泪滴盘 teardrop pad q3Tp/M.
雪人盘 snowman pad %VZQX_
形盘 V-shaped pad V "eRf3Q7w:
环形盘 annular pad 1T96W :
非圆形盘 non-circular pad p{c+ +P5
隔离盘 isolation pad %uA\Le
非功能连接盘 monfunctional pad uj
6dP
偏置连接盘 offset land &\[3m^L
腹(背)裸盘 back-bard land >d1gVBhk
盘址 anchoring spaur k(As^'>
连接盘图形 land pattern Rd#V,[d
连接盘网格阵列 land grid array *}\}@0%
孔环 annular ring T;{M9W+
元件孔 component hole 2pu8')'P
安装孔 mounting hole Ro1b (+H
支撑孔 supported hole @!;EW
R]
非支撑孔 unsupported hole AC'$~4
导通孔 via 7=Vs1TVc
镀通孔 plated through hole (PTH) 6@N?`6Bt
余隙孔 access hole Pi^5LI6JW
盲孔 blind via (hole) <]9%Pm#X
埋孔 buried via hole Nw74T
埋,盲孔 buried blind via L!fiW`>0G
任意层内部导通孔 any layer inner via hole _hK83s4
全部钻孔 all drilled hole I)9un|+,y
定位孔 toaling hole ah1DuTT/G
无连接盘孔 landless hole &2i3"9k
中间孔 interstitial hole /d<"{\o
无连接盘导通孔 landless via hole ?uiQ'}
引导孔 pilot hole ]6#7TT
端接全隙孔 terminal clearomee hole Hjho!np
准尺寸孔 dimensioned hole [Page] Ry5/O?QL
在连接盘中导通孔 via-in-pad 7F=Xn@ _
孔位 hole location JYQ.Y!X1O
孔密度 hole density ^7cZ9/3
孔图 hole pattern S w<V/t
钻孔图 drill drawing !%pY)69gv
装配图assembly drawing kB`t_`7f
参考基准 datum referan ?hW?w$C
1) 元件设备 [;IW'cXNq
qT
U(]O1
三绕组变压器:three-column transformer ThrClnTrans T!GX^nn*O
双绕组变压器:double-column transformer DblClmnTrans .'+*>y!
电容器:Capacitor )@%wj;>a
并联电容器:shunt capacitor F.nJXZnJ
电抗器:Reactor ve#*qz Y
母线:Busbar [8T
输电线:TransmissionLine (
Lp~:p
发电厂:power plant E="FE.%A
断路器:Breaker b7X-mkF
刀闸(隔离开关):Isolator J|ni'Hb
分接头:tap 0)c9X[sG
电动机:motor CTqAhL 4}
(2) 状态参数 yS*s[vT
#1>DV@^F
有功:active power ZjlFr(
无功:reactive power 32DSZ0
电流:current iti~RV,
容量:capacity kPh;SCr{
电压:voltage a,B2;4"
档位:tap position i{['18Q$F3
有功损耗:reactive loss .kv/db
无功损耗:active loss D/T&0
功率因数:power-factor X)-9u 8
功率:power ~j1.;WId[
功角:power-angle bzI!;P1&
电压等级:voltage grade qN hV zx
空载损耗:no-load loss +3@d]JfMh
铁损:iron loss QQQ3U
铜损:copper loss >g ):xi3qK
空载电流:no-load current ,&wTUS\
阻抗:impedance ||{V*"+\
正序阻抗:positive sequence impedance k>W5ts2+
负序阻抗:negative sequence impedance |*~=w J_
零序阻抗:zero sequence impedance 1x\Vz\
电阻:resistor =44hI86
电抗:reactance kh11Y1Q0d
电导:conductance 50 s)5G#
电纳:susceptance W YHr'xJ
无功负载:reactive load 或者QLoad lq4vX^S
有功负载: active load PLoad {l /]+8G^
遥测:YC(telemetering) eSV_.uvsb
遥信:YX $On
励磁电流(转子电流):magnetizing current ;n-)4b]\
定子:stator ^8_`IT
功角:power-angle KNR_upO8
上限:upper limit Fv[. %tW
下限:lower limit Kp_L\'.I5$
并列的:apposable 3f 1@<7*
高压: high voltage IaxzkX_48
低压:low voltage 'rT@r:6fn
中压:middle voltage 2TR l@
电力系统 power system HA
+EuQE"
发电机 generator 0YMmW xV
励磁 excitation Ihe/P {t]J
励磁器 excitor z8#c!h<@;
电压 voltage nm[ yp3B
电流 current |2yTt*!-r
母线 bus U}c[oA
变压器 transformer wm3fd7T
升压变压器 step-up transformer /eM_:H5
高压侧 high side M4;A4V=W
输电系统 power transmission system IIN"'7Z^R
输电线 transmission line #MZ0Sd8]&
固定串联电容补偿fixed series capacitor compensation 0baq696<F
稳定 stability Vrz6<c-'B
电压稳定 voltage stability C:$12{I?*
功角稳定 angle stability \O]1QM94Y
暂态稳定 transient stability Sa V]6/|
电厂 power plant &"V%n
能量输送 power transfer 4o:
交流 AC NXAP=y3
装机容量 installed capacity qXHr[C"
电网 power system 4:!KtpR[O
落点 drop point w|6;Pf~1y)
开关站 switch station ^k&T