1 backplane 背板 +hvVoBCM*
2 Band gap voltage reference 带隙电压参考 4fzM%ku
3 benchtop supply 工作台电源 z//6yr
4 Block Diagram 方块图 5 Bode Plot 波特图 ph1veD<ZZ
6 Bootstrap 自举 `S7${0e
7 Bottom FET Bottom FET ^coJ"[D
8 bucket capcitor 桶形电容 \+w -{"u$
9 chassis 机架 CD0SXNi"zH
10 Combi-sense Combi-sense I-q@@!=
11 constant current source 恒流源 Uz!cVs?-
12 Core Sataration 铁芯饱和 T+/Gz'
13 crossover frequency 交叉频率
v4<x 4
14 current ripple 纹波电流 C44Dz.rs
15 Cycle by Cycle 逐周期 Ih95&HsdC
16 cycle skipping 周期跳步 [! :.9
17 Dead Time 死区时间 FCmS3KIa,
18 DIE Temperature 核心温度 t
UW'E
19 Disable 非使能,无效,禁用,关断 1k>*
20 dominant pole 主极点 @le23+q
21 Enable 使能,有效,启用 0)qLW&
w
22 ESD Rating ESD额定值 MgLz:2
:F
23 Evaluation Board 评估板 8YBsYKC
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. \G*vY#]
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 D &wm7,
25 Failling edge 下降沿 'm"H*f
26 figure of merit 品质因数 Pz +8u&~p
27 float charge voltage 浮充电压 G>{;@u
28 flyback power stage 反驰式功率级 $wVY)p9Q
29 forward voltage drop 前向压降 A!
1>
30 free-running 自由运行 D`.CXFI+U
31 Freewheel diode 续流二极管 Tr}c]IP*
32 Full load 满负载 33 gate drive 栅极驱动 S*CRVs
34 gate drive stage 栅极驱动级 aARm nV
35 gerber plot Gerber 图 XH2g:$
36 ground plane 接地层 HWGlC <
37 Henry 电感单位:亨利 !/$BXUrd
38 Human Body Model 人体模式 ^fb4g+Au
39 Hysteresis 滞回 }qXi;u))
40 inrush current 涌入电流 PHD$E s
41 Inverting 反相 F:M3^I
42 jittery 抖动 >UuLSF}
43 Junction 结点 W#0pFofXw
44 Kelvin connection 开尔文连接 5kJ>pb$/
45 Lead Frame 引脚框架 te'<xfG
46 Lead Free 无铅 /gHRJ$2|Sx
47 level-shift 电平移动 Oy[t}*Ik
48 Line regulation 电源调整率 +3t(kQ
49 load regulation 负载调整率 z0Gh |N@)
50 Lot Number 批号 f5/ba9nI
51 Low Dropout 低压差 Vo(d)"m?
52 Miller 密勒 53 node 节点 AC(}cMM+
54 Non-Inverting 非反相 mnXaf)"
55 novel 新颖的 <H E'5b
56 off state 关断状态 +2W#=G
57 Operating supply voltage 电源工作电压 e v?Hz8Q;(
58 out drive stage 输出驱动级 JUU0Tx:`9)
59 Out of Phase 异相 -D.6@@%Kc}
60 Part Number 产品型号 r0j:ll d
61 pass transistor pass transistor bU:"dqRm<
62 P-channel MOSFET P沟道MOSFET :d!.E$S
63 Phase margin 相位裕度 0 x"3
64 Phase Node 开关节点 Q:kpaMA1P
65 portable electronics 便携式电子设备 '(u [
66 power down 掉电 9}2I'7]
67 Power Good 电源正常 Q9#$4
68 Power Groud 功率地 8X*6i-j5E
69 Power Save Mode 节电模式 OBN]bvCJ
70 Power up 上电 1/w['d4l!
71 pull down 下拉 Cg21-G.
72 pull up 上拉 >&U]j*'4
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) |TEf? <"c
74 push pull converter 推挽转换器 m=NX;t
75 ramp down 斜降 0R*
76 ramp up 斜升 ~"}-cl,
77 redundant diode 冗余二极管 `t ZvIy*
78 resistive divider 电阻分压器 ycCEXu2F
79 ringing 振 铃 zc,fJM
80 ripple current 纹波电流 <r3F*S=
81 rising edge 上升沿 &&(sZGw
82 sense resistor 检测电阻 31YzTbl[H
83 Sequenced Power Supplys 序列电源 2lHJ&fck<
84 shoot-through 直通,同时导通 N9:xtrJ]_J
85 stray inductances. 杂散电感 T92k"fBY
86 sub-circuit 子电路 aCFO]
87 substrate 基板 3=5+NJ'8
88 Telecom 电信 qz(0iZ] Y
89 Thermal Information 热性能信息 r#3_F=xL5
90 thermal slug 散热片 HK5\i@G+<
91 Threshold 阈值 gnB%/g[_
92 timing resistor 振荡电阻 )0RH"#,2L
93 Top FET Top FET W)w@ju$Ko
94 Trace 线路,走线,引线 81H04L9K 7
95 Transfer function 传递函数 *]O[ZjyOY
96 Trip Point 跳变点 .#J'+LxFr
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Eh0R0;l5>
98 Under Voltage Lock Out (UVLO) 欠压锁定 i+T$&$b
99 Voltage Reference 电压参考 =QOtag1;
100 voltage-second product 伏秒积 IM)\-O\Wd
101 zero-pole frequency compensation 零极点频率补偿 NBE)DL
102 beat frequency 拍频 cq
%=DZ
103 one shots 单击电路 "i4@'`r
104 scaling 缩放 2Wq)y1R<T
105 ESR 等效串联电阻 [Page] &kRkOjuk
106 Ground 地电位 x@Z?DS$)
107 trimmed bandgap 平衡带隙 i4v7x;m_p
108 dropout voltage 压差 SgFyv<6>:
109 large bulk capacitance 大容量电容 ;wgm
'jr
110 circuit breaker 断路器 K
)1K ]
111 charge pump 电荷泵 z)yxz:E
112 overshoot 过冲 ix$?/GlL
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印制电路printed circuit 0b~5i-zM/
印制线路 printed wiring 8GV$L~i
印制板 printed board q9yY%
印制板电路 printed circuit board @B*?owba>
印制线路板 printed wiring board ft4J.oT
印制元件 printed component B.;/N220P
印制接点 printed contact D*DCMMp=0
印制板装配 printed board assembly ;0P2nc:U~
板 board 4=>/x90y
刚性印制板 rigid printed board X9#Od9cNaC
挠性印制电路 flexible printed circuit @q],pD
挠性印制线路 flexible printed wiring dBX%/
齐平印制板 flush printed board NHPpHY3^.
金属芯印制板 metal core printed board W(1p0|WQ:
金属基印制板 metal base printed board [9~Bau
多重布线印制板 mulit-wiring printed board ,57g_z]V
塑电路板 molded circuit board IdUMoLL?
散线印制板 discrete wiring board y 7|x<Z
微线印制板 micro wire board ?o"wyF A*
积层印制板 buile-up printed board Bk?3lwCT
表面层合电路板 surface laminar circuit a(NN%'fDD
埋入凸块连印制板 B2it printed board ;Pnz4Y4|eU
载芯片板 chip on board q[] "`?
埋电阻板 buried resistance board '|G_C%,B
母板 mother board E@7";&\-8
子板 daughter board kNMhMEez
背板 backplane "+[:\
裸板 bare board .&TJSIx$
键盘板夹心板 copper-invar-copper board KaZ*HPe(
动态挠性板 dynamic flex board `)*
静态挠性板 static flex board ~}z{RE($v
可断拼板 break-away planel ,Si\ky7L
电缆 cable `
Cdk
b5
挠性扁平电缆 flexible flat cable (FFC) kb Fr
薄膜开关 membrane switch fF;Oz"I{\
混合电路 hybrid circuit -z-58FLlO
厚膜 thick film k
9R_27F
厚膜电路 thick film circuit !r,ZyJU
薄膜 thin film ;m,lS_[c
薄膜混合电路 thin film hybrid circuit (?72 vCc
互连 interconnection `f}}z5
导线 conductor trace line O{,Uge2n,
齐平导线 flush conductor uB>NwCL;
传输线 transmission line Ny/bNQS
跨交 crossover MRZWfc
板边插头 edge-board contact 3x#=@i
增强板 stiffener 9qc1^Fs~
基底 substrate .[? E1we
基板面 real estate Vrf2%$g
导线面 conductor side vHZw{'5y
元件面 component side 5][Rvu0
焊接面 solder side ^VR1whCrx
导电图形 conductive pattern :=+s^K
非导电图形 non-conductive pattern gEcVQPD@
基材 base material i%GjtYjS
层压板 laminate 2fT't"gw
覆金属箔基材 metal-clad bade material U
SXz
覆铜箔层压板 copper-clad laminate (CCL) /XjIm4EN
复合层压板 composite laminate 7]_UZ)u
薄层压板 thin laminate v(3nBZHv_!
基体材料 basis material `o8b\p\zn
预浸材料 prepreg kzZtKN9Az
粘结片 bonding sheet h
`d(?1
预浸粘结片 preimpregnated bonding sheer !u.{<51b
环氧玻璃基板 epoxy glass substrate f#pT6
预制内层覆箔板 mass lamination panel
&THM]3:
内层芯板 core material ps[TiW{q;
粘结层 bonding layer B!K{y>|.
粘结膜 film adhesive mDC{c ?
无支撑胶粘剂膜 unsupported adhesive film >G92k76G
覆盖层 cover layer (cover lay) c>{6NSS -
增强板材 stiffener material 7uFM)b@.P
铜箔面 copper-clad surface 2mP|
hp?
去铜箔面 foil removal surface *r!1K!c
层压板面 unclad laminate surface e,>L&9] ZI
基膜面 base film surface l7Y^C1hM
胶粘剂面 adhesive faec ^2[0cne
原始光洁面 plate finish XtRfzqg?K
粗面 matt finish w:I^iI.
剪切板 cut to size panel Ih!UL:Ckh
超薄型层压板 ultra thin laminate CsS0(n(x
A阶树脂 A-stage resin >P/kb fPA
B阶树脂 B-stage resin &STgj|t_
C阶树脂 C-stage resin u`$,S&Er
环氧树脂 epoxy resin Fl>v9%A
酚醛树脂 phenolic resin M6vW}APH[n
聚酯树脂 polyester resin L,of@>
聚酰亚胺树脂 polyimide resin d}3<nz,
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin ~O?Gi 4^Yg
丙烯酸树脂 acrylic resin _j-k*:
三聚氰胺甲醛树脂 melamine formaldehyde resin }UMg ph:2:
多官能环氧树脂 polyfunctional epoxy resin J\b,rOI f
溴化环氧树脂 brominated epoxy resin 7qt<CLJ
环氧酚醛 epoxy novolac
%1 <No/
氟树脂 fluroresin G5egyP;
硅树脂 silicone resin %gSqc
}v*
硅烷 silane us\@n"
聚合物 polymer 6*cm
无定形聚合物 amorphous polymer 3}= .7qm
结晶现象 crystalline polamer w~afQA>
双晶现象 dimorphism =H.l/'/Z
共聚物 copolymer C(b"0>
合成树脂 synthetic V:9| 9$G
热固性树脂 thermosetting resin [Page] *E+2E^B
热塑性树脂 thermoplastic resin + _rjA_
感光性树脂 photosensitive resin zLc.4k
环氧值 epoxy value M7/P&d
双氰胺 dicyandiamide quN7'5ZC[
粘结剂 binder N{46DS
胶粘剂 adesive ZZA!Y9ia2
固化剂 curing agent t }7hD
阻燃剂 flame retardant K~z*P0g*
遮光剂 opaquer 9*GwW&M%1_
增塑剂 plasticizers s+(%N8B
不饱和聚酯 unsatuiated polyester oD4NQR
聚酯薄膜 polyester yBE1mA:x7:
聚酰亚胺薄膜 polyimide film (PI) D{Y~kV|
聚四氟乙烯 polytetrafluoetylene (PTFE) e'[T5HI
增强材料 reinforcing material -Cd4yWkO
折痕 crease oF,XSd
云织 waviness EXH{3E54)`
鱼眼 fish eye B)O=wx
毛圈长 feather length 7'S/hV%
厚薄段 mark 'Y(#Yxc
裂缝 split T#6'] D
捻度 twist of yarn `I ,A7b
浸润剂含量 size content t1b$,jHmKl
浸润剂残留量 size residue *_`T*$
处理剂含量 finish level `J[(Dx'y=t
偶联剂 couplint agent A^q= :ofQ
断裂长 breaking length k^Zpb&`Hx
吸水高度 height of capillary rise V2g,JFp&
湿强度保留率 wet strength retention 0&=2+=[c
白度 whitenness \=Af AO@
导电箔 conductive foil Dx$74~2e
铜箔 copper foil wYSvI
压延铜箔 rolled copper foil MVg`6&oH
光面 shiny side EJjTf:
粗糙面 matte side "Ol;0>$
处理面 treated side V]L$`7G
防锈处理 stain proofing Fx4C]S
双面处理铜箔 double treated foil &
d\`=e
模拟 simulation #i-!:6sLA
逻辑模拟 logic simulation T?!^-PD9*
电路模拟 circit simulation C, n]9
时序模拟 timing simulation p|,K2^?Y
模块化 modularization *h1Zqb
设计原点 design origin Ictc '#y
优化(设计) optimization (design) $Rv}L' L
供设计优化坐标轴 predominant axis WLiY:X(+|
表格原点 table origin 8R`@edj>
元件安置 component positioning Z{+h~?63
比例因子 scaling factor t!c8c^HR
扫描填充 scan filling JmrQDO_(
矩形填充 rectangle filling 8xj4N%PA
填充域 region filling }U7>_b2
实体设计 physical design S+ymdZ)xZ`
逻辑设计 logic design -))>7skc
逻辑电路 logic circuit 0(Y$xg
层次设计 hierarchical design to[EA6J8l
自顶向下设计 top-down design SOb17:o3|
自底向上设计 bottom-up design $1H?k
费用矩阵 cost metrix -le:0NUwI
元件密度 component density ^8.R 'Yq
自由度 degrees freedom q?[{fcNh$
出度 out going degree Q&(?D
入度 incoming degree vxUJ4|Qz
曼哈顿距离 manhatton distance Vyj>&"28
欧几里德距离 euclidean distance C@pDX>~2=b
网络 network *0 i
阵列 array /AJ^wY
段 segment rr3NY$W
逻辑 logic -}{\C]%
逻辑设计自动化 logic design automation n]ar\f
分线 separated time -2v|d]3qG
分层 separated layer ij r*_=
定顺序 definite sequence 4@5rR~DQq
导线(通道) conduction (track) wz.Il-sm
导线(体)宽度 conductor width PdMx6 Ab
导线距离 conductor spacing vMzR3@4e
导线层 conductor layer fB1JU1
导线宽度/间距 conductor line/space on*?O O'
第一导线层 conductor layer No.1 TmKO/N@}
圆形盘 round pad jt"p Js'
方形盘 square pad ETH`.~%
菱形盘 diamond pad rNU,(htS
长方形焊盘 oblong pad @MtF^y
子弹形盘 bullet pad
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泪滴盘 teardrop pad 5Ag]1k{
雪人盘 snowman pad H4k`wWOk
形盘 V-shaped pad V uP|AP
环形盘 annular pad VOG DD@
非圆形盘 non-circular pad TT.EQv5
隔离盘 isolation pad O~{Zs\u9
非功能连接盘 monfunctional pad )#ic"UtR
偏置连接盘 offset land G8QJM0VpS
腹(背)裸盘 back-bard land L$ ]D&f8:
盘址 anchoring spaur /Ia=/Jj7N
连接盘图形 land pattern m
oFK/5cJ
连接盘网格阵列 land grid array D: JGd$`
孔环 annular ring =!U{vT
元件孔 component hole xw%?R=&L
安装孔 mounting hole rM [Ps=5
支撑孔 supported hole *2MUG
h
非支撑孔 unsupported hole \5s!lv*&
导通孔 via F__DPEAc_
镀通孔 plated through hole (PTH) s<:"rw`
余隙孔 access hole Fj 1/B0acS
盲孔 blind via (hole) F`Q,pBl1p6
埋孔 buried via hole
H.Jcp|k[;
埋,盲孔 buried blind via ^%go\ C ;
任意层内部导通孔 any layer inner via hole p*Q"<@n
全部钻孔 all drilled hole k]R O=/ ?M
定位孔 toaling hole 4$IPz7
无连接盘孔 landless hole +R2
中间孔 interstitial hole RF6(n8["MW
无连接盘导通孔 landless via hole vm8QKPy
引导孔 pilot hole Esw&ScBOP