1 backplane 背板 m1B+31'>^
2 Band gap voltage reference 带隙电压参考 >qS9PX
3 benchtop supply 工作台电源 mz,
4 Block Diagram 方块图 5 Bode Plot 波特图 W6? pswQ
6 Bootstrap 自举 MZSy6v
7 Bottom FET Bottom FET * w?N{.
8 bucket capcitor 桶形电容 *>|gxM8
9 chassis 机架 wO'T BP
10 Combi-sense Combi-sense e1%/2 6\
11 constant current source 恒流源 $8 UUzk
12 Core Sataration 铁芯饱和 $Tu61zq
13 crossover frequency 交叉频率 F`gi_; c
14 current ripple 纹波电流 vk77B(u
15 Cycle by Cycle 逐周期 uE%r/:!k4$
16 cycle skipping 周期跳步 95 ; x=ju
17 Dead Time 死区时间 9$cWU_q{
18 DIE Temperature 核心温度 $c 0h. t
19 Disable 非使能，无效，禁用，关断 `A w^H!
20 dominant pole 主极点 3Dng 1}
21 Enable 使能，有效，启用 a%kQl^I 4
22 ESD Rating ESD额定值 Al}6q{E9+8
23 Evaluation Board 评估板 C-Q28lD}f
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. F5P[dp-`1
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 wSa)* ]%
25 Failling edge 下降沿 }= <
26 figure of merit 品质因数 N5Q[ n d
27 float charge voltage 浮充电压 w_.F'
E
28 flyback power stage 反驰式功率级 .E`\MtA
29 forward voltage drop 前向压降 8K:y\ 1
30 free-running 自由运行 NW] Lj >0Y
31 Freewheel diode 续流二极管 vHyC; 4'
32 Full load 满负载 33 gate drive 栅极驱动 ~;l@|7wGz
34 gate drive stage 栅极驱动级 : r{<zd>;
35 gerber plot Gerber 图 vB.E3 r=
36 ground plane 接地层 2bJQTk _S
37 Henry 电感单位：亨利 'u *D A|HC
38 Human Body Model 人体模式 G<}( )+L
39 Hysteresis 滞回 > V-A;S:
40 inrush current 涌入电流 't:; irLW.
41 Inverting 反相 \k .{-nh
42 jittery 抖动 pMw*9s X
43 Junction 结点 dP3CG8w5
44 Kelvin connection 开尔文连接 );#JL0I
45 Lead Frame 引脚框架 '@o;-'b
46 Lead Free 无铅 |2O]R s
47 level-shift 电平移动 l4F%VR4KT
48 Line regulation 电源调整率 +"rDT1^V
49 load regulation 负载调整率 tr< Nm6!
50 Lot Number 批号 SIBtm m1W
51 Low Dropout 低压差 )eUh=eW
52 Miller 密勒 53 node 节点 Sc\ *W0m
54 Non-Inverting 非反相 o_Xflz C
55 novel 新颖的 wxKX{Bs
56 off state 关断状态 pmuvg6@h
57 Operating supply voltage 电源工作电压 GWZ
}7ake
58 out drive stage 输出驱动级 dq(uVW^&ae
59 Out of Phase 异相 ff]6aR/
UQ
60 Part Number 产品型号 BF\XEm?!
61 pass transistor pass transistor Z InpMp
62 P-channel MOSFET P沟道MOSFET K'L^;z6
63 Phase margin 相位裕度 &5\i M^
64 Phase Node 开关节点 VEWi_;=J1
65 portable electronics 便携式电子设备 Fq0i`~L~
66 power down 掉电 e|)hG8FlF
67 Power Good 电源正常 `F-/QX[:
68 Power Groud 功率地 kjIAep0rT
69 Power Save Mode 节电模式 uZ NTHD
70 Power up 上电 v\c>b:AofD
71 pull down 下拉 %'b M){
72 pull up 上拉 ~-ia+A6GIV
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） <CS(c|7
74 push pull converter 推挽转换器 5 h-@ |t
75 ramp down 斜降 2M.fLQ?
76 ramp up 斜升 bGN: =Y'
77 redundant diode 冗余二极管 `95r0t0hh\
78 resistive divider 电阻分压器 &-;4.op
79 ringing 振 铃 PRx8I
.
80 ripple current 纹波电流 +9M^7 /}H
81 rising edge 上升沿 K* %9 )hq
82 sense resistor 检测电阻 t_o[ 'F
83 Sequenced Power Supplys 序列电源 SEo'(-5
84 shoot-through 直通，同时导通 sZjQ3*<-r
85 stray inductances. 杂散电感 x3hB5p$q
86 sub-circuit 子电路 52%2R]G!
87 substrate 基板 P@Hs`=
88 Telecom 电信 = i$Fl{vH
89 Thermal Information 热性能信息 ^NRl//
90 thermal slug 散热片 (/z_Q{"N
91 Threshold 阈值 x.]i }mt
92 timing resistor 振荡电阻 fa-IhB1!K
93 Top FET Top FET SON-Z"v
94 Trace 线路，走线，引线 1ct;A_48
95 Transfer function 传递函数 q3mJ782p]
96 Trip Point 跳变点 X.OD`.!>
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） p)jk>j B
98 Under Voltage Lock Out (UVLO) 欠压锁定 TITKj?*o
99 Voltage Reference 电压参考 y=fx%~<>
8
100 voltage-second product 伏秒积 RmI ]1S_=
101 zero-pole frequency compensation 零极点频率补偿 uW=k K0E
102 beat frequency 拍频 *T- <|zQ
103 one shots 单击电路 )Lk639r
104 scaling 缩放 ERUz3mjA/
105 ESR 等效串联电阻 [Page] c?tBi9'Y]
106 Ground 地电位 n&L+wqJ
107 trimmed bandgap 平衡带隙 &:;:"{t}Do
108 dropout voltage 压差 hB "fhX
109 large bulk capacitance 大容量电容 AS!?q
110 circuit breaker 断路器 )SaG H3~*C
111 charge pump 电荷泵 A}BVep@D
112 overshoot 过冲 _Us#\+]_:
rxe >}ZO
印制电路printed circuit Cl5uS%g
印制线路 printed wiring 2L:_rR#w
印制板 printed board GOj-)i/_
印制板电路 printed circuit board ; ^*}#X d
印制线路板 printed wiring board u#Pa7_zBj]
印制元件 printed component bk[U/9Z\
印制接点 printed contact F5LuSy+v
印制板装配 printed board assembly viW!,QQ(S
板 board <5-[{Q/2z
刚性印制板 rigid printed board O_2pIbh
挠性印制电路 flexible printed circuit f~t:L, \,
挠性印制线路 flexible printed wiring `EEL1[:BR
齐平印制板 flush printed board A^nvp!_
金属芯印制板 metal core printed board Y#]+Tm (+
金属基印制板 metal base printed board 9`T)@Uj2n
多重布线印制板 mulit-wiring printed board ~xbe~$$Q@
塑电路板 molded circuit board b[ sx_b
散线印制板 discrete wiring board &#o~U$GBg
微线印制板 micro wire board O%Scjm-^X
积层印制板 buile-up printed board 'OE&/
C [
表面层合电路板 surface laminar circuit
Hu^1[#
埋入凸块连印制板 B2it printed board T%x}Y#U'`
载芯片板 chip on board zE336
埋电阻板 buried resistance board :I"2V
母板 mother board
d: _t-ZZo
子板 daughter board sz5MH!/PJ
背板 backplane .\\DKh%
裸板 bare board k o5 @qNq
键盘板夹心板 copper-invar-copper board P#E &|n7DT
动态挠性板 dynamic flex board ,QOG !T4
静态挠性板 static flex board fsmN)_T
可断拼板 break-away planel 9
3U_tQ&1?
电缆 cable 8 |b3j^u
挠性扁平电缆 flexible flat cable (FFC) }^4Xv^dW>g
薄膜开关 membrane switch %OtFHhb
混合电路 hybrid circuit Eav[/cU
厚膜 thick film H ;7(}:.
厚膜电路 thick film circuit 0v6)t.]s
薄膜 thin film u~r=)His
薄膜混合电路 thin film hybrid circuit pe0F0Ruy
互连 interconnection HpR]q05d
导线 conductor trace line ;5wn 67'
齐平导线 flush conductor f"B3,6m
传输线 transmission line w4_ U0
n3
跨交 crossover O1 rvaOlr
板边插头 edge-board contact LnFdhrB@x
增强板 stiffener eiuSvyY
基底 substrate "HX<,l8f%
基板面 real estate }xKP~h'F
导线面 conductor side YSs)HV. 8
元件面 component side t$ +?6E
焊接面 solder side 'QG xd!4
导电图形 conductive pattern _G_Cj{w
非导电图形 non-conductive pattern rJd,Rdt.
基材 base material ZkgV_<M|
层压板 laminate =31"fS@
覆金属箔基材 metal-clad bade material sI43@[
覆铜箔层压板 copper-clad laminate (CCL) d]`CxI]
复合层压板 composite laminate 9 ^o-EC!_
薄层压板 thin laminate ImCe K
基体材料 basis material 'z
);
预浸材料 prepreg ]~8 44J p
粘结片 bonding sheet + _7*iJtD5
预浸粘结片 preimpregnated bonding sheer C #QpQg2
环氧玻璃基板 epoxy glass substrate +U:$(UV'A
预制内层覆箔板 mass lamination panel -_ I _W&
内层芯板 core material .=U#eHBdAQ
粘结层 bonding layer FK6[>(QO
粘结膜 film adhesive Us %T;gW
无支撑胶粘剂膜 unsupported adhesive film <
|e,05aM
覆盖层 cover layer (cover lay) 9K /HO!z
增强板材 stiffener material zFfoqb#*g
铜箔面 copper-clad surface agkA}O
去铜箔面 foil removal surface yH7F ''O7
层压板面 unclad laminate surface 1h(0IjG8
基膜面 base film surface ?=>+LqP
胶粘剂面 adhesive faec b>_o xK
原始光洁面 plate finish PxF <\pu&
粗面 matt finish ,?PTcQF
剪切板 cut to size panel eeIhed 9
超薄型层压板 ultra thin laminate .ELGWF`>
A阶树脂 A-stage resin z|fmrwkN'$
B阶树脂 B-stage resin R5 "K]~
C阶树脂 C-stage resin 7}1~%:6
环氧树脂 epoxy resin ko1J094Y%
酚醛树脂 phenolic resin ~7Y+2FZ
聚酯树脂 polyester resin ]&?Y~"{cD
聚酰亚胺树脂 polyimide resin ^F>cp
,x
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin /`9sPR6e
丙烯酸树脂 acrylic resin N Ih:D bE
三聚氰胺甲醛树脂 melamine formaldehyde resin jN u9KlN
多官能环氧树脂 polyfunctional epoxy resin )@N2
溴化环氧树脂 brominated epoxy resin r$5i Wu
环氧酚醛 epoxy novolac Y_}mYvJW
氟树脂 fluroresin "ZHW2l Mf
硅树脂 silicone resin Cv
}Qwy
硅烷 silane yphS'AG
聚合物 polymer Xf0M:\w=M
无定形聚合物 amorphous polymer - *F(7$
结晶现象 crystalline polamer f @8mS
双晶现象 dimorphism BeCWa> 54i
共聚物 copolymer 33jovK 2
合成树脂 synthetic p/(~IC "!J
热固性树脂 thermosetting resin [Page] H&F9J ^rC
热塑性树脂 thermoplastic resin ]e >R K'
感光性树脂 photosensitive resin R,)}>X|<
环氧值 epoxy value 8iW;y2qF
双氰胺 dicyandiamide 7: A x(El
粘结剂 binder u83J@nDQ
胶粘剂 adesive dlU'2Cl7d
固化剂 curing agent e'~Zo9`r6
阻燃剂 flame retardant m#ZO`W
遮光剂 opaquer +$X#q8j06
增塑剂 plasticizers . 7zK@6i
不饱和聚酯 unsatuiated polyester ~jK{ ,$:=
聚酯薄膜 polyester &P.4(1sC
聚酰亚胺薄膜 polyimide film (PI) v4?x.I
聚四氟乙烯 polytetrafluoetylene (PTFE) u4m,'XR
增强材料 reinforcing material D*Ik7Pe
折痕 crease : k7u GD
云织 waviness *J$=.fF1
鱼眼 fish eye PpV'F[|,r
毛圈长 feather length qZ]pq2G
厚薄段 mark F&])P-
!3
裂缝 split ii%+jdi.
捻度 twist of yarn KQcs3F@t
浸润剂含量 size content df*5,NV'-*
浸润剂残留量 size residue uqM yoIc
处理剂含量 finish level 7uT:b!^f[
偶联剂 couplint agent GFfq+=se
断裂长 breaking length V<D.sd<
吸水高度 height of capillary rise cHcmgW\4
湿强度保留率 wet strength retention 1mfs 4
白度 whitenness o8zy^zN$6
导电箔 conductive foil uMut=ja(U
铜箔 copper foil 4VHq BQ4
压延铜箔 rolled copper foil 76wc ,+
光面 shiny side iS&l8@2a
粗糙面 matte side /R~1Zj2&
处理面 treated side (
xXGSx
防锈处理 stain proofing ?I/qE='*
双面处理铜箔 double treated foil |X,|QC*7?
模拟 simulation ZeUvy IG
逻辑模拟 logic simulation "8 ~:[G#
电路模拟 circit simulation 4&xZ]QC)O5
时序模拟 timing simulation baJxU:Y=p
模块化 modularization iv?g Zg
设计原点 design origin RG3l.jL
优化（设计） optimization (design) 5K^69mx
供设计优化坐标轴 predominant axis _
):d`O e
表格原点 table origin TlI<1/ fP}
元件安置 component positioning lE!a
比例因子 scaling factor _9tK[ /h
扫描填充 scan filling N>Eqj>G
矩形填充 rectangle filling w^L ta
填充域 region filling &Zgh Mq ~
实体设计 physical design N B\{'
逻辑设计 logic design CNQC^d\ h
逻辑电路 logic circuit pWPIJ>2G:
层次设计 hierarchical design Ct2j ZqCDo
自顶向下设计 top-down design zUkN 0
自底向上设计 bottom-up design !>BZ6gn5
费用矩阵 cost metrix t <T[h2Wd
元件密度 component density U7!.,k R-
自由度 degrees freedom S!Omy:=;i
出度 out going degree 2-=\~<)
入度 incoming degree hX`hs- *qM
曼哈顿距离 manhatton distance 3uZJ.Fb
欧几里德距离 euclidean distance YY&l?*M<
网络 network i<H wTmm$
阵列 array |+3 5y_i6
段 segment 0dA7pY9
逻辑 logic &;XAuDw4+i
逻辑设计自动化 logic design automation OkCQ?]
分线 separated time hty0Rb[dH
分层 separated layer >*- FV{{
定顺序 definite sequence %q!8={ J8
导线（通道） conduction (track) fLSXPvm
导线（体）宽度 conductor width A#nun
导线距离 conductor spacing uch>AuF:
导线层 conductor layer ddfs8\
导线宽度/间距 conductor line/space masT>vM
第一导线层 conductor layer No.1 ?lbH02P{v
圆形盘 round pad t~E<j+<2B
方形盘 square pad "6R
5+
菱形盘 diamond pad ~by]xE1Eg
长方形焊盘 oblong pad $we]91(: :
子弹形盘 bullet pad 6`0mta Q
泪滴盘 teardrop pad Nru7(ag1~
雪人盘 snowman pad B|C/
Rk6?
形盘 V-shaped pad V z a:a)U^n
环形盘 annular pad f' <Q.Vh<
非圆形盘 non-circular pad v1|Bf8
隔离盘 isolation pad \k]x;S<a
非功能连接盘 monfunctional pad &K43x&mFF
偏置连接盘 offset land _bzqd"
31I
腹（背）裸盘 back-bard land V7Z4T6j4
盘址 anchoring spaur ]J* , g,
连接盘图形 land pattern 6\u!E~zy
连接盘网格阵列 land grid array L4b:F0
孔环 annular ring 4-kZJ \]
元件孔 component hole (]RM6i 7
安装孔 mounting hole DNR~_3Aq
支撑孔 supported hole {^ m(,K_
非支撑孔 unsupported hole sK"9fU
导通孔 via "F3]X)}
镀通孔 plated through hole (PTH) e/*$^i+S
余隙孔 access hole 4\pWB90V
盲孔 blind via (hole) {TO mv
埋孔 buried via hole :-iMdtm
埋,盲孔 buried blind via %*o8L6Hn
任意层内部导通孔 any layer inner via hole Cv>o.Bp|
全部钻孔 all drilled hole ;Og&FFs'
定位孔 toaling hole G/d4f?RU
无连接盘孔 landless hole B aO1/zk
中间孔 interstitial hole u>Rb
?`
无连接盘导通孔 landless via hole yJsH=5A
引导孔 pilot hole
Og2vGzD
端接全隙孔 terminal clearomee hole iJv48#'ii
准尺寸孔 dimensioned hole [Page] Xt{*N-v\
在连接盘中导通孔 via-in-pad FVB;\'/
孔位 hole location kF{*(r=.o
孔密度 hole density g|Y] wd
孔图 hole pattern ?!=iu!J
钻孔图 drill drawing 4J|t?]ij|E
装配图assembly drawing B-*E: O0y
参考基准 datum referan R# n%cXc|
1） 元件设备 'q>2t}K G
ExSO|g]%
三绕组变压器：three-column transformer ThrClnTrans >tG+?Y'{
双绕组变压器：double-column transformer DblClmnTrans R//$r%a
电容器：Capacitor !)qQbk
并联电容器：shunt capacitor ]WUC:6x
电抗器：Reactor =39 ?:VoD
母线：Busbar 1`LXz3uBe
输电线：TransmissionLine p0{EQT`tMG
发电厂：power plant ?\/qeGW6G
断路器：Breaker 0@5E|< A
刀闸(隔离开关)：Isolator LhzMAW<L4
分接头：tap 8Zc U[8r
电动机：motor Eq^uKi
（2） 状态参数 mmEp' E
'4OcZ/oI
有功：active power ~:lKS;PRuK
无功：reactive power Cs@ +r
电流：current 0rokR&Y-d
容量：capacity pi5GxD A]
电压：voltage \OC6M ` /
档位：tap position Te{ *6-gO3
有功损耗：reactive loss pi @Xkw
无功损耗：active loss E2AW7f(/
功率因数：power-factor Ogg#jx (4
功率：power g,]@4|
功角：power-angle \aP6_g:N}
电压等级：voltage grade D H^T x
空载损耗：no-load loss Y-~~,Yl~
铁损：iron loss td{O}\s7D
铜损：copper loss .5> 20\b2
空载电流：no-load current wP"q<W
g
阻抗：impedance .wK1El{bf
正序阻抗：positive sequence impedance ^1jk$$f
负序阻抗：negative sequence impedance yPu4T6V v
零序阻抗：zero sequence impedance [U\ (G
电阻：resistor )F pJ 1
电抗：reactance R^MiP|?ZH
电导：conductance E1Q0 k5@
电纳：susceptance ~S; Z\
无功负载：reactive load 或者QLoad *~z#.63oZ
有功负载: active load PLoad gJ 3c;
遥测：YC(telemetering) 2GWDEgI1o
遥信：YX %G?K@5?j?
励磁电流(转子电流)：magnetizing current W9J1=
定子：stator {hqAnZ@]vr
功角：power-angle ad n|N
上限:upper limit ,smF^l
下限：lower limit Ulqh@ CE)
并列的：apposable (A/0@ f1#
高压: high voltage ~fzuwz
低压：low voltage 9 1P4:6
中压：middle voltage 80ZnM%/}
电力系统 power system TSo:7&|
发电机 generator *]s&8/Gmb
励磁 excitation Mth6-^g5
励磁器 excitor #Og t(5Sd
电压 voltage 6J%iZ
电流 current A8?[6^%O |
母线 bus X)uDSI~
变压器 transformer ]UNZd/hIL
升压变压器 step-up transformer \gccQig1CJ
高压侧 high side 0jB X5
输电系统 power transmission system }qC SS <a
输电线 transmission line \&A+s4c")
固定串联电容补偿fixed series capacitor compensation :kw 0y
稳定 stability $W!]fc ZlB
电压稳定 voltage stability J(h3]J/Yw
功角稳定 angle stability uhn%lV]
暂态稳定 transient stability 0^_MN~s(X
电厂 power plant ;Gm>O7"|@
能量输送 power transfer w;yx<1f
交流 AC +lp{#1q0
装机容量 installed capacity sm s1%%~
电网 power system M% =P)cC
落点 drop point \~"#ld(x7
开关站 switch station \3{3ly~L
双回同杆并架 double-circuit lines on the same tower 02 f9 w V
变电站 transformer substation }. %s
xw
补偿度 degree of compensation /jrY %C
高抗 high voltage shunt reactor hWGZd~L
无功补偿 reactive power compensation {-*\w-~G
故障 fault qw:9zYG}qW
调节 regulation zS%
m_,t
裕度 magin b>q6:=((
三相故障 three phase fault t*+ ! n.p
故障切除时间 fault clearing time I}:L ]H{E
极限切除时间 critical clearing time b!~TAT&8
切机 generator triping :|XCnK0
高顶值 high limited value =g0*MZ;"
强行励磁 reinforced excitation N+>'J23d!
线路补偿器 LDC(line drop compensation) -h\@RC
机端 generator terminal &X w`T9<
静态 static (state) w yD%x(
动态 dynamic (state) \8_V(lU
单机无穷大系统 one machine - infinity bus system /"0as_L<
机端电压控制 AVR Ff/Ig]Lb
电抗 reactance #1l7 FT?q
电阻 resistance Z% Z"VoxH
功角 power angle
8xo;E=`
有功（功率） active power sQ(1/"gb
无功（功率） reactive power @aB9%An1
功率因数 power factor $5/\Z
无功电流 reactive current 92(~'5Qr
下降特性 droop characteristics FuMq|S
斜率 slope M'| )dM|
额定 rating S _T
变比 ratio `V~LV<v5
参考值 reference value R"Y?iZ ed3
电压互感器 PT JFJIls
分接头 tap -RC v7U`
下降率 droop rate }wkaQQh
仿真分析 simulation analysis n ` #+L~X
传递函数 transfer function El 1:?4;
框图 block diagram le2/Zs$
受端 receive-side T+B Iy|O
裕度 margin tBTJmih"
同步 synchronization j/`Up
失去同步 loss of synchronization [#zE.
TW
阻尼 damping T:)% P6/
摇摆 swing ~GYpa t
保护断路器 circuit breaker 6 <r2*`
电阻：resistance )y s=+Pz
电抗：reactance DrV0V
.t,
阻抗：impedance u
mqKFM$
电导：conductance I W8.
电纳：susceptance
