1 backplane 背板 =MjkD)l
2 Band gap voltage reference 带隙电压参考 kc7,F2=F
3 benchtop supply 工作台电源 Iy#=Nq=
4 Block Diagram 方块图 5 Bode Plot 波特图 dI?x&#(vw
6 Bootstrap 自举 \n<9R8g5
7 Bottom FET Bottom FET WdZ_^
8 bucket capcitor 桶形电容 9-" !v0['
9 chassis 机架 :l Bw0{fP
10 Combi-sense Combi-sense oiTSpd-
11 constant current source 恒流源 BA6(Owb
12 Core Sataration 铁芯饱和 |r+w(TG
13 crossover frequency 交叉频率 WS6;ad;|
14 current ripple 纹波电流 d^+0=_[PmK
15 Cycle by Cycle 逐周期 5rH?FQE
16 cycle skipping 周期跳步 2)MX<prH
17 Dead Time 死区时间 3%(,f,
18 DIE Temperature 核心温度 eqSCE6r9x
19 Disable 非使能，无效，禁用，关断 i ?:#lbw_
20 dominant pole 主极点 O)8$aAJ)V
21 Enable 使能，有效，启用 L-DL)8;`
22 ESD Rating ESD额定值 E"zC6iYZ;
23 Evaluation Board 评估板 :Xs3Vh,V
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. yXT.]%)
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 *_sSM+S
25 Failling edge 下降沿 z)ndj
1,#)
26 figure of merit 品质因数 W
P9PX
27 float charge voltage 浮充电压 u10;qYfL8o
28 flyback power stage 反驰式功率级 HV=P! v6
29 forward voltage drop 前向压降 HJ_8 `( '
30 free-running 自由运行 :!/ (N
31 Freewheel diode 续流二极管 D4O^5?F)|
32 Full load 满负载 33 gate drive 栅极驱动 "9X1T]
34 gate drive stage 栅极驱动级 iyv5\
35 gerber plot Gerber 图 Gzc`5n{"
36 ground plane 接地层 &)izh) FA
37 Henry 电感单位：亨利 8/<+p? 3p>
38 Human Body Model 人体模式 OK(xG3T
39 Hysteresis 滞回 +Kp8X 53
40 inrush current 涌入电流 6>gm!6`
41 Inverting 反相 b#( X+I
42 jittery 抖动 D]twid~OS
43 Junction 结点 &Eh OSu
44 Kelvin connection 开尔文连接 O$7cN\Z
45 Lead Frame 引脚框架 Z.b?Jzj
46 Lead Free 无铅 _H"_&m$aDm
47 level-shift 电平移动 AAF']z<4_"
48 Line regulation 电源调整率 "^oU&]KQJ
49 load regulation 负载调整率 X#o<))
50 Lot Number 批号 }ag;yf;
51 Low Dropout 低压差 9\VV++}s>o
52 Miller 密勒 53 node 节点 Oe21noL
54 Non-Inverting 非反相 iXLH[uhO;
55 novel 新颖的 k'NP +N<M
56 off state 关断状态 cs 58: G5
57 Operating supply voltage 电源工作电压 b$sT`+4q
58 out drive stage 输出驱动级 XZ<8M}Lg
59 Out of Phase 异相 b%].D(qBy
60 Part Number 产品型号 \c1>15
61 pass transistor pass transistor v0( _4U]/
62 P-channel MOSFET P沟道MOSFET 8p#V4liE
63 Phase margin 相位裕度 (6i4N2
64 Phase Node 开关节点 =@D H hg
65 portable electronics 便携式电子设备 b!qlucA eE
66 power down 掉电 ?e\u_3- 9
67 Power Good 电源正常 LbuhKL}VN
68 Power Groud 功率地 q ,+29
69 Power Save Mode 节电模式 XUA %3Xr
70 Power up 上电 q|
UO]V
71 pull down 下拉 uR.`8s |
72 pull up 上拉 y+
4#Iy
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） IP^1c a#<
74 push pull converter 推挽转换器 %{jL+4veoL
75 ramp down 斜降 `7oYXk
76 ramp up 斜升 U ]7;K>.T
77 redundant diode 冗余二极管 Z&n#*rQ7[
78 resistive divider 电阻分压器 : o:Z
79 ringing 振 铃 NU"L1dK
@
80 ripple current 纹波电流 [ OS& eK 8
81 rising edge 上升沿 })j N
8px
82 sense resistor 检测电阻 dM-~Qo
83 Sequenced Power Supplys 序列电源 =7EkN% V:{
84 shoot-through 直通，同时导通 [<sN "
85 stray inductances. 杂散电感 Gr'|n R8
86 sub-circuit 子电路 4 ]k o
87 substrate 基板 2Z ?l,M~
88 Telecom 电信 3_>=Cv}
89 Thermal Information 热性能信息 tF\_AvL_8
90 thermal slug 散热片 -wVu M.n(Z
91 Threshold 阈值 *J{E1])<a
92 timing resistor 振荡电阻 \ (}pm#O
93 Top FET Top FET q3`~uTzk
94 Trace 线路，走线，引线 $-.*8*9
95 Transfer function 传递函数 1k`gr&S
96 Trip Point 跳变点 1@9M[_<n5
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） >*\yEH9"
98 Under Voltage Lock Out (UVLO) 欠压锁定 mC3:P5/c
99 Voltage Reference 电压参考 D~ M* ]&
100 voltage-second product 伏秒积 FD[4?\W]#
101 zero-pole frequency compensation 零极点频率补偿 cYBjsN(!A|
102 beat frequency 拍频 GiKhdy
103 one shots 单击电路 4O:HT m
104 scaling 缩放 DQ&\k'"\
105 ESR 等效串联电阻 [Page] ! %B-y 9\
106 Ground 地电位 \Y`psSf+
107 trimmed bandgap 平衡带隙 qTN30(x2
108 dropout voltage 压差 s#(7D3Pr#
109 large bulk capacitance 大容量电容 N,.awA{
110 circuit breaker 断路器 ^gkKk&~A5?
111 charge pump 电荷泵 Htfq?\ FD
112 overshoot 过冲 bP,K a
KUC%Da3
印制电路printed circuit vQj {yJ\l1
印制线路 printed wiring m*\LO%s]E
印制板 printed board ":qS9vW
印制板电路 printed circuit board h,6> ^A
印制线路板 printed wiring board F"QJ)F
印制元件 printed component VV sE]7P ]
印制接点 printed contact hLVgP&/ E
印制板装配 printed board assembly =1xVw5^F
板 board (j(9' DjP
刚性印制板 rigid printed board fAfB.|cd
挠性印制电路 flexible printed circuit ,XI=e=
挠性印制线路 flexible printed wiring F 5OQM?J
齐平印制板 flush printed board 4G hg~0
金属芯印制板 metal core printed board 4q(,uk&R[
金属基印制板 metal base printed board uo*lW2&U
多重布线印制板 mulit-wiring printed board M:L-j{?y_
塑电路板 molded circuit board ,b?G]WQrHs
散线印制板 discrete wiring board tK
`A_h C
微线印制板 micro wire board ~#)9Kl7<X
积层印制板 buile-up printed board 9$} > O]
表面层合电路板 surface laminar circuit b@sq}8YD|z
埋入凸块连印制板 B2it printed board +UX}
"m~W
载芯片板 chip on board ~}SQLYy7Z
埋电阻板 buried resistance board = )4bf"~8
母板 mother board wUfPnAD.'
子板 daughter board |t z{Es<`B
背板 backplane SpOSUpl%
裸板 bare board C4t~k
键盘板夹心板 copper-invar-copper board
A7eYKo
q
动态挠性板 dynamic flex board c{39,oF
静态挠性板 static flex board O2fFh_\
可断拼板 break-away planel "{ d[V(lE"
电缆 cable l{VJaZ $M
挠性扁平电缆 flexible flat cable (FFC) lwo,D}
薄膜开关 membrane switch ,u!_mV
混合电路 hybrid circuit wo$ F_!3u
厚膜 thick film Ih;D-^RQ
厚膜电路 thick film circuit / Ao.b|mm
薄膜 thin film 6UuM `e u
薄膜混合电路 thin film hybrid circuit &(jt |?{
互连 interconnection Z m(}~C29
导线 conductor trace line 238z'I+$G/
齐平导线 flush conductor (C%qA<6
传输线 transmission line 6;Mv)|FJF
跨交 crossover +eop4 |Z
板边插头 edge-board contact ^ ,[gO#hgz
增强板 stiffener qQS&K%F
基底 substrate =,&{ &m)
基板面 real estate 6+C]rEY/o
导线面 conductor side N ]GF>kf:
元件面 component side G B>T3l"
焊接面 solder side $c LZ,N24
导电图形 conductive pattern ZJ [p7XP
非导电图形 non-conductive pattern k\ZU%"^J
基材 base material -cU w}
层压板 laminate SL<EZn0F9
覆金属箔基材 metal-clad bade material =S\pI
覆铜箔层压板 copper-clad laminate (CCL) Hq,N OP
复合层压板 composite laminate 6']WOM#
薄层压板 thin laminate h9~oS/%:
基体材料 basis material ytV4q U82G
预浸材料 prepreg (D\`:1g
粘结片 bonding sheet 5rJ7CfVq
预浸粘结片 preimpregnated bonding sheer 9F F
环氧玻璃基板 epoxy glass substrate VY0-18 o
预制内层覆箔板 mass lamination panel nrM-\'
内层芯板 core material j3>&Su>H4
粘结层 bonding layer g=N de2d?
粘结膜 film adhesive !T}R=;)e h
无支撑胶粘剂膜 unsupported adhesive film Su'l &]
覆盖层 cover layer (cover lay) >-(,BfZ
增强板材 stiffener material 5)gC<
铜箔面 copper-clad surface |]?7r?=J9v
去铜箔面 foil removal surface msw=x0{n5
层压板面 unclad laminate surface vQ{mEaH
基膜面 base film surface 4c.!^EiV
胶粘剂面 adhesive faec p,\(j
原始光洁面 plate finish gNh4c{Al9
粗面 matt finish F_V/&OV
剪切板 cut to size panel f6#1sO4"
超薄型层压板 ultra thin laminate "h&[6-0'
A阶树脂 A-stage resin ^YEMR C
B阶树脂 B-stage resin qi8~bQ{rH
C阶树脂 C-stage resin ;]2d %Qt
环氧树脂 epoxy resin ZrWA ,~;
酚醛树脂 phenolic resin [kI[qByf
聚酯树脂 polyester resin `,FhCT5
聚酰亚胺树脂 polyimide resin J z-RMX=
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin e W[](lGWM
丙烯酸树脂 acrylic resin Ul|htB<1:
三聚氰胺甲醛树脂 melamine formaldehyde resin ~VPE9D@
多官能环氧树脂 polyfunctional epoxy resin L0Z AF2O
溴化环氧树脂 brominated epoxy resin B>
zQ[e@t
环氧酚醛 epoxy novolac u/5)Yx+5_
氟树脂 fluroresin PxJvE*6^H
硅树脂 silicone resin }] j#C
硅烷 silane *,wW-8
聚合物 polymer =AeOki e
无定形聚合物 amorphous polymer "GAKi}y">v
结晶现象 crystalline polamer CbT ; #0
双晶现象 dimorphism i6E ~]&~.v
共聚物 copolymer 1xU) nXXb
合成树脂 synthetic 4o( Q+6m
热固性树脂 thermosetting resin [Page] x |3G}[=
热塑性树脂 thermoplastic resin $X rX(l5
感光性树脂 photosensitive resin B)Dsen
环氧值 epoxy value N\x <'P4q
双氰胺 dicyandiamide {CGk9g" `
粘结剂 binder CrX1qyR
胶粘剂 adesive q}J Eesf
固化剂 curing agent p1,.f&(f
阻燃剂 flame retardant RIF*9= ,S
遮光剂 opaquer Qy) -gax:,
增塑剂 plasticizers R78lV -};Q
不饱和聚酯 unsatuiated polyester N! 13QI
H
聚酯薄膜 polyester 2%j"E{J&
聚酰亚胺薄膜 polyimide film (PI) iD:T KB_r
聚四氟乙烯 polytetrafluoetylene (PTFE) kfy |3KA3m
增强材料 reinforcing material ;7g~4Uv4}
折痕 crease >):> Pz%U
云织 waviness FX/f0C3CK
鱼眼 fish eye IHe?/oUL"b
毛圈长 feather length iMp_1EXe
厚薄段 mark <*d jtO
裂缝 split *0%G`Q
捻度 twist of yarn tnw6[U!rh=
浸润剂含量 size content S!7|vb*ko
浸润剂残留量 size residue r7 *'s
处理剂含量 finish level `AhTER
偶联剂 couplint agent $eh>.c'&]
断裂长 breaking length g<MCvC@
吸水高度 height of capillary rise
4-q8:5
湿强度保留率 wet strength retention $(pVE}J
白度 whitenness $`Aps7A
导电箔 conductive foil ,}$[;$ye
铜箔 copper foil _(:bGI'.m
压延铜箔 rolled copper foil J|dj`Z ?
光面 shiny side );V.le}% (
粗糙面 matte side A )D1
#,0
处理面 treated side `qj24ehc
防锈处理 stain proofing fMRMQR=6B
双面处理铜箔 double treated foil mvGj
!'
模拟 simulation AM4
: xz
逻辑模拟 logic simulation rNX]t p{j
电路模拟 circit simulation )dI `yf
时序模拟 timing simulation XE : JL_
模块化 modularization =' #yG(h
设计原点 design origin }<G#bh6;Q
优化（设计） optimization (design) (hIy31Pf
供设计优化坐标轴 predominant axis KoTQc0b!
表格原点 table origin }%k 3
元件安置 component positioning }e&Z"H |
比例因子 scaling factor hx sW9
扫描填充 scan filling + Scw;gO
矩形填充 rectangle filling
8=j_~&*
填充域 region filling 0u f)6(f
实体设计 physical design ~Z
x_"
逻辑设计 logic design el^WBC3
逻辑电路 logic circuit 5U %a$.yr
层次设计 hierarchical design ?h'd\.j{
自顶向下设计 top-down design *W=R:Bl!
自底向上设计 bottom-up design T &kr IZw
费用矩阵 cost metrix kV+O|9
元件密度 component density 4$jb-Aw
自由度 degrees freedom kY`L[1G$
出度 out going degree DsF<P@O 6
入度 incoming degree Y'2 |G Jc2
曼哈顿距离 manhatton distance _9b;8%? Yf
欧几里德距离 euclidean distance hZLwg7X!
网络 network KJN{p~Q
阵列 array tD\%SiTg=b
段 segment 2$ gOe^ &
逻辑 logic 8zk?:?8%{
逻辑设计自动化 logic design automation %v 1NDhaXz
分线 separated time ,.&y -?
分层 separated layer :sXn*k4v
定顺序 definite sequence RS[>7-9
导线（通道） conduction (track) [5TGCGxP{
导线（体）宽度 conductor width YCEdt>5PA
导线距离 conductor spacing <46fk*
导线层 conductor layer x9VR>ux&
导线宽度/间距 conductor line/space ^K
n{L
第一导线层 conductor layer No.1 %oqC5O6
圆形盘 round pad w#\*{EN
方形盘 square pad z\ ?cazQ
菱形盘 diamond pad T_*R^Ukb5
长方形焊盘 oblong pad \*k}RKDwT
子弹形盘 bullet pad E]j2%}6Z%
泪滴盘 teardrop pad 0*}%v:uN9
雪人盘 snowman pad nA>kJSL'$
形盘 V-shaped pad V b(|1DE 0Cv
环形盘 annular pad V?"SrX N>
非圆形盘 non-circular pad *T{P^q.s~[
隔离盘 isolation pad $d _%7 xx
非功能连接盘 monfunctional pad F~tT5?+
偏置连接盘 offset land or{X{_X7
腹（背）裸盘 back-bard land U 4ELlxGe
盘址 anchoring spaur j ^'op|l
连接盘图形 land pattern Pf?y!d K <
连接盘网格阵列 land grid array vTY+J$N__
孔环 annular ring Km9Y_`?
元件孔 component hole `8rI nfV
安装孔 mounting hole R#UcwX}o
支撑孔 supported hole 0755;26Bx
非支撑孔 unsupported hole *Af:^>mh
导通孔 via WGeTL`}dh
镀通孔 plated through hole (PTH) m?Qr)F_M
余隙孔 access hole L#^'9v}Hb
盲孔 blind via (hole) c3$h-M(jVJ
埋孔 buried via hole (( D*kd"
埋,盲孔 buried blind via :RE.m d
任意层内部导通孔 any layer inner via hole wa*/Am9;~
全部钻孔 all drilled hole HKZD*E((
定位孔 toaling hole !9knF t43
无连接盘孔 landless hole Mk~]0d
中间孔 interstitial hole T2^0Q9E?
无连接盘导通孔 landless via hole Eax^1 |6
引导孔 pilot hole \KJ\> 2Y
端接全隙孔 terminal clearomee hole qvH7 otA
准尺寸孔 dimensioned hole [Page] $<(FZb=
在连接盘中导通孔 via-in-pad
{Bb:S"7NX
孔位 hole location ZfYva(zP{Q
孔密度 hole density 7jL3mI;n%;
孔图 hole pattern . w_oW mD
钻孔图 drill drawing w[S!U<9/
装配图assembly drawing _b8?_Zq
参考基准 datum referan <cn{S`
1） 元件设备 ~\^h;A'3
r)G^V&96
三绕组变压器：three-column transformer ThrClnTrans s;'j n_,0
双绕组变压器：double-column transformer DblClmnTrans gI SP .
电容器：Capacitor Nl S/PWc6(
并联电容器：shunt capacitor Qwm#6 {5
电抗器：Reactor (!@
Q\P
母线：Busbar 3 0fsVwE2
输电线：TransmissionLine o"a~
发电厂：power plant 9$u'2TV
断路器：Breaker Z`=[hu
刀闸(隔离开关)：Isolator cJnAwIs_e`
分接头：tap Gw/imXL
电动机：motor "#a_--"k9
（2） 状态参数 5D32d1A
^K#PcPF-j
有功：active power eXqS9`zKr
无功：reactive power "XEK oeG{
电流：current `T
gwa
容量：capacity ^" EsBt
电压：voltage zIyMq3
档位：tap position 0 =2D 90
有功损耗：reactive loss MifP ZQ
无功损耗：active loss dvAvG. ;U
功率因数：power-factor ;;9W/m~]
功率：power LXIQpD ,M
功角：power-angle %ifq4'?Z
电压等级：voltage grade ?5A!/`E& %
空载损耗：no-load loss -Tw96 dv
铁损：iron loss s:6pPJL
铜损：copper loss 19u'{/Y"
空载电流：no-load current rl0sN5n
阻抗：impedance <9]9;
正序阻抗：positive sequence impedance e*7nq ~ B5
负序阻抗：negative sequence impedance y3]7^+k
零序阻抗：zero sequence impedance vT#$`M<
电阻：resistor Y 7a<3>
电抗：reactance UKBVCAK
电导：conductance lm?1 K:+[
电纳：susceptance S+d@RMdes
无功负载：reactive load 或者QLoad x>?jfN,e
有功负载: active load PLoad y7;i4::A\
遥测：YC(telemetering) }E\ b_.
遥信：YX iG \ ]
励磁电流(转子电流)：magnetizing current "QWF&-kAI
定子：stator dc .o K4G}
功角：power-angle RGw=!0V
上限:upper limit aIrQ=}
下限：lower limit v[r5!, F
并列的：apposable FY^[?lj
高压: high voltage (o!v,=# 6{
低压：low voltage RJo"yB$1e6
中压：middle voltage r+}5;fQJ
电力系统 power system x*G-?Xza)
发电机 generator (~R [ K,G
励磁 excitation V'XmMn)!
励磁器 excitor G d".zsn
电压 voltage `h>a2
电流 current 7fVlA "x
母线 bus 2{v$GFc/
变压器 transformer HAH v^
升压变压器 step-up transformer Ag 3[Nu1
高压侧 high side &i&k 4
输电系统 power transmission system S1iF1X(+?X
输电线 transmission line -' j_JJ
固定串联电容补偿fixed series capacitor compensation :N \j@yJK
稳定 stability woctnT%"Q/
电压稳定 voltage stability 'l%b5:
功角稳定 angle stability 7X
h'VOljB
暂态稳定 transient stability x<m{B@3T
电厂 power plant gEVN;G'B<=
能量输送 power transfer }tvLe3O
交流 AC .Ulrv5wJ
装机容量 installed capacity He#5d!cf:M
电网 power system [jPUAr}
落点 drop point 0Q81$% @<
开关站 switch station dM%#DN8 l
双回同杆并架 double-circuit lines on the same tower 4z^ ?3@:K
变电站 transformer substation VJK?"m X
补偿度 degree of compensation K3uNR w
高抗 high voltage shunt reactor \`H"4r[?(
无功补偿 reactive power compensation J}Q4.1WG$
故障 fault I7b_dJD;*
调节 regulation h]wahExYP
裕度 magin 8 JOfx
三相故障 three phase fault AY{-Hf&
故障切除时间 fault clearing time q5jLK)
极限切除时间 critical clearing time 6TN!6 3{Cz
切机 generator triping 9n#Q1Xq
高顶值 high limited value &+@~;p 5F
强行励磁 reinforced excitation n"[VM=YGI
线路补偿器 LDC(line drop compensation) [D8u.8q
机端 generator terminal {u 3eel
静态 static (state) Xz,- '
动态 dynamic (state) _0~WT
单机无穷大系统 one machine - infinity bus system _|VWf 8?\
机端电压控制 AVR ~FnB!Mh}?
电抗 reactance {s=n "*Qp)
电阻 resistance ,QDS_u$xi&
功角 power angle AOT +4*)%
有功（功率） active power 4NY00d/R
无功（功率） reactive power Y<~N x~w{
功率因数 power factor mN5`Fct*A>
无功电流 reactive current q|*}>=NX
下降特性 droop characteristics 8Iz-YG~%3
斜率 slope +~gqP k
额定 rating .~ )[>
变比 ratio K"p$ga{
参考值 reference value f.V 1
电压互感器 PT >(v%"04|e
分接头 tap >d .o1<
下降率 droop rate ~VNN
仿真分析 simulation analysis 5|&:l8=
传递函数 transfer function <ej Wl% 4
框图 block diagram S >E|A %
受端 receive-side JfJU OaL
裕度 margin 4)'8fi
同步 synchronization @,Je*5$o"
失去同步 loss of synchronization ( ~YF m"S
阻尼 damping .rfufx9Sw
摇摆 swing KfC8~{O -
保护断路器 circuit breaker I\NiA>c
电阻：resistance RR2Q
电抗：reactance J.
]~J|K
阻抗：impedance rg Q6/3}qc
电导：conductance PUMh#^g}
电纳：susceptance
