1 backplane 背板 CdtwR0
2 Band gap voltage reference 带隙电压参考 ;BHIss7
3 benchtop supply 工作台电源 ~4ijiw$
4 Block Diagram 方块图 5 Bode Plot 波特图 NpGz y`&b
6 Bootstrap 自举 +>%AG&Pc
7 Bottom FET Bottom FET bW3Ah?0N
8 bucket capcitor 桶形电容 i}))6
9 chassis 机架 *r6v9
10 Combi-sense Combi-sense ^[2siG
11 constant current source 恒流源 sq8O+AWl
12 Core Sataration 铁芯饱和 Kf6D$}
13 crossover frequency 交叉频率 Lk-h AN{[
14 current ripple 纹波电流 P1`YbLER5
15 Cycle by Cycle 逐周期 t*c_70|@k
16 cycle skipping 周期跳步 ;;EFiaA
17 Dead Time 死区时间 ya;(D 8x)
18 DIE Temperature 核心温度 pT;xoe
19 Disable 非使能,无效,禁用,关断 mVT[:a3
20 dominant pole 主极点 P>|sCF
21 Enable 使能,有效,启用 ,^@/I:
22 ESD Rating ESD额定值 ;$4:
&T
23 Evaluation Board 评估板 f>? b2a2HX
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ;y>}LGG
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 _IvqZ/6Y(
25 Failling edge 下降沿 hXx:D3h
26 figure of merit 品质因数 U8zs=tA
27 float charge voltage 浮充电压 P;ZVv{mT
28 flyback power stage 反驰式功率级 8%b-.O:_$
29 forward voltage drop 前向压降 JS&;7Z$KX
30 free-running 自由运行 |j$$0N
31 Freewheel diode 续流二极管 ZYz8ul$E
32 Full load 满负载 33 gate drive 栅极驱动 os+]ct
34 gate drive stage 栅极驱动级 RRGs:h@;
35 gerber plot Gerber 图 .5#+)] l
36 ground plane 接地层 R~#&xfMd.
37 Henry 电感单位:亨利 m2F+6G
38 Human Body Model 人体模式 3C#Sr6
39 Hysteresis 滞回 c>#3{}X|x%
40 inrush current 涌入电流 z_Pq5
41 Inverting 反相 3gW+|3E
42 jittery 抖动 Q1DiEg
43 Junction 结点 o~VZ%B
44 Kelvin connection 开尔文连接 <!?ZH"F0
45 Lead Frame 引脚框架 /8lmNA
46 Lead Free 无铅 F[0w*i&u5
47 level-shift 电平移动 ;]%Syrzp
48 Line regulation 电源调整率 1]7v3m
49 load regulation 负载调整率 DM{Z#b]
50 Lot Number 批号 (i]0IYMXy*
51 Low Dropout 低压差 :)k|Onz
52 Miller 密勒 53 node 节点 Qgl5Jr.
54 Non-Inverting 非反相 _2<d6@}
55 novel 新颖的 B)&z% +
56 off state 关断状态 tLGNYW!K
57 Operating supply voltage 电源工作电压 wUzMB]w
58 out drive stage 输出驱动级 U+@rLQ.-
59 Out of Phase 异相 + Ui%}^ZZ
60 Part Number 产品型号 x\5\KGw16
61 pass transistor pass transistor -qB{TA-.\
62 P-channel MOSFET P沟道MOSFET AD"L>7
63 Phase margin 相位裕度 H$)otDOE
64 Phase Node 开关节点 .[vYT.LE
65 portable electronics 便携式电子设备 9:*a9xT,
66 power down 掉电 ` =I@W
67 Power Good 电源正常 <A]
Kg
68 Power Groud 功率地 C)ebZ3
69 Power Save Mode 节电模式 *Di ;Gf@
70 Power up 上电 <+ckE2j
71 pull down 下拉 RG`eNRTQ%
72 pull up 上拉 ^:o^g'Yab
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Yg]!`(db
74 push pull converter 推挽转换器 }[ByN).
75 ramp down 斜降 C*Dco{
EQ>
76 ramp up 斜升 OJ)XJL
77 redundant diode 冗余二极管 x)e(g}n
78 resistive divider 电阻分压器 /#e-x|L
79 ringing 振 铃 !l1jQq_mK
80 ripple current 纹波电流 OH vV_
81 rising edge 上升沿 h%U,g
9_
82 sense resistor 检测电阻 \l/<[ZZ
83 Sequenced Power Supplys 序列电源 zR }vw{
84 shoot-through 直通,同时导通 ~P+;_
85 stray inductances. 杂散电感 3xpygx9
86 sub-circuit 子电路 :ZU-Vi.b
87 substrate 基板 jN sM&s,
88 Telecom 电信 X%Ta?(9|.^
89 Thermal Information 热性能信息 %Yny/O\e%
90 thermal slug 散热片 lBOxB/`
91 Threshold 阈值 &=v5M9GR]
92 timing resistor 振荡电阻 8"J6(KS
93 Top FET Top FET Uy{ZK*c8i
94 Trace 线路,走线,引线 (l:LG"sy\
95 Transfer function 传递函数 wZ~eE'zx+
96 Trip Point 跳变点 qUG)+~g`
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 6G?7>M
98 Under Voltage Lock Out (UVLO) 欠压锁定 vA0f4W 8+
99 Voltage Reference 电压参考 ag"Nf-o/Y
100 voltage-second product 伏秒积 sm;\;MP*yH
101 zero-pole frequency compensation 零极点频率补偿 -|/*S]6kK
102 beat frequency 拍频 QPp>%iE@
103 one shots 单击电路
BPC>
104 scaling 缩放 $Q*^c"&
105 ESR 等效串联电阻 [Page] 4XArpKA
106 Ground 地电位 *&rV}vVP^
107 trimmed bandgap 平衡带隙 IFF3gh42.
108 dropout voltage 压差 ci{WyIh
109 large bulk capacitance 大容量电容 Ct9*T`Gl
110 circuit breaker 断路器 `'/1Ij+
111 charge pump 电荷泵 uE,j$d
112 overshoot 过冲 ?bl9e&/!
0tP{K
印制电路printed circuit tcj3x<
印制线路 printed wiring 8jU6N*p/
印制板 printed board ZTK)N
印制板电路 printed circuit board r[ RO"Ej"
印制线路板 printed wiring board ^uWj#
印制元件 printed component #i[V{J8.p
印制接点 printed contact H.[t&VO
印制板装配 printed board assembly =1% <
板 board M0"}>`1lJ
刚性印制板 rigid printed board Xm[Cgt_?
挠性印制电路 flexible printed circuit q%8Ck)xz
挠性印制线路 flexible printed wiring #l-/!j
齐平印制板 flush printed board 17B`
金属芯印制板 metal core printed board ;2iDa
金属基印制板 metal base printed board 'V(9ein^Q
多重布线印制板 mulit-wiring printed board @7OE:& #V
塑电路板 molded circuit board $O^U"
散线印制板 discrete wiring board uKd79[1
微线印制板 micro wire board E#mpj~{-
积层印制板 buile-up printed board |FJc'&) J"
表面层合电路板 surface laminar circuit A,! YXl[
埋入凸块连印制板 B2it printed board *Au[{sR
载芯片板 chip on board F48W8'un
埋电阻板 buried resistance board u_X(c'aE;
母板 mother board 6gJc?+
子板 daughter board mA0|W#NB
背板 backplane
tf?"AY4
裸板 bare board .*g^
i`
键盘板夹心板 copper-invar-copper board wxo{gBq
动态挠性板 dynamic flex board *aS[^iX?s
静态挠性板 static flex board gatxvR7H
可断拼板 break-away planel lsRW.h,
电缆 cable [HSN*LXe
挠性扁平电缆 flexible flat cable (FFC) %3 VToj@`>
薄膜开关 membrane switch /7p1y v
混合电路 hybrid circuit oq9gG)F
厚膜 thick film R'x^Y"
厚膜电路 thick film circuit $o>6Io|D
薄膜 thin film u1_NC;
薄膜混合电路 thin film hybrid circuit ]5j1p6;(`
互连 interconnection ^F`\B'8MF
导线 conductor trace line tY6QhhuS:
齐平导线 flush conductor \6K1Z!*;
传输线 transmission line vON1\$bu`
跨交 crossover ,U#FtOec
板边插头 edge-board contact 5WU?Km
增强板 stiffener H4JwgQ
基底 substrate ^?o> (K
基板面 real estate WS1$cAD2N
导线面 conductor side @sLB
_f
元件面 component side \:`-"Ou(*
焊接面 solder side ()%;s2>F
导电图形 conductive pattern Xo~kB)|,
非导电图形 non-conductive pattern I=}pT50~9
基材 base material `ls^fnJTpf
层压板 laminate P'D'+qS
覆金属箔基材 metal-clad bade material C &-]RffA
覆铜箔层压板 copper-clad laminate (CCL) Gjo&~*;
复合层压板 composite laminate @c^g<
薄层压板 thin laminate D|E,9|=v
基体材料 basis material LXx`Vk>ky
预浸材料 prepreg \s">trXwX
粘结片 bonding sheet <Z\j#p:
预浸粘结片 preimpregnated bonding sheer uT2w2A;
环氧玻璃基板 epoxy glass substrate eCXw8
预制内层覆箔板 mass lamination panel (G`O[JF
内层芯板 core material vFgX]&bE
粘结层 bonding layer ?D S|vCae
粘结膜 film adhesive |FxTP&8~
无支撑胶粘剂膜 unsupported adhesive film \R (Yf!>
覆盖层 cover layer (cover lay) Nkg^;-CV0
增强板材 stiffener material `]4bH,%~
铜箔面 copper-clad surface ^)0b= (.
去铜箔面 foil removal surface cHk ?$
层压板面 unclad laminate surface [pYjH+<
基膜面 base film surface Swnom?t
胶粘剂面 adhesive faec 7)37AK w
原始光洁面 plate finish ZRLS3*`
粗面 matt finish O t1:z:Pl
剪切板 cut to size panel x|q|> dPB
超薄型层压板 ultra thin laminate wl:[Ad
A阶树脂 A-stage resin +DA,|~k_
B阶树脂 B-stage resin b 3i34,
C阶树脂 C-stage resin GMQKR,6VM
环氧树脂 epoxy resin -Vhxnh S
酚醛树脂 phenolic resin /E<:=DD<
聚酯树脂 polyester resin ])iw|`@dJ
聚酰亚胺树脂 polyimide resin qhqqCVrsW
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin D!nx %%q
丙烯酸树脂 acrylic resin i.G"21M
三聚氰胺甲醛树脂 melamine formaldehyde resin ~sbn"OS+
多官能环氧树脂 polyfunctional epoxy resin Y[Kpd[)[v
溴化环氧树脂 brominated epoxy resin *ci%c^}V
环氧酚醛 epoxy novolac wA?q/cw C
氟树脂 fluroresin Z}s56{!.
硅树脂 silicone resin |tqYRWn0
硅烷 silane 1@{qPmf^
聚合物 polymer
_)=eE
无定形聚合物 amorphous polymer .l}oxWWoS
结晶现象 crystalline polamer .rs\%M|X
双晶现象 dimorphism ry!0~ir
共聚物 copolymer >^ijj`{d
合成树脂 synthetic =Xh*w
热固性树脂 thermosetting resin [Page] VAet!H +]
热塑性树脂 thermoplastic resin e<1)KqG
感光性树脂 photosensitive resin bA8RoC
环氧值 epoxy value }Z3+z@L
双氰胺 dicyandiamide CwQRHi
粘结剂 binder rugR>&mea
胶粘剂 adesive @w{"6xc%a
固化剂 curing agent 8KyF0r?
阻燃剂 flame retardant ;/=6~%
遮光剂 opaquer i*2l4
增塑剂 plasticizers ]0@
06G(y
不饱和聚酯 unsatuiated polyester Bl!R
bh\
聚酯薄膜 polyester *J|]E(
聚酰亚胺薄膜 polyimide film (PI) %% A==_b
聚四氟乙烯 polytetrafluoetylene (PTFE) ZtH{2j0
增强材料 reinforcing material Gn}^BJN
折痕 crease AxZaV;%*
云织 waviness N,~"8YSo
鱼眼 fish eye I4\
c+f9
毛圈长 feather length Xw_6SR9C
厚薄段 mark )h,-zAnZ
裂缝 split F
uJ=]T
捻度 twist of yarn unN=yeut
浸润剂含量 size content +#MQ8d
浸润剂残留量 size residue T
}^2IJ]
处理剂含量 finish level S1G3xY$0
偶联剂 couplint agent 0V5 {:mzA
断裂长 breaking length WSV[)-=:
吸水高度 height of capillary rise Fb&WwGY,P
湿强度保留率 wet strength retention BOf)27)
白度 whitenness X Cf!xIv
导电箔 conductive foil -P[bA0N,
铜箔 copper foil \\i$zRi
压延铜箔 rolled copper foil _ pKWDMB$z
光面 shiny side =]<JkWSk
粗糙面 matte side
fgE Mn;
处理面 treated side f%cbBx^;
防锈处理 stain proofing cu#s}*Ip
双面处理铜箔 double treated foil RuuXDuu:VL
模拟 simulation k*Vf2O3${
逻辑模拟 logic simulation )*I%rN8b
电路模拟 circit simulation tDwj~{a~
时序模拟 timing simulation 9_I#{?
模块化 modularization DY6ra% T
设计原点 design origin rtY4B~_
优化(设计) optimization (design) o dTg.m
供设计优化坐标轴 predominant axis Y:'#jY*V
表格原点 table origin |cd=7[B
元件安置 component positioning /!HFi>
比例因子 scaling factor T^XU5qgN
扫描填充 scan filling kF o&!
矩形填充 rectangle filling ? =a,
填充域 region filling PP_fTacX
实体设计 physical design -|x YT+?%
逻辑设计 logic design F\(7B#
逻辑电路 logic circuit D>).^>|q
层次设计 hierarchical design tpP2dg9dF
自顶向下设计 top-down design #RWH k
自底向上设计 bottom-up design DA-W =Cc
费用矩阵 cost metrix 'p:L"L}Q?
元件密度 component density Z4aK
自由度 degrees freedom wc7F45l4
出度 out going degree Yvbk[Rb
入度 incoming degree ]53'\TH
曼哈顿距离 manhatton distance 2*1FW v
欧几里德距离 euclidean distance _z(ydL*
网络 network \~ql_X;3
阵列 array JU\wvP5j
段 segment 2W]y9)<c
逻辑 logic LJII7<k
逻辑设计自动化 logic design automation PS${B
分线 separated time [osm\w49
分层 separated layer sM8 AORd
定顺序 definite sequence {P>%l\?
导线(通道) conduction (track) Yt%
E,U~g
导线(体)宽度 conductor width "=r"c$xou
导线距离 conductor spacing 6ISDY>p
导线层 conductor layer b/dyH
导线宽度/间距 conductor line/space ^vH3 -A;*
第一导线层 conductor layer No.1 ,H+LE$=
圆形盘 round pad (!9ybH;T
方形盘 square pad OlI {VszR
菱形盘 diamond pad Q0cr^24/
长方形焊盘 oblong pad B{+ Ra
子弹形盘 bullet pad =-GHs$u%f
泪滴盘 teardrop pad LUjev\Re
雪人盘 snowman pad qmJ^@dxs
形盘 V-shaped pad V b 7%O[
环形盘 annular pad 3x{2Dh i
非圆形盘 non-circular pad b!ea(D!:
隔离盘 isolation pad P Zc{wbjp&
非功能连接盘 monfunctional pad ]A2l%V_7
偏置连接盘 offset land I N'a5&..
腹(背)裸盘 back-bard land :x<'>)6
盘址 anchoring spaur zxr|:KC ?&
连接盘图形 land pattern 1~#2AdG
连接盘网格阵列 land grid array U'tfsf/V
孔环 annular ring / NlT[@T
元件孔 component hole 0{GpO6!
安装孔 mounting hole A+Xk=k5<
支撑孔 supported hole &]? X"K
非支撑孔 unsupported hole L--(Y+vmf
导通孔 via 7>`VZ?
镀通孔 plated through hole (PTH) @Ja8~5 :
余隙孔 access hole AqzPwO^
盲孔 blind via (hole) xXktMlI
埋孔 buried via hole bqt*d)$
埋,盲孔 buried blind via $"/xi `
任意层内部导通孔 any layer inner via hole NHCdf*
全部钻孔 all drilled hole -^sbf.
定位孔 toaling hole =tv,B3Mo
无连接盘孔 landless hole AShnCL8uR
中间孔 interstitial hole Vp'Zm:
无连接盘导通孔 landless via hole d:"]*EZ [
引导孔 pilot hole -&ic%0|f
端接全隙孔 terminal clearomee hole ?(^HjRUY
准尺寸孔 dimensioned hole [Page] fiq4|!^h
在连接盘中导通孔 via-in-pad jB17]OCN
孔位 hole location BWct0=
孔密度 hole density Q6 G-`&5
孔图 hole pattern =nYd|Ok
钻孔图 drill drawing rK%A=Q
装配图assembly drawing D{{ME8
参考基准 datum referan z3 lZ3
1) 元件设备 }!i#1uHUH:
b$f@.L
三绕组变压器:three-column transformer ThrClnTrans 9$ z|kwU
双绕组变压器:double-column transformer DblClmnTrans to1{7q
电容器:Capacitor E-\<,=bh
并联电容器:shunt capacitor 5UQz6DK
电抗器:Reactor ^0/FZ)V8
母线:Busbar 0z2A!a p
输电线:TransmissionLine GN4'LU
发电厂:power plant zw`T^N#
断路器:Breaker X4:\Shb97
刀闸(隔离开关):Isolator U9[
&ci
分接头:tap t}zffe-
电动机:motor (hB&OP5Fne
(2) 状态参数 mZ^z%+Ca|
+ou
]|
有功:active power w(QU '4~
无功:reactive power >[=fbL@N<@
电流:current "eq{_4dL
容量:capacity ZxmMw
电压:voltage UN
<s1
档位:tap position cY|?iEVs)
有功损耗:reactive loss iyF~:[8
无功损耗:active loss =kz(1Pb
功率因数:power-factor Q2c|sK8
功率:power .a%D:4GYR
功角:power-angle k !S0-/h
电压等级:voltage grade 0UEEvD5
空载损耗:no-load loss 8,Jjv*
铁损:iron loss =l_B58wrx
铜损:copper loss (j^Qa~{mG4
空载电流:no-load current z+K -aj w
阻抗:impedance |F
}y6 gH
正序阻抗:positive sequence impedance uXX3IE[
负序阻抗:negative sequence impedance TBN0u k
零序阻抗:zero sequence impedance l,n0=Ew
电阻:resistor 42a.@JbLQ
电抗:reactance tiZ5
:^$b4
电导:conductance }fps~R
电纳:susceptance g\CRx^s
无功负载:reactive load 或者QLoad B?
$9M9
有功负载: active load PLoad `ZCeuOH
遥测:YC(telemetering) v+.
n9
遥信:YX 6>rgoT)6~
励磁电流(转子电流):magnetizing current WoVPp*zlX
定子:stator 'OIOl
功角:power-angle 'c[[H3s!;
上限:upper limit v=kQ/h
下限:lower limit _g|zDi^
并列的:apposable e>zCzKK
高压: high voltage \K$9r=!(
低压:low voltage S]E1+,-*
中压:middle voltage KMO(f!?
电力系统 power system 3*< O-Jr
发电机 generator J*Dt\[X
励磁 excitation #wXq'yi
励磁器 excitor `mar-r_m
电压 voltage 'R&Y pR
电流 current YP*EDb?f
母线 bus xbbQ)sH&m
变压器 transformer &cnciEw1
升压变压器 step-up transformer ldd|"[Ds
高压侧 high side C-i9F%..
输电系统 power transmission system i3bH^WwE&k
输电线 transmission line a$0,T_wD
固定串联电容补偿fixed series capacitor compensation 42* y27Dtm
稳定 stability BHoy:Tp
电压稳定 voltage stability Gk<M@d^hQ
功角稳定 angle stability :@BAiKa[wa
暂态稳定 transient stability Af~>}-`a
电厂 power plant %49P<vo`?
能量输送 power transfer [BPK0
交流 AC }I3 ZNd
装机容量 installed capacity n}KF)W=
电网 power system 6n[O8^
落点 drop point d']CBoK
开关站 switch station !*[Fw1-J
双回同杆并架 double-circuit lines on the same tower 7ojU]l y
变电站 transformer substation N_3$B=
补偿度 degree of compensation F8u;C:^d
高抗 high voltage shunt reactor ['<Q402:.
无功补偿 reactive power compensation up(6/-/.7
故障 fault PxuE(n V[
调节 regulation h(M_
K
裕度 magin RKI BFP8.
三相故障 three phase fault ORVFp]gG
故障切除时间 fault clearing time R,]J~TfPK
极限切除时间 critical clearing time Y[_{tS#u
切机 generator triping <+7]EwVcn^
高顶值 high limited value T;7=05k<_
强行励磁 reinforced excitation DC9\Sp?
线路补偿器 LDC(line drop compensation) |p4D!M+$7
机端 generator terminal vy:-a G
静态 static (state) JQi+y;
动态 dynamic (state) ??\1eo2gB
单机无穷大系统 one machine - infinity bus system ;Jh=7wx
机端电压控制 AVR |hx"yy'ux
电抗 reactance #$-zg^
电阻 resistance w'[^RZW:j
功角 power angle cSbyVC[r
有功(功率) active power = aO1uC|6C
无功(功率) reactive power uPe&i5YR
功率因数 power factor E#?Bn5-uBs
无功电流 reactive current O4)'78ATp
下降特性 droop characteristics N>zpxU {
斜率 slope 2p^Jqp`$
额定 rating @2yoy&IO
变比 ratio )JNUfauyT
参考值 reference value H0!LiazA>
电压互感器 PT ":qhO0
分接头 tap xE$>;30b_
下降率 droop rate cDkq@H:
仿真分析 simulation analysis !^[i"F:G
传递函数 transfer function I{/}pr>
框图 block diagram M%yeI{m
受端 receive-side wBuos}/
裕度 margin ''Pu
同步 synchronization +69[06F
失去同步 loss of synchronization hFW{qWP
阻尼 damping 2|6E{o
摇摆 swing _nUvDdEs,
保护断路器 circuit breaker !t;B.[U *
电阻:resistance /JqNiqvh
电抗:reactance i?HN
阻抗:impedance Z2t'?N|_
电导:conductance )ajF ca@v
电纳:susceptance