1 backplane 背板 K/oC+Z;K
2 Band gap voltage reference 带隙电压参考 /8V#6d_
3 benchtop supply 工作台电源 E]zTd$v6
4 Block Diagram 方块图 5 Bode Plot 波特图 tK9_]663
6 Bootstrap 自举 K_\fO|<k
7 Bottom FET Bottom FET _-^bAr`z
8 bucket capcitor 桶形电容 xw?Mc{w
9 chassis 机架 *#ccz
10 Combi-sense Combi-sense _TF\y@hF*D
11 constant current source 恒流源 e[txJ*SuO
12 Core Sataration 铁芯饱和 X$"=\p>X
13 crossover frequency 交叉频率 jKFypIZ4
14 current ripple 纹波电流 3yNILj
15 Cycle by Cycle 逐周期 y+3<
]
N
16 cycle skipping 周期跳步 Y\e,#y
17 Dead Time 死区时间 4-P'e%S
18 DIE Temperature 核心温度 WzM9{c
19 Disable 非使能,无效,禁用,关断 &,?bX])
20 dominant pole 主极点 /_Z--s>j
21 Enable 使能,有效,启用 DP E NYr
22 ESD Rating ESD额定值 /S}0u}jID?
23 Evaluation Board 评估板 CiE
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Jw%0t'0Zi
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 \@yx;}bdI
25 Failling edge 下降沿 sT|$@$bN
26 figure of merit 品质因数 INca
27 float charge voltage 浮充电压 U`gQ7
28 flyback power stage 反驰式功率级 /mMRV:pd
29 forward voltage drop 前向压降 ~udi=J|
30 free-running 自由运行 A?l.(qGC_
31 Freewheel diode 续流二极管 QR'yZ45n4
32 Full load 满负载 33 gate drive 栅极驱动 z[kz[
34 gate drive stage 栅极驱动级 :W'Yt9v)
35 gerber plot Gerber 图 Z i-)PK^
36 ground plane 接地层 r:h\{DVf
37 Henry 电感单位:亨利 9qIdwDRY
38 Human Body Model 人体模式 1mT3$Z
39 Hysteresis 滞回 +5n,/YjS`
40 inrush current 涌入电流 U1pL
`P1
41 Inverting 反相 .+1.??8:+
42 jittery 抖动 //C3tW
43 Junction 结点 R"Q=U}?$
44 Kelvin connection 开尔文连接 #R_IF&7
45 Lead Frame 引脚框架 HWe?vz$4"
46 Lead Free 无铅 ka_]s:>+
47 level-shift 电平移动 <gU^#gsGra
48 Line regulation 电源调整率 Jv
49 load regulation 负载调整率 U=_O*n?N-d
50 Lot Number 批号 g'G"`)~ 2
51 Low Dropout 低压差 IipG?v0z~
52 Miller 密勒 53 node 节点 [t^Z2a{
54 Non-Inverting 非反相 1+;Z0$edxz
55 novel 新颖的 KiXXlaOs
56 off state 关断状态 #KA,=J
57 Operating supply voltage 电源工作电压 w_-v!s2
58 out drive stage 输出驱动级 5mNd5IM
59 Out of Phase 异相 CRy;>UI
60 Part Number 产品型号 IY$H M3t7
61 pass transistor pass transistor '~?\NeO=
62 P-channel MOSFET P沟道MOSFET C3|(XChqC
63 Phase margin 相位裕度 yp%7zrU
64 Phase Node 开关节点 c}9.Or`?
65 portable electronics 便携式电子设备 98u$5=Z'/
66 power down 掉电 VEAf,{)Q
67 Power Good 电源正常 zUg-M
68 Power Groud 功率地 CB(Qy9C%h[
69 Power Save Mode 节电模式 Gv,_;?7lD
70 Power up 上电 9F8"(
71 pull down 下拉 M7R.?nk
72 pull up 上拉 DgOO\
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) a4gJ-FE
74 push pull converter 推挽转换器 %X(iAoxbj
75 ramp down 斜降 `TvpKS5.Y
76 ramp up 斜升 sdq8wn
77 redundant diode 冗余二极管 p|Po##E}g^
78 resistive divider 电阻分压器 (ly4[G1y
79 ringing 振 铃 #Z8=z*4
80 ripple current 纹波电流 H+&c=~D\_
81 rising edge 上升沿 Bob K>db
82 sense resistor 检测电阻 69)- )en
83 Sequenced Power Supplys 序列电源 d_CY=DHF%`
84 shoot-through 直通,同时导通 [[(29|`]
85 stray inductances. 杂散电感 Bny3j~*U
86 sub-circuit 子电路 , VT&
87 substrate 基板 d+ P<nI/|
88 Telecom 电信 $q`650&S*
89 Thermal Information 热性能信息 p<#WueR[
90 thermal slug 散热片 W0GDn
91 Threshold 阈值 '0z-duu
92 timing resistor 振荡电阻 &6-udZB-
93 Top FET Top FET &)?ECj0`
94 Trace 线路,走线,引线 G}B)bM2
95 Transfer function 传递函数 P@Oq'y[
96 Trip Point 跳变点 92|\`\LP%
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) "M.\Z9BCt
98 Under Voltage Lock Out (UVLO) 欠压锁定 p8CDFLuV
99 Voltage Reference 电压参考 +Tnn'^4
100 voltage-second product 伏秒积 `Pa z
101 zero-pole frequency compensation 零极点频率补偿 jqULg iC
102 beat frequency 拍频 APydZ
103 one shots 单击电路 z;? 32K
104 scaling 缩放 5;{Q >n
105 ESR 等效串联电阻 [Page] R
pUq#Y:a
106 Ground 地电位 [=dK%7v
107 trimmed bandgap 平衡带隙 G:'hT=8
108 dropout voltage 压差 9os>k*
109 large bulk capacitance 大容量电容 }GV5':W@WG
110 circuit breaker 断路器 @VlDi1
111 charge pump 电荷泵 WP/?(%#Y
112 overshoot 过冲 Ae,P&(
I"TFj$Pg
印制电路printed circuit
DEj6 ky
印制线路 printed wiring J&mZsa)4
印制板 printed board Jw;Tq"&
印制板电路 printed circuit board
jQDXl
印制线路板 printed wiring board d\% |!ix
印制元件 printed component X?PcEAi;w
印制接点 printed contact {9>LF
印制板装配 printed board assembly R(jp
板 board O}Y& @V%4k
刚性印制板 rigid printed board @w?y;W!a>
挠性印制电路 flexible printed circuit oC"1{ybyl
挠性印制线路 flexible printed wiring .UJp#/EHs
齐平印制板 flush printed board ?];?3X~|
金属芯印制板 metal core printed board Aj9<4N
金属基印制板 metal base printed board H{Fww4pn
多重布线印制板 mulit-wiring printed board K"lZwU\:On
塑电路板 molded circuit board b#ih=qE
散线印制板 discrete wiring board ;- ~}g 7$
微线印制板 micro wire board vUtA@
积层印制板 buile-up printed board i7N|p9O.
表面层合电路板 surface laminar circuit g<ZB9;FX %
埋入凸块连印制板 B2it printed board :xd)]Ns
载芯片板 chip on board yHrYSEM
埋电阻板 buried resistance board eiTG
母板 mother board *qM)[XO
子板 daughter board oT=XCa5
背板 backplane ){~]-VK
裸板 bare board >x/;'Y.
键盘板夹心板 copper-invar-copper board Pe-1o#7~W
动态挠性板 dynamic flex board rd#O ]
静态挠性板 static flex board /*v}.fH%
可断拼板 break-away planel ZboY]1L[j
电缆 cable h^Bp^V5#
挠性扁平电缆 flexible flat cable (FFC) .(D,CGtYb
薄膜开关 membrane switch Cp[{|U-?G
混合电路 hybrid circuit 9Tju+KcK
厚膜 thick film E@uxEF
厚膜电路 thick film circuit H Pvs~`>V
薄膜 thin film WoYXXYP/E
薄膜混合电路 thin film hybrid circuit st91rV$y?
互连 interconnection Ze?(N~
导线 conductor trace line m]XG7:}V0
齐平导线 flush conductor v'fX'/
传输线 transmission line Pl2ZA)[g
跨交 crossover m+Um^:\jX
板边插头 edge-board contact 1MVzu7
增强板 stiffener luPj'd?
基底 substrate R]Iv?)Y
基板面 real estate (fSpY\JPI
导线面 conductor side I=vGS
元件面 component side 7Pb:z4j
焊接面 solder side 9hbn<Y
导电图形 conductive pattern OE{PP9eh
非导电图形 non-conductive pattern at(oepq
基材 base material 'f'zV@)
层压板 laminate zQPQP`
覆金属箔基材 metal-clad bade material ;";#{B:
覆铜箔层压板 copper-clad laminate (CCL) &O&;v|!9
复合层压板 composite laminate dE ,NG)MH
薄层压板 thin laminate #YEOY#
基体材料 basis material Uu}a! V
预浸材料 prepreg cq?&edjP
粘结片 bonding sheet F4o)6+YM
预浸粘结片 preimpregnated bonding sheer aC2cyUuaN
环氧玻璃基板 epoxy glass substrate e7# B?
预制内层覆箔板 mass lamination panel Ei$@)qS/
内层芯板 core material S(&]?!
粘结层 bonding layer +?&|p0
粘结膜 film adhesive B '@a36
无支撑胶粘剂膜 unsupported adhesive film n91@{U)QJ3
覆盖层 cover layer (cover lay) #z.QBG@
增强板材 stiffener material *'BA#
/@
铜箔面 copper-clad surface Hea76P5$P+
去铜箔面 foil removal surface
B#Q=Fo 6
层压板面 unclad laminate surface 8dBG ZwyET
基膜面 base film surface r=S6yq}
胶粘剂面 adhesive faec dI$U{;t
原始光洁面 plate finish >U%:Nfo3
粗面 matt finish 2A,iY}R
剪切板 cut to size panel #0F6{&;
M
超薄型层压板 ultra thin laminate df'xx)kW
A阶树脂 A-stage resin 2{`[<w
B阶树脂 B-stage resin ea\b7a*
C阶树脂 C-stage resin OS.oknzZZ
环氧树脂 epoxy resin [0lu&ak[&
酚醛树脂 phenolic resin 8`$lsD
聚酯树脂 polyester resin 0/g 0=dW=
聚酰亚胺树脂 polyimide resin 0}:wM':G
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin GELxS!
丙烯酸树脂 acrylic resin
Qr n^T
三聚氰胺甲醛树脂 melamine formaldehyde resin O=A(x m#
多官能环氧树脂 polyfunctional epoxy resin q|EE
em
溴化环氧树脂 brominated epoxy resin eHt |O~
环氧酚醛 epoxy novolac 3%J7_e'
氟树脂 fluroresin (mvzGXNz4
硅树脂 silicone resin l+V#`S*q
硅烷 silane `g~T #U\>d
聚合物 polymer DjK
无定形聚合物 amorphous polymer c!2j+ORz
结晶现象 crystalline polamer L<`p;?
双晶现象 dimorphism ?F!='6D}b
共聚物 copolymer O!
t>
@%)
合成树脂 synthetic 0>aAI3E
热固性树脂 thermosetting resin [Page] LY? `+/
热塑性树脂 thermoplastic resin p2\mPFxEP
感光性树脂 photosensitive resin jQ 'r};;
环氧值 epoxy value /HiRbwQK#
双氰胺 dicyandiamide 1~|o@CO
粘结剂 binder i_KAD U&mP
胶粘剂 adesive EAE\'9T&g
固化剂 curing agent *fIb|r
阻燃剂 flame retardant BB)(#yoi
遮光剂 opaquer >bo_
增塑剂 plasticizers E#T6rd P
不饱和聚酯 unsatuiated polyester n$})}kj
聚酯薄膜 polyester bt2`elH|
聚酰亚胺薄膜 polyimide film (PI) ZB|y
聚四氟乙烯 polytetrafluoetylene (PTFE) VuiK5?m
增强材料 reinforcing material 1(;_1@P
折痕 crease WF!u2E+
云织 waviness :I)WSXP9h
鱼眼 fish eye -wi zUp
毛圈长 feather length ]'%Z&1 w
厚薄段 mark T*'?;u
裂缝 split [*jvvkAp
捻度 twist of yarn 7:cmBkXm
浸润剂含量 size content GmJ4AYEP
浸润剂残留量 size residue k>ERU]7[
处理剂含量 finish level 8=!BtMd"
偶联剂 couplint agent H`XE5Hk)P%
断裂长 breaking length -76l*=|
吸水高度 height of capillary rise ,o\-'
湿强度保留率 wet strength retention RdtF5#\z
白度 whitenness m&36$>r=
导电箔 conductive foil ^#Ruw?D
铜箔 copper foil (8$; 4 q[!
压延铜箔 rolled copper foil ;YYo^9Lh}
光面 shiny side ohod)8
粗糙面 matte side (/oHj^>3N`
处理面 treated side 2^*a$OJ
防锈处理 stain proofing
D ^Cpgha
双面处理铜箔 double treated foil 2L!wbeTb;
模拟 simulation [
BpZ{Ql
逻辑模拟 logic simulation p}r1@L s
电路模拟 circit simulation 3a_=e
B
时序模拟 timing simulation rda/
模块化 modularization Pm
Zb!|
设计原点 design origin X5V8w4NN
优化(设计) optimization (design) O8 \dMb
供设计优化坐标轴 predominant axis 2A5R3x=\
表格原点 table origin n*Q~<`T
元件安置 component positioning W>*9T?
比例因子 scaling factor @Z fQ)q\
扫描填充 scan filling vs`"BQYf
矩形填充 rectangle filling *T+Bjj;w
填充域 region filling Wvg+5Q
实体设计 physical design vfn _Nq;
逻辑设计 logic design \N[Z58R !z
逻辑电路 logic circuit Uh9p,AV
层次设计 hierarchical design oXQzCjX_
自顶向下设计 top-down design :L E&p[^
自底向上设计 bottom-up design g<@P_^vo
费用矩阵 cost metrix orGkS<P
元件密度 component density L7}dvdtZ0
自由度 degrees freedom VD,p<u{r
出度 out going degree HoTg7/iK
入度 incoming degree G1vg2'A
曼哈顿距离 manhatton distance WaaF;|,(
欧几里德距离 euclidean distance R[%ZyQ_
网络 network dE`a1H%
阵列 array fs:%L
段 segment nNN~Z'bG
逻辑 logic YEg(QOn3Q
逻辑设计自动化 logic design automation A$H;2T5N
分线 separated time b#17N2xkT
分层 separated layer !sJ*0
定顺序 definite sequence z;#DX15Rj
导线(通道) conduction (track) O/|,rAE
导线(体)宽度 conductor width Zs$Qo->F
导线距离 conductor spacing 0pC}+
+
导线层 conductor layer s"7$SxMT
导线宽度/间距 conductor line/space '#;%=+=;
第一导线层 conductor layer No.1 NQFMExg,
圆形盘 round pad _~{Nco7T
方形盘 square pad P Tc@MH)
菱形盘 diamond pad nz?jNdyz
长方形焊盘 oblong pad YM:;mX5B
子弹形盘 bullet pad gq'}LcV
泪滴盘 teardrop pad R?/!7
雪人盘 snowman pad Tx+Bkfj
形盘 V-shaped pad V w,,QXJe{Z_
环形盘 annular pad b,k%n_&n
非圆形盘 non-circular pad 74h[YyVi
隔离盘 isolation pad us_o{
非功能连接盘 monfunctional pad T[z}^"
偏置连接盘 offset land S m%\,/3
腹(背)裸盘 back-bard land {D6E@a
盘址 anchoring spaur vLc7RL
连接盘图形 land pattern |2YkZ nJn
连接盘网格阵列 land grid array O]XdPH20
孔环 annular ring ?tf/#5t}
元件孔 component hole BkH- d z
安装孔 mounting hole }Sxuc/%:
支撑孔 supported hole "<e<0::
非支撑孔 unsupported hole Ez= Q{g
导通孔 via JB_<Haj
镀通孔 plated through hole (PTH) IQ5H`o?[B
余隙孔 access hole D)]U+Qk
盲孔 blind via (hole) u(Y! _
埋孔 buried via hole 1feZ`P;
埋,盲孔 buried blind via %X--`91|u
任意层内部导通孔 any layer inner via hole {N \ri{|
全部钻孔 all drilled hole T;4& ^5n
定位孔 toaling hole Nx%]dOa
无连接盘孔 landless hole pq3W.7z;b
中间孔 interstitial hole iEA$`LhO\A
无连接盘导通孔 landless via hole &pL.hM^
引导孔 pilot hole HB>&}z0
端接全隙孔 terminal clearomee hole X
J+y5at
准尺寸孔 dimensioned hole [Page] eplz5%<
在连接盘中导通孔 via-in-pad "&_$%#HUv
孔位 hole location (O$PJLI
孔密度 hole density P
,%IZ.
孔图 hole pattern @y|ZXPC#
钻孔图 drill drawing ]\qbe
装配图assembly drawing g}cb>'=={
参考基准 datum referan JTw< 4]
1) 元件设备 !mM`+XH
jo7`DDb
三绕组变压器:three-column transformer ThrClnTrans v>p UVM
双绕组变压器:double-column transformer DblClmnTrans j56#KNAha
电容器:Capacitor Q)n6.%V/e
并联电容器:shunt capacitor 3U_-sMOB|
电抗器:Reactor <l:c O$ m
母线:Busbar ^B>BA
输电线:TransmissionLine rx$B(z(c
发电厂:power plant B7*^rbI:X
断路器:Breaker 5i<E AKL
刀闸(隔离开关):Isolator pG|+\k/B
分接头:tap h^H~q<R[T
电动机:motor Ojh\H
(2) 状态参数 EJ%Kr$51K
y7x&/2
有功:active power EAdr}io
无功:reactive power 2j*+^&M/
电流:current w%3R[Kdzk
容量:capacity Pl>BTo>p'
电压:voltage K5h2 ~
档位:tap position Q^B !^_M
有功损耗:reactive loss c,v?2*<
无功损耗:active loss >dr34=(
功率因数:power-factor
MeP,8,n'
功率:power + YjK#
功角:power-angle RF#S=X6
电压等级:voltage grade fMRv:kNAt
空载损耗:no-load loss qwERy{]Sp;
铁损:iron loss AjW5H*
铜损:copper loss Bb~Q]V=x;
空载电流:no-load current ib-)T7V`
阻抗:impedance Y]9AC
正序阻抗:positive sequence impedance cLZaQsS%
负序阻抗:negative sequence impedance e[>c>F^
零序阻抗:zero sequence impedance RTLA*
电阻:resistor ]"*sp
电抗:reactance 60iMfcT
电导:conductance "8NhrUX
电纳:susceptance k|r+/gIV
无功负载:reactive load 或者QLoad A#&,S4Wi|
有功负载: active load PLoad S260h,(,
遥测:YC(telemetering) 5Nt40)E}sN
遥信:YX ^z _m<&r
励磁电流(转子电流):magnetizing current vg.K-"yQW
定子:stator mBQp#-1\
功角:power-angle ;%wY fq~P
上限:upper limit <
s>y{e
下限:lower limit :Sd"~\N+
并列的:apposable 4GL-3e
高压: high voltage ri]"a?Rm
低压:low voltage ~vL`[JiK
中压:middle voltage CY4ntd4M
电力系统 power system Jtv~n
发电机 generator
*!wBn
励磁 excitation Hy*_4r
励磁器 excitor k>'c4ay290
电压 voltage t=6[FK
电流 current RyN}Gz/YN
母线 bus -Y{=bZS u
变压器 transformer G<MX94?
升压变压器 step-up transformer T\
cJn>kCn
高压侧 high side l>J>?b=x"[
输电系统 power transmission system :
U Yn
输电线 transmission line p
bT sn
固定串联电容补偿fixed series capacitor compensation egd%,`
稳定 stability M?nYplC
电压稳定 voltage stability x,+2k6Wn!
功角稳定 angle stability dB=aq34l
暂态稳定 transient stability xc&&UKd
电厂 power plant _P:}]5-|
能量输送 power transfer j@98UZ{g\
交流 AC oA;> z
装机容量 installed capacity aOOkC&%
电网 power system ($vaj;
落点 drop point 6z-&Zu7@
开关站 switch station T 8.
to
双回同杆并架 double-circuit lines on the same tower .Jvy0B} B
变电站 transformer substation +YNN$i
补偿度 degree of compensation (v2.8zrJ
高抗 high voltage shunt reactor pAY[XN
无功补偿 reactive power compensation UD+r{s/%
故障 fault $.g)%#h:
调节 regulation sT;:V
裕度 magin SBbPO5^](
三相故障 three phase fault tw*n+{]hi
故障切除时间 fault clearing time zNo(|;19
极限切除时间 critical clearing time Ed^F_Gg#
切机 generator triping X *fle
高顶值 high limited value /BaXWrd+
强行励磁 reinforced excitation x392uS$#
线路补偿器 LDC(line drop compensation) 7XDze(O5
机端 generator terminal _]/&NSk
静态 static (state) \U\k$ (
动态 dynamic (state) q]}1/JZS
单机无穷大系统 one machine - infinity bus system "x"y3v'
机端电压控制 AVR KD*q|?Z
电抗 reactance UomO^P
电阻 resistance gT=RJB
功角 power angle
L>PPAI
有功(功率) active power uA1DTr?z
无功(功率) reactive power K]0K/~>8
功率因数 power factor 4pw:O^v
无功电流 reactive current c8=@s#
下降特性 droop characteristics }w%W A&"W
斜率 slope }2;{}J
额定 rating >.}ewz&9o
变比 ratio B*,Qw_3dG
参考值 reference value #ozQF~
电压互感器 PT [-pB}1Dxb
分接头 tap ;<~lzfs
下降率 droop rate 8ba*:sb
仿真分析 simulation analysis !arTR.b\
传递函数 transfer function ;=ci7IT'
框图 block diagram rjJ-ZRs\
受端 receive-side EvJ"%:bp
裕度 margin Z9+xB"q2
同步 synchronization /EXubU73
失去同步 loss of synchronization 1$^=M[v
阻尼 damping ;^cc-bLvF
摇摆 swing 9>1
$Jv3
保护断路器 circuit breaker Z"u|-RoBV
电阻:resistance yS2[V,vS7
电抗:reactance w*3DIVlxL
阻抗:impedance p#T^o]+
电导:conductance 5%Xny8
]|D
电纳:susceptance