1 backplane 背板 ATx6YP@7~
2 Band gap voltage reference 带隙电压参考 w/_n$hX
3 benchtop supply 工作台电源 `2N&{(
4 Block Diagram 方块图 5 Bode Plot 波特图 fd~a\5%e
6 Bootstrap 自举 nF$n[:
7 Bottom FET Bottom FET ;^+#
8 bucket capcitor 桶形电容 YuufgPE*H
9 chassis 机架 !-%fCg(B
10 Combi-sense Combi-sense ETU.v*HT]
11 constant current source 恒流源 x?s5vxAKf
12 Core Sataration 铁芯饱和 k\->uSU9
13 crossover frequency 交叉频率 {6H%4n
14 current ripple 纹波电流 GZJIIP#
15 Cycle by Cycle 逐周期 -+MGs]),
16 cycle skipping 周期跳步 rHe*/nN%*
17 Dead Time 死区时间 >d#oJ?goX
18 DIE Temperature 核心温度 Pf,S`Uw;
19 Disable 非使能,无效,禁用,关断 L(Ww6oj
20 dominant pole 主极点
/tIR}qK
21 Enable 使能,有效,启用 $p_FrN{
22 ESD Rating ESD额定值 T.ZPpxY
23 Evaluation Board 评估板 kkWqP20q
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. xW|^2k
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ~{69&T}9
25 Failling edge 下降沿 "s-e)svB
26 figure of merit 品质因数 >6 p
<n
27 float charge voltage 浮充电压 +!_?f'kv`
28 flyback power stage 反驰式功率级 R}~p1=D
29 forward voltage drop 前向压降 zx)^!dEMM
30 free-running 自由运行 u=j|']hp#&
31 Freewheel diode 续流二极管 epz'GN]V
32 Full load 满负载 33 gate drive 栅极驱动 IX/FKSuq
34 gate drive stage 栅极驱动级 :CH*~o
35 gerber plot Gerber 图 'p0|wM_
36 ground plane 接地层 $xx5+A%,
37 Henry 电感单位:亨利 VrG4wLpLs
38 Human Body Model 人体模式 $E=t6WvA
39 Hysteresis 滞回 z9> yg_Q
40 inrush current 涌入电流 gkxEy5c[
41 Inverting 反相 D@]gc&JN[
42 jittery 抖动 O[nl#$w
43 Junction 结点 Y# <38+Gd
44 Kelvin connection 开尔文连接 >&uG1q0p.
45 Lead Frame 引脚框架 m]g"]U:
46 Lead Free 无铅 {sn :Lj0
47 level-shift 电平移动 -
0t
48 Line regulation 电源调整率 3,`.$
49 load regulation 负载调整率 Rg:3}T`~n
50 Lot Number 批号 C):RE<X
51 Low Dropout 低压差 >;E[XG^
52 Miller 密勒 53 node 节点 F[aow$",+}
54 Non-Inverting 非反相 i?7%z`
55 novel 新颖的 Z=;+)
#,
56 off state 关断状态 H<$.AC\zn
57 Operating supply voltage 电源工作电压 ~&E|;\G
58 out drive stage 输出驱动级 .3;bUJ1
59 Out of Phase 异相 {d|R67~V
60 Part Number 产品型号 doR'E=Z4h
61 pass transistor pass transistor 'WqSHb7
62 P-channel MOSFET P沟道MOSFET 6~ g:"}
63 Phase margin 相位裕度 |
?6wlf
64 Phase Node 开关节点 3YY<2<
65 portable electronics 便携式电子设备 2>{_O?UN
66 power down 掉电 ,v"/3Ff{,
67 Power Good 电源正常 ^V^In-[!y:
68 Power Groud 功率地 WY@x2bBi
69 Power Save Mode 节电模式 vFfvvRda4x
70 Power up 上电 S}"?#=Q.%O
71 pull down 下拉 DdI7%?hK
72 pull up 上拉 E(G=~>P
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) \!UNale
74 push pull converter 推挽转换器 tVx.J'"Y
75 ramp down 斜降 `1%SXP1
76 ramp up 斜升 {Y5h*BD>
77 redundant diode 冗余二极管 !$q1m@K1
78 resistive divider 电阻分压器 (vIrXF5Dnj
79 ringing 振 铃 'e6W$?z
80 ripple current 纹波电流 `Tzqvnn
81 rising edge 上升沿 "?j|;p@!>
82 sense resistor 检测电阻 c%.f|/.k
83 Sequenced Power Supplys 序列电源 +n(H"I7cU
84 shoot-through 直通,同时导通 $XS0:C0
85 stray inductances. 杂散电感 ~qNpPIrGr
86 sub-circuit 子电路 v9~Hl
87 substrate 基板 dRZor gar
88 Telecom 电信 Q, E!Ew3
89 Thermal Information 热性能信息 X.0/F6U
90 thermal slug 散热片 1{ #Xa=
91 Threshold 阈值 V mQ7M4j*
92 timing resistor 振荡电阻 -
Pz
)O@ ;
93 Top FET Top FET AK<ZP?0
94 Trace 线路,走线,引线 ~H0~5v F
95 Transfer function 传递函数 TGLkwXOkT
96 Trip Point 跳变点 ,8uu,,c
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) FH8?W|
G
98 Under Voltage Lock Out (UVLO) 欠压锁定 RCt)qh+
99 Voltage Reference 电压参考 QnxkD)f*0
100 voltage-second product 伏秒积 |D^Q}uT
101 zero-pole frequency compensation 零极点频率补偿 ^&uWAQohL
102 beat frequency 拍频 yZ:|wxVY
103 one shots 单击电路 ~QdwoeaD
104 scaling 缩放 #f|-l$a)3a
105 ESR 等效串联电阻 [Page] mxHNK4/
106 Ground 地电位 c: *wev
107 trimmed bandgap 平衡带隙 PqcuSb6
108 dropout voltage 压差 e:[Kp6J
109 large bulk capacitance 大容量电容 M
O5fu!
110 circuit breaker 断路器 3Gn2@`GC
111 charge pump 电荷泵 We#*.nr{3Z
112 overshoot 过冲 &3{:h
P7\(D`
印制电路printed circuit p)ZlQ.d#Y
印制线路 printed wiring G%YD2<V
印制板 printed board =Ak>2
印制板电路 printed circuit board JXj`
印制线路板 printed wiring board r"fu{4aX
印制元件 printed component :yT~.AK}>1
印制接点 printed contact [ur/`
印制板装配 printed board assembly BHj]w*Ov
板 board ~Y)Au?d(a
刚性印制板 rigid printed board pq5)Ug
挠性印制电路 flexible printed circuit ](_(1
挠性印制线路 flexible printed wiring j<deTK;.
齐平印制板 flush printed board aic6,>\!'
金属芯印制板 metal core printed board O8u"Y0$*w
金属基印制板 metal base printed board Tf@t.4\
多重布线印制板 mulit-wiring printed board @YwaOc_%
塑电路板 molded circuit board |r-<t
散线印制板 discrete wiring board 8gC(N3/E"
微线印制板 micro wire board XQ(`8Jl&^
积层印制板 buile-up printed board Rl5}W\&
表面层合电路板 surface laminar circuit +G/~v`Bv
埋入凸块连印制板 B2it printed board $Z28nPd/
载芯片板 chip on board uFdSD
埋电阻板 buried resistance board /LSiDys
母板 mother board !hH6!G
子板 daughter board @oRYQ|.R
背板 backplane q/OraPAB
裸板 bare board q=?"0i&V
键盘板夹心板 copper-invar-copper board D'nV
&m
动态挠性板 dynamic flex board b}"/K$`Fd
静态挠性板 static flex board [q.W!l4E
可断拼板 break-away planel ]Vwky]d
电缆 cable s?Q`#qD
挠性扁平电缆 flexible flat cable (FFC) E #ys-t 42
薄膜开关 membrane switch RM<\bZPc
混合电路 hybrid circuit [/#n+sz.A
厚膜 thick film mOX I"q]p
厚膜电路 thick film circuit E"G._<3J8
薄膜 thin film 5h{Hf]A
薄膜混合电路 thin film hybrid circuit M3z7P.\G
互连 interconnection >a4Bfnf"eI
导线 conductor trace line +^69>L2V
齐平导线 flush conductor 9q8
rf\&
传输线 transmission line 19#)#
n^
跨交 crossover w@:o:yLS
板边插头 edge-board contact ,}2j
Fb9z4
增强板 stiffener H>7!+&M
基底 substrate t3s}U@(C
基板面 real estate zIAMM
导线面 conductor side ~r>UjC_
B:
元件面 component side _SFD}w3b$
焊接面 solder side (u'/tNGS
导电图形 conductive pattern #ASu
SQ
非导电图形 non-conductive pattern b5)>h
基材 base material 6nq.~f2`
层压板 laminate ZR QPOy
覆金属箔基材 metal-clad bade material ^#t<ILUa
覆铜箔层压板 copper-clad laminate (CCL) J2cNwhZ
复合层压板 composite laminate r2Z`4tN:
薄层压板 thin laminate {
o;0Fx
基体材料 basis material a0LX<}
预浸材料 prepreg uBMNkN8
粘结片 bonding sheet B+Bv(p
预浸粘结片 preimpregnated bonding sheer :YI>AaYWDO
环氧玻璃基板 epoxy glass substrate sO6t8)$b
预制内层覆箔板 mass lamination panel ~w*ojI
内层芯板 core material '{u#:TTj
粘结层 bonding layer 'K"*4B^3
粘结膜 film adhesive |$w-}$jq5
无支撑胶粘剂膜 unsupported adhesive film Qp?+_<{
覆盖层 cover layer (cover lay) S8cFD):q
增强板材 stiffener material o{Ep/O`
铜箔面 copper-clad surface $ta#]>{
去铜箔面 foil removal surface *Xnq1_K}
层压板面 unclad laminate surface 52 A=c1kb
基膜面 base film surface R"=M5
胶粘剂面 adhesive faec k %rP*b*
原始光洁面 plate finish nc{<v
粗面 matt finish ?d0Dfqh_
剪切板 cut to size panel ;Dgp
!*v=
超薄型层压板 ultra thin laminate 0q;] ;m
A阶树脂 A-stage resin "|%fAE
B阶树脂 B-stage resin ;5l|-&{@*
C阶树脂 C-stage resin atAA[~
环氧树脂 epoxy resin ;(,Fe/wvC
酚醛树脂 phenolic resin gc:>HX);)
聚酯树脂 polyester resin J|q_&MX/
聚酰亚胺树脂 polyimide resin !Ch ya
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 4>HGwk@+8
丙烯酸树脂 acrylic resin /Rz,2jfRx'
三聚氰胺甲醛树脂 melamine formaldehyde resin 8UcT?Zp
多官能环氧树脂 polyfunctional epoxy resin <am7t[G."
溴化环氧树脂 brominated epoxy resin zVa+5\Q
环氧酚醛 epoxy novolac X[ (J!"+
氟树脂 fluroresin [)u(\nfGX
硅树脂 silicone resin zK92:+^C
硅烷 silane <coCu0
聚合物 polymer pp`U]Q5"gX
无定形聚合物 amorphous polymer ;CZcY] ol
结晶现象 crystalline polamer HXQrtJ
双晶现象 dimorphism =R"tnjR
共聚物 copolymer 7q=0]Hrg(D
合成树脂 synthetic *S4P'JSY
热固性树脂 thermosetting resin [Page] }{y$$X<:
热塑性树脂 thermoplastic resin gk#rA/x
感光性树脂 photosensitive resin . gJKr
环氧值 epoxy value (jG$M= q-
双氰胺 dicyandiamide M2S|$6t:
粘结剂 binder ?0a 0 R
胶粘剂 adesive R 2s>;V.:
固化剂 curing agent *ZGN!0/
阻燃剂 flame retardant hzb|:
遮光剂 opaquer :
eFc.>KoD
增塑剂 plasticizers +bnw,B><
不饱和聚酯 unsatuiated polyester ]l'ki8
聚酯薄膜 polyester uSJP"Lw
聚酰亚胺薄膜 polyimide film (PI) ~4<3`l=A
聚四氟乙烯 polytetrafluoetylene (PTFE) >xKRU5
增强材料 reinforcing material Y ckbc6F
折痕 crease ~=ktFuEa
云织 waviness U;@jl?jnG
鱼眼 fish eye "-?Y UY`
毛圈长 feather length qI^jwl|k
厚薄段 mark Sq,ty{j2%
裂缝 split gi>_>zStv
捻度 twist of yarn Q^rW^d
浸润剂含量 size content E}=NZqOB!
浸润剂残留量 size residue #^ #i]{g
处理剂含量 finish level )M 0O=Cl1
偶联剂 couplint agent yFo5 pKF.J
断裂长 breaking length PEIr-qs%D
吸水高度 height of capillary rise BaAb4{
湿强度保留率 wet strength retention 1_C6KS
白度 whitenness j.}V~Sp*
导电箔 conductive foil "r"An"
铜箔 copper foil 5.#9}]
压延铜箔 rolled copper foil uLljM{I
光面 shiny side M3 u8NRd5|
粗糙面 matte side 9m4rNvb
处理面 treated side Dt.Wb&V_w
防锈处理 stain proofing y3]"H(
双面处理铜箔 double treated foil -Wk"o?}q
模拟 simulation iXRt9)MT{
逻辑模拟 logic simulation %Qz`SO8x?
电路模拟 circit simulation EIQy?ig86
时序模拟 timing simulation sLp
LY1X
模块化 modularization YO0x68
设计原点 design origin |l(lrJ{
优化(设计) optimization (design) h_yR$H&tX
供设计优化坐标轴 predominant axis {fv8S;|u
表格原点 table origin zEfD{I
元件安置 component positioning ~|C1$.-
比例因子 scaling factor @ -d4kg
扫描填充 scan filling b'5pQ2Mq
矩形填充 rectangle filling R} 9jgB
填充域 region filling 3uG5b8?
实体设计 physical design *+4iBpyiB
逻辑设计 logic design F|`B2Gr
逻辑电路 logic circuit \Pmk`^T
层次设计 hierarchical design ^3o8F
自顶向下设计 top-down design (1j$*?iGA
自底向上设计 bottom-up design G3^]Wwu
费用矩阵 cost metrix mm<iT59
元件密度 component density 4(GgaQFO?
自由度 degrees freedom Q8cPKDB
出度 out going degree an[~%vxw}
入度 incoming degree 72vGfT2HtZ
曼哈顿距离 manhatton distance 1|w:xG^
欧几里德距离 euclidean distance 'OW"*b
网络 network %P,^}h7
阵列 array $!!=fFX*y
段 segment }QW~.>`
逻辑 logic bvS\P!m\c
逻辑设计自动化 logic design automation ]mo<qWRc>p
分线 separated time @SG"t,5s
分层 separated layer pbxcsA\
定顺序 definite sequence (G%gVk]
导线(通道) conduction (track) KqUSTR1e[
导线(体)宽度 conductor width dS_)ll.6z
导线距离 conductor spacing NZW)X[nXM
导线层 conductor layer <L
( =
导线宽度/间距 conductor line/space GiO#1gA
第一导线层 conductor layer No.1 Rn_W|"
圆形盘 round pad -U;LiO;N
方形盘 square pad <O)X89dFM
菱形盘 diamond pad 1\{U<Oli
长方形焊盘 oblong pad R6Z}/ m
子弹形盘 bullet pad L{%a4Ip
泪滴盘 teardrop pad ,W8Iabi^
雪人盘 snowman pad MGKeD+=5
形盘 V-shaped pad V }\L!;6oy
环形盘 annular pad a{Hb7&
非圆形盘 non-circular pad cPaWJ+c
隔离盘 isolation pad (Cd{#j<
非功能连接盘 monfunctional pad 9`n)"r
偏置连接盘 offset land G$|;~'E
腹(背)裸盘 back-bard land xXxh3 k\
盘址 anchoring spaur 4FE@s0M,
连接盘图形 land pattern 9f%y)[ \
连接盘网格阵列 land grid array bKJ7vXC05
孔环 annular ring .C;_4jE
元件孔 component hole Sc$8tLDLj
安装孔 mounting hole o"}&qA;
支撑孔 supported hole OPt;G,$ta
非支撑孔 unsupported hole a(DZGQ-as
导通孔 via DcR}pQ(e
镀通孔 plated through hole (PTH) -YjgS/g
余隙孔 access hole 4zfRD`;
盲孔 blind via (hole) ZWhmO=b!
埋孔 buried via hole \pD=Lv9
埋,盲孔 buried blind via g_U~.?Db7
任意层内部导通孔 any layer inner via hole T\
}v$A03
全部钻孔 all drilled hole QT= ,En
定位孔 toaling hole 3)c
K*8#
无连接盘孔 landless hole ssyd8LC#
中间孔 interstitial hole ]F*a PV
无连接盘导通孔 landless via hole =Pb5b6Y@6
引导孔 pilot hole /`O]etr`d
端接全隙孔 terminal clearomee hole ?7nr\g"g(
准尺寸孔 dimensioned hole [Page] oBNX8%5w
在连接盘中导通孔 via-in-pad `=}UFu
孔位 hole location 71/ m.w
孔密度 hole density t-7U1B}=<C
孔图 hole pattern 6+B{4OY
钻孔图 drill drawing o|;eMO-
装配图assembly drawing YaNH.$.:
参考基准 datum referan W6Aj<{\F
1) 元件设备 9kX=99kf[
D@\;@(
|
三绕组变压器:three-column transformer ThrClnTrans g;!@DVF$
双绕组变压器:double-column transformer DblClmnTrans hUT^V(
电容器:Capacitor sL AuR
并联电容器:shunt capacitor iA3>X-x
电抗器:Reactor euj8p:+X
母线:Busbar #3Ej0"A@-B
输电线:TransmissionLine 7.e7Fi{
发电厂:power plant 8hK P
断路器:Breaker BF@5&>E
刀闸(隔离开关):Isolator VwOG?5W/
分接头:tap bH\C5zt6(
电动机:motor E<<p_hX8R
(2) 状态参数 B?#k W!wj
mo;)0Vq2l
有功:active power "7yNKO;W
无功:reactive power M .)}e7
电流:current *|k;a]HT
容量:capacity &(1H!
电压:voltage )jlP
cO-
档位:tap position 4g7ja
有功损耗:reactive loss .;HIEj zq
无功损耗:active loss mGe|8In
功率因数:power-factor :GQIlA8cF$
功率:power .B'UQ|NR
功角:power-angle AUxM)H
电压等级:voltage grade ] dHB}
空载损耗:no-load loss UK6xkra?#
铁损:iron loss ss`P QN
铜损:copper loss I%9bPQ
空载电流:no-load current xEVLE,*?>
阻抗:impedance rps(Jos_~
正序阻抗:positive sequence impedance os1?6z~
负序阻抗:negative sequence impedance WDEe$k4.
零序阻抗:zero sequence impedance ,jRcl!n`
电阻:resistor H\fcY p6
电抗:reactance LZM,QQ
电导:conductance )d +hZ'
电纳:susceptance pd4cg?K
无功负载:reactive load 或者QLoad &:c:9w
有功负载: active load PLoad T~%H%O(F
遥测:YC(telemetering) BrJ
o!@<
遥信:YX aXdf>2c{JD
励磁电流(转子电流):magnetizing current 3ar=1_Ar
定子:stator ?0rOcaTY
功角:power-angle Gz>Lqd
上限:upper limit gEv-> pc
下限:lower limit
c6Lif)4
并列的:apposable )?w&oIj5
高压: high voltage &:V@2_6"
低压:low voltage "v(G7*2
中压:middle voltage @iU%`=ziz
电力系统 power system _+twqi
发电机 generator ch@x]@-;A3
励磁 excitation JbE?a[Eg?
励磁器 excitor -<^jGrb
电压 voltage yjEI/9_
电流 current fokwW}>B[f
母线 bus #B @X
变压器 transformer 5x8'K7/4.
升压变压器 step-up transformer
RT%x&j
高压侧 high side NJZXs_%>$
输电系统 power transmission system _QR
g7
输电线 transmission line \bhOPK>w
固定串联电容补偿fixed series capacitor compensation c[SU5 66y
稳定 stability M
h`CP
电压稳定 voltage stability rdO@X9z
功角稳定 angle stability ZCm1+Y$
暂态稳定 transient stability mZwi7s&u
电厂 power plant * R%.a^R
能量输送 power transfer U1l0Uke
交流 AC KNy`Lj)VPY
装机容量 installed capacity h4f~5- Y
电网 power system nV'3sUvR#
落点 drop point OI+E
(nA
开关站 switch station hM~eJv
双回同杆并架 double-circuit lines on the same tower vXephR'
变电站 transformer substation Qi_&aU$>lM
补偿度 degree of compensation mc?';dEG
高抗 high voltage shunt reactor 9"~9hOEct
无功补偿 reactive power compensation QwBXlO?
故障 fault Vo%Yf9C
调节 regulation )S^z+3p
裕度 magin e1Ob!N-
三相故障 three phase fault 3[VWTq)D=
故障切除时间 fault clearing time K<FKu $=
极限切除时间 critical clearing time ! ,@ZQS
切机 generator triping -Q#o)o
高顶值 high limited value rJu[N(2k
强行励磁 reinforced excitation C1d
04Q
线路补偿器 LDC(line drop compensation) 5.wiTy
机端 generator terminal *vYn_wE
静态 static (state) 8Jr1_a
动态 dynamic (state) gI)u}JX
单机无穷大系统 one machine - infinity bus system G*B$%?n
机端电压控制 AVR W6vf=I@f
电抗 reactance )R~aA#<>
电阻 resistance I~)cYl:|G
功角 power angle \^LWCp,C"
有功(功率) active power tw=K&/@^O
无功(功率) reactive power y_*n9
)Ct
功率因数 power factor !i^]UN
无功电流 reactive current >8|+%pK8<
下降特性 droop characteristics 3YW=||;|Yg
斜率 slope j eq:
额定 rating (3VGaUlx
变比 ratio .]P2}w)x?
参考值 reference value g5y;?fqJ
电压互感器 PT e2c1pgs&+
分接头 tap tjj^O%SV<
下降率 droop rate r0\?WoF2C
仿真分析 simulation analysis }p=g*Zo*C;
传递函数 transfer function EWA;L?g|A
框图 block diagram )Vg2Jix,]
受端 receive-side If;R?j0;Q
裕度 margin :6Pnie
同步 synchronization kh3<V'k]
失去同步 loss of synchronization zI^Da!r.
阻尼 damping i?;R}%~
摇摆 swing /Wu |)tx
保护断路器 circuit breaker Iq^if>
电阻:resistance 7d;pvhnH
电抗:reactance @uM EXP
阻抗:impedance Bd5+/G=m
电导:conductance i.y=8GxY
电纳:susceptance