1 backplane 背板 ]xC#XYE:dy
2 Band gap voltage reference 带隙电压参考 k-IL%+U
3 benchtop supply 工作台电源 .a2b&}/.d
4 Block Diagram 方块图 5 Bode Plot 波特图 ?C)a0>L
6 Bootstrap 自举 SW5V:|/
7 Bottom FET Bottom FET 3}aKok"k
8 bucket capcitor 桶形电容
7 OAM
9 chassis 机架 *N>n5B2
10 Combi-sense Combi-sense |y9(qcKn$
11 constant current source 恒流源 ^Ej$o@PH
12 Core Sataration 铁芯饱和 kvcDa+#
13 crossover frequency 交叉频率 K&ZN!VN/p
14 current ripple 纹波电流 Ln:6@Ok)5%
15 Cycle by Cycle 逐周期 LNp{lC
16 cycle skipping 周期跳步 & "i4og<
17 Dead Time 死区时间 Y`F) UwKK
18 DIE Temperature 核心温度 =~z sah6N
19 Disable 非使能,无效,禁用,关断 m%zo? e
20 dominant pole 主极点 Hb}O/G$a*
21 Enable 使能,有效,启用 yPY}b_W
22 ESD Rating ESD额定值 mi[t1cN)=
23 Evaluation Board 评估板 (P!r^87
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. JLd-{}A""-
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 "5<:Dj/W
25 Failling edge 下降沿 &1/OwTI4J
26 figure of merit 品质因数 $7h]A$$Fv
27 float charge voltage 浮充电压 L~oy|K67
28 flyback power stage 反驰式功率级 0JFS%Yjw[
29 forward voltage drop 前向压降 riR(CJ}Ff
30 free-running 自由运行 +YZ*>ki
31 Freewheel diode 续流二极管 E{;F4wT_@
32 Full load 满负载 33 gate drive 栅极驱动 [|".j#ZlK
34 gate drive stage 栅极驱动级 Fn>KdoByN
35 gerber plot Gerber 图 %xt;&HE
36 ground plane 接地层 umT *
37 Henry 电感单位:亨利 e5RF6roxO
38 Human Body Model 人体模式 &F-
\t5X=i
39 Hysteresis 滞回 ai%*s&0/Y
40 inrush current 涌入电流 d|#&j."
41 Inverting 反相 vf&_
N
42 jittery 抖动 "QD>m7
43 Junction 结点 r[?GO"ej5
44 Kelvin connection 开尔文连接 k5M5bH',
45 Lead Frame 引脚框架 GY>G}bfh
46 Lead Free 无铅 @C-03`JWuK
47 level-shift 电平移动 NSawD.9mV
48 Line regulation 电源调整率 0$A^ .M;
49 load regulation 负载调整率 azz=,^U#
50 Lot Number 批号 J>l?HK
51 Low Dropout 低压差 3daI_Nx>
52 Miller 密勒 53 node 节点 lArKfs/
54 Non-Inverting 非反相 XGuxd
55 novel 新颖的 1rx,qfCq
56 off state 关断状态 ;NOmI+t0w&
57 Operating supply voltage 电源工作电压 .k:heN2-x
58 out drive stage 输出驱动级 },n?
59 Out of Phase 异相 ?g\emhG
60 Part Number 产品型号 ;6eBfMhL
61 pass transistor pass transistor /#WvC;B
62 P-channel MOSFET P沟道MOSFET @(bg#
63 Phase margin 相位裕度 aFaioE#h(
64 Phase Node 开关节点 _9g-D9
65 portable electronics 便携式电子设备 O1D|T"@
66 power down 掉电 P_4E<"eK
67 Power Good 电源正常 JM1O7I
68 Power Groud 功率地 ,ZghV1z
69 Power Save Mode 节电模式 6hMKAk
70 Power up 上电 2E8G5?qe)
71 pull down 下拉 f8
BZk h
72 pull up 上拉 v,C~5J3h)
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Sn
S$5o
74 push pull converter 推挽转换器 6P3h955c
75 ramp down 斜降 ZIKSHC9
76 ramp up 斜升 jDb"|l
77 redundant diode 冗余二极管 T|8:_4/l
78 resistive divider 电阻分压器 ;L,i">_%u[
79 ringing 振 铃 JK`$/l|7
80 ripple current 纹波电流 uu9IUqEq2
81 rising edge 上升沿 l?QA;9_R'
82 sense resistor 检测电阻 tLi91)oG
83 Sequenced Power Supplys 序列电源 Gx
%=&O
84 shoot-through 直通,同时导通 Nm
!~h|3
85 stray inductances. 杂散电感 N]eBmv$|
86 sub-circuit 子电路 5 w(nttYH
87 substrate 基板 CY*o"@-o5)
88 Telecom 电信 G^N@r:RS
89 Thermal Information 热性能信息 {,i-V57-h
90 thermal slug 散热片
tKS[
91 Threshold 阈值 IU<lF) PF$
92 timing resistor 振荡电阻 )Gavjj&uJ
93 Top FET Top FET :hT.L3n,
94 Trace 线路,走线,引线 X;H\u6-|>6
95 Transfer function 传递函数 DF_wMv:>^
96 Trip Point 跳变点 ~4pP(
JP
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) n$N$OFuO
98 Under Voltage Lock Out (UVLO) 欠压锁定 41R6V>e@9J
99 Voltage Reference 电压参考 WW.@S5
100 voltage-second product 伏秒积 _P=+\[|y
101 zero-pole frequency compensation 零极点频率补偿 d#TA20`
102 beat frequency 拍频 n\)1Bz
103 one shots 单击电路 S2DG=hi`GK
104 scaling 缩放 1
_Oc1RM
105 ESR 等效串联电阻 [Page] iMt3h8
106 Ground 地电位 PxgJ7d
107 trimmed bandgap 平衡带隙 Rw%%
9
108 dropout voltage 压差 (:qc[,m
109 large bulk capacitance 大容量电容 =w}JAEE|(i
110 circuit breaker 断路器 5L:-Xr{
111 charge pump 电荷泵 4xEw2F
112 overshoot 过冲 @J&korU
W^H3 =hZ
印制电路printed circuit *<W8j[?
印制线路 printed wiring /zt M'
印制板 printed board PWyf3
印制板电路 printed circuit board !ig&8:
印制线路板 printed wiring board n8F~!|lQ0
印制元件 printed component );':aXj
印制接点 printed contact tH)jEY9
印制板装配 printed board assembly h Fik>B#!
板 board GkX Se)#p
刚性印制板 rigid printed board C&>*~
挠性印制电路 flexible printed circuit Bp_R"DS7A
挠性印制线路 flexible printed wiring k`Ifl)
齐平印制板 flush printed board ')!X1A{
金属芯印制板 metal core printed board 7jIBE
金属基印制板 metal base printed board ^L5-2;s<U'
多重布线印制板 mulit-wiring printed board n'v\2(&uYN
塑电路板 molded circuit board UL-_z++G
散线印制板 discrete wiring board VO8rd>b4
微线印制板 micro wire board \$ipnQv
积层印制板 buile-up printed board S@qR~_>a
表面层合电路板 surface laminar circuit fE+zA)KX
埋入凸块连印制板 B2it printed board O`c50yY
载芯片板 chip on board itP`{[
埋电阻板 buried resistance board gr SF}y!3
母板 mother board ^APtV6g
子板 daughter board !*}UP|8
背板 backplane I7oA7@zv
裸板 bare board [p9v#\G; [
键盘板夹心板 copper-invar-copper board #G77q$
动态挠性板 dynamic flex board X)[tb]U/Wx
静态挠性板 static flex board HKXC=^}x'
可断拼板 break-away planel WA8<:#{e
电缆 cable /7 Tm2Vj8
挠性扁平电缆 flexible flat cable (FFC) IgG[Pr'D
薄膜开关 membrane switch v^b4WS+.:
混合电路 hybrid circuit :R,M Y"(
厚膜 thick film iCF},W+
厚膜电路 thick film circuit 7Hr_ZwO/^
薄膜 thin film u1$6:"2@5k
薄膜混合电路 thin film hybrid circuit QM F
互连 interconnection GYx0U8MJ[e
导线 conductor trace line R~4X?@ZB
齐平导线 flush conductor 80*hi)ux[
传输线 transmission line cx$IWQf2
跨交 crossover 3$nK
板边插头 edge-board contact Sp80xV_B
增强板 stiffener Y/kq!)u;%L
基底 substrate x/umwT,o v
基板面 real estate 4u6 FvN
导线面 conductor side ]8\I{LR
元件面 component side VTu#)I7A^@
焊接面 solder side yov~'S9
导电图形 conductive pattern =EP`,zqn$9
非导电图形 non-conductive pattern </{Zb.
基材 base material 4w^o !
层压板 laminate m!/TJhiQ
覆金属箔基材 metal-clad bade material ?eIb7O
覆铜箔层压板 copper-clad laminate (CCL) HeAXZA,
复合层压板 composite laminate tp] 5[U
薄层压板 thin laminate k{SGbC1=VK
基体材料 basis material 2'Dl$DH
预浸材料 prepreg :+ ,;5
粘结片 bonding sheet U =.PL\
预浸粘结片 preimpregnated bonding sheer `N *:,8j
环氧玻璃基板 epoxy glass substrate \vAjg
预制内层覆箔板 mass lamination panel MjMDD
内层芯板 core material = {O ~
粘结层 bonding layer [s>3xWZ+a
粘结膜 film adhesive R+M =)Z
无支撑胶粘剂膜 unsupported adhesive film f+^6.%
覆盖层 cover layer (cover lay) y&zFS4"x
增强板材 stiffener material dH^6K0J
铜箔面 copper-clad surface *y*tI}
去铜箔面 foil removal surface u#@/^h;
层压板面 unclad laminate surface gF{ehU%
基膜面 base film surface 4!/JN J
胶粘剂面 adhesive faec r%PWv0z_c
原始光洁面 plate finish xm{]|~^JG
粗面 matt finish I}4
PB+yu
剪切板 cut to size panel MxsLrWxm
超薄型层压板 ultra thin laminate 5naFn m7%
A阶树脂 A-stage resin fjRVYOG#
B阶树脂 B-stage resin 2I-d.{
C阶树脂 C-stage resin UCLM*`M
环氧树脂 epoxy resin i.Rl&t
酚醛树脂 phenolic resin >|QH
I
d8
聚酯树脂 polyester resin Zhq_ pus"a
聚酰亚胺树脂 polyimide resin }`"}eN @,
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin N(&{~*YE
丙烯酸树脂 acrylic resin n[3z_QI
三聚氰胺甲醛树脂 melamine formaldehyde resin a: "1LnvR
多官能环氧树脂 polyfunctional epoxy resin }iUK`e
溴化环氧树脂 brominated epoxy resin /f3/}x!po
环氧酚醛 epoxy novolac 2LwJ%!
氟树脂 fluroresin *-T.xo
硅树脂 silicone resin (;l@d|g
硅烷 silane kTb$lLG\xk
聚合物 polymer Je6[q
无定形聚合物 amorphous polymer b#6S8C+@
结晶现象 crystalline polamer 68tyWd}
双晶现象 dimorphism d51lTGH7Z
共聚物 copolymer iq; |
i!
合成树脂 synthetic |
&X<-
热固性树脂 thermosetting resin [Page] 0'Pjnk-i
热塑性树脂 thermoplastic resin 0JlNUO5Nt
感光性树脂 photosensitive resin VgHO&vU
环氧值 epoxy value s6 yvq#:
双氰胺 dicyandiamide g*V.u]U!i
粘结剂 binder rnIjpc F
胶粘剂 adesive T~[:oil
固化剂 curing agent /Y0~BQC7!
阻燃剂 flame retardant 0?7yM:!l
遮光剂 opaquer -n _Y.~
增塑剂 plasticizers H/D=$)3op
不饱和聚酯 unsatuiated polyester ZJ/528Ju
聚酯薄膜 polyester [b++bCH3
聚酰亚胺薄膜 polyimide film (PI) ?2<)
Jw
聚四氟乙烯 polytetrafluoetylene (PTFE) FOiwA.:0
增强材料 reinforcing material k~tEUsv
折痕 crease ReaZg ?:h
云织 waviness K.
;ev
鱼眼 fish eye 4S_f2P2J
毛圈长 feather length ?qjdmB|w
厚薄段 mark ]v
${k
裂缝 split ,?GwA@~$k:
捻度 twist of yarn q[$>\Nfg>B
浸润剂含量 size content Z0<Vss
浸润剂残留量 size residue #w{`6}p
处理剂含量 finish level EG{+Sz
偶联剂 couplint agent >dAl *T
断裂长 breaking length tia}&9;
吸水高度 height of capillary rise _^<vp
湿强度保留率 wet strength retention R$:-~<O
白度 whitenness 9)!Ksg(h
导电箔 conductive foil 4:V
+>Jt
铜箔 copper foil )M8d\]
压延铜箔 rolled copper foil YgEd%Z%4
光面 shiny side +Br<;sW
粗糙面 matte side u3h(EAH>
处理面 treated side k\OZ'dS
防锈处理 stain proofing j7P49{
双面处理铜箔 double treated foil uX7L1~s-
模拟 simulation <-`bWz=+
逻辑模拟 logic simulation mIlg=8:
电路模拟 circit simulation ~?/7:S
时序模拟 timing simulation 7F"ljkN1S
模块化 modularization ) 57'<
设计原点 design origin PF4[;ES'
优化(设计) optimization (design) !@z9n\Yj
供设计优化坐标轴 predominant axis 01n!T2;yW}
表格原点 table origin !.R-|<2|6
元件安置 component positioning sUF$eVAT
比例因子 scaling factor BbB3#/g
扫描填充 scan filling yCjc5d|tT
矩形填充 rectangle filling %pZT3dcK
填充域 region filling ZcA"HD%
实体设计 physical design +k=*AQt^8
逻辑设计 logic design tY_=[6?Zu
逻辑电路 logic circuit ?wtKi#k'v#
层次设计 hierarchical design ]yOM
自顶向下设计 top-down design KDN#CU
自底向上设计 bottom-up design oIrc))j,$
费用矩阵 cost metrix s.z)l$
元件密度 component density %jAc8~vW?
自由度 degrees freedom _kD5pC =
出度 out going degree Gb^63.}
入度 incoming degree dOD(<
曼哈顿距离 manhatton distance as:=QMV
欧几里德距离 euclidean distance {tVA(&\<
网络 network X0*+]tRg
阵列 array ],c0nz^%BR
段 segment J.~@j;[2
逻辑 logic T)tr"<F5NP
逻辑设计自动化 logic design automation mLq0;uGL|
分线 separated time GVT 6cR
分层 separated layer 6Emn@Mn=
定顺序 definite sequence -n:2US<
导线(通道) conduction (track) l"8g9z
导线(体)宽度 conductor width %\it4 r3
导线距离 conductor spacing R/{h4/+vJ
导线层 conductor layer $Y/z+ea
导线宽度/间距 conductor line/space $;g*s?F*
第一导线层 conductor layer No.1 #mH28UT
圆形盘 round pad eHx {[J?
方形盘 square pad )+FnwW
菱形盘 diamond pad py$Gy-I~[
长方形焊盘 oblong pad }5E H67
子弹形盘 bullet pad 2-S}#S}2C
泪滴盘 teardrop pad ^3HSw ?a"
雪人盘 snowman pad `@Z$+
形盘 V-shaped pad V 1mV
'
~W
环形盘 annular pad >u%Bn\G
非圆形盘 non-circular pad K%9!1'
隔离盘 isolation pad ?r;F'%N=
非功能连接盘 monfunctional pad %~eu&\os
偏置连接盘 offset land (ht"wY#T<(
腹(背)裸盘 back-bard land a[t"J*0
盘址 anchoring spaur 1sUgjyGQ
连接盘图形 land pattern b?k,_;\
连接盘网格阵列 land grid array ?(s9dS,7wZ
孔环 annular ring qPu?rU{2
元件孔 component hole %m|BXyf]_B
安装孔 mounting hole )~)T[S
支撑孔 supported hole pDC`Fi
非支撑孔 unsupported hole 6T"5,Q</h
导通孔 via @V4nc
'o.
镀通孔 plated through hole (PTH) 9Eh*r@>
余隙孔 access hole 9'X "a
盲孔 blind via (hole) 8U#14U5rS
埋孔 buried via hole }T%E;m-
埋,盲孔 buried blind via *"|f!t
任意层内部导通孔 any layer inner via hole ;&b=>kPlZ
全部钻孔 all drilled hole Y}vV.q
定位孔 toaling hole =)#XZ[#F
无连接盘孔 landless hole k H06Cb
中间孔 interstitial hole Kj"n
Id)
无连接盘导通孔 landless via hole %i&am=
引导孔 pilot hole f`}u9!jVR
端接全隙孔 terminal clearomee hole ?zo7.R-Vac
准尺寸孔 dimensioned hole [Page] |r*y63\T
在连接盘中导通孔 via-in-pad b#(QZ
孔位 hole location /0L]Pf;
孔密度 hole density ^(*eo e
孔图 hole pattern ~LH).\V
钻孔图 drill drawing m=`V
装配图assembly drawing %*L8W*V
参考基准 datum referan Ornm3%p+e
1) 元件设备 SM}&
@cJ
kaZcYuT.9
三绕组变压器:three-column transformer ThrClnTrans @C'qbO{
双绕组变压器:double-column transformer DblClmnTrans %z1hXh#+
电容器:Capacitor (!ud"A|ab4
并联电容器:shunt capacitor V" 5rIk
电抗器:Reactor h#h)=;
母线:Busbar 8LtkP&Wx
输电线:TransmissionLine [c>YKN2qa
发电厂:power plant FOa2VP%
断路器:Breaker eET1f8B=L
刀闸(隔离开关):Isolator 6%VRQ#g!
分接头:tap &I(3/u
电动机:motor l)Cg?9
(2) 状态参数 %F*h}i
B3u:D"t
有功:active power 'kCr1t
无功:reactive power !O,`Z`T?
电流:current 9@(V!G
容量:capacity c5Hm94,p
电压:voltage K?wo AuY
档位:tap position r-}C !aF]
有功损耗:reactive loss X{5(i3?S
无功损耗:active loss F-?s8RD
功率因数:power-factor CJLfpvV
功率:power m!<uY?,hf
功角:power-angle {NIE:MXX
电压等级:voltage grade 2)`4(38
空载损耗:no-load loss :2&W9v
铁损:iron loss _`]YWvh
铜损:copper loss |P=-m-W
空载电流:no-load current M[dJQ(
阻抗:impedance E7Pz~6
正序阻抗:positive sequence impedance d>Np; "
负序阻抗:negative sequence impedance [M.!7+$o
零序阻抗:zero sequence impedance "Kn%|\YL@4
电阻:resistor Xpf:I
电抗:reactance XCZNvLG
电导:conductance _$qH\>se
电纳:susceptance mvW,nM1Y
无功负载:reactive load 或者QLoad 2HREO@._)
有功负载: active load PLoad &14Er,K
遥测:YC(telemetering) 3hzKd_
遥信:YX &p^8zE s
励磁电流(转子电流):magnetizing current TqXB2`7Ri
定子:stator Oc?]L&a