1 backplane 背板 ]@bu%_s"
2 Band gap voltage reference 带隙电压参考 +axpIjI'
3 benchtop supply 工作台电源 Y<oDv`aZ0
4 Block Diagram 方块图 5 Bode Plot 波特图 &fuJ%
6 Bootstrap 自举 3 h~U)mg
7 Bottom FET Bottom FET Oe:_B/l
8 bucket capcitor 桶形电容 [j^c&}0
9 chassis 机架 <>|/U `
10 Combi-sense Combi-sense yQM<(;\O
11 constant current source 恒流源 =
7TK&
12 Core Sataration 铁芯饱和 e[AwR?=
13 crossover frequency 交叉频率 $2+(|VG4F
14 current ripple 纹波电流 ]v{TSP^/
15 Cycle by Cycle 逐周期 ?3)
IzzO
16 cycle skipping 周期跳步 SF2<
17 Dead Time 死区时间
;'g.%
18 DIE Temperature 核心温度 {s/u[T_D2
19 Disable 非使能,无效,禁用,关断 `lA[-x~
20 dominant pole 主极点 ); <Le6
21 Enable 使能,有效,启用 iS%md
22 ESD Rating ESD额定值 ^~:&/ 0
23 Evaluation Board 评估板 1}"PLq(
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. pJpTOq\h
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 W
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25 Failling edge 下降沿 uEPdL':}2
26 figure of merit 品质因数 DeTD.)pS
27 float charge voltage 浮充电压 \C(dWs
28 flyback power stage 反驰式功率级 'HdOW[3o
29 forward voltage drop 前向压降 ek3,ss3
30 free-running 自由运行 A(<"oAe|
31 Freewheel diode 续流二极管 ;x=r.3OQy
32 Full load 满负载 33 gate drive 栅极驱动 @rT}V>2I
34 gate drive stage 栅极驱动级 Sd0y=!Pj=
35 gerber plot Gerber 图 lp=8RbQYC
36 ground plane 接地层 37M?m$BL
37 Henry 电感单位:亨利 ?()$imb*
38 Human Body Model 人体模式 kbF+aS
39 Hysteresis 滞回 3S_H hvB
40 inrush current 涌入电流 5QoU&Hv
41 Inverting 反相 _g#v*7o2@
42 jittery 抖动 qIIl,!&}A
43 Junction 结点 BDCFToSf|
44 Kelvin connection 开尔文连接 }*ZOD1j
45 Lead Frame 引脚框架 9/x_p;bI
46 Lead Free 无铅 a' pJg<
47 level-shift 电平移动 \X?GzQkr
48 Line regulation 电源调整率 J6 VG j=/
49 load regulation 负载调整率 MJ+]\(
50 Lot Number 批号 WKwU:im
51 Low Dropout 低压差 &InMI#0mV
52 Miller 密勒 53 node 节点 yj+HU5L4
54 Non-Inverting 非反相 z]Jpvw`p
55 novel 新颖的 EN!Q]O|
56 off state 关断状态 (VxWa#P
57 Operating supply voltage 电源工作电压 ;.g <u
58 out drive stage 输出驱动级 4}\Dr
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59 Out of Phase 异相 s{]2~Z^2od
60 Part Number 产品型号 &oyj8
61 pass transistor pass transistor tbP
;iK'
62 P-channel MOSFET P沟道MOSFET MSMgaw?
63 Phase margin 相位裕度 ee=d*)
64 Phase Node 开关节点 ^:c"%<"='
65 portable electronics 便携式电子设备 ;| :^zo
66 power down 掉电 mCY+V~^~kz
67 Power Good 电源正常 Q]u*Oels
68 Power Groud 功率地 WF.y"{6>
69 Power Save Mode 节电模式 Apfs&{Uy
70 Power up 上电 9W[ ~c"Ku
71 pull down 下拉 ;1&7v
72 pull up 上拉 sP+ZE>7
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) #
[0>wEq
74 push pull converter 推挽转换器 o|v_+<zD!
75 ramp down 斜降 mJ3|UClPS
76 ramp up 斜升 ?+WSYg0
77 redundant diode 冗余二极管 5l&9BS&
78 resistive divider 电阻分压器 -X6[qLq
79 ringing 振 铃 *&\fBi]
80 ripple current 纹波电流 u\JYxNj1
81 rising edge 上升沿 ?oc#$fcQ~
82 sense resistor 检测电阻 nDhD"rc
83 Sequenced Power Supplys 序列电源 C6 XZZ
84 shoot-through 直通,同时导通 xfE:r:
85 stray inductances. 杂散电感 pd[?TyVK;
86 sub-circuit 子电路 9Xu
O\+z
87 substrate 基板 B-<H8[GkG1
88 Telecom 电信 TZ]D6.mD
89 Thermal Information 热性能信息 Z3)l5JG)
90 thermal slug 散热片 MMI7FlfY
91 Threshold 阈值 K`25G_Y3@
92 timing resistor 振荡电阻 >$.lM~k
93 Top FET Top FET UUlrfur~
94 Trace 线路,走线,引线 *)2&gQ&%+
95 Transfer function 传递函数 Of*z9YI
96 Trip Point 跳变点 {y[T3(tt
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) oA _,jsD4
98 Under Voltage Lock Out (UVLO) 欠压锁定 wjr1?c
99 Voltage Reference 电压参考 c%|18dV
100 voltage-second product 伏秒积 jE!W&0
101 zero-pole frequency compensation 零极点频率补偿 5DHFxym'
102 beat frequency 拍频 BAq@ H8*B
103 one shots 单击电路 22|a~"Z
104 scaling 缩放 FTihxC?.L
105 ESR 等效串联电阻 [Page] `;@#yyj:_
106 Ground 地电位 YB}p`b42L
107 trimmed bandgap 平衡带隙 ;JK!dzi}
108 dropout voltage 压差 c&Mci"nj0
109 large bulk capacitance 大容量电容 (mOUbO8
110 circuit breaker 断路器 Z?vbe}pUM
111 charge pump 电荷泵 FK$?8Jp
112 overshoot 过冲 s5s'$|h"
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印制电路printed circuit
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印制线路 printed wiring drJ<&1O
印制板 printed board =]OG5b_-Y
印制板电路 printed circuit board P(1bd"Q
印制线路板 printed wiring board *uLlf'qU]
印制元件 printed component r&G=}ZMO
印制接点 printed contact Wm5/>Cu,
印制板装配 printed board assembly kT!Y~c
板 board \`|*i$
刚性印制板 rigid printed board #8!xIy
挠性印制电路 flexible printed circuit -N')LY
挠性印制线路 flexible printed wiring 6o_t;cpT
齐平印制板 flush printed board 8H>: C(h
金属芯印制板 metal core printed board S
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金属基印制板 metal base printed board fNVNx~E
多重布线印制板 mulit-wiring printed board >taC_f06
塑电路板 molded circuit board Ol,Tw=?
散线印制板 discrete wiring board X0=#e54
微线印制板 micro wire board a!1\,.
积层印制板 buile-up printed board 24TQl<H{
表面层合电路板 surface laminar circuit m17H#!`
埋入凸块连印制板 B2it printed board A
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载芯片板 chip on board m)A~1+M$)L
埋电阻板 buried resistance board PXZZPW/
母板 mother board 1k5o?'3&
子板 daughter board *Ge2P3
背板 backplane W2F %E
裸板 bare board ( aGwe@AS
键盘板夹心板 copper-invar-copper board A~CQ@
动态挠性板 dynamic flex board -?A,N,nnX
静态挠性板 static flex board 9B lc
可断拼板 break-away planel k{/2vV[`]
电缆 cable $e=pdD~
挠性扁平电缆 flexible flat cable (FFC) tN'-4<+
薄膜开关 membrane switch r@_`ob RW;
混合电路 hybrid circuit S
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厚膜 thick film }";\8
厚膜电路 thick film circuit s
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薄膜 thin film dF$Fd{\4^
薄膜混合电路 thin film hybrid circuit FK
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互连 interconnection 87P.K Yy
导线 conductor trace line hw?'aXK{
齐平导线 flush conductor o(,u"c/Or
传输线 transmission line /dU-$}>ZI
跨交 crossover o2cZ
板边插头 edge-board contact 2Uf}gG)
增强板 stiffener w l.#{@J]<
基底 substrate ?fB}9(6
基板面 real estate ;?/v}$Pa
导线面 conductor side 2;@#i*\Y
元件面 component side MLV_I4o
焊接面 solder side CU3[{a
导电图形 conductive pattern O`nrXC{
非导电图形 non-conductive pattern k<xiP@b{y
基材 base material Mf0XQ3n`H
层压板 laminate fqaysy
覆金属箔基材 metal-clad bade material y*,3P0*z
覆铜箔层压板 copper-clad laminate (CCL) %m:T?![XO
复合层压板 composite laminate "(uEcS2<
薄层压板 thin laminate BJgg-z{Y
基体材料 basis material M<t>jM@'A#
预浸材料 prepreg WlHw\\ur
粘结片 bonding sheet o(iN}. c
预浸粘结片 preimpregnated bonding sheer Xg|_
环氧玻璃基板 epoxy glass substrate Jsee8^_~
预制内层覆箔板 mass lamination panel d($f8{~W
内层芯板 core material ='1J&w~7
粘结层 bonding layer VXforI
粘结膜 film adhesive }(AgXvRq
无支撑胶粘剂膜 unsupported adhesive film +kF$I7LN
覆盖层 cover layer (cover lay) bP%0T++vo
增强板材 stiffener material #4. S2m4
铜箔面 copper-clad surface yM%,*VZ
去铜箔面 foil removal surface `3!ERQU
层压板面 unclad laminate surface eWvL(2`T x
基膜面 base film surface m2[q*k]AtS
胶粘剂面 adhesive faec d[+ xLa
原始光洁面 plate finish -(FVTWi0
粗面 matt finish 41y}n{4n8
剪切板 cut to size panel e[fzy0
超薄型层压板 ultra thin laminate k>
I;mEV
A阶树脂 A-stage resin &:g5+([<