1 backplane 背板 NHAH#7]M&1
2 Band gap voltage reference 带隙电压参考 xD4$0Ppu
3 benchtop supply 工作台电源 v&r=-}z2!
4 Block Diagram 方块图 5 Bode Plot 波特图 VGB-h'
6 Bootstrap 自举 ; :T9IL
7 Bottom FET Bottom FET =LK}9ViH
8 bucket capcitor 桶形电容 5j`v`[B;
9 chassis 机架 1AT'S;`
10 Combi-sense Combi-sense <wa(xDBw
11 constant current source 恒流源 [IMQIX
12 Core Sataration 铁芯饱和 R^6Zafp
13 crossover frequency 交叉频率 ~z`/9;
14 current ripple 纹波电流 '#<> "|
15 Cycle by Cycle 逐周期 ;y OD
16 cycle skipping 周期跳步 ;NP[_2|-,
17 Dead Time 死区时间 y?Onb3%
18 DIE Temperature 核心温度 :~D];m
19 Disable 非使能,无效,禁用,关断 ABZ06S/
20 dominant pole 主极点 Hd374U<8]T
21 Enable 使能,有效,启用 [;FofuZ
22 ESD Rating ESD额定值 <sc\EK
23 Evaluation Board 评估板 nP;;MX:B
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. -X8eabb
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 $_FZn'Db6
25 Failling edge 下降沿 s1=+::
26 figure of merit 品质因数 `kPc!I7Y
27 float charge voltage 浮充电压 0bSz4<}
28 flyback power stage 反驰式功率级 ~#Aa Ldq
29 forward voltage drop 前向压降 OXCQfT@\
30 free-running 自由运行 ^K;hn,R=
31 Freewheel diode 续流二极管 f?maa5S
32 Full load 满负载 33 gate drive 栅极驱动 gz4UV/qr/
34 gate drive stage 栅极驱动级 r[!(?%>j
35 gerber plot Gerber 图 ?:/|d\,7@
36 ground plane 接地层 c3#q0Ma
37 Henry 电感单位:亨利 e9:P9Di(b
38 Human Body Model 人体模式 ]"h=Qc
39 Hysteresis 滞回 (bvoF5%
40 inrush current 涌入电流 02pplDFsM
41 Inverting 反相 ;wgFr.#hp@
42 jittery 抖动 v)+@XU2wZ
43 Junction 结点 o\goE^,aeR
44 Kelvin connection 开尔文连接 0m&3?"5u
45 Lead Frame 引脚框架 !^L-T?y.2
46 Lead Free 无铅 (tKMBxQo8
47 level-shift 电平移动 L
{qJ-ln:
48 Line regulation 电源调整率 pX_b6%yX(
49 load regulation 负载调整率 .`J:xL%Z
50 Lot Number 批号 {cR3.%wX
51 Low Dropout 低压差 #KE;=$(S
52 Miller 密勒 53 node 节点 J*K<FFp3<
54 Non-Inverting 非反相 z mbZ
55 novel 新颖的 u5F}( +4r
56 off state 关断状态 ?wCs&tM
57 Operating supply voltage 电源工作电压 eM }W6vIn
58 out drive stage 输出驱动级 N"1QX6
59 Out of Phase 异相 IN_gF_@%
60 Part Number 产品型号 .CS v|:'1
61 pass transistor pass transistor ]nc2/S%
62 P-channel MOSFET P沟道MOSFET ]! )xr
63 Phase margin 相位裕度 SH=:p^J
64 Phase Node 开关节点 u E.^w;~2=
65 portable electronics 便携式电子设备 km4g}~N</
66 power down 掉电 %w:'!X><
67 Power Good 电源正常 $eX*
68 Power Groud 功率地 Y|RdzCM
69 Power Save Mode 节电模式 HH zEQV Lh
70 Power up 上电 rJV?)=Z
71 pull down 下拉 \O? u*
72 pull up 上拉 ANb"oX c
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ]/44Ygz/
74 push pull converter 推挽转换器 WsB3SFNG
75 ramp down 斜降 G=cNzr9
76 ramp up 斜升 GA@ Ue9
77 redundant diode 冗余二极管 "teyi"U+
78 resistive divider 电阻分压器 !g2a|g
79 ringing 振 铃 2GUupnQkD
80 ripple current 纹波电流 k%Eh{dA
81 rising edge 上升沿 v$3_o :
82 sense resistor 检测电阻 F`srE6H
83 Sequenced Power Supplys 序列电源 OZT^\Ky_l
84 shoot-through 直通,同时导通 ! TDD^
85 stray inductances. 杂散电感 k>>`fE\K
86 sub-circuit 子电路 5~U:@Tp
87 substrate 基板 y||@?Y
88 Telecom 电信 JY@X2'>v/
89 Thermal Information 热性能信息 VVLIeJ(*XT
90 thermal slug 散热片 w_3xKnMT\
91 Threshold 阈值 <jFSj=cIL
92 timing resistor 振荡电阻 "mtp0
93 Top FET Top FET 7E\gxQ(vU
94 Trace 线路,走线,引线 )S Q('vwg
95 Transfer function 传递函数 pYh!]0n
96 Trip Point 跳变点 m}pL`:e!
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Mj'lASI
98 Under Voltage Lock Out (UVLO) 欠压锁定 Qc3?}os2
99 Voltage Reference 电压参考 T.2ZBG~|[
100 voltage-second product 伏秒积 9[sG1eP!
101 zero-pole frequency compensation 零极点频率补偿 S+pP!YX
102 beat frequency 拍频 >%h7dC3h
103 one shots 单击电路 j{"[Ec
104 scaling 缩放 ^ $wJi9D6
105 ESR 等效串联电阻 [Page] v:A:37#I
106 Ground 地电位 Fx5ZwT
t
107 trimmed bandgap 平衡带隙 oZ-FF'
108 dropout voltage 压差 A$<>JVv
109 large bulk capacitance 大容量电容 i6PE6>
1/
110 circuit breaker 断路器 G4m4k
111 charge pump 电荷泵 HEpM4xe$
112 overshoot 过冲 H
pFb{
Y%h}U<y
印制电路printed circuit ]>vf 9]
印制线路 printed wiring CO'ar,
印制板 printed board J[r^T&o
印制板电路 printed circuit board ?`aTu:1#Z
印制线路板 printed wiring board ((cb4IX
印制元件 printed component G
*@@K
印制接点 printed contact `Hd9\;NJ
印制板装配 printed board assembly IXJ6PpQLv
板 board ZOn_dYjC
刚性印制板 rigid printed board avBu a6i'
挠性印制电路 flexible printed circuit M5 `m.n<
挠性印制线路 flexible printed wiring H|K("AVP:
齐平印制板 flush printed board +;6)
金属芯印制板 metal core printed board
QP V@'.2m
金属基印制板 metal base printed board KGQC't
多重布线印制板 mulit-wiring printed board jE*Ff&]%m
塑电路板 molded circuit board @p6@a6N%
散线印制板 discrete wiring board - `4Ty*K
微线印制板 micro wire board HT&p{7kFm
积层印制板 buile-up printed board [-]A^?yBM
表面层合电路板 surface laminar circuit N33AcV!*8
埋入凸块连印制板 B2it printed board V Y_f =
载芯片板 chip on board ~$ *`cO
埋电阻板 buried resistance board V4EM5 Z\k
母板 mother board O8[k_0@
子板 daughter board [
t$AavU.
背板 backplane /.2 qWQH
裸板 bare board "qgu$N4/>
键盘板夹心板 copper-invar-copper board /yp/9r@T0
动态挠性板 dynamic flex board /sV?JV[t
静态挠性板 static flex board 0#
l#,Y6#I
可断拼板 break-away planel EIPnm%{1
电缆 cable Ph
Ttx(!
挠性扁平电缆 flexible flat cable (FFC) W]@6=OpH
薄膜开关 membrane switch %Gu][_.L
混合电路 hybrid circuit x,f>X;04
厚膜 thick film 7$#rNYa,z
厚膜电路 thick film circuit i7(~>6@|
薄膜 thin film hMWo\qM
薄膜混合电路 thin film hybrid circuit wB2}uk7
互连 interconnection c(E,&{+E
导线 conductor trace line vs\|rLa
齐平导线 flush conductor UFIjW[h
传输线 transmission line zu C5@jy.x
跨交 crossover L:i+}F;M)s
板边插头 edge-board contact sNf
+ lga0
增强板 stiffener e z+yP,.#
基底 substrate 19) !$Hl
基板面 real estate Y!it!9
导线面 conductor side c(CJ{>F%
元件面 component side EZ `}*Yrd
焊接面 solder side DiR'p`b~
导电图形 conductive pattern r*]uR /Z$
非导电图形 non-conductive pattern ? osfL
基材 base material VW~Xbyf
层压板 laminate &8afl"_~
覆金属箔基材 metal-clad bade material ivD^HhG
覆铜箔层压板 copper-clad laminate (CCL) EzUPah
复合层压板 composite laminate A-;^~I
薄层压板 thin laminate U&s(1~e\
基体材料 basis material El+Ft.7
预浸材料 prepreg P|8e%P
粘结片 bonding sheet FTbtAlqh<
预浸粘结片 preimpregnated bonding sheer 0NrTJ R`
环氧玻璃基板 epoxy glass substrate 2$3kKY6$e
预制内层覆箔板 mass lamination panel =nw0# '
内层芯板 core material (qbc;gBy
粘结层 bonding layer -? Ejbko
粘结膜 film adhesive 5c)<'EP
无支撑胶粘剂膜 unsupported adhesive film MorW\7-}
覆盖层 cover layer (cover lay) "d2LyQy
增强板材 stiffener material j37:
铜箔面 copper-clad surface I0(8Z]x
去铜箔面 foil removal surface O[L\T
层压板面 unclad laminate surface /XN*)m
基膜面 base film surface $M-NR||k
胶粘剂面 adhesive faec RpjSTV8Tkm
原始光洁面 plate finish 69rwX"^
粗面 matt finish ^h`!f vyH
剪切板 cut to size panel Y6+k9$h
超薄型层压板 ultra thin laminate sb 8dc
A阶树脂 A-stage resin hg{ &Y(J!U
B阶树脂 B-stage resin XA?WUR[e
C阶树脂 C-stage resin s
8Jj6V
环氧树脂 epoxy resin lR,G;
酚醛树脂 phenolic resin GgT=t)}wu
聚酯树脂 polyester resin _m" ^lo
聚酰亚胺树脂 polyimide resin Na-q%ru
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin e`vUK.UoW
丙烯酸树脂 acrylic resin L+u OBW_
三聚氰胺甲醛树脂 melamine formaldehyde resin WVinP(#nfM
多官能环氧树脂 polyfunctional epoxy resin I>\}}!
溴化环氧树脂 brominated epoxy resin tjt=N\;
环氧酚醛 epoxy novolac JTjzT2`A.
氟树脂 fluroresin ^fG`DjA)
硅树脂 silicone resin H RWZ0 '
硅烷 silane UQSX<6"
聚合物 polymer = >P_mPP=
无定形聚合物 amorphous polymer A<a2TXcIE3
结晶现象 crystalline polamer Dxz5NW4
双晶现象 dimorphism X4XFu
共聚物 copolymer #%;<FFu\
合成树脂 synthetic 0@:Y>qVa
热固性树脂 thermosetting resin [Page] P"2Q&M_/
热塑性树脂 thermoplastic resin 2n _T2{
感光性树脂 photosensitive resin >\RDQ%z
环氧值 epoxy value %+D-y+hn
双氰胺 dicyandiamide ZWov_
粘结剂 binder </8be=e7p
胶粘剂 adesive #*[,woNk
固化剂 curing agent }rFTh I
阻燃剂 flame retardant >aX:gN
遮光剂 opaquer -,[~~
增塑剂 plasticizers 4S^
不饱和聚酯 unsatuiated polyester buc,M@>
聚酯薄膜 polyester PXOq#
聚酰亚胺薄膜 polyimide film (PI) q#l.A?rK\
聚四氟乙烯 polytetrafluoetylene (PTFE) k\Yu5)
增强材料 reinforcing material \,$r,6-g
折痕 crease ;G iI'M
云织 waviness 3-4Nad
鱼眼 fish eye WT;.>F
毛圈长 feather length u Eu6f
厚薄段 mark *Pa2bY3:
裂缝 split cr2{sGn|
捻度 twist of yarn -lnTYxo+]^
浸润剂含量 size content ^A:!ni@3
浸润剂残留量 size residue Nck!z8
处理剂含量 finish level ,?P8m"
偶联剂 couplint agent L3-<Kop
断裂长 breaking length e5]&1^+
吸水高度 height of capillary rise bjU 2UcI"<
湿强度保留率 wet strength retention hWl""66+5
白度 whitenness 6GvhEulYR
导电箔 conductive foil ;5,`Jpca
铜箔 copper foil 2&zn^\%"
压延铜箔 rolled copper foil >DSNKU+j
光面 shiny side CnM+HN30o
粗糙面 matte side uzat."`d'
处理面 treated side 4SX3c:>
防锈处理 stain proofing b'1/cY/!
双面处理铜箔 double treated foil !gD 3CA
模拟 simulation }rFsU\]:q
逻辑模拟 logic simulation Fh*q]1F
电路模拟 circit simulation >w%d'e$
时序模拟 timing simulation yfRUTG
模块化 modularization D2hAlV)i(
设计原点 design origin J)#59a
优化(设计) optimization (design) PV5TG39qQ
供设计优化坐标轴 predominant axis 5`OK-
表格原点 table origin Eg287B
元件安置 component positioning zLJ:U`uh\
比例因子 scaling factor n.;5P {V1
扫描填充 scan filling 4OqE.LFu
矩形填充 rectangle filling "jkw8UVz
填充域 region filling q?e16M
实体设计 physical design 0ECO/EuCg
逻辑设计 logic design ovo? lE-a0
逻辑电路 logic circuit #`YxoY `
层次设计 hierarchical design ZmYa.4'L
自顶向下设计 top-down design IPr*pQ{;c
自底向上设计 bottom-up design %^Q@*+{:f
费用矩阵 cost metrix Ba\wq:
元件密度 component density p``;!3~~
自由度 degrees freedom oHc-0$eMKY
出度 out going degree Y]`lEq%
入度 incoming degree a[d{>Fb.
曼哈顿距离 manhatton distance 'Wx\"]:
欧几里德距离 euclidean distance Kq@m?h
网络 network yNb#Ia
阵列 array 9;xL!cy
段 segment q7)]cY_
逻辑 logic 32)&;
逻辑设计自动化 logic design automation Qw{\sCH>
分线 separated time @+T{M:&l
分层 separated layer Qzs\|KS
定顺序 definite sequence Jnu}{^~
导线(通道) conduction (track) /64^5DjTh
导线(体)宽度 conductor width n+RUPZ
导线距离 conductor spacing T9XW%/n
导线层 conductor layer K{r1&O>W
导线宽度/间距 conductor line/space [][:/~q!
第一导线层 conductor layer No.1 "0!eb3n
圆形盘 round pad hK9t}NE.O
方形盘 square pad t?#vb}_
菱形盘 diamond pad ;s!ns N
长方形焊盘 oblong pad /!&b'7y
子弹形盘 bullet pad R"\ub"]
泪滴盘 teardrop pad U#~nN+SIt
雪人盘 snowman pad `|ck5DZT5L
形盘 V-shaped pad V QB.*R? A
环形盘 annular pad e{rHO,#A>
非圆形盘 non-circular pad 4Q`=t&u
隔离盘 isolation pad q!9v}R3(
非功能连接盘 monfunctional pad \4`saM /x
偏置连接盘 offset land Mh-*5Rx
腹(背)裸盘 back-bard land LK-K_!F
盘址 anchoring spaur X~Rk ,d3
连接盘图形 land pattern nV,{w4t+
连接盘网格阵列 land grid array O>"r. sR
孔环 annular ring ,$zSJzS
元件孔 component hole "DcueU#!
安装孔 mounting hole _QOOx+%*5
支撑孔 supported hole 0u&?Zy9&
非支撑孔 unsupported hole G+QNg.pH
导通孔 via t$PnQ@xu
镀通孔 plated through hole (PTH) q3pN/f;kr,
余隙孔 access hole }5Tyz i(
盲孔 blind via (hole) l)!woOt
埋孔 buried via hole zN8V~M;
埋,盲孔 buried blind via {p lmFV
任意层内部导通孔 any layer inner via hole luxKgcU
全部钻孔 all drilled hole >-tH&X^
定位孔 toaling hole U~B}vt
无连接盘孔 landless hole KiRt'
中间孔 interstitial hole Rcx'a:k
无连接盘导通孔 landless via hole GYb2m"a)
引导孔 pilot hole xfF&$K"
端接全隙孔 terminal clearomee hole |uBot#K|
准尺寸孔 dimensioned hole [Page] @ !O&b%8X%
在连接盘中导通孔 via-in-pad C[<\ufclD
孔位 hole location m 'H
孔密度 hole density id[>!fQ=Y
孔图 hole pattern @vYN7
钻孔图 drill drawing p7=^m>Z6
装配图assembly drawing B|
0s4E
参考基准 datum referan $> rfAs!
1) 元件设备 ka9v2tE\
ht74h
三绕组变压器:three-column transformer ThrClnTrans l<MCmKuYp
双绕组变压器:double-column transformer DblClmnTrans U%PMV?L{
电容器:Capacitor ?[4khQt
并联电容器:shunt capacitor !)*T
电抗器:Reactor o)'=D(
母线:Busbar o?
xR[N-J
输电线:TransmissionLine A`U 2HC
发电厂:power plant #uw*8&%0
断路器:Breaker zvs 2j"lb
刀闸(隔离开关):Isolator )yH#*~X_
分接头:tap Y(!)G!CMc
电动机:motor E_I6
(2) 状态参数 q@"4Rbu6
}lvP|6Y: y
有功:active power E|A_|FS&%
无功:reactive power AJ1$$c
电流:current #?d>S;)+
容量:capacity SrU
电压:voltage ;\&bvGj8V
档位:tap position %fSk
"%u%<
有功损耗:reactive loss cXEy>U|/
无功损耗:active loss zm S-s\$,
功率因数:power-factor b({b5z.A
功率:power g$+O<a@ n
功角:power-angle ?*5l}y=
电压等级:voltage grade ez9M]! 8Lt
空载损耗:no-load loss F^v{ Jqc
铁损:iron loss #Q)w$WR
铜损:copper loss RKZk/ly
空载电流:no-load current WaK{/6?T,
阻抗:impedance >0okb3+
正序阻抗:positive sequence impedance z+B
负序阻抗:negative sequence impedance "'dC>7* <
零序阻抗:zero sequence impedance (#Kvm
电阻:resistor 6h*bcb#C
电抗:reactance =]k_Oq-1h
电导:conductance E|}Nj}(*
电纳:susceptance k
<Sa<
无功负载:reactive load 或者QLoad %;B'>$O
有功负载: active load PLoad CxN@g'
遥测:YC(telemetering) T`DlOi]Z_
遥信:YX VrL>0d&d
励磁电流(转子电流):magnetizing current +|w~j#j9`
定子:stator >\Pj(,'
功角:power-angle uUB%I 8
上限:upper limit lMf5F8
下限:lower limit 0#nXxkw
并列的:apposable Y##P9^zH1
高压: high voltage -Af`AX
低压:low voltage XD>@EYN<X
中压:middle voltage ^/YAokj
电力系统 power system MX_a]$\:n
发电机 generator qk"=nAJX
励磁 excitation gV>\lMc[-%
励磁器 excitor *Bz&