1 backplane 背板 1#<E]<='t
2 Band gap voltage reference 带隙电压参考 o4;Nb|kk9+
3 benchtop supply 工作台电源 j#f&!&G5<&
4 Block Diagram 方块图 5 Bode Plot 波特图 ,no:6
6 Bootstrap 自举 =R.9"7~2x
7 Bottom FET Bottom FET VWv0\:,G
8 bucket capcitor 桶形电容 (<X dj^v
9 chassis 机架 Ag6
(
10 Combi-sense Combi-sense R6XMBYK^
11 constant current source 恒流源 V2,WP
12 Core Sataration 铁芯饱和 ~a%hRJg
13 crossover frequency 交叉频率 NR&9:?
14 current ripple 纹波电流 |mmG
s
15 Cycle by Cycle 逐周期 61/zrMPn
16 cycle skipping 周期跳步 uFWgq::\
17 Dead Time 死区时间 Bed jw =B
18 DIE Temperature 核心温度 h.;CL#s
19 Disable 非使能,无效,禁用,关断 ? myXG92
20 dominant pole 主极点
7yTe]O
21 Enable 使能,有效,启用 O97bgj]
22 ESD Rating ESD额定值 1qe^rz|
23 Evaluation Board 评估板 mN
6`8
[
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. c$kb0VR
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 :5{@*
25 Failling edge 下降沿 b,R'T+4[
26 figure of merit 品质因数 v|(b,J3
27 float charge voltage 浮充电压 !u}3H|6~
28 flyback power stage 反驰式功率级 jYX9;C;J
29 forward voltage drop 前向压降 OX/.v?c
30 free-running 自由运行 oB
R(7U~0
31 Freewheel diode 续流二极管 Xb-c`k~_
32 Full load 满负载 33 gate drive 栅极驱动 q{/Jw"e
34 gate drive stage 栅极驱动级 s@LNQ|'kO
35 gerber plot Gerber 图 /2Lo{v=0[
36 ground plane 接地层 :V~*vLvR
37 Henry 电感单位:亨利 t}k'Ba3]:Y
38 Human Body Model 人体模式 MW~B[%/
39 Hysteresis 滞回 :wZ`>,K"t>
40 inrush current 涌入电流 5MY}(w
41 Inverting 反相 Cw&D}
42 jittery 抖动 i: M*L< +
43 Junction 结点 UX`DZb+^
44 Kelvin connection 开尔文连接 4F,Ql"ae(
45 Lead Frame 引脚框架 (TNY2Ke2 8
46 Lead Free 无铅 |cGeL[
47 level-shift 电平移动 LDEW00zL
48 Line regulation 电源调整率 ` ]P5,
49 load regulation 负载调整率 ` u\z!x'
50 Lot Number 批号 !u{"] T:
51 Low Dropout 低压差 \41)0,sEy
52 Miller 密勒 53 node 节点 TUUE(sLA
54 Non-Inverting 非反相 5f'g3'
55 novel 新颖的 xY'qm8V
56 off state 关断状态 ,&&M|,NQ&s
57 Operating supply voltage 电源工作电压 >2CusT 2
58 out drive stage 输出驱动级 A1QI4.K
59 Out of Phase 异相 QrckTO
60 Part Number 产品型号 U+PCvl=x
61 pass transistor pass transistor aZjef
62 P-channel MOSFET P沟道MOSFET k5t^s
63 Phase margin 相位裕度 04guud }
64 Phase Node 开关节点 XyM(@6,'
65 portable electronics 便携式电子设备 =ym
66 power down 掉电 CLY6 YB' R
67 Power Good 电源正常 25a#eDbqi
68 Power Groud 功率地 fb"J Bc}X
69 Power Save Mode 节电模式 ::OFW@dS
70 Power up 上电 9c^skNbS
71 pull down 下拉 n!ZP?]FR
72 pull up 上拉 w"a 9'r
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) [Ba2b: l6v
74 push pull converter 推挽转换器 4Wla&yy
75 ramp down 斜降 kV\-%:-
76 ramp up 斜升 }kCn@
77 redundant diode 冗余二极管 e-iYJ?
78 resistive divider 电阻分压器 )y`TymM[F
79 ringing 振 铃 dT]L-uRZgy
80 ripple current 纹波电流 Xvu)
81 rising edge 上升沿 x\`RW3 K
82 sense resistor 检测电阻 q)?p$\
83 Sequenced Power Supplys 序列电源 uGa(_ut
84 shoot-through 直通,同时导通 VPM|Rj:d
85 stray inductances. 杂散电感 ]CIQq1iY
86 sub-circuit 子电路 OgKWgvy
87 substrate 基板 /1 US,
88 Telecom 电信 EItxRHV5
89 Thermal Information 热性能信息 wrQydI
90 thermal slug 散热片 u%=bHg
91 Threshold 阈值 EvqUNnjR
92 timing resistor 振荡电阻 }2Cd1RnS
93 Top FET Top FET .>kccLr:z
94 Trace 线路,走线,引线 2{mY:\
95 Transfer function 传递函数 8B *E+f0
96 Trip Point 跳变点 VR4E
2^
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) KP=D! l&q
98 Under Voltage Lock Out (UVLO) 欠压锁定 Mu'^OX82
99 Voltage Reference 电压参考 X:G&5
100 voltage-second product 伏秒积 7MO
101 zero-pole frequency compensation 零极点频率补偿 Z[#I"-Q~:
102 beat frequency 拍频 J[}gku?C;
103 one shots 单击电路 ^V<J69ny|9
104 scaling 缩放 O1?B{F/ e
105 ESR 等效串联电阻 [Page] wi\z>'R
106 Ground 地电位 ;48P vw>g}
107 trimmed bandgap 平衡带隙 \;-=ODC
108 dropout voltage 压差 iN<(O7B;
109 large bulk capacitance 大容量电容 e86Aqehle
110 circuit breaker 断路器 *CeQY M
111 charge pump 电荷泵 j6tP)f^tD
112 overshoot 过冲 /&D'V_Q`*
j`2B}@ 2
印制电路printed circuit e=gboR
印制线路 printed wiring oMh~5
W
印制板 printed board R=\v3m
印制板电路 printed circuit board n> MD\ZS
印制线路板 printed wiring board 6sYV7w,'@
印制元件 printed component W[R]^2QAG
印制接点 printed contact cP*c(k~N
印制板装配 printed board assembly 9U2Px$E
板 board CV!;oB&
刚性印制板 rigid printed board x1Nme%%&
挠性印制电路 flexible printed circuit >vQ6V'F
挠性印制线路 flexible printed wiring ra]!4Kd'
齐平印制板 flush printed board \|4 Ca't
金属芯印制板 metal core printed board Hs[}l_gYn
金属基印制板 metal base printed board H9%l?r5
多重布线印制板 mulit-wiring printed board <^#P6
塑电路板 molded circuit board #mgA/q?A
散线印制板 discrete wiring board ;c>>$lr
微线印制板 micro wire board >65
TkAp
积层印制板 buile-up printed board Z,0O/RFJ.q
表面层合电路板 surface laminar circuit 1KW3l<v-6
埋入凸块连印制板 B2it printed board /GsSrP_?]
载芯片板 chip on board ]@*tfz\YaH
埋电阻板 buried resistance board McEmd.S<n
母板 mother board =MMCf0
子板 daughter board jEZ
"
背板 backplane 8]My
k>
裸板 bare board -&trk
键盘板夹心板 copper-invar-copper board Dp!;7e s|
动态挠性板 dynamic flex board z8b
_ _%Br
静态挠性板 static flex board q^u1z|'Z
可断拼板 break-away planel ER{yuw
电缆 cable mH'\:oN
挠性扁平电缆 flexible flat cable (FFC) Nt HbwU,
薄膜开关 membrane switch [FB&4>V/
混合电路 hybrid circuit a|UqeNI{
厚膜 thick film DWuRJ
厚膜电路 thick film circuit ]a)IMIh;
薄膜 thin film 0HjJaML
薄膜混合电路 thin film hybrid circuit .SG0}8gW
互连 interconnection %njOX#.w
导线 conductor trace line !0b%Jh
齐平导线 flush conductor =]T|h
传输线 transmission line O-Dc[t%
跨交 crossover !2(.$}E
板边插头 edge-board contact 3KtAK9PT
增强板 stiffener CP +4k.)*O
基底 substrate Hr8\QgD<4
基板面 real estate AQ-mE9>P
导线面 conductor side \ZqK\=
元件面 component side #
2d,U\_
焊接面 solder side #`vVgGZ&
导电图形 conductive pattern H;qJH1EdD
非导电图形 non-conductive pattern n9DbiL1{
基材 base material @Eo4U]-
层压板 laminate 3a%xn4P
覆金属箔基材 metal-clad bade material [qiOd!
覆铜箔层压板 copper-clad laminate (CCL) C}9Kx }q
复合层压板 composite laminate @2u#93Y
薄层压板 thin laminate }0Y`|H\v
基体材料 basis material Hv3W{|
预浸材料 prepreg rmoJ
=.'
粘结片 bonding sheet 3i6h"Wu`n
预浸粘结片 preimpregnated bonding sheer $1~c_<DN
环氧玻璃基板 epoxy glass substrate zFOL(s.h|0
预制内层覆箔板 mass lamination panel 691G15
内层芯板 core material \Y9I~8\gB
粘结层 bonding layer V+46R
]
粘结膜 film adhesive A9t8`|1"%H
无支撑胶粘剂膜 unsupported adhesive film .W$
sxVXB
覆盖层 cover layer (cover lay) )'`CC>Q
增强板材 stiffener material |Hfl&3
铜箔面 copper-clad surface 0:. 6rp
去铜箔面 foil removal surface <iRWd
层压板面 unclad laminate surface n_J5zQJ
基膜面 base film surface ~zMDY F"&
胶粘剂面 adhesive faec B7|c`7x(
原始光洁面 plate finish of=ql
粗面 matt finish |e:rYLxm:
剪切板 cut to size panel h<)yJh
超薄型层压板 ultra thin laminate 5E`JD
A阶树脂 A-stage resin /,X7.t_-
B阶树脂 B-stage resin SAy{YOLtl
C阶树脂 C-stage resin LaclC]yLU
环氧树脂 epoxy resin 0TmZ*?3!4
酚醛树脂 phenolic resin L$SMfx
聚酯树脂 polyester resin '^DUq?E4
聚酰亚胺树脂 polyimide resin *.o"ZVl
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin T~h.=5
丙烯酸树脂 acrylic resin (V!0'9c
三聚氰胺甲醛树脂 melamine formaldehyde resin G~(&3
多官能环氧树脂 polyfunctional epoxy resin
k1RV'
溴化环氧树脂 brominated epoxy resin $,@JYLC2
环氧酚醛 epoxy novolac Wa<-AZnh
氟树脂 fluroresin p.5e:
i^LJ
硅树脂 silicone resin i+I0k~wY
硅烷 silane BtzYA"
聚合物 polymer js
-2"I
无定形聚合物 amorphous polymer I )5<DZB9
结晶现象 crystalline polamer :WO{x g
双晶现象 dimorphism \qB6TiB/
共聚物 copolymer n_}aZB3;U
合成树脂 synthetic !UVk9
热固性树脂 thermosetting resin [Page] a(f(R&-:$Y
热塑性树脂 thermoplastic resin tJAnuhX
感光性树脂 photosensitive resin z-I|h~ii
环氧值 epoxy value NZP7r;u
双氰胺 dicyandiamide >e/ r2U
粘结剂 binder KJX>DL 9\
胶粘剂 adesive K'V 2FTJI
固化剂 curing agent 3
1k
阻燃剂 flame retardant D?mDG|Z
遮光剂 opaquer onib x^Fcd
增塑剂 plasticizers Hr&Ere8.4p
不饱和聚酯 unsatuiated polyester 6#vI;d[^
聚酯薄膜 polyester A$:|Qd7F1
聚酰亚胺薄膜 polyimide film (PI) lCHo+>\Z
聚四氟乙烯 polytetrafluoetylene (PTFE) ^obC4(
增强材料 reinforcing material Fv A8T2-v
折痕 crease 5D
L,U(Y
云织 waviness [[X+P 0`r
鱼眼 fish eye J)Ol"LXV
毛圈长 feather length tH,sql)
厚薄段 mark 9(Jy0]E~
裂缝 split =9<$eLE0
捻度 twist of yarn )(]Envb?A0
浸润剂含量 size content tpZ->)1
浸润剂残留量 size residue ]w-.|vx
处理剂含量 finish level +|0 t
偶联剂 couplint agent
|Qr:!MA
断裂长 breaking length AOAO8%|I
吸水高度 height of capillary rise >4c` UW
湿强度保留率 wet strength retention ol }`Wwy
白度 whitenness %I0}4$
导电箔 conductive foil ^e%k~B^
铜箔 copper foil WN\PX!K9
压延铜箔 rolled copper foil WL:0R>0
光面 shiny side -yl;3K]l
粗糙面 matte side #D0 ~{H
处理面 treated side UKj`_a6
防锈处理 stain proofing \XDmK
双面处理铜箔 double treated foil ai9
模拟 simulation _A3X6
逻辑模拟 logic simulation QF&6?e06p0
电路模拟 circit simulation N%u
时序模拟 timing simulation t\%%d)d9
模块化 modularization [T]Bf o
设计原点 design origin d"GDZ[6
优化(设计) optimization (design) m9!DOL1pl
供设计优化坐标轴 predominant axis _r5wF(Y?7
表格原点 table origin uJ8x
元件安置 component positioning p6Gcts?,
比例因子 scaling factor %6HX*_Mr&
扫描填充 scan filling CIy^`2wq
矩形填充 rectangle filling TzY*;
填充域 region filling q5?{1
实体设计 physical design s~Gw
逻辑设计 logic design dm& /K
4c
逻辑电路 logic circuit O8y9dX-2
层次设计 hierarchical design ;W6-i2?
自顶向下设计 top-down design |*fNH(8&H
自底向上设计 bottom-up design AK;^9b-}q:
费用矩阵 cost metrix 3.FR C
元件密度 component density /GN4I!LA
自由度 degrees freedom 4m\([EO
出度 out going degree Ro~fvL~Ps
入度 incoming degree y@aKNWy}$
曼哈顿距离 manhatton distance }Aw47;5q;
欧几里德距离 euclidean distance N%*9&FjrL
网络 network I*(1.%:m
阵列 array H `5Ct
段 segment Kr]W
o8dWy
逻辑 logic yKlU6t&`
G
逻辑设计自动化 logic design automation hLo>R'@uN
分线 separated time j/'
g$
分层 separated layer KC]tY9 FK
定顺序 definite sequence ~QCA -Yud
导线(通道) conduction (track) xU:4Y0y8
导线(体)宽度 conductor width BjvdnbJg
导线距离 conductor spacing y;r"+bS8
导线层 conductor layer 8,y{q9O
导线宽度/间距 conductor line/space FR["e1<0
第一导线层 conductor layer No.1 C]Q>*=r
圆形盘 round pad PT05DH
方形盘 square pad ZMJ3NN]F
菱形盘 diamond pad Uuz?8/w}#
长方形焊盘 oblong pad Q.1XP
子弹形盘 bullet pad MX?}?"y
泪滴盘 teardrop pad
pl?kS8#U?
雪人盘 snowman pad m3luhGn
形盘 V-shaped pad V b|6 !EGh
环形盘 annular pad q}sK
非圆形盘 non-circular pad %Co
b(C&}
隔离盘 isolation pad Pa[?L:E
非功能连接盘 monfunctional pad (V)9s\Le_
偏置连接盘 offset land pND48 g;
腹(背)裸盘 back-bard land zWtj|%ts
盘址 anchoring spaur /`}6rXnw9
连接盘图形 land pattern t2U$m'(A&
连接盘网格阵列 land grid array B>@D,)/bT5
孔环 annular ring p7$3`t6u
元件孔 component hole %z2oDAjX
安装孔 mounting hole PU"S;4m
支撑孔 supported hole
WAv@F[
非支撑孔 unsupported hole 0$l&i=L
导通孔 via KX=/B=3~
镀通孔 plated through hole (PTH) {Hr>X
余隙孔 access hole =EWD
|<
盲孔 blind via (hole) 7N6zqjIB
埋孔 buried via hole @2?=3Wf
埋,盲孔 buried blind via @ct#s:t
任意层内部导通孔 any layer inner via hole J+iX,X
全部钻孔 all drilled hole [NjajA~z>F
定位孔 toaling hole "h$D7 mL
无连接盘孔 landless hole ExQ--!AC=
中间孔 interstitial hole O'fc/cvh='
无连接盘导通孔 landless via hole 9>IsqYc
引导孔 pilot hole Kn.iyR
端接全隙孔 terminal clearomee hole ],Ab cTX
准尺寸孔 dimensioned hole [Page] <ip)r;
在连接盘中导通孔 via-in-pad pj+tjF6Np
孔位 hole location ]a=l^Pc(xN
孔密度 hole density Rd0?zEKV
孔图 hole pattern }FZp840
钻孔图 drill drawing *5^ze+:
装配图assembly drawing sI$:V7/!
参考基准 datum referan z30= ay1
1) 元件设备 +yvBSpY
sY_fq.Z
三绕组变压器:three-column transformer ThrClnTrans 9 #:ue@)
双绕组变压器:double-column transformer DblClmnTrans h ;jsH!
电容器:Capacitor /%;/pi
并联电容器:shunt capacitor
[-QK$~[ g
电抗器:Reactor a9L0f BRy
母线:Busbar |]I#CdO
输电线:TransmissionLine )2/b$i,JKk
发电厂:power plant I ;l`VtD
断路器:Breaker 6B
/Jp
刀闸(隔离开关):Isolator N4tc V\O
分接头:tap }WoX9M; 1
电动机:motor =g1 D;
(2) 状态参数 r!>es;R8
%uF:)
有功:active power 7~:>WMv9
无功:reactive power E#m76]vkCU
电流:current eUYG96Jw
容量:capacity =y`-sU Hx
电压:voltage dr}O+7_7%-
档位:tap position m79m{!q$-
有功损耗:reactive loss /\Jc:v#Q
无功损耗:active loss YstXNN4
功率因数:power-factor UX03"gX
功率:power 'w: tq
功角:power-angle +W!'B
r
电压等级:voltage grade P"U>tsHK:
空载损耗:no-load loss
4{c`g$j>
铁损:iron loss ;I[.
铜损:copper loss ,80jMs
空载电流:no-load current 1i ?gvzrq
阻抗:impedance HdDo
正序阻抗:positive sequence impedance X*(gT1"t
负序阻抗:negative sequence impedance 'Wd3`4V$
零序阻抗:zero sequence impedance 9(V=Ubj
电阻:resistor }Z<D^Z~w
电抗:reactance (8+.#1!*
电导:conductance 'cWlY3%t
电纳:susceptance PpI+@:p[
无功负载:reactive load 或者QLoad &:IfhS
有功负载: active load PLoad 9N`+ O
遥测:YC(telemetering) Fa Qu$q
遥信:YX _gis+f/8h
励磁电流(转子电流):magnetizing current H!Fr("6}
定子:stator EY=\C$3J:
功角:power-angle 17?NR\Q
上限:upper limit RI7qsm6RN
下限:lower limit ot&j HS'
并列的:apposable e<&_tx
高压: high voltage >^2ZM
低压:low voltage h'z+8X_t
中压:middle voltage rcD.P?"
电力系统 power system s:qxAUi\/
发电机 generator Q%_!xQP`
励磁 excitation g^Ugl=f,
励磁器 excitor A?%XO
%
电压 voltage 'M]CZ}
电流 current AIIBd
母线 bus I_R5\l}O+D
变压器 transformer E1mI Xd;.
升压变压器 step-up transformer A=\'r<:
高压侧 high side 0jl:Yzo&\
输电系统 power transmission system ^H@!)+
=
输电线 transmission line 7zz(#
固定串联电容补偿fixed series capacitor compensation %FXI lH5
稳定 stability w>1l@%Uo
电压稳定 voltage stability dK-
^
功角稳定 angle stability tIg CF?
暂态稳定 transient stability ]DL>
.<]d
电厂 power plant ePIly)=X
能量输送 power transfer s~IA},F,\
交流 AC *IjdN,wox
装机容量 installed capacity =X%R*~!#Of
电网 power system =B,_d0Id
落点 drop point ]e#,\})Br
开关站 switch station W}<M?b4tP
双回同杆并架 double-circuit lines on the same tower @5dBb+0J
变电站 transformer substation ^HOwN<}`#
补偿度 degree of compensation tOlzOBzR
高抗 high voltage shunt reactor c DEe?WS
无功补偿 reactive power compensation Y;%R/OyWY
故障 fault ||"":K
调节 regulation l72ie
裕度 magin qx#ghcU
三相故障 three phase fault pX h^M{.
故障切除时间 fault clearing time KY(l<pm
极限切除时间 critical clearing time f(9$"Vi
切机 generator triping p0:&7,+a,
高顶值 high limited value 8gu7f;H/k
强行励磁 reinforced excitation 0YsN82IDD
线路补偿器 LDC(line drop compensation) s1*WK&@
机端 generator terminal JXI+k.fi
静态 static (state) h\: tUEg#J
动态 dynamic (state) dKN3ZCw*gF
单机无穷大系统 one machine - infinity bus system gP_d>p:b
机端电压控制 AVR w$<fSe7
电抗 reactance p1`'1`.3
电阻 resistance W0r5D9k
功角 power angle aS1P]&
有功(功率) active power (fLbg,
无功(功率) reactive power Hhce:E@K
功率因数 power factor ko7-%+0|]
无功电流 reactive current q}7Df!<|
下降特性 droop characteristics 9O0
斜率 slope &&QDEDszp
额定 rating 7=M'n;!Mh
变比 ratio U
mx
参考值 reference value MM58w3Mz
电压互感器 PT 80l3.z,:
分接头 tap H&>>]DD
下降率 droop rate fAA@ziKg
仿真分析 simulation analysis yrvSbqR
传递函数 transfer function *7D$;?"
框图 block diagram nH3b<k;S
受端 receive-side YQ[&h
裕度 margin R;,u >P "
同步 synchronization :N'[de
失去同步 loss of synchronization 6[Pr<4J
阻尼 damping S r#fyr
摇摆 swing `
a<|CcUGU
保护断路器 circuit breaker MdTd$ 4J3
电阻:resistance V44sNi
电抗:reactance hcqmjqJ
阻抗:impedance `a1R "A
电导:conductance Dm`U|<o
电纳:susceptance