1 backplane 背板 RX cfd-us
2 Band gap voltage reference 带隙电压参考 -h`[w:
3 benchtop supply 工作台电源 J^xIfV~zt
4 Block Diagram 方块图 5 Bode Plot 波特图 tT`{xM
6 Bootstrap 自举 c)q'" r
7 Bottom FET Bottom FET }^"#&w3<
8 bucket capcitor 桶形电容 Ce.*yO<-
9 chassis 机架 5W4Tp% Lda
10 Combi-sense Combi-sense l2ww3)Z
11 constant current source 恒流源 |jw{7\+
12 Core Sataration 铁芯饱和 i[r>^U8O
13 crossover frequency 交叉频率 rWS],q=c
14 current ripple 纹波电流 8oxYgj&~X
15 Cycle by Cycle 逐周期 ~]S%b3>
16 cycle skipping 周期跳步 yq]/r=e!k
17 Dead Time 死区时间 R GC DC*\
18 DIE Temperature 核心温度 U_oei3QP
19 Disable 非使能,无效,禁用,关断 *3s,~<''%
20 dominant pole 主极点 _u QxrB"9
21 Enable 使能,有效,启用 \1[v-hvK
22 ESD Rating ESD额定值 AY)R2>
fW%
23 Evaluation Board 评估板 NB)$l2<d
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 0m>?-/uDx
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 j#D (
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25 Failling edge 下降沿 f)9{D[InM^
26 figure of merit 品质因数 c[zaYcbl
27 float charge voltage 浮充电压 f`Wces=5
28 flyback power stage 反驰式功率级 JXKo zy41
29 forward voltage drop 前向压降 _2p D
30 free-running 自由运行 #Ab,h#f*7
31 Freewheel diode 续流二极管 =+>^:3cCQ
32 Full load 满负载 33 gate drive 栅极驱动 1_RN*M+#
34 gate drive stage 栅极驱动级 XMi)PXs$
35 gerber plot Gerber 图 yh{Wuz=T
36 ground plane 接地层 <52)
37 Henry 电感单位:亨利 wU(N<9
38 Human Body Model 人体模式 OtD!@GQ6
39 Hysteresis 滞回 @mRda%qR
40 inrush current 涌入电流 ?<h|Q~JH
41 Inverting 反相 > a"4aYj
42 jittery 抖动 F2WMts
43 Junction 结点 1WJ%n;
44 Kelvin connection 开尔文连接 rG"QK!R5
45 Lead Frame 引脚框架 Ou,Eu05jt'
46 Lead Free 无铅 YH-+s
47 level-shift 电平移动 oaMh5FPy
48 Line regulation 电源调整率 C#@>osC
49 load regulation 负载调整率 3lG=.yD
50 Lot Number 批号 wfY]J0l
51 Low Dropout 低压差 yr,Oq~e
52 Miller 密勒 53 node 节点 8B"my\
54 Non-Inverting 非反相 |:G`f8q9
55 novel 新颖的 u(b Pdf@kz
56 off state 关断状态 GJP\vsaQ
57 Operating supply voltage 电源工作电压 ]~J.YX9ST
58 out drive stage 输出驱动级 ^eHf'^Cvvu
59 Out of Phase 异相 ,W:Bh$%
60 Part Number 产品型号 }\wTV*n`X
61 pass transistor pass transistor n1+,Pe*)
62 P-channel MOSFET P沟道MOSFET [X=J]e^D
63 Phase margin 相位裕度 ptvM>zw'~g
64 Phase Node 开关节点 <lFQ4<"m
65 portable electronics 便携式电子设备 h&Q9
66 power down 掉电 $kCXp.#k@~
67 Power Good 电源正常 (14J~MDB
68 Power Groud 功率地 uU#7SX(uu
69 Power Save Mode 节电模式 9<Kc9Z
70 Power up 上电 zm`^=cV
71 pull down 下拉 6z>Zm1h
72 pull up 上拉 w7Y>B`wm?
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ?>
SH`\
74 push pull converter 推挽转换器 elw}(l<F
75 ramp down 斜降 `z]MQdE_w
76 ramp up 斜升 (%^Bp\.02!
77 redundant diode 冗余二极管 2%oo.?!R
78 resistive divider 电阻分压器 53jtwklA
79 ringing 振 铃 ~n$e
80 ripple current 纹波电流 RiNKUk{-
81 rising edge 上升沿 Kl)PF),
82 sense resistor 检测电阻 6yRxb(
83 Sequenced Power Supplys 序列电源 1> wt
84 shoot-through 直通,同时导通 wU =@,K
85 stray inductances. 杂散电感 q9mYhT/Im
86 sub-circuit 子电路 km+}./@
87 substrate 基板 \/
8
V|E
88 Telecom 电信 1XvB,DhJ
89 Thermal Information 热性能信息 ngC|BLT%h
90 thermal slug 散热片 2(Ez
H
91 Threshold 阈值 ]/C1pG*o
92 timing resistor 振荡电阻 3[E)/~-
93 Top FET Top FET {V{*rq<)
94 Trace 线路,走线,引线 g6=w
MRt[
95 Transfer function 传递函数 .Lc<1s
96 Trip Point 跳变点 |[]"{Eo"}
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) -A A='s
98 Under Voltage Lock Out (UVLO) 欠压锁定 MX.=k>
99 Voltage Reference 电压参考 0o+2]`q)Q
100 voltage-second product 伏秒积 q>X%MN y
101 zero-pole frequency compensation 零极点频率补偿 }\oy?_8~
102 beat frequency 拍频 0W1=9+c|X
103 one shots 单击电路 XCTee
104 scaling 缩放 |Skxa\MI
105 ESR 等效串联电阻 [Page] &bO0Rn1F
106 Ground 地电位 (!0=~x|Z[
107 trimmed bandgap 平衡带隙 ua-cX3E
108 dropout voltage 压差 c>*RQ4vE
109 large bulk capacitance 大容量电容 <Hq|<^_K
110 circuit breaker 断路器 fGD#|a;,
111 charge pump 电荷泵 '[h|f
112 overshoot 过冲 oU.LYz_
kN)m"}gX
印制电路printed circuit Y:0SrB!\
印制线路 printed wiring fEl,jA
印制板 printed board #sq$i
印制板电路 printed circuit board nD$CY K
印制线路板 printed wiring board e Ert_@}
印制元件 printed component Z ?{;|Z5
印制接点 printed contact \HzI*|*A
印制板装配 printed board assembly uW8LG\Z>D5
板 board wER>a (
刚性印制板 rigid printed board m-Uq6_e
挠性印制电路 flexible printed circuit v_gQCS
挠性印制线路 flexible printed wiring `.FvuwP
齐平印制板 flush printed board cIO7RD$8
金属芯印制板 metal core printed board Xh,{/5m
金属基印制板 metal base printed board ~8-Z=-
多重布线印制板 mulit-wiring printed board }lk_Oe1
塑电路板 molded circuit board ^/3R/;?
散线印制板 discrete wiring board L{)e1 p]q
微线印制板 micro wire board >HUU`= SC
积层印制板 buile-up printed board GB(o)I#h
表面层合电路板 surface laminar circuit 62&(+'$n
埋入凸块连印制板 B2it printed board DFz,>DM;
载芯片板 chip on board 0wLu*K5$4E
埋电阻板 buried resistance board (= H%VXQH
母板 mother board aIv>X@U}
子板 daughter board }'mBqn
背板 backplane &sp7YkaW
裸板 bare board K.Tfu"6
键盘板夹心板 copper-invar-copper board 8xQ5[Ov
动态挠性板 dynamic flex board vMiZ:*iaj@
静态挠性板 static flex board _(}{=:M?
可断拼板 break-away planel cp0@wC#d
电缆 cable ey@]B5
挠性扁平电缆 flexible flat cable (FFC) C|"h]
薄膜开关 membrane switch d7y`AS@q6
混合电路 hybrid circuit a{7>7%[
厚膜 thick film &i8AB{OU
厚膜电路 thick film circuit t%e}'?#^
薄膜 thin film /HsJyp+t
薄膜混合电路 thin film hybrid circuit ISI\<qx
互连 interconnection )QGj\2I
导线 conductor trace line Lt+ Cm$3
齐平导线 flush conductor 0Ii*
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传输线 transmission line %X Jv;|
跨交 crossover ] ZGP
板边插头 edge-board contact 1nb]~{l
增强板 stiffener 7u!i)<pn
基底 substrate ]A:n]mL
基板面 real estate bb#F2r4
导线面 conductor side 8,p nm
元件面 component side ty|E[Ez1
焊接面 solder side (c ?OcwTH
导电图形 conductive pattern <FIc!
非导电图形 non-conductive pattern wR\Y+Z
基材 base material |*W`}i
层压板 laminate $R3]y9`?
覆金属箔基材 metal-clad bade material NDW6UFd>1
覆铜箔层压板 copper-clad laminate (CCL) CpuL[|51
复合层压板 composite laminate Q#
w`ZQX3
薄层压板 thin laminate 3%Z:B8:<