1 backplane 背板 'L3MHTM>[
2 Band gap voltage reference 带隙电压参考 +p>h` fc
3 benchtop supply 工作台电源 7{M&9| aK
4 Block Diagram 方块图 5 Bode Plot 波特图 /PSXuVtu5
6 Bootstrap 自举 -?#iPvk6
7 Bottom FET Bottom FET |)>+&
xk
8 bucket capcitor 桶形电容 36co'a4,
9 chassis 机架 bR~Xog
10 Combi-sense Combi-sense EZiLXQd_
11 constant current source 恒流源 \Cq4r4'
12 Core Sataration 铁芯饱和 @0EY5{&
13 crossover frequency 交叉频率 0#'MR.,
14 current ripple 纹波电流 HP*{1Q@5
15 Cycle by Cycle 逐周期 :F6dXW
16 cycle skipping 周期跳步 i^:#*Q-co
17 Dead Time 死区时间 M1/(Xla3
18 DIE Temperature 核心温度 93.\.&L\
19 Disable 非使能,无效,禁用,关断 ?QKDYH(
20 dominant pole 主极点 O{3X`xAf
21 Enable 使能,有效,启用 6FUcg40Y
22 ESD Rating ESD额定值 r$4d4xtK
23 Evaluation Board 评估板 5V(#nz
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. PJm@fK(j
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 j<
h1s%
25 Failling edge 下降沿 |PYyhY
26 figure of merit 品质因数 W Pr:d
27 float charge voltage 浮充电压 \6 J Y#%
28 flyback power stage 反驰式功率级 q0ab]g+
29 forward voltage drop 前向压降 #'f5owk>,
30 free-running 自由运行 iu<Tv,{8
31 Freewheel diode 续流二极管 4w9=z,
32 Full load 满负载 33 gate drive 栅极驱动 X4\T=Q?uLx
34 gate drive stage 栅极驱动级 aUa+]H[
35 gerber plot Gerber 图 Qh8pOUD0l}
36 ground plane 接地层 T[e+iv<8j
37 Henry 电感单位:亨利
hFycSu
38 Human Body Model 人体模式 /YPG_,lRA
39 Hysteresis 滞回 k9H}nP$F
40 inrush current 涌入电流 $$p +~X
41 Inverting 反相 POl-S<QV
42 jittery 抖动 J3 oUtu
43 Junction 结点 {G3Ok++hc
44 Kelvin connection 开尔文连接 pheu48/f
45 Lead Frame 引脚框架 l{3zlXk3z
46 Lead Free 无铅 cr0/.Zv)
47 level-shift 电平移动 5FB3w48
48 Line regulation 电源调整率 hJ%$Te
49 load regulation 负载调整率 gGCr~.5
50 Lot Number 批号 b(U5n"cdA
51 Low Dropout 低压差 $_'<kH-eP
52 Miller 密勒 53 node 节点 nt&%
sM-X
54 Non-Inverting 非反相 p; , V
55 novel 新颖的 )!VJ\
56 off state 关断状态 =v?V
57 Operating supply voltage 电源工作电压 U3]/ NV*
58 out drive stage 输出驱动级 0wqw5KC
59 Out of Phase 异相 s+ *LVfau
60 Part Number 产品型号 9_svtO ]P
61 pass transistor pass transistor Kn1u1@&Xd
62 P-channel MOSFET P沟道MOSFET RFe>#o
63 Phase margin 相位裕度 'Q]Wk75
64 Phase Node 开关节点 )iIsnM
65 portable electronics 便携式电子设备 i,RbIZnJ
66 power down 掉电 VFq\{@-
%
67 Power Good 电源正常 cRag0.[
68 Power Groud 功率地 kAUL7_>6X
69 Power Save Mode 节电模式 "IJ1b~j?
70 Power up 上电 {EoZ}I
71 pull down 下拉 H%=;pD>o
72 pull up 上拉 Oel%lY}m3
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) DN*M-o9
74 push pull converter 推挽转换器 ebL0cK?
75 ramp down 斜降 wD6QN
76 ramp up 斜升 [zP}G?(
77 redundant diode 冗余二极管 k&K'FaM!
78 resistive divider 电阻分压器
c*[aIqj
79 ringing 振 铃 d"3x11|
80 ripple current 纹波电流 (IHR {m
81 rising edge 上升沿 :SMf
(E 5
82 sense resistor 检测电阻 %F-yFN"
83 Sequenced Power Supplys 序列电源 ?a,`{1m0\
84 shoot-through 直通,同时导通 J1M9),
85 stray inductances. 杂散电感 P()&?C
86 sub-circuit 子电路 +WR'\15u
87 substrate 基板 S n~P1C
88 Telecom 电信 \G/ZA) t
89 Thermal Information 热性能信息 8<6@O
90 thermal slug 散热片 `5x0p a
91 Threshold 阈值 $K\;sn; |:
92 timing resistor 振荡电阻 I&1.}{G>F
93 Top FET Top FET #MMp0
94 Trace 线路,走线,引线 *ZRk)
95 Transfer function 传递函数 Ka)aBU9
96 Trip Point 跳变点 _-v$fDrz
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) fpzEh}:H\
98 Under Voltage Lock Out (UVLO) 欠压锁定 ^MhMYA
99 Voltage Reference 电压参考 vON7~KA
100 voltage-second product 伏秒积 //$^~}wt
101 zero-pole frequency compensation 零极点频率补偿 YD~(l-?"
102 beat frequency 拍频 pNQ@aJ
103 one shots 单击电路 /bC@^Y&}
104 scaling 缩放 :.-KM7tDI1
105 ESR 等效串联电阻 [Page] cqb6]
106 Ground 地电位 oq>jCOVh
107 trimmed bandgap 平衡带隙
{pRa%DF
108 dropout voltage 压差 r24
s_
109 large bulk capacitance 大容量电容 ^#w9!I{4.
110 circuit breaker 断路器 _39VL
111 charge pump 电荷泵 6l"4F6
112 overshoot 过冲 >k}Kf1I
^d9o \
印制电路printed circuit 3Dh{#"88
印制线路 printed wiring ZM=eiJZ
印制板 printed board d(Yuz#Qcrh
印制板电路 printed circuit board sv\=/F@n
印制线路板 printed wiring board QNcl
印制元件 printed component `+ Mva
印制接点 printed contact 0V2~
印制板装配 printed board assembly 94rx4"AN8;
板 board ej(w{vl
刚性印制板 rigid printed board [#:yOZt
挠性印制电路 flexible printed circuit 3[kl` *`
挠性印制线路 flexible printed wiring S.C7%XU
齐平印制板 flush printed board ^h<ElK
金属芯印制板 metal core printed board ]7|qhAh<L
金属基印制板 metal base printed board eQ#"-i
多重布线印制板 mulit-wiring printed board IPY[x|
塑电路板 molded circuit board Z= pvoTY
散线印制板 discrete wiring board ar`}+2Qh0
微线印制板 micro wire board :|ytw=3>
积层印制板 buile-up printed board gF~
}
表面层合电路板 surface laminar circuit /'>ck2drjk
埋入凸块连印制板 B2it printed board HN&]`cr;
载芯片板 chip on board cyI:dvg
埋电阻板 buried resistance board DeN$YE#*
母板 mother board 1!ijRr
子板 daughter board <ou=f'
背板 backplane aQ1n1OBr
裸板 bare board ~Z97L
键盘板夹心板 copper-invar-copper board "[ >ql1t{b
动态挠性板 dynamic flex board OZl0I#@A
静态挠性板 static flex board W%#LHluP
可断拼板 break-away planel [lj^lN8
电缆 cable l_&T)Ei
挠性扁平电缆 flexible flat cable (FFC) 5PKdMEK|q
薄膜开关 membrane switch wA%,_s/U
混合电路 hybrid circuit +|O&k
厚膜 thick film wH qbTA
厚膜电路 thick film circuit 8{-bG8L> 5
薄膜 thin film 7(zY:9|(
薄膜混合电路 thin film hybrid circuit &<5oDdC
互连 interconnection HD}3mP
导线 conductor trace line g\?7M1~
齐平导线 flush conductor be&,V_F
传输线 transmission line L?hWH0^3
跨交 crossover >!P !F(
板边插头 edge-board contact O#b%&s"o
增强板 stiffener .iEzEmu
基底 substrate !*B1Eo--cN
基板面 real estate ?OWJ UmQ
导线面 conductor side </h}2x
元件面 component side myWa>Mvb
焊接面 solder side -<n]Sv;V
导电图形 conductive pattern =q*j". <
非导电图形 non-conductive pattern iD!]I$
基材 base material ljO t~@Ea
层压板 laminate (fnp\j3w
覆金属箔基材 metal-clad bade material C5'#0}6i
覆铜箔层压板 copper-clad laminate (CCL) _O>8jH!#
复合层压板 composite laminate kT{d pGU9
薄层压板 thin laminate gA DF
基体材料 basis material 5!d'RBO
预浸材料 prepreg Z|$OPMLX
粘结片 bonding sheet Jg%jmI;Y
预浸粘结片 preimpregnated bonding sheer ^eWD4Vp|4
环氧玻璃基板 epoxy glass substrate 1bJrEXHXy
预制内层覆箔板 mass lamination panel >[gNQJ6
内层芯板 core material 8u#2M8.5E
粘结层 bonding layer dy2<b+..
粘结膜 film adhesive z]
teQaUZ
无支撑胶粘剂膜 unsupported adhesive film U_C1GT-|
覆盖层 cover layer (cover lay) nfjwWDH
增强板材 stiffener material y[sO0u\
铜箔面 copper-clad surface i;}mIsNBY
去铜箔面 foil removal surface \TXCq@
层压板面 unclad laminate surface $"]*,=-X
基膜面 base film surface Kh2!c+Mw
胶粘剂面 adhesive faec .Zv uhOn^
原始光洁面 plate finish +HNM$yp
粗面 matt finish A"~4|`W
剪切板 cut to size panel G^/8lIj
超薄型层压板 ultra thin laminate dgM@|&9*m
A阶树脂 A-stage resin K-drN)o
B阶树脂 B-stage resin X=i",5;
C阶树脂 C-stage resin |4|j5<5
环氧树脂 epoxy resin ;*XH[>I
酚醛树脂 phenolic resin 16R0#Q/{+*
聚酯树脂 polyester resin YB'BAX<lI
聚酰亚胺树脂 polyimide resin = F"vL
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin M[7$cfp-Y~
丙烯酸树脂 acrylic resin `E2HQA@
三聚氰胺甲醛树脂 melamine formaldehyde resin jz72~+)T
多官能环氧树脂 polyfunctional epoxy resin +LsACSB
溴化环氧树脂 brominated epoxy resin MF/@Efjn
]
环氧酚醛 epoxy novolac ky-9I<Z,,
氟树脂 fluroresin &F#K=R| .j
硅树脂 silicone resin 'PVxc%[
硅烷 silane Sn!5/9Y
聚合物 polymer }IGoPCV|
无定形聚合物 amorphous polymer 8xN+LL'T{
结晶现象 crystalline polamer aJ^RY5
双晶现象 dimorphism \t^h|<`
共聚物 copolymer $c<NEt_\
合成树脂 synthetic ,@4~:OY
热固性树脂 thermosetting resin [Page] eT6T@C](
热塑性树脂 thermoplastic resin j0+l-]F-
感光性树脂 photosensitive resin - HiRXB
环氧值 epoxy value ==)q{e5
双氰胺 dicyandiamide n!$zO{P
粘结剂 binder C6{\^kG^j2
胶粘剂 adesive <P1yA>=3`
固化剂 curing agent 7@uhw">mX
阻燃剂 flame retardant 9B<aYp)
遮光剂 opaquer I$w:qS&:
增塑剂 plasticizers DA wUG
不饱和聚酯 unsatuiated polyester '$\O*e'
聚酯薄膜 polyester /@QPJ~%8Ud
聚酰亚胺薄膜 polyimide film (PI) OT{cP3;0*o
聚四氟乙烯 polytetrafluoetylene (PTFE) ztb?4f q6)
增强材料 reinforcing material %UokR"
折痕 crease *\PCMl
云织 waviness hWD%_"yhd
鱼眼 fish eye 7/b\NLeJ'
毛圈长 feather length y0_z_S#gO
厚薄段 mark "';K$&,[
裂缝 split -"~XI~a@Wo
捻度 twist of yarn mfCp@1;26
浸润剂含量 size content ^M6R l0
浸润剂残留量 size residue fobnK~2
处理剂含量 finish level e
.1!
K
偶联剂 couplint agent ,,HoD~]rd
断裂长 breaking length -fCR^`UOS
吸水高度 height of capillary rise ]m<z
湿强度保留率 wet strength retention xh|<`>5
白度 whitenness P}8cSX9
导电箔 conductive foil &Xh_`*]ox
铜箔 copper foil bAS/cuZs
压延铜箔 rolled copper foil wlsq[xP
光面 shiny side s@D/.X
粗糙面 matte side 8$`$24Wx
处理面 treated side n5>OZ3 E@
防锈处理 stain proofing 5u=>~yK+
双面处理铜箔 double treated foil _{&bmE
模拟 simulation o'J^kd`
逻辑模拟 logic simulation :e rfs}I
电路模拟 circit simulation 7tQ?av
时序模拟 timing simulation hAU@}"=G
模块化 modularization ,4--3 MU
设计原点 design origin p!>DA?vF
优化(设计) optimization (design) /l>!7
供设计优化坐标轴 predominant axis F_ -}GN%
表格原点 table origin x,M8NTb*
元件安置 component positioning >0E3Em<(}l
比例因子 scaling factor 7&&3@96<*#
扫描填充 scan filling i[/`9 AK
矩形填充 rectangle filling $|m'~AmI
填充域 region filling P"f4`q
实体设计 physical design *3\ Nj6
逻辑设计 logic design w:aV2
逻辑电路 logic circuit 7_ s7);
层次设计 hierarchical design V
`7(75
自顶向下设计 top-down design bJoP@s
自底向上设计 bottom-up design #Q` TH<
费用矩阵 cost metrix ~$d(@T&
元件密度 component density COA*Q
自由度 degrees freedom `z$=J"%? y
出度 out going degree ;
,n}>iTE
入度 incoming degree 3/V0w|ZgD
曼哈顿距离 manhatton distance @Y !Jm
欧几里德距离 euclidean distance =z zmz7op
网络 network 9m%2&fjK^
阵列 array %l[]n;*$
段 segment c2Wp 8l
逻辑 logic tUi@'%>=5
逻辑设计自动化 logic design automation L$6W,D
分线 separated time u0F{.fe
分层 separated layer J
p)I9k,Ez
定顺序 definite sequence mJZB@m u?
导线(通道) conduction (track) V3(8?Fz.
导线(体)宽度 conductor width i} 5M'~F
导线距离 conductor spacing .iYp9?t
导线层 conductor layer ?Ta<.j
导线宽度/间距 conductor line/space C#n.hgo>I
第一导线层 conductor layer No.1 '| p"HbJ
圆形盘 round pad YI>9C 76L
方形盘 square pad \aN7[>R.Q
菱形盘 diamond pad Je4hQJ<h
长方形焊盘 oblong pad ,\T7{=ZG\!
子弹形盘 bullet pad dU-nE5
泪滴盘 teardrop pad RFPcH8-u7
雪人盘 snowman pad n0Qp:_2z
形盘 V-shaped pad V DE+k'8\T
环形盘 annular pad ?[;>1+D
非圆形盘 non-circular pad Nq1YFI>W
隔离盘 isolation pad }W0_eQ
非功能连接盘 monfunctional pad 0#CmB4!<O
偏置连接盘 offset land mVEIHzk2b
腹(背)裸盘 back-bard land g}d[j
I9
盘址 anchoring spaur f>|Wd;7l:
连接盘图形 land pattern $18?Q+?3
连接盘网格阵列 land grid array rl,i,1t
孔环 annular ring #v; :K8
元件孔 component hole iJ`zWpj+{Q
安装孔 mounting hole $,B;\PX
支撑孔 supported hole 0g9y4z{H
非支撑孔 unsupported hole f@2F!
导通孔 via k"|Fu
镀通孔 plated through hole (PTH) 9/_~YY=/h
余隙孔 access hole v
6s]X*l?
盲孔 blind via (hole) -A@/cS%p
埋孔 buried via hole TKQ^D
埋,盲孔 buried blind via OF2W UcQ
任意层内部导通孔 any layer inner via hole \OXQ%J2v
全部钻孔 all drilled hole gJ~CD1`O
定位孔 toaling hole 3m$ck$
无连接盘孔 landless hole rZWs-]s6t
中间孔 interstitial hole djqw5kO:R
无连接盘导通孔 landless via hole !f]kTs]j~
引导孔 pilot hole %|j8#09
端接全隙孔 terminal clearomee hole KcUR
/o5K
准尺寸孔 dimensioned hole [Page] %=$Knc_!T^
在连接盘中导通孔 via-in-pad [N#4H3GM8
孔位 hole location ;2$0j1>
孔密度 hole density q\-P/aN_
孔图 hole pattern =K_&@|f+B
钻孔图 drill drawing jYvl-2A'
装配图assembly drawing HYL['B?Wid
参考基准 datum referan %w?C)$Kn\
1) 元件设备 {T-^xwc
j+rY
三绕组变压器:three-column transformer ThrClnTrans r`\@Fv,
双绕组变压器:double-column transformer DblClmnTrans |>OBpb
电容器:Capacitor A!Tm[oqu
并联电容器:shunt capacitor TY%=Y=
电抗器:Reactor x6^Y&,y9kU
母线:Busbar *Q)-"]O(k
输电线:TransmissionLine )%PMDG|
发电厂:power plant @|5B}%!
断路器:Breaker 1xu~@v60
刀闸(隔离开关):Isolator #SG.`J<%
分接头:tap xkU8(=
电动机:motor M6bM`wHH>
(2) 状态参数 ~KV{m
JPHM+3v
有功:active power "vg.{
无功:reactive power #kh:GAp]
电流:current ens]?,`0
容量:capacity q#SEtyJL
电压:voltage t{QQ;'
档位:tap position G&@dJ &B
有功损耗:reactive loss I ~^Xw7
无功损耗:active loss [$pb
功率因数:power-factor Zw _aeJ
功率:power g"k4Z
功角:power-angle lHDZfwJ&C1
电压等级:voltage grade g cB
hEw
空载损耗:no-load loss `SOQPAnK+;
铁损:iron loss ?@7!D8$9
铜损:copper loss _RbM'_y+E
空载电流:no-load current SM%/pu;
阻抗:impedance {}rnn$HQe
正序阻抗:positive sequence impedance dpK-
负序阻抗:negative sequence impedance ecQ{ePoU
零序阻抗:zero sequence impedance .ZV='i()X
电阻:resistor I$p1^8~L
电抗:reactance "}#%h&,
电导:conductance }+bo?~2E&
电纳:susceptance Jm#p!G+
无功负载:reactive load 或者QLoad Sc#3<nVg
有功负载: active load PLoad TOF V`7q;3
遥测:YC(telemetering) r>7+&s*yk
遥信:YX %l14K_
励磁电流(转子电流):magnetizing current *^Ges;5$"
定子:stator ,Q3OQ[Nmh
功角:power-angle 9#m3<oSJ
上限:upper limit 8|<</v8i
下限:lower limit w-2#CX8jY
并列的:apposable ExSM=
高压: high voltage _)~1'tCs}h
低压:low voltage UP$>,05z6
中压:middle voltage [z ]P5
电力系统 power system U#]J5'i
发电机 generator # ACT&J
励磁 excitation 'RhS%l
励磁器 excitor >j3':>\U
电压 voltage p5tb=Zg_
电流 current JqZt1um
母线 bus T/2k2r4PD
变压器 transformer |m6rF7Q
升压变压器 step-up transformer <#4""FO*
高压侧 high side KvEv0L<ky
输电系统 power transmission system ~CbiKez
输电线 transmission line xr]bH.>
固定串联电容补偿fixed series capacitor compensation @eeI4Jz
稳定 stability F8dr-"G
电压稳定 voltage stability l@*$C&E
功角稳定 angle stability 24k]X`/n
暂态稳定 transient stability FU/:'/ L
电厂 power plant s~2o<#
能量输送 power transfer t-o,iaPG3
交流 AC h@\-]zN{
装机容量 installed capacity li
v=q
电网 power system &M<"Fmn
落点 drop point tpEy-"D&
开关站 switch station 3<"j/9;K'
双回同杆并架 double-circuit lines on the same tower az:}RE3o
变电站 transformer substation w8R7Ksn(
补偿度 degree of compensation {Ji&rk}NP
高抗 high voltage shunt reactor
{U$XHG
无功补偿 reactive power compensation pfHjs3A=
故障 fault dO%f ;m>#
调节 regulation |LZ{kD|
裕度 magin dsx<ZwZN>
三相故障 three phase fault cW_wIy\]&
故障切除时间 fault clearing time mRRZ/m?A(
极限切除时间 critical clearing time (lS[a
切机 generator triping %K')_NS@
高顶值 high limited value D
(8Z90
强行励磁 reinforced excitation Hv/5)
线路补偿器 LDC(line drop compensation) KpLaQb
机端 generator terminal fdX|t"oz
静态 static (state) $Wj{B@k
动态 dynamic (state) 5,##p"O(
单机无穷大系统 one machine - infinity bus system =pi,]m
机端电压控制 AVR ~!~i_L\V
电抗 reactance A+8)VlE\
电阻 resistance w(aj' i
功角 power angle Q"D
有功(功率) active power 2wB*c9~
无功(功率) reactive power nRB3VsL
功率因数 power factor 89^g$ ac
无功电流 reactive current hZ452W
下降特性 droop characteristics fX 1%I
斜率 slope 2(0%{*m
额定 rating 9xz@2b@
变比 ratio ^pd7nr~Y
参考值 reference value MnqT?Cc4$j
电压互感器 PT b way+lh
分接头 tap Nv.
下降率 droop rate P ?f${t+
仿真分析 simulation analysis :%J;[bS+
传递函数 transfer function ;YY<KuT
框图 block diagram i6k6l%
受端 receive-side 8Cp@k=
裕度 margin A :KZyd"Z
同步 synchronization xtD(tiqh.;
失去同步 loss of synchronization B
E8_.>
阻尼 damping WwTl|wgvyI
摇摆 swing HQ9tvSc
保护断路器 circuit breaker EK=0oy[
电阻:resistance G!sfp}qW
电抗:reactance -O?HfQ
阻抗:impedance N8At N\e
电导:conductance 5o 5DG
电纳:susceptance