1 backplane 背板 okTqq=xd`
2 Band gap voltage reference 带隙电压参考 JthU'"K
3 benchtop supply 工作台电源 ,@\z{}~v
4 Block Diagram 方块图 5 Bode Plot 波特图 C=JS]2W2
6 Bootstrap 自举 5aNvGI1
7 Bottom FET Bottom FET cJzkA^T9
8 bucket capcitor 桶形电容 S{N=9934_
9 chassis 机架 Z:YgG.z"
10 Combi-sense Combi-sense ^#U[v7y
11 constant current source 恒流源 9K-,#a
12 Core Sataration 铁芯饱和 ZP
]Ok
13 crossover frequency 交叉频率 FSYs1Li_C
14 current ripple 纹波电流 M9?f`9
15 Cycle by Cycle 逐周期 fpJ%{z2
16 cycle skipping 周期跳步 Q;GcV&f;f
17 Dead Time 死区时间 2.'hr/.
18 DIE Temperature 核心温度 S}qGf%
19 Disable 非使能,无效,禁用,关断 HQMug
20 dominant pole 主极点 f6 s .xQ
21 Enable 使能,有效,启用 nX8ulGG s
22 ESD Rating ESD额定值 >96+s)T%;
23 Evaluation Board 评估板 ua,!kyS
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. PW\me7iCz
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 3Pvz57z{
25 Failling edge 下降沿 M5 ^qc
26 figure of merit 品质因数 G+<id1
27 float charge voltage 浮充电压 +'_ peT.8
28 flyback power stage 反驰式功率级 *E+VcU
29 forward voltage drop 前向压降 8+H 0
30 free-running 自由运行 U65oh8x
31 Freewheel diode 续流二极管 ^DVryeLD
32 Full load 满负载 33 gate drive 栅极驱动 j1=su~
34 gate drive stage 栅极驱动级 \\3 ?ij:v
35 gerber plot Gerber 图 T[MDjhv'
36 ground plane 接地层 =MwR)CI#
37 Henry 电感单位:亨利 aLlHR_
38 Human Body Model 人体模式 z<gII~%
39 Hysteresis 滞回 ]GD&EQ
40 inrush current 涌入电流 KY?ujeF
41 Inverting 反相 b*ja,I4
42 jittery 抖动 #/HZ[Vw
43 Junction 结点 4/OmgBo'
44 Kelvin connection 开尔文连接 g!OcWy)7
45 Lead Frame 引脚框架 [~c_Aa+6N
46 Lead Free 无铅 $-]I?cWlQ
47 level-shift 电平移动 )Br#R:#
48 Line regulation 电源调整率 PcI~,e%
49 load regulation 负载调整率 z m]R76
50 Lot Number 批号 ZD4aT1|Q7
51 Low Dropout 低压差 N6> rU
52 Miller 密勒 53 node 节点 &P"1 3]^@
54 Non-Inverting 非反相 u"m TS&
55 novel 新颖的 Z[>fFg~N4
56 off state 关断状态 (p]S
57 Operating supply voltage 电源工作电压 6C/Pu!Sx?
58 out drive stage 输出驱动级 VF g(:
59 Out of Phase 异相 8dCRSU
60 Part Number 产品型号 Wr-I~>D%_
61 pass transistor pass transistor ~(B%E'
62 P-channel MOSFET P沟道MOSFET |;&I$'i
63 Phase margin 相位裕度 }$g"|;<ha
64 Phase Node 开关节点 #g'j0N
65 portable electronics 便携式电子设备 q$"?P
66 power down 掉电 i:jns>E
67 Power Good 电源正常 [f}`reRlZ
68 Power Groud 功率地 \S&OAe/b
69 Power Save Mode 节电模式 RxNLn/?d@
70 Power up 上电 Cq'{%
71 pull down 下拉 `g4N]<@z
72 pull up 上拉 %e)?Mem
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Ya(3Z_f+VZ
74 push pull converter 推挽转换器 &Pc.[k
75 ramp down 斜降 <":83RCS
76 ramp up 斜升 hT `&Xb
77 redundant diode 冗余二极管 b"nkF\P@Fj
78 resistive divider 电阻分压器 C](djkA$
79 ringing 振 铃 wQ[!~>A
80 ripple current 纹波电流 9+/D\|"{
81 rising edge 上升沿 \HG4i/V:h
82 sense resistor 检测电阻 1_l)$"
83 Sequenced Power Supplys 序列电源 /a)^)
84 shoot-through 直通,同时导通 N(3Bzd)
85 stray inductances. 杂散电感 'Gamb+[
86 sub-circuit 子电路 PZO.$'L|7
87 substrate 基板 Cl3L)
88 Telecom 电信 t=|}?lN<
89 Thermal Information 热性能信息 _~*j=XR s
90 thermal slug 散热片 h:sf?X[
91 Threshold 阈值 5NhAb$q2Y
92 timing resistor 振荡电阻 S9ic4rcd
93 Top FET Top FET .v+W>
94 Trace 线路,走线,引线 u J]uz%
95 Transfer function 传递函数 2.]d~\
96 Trip Point 跳变点 RLzqpE<rJ
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) pp(?rE$S
98 Under Voltage Lock Out (UVLO) 欠压锁定 eW8{],B
99 Voltage Reference 电压参考 \(;u[
100 voltage-second product 伏秒积 ` N
R,8F
101 zero-pole frequency compensation 零极点频率补偿 =e0MEV#s.
102 beat frequency 拍频 J<4_<.o(a
103 one shots 单击电路 b5I 8jPj4c
104 scaling 缩放 qk>SM|{
105 ESR 等效串联电阻 [Page] U<>@)0~7g!
106 Ground 地电位 q&_\A0
107 trimmed bandgap 平衡带隙 :SWrx MT
108 dropout voltage 压差 ~b0l?P*Ff
109 large bulk capacitance 大容量电容 vK+!m~kDu
110 circuit breaker 断路器 }2:q#}"
111 charge pump 电荷泵 7FD,TJs
112 overshoot 过冲 G l2WbY
e@S$[,8
印制电路printed circuit <#199`R
印制线路 printed wiring Y6. Bi
印制板 printed board 7i'clB9!
印制板电路 printed circuit board }Kp$/CYd
印制线路板 printed wiring board Sa0IRC<LV
印制元件 printed component _[i.)8$7
印制接点 printed contact U2tgBF?)A
印制板装配 printed board assembly uEG4^
板 board QMmZvz\^
刚性印制板 rigid printed board }_}
挠性印制电路 flexible printed circuit L/,gD.h^
挠性印制线路 flexible printed wiring A f!`7l-
齐平印制板 flush printed board #<U@SMv
金属芯印制板 metal core printed board TU6YS<
金属基印制板 metal base printed board #$L/pRC
多重布线印制板 mulit-wiring printed board 6ecx!uc$
塑电路板 molded circuit board 7y42)X
散线印制板 discrete wiring board 3Zs0W{OxU
微线印制板 micro wire board B1s&2{L6K
积层印制板 buile-up printed board %e)vl[:}
表面层合电路板 surface laminar circuit >Q ^ mR
埋入凸块连印制板 B2it printed board mG@[~w+
载芯片板 chip on board !0|&f>y
埋电阻板 buried resistance board L; A#N9
母板 mother board i,%N#
子板 daughter board 9C{Xpu
背板 backplane I9rQX9#B
裸板 bare board 4:733Q3oK
键盘板夹心板 copper-invar-copper board |id7@3leu
动态挠性板 dynamic flex board `[XH=-p
静态挠性板 static flex board |nr;OM
可断拼板 break-away planel J7e/+W~
电缆 cable w@O)b-b|w
挠性扁平电缆 flexible flat cable (FFC)
"*V'
薄膜开关 membrane switch &B=z*m
混合电路 hybrid circuit CdcBE.%<
厚膜 thick film )56L`5#tS
厚膜电路 thick film circuit WE_'u+!B
薄膜 thin film ZtP/|P5@
薄膜混合电路 thin film hybrid circuit Ol<LL#<j4
互连 interconnection M?hPlo"_
导线 conductor trace line (^sb('"
齐平导线 flush conductor $Fy~xMA8O
传输线 transmission line pU,\ &3N
跨交 crossover $P#+Y,r~\
板边插头 edge-board contact 30(e6T;
增强板 stiffener S;2UcSsQl
基底 substrate a9_2b}t
基板面 real estate M195[]
导线面 conductor side t\!5$P
元件面 component side kkj@!1q(wO
焊接面 solder side R$MR|
导电图形 conductive pattern {!{T,_ J
非导电图形 non-conductive pattern QfM^J5j.M?
基材 base material W?.xtQEv
层压板 laminate mUR[;;l
覆金属箔基材 metal-clad bade material ~7Nqwwx
覆铜箔层压板 copper-clad laminate (CCL) B>z^W+Unyn
复合层压板 composite laminate F8{T/YhZ
薄层压板 thin laminate -xJ\/"A
基体材料 basis material kI5LG6
预浸材料 prepreg <Nc9F['
粘结片 bonding sheet wLt0Fq6QG
预浸粘结片 preimpregnated bonding sheer Et}%sdS
环氧玻璃基板 epoxy glass substrate
=&qfmq
预制内层覆箔板 mass lamination panel a{%EHL,F
内层芯板 core material 20` XklV
粘结层 bonding layer dr(e)eD(R>
粘结膜 film adhesive S_VzmCi
无支撑胶粘剂膜 unsupported adhesive film @wP.Rd
覆盖层 cover layer (cover lay) 6Q+VW_~
增强板材 stiffener material "/UPq6
铜箔面 copper-clad surface |L-- j
去铜箔面 foil removal surface ?o/p}6
层压板面 unclad laminate surface N5k9o:2
基膜面 base film surface ,p\*cHB9
胶粘剂面 adhesive faec 9{A*[.XK]
原始光洁面 plate finish *|0W3uy\Y
粗面 matt finish K+yi_n L
剪切板 cut to size panel wjOqCF"
超薄型层压板 ultra thin laminate _nw\ac#*
A阶树脂 A-stage resin |Z Cv>8?n
B阶树脂 B-stage resin +s [_
4
C阶树脂 C-stage resin Vt9o8naz
环氧树脂 epoxy resin 0{?%"t\/f
酚醛树脂 phenolic resin A?)(^
聚酯树脂 polyester resin 6Hd^qouid
聚酰亚胺树脂 polyimide resin 8-K4*(-dL
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin e+@.n
丙烯酸树脂 acrylic resin AJzm/,H
三聚氰胺甲醛树脂 melamine formaldehyde resin R~N%sn
多官能环氧树脂 polyfunctional epoxy resin do%.KIk
溴化环氧树脂 brominated epoxy resin f9n4/(Cy
环氧酚醛 epoxy novolac SBw'z(U
氟树脂 fluroresin C{ Z*5)
硅树脂 silicone resin mj9]M?]
硅烷 silane %U1HvmyK
聚合物 polymer >g [Wnzf
无定形聚合物 amorphous polymer g|!=@9[dv
结晶现象 crystalline polamer kYd=DY
双晶现象 dimorphism x_H"<-By
共聚物 copolymer BTE&7/i21
合成树脂 synthetic 6b!1j,\Vx
热固性树脂 thermosetting resin [Page] 0XL[4[LdA
热塑性树脂 thermoplastic resin \}Pr!tk!
感光性树脂 photosensitive resin ,l\D@<F
环氧值 epoxy value .3
^*_
双氰胺 dicyandiamide >rh<%55P`
粘结剂 binder o`}8ZtD
胶粘剂 adesive 7G_lGV_
固化剂 curing agent D,uT#P
阻燃剂 flame retardant gti=GmL(L
遮光剂 opaquer
`k08M)
增塑剂 plasticizers rO1.8KKJ
不饱和聚酯 unsatuiated polyester x/92],.Mz
聚酯薄膜 polyester Aq/wa6^%
聚酰亚胺薄膜 polyimide film (PI) -%t8a42
聚四氟乙烯 polytetrafluoetylene (PTFE) uYc&Q$U
增强材料 reinforcing material \<y#$:4r<8
折痕 crease yhyh\.
云织 waviness y"nCT3
鱼眼 fish eye s|"4!{It
毛圈长 feather length "QY~V{u5
厚薄段 mark .>(qZEF
裂缝 split I,lzyxRP
捻度 twist of yarn wtGb3D"am
浸润剂含量 size content +Nka,C^O"
浸润剂残留量 size residue "S&1J8D|
处理剂含量 finish level j;*=
^s
偶联剂 couplint agent =iPQ\_ON@
断裂长 breaking length h6(L22Hn
吸水高度 height of capillary rise 6IM:Xj
湿强度保留率 wet strength retention m3_)UIJZ
白度 whitenness 8L(KdDY
导电箔 conductive foil /s`xPxvt
铜箔 copper foil W{;LI
WsZ
压延铜箔 rolled copper foil 5wMEp" YHE
光面 shiny side XpOQBXbt
粗糙面 matte side gr$H?|n l
处理面 treated side * (<3 oIRS
防锈处理 stain proofing VnMiZAHR
双面处理铜箔 double treated foil N" oJ3-~
模拟 simulation oRCD8b?
逻辑模拟 logic simulation z[_Gg8e
电路模拟 circit simulation ^kj%Ekt7
时序模拟 timing simulation 885
,3AdA
模块化 modularization 1uhSP!b
设计原点 design origin v_@!u`
优化(设计) optimization (design) px_%5^zRQ
供设计优化坐标轴 predominant axis \R<OT%8
表格原点 table origin
'+C%]p
元件安置 component positioning [x|{VJ(h
比例因子 scaling factor 93#wU})
扫描填充 scan filling k$} 6Qd
矩形填充 rectangle filling \t@|-`
填充域 region filling JTB5#S4W
实体设计 physical design (*Y ENT}
逻辑设计 logic design Cqk6I gw
逻辑电路 logic circuit y<5xlN(+v
层次设计 hierarchical design DnPV
Tp(>
自顶向下设计 top-down design Q /\Hc
自底向上设计 bottom-up design ZCVN+::Y
费用矩阵 cost metrix h9J
元件密度 component density aG\B?pn-
自由度 degrees freedom Z@`HFZJ
出度 out going degree qT L@N9
入度 incoming degree $eBE pN
曼哈顿距离 manhatton distance sWnU*Q
欧几里德距离 euclidean distance b}r3x&)
网络 network V|fs"HY
阵列 array _/!IjB:(70
段 segment >j$CM:w
逻辑 logic x_5H_! \#
逻辑设计自动化 logic design automation XX(;,[(_
分线 separated time ,*Yu~4
分层 separated layer [(N<E/m %B
定顺序 definite sequence Z5o6RTi
导线(通道) conduction (track) r
yO\$m
导线(体)宽度 conductor width `W8dayZt
导线距离 conductor spacing 5<ycF_
导线层 conductor layer X;0DQnAI8j
导线宽度/间距 conductor line/space AHhck?M^
第一导线层 conductor layer No.1 p`JD8c
圆形盘 round pad VscEdtkd
方形盘 square pad lH ^[b[
菱形盘 diamond pad gI^*O@Q4{b
长方形焊盘 oblong pad o3l_&?^
子弹形盘 bullet pad 7>J8\=
泪滴盘 teardrop pad 6l>$N?a
雪人盘 snowman pad m>6,{g)
形盘 V-shaped pad V ^1S(6'a#
环形盘 annular pad JQ8wL _C>
非圆形盘 non-circular pad v7/qJ9l
隔离盘 isolation pad `:A`%Fg8<
非功能连接盘 monfunctional pad !285=cxz
偏置连接盘 offset land yggQ4y6
腹(背)裸盘 back-bard land dg4 QA_"
盘址 anchoring spaur i9oi}$;J
连接盘图形 land pattern iVt6rX
连接盘网格阵列 land grid array Ed)t87E
孔环 annular ring b{t'Doe
元件孔 component hole *#,wV
安装孔 mounting hole ^60BQ{ne
支撑孔 supported hole Nd*zSsVlq
非支撑孔 unsupported hole _}7N,Cx
导通孔 via @%K@oD L
镀通孔 plated through hole (PTH) W9T,1h5x
余隙孔 access hole g~Zel}h#
盲孔 blind via (hole) cSBYC_LU
埋孔 buried via hole (yCFpb
埋,盲孔 buried blind via [=-?n6
任意层内部导通孔 any layer inner via hole 5/Q^p"
全部钻孔 all drilled hole Qsc%qt-l
定位孔 toaling hole },'2j
无连接盘孔 landless hole R$=UJ}>
中间孔 interstitial hole Dm[4`p@IY\
无连接盘导通孔 landless via hole &V[m{.
引导孔 pilot hole }}v;V*_V
端接全隙孔 terminal clearomee hole %9xz[Ng
准尺寸孔 dimensioned hole [Page] RJ1Q.o
在连接盘中导通孔 via-in-pad )G0a72
孔位 hole location m6)8L?B
孔密度 hole density g#;w)- Zj
孔图 hole pattern rm NqS+t
钻孔图 drill drawing aO?(ZL
装配图assembly drawing /v
E >*x
参考基准 datum referan HP2]b?C
1) 元件设备 Ex~[Hk4ow
T2
0dZ8{y
三绕组变压器:three-column transformer ThrClnTrans BM#cosV7%h
双绕组变压器:double-column transformer DblClmnTrans GM{m(Y
电容器:Capacitor )W~w72j-
并联电容器:shunt capacitor ?C6iJnm
电抗器:Reactor e7ixi^Q
母线:Busbar yK<%AV@v
输电线:TransmissionLine 52BlFBNV
发电厂:power plant {mMrD 5
断路器:Breaker :Q=Jn?Gjb
刀闸(隔离开关):Isolator $6T*\(;T@A
分接头:tap q3B#rje>h
电动机:motor Jeyy Z=
(2) 状态参数 C+$dm)M/q
](4V3w.
有功:active power j8!fzJG
无功:reactive power RX%*:lXi_
电流:current 3HC aZ?Ry'
容量:capacity |r!G(an1x4
电压:voltage I3D8xl>P\
档位:tap position l~wx8
,?G
有功损耗:reactive loss ;=Jj{FoG%
无功损耗:active loss 2:Q9gru
功率因数:power-factor Zi[@xG8dm
功率:power p
mcy(<
功角:power-angle {e
A4y~k
电压等级:voltage grade Ps(3X@
空载损耗:no-load loss KD*,u{v;
铁损:iron loss oori t
铜损:copper loss ZkkXITQkPM
空载电流:no-load current sXkWs2!
阻抗:impedance W`K XO|'p@
正序阻抗:positive sequence impedance &aldnJ
负序阻抗:negative sequence impedance 9~bje^M
零序阻抗:zero sequence impedance F`3c uL[N
电阻:resistor kN>%y&cK
电抗:reactance $%"i|KTsv:
电导:conductance &xMR{:
电纳:susceptance C] qY
无功负载:reactive load 或者QLoad ~T9%%W[
有功负载: active load PLoad ?N<* ATCL
遥测:YC(telemetering) oJbD|m
遥信:YX C2Fklp6
励磁电流(转子电流):magnetizing current #.UooFk+Y
定子:stator Xy:'f".M~\
功角:power-angle 8Br*
上限:upper limit K?,eIZ{.S
下限:lower limit NduvfA4
并列的:apposable Wo2TU!
高压: high voltage aErms-~
低压:low voltage kMAQHpDD
中压:middle voltage e3UGYwQ
电力系统 power system m+||t
发电机 generator 3:7J@>
励磁 excitation mS5'q q;t
励磁器 excitor Wc ]BQn
电压 voltage t/LQ|/xo
电流 current LCx{7bN1ro
母线 bus @*e|{;X]hy
变压器 transformer j1%o+#df
升压变压器 step-up transformer A&rk5y;
高压侧 high side j|TcmZGO
输电系统 power transmission system b26#0;i
输电线 transmission line w d2GKq!
固定串联电容补偿fixed series capacitor compensation S(eCG2gR
稳定 stability u~7mH
电压稳定 voltage stability Ikql
功角稳定 angle stability im|(
4f
暂态稳定 transient stability X:bv
?o>Y
电厂 power plant NypM+y
能量输送 power transfer >Lx,<sE
交流 AC #'fh'$5"
装机容量 installed capacity VliX'.-
电网 power system R7}=k)U?d@
落点 drop point Y b\t0:_
开关站 switch station oa$-o/DhB
双回同杆并架 double-circuit lines on the same tower 5A
oKlJrY
变电站 transformer substation O*xC}$OOn
补偿度 degree of compensation >=BH$4Ce
高抗 high voltage shunt reactor ~A2{$C
无功补偿 reactive power compensation Xptb4]
故障 fault kIhP 73M
调节 regulation B/.+&AJw
裕度 magin JpqZVu"7
三相故障 three phase fault |VxEWU/
故障切除时间 fault clearing time NC'+-P'y
极限切除时间 critical clearing time 4^cDp!8
切机 generator triping 8+Sa$R
高顶值 high limited value ms2y[b
强行励磁 reinforced excitation Uyf<:8U\
线路补偿器 LDC(line drop compensation) JoeU J3N
机端 generator terminal =lY6v-MBw
静态 static (state) C4wJSQl_I
动态 dynamic (state) |^9+c2
单机无穷大系统 one machine - infinity bus system l?Vm/YXb
机端电压控制 AVR (?R;u>
电抗 reactance s+IU%y/9$a
电阻 resistance $BHbnsaQ
功角 power angle Otq`4 5
有功(功率) active power ?}|l )
无功(功率) reactive power 1{D_30sG.
功率因数 power factor ^*JpdmVhu
无功电流 reactive current hbl%<ItI49
下降特性 droop characteristics #yz5CWu
斜率 slope 8>^(-ca_
额定 rating 0qP&hybL[(
变比 ratio XJJdCv^
参考值 reference value uG<VQ2LM
电压互感器 PT CR8a)X4j#
分接头 tap y.,S}7l:
下降率 droop rate vC$Q4>m
仿真分析 simulation analysis 8 Z|c!QIU
传递函数 transfer function N6K%Wkz
框图 block diagram 4Uz1~AuNxb
受端 receive-side lS1-e0,h1
裕度 margin }#0MJ6L
同步 synchronization
qkQ_#
失去同步 loss of synchronization CUJP"u>8M
阻尼 damping ~q0g7?}&
摇摆 swing )D_ZZPq_
保护断路器 circuit breaker 1K(a=o[Ce
电阻:resistance r*$$82s
电抗:reactance Arvxl(R\4
阻抗:impedance <3?T^/8
电导:conductance ~9#x/EG/
电纳:susceptance