1 backplane 背板 5$ra4+k0
2 Band gap voltage reference 带隙电压参考 ou[_ y
3 benchtop supply 工作台电源 m+J3t@$
4 Block Diagram 方块图 5 Bode Plot 波特图 b1A8 -![
6 Bootstrap 自举 X)K3X:~L+
7 Bottom FET Bottom FET !Xbr7:UPN1
8 bucket capcitor 桶形电容 ~+GMn[h
9 chassis 机架 z7H[\ 4A!>
10 Combi-sense Combi-sense 4Fr\=TX
11 constant current source 恒流源 ]zza/O;31(
12 Core Sataration 铁芯饱和 3Hli^9&OX_
13 crossover frequency 交叉频率 ?`oCc[hY
14 current ripple 纹波电流 u}7#3JfLn
15 Cycle by Cycle 逐周期 Y M_\ ZK:
16 cycle skipping 周期跳步 p6yC1\U!o
17 Dead Time 死区时间 M)U 32gI:
18 DIE Temperature 核心温度 G^]7!:0
19 Disable 非使能,无效,禁用,关断 wM;9plYlw0
20 dominant pole 主极点 }cL9`a9j
21 Enable 使能,有效,启用 C>qKKLZ
22 ESD Rating ESD额定值 Bk~lE]Q3c7
23 Evaluation Board 评估板 T`;>Kq:s
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ">G|\_ZF
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 <[H1S@{W
25 Failling edge 下降沿 <Cvlz^K[
26 figure of merit 品质因数 w6fVZY4
27 float charge voltage 浮充电压 >HUU`= SC
28 flyback power stage 反驰式功率级 GB(o)I#h
29 forward voltage drop 前向压降 62&(+'$n
30 free-running 自由运行 DFz,>DM;
31 Freewheel diode 续流二极管 _d'x6$Jg
32 Full load 满负载 33 gate drive 栅极驱动 XM$HHk}L;
34 gate drive stage 栅极驱动级 !`k{Ga
35 gerber plot Gerber 图 L>Y>b4oy3
36 ground plane 接地层 D-/K'|b
37 Henry 电感单位:亨利 K.Tfu"6
38 Human Body Model 人体模式 8xQ5[Ov
39 Hysteresis 滞回 vMiZ:*iaj@
40 inrush current 涌入电流 _(}{=:M?
41 Inverting 反相 cp0@wC#d
42 jittery 抖动 c]>s(/}T
43 Junction 结点 ;~$_A4;
44 Kelvin connection 开尔文连接 b<de)MG
45 Lead Frame 引脚框架 ThX%Uzd"[;
46 Lead Free 无铅 }jM&GH1
47 level-shift 电平移动 XHgwK@GU
48 Line regulation 电源调整率 vs/.'yD/C
49 load regulation 负载调整率 (KDUX
t.
50 Lot Number 批号 'b#`8k~>
51 Low Dropout 低压差 1 f ]04TI
52 Miller 密勒 53 node 节点 ~Cx07I_lf
54 Non-Inverting 非反相 /2K4ka<?7
55 novel 新颖的 J~6+zBF
56 off state 关断状态 + RX{
57 Operating supply voltage 电源工作电压 Wc4F'}s
58 out drive stage 输出驱动级 bb#F2r4
59 Out of Phase 异相 8,p nm
60 Part Number 产品型号 ty|E[Ez1
61 pass transistor pass transistor (c ?OcwTH
62 P-channel MOSFET P沟道MOSFET <FIc!
63 Phase margin 相位裕度 wR\Y+Z
64 Phase Node 开关节点 |*W`}i
65 portable electronics 便携式电子设备 $R3]y9`?
66 power down 掉电 NDW6UFd>1
67 Power Good 电源正常 CpuL[|51
68 Power Groud 功率地 Q#
w`ZQX3
69 Power Save Mode 节电模式 Amf
gc>eJ
70 Power up 上电 37DyDzW)'
71 pull down 下拉 hPa:>e
72 pull up 上拉 PG<tic<?
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) m$ZPQ0X
74 push pull converter 推挽转换器 f"zXiUV
75 ramp down 斜降 CfKvC
76 ramp up 斜升 bI
3o|
77 redundant diode 冗余二极管 6]yYiz2Xn
78 resistive divider 电阻分压器 FUic7>
79 ringing 振 铃 ufE;rcYE
80 ripple current 纹波电流 .5*h']iFr1
81 rising edge 上升沿 *HFRG)[V
82 sense resistor 检测电阻 `9BZ))Pg
83 Sequenced Power Supplys 序列电源 -&JUg
o=
84 shoot-through 直通,同时导通 K,{P
b?
85 stray inductances. 杂散电感 +G';no\h
86 sub-circuit 子电路 U}ei2q\
87 substrate 基板 duCxYhh|
88 Telecom 电信 #~l(t_m{
89 Thermal Information 热性能信息 u}ULb F
90 thermal slug 散热片 9P;}P!W
91 Threshold 阈值 &~of]A
92 timing resistor 振荡电阻 N t]YhO
93 Top FET Top FET r>4HF"Nm
94 Trace 线路,走线,引线 YqhZndktX
95 Transfer function 传递函数 o2
96 Trip Point 跳变点 ]n9o=^q/
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) DPCB=2E
98 Under Voltage Lock Out (UVLO) 欠压锁定 J jRz<T;
99 Voltage Reference 电压参考 #@s[!4)_I
100 voltage-second product 伏秒积 n1+1/
101 zero-pole frequency compensation 零极点频率补偿 -`nQa$N-
102 beat frequency 拍频 .{[+d3+,
103 one shots 单击电路 (}ObX!,
104 scaling 缩放 .)L%ANf
105 ESR 等效串联电阻 [Page] "mlVs/nsyG
106 Ground 地电位 &)[?D<
107 trimmed bandgap 平衡带隙 ~d]X@(G&
108 dropout voltage 压差 {cmY`to
109 large bulk capacitance 大容量电容 UnSi= uj
110 circuit breaker 断路器 "M#A `b
111 charge pump 电荷泵 {j$ :9 H
112 overshoot 过冲 t5:
1' N9P
LpCJfQ
印制电路printed circuit {nvF>
印制线路 printed wiring 'sb&xj`d
印制板 printed board @r7ekyO8)
印制板电路 printed circuit board .SZ ZT0Z
印制线路板 printed wiring board Jbv66)0M
印制元件 printed component f793yCiG
印制接点 printed contact L'(ei7Z
印制板装配 printed board assembly F/gA[Y|,gI
板 board 8t)5b.PS
刚性印制板 rigid printed board ?8AV-rRX
挠性印制电路 flexible printed circuit |^l17veA@
挠性印制线路 flexible printed wiring HRQ3v`P.
齐平印制板 flush printed board {}gx;v)
金属芯印制板 metal core printed board JZ=ahSi
金属基印制板 metal base printed board 2F5*C
多重布线印制板 mulit-wiring printed board jQ>~
塑电路板 molded circuit board :g&9v_}&K{
散线印制板 discrete wiring board \
@XvEx%
微线印制板 micro wire board }eKY%WU>O
积层印制板 buile-up printed board qPal'c0
表面层合电路板 surface laminar circuit g$X4ZRSel
埋入凸块连印制板 B2it printed board Z`jc*jgy
载芯片板 chip on board d\eTyN'rA
埋电阻板 buried resistance board M N-j$-y}
母板 mother board
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子板 daughter board \%],pZsA ~
背板 backplane =:neGqd\_E
裸板 bare board %=w@c
键盘板夹心板 copper-invar-copper board 9):h
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动态挠性板 dynamic flex board <!qN<#$y
静态挠性板 static flex board IOL5p*:gz
可断拼板 break-away planel 4Nylc.2mi
电缆 cable M~h^~:Lk
挠性扁平电缆 flexible flat cable (FFC) ]2zzY::Sd=
薄膜开关 membrane switch 9Rf})$o+
混合电路 hybrid circuit \eH`{Z'.x5
厚膜 thick film %Z.!T
厚膜电路 thick film circuit M\m6|P
薄膜 thin film 5vP=Wf cW
薄膜混合电路 thin film hybrid circuit ,F;<Y9]
互连 interconnection (~k{aO
导线 conductor trace line c]Z@L~WW
齐平导线 flush conductor @#u'z~a)
传输线 transmission line $M:Ru@Du2
跨交 crossover %[l#S*)~
板边插头 edge-board contact itU
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增强板 stiffener RyuI2jEy
基底 substrate "gIjU~'A
基板面 real estate vV$6fvS
导线面 conductor side =|j~*6Hd
元件面 component side
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焊接面 solder side pw,
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导电图形 conductive pattern [}*xxy
非导电图形 non-conductive pattern B5R/GV
基材 base material S\jIs [Dz
层压板 laminate ABG>W>H-S
覆金属箔基材 metal-clad bade material x<=<Lx0B;
覆铜箔层压板 copper-clad laminate (CCL) (_ TKDx_
复合层压板 composite laminate "e ;wN3/bF
薄层压板 thin laminate WHk rd8
基体材料 basis material C@F3iwTtp
预浸材料 prepreg c}u`L6!I3
粘结片 bonding sheet f53WDI6
预浸粘结片 preimpregnated bonding sheer ^630%YO
环氧玻璃基板 epoxy glass substrate FfSKE
预制内层覆箔板 mass lamination panel ?S2!'L
内层芯板 core material >|W\8dTQ
粘结层 bonding layer cedH#;V!j
粘结膜 film adhesive w8KVs\/
无支撑胶粘剂膜 unsupported adhesive film
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覆盖层 cover layer (cover lay) g[D`.
增强板材 stiffener material X/AA8QV o
铜箔面 copper-clad surface oMV^W^<
去铜箔面 foil removal surface
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层压板面 unclad laminate surface w+Oo-AGNH
基膜面 base film surface gPf^dGi7t
胶粘剂面 adhesive faec 8]2j*e0xV
原始光洁面 plate finish Y'9<fSn5&
粗面 matt finish d>bS)
剪切板 cut to size panel ,\CG}-v@CN
超薄型层压板 ultra thin laminate p+.{"%
A阶树脂 A-stage resin dk@j!-q^
B阶树脂 B-stage resin ];U}'&
C阶树脂 C-stage resin iosL&*'8
环氧树脂 epoxy resin sqjv3=}
酚醛树脂 phenolic resin Xhk_h2F[
聚酯树脂 polyester resin PvkHlb^x%
聚酰亚胺树脂 polyimide resin o4d[LV4DS
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin r$/.x6g//
丙烯酸树脂 acrylic resin S!{Kn ;@
三聚氰胺甲醛树脂 melamine formaldehyde resin fs3jPHZJ#
多官能环氧树脂 polyfunctional epoxy resin <pp<%~_Z
溴化环氧树脂 brominated epoxy resin Y)KO*40c
环氧酚醛 epoxy novolac iTpK:pX
氟树脂 fluroresin RI0+9YJ
硅树脂 silicone resin =7P(T`j
硅烷 silane `7o(CcF6H
聚合物 polymer ?cmv;KV
无定形聚合物 amorphous polymer lKA2~ o
结晶现象 crystalline polamer >G<.^~o
双晶现象 dimorphism eGW~4zU
共聚物 copolymer /sa\Ze;E
合成树脂 synthetic R3!3TJ
热固性树脂 thermosetting resin [Page] 6JZ$;x{j
热塑性树脂 thermoplastic resin "PtOe[Xk
感光性树脂 photosensitive resin f^D4aEU
环氧值 epoxy value $/XR/
双氰胺 dicyandiamide Yv7`5b{N.
粘结剂 binder r<XlIi
胶粘剂 adesive AOVoOd+6
固化剂 curing agent {WYmO1
阻燃剂 flame retardant L|pJ\~
遮光剂 opaquer EC0M0qQ
增塑剂 plasticizers v>]^wH>/"
不饱和聚酯 unsatuiated polyester eF%IX
聚酯薄膜 polyester p}{V%!`_
聚酰亚胺薄膜 polyimide film (PI) J6m(\o
聚四氟乙烯 polytetrafluoetylene (PTFE) n?z^"vv$i
增强材料 reinforcing material % m0x]
折痕 crease =S|^pN
云织 waviness VjhwafYC
鱼眼 fish eye V9r58hbVT
毛圈长 feather length 1WbawiG}
厚薄段 mark K-f\nr
裂缝 split %\n&iRwDF
捻度 twist of yarn u,Rhm-`
浸润剂含量 size content e) x;3r"j
浸润剂残留量 size residue ;rJ
处理剂含量 finish level D |BP]j}6
偶联剂 couplint agent AG==A&d>$
断裂长 breaking length eOI#T'5
吸水高度 height of capillary rise Q`4]\)Dp
湿强度保留率 wet strength retention x[i Et%_
白度 whitenness 8G0DuMI5
导电箔 conductive foil DZ9qIc}Y
铜箔 copper foil TPeBb8v8D
压延铜箔 rolled copper foil ~RS^Opoa
光面 shiny side avI
粗糙面 matte side ^68BxYUoD\
处理面 treated side 6opubI<
防锈处理 stain proofing =P"Sm
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双面处理铜箔 double treated foil 05>xQx?"m4
模拟 simulation `'^&*
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逻辑模拟 logic simulation >|e>=
电路模拟 circit simulation 7L=V{,,v
时序模拟 timing simulation .Iret:
模块化 modularization UIl^s8/
设计原点 design origin :/
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优化(设计) optimization (design) >5|;8v-r
供设计优化坐标轴 predominant axis VSI.c`=,
表格原点 table origin M+N7JpR
元件安置 component positioning ;<yVJox
比例因子 scaling factor 95G*i;E
扫描填充 scan filling ZdJer6:Z}
矩形填充 rectangle filling RL;>1Q,H
填充域 region filling s`$px2Gw
实体设计 physical design &_!g|-
逻辑设计 logic design ;%R+]&J
逻辑电路 logic circuit Cq0S8Or0
层次设计 hierarchical design tR]1c
自顶向下设计 top-down design h""a#n)q}`
自底向上设计 bottom-up design K)`\u7Bu
费用矩阵 cost metrix &$?i
元件密度 component density Y_)aoRjB
自由度 degrees freedom ?+bDFM}
出度 out going degree pSq3\#Twr
入度 incoming degree CbA2?( 1o1
曼哈顿距离 manhatton distance sO!YM5v8
欧几里德距离 euclidean distance Ye8&cZ*.
网络 network *<**rY*
阵列 array ]o(&J7Z6-
段 segment mmVx',k
逻辑 logic X%1fMC
逻辑设计自动化 logic design automation F<UEipe/N
分线 separated time fi[c^e+IX
分层 separated layer k_=~ObA$g
定顺序 definite sequence fDdTs@)6
导线(通道) conduction (track) tN5brf
导线(体)宽度 conductor width rX%qWhiEJ
导线距离 conductor spacing 1MV\
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导线层 conductor layer kd9GHN;7
导线宽度/间距 conductor line/space "$Wi SR
第一导线层 conductor layer No.1 jaAv_=93f
圆形盘 round pad jG3}V3|.
方形盘 square pad 2wWL]`(E
菱形盘 diamond pad +McKyEa
长方形焊盘 oblong pad I
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子弹形盘 bullet pad %^l77:O
泪滴盘 teardrop pad Cl;B%5yl
雪人盘 snowman pad xy%lp{
形盘 V-shaped pad V u_o>v{&i
环形盘 annular pad /
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非圆形盘 non-circular pad nFl=D=50-
隔离盘 isolation pad fuQ|[tpvQG
非功能连接盘 monfunctional pad .,K?(O4AY
偏置连接盘 offset land 6dh@DG*k
腹(背)裸盘 back-bard land xw5E!]~D
盘址 anchoring spaur #N|)hBz9-
连接盘图形 land pattern 6 qK0G$>
连接盘网格阵列 land grid array U4_<
孔环 annular ring '"5"$)7
元件孔 component hole \<VwGbzFi
安装孔 mounting hole P'D~Y#^
支撑孔 supported hole <