1 backplane 背板 |'" 17c&
2 Band gap voltage reference 带隙电压参考 ^ H )nQ
3 benchtop supply 工作台电源 Zr
U9oy&!C
4 Block Diagram 方块图 5 Bode Plot 波特图 gV-x1s+
6 Bootstrap 自举 X=U >r
7 Bottom FET Bottom FET s#*T(pY
8 bucket capcitor 桶形电容 lyYi2& %
9 chassis 机架 BQTibd
10 Combi-sense Combi-sense mcB8xE
11 constant current source 恒流源 2IGoAt>V
12 Core Sataration 铁芯饱和 ohPCYt
13 crossover frequency 交叉频率 quEP"
14 current ripple 纹波电流 /degBL+
15 Cycle by Cycle 逐周期 IxQ(g#sj_k
16 cycle skipping 周期跳步 a.O pxd
17 Dead Time 死区时间 xOAA1#
18 DIE Temperature 核心温度 jx7b$x]
19 Disable 非使能,无效,禁用,关断
|q:p^;x
20 dominant pole 主极点 >|S&@<
21 Enable 使能,有效,启用 cB ,l=/?
22 ESD Rating ESD额定值 [)E.T,fjMQ
23 Evaluation Board 评估板 9< $n'g
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. B<p -.tv
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 1ae,s{|
25 Failling edge 下降沿 y$7vJl.uS/
26 figure of merit 品质因数 yaD_c;
27 float charge voltage 浮充电压 BD(Y=g
28 flyback power stage 反驰式功率级 |{a`,%mw
29 forward voltage drop 前向压降 QxaW
x
30 free-running 自由运行 m\hzQ9
31 Freewheel diode 续流二极管 Wu!s
32 Full load 满负载 33 gate drive 栅极驱动 %Ct^{k~1
34 gate drive stage 栅极驱动级 R
rtr\a
35 gerber plot Gerber 图 5UgxuuP4
36 ground plane 接地层 P wY~L3,
37 Henry 电感单位:亨利 bkvm-$/
38 Human Body Model 人体模式 K_" denzT+
39 Hysteresis 滞回 =5v=<, ]
40 inrush current 涌入电流 T|o ]8z
41 Inverting 反相 $xK2M
42 jittery 抖动 "nzQ$E>?$
43 Junction 结点 +[R,wsG
44 Kelvin connection 开尔文连接 -szSA
45 Lead Frame 引脚框架 `v|w&ty*
46 Lead Free 无铅 B,_/'DneQK
47 level-shift 电平移动 m);0sb
48 Line regulation 电源调整率 {|E'
49 load regulation 负载调整率 \@}G'7{
50 Lot Number 批号 Mkj`
51 Low Dropout 低压差 K|{IX^3)V
52 Miller 密勒 53 node 节点 @5rl;C
54 Non-Inverting 非反相 djk?;^8
55 novel 新颖的 D["~G v
56 off state 关断状态 RI[=N:C^
57 Operating supply voltage 电源工作电压 .T63:
58 out drive stage 输出驱动级 aJ{-m@/5
59 Out of Phase 异相 $\w<.)"#
60 Part Number 产品型号 S#{jyU9 ]
61 pass transistor pass transistor +}.~"
62 P-channel MOSFET P沟道MOSFET ZR,"w
63 Phase margin 相位裕度 i eL7jN,'m
64 Phase Node 开关节点 i0TbsoKh:
65 portable electronics 便携式电子设备 %2;Nj;
J$
66 power down 掉电 5{"v/nXV
67 Power Good 电源正常 [XKudw%
68 Power Groud 功率地 Xv&&U@7
69 Power Save Mode 节电模式 <l.l6okp
70 Power up 上电 %6%~`((4
71 pull down 下拉 V`WSZ
72 pull up 上拉
L* 0$x
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) `B A'a" $
74 push pull converter 推挽转换器 u^4$<fd
75 ramp down 斜降 sc0.!6^'V
76 ramp up 斜升 sy]hMGH:3W
77 redundant diode 冗余二极管 7G\a5
78 resistive divider 电阻分压器 E
xls_oSp
79 ringing 振 铃 !S3^{l-
80 ripple current 纹波电流 zzH^xxg
81 rising edge 上升沿 v:1DNR4
82 sense resistor 检测电阻 z|$M,?r'
83 Sequenced Power Supplys 序列电源 )yt_i'D}
84 shoot-through 直通,同时导通 @"G+kLv0
85 stray inductances. 杂散电感 GiK4LJ~cH)
86 sub-circuit 子电路 Vm*E^ v
87 substrate 基板 o}p^q:T*
88 Telecom 电信 gWu<5Y=C
89 Thermal Information 热性能信息 E Xxv
90 thermal slug 散热片 qN"Q3mU^h*
91 Threshold 阈值 WqJrDj~
92 timing resistor 振荡电阻 Z_h-5VU-
93 Top FET Top FET >\o._?xSA
94 Trace 线路,走线,引线 xep8CimP'
95 Transfer function 传递函数 fpa~~E-
96 Trip Point 跳变点 h.*v0cq:
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ]<*-pRN
98 Under Voltage Lock Out (UVLO) 欠压锁定 !kS/Ei
99 Voltage Reference 电压参考 @Cml^v@`L
100 voltage-second product 伏秒积 r,HIoeAKP
101 zero-pole frequency compensation 零极点频率补偿 srQGqE~
102 beat frequency 拍频 b]b+PK*h
103 one shots 单击电路 &"?S0S>r!
104 scaling 缩放 &<LBz|
105 ESR 等效串联电阻 [Page] &\y`9QpVF
106 Ground 地电位 dSI<s^n
107 trimmed bandgap 平衡带隙 1N}vz(0"
108 dropout voltage 压差 kW7$Gw]-
109 large bulk capacitance 大容量电容 \2^o,1r/
110 circuit breaker 断路器 b+CJRB1
111 charge pump 电荷泵 5HaI$>h6
112 overshoot 过冲 ifcp!l+8
'.wb= C
印制电路printed circuit L++qMRk9
印制线路 printed wiring &/n*>%2
印制板 printed board {e5DQ 21.
印制板电路 printed circuit board Sh2BU3
印制线路板 printed wiring board ,`bmue5
印制元件 printed component [w90gp1O[
印制接点 printed contact Za,myuI+
印制板装配 printed board assembly suS[P?4
板 board DNr*|A2<
刚性印制板 rigid printed board j5[Y0)pV\
挠性印制电路 flexible printed circuit O6ph_$nt.
挠性印制线路 flexible printed wiring Q5b9q$L$
齐平印制板 flush printed board q
BIekQT
金属芯印制板 metal core printed board ed2r<H$
金属基印制板 metal base printed board S Rk%BJ? ~
多重布线印制板 mulit-wiring printed board pm=m~
塑电路板 molded circuit board guG&3{&\s
散线印制板 discrete wiring board l8khu)\n4R
微线印制板 micro wire board -xG6J.S
积层印制板 buile-up printed board G
c\^Kg^#
表面层合电路板 surface laminar circuit wn;)La
埋入凸块连印制板 B2it printed board Qvty;2$o@
载芯片板 chip on board -p?&vQDo`
埋电阻板 buried resistance board Sn0kJIb
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母板 mother board o*Xfgc
子板 daughter board p|(SR~;6
背板 backplane _RIlGs\.
裸板 bare board ps;d bY*s6
键盘板夹心板 copper-invar-copper board XF+4*),
动态挠性板 dynamic flex board eyuyaSE
静态挠性板 static flex board ^ |SiqE
可断拼板 break-away planel dr(-k3ex
电缆 cable ;NH^+h
挠性扁平电缆 flexible flat cable (FFC) ?;_*8Doq-a
薄膜开关 membrane switch 3vKTCHbk9
混合电路 hybrid circuit b50mMWtG
厚膜 thick film 4BSqL!i(
厚膜电路 thick film circuit 2kt0Rxg
薄膜 thin film x5CMP%}d
薄膜混合电路 thin film hybrid circuit u>]3?ty`
互连 interconnection tS>^x
导线 conductor trace line |lcp
(u*u
齐平导线 flush conductor DR{O.TX
传输线 transmission line `KN>0R2k
跨交 crossover F(#?-MCs
板边插头 edge-board contact KzP{bK5/
增强板 stiffener Gx8!AmeX
基底 substrate YVwpqOE.=
基板面 real estate 33EF/k3vW
导线面 conductor side l -xc*lC
元件面 component side cFt&E