1 backplane 背板 x,]x>Up
2 Band gap voltage reference 带隙电压参考 JqZt1um
3 benchtop supply 工作台电源 d(TN(6g@
4 Block Diagram 方块图 5 Bode Plot 波特图 L\UGC%]9
6 Bootstrap 自举 WcoA)we
7 Bottom FET Bottom FET 4L ]4WVc
8 bucket capcitor 桶形电容 ~CbiKez
9 chassis 机架 xr]bH.>
10 Combi-sense Combi-sense @eeI4Jz
11 constant current source 恒流源 gzn:]Y^
12 Core Sataration 铁芯饱和 LU+SuVm
13 crossover frequency 交叉频率 8h }a:/
14 current ripple 纹波电流 dKCl#~LAI'
15 Cycle by Cycle 逐周期 "uT2 DY[
16 cycle skipping 周期跳步 _z8"r&
17 Dead Time 死区时间 RXg\A!5GV
18 DIE Temperature 核心温度 M2p|&Z%
19 Disable 非使能,无效,禁用,关断 88,hza`#V
20 dominant pole 主极点 3<"j/9;K'
21 Enable 使能,有效,启用 az:}RE3o
22 ESD Rating ESD额定值 S{N4[U?V>
23 Evaluation Board 评估板 0kj5r*qA
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. sS;)d
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 Sn4xv2/
25 Failling edge 下降沿 y6tqemz
26 figure of merit 品质因数 J`)/\9'&&
27 float charge voltage 浮充电压 iu(obmh/o
28 flyback power stage 反驰式功率级 .?5
~zK
29 forward voltage drop 前向压降 J$42*S Y
30 free-running 自由运行
[?|yQ x
31 Freewheel diode 续流二极管 r7g@(K
32 Full load 满负载 33 gate drive 栅极驱动 :wXiz`VH
34 gate drive stage 栅极驱动级 EyVu-4L:#
35 gerber plot Gerber 图 0)g]pG8&ro
36 ground plane 接地层 fdX|t"oz
37 Henry 电感单位:亨利 0m]QQGvJ{
38 Human Body Model 人体模式 t0e5L{ QJ
39 Hysteresis 滞回 dm[cl~[
Q
40 inrush current 涌入电流 2ua!<^,
41 Inverting 反相 <mlN\BcX;
42 jittery 抖动 {6 h 1
43 Junction 结点 L(K 5f7\
44 Kelvin connection 开尔文连接 tc[Ld#
45 Lead Frame 引脚框架 VBPtM{g
46 Lead Free 无铅 ,cS#
47 level-shift 电平移动 9x!kvB6
48 Line regulation 电源调整率 CEkUXsp
49 load regulation 负载调整率 mz%l4w?'
50 Lot Number 批号 4-SU\_
51 Low Dropout 低压差 1uN;JN
`_
52 Miller 密勒 53 node 节点 AVw oOvJ
54 Non-Inverting 非反相 .O'~s/h
55 novel 新颖的 }Vob)r{R@
56 off state 关断状态 L~{(9J'(
57 Operating supply voltage 电源工作电压 zps=~|
58 out drive stage 输出驱动级 n
nAtXVy
59 Out of Phase 异相 ]?H12xz
60 Part Number 产品型号 Q"~%T@e
61 pass transistor pass transistor au+Jz_$)
62 P-channel MOSFET P沟道MOSFET XXn3K BIf
63 Phase margin 相位裕度 >I5Wf/$
64 Phase Node 开关节点 ]tT=jN&(
65 portable electronics 便携式电子设备 LYL_Ah'=
66 power down 掉电 ; 8DtnnE
67 Power Good 电源正常 0+op|bdj
68 Power Groud 功率地 `r-Jy{!y4
69 Power Save Mode 节电模式 F7O*%y.';
70 Power up 上电 8)?&eE'
71 pull down 下拉 CF','gPnc
72 pull up 上拉 48^C+#Jbc
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 4GF3.?3
74 push pull converter 推挽转换器 D!Y@Og.
75 ramp down 斜降 \3^V-/SJf
76 ramp up 斜升 i&lW&]
77 redundant diode 冗余二极管 +@!\3a4!
78 resistive divider 电阻分压器 y7:f^4
79 ringing 振 铃 L-E?1qhP>
80 ripple current 纹波电流 j>;1jzr2}
81 rising edge 上升沿 FWW@t1)
82 sense resistor 检测电阻 G\MeJSt*
83 Sequenced Power Supplys 序列电源 N}%AUm/L
84 shoot-through 直通,同时导通 K)
85 stray inductances. 杂散电感 8%u|[Si;
86 sub-circuit 子电路 /{hT3ncb
87 substrate 基板 +g7]ga
88 Telecom 电信 S@3`H8 [
89 Thermal Information 热性能信息 GB}\ 7a
90 thermal slug 散热片 _F[a2PE2+
91 Threshold 阈值 ww7nQ}H5(
92 timing resistor 振荡电阻 AN:s%w2
93 Top FET Top FET UW8yu.`?
94 Trace 线路,走线,引线 2;>uP#1]
95 Transfer function 传递函数 .wq
j
96 Trip Point 跳变点 B,_K mHItd
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 5EQ)pH+
98 Under Voltage Lock Out (UVLO) 欠压锁定 D=z="p\
99 Voltage Reference 电压参考 M0lJyzJ
100 voltage-second product 伏秒积 E"p _!!1
101 zero-pole frequency compensation 零极点频率补偿 "}1cQ|0a
102 beat frequency 拍频 dF 6od
103 one shots 单击电路 -f ~1Id
104 scaling 缩放 s?m_zJh
105 ESR 等效串联电阻 [Page] ,N,@9p
106 Ground 地电位 \F`>zY2$%
107 trimmed bandgap 平衡带隙 |pBFmm*
108 dropout voltage 压差 r vq{Dfo=
109 large bulk capacitance 大容量电容 m%})H"5
110 circuit breaker 断路器 m?yztm~u
111 charge pump 电荷泵 HxW/t7Z(
112 overshoot 过冲 P3W3+pwq
s 7wA3|9
印制电路printed circuit Q~ Ad{yC
印制线路 printed wiring G7`mK}J7
印制板 printed board l$j~p=S$F
印制板电路 printed circuit board Tf!6N<dRXR
印制线路板 printed wiring board @8m%*pBg
印制元件 printed component %7`eT^
印制接点 printed contact <m~8pM
印制板装配 printed board assembly MHt
~ZVH
板 board "2-D[rYZ
刚性印制板 rigid printed board !mqIq}h
挠性印制电路 flexible printed circuit 2^`k6V!
挠性印制线路 flexible printed wiring ._j?1Fw`
齐平印制板 flush printed board lY@2$q9BT
金属芯印制板 metal core printed board /mp!%j~
金属基印制板 metal base printed board gV9bt~
多重布线印制板 mulit-wiring printed board 2 f%+1uU
塑电路板 molded circuit board >#&2 5,Q
散线印制板 discrete wiring board n05GM.|*s
微线印制板 micro wire board NpM;vO
积层印制板 buile-up printed board KwaxNb5
表面层合电路板 surface laminar circuit 0S>L0qp
埋入凸块连印制板 B2it printed board YR/I<m`]}
载芯片板 chip on board !PeSnO
埋电阻板 buried resistance board YW~ 9 N
母板 mother board di+|` O
子板 daughter board 9^H.[t
背板 backplane LcA7f'GVK
裸板 bare board A2L"&dl
键盘板夹心板 copper-invar-copper board B0Z>di:
动态挠性板 dynamic flex board x<rS2d-Y
静态挠性板 static flex board lcEK&AtK
可断拼板 break-away planel ]gnEo.R
电缆 cable j-"34
挠性扁平电缆 flexible flat cable (FFC) M6A0D+08
薄膜开关 membrane switch iyR"O1]
混合电路 hybrid circuit G `3{Q7k
厚膜 thick film ci2Z_JA+
厚膜电路 thick film circuit SvkCx>6/G
薄膜 thin film B:UM2Jl
薄膜混合电路 thin film hybrid circuit yDZm)|<.
互连 interconnection
O<|pw
导线 conductor trace line IaOR%Bg
齐平导线 flush conductor m:0[as=
传输线 transmission line s~>1TxJe
跨交 crossover 0k5 uqGLXe
板边插头 edge-board contact ]n"RPktx
增强板 stiffener ;-"q;&1e
基底 substrate
tKh
基板面 real estate 2v@B7r4}
导线面 conductor side L[nDjQn"
元件面 component side m`$Q/SyvG
焊接面 solder side n`w]? bL
导电图形 conductive pattern n q>F_h
非导电图形 non-conductive pattern 6yAZvX
基材 base material ~UeTV?)
层压板 laminate I][&*V1
覆金属箔基材 metal-clad bade material [7r^fD
A
覆铜箔层压板 copper-clad laminate (CCL) |dqESl,2
复合层压板 composite laminate [iO8R-N8d
薄层压板 thin laminate o6~JAvw
基体材料 basis material 0nkC%j
预浸材料 prepreg I#;dS!W"'
粘结片 bonding sheet [~\]<;;\
预浸粘结片 preimpregnated bonding sheer Z.Dg=>G]
环氧玻璃基板 epoxy glass substrate %*Mr ^=
预制内层覆箔板 mass lamination panel ~G=E
Q]a
内层芯板 core material eYlI };
粘结层 bonding layer id8QagJ
粘结膜 film adhesive xb0,dZb
无支撑胶粘剂膜 unsupported adhesive film .<fdX()e,
覆盖层 cover layer (cover lay) bnanTH9-
增强板材 stiffener material ?mK&Slh.
铜箔面 copper-clad surface O(=9&PRi
去铜箔面 foil removal surface o^"OKHU,S0
层压板面 unclad laminate surface +Q);t,
基膜面 base film surface kF,ME5%
胶粘剂面 adhesive faec $- %um
原始光洁面 plate finish ]63!
Wc
粗面 matt finish =6=:OId
剪切板 cut to size panel yk5K8D[tV
超薄型层压板 ultra thin laminate
$X/'BCb
A阶树脂 A-stage resin +%K~
B阶树脂 B-stage resin XSK<hr0m
C阶树脂 C-stage resin 0#uB[N
环氧树脂 epoxy resin =23@"ji@D
酚醛树脂 phenolic resin +U_1B%e(%
聚酯树脂 polyester resin A! HJ
聚酰亚胺树脂 polyimide resin M&faa7
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin I"3C/ pU2
丙烯酸树脂 acrylic resin puWMgvv
三聚氰胺甲醛树脂 melamine formaldehyde resin SVd@-
'-K
多官能环氧树脂 polyfunctional epoxy resin QE)zH)(
溴化环氧树脂 brominated epoxy resin , u%V%
环氧酚醛 epoxy novolac OyK#Rm2A=
氟树脂 fluroresin z8{-I@+`
硅树脂 silicone resin ZbdGI@
硅烷 silane w3>11bE
聚合物 polymer UyV5A
无定形聚合物 amorphous polymer O
j:I @c
结晶现象 crystalline polamer tH
*|
双晶现象 dimorphism oCI\yp@a
共聚物 copolymer GU@#\3
合成树脂 synthetic q%$p56\?3
热固性树脂 thermosetting resin [Page] =VZ_';b h
热塑性树脂 thermoplastic resin ?(K=du
感光性树脂 photosensitive resin q<z8P;oP^
环氧值 epoxy value ^QJJ2 jZ
双氰胺 dicyandiamide Tt{z_gU6
粘结剂 binder 3^y<Db
胶粘剂 adesive Xa?igbgAwx
固化剂 curing agent q6nRk~
阻燃剂 flame retardant 0hGmOUO
遮光剂 opaquer ?fq!BV
增塑剂 plasticizers W,CAg7:*
不饱和聚酯 unsatuiated polyester /w5*R5B{
聚酯薄膜 polyester oS9Od8
聚酰亚胺薄膜 polyimide film (PI) LK}FI*A_
聚四氟乙烯 polytetrafluoetylene (PTFE) >,3 uu}s
增强材料 reinforcing material `Z5dRLrd
折痕 crease s>L.V2!$0
云织 waviness &V<f;PF(I
鱼眼 fish eye S1y6G/e9
毛圈长 feather length N_iy4W(NU
厚薄段 mark wi
jO2F
裂缝 split MO7R3PP
捻度 twist of yarn vBF9!6X .
浸润剂含量 size content WR"1d\m:
浸润剂残留量 size residue xYYa%PhIC
处理剂含量 finish level 0^uUt-
偶联剂 couplint agent L;j++^p
断裂长 breaking length Lkx~>U
吸水高度 height of capillary rise +> !nqp
湿强度保留率 wet strength retention C<(oaeQY
白度 whitenness \({'Xo >(
导电箔 conductive foil #m?)XB^_
铜箔 copper foil >jIn&s!}
压延铜箔 rolled copper foil W9tZX5V1
光面 shiny side "zd_eC5
粗糙面 matte side kVKAG\F
处理面 treated side rg >2tgA
防锈处理 stain proofing ! {G0'
双面处理铜箔 double treated foil 0^o/cSF
模拟 simulation
C&vi7Yx
逻辑模拟 logic simulation 457{9k
电路模拟 circit simulation 0D@ $
时序模拟 timing simulation t $Rc
0
模块化 modularization ]2)A/fOW
设计原点 design origin Bz-jy.
优化(设计) optimization (design) -XCs?@8EQ
供设计优化坐标轴 predominant axis |%XTy7^a
表格原点 table origin MSvZ3[5Io
元件安置 component positioning .|R4E
比例因子 scaling factor ws!~MSIy
扫描填充 scan filling hPBBXj/=
矩形填充 rectangle filling 1a{r1([)
填充域 region filling At=d//5FFP
实体设计 physical design
0]c&K
逻辑设计 logic design x@rQ7K>
逻辑电路 logic circuit W>d)(
层次设计 hierarchical design 04;s@\yX4
自顶向下设计 top-down design
-NN=(p!<
自底向上设计 bottom-up design
&Q?@VNi
费用矩阵 cost metrix wxh\CBxG
元件密度 component density MAFdJ+n#
自由度 degrees freedom @g5y_G{SP
出度 out going degree xLoQ0rt
6
入度 incoming degree 0,ryy,2
曼哈顿距离 manhatton distance ,jis@]:
欧几里德距离 euclidean distance Y 2ANt w@
网络 network |JYb4J4Ni
阵列 array 9N9&y^SmD
段 segment #d\&6'O
逻辑 logic naf ~#==vc
逻辑设计自动化 logic design automation 9_:"`)]3B
分线 separated time bT2G
G
分层 separated layer S5TVfV5LI
定顺序 definite sequence ~>=.^
导线(通道) conduction (track) ,*6K3/kW
导线(体)宽度 conductor width /CsP@f_Gw
导线距离 conductor spacing Vl5>o$G|<.
导线层 conductor layer \M\7k5$
导线宽度/间距 conductor line/space 3jxC}xz)
第一导线层 conductor layer No.1 9!Mh(KtQ
圆形盘 round pad &F~d~;G"q
方形盘 square pad nI6ompTX
菱形盘 diamond pad Zhfg
长方形焊盘 oblong pad <5z!0m-G
子弹形盘 bullet pad Io3-\Ff
泪滴盘 teardrop pad [d[w/@
雪人盘 snowman pad VM\R-[
形盘 V-shaped pad V d%'#-w'
环形盘 annular pad lY
tt|J
非圆形盘 non-circular pad -GPBX?
隔离盘 isolation pad @L!^2v
非功能连接盘 monfunctional pad 8~C}0H
偏置连接盘 offset land ftPps-
腹(背)裸盘 back-bard land Yt(FSb31H
盘址 anchoring spaur !s=$UC
连接盘图形 land pattern 15j5F5P
连接盘网格阵列 land grid array %BkE %ZcZ
孔环 annular ring L4/ns@e
元件孔 component hole X#$ oV#
安装孔 mounting hole ?(=|!`IoO
支撑孔 supported hole apa&'%7
非支撑孔 unsupported hole 9#:nlu9
导通孔 via M+
%O-B
镀通孔 plated through hole (PTH) WkA47+DsV
余隙孔 access hole ?Xypn#OPt
盲孔 blind via (hole) 9t\14tVwx
埋孔 buried via hole \T_ZcV
埋,盲孔 buried blind via BNdq=|,+"
任意层内部导通孔 any layer inner via hole |cY HH$
全部钻孔 all drilled hole Ln,<|,fZN
定位孔 toaling hole # atq7tX
无连接盘孔 landless hole cDz@3So.b
中间孔 interstitial hole !FP ]
无连接盘导通孔 landless via hole $mM"C+dD
引导孔 pilot hole /8qR7Z^HZ
端接全隙孔 terminal clearomee hole _D4qnb@
准尺寸孔 dimensioned hole [Page] '/HShS!d
在连接盘中导通孔 via-in-pad L.@$rFhA
孔位 hole location c2g[w;0"
孔密度 hole density Q;3`T7
孔图 hole pattern fKY-@B[|
钻孔图 drill drawing WMtFXkf6"
装配图assembly drawing /(s |'"6
参考基准 datum referan PM84Z@Y
1) 元件设备 *bFWNJ}`q
)4uWB2ZRoi
三绕组变压器:three-column transformer ThrClnTrans lF(v<drkB
双绕组变压器:double-column transformer DblClmnTrans qA7,txQ:
电容器:Capacitor 7/<~s]D[%
并联电容器:shunt capacitor p+=zl`\=|
电抗器:Reactor tjtvO@?1-
母线:Busbar R5=J :o
输电线:TransmissionLine (9%?ik
发电厂:power plant g]&fyB#
断路器:Breaker [ ft6xI
刀闸(隔离开关):Isolator ~Re4zU
分接头:tap $||WI}k3V
电动机:motor Y[7prjd
(2) 状态参数 ),N,!15j,
q("XS
有功:active power KU$,{Sn6@
无功:reactive power 4Px|:7~wT8
电流:current i.6 b%
容量:capacity G$Mf(S'f
电压:voltage !8UIyw
档位:tap position GZaB z#U
有功损耗:reactive loss %l&oRBC
无功损耗:active loss }TMO>eB'
功率因数:power-factor y$7Ys:R~
功率:power >A{Dpsi\
功角:power-angle UeFJ5n'x:
电压等级:voltage grade ^?Xs!kJP
空载损耗:no-load loss [G8EX3
铁损:iron loss $Be hU
铜损:copper loss +&u/R')?6r
空载电流:no-load current "W+>?u )
阻抗:impedance y_L8i[
正序阻抗:positive sequence impedance Ich^*z(F$
负序阻抗:negative sequence impedance Wx-0Ip'9
零序阻抗:zero sequence impedance o
A2oX
电阻:resistor }6a}8EyFP
电抗:reactance k#pO+[ x
电导:conductance o7E|wS
电纳:susceptance vai w*?jV
无功负载:reactive load 或者QLoad B\R X
有功负载: active load PLoad 8zeeC
eI U
遥测:YC(telemetering) z**2-4 z
遥信:YX =At" Q6-O
励磁电流(转子电流):magnetizing current FLG"c690
定子:stator T=YVG@fm?
功角:power-angle P x Q] $w
上限:upper limit &X:;B'
下限:lower limit }h Wv
p
并列的:apposable grE(8M
高压: high voltage OcV,pJ
低压:low voltage $$ *tK8#
中压:middle voltage >(P(!^[f
电力系统 power system HUjX[w8
发电机 generator 9Zd\6F,
励磁 excitation oQ-m
励磁器 excitor w.58=Pr
电压 voltage r}qDvC D
电流 current NUVKAAgMX
母线 bus AJB
NM
变压器 transformer ^X{U7?x
升压变压器 step-up transformer 0'6ai=W
高压侧 high side %C`P7&8m=O
输电系统 power transmission system }&/>v' G
输电线 transmission line `PAQv+EYz
固定串联电容补偿fixed series capacitor compensation M`al~9
稳定 stability )e5=<'f1
电压稳定 voltage stability s?;8h &]=
功角稳定 angle stability 3);P!W4>
暂态稳定 transient stability BAXu\a-C_
电厂 power plant C~4SPCU
能量输送 power transfer z4_B/Q
交流 AC )rP,+ B?W
装机容量 installed capacity vrb@::sy0T
电网 power system rzHBop-8
落点 drop point h(yFr/
开关站 switch station V~*>/2+
双回同杆并架 double-circuit lines on the same tower #pPOQv:~
变电站 transformer substation "{vWdY|"
补偿度 degree of compensation I1m[M?
高抗 high voltage shunt reactor W7A!QS
无功补偿 reactive power compensation U9T}iI
故障 fault k%gj
调节 regulation h[qZM
裕度 magin ?=4oxPe
三相故障 three phase fault F%a&|X
故障切除时间 fault clearing time GdUsv
极限切除时间 critical clearing time |dEPy-Xe
切机 generator triping Vx.c`/
高顶值 high limited value !%M,x~H
强行励磁 reinforced excitation u-&V