1 backplane 背板 ^@ UjQ9[>
2 Band gap voltage reference 带隙电压参考 &9h
3 benchtop supply 工作台电源 B_@7IbB
4 Block Diagram 方块图 5 Bode Plot 波特图 YnxU(v'\
6 Bootstrap 自举 7sN0`7
7 Bottom FET Bottom FET c+;S<g0
8 bucket capcitor 桶形电容 <W|1<=z(
9 chassis 机架 !'PlDGD
10 Combi-sense Combi-sense LO>8 j:
11 constant current source 恒流源 )GCLK<,swu
12 Core Sataration 铁芯饱和 |
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13 crossover frequency 交叉频率 ./!KE"!
14 current ripple 纹波电流 Ko-QR(
15 Cycle by Cycle 逐周期 Rc%PZ}es
16 cycle skipping 周期跳步 N('3oy#8
17 Dead Time 死区时间 7X:hIl
18 DIE Temperature 核心温度 (\q[gyR
19 Disable 非使能,无效,禁用,关断 Jh(mbD
20 dominant pole 主极点 wKrdcWI,Z
21 Enable 使能,有效,启用 7?]!Ecr"
22 ESD Rating ESD额定值 HtS#_y%(
23 Evaluation Board 评估板 @YrGyq
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 9>zDJx
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 |Qq+8IeYG
25 Failling edge 下降沿 j5A\y^Kv
26 figure of merit 品质因数 U*xxrt/On/
27 float charge voltage 浮充电压 5z[6rT=a
28 flyback power stage 反驰式功率级 " V/k<HRw
29 forward voltage drop 前向压降 tQ6| PV
30 free-running 自由运行 k#-[ M.i
31 Freewheel diode 续流二极管 ;>'SV~F
32 Full load 满负载 33 gate drive 栅极驱动 $WM8tF?H
34 gate drive stage 栅极驱动级 y(ldO;.
35 gerber plot Gerber 图 h?3f5G*&H
36 ground plane 接地层 ]N_140N~
37 Henry 电感单位:亨利 95% :AQLV
38 Human Body Model 人体模式 ILIRI[7(
39 Hysteresis 滞回 2PI #ie4
40 inrush current 涌入电流 {8W |W2o$!
41 Inverting 反相 R3cG<MjmK
42 jittery 抖动 R=QM;
43 Junction 结点 }K+\8em
44 Kelvin connection 开尔文连接 {vCU^BN,k
45 Lead Frame 引脚框架 IBF.&[[S
46 Lead Free 无铅 ~v,!n/('
47 level-shift 电平移动 aeQ{_SK
48 Line regulation 电源调整率 ),z,LU Yf
49 load regulation 负载调整率 00R%
50 Lot Number 批号 2voNgY
51 Low Dropout 低压差 gZ~y}@Ly
52 Miller 密勒 53 node 节点 OHQ3+WJ
54 Non-Inverting 非反相 )8\Z=uC
55 novel 新颖的 M!{Rq1M
56 off state 关断状态 79y'Ja+`j
57 Operating supply voltage 电源工作电压 AZ}%MA;q
58 out drive stage 输出驱动级 @$_rEdwi
59 Out of Phase 异相 ta2z
60 Part Number 产品型号 7?*~oVZW
61 pass transistor pass transistor ,\Z8*Jr3Q
62 P-channel MOSFET P沟道MOSFET UYlJO{|a
63 Phase margin 相位裕度 _6|
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64 Phase Node 开关节点 <`^>bv9
65 portable electronics 便携式电子设备 pZW}^kg=
66 power down 掉电 7?)m(CFy
67 Power Good 电源正常 #=>kw^5
68 Power Groud 功率地 eDvXU_yA
69 Power Save Mode 节电模式 ^D0/H
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70 Power up 上电 gDgP;id
71 pull down 下拉 ]ZBgE\[
72 pull up 上拉 3Ro7M=]
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) REeD?u j
74 push pull converter 推挽转换器 t"4Rn<-
75 ramp down 斜降 8j({=xbg&
76 ramp up 斜升 G>9'5Lt
77 redundant diode 冗余二极管 zkw0jX~
78 resistive divider 电阻分压器 |J@|
79 ringing 振 铃 <PH3gyC
80 ripple current 纹波电流 k)o7COx
81 rising edge 上升沿 axt6u)4%7:
82 sense resistor 检测电阻 47$-5k30
83 Sequenced Power Supplys 序列电源 a2IV!0x
84 shoot-through 直通,同时导通 h?M'7Lti
85 stray inductances. 杂散电感 <L[ *hp
86 sub-circuit 子电路 +/1P^U /
87 substrate 基板 X*D5y8<
88 Telecom 电信 ~6pCOS}
89 Thermal Information 热性能信息 U*c{:K-C
90 thermal slug 散热片 =t <:zLe
91 Threshold 阈值 ]&; G\9$y
92 timing resistor 振荡电阻 -#:Y+"'
93 Top FET Top FET EC:x,i
94 Trace 线路,走线,引线 R;N>#_9HU
95 Transfer function 传递函数 j.e`ip
96 Trip Point 跳变点 S<)RVm,!e
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) A_8`YN"Xk
98 Under Voltage Lock Out (UVLO) 欠压锁定 bDcWb2lqs
99 Voltage Reference 电压参考 S@l
a.0HDA
100 voltage-second product 伏秒积 oC;l5v<
101 zero-pole frequency compensation 零极点频率补偿 'ocwXyP,
102 beat frequency 拍频 F\YcSDM
103 one shots 单击电路 M?:f^
104 scaling 缩放 "fX8xZdS
105 ESR 等效串联电阻 [Page] -+Awm{X_@
106 Ground 地电位 'bQs_
107 trimmed bandgap 平衡带隙 bE%mgaOh
108 dropout voltage 压差 ;Ln7_
109 large bulk capacitance 大容量电容 $rV:&A
110 circuit breaker 断路器 J_)z:`[yE
111 charge pump 电荷泵
vf/$`IJ
112 overshoot 过冲 h1D~AgZOVj
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印制电路printed circuit Z"PDOwj5
印制线路 printed wiring *=KexOa9
印制板 printed board #RZJ1uL
印制板电路 printed circuit board lMI
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印制线路板 printed wiring board e`gGzyM
印制元件 printed component LU 5
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印制接点 printed contact Xk7$?8r4&
印制板装配 printed board assembly UO7a}Tz<
板 board ?geWR_Z
刚性印制板 rigid printed board [{fF)D<tC
挠性印制电路 flexible printed circuit ^FyvaO
挠性印制线路 flexible printed wiring <aQ; "O~
齐平印制板 flush printed board kAKqW7,q"
金属芯印制板 metal core printed board _|Kv~\G!
金属基印制板 metal base printed board Z-;uzx
多重布线印制板 mulit-wiring printed board M,v@G$pW
塑电路板 molded circuit board &t=>:C$1Y
散线印制板 discrete wiring board 3K;b~xg`nw
微线印制板 micro wire board D ;T r
积层印制板 buile-up printed board Vzv.e6_
表面层合电路板 surface laminar circuit IQ27FV|3
埋入凸块连印制板 B2it printed board ]$`s}BN
载芯片板 chip on board (J) Rs`_
埋电阻板 buried resistance board \]d*h]Hms
母板 mother board t&?v9n"X
子板 daughter board ;@ ! d!&
背板 backplane h0EGhJs
裸板 bare board H:nu>pzt
键盘板夹心板 copper-invar-copper board @|*Z0bn'
动态挠性板 dynamic flex board a[{QlD^D
静态挠性板 static flex board 1Qc(<gM
可断拼板 break-away planel ne%OTr4dD
电缆 cable :Pp;{=J
挠性扁平电缆 flexible flat cable (FFC) H ]N/Y{
薄膜开关 membrane switch 4)I/\
混合电路 hybrid circuit VRN9 yn2
厚膜 thick film U"R.!=v
厚膜电路 thick film circuit S:GUR6g8D
薄膜 thin film &Bdt+OQ ;
薄膜混合电路 thin film hybrid circuit '[ddE!ta
互连 interconnection SO jDtZ
导线 conductor trace line A#07Ly8kXn
齐平导线 flush conductor -gX2{dW
传输线 transmission line
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跨交 crossover PQI,vr'R
板边插头 edge-board contact T4, Zc
增强板 stiffener qt&"cw
基底 substrate ^OcfM_4pN
基板面 real estate y&I|m
导线面 conductor side M6d w~0e
元件面 component side rM?Dp2
焊接面 solder side r.G/f{=<@
导电图形 conductive pattern 71m-W#zyA
非导电图形 non-conductive pattern }oxaB9r
基材 base material {q>4:lsS
层压板 laminate OL9C#er
覆金属箔基材 metal-clad bade material )p_LkX(
覆铜箔层压板 copper-clad laminate (CCL) )A+j
复合层压板 composite laminate (7#lN
薄层压板 thin laminate >wm$,%zk
基体材料 basis material bb_jD^
预浸材料 prepreg PY:#F|uHS`
粘结片 bonding sheet bOGDz|H``
预浸粘结片 preimpregnated bonding sheer >^ 1S26
环氧玻璃基板 epoxy glass substrate TF3q?0
预制内层覆箔板 mass lamination panel :XY3TI
内层芯板 core material <`p'6n79
粘结层 bonding layer p$G3r0@
粘结膜 film adhesive s6hWq&C
无支撑胶粘剂膜 unsupported adhesive film `1v!sSR0R
覆盖层 cover layer (cover lay) I; }%k;v6
增强板材 stiffener material vo<#sa^,j
铜箔面 copper-clad surface Fmle|
去铜箔面 foil removal surface i/EiUH/~
层压板面 unclad laminate surface i|noYo_Ah\
基膜面 base film surface =5_F9nk-
胶粘剂面 adhesive faec
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原始光洁面 plate finish ;p"XCLHl
粗面 matt finish BW\5RIWwE5
剪切板 cut to size panel ;=
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超薄型层压板 ultra thin laminate OQ*. ho
A阶树脂 A-stage resin 10a*7 L
B阶树脂 B-stage resin 2EcYO$R!
C阶树脂 C-stage resin '\YhRU
环氧树脂 epoxy resin pXlBKJmW
酚醛树脂 phenolic resin n#'',4f
聚酯树脂 polyester resin 3Qr!?=nf
聚酰亚胺树脂 polyimide resin #]HjP\C
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin nhhJUN?8
丙烯酸树脂 acrylic resin KgAX0dM
三聚氰胺甲醛树脂 melamine formaldehyde resin Y6DiISl
多官能环氧树脂 polyfunctional epoxy resin =w?cp}HW
溴化环氧树脂 brominated epoxy resin LZ]pyoi
环氧酚醛 epoxy novolac BD+~8v
氟树脂 fluroresin bUB6B
硅树脂 silicone resin x=+I8Q4:
硅烷 silane ;mxT>|z
聚合物 polymer 5|t&qUV
无定形聚合物 amorphous polymer GV[BpH
结晶现象 crystalline polamer rzj'!~>U
双晶现象 dimorphism 3AL=*qq
共聚物 copolymer Y }d>%i+
合成树脂 synthetic /7)G"qG~F~
热固性树脂 thermosetting resin [Page] DNO%J^
热塑性树脂 thermoplastic resin phSP+/w
感光性树脂 photosensitive resin PS]XLz
环氧值 epoxy value <W^~Y31:0
双氰胺 dicyandiamide 9'aR-tFun;
粘结剂 binder 1vd+p!n
胶粘剂 adesive 8rNxd=!
固化剂 curing agent dju{&wo~4
阻燃剂 flame retardant >n\Q[W
遮光剂 opaquer ;BvWU\!
增塑剂 plasticizers 4rdrl
不饱和聚酯 unsatuiated polyester @h8~xs~DG
聚酯薄膜 polyester /bk} J:QRg
聚酰亚胺薄膜 polyimide film (PI) 3Ab$
聚四氟乙烯 polytetrafluoetylene (PTFE) ;<