1 backplane 背板 ]P$8# HiX
2 Band gap voltage reference 带隙电压参考 SqFya
3 benchtop supply 工作台电源 "e g`3v
4 Block Diagram 方块图 5 Bode Plot 波特图 !`\W8JT+
6 Bootstrap 自举 HKq 2X4J$
7 Bottom FET Bottom FET 'T7JXV5
8 bucket capcitor 桶形电容 Gk,{{:M:5
9 chassis 机架 shxr^
10 Combi-sense Combi-sense ADA%$NhJ!
11 constant current source 恒流源 O;f^'N
12 Core Sataration 铁芯饱和 F}0QocD
13 crossover frequency 交叉频率 ;|w &n
14 current ripple 纹波电流 m(nlu
15 Cycle by Cycle 逐周期 !$AVlMnJ
16 cycle skipping 周期跳步 x+|Fw d
17 Dead Time 死区时间 t*<vc]D
18 DIE Temperature 核心温度 qyUcjc%[
19 Disable 非使能,无效,禁用,关断 n<8$_?-
20 dominant pole 主极点 Xn"n5=M
21 Enable 使能,有效,启用 PTA;a0A
22 ESD Rating ESD额定值 Y_>z"T
23 Evaluation Board 评估板 4DEsB)%X
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. J:f>/
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 {d}-SoxH
25 Failling edge 下降沿 G6JyAC9j
26 figure of merit 品质因数 3`TC*
27 float charge voltage 浮充电压 JwB:NqB
28 flyback power stage 反驰式功率级 zJI/j
_~W
29 forward voltage drop 前向压降 dpZ7eJ
30 free-running 自由运行 Sn.I
]:l
31 Freewheel diode 续流二极管 \qQ5x
32 Full load 满负载 33 gate drive 栅极驱动 2F!K
}aw
34 gate drive stage 栅极驱动级 7;;W{W%
35 gerber plot Gerber 图 k(=\&T
36 ground plane 接地层 jCW>=1:JGY
37 Henry 电感单位:亨利 fj0+a0h
38 Human Body Model 人体模式 POH>!lHu
39 Hysteresis 滞回 & /-@R|
40 inrush current 涌入电流 vc6UA%/f
41 Inverting 反相 '`"LX!"ZO
42 jittery 抖动 l4U& CA y
43 Junction 结点 (m)%5*:
44 Kelvin connection 开尔文连接 P.qD,$-
45 Lead Frame 引脚框架 M =yZ5~3
46 Lead Free 无铅 ?#}=!$p
47 level-shift 电平移动 kSU5
}
48 Line regulation 电源调整率 GOJi/R.{
49 load regulation 负载调整率 6xdu}l=%
50 Lot Number 批号 {N)\It
51 Low Dropout 低压差 )@eBe^
52 Miller 密勒 53 node 节点 PC\Xm,,
54 Non-Inverting 非反相 C>v
55 novel 新颖的 a47Btd'm
56 off state 关断状态 t
vk^L3=<
57 Operating supply voltage 电源工作电压 ejgg.G ^
58 out drive stage 输出驱动级 F1M@$S,
59 Out of Phase 异相 &@dMk4BH<
60 Part Number 产品型号 CSr{MF`]e
61 pass transistor pass transistor cnLC> _hY
62 P-channel MOSFET P沟道MOSFET G8u8&|
63 Phase margin 相位裕度 e"r}I!.
64 Phase Node 开关节点 H7Y}qP5X
65 portable electronics 便携式电子设备 4bAgbx-^
66 power down 掉电 $nn~K
67 Power Good 电源正常 JTx}{kVO
68 Power Groud 功率地 GZZLX19sq
69 Power Save Mode 节电模式 r0\bi6;s/
70 Power up 上电 /4_}wi\
71 pull down 下拉 ljiq +tT
72 pull up 上拉 <ya'L&
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) .Z_U]_(
74 push pull converter 推挽转换器 T{uktIO/
75 ramp down 斜降 E*(Q'p9C
76 ramp up 斜升 IE_@:]K}Ja
77 redundant diode 冗余二极管 "VT5WFj
78 resistive divider 电阻分压器 n:*+pL;
79 ringing 振 铃 jb7=1OPD_
80 ripple current 纹波电流 g!~j
Wn?A
81 rising edge 上升沿 >F+:ej
82 sense resistor 检测电阻
#jZ:Ex
83 Sequenced Power Supplys 序列电源
}rO4b>J
84 shoot-through 直通,同时导通 Bs# #3{ylu
85 stray inductances. 杂散电感 dtF6IdAf
86 sub-circuit 子电路 yLDHJ}R
87 substrate 基板 etTuukq_Z
88 Telecom 电信 ]6:5<NW
89 Thermal Information 热性能信息 3_h%g$04s
90 thermal slug 散热片 fLD9RZ8_
91 Threshold 阈值 Ix(4<s
92 timing resistor 振荡电阻 5Q%#Z
L/'
93 Top FET Top FET qb" !
94 Trace 线路,走线,引线 4k#B5^iJ
95 Transfer function 传递函数 [")0{LSA=
96 Trip Point 跳变点 y:,{U*49
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 8vT:icl
98 Under Voltage Lock Out (UVLO) 欠压锁定 A%GJ|h,i
99 Voltage Reference 电压参考 3/ [=
100 voltage-second product 伏秒积 >#q|Pjv]
101 zero-pole frequency compensation 零极点频率补偿 9723f1&Vd
102 beat frequency 拍频 ,7QnZ=F
103 one shots 单击电路 BMdr.0
104 scaling 缩放 ;zCHEz
105 ESR 等效串联电阻 [Page] "q(&<+D@
106 Ground 地电位 ^-ACtA)
107 trimmed bandgap 平衡带隙 .1pEq~>
108 dropout voltage 压差 TWs|lhC7!
109 large bulk capacitance 大容量电容 *,Re&N8
110 circuit breaker 断路器 hCDI;'ls
111 charge pump 电荷泵 fk"{G>&8
112 overshoot 过冲 xO.7cSqgw
\;?\@vo<
印制电路printed circuit q6ikJ8E8b
印制线路 printed wiring `773& \PK
印制板 printed board =.o-R=:d
印制板电路 printed circuit board q@\_q!
印制线路板 printed wiring board p/:5bvA
印制元件 printed component a>kDG <.A
印制接点 printed contact jqLyX
印制板装配 printed board assembly V\G>e{
板 board `j(+Y
刚性印制板 rigid printed board O[`Ob6Q{F
挠性印制电路 flexible printed circuit :rj78_e9
挠性印制线路 flexible printed wiring QB.7n&u
齐平印制板 flush printed board x:bYd\
EJ[
金属芯印制板 metal core printed board C{ti>'"V
金属基印制板 metal base printed board u qyf3bK
多重布线印制板 mulit-wiring printed board O-B3@qQ. h
塑电路板 molded circuit board Wp]EaYt2D
散线印制板 discrete wiring board OM.^>=
微线印制板 micro wire board
F#PJ+W*h
积层印制板 buile-up printed board j~{2fd<>
表面层合电路板 surface laminar circuit Ya_6Zd4O
埋入凸块连印制板 B2it printed board ]lo1Kw
载芯片板 chip on board 4w?7AI]Ej
埋电阻板 buried resistance board w\mF2h
母板 mother board ~3%3{aa
子板 daughter board 3(&.[o
Z
背板 backplane nZT@d;]U9
裸板 bare board j*zK"n
键盘板夹心板 copper-invar-copper board N:<O
动态挠性板 dynamic flex board 5_`}$"<~
静态挠性板 static flex board J#kdyBmuO
可断拼板 break-away planel G<z)Ydh_
电缆 cable 7X|r';"?i
挠性扁平电缆 flexible flat cable (FFC) xHGoCFB
薄膜开关 membrane switch yRznP)
混合电路 hybrid circuit ./
:86@O
厚膜 thick film m=9N^_
厚膜电路 thick film circuit wgyO%
薄膜 thin film bxN;"{>Xz
薄膜混合电路 thin film hybrid circuit f+920/>!Z
互连 interconnection -b$OHFL
导线 conductor trace line caP
齐平导线 flush conductor m@@QT<
传输线 transmission line mQs$7t[>t
跨交 crossover (2li:1j
板边插头 edge-board contact v2{O67j}
o
增强板 stiffener p[)<d_
基底 substrate ]'Yw#YB
基板面 real estate /RM-+D:Y
导线面 conductor side @>]3xHE6#=
元件面 component side kut|A
焊接面 solder side TJpv"V
导电图形 conductive pattern h7$!wf!I
非导电图形 non-conductive pattern RV`j>1
基材 base material 62jA
层压板 laminate C6w{"[Wv=X
覆金属箔基材 metal-clad bade material }#8uXA
覆铜箔层压板 copper-clad laminate (CCL) #+
'@/5{ n
复合层压板 composite laminate J7GsNFL
薄层压板 thin laminate gcxk'd
基体材料 basis material 0f^.zt{T
预浸材料 prepreg ^rwSbM$
粘结片 bonding sheet :Y>]6
预浸粘结片 preimpregnated bonding sheer V+24- QWh
环氧玻璃基板 epoxy glass substrate Bx-,"Z \
预制内层覆箔板 mass lamination panel Aa>gN
内层芯板 core material BUinzW z{a
粘结层 bonding layer !h!9SE
粘结膜 film adhesive }qhK.e
无支撑胶粘剂膜 unsupported adhesive film }yw;L(3
覆盖层 cover layer (cover lay) +
nS/jW
增强板材 stiffener material XL^N5
铜箔面 copper-clad surface F5+_p@!i
去铜箔面 foil removal surface %wW5)Y I
层压板面 unclad laminate surface ]Rh(=bg
基膜面 base film surface o2 d~
胶粘剂面 adhesive faec #@^w>D6W
原始光洁面 plate finish Uob |Q=MQ
粗面 matt finish NCnId}BT
剪切板 cut to size panel c)MR+'d\WO
超薄型层压板 ultra thin laminate 2nkj;x{H$
A阶树脂 A-stage resin ~[TKVjyO
B阶树脂 B-stage resin VtiqAh}4
C阶树脂 C-stage resin %J7mZB9
环氧树脂 epoxy resin Ok~{@\
酚醛树脂 phenolic resin q_y,j&
聚酯树脂 polyester resin JjLyV`DJ
聚酰亚胺树脂 polyimide resin $sF#Na4^
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin qYZ7Zt;
丙烯酸树脂 acrylic resin :IVMTdYf
三聚氰胺甲醛树脂 melamine formaldehyde resin 6^O?p2xpo
多官能环氧树脂 polyfunctional epoxy resin h5rP]dbhXU
溴化环氧树脂 brominated epoxy resin QX.6~*m1
环氧酚醛 epoxy novolac qMES<UL>
氟树脂 fluroresin z-G7Y#
硅树脂 silicone resin $H-D9+8 7
硅烷 silane eD{ @0&
聚合物 polymer gkML .u
无定形聚合物 amorphous polymer yj'' \
结晶现象 crystalline polamer ;K\N
双晶现象 dimorphism eM=) >zl
共聚物 copolymer #r.` V!=
合成树脂 synthetic I.+)sB?5
热固性树脂 thermosetting resin [Page] $Cd ;0gdv
热塑性树脂 thermoplastic resin _:X|R#d
感光性树脂 photosensitive resin 8o7]XZE=)
环氧值 epoxy value e=o{Zo?H=
双氰胺 dicyandiamide >'-w%H/
粘结剂 binder >Ug?O~-
胶粘剂 adesive xSDE6]
固化剂 curing agent Eqmv`Z
[_
阻燃剂 flame retardant gSr}p$N
遮光剂 opaquer E`uaE=Mdq
增塑剂 plasticizers ]Uu(OI<)
不饱和聚酯 unsatuiated polyester
n22hVw
聚酯薄膜 polyester B_"OA3d_
聚酰亚胺薄膜 polyimide film (PI) 4nII/cPG
聚四氟乙烯 polytetrafluoetylene (PTFE) R^yZG{?t
增强材料 reinforcing material y|;8 :b32
折痕 crease ~"q,<t
云织 waviness 40Qzo%eL
鱼眼 fish eye oIvnF:c
毛圈长 feather length cxD}t'T
厚薄段 mark p~q_0Pg%
裂缝 split AO}i@YJth
捻度 twist of yarn J`+`Kq1T
浸润剂含量 size content Z0"&
浸润剂残留量 size residue $}^\=p}X
处理剂含量 finish level MeI2i
偶联剂 couplint agent NB+$ym
断裂长 breaking length Ztyv@z'/Z
吸水高度 height of capillary rise c. TB8Ol
湿强度保留率 wet strength retention !q-:rW?c
白度 whitenness ? gA=39[j
导电箔 conductive foil )-.Cne;n
铜箔 copper foil -.b
I o
压延铜箔 rolled copper foil ^\vfos
光面 shiny side 20/P M9
粗糙面 matte side =tS[&6/
处理面 treated side 9*=@/1
防锈处理 stain proofing }+{*, z
双面处理铜箔 double treated foil hINnb7o
模拟 simulation Q"OV>kl k
逻辑模拟 logic simulation ayH%
qp
电路模拟 circit simulation mo|PrLV
时序模拟 timing simulation EtR@sJ<
模块化 modularization K=m9H=IX~T
设计原点 design origin Nxbd~^j
优化(设计) optimization (design) hsHVX[<5`
供设计优化坐标轴 predominant axis !bZhj3.
表格原点 table origin r*i$+ Z
元件安置 component positioning "rjv5*z^&
比例因子 scaling factor KH2F#[
!Lw
扫描填充 scan filling B:3+',i1
矩形填充 rectangle filling ^A *]&%(h
填充域 region filling t,=@hs
hN
实体设计 physical design 4-]Do?
逻辑设计 logic design *R_'$+
逻辑电路 logic circuit u=@h`5-fp
层次设计 hierarchical design [GR]!\!%~
自顶向下设计 top-down design jh 7p62R
自底向上设计 bottom-up design {?EEIfg
费用矩阵 cost metrix y:g7'+c
元件密度 component density ]RH=s7L
自由度 degrees freedom 4V u'r?
出度 out going degree 'a;ini
入度 incoming degree "pSH!0Ap\
曼哈顿距离 manhatton distance f
MY;
欧几里德距离 euclidean distance 8!u/
网络 network E8T"{
R80
阵列 array ,+ns
{ppn
段 segment 9RG\UbX)^|
逻辑 logic r#_7]_3
逻辑设计自动化 logic design automation pu/m8
分线 separated time `e'G.@
分层 separated layer .sd B3x
定顺序 definite sequence qDby!^ryc
导线(通道) conduction (track) ,}9f(`
导线(体)宽度 conductor width =cf{f]N
导线距离 conductor spacing M&uzOK+
导线层 conductor layer v}7@CP]nV
导线宽度/间距 conductor line/space *Rz{44LP&
第一导线层 conductor layer No.1 8 A2if9E3
圆形盘 round pad RGT_}ni
方形盘 square pad b@=zrhQ
菱形盘 diamond pad u^`eKak"l
长方形焊盘 oblong pad 6#E]zmXO2
子弹形盘 bullet pad
;Y
Dv.I
泪滴盘 teardrop pad xGKfej9
雪人盘 snowman pad G_V.H\w
形盘 V-shaped pad V [ 3$.*
环形盘 annular pad wqJ*%
非圆形盘 non-circular pad wXc,F D$
隔离盘 isolation pad uew0R;+oa
非功能连接盘 monfunctional pad {iA^rv|
偏置连接盘 offset land +?qf`p.{
腹(背)裸盘 back-bard land 84iJ[Fq{
盘址 anchoring spaur [X;>*-
连接盘图形 land pattern WwW"fkv
连接盘网格阵列 land grid array (N,nux(0k
孔环 annular ring V-[2jC{
元件孔 component hole Jzk!K@
安装孔 mounting hole fH-NU-"
支撑孔 supported hole (l
Lu?NpIi
非支撑孔 unsupported hole CXBzX:T?#
导通孔 via g93I+
镀通孔 plated through hole (PTH) N g58/}zO
余隙孔 access hole 6dF$?I&
盲孔 blind via (hole) |}Q( F+cL
埋孔 buried via hole m'd^?Qc
埋,盲孔 buried blind via g<fP:/
任意层内部导通孔 any layer inner via hole R"NGJu9
全部钻孔 all drilled hole Y;8
>=0ye
定位孔 toaling hole &kb\,mQ
无连接盘孔 landless hole smV!y8&
中间孔 interstitial hole aIQOs
无连接盘导通孔 landless via hole /v5qyR7an
引导孔 pilot hole mj)PLZ]
端接全隙孔 terminal clearomee hole M
/"gf;)q>
准尺寸孔 dimensioned hole [Page] zEy&4Kl{+
在连接盘中导通孔 via-in-pad *%3oyWwCd
孔位 hole location ~
9=27p
孔密度 hole density QO@6VY@
孔图 hole pattern FS8S68
钻孔图 drill drawing @\ }sb]
装配图assembly drawing jM*AL
X
参考基准 datum referan 9x(}F<L
1) 元件设备 kg:l:C)Tq
ai4PM
b$p
三绕组变压器:three-column transformer ThrClnTrans [KMS<4t'
双绕组变压器:double-column transformer DblClmnTrans 9X3yp:>V
电容器:Capacitor t')h{2&&!2
并联电容器:shunt capacitor N*f^Z#B]
电抗器:Reactor TaOOq}8c#
母线:Busbar WJAYM2
6\
输电线:TransmissionLine w$b~x4y%
发电厂:power plant JPLI
@zX^
断路器:Breaker u)7*Rj^
刀闸(隔离开关):Isolator zwnw'
分接头:tap 9<v}LeX
电动机:motor 3EmcYC
(2) 状态参数 PT+c&5A S
P])L8zK
有功:active power ZY)%U*jWU
无功:reactive power 6%%PP8.F
电流:current ?NlSeh
容量:capacity K}Na3}m
电压:voltage
qtzFg#
档位:tap position FRgLlp8x
有功损耗:reactive loss Mm.Ql
无功损耗:active loss W<Z$YWr
功率因数:power-factor 847 R
功率:power PRwu
功角:power-angle !_dR'
电压等级:voltage grade ]%Y\ZIS
空载损耗:no-load loss 9\>sDSCx
铁损:iron loss ywEDy|Wn$~
铜损:copper loss R4SxFp
空载电流:no-load current Z:|9N/>T
阻抗:impedance o!utZmk$
正序阻抗:positive sequence impedance g?V&mu
负序阻抗:negative sequence impedance #X5hSw;
零序阻抗:zero sequence impedance |Ytg
电阻:resistor -E]Sk&4Gj
电抗:reactance {y b D
电导:conductance Pcdf$a"`
电纳:susceptance U{}!y3[wK
无功负载:reactive load 或者QLoad Px#$uU
有功负载: active load PLoad uB;_vC
遥测:YC(telemetering) 5%P[^}
遥信:YX 7@IFp~6<qK
励磁电流(转子电流):magnetizing current t:=k)B
定子:stator (]XbPW
功角:power-angle %[ /<+
上限:upper limit IA2GUnUhu
下限:lower limit 7]s%rya
并列的:apposable f ;wc{qy
高压: high voltage UiIF6-ZZ!
低压:low voltage f05=Mc&)
中压:middle voltage Y208b?=9w
电力系统 power system &K
*X)DAs
发电机 generator [4XC#OgA
励磁 excitation |1l&@#j!2
励磁器 excitor E/mw* c^
电压 voltage 2tf6GX:
电流 current s}ADk-7
母线 bus Me/\z^pF
变压器 transformer 6/6Rah!
升压变压器 step-up transformer EZib1g&:R/
高压侧 high side [@3SfQ
输电系统 power transmission system h!e2
+4{4{
输电线 transmission line 9!}q{2j
固定串联电容补偿fixed series capacitor compensation JUQg 'D
稳定 stability ]*;F. pZ
电压稳定 voltage stability Q0~j$Jc
功角稳定 angle stability 2]2H++
暂态稳定 transient stability >zmzK{A=
电厂 power plant #*2Rp8n
能量输送 power transfer FZXyfZw!|
交流 AC qVBL>9O*.
装机容量 installed capacity p7C!G1+z
电网 power system AIh*1>2Xn
落点 drop point "-
eZZEl(
开关站 switch station *vnXlV4L
双回同杆并架 double-circuit lines on the same tower hS:jBp,
变电站 transformer substation U-EhPAB@
补偿度 degree of compensation ?2ItB `<(
高抗 high voltage shunt reactor #s2B%X
无功补偿 reactive power compensation [AR>?6G-
故障 fault i8~$o:&HT
调节 regulation '7tBvVO_
裕度 magin m<: IFx#
三相故障 three phase fault [U.v:tR
故障切除时间 fault clearing time jPk
c3dG
+
极限切除时间 critical clearing time .Xd0
Q=1h
切机 generator triping MEq"}zrh
高顶值 high limited value Np2ci~"<.
强行励磁 reinforced excitation %idk@~H Cg
线路补偿器 LDC(line drop compensation) 4o5i ."l
机端 generator terminal </s,pe79B
静态 static (state) t1ze-Ht;
动态 dynamic (state) \c7>:DH
单机无穷大系统 one machine - infinity bus system r,xmEj0E
机端电压控制 AVR _%Z P{5D>
电抗 reactance 6>DLp}d
电阻 resistance Bo
r7] #
功角 power angle {/}^D-
有功(功率) active power r{[OJc!
无功(功率) reactive power oT&m4I
功率因数 power factor ,2`~ NPb
无功电流 reactive current sLns3&n2
下降特性 droop characteristics JsQ6l%9
斜率 slope 7[KCWJ
额定 rating $|a;~m>
变比 ratio 'UfeluMd
参考值 reference value k+1gQru{d
电压互感器 PT u Z(? >
分接头 tap G!Zyl^
下降率 droop rate S%l:kKD
仿真分析 simulation analysis m22wF>9
传递函数 transfer function `ZGcgO<c\
框图 block diagram n29(!10Px
受端 receive-side #a,9B-X
裕度 margin lTz6"/
同步 synchronization S_Z`so}
失去同步 loss of synchronization <DZcra
阻尼 damping >eS$
摇摆 swing 2]ti!<
保护断路器 circuit breaker 6E^~n
电阻:resistance YD&_^3-XM
电抗:reactance '*!L!VJ
阻抗:impedance D7Zm2Kj
电导:conductance DWf$X1M
电纳:susceptance