1 backplane 背板 ^~ Sn{esA
2 Band gap voltage reference 带隙电压参考 :9b RuUm
3 benchtop supply 工作台电源 66*o2D\Q*G
4 Block Diagram 方块图 5 Bode Plot 波特图 _+En%p.m
6 Bootstrap 自举 ?MH4<7?"
7 Bottom FET Bottom FET wO#+8js
8 bucket capcitor 桶形电容 [XXN0+ /
9 chassis 机架 y6/X!+3+
10 Combi-sense Combi-sense y#+o*(=fRE
11 constant current source 恒流源 P]B#i1
12 Core Sataration 铁芯饱和 ho1F8TG=
13 crossover frequency 交叉频率 ShpnFuH
14 current ripple 纹波电流 >$DqG$D
15 Cycle by Cycle 逐周期 F
4/Uu"J:
16 cycle skipping 周期跳步 Sg-xm+iSDt
17 Dead Time 死区时间 /Hmo!"W`
18 DIE Temperature 核心温度 MlFvDy
19 Disable 非使能,无效,禁用,关断 %j@FZ
)a[
20 dominant pole 主极点 j,XKu5w)Oi
21 Enable 使能,有效,启用 arZIe+KW
22 ESD Rating ESD额定值 Be+:-t)
23 Evaluation Board 评估板 %5%Wo(W'
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. #A;Z4jK
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 YW<2:1A|
25 Failling edge 下降沿 __j8jEV
26 figure of merit 品质因数 ~-d.3A$u
27 float charge voltage 浮充电压 Ao T 7sy7
28 flyback power stage 反驰式功率级 aB^G
29 forward voltage drop 前向压降 Ef.4.iDJrR
30 free-running 自由运行 \]xYV}(FO
31 Freewheel diode 续流二极管 U[l%oLra
32 Full load 满负载 33 gate drive 栅极驱动 (, "E9.
34 gate drive stage 栅极驱动级 Oq6n.:8g"
35 gerber plot Gerber 图 jm\#($gl=
36 ground plane 接地层 @'@6vC
37 Henry 电感单位:亨利 4&e@>
38 Human Body Model 人体模式 *a!!(cZZ
39 Hysteresis 滞回 dH|^\IQ
40 inrush current 涌入电流 RWFf-VA?
41 Inverting 反相 sv"mba.J
42 jittery 抖动 <R>z;2c
43 Junction 结点 \F~Cbj+'Nu
44 Kelvin connection 开尔文连接 S:/RYT"
45 Lead Frame 引脚框架 Y)}%SP>,
46 Lead Free 无铅 m7vxzC*
47 level-shift 电平移动 9
w1ONw8v
48 Line regulation 电源调整率 &Fjilx'k
49 load regulation 负载调整率 /T)n5X
50 Lot Number 批号
'*u;:[73
51 Low Dropout 低压差 ~+C?][T
52 Miller 密勒 53 node 节点 V(LFH9.Mp
54 Non-Inverting 非反相 MdZgS#`
55 novel 新颖的 o'/C$E4W
56 off state 关断状态 $3[\:+
57 Operating supply voltage 电源工作电压 PMs_K"-K
58 out drive stage 输出驱动级 uz3pc;0LPY
59 Out of Phase 异相 '-33iG
60 Part Number 产品型号 JZ/O0PW
61 pass transistor pass transistor [P=[hj;
62 P-channel MOSFET P沟道MOSFET 2Fg t)`{!
63 Phase margin 相位裕度 (M,VwwN
64 Phase Node 开关节点 {$YD-bqY
65 portable electronics 便携式电子设备 '<< ~wt
66 power down 掉电 dqA[|bV
67 Power Good 电源正常 +\GZ(!~
68 Power Groud 功率地 L~y t AZ,
69 Power Save Mode 节电模式 zK4
8vo
70 Power up 上电 ) Zo_6%
71 pull down 下拉
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72 pull up 上拉 S?\hbM]V-o
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) heZy
66
74 push pull converter 推挽转换器 nDB 2>J
75 ramp down 斜降 o Xi}@
76 ramp up 斜升 U!?gdX
77 redundant diode 冗余二极管 dyiEK)$h
78 resistive divider 电阻分压器 s%[GQQ-N
79 ringing 振 铃 exO#>th1
80 ripple current 纹波电流 o 7W Kh=
81 rising edge 上升沿 F] ?@X
82 sense resistor 检测电阻 aq+IC@O
83 Sequenced Power Supplys 序列电源 yISQYvSN
84 shoot-through 直通,同时导通 E? eWv)//
85 stray inductances. 杂散电感 D`:d'ow~KQ
86 sub-circuit 子电路 3'*%R48P`
87 substrate 基板 :q64K?X
88 Telecom 电信 7k=F6k0)
89 Thermal Information 热性能信息 /CI%XocB
90 thermal slug 散热片 30 [#%_* o
91 Threshold 阈值 7X{bB
92 timing resistor 振荡电阻 Fiu!!M6
93 Top FET Top FET Zxc7nLKF~
94 Trace 线路,走线,引线 )R8%'X;U
95 Transfer function 传递函数 +6hl@Fm(
96 Trip Point 跳变点 \DU^idp#
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) p&sK\
98 Under Voltage Lock Out (UVLO) 欠压锁定 0GX10*t.
99 Voltage Reference 电压参考 .6ngo0<g
100 voltage-second product 伏秒积 mvq7G
101 zero-pole frequency compensation 零极点频率补偿 4[#6<Ixf
102 beat frequency 拍频 =vr Y{5!>
103 one shots 单击电路 o9Txo
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104 scaling 缩放 /pN'K5@
105 ESR 等效串联电阻 [Page]
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106 Ground 地电位 n(1wdl Ep
107 trimmed bandgap 平衡带隙 twtkH~`"Q
108 dropout voltage 压差 hB7pR"P
109 large bulk capacitance 大容量电容 HS\3)Ooj>
110 circuit breaker 断路器 1<a@ p}
111 charge pump 电荷泵 ;EJPrDHTk
112 overshoot 过冲 _jTwiuMS-
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印制电路printed circuit 8wX+ZL:9
印制线路 printed wiring vXWsF\g
印制板 printed board BjyXQ9D
印制板电路 printed circuit board NSS4vtA
印制线路板 printed wiring board 97Zk
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印制元件 printed component gX$0[
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印制接点 printed contact jF2[bzY4
印制板装配 printed board assembly tS (i711
板 board 6Q2orn[
刚性印制板 rigid printed board T)(e!Xz
挠性印制电路 flexible printed circuit qE0FgqRB
挠性印制线路 flexible printed wiring 1Y=AT!"V
齐平印制板 flush printed board M'umoZmW0
金属芯印制板 metal core printed board Q+b.-iWR
金属基印制板 metal base printed board <TR/ `
多重布线印制板 mulit-wiring printed board NtY*sUKRD
塑电路板 molded circuit board _{e&@d
散线印制板 discrete wiring board CF|moc:;
微线印制板 micro wire board I z}2
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积层印制板 buile-up printed board HDF"]l;
表面层合电路板 surface laminar circuit \Pl,'
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埋入凸块连印制板 B2it printed board Kc%n(,+%"
载芯片板 chip on board /M^V2=
埋电阻板 buried resistance board ,!6M*|
母板 mother board _%wK}eH+sy
子板 daughter board .!JMPf"QEI
背板 backplane -`!_h[
裸板 bare board cBifZv*l
键盘板夹心板 copper-invar-copper board ~reQV6oQua
动态挠性板 dynamic flex board :tMre^oP
静态挠性板 static flex board |N:MZ#};
可断拼板 break-away planel 0)d?Y
电缆 cable 4}Q O!(
挠性扁平电缆 flexible flat cable (FFC) $%g\YdC
薄膜开关 membrane switch Es'-wr\Hm
混合电路 hybrid circuit oGm1d{_-O
厚膜 thick film m|]j'g?{}(
厚膜电路 thick film circuit &/](HLdF
薄膜 thin film $gVLk.
薄膜混合电路 thin film hybrid circuit \!^i;1h0c3
互连 interconnection g4N%PV8
导线 conductor trace line Ia=_78MgZ
齐平导线 flush conductor ?"{QK:`
传输线 transmission line },DyU
跨交 crossover \F 3C=M@:
板边插头 edge-board contact lPY@{1W
增强板 stiffener Zc-#;/b3T
基底 substrate S8O)/Sg=
基板面 real estate 96c"I;\GXX
导线面 conductor side u3 ]Uxy
元件面 component side 8rFaW
焊接面 solder side bvl~[p$W3
导电图形 conductive pattern Hqvc7 -c6
非导电图形 non-conductive pattern Yeqvv
基材 base material 2;:lK" :
层压板 laminate 79D=d'eA
覆金属箔基材 metal-clad bade material |*:tyP%m^
覆铜箔层压板 copper-clad laminate (CCL) (cvh3',
复合层压板 composite laminate Q[M (Wqg
薄层压板 thin laminate 1Gsw-a;a
基体材料 basis material /xcJo g~F,
预浸材料 prepreg
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粘结片 bonding sheet 6sPk:5
预浸粘结片 preimpregnated bonding sheer U,PZMz`2j
环氧玻璃基板 epoxy glass substrate h$70H ^r
预制内层覆箔板 mass lamination panel 75ZH
内层芯板 core material 9#uIC7M
粘结层 bonding layer =HVfJ"vK
粘结膜 film adhesive 2B-.}OJ
无支撑胶粘剂膜 unsupported adhesive film *B1x`=
覆盖层 cover layer (cover lay) N31?9GE
增强板材 stiffener material ejVdxVr \7
铜箔面 copper-clad surface 0<g<GQ(E
去铜箔面 foil removal surface j'+ELKQ
层压板面 unclad laminate surface ]}kI)34/
基膜面 base film surface Va7c#P?
胶粘剂面 adhesive faec #e/2C
原始光洁面 plate finish Y+g,pX
粗面 matt finish a:A n=NA
剪切板 cut to size panel XYe~G@Q Z
超薄型层压板 ultra thin laminate 6mCq/$
A阶树脂 A-stage resin PWvSbn6
B阶树脂 B-stage resin s`"O M^[-
C阶树脂 C-stage resin vQ 4}WtvA
环氧树脂 epoxy resin 1?(cmXj
酚醛树脂 phenolic resin ]ni6p&b>
聚酯树脂 polyester resin d<x1*a
聚酰亚胺树脂 polyimide resin /HkFlfPd
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 'WQdr(
丙烯酸树脂 acrylic resin PL@~Ys0
三聚氰胺甲醛树脂 melamine formaldehyde resin vt.P*Z5
多官能环氧树脂 polyfunctional epoxy resin ?q_^Rj$
溴化环氧树脂 brominated epoxy resin }X]\VSF{
环氧酚醛 epoxy novolac j$Nf%V 6Y
氟树脂 fluroresin mQ}Gh_'ps
硅树脂 silicone resin H?tUCbw
硅烷 silane 1AF%-<`?s
聚合物 polymer ;1 |x
无定形聚合物 amorphous polymer O|I+],
结晶现象 crystalline polamer Sh&iQ_vq
双晶现象 dimorphism y7z( &M@
共聚物 copolymer rVH6QQF=\
合成树脂 synthetic Q".g.k
热固性树脂 thermosetting resin [Page] '. (~
热塑性树脂 thermoplastic resin T~Ly^|Ihz
感光性树脂 photosensitive resin ([R")~`(l2
环氧值 epoxy value X4wH/q^
双氰胺 dicyandiamide =A@>I0(7
粘结剂 binder vT c7an6fy
胶粘剂 adesive ;F5"}x
固化剂 curing agent s\gp5MT
阻燃剂 flame retardant R4{-Qv#8
q
遮光剂 opaquer jvHFFSK
增塑剂 plasticizers lpy:3`ti
不饱和聚酯 unsatuiated polyester 19Ww3PvQ;
聚酯薄膜 polyester zrRFn `B
聚酰亚胺薄膜 polyimide film (PI) l!?yu]Yon
聚四氟乙烯 polytetrafluoetylene (PTFE) *%!M4&
增强材料 reinforcing material 6Ps.E
折痕 crease FI"HJwAs
云织 waviness 5Fbs
WW2
鱼眼 fish eye Fi2xr<7"
毛圈长 feather length sI,W%I':d
厚薄段 mark +q{[\#t5
裂缝 split $6h*lT<
捻度 twist of yarn E]I$}>k
浸润剂含量 size content "AC^ rz~U
浸润剂残留量 size residue V.6)0fKZW
处理剂含量 finish level mR%FqaN_
偶联剂 couplint agent *geN[[
断裂长 breaking length 5u$ D/*
Eb
吸水高度 height of capillary rise oC*=JJe,
湿强度保留率 wet strength retention h2~4G)J
白度 whitenness Y$<D9fs3
导电箔 conductive foil h|bT)!|
铜箔 copper foil M`7y>Ud
压延铜箔 rolled copper foil 6>`c1
\8f
光面 shiny side TL0[@rr4
粗糙面 matte side lCIDBBjy^
处理面 treated side 4)kG-[#
防锈处理 stain proofing !eI2r
双面处理铜箔 double treated foil $,fy$
Qk,S
模拟 simulation g(Yb^'X/
逻辑模拟 logic simulation &~~wX,6+
电路模拟 circit simulation ZmEEj-*7s
时序模拟 timing simulation UZ2TqR
模块化 modularization hyg8wI
设计原点 design origin 9GU]l7C=z
优化(设计) optimization (design) ;H'gT+t<c
供设计优化坐标轴 predominant axis ik.A1j9oN
表格原点 table origin ]:ZdV9`
元件安置 component positioning n,$z>
比例因子 scaling factor xQ4%e[/
扫描填充 scan filling #Sh <