1 backplane 背板 []2$rJZD9
2 Band gap voltage reference 带隙电压参考 imJ[:E
3 benchtop supply 工作台电源 QK``tWLIg7
4 Block Diagram 方块图 5 Bode Plot 波特图 3<e(@W}n-M
6 Bootstrap 自举 ]O mb :
7 Bottom FET Bottom FET Ef,7zKG
8 bucket capcitor 桶形电容 ,w9#%=xE
9 chassis 机架 7\\~xSXh
10 Combi-sense Combi-sense ~RZJ/%6F
11 constant current source 恒流源 [5 Y$L
12 Core Sataration 铁芯饱和 -H ac^4uF
13 crossover frequency 交叉频率 ?d>P+).
14 current ripple 纹波电流 n, Yr!W:h
15 Cycle by Cycle 逐周期 D^N#E>,
16 cycle skipping 周期跳步 `Q1WVd29
17 Dead Time 死区时间 yKe*<\
18 DIE Temperature 核心温度 !BvTJ-e)F
19 Disable 非使能，无效，禁用，关断 $ +GFOO
20 dominant pole 主极点 |%2/I>o
21 Enable 使能，有效，启用 epG X.
22 ESD Rating ESD额定值 T/Wm S?
23 Evaluation Board 评估板 p jKl)q
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. .%J?T5D
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 +s/N@]5n W
25 Failling edge 下降沿 XL. CJ5y>
26 figure of merit 品质因数 k+7M|t.?4
27 float charge voltage 浮充电压
O#Zs 3k
28 flyback power stage 反驰式功率级 YP$*; l
29 forward voltage drop 前向压降 ; $ ?jR
c
30 free-running 自由运行 #iR yjD
31 Freewheel diode 续流二极管 *1o+o$hY2
32 Full load 满负载 33 gate drive 栅极驱动 T $.-{I
34 gate drive stage 栅极驱动级 Jm) ; |#y
35 gerber plot Gerber 图 UgD'Bi
36 ground plane 接地层 .5KC'?
37 Henry 电感单位：亨利 C<wj?!v,F[
38 Human Body Model 人体模式 lEYT{
39 Hysteresis 滞回 8~[C'+r
40 inrush current 涌入电流 Qa7S' (
41 Inverting 反相 } n2-*{)x
42 jittery 抖动 /_VRO9R\V
43 Junction 结点 RaM#@D7
44 Kelvin connection 开尔文连接 {xBjEhQm
45 Lead Frame 引脚框架 pw<q?q%
46 Lead Free 无铅 rjpafGC p
47 level-shift 电平移动 a7v[l04
48 Line regulation 电源调整率 4xAlaOw5M
49 load regulation 负载调整率 CSX $Pk*
50 Lot Number 批号 Y)4Nydq
51 Low Dropout 低压差 c~L6fvS
52 Miller 密勒 53 node 节点 Dt~}9HrU
54 Non-Inverting 非反相 8SCW.;0
55 novel 新颖的 $?/Xk%d+
56 off state 关断状态 \_I)loPc8
57 Operating supply voltage 电源工作电压 SJ~I
r #
58 out drive stage 输出驱动级 d*\C^:Z
59 Out of Phase 异相 X %9xu c
60 Part Number 产品型号 N>}K+M>
61 pass transistor pass transistor 0w[0%:R ^
62 P-channel MOSFET P沟道MOSFET 4QKE{0NE
63 Phase margin 相位裕度 jC Kt;lj
64 Phase Node 开关节点 &zh+:TRm
65 portable electronics 便携式电子设备 gh #w%g1g
66 power down 掉电 kO3k| 6f=
67 Power Good 电源正常 -g[*wN8
68 Power Groud 功率地 X+gz+V/
69 Power Save Mode 节电模式 o4[2`m T
70 Power up 上电 s[B6%DI/5
71 pull down 下拉 zIQc#F6\5
72 pull up 上拉 mN'9|`>V>
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） Kf? {GNE7
74 push pull converter 推挽转换器 syN b0LR
75 ramp down 斜降 55\X\>
0C7
76 ramp up 斜升 }AsF\W+5
77 redundant diode 冗余二极管 &!YH"{b
78 resistive divider 电阻分压器 'y M:W cN
79 ringing 振 铃 *r?51*J
80 ripple current 纹波电流 1uge>o&
81 rising edge 上升沿 = ' bmjXu
82 sense resistor 检测电阻 *ckrn>E{h
83 Sequenced Power Supplys 序列电源 FTYLMQ
i
84 shoot-through 直通，同时导通 wpdE I(
85 stray inductances. 杂散电感 ? -F'0-t4%
86 sub-circuit 子电路
[aS)<^
87 substrate 基板 =ci5&B?
88 Telecom 电信 vS t=Ax3]
89 Thermal Information 热性能信息 n p\Q&
90 thermal slug 散热片 K<L%@[gi
91 Threshold 阈值 F",abp!
92 timing resistor 振荡电阻 '
bw , K*
93 Top FET Top FET (Nlm4*{ h
94 Trace 线路，走线，引线 PKM$*_LcGI
95 Transfer function 传递函数 [ 6o :v8&3
96 Trip Point 跳变点 cKYvRe
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） lPN< rgg
98 Under Voltage Lock Out (UVLO) 欠压锁定 |p4OlUq
99 Voltage Reference 电压参考 &'yV:g3 H
100 voltage-second product 伏秒积 s=~7m.m
101 zero-pole frequency compensation 零极点频率补偿 *,[=}v1
102 beat frequency 拍频 iCSM1W3
103 one shots 单击电路 %^%-h} 1
104 scaling 缩放 E|4XQ|B@
105 ESR 等效串联电阻 [Page] K9M.+d4
106 Ground 地电位 >hL'#;:f#
107 trimmed bandgap 平衡带隙 b oOw
K?
108 dropout voltage 压差 kt 3#_d^El
109 large bulk capacitance 大容量电容 ;Kq?*H
110 circuit breaker 断路器 pH:|G
111 charge pump 电荷泵 2[YD&
112 overshoot 过冲 |ShRxE3@'
dVt@D&
印制电路printed circuit WAa1H60VkS
印制线路 printed wiring ;_\
印制板 printed board rLVc<595
印制板电路 printed circuit board %=<NqINM[
印制线路板 printed wiring board h%^kA@3F
印制元件 printed component _r5Ild @n
印制接点 printed contact ?~Ed
n-" Y
印制板装配 printed board assembly "l,EcZRjTz
板 board [k=9 +0p
刚性印制板 rigid printed board 2y7q
x1$C
挠性印制电路 flexible printed circuit :*+BBC
挠性印制线路 flexible printed wiring BB J]>lQ
齐平印制板 flush printed board 2,Dc ]oj
金属芯印制板 metal core printed board }R5&[hxh4t
金属基印制板 metal base printed board uv!qE1z@':
多重布线印制板 mulit-wiring printed board bNU^tL3QZ
塑电路板 molded circuit board yaYt/?|
散线印制板 discrete wiring board L0VR(
微线印制板 micro wire board v
4b`19}
积层印制板 buile-up printed board 0fK|}mm ZA
表面层合电路板 surface laminar circuit : 8<^rP
埋入凸块连印制板 B2it printed board {=4:Tgw
载芯片板 chip on board ye7&y4v+
埋电阻板 buried resistance board KR(ftG'
母板 mother board =<h=">}5'
子板 daughter board 9S1V! Jp
背板 backplane . mrRv8>$
裸板 bare board P1 >X5:
键盘板夹心板 copper-invar-copper board CPeK0(7Zh
动态挠性板 dynamic flex board *dTf(J
静态挠性板 static flex board `gs,JJ6N
可断拼板 break-away planel i4r~eneP
电缆 cable $K fk=@
挠性扁平电缆 flexible flat cable (FFC) R.`J"J0/~
薄膜开关 membrane switch ~2}ICU5
混合电路 hybrid circuit ~MQf($]
厚膜 thick film :|N bk58
厚膜电路 thick film circuit ^Jc0c)*
薄膜 thin film h#ot)m|I
薄膜混合电路 thin film hybrid circuit 3 v$4LY
互连 interconnection 2=M!lB
*
导线 conductor trace line ,VsCRp
齐平导线 flush conductor BD#;3 ?|
传输线 transmission line 0U*"OSpF
跨交 crossover r8 >?-P
板边插头 edge-board contact :uDB3jN[
增强板 stiffener
/?xn
基底 substrate : {Z^ _;Tf
基板面 real estate 8N_rJ)f
导线面 conductor side .Awq(
元件面 component side Q^w]Nj(e_
焊接面 solder side }0>/G?2Yp
导电图形 conductive pattern M=`Se& -M
非导电图形 non-conductive pattern Li^!OHro.
基材 base material oA@^N4PD
层压板 laminate 6&0a?Xu
覆金属箔基材 metal-clad bade material bLF0MVLM
覆铜箔层压板 copper-clad laminate (CCL) 94 @!.11
复合层压板 composite laminate Hv*O9!cC
薄层压板 thin laminate >G~;2K[
基体材料 basis material io3'h:+9s
预浸材料 prepreg +0 |0X {v
粘结片 bonding sheet @cGql=t
预浸粘结片 preimpregnated bonding sheer w! 7/;VJ3d
环氧玻璃基板 epoxy glass substrate t O>qd#I
预制内层覆箔板 mass lamination panel r= aQ S5
内层芯板 core material Qf]!K6eR
粘结层 bonding layer M0
8Y
粘结膜 film adhesive c?",k zo
无支撑胶粘剂膜 unsupported adhesive film CI'5JOqP
覆盖层 cover layer (cover lay) >GUTno$J
增强板材 stiffener material 9Wrcl ai
铜箔面 copper-clad surface -h`0v
去铜箔面 foil removal surface )^sfEYoA
层压板面 unclad laminate surface * ?fBmq[j
基膜面 base film surface f BOG#-a}
胶粘剂面 adhesive faec HI 61rXN F
原始光洁面 plate finish Y|n Tc .A
粗面 matt finish g Mn)<u >
剪切板 cut to size panel a $:N9&P
超薄型层压板 ultra thin laminate Lr:K0A.Ch
A阶树脂 A-stage resin ^%JWc 3jZ
B阶树脂 B-stage resin #JucOWxjY
C阶树脂 C-stage resin rnE 'gH(V'
环氧树脂 epoxy resin g XMkI$ab
酚醛树脂 phenolic resin yQ50f~9
聚酯树脂 polyester resin {!h[@f4
聚酰亚胺树脂 polyimide resin heA\6W:u&
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin cn:VEF:l
丙烯酸树脂 acrylic resin Y,~]ecI
三聚氰胺甲醛树脂 melamine formaldehyde resin S~Q";C[&
多官能环氧树脂 polyfunctional epoxy resin "O
"@HVF@
溴化环氧树脂 brominated epoxy resin _P1-d`b0 a
环氧酚醛 epoxy novolac ')c u/
氟树脂 fluroresin .`XA6e(8KR
硅树脂 silicone resin cTp+M L
硅烷 silane B,T .bgp\
聚合物 polymer $*R9LPpk+
无定形聚合物 amorphous polymer @oNrR$7
结晶现象 crystalline polamer oZt z"B
双晶现象 dimorphism K%B i8d
共聚物 copolymer .*" IJD9
合成树脂 synthetic \-y i#N
热固性树脂 thermosetting resin [Page] a\E]ueVD2j
热塑性树脂 thermoplastic resin jN0v<_PJED
感光性树脂 photosensitive resin H1M>60*
环氧值 epoxy value
P_ g
双氰胺 dicyandiamide +\chHOsw
粘结剂 binder p4 PFoFo2
胶粘剂 adesive pp jrm
固化剂 curing agent LBB [aF,Lr
阻燃剂 flame retardant ~Y[1 Me
遮光剂 opaquer B#yyO>0k]
增塑剂 plasticizers j Xf-+ ;ZQ
不饱和聚酯 unsatuiated polyester sx\7Z#|
聚酯薄膜 polyester JnDR(s4(E
聚酰亚胺薄膜 polyimide film (PI) .O^ |MhBJu
聚四氟乙烯 polytetrafluoetylene (PTFE) D=Y HJ>-wB
增强材料 reinforcing material H< "j3qt
折痕 crease a\MJbB Xv
云织 waviness hlZjk0ez
鱼眼 fish eye IY PLitT
毛圈长 feather length QR)eJ5<
厚薄段 mark ]\U'_G2]
裂缝 split {w++)N2sh
捻度 twist of yarn FCPbp!q6
浸润剂含量 size content VrK 5a9*^
浸润剂残留量 size residue =g:\R$lQ
处理剂含量 finish level . 9ne'Ta
偶联剂 couplint agent I1,?qr"Zr
断裂长 breaking length X(\RA.64
吸水高度 height of capillary rise S EmD's
湿强度保留率 wet strength retention xT/&'$@{)
白度 whitenness .^23qCs
导电箔 conductive foil A5b}G
铜箔 copper foil Ih0GzyU*4
压延铜箔 rolled copper foil 4]GyuY
光面 shiny side jI%yi-<;
粗糙面 matte side rgCId@R
处理面 treated side 53QP~[F8R]
防锈处理 stain proofing Sy_M!`B
双面处理铜箔 double treated foil X)~- MY*p
模拟 simulation 7^F?ke y?
逻辑模拟 logic simulation j X%Q
电路模拟 circit simulation OsXQWSkj~
时序模拟 timing simulation tdm /U
模块化 modularization R )=<q] Ms
设计原点 design origin +j,;g #d
优化（设计） optimization (design) Sa0\9 3oa
供设计优化坐标轴 predominant axis -_3.]o/J
表格原点 table origin 3A5" %
元件安置 component positioning jv ";?*I6.
比例因子 scaling factor KB^IGF
扫描填充 scan filling >7 |37a
矩形填充 rectangle filling ]x|sT Kv2
填充域 region filling dj=n1f+;[
实体设计 physical design IYWD_}_
$
逻辑设计 logic design ?S_S.Bd
逻辑电路 logic circuit v:chr$>j5
层次设计 hierarchical design - M]C- $
自顶向下设计 top-down design ;3!TOY"j;e
自底向上设计 bottom-up design -[ =`bHo
费用矩阵 cost metrix &Ru6Yt0W
元件密度 component density qv:WC
TAn
自由度 degrees freedom .jCdJ
=z
出度 out going degree e|I5Nx2)
入度 incoming degree C9h8d
曼哈顿距离 manhatton distance :X^B1z3X4
欧几里德距离 euclidean distance Q|>y2g!
网络 network F~B8XUa3
阵列 array _ AFgx8
段 segment pnD#RvmW2e
逻辑 logic #ua#$&p
逻辑设计自动化 logic design automation }IV7dKz l
分线 separated time QMIXz [9w
分层 separated layer UX?_IgJh<"
定顺序 definite sequence K"pfp !Y
导线（通道） conduction (track) *M="k 1P1
导线（体）宽度 conductor width p7*\]HyE)
导线距离 conductor spacing p"T4;QBxQ
导线层 conductor layer loZfzN&6A
导线宽度/间距 conductor line/space vn8Ez6<27
第一导线层 conductor layer No.1 m*'#`v Ibb
圆形盘 round pad Kl* ##qw !
方形盘 square pad b7$?'neH/.
菱形盘 diamond pad M 1^pW 6 3
长方形焊盘 oblong pad 3laSPih [.
子弹形盘 bullet pad h41v}5!-
泪滴盘 teardrop pad 0<Y)yNsV
雪人盘 snowman pad *}?^)z7w
形盘 V-shaped pad V Po2YDj`
环形盘 annular pad k: {$M yK
非圆形盘 non-circular pad u@ o3p*bQ
隔离盘 isolation pad ?0.+DB
$
非功能连接盘 monfunctional pad MG ~^>
偏置连接盘 offset land +h
=lAHn&
腹（背）裸盘 back-bard land 8Vq,J :+
盘址 anchoring spaur ^}WeB U
连接盘图形 land pattern W>"i0p
连接盘网格阵列 land grid array ;{>z\6N
孔环 annular ring QoqdPk#1
元件孔 component hole 03,+uf
安装孔 mounting hole ? 0%lB=qQ
支撑孔 supported hole (\Dd9a8V-
非支撑孔 unsupported hole "^u|vCqw
导通孔 via 43/|[
镀通孔 plated through hole (PTH) Y A;S'dxY
余隙孔 access hole
~d
} -
盲孔 blind via (hole) 5L4~7/kj
埋孔 buried via hole `T-(g1:9
埋,盲孔 buried blind via $N+azal+y
任意层内部导通孔 any layer inner via hole kJ~^
}o
全部钻孔 all drilled hole T- 27E $0
定位孔 toaling hole RY*6TYX!
无连接盘孔 landless hole 2LgRgY{Bl
中间孔 interstitial hole r+) A)a,
无连接盘导通孔 landless via hole d=xweU<
引导孔 pilot hole }C)
端接全隙孔 terminal clearomee hole PPohpdd)
准尺寸孔 dimensioned hole [Page] A}$A~g5 Ap
在连接盘中导通孔 via-in-pad GwpJxiFgk
孔位 hole location j88H3bi0
孔密度 hole density T IS}'c'C
孔图 hole pattern ;'nu9FU*O
钻孔图 drill drawing W1Ht8uYG3
装配图assembly drawing ~_R=2t{u _
参考基准 datum referan }lWEbQ)(!
1） 元件设备 Xh){ W~ -
byd[pnI$H
三绕组变压器：three-column transformer ThrClnTrans sB /*gO
双绕组变压器：double-column transformer DblClmnTrans z7J#1q~:yY
电容器：Capacitor |,qz7dp e
并联电容器：shunt capacitor vK| d P3
电抗器：Reactor Wvcj\2'yd
母线：Busbar wJ+"JQY.J+
输电线：TransmissionLine @ij}|k%*
发电厂：power plant W[+E5I
断路器：Breaker K^9!Qp
刀闸(隔离开关)：Isolator c,e
0+
分接头：tap 0e 3 aWn
电动机：motor OrHnz981K
（2） 状态参数 Nk]r2^. z[
eRD s?n3F
有功：active power zX(p\ NU
无功：reactive power 2c} >} A 4
电流：current r lW
容量：capacity !30 BZM ^
电压：voltage (0^u
档位：tap position 7ej" q
有功损耗：reactive loss l 4(-yWC$H
无功损耗：active loss z$;z&X$j
功率因数：power-factor !x|Ok'izDL
功率：power q
S2#=
功角：power-angle Zs)HzOP)9
电压等级：voltage grade RBiDU}j
空载损耗：no-load loss 3%'$AM}+s
铁损：iron loss }F** !%4d
铜损：copper loss 'R? ;T[s%
空载电流：no-load current ]*Zg(YA
阻抗：impedance p ^T0(\1
正序阻抗：positive sequence impedance 1[/X$DyaK
负序阻抗：negative sequence impedance
5G= 2=E
零序阻抗：zero sequence impedance {B uh5U,
电阻：resistor Fn$EP:>
电抗：reactance TDA+ rl
电导：conductance ,+%$vV
.g\
电纳：susceptance umK ~K!i
无功负载：reactive load 或者QLoad <SOC
有功负载: active load PLoad BY6QJkI9 x
遥测：YC(telemetering) r `V Kb
遥信：YX W8R@Pf
励磁电流(转子电流)：magnetizing current $D\SueZ
定子：stator JT, 8/o
功角：power-angle o|(-0mWBQA
上限:upper limit ^HQg$}=
下限：lower limit b$H{| [
并列的：apposable C4]v q+
高压: high voltage QVm3(;&'
低压：low voltage j;)U5X
中压：middle voltage #:e52=
电力系统 power system +.NopI3:
发电机 generator n ;y<!L7
励磁 excitation v 4D F
#O
励磁器 excitor T[;O K
电压 voltage },e f(
电流 current j[v<xo
母线 bus *dL!)+:d
变压器 transformer H~e;S#3_v
升压变压器 step-up transformer Ft#d &
I
高压侧 high side 2mWW0txil
输电系统 power transmission system ![P1Qv p
输电线 transmission line b<~\ IPY
固定串联电容补偿fixed series capacitor compensation Ir }r98lz
稳定 stability ;*[nZV>
电压稳定 voltage stability ]]J2#mN:n
功角稳定 angle stability oyi EOC
暂态稳定 transient stability ng; ,;o.
电厂 power plant E ?m(&O
j
能量输送 power transfer wWQv]c%
交流 AC HE,# pj(D
装机容量 installed capacity ,nD:W
电网 power system !Y8us"
落点 drop point i"p)%q~ z
开关站 switch station LkD$\i
双回同杆并架 double-circuit lines on the same tower !U/iY%NE
变电站 transformer substation 6Xu8~%i
补偿度 degree of compensation %XM wjBM
高抗 high voltage shunt reactor y+hC !-
无功补偿 reactive power compensation <b~KR8
故障 fault @2yi%_ ]h
调节 regulation JBo/<W#|
裕度 magin mp:%k\cF|
三相故障 three phase fault u_[s+ J/
故障切除时间 fault clearing time >gtKyn]
极限切除时间 critical clearing time >jD,%yG
切机 generator triping QWp,(Mv:r
高顶值 high limited value SQ9s
强行励磁 reinforced excitation &'u Fy0d,
线路补偿器 LDC(line drop compensation) @kw#\%Uz
机端 generator terminal ],YIEOx6
静态 static (state) /f@VRME
动态 dynamic (state) ^Qt4}V=
单机无穷大系统 one machine - infinity bus system 7{e0^V,\k
机端电压控制 AVR hqd}L~o:
电抗 reactance E5(\/;[*`
电阻 resistance rV>/: FG
功角 power angle po~V{>fUm
有功（功率） active power i/N4uq}'A<
无功（功率） reactive power 03Pa; n
功率因数 power factor ~3< Li}W
无功电流 reactive current { K'QE0'x
下降特性 droop characteristics [XK Ke
斜率 slope :biM}L
额定 rating n>T1KC %
变比 ratio .>NhC"
参考值 reference value Rd7Xs
电压互感器 PT Fsv:SL+5
分接头 tap (=c R;\s<
下降率 droop rate d~1Nct$:
仿真分析 simulation analysis E$"( :%'v
传递函数 transfer function BQq,,i8H
框图 block diagram ;gfY_MXnF
受端 receive-side `@eo <6
裕度 margin Ch8w_Jf1yx
同步 synchronization >Ng7q?h
失去同步 loss of synchronization -h+=^ ,
阻尼 damping WlVp|s{TYP
摇摆 swing &"]Uh
保护断路器 circuit breaker d5mhk[p7\J
电阻：resistance *)+1BYMo
电抗：reactance T|dQY~n~
阻抗：impedance !mLQdkTE
电导：conductance F[uy'~;@
电纳：susceptance
