1 backplane 背板 vMDX
2 Band gap voltage reference 带隙电压参考 s]tBd!~
3 benchtop supply 工作台电源 7'pmW,;
4 Block Diagram 方块图 5 Bode Plot 波特图 !!jitFHzb
6 Bootstrap 自举 Pz=x$aY
7 Bottom FET Bottom FET ~Ogtgr
8 bucket capcitor 桶形电容 **].d;~[l
9 chassis 机架 tC4:cX
10 Combi-sense Combi-sense =\t%U5
11 constant current source 恒流源 G`a,(<kT;
12 Core Sataration 铁芯饱和 ?0ezr[`.
13 crossover frequency 交叉频率 GT -(r+u
14 current ripple 纹波电流 xaM?
B7
15 Cycle by Cycle 逐周期 lphELPh
16 cycle skipping 周期跳步 F5*NK!U
17 Dead Time 死区时间 <c,/+
lQ^
18 DIE Temperature 核心温度 M[;N6EJH
19 Disable 非使能,无效,禁用,关断 V_>)m3zsL
20 dominant pole 主极点 NI@$"
21 Enable 使能,有效,启用 "agc*o~!F
22 ESD Rating ESD额定值 N33{vx
23 Evaluation Board 评估板 e)(m0m\
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. &8l4A=l$
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 qWQ7:*DL
25 Failling edge 下降沿 nJdO~0}3
26 figure of merit 品质因数 ^m3[mY [a
27 float charge voltage 浮充电压 ZL0':7
28 flyback power stage 反驰式功率级 h-^7cHI}
29 forward voltage drop 前向压降 m((A
30 free-running 自由运行 f9Vxtd
31 Freewheel diode 续流二极管 UUzu`>upB
32 Full load 满负载 33 gate drive 栅极驱动 uV\ _j3,2
34 gate drive stage 栅极驱动级 *zf@J'
35 gerber plot Gerber 图 c|kQ3(
36 ground plane 接地层 vPVA^UPNV
37 Henry 电感单位:亨利 Kn#3^>D
38 Human Body Model 人体模式 U?MKZL7
39 Hysteresis 滞回 :%#(<@ {
40 inrush current 涌入电流 ~-"<)XPe
41 Inverting 反相 |;L%hIR[
42 jittery 抖动 OT&mNE4
43 Junction 结点 [vIHYp
44 Kelvin connection 开尔文连接 `&)khxT/
45 Lead Frame 引脚框架 `=]I-5#.W
46 Lead Free 无铅 _` %z
47 level-shift 电平移动 .kBZ(`K
48 Line regulation 电源调整率 [5v[Zqud
49 load regulation 负载调整率 $
}u,uI
50 Lot Number 批号 #-QQ_
51 Low Dropout 低压差 YWfw%p?n"
52 Miller 密勒 53 node 节点 o'W[v0>
L-
54 Non-Inverting 非反相 JsOu
*9R
55 novel 新颖的 }tH$/-qnJE
56 off state 关断状态 67uUeCW
57 Operating supply voltage 电源工作电压 KUC (n!
58 out drive stage 输出驱动级 EZm6WvlxSI
59 Out of Phase 异相 Y)x(+#
60 Part Number 产品型号 t"0Z=`Wi
61 pass transistor pass transistor cuJ%;q=;
62 P-channel MOSFET P沟道MOSFET t~xp&LQiY
63 Phase margin 相位裕度 FW)G5^Tf
64 Phase Node 开关节点 XO)|l8t#$=
65 portable electronics 便携式电子设备 7Y:~'&U|
66 power down 掉电 FFT h}>>
67 Power Good 电源正常 09Sy-
je*/
68 Power Groud 功率地 C|kZT<,]
69 Power Save Mode 节电模式 q4XS
E,
70 Power up 上电 >?b9Xh
71 pull down 下拉 yqpb_h9
72 pull up 上拉 Ea%}VZ&[
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 8ODrW!o
74 push pull converter 推挽转换器 p]d3F^*i
75 ramp down 斜降 hWGCYkuW
76 ramp up 斜升 33O@jbs@
77 redundant diode 冗余二极管 su~_l[6
78 resistive divider 电阻分压器 ,+0>p
79 ringing 振 铃 P)?)H]J"
80 ripple current 纹波电流 Xa._
81 rising edge 上升沿 O!!Ne'I
82 sense resistor 检测电阻 hJ0)"OA5
83 Sequenced Power Supplys 序列电源 neGCMKtzlJ
84 shoot-through 直通,同时导通 Ku{DdiTg>
85 stray inductances. 杂散电感 ;;E "+.
86 sub-circuit 子电路 b {e nD
87 substrate 基板 X0X!:gX
88 Telecom 电信 7Zl-|
89 Thermal Information 热性能信息 .7-Yu1{2
90 thermal slug 散热片 g)+45w*+5
91 Threshold 阈值 CqVh9M.ah
92 timing resistor 振荡电阻 $wa )e
93 Top FET Top FET H4'xxsx
94 Trace 线路,走线,引线 'J^E|1P
95 Transfer function 传递函数 :('7ly!h
96 Trip Point 跳变点 .^^YS$%%7
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) rJJI<{$
98 Under Voltage Lock Out (UVLO) 欠压锁定 LEMgRI`rf
99 Voltage Reference 电压参考 t@-:e^ v
100 voltage-second product 伏秒积 ^+:_S9qst
101 zero-pole frequency compensation 零极点频率补偿 rvRtR/*?j
102 beat frequency 拍频 _p vL b
103 one shots 单击电路 SE+K"faKQ
104 scaling 缩放 C !81Km5
105 ESR 等效串联电阻 [Page] v7VJVLH,I7
106 Ground 地电位 %p?u
^ rq
107 trimmed bandgap 平衡带隙 7>EjP&l
108 dropout voltage 压差 .Ev i
109 large bulk capacitance 大容量电容 }5^j08
110 circuit breaker 断路器 Fs7/3
111 charge pump 电荷泵 6C>x,kU
112 overshoot 过冲 emb~l{K $
]*-9zo0
印制电路printed circuit _$"qC[.
印制线路 printed wiring aX6.XHWbDf
印制板 printed board u79.`,Ad&
印制板电路 printed circuit board >4=sEj
印制线路板 printed wiring board ]J)WcM:
印制元件 printed component ~DcX}VCm
印制接点 printed contact Y;S+2])R2
印制板装配 printed board assembly R%XbO~{u
板 board =x}27f%-Mg
刚性印制板 rigid printed board !<}<HR^)
挠性印制电路 flexible printed circuit /AWV@'
挠性印制线路 flexible printed wiring J\XYUs
齐平印制板 flush printed board a;m-Vu!
金属芯印制板 metal core printed board eu~WFI
金属基印制板 metal base printed board oUR'gc :
多重布线印制板 mulit-wiring printed board g+p?J.+
塑电路板 molded circuit board /r Zj=
散线印制板 discrete wiring board R1/)Yy
微线印制板 micro wire board MzsDWx;eJ
积层印制板 buile-up printed board ^3IO.`|
表面层合电路板 surface laminar circuit PMjqcdBzm
埋入凸块连印制板 B2it printed board 95>(NwST4
载芯片板 chip on board \MQ|(
埋电阻板 buried resistance board 6~V$0Y>]
母板 mother board &%L1n?>Q}
子板 daughter board "'-f?kZ
背板 backplane &V$_u#<
裸板 bare board T?:Vw laE
键盘板夹心板 copper-invar-copper board 5`*S'W}\>
动态挠性板 dynamic flex board B*(BsXQLY
静态挠性板 static flex board GT7&>}FJ)
可断拼板 break-away planel OdbXna
电缆 cable |}? H$d
挠性扁平电缆 flexible flat cable (FFC) %M3L<2
薄膜开关 membrane switch &,P; 7 R
混合电路 hybrid circuit K491QXG
厚膜 thick film _N {4Rs0
厚膜电路 thick film circuit YkFAu8b>
薄膜 thin film g< xE}[gF
薄膜混合电路 thin film hybrid circuit d_,Ql708f
互连 interconnection fK6[ p&
导线 conductor trace line + ZKU2N*
齐平导线 flush conductor ;F|#m,2Q-
传输线 transmission line ?fN6_x2e3
跨交 crossover i)$P1h
板边插头 edge-board contact kY?tUpM!TB
增强板 stiffener '?jsH+j+
基底 substrate Xj{gyLs
基板面 real estate #*q]^Is"
导线面 conductor side Y7zs)W8xTT
元件面 component side &~Y%0&F,&
焊接面 solder side &09&;KJ
导电图形 conductive pattern =;4K5l{c
非导电图形 non-conductive pattern cQ]c!G|a4
基材 base material
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层压板 laminate @ta:9wZ
覆金属箔基材 metal-clad bade material sv!zY= 6
覆铜箔层压板 copper-clad laminate (CCL) Gy[anDE&
复合层压板 composite laminate c4u/tt.)
薄层压板 thin laminate <(@Z#%O9)
基体材料 basis material {i+
o'Lw
预浸材料 prepreg !u'xdV+bf
粘结片 bonding sheet gD51N()s,
预浸粘结片 preimpregnated bonding sheer u]Q}jqiq"
环氧玻璃基板 epoxy glass substrate S6}_N/;6~
预制内层覆箔板 mass lamination panel 064k;|>D
内层芯板 core material b*(K;`9)B
粘结层 bonding layer PZQAlO,
粘结膜 film adhesive c~4Cpy^
无支撑胶粘剂膜 unsupported adhesive film QJj='+R>
覆盖层 cover layer (cover lay) !uoT8BBAk
增强板材 stiffener material HE35QH@/`
铜箔面 copper-clad surface .^M#BAt2
去铜箔面 foil removal surface +SF+$^T
层压板面 unclad laminate surface I-/>M/66
基膜面 base film surface `Th~r&GvF
胶粘剂面 adhesive faec HAL\j5i
原始光洁面 plate finish ;<q2
粗面 matt finish 78{9@\e"0
剪切板 cut to size panel ii_kgqT^
超薄型层压板 ultra thin laminate "AZ|u#0P
A阶树脂 A-stage resin .8Bu%Sf
B阶树脂 B-stage resin G^tazAEfo
C阶树脂 C-stage resin P
JATRJ1.
环氧树脂 epoxy resin jC_'6sc`
酚醛树脂 phenolic resin ;py9,Wno
聚酯树脂 polyester resin >O<a9wz
聚酰亚胺树脂 polyimide resin #Lpw8b6
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin L{P'mG=4
丙烯酸树脂 acrylic resin ZM})l9_o"
三聚氰胺甲醛树脂 melamine formaldehyde resin dVYY:1PS
多官能环氧树脂 polyfunctional epoxy resin "5L?RkFi\
溴化环氧树脂 brominated epoxy resin ZT@=d$Z&t
环氧酚醛 epoxy novolac (D%vN&F
氟树脂 fluroresin f*<Vq:N=\
硅树脂 silicone resin hcj]T?
硅烷 silane J}&U[ds p
聚合物 polymer 0uIY6e0E
无定形聚合物 amorphous polymer )2RRa^=&
结晶现象 crystalline polamer vRH^en
双晶现象 dimorphism r&m49N,d
共聚物 copolymer rbnAC*y8'L
合成树脂 synthetic
:`NZD
热固性树脂 thermosetting resin [Page] Nd]F 33|X
热塑性树脂 thermoplastic resin j&,Gv@
感光性树脂 photosensitive resin _,!0_\+i
环氧值 epoxy value gy%.+!4>v`
双氰胺 dicyandiamide OA*O =
粘结剂 binder W]#w4Fp!
胶粘剂 adesive {QM rgyQE
固化剂 curing agent w")
G:K
阻燃剂 flame retardant !DzeJWM|
遮光剂 opaquer 8 7(t<3V&
增塑剂 plasticizers I)V=$r{
不饱和聚酯 unsatuiated polyester 0:
a2ER|J
聚酯薄膜 polyester |J,zU6t
聚酰亚胺薄膜 polyimide film (PI) nf^?X`g
聚四氟乙烯 polytetrafluoetylene (PTFE) pe
vXixl
增强材料 reinforcing material TdgK.g 4
折痕 crease ]CF-#q}'
云织 waviness zI4rAsysL
鱼眼 fish eye _i {Y0d+
毛圈长 feather length -$W1wb9z
厚薄段 mark Tk?uJIS :
裂缝 split &'$Bk5 D@G
捻度 twist of yarn /Ne#{*z)hO
浸润剂含量 size content >2znn&gZ
浸润剂残留量 size residue =}#yi<Lt
处理剂含量 finish level salC4z3
偶联剂 couplint agent YK)m6zW5
断裂长 breaking length B^/MwD>%
吸水高度 height of capillary rise vSR&>Q%X
湿强度保留率 wet strength retention w2.]
3QAZ
白度 whitenness -y-}g[`
导电箔 conductive foil VKl,m ;&