1 backplane 背板 9[c%J*r
2 Band gap voltage reference 带隙电压参考 1?*
3 benchtop supply 工作台电源 jOpcV|2
4 Block Diagram 方块图 5 Bode Plot 波特图 VQ5nq'{v
6 Bootstrap 自举 I\~G|B
7 Bottom FET Bottom FET %?^6).aEK
8 bucket capcitor 桶形电容 z@Q@^
&0Mr
9 chassis 机架 [%Bf<
J<
10 Combi-sense Combi-sense Uo12gIX
11 constant current source 恒流源 h7*W*Bd
12 Core Sataration 铁芯饱和 @yXfBML?]
13 crossover frequency 交叉频率 <<](XgR(
14 current ripple 纹波电流 r_e7a6
15 Cycle by Cycle 逐周期 ^EG\iO2X
16 cycle skipping 周期跳步
c gzwx
17 Dead Time 死区时间 ;w|b0V6
18 DIE Temperature 核心温度 P}ok*{"J<>
19 Disable 非使能,无效,禁用,关断 KDl_?9E5
20 dominant pole 主极点 9Y>8=#.c
21 Enable 使能,有效,启用 DrnJ;Hi"
22 ESD Rating ESD额定值 mC?i}+4>4R
23 Evaluation Board 评估板 N>(g?A;
Z+
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ay "'#[
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 T,xPSN2A*
25 Failling edge 下降沿 kg@>;(V&
26 figure of merit 品质因数 Ev7J+TmXM
27 float charge voltage 浮充电压 -C(b,F%%
28 flyback power stage 反驰式功率级 M?b6'd9f
29 forward voltage drop 前向压降 )ZrS{vY
30 free-running 自由运行 O=SkAsim
31 Freewheel diode 续流二极管 %AOja+
32 Full load 满负载 33 gate drive 栅极驱动 MX4]Vpv
34 gate drive stage 栅极驱动级 PP:(EN1
35 gerber plot Gerber 图 r]3'74j:
36 ground plane 接地层 E*L iM5+I
37 Henry 电感单位:亨利 N]KxAttt
38 Human Body Model 人体模式 _k8A$s<d
39 Hysteresis 滞回 lEHzyh}2k
40 inrush current 涌入电流 [7_56\G4
41 Inverting 反相 yV_4?nh
42 jittery 抖动 S=_vv)6+4
43 Junction 结点 w
=.Fj
44 Kelvin connection 开尔文连接 nhIa175'
45 Lead Frame 引脚框架 !mWiYpbU+
46 Lead Free 无铅 O6IB.
>T
47 level-shift 电平移动 \J+*
48 Line regulation 电源调整率 "4vy lHIo
49 load regulation 负载调整率 s
w39\urf
50 Lot Number 批号 J|'7_0OAx
51 Low Dropout 低压差 G8Nt
8U~
52 Miller 密勒 53 node 节点 +w=AJdc
54 Non-Inverting 非反相 /axIIfx-
55 novel 新颖的 gTA%uRBa
56 off state 关断状态 DW)2 m;
57 Operating supply voltage 电源工作电压 'v]u#/7a
58 out drive stage 输出驱动级 6mKjau{r_
59 Out of Phase 异相 dCj,b$
60 Part Number 产品型号 `--TP
61 pass transistor pass transistor K&8dA0i2u2
62 P-channel MOSFET P沟道MOSFET 3O7!`Nm@
63 Phase margin 相位裕度 _`64gS}^
64 Phase Node 开关节点 }Tf9S<xpq3
65 portable electronics 便携式电子设备 wdUBg*X8
66 power down 掉电 QWMdn
67 Power Good 电源正常 [s&$l G!
68 Power Groud 功率地 ^pJ!isuqu
69 Power Save Mode 节电模式 C@jJ.^
<<
70 Power up 上电 f>aRkTHf
71 pull down 下拉 |&Ym@Jyj
72 pull up 上拉 0ez(A
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 6xD#?
74 push pull converter 推挽转换器 O(+phRwJ
75 ramp down 斜降 u|4$+QiD
76 ramp up 斜升 %/9
EORdeH
77 redundant diode 冗余二极管 `'V4PUe
78 resistive divider 电阻分压器 XS$OyW_Q
79 ringing 振 铃 7O,U?p
80 ripple current 纹波电流 Bdj%hyW
81 rising edge 上升沿 |j 6OM{@
82 sense resistor 检测电阻 ]O]GeAGC2
83 Sequenced Power Supplys 序列电源 |=&cQRY!p
84 shoot-through 直通,同时导通 0{#8',*}m?
85 stray inductances. 杂散电感 P;k0W>~k
86 sub-circuit 子电路 sJ]taY ou
87 substrate 基板 :O(^w}sle
88 Telecom 电信 =zyC-;r!
89 Thermal Information 热性能信息 qL,tYJ<m%
90 thermal slug 散热片 !"eIV@7
91 Threshold 阈值 AE} )o)B
92 timing resistor 振荡电阻 CZ nOui
93 Top FET Top FET hUYd0qEbEt
94 Trace 线路,走线,引线 %'[&U# -
95 Transfer function 传递函数 f%V4pzOc"
96 Trip Point 跳变点 A'2w>8
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) RIIitgV_
98 Under Voltage Lock Out (UVLO) 欠压锁定 Y +Fljr*
99 Voltage Reference 电压参考 NMA}Q$o
s
100 voltage-second product 伏秒积 YfRkwKjy(
101 zero-pole frequency compensation 零极点频率补偿 C:Hoq(
102 beat frequency 拍频 o`Ta("9^
103 one shots 单击电路 &gjF4~W]
104 scaling 缩放 !E T~KL!
105 ESR 等效串联电阻 [Page] fJ ,1Ef;Z
106 Ground 地电位 ",!1m7[wF
107 trimmed bandgap 平衡带隙 J9=m]R8T
108 dropout voltage 压差 9]e V?yoA8
109 large bulk capacitance 大容量电容 u?9" jX
110 circuit breaker 断路器 6C-z=s)P&
111 charge pump 电荷泵 i\dc>C ;
112 overshoot 过冲 ~V$|i"
mW:!M!kk
印制电路printed circuit z`\F@pX%wC
印制线路 printed wiring x:QgjK
印制板 printed board zD<or&6
印制板电路 printed circuit board f4BnX(1u
印制线路板 printed wiring board VqS#waNrx
印制元件 printed component |_yYLYH'
印制接点 printed contact xKFn.qFr
印制板装配 printed board assembly &9Xhl''
板 board 0@EwM
刚性印制板 rigid printed board Z.M,NR
挠性印制电路 flexible printed circuit #y%!\1M/:A
挠性印制线路 flexible printed wiring ~j<+k4I~
齐平印制板 flush printed board i@4~.iZ8
金属芯印制板 metal core printed board k68F-e[i^
金属基印制板 metal base printed board `P9XqWr
多重布线印制板 mulit-wiring printed board U{VCZ*0cj
塑电路板 molded circuit board (<)]sp2
散线印制板 discrete wiring board ldp%{"ZZ
微线印制板 micro wire board KjQR$-
积层印制板 buile-up printed board Ovj^IjG-`
表面层合电路板 surface laminar circuit RoyPrO [3
埋入凸块连印制板 B2it printed board S*n@81Z
载芯片板 chip on board NM06QzE
埋电阻板 buried resistance board /FIE:Io
母板 mother board W]nSR RWco
子板 daughter board A$w4PVS
背板 backplane PnoPbk[<
裸板 bare board tQylT0'[+o
键盘板夹心板 copper-invar-copper board 0D&t!$Ibf
动态挠性板 dynamic flex board )4&cph';
静态挠性板 static flex board ?|39u{
可断拼板 break-away planel u&n'
ITH
电缆 cable cra+T+|>Kc
挠性扁平电缆 flexible flat cable (FFC) o9H^?Rut
薄膜开关 membrane switch pbU!dOU~e
混合电路 hybrid circuit =X.9,$Y
厚膜 thick film Cm\6tD
厚膜电路 thick film circuit beu\cV3
薄膜 thin film qu-/"w<3$
薄膜混合电路 thin film hybrid circuit DrO2 y
互连 interconnection +mp@b942*
导线 conductor trace line 9F*+YG!
齐平导线 flush conductor )'4k|@8|
传输线 transmission line 67VT\f
跨交 crossover iURk=*Z=
板边插头 edge-board contact fF V!)Zj
增强板 stiffener )lZp9O
基底 substrate YWxc-fPZ
基板面 real estate
0gfA#|'
导线面 conductor side zNIsf"
元件面 component side u,w:SM@*(
焊接面 solder side ivW(*c
导电图形 conductive pattern YE9,KVV;$n
非导电图形 non-conductive pattern iV eC=^1
基材 base material .Fa4shNV
层压板 laminate (owrdPT!
覆金属箔基材 metal-clad bade material P`e!Z:
覆铜箔层压板 copper-clad laminate (CCL) &w1P\4?G
复合层压板 composite laminate wV^V]c ?U
薄层压板 thin laminate zBe8,, e
基体材料 basis material QJ7L7S
预浸材料 prepreg G3{=@Z1
粘结片 bonding sheet INyk3`FT
预浸粘结片 preimpregnated bonding sheer }eRD|1
环氧玻璃基板 epoxy glass substrate g=$1cC+(
预制内层覆箔板 mass lamination panel pf_mf.
内层芯板 core material r!{LLc}>
粘结层 bonding layer `2PLWo
粘结膜 film adhesive x4/M}%h!;B
无支撑胶粘剂膜 unsupported adhesive film 6KOlY>m]
覆盖层 cover layer (cover lay) _z1(y}u}
增强板材 stiffener material Z%n(O(^L
铜箔面 copper-clad surface &JtV'@>v
去铜箔面 foil removal surface q|LDo~H
层压板面 unclad laminate surface V@\%)J'g
基膜面 base film surface W[^qa5W<FB
胶粘剂面 adhesive faec dH^ <t,v
原始光洁面 plate finish [l8jRT=R
粗面 matt finish rQaxr!
剪切板 cut to size panel Yp:KI7
超薄型层压板 ultra thin laminate jvQ*t_L
A阶树脂 A-stage resin xSBc-u#< G
B阶树脂 B-stage resin QurW/a
C阶树脂 C-stage resin l}lIi8
环氧树脂 epoxy resin bpxeznz
酚醛树脂 phenolic resin &zuG81F6
聚酯树脂 polyester resin Kk{<@v)
聚酰亚胺树脂 polyimide resin V}zEK0n(6
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin D2,z)O%VK
丙烯酸树脂 acrylic resin I'@Ydt2
三聚氰胺甲醛树脂 melamine formaldehyde resin jr`Es s
多官能环氧树脂 polyfunctional epoxy resin 6HlePTf8
溴化环氧树脂 brominated epoxy resin +tD[9b!
m
环氧酚醛 epoxy novolac }@^4,FKJ
氟树脂 fluroresin Q"7Gy<
硅树脂 silicone resin d`/tE?Gw
硅烷 silane is@b&V]
聚合物 polymer _{ZqO;[u
无定形聚合物 amorphous polymer L*x[?x;)@
结晶现象 crystalline polamer MX ;J5(Ae
双晶现象 dimorphism EMc;^ d
共聚物 copolymer l#}.^71+
合成树脂 synthetic ?PyG/W
热固性树脂 thermosetting resin [Page] ]7rj/l$u
热塑性树脂 thermoplastic resin hnznp1[#@
感光性树脂 photosensitive resin +/ &_v^sC;
环氧值 epoxy value H`geS
双氰胺 dicyandiamide rgOfNVyJG<
粘结剂 binder %H+\>raLz
胶粘剂 adesive po}F6m8bX
固化剂 curing agent ZZyDG9a>7
阻燃剂 flame retardant Vy|6E#U
遮光剂 opaquer OGY"<YH6
增塑剂 plasticizers U5r7j
不饱和聚酯 unsatuiated polyester o^V(U~m]
聚酯薄膜 polyester kVD(Q~<
聚酰亚胺薄膜 polyimide film (PI) ?Q72 ;/$
聚四氟乙烯 polytetrafluoetylene (PTFE) W\L`5CW
增强材料 reinforcing material ts8+V<g
折痕 crease TET`b7G
云织 waviness "C*B,D*}:
鱼眼 fish eye {$1J=JbE
毛圈长 feather length _kY#D;`:r
厚薄段 mark ,<Q~b%(3
裂缝 split A Z{^o4<q
捻度 twist of yarn 3<=G?of
浸润剂含量 size content 0j_bh,zG#
浸润剂残留量 size residue &V)6!,rb
处理剂含量 finish level 0n/gd"M
偶联剂 couplint agent (4%YHS8
断裂长 breaking length /o2P+Xr8"
吸水高度 height of capillary rise q}FVzahv
湿强度保留率 wet strength retention OK{xuX8u
白度 whitenness =GXu 5 8
导电箔 conductive foil +L=*:e\j
铜箔 copper foil 0W%@gs5d&
压延铜箔 rolled copper foil u@3y&b
光面 shiny side dCFlM&(i
粗糙面 matte side $ F S_E
处理面 treated side {bPV)RL:
防锈处理 stain proofing z~\t|Z]G,|
双面处理铜箔 double treated foil U #~;)fZ
模拟 simulation wI5Yn
h
逻辑模拟 logic simulation A4QcQ"
电路模拟 circit simulation &ciN@nJ|$z
时序模拟 timing simulation 1+7GUSIb
模块化 modularization SI6B#u-i
设计原点 design origin SAY
f'[|w
优化(设计) optimization (design) 7FF-*2@
供设计优化坐标轴 predominant axis k;5P om
表格原点 table origin v0 Ir#B,[H
元件安置 component positioning _|''{kj(
比例因子 scaling factor :ZDMNhUl
&
扫描填充 scan filling 5ZY)nelc
矩形填充 rectangle filling "+uNmUUnm
填充域 region filling TH &qX
实体设计 physical design k'X;ruQ:tF
逻辑设计 logic design '>(.%@
逻辑电路 logic circuit b5:op@V
层次设计 hierarchical design "EV!>^Z
自顶向下设计 top-down design $M:3 XAN
自底向上设计 bottom-up design 6q>+!kXh
费用矩阵 cost metrix W~Z<1[
元件密度 component density J/A[45OD
自由度 degrees freedom x|KWyfOS
出度 out going degree s9oO%e<
入度 incoming degree j(#%tIv
曼哈顿距离 manhatton distance 9,]5v+
欧几里德距离 euclidean distance z5]bia,
网络 network *U#m+@\0
阵列 array -@&1`@):{
段 segment BN,>&1I
逻辑 logic _#_
E^!
逻辑设计自动化 logic design automation _e!F~V.
分线 separated time voe7l+Xk
分层 separated layer ^S#t|rN
定顺序 definite sequence j'p1q
导线(通道) conduction (track) ^ZTGJ(j7~
导线(体)宽度 conductor width T5O _LCIws
导线距离 conductor spacing MEiRj]t
导线层 conductor layer \.gEh1HW
导线宽度/间距 conductor line/space MP>n)!R[`
第一导线层 conductor layer No.1 V|MY!uV
圆形盘 round pad tD$lNh^
方形盘 square pad Fd\e*ww'
菱形盘 diamond pad MK}-<&v
长方形焊盘 oblong pad Ei({`^
子弹形盘 bullet pad ]+H?@*b`
泪滴盘 teardrop pad Qju`e Eo
雪人盘 snowman pad 4F MAz^
形盘 V-shaped pad V gBk5wk_j|
环形盘 annular pad <f~Fl^^8
非圆形盘 non-circular pad VK3it3FI>3
隔离盘 isolation pad kJ)gP 2E
非功能连接盘 monfunctional pad AAUyy
:
偏置连接盘 offset land "'Z- UV
腹(背)裸盘 back-bard land eXl=i-'
盘址 anchoring spaur ~2_lp^Y
连接盘图形 land pattern G"y.Z2$
连接盘网格阵列 land grid array )fU(AXSP
孔环 annular ring "?.~/@
元件孔 component hole 9j|gdfb%ml
安装孔 mounting hole `xKFqx:e
支撑孔 supported hole \0FT!}
L
非支撑孔 unsupported hole Rn+4DcR
导通孔 via l)+:4N?iVv
镀通孔 plated through hole (PTH) sNU}n<J-
余隙孔 access hole }lZ>
盲孔 blind via (hole) yy(A(}
埋孔 buried via hole +1;'B4
埋,盲孔 buried blind via _ :^7a3I
任意层内部导通孔 any layer inner via hole $1*3!}_0
全部钻孔 all drilled hole }{],GHCjQ
定位孔 toaling hole gY9\o#)<
无连接盘孔 landless hole ~0-g%C?R
中间孔 interstitial hole t"s5\;IJ
无连接盘导通孔 landless via hole ^~L}<]
引导孔 pilot hole u@.>WHQN
端接全隙孔 terminal clearomee hole ;8B.;%qkL
准尺寸孔 dimensioned hole [Page] `EMi0hm&H
在连接盘中导通孔 via-in-pad mgkyC5)d
孔位 hole location M2T| "Q"=
孔密度 hole density >[*4Tjg
孔图 hole pattern "<l<&
qp
钻孔图 drill drawing hRTMFgO
装配图assembly drawing @%W]".*'}
参考基准 datum referan )fh0&Y; R
1) 元件设备 _dU P7H (
5JFV%odo
三绕组变压器:three-column transformer ThrClnTrans Rs$5PdH
双绕组变压器:double-column transformer DblClmnTrans t;#Gmo
电容器:Capacitor h{]#ag5`
并联电容器:shunt capacitor Rf[V)x
电抗器:Reactor {0's~U+@
母线:Busbar h[=nx^
输电线:TransmissionLine YL5>V$i
发电厂:power plant .RRlUWu
断路器:Breaker p#H]\P'
刀闸(隔离开关):Isolator vD=%`G[m
分接头:tap j Selop>N
电动机:motor ^,7=X8Su
(2) 状态参数 k90B!kg
W^xZ+]
有功:active power !dv-8C$U
无功:reactive power aR:<<IF\
电流:current -i_En^Fi
容量:capacity :)P<jX-G
电压:voltage ^Rmoz1d
档位:tap position ]*ov&{'
有功损耗:reactive loss _+zVpZ
无功损耗:active loss (fXq<GXAn/
功率因数:power-factor AMk~dzNt
功率:power eF1.VLI
功角:power-angle * bZ\@Qm
电压等级:voltage grade #pu}y,QN$
空载损耗:no-load loss 7c::Qf[|
铁损:iron loss VG#Q;Xd}
铜损:copper loss ]P*!'iYN(
空载电流:no-load current )vHi|~(
阻抗:impedance B| Q6!
正序阻抗:positive sequence impedance %CT!$Y'n
负序阻抗:negative sequence impedance ]p$zvMf}
零序阻抗:zero sequence impedance $Sb@zLi)
电阻:resistor J~dTVBx
电抗:reactance T}2:.Hk:N
电导:conductance NW De-<fQ
电纳:susceptance pbdF]>\
无功负载:reactive load 或者QLoad k5X b}@
有功负载: active load PLoad !`C%Fkq
遥测:YC(telemetering) dzxI QlP
遥信:YX }jcIDiSu
励磁电流(转子电流):magnetizing current 9cOx@c+/
定子:stator 5bBCpNa
功角:power-angle %O /d4
上限:upper limit I Tn;m
下限:lower limit r|bPR!0
并列的:apposable {_as!5l
高压: high voltage 6J;i,/ky
低压:low voltage ;fx1!:;.
中压:middle voltage f+^c@0que
电力系统 power system xA9V$# d|
发电机 generator ._ih$=
励磁 excitation 5Jw"{V?Ak
励磁器 excitor h60\ Y 8
电压 voltage >p |yf.G
电流 current j ]HE>
母线 bus Zsk?QS FE
变压器 transformer CK Mv7
升压变压器 step-up transformer pVz pN8!
高压侧 high side (uT^Nn9L=
输电系统 power transmission system )"-fHW+fy
输电线 transmission line +{Gw9h"5g*
固定串联电容补偿fixed series capacitor compensation zf7rF}
稳定 stability c85O_J
电压稳定 voltage stability 9C>ynH
功角稳定 angle stability kDg{>mf
暂态稳定 transient stability gDj_KKd
电厂 power plant xiJz`KD&
能量输送 power transfer c&A]pLn+x
交流 AC 8L{$v~ +
装机容量 installed capacity W60Q3
电网 power system uegb;m
落点 drop point &]*|6cR$E
开关站 switch station wmiafBA e
双回同杆并架 double-circuit lines on the same tower X,&xhSzg?
变电站 transformer substation sM0c#YK?
补偿度 degree of compensation QglYU
高抗 high voltage shunt reactor tPzM7
n|
无功补偿 reactive power compensation T7ki/hjRb
故障 fault V-:`+&S{^
调节 regulation j^rYFS
w:Q
裕度 magin o6:45
三相故障 three phase fault \ bC}&Iz6
故障切除时间 fault clearing time j]#wrm
极限切除时间 critical clearing time `TAcZl=8
切机 generator triping Q{8qm<0g
高顶值 high limited value B'!PJj
强行励磁 reinforced excitation OAY8,C=M
线路补偿器 LDC(line drop compensation) 8 `o{b"l+
机端 generator terminal z6Fun
静态 static (state) GU5W|bS
动态 dynamic (state) |o|gP8
单机无穷大系统 one machine - infinity bus system G1p43
机端电压控制 AVR v<%]XHN
电抗 reactance tb:
电阻 resistance bD d_}
功角 power angle /XjN%|
有功(功率) active power TJE%
U0Ln
无功(功率) reactive power H
kSL5@
功率因数 power factor Cv0&prt
无功电流 reactive current 4VC/-.At
下降特性 droop characteristics S\}?zlV
斜率 slope VVgsLQd
额定 rating zLo;.X[Y
变比 ratio FBYll[8
参考值 reference value B,w:DX
电压互感器 PT <r0.ppgY
分接头 tap F
ZM2
下降率 droop rate `B:B7Cpvn
仿真分析 simulation analysis 2B5A!?~>
传递函数 transfer function 2\DTJ`Y,
框图 block diagram Al=(sHc'
受端 receive-side ~v^%ze
裕度 margin jC#`PA3m=
同步 synchronization `Fz\wPd
失去同步 loss of synchronization x GwTk
阻尼 damping v/]Qq
摇摆 swing te4F"SEf
保护断路器 circuit breaker oo;;y,`8py
电阻:resistance kboizJp
电抗:reactance LG"c8Vv&)~
阻抗:impedance |)m*EME
电导:conductance <'yf|N!9G
电纳:susceptance