1 backplane 背板 | 'Ksy{lA
2 Band gap voltage reference 带隙电压参考 hx;0h&L
3 benchtop supply 工作台电源 H+VjY MvK
4 Block Diagram 方块图 5 Bode Plot 波特图 OH` |aqN
6 Bootstrap 自举 R!RgQwEak
7 Bottom FET Bottom FET wf,w%n
8 bucket capcitor 桶形电容 #pWeMt'
9 chassis 机架 p9*Ak
U&]
10 Combi-sense Combi-sense 1u_< 1X3
11 constant current source 恒流源
g6;a2
12 Core Sataration 铁芯饱和 XWf1c ~J
13 crossover frequency 交叉频率 A04E <nr
14 current ripple 纹波电流 DG
6W
^
15 Cycle by Cycle 逐周期 :qK^71gz
16 cycle skipping 周期跳步 [R{%r^"2p
17 Dead Time 死区时间 | @pn=wW
18 DIE Temperature 核心温度 p-2PC{% t|
19 Disable 非使能，无效，禁用，关断 N7dI}ju
20 dominant pole 主极点 ! u=A9i!
21 Enable 使能，有效，启用 ?w>-ya
22 ESD Rating ESD额定值 Hni?r!8r
23 Evaluation Board 评估板 q,.@<s W
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. T1YbF/M'
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 T7ICXpe@
25 Failling edge 下降沿 ^:^8M4:
26 figure of merit 品质因数 )L$)qfQ~x
27 float charge voltage 浮充电压 U
oG+d u[
28 flyback power stage 反驰式功率级 >VB*Xt\C&
29 forward voltage drop 前向压降 pXoT@[}
30 free-running 自由运行 c7t .
31 Freewheel diode 续流二极管 DM3 %+ xY
32 Full load 满负载 33 gate drive 栅极驱动 &&`-A6`p
34 gate drive stage 栅极驱动级 = g$>]AE
35 gerber plot Gerber 图 UR DXyA t
36 ground plane 接地层 v|; }}ol
37 Henry 电感单位：亨利 "uG@gV
38 Human Body Model 人体模式 *.A{p ;JC(
39 Hysteresis 滞回 !)LVZfQ0
40 inrush current 涌入电流 'zfj`aqc
41 Inverting 反相 U$wD'v3pw
42 jittery 抖动 *dX
7
43 Junction 结点 G
q2@37U
44 Kelvin connection 开尔文连接 7uxUqM
45 Lead Frame 引脚框架 \CZD.2p# &
46 Lead Free 无铅 50NLgu E
47 level-shift 电平移动 d\j[O9W>
48 Line regulation 电源调整率 !ZzDSQ ;
49 load regulation 负载调整率 ko`.nSZ-k
50 Lot Number 批号 uu;1B.[b
51 Low Dropout 低压差 3s$vaV~(a
52 Miller 密勒 53 node 节点 )]3_o!o
54 Non-Inverting 非反相 {*AYhZ
55 novel 新颖的 4-~S"T8<u
56 off state 关断状态 W&;,7T8@
57 Operating supply voltage 电源工作电压 V8" m _
58 out drive stage 输出驱动级 m-MfFEZ
59 Out of Phase 异相 rtZEK:.#
60 Part Number 产品型号 t-VU&.Y
61 pass transistor pass transistor xw~ 3x*{
62 P-channel MOSFET P沟道MOSFET L_Lhmtm}m
63 Phase margin 相位裕度 I9O%/^5^[w
64 Phase Node 开关节点 -~WDv[ [
65 portable electronics 便携式电子设备 (Kb_/
66 power down 掉电 p{oc}dWin
67 Power Good 电源正常 wlw`%z-B2
68 Power Groud 功率地 YzeNr*
69 Power Save Mode 节电模式 + vO; J
70 Power up 上电 ((mR' A|`
71 pull down 下拉 R 9b0D>Lxt
72 pull up 上拉 W9/HM !
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） gfly?)V nF
74 push pull converter 推挽转换器 Q ?R3aJ
75 ramp down 斜降 Ktn:6=,
76 ramp up 斜升
} @4by<
77 redundant diode 冗余二极管 F6gU9=F1<
78 resistive divider 电阻分压器 /uJ(W
79 ringing 振 铃 ]jgMN7
80 ripple current 纹波电流 dd:vQOF;
81 rising edge 上升沿 A Y _GD ^
82 sense resistor 检测电阻 :'X: cL
83 Sequenced Power Supplys 序列电源 0Q!/A5z
84 shoot-through 直通，同时导通 _Z_R\
85 stray inductances. 杂散电感 .0?A0D?sP
86 sub-circuit 子电路 -xL^UcG0
87 substrate 基板 xt1Ug~5
88 Telecom 电信 1Ms_ 2
89 Thermal Information 热性能信息 r& ux|o+
90 thermal slug 散热片 6 }>CPi#
91 Threshold 阈值 FqXE6^
92 timing resistor 振荡电阻 +D
d !
93 Top FET Top FET HJjx!7h
94 Trace 线路，走线，引线 @|EWif|
95 Transfer function 传递函数 # &K? N
96 Trip Point 跳变点 -
` {T ?
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） UM:]Qba In
98 Under Voltage Lock Out (UVLO) 欠压锁定 ^ 5rB/y,
99 Voltage Reference 电压参考 x,LY fy"0
100 voltage-second product 伏秒积 tui5?\
101 zero-pole frequency compensation 零极点频率补偿 UT_kw}1o
102 beat frequency 拍频 |./{,",
103 one shots 单击电路 (CInt_dBw~
104 scaling 缩放 K8RV=3MBLD
105 ESR 等效串联电阻 [Page] i $lp8Y2ih
106 Ground 地电位 qFN`pe,
107 trimmed bandgap 平衡带隙 6 l7 iX]
108 dropout voltage 压差 tP4z#0r2
109 large bulk capacitance 大容量电容 G>,43S!<
110 circuit breaker 断路器 <kKuis6h
111 charge pump 电荷泵 [,sm]/Xlc
112 overshoot 过冲 6o&ZS @
}h1y^fuGi
印制电路printed circuit $V,ZH*
g
印制线路 printed wiring ]DjnzC lx
印制板 printed board <RuLIu
印制板电路 printed circuit board SA%uGkm:e
印制线路板 printed wiring board m2[]`Ir^@
印制元件 printed component L [&|<<c
印制接点 printed contact )3.=)?XW
印制板装配 printed board assembly sq{=TB{
板 board m
;yIFO
刚性印制板 rigid printed board DO6
p v
挠性印制电路 flexible printed circuit rqz48~\lJ
挠性印制线路 flexible printed wiring ^~^=$ fz
齐平印制板 flush printed board ~rlPS#]o
金属芯印制板 metal core printed board #=N6[:,
金属基印制板 metal base printed board rlY n"3%
多重布线印制板 mulit-wiring printed board kK=f@l
塑电路板 molded circuit board yM('!iG*/
散线印制板 discrete wiring board ?-JW2 E"uT
微线印制板 micro wire board `*3;sq%`
积层印制板 buile-up printed board 31cZ6[
表面层合电路板 surface laminar circuit 9XmbHS[0V
埋入凸块连印制板 B2it printed board U#:N/ts*(
载芯片板 chip on board Yf_/c*t\5
埋电阻板 buried resistance board E] W
:
母板 mother board u Au'2M,_
子板 daughter board - ufaV#
背板 backplane RQU-]qQ8BM
裸板 bare board ogqKM_
键盘板夹心板 copper-invar-copper board g%o kYH?
动态挠性板 dynamic flex board N?IdaVLj
静态挠性板 static flex board VFq7nV/O
可断拼板 break-away planel /9o6R:B
电缆 cable iy|;xBI,
挠性扁平电缆 flexible flat cable (FFC) ;@qQ^!g2
薄膜开关 membrane switch ^%O $7*
混合电路 hybrid circuit Q-J} :U
厚膜 thick film NIHcX6Nw
厚膜电路 thick film circuit A3|2;4t
薄膜 thin film WO$8j2!~#
薄膜混合电路 thin film hybrid circuit sl`?9- _[
互连 interconnection g){gF(
导线 conductor trace line 0-p
%.}GE
齐平导线 flush conductor q8MyEoc:n
传输线 transmission line Zt}b}Bz
跨交 crossover MAQ-'s@
板边插头 edge-board contact %4})_h?j
增强板 stiffener M zF,is
基底 substrate rpc;*t+z
基板面 real estate JFq<sY!
导线面 conductor side n[\L6}
元件面 component side P MI?PC[;
焊接面 solder side i!eY"|o
导电图形 conductive pattern #Q BW%L
非导电图形 non-conductive pattern Q.Y6
基材 base material ,{_56j^d,
层压板 laminate SNf~%B?`L
覆金属箔基材 metal-clad bade material <pM6fI6BD
覆铜箔层压板 copper-clad laminate (CCL) m~4ik1 wq
复合层压板 composite laminate VVfTFi<
薄层压板 thin laminate r @PVSH/
基体材料 basis material _o&NbD H
预浸材料 prepreg 0^)~p{Zh
粘结片 bonding sheet OW#G{#.6R
预浸粘结片 preimpregnated bonding sheer _-2;!L#/
环氧玻璃基板 epoxy glass substrate AC!yc(^<
预制内层覆箔板 mass lamination panel \eAV: qV
内层芯板 core material h@J3+ u<
粘结层 bonding layer I8|"h8\
粘结膜 film adhesive wbI1~/
无支撑胶粘剂膜 unsupported adhesive film }GH C u
覆盖层 cover layer (cover lay) HkY#i;%N
增强板材 stiffener material / S @iF
铜箔面 copper-clad surface ,; Uf>8~
去铜箔面 foil removal surface 5g.K yj|
层压板面 unclad laminate surface k1SD{ BL
基膜面 base film surface _Ud! tK *H
胶粘剂面 adhesive faec ?1r<`o3l\
原始光洁面 plate finish ( X+2vN
粗面 matt finish dF5y'
R'
剪切板 cut to size panel )u0 /s'
超薄型层压板 ultra thin laminate =E-o@#BS
A阶树脂 A-stage resin +G+1B6 S
B阶树脂 B-stage resin }PM7CZSq
C阶树脂 C-stage resin q
s: TR
环氧树脂 epoxy resin x$FcF8
酚醛树脂 phenolic resin \jZ)r>US"
聚酯树脂 polyester resin hZWkw{c
聚酰亚胺树脂 polyimide resin S,Q(,e ^&
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 7Sh1QD YZ
丙烯酸树脂 acrylic resin X~/-,oV=A
三聚氰胺甲醛树脂 melamine formaldehyde resin $GHi9aj_P
多官能环氧树脂 polyfunctional epoxy resin 8"p rWAN
溴化环氧树脂 brominated epoxy resin /SyAjZ
环氧酚醛 epoxy novolac ~ _IQ:]k
氟树脂 fluroresin Sggl*V/q
硅树脂 silicone resin 8~T=p:z'
硅烷 silane tI5*0
聚合物 polymer OX?E3 <8`
无定形聚合物 amorphous polymer c= ?Tu
结晶现象 crystalline polamer KTwP.!<v
双晶现象 dimorphism h"'}Z^
共聚物 copolymer ?mN!9/DIc
合成树脂 synthetic 8k+k\V{
热固性树脂 thermosetting resin [Page] t;u)_C,bmP
热塑性树脂 thermoplastic resin d[nz0LI|mk
感光性树脂 photosensitive resin @Vy Ne(U
环氧值 epoxy value )*Wz5x
双氰胺 dicyandiamide #%L_wJB-
粘结剂 binder Dg hqSL ^s
胶粘剂 adesive HrMbp
固化剂 curing agent I3}]MAE
阻燃剂 flame retardant ` k(Q:
遮光剂 opaquer =W>a ~e]/
增塑剂 plasticizers `cIe qp
不饱和聚酯 unsatuiated polyester CrG!8}
聚酯薄膜 polyester t:xTmK&vt
聚酰亚胺薄膜 polyimide film (PI) %!A-K1Z\D
聚四氟乙烯 polytetrafluoetylene (PTFE) q(4Ny<=,'K
增强材料 reinforcing material ]z | 2
折痕 crease h Z.](rD
云织 waviness TtQd#mSI\
鱼眼 fish eye PO^#G @
毛圈长 feather length J)|I/8!#
厚薄段 mark hS>=p O+y
裂缝 split `tcX[(`
捻度 twist of yarn DZA '0-
浸润剂含量 size content E>O@Bv
浸润剂残留量 size residue 7|"$YV'DM
处理剂含量 finish level c%&*yR
偶联剂 couplint agent * P&lAyt6
断裂长 breaking length g@pK9R%wH<
吸水高度 height of capillary rise 8 i<]$
湿强度保留率 wet strength retention "L8 Hgwg
白度 whitenness gvL*]U 7
导电箔 conductive foil t2|0n o
铜箔 copper foil f zL5C2d
压延铜箔 rolled copper foil x}=Q)| )]
光面 shiny side "
RIt
粗糙面 matte side cIK4sOTJ&
处理面 treated side NRspi_&4J
防锈处理 stain proofing 6&L;Sw#Dg
双面处理铜箔 double treated foil $vn )(zn+
模拟 simulation y{~tMpo<
逻辑模拟 logic simulation =WEDQ\ c
电路模拟 circit simulation |`fuu2W!
时序模拟 timing simulation {Z
Ld_VGW
模块化 modularization yS3o r(K
设计原点 design origin 3II*NANeg
优化（设计） optimization (design) -Rr !J37
供设计优化坐标轴 predominant axis c>Ri6=C
表格原点 table origin Nus] ]Iy-g
元件安置 component positioning bfpoX,:
比例因子 scaling factor )n[=)"rf
扫描填充 scan filling (m=1yj9
矩形填充 rectangle filling U!E}(9
tb
填充域 region filling '+'h^
实体设计 physical design &qIdT;^=I
逻辑设计 logic design %;<g!Vw.k
逻辑电路 logic circuit OKk" S_`
层次设计 hierarchical design WGyPyG#Fl
自顶向下设计 top-down design !1UZ< hq
自底向上设计 bottom-up design NgF"1E
费用矩阵 cost metrix 1 Tev&J
元件密度 component density )h{+pK
自由度 degrees freedom Lv Z',u}
出度 out going degree @xBO[v
入度 incoming degree :h!'\9
曼哈顿距离 manhatton distance H]f[r~
欧几里德距离 euclidean distance 2]FRIy
d
网络 network n wqA\
阵列 array h-SKw=n
段 segment PzhC *" i}
逻辑 logic ;vbM C74J#
逻辑设计自动化 logic design automation T21?~jS
分线 separated time 1TF S2R n
分层 separated layer a`?Vc}&
定顺序 definite sequence 4X+I2CD
导线（通道） conduction (track) BN &}g}N
导线（体）宽度 conductor width ;:>q;%
导线距离 conductor spacing '$J M2 u
导线层 conductor layer FJxb!- 0&
导线宽度/间距 conductor line/space nHp(,'R/
第一导线层 conductor layer No.1 Ttp%U8-LJR
圆形盘 round pad ]KG.-o30
方形盘 square pad PtzT ><
菱形盘 diamond pad WT3g31
长方形焊盘 oblong pad y9=<q%Kc-
子弹形盘 bullet pad _}T )\o
泪滴盘 teardrop pad >$)~B 4
雪人盘 snowman pad [,MK)7DU
形盘 V-shaped pad V `U >2H4P
环形盘 annular pad u`Y~r<?P(
非圆形盘 non-circular pad cqW(9A|8
隔离盘 isolation pad BMV\@Sg
非功能连接盘 monfunctional pad ) |AxQPd
偏置连接盘 offset land vF>]9sMv
腹（背）裸盘 back-bard land
C ?'s
盘址 anchoring spaur AN|f:259
连接盘图形 land pattern joZd
连接盘网格阵列 land grid array S_RP& +!7
孔环 annular ring U3 UA
元件孔 component hole /^bU8E&^M
安装孔 mounting hole ~`B ]G
支撑孔 supported hole Q0,eE:
非支撑孔 unsupported hole Iek ] /=
导通孔 via [X8EfU}
镀通孔 plated through hole (PTH) &2O~BIRE
余隙孔 access hole N|ZGc{?
盲孔 blind via (hole) HS\'{4 P
埋孔 buried via hole vL^ +X`.td
埋,盲孔 buried blind via w* o2lg9
任意层内部导通孔 any layer inner via hole 3"k n5)x
全部钻孔 all drilled hole !;hp
定位孔 toaling hole Mm9* $g!R
无连接盘孔 landless hole 5@I/+ D
中间孔 interstitial hole !(Q@1 c&z
无连接盘导通孔 landless via hole )@y7 qb
引导孔 pilot hole v-Q> I5D;:
端接全隙孔 terminal clearomee hole GMoz$c6n_
准尺寸孔 dimensioned hole [Page] TqOH (= {
在连接盘中导通孔 via-in-pad #T H(:I=[
孔位 hole location wx!2/I>
孔密度 hole density R\/tKZJjb
孔图 hole pattern |B64%w>Y
钻孔图 drill drawing o=xM aA
装配图assembly drawing {eQijW2Z3
参考基准 datum referan +kD JZ
1） 元件设备 S;%k?O 7v
b@K1;A! S
三绕组变压器：three-column transformer ThrClnTrans xj3{Ke`6
双绕组变压器：double-column transformer DblClmnTrans @,]W
电容器：Capacitor 1F3Q^3+
并联电容器：shunt capacitor yT='V1
电抗器：Reactor . NxskXq)
母线：Busbar ap" pQ[t;
输电线：TransmissionLine 4%JJ} {Ff
发电厂：power plant v#: ?: <
断路器：Breaker bUSa#pNO>
刀闸(隔离开关)：Isolator E]r<t#
分接头：tap c>+68<H
电动机：motor t'.:"H8BI
（2） 状态参数 n1PvZ~^3
nHp$5|r<
有功：active power 'SrDc'?
无功：reactive power l k
/Ke
电流：current , E$f"
容量：capacity \pSRG=`
电压：voltage * Gj`1# Z$
档位：tap position N3oa!PE
有功损耗：reactive loss ZW@cw }
无功损耗：active loss D-x*RRkpp
功率因数：power-factor v!3Oq.ot
功率：power C^,J 6;'
功角：power-angle G{Uqp'=G
电压等级：voltage grade h%v qt~0
空载损耗：no-load loss <yvo<R^30
铁损：iron loss &!HG.7AY
铜损：copper loss :7(d 6gEL
空载电流：no-load current pigu]mj
阻抗：impedance P: 1eWP
正序阻抗：positive sequence impedance {]N7kY.W
负序阻抗：negative sequence impedance `49!di[
零序阻抗：zero sequence impedance ilZ5a& X;
电阻：resistor -SzCeq(p%5
电抗：reactance G9K& }_,
电导：conductance K5??WB63B
电纳：susceptance Ea0EG> Y
无功负载：reactive load 或者QLoad t? =V<Yd1
有功负载: active load PLoad SbsdunW+?
遥测：YC(telemetering) J{L d)Q,^
遥信：YX mmCGIX
励磁电流(转子电流)：magnetizing current #c'}_s2F[
定子：stator #BZ5Mxzj
功角：power-angle yD8Qy+6 L
上限:upper limit ]" j%:fr
下限：lower limit HL:w*8a
并列的：apposable tq=M 9c
高压: high voltage (#>Q#Izr
低压：low voltage _) 4zm
中压：middle voltage %>y!N!.F
电力系统 power system Hd
gABIuX
发电机 generator f 3:dn7
励磁 excitation L},o;p:
励磁器 excitor XjxI@VXzUV
电压 voltage I7t}$ S6
电流 current }wEt=zOJ
母线 bus &W&A88FfZU
变压器 transformer >N}+O<Fc
升压变压器 step-up transformer 0TiDQ4}i[
高压侧 high side DQ0 UY
输电系统 power transmission system %O7?:#_
输电线 transmission line \\ d8ulu
固定串联电容补偿fixed series capacitor compensation r "\<+$ 7
稳定 stability !thFa yq
电压稳定 voltage stability %(s2{$3
功角稳定 angle stability $%ww$3
暂态稳定 transient stability l
SuNZY aO
电厂 power plant k9VWyq__
能量输送 power transfer 2j1HN
交流 AC ww'B!Ml>F
装机容量 installed capacity i=f hK~Jd
电网 power system |t#s h
落点 drop point L%pAEoSG
开关站 switch station sp0_f;bC
双回同杆并架 double-circuit lines on the same tower :cP u
变电站 transformer substation Z1 (!syg
补偿度 degree of compensation K;TTGK
高抗 high voltage shunt reactor |47 2X &e
无功补偿 reactive power compensation = Fq{#s C>
故障 fault y Dpv+6(a
调节 regulation ?b(DDQMf
裕度 magin NxFCVqGb
三相故障 three phase fault ?tT89m3_E
故障切除时间 fault clearing time n~i^ +pD@
极限切除时间 critical clearing time 5\ }QOL
切机 generator triping !8R JHMX&
高顶值 high limited value !Uhc jfq`e
强行励磁 reinforced excitation M?[ 'HoRo
线路补偿器 LDC(line drop compensation) x3jjtjf
机端 generator terminal )>;387'Y
静态 static (state) -W|~YK7e
动态 dynamic (state) zT hut!O
单机无穷大系统 one machine - infinity bus system .Lm`v0' w
机端电压控制 AVR Y)M-?|4
电抗 reactance Xx m7s S
电阻 resistance !__^M3S,k
功角 power angle &kH7_Lz
有功（功率） active power }MM:q R
无功（功率） reactive power \PmM856=ms
功率因数 power factor UK[+I]I
p
无功电流 reactive current +]Z *_?j9{
下降特性 droop characteristics eN m
Wul
斜率 slope MA7&fNjB
额定 rating %XXjQ 5p
变比 ratio q+lCA#Sx
参考值 reference value Ti#x62X{
电压互感器 PT !VvM
分接头 tap dmMr Z1u2
下降率 droop rate M%Q_;\?]
仿真分析 simulation analysis ` ^z
l =
传递函数 transfer function _Vr}ipx-k
框图 block diagram cZw_^@!
受端 receive-side a1v?{vu\E
裕度 margin "m}N
hoD4
同步 synchronization %V-Hy ;V
失去同步 loss of synchronization #Jfmt~ks '
阻尼 damping sWP_f b1
摇摆 swing ORfMp 'uP=
保护断路器 circuit breaker YD5mJ[1t"2
电阻：resistance &Hl
w2^
电抗：reactance O*Z -3 l
阻抗：impedance U
a1Z,~ *
电导：conductance yJ8_<A
电纳：susceptance
