1 backplane 背板 O\"3J(y,
2 Band gap voltage reference 带隙电压参考 C,ARXW1
3 benchtop supply 工作台电源 4;0lvDD
4 Block Diagram 方块图 5 Bode Plot 波特图 HoRg^Ai?\
6 Bootstrap 自举 ,>0* @2
7 Bottom FET Bottom FET (2^gVz=j
8 bucket capcitor 桶形电容 #/Vh|UeX
9 chassis 机架 I J(
10 Combi-sense Combi-sense ,P70Jb
11 constant current source 恒流源 ,0~n3G
12 Core Sataration 铁芯饱和 Wp!%-vzy&
13 crossover frequency 交叉频率 8T!+ZQAz
14 current ripple 纹波电流 B1>/5hV}
15 Cycle by Cycle 逐周期 !`,Sfqij
16 cycle skipping 周期跳步 g" .are'7
17 Dead Time 死区时间 IDB+%xl#S
18 DIE Temperature 核心温度 8o'_`{ba
19 Disable 非使能,无效,禁用,关断 3c]b)n~Y
20 dominant pole 主极点 117EZg]O
21 Enable 使能,有效,启用 iB%gPoDCL@
22 ESD Rating ESD额定值 r0+6evU2
23 Evaluation Board 评估板 b`~p.c%(
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. MbZJ;,e?
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 DVB{2~7 4
25 Failling edge 下降沿 4{rZppm
26 figure of merit 品质因数 HUv/ ~^<
27 float charge voltage 浮充电压 <b`E_
28 flyback power stage 反驰式功率级 VcSVu
29 forward voltage drop 前向压降 K1\a#w
30 free-running 自由运行 x,|hU@h
31 Freewheel diode 续流二极管 w35J.zn
32 Full load 满负载 33 gate drive 栅极驱动 smRE!f*q
34 gate drive stage 栅极驱动级 vdx0i&RiL
35 gerber plot Gerber 图 jB$IyQ;@
36 ground plane 接地层 T_@K&<
37 Henry 电感单位:亨利 d%RC
38 Human Body Model 人体模式 G
MX?
39 Hysteresis 滞回 S+atn]eU@
40 inrush current 涌入电流 BGD8w2
41 Inverting 反相 $Q96,rb}k;
42 jittery 抖动 [z`31F
43 Junction 结点 ||hb~%JK6
44 Kelvin connection 开尔文连接 El[)?+;D
45 Lead Frame 引脚框架 G~2jUyv
46 Lead Free 无铅 1 u| wMO
47 level-shift 电平移动 Crho=RJPR
48 Line regulation 电源调整率 3=FZ9>by
49 load regulation 负载调整率 ]B%v+uaW
50 Lot Number 批号 aB{vFTD5
51 Low Dropout 低压差 i|w81p^o
52 Miller 密勒 53 node 节点 )Ch2E|C?=8
54 Non-Inverting 非反相 TMlP*d#
55 novel 新颖的 Q<^Tl(`/N?
56 off state 关断状态 }z _
57 Operating supply voltage 电源工作电压 b[t> te
58 out drive stage 输出驱动级 U(Nu%
59 Out of Phase 异相 G7qG$wd8h
60 Part Number 产品型号 E:JJ3X|
61 pass transistor pass transistor 9`I _Et
62 P-channel MOSFET P沟道MOSFET zR1^I~
%
63 Phase margin 相位裕度 2ORNi,_I
64 Phase Node 开关节点 6:Ch^c+IZ
65 portable electronics 便携式电子设备 ]>LhkA@V
66 power down 掉电 5!DBmAB
67 Power Good 电源正常 P9^-6;'Y
68 Power Groud 功率地 )0"wB
69 Power Save Mode 节电模式 wRcAX%n&
70 Power up 上电 WN?O'E=2
71 pull down 下拉 [F0s!,P
72 pull up 上拉 s2'yY(u/
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) T>}5:,N~
74 push pull converter 推挽转换器 -(bXSBs#
75 ramp down 斜降 < Z{HX[y
76 ramp up 斜升 E^ P,*s
77 redundant diode 冗余二极管 <j*;.yyC
78 resistive divider 电阻分压器 y .#")IAF
79 ringing 振 铃 ^W'fA{sr
80 ripple current 纹波电流 8$85^Of
81 rising edge 上升沿 Xu<k3oD7
82 sense resistor 检测电阻 P
`}zlml
83 Sequenced Power Supplys 序列电源 ,&jhlZ i
84 shoot-through 直通,同时导通 ;1`fC@rI
85 stray inductances. 杂散电感 @R/07&lBR
86 sub-circuit 子电路 8oUpQcim
87 substrate 基板 4]G?G]lS>
88 Telecom 电信 tBq
nfv
89 Thermal Information 热性能信息 r=5{o1"
90 thermal slug 散热片
z.$4!$q
91 Threshold 阈值 SB1upTn
92 timing resistor 振荡电阻 ohF JZ'
93 Top FET Top FET rai3<_W<
94 Trace 线路,走线,引线 !>{G,\^=pT
95 Transfer function 传递函数 rR9|6l
3
96 Trip Point 跳变点 ??PC
k1X
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) i5Zk_-\#H
98 Under Voltage Lock Out (UVLO) 欠压锁定 _,xc[ 07
99 Voltage Reference 电压参考 $ACvV"b
100 voltage-second product 伏秒积 <,Ue
0
101 zero-pole frequency compensation 零极点频率补偿 Ge-CY
102 beat frequency 拍频 bvv|;6
103 one shots 单击电路 .z)%)PVV
104 scaling 缩放 0vEoGgY0*:
105 ESR 等效串联电阻 [Page] tw^,G(
106 Ground 地电位 U]^HjfX\
107 trimmed bandgap 平衡带隙 |B'9\OkP[=
108 dropout voltage 压差 NLUT#!Gr
109 large bulk capacitance 大容量电容 FME3sa$
110 circuit breaker 断路器 : >6F+XZ
111 charge pump 电荷泵 J8S'/y(LE<
112 overshoot 过冲 =NnNN'}
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印制电路printed circuit 3Mxp)uG/
印制线路 printed wiring zo +nq%=
印制板 printed board q}~3C1
印制板电路 printed circuit board JRSSn] pw
印制线路板 printed wiring board cxA ^:3
印制元件 printed component V.O(S\
印制接点 printed contact .q
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印制板装配 printed board assembly b4E:Wn9x
板 board 3&u&x(
刚性印制板 rigid printed board tE@;X=
挠性印制电路 flexible printed circuit ~i~7na|
挠性印制线路 flexible printed wiring :bz}c48%
齐平印制板 flush printed board e?7&M
金属芯印制板 metal core printed board P%{^ i]
金属基印制板 metal base printed board >#hO).`C
多重布线印制板 mulit-wiring printed board }._eIx"
塑电路板 molded circuit board Pa{%\dsv
散线印制板 discrete wiring board LXbP 2
微线印制板 micro wire board 3gv|9T
积层印制板 buile-up printed board <\NY<QIwFw
表面层合电路板 surface laminar circuit J4Nln
埋入凸块连印制板 B2it printed board *a58ZI@
载芯片板 chip on board #9X70|f
埋电阻板 buried resistance board
k\WR ]
母板 mother board ny`#%Vs
子板 daughter board N F+iza;DP
背板 backplane H*[M\gN$
裸板 bare board R{ a"Y$
键盘板夹心板 copper-invar-copper board 2Ou[u#H
动态挠性板 dynamic flex board _9=Yvc=
静态挠性板 static flex board Ezr:1 GJ
可断拼板 break-away planel H-~6Z",1
电缆 cable ^:#D0[
挠性扁平电缆 flexible flat cable (FFC) .Nw=[
薄膜开关 membrane switch }oL'8-y
混合电路 hybrid circuit tS|(K=$
厚膜 thick film zx-81fx+k
厚膜电路 thick film circuit 4<% *E{`
薄膜 thin film oW<5|FaN
薄膜混合电路 thin film hybrid circuit 5qr'.m
互连 interconnection %]>KvoA
导线 conductor trace line +n#V[~~8AI
齐平导线 flush conductor /4g1zrU
传输线 transmission line 5\e9@1Rc
跨交 crossover So0f)`A
板边插头 edge-board contact BsEF'h'Owh
增强板 stiffener }UWL-TkEjF
基底 substrate 8>0e*jC
基板面 real estate DpUbzr41+k
导线面 conductor side z"0I>gl
元件面 component side 1UE6 4Kl:S
焊接面 solder side .ox8*OO<
导电图形 conductive pattern D'J0wT#
非导电图形 non-conductive pattern <$X3Hye
基材 base material j!]YNH@
层压板 laminate NdzSz]q}
覆金属箔基材 metal-clad bade material O*0l+mop
覆铜箔层压板 copper-clad laminate (CCL) m^bNuo
复合层压板 composite laminate ;\=M;Zt
薄层压板 thin laminate W3 'q\+
基体材料 basis material ~},=OF-b
预浸材料 prepreg >U%gctIg
粘结片 bonding sheet jV4\A
预浸粘结片 preimpregnated bonding sheer \'|>p/5I
环氧玻璃基板 epoxy glass substrate JwAYG5W
预制内层覆箔板 mass lamination panel ;*:Pw?'
内层芯板 core material qYlhlHD
粘结层 bonding layer &o,<ijJ:^m
粘结膜 film adhesive MM(xk
无支撑胶粘剂膜 unsupported adhesive film R)mu2^
覆盖层 cover layer (cover lay) =5kY6%E7c
增强板材 stiffener material A1.7O
铜箔面 copper-clad surface
w-Da~[J
去铜箔面 foil removal surface Q0&H#xgt
层压板面 unclad laminate surface kic/*v\6@
基膜面 base film surface 80Gn%1A9
胶粘剂面 adhesive faec R,pX:H+
原始光洁面 plate finish JV]^zW
粗面 matt finish aB7+Tb
剪切板 cut to size panel UFp,a0|
超薄型层压板 ultra thin laminate w+1|9Y
A阶树脂 A-stage resin rEv$+pP
B阶树脂 B-stage resin {
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C阶树脂 C-stage resin wid;8%m
环氧树脂 epoxy resin 2T V X)q<\
酚醛树脂 phenolic resin m]5Cq6
聚酯树脂 polyester resin :}@g6
聚酰亚胺树脂 polyimide resin |MFF7z{%
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin M#As0~y
丙烯酸树脂 acrylic resin UN]f"k&