1 backplane 背板 Z}Ft:7
2 Band gap voltage reference 带隙电压参考 o:Sa,
!DK
3 benchtop supply 工作台电源 JrRH\+4K
4 Block Diagram 方块图 5 Bode Plot 波特图 :! !at:>
6 Bootstrap 自举 8c^TT&
7 Bottom FET Bottom FET YglmX"fLf
8 bucket capcitor 桶形电容 :E )>\&
9 chassis 机架 E#N|wq
10 Combi-sense Combi-sense l]l'4@1
11 constant current source 恒流源 4u})+2W
12 Core Sataration 铁芯饱和 {[?(9u7R
13 crossover frequency 交叉频率 (M.&^w;`,
14 current ripple 纹波电流 %aVq+kC h
15 Cycle by Cycle 逐周期 i6Emhji
16 cycle skipping 周期跳步 \n|EM@=eE
17 Dead Time 死区时间 5uj?#)N
18 DIE Temperature 核心温度 ~%kkeh\j
19 Disable 非使能,无效,禁用,关断 Vb]=B~ ^`
20 dominant pole 主极点 $C$V%5aA
21 Enable 使能,有效,启用 mb^~qeRQ
22 ESD Rating ESD额定值 +*/Zu`kzX
23 Evaluation Board 评估板 0{}8(
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. ,M
^<CJ
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 K:#I
25 Failling edge 下降沿 jLHkOk5{:
26 figure of merit 品质因数 }l} Bo.C
27 float charge voltage 浮充电压 VY=jc~c]v
28 flyback power stage 反驰式功率级 |"CZ T#
29 forward voltage drop 前向压降 O.M>+~Nw
30 free-running 自由运行 #( 146
31 Freewheel diode 续流二极管 3kp+<$
32 Full load 满负载 33 gate drive 栅极驱动 U$D65B4=
34 gate drive stage 栅极驱动级 l L@XM2"
35 gerber plot Gerber 图 gu.}M:u
36 ground plane 接地层 rlSeu5X6
37 Henry 电感单位:亨利 C{xaENp
38 Human Body Model 人体模式 ywmo#qYe
39 Hysteresis 滞回 ,G?WAOy,
40 inrush current 涌入电流 ytJ/g/,A0i
41 Inverting 反相 0gP}zM73
42 jittery 抖动 '/p/8V.O.
43 Junction 结点 ~H<6gN<j(.
44 Kelvin connection 开尔文连接 tGE$z]1c@
45 Lead Frame 引脚框架 6wjw ^m0
46 Lead Free 无铅 #rQ2gx4
47 level-shift 电平移动 Ad9}9!<
48 Line regulation 电源调整率 ~t~k2^)|"
49 load regulation 负载调整率 fW1CFRHH
50 Lot Number 批号 :vQrOn18p
51 Low Dropout 低压差 }?_?V&K|
52 Miller 密勒 53 node 节点 sfugY(m
54 Non-Inverting 非反相 CXx*_@}MU
55 novel 新颖的 SBk4_J/_
56 off state 关断状态 u$Jz~:=,
57 Operating supply voltage 电源工作电压 <7Or{:Sc90
58 out drive stage 输出驱动级 t:
;Pj9
59 Out of Phase 异相 Em
!/a$
60 Part Number 产品型号 Y>dzR)~3[
61 pass transistor pass transistor nuMD!qu!nZ
62 P-channel MOSFET P沟道MOSFET Vl=l?A8
63 Phase margin 相位裕度 a;qryUyG
64 Phase Node 开关节点 +RM SA^
65 portable electronics 便携式电子设备 -[9JJ/7y
66 power down 掉电 Q}K"24`=
67 Power Good 电源正常 m{cGK`/\
68 Power Groud 功率地 CMG&7(MR
69 Power Save Mode 节电模式 H0gbSd+
70 Power up 上电 t[;LD_
71 pull down 下拉 JWhdMU
72 pull up 上拉 U175{N%3
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ;yLu R
74 push pull converter 推挽转换器 6"O+w=5B
75 ramp down 斜降 kY|utoAP
76 ramp up 斜升 bL+_j}{:N
77 redundant diode 冗余二极管 RSyUaA
78 resistive divider 电阻分压器 %G/hD
79 ringing 振 铃 K6/Q}W
80 ripple current 纹波电流 )D5"ap]fX
81 rising edge 上升沿 u=?.}Pj
82 sense resistor 检测电阻 rv^@, 8vq
83 Sequenced Power Supplys 序列电源 j<99FW"@e
84 shoot-through 直通,同时导通 kYqU9cB~
85 stray inductances. 杂散电感 bz2ztH9 n
86 sub-circuit 子电路 JHM9
87 substrate 基板 p{Yv3dNl
88 Telecom 电信 FaQe_;
89 Thermal Information 热性能信息 2W96Zju\
90 thermal slug 散热片 p;59?
91 Threshold 阈值 m '|bGV
92 timing resistor 振荡电阻 t?x<g <PJ4
93 Top FET Top FET k}kQI~S9
94 Trace 线路,走线,引线 fF$<7O)+]
95 Transfer function 传递函数 0w\zLU
96 Trip Point 跳变点 ~ Ei $nV
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) g1/[eoZzk
98 Under Voltage Lock Out (UVLO) 欠压锁定 `iAF3:
99 Voltage Reference 电压参考 6xe*E[#k\
100 voltage-second product 伏秒积 u~M
q*
101 zero-pole frequency compensation 零极点频率补偿 Ustv{:7v
102 beat frequency 拍频 Yq0| J
103 one shots 单击电路 ['X]R:3h
104 scaling 缩放 6Z6'}BDP
105 ESR 等效串联电阻 [Page] -aPg#ub
106 Ground 地电位 uGf@
107 trimmed bandgap 平衡带隙 h5{'Q$Erl
108 dropout voltage 压差 G_3O]BMKd)
109 large bulk capacitance 大容量电容 ?cBwPetp
110 circuit breaker 断路器 hYT0l$Ng
111 charge pump 电荷泵 uy[At+%zg
112 overshoot 过冲 0_95|3kc
[fya)}
印制电路printed circuit \}u
Y'F
印制线路 printed wiring c)TPM/>(p
印制板 printed board F#,90F'
印制板电路 printed circuit board N
,'GN[s
印制线路板 printed wiring board
{7"Q\
印制元件 printed component ]_mb7X>
印制接点 printed contact c@!_/0
印制板装配 printed board assembly (Y.k8";)`
板 board fnjPSts0
刚性印制板 rigid printed board
_JzEGpeG
挠性印制电路 flexible printed circuit ITE{@1
挠性印制线路 flexible printed wiring *KZYv=s,u
齐平印制板 flush printed board oo/qb`-6
金属芯印制板 metal core printed board DbBcQ%
金属基印制板 metal base printed board &Cq`Y !y
多重布线印制板 mulit-wiring printed board 8\@m
- E!{
塑电路板 molded circuit board &=@IzmA
散线印制板 discrete wiring board 8O5s`qKMYT
微线印制板 micro wire board
acajHs
积层印制板 buile-up printed board ExY] Sdx
表面层合电路板 surface laminar circuit GfxZ'VIn
埋入凸块连印制板 B2it printed board 9|^2",V
载芯片板 chip on board ~WeM TXF>y
埋电阻板 buried resistance board Z,
zWuE3
母板 mother board :[p}
子板 daughter board )Ys x}vS Z
背板 backplane qTRsZz@
裸板 bare board er("wtM
键盘板夹心板 copper-invar-copper board d\&U*=
动态挠性板 dynamic flex board Gvt G(u~
静态挠性板 static flex board YFLZ %(
可断拼板 break-away planel SB;&GHq"n
电缆 cable pz!Zs."f)
挠性扁平电缆 flexible flat cable (FFC) rT=rrvV3g
薄膜开关 membrane switch O W_{$9U
混合电路 hybrid circuit WrnrFz
厚膜 thick film !P2ro~0/
厚膜电路 thick film circuit -P(efYk
薄膜 thin film SXSgld2uS
薄膜混合电路 thin film hybrid circuit i^/T
互连 interconnection MD}w Y><C
导线 conductor trace line !j8FIY'[
齐平导线 flush conductor @+&LYy72
传输线 transmission line .Yamc#A-
跨交 crossover bWjc'P6rx
板边插头 edge-board contact QGMV}y
增强板 stiffener pQyK={7?`
基底 substrate oM
X
基板面 real estate sf:,qD=z
导线面 conductor side ^rB8? kt
元件面 component side _>o:R$ %}
焊接面 solder side F#3Q_G^/
导电图形 conductive pattern =Pyj%4Rs
非导电图形 non-conductive pattern {UX!go^J
基材 base material $!-yr7
层压板 laminate :tc@2/>!O
覆金属箔基材 metal-clad bade material ]vB$~3||
覆铜箔层压板 copper-clad laminate (CCL) XnH05LQ
复合层压板 composite laminate y B81f
薄层压板 thin laminate u%GEqruo[
基体材料 basis material U"~>jZKk
预浸材料 prepreg 'NbHa!
粘结片 bonding sheet '9%\;
预浸粘结片 preimpregnated bonding sheer ` _6C{<O
环氧玻璃基板 epoxy glass substrate [@_Jj3`4
预制内层覆箔板 mass lamination panel ]"pVj6O
内层芯板 core material v1#otrf
粘结层 bonding layer VnSCz" ?3
粘结膜 film adhesive DcS+_>a\{l
无支撑胶粘剂膜 unsupported adhesive film _f7 9wx\B
覆盖层 cover layer (cover lay) "-E\[@/
增强板材 stiffener material _kC-dEGf!y
铜箔面 copper-clad surface w$>u b@=
去铜箔面 foil removal surface FBG4pb9=~
层压板面 unclad laminate surface oe ~'o'
基膜面 base film surface HRpte=`q
胶粘剂面 adhesive faec Q*GN`07@?d
原始光洁面 plate finish [XN={
粗面 matt finish b;L\EB
剪切板 cut to size panel zWnX*2>b
超薄型层压板 ultra thin laminate \wmN
A阶树脂 A-stage resin JT~4mT
B阶树脂 B-stage resin gZVc 5u<
C阶树脂 C-stage resin O4 w(T
环氧树脂 epoxy resin Oz.HH
酚醛树脂 phenolic resin 4a&RYx
聚酯树脂 polyester resin j<u pRS,$
聚酰亚胺树脂 polyimide resin }YQX~="
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin pt?bWyKG
丙烯酸树脂 acrylic resin iG$!6;w<
三聚氰胺甲醛树脂 melamine formaldehyde resin A]*}HZ,
多官能环氧树脂 polyfunctional epoxy resin ip\sXVR
溴化环氧树脂 brominated epoxy resin 53_Hl]#qZ
环氧酚醛 epoxy novolac ~"gA,e-)
氟树脂 fluroresin JhYe6y[q
硅树脂 silicone resin `Uq#W+r,
硅烷 silane MyOd,vU
聚合物 polymer xl{=Y< ;
无定形聚合物 amorphous polymer hy1oq7F(Q
结晶现象 crystalline polamer 0^ _uV9r
双晶现象 dimorphism *YI98
共聚物 copolymer `K"L /I9
合成树脂 synthetic 5{TsiZh4
热固性树脂 thermosetting resin [Page] 'B$yo]
热塑性树脂 thermoplastic resin ME$[=?7XX
感光性树脂 photosensitive resin P.se'z)E
环氧值 epoxy value |o"?gB}Dh
双氰胺 dicyandiamide ^^u5*n+5
粘结剂 binder 8qoMo7-f
胶粘剂 adesive ]2A^1Del
固化剂 curing agent -12UN(&&Z
阻燃剂 flame retardant eSn+ B;
遮光剂 opaquer @3i\%R)n;
增塑剂 plasticizers >IafUy
不饱和聚酯 unsatuiated polyester AF{\6<m
聚酯薄膜 polyester (y'hyJo
聚酰亚胺薄膜 polyimide film (PI) [|wZ77\
聚四氟乙烯 polytetrafluoetylene (PTFE) NSMyliM1Y
增强材料 reinforcing material wVXS%4|v
折痕 crease .Z`R^2MU
云织 waviness 0|q AxR-
鱼眼 fish eye
x^qVw5{n
毛圈长 feather length OF>mF~
厚薄段 mark 1.JK33
裂缝 split J( TkXNm
捻度 twist of yarn qx(xvU9
浸润剂含量 size content yf)%%&
浸润剂残留量 size residue Mexk~zA^
处理剂含量 finish level Rh2+=N<X
偶联剂 couplint agent fm%t^)E
断裂长 breaking length Xq4O@V
吸水高度 height of capillary rise iXkF1r]i
湿强度保留率 wet strength retention ]#<4vl\
白度 whitenness ^0)g/`H^>
导电箔 conductive foil Jrf=@m\dk
铜箔 copper foil + J{IRyBc
压延铜箔 rolled copper foil `7Q<'oK
光面 shiny side +^ac'Y)A
粗糙面 matte side \w>y`\6mX
处理面 treated side 5~U/
防锈处理 stain proofing I|!OY`ko
双面处理铜箔 double treated foil c]-<vkpV
模拟 simulation y7 cl_ rK
逻辑模拟 logic simulation N% B>M7-=
电路模拟 circit simulation Paq4
时序模拟 timing simulation nAato\mM
模块化 modularization +E+p"7
设计原点 design origin E~T-=ocKE
优化(设计) optimization (design) 9RL`<,Q
供设计优化坐标轴 predominant axis ~/U1xk%
表格原点 table origin P; no?
元件安置 component positioning ;1=1:S8
比例因子 scaling factor t+
TdLDJR
扫描填充 scan filling I,DS@SK
矩形填充 rectangle filling uMv,zO5
填充域 region filling 2'Uu:Y^
实体设计 physical design U>SShpmZA
逻辑设计 logic design @4C% +-
逻辑电路 logic circuit Q\vpqE!9
层次设计 hierarchical design :,7hWs
自顶向下设计 top-down design V &T~zh1
自底向上设计 bottom-up design 'oVx#w^mf
费用矩阵 cost metrix A\DCW
元件密度 component density VGN5<?PrN
自由度 degrees freedom ]5cT cX;Z#
出度 out going degree W*:.Gxv]
入度 incoming degree Z\rwO>3
曼哈顿距离 manhatton distance Vp\,CuQ
欧几里德距离 euclidean distance I
34>X`[o
网络 network gVuFHHeUz
阵列 array VQ@
段 segment
/maJtX'
逻辑 logic Yh7t"=o
逻辑设计自动化 logic design automation ?j.,Nw4FC
分线 separated time -i|}m++
分层 separated layer lVa%$F{Pq
定顺序 definite sequence 1GRCV8"Z^
导线(通道) conduction (track) 4J?0bZ
导线(体)宽度 conductor width >'$Mp <
导线距离 conductor spacing q
i;1L
Kc
导线层 conductor layer (WJRi:NP?
导线宽度/间距 conductor line/space 3}1u\(Mf
第一导线层 conductor layer No.1 M_f:A
圆形盘 round pad S hWJ72c
方形盘 square pad 9*wK@yEl
菱形盘 diamond pad \@zHON(
长方形焊盘 oblong pad cjY-y-vO
子弹形盘 bullet pad ,`Z1m
o>n
泪滴盘 teardrop pad ]EAO+x9
雪人盘 snowman pad 5DZ#9m/
形盘 V-shaped pad V j (d~aqW
环形盘 annular pad r6qj7}\
非圆形盘 non-circular pad X?',n
1
隔离盘 isolation pad ?V=ZIGj
非功能连接盘 monfunctional pad o|:b;\)b
偏置连接盘 offset land |df Pki{
腹(背)裸盘 back-bard land n>XdU%&
盘址 anchoring spaur =WATyY:s
连接盘图形 land pattern ;'K5J9k
连接盘网格阵列 land grid array `wVyb>T
孔环 annular ring '<<t]kK[N
元件孔 component hole {P./==^0
安装孔 mounting hole SfyQ$$Z
支撑孔 supported hole G` A4|+W"
非支撑孔 unsupported hole ?l )[7LR4
导通孔 via reWot&;
镀通孔 plated through hole (PTH) O/Crd/
余隙孔 access hole A/s?x>QA
盲孔 blind via (hole) ~
7s!VR
埋孔 buried via hole <'*LRd$1
埋,盲孔 buried blind via 7$=InK
任意层内部导通孔 any layer inner via hole w@E3ZL^
全部钻孔 all drilled hole eMsd37J
定位孔 toaling hole oc`H}Wvn
无连接盘孔 landless hole
Otuf]B^s
中间孔 interstitial hole D@.6>:;il
无连接盘导通孔 landless via hole ?a5! H*,
引导孔 pilot hole ##*3bDf$-5
端接全隙孔 terminal clearomee hole Y3b *a".X
准尺寸孔 dimensioned hole [Page] `;C V=,M
在连接盘中导通孔 via-in-pad D,feF9
孔位 hole location 0,")C5j
孔密度 hole density QWYJ*
孔图 hole pattern ~>|ziHx
钻孔图 drill drawing 4B.*g-L
装配图assembly drawing bAMdI 5Zk?
参考基准 datum referan T~e.PP
1) 元件设备 K0>zxqY
":ue-=&M
三绕组变压器:three-column transformer ThrClnTrans rILYI;'o
双绕组变压器:double-column transformer DblClmnTrans g-
gV2$I
电容器:Capacitor 02^ rV*re
并联电容器:shunt capacitor 4r}51 N\
电抗器:Reactor (9a^$C*
母线:Busbar ~DwpoeYX
输电线:TransmissionLine [(lW^-
发电厂:power plant H:|uw
断路器:Breaker ;V!D:5U
刀闸(隔离开关):Isolator MQ2}EY*A
分接头:tap 2^7`mES
电动机:motor @yYkti;4-
(2) 状态参数 !a\^Sk
/
?J0y|
有功:active power !nnC3y{G
无功:reactive power [/r(__.
电流:current {Sh ;(.u^
容量:capacity Pm7}"D'/
电压:voltage E1
2uZ$X
档位:tap position 9(Xn>G'iT
有功损耗:reactive loss e0 ecD3
无功损耗:active loss >t+P(*u
功率因数:power-factor p_4<6{KEt
功率:power h?U
O&(
功角:power-angle
YmG("z
电压等级:voltage grade ;^L(^Hx
空载损耗:no-load loss #'`{Qv0,
铁损:iron loss ;_=&-mz
铜损:copper loss HzsdHH(J
空载电流:no-load current [-w%/D%@
阻抗:impedance .}+}8[p4l
正序阻抗:positive sequence impedance h";L
负序阻抗:negative sequence impedance u3D)M%e
零序阻抗:zero sequence impedance !4!~Lk=
电阻:resistor 6y<EgYzdE
电抗:reactance HzJz+ x:
电导:conductance L~3Pm%{@A
电纳:susceptance >$7B
wO
无功负载:reactive load 或者QLoad 7tp36 TE
有功负载: active load PLoad <_+X 88
遥测:YC(telemetering) M6TD"-
遥信:YX z$sGv19pB
励磁电流(转子电流):magnetizing current 0g;|y4SN=
定子:stator E{(;@PzE
功角:power-angle kx^/*~ex
上限:upper limit ar,7S&s