1 backplane 背板
SvrUXf
2 Band gap voltage reference 带隙电压参考 [m%]C
3 benchtop supply 工作台电源 mCG&=Fx
4 Block Diagram 方块图 5 Bode Plot 波特图 1ANb=X|hig
6 Bootstrap 自举 't5`Ni
7 Bottom FET Bottom FET CPMGsW^
8 bucket capcitor 桶形电容 SD<a#S\o
9 chassis 机架 `b%lojT.
10 Combi-sense Combi-sense 51y#AQ@
11 constant current source 恒流源 To5hVL<Ex"
12 Core Sataration 铁芯饱和 Vu=/<;-N
13 crossover frequency 交叉频率 UGj |)/
14 current ripple 纹波电流 5t"FNL
<(M
15 Cycle by Cycle 逐周期 .{} 8mFi1
16 cycle skipping 周期跳步 v^vi *c
17 Dead Time 死区时间 \4^rb?B
18 DIE Temperature 核心温度 Rn]xxa'
19 Disable 非使能,无效,禁用,关断 C/'w
20 dominant pole 主极点 )*S:C
21 Enable 使能,有效,启用 w( _42)v]g
22 ESD Rating ESD额定值 Jazg n5
23 Evaluation Board 评估板 l;L_A@B<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. k~ByICE
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 0H]{,mVs
25 Failling edge 下降沿 /jGV[_Q=P
26 figure of merit 品质因数 Wpi35JrC
27 float charge voltage 浮充电压 |_>^vW1f
28 flyback power stage 反驰式功率级 U+@U/s%8
29 forward voltage drop 前向压降 nosD1sS.K8
30 free-running 自由运行 ~!!|#A)W
31 Freewheel diode 续流二极管 K,$rG%czX
32 Full load 满负载 33 gate drive 栅极驱动 $LFL4Q
34 gate drive stage 栅极驱动级 /XEW]/4
35 gerber plot Gerber 图 }v4dOGc?
36 ground plane 接地层 q!?*M?Oz
37 Henry 电感单位:亨利 b*M?\ aA
38 Human Body Model 人体模式 O#^H.B
39 Hysteresis 滞回 3RT\G0?8f
40 inrush current 涌入电流 stBe ^C
41 Inverting 反相 fe,6YXUf
42 jittery 抖动 pDSNI2
43 Junction 结点
2wHbhW[
44 Kelvin connection 开尔文连接 ;}"Eqq:
45 Lead Frame 引脚框架 {svo!pN:
46 Lead Free 无铅 )<:TpMdUk
47 level-shift 电平移动 Y`Io}h G$
48 Line regulation 电源调整率 G0Qw&
mqF
49 load regulation 负载调整率 IhYR4?e
50 Lot Number 批号 7-!n-
51 Low Dropout 低压差 _Uq' N0U
52 Miller 密勒 53 node 节点 }Mt1C~{(
54 Non-Inverting 非反相 NX.xEW@
55 novel 新颖的 +8T^q,
56 off state 关断状态 I4{xQI
57 Operating supply voltage 电源工作电压 `+"(GaZ
58 out drive stage 输出驱动级 X["xC3 i
59 Out of Phase 异相 #c>GjUJ.w
60 Part Number 产品型号 $?G@ijk,
61 pass transistor pass transistor Qop,~yK
62 P-channel MOSFET P沟道MOSFET rUj\F9*5#
63 Phase margin 相位裕度 q1( [mHZ
64 Phase Node 开关节点 cN8Fn4gq
65 portable electronics 便携式电子设备 >m,hna]RZ
66 power down 掉电 AXW.`~ 4
67 Power Good 电源正常 t'l4$}(
68 Power Groud 功率地 IrqM_OjC
69 Power Save Mode 节电模式 bIAE?D
70 Power up 上电 K+F"V W*?
71 pull down 下拉 C;N6",s!
72 pull up 上拉 dD=$$(
je
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) L ,dh$F
74 push pull converter 推挽转换器 kz7FQE
75 ramp down 斜降 N8{jvat
76 ramp up 斜升 cR/Nl pX
77 redundant diode 冗余二极管 V0>X2&.A
78 resistive divider 电阻分压器 d?2ORr|m=
79 ringing 振 铃 o8 JOpD
80 ripple current 纹波电流 5M0Q'"`F:
81 rising edge 上升沿 gHrs|6q9
82 sense resistor 检测电阻 >+P}S@
83 Sequenced Power Supplys 序列电源 '|[V}K5m/f
84 shoot-through 直通,同时导通 , ~O>8VbF
85 stray inductances. 杂散电感 ;7QXs39S
86 sub-circuit 子电路 -AdDPWn
87 substrate 基板 ERpAV-Zf
88 Telecom 电信 ,PTM'O@aU#
89 Thermal Information 热性能信息 w`)5(~b
90 thermal slug 散热片 h|CZ~
91 Threshold 阈值 oS fr5
i
92 timing resistor 振荡电阻 ]P0%S@]
93 Top FET Top FET AafS6]y
94 Trace 线路,走线,引线 )8@-
95 Transfer function 传递函数 olE(#}7V
96 Trip Point 跳变点 7__[=)(b2X
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) AG@gOm
98 Under Voltage Lock Out (UVLO) 欠压锁定 x#D%3v"l_*
99 Voltage Reference 电压参考 GfE>?mG
100 voltage-second product 伏秒积 0Z1ksfLU
101 zero-pole frequency compensation 零极点频率补偿 ""0Y^M2I
102 beat frequency 拍频 QxYm3x5
103 one shots 单击电路 $r/$aq=K
104 scaling 缩放 u2 s
105 ESR 等效串联电阻 [Page] Zv;nY7B
106 Ground 地电位 4v\HaOk
107 trimmed bandgap 平衡带隙 &<VU}c^!
108 dropout voltage 压差 n1."Qix0
109 large bulk capacitance 大容量电容 w}xA@JgQ%
110 circuit breaker 断路器 'Qy6m'esW
111 charge pump 电荷泵 P R%)3
112 overshoot 过冲 djdTh
+>28
nqj(V
印制电路printed circuit e*7O!Z=O
印制线路 printed wiring pl`4&y%Me
印制板 printed board K81X32Lm'
印制板电路 printed circuit board 1=R$ RI
印制线路板 printed wiring board _z@/~M(
印制元件 printed component jIubJQR~
印制接点 printed contact #n>U7j9`O
印制板装配 printed board assembly 41X`.
板 board 5n3yc7NPP
刚性印制板 rigid printed board [ohLG_9
挠性印制电路 flexible printed circuit IVNH.g'
挠性印制线路 flexible printed wiring gNB+e5[; 2
齐平印制板 flush printed board %R0 Wq4}
金属芯印制板 metal core printed board >3!~U.AA'x
金属基印制板 metal base printed board /mkT7,]
多重布线印制板 mulit-wiring printed board q<&1,^A
塑电路板 molded circuit board u cpU$+
散线印制板 discrete wiring board YEu+kBlcQ
微线印制板 micro wire board e
)0 ]WJ
积层印制板 buile-up printed board 0/R;g~q@
表面层合电路板 surface laminar circuit CvU$Fsb
埋入凸块连印制板 B2it printed board C+NN.5No
载芯片板 chip on board !mlfG"FE
埋电阻板 buried resistance board LYDiqOrx
母板 mother board <_YdN)x
子板 daughter board ZmsYRk~@-
背板 backplane ;'S,JGpvT
裸板 bare board IuXgxR%
键盘板夹心板 copper-invar-copper board qp})4XT v
动态挠性板 dynamic flex board \CjJa(vV
静态挠性板 static flex board )'+[,z ;s
可断拼板 break-away planel Cbff:IP
电缆 cable 32ki ?\P
挠性扁平电缆 flexible flat cable (FFC) 5P!ZGbG
薄膜开关 membrane switch sX1DbEjj[o
混合电路 hybrid circuit *K/K97
厚膜 thick film OJ&'Z}LB
厚膜电路 thick film circuit <2pp6je\0s
薄膜 thin film Y#F.{i
薄膜混合电路 thin film hybrid circuit L$PbC!1
互连 interconnection XDPR$u8hM
导线 conductor trace line X:W\EeH
齐平导线 flush conductor $g>bp<9v4
传输线 transmission line clvg5{^q[
跨交 crossover Qt.*Z;Gs
板边插头 edge-board contact F$t]JM
增强板 stiffener )g@+
MR
基底 substrate ED` 1)1<
基板面 real estate =8]`-(
导线面 conductor side aO1^>hy
元件面 component side |4@cX<d.
焊接面 solder side }097[-g7
导电图形 conductive pattern fpf]qQ
W~7
非导电图形 non-conductive pattern g{N}]_%Uh
基材 base material /|v4]t-
层压板 laminate [icD*N<Gc
覆金属箔基材 metal-clad bade material IW\^-LI.
覆铜箔层压板 copper-clad laminate (CCL) kkl'D!z2g
复合层压板 composite laminate rj=as>6B
薄层压板 thin laminate fu!T4{2
基体材料 basis material rUKg<]&@
预浸材料 prepreg |+Wn5iT
粘结片 bonding sheet !<];N0nt#
预浸粘结片 preimpregnated bonding sheer tD.#*.7
环氧玻璃基板 epoxy glass substrate 2K:A4)jZ
预制内层覆箔板 mass lamination panel irlFB#..
内层芯板 core material YoKE=ln7
粘结层 bonding layer r?DCR\Jq
粘结膜 film adhesive Vlx.C~WYn
无支撑胶粘剂膜 unsupported adhesive film d|R-K7 ~~
覆盖层 cover layer (cover lay) yY8zTWji_
增强板材 stiffener material 6:8s,a3&[k
铜箔面 copper-clad surface =`+D/
W\[Y
去铜箔面 foil removal surface _[[0rn$
层压板面 unclad laminate surface ZxtO.U2
基膜面 base film surface 9^/Y7Wp/@
胶粘剂面 adhesive faec MFq?mZ,
原始光洁面 plate finish $OZ= L
粗面 matt finish U`6|K$@
剪切板 cut to size panel b+~_/;Y9
超薄型层压板 ultra thin laminate T<*)Cdid
A阶树脂 A-stage resin h3`}{
w
B阶树脂 B-stage resin kP`#zwp'Ci
C阶树脂 C-stage resin *EuX7LEu_
环氧树脂 epoxy resin GFFwk4n1
酚醛树脂 phenolic resin }# s{."
聚酯树脂 polyester resin 6w<rSU d'
聚酰亚胺树脂 polyimide resin :)lS9<Y}
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin r)gK5Mv
丙烯酸树脂 acrylic resin JU)^b
V_
三聚氰胺甲醛树脂 melamine formaldehyde resin bUcp8
多官能环氧树脂 polyfunctional epoxy resin T`e`nQ0nn
溴化环氧树脂 brominated epoxy resin RI*n]HNgy+
环氧酚醛 epoxy novolac 6/<Hx@r (
氟树脂 fluroresin LzL)qdL
硅树脂 silicone resin ChK-L6
硅烷 silane TU6s~
聚合物 polymer zTc;-,
无定形聚合物 amorphous polymer AFi_P\X
结晶现象 crystalline polamer :E-$:\V0}k
双晶现象 dimorphism M0$MK>
共聚物 copolymer a]p9[Nk
合成树脂 synthetic BWxfY^,'&6
热固性树脂 thermosetting resin [Page] ~u%$ 9IhM
热塑性树脂 thermoplastic resin azZtuDfv
感光性树脂 photosensitive resin 6:(s8e
环氧值 epoxy value 1Le8W)J
双氰胺 dicyandiamide kl]V_ 7[
粘结剂 binder zr!7*,
p
胶粘剂 adesive c!E{fS P
固化剂 curing agent ~Eg]Auk7
阻燃剂 flame retardant bse`Xfg
遮光剂 opaquer T^4 dHG-(
增塑剂 plasticizers =@d#@
不饱和聚酯 unsatuiated polyester yP7b))AW9
聚酯薄膜 polyester xT 06*wQ
聚酰亚胺薄膜 polyimide film (PI) z%E(o%l8
聚四氟乙烯 polytetrafluoetylene (PTFE) 'd2
:a2C]
增强材料 reinforcing material deAV:c
折痕 crease MiZ<v/L2
云织 waviness ?1L<VL=b
鱼眼 fish eye 81EEYf
毛圈长 feather length g?80>-!bF
厚薄段 mark ;h1hz^Wq
裂缝 split QKjn/%l"@
捻度 twist of yarn rf=l1GW
浸润剂含量 size content ZV--d'YiEm
浸润剂残留量 size residue PPl o0R
处理剂含量 finish level |fKT@2(
偶联剂 couplint agent Stwg[K0<
断裂长 breaking length {>
,M
吸水高度 height of capillary rise WOn<JCh]
湿强度保留率 wet strength retention =Fc]mcJ69
白度 whitenness rG?5z"
导电箔 conductive foil E"'u2jEG^
铜箔 copper foil =RHtugwy
压延铜箔 rolled copper foil ?lkB{-%rQ
光面 shiny side EmaS/]X[
粗糙面 matte side ng/h6
S
处理面 treated side B:X%k/{
防锈处理 stain proofing 6/ 5c|
双面处理铜箔 double treated foil y7/4u-_c
模拟 simulation Sj I,v+
逻辑模拟 logic simulation 2->Lz
电路模拟 circit simulation CmXLD} L_x
时序模拟 timing simulation R]yce2w" z
模块化 modularization |= cc >]
设计原点 design origin m!KEK\5M?
优化(设计) optimization (design) rGQD+ d
供设计优化坐标轴 predominant axis lD0a<L3
表格原点 table origin Gx$m"Jeq\
元件安置 component positioning .tKBmq0xo"
比例因子 scaling factor \FfqIc9;
扫描填充 scan filling Aa_@&e
矩形填充 rectangle filling vLxaZWr
填充域 region filling hdWV vN
实体设计 physical design ~D@ YLW1z(
逻辑设计 logic design &Z>??|f
逻辑电路 logic circuit +EjXoW7V
层次设计 hierarchical design CKHmJ]=
自顶向下设计 top-down design oUn+tu:
自底向上设计 bottom-up design LpY{<:y
费用矩阵 cost metrix pq
r_{
元件密度 component density lv?`+tU2_
自由度 degrees freedom 3|!3R'g/ >
出度 out going degree ujnT B*Cqc
入度 incoming degree $gnrd~v4e
曼哈顿距离 manhatton distance z2{y<a9;?
欧几里德距离 euclidean distance >d`GNE
网络 network D}
B?~Lls
阵列 array QGI@5
段 segment Y!45Kio
逻辑 logic EVLL,x.~:z
逻辑设计自动化 logic design automation TrzAgNt
分线 separated time fZpi+I
分层 separated layer g%Tokl
定顺序 definite sequence Mi#i 3y(
导线(通道) conduction (track) tl /i
导线(体)宽度 conductor width OvQzMXU^I
导线距离 conductor spacing lx4pTw1
导线层 conductor layer 0?oL zw&
导线宽度/间距 conductor line/space y;CX)!8
第一导线层 conductor layer No.1 ;o'r@4^&$R
圆形盘 round pad u=Ik&^v
Wq
方形盘 square pad r'y Nc&~
菱形盘 diamond pad d:|x e :
长方形焊盘 oblong pad ZHjL8Iq
子弹形盘 bullet pad ?;v\wx
泪滴盘 teardrop pad IagM#}m@
雪人盘 snowman pad @.$-
^-
形盘 V-shaped pad V _BA; H+M
环形盘 annular pad ip<VRC5`5
非圆形盘 non-circular pad s}". po]
隔离盘 isolation pad hFm^Fy[R
非功能连接盘 monfunctional pad f8[O]MrO;
偏置连接盘 offset land Ph]b6
腹(背)裸盘 back-bard land qD*y60~]zz
盘址 anchoring spaur Pb;c:HeI/
连接盘图形 land pattern E,tdn#_|
连接盘网格阵列 land grid array ~n@rX=Y)]0
孔环 annular ring BFw_T3}zn
元件孔 component hole &-qQF`7
安装孔 mounting hole Q<u?BA/
支撑孔 supported hole TW>GYGz
非支撑孔 unsupported hole
$adZ|Q\
导通孔 via czIAx1R9
镀通孔 plated through hole (PTH) &~+QPnI>Pm
余隙孔 access hole ^CLQs;zXE
盲孔 blind via (hole) hsrf 2Xw[
埋孔 buried via hole mrRid}2
埋,盲孔 buried blind via g/f6N
z
任意层内部导通孔 any layer inner via hole aOd#f:{y
全部钻孔 all drilled hole ]w>o=<?b
定位孔 toaling hole V'{\g|)
无连接盘孔 landless hole wHs1ge (
中间孔 interstitial hole vTx>z\7q,
无连接盘导通孔 landless via hole Z6${nUX
引导孔 pilot hole C`t@tgT
端接全隙孔 terminal clearomee hole (eU 4{X7
准尺寸孔 dimensioned hole [Page] L~t<
0\r
在连接盘中导通孔 via-in-pad sw}O g`U
孔位 hole location QPB,B>Z
孔密度 hole density WtZI1`\qe
孔图 hole pattern 8>[g/%W
钻孔图 drill drawing ,.0bE
9\o
装配图assembly drawing -O\i^?lD;
参考基准 datum referan 3%?tUt
1) 元件设备 ou-UR5
':;k<(<-
三绕组变压器:three-column transformer ThrClnTrans 4zS0kk;+
双绕组变压器:double-column transformer DblClmnTrans ;DK%!."%
电容器:Capacitor K [DpH&
并联电容器:shunt capacitor }r@dZBp:
电抗器:Reactor &
V>rq'~;
母线:Busbar -ymDRoi
输电线:TransmissionLine vb]kh_
发电厂:power plant ="YGR:
断路器:Breaker 0)Ephsw
刀闸(隔离开关):Isolator MBg[hu%
分接头:tap 7xeqs
q
电动机:motor r~)fAb?
(2) 状态参数 )L:e0u
wxvi)|)
有功:active power j~{cT/5Y_
无功:reactive power B ktRA
电流:current -&Xv,:'?
容量:capacity 0pMN@Cz6
电压:voltage Oq.ss!/z
档位:tap position [-$
Do
有功损耗:reactive loss D`WRy}o
无功损耗:active loss <r:AJ;
功率因数:power-factor *"w hup[
功率:power d)vP9vXy
功角:power-angle * $f`ouJl
电压等级:voltage grade XJe=+_K9
空载损耗:no-load loss @/<UhnI
铁损:iron loss &t9V
铜损:copper loss wv3,%
lN
空载电流:no-load current m@Yc&M~
阻抗:impedance aq$ hE-{28
正序阻抗:positive sequence impedance _F%`7j
负序阻抗:negative sequence impedance O,B\|pd2
零序阻抗:zero sequence impedance )k,n}
电阻:resistor P'U2hCif
电抗:reactance 3>1^$0iq
电导:conductance W\kli';jyC
电纳:susceptance kh0cJE\_^
无功负载:reactive load 或者QLoad EB*sd S
有功负载: active load PLoad 2HFn\kjj.s
遥测:YC(telemetering) =Hd yra
遥信:YX PoF3fy%.
励磁电流(转子电流):magnetizing current 7_i8'(``
定子:stator mtv8Bm=<
功角:power-angle Lg7A[\c
~
上限:upper limit GjhTF|
下限:lower limit d5m-f/
并列的:apposable 3^y(@XFt
高压: high voltage "OjAhKfG
低压:low voltage !B3TLeh
中压:middle voltage XH!#_jy
电力系统 power system [
/o'l:
发电机 generator xN-,gT'!
励磁 excitation 5^ Qa8yA>7
励磁器 excitor rz "$zc.)
电压 voltage 4 ThFC
电流 current :k/Xt$`
母线 bus v(2N@s<%
变压器 transformer rR.It,,
升压变压器 step-up transformer Xi&J%N'
高压侧 high side bT.q@oU
输电系统 power transmission system y'_8b=*
输电线 transmission line -@#w)
固定串联电容补偿fixed series capacitor compensation .hat!Tt9
稳定 stability ]1!" q40)]
电压稳定 voltage stability T0w_d_aS
功角稳定 angle stability D`LBv,n
暂态稳定 transient stability P"vrYom
电厂 power plant n[ B~C
能量输送 power transfer sT\:**
交流 AC [r/zBF-.
装机容量 installed capacity 5BhR4+1J
电网 power system NHGTV$T`1
落点 drop point L|'^P3#7`
开关站 switch station So aqmY;+
双回同杆并架 double-circuit lines on the same tower !__0Vk[s
变电站 transformer substation ,S-h~x
补偿度 degree of compensation @RoZd?
高抗 high voltage shunt reactor bU!
v
无功补偿 reactive power compensation
X06Lr!-%
故障 fault L!fTYX#K]
调节 regulation ]i*ucW4
裕度 magin eTuqK23
三相故障 three phase fault $m 4-^=
故障切除时间 fault clearing time ZL!u$)(V
极限切除时间 critical clearing time ?%s>a8w
切机 generator triping tq3_az ~1
高顶值 high limited value V_+&Y$msi~
强行励磁 reinforced excitation ^dQ{vL@9b9
线路补偿器 LDC(line drop compensation) 4_R|3L
机端 generator terminal S0,\{j
静态 static (state) Qz~uD'Rs/
动态 dynamic (state) <g[z jV9p
单机无穷大系统 one machine - infinity bus system XIW0Z C
机端电压控制 AVR .hl_zc#
电抗 reactance EbC!tR
电阻 resistance xVm-4gB
功角 power angle A l U^,X
有功(功率) active power A]z*#+Sl
无功(功率) reactive power 9njl,Q:
功率因数 power factor cr1x
CPJj
无功电流 reactive current ]b4WfIu
下降特性 droop characteristics v4ot08 C
斜率 slope 6\4-I^=B
额定 rating !U^{`V jp[
变比 ratio DP ? dC`
参考值 reference value jj5S+ >4
电压互感器 PT !J`lA
分接头 tap ++0)KSvw
下降率 droop rate ^#/FkEt7bp
仿真分析 simulation analysis 6%v9o?:~l
传递函数 transfer function 4DA34m(
框图 block diagram XjX
受端 receive-side 7;'33Bm*
裕度 margin >L7s[vKn
同步 synchronization 'YL[s
失去同步 loss of synchronization _P;D.>?
阻尼 damping (`P\nnb
摇摆 swing yYG<tUG;
保护断路器 circuit breaker Ni,nQ;9
电阻:resistance %q {q.(M#
电抗:reactance R@vcS=m7
阻抗:impedance %Sr+D{B
电导:conductance V`V\/s gj
电纳:susceptance