1 backplane 背板 l7|z]v-
2 Band gap voltage reference 带隙电压参考 J$#T_4 )
3 benchtop supply 工作台电源 Lc{AB!Br
4 Block Diagram 方块图 5 Bode Plot 波特图 w"j>^#8
6 Bootstrap 自举 rfqwxr45h
7 Bottom FET Bottom FET qYK^S4L
8 bucket capcitor 桶形电容 5#GMp
9 chassis 机架 x3q^}sj%
10 Combi-sense Combi-sense MTu\T
11 constant current source 恒流源 D0Dz@25-
12 Core Sataration 铁芯饱和 hY`<J]-'`
13 crossover frequency 交叉频率 ~/L:$
14 current ripple 纹波电流 "wgPPop
15 Cycle by Cycle 逐周期 OG5{oH#K
16 cycle skipping 周期跳步 zjmoIE
17 Dead Time 死区时间 \u,CixV=
18 DIE Temperature 核心温度 )ros-dp`
19 Disable 非使能,无效,禁用,关断 ,Kv6!ib6Q
20 dominant pole 主极点 76l. {TXF
21 Enable 使能,有效,启用 &<t%u[3
22 ESD Rating ESD额定值 2Re8rcQQU
23 Evaluation Board 评估板 I~&*^q6 |
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 3Bl|~K;-
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 1dN/H)]
25 Failling edge 下降沿 74([~Qs _M
26 figure of merit 品质因数 4|?(LHBD)
27 float charge voltage 浮充电压 ?(9*@
28 flyback power stage 反驰式功率级 ),x0G*oebj
29 forward voltage drop 前向压降 2j-l<!s
30 free-running 自由运行 rS [4Pey
31 Freewheel diode 续流二极管 \@@ G\\)er
32 Full load 满负载 33 gate drive 栅极驱动 In?rQiD9
34 gate drive stage 栅极驱动级 > "hP
35 gerber plot Gerber 图 HxO+JI`'3
36 ground plane 接地层 %r^tZ ;;l
37 Henry 电感单位:亨利 hkPMu@BI
38 Human Body Model 人体模式 V D#q\
39 Hysteresis 滞回 & DP"RWT/
40 inrush current 涌入电流 z4YDngf=4
41 Inverting 反相 mnA_$W3~I
42 jittery 抖动 e|tx`yA
43 Junction 结点 $n<1D -0!r
44 Kelvin connection 开尔文连接 U^_\V BAk
45 Lead Frame 引脚框架 <WUgH6"
46 Lead Free 无铅 #6M |T+=
47 level-shift 电平移动 :Racu;xf
48 Line regulation 电源调整率 ;mpY cpI
49 load regulation 负载调整率 n/v.U,f&l@
50 Lot Number 批号 -8)Hulo/{U
51 Low Dropout 低压差 dk7x<$h-h0
52 Miller 密勒 53 node 节点 ep8UWxB5
54 Non-Inverting 非反相 hJSvx
55 novel 新颖的 Uh0g !zzp
56 off state 关断状态 aVR!~hvFs
57 Operating supply voltage 电源工作电压 QvbH " 7
58 out drive stage 输出驱动级 kwp%5C-S
59 Out of Phase 异相 !60U^\
60 Part Number 产品型号 2*sTU
61 pass transistor pass transistor G ]h
62 P-channel MOSFET P沟道MOSFET N8nt2r<h
63 Phase margin 相位裕度 :
;8L1'
64 Phase Node 开关节点 -7!L]BcZ.
65 portable electronics 便携式电子设备 d./R;Z- I{
66 power down 掉电 Fx!D:.)/G
67 Power Good 电源正常 N_92,xI#
68 Power Groud 功率地 |OLXb+7X
69 Power Save Mode 节电模式 ;=joQWNDm
70 Power up 上电 u.A}&'H
71 pull down 下拉 6"_pCkn;c<
72 pull up 上拉 ;8<HB1 &,
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ?n#$y@U
74 push pull converter 推挽转换器 f%PLR9Nh5@
75 ramp down 斜降 (g@X.*c8
76 ramp up 斜升 @:im/SE
77 redundant diode 冗余二极管 +o@:8!IM1
78 resistive divider 电阻分压器 w7`pbcY,
79 ringing 振 铃 d%I7OBBx@
80 ripple current 纹波电流 .$s']' =
81 rising edge 上升沿 fTpG>*{p
82 sense resistor 检测电阻 )&E]
83 Sequenced Power Supplys 序列电源 g(zeOS]q}
84 shoot-through 直通,同时导通 ^zTe9:hz/\
85 stray inductances. 杂散电感 u"zR_CzYc
86 sub-circuit 子电路 0xZ^ f}@L
87 substrate 基板 O)W+rmToI
88 Telecom 电信 sPc}hG+N
89 Thermal Information 热性能信息 <cZ/_+H%C
90 thermal slug 散热片 i+(>w'=m
91 Threshold 阈值 } J?,?>Z
92 timing resistor 振荡电阻 CA|l|
t^
93 Top FET Top FET aA$\iFYA
94 Trace 线路,走线,引线 9Tr ceL;
95 Transfer function 传递函数 `}`Q qv
96 Trip Point 跳变点 PCwc=
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) \5tG>>c i
98 Under Voltage Lock Out (UVLO) 欠压锁定 ?Sh"%x
99 Voltage Reference 电压参考 ?#a&eW
100 voltage-second product 伏秒积 Y'000#+
101 zero-pole frequency compensation 零极点频率补偿 lV:feX
102 beat frequency 拍频 #do%u"q
103 one shots 单击电路 ..Dm@m}
104 scaling 缩放 8a)4>B
105 ESR 等效串联电阻 [Page] #9s)f R
106 Ground 地电位 -J=6)
107 trimmed bandgap 平衡带隙 i`52tH y_
108 dropout voltage 压差 :Z/\U*6~
109 large bulk capacitance 大容量电容 )n"0:"Ou
110 circuit breaker 断路器 9BP'[SM%),
111 charge pump 电荷泵 t]Ln(r
112 overshoot 过冲 c|3oa"6T>
M]X!D7
印制电路printed circuit MB:[: nX
印制线路 printed wiring M._E$y,5
印制板 printed board ]@21K O
印制板电路 printed circuit board
6p@[U>`
印制线路板 printed wiring board 4pMp@b
印制元件 printed component v Cej( ))
印制接点 printed contact J|hVD
印制板装配 printed board assembly x0)=jp '
板 board tq,^!RSbZ
刚性印制板 rigid printed board wEq&O|Vj
挠性印制电路 flexible printed circuit k?HdW(HA
挠性印制线路 flexible printed wiring SFh<>J^ 0a
齐平印制板 flush printed board mW {uChHP
金属芯印制板 metal core printed board Y,L[0%
金属基印制板 metal base printed board iVnMn1h
多重布线印制板 mulit-wiring printed board u(yN81
塑电路板 molded circuit board [(g2u@
散线印制板 discrete wiring board Z&?4<-@6\p
微线印制板 micro wire board \:F$7 *Ne
积层印制板 buile-up printed board g||EjCsp
表面层合电路板 surface laminar circuit 6:S,
{@G
埋入凸块连印制板 B2it printed board F,)+9/S&
载芯片板 chip on board G6{'|CV
埋电阻板 buried resistance board ^w%%$9=:r
母板 mother board UrciCOQf
子板 daughter board HCrQ+r{g
背板 backplane .|u`s,\
裸板 bare board \:s%;s51
键盘板夹心板 copper-invar-copper board LEjq<t1&
动态挠性板 dynamic flex board {S+?n[1r\
静态挠性板 static flex board x6JV@wA&
可断拼板 break-away planel F (kq
电缆 cable |15!D
挠性扁平电缆 flexible flat cable (FFC) ;=IJHk1&
薄膜开关 membrane switch [?:MIl#!
混合电路 hybrid circuit CG@Fn\J
厚膜 thick film _(?`eWo
厚膜电路 thick film circuit #%ld~dgz-
薄膜 thin film l d#x'/
薄膜混合电路 thin film hybrid circuit 'bLP#TAzf
互连 interconnection ID`C
导线 conductor trace line |*w)]2Bl
齐平导线 flush conductor "CC"J(&a
传输线 transmission line \z2y?"\?
跨交 crossover E<tR8='F
板边插头 edge-board contact N;YFr
增强板 stiffener ,6MJW#~]
基底 substrate Dz$w6d
基板面 real estate tA4Ra,-c
导线面 conductor side o:cTc:l)
元件面 component side S'$m3,l(k
焊接面 solder side OAiW8BAe
导电图形 conductive pattern bJ
6ivz
非导电图形 non-conductive pattern 451.VI}MR
基材 base material RLL
ph
层压板 laminate Iv3yDL;
覆金属箔基材 metal-clad bade material c\>I0HH;!
覆铜箔层压板 copper-clad laminate (CCL) "|J6*s
复合层压板 composite laminate Q1|6;4L
薄层压板 thin laminate &R.5t/x_
基体材料 basis material #r"|%nOfY
预浸材料 prepreg Ap?,y?
粘结片 bonding sheet XNx$^I=
预浸粘结片 preimpregnated bonding sheer gQSVPbzK
环氧玻璃基板 epoxy glass substrate `Rq|*:LV
预制内层覆箔板 mass lamination panel ipMSMk7gx
内层芯板 core material /d6Rdl`w
粘结层 bonding layer z__t8yc3
粘结膜 film adhesive Op9 ^Eu%n
无支撑胶粘剂膜 unsupported adhesive film C4PT(cezR
覆盖层 cover layer (cover lay) *szs"mQ/
增强板材 stiffener material k kD#Bb
铜箔面 copper-clad surface hTO2+F*
去铜箔面 foil removal surface ECM#J28D
层压板面 unclad laminate surface '3^ qW
基膜面 base film surface nG5\vj,zB
胶粘剂面 adhesive faec j>\rs|^O
原始光洁面 plate finish |[5;dt_U/
粗面 matt finish Hci>q`p#
剪切板 cut to size panel [S]q'c)
超薄型层压板 ultra thin laminate 8;"%x|iBoL
A阶树脂 A-stage resin D9P,[:"
B阶树脂 B-stage resin 5CcX'*P
C阶树脂 C-stage resin w0nbL^f
环氧树脂 epoxy resin (t&`m[>K
酚醛树脂 phenolic resin ?-Of\fNu
聚酯树脂 polyester resin {Y-'i;j?
聚酰亚胺树脂 polyimide resin OSUiS`k
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin t1
9f%d
丙烯酸树脂 acrylic resin NWiDNK[VE}
三聚氰胺甲醛树脂 melamine formaldehyde resin [R8BcO(
多官能环氧树脂 polyfunctional epoxy resin wTR?8$
溴化环氧树脂 brominated epoxy resin PCgr`($U
环氧酚醛 epoxy novolac 52#
*{q}
氟树脂 fluroresin '>1M~B
硅树脂 silicone resin G6>sAOf
硅烷 silane 2P'Vp7f6 Y
聚合物 polymer .WN&]yr,
无定形聚合物 amorphous polymer {_.(,Z{
结晶现象 crystalline polamer X1}M_h%
双晶现象 dimorphism ^J^~5q8
共聚物 copolymer 9cN@y<_I
合成树脂 synthetic $U7/w?gc'
热固性树脂 thermosetting resin [Page] N#-.[9!
热塑性树脂 thermoplastic resin nXfz@q
感光性树脂 photosensitive resin N
GnE
环氧值 epoxy value $,r%@'= &
双氰胺 dicyandiamide S{2;PaK
粘结剂 binder NW0se
DL
胶粘剂 adesive ?Q=(?yR0]
固化剂 curing agent a(O@E%|u
阻燃剂 flame retardant U,yZ.1V^:
遮光剂 opaquer 6 mLC{X[
增塑剂 plasticizers mP15PZ
不饱和聚酯 unsatuiated polyester D1>*ml
聚酯薄膜 polyester &u[F)|
聚酰亚胺薄膜 polyimide film (PI) [-Y~g%M
聚四氟乙烯 polytetrafluoetylene (PTFE) ~MB)}!S:
增强材料 reinforcing material 5lzbg
折痕 crease N`N=}&v ]
云织 waviness #<&@-D8
鱼眼 fish eye /i@.Xg@:
毛圈长 feather length >zJk G9a
厚薄段 mark :&z!o"K
裂缝 split !}U3{L-
捻度 twist of yarn s2N'Ip
浸润剂含量 size content +J| LfXgB
浸润剂残留量 size residue 8aRmHy"9l
处理剂含量 finish level hTby:$aCg
偶联剂 couplint agent BBX/ &d8n
断裂长 breaking length !7#*Wdt+P
吸水高度 height of capillary rise p\'X%R
湿强度保留率 wet strength retention RmKbnS$*q
白度 whitenness a>8]+@
导电箔 conductive foil k"BM1-f
铜箔 copper foil leizjL\P
压延铜箔 rolled copper foil {nA+-=T
光面 shiny side {#z47Rz
粗糙面 matte side t*BCpC}
处理面 treated side fIx|0,D&7L
防锈处理 stain proofing ?_ uan
双面处理铜箔 double treated foil K|~!oQ
模拟 simulation <$uDN].T4
逻辑模拟 logic simulation vft7-|8T
电路模拟 circit simulation wp~KrUlR
时序模拟 timing simulation qB$QC
模块化 modularization ],R\oMYy|P
设计原点 design origin 5>1c4u`x
优化(设计) optimization (design) V+0pvgS[
供设计优化坐标轴 predominant axis Ug gg!zA
表格原点 table origin xQ?$H?5B<
元件安置 component positioning k-s|gC4
比例因子 scaling factor D2MIV&pahP
扫描填充 scan filling +['1~5
矩形填充 rectangle filling E){ODyk
填充域 region filling _Eq,udCso
实体设计 physical design t?weD{O
逻辑设计 logic design Gh{9nM_\"
逻辑电路 logic circuit K;\fJ2ag
层次设计 hierarchical design tg/!=g
自顶向下设计 top-down design W Kd:O)J
自底向上设计 bottom-up design y?}<SnjP:
费用矩阵 cost metrix ky]L`w
元件密度 component density -=1>t3~\
自由度 degrees freedom \)MzUOZn
出度 out going degree l0',B*og
入度 incoming degree @2$Uk!
曼哈顿距离 manhatton distance )T(1oK(g
欧几里德距离 euclidean distance *a(GG
网络 network E`wq`g`H<
阵列 array dt<P6pK-
段 segment $9Xn.,W
逻辑 logic h2+"e# _
逻辑设计自动化 logic design automation KlwBoC/{K
分线 separated time /(s N@kt
分层 separated layer vsq
|m5
定顺序 definite sequence raP9rEs
导线(通道) conduction (track) Qq.Ja%Zq
导线(体)宽度 conductor width { ux'9SA
导线距离 conductor spacing vhU
$GG8
导线层 conductor layer >v/%R~BuX
导线宽度/间距 conductor line/space KC<K*UHPAH
第一导线层 conductor layer No.1 $ O;a~/T
圆形盘 round pad xWWVU}fd1
方形盘 square pad =|
r%
lx
菱形盘 diamond pad !i{5mc\
长方形焊盘 oblong pad ?*QL;[n1
子弹形盘 bullet pad .36]>8
泪滴盘 teardrop pad R++w>5 5A
雪人盘 snowman pad VW] ,R1q
形盘 V-shaped pad V =AuxMEg
环形盘 annular pad N;cSR\Ng
非圆形盘 non-circular pad P$/Y9o
隔离盘 isolation pad G$lE0_j2{
非功能连接盘 monfunctional pad 8tT/w5
偏置连接盘 offset land >+[{m<Eq
腹(背)裸盘 back-bard land Nqj5, 9*c
盘址 anchoring spaur EhOB+Mc1
连接盘图形 land pattern clT[?8*
连接盘网格阵列 land grid array #\LYo{op/.
孔环 annular ring 4"+v:t)z6{
元件孔 component hole <Um 5w1
安装孔 mounting hole xUB{{8B:L
支撑孔 supported hole \Dx)P[Ur
非支撑孔 unsupported hole G|UeR=/
导通孔 via !@)tkhP
镀通孔 plated through hole (PTH) xwijCFI*
余隙孔 access hole V67<Ky>
盲孔 blind via (hole) 3+vMi[YO
埋孔 buried via hole //}KWz
埋,盲孔 buried blind via "!o|^nN,
任意层内部导通孔 any layer inner via hole 6.3qux9
全部钻孔 all drilled hole S<++eu
定位孔 toaling hole )aX#RM? N
无连接盘孔 landless hole kl5Y{![/&f
中间孔 interstitial hole ((fFe8Rn)q
无连接盘导通孔 landless via hole TzV~I\a|
引导孔 pilot hole 4+N9Ylh
端接全隙孔 terminal clearomee hole MBFn s/
准尺寸孔 dimensioned hole [Page] #\O?|bN'q
在连接盘中导通孔 via-in-pad ;E\ e.R
孔位 hole location chU,));F
孔密度 hole density K=J">^uW
孔图 hole pattern 0(|36;x
钻孔图 drill drawing J['?ud}@
装配图assembly drawing
hh^_Z| 5
参考基准 datum referan t,yMO
1) 元件设备 ^ Mq8jw(2
xcXnd"YYE
三绕组变压器:three-column transformer ThrClnTrans k=.pcDX
双绕组变压器:double-column transformer DblClmnTrans N6/;p]|
电容器:Capacitor fSm|anuKZe
并联电容器:shunt capacitor ju/#V}N
电抗器:Reactor )s8{|) -
母线:Busbar .$r7q[
输电线:TransmissionLine 9Ui|8e~=
发电厂:power plant ' n "n;
断路器:Breaker 2PVQSwW:
刀闸(隔离开关):Isolator ,mD{4 >7
分接头:tap Y^}c+)t
电动机:motor T=T1?@2C
(2) 状态参数 (L7%V !
qoJ<e`h}
有功:active power \7tJ)[0aF
无功:reactive power @D=i|f
电流:current 0/b3]{skK
容量:capacity K55]W2I9
电压:voltage +bcJm
档位:tap position
MVe4[<
有功损耗:reactive loss |F?/L>
无功损耗:active loss xayd_RB 9
功率因数:power-factor oJor
]QY K
功率:power A!aki}aT~
功角:power-angle rPoq~p[Y
电压等级:voltage grade 1H7bPl|
空载损耗:no-load loss %9`\7h7K
铁损:iron loss =_9grF-
铜损:copper loss 6kHb*L Je
空载电流:no-load current :LX
(9f
阻抗:impedance ]*pro|
正序阻抗:positive sequence impedance JReJlDu
负序阻抗:negative sequence impedance C4t@;U=x
零序阻抗:zero sequence impedance ](sT,'
电阻:resistor }Uunlz<
电抗:reactance sn:wLc/GAd
电导:conductance "A3V(~%!
电纳:susceptance bRK[u\,
无功负载:reactive load 或者QLoad eR:!1z_h
有功负载: active load PLoad D=!5l4
遥测:YC(telemetering) 3^p;'7x
遥信:YX mpDQhD[n
励磁电流(转子电流):magnetizing current 9i/VvW
定子:stator >iFi~)i_4y
功角:power-angle S"Mm_<A$@
上限:upper limit XiN@$
下限:lower limit jmh$6 N%
F
并列的:apposable .V\:)\<|
高压: high voltage $ 2PpG|q
低压:low voltage PitDk
1T
中压:middle voltage hYU4%"X
电力系统 power system R{SN.% {;
发电机 generator IRB BLXv7\
励磁 excitation Tn(c%ytN
励磁器 excitor nM6/c
电压 voltage '7/c7m/$X<
电流 current xBKis\b
母线 bus kJG0X%+w
变压器 transformer s2iL5N|"Q
升压变压器 step-up transformer cXG$zwS\
高压侧 high side @DA.$zn&
输电系统 power transmission system s!F`
0=J^
输电线 transmission line \} +b_J6-
固定串联电容补偿fixed series capacitor compensation Pvu*Y0_p
稳定 stability 2vx1M6a)L
电压稳定 voltage stability @6:J$B~)u
功角稳定 angle stability 2g:V_%
暂态稳定 transient stability +JRPd.B"@
电厂 power plant ^%~ux0%^T
能量输送 power transfer S|v")6
交流 AC sj\kp
ni
装机容量 installed capacity g|PRk9
电网 power system hTK6N
落点 drop point oV Hh
开关站 switch station R`!'c(V
双回同杆并架 double-circuit lines on the same tower !Xf7RT
变电站 transformer substation i2(lqhaP
补偿度 degree of compensation e!JC5Al7
高抗 high voltage shunt reactor :~{x'`czJ
无功补偿 reactive power compensation bf1EMai"
故障 fault OVgx2_F
调节 regulation %q)*8
裕度 magin i*-L_!cc:
三相故障 three phase fault ;E]^7T
故障切除时间 fault clearing time [Uw/;Kyh
极限切除时间 critical clearing time EoD[,:*
切机 generator triping 9$oU6#U,h
高顶值 high limited value &['cZ/bM
强行励磁 reinforced excitation `'
"125T
线路补偿器 LDC(line drop compensation) Ua=w;h
机端 generator terminal i%eq!q
静态 static (state) |#_`aT"
动态 dynamic (state) UOAL7
单机无穷大系统 one machine - infinity bus system X9oxni#
机端电压控制 AVR q=(.N>%
电抗 reactance B>"O~ gZ{#
电阻 resistance )`B
n"=
功角 power angle tV5Uz&:b
有功(功率) active power FSn&N2[D
无功(功率) reactive power sGdlS&08(
功率因数 power factor g8^YDrH
无功电流 reactive current ^~Dmb2h
下降特性 droop characteristics N!
N>/9
斜率 slope DsZBhjCB
额定 rating ~KF>Jow?Y
变比 ratio .uGvmD<;x
参考值 reference value Q4vl
电压互感器 PT /9..hEq^
分接头 tap h<8.0
下降率 droop rate ++)3*+N+
仿真分析 simulation analysis ;mw$(ZKa#
传递函数 transfer function d5O_~xf&
框图 block diagram 8Q2qroT
受端 receive-side .3JLa8y
裕度 margin |JD"iP:
同步 synchronization V`/D!8>
失去同步 loss of synchronization '**dD2
n
阻尼 damping [%`L sY
摇摆 swing !QTfQ69Y0
保护断路器 circuit breaker [)E.T,fjMQ
电阻:resistance wmQT$`$b
电抗:reactance B<p -.tv
阻抗:impedance |)pRkn8x
电导:conductance zj9)vr`7
电纳:susceptance