1 backplane 背板 29?{QJb
2 Band gap voltage reference 带隙电压参考 xj/ +Z!,9
3 benchtop supply 工作台电源 /\-qz$
4 Block Diagram 方块图 5 Bode Plot 波特图 oEE*H2l\
6 Bootstrap 自举 "8Ud&o
7 Bottom FET Bottom FET R4< }kA,.
8 bucket capcitor 桶形电容 a
X >bC-
9 chassis 机架 '3f"#fF6
10 Combi-sense Combi-sense i/nA(%_
11 constant current source 恒流源 6xs_@Vk|d
12 Core Sataration 铁芯饱和 pJ6Z/ 3]
13 crossover frequency 交叉频率 m<>3GF,5bP
14 current ripple 纹波电流 ZB'/D O=i
15 Cycle by Cycle 逐周期 R=I ZFwr
16 cycle skipping 周期跳步 ~+{OSx<S
17 Dead Time 死区时间 .0:t wj
18 DIE Temperature 核心温度 &46h!g W
19 Disable 非使能，无效，禁用，关断 D7b<&D@
20 dominant pole 主极点 *5k" v"NM(
21 Enable 使能，有效，启用 x4cP% {n
22 ESD Rating ESD额定值 }fW@8ji\
23 Evaluation Board 评估板 V:rq}F}
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. yz}Agc4.I
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 x8Rmap@L.
25 Failling edge 下降沿 I| qoH N,g
26 figure of merit 品质因数 wRL=9/5(8
27 float charge voltage 浮充电压 O_#Ag K<A
28 flyback power stage 反驰式功率级 !HM|~G7
29 forward voltage drop 前向压降 '~{^c }
30 free-running 自由运行 ST3a iyG
31 Freewheel diode 续流二极管 oagxTFh8~
32 Full load 满负载 33 gate drive 栅极驱动 /sf:.TpVh
34 gate drive stage 栅极驱动级 ?Gc9^b B I
35 gerber plot Gerber 图 >&mlwxqv
36 ground plane 接地层 CwQgA%) !i
37 Henry 电感单位：亨利 MR/jM@ 8
38 Human Body Model 人体模式 R9 o3T)9V
39 Hysteresis 滞回 F#KO!\iA+
40 inrush current 涌入电流 ;7"}I
41 Inverting 反相 4oT1<n`r+
42 jittery 抖动 T8 k@DS
43 Junction 结点 wSHE~Xx
44 Kelvin connection 开尔文连接 r>1M&Y=<
45 Lead Frame 引脚框架 0 !yvcviw
46 Lead Free 无铅 Qi' ,[Xmf
47 level-shift 电平移动 9^Q: l0|
48 Line regulation 电源调整率 tuuc9H4B
49 load regulation 负载调整率 `Q V}je
50 Lot Number 批号 Q}~of}h/
51 Low Dropout 低压差 iha{(-
52 Miller 密勒 53 node 节点 {dV#"+
54 Non-Inverting 非反相 c#M 'Mye
55 novel 新颖的 ]q DhGt
56 off state 关断状态 vr <6j/ty
57 Operating supply voltage 电源工作电压 :B?XNo
58 out drive stage 输出驱动级 ">]v'h(s
59 Out of Phase 异相 O^v^GG=e;C
60 Part Number 产品型号 Tx%6whd/'
61 pass transistor pass transistor
*jo y %F
62 P-channel MOSFET P沟道MOSFET Bi9b"*LN
63 Phase margin 相位裕度 Fx2z lM&
64 Phase Node 开关节点 i|PQNhUe
65 portable electronics 便携式电子设备 XQ&iV7
66 power down 掉电 W!pLk/|ls
67 Power Good 电源正常 (SV(L~ T_
68 Power Groud 功率地 |[n-H;0
69 Power Save Mode 节电模式 l\7 N R
70 Power up 上电 'NF_!D
71 pull down 下拉 [@Y<:6
72 pull up 上拉 Xxcv 5.ug
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） `f`\j
-Lu
74 push pull converter 推挽转换器 _sIhQ8$:
75 ramp down 斜降 h(!x&kZq.
76 ramp up 斜升 {"l_x]q
77 redundant diode 冗余二极管
z "8%W?o>
78 resistive divider 电阻分压器 ;
m F-y,E
79 ringing 振 铃 2@ vSe
80 ripple current 纹波电流 ~TC z1UWV
81 rising edge 上升沿 `2\vDy1,j
82 sense resistor 检测电阻 }Z*@EWc>
83 Sequenced Power Supplys 序列电源 >=-w2&
84 shoot-through 直通，同时导通 4` 5 jq)
85 stray inductances. 杂散电感 /v"u4Ipj
86 sub-circuit 子电路 =vLe OX
87 substrate 基板 k L2(M6m
88 Telecom 电信 3eQ-P8LS
89 Thermal Information 热性能信息 zK893)
90 thermal slug 散热片 `#B|l+b aq
91 Threshold 阈值 @0A7d
$J(
92 timing resistor 振荡电阻 N%!8 I
93 Top FET Top FET w!o[pvyR$
94 Trace 线路，走线，引线 {LfVV5?
95 Transfer function 传递函数 )O~LXK=b
96 Trip Point 跳变点 UR6.zE4=_
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） <wUDcF
98 Under Voltage Lock Out (UVLO) 欠压锁定 b=v
99 Voltage Reference 电压参考 z/u;afB9q
100 voltage-second product 伏秒积 cmF&1o3_
101 zero-pole frequency compensation 零极点频率补偿 $A\fm`
102 beat frequency 拍频 1P(rgn:8e
103 one shots 单击电路 ;Ut0tm
104 scaling 缩放 WCT}OiL sL
105 ESR 等效串联电阻 [Page] =jIB5".
106 Ground 地电位 7?< .L
107 trimmed bandgap 平衡带隙 ^T`)ltI]V
108 dropout voltage 压差 s7=CH
109 large bulk capacitance 大容量电容 _]8FCO
110 circuit breaker 断路器 .w3.zZ0[
111 charge pump 电荷泵 d;O16xcM/
112 overshoot 过冲 DJ;il)^
@~% R%Vu
印制电路printed circuit aOHf#!/"sb
印制线路 printed wiring 'PRsZ`x.
印制板 printed board (@*[^@ipV
印制板电路 printed circuit board >2l1t}"\
印制线路板 printed wiring board (#GOXz
印制元件 printed component = #]^H c
印制接点 printed contact O@r%G0Jge
印制板装配 printed board assembly x!GHUz*:uz
板 board W 1S7%6y_1
刚性印制板 rigid printed board wYy=Tl-N
挠性印制电路 flexible printed circuit x`K<z
J
挠性印制线路 flexible printed wiring '<_nL8A^
齐平印制板 flush printed board S~L$sqt
金属芯印制板 metal core printed board -(9>{!",J
金属基印制板 metal base printed board - &u]B$
多重布线印制板 mulit-wiring printed board `>&V_^y+
塑电路板 molded circuit board 7/QQ&7+NkS
散线印制板 discrete wiring board =W'a6)WE
微线印制板 micro wire board *TQXE:vZ[
积层印制板 buile-up printed board 1'DD9d{ qN
表面层合电路板 surface laminar circuit "L^] a$&
埋入凸块连印制板 B2it printed board 3 T^f#UT
载芯片板 chip on board ?g
gl8bzA
埋电阻板 buried resistance board 0 `%eP5
母板 mother board :VpRpj4f
子板 daughter board o?(({HH
背板 backplane
3D
L7
裸板 bare board ^`>,~$Q
键盘板夹心板 copper-invar-copper board =Hplg>h)
动态挠性板 dynamic flex board `|?K4<5|
静态挠性板 static flex board ax$ashFO/!
可断拼板 break-away planel 4FURm@C6
电缆 cable ("0 7t/||
挠性扁平电缆 flexible flat cable (FFC) o1C1F}gxU
薄膜开关 membrane switch ZXV_Dc
混合电路 hybrid circuit "SC }C
厚膜 thick film +(n&>7 5
厚膜电路 thick film circuit ?WPuTPw{
薄膜 thin film IcmTF #{D
薄膜混合电路 thin film hybrid circuit ;NNYJqWd^]
互连 interconnection x=>B 6o-f
导线 conductor trace line "TW%-67
齐平导线 flush conductor &Omo\Oq&W>
传输线 transmission line 3cfJ(% 'X
跨交 crossover PyQt8Q lz
板边插头 edge-board contact vN#?>aL
增强板 stiffener ML wh&I9)
基底 substrate K|JpkEw
基板面 real estate ]@E_Hx{S
导线面 conductor side 8R?X$=$]!.
元件面 component side )e&U'Fx
焊接面 solder side &V/n!|q<H
导电图形 conductive pattern v2=Iqo
非导电图形 non-conductive pattern =rSJ6'2("
基材 base material \Ps}1)w T
层压板 laminate 32h}+fd
覆金属箔基材 metal-clad bade material *IBT!@*Q&
覆铜箔层压板 copper-clad laminate (CCL) 5cj]Y)I-~
复合层压板 composite laminate @BQJKPF*
薄层压板 thin laminate Mtt t ] ]
基体材料 basis material ` pr$l
预浸材料 prepreg 0u[Vd:()v(
粘结片 bonding sheet MLD1%* &0
预浸粘结片 preimpregnated bonding sheer wUb5[m
环氧玻璃基板 epoxy glass substrate UuXq+HYR
预制内层覆箔板 mass lamination panel 2to~=/.
内层芯板 core material r{NCI
粘结层 bonding layer ^`M,ju
粘结膜 film adhesive \"=4)Huv
无支撑胶粘剂膜 unsupported adhesive film BK>3rjXi>a
覆盖层 cover layer (cover lay) Z;M}.'BE
增强板材 stiffener material TCShS}q;%
铜箔面 copper-clad surface WcRTv"4&
去铜箔面 foil removal surface Nr~9] S
层压板面 unclad laminate surface akR+QZ,)
基膜面 base film surface r?cDy QE
胶粘剂面 adhesive faec KX8$j$yW
原始光洁面 plate finish =VA5!-6<Uq
粗面 matt finish pO]{Y?X:
剪切板 cut to size panel iczJXA+
超薄型层压板 ultra thin laminate i' XW)n
A阶树脂 A-stage resin /%qw-v9qPV
B阶树脂 B-stage resin Xn:5pd;?B6
C阶树脂 C-stage resin [l~Gwaul>
环氧树脂 epoxy resin !9 7U2L4
酚醛树脂 phenolic resin |#OMrP+o i
聚酯树脂 polyester resin X8(H#Ef[
聚酰亚胺树脂 polyimide resin 9gWR djK:
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin vP k\b 3E
丙烯酸树脂 acrylic resin YoC{ t&rY
三聚氰胺甲醛树脂 melamine formaldehyde resin h\qQ% |X
多官能环氧树脂 polyfunctional epoxy resin 6f=, $:S$
溴化环氧树脂 brominated epoxy resin *=yUs'brB
环氧酚醛 epoxy novolac C1V: _-
氟树脂 fluroresin ,[gu7z^|
硅树脂 silicone resin }u ZtAH|
硅烷 silane ;Gf,I1d}{
聚合物 polymer o<1a]M|
无定形聚合物 amorphous polymer {TmrWFo
结晶现象 crystalline polamer U2hPsF4f
双晶现象 dimorphism 4?eO1=a
共聚物 copolymer 0cGO*G2Xr
合成树脂 synthetic tccw0
热固性树脂 thermosetting resin [Page] W#|30RU.G
热塑性树脂 thermoplastic resin [nSlkl
感光性树脂 photosensitive resin .$ o0$`}
环氧值 epoxy value .8.4!6~@
双氰胺 dicyandiamide 5Q/&,NP
粘结剂 binder 30BFwNE
胶粘剂 adesive GbFtX\s+5j
固化剂 curing agent #\P\(+0K
阻燃剂 flame retardant j<*
遮光剂 opaquer hq[:U?!Tt
增塑剂 plasticizers @%FLT6MY
不饱和聚酯 unsatuiated polyester ,Wbr;
zb
聚酯薄膜 polyester {pWb*~!k
聚酰亚胺薄膜 polyimide film (PI) 0\B31=N(
聚四氟乙烯 polytetrafluoetylene (PTFE) g$^:2MT"aQ
增强材料 reinforcing material ~8oti 4
折痕 crease h)NZG6R
云织 waviness _ ^2\/@
鱼眼 fish eye {fd/:B 7T
毛圈长 feather length P0mY/b BU
厚薄段 mark J2_~iC&;s
裂缝 split rd
)_*{
捻度 twist of yarn d O})#50f
浸润剂含量 size content W5)R{w0`GD
浸润剂残留量 size residue Bd++G'F Z
处理剂含量 finish level " e-RV
偶联剂 couplint agent `d ,v
断裂长 breaking length $ [t7&e
吸水高度 height of capillary rise
Wx8oTN
湿强度保留率 wet strength retention 4uX|2nJ2!;
白度 whitenness B2kKEMdGg
导电箔 conductive foil w'r?)WW$
铜箔 copper foil R(^ 2+mV?
压延铜箔 rolled copper foil HL`=zB%
光面 shiny side H{d;, KfX
粗糙面 matte side Hxr)`i46
处理面 treated side )%zOq:{\5
防锈处理 stain proofing 7u =R 5
双面处理铜箔 double treated foil |T; ]%<O3E
模拟 simulation 15l{gbCW
逻辑模拟 logic simulation X]1Q# $b
电路模拟 circit simulation RV_(T+
时序模拟 timing simulation r3}Q1b&
模块化 modularization \@8.BCWK
设计原点 design origin hI#1Ybl
优化（设计） optimization (design) rlpbLO G`
供设计优化坐标轴 predominant axis <Pnz$nH:e
表格原点 table origin {CaTu5\
元件安置 component positioning SD bR( oV
比例因子 scaling factor [ Yyb)Qf
扫描填充 scan filling T?4I\SG
矩形填充 rectangle filling C$x
r)_
填充域 region filling AE@N:a
实体设计 physical design _!ITCkBj
逻辑设计 logic design lP;X=X>
逻辑电路 logic circuit B )`@E4i
层次设计 hierarchical design [-p?gyl
自顶向下设计 top-down design >D5WAQ>b
自底向上设计 bottom-up design '
X9D( ?O
费用矩阵 cost metrix L60Sc
元件密度 component density xm*6I
自由度 degrees freedom GF/!@N
出度 out going degree - % 'ys
入度 incoming degree #wS/QrRE
曼哈顿距离 manhatton distance g;eoH
欧几里德距离 euclidean distance R^f-j-$o]
网络 network oD8X]R,
H
阵列 array GE!fh1[[u
段 segment it)!-[:bm
逻辑 logic LD gGVl
逻辑设计自动化 logic design automation >g+e`!;6
分线 separated time mzbMX
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分层 separated layer r YfN
定顺序 definite sequence $v\o14 v
导线（通道） conduction (track) 8`Iz%rw&(J
导线（体）宽度 conductor width sMDHg
导线距离 conductor spacing *1b1phh0/
导线层 conductor layer 40m>~I^q}
导线宽度/间距 conductor line/space \(4kEB2s$
第一导线层 conductor layer No.1 G9AQIU%ii
圆形盘 round pad mGC! 7^_D`
方形盘 square pad 1$RU hxT
菱形盘 diamond pad *t_JR
长方形焊盘 oblong pad +6;1.5Tc
子弹形盘 bullet pad yk 0#byW`
泪滴盘 teardrop pad C#oH7 o+_.
雪人盘 snowman pad \2OjIEQQ
形盘 V-shaped pad V ,xOO R
环形盘 annular pad P^-daRb
非圆形盘 non-circular pad di|5 |bn7
隔离盘 isolation pad Y q (CD!
非功能连接盘 monfunctional pad /DE`>eJY
偏置连接盘 offset land "8*5!anu-
腹（背）裸盘 back-bard land E%e2$Kf D
盘址 anchoring spaur 9~|hG o
连接盘图形 land pattern z cCGR Ee=
连接盘网格阵列 land grid array ( SiwO.TZ
孔环 annular ring $/|2d4O:{
元件孔 component hole *U:0c
;h
安装孔 mounting hole S&z8-D=8k
支撑孔 supported hole TYu(;~
非支撑孔 unsupported hole SadffAvSA{
导通孔 via .?dYY;P
镀通孔 plated through hole (PTH) Kq&JvY^
余隙孔 access hole %"=qdBuk
盲孔 blind via (hole) <d]
t{M62W
埋孔 buried via hole w#w?Y!JXo
埋,盲孔 buried blind via =&x
u"V
任意层内部导通孔 any layer inner via hole ZB'ms[
全部钻孔 all drilled hole D&/~lhyNZ
定位孔 toaling hole <wj}y0(
无连接盘孔 landless hole wdLl Q D
中间孔 interstitial hole a<Ksas'5S
无连接盘导通孔 landless via hole F&)(G\
引导孔 pilot hole 8i Xt8XY3
端接全隙孔 terminal clearomee hole 0oNy
准尺寸孔 dimensioned hole [Page] @3WI7q4
在连接盘中导通孔 via-in-pad DEN (pA\
孔位 hole location g?> V4WF
孔密度 hole density "H 3DmsB
孔图 hole pattern t(r}jU=qw
钻孔图 drill drawing p#+Da\qmx
装配图assembly drawing _2wH4 ^Vb
参考基准 datum referan
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1） 元件设备 XFJz\'{
D\ kd6
三绕组变压器：three-column transformer ThrClnTrans /~}<[6ZGCY
双绕组变压器：double-column transformer DblClmnTrans du_TiI
电容器：Capacitor *jrQ-'<T
并联电容器：shunt capacitor 5 4>gr1B
电抗器：Reactor OiJz?G:m
母线：Busbar ]~t4E'y)z
输电线：TransmissionLine ]Z=O+7 (r
发电厂：power plant p8|u 0/;k
断路器：Breaker ]>H'CM4JR
刀闸(隔离开关)：Isolator K>S:Z
分接头：tap XyrQJ}WR|
电动机：motor /A"UV\H`f
（2） 状态参数 k:* (..!0z
s%Ir h;Bs
有功：active power Uk<2XGj
无功：reactive power lm\~_ 4l1
电流：current \
ix& U
容量：capacity ^7,` 6g
电压：voltage #@8JYzMq%
档位：tap position jPA^SxM
有功损耗：reactive loss Ers8J V
无功损耗：active loss uraT$Q}
功率因数：power-factor o@ W:PmKW
功率：power Hq oCl
功角：power-angle CI+ @G XY
电压等级：voltage grade ]mdO3P
空载损耗：no-load loss z=pGu_`2
铁损：iron loss (^mp b
铜损：copper loss 2YhtD A
空载电流：no-load current ,; k`N` #'
阻抗：impedance >A
?{cbJ
正序阻抗：positive sequence impedance 1`v$R0 `!
负序阻抗：negative sequence impedance 8XhGo2zf
零序阻抗：zero sequence impedance (hn;C>B
电阻：resistor - EIfuh
电抗：reactance 8}>s{u;W
电导：conductance &)GlLpaT
电纳：susceptance EB2 5N~7
无功负载：reactive load 或者QLoad Fa-F`U@h(m
有功负载: active load PLoad d[$YTw
遥测：YC(telemetering) Z<W`5sop^
遥信：YX {1m.d;(1
励磁电流(转子电流)：magnetizing current 'RzzLk|$
定子：stator W'}^m*F
功角：power-angle ;|AyP
上限:upper limit hYY-Eq4TC
下限：lower limit <= Aqi9 1
并列的：apposable I_3{i`g
高压: high voltage 1rGi"kdf
低压：low voltage At)\$GJ
中压：middle voltage 6y
电力系统 power system cC7&]2X +f
发电机 generator ZDTp/5=?K/
励磁 excitation `VD7VX,rp*
励磁器 excitor *28:|blbL
电压 voltage |jJ9dTD8/
电流 current JxLSQ-"
母线 bus H:!pFj
变压器 transformer >v1ajI>O&{
升压变压器 step-up transformer B(qwTz 51
高压侧 high side &.)ST0b4
输电系统 power transmission system 9KDm<Q-mf
输电线 transmission line 8s)(e9Sr
固定串联电容补偿fixed series capacitor compensation 9f_Q s4
稳定 stability R(W}..U0R"
电压稳定 voltage stability ,<O| Iis
功角稳定 angle stability 7]lUPLsl
暂态稳定 transient stability f&88 N<)
电厂 power plant ],xvhfZ"dn
能量输送 power transfer -Ta|
qQa
交流 AC |eEXCn3{
装机容量 installed capacity Ah Rvyj
电网 power system Pe)SugCs
落点 drop point jzAXC^FS
开关站 switch station DA9f\q
双回同杆并架 double-circuit lines on the same tower L]#b = Y
变电站 transformer substation >o|.0aw<
补偿度 degree of compensation JHCXUT-r{
高抗 high voltage shunt reactor 9
gWqs'
无功补偿 reactive power compensation `i{p6-U3
故障 fault pfF2!`7pI
调节 regulation $[{YE[a
裕度 magin iNv"!'|
三相故障 three phase fault f/UIpswrZ'
故障切除时间 fault clearing time I/Q~rVt
极限切除时间 critical clearing time ^+rI=c 0
切机 generator triping N%fDgK
高顶值 high limited value I,@
6w
强行励磁 reinforced excitation ]y ~"M
线路补偿器 LDC(line drop compensation) EN;4EC7tE
机端 generator terminal 7 p[NuU*Gg
静态 static (state) pz,iQUs _o
动态 dynamic (state) c%5Suu( J6
单机无穷大系统 one machine - infinity bus system ]Pf!wv
机端电压控制 AVR )kvrQ6
电抗 reactance ,FWsgqL{l
电阻 resistance ;>r
E+k%_
功角 power angle E?cf#;2h8m
有功（功率） active power 'QQa :3<x
无功（功率） reactive power J{e`P; ND
功率因数 power factor ^C70b)68
无功电流 reactive current =H/ 5
下降特性 droop characteristics
%eW2w@8]
斜率 slope iPdR;O'
额定 rating mG.H=iw
变比 ratio bD<hzOa
参考值 reference value h4N&Yb fo
电压互感器 PT /A1qTG=Br
分接头 tap
,)Z1&J?
下降率 droop rate z4wG]]Kh*
仿真分析 simulation analysis X{tfF!+iy
传递函数 transfer function cg_j.=M-
框图 block diagram $<F9 ;Z
受端 receive-side &R t^G
裕度 margin (gjCm0#_%
同步 synchronization LjPpn jU
失去同步 loss of synchronization w<O t0& &
阻尼 damping rH9[x8e
摇摆 swing k]~|!`
保护断路器 circuit breaker g4}K6)@
电阻：resistance 5;X3{$y
电抗：reactance OEhDRU%k
阻抗：impedance )Ag{S[yZ
电导：conductance 8RjFp2) W
电纳：susceptance
