1 backplane 背板 C1qlB8(Wh>
2 Band gap voltage reference 带隙电压参考 yigq#h^
3 benchtop supply 工作台电源 &" 5Yt&{
4 Block Diagram 方块图 5 Bode Plot 波特图 ~]9EhC'l
6 Bootstrap 自举 t!u>l
7 Bottom FET Bottom FET cxFyN;7
8 bucket capcitor 桶形电容 ccx0aC3@I
9 chassis 机架 S\GxLW@x
10 Combi-sense Combi-sense ;#8xRLW
11 constant current source 恒流源 -a"b:Q
12 Core Sataration 铁芯饱和 :~ 	
13 crossover frequency 交叉频率 h2= wC.
14 current ripple 纹波电流 R((KAl]dL
15 Cycle by Cycle 逐周期 7osHKO<?2
16 cycle skipping 周期跳步 :QHh;TIG=<
17 Dead Time 死区时间 1=z\,~b
18 DIE Temperature 核心温度 ux17q>G
19 Disable 非使能,无效,禁用,关断 ?(}~[
20 dominant pole 主极点 i[z#5;x+<
21 Enable 使能,有效,启用 Bt1v7M
22 ESD Rating ESD额定值 /^gu&xnS
23 Evaluation Board 评估板 <K>qK]|C
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. A6E~GJa
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 0HQTe>!
25 Failling edge 下降沿 7h:EU7
26 figure of merit 品质因数 u@`y/,PX
27 float charge voltage 浮充电压 !kH 1|
28 flyback power stage 反驰式功率级 jfam/LL{V
29 forward voltage drop 前向压降 2E!Q5 l!j
30 free-running 自由运行 KFaYn
31 Freewheel diode 续流二极管 Hq?dqg' %~
32 Full load 满负载 33 gate drive 栅极驱动 H:WuMw D4
34 gate drive stage 栅极驱动级 Id>I.e4
35 gerber plot Gerber 图 *D`$oK,U
36 ground plane 接地层 ; 3sjTqD
37 Henry 电感单位:亨利 )t:8;;W@Ir
38 Human Body Model 人体模式 w6-<HPW<S
39 Hysteresis 滞回 [9F
40 inrush current 涌入电流 WD*z..`
41 Inverting 反相 WA*1_
42 jittery 抖动 (B?ZUXM,
43 Junction 结点 *<h )q)HS
44 Kelvin connection 开尔文连接 afu!.}4Ct
45 Lead Frame 引脚框架 X+N8r^&
46 Lead Free 无铅 'e$8
IZm
47 level-shift 电平移动 m}>Q#IVZ
48 Line regulation 电源调整率 D^U?!S&4~
49 load regulation 负载调整率 u%=2g'+)_
50 Lot Number 批号 Qv]rj]%
51 Low Dropout 低压差 ?N@[R];
52 Miller 密勒 53 node 节点 K(P.i^k
54 Non-Inverting 非反相 am7~
55 novel 新颖的 Y'#uZA3KA
56 off state 关断状态 e nw*[D !
57 Operating supply voltage 电源工作电压 _NpxV'E
58 out drive stage 输出驱动级 Q]$pg 5O
59 Out of Phase 异相 ep*8*GmP
60 Part Number 产品型号 {M\n
61 pass transistor pass transistor Lzcea+*uw
62 P-channel MOSFET P沟道MOSFET \6aisK
63 Phase margin 相位裕度 _?eT[!oO8
64 Phase Node 开关节点 T`]P5Bk8r
65 portable electronics 便携式电子设备 r8[)C cv
66 power down 掉电 sk3AwG;A
67 Power Good 电源正常 $s 'n]]Wq
68 Power Groud 功率地 #3A|Z=,5
69 Power Save Mode 节电模式
\]dvwN3x
70 Power up 上电 M 5`hMfg
71 pull down 下拉 2lqy <o
72 pull up 上拉 PSyUC#;
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) QiJ
74 push pull converter 推挽转换器 #qK5i1<
75 ramp down 斜降 E Q:6R|L
76 ramp up 斜升 fX>y^s?y
77 redundant diode 冗余二极管 J=HN~B1
78 resistive divider 电阻分压器 %7?Z|'\
79 ringing 振 铃 -D%mVe)&+
80 ripple current 纹波电流 wyLyPJv
81 rising edge 上升沿 BKgCuz:y
82 sense resistor 检测电阻 ksUF(lYk
83 Sequenced Power Supplys 序列电源 t
>.=q:
84 shoot-through 直通,同时导通 >gz8,&
85 stray inductances. 杂散电感 r@
!
86 sub-circuit 子电路 0]^gT'
87 substrate 基板 J@#rOOu
88 Telecom 电信 gP |>gy#e
89 Thermal Information 热性能信息 ${gO=Z
90 thermal slug 散热片 x@[6u
91 Threshold 阈值 Qd>\{$N
92 timing resistor 振荡电阻 $I4Wl:(~}
93 Top FET Top FET 9n"MNedqH
94 Trace 线路,走线,引线 =1<v1s|)q
95 Transfer function 传递函数 5du xW>D
96 Trip Point 跳变点 tk>J
mcTw
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) wz BI<0]z
98 Under Voltage Lock Out (UVLO) 欠压锁定 )t CNp
99 Voltage Reference 电压参考 P4+PY 8
100 voltage-second product 伏秒积 MIh\z7gW
101 zero-pole frequency compensation 零极点频率补偿 !/=.~B
102 beat frequency 拍频 ff~1>=^
103 one shots 单击电路 "b%FkD
104 scaling 缩放 QZ*gR#K]Sz
105 ESR 等效串联电阻 [Page] !0F+qzGG7
106 Ground 地电位 p+dOw#
107 trimmed bandgap 平衡带隙 0Q)YZ2
108 dropout voltage 压差 _KkP{g,Y
109 large bulk capacitance 大容量电容 2.MY8}&WBu
110 circuit breaker 断路器 i6g=fx6j*
111 charge pump 电荷泵 +oL@pp0
112 overshoot 过冲 %E"Z &_3{
yT~x7,
印制电路printed circuit :\y' ?d- Q
印制线路 printed wiring 1+YqdDqQ
印制板 printed board 0sTR`Xk
印制板电路 printed circuit board 2(m#WK7>F
印制线路板 printed wiring board aPQxpK?
印制元件 printed component 14 (sp
印制接点 printed contact fPPmUM^C9
印制板装配 printed board assembly $g/h=w@
板 board sV\K[4HG
刚性印制板 rigid printed board |68k9rq
挠性印制电路 flexible printed circuit <XN=v!2;
挠性印制线路 flexible printed wiring FYK`.>L28
齐平印制板 flush printed board s[t<2)i
金属芯印制板 metal core printed board FZLx.3k4
金属基印制板 metal base printed board UM<s#t`\3
多重布线印制板 mulit-wiring printed board TQ5kM
塑电路板 molded circuit board Qkhor-f0
散线印制板 discrete wiring board MH9vg5QKp
微线印制板 micro wire board ,Q0H)//~
积层印制板 buile-up printed board d`=LZio
表面层合电路板 surface laminar circuit j-.Y!$a%6
埋入凸块连印制板 B2it printed board `!AI:c*3p1
载芯片板 chip on board -Tn%O|#K
埋电阻板 buried resistance board
NRgVNE
母板 mother board *ZxurbX#
子板 daughter board jL'`M%8O
背板 backplane Ps{vN
~}
裸板 bare board -4P `:bF
键盘板夹心板 copper-invar-copper board }W&9} 9p"
动态挠性板 dynamic flex board +C[g>c}d
静态挠性板 static flex board 9%1J..c
可断拼板 break-away planel k%Vprc
电缆 cable _l"nwEs
挠性扁平电缆 flexible flat cable (FFC) 3!vzkBr
薄膜开关 membrane switch U4<c![Pp.
混合电路 hybrid circuit ~"NuYM#@
厚膜 thick film K[LuvS
厚膜电路 thick film circuit h9#)Eo
薄膜 thin film x0:BxRx*
薄膜混合电路 thin film hybrid circuit 8ZLHN',
互连 interconnection ${eV3LSC
导线 conductor trace line !a-B=pn!]
齐平导线 flush conductor @BF1X.4-+
传输线 transmission line Z#bO}!
跨交 crossover qmt9J?$k
板边插头 edge-board contact VpSpj/\m)'
增强板 stiffener }a.j~>rq
基底 substrate .Y"F3
R
基板面 real estate P^48]Kj7
导线面 conductor side akU2ToP
元件面 component side XM,slQ
焊接面 solder side cD}]4
导电图形 conductive pattern ,&qC
R
sw
非导电图形 non-conductive pattern &i.sSqSI5
基材 base material !8|}-eFY
层压板 laminate Q2uV/M1?
覆金属箔基材 metal-clad bade material RtzSe$O
覆铜箔层压板 copper-clad laminate (CCL) 2E[7RBFY+\
复合层压板 composite laminate >]z^.U7=
薄层压板 thin laminate A`ajsZ{q,
基体材料 basis material u+KZ. n/
预浸材料 prepreg ~x#TfeU]
粘结片 bonding sheet (Bd'Pj]:
预浸粘结片 preimpregnated bonding sheer "Y=`w,~~
环氧玻璃基板 epoxy glass substrate q$mc{F($D
预制内层覆箔板 mass lamination panel 4=MjyH|[Jx
内层芯板 core material lg~7[=%k#
粘结层 bonding layer sA77*T
粘结膜 film adhesive ~~ rR< re
无支撑胶粘剂膜 unsupported adhesive film \6JOBR
覆盖层 cover layer (cover lay) ?1a9k@[t
增强板材 stiffener material ,^97Ks
;
铜箔面 copper-clad surface XW" 0:}`J
去铜箔面 foil removal surface T9H*]LxK
层压板面 unclad laminate surface dK4rrO
基膜面 base film surface >MYDwH
胶粘剂面 adhesive faec F!wz{i6\h
原始光洁面 plate finish E3]WRF;l
粗面 matt finish Mjy:k|aY"
剪切板 cut to size panel mpMAhm:
超薄型层压板 ultra thin laminate @qq"X'3t
A阶树脂 A-stage resin ~~Ezt*lH
B阶树脂 B-stage resin ow.!4kx{ d
C阶树脂 C-stage resin ?!6Itkg
环氧树脂 epoxy resin W%-XN
酚醛树脂 phenolic resin '.(Gg%*\.
聚酯树脂 polyester resin pX?3inQP%(
聚酰亚胺树脂 polyimide resin Es%f@$0uy
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin JHt
U"
丙烯酸树脂 acrylic resin x9 %=d
三聚氰胺甲醛树脂 melamine formaldehyde resin %BP>,E/w
多官能环氧树脂 polyfunctional epoxy resin pUb1#=
溴化环氧树脂 brominated epoxy resin Y}N\|*ye-
环氧酚醛 epoxy novolac ~<m^
氟树脂 fluroresin 0!_?\)X
硅树脂 silicone resin !}#> ky!t
硅烷 silane f7lj,GAZ
聚合物 polymer _>Raw
无定形聚合物 amorphous polymer ExS5RV@v'
结晶现象 crystalline polamer MK=oGzK
双晶现象 dimorphism .qO4ceW2-~
共聚物 copolymer cR/Nl pX
合成树脂 synthetic V0>X2&.A
热固性树脂 thermosetting resin [Page] d?2ORr|m=
热塑性树脂 thermoplastic resin o8 JOpD
感光性树脂 photosensitive resin Nc7"`!;-
环氧值 epoxy value pg4W?N`
双氰胺 dicyandiamide dm4Q'u
粘结剂 binder <gkE,e9
胶粘剂 adesive m-vn5OX
固化剂 curing agent ~v.mbh
阻燃剂 flame retardant G`Nw]_
Z_
遮光剂 opaquer 0\P5=hD)K
增塑剂 plasticizers _SAM8!q4,
不饱和聚酯 unsatuiated polyester j|k/&q[St
聚酯薄膜 polyester h*k V@Dc
聚酰亚胺薄膜 polyimide film (PI) I)Xf4FS@
聚四氟乙烯 polytetrafluoetylene (PTFE) /\w4k
增强材料 reinforcing material +[!S[KE
折痕 crease e0zP LU}
云织 waviness lFjz*g2'
鱼眼 fish eye r ;RYGLx
毛圈长 feather length i/x |c!E
厚薄段 mark i6'=]f'{
裂缝 split <l{oE?N
捻度 twist of yarn -e/}DGL
浸润剂含量 size content a)QT#.
浸润剂残留量 size residue d_yvG.#C
处理剂含量 finish level H5}61 JC/z
偶联剂 couplint agent 3%kUj
断裂长 breaking length Lq2Q:w'
吸水高度 height of capillary rise M:/NW-:
湿强度保留率 wet strength retention hCcI]#S&
白度 whitenness gjDNl/r/
导电箔 conductive foil .SD-6GVD
铜箔 copper foil >GGM76vB=,
压延铜箔 rolled copper foil A@}5'LzL
光面 shiny side
'"B
粗糙面 matte side $oBs%.Jp
处理面 treated side yE8D^M|g
防锈处理 stain proofing vB8$Qx\J
双面处理铜箔 double treated foil &n6{wtBP
模拟 simulation D&%8JL
逻辑模拟 logic simulation 9zwD%3Ufn
电路模拟 circit simulation NfV|c~?d
时序模拟 timing simulation }?s-$@$R
模块化 modularization I%YwG3uR
设计原点 design origin qVC+q8
优化(设计) optimization (design) \f9WpAY
供设计优化坐标轴 predominant axis FS1\`#Bm)
表格原点 table origin r%U6,7d=)
元件安置 component positioning 7;EDU
比例因子 scaling factor Nk7y2[
扫描填充 scan filling u#76w74
矩形填充 rectangle filling W%L'nR~w$
填充域 region filling hIe .Mv-I)
实体设计 physical design fDy*dp4z
逻辑设计 logic design "ko*-FrQ
逻辑电路 logic circuit z%8`F%2
层次设计 hierarchical design sFpg
自顶向下设计 top-down design 9\Jc7[b
自底向上设计 bottom-up design FRQ.ix2
费用矩阵 cost metrix @xWWN
元件密度 component density YSP\+ZZ
自由度 degrees freedom 6$urrSQ`N0
出度 out going degree A9xeOy8e
入度 incoming degree Tb i?AJa}
曼哈顿距离 manhatton distance wN[lC|1c
欧几里德距离 euclidean distance `UsJaoR#f
网络 network EF)BezG5y
阵列 array w+)${|N?
段 segment Jt8;ddz
逻辑 logic wA5Iz{uQO
逻辑设计自动化 logic design automation fd'kv
分线 separated time w"'
Pn`T
分层 separated layer 50_[hC&C)
定顺序 definite sequence cGlN*GJ*H
导线(通道) conduction (track) a|t~&\@
导线(体)宽度 conductor width Y_%:%J
导线距离 conductor spacing L`nW&;w'
导线层 conductor layer !n-Sh<8
导线宽度/间距 conductor line/space Hu|Tj<S
第一导线层 conductor layer No.1 Lz 1.+:Ag
圆形盘 round pad +=($mcw#[
方形盘 square pad oMbd1uus
菱形盘 diamond pad @[r[l#4yUi
长方形焊盘 oblong pad IBa0O|*6
子弹形盘 bullet pad P]Fb0X
泪滴盘 teardrop pad |Hf|N$
雪人盘 snowman pad :!aLa}`@
形盘 V-shaped pad V 8jz>^.-o
环形盘 annular pad h@
lz
非圆形盘 non-circular pad "@G[:(BoB<
隔离盘 isolation pad Ch"wp/[
非功能连接盘 monfunctional pad u>
{aF{
偏置连接盘 offset land KU8,8:yY
腹(背)裸盘 back-bard land :rb;*nY!
盘址 anchoring spaur 9lq5\ tL-
连接盘图形 land pattern 1
uU$V
=
连接盘网格阵列 land grid array M(C">L]8
孔环 annular ring B:"D)/\
元件孔 component hole !>9s
安装孔 mounting hole sQgz}0_=)
支撑孔 supported hole _#{ *I(l
非支撑孔 unsupported hole (HRj0,/^
导通孔 via fG0ZVV!
镀通孔 plated through hole (PTH) i9ySD
余隙孔 access hole _^_3>}y5op
盲孔 blind via (hole) ](JrEg$K
埋孔 buried via hole ]
2
`%i5
埋,盲孔 buried blind via %"{P?V<-V
任意层内部导通孔 any layer inner via hole zmhc\M?z
全部钻孔 all drilled hole +?)7l
定位孔 toaling hole -E}X`?WhD
无连接盘孔 landless hole B{/og*xd*1
中间孔 interstitial hole )c11_1;
无连接盘导通孔 landless via hole Zn9u&!T&
引导孔 pilot hole GQ1/pys
端接全隙孔 terminal clearomee hole b+~_/;Y9
准尺寸孔 dimensioned hole [Page] T<*)Cdid
在连接盘中导通孔 via-in-pad h3`}{
w
孔位 hole location kP`#zwp'Ci
孔密度 hole density *EuX7LEu_
孔图 hole pattern GFFwk4n1
钻孔图 drill drawing }# s{."
装配图assembly drawing 6w<rSU d'
参考基准 datum referan :)lS9<Y}
1) 元件设备 [63\2{_^v
EV( F!&
三绕组变压器:three-column transformer ThrClnTrans uX-^9t
双绕组变压器:double-column transformer DblClmnTrans a#]V|1*O
电容器:Capacitor ^iONC&r
并联电容器:shunt capacitor `t/j6e]
电抗器:Reactor &5y
母线:Busbar 1J[$f>%n]
输电线:TransmissionLine LAC&W;pJ"
发电厂:power plant Phi5;U!
断路器:Breaker ,yC..aI
刀闸(隔离开关):Isolator xn`)I>v
分接头:tap }-fHS;/
电动机:motor 3VLwY!2:
(2) 状态参数 T+L=GnYl
B .y}S
有功:active power L(|K{vH h]
无功:reactive power S
TWH2_`
电流:current pFH.beY
容量:capacity \a+Q5g
电压:voltage ,\i*vJ#f
档位:tap position {^1O
有功损耗:reactive loss #TNjQNg@O
无功损耗:active loss XYvj3+
功率因数:power-factor jSpj6:@B
功率:power y#a,d||N1
功角:power-angle kn}^oRT
电压等级:voltage grade &pY'
空载损耗:no-load loss (9`dLw5
铁损:iron loss Z}t;:yhR
铜损:copper loss c>$d!IKCL
空载电流:no-load current B& @ pZYl
阻抗:impedance :6o%x0l
正序阻抗:positive sequence impedance r[(;J0=
负序阻抗:negative sequence impedance A8tJ&O
rwY
零序阻抗:zero sequence impedance (nQm9 M(
电阻:resistor LF7 }gQs
^
电抗:reactance 2Vti|@JYp
电导:conductance 3:GwX4yW
电纳:susceptance XQ=% a5w
无功负载:reactive load 或者QLoad ^# #j
{h7
有功负载: active load PLoad =Xvm#/
遥测:YC(telemetering) E0I/]0
遥信:YX OH06{I>;
励磁电流(转子电流):magnetizing current x'0_lf</#
定子:stator F'|K>!H
功角:power-angle ho$}#o
上限:upper limit 9C)VW
下限:lower limit J&j5@
并列的:apposable IoLP*D
高压: high voltage Y-bTKSn
低压:low voltage Dh4Lffy
中压:middle voltage bVz<8b6h'-
电力系统 power system (W#CDw<ja
发电机 generator 4L,wBce;,t
励磁 excitation ftpPrtaP
励磁器 excitor 'yVe&5?
电压 voltage yf&_l^!
电流 current eGT&&Y
母线 bus 6:wk=#w
变压器 transformer Je|:\Qk
升压变压器 step-up transformer kcUn GiP
高压侧 high side 3ibQbk
输电系统 power transmission system E
G+/2o+W
输电线 transmission line G%k&|
固定串联电容补偿fixed series capacitor compensation [;Ih I
稳定 stability 5/Qu5/
电压稳定 voltage stability K6-)l
isf
功角稳定 angle stability tf6-DmMH
暂态稳定 transient stability `Njvk
电厂 power plant s<LnUF1b
能量输送 power transfer OK v2..8
交流 AC f/c&Ya(D~
装机容量 installed capacity -ysNo4#e&
电网 power system ,vLQx\m{
落点 drop point [R1|=kGU
开关站 switch station cz,CL/rno
双回同杆并架 double-circuit lines on the same tower hiibPc?I
变电站 transformer substation }j2;B 8j
补偿度 degree of compensation [>mH
高抗 high voltage shunt reactor )C"ixZ>2xQ
无功补偿 reactive power compensation j^#p#`m
故障 fault EVLL,x.~:z
调节 regulation eH7x>[lH.
裕度 magin vE,^K6q0`
三相故障 three phase fault 0^tY|(b3/M
故障切除时间 fault clearing time eCR^$z=c
极限切除时间 critical clearing time cY5;~lO
切机 generator triping Rd7U5MBEF
高顶值 high limited value ;Q,t65+Am
强行励磁 reinforced excitation b-/QZvg
线路补偿器 LDC(line drop compensation) h STcL:b
机端 generator terminal st* sv}
静态 static (state) 2]?=\_T
动态 dynamic (state) @:RoY vk$
单机无穷大系统 one machine - infinity bus system qE2VUEv5Y
机端电压控制 AVR \"$P :Uv
电抗 reactance 1OExa<Zq
电阻 resistance N@tKgx
功角 power angle [ KgO:},c
有功(功率) active power n%29WF6Zf
无功(功率) reactive power ?7V~>i8[
功率因数 power factor ;<m*ASM.3
无功电流 reactive current x#3*C|A
下降特性 droop characteristics #<==7X#
斜率 slope -5
额定 rating /0qbRk i
变比 ratio FS=yc.Q_
参考值 reference value T0dD:s N
电压互感器 PT /d}"s.3p
分接头 tap RHBQgD$
下降率 droop rate $365VTh"
仿真分析 simulation analysis 8#JX#<HEo
传递函数 transfer function pl3ap(/
框图 block diagram #S9J9k
受端 receive-side JDR_k
裕度 margin q\?p' i
同步 synchronization wH!$TAZ:Yw
失去同步 loss of synchronization G\F>*
阻尼 damping OFtf)cGE
摇摆 swing 5b/ ~]v
保护断路器 circuit breaker =K0%bI
电阻:resistance iii|;v]+
电抗:reactance 4 @{?4k-cq
阻抗:impedance hsY?og_H
电导:conductance X uE: dL?
电纳:susceptance