1 backplane 背板 ?*oBevUnCY
2 Band gap voltage reference 带隙电压参考 hgYi ,e
3 benchtop supply 工作台电源 OC?a[^hB^)
4 Block Diagram 方块图 5 Bode Plot 波特图 +9^V9]{Vo
6 Bootstrap 自举 Z\lJE>1
7 Bottom FET Bottom FET _GhP{C$
8 bucket capcitor 桶形电容 ~Q+E" "
9 chassis 机架 0W_olnZ
10 Combi-sense Combi-sense X!aC6gujOH
11 constant current source 恒流源 :d AC:h
12 Core Sataration 铁芯饱和 F"-u8in`
13 crossover frequency 交叉频率 tPp9=e2[s
14 current ripple 纹波电流 5T*Uq>x0
15 Cycle by Cycle 逐周期 ftb .CPWI
16 cycle skipping 周期跳步 v}cTS@0
17 Dead Time 死区时间 ;JuBybJb
18 DIE Temperature 核心温度 D(;jv= "/
19 Disable 非使能,无效,禁用,关断 V=i/cI\
20 dominant pole 主极点 ;\'d9C
21 Enable 使能,有效,启用 k)3b0T@b
22 ESD Rating ESD额定值 9QXBz=Fnf
23 Evaluation Board 评估板 yG'
5:
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Exb?eHO
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。
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25 Failling edge 下降沿 ;s$,}O.
26 figure of merit 品质因数 /f*QxNZ,p
27 float charge voltage 浮充电压 }5Zmc6S{
28 flyback power stage 反驰式功率级 ts:YJAu+F
29 forward voltage drop 前向压降 qWdob>u
30 free-running 自由运行 gmqL,H#
31 Freewheel diode 续流二极管 !g.?+~@
32 Full load 满负载 33 gate drive 栅极驱动 B>;`$-
34 gate drive stage 栅极驱动级 EXF|;@-"
35 gerber plot Gerber 图 Z[ 53cVT^
36 ground plane 接地层 DqJzsk'd3
37 Henry 电感单位:亨利 6"oG
bte
38 Human Body Model 人体模式 On~w`
39 Hysteresis 滞回 F(;=^w
40 inrush current 涌入电流 kgb:<{pJ
41 Inverting 反相 T5_/*`F
42 jittery 抖动 20,}T)}Tm
43 Junction 结点 Op_(10|
44 Kelvin connection 开尔文连接 WvoJ^{\4N*
45 Lead Frame 引脚框架 !hugn6
46 Lead Free 无铅 H3xMoSs
47 level-shift 电平移动 3j6Am{9
48 Line regulation 电源调整率 $=9g,39
49 load regulation 负载调整率 Yn_v'Os2
50 Lot Number 批号 `C&@6{L
51 Low Dropout 低压差 ^Q#g-"b
52 Miller 密勒 53 node 节点 uPVO!`N3
54 Non-Inverting 非反相 X()yhe_
55 novel 新颖的 a 7>^^?|
56 off state 关断状态 9 gc0Ri[4m
57 Operating supply voltage 电源工作电压 3P *[!KI
58 out drive stage 输出驱动级 c }7gHud
59 Out of Phase 异相 wBlo2WY
60 Part Number 产品型号 rqWD#FB=z
61 pass transistor pass transistor gSk0#Jt
62 P-channel MOSFET P沟道MOSFET Kgw,]E&7
63 Phase margin 相位裕度 %BwvA_T'Q
64 Phase Node 开关节点 <{cf'"O7 )
65 portable electronics 便携式电子设备 M^&^g
66 power down 掉电 {O!B8a
67 Power Good 电源正常 W_L;^5Y;m
68 Power Groud 功率地 7o7*g 7
69 Power Save Mode 节电模式 u#+Is4Vh
70 Power up 上电 ,UNnz&H+f
71 pull down 下拉 zi_0*znw
72 pull up 上拉 a|-ozBFR
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) O%1uBc
74 push pull converter 推挽转换器 }vEMG-sxX
75 ramp down 斜降 u\3=m%1
76 ramp up 斜升 3z0%uY[e
77 redundant diode 冗余二极管 b?j\YX[e
78 resistive divider 电阻分压器 v=~+o[
79 ringing 振 铃 d$HPpi1LL
80 ripple current 纹波电流 QKI g5I-
81 rising edge 上升沿 @Yw>s9X
82 sense resistor 检测电阻 6Zx)L|B
83 Sequenced Power Supplys 序列电源 =<X4LO)C
84 shoot-through 直通,同时导通 zwJ\F '
85 stray inductances. 杂散电感 x3l~k Z(
86 sub-circuit 子电路 Y;{(?0
s
87 substrate 基板 tfdb9#&?
88 Telecom 电信 !}hG|Y6s
89 Thermal Information 热性能信息 ODxCD%L
90 thermal slug 散热片 @5h(bLEP
91 Threshold 阈值 ,0@QBr5P
92 timing resistor 振荡电阻 1b<[/g9
93 Top FET Top FET Q"QZ^!zRl
94 Trace 线路,走线,引线 :{ Lihe~\
95 Transfer function 传递函数 S|O#KE
96 Trip Point 跳变点 'F^1)Ga$
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) skF}_
98 Under Voltage Lock Out (UVLO) 欠压锁定 s]pNT1,
99 Voltage Reference 电压参考 [JEf P/n|.
100 voltage-second product 伏秒积 ?&D.b$
101 zero-pole frequency compensation 零极点频率补偿 u =lsH
102 beat frequency 拍频 ;)Sf|
103 one shots 单击电路 C$d b)5-
104 scaling 缩放 9vBW CCf
105 ESR 等效串联电阻 [Page] H`4KhdqR
106 Ground 地电位 };g<|v*o
107 trimmed bandgap 平衡带隙 _Mi*Fvj
108 dropout voltage 压差 qS?^(Vt|R
109 large bulk capacitance 大容量电容 A}[x))r
110 circuit breaker 断路器 $U"pdf
111 charge pump 电荷泵 8M,$|\U
112 overshoot 过冲 <=!FB8 .
K.Y.K$NjP{
印制电路printed circuit QsBC[7<jd-
印制线路 printed wiring Bo;{ QoB
印制板 printed board C6qGCzlG`
印制板电路 printed circuit board Lb~'
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印制线路板 printed wiring board 13A~."b
印制元件 printed component (gUVZeVFP
印制接点 printed contact |<JBoE]3B
印制板装配 printed board assembly a28`)17z
板 board ft$!u-`
刚性印制板 rigid printed board 63VgQ
挠性印制电路 flexible printed circuit I7+yu>
挠性印制线路 flexible printed wiring k{ulu
齐平印制板 flush printed board }"STc&1
金属芯印制板 metal core printed board W$J@|i
金属基印制板 metal base printed board eC@b-q
多重布线印制板 mulit-wiring printed board T2 TWb
塑电路板 molded circuit board TiKfIv
散线印制板 discrete wiring board 1-.(pA'
微线印制板 micro wire board jP.dQj^j&
积层印制板 buile-up printed board t')%;N
表面层合电路板 surface laminar circuit bUe6f,8,
埋入凸块连印制板 B2it printed board ^*F'[!. p
载芯片板 chip on board XdE|7=+s
埋电阻板 buried resistance board A3|X`X
母板 mother board ^@<Ia-x
子板 daughter board g6@^n$Y
背板 backplane (8(P12l
裸板 bare board
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键盘板夹心板 copper-invar-copper board .SDE6nvbW
动态挠性板 dynamic flex board &X,6v
静态挠性板 static flex board {d%hkbN+{
可断拼板 break-away planel @&GY5<&b
电缆 cable Fnuheb'&m
挠性扁平电缆 flexible flat cable (FFC) m,Mg
薄膜开关 membrane switch j07b!j:"\}
混合电路 hybrid circuit QG5c>Q
厚膜 thick film Y8/&1s_
厚膜电路 thick film circuit vofBS
薄膜 thin film - H`,`#{
薄膜混合电路 thin film hybrid circuit Ki(0s
互连 interconnection /}S1e P6
导线 conductor trace line wq]vcY9^
齐平导线 flush conductor ^2nH6,LPS
传输线 transmission line R#Z
m[S
跨交 crossover JykN EMB#
板边插头 edge-board contact %F(lq*8X
增强板 stiffener _xM3c&VeG
基底 substrate 8COGe=+o
基板面 real estate 5s<.qDc
导线面 conductor side {m"I-VF
元件面 component side 1~S''[
焊接面 solder side 1_>w|6;e
导电图形 conductive pattern 54Vb[;`Kkb
非导电图形 non-conductive pattern }ok'd=M
基材 base material "sed{?
层压板 laminate ODKS6E1{
覆金属箔基材 metal-clad bade material E0eZal],
覆铜箔层压板 copper-clad laminate (CCL) 1n#{c5T
复合层压板 composite laminate >[g.8'hI
薄层压板 thin laminate Y r8gKhv W
基体材料 basis material yS4nB04`=
预浸材料 prepreg _r`(P#Hy
粘结片 bonding sheet c#a>> V
预浸粘结片 preimpregnated bonding sheer 2,p= %
环氧玻璃基板 epoxy glass substrate |9mGX9q
预制内层覆箔板 mass lamination panel @1V?94T1
内层芯板 core material LG=_>:~t>
粘结层 bonding layer `rpmh7*WV
粘结膜 film adhesive *enT2Q
无支撑胶粘剂膜 unsupported adhesive film F ZN}T{<
覆盖层 cover layer (cover lay) B~%SB/eu
增强板材 stiffener material nr%P11U\c
铜箔面 copper-clad surface > (W\Eh{J
去铜箔面 foil removal surface y7LM}dH#m
层压板面 unclad laminate surface pZ 7KWk4
基膜面 base film surface P?zL`czWd
胶粘剂面 adhesive faec v&xhS
yZ
原始光洁面 plate finish l>pnY%(A
粗面 matt finish Rc}#4pM8
剪切板 cut to size panel %Z yt;p2
超薄型层压板 ultra thin laminate .19_EQ>+
A阶树脂 A-stage resin UM. Se(kS
B阶树脂 B-stage resin Pk:b:(4
C阶树脂 C-stage resin g8]$BhRIfr
环氧树脂 epoxy resin rR(\fX!dg
酚醛树脂 phenolic resin {mA#'75a#
聚酯树脂 polyester resin "SpsSQ
聚酰亚胺树脂 polyimide resin sX(rJLbD
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin `LJ.NY pP
丙烯酸树脂 acrylic resin oMKG M@V
三聚氰胺甲醛树脂 melamine formaldehyde resin ,DCrhk
多官能环氧树脂 polyfunctional epoxy resin F "-GhjK
溴化环氧树脂 brominated epoxy resin MYUL y2)
环氧酚醛 epoxy novolac `'ak/%Krh
氟树脂 fluroresin 7qg. :h
硅树脂 silicone resin $~T|v7Y%
硅烷 silane ORt)sn&~d
聚合物 polymer tA-p!#V<k1
无定形聚合物 amorphous polymer K?=g
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结晶现象 crystalline polamer -9(nsaV
双晶现象 dimorphism }5y]kn
共聚物 copolymer LHq*E`
合成树脂 synthetic >x${I`2w
热固性树脂 thermosetting resin [Page] )>!y7/3
热塑性树脂 thermoplastic resin s+a#x(7{
感光性树脂 photosensitive resin 2MDY nMy
环氧值 epoxy value e_llW(*l8^
双氰胺 dicyandiamide 2XV3f$, H
粘结剂 binder KvlLcE~`o
胶粘剂 adesive HG)h,&nc-
固化剂 curing agent @Cl1G
阻燃剂 flame retardant qhNYQ/uS
遮光剂 opaquer nk+9J#Gs
增塑剂 plasticizers - S%8
不饱和聚酯 unsatuiated polyester =2d h}8Mz
聚酯薄膜 polyester _%<qZT
聚酰亚胺薄膜 polyimide film (PI) /?:q9Wy
聚四氟乙烯 polytetrafluoetylene (PTFE) y&2O)z!B
增强材料 reinforcing material xOc&n0}%
折痕 crease gm}zF%B"
云织 waviness z_87;y;=
鱼眼 fish eye ksQw|>K
毛圈长 feather length XI5q>cd\Sz
厚薄段 mark yu=(m~KX
裂缝 split I(+%`{Wv
捻度 twist of yarn Ml+O -
3T
浸润剂含量 size content bYy7Ul6]
浸润剂残留量 size residue Pol
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处理剂含量 finish level h5@JS1cY
偶联剂 couplint agent &MGM9
zm-]
断裂长 breaking length 9w$+Qc
吸水高度 height of capillary rise j6BFh=?D
湿强度保留率 wet strength retention jn>RE
白度 whitenness rq^VOK|L
导电箔 conductive foil Q}]RB$ZS
铜箔 copper foil ]]|vQA^
压延铜箔 rolled copper foil {(^%2dk83C
光面 shiny side ?yAjxoE~?
粗糙面 matte side <*DP G\6Ma
处理面 treated side ~tqDh(
防锈处理 stain proofing $~:|Vj5iZ\
双面处理铜箔 double treated foil <O]B'Wc [
模拟 simulation Dqm;twd>
逻辑模拟 logic simulation VY "i>Ae
电路模拟 circit simulation P6;Cohfh
时序模拟 timing simulation m"mU:-jk`
模块化 modularization ]s~%1bd
设计原点 design origin Yx<wYzD
优化(设计) optimization (design) 2-gI@8NPI
供设计优化坐标轴 predominant axis IoWK 8x
表格原点 table origin PA>su)N$
元件安置 component positioning u$mp%d8
比例因子 scaling factor IJofbuzw:
扫描填充 scan filling G1/
矩形填充 rectangle filling ?a` $Y>?h
填充域 region filling n;*W#c
实体设计 physical design j'|`:^
Sy
逻辑设计 logic design \m1jV>q
逻辑电路 logic circuit ^I6GH?19>e
层次设计 hierarchical design Ozs&YZ
自顶向下设计 top-down design Iih]q
自底向上设计 bottom-up design bd3q207>
费用矩阵 cost metrix K_LwYO3
元件密度 component density Q#*Pjl
自由度 degrees freedom /SQ1i}%
出度 out going degree K"9V8x3Wg
入度 incoming degree 1TL~I-G&n
曼哈顿距离 manhatton distance <^wqN!/
欧几里德距离 euclidean distance +v"%@lC};
网络 network lcEin*Oc
阵列 array [Xo}CU
段 segment wM&WR2
逻辑 logic "SN+ ^`
逻辑设计自动化 logic design automation 1IV
R4:a
分线 separated time 6O'6,%#
分层 separated layer ,SSq4
定顺序 definite sequence $7bux1L
导线(通道) conduction (track) }A'Ro/n
导线(体)宽度 conductor width D``>1IA]
导线距离 conductor spacing o:Q.XWa@MG
导线层 conductor layer >X-*Hu'U#
导线宽度/间距 conductor line/space S*?x|&a
第一导线层 conductor layer No.1 =CjN=FM
圆形盘 round pad QLe<).S1B2
方形盘 square pad xzTF| Z\
菱形盘 diamond pad ?u_O(eg
长方形焊盘 oblong pad gPg2Ve0Qy
子弹形盘 bullet pad Z;nUS,?om
泪滴盘 teardrop pad +a((,wAN2
雪人盘 snowman pad b#E!wMClS
形盘 V-shaped pad V g\foBK:GE
环形盘 annular pad Yq0=4#_
非圆形盘 non-circular pad d3K-|
隔离盘 isolation pad X3,+aL`
非功能连接盘 monfunctional pad 7c.LyvM
偏置连接盘 offset land UIi`bbJ
腹(背)裸盘 back-bard land 6$6Qk !%
盘址 anchoring spaur 1#
X*kF
连接盘图形 land pattern
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连接盘网格阵列 land grid array (k&r^V/=
孔环 annular ring 4m3pF0k
元件孔 component hole 52d8EGC
安装孔 mounting hole mY !LGN
支撑孔 supported hole O\KSPy7YQ
非支撑孔 unsupported hole *;yn_zg
导通孔 via
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镀通孔 plated through hole (PTH) Qv>rww]
余隙孔 access hole Wg
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盲孔 blind via (hole) N_),'2
埋孔 buried via hole <{UjO
埋,盲孔 buried blind via W;@9x1jKX
任意层内部导通孔 any layer inner via hole u.Z,HsEO b
全部钻孔 all drilled hole wx%TQ!
定位孔 toaling hole p7kH"j{xD
无连接盘孔 landless hole l9X\\uG&
中间孔 interstitial hole nH% 1lD?:
无连接盘导通孔 landless via hole XT0:$0F
引导孔 pilot hole =FtJa3mHK
端接全隙孔 terminal clearomee hole q^k]e{PD
准尺寸孔 dimensioned hole [Page] ;5wr5H3
在连接盘中导通孔 via-in-pad OGqsQ
孔位 hole location ~^R?H S
孔密度 hole density ,,KGcDBj
孔图 hole pattern 0[T>UEI?
钻孔图 drill drawing jJDYl( [
装配图assembly drawing "~HV!(dRMC
参考基准 datum referan 8x9$6HO
1) 元件设备 KGoHn6jM
Zc9j_.?*
三绕组变压器:three-column transformer ThrClnTrans }./_fFN@
双绕组变压器:double-column transformer DblClmnTrans 81<0B@E
电容器:Capacitor czv )D\*
并联电容器:shunt capacitor b[_${in:
电抗器:Reactor )Mj
$/
母线:Busbar %">
Oy&3
输电线:TransmissionLine `DPR >dd@
发电厂:power plant }475c{
断路器:Breaker 0{
;[k
刀闸(隔离开关):Isolator p>@S61
&
[
分接头:tap b-XC\
电动机:motor WDdp(<
(2) 状态参数 _p`@/[(|
Lv{xwHnE
有功:active power ,$qqHSd1M
无功:reactive power j$8i!C
电流:current %g<J"/
容量:capacity L!]~J?)
电压:voltage 2!4.L&Ki
档位:tap position > \KVg(?D
有功损耗:reactive loss X;?Z_3I:5
无功损耗:active loss
j{;RuNt
功率因数:power-factor k v}<u
功率:power A|esVUo<3^
功角:power-angle ^QKL}xiV:
电压等级:voltage grade _2,eS[wP
空载损耗:no-load loss Q$(0Nx<
铁损:iron loss <15POB
铜损:copper loss C,!}WB@VME
空载电流:no-load current OJ'x>kE
阻抗:impedance h1 D#,
正序阻抗:positive sequence impedance #!FLX*,
负序阻抗:negative sequence impedance {&Bpf
K;`)
零序阻抗:zero sequence impedance O(( kv|X4
电阻:resistor joN}N }U
电抗:reactance VnJ-nfA
电导:conductance |= frsf~?
电纳:susceptance BI\+NGrB
无功负载:reactive load 或者QLoad ^3-Wxn9&
有功负载: active load PLoad PZdYkbj
遥测:YC(telemetering) N+vU@)_lC
遥信:YX 7Pc0|Z/
励磁电流(转子电流):magnetizing current ClH aR
定子:stator g1uqsqYt
功角:power-angle ] _/d
上限:upper limit B9Dh^9?L
下限:lower limit / h6(!-"
并列的:apposable |m%M$^sZ}
高压: high voltage #c0
dZ
低压:low voltage xmDX1sL**
中压:middle voltage ItTIU
电力系统 power system a9E!2o+,
发电机 generator )6?.; B
励磁 excitation m\lSBy6
励磁器 excitor RT45@
电压 voltage wjmZ`UMz
电流 current k:4?3zJI
母线 bus :{9|/a
变压器 transformer 3_atv'I
升压变压器 step-up transformer (/_Q
r2KfC
高压侧 high side f/b }X3K
输电系统 power transmission system F GOa!G
输电线 transmission line vII8>x%*
固定串联电容补偿fixed series capacitor compensation 0NSn5Hq
稳定 stability oPNYCE
电压稳定 voltage stability ~^.&nph
功角稳定 angle stability sQ^>.yG
暂态稳定 transient stability Ss u{Lj
电厂 power plant g[;iVX^1&
能量输送 power transfer ru`;cXa,
交流 AC 34C
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装机容量 installed capacity 5Ag>,>kJ6
电网 power system );h\0w>3
落点 drop point 1V`]sfRK
开关站 switch station <LW|m7
双回同杆并架 double-circuit lines on the same tower \i-jME(sN
变电站 transformer substation bIm$7a`T
补偿度 degree of compensation bE>3D#V<
高抗 high voltage shunt reactor L\og`L)5\
无功补偿 reactive power compensation yj$S?B Ee
故障 fault E|9LUPcb
调节 regulation w c%
裕度 magin Z"?AaD[
三相故障 three phase fault )
WIlj
故障切除时间 fault clearing time [6S"iNiyKT
极限切除时间 critical clearing time U30)r+&
切机 generator triping Kc udWW]
高顶值 high limited value gE=~.P[ZX
强行励磁 reinforced excitation [Pp#l*
线路补偿器 LDC(line drop compensation) _3p:q.
机端 generator terminal /^[)JbgB
静态 static (state) LO61J_J<
动态 dynamic (state) -e(2?Xq9
单机无穷大系统 one machine - infinity bus system CHpDzG>]4
机端电压控制 AVR \ b9,>
电抗 reactance &up/`8
电阻 resistance *Kzs(O
功角 power angle UxicqkX
有功(功率) active power 0]oQ08
无功(功率) reactive power 5,AQ~_,'\
功率因数 power factor )dL?B9d:
无功电流 reactive current jX&&@zMq
下降特性 droop characteristics Y0B*.H
Ae
斜率 slope g&0GO:F`
额定 rating 8)POEY4
变比 ratio N~>?w#?J
参考值 reference value T%a]3
电压互感器 PT b$R>GQ?#
分接头 tap deTbvl
下降率 droop rate 9_>4~!x`
仿真分析 simulation analysis 4}LF>_+=
传递函数 transfer function wCt+{Y3T
框图 block diagram qfYb\b
受端 receive-side Mqh~ 5NM
裕度 margin Ee|+uQ981>
同步 synchronization $g$`fR)
失去同步 loss of synchronization _TPo=}Z
阻尼 damping @$+[IiP
摇摆 swing J$I1*~I4v
保护断路器 circuit breaker omjLQp[%
电阻:resistance E7eVg*Cvi
电抗:reactance [d&Faa[`
阻抗:impedance Y!7P>?)`,X
电导:conductance (x^|
电纳:susceptance