1 backplane 背板 'yrU_k,h
2 Band gap voltage reference 带隙电压参考 4 nIs+
3 benchtop supply 工作台电源 OJ2O?Te8
4 Block Diagram 方块图 5 Bode Plot 波特图 Glt%%TJb
6 Bootstrap 自举 E`^?2dv+/
7 Bottom FET Bottom FET =K#12TRf
8 bucket capcitor 桶形电容 |l*#pN&L
9 chassis 机架 VaLx- RX
10 Combi-sense Combi-sense zmREzP#X
11 constant current source 恒流源 \|OW`7Q)k
12 Core Sataration 铁芯饱和 g91X*$`]
13 crossover frequency 交叉频率 ~-1!?t/%
14 current ripple 纹波电流 81(.{Y839_
15 Cycle by Cycle 逐周期 qQL]3qP
16 cycle skipping 周期跳步 d8Keyi8[
17 Dead Time 死区时间 5LPyPL L
18 DIE Temperature 核心温度 {95z\UE}
19 Disable 非使能,无效,禁用,关断 z /
YF7wrx
20 dominant pole 主极点 wZ^7#yX>
21 Enable 使能,有效,启用 Hl@)j
22 ESD Rating ESD额定值 n'dxa<F2|
23 Evaluation Board 评估板 /1h
0l;
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 0Q2P"1>KT/
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 R0 g-
25 Failling edge 下降沿 )$h<9e
26 figure of merit 品质因数 ;bC163[
27 float charge voltage 浮充电压 s'4S,
28 flyback power stage 反驰式功率级 6$d3Ap@Gl
29 forward voltage drop 前向压降 m'
LRP:9v
30 free-running 自由运行 LuLnmnmB
31 Freewheel diode 续流二极管 %*>ee[^L ,
32 Full load 满负载 33 gate drive 栅极驱动 `ViFY
34 gate drive stage 栅极驱动级 GMY"*J<E
35 gerber plot Gerber 图 q.
%[!O
36 ground plane 接地层 SBj9sFZ
37 Henry 电感单位:亨利 4h|48</
38 Human Body Model 人体模式 |_=o0lf
39 Hysteresis 滞回 DOr()X
40 inrush current 涌入电流 %:^|Q;xe
41 Inverting 反相 ;:w?&4
42 jittery 抖动 {"cS:u
43 Junction 结点 (c{<JYEC
44 Kelvin connection 开尔文连接 oZ)\Ya=
45 Lead Frame 引脚框架 !9$xfg}
46 Lead Free 无铅 /uTU*Oe
47 level-shift 电平移动 :3,aR\
48 Line regulation 电源调整率 Dm,*G`Js
49 load regulation 负载调整率 /Dn,;@ZwAi
50 Lot Number 批号 M]S&vE{D
51 Low Dropout 低压差 lP4A?J+Q
52 Miller 密勒 53 node 节点 8x`?Yc
54 Non-Inverting 非反相 RJ#xq#l
55 novel 新颖的 1:.0^?Gz
56 off state 关断状态 l.DC20bs
57 Operating supply voltage 电源工作电压 $oefG}h2
58 out drive stage 输出驱动级 \'rh7!v-u
59 Out of Phase 异相 IX!Q X
60 Part Number 产品型号 EF7Y 4lp
61 pass transistor pass transistor (6xrs_ea
62 P-channel MOSFET P沟道MOSFET U!GG8;4
63 Phase margin 相位裕度 ]F,mj-?4x
64 Phase Node 开关节点 JN{.-k4Ha
65 portable electronics 便携式电子设备 e i L
;
66 power down 掉电 /$'R!d5r
67 Power Good 电源正常 yQ33JQr
68 Power Groud 功率地 ``~7z;E%@
69 Power Save Mode 节电模式 BE54^U
70 Power up 上电 +Om(&\c(6
71 pull down 下拉 6K/j,e>L
72 pull up 上拉 H_RVGAbU
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ~^U(G As
74 push pull converter 推挽转换器 1-@[th
75 ramp down 斜降 :hre|$@{a
76 ramp up 斜升 X 8TwMt
77 redundant diode 冗余二极管 7XE |5G
78 resistive divider 电阻分压器 Iz'*^{Ssm
79 ringing 振 铃 82w='~y
80 ripple current 纹波电流 VEolyPcsg&
81 rising edge 上升沿 hpftVEB
82 sense resistor 检测电阻 N# Ru`;
83 Sequenced Power Supplys 序列电源 /65ddt
84 shoot-through 直通,同时导通 (T1)7%Xs
85 stray inductances. 杂散电感 b%w?YR
86 sub-circuit 子电路 [m>kOv6>^
87 substrate 基板 _z:7Dj#
88 Telecom 电信 d"
T">Og)
89 Thermal Information 热性能信息 jU1 ([(?"
90 thermal slug 散热片 ?GdoB7(%
91 Threshold 阈值 sN6R0YW
92 timing resistor 振荡电阻 j@jaFsX|
93 Top FET Top FET gr\UI!]F
94 Trace 线路,走线,引线 Fdgu=qMm
95 Transfer function 传递函数 icq!^5BzL
96 Trip Point 跳变点 _]SV@q^
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ;\P\0pI50
98 Under Voltage Lock Out (UVLO) 欠压锁定 C;#-2^h
99 Voltage Reference 电压参考 b?6-lYE>L
100 voltage-second product 伏秒积 I]HrtI
101 zero-pole frequency compensation 零极点频率补偿 t'msgC6=>u
102 beat frequency 拍频 OH2Xxr[bQ
103 one shots 单击电路 3$fzqFo
104 scaling 缩放 ?0%yDq1_
105 ESR 等效串联电阻 [Page] FLT4:B7
106 Ground 地电位 `|Aj3a3sND
107 trimmed bandgap 平衡带隙 jf_xm=n
108 dropout voltage 压差 uJ Q#l\t
109 large bulk capacitance 大容量电容 sW'SR
110 circuit breaker 断路器 -O.q$D=as
111 charge pump 电荷泵 idWYpU>gC
112 overshoot 过冲 {+CW_ce
Eiqx1ZM
印制电路printed circuit 5Jo><P a
印制线路 printed wiring Nj8 `<Sl
印制板 printed board 9ihB;m'C)
印制板电路 printed circuit board zZrUS'8
印制线路板 printed wiring board T%{qwZc+mJ
印制元件 printed component !j'9>G{T
印制接点 printed contact aS
]bTYJ'
印制板装配 printed board assembly !q:[$g-@q
板 board 8UH
c,np
刚性印制板 rigid printed board :#CQQ*@
挠性印制电路 flexible printed circuit xcBV,[E{
挠性印制线路 flexible printed wiring ,(h:0L2v7d
齐平印制板 flush printed board H7&>c M
金属芯印制板 metal core printed board 4bV&U=
金属基印制板 metal base printed board blbL49;
多重布线印制板 mulit-wiring printed board BCH{0w^D
塑电路板 molded circuit board u4
##*m
散线印制板 discrete wiring board YNEPu:5J
微线印制板 micro wire board +;Yd<~!c Z
积层印制板 buile-up printed board TvV_Tz4e
表面层合电路板 surface laminar circuit mB.ybrig
埋入凸块连印制板 B2it printed board u\LbPk
载芯片板 chip on board Mf7Z5
埋电阻板 buried resistance board T8nOb9Nrj
母板 mother board (XF"ckma
子板 daughter board ;+d2qbGd
背板 backplane mMp(
裸板 bare board 0)@7$Xhf
键盘板夹心板 copper-invar-copper board "eqN d"~
动态挠性板 dynamic flex board *>m,7} L
静态挠性板 static flex board ]yc&ffe%
可断拼板 break-away planel t0^chlJP$
电缆 cable jc%
挠性扁平电缆 flexible flat cable (FFC) u"WqI[IV
薄膜开关 membrane switch 9$]I3k
混合电路 hybrid circuit 0?x9.]
厚膜 thick film XTzz/.T;Z
厚膜电路 thick film circuit ??X3teO{
薄膜 thin film eouxNw}F1
薄膜混合电路 thin film hybrid circuit = JE4C9$,
互连 interconnection Z/Vb _
导线 conductor trace line Qn=#KS8=J
齐平导线 flush conductor ]Ut fI
传输线 transmission line 3&39M&
跨交 crossover %E1_)^^
板边插头 edge-board contact >bgx o<
增强板 stiffener Or {9?;G
基底 substrate h-0#h/u>M
基板面 real estate 0a1Vj56{)
导线面 conductor side S,Y\ox-
元件面 component side Qyh_o
焊接面 solder side l"T{!Oq
导电图形 conductive pattern EbG`q!C
非导电图形 non-conductive pattern 3Ryae/Nk
基材 base material ymNL`GYN[
层压板 laminate `E @TPdu
覆金属箔基材 metal-clad bade material V_1'` F
覆铜箔层压板 copper-clad laminate (CCL) fga{b7
复合层压板 composite laminate UKfC!YR2J8
薄层压板 thin laminate TGSUbBgU
基体材料 basis material /'yi!:FZFC
预浸材料 prepreg @<^_ _."
粘结片 bonding sheet at N%csA0
预浸粘结片 preimpregnated bonding sheer :6N'%LKK
环氧玻璃基板 epoxy glass substrate ^@"H(1Hxu/
预制内层覆箔板 mass lamination panel [xm{4Ba2X
内层芯板 core material GjHV|)^
粘结层 bonding layer \A~r~
粘结膜 film adhesive [,@gSb|D?
无支撑胶粘剂膜 unsupported adhesive film IJ#G/<ZJZ
覆盖层 cover layer (cover lay) m VSaC
增强板材 stiffener material In3},x+$
铜箔面 copper-clad surface Cp`>dtCd
去铜箔面 foil removal surface ?3=D-Xrb
层压板面 unclad laminate surface z_gjC%(y
基膜面 base film surface f:w#r.]
胶粘剂面 adhesive faec ,JLY
oE+
原始光洁面 plate finish =|Q7k +b
粗面 matt finish l.Psh7B2
剪切板 cut to size panel k+D32]b@
超薄型层压板 ultra thin laminate 49e~/YY
A阶树脂 A-stage resin dn? #}^,"
B阶树脂 B-stage resin G$P|F6
C阶树脂 C-stage resin sKIpL(_I$
环氧树脂 epoxy resin #z(JYw,
酚醛树脂 phenolic resin QH)uh"
聚酯树脂 polyester resin ptA-rX.
聚酰亚胺树脂 polyimide resin )bl''
yO
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin \G+uK:PC,
丙烯酸树脂 acrylic resin u'm[wjCjc
三聚氰胺甲醛树脂 melamine formaldehyde resin T+$Af,~
多官能环氧树脂 polyfunctional epoxy resin ^Z6N&s#6
溴化环氧树脂 brominated epoxy resin S4'\=w#
环氧酚醛 epoxy novolac <"&I'9
氟树脂 fluroresin c@uNA0
p
硅树脂 silicone resin /d1
B-I
硅烷 silane !BQ:R(w
聚合物 polymer sz7|2OV"
无定形聚合物 amorphous polymer
>k\lE(
结晶现象 crystalline polamer |=xK-;qs
双晶现象 dimorphism T#>1$0yv
共聚物 copolymer !)nA4l=S#
合成树脂 synthetic L,KK{o|Eq
热固性树脂 thermosetting resin [Page] %wc=Mf
热塑性树脂 thermoplastic resin
C0Oe$&
_
感光性树脂 photosensitive resin zG[GyyAQ
环氧值 epoxy value dHAI4Yf4U
双氰胺 dicyandiamide 4a]$4LQV
粘结剂 binder L#\!0YW/@
胶粘剂 adesive GD]yP..
固化剂 curing agent '`+GC9VG
阻燃剂 flame retardant ne~=^IRB
遮光剂 opaquer #RyX}t X,
增塑剂 plasticizers !_ng_,J
不饱和聚酯 unsatuiated polyester @Yl&Jg2l'
聚酯薄膜 polyester nw)yK%`;M
聚酰亚胺薄膜 polyimide film (PI) Vk#wJ-
聚四氟乙烯 polytetrafluoetylene (PTFE) K]<49`MX
增强材料 reinforcing material [q<Vm-
折痕 crease 7*a']W{aJ
云织 waviness )S,Rx
鱼眼 fish eye (|*CVI;
毛圈长 feather length ,rC$~
&
厚薄段 mark `<3/k
裂缝 split a$~pAy5C
捻度 twist of yarn b/yXE)3
X
浸润剂含量 size content C5W}
o:jE
浸润剂残留量 size residue )-RI
处理剂含量 finish level RTEzcJ>
偶联剂 couplint agent i8kyYMPP
断裂长 breaking length ?xb4y=P7
吸水高度 height of capillary rise Jxq;Uu9
湿强度保留率 wet strength retention 8ph*S&H
白度 whitenness hm&cRehU
导电箔 conductive foil ` !JcQ'u
铜箔 copper foil l1EI4Y9KG
压延铜箔 rolled copper foil K).Gj2 $
光面 shiny side V1 H3}
粗糙面 matte side qZcRK9l]F1
处理面 treated side @_+B'<2
防锈处理 stain proofing Q#Vg5H4
双面处理铜箔 double treated foil Q96"^Hd
模拟 simulation ^J[r<Dm8F
逻辑模拟 logic simulation v Mi&0$
电路模拟 circit simulation 8vuA`T!~G
时序模拟 timing simulation qi&;2Yv
模块化 modularization "SV#e4C.
设计原点 design origin ,f]GOH
优化(设计) optimization (design) qrK\f
供设计优化坐标轴 predominant axis q0>@!1Wb
表格原点 table origin 'H]&$AZ;@
元件安置 component positioning 9k`}fk\M
比例因子 scaling factor cGE,3dsF[
扫描填充 scan filling {Y(# <UDM
矩形填充 rectangle filling {tN?)~ZQ
填充域 region filling )Gu:eYp+`
实体设计 physical design E;m-^dxc
逻辑设计 logic design mHY R?
逻辑电路 logic circuit RTJ\|#w
层次设计 hierarchical design TrEo5H ;
自顶向下设计 top-down design i.(kX`~J1
自底向上设计 bottom-up design vpoYb
费用矩阵 cost metrix $BPTk0Y
元件密度 component density KcK,%!>B
自由度 degrees freedom 1h[xVvo<L
出度 out going degree EV$$wrohQ`
入度 incoming degree A0@E^bG
曼哈顿距离 manhatton distance 2#1G)XI
欧几里德距离 euclidean distance \a.^5g
网络 network 3om_Z/k
阵列 array k\NwH?ppu
段 segment [\rnJ
lE
逻辑 logic ]m(C}}
逻辑设计自动化 logic design automation y;r{0lTB
分线 separated time mk'$ |2O
分层 separated layer A.%MrgOOX
定顺序 definite sequence :|V`QM
导线(通道) conduction (track) M(8Mj[>>Rj
导线(体)宽度 conductor width :9O"?FE
导线距离 conductor spacing #AN]mH
导线层 conductor layer Z +vT76g3
导线宽度/间距 conductor line/space kW!`vQm~
第一导线层 conductor layer No.1 L6ifT`;T
圆形盘 round pad vRR(b!Lq
方形盘 square pad icw (y(W
菱形盘 diamond pad ;L{#TC(]J]
长方形焊盘 oblong pad !go$J]T
子弹形盘 bullet pad tS@J)p+_(
泪滴盘 teardrop pad ]w+n39da
雪人盘 snowman pad qIC9L"I
形盘 V-shaped pad V %^?yI
环形盘 annular pad 6HK
dBW$/
非圆形盘 non-circular pad 8=Z]?D=
隔离盘 isolation pad KIeTZVu$%
非功能连接盘 monfunctional pad Ne=o+ $.(
偏置连接盘 offset land q"uP%TN
腹(背)裸盘 back-bard land P>wDr`*
盘址 anchoring spaur 9!kH:Az[p
连接盘图形 land pattern 2l YA% n
连接盘网格阵列 land grid array (=/%_jj
孔环 annular ring mx ]a@tu
元件孔 component hole 9td[^EB#(h
安装孔 mounting hole w9c^IS
支撑孔 supported hole M<
1rQW'
非支撑孔 unsupported hole M;$LB@h
导通孔 via rZt7C(FM$7
镀通孔 plated through hole (PTH) y. A]un1
余隙孔 access hole V|njgcn d
盲孔 blind via (hole) ="<S1}.
埋孔 buried via hole s&