1 backplane 背板 %503<j
2 Band gap voltage reference 带隙电压参考 $
)2zz>4
3 benchtop supply 工作台电源 `fG<iBD
4 Block Diagram 方块图 5 Bode Plot 波特图 +br'
2Pn
6 Bootstrap 自举 F8/n;
7 Bottom FET Bottom FET DFRgn
8 bucket capcitor 桶形电容 i3$G)W
9 chassis 机架 KilN`?EJ
10 Combi-sense Combi-sense a^[s[j#^,
11 constant current source 恒流源 M[-/ &;`f@
12 Core Sataration 铁芯饱和 vI48*&]wTf
13 crossover frequency 交叉频率 :C0)[L
14 current ripple 纹波电流 &arJe!K
15 Cycle by Cycle 逐周期 =`CK`x
16 cycle skipping 周期跳步 $j@P8<M7
17 Dead Time 死区时间 rH\oFCzC
18 DIE Temperature 核心温度 z-sq9Qp&x
19 Disable 非使能,无效,禁用,关断 INCD5dihJ
20 dominant pole 主极点 ,u-9e4
21 Enable 使能,有效,启用 NH=@[t)P,
22 ESD Rating ESD额定值 MFWkJbZV
23 Evaluation Board 评估板 n 1^h;2gz
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. G"Ey%Q2K
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 xsS;<uCD
25 Failling edge 下降沿 <'hoN/g
26 figure of merit 品质因数 |'x"+x
27 float charge voltage 浮充电压 NMrf I0tbG
28 flyback power stage 反驰式功率级 #~w~k+E4
29 forward voltage drop 前向压降 {CTJX2&
30 free-running 自由运行 <1_3`t
31 Freewheel diode 续流二极管 mGF)Ot R
32 Full load 满负载 33 gate drive 栅极驱动 |}X[Yg=FG
34 gate drive stage 栅极驱动级 Lso%1M
35 gerber plot Gerber 图 Nm%#rZrN~Q
36 ground plane 接地层 7pnlS*E.
37 Henry 电感单位:亨利 [?$tu%Q(Z
38 Human Body Model 人体模式 <KoOJMx(
39 Hysteresis 滞回 rx<P#y]3)
40 inrush current 涌入电流 :n%&
41 Inverting 反相 8"V1h72vcW
42 jittery 抖动 7lwFxP5QT
43 Junction 结点 Jv]$@>#
44 Kelvin connection 开尔文连接 #nZPnc:
45 Lead Frame 引脚框架 3+iryW(\
46 Lead Free 无铅 RfCu5Kn
47 level-shift 电平移动 l=$?#^^ /
48 Line regulation 电源调整率 3m$Qd#|
49 load regulation 负载调整率 L EFLKC
50 Lot Number 批号 #hXvGon$?
51 Low Dropout 低压差 53bVhPGv
52 Miller 密勒 53 node 节点 axN\ZXU
54 Non-Inverting 非反相 l$R9c+L=
55 novel 新颖的 OcC|7s",
56 off state 关断状态 [O]rf+NZ(5
57 Operating supply voltage 电源工作电压 w:=:D=xH2
58 out drive stage 输出驱动级 ETdN<}m
59 Out of Phase 异相 zzd PR}VG
60 Part Number 产品型号 WH Ul.h
61 pass transistor pass transistor O+=}x]q*y
62 P-channel MOSFET P沟道MOSFET 7(|f@Y~*
63 Phase margin 相位裕度 \
*g3j
64 Phase Node 开关节点 J5xZLv
65 portable electronics 便携式电子设备 ^^a%Lz)U
66 power down 掉电 |U$ "GI
67 Power Good 电源正常 |PGTP#O<
68 Power Groud 功率地 2gEF$?+q?
69 Power Save Mode 节电模式 Tv~Ho&LS
70 Power up 上电 dqFp"Xe"%
71 pull down 下拉 )gAqWbkB
72 pull up 上拉 \,lIPA/L
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) K\mFb
74 push pull converter 推挽转换器 q:vGG K^
75 ramp down 斜降 wk1/&
76 ramp up 斜升 79h'sp6;
77 redundant diode 冗余二极管 oc[z dIk
78 resistive divider 电阻分压器 6X4r2Vq
79 ringing 振 铃 # 00?]6`z
80 ripple current 纹波电流 nmyDGuzk
81 rising edge 上升沿 ,,7hVw
82 sense resistor 检测电阻 {7_C|z:'p&
83 Sequenced Power Supplys 序列电源 F9A5}/\
84 shoot-through 直通,同时导通 \#F>R,
85 stray inductances. 杂散电感 J?hs\nA
86 sub-circuit 子电路 p
)WRsJ8
87 substrate 基板 ;sx4w!Y,
88 Telecom 电信 o/=61K8D
89 Thermal Information 热性能信息 nAX/u[
90 thermal slug 散热片 Q6N?cQtOT
91 Threshold 阈值 ,8!'jE[d
92 timing resistor 振荡电阻 9j5-/
93 Top FET Top FET O&VA79\UO
94 Trace 线路,走线,引线 !lM.1gTTC
95 Transfer function 传递函数 "}oo`+]Cq
96 Trip Point 跳变点 3bQq
Nk
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 4`Jf_C
98 Under Voltage Lock Out (UVLO) 欠压锁定 OAgZeK$
99 Voltage Reference 电压参考 <KI>:@|Sc
100 voltage-second product 伏秒积 n{M-t@r7
101 zero-pole frequency compensation 零极点频率补偿 JE<h
102 beat frequency 拍频 kX)*:~*
103 one shots 单击电路 k$kxw_N5d
104 scaling 缩放 lB!M;2^)X
105 ESR 等效串联电阻 [Page] W[>qiYf^b
106 Ground 地电位 )lJi7 ^,
107 trimmed bandgap 平衡带隙 _'n]rQ'
108 dropout voltage 压差 K%u>'W
109 large bulk capacitance 大容量电容 RRl`;w?
110 circuit breaker 断路器 ]]y,FQ,r
111 charge pump 电荷泵 vV"I}L
112 overshoot 过冲 b S' dXP
^SM5oK
印制电路printed circuit UVW4KUxR
印制线路 printed wiring `_BmVms
印制板 printed board BQs\!~Ux2
印制板电路 printed circuit board t oM+Bd:Y
印制线路板 printed wiring board gN*b~&G
印制元件 printed component uWP0(6 %
印制接点 printed contact qt4%=E;[
印制板装配 printed board assembly yf4 i!~
板 board /Kd'!lMuz
刚性印制板 rigid printed board 46B'Ec
挠性印制电路 flexible printed circuit gtqtFrleG
挠性印制线路 flexible printed wiring }?HWUAL\
齐平印制板 flush printed board +I}!)$/
金属芯印制板 metal core printed board 0r?]b*IEK
金属基印制板 metal base printed board *nv^s
多重布线印制板 mulit-wiring printed board p1T0FBV
L
塑电路板 molded circuit board @xk ;]H80
散线印制板 discrete wiring board mXyg\5
微线印制板 micro wire board R0|4KT-i
积层印制板 buile-up printed board FL&L$#X
表面层合电路板 surface laminar circuit 7loWqZ
埋入凸块连印制板 B2it printed board $if(n||
载芯片板 chip on board nHU}OGzW
埋电阻板 buried resistance board R38
\&F
母板 mother board Jid_&\
子板 daughter board 6}Rb-\N
背板 backplane {!! 8 *ix
裸板 bare board `(6cRT`Wp
键盘板夹心板 copper-invar-copper board P0k.\ 8qz
动态挠性板 dynamic flex board .B'ws/%5\
静态挠性板 static flex board }1Q>A 5e
可断拼板 break-away planel ofs Lx6Po
电缆 cable sLSH`Xy?5
挠性扁平电缆 flexible flat cable (FFC) j(M.7Z7^
薄膜开关 membrane switch IYr}%:P)
混合电路 hybrid circuit xU(b:D Z
厚膜 thick film EoS6t
厚膜电路 thick film circuit +6n\5+5
薄膜 thin film U99Uny9
薄膜混合电路 thin film hybrid circuit V >~\~H2Y
互连 interconnection def\=WyK
导线 conductor trace line 0C6T>E7
齐平导线 flush conductor %/S HB
传输线 transmission line _{GD\Ai_W
跨交 crossover WHu[A/##']
板边插头 edge-board contact .&h|r>*|J
增强板 stiffener qa4j>;
基底 substrate J~h9i=4<bF
基板面 real estate $y UPua/-
导线面 conductor side `3z6y&dmx
元件面 component side e+?;Dc-SJ\
焊接面 solder side 6=*n$l#}
导电图形 conductive pattern &z>iqm"Ww
非导电图形 non-conductive pattern Pjq()\/[Z
基材 base material "Id1H
层压板 laminate ~y/qm
[P
覆金属箔基材 metal-clad bade material 6H;\Jt
覆铜箔层压板 copper-clad laminate (CCL) 9S<V5$}
复合层压板 composite laminate :W+%jn
薄层压板 thin laminate BHU=TK@GR
基体材料 basis material v"<M
~9T)
预浸材料 prepreg &y-z[GR[{
粘结片 bonding sheet hE'>8 {
预浸粘结片 preimpregnated bonding sheer j9BcoEl:;
环氧玻璃基板 epoxy glass substrate klTRuU(
预制内层覆箔板 mass lamination panel w BoP&l
内层芯板 core material urQ<r{$x0
粘结层 bonding layer vtc%MG1
粘结膜 film adhesive V}FH5z
|
无支撑胶粘剂膜 unsupported adhesive film lbh7`xCR
覆盖层 cover layer (cover lay) fVi[mH0=+
增强板材 stiffener material n-1
铜箔面 copper-clad surface ucJ8l(?Qc
去铜箔面 foil removal surface hI*6f3Vn(n
层压板面 unclad laminate surface ET%F+
基膜面 base film surface gj&5>brP
胶粘剂面 adhesive faec T iJ \J{
原始光洁面 plate finish 7Q~$&G
粗面 matt finish -67!u;
剪切板 cut to size panel uX6rCokr
超薄型层压板 ultra thin laminate DW)X3A(^
A阶树脂 A-stage resin v7f[$s$m
B阶树脂 B-stage resin g``S SU
C阶树脂 C-stage resin gOp81)
环氧树脂 epoxy resin Bm6tf}8
酚醛树脂 phenolic resin X G5"u
聚酯树脂 polyester resin -<tTT
聚酰亚胺树脂 polyimide resin *r|13|k
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin m&[(xVM
丙烯酸树脂 acrylic resin L:.Rv0XT
三聚氰胺甲醛树脂 melamine formaldehyde resin SjcX|=S
多官能环氧树脂 polyfunctional epoxy resin :zpT Gk8Z
溴化环氧树脂 brominated epoxy resin V=Z%y$1Bc
环氧酚醛 epoxy novolac tv;?W=&P
氟树脂 fluroresin +^.xLTX`$
硅树脂 silicone resin :]LW,Eql
硅烷 silane 5H(
]"C
聚合物 polymer uI3oPP> $
无定形聚合物 amorphous polymer VS65SxHA
结晶现象 crystalline polamer N1U.1~U
双晶现象 dimorphism rY$wC%
共聚物 copolymer <Rz[G+0S=
合成树脂 synthetic 1\/~>
热固性树脂 thermosetting resin [Page] nd5.Py$
热塑性树脂 thermoplastic resin Q_*.1L
感光性树脂 photosensitive resin @}'?o_/C
环氧值 epoxy value _6]tbni?v
双氰胺 dicyandiamide ZR8y9mx2"
粘结剂 binder ]UZP dw1D
胶粘剂 adesive f+Fzpd?w S
固化剂 curing agent aLwEz}-
阻燃剂 flame retardant 'yh)6mid
遮光剂 opaquer eUD 5V
增塑剂 plasticizers qr~zTBT]
E
不饱和聚酯 unsatuiated polyester vJ;0%;eu[!
聚酯薄膜 polyester A>*#Nw5L
聚酰亚胺薄膜 polyimide film (PI) CU/Id`"tW
聚四氟乙烯 polytetrafluoetylene (PTFE) %d
/]8uO
增强材料 reinforcing material V0_^==Vs
折痕 crease Ol;"}3*Z*
云织 waviness 4UN|`'c
鱼眼 fish eye r_o\72
毛圈长 feather length B.);Ju
厚薄段 mark V]Uc@7S/
裂缝 split -)DxF<8B
捻度 twist of yarn [5GzY`/m
浸润剂含量 size content <B+
WM
浸润剂残留量 size residue 7bR[.|T
处理剂含量 finish level qR4-~p8
偶联剂 couplint agent dSS Ai
|}
断裂长 breaking length |w>d]eA5
吸水高度 height of capillary rise ~Yre(8+M
湿强度保留率 wet strength retention 6?/f$,v
白度 whitenness E:P_CDSd]
导电箔 conductive foil
FWLLbL5t
铜箔 copper foil [9yy<Z5
压延铜箔 rolled copper foil ~e5E%bXxC
光面 shiny side /8/N
粗糙面 matte side %)e&"mq!|
处理面 treated side pQ8f$I#v
防锈处理 stain proofing }3-`e3
双面处理铜箔 double treated foil T|5uywA|
模拟 simulation cHnd
gUW]
逻辑模拟 logic simulation tHFUV\D;,
电路模拟 circit simulation V@`%k]k
时序模拟 timing simulation /K<>OyR?
模块化 modularization k:&B
b"
设计原点 design origin )
gxN'z
优化(设计) optimization (design) IYhn*
供设计优化坐标轴 predominant axis -R`nitf
表格原点 table origin ?VyiR40-Cx
元件安置 component positioning 9CZEP0i7
比例因子 scaling factor !]&+g'aC3
扫描填充 scan filling /@", 5U#
矩形填充 rectangle filling 4v`;D,dIu
填充域 region filling =!($=9
实体设计 physical design i,l$1g-i
逻辑设计 logic design `L3{y/U'
逻辑电路 logic circuit Z|d+1i
层次设计 hierarchical design Qn@[{%),4
自顶向下设计 top-down design L;
<Pod
自底向上设计 bottom-up design eqyUI|e
费用矩阵 cost metrix '.I0n
元件密度 component density | 8akp
自由度 degrees freedom zOis}$GR
出度 out going degree @680.+Kw
入度 incoming degree &p55Cg@e)
曼哈顿距离 manhatton distance VrJf g
欧几里德距离 euclidean distance M4t:)!dji?
网络 network )c.!3n/pb
阵列 array ~{t<g;F
段 segment 2rM/kF >g
逻辑 logic S]gV! Q4%
逻辑设计自动化 logic design automation ",S146Y+
分线 separated time kU{a!ca4
分层 separated layer }?9 A:&
定顺序 definite sequence i8=+<d
导线(通道) conduction (track) 3k:`7E.
导线(体)宽度 conductor width Q|7m9~
导线距离 conductor spacing w[u>*I
导线层 conductor layer (?[%u0%_
导线宽度/间距 conductor line/space )J
8mn*
第一导线层 conductor layer No.1 S|m|ulB
圆形盘 round pad a@C}0IP)
方形盘 square pad p,3}A(>
菱形盘 diamond pad yxi* 4R
长方形焊盘 oblong pad perhR!#J
子弹形盘 bullet pad 4!-/m7%eF
泪滴盘 teardrop pad </2Cn@
雪人盘 snowman pad m=60a@o]
形盘 V-shaped pad V [*r=u[67F
环形盘 annular pad Ru$%gh>v
非圆形盘 non-circular pad N^'(`"J s
隔离盘 isolation pad .cr<.Ov
非功能连接盘 monfunctional pad GGsAisF"N
偏置连接盘 offset land =TA8]7S~U
腹(背)裸盘 back-bard land 6U1_Wk?
盘址 anchoring spaur ~pwk[Q!
连接盘图形 land pattern )eH?3""
连接盘网格阵列 land grid array :b,An'H
孔环 annular ring 8>|<m'e^\r
元件孔 component hole mJsU7bD`
安装孔 mounting hole {O4&HW%
支撑孔 supported hole D@m3bsMwe
非支撑孔 unsupported hole b{.Y?.U
导通孔 via 8(}cbW
镀通孔 plated through hole (PTH) u&e?3qKX(
余隙孔 access hole R=S)O.*R
盲孔 blind via (hole) u0%bv\$m
埋孔 buried via hole ksyQ_4^SO
埋,盲孔 buried blind via _TbvQY
任意层内部导通孔 any layer inner via hole }D!o=Mg^
全部钻孔 all drilled hole Q5*"t*L!N
定位孔 toaling hole gj4ONmY
无连接盘孔 landless hole PVrNS7 Rk/
中间孔 interstitial hole X*`b}^T
无连接盘导通孔 landless via hole 4XSq\.@G
引导孔 pilot hole !y3XIbdS"
端接全隙孔 terminal clearomee hole %U9f`qE
准尺寸孔 dimensioned hole [Page] :DFtH13qO
在连接盘中导通孔 via-in-pad ,v#3A7"yW
孔位 hole location vg5fMH9ZZ
孔密度 hole density HC|
]Au
孔图 hole pattern b6@0?_n
钻孔图 drill drawing ,8stEp9~h]
装配图assembly drawing S~^]ib0
参考基准 datum referan QM{B(zH
1) 元件设备 pJ/{X=y
t6~~s
iQI'
三绕组变压器:three-column transformer ThrClnTrans
va!fJ
双绕组变压器:double-column transformer DblClmnTrans vQ>8>V
电容器:Capacitor B8>@q!G8P
并联电容器:shunt capacitor J5}?<Dd:
电抗器:Reactor pAyUQe;X#
母线:Busbar jV#1d8qm
输电线:TransmissionLine e/$M6l$Q*4
发电厂:power plant od*#)
断路器:Breaker M[L@ej
刀闸(隔离开关):Isolator 0SJ(Ln`0K
分接头:tap j+2-Xy'
电动机:motor 2c3/iYCKP
(2) 状态参数 wIF)(t-):
b2~5 LZ
有功:active power srH.$Y;~
无功:reactive power {T3wOi
电流:current w}
r mYQ
容量:capacity Iz&<rL;s
电压:voltage LftzW{>gI"
档位:tap position }{.V^;
有功损耗:reactive loss /Ur]U
w
无功损耗:active loss GQ*or>R1
功率因数:power-factor }U**)"
功率:power |lh&l<=(f
功角:power-angle 9<5ii
电压等级:voltage grade kMg[YQ]OC
空载损耗:no-load loss )Zrn?KM
铁损:iron loss @`HW0Y_:
铜损:copper loss _SQ]\Z
空载电流:no-load current pK)!o
阻抗:impedance ;kD
Rm'(
正序阻抗:positive sequence impedance ?Xqkf>
负序阻抗:negative sequence impedance MgHO WoF
零序阻抗:zero sequence impedance 3
op{h6
电阻:resistor %/RT}CBBsW
电抗:reactance %%lJyLq'Vk
电导:conductance ~ _ko$(;A
电纳:susceptance 4cDe'9
LA
无功负载:reactive load 或者QLoad <M\#7.](
有功负载: active load PLoad +aOX{1w
遥测:YC(telemetering) .<6'*XR
遥信:YX %\!@$]3q
励磁电流(转子电流):magnetizing current *+ +}ll6
定子:stator ]MB6++.e
功角:power-angle A9LVS&52
上限:upper limit [2z
>8SL
下限:lower limit |43Oc:Ah+
并列的:apposable {ApjOIxk
高压: high voltage _] us1
低压:low voltage 'w_Qs~6~{
中压:middle voltage #X0Y8:vj
电力系统 power system Y5<W"[B!
发电机 generator ]x6rP
励磁 excitation ]m#*4
励磁器 excitor i_p-|I:hQ
电压 voltage %4Yq
(e
电流 current ^NO4T
母线 bus Oki{)Ssy
变压器 transformer 1/c+ug!y
升压变压器 step-up transformer ]vH:@%3U
高压侧 high side &PFK0tY
输电系统 power transmission system cPX^4d~9
输电线 transmission line %t]{C06w+{
固定串联电容补偿fixed series capacitor compensation ZN!<!"~
稳定 stability !'a
<Dw5
电压稳定 voltage stability ym2"D?P
(
功角稳定 angle stability U"L-1]L
暂态稳定 transient stability W?du ]
电厂 power plant d/\ajQ1::
能量输送 power transfer Cw~fP[5XMF
交流 AC 2Vxx
装机容量 installed capacity 9y j'->dL
电网 power system ^t,haO4
落点 drop point ,Eo\(j2F.
开关站 switch station FDuIm,NI
双回同杆并架 double-circuit lines on the same tower rW`l1yi*$
变电站 transformer substation TpxAp',#7
补偿度 degree of compensation Ij:yTu
高抗 high voltage shunt reactor k{cPiY^
无功补偿 reactive power compensation
Fp>nu _-"
故障 fault NdC5w-WY
调节 regulation &5hs
W1`
裕度 magin xggF:El3{
三相故障 three phase fault C4gzg
故障切除时间 fault clearing time
CaV)F3
极限切除时间 critical clearing time xxOhGA)
切机 generator triping =D)ADZ\<r
高顶值 high limited value @IOl0db
强行励磁 reinforced excitation Op hD_^
线路补偿器 LDC(line drop compensation) sk@aOv'*(
机端 generator terminal ul!q)cPb{
静态 static (state) \!IEZ
动态 dynamic (state) o 80x@ &A:
单机无穷大系统 one machine - infinity bus system -0<ZN(?|
机端电压控制 AVR xsU3c0wbr8
电抗 reactance N3wy][bo
电阻 resistance x\YVB',h
功角 power angle ^grDP*;W
有功(功率) active power 7yOBxb
无功(功率) reactive power w4l]rH
功率因数 power factor ?5wsgP^
无功电流 reactive current }$s QmRR
下降特性 droop characteristics *?+2%zP
斜率 slope XY<KLO%
额定 rating 8tzL.P^
变比 ratio {a(<E8-^
参考值 reference value {,= hIXo>
电压互感器 PT Is9.A_0h
分接头 tap @2TfW]6
下降率 droop rate (R(NEN
仿真分析 simulation analysis Z
4c^6v
传递函数 transfer function 15MKV=?oY
框图 block diagram AnpO?+\HF
受端 receive-side %1)J Rc
裕度 margin qos/pm$&i
同步 synchronization Fzz9BEw(i
失去同步 loss of synchronization V(Oi!(H;v
阻尼 damping Omph(
摇摆 swing c)c_Qv
保护断路器 circuit breaker U@:l~xJ
电阻:resistance ](`:<>c
电抗:reactance ;HiaX<O!
阻抗:impedance r>G||/Z
电导:conductance JvS
~.g1
电纳:susceptance