1 backplane 背板 fFXs:(
2 Band gap voltage reference 带隙电压参考 K *vNv4
3 benchtop supply 工作台电源 k;zbq
4 Block Diagram 方块图 5 Bode Plot 波特图 b9|F>3?r>
6 Bootstrap 自举 ThWZ>hyJ
7 Bottom FET Bottom FET i )3Y\u
8 bucket capcitor 桶形电容 9 K$F.{cx
9 chassis 机架 PyYKeo=
10 Combi-sense Combi-sense :;0?;dpO
11 constant current source 恒流源 a}E8ADyC
12 Core Sataration 铁芯饱和 l[G,sq"
13 crossover frequency 交叉频率 nq/xD;q
14 current ripple 纹波电流 +6<MK;
15 Cycle by Cycle 逐周期 3Un/-4uL
16 cycle skipping 周期跳步 JPQ02&e
17 Dead Time 死区时间
4EB$e?
18 DIE Temperature 核心温度 w0/W=!_
19 Disable 非使能,无效,禁用,关断 ]CC~Eo-%-
20 dominant pole 主极点 |&n dQ(!l
21 Enable 使能,有效,启用 e@]cI/j
22 ESD Rating ESD额定值 GU&XK7L
23 Evaluation Board 评估板 8x,;B_Zu
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. fbuop&FN+q
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 .v1rrH?
25 Failling edge 下降沿 5tq$SF42X
26 figure of merit 品质因数 yvDzxu
27 float charge voltage 浮充电压 SVq7qc9K?
28 flyback power stage 反驰式功率级 3%EwA\V(
29 forward voltage drop 前向压降 S"3g 1yU^_
30 free-running 自由运行 ;SC|VcbyH
31 Freewheel diode 续流二极管 ;o^m"I\y
32 Full load 满负载 33 gate drive 栅极驱动 Bl`e+&b
34 gate drive stage 栅极驱动级 g1zqh,
35 gerber plot Gerber 图 RB &s$6A
36 ground plane 接地层 ^ *
DKF
37 Henry 电感单位:亨利 ui 2RTAb
38 Human Body Model 人体模式 UO:>^,(j
39 Hysteresis 滞回 `SW`d<+L
40 inrush current 涌入电流 Ds}6{']K
41 Inverting 反相 =?*V3e3{
42 jittery 抖动 &OzJ^G\o
43 Junction 结点 z%g<&Cq
44 Kelvin connection 开尔文连接 IL%&*B
45 Lead Frame 引脚框架 ~o #
NOfYi
46 Lead Free 无铅 R:ar85F
47 level-shift 电平移动 #='#`5_5
48 Line regulation 电源调整率 b/5~VY*T
49 load regulation 负载调整率 UVI=&y]c,p
50 Lot Number 批号 Yhsb$wu
51 Low Dropout 低压差 .FMF0r>l
52 Miller 密勒 53 node 节点 1}ToR=
54 Non-Inverting 非反相 A1'IK.
55 novel 新颖的 @~N#)L^
56 off state 关断状态 y4?>5{`W
57 Operating supply voltage 电源工作电压 O/-OW: 03
58 out drive stage 输出驱动级 ,~4(td+R7
59 Out of Phase 异相 Ppp&3h[dW)
60 Part Number 产品型号 \Fj4Gy?MW
61 pass transistor pass transistor F
H%yyT
62 P-channel MOSFET P沟道MOSFET A|a\pL` @
63 Phase margin 相位裕度 Tf[]vqa`G
64 Phase Node 开关节点 s~63JDy"E
65 portable electronics 便携式电子设备 n&V(c&C
66 power down 掉电 1Gqtd^*;
67 Power Good 电源正常 QB@*/Le
68 Power Groud 功率地 C3<3
69 Power Save Mode 节电模式 !EW]:u
70 Power up 上电 VI+Y 4T@
71 pull down 下拉 q;AQ6k(
72 pull up 上拉 m76]INq
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) 'V>+G>U
74 push pull converter 推挽转换器 OB^
75 ramp down 斜降 8'quQCx*=
76 ramp up 斜升 Ux<h`
s
77 redundant diode 冗余二极管 LaIif_fie^
78 resistive divider 电阻分压器 G?V3lQI1n
79 ringing 振 铃 p_nrua?
80 ripple current 纹波电流 JC+VG;kcs
81 rising edge 上升沿 23fAc"@ B
82 sense resistor 检测电阻 _Ey8P0-I
83 Sequenced Power Supplys 序列电源 s`TBz8QO$
84 shoot-through 直通,同时导通 ujSzm=_P
85 stray inductances. 杂散电感 So 5{E4[
86 sub-circuit 子电路 x-QP+M`Pu
87 substrate 基板 *K 7L5.
88 Telecom 电信 FG(`&S+,
89 Thermal Information 热性能信息 tO0+~Wm
90 thermal slug 散热片 )-
\w
91 Threshold 阈值 gbh:Y}_FU
92 timing resistor 振荡电阻 }v!6BU6<Q
93 Top FET Top FET Q6>vF)(
-
94 Trace 线路,走线,引线 "LWp/
95 Transfer function 传递函数 GJ$,@
96 Trip Point 跳变点 Y\=:j7'
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ~@O4>T+VW
98 Under Voltage Lock Out (UVLO) 欠压锁定 y1saE
99 Voltage Reference 电压参考 zJy{Ry[Sb
100 voltage-second product 伏秒积 GhT7:_r~
101 zero-pole frequency compensation 零极点频率补偿 kO#`m]
102 beat frequency 拍频 !K2[S
J
103 one shots 单击电路 aD^MoB3
104 scaling 缩放 (l,o UBRr
105 ESR 等效串联电阻 [Page] loB/w{r*x
106 Ground 地电位 :Ry24X
107 trimmed bandgap 平衡带隙 utE:HD.PN
108 dropout voltage 压差 -jy"?]ve.
109 large bulk capacitance 大容量电容 ,ym;2hJ
110 circuit breaker 断路器 ;0*^9 8K
111 charge pump 电荷泵 ig,|3(
112 overshoot 过冲 y{sA[ "
{?iqO?
印制电路printed circuit buFtLPe
印制线路 printed wiring :6 fQE#(s&
印制板 printed board "10VN*)J}
印制板电路 printed circuit board w~&]gyf
印制线路板 printed wiring board *X #e
印制元件 printed component ._3NqE;
印制接点 printed contact Dfo9jYPf
印制板装配 printed board assembly Gpu?z-)
板 board YMd&+J`
刚性印制板 rigid printed board $^!w`>0C
挠性印制电路 flexible printed circuit ?X1#b2s
挠性印制线路 flexible printed wiring .g~@e_;):
齐平印制板 flush printed board t;]egk
金属芯印制板 metal core printed board AIyv;}5
金属基印制板 metal base printed board $yAfs3/%)s
多重布线印制板 mulit-wiring printed board ihWz/qx&q
塑电路板 molded circuit board \_E.%K
散线印制板 discrete wiring board -Tx tX8v
微线印制板 micro wire board =1VH5pVr}
积层印制板 buile-up printed board *
2%e.d3"M
表面层合电路板 surface laminar circuit u2<h<}Y
埋入凸块连印制板 B2it printed board yh:,[<q
载芯片板 chip on board l/^-:RRNKi
埋电阻板 buried resistance board .B13)$C
母板 mother board DO1{r/Ib.{
子板 daughter board ;Y^RF?un
背板 backplane AF$ o>f
裸板 bare board j%;)CV
G"
键盘板夹心板 copper-invar-copper board zf~zYZSr
动态挠性板 dynamic flex board 5KR|p Fq
静态挠性板 static flex board jVIpbG44
可断拼板 break-away planel HqBPY[;s
电缆 cable ~P_kr'o
挠性扁平电缆 flexible flat cable (FFC) ~PnpYd<2
薄膜开关 membrane switch @U{M"1zZe
混合电路 hybrid circuit oNZW#<K
厚膜 thick film %
eRwH
>
厚膜电路 thick film circuit '.yWL
薄膜 thin film MF}Lv1/[-J
薄膜混合电路 thin film hybrid circuit Xb*_LZAU
互连 interconnection ,d>~='
导线 conductor trace line `uA&w}(G
齐平导线 flush conductor Mqp68%
传输线 transmission line 0
0&$SE
跨交 crossover )c/y07er
板边插头 edge-board contact k+$4?/A
增强板 stiffener %n25Uq
基底 substrate zI! R-Nb
基板面 real estate }27Vh0v
导线面 conductor side H$amt^|zQ4
元件面 component side m1i+{((
焊接面 solder side 8$U ZL
导电图形 conductive pattern ]a#]3(o]}
非导电图形 non-conductive pattern tcEf
~|3
基材 base material hX%v`8
层压板 laminate ddDJXk)!0
覆金属箔基材 metal-clad bade material @ ^cgq3H'
覆铜箔层压板 copper-clad laminate (CCL) o%PoSZZ
复合层压板 composite laminate +A ?+G
薄层压板 thin laminate ,7jiHF
基体材料 basis material &W+G{W{3
预浸材料 prepreg j :Jdwf
粘结片 bonding sheet ?{,)XFck
预浸粘结片 preimpregnated bonding sheer h_G|.7!
环氧玻璃基板 epoxy glass substrate BC{J3<0bf@
预制内层覆箔板 mass lamination panel C$G88hesn
内层芯板 core material -!G#")<
粘结层 bonding layer )^S^s>3
粘结膜 film adhesive RK:sQWG
无支撑胶粘剂膜 unsupported adhesive film X1[R*a/p
覆盖层 cover layer (cover lay) ioa_AG6B
增强板材 stiffener material @-@rG>y^:
铜箔面 copper-clad surface zRoEx1
去铜箔面 foil removal surface ,tF" 4|#
层压板面 unclad laminate surface #'Y6UGJ\n
基膜面 base film surface Po!JgcJ#\
胶粘剂面 adhesive faec _AHB|P I
原始光洁面 plate finish 9Q7cUoxY
粗面 matt finish /\uH[[s
剪切板 cut to size panel 40d9/$uzh
超薄型层压板 ultra thin laminate TgE.=` "7
A阶树脂 A-stage resin YZ:'8<
B阶树脂 B-stage resin 2a(yR>#
C阶树脂 C-stage resin VE"0VB.
环氧树脂 epoxy resin DD6`k*RIk.
酚醛树脂 phenolic resin bc=u1=~w
聚酯树脂 polyester resin .y_bV=
聚酰亚胺树脂 polyimide resin YSz$` 7i
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin xiOrk
丙烯酸树脂 acrylic resin |XA aKZA
三聚氰胺甲醛树脂 melamine formaldehyde resin ID).*@(I"
多官能环氧树脂 polyfunctional epoxy resin X.AWs=:-
溴化环氧树脂 brominated epoxy resin }%ZG>LG5J
环氧酚醛 epoxy novolac b:5%}
氟树脂 fluroresin 6dR-HhF
硅树脂 silicone resin ~v(M6dz~vk
硅烷 silane vQTQS[R=z
聚合物 polymer VDu
.L8
无定形聚合物 amorphous polymer ?]:EmP
结晶现象 crystalline polamer awSS..g}L
双晶现象 dimorphism \%?8jQ'tX
共聚物 copolymer t k/K0u
合成树脂 synthetic ]7R&m)16
热固性树脂 thermosetting resin [Page] (VXx G/E3
热塑性树脂 thermoplastic resin %)hIpxOrX
感光性树脂 photosensitive resin b}?@syy8
环氧值 epoxy value U>B5LU9&
双氰胺 dicyandiamide &~JfDe9IS
粘结剂 binder +yP[(b/
胶粘剂 adesive [cLU*:
固化剂 curing agent JXRf4QmG
阻燃剂 flame retardant 5)n:<U*
遮光剂 opaquer >[%.h(h/%
增塑剂 plasticizers Vh.;p.!e
不饱和聚酯 unsatuiated polyester ;$tv8%_L[
聚酯薄膜 polyester !%RJC,X
聚酰亚胺薄膜 polyimide film (PI) u388Wj
聚四氟乙烯 polytetrafluoetylene (PTFE) L3=YlX`UL
增强材料 reinforcing material LY88;*:S
折痕 crease zr; Y1Xt4
云织 waviness 71<PEawL
鱼眼 fish eye o!l3.5m2d
毛圈长 feather length WVT5VJ7*
厚薄段 mark pJ$N@ID
裂缝 split ZaUcP6[h
捻度 twist of yarn Yr"!&\[oz
浸润剂含量 size content J.e8UQ@=5
浸润剂残留量 size residue j#nO6\&o
处理剂含量 finish level hA1gkEM2o
偶联剂 couplint agent x+*L5$;h
断裂长 breaking length "U5Ln2X{J
吸水高度 height of capillary rise 0q>NE<L
湿强度保留率 wet strength retention K@j^gF/0B
白度 whitenness mb~=Xyk&
导电箔 conductive foil MNf @HG
铜箔 copper foil & L.PU@
压延铜箔 rolled copper foil 6PQJgki
光面 shiny side mcz(,u}
粗糙面 matte side [`zbf_RyO
处理面 treated side kO,VayjT
防锈处理 stain proofing Z*vpQBbu
双面处理铜箔 double treated foil +Sd x8 Z5
模拟 simulation \{MrQ2jd
逻辑模拟 logic simulation +.gf]|
电路模拟 circit simulation Q&.IlVB[
时序模拟 timing simulation _L:i=.hxN
模块化 modularization s7UhC.>'@
设计原点 design origin r_V2 J{B
优化(设计) optimization (design) sx-Hw4.a"
供设计优化坐标轴 predominant axis T)Zt'M
表格原点 table origin An8%7xa7
元件安置 component positioning uku}Mr"p
比例因子 scaling factor =_?pOq
扫描填充 scan filling y[^k*,=
9
矩形填充 rectangle filling 6Bq~\b^
填充域 region filling _r<zSH%
实体设计 physical design h[-d1bKwS
逻辑设计 logic design P"V{y|2
逻辑电路 logic circuit 1|l)gfcP
层次设计 hierarchical design $xUzFLh=`
自顶向下设计 top-down design 8=n9hLhqo
自底向上设计 bottom-up design }o!#_N0T
费用矩阵 cost metrix Q2[prrk%j
元件密度 component density 1o;g1Z/
自由度 degrees freedom rt 3f7 s*
出度 out going degree wzDk{4U
入度 incoming degree 20.-;jK
曼哈顿距离 manhatton distance :!+}XT7)/
欧几里德距离 euclidean distance }:RT,<
网络 network nI` f_sp
阵列 array XoKO2<3
段 segment #LN5&i;s
逻辑 logic :~ZqB\>i
逻辑设计自动化 logic design automation ]< s\V-y
分线 separated time uXG`6|?
分层 separated layer Hyq@O8
定顺序 definite sequence JGk3b=K
导线(通道) conduction (track) 5q(]1|Sei
导线(体)宽度 conductor width w'oo-.k
导线距离 conductor spacing qLQ <1>u
导线层 conductor layer o[bE
导线宽度/间距 conductor line/space t
g
KG&
第一导线层 conductor layer No.1 n*vTVt)dJ
圆形盘 round pad ~|y^\U@
方形盘 square pad tb:,Uf>E
菱形盘 diamond pad 7xv4E<r2
长方形焊盘 oblong pad 5|<yfk8*J
子弹形盘 bullet pad ~7lTqY\
泪滴盘 teardrop pad ?Do^stq'4
雪人盘 snowman pad hzT{3YtY2
形盘 V-shaped pad V ,67"C2Y
环形盘 annular pad (~j,mk
非圆形盘 non-circular pad Pl rkgS0J
隔离盘 isolation pad ibd$%;bX3
非功能连接盘 monfunctional pad aN^]bs?R
偏置连接盘 offset land
h`wMi}q'D
腹(背)裸盘 back-bard land X q}Ucpj
盘址 anchoring spaur }}^,7npU
连接盘图形 land pattern DS#cm3
连接盘网格阵列 land grid array NJ;"jQ-
孔环 annular ring \H Wcd|
元件孔 component hole IVI~1~
安装孔 mounting hole g>2aIun_Q
支撑孔 supported hole di6B!YQP
非支撑孔 unsupported hole s<[A0=LH
导通孔 via *4<4
镀通孔 plated through hole (PTH) o"rq/\ovv
余隙孔 access hole _j:UGMTi(U
盲孔 blind via (hole) _iG2J&1'L
埋孔 buried via hole X+=-f^)&
埋,盲孔 buried blind via $&cz$jyY
任意层内部导通孔 any layer inner via hole T>}0) s
全部钻孔 all drilled hole
f~w>v
定位孔 toaling hole
BdN8
^W
无连接盘孔 landless hole 3lo;^KX !
中间孔 interstitial hole si_W:mLF{a
无连接盘导通孔 landless via hole )v[XmJ>H~o
引导孔 pilot hole :P3{Nxa
端接全隙孔 terminal clearomee hole 2O
eshkE
准尺寸孔 dimensioned hole [Page] WtEI] WO
在连接盘中导通孔 via-in-pad nz4<pvC,*
孔位 hole location "(s6aqO$
孔密度 hole density 1HMUHZT
孔图 hole pattern `/#f?Hk=
钻孔图 drill drawing '.?^uM
装配图assembly drawing f}^I=pS&
参考基准 datum referan `
^DjEdUN
1) 元件设备 Q,{^S,s<
$}t=RW
三绕组变压器:three-column transformer ThrClnTrans 3Jk[/.h
双绕组变压器:double-column transformer DblClmnTrans !c%
电容器:Capacitor 9YB2e84j
并联电容器:shunt capacitor 9B
/s
电抗器:Reactor qu_)`wB
母线:Busbar JPEIT
输电线:TransmissionLine R {HV]o|qk
发电厂:power plant RctU' T
断路器:Breaker PgMbMH
刀闸(隔离开关):Isolator 3y99O
$EAc
分接头:tap \[yr=X
电动机:motor |^R*4;Phe
(2) 状态参数 [F+(^- (
74+A+SK[
有功:active power C,/O
无功:reactive power \)OEBN`9#
电流:current Ly;I,)w
容量:capacity Hou*lCA
电压:voltage IV'p~t
档位:tap position w5`#q&?
有功损耗:reactive loss iv*V#J>
无功损耗:active loss owvS/"@
功率因数:power-factor # ly@;!M
功率:power ?~J i-{#X
功角:power-angle 69-:]7.g
电压等级:voltage grade N2BI_,hI1
空载损耗:no-load loss k;k}qq`d
铁损:iron loss ?]c+j1i
铜损:copper loss ,M QVE
空载电流:no-load current 4WC9US-k
阻抗:impedance wJe?t$ac?
正序阻抗:positive sequence impedance =. *98
负序阻抗:negative sequence impedance re^Hc(8M
零序阻抗:zero sequence impedance Q$~n/
电阻:resistor WK0C
电抗:reactance p~&BChBl!=
电导:conductance =7%oE[
电纳:susceptance WF2NG;f=
无功负载:reactive load 或者QLoad ]ab#q=
有功负载: active load PLoad 3uV4/%U
遥测:YC(telemetering) d H?
ScXM=
遥信:YX T dk
,&8
励磁电流(转子电流):magnetizing current /)EY2Y'
定子:stator hN3u@P^
功角:power-angle :P$#MC
上限:upper limit P`S@n/}
下限:lower limit 2C$R4:Ssw)
并列的:apposable Ts9ktPlm
高压: high voltage =bLY
/
低压:low voltage N2ied^* 0
中压:middle voltage d,0 }VaY=D
电力系统 power system Zp&@h-%YoD
发电机 generator (gwj)?:
励磁 excitation s
=Umj'1k
励磁器 excitor eS'yGY0b
电压 voltage vi!YN|}\
电流 current S{#cD1>.
母线 bus FY'ty@|_s
变压器 transformer t
P"\J(x
升压变压器 step-up transformer w8Vw1wW
高压侧 high side M6rc!K
输电系统 power transmission system o31Nmy
Ni
输电线 transmission line RO&H5m r%@
固定串联电容补偿fixed series capacitor compensation }7s>B24J
稳定 stability ;
A,#;%j
电压稳定 voltage stability JWv{=_2w
功角稳定 angle stability >9H@|[C
暂态稳定 transient stability n6MM5h/#r
电厂 power plant C[uOReo
能量输送 power transfer WC,+Cn e
交流 AC _:g&,2bc
装机容量 installed capacity k|YWOy@D~
电网 power system &QNY,Pj
落点 drop point VZy4_v=
开关站 switch station
d$W
双回同杆并架 double-circuit lines on the same tower HYK!}&
变电站 transformer substation *Dmx&F=3,5
补偿度 degree of compensation "*z_O
高抗 high voltage shunt reactor .8WXC
无功补偿 reactive power compensation <7_KeOLJ
故障 fault 52_#
调节 regulation Q=uR Kh
裕度 magin S4CbyXW
三相故障 three phase fault B,WTHU[AV
故障切除时间 fault clearing time `J0i.0p
极限切除时间 critical clearing time "2?l{4T\
切机 generator triping o%E;3l
高顶值 high limited value ZR0r>@M3v<
强行励磁 reinforced excitation kc `V4b%
线路补偿器 LDC(line drop compensation) (1R?s>3o
机端 generator terminal w|[RDaA b
静态 static (state) &fC!(Oy
动态 dynamic (state) . @q-B+Eg
单机无穷大系统 one machine - infinity bus system b5G}3)'w
机端电压控制 AVR :}:3i9e*2
电抗 reactance ;%C'FV e]
电阻 resistance 'XrRhF
(
功角 power angle N6OMYP1
有功(功率) active power 5yZ TcS z
无功(功率) reactive power {c?JuV4q?
功率因数 power factor nlYR-.
无功电流 reactive current
+=q)
下降特性 droop characteristics i':i_kU
斜率 slope RyJ 1mAC
额定 rating
-t2T(ha
变比 ratio a ]Eg!Q
参考值 reference value z4#(Ze@u~_
电压互感器 PT Kv'n:z7Md
分接头 tap rl#vE's6.e
下降率 droop rate ;22l"-F
仿真分析 simulation analysis eN?Y7
传递函数 transfer function s=6}%%q6
框图 block diagram 6VP`evan
受端 receive-side =L|tp%!
裕度 margin O,bkQY$v
同步 synchronization Q5{Pv}Jx
失去同步 loss of synchronization aI(7nJ=R
阻尼 damping %3q0(Xl
摇摆 swing X,aYK;q%z
保护断路器 circuit breaker 4/ kv3rv
电阻:resistance ?bZovRx
电抗:reactance s>k Uh
阻抗:impedance &6 s) X
电导:conductance ml0.$z
电纳:susceptance