1 backplane 背板 ?`[NFqv_]
2 Band gap voltage reference 带隙电压参考 MV=9!{`
3 benchtop supply 工作台电源 P_u|-~|\
4 Block Diagram 方块图 5 Bode Plot 波特图 V]S1X^
6 Bootstrap 自举 ?RzD Qy D
7 Bottom FET Bottom FET *MI*Rz?4
8 bucket capcitor 桶形电容 Il`tNr
9 chassis 机架 nv<` K9d
10 Combi-sense Combi-sense `Bn=?9
11 constant current source 恒流源 )fdE6
12 Core Sataration 铁芯饱和 k-*Mzm]kb
13 crossover frequency 交叉频率 RmI1`
14 current ripple 纹波电流 _73h<|0
15 Cycle by Cycle 逐周期 5(
_6+'0
16 cycle skipping 周期跳步 C>Is1i^9
17 Dead Time 死区时间 ",>H(wJ8
18 DIE Temperature 核心温度 ~m*,mz
19 Disable 非使能,无效,禁用,关断 -|Kzo_"
v5
20 dominant pole 主极点 _IeU+tS
21 Enable 使能,有效,启用 ]4 (?BJ
22 ESD Rating ESD额定值 !jqWwi
23 Evaluation Board 评估板 0Aa`p3.)
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. dd|W@Xp -
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 S-+M;@'Rl
25 Failling edge 下降沿 TzBzEiANn
26 figure of merit 品质因数 -=698h*
27 float charge voltage 浮充电压 bAr` E
28 flyback power stage 反驰式功率级 YRlDX:oX~
29 forward voltage drop 前向压降 UofTll)
30 free-running 自由运行 (Vg}Hh?p
31 Freewheel diode 续流二极管 (c v!Y=]
32 Full load 满负载 33 gate drive 栅极驱动 yg]2erR
34 gate drive stage 栅极驱动级 >"3>fche
35 gerber plot Gerber 图 *5,c Rz
36 ground plane 接地层 irTv4ZE'+l
37 Henry 电感单位:亨利 M`D$!BJr
38 Human Body Model 人体模式 ^6p'YYj"5
39 Hysteresis 滞回 Tp<k<uKD
40 inrush current 涌入电流 3z;_KmM
41 Inverting 反相 @U -$dw'4
42 jittery 抖动 nU`Lhh8y
43 Junction 结点 ji+{ :D
44 Kelvin connection 开尔文连接 a <X0e>
45 Lead Frame 引脚框架 7t-Lz|
$"
46 Lead Free 无铅 NN
0Q`r,8}
47 level-shift 电平移动 p$;I'
48 Line regulation 电源调整率 #~qAHJ<
49 load regulation 负载调整率 #ZiT-
50 Lot Number 批号 7 gB{In0
51 Low Dropout 低压差 VSOz.g>
52 Miller 密勒 53 node 节点 ZkB3[$4C=5
54 Non-Inverting 非反相 w?csV8ot
55 novel 新颖的 !.fw,!}hOD
56 off state 关断状态 NHX>2-b
57 Operating supply voltage 电源工作电压 ;K:8#XuV
58 out drive stage 输出驱动级 > 8]j
59 Out of Phase 异相 ZEbLL4n
60 Part Number 产品型号 `0#H]=$2h
61 pass transistor pass transistor U l Mi.;/^
62 P-channel MOSFET P沟道MOSFET 3}&ZOO
63 Phase margin 相位裕度 &~5=K
64 Phase Node 开关节点 8(X0
:
65 portable electronics 便携式电子设备 K^%-NyV
66 power down 掉电 h[XGC=%
67 Power Good 电源正常 yZ}d+7T}
68 Power Groud 功率地 <M[U#Q~?~e
69 Power Save Mode 节电模式 Uz8hANN0_
70 Power up 上电 Tvf~P w
71 pull down 下拉 ;)!"Ty|
72 pull up 上拉 \Mi#{0f+q
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) & 7QH^
74 push pull converter 推挽转换器 k3@HI|
75 ramp down 斜降 0o&}mKe
76 ramp up 斜升 i+M*J#'
77 redundant diode 冗余二极管 dGgP_S
78 resistive divider 电阻分压器 zXc}W*ymj
79 ringing 振 铃 Qs+ k)e,
80 ripple current 纹波电流 |k-XBp
81 rising edge 上升沿 #w3ru6*W
82 sense resistor 检测电阻 6*1$8G`$8,
83 Sequenced Power Supplys 序列电源 _LfHs1g4
84 shoot-through 直通,同时导通 \k&1*b?h
85 stray inductances. 杂散电感 "2HY5AE
86 sub-circuit 子电路 q"aPJ0ni'
87 substrate 基板 +AQDD4bu
88 Telecom 电信 Gm=>!.p
89 Thermal Information 热性能信息 'UDBV
90 thermal slug 散热片 RSWcaATZN
91 Threshold 阈值 fU*C/ d3
92 timing resistor 振荡电阻 O25mkX
93 Top FET Top FET q/6UK =
94 Trace 线路,走线,引线 @Y'I,e
95 Transfer function 传递函数 m7 XjP2
96 Trip Point 跳变点 = hX[
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ~mILA->F
98 Under Voltage Lock Out (UVLO) 欠压锁定 ,@Z_{,b
99 Voltage Reference 电压参考 ^Qh-(u`
100 voltage-second product 伏秒积 j|'R$|
101 zero-pole frequency compensation 零极点频率补偿 q9}2
102 beat frequency 拍频 -gKpL\
103 one shots 单击电路 B7"Fp
104 scaling 缩放 \K`jCsT
105 ESR 等效串联电阻 [Page] l`rC0kJ]
106 Ground 地电位 8&a_A:h
107 trimmed bandgap 平衡带隙 *PB/iVH%6
108 dropout voltage 压差 =l|>.\-
109 large bulk capacitance 大容量电容 R+.
N n
110 circuit breaker 断路器 0o68rF5^s
111 charge pump 电荷泵 <%,'$^'DS
112 overshoot 过冲 lYQtv=q
x1DVD!0 ~{
印制电路printed circuit ~u/@rqF
印制线路 printed wiring H%.zXQ4}n
印制板 printed board TU%"jb5
印制板电路 printed circuit board p5SX1PPQ
印制线路板 printed wiring board tyXl}$)y
印制元件 printed component Dt {')
印制接点 printed contact :` <psvd
印制板装配 printed board assembly FX 1C
e
板 board
<qn,
刚性印制板 rigid printed board mmN|F$;r
挠性印制电路 flexible printed circuit G `Izf1B`I
挠性印制线路 flexible printed wiring +2O=s<fp
齐平印制板 flush printed board ta! V=U
金属芯印制板 metal core printed board }1rvM4{/+f
金属基印制板 metal base printed board Qu_EfmN|
多重布线印制板 mulit-wiring printed board k|ip?O
塑电路板 molded circuit board 4hNwKe"Ki
散线印制板 discrete wiring board /W9
&Ke
微线印制板 micro wire board %AgA -pBp
积层印制板 buile-up printed board 9UmBm#"
表面层合电路板 surface laminar circuit ;vUxO<cKFq
埋入凸块连印制板 B2it printed board z+6QZQk
载芯片板 chip on board 5vGioO
埋电阻板 buried resistance board =L16hDk o
母板 mother board foyB{6q8
子板 daughter board A5+5J_)*
背板 backplane DrFu r(=T
裸板 bare board FAd``9kRT
键盘板夹心板 copper-invar-copper board Gy^FrF
动态挠性板 dynamic flex board qp1\I$Y
静态挠性板 static flex board >e_%M50
可断拼板 break-away planel 0:PSt_33F
电缆 cable SauHFl8?
挠性扁平电缆 flexible flat cable (FFC) 9mm2V ps;
薄膜开关 membrane switch ^hysC c
混合电路 hybrid circuit Ge~,[If+
厚膜 thick film /b+;:
z
厚膜电路 thick film circuit NY 4C@@"
薄膜 thin film Dpj-{q7C
薄膜混合电路 thin film hybrid circuit y*(_\\
互连 interconnection #jgqkMOd,j
导线 conductor trace line - XLo0
齐平导线 flush conductor mLULd} g/o
传输线 transmission line Q4CJ]J`
跨交 crossover 1 Xa+%n9
板边插头 edge-board contact ,M{Q}:$+4
增强板 stiffener :r^klJ(m
基底 substrate ?to1rFrU
基板面 real estate 9[,s4sxH
导线面 conductor side rx}*u3x=
元件面 component side D8EeZUqU
焊接面 solder side /Bm#`?(ia
导电图形 conductive pattern y-<$bA[K~
非导电图形 non-conductive pattern t,1in4sN
基材 base material zw<
4G[u
层压板 laminate [tOuNj:
覆金属箔基材 metal-clad bade material jF4csO=E
覆铜箔层压板 copper-clad laminate (CCL) |""=)-5N
复合层压板 composite laminate }!=gP.Zu^
薄层压板 thin laminate j;G[%gi6{
基体材料 basis material H)`@2~Y
预浸材料 prepreg
[Ek42%
粘结片 bonding sheet hRRkFz/0&
预浸粘结片 preimpregnated bonding sheer _o&94&
环氧玻璃基板 epoxy glass substrate OZa88&
预制内层覆箔板 mass lamination panel PE|PwqX
内层芯板 core material /=q.tDH=I
粘结层 bonding layer UDVf@[[hN
粘结膜 film adhesive KS?mw`Nr
无支撑胶粘剂膜 unsupported adhesive film %mJ~F*Dy
覆盖层 cover layer (cover lay) q;ZLaX\bFl
增强板材 stiffener material "*+\KPCU
铜箔面 copper-clad surface Q%I#{+OT
去铜箔面 foil removal surface rNZO.qijz
层压板面 unclad laminate surface f.J9) lfb
基膜面 base film surface E*OG-r
胶粘剂面 adhesive faec })KJ60B
原始光洁面 plate finish &adY
粗面 matt finish ,%[LwmET
剪切板 cut to size panel )
b/n)%6
超薄型层压板 ultra thin laminate mF}c-
D
A阶树脂 A-stage resin Z@}sCZ=#A
B阶树脂 B-stage resin WN$R[N
C阶树脂 C-stage resin 'YBi5_
环氧树脂 epoxy resin 3IGCl w(
酚醛树脂 phenolic resin Zd8drT'@#
聚酯树脂 polyester resin ix^gAot
聚酰亚胺树脂 polyimide resin tp%|AD"
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin {K<uM'ww>
丙烯酸树脂 acrylic resin H_Iim[v#
三聚氰胺甲醛树脂 melamine formaldehyde resin UlnyTz~
多官能环氧树脂 polyfunctional epoxy resin KUF$h Er
溴化环氧树脂 brominated epoxy resin ]7v81G5E
环氧酚醛 epoxy novolac PEfE'lGj
氟树脂 fluroresin R$Zv0a&
硅树脂 silicone resin 5/tj
硅烷 silane Ze#Jhn@
聚合物 polymer ,.[.SU#V
无定形聚合物 amorphous polymer 4 #aqz9k
结晶现象 crystalline polamer ]{(l;k9=e
双晶现象 dimorphism `b#/[3
共聚物 copolymer .F4oo =
合成树脂 synthetic z<n"{%
热固性树脂 thermosetting resin [Page] *e%Dg{_
热塑性树脂 thermoplastic resin 3T"#T&eL
感光性树脂 photosensitive resin 1$);V,DK!
环氧值 epoxy value 'BqrJfv
双氰胺 dicyandiamide f( ]R/'o
粘结剂 binder 2dXU0095
胶粘剂 adesive ,>&?ty9o
固化剂 curing agent 1po"gVot
阻燃剂 flame retardant (~=Qufy
遮光剂 opaquer |^Y*~d<H
增塑剂 plasticizers Hr
/W6C
不饱和聚酯 unsatuiated polyester {-o7w0d_
聚酯薄膜 polyester y>@v>S
聚酰亚胺薄膜 polyimide film (PI) r4 9UJE
聚四氟乙烯 polytetrafluoetylene (PTFE) h0T< :X
增强材料 reinforcing material |.y>[+Qb*
折痕 crease Jz=;mrW
云织 waviness Y=5!QLV4
鱼眼 fish eye BO8%:/37[4
毛圈长 feather length 2^cAK t6bC
厚薄段 mark +]A+!8%Z
裂缝 split uG2Xkj
捻度 twist of yarn -"2 <h:#
浸润剂含量 size content kSLSxfR
浸润剂残留量 size residue J f\Qf
处理剂含量 finish level %|#P&`
偶联剂 couplint agent ny278tr Q7
断裂长 breaking length ,@}W@GGP)
吸水高度 height of capillary rise 'Y hA
湿强度保留率 wet strength retention UN,<6D3\b
白度 whitenness +F1]M2p]
导电箔 conductive foil 3js)niT9u
铜箔 copper foil OI'uH$y
压延铜箔 rolled copper foil bq c;.4$
光面 shiny side &W&7bZ$;
粗糙面 matte side yfPCGCOW?
处理面 treated side bk/.<Rt
防锈处理 stain proofing [P.@1mV
双面处理铜箔 double treated foil C*"Rd
模拟 simulation vs5
D:cZ}
逻辑模拟 logic simulation `Mo~EHso.
电路模拟 circit simulation <'g0il
时序模拟 timing simulation *raIV]W3
模块化 modularization zi?qK?m
设计原点 design origin j)6@q@P/
优化(设计) optimization (design) Q.j-C}a
供设计优化坐标轴 predominant axis M3hy5j(b
表格原点 table origin wk-Mu\
元件安置 component positioning h-z%C6
比例因子 scaling factor ^AovkK(p
扫描填充 scan filling ;yRwoTc)Y
矩形填充 rectangle filling P Xyyyir{
填充域 region filling |usnY
实体设计 physical design ~0VwF
逻辑设计 logic design /V#MLPA
逻辑电路 logic circuit ^ %~Et>C
层次设计 hierarchical design ==jkp
U*=
自顶向下设计 top-down design Jm{As*W>
自底向上设计 bottom-up design F!z! :yp
费用矩阵 cost metrix OhA^UP01-
元件密度 component density 27h/6i3
自由度 degrees freedom yrxx+z|wR
出度 out going degree ?TL2'U|M
入度 incoming degree wZ
(uq?3S`
曼哈顿距离 manhatton distance 9b{g+lMZo
欧几里德距离 euclidean distance -L^0-g
网络 network dg!1wD
阵列 array X+(aQ
>y
段 segment HB/
_O22
逻辑 logic PO=ZxG
逻辑设计自动化 logic design automation >#${.+y
分线 separated time 2:smt)f
分层 separated layer !Szgph"ul
定顺序 definite sequence x9XGCr
导线(通道) conduction (track) ~Mg8C9B?%3
导线(体)宽度 conductor width )w}*PL
导线距离 conductor spacing puf;"c6e'
导线层 conductor layer =y,yQO
导线宽度/间距 conductor line/space 4wM$5
第一导线层 conductor layer No.1 [T$$od[.
圆形盘 round pad dpc=yXg>"c
方形盘 square pad ?z4uze1
菱形盘 diamond pad a$+e8>
长方形焊盘 oblong pad K'{ wncumQ
子弹形盘 bullet pad o'= [<
泪滴盘 teardrop pad x~3>1Wr#M
雪人盘 snowman pad #b]}cwd!
形盘 V-shaped pad V f:)K
环形盘 annular pad LyCV_6;D
非圆形盘 non-circular pad `Tm8TZd66
隔离盘 isolation pad W~W?<%@
非功能连接盘 monfunctional pad ?(`nBlWQ5
偏置连接盘 offset land \nWzn4f
腹(背)裸盘 back-bard land 6):sO/es
盘址 anchoring spaur =8VJ.{xy_e
连接盘图形 land pattern RY'\mt"W2
连接盘网格阵列 land grid array f|[5&,2<
孔环 annular ring eog,EP"a8Y
元件孔 component hole 5. +$v4
安装孔 mounting hole a3E*%G
支撑孔 supported hole ;4O;74`Zh
非支撑孔 unsupported hole `rOe5Zp$
导通孔 via c_DB^M!h
镀通孔 plated through hole (PTH) W4] 0qp`\
余隙孔 access hole Y
GcY2p<
盲孔 blind via (hole) @Tj
6!v
埋孔 buried via hole LeRh(a`=$
埋,盲孔 buried blind via wTJMq`sY_
任意层内部导通孔 any layer inner via hole `P)64So-1
全部钻孔 all drilled hole {F{[!.
定位孔 toaling hole D$^7Xhk
无连接盘孔 landless hole y(p:)Iv
中间孔 interstitial hole N;Gf,pE
无连接盘导通孔 landless via hole !gA^$(=:"
引导孔 pilot hole hTNYjXj
端接全隙孔 terminal clearomee hole ,y{fqa4
准尺寸孔 dimensioned hole [Page] @v:ILby4-
在连接盘中导通孔 via-in-pad D4x'
孔位 hole location `A}{
I}xq
孔密度 hole density 5SPl#*W
孔图 hole pattern Wf&G9Be?8
钻孔图 drill drawing b^=8%~?%4
装配图assembly drawing _o=`-iy9
参考基准 datum referan 4j=@}!TBt
1) 元件设备 X|QX1dl
oqm{<g?2
三绕组变压器:three-column transformer ThrClnTrans B'#gs'fl
双绕组变压器:double-column transformer DblClmnTrans J~ gkGso
电容器:Capacitor .q& ]wu
并联电容器:shunt capacitor u
BW
电抗器:Reactor Vm5P@RU$w;
母线:Busbar oY#XWe8Om
输电线:TransmissionLine t)kr/Z*p\
发电厂:power plant EPUJa~4
断路器:Breaker 6`PGV+3j
刀闸(隔离开关):Isolator "r `6c0Z
分接头:tap l#(g&x6J
电动机:motor F@*r%[S/
(2) 状态参数 oz5lt4
UVuuIW0k
有功:active power YUE1 '}
无功:reactive power ]8j5Ou6#y
电流:current J,2v~Dq
容量:capacity cF>;f(X
电压:voltage XS~w_J#q
档位:tap position 9%hB
有功损耗:reactive loss ]KII?{<k
无功损耗:active loss IU"!oM ^
功率因数:power-factor (h(ZL9!
功率:power orN2(:Ct7
功角:power-angle 5D@Q1
电压等级:voltage grade SEn8t"n
空载损耗:no-load loss
T?$?5
铁损:iron loss }&^bR)=
铜损:copper loss %4g4 C#
空载电流:no-load current dodz|5o%
阻抗:impedance BqJrL/(
正序阻抗:positive sequence impedance ~#xs
`@{s
负序阻抗:negative sequence impedance ZCq\Zk1O&
零序阻抗:zero sequence impedance K^p"Z$$
电阻:resistor xuC6EK+
电抗:reactance l~>rpG
电导:conductance J +Y|# U
电纳:susceptance iO#xIl<
无功负载:reactive load 或者QLoad Czl 8Q oH
有功负载: active load PLoad m3ZOq
B-
遥测:YC(telemetering) 9#ay(g
遥信:YX
(Y?yGq/
励磁电流(转子电流):magnetizing current x-P_}}K 79
定子:stator uqH! eN5
功角:power-angle 8XXTN@&,
上限:upper limit C]@B~X1H^
下限:lower limit hYQ%|CBXBR
并列的:apposable "e?#c<p7
高压: high voltage 6v#sq
低压:low voltage }LVE^6zyk
中压:middle voltage KuAGy*:4T
电力系统 power system ~wV98u-N
发电机 generator 5 BG&r*U
励磁 excitation 8IcQpn#
励磁器 excitor 1>*<K/\qg
电压 voltage NQ{Z
电流 current {twf7.eY
母线 bus Y{B_OoTun
变压器 transformer W5yu`Br
升压变压器 step-up transformer y")>"8H
高压侧 high side ;:YjgZ:+Q]
输电系统 power transmission system =|^W]2W$
输电线 transmission line Z~:lfCK`
固定串联电容补偿fixed series capacitor compensation
r3K:
稳定 stability ;(Va_
电压稳定 voltage stability !,WRXE&j
功角稳定 angle stability o=5uM
暂态稳定 transient stability 2{qG
电厂 power plant ]nGA1 S{
能量输送 power transfer VZl0)YLK
交流 AC 7"U,N;y
装机容量 installed capacity KV(W|~+ rM
电网 power system B_1u<00kg
落点 drop point nmAXU!t'
开关站 switch station ,l"2MXD
双回同杆并架 double-circuit lines on the same tower ) FsSXnZL
变电站 transformer substation =hb87g.
补偿度 degree of compensation KAaeaiD
高抗 high voltage shunt reactor :H k4i%hGk
无功补偿 reactive power compensation |/ 7's'
故障 fault ImW~Jy
调节 regulation D*b|(Oi
裕度 magin a,\u|T:g
三相故障 three phase fault %Q01EjRes
故障切除时间 fault clearing time ?XrTZ{5'
极限切除时间 critical clearing time vCr$miZ
切机 generator triping l$@lk?dc
高顶值 high limited value 5,fzB~$TX(
强行励磁 reinforced excitation `2+52q<FO
线路补偿器 LDC(line drop compensation) "lAS
<dq
机端 generator terminal 8zv6Mx
静态 static (state) NV ~i4R*#
动态 dynamic (state) [^P2Kn
单机无穷大系统 one machine - infinity bus system }e|]G,NZO
机端电压控制 AVR |bUmkw
电抗 reactance g#NUo/
电阻 resistance T!$HVHh&,}
功角 power angle 1z!Lk*C)
有功(功率) active power WJ,ON-v
无功(功率) reactive power 9&jNdB
功率因数 power factor q|\Cp
无功电流 reactive current o?\Pw9Y
下降特性 droop characteristics 6d6SP)|j
斜率 slope yFv3>\
额定 rating )f|6=x4
变比 ratio &KwtvUN{
参考值 reference value 3"RZiOyv
电压互感器 PT ]C^*C|
分接头 tap e70*y'1fu
下降率 droop rate 8=VX` X
仿真分析 simulation analysis $80/ub:R
传递函数 transfer function P]^]
T}5
框图 block diagram 1Tkz!
受端 receive-side B 8,{jwB
裕度 margin )Qp?LECrt
同步 synchronization =uEhxsj)S
失去同步 loss of synchronization ~d]7 Cl
阻尼 damping *?\Nioii
摇摆 swing s4*,ocyBP
保护断路器 circuit breaker }2"k:-g
电阻:resistance l1-FL-1
电抗:reactance ggWfk
阻抗:impedance r6<}S(
电导:conductance m5*RB1
电纳:susceptance