1 backplane 背板 Q3'L\_1L
2 Band gap voltage reference 带隙电压参考 4XNdsb
3 benchtop supply 工作台电源 Fzk%eHG=
4 Block Diagram 方块图 5 Bode Plot 波特图 L;i(@tp|v
6 Bootstrap 自举 `L
m9!?
7 Bottom FET Bottom FET DyCnL@
8 bucket capcitor 桶形电容 \"|7o8
9 chassis 机架 08qM?{zo^
10 Combi-sense Combi-sense kKs}E| T
11 constant current source 恒流源 oIv\Xdc8 1
12 Core Sataration 铁芯饱和 ^JY,K
13 crossover frequency 交叉频率 M`49ydh&
14 current ripple 纹波电流 nc9sfH3
15 Cycle by Cycle 逐周期 /4YxB,
16 cycle skipping 周期跳步 7m.>2U
17 Dead Time 死区时间 L(q~%
18 DIE Temperature 核心温度 [;pL15-}4
19 Disable 非使能,无效,禁用,关断 ^u+#x2$Mg
20 dominant pole 主极点 ~F.kgX
21 Enable 使能,有效,启用 .!)i
22 ESD Rating ESD额定值 X<<FS%:+
23 Evaluation Board 评估板 `6\u!#
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. eE5j6`5i
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 560`R>
25 Failling edge 下降沿 'j$n;3
26 figure of merit 品质因数 m9mkZ:r(kV
27 float charge voltage 浮充电压 VJSkQ\KD
28 flyback power stage 反驰式功率级 zI$'D|A
29 forward voltage drop 前向压降 s-Qq#T
30 free-running 自由运行 %cl{J_}{&
31 Freewheel diode 续流二极管 vEc<|t
32 Full load 满负载 33 gate drive 栅极驱动 6B!v;93U
34 gate drive stage 栅极驱动级 B4eV $~<
35 gerber plot Gerber 图 x-s\0l
36 ground plane 接地层 =h\uC).t&
37 Henry 电感单位:亨利 >^GAfvW
38 Human Body Model 人体模式 a49t/
39 Hysteresis 滞回 Vtv1{/@+c
40 inrush current 涌入电流 t[p/65L>8
41 Inverting 反相 eL1)_M;{
42 jittery 抖动 5"&=BD~D
43 Junction 结点 |e91KmiqJ
44 Kelvin connection 开尔文连接 ]VoJ7LoCZ'
45 Lead Frame 引脚框架 cuh Z_l
46 Lead Free 无铅 l9naqb:iP
47 level-shift 电平移动 zsr; 37
48 Line regulation 电源调整率 'x u!t'l&
49 load regulation 负载调整率 |&_(I
50 Lot Number 批号 ~Z}DN*S
51 Low Dropout 低压差 R,`3 SW()
52 Miller 密勒 53 node 节点 IweNe`Z
54 Non-Inverting 非反相 qHu\3@px
55 novel 新颖的 Rnw v/)
56 off state 关断状态 3/Dis)
v8
57 Operating supply voltage 电源工作电压 kC
iOcl*$
58 out drive stage 输出驱动级 df{6!}/(
59 Out of Phase 异相 5l]qhi3f
60 Part Number 产品型号 / hYFOZ
61 pass transistor pass transistor ->'xjD
62 P-channel MOSFET P沟道MOSFET J@qwz[d i
63 Phase margin 相位裕度 ) ):w`^6
64 Phase Node 开关节点 tja7y"(]
65 portable electronics 便携式电子设备 ]\F}-I[
66 power down 掉电 xiO10:L4
67 Power Good 电源正常 #ds@!u+&
68 Power Groud 功率地 1"No~/_
69 Power Save Mode 节电模式 #:=*n(GT
70 Power up 上电 ~H:.&'E
71 pull down 下拉 kudXwj
72 pull up 上拉 I^m9(L4%
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) q>m[vvt"
74 push pull converter 推挽转换器 m0N{%Mf-
75 ramp down 斜降 7Mb-v}
76 ramp up 斜升 w|:ev_c|
77 redundant diode 冗余二极管 LZ8xh
78 resistive divider 电阻分压器 a6'T]DW0W
79 ringing 振 铃 7)*QX,4C
80 ripple current 纹波电流 PoZxT-U
81 rising edge 上升沿 FO)`&s"&2
82 sense resistor 检测电阻 .q'{3
83 Sequenced Power Supplys 序列电源 SHQgI<D7
84 shoot-through 直通,同时导通 :Fi$-g
85 stray inductances. 杂散电感 w
sbzGW~=
86 sub-circuit 子电路 c3N,P<#
87 substrate 基板 f\~A72-
88 Telecom 电信 <[V1z=Eo/]
89 Thermal Information 热性能信息 U98e=57N
90 thermal slug 散热片 [#2X
91 Threshold 阈值 ^4=%~Yx
92 timing resistor 振荡电阻 tJpK/"R'
93 Top FET Top FET '
BY|7j~
94 Trace 线路,走线,引线 is`~C
95 Transfer function 传递函数 +0M0g_sk
96 Trip Point 跳变点 qcoTt~\
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ycrM8Mu
3
98 Under Voltage Lock Out (UVLO) 欠压锁定 ?pV!`vp^{
99 Voltage Reference 电压参考 Ub`vf4EB
100 voltage-second product 伏秒积 .Ix[&+LsY
101 zero-pole frequency compensation 零极点频率补偿 \Z_29L w=
102 beat frequency 拍频 y)b=7sU
103 one shots 单击电路 bdHHOpXM
104 scaling 缩放 j`%a2
105 ESR 等效串联电阻 [Page] ^=y%s
106 Ground 地电位 Wo~;h(6
107 trimmed bandgap 平衡带隙
BO'7c1FU
108 dropout voltage 压差 \I 7,1I
109 large bulk capacitance 大容量电容 ;+rcT;_^/
110 circuit breaker 断路器 U<wM#l
P|Z
111 charge pump 电荷泵 +O@|bd\
112 overshoot 过冲 Tb!jIe
Nq#B4Zx
印制电路printed circuit c. }#.-b8
印制线路 printed wiring j>Cp4
印制板 printed board d8&T62Dnd4
印制板电路 printed circuit board ->2m/d4a
印制线路板 printed wiring board Z
|<
印制元件 printed component cg^=F_h
印制接点 printed contact @gk{wh>c
印制板装配 printed board assembly &[kFl\
板 board F87c?Vh)K
刚性印制板 rigid printed board PBgU/zVn
挠性印制电路 flexible printed circuit R,m|+[sl
挠性印制线路 flexible printed wiring zG\:#,9
齐平印制板 flush printed board CwwZ~2
金属芯印制板 metal core printed board 0}WDB_L
金属基印制板 metal base printed board r\$`e7d}!
多重布线印制板 mulit-wiring printed board "/d
塑电路板 molded circuit board h/..cVD,K
散线印制板 discrete wiring board H.&"~eH
微线印制板 micro wire board tfVlIY<
积层印制板 buile-up printed board ~;0W
+
表面层合电路板 surface laminar circuit O8/r-?4.
埋入凸块连印制板 B2it printed board h}=
载芯片板 chip on board =L*-2cE6#
埋电阻板 buried resistance board d t^Hd]+^\
母板 mother board D(#6H~QN%
子板 daughter board ?7TuE!!M
背板 backplane !%/(a)B$^$
裸板 bare board h=dFSK?*D
键盘板夹心板 copper-invar-copper board G| qsJ
动态挠性板 dynamic flex board ]BfJ~+ N
静态挠性板 static flex board Pp`[E/
qj4
可断拼板 break-away planel a2B9
.;F
电缆 cable ex8}./mjJ
挠性扁平电缆 flexible flat cable (FFC) GB}!7W"
薄膜开关 membrane switch pV/5w<_x?
混合电路 hybrid circuit l4\ !J/df
厚膜 thick film ,e;_
Vb
厚膜电路 thick film circuit VbX$\Cs:
薄膜 thin film Qb' Q4@.
薄膜混合电路 thin film hybrid circuit ;OSEMgB1
互连 interconnection d^I:{Ii'
导线 conductor trace line na_Wp^;
齐平导线 flush conductor [FeN(8hGS
传输线 transmission line [@/s! i @
跨交 crossover Yduj3Ht:w
板边插头 edge-board contact R/l/GNm
增强板 stiffener /}nq?Vf
基底 substrate 9!s)52qt
基板面 real estate ?gG%FzfQ/
导线面 conductor side '}F..w/
元件面 component side e(vnnv?R{
焊接面 solder side &90pKs
导电图形 conductive pattern 5Vlm?mPU
非导电图形 non-conductive pattern fr8hT(,s)
基材 base material >w#&fd
层压板 laminate lKV7IoJ&;
覆金属箔基材 metal-clad bade material o_cAelI[!
覆铜箔层压板 copper-clad laminate (CCL)
scZ&}Ni
复合层压板 composite laminate Dw.Pv)'$
薄层压板 thin laminate )|KZGr
基体材料 basis material fkD-mRKw
预浸材料 prepreg `h<>_zpjY
粘结片 bonding sheet lhB;jE
预浸粘结片 preimpregnated bonding sheer rmPJid[8B~
环氧玻璃基板 epoxy glass substrate mX GW+
预制内层覆箔板 mass lamination panel F **/T
内层芯板 core material `Db%:l^e
粘结层 bonding layer U,Th-oU
粘结膜 film adhesive )TwA?kj
无支撑胶粘剂膜 unsupported adhesive film /~P4<1
覆盖层 cover layer (cover lay) E+~1GKd
增强板材 stiffener material fnK H<
铜箔面 copper-clad surface j){0>O.V
去铜箔面 foil removal surface 9eEA80i7
层压板面 unclad laminate surface +5H1n(6)
基膜面 base film surface Z._%T$8aJv
胶粘剂面 adhesive faec T 2Gscey
原始光洁面 plate finish xOKf|
粗面 matt finish M7//*Q'?
剪切板 cut to size panel =:m6ge@C&H
超薄型层压板 ultra thin laminate G@rV9
A阶树脂 A-stage resin 7e6;
|?
B阶树脂 B-stage resin Qk].^'\
C阶树脂 C-stage resin s(y=u >
环氧树脂 epoxy resin #xt-65^
酚醛树脂 phenolic resin _ECH(
聚酯树脂 polyester resin VF g"AJf
聚酰亚胺树脂 polyimide resin mw~$;64;a
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin ?y,z
丙烯酸树脂 acrylic resin }ssL;q
三聚氰胺甲醛树脂 melamine formaldehyde resin [y(<1]i-a
多官能环氧树脂 polyfunctional epoxy resin OD).kP}s^
溴化环氧树脂 brominated epoxy resin )No> Q :t
环氧酚醛 epoxy novolac ~2O1$o u
氟树脂 fluroresin v[<;z(7Qk
硅树脂 silicone resin qjf9ZD&
硅烷 silane ,AyQCUz{*?
聚合物 polymer h3MZLPe
无定形聚合物 amorphous polymer 2]+f<Z[/
结晶现象 crystalline polamer d#:7V%]dp
双晶现象 dimorphism HlXEU$e
共聚物 copolymer 3Cg0^~?6-
合成树脂 synthetic <+AvbqDe
热固性树脂 thermosetting resin [Page] t?h\Af4Tf
热塑性树脂 thermoplastic resin 'nfdOX.d
感光性树脂 photosensitive resin _"lW
环氧值 epoxy value :nxBM#:xu
双氰胺 dicyandiamide )uy2,`z
粘结剂 binder 4Vv$bbu+
胶粘剂 adesive $8fJ DN
固化剂 curing agent Qp~3DUM
阻燃剂 flame retardant 0>U7]wZKc
遮光剂 opaquer @}hdMVi
增塑剂 plasticizers %!OA/7XbG
不饱和聚酯 unsatuiated polyester "\rR0V!wA
聚酯薄膜 polyester >44,Dp]
聚酰亚胺薄膜 polyimide film (PI) InB'Ag"
聚四氟乙烯 polytetrafluoetylene (PTFE) b@9d@@/wx
增强材料 reinforcing material y
hNy
折痕 crease } /aqh ;W
云织 waviness zUz j
F
鱼眼 fish eye Sw~L
M&A
毛圈长 feather length ? ;$f"Wl
厚薄段 mark II{"6YI>
裂缝 split W"\O+
捻度 twist of yarn (RI+4V1
浸润剂含量 size content U]
av{}U
浸润剂残留量 size residue DUvF
处理剂含量 finish level LmjGU[L,@
偶联剂 couplint agent f|&,SI ?
断裂长 breaking length FXFyF*w2
吸水高度 height of capillary rise ejlau#8"
湿强度保留率 wet strength retention d5qGTT ~a
白度 whitenness XW BTBL
导电箔 conductive foil o*:D/"gb
铜箔 copper foil s@pIcNvx
压延铜箔 rolled copper foil "]x#kM
光面 shiny side 2\9OT>
粗糙面 matte side b^WF
R
处理面 treated side qw}.
QwPT
防锈处理 stain proofing 52' 0l>
双面处理铜箔 double treated foil D[<~^R;*
模拟 simulation 5 8gkE94
逻辑模拟 logic simulation QI6=[
电路模拟 circit simulation c>L#(D\\
时序模拟 timing simulation }/}eZCaG
模块化 modularization @8U8> 'zDE
设计原点 design origin oU)3du
优化(设计) optimization (design) pu
Z0_1uN
供设计优化坐标轴 predominant axis x1`zD*{
表格原点 table origin @_Es|(4
元件安置 component positioning #EIcP=1m4
比例因子 scaling factor s+6tdBvzs
扫描填充 scan filling ;6{{hc4
矩形填充 rectangle filling FUs57
V
填充域 region filling p%- m"u
实体设计 physical design cD]#6PFA
逻辑设计 logic design ~otV'= /my
逻辑电路 logic circuit 0"DS>:Ntk
层次设计 hierarchical design YAYwrKt
自顶向下设计 top-down design y{J7^o(_~
自底向上设计 bottom-up design &-p!Lg&D
费用矩阵 cost metrix QHw{@*
元件密度 component density $fQ'q3
自由度 degrees freedom M
nDaag
出度 out going degree YL9Tsw
入度 incoming degree A4f;ftB
曼哈顿距离 manhatton distance o5< w2(
欧几里德距离 euclidean distance CzG/=#IU
网络 network DXx),?s>
阵列 array {|R +|ow
段 segment 'Jl3%axR
逻辑 logic 9 N9Q#o$!.
逻辑设计自动化 logic design automation A5%cgr% 6
分线 separated time Vl0Y'@{
分层 separated layer Zl{DqC^
定顺序 definite sequence ~
ve
导线(通道) conduction (track) *KDwl<^A
导线(体)宽度 conductor width ZG1 {"J/z
导线距离 conductor spacing \vp^[,SI
导线层 conductor layer )C%S`d<%,
导线宽度/间距 conductor line/space \\$wg
第一导线层 conductor layer No.1 @S?D}myD
圆形盘 round pad Z]=9=S|
.4
方形盘 square pad .oz(,$CS"
菱形盘 diamond pad 1L<X+,]@
长方形焊盘 oblong pad q]OgT4ly
子弹形盘 bullet pad
4B'-tV
泪滴盘 teardrop pad }Fb966 $
雪人盘 snowman pad I_On0@%T5b
形盘 V-shaped pad V !l~3K(&4
环形盘 annular pad T*zy^we
非圆形盘 non-circular pad J|N>}di
隔离盘 isolation pad -|`E'b81
非功能连接盘 monfunctional pad *sq+ Vc(
偏置连接盘 offset land A&=`?4>
腹(背)裸盘 back-bard land <(B: "wI
盘址 anchoring spaur QS2~}{v
连接盘图形 land pattern H263<^
连接盘网格阵列 land grid array r9$7P?zm
孔环 annular ring YveNsn
元件孔 component hole X.JPM{]
安装孔 mounting hole Gkz~xQy1T
支撑孔 supported hole A3zO&4f
]
非支撑孔 unsupported hole U$T
(R2@
导通孔 via D]WU,a[$Bc
镀通孔 plated through hole (PTH) x).`nZ1
余隙孔 access hole T``~YoIdz
盲孔 blind via (hole) yNN_}9
埋孔 buried via hole <PXnR\
埋,盲孔 buried blind via J)_IfbY
任意层内部导通孔 any layer inner via hole 3k5F$wf
全部钻孔 all drilled hole j8{,u6w)-
定位孔 toaling hole 6D1tRo
无连接盘孔 landless hole Q)l~?Fx
中间孔 interstitial hole IC@-`S#F
无连接盘导通孔 landless via hole <!I^ xo[
引导孔 pilot hole vAo|o*
端接全隙孔 terminal clearomee hole ]|)M /U *
准尺寸孔 dimensioned hole [Page] C_
(s
在连接盘中导通孔 via-in-pad ,)P6fa/
孔位 hole location v#Y9O6g]T
孔密度 hole density c`4i#R
孔图 hole pattern +B-;.]L
T
钻孔图 drill drawing `~ {0
装配图assembly drawing il>XV>
参考基准 datum referan s14; \
1) 元件设备 &g\?znF]H
&Un^
_M
三绕组变压器:three-column transformer ThrClnTrans qlIbnyP<
双绕组变压器:double-column transformer DblClmnTrans bAm ,gP
电容器:Capacitor yB,{:kq7D
并联电容器:shunt capacitor IL N0/eH
电抗器:Reactor Ikj_
0/%F
母线:Busbar Z<n%~z^
输电线:TransmissionLine +hKH\]
发电厂:power plant 8i'EO6
断路器:Breaker (S#nA:E
刀闸(隔离开关):Isolator EJZb3
分接头:tap L(i0d[F
电动机:motor +5IC-=ZB
(2) 状态参数 f1}b;JJTsv
Yeb-u+23
有功:active power |_`wC
无功:reactive power M8iI e:{ c
电流:current =K\.YKT
容量:capacity gCc::[}\Y
电压:voltage #ysSfM6
档位:tap position g7nqe~`{
有功损耗:reactive loss Zi~-m]9U
无功损耗:active loss @8s:,Y_
功率因数:power-factor (DrDWD4_
功率:power $Hbd:1%i
{
功角:power-angle nPo YjQi
电压等级:voltage grade }_"<2|~_
空载损耗:no-load loss 8.R~Ys*
铁损:iron loss +^v]d_~w_
铜损:copper loss mzh7E[S_,i
空载电流:no-load current J|GEt@o3
阻抗:impedance YR}
P;
正序阻抗:positive sequence impedance RFqf$
负序阻抗:negative sequence impedance tOf18V{a
零序阻抗:zero sequence impedance }iCcXZ&5^
电阻:resistor 0-a[[hL?
电抗:reactance Y<oDv`aZ0
电导:conductance &fuJ%
电纳:susceptance vynchZ+g]
无功负载:reactive load 或者QLoad e#jkp'
有功负载: active load PLoad *{e?%!Q
遥测:YC(telemetering) 5u3SP?.&
遥信:YX o?\v
8.n
励磁电流(转子电流):magnetizing current )/2J|LxS
定子:stator Af%#&r7W
功角:power-angle nt*nTtcE
上限:upper limit 4ZN&Yf`
下限:lower limit m? #J`?E
并列的:apposable :ncR7:Z
高压: high voltage jVhfpS[
低压:low voltage
;'g.%
中压:middle voltage {s/u[T_D2
电力系统 power system `lA[-x~
发电机 generator ); <Le6
励磁 excitation iS%md
励磁器 excitor ^~:&/ 0
电压 voltage 1}"PLq(
电流 current pJpTOq\h
母线 bus W
n43TSs-
变压器 transformer ?}g#Mc
升压变压器 step-up transformer `zZGL&9m`
高压侧 high side ELWm>'Q#9
输电系统 power transmission system iAAlld1
输电线 transmission line AJ`R2
$
固定串联电容补偿fixed series capacitor compensation }qhNz0*
稳定 stability vx&jI$t8
电压稳定 voltage stability hd E? %A
功角稳定 angle stability CF?TW
暂态稳定 transient stability ?()$imb*
电厂 power plant -WX{y Ci
能量输送 power transfer Wk"\aoX"E
交流 AC hXE_OXZ
装机容量 installed capacity C@8WY
电网 power system UPI'O %
落点 drop point |Q _]+[
开关站 switch station [)&(zJHX
双回同杆并架 double-circuit lines on the same tower z8"(Yy7m
变电站 transformer substation RU'
WHk
补偿度 degree of compensation Q:4euhz*
高抗 high voltage shunt reactor yF#:*Vz>
无功补偿 reactive power compensation lx!9KQAM*
故障 fault `p.O
调节 regulation c8
xZT
裕度 magin s[HQq;S
三相故障 three phase fault 8aSH0dX
故障切除时间 fault clearing time VP<_~OLc
极限切除时间 critical clearing time |GQFNrNx
切机 generator triping p*^[
~} N
高顶值 high limited value zw yK \j
强行励磁 reinforced excitation a#qC.,$A
线路补偿器 LDC(line drop compensation) sb7~sa&-
机端 generator terminal GG@&jcp7
静态 static (state) 5yhfCe m|
动态 dynamic (state) Q41eYzAi
单机无穷大系统 one machine - infinity bus system X+*"FKm S.
机端电压控制 AVR C"We>!
电抗 reactance Q]u*Oels
电阻 resistance WF.y"{6>
功角 power angle ys3&$G
有功(功率) active power jPjFp35;zb
无功(功率) reactive power $M(ZKS3,j
功率因数 power factor n #|p R2
无功电流 reactive current HP
/@ _qk
下降特性 droop characteristics vV?=r5j
斜率 slope B[I
a8t
额定 rating xqua>!mqS
变比 ratio BP7&wd
参考值 reference value 4X5Tyv(Dp
电压互感器 PT l{7q(
分接头 tap Ao:<aX,=
下降率 droop rate ^?5[M^
仿真分析 simulation analysis 9z:P#=Q:
传递函数 transfer function C6 XZZ
框图 block diagram xfE:r:
受端 receive-side pd[?TyVK;
裕度 margin 9Xu
O\+z
同步 synchronization ;U^7]JO;
失去同步 loss of synchronization zoU-*Rs6
阻尼 damping
V_SZp8
摇摆 swing e"sz jY~V
保护断路器 circuit breaker : Nf-}"
电阻:resistance ^,$>z*WQ.
电抗:reactance yE \dv)(<
阻抗:impedance f~LM-7!zf}
电导:conductance XSu9C zx&I
电纳:susceptance