1 backplane 背板 `I>K?
2 Band gap voltage reference 带隙电压参考 xs I/DW
3 benchtop supply 工作台电源 :]^P^khK
4 Block Diagram 方块图 5 Bode Plot 波特图 pG( knu
6 Bootstrap 自举 w&"w"
7 Bottom FET Bottom FET zn
?;>Bl
8 bucket capcitor 桶形电容 Y+
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9 chassis 机架 @."o:K
10 Combi-sense Combi-sense &a=e=nR5
11 constant current source 恒流源 iW}l[g8sw!
12 Core Sataration 铁芯饱和 1D[P\r-
13 crossover frequency 交叉频率 ij i.3-
14 current ripple 纹波电流 <s>/< kW:
15 Cycle by Cycle 逐周期 -k
<9v.:
16 cycle skipping 周期跳步 Kyp0SZp[
17 Dead Time 死区时间 oe|e+
18 DIE Temperature 核心温度 dn\F!
19 Disable 非使能,无效,禁用,关断 NoO+xLHw8
20 dominant pole 主极点 -z0{\=@#m
21 Enable 使能,有效,启用 /plUzy2Yu
22 ESD Rating ESD额定值 F!&pENQ
23 Evaluation Board 评估板 ,imvA5
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. L{LU@.;1
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ~J-|,ZMd
25 Failling edge 下降沿 /HuYduGdP
26 figure of merit 品质因数 }#G"!/ZA0:
27 float charge voltage 浮充电压 &U~r}=
28 flyback power stage 反驰式功率级 uT} TSwgp
29 forward voltage drop 前向压降 T#n1@FgC
30 free-running 自由运行 vif8{S
31 Freewheel diode 续流二极管 kr(<Y|
32 Full load 满负载 33 gate drive 栅极驱动 OJsd[l3xR
34 gate drive stage 栅极驱动级 PGPbpl&\t
35 gerber plot Gerber 图 `f+8WPJPZ
36 ground plane 接地层 n<:d%&^n
37 Henry 电感单位:亨利 =/g$bZ
38 Human Body Model 人体模式 Yc82vSG'
39 Hysteresis 滞回 e$EF% cKH
40 inrush current 涌入电流 EotwUT|
41 Inverting 反相 @ 9 {%Kn
42 jittery 抖动 {?/8jCVd
43 Junction 结点 ~$4.Mf,u
44 Kelvin connection 开尔文连接 em1cc,
45 Lead Frame 引脚框架 U>_IYT
46 Lead Free 无铅 l^!A
47 level-shift 电平移动 i6md fp|k
48 Line regulation 电源调整率 ?JgO-.
49 load regulation 负载调整率 aw/7Z`
50 Lot Number 批号 "Ug/
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51 Low Dropout 低压差 >4/L-y+
52 Miller 密勒 53 node 节点 .ts0LDk0f
54 Non-Inverting 非反相 tP`G]BCbt
55 novel 新颖的 }@14E-N=
56 off state 关断状态 'q92E(
57 Operating supply voltage 电源工作电压 u\XkXS`
58 out drive stage 输出驱动级 lU$4NUwM
59 Out of Phase 异相 gr>o
E#7
60 Part Number 产品型号 M%&A.j[
61 pass transistor pass transistor +`*qlP;
62 P-channel MOSFET P沟道MOSFET 4Oy.,MDQP
63 Phase margin 相位裕度 RM&H!E<#
64 Phase Node 开关节点 \-
=^]]b=
65 portable electronics 便携式电子设备 R3j#WgltP
66 power down 掉电 @0z0m;8
67 Power Good 电源正常 ov`^o25f
68 Power Groud 功率地 JOrELrMx
69 Power Save Mode 节电模式 !ww:O| 0
70 Power up 上电 ahNX/3;y
71 pull down 下拉 LZr0]g{Pu/
72 pull up 上拉 %o@['9U[j
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) UZje>.~?
74 push pull converter 推挽转换器 /o~qC<7
75 ramp down 斜降 TCHqe19?
76 ramp up 斜升 9zZ5Lr^21
77 redundant diode 冗余二极管 Fm<jg}>MAd
78 resistive divider 电阻分压器 s:+HRJD|
79 ringing 振 铃 RCBf;$O
80 ripple current 纹波电流 U~:N^Sc
81 rising edge 上升沿 o_Jn_3=
82 sense resistor 检测电阻 lt{lpH
83 Sequenced Power Supplys 序列电源 Y=vVxVI\
84 shoot-through 直通,同时导通 R"U/RS
85 stray inductances. 杂散电感 XM6".eF)M
86 sub-circuit 子电路 vi]r
87 substrate 基板 *jM_ wwG
88 Telecom 电信 =db'#m{$
89 Thermal Information 热性能信息 C8IkpAD
90 thermal slug 散热片 M{?zvq?d
91 Threshold 阈值 ,3Wb4so
92 timing resistor 振荡电阻 b7B+eN ?z
93 Top FET Top FET E X%6''ys
94 Trace 线路,走线,引线 TB7>s~)47E
95 Transfer function 传递函数 0]AN;
96 Trip Point 跳变点 4q>7OB:e
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) {=UFk-$=
98 Under Voltage Lock Out (UVLO) 欠压锁定 fdlvn*H
99 Voltage Reference 电压参考 6'xomRpYN
100 voltage-second product 伏秒积 5D,.^a1 A
101 zero-pole frequency compensation 零极点频率补偿 #D+7TWDwNt
102 beat frequency 拍频 -S"5{ N73
103 one shots 单击电路 @#RuSc
104 scaling 缩放 0b/ir 2
105 ESR 等效串联电阻 [Page] I eG=J4:*
106 Ground 地电位 M|\^UF2e
107 trimmed bandgap 平衡带隙 U1ZIuDg'E
108 dropout voltage 压差 OT%0{2c"]
109 large bulk capacitance 大容量电容 1T ( u
110 circuit breaker 断路器 s\[LpLt
111 charge pump 电荷泵 .VT;H1#
112 overshoot 过冲 *YWk1Cwjo
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印制电路printed circuit ypx: )e"/
印制线路 printed wiring qgoJ4Z*
印制板 printed board xfjd5J7'
印制板电路 printed circuit board NJtQx2Sd'H
印制线路板 printed wiring board ^ eQFg>
印制元件 printed component F{<5aLaYti
印制接点 printed contact ? ^M
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印制板装配 printed board assembly {esJ=FV\
板 board 5?WYsj"
刚性印制板 rigid printed board 33Jd!orXU
挠性印制电路 flexible printed circuit bEm7QgV{X
挠性印制线路 flexible printed wiring /<);=&[
齐平印制板 flush printed board "~F3*lk#E
金属芯印制板 metal core printed board 7R}9oK_I
金属基印制板 metal base printed board 4({(i
多重布线印制板 mulit-wiring printed board ,`k_|//}=
塑电路板 molded circuit board RK[D_SmS
散线印制板 discrete wiring board lVz9k
微线印制板 micro wire board `vd= ec
积层印制板 buile-up printed board <$%X<sDkq
表面层合电路板 surface laminar circuit ! QM.P
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埋入凸块连印制板 B2it printed board DAfyK?+UL
载芯片板 chip on board MJ`N,E[
埋电阻板 buried resistance board UXT
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母板 mother board )VSwTx&
子板 daughter board aSC9&Nf;
背板 backplane Lxv6!?v|
裸板 bare board +oI3I~
键盘板夹心板 copper-invar-copper board Q8T`wd$D#
动态挠性板 dynamic flex board <a4TO8
静态挠性板 static flex board #] CFA9z
可断拼板 break-away planel {:Aw_z:'
电缆 cable 5G(3vRX|1
挠性扁平电缆 flexible flat cable (FFC) !gF9k8\Yr$
薄膜开关 membrane switch )=J5\3O*x
混合电路 hybrid circuit )KE[!ofD
厚膜 thick film ~e `Bq>
厚膜电路 thick film circuit $Az^Y0[D
薄膜 thin film -'`TL$
薄膜混合电路 thin film hybrid circuit $<nCXVqL,
互连 interconnection \ \06T`
导线 conductor trace line S4N(cn&
齐平导线 flush conductor oRM)%N#
传输线 transmission line j~E",7Q'
跨交 crossover ?^i1_v7 Bi
板边插头 edge-board contact -`+<{NHv\
增强板 stiffener k1^\|
基底 substrate DZ$`
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基板面 real estate P?LlJ5hn
导线面 conductor side j'?7D0>
元件面 component side mj&57D\fq
焊接面 solder side Bj Wr5SJ
导电图形 conductive pattern :XG;ru%i
非导电图形 non-conductive pattern =PkO!Mm8
基材 base material zce`\ /:
层压板 laminate JTU#vq:TY
覆金属箔基材 metal-clad bade material *T`-|H*6@
覆铜箔层压板 copper-clad laminate (CCL) S?ujRp
复合层压板 composite laminate ~YP Jez
薄层压板 thin laminate &Lm-()wb
基体材料 basis material |TsE-t*E}
预浸材料 prepreg 2f>PO +4S{
粘结片 bonding sheet 2 PqS%`XiS
预浸粘结片 preimpregnated bonding sheer G(iJi
环氧玻璃基板 epoxy glass substrate
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预制内层覆箔板 mass lamination panel gU&%J4O
内层芯板 core material j}1zdA
粘结层 bonding layer D&G"BZx|
粘结膜 film adhesive P 1XK*GZ
无支撑胶粘剂膜 unsupported adhesive film Z[Qza13lo
覆盖层 cover layer (cover lay) %FZ2xyI.
增强板材 stiffener material 2I/xJ+
铜箔面 copper-clad surface %" D%:
去铜箔面 foil removal surface 6$U]9D
层压板面 unclad laminate surface t5B7I59
基膜面 base film surface <TGn=>u
胶粘剂面 adhesive faec hR#-u1C
原始光洁面 plate finish e~l#4{w
粗面 matt finish
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剪切板 cut to size panel VU`OO$,W
超薄型层压板 ultra thin laminate oA] KE"T
A阶树脂 A-stage resin sRSz}]
B阶树脂 B-stage resin 7hP<f}xL
C阶树脂 C-stage resin k%s_0
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环氧树脂 epoxy resin =m89z}Ot
酚醛树脂 phenolic resin #Z+i~t{e(
聚酯树脂 polyester resin r;BT,jiX
聚酰亚胺树脂 polyimide resin ~{hxR)x9
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin K6/@]y%Wr
丙烯酸树脂 acrylic resin Q?b14]6im
三聚氰胺甲醛树脂 melamine formaldehyde resin :W#rhuzC
多官能环氧树脂 polyfunctional epoxy resin YB<*"HxM)}
溴化环氧树脂 brominated epoxy resin fmqb`%
环氧酚醛 epoxy novolac C+[%7vF1
氟树脂 fluroresin C%d_@*82
硅树脂 silicone resin }KUd7[s
硅烷 silane k.<]4iS
聚合物 polymer }%b;vzkG5
无定形聚合物 amorphous polymer "Z
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结晶现象 crystalline polamer @NhvnfZ
双晶现象 dimorphism 9.'h^#C
共聚物 copolymer '* mH*?Y
合成树脂 synthetic ,}oM-B
热固性树脂 thermosetting resin [Page] A?_ =K
热塑性树脂 thermoplastic resin S/|,u`g-
感光性树脂 photosensitive resin NBl+_/2'w
环氧值 epoxy value Q!-
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双氰胺 dicyandiamide v+p{|X-
粘结剂 binder E_Z{6&r
胶粘剂 adesive fjvN$NgVs
固化剂 curing agent hfpJ+[
阻燃剂 flame retardant dS^T$sz.co
遮光剂 opaquer EA ]+vq
增塑剂 plasticizers %CWPbk^
不饱和聚酯 unsatuiated polyester s { #3r
聚酯薄膜 polyester
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聚酰亚胺薄膜 polyimide film (PI) XE^)VLH:
聚四氟乙烯 polytetrafluoetylene (PTFE) U*90m~)
增强材料 reinforcing material 8.F~k~srA
折痕 crease DZzN>9<)^
云织 waviness hxce\OuU0h
鱼眼 fish eye mF` B#
毛圈长 feather length (c0A.L)
厚薄段 mark W3`>8v1?o
裂缝 split 21k5I #U
捻度 twist of yarn fXrXV~'8
浸润剂含量 size content 6'\6OsH
浸润剂残留量 size residue ),%6V5a+E
处理剂含量 finish level %$%&m1Y
偶联剂 couplint agent h -iJlm
断裂长 breaking length +`3!I
吸水高度 height of capillary rise Gt9&)/#
湿强度保留率 wet strength retention 9x,RvWTb
白度 whitenness ^C2\`jLMY
导电箔 conductive foil [+O"<Ua
铜箔 copper foil \*=7#Vd
压延铜箔 rolled copper foil ge]STSM0n7
光面 shiny side y%
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粗糙面 matte side '_|h6<.k[
处理面 treated side L^Jk=8
防锈处理 stain proofing pp9Zb.D\
双面处理铜箔 double treated foil N0#JOu}~
模拟 simulation %,+leKs
逻辑模拟 logic simulation d)~Fmi;
电路模拟 circit simulation C8F 7bG8c
时序模拟 timing simulation kdGT{2u
模块化 modularization s-dLZ.9F
设计原点 design origin ^>"z@$|\:
优化(设计) optimization (design) <&)v~-&O
供设计优化坐标轴 predominant axis &89oO@5
表格原点 table origin 1S@vGq}
元件安置 component positioning {Zp\^/
比例因子 scaling factor )BRKZQN
扫描填充 scan filling 1sYEZO;
矩形填充 rectangle filling GF3/ RT9
填充域 region filling ~'R(2[L!;
实体设计 physical design &=4(l|wcg
逻辑设计 logic design ~|<m,)!
逻辑电路 logic circuit ,o]4?-
层次设计 hierarchical design >>[G1
自顶向下设计 top-down design ou
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自底向上设计 bottom-up design 7RZh<