1 backplane 背板 zDyeAxh4
2 Band gap voltage reference 带隙电压参考 k+$4?/A
3 benchtop supply 工作台电源 x
5Dt5Yp"o
4 Block Diagram 方块图 5 Bode Plot 波特图 5R `6zhf
6 Bootstrap 自举 >-lL-%N_
7 Bottom FET Bottom FET v6?\65w,|
8 bucket capcitor 桶形电容 OeGuq.>w
9 chassis 机架 xm5FQ) T
10 Combi-sense Combi-sense P&0cF{
11 constant current source 恒流源 [V,
;X
12 Core Sataration 铁芯饱和 lMez!qx,=
13 crossover frequency 交叉频率 ' u};z:t
14 current ripple 纹波电流 #.+*G`m
15 Cycle by Cycle 逐周期 jA4v?(AO}#
16 cycle skipping 周期跳步 b^DV9mO4J
17 Dead Time 死区时间 G@EjWZQ
18 DIE Temperature 核心温度 l0\>zWLZZ9
19 Disable 非使能,无效,禁用,关断 -#;VFSz,9*
20 dominant pole 主极点 V)QR!4De
21 Enable 使能,有效,启用 ( L\G!pP.
22 ESD Rating ESD额定值 BON""yIC
23 Evaluation Board 评估板 3dDQz#
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. F>kn:I"X)
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 S aet";pf`
25 Failling edge 下降沿 G>S1Ld'MV
26 figure of merit 品质因数 |uwteG5?$s
27 float charge voltage 浮充电压 n3g
WMC
28 flyback power stage 反驰式功率级 OXX(OCG>
29 forward voltage drop 前向压降 j_uY8c>3\q
30 free-running 自由运行 Z?v6pjZ?
31 Freewheel diode 续流二极管
e=)*O
32 Full load 满负载 33 gate drive 栅极驱动 n;^k
34 gate drive stage 栅极驱动级 ,
gr&s+
35 gerber plot Gerber 图 k,iV$,[TF
36 ground plane 接地层 :'rZZeb'
37 Henry 电感单位:亨利 F"f}vl
38 Human Body Model 人体模式 ?Wz(f {Hm
39 Hysteresis 滞回 7K]U|K#
40 inrush current 涌入电流 |DPpp/
41 Inverting 反相 X:-bAu}D
42 jittery 抖动 }:l%,DBw
43 Junction 结点 +6)kX4
44 Kelvin connection 开尔文连接 %%,hR'+|
45 Lead Frame 引脚框架 p F*~)e
46 Lead Free 无铅 hPi
:31-0
47 level-shift 电平移动 i
=fOdp
48 Line regulation 电源调整率 t2%@py*bU
49 load regulation 负载调整率 _KhEwd
50 Lot Number 批号 'j<:FUDJ
51 Low Dropout 低压差 ^_S-s\DW
52 Miller 密勒 53 node 节点 f+aS2k(e>
54 Non-Inverting 非反相 9 c5G6n0
55 novel 新颖的 =']};
56 off state 关断状态 8j+:s\
57 Operating supply voltage 电源工作电压 p9 ,\ {Is
58 out drive stage 输出驱动级 sEJ;t0.LX
59 Out of Phase 异相 3G/ mB
60 Part Number 产品型号 b}*@=X=4o
61 pass transistor pass transistor Y=Ar3O*F
62 P-channel MOSFET P沟道MOSFET yZ~eLWz
63 Phase margin 相位裕度 5nM9!A\D
64 Phase Node 开关节点 CbH T #
65 portable electronics 便携式电子设备 %=mwOoMk0L
66 power down 掉电 ic{.#R.BY
67 Power Good 电源正常 Gg pQ]rw
68 Power Groud 功率地 D7_Hu'y<o
69 Power Save Mode 节电模式 IU'!?XVo
70 Power up 上电 (zw=qbS&
71 pull down 下拉 voej ~z+
72 pull up 上拉 PxVI{:Uz
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ;GgQ@s@
74 push pull converter 推挽转换器 Yx}"> ;\
75 ramp down 斜降 #nf%ojh
76 ramp up 斜升 Dss/>!
mN
77 redundant diode 冗余二极管 ^I0GZG
78 resistive divider 电阻分压器 EO9kE.g
79 ringing 振 铃 <j1d~XU}
80 ripple current 纹波电流 lfpt:5a9&
81 rising edge 上升沿
Eagmafu
82 sense resistor 检测电阻 tp0!,ne*
83 Sequenced Power Supplys 序列电源 <;,S"e
84 shoot-through 直通,同时导通 N} x/&e
85 stray inductances. 杂散电感 &b@!DAwAJ
86 sub-circuit 子电路 qvfAG 0p
87 substrate 基板 Ubw!/|mi
88 Telecom 电信 ?<yq 2`\4O
89 Thermal Information 热性能信息 Puth8$
90 thermal slug 散热片 [>M*_1F
91 Threshold 阈值 djy:
92 timing resistor 振荡电阻 N9JgV,`
93 Top FET Top FET */5<L99v
94 Trace 线路,走线,引线 ofPF}
95 Transfer function 传递函数 ?;r8SowZ7
96 Trip Point 跳变点 DtJTnvG~B
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) QC\g%MVG
98 Under Voltage Lock Out (UVLO) 欠压锁定 \A3>c|
99 Voltage Reference 电压参考 spSN6.j
100 voltage-second product 伏秒积 H ?=pWB
101 zero-pole frequency compensation 零极点频率补偿 Gkodk[VuLs
102 beat frequency 拍频 k}f<'g<H
103 one shots 单击电路 L%o6 5
104 scaling 缩放 RZ<+AX9R
105 ESR 等效串联电阻 [Page] j_6` s!Yw
106 Ground 地电位 ]lB3qEn<
107 trimmed bandgap 平衡带隙 B~_,>WG
108 dropout voltage 压差 mOz&6T<|
109 large bulk capacitance 大容量电容 5}d/8tS
110 circuit breaker 断路器 HV$9b~(
111 charge pump 电荷泵 lEyG9Xvi
112 overshoot 过冲 |B1;l<|`
/50g3?X,
印制电路printed circuit l#5~t|\
印制线路 printed wiring _,Rsl$Tk'
印制板 printed board =mi:<q
印制板电路 printed circuit board S`W'G&bCj
印制线路板 printed wiring board VT5cxB<
印制元件 printed component #A|D\IhF
印制接点 printed contact lZS_n9Sc
印制板装配 printed board assembly Xew1LPI
板 board Hlt8al3
刚性印制板 rigid printed board n2jvXLJq
挠性印制电路 flexible printed circuit ax72e hL}
挠性印制线路 flexible printed wiring 0U~;%N+lv
齐平印制板 flush printed board j5,^9'
金属芯印制板 metal core printed board D 8@nkSP
金属基印制板 metal base printed board {XDY:`vZ}
多重布线印制板 mulit-wiring printed board {w |dM#
塑电路板 molded circuit board hr_9;,EPh
散线印制板 discrete wiring board :~ZqB\>i
微线印制板 micro wire board *gM,x4 Y
积层印制板 buile-up printed board jIx8k8
表面层合电路板 surface laminar circuit ;LQ# *NjL\
埋入凸块连印制板 B2it printed board w PG1P'w;
载芯片板 chip on board Ss#@=:"P
埋电阻板 buried resistance board d%#!nq{vd
母板 mother board "'z,[v50&
子板 daughter board wDT>">&d
背板 backplane .)"_Q/q
裸板 bare board 9lZAa8Rx i
键盘板夹心板 copper-invar-copper board E(QZ!'%K+m
动态挠性板 dynamic flex board @)W(q5)}9"
静态挠性板 static flex board =9qGEkd3
可断拼板 break-away planel z.2r@Psk
电缆 cable |+Hp+9J
挠性扁平电缆 flexible flat cable (FFC) :mXGIRi
薄膜开关 membrane switch [K cki+
混合电路 hybrid circuit "*++55
厚膜 thick film T~i%j@Q.6
厚膜电路 thick film circuit W>5vRwx00
薄膜 thin film AW,v
薄膜混合电路 thin film hybrid circuit [%j?.N
互连 interconnection ^CZCZ,v
导线 conductor trace line c;:">NR
齐平导线 flush conductor (O)\#%,@R
传输线 transmission line gk!E$NyE
跨交 crossover v229H<
板边插头 edge-board contact B ~fSMB6h
增强板 stiffener B :.@Qi^
基底 substrate }xAie(
基板面 real estate 0bMoUy*q
导线面 conductor side q"gqO%Wb|
元件面 component side EMVk:Vt]
焊接面 solder side _GVE^yW~z
导电图形 conductive pattern A}t %;V2
非导电图形 non-conductive pattern A6Ghj{~
基材 base material o&(wg(Rv
层压板 laminate YBb)/ZghY
覆金属箔基材 metal-clad bade material z$JX'(<Z7
覆铜箔层压板 copper-clad laminate (CCL) QWrIa1.JC
复合层压板 composite laminate LHs-&
薄层压板 thin laminate J|VK P7
基体材料 basis material 2
;JQX!
预浸材料 prepreg Ye9Y^+-
粘结片 bonding sheet c_
La^HS
预浸粘结片 preimpregnated bonding sheer ShQ|{P9
环氧玻璃基板 epoxy glass substrate ?Bo?JMV
预制内层覆箔板 mass lamination panel nz4<pvC,*
内层芯板 core material 0cHfxy3
粘结层 bonding layer sX+`wc
粘结膜 film adhesive ;{|X,;s
无支撑胶粘剂膜 unsupported adhesive film ;Vg^!]LL#
覆盖层 cover layer (cover lay) t)YUPDQ@J
增强板材 stiffener material rh@r\H@j
铜箔面 copper-clad surface #
;K,,ku
x
去铜箔面 foil removal surface RFw(]o,9cR
层压板面 unclad laminate surface sLb8*fak
基膜面 base film surface H&M1>JtE
胶粘剂面 adhesive faec lC0~c=?J
原始光洁面 plate finish !; IJ
粗面 matt finish U^MuZ
剪切板 cut to size panel ]eE 1n2
超薄型层压板 ultra thin laminate 3KSpB;HX
A阶树脂 A-stage resin JIzY,%`\
B阶树脂 B-stage resin 6?N4l ]l
C阶树脂 C-stage resin v?L
环氧树脂 epoxy resin KU-'+k2s;p
酚醛树脂 phenolic resin j&5G\6:
聚酯树脂 polyester resin ((XE\V\}Z
聚酰亚胺树脂 polyimide resin 089 k.WG
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin LheFQ A
丙烯酸树脂 acrylic resin k<H%vg>{~s
三聚氰胺甲醛树脂 melamine formaldehyde resin aX;A==>
多官能环氧树脂 polyfunctional epoxy resin 1BJ<m5/1%
溴化环氧树脂 brominated epoxy resin av-#)E
环氧酚醛 epoxy novolac @}Zd (o
氟树脂 fluroresin |( G2K'Ab
硅树脂 silicone resin MaO"#{i
硅烷 silane ',7a E@PJ
聚合物 polymer ^i+[m
无定形聚合物 amorphous polymer @Br
{!#Wf
结晶现象 crystalline polamer N2BI_,hI1
双晶现象 dimorphism k;k}qq`d
共聚物 copolymer Zb(E:~h\
合成树脂 synthetic FZF @
热固性树脂 thermosetting resin [Page] W^es;5
热塑性树脂 thermoplastic resin r`jWp\z
感光性树脂 photosensitive resin !;S"&mcPDJ
环氧值 epoxy value 5Fmav5
双氰胺 dicyandiamide )tS-.P rA-
粘结剂 binder kbYeV_OwM
胶粘剂 adesive rEdY>\'
固化剂 curing agent b O=yi)
阻燃剂 flame retardant Z<U>A
遮光剂 opaquer S,''>`w
增塑剂 plasticizers 7{e=="#*
不饱和聚酯 unsatuiated polyester iXFP5a>|
聚酯薄膜 polyester }u%"$[I}
聚酰亚胺薄膜 polyimide film (PI) ySe$4deJ
聚四氟乙烯 polytetrafluoetylene (PTFE) o:"anHs
增强材料 reinforcing material j(eFoZz,
折痕 crease D'b#,a;V
云织 waviness $d/&k`
鱼眼 fish eye er2cQS7R
毛圈长 feather length 06 i;T~Y
厚薄段 mark \}5p0.=
裂缝 split `pL^}_>|GM
捻度 twist of yarn 7AwgJb hn
浸润剂含量 size content m}3gZu]
浸润剂残留量 size residue .$!{-v[
处理剂含量 finish level `]=oo%(h
偶联剂 couplint agent \L # INP4~
断裂长 breaking length G_ >G'2
吸水高度 height of capillary rise AQss4[\Dx
湿强度保留率 wet strength retention P:C2G(V1AR
白度 whitenness AVl~{k|
导电箔 conductive foil !2tW$BP^
铜箔 copper foil $g10vF3
压延铜箔 rolled copper foil L?5f+@0.
光面 shiny side + H_WlYg-
粗糙面 matte side 3QXjD/h
处理面 treated side OtTBErQNF
防锈处理 stain proofing 2;$k(x]
双面处理铜箔 double treated foil !TKkec8$
模拟 simulation usFfMF X
逻辑模拟 logic simulation ~+G#n"P n
电路模拟 circit simulation c~=B0K-
时序模拟 timing simulation ?F7o!B
模块化 modularization rJJ[X4$
设计原点 design origin MFt*&%,JX
优化(设计) optimization (design) 71fk.16
供设计优化坐标轴 predominant axis W_`A"WdT.
表格原点 table origin -nbMTY}
元件安置 component positioning 1L nyWZ
比例因子 scaling factor |Ic`,>XM
扫描填充 scan filling DgHaOAdU
矩形填充 rectangle filling p\p\q(S">
填充域 region filling &?,6~qm[
实体设计 physical design FLZWZ;
逻辑设计 logic design )$Mmn
逻辑电路 logic circuit "O[j!fG8,
层次设计 hierarchical design I$t3qd{H&
自顶向下设计 top-down design #A7jyg":
自底向上设计 bottom-up design &HW1mNF9
费用矩阵 cost metrix ZR0r>@M3v<
元件密度 component density 1oLv.L
自由度 degrees freedom E.`U`L
出度 out going degree A{ eL l
入度 incoming degree )~J>X{hy
曼哈顿距离 manhatton distance Ih}1%Jq
欧几里德距离 euclidean distance V'Kgdj
网络 network <A5]]{9 +
阵列 array H)w(q^i
段 segment >EsziRm
逻辑 logic fBn"kr;
逻辑设计自动化 logic design automation l_tw<`Ep
分线 separated time DQ#H,\^<
分层 separated layer ;<
jbLhHwD
定顺序 definite sequence $~0Q@):
导线(通道) conduction (track) 4+$b~u
导线(体)宽度 conductor width U9y|>P\)T
导线距离 conductor spacing /cr}N%HZB
导线层 conductor layer D]a:@x`+Bz
导线宽度/间距 conductor line/space N,dT3we
第一导线层 conductor layer No.1 WEg6Kz
圆形盘 round pad 3.d"rl
方形盘 square pad }9HmTr|
菱形盘 diamond pad 6lwta`2
长方形焊盘 oblong pad D4Al3fe
子弹形盘 bullet pad =]`lN-rYw
泪滴盘 teardrop pad 7?8wyk|x
雪人盘 snowman pad w%AcG~`j!B
形盘 V-shaped pad V T<3BT
环形盘 annular pad '^BV_ QQ
非圆形盘 non-circular pad H=*5ASc
隔离盘 isolation pad aprm0:Q^
非功能连接盘 monfunctional pad U[L9*=P;
偏置连接盘 offset land u]NZ`t%AP
腹(背)裸盘 back-bard land bzDIhnw
盘址 anchoring spaur =gfI!w
连接盘图形 land pattern Ho DVn/lr
连接盘网格阵列 land grid array uwf
5!Z:>
孔环 annular ring n+@F`]Ke
元件孔 component hole H1GRMDNXOA
安装孔 mounting hole D4eTTfQ
支撑孔 supported hole wbDM5%
非支撑孔 unsupported hole '{I_\~*
导通孔 via FGO[
|]7IN
镀通孔 plated through hole (PTH) p.}Ls)I
余隙孔 access hole ^,l_{
盲孔 blind via (hole) |Fm6#1A@
埋孔 buried via hole \^( 0B8|w
埋,盲孔 buried blind via NNhL*C[_7
任意层内部导通孔 any layer inner via hole >3 yk#U|7}
全部钻孔 all drilled hole 2?m.45`
定位孔 toaling hole @`tXKP$so
无连接盘孔 landless hole |@ ,|F:h<M
中间孔 interstitial hole H>9CW<8
无连接盘导通孔 landless via hole `l2O?U -@
引导孔 pilot hole QB.J,o*XD4
端接全隙孔 terminal clearomee hole -<jL~][S
准尺寸孔 dimensioned hole [Page] C%*k.$#r!
在连接盘中导通孔 via-in-pad Om{l>24i.\
孔位 hole location {3})=>u:S
孔密度 hole density L9pvG(R%
孔图 hole pattern l4n)#?Q?
钻孔图 drill drawing qq)0yyL r
装配图assembly drawing m)V/L]4
参考基准 datum referan AL$&|=C-$
1) 元件设备 !D!~^\
?USQlnr:R/
三绕组变压器:three-column transformer ThrClnTrans q-nSLE+_;
双绕组变压器:double-column transformer DblClmnTrans @
'@:sM_
电容器:Capacitor ]yjl~3
并联电容器:shunt capacitor syU9O&<
电抗器:Reactor m}>F<;hQ
母线:Busbar {t};-q!v$j
输电线:TransmissionLine A:(*y
2
发电厂:power plant eC5 $#,HiC
断路器:Breaker 6wco&7
刀闸(隔离开关):Isolator | mu+9
分接头:tap y_xnai
电动机:motor *[=bR>
(2) 状态参数 r kiT1YTY
n wI!O
有功:active power yj4+5`|f
无功:reactive power ?+T^O?r|O
电流:current ^(viM?*
容量:capacity *6xgctk
电压:voltage {3N'D2N
档位:tap position %OgS^_tu
有功损耗:reactive loss @HZKc\1
无功损耗:active loss E}%hz*Q)(
功率因数:power-factor uEc<}pV
功率:power $gBd <N9|c
功角:power-angle Y(.OF
Q
电压等级:voltage grade .z13 =yv
空载损耗:no-load loss :eo
铁损:iron loss ~=R SKyzt
铜损:copper loss Ltjbxw"Qd
空载电流:no-load current NEa>\K<\
阻抗:impedance 9&RFO$WH
正序阻抗:positive sequence impedance FI"`DMb}
负序阻抗:negative sequence impedance ~ %B<
零序阻抗:zero sequence impedance `9k0Gd
电阻:resistor "UwH\T4I
电抗:reactance Mi~(aah
电导:conductance sgE-`#
电纳:susceptance 5Sk W-+$
无功负载:reactive load 或者QLoad ;gC|
有功负载: active load PLoad r!
Ay:r
遥测:YC(telemetering) gWY"w!f
遥信:YX mo~*C
励磁电流(转子电流):magnetizing current {BHI1Uw
定子:stator 9n}p;3{f
功角:power-angle &@ JvnO:
上限:upper limit 1:Si,d,wh
下限:lower limit RCRpzY+@
并列的:apposable Z,iHy3`
高压: high voltage *.)tG
低压:low voltage !%dN<%Ah
中压:middle voltage .f+TZDUO
电力系统 power system u{["50~
发电机 generator q&:=<+2"
励磁 excitation wgd /(8d
励磁器 excitor Fd*8N8Pi
电压 voltage !nAX$i~
电流 current {}:ToIp
母线 bus If%/3UJ@
变压器 transformer cyJG8f
升压变压器 step-up transformer %/updw#{B
高压侧 high side UwC=1g U
输电系统 power transmission system 0Ia($.1mY
输电线 transmission line u+{a8=
固定串联电容补偿fixed series capacitor compensation ?k(\ApVHj
稳定 stability tDAhyy73
电压稳定 voltage stability %c[ V
功角稳定 angle stability KN-avu_Ix
暂态稳定 transient stability B7]MGXC
电厂 power plant Pb*5eXk
能量输送 power transfer "Ky; a?Y
交流 AC Hty0qr3
装机容量 installed capacity t|m=J`a{q;
电网 power system F`9]=T0
落点 drop point Is+O
开关站 switch station >3&O::]3
双回同杆并架 double-circuit lines on the same tower )Pv9_XKJ
变电站 transformer substation d:yqj:
补偿度 degree of compensation Y3O#Q)-j$
高抗 high voltage shunt reactor 4 {9B9={
无功补偿 reactive power compensation `mN4_\]
故障 fault eilYA_FL.
调节 regulation \(%Y%?dy
裕度 magin yV^s,P1
三相故障 three phase fault YM
DMH"3
故障切除时间 fault clearing time VsA'de!V4[
极限切除时间 critical clearing time V%Sy"IG
切机 generator triping ^%`wJ.c
高顶值 high limited value hdVdcnM
强行励磁 reinforced excitation -1J[n0O.
线路补偿器 LDC(line drop compensation) MMj9{ou
机端 generator terminal H8"@iE,
静态 static (state) }K3x
动态 dynamic (state) ~/*MY
单机无穷大系统 one machine - infinity bus system GaSPJt
机端电压控制 AVR @Pt="*g
电抗 reactance H@l}WihW
电阻 resistance LQjsOo
功角 power angle u,6~qQczE
有功(功率) active power rylzcN9RM$
无功(功率) reactive power FHV-BuH5
功率因数 power factor Qca&E`~Q
无功电流 reactive current 3d|9t9v
下降特性 droop characteristics h9eMcCU
斜率 slope 4rrSb*
额定 rating D::rGB?.b
变比 ratio 4^URX>nx8
参考值 reference value r\/+Oa'
电压互感器 PT 50={%R
分接头 tap ttu&@
=
下降率 droop rate ^_m9KA
仿真分析 simulation analysis \eFR(gO+
传递函数 transfer function @9"J|}
框图 block diagram ~
yX2\i"
受端 receive-side 8]LD]h)B"
裕度 margin =kuMWaD
同步 synchronization =W'Ae,&
失去同步 loss of synchronization RU\/j%^
阻尼 damping S9#)A->
摇摆 swing qT^I?g"!
保护断路器 circuit breaker uS^Ipxe\
电阻:resistance bcYF\@};
电抗:reactance hvaSH69*m
阻抗:impedance ,I,\ml
电导:conductance p3^m9J
电纳:susceptance