1 backplane 背板 sT|FgB
2 Band gap voltage reference 带隙电压参考 CHX- 4-84{
3 benchtop supply 工作台电源 a jyuk@
4 Block Diagram 方块图 5 Bode Plot 波特图 ,"Nfo`7
6 Bootstrap 自举 Y<drRK!
7 Bottom FET Bottom FET b )mU9
8 bucket capcitor 桶形电容 vfZ.js/
9 chassis 机架 ,Rh6(I
10 Combi-sense Combi-sense Pn[R.u(l
11 constant current source 恒流源 7`IoQvX
12 Core Sataration 铁芯饱和 BYBf`F)4
13 crossover frequency 交叉频率 hs m%o\
14 current ripple 纹波电流 Tf1G827
15 Cycle by Cycle 逐周期 G`1FD
16 cycle skipping 周期跳步 r#CQCq
17 Dead Time 死区时间 I "<ACM
18 DIE Temperature 核心温度 ySk'#\d
19 Disable 非使能,无效,禁用,关断 :6r)HJ5sg
20 dominant pole 主极点 FV->226o%
21 Enable 使能,有效,启用 SZ[,(h
22 ESD Rating ESD额定值 qz
.{[l
23 Evaluation Board 评估板 g~i%*u,Y<
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. Z* Fxr;)d
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 sAG#M\A6
25 Failling edge 下降沿 #M5R>&?Jqz
26 figure of merit 品质因数 t kJw}W1@
27 float charge voltage 浮充电压 [aF^ D;o
28 flyback power stage 反驰式功率级 }c$@0x;YQ
29 forward voltage drop 前向压降 l&f"qF?
30 free-running 自由运行 dO{a!Ca
31 Freewheel diode 续流二极管 _Bp{~-fO
32 Full load 满负载 33 gate drive 栅极驱动 j(|9>J*,~G
34 gate drive stage 栅极驱动级 XAb!hc
35 gerber plot Gerber 图 )_\ZUem
36 ground plane 接地层 @FBlF$vG
37 Henry 电感单位:亨利 K~ 6[zJ4
38 Human Body Model 人体模式 ?7Y6: zo$^
39 Hysteresis 滞回 ]N\J~Gm
40 inrush current 涌入电流 <^APq8>
41 Inverting 反相 lLb"><8a
42 jittery 抖动 i^2yq&uT(
43 Junction 结点 ]26
Q*.1~
44 Kelvin connection 开尔文连接 I}&`IUP
45 Lead Frame 引脚框架 E
mUA38
46 Lead Free 无铅 +NH#t}.
47 level-shift 电平移动 ;ORT#7CU
48 Line regulation 电源调整率 dZ1/w0<M2
49 load regulation 负载调整率 B`Q~p92
50 Lot Number 批号 8N8N)#A[
51 Low Dropout 低压差 |N{?LKR
%
52 Miller 密勒 53 node 节点 eiNF?](3O
54 Non-Inverting 非反相 uTemAIp
$u
55 novel 新颖的 VOj{&O2c
56 off state 关断状态 K|n$-WDG}
57 Operating supply voltage 电源工作电压 /:YJ2AARY
58 out drive stage 输出驱动级 Od?M4Ed(
59 Out of Phase 异相 <K$X>&Ts
60 Part Number 产品型号 u;[*Z
61 pass transistor pass transistor mr`Lxy9e
62 P-channel MOSFET P沟道MOSFET S-M|
6fv
63 Phase margin 相位裕度 @bc=O1vX~;
64 Phase Node 开关节点 lO Rym:P
65 portable electronics 便携式电子设备 qM."W=XVN
66 power down 掉电
~s
:Ml
67 Power Good 电源正常 4!Cu>8B
68 Power Groud 功率地 $qoh0$
69 Power Save Mode 节电模式 7lo`)3mB
70 Power up 上电 \Kx@?,
71 pull down 下拉 63J_u-o
72 pull up 上拉 ;Y&<psQeb
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Z#+{ksU
74 push pull converter 推挽转换器 rj.]M6#
75 ramp down 斜降 "kE$2Kg
76 ramp up 斜升 n^svRM]eQ
77 redundant diode 冗余二极管 jkPye{j
78 resistive divider 电阻分压器 @E(_H$|E
79 ringing 振 铃 @AXRKYQ{t
80 ripple current 纹波电流 OZ/P@`kN.f
81 rising edge 上升沿 :GXD-6}^|
82 sense resistor 检测电阻 KRY%B[k
83 Sequenced Power Supplys 序列电源 /EN3>25"#
84 shoot-through 直通,同时导通 Rmq8lU
85 stray inductances. 杂散电感 ,?OV39h
86 sub-circuit 子电路 Ft7{P.g
87 substrate 基板 n/
\{}9
88 Telecom 电信
z,6X{=
89 Thermal Information 热性能信息 uafSz@`
90 thermal slug 散热片 xKilTh_.6
91 Threshold 阈值 xq?9w$
92 timing resistor 振荡电阻 i\2d1Z
93 Top FET Top FET #cN0ciCT'
94 Trace 线路,走线,引线 2:31J4t-<
95 Transfer function 传递函数 sH//*y
96 Trip Point 跳变点 c$cb2V7,
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) B.wRZDEvc
98 Under Voltage Lock Out (UVLO) 欠压锁定 :YL`GSl
99 Voltage Reference 电压参考 SDdefB
100 voltage-second product 伏秒积 E]^wsS>=
101 zero-pole frequency compensation 零极点频率补偿 (*.t~6c?5
102 beat frequency 拍频 xQ4'$rL1d
103 one shots 单击电路 :8}iZ.
104 scaling 缩放 &P+7Um(
105 ESR 等效串联电阻 [Page] >~;MQDU5*Y
106 Ground 地电位 $1QQidB
107 trimmed bandgap 平衡带隙 @yBg)1AL
108 dropout voltage 压差 n*tT<
109 large bulk capacitance 大容量电容 iKy_DV;J
110 circuit breaker 断路器 0!WF,)/T7i
111 charge pump 电荷泵 `m6>r9:
112 overshoot 过冲 ~$#"'Tl4J
1_D|;/aI
印制电路printed circuit 9y BENvq
印制线路 printed wiring fS08q9,S /
印制板 printed board |5uvmK
印制板电路 printed circuit board K;%P_f/KJP
印制线路板 printed wiring board k7rFbrLZ
印制元件 printed component 7M#eR8*[se
印制接点 printed contact #~A (%a
印制板装配 printed board assembly "62vwWrwO
板 board `
u# '
刚性印制板 rigid printed board @ ;%+Ms
挠性印制电路 flexible printed circuit s}MD;V&0
挠性印制线路 flexible printed wiring Vy]y73~
齐平印制板 flush printed board pwg$% lv
金属芯印制板 metal core printed board VO_! +
金属基印制板 metal base printed board uSZCJ#'G
多重布线印制板 mulit-wiring printed board 6S#Y$2
P
塑电路板 molded circuit board .Dn.|A
散线印制板 discrete wiring board a;=)`
微线印制板 micro wire board AJk0jh\.j%
积层印制板 buile-up printed board dGxk
ql
表面层合电路板 surface laminar circuit mR3)$!
埋入凸块连印制板 B2it printed board m3Mo2};?
载芯片板 chip on board VMry$
埋电阻板 buried resistance board Lk?%B)z
母板 mother board W[pOLc-
子板 daughter board ]_Cm 5Z7
背板 backplane b2}>{Li0
裸板 bare board @J`o
pR
键盘板夹心板 copper-invar-copper board do {E39
动态挠性板 dynamic flex board F.zx]][JV
静态挠性板 static flex board (mO{W
可断拼板 break-away planel Y(aEp_kV
电缆 cable T:v.]0l~
挠性扁平电缆 flexible flat cable (FFC) ^$8@B]*
薄膜开关 membrane switch {{hp;&x
混合电路 hybrid circuit U_s3)/'
厚膜 thick film d:Y!!LV-@L
厚膜电路 thick film circuit 75@!j[QL<
薄膜 thin film xJG&vOf;?
薄膜混合电路 thin film hybrid circuit 9CBKU4JQ
互连 interconnection w}8
,ICL
导线 conductor trace line @uh^)6i]/
齐平导线 flush conductor ew13qpt)<L
传输线 transmission line mf~JolucJ
跨交 crossover _&(\>{pm
板边插头 edge-board contact RIhu9W
增强板 stiffener 968<yO]
基底 substrate 5j8aMnv s
基板面 real estate (p19"p
导线面 conductor side X8}m
%
元件面 component side X;e=d+pw
焊接面 solder side Mi>!
导电图形 conductive pattern 2 m"2>gX
非导电图形 non-conductive pattern *B4?(&0
基材 base material [Rj_p&'
层压板 laminate iXoEdt)
覆金属箔基材 metal-clad bade material 1K*`i(
覆铜箔层压板 copper-clad laminate (CCL) C F,-l
B
复合层压板 composite laminate Yvi.l6JL
薄层压板 thin laminate DpRGPs
基体材料 basis material G '1K6
预浸材料 prepreg -dto46X
粘结片 bonding sheet WyA`V C
预浸粘结片 preimpregnated bonding sheer o+],L_Ab
环氧玻璃基板 epoxy glass substrate w"Q/ 6#!K
预制内层覆箔板 mass lamination panel !:]/MpQ ?
内层芯板 core material T'ko =k
粘结层 bonding layer ;L*Ku'6Mt
粘结膜 film adhesive JT,[;
无支撑胶粘剂膜 unsupported adhesive film 9ZD>_a
覆盖层 cover layer (cover lay) whW%c8
增强板材 stiffener material Y5ZBP?P
铜箔面 copper-clad surface >;K!yI?0
去铜箔面 foil removal surface @<TC+M5!
层压板面 unclad laminate surface 5!s7`w]8*0
基膜面 base film surface rq#\x{l
胶粘剂面 adhesive faec 6"oG
bte
原始光洁面 plate finish ?wi^R:2|j
粗面 matt finish kgb:<{pJ
剪切板 cut to size panel 8{-
*Q(=/
超薄型层压板 ultra thin laminate D7lRZb
A阶树脂 A-stage resin F"^/R
B阶树脂 B-stage resin T;M4NGmvd
C阶树脂 C-stage resin $=9g,39
环氧树脂 epoxy resin oazY?E]}3
酚醛树脂 phenolic resin YlC$L$%Zd.
聚酯树脂 polyester resin [*K.9}+G_
聚酰亚胺树脂 polyimide resin K^Ho%_)
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin xFScj0Y
丙烯酸树脂 acrylic resin df)S}}#H
三聚氰胺甲醛树脂 melamine formaldehyde resin h]vuBHJ}
多官能环氧树脂 polyfunctional epoxy resin mVd%sWD
溴化环氧树脂 brominated epoxy resin 8b:GyC5L
环氧酚醛 epoxy novolac `]I p`_{
氟树脂 fluroresin 2{xf{)hO?
硅树脂 silicone resin ^2`*1el
硅烷 silane | /X+2K}3
聚合物 polymer [{q])P;
无定形聚合物 amorphous polymer P
r2WF~NuO
结晶现象 crystalline polamer qQwf#&
双晶现象 dimorphism FL[,?RU?2
共聚物 copolymer tx$`1KA
合成树脂 synthetic bo-lT-I
热固性树脂 thermosetting resin [Page] n
>@Qx$-
热塑性树脂 thermoplastic resin 7n[0)XR>
感光性树脂 photosensitive resin x"P@[T
环氧值 epoxy value 6J<R;g23R]
双氰胺 dicyandiamide f_z]kA
+H
粘结剂 binder Y;{(?0
s
胶粘剂 adesive }BWT21'-Y
固化剂 curing agent 629ogJo8
阻燃剂 flame retardant PQrc#dfc|
遮光剂 opaquer O$7r)B6Cs
增塑剂 plasticizers ?h:xO\h8
不饱和聚酯 unsatuiated polyester "..I$R
聚酯薄膜 polyester {Fvl7Sh
聚酰亚胺薄膜 polyimide film (PI) <C_FRpR<f
聚四氟乙烯 polytetrafluoetylene (PTFE) v$Xoxp
增强材料 reinforcing material m>f8RBp]'
折痕 crease ojx2[a\
云织 waviness FK@Gd)(
鱼眼 fish eye ;NF:98
毛圈长 feather length };g<|v*o
厚薄段 mark ujr"_ofI
裂缝 split ))6YOc
捻度 twist of yarn \s6VOR/
浸润剂含量 size content ~!P&LZ
浸润剂残留量 size residue w&*oWI$i
处理剂含量 finish level O f]/tdPp
偶联剂 couplint agent ^;[^L=}8$
断裂长 breaking length gkDXt^Ob
吸水高度 height of capillary rise oK3PA
湿强度保留率 wet strength retention Ap> H-/C
白度 whitenness Fr#QM0--B
导电箔 conductive foil n2Y a'YF
铜箔 copper foil y
m?uj4I{
压延铜箔 rolled copper foil /}k?Tg/
光面 shiny side jxZ_-1
粗糙面 matte side @xr}(.
处理面 treated side 'VV"$`Fu"
防锈处理 stain proofing ,"5xKF+cS
双面处理铜箔 double treated foil \=H+m%
模拟 simulation QtLd(&
!v
逻辑模拟 logic simulation Y?%=6S
电路模拟 circit simulation (8(P12l
时序模拟 timing simulation >+@EU)
模块化 modularization jpZ 7p;
设计原点 design origin hLaQ[9
优化(设计) optimization (design) PJAM_K;
供设计优化坐标轴 predominant axis HMw}pp:
表格原点 table origin lr=quWDY
元件安置 component positioning L$?YbQo7
比例因子 scaling factor 2>)::9e4
扫描填充 scan filling |AS9^w
矩形填充 rectangle filling I.p"8I;
填充域 region filling =cI> {
实体设计 physical design I=;=;-
逻辑设计 logic design < Q6
逻辑电路 logic circuit )Ut9k
层次设计 hierarchical design A",R2d
自顶向下设计 top-down design 8aVj@x$'
自底向上设计 bottom-up design < fYcON
费用矩阵 cost metrix # (-?i\i
元件密度 component density 58]t iP"
自由度 degrees freedom ~I@ %ysR
出度 out going degree ootkf=
入度 incoming degree eY_BECJ+OO
曼哈顿距离 manhatton distance nX<yB9bXDg
欧几里德距离 euclidean distance ew,g'$drD
网络 network dZAb':
阵列 array Efu/v<
段 segment PUC:Pl77
逻辑 logic RA}Y$ }^#'
逻辑设计自动化 logic design automation a lyA#zao|
分线 separated time @"afEMd
分层 separated layer *a`_,Q{x
定顺序 definite sequence 21hTun"W
导线(通道) conduction (track) T5aeO^x
导线(体)宽度 conductor width X`7O%HiX/`
导线距离 conductor spacing SA~oGgk=P
导线层 conductor layer G$jw#a[L
导线宽度/间距 conductor line/space T8Ye+eP}
第一导线层 conductor layer No.1 o3.b='HAm
圆形盘 round pad -_f-j
方形盘 square pad G.qjw]Llf
菱形盘 diamond pad sX(rJLbD
长方形焊盘 oblong pad ki]i[cdk
子弹形盘 bullet pad
(!T\[6
泪滴盘 teardrop pad &izk$~
雪人盘 snowman pad \ZC0bHsA
形盘 V-shaped pad V 7+m.:~H3}
环形盘 annular pad ^;;gPhhWV
非圆形盘 non-circular pad G4"[ynlWV
隔离盘 isolation pad 8e_9u@p+w
非功能连接盘 monfunctional pad {QIdeB[
偏置连接盘 offset land #wF6Wx iG
腹(背)裸盘 back-bard land _j]vR
盘址 anchoring spaur OmaG|2u
连接盘图形 land pattern J!iKW
连接盘网格阵列 land grid array j`-9.
孔环 annular ring kQ .3J.Q5
元件孔 component hole IKnXtydeI}
安装孔 mounting hole t8Giv89{
支撑孔 supported hole &FDWlrGg
非支撑孔 unsupported hole ^/7Y3n!|3
导通孔 via f:h<tlob
镀通孔 plated through hole (PTH) 2bTM0-
余隙孔 access hole gm}zF%B"
盲孔 blind via (hole) A )xfO-
埋孔 buried via hole 9j$ J}=y
埋,盲孔 buried blind via Yu|L6#[E
任意层内部导通孔 any layer inner via hole I>@Qfc
bG
全部钻孔 all drilled hole [?F]S:/i
定位孔 toaling hole h\*I*I8C
无连接盘孔 landless hole qa5 T(:8
中间孔 interstitial hole 6"La`}B(T8
无连接盘导通孔 landless via hole =T|m#*{.L
引导孔 pilot hole '];=1loD
端接全隙孔 terminal clearomee hole 0[fqF^HEN
准尺寸孔 dimensioned hole [Page] MW)=l
| G
在连接盘中导通孔 via-in-pad tnC,1HV0[
孔位 hole location >~\CiV4^
孔密度 hole density <_-8)abK
孔图 hole pattern _E
xd:
钻孔图 drill drawing CM+/.y T
装配图assembly drawing ]s~%1bd
参考基准 datum referan Xldz&&@
1) 元件设备 *@[+C~U
/w:~!3Aj0+
三绕组变压器:three-column transformer ThrClnTrans q@Sj$
双绕组变压器:double-column transformer DblClmnTrans aTPmW]w6
电容器:Capacitor n }4L q^$
并联电容器:shunt capacitor rfhvd wwD
电抗器:Reactor <k-hRs2d
母线:Busbar t}-rN5GO
输电线:TransmissionLine p`3$NCJN
发电厂:power plant |%5nV=&\
断路器:Breaker hOIk6}r4X
刀闸(隔离开关):Isolator "6o5x&H
分接头:tap 3(>NS ?lX
电动机:motor S s#UX_DT_
(2) 状态参数 =j
S
?K^~(D8(
有功:active power gD/% l[
无功:reactive power &Ch~$Wb^
电流:current )>rHM6-W
容量:capacity LkIbvJCV
电压:voltage t+Hx&_pMj
档位:tap position m6M:l"u
有功损耗:reactive loss x>~.cey
无功损耗:active loss rgXD>yu(
功率因数:power-factor J9yB'yE8
功率:power Rz!! ;<ye8
功角:power-angle TeWpdUCO
电压等级:voltage grade 2K$#U|Qi
空载损耗:no-load loss {aq}Q|?/
铁损:iron loss d]w%zo,yr
铜损:copper loss }?XNA.Wz
空载电流:no-load current ?tFsSU
阻抗:impedance
]<?7CpP
正序阻抗:positive sequence impedance 088"7 s
负序阻抗:negative sequence impedance < .B^\X$
零序阻抗:zero sequence impedance P V,AN
电阻:resistor *q |3QHZ
电抗:reactance caC(KK#<
电导:conductance {Qr0pjE7R
电纳:susceptance _4#&!b6
无功负载:reactive load 或者QLoad zCdzxb_h"
有功负载: active load PLoad f6zS_y9gn
遥测:YC(telemetering) <tp#KZE
遥信:YX N"q C-h
励磁电流(转子电流):magnetizing current dw]wQ\4B
定子:stator hCKx%&[^7
功角:power-angle zS+_6s
上限:upper limit a#G]5TZ
下限:lower limit Z-B b,8
并列的:apposable ~^R?H S
高压: high voltage aR~Od Ys
低压:low voltage b&1-tYV
中压:middle voltage c/\$AJV.H
电力系统 power system :[ AP^
发电机 generator lYMNx|PF
励磁 excitation 1-bQ
( -
励磁器 excitor @*rED6zH
电压 voltage Nu%:7
电流 current c@1q8,
母线 bus mv+K!T6
变压器 transformer $ZOKB9QccC
升压变压器 step-up transformer p>@S61
&
[
高压侧 high side OnKPD=<
输电系统 power transmission system _p`@/[(|
输电线 transmission line U.B=%S
固定串联电容补偿fixed series capacitor compensation p!~{<s]
稳定 stability %g<J"/
电压稳定 voltage stability
(s\":5
C
功角稳定 angle stability _7M! b9oA
暂态稳定 transient stability 5@{+V!o,
电厂 power plant 8{GRrwQ>
能量输送 power transfer .V\M/q\Tv
交流 AC qJ|n73yn
装机容量 installed capacity j_r7oARL
电网 power system k9^Vw+$m
落点 drop point d$G<g78D
开关站 switch station MK<VjpP0(
双回同杆并架 double-circuit lines on the same tower s;0eD5b>x
变电站 transformer substation G{cTQH|
补偿度 degree of compensation kH43 T
高抗 high voltage shunt reactor <9s=K\-
无功补偿 reactive power compensation R "&(Ae?LR
故障 fault 4P>tGO&*x
调节 regulation ,ZYj8^gF
裕度 magin ZQ^kS9N i
三相故障 three phase fault A!kNqJ2
故障切除时间 fault clearing time 7\
<4LX
极限切除时间 critical clearing time q-.e9eoc\
切机 generator triping ItTIU
高顶值 high limited value lbES9o5
强行励磁 reinforced excitation X'&$wQ6,K
线路补偿器 LDC(line drop compensation) 3"gifE
机端 generator terminal {}3kla{
静态 static (state) ;!@\|E
动态 dynamic (state) ."Yub];H
单机无穷大系统 one machine - infinity bus system j}R4mh
机端电压控制 AVR gkpNT)
电抗 reactance oPNYCE
电阻 resistance DJE/u qE
功角 power angle 8-5a*vV,>
有功(功率) active power &F}1\6{fL
无功(功率) reactive power k~Pm.@,3o
功率因数 power factor F.=uJdl.!
无功电流 reactive current 4[3T%jA
下降特性 droop characteristics [&*$!M
斜率 slope wN)R !6
额定 rating bE>3D#V<
变比 ratio ^+[o+
参考值 reference value ?E2k]y6<
电压互感器 PT %:o@IRTRU
分接头 tap x#0C+cU
下降率 droop rate x=B+FIJ
仿真分析 simulation analysis <nsl`C~6g0
传递函数 transfer function "|DR"rr'j
框图 block diagram A2&&iL=j/
受端 receive-side T *t$
裕度 margin H>XbqIkL@
同步 synchronization gSj-~kP
失去同步 loss of synchronization sW2LNE
阻尼 damping ,H[AC}z2X
摇摆 swing ;D8Nya>%
保护断路器 circuit breaker l*Y~h3
电阻:resistance W,{`)NWg
电抗:reactance p>eD{#2
阻抗:impedance \wRr6-!_
电导:conductance GvzPT2E!
电纳:susceptance