1 backplane 背板 *nkoPVpC
2 Band gap voltage reference 带隙电压参考 p8Qk'F=h
3 benchtop supply 工作台电源 1~NT.tY
4 Block Diagram 方块图 5 Bode Plot 波特图 KW pVw!
6 Bootstrap 自举 %]}
7 Bottom FET Bottom FET A P?R"%
8 bucket capcitor 桶形电容 ia!y!_L\'
9 chassis 机架 Ng2twfSl$
10 Combi-sense Combi-sense G[uK -U
11 constant current source 恒流源 h-`? {k&e
12 Core Sataration 铁芯饱和 #lL^?|M
13 crossover frequency 交叉频率 @@Kp67Iv
14 current ripple 纹波电流 3YOq2pW72G
15 Cycle by Cycle 逐周期 KPKt^C
16 cycle skipping 周期跳步 2} /aFR
17 Dead Time 死区时间 0z6R'Kjy A
18 DIE Temperature 核心温度 V^bwXr4f
19 Disable 非使能,无效,禁用,关断 ];[}:f
20 dominant pole 主极点 7x|9n
21 Enable 使能,有效,启用 ZbW17@b
22 ESD Rating ESD额定值 E Nhl&J
23 Evaluation Board 评估板 f@wquG'
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. B"1c
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 JcsHt;
25 Failling edge 下降沿 he;dq)-e9
26 figure of merit 品质因数 IL#"~D?
27 float charge voltage 浮充电压 m$>H u@Va
28 flyback power stage 反驰式功率级 P~ >OS5^
29 forward voltage drop 前向压降 3Ei#q+7
30 free-running 自由运行 7rc0yB
31 Freewheel diode 续流二极管 d;Ym=YHJtn
32 Full load 满负载 33 gate drive 栅极驱动 un mJbY;t
34 gate drive stage 栅极驱动级 6
$4[gcL'
35 gerber plot Gerber 图 '}53f2%gKa
36 ground plane 接地层 M=@:ZQ^!
37 Henry 电感单位:亨利 NX*Q F+
38 Human Body Model 人体模式 BU/"rv"(Fg
39 Hysteresis 滞回 uP)'FI
40 inrush current 涌入电流 pZ.ecZe/
41 Inverting 反相 >
PRFWO
42 jittery 抖动 V1N3iI
43 Junction 结点 vxBgGl
44 Kelvin connection 开尔文连接 Q%`@0#"]Sv
45 Lead Frame 引脚框架 @e.C"@G
46 Lead Free 无铅 vtg!8u4
47 level-shift 电平移动 we//|fA<
48 Line regulation 电源调整率 ].w4$OJ?
49 load regulation 负载调整率 y@S$^jk.
50 Lot Number 批号 S%;O+eFYb
51 Low Dropout 低压差 V(I8=rVH
52 Miller 密勒 53 node 节点 ,aZ[R27rpL
54 Non-Inverting 非反相 {L{o]Ii?g
55 novel 新颖的 nV|EQs4(
56 off state 关断状态 @1roe
G
57 Operating supply voltage 电源工作电压 Ju@c~Xm
58 out drive stage 输出驱动级 nfbR
P t
59 Out of Phase 异相 Tv,[DI +
60 Part Number 产品型号 ,q`\\d
61 pass transistor pass transistor 2~)`N>@
62 P-channel MOSFET P沟道MOSFET ;WQve_\
63 Phase margin 相位裕度 2`K=Hby
64 Phase Node 开关节点 <44G]eb
65 portable electronics 便携式电子设备 BA:VPTZq
66 power down 掉电 y%cP1y)
67 Power Good 电源正常 vH@ds
k
68 Power Groud 功率地 z\W64^'"Z
69 Power Save Mode 节电模式 Q~
w|#
70 Power up 上电 R B
71 pull down 下拉 &jJL"gq"
72 pull up 上拉 X'Xx"M
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) q"lSZ;
'E
74 push pull converter 推挽转换器 ASA,{w]
75 ramp down 斜降 k(nW#*N_
76 ramp up 斜升 V~3a!-m\
77 redundant diode 冗余二极管 GR_-9}jQP
78 resistive divider 电阻分压器 +SU8 +w
79 ringing 振 铃 b{&)6M)zo
80 ripple current 纹波电流 Dw.J2>uj
81 rising edge 上升沿 -`h)$&,
82 sense resistor 检测电阻 jvL[
JI,b
83 Sequenced Power Supplys 序列电源 F@KGj|
84 shoot-through 直通,同时导通 A}9`S6 @@
85 stray inductances. 杂散电感 b2Fe<~S{
86 sub-circuit 子电路 p8O2Z?\
87 substrate 基板 Ffz,J6b
88 Telecom 电信 4xje$/_d
89 Thermal Information 热性能信息 !wVM= z^G
90 thermal slug 散热片 `*R:gE=
91 Threshold 阈值 Z@S3ZGe
92 timing resistor 振荡电阻 *i%.;Z"
93 Top FET Top FET Xc-'Y"}|`t
94 Trace 线路,走线,引线 kgP0x-Ap
95 Transfer function 传递函数 )7Wf@@R'F
96 Trip Point 跳变点 IOmfF[
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) pz*3N
98 Under Voltage Lock Out (UVLO) 欠压锁定 G5 WVr$
99 Voltage Reference 电压参考 uw_Y\F-$
100 voltage-second product 伏秒积 ^jZbo{
101 zero-pole frequency compensation 零极点频率补偿 "ze|W\Bv!
102 beat frequency 拍频 "<1{9
103 one shots 单击电路 ^}o 2
104 scaling 缩放 f.$af4
u
105 ESR 等效串联电阻 [Page] 'zTLl8P
106 Ground 地电位 0S!K{xyR
107 trimmed bandgap 平衡带隙 .W!i7
108 dropout voltage 压差 zRr*7G
109 large bulk capacitance 大容量电容 @q7I4
110 circuit breaker 断路器 VU3upy<
111 charge pump 电荷泵 aEeodA<(
112 overshoot 过冲 3F2w-+L
%dVZ0dl
印制电路printed circuit YN F k
印制线路 printed wiring 9W2Vo [(
印制板 printed board n{mfn*r.
印制板电路 printed circuit board gjD Ho$
印制线路板 printed wiring board 0aB;p7~&
印制元件 printed component H*CW1([
印制接点 printed contact rjYJs*#
印制板装配 printed board assembly oap4rHk}
板 board )Ql%r?(F+
刚性印制板 rigid printed board %>{0yEC
挠性印制电路 flexible printed circuit /h3RmUy
挠性印制线路 flexible printed wiring p<"m[Dt]
齐平印制板 flush printed board aqk!T%fg
金属芯印制板 metal core printed board 1mG-}
金属基印制板 metal base printed board -uf|w?
多重布线印制板 mulit-wiring printed board 2\{zmc}G-0
塑电路板 molded circuit board s2'h
散线印制板 discrete wiring board cVF"!.
微线印制板 micro wire board _q-*7hCQ`
积层印制板 buile-up printed board jNk%OrP]
表面层合电路板 surface laminar circuit i8]S:4 9
埋入凸块连印制板 B2it printed board SwMc
pNo
载芯片板 chip on board 2J BR)P
埋电阻板 buried resistance board S<Xf>-8w
母板 mother board }pkzH'$HJ
子板 daughter board ( a#BV}=
背板 backplane &F~T-i>X
裸板 bare board KbeC"mi
键盘板夹心板 copper-invar-copper board %EB/b
动态挠性板 dynamic flex board zTU0HR3A
静态挠性板 static flex board i9x+A/o[
可断拼板 break-away planel . $vK&k
电缆 cable c\j/k[\<
挠性扁平电缆 flexible flat cable (FFC) eJ-nKkg~a
薄膜开关 membrane switch A*BeR0(
混合电路 hybrid circuit I; rGD^
厚膜 thick film N;`n@9BF
厚膜电路 thick film circuit TM%%O :3
薄膜 thin film w``U=sfmV
薄膜混合电路 thin film hybrid circuit oEpFuWp%A
互连 interconnection A.w.rVDD
导线 conductor trace line SE*g;Cvg1
齐平导线 flush conductor u>vL/nI
传输线 transmission line o }m3y
跨交 crossover l.M0`Cn-%
板边插头 edge-board contact 4o5t#qP5$S
增强板 stiffener dSHDWu&
基底 substrate 5Gm_\kd
基板面 real estate 1?l1:}^L
导线面 conductor side ZbKg~jdF
元件面 component side ]7A'7p$Y
焊接面 solder side <N~K;n
v
导电图形 conductive pattern ;!Fn1|)
非导电图形 non-conductive pattern YN5rml'-
基材 base material =7UsVn#o
层压板 laminate UJ2U1H54h
覆金属箔基材 metal-clad bade material 6_B]MN!(
覆铜箔层压板 copper-clad laminate (CCL) $%f&a3#
复合层压板 composite laminate 2&cT~ZX&'
薄层压板 thin laminate '~ 47)fN
基体材料 basis material j1<Yg,_.p
预浸材料 prepreg wC'Szni
粘结片 bonding sheet ))Za&S*<
预浸粘结片 preimpregnated bonding sheer #AY&BWS$
环氧玻璃基板 epoxy glass substrate {P-):
预制内层覆箔板 mass lamination panel /yZcDK4
内层芯板 core material ~"A0Rs=
粘结层 bonding layer .e-#yET
粘结膜 film adhesive h{qgEIk&
无支撑胶粘剂膜 unsupported adhesive film 6!bsM"F
覆盖层 cover layer (cover lay) 2~[juWbz
增强板材 stiffener material t_1LL >R
铜箔面 copper-clad surface VIbq:U
去铜箔面 foil removal surface [V`r^
层压板面 unclad laminate surface K(|}dl:
基膜面 base film surface f6p/5]=J26
胶粘剂面 adhesive faec %a7$QF]
原始光洁面 plate finish k}rbim
粗面 matt finish F"mmLao
剪切板 cut to size panel [#iz/q~}
超薄型层压板 ultra thin laminate N$tGQ@
A阶树脂 A-stage resin cZ3v=ke^
B阶树脂 B-stage resin ia?
c0xL
C阶树脂 C-stage resin Iga024KR
环氧树脂 epoxy resin vih9KBT
酚醛树脂 phenolic resin W%w~ah|/]
聚酯树脂 polyester resin CvdN"k
聚酰亚胺树脂 polyimide resin cz$2R
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin q.}CU.dp
丙烯酸树脂 acrylic resin 2Khv>#l
三聚氰胺甲醛树脂 melamine formaldehyde resin ee=D1 qNu;
多官能环氧树脂 polyfunctional epoxy resin |':{lH6+1
溴化环氧树脂 brominated epoxy resin _e2=ado
环氧酚醛 epoxy novolac d_P` qA
氟树脂 fluroresin _u Il
硅树脂 silicone resin z(~_AN M4,
硅烷 silane W%Fv p;\`
聚合物 polymer K)P%;X
无定形聚合物 amorphous polymer HbIF^LeY|R
结晶现象 crystalline polamer R@2X3s:
双晶现象 dimorphism V VCZ9MVJ
共聚物 copolymer "Y.y:Vv;
合成树脂 synthetic \)Cl%Em
热固性树脂 thermosetting resin [Page] [-x7_=E#
热塑性树脂 thermoplastic resin 47B&s
感光性树脂 photosensitive resin |l!aB(NW
环氧值 epoxy value P2nu;I_&
双氰胺 dicyandiamide 2Z%O7V~u
粘结剂 binder J~- 4C)
胶粘剂 adesive <oeIcN7d
固化剂 curing agent 6MI8zRX
阻燃剂 flame retardant Bbp|!+KP{(
遮光剂 opaquer 3$JoDL(Z
增塑剂 plasticizers >-c8q]()ly
不饱和聚酯 unsatuiated polyester _
x*3PE
聚酯薄膜 polyester { xB3S_,8
聚酰亚胺薄膜 polyimide film (PI) T]$U""
聚四氟乙烯 polytetrafluoetylene (PTFE) Vw"\{`
增强材料 reinforcing material %
u6Sr5A[s
折痕 crease 8;X-)&R
云织 waviness 048kPXm`
鱼眼 fish eye _vZOZKS+
毛圈长 feather length )`}:8y?
厚薄段 mark :Tq~8!s
裂缝 split %XTI-B/K
捻度 twist of yarn :@&/kyGH
浸润剂含量 size content Q@H V- (A
浸润剂残留量 size residue OrG).^l
处理剂含量 finish level ']oQ]Yx0
偶联剂 couplint agent J8D,ZfPN`d
断裂长 breaking length .e5Mnd%$M
吸水高度 height of capillary rise &.ACd+Cd
湿强度保留率 wet strength retention %>s|j'{
白度 whitenness mA} "a<0
导电箔 conductive foil A)KZa"EX
铜箔 copper foil =w^M{W.w
压延铜箔 rolled copper foil mVmGg,
光面 shiny side I?NyM
粗糙面 matte side (iGTACoF
处理面 treated side $ulOp;~A%
防锈处理 stain proofing y?!"6t7&
双面处理铜箔 double treated foil \[nut;
模拟 simulation hzC>~Ub5
逻辑模拟 logic simulation G/ 5%.Bf@
电路模拟 circit simulation YoE3<[KD(
时序模拟 timing simulation /L#?zSt
模块化 modularization CH/rp4NeSy
设计原点 design origin &?RQZHtg
优化(设计) optimization (design) Ct|A:/z(
供设计优化坐标轴 predominant axis 4/)k)gLI
表格原点 table origin J-4:H
gx
元件安置 component positioning y!%CffF2
比例因子 scaling factor 3mni>*q7d
扫描填充 scan filling h1(4Ic
矩形填充 rectangle filling A(N4N
填充域 region filling (9h`3#
实体设计 physical design )_NO4`ejs/
逻辑设计 logic design 9{uO1O\
逻辑电路 logic circuit ;=UsAB]
层次设计 hierarchical design HorDNRyu
自顶向下设计 top-down design kNL\m[W8$
自底向上设计 bottom-up design d5l UGRg
费用矩阵 cost metrix 39jG8zr=Z[
元件密度 component density vcd\GN*4f
自由度 degrees freedom *9i{,I@
出度 out going degree t0I{q0
入度 incoming degree Lh<).<S
曼哈顿距离 manhatton distance FGQzoS
欧几里德距离 euclidean distance E~:x(5'%d
网络 network {}x^ri~
阵列 array 1i] ^{;]
段 segment M#[{>6>iE
逻辑 logic llsfTrp
逻辑设计自动化 logic design automation wvPk:1wD5
分线 separated time 7[wieYj{
分层 separated layer .>nRzgo
定顺序 definite sequence !g.?
导线(通道) conduction (track) o8vug$=Z
导线(体)宽度 conductor width t()c=8qF|u
导线距离 conductor spacing xP,hTE
导线层 conductor layer uM'Jp?
导线宽度/间距 conductor line/space Hq 188<
第一导线层 conductor layer No.1 5PnDN\
圆形盘 round pad "wHFN>5B
方形盘 square pad -PQv ?5
菱形盘 diamond pad ;({W#Wa
长方形焊盘 oblong pad ]$_NyAoBb
子弹形盘 bullet pad &!
?eL
泪滴盘 teardrop pad 1'\/,Es
雪人盘 snowman pad >dG[G>
形盘 V-shaped pad V OBAi2Vw
环形盘 annular pad 8&aq/4:q0
非圆形盘 non-circular pad {.\TtE
隔离盘 isolation pad eGHaY4|
非功能连接盘 monfunctional pad "-J-k=
偏置连接盘 offset land "w.3Q96r
腹(背)裸盘 back-bard land tNX|U:Y*
盘址 anchoring spaur pV"R|{#V
连接盘图形 land pattern mdgi5v
连接盘网格阵列 land grid array }Z,x~G
孔环 annular ring Wiu"k%Qsh
元件孔 component hole ^v`\x5"Vp
安装孔 mounting hole .VzT:4-<Q"
支撑孔 supported hole ?1eK#Z.
非支撑孔 unsupported hole Ez=Olbk
导通孔 via U ZsH9
o
镀通孔 plated through hole (PTH) !I
Qck8Y
余隙孔 access hole abLnI =W`
盲孔 blind via (hole) xK\d4"
埋孔 buried via hole j,dR,N d
埋,盲孔 buried blind via (*)hD(C5
任意层内部导通孔 any layer inner via hole ^]-6u:J!
全部钻孔 all drilled hole ,nB5/Lx
定位孔 toaling hole NTI+
无连接盘孔 landless hole igR";OQk
中间孔 interstitial hole FG*r'tC~r
无连接盘导通孔 landless via hole A$:U'ZG_
引导孔 pilot hole w:Kl6"c
端接全隙孔 terminal clearomee hole 46&/gehr
准尺寸孔 dimensioned hole [Page] *ppffz
在连接盘中导通孔 via-in-pad s}% M4
孔位 hole location 7VF LJrt
孔密度 hole density 'CkIz"Wd
孔图 hole pattern Gk /fBs
钻孔图 drill drawing 1HZO9cXJ
装配图assembly drawing +&2%+[nBZ
参考基准 datum referan %Q dn
1) 元件设备 r|Tcfk]%
8eHyL
三绕组变压器:three-column transformer ThrClnTrans u^qT2Ss0
双绕组变压器:double-column transformer DblClmnTrans ~1vDV>dpE
电容器:Capacitor xjj6WED
并联电容器:shunt capacitor _t #k,;
电抗器:Reactor c|@bwat4
母线:Busbar d,n 'n
输电线:TransmissionLine ]F'e
aR
发电厂:power plant sI^Xb@'09$
断路器:Breaker wov\kV
刀闸(隔离开关):Isolator h|{]B,.Lh
分接头:tap I75DUJqy]
电动机:motor Hn+~5@.
(2) 状态参数 76h ,]xi
oHn
Ky[1
有功:active power pohp&Tcm
无功:reactive power XLOh7(
电流:current 6.nCV0xA
容量:capacity j yUCH*@
电压:voltage 8i#2d1O
档位:tap position x Bi' X
有功损耗:reactive loss 9H`XeQ.
无功损耗:active loss *]/zc1Q4M
功率因数:power-factor 54R#W:t
功率:power zL `iK"N`
功角:power-angle A!WKnb_`
电压等级:voltage grade uH- l%17
空载损耗:no-load loss "N bq#w\
铁损:iron loss fN^8{w/O
铜损:copper loss qL3;}R
空载电流:no-load current .jT#:_
阻抗:impedance !0L Wa"
正序阻抗:positive sequence impedance dufu|BL|}
负序阻抗:negative sequence impedance e_ANUll1
零序阻抗:zero sequence impedance c>:wd@w
电阻:resistor 3>`mI8$t
电抗:reactance .Una+Z
电导:conductance RF53J yt
电纳:susceptance 9BBmw(M}
无功负载:reactive load 或者QLoad Eq9x2
有功负载: active load PLoad ""F5z,'
遥测:YC(telemetering) 7XLtN "$$
遥信:YX Y}|X|!0x
励磁电流(转子电流):magnetizing current iYm-tsER;
定子:stator PB`Y
g
功角:power-angle {~"/Y@&]R
上限:upper limit /,&<6c-Q@W
下限:lower limit ,|H
`e^
并列的:apposable /quc}"__
高压: high voltage 4,gK[ dc
低压:low voltage O6a<`]F
中压:middle voltage
?2{Gn-{
电力系统 power system V0.vQ/
发电机 generator vB|hZTW
励磁 excitation Tc &z:
励磁器 excitor tla
5B_
电压 voltage sF?TmBQ*
电流 current {e9@-
母线 bus ~{B7 k:
变压器 transformer Gm.T;fc:
升压变压器 step-up transformer L<-_1!wh
高压侧 high side BBRR)
输电系统 power transmission system ]kRfB:4ED
输电线 transmission line u4F5h PO]
固定串联电容补偿fixed series capacitor compensation =eXU@B
稳定 stability a85$K$b>
电压稳定 voltage stability BsqP?/
功角稳定 angle stability [{<`o5qR
暂态稳定 transient stability #9}D4i.`}
电厂 power plant (%e.:W${
能量输送 power transfer 9_rYBX
交流 AC JG!mc7
装机容量 installed capacity *,8^@(th
电网 power system mD0f<gJ1
落点 drop point YYl 4"l
开关站 switch station [OV"}<V
双回同杆并架 double-circuit lines on the same tower ;F!5%}OcL%
变电站 transformer substation &5spTMw8
补偿度 degree of compensation Mxsa-?R;v
高抗 high voltage shunt reactor [.'|_l
无功补偿 reactive power compensation )72+\C[*~r
故障 fault l7259Ro~
调节 regulation +N9X/QFKV
裕度 magin EQyC1j
三相故障 three phase fault )oDHeU<&
故障切除时间 fault clearing time % X+:o]T
极限切除时间 critical clearing time ;R5`"`
切机 generator triping qL&[K>2z
高顶值 high limited value F2dHH^
强行励磁 reinforced excitation ^ft>@=K(|
线路补偿器 LDC(line drop compensation) m!4ndO;0vh
机端 generator terminal djQH1^(IU
静态 static (state) *:YiimOY"
动态 dynamic (state) I<4Pur>"
单机无穷大系统 one machine - infinity bus system 7he,?T)vD
机端电压控制 AVR
(GuzN
电抗 reactance 5k3n\sqZA
电阻 resistance be{H$9'
功角 power angle HU}7zK2
有功(功率) active power F/bT)QT<f
无功(功率) reactive power ^f
&XQQY
功率因数 power factor :q7Wy&ow
无功电流 reactive current |vwVghC
下降特性 droop characteristics 5C*Pd
Wpl
斜率 slope yAs>{6%-
额定 rating YTpSHpf@
变比 ratio b#Z{{eLny
参考值 reference value *@r/5pM2}
电压互感器 PT zh`<WN&H
分接头 tap }DEg-j,F
下降率 droop rate Xe'x[(l
仿真分析 simulation analysis fue(UMF~
传递函数 transfer function C'@i/+
框图 block diagram <#y[gTJ<'>
受端 receive-side JEwa
&
裕度 margin p8H'{f\G
同步 synchronization k>Vci{v
失去同步 loss of synchronization u+e{Mim
阻尼 damping y8Z_Itlf
摇摆 swing +I:Unp
保护断路器 circuit breaker B6nX$T4zP
电阻:resistance vq0Tk
bzs
电抗:reactance PbgP\JeX
阻抗:impedance 6V:U(g
电导:conductance r1m]HFN
电纳:susceptance