1 backplane 背板 8BS$6Pa
2 Band gap voltage reference 带隙电压参考 {[H#lX 4
3 benchtop supply 工作台电源 ;''S};
4 Block Diagram 方块图 5 Bode Plot 波特图 1U~'8=-
6 Bootstrap 自举 -Vg0J6x
7 Bottom FET Bottom FET 0j#$Swa
8 bucket capcitor 桶形电容 _#P5j#
9 chassis 机架 C}XB%:5H5
10 Combi-sense Combi-sense u*Y!=IT
11 constant current source 恒流源 wE <PXBl\b
12 Core Sataration 铁芯饱和 c3Ig4 n0Y>
13 crossover frequency 交叉频率 ok&v+A
14 current ripple 纹波电流 H:1F=$0I9
15 Cycle by Cycle 逐周期 :SD3
16 cycle skipping 周期跳步 OJcI0(G
17 Dead Time 死区时间 E&W4`{6K4
18 DIE Temperature 核心温度 %%O_:@9x,
19 Disable 非使能,无效,禁用,关断 Mr K?,7*Xi
20 dominant pole 主极点 +w3k_^X9c
21 Enable 使能,有效,启用 #>$w9}gFi
22 ESD Rating ESD额定值 =6w(9O
23 Evaluation Board 评估板 BS3BJwf;
f
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. i6h0_q8
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超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 rlDJHR6
25 Failling edge 下降沿 {-5b[m(
26 figure of merit 品质因数 );F
/P0P
27 float charge voltage 浮充电压 [;INVUwG^
28 flyback power stage 反驰式功率级 $J:~jY/J
29 forward voltage drop 前向压降 l>>,~
30 free-running 自由运行 '-X913eG!
31 Freewheel diode 续流二极管 dNs<`2m
32 Full load 满负载 33 gate drive 栅极驱动 oakm{I|k}
34 gate drive stage 栅极驱动级 1Yv#4t
35 gerber plot Gerber 图 pK2n'4
C
36 ground plane 接地层 obIYC
37 Henry 电感单位:亨利 {7q +3f <
38 Human Body Model 人体模式 6sRKbp|r7
39 Hysteresis 滞回 w.0]>/C
40 inrush current 涌入电流 9=^4p=1J
41 Inverting 反相 @)wNINvD
42 jittery 抖动 Wr;?t!
43 Junction 结点 <wt9K2,
44 Kelvin connection 开尔文连接 +4p gPv
45 Lead Frame 引脚框架 d `+cNKf
46 Lead Free 无铅 V$ss[fX
47 level-shift 电平移动 6JL:p{RLi
48 Line regulation 电源调整率 ma M8:\
49 load regulation 负载调整率 VlFDMw.4.+
50 Lot Number 批号 h|'T'l&z
51 Low Dropout 低压差 vV9q5Bj:
52 Miller 密勒 53 node 节点 SA$1rqU=
54 Non-Inverting 非反相 'xp&)gL
55 novel 新颖的 |[lM2
56 off state 关断状态 Ijj]_V{,
57 Operating supply voltage 电源工作电压 u
kKp,1xz
58 out drive stage 输出驱动级 [P_1a`b
59 Out of Phase 异相 7[ra#>e8'
60 Part Number 产品型号 .@ElfPP(L
61 pass transistor pass transistor \TBY)_[ {
62 P-channel MOSFET P沟道MOSFET FPPGf!Eq
63 Phase margin 相位裕度 _7zER6#}
64 Phase Node 开关节点 (yel
65 portable electronics 便携式电子设备 8.Ty
,7Z
66 power down 掉电 M 9b_Q
67 Power Good 电源正常 #zcnc$x\
68 Power Groud 功率地 L);kwx7{LW
69 Power Save Mode 节电模式 f&ym'S
70 Power up 上电 Gv}h/zu-
71 pull down 下拉 #_bSWV4
72 pull up 上拉 Z*|qbu)
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) ^dR5fAS
74 push pull converter 推挽转换器 o5FBqt
75 ramp down 斜降 WV"{oED
76 ramp up 斜升 ~T[m{8uh
77 redundant diode 冗余二极管 [
Q6v #I
78 resistive divider 电阻分压器 `QlChxd
79 ringing 振 铃 %h%^i
80 ripple current 纹波电流 8W"~>7/>D
81 rising edge 上升沿 ~l@SGHx
82 sense resistor 检测电阻
:RW0<
83 Sequenced Power Supplys 序列电源 \TrhJ
84 shoot-through 直通,同时导通 z<jWy$Ta;
85 stray inductances. 杂散电感 i- E~ZfJ
86 sub-circuit 子电路 'I_\ELb_
87 substrate 基板 /*lSpsBn
88 Telecom 电信 bewi.$E{
89 Thermal Information 热性能信息 %o+VZEH3
90 thermal slug 散热片 *Gm%Dn
91 Threshold 阈值 PU^Z7T);
92 timing resistor 振荡电阻 ;o#R(m@Lx
93 Top FET Top FET Ee##:I[z
94 Trace 线路,走线,引线 |T9p#) ec2
95 Transfer function 传递函数 08S|$_
96 Trip Point 跳变点 $vdGkz@6
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) HzT"{N9
98 Under Voltage Lock Out (UVLO) 欠压锁定 QO)Q%K,
99 Voltage Reference 电压参考 fO.gfHI
100 voltage-second product 伏秒积 lfKrd3KS_
101 zero-pole frequency compensation 零极点频率补偿 6;GL>))'
102 beat frequency 拍频 ;ePmN|rq;
103 one shots 单击电路 E#T-2^nD
104 scaling 缩放 U&/Jh^Yy
105 ESR 等效串联电阻 [Page] h"')D
106 Ground 地电位 q7wd9 6G:
107 trimmed bandgap 平衡带隙 GjA;o3(
108 dropout voltage 压差 y?M99Vo4?
109 large bulk capacitance 大容量电容 r
8,6qP[
110 circuit breaker 断路器 Au"[2cG
111 charge pump 电荷泵 g0^%X9s
112 overshoot 过冲 2`l$uEI3oJ
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印制电路printed circuit M*E4:A9_M
印制线路 printed wiring ewk62{
印制板 printed board UtiS?w6
印制板电路 printed circuit board pscCXk(|A`
印制线路板 printed wiring board LeY\{w
印制元件 printed component Fp06a!7<
印制接点 printed contact R {+Rvk
印制板装配 printed board assembly ;/SM^&Y
板 board /"Om-DK%
刚性印制板 rigid printed board 1z$;>+g<
挠性印制电路 flexible printed circuit {JzX`Z30l
挠性印制线路 flexible printed wiring ]`y4n=L.
齐平印制板 flush printed board <Dt,FWWkv'
金属芯印制板 metal core printed board kN;l@>
金属基印制板 metal base printed board /z,sM"d
多重布线印制板 mulit-wiring printed board j+J)S1
塑电路板 molded circuit board Sz"J-3b^
散线印制板 discrete wiring board r 06}@ 7
微线印制板 micro wire board aIZ@5w"7
积层印制板 buile-up printed board iR(A^
表面层合电路板 surface laminar circuit ][6$$Lz
埋入凸块连印制板 B2it printed board L$@^EENS
载芯片板 chip on board KC?h sID{
埋电阻板 buried resistance board uyxU>yHV<g
母板 mother board n4ce)N@
子板 daughter board "a6
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背板 backplane GOa](oD}
裸板 bare board M:nXn7)+
键盘板夹心板 copper-invar-copper board ZqkP# ]+Y'
动态挠性板 dynamic flex board I
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静态挠性板 static flex board n\.K:t[:
可断拼板 break-away planel 7
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电缆 cable l8%x(N4
挠性扁平电缆 flexible flat cable (FFC) P~i^V;g
薄膜开关 membrane switch Z%XBuq:BY
混合电路 hybrid circuit yK0Q,
厚膜 thick film .F?yt5{5No
厚膜电路 thick film circuit )"jG)c^1*
薄膜 thin film ||}|=Sz
薄膜混合电路 thin film hybrid circuit J~DP*}~XK
互连 interconnection 1p23&\\~
导线 conductor trace line ]^&DEj{
齐平导线 flush conductor rr*",a"}m
传输线 transmission line /[GOs*{zB
跨交 crossover CjOaw$s
板边插头 edge-board contact :4<+)r26
增强板 stiffener Rmn| "ZK
基底 substrate HQaKG4Z
基板面 real estate [t<^WmgtxL
导线面 conductor side X`:(-3T
元件面 component side l?a(=
焊接面 solder side Fx0K.Q2Y0
导电图形 conductive pattern r1-?mMSU&
非导电图形 non-conductive pattern /pFg<
基材 base material vf~q%+UqK
层压板 laminate C\.? 3
覆金属箔基材 metal-clad bade material NV*aHci
覆铜箔层压板 copper-clad laminate (CCL) xh@H@Q\
复合层压板 composite laminate >('L2]4\v
薄层压板 thin laminate I\Y/*u
基体材料 basis material Otn,(j;u
预浸材料 prepreg eOD;@4lR
粘结片 bonding sheet WaN0$66[:
预浸粘结片 preimpregnated bonding sheer ePIBg(
环氧玻璃基板 epoxy glass substrate aAu
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预制内层覆箔板 mass lamination panel `wB(J%w
内层芯板 core material 68Wm=j.m
粘结层 bonding layer p."pI Bd
粘结膜 film adhesive _7]5Q
无支撑胶粘剂膜 unsupported adhesive film 1<<`T%&
覆盖层 cover layer (cover lay) 20zIO.&o
增强板材 stiffener material =35EG{W(
铜箔面 copper-clad surface y= cBpC
去铜箔面 foil removal surface @6
gA4h
层压板面 unclad laminate surface >Bskw2
基膜面 base film surface Y$Js5K@F
胶粘剂面 adhesive faec A7+eWg{
原始光洁面 plate finish TxN#3m?G
粗面 matt finish *ta|,
剪切板 cut to size panel yXppu[=
超薄型层压板 ultra thin laminate `8xe2=Ub
A阶树脂 A-stage resin %=S^{A
B阶树脂 B-stage resin kd|@.
C阶树脂 C-stage resin q'3=
环氧树脂 epoxy resin 0D|^S<z6
酚醛树脂 phenolic resin Qgo0uuM
聚酯树脂 polyester resin @ L% 3}
聚酰亚胺树脂 polyimide resin 9j:?s;B
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin `B
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丙烯酸树脂 acrylic resin `"zX<
三聚氰胺甲醛树脂 melamine formaldehyde resin +X
cB 5S>
多官能环氧树脂 polyfunctional epoxy resin ]8d]nftY
溴化环氧树脂 brominated epoxy resin T9RR.
ng
环氧酚醛 epoxy novolac ' "~|L>F%G
氟树脂 fluroresin +S^Uw'L$=T
硅树脂 silicone resin jp=^$rS6[
硅烷 silane ;|soc:aH
聚合物 polymer {{SQL)yJ
无定形聚合物 amorphous polymer yFl@z
结晶现象 crystalline polamer
Rc0OEs%7P
双晶现象 dimorphism Gow_a'
共聚物 copolymer `-]*Qb+
合成树脂 synthetic SL pd~ZC?
热固性树脂 thermosetting resin [Page] _D$|lk-
热塑性树脂 thermoplastic resin B6MMn.
感光性树脂 photosensitive resin ,hT t]w
环氧值 epoxy value r$=iM:kERC
双氰胺 dicyandiamide 8g(%6 ET
粘结剂 binder yGZb
胶粘剂 adesive y*vs}G'W
固化剂 curing agent 6n
阻燃剂 flame retardant $w)yQ %
遮光剂 opaquer "CT'^d+
增塑剂 plasticizers zK k;&y|{
不饱和聚酯 unsatuiated polyester db@i*Bf
聚酯薄膜 polyester 8nt:peJ$+
聚酰亚胺薄膜 polyimide film (PI) DFVaZN?~
聚四氟乙烯 polytetrafluoetylene (PTFE) $;@^coz9U
增强材料 reinforcing material Dx 4?6
折痕 crease #J)sz,)(
云织 waviness yJppPIW^
鱼眼 fish eye CbS- Rz:
毛圈长 feather length O<Ht-TN&
厚薄段 mark [Sg1\UTl
裂缝 split 8JJqEkQ
捻度 twist of yarn pLDseEr<
浸润剂含量 size content g9<*+fV
2$
浸润剂残留量 size residue 5^ARC^v
处理剂含量 finish level ^UEI`_HO0
偶联剂 couplint agent
J5*krH2i
断裂长 breaking length Eu l,1yR
吸水高度 height of capillary rise :JV=Kt
湿强度保留率 wet strength retention V~+Oil6sa
白度 whitenness O:{I9V-=>s
导电箔 conductive foil #[qmhU{s
铜箔 copper foil 5T:e4U&
压延铜箔 rolled copper foil }XX)U_x
光面 shiny side 8jMw7ti
粗糙面 matte side -ce N}Cb3
处理面 treated side /v
U$62KA
防锈处理 stain proofing jdK~]eld=
双面处理铜箔 double treated foil 0x4Xs
模拟 simulation ~ZweP$l
逻辑模拟 logic simulation mHM38T9C%
电路模拟 circit simulation :p;!\4)u
时序模拟 timing simulation Z[)t34EY"
模块化 modularization `J'xVq#O
设计原点 design origin "n^h'// mn
优化(设计) optimization (design) po4seW!
供设计优化坐标轴 predominant axis l<ag\ d
表格原点 table origin ;ug&v
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元件安置 component positioning %\6|fKB4<
比例因子 scaling factor Nv,1F
扫描填充 scan filling ['~3"lK^O
矩形填充 rectangle filling s{(aW5$!s
填充域 region filling f7Y0L8D
实体设计 physical design @i'RIL}
逻辑设计 logic design 9.{u2a\
逻辑电路 logic circuit 8`v+yHjG
层次设计 hierarchical design MRR 5j;4GK
自顶向下设计 top-down design %YkJA:
自底向上设计 bottom-up design f*,jhJ_I
费用矩阵 cost metrix $A;jl`ng
元件密度 component density 5Ev9u),D+v
自由度 degrees freedom ]i(tou-[i
出度 out going degree x{6KsYEY
入度 incoming degree ~Z9Eb|B
曼哈顿距离 manhatton distance VUpa^R
欧几里德距离 euclidean distance %PRG;kR
网络 network P"Lk(gY
阵列 array #` Q3Z}C
段 segment X;lL$
逻辑 logic =iW!Mq
逻辑设计自动化 logic design automation 'r~,~AI
分线 separated time PIR#M('
分层 separated layer @<=x fs
定顺序 definite sequence VkTdpeBV
导线(通道) conduction (track) mk(O..)2
导线(体)宽度 conductor width |5oK04<
导线距离 conductor spacing
Yz(k4K
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导线层 conductor layer N[~{'i
导线宽度/间距 conductor line/space +;^UxW
第一导线层 conductor layer No.1 x)N$.7'9OJ
圆形盘 round pad H=Scrvfx
方形盘 square pad I@Pp[AyG
菱形盘 diamond pad ,n<t':-
长方形焊盘 oblong pad #S)]`YW
子弹形盘 bullet pad 8mj Pa^A
泪滴盘 teardrop pad me:~q#k
雪人盘 snowman pad O#LG$Y
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形盘 V-shaped pad V I,TJV)B
环形盘 annular pad #hG0{_d7
非圆形盘 non-circular pad Uc%n{
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隔离盘 isolation pad ?QxI2J
非功能连接盘 monfunctional pad W!vN(1:(
偏置连接盘 offset land <Hd8Jd4f
腹(背)裸盘 back-bard land c%y(Z5
盘址 anchoring spaur H'KCIqo
连接盘图形 land pattern j5Kw0Wy7
连接盘网格阵列 land grid array `EKmp|B_p_
孔环 annular ring Tzr_K
元件孔 component hole |osu4=s|
安装孔 mounting hole wpgO09
支撑孔 supported hole MDV<[${
非支撑孔 unsupported hole G>Fk
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导通孔 via =og>& K
镀通孔 plated through hole (PTH) TL&