1 backplane 背板 \NPmym_6J
2 Band gap voltage reference 带隙电压参考 4h|c<-`>t
3 benchtop supply 工作台电源 ;r<^a6B
4 Block Diagram 方块图 5 Bode Plot 波特图 Ayxkv)%:@)
6 Bootstrap 自举 *\
R ]NV
7 Bottom FET Bottom FET p M4 :#%V
8 bucket capcitor 桶形电容 0XE4<U
9 chassis 机架 ,Lr.9I.
10 Combi-sense Combi-sense rC5
p-B%
11 constant current source 恒流源 Kp%2k^U
12 Core Sataration 铁芯饱和 -t!~%_WCv
13 crossover frequency 交叉频率 m|n
14 current ripple 纹波电流 <^#,_o,!
15 Cycle by Cycle 逐周期 ~vm%6CABM
16 cycle skipping 周期跳步 LBYMCY
17 Dead Time 死区时间 +r2+X:#~T
18 DIE Temperature 核心温度 :CG`t?N9M
19 Disable 非使能,无效,禁用,关断 +$ 'Zf0U
20 dominant pole 主极点 hOjk3
k
21 Enable 使能,有效,启用 oB(?_No7
22 ESD Rating ESD额定值 u^^[Q2LDU}
23 Evaluation Board 评估板 "L IF.)
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. =^M/{51j
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 XP!S$Q]D
25 Failling edge 下降沿 <cps2*'
26 figure of merit 品质因数 8\&X2[oAD
27 float charge voltage 浮充电压 &6/[B_.
28 flyback power stage 反驰式功率级 xQ7l~O
b
29 forward voltage drop 前向压降 "H'B*vc-
30 free-running 自由运行 -*1d!
31 Freewheel diode 续流二极管 ^O?/yV?4c
32 Full load 满负载 33 gate drive 栅极驱动 &*M!lxDN
34 gate drive stage 栅极驱动级 T<n
35 gerber plot Gerber 图 u-QB.iQ+s
36 ground plane 接地层 ,0M_Bk"
37 Henry 电感单位:亨利 '$i:
2mn,
38 Human Body Model 人体模式 BtkOnbz8X
39 Hysteresis 滞回 i1 }:8Unxf
40 inrush current 涌入电流 ^UP`%egR
41 Inverting 反相 0yk]o5a++
42 jittery 抖动 X8Bd3-B
43 Junction 结点 p_RsU`[
44 Kelvin connection 开尔文连接 94'&b=5+
45 Lead Frame 引脚框架 .]8ZwAs=&
46 Lead Free 无铅 zfJT,h-{
47 level-shift 电平移动 z O-z%y
48 Line regulation 电源调整率 /CrSu
49 load regulation 负载调整率 qqjwJ!@P
50 Lot Number 批号 is?{MJZ_
51 Low Dropout 低压差 *3+4[WT0]a
52 Miller 密勒 53 node 节点 ; 5*&xz
54 Non-Inverting 非反相 Zu*F#s!tUI
55 novel 新颖的 j*|VctM
56 off state 关断状态 yuh *
57 Operating supply voltage 电源工作电压 zYH&i6nj
58 out drive stage 输出驱动级 L^1NY3=$
59 Out of Phase 异相 aC]$k'71
60 Part Number 产品型号 OAgniLv
61 pass transistor pass transistor Cwv9 a^
62 P-channel MOSFET P沟道MOSFET 'p^t^=dQ
63 Phase margin 相位裕度 y6g&Y.:o
64 Phase Node 开关节点 xK>*yV
65 portable electronics 便携式电子设备 /J]5H
66 power down 掉电 /!0={G
67 Power Good 电源正常 &h}#HS>l
68 Power Groud 功率地 |Tv#4st
69 Power Save Mode 节电模式 t*p71U4+I
70 Power up 上电 = }~hWL
71 pull down 下拉 #$.;'#u'so
72 pull up 上拉 %Tfbsyf%f
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) " s,1%Ltt
74 push pull converter 推挽转换器 ?e%ZOI
75 ramp down 斜降 p'Y^X
76 ramp up 斜升 CT&|QH{
77 redundant diode 冗余二极管 i}cRi&2[
78 resistive divider 电阻分压器 8=!D$t\3
79 ringing 振 铃 Lc}LGq!
80 ripple current 纹波电流 n'"/KS+_
81 rising edge 上升沿 &5>Kl}7
82 sense resistor 检测电阻 W~)}xy
83 Sequenced Power Supplys 序列电源 N"Z{5A
84 shoot-through 直通,同时导通 hqD*z6aH
85 stray inductances. 杂散电感 P?%s
#I:
86 sub-circuit 子电路 ez7A4>/
87 substrate 基板 ^vZSUfS
88 Telecom 电信 ~?l |
[
89 Thermal Information 热性能信息 Jx:Y-$
90 thermal slug 散热片 \P[Y`LYL
91 Threshold 阈值 C2!|OQ9A2
92 timing resistor 振荡电阻 =0
#OU
93 Top FET Top FET Lw1Yvtn
94 Trace 线路,走线,引线 ,Co|-DYf}
95 Transfer function 传递函数 )Om*@;r(
96 Trip Point 跳变点 p#-Z4- `
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) -uS!\
98 Under Voltage Lock Out (UVLO) 欠压锁定 Zj(AJ* r
99 Voltage Reference 电压参考 x5pdS:
100 voltage-second product 伏秒积 #`^}PuQ
101 zero-pole frequency compensation 零极点频率补偿 a,,ex i
102 beat frequency 拍频 j;zM{qu_
103 one shots 单击电路 GC-5X`Sq
104 scaling 缩放 Y/F6\oh
105 ESR 等效串联电阻 [Page] t5Sy V:fP
106 Ground 地电位 I{|O "8
107 trimmed bandgap 平衡带隙 Cp\6W[2+B
108 dropout voltage 压差 w?L6!) oiz
109 large bulk capacitance 大容量电容 7g^]:3f!
110 circuit breaker 断路器 _;"il%l=1
111 charge pump 电荷泵 i$Ul(?
112 overshoot 过冲 ,~U>'&M;
H_7/%noS5
印制电路printed circuit gb1V~
印制线路 printed wiring }CSDV9).S
印制板 printed board &C_j\7Dq
印制板电路 printed circuit board 3Tcms/n
印制线路板 printed wiring board j^*dmX
印制元件 printed component hPB9@hT$
印制接点 printed contact rI{; I DV
印制板装配 printed board assembly hPkp;a #
板 board "nynl'Ryk
刚性印制板 rigid printed board M/f<A$xx_
挠性印制电路 flexible printed circuit 38B2|x
挠性印制线路 flexible printed wiring gT.sjd
齐平印制板 flush printed board &u."A3(
金属芯印制板 metal core printed board "S[450%
金属基印制板 metal base printed board ,>a&"V^k
多重布线印制板 mulit-wiring printed board "Fr.fhh'~
塑电路板 molded circuit board bL`TySX
散线印制板 discrete wiring board k t#fMd$
微线印制板 micro wire board (TtkFo'!U
积层印制板 buile-up printed board l:~/<`o
表面层合电路板 surface laminar circuit ;fTKfa
埋入凸块连印制板 B2it printed board tAd%#:K
载芯片板 chip on board LVM%"sd?
埋电阻板 buried resistance board dlh)gp;
母板 mother board 5Pc;5
o0C
子板 daughter board v4TQX<0s
背板 backplane CZwXTHe
裸板 bare board B3`5O[6
键盘板夹心板 copper-invar-copper board Vr)S{k-Q
动态挠性板 dynamic flex board o'aEY<mZ7
静态挠性板 static flex board Y1\ }5k{>
可断拼板 break-away planel &J]K3w1p
电缆 cable "]*&oQCI
挠性扁平电缆 flexible flat cable (FFC) 1t~G|zhX
薄膜开关 membrane switch nF]W,@u"h
混合电路 hybrid circuit eb\K "ec"
厚膜 thick film /U*C\ xMm
厚膜电路 thick film circuit Tk[ $5u*,
薄膜 thin film !PlEO 2at
薄膜混合电路 thin film hybrid circuit xj)F55e?
互连 interconnection O`kl\K*R7
导线 conductor trace line e2Pcm_Ahv*
齐平导线 flush conductor {w O|)|
传输线 transmission line
Mx ?d
跨交 crossover cl3K<'D
板边插头 edge-board contact Qy<P463A(l
增强板 stiffener ?zMHP#i
基底 substrate 79j+vH!zh
基板面 real estate p`dU2gV
导线面 conductor side Et_bH%0
元件面 component side Mj3A5;#
焊接面 solder side 1-uxC^u?|#
导电图形 conductive pattern %wg-=;d4
非导电图形 non-conductive pattern 7F7{)L
基材 base material :pY/-Cgv
层压板 laminate ;`4&Rm9n?
覆金属箔基材 metal-clad bade material Rok7n1gW
覆铜箔层压板 copper-clad laminate (CCL) [S%_In
复合层压板 composite laminate NNR`!Pty
薄层压板 thin laminate | j`@eF/"
基体材料 basis material 1=c\Rr9]
预浸材料 prepreg eK=xrk
粘结片 bonding sheet mDABH@R
预浸粘结片 preimpregnated bonding sheer ah&D%8E
环氧玻璃基板 epoxy glass substrate f*% D$Mqg
预制内层覆箔板 mass lamination panel X7MM2V
内层芯板 core material 4he GnMD
粘结层 bonding layer ek\ xx
粘结膜 film adhesive 4[r0G+
无支撑胶粘剂膜 unsupported adhesive film 'F3f+YD
覆盖层 cover layer (cover lay) 2;`1h[,-^
增强板材 stiffener material _Ey9G
铜箔面 copper-clad surface _/$Bpr{R
去铜箔面 foil removal surface n
ATuD
层压板面 unclad laminate surface ^7cGq+t
基膜面 base film surface \ a<h/4#|
胶粘剂面 adhesive faec Qj.#)R
原始光洁面 plate finish G6P?2@
粗面 matt finish ZY= {8T@
剪切板 cut to size panel ::lKL
超薄型层压板 ultra thin laminate GW@;}m(
A阶树脂 A-stage resin L#?Ek-
B阶树脂 B-stage resin X/!o\yyT
C阶树脂 C-stage resin 6:5I26
环氧树脂 epoxy resin 8 +/rlHp
酚醛树脂 phenolic resin x,+{9
聚酯树脂 polyester resin ~"H,/m%2o
聚酰亚胺树脂 polyimide resin _ QI\
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin 6Q@j
丙烯酸树脂 acrylic resin ItVWO:x&v
三聚氰胺甲醛树脂 melamine formaldehyde resin IB"w&