1 backplane 背板 |'P]GK
2 Band gap voltage reference 带隙电压参考 0
HGM4[)=
3 benchtop supply 工作台电源 q)LMm7
4 Block Diagram 方块图 5 Bode Plot 波特图 ~ELNyI11
6 Bootstrap 自举 _ky,;9G]
7 Bottom FET Bottom FET iHeN9 cl
8 bucket capcitor 桶形电容 Aydm2!l1
9 chassis 机架 zKw`Md
10 Combi-sense Combi-sense -~s!73pDY
11 constant current source 恒流源 ]op}y0
12 Core Sataration 铁芯饱和 jN{Xfjmfv
13 crossover frequency 交叉频率 PmkR3<=leg
14 current ripple 纹波电流 0Vlk;fIh
15 Cycle by Cycle 逐周期 N4^-`
16 cycle skipping 周期跳步 X
iS1\*
17 Dead Time 死区时间 /1"(cQ%?
18 DIE Temperature 核心温度 'Y*E<6:
19 Disable 非使能,无效,禁用,关断 ;YA(|h<
20 dominant pole 主极点 o<|cA5f\
21 Enable 使能,有效,启用 qaY1xPWz"
22 ESD Rating ESD额定值 oe%}?u
23 Evaluation Board 评估板 >p)MawT]
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. (!ZM{Js%
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 VCY\be
25 Failling edge 下降沿 $G8E 3|k
26 figure of merit 品质因数 `z{%(_+[
27 float charge voltage 浮充电压 'qZW,],5
28 flyback power stage 反驰式功率级 "fG8?)d;
29 forward voltage drop 前向压降 9!6f-K
30 free-running 自由运行 kE:nsXI
)
31 Freewheel diode 续流二极管 DK$X2B"c V
32 Full load 满负载 33 gate drive 栅极驱动 -m)X]]~C
34 gate drive stage 栅极驱动级 ~Mx!^
35 gerber plot Gerber 图 %SX|o-B~.o
36 ground plane 接地层 CnpV:>V=
37 Henry 电感单位:亨利 .X@FXx&
38 Human Body Model 人体模式 I KqQ>Z-q~
39 Hysteresis 滞回 T=iJGRctB
40 inrush current 涌入电流 DnC{YK
41 Inverting 反相 =Q+;=-1
42 jittery 抖动 wG~`[>y (
43 Junction 结点 =y
[M\m
44 Kelvin connection 开尔文连接 Z'4./
45 Lead Frame 引脚框架 H<VTa? n
46 Lead Free 无铅 Kf>A\l^X7
47 level-shift 电平移动 g
l^<Q
48 Line regulation 电源调整率 k`So -e-
49 load regulation 负载调整率 R9'b-5q
50 Lot Number 批号 tXoWwQD;Y
51 Low Dropout 低压差 wLi4G@jJ
52 Miller 密勒 53 node 节点 V}J)\VZ2#
54 Non-Inverting 非反相 }T; P~aG
55 novel 新颖的 kW*f.!
56 off state 关断状态 qs1 ?IYD
57 Operating supply voltage 电源工作电压 GC?ON0g5s
58 out drive stage 输出驱动级 % 5m/
59 Out of Phase 异相 O#F
60 Part Number 产品型号 kqM045W7
61 pass transistor pass transistor 1$D_6U:H0
62 P-channel MOSFET P沟道MOSFET qlb-
jL
63 Phase margin 相位裕度 9{(.Il J>
64 Phase Node 开关节点 ySx>LuY#3
65 portable electronics 便携式电子设备 /q<__N
66 power down 掉电 :# .<[
67 Power Good 电源正常 [Yo,*,y31
68 Power Groud 功率地 9Xj7~,
69 Power Save Mode 节电模式 RZHd9v$
70 Power up 上电 N9jH\0nG
71 pull down 下拉 T;L>;E>B
72 pull up 上拉 'JCZ]pZ
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) xC{qV,
74 push pull converter 推挽转换器 :ctu5{"UJ
75 ramp down 斜降 U@HK+C"M|
76 ramp up 斜升 )we}6sE"
77 redundant diode 冗余二极管 vK9E
78 resistive divider 电阻分压器 b:Wm8pp?
79 ringing 振 铃 G+%zn|
80 ripple current 纹波电流 ]!I7Y.w6
81 rising edge 上升沿 pnjXf.g"O
82 sense resistor 检测电阻 eZSNNgD<:
83 Sequenced Power Supplys 序列电源 q?4p)@#
84 shoot-through 直通,同时导通 v-#Q7T
85 stray inductances. 杂散电感 SSPHhAeH8
86 sub-circuit 子电路 ^5H >pat
87 substrate 基板 ,{BaePMp
88 Telecom 电信 t/cY=Wp
89 Thermal Information 热性能信息 U&Wt%U{
90 thermal slug 散热片 AfX}y+Ah
91 Threshold 阈值 jF0jkj1&/[
92 timing resistor 振荡电阻 ?$*SjZt
93 Top FET Top FET j/fzzI0@
94 Trace 线路,走线,引线 6G
#}Q/
95 Transfer function 传递函数 cl]Mi
"3_
96 Trip Point 跳变点 W8ouO+wK
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) ;5zz<;Zy
98 Under Voltage Lock Out (UVLO) 欠压锁定 7s/u(~d)
99 Voltage Reference 电压参考 vbb5f #WZ
100 voltage-second product 伏秒积 bmfI~8
101 zero-pole frequency compensation 零极点频率补偿 [P&7i57
102 beat frequency 拍频 1DE1.1
103 one shots 单击电路 ]L9s%]o
104 scaling 缩放 MCS8y+QK
105 ESR 等效串联电阻 [Page] 4kBaB
106 Ground 地电位 ^G4Py<s
107 trimmed bandgap 平衡带隙 |G?htZF
108 dropout voltage 压差 *v9 2
109 large bulk capacitance 大容量电容 J%x\=Sv
110 circuit breaker 断路器 :c8&N-`
111 charge pump 电荷泵 -=~| ."O
112 overshoot 过冲 n/Sw P
_a6[{_Pc
印制电路printed circuit ZUoxMm
印制线路 printed wiring Hea;?4Vg
印制板 printed board ^>jwh
印制板电路 printed circuit board \/: {)T~
印制线路板 printed wiring board bYEy<7)x
印制元件 printed component H5Z$*4%G
印制接点 printed contact [H6hyG~
印制板装配 printed board assembly %Z):>'
板 board L3@82yPo!
刚性印制板 rigid printed board FFu9&8Y
挠性印制电路 flexible printed circuit j@SQ~AS
挠性印制线路 flexible printed wiring +y&Tf#.V/A
齐平印制板 flush printed board >8k_n
金属芯印制板 metal core printed board gj*+\3KO@a
金属基印制板 metal base printed board E`?3PA8
多重布线印制板 mulit-wiring printed board V:VO[e<e
塑电路板 molded circuit board #vti+A~n,4
散线印制板 discrete wiring board +VO-oFE |
微线印制板 micro wire board ,.OERw
积层印制板 buile-up printed board :I+Gu*0WD
表面层合电路板 surface laminar circuit I@yCTluV$
埋入凸块连印制板 B2it printed board Qa-K$dm%
载芯片板 chip on board `< xn8h9p
埋电阻板 buried resistance board _$
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母板 mother board M<kj_.
子板 daughter board 7Rd'm'l)
背板 backplane (O.d>
裸板 bare board 6)Y.7 XR
键盘板夹心板 copper-invar-copper board n:yTeZ=-s4
动态挠性板 dynamic flex board &6ZD136
静态挠性板 static flex board @~YYD#'vNY
可断拼板 break-away planel |wH5sjT
电缆 cable -uMSe~
挠性扁平电缆 flexible flat cable (FFC) ^/\Of{OZ-
薄膜开关 membrane switch `$W_R[
混合电路 hybrid circuit D-5VC9{
厚膜 thick film Rb%8)t
x
厚膜电路 thick film circuit r76J
N
薄膜 thin film L?WFmn
薄膜混合电路 thin film hybrid circuit *>n;SuT_
互连 interconnection tt0f-:#
导线 conductor trace line j g8fU
齐平导线 flush conductor VGpWg rmHk
传输线 transmission line M%2+y5
跨交 crossover _qw?@478
板边插头 edge-board contact { g/0x,-Z
增强板 stiffener x{n`^;Y1
基底 substrate <{V(.=11
基板面 real estate @?yX!_YC
导线面 conductor side ?o81E2TJO
元件面 component side nxWY7hU
焊接面 solder side BD_Iz A<wK
导电图形 conductive pattern f!I[>&n
非导电图形 non-conductive pattern k <=//r
基材 base material }o(zj=7
层压板 laminate Ju96#v+:
覆金属箔基材 metal-clad bade material /s@o Z{h
覆铜箔层压板 copper-clad laminate (CCL) VUPXO
复合层压板 composite laminate zNxW'?0Z?
薄层压板 thin laminate 8<8:+M}
基体材料 basis material y(CS5v#FG
预浸材料 prepreg bdC8zDD
粘结片 bonding sheet x:),P-~w
预浸粘结片 preimpregnated bonding sheer }<@b=_>S
环氧玻璃基板 epoxy glass substrate S-
pV_Ff
预制内层覆箔板 mass lamination panel 8Kg n"M3
内层芯板 core material ADDSCY=,
粘结层 bonding layer r'^Hg/Jzt
粘结膜 film adhesive }1Gv)l7
无支撑胶粘剂膜 unsupported adhesive film Z>)Bp/-
覆盖层 cover layer (cover lay) jQ2Ot <
增强板材 stiffener material 'ig&$fz b
铜箔面 copper-clad surface w<Wf?a G
去铜箔面 foil removal surface [N7{WSZ&
层压板面 unclad laminate surface iBF|&h(\
基膜面 base film surface mRL"nC
胶粘剂面 adhesive faec v!<gY
m&
原始光洁面 plate finish sf)EMh3Z
粗面 matt finish g.BdlVB\
剪切板 cut to size panel l_o@miG/
超薄型层压板 ultra thin laminate =Je[c,&j$?
A阶树脂 A-stage resin $*e2YQdLo
B阶树脂 B-stage resin -w9pwB
C阶树脂 C-stage resin }=<
环氧树脂 epoxy resin N5Q[n d
酚醛树脂 phenolic resin ^hc!FD
聚酯树脂 polyester resin &,zq%;-f
聚酰亚胺树脂 polyimide resin 8K:y\1
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin NW]Lj>0Y
丙烯酸树脂 acrylic resin vHyC; 4'
三聚氰胺甲醛树脂 melamine formaldehyde resin ~;l@|7wGz
多官能环氧树脂 polyfunctional epoxy resin :r{<zd>;
溴化环氧树脂 brominated epoxy resin W>) M5t4i
环氧酚醛 epoxy novolac )J2mM
氟树脂 fluroresin t;W0"ci9
硅树脂 silicone resin G<}()+L
硅烷 silane PVe
xa|aaX
聚合物 polymer (}Z@R#njH
无定形聚合物 amorphous polymer #.rdQ,)<
结晶现象 crystalline polamer
e?0l"
双晶现象 dimorphism [tlI!~Z
共聚物 copolymer \pPY37l
合成树脂 synthetic >0/i[k-dk
热固性树脂 thermosetting resin [Page] C _'%NlJ'
热塑性树脂 thermoplastic resin idLWe9gC
感光性树脂 photosensitive resin 4{y)TZ
环氧值 epoxy value wH>a~C:
双氰胺 dicyandiamide Gr*r=s
粘结剂 binder J1( 9QN[w
胶粘剂 adesive 7%5z p|3
固化剂 curing agent k.uH~S _
阻燃剂 flame retardant aOlT;h
遮光剂 opaquer :flx6,7D
增塑剂 plasticizers Vr]id
不饱和聚酯 unsatuiated polyester 2;k*@k-t
聚酯薄膜 polyester JZ)RGSG i
聚酰亚胺薄膜 polyimide film (PI) m8A#~i .
聚四氟乙烯 polytetrafluoetylene (PTFE) 94h]~GqNi
增强材料 reinforcing material -.1y(k^4E
折痕 crease gwLf '
云织 waviness 7I&&bWB
鱼眼 fish eye J?V? R
毛圈长 feather length i6^twK)j
厚薄段 mark ( /=f6^}
裂缝 split A
9( x
捻度 twist of yarn {#ZlM
浸润剂含量 size content joFm]3$;
浸润剂残留量 size residue YN/|$sMD|
处理剂含量 finish level [)H&'5 +F
偶联剂 couplint agent k
Z?=AXu
断裂长 breaking length &TUWW