1 backplane 背板 1! vR
8.
2 Band gap voltage reference 带隙电压参考 o5Pq>Y2T
3 benchtop supply 工作台电源 A`X$jpAn&
4 Block Diagram 方块图 5 Bode Plot 波特图
x,>@IEN7
6 Bootstrap 自举 K +w3YA
7 Bottom FET Bottom FET (U$ F) 7
8 bucket capcitor 桶形电容 {CQA@p:Y}
9 chassis 机架 FE$)[ w,m
10 Combi-sense Combi-sense Qs;bVlp!H
11 constant current source 恒流源 YM1@B`yWE
12 Core Sataration 铁芯饱和 /7P4[~vw
13 crossover frequency 交叉频率 +sgishqn9
14 current ripple 纹波电流 ^P&y9dC.
15 Cycle by Cycle 逐周期 q'K=Ly+
16 cycle skipping 周期跳步 SwSBQq%h]M
17 Dead Time 死区时间 8#7z5:_
18 DIE Temperature 核心温度 GbStqR~^#
19 Disable 非使能，无效，禁用，关断 h\D
y(\
20 dominant pole 主极点 /A <L
21 Enable 使能，有效，启用 G.T}^ xHmL
22 ESD Rating ESD额定值 (zgXhx_!D
23 Evaluation Board 评估板 \!G&:<h
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. 6AZ/whn#
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 RUO,tB|(_;
25 Failling edge 下降沿 8 b|&
26 figure of merit 品质因数 )ALf!E%{
27 float charge voltage 浮充电压 ?N $
28 flyback power stage 反驰式功率级 X<Vko^vlj
29 forward voltage drop 前向压降 #p=/P {*
30 free-running 自由运行 #XC\= pZX
31 Freewheel diode 续流二极管 ~p8-#A)X,)
32 Full load 满负载 33 gate drive 栅极驱动 /p X\)wi
34 gate drive stage 栅极驱动级 Z$HYXm
35 gerber plot Gerber 图 7CM<"pV
36 ground plane 接地层 }v@w(*)h:
37 Henry 电感单位：亨利 g -Z>1V
38 Human Body Model 人体模式 #.Ft PR
39 Hysteresis 滞回 =wI ,H@
40 inrush current 涌入电流 }1d
6d3b
41 Inverting 反相 _~5{l_v|I
42 jittery 抖动 S
G] e^%i
43 Junction 结点 *Pw; ;#\B
44 Kelvin connection 开尔文连接 oD~VK,.
45 Lead Frame 引脚框架
Sn" 1XU
46 Lead Free 无铅 x*bM C&Ea
47 level-shift 电平移动 d
t0?4 d
48 Line regulation 电源调整率 yWt87+%T
49 load regulation 负载调整率 Q@ /wn
50 Lot Number 批号 >RF [0s'-
51 Low Dropout 低压差 JBi<TDm/
52 Miller 密勒 53 node 节点 ddlLS
54 Non-Inverting 非反相 k gWF@"_
55 novel 新颖的 Ou8@7S
56 off state 关断状态 + ?nW
57 Operating supply voltage 电源工作电压 Qmzj1e$6x
58 out drive stage 输出驱动级 (K^9$w]tf
59 Out of Phase 异相 G~u94rw|:
60 Part Number 产品型号 tC-(GDGy5
61 pass transistor pass transistor M/ R#f9W
62 P-channel MOSFET P沟道MOSFET 2-]gHAw%
63 Phase margin 相位裕度 UiaY0 .D
64 Phase Node 开关节点 ykX}T6T
65 portable electronics 便携式电子设备 qK;n>BTe
66 power down 掉电 q9ic j
67 Power Good 电源正常
BNu zlR
68 Power Groud 功率地 c?>Q!sC
69 Power Save Mode 节电模式 'UW7zL5
70 Power up 上电 i&{8a3B
71 pull down 下拉 r`B 8Cik
72 pull up 上拉 f=g/_R2$xN
73 Pulse by Pulse 逐脉冲（Pulse by Pulse） 8$xg\l0?KK
74 push pull converter 推挽转换器 OHM.xw*?.
75 ramp down 斜降 2+
>.Z.pX
76 ramp up 斜升 ak0KrVF
77 redundant diode 冗余二极管 B.Ic8'
78 resistive divider 电阻分压器 YNHn# 98\
79 ringing 振 铃 U#d&#",s
80 ripple current 纹波电流 @j5W4HU
81 rising edge 上升沿 5pE[}@-c9
82 sense resistor 检测电阻 T~=NY, n
83 Sequenced Power Supplys 序列电源 D3(|bSca
84 shoot-through 直通，同时导通 Ny
p5=
85 stray inductances. 杂散电感 :=UeYm
@
86 sub-circuit 子电路 2O`uzT$
87 substrate 基板 ^e<0-uM" s
88 Telecom 电信 e=1&mO?
89 Thermal Information 热性能信息 u+z$+[lm!G
90 thermal slug 散热片 IEjKI"
91 Threshold 阈值 !T6oD]x3
92 timing resistor 振荡电阻 uTBls8
93 Top FET Top FET >77
/e@
94 Trace 线路，走线，引线 I zM =?,`
95 Transfer function 传递函数 g9'50<|J
96 Trip Point 跳变点 M2%<4(UwI
97 turns ratio 匝数比，＝Np / Ns。（初级匝数/次级匝数） <y(>z*T;
98 Under Voltage Lock Out (UVLO) 欠压锁定 2 ,E&}a|;b
99 Voltage Reference 电压参考 -O^ b
100 voltage-second product 伏秒积 r >u0Y
101 zero-pole frequency compensation 零极点频率补偿 DZR k K3
102 beat frequency 拍频 P[%
W[E<
103 one shots 单击电路 .e"De- u
104 scaling 缩放 9%> H}7=
105 ESR 等效串联电阻 [Page] dxUq5`#G,
106 Ground 地电位 Hx 62x X
107 trimmed bandgap 平衡带隙 bx!Sy0PUJ
108 dropout voltage 压差 91jv=>=DM
109 large bulk capacitance 大容量电容 %Kd 8ZNv
110 circuit breaker 断路器 LN " bGe
111 charge pump 电荷泵 `-qSvjX
112 overshoot 过冲 Ga+\b >C
C ZxQz
印制电路printed circuit K>w}(td
印制线路 printed wiring Ep.,2H
印制板 printed board e7>) Z
印制板电路 printed circuit board ORp6
印制线路板 printed wiring board ^qy$M>
印制元件 printed component mQ('X~l
印制接点 printed contact >"5^]o2?~l
印制板装配 printed board assembly xXp\U'Ad~~
板 board {KdC5 1"Nv
刚性印制板 rigid printed board Bl3G_Ep
挠性印制电路 flexible printed circuit T5Sa9\`>
挠性印制线路 flexible printed wiring B`T|M$Ug
齐平印制板 flush printed board !M)!
金属芯印制板 metal core printed board 9kH~+
金属基印制板 metal base printed board t \Fc <
多重布线印制板 mulit-wiring printed board T,`'qZ>
塑电路板 molded circuit board `IFt;J a\6
散线印制板 discrete wiring board Kg~<h B6
微线印制板 micro wire board } sd-X`lZ
积层印制板 buile-up printed board ` {k>I^Pg
表面层合电路板 surface laminar circuit HI,1~ J w+
埋入凸块连印制板 B2it printed board Op~sR ^ez
载芯片板 chip on board D 7 [n^WtL
埋电阻板 buried resistance board ?G* XZ0u~
母板 mother board [qIi_(%o
子板 daughter board B[S.6 "/H
背板 backplane -]+ XTsL
裸板 bare board [j
'Ogm7"
键盘板夹心板 copper-invar-copper board U@ALo
动态挠性板 dynamic flex board agM.-MK
静态挠性板 static flex board *P61q\2Z
可断拼板 break-away planel y@nWa\i G
电缆 cable 67<zBw2
挠性扁平电缆 flexible flat cable (FFC) dY;^JPT
薄膜开关 membrane switch xX{uDMYa;
混合电路 hybrid circuit e\%QHoi>u
厚膜 thick film LCyci1\@
厚膜电路 thick film circuit (W5E\hjJ
薄膜 thin film DcQ^V 4_
薄膜混合电路 thin film hybrid circuit a_`E'BkgU
互连 interconnection /21d%T:}
导线 conductor trace line 2 t<
dCw
齐平导线 flush conductor &A*o Q3
传输线 transmission line t TA6 p
跨交 crossover awHfd5nRS
板边插头 edge-board contact f0IljY!.
增强板 stiffener m{JiF-=u
基底 substrate _-o*3gmbQ
基板面 real estate wf= #w}f
导线面 conductor side v@XQ)95]F
元件面 component side >tr_Ypfv,c
焊接面 solder side r{YyKSL1*K
导电图形 conductive pattern .sbU-_ij@U
非导电图形 non-conductive pattern ngsax1xO
基材 base material >QE^KtZ
层压板 laminate ojs&W]r0Z
覆金属箔基材 metal-clad bade material Zj<oh8
覆铜箔层压板 copper-clad laminate (CCL) p0qQ(
复合层压板 composite laminate ' uo `-Y
薄层压板 thin laminate q-o= lU"
基体材料 basis material _a+0LTo".
预浸材料 prepreg ;wL *
粘结片 bonding sheet d%t]:41=Z
预浸粘结片 preimpregnated bonding sheer C:
kl/9M@
环氧玻璃基板 epoxy glass substrate CBnD)1b\
预制内层覆箔板 mass lamination panel )_ G M&-
内层芯板 core material ]1)@.b;QR
粘结层 bonding layer >, 234ab=d
粘结膜 film adhesive }h +a8@
无支撑胶粘剂膜 unsupported adhesive film nKu`Ta*fX
覆盖层 cover layer (cover lay) R>/M>*C
增强板材 stiffener material }ebw1G
铜箔面 copper-clad surface |GdA0y\v*}
去铜箔面 foil removal surface w?jmi~ 6
层压板面 unclad laminate surface g#9w5Q
基膜面 base film surface Pu/0< Orp7
胶粘剂面 adhesive faec l]sO[`X
原始光洁面 plate finish u8+ <uWB
粗面 matt finish tborRi )
剪切板 cut to size panel M\\T Q(B
超薄型层压板 ultra thin laminate ;f= :~go
A阶树脂 A-stage resin uqTOEHH7
B阶树脂 B-stage resin eb9qg.9Z
C阶树脂 C-stage resin &0(2Z^Z>fw
环氧树脂 epoxy resin sn5N9=\+T
酚醛树脂 phenolic resin +}m j6 I
聚酯树脂 polyester resin KS*W<_I
聚酰亚胺树脂 polyimide resin ` 3pe\s
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Q Aygr4\X^
丙烯酸树脂 acrylic resin '3+S5p8
三聚氰胺甲醛树脂 melamine formaldehyde resin R3?~+ y&
多官能环氧树脂 polyfunctional epoxy resin PO&xi9_
溴化环氧树脂 brominated epoxy resin ;2L=WR%
环氧酚醛 epoxy novolac ^z[s;:-
氟树脂 fluroresin t$l[ 4
R-
硅树脂 silicone resin M#<x2ojW
硅烷 silane \M>AN
Z}
聚合物 polymer U?$v 1 ||
无定形聚合物 amorphous polymer )z/j5tnvm
结晶现象 crystalline polamer Q l&P1|&
双晶现象 dimorphism L'a MXN O
共聚物 copolymer cb'8Li8,j
合成树脂 synthetic )&_{m
K
热固性树脂 thermosetting resin [Page] elKQge
热塑性树脂 thermoplastic resin :\4O9f*5+
感光性树脂 photosensitive resin ~@'|R%jJ
环氧值 epoxy value {/Q pEd>3+
双氰胺 dicyandiamide Z N1QTb
粘结剂 binder ~Rv U+D
胶粘剂 adesive )B}]0`z:P
固化剂 curing agent *
+OAc `8
阻燃剂 flame retardant _F@FcFG1Z*
遮光剂 opaquer >W- e0kkH
增塑剂 plasticizers l\$C)q6O
不饱和聚酯 unsatuiated polyester _^P> @
^
聚酯薄膜 polyester + s[ (CI.b
聚酰亚胺薄膜 polyimide film (PI) 5)T{iPU%X
聚四氟乙烯 polytetrafluoetylene (PTFE) []dRDe;#
增强材料 reinforcing material ^+GN8L Us
折痕 crease zEO
9TuBO
云织 waviness c$e~O-OVD?
鱼眼 fish eye wV5<sH__
毛圈长 feather length
K[?wP>s
厚薄段 mark zcxG%? Q
裂缝 split l@j!j]nE
捻度 twist of yarn xFpJ#S&
浸润剂含量 size content F&c A!~
浸润剂残留量 size residue }\gpO0Ox
处理剂含量 finish level C{2 UPG4 x
偶联剂 couplint agent jBE= Ij
断裂长 breaking length <78> 6u/W%
吸水高度 height of capillary rise \ g0
湿强度保留率 wet strength retention %H} +'.8
白度 whitenness Q| xPm:
导电箔 conductive foil UI8M<
铜箔 copper foil Pv0+`>):
压延铜箔 rolled copper foil 4tu2%Og)?
光面 shiny side gl!3pTC
粗糙面 matte side .pdgRjlSn
处理面 treated side 0j_!)B
防锈处理 stain proofing ,%,}[q?]d
双面处理铜箔 double treated foil 5@v!wms
模拟 simulation x`o_&09;CG
逻辑模拟 logic simulation x1Si&0T0P<
电路模拟 circit simulation i, )kI
时序模拟 timing simulation 7
'f>
模块化 modularization E3gQ`+wNg?
设计原点 design origin l|uN-{ w
优化（设计） optimization (design) Y: byb68
供设计优化坐标轴 predominant axis -7pZRnv
表格原点 table origin L3kms6ch
元件安置 component positioning V'6%G:?0a
比例因子 scaling factor dv Xu?F55
扫描填充 scan filling ] "YG7|E U
矩形填充 rectangle filling BR W
填充域 region filling /\=g;o'
实体设计 physical design ,> ~9 2
逻辑设计 logic design SgY>$gP9S
逻辑电路 logic circuit FJ2^0s/"
层次设计 hierarchical design Af
-{'
自顶向下设计 top-down design ^$T>3@rD B
自底向上设计 bottom-up design Zd~Z`B} &
费用矩阵 cost metrix ;ga~ae=Fg
元件密度 component density 4)"jg[
自由度 degrees freedom `U;4O)`n
出度 out going degree \y0abxIHS
入度 incoming degree BGA.8qWR4
曼哈顿距离 manhatton distance A!j &g(Z"Q
欧几里德距离 euclidean distance cy}2~w&s4
网络 network '7E?|B0],
阵列 array {WC{T2:8
段 segment qvab >U`
逻辑 logic \.*aC)
逻辑设计自动化 logic design automation M<)HJ lr
分线 separated time $I tehy
分层 separated layer :Tjo+vw7$H
定顺序 definite sequence ik ofJ l]9
导线（通道） conduction (track) Q *lZ;~R
导线（体）宽度 conductor width |#MA?oz3T
导线距离 conductor spacing \Mi y+<8$
导线层 conductor layer \Hy~~Zh2
导线宽度/间距 conductor line/space X#p E!mT
第一导线层 conductor layer No.1 0 _%u(?
圆形盘 round pad yuhSP{pv'
方形盘 square pad Z$+0gm\Cnw
菱形盘 diamond pad paiF ah
长方形焊盘 oblong pad v'DL >Y
子弹形盘 bullet pad lJ }lO,g
泪滴盘 teardrop pad 0h#' 3z<
雪人盘 snowman pad {
\Q'eL8
形盘 V-shaped pad V WF:i}+g+^
环形盘 annular pad v_oNM 5w
非圆形盘 non-circular pad P/0 n)
Q
隔离盘 isolation pad B '&%EW]
非功能连接盘 monfunctional pad W**a\[~$
偏置连接盘 offset land 6{1c
S
腹（背）裸盘 back-bard land P iM@iS
盘址 anchoring spaur 4m%_# J{
连接盘图形 land pattern N|8TE7- F|
连接盘网格阵列 land grid array :,:r
孔环 annular ring Z.rKV}yjY
元件孔 component hole ]X{LZ Yk
安装孔 mounting hole _ea!psA0
支撑孔 supported hole >D*L0snjV
非支撑孔 unsupported hole e >MC
3D`5
导通孔 via 1 'Kn:I
镀通孔 plated through hole (PTH) N 0/DPZX7
余隙孔 access hole p"Fj6 T2
盲孔 blind via (hole) K~C*4H:9
埋孔 buried via hole y<.1+TG
埋,盲孔 buried blind via Ga$+x++'*
任意层内部导通孔 any layer inner via hole / 1g_Uv;
全部钻孔 all drilled hole *y
F 9_\n
定位孔 toaling hole rFdovfb
无连接盘孔 landless hole bf::bV?T
中间孔 interstitial hole rT5dv3^MW!
无连接盘导通孔 landless via hole mZ*!$P:vy"
引导孔 pilot hole )CEfG
端接全隙孔 terminal clearomee hole
- x @mS2
准尺寸孔 dimensioned hole [Page] e=TB/W_
在连接盘中导通孔 via-in-pad 3 fM~R+p
孔位 hole location hcwK i
孔密度 hole density h_Q9 c
孔图 hole pattern hQPiGIs
钻孔图 drill drawing r#3(;N{=
装配图assembly drawing k)d LJ<EM
参考基准 datum referan vt@.fT#e
1） 元件设备 KK}^E_v
7k{C'\m
三绕组变压器：three-column transformer ThrClnTrans LEWey bT
双绕组变压器：double-column transformer DblClmnTrans j: \MrYt0H
电容器：Capacitor 9SXFiZA(r
并联电容器：shunt capacitor .[ NB"\<q
电抗器：Reactor ytK h[Uo
母线：Busbar z4 5ImItH
输电线：TransmissionLine +|KnO
发电厂：power plant zT*EpIa+LS
断路器：Breaker b_:]Y<{> f
刀闸(隔离开关)：Isolator nB WVG
分接头：tap , 0MDkXb
电动机：motor -: dUD1
（2） 状态参数 ^ ,d!K2`
VE6
V^6SL
有功：active power V31<~&O~%
无功：reactive power "VRc R
电流：current >PGW>W$
容量：capacity F /IXqj
电压：voltage HSE9-c =
档位：tap position :]v%6i.
有功损耗：reactive loss nK)U.SZ
无功损耗：active loss %l( qyH)*
功率因数：power-factor -O:+?gG
功率：power # 4L[8(+V
功角：power-angle )xy1 DA
电压等级：voltage grade kG^DHEne
空载损耗：no-load loss nm_]2z O
铁损：iron loss ,|<2wn#q
铜损：copper loss 2Xys;Dwx
空载电流：no-load current
pQKR
阻抗：impedance 6*J`2U9Q
正序阻抗：positive sequence impedance 1>r7s*
负序阻抗：negative sequence impedance s{4|eYR
零序阻抗：zero sequence impedance imv [xBA(d
电阻：resistor , `ST Va-
电抗：reactance n*D-01v YP
电导：conductance /'ccFm2
电纳：susceptance @`^+XP K\
无功负载：reactive load 或者QLoad 3Un
q
9
有功负载: active load PLoad J\^ZRu_K
遥测：YC(telemetering) e
C?adCb
遥信：YX
X Cc /\
励磁电流(转子电流)：magnetizing current $vlq ]6V8
定子：stator R @ N
I
功角：power-angle Ri =>evx
上限:upper limit rXPq'k'h#-
下限：lower limit h y3j8?66
并列的：apposable B&ItA76
高压: high voltage aVNBF`
低压：low voltage 8QDs4Bv|
中压：middle voltage ~za=yZo7(
电力系统 power system `z=U-v'H)D
发电机 generator `$vTGkGpY
励磁 excitation [DpGL/Y.
励磁器 excitor YBq u7&
电压 voltage r9McCebIW
电流 current ,\laqH\ 1%
母线 bus >qk[/\^O
变压器 transformer >77N5 >]e
升压变压器 step-up transformer Cgq/#2BM
高压侧 high side h
U\)CM
输电系统 power transmission system V3DXoRE-8i
输电线 transmission line Q\|72NWS
固定串联电容补偿fixed series capacitor compensation ufyqfI D
稳定 stability _H@Y%"ZHJ6
电压稳定 voltage stability U ]jHe
功角稳定 angle stability 6 2GP1qH9
暂态稳定 transient stability v6(Y z[
电厂 power plant dfl| 6R
能量输送 power transfer 91d@/z
交流 AC Z]kk.@P
装机容量 installed capacity +y'V
电网 power system Y7(E<1Yx
落点 drop point y=7WnQc
开关站 switch station &~gqEl6RF
双回同杆并架 double-circuit lines on the same tower 41Bp^R}^/
变电站 transformer substation q_S`@2Dzz,
补偿度 degree of compensation 5mxHOtvtWM
高抗 high voltage shunt reactor {C3AxK0
无功补偿 reactive power compensation mC OJ1 }
故障 fault V ; 0{o
调节 regulation kzU;24"K
裕度 magin |<t Z|
三相故障 three phase fault m} /L MY
故障切除时间 fault clearing time GPlAQk
极限切除时间 critical clearing time $.{CA-~%[
切机 generator triping |:yQOq|
高顶值 high limited value ?|!167 /O
强行励磁 reinforced excitation yZ k HBG4
线路补偿器 LDC(line drop compensation) 5(e?,B }
机端 generator terminal
Z)}q=NjA
静态 static (state) Xvu|ss
动态 dynamic (state) 5dOA^P@`,M
单机无穷大系统 one machine - infinity bus system Pl^-]~
机端电压控制 AVR 7LMad%
电抗 reactance ;ELQIHnD"
电阻 resistance bL*;6TzRK
功角 power angle yem*g 1
有功（功率） active power vQf'lEFk
无功（功率） reactive power y\0<f ` v6
功率因数 power factor Vfew )]I
无功电流 reactive current $jMU| {
下降特性 droop characteristics BkfWZ O{7
斜率 slope ] = ar&1}J
额定 rating $T* ##kyE9
变比 ratio 9Br 2}!Ny
参考值 reference value " a;z
电压互感器 PT $__e7
分接头 tap 6ExUNp @U>
下降率 droop rate _|%pe]St
仿真分析 simulation analysis V#
Mw
传递函数 transfer function lsmzy _gV7
框图 block diagram hCRW0
I
受端 receive-side :()(P9?
裕度 margin T3
xr Ua&
同步 synchronization s ' %KKC
失去同步 loss of synchronization pL ` snVz
阻尼 damping CORX .PQ
摇摆 swing J ]uYXsC
保护断路器 circuit breaker }G
n2%
电阻：resistance cGSoAK
电抗：reactance 9HMW!DSK`
阻抗：impedance E .W7`zl
电导：conductance R<W#.mpo6
电纳：susceptance
