1 backplane 背板 7oWv'
2 Band gap voltage reference 带隙电压参考 *V\kS
3 benchtop supply 工作台电源 LRI_s>7
4 Block Diagram 方块图 5 Bode Plot 波特图 n}+
DO6J
6 Bootstrap 自举 {jl4`
7 Bottom FET Bottom FET Vy?w,E0^:
8 bucket capcitor 桶形电容 M aEh8*
9 chassis 机架 jgYiuM3c\
10 Combi-sense Combi-sense 5_O.p3$tV
11 constant current source 恒流源 AsLAm#zq
12 Core Sataration 铁芯饱和 'X?`+2wK
13 crossover frequency 交叉频率 4VooU [Ka(
14 current ripple 纹波电流 $M8'm1R9
15 Cycle by Cycle 逐周期 `rcjZ^n
16 cycle skipping 周期跳步 r9%W?fEBp
17 Dead Time 死区时间 [DE8s[i-
18 DIE Temperature 核心温度 6xOR,p>E
19 Disable 非使能,无效,禁用,关断 Y'Af I^K
20 dominant pole 主极点 #8RQ7|7b|
21 Enable 使能,有效,启用 7}#vANm
22 ESD Rating ESD额定值 (PNvv/A
23 Evaluation Board 评估板 FxUH?%w
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. a2i
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 l^vq'<kI
25 Failling edge 下降沿 |fA[s7)
26 figure of merit 品质因数 x;SrJVDN
27 float charge voltage 浮充电压 ^NCH)zK]v
28 flyback power stage 反驰式功率级 AV'>
29 forward voltage drop 前向压降 tQ/w\6{
30 free-running 自由运行 Soa.thP
31 Freewheel diode 续流二极管 !!QMcx_C#/
32 Full load 满负载 33 gate drive 栅极驱动 z#\Z|OKU
34 gate drive stage 栅极驱动级 fT@#S}t
35 gerber plot Gerber 图 ecFI"g
36 ground plane 接地层 0 #q_LB
37 Henry 电感单位:亨利 @#V{@@3$
38 Human Body Model 人体模式 o1Xk\R{
39 Hysteresis 滞回 +F/ '+
40 inrush current 涌入电流 -0kwS4Hx2
41 Inverting 反相 zso.?`85
42 jittery 抖动 ?T^$,1-
43 Junction 结点 Mz06cw&
44 Kelvin connection 开尔文连接 }Orc;_)r
45 Lead Frame 引脚框架 06ueE\@Sg
46 Lead Free 无铅 [$./'-I]
47 level-shift 电平移动 Ve=0_GR0
48 Line regulation 电源调整率 ;6]+/e7O
49 load regulation 负载调整率 z><JbSE?
50 Lot Number 批号 #mj+|/0
51 Low Dropout 低压差 CEUR-LK0
52 Miller 密勒 53 node 节点 _Y0o\0B
54 Non-Inverting 非反相 3!d|K%J
55 novel 新颖的 eg}|%GG
56 off state 关断状态 =HSE
57 Operating supply voltage 电源工作电压 )jH"6my_
58 out drive stage 输出驱动级 J#D!J8KP7
59 Out of Phase 异相 L*5&hPU
60 Part Number 产品型号 tf/ f-S
61 pass transistor pass transistor Q!"Li
62 P-channel MOSFET P沟道MOSFET L7KHs'c*
63 Phase margin 相位裕度 bc&:v$EGy
64 Phase Node 开关节点 kL&^/([9
65 portable electronics 便携式电子设备 $;@s
66 power down 掉电 :hevBBP
67 Power Good 电源正常 MTF:mLJ
68 Power Groud 功率地 }&!rIU
69 Power Save Mode 节电模式 6 o+zhi;E
70 Power up 上电 eF2<L [9
71 pull down 下拉 dJ|]W|q<
72 pull up 上拉 #fFEo)YG
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) +/Z:L$C6
74 push pull converter 推挽转换器 O@ "6)/
75 ramp down 斜降 ?W#! S
76 ramp up 斜升 b'ew
Od=
77 redundant diode 冗余二极管 OaZ~
78 resistive divider 电阻分压器 v5*SoUOF
79 ringing 振 铃 ck Tnb
80 ripple current 纹波电流 }
HvVL}7
81 rising edge 上升沿 ]=pEs6%O3
82 sense resistor 检测电阻 }q~A( u
83 Sequenced Power Supplys 序列电源 #-kyZ
84 shoot-through 直通,同时导通 ucMl>G'!gX
85 stray inductances. 杂散电感 ikY=}
86 sub-circuit 子电路 5-+Y2tp}
87 substrate 基板 LN7;Yr
88 Telecom 电信 lID5mg31
89 Thermal Information 热性能信息 !E*-\}[
90 thermal slug 散热片 q_W NN/w
91 Threshold 阈值 eDy}_By^
92 timing resistor 振荡电阻 -nU_eDy
93 Top FET Top FET ; id
94 Trace 线路,走线,引线 =,(Ba'
95 Transfer function 传递函数 +C+3DwN
96 Trip Point 跳变点 U2K>\/ -~
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) tBf u{oC
98 Under Voltage Lock Out (UVLO) 欠压锁定 1W-!f%
99 Voltage Reference 电压参考 sGzd c
100 voltage-second product 伏秒积 2/h Mx-
101 zero-pole frequency compensation 零极点频率补偿 LxG :?=O.
102 beat frequency 拍频 m@yaF:
R
103 one shots 单击电路 "3!4 hiU9
104 scaling 缩放 Bg34YmZ
105 ESR 等效串联电阻 [Page] ]P 2M
106 Ground 地电位 {wd.aUB
107 trimmed bandgap 平衡带隙 <;acWT?(
108 dropout voltage 压差 ?XeRL<n
109 large bulk capacitance 大容量电容 )~WxNn3rx
110 circuit breaker 断路器 ?B[Z9Ef"8l
111 charge pump 电荷泵 T9(~^}_+9
112 overshoot 过冲 TpnkJygIm
MEo+S
印制电路printed circuit |&C.P?q
印制线路 printed wiring 8_ju.h[
印制板 printed board fPspJug
印制板电路 printed circuit board 8XTVpf4
印制线路板 printed wiring board !WrUr]0IP
印制元件 printed component 56L>tP
印制接点 printed contact 6KV&E8Gn
印制板装配 printed board assembly 4cs`R+]o
板 board eyy&JjVs
刚性印制板 rigid printed board Kr8p:$D};
挠性印制电路 flexible printed circuit n /rQ*hr
挠性印制线路 flexible printed wiring >yT:eG
齐平印制板 flush printed board {U&Mo97rzX
金属芯印制板 metal core printed board "ua/65cq9
金属基印制板 metal base printed board whvM^
多重布线印制板 mulit-wiring printed board c?[A
塑电路板 molded circuit board bu\,2t}B
散线印制板 discrete wiring board ]1gt|M^
微线印制板 micro wire board
#p\sw
积层印制板 buile-up printed board ,A_itRHH
表面层合电路板 surface laminar circuit _{-GR -
埋入凸块连印制板 B2it printed board }/M ~
载芯片板 chip on board 7 +?
埋电阻板 buried resistance board )LnHm
母板 mother board Tqm9><!r
子板 daughter board O@Xl_QNxc!
背板 backplane *USZ2|i
裸板 bare board `
R^[s56wp
键盘板夹心板 copper-invar-copper board CK.Z-_M
动态挠性板 dynamic flex board b7HS3NYk
静态挠性板 static flex board 3WaYeol`
可断拼板 break-away planel pcL02W|J
电缆 cable JTdK\A>l
挠性扁平电缆 flexible flat cable (FFC) .XS rLb?
薄膜开关 membrane switch utRvE(IbmV
混合电路 hybrid circuit wGw}a[a
厚膜 thick film o#E
z_D[
厚膜电路 thick film circuit .lRO;D
薄膜 thin film Lt=#tu&d
薄膜混合电路 thin film hybrid circuit dB< \X.
互连 interconnection ou@Dd4
导线 conductor trace line #&&^5r-b-
齐平导线 flush conductor q}(UC1|
传输线 transmission line XnV|{X%]U
跨交 crossover (\M&/X~q
板边插头 edge-board contact >WG$!o +R
增强板 stiffener } fSbH
基底 substrate 2Xgn[oI{
基板面 real estate !%]]lxi
导线面 conductor side !MQo=k
元件面 component side `} Q+:
焊接面 solder side ~"{Kjr#R
导电图形 conductive pattern t5[{ihv~:
非导电图形 non-conductive pattern YdIV_&-W
基材 base material ~pwp B2c
层压板 laminate F5&4x"c
覆金属箔基材 metal-clad bade material nqy\xK#.^
覆铜箔层压板 copper-clad laminate (CCL) dht1I`i"B
复合层压板 composite laminate &eyFApM[Z
薄层压板 thin laminate vhdT"7`U
基体材料 basis material Z#MPlw0B
预浸材料 prepreg F|Jo|02
粘结片 bonding sheet Pp#!yMxBr
预浸粘结片 preimpregnated bonding sheer _ ?=bW
环氧玻璃基板 epoxy glass substrate 5ahAp];
预制内层覆箔板 mass lamination panel Y~bp:FkS
内层芯板 core material wGAN"K:e
粘结层 bonding layer [WC-EDO2lb
粘结膜 film adhesive \)`\F$CF
无支撑胶粘剂膜 unsupported adhesive film 5-aCNAF2
覆盖层 cover layer (cover lay) ,SS@]9A&
增强板材 stiffener material X]Sr]M^EK
铜箔面 copper-clad surface "7iHTV
去铜箔面 foil removal surface 3E:wyf)i"
层压板面 unclad laminate surface
M9 _h0
基膜面 base film surface a)[t kjU
胶粘剂面 adhesive faec 1rT}mm/e;
原始光洁面 plate finish M
HlP)'
粗面 matt finish lbTz
剪切板 cut to size panel !dSY?1>U<
超薄型层压板 ultra thin laminate A]ciox$AjW
A阶树脂 A-stage resin {v<Ig{{V
B阶树脂 B-stage resin ;. /Tv84I^
C阶树脂 C-stage resin xOPSw|!w
环氧树脂 epoxy resin &2#<6=}
酚醛树脂 phenolic resin JzCfs<D
聚酯树脂 polyester resin !9OAMHa*9
聚酰亚胺树脂 polyimide resin H&`p9d*(e
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin vQYd!DSh
丙烯酸树脂 acrylic resin xw]Zo<F
三聚氰胺甲醛树脂 melamine formaldehyde resin `N
;!=7y7Y
多官能环氧树脂 polyfunctional epoxy resin >"N \ZC^
溴化环氧树脂 brominated epoxy resin Wvmf[!V;
环氧酚醛 epoxy novolac {_KuztJGA
氟树脂 fluroresin =`Nnd@3v
硅树脂 silicone resin -9vAY+s.
硅烷 silane /Y%) Y
聚合物 polymer @ U:WWTzf
无定形聚合物 amorphous polymer HO}aLp
结晶现象 crystalline polamer q1`uS^3`
双晶现象 dimorphism +#,t
共聚物 copolymer XNd:x{
合成树脂 synthetic noGMfZ1
热固性树脂 thermosetting resin [Page] W)$;T%u
热塑性树脂 thermoplastic resin PBR+NHrZ
感光性树脂 photosensitive resin c;BQ$je}
环氧值 epoxy value Nr6YQH*[
双氰胺 dicyandiamide y @h^
粘结剂 binder boJQ3Xc
胶粘剂 adesive `:?padZG
固化剂 curing agent ^L<1S/~)
阻燃剂 flame retardant uA*Op45
遮光剂 opaquer R qOEQ*k
增塑剂 plasticizers yV=hi?f-[V
不饱和聚酯 unsatuiated polyester !fyE
Hk
聚酯薄膜 polyester ;x|4Tm
聚酰亚胺薄膜 polyimide film (PI) W^P%k:anK
聚四氟乙烯 polytetrafluoetylene (PTFE) qm@c[b
增强材料 reinforcing material GcHWalm
折痕 crease .ikFqZ$$
云织 waviness |#f
P8OK
鱼眼 fish eye 6@; w%Ea
毛圈长 feather length x!]ZVl]
厚薄段 mark @X
裂缝 split #^%Rk'W
捻度 twist of yarn d #y{eV$Q
浸润剂含量 size content =DGaK0n
浸润剂残留量 size residue g6;O)b
处理剂含量 finish level =+A8s$Pb
偶联剂 couplint agent _av%`bb&z9
断裂长 breaking length mzfj!0zR*
吸水高度 height of capillary rise ]%"Z[R
湿强度保留率 wet strength retention _H<ur?G
白度 whitenness W5EB+b49KM
导电箔 conductive foil C Vyq/X
铜箔 copper foil `61VP-r
压延铜箔 rolled copper foil #oJ9BgDry
光面 shiny side r]kLe2r:B
粗糙面 matte side <b{Le{QJ*
处理面 treated side VL7zU->
防锈处理 stain proofing W(a=ev2sa
双面处理铜箔 double treated foil /XtxgO\T.
模拟 simulation on\0i{0l8
逻辑模拟 logic simulation P=(\3ok
电路模拟 circit simulation hdfNXZ{A"
时序模拟 timing simulation X;6&:%ZL@^
模块化 modularization Xp4pN{h e
设计原点 design origin 52{jq18&
优化(设计) optimization (design) ){L`hQ*=w
供设计优化坐标轴 predominant axis oC^-" (#
表格原点 table origin ,hYUxh45
元件安置 component positioning /8Ca8Ju
比例因子 scaling factor !
FhN(L[=j
扫描填充 scan filling HVh+Zk
矩形填充 rectangle filling Cq}LKiu
填充域 region filling vAHJP$x
实体设计 physical design <?2[]h:wp
逻辑设计 logic design I>C;$Lp]
逻辑电路 logic circuit | t3_E
层次设计 hierarchical design pc:~_6S
自顶向下设计 top-down design .2Y"=|NdA
自底向上设计 bottom-up design ZYc)_Og
费用矩阵 cost metrix ,.x1+9X
元件密度 component density W29@`93
自由度 degrees freedom Ko kmylHu
出度 out going degree xud =(HLl
入度 incoming degree p@YU7_sF^!
曼哈顿距离 manhatton distance Nq9@^ E-{M
欧几里德距离 euclidean distance @]gP"Pp
网络 network %h2U(=/:
阵列 array f* p=]]y
段 segment )LKutN?tBy
逻辑 logic m7~kRY514
逻辑设计自动化 logic design automation v>;6pcp[F
分线 separated time )Uo)3FAn
分层 separated layer ?.,..p
定顺序 definite sequence P8:k"i/6J
导线(通道) conduction (track) 8! pfy"
导线(体)宽度 conductor width |r%6;8A]i
导线距离 conductor spacing !n@Yg2 w
导线层 conductor layer |J?KHI
导线宽度/间距 conductor line/space e#<%`\qH
第一导线层 conductor layer No.1 ;[uJ~7e3
圆形盘 round pad #q6jE
方形盘 square pad <x53b/ft
菱形盘 diamond pad h/QZcA
长方形焊盘 oblong pad Go=MG:`
子弹形盘 bullet pad qI5_@[S*
泪滴盘 teardrop pad diaLw
雪人盘 snowman pad QZYD;&iY&
形盘 V-shaped pad V wS hsu_(i
环形盘 annular pad |36d<b Io
非圆形盘 non-circular pad l]uF!']f
隔离盘 isolation pad gcQ>:mi
非功能连接盘 monfunctional pad ApG_Gd.
偏置连接盘 offset land X8GIRL)lJ
腹(背)裸盘 back-bard land ^R!
qxSj
盘址 anchoring spaur */u_RJ
连接盘图形 land pattern 69p>?zn
连接盘网格阵列 land grid array ?|w>."F
孔环 annular ring &) T5V
元件孔 component hole Z[[qW
f
安装孔 mounting hole <V5(5gx
支撑孔 supported hole B#OnooJI
非支撑孔 unsupported hole bd5\Rt
导通孔 via MRV4D<NQ
镀通孔 plated through hole (PTH) }N&}6U
余隙孔 access hole si.ZTG9m
盲孔 blind via (hole) 4%Z! *W*
埋孔 buried via hole O@ F0UM`!
埋,盲孔 buried blind via 3-`IMNn!
任意层内部导通孔 any layer inner via hole 8Mf6*G#Y
全部钻孔 all drilled hole ~a^mLnY@
定位孔 toaling hole W.'#pd
无连接盘孔 landless hole N^*%{[<5
中间孔 interstitial hole 04D>h0yFf
无连接盘导通孔 landless via hole |D~mLs;&
引导孔 pilot hole ZUyG
}6)J
端接全隙孔 terminal clearomee hole 'JU(2mF
准尺寸孔 dimensioned hole [Page] SIYBMe
在连接盘中导通孔 via-in-pad ;6KcX \g-
孔位 hole location aY@]mMz\
孔密度 hole density PzMJ^H{
孔图 hole pattern ~:'tp28?
钻孔图 drill drawing .!e):&(8
装配图assembly drawing iyKAw
参考基准 datum referan Ye% e!
1) 元件设备 Tty_P,
?x1sm"]p'
三绕组变压器:three-column transformer ThrClnTrans PV$)k>H-
双绕组变压器:double-column transformer DblClmnTrans bA!n;
电容器:Capacitor zl^ %x1G
并联电容器:shunt capacitor Yd'Fhvo8
电抗器:Reactor t~]n"zgovz
母线:Busbar #I8)|p?P
输电线:TransmissionLine wI8
发电厂:power plant &&T\PspM
断路器:Breaker <`rmQ`(}s
刀闸(隔离开关):Isolator 2[
=
=
分接头:tap c%+/TO
电动机:motor Q6)Wh6Cm
(2) 状态参数 Zgy~Y0Di
'K&^y%~py,
有功:active power ndg1E;>
无功:reactive power !xk`oW
电流:current Z.'j7(tu
容量:capacity )Q= EmZbJz
电压:voltage h K;9XJAf
档位:tap position i<@"+~n~GK
有功损耗:reactive loss A0X'|4I
无功损耗:active loss *U>"_h T0
功率因数:power-factor jV{?.0/h|
功率:power +q n[F70}
功角:power-angle !iv6k~.e'2
电压等级:voltage grade -[/tS<U
空载损耗:no-load loss C0C2]xx{
铁损:iron loss `(tVwX4
铜损:copper loss ?#s9@R1
空载电流:no-load current vT@*o=I
阻抗:impedance wN
NXUW
正序阻抗:positive sequence impedance f euATL]
负序阻抗:negative sequence impedance X1*f#3cm#
零序阻抗:zero sequence impedance t2x2_;a
电阻:resistor MrjgV+P}[
电抗:reactance `vjn,2S}
电导:conductance 43wm_4C!H
电纳:susceptance >AK9F.
_z
无功负载:reactive load 或者QLoad {E=BFs
有功负载: active load PLoad ^^,cnDlm
遥测:YC(telemetering) W(5XcP(
遥信:YX `PY=B$?{4
励磁电流(转子电流):magnetizing current :1asY:)vNP
定子:stator .A6D&-&z
功角:power-angle %_Q+@9
上限:upper limit nA*Udrcn
下限:lower limit H4B|c42
并列的:apposable f \ E9u}
高压: high voltage lbs0i
低压:low voltage Es<& 6
中压:middle voltage &u`EYxT
电力系统 power system L|hELWru
发电机 generator :$6mS[@|
励磁 excitation :+_uyp2V
励磁器 excitor Bnp\G h
电压 voltage B4@1WZn<8
电流 current -kF8ZF
母线 bus bv^wE,+?o
变压器 transformer <-6f}wN
升压变压器 step-up transformer :6gRoMb]
高压侧 high side m!5MGq~
输电系统 power transmission system gmqA 5W~y
输电线 transmission line aD^jlt
固定串联电容补偿fixed series capacitor compensation ^'%Q>FVb
稳定 stability XX7zm_>+
电压稳定 voltage stability uG7?:) pxv
功角稳定 angle stability >sjvE4s
暂态稳定 transient stability q nb#~=x^
电厂 power plant ^jbjHI&
能量输送 power transfer 63E)RR_Lh
交流 AC Qz4eQlWhp
装机容量 installed capacity B?%e-xV-
电网 power system dVMduo
落点 drop point 4A`U [r_>D
开关站 switch station `h%K8];<6f
双回同杆并架 double-circuit lines on the same tower dQn,0
变电站 transformer substation s6F0&L;N&
补偿度 degree of compensation ~9y/MR
高抗 high voltage shunt reactor CKnPMvmz
无功补偿 reactive power compensation 1B#iJZ}
故障 fault U5
ia| V
调节 regulation s
!IvUc7'
裕度 magin B&QEt[=s
三相故障 three phase fault $D='NzE/
故障切除时间 fault clearing time p;qFMzyS9
极限切除时间 critical clearing time )3f<0C>
切机 generator triping }Ug$d>\
高顶值 high limited value o)f$ 7.
强行励磁 reinforced excitation NQxx_3*4O
线路补偿器 LDC(line drop compensation) SoWMP2/
机端 generator terminal :qc?FQ
;
静态 static (state) XRmE
动态 dynamic (state) :HM~!7e
单机无穷大系统 one machine - infinity bus system 6u'E}hAx|
机端电压控制 AVR C#V_Gb
电抗 reactance \[G"/]J
电阻 resistance
2g~W})e
功角 power angle g"~`\xhx
有功(功率) active power AJ>$`=
无功(功率) reactive power O5MV&Zb(
功率因数 power factor )<%CI#s#
无功电流 reactive current QFK'r\3pU
下降特性 droop characteristics Q4Nut
斜率 slope #@' B\!<@=
额定 rating o5['5?i} /
变比 ratio v^J']p
参考值 reference value p"7]zq]'
电压互感器 PT xS(VgP&YGO
分接头 tap 9mW
下降率 droop rate {Hie%2V
仿真分析 simulation analysis <Mndr8 H
传递函数 transfer function mBEMwJ}O`
框图 block diagram KjMwrMgC
受端 receive-side Rh!m1Q(-
裕度 margin
M6ZXq6J
同步 synchronization f9OY>|a9
失去同步 loss of synchronization m70AWG
阻尼 damping
!<HF764@`
摇摆 swing p' 6h9/
保护断路器 circuit breaker yf[1?{iVo
电阻:resistance 7|"l/s9,
电抗:reactance gL~3z'$
阻抗:impedance P1z:L
电导:conductance IAWs}xIly
电纳:susceptance