1 backplane 背板 <dE~z] P
2 Band gap voltage reference 带隙电压参考 Q?LzL(OioN
3 benchtop supply 工作台电源 y7CXE6Y
4 Block Diagram 方块图 5 Bode Plot 波特图 "Dk@-Ac
6 Bootstrap 自举 :|S[i('
7 Bottom FET Bottom FET 1|-C(UW>
8 bucket capcitor 桶形电容 T"3LO[j+
9 chassis 机架 w5)KWeGa
10 Combi-sense Combi-sense sx;/xIU|
11 constant current source 恒流源 Iurz?dt4w
12 Core Sataration 铁芯饱和 4clCZ@\K^
13 crossover frequency 交叉频率 .t>SbGC
14 current ripple 纹波电流 eYoc(bG(+
15 Cycle by Cycle 逐周期 ZVJ6 {DS/
16 cycle skipping 周期跳步 CdCY#$Z
17 Dead Time 死区时间 (zy|>u
18 DIE Temperature 核心温度 g#l!b%$
19 Disable 非使能,无效,禁用,关断 I]5){Q"S
20 dominant pole 主极点 }j1;0 kb?
21 Enable 使能,有效,启用 CE
22 ESD Rating ESD额定值 Gdx%#@/
23 Evaluation Board 评估板 jqj}j2
9
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. >k@{NP2b
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 ^/Yk*Ny
25 Failling edge 下降沿 MFO%F) 5
26 figure of merit 品质因数 G@~e:v)
27 float charge voltage 浮充电压 _C1u}1hW#
28 flyback power stage 反驰式功率级 ^-s7>F`jx
29 forward voltage drop 前向压降 &WAU[{4W
30 free-running 自由运行 i=>`=. ~
31 Freewheel diode 续流二极管 5syzh
S
32 Full load 满负载 33 gate drive 栅极驱动 imwn)]L R
34 gate drive stage 栅极驱动级 X"g,QqDD
35 gerber plot Gerber 图 s5{H15
36 ground plane 接地层 bzZdj6>kX
37 Henry 电感单位:亨利 xOg|<Nnl
38 Human Body Model 人体模式
#z.\pd
39 Hysteresis 滞回 ~e,K
40 inrush current 涌入电流 Gv 8Z
41 Inverting 反相 ~
W8
M3(^
42 jittery 抖动 0{o 8-#
43 Junction 结点 R*W1<W%q=
44 Kelvin connection 开尔文连接 Ue,eEer
45 Lead Frame 引脚框架 m |+zMf&
46 Lead Free 无铅 d@cyQFX
47 level-shift 电平移动 "Ya;&F.'
48 Line regulation 电源调整率 AlrUfSBB
49 load regulation 负载调整率 s%>u[-9U
50 Lot Number 批号 U'5p;j)_
51 Low Dropout 低压差 uF|[MWcy0#
52 Miller 密勒 53 node 节点 e1bV&
54 Non-Inverting 非反相 Of-gG~
55 novel 新颖的 7|"G
3ck
56 off state 关断状态 jl]p e7-
57 Operating supply voltage 电源工作电压 WwSyw?T
58 out drive stage 输出驱动级 >2mY%
59 Out of Phase 异相 (lit^v,9
60 Part Number 产品型号 EmP2r*"rb
61 pass transistor pass transistor X88I|Z'HIh
62 P-channel MOSFET P沟道MOSFET yFFNzw{
63 Phase margin 相位裕度 c No)LF
64 Phase Node 开关节点 {Y]3t9!\
65 portable electronics 便携式电子设备 #&{)`+!"
66 power down 掉电 +`m0i1uI3
67 Power Good 电源正常 H0.&~!,*
68 Power Groud 功率地 iHo0:J~
69 Power Save Mode 节电模式 t`\l+L
70 Power up 上电 ,0>_(5
71 pull down 下拉 _J3\e%ys
72 pull up 上拉 m Ub2U&6(
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) F
'HYWH0?
74 push pull converter 推挽转换器 Hpp;dG
75 ramp down 斜降 %-!:$ 1;
76 ramp up 斜升 | 8n,|%e
77 redundant diode 冗余二极管 J/ vcP
78 resistive divider 电阻分压器 jz&= 8
79 ringing 振 铃 63i&e/pv
80 ripple current 纹波电流 u`*$EP-%
81 rising edge 上升沿 )[t3-'
82 sense resistor 检测电阻 wLQM]$O
83 Sequenced Power Supplys 序列电源 zfml^N
84 shoot-through 直通,同时导通 ju"j?2+F
85 stray inductances. 杂散电感 k}{K7,DM
86 sub-circuit 子电路 =&U7:u
87 substrate 基板 VD=F{|^
88 Telecom 电信 _j_c&
89 Thermal Information 热性能信息 VK4"
90 thermal slug 散热片 ~BI! l
91 Threshold 阈值 y=}a55:qE
92 timing resistor 振荡电阻 #xrE^Txh
93 Top FET Top FET (W`=`]!
94 Trace 线路,走线,引线 D4GXZX8K
95 Transfer function 传递函数 cXOb=
96 Trip Point 跳变点 )#cGePA
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) 'DH_ihZ
98 Under Voltage Lock Out (UVLO) 欠压锁定 Dw2$#d
99 Voltage Reference 电压参考 =(5}0}j
100 voltage-second product 伏秒积 qSL~A-
101 zero-pole frequency compensation 零极点频率补偿 C1~Ro9si
102 beat frequency 拍频 _P]k6z+
103 one shots 单击电路 =Sn!'@%U]
104 scaling 缩放 v#KE"m
105 ESR 等效串联电阻 [Page] Aa%ks+1
106 Ground 地电位 =G<S!qW
107 trimmed bandgap 平衡带隙 \V<deMb=
108 dropout voltage 压差 s0'Xih sw6
109 large bulk capacitance 大容量电容 \6Hu&WHy
110 circuit breaker 断路器 }*0*8~Q'5
111 charge pump 电荷泵 en gh3TZC
112 overshoot 过冲 TqMy">>
#1f8A5<
印制电路printed circuit B3Esfk
印制线路 printed wiring .J|"bs9
印制板 printed board }Rq-IRa'
印制板电路 printed circuit board 7Y'.yn
印制线路板 printed wiring board qUp DmH
印制元件 printed component `L}Irt}
印制接点 printed contact -U_<:
印制板装配 printed board assembly 8DNGqaH;dt
板 board $yg}HS7HC
刚性印制板 rigid printed board )kNyl@m
挠性印制电路 flexible printed circuit [ 5kaF"
挠性印制线路 flexible printed wiring !.k
齐平印制板 flush printed board !ly]{DTmm
金属芯印制板 metal core printed board $f<R j/`&
金属基印制板 metal base printed board Fop"m/
多重布线印制板 mulit-wiring printed board $X;fz)u
塑电路板 molded circuit board Ib8xvzR6I&
散线印制板 discrete wiring board niN$!k+Jr
微线印制板 micro wire board o%tvwv
积层印制板 buile-up printed board u7<s_M3%N
表面层合电路板 surface laminar circuit F D6>[W
埋入凸块连印制板 B2it printed board qu/59D
载芯片板 chip on board dmD':1
埋电阻板 buried resistance board 8>K2[cPD
母板 mother board #fYz367>
子板 daughter board mYzq[p_|j
背板 backplane A5gdZZ'x
裸板 bare board yf7p0;$?
键盘板夹心板 copper-invar-copper board yN~: 3
动态挠性板 dynamic flex board XA:v:JFS
静态挠性板 static flex board SuW_[6]
可断拼板 break-away planel 8V3SZ17
电缆 cable e]{X62]
挠性扁平电缆 flexible flat cable (FFC) Fu (I<o+T-
薄膜开关 membrane switch m:~s6c6H
混合电路 hybrid circuit cS ;hyLd
厚膜 thick film 1]v.Qu<
厚膜电路 thick film circuit q-}J0vu\K
薄膜 thin film 8ESBui3;
薄膜混合电路 thin film hybrid circuit a8%/Xwr~
互连 interconnection ~Hs a6F&F
导线 conductor trace line 8P'>%G<m
齐平导线 flush conductor =`rESb[
传输线 transmission line Aj4i}pT
跨交 crossover .
\fzK
板边插头 edge-board contact c>r0N[
增强板 stiffener S-:l
60.
基底 substrate :U<`iJwY
基板面 real estate ZuF-$]oL&
导线面 conductor side X(#G6KeZFZ
元件面 component side W%.Kr-[?`o
焊接面 solder side 2rf-pdOvG
导电图形 conductive pattern +dk}$w[g
非导电图形 non-conductive pattern x2[A(O=
基材 base material a%sr*`
层压板 laminate W)?B{\
覆金属箔基材 metal-clad bade material aDTNr/I
覆铜箔层压板 copper-clad laminate (CCL) /WB^h6qg
复合层压板 composite laminate Ylll4w62N
薄层压板 thin laminate Lu6!W
基体材料 basis material S=ebht=
预浸材料 prepreg *K'(t
粘结片 bonding sheet Y|g8xkI}XB
预浸粘结片 preimpregnated bonding sheer _CBG?
环氧玻璃基板 epoxy glass substrate InMF$pw
预制内层覆箔板 mass lamination panel a&p|>,WS
内层芯板 core material Lt.a@\J'_
粘结层 bonding layer kA{[k
粘结膜 film adhesive EV z>#GC
无支撑胶粘剂膜 unsupported adhesive film u)MdFz
覆盖层 cover layer (cover lay) KZ
pqbI Z
增强板材 stiffener material \SS1-UbL
铜箔面 copper-clad surface } O8|_d
去铜箔面 foil removal surface )VID
;l;4
层压板面 unclad laminate surface N)03{$WM
基膜面 base film surface yNP
M-
胶粘剂面 adhesive faec NSUw7hnWvz
原始光洁面 plate finish 3VbMW, _&"
粗面 matt finish *pCT34'--
剪切板 cut to size panel \IbGNV`q
超薄型层压板 ultra thin laminate V.6h6B!vB
A阶树脂 A-stage resin B)O{+avu
B阶树脂 B-stage resin n:,At]ky
C阶树脂 C-stage resin [*Nuw_l
环氧树脂 epoxy resin 0{j]p^'<
酚醛树脂 phenolic resin Jc"xH~,
聚酯树脂 polyester resin (4LXoNT
聚酰亚胺树脂 polyimide resin YN#i^(
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin h.E8G^}@
丙烯酸树脂 acrylic resin KyK%2:
三聚氰胺甲醛树脂 melamine formaldehyde resin Lqb9gUJ:U
多官能环氧树脂 polyfunctional epoxy resin )" q$g&
溴化环氧树脂 brominated epoxy resin ,&rlt+wE
环氧酚醛 epoxy novolac (;;%B =
氟树脂 fluroresin V)72]p
硅树脂 silicone resin Cb5;l~}L
硅烷 silane 9aFu51
聚合物 polymer qR/~a
无定形聚合物 amorphous polymer K>hQls+
结晶现象 crystalline polamer /-)\$T1d
双晶现象 dimorphism HKbyi~8N=
共聚物 copolymer )HQ':ZE$
合成树脂 synthetic >
L_kSC?
热固性树脂 thermosetting resin [Page] c!vtQ<h-
热塑性树脂 thermoplastic resin _o/LFLq
感光性树脂 photosensitive resin HjAhz
环氧值 epoxy value a,i
k=g
双氰胺 dicyandiamide VPoA,;Y"-
粘结剂 binder +sq'\Tbp
胶粘剂 adesive 1t
wC-rC
固化剂 curing agent 3oc p4x`[
阻燃剂 flame retardant
_GS_R%b
遮光剂 opaquer YEH /22
增塑剂 plasticizers jR[VPm=
不饱和聚酯 unsatuiated polyester ]Jz2[F"J
聚酯薄膜 polyester Is1P,`*!
聚酰亚胺薄膜 polyimide film (PI) <ZO"0oz%
聚四氟乙烯 polytetrafluoetylene (PTFE) /j46`F
增强材料 reinforcing material *;cvG?V
折痕 crease Z"j #kaXA
云织 waviness
f?vbIc`
鱼眼 fish eye "159Q
毛圈长 feather length
|Hx#Uk#
厚薄段 mark 0M=A,`qk
裂缝 split D1hy:KkAv]
捻度 twist of yarn P/i{_r
浸润剂含量 size content Iv])s
浸润剂残留量 size residue }z%fQbw
处理剂含量 finish level 3-x ;_
偶联剂 couplint agent {Tx"G9
断裂长 breaking length =rz7 x
吸水高度 height of capillary rise m31l[e
湿强度保留率 wet strength retention QS7<7+
白度 whitenness <O:}dXqZ
导电箔 conductive foil 1eHU!{<fqm
铜箔 copper foil skr dL.5
压延铜箔 rolled copper foil S$#"bK/p^
光面 shiny side ]R%[cr
粗糙面 matte side 8Of.n7{
处理面 treated side eX)'C>4W
防锈处理 stain proofing kU:ge
双面处理铜箔 double treated foil tb$I8T
模拟 simulation Sc b'
逻辑模拟 logic simulation u@&e{w~0
电路模拟 circit simulation ;wGoEN
时序模拟 timing simulation 0'wchy>
模块化 modularization mIW8K
):
设计原点 design origin |"]#jx*8KC
优化(设计) optimization (design) F8xz^UQO
供设计优化坐标轴 predominant axis pLYLHS`*
表格原点 table origin e= { ?d6
元件安置 component positioning ^^
>j2=
比例因子 scaling factor 1t+uMhy*y
扫描填充 scan filling /{6&99SJcc
矩形填充 rectangle filling 1S[4@rZ
填充域 region filling \_io:{M
实体设计 physical design <JUumrEo
逻辑设计 logic design r:{;HM+
逻辑电路 logic circuit Ms<v81z5T
层次设计 hierarchical design %CoO-1@C
自顶向下设计 top-down design wjtFZGx&
自底向上设计 bottom-up design Jb/VITqN4
费用矩阵 cost metrix xAwP
元件密度 component density #W$6[#7=I
自由度 degrees freedom G*s5GG@Z.
出度 out going degree m@Hg:DY
入度 incoming degree g)!d03Qoy
曼哈顿距离 manhatton distance c1tM(]&
欧几里德距离 euclidean distance i[Qq,MmC
网络 network [_T6
阵列 array &s#O iF8
段 segment v[~~q
逻辑 logic E]w2
{%
逻辑设计自动化 logic design automation M{z&h>
分线 separated time s4uZ >
分层 separated layer 4 :phq
定顺序 definite sequence :3N6Ej
导线(通道) conduction (track) _<Ip0?N
导线(体)宽度 conductor width ppuJC'GW
导线距离 conductor spacing Gq=tR `.
导线层 conductor layer x)R1aq
导线宽度/间距 conductor line/space Prc(
第一导线层 conductor layer No.1 ~%eZQgqA*
圆形盘 round pad &>n:7
方形盘 square pad @Os0A
菱形盘 diamond pad XqLR2d
长方形焊盘 oblong pad lLur.f
子弹形盘 bullet pad L,yq'>*5s
泪滴盘 teardrop pad qWU59:d^{
雪人盘 snowman pad :jAsm[
形盘 V-shaped pad V HQZJK82
环形盘 annular pad )Vz=:.D
非圆形盘 non-circular pad v65]$%F?
隔离盘 isolation pad (fYYcpd,k
非功能连接盘 monfunctional pad yxtfyf|9 '
偏置连接盘 offset land w1EB>!<;tj
腹(背)裸盘 back-bard land e%km}m A
盘址 anchoring spaur |w"G4J6ha
连接盘图形 land pattern *5u3d`bW
连接盘网格阵列 land grid array }#q0K
孔环 annular ring !5qV}5
元件孔 component hole O]XgA0]
安装孔 mounting hole tUksIUYD\
支撑孔 supported hole s"`Oj5
非支撑孔 unsupported hole d};[^q6X
导通孔 via >Qqxn*O
镀通孔 plated through hole (PTH) 6<%b}q9Mo
余隙孔 access hole Z,-J
tl
盲孔 blind via (hole) ta@fNS4
埋孔 buried via hole |hS^eK_
埋,盲孔 buried blind via aI>F8R?
任意层内部导通孔 any layer inner via hole DW>O]\I
全部钻孔 all drilled hole (&=3Y8
定位孔 toaling hole +y_V$q$G
无连接盘孔 landless hole ?e%u[ Q0
中间孔 interstitial hole =)#<u9
qqL
无连接盘导通孔 landless via hole Rzyaicj^c
引导孔 pilot hole y: ]
端接全隙孔 terminal clearomee hole .E9$j<SP-
准尺寸孔 dimensioned hole [Page] x6Tpt^N}
在连接盘中导通孔 via-in-pad g,G{%dGsk
孔位 hole location fo=@ X>S
孔密度 hole density z%]3`_I
孔图 hole pattern Nx zAlu
钻孔图 drill drawing |kF"p~s
装配图assembly drawing -
i{1h"
参考基准 datum referan &p+2Vz{
1) 元件设备 sY[!=` @
rM4Ri}bS
三绕组变压器:three-column transformer ThrClnTrans xouBBb=
双绕组变压器:double-column transformer DblClmnTrans i)/#u+Y1P
电容器:Capacitor ;Za^).=
并联电容器:shunt capacitor L*P*^I^1
电抗器:Reactor <'jygZ(
母线:Busbar p
m<K6I
输电线:TransmissionLine <vzU}JA\
发电厂:power plant &Z}}9dd
断路器:Breaker Q>xp 90&.n
刀闸(隔离开关):Isolator BwYR"
分接头:tap [fJxbr"
电动机:motor S/yBr`
(2) 状态参数 Y3ypca&P9
1lsg|iVz
有功:active power .G}$jO}
无功:reactive power -aDBdZ;y
电流:current !-7<x"avm
容量:capacity .B!L+M< [
电压:voltage _$mS=G(
档位:tap position F)50 6
有功损耗:reactive loss CHdYY7\{
无功损耗:active loss /GA-1cS_(
功率因数:power-factor "/x/]Qx2
功率:power P#/s5D8
功角:power-angle )LL.fPic
电压等级:voltage grade 9? |m ^
空载损耗:no-load loss :FixLr!q
铁损:iron loss pW&8 =Ew
铜损:copper loss OYOczb]
空载电流:no-load current >qdRqy)DC
阻抗:impedance aSeh?2n8
正序阻抗:positive sequence impedance ?' $}k
负序阻抗:negative sequence impedance 3P*"$ fH
零序阻抗:zero sequence impedance V^\b"1X7N
电阻:resistor |vj!,b88n#
电抗:reactance R;w1& Z
电导:conductance K&&YxX~3
电纳:susceptance P!/:yWd
无功负载:reactive load 或者QLoad PkK#HD
有功负载: active load PLoad xQ=L2pX
遥测:YC(telemetering) ++}#pl8e
遥信:YX UvGX+M,z'
励磁电流(转子电流):magnetizing current i,/Q.XL
定子:stator ([ hd
功角:power-angle Zk #C!]=
上限:upper limit s3)T}52
下限:lower limit Ucj>gc=
并列的:apposable )1&,khd/u
高压: high voltage wHErF
#xo
低压:low voltage ZQ~EaI9R
中压:middle voltage h-@_.&P0e
电力系统 power system 6
wD
发电机 generator Byns6k
励磁 excitation 2J7JEv|
励磁器 excitor PLWx'N-kqL
电压 voltage \'x?VVw
电流 current {"^#CSi
母线 bus .Tc?9X~4
变压器 transformer MLn?t^v-
升压变压器 step-up transformer Q#I?nBin
高压侧 high side +C(/.X
Kz%
输电系统 power transmission system <V*M%YWs
输电线 transmission line
EJO6k1
固定串联电容补偿fixed series capacitor compensation 5?MKx!%
稳定 stability mvBUm-X
电压稳定 voltage stability K-7i4
~
功角稳定 angle stability V,
e
暂态稳定 transient stability JZ0u/x5
电厂 power plant zC$(/nZ
能量输送 power transfer q*{Dy1Tj
交流 AC b %I2ig
装机容量 installed capacity u}KEH@yv
电网 power system ,:/3'L
落点 drop point 51x)fZQ
开关站 switch station Z+x`q#ZQr
双回同杆并架 double-circuit lines on the same tower n5 jzVv
变电站 transformer substation lmr:PX
补偿度 degree of compensation btU:=6
高抗 high voltage shunt reactor RLbxNn
无功补偿 reactive power compensation Amvl/bO
故障 fault ,46k8%WW
调节 regulation Hh.l,Z7i7D
裕度 magin v"smmQZik
三相故障 three phase fault +wg|~Lef h
故障切除时间 fault clearing time [
f`V_1d3
极限切除时间 critical clearing time T=->~@5
切机 generator triping S%m$LM]NCg
高顶值 high limited value 626!6E;T
强行励磁 reinforced excitation !`#xFRHe
线路补偿器 LDC(line drop compensation) 2M+'9+k~
机端 generator terminal ~m.@{Do0p
静态 static (state) Mi_/
^
动态 dynamic (state) fP:g}Z
单机无穷大系统 one machine - infinity bus system 6'qC *r
机端电压控制 AVR y2,M9
电抗 reactance 7q[a8rUdh
电阻 resistance yPza
功角 power angle eo&nAr
有功(功率) active power weky
5(:
无功(功率) reactive power [.NG~ cpb
功率因数 power factor ]\5?E }kd
无功电流 reactive current V0x;*)\PYm
下降特性 droop characteristics Ljjuf=]
斜率 slope !z]2+
额定 rating d%:
变比 ratio F"Y.'my8
参考值 reference value .d>TU bR;
电压互感器 PT L) ]|\|
分接头 tap 6vQCghI
下降率 droop rate h|j$Jy
仿真分析 simulation analysis yk|<P\
传递函数 transfer function gK8{ =A0c
框图 block diagram Q-}yZ
受端 receive-side Akbt%&
裕度 margin A7qKY-4B
同步 synchronization %Z=%E!*
失去同步 loss of synchronization u
6(O;
阻尼 damping +bw>9VmG
摇摆 swing Bqd'2HQd
保护断路器 circuit breaker 93*MY7j}
电阻:resistance MIJ^n(-G
电抗:reactance '-7rHx
阻抗:impedance cn$o$:tW
电导:conductance >qBQfz:U>
电纳:susceptance