1 backplane 背板 \^iPU 27H
2 Band gap voltage reference 带隙电压参考 4C^;lK
3 benchtop supply 工作台电源 JicAz1P1W
4 Block Diagram 方块图 5 Bode Plot 波特图 '~i}2e.
6 Bootstrap 自举 &| %<=\
7 Bottom FET Bottom FET ^yH!IRRAq
8 bucket capcitor 桶形电容 @cPb*
9 chassis 机架 &Zl$7
10 Combi-sense Combi-sense d3h2$EDD
11 constant current source 恒流源 o{yEF1,c\
12 Core Sataration 铁芯饱和 }f)$+mi
13 crossover frequency 交叉频率 "bAkS}(hB(
14 current ripple 纹波电流 ;cl\$TDL
15 Cycle by Cycle 逐周期 >TUs~
16 cycle skipping 周期跳步 V6"<lK8"
17 Dead Time 死区时间 i"%X[(U7
18 DIE Temperature 核心温度 {hB7F"S
19 Disable 非使能,无效,禁用,关断 cZKK\hf<
20 dominant pole 主极点 `e]L.P_e?
21 Enable 使能,有效,启用 O(;K]8
22 ESD Rating ESD额定值 {]plT~{e
23 Evaluation Board 评估板 7
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24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. b7g\wnV8z
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 7''l\3mIn
25 Failling edge 下降沿 9^h\vR|]S
26 figure of merit 品质因数 {g}!M^|
27 float charge voltage 浮充电压 %3scz)4$
28 flyback power stage 反驰式功率级 v5l)T}Nb
29 forward voltage drop 前向压降 tLe!_p)
30 free-running 自由运行 Z8nj9X$
31 Freewheel diode 续流二极管 -}0S%|#m
32 Full load 满负载 33 gate drive 栅极驱动 A_1cM#4
34 gate drive stage 栅极驱动级 Rk.YnA_J6
35 gerber plot Gerber 图 g1VdP[Y#
36 ground plane 接地层 +9G
GC
37 Henry 电感单位:亨利 j?%^N\9
38 Human Body Model 人体模式 0ZPwEP
39 Hysteresis 滞回 C
J S
40 inrush current 涌入电流 C{!L +]/
41 Inverting 反相 $j:$
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42 jittery 抖动 xy$73K6
43 Junction 结点 'gk.J
44 Kelvin connection 开尔文连接 A,i.1U"w8
45 Lead Frame 引脚框架 ~C=I{qzF+
46 Lead Free 无铅 *T
j(IN
47 level-shift 电平移动 Htn=h~U`z
48 Line regulation 电源调整率 |t*(]U2O0
49 load regulation 负载调整率 m\`dLrPX4j
50 Lot Number 批号 <uUQ-]QOIh
51 Low Dropout 低压差 84^'^nd
52 Miller 密勒 53 node 节点 k@U8K(:x
54 Non-Inverting 非反相 K[0.4+
55 novel 新颖的 }r$&"wYM
56 off state 关断状态 [2#5;')
57 Operating supply voltage 电源工作电压 lY/{X]T.(
58 out drive stage 输出驱动级 zWpJ\/k~
59 Out of Phase 异相 6M9t<DQV
60 Part Number 产品型号 3Yf&F([t
61 pass transistor pass transistor o&P}GcEIw
62 P-channel MOSFET P沟道MOSFET `Bk7W]{L
63 Phase margin 相位裕度 )I'?]p<
64 Phase Node 开关节点 exw~SvT3
65 portable electronics 便携式电子设备 &C<K|F!j!
66 power down 掉电 ^;jJVYx-PP
67 Power Good 电源正常 B*7Y5_N
68 Power Groud 功率地 73B,I 0U
69 Power Save Mode 节电模式 .gTla
70 Power up 上电 3~Od2nk(x
71 pull down 下拉 L;zwqdI
72 pull up 上拉 ifj%!*
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) r!SMF]?SJ
74 push pull converter 推挽转换器 iSu7K&X9q
75 ramp down 斜降 Qb<i,`SN
76 ramp up 斜升 aTS\NpK&
77 redundant diode 冗余二极管
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78 resistive divider 电阻分压器 a0I+|fR
79 ringing 振 铃 P8!ON=
80 ripple current 纹波电流 4k/B=%l
81 rising edge 上升沿 eJA$J=^R;
82 sense resistor 检测电阻 {Q],rv|;
83 Sequenced Power Supplys 序列电源 _+PiaJ&'
84 shoot-through 直通,同时导通 I^"ouM9}Q
85 stray inductances. 杂散电感 zaW y7@?
86 sub-circuit 子电路 |{W4JFKJ
87 substrate 基板 ~_opU(;f
88 Telecom 电信 .GcIwP'aU-
89 Thermal Information 热性能信息 q1ybJii
90 thermal slug 散热片 ,5oe8\uz
91 Threshold 阈值 Yt&Isi
+
92 timing resistor 振荡电阻 zQ3m@x
93 Top FET Top FET 68Po`_/s
94 Trace 线路,走线,引线 fB^h2
95 Transfer function 传递函数 K"u-nroHW
96 Trip Point 跳变点 ~hK7(K
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) wZ6D\I
98 Under Voltage Lock Out (UVLO) 欠压锁定 Zjqa n
99 Voltage Reference 电压参考 "fK`F/
100 voltage-second product 伏秒积 np2oXg%
101 zero-pole frequency compensation 零极点频率补偿 I\e?v`e
102 beat frequency 拍频 {!!df.h
103 one shots 单击电路 D4,kGU@
104 scaling 缩放 |vW(;j6
105 ESR 等效串联电阻 [Page] gc(Gc vdB\
106 Ground 地电位 LXYpP-E
107 trimmed bandgap 平衡带隙 'a.n
108 dropout voltage 压差 U\aP
109 large bulk capacitance 大容量电容 .Zo%6[X
110 circuit breaker 断路器 h OYm
=r
111 charge pump 电荷泵 +&hhj~I.
112 overshoot 过冲 $VEG1]/svp
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印制电路printed circuit .*XELP=BT
印制线路 printed wiring EWOS6Yg7
印制板 printed board @1+C*
印制板电路 printed circuit board ;R[ xo!
印制线路板 printed wiring board 3#GZ6:rVJ
印制元件 printed component e7e6b-"_2
印制接点 printed contact FY;\1bt<<
印制板装配 printed board assembly wq yw#)S
板 board x_za
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刚性印制板 rigid printed board W|@7I@@$"
挠性印制电路 flexible printed circuit GJZGHUB=>
挠性印制线路 flexible printed wiring c:#<g/-{wM
齐平印制板 flush printed board A8,9^cQ]
金属芯印制板 metal core printed board ;]*V6!6RR
金属基印制板 metal base printed board 'Br:f_}
多重布线印制板 mulit-wiring printed board WFWQ;U{|
塑电路板 molded circuit board +'fy%/
散线印制板 discrete wiring board R7)\wP*l5
微线印制板 micro wire board _#[~?g`
积层印制板 buile-up printed board ed3d 6/%HR
表面层合电路板 surface laminar circuit +_^Rxx!XA
埋入凸块连印制板 B2it printed board )m8ve)l
载芯片板 chip on board R Lnsy,
埋电阻板 buried resistance board {
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母板 mother board Z_b^K^4
子板 daughter board /zt9;^e
背板 backplane DlC\sm
裸板 bare board D$X9xtT
键盘板夹心板 copper-invar-copper board E}Ir<\
动态挠性板 dynamic flex board RYhaQ&1i
静态挠性板 static flex board ~kDR9s7
可断拼板 break-away planel :TU|;(p
电缆 cable JA]TO(x
挠性扁平电缆 flexible flat cable (FFC) Q1ox<-
薄膜开关 membrane switch oZM6%-@qi
混合电路 hybrid circuit $qz(9M(m#
厚膜 thick film yH`4sd
厚膜电路 thick film circuit /"~ D(bw0=
薄膜 thin film {;:QY1QT
薄膜混合电路 thin film hybrid circuit \R"} =7
互连 interconnection L >*
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导线 conductor trace line MHF31/g\
齐平导线 flush conductor ! z!lQ~
传输线 transmission line 01N]|F:
跨交 crossover GUX!kj
板边插头 edge-board contact cZ8lRVaWW
增强板 stiffener A%Ov.~&\G
基底 substrate 'eM90I%(
基板面 real estate [_$r- FA
导线面 conductor side !yUn|v>&p
元件面 component side 7!-3jU@m
焊接面 solder side #sHA!@ |
导电图形 conductive pattern N+)gYb6h
非导电图形 non-conductive pattern +&AKDVmx
基材 base material [{s 1=c
层压板 laminate BIu%A]e"
覆金属箔基材 metal-clad bade material It5U=PU
覆铜箔层压板 copper-clad laminate (CCL) `zRE $O
复合层压板 composite laminate D)kh"cK*1
薄层压板 thin laminate tVAWc$3T
基体材料 basis material t>f61<27eB
预浸材料 prepreg S\\3?[!p
粘结片 bonding sheet oK-T@ &-
预浸粘结片 preimpregnated bonding sheer WO}l&Q
环氧玻璃基板 epoxy glass substrate fPW|)e"
预制内层覆箔板 mass lamination panel Y 6NoNc]h
内层芯板 core material Nu/D$m'PY
粘结层 bonding layer VXE85
粘结膜 film adhesive L&gC
无支撑胶粘剂膜 unsupported adhesive film mbf'xGO
覆盖层 cover layer (cover lay) ;8|D4+
增强板材 stiffener material 9S<87sO
铜箔面 copper-clad surface I "8:IF
去铜箔面 foil removal surface fX:)mLnO/
层压板面 unclad laminate surface TO(2n8'fdO
基膜面 base film surface /*V:Lh
胶粘剂面 adhesive faec `.MY"g9
原始光洁面 plate finish G,{=sFX
粗面 matt finish b`W2^/D
剪切板 cut to size panel |"K<
超薄型层压板 ultra thin laminate LnwI 7uvq
A阶树脂 A-stage resin 2H,^i,
B阶树脂 B-stage resin V`ODX>\
C阶树脂 C-stage resin |b
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环氧树脂 epoxy resin pCB^\M%*
酚醛树脂 phenolic resin 1 #zIAN>
聚酯树脂 polyester resin %=ZN2)7{
聚酰亚胺树脂 polyimide resin 8+7n"6GY2/
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin xSf&*wLE
丙烯酸树脂 acrylic resin fXL&?~fS
三聚氰胺甲醛树脂 melamine formaldehyde resin !!{!T;)l
多官能环氧树脂 polyfunctional epoxy resin 5B|&+7dCw
溴化环氧树脂 brominated epoxy resin (f-Mm0%[
环氧酚醛 epoxy novolac QNN*/n
氟树脂 fluroresin B%]yLJ
硅树脂 silicone resin WxLmzSz{xD
硅烷 silane vb&1 S
聚合物 polymer T%[&[8{8
无定形聚合物 amorphous polymer fZq_]1(/uP
结晶现象 crystalline polamer gv6}GE
双晶现象 dimorphism ak SUk)}e
共聚物 copolymer k;7R3O@
合成树脂 synthetic |9fvj6?Y
热固性树脂 thermosetting resin [Page] GlVb |O"
热塑性树脂 thermoplastic resin &N