1 backplane 背板 [7Nn%eZC
2 Band gap voltage reference 带隙电压参考 c ;3bX6RD*
3 benchtop supply 工作台电源 ;(w=}s%]+
4 Block Diagram 方块图 5 Bode Plot 波特图 m[^;HwJ
6 Bootstrap 自举 @C=, >+D
7 Bottom FET Bottom FET IidZ-Il
8 bucket capcitor 桶形电容 ^v3+w"2
9 chassis 机架 <.3@-z>w2,
10 Combi-sense Combi-sense .Jdw:
11 constant current source 恒流源 Fga9
12 Core Sataration 铁芯饱和 k;3P;@3,W
13 crossover frequency 交叉频率 :Puv8[1i
14 current ripple 纹波电流 c: *wev
15 Cycle by Cycle 逐周期 Tu_dkif'
16 cycle skipping 周期跳步 "!)8bTW
17 Dead Time 死区时间 }jU{RR%6B
18 DIE Temperature 核心温度 P7\(D`
19 Disable 非使能,无效,禁用,关断 ?l,i(I
20 dominant pole 主极点 y<F$@
21 Enable 使能,有效,启用 zi>f436-
22 ESD Rating ESD额定值 M
_U$I7
23 Evaluation Board 评估板 (XqeX(s
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. e;3$7$n Pv
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 cb%w,yXw
25 Failling edge 下降沿 !^axO
26 figure of merit 品质因数 Wr)%C
27 float charge voltage 浮充电压 4)j<(5
28 flyback power stage 反驰式功率级 rvE!Q=y~
29 forward voltage drop 前向压降 +G/~v`Bv
30 free-running 自由运行 mA^>Y_:
31 Freewheel diode 续流二极管 66L*6O4
32 Full load 满负载 33 gate drive 栅极驱动 zm8m J2s
34 gate drive stage 栅极驱动级 cjN4U [
35 gerber plot Gerber 图 tW=0AtZl]
36 ground plane 接地层 R:.7c(s
37 Henry 电感单位:亨利 dN*<dz+4r
38 Human Body Model 人体模式 g"Ii'JZ?
39 Hysteresis 滞回 =m/2)R{
40 inrush current 涌入电流 g<.8iW 'c
41 Inverting 反相 &H4UVI
42 jittery 抖动 %!.rP
43 Junction 结点 G,"$Erx
44 Kelvin connection 开尔文连接 ;,4J:zvZdQ
45 Lead Frame 引脚框架 Cza)s
46 Lead Free 无铅 moo>~F _^
47 level-shift 电平移动 U_8I$v-~
48 Line regulation 电源调整率 b5)>h
49 load regulation 负载调整率 un9o~3SF<
50 Lot Number 批号 |y=gp
51 Low Dropout 低压差 l|up3A3)
52 Miller 密勒 53 node 节点 <%Rr-,
54 Non-Inverting 非反相 <1LuYEDq
55 novel 新颖的 rFK
*
56 off state 关断状态 $7bmUQ|
57 Operating supply voltage 电源工作电压 T
a[74;VO
58 out drive stage 输出驱动级 ~
dk1fh
59 Out of Phase 异相 P4AdfHk
60 Part Number 产品型号 *Xnq1_K}
61 pass transistor pass transistor Z"^@B2v
62 P-channel MOSFET P沟道MOSFET .R"L$V$RU.
63 Phase margin 相位裕度 |S}*M<0
64 Phase Node 开关节点 W P&zF$
65 portable electronics 便携式电子设备 ;5l|-&{@*
66 power down 掉电 +~v(*s C
67 Power Good 电源正常 xr2:bu
68 Power Groud 功率地 NEH$&%OV?
69 Power Save Mode 节电模式 wz#n$W3mGf
70 Power up 上电 <KA@A}
71 pull down 下拉 1mV0AE538
72 pull up 上拉 c2f$:XiM
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Ne EV!V8
74 push pull converter 推挽转换器 w6Q]?p+
75 ramp down 斜降 I$LO0avvH2
76 ramp up 斜升 i5" q1dRQ
77 redundant diode 冗余二极管 Sx"I]N
78 resistive divider 电阻分压器 4{g|$@s(
79 ringing 振 铃 #*/h*GNMs
80 ripple current 纹波电流 yw<xv-Q=i
81 rising edge 上升沿 :JIPF=]fc
82 sense resistor 检测电阻 hzb|:
83 Sequenced Power Supplys 序列电源 y|se^dn
84 shoot-through 直通,同时导通 A{%;Hd`0/
85 stray inductances. 杂散电感 t@n (a
86 sub-circuit 子电路 ]IV;>94[
87 substrate 基板 W!X]t)Ow
88 Telecom 电信 j[cjQ]>~'
89 Thermal Information 热性能信息 Se8y-AL6x>
90 thermal slug 散热片 tV9C33
91 Threshold 阈值 Rp*t"HSaAW
92 timing resistor 振荡电阻 UGt7iT<`8
93 Top FET Top FET *Rh .s!@4
94 Trace 线路,走线,引线 E;H(jVZ
95 Transfer function 传递函数 &7&*As
96 Trip Point 跳变点 X~3P?O]kFv
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) {B.]w9
98 Under Voltage Lock Out (UVLO) 欠压锁定 e~;)-Z
99 Voltage Reference 电压参考 VBJ]d|
100 voltage-second product 伏秒积 7F:;3c
101 zero-pole frequency compensation 零极点频率补偿 :q<%wLs
102 beat frequency 拍频 Xy<f_
103 one shots 单击电路
(Nb1R"J`
104 scaling 缩放 pw yl,A
105 ESR 等效串联电阻 [Page] {VG[m@
106 Ground 地电位 /exl9Ilt]
107 trimmed bandgap 平衡带隙 N-YZ0/c
108 dropout voltage 压差 /,Id_TTCO
109 large bulk capacitance 大容量电容 }zxh:"#K
110 circuit breaker 断路器 e*6` dz@
111 charge pump 电荷泵 r~_ /Jj
112 overshoot 过冲 72vGfT2HtZ
TcmZ0L^O
印制电路printed circuit pY>-N
印制线路 printed wiring v^_]W3K
印制板 printed board .hNw1~Fj
印制板电路 printed circuit board T8TsKjqOZ
印制线路板 printed wiring board ={@ @`yP^$
印制元件 printed component T KL(97)<
印制接点 printed contact Mv`L F
印制板装配 printed board assembly SH$cn,3F8
板 board 4?M3#],'h
刚性印制板 rigid printed board Fd,+(i D
挠性印制电路 flexible printed circuit ~w9=Fd6
挠性印制线路 flexible printed wiring }\L!;6oy
齐平印制板 flush printed board UMi`u6#
金属芯印制板 metal core printed board 't?7.#,6O
金属基印制板 metal base printed board "mK i$FV
多重布线印制板 mulit-wiring printed board , !%R5*?=D
塑电路板 molded circuit board LI;Efy L
散线印制板 discrete wiring board \j})Kul
微线印制板 micro wire board !5SQN5K
积层印制板 buile-up printed board J[Yg]6
表面层合电路板 surface laminar circuit =>ztB w\
埋入凸块连印制板 B2it printed board ZWhmO=b!
载芯片板 chip on board QUZQY`'@
埋电阻板 buried resistance board ^N2M/B|0
母板 mother board , 64t
子板 daughter board P9TBQW2G{
背板 backplane /`O]etr`d
裸板 bare board .i&ZT}v3
键盘板夹心板 copper-invar-copper board 11y.z^
动态挠性板 dynamic flex board 'Ywpdzz[
静态挠性板 static flex board 87pXv6'FQ
可断拼板 break-away planel W6Aj<{\F
电缆 cable =e!l=d|/
挠性扁平电缆 flexible flat cable (FFC) c6Aut`dK
薄膜开关 membrane switch E_D ^O
混合电路 hybrid circuit KW|\)83$
厚膜 thick film ./&zO{|0]
厚膜电路 thick film circuit M9s43XL(&
薄膜 thin film RE>ks[
薄膜混合电路 thin film hybrid circuit 7{An@hNh
互连 interconnection w &|R5Q
导线 conductor trace line ^K.u
~p
齐平导线 flush conductor M6jp1:ZH2q
传输线 transmission line H\| ]!8w5Z
跨交 crossover F?8BS*r_
板边插头 edge-board contact fzS`dL5,W
增强板 stiffener
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基底 substrate )W`SC mr]
基板面 real estate 2<'`^AO@
导线面 conductor side SY'2A)
元件面 component side }U%^3r-
焊接面 solder side ?Ml%$z@b?
导电图形 conductive pattern o#xgrMB
非导电图形 non-conductive pattern )d +hZ'
基材 base material ,M)k7t:
层压板 laminate 8M^wuRn
覆金属箔基材 metal-clad bade material mG831v?
覆铜箔层压板 copper-clad laminate (CCL) 2'wr={>W
复合层压板 composite laminate gEv-> pc
薄层压板 thin laminate Q !9HA[Ly
基体材料 basis material /
l".}S
预浸材料 prepreg 'aD6>8/Hj
粘结片 bonding sheet q*6q}s3n
预浸粘结片 preimpregnated bonding sheer -<^jGrb
环氧玻璃基板 epoxy glass substrate m|pTn#*`
预制内层覆箔板 mass lamination panel D@8jGcz62
内层芯板 core material aSOU#Csx
粘结层 bonding layer fO].e"}
粘结膜 film adhesive 9~@<-6jE3b
无支撑胶粘剂膜 unsupported adhesive film zKLn!b#>
覆盖层 cover layer (cover lay) K7IyCcdB
增强板材 stiffener material q0&Wk"X%rr
铜箔面 copper-clad surface <