1 backplane 背板 H%,jB<-.A
2 Band gap voltage reference 带隙电压参考 `
u# '
3 benchtop supply 工作台电源 =0te.io)3O
4 Block Diagram 方块图 5 Bode Plot 波特图 Eei"baw/
6 Bootstrap 自举 T3HAr9i%)
7 Bottom FET Bottom FET {K\l3_=5qb
8 bucket capcitor 桶形电容 C-
Aiv@@<=
9 chassis 机架 Fai_v{&?
10 Combi-sense Combi-sense _[zZm*
11 constant current source 恒流源 V3%"z
12 Core Sataration 铁芯饱和 ~H[
13 crossover frequency 交叉频率 mWOW39Ku
14 current ripple 纹波电流 kA`Z#yu
15 Cycle by Cycle 逐周期 fE1B1j<
16 cycle skipping 周期跳步 "N"$B~W*
17 Dead Time 死区时间 #fq%903=
18 DIE Temperature 核心温度 >s
4"2X
19 Disable 非使能,无效,禁用,关断 l^.d3b
20 dominant pole 主极点 ?LJDBN
21 Enable 使能,有效,启用 %4F
Q~
22 ESD Rating ESD额定值 ET]PF ,`
23 Evaluation Board 评估板 j]-0m4QF
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. tDWW
4H
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 &`#k1t'
25 Failling edge 下降沿 S6k
R o^2
26 figure of merit 品质因数 X9W'.s.[Q
27 float charge voltage 浮充电压 UKYQ @m
28 flyback power stage 反驰式功率级 G,tJ\xMw8
29 forward voltage drop 前向压降 QucDIZ
30 free-running 自由运行 N?xZ]?T
31 Freewheel diode 续流二极管 #nK38W#
32 Full load 满负载 33 gate drive 栅极驱动 l(c2 B
34 gate drive stage 栅极驱动级 i!H)@4jX
35 gerber plot Gerber 图 K U 2LJ_~Y
36 ground plane 接地层 {WBe(dc_%
37 Henry 电感单位:亨利 nz{
;]U1
38 Human Body Model 人体模式 s)Gnj;
39 Hysteresis 滞回 N$\'X<{
40 inrush current 涌入电流 j7(sYo@x7
41 Inverting 反相 8Ld`$_E
42 jittery 抖动 jZjWz1+
43 Junction 结点 [i[*xf-B
44 Kelvin connection 开尔文连接 {1 VHz])I
45 Lead Frame 引脚框架 $8/=@E{51
46 Lead Free 无铅 nWfzwXP>_
47 level-shift 电平移动 ] !7%)
48 Line regulation 电源调整率 }ufzlHD
49 load regulation 负载调整率 cyM9[X4rC
50 Lot Number 批号 W''%{A/'
51 Low Dropout 低压差 'eyzH[l,(
52 Miller 密勒 53 node 节点
fQW1&lFT
54 Non-Inverting 非反相 F$L2bgQR?'
55 novel 新颖的 " ^v/Y
56 off state 关断状态 $|kq{@<
57 Operating supply voltage 电源工作电压 jL9g.q4^
58 out drive stage 输出驱动级 RIhu9W
59 Out of Phase 异相 o,-p[1b
60 Part Number 产品型号 xq6
eu
9
61 pass transistor pass transistor 5j8aMnv s
62 P-channel MOSFET P沟道MOSFET <z'Pj7c[
63 Phase margin 相位裕度 Vd+qi~kA
64 Phase Node 开关节点 ;jgk53lo
65 portable electronics 便携式电子设备 4>x$I9^Y!
66 power down 掉电 A-n@:` n~
67 Power Good 电源正常 1c5+XCr
68 Power Groud 功率地 NO)Hi)$X6Y
69 Power Save Mode 节电模式 ;mT|0&o>#
70 Power up 上电 \d'>Ky;GD
71 pull down 下拉 \ltbiDP2
72 pull up 上拉 ^sF/-/ {?U
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) B$ =oU
74 push pull converter 推挽转换器 DOaTp f
75 ramp down 斜降 :EGvI
76 ramp up 斜升 u%t/W0xi
77 redundant diode 冗余二极管 AvmI<U
78 resistive divider 电阻分压器 dd+hX$,
79 ringing 振 铃 lfJvN
80 ripple current 纹波电流 aru;yR
81 rising edge 上升沿 `49: !M$i
82 sense resistor 检测电阻 ?l> <?i
83 Sequenced Power Supplys 序列电源 !W\za0p
84 shoot-through 直通,同时导通 539fB,
85 stray inductances. 杂散电感 1Yk!R9.
86 sub-circuit 子电路 Y>J$OA:
87 substrate 基板 <)qJI'u|
88 Telecom 电信 >z'T"R/
89 Thermal Information 热性能信息 +g9CklJ
90 thermal slug 散热片 \CU-a`n
91 Threshold 阈值 +6~y1s/B[
92 timing resistor 振荡电阻 qjm6\ii:)
93 Top FET Top FET \ u*R6z
94 Trace 线路,走线,引线 whW%c8
95 Transfer function 传递函数 #+"1">l
96 Trip Point 跳变点 + L\Dh.Ir
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) Qi= pP/Y
98 Under Voltage Lock Out (UVLO) 欠压锁定 i5*BZv>e
99 Voltage Reference 电压参考 ~D0e\Q(A
100 voltage-second product 伏秒积 *Cj<Vy
101 zero-pole frequency compensation 零极点频率补偿 ykS-5E`
102 beat frequency 拍频 ixvF`S9
103 one shots 单击电路 iW?z2%#
104 scaling 缩放 ;hV-*;>
105 ESR 等效串联电阻 [Page] 0Yk$f1g
106 Ground 地电位 ?3_^SRW&a
107 trimmed bandgap 平衡带隙 _x` oab0@
108 dropout voltage 压差 tqFE>ojlI
109 large bulk capacitance 大容量电容 _'mK=`>u
110 circuit breaker 断路器 b Y2:g )
111 charge pump 电荷泵 4=nh'
U38
112 overshoot 过冲 8C=8Wjm
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印制电路printed circuit W^,(we
印制线路 printed wiring ==Ah& ){4^
印制板 printed board 5M&<tj/[a0
印制板电路 printed circuit board YlC$L$%Zd.
印制线路板 printed wiring board o.g)[$M8cF
印制元件 printed component LOEiV
印制接点 printed contact K^Ho%_)
印制板装配 printed board assembly 8b[<:{[YB
板 board Aa`R40 yl
刚性印制板 rigid printed board wBlo2WY
挠性印制电路 flexible printed circuit rqWD#FB=z
挠性印制线路 flexible printed wiring @@3%lr71
齐平印制板 flush printed board X/f?=U
金属芯印制板 metal core printed board mhgvN-? "h
金属基印制板 metal base printed board AsfmH-4)
多重布线印制板 mulit-wiring printed board _[pbfua
塑电路板 molded circuit board o_sb+Vn|
散线印制板 discrete wiring board 5hl!zA?
微线印制板 micro wire board B'-n
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积层印制板 buile-up printed board SUb:0GUa
表面层合电路板 surface laminar circuit E#~J"9k98
埋入凸块连印制板 B2it printed board Ez+8B|0P
载芯片板 chip on board T0X+\&W
埋电阻板 buried resistance board <xlyk/
母板 mother board Y#zHw<<E
子板 daughter board f;%=S:3
背板 backplane tx$`1KA
裸板 bare board c=f;3N
键盘板夹心板 copper-invar-copper board Y~B-dx'V
动态挠性板 dynamic flex board =eQ'^3a
静态挠性板 static flex board v[4-?7-
可断拼板 break-away planel MmQk@~
电缆 cable WCP2x.gb5
挠性扁平电缆 flexible flat cable (FFC) 97pfMk1_
薄膜开关 membrane switch GGU>={D)
混合电路 hybrid circuit /[I#3|
厚膜 thick film qm6 X5T
厚膜电路 thick film circuit 3~\,VO''
薄膜 thin film cDq*B*e
薄膜混合电路 thin film hybrid circuit (H;,E-
互连 interconnection {XH3zMk[
导线 conductor trace line UmL Boy&*
齐平导线 flush conductor 07G'"=
传输线 transmission line pwVaSnre`
跨交 crossover 7;a
板边插头 edge-board contact Z=beki]
增强板 stiffener G4^6o[ x
基底 substrate r8>Qs RnU%
基板面 real estate fwi
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导线面 conductor side y=2nV
元件面 component side m>f8RBp]'
焊接面 solder side t]hfq~Ft
导电图形 conductive pattern +t8#rT ^B
非导电图形 non-conductive pattern FK@Gd)(
基材 base material 0.&-1pw
层压板 laminate dN@C)5pm5`
覆金属箔基材 metal-clad bade material tu^C<MV
覆铜箔层压板 copper-clad laminate (CCL) _Mi*Fvj
复合层压板 composite laminate qS?^(Vt|R
薄层压板 thin laminate Pp.]/;
基体材料 basis material $U"pdf
预浸材料 prepreg 8M,$|\U
粘结片 bonding sheet L0qL\>#ejr
预浸粘结片 preimpregnated bonding sheer K.Y.K$NjP{
环氧玻璃基板 epoxy glass substrate S;tvt/\!Z
预制内层覆箔板 mass lamination panel P1&Irwb`
内层芯板 core material i.gagb
粘结层 bonding layer }J6 y NoXu
粘结膜 film adhesive
825 QS`
无支撑胶粘剂膜 unsupported adhesive film a>&dAo}
覆盖层 cover layer (cover lay) 2>g!+p Ox
增强板材 stiffener material s=Xg6 D
铜箔面 copper-clad surface %zN~%mJG
去铜箔面 foil removal surface Q"K`~QF"
层压板面 unclad laminate surface I7+yu>
基膜面 base film surface z8j7K'vV1
胶粘剂面 adhesive faec y>c Yw!
原始光洁面 plate finish jEm=A8q
粗面 matt finish sC_doh_M
剪切板 cut to size panel \eXuNv_
超薄型层压板 ultra thin laminate }Vfc;2
A阶树脂 A-stage resin S&F;~
B阶树脂 B-stage resin KB$Y8[
C阶树脂 C-stage resin C_&ZQlgQ
环氧树脂 epoxy resin \"9ysePI
酚醛树脂 phenolic resin 4$+/7I \
聚酯树脂 polyester resin _
Gkb[H&RZ
聚酰亚胺树脂 polyimide resin SP4(yJy&
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin Y?%=6S
丙烯酸树脂 acrylic resin bp'\nso/
三聚氰胺甲醛树脂 melamine formaldehyde resin k/i&e~! \
多官能环氧树脂 polyfunctional epoxy resin >6|Xvtf
溴化环氧树脂 brominated epoxy resin FAq9G-\B
环氧酚醛 epoxy novolac >gDKkeLD
氟树脂 fluroresin (d['f]S+&
硅树脂 silicone resin !.7m4mKzo
硅烷 silane Jm 1n|f
聚合物 polymer >vDi,qmZ
无定形聚合物 amorphous polymer -kb;h F}.
结晶现象 crystalline polamer cHJ4[x=
双晶现象 dimorphism Wf=hFc1_@
共聚物 copolymer d~y]7h |
合成树脂 synthetic Zbf~E {
热固性树脂 thermosetting resin [Page] zANsv9R~
热塑性树脂 thermoplastic resin sqO$ka{
感光性树脂 photosensitive resin K<v:RbU|[1
环氧值 epoxy value k)agbx
双氰胺 dicyandiamide ufN`=IJ%
粘结剂 binder L(}/W~En
胶粘剂 adesive _xM3c&VeG
固化剂 curing agent 8COGe=+o
阻燃剂 flame retardant 5s<.qDc
遮光剂 opaquer 8aVj@x$'
增塑剂 plasticizers H<
不饱和聚酯 unsatuiated polyester &