1 backplane 背板 UuT>qWxQ8
2 Band gap voltage reference 带隙电压参考 H1|X0a(j
3 benchtop supply 工作台电源 -O~WHi5}
4 Block Diagram 方块图 5 Bode Plot 波特图 `(=)8>|e
6 Bootstrap 自举 0$&Z_oJ
7 Bottom FET Bottom FET H` Q_gy5Z(
8 bucket capcitor 桶形电容 -+|0LXo
9 chassis 机架 $a\q<fN}
10 Combi-sense Combi-sense QfU
0*W?r
11 constant current source 恒流源 yhQo1e>
12 Core Sataration 铁芯饱和 wias]u|
13 crossover frequency 交叉频率 Ym&_IOx
14 current ripple 纹波电流 4,FkA_k
15 Cycle by Cycle 逐周期 zo@>~G3$9
16 cycle skipping 周期跳步 w[PW-m^`
17 Dead Time 死区时间 /c/!13|
18 DIE Temperature 核心温度 L7n->8Qk
19 Disable 非使能,无效,禁用,关断 B_`A[0H
20 dominant pole 主极点 @[zPN[z.
21 Enable 使能,有效,启用 H)
q9.Jg
22 ESD Rating ESD额定值 @z
dmB~C
23 Evaluation Board 评估板 GOH@|2N
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. E3,Z(dpX!
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 aU4'_%Y@
25 Failling edge 下降沿 $g#X9/+<
26 figure of merit 品质因数 Dr(.|)hv[&
27 float charge voltage 浮充电压 *KxV;H8/
28 flyback power stage 反驰式功率级 !bH-(K{S6
29 forward voltage drop 前向压降 .d8) *
30 free-running 自由运行 bL
*; N3#E
31 Freewheel diode 续流二极管 `mw@"
32 Full load 满负载 33 gate drive 栅极驱动 Ofqe+C
34 gate drive stage 栅极驱动级 }}grJh>tGg
35 gerber plot Gerber 图 6xnJyEQUM
36 ground plane 接地层 K*
[cJcY+
37 Henry 电感单位:亨利 f=~@e#U
38 Human Body Model 人体模式 R(pvUm&L
39 Hysteresis 滞回 uT]_pKm
40 inrush current 涌入电流 A!iH g__/t
41 Inverting 反相 _3A$zA
42 jittery 抖动 s.zH.q,
43 Junction 结点 s}|IRDpp
44 Kelvin connection 开尔文连接 p4{?Rhb6
45 Lead Frame 引脚框架 qcQ`WU{
46 Lead Free 无铅 XZp(Po:H
47 level-shift 电平移动 $Ae/NwIlc
48 Line regulation 电源调整率 K<Yh'RvTD
49 load regulation 负载调整率 &??(EA3
50 Lot Number 批号 Dvd.Q/f
51 Low Dropout 低压差 RG*Nw6A
52 Miller 密勒 53 node 节点 !S(jT?'w
54 Non-Inverting 非反相 .vpQ3m>
55 novel 新颖的 B TcxBh
56 off state 关断状态 /^/'9}7
57 Operating supply voltage 电源工作电压 4D\_[(P
58 out drive stage 输出驱动级 *#UDMoz<
59 Out of Phase 异相 pk;bx2CP8
60 Part Number 产品型号 )E6m}? H5
61 pass transistor pass transistor r)X?H
62 P-channel MOSFET P沟道MOSFET @gxO%@@
63 Phase margin 相位裕度 LfgR[!
64 Phase Node 开关节点 ^o?.Rph|i]
65 portable electronics 便携式电子设备 #B+2qD>E
66 power down 掉电 / d6mlQS
67 Power Good 电源正常 C:4h
68 Power Groud 功率地 7qL]_u[^
69 Power Save Mode 节电模式 ",Q \A I
70 Power up 上电 4,$x~m`N
71 pull down 下拉 B>?. Nr
72 pull up 上拉 w`#lLl
B
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) JvHJ*E
74 push pull converter 推挽转换器 !xe<@$
75 ramp down 斜降 T w"^I*B
76 ramp up 斜升 1q\U
(^
77 redundant diode 冗余二极管 83TN6gW
78 resistive divider 电阻分压器 PjsQ+5[>
79 ringing 振 铃 deeOtco$LT
80 ripple current 纹波电流 g-*@I`k[
81 rising edge 上升沿
ZfvFs
82 sense resistor 检测电阻 "me Jn/
83 Sequenced Power Supplys 序列电源 ^=R>rUCmv
84 shoot-through 直通,同时导通 4s"8e]q=
85 stray inductances. 杂散电感 i$og
v2J
86 sub-circuit 子电路 Y/@4|9!
87 substrate 基板 R_@yj]%H=
88 Telecom 电信 <7TpC@"/g
89 Thermal Information 热性能信息 M5%u>$2
90 thermal slug 散热片 ]^Q`CiKd
91 Threshold 阈值 U.wgae].O;
92 timing resistor 振荡电阻 CH9#<?l
93 Top FET Top FET j/^0q90QO
94 Trace 线路,走线,引线 _Dk;U*2
95 Transfer function 传递函数 2]>s@?[
96 Trip Point 跳变点 w
#1l)+
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) lZ_i~;u4@v
98 Under Voltage Lock Out (UVLO) 欠压锁定 ?"sk"{
99 Voltage Reference 电压参考 2!" N9Adt
100 voltage-second product 伏秒积 Keof{>V=CA
101 zero-pole frequency compensation 零极点频率补偿 UTs0=:+,t
102 beat frequency 拍频 ]Ff&zBJ
103 one shots 单击电路 `+*
M r
104 scaling 缩放 IS'=%qhC`
105 ESR 等效串联电阻 [Page] 0Y!Bb2m
106 Ground 地电位 <[a9"G7
107 trimmed bandgap 平衡带隙 >Y{.)QS
108 dropout voltage 压差 yiI&>J))
109 large bulk capacitance 大容量电容 M:C*?;K:
110 circuit breaker 断路器 Wb*d`hzQ}
111 charge pump 电荷泵 ld2\/9+n
112 overshoot 过冲 /"/$1F%{
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印制电路printed circuit L"('gc!W
印制线路 printed wiring %A W
印制板 printed board bLNQ%=FjO
印制板电路 printed circuit board g7d) YUc
印制线路板 printed wiring board zo]7#
印制元件 printed component 6dg[
印制接点 printed contact k (
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印制板装配 printed board assembly BHFWig*{
板 board g<{~f
刚性印制板 rigid printed board J-I7K!B
挠性印制电路 flexible printed circuit teM&[U
挠性印制线路 flexible printed wiring Ye1P5+W(
齐平印制板 flush printed board `9$?g|rB
金属芯印制板 metal core printed board i>e7 5`9
金属基印制板 metal base printed board S!g&&RDx
多重布线印制板 mulit-wiring printed board eUBk^C]\
塑电路板 molded circuit board nGyY`wt&Rg
散线印制板 discrete wiring board Ui1K66{
微线印制板 micro wire board ]>`Q"g~0
积层印制板 buile-up printed board P^1rNB
表面层合电路板 surface laminar circuit ]`:Fj|>
埋入凸块连印制板 B2it printed board v3@)q0@
载芯片板 chip on board }b,a*4pN
埋电阻板 buried resistance board ]CHMkuP[k
母板 mother board !5=3Y4bg1
子板 daughter board fh,Y#. V`
背板 backplane %7V?7BE
裸板 bare board $RF"m"
键盘板夹心板 copper-invar-copper board /nC"'d(#
动态挠性板 dynamic flex board Z/ThYbk
静态挠性板 static flex board 2Jj`7VH>
可断拼板 break-away planel -G*u2i_*
电缆 cable ][0HJG{{g
挠性扁平电缆 flexible flat cable (FFC) F]YPq
薄膜开关 membrane switch =#>P!
混合电路 hybrid circuit ZY][LU~l8
厚膜 thick film uHwuw_eK`
厚膜电路 thick film circuit 1lx\Pz@ol
薄膜 thin film b!UT<:o
薄膜混合电路 thin film hybrid circuit NG b`f-:jw
互连 interconnection {O!fV<Vx 9
导线 conductor trace line s]=kD
齐平导线 flush conductor oM< &4F
传输线 transmission line 7f
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跨交 crossover (r7~ccy4
板边插头 edge-board contact 8(S'g+p
增强板 stiffener g[Yok`e[
基底 substrate oTfEX4 t {
基板面 real estate sb8SG_ c.
导线面 conductor side Wc+ e>*
元件面 component side $Y ]*v)}X
焊接面 solder side I*}:C
导电图形 conductive pattern VoP(!.Ua>7
非导电图形 non-conductive pattern 'MC)%N,
基材 base material 9$Hgh7'hvs
层压板 laminate 'RG`DzuF
覆金属箔基材 metal-clad bade material }*+ca>K
覆铜箔层压板 copper-clad laminate (CCL) UkeW2l`:
复合层压板 composite laminate )DoY*'Cl
薄层压板 thin laminate gE8>5_R|
基体材料 basis material 242lR0#aY
预浸材料 prepreg =P2T&Gb
粘结片 bonding sheet v'Lckw@G4
预浸粘结片 preimpregnated bonding sheer 6i&WF<%D
环氧玻璃基板 epoxy glass substrate zzPgLE55
预制内层覆箔板 mass lamination panel g:OVAA
内层芯板 core material BeplS
粘结层 bonding layer `cVG_=2
粘结膜 film adhesive v|n.AGn
无支撑胶粘剂膜 unsupported adhesive film GL
(YC-{
覆盖层 cover layer (cover lay) WRD^S:`BH
增强板材 stiffener material R=PjLH&)
铜箔面 copper-clad surface w`i3B@w
去铜箔面 foil removal surface hp[8.Z$7
层压板面 unclad laminate surface 7(wY4T
基膜面 base film surface u6|7P<HUfb
胶粘剂面 adhesive faec ==|//:: \
原始光洁面 plate finish <4Ujk8Zj
粗面 matt finish R#Ss_y
剪切板 cut to size panel Ak|jJ
超薄型层压板 ultra thin laminate =FdS'<GM
A阶树脂 A-stage resin `bivAL
B阶树脂 B-stage resin 03{e[#6
C阶树脂 C-stage resin !o>/gI`
环氧树脂 epoxy resin tohYwXN
酚醛树脂 phenolic resin KS%xo6k.
聚酯树脂 polyester resin 5w{_WR6,
聚酰亚胺树脂 polyimide resin $'kIo*cZ
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin L+d_+:w
丙烯酸树脂 acrylic resin wn|Sdp
三聚氰胺甲醛树脂 melamine formaldehyde resin ?;}2Z)
多官能环氧树脂 polyfunctional epoxy resin x/5%a{~j2
溴化环氧树脂 brominated epoxy resin xNl_Q8Z?R^
环氧酚醛 epoxy novolac "z7.i{
氟树脂 fluroresin 6i>xCb
硅树脂 silicone resin {wCQ#V
硅烷 silane -CxaOZG
聚合物 polymer K{"(|~=U
无定形聚合物 amorphous polymer p?5`+Z
结晶现象 crystalline polamer /z~;.jRg
双晶现象 dimorphism 1oodw!hW
共聚物 copolymer Qs</.PO
合成树脂 synthetic -,}f6*
热固性树脂 thermosetting resin [Page] `"/@LUso
热塑性树脂 thermoplastic resin dp-8,Seu
感光性树脂 photosensitive resin Hz+edMUL
环氧值 epoxy value rN_\tulOF
双氰胺 dicyandiamide iQs(Dh=*
粘结剂 binder r@k&1*&
胶粘剂 adesive |P~TZ
固化剂 curing agent CA:t](xqQ
阻燃剂 flame retardant +*F ;l\R
遮光剂 opaquer eX$u
增塑剂 plasticizers 6fQQKM@a|
不饱和聚酯 unsatuiated polyester )*$'e<?`
聚酯薄膜 polyester \vojF\
聚酰亚胺薄膜 polyimide film (PI) :C>slxY
聚四氟乙烯 polytetrafluoetylene (PTFE) mWCY%o@
增强材料 reinforcing material bi[vs|
折痕 crease Z*x Q"+\
云织 waviness o{nBtxZ"
鱼眼 fish eye lYD-U8
毛圈长 feather length -bcm"(<T'
厚薄段 mark 57rc|]C
裂缝 split If2f7{b
捻度 twist of yarn \JN?3}_J
浸润剂含量 size content `3\5&B