1 backplane 背板 s"KJiQKGM
2 Band gap voltage reference 带隙电压参考 V N{NA+I
3 benchtop supply 工作台电源 \c,pEXG
4 Block Diagram 方块图 5 Bode Plot 波特图 5Qwh(C^H
6 Bootstrap 自举 oPf)be| #
7 Bottom FET Bottom FET OPJ: XbG
8 bucket capcitor 桶形电容 hB;VCg8
9 chassis 机架 9p* gU[
10 Combi-sense Combi-sense 8)*2@-Rp
11 constant current source 恒流源 jEdtJEPa
12 Core Sataration 铁芯饱和 #SVNHpx
13 crossover frequency 交叉频率 R7jmv n
14 current ripple 纹波电流 W*DVi_\$y
15 Cycle by Cycle 逐周期 @&F@I3`{
16 cycle skipping 周期跳步 iRo.RU8>
17 Dead Time 死区时间 h"mi"H^o
18 DIE Temperature 核心温度 uQ$^;Pr
19 Disable 非使能,无效,禁用,关断 D1
Z{W
20 dominant pole 主极点 Oc].@Jy
21 Enable 使能,有效,启用 IA zZ1#/3
22 ESD Rating ESD额定值 2|iV,uJ&
23 Evaluation Board 评估板 {]*x*aa\
24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. g6t"mkMY
L
超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 inb^$v
25 Failling edge 下降沿 POI.]1i
26 figure of merit 品质因数 Ox!U8g8c
27 float charge voltage 浮充电压 ZIR0PQh\
28 flyback power stage 反驰式功率级 O=cxNy-I
29 forward voltage drop 前向压降 /PBaIoJE
30 free-running 自由运行 8M,9kXq{L
31 Freewheel diode 续流二极管 EI>6Nh
32 Full load 满负载 33 gate drive 栅极驱动 cLa]D[H
34 gate drive stage 栅极驱动级 9h90huyKF
35 gerber plot Gerber 图 '+>fFM,*B
36 ground plane 接地层 =WdaxjenZ/
37 Henry 电感单位:亨利 JG[o"&Sd
38 Human Body Model 人体模式 BcjP+$k4_
39 Hysteresis 滞回 ?^mi3VM
40 inrush current 涌入电流 x&Vm!,%:1
41 Inverting 反相 Lf([dE1
42 jittery 抖动
JCcZuwu[
43 Junction 结点 V3;.{0k
44 Kelvin connection 开尔文连接 []R? ViG
45 Lead Frame 引脚框架 /M~!sPW&?
46 Lead Free 无铅 Zv_.na/^K
47 level-shift 电平移动 ,
^F)L|
48 Line regulation 电源调整率 |s#'dS;
49 load regulation 负载调整率 UUKP"
50 Lot Number 批号 1be %G [*
51 Low Dropout 低压差 v0D q@Q1
52 Miller 密勒 53 node 节点 r"2V
54 Non-Inverting 非反相 AsS$C&^
55 novel 新颖的 -4w=s|#.\
56 off state 关断状态 ne61}F"E
57 Operating supply voltage 电源工作电压 "vYE+
58 out drive stage 输出驱动级 ,t{,_uPJY
59 Out of Phase 异相 "vCM}F
60 Part Number 产品型号 l\AMl
\
61 pass transistor pass transistor SVlua@]ChU
62 P-channel MOSFET P沟道MOSFET q+KzIde|%
63 Phase margin 相位裕度 u<q :$
64 Phase Node 开关节点 b*;"q9u5
65 portable electronics 便携式电子设备 zsU=sTsL
66 power down 掉电 "\Egs)\
67 Power Good 电源正常 h)1qp Qj
68 Power Groud 功率地 k:2QuG^
69 Power Save Mode 节电模式 R+q"_90_
70 Power up 上电 oRKEJNps
71 pull down 下拉 .@-9'<K?~
72 pull up 上拉 Nw& !}#m
73 Pulse by Pulse 逐脉冲(Pulse by Pulse) Mypc3
74 push pull converter 推挽转换器 @D-AO_
75 ramp down 斜降
s cuHmY0
76 ramp up 斜升 Iz6y{E
77 redundant diode 冗余二极管 Qu=LnGo~P
78 resistive divider 电阻分压器 G$'jEa<:u
79 ringing 振 铃 SvN9aD1
80 ripple current 纹波电流 q#Zs\PD
81 rising edge 上升沿 ihh4pD27g
82 sense resistor 检测电阻 w{~+EolK
83 Sequenced Power Supplys 序列电源 lf>*Y.!@me
84 shoot-through 直通,同时导通 GU't%[
85 stray inductances. 杂散电感 ]sz3]"2
86 sub-circuit 子电路 <PPNhf8
87 substrate 基板 EM7+VO(
88 Telecom 电信 Uie?9&3
89 Thermal Information 热性能信息 %N;!+
;F_g
90 thermal slug 散热片 *`j-i
91 Threshold 阈值 =NbI%
92 timing resistor 振荡电阻 p~ C.IG
93 Top FET Top FET 4`Q3v4fOF
94 Trace 线路,走线,引线 {QBB^px
95 Transfer function 传递函数 ;!o]wHmA
96 Trip Point 跳变点 2fU$J>Y
97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) xD&^j$Em
98 Under Voltage Lock Out (UVLO) 欠压锁定 ]0;864X0
99 Voltage Reference 电压参考 -~eJn'W
100 voltage-second product 伏秒积 SVjl~U-^
101 zero-pole frequency compensation 零极点频率补偿 HL/bS/KX
102 beat frequency 拍频 ;})5:\h
103 one shots 单击电路 2([2Pb3<"
104 scaling 缩放 Cv$
SJc
105 ESR 等效串联电阻 [Page] TI9UXa:V\
106 Ground 地电位 Auy_K?he]
107 trimmed bandgap 平衡带隙 h8\
T
108 dropout voltage 压差 [Q\GxX.
109 large bulk capacitance 大容量电容 H$af/^
110 circuit breaker 断路器 n~g)I&
111 charge pump 电荷泵 0Io'bF
112 overshoot 过冲 U yw-2]!n
'(f/~"9B
印制电路printed circuit k3+e;[My+
印制线路 printed wiring IHgeQ F
~
印制板 printed board ^xf<nNF:p
印制板电路 printed circuit board ;"O&X<BX-
印制线路板 printed wiring board ,>t69 Ad
印制元件 printed component
)>D+x5o]
印制接点 printed contact O62b+%~F
印制板装配 printed board assembly >5R<;#8
板 board "<}&GcJbz
刚性印制板 rigid printed board e]=!"nJ+
挠性印制电路 flexible printed circuit GDYFU*0
挠性印制线路 flexible printed wiring +(uYwdcN
齐平印制板 flush printed board )BfT7{WN
金属芯印制板 metal core printed board dd?x(,"A`
金属基印制板 metal base printed board y=Mq(c:'UN
多重布线印制板 mulit-wiring printed board ZVeaTK4_
t
塑电路板 molded circuit board 64-#}3zL
散线印制板 discrete wiring board $3Z-)m
微线印制板 micro wire board @!&}}"<
积层印制板 buile-up printed board 9 Pw0m=4
表面层合电路板 surface laminar circuit H
_Va"yTO6
埋入凸块连印制板 B2it printed board o]IjK
载芯片板 chip on board 4tSv{B/}
埋电阻板 buried resistance board /ywD{*
母板 mother board [~:-&
子板 daughter board E~<`/s
背板 backplane y~IuP c
裸板 bare board g%u&Zkevx
键盘板夹心板 copper-invar-copper board RzhWD^b B
动态挠性板 dynamic flex board H3{GmV8
静态挠性板 static flex board K78rg/`
可断拼板 break-away planel +n}$pM|NKU
电缆 cable U/lM\3v/e
挠性扁平电缆 flexible flat cable (FFC) fC}R4f7C
薄膜开关 membrane switch Y!6/[<r$~k
混合电路 hybrid circuit fw oQ'&
厚膜 thick film :';L/x>
厚膜电路 thick film circuit .qk]$LJF7
薄膜 thin film EQqx+J&!
薄膜混合电路 thin film hybrid circuit <8UYhGK
互连 interconnection jL)WPq!m+
导线 conductor trace line VF&Z%O3n
齐平导线 flush conductor qo)?8kx>l
传输线 transmission line R:p62c;Tv0
跨交 crossover @|a>&~xX
板边插头 edge-board contact (;VVCAoy
增强板 stiffener &D%(~|'
基底 substrate E,n}HiAz7V
基板面 real estate K/ &?VIi`z
导线面 conductor side H A}f,),G
元件面 component side ~.%K/=wK @
焊接面 solder side =66Nw(E.
导电图形 conductive pattern Vtppuu$
非导电图形 non-conductive pattern gn5)SP 8
基材 base material 4/X/>Y1
层压板 laminate I8OD$`~*U6
覆金属箔基材 metal-clad bade material XWJwJ
覆铜箔层压板 copper-clad laminate (CCL) ( 6(x'ByT
复合层压板 composite laminate @DW[Z`X
薄层压板 thin laminate e&eW|E
基体材料 basis material 7?OH,^
预浸材料 prepreg +.RKi!
粘结片 bonding sheet @`FCiH M
预浸粘结片 preimpregnated bonding sheer 3Rm#-T s
环氧玻璃基板 epoxy glass substrate
9;Fbnp'
预制内层覆箔板 mass lamination panel b]E|*
内层芯板 core material +7Kyyu)y@
粘结层 bonding layer Hn,:`mj4-6
粘结膜 film adhesive )pw&c_x
无支撑胶粘剂膜 unsupported adhesive film 0'&X
T^"
覆盖层 cover layer (cover lay) LtT\z<bAI
增强板材 stiffener material co_oMc
铜箔面 copper-clad surface W~_t~Vg5
去铜箔面 foil removal surface 2/,0iwj-
层压板面 unclad laminate surface "QoQ4r<|
基膜面 base film surface FZB~|3eq{
胶粘剂面 adhesive faec SPj><5Ro
原始光洁面 plate finish \U%#nU{
粗面 matt finish <lr*ZSNY
剪切板 cut to size panel P)dL?vkK
超薄型层压板 ultra thin laminate @{h?+
d
A阶树脂 A-stage resin ch5s<x#CE
B阶树脂 B-stage resin j?b\+rr
C阶树脂 C-stage resin 3M5#4n\v$
环氧树脂 epoxy resin ,?
E&V_5
酚醛树脂 phenolic resin Li 2Zndp
聚酯树脂 polyester resin M(|
聚酰亚胺树脂 polyimide resin w",?
Bef
双马来酰亚胺三嗪树脂 bismaleimide-triazine resin TG
n-7 88
丙烯酸树脂 acrylic resin '2hbJk
三聚氰胺甲醛树脂 melamine formaldehyde resin }awzO#
多官能环氧树脂 polyfunctional epoxy resin !gwjN_ZJ^
溴化环氧树脂 brominated epoxy resin ;0ME+]`"3
环氧酚醛 epoxy novolac SFH-^ly&D
氟树脂 fluroresin Hy{
Q#fq
硅树脂 silicone resin s!/TU{8J
硅烷 silane 7iuQ9q^&
聚合物 polymer T~sTBGcv
无定形聚合物 amorphous polymer P`U<7xF~
结晶现象 crystalline polamer ryO$6L
双晶现象 dimorphism "S~_[/q
共聚物 copolymer 4VN aq<8
合成树脂 synthetic 3`9{T>
热固性树脂 thermosetting resin [Page] Do?P<x o
热塑性树脂 thermoplastic resin KsAH]2Q%
感光性树脂 photosensitive resin 33:DH}
环氧值 epoxy value t?;T3k[RM
双氰胺 dicyandiamide O?bK%P]ay
粘结剂 binder Z.Rb~n&
胶粘剂 adesive fYebB7Pv
固化剂 curing agent ~
aZedQc
阻燃剂 flame retardant <<MjC5
遮光剂 opaquer UVf\2\ Y
增塑剂 plasticizers v}Wmd4Y'
不饱和聚酯 unsatuiated polyester {u7##Vrgt8
聚酯薄膜 polyester JU0]Wq <^[
聚酰亚胺薄膜 polyimide film (PI) ]TO/kl/
聚四氟乙烯 polytetrafluoetylene (PTFE) ETv9k g
增强材料 reinforcing material 5IVksg
折痕 crease v4?iOD
云织 waviness (.K\Jg'Y6j
鱼眼 fish eye F-n"^.7
毛圈长 feather length %Xh fXd'
厚薄段 mark 'p)Q68;&
裂缝 split ]/]ju$l9Z
捻度 twist of yarn tP
~zKU
浸润剂含量 size content @^nu#R
浸润剂残留量 size residue #*q2d
处理剂含量 finish level .R44$F
偶联剂 couplint agent A3P9.mur
断裂长 breaking length ~pP0|B*%
吸水高度 height of capillary rise QHf$f@bjI
湿强度保留率 wet strength retention !7lj>B A>
白度 whitenness DrS~lTf=>
导电箔 conductive foil ty1fcdFZM
铜箔 copper foil ^.X [)U
压延铜箔 rolled copper foil U/MFhD(06
光面 shiny side bk#xiuwT
粗糙面 matte side ru.5fQU
处理面 treated side Qb^q+C)o]
防锈处理 stain proofing H;_yRUY9
双面处理铜箔 double treated foil GA^mgm"O
模拟 simulation L0Vgo<A
逻辑模拟 logic simulation >POO-8Q
电路模拟 circit simulation ESQ!@G/n
时序模拟 timing simulation .e[Tu|qo
模块化 modularization $B\E.ml.
设计原点 design origin _pDjg%A>n
优化(设计) optimization (design) I{.HO<$7D}
供设计优化坐标轴 predominant axis ='Oj4T
表格原点 table origin Q49BU@xX
元件安置 component positioning 9$WJ"]
比例因子 scaling factor F+=urc>w
扫描填充 scan filling [$:,-Q @
矩形填充 rectangle filling &a~=b,
填充域 region filling UKB_Yy^Y
实体设计 physical design <,39_#H?F3
逻辑设计 logic design P@ypk^v
逻辑电路 logic circuit ;i)KHj'
层次设计 hierarchical design NXoK@Y
自顶向下设计 top-down design XDmbm*~i
自底向上设计 bottom-up design u]vPy
ria
费用矩阵 cost metrix to3?$-L
元件密度 component density _'iDF
自由度 degrees freedom X B I;Lg
出度 out going degree )q+4k m6
入度 incoming degree (9.yOc4
曼哈顿距离 manhatton distance ^ "6f\
欧几里德距离 euclidean distance +mWjBY
网络 network 4
eh=f!(+
阵列 array T&}Ye\%
段 segment ?vbDB 4
逻辑 logic b :\D\X
逻辑设计自动化 logic design automation }""p)Y&
分线 separated time 8]*Q79
分层 separated layer iz
x[
定顺序 definite sequence c>MY$-PD
导线(通道) conduction (track) )mD\d|7f
导线(体)宽度 conductor width G.jQX'%4QG
导线距离 conductor spacing (KF7zP
导线层 conductor layer LD.Ck6@
导线宽度/间距 conductor line/space z-Hkz
第一导线层 conductor layer No.1 _Xh=&(/8@
圆形盘 round pad kyAs'R@z
方形盘 square pad !LSs9_w
菱形盘 diamond pad }MZan" cfo
长方形焊盘 oblong pad 2ij/N%l
子弹形盘 bullet pad 9eSRCLhgD
泪滴盘 teardrop pad *,jqE9:O
雪人盘 snowman pad }u^:MI
形盘 V-shaped pad V g~R/3cm4
环形盘 annular pad )
hdgz$cl
非圆形盘 non-circular pad @a;sV!S{
隔离盘 isolation pad hmzair3X
非功能连接盘 monfunctional pad gHH&IzHF
偏置连接盘 offset land iPFL"v<#J
腹(背)裸盘 back-bard land +FBi5h
盘址 anchoring spaur
sL~,
连接盘图形 land pattern m+$/DD^-zl
连接盘网格阵列 land grid array ;G Qm[W([
孔环 annular ring 3;D?|E]1
元件孔 component hole ![Hhxu
安装孔 mounting hole c%yh(g
支撑孔 supported hole .HOY q
非支撑孔 unsupported hole ScHlfk
p
导通孔 via c,AZ/t
镀通孔 plated through hole (PTH) e[p^p!a
余隙孔 access hole Tg\hx>
盲孔 blind via (hole) VD4S_qx
埋孔 buried via hole Nh :JU?h
埋,盲孔 buried blind via +9~ZA3DiP
任意层内部导通孔 any layer inner via hole 0~.)GG%R>D
全部钻孔 all drilled hole cUVTRWV
定位孔 toaling hole Sgx+V"bkT
无连接盘孔 landless hole e@+v9Bs]q
中间孔 interstitial hole |$ w0+bV*
无连接盘导通孔 landless via hole 5F03y`@ u
引导孔 pilot hole :+1bg&wQ
端接全隙孔 terminal clearomee hole (WkTQRcN,
准尺寸孔 dimensioned hole [Page] *vXDuhQ
在连接盘中导通孔 via-in-pad ?:JdRnH \
孔位 hole location z=%IcSx;
孔密度 hole density 0O^r.&{j>
孔图 hole pattern yI *M[0
钻孔图 drill drawing clC~2:
装配图assembly drawing F]Pul|.l
参考基准 datum referan A'b<?)Y7_
1) 元件设备 ~q5-9{ma
n4XMN\:g{
三绕组变压器:three-column transformer ThrClnTrans iUpSN0XkMM
双绕组变压器:double-column transformer DblClmnTrans 7j95"mI
电容器:Capacitor >]C<j4
并联电容器:shunt capacitor /o'oF
电抗器:Reactor L:Ed-=|Uw
母线:Busbar f0g6g!&gf
输电线:TransmissionLine iF+S%aPd#
发电厂:power plant .0KOnLdK
断路器:Breaker myffYK,
刀闸(隔离开关):Isolator &F9OZMK=
分接头:tap )*+u\x_Hx
电动机:motor =cknE=
(2) 状态参数 AwA1&mh
l`oT:
有功:active power 0yKwH\S
无功:reactive power ,%.:g65%
电流:current Kl!DKeF
容量:capacity /S/tE
电压:voltage C!`>cUhE{
档位:tap position +i2YX7Of
有功损耗:reactive loss 4h(jw
无功损耗:active loss T R+Q4Y:
功率因数:power-factor YcEtgpz@
功率:power $;Q=iv3
功角:power-angle S/KVN(Z
电压等级:voltage grade ]9dx3<2_I
空载损耗:no-load loss ipgN<|`?@
铁损:iron loss ,K`E&hS
铜损:copper loss 6MrZ6dz^
空载电流:no-load current oPp!*$V
阻抗:impedance _95- -\
正序阻抗:positive sequence impedance N,h1$)\B#
负序阻抗:negative sequence impedance Dg1kbO=2
零序阻抗:zero sequence impedance i#Ne'q;T
电阻:resistor ]L[JS^#7
电抗:reactance $(Z]TS$M&
电导:conductance [BJ$|[11
电纳:susceptance X!7cz t
无功负载:reactive load 或者QLoad ab8oMi`z
有功负载: active load PLoad z+y;y&P
遥测:YC(telemetering) cH+h=E=
遥信:YX u4`mQ6
励磁电流(转子电流):magnetizing current N`y}Gs
定子:stator [u,hc/PL
功角:power-angle TXZ(mj?
上限:upper limit ^=aml
下限:lower limit ~R"]LbeY
并列的:apposable |)
x'
高压: high voltage ~| 4U@
低压:low voltage Aqx3!
中压:middle voltage >DPds~k
电力系统 power system UIC\CP d
发电机 generator Z[DetRc-
励磁 excitation 6M
O|s1zk
励磁器 excitor D!l [3
电压 voltage JUe K"|fA
电流 current jh<TdvF2$
母线 bus 8@9hU`H8l
变压器 transformer >X-ed
升压变压器 step-up transformer 34/]m/2NZK
高压侧 high side +#de8/x
输电系统 power transmission system oi33{#%t
输电线 transmission line + 1E?He:iQ
固定串联电容补偿fixed series capacitor compensation GoGohsj
稳定 stability +0oyt?
电压稳定 voltage stability yv6Zo0s<J
功角稳定 angle stability F[o+p|nF
暂态稳定 transient stability s0~05{
电厂 power plant I?^Q084
能量输送 power transfer q\\8b{~
交流 AC 1]D/3!
装机容量 installed capacity kxr6sO~
电网 power system XwHu:v'=
落点 drop point Z`SWZ<
开关站 switch station Fy4<
双回同杆并架 double-circuit lines on the same tower t z
+
变电站 transformer substation &;r'{$
补偿度 degree of compensation 2|T|K?R^
高抗 high voltage shunt reactor _rWM]
无功补偿 reactive power compensation mMD$X[:
故障 fault i?&4SG+2~K
调节 regulation <Y}"D Yt
裕度 magin r?Zy-yQ
三相故障 three phase fault Qwp\)jVi
故障切除时间 fault clearing time YYZs#_
极限切除时间 critical clearing time gLXvw]
切机 generator triping hB2s$QS
高顶值 high limited value pAUfG^v
强行励磁 reinforced excitation ~I/>i&