“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 0A1l"$_|
--------------------------------------------------- r,b
真空术语 zb;'}l;+
wh*OD
1.标准环境条件 standard ambient condition: ^1Yx'ua'
2.气体的标准状态 standard reference conditions forgases: siD Sm
3.压力(压强)p pressure: m7RWu I,
4.帕斯卡Pa pascal: :m37Fpz&b
5.托Torr torr: QGshc
6.标准大气压atm standard atmosphere: wV-cpJ,}
7.毫巴mbar millibar: *:&fw'vd,
8.分压力 partial pressure: BV!Kiw
9.全压力 total pressure: nmSpNkJ5
10.真空 vacuum: G %#us3x
11.真空度 degree of vacuum: _puQX@i
12.真空区域 ranges of vacuum: :_e.ch:4
13.气体 gas: x(t}H8q
14.非可凝气体 non-condensable gas: Mb<KZ_wYOX
15.蒸汽vapor: o_5|L9
16.饱和蒸汽压saturation vapor pressure: ;<MaCtDt
17.饱和度degree of saturation: wPc,FH+y
18.饱和蒸汽saturated vapor: P{}Oe
*9"
19.未饱和蒸汽unsaturated vapor: |Pj _L`G
20.分子数密度n,m-3 number density of molecules: EI_J7J+
21.平均自由程ι、λ,m mean free path: G)e 20Mst
22.碰撞率ψ collision rate: vW4f 3(/
23.体积碰撞率χ volume collision rate: Wc]Fg9E
24.气体量G quantity of gas: 3aDma/
25.气体的扩散 diffusion of gas: gf3/ kll9
26.扩散系数D diffusion coefficient; diffusivity: mYy3KqYu
27.粘滞流 viscous flow: { j/w3
28.粘滞系数η viscous factor: =Wjm_Rvk9
29.泊肖叶流 poiseuille flow: p[/n[@<8=
30.中间流 intermediate flow: ' l!QGKz
31.分子流 molecular flow: /NkZ;<uxJ
32克努曾数 number of knudsen: ]3I_H+hU
33.分子泻流 molecular effusion; effusive flow: T4f:0r;^f*
34.流逸 transpiration: #|e<l1 F
35.热流逸 thermal transpiration: o3W5FHFAv
36.分子流率qN molecular flow rate; molecular flux: 'PO1{&M
37.分子流率密度 molecular flow rate density; density of molecular flux: lO) B/N&
38.质量流率qm mass flow rare: K^>qn,]H'
39.流量qG throughput of gas: }YSH8d
40.体积流率qV volume flow rate: L`Ic0}|lzy
41.摩尔流率qυ molar flow rate: A5/h*`Q\\
42.麦克斯韦速度分布 maxwellian velocity distribution: Kp&d9e{
Yc
43.传输几率Pc transmission probability: .6'T;SoK>
44.分子流导CN,UN molecular conductance: @+2Zt%
45.流导C,U conductance: ZHF@k'vm/9
46.固有流导Ci,Ui intrinsic conductance: Mr1pRIYMd
47.流阻W resistance: 6@$[x* V
48.吸附 sorption: l%U9g
49.表面吸附 adsorption: y7w>/7q
50.物理吸附physisorption: |/(5GX,X
51.化学吸附 chemisorption: B#gmT2L
52.吸收absorption: <B
fwR$
53.适应系数α accommodation factor: },"g*
54.入射率υ impingement rate: `C()H@;
55.凝结率condensation rate: L{Th>]X
56.粘着率 sticking rate: m2}&5vD8-
57.粘着几率Ps sticking probability: *PI3L/*
58.滞留时间τ residence time: D H.ljGb
59.迁移 migration: [Ytia#Vv
60.解吸 desorption: %*/[aq, #
61.去气 degassing: ._R82gy
62.放气 outgassing: 3a5H<3w_
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: >:xnjEsi$/
64.蒸发率 evaporation rate: F0!r9U((
65.渗透 permeation: F?dTCa
66.渗透率φ permeability: kQb0pfYs
67.渗透系数P permeability coefficient s R~&S))
2. 1.真空泵 vacuum pumps
~ 52
1-1.容积真空泵 positive displacement pump: _m&VdIPO
⑴.气镇真空泵 gas ballast vacuum pump: DTJ
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: cn#a/Hx
⑶.干封真空泵 dry-sealed vacuum pump: *H$nydQ:
⑷.往复真空泵 piston vacuum pump: /qCYNwWH9
⑸.液环真空泵 liquid ring vacuum pump: H{V-C_
⑹.旋片真空泵 sliding vane rotary vacuum pump: m0edkt-x
⑺.定片真空泵 rotary piston vacuum pump: PU>;4l
⑻.滑阀真空泵 rotary plunger vacuum pump: m=K XMX
⑼.余摆线真空泵 trochoidal vacuum pump: >}I}9y+
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: 3}+/\:q*
⑾.罗茨真空泵 roots vacuum pump: H z6H,h
1-2.动量传输泵 kinetic vacuum pump: jn7}jWA
⑴.牵引分子泵molecular drag pump: }Q%>Fv
⑵.涡轮分子泵turbo molecular pump: i" )_M|
⑶.喷射真空泵ejector vacuum pump: J8%|Gd0#4
⑷.液体喷射真空泵liquid jet vacuum pump: nqH^%/7)A@
⑸.气体喷射真空泵gas jet vacuum pump: EW!$D
⑹.蒸汽喷射真空泵vapor jet vacuum pump : 01dx}L@hz
⑺.扩散泵diffusion pump : s%:fB(
⑻.自净化扩散泵self purifying diffusion pump: a~%ej.)l
⑼.分馏扩散泵 fractionating diffusion pump : )FP|}DCxQ
⑽.扩散喷射泵diffusion ejector pump : ! $iR:ji
⑾.离子传输泵ion transfer pump: ;L[9[uQ[C
1-3.捕集真空泵 entrapment vacuum pump: J!H5{7.efN
⑴吸附泵adsorption pump: 3UaP7p+d
⑵.吸气剂泵 getter pump: Ao\Vh\rQkq
⑶.升华(蒸发)泵 sublimation (evaporation)pump : bXW)n<y
⑷.吸气剂离子泵getter ion pump: q!,do2T
⑸.蒸发离子泵 evaporation ion pump: k@~-|\ooG
⑹.溅射离子泵sputter ion pump: Y1~SGg7(@
⑺.低温泵cryopump: ky#6M?
\
~L1O\V
i
2.真空泵零部件 8 N` $7^^
2-1.泵壳 pump case: y((_V%F}
2-2.入口 inlet: d5%*^nMpY
2-3.出口outlet: /;0>*ft4
2-4.旋片(滑片、滑阀)vane; blade : {aL$vgYT1
2-5.排气阀discharge valve: 98]t"ny [
2-6.气镇阀gas ballast valve: <Z;7=k
2-7.膨胀室expansion chamber: G225Nz;Y*
2-8.压缩室compression chamber: KH7]`CU
2-9.真空泵油 vacuum pump oil: |:?.-tq
2-10.泵液 pump fluid: <7 rK
2-11.喷嘴 nozzle: JA}'d7yEa
2-13.喷嘴扩张率nozzle expansion rate: =4D_-Q
2-14.喷嘴间隙面积 nozzle clearance area : +E:(-$"R
2-15.喷嘴间隙nozzle clearance: Dmi;# WY
2-16.射流jet: %(Ys-GeGr
2-17.扩散器diffuser: JXAyF6
$
2-18.扩散器喉部diffuser thoat: z]YhQIU4n8
2-19.蒸汽导管vapor tube(pipe;chimney): \,EPsQV0?
2-20.喷嘴组件nozzle assembly: U{_s1
2-21.下裙skirt: >2:S v1T
^zJ.W
3.附件 `|w#K28t"
3-1阱trap: "{k
)nr+7U
⑴.冷阱 cold trap: 8_m9CQ6 i
⑵.吸附阱sorption trap: t/ 1NTa
⑶.离子阱ion trap: }^ <zVdwp
⑷.冷冻升华阱 cryosublimation trap: Vr1|%*0Tv
3-2.挡板baffle: hN53= X:
3-3.油分离器oil separator: t4*A+"~j
3-4.油净化器oil purifier: \?^wu
3-5.冷凝器condenser: E,fp=.
~K96y$ DTE
4.泵按工作分类 }Yl=lcvw
4-1.主泵main pump:
D.o|($S0
4-2.粗抽泵roughing vacuum pump: XgKG\C=3
4-3.前级真空泵backing vacuum pump: Y/66`&,{
4-4.粗(低)真空泵 roughing(low)vacuum pump: /vDF<HVzm
4-5.维持真空泵holding vacuum pump: 'lk74qU$
4-6.高真空泵high vacuum pump: +-\9'Q
4-7.超高真空泵ultra-high vacuum pump: I
6YT|R
4-8.增压真空泵booster vacuum pump: C<t>m_t9
7 !.8#A':
5.真空泵特性 {Yk20Zn
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: } XU:DE
5-2.真空泵的抽气量Q throughput of vacuum pump:。 --YUiNhh
5-3.起动压力starting pressure: S1`0d9ds#
5-4.前级压力 backing pressure : &U*J{OP|
5-5.临界前级压力 critical backing pressure: BDRVT Y(s
5-6.最大前级压力maximum backing pressure: ()#tR^T
5-7.最大工作压力maximum working pressure: }.cmiC
5-8.真空泵的极限压力ultimate pressure of a pump: 4_I{Q^f
5-9.压缩比compression ratio: @!/fvP
5-10.何氏系数Ho coefficient: DB%AO:8
5-11.抽速系数speed factor: Wky S Tc
5-12.气体的反扩散back-diffusion of gas: TQd FC\@f"
5-13.泵液返流back-streaming of pump fluid: eJGos!>*
5-14.返流率back-streaming rate idS
RWa
5-15.返迁移back-migration: T\!SA
5-16.爆腾bumping: SzlfA%4+GR
5-17.水蒸气允许量qm water vapor tolerable load: Yb3f]4EH
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: .0E4c8R\X
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 0,$-)SkT
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump bM0[V5:jB
3. 1.一般术语 OG+r|.N;
1-1.压力计pressure gauge: yLO
&(Mb
1-2.真空计vacuum gauge: m'(;uR`
⑴.规头(规管)gauge head: nYy}''l<
⑵.裸规nude gauge : ';\gR/L
⑶.真空计控制单元gauge control unit : H
L|spl(c
⑷.真空计指示单元gauge indicating unit : >^f)|0dn)E
0#fG4D_
2.真空计一般分类 )R)$T'
2-1.压差式真空计differential vacuum gauge: P"uHtHK
2-2.绝对真空计 absolute vacuum gauge: {dA
~#fW<
2-3.全压真空计total pressure vacuum gauge: QcG5PV
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: !8@rK$DB
2-5.相对真空计relative vacuum gauge : Y`7#[g
Gz|%;
3.真空计特性 /D$+b9FR<
3-1.真空计测量范围pressure range of vacuum gauge: TflS@Z7C
3-2.灵敏度系数sensitivity coefficient: #O9*$eMw
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): +>:}req
3-5.规管光电流photon current of vacuum gauge head: IO!1|JMr6
3-6.等效氮压力equivalent nitrogen pressure : +:]Aqyc\
3-7.X射线极限值 X-ray limit: '<&EPUO
3-8.逆X射线效应anti X-ray effect: 7vpN6YP
3-9.布利尔斯效应blears effect: r d6F"W
g{W6a2
4.全压真空计 f >)Tq'
4-1.液位压力计liquid level manometer: 8f,'p}@!d
4-2.弹性元件真空计elastic element vacuum gauge: B>|U-[A
4-3.压缩式真空计compression gauge: !P~ PF:W~|
4-4.压力天平pressure balance: 45)ogg2
4-5.粘滞性真空计viscosity gauge : [%84L@:h
4-6.热传导真空计thermal conductivity vacuum gauge : ~0F9x9V
4-7.热分子真空计thermo-molecular gauge: ~njbLUB
4-8.电离真空计ionization vacuum gauge: |J<pLz
4-9.放射性电离真空计radioactive ionization gauge: Oh/b?|imG
4-10.冷阴极电离真空计cold cathode ionization gauge: 14rVb2^
4-11.潘宁真空计penning gauge: -Y8ks7
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: >C:"$x2"#(
4-13.放电管指示器discharge tube indicator: nGv23R(?G
4-14.热阴极电离真空计hot cathode ionization gauge: \)otu\3/
4-15.三极管式真空计triode gauge: c{,y{2c]LT
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: 5]H))}9>d
4-17.B-A型电离真空计Bayard-Alpert gauge: OY^n0Zof,
4-18.调制型电离真空计modulator gauge: Oj"pj:fB
4-19.抑制型电离真空计suppressor gauge: "$W|/vD+
4-20.分离型电离真空计extractor gauge: +f
X}O9
4-21.弯注型电离真空计bent beam gauge: 5BU%%fBJ.
4-22.弹道型电离真空计 orbitron gauge : $m:2&lU3
4-23.热阴极磁控管真空计hot cathode magnetron gauge: [%7;f|p?
oEenm\ZI
5.分压真空计(分压分析器) 2q-:p8
5-1.射频质谱仪radio frequency mass spectrometer: k=T-L
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: w>6"Sc7oc2
5-3.单极质谱仪momopole mass spectrometer: Zk/' \(5
5-4.双聚焦质谱仪double focusing mass spectrometer: ]_ejDN\>{V
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: d2C[wQF
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: i'W_;Y}
5-7.回旋质谱仪omegatron mass spectrometer: FQk_#BkK
5-8.飞行时间质谱仪time of flight mass spectrometer: ]27>a"p59Y
k5aa>6K
6.真空计校准 ?qg^WDs$
6-1.标准真空计reference gauges: s-,=e
6-2.校准系统system of calibration: fiE>H~
6-3.校准系数K calibration coefficient: NK7H,V}T
6-4.压缩计法meleod gauge method: FJsK5-
6-5.膨胀法expansion method: 4|>
rwQ~t
6-6.流导法flow method: x|@1wQ"6
4. 1.真空系统vacuum system 0" U5oP[
1-1.真空机组pump system: "x#]i aDjf
1-2.有油真空机组pump system used oil : a^*cZ?Ta
1-3.无油真空机组oil free pump system xFBh?
1-4.连续处理真空设备continuous treatment vacuum plant: c*x J=Gz6d
1-5.闸门式真空系统vacuum system with an air-lock: T-a&e9B
1-6.压差真空系统differentially pumped vacuum system: ZnvEv;P
1-7.进气系统gas admittance system: qri}=du&F
aBXYri
2.真空系统特性参量 _M8G3QOx
2-1.抽气装置的抽速volume flow rate of a pumping unit : gYTyH.
2-2.抽气装置的抽气量throughput of a pumping unit : @-'/__cgt
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: /S:w&5e
2-4.真空系统的漏气速率leak throughput of a vacuum system: {S5RK-ax
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: LP^p~5Az
2-6.极限压力ultimate pressure: 5h`m]#YEG
2-7.残余压力residual pressure: +1otn~(E
2-8.残余气体谱residual gas spectrum: V";mWws+?#
2-9.基础压力base pressure: 5f;n<EPy
2-10.工作压力working pressure: &Ki>h
2-11.粗抽时间roughing time: A",eS6
2-12.抽气时间pump-down time: Sm$p\ORa
2-13.真空系统时间常数time constant of a vacuum system: T ;i?w
2-14.真空系统进气时间venting time: 0JmFQ^g(
,>D ja59
3.真空容器 ]Nnxnp
3-1.真空容器;真空室vacuum chamber: Err4
%-
3-2.封离真空装置sealed vacuum device: 9@:BK;Fi
3-3.真空钟罩vacuum bell jar: }1QI"M*
3-4.真空容器底板vacuum base plate: z-n>9
3-5.真空岐管vacuum manifold: <RhOjZgyZ
3-6.前级真空容器(贮气罐)backing reservoir: rHvF%o
3-7.真空保护层outer chamber: M{C6rm|
3-8.真空闸室vacuum air lock: qBT_!
)h
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: an3~'g?
fv|]= e
4.真空封接和真空引入线 T"n{WmVQ
4-1.永久性真空封接permanent seal : nN>J*02(
4.2.玻璃分级过渡封接graded seal : 1TKEm9j]u
4-3.压缩玻璃金属封接compression glass-to-metal seal: ^'m\D;
4-4.匹配式玻璃金属封接matched glass-to-metal seal: U
z"sdi
4-5.陶瓷金属封接ceramic-to-metal seal: "gFxfWIA
4-6.半永久性真空封接semi-permanent seal : qs=Gj?GwGQ
4-7.可拆卸的真空封接demountable joint: + c`AE
4-8.液体真空封接liquid seal z)}3**3'y
4-9.熔融金属真空封接molten metal seal: ,mB Z`X@N
4-10.研磨面搭接封接ground and lapped seal: ?Phk~ jE
4-11.真空法兰连接vacuum flange connection: BbFa=H.
4-12.真空密封垫vacuum-tight gasket: F "!agc2!
4-13.真空密封圈ring gasket: YPu9Q
4-14.真空平密封垫flat gasket: b)N[[sOt
4-15.真空引入线feedthrough leadthrough: G 0hYFc u
4-16.真空轴密封shaft seal: t5xb"F
4-17.真空窗vacuum window: NwguP
4-18.观察窗viewing window: }i(qt&U;
*R BV'b
5.真空阀门 )IQ*
5-1.真空阀门的特性characteristic of vacuum valves: 3filAGR?
⑴.真空阀门的流导conductance of vacuum valves: JjQ8|En
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: 1n_;kaY
5-2.真空调节阀regulating valve: u^Vh.g]
5-3.微调阀 micro-adjustable valve: uS~#4;R
5-4.充气阀charge valve: X2qv^G,
5-5.进气阀gas admittance valve: g+/0DO_F3
5-6.真空截止阀break valve: $*k)|4
5-7.前级真空阀backing valve: WJfES2N
5-8.旁通阀 by-pass valve: zxkM'8JC
5-9.主真空阀main vacuum valve: X/l;s
5-10.低真空阀low vacuum valve: 62Mdm3
5-11.高真空阀high vacuum valve: Jm4#V~w
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: >)Ioo$B
5-13.手动阀manually operated valve: r088aUO
P
5-14.气动阀pneumatically operated valve: 'TL2%T/)t
5-15.电磁阀electromagnetically operated valve: yMb|I~k
5-16.电动阀valve with electrically motorized operation: KF+mZB
5-17.挡板阀baffle valve: v9=}S\=Cd
5-18.翻板阀flap valve: [& ^RP,N~
5-19.插板阀gate valve: Ea-bC:>
5-20.蝶阀butterfly valve: l;OYUq~F
) V36t{
6.真空管路 `z9J`r=I
6-1.粗抽管路roughing line: Z0-ytODII
6-2.前级真空管路backing line: obO}NF*g^
6-3.旁通管路;By-Pass管路 by-pass line: b._m 8z ~
6-4.抽气封口接头pumping stem: \6o\+OQk
6-5.真空限流件limiting conductance: ~h!
13!
6-6.过滤器filter: *:g_'K"+
5. 1.一般术语 `N}d}O8
1-1真空镀膜vacuum coating: :=*}htP4C
1-2基片substrate: pLnB)z?
1-3试验基片testing substrate: |f\D>Y%)
1-4镀膜材料coating material: Z.'syGuV
1-5蒸发材料evaporation material: :'}@Al9=>
1-6溅射材料sputtering material: "k:=Y7Dx
1-7膜层材料(膜层材质)film material: 9cG<hX9`F
1-8蒸发速率evaporation rate: ^
q?1U?4
1-9溅射速率sputtering rate: s5&=Bsv
1-10沉积速率deposition rate: )MSZ2)(
1-11镀膜角度coating angle: y(5:}x&E
l1A5Y5x9=
2.工艺 "UG
K8x
2-1真空蒸膜vacuum evaporation coating: bAEg$A
(1).同时蒸发simultaneous evaporation: e\F}q)_
(2).蒸发场蒸发evaporation field evaporation: W\8Ln>
(3).反应性真空蒸发reactive vacuum evaporation: oh~:,
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: hi|!
(5).直接加热的蒸发direct heating evaporation: ]a?bzOr,
(6).感应加热蒸发induced heating evaporation: C5*xQlCq}
(7).电子束蒸发electron beam evaporation: ys8Q.oBv_`
(8).激光束蒸发laser beam evaporation: Q9c)k{QZ
(9).间接加热的蒸发indirect heating evaporation: /7/0x ./{
(10).闪蒸flash evaportion: 2 0tO#{Li
2-2真空溅射vacuum sputtering: F PR`tE
(1).反应性真空溅射 reactive vacuum sputtering: gl8Ib<{
(2).偏压溅射bias sputtering: fvqd'2 t
(3).直流二级溅射direct current diode sputtering: I4=Xb^Ux
(4).非对称性交流溅射asymmtric alternate current sputtering: ^A9M;q
(5).高频二极溅射high frequency diode sputtering: !l 6dg&
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1/;o
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: y9 L14
(8).离子束溅射ion beam sputtering: IRW^ok.'b!
(9).辉光放电清洗glow discharge cleaning: `VT>M@i/
2-3物理气相沉积PVD physical vapor deposition: n lGHT
2-4化学气相沉积CVD chemical vapor deposition: eGL<vX
2-5磁控溅射magnetron sputtering:
c5% 6Y2W0
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: wRvb8F0
2-7空心阴极离子镀HCD hollow cathode discharge deposition: ,<`)>2 'o
2-8电弧离子镀arc discharge deposition: QkQ!Ep(
86
.`T l;
3.专用部件 s{}]D{bc
3-1镀膜室coating chamber: O
)d[8jw"
3-2蒸发器装置evaporator device: FwG!>
3-3蒸发器evaporator: 6RoAl$}'
3-4直接加热式蒸发器evaporator by direct heat: h6v07 7qG
3-5间接加热式蒸发器evaporator by indirect heat: rD
&D)w
3-7溅射装置sputtering device: ezm&]F`
3-8靶target: @'6"7g
3-10时控挡板timing shutter: O;uG?.\
3-11掩膜mask: lDU_YEQ>
3-12基片支架substrate holder: WsGths+[
3-13夹紧装置clamp: &,:h)
3-14换向装置reversing device: F@YKFk+a
3-15基片加热装置substrate heating device: "i^
GmVn
3-16基片冷却装置substrate colding device: G`0V)S
eWs&J24
4.真空镀膜设备 aYn^)6^
4-1真空镀膜设备vacuum coating plant: u<xo/=Z
(1).真空蒸发镀膜设备vacuum evaporation coating plant: E_T2z4lw
(2).真空溅射镀膜设备vacuum sputtering coating plant: V3Z]DA
4-2连续镀膜设备continuous coating plant: $IQw=w7p
4-3半连续镀膜设备semi- continuous coating plant UL$}{2N,_
6. 1.漏孔 #xh_
1-1漏孔leaks: }UwO<#
1-2通道漏孔channel leak: TrS8h^C
1-3薄膜漏孔membrane leak: O+q/4
1-4分子漏孔molecular leak: k[j90C5
1-5粘滞漏孔vixcous leak: dT"hNHaf
1-6校准漏孔calibrated leak: };L ^w:
1-7标准漏孔reference leak : b97w^ah4gJ
1-8虚漏virtual leak: +Vb8f["+-
1-9漏率leak rate: L{-LX=G^
1-10标准空气漏率standard air leak rate: saf&dd
1-11等值标准空气漏率equivalent standard air leak rate: KLW n?`
1-12探索(示漏)气体: zAzP,1$?
Z @ dC+0[=
2.本底 SRIA*M.B}
2-1本底background: 2Os1C}m
2-2探索气体本底search gas background : j$7|XM6
2-3漂移drift: B;>{0
s
2-4噪声noise: nI.x
9;.(u'y|
3.检漏仪 DyJ.BQdk)
3-1检漏仪leak detector: /D&%v*~E
3-2高频火花检漏仪H.F. spark leak detector: D,v U
3-3卤素检漏仪halide leak detector: dO> VwP
3-4氦质谱检漏仪helium mass spectrometer leak detector: G2bDf-1ew
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: t]jFo
:}8Z@H!KkY
4.检漏 'rp }G&m
4-1气泡检漏leak detection by bubbles: }o4N<%/+
4-2氨检漏leak detection by ammonia: Q_-_^J
4-3升压检漏leak detection of rise pressure: 4fk8*{Y
4-4放射性同位素检漏radioactive isotope leak detection: 58\&/lYW
4-5荧光检漏fluorescence leak detection [qUN 4x5b
7. 1.一般术语 Z>c3
1-1真空干燥vacuum drying: wI]"U2L5
1-2冷冻干燥freeze drying : o1W:ox?kO
1-3物料material: R'EUV0KX>Y
1-4待干燥物料material to be dried: %,Sf1fUJ
1-5干燥物料dried material : c0B|F
1-6湿气moisture;humidity: voP7"Dl[
1-7自由湿气free moisture: ('wY9kvL&
1-8结合湿气bound moisture: <h%O?mkC
1-9分湿气partial moisture: poGc a1
1-10含湿量moisture content: Nkxmm/Z
1-11初始含湿量initial moisture content: ;<yd^Xs
1-12最终含湿量final residual moisture: /Jf.y*;
1-13湿度degree of moisture ,degree of humidity : UcBe'r}G
1-14干燥物质dry matter : `>0MNmu
1-15干燥物质含量content of dry matter: fkf1m:Ckh
+zXEYc
2.干燥工艺 N\:.
M
2-1干燥阶段stages of drying : -F'b8:m
(1).预干燥preliminary dry: 4wC+S9I#E^
(2).一次干燥(广义)primary drying(in general): ?]D"k4
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): \fA{1
(4).二次干燥secondary drying: yFDv6yJ.
2-2.(1).接触干燥contact drying: I}Nd$P)>
(2).辐射干燥 drying by radiation : L}@c6fHG
(3).微波干燥microwave drying: 0#w?HCx=
(4).气相干燥vapor phase drying: B<j'm0a>B
(5).静态干燥static drying: *K> l*l(f]
(6).动态干燥dynamic drying: a=M\MZK>
2-3干燥时间drying time: f$NM M
>z
2-4停留时间length of stay(in the drying chamber): WVVJ
2-5循环时间cycle time: =FE|+!>PA
2-6干燥率 dessication ratio : :'#TCDlOb
2-7去湿速率mass flow rate of humidity: 2M#r]
2-8单位面积去湿速率mass flow rate of humidity per surface area: V&-~x^JK
2-9干燥速度 drying speed : /pF`8$
2-10干燥过程drying process: sR/b$j>i3
2-11加热温度heating temperature: =Umw$+fJr
2-12干燥温度temperature of the material being dried : A.hd
Kl
2-13干燥损失loss of material during the drying process : Cvn#=6V3
2-14飞尘lift off (particles): z9aY]lHY
2-15堆层厚度thickness of the material: N[k wO1
.e_cgad :
3.冷冻干燥 W5SJ^,d)J
3-1冷冻freezing: } CeCc0M
(1).静态冷冻static freezing: f=)2f=
(2).动态冷冻dynamic freezing: ^ f# FI&
(3).离心冷冻centrifugal freezing: |SyMngIY
(4).滚动冷冻shell freezing: L!=QR8?@E
(5).旋转冷冻spin-freezing: V}\~ugN)y
(6).真空旋转冷冻vacuum spin-freezing: 8Y5
(7).喷雾冷冻spray freezing: !
u:Weoz
(8).气流冷冻air blast freezing: <=f}8a.R3
3-2冷冻速率rate of freezing: ]Kr
`9r),
3-3冷冻物料frozen material: )/z@vY
3-4冰核ice core: G "73=8d
3-5干燥物料外壳envelope of dried matter: J~#;<e{\"
3-6升华表面sublimation front: d/i`l*
3-7融化位置freezer burn: AhZ8 0!
HD(.BW7
4.真空干燥设备;真空冷冻干燥设备 m=YU2!Mb
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: 1Tu
*79A
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: qh`t-
4-3加热表面heating surface: 5}`_x+$%(`
4-4物品装载面shelf : \hB5@e4i2
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 9uGrk^<t
4-6单位面积干燥器处理能力throughput per shelf area: jYe'V#5S#
4-7冰冷凝器ice condenser: mauI42
4-8冰冷凝器的负载load of the ice condenser: ~R(%D-k
4-9冰冷凝器的额定负载rated load of the ice condenser 9/nn)soC3
8. 1.一般术语 \EVBwE,
1-1试样sample : =Q.^c.sw
(1).表面层surface layer: V,$0p1?J
(2).真实表面true surface: je!-J8{
(3).有效表面积effective surface area: Rz.? i+
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: >Q(3*d >
(5).表面粒子密度surface particle density: %Ah^E$&n2
(6).单分子层monolayer: >uSy
(7).表面单分子层粒子密度monolayer density: B[KJR?>
(8).覆盖系数coverage ratio: KN*
1-2激发excitation: uvrB5=u
(1).一次粒子primary particle: 5O\*h;U 6
(2).一次粒子通量primary particle flux: y~FV2$
(3).一次粒子通量密度density of primary particle flux: lBaR
(4).一次粒子负荷primary particle load: d+'p@!W_
(5).一次粒子积分负荷integral load of primary particle: 3\B>lKhQ
(6).一次粒子的入射能量energy of the incident primary particle: ho$+L
(7).激发体积excited volume: ?Orxmxc
2
(8).激发面积excited area: ~-I+9F
(9).激发深度excited death: !_"fP:T>
(10).二次粒子secondary particles: B&@?*^.
(11).二次粒子通量secondary particle flux: }5hqDBK?
(12).二次粒子发射能energy of the emitted secondary particles: `DC2gJKk%
(13).发射体积emitting volume: wYmM"60
(14).发射面积emitting area: s D=n95`v
(15).发射深度emitting depth: $g
sxO!G
(16).信息深度information depth: 8|" XSN
(17).平均信息深度mean information depth: v61[.oS
1-3入射角angle of incidence: 7Zh~lM
1-4发射角angle of emission: 1~PV[2a
1-5观测角observation: THS.GvT9[
1-6分析表面积analyzed surface area: LbkF
1-7产额 yield : ^pYxKU_O
1-8表面层微小损伤分析minimum damage surface analysis: ~x|F)~:0=
1-9表面层无损伤分析non-destructive surface analysis: ,]d,-)KX8
1-10断面深度分析 profile analysis in depth; depth profile analysis : dUQDOo
1-11可观测面积observable area: 8@tPm$
1-12可观测立体角observable solid angle : Ba!J"b]
1-13接受立体角;观测立体角angle of acceptance: WS`qVL]^&
1-14角分辨能力angular resolving power: L>3x9
1-15发光度luminosity: 3J5!oF{H
1-16二次粒子探测比detection ratio of secondary particles: fP.
6HF_p_
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: aXoVy&x=
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ]]*7\ :cb
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 3h *!V6%q
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: RR]CW
1-21本底压力base pressure: `-p:vq`
1-22工作压力working pressure: @CT;g\4
!Y[lQXv
2.分析方法 -&-Ma,M?
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: v^1pN>#%g
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : 7BJzMlJ1Y
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: c5u@pvSP
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 4/wa+Y+=vt
2-3离子散射表面分析ion scattering spectroscopy: W;,C_
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: "*Tb"
'O
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: `a2n:F
2-6离子散射谱仪ion scattering spectrometer: "t~
2-7俄歇效应Auger process: 5Er2}KZJv,
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: SgS~ {4Zx*
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: rl#p".4q
2-10光电子谱术photoelectron spectroscopy : FSA1gAW6g
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS:
%*L:sTj(
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 50o~ P!Lz|
2-11光电子谱仪photoelectron spectrometer: c1E'$-
K@
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: :R~MO&
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: ~x]jB
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): -}KC=,]vh
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus