“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 zsha/:b
--------------------------------------------------- 2 1]87$
真空术语 W\J wEb9Y
m8<l2O=m
1.标准环境条件 standard ambient condition: 8iwqy0<
2.气体的标准状态 standard reference conditions forgases: A>W8^|l6+-
3.压力(压强)p pressure: sc
&S0K
4.帕斯卡Pa pascal: 8!u8ZvbFG
5.托Torr torr: q~*>
6.标准大气压atm standard atmosphere: zQ~8(E]Rf
7.毫巴mbar millibar: \-~TW4dYe
8.分压力 partial pressure: 0*}%v:uN9
9.全压力 total pressure: gl~>MasV&
10.真空 vacuum: *T{P^q.s~[
11.真空度 degree of vacuum: x*2' I
12.真空区域 ranges of vacuum: U<H<
!NV
13.气体 gas: |]8Hh>
14.非可凝气体 non-condensable gas: ]S#m
o
15.蒸汽vapor: MC&sM-/
16.饱和蒸汽压saturation vapor pressure: UuvI?D
17.饱和度degree of saturation: V[T`I a\
18.饱和蒸汽saturated vapor: l2LUcI$ x
19.未饱和蒸汽unsaturated vapor: (r+#}z}
20.分子数密度n,m-3 number density of molecules: }tRY,f
21.平均自由程ι、λ,m mean free path: 98AX=%8
22.碰撞率ψ collision rate: z}:|is)?
23.体积碰撞率χ volume collision rate: 3>t^Xu~
24.气体量G quantity of gas: L+o"<LV]
25.气体的扩散 diffusion of gas: V"{+cPBO)
26.扩散系数D diffusion coefficient; diffusivity: o:irwfArv
27.粘滞流 viscous flow: Ysz&/ry
28.粘滞系数η viscous factor: DoA+Bwq@
29.泊肖叶流 poiseuille flow: ,Bg)p_B
30.中间流 intermediate flow: |p"E0av
31.分子流 molecular flow: Q-g}{mFS
32克努曾数 number of knudsen: W{!GL
33.分子泻流 molecular effusion; effusive flow: B5Y
3GWhrx
34.流逸 transpiration: ToWtltCD
35.热流逸 thermal transpiration: Ow\dk^\-G8
36.分子流率qN molecular flow rate; molecular flux: 8NRc+@f|m
37.分子流率密度 molecular flow rate density; density of molecular flux: 39(]UO6^;
38.质量流率qm mass flow rare: /X_g[*]?
39.流量qG throughput of gas: bEJz>oyW"
40.体积流率qV volume flow rate: 05cyWg9a
41.摩尔流率qυ molar flow rate: J<4egk4
42.麦克斯韦速度分布 maxwellian velocity distribution: QXcSDJ
43.传输几率Pc transmission probability: #gL$~.1
44.分子流导CN,UN molecular conductance: Rr|&~%#z
45.流导C,U conductance: 8(EK17rE`
46.固有流导Ci,Ui intrinsic conductance: N5%zbfKM
47.流阻W resistance: RN3-:Zd_X
48.吸附 sorption: C\B&'+uR
49.表面吸附 adsorption: <[eE5X(
50.物理吸附physisorption: Gz9w1[t
51.化学吸附 chemisorption: ^6E+l#
52.吸收absorption: y(!YN7_A
53.适应系数α accommodation factor: |%@.@c
54.入射率υ impingement rate: '9Hah
55.凝结率condensation rate: Gw/imXL
56.粘着率 sticking rate: "#a_--"k9
57.粘着几率Ps sticking probability: 5D32d1A
58.滞留时间τ residence time: Rt[zZv
59.迁移 migration: lStYfO:<'v
60.解吸 desorption: "XEKoeG{
61.去气 degassing: `T
gwa
62.放气 outgassing: ^" EsBt
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: zIyMq3
64.蒸发率 evaporation rate: <{"]&bl
65.渗透 permeation: ;;2Yfn'`9
66.渗透率φ permeability: 9,4Lb]
67.渗透系数P permeability coefficient Uo!#p'<w)p
2. 1.真空泵 vacuum pumps -Tw96 dv
1-1.容积真空泵 positive displacement pump: 19u'{/Y"
⑴.气镇真空泵 gas ballast vacuum pump: S-^RZ"
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: BixKK$Lo
⑶.干封真空泵 dry-sealed vacuum pump: o<hT/ P
⑷.往复真空泵 piston vacuum pump: r
pv`%
⑸.液环真空泵 liquid ring vacuum pump: GtC bzNY
⑹.旋片真空泵 sliding vane rotary vacuum pump: YR2Q6}xR
⑺.定片真空泵 rotary piston vacuum pump: [q/tKdo@
⑻.滑阀真空泵 rotary plunger vacuum pump: 0<8pG:BQ
⑼.余摆线真空泵 trochoidal vacuum pump: Vd-\_VP20
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: B} %B4&Ij
⑾.罗茨真空泵 roots vacuum pump: [84f[`!Ui
1-2.动量传输泵 kinetic vacuum pump: vakAl;
⑴.牵引分子泵molecular drag pump: ]pZxbs&Vb
⑵.涡轮分子泵turbo molecular pump: &vf%E@<
⑶.喷射真空泵ejector vacuum pump: "pDwN$c
⑷.液体喷射真空泵liquid jet vacuum pump: cH&-/|N
⑸.气体喷射真空泵gas jet vacuum pump: G\y: O9(
⑹.蒸汽喷射真空泵vapor jet vacuum pump : (QPfrR=J4
⑺.扩散泵diffusion pump : SIBNU3;DL
⑻.自净化扩散泵self purifying diffusion pump: 8b0!eB#_Ee
⑼.分馏扩散泵 fractionating diffusion pump : dPdodjSu,!
⑽.扩散喷射泵diffusion ejector pump : C6=P(%y
⑾.离子传输泵ion transfer pump: y|BRAk&n
1-3.捕集真空泵 entrapment vacuum pump: ^ di[J^
⑴吸附泵adsorption pump: 9!u=q5+E
⑵.吸气剂泵 getter pump: HAHv^
⑶.升华(蒸发)泵 sublimation (evaporation)pump : u7_IO
⑷.吸气剂离子泵getter ion pump: vPm&0,R*y:
⑸.蒸发离子泵 evaporation ion pump: v&hQ;v
⑹.溅射离子泵sputter ion pump: _B@=fY(g!
⑺.低温泵cryopump: QEe\1>1"&
{9tKq--@E9
2.真空泵零部件 03F%!Rm/j
2-1.泵壳 pump case: Ue>;h9^
2-2.入口 inlet: 3fS+,>s\O
2-3.出口outlet: }r}$8M+1
2-4.旋片(滑片、滑阀)vane; blade : {bxTODt@
2-5.排气阀discharge valve: Sn I-dXNF
2-6.气镇阀gas ballast valve: }9&Z#1/
2-7.膨胀室expansion chamber: tevB2'3^
2-8.压缩室compression chamber: q~[@(+zP5
2-9.真空泵油 vacuum pump oil: 0Q81$% @<
2-10.泵液 pump fluid: dM%#DN8l
2-11.喷嘴 nozzle: '[E|3K5d
2-13.喷嘴扩张率nozzle expansion rate: 7oPLO(0L
2-14.喷嘴间隙面积 nozzle clearance area : t%
-"h|
2-15.喷嘴间隙nozzle clearance: f^P:eBgpx
2-16.射流jet: hL1q9%
2-17.扩散器diffuser: Q>jx`68'KI
2-18.扩散器喉部diffuser thoat: FT*OF 3
2-19.蒸汽导管vapor tube(pipe;chimney): HLL[r0P`F
2-20.喷嘴组件nozzle assembly: =J2\"6BnzA
2-21.下裙skirt: :L~{Q>o
b51{sL
3.附件 :[;]6;
3-1阱trap: cQ= "3M)~r
⑴.冷阱 cold trap: V/X4WZs|i
⑵.吸附阱sorption trap: gnW]5#c@
⑶.离子阱ion trap: E\3fL"lM
⑷.冷冻升华阱 cryosublimation trap: 5H (CP
3-2.挡板baffle: 2E
V
M*^A
3-3.油分离器oil separator: LaI(
3-4.油净化器oil purifier: vx:MLmZ.
3-5.冷凝器condenser: X6+2~'*t
pF)}< <C
4.泵按工作分类 gmU_# J%~
4-1.主泵main pump: + 9vd(c
4-2.粗抽泵roughing vacuum pump: ttazY#
4-3.前级真空泵backing vacuum pump: udRum7XW3
4-4.粗(低)真空泵 roughing(low)vacuum pump: 9.<d S
4-5.维持真空泵holding vacuum pump: 1`t4wD$/
4-6.高真空泵high vacuum pump: yv.Y-c=
4-7.超高真空泵ultra-high vacuum pump: / v";u)
4-8.增压真空泵booster vacuum pump: 4dkU;Ob
Oeua<,]Z~
5.真空泵特性 Ix+===6
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: RYU(z;+0p
5-2.真空泵的抽气量Q throughput of vacuum pump:。 ?y.q<F)
5-3.起动压力starting pressure: 7@[3]c<=
5-4.前级压力 backing pressure : mI55vNyer
5-5.临界前级压力 critical backing pressure: Hwr#
NKz-
5-6.最大前级压力maximum backing pressure: jft%\sY
5-7.最大工作压力maximum working pressure: v&BKl
5-8.真空泵的极限压力ultimate pressure of a pump: k=t\
5-9.压缩比compression ratio: P3w]PG@
5-10.何氏系数Ho coefficient: O>zPWVwa
5-11.抽速系数speed factor: #St=% !
5-12.气体的反扩散back-diffusion of gas: h,|49~^@"
5-13.泵液返流back-streaming of pump fluid: R<}WNZl
5-14.返流率back-streaming rate "qEi$a&]
5-15.返迁移back-migration: MA\^<x_?L}
5-16.爆腾bumping: "AN2K
5-17.水蒸气允许量qm water vapor tolerable load: =[wVRQ?
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: }E=:k&IDPB
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: %O5
k+~9
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump dXAKk[uf
3. 1.一般术语 "CYh"4]@rD
1-1.压力计pressure gauge: kF:4[d
1-2.真空计vacuum gauge: 6S-1Wc4
⑴.规头(规管)gauge head: IR*g>q
⑵.裸规nude gauge : ^i3~i?\,P
⑶.真空计控制单元gauge control unit : 0\G`AO;D
⑷.真空计指示单元gauge indicating unit : Pn )^mt
#;Yn8'a~
2.真空计一般分类 GA19=gow
2-1.压差式真空计differential vacuum gauge: 5):2;h k
2-2.绝对真空计 absolute vacuum gauge: %
K$om|]p
2-3.全压真空计total pressure vacuum gauge: x+j5vzhG)
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: iI_ad7,u
2-5.相对真空计relative vacuum gauge : e:9CD-
Vp =
3.真空计特性 zWiMl.[
3-1.真空计测量范围pressure range of vacuum gauge: P;%4Imq3
3-2.灵敏度系数sensitivity coefficient: ?Ji.bnfK
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): DlB"o.
3-5.规管光电流photon current of vacuum gauge head: K`!q1g`
3-6.等效氮压力equivalent nitrogen pressure : xrbDqA.b
3-7.X射线极限值 X-ray limit: auOYi<<>W
3-8.逆X射线效应anti X-ray effect: b6Jv|1w'
3-9.布利尔斯效应blears effect: SB#YV
5oz[Njq4
4.全压真空计 Ndj9B|s_
4-1.液位压力计liquid level manometer: %N\pfZ2\
4-2.弹性元件真空计elastic element vacuum gauge: }s;W{Q
4-3.压缩式真空计compression gauge: \tc`Aj%K
4-4.压力天平pressure balance: nQ\ +Za==
4-5.粘滞性真空计viscosity gauge : fMjn8.
4-6.热传导真空计thermal conductivity vacuum gauge : h.Cr;w,2R
4-7.热分子真空计thermo-molecular gauge: @kR/=EfS
4-8.电离真空计ionization vacuum gauge: O=os ,'"
4-9.放射性电离真空计radioactive ionization gauge: Jhbkp?Zli
4-10.冷阴极电离真空计cold cathode ionization gauge: ayfZ>x{s*
4-11.潘宁真空计penning gauge: 'L#qR)t
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: ?}*A/-Hx0U
4-13.放电管指示器discharge tube indicator: S[fzy$">
4-14.热阴极电离真空计hot cathode ionization gauge: 5MJ`B:He+
4-15.三极管式真空计triode gauge: '>:mEXK}w
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: pm<zw-
4-17.B-A型电离真空计Bayard-Alpert gauge: A8JEig 3Ix
4-18.调制型电离真空计modulator gauge: ^FSUK
4-19.抑制型电离真空计suppressor gauge:
jKV,i?
4-20.分离型电离真空计extractor gauge: AL/`Pqlk
4-21.弯注型电离真空计bent beam gauge: y6KI.LWR9
4-22.弹道型电离真空计 orbitron gauge : b&u o^G,
4-23.热阴极磁控管真空计hot cathode magnetron gauge: y}jX/Ln
%
R~9qO
5.分压真空计(分压分析器) 5q[0;`J
5-1.射频质谱仪radio frequency mass spectrometer: t?^C9(;6
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: Ou IoO
5-3.单极质谱仪momopole mass spectrometer: VNx|nP&
5-4.双聚焦质谱仪double focusing mass spectrometer: }?B=R#5
5-5.磁偏转质谱仪magnetic deflection mass spectrometer:
>So)KB
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: ]saf<?fzr
5-7.回旋质谱仪omegatron mass spectrometer: (j-[m\wF
5-8.飞行时间质谱仪time of flight mass spectrometer: kvh}{@|-
1
O+4A[cr
6.真空计校准 >8;Co]::kx
6-1.标准真空计reference gauges: gO-C[j/
6-2.校准系统system of calibration: TRG(W^<F
6-3.校准系数K calibration coefficient: !pI)i*V|
6-4.压缩计法meleod gauge method: .fxI)
6-5.膨胀法expansion method: "m3:HS
6-6.流导法flow method: 2U,O
e9
4. 1.真空系统vacuum system \RZFq<6>
1-1.真空机组pump system: *&)<'6
1-2.有油真空机组pump system used oil : .)^@[yrkz
1-3.无油真空机组oil free pump system jh.W$.Oq
1-4.连续处理真空设备continuous treatment vacuum plant: 7G}vQO
1-5.闸门式真空系统vacuum system with an air-lock: :u#Ls,OZz
1-6.压差真空系统differentially pumped vacuum system: pYV$sDlD
1-7.进气系统gas admittance system: JsOPI]
yEUF K
2.真空系统特性参量 UM%[UyYQ
2-1.抽气装置的抽速volume flow rate of a pumping unit : <by}/lF0
2-2.抽气装置的抽气量throughput of a pumping unit : "iE9X.6NMu
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: p~M1}mE
2-4.真空系统的漏气速率leak throughput of a vacuum system: 5,>1rd<B
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: /=4P<&J
2-6.极限压力ultimate pressure: cA ;'~[
2-7.残余压力residual pressure: Xg.'<.!g0
2-8.残余气体谱residual gas spectrum: HbF.doXK
2-9.基础压力base pressure: W;*rSK|(Sc
2-10.工作压力working pressure: J=>?D@K
2-11.粗抽时间roughing time: QOIi/flK
2-12.抽气时间pump-down time: Okca6=2"
2-13.真空系统时间常数time constant of a vacuum system: .EVy?-
2-14.真空系统进气时间venting time: vBsd.2t~
_GK^ 7}u
3.真空容器 -i|qk`Y
3-1.真空容器;真空室vacuum chamber: m`
cw:
3-2.封离真空装置sealed vacuum device: ;nG"y:qq
3-3.真空钟罩vacuum bell jar: cs`/^2Vf"#
3-4.真空容器底板vacuum base plate: W<TW6_*e
3-5.真空岐管vacuum manifold: %*P59%
3-6.前级真空容器(贮气罐)backing reservoir: !c:Q+:,H
3-7.真空保护层outer chamber: a8aEZ724
3-8.真空闸室vacuum air lock: 8^=g$;g
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: bJe*J\){
evPr~_
4.真空封接和真空引入线 c"t1E-Nsk
4-1.永久性真空封接permanent seal : ed*Cx~rT
4.2.玻璃分级过渡封接graded seal : $*K5
4-3.压缩玻璃金属封接compression glass-to-metal seal: &oiX/UaY
4-4.匹配式玻璃金属封接matched glass-to-metal seal: b].:2
4-5.陶瓷金属封接ceramic-to-metal seal: C1P{4 U
4-6.半永久性真空封接semi-permanent seal : i0,{*LD%^
4-7.可拆卸的真空封接demountable joint: Mm-FdP
m
4-8.液体真空封接liquid seal qAm$yfYs`
4-9.熔融金属真空封接molten metal seal: &'Qz
4-10.研磨面搭接封接ground and lapped seal: c&)H
4-11.真空法兰连接vacuum flange connection: />q=qkdq0
4-12.真空密封垫vacuum-tight gasket: %([$v6y
4-13.真空密封圈ring gasket: ( gO ?-0
4-14.真空平密封垫flat gasket: ;6t>!2I>C
4-15.真空引入线feedthrough leadthrough: +FQ:Q+
4-16.真空轴密封shaft seal: 57IrD*{
4-17.真空窗vacuum window: _3tHzDSG#
4-18.观察窗viewing window: q#v.-013r
?LgR8/Io@5
5.真空阀门 7Upm
5-1.真空阀门的特性characteristic of vacuum valves: m\7-/e2a
⑴.真空阀门的流导conductance of vacuum valves: M$-4.+G
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: #NNj#
5-2.真空调节阀regulating valve: xPb;_~
5-3.微调阀 micro-adjustable valve: [e3|yE6
5-4.充气阀charge valve: |K'{R'A
5-5.进气阀gas admittance valve: UA{sUj+?
5-6.真空截止阀break valve: >OE.6)'Rm
5-7.前级真空阀backing valve: x+|Fw d
5-8.旁通阀 by-pass valve: t*<vc]D
5-9.主真空阀main vacuum valve: qyUcjc%[
5-10.低真空阀low vacuum valve: n<8$_?-
5-11.高真空阀high vacuum valve: (U2G"
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: n0U^gsD4J
5-13.手动阀manually operated valve: f1=BBQY
>
5-14.气动阀pneumatically operated valve: <.$<d
5-15.电磁阀electromagnetically operated valve: =b32E^z,
5-16.电动阀valve with electrically motorized operation: CB_(9T72H
5-17.挡板阀baffle valve: Q'JE DH\
5-18.翻板阀flap valve: yNc>s/
5-19.插板阀gate valve: Y:^ =jV7
5-20.蝶阀butterfly valve: E{T\51V]%
nX5*pTfjL3
6.真空管路 h\'GL(?DBI
6-1.粗抽管路roughing line: (J.(Fl>^
6-2.前级真空管路backing line: 7zr\AgV9
6-3.旁通管路;By-Pass管路 by-pass line: Qat%<;P2
6-4.抽气封口接头pumping stem: )g:UH
Ns
6-5.真空限流件limiting conductance: 78+H|bH8
6-6.过滤器filter: Mn>dI@/gM
5. 1.一般术语 T_Z@uZom.
1-1真空镀膜vacuum coating: eN/sW!:P|
1-2基片substrate: c/;t.+g
1-3试验基片testing substrate: L)8 +/+
1-4镀膜材料coating material: E=~H,~
1-5蒸发材料evaporation material: s%GiM
1-6溅射材料sputtering material: ><LIOFqsS
1-7膜层材料(膜层材质)film material: .~v~~VL1NS
1-8蒸发速率evaporation rate: +Jt"JJ>% k
1-9溅射速率sputtering rate: lx$Y-Tb^F
1-10沉积速率deposition rate: /T#<g:
1-11镀膜角度coating angle: HZ8
j[kO
(N;Jw^C@
2.工艺 [7<X&Q
2-1真空蒸膜vacuum evaporation coating: &M>S$+I
n
(1).同时蒸发simultaneous evaporation: QIi*'21a+
(2).蒸发场蒸发evaporation field evaporation: sB0+21'R
(3).反应性真空蒸发reactive vacuum evaporation:
@KOa5-u
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: /lr RbZ
(5).直接加热的蒸发direct heating evaporation: -mY90]g
(6).感应加热蒸发induced heating evaporation: f@LUp^Z/v
(7).电子束蒸发electron beam evaporation: ^{6Y7T]
(8).激光束蒸发laser beam evaporation: >=U$s@
(9).间接加热的蒸发indirect heating evaporation: Xid>8
(10).闪蒸flash evaportion:
dZ%b|CUb
2-2真空溅射vacuum sputtering: `yQHPN0/
(1).反应性真空溅射 reactive vacuum sputtering: 3BY/&'oX
(2).偏压溅射bias sputtering: *}/xy
SH3
(3).直流二级溅射direct current diode sputtering: "3\RJ?eW:S
(4).非对称性交流溅射asymmtric alternate current sputtering: C{!Czz.N
(5).高频二极溅射high frequency diode sputtering: <(f4#BP
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1/cb;:h>
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: '')G6-c/
(8).离子束溅射ion beam sputtering: cYbO)?mC_
(9).辉光放电清洗glow discharge cleaning: .z[+sy_
2-3物理气相沉积PVD physical vapor deposition: YvYav d
2-4化学气相沉积CVD chemical vapor deposition: WZm^:,
2-5磁控溅射magnetron sputtering: rA1
gH6D
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 4aV3x&6X
2-7空心阴极离子镀HCD hollow cathode discharge deposition: DVB:8"Bu
2-8电弧离子镀arc discharge deposition: @%#(Hse
,7j`5iq[m
3.专用部件 50I6:=@\\
3-1镀膜室coating chamber: >p<(CVX[
3-2蒸发器装置evaporator device: z?
{#/
3-3蒸发器evaporator: Ev^Xs6 }"
3-4直接加热式蒸发器evaporator by direct heat: dt5gQ9(B
3-5间接加热式蒸发器evaporator by indirect heat: vo::y"
3-7溅射装置sputtering device: I[4E?
3-8靶target: qHKZ5w
3-10时控挡板timing shutter: #5H@/o8!s=
3-11掩膜mask: ]$L[3qA.
3-12基片支架substrate holder: &>s(f-\8
3-13夹紧装置clamp: bTiw?i+6Dv
3-14换向装置reversing device: yjSN;3t71
3-15基片加热装置substrate heating device: 4;*V^\',9
3-16基片冷却装置substrate colding device: 0)P18n"$
K[ \z'9Q
4.真空镀膜设备 kqyMrZ#
4-1真空镀膜设备vacuum coating plant: TgUQD(d^
(1).真空蒸发镀膜设备vacuum evaporation coating plant: {[s<\<~B*
(2).真空溅射镀膜设备vacuum sputtering coating plant: ScTqnY$v
4-2连续镀膜设备continuous coating plant: @i`gR%
4-3半连续镀膜设备semi- continuous coating plant r[,KE.^6~#
6. 1.漏孔 b~Ruhi[E
1-1漏孔leaks: 5sE^MS1
1-2通道漏孔channel leak: G{"1I
1-3薄膜漏孔membrane leak: TtvS|09p;
1-4分子漏孔molecular leak: xv*mK1e
1-5粘滞漏孔vixcous leak: .Gv~e!a8
1-6校准漏孔calibrated leak: NRl"!FSD;"
1-7标准漏孔reference leak : D3K`b4YV
1-8虚漏virtual leak: hD,-!R
1-9漏率leak rate: $?s^HKF~
1-10标准空气漏率standard air leak rate: H,I}R
1-11等值标准空气漏率equivalent standard air leak rate: t/$xzsoJZr
1-12探索(示漏)气体: UP`q6]P
nY8UJy}<oL
2.本底 C=]3NB>Jc
2-1本底background: e56#Qb@$\
2-2探索气体本底search gas background : jG2w(h/"
2-3漂移drift: Cn55%:
2-4噪声noise: MvW>ktkU
U;nC)'~YW9
3.检漏仪 {L=[1
3-1检漏仪leak detector: x3P@AC$\
3-2高频火花检漏仪H.F. spark leak detector: t,+S~Cj|
3-3卤素检漏仪halide leak detector: nZT@d;]U9
3-4氦质谱检漏仪helium mass spectrometer leak detector: j*zK"n
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: N:<O
5_`}$"<~
4.检漏 J#kdyBmuO
4-1气泡检漏leak detection by bubbles: G<z)Ydh_
4-2氨检漏leak detection by ammonia: 7X|r';"?i
4-3升压检漏leak detection of rise pressure: xHGoCFB
4-4放射性同位素检漏radioactive isotope leak detection: yRznP)
4-5荧光检漏fluorescence leak detection nT12[@:Tr
7. 1.一般术语 ;1dz?'%V
1-1真空干燥vacuum drying: Chua>p!$g
1-2冷冻干燥freeze drying : J
v#^GNm
1-3物料material: KRtu@;?
1-4待干燥物料material to be dried: VMWg:=~$
1-5干燥物料dried material : !BX62j\?
1-6湿气moisture;humidity: LnDj
1-7自由湿气free moisture: ]Rye AJ3
1-8结合湿气bound moisture: ^55?VQB
1-9分湿气partial moisture: /kz&9FM
1-10含湿量moisture content: R]Oy4U,f
1-11初始含湿量initial moisture content: nADd,|xD3
1-12最终含湿量final residual moisture: )
b10%n^
1-13湿度degree of moisture ,degree of humidity : X W)A~wPBs
1-14干燥物质dry matter : 9qDGxW
'1
1-15干燥物质含量content of dry matter: ^{s0d+@{
d]3sC
2.干燥工艺 f
99PwE(=
2-1干燥阶段stages of drying : &w0=/G/T=~
(1).预干燥preliminary dry: Elp!,(+&6
(2).一次干燥(广义)primary drying(in general): As|/
O7%
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): Z-|C{1}A
(4).二次干燥secondary drying: .LhmYbQ2WE
2-2.(1).接触干燥contact drying: }^[@m#
(2).辐射干燥 drying by radiation : Bs?F*,zDJ
(3).微波干燥microwave drying: L_mqC(vn
(4).气相干燥vapor phase drying: Y2-bU 7mo
(5).静态干燥static drying: h*UUtLi%WU
(6).动态干燥dynamic drying: c0&'rxi(B
2-3干燥时间drying time: $0}bi:7
2-4停留时间length of stay(in the drying chamber): r6JkoPMh
2-5循环时间cycle time: ts<dUO
2-6干燥率 dessication ratio : 9/Dt:R3QU
2-7去湿速率mass flow rate of humidity: v{ n}%akc
2-8单位面积去湿速率mass flow rate of humidity per surface area: od1omYsR
2-9干燥速度 drying speed : "PaGDhS
2-10干燥过程drying process: .4> s2
2-11加热温度heating temperature: o2 d~
2-12干燥温度temperature of the material being dried : |nN/x<v
2-13干燥损失loss of material during the drying process : k{jw%a<Sc
2-14飞尘lift off (particles): 2nkj;x{H$
2-15堆层厚度thickness of the material: ;Ia1L{472m
*\KvcRMGUa
3.冷冻干燥 1\*B.
3-1冷冻freezing: ]t)M}^w
(1).静态冷冻static freezing: -!,]Y10
(2).动态冷冻dynamic freezing: \.P}`Bpa
(3).离心冷冻centrifugal freezing: !9xANSb
(4).滚动冷冻shell freezing: Q5nyD/k4c
(5).旋转冷冻spin-freezing: o?K|[gNi
(6).真空旋转冷冻vacuum spin-freezing: O6,"#BX
(7).喷雾冷冻spray freezing: gvqd1?0w
(8).气流冷冻air blast freezing: ll\^9
4]Q
3-2冷冻速率rate of freezing: z-G7Y#
3-3冷冻物料frozen material: $H-D9+8 7
3-4冰核ice core: =8p+-8M[d
3-5干燥物料外壳envelope of dried matter: ' P`p.5nH
3-6升华表面sublimation front: 6'Yn|A
3-7融化位置freezer burn: 3
9{"T0
$;uWj|
4.真空干燥设备;真空冷冻干燥设备 }<ONx g6Kb
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: S"TMsi
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: RyOT[J
4-3加热表面heating surface: &rztC]jF
4-4物品装载面shelf : ?ZHE8
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ~Oq,[,W
4-6单位面积干燥器处理能力throughput per shelf area:
0IgnpeA]
4-7冰冷凝器ice condenser: M1]6lg[si
4-8冰冷凝器的负载load of the ice condenser: &1E~ \8U
4-9冰冷凝器的额定负载rated load of the ice condenser #VdI{IbW
8. 1.一般术语 MAe<.DHY
1-1试样sample : 7s8<FyFsjd
(1).表面层surface layer: \As oeeF
(2).真实表面true surface: z[\W\g*|ri
(3).有效表面积effective surface area: ?FV7|)f
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: _A,-[*OKI
(5).表面粒子密度surface particle density: / }XsuH
(6).单分子层monolayer: VyoE5o
(7).表面单分子层粒子密度monolayer density: foz5D9sQ
(8).覆盖系数coverage ratio: Z0"&
1-2激发excitation: 4/2RfDp
(1).一次粒子primary particle: F7Dc!JNa
(2).一次粒子通量primary particle flux: a\&(Ua
(3).一次粒子通量密度density of primary particle flux: RZd4(7H=q
(4).一次粒子负荷primary particle load: p_5>?[TW:
(5).一次粒子积分负荷integral load of primary particle: I#S~
(6).一次粒子的入射能量energy of the incident primary particle: qXB03}] G
(7).激发体积excited volume: 2JA&{ch
(8).激发面积excited area: k?["F%)I
(9).激发深度excited death:
HTUYvU*-
(10).二次粒子secondary particles: zY+t ,2z
(11).二次粒子通量secondary particle flux: RUS7Z~5
(12).二次粒子发射能energy of the emitted secondary particles: 9xK4!~5V
(13).发射体积emitting volume: mI7rx`4H
(14).发射面积emitting area: hINnb7o
(15).发射深度emitting depth: Q"OV>kl k
(16).信息深度information depth: )iEa2uJ
(17).平均信息深度mean information depth: MJ>Qq[0
1-3入射角angle of incidence: 5mna7BCEb
1-4发射角angle of emission: jMf 7J
1-5观测角observation: Ez/\bE
1-6分析表面积analyzed surface area: _H4$$
1-7产额 yield : Q(=Vk~v
1-8表面层微小损伤分析minimum damage surface analysis: c#{Ywh
1-9表面层无损伤分析non-destructive surface analysis: {+C %D'
1-10断面深度分析 profile analysis in depth; depth profile analysis : `R=a@DQ
1-11可观测面积observable area: ;.nP%jD
1-12可观测立体角observable solid angle : P~Te+ -jX}
1-13接受立体角;观测立体角angle of acceptance: 5W[3_P+
1-14角分辨能力angular resolving power: mJ8{lXq3!
1-15发光度luminosity: W>`g;[ W
1-16二次粒子探测比detection ratio of secondary particles: O1x0[sy
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: Y!Uu173
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ]RH=s7L
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: 8zQ_xE
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: ,bZ"8Z"lss
1-21本底压力base pressure: =2RhPD
1-22工作压力working pressure: zG-_!FIn
U^M@um M
2.分析方法 a%7"_{s1
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ?%\mQmjas
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : ~K5Cr
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: -H1"OJ2aF
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 0|+>A?E}E
2-3离子散射表面分析ion scattering spectroscopy: [{S;%Jj*X/
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: .sd B3x
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ";wyNpb(
2-6离子散射谱仪ion scattering spectrometer: js:C
mnI
2-7俄歇效应Auger process: LPEjRG,
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: g2g`,"T
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: Cz'xGW{
2-10光电子谱术photoelectron spectroscopy : 8_xnWMOe
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: ? .c?Pu
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: &mh Ln4^
2-11光电子谱仪photoelectron spectrometer: R#Y50hzT
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: uz*d^gr}
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: L7SEswMti
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): Q,zC_
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus