寻找硅胶。用在投影仪的光学元件上。

  参数参考 uw3vYYFX  
Curing Ey7zb#/<!  
Pre-cure:    100oC for 15 minutes Tx}Nr^  
Full cure:    100oC for 1 hour (minimum) Vit-)o{zr  
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin I(M/X/  
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Mechanical Data h\!8*e;RAW  
1. Tensile strength:    800 psi (min) v?."`,e  
2. Lap shear strength:    250 psi (min) O|t>.<T?  
3. Elongation:        80% (min) r|l?2 eO~  
4. Hardness:        50 Shore D (7qlp*8.s  
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Thermal and Optical Data: l>;hQh  
1.  Working temperature range: -40oC – 230oC
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2.    Decomposition temperature:    onset at 3000C (by TGA) @XJ7ff&  
3.    No change in modulus with temperature -*7i:mg  
4.    CTE ~ 200 ppm/oC #ZJ 1\Ov  
5.    Refractive index:        1.43 ~u%$ 9IhM  
6.    Transmittance(%)    >90  @260-700nm azZtuDfv  
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