2014年国际光电子与微电子技术及应用研讨会
天津滨海新区政府联合中国航天科工集团公司，将于2014年11月中旬在天津共同发起举办“2014国际光电子与微电子技术及应用研讨会”。
 - Micromirrors and optical scanners - Tunable microlenses - Optical switches, OXCs, VOAs - Microspectrometers - Picoprojectors - Microactuators for optical devices/systems - Optical microsensors - Device fabrication technologies for optical MEMS devices - Biomedical micro-optical devices - Micro-optical systems for imaging - Modeling and characterization - Optical systems on chip - Optical energy harvesting - Opto-fluidic devices, etc Conf7: Packaging Technology (封装技术) - General IC package architecture design - 3D integration: design and technology solutions for system-on-chip - Wafer scale packing solution and implementation - High reliability ceramic package design and manufacture - Tools and methodologies for electrical, stress, and thermal modeling. - Novel partitioning, power delivery design, clock tree design, heatsink/cooling methods - Innovative package design for image sensors - Other topics relates to semiconductor IC package design and manufacture, etc Conf8: Advanced Optoelectronic Sensing Systems and Applications (光电传感系统与应用) Conf9: Micro-nano Photonics and Applications (微纳光子学及应用) - Nano-biophotonics - Photonic crystals - Nanophotonics for displays - Optical storage - Nanoplasmonics and metamaterials |
1.行业新闻、市场分析。 2.新品新技术（最新研发出来的产品技术介绍，包括产品性能参数、作用、应用领域及图片）； 3.解决方案/专业论文（针对问题及需求，提出一个解决问题的执行方案）； 4.技术文章、白皮书，光学软件运用技术（光电行业内技术文档）；
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