首页 -> 登录 -> 注册 -> 回复主题 -> 发表主题
光行天下 -> 光电资讯及信息发布 -> CIOE2013:Aifotec AG携Wafer-level die bonding参展 [点此返回论坛查看本帖完整版本] [打印本页]

abjames 2013-08-20 16:46

CIOE2013:Aifotec AG携Wafer-level die bonding参展

CIOE2013:Aifotec AG携带Wafer-level die bonding参展 u0<d2Y  
:DF`A(  
Technology evaluation vbW\~xf  
BOM analysis Tom}sFl][  
Contract studies :FEd:0TS  
Design for Manufacturability, analysis and planning '5&B~ 1&  
Production roadmapping across hybrid technologies Nj! R9N  
   bvt-leA=  
Aifotec AG / n C$?w  
展位号: 1A09-9 oY| (M_;  
F>hVrUD8  
Aifotec AG is an independent provider of photonic design and manufacturing services. vq@#Be?@  
B' <O)"1w  
We offer industry-proven experience in a variety of Photonic Development (PDS) and Photonic Manufacturing Services (PMS) for high-precision optical devices in applications such as Data Communications, Consumer, Automotive and Military. Aifotec AG offers Hybrid Integration Technology experience, which allows packaging solutions across leading-edge process benches such as glass, ceramic, polymer and silicon, using either laser bonding, as well as different gluing technologies. X7(rg W8  
sIP6GWK$  
Aifotec AG originates from Aifotec Fiberoptics GmbH, which was founded in 2002 out of an MBO from Finisar Europe GmbH, and has meanwhile advanced to one of the leading providers of design and manufacturing services for high-precision (+/- 0.5um) and yet cost effective photonic modules and components. 9 &?tQ"@x  
7!]k#|u  
Together with our strategic partner FOCUZ, a Thai volume manufacturer of fibre-coupled modules we offer a powerful combination of forces, highly unique in the industry.
查看本帖完整版本: [-- CIOE2013:Aifotec AG携Wafer-level die bonding参展 --] [-- top --]

Copyright © 2005-2024 光行天下 蜀ICP备06003254号-1 网站统计