请教下各位高手,CODEV如何进行消热差设计,是用thermpik宏么?具体操作怎么弄呢?我把温度范围输进去,结果得到 %,a.431gi vb9G_Pfz ************************************************** -{pcb7.xuv * WARNING * :Ff1Js(Z * * +;`Cm.Iu * All Solves & Pickups have been deleted * hc>hNC:a * * dQ`ch~HVUW * The Starting Lens has been Dezoomed to Z1 * `zC_?+ * * |g> K$m^ * Please check the resulting thermal zoom lens * Mh>^~; * carefully to verify validity of the set-up * :2 ?dl:l * * Cf<i" ************************************************** S`K8e^] j?/T7a^ ERROR - The macro THERM_ENV.SEQ was not found $4 >K2 It is recommended that you copy the sample .cQwjL from the CV_MACRO directory into your %l,p />r working directory, and edit it appropriately Jnb>u*7, 这是哪里的问题呢?用ZEMAX多重结构直接就出来了啊。。。。。。 z^{VqC*o+ 请各位高手指教下,如果有推荐的资料也可以,我这里的CODEV资料都查过了,没查到相关的东西。 m$*dPje 谢谢啦!!!!! qW][Q%'lt