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2008-01-12 21:59 |
LED照明专业术语中英文对照
1 backplane 背板 ,lw<dB@7"5 2 Band gap voltage reference 带隙电压参考 %suXp,j 3 benchtop supply 工作台电源 !O#NP! 4 Block Diagram 方块图 5 Bode Plot 波特图 :6Sb3w5h 6 Bootstrap 自举 5$f*fMd; 7 Bottom FET Bottom FET h>K%OxR 8 bucket capcitor 桶形电容 Hy1f,D 9 chassis 机架 L QP4#7 10 Combi-sense Combi-sense o8S)8_3 11 constant current source 恒流源 ~TALpd 12 Core Sataration 铁芯饱和 5P
< F 13 crossover frequency 交叉频率 %GDs/9 14 current ripple 纹波电流 N
@sVA%L. 15 Cycle by Cycle 逐周期 %D}]Z=gp 16 cycle skipping 周期跳步 ]#oqum@Yf1 17 Dead Time 死区时间 y'pX/5R0 18 DIE Temperature 核心温度 'D;'Pr] 19 Disable 非使能,无效,禁用,关断 gw9:1S
20 dominant pole 主极点 ^<O:`c6_ 21 Enable 使能,有效,启用 eEkbD"Q 22 ESD Rating ESD额定值 -* ;`~5 23 Evaluation Board 评估板 oGi{d5 24 Exceeding the specifications below may result in permanent damage to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not implied. z|>f*Z 超过下面的规格使用可能引起永久的设备损害或设备故障。建议不要工作在电特性表规定的参数范围以外。 z"lRfOWI 25 Failling edge 下降沿 sp$W=Wu7 26 figure of merit 品质因数 OQh(qa 27 float charge voltage 浮充电压 nxh9'"th 28 flyback power stage 反驰式功率级 h|Uy!?l
29 forward voltage drop 前向压降
UBxQ4)% 30 free-running 自由运行 ssC5YtF7X 31 Freewheel diode 续流二极管 /h'b,iYVV 32 Full load 满负载 33 gate drive 栅极驱动 j8gi/07l 34 gate drive stage 栅极驱动级 A PR%ZpG 35 gerber plot Gerber 图 s*DDO67\W 36 ground plane 接地层 {CR'Z0 37 Henry 电感单位:亨利 /0H39]y!~ 38 Human Body Model 人体模式 Ju7nvxC 39 Hysteresis 滞回 JRj%d&^} 40 inrush current 涌入电流 MM%c 41 Inverting 反相 0Ie9T1D= 42 jittery 抖动 f
i3 < 43 Junction 结点 N;6WfdA- 44 Kelvin connection 开尔文连接 AyMMr_q 45 Lead Frame 引脚框架 ,fwN_+5 46 Lead Free 无铅 r:Xui- 47 level-shift 电平移动 TBYRY)~f 48 Line regulation 电源调整率 +}@HtjM 49 load regulation 负载调整率 If_S_A c 50 Lot Number 批号 RT)*H>| 51 Low Dropout 低压差 =N zA2td 52 Miller 密勒 53 node 节点 h4^
a#%$ 54 Non-Inverting 非反相 ZrFC#wJb 55 novel 新颖的 43Yav+G(+ 56 off state 关断状态 |0mVK` 57 Operating supply voltage 电源工作电压 kEE8cW3 58 out drive stage 输出驱动级 !%?X% @9 59 Out of Phase 异相 O`hOVHDQ 60 Part Number 产品型号 vO2 o/
61 pass transistor pass transistor |mfQmFF 62 P-channel MOSFET P沟道MOSFET QMfa~TH#p 63 Phase margin 相位裕度 ~sQN\]5VW 64 Phase Node 开关节点 /0mbG!Ac 65 portable electronics 便携式电子设备 8]N+V: 66 power down 掉电 h*Y);mc$# 67 Power Good 电源正常 5"5D( 68 Power Groud 功率地 ?*z#G'3z1 69 Power Save Mode 节电模式 #<bt}Tht 70 Power up 上电 zZ|Si 71 pull down 下拉 !z;a>[T' 72 pull up 上拉 )BY\c7SG 73 Pulse by Pulse 逐脉冲(Pulse by Pulse) !\H!9FR 74 push pull converter 推挽转换器 ']+ -u{+# 75 ramp down 斜降 ]cnLJ^2 76 ramp up 斜升 d"|XN{ 77 redundant diode 冗余二极管 }06
78 resistive divider 电阻分压器 M ,8r{[2 79 ringing 振 铃 vvLm9Tw 80 ripple current 纹波电流 ~3.1.
'A 81 rising edge 上升沿 */n)_ 82 sense resistor 检测电阻 V,($I'&/ 83 Sequenced Power Supplys 序列电源
S ;x;FU 84 shoot-through 直通,同时导通 i=-zaboo 85 stray inductances. 杂散电感 )>Oip 86 sub-circuit 子电路 KD^>Vv# 87 substrate 基板 vS:%(Y"!< 88 Telecom 电信 PY.c$)az> 89 Thermal Information 热性能信息 Pt?]JJxl- 90 thermal slug 散热片 . oUaq|O 91 Threshold 阈值 #{GUu',?& 92 timing resistor 振荡电阻 Z^>[{|lIA 93 Top FET Top FET A:1O:LB=! 94 Trace 线路,走线,引线 Pn5@7~ 95 Transfer function 传递函数 a4X J0Tm 96 Trip Point 跳变点 gO?+:}! 97 turns ratio 匝数比,=Np / Ns。(初级匝数/次级匝数) `/<KDd:_t 98 Under Voltage Lock Out (UVLO) 欠压锁定 jpqq>Hbg_ 99 Voltage Reference 电压参考 z_eP 100 voltage-second product 伏秒积 4em7PmT 101 zero-pole frequency compensation 零极点频率补偿 =8j;!7p 102 beat frequency 拍频 h%(dT/jPL) 103 one shots 单击电路 S'HM|& 104 scaling 缩放 +}X?+Epm 105 ESR 等效串联电阻 [Page] Zbxd,|<| 106 Ground 地电位 "TKf"zc 107 trimmed bandgap 平衡带隙 y>u+.z a| 108 dropout voltage 压差 |^Z1 D TAw 109 large bulk capacitance 大容量电容 hZ.Sj~>7` 110 circuit breaker 断路器 R)t"`'6| 111 charge pump 电荷泵 rSB"0W7 112 overshoot 过冲 {!xPq% Nm#VA.~ 印制电路printed circuit l2=.;7IV 印制线路 printed wiring t-lWvxXe 印制板 printed board e%j+,)Ry 印制板电路 printed circuit board O1coay 印制线路板 printed wiring board q~r)B} 印制元件 printed component )ye[R^!} 印制接点 printed contact f!*b8ND^R
印制板装配 printed board assembly o)cd!,h 板 board +}>whyX1 刚性印制板 rigid printed board (80]xLEBL 挠性印制电路 flexible printed circuit hyL3fkMJ, 挠性印制线路 flexible printed wiring kYz)h 齐平印制板 flush printed board
C+,;hj 金属芯印制板 metal core printed board z['>`Kt 金属基印制板 metal base printed board \rcbt6H
多重布线印制板 mulit-wiring printed board t</rvAH E 塑电路板 molded circuit board Wk'KN o 散线印制板 discrete wiring board /+P
4cHv]F 微线印制板 micro wire board 18Vtk"j 积层印制板 buile-up printed board 8=T;R&U^M 表面层合电路板 surface laminar circuit s7SW4ff1 埋入凸块连印制板 B2it printed board 4CS9vv)9R 载芯片板 chip on board iquB]z' 埋电阻板 buried resistance board ,$mnD@) 母板 mother board 2<yi8O\ 子板 daughter board Z~~{!C+G 背板 backplane ,2[laJ 裸板 bare board >;nE.] 键盘板夹心板 copper-invar-copper board ]o_Z3xXUa 动态挠性板 dynamic flex board 4/S4bk*8 静态挠性板 static flex board v@LK3S/!3 可断拼板 break-away planel EkEM|<GNd 电缆 cable 5l2Ph4( 挠性扁平电缆 flexible flat cable (FFC) ]/HSlT= 薄膜开关 membrane switch NM/?jF@j* 混合电路 hybrid circuit L"1UUOKy 厚膜 thick film -wC;pA#o 厚膜电路 thick film circuit rv&(yA 薄膜 thin film &iR>:=ksN 薄膜混合电路 thin film hybrid circuit nE+sbfC 互连 interconnection yd`xmc) 导线 conductor trace line Z BcZG 齐平导线 flush conductor F5wCl2I 传输线 transmission line qWGnIPk 跨交 crossover Iu jly f 板边插头 edge-board contact 8uM >Up X 增强板 stiffener |J'@-*5?[8 基底 substrate W @`Nn*S 基板面 real estate Av^{$9yl 导线面 conductor side ?&_ -,\t 元件面 component side \kvd;T#t6 焊接面 solder side xSs);XO, 导电图形 conductive pattern V2,54YE 非导电图形 non-conductive pattern xpx=t71Hq 基材 base material =;7gxV3; 层压板 laminate n%"q> 覆金属箔基材 metal-clad bade material ixw3Z D(>+ 覆铜箔层压板 copper-clad laminate (CCL) 75r>~@)* 复合层压板 composite laminate >zFe) 薄层压板 thin laminate ~jH@3\
?- 基体材料 basis material '~VKH}b 预浸材料 prepreg 84DneSpHsp 粘结片 bonding sheet F.HD;C-;( 预浸粘结片 preimpregnated bonding sheer ;RflzY|D 环氧玻璃基板 epoxy glass substrate =GL}\I 预制内层覆箔板 mass lamination panel iN"kv 内层芯板 core material 4{(uw 粘结层 bonding layer
T,@.RF 粘结膜 film adhesive >E|@3g
+2 无支撑胶粘剂膜 unsupported adhesive film w>p0ldi 覆盖层 cover layer (cover lay) wV+ W( 增强板材 stiffener material MGfDxHg] 铜箔面 copper-clad surface -GD_xk 去铜箔面 foil removal surface %2f``48# 层压板面 unclad laminate surface n`2d 基膜面 base film surface d=o|)kV 胶粘剂面 adhesive faec A07g@3n 原始光洁面 plate finish J_C<Erx[O 粗面 matt finish );_g2=:# 剪切板 cut to size panel F^7qLvh 超薄型层压板 ultra thin laminate :.'<ndM A阶树脂 A-stage resin .X\p;~H
5 B阶树脂 B-stage resin rIH/<@+ C阶树脂 C-stage resin g34<0%6jd 环氧树脂 epoxy resin 8*!<,k="9 酚醛树脂 phenolic resin 8>x!n/z) 聚酯树脂 polyester resin <gF=$u|}3[ 聚酰亚胺树脂 polyimide resin p
@&>{hi@ 双马来酰亚胺三嗪树脂 bismaleimide-triazine resin R
5-q{ 丙烯酸树脂 acrylic resin U&yXs'3a& 三聚氰胺甲醛树脂 melamine formaldehyde resin 15+>W4v 多官能环氧树脂 polyfunctional epoxy resin _Db=I3.HJ 溴化环氧树脂 brominated epoxy resin `uM:> 环氧酚醛 epoxy novolac n$
$^(-g@) 氟树脂 fluroresin S<rdPS*P 硅树脂 silicone resin ']Gqa$(YC 硅烷 silane C8rD54A'M 聚合物 polymer &PVos|G 无定形聚合物 amorphous polymer 5XySF # 结晶现象 crystalline polamer (4cWq!ax<$ 双晶现象 dimorphism cjAKc|N J 共聚物 copolymer k"\%x=# 合成树脂 synthetic 26PUO$&b. 热固性树脂 thermosetting resin [Page] 'bJ!~ML& 热塑性树脂 thermoplastic resin NdGIH/Y;M 感光性树脂 photosensitive resin [bk2RaX:i 环氧值 epoxy value v#0F1a?]D 双氰胺 dicyandiamide _8P"/(
`Rw 粘结剂 binder y=g9 wO 胶粘剂 adesive i]J*lM7' 固化剂 curing agent [Oen{c9A 阻燃剂 flame retardant Se<]g$eK?5 遮光剂 opaquer n8UQIa4&= 增塑剂 plasticizers n|2`y? 不饱和聚酯 unsatuiated polyester 6w(Mb~[n 聚酯薄膜 polyester s0uI;WMg 聚酰亚胺薄膜 polyimide film (PI) wI><kdz 聚四氟乙烯 polytetrafluoetylene (PTFE) '?=SnjMX 增强材料 reinforcing material ma9q?H#X 折痕 crease 'N^\9X0 云织 waviness !Ob 鱼眼 fish eye vQ/}E@?u 毛圈长 feather length ]Q,;5>#W 厚薄段 mark 9pUvw_9MY 裂缝 split B!-hcn]y 捻度 twist of yarn EBlfwFd 浸润剂含量 size content #<0Yx9Jh. 浸润剂残留量 size residue (;v)0&h 处理剂含量 finish level A<P3X/i 偶联剂 couplint agent 5I/wP qR[ 断裂长 breaking length Mx{VN
P 吸水高度 height of capillary rise q9fCoz 湿强度保留率 wet strength retention VeiJ1=hc 白度 whitenness q9cmtZrm 导电箔 conductive foil x{{QS$6v 铜箔 copper foil ddvSi6 压延铜箔 rolled copper foil o#3?")>| 光面 shiny side )OQhtxK 粗糙面 matte side :W]?6= 处理面 treated side u$ [R>l9 防锈处理 stain proofing L08>9tf` 双面处理铜箔 double treated foil W%LTcm 模拟 simulation 2{;&c 逻辑模拟 logic simulation ?~~sOf AP 电路模拟 circit simulation >2h|$6iWP 时序模拟 timing simulation 8|^dM$ 模块化 modularization HDQhXw!!hc 设计原点 design origin ,:g.B\'Q 优化(设计) optimization (design) 0^'A^ 供设计优化坐标轴 predominant axis Z|;<:RKWY 表格原点 table origin f!6oW( r-L 元件安置 component positioning S<}2y 9F
比例因子 scaling factor 0\v98g<[+ 扫描填充 scan filling HUqG)t*c1 矩形填充 rectangle filling X"WKgC g$ 填充域 region filling )"k>}&' 实体设计 physical design Ci%u =%( 逻辑设计 logic design MuNM)pyxp 逻辑电路 logic circuit uC\FW6K=m 层次设计 hierarchical design gXr"],OM; 自顶向下设计 top-down design [Du@go1C 自底向上设计 bottom-up design T}} 0hs; 费用矩阵 cost metrix AA][}lU:5 元件密度 component density [MSLVTR 自由度 degrees freedom VBc[(8o 出度 out going degree *9:oTN 入度 incoming degree tP; &$y.8 曼哈顿距离 manhatton distance 6k6M&a 欧几里德距离 euclidean distance s( @w1tS. 网络 network FR~YO|4? 阵列 array 5
o:VixZf 段 segment yXU-@~ 逻辑 logic NGYliP,.6 逻辑设计自动化 logic design automation m87,N~DP 分线 separated time UeWEncN( 分层 separated layer
V|=PaO 定顺序 definite sequence 2p\CCzw 导线(通道) conduction (track) blxAy 导线(体)宽度 conductor width e$F]t*)Xa 导线距离 conductor spacing fDc>E+, 导线层 conductor layer _\E{T5 导线宽度/间距 conductor line/space n}== 第一导线层 conductor layer No.1 w0QN5? 圆形盘 round pad _^4\z*x 方形盘 square pad =H*}{'# 菱形盘 diamond pad Enee\!@v 长方形焊盘 oblong pad eUQ., mP 子弹形盘 bullet pad `@GqD 泪滴盘 teardrop pad !_GY\@} 雪人盘 snowman pad )6|7L)Dk 形盘 V-shaped pad V jvx9b([<sG 环形盘 annular pad 8@%Xd^ 非圆形盘 non-circular pad $ tf;\R 隔离盘 isolation pad 2m.RM&TdB 非功能连接盘 monfunctional pad `-zdjc d 偏置连接盘 offset land 9xWC<i 腹(背)裸盘 back-bard land 97:1L4w.( 盘址 anchoring spaur \8\)5#? 连接盘图形 land pattern -_=0PW5{ 连接盘网格阵列 land grid array a] :tn:q 孔环 annular ring YArNJ5z= 元件孔 component hole #!p=P<4M
安装孔 mounting hole x_1JQDE 支撑孔 supported hole 8Ml&lfn_8 非支撑孔 unsupported hole y e!Bfz> 导通孔 via <4jQbY; 镀通孔 plated through hole (PTH) zx^]3} 余隙孔 access hole kTQ:k
}%B 盲孔 blind via (hole) 4X7y}F.J 埋孔 buried via hole AoHA+>&U 埋,盲孔 buried blind via n<MMO=+bg 任意层内部导通孔 any layer inner via hole 8?] :> 全部钻孔 all drilled hole [+$l/dag 定位孔 toaling hole
{ZFa
+ 无连接盘孔 landless hole $mm =$. 中间孔 interstitial hole
?7-#iC` 无连接盘导通孔 landless via hole Mq) n=M 引导孔 pilot hole <B
5^ 端接全隙孔 terminal clearomee hole P# 2&?.d\ 准尺寸孔 dimensioned hole [Page] /^96| 在连接盘中导通孔 via-in-pad )gdv! 孔位 hole location 2{s ND 孔密度 hole density gd<8RVA 孔图 hole pattern Cw?AP6f% 钻孔图 drill drawing o;Ijv\Em 装配图assembly drawing RAKQ+Y"nl 参考基准 datum referan A/N*Nc 1) 元件设备 XuJwZN!( []Cvma1\ 三绕组变压器:three-column transformer ThrClnTrans (ohkM`83k 双绕组变压器:double-column transformer DblClmnTrans vl$! To9R" 电容器:Capacitor S-Va_t$ 并联电容器:shunt capacitor vy/U""w` 电抗器:Reactor YVVX7hB 母线:Busbar R#~}ZUk2 输电线:TransmissionLine *lv)9L+0 发电厂:power plant c5P52_@ 断路器:Breaker i=_leC)rl 刀闸(隔离开关):Isolator 7UHqiA`L 分接头:tap , >Y.! 电动机:motor Qv8#{y@U (2) 状态参数 $n `Zvl2 L1BpkB 有功:active power B%6bk. 无功:reactive power j5z, l 电流:current IcL3.(!]l 容量:capacity ,r5<v_ 电压:voltage 9CJUOB>] 档位:tap position vVyO}Q` 有功损耗:reactive loss B0=:A 无功损耗:active loss OdQ>h$ gZ 功率因数:power-factor 7^sU/3z 功率:power ,- ]2s_ 功角:power-angle "W6nW 电压等级:voltage grade *p?b "{_a 空载损耗:no-load loss xy mK| 铁损:iron loss <6/XE@" 铜损:copper loss w GZ(bKyO 空载电流:no-load current {%D
"0* ^ 阻抗:impedance dQM# -t4* 正序阻抗:positive sequence impedance 4:r^6m%% 负序阻抗:negative sequence impedance |UnTd$m 零序阻抗:zero sequence impedance P},S[GaZ 电阻:resistor +^YV>; 电抗:reactance UQ|0Aqwq 电导:conductance _zh}%#6L 电纳:susceptance I#eIm3Y? 无功负载:reactive load 或者QLoad NJqALm!( 有功负载: active load PLoad mk\U wv 遥测:YC(telemetering) |+6Z+-.Hg 遥信:YX dMGu9k~u 励磁电流(转子电流):magnetizing current *(?YgV 定子:stator 7P/j\frW 功角:power-angle yfTnj:Fz 上限:upper limit 0nx
<f>n 下限:lower limit x(}t r27o 并列的:apposable ?;)(O2p 高压: high voltage 1+eC'&@Xjt 低压:low voltage 74gU4T 中压:middle voltage gp-wlu4 电力系统 power system #PXl*~PrQ/ 发电机 generator |Q9S$l] 励磁 excitation Xz]}cRQ[ 励磁器 excitor DDAqgx 电压 voltage YD@V2gK 电流 current hph 3kfR 母线 bus Va=0R 变压器 transformer ]?``*{Zqy 升压变压器 step-up transformer +Yi=Wo/ 高压侧 high side q<c).4 输电系统 power transmission system Dj!J 4uD 输电线 transmission line oPa2GW8 固定串联电容补偿fixed series capacitor compensation S\0"G* 稳定 stability U^pe/11)H 电压稳定 voltage stability
IR/0gP 功角稳定 angle stability nWXI*%m5 暂态稳定 transient stability gFDP:I/` 电厂 power plant |lJXI:GG 能量输送 power transfer =Rb, `% 交流 AC 00;=6q]TA 装机容量 installed capacity $6y1';A 电网 power system ;uoH+`pf 落点 drop point ][G<CO`k 开关站 switch station B/5C jHz 双回同杆并架 double-circuit lines on the same tower I*lq0& 变电站 transformer substation ~ S-x-cZ 补偿度 degree of compensation QJ"Bd`wc 高抗 high voltage shunt reactor 2A`EFk7_X 无功补偿 reactive power compensation PI?-gc?[ 故障 fault {xM%3 调节 regulation 6 Dg[b 裕度 magin )3)L 三相故障 three phase fault *39sh[*} 故障切除时间 fault clearing time =z=Guvcn` 极限切除时间 critical clearing time :eIBK 切机 generator triping #mllVQ 高顶值 high limited value %{}Jr` 强行励磁 reinforced excitation ny=CtU!z 线路补偿器 LDC(line drop compensation)
xY!]eLZ)& 机端 generator terminal U Ciq'^, 静态 static (state) -q+Fj;El 动态 dynamic (state) mD )Nh 单机无穷大系统 one machine - infinity bus system PKjA@+ 机端电压控制 AVR R8],}6,;E} 电抗 reactance tY[y? DJ 电阻 resistance m2_&rjGz 功角 power angle q>Q|:g&: 有功(功率) active power RIJBHOa 无功(功率) reactive power " jeJV,% 功率因数 power factor %djx0sy 无功电流 reactive current H<NYm#a" 下降特性 droop characteristics %<
W1y 斜率 slope .Zwn{SMtu 额定 rating RisrU 变比 ratio J| 'T2g 参考值 reference value c89RuI `B~ 电压互感器 PT $iP#8La:Y 分接头 tap *g=*}2 下降率 droop rate MI@ RdXkY 仿真分析 simulation analysis VS}Vl 传递函数 transfer function !4 hs9b 框图 block diagram Aga7X@fV( 受端 receive-side _aDx('
裕度 margin u@gYEx} 同步 synchronization nEGku]pCH{ 失去同步 loss of synchronization +m+HC(Z 阻尼 damping G4RsH/ 摇摆 swing Z2$-},i 保护断路器 circuit breaker w1KQ9H* 电阻:resistance R/b=!< 电抗:reactance (=PnLP 阻抗:impedance yGD0}\!n 电导:conductance ;ib~c, 电纳:susceptance
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