| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 71AYDO --------------------------------------------------- _wb]tE ~g 真空术语 +8?18@obp ><"|>(y 1.标准环境条件 standard ambient condition:
WZ,k][~ 2.气体的标准状态 standard reference conditions forgases: srN7 3.压力(压强)p pressure: +<p&Va# 4.帕斯卡Pa pascal: 0<@['W}G 5.托Torr torr: Pi?G:IF 6.标准大气压atm standard atmosphere: GU/P%c/V 7.毫巴mbar millibar: }2RbX,0l9 8.分压力 partial pressure: EFVZAY"+!; 9.全压力 total pressure: |?^qsnB 10.真空 vacuum: +l)t5Mg\ 11.真空度 degree of vacuum: ub>:dNBN 12.真空区域 ranges of vacuum: aLm~.@Q 13.气体 gas:
Pm2LB<qS 14.非可凝气体 non-condensable gas: ai?J 15.蒸汽vapor: v8 =#1YB; 16.饱和蒸汽压saturation vapor pressure: 9<3}zwJ 17.饱和度degree of saturation: __tA(uA 18.饱和蒸汽saturated vapor: k -R"e 19.未饱和蒸汽unsaturated vapor: j?o6>j 20.分子数密度n,m-3 number density of molecules: V1d#7rP 21.平均自由程ι、λ,m mean free path: RZ{O6~VH 22.碰撞率ψ collision rate: O-p`9(_m 23.体积碰撞率χ volume collision rate: ]C"?xy 24.气体量G quantity of gas: af@a / 25.气体的扩散 diffusion of gas: H"w;~;h 26.扩散系数D diffusion coefficient; diffusivity: = )3\B 27.粘滞流 viscous flow: /2=9i84 28.粘滞系数η viscous factor: T`]%$$1s 29.泊肖叶流 poiseuille flow: '#=n> 30.中间流 intermediate flow: @UdF6:T 31.分子流 molecular flow: d\3 %5Y 32克努曾数 number of knudsen: +(:Qf+: 33.分子泻流 molecular effusion; effusive flow: G/3T0d+- 34.流逸 transpiration: I`IW^eZM 35.热流逸 thermal transpiration: i; ]0>g4 36.分子流率qN molecular flow rate; molecular flux: 2eRk_j] 37.分子流率密度 molecular flow rate density; density of molecular flux: t D
8l0 38.质量流率qm mass flow rare: M'R
] '' 39.流量qG throughput of gas: l{^s4 40.体积流率qV volume flow rate: 6l4= 41.摩尔流率qυ molar flow rate: PY '^:0 42.麦克斯韦速度分布 maxwellian velocity distribution: 29G el 43.传输几率Pc transmission probability: v]Pyz<+ 44.分子流导CN,UN molecular conductance: $u, 6x~> 45.流导C,U conductance: t%^&b'/Z 46.固有流导Ci,Ui intrinsic conductance: a"O;DYh 47.流阻W resistance: =c,7uB 48.吸附 sorption: n;=FD;}j+ 49.表面吸附 adsorption: U&*%KPy` 50.物理吸附physisorption: E+<GsN] 51.化学吸附 chemisorption: St!0MdCH 52.吸收absorption: ^K J#dT 53.适应系数α accommodation factor: |[#Qk 4Ttf 54.入射率υ impingement rate: vY.VFEP/ 55.凝结率condensation rate: =6\^F i 56.粘着率 sticking rate: JURu>-i 57.粘着几率Ps sticking probability: +{;wOQ. 58.滞留时间τ residence time: $A,YQH+ 59.迁移 migration: jp4-w( 60.解吸 desorption: /L(}VJg- 61.去气 degassing: ()Wu_Q 62.放气 outgassing: c]U+6JH 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: |XQ_4{ 64.蒸发率 evaporation rate: o>+ mw| { 65.渗透 permeation: +CSv@ />3 66.渗透率φ permeability: gWj r|m< 67.渗透系数P permeability coefficient ;C1#[U1Uy 2. 1.真空泵 vacuum pumps #Q=c.AL{ 1-1.容积真空泵 positive displacement pump: a0A=R5_ ⑴.气镇真空泵 gas ballast vacuum pump: !^NZp%Yd ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: wXnVQ-6H ⑶.干封真空泵 dry-sealed vacuum pump: F3o"ETle ⑷.往复真空泵 piston vacuum pump: 8[AU`F8W ⑸.液环真空泵 liquid ring vacuum pump: `?l
/HUw ⑹.旋片真空泵 sliding vane rotary vacuum pump: Cq<Lj ⑺.定片真空泵 rotary piston vacuum pump: 2(\PsN w! ⑻.滑阀真空泵 rotary plunger vacuum pump: }C["'tLX ⑼.余摆线真空泵 trochoidal vacuum pump: :nl,Ac ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: jHHCJOHB8 ⑾.罗茨真空泵 roots vacuum pump: eAP
8! 1-2.动量传输泵 kinetic vacuum pump: ='1hvv/ ⑴.牵引分子泵molecular drag pump: c}),yQ|!: ⑵.涡轮分子泵turbo molecular pump: I!kR:Z ⑶.喷射真空泵ejector vacuum pump: Hc|cA(9sh9 ⑷.液体喷射真空泵liquid jet vacuum pump: /D|q-`*K ⑸.气体喷射真空泵gas jet vacuum pump: [x=(:soEqC ⑹.蒸汽喷射真空泵vapor jet vacuum pump : >e.KD)qA ⑺.扩散泵diffusion pump : w03Ur4>T ⑻.自净化扩散泵self purifying diffusion pump: b-<@3N.9] ⑼.分馏扩散泵 fractionating diffusion pump : bJ6C7-w:wa ⑽.扩散喷射泵diffusion ejector pump : e~'z;%O~ ⑾.离子传输泵ion transfer pump: B2LXF3#/ 1-3.捕集真空泵 entrapment vacuum pump: g;[t1~oF ⑴吸附泵adsorption pump: 1.8"N&s ⑵.吸气剂泵 getter pump: 'T qF}a7 ⑶.升华(蒸发)泵 sublimation (evaporation)pump : Xnh&Kyz`v ⑷.吸气剂离子泵getter ion pump:
- 3PLP$P ⑸.蒸发离子泵 evaporation ion pump: _):@C:6 ⑹.溅射离子泵sputter ion pump: pz/W#VN ⑺.低温泵cryopump: %FqQ+0^ \WdSj 2.真空泵零部件 #v~dhx=R 2-1.泵壳 pump case: z_KCG2=5 2-2.入口 inlet: 1BEc" 2-3.出口outlet: Ijz*wq\s; 2-4.旋片(滑片、滑阀)vane; blade : Sj/v: 2-5.排气阀discharge valve: Z1$U[Tsd 2-6.气镇阀gas ballast valve: jRDvVV/-wr 2-7.膨胀室expansion chamber: o>yXEg 2-8.压缩室compression chamber: k*,+ag*j 2-9.真空泵油 vacuum pump oil: {+{p. 2-10.泵液 pump fluid: %`lJA W[ 2-11.喷嘴 nozzle: )~nieQEZQ 2-13.喷嘴扩张率nozzle expansion rate: DNqC*IvuzM 2-14.喷嘴间隙面积 nozzle clearance area : kj4=Q\Rfm 2-15.喷嘴间隙nozzle clearance: (@^ySiU 2-16.射流jet: ?X\.O-=4X 2-17.扩散器diffuser: r>*+d|c4 2-18.扩散器喉部diffuser thoat: y[AB,Dd 2-19.蒸汽导管vapor tube(pipe;chimney): SH8zkAA7u} 2-20.喷嘴组件nozzle assembly: v7#|% 2-21.下裙skirt: a{JO8<dlm cuy9QBB
: 3.附件 tW-[.Y -M, 3-1阱trap: x`I Wo:j ⑴.冷阱 cold trap: }ksp(.}G ⑵.吸附阱sorption trap: q j9q ⑶.离子阱ion trap: WMWMb3 ⑷.冷冻升华阱 cryosublimation trap: @}{uibLD\ 3-2.挡板baffle: 9^Web~yi# 3-3.油分离器oil separator: 5.yiNWh 3-4.油净化器oil purifier: )4:]gx#cr 3-5.冷凝器condenser: o"A)t= <X& fs*x& 4.泵按工作分类 dmLx $8 4-1.主泵main pump: gnxD'1_ 4-2.粗抽泵roughing vacuum pump: u.?jW vcv 4-3.前级真空泵backing vacuum pump: 4"!kCUB 4-4.粗(低)真空泵 roughing(low)vacuum pump: T
7qHw!) 4-5.维持真空泵holding vacuum pump: A+4Kj~`! 4-6.高真空泵high vacuum pump: Lh.-*H 4-7.超高真空泵ultra-high vacuum pump: l2dj GZk 4-8.增压真空泵booster vacuum pump: Y}Y~?kE>M| Q%J,:J 5.真空泵特性 {&B0kjf 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: El
:%\hGy 5-2.真空泵的抽气量Q throughput of vacuum pump:。 s&$e}yxVO 5-3.起动压力starting pressure: `f~$h?}3-@ 5-4.前级压力 backing pressure : P7/Xh3 5-5.临界前级压力 critical backing pressure: bF+j%= 5-6.最大前级压力maximum backing pressure: Pv\8 \,B9 5-7.最大工作压力maximum working pressure: m^TN6/]) 5-8.真空泵的极限压力ultimate pressure of a pump: &_hEM~{ 5-9.压缩比compression ratio: aX|(%1r 5-10.何氏系数Ho coefficient: a+a6P5kJ 5-11.抽速系数speed factor: b+hN\/*] 5-12.气体的反扩散back-diffusion of gas: ~.0'v [N 5-13.泵液返流back-streaming of pump fluid: R1<$VR 5-14.返流率back-streaming rate 1cRF0MI 5-15.返迁移back-migration: YmjA!n 5-16.爆腾bumping: G8/q&6f_ 5-17.水蒸气允许量qm water vapor tolerable load: I,)\506 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: X{ 6a 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 8.I3%u 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ?<8c 3. 1.一般术语 e L}X(). 1-1.压力计pressure gauge: UA]fKi 1-2.真空计vacuum gauge: g)|vS>^~ ⑴.规头(规管)gauge head: Rr[Wka9[ ⑵.裸规nude gauge : Ip)u6We>I ⑶.真空计控制单元gauge control unit : v'^}zO ⑷.真空计指示单元gauge indicating unit : 8IBr#+0 <X1lq9 lW 2.真空计一般分类 ozl!vf# kv 2-1.压差式真空计differential vacuum gauge: &%qDi_UD 2-2.绝对真空计 absolute vacuum gauge: X(3| (1;sV 2-3.全压真空计total pressure vacuum gauge: S'NLj( 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: Ck"db30. 2-5.相对真空计relative vacuum gauge : D<<q5gG {9x>@p/ 3.真空计特性 r
)_*MPY 3-1.真空计测量范围pressure range of vacuum gauge: qK9A
/Mc 3-2.灵敏度系数sensitivity coefficient: .jtv Hr}U 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): bQwG"N 3-5.规管光电流photon current of vacuum gauge head: kp}[nehF 3-6.等效氮压力equivalent nitrogen pressure : z5Tsu1c 3-7.X射线极限值 X-ray limit: *rHz/& , 3-8.逆X射线效应anti X-ray effect: 6iF&!Fd>J 3-9.布利尔斯效应blears effect: U|\ .)h= z1^fG) 4.全压真空计 niW"o-} 4-1.液位压力计liquid level manometer: /{R. 4-2.弹性元件真空计elastic element vacuum gauge: 6?C';1 4-3.压缩式真空计compression gauge: "Jg.)1Jw 4-4.压力天平pressure balance: V`W '] 4-5.粘滞性真空计viscosity gauge :
&1&OXm$ 4-6.热传导真空计thermal conductivity vacuum gauge : W3\E;C-g0 4-7.热分子真空计thermo-molecular gauge: 4m"0R\ 4-8.电离真空计ionization vacuum gauge: n"D` = 4-9.放射性电离真空计radioactive ionization gauge: hlze]d?z 4-10.冷阴极电离真空计cold cathode ionization gauge: X!'C'3 X 4-11.潘宁真空计penning gauge: 8"-=+w.CZ 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 84WcaH 4-13.放电管指示器discharge tube indicator: XuHR 4-14.热阴极电离真空计hot cathode ionization gauge: Q.h.d)) 4-15.三极管式真空计triode gauge: Fu5Y<*x 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: g0}jE%) 4-17.B-A型电离真空计Bayard-Alpert gauge: lcjOBu 4-18.调制型电离真空计modulator gauge: 8~s0%%{,M 4-19.抑制型电离真空计suppressor gauge: ]FIIs58IM 4-20.分离型电离真空计extractor gauge: 1EC;t1.7 4-21.弯注型电离真空计bent beam gauge: A*81}P_ 4-22.弹道型电离真空计 orbitron gauge : o^*: 4-23.热阴极磁控管真空计hot cathode magnetron gauge: udBIEW,` vD?D]8.F~Q 5.分压真空计(分压分析器) "Y&
5-1.射频质谱仪radio frequency mass spectrometer: M"/Jn[ 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: |O oczYf 5-3.单极质谱仪momopole mass spectrometer: %Q &'] 5-4.双聚焦质谱仪double focusing mass spectrometer: e.%I#rNI 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: -o`K/f}d 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: vR2);ywX 5-7.回旋质谱仪omegatron mass spectrometer: rwP)TJh" 5-8.飞行时间质谱仪time of flight mass spectrometer: Qzo -Yw`= c ^.^5@ 6.真空计校准 <g;,or#$ 6-1.标准真空计reference gauges: 8AY;WL:; 6-2.校准系统system of calibration: ZeU){CB 6-3.校准系数K calibration coefficient: xE^G*<mj: 6-4.压缩计法meleod gauge method: T#E$sZ 6-5.膨胀法expansion method: |)Dm.)/0) 6-6.流导法flow method: t!6uz 4. 1.真空系统vacuum system <2&qIvHL 1-1.真空机组pump system: :(m, 06K 1-2.有油真空机组pump system used oil : fDplYn# 1-3.无油真空机组oil free pump system fKqr$59> 1-4.连续处理真空设备continuous treatment vacuum plant: YI"!&a'yj 1-5.闸门式真空系统vacuum system with an air-lock: 0Ui_Trlc 1-6.压差真空系统differentially pumped vacuum system: Us'JMZ~ 1-7.进气系统gas admittance system: <PuY"-`/Oc `Ds=a`^b 2.真空系统特性参量 jdu6P+_8n 2-1.抽气装置的抽速volume flow rate of a pumping unit : rg
k1.0U0 2-2.抽气装置的抽气量throughput of a pumping unit : b+J|yM<` 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: f77W{T4 2-4.真空系统的漏气速率leak throughput of a vacuum system: 24? _k]Y 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: i7r)9^y 2-6.极限压力ultimate pressure: )$9wKk\F 2-7.残余压力residual pressure: ('C)S)98C 2-8.残余气体谱residual gas spectrum: ,\P|%yv 2-9.基础压力base pressure: gWa0x- 2-10.工作压力working pressure: xt pY* 2-11.粗抽时间roughing time: |UWIV 2-12.抽气时间pump-down time: JmK
)Y# A 2-13.真空系统时间常数time constant of a vacuum system: \y=28KKc:c 2-14.真空系统进气时间venting time: A>upT' Ib{l$# 3.真空容器 #t(/wa4 3-1.真空容器;真空室vacuum chamber:
*~U.36 3-2.封离真空装置sealed vacuum device: w`f66*@Q1 3-3.真空钟罩vacuum bell jar: P[q>;Fx* 3-4.真空容器底板vacuum base plate: wZ\93W-} 3-5.真空岐管vacuum manifold: XIbxi 3-6.前级真空容器(贮气罐)backing reservoir: $3>Rw/, 3-7.真空保护层outer chamber: UR_Ty59 3-8.真空闸室vacuum air lock: .`+~mQ
Wn 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: wUr(i * OhCdBO 4.真空封接和真空引入线 a]V8F&)g# 4-1.永久性真空封接permanent seal : <_|@~^u 4.2.玻璃分级过渡封接graded seal : !wpK
+.D 4-3.压缩玻璃金属封接compression glass-to-metal seal: i*mU<:t 4-4.匹配式玻璃金属封接matched glass-to-metal seal: p qpsa' 4-5.陶瓷金属封接ceramic-to-metal seal: |mn} wNUN] 4-6.半永久性真空封接semi-permanent seal : \M@IKE 4-7.可拆卸的真空封接demountable joint: PDA9.b<q0 4-8.液体真空封接liquid seal [u K,.G 4-9.熔融金属真空封接molten metal seal: _$@fCo0 4-10.研磨面搭接封接ground and lapped seal: JJWPte/ 4-11.真空法兰连接vacuum flange connection: {-m e;ayk 4-12.真空密封垫vacuum-tight gasket: zNKB'hsK 4-13.真空密封圈ring gasket: T$2A2gb` 4-14.真空平密封垫flat gasket: %gFIu.c 4-15.真空引入线feedthrough leadthrough: WR#h~N
9c 4-16.真空轴密封shaft seal: ,pTZ/#vP# 4-17.真空窗vacuum window: tyW[i8)O} 4-18.观察窗viewing window: GiuE\J9i i>h3UIx\ 5.真空阀门 UF5_be,D 5-1.真空阀门的特性characteristic of vacuum valves: ZZ^A&%E(a ⑴.真空阀门的流导conductance of vacuum valves: yQj J-g(. ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: FO_}9 <s 5-2.真空调节阀regulating valve: y4p"LD5%^ 5-3.微调阀 micro-adjustable valve: |z_Dw$-xm 5-4.充气阀charge valve: 0Q7<;'m 5-5.进气阀gas admittance valve: G5t7KI 5-6.真空截止阀break valve: 8w[O% 5-7.前级真空阀backing valve: ETL7|C" 5-8.旁通阀 by-pass valve: Eb9h9sjv 5-9.主真空阀main vacuum valve: !=.y[Db= 5-10.低真空阀low vacuum valve: PZV>A!7C8n 5-11.高真空阀high vacuum valve: j1{`}\e 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: CckfoJ 9 5-13.手动阀manually operated valve: &XCd2 5-14.气动阀pneumatically operated valve: >E4,zs@7t 5-15.电磁阀electromagnetically operated valve: Lc}hjK 5-16.电动阀valve with electrically motorized operation: wn_
>Vi1 5-17.挡板阀baffle valve: 6q>iPK Jt 5-18.翻板阀flap valve: &4WA/'>R 5-19.插板阀gate valve: Pz2Q]}(w 5-20.蝶阀butterfly valve: |/l] ]+ UIf#Gy|l 6.真空管路 WQVU 82b* 6-1.粗抽管路roughing line: Rh"O$K~ 6-2.前级真空管路backing line: GR*sk#{ 6-3.旁通管路;By-Pass管路 by-pass line: ~YW;' 6-4.抽气封口接头pumping stem: h+H+>,N8` 6-5.真空限流件limiting conductance: 8(K:2 6-6.过滤器filter: Z P|k3
5. 1.一般术语 |*zgX]-+; 1-1真空镀膜vacuum coating: O_2o/ 1-2基片substrate: 58#nYt 1-3试验基片testing substrate: Z D"*fr 1-4镀膜材料coating material: [>p!*%m 1-5蒸发材料evaporation material: ;2g.X(Ra 1-6溅射材料sputtering material: _8 K|2$X 1-7膜层材料(膜层材质)film material: Nes|4Z< 1-8蒸发速率evaporation rate: ynMYf 1-9溅射速率sputtering rate: 9$X" D 1-10沉积速率deposition rate: KV;q}EyG 1-11镀膜角度coating angle: {_\dwe9
'Bt!X^ 2.工艺 oaq,4FT 2-1真空蒸膜vacuum evaporation coating: [Pp#r&4H (1).同时蒸发simultaneous evaporation: _/P;`@ (2).蒸发场蒸发evaporation field evaporation: & }j;SK5 (3).反应性真空蒸发reactive vacuum evaporation: J7{D6@yLS (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: A~>B?Wijqg (5).直接加热的蒸发direct heating evaporation: hUvA;E(qD (6).感应加热蒸发induced heating evaporation: .e3@fq (7).电子束蒸发electron beam evaporation: =<9Mv+Ry8 (8).激光束蒸发laser beam evaporation: 7vPGb:y (9).间接加热的蒸发indirect heating evaporation: SbL7e#!! (10).闪蒸flash evaportion: &*O'qOO<2 2-2真空溅射vacuum sputtering: J#@+1 Nt (1).反应性真空溅射 reactive vacuum sputtering: G2!<C-T{2 (2).偏压溅射bias sputtering: pQ7elv] (3).直流二级溅射direct current diode sputtering: N|)e {|k (4).非对称性交流溅射asymmtric alternate current sputtering: @zw&-b:qI (5).高频二极溅射high frequency diode sputtering: h|'|n/F (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: @ kv~2m (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: uInI{> (8).离子束溅射ion beam sputtering: mhU=^/X (9).辉光放电清洗glow discharge cleaning: .sj/Lw} 2-3物理气相沉积PVD physical vapor deposition: NzhWGr_x' 2-4化学气相沉积CVD chemical vapor deposition: p_n$}z 2-5磁控溅射magnetron sputtering: dQp>z%L) 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: Q8l vwip 2-7空心阴极离子镀HCD hollow cathode discharge deposition: &y73^"% 2-8电弧离子镀arc discharge deposition: UHfE.mTjM `]19}GK~xo 3.专用部件 "#8^":,4 3-1镀膜室coating chamber: +B+cN[d 3-2蒸发器装置evaporator device: ;cL+=! 3-3蒸发器evaporator:
ca0vN^Ji 3-4直接加热式蒸发器evaporator by direct heat: {s6#h #U 3-5间接加热式蒸发器evaporator by indirect heat: W>{&"
5 3-7溅射装置sputtering device: %O[1yZh
\ 3-8靶target: <]oPr1 3-10时控挡板timing shutter: t^6ams$ 3-11掩膜mask: Ha ZV7 3-12基片支架substrate holder: WyQ8}]1b 3-13夹紧装置clamp: "=40%j0 3-14换向装置reversing device: M,{; xf 3-15基片加热装置substrate heating device: >U4bK^/Bp 3-16基片冷却装置substrate colding device: I~"l9Jc!" W S9:*YH 4.真空镀膜设备 Q>w)b]d~c 4-1真空镀膜设备vacuum coating plant: oz3!%' (1).真空蒸发镀膜设备vacuum evaporation coating plant: MD4mh2 (2).真空溅射镀膜设备vacuum sputtering coating plant: e+2lus,u6t 4-2连续镀膜设备continuous coating plant: 67Tu8I/r 4-3半连续镀膜设备semi- continuous coating plant 7n;a_Z0s$ 6. 1.漏孔 ;U tEHvE* 1-1漏孔leaks: RJT55Rv{ 1-2通道漏孔channel leak: l:#'i`; 1-3薄膜漏孔membrane leak: 'rfsrZ? 1-4分子漏孔molecular leak: O7&OCo|b%> 1-5粘滞漏孔vixcous leak: f
e^s`dsG 1-6校准漏孔calibrated leak: 3XbFg%8YG 1-7标准漏孔reference leak : [P)](8nR[ 1-8虚漏virtual leak: eIPk$j{e 1-9漏率leak rate: NLgeBLB 1-10标准空气漏率standard air leak rate: 8|hi2Qeu,c 1-11等值标准空气漏率equivalent standard air leak rate: %$_?%X0=t 1-12探索(示漏)气体: NY[48H .Z 17X_ 2.本底 P=9sP:[f6 2-1本底background: K TE*Du 2-2探索气体本底search gas background : \naG 2-3漂移drift: `I|Y7GoUO 2-4噪声noise: zRau/1Y0 t#]VR7] 3.检漏仪 A>:31C 3-1检漏仪leak detector: 7d_"4;K) 3-2高频火花检漏仪H.F. spark leak detector: = j
l(Q 3-3卤素检漏仪halide leak detector: OXoEA a 3-4氦质谱检漏仪helium mass spectrometer leak detector: +fMW B 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: R3BK\kf& Au )%w 4.检漏 6H|T ) 4-1气泡检漏leak detection by bubbles: ZU9Rvtb KB 4-2氨检漏leak detection by ammonia: UyNP:q: 4-3升压检漏leak detection of rise pressure: kY~yA2*G 4-4放射性同位素检漏radioactive isotope leak detection: <%`z:G3 4-5荧光检漏fluorescence leak detection $@dPIq4o;} 7. 1.一般术语 SQw"mO 1-1真空干燥vacuum drying: Z>'hNj)ju 1-2冷冻干燥freeze drying : ].gC9@C:$i 1-3物料material: `
-<S13 1-4待干燥物料material to be dried: !6s]p%{V 1-5干燥物料dried material : 6SSrkj }U 1-6湿气moisture;humidity: rN {5^+w 1-7自由湿气free moisture: xz/G$7q7 1-8结合湿气bound moisture: fvDcE]_%H 1-9分湿气partial moisture: -r{]9v2j 1-10含湿量moisture content: Sa6YqOel@ 1-11初始含湿量initial moisture content: 6
)Qe*S 1-12最终含湿量final residual moisture: 3\P/4GK) 1-13湿度degree of moisture ,degree of humidity : /Dk`? 1-14干燥物质dry matter : )q%DRLD'G 1-15干燥物质含量content of dry matter: O<0-`=W,a %vrUk;<35 2.干燥工艺 16N`xw+{ 2-1干燥阶段stages of drying : 79M`?xm (1).预干燥preliminary dry: JG'&anbm (2).一次干燥(广义)primary drying(in general): ~eGtoEY (3).一次干燥(冷冻干燥)primary drying(freeze-drying): VDv>I 2% (4).二次干燥secondary drying: !=+hU/e 2-2.(1).接触干燥contact drying: {Hxziyv~Y( (2).辐射干燥 drying by radiation : M5LqZyY (3).微波干燥microwave drying: SjU0Xb)[ (4).气相干燥vapor phase drying: rAQ3x0 (5).静态干燥static drying: d!q)FRzi (6).动态干燥dynamic drying: Z9PG7h 2-3干燥时间drying time: mz .uK2l{ 2-4停留时间length of stay(in the drying chamber): )XD$YI 2-5循环时间cycle time: }nNCgH 2-6干燥率 dessication ratio : =ThacZHb8 2-7去湿速率mass flow rate of humidity: MqswYK-s 2-8单位面积去湿速率mass flow rate of humidity per surface area: )G9,5[ 2-9干燥速度 drying speed : :WN*wd 2-10干燥过程drying process: [Q20c<, 2-11加热温度heating temperature: {UEZ:a 2-12干燥温度temperature of the material being dried : N%QVkuCbM 2-13干燥损失loss of material during the drying process : qznd'^[ 2-14飞尘lift off (particles):
-B#>Jn#F 2-15堆层厚度thickness of the material: V8J!8=2 +Tp>3Jh2 3.冷冻干燥 ob>2SU[Y 3-1冷冻freezing: ?bK^IHh (1).静态冷冻static freezing: z4c{W~}` (2).动态冷冻dynamic freezing: UR.l*+<W7 (3).离心冷冻centrifugal freezing: Ps7Bt(/ (4).滚动冷冻shell freezing: L[ 7Aa"R (5).旋转冷冻spin-freezing: @{UtS2L (6).真空旋转冷冻vacuum spin-freezing: rM(2RI4O`0 (7).喷雾冷冻spray freezing: Yf,U2A\ (8).气流冷冻air blast freezing: |<1 3-2冷冻速率rate of freezing: FFqqAT5 3-3冷冻物料frozen material: }Z}4_/E 3-4冰核ice core: rQPV@J]: 3-5干燥物料外壳envelope of dried matter: dJd(m&.|N 3-6升华表面sublimation front: @phb5 3-7融化位置freezer burn: cYp]zn+6 D[ (A`!) 4.真空干燥设备;真空冷冻干燥设备 ibskce{H 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ;?0k> 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: q~:k[@`. 4-3加热表面heating surface: ,XNz.+Ov 4-4物品装载面shelf : VKp4FiI6 4-5干燥器的处理能力throughput (of the vacuum drying chamber): 0SLS;s.GX 4-6单位面积干燥器处理能力throughput per shelf area: Vi1=
E]) 4-7冰冷凝器ice condenser: D^9r#& 4-8冰冷凝器的负载load of the ice condenser: WfE,U=e* 4-9冰冷凝器的额定负载rated load of the ice condenser ns,qj}# 8. 1.一般术语 %JC-%TRWK 1-1试样sample : li?RymlF (1).表面层surface layer: }_L,Xg:I (2).真实表面true surface: h*9s^`9) (3).有效表面积effective surface area: X8 (,
,>_ (4).宏观表面;几何表面macroscopic surface area; geometric surface area: w{;esU (5).表面粒子密度surface particle density: 48 `k"Uy (6).单分子层monolayer: jN43vHm\Y9 (7).表面单分子层粒子密度monolayer density: L<**J\=7M (8).覆盖系数coverage ratio: X!%CYmIRb 1-2激发excitation: [vs5e3B) (1).一次粒子primary particle: EpCsJ08K (2).一次粒子通量primary particle flux: L^zF@n^5A (3).一次粒子通量密度density of primary particle flux: h}o7/p (4).一次粒子负荷primary particle load: hWujio/h (5).一次粒子积分负荷integral load of primary particle: MxO0# (6).一次粒子的入射能量energy of the incident primary particle: 5&\% (7).激发体积excited volume: 8QN#PaY (8).激发面积excited area: as?~N/} (9).激发深度excited death: syYe0~ (10).二次粒子secondary particles: H_<X\( (11).二次粒子通量secondary particle flux: ' s6SKjZS (12).二次粒子发射能energy of the emitted secondary particles: #PpmR_IX (13).发射体积emitting volume: nDvj*lZF (14).发射面积emitting area: < | |