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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 CE-ySIa  
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真空术语 9kL'"0c  
Ji4c8*&Jpc  
1.标准环境条件 standard ambient condition: XP *pYN  
2.气体的标准状态 standard reference conditions forgases: /E$"\md  
3.压力(压强)p pressure: q.FgX  
4.帕斯卡Pa pascal: 2]C`S,)  
5.托Torr torr: aM5zYj`pW  
6.标准大气压atm standard atmosphere: ChF:N0w? p  
7.毫巴mbar millibar: S{{D G  
8.分压力 partial pressure: +Sv`23G@  
9.全压力 total pressure: qlD+[`=b  
10.真空 vacuum: XWZ *{/u  
11.真空度 degree of vacuum: } WY7!Y  
12.真空区域 ranges of vacuum: *O,\/aQ+  
13.气体 gas: y562g`"U  
14.非可凝气体 non-condensable gas: :X Er{X  
15.蒸汽vapor: CUfD[un2D  
16.饱和蒸汽压saturation vapor pressure: YuSe~~F)j  
17.饱和度degree of saturation: YUJlQ2e(  
18.饱和蒸汽saturated vapor: QgO@oV*S  
19.未饱和蒸汽unsaturated vapor: 0DhF3]  
20.分子数密度n,m-3 number density of molecules: +Tc<|-qQn  
21.平均自由程ι、λ,m mean free path: ! L:!X88  
22.碰撞率ψ collision rate: l;}D| 6+_W  
23.体积碰撞率χ volume collision rate: *,{. oO9#  
24.气体量G quantity of gas: xekW-=#a7-  
25.气体的扩散 diffusion of gas: ;!DUNzl  
26.扩散系数D diffusion coefficient; diffusivity: iq-n(Rfw~  
27.粘滞流 viscous flow: q0{KYWOvk  
28.粘滞系数η viscous factor: (h7 rW3  
29.泊肖叶流 poiseuille flow: T5.1qrL  
30.中间流 intermediate flow: _%w-y(Sqn  
31.分子流 molecular flow: KL,=Z&.<=  
32克努曾数 number of knudsen: >|WNsjkU%  
33.分子泻流 molecular effusion; effusive flow: RoSh|$JF  
34.流逸 transpiration: 5_ -YF~  
35.热流逸 thermal transpiration: 7'Y 3T[  
36.分子流率qN molecular flow rate; molecular flux: i%+cPQ^o  
37.分子流率密度 molecular flow rate density; density of molecular flux: CdlE"Ye  
38.质量流率qm mass flow rare: o $oW-U  
39.流量qG throughput of gas: LOpn PH`  
40.体积流率qV volume flow rate: 6|wi Zw  
41.摩尔流率qυ molar flow rate: ;0O3b  
42.麦克斯韦速度分布 maxwellian velocity distribution: p#hs8xz  
43.传输几率Pc transmission probability: 8<t6_* f  
44.分子流导CN,UN molecular conductance: xK9"t;!C&  
45.流导C,U conductance: )a.Y$![  
46.固有流导Ci,Ui intrinsic conductance: _Sy-&}c+ +  
47.流阻W resistance: Z0g3> iItM  
48.吸附 sorption: W_9-JM(r  
49.表面吸附 adsorption: \~d|MP}"F:  
50.物理吸附physisorption: v~e@:7d i  
51.化学吸附 chemisorption: 5:/ zbt\C  
52.吸收absorption: s$css{(ek  
53.适应系数α accommodation factor: r-v ;A  
54.入射率υ impingement rate: I-oI,c%+  
55.凝结率condensation rate: rlk0t159  
56.粘着率 sticking rate: Wk"4mq  
57.粘着几率Ps sticking probability: 2s>dlz  
58.滞留时间τ residence time: -;&aU;k  
59.迁移 migration: }GJIM|7^  
60.解吸 desorption: U*`7   
61.去气 degassing: 0b+OB pqN  
62.放气 outgassing: 2Un~ Iy  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 2ikY.Xi6  
64.蒸发率 evaporation rate: !c[(#g  
65.渗透 permeation: G[n^SEY!  
66.渗透率φ permeability: |F[E h ~  
67.渗透系数P permeability coefficient +gqtW8 6  
2.   1.真空泵 vacuum pumps >;kCcfS3ct  
1-1.容积真空泵 positive displacement pump: /KjRB_5~q}  
⑴.气镇真空泵 gas ballast vacuum pump: U1bhd}MoR  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: i71 ,  
⑶.干封真空泵 dry-sealed vacuum pump: (iM"ug2  
⑷.往复真空泵 piston vacuum pump: m6tbN/EJZ  
⑸.液环真空泵 liquid ring vacuum pump: {.pR$]6B"+  
⑹.旋片真空泵 sliding vane rotary vacuum pump: jOj`S%7  
⑺.定片真空泵 rotary piston vacuum pump: Yh)yp?  
⑻.滑阀真空泵 rotary plunger vacuum pump: $Nvt:X_  
⑼.余摆线真空泵 trochoidal vacuum pump: PhW< )B]  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: RQ}(}|1+\  
⑾.罗茨真空泵 roots vacuum pump: #Ki(9oWd  
1-2.动量传输泵 kinetic vacuum pump: n0g,r/  
⑴.牵引分子泵molecular drag pump: HMGby2^+  
⑵.涡轮分子泵turbo molecular pump: w^Qb9vTa8  
⑶.喷射真空泵ejector vacuum pump: O^ZOc0<  
⑷.液体喷射真空泵liquid jet vacuum pump: a3e<< <Z>R  
⑸.气体喷射真空泵gas jet vacuum pump: \PU3{_G]  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : rStfluPL  
⑺.扩散泵diffusion pump : 0yr=$F(]s  
⑻.自净化扩散泵self purifying diffusion pump: o:B?gDM  
⑼.分馏扩散泵 fractionating diffusion pump : ss63/   
⑽.扩散喷射泵diffusion ejector pump : V{@ xhW0  
⑾.离子传输泵ion transfer pump: XlIRedZ{  
1-3.捕集真空泵 entrapment vacuum pump: Ug02G  
⑴吸附泵adsorption pump: c=]qUhnH  
⑵.吸气剂泵 getter pump: `RDl k  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : N p9N#m?  
⑷.吸气剂离子泵getter ion pump: z2Sp  
⑸.蒸发离子泵 evaporation ion pump: 7^,C=2  
⑹.溅射离子泵sputter ion pump: ktLXL;~X  
⑺.低温泵cryopump: +^tq?PfE  
yL/EIN  
2.真空泵零部件 >yFEUD:  
2-1.泵壳 pump case: d2lOx|jt  
2-2.入口 inlet: M,@\*qlEJ  
2-3.出口outlet: H?98^y7  
2-4.旋片(滑片、滑阀)vane; blade : n B4)%  
2-5.排气阀discharge valve: S!Ue+jW  
2-6.气镇阀gas ballast valve: sW!pMkd_  
2-7.膨胀室expansion chamber: U;Z6o1G  
2-8.压缩室compression chamber: wLwAtjW)  
2-9.真空泵油 vacuum pump oil: Li~(kw3  
2-10.泵液 pump fluid: 54~`8f  
2-11.喷嘴 nozzle:  ^ZnlWZ@r  
2-13.喷嘴扩张率nozzle expansion rate: <![tn#_  
2-14.喷嘴间隙面积 nozzle clearance area : YVt#( jl  
2-15.喷嘴间隙nozzle clearance: WmU4~.  
2-16.射流jet: dA >=#/"  
2-17.扩散器diffuser: wuE]ju<  
2-18.扩散器喉部diffuser thoat: (\m4o   
2-19.蒸汽导管vapor tube(pipe;chimney): [.4R ,[U  
2-20.喷嘴组件nozzle assembly: 4DI.R K9  
2-21.下裙skirt: eq.K77El{J  
N^7Qn*qt[  
3.附件 (7BG~T  
3-1阱trap: S|!)_RL  
⑴.冷阱 cold trap: MMCac6;Aea  
⑵.吸附阱sorption trap: owL>w  
⑶.离子阱ion trap: ULc oti=,  
⑷.冷冻升华阱 cryosublimation trap: jn vJ`7zFP  
3-2.挡板baffle: >Ia{ZbQV  
3-3.油分离器oil separator: gQaBQq9  
3-4.油净化器oil purifier: =ic"K6mhq  
3-5.冷凝器condenser: K  +n  
V5sH:A7GJ  
4.泵按工作分类 h|OqM:J;  
4-1.主泵main pump: G)5w_^&%  
4-2.粗抽泵roughing vacuum pump: `|K30hRp:  
4-3.前级真空泵backing vacuum pump: O{Bll;C  
4-4.粗(低)真空泵 roughing(low)vacuum pump: B:S/ ?v  
4-5.维持真空泵holding vacuum pump: =H&{*Ja  
4-6.高真空泵high vacuum pump: j`jF{k b  
4-7.超高真空泵ultra-high vacuum pump: X`bN/sI  
4-8.增压真空泵booster vacuum pump: f)w>V3~w,  
N,U<.{T=A  
5.真空泵特性 rlG& wX  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: L rV`P)$T  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 rT$J0"*=  
5-3.起动压力starting pressure: 4_qd5K+n"  
5-4.前级压力 backing pressure : *,q W9z  
5-5.临界前级压力 critical backing pressure: `Wq4k>J}*  
5-6.最大前级压力maximum backing pressure: l/9V59Fv9  
5-7.最大工作压力maximum working pressure: 2)}ic2]pn  
5-8.真空泵的极限压力ultimate pressure of a pump: I^|6gaP|6  
5-9.压缩比compression ratio: y ,][  
5-10.何氏系数Ho coefficient: Ny|2Fcs  
5-11.抽速系数speed factor: l`c&nf6  
5-12.气体的反扩散back-diffusion of gas: YEfa8'7R  
5-13.泵液返流back-streaming of pump fluid: sLiKcR8^  
5-14.返流率back-streaming rate >7%Gd-;l  
5-15.返迁移back-migration: F FHk0!3  
5-16.爆腾bumping: RbB y8ZVM  
5-17.水蒸气允许量qm water vapor tolerable load: [1{#a {4  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: ZL[~[  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: VZ"W_U,  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump db$wKvO1  
3.   1.一般术语 L=Cm0q 3 v  
1-1.压力计pressure gauge: f9v%k'T[  
1-2.真空计vacuum gauge: gBM6{48GF  
⑴.规头(规管)gauge head: *s4h tt  
⑵.裸规nude gauge : 9pAklD4  
⑶.真空计控制单元gauge control unit : }^r=(  
⑷.真空计指示单元gauge indicating unit : mqL&bmT  
I*c B Ha  
2.真空计一般分类 7hAFK  
2-1.压差式真空计differential vacuum gauge: pzcV[E1  
2-2.绝对真空计 absolute vacuum gauge: c%p7?3Ry  
2-3.全压真空计total pressure vacuum gauge: l)y$c}U  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: `I*W}5  
2-5.相对真空计relative vacuum gauge : !GJnYDN  
a1V+doC  
3.真空计特性 /H 3u^  
3-1.真空计测量范围pressure range of vacuum gauge: ^6&?R?y  
3-2.灵敏度系数sensitivity coefficient: v:otR%yt  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Q1tZ]Q.6  
3-5.规管光电流photon current of vacuum gauge head: &k'J5YHm8H  
3-6.等效氮压力equivalent nitrogen pressure : y bWb'+x  
3-7.X射线极限值 X-ray limit: C1=7.dPr  
3-8.逆X射线效应anti X-ray effect:  d+FS  
3-9.布利尔斯效应blears effect: >E*j4gg  
AKW M7fI  
4.全压真空计 V %k #M  
4-1.液位压力计liquid level manometer: uJ:'<dJ  
4-2.弹性元件真空计elastic element vacuum gauge: aju!Aq54G  
4-3.压缩式真空计compression gauge: JP$@*F@t  
4-4.压力天平pressure balance: 6ww4ZH?j  
4-5.粘滞性真空计viscosity gauge : kMD:~ V  
4-6.热传导真空计thermal conductivity vacuum gauge : j ys1Ki  
4-7.热分子真空计thermo-molecular gauge: a<AT;Tc  
4-8.电离真空计ionization vacuum gauge: s^5KFK1  
4-9.放射性电离真空计radioactive ionization gauge: ?-"xP'#  
4-10.冷阴极电离真空计cold cathode ionization gauge: RU} M&&  
4-11.潘宁真空计penning gauge: s)_Xj`Q#  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: cYBv}ylw}R  
4-13.放电管指示器discharge tube indicator: 29:1crzx~  
4-14.热阴极电离真空计hot cathode ionization gauge: _`6fGu& W  
4-15.三极管式真空计triode gauge: /?<tjK' "H  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: MQD%m ;[s  
4-17.B-A型电离真空计Bayard-Alpert gauge: dWR0tS6vR`  
4-18.调制型电离真空计modulator gauge: V&7jd7 2{  
4-19.抑制型电离真空计suppressor gauge: K$>C*?R  
4-20.分离型电离真空计extractor gauge: N>, `l  
4-21.弯注型电离真空计bent beam gauge: ! Jh/M^  
4-22.弹道型电离真空计 orbitron gauge : kpc3l[.A  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: J;Y=o B  
{(mT,}`4  
5.分压真空计(分压分析器) bs-O3w  
5-1.射频质谱仪radio frequency mass spectrometer: f{ZOH<"Lo  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: eWjLP{W  
5-3.单极质谱仪momopole mass spectrometer: wNsAVUjLe  
5-4.双聚焦质谱仪double focusing mass spectrometer: CiE  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Jw%0t'0Zi  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: ^,@!L-<~(b  
5-7.回旋质谱仪omegatron mass spectrometer: FD?!bI4  
5-8.飞行时间质谱仪time of flight mass spectrometer: 6"+/Imb-  
*5( h,s3&  
6.真空计校准 LKtug>Me  
6-1.标准真空计reference gauges: \^<eJf D  
6-2.校准系统system of calibration: *Xh)22~T  
6-3.校准系数K calibration coefficient: unE h  
6-4.压缩计法meleod gauge method: L_fu<W  
6-5.膨胀法expansion method: @ 2r9JqR[=  
6-6.流导法flow method: X+l &MD  
4.   1.真空系统vacuum system U68o"iE  
1-1.真空机组pump system: U\N|hw#f!!  
1-2.有油真空机组pump system used oil : <DG=qP6O  
1-3.无油真空机组oil free pump system 2qEm,x'S  
1-4.连续处理真空设备continuous treatment vacuum plant: o(~QuHOp8>  
1-5.闸门式真空系统vacuum system with an air-lock: d-%!.,F#W  
1-6.压差真空系统differentially pumped vacuum system: J }?F4  
1-7.进气系统gas admittance system: #R_IF&7  
HWe?vz$4"  
2.真空系统特性参量 ka_]s:>+  
2-1.抽气装置的抽速volume flow rate of a pumping unit : )6?(K"T  
2-2.抽气装置的抽气量throughput of a pumping unit : O 0Fw!IQk  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: RS&l68[6  
2-4.真空系统的漏气速率leak throughput of a vacuum system: T7f>u}T  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: FI @!7@  
2-6.极限压力ultimate pressure: w6 C0]vh  
2-7.残余压力residual pressure: >kK;IF9h  
2-8.残余气体谱residual gas spectrum: Kk?P89=*  
2-9.基础压力base pressure: V=!tZ[4z$h  
2-10.工作压力working pressure: 56i9V9{2  
2-11.粗抽时间roughing time: %E q} H  
2-12.抽气时间pump-down time: o!TG8aeb  
2-13.真空系统时间常数time constant of a vacuum system: hL:n9G  
2-14.真空系统进气时间venting time: '1?b?nVo  
]Bo !v*12  
3.真空容器 B%HG7  
3-1.真空容器;真空室vacuum chamber: h-B&m:gD_U  
3-2.封离真空装置sealed vacuum device: ><o dBM-  
3-3.真空钟罩vacuum bell jar: v=4,k G  
3-4.真空容器底板vacuum base plate: C(i1Vx<-  
3-5.真空岐管vacuum manifold: eNN)2-96  
3-6.前级真空容器(贮气罐)backing reservoir: r|rOIAo  
3-7.真空保护层outer chamber: ?nOul}y/  
3-8.真空闸室vacuum air lock: =,B44:`r  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: T;(k  
Wi3:;`>G<p  
4.真空封接和真空引入线 %X(iAoxbj  
4-1.永久性真空封接permanent seal : >"qnuv G  
4.2.玻璃分级过渡封接graded seal : Ps3wg=ni[  
4-3.压缩玻璃金属封接compression glass-to-metal seal: 2CX'J8Sy  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: _97A9wHj  
4-5.陶瓷金属封接ceramic-to-metal seal: t!MGSB~  
4-6.半永久性真空封接semi-permanent seal : @di mZsi1  
4-7.可拆卸的真空封接demountable joint: #QdBI{2  
4-8.液体真空封接liquid seal __Kn 1H{  
4-9.熔融金属真空封接molten metal seal: 8^26g 3  
4-10.研磨面搭接封接ground and lapped seal: 7MXi_V;p<  
4-11.真空法兰连接vacuum flange connection: RJ/4T#b"+  
4-12.真空密封垫vacuum-tight gasket: h$`P|#V&  
4-13.真空密封圈ring gasket: 0Da9,&D  
4-14.真空平密封垫flat gasket: E"p;  
4-15.真空引入线feedthrough leadthrough: 5 rpX"(  
4-16.真空轴密封shaft seal:  5VWyc9Q  
4-17.真空窗vacuum window: k&-SB -  
4-18.观察窗viewing window:  b,] QfC  
G }B)bM2  
5.真空阀门 P@ Oq'y[  
5-1.真空阀门的特性characteristic of vacuum valves: "F nH>g-  
⑴.真空阀门的流导conductance of vacuum valves: Y%AVC9(  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: x9UF  
5-2.真空调节阀regulating valve: 3ZO\P u  
5-3.微调阀 micro-adjustable valve: ,tt]C~\u  
5-4.充气阀charge valve: s+{)K  
5-5.进气阀gas admittance valve: nH*JR  
5-6.真空截止阀break valve: L+s3@ C;b  
5-7.前级真空阀backing valve: *c<=IcA  
5-8.旁通阀 by-pass valve: 9ohaU  
5-9.主真空阀main vacuum valve: cE3g7(a  
5-10.低真空阀low vacuum valve: CAX)AN  
5-11.高真空阀high vacuum valve: fUy:TCS  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 9$)I=Rpk =  
5-13.手动阀manually operated valve: 0[(TrIpXl  
5-14.气动阀pneumatically operated valve: eEvE3=,hg  
5-15.电磁阀electromagnetically operated valve: |KF_h^  
5-16.电动阀valve with electrically motorized operation: Fk01j;k.H  
5-17.挡板阀baffle valve: @LQe[`  
5-18.翻板阀flap valve: ~ ;CnwG   
5-19.插板阀gate valve: '6Lw<#It  
5-20.蝶阀butterfly valve: ~\;s}Fv.  
koQ\]t'*As  
6.真空管路 {9>LF  
6-1.粗抽管路roughing line: `cee tr=  
6-2.前级真空管路backing line: |Tn+Aq7  
6-3.旁通管路;By-Pass管路 by-pass line: !Zf< j  
6-4.抽气封口接头pumping stem: xaQO=[  
6-5.真空限流件limiting conductance:       `;?`XC"m  
6-6.过滤器filter: [wHGt?R  
5.   1.一般术语 /CR Z  
1-1真空镀膜vacuum coating: W dM?{; #  
1-2基片substrate: |$AoI  
1-3试验基片testing substrate: @3T)J,f  
1-4镀膜材料coating material: QtM9G@%  
1-5蒸发材料evaporation material: "Dr8}g:X  
1-6溅射材料sputtering material: W!@*3U]2R  
1-7膜层材料(膜层材质)film material: C !a#M{:  
1-8蒸发速率evaporation rate: E?,O>bCJ5  
1-9溅射速率sputtering rate: l_Ee us  
1-10沉积速率deposition rate: {<f |h)r  
1-11镀膜角度coating angle: (yh zjN~  
[FhFeW>  
2.工艺 u">KE6um  
2-1真空蒸膜vacuum evaporation coating: U]!~C 1cmw  
(1).同时蒸发simultaneous evaporation: /XfE6SBz  
(2).蒸发场蒸发evaporation field evaporation: B !>hHQ2  
(3).反应性真空蒸发reactive vacuum evaporation: UBj"m<  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: t|/{oAj  
(5).直接加热的蒸发direct heating evaporation: .(D,CGtYb  
(6).感应加热蒸发induced heating evaporation: Cp[{| U-?G  
(7).电子束蒸发electron beam evaporation: %3ieR}:/e&  
(8).激光束蒸发laser beam evaporation: =\[}@Kh  
(9).间接加热的蒸发indirect heating evaporation: 2h:*lV^  
(10).闪蒸flash evaportion: tCoT-\Q  
2-2真空溅射vacuum sputtering: x^0MEsR  
(1).反应性真空溅射 reactive vacuum sputtering: QC/%|M0 {  
(2).偏压溅射bias sputtering: D\"F?>  
(3).直流二级溅射direct current diode sputtering: 0m`{m'B4n  
(4).非对称性交流溅射asymmtric alternate current sputtering: -pb>=@Yq  
(5).高频二极溅射high frequency diode sputtering: x(r>iy  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: .(2Zoa  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 8ux?K5_  
(8).离子束溅射ion beam sputtering: Y*}xD;c k  
(9).辉光放电清洗glow discharge cleaning: [ \41  
2-3物理气相沉积PVD physical vapor deposition: o8Q+hZB}A  
2-4化学气相沉积CVD chemical vapor deposition: {Z~5#<t  
2-5磁控溅射magnetron sputtering: "2J$~2{N  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: !:zWhu,  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: _s(izc  
2-8电弧离子镀arc discharge deposition: zQPQP`  
;";#{B:  
3.专用部件 iS/faXe5  
3-1镀膜室coating chamber: LBCat=d<  
3-2蒸发器装置evaporator device: ho J{C 0  
3-3蒸发器evaporator: -~PiPYX  
3-4直接加热式蒸发器evaporator by direct heat: "q<}#]u  
3-5间接加热式蒸发器evaporator by indirect heat: J.t tJOP  
3-7溅射装置sputtering device: ggQBQ/ L  
3-8靶target: E:!qnc L:  
3-10时控挡板timing shutter: 0P?\eoB@8  
3-11掩膜mask: z8 n=\xL  
3-12基片支架substrate holder: cz{5-;$9Z  
3-13夹紧装置clamp: [H-r0Ah  
3-14换向装置reversing device:  *|OP>N  
3-15基片加热装置substrate heating device: il403Ae0  
3-16基片冷却装置substrate colding device: jE.yT(+lW  
C;DR@'+q  
4.真空镀膜设备 #z. QBG@  
4-1真空镀膜设备vacuum coating plant: *'BA# /@  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: !}+rg2  
(2).真空溅射镀膜设备vacuum sputtering coating plant: h3udS{9 '8  
4-2连续镀膜设备continuous coating plant: @0v%5@  
4-3半连续镀膜设备semi- continuous coating plant Y<h [5  
6.   1.漏孔 ~WKcO&  
1-1漏孔leaks: GM{J3O=  
1-2通道漏孔channel leak: IegZ)&_n  
1-3薄膜漏孔membrane leak: m h5ozv$  
1-4分子漏孔molecular leak: zfexaf!  
1-5粘滞漏孔vixcous leak: )^D:VY9 2  
1-6校准漏孔calibrated leak: ` 6'dhB  
1-7标准漏孔reference leak : C{5^UCJkg  
1-8虚漏virtual leak: o 5;V=8T;  
1-9漏率leak rate: 3lW7auH4Y{  
1-10标准空气漏率standard air leak rate: S2!$  
1-11等值标准空气漏率equivalent standard air leak rate: .5ItH^  
1-12探索(示漏)气体: reU*apZ/  
:t'*fHi~  
2.本底 }BR@vY'd  
2-1本底background: {&qB!axj  
2-2探索气体本底search gas background : Z2.S:y.  
2-3漂移drift: ^o|Gx  
2-4噪声noise: AVR=\ qR  
|IgH0 zZ  
3.检漏仪 E+tV7xa~  
3-1检漏仪leak detector: S,'y L7s  
3-2高频火花检漏仪H.F. spark leak detector: \_#Z~I{  
3-3卤素检漏仪halide leak detector: Qgel^"t]i  
3-4氦质谱检漏仪helium mass spectrometer leak detector: ?F!='6D}b  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: O! t> @%)  
+OTNn@!9  
4.检漏 mv0JD(  
4-1气泡检漏leak detection by bubbles: sC^9  
4-2氨检漏leak detection by ammonia: w4"4(SR.  
4-3升压检漏leak detection of rise pressure: .dr-I7&!  
4-4放射性同位素检漏radioactive isotope leak detection: <h vVh9  
4-5荧光检漏fluorescence leak detection ;`(l)X+7  
7.   1.一般术语 :RqTbE4B  
1-1真空干燥vacuum drying: InCJ4D  
1-2冷冻干燥freeze drying : <"SOH; w  
1-3物料material: KK|AXoBf  
1-4待干燥物料material to be dried: 13lJq:bM  
1-5干燥物料dried material : :v(fgS2\  
1-6湿气moisture;humidity: *w/})Y3^  
1-7自由湿气free moisture: _rmTX.'w  
1-8结合湿气bound moisture: vnrP;T=^  
1-9分湿气partial moisture: F^xhhz&e  
1-10含湿量moisture content: Kj+=?R~}S  
1-11初始含湿量initial moisture content: wQnW2)9!  
1-12最终含湿量final residual moisture: <)J83D0$E  
1-13湿度degree of moisture ,degree of humidity : EU0b>2n4  
1-14干燥物质dry matter : [*jvvkAp  
1-15干燥物质含量content of dry matter: 7: cmBkXm  
GmJ4AYEP  
2.干燥工艺 q7!$-  
2-1干燥阶段stages of drying : 7w_cKR1;  
(1).预干燥preliminary dry: ._$tNGI4  
(2).一次干燥(广义)primary drying(in general): 6(FkcC$G  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): {~lVe GBp  
(4).二次干燥secondary drying: 2VY.#9vl  
2-2.(1).接触干燥contact drying: x9NcIa9  
(2).辐射干燥 drying by radiation : Z WVN(U  
(3).微波干燥microwave drying: l^ Q-KUI  
(4).气相干燥vapor phase drying: 1J tt\yq  
(5).静态干燥static drying: nJ]oApb/-  
(6).动态干燥dynamic drying: /%P|<[< [  
2-3干燥时间drying time: {imz1g;  
2-4停留时间length of stay(in the drying chamber): aSy^( WN8  
2-5循环时间cycle time: wVw?UN*rm;  
2-6干燥率 dessication ratio : 5Lo\[K >j  
2-7去湿速率mass flow rate of humidity: GW[g!6 6^  
2-8单位面积去湿速率mass flow rate of humidity per surface area: nB#m?hK  
2-9干燥速度 drying speed : R[l9f8  
2-10干燥过程drying process: G';yb^DB  
2-11加热温度heating temperature: n& j@7R  
2-12干燥温度temperature of the material being dried : x'c%w:  
2-13干燥损失loss of material during the drying process : 5ml#/kE  
2-14飞尘lift off (particles): - %5O:n  
2-15堆层厚度thickness of the material: 2c Pd$j  
YH 5jvvOI  
3.冷冻干燥 Rx}*I00  
3-1冷冻freezing: v*pN~}5  
(1).静态冷冻static freezing: lO=Nw+'$S  
(2).动态冷冻dynamic freezing: vfn _Nq;  
(3).离心冷冻centrifugal freezing: LMF@-j%  
(4).滚动冷冻shell freezing: bJ$6[H-:  
(5).旋转冷冻spin-freezing: C1V@\mRi  
(6).真空旋转冷冻vacuum spin-freezing: 4=T.rVS[  
(7).喷雾冷冻spray freezing: iFypKpHg~  
(8).气流冷冻air blast freezing: 3kc.U  
3-2冷冻速率rate of freezing: f <,E  
3-3冷冻物料frozen material: 5Q9nJC{'NN  
3-4冰核ice core: |6ZH+6[  
3-5干燥物料外壳envelope of dried matter: G(n e8L8  
3-6升华表面sublimation front:  3 )bC,  
3-7融化位置freezer burn: Hw(_l,Xf  
Bc^%1  
4.真空干燥设备;真空冷冻干燥设备 8`0/?MZ)   
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: a&?SRC'x  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: Q^|ZoJS  
4-3加热表面heating surface: u@"nVHgMJ  
4-4物品装载面shelf : Q"@x,8xW  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): 3[RP:W@%  
4-6单位面积干燥器处理能力throughput per shelf area: uVQH,NA,  
4-7冰冷凝器ice condenser: t,f)!D$  
4-8冰冷凝器的负载load of the ice condenser: (iT?uMRz  
4-9冰冷凝器的额定负载rated load of the ice condenser ]WO0v`xh  
8.   1.一般术语 }u>F}mUa  
1-1试样sample : -_p+4tV  
(1).表面层surface layer: nz?jNdyz  
(2).真实表面true surface: YM:;mX5B  
(3).有效表面积effective surface area: vjzpU(Sq#  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: G~ldU: ?  
(5).表面粒子密度surface particle density: Q7~9~  
(6).单分子层monolayer: -$; h+9BO  
(7).表面单分子层粒子密度monolayer density: ;`{PA !>  
(8).覆盖系数coverage ratio: I|`/#BYbW  
1-2激发excitation: nQ$4W  
(1).一次粒子primary particle: Ji#"PE/Pt  
(2).一次粒子通量primary particle flux: "L(4 EcO@  
(3).一次粒子通量密度density of primary particle flux: (D?%(f  
(4).一次粒子负荷primary particle load: "\n,vNk  
(5).一次粒子积分负荷integral load of primary particle: n)n>|w_  
(6).一次粒子的入射能量energy of the incident primary particle: ek^=Z`  
(7).激发体积excited volume: ;j#(%U]Vp  
(8).激发面积excited area: &7}\mnhB  
(9).激发深度excited death: 0G`FXj}L  
(10).二次粒子secondary particles: 8@}R_GZc  
(11).二次粒子通量secondary particle flux: kvdiDo  
(12).二次粒子发射能energy of the emitted secondary particles: IQ5H`o?[B  
(13).发射体积emitting volume: D)]U+Qk  
(14).发射面积emitting area: 'R{Xq HP  
(15).发射深度emitting depth: }%&hxhR^t3  
(16).信息深度information depth: :3uCW1  
(17).平均信息深度mean information depth: d-W@/J  
1-3入射角angle of incidence: w;=fi}<G|e  
1-4发射角angle of emission: iq25|{1$  
1-5观测角observation: 7M|!N_ $  
1-6分析表面积analyzed surface area: z<T(afM{*  
1-7产额 yield : *tWZ.I<<  
1-8表面层微小损伤分析minimum damage surface analysis: cJ}J4?  
1-9表面层无损伤分析non-destructive surface analysis: DaA9fJ7a   
1-10断面深度分析 profile analysis in depth; depth profile analysis : Mdj?;'Yv  
1-11可观测面积observable area: rzR=% >  
1-12可观测立体角observable solid angle : 6;O fh   
1-13接受立体角;观测立体角angle of acceptance: O!,WH?r  
1-14角分辨能力angular resolving power: 61XLL/=P  
1-15发光度luminosity: $,mljJSQv  
1-16二次粒子探测比detection ratio of secondary particles: /8)-j}gZa  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: Y]u6f c  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: \~LwlOo%R  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: {.D^2mj |  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: v>p UVM  
1-21本底压力base pressure: MHuQGc"e+4  
1-22工作压力working pressure: yFD3:;}  
#|ppW fZQ  
2.分析方法 .nN>Ipv  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 4TP AD)C  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : p)dD{+"/2  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: bv NXA*0  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: PNSV?RT*pG  
2-3离子散射表面分析ion scattering spectroscopy: *2? -6  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: G$eA(GE   
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: EJ%Kr$51K  
2-6离子散射谱仪ion scattering spectrometer: 9AA_e ~y  
2-7俄歇效应Auger process: w_>SxSS7  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: 2j*+^&M/  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: rz@FUU:&  
2-10光电子谱术photoelectron spectroscopy : *VbB'u:  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: hk +@ngh%  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: *hk8[  
2-11光电子谱仪photoelectron spectrometer: _gLj(<^9  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: -msfiO  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 0LjF$3GpZ  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): ' )0eB:  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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