| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 4id3P{aU --------------------------------------------------- 13ipaz 真空术语 t-!Rgg$9 u=vh
Z%A] 1.标准环境条件 standard ambient condition: UG6M9 2.气体的标准状态 standard reference conditions forgases: ob0~VEH- 3.压力(压强)p pressure: {hxW,mmA 4.帕斯卡Pa pascal: jo_o`j 5.托Torr torr: nc<qbN 6.标准大气压atm standard atmosphere: pAENXC\, 7.毫巴mbar millibar: HKpD2M 8.分压力 partial pressure: EtGH\?d~] 9.全压力 total pressure: ;)gLjF/F7 10.真空 vacuum: 0[lS(K 11.真空度 degree of vacuum: AvZXRN1:' 12.真空区域 ranges of vacuum: e d_m +NM 13.气体 gas: (%i!%{!] 14.非可凝气体 non-condensable gas: !2(.$}E 15.蒸汽vapor: 1x{XE*%; 16.饱和蒸汽压saturation vapor pressure: #
2d,U\_ 17.饱和度degree of saturation: >Z}@7$(7!~ 18.饱和蒸汽saturated vapor: i9KTX%s5^ 19.未饱和蒸汽unsaturated vapor: 7 xUE,)? 20.分子数密度n,m-3 number density of molecules: 0k%hY{ 21.平均自由程ι、λ,m mean free path: 6zuze0ud 22.碰撞率ψ collision rate: 6Hda]y 23.体积碰撞率χ volume collision rate: MZ)T0|S_ 24.气体量G quantity of gas: bCzdszvg3 25.气体的扩散 diffusion of gas: ;:U<ce= 26.扩散系数D diffusion coefficient; diffusivity: mzu<C)9d, 27.粘滞流 viscous flow: (oF-O{ 28.粘滞系数η viscous factor: qT$)Rb& 29.泊肖叶流 poiseuille flow: n_J5zQJ 30.中间流 intermediate flow: |<1M&\oaQ' 31.分子流 molecular flow: vffH 32克努曾数 number of knudsen: ~U9q-/(J/ 33.分子泻流 molecular effusion; effusive flow: W=3? x 34.流逸 transpiration: T RDxT 35.热流逸 thermal transpiration: i$["aP~G 36.分子流率qN molecular flow rate; molecular flux: /w0w*nH 37.分子流率密度 molecular flow rate density; density of molecular flux: -n-Z/5~ X 38.质量流率qm mass flow rare: 3
&Sp@, 39.流量qG throughput of gas:
{U^j&E 40.体积流率qV volume flow rate: 8A!'I<S1 41.摩尔流率qυ molar flow rate: /~tP7<7A 42.麦克斯韦速度分布 maxwellian velocity distribution: 12 -EDg/1 43.传输几率Pc transmission probability: K_Re}\D 44.分子流导CN,UN molecular conductance: <n\i>A3`,S 45.流导C,U conductance: Mb1wYh 46.固有流导Ci,Ui intrinsic conductance: k/@Tr
: 47.流阻W resistance: >e/ r2U 48.吸附 sorption: \f<z*!,D$ 49.表面吸附 adsorption: [1U{ci&=p 50.物理吸附physisorption: DLXL!-)z 51.化学吸附 chemisorption: F)7j@h^ 52.吸收absorption: ]);NnsG 53.适应系数α accommodation factor: F<gMUDB 54.入射率υ impingement rate: CbQ4Y 55.凝结率condensation rate: ^N{k6>; 56.粘着率 sticking rate: ntZ~m 57.粘着几率Ps sticking probability: d#8e~ 58.滞留时间τ residence time: AOAO8%|I 59.迁移 migration: ol }`Wwy 60.解吸 desorption: QXY}STs 61.去气 degassing: 7f
r>ZY^ 62.放气 outgassing: "koo` J 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: h1-Gp3# 64.蒸发率 evaporation rate: ^cn@?k((A 65.渗透 permeation: 4DM*^=9E 66.渗透率φ permeability: Yv=g^tw 67.渗透系数P permeability coefficient SBL+e]P 2. 1.真空泵 vacuum pumps A_F0\ EN* 1-1.容积真空泵 positive displacement pump: .1{l[[= W ⑴.气镇真空泵 gas ballast vacuum pump: Qsji0ikG ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: _D
JCsK| ⑶.干封真空泵 dry-sealed vacuum pump: &mdB\Y?^ ⑷.往复真空泵 piston vacuum pump: dm& /K
4c ⑸.液环真空泵 liquid ring vacuum pump: ;W6-i2? ⑹.旋片真空泵 sliding vane rotary vacuum pump: t)'dF*L ⑺.定片真空泵 rotary piston vacuum pump: }AJ L,Q7q ⑻.滑阀真空泵 rotary plunger vacuum pump: ~#4~_d.=L ⑼.余摆线真空泵 trochoidal vacuum pump: [zx|eG<&- ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ^Et,TF\ ⑾.罗茨真空泵 roots vacuum pump: K"^cq~ 1-2.动量传输泵 kinetic vacuum pump: bBG/gQ ⑴.牵引分子泵molecular drag pump: j/'
g$ ⑵.涡轮分子泵turbo molecular pump: P9s_2KOF ⑶.喷射真空泵ejector vacuum pump: 6Hl<,(vn ⑷.液体喷射真空泵liquid jet vacuum pump: \OA
L Or ⑸.气体喷射真空泵gas jet vacuum pump: 3C#RjA-2[ ⑹.蒸汽喷射真空泵vapor jet vacuum pump : bs P6\'\4 ⑺.扩散泵diffusion pump : 0O[l?e4,8{ ⑻.自净化扩散泵self purifying diffusion pump: cd+^=esSO ⑼.分馏扩散泵 fractionating diffusion pump : + ~~ Z0.[ ⑽.扩散喷射泵diffusion ejector pump : }_]As}E ⑾.离子传输泵ion transfer pump: (V)9s\Le_ 1-3.捕集真空泵 entrapment vacuum pump: D$$3fN.iEL ⑴吸附泵adsorption pump: G:DSWW} ⑵.吸气剂泵 getter pump: ng
9NE8F ⑶.升华(蒸发)泵 sublimation (evaporation)pump : 7JS#a=D# ⑷.吸气剂离子泵getter ion pump: K.%z;(U ⑸.蒸发离子泵 evaporation ion pump: ?uig04@3 ⑹.溅射离子泵sputter ion pump: *#6|!%?g ⑺.低温泵cryopump: jceHKl ey*,StT5a 2.真空泵零部件 [NjajA~z>F 2-1.泵壳 pump case: xY+A]Up|w 2-2.入口 inlet: aoK4Du{ 2-3.出口outlet: w0aHEvH/ 2-4.旋片(滑片、滑阀)vane; blade : v =>3"!* 2-5.排气阀discharge valve: 4L!e=>as"1 2-6.气镇阀gas ballast valve: h~:H?pj3g 2-7.膨胀室expansion chamber: D"'#one 2-8.压缩室compression chamber: ;2BPPZ 2-9.真空泵油 vacuum pump oil: 4 #G3ew 2-10.泵液 pump fluid: ^&HI+M 2-11.喷嘴 nozzle: kr6:{\DU:B 2-13.喷嘴扩张率nozzle expansion rate: m8p4U-*j 2-14.喷嘴间隙面积 nozzle clearance area : >|(WS.n 3C 2-15.喷嘴间隙nozzle clearance: :ECw
\_"0$ 2-16.射流jet: N4tc V\O 2-17.扩散器diffuser: UX?X]ZYVR 2-18.扩散器喉部diffuser thoat: RR8U
Cv 2-19.蒸汽导管vapor tube(pipe;chimney): 7~:>WMv9 2-20.喷嘴组件nozzle assembly: L{zamVQG 2-21.下裙skirt: -B",&yTV dr}O+7_7%- 3.附件 !P+~c0DF 3-1阱trap: P~;<o!f ⑴.冷阱 cold trap: 'w: tq ⑵.吸附阱sorption trap: 54bF)<+ ⑶.离子阱ion trap: yZQ1]
'^31 ⑷.冷冻升华阱 cryosublimation trap: !Mm+bWn=mB 3-2.挡板baffle: lrM.RM96 3-3.油分离器oil separator: +
?[ ACZF 3-4.油净化器oil purifier:
zgZi 3-5.冷凝器condenser: x A@|I# }S1Z>ZA5 4.泵按工作分类 1v+JCOy 4-1.主泵main pump: !]n{l_5r 4-2.粗抽泵roughing vacuum pump: 7/$nA<qM 4-3.前级真空泵backing vacuum pump: yL^M~lws 4-4.粗(低)真空泵 roughing(low)vacuum pump: h'z+8X_t 4-5.维持真空泵holding vacuum pump: My`josJ`Pb 4-6.高真空泵high vacuum pump: E,"b*l. 4-7.超高真空泵ultra-high vacuum pump: [J[ysW})W 4-8.增压真空泵booster vacuum pump: S}XB
| !07FsPI#{ 5.真空泵特性 b6rzHnl{ 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 7zz(# 5-2.真空泵的抽气量Q throughput of vacuum pump:。 2`q^Q 5-3.起动压力starting pressure: >vNk kxWyQ 5-4.前级压力 backing pressure : 9OO0Ht4j 5-5.临界前级压力 critical backing pressure: U>3%!83kF 5-6.最大前级压力maximum backing pressure: -Ihn<<uE? 5-7.最大工作压力maximum working pressure: !/=9VD{U! 5-8.真空泵的极限压力ultimate pressure of a pump: z[$9B#P 5-9.压缩比compression ratio: * 7zN 5-10.何氏系数Ho coefficient: VygXhh^7\ 5-11.抽速系数speed factor: Y;%R/OyWY 5-12.气体的反扩散back-diffusion of gas: gn4g 43 5-13.泵液返流back-streaming of pump fluid: 80R=r 5-14.返流率back-streaming rate nFf\tf%8 5-15.返迁移back-migration: Rzn 0-cG 5-16.爆腾bumping: }y-AoG 5-17.水蒸气允许量qm water vapor tolerable load: A{n*NxKCX! 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: S3JygN* 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ^0BF2&Zx 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ;]O 7^s#v 3. 1.一般术语 * zJiii 1-1.压力计pressure gauge: b$$L]$q2 1-2.真空计vacuum gauge: O}\"$n> ⑴.规头(规管)gauge head: %]= 'Uv^x ⑵.裸规nude gauge : _`Yvfz3 ⑶.真空计控制单元gauge control unit : kdueQ(\ ⑷.真空计指示单元gauge indicating unit : '=G<)z@k -^nQ^Td=j 2.真空计一般分类 y0mg}N1 2-1.压差式真空计differential vacuum gauge: ~?8x0 2-2.绝对真空计 absolute vacuum gauge: `'k's]Y 2-3.全压真空计total pressure vacuum gauge: u3?Pp[tM< 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: }?ac<> u& 2-5.相对真空计relative vacuum gauge : .qU%SmQ^ 1_E3DXe 3.真空计特性 ~6kA<(x 3-1.真空计测量范围pressure range of vacuum gauge: p=5H^E m1 3-2.灵敏度系数sensitivity coefficient: 6s"bstc{ 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): r3bvuq,6$ 3-5.规管光电流photon current of vacuum gauge head: ,9j:h)ks? 3-6.等效氮压力equivalent nitrogen pressure : +H^V},dBp! 3-7.X射线极限值 X-ray limit: W;@ae,^ 3-8.逆X射线效应anti X-ray effect: LkbvA 3-9.布利尔斯效应blears effect: co%_~xO l$~bkVNL 4.全压真空计 Xs,PT 4-1.液位压力计liquid level manometer: ,ce^"yG 4-2.弹性元件真空计elastic element vacuum gauge: `j"G=%e3. 4-3.压缩式真空计compression gauge: 5nIlG 4-4.压力天平pressure balance: /F9lW}pd 4-5.粘滞性真空计viscosity gauge : Jt,
4@ 4-6.热传导真空计thermal conductivity vacuum gauge : zMqEMx9 4-7.热分子真空计thermo-molecular gauge: 5Cyjq0+ 4-8.电离真空计ionization vacuum gauge: +&8Ud8Q 4-9.放射性电离真空计radioactive ionization gauge: T[=cKYp8\ 4-10.冷阴极电离真空计cold cathode ionization gauge: kxf=%<l 4-11.潘宁真空计penning gauge: (eE}W~Z 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: l5nDt$Ex 4-13.放电管指示器discharge tube indicator: v23Uh2[@Yy 4-14.热阴极电离真空计hot cathode ionization gauge: i1Sc/ 4-15.三极管式真空计triode gauge: (>`SS#(T! 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: .TS=[WGMS 4-17.B-A型电离真空计Bayard-Alpert gauge: [t)i\ }V 4-18.调制型电离真空计modulator gauge: 8J U~Q 4-19.抑制型电离真空计suppressor gauge: z6r/
w 4-20.分离型电离真空计extractor gauge: eH*b-H[ 4-21.弯注型电离真空计bent beam gauge: s""8V_,; 4-22.弹道型电离真空计 orbitron gauge : FQ1oqqr 4-23.热阴极磁控管真空计hot cathode magnetron gauge: U {!{5l: DN0b.*[`3 5.分压真空计(分压分析器) dph6aN(49 5-1.射频质谱仪radio frequency mass spectrometer: MCG~{#` 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 8{t&8Ql n 5-3.单极质谱仪momopole mass spectrometer: N,$o'\l 5-4.双聚焦质谱仪double focusing mass spectrometer: uNBhVsM6< 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Rx-i.Et Z 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 1e} 3L2rC 5-7.回旋质谱仪omegatron mass spectrometer: %n,bPa>T 5-8.飞行时间质谱仪time of flight mass spectrometer: 1=.kH[R >L4$DKO 6.真空计校准 _S1uJ~j;E 6-1.标准真空计reference gauges: RL9BB. 6-2.校准系统system of calibration: X\RTHlw'] 6-3.校准系数K calibration coefficient: _,~zy9{, 6-4.压缩计法meleod gauge method: tYa8I/HpT 6-5.膨胀法expansion method: CU_06A|} 6-6.流导法flow method: &N ;6G`3 4. 1.真空系统vacuum system a| cD{d 1-1.真空机组pump system: `I$A;OPK7 1-2.有油真空机组pump system used oil : JY16|ia 1-3.无油真空机组oil free pump system t57b)5{FM 1-4.连续处理真空设备continuous treatment vacuum plant: mNKa~E 1-5.闸门式真空系统vacuum system with an air-lock: %}:J
9vra 1-6.压差真空系统differentially pumped vacuum system: $ 1ZY
Vw 1-7.进气系统gas admittance system: bHnQLJ oMbCljUC 2.真空系统特性参量 i|mA/
e3b 2-1.抽气装置的抽速volume flow rate of a pumping unit : 'CX
KphlWs 2-2.抽气装置的抽气量throughput of a pumping unit : Jt8 v=<@ 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: }^q#0`e(y 2-4.真空系统的漏气速率leak throughput of a vacuum system: u@B"*V~K 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: rpmDr7G 2-6.极限压力ultimate pressure: |*$_eb 2-7.残余压力residual pressure: tDo0Q/` 2-8.残余气体谱residual gas spectrum: |sh U 2-9.基础压力base pressure: |.A>0-']M 2-10.工作压力working pressure: TfPx 2-11.粗抽时间roughing time: rL=$WxdPU 2-12.抽气时间pump-down time: YaU A}0cW 2-13.真空系统时间常数time constant of a vacuum system: 7-DC"`Y8e 2-14.真空系统进气时间venting time: U VT8TN-T jo^*R'} 3.真空容器 pP @#|T 3-1.真空容器;真空室vacuum chamber: _*9Zp1r 3-2.封离真空装置sealed vacuum device: (`xc3-, 3-3.真空钟罩vacuum bell jar: 4]bT O 3-4.真空容器底板vacuum base plate: D fea<5~^z 3-5.真空岐管vacuum manifold: kBzzi^cl 3-6.前级真空容器(贮气罐)backing reservoir: yrjm0BM# 3-7.真空保护层outer chamber: R|suBF3 3-8.真空闸室vacuum air lock: j{g {`Qa 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: Hpt)(Nz: [Z0e$ 4.真空封接和真空引入线 gJ])A7O 4-1.永久性真空封接permanent seal : F!xK#~e 4.2.玻璃分级过渡封接graded seal : /dfZ>k8 4-3.压缩玻璃金属封接compression glass-to-metal seal: ;Y"J j 4-4.匹配式玻璃金属封接matched glass-to-metal seal: R/#*~tPi8 4-5.陶瓷金属封接ceramic-to-metal seal: )d(cXN-T 4-6.半永久性真空封接semi-permanent seal : 3 yElN.= 4-7.可拆卸的真空封接demountable joint: B;m18LDu 4-8.液体真空封接liquid seal =vFI4)$- 4-9.熔融金属真空封接molten metal seal: BWs\'B 4-10.研磨面搭接封接ground and lapped seal: ?o4&cCFOE 4-11.真空法兰连接vacuum flange connection: ?d%_o@ 4-12.真空密封垫vacuum-tight gasket: <ESAoY"RPN 4-13.真空密封圈ring gasket: `drvu?F 4-14.真空平密封垫flat gasket: K)qmJ-Gub 4-15.真空引入线feedthrough leadthrough: 1)r1/0 4-16.真空轴密封shaft seal: 9$ _}E` 4-17.真空窗vacuum window: j.z#fU 4-18.观察窗viewing window: ~DJ/sY2/ <W?,n% 5.真空阀门 &EQov9P7 5-1.真空阀门的特性characteristic of vacuum valves: +z4NxR
⑴.真空阀门的流导conductance of vacuum valves: {>z.y1 ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: mz#(\p=T 5-2.真空调节阀regulating valve: j'7FTVmJ 5-3.微调阀 micro-adjustable valve: H(pOR<` 5-4.充气阀charge valve: /
g&mDYV| 5-5.进气阀gas admittance valve: I[&!\Me[+w 5-6.真空截止阀break valve: q)P<lKi 5-7.前级真空阀backing valve: |m=@;B| 5-8.旁通阀 by-pass valve: v9<p@GY"\ 5-9.主真空阀main vacuum valve: mV;7SBoT 5-10.低真空阀low vacuum valve: -du+iOe? 5-11.高真空阀high vacuum valve: l/TH"z( 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: BFMM6-Ve 5-13.手动阀manually operated valve: }x%"Oq|2]x 5-14.气动阀pneumatically operated valve: F`-? 3]\3 5-15.电磁阀electromagnetically operated valve: 7Fq|Zc`P 5-16.电动阀valve with electrically motorized operation: 9)=as/o 5-17.挡板阀baffle valve: XL+kEZ|3 5-18.翻板阀flap valve: !Zs;m`j&9 5-19.插板阀gate valve: :cOwTW?Fj 5-20.蝶阀butterfly valve: #a/lt^}C* 5B(|!Xq;I 6.真空管路 v+\E%H 6-1.粗抽管路roughing line: p1 o?^A& 6-2.前级真空管路backing line: 1XSqgr"3 6-3.旁通管路;By-Pass管路 by-pass line: =P5SFMPN 6-4.抽气封口接头pumping stem: p<jHUG4?' 6-5.真空限流件limiting conductance: {xOu*8J 6-6.过滤器filter: 1Og9VG1^ 5. 1.一般术语 {B[i|(xQx 1-1真空镀膜vacuum coating: 0m?ul%= 1-2基片substrate: `RjcJ?r 1-3试验基片testing substrate: 6k^vF~ 1-4镀膜材料coating material: ^P]: etld9 1-5蒸发材料evaporation material: +|o-lb 1-6溅射材料sputtering material: J,E&Uz95% 1-7膜层材料(膜层材质)film material: Ad]r )d{ 1-8蒸发速率evaporation rate: 4h(aTbHaQ 1-9溅射速率sputtering rate: v}iJ:' 1-10沉积速率deposition rate: 8^M5u>=t; 1-11镀膜角度coating angle: _msDf2e9 XLM 9+L 2.工艺 Wqy8ZgSC 2-1真空蒸膜vacuum evaporation coating: 2wu
5`Z[E (1).同时蒸发simultaneous evaporation: y*zZ }> (2).蒸发场蒸发evaporation field evaporation: ,E/vHI8 (3).反应性真空蒸发reactive vacuum evaporation: o2%"Luf< (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: -'ZP_$sA (5).直接加热的蒸发direct heating evaporation: F.AO (6).感应加热蒸发induced heating evaporation: ,ll!19y (7).电子束蒸发electron beam evaporation: _&yQW&vH# (8).激光束蒸发laser beam evaporation: Wlt shZo (9).间接加热的蒸发indirect heating evaporation: L@v0C) (10).闪蒸flash evaportion: bXt A4O 2-2真空溅射vacuum sputtering: .%D] z{'' (1).反应性真空溅射 reactive vacuum sputtering: \*_qP*vq@ (2).偏压溅射bias sputtering: lJq
%me;4m (3).直流二级溅射direct current diode sputtering: aIkxN& (4).非对称性交流溅射asymmtric alternate current sputtering: ^QXUiXzl (5).高频二极溅射high frequency diode sputtering: ]jM D'vg^b (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1OJ:Vy}n (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: g%^Zq" (8).离子束溅射ion beam sputtering: {%~Sbcq4F (9).辉光放电清洗glow discharge cleaning: M~3(4, 2-3物理气相沉积PVD physical vapor deposition: q E(`@G 2-4化学气相沉积CVD chemical vapor deposition: {jr>Z"/q 2-5磁控溅射magnetron sputtering: OhIUm4=|$ 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: \b~zyt6- 2-7空心阴极离子镀HCD hollow cathode discharge deposition: Y$Fbi2A4 2-8电弧离子镀arc discharge deposition: <w08p*? R?^FO:nM%! 3.专用部件 vzy/Rq 3-1镀膜室coating chamber: $D8KEkW 3-2蒸发器装置evaporator device: vzs6YsA 3-3蒸发器evaporator: &Gxk~p< 3-4直接加热式蒸发器evaporator by direct heat: S:b-+w|* 3-5间接加热式蒸发器evaporator by indirect heat: f&5'1tG 3-7溅射装置sputtering device: .lbo\v}2W 3-8靶target: acG4u+[ ] 3-10时控挡板timing shutter: 6sE%] u<V 3-11掩膜mask: Z@i"/~B|4\ 3-12基片支架substrate holder: mEh([ZnY 3-13夹紧装置clamp: >v\t>
[9t 3-14换向装置reversing device: M9*#8> 3-15基片加热装置substrate heating device: XXwe/>J 3-16基片冷却装置substrate colding device: A.[~}ywH 3kU4?D] 4.真空镀膜设备 +c+i~5B4 4-1真空镀膜设备vacuum coating plant: S!Z2aFj (1).真空蒸发镀膜设备vacuum evaporation coating plant: 4 C7z6VWg (2).真空溅射镀膜设备vacuum sputtering coating plant: |:[
[w&R 4-2连续镀膜设备continuous coating plant: V:Z}cfR .7 4-3半连续镀膜设备semi- continuous coating plant 4nvi7 6. 1.漏孔 *{K?JB#W 1-1漏孔leaks: } ={TVs^ 1-2通道漏孔channel leak: h!yI(cY 1-3薄膜漏孔membrane leak: qL;T^lj P 1-4分子漏孔molecular leak: Of@LEEh6 1-5粘滞漏孔vixcous leak: ;1gWz
1-6校准漏孔calibrated leak: cT&!_g#g 1-7标准漏孔reference leak : ZUg~8VVe 1-8虚漏virtual leak: d[( } 1-9漏率leak rate: r9\7I7z 1-10标准空气漏率standard air leak rate: sFrerv&0 1-11等值标准空气漏率equivalent standard air leak rate: m,3H] 1-12探索(示漏)气体: D# Gf.c 9^4BqAWYrV 2.本底 :U{$G(
< 2-1本底background: AP:(/@K| 2-2探索气体本底search gas background : /
%9DO 2-3漂移drift: s+fjQo4 2-4噪声noise: AJJa<c+j /%F}vW(! 3.检漏仪 9|{t%F=- 3-1检漏仪leak detector: &%=]lP] 3-2高频火花检漏仪H.F. spark leak detector: 1*VArr6*6 3-3卤素检漏仪halide leak detector: 7A=*3 3-4氦质谱检漏仪helium mass spectrometer leak detector: [t}@>@W| 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: !yQ%^g` ~'.SmXZs 4.检漏 j=U^+jAn 4-1气泡检漏leak detection by bubbles: 0e,U&B<W 4-2氨检漏leak detection by ammonia: +qiI;C_P\ 4-3升压检漏leak detection of rise pressure: nQm
(UN 4-4放射性同位素检漏radioactive isotope leak detection: UzKB "Q 4-5荧光检漏fluorescence leak detection W|I<hY\X 7. 1.一般术语 q L-Ni 1-1真空干燥vacuum drying: }fqy vI 1-2冷冻干燥freeze drying :
25H=RTw 1-3物料material: k;~*8i=%,\ 1-4待干燥物料material to be dried: ]ME2V 1-5干燥物料dried material : ZQ)vvD< 1-6湿气moisture;humidity: b+tm[@|,v 1-7自由湿气free moisture: :<
*x G& 1-8结合湿气bound moisture: p?H2W- 1-9分湿气partial moisture: 9\S,$A{{* 1-10含湿量moisture content: }xb?C""q^q 1-11初始含湿量initial moisture content: IA3m.Vxj ^ 1-12最终含湿量final residual moisture: 0qSf7"3f 1-13湿度degree of moisture ,degree of humidity : 3;<Vv*a"Dm 1-14干燥物质dry matter : 6-t:eo9 1-15干燥物质含量content of dry matter: Gl]z@ZXWIw PZYVLUw
` 2.干燥工艺 3[cGSI"+ 2-1干燥阶段stages of drying : dhCrcYn (1).预干燥preliminary dry: -E+LA (2).一次干燥(广义)primary drying(in general): mhv ;pM6 (3).一次干燥(冷冻干燥)primary drying(freeze-drying): RemjiCE0' (4).二次干燥secondary drying: D6vhW:t8? 2-2.(1).接触干燥contact drying: ["~T)d' (2).辐射干燥 drying by radiation : pkEx.R) (3).微波干燥microwave drying: >E\U$}WCG (4).气相干燥vapor phase drying: Fu\!'\6 (5).静态干燥static drying: ,(v=ZeI (6).动态干燥dynamic drying: ' &<saqA 2-3干燥时间drying time: &, %+rvo} 2-4停留时间length of stay(in the drying chamber): "Gc\"'^r 2-5循环时间cycle time:
*Q!I^]CR 2-6干燥率 dessication ratio : z`2Ais@ao 2-7去湿速率mass flow rate of humidity: kR]AW60OE 2-8单位面积去湿速率mass flow rate of humidity per surface area: bS&XlgnKi 2-9干燥速度 drying speed : X 3(CY`HH[ 2-10干燥过程drying process: 7Rl/F1G o} 2-11加热温度heating temperature: ::k
cV'* 2-12干燥温度temperature of the material being dried : K[R.B!;N 2-13干燥损失loss of material during the drying process : Gr|IM,5P4 2-14飞尘lift off (particles): Q4B(NYEu( 2-15堆层厚度thickness of the material: ;uyQ R8 `^'0__<M 3.冷冻干燥 aFd87'^ 3-1冷冻freezing: U`kO<ztk (1).静态冷冻static freezing: kPezR:
31 (2).动态冷冻dynamic freezing: ~ea&1+Z[3 (3).离心冷冻centrifugal freezing:
XM< (4).滚动冷冻shell freezing: b.mWB`59 (5).旋转冷冻spin-freezing: nV>=n,+s" (6).真空旋转冷冻vacuum spin-freezing: jU!ibs}R3 (7).喷雾冷冻spray freezing: ?V$@2vBVX4 (8).气流冷冻air blast freezing: x%OJ3Qjj= 3-2冷冻速率rate of freezing: #)z7&nD 3-3冷冻物料frozen material: |v@ zyOq&b 3-4冰核ice core: F0tx.]uS 3-5干燥物料外壳envelope of dried matter: !WNO!S0/j 3-6升华表面sublimation front: 3Ss)i7 3-7融化位置freezer burn: H':0 z2god 1" 4.真空干燥设备;真空冷冻干燥设备 Azag*M? 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: U~_G *0 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: x_OZdI 4-3加热表面heating surface: 0s%]%2ON 4-4物品装载面shelf : Z.3*sp0
yv 4-5干燥器的处理能力throughput (of the vacuum drying chamber): uV\~2#o$_ 4-6单位面积干燥器处理能力throughput per shelf area: b_GAK 4-7冰冷凝器ice condenser: b*dEX%H8sf 4-8冰冷凝器的负载load of the ice condenser: *@[N~:z/ 4-9冰冷凝器的额定负载rated load of the ice condenser aT}?-CUxx 8. 1.一般术语 QR*{}`+l 1-1试样sample : rj-Q+rgup (1).表面层surface layer: "j% L* J) (2).真实表面true surface: "-A@d&5. (3).有效表面积effective surface area: S\W&{+3 (4).宏观表面;几何表面macroscopic surface area; geometric surface area: ;1L7+.A (5).表面粒子密度surface particle density: L0>w|LpRc (6).单分子层monolayer: n_1,-(t (7).表面单分子层粒子密度monolayer density: Qm2(Z8Gh (8).覆盖系数coverage ratio: T8\%+3e. 1-2激发excitation: .8/W_iC92 (1).一次粒子primary particle: i=j4Wg ,{J (2).一次粒子通量primary particle flux: uW^ W/S%' (3).一次粒子通量密度density of primary particle flux: gfmaO] (4).一次粒子负荷primary particle load:
z+F:_ (5).一次粒子积分负荷integral load of primary particle: hSfLNvK
(6).一次粒子的入射能量energy of the incident primary particle: DY!mq91
(7).激发体积excited volume: )0xEI (8).激发面积excited area: Ehf3L |9 (9).激发深度excited death: .Wq" (10).二次粒子secondary particles: =OU]<% (11).二次粒子通量secondary particle flux: }t9A#GOz (12).二次粒子发射能energy of the emitted secondary particles: 8GFA}_(^R (13).发射体积emitting volume: }c-tvK1g (14).发射面积emitting area: ,Jh('r7 (15).发射深度emitting depth: @dp1bkU (16).信息深度information depth: &+>)H$5 (17).平均信息深度mean information depth: ~\D
H[Mt 1-3入射角angle of incidence: Hxzdxwz%$ 1-4发射角angle of emission: sT"h)I)]* 1-5观测角observation: w=S7zzL) 1-6分析表面积analyzed surface area: W mT(>JBO 1-7产额 yield : :i_kA'dl& 1-8表面层微小损伤分析minimum damage surface analysis: hSyA;*)U 1-9表面层无损伤分析non-destructive surface analysis: IfGQeynj 1-10断面深度分析 profile analysis in depth; depth profile analysis : ,"!P{c 1-11可观测面积observable area: ,0R2k `m! 1-12可观测立体角observable solid angle : `nDgwp:b" 1-13接受立体角;观测立体角angle of acceptance: >4} 2~; 1-14角分辨能力angular resolving power: 9#AsSbBpf 1-15发光度luminosity: _Ak?i\ 1-16二次粒子探测比detection ratio of secondary particles: ceu}Lp^%/ 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: "wPFQXU 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ]'UO]i/ 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: ~4~-^
t 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: ;=.QT 1-21本底压力base pressure: aQEMCWxZ 1-22工作压力working pressure: %q@eCN 43;@m}|7$ 2.分析方法 Pb|'f( 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: !m#cneV (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : AE)<ee%\\ (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: .FnO 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: Lw]:/x 2-3离子散射表面分析ion scattering spectroscopy: .wD>0Ig 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: F%Lniv/N 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: d/G P.d 2-6离子散射谱仪ion scattering spectrometer: qYW{$K 2-7俄歇效应Auger process: nr>g0_%m 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: Oifu ?f<r 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: /AR;O4X+ 2-10光电子谱术photoelectron spectroscopy :
0O>8DX (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: .Jz$)R (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: N2VF_[l 2-11光电子谱仪photoelectron spectrometer: =De%]]> 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: HlB'yOHv! 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: $;_'5`xs 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): 0C}7=_? 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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