cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 2:/' --------------------------------------------------- ZqkP# ]+Y' 真空术语 bUp%87<*X @=b0>^\m 1.标准环境条件 standard ambient condition: <0 R7uH 2.气体的标准状态 standard reference conditions forgases: FymA_Eq 3.压力(压强)p pressure: =2)5_/9au 4.帕斯卡Pa pascal: OcMd'fwO 5.托Torr torr: #v')iR"
6.标准大气压atm standard atmosphere: Yq#I#
2RD 7.毫巴mbar millibar: }vxb, [# 8.分压力 partial pressure: ~7b'4\ 9.全压力 total pressure: U{LDtn%@h6 10.真空 vacuum: ]^&DEj{ 11.真空度 degree of vacuum: rr*",a"}m 12.真空区域 ranges of vacuum: /[GOs*{zB 13.气体 gas: ,u{d@U^)3@ 14.非可凝气体 non-condensable gas: [={pFq` 15.蒸汽vapor: nV
McHN 16.饱和蒸汽压saturation vapor pressure: zV4%F"- 17.饱和度degree of saturation: \h :Rw| 18.饱和蒸汽saturated vapor: g 6>RyjN 19.未饱和蒸汽unsaturated vapor: Q9 kKk 20.分子数密度n,m-3 number density of molecules: +yS"pOT 21.平均自由程ι、λ,m mean free path: Nt&}T 22.碰撞率ψ collision rate: -deY,% 23.体积碰撞率χ volume collision rate: PFG):i-? 24.气体量G quantity of gas: /+sn-$/"i 25.气体的扩散 diffusion of gas: NV*aHci 26.扩散系数D diffusion coefficient; diffusivity: xh@H@Q\ 27.粘滞流 viscous flow: >?b/_O 28.粘滞系数η viscous factor: =@binTC4 29.泊肖叶流 poiseuille flow: )(\5Wk9( 30.中间流 intermediate flow: E[nW B"pxE 31.分子流 molecular flow: @p|[7' 32克努曾数 number of knudsen: 6}x^T)R 33.分子泻流 molecular effusion; effusive flow: }^?dK3~q 34.流逸 transpiration: j"_V+)SD 35.热流逸 thermal transpiration: 5xLuu KG 36.分子流率qN molecular flow rate; molecular flux: 7SXi#{ 37.分子流率密度 molecular flow rate density; density of molecular flux:
?O\n!c 38.质量流率qm mass flow rare: o&;+!Si@T 39.流量qG throughput of gas: y$*Tbzp 40.体积流率qV volume flow rate: z.]t_`KuF9 41.摩尔流率qυ molar flow rate: ?_m;~>C 42.麦克斯韦速度分布 maxwellian velocity distribution: z mrk`o~ 43.传输几率Pc transmission probability: &]pW## 44.分子流导CN,UN molecular conductance: uMPJ 45.流导C,U conductance: Nh]eZ3O 46.固有流导Ci,Ui intrinsic conductance: (LTm!"Q 47.流阻W resistance: M)I&^mm39 48.吸附 sorption: eAu3,qoM 49.表面吸附 adsorption: =
Yh>5A 50.物理吸附physisorption:
HHWB_QaL 51.化学吸附 chemisorption: ',kYZay 52.吸收absorption: 3UD_2[aqN( 53.适应系数α accommodation factor: I@+dE V`Lf 54.入射率υ impingement rate: 0RYh4'=F 55.凝结率condensation rate: <|hvH 56.粘着率 sticking rate: WSi Utf|g 57.粘着几率Ps sticking probability: ]8d]nftY 58.滞留时间τ residence time: T9RR.
ng 59.迁移 migration: ' "~|L>F%G 60.解吸 desorption: hKQT, 61.去气 degassing: K$#(\-M
62.放气 outgassing: %OfaBv& 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: o8
q@rwu3 64.蒸发率 evaporation rate: '<>pz<c 65.渗透 permeation: B\KvKT|\ 66.渗透率φ permeability: 7AV !v` 67.渗透系数P permeability coefficient -AD3Pd|Y[ 2. 1.真空泵 vacuum pumps Xy_+L_h^ 1-1.容积真空泵 positive displacement pump: NLoJmOi;L7 ⑴.气镇真空泵 gas ballast vacuum pump: Eae]s8ek9 ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: EtcAU}9 ⑶.干封真空泵 dry-sealed vacuum pump: @,i:fY ⑷.往复真空泵 piston vacuum pump: ~-A5h( ⑸.液环真空泵 liquid ring vacuum pump: x}AWWmXv ⑹.旋片真空泵 sliding vane rotary vacuum pump: 6Nj\N oS ⑺.定片真空泵 rotary piston vacuum pump: /XS}<!)% ⑻.滑阀真空泵 rotary plunger vacuum pump: 1q}iUnR ⑼.余摆线真空泵 trochoidal vacuum pump: jNaK] ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: Q;)[~p ⑾.罗茨真空泵 roots vacuum pump: \uQ(-ji 1-2.动量传输泵 kinetic vacuum pump: Pqo"~&Y|~ ⑴.牵引分子泵molecular drag pump: -+Kx^V#'R ⑵.涡轮分子泵turbo molecular pump: \[B5j0vV, ⑶.喷射真空泵ejector vacuum pump: vtCt6M ⑷.液体喷射真空泵liquid jet vacuum pump: [,8@oM# ⑸.气体喷射真空泵gas jet vacuum pump: -%5*c61 ⑹.蒸汽喷射真空泵vapor jet vacuum pump : D;.-e ⑺.扩散泵diffusion pump : ou6yi;
l% ⑻.自净化扩散泵self purifying diffusion pump: XBF#ILJ ⑼.分馏扩散泵 fractionating diffusion pump : uPr@xff ⑽.扩散喷射泵diffusion ejector pump : oa}-=hG ⑾.离子传输泵ion transfer pump: L'H'E, 1-3.捕集真空泵 entrapment vacuum pump: ucL}fnY1 ⑴吸附泵adsorption pump: U;`N:~|p# ⑵.吸气剂泵 getter pump: crz )F" ⑶.升华(蒸发)泵 sublimation (evaporation)pump : (}V.xi ⑷.吸气剂离子泵getter ion pump: QO[! ⑸.蒸发离子泵 evaporation ion pump: eL0U5># ⑹.溅射离子泵sputter ion pump: vfK^^S ⑺.低温泵cryopump: SBzJQt@Hs ltwX- 2.真空泵零部件 -,uTAk0+@ 2-1.泵壳 pump case: 4sP0oe[h 2-2.入口 inlet: i,8h
B(M! 2-3.出口outlet: ;;2XLkWu 2-4.旋片(滑片、滑阀)vane; blade : ]p\7s 2-5.排气阀discharge valve: z{]$WVs:^ 2-6.气镇阀gas ballast valve: b" 1a7 2-7.膨胀室expansion chamber: (]w_}E]N 2-8.压缩室compression chamber: iyB02\d 2-9.真空泵油 vacuum pump oil: ~-.}]N+([ 2-10.泵液 pump fluid: dPc*!xrq 2-11.喷嘴 nozzle: f<=<:+ 2-13.喷嘴扩张率nozzle expansion rate: s+#gH@c 2-14.喷嘴间隙面积 nozzle clearance area : P6u9Ngay 2-15.喷嘴间隙nozzle clearance: Y}&//S A 2-16.射流jet: Y4_/G4C 2-17.扩散器diffuser: cV\(Z6u 2-18.扩散器喉部diffuser thoat: ZgP=maQk 2-19.蒸汽导管vapor tube(pipe;chimney): Aq yR+ 2-20.喷嘴组件nozzle assembly: }%c2u/PQ 2-21.下裙skirt: MCZTeYnx %YkJA: 3.附件 f*,jhJ_I 3-1阱trap: Oh3AbpTT ⑴.冷阱 cold trap: $5yH(Z[[ ⑵.吸附阱sorption trap: IDQ@h`"B ⑶.离子阱ion trap: $sTbFY ⑷.冷冻升华阱 cryosublimation trap: ;PCnEs 3-2.挡板baffle: JR8 b[Oj.S 3-3.油分离器oil separator: "1FPe63\*O 3-4.油净化器oil purifier: {_&'tXL 3-5.冷凝器condenser: Hbu8gqu 0x7F~%%2 4.泵按工作分类 =iW!Mq 4-1.主泵main pump: 'r~,~AI 4-2.粗抽泵roughing vacuum pump: X; I:i%- 4-3.前级真空泵backing vacuum pump: ,pM~Phmp 4-4.粗(低)真空泵 roughing(low)vacuum pump: ]VtVw^ ir 4-5.维持真空泵holding vacuum pump: 0{^@kxV 4-6.高真空泵high vacuum pump: DDxbIkt 4-7.超高真空泵ultra-high vacuum pump: }Qyuy~-&^ 4-8.增压真空泵booster vacuum pump: VT8PV5z /j/,@,lw7z 5.真空泵特性 ,V1/(|[h 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ZUePHI-dP 5-2.真空泵的抽气量Q throughput of vacuum pump:。 )hs"P%Zg 5-3.起动压力starting pressure: K&Ner(/X`6 5-4.前级压力 backing pressure : }(k#,&Fv` 5-5.临界前级压力 critical backing pressure: d3-F?i
5d 5-6.最大前级压力maximum backing pressure: 1/X@~ 5-7.最大工作压力maximum working pressure: =r"-Pm{ 5-8.真空泵的极限压力ultimate pressure of a pump: ,cZhkXd
5-9.压缩比compression ratio: C))5,aX 5-10.何氏系数Ho coefficient: q.0Evr: 5-11.抽速系数speed factor: cq lA"Eof 5-12.气体的反扩散back-diffusion of gas: K.) ionb 5-13.泵液返流back-streaming of pump fluid: 5.m&93P 5-14.返流率back-streaming rate x93h{Kf 5-15.返迁移back-migration: 'NJGez'b, 5-16.爆腾bumping: w0qrh\3du 5-17.水蒸气允许量qm water vapor tolerable load: wJyrF 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: B7PkCS&X 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: :btb|^C 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump MDV<[${ 3. 1.一般术语 EQe !&; 1-1.压力计pressure gauge: 9{[I| 1-2.真空计vacuum gauge: \9" ⑴.规头(规管)gauge head: g)0>J ⑵.裸规nude gauge : ?*DM|hzOi ⑶.真空计控制单元gauge control unit : paKur%2u ⑷.真空计指示单元gauge indicating unit : x}\x3U 0lpkG
="&r 2.真空计一般分类 e&~vO| 3w% 2-1.压差式真空计differential vacuum gauge: ?,s]5 2-2.绝对真空计 absolute vacuum gauge: pH&*5=t} 2-3.全压真空计total pressure vacuum gauge: [|iWLPO1&k 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: R[_Q}W'HG 2-5.相对真空计relative vacuum gauge : #IJm*_J< AWaptw_p*
3.真空计特性 grD[7;1~:) 3-1.真空计测量范围pressure range of vacuum gauge: z$g
cK>@l 3-2.灵敏度系数sensitivity coefficient: MB7UI8 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 7Qdf#DG 3-5.规管光电流photon current of vacuum gauge head: 8;PS>9< 3-6.等效氮压力equivalent nitrogen pressure : Cws;6i*=@ 3-7.X射线极限值 X-ray limit: )6+Z9 9w 3-8.逆X射线效应anti X-ray effect: /80H.|8O 3-9.布利尔斯效应blears effect: m(>MP/ $4>(} 4.全压真空计 1O#]qZS}] 4-1.液位压力计liquid level manometer: CdBpz/ 4-2.弹性元件真空计elastic element vacuum gauge: vEy0DHEE 4-3.压缩式真空计compression gauge: Zv]'9,cbk 4-4.压力天平pressure balance: yq H 4-5.粘滞性真空计viscosity gauge : TWzlF>4N 4-6.热传导真空计thermal conductivity vacuum gauge : )Ehi8 4-7.热分子真空计thermo-molecular gauge: o*MiKgQ& 4-8.电离真空计ionization vacuum gauge: |>^5G@e 4-9.放射性电离真空计radioactive ionization gauge: &9Y ^/W 4-10.冷阴极电离真空计cold cathode ionization gauge: n?KhBJx 4 4-11.潘宁真空计penning gauge: J#.f%VJ 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: m+UWvUB) 4-13.放电管指示器discharge tube indicator: ^fiJxU 4-14.热阴极电离真空计hot cathode ionization gauge: # &,W x 4-15.三极管式真空计triode gauge: GB%kxtGD;\ 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: s5bqS'% 4-17.B-A型电离真空计Bayard-Alpert gauge: w"`Zf7a{/ 4-18.调制型电离真空计modulator gauge: 6|mHu2qXm 4-19.抑制型电离真空计suppressor gauge: FR9w0{o 4-20.分离型电离真空计extractor gauge:
=oE(ur 4-21.弯注型电离真空计bent beam gauge: ?^whK<"] 4-22.弹道型电离真空计 orbitron gauge : reQr=OAez 4-23.热阴极磁控管真空计hot cathode magnetron gauge: QdIx@[+WOq K`=9"v'f+ 5.分压真空计(分压分析器) Y/x>wNW 5-1.射频质谱仪radio frequency mass spectrometer: @T"-%L8PL 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: m?<^b_a} 5-3.单极质谱仪momopole mass spectrometer: `uKsFXM 5-4.双聚焦质谱仪double focusing mass spectrometer: /!#A'#Z 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Ypx5:gm|J 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: T_)g/,5> 5-7.回旋质谱仪omegatron mass spectrometer: 3F?7oMNIh 5-8.飞行时间质谱仪time of flight mass spectrometer: oF0DprP@ U{\9mt7b! 6.真空计校准 ["O_Phb| 6-1.标准真空计reference gauges: C669:% 6-2.校准系统system of calibration: lfAiW;giJ 6-3.校准系数K calibration coefficient: k vpkWD; 6-4.压缩计法meleod gauge method: E^iShe 6-5.膨胀法expansion method: wBWqibY| 6-6.流导法flow method: o;9 G{Xj3@ 4. 1.真空系统vacuum system f,|g|&C 1-1.真空机组pump system: `h|Y0x 1-2.有油真空机组pump system used oil : cR{F|0X 1-3.无油真空机组oil free pump system V3%
>TNp 1-4.连续处理真空设备continuous treatment vacuum plant: CnpQdI 1-5.闸门式真空系统vacuum system with an air-lock: GlHP`&;UH 1-6.压差真空系统differentially pumped vacuum system: b'ZzDYN 1-7.进气系统gas admittance system: 4tEAi4H|`@ 4Q!|fn0Sv 2.真空系统特性参量 hj=qWGRgI 2-1.抽气装置的抽速volume flow rate of a pumping unit : dWx@<(`OC 2-2.抽气装置的抽气量throughput of a pumping unit : d,b]#fj 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 4@+']vN4 2-4.真空系统的漏气速率leak throughput of a vacuum system: )oALB vX 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: #bJp)&LO 2-6.极限压力ultimate pressure: q@G}Hjn 2-7.残余压力residual pressure: i[?VF\Y( 2-8.残余气体谱residual gas spectrum: @Di!~e6 2-9.基础压力base pressure: K'}I?H~P_ 2-10.工作压力working pressure: 4ClSl#X#i 2-11.粗抽时间roughing time: N%,zME 2-12.抽气时间pump-down time: 67;6nXG0K 2-13.真空系统时间常数time constant of a vacuum system: V|hwT^h 2-14.真空系统进气时间venting time: S
n<X Bq;GO 3.真空容器 +1a3^A\ 3-1.真空容器;真空室vacuum chamber: cij8'("+! 3-2.封离真空装置sealed vacuum device: ]HaX.Z< 3-3.真空钟罩vacuum bell jar: g[R4/]K^$ 3-4.真空容器底板vacuum base plate: >=d 5Scix 3-5.真空岐管vacuum manifold: F [Lg,} 3-6.前级真空容器(贮气罐)backing reservoir: 52 *ii 3-7.真空保护层outer chamber: ;[79Ewd#$ 3-8.真空闸室vacuum air lock: .EPv4[2%F8 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: v8WT?% Dpwqg3,
4.真空封接和真空引入线 QI'-I\Co 4-1.永久性真空封接permanent seal : =]5f\f6 4.2.玻璃分级过渡封接graded seal : rq^%)tR 4-3.压缩玻璃金属封接compression glass-to-metal seal: em95ccs'- 4-4.匹配式玻璃金属封接matched glass-to-metal seal: t-5K
dLB 4-5.陶瓷金属封接ceramic-to-metal seal: c|d,:u# 4-6.半永久性真空封接semi-permanent seal : ie11syhV" 4-7.可拆卸的真空封接demountable joint:
>S-JAPuO 4-8.液体真空封接liquid seal Y]=k"]:% 4-9.熔融金属真空封接molten metal seal: d&+0JI< 4-10.研磨面搭接封接ground and lapped seal: hj&~Dn( 4-11.真空法兰连接vacuum flange connection: t`'jr=e,~ 4-12.真空密封垫vacuum-tight gasket: `dD_"Hdt 4-13.真空密封圈ring gasket: L
}3eZ- 4-14.真空平密封垫flat gasket: \4LTViY] 4-15.真空引入线feedthrough leadthrough: Q lA?dXQ 4-16.真空轴密封shaft seal: z(8G=C 4-17.真空窗vacuum window: e/_QS}OA 4-18.观察窗viewing window: j74hWz+p4 "G-h8IN^O 5.真空阀门 0WfnX>(C7R 5-1.真空阀门的特性characteristic of vacuum valves: E]8uj8K3] ⑴.真空阀门的流导conductance of vacuum valves: xmEom ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: eX>*}pI 5-2.真空调节阀regulating valve: _g
fmo 5-3.微调阀 micro-adjustable valve: {NQCe0S+p 5-4.充气阀charge valve: `|Hk+V 5-5.进气阀gas admittance valve: ).IyjHY 5-6.真空截止阀break valve:
,v
2^Ui 5-7.前级真空阀backing valve: SB08-G2 5-8.旁通阀 by-pass valve: ,[T/O\k 5-9.主真空阀main vacuum valve: dA (n,@{ 5-10.低真空阀low vacuum valve: O@
H.k<zn 5-11.高真空阀high vacuum valve: c{dabzLy 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: \EU^`o+ 5-13.手动阀manually operated valve: 4;W{#jk 5-14.气动阀pneumatically operated valve: j#2EQ 5-15.电磁阀electromagnetically operated valve: q*4U2_^. 5-16.电动阀valve with electrically motorized operation: w~'}uh 5-17.挡板阀baffle valve: :s&dn%5N" 5-18.翻板阀flap valve: _9t1aP5 5-19.插板阀gate valve: Cc*R3vHM6 5-20.蝶阀butterfly valve: 3^nH>f-Y #AB5}rPEI 6.真空管路 rjiHP;-t1 6-1.粗抽管路roughing line: GB^ `A 6-2.前级真空管路backing line: UgK
c2~ 6-3.旁通管路;By-Pass管路 by-pass line: iF Mf[qBg 6-4.抽气封口接头pumping stem: {l5fKVb\C 6-5.真空限流件limiting conductance: \y:48zd 6-6.过滤器filter: ~@Q]@8Tv\ 5. 1.一般术语 @{q<"hT 1-1真空镀膜vacuum coating: 0}qlZFB 1-2基片substrate: <K<#)mcv 1-3试验基片testing substrate: 5-$D<}Z 1-4镀膜材料coating material: d@1^U9sf 1-5蒸发材料evaporation material: ^9Cu?!xu0 1-6溅射材料sputtering material: 'fGKRd|) 1-7膜层材料(膜层材质)film material: A)3H`L 1-8蒸发速率evaporation rate: 2_)UHTwsK 1-9溅射速率sputtering rate: +0z7}u\x 1-10沉积速率deposition rate: #T2J + 1-11镀膜角度coating angle: %7}j|eS)G TwI s_r: 2.工艺 Y I;iG[T,& 2-1真空蒸膜vacuum evaporation coating: {+7FBdxVB
(1).同时蒸发simultaneous evaporation: ls&H oJ7 (2).蒸发场蒸发evaporation field evaporation: T}=^D= (3).反应性真空蒸发reactive vacuum evaporation: <$zhNu~ (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: jLt3jN (5).直接加热的蒸发direct heating evaporation: ![_0GFbT (6).感应加热蒸发induced heating evaporation: Y1I)w^}: (7).电子束蒸发electron beam evaporation: *9$SFe|&n: (8).激光束蒸发laser beam evaporation: bKGX>
%- (9).间接加热的蒸发indirect heating evaporation: $C5*@`GM$ (10).闪蒸flash evaportion: K)mQcB-"? 2-2真空溅射vacuum sputtering: o h\$u5 (1).反应性真空溅射 reactive vacuum sputtering: [RN]?, (2).偏压溅射bias sputtering: x51R:x(p (3).直流二级溅射direct current diode sputtering: <7F-WR/2n (4).非对称性交流溅射asymmtric alternate current sputtering: aK
-x{ (5).高频二极溅射high frequency diode sputtering: B+U:=591 (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1n!:L!,` (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: (@5`beEd (8).离子束溅射ion beam sputtering: SU4i'o (9).辉光放电清洗glow discharge cleaning: 2;WbXc!#! 2-3物理气相沉积PVD physical vapor deposition: 65qqs|&w;[ 2-4化学气相沉积CVD chemical vapor deposition: T\bP8D 2-5磁控溅射magnetron sputtering: e9RYk:O 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: NT.#U?9c 2-7空心阴极离子镀HCD hollow cathode discharge deposition: )]FXUz|; 2-8电弧离子镀arc discharge deposition: k:run2K $1|E(d1 3.专用部件 ;]Q6K9.d8 3-1镀膜室coating chamber: {FI*oO1A~ 3-2蒸发器装置evaporator device: [UI>SN 3-3蒸发器evaporator: #8"oqqYi 3-4直接加热式蒸发器evaporator by direct heat: "%Y=+ 3-5间接加热式蒸发器evaporator by indirect heat:
m","m 3-7溅射装置sputtering device: Dk^AnMx%_ 3-8靶target: 2I }p X9 3-10时控挡板timing shutter: A8vd@0 3-11掩膜mask: S\8v)|Pr 3-12基片支架substrate holder: k Alxm{ 3-13夹紧装置clamp: Z>g>OPu 3-14换向装置reversing device: ApeqbD5g& 3-15基片加热装置substrate heating device: >lUPOc 3-16基片冷却装置substrate colding device: Ld}?da Pj \Dq'~
d 4.真空镀膜设备 +`k30-<P 4-1真空镀膜设备vacuum coating plant: *
&:_Vgu (1).真空蒸发镀膜设备vacuum evaporation coating plant: )8W! | (2).真空溅射镀膜设备vacuum sputtering coating plant: e7@ m i 4-2连续镀膜设备continuous coating plant: Zyz#xMmM 4-3半连续镀膜设备semi- continuous coating plant ==m[t-
9x 6. 1.漏孔 WSH[*jMA 1-1漏孔leaks: ?QT6q]|d0+ 1-2通道漏孔channel leak: >pfeP"[(3 1-3薄膜漏孔membrane leak: K9k!P8Rd 1-4分子漏孔molecular leak: %o%V4K* 1-5粘滞漏孔vixcous leak: p lnH 1-6校准漏孔calibrated leak: 1$vG Q 1-7标准漏孔reference leak : 6[A\cs 1-8虚漏virtual leak: ]E<Z5G1HD 1-9漏率leak rate: ,7&\jET5^0 1-10标准空气漏率standard air leak rate: ZgxB7zl// 1-11等值标准空气漏率equivalent standard air leak rate: >[;@
[4} 1-12探索(示漏)气体: z:#]P0 Deh3Dtg/k 2.本底 +zMPkbP6 2-1本底background: |z=`Ur@) 2-2探索气体本底search gas background : J#Hh4Kc 2-3漂移drift: JfN5#+_i 2-4噪声noise: H 1kI+YJ@ [G|. 3.检漏仪 gE2(E0H 3-1检漏仪leak detector: 5 qfvHQ ~M 3-2高频火花检漏仪H.F. spark leak detector: Z?'CS|ud 3-3卤素检漏仪halide leak detector: Ol }5ry 3-4氦质谱检漏仪helium mass spectrometer leak detector: ^~[7])}g6 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: 7<^+)DsS? ~rBFP) 4.检漏 Qt+D ,X 4-1气泡检漏leak detection by bubbles: A{zqr^/h 4-2氨检漏leak detection by ammonia: rc8HZ 4-3升压检漏leak detection of rise pressure: Ea@0>_U| 4-4放射性同位素检漏radioactive isotope leak detection: ZR}v_]l^ 4-5荧光检漏fluorescence leak detection D j9aTO 7. 1.一般术语 o7!A(Eu 1-1真空干燥vacuum drying: IEy$2f>Ns 1-2冷冻干燥freeze drying : _h-agn4[i 1-3物料material: jV sH 1-4待干燥物料material to be dried: `}),wBq 1-5干燥物料dried material : VAL?
Z 1-6湿气moisture;humidity: k2D*`\
D 1-7自由湿气free moisture: crIF5^3Yby 1-8结合湿气bound moisture: ':4<[Vk 1-9分湿气partial moisture: :b44LXKCP 1-10含湿量moisture content: l[T-Ak 1-11初始含湿量initial moisture content: vMp=\U-~^ 1-12最终含湿量final residual moisture: caQ1SV^{9 1-13湿度degree of moisture ,degree of humidity : ^@V*:n^ 1-14干燥物质dry matter : ,zoHmV1Wd+ 1-15干燥物质含量content of dry matter: .z,-ThTH@\ $vXY"-k 2.干燥工艺
BjH|E@z 2-1干燥阶段stages of drying : =T[P (1).预干燥preliminary dry: ,"`20.Lv (2).一次干燥(广义)primary drying(in general): G!I++M" (3).一次干燥(冷冻干燥)primary drying(freeze-drying): zq</(5H (4).二次干燥secondary drying: &s`)_P[ 2-2.(1).接触干燥contact drying: swj\X,{ (2).辐射干燥 drying by radiation : 'bl9fO4v (3).微波干燥microwave drying: 1-p#}VX (4).气相干燥vapor phase drying: ^s6~*n<fH (5).静态干燥static drying:
(sKg*G2 (6).动态干燥dynamic drying: LG,? ,%_s 2-3干燥时间drying time: wMCMrv: 2-4停留时间length of stay(in the drying chamber): "> Qxb.Y} 2-5循环时间cycle time: h~#F2#. 2-6干燥率 dessication ratio : @sn:%/x _ 2-7去湿速率mass flow rate of humidity: ZvF#J_%gE5 2-8单位面积去湿速率mass flow rate of humidity per surface area: O<s7VHj 2-9干燥速度 drying speed : W@AHE?s6g 2-10干燥过程drying process: %_E5B6xi{ 2-11加热温度heating temperature: KJT N"hF 2-12干燥温度temperature of the material being dried :
M]5l-i$ 2-13干燥损失loss of material during the drying process : K7&]|^M9 2-14飞尘lift off (particles): fh =R 2-15堆层厚度thickness of the material: {Ycgq%1>] F[\T'{ 3.冷冻干燥 #eKKH]J/ 3-1冷冻freezing: ,.P]5 lE (1).静态冷冻static freezing: _W(xO
|,M (2).动态冷冻dynamic freezing: ;b [>{Q; (3).离心冷冻centrifugal freezing: )2).kL> (4).滚动冷冻shell freezing: LkJq Bg (5).旋转冷冻spin-freezing: TYuP
EVEXZ (6).真空旋转冷冻vacuum spin-freezing: _(f@b1O~ (7).喷雾冷冻spray freezing: z\tY A (8).气流冷冻air blast freezing: IA0vSF: 3-2冷冻速率rate of freezing: ByjfPb# 3-3冷冻物料frozen material: A/=cGE 3-4冰核ice core: .K~V DUu 3-5干燥物料外壳envelope of dried matter: *m"@*O' 3-6升华表面sublimation front: k`>qb8, 3-7融化位置freezer burn: M
%zf?>]) ',hoe 4.真空干燥设备;真空冷冻干燥设备 -!+i
^r 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ,zZH>P 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: Z6gwAvf< 4-3加热表面heating surface: LF.i0^#J 4-4物品装载面shelf : 9ls1y=M8J 4-5干燥器的处理能力throughput (of the vacuum drying chamber): %u%;L+0Q[ 4-6单位面积干燥器处理能力throughput per shelf area: eW.qMx#:od 4-7冰冷凝器ice condenser: g s1 4-8冰冷凝器的负载load of the ice condenser: s8(Z&pQ 4-9冰冷凝器的额定负载rated load of the ice condenser XzV>q~I3|E 8. 1.一般术语 bzpi7LKN 1-1试样sample : i/!{k2 (1).表面层surface layer: '(r?($s (2).真实表面true surface: h(q4
B~ (3).有效表面积effective surface area: >%6j -:S (4).宏观表面;几何表面macroscopic surface area; geometric surface area: W\<OCD%X (5).表面粒子密度surface particle density: e#5WX (6).单分子层monolayer: Onqapm0 (7).表面单分子层粒子密度monolayer density: ;Uch (8).覆盖系数coverage ratio: u^C\aujg 1-2激发excitation: ,?U(PEO\f (1).一次粒子primary particle: 5Zc (2).一次粒子通量primary particle flux: o$bQ-_B` (3).一次粒子通量密度density of primary particle flux: LL:N/1ysG (4).一次粒子负荷primary particle load: 2FL_!;p;2E (5).一次粒子积分负荷integral load of primary particle: :6C R~p (6).一次粒子的入射能量energy of the incident primary particle: :F5(]g 7 (7).激发体积excited volume: ce4rhtkV (8).激发面积excited area: uF%N`e^S (9).激发深度excited death: aU +uPP (10).二次粒子secondary particles: 49/2E@G4. (11).二次粒子通量secondary particle flux: 7g8\q@', (12).二次粒子发射能energy of the emitted secondary particles: hDJ+Rk@ (13).发射体积emitting volume: hQ%X0X, (14).发射面积emitting area: sk5=$My (15).发射深度emitting depth: 0* ^f
EoV (16).信息深度information depth: LCRWC`%& (17).平均信息深度mean information depth: 1\-lAk!
1-3入射角angle of incidence: =S^ vIo) 1-4发射角angle of emission: !pa7]cZ 1-5观测角observation: ~&0lWa 1-6分析表面积analyzed surface area: E]{0lG`l 1-7产额 yield : Yo5ged]i 1-8表面层微小损伤分析minimum damage surface analysis: !N:w?zsp 1-9表面层无损伤分析non-destructive surface analysis: $m.'d*e5 1-10断面深度分析 profile analysis in depth; depth profile analysis : 3Qv9=q|[b 1-11可观测面积observable area: HE4S%#bH> 1-12可观测立体角observable solid angle : ,iiI5FR 1-13接受立体角;观测立体角angle of acceptance: :'H}b*VWx 1-14角分辨能力angular resolving power: ]w)uo4<^J 1-15发光度luminosity: 8/"uS ;yP 1-16二次粒子探测比detection ratio of secondary particles: AnsJ3C 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: >&Ye(3w& 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: dg N#" 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: qk&BCkPT 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: Hb!A\;> 1-21本底压力base pressure: m&*0<N 1-22工作压力working pressure: Dxr4B< 00W_XhJ 2.分析方法 Mv%B#J 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ~8Ef`zL (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : }
F*=+n (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: usugjx^p 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: "g!/^A!! 2-3离子散射表面分析ion scattering spectroscopy: \<=.J`o{ 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 3z
5"Ckzb 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: )]}68}9 2-6离子散射谱仪ion scattering spectrometer: Q|Pm8{8 2-7俄歇效应Auger process: a- /p/
I-% 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: ,l)AYu!q4F 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: xNVSWi, 2-10光电子谱术photoelectron spectroscopy : .fzns20u (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: xUs1-O1i (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: KC\W6|NtGj 2-11光电子谱仪photoelectron spectrometer: ~r]$(V n
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: U%2{PbL
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: kdm@1x 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): _ZuI x=! 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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