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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 t1n'Ecm(  
--------------------------------------------------- x1|5q/I  
真空术语 N{q5E,}  
$QNfy.6Tn  
1.标准环境条件 standard ambient condition: x|F6^d   
2.气体的标准状态 standard reference conditions forgases: ZZ]/9oiF%  
3.压力(压强)p pressure: ! r.X.C  
4.帕斯卡Pa pascal: TJ?}5h5  
5.托Torr torr: B5=L</Aj  
6.标准大气压atm standard atmosphere: |jEKUTv,G  
7.毫巴mbar millibar: `5O<U~'d  
8.分压力 partial pressure: z]gxkol\  
9.全压力 total pressure: {pd%I  
10.真空 vacuum: wZE[we^Q"  
11.真空度 degree of vacuum: 96}/;e]@  
12.真空区域 ranges of vacuum: Nr:%oD_G*  
13.气体 gas: *yiJw\DRN  
14.非可凝气体 non-condensable gas: m&Ms[X  
15.蒸汽vapor: [<1i[\^  
16.饱和蒸汽压saturation vapor pressure: p%xo@v(  
17.饱和度degree of saturation: dK|MQ <  
18.饱和蒸汽saturated vapor: !`=r('l  
19.未饱和蒸汽unsaturated vapor: \^|ncu:T  
20.分子数密度n,m-3 number density of molecules: .NQoqXR  
21.平均自由程ι、λ,m mean free path: !+U#^2Gz  
22.碰撞率ψ collision rate: %nFZA)B[  
23.体积碰撞率χ volume collision rate: Q\m"n^XN  
24.气体量G quantity of gas: ` *$^rQS  
25.气体的扩散 diffusion of gas: &{Uaa  
26.扩散系数D diffusion coefficient; diffusivity: vkc(-n  
27.粘滞流 viscous flow: l"CHI*  
28.粘滞系数η viscous factor: 0}Kl47}aD  
29.泊肖叶流 poiseuille flow: MCz +l0  
30.中间流 intermediate flow: va~:oA  
31.分子流 molecular flow: _^#PV}  
32克努曾数 number of knudsen: M}(4>W  
33.分子泻流 molecular effusion; effusive flow: h*_r=' E  
34.流逸 transpiration: }{=%j~V;&  
35.热流逸 thermal transpiration: &fiDmUxj  
36.分子流率qN molecular flow rate; molecular flux: Wq&TbWR  
37.分子流率密度 molecular flow rate density; density of molecular flux: UrN$nhH  
38.质量流率qm mass flow rare: |Ro\2uSr  
39.流量qG throughput of gas: kki]6_/n  
40.体积流率qV volume flow rate: q'C'S#qqn  
41.摩尔流率qυ molar flow rate: nUd(@@%m  
42.麦克斯韦速度分布 maxwellian velocity distribution: :3Ty%W&&  
43.传输几率Pc transmission probability: S9U9;>g  
44.分子流导CN,UN molecular conductance: r/:9j(yxr  
45.流导C,U conductance: i T 4H@  
46.固有流导Ci,Ui intrinsic conductance: XfViLBY( >  
47.流阻W resistance: 2>ce(4Gky  
48.吸附 sorption: 'ZL)-kbI  
49.表面吸附 adsorption: "O9uz$  
50.物理吸附physisorption: :L*CL 8m  
51.化学吸附 chemisorption: ^R>&^"oI  
52.吸收absorption: H{p+gj^J  
53.适应系数α accommodation factor: zh*NRN  
54.入射率υ impingement rate: i]8zZRe  
55.凝结率condensation rate: (a&.Ad0{  
56.粘着率 sticking rate: tnRq?  
57.粘着几率Ps sticking probability: dRWp/3 }  
58.滞留时间τ residence time: wQPjo!FEX  
59.迁移 migration: F'pD_d9]e  
60.解吸 desorption: +qzsC/y  
61.去气 degassing: N@tzYD|hA  
62.放气 outgassing: u^!-Z)W  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: He"> kJx  
64.蒸发率 evaporation rate: <:RU,  
65.渗透 permeation: FjkE^o>  
66.渗透率φ permeability: Vwm\a]s  
67.渗透系数P permeability coefficient rb`C:#j{J  
2.   1.真空泵 vacuum pumps pBK[j ([  
1-1.容积真空泵 positive displacement pump: ME0ivr*=:  
⑴.气镇真空泵 gas ballast vacuum pump: Ms{v;fT  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: #G)ZhgB^  
⑶.干封真空泵 dry-sealed vacuum pump: %S$P+B?  
⑷.往复真空泵 piston vacuum pump: IF5+&O  
⑸.液环真空泵 liquid ring vacuum pump: *( D_g!a  
⑹.旋片真空泵 sliding vane rotary vacuum pump: JGGss5  
⑺.定片真空泵 rotary piston vacuum pump: 0DS<(  
⑻.滑阀真空泵 rotary plunger vacuum pump: ;9B:E"K?@1  
⑼.余摆线真空泵 trochoidal vacuum pump: L.+5`&  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: T3'dfe U  
⑾.罗茨真空泵 roots vacuum pump: A6TNtXk  
1-2.动量传输泵 kinetic vacuum pump: uysGOyi<u  
⑴.牵引分子泵molecular drag pump: olK%TM[Y  
⑵.涡轮分子泵turbo molecular pump: ~[ve?51  
⑶.喷射真空泵ejector vacuum pump: Tvf]OJ9N  
⑷.液体喷射真空泵liquid jet vacuum pump:  '=%vf  
⑸.气体喷射真空泵gas jet vacuum pump: G^)|c<'M  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : D{a{$P r  
⑺.扩散泵diffusion pump : ==UH)o`?8  
⑻.自净化扩散泵self purifying diffusion pump: O3Ks|%1  
⑼.分馏扩散泵 fractionating diffusion pump : lFI"U^xC  
⑽.扩散喷射泵diffusion ejector pump : { #>@h7  
⑾.离子传输泵ion transfer pump: l ^\5Jr03  
1-3.捕集真空泵 entrapment vacuum pump: +de.!oY  
⑴吸附泵adsorption pump: 4i/TEHQ  
⑵.吸气剂泵 getter pump: ^[^uDE <  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : Bv3?WW  
⑷.吸气剂离子泵getter ion pump: s&8QRI.  
⑸.蒸发离子泵 evaporation ion pump: *K-,<hJ#L  
⑹.溅射离子泵sputter ion pump: 4vE,nx=  
⑺.低温泵cryopump: s{< rc>  
4s0>QD$J  
2.真空泵零部件 Q0ev*MS9Z  
2-1.泵壳 pump case: {PYN3\N,  
2-2.入口 inlet: X$PT-~!a  
2-3.出口outlet: `,\WhJ?9  
2-4.旋片(滑片、滑阀)vane; blade : {9'"!fH  
2-5.排气阀discharge valve: ]yCmGt+b  
2-6.气镇阀gas ballast valve: )h>Cp,|{  
2-7.膨胀室expansion chamber: -pa.-@  
2-8.压缩室compression chamber: ) ,*&rd!  
2-9.真空泵油 vacuum pump oil: Gh42qar`  
2-10.泵液 pump fluid: :q^g+Bu=  
2-11.喷嘴 nozzle: a/`fJY6rR  
2-13.喷嘴扩张率nozzle expansion rate: 36&7J{MU  
2-14.喷嘴间隙面积 nozzle clearance area : hMi!H.EX.  
2-15.喷嘴间隙nozzle clearance: n'%*vdHK m  
2-16.射流jet: .+{nfmc,c  
2-17.扩散器diffuser: K6!`b( v#  
2-18.扩散器喉部diffuser thoat:  ,ulTZV  
2-19.蒸汽导管vapor tube(pipe;chimney): f,`FbT  
2-20.喷嘴组件nozzle assembly: h/eKVRGs"  
2-21.下裙skirt: X+bLLW>&  
OuS{ve  
3.附件 \p [!@d^  
3-1阱trap: v8-F;>H  
⑴.冷阱 cold trap: 7d'4"c;*;  
⑵.吸附阱sorption trap: B'atwgI0  
⑶.离子阱ion trap: 49Ht I9@  
⑷.冷冻升华阱 cryosublimation trap: ?#slg8[  
3-2.挡板baffle: v%86JUlK.  
3-3.油分离器oil separator: od?Q&'A  
3-4.油净化器oil purifier: o.}^6.h"  
3-5.冷凝器condenser: BjOrQAO  
IO]Oo3  
4.泵按工作分类 ] p'+F  
4-1.主泵main pump: 5 BcuLRId:  
4-2.粗抽泵roughing vacuum pump: YN"102CK  
4-3.前级真空泵backing vacuum pump: Jg;Hg[  
4-4.粗(低)真空泵 roughing(low)vacuum pump: k= nfo-h  
4-5.维持真空泵holding vacuum pump: dpE\eXoa,  
4-6.高真空泵high vacuum pump: }wj*^>*  
4-7.超高真空泵ultra-high vacuum pump: >i@gR  
4-8.增压真空泵booster vacuum pump: XD%?'uUQ_  
wyAqrf  
5.真空泵特性 Me5umA  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 5g/^wKhKG  
5-2.真空泵的抽气量Q throughput of vacuum pump:。  $@8\9Y {  
5-3.起动压力starting pressure: ] p+t>'s  
5-4.前级压力 backing pressure : "eh"' Z  
5-5.临界前级压力 critical backing pressure: J,m.LpY  
5-6.最大前级压力maximum backing pressure: bs%]xf ~D;  
5-7.最大工作压力maximum working pressure: (IJf2  
5-8.真空泵的极限压力ultimate pressure of a pump: ~3f#cEP>d}  
5-9.压缩比compression ratio: },[S9I`p  
5-10.何氏系数Ho coefficient: \mWXr*;  
5-11.抽速系数speed factor: ]2b" oHg  
5-12.气体的反扩散back-diffusion of gas: .7E-  
5-13.泵液返流back-streaming of pump fluid: !jYV,:'  
5-14.返流率back-streaming rate hTVN`9h7  
5-15.返迁移back-migration: u b4(mS  
5-16.爆腾bumping: >+,1@R  
5-17.水蒸气允许量qm water vapor tolerable load: s/P\w"/fN  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: K"-N:OV  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ,u~\$ Az6  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 9n8;eE08  
3.   1.一般术语 >KGQ#hnH  
1-1.压力计pressure gauge: NSb< 7_L  
1-2.真空计vacuum gauge: S$muV9z2=  
⑴.规头(规管)gauge head: o L6[i'H|  
⑵.裸规nude gauge : DgOoEHy[  
⑶.真空计控制单元gauge control unit : F<IqKgGzH  
⑷.真空计指示单元gauge indicating unit : {"{J*QH  
WxO*{`T!  
2.真空计一般分类 nW|[poQK  
2-1.压差式真空计differential vacuum gauge: 9h*$P:S;1v  
2-2.绝对真空计 absolute vacuum gauge: |U7{!yy%MF  
2-3.全压真空计total pressure vacuum gauge: 3]} W  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: >|z=-hqPK  
2-5.相对真空计relative vacuum gauge : BKvF,f/g  
/hI#6k8o_  
3.真空计特性 OQ!mL3f  
3-1.真空计测量范围pressure range of vacuum gauge: _}JygOew  
3-2.灵敏度系数sensitivity coefficient: O8dDoP\F2  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): b[RBp0]x  
3-5.规管光电流photon current of vacuum gauge head: @X\nY</E#M  
3-6.等效氮压力equivalent nitrogen pressure : |C-B=XE;3  
3-7.X射线极限值 X-ray limit: k"Sw,"e>+  
3-8.逆X射线效应anti X-ray effect: YT&_{nL#\  
3-9.布利尔斯效应blears effect: 5-]%D(y  
cs@5K$v  
4.全压真空计 g3x192f  
4-1.液位压力计liquid level manometer: hk,Q=};  
4-2.弹性元件真空计elastic element vacuum gauge: K=06I  
4-3.压缩式真空计compression gauge: !4oYQB  
4-4.压力天平pressure balance: #3/l4`/j  
4-5.粘滞性真空计viscosity gauge : n,Ux>L  
4-6.热传导真空计thermal conductivity vacuum gauge : &V$'{  
4-7.热分子真空计thermo-molecular gauge: \vm'D'9  
4-8.电离真空计ionization vacuum gauge: s|{K?s  
4-9.放射性电离真空计radioactive ionization gauge: $L`7(0U-  
4-10.冷阴极电离真空计cold cathode ionization gauge: f#X`e'1  
4-11.潘宁真空计penning gauge: R^8Opf_UN  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: Bpk%,*$*)  
4-13.放电管指示器discharge tube indicator: [N7[%iQ%  
4-14.热阴极电离真空计hot cathode ionization gauge: n\cP17dr  
4-15.三极管式真空计triode gauge: 1 !\pwd@{  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: !' sDqBZ&7  
4-17.B-A型电离真空计Bayard-Alpert gauge: eJy@N  
4-18.调制型电离真空计modulator gauge: fylaH(LER  
4-19.抑制型电离真空计suppressor gauge: Yn I   
4-20.分离型电离真空计extractor gauge: K5 w22L^=+  
4-21.弯注型电离真空计bent beam gauge: ^i:%;oeG  
4-22.弹道型电离真空计 orbitron gauge : Hs-NP#I  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: d3n TJX  
{z.}u5N  
5.分压真空计(分压分析器) 8Q6il-  
5-1.射频质谱仪radio frequency mass spectrometer: ;W+.]_$6)T  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ;#Mq=Fr-SG  
5-3.单极质谱仪momopole mass spectrometer: 8n&",)U  
5-4.双聚焦质谱仪double focusing mass spectrometer: +Z{ 4OJK  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: C %EQ9Iq6r  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: }.T$bj1B;V  
5-7.回旋质谱仪omegatron mass spectrometer: hc[GpZcw,  
5-8.飞行时间质谱仪time of flight mass spectrometer: 1W/= =+%I  
1eb1Lvn  
6.真空计校准 S2<(n,"  
6-1.标准真空计reference gauges: N!Y'W)i16  
6-2.校准系统system of calibration: |fzo$Bq  
6-3.校准系数K calibration coefficient: ; 9'*w=V  
6-4.压缩计法meleod gauge method: Zn9w1ev  
6-5.膨胀法expansion method: Y<0f1N  
6-6.流导法flow method: jN*A"m  
4.   1.真空系统vacuum system Tzk8y 7$[  
1-1.真空机组pump system: n*O/ X  
1-2.有油真空机组pump system used oil : 2%@j<yS  
1-3.无油真空机组oil free pump system !P:hf/l[B  
1-4.连续处理真空设备continuous treatment vacuum plant: F^ Q  
1-5.闸门式真空系统vacuum system with an air-lock: 2r* o  
1-6.压差真空系统differentially pumped vacuum system: pH"LZ7)DI0  
1-7.进气系统gas admittance system: q2hZ1o  
D#k>.)g  
2.真空系统特性参量 U9N}6a=  
2-1.抽气装置的抽速volume flow rate of a pumping unit : 'Y&yt"cs  
2-2.抽气装置的抽气量throughput of a pumping unit : FlkAo]  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: o oS4F1ta  
2-4.真空系统的漏气速率leak throughput of a vacuum system: L g%cVSz/C  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: $[|8bE  
2-6.极限压力ultimate pressure: 3cfkJ|fuwe  
2-7.残余压力residual pressure: Stp??  
2-8.残余气体谱residual gas spectrum: atN`w=6A`  
2-9.基础压力base pressure: >w*"LZjTTK  
2-10.工作压力working pressure: <`N\FM^vo  
2-11.粗抽时间roughing time: s*!2oj  
2-12.抽气时间pump-down time: # =322bnO  
2-13.真空系统时间常数time constant of a vacuum system: ^SjGNg^ 7D  
2-14.真空系统进气时间venting time: &Owt:R)9~  
s!+?) bB  
3.真空容器 YTGup]d  
3-1.真空容器;真空室vacuum chamber: 6l>G>)  
3-2.封离真空装置sealed vacuum device: MK"Yt<e(o  
3-3.真空钟罩vacuum bell jar: p@Qzg /X  
3-4.真空容器底板vacuum base plate: o0<T|zgF5,  
3-5.真空岐管vacuum manifold: dj]sr!q+  
3-6.前级真空容器(贮气罐)backing reservoir: ?]7ITF  
3-7.真空保护层outer chamber: 0dgR;Dl(  
3-8.真空闸室vacuum air lock: gbInSp`4  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: f|q6<n_nM  
cJhf{{_oR  
4.真空封接和真空引入线 10 p+e_@  
4-1.永久性真空封接permanent seal : OOv"h\,  
4.2.玻璃分级过渡封接graded seal : {`3;Pd`  
4-3.压缩玻璃金属封接compression glass-to-metal seal: T}\U:@b  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: G;^iwxzhO  
4-5.陶瓷金属封接ceramic-to-metal seal: r^ "mPgY  
4-6.半永久性真空封接semi-permanent seal : WUHx0I  
4-7.可拆卸的真空封接demountable joint: P, Vq/Tt  
4-8.液体真空封接liquid seal @E==~ b  
4-9.熔融金属真空封接molten metal seal: opIcSm&  
4-10.研磨面搭接封接ground and lapped seal: 6}|vfw  
4-11.真空法兰连接vacuum flange connection: ~pF'Qw" z|  
4-12.真空密封垫vacuum-tight gasket: w6E?TI  
4-13.真空密封圈ring gasket: *PMql$  
4-14.真空平密封垫flat gasket: h`vM+,I  
4-15.真空引入线feedthrough leadthrough: n@%'Nbc>b  
4-16.真空轴密封shaft seal: cw^FOV*  
4-17.真空窗vacuum window: HML6<U-eS  
4-18.观察窗viewing window: N..u<06j/  
n;q7? KW8  
5.真空阀门 )Z^( +  
5-1.真空阀门的特性characteristic of vacuum valves: /g8yc'{p  
⑴.真空阀门的流导conductance of vacuum valves: fx}R7GN2  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: [UI bO@e  
5-2.真空调节阀regulating valve: {bNnhW*qOu  
5-3.微调阀 micro-adjustable valve: Y]n^(V  
5-4.充气阀charge valve: w?5b:W,  
5-5.进气阀gas admittance valve: MDB}G '  
5-6.真空截止阀break valve: UGN. ]#"#  
5-7.前级真空阀backing valve: iD]!PaFD`  
5-8.旁通阀 by-pass valve: 2HTZ, W  
5-9.主真空阀main vacuum valve: "7aFVf  
5-10.低真空阀low vacuum valve: M9N|Ql  
5-11.高真空阀high vacuum valve: L8$7^muad  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: X;0EgIqh3  
5-13.手动阀manually operated valve: ML'R[~|  
5-14.气动阀pneumatically operated valve: iFHVr'Og'  
5-15.电磁阀electromagnetically operated valve: KcrF=cA  
5-16.电动阀valve with electrically motorized operation: SKS[Lf  
5-17.挡板阀baffle valve: "TxXrt%>A  
5-18.翻板阀flap valve: *i\7dJ Dj  
5-19.插板阀gate valve: eIEcj<f  
5-20.蝶阀butterfly valve: zMG4oRPP  
9S<W~# zz  
6.真空管路 \Js9U|lY  
6-1.粗抽管路roughing line: hrW.TwK  
6-2.前级真空管路backing line: Zkz:h7GUG-  
6-3.旁通管路;By-Pass管路 by-pass line: HD`%Ma Yhc  
6-4.抽气封口接头pumping stem: :*8@Mj Z4  
6-5.真空限流件limiting conductance:       <8y8^m`P9  
6-6.过滤器filter: NH?s  
5.   1.一般术语 LCdc7  
1-1真空镀膜vacuum coating: wY=ky629  
1-2基片substrate: )Q\;N C=4  
1-3试验基片testing substrate: ,~3sba  
1-4镀膜材料coating material: +&t{IP(?  
1-5蒸发材料evaporation material: r&H>JCRZ<=  
1-6溅射材料sputtering material: ;m&f Vp  
1-7膜层材料(膜层材质)film material: HL)1{[|`  
1-8蒸发速率evaporation rate: "w A8J%:  
1-9溅射速率sputtering rate: @4Y>)wn&;  
1-10沉积速率deposition rate: :l 7\7IT  
1-11镀膜角度coating angle:  q)%C|  
``Nj Nd  
2.工艺 xE9s=}  
2-1真空蒸膜vacuum evaporation coating: 2z-&Ya Qu  
(1).同时蒸发simultaneous evaporation: 16] O^R;r  
(2).蒸发场蒸发evaporation field evaporation: <oeHZD_ OR  
(3).反应性真空蒸发reactive vacuum evaporation: xqG` _S l  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: w S;(u[W  
(5).直接加热的蒸发direct heating evaporation: 5]F9o9]T  
(6).感应加热蒸发induced heating evaporation: C f+O7Y`^  
(7).电子束蒸发electron beam evaporation: `t8e2?GH  
(8).激光束蒸发laser beam evaporation: [Y:HVr,  
(9).间接加热的蒸发indirect heating evaporation: ~#-`Qh  
(10).闪蒸flash evaportion: Ig6s'^  
2-2真空溅射vacuum sputtering: (_W[~df4  
(1).反应性真空溅射 reactive vacuum sputtering: ~L1N1Z)Kk  
(2).偏压溅射bias sputtering: g_}@/5?y  
(3).直流二级溅射direct current diode sputtering: :q= XE$%H  
(4).非对称性交流溅射asymmtric alternate current sputtering: :b ;5O3:B  
(5).高频二极溅射high frequency diode sputtering: WTd}) s  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: @emZwN"m  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: @hv9 =v+  
(8).离子束溅射ion beam sputtering: wbpxJtJB  
(9).辉光放电清洗glow discharge cleaning: |l ~ADEg  
2-3物理气相沉积PVD physical vapor deposition: AHLDURv  
2-4化学气相沉积CVD chemical vapor deposition: ;3-ssF}k*  
2-5磁控溅射magnetron sputtering: 1n5&PNu  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: Z-~^)lo  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: qa Q  
2-8电弧离子镀arc discharge deposition: kBT cN D|  
9 V;m;sz  
3.专用部件 QO%LSRw  
3-1镀膜室coating chamber: d#W[<,  
3-2蒸发器装置evaporator device: BE U[M  
3-3蒸发器evaporator: fY `A  
3-4直接加热式蒸发器evaporator by direct heat: Fb*;5VNU.  
3-5间接加热式蒸发器evaporator by indirect heat: ' ZB%McS  
3-7溅射装置sputtering device: D +oo5  
3-8靶target: RXP"v-  
3-10时控挡板timing shutter: gf!j|O;  
3-11掩膜mask: `?>OY&(  
3-12基片支架substrate holder: kfHLjr.  
3-13夹紧装置clamp: d,>l;l  
3-14换向装置reversing device: ~:0h o  
3-15基片加热装置substrate heating device: c]O4l2nCL  
3-16基片冷却装置substrate colding device: 9*x9sfCv9  
,5/gNg  
4.真空镀膜设备 leiza?[  
4-1真空镀膜设备vacuum coating plant: @tP,l$O&  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 5yQgGd)  
(2).真空溅射镀膜设备vacuum sputtering coating plant: ik]UzB  
4-2连续镀膜设备continuous coating plant: #8(@a Y  
4-3半连续镀膜设备semi- continuous coating plant -}>Q0d)  
6.   1.漏孔 8<o(z'&y  
1-1漏孔leaks: "kL5HD]TC  
1-2通道漏孔channel leak: ](O!6_'d  
1-3薄膜漏孔membrane leak: .$r(":A#)  
1-4分子漏孔molecular leak: 6Y=$7%z  
1-5粘滞漏孔vixcous leak: /!LfEO  
1-6校准漏孔calibrated leak: E0*81PS  
1-7标准漏孔reference leak : 2yN~[, L  
1-8虚漏virtual leak: zi5;>Iv0}  
1-9漏率leak rate: Aw5yvQ>]e  
1-10标准空气漏率standard air leak rate: F Pu,sz8  
1-11等值标准空气漏率equivalent standard air leak rate: >Rr]e`3wG  
1-12探索(示漏)气体: ^v`|0z\  
_[.`QW~  
2.本底 t[X'OK0W%3  
2-1本底background: _|#)tWy}  
2-2探索气体本底search gas background : m7d? SU  
2-3漂移drift: -m-~  
2-4噪声noise: Q!@" Y/  
Iz  ,C!c  
3.检漏仪 9iGJYMWf  
3-1检漏仪leak detector: fghJj@ES  
3-2高频火花检漏仪H.F. spark leak detector: yYW>)  
3-3卤素检漏仪halide leak detector: k<AnTboa  
3-4氦质谱检漏仪helium mass spectrometer leak detector: jirxzj  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: |{Oe&j3|  
uRp-yu[nt%  
4.检漏 9]|cs  
4-1气泡检漏leak detection by bubbles: oo /#]a  
4-2氨检漏leak detection by ammonia: _RAPXU~ 6-  
4-3升压检漏leak detection of rise pressure: )WD<Q x&  
4-4放射性同位素检漏radioactive isotope leak detection: Xo'_|-N+  
4-5荧光检漏fluorescence leak detection &L;0%  
7.   1.一般术语 -l^u1z  
1-1真空干燥vacuum drying: ]r|X[9  
1-2冷冻干燥freeze drying : qi$6y?  
1-3物料material: Qxt ,@<IK  
1-4待干燥物料material to be dried: N 0`)WLW  
1-5干燥物料dried material : U t0oh  
1-6湿气moisture;humidity: pWeKN`  
1-7自由湿气free moisture: X62GEqff  
1-8结合湿气bound moisture: HD$W\P  
1-9分湿气partial moisture: A5z5e# ,u  
1-10含湿量moisture content: 0<fN<iR`  
1-11初始含湿量initial moisture content: C?X^h{T p  
1-12最终含湿量final residual moisture: t}]=5)9<  
1-13湿度degree of moisture ,degree of humidity : f7\$rx  
1-14干燥物质dry matter : \y{C>! WX4  
1-15干燥物质含量content of dry matter: <kp?*xV]]  
  Lxs  
2.干燥工艺 ]^E<e!z={$  
2-1干燥阶段stages of drying : QYDSE  
(1).预干燥preliminary dry: h>q& X4-  
(2).一次干燥(广义)primary drying(in general): tpU[KR[-  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): a! ]'S4JS  
(4).二次干燥secondary drying: >q "mI6F  
2-2.(1).接触干燥contact drying: r. :LZEr  
(2).辐射干燥 drying by radiation : (xy/:i".V  
(3).微波干燥microwave drying: l jQru ^(u  
(4).气相干燥vapor phase drying: Il,2^54q  
(5).静态干燥static drying: r 1nl!  
(6).动态干燥dynamic drying: G D$o |l]\  
2-3干燥时间drying time: 3Oy?_a$  
2-4停留时间length of stay(in the drying chamber): COZ<^*=A#p  
2-5循环时间cycle time: o^}K]ML!t  
2-6干燥率 dessication ratio : H)ud?vB6  
2-7去湿速率mass flow rate of humidity: ~#C7G\R  
2-8单位面积去湿速率mass flow rate of humidity per surface area: g Q6_]~4  
2-9干燥速度 drying speed : ^cn%]X#.  
2-10干燥过程drying process: %`?IY<  
2-11加热温度heating temperature: }CIH1q3P  
2-12干燥温度temperature of the material being dried : TY"8.vd  
2-13干燥损失loss of material during the drying process : i^f*Em1  
2-14飞尘lift off (particles): k+t?EZ6L  
2-15堆层厚度thickness of the material: W9+H /T7!  
p D-k<8|  
3.冷冻干燥 j  Jt"=  
3-1冷冻freezing: {CdQ)|  
(1).静态冷冻static freezing: Yw7txp`i  
(2).动态冷冻dynamic freezing: GHWi,' mr  
(3).离心冷冻centrifugal freezing: 6j/g/!9c!  
(4).滚动冷冻shell freezing: H,u{zU')  
(5).旋转冷冻spin-freezing: H|JPqBNRh  
(6).真空旋转冷冻vacuum spin-freezing: #ueWU  
(7).喷雾冷冻spray freezing: 0%&ZR=y(G  
(8).气流冷冻air blast freezing: P;4Y%Dq~Qo  
3-2冷冻速率rate of freezing: JFewOt3  
3-3冷冻物料frozen material: Se{x-vn?p  
3-4冰核ice core: `\_>P@qz  
3-5干燥物料外壳envelope of dried matter: +N n $  
3-6升华表面sublimation front: l!qhK'']V"  
3-7融化位置freezer burn: _Wg?H:\  
:{BD/6  
4.真空干燥设备;真空冷冻干燥设备 UTwXN |'|  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: o^+2%S`]  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: rZ'&'#Q  
4-3加热表面heating surface: PDQEI55  
4-4物品装载面shelf : wIQ~a  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): QP>tu1B|  
4-6单位面积干燥器处理能力throughput per shelf area: {G.W?  
4-7冰冷凝器ice condenser:  S1$lNB  
4-8冰冷凝器的负载load of the ice condenser: Rxb?SBa  
4-9冰冷凝器的额定负载rated load of the ice condenser Z uFk}R"x  
8.   1.一般术语 X} {z7[  
1-1试样sample : +{#65 z  
(1).表面层surface layer: )SU\s+"M  
(2).真实表面true surface: ] MP*5U>;  
(3).有效表面积effective surface area: /|s~X@%K  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: N> 7sG(!'"  
(5).表面粒子密度surface particle density: `)y<X#[8  
(6).单分子层monolayer: nwS @r  
(7).表面单分子层粒子密度monolayer density: 8FT]B/^&m  
(8).覆盖系数coverage ratio: 05>mRqVL  
1-2激发excitation: }uR[H2D`L  
(1).一次粒子primary particle: qTZ\;[CrP"  
(2).一次粒子通量primary particle flux: A4uKE"WE  
(3).一次粒子通量密度density of primary particle flux: FP=up#zl  
(4).一次粒子负荷primary particle load: r{cmw`WA/P  
(5).一次粒子积分负荷integral load of primary particle: [x%[N)U3  
(6).一次粒子的入射能量energy of the incident primary particle: \qf0=CPw8  
(7).激发体积excited volume: *c<6 Er>s  
(8).激发面积excited area: ^/~ZP?%]  
(9).激发深度excited death: yopC <k  
(10).二次粒子secondary particles: <uYrYqN  
(11).二次粒子通量secondary particle flux: CP'b,}Dd?I  
(12).二次粒子发射能energy of the emitted secondary particles: 8KyRD1 (-R  
(13).发射体积emitting volume: Y1Q240  
(14).发射面积emitting area: lfw|Q@  
(15).发射深度emitting depth: Wu~cy}\  
(16).信息深度information depth: oBO4a^D  
(17).平均信息深度mean information depth: 5^ck$af  
1-3入射角angle of incidence: Q&#Arph0e  
1-4发射角angle of emission: yJK:4af;.  
1-5观测角observation: T095]*Hm  
1-6分析表面积analyzed surface area: gc\/A\F<  
1-7产额 yield : ,&~-Sq) ~  
1-8表面层微小损伤分析minimum damage surface analysis: )2 lB  
1-9表面层无损伤分析non-destructive surface analysis: ;kI)j ?  
1-10断面深度分析 profile analysis in depth; depth profile analysis : "T$LJ1E  
1-11可观测面积observable area: 9a2[_Wy  
1-12可观测立体角observable solid angle : h#p[6}D  
1-13接受立体角;观测立体角angle of acceptance: E~@&&d U8  
1-14角分辨能力angular resolving power: &S=Qu?H  
1-15发光度luminosity: bf=!\L$  
1-16二次粒子探测比detection ratio of secondary particles: /X]gm\x7s  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: %iB,hGatE  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: +zwS[P@  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: j0=F__H#@  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: 2"T b><^"  
1-21本底压力base pressure: **$kW bS  
1-22工作压力working pressure: <0VC`+p<)  
,.kmUd  
2.分析方法 H:EK&$sU  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 3:O|p[2)L  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : 6oa>\PDy   
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: 1s~rWnhVv  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: %+ nM4)h  
2-3离子散射表面分析ion scattering spectroscopy: W__Y^\ ~  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: >/Gw)K}#E  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: : t9sAD  
2-6离子散射谱仪ion scattering spectrometer: qnHjwMi  
2-7俄歇效应Auger process: cTz@ga;!mI  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: T6b~uE  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: [,MaAB  
2-10光电子谱术photoelectron spectroscopy : JMk2OK {0  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: x+DETRLP  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: H<}|n1w<  
2-11光电子谱仪photoelectron spectrometer: 3ZC@q #R A  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ZbiC=uh  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: <"K2t Tg.  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): :@@`N_2?  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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