| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 `1i\8s&O6@ --------------------------------------------------- #:E^($v 真空术语 wJg&OQc9 Zfc{}ius 1.标准环境条件 standard ambient condition: ow4|GLU^; 2.气体的标准状态 standard reference conditions forgases: f3SAK!V+s 3.压力(压强)p pressure: FvyC$vip 4.帕斯卡Pa pascal: S;}/ql y 5.托Torr torr: 6g)X&pZ 6.标准大气压atm standard atmosphere: }*|aVBvU 7.毫巴mbar millibar: xgJyG.? 8.分压力 partial pressure: G7k.YtW 9.全压力 total pressure: :v%iF!+.P 10.真空 vacuum: $xK(bc'{ 11.真空度 degree of vacuum: F#Bi*YY 12.真空区域 ranges of vacuum: +:3p*x%1H 13.气体 gas: yHnN7& 14.非可凝气体 non-condensable gas: F>U*Wy 15.蒸汽vapor: 'e*:eBoyb 16.饱和蒸汽压saturation vapor pressure: 1>)uI@?Rb 17.饱和度degree of saturation: &GaI 18.饱和蒸汽saturated vapor: vpP8'f. 19.未饱和蒸汽unsaturated vapor: /rnP/X)T 20.分子数密度n,m-3 number density of molecules: \]qwD m/ 21.平均自由程ι、λ,m mean free path: 1i
7p' 22.碰撞率ψ collision rate: bJB*w 23.体积碰撞率χ volume collision rate: oRHWb_$" 24.气体量G quantity of gas: t]6
4= 25.气体的扩散 diffusion of gas: kj@m5`G 26.扩散系数D diffusion coefficient; diffusivity: 6Z!OD(/e 27.粘滞流 viscous flow: @O| lA 28.粘滞系数η viscous factor: *]e9/f 29.泊肖叶流 poiseuille flow: vqRW^>~-B 30.中间流 intermediate flow: _))--+cL 31.分子流 molecular flow: EoOwu-{ 32克努曾数 number of knudsen: |$`I1
33.分子泻流 molecular effusion; effusive flow: eXQzCm 34.流逸 transpiration: 7Yly^ 35.热流逸 thermal transpiration: (@cZmU, 36.分子流率qN molecular flow rate; molecular flux: p2j=73$ 37.分子流率密度 molecular flow rate density; density of molecular flux: ~c|{PZ9U 38.质量流率qm mass flow rare: aZL
FsSY 39.流量qG throughput of gas: 2@f?yh0 40.体积流率qV volume flow rate: !z_VwZ#, 41.摩尔流率qυ molar flow rate: 29k\}m7l<* 42.麦克斯韦速度分布 maxwellian velocity distribution: A{ Ejk| 43.传输几率Pc transmission probability: Am)XbN')1 44.分子流导CN,UN molecular conductance: +$D~?sk 45.流导C,U conductance: 2@a]x( 46.固有流导Ci,Ui intrinsic conductance: 0BQ< a 47.流阻W resistance: ~MW_=6U 48.吸附 sorption: /;xmM2B' 49.表面吸附 adsorption: nX-%qc" 50.物理吸附physisorption: LYp=o8JW| 51.化学吸附 chemisorption:
Y 9~z7 52.吸收absorption: av}pT)]\
53.适应系数α accommodation factor: gfU!sYZ 54.入射率υ impingement rate: k?ksv+e\ 55.凝结率condensation rate: 28d=-s=[ 56.粘着率 sticking rate: #AUa'qBt 57.粘着几率Ps sticking probability: Xw<N nvz6 58.滞留时间τ residence time: 5E}~iC& 59.迁移 migration: m'ykDK\B 60.解吸 desorption: e"6!0Py#* 61.去气 degassing: qy: 62.放气 outgassing: &ajpD sz; 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: ^FN(wvqb8 64.蒸发率 evaporation rate: y1+~IjY 65.渗透 permeation: %SD=3UK6 66.渗透率φ permeability: Pdw[#X<[` 67.渗透系数P permeability coefficient < e7 2. 1.真空泵 vacuum pumps x@480r 1-1.容积真空泵 positive displacement pump: e$y VV# ⑴.气镇真空泵 gas ballast vacuum pump: tQrkRg(E: ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: &[4lP~ ⑶.干封真空泵 dry-sealed vacuum pump: J,]U"+;H ⑷.往复真空泵 piston vacuum pump: :,BKB*a\ ⑸.液环真空泵 liquid ring vacuum pump: (
mKuFz7 ⑹.旋片真空泵 sliding vane rotary vacuum pump: $r87]y! ⑺.定片真空泵 rotary piston vacuum pump: A?/(W_Gt^M ⑻.滑阀真空泵 rotary plunger vacuum pump: I:G4i}mA ⑼.余摆线真空泵 trochoidal vacuum pump: "=9kX`(1 y ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: kZ3w 2=x3v ⑾.罗茨真空泵 roots vacuum pump: yZ]u{LJS 1-2.动量传输泵 kinetic vacuum pump: 5rx;?yvn ⑴.牵引分子泵molecular drag pump: ]M5w!O! ⑵.涡轮分子泵turbo molecular pump: ESt@%7.F ⑶.喷射真空泵ejector vacuum pump: fG*366W ⑷.液体喷射真空泵liquid jet vacuum pump: QSq0{ ⑸.气体喷射真空泵gas jet vacuum pump: qg#|1J6e ⑹.蒸汽喷射真空泵vapor jet vacuum pump : _}(ej&'f ⑺.扩散泵diffusion pump : o7;#B)jWS ⑻.自净化扩散泵self purifying diffusion pump: 5T4!'4n ⑼.分馏扩散泵 fractionating diffusion pump : 1y($h< ⑽.扩散喷射泵diffusion ejector pump : amH..D7_> ⑾.离子传输泵ion transfer pump: xf]_@T; 1-3.捕集真空泵 entrapment vacuum pump:
+*aZ9g ⑴吸附泵adsorption pump: zs~v6y@ ⑵.吸气剂泵 getter pump: YB1uudW9 ⑶.升华(蒸发)泵 sublimation (evaporation)pump : \ tx4bV# ⑷.吸气剂离子泵getter ion pump: :7-2^7z) ⑸.蒸发离子泵 evaporation ion pump: b
qNM ⑹.溅射离子泵sputter ion pump: 1f zHmD ⑺.低温泵cryopump: mE}@}@( ij<6gv~ n" 2.真空泵零部件 $'obj 2-1.泵壳 pump case: }hy,
}2(8 2-2.入口 inlet: fyE#8h_>4 2-3.出口outlet: z nxAP| 2-4.旋片(滑片、滑阀)vane; blade : da/Tms`T 2-5.排气阀discharge valve: H<`<5M 8 2-6.气镇阀gas ballast valve: c/Ykk7T9-- 2-7.膨胀室expansion chamber: <//#0r* 2-8.压缩室compression chamber: O.% $oV 2-9.真空泵油 vacuum pump oil: .!pr0/9B 2-10.泵液 pump fluid: ]F4.m 2-11.喷嘴 nozzle: k ED1s's 2-13.喷嘴扩张率nozzle expansion rate: jJK`+J,i}X 2-14.喷嘴间隙面积 nozzle clearance area : TppuEC> 2-15.喷嘴间隙nozzle clearance: ,s9gGCA 2-16.射流jet: yxx'g+D* 2-17.扩散器diffuser: y]e[fZ`L 2-18.扩散器喉部diffuser thoat: 2aR<xcSg 2-19.蒸汽导管vapor tube(pipe;chimney): EDf"1b{PX 2-20.喷嘴组件nozzle assembly: 88l\8k4r 2-21.下裙skirt: @z-%:J/$ NM{/rvM 3.附件 F?B`rw@xr 3-1阱trap: 34gC[G= ⑴.冷阱 cold trap: +-*Ww5Zti ⑵.吸附阱sorption trap: y9xvGr[l ⑶.离子阱ion trap: &Q`{ Gk ⑷.冷冻升华阱 cryosublimation trap: Y%1 94fY$ 3-2.挡板baffle: Glw_<ag[ 3-3.油分离器oil separator: ^.|P&f~ 3-4.油净化器oil purifier: !F|#TETrt 3-5.冷凝器condenser: zvgy$]y'\ `UK'IN.il 4.泵按工作分类 (/a#1Pd& 4-1.主泵main pump: n,_q6/! 4-2.粗抽泵roughing vacuum pump: QK`5KB(k' 4-3.前级真空泵backing vacuum pump:
h/*q +H 4-4.粗(低)真空泵 roughing(low)vacuum pump: ls*bCe 4-5.维持真空泵holding vacuum pump: S[ln||{ 4-6.高真空泵high vacuum pump: !w;oVPNg 4-7.超高真空泵ultra-high vacuum pump: <1%(%KdN[ 4-8.增压真空泵booster vacuum pump: 8%ea(|Wjg ~EL3I 5.真空泵特性 A 6IrA/b 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: d^(7\lw| 5-2.真空泵的抽气量Q throughput of vacuum pump:。 fFYfb4o 5-3.起动压力starting pressure: BtA_1RO 5-4.前级压力 backing pressure : R9z:K_d, 5-5.临界前级压力 critical backing pressure: NZoNsNu*C. 5-6.最大前级压力maximum backing pressure: J{!U;r!6 5-7.最大工作压力maximum working pressure: }nUq=@ej 5-8.真空泵的极限压力ultimate pressure of a pump: H _0F:e 5-9.压缩比compression ratio: xk*&zAt 5-10.何氏系数Ho coefficient: }Be;YIhG 5-11.抽速系数speed factor: !*eDT4a 5-12.气体的反扩散back-diffusion of gas: b$;qtfJG 5-13.泵液返流back-streaming of pump fluid: kfV}ta'^S 5-14.返流率back-streaming rate e=^^TX`I 5-15.返迁移back-migration: ,`
64t'g 5-16.爆腾bumping: 5(=5GkE)> 5-17.水蒸气允许量qm water vapor tolerable load: NHL9qL"qk 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: y<g1q"F 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: m!K`?P]:N 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump T T@U_^o 3. 1.一般术语 SNJSRqWL/ 1-1.压力计pressure gauge: &.l^> # 1-2.真空计vacuum gauge: mPL0s ⑴.规头(规管)gauge head: kz\Ss|jl ⑵.裸规nude gauge : x fa- ⑶.真空计控制单元gauge control unit : YO'aX ⑷.真空计指示单元gauge indicating unit : 2O
2HmL (QTF+~) 2.真空计一般分类 K0YQ b&*k 2-1.压差式真空计differential vacuum gauge: 7tbY>U8 2-2.绝对真空计 absolute vacuum gauge: b}
0G~oLP 2-3.全压真空计total pressure vacuum gauge: B[,AR"#b 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: w*M&@+3I 2-5.相对真空计relative vacuum gauge : RY
.@_{ k-Yli21-/| 3.真空计特性 (^NYC$ZxM= 3-1.真空计测量范围pressure range of vacuum gauge: xG(xG%J 3-2.灵敏度系数sensitivity coefficient: 5%%e$o+ 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): z"97AXu 3-5.规管光电流photon current of vacuum gauge head: yAiO._U 3-6.等效氮压力equivalent nitrogen pressure : 4_`(c1oA 3-7.X射线极限值 X-ray limit: DL*vF>v 3-8.逆X射线效应anti X-ray effect: L^jjf8_ 3-9.布利尔斯效应blears effect: *4ido? W cGg 4.全压真空计 f{.4#C' 4-1.液位压力计liquid level manometer: zM,r0Z 4-2.弹性元件真空计elastic element vacuum gauge: njc-=o 4-3.压缩式真空计compression gauge: b'W.l1]<- 4-4.压力天平pressure balance: byFO^pce 4-5.粘滞性真空计viscosity gauge : uGv|!UQw 4-6.热传导真空计thermal conductivity vacuum gauge : 0|Xz-Y 4-7.热分子真空计thermo-molecular gauge: 1<tJ3>Xl 4-8.电离真空计ionization vacuum gauge: g/FZ?Wo 4-9.放射性电离真空计radioactive ionization gauge: `a%MD>R_Lg 4-10.冷阴极电离真空计cold cathode ionization gauge: uzI=.j 4-11.潘宁真空计penning gauge: L#",.x 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: q;}iW:r&Q 4-13.放电管指示器discharge tube indicator: Ptc+ypTu 4-14.热阴极电离真空计hot cathode ionization gauge: Gl@{y ( 4-15.三极管式真空计triode gauge: Pa6pq;4St 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: }T0O~c{$i 4-17.B-A型电离真空计Bayard-Alpert gauge: &+n9T?+b 4-18.调制型电离真空计modulator gauge: t/}NX[q 4-19.抑制型电离真空计suppressor gauge: jU $G<G 4-20.分离型电离真空计extractor gauge: ?j0yT@ G 4-21.弯注型电离真空计bent beam gauge: ?ac4GA( 4-22.弹道型电离真空计 orbitron gauge : <PVwf`W. 4-23.热阴极磁控管真空计hot cathode magnetron gauge: ae2Q^yLA $~S~pvT 5.分压真空计(分压分析器) 8IA1@0n& 5-1.射频质谱仪radio frequency mass spectrometer: 8qqN0"{, 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ,3!$mQL= 5-3.单极质谱仪momopole mass spectrometer: -72EXO=| 5-4.双聚焦质谱仪double focusing mass spectrometer: j*5IRzK1%0 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ESNI$[` 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 5f{P% x( 5-7.回旋质谱仪omegatron mass spectrometer: qiB~ 5-8.飞行时间质谱仪time of flight mass spectrometer: 8L,=E ap +SR{FF 6.真空计校准 ^nK<t?KS 6-1.标准真空计reference gauges: *5 +GJWKN 6-2.校准系统system of calibration: A#6zINK#B 6-3.校准系数K calibration coefficient: f"KrPx!^b 6-4.压缩计法meleod gauge method: s-_D,$ | 6-5.膨胀法expansion method: @zC6` 6-6.流导法flow method: <)p.GAZ 4. 1.真空系统vacuum system s/=% kCo 1-1.真空机组pump system: 3*&
Y'/! 1-2.有油真空机组pump system used oil : vjq2(I)u 1-3.无油真空机组oil free pump system #]x3(}3W 1-4.连续处理真空设备continuous treatment vacuum plant: ?+))J~@t 1-5.闸门式真空系统vacuum system with an air-lock: %rMCiz 1-6.压差真空系统differentially pumped vacuum system: JwB'B 1-7.进气系统gas admittance system: K
J\kR `XhH{*Q"X 2.真空系统特性参量 c7jmzo 2-1.抽气装置的抽速volume flow rate of a pumping unit : ZRG
Cy5Rk 2-2.抽气装置的抽气量throughput of a pumping unit : +U2lwd!j 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: Rh ^(91d 2-4.真空系统的漏气速率leak throughput of a vacuum system: Oj;*Gi9E 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: |L8
[+_m 2-6.极限压力ultimate pressure: $uZmIu9Bi+ 2-7.残余压力residual pressure: R>*z8n 2-8.残余气体谱residual gas spectrum: .P$m?p# 2-9.基础压力base pressure: dgjK\pH`h 2-10.工作压力working pressure: TIKkS*$ 2-11.粗抽时间roughing time: 3l~+VBR_ 2-12.抽气时间pump-down time: 7ocUFY0" 2-13.真空系统时间常数time constant of a vacuum system: V9,<> 2-14.真空系统进气时间venting time: ?1D!%jfi u<Kowt<ci 3.真空容器 r*+~(83k 3-1.真空容器;真空室vacuum chamber: y)fMVD"( 3-2.封离真空装置sealed vacuum device: /@F'f@; 3-3.真空钟罩vacuum bell jar: lN#j%0MaUo 3-4.真空容器底板vacuum base plate: 2ZY$/ 3-5.真空岐管vacuum manifold: '9zW#b 3-6.前级真空容器(贮气罐)backing reservoir: c|k_[8L 3-7.真空保护层outer chamber: =I`S7oF 3-8.真空闸室vacuum air lock: |n/;x$Cb 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: !?nO0Ao-$ } Bf@69 4.真空封接和真空引入线 (dq_,LI 4-1.永久性真空封接permanent seal : sfyLG3$/ 4.2.玻璃分级过渡封接graded seal : ]>1Mq,! 4-3.压缩玻璃金属封接compression glass-to-metal seal: $6a9<&LP_ 4-4.匹配式玻璃金属封接matched glass-to-metal seal: w'K7$F51 4-5.陶瓷金属封接ceramic-to-metal seal: y:RW:D& 4-6.半永久性真空封接semi-permanent seal : 8>9Mh!t}(I 4-7.可拆卸的真空封接demountable joint: gx.\H3y 4-8.液体真空封接liquid seal v>]g="5}8 4-9.熔融金属真空封接molten metal seal: ?4bYb]8Z 4-10.研磨面搭接封接ground and lapped seal: ~.:{
Ik] 4-11.真空法兰连接vacuum flange connection: a+E
8s7C/D 4-12.真空密封垫vacuum-tight gasket: V: D;?$Jl 4-13.真空密封圈ring gasket: w7Yu} JY^ 4-14.真空平密封垫flat gasket: 8ttJ\m 4-15.真空引入线feedthrough leadthrough: %JM$] 4-16.真空轴密封shaft seal: k|/VNV( =0 4-17.真空窗vacuum window: Rn~'S2`u 4-18.观察窗viewing window: @Chl>s Sb[>R(0: 5.真空阀门 ,Z~`aHhr 5-1.真空阀门的特性characteristic of vacuum valves: q[\ 3,Y ⑴.真空阀门的流导conductance of vacuum valves: LP"g(D2'n ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: O2Qmz=% 5-2.真空调节阀regulating valve: p(n0(}eVC' 5-3.微调阀 micro-adjustable valve: 4Hz3KKu 5-4.充气阀charge valve: #c:s2EL 5-5.进气阀gas admittance valve: \6|y~5Hw{r 5-6.真空截止阀break valve: Mt4 5-7.前级真空阀backing valve: R!M' 5-8.旁通阀 by-pass valve: \p(S4?I7 5-9.主真空阀main vacuum valve: t`8Jz~G` 5-10.低真空阀low vacuum valve: $`|hF[tv 5-11.高真空阀high vacuum valve: ~^2w)-N 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: f6Y?),` 5-13.手动阀manually operated valve: @rYZ0`E9 5-14.气动阀pneumatically operated valve: M2Nh3ijr 5-15.电磁阀electromagnetically operated valve: GrLxERf 5-16.电动阀valve with electrically motorized operation: jlBsm'M<m 5-17.挡板阀baffle valve: }k VC]+ 5-18.翻板阀flap valve: d~aTjf 5-19.插板阀gate valve: v@{y} 5-20.蝶阀butterfly valve: Yh1</C !V.]mI 6.真空管路 wO,qFY 6-1.粗抽管路roughing line: SSI> +A 6-2.前级真空管路backing line: mfj{_fR3 6-3.旁通管路;By-Pass管路 by-pass line: E{Wn&?i>A 6-4.抽气封口接头pumping stem: BbX$R`f 6-5.真空限流件limiting conductance: uU)t_W&-J 6-6.过滤器filter: ~T@E")uR 5. 1.一般术语 k M/:n 1-1真空镀膜vacuum coating: NOTG|\{ 1-2基片substrate: f/sz/KC]~ 1-3试验基片testing substrate: u0wu\ 1-4镀膜材料coating material: /R B%m8@; 1-5蒸发材料evaporation material: gv eGBi 1-6溅射材料sputtering material: "Erphn 1-7膜层材料(膜层材质)film material: s]m]b#1!r 1-8蒸发速率evaporation rate: @wXYza0|d 1-9溅射速率sputtering rate: ^6l5@#)w 1-10沉积速率deposition rate: MEI&]qI 1-11镀膜角度coating angle: D\G 8p; /uWUQ#9 2.工艺 L"YQji! 2-1真空蒸膜vacuum evaporation coating: :7(fBf5 (1).同时蒸发simultaneous evaporation: @lzq`SzM (2).蒸发场蒸发evaporation field evaporation: .Yk}iHcW. (3).反应性真空蒸发reactive vacuum evaporation: >(2;(TbQm0 (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: CZzt=9 (5).直接加热的蒸发direct heating evaporation: glch06 (6).感应加热蒸发induced heating evaporation: EZWWvL (7).电子束蒸发electron beam evaporation: S8v,'Cc (8).激光束蒸发laser beam evaporation: NkUY_rKPb (9).间接加热的蒸发indirect heating evaporation: eV_",W (10).闪蒸flash evaportion: d*u3]&?x&f 2-2真空溅射vacuum sputtering: n'ZPB (1).反应性真空溅射 reactive vacuum sputtering: t]sk[ (2).偏压溅射bias sputtering: [ (Y@ (3).直流二级溅射direct current diode sputtering: VN-0hw/A (4).非对称性交流溅射asymmtric alternate current sputtering: jXx~5 (5).高频二极溅射high frequency diode sputtering: T7qp ({v?Q (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: \&d1bq (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: iw.F8[}) (8).离子束溅射ion beam sputtering: Y3|_&\v6 (9).辉光放电清洗glow discharge cleaning: *vNAm(\N 2-3物理气相沉积PVD physical vapor deposition: GB+$ed5@< 2-4化学气相沉积CVD chemical vapor deposition: 9F3aT'3#! 2-5磁控溅射magnetron sputtering: ~p+
`pwjY1 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: *[>{9V 2-7空心阴极离子镀HCD hollow cathode discharge deposition: Cno[:iom 2-8电弧离子镀arc discharge deposition: <DqFfrpc Urw =a$ 3.专用部件 UChLWf|' 3-1镀膜室coating chamber: >]B_+r0m^ 3-2蒸发器装置evaporator device: ,wr5DQ 3-3蒸发器evaporator: rxxVLW 3-4直接加热式蒸发器evaporator by direct heat: % M_F/ O 3-5间接加热式蒸发器evaporator by indirect heat: f3;[ZS 3-7溅射装置sputtering device: U7LCd+Z5X 3-8靶target: W^W.* ?e` 3-10时控挡板timing shutter: fda2dY; 3-11掩膜mask: pw))9~XU 3-12基片支架substrate holder: >8NUji2I 3-13夹紧装置clamp: p>U= Jg 3-14换向装置reversing device: <'T DOYb 3-15基片加热装置substrate heating device: p*jH5h cy 3-16基片冷却装置substrate colding device: U*EBH . Z`xNp 4.真空镀膜设备 xJ^B.;> 4-1真空镀膜设备vacuum coating plant: $LBgBH&z (1).真空蒸发镀膜设备vacuum evaporation coating plant: Ct(^nn$A (2).真空溅射镀膜设备vacuum sputtering coating plant: -{oZK{a1 4-2连续镀膜设备continuous coating plant: %f\j)qw 4-3半连续镀膜设备semi- continuous coating plant OHY|< &* 6. 1.漏孔 {Zs
EYUP 1-1漏孔leaks: 1Uah IePf 1-2通道漏孔channel leak: p;%5 o0{1 1-3薄膜漏孔membrane leak: t[HsqnP 1-4分子漏孔molecular leak: 6EY0Fjsi 1-5粘滞漏孔vixcous leak: ^c}kVQ\g3 1-6校准漏孔calibrated leak: PE_JO(e;Xm 1-7标准漏孔reference leak : t@2MEo 1-8虚漏virtual leak: y`z?lmV)xM 1-9漏率leak rate: \R
3O39[ 1-10标准空气漏率standard air leak rate: =OrVaZ0 1-11等值标准空气漏率equivalent standard air leak rate: m8l!+8 1-12探索(示漏)气体: ?>R(;B|ER Lm^vS u 2.本底 e ?Jgk$" 2-1本底background: >2'A~?% 2-2探索气体本底search gas background : 6 G,cc 2-3漂移drift: U$=Z`^< 2-4噪声noise: >qMzQw2 1Si$Q 3.检漏仪 l?X)]1 3-1检漏仪leak detector: )|]*"yf:E 3-2高频火花检漏仪H.F. spark leak detector: |*~SR.[` 3-3卤素检漏仪halide leak detector: Tj2pEOu 3-4氦质谱检漏仪helium mass spectrometer leak detector: OJFWmZ(X 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: H-%
B<7 ;t/KF" 4.检漏 |41~U\ 4-1气泡检漏leak detection by bubbles: ,{'ZP_ 4-2氨检漏leak detection by ammonia: b$/7rVH! 4-3升压检漏leak detection of rise pressure: -|:mRAe 4-4放射性同位素检漏radioactive isotope leak detection: d|sf2 4-5荧光检漏fluorescence leak detection S2
-J1x2N 7. 1.一般术语 sZ"(#g;3< 1-1真空干燥vacuum drying: qnU`Q{ 1-2冷冻干燥freeze drying : T#}"?A| 1-3物料material: 2H1?f|0> 1-4待干燥物料material to be dried: bz`rSp8h 1-5干燥物料dried material : $GD
Q1&Z 1-6湿气moisture;humidity: e[QEOx/-h2 1-7自由湿气free moisture: B}I9+/|{ 1-8结合湿气bound moisture: iML?`%/vN 1-9分湿气partial moisture: 94lz?-j 1-10含湿量moisture content: CE4Kc33OU| 1-11初始含湿量initial moisture content: (
_MY;S 1-12最终含湿量final residual moisture: @><8YN^)% 1-13湿度degree of moisture ,degree of humidity : i2)$%M& 1-14干燥物质dry matter : 5',&8 1-15干燥物质含量content of dry matter: ] $F% BWkTQd<t 2.干燥工艺 ^_=bssaOd 2-1干燥阶段stages of drying : Rf!$n7& \ (1).预干燥preliminary dry: \XbCJJP (2).一次干燥(广义)primary drying(in general): \mFgjPz (3).一次干燥(冷冻干燥)primary drying(freeze-drying): WXa<(\S\V (4).二次干燥secondary drying: SS&G<3Ke 2-2.(1).接触干燥contact drying: dFk$rr>q (2).辐射干燥 drying by radiation : DH])Q5 (3).微波干燥microwave drying: ]_m(q`_ (4).气相干燥vapor phase drying: 6"2IV (5).静态干燥static drying: (Wn^~-`=+ (6).动态干燥dynamic drying: k P=~L=cK 2-3干燥时间drying time: QOv@rP/ 2-4停留时间length of stay(in the drying chamber): G4EuW *~ 2-5循环时间cycle time: wYd{X 8$ 2-6干燥率 dessication ratio : (I#3![q 2-7去湿速率mass flow rate of humidity: K*tomy 2-8单位面积去湿速率mass flow rate of humidity per surface area: ZkF6AF 2-9干燥速度 drying speed : |Syulus 2-10干燥过程drying process: 5~RR
_G 2-11加热温度heating temperature: cE*d(g 2-12干燥温度temperature of the material being dried : r_Pi)MPc 2-13干燥损失loss of material during the drying process : dSE"G>l8 2-14飞尘lift off (particles): fy>~GFk( 2-15堆层厚度thickness of the material: N LSJ
D b%xG^jUXsX 3.冷冻干燥 m :2A[H+ 3-1冷冻freezing: 3
t+1M (1).静态冷冻static freezing: :d|~k (2).动态冷冻dynamic freezing: CE|rn8MB (3).离心冷冻centrifugal freezing: CS;4 ysNf (4).滚动冷冻shell freezing: 8)YDUE%VH (5).旋转冷冻spin-freezing: Eo0/cln| (6).真空旋转冷冻vacuum spin-freezing: 4V'HPD>=V (7).喷雾冷冻spray freezing: [I(
Yn (8).气流冷冻air blast freezing: !{b4+!@p 3-2冷冻速率rate of freezing: O&@CT] )8 3-3冷冻物料frozen material: |}o3EX 3-4冰核ice core: ?:i,%]zxC 3-5干燥物料外壳envelope of dried matter: UYhxgPGsj 3-6升华表面sublimation front: FlT5R*m 3-7融化位置freezer burn: ?DKY;:dZF C/q!! 4.真空干燥设备;真空冷冻干燥设备 sV]I]DR 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: [G"Va_A8 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: [6\b(kS+ 4-3加热表面heating surface: 2u(G:cR 4-4物品装载面shelf : 9<5S!?JL 4-5干燥器的处理能力throughput (of the vacuum drying chamber): E^m;Ab= 4-6单位面积干燥器处理能力throughput per shelf area: +77B656 4-7冰冷凝器ice condenser: !iW>xo 4-8冰冷凝器的负载load of the ice condenser: sAoxLI 4-9冰冷凝器的额定负载rated load of the ice condenser mTL JajE/ 8. 1.一般术语 T _fM\jdI 1-1试样sample : No*[@D]g
(1).表面层surface layer: dEZlJo@J (2).真实表面true surface: <4582x,G (3).有效表面积effective surface area: 'i4L.& (4).宏观表面;几何表面macroscopic surface area; geometric surface area: -0P9|;h5 (5).表面粒子密度surface particle density: !i\ gCLg2_ (6).单分子层monolayer: XfN(7d0 (7).表面单分子层粒子密度monolayer density: H^M>(kT#& (8).覆盖系数coverage ratio: U+&Eps&NI 1-2激发excitation: x
kdC-S (1).一次粒子primary particle: ;*WG9Y(W (2).一次粒子通量primary particle flux: I8uFMP (3).一次粒子通量密度density of primary particle flux: wYQEm (4).一次粒子负荷primary particle load: s%1ZraMvJ (5).一次粒子积分负荷integral load of primary particle: <T]ey (6).一次粒子的入射能量energy of the incident primary particle: zpZfsn! (7).激发体积excited volume: ~yJJ00% (8).激发面积excited area: ]`M2Kwp (9).激发深度excited death: Q"H/RMo- (10).二次粒子secondary particles: <6X*k{ (11).二次粒子通量secondary particle flux: IL`=r6\ (12).二次粒子发射能energy of the emitted secondary particles: I
moxg+u
(13).发射体积emitting volume: 8#/y`ul (14).发射面积emitting area: -F MonM (15).发射深度emitting depth: s;-AZr) (16).信息深度information depth: LL==2KNUo (17).平均信息深度mean information depth: `@#rAW D 1-3入射角angle of incidence: "uFwsjz&B 1-4发射角angle of emission:
UqNUX?( 1-5观测角observation: }b/P\1#z 1-6分析表面积analyzed surface area: :aH5=@[!y 1-7产额 yield : 4issj$ 1-8表面层微小损伤分析minimum damage surface analysis: o7@C$R_# 1-9表面层无损伤分析non-destructive surface analysis: bP> Kx-%q 1-10断面深度分析 profile analysis in depth; depth profile analysis : \>X!n2rLZe 1-11可观测面积observable area: =}.gU WV 1-12可观测立体角observable solid angle : ,e$6%R 1-13接受立体角;观测立体角angle of acceptance: <~uzKs0 1-14角分辨能力angular resolving power: GxEShSGOE 1-15发光度luminosity: 6[SIDOp*^ 1-16二次粒子探测比detection ratio of secondary particles: opMnLor 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: :>U+HQll 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: T"<)B^8f 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: Xj~%kPe 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: wE}Wh5 1-21本底压力base pressure: MzDosr3: 1-22工作压力working pressure: @w`wJ*I4, 9Vo*AK'&U 2.分析方法 SZ}=~yoD( 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: V:vqt@ (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : DTSf[zP/ (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: ~]q>}/&YLo 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: [FLR&=.( 2-3离子散射表面分析ion scattering spectroscopy: e~d=e3mBp 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: is~2{: 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ncMzHw 2-6离子散射谱仪ion scattering spectrometer: [:cvy[}v@ 2-7俄歇效应Auger process: kw
E2V+2 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: cnI5G! 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: O1bW, n( 2-10光电子谱术photoelectron spectroscopy : zo8D" (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: ~?FhQd\Q (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: ?{e}ouKYX1 2-11光电子谱仪photoelectron spectrometer: *UJ4\ 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 0^sY>N" 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: :mW<
E 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): <f M}Kk 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
|
|