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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 : E[\1  
--------------------------------------------------- <'N"GLJ  
真空术语 $9YAq/#Q  
&OQ37(<_  
1.标准环境条件 standard ambient condition: 'i+j;.  
2.气体的标准状态 standard reference conditions forgases: q4=Gj`\43  
3.压力(压强)p pressure: ', ~  
4.帕斯卡Pa pascal: o9\J vJk  
5.托Torr torr: 0`UI^Y~Q  
6.标准大气压atm standard atmosphere: 3V=wW{;x  
7.毫巴mbar millibar: l7 Pn5c  
8.分压力 partial pressure:  PgI H(  
9.全压力 total pressure: =hFIH\x  
10.真空 vacuum: e}>3<Dh  
11.真空度 degree of vacuum: "`g5iUHqUl  
12.真空区域 ranges of vacuum: 0"}qND  
13.气体 gas: #0$fZ  
14.非可凝气体 non-condensable gas: ZDny=&>#  
15.蒸汽vapor: $0 ]xeD0X  
16.饱和蒸汽压saturation vapor pressure: PtsQV!  
17.饱和度degree of saturation: ^G(U@-0..  
18.饱和蒸汽saturated vapor: =sZ58xA  
19.未饱和蒸汽unsaturated vapor: rf?%- X(V  
20.分子数密度n,m-3 number density of molecules: v}\4/u  
21.平均自由程ι、λ,m mean free path: +2xgMN6B@  
22.碰撞率ψ collision rate: 5tx!LGOK  
23.体积碰撞率χ volume collision rate: .w,$ TezGP  
24.气体量G quantity of gas: #No3}O;"g  
25.气体的扩散 diffusion of gas: W_.WMbT  
26.扩散系数D diffusion coefficient; diffusivity: UOIB}ut V  
27.粘滞流 viscous flow: y'L7o V?L9  
28.粘滞系数η viscous factor: V#X#rDfJZ  
29.泊肖叶流 poiseuille flow: ,="hI:*<  
30.中间流 intermediate flow: A |u-VXQ  
31.分子流 molecular flow: )iX2r{  
32克努曾数 number of knudsen: }TQa<;Q  
33.分子泻流 molecular effusion; effusive flow: ~aPe?{yIUa  
34.流逸 transpiration: "hi d3"G  
35.热流逸 thermal transpiration: ;gGq\c  
36.分子流率qN molecular flow rate; molecular flux: d! {]CZ"@  
37.分子流率密度 molecular flow rate density; density of molecular flux: )_n=it$  
38.质量流率qm mass flow rare: eWWqK9B.-  
39.流量qG throughput of gas: JAx0(MZO  
40.体积流率qV volume flow rate: rjK]zD9  
41.摩尔流率qυ molar flow rate: CS'LW;#[  
42.麦克斯韦速度分布 maxwellian velocity distribution: bog3=Ig-  
43.传输几率Pc transmission probability: }#r awVe=  
44.分子流导CN,UN molecular conductance: }ChScY  
45.流导C,U conductance: -*A1[Z ?  
46.固有流导Ci,Ui intrinsic conductance: P{,A%t  
47.流阻W resistance: UpaF>,kM  
48.吸附 sorption: ?wP/l  
49.表面吸附 adsorption: 2cEvsvw>  
50.物理吸附physisorption: %rlMjF'tG  
51.化学吸附 chemisorption: 5G2G<[p5oQ  
52.吸收absorption: !He_f-eZ  
53.适应系数α accommodation factor: v-Tkp Yn  
54.入射率υ impingement rate: U ,NGV0  
55.凝结率condensation rate: ''dS {nQs  
56.粘着率 sticking rate: *8r^!(Kj  
57.粘着几率Ps sticking probability: x(n|zp ("  
58.滞留时间τ residence time: % n RgHN>  
59.迁移 migration: FI,K 0sO/|  
60.解吸 desorption: nW)?cQ I  
61.去气 degassing: ZIN1y;dJ  
62.放气 outgassing: J}NMF#w/;  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: IwXWtVL  
64.蒸发率 evaporation rate: qjObu\r  
65.渗透 permeation: !YPwql(  
66.渗透率φ permeability: H#i,Ve '  
67.渗透系数P permeability coefficient '_b3m2I.G  
2.   1.真空泵 vacuum pumps N5c*#lHI  
1-1.容积真空泵 positive displacement pump:  !2kM  
⑴.气镇真空泵 gas ballast vacuum pump: N a$.VT  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump:  zo1T`"Y  
⑶.干封真空泵 dry-sealed vacuum pump: et2;{Tb,5  
⑷.往复真空泵 piston vacuum pump: ;A4qE W  
⑸.液环真空泵 liquid ring vacuum pump: wPEK5=\4Ob  
⑹.旋片真空泵 sliding vane rotary vacuum pump: Atb`Q'Yrw  
⑺.定片真空泵 rotary piston vacuum pump:  svx7  
⑻.滑阀真空泵 rotary plunger vacuum pump: hraR:l D  
⑼.余摆线真空泵 trochoidal vacuum pump: 6cd!;Ca  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: W[I$([  
⑾.罗茨真空泵 roots vacuum pump: E mg=,  
1-2.动量传输泵 kinetic vacuum pump: \q?^DI:`   
⑴.牵引分子泵molecular drag pump: ny{S&f  
⑵.涡轮分子泵turbo molecular pump: 4#{f8  
⑶.喷射真空泵ejector vacuum pump: vh.-9eD  
⑷.液体喷射真空泵liquid jet vacuum pump: *^%+PQ  
⑸.气体喷射真空泵gas jet vacuum pump: O=t~.]))  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : gg.]\#3g  
⑺.扩散泵diffusion pump : 0$ON`Vsu|  
⑻.自净化扩散泵self purifying diffusion pump: Mq#m;v$E  
⑼.分馏扩散泵 fractionating diffusion pump : gzlxkv-F{  
⑽.扩散喷射泵diffusion ejector pump : aGBd~y@e  
⑾.离子传输泵ion transfer pump: RP$h;0EQG  
1-3.捕集真空泵 entrapment vacuum pump: #8sy QWlG  
⑴吸附泵adsorption pump: =/}Rnl+c  
⑵.吸气剂泵 getter pump: W/\pqH  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : zJP jsD]  
⑷.吸气剂离子泵getter ion pump: !KJA)znx;(  
⑸.蒸发离子泵 evaporation ion pump: )u+O~Y95&i  
⑹.溅射离子泵sputter ion pump: CuK>1_Dq  
⑺.低温泵cryopump: KTt+}-vP^  
%X's/;(Lx`  
2.真空泵零部件 c&1_lI,tH  
2-1.泵壳 pump case:  71@kIJI  
2-2.入口 inlet: 5Q <vS"g  
2-3.出口outlet: }-sh  
2-4.旋片(滑片、滑阀)vane; blade : a_bZT4  
2-5.排气阀discharge valve: Lc?"4  
2-6.气镇阀gas ballast valve: %f'=9pit  
2-7.膨胀室expansion chamber: p6NPWaBR  
2-8.压缩室compression chamber: U# [T!E  
2-9.真空泵油 vacuum pump oil: H\V?QDn  
2-10.泵液 pump fluid: y{&%]Fq <5  
2-11.喷嘴 nozzle: *#E_KW1RV  
2-13.喷嘴扩张率nozzle expansion rate: ZV:df 6S  
2-14.喷嘴间隙面积 nozzle clearance area : hxj\  
2-15.喷嘴间隙nozzle clearance: 6\u. [2lE^  
2-16.射流jet: 0<:rp]<,  
2-17.扩散器diffuser: Y- Q)sv  
2-18.扩散器喉部diffuser thoat: ,"5HJA4  
2-19.蒸汽导管vapor tube(pipe;chimney): +,,dsL  
2-20.喷嘴组件nozzle assembly: :-#7j} R&  
2-21.下裙skirt: ;zze.kb&F  
t\LE\[XM>  
3.附件 [L7s(Zs>  
3-1阱trap: BriL ^]  
⑴.冷阱 cold trap: @{#'y4\>  
⑵.吸附阱sorption trap:  H{yBD xw  
⑶.离子阱ion trap: 9(qoME}>=  
⑷.冷冻升华阱 cryosublimation trap: Y'jgp Vt  
3-2.挡板baffle: yUf`L=C:  
3-3.油分离器oil separator: IJKdVb~   
3-4.油净化器oil purifier: g33Y$Xdk  
3-5.冷凝器condenser: B_iaty   
Z2@e~&L  
4.泵按工作分类 L~e0^X?  
4-1.主泵main pump: Gh.?6kuh  
4-2.粗抽泵roughing vacuum pump: @=P c{xp  
4-3.前级真空泵backing vacuum pump: 4YI6&  
4-4.粗(低)真空泵 roughing(low)vacuum pump: =SuJ*  
4-5.维持真空泵holding vacuum pump: \1&4wzT  
4-6.高真空泵high vacuum pump: gx^_bHh  
4-7.超高真空泵ultra-high vacuum pump: d&L  
4-8.增压真空泵booster vacuum pump: }f_@@#KB?  
H"A@Q.'  
5.真空泵特性 >TM{2b,(p  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: |A,.mOT  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 cUP1Uolvn  
5-3.起动压力starting pressure: ]K8G}|Wy6  
5-4.前级压力 backing pressure : [ _ `yy  
5-5.临界前级压力 critical backing pressure: sr[[xzL  
5-6.最大前级压力maximum backing pressure: -dF (_ %C  
5-7.最大工作压力maximum working pressure: h4itXJy52B  
5-8.真空泵的极限压力ultimate pressure of a pump: rQNm2h  
5-9.压缩比compression ratio: pg!oi?Jn  
5-10.何氏系数Ho coefficient: ~|, "w90  
5-11.抽速系数speed factor: -IVWkA)7  
5-12.气体的反扩散back-diffusion of gas: =bP<cC=3b  
5-13.泵液返流back-streaming of pump fluid: qhG2j;  
5-14.返流率back-streaming rate Z_dL@\#|  
5-15.返迁移back-migration: =`>ei  
5-16.爆腾bumping: b@=H$"  
5-17.水蒸气允许量qm water vapor tolerable load: As5l36  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: 6 <`e]PT  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 6Y6t.j0vN.  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump RTbV!I  
3.   1.一般术语 >dgq2ok!u  
1-1.压力计pressure gauge: _<2{8>EVf  
1-2.真空计vacuum gauge: E}F-*go  
⑴.规头(规管)gauge head: TG8U=9qt  
⑵.裸规nude gauge : p:$v,3:  
⑶.真空计控制单元gauge control unit : {|OXiRm'  
⑷.真空计指示单元gauge indicating unit : e2G;_:  
q9VBK(,X  
2.真空计一般分类  q^6#.}  
2-1.压差式真空计differential vacuum gauge: i"Hc(lg  
2-2.绝对真空计 absolute vacuum gauge: @`nG &U  
2-3.全压真空计total pressure vacuum gauge: 9 `bLQd  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: wpC .!T  
2-5.相对真空计relative vacuum gauge : ts_|7Ev  
Eb6cL`#N  
3.真空计特性 {*g{9`   
3-1.真空计测量范围pressure range of vacuum gauge: ]oz>/\!  
3-2.灵敏度系数sensitivity coefficient: DnhbMxh8o  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): ^?\|2H  
3-5.规管光电流photon current of vacuum gauge head: }X=c|]6i^  
3-6.等效氮压力equivalent nitrogen pressure : 4bdCbI  
3-7.X射线极限值 X-ray limit: _I3"35a  
3-8.逆X射线效应anti X-ray effect: yP} |8x  
3-9.布利尔斯效应blears effect: X7-[#} T  
[euR<i*I#  
4.全压真空计 Y=_*Ai  
4-1.液位压力计liquid level manometer: 2h]CZD4  
4-2.弹性元件真空计elastic element vacuum gauge: Ma(Q~G .  
4-3.压缩式真空计compression gauge: iFcSz  
4-4.压力天平pressure balance: sredL#]BA  
4-5.粘滞性真空计viscosity gauge : -#G>`T~  
4-6.热传导真空计thermal conductivity vacuum gauge : JV4fL~  
4-7.热分子真空计thermo-molecular gauge: i| ,}y`C#  
4-8.电离真空计ionization vacuum gauge: U7g,@/Qx  
4-9.放射性电离真空计radioactive ionization gauge: 9&Y|,&W  
4-10.冷阴极电离真空计cold cathode ionization gauge: #j+cl'  
4-11.潘宁真空计penning gauge: ]B~ (yh  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: -bSM]86  
4-13.放电管指示器discharge tube indicator: \Nf#{  
4-14.热阴极电离真空计hot cathode ionization gauge: 5&_")k3$*  
4-15.三极管式真空计triode gauge: i PG:w+G  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: n_Y7*3/b-o  
4-17.B-A型电离真空计Bayard-Alpert gauge: e0ni  
4-18.调制型电离真空计modulator gauge: x;} 25A|  
4-19.抑制型电离真空计suppressor gauge: R^$EnrY(<  
4-20.分离型电离真空计extractor gauge: 8cMX=P  
4-21.弯注型电离真空计bent beam gauge: -k2|`t _  
4-22.弹道型电离真空计 orbitron gauge : )Spa F)N8  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: <}c7E3Uc  
Ly2!(,FB.  
5.分压真空计(分压分析器) h#)\K| qs  
5-1.射频质谱仪radio frequency mass spectrometer: FzCXA=m  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: jA~omX2A  
5-3.单极质谱仪momopole mass spectrometer: Bf+~&I#E  
5-4.双聚焦质谱仪double focusing mass spectrometer: GiK,+M"d  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ]:T:cO0_n  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: d1t_o2  
5-7.回旋质谱仪omegatron mass spectrometer: OUO'w6m!  
5-8.飞行时间质谱仪time of flight mass spectrometer: w~pe?j_F$  
!Z{7X ^  
6.真空计校准 v^p* l0r6:  
6-1.标准真空计reference gauges: <pKOFN%m  
6-2.校准系统system of calibration: 55] MRv  
6-3.校准系数K calibration coefficient: 'gD./|Z0  
6-4.压缩计法meleod gauge method: ,VUOsNN4\  
6-5.膨胀法expansion method: usoyH0t!?  
6-6.流导法flow method: 4k<U5J  
4.   1.真空系统vacuum system 'IVC!uL,%  
1-1.真空机组pump system: ]]}iSw'  
1-2.有油真空机组pump system used oil : 7 TM-uA$  
1-3.无油真空机组oil free pump system Zn Rj}y  
1-4.连续处理真空设备continuous treatment vacuum plant: Ky8,HdAq  
1-5.闸门式真空系统vacuum system with an air-lock: 4 CiRh  
1-6.压差真空系统differentially pumped vacuum system: U;u4ey  
1-7.进气系统gas admittance system: Q[H4l({E  
K9VP@[zbJ  
2.真空系统特性参量 |DVFi2   
2-1.抽气装置的抽速volume flow rate of a pumping unit : rTJqw@]#WH  
2-2.抽气装置的抽气量throughput of a pumping unit : | "M1+(k7  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: LtKR15h,  
2-4.真空系统的漏气速率leak throughput of a vacuum system: j':<7n/A  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: I.~=\%Z {  
2-6.极限压力ultimate pressure: A5 4u}  
2-7.残余压力residual pressure: Y<N#{)Q  
2-8.残余气体谱residual gas spectrum: 8-kR {9r  
2-9.基础压力base pressure: !B9 Yw/Ba  
2-10.工作压力working pressure: i/!KUbt  
2-11.粗抽时间roughing time: #KHj.Vg  
2-12.抽气时间pump-down time: opzlh@R 3  
2-13.真空系统时间常数time constant of a vacuum system: B(eiRr3  
2-14.真空系统进气时间venting time: d}Y#l}!E6  
A%&lW9z7  
3.真空容器 Su +<mW  
3-1.真空容器;真空室vacuum chamber: ={6vShG)m  
3-2.封离真空装置sealed vacuum device: GGZ9DC\{  
3-3.真空钟罩vacuum bell jar: )S#?'gt*  
3-4.真空容器底板vacuum base plate: )`gxaT>&l  
3-5.真空岐管vacuum manifold: H xc>?  
3-6.前级真空容器(贮气罐)backing reservoir: 2sEG# /Y=  
3-7.真空保护层outer chamber: wsAb8U C_  
3-8.真空闸室vacuum air lock: YETGq-  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: W>b\O">  
vYo~36  
4.真空封接和真空引入线 c0X1})q$  
4-1.永久性真空封接permanent seal : Zba<|C  
4.2.玻璃分级过渡封接graded seal : @.G;dL.f{  
4-3.压缩玻璃金属封接compression glass-to-metal seal: 'fzJw  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: j!0-3YKv  
4-5.陶瓷金属封接ceramic-to-metal seal: #0^a-47PA<  
4-6.半永久性真空封接semi-permanent seal : ew c:-2Y^  
4-7.可拆卸的真空封接demountable joint: 6vU%Y_n=y]  
4-8.液体真空封接liquid seal 1NrNTBI@  
4-9.熔融金属真空封接molten metal seal: ye}86{l  
4-10.研磨面搭接封接ground and lapped seal: tv]9n8v  
4-11.真空法兰连接vacuum flange connection:  7(o:J  
4-12.真空密封垫vacuum-tight gasket: G \$x.  
4-13.真空密封圈ring gasket: .H&XP W  
4-14.真空平密封垫flat gasket: -y$<fu9 e  
4-15.真空引入线feedthrough leadthrough: G%}k_vi&q  
4-16.真空轴密封shaft seal: ]4lC/ &nm  
4-17.真空窗vacuum window: X@A8~ kj1  
4-18.观察窗viewing window: e%7#e%1s  
$HRl:KDdP~  
5.真空阀门 ,WoV)L'?  
5-1.真空阀门的特性characteristic of vacuum valves: 7o7FW=^  
⑴.真空阀门的流导conductance of vacuum valves: F"23v G>3  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: }p8iq  
5-2.真空调节阀regulating valve: %qVD-Jln  
5-3.微调阀 micro-adjustable valve: yhnPS4DC  
5-4.充气阀charge valve: .^ba*qb`{  
5-5.进气阀gas admittance valve: srKEtd"  
5-6.真空截止阀break valve: f&Juq8s_0  
5-7.前级真空阀backing valve: 25W #mh,'  
5-8.旁通阀 by-pass valve: A9GSeW<  
5-9.主真空阀main vacuum valve: C_h$$G{S(  
5-10.低真空阀low vacuum valve: ;j<#VS-]  
5-11.高真空阀high vacuum valve: <e@4;Z(h04  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: I%z,s{9p  
5-13.手动阀manually operated valve: Z:,`hW*A6  
5-14.气动阀pneumatically operated valve: g/w <T+v  
5-15.电磁阀electromagnetically operated valve: I&% Z*H  
5-16.电动阀valve with electrically motorized operation: w,<n5dMv  
5-17.挡板阀baffle valve: ow'CwOj$  
5-18.翻板阀flap valve: WZviC_  
5-19.插板阀gate valve: :"K9(XKKU  
5-20.蝶阀butterfly valve: dTwYDV}:  
&hM7y7  
6.真空管路 7H,)heA  
6-1.粗抽管路roughing line: .W\x{h  
6-2.前级真空管路backing line: J7kqyo"  
6-3.旁通管路;By-Pass管路 by-pass line: e=[@HVr   
6-4.抽气封口接头pumping stem: .kfx\,lgm  
6-5.真空限流件limiting conductance:       8rLhOA  
6-6.过滤器filter: Fg i;%  
5.   1.一般术语 GgtYO4,  
1-1真空镀膜vacuum coating: n3\~H9  
1-2基片substrate: i G%R'/*  
1-3试验基片testing substrate: kJCeQK:W  
1-4镀膜材料coating material: =8Z-ORW51  
1-5蒸发材料evaporation material: {_Fh3gjb/  
1-6溅射材料sputtering material: o"p['m*g  
1-7膜层材料(膜层材质)film material: 4Q,|7@  
1-8蒸发速率evaporation rate: 1 q|iw  
1-9溅射速率sputtering rate: J(9{P/  
1-10沉积速率deposition rate: ]L k- -\  
1-11镀膜角度coating angle: Y3H5}4QD  
 1%";|  
2.工艺 \9R=fA18  
2-1真空蒸膜vacuum evaporation coating: _C,9c7K4  
(1).同时蒸发simultaneous evaporation: 1c*;Lr.K  
(2).蒸发场蒸发evaporation field evaporation: +$#h6V  
(3).反应性真空蒸发reactive vacuum evaporation: "EZpTy}Ee  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: 2g5jGe*0  
(5).直接加热的蒸发direct heating evaporation: @=BApuer+  
(6).感应加热蒸发induced heating evaporation: xiqeKoAD  
(7).电子束蒸发electron beam evaporation: {f;DhB-jj  
(8).激光束蒸发laser beam evaporation: @qB>qD~WsD  
(9).间接加热的蒸发indirect heating evaporation: DbYnd%k*4  
(10).闪蒸flash evaportion: xZVZYvC,t  
2-2真空溅射vacuum sputtering: i*T -9IP  
(1).反应性真空溅射 reactive vacuum sputtering: 60WlC0Y~u  
(2).偏压溅射bias sputtering: #w si><7   
(3).直流二级溅射direct current diode sputtering: ` ^;J<l  
(4).非对称性交流溅射asymmtric alternate current sputtering: b&RsxW7  
(5).高频二极溅射high frequency diode sputtering: *Xh#W7,<  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: :G &:v  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: j rX`_Y  
(8).离子束溅射ion beam sputtering: jI9#OEH_g  
(9).辉光放电清洗glow discharge cleaning:  %Nx,ZD@  
2-3物理气相沉积PVD physical vapor deposition: l9 &L$,=  
2-4化学气相沉积CVD chemical vapor deposition: Yaz/L)Y;R  
2-5磁控溅射magnetron sputtering: 3jHE,5m  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 7R,;/3wWjG  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: ^4et; F%  
2-8电弧离子镀arc discharge deposition: 9ZuKED  
3r[ s_Y*  
3.专用部件 apnpy\in  
3-1镀膜室coating chamber: f*VXg[&\\F  
3-2蒸发器装置evaporator device: .9UrWBW\I  
3-3蒸发器evaporator: gu&W:FY  
3-4直接加热式蒸发器evaporator by direct heat: >'jkL5l  
3-5间接加热式蒸发器evaporator by indirect heat: >4os%T  
3-7溅射装置sputtering device: Q`Rn,kCVy  
3-8靶target: ScmwHid:\  
3-10时控挡板timing shutter: alBnN<UM  
3-11掩膜mask: _9?v?mL5;  
3-12基片支架substrate holder: {Q @?CT  
3-13夹紧装置clamp: }rF4M1+B\  
3-14换向装置reversing device: $9u:Ox 2  
3-15基片加热装置substrate heating device: ;j+*}|!  
3-16基片冷却装置substrate colding device: qx*N-,M%k(  
9WV8ZP  
4.真空镀膜设备 d<E2=WVB6  
4-1真空镀膜设备vacuum coating plant: VKg9^%#b`[  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: <;cch6Z  
(2).真空溅射镀膜设备vacuum sputtering coating plant: fUZCP*7>  
4-2连续镀膜设备continuous coating plant: p&D7&Sb[  
4-3半连续镀膜设备semi- continuous coating plant -#R63f&  
6.   1.漏孔 md|I?vk  
1-1漏孔leaks: j,z)x[3}  
1-2通道漏孔channel leak: ?[%.4i;-h  
1-3薄膜漏孔membrane leak: [w)KNl  
1-4分子漏孔molecular leak: L@f&71  
1-5粘滞漏孔vixcous leak: yV31OBC:  
1-6校准漏孔calibrated leak: E )2/Vn2  
1-7标准漏孔reference leak : {\|XuCF#  
1-8虚漏virtual leak: HrT@Df  
1-9漏率leak rate: <N3~X,ch  
1-10标准空气漏率standard air leak rate: wB+F/]]|N  
1-11等值标准空气漏率equivalent standard air leak rate: dCLNZq h6  
1-12探索(示漏)气体: ngk:q5Tp  
C:f^&4 3  
2.本底 2X(2O':Uc  
2-1本底background: IoV"t,  
2-2探索气体本底search gas background : @moaa}1  
2-3漂移drift: ;";>7k/}  
2-4噪声noise: /AY q^  
Bx.hFEL  
3.检漏仪 "hZ `^ "0b  
3-1检漏仪leak detector: MYR\W*B'b  
3-2高频火花检漏仪H.F. spark leak detector: h]IoH0/  
3-3卤素检漏仪halide leak detector:  UF@.  
3-4氦质谱检漏仪helium mass spectrometer leak detector: $U(D*0+o/  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: P]L%$!g  
-^8OjGat  
4.检漏 |:u5R%  
4-1气泡检漏leak detection by bubbles: 6F%6]n  
4-2氨检漏leak detection by ammonia: _^!C4?2!  
4-3升压检漏leak detection of rise pressure: ETR7% 0$r  
4-4放射性同位素检漏radioactive isotope leak detection: <,H/7Ba  
4-5荧光检漏fluorescence leak detection ;6?,Yhk$h  
7.   1.一般术语 Zjs,R{  
1-1真空干燥vacuum drying: `wSoa#U"@  
1-2冷冻干燥freeze drying : 7 Rc/<,X  
1-3物料material: {7v|\6@e3  
1-4待干燥物料material to be dried: rxZk!- t)L  
1-5干燥物料dried material : gLx?0eBBA  
1-6湿气moisture;humidity: u{dkUG1ia  
1-7自由湿气free moisture: 5r;)Ppo  
1-8结合湿气bound moisture: aD~S~L!  
1-9分湿气partial moisture: M R,A{X  
1-10含湿量moisture content: .dvs&+I  
1-11初始含湿量initial moisture content: CI+liH  
1-12最终含湿量final residual moisture: &?gcnMg$,J  
1-13湿度degree of moisture ,degree of humidity : "g(q)u >  
1-14干燥物质dry matter : KCqz]  
1-15干燥物质含量content of dry matter: "kucFf f  
UY:Be8C A  
2.干燥工艺 UA#=K+2  
2-1干燥阶段stages of drying : F'_z$,X6  
(1).预干燥preliminary dry: 3;!a'[W&p  
(2).一次干燥(广义)primary drying(in general): -7EwZRS@9  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): Yt r*"-  
(4).二次干燥secondary drying: % 5BSXAc  
2-2.(1).接触干燥contact drying: >as+#rz1p  
(2).辐射干燥 drying by radiation : Aiqb*v$  
(3).微波干燥microwave drying: [ .3Gb}B  
(4).气相干燥vapor phase drying: &((04<@e  
(5).静态干燥static drying: IY?o \vC  
(6).动态干燥dynamic drying: p%OVl[^jp  
2-3干燥时间drying time: E>"SC\#7  
2-4停留时间length of stay(in the drying chamber): TJ,?C$3  
2-5循环时间cycle time: :rvBx"  
2-6干燥率 dessication ratio : B\`${O(  
2-7去湿速率mass flow rate of humidity: +ERuZc$3,  
2-8单位面积去湿速率mass flow rate of humidity per surface area: YKx+z[A/p  
2-9干燥速度 drying speed : >PGsY[N  
2-10干燥过程drying process: qz!^< M  
2-11加热温度heating temperature: 26j-1c!NGd  
2-12干燥温度temperature of the material being dried : [c99m:*+  
2-13干燥损失loss of material during the drying process : $% W.=a'5  
2-14飞尘lift off (particles): rhN"#?  
2-15堆层厚度thickness of the material:  yT(86#st  
J/[PA[Rf  
3.冷冻干燥 Qk^}  
3-1冷冻freezing: 8#Y_]Z?)  
(1).静态冷冻static freezing: \,`iu=YZv  
(2).动态冷冻dynamic freezing: \i)@"}  
(3).离心冷冻centrifugal freezing: Rr\fw'  
(4).滚动冷冻shell freezing: I#zL-RXT  
(5).旋转冷冻spin-freezing: Lf8{']3  
(6).真空旋转冷冻vacuum spin-freezing: [,|4%Y  
(7).喷雾冷冻spray freezing: eBe5H =I@  
(8).气流冷冻air blast freezing: CTc#*LJx>j  
3-2冷冻速率rate of freezing: 3LVL5y7|  
3-3冷冻物料frozen material: f{'N O`G  
3-4冰核ice core: y!\q ', F  
3-5干燥物料外壳envelope of dried matter: 0LP>3"Sm  
3-6升华表面sublimation front: o:Tpd 0F  
3-7融化位置freezer burn:  <XnxAA  
JOki4N  
4.真空干燥设备;真空冷冻干燥设备 o6r ^  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: |:d_IB@  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: xf{=~j/L  
4-3加热表面heating surface: @ t8{pb;v  
4-4物品装载面shelf : \(1WLP$2U  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): ]Vf2Mn=]"  
4-6单位面积干燥器处理能力throughput per shelf area: 5eas^Rm  
4-7冰冷凝器ice condenser: &Fch{%S>  
4-8冰冷凝器的负载load of the ice condenser: 'W[Nr  
4-9冰冷凝器的额定负载rated load of the ice condenser ;S+"z;$m  
8.   1.一般术语 ?:RWHe.P  
1-1试样sample : l{_1`rC'  
(1).表面层surface layer: By0Zz  
(2).真实表面true surface: o(xt%'L`t  
(3).有效表面积effective surface area: .~4DlT  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: ?qtL*;  
(5).表面粒子密度surface particle density: vn96o] n  
(6).单分子层monolayer: 6^nxw>-   
(7).表面单分子层粒子密度monolayer density: )"^ )Nk  
(8).覆盖系数coverage ratio: QWK\6  
1-2激发excitation: Dn;$4Dak(  
(1).一次粒子primary particle: XN'<H(G  
(2).一次粒子通量primary particle flux: qTnk>g_oS&  
(3).一次粒子通量密度density of primary particle flux: T- lHlm  
(4).一次粒子负荷primary particle load: \J{ %xW>  
(5).一次粒子积分负荷integral load of primary particle: l' a<k"  
(6).一次粒子的入射能量energy of the incident primary particle: w Yr M2X@  
(7).激发体积excited volume: ;<|m0>X  
(8).激发面积excited area: K_BF=C.k  
(9).激发深度excited death: m?<5-"hz  
(10).二次粒子secondary particles: 6X GqZ!2  
(11).二次粒子通量secondary particle flux: {hKf 'd9E  
(12).二次粒子发射能energy of the emitted secondary particles: :FI 4GR*?  
(13).发射体积emitting volume: u-~?ylh  
(14).发射面积emitting area: <(2,@_~@r  
(15).发射深度emitting depth: +~M`rR*  
(16).信息深度information depth: %|By ?i  
(17).平均信息深度mean information depth: >)iCKx  
1-3入射角angle of incidence: dn= g!=  
1-4发射角angle of emission: }9(:W</}  
1-5观测角observation: /%h<^YDBf  
1-6分析表面积analyzed surface area: nsV;6^>  
1-7产额 yield : =h}IyY@o  
1-8表面层微小损伤分析minimum damage surface analysis: ~,P."  
1-9表面层无损伤分析non-destructive surface analysis: 4 O~zkg  
1-10断面深度分析 profile analysis in depth; depth profile analysis : LXcH<)  
1-11可观测面积observable area: WiclG8l  
1-12可观测立体角observable solid angle : NxQ+z^o\  
1-13接受立体角;观测立体角angle of acceptance: 5y|/}D>  
1-14角分辨能力angular resolving power: {!7 ^ w  
1-15发光度luminosity: 1\BQq  
1-16二次粒子探测比detection ratio of secondary particles: a$'= a09  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ?hwT{h  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: <YBA 7i  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: bcZ s+FOPd  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: :g=z}7!s  
1-21本底压力base pressure: vOYG&)Jm  
1-22工作压力working pressure: mkOj&Q  
*%xmCP J  
2.分析方法 Q[N6#C:(4  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: dzPwlCC%-  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : Y;WHjW(K  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: `l8^n0-  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: y9L:2f\  
2-3离子散射表面分析ion scattering spectroscopy: t9B]V  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: :svRn9_8H  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: geRD2`3;  
2-6离子散射谱仪ion scattering spectrometer: K\]ey;Bd  
2-7俄歇效应Auger process: 6P KH%  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: bC@9 */i  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: W{2(fb  
2-10光电子谱术photoelectron spectroscopy : X}$uvB}+>  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: vo_m$/O  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: LE:nmo  
2-11光电子谱仪photoelectron spectrometer: L0H kmaH  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ~L.)<{?  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 0*KU"JcXd  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): "##Ylq("  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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