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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 qh9Z50E9  
--------------------------------------------------- ZrPbl "`7  
真空术语 S2HcG 1J  
R3x3]]D  
1.标准环境条件 standard ambient condition: `uOT+B%R  
2.气体的标准状态 standard reference conditions forgases: K2TcOFQ  
3.压力(压强)p pressure: B2>H_dmQ  
4.帕斯卡Pa pascal: #|L8tuWW  
5.托Torr torr: 0 ?s|i :  
6.标准大气压atm standard atmosphere: $"+djI?E9  
7.毫巴mbar millibar: [@VP?74  
8.分压力 partial pressure: OI|[roMK  
9.全压力 total pressure: Zq+v6fk_Mn  
10.真空 vacuum: [tlI!~Z  
11.真空度 degree of vacuum: \pPY37l  
12.真空区域 ranges of vacuum: '@o;-'b  
13.气体 gas: |2O]R s  
14.非可凝气体 non-condensable gas: zr-*$1eu  
15.蒸汽vapor: - Ajo9H  
16.饱和蒸汽压saturation vapor pressure: 8I lunJ  
17.饱和度degree of saturation: s'!Cp=xQF"  
18.饱和蒸汽saturated vapor: l3Xfc2~ 2  
19.未饱和蒸汽unsaturated vapor: W0dSsjNio  
20.分子数密度n,m-3 number density of molecules: |Luqoa  
21.平均自由程ι、λ,m mean free path: zd2)M@  
22.碰撞率ψ collision rate: SF7\<'4\N  
23.体积碰撞率χ volume collision rate: 6a[}'/  
24.气体量G quantity of gas: 6HT ;#Znn  
25.气体的扩散 diffusion of gas: \y97W&AN  
26.扩散系数D diffusion coefficient; diffusivity: 5eLtCsHz  
27.粘滞流 viscous flow: h;p>o75O  
28.粘滞系数η viscous factor: )#?"Gjf~  
29.泊肖叶流 poiseuille flow: `7c~m ypx  
30.中间流 intermediate flow: &v56#lG  
31.分子流 molecular flow: '*K:  lx  
32克努曾数 number of knudsen: CyJEY-  
33.分子泻流 molecular effusion; effusive flow: Oxm>c[R  
34.流逸 transpiration: sd*p/Q|4  
35.热流逸 thermal transpiration: h}[-'>{  
36.分子流率qN molecular flow rate; molecular flux: %'b M){  
37.分子流率密度 molecular flow rate density; density of molecular flux: {#ZlM  
38.质量流率qm mass flow rare: joFm]3$;  
39.流量qG throughput of gas: V3&RJ k=b  
40.体积流率qV volume flow rate: [)H&'5 +F  
41.摩尔流率qυ molar flow rate: y&6FybIz  
42.麦克斯韦速度分布 maxwellian velocity distribution: WffQ:L?  
43.传输几率Pc transmission probability: <f ZyAa3}  
44.分子流导CN,UN molecular conductance: 2<i!{;u$qL  
45.流导C,U conductance: 3k\#CiB{  
46.固有流导Ci,Ui intrinsic conductance: t_o['F  
47.流阻W resistance: SEo'(-5  
48.吸附 sorption: Xnt~]k\"  
49.表面吸附 adsorption: +[M6X} TQ  
50.物理吸附physisorption: W<bGDh  
51.化学吸附 chemisorption: MV5_L3M  
52.吸收absorption: '.on)Zd.  
53.适应系数α accommodation factor: `tB gH_$M  
54.入射率υ impingement rate: ZT'`hK_up  
55.凝结率condensation rate: }u\])I3  
56.粘着率 sticking rate: )Q=_0;#;k  
57.粘着几率Ps sticking probability: 0]'7_vDs|  
58.滞留时间τ residence time: /$i.0$L  
59.迁移 migration: v_BcTzQ0S  
60.解吸 desorption: 7r7YNn/?  
61.去气 degassing: aT{_0m$G10  
62.放气 outgassing: P Y_u/<u  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: )P%ZA)l%_o  
64.蒸发率 evaporation rate: ?iw!OoZ`  
65.渗透 permeation: !<j'Ea  
66.渗透率φ permeability: 02f~En}>6  
67.渗透系数P permeability coefficient C;;Sih5  
2.   1.真空泵 vacuum pumps /$ w%Q-p  
1-1.容积真空泵 positive displacement pump: ,`|3KE9  
⑴.气镇真空泵 gas ballast vacuum pump: &:;:"{t}Do  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: hB "fhX  
⑶.干封真空泵 dry-sealed vacuum pump: Sxnpq Vbk  
⑷.往复真空泵 piston vacuum pump: &b.=M>\9Q  
⑸.液环真空泵 liquid ring vacuum pump: cA2V2S)  
⑹.旋片真空泵 sliding vane rotary vacuum pump: jfP*"uUK  
⑺.定片真空泵 rotary piston vacuum pump: zpzK>DH(  
⑻.滑阀真空泵 rotary plunger vacuum pump: ],>@";9u"  
⑼.余摆线真空泵 trochoidal vacuum pump: R] vV*  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: KT_!d*  
⑾.罗茨真空泵 roots vacuum pump: QCD .YFM  
1-2.动量传输泵 kinetic vacuum pump: iNWw;_|1  
⑴.牵引分子泵molecular drag pump: c' ^?/$H|  
⑵.涡轮分子泵turbo molecular pump: l>2E (Y|  
⑶.喷射真空泵ejector vacuum pump: ({ 8-*  
⑷.液体喷射真空泵liquid jet vacuum pump: xmNB29#  
⑸.气体喷射真空泵gas jet vacuum pump: }QN1|mP2  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : bZ?v-fn\D,  
⑺.扩散泵diffusion pump : @GPCwE1  
⑻.自净化扩散泵self purifying diffusion pump: Y#]+Tm (+  
⑼.分馏扩散泵 fractionating diffusion pump : 9`T)@Uj2n  
⑽.扩散喷射泵diffusion ejector pump : XR8,Vt)=  
⑾.离子传输泵ion transfer pump: b[sx_b  
1-3.捕集真空泵 entrapment vacuum pump: &#o~U$GBg  
⑴吸附泵adsorption pump: ,MdV;j ~"'  
⑵.吸气剂泵 getter pump: i)o2klIkB  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : c%^7!FSg  
⑷.吸气剂离子泵getter ion pump: O)C\v F#  
⑸.蒸发离子泵 evaporation ion pump: bh s5x  
⑹.溅射离子泵sputter ion pump: 10G}{  
⑺.低温泵cryopump: xj<Rp|7&  
4{}FL  
2.真空泵零部件 o906/5M  
2-1.泵壳 pump case: aKV$pC<[o  
2-2.入口 inlet: ) mI05  
2-3.出口outlet: q YC;cKv  
2-4.旋片(滑片、滑阀)vane; blade :  Qn^'  
2-5.排气阀discharge valve: Km%]1X7T6  
2-6.气镇阀gas ballast valve: $CxKuB(  
2-7.膨胀室expansion chamber: teOe#*  
2-8.压缩室compression chamber: d)"3K6s|5  
2-9.真空泵油 vacuum pump oil: -<c=US  
2-10.泵液 pump fluid: F;>V>" edl  
2-11.喷嘴 nozzle: 8&;UO{  
2-13.喷嘴扩张率nozzle expansion rate: Eou~P h*t  
2-14.喷嘴间隙面积 nozzle clearance area : Bt[/0>i  
2-15.喷嘴间隙nozzle clearance: Hj'xAtx5  
2-16.射流jet: o=u3&liBi  
2-17.扩散器diffuser: >lmi@UN|k  
2-18.扩散器喉部diffuser thoat: ~Xw"}S5  
2-19.蒸汽导管vapor tube(pipe;chimney): OGBHos  
2-20.喷嘴组件nozzle assembly: 4]rnY~  
2-21.下裙skirt: ];}Wfl  
PvR6 z0  
3.附件 7wWFr  
3-1阱trap: yTyj'-4  
⑴.冷阱 cold trap: &*sP/z  
⑵.吸附阱sorption trap: [M?}uK ^  
⑶.离子阱ion trap: G=)i{oC  
⑷.冷冻升华阱 cryosublimation trap: { .n"Z  
3-2.挡板baffle: OBgkpx*Q  
3-3.油分离器oil separator: Q.bXM?V)  
3-4.油净化器oil purifier: a! (4Ch  
3-5.冷凝器condenser: s J\BF  
]~844J p  
4.泵按工作分类 +_7*iJtD5  
4-1.主泵main pump: "lQ*1.i  
4-2.粗抽泵roughing vacuum pump: |o,YCzy|5  
4-3.前级真空泵backing vacuum pump: tWo{7)Eb  
4-4.粗(低)真空泵 roughing(low)vacuum pump: @)IjNplYkw  
4-5.维持真空泵holding vacuum pump: -T!f,g3vW  
4-6.高真空泵high vacuum pump: 6~OoFm5  
4-7.超高真空泵ultra-high vacuum pump: o-;E>N7t  
4-8.增压真空泵booster vacuum pump: 6L:x^bM  
ml2_ ]3j!  
5.真空泵特性 xE1 eT,  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ai}mOyJs  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 1h(0IjG8  
5-3.起动压力starting pressure: ?=>+LqP  
5-4.前级压力 backing pressure : }{M#EP8q+  
5-5.临界前级压力 critical backing pressure: fz;iOjr>  
5-6.最大前级压力maximum backing pressure: :#2Bw]z&z  
5-7.最大工作压力maximum working pressure: :s=NUw_^  
5-8.真空泵的极限压力ultimate pressure of a pump: CF&NFSti^  
5-9.压缩比compression ratio: YTAmgkF\4  
5-10.何氏系数Ho coefficient: X(!Cfb8+5  
5-11.抽速系数speed factor: xrlmKSPa  
5-12.气体的反扩散back-diffusion of gas: =5aDM\L$&  
5-13.泵液返流back-streaming of pump fluid: >O1[:%Z1  
5-14.返流率back-streaming rate Gb"r|(!  
5-15.返迁移back-migration: Kfm5i Q  
5-16.爆腾bumping: ot @|!V  
5-17.水蒸气允许量qm water vapor tolerable load: Q*~LCtrI  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: h a|C&G  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: INUG*JC6  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump Fd#?\r.  
3.   1.一般术语 KN$}tCU  
1-1.压力计pressure gauge: ygOd69  
1-2.真空计vacuum gauge: qd+h$ "p  
⑴.规头(规管)gauge head: sLh==V;9  
⑵.裸规nude gauge : UU'|Xz9~  
⑶.真空计控制单元gauge control unit : jATI&oX  
⑷.真空计指示单元gauge indicating unit : BeCWa>54i  
9F6F~::l}  
2.真空计一般分类 p/(~IC "!J  
2-1.压差式真空计differential vacuum gauge: XXbqQhf  
2-2.绝对真空计 absolute vacuum gauge: ilK-?@u+  
2-3.全压真空计total pressure vacuum gauge: I[b}4M6E  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: (]_1  
2-5.相对真空计relative vacuum gauge : whonDG4WP  
.tkT<o-u<J  
3.真空计特性 lW<PoT  
3-1.真空计测量范围pressure range of vacuum gauge: m7&O9?X  
3-2.灵敏度系数sensitivity coefficient: U ?'vXa  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): A3vUPWdDk  
3-5.规管光电流photon current of vacuum gauge head: Jm|+-F@I  
3-6.等效氮压力equivalent nitrogen pressure : d\%WgH  
3-7.X射线极限值 X-ray limit: &GNxo$CG  
3-8.逆X射线效应anti X-ray effect: s?zAP O8Sz  
3-9.布利尔斯效应blears effect: 6Z#\CixG  
: k7uGD  
4.全压真空计 (*1v\Q  
4-1.液位压力计liquid level manometer: ng:kA%! Q  
4-2.弹性元件真空计elastic element vacuum gauge: 6Ztq  
4-3.压缩式真空计compression gauge: : q ti  
4-4.压力天平pressure balance: u583_k%  
4-5.粘滞性真空计viscosity gauge : 'sLiu8G  
4-6.热传导真空计thermal conductivity vacuum gauge : wx\v:A  
4-7.热分子真空计thermo-molecular gauge: ~)qtply  
4-8.电离真空计ionization vacuum gauge:  e`d%-9  
4-9.放射性电离真空计radioactive ionization gauge: [v$0[IuY,  
4-10.冷阴极电离真空计cold cathode ionization gauge: "oWwc zzO  
4-11.潘宁真空计penning gauge: !E,A7s  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: !h(|\" }  
4-13.放电管指示器discharge tube indicator: V~S0hqW[  
4-14.热阴极电离真空计hot cathode ionization gauge: kgy:Q'  
4-15.三极管式真空计triode gauge:  ]E_h  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: S5KEXnjm  
4-17.B-A型电离真空计Bayard-Alpert gauge: HODz*pI  
4-18.调制型电离真空计modulator gauge: qzI&<4  
4-19.抑制型电离真空计suppressor gauge: >RPd$('T  
4-20.分离型电离真空计extractor gauge: \ W?R  
4-21.弯注型电离真空计bent beam gauge: e?`5>& Up  
4-22.弹道型电离真空计 orbitron gauge : Ob}?zl@  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: 9Rn? :B~W:  
N;Dni#tQ`  
5.分压真空计(分压分析器) 0`)iIz  
5-1.射频质谱仪radio frequency mass spectrometer: so)"4 SEu  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: b3S.-W{p.  
5-3.单极质谱仪momopole mass spectrometer: WX}xmtLs  
5-4.双聚焦质谱仪double focusing mass spectrometer: {g2@6ct  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: fBgEnz/  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: nt;haeJ  
5-7.回旋质谱仪omegatron mass spectrometer: _$wmI/_J M  
5-8.飞行时间质谱仪time of flight mass spectrometer: <EPj$::  
&ZghMq~  
6.真空计校准 "VkTY|a  
6-1.标准真空计reference gauges: CNQC^d\ h  
6-2.校准系统system of calibration: pWPIJ>2G:  
6-3.校准系数K calibration coefficient: &LF` W  
6-4.压缩计法meleod gauge method: s7g(3<(  
6-5.膨胀法expansion method: 6el;Erp  
6-6.流导法flow method: [cTe54n  
4.   1.真空系统vacuum system ?+g`HTY u  
1-1.真空机组pump system: vo\fUT@k  
1-2.有油真空机组pump system used oil : *<E]E?  
1-3.无油真空机组oil free pump system 6'kS_Zu{<  
1-4.连续处理真空设备continuous treatment vacuum plant: {GKy'/[  
1-5.闸门式真空系统vacuum system with an air-lock: gzjR 6uz  
1-6.压差真空系统differentially pumped vacuum system: 6(]tYcC  
1-7.进气系统gas admittance system: 5k6mmiaKk  
+Vo}F  
2.真空系统特性参量 : p{+G  
2-1.抽气装置的抽速volume flow rate of a pumping unit : '" X_B0k  
2-2.抽气装置的抽气量throughput of a pumping unit : ndjx|s)E  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 0{[m%eSK'  
2-4.真空系统的漏气速率leak throughput of a vacuum system: JYrY[',u  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: nSF``pp+  
2-6.极限压力ultimate pressure: p8kr/uMP ;  
2-7.残余压力residual pressure: 5DXR8mLoaJ  
2-8.残余气体谱residual gas spectrum: VtzI9CD  
2-9.基础压力base pressure: pM{nh00[  
2-10.工作压力working pressure: "6R 5+  
2-11.粗抽时间roughing time: ,g7.rEA  
2-12.抽气时间pump-down time: "V>R9dO{"!  
2-13.真空系统时间常数time constant of a vacuum system: r'dr9"-{  
2-14.真空系统进气时间venting time: 2RqbrY n  
qw7@(R'"  
3.真空容器 JCPUM *g8  
3-1.真空容器;真空室vacuum chamber: %&->%U|'  
3-2.封离真空装置sealed vacuum device: !@x+q)2  
3-3.真空钟罩vacuum bell jar: -29gL_dk.  
3-4.真空容器底板vacuum base plate: &K43x&mFF  
3-5.真空岐管vacuum manifold: :9R=]#uD  
3-6.前级真空容器(贮气罐)backing reservoir: V7Z4T6j4  
3-7.真空保护层outer chamber: S@}1t4Ls:  
3-8.真空闸室vacuum air lock: Iq#ZhAk  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: KjFK/Og.  
P7 ]z  
4.真空封接和真空引入线 rwniOQe  
4-1.永久性真空封接permanent seal : &-czStQ  
4.2.玻璃分级过渡封接graded seal : LAP6U.m'd  
4-3.压缩玻璃金属封接compression glass-to-metal seal: tV_t6x_.  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: yf?h#G%24  
4-5.陶瓷金属封接ceramic-to-metal seal: Ul_M3"Z  
4-6.半永久性真空封接semi-permanent seal : ?9HhG?_x  
4-7.可拆卸的真空封接demountable joint: Qd_Y\PzS  
4-8.液体真空封接liquid seal R g?1-|Tj  
4-9.熔融金属真空封接molten metal seal: %*o8L6Hn  
4-10.研磨面搭接封接ground and lapped seal: zW}[+el }  
4-11.真空法兰连接vacuum flange connection: 'DCFezdf3  
4-12.真空密封垫vacuum-tight gasket: FYb34LY  
4-13.真空密封圈ring gasket: TDg@Tg0  
4-14.真空平密封垫flat gasket: ?\U!huu  
4-15.真空引入线feedthrough leadthrough: v}sY|p"  
4-16.真空轴密封shaft seal: jYVE8Y)my  
4-17.真空窗vacuum window: j7MO'RX`&  
4-18.观察窗viewing window: t ?h kL  
[3W*9j  
5.真空阀门 < AI;6/  
5-1.真空阀门的特性characteristic of vacuum valves: V $|<  
⑴.真空阀门的流导conductance of vacuum valves: ' JdkUhq1V  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: x lsqj`=  
5-2.真空调节阀regulating valve: T# lP!c  
5-3.微调阀 micro-adjustable valve: FZ|CqD"#  
5-4.充气阀charge valve: dl5=q\1=  
5-5.进气阀gas admittance valve: nx:KoB"ny  
5-6.真空截止阀break valve: ckjrk  
5-7.前级真空阀backing valve: 2oZ9laJO  
5-8.旁通阀 by-pass valve: e8h,,:l3j  
5-9.主真空阀main vacuum valve: YB)3X[R+0  
5-10.低真空阀low vacuum valve: w-b' LP  
5-11.高真空阀high vacuum valve: g7CXlT0Q6  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: n;8'`s  
5-13.手动阀manually operated valve: x1gx$P  
5-14.气动阀pneumatically operated valve: #5&jt@NS  
5-15.电磁阀electromagnetically operated valve: /ahNnCtu?1  
5-16.电动阀valve with electrically motorized operation: 1|ZhPsD.}g  
5-17.挡板阀baffle valve: v8/6wy?  
5-18.翻板阀flap valve: Q}*y$se!  
5-19.插板阀gate valve: {ub/3Uh  
5-20.蝶阀butterfly valve: EPX8Wwf  
0rokR&Y-d  
6.真空管路 ?/M_~e.P  
6-1.粗抽管路roughing line: h(B,d,q"  
6-2.前级真空管路backing line: >p])it[q&$  
6-3.旁通管路;By-Pass管路 by-pass line: ?$z.K>S5  
6-4.抽气封口接头pumping stem: Nt:8ogk/  
6-5.真空限流件limiting conductance:       .mL#6P!d3^  
6-6.过滤器filter: K"<*a"1I  
5.   1.一般术语 sT1&e5`W  
1-1真空镀膜vacuum coating: s?3i) Ymr  
1-2基片substrate: 64j|}wJ$  
1-3试验基片testing substrate: .5> 20\b2  
1-4镀膜材料coating material: }:z5t,u6  
1-5蒸发材料evaporation material: 6<Hu8$G|  
1-6溅射材料sputtering material: k_GP> b\"k  
1-7膜层材料(膜层材质)film material: oc{EuW{Ag  
1-8蒸发速率evaporation rate: DF1<JdO+  
1-9溅射速率sputtering rate: Zt@Z=r:&  
1-10沉积速率deposition rate: 0 nW F  
1-11镀膜角度coating angle: MR'o{?{e`  
XD-^w_  
2.工艺 9l+{OA  
2-1真空蒸膜vacuum evaporation coating: 7ODaX.t->  
(1).同时蒸发simultaneous evaporation: uH\kQ9f  
(2).蒸发场蒸发evaporation field evaporation: *s)}Bj  
(3).反应性真空蒸发reactive vacuum evaporation: kGN||h  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: >_ X/[<  
(5).直接加热的蒸发direct heating evaporation: r;iV$Rq !  
(6).感应加热蒸发induced heating evaporation: /&Jv,[2kV  
(7).电子束蒸发electron beam evaporation: {.k)2{  
(8).激光束蒸发laser beam evaporation: :DkAQ-<~  
(9).间接加热的蒸发indirect heating evaporation: qJ8-9^E,L  
(10).闪蒸flash evaportion: .dq "k  
2-2真空溅射vacuum sputtering: q]<xMg#nu  
(1).反应性真空溅射 reactive vacuum sputtering: xi'<y  
(2).偏压溅射bias sputtering: 6ri#Lw  
(3).直流二级溅射direct current diode sputtering: h3Fo-]0  
(4).非对称性交流溅射asymmtric alternate current sputtering: FN )d1q(~  
(5).高频二极溅射high frequency diode sputtering: I__4I{nI  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: We`'>'W0  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 8SnS~._9  
(8).离子束溅射ion beam sputtering: Fa3gJ[ZAqf  
(9).辉光放电清洗glow discharge cleaning: QLb MPS  
2-3物理气相沉积PVD physical vapor deposition: lr('k`KOQ  
2-4化学气相沉积CVD chemical vapor deposition: V`fL%du,3  
2-5磁控溅射magnetron sputtering: }uX|5&=~f  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: h(xP_Svj>  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: hSqMaX%G  
2-8电弧离子镀arc discharge deposition: P#G.lft"O  
MV+i{]  
3.专用部件 "dN < i  
3-1镀膜室coating chamber: w;yx<1f  
3-2蒸发器装置evaporator device: +lp{#1q0  
3-3蒸发器evaporator: sms1%%~  
3-4直接加热式蒸发器evaporator by direct heat: V,QwN&  
3-5间接加热式蒸发器evaporator by indirect heat: \~"#ld(x7  
3-7溅射装置sputtering device: U6WG?$x  
3-8靶target: ]b[,LwB\`~  
3-10时控挡板timing shutter: Qp:6= o0:  
3-11掩膜mask: +cfziQ$'  
3-12基片支架substrate holder: 3-Y=EH_0  
3-13夹紧装置clamp: dl[ob,aCK  
3-14换向装置reversing device: w@N{ @tG  
3-15基片加热装置substrate heating device: Ao`_",E  
3-16基片冷却装置substrate colding device: sQk|I x  
ySruAkw%  
4.真空镀膜设备 LZ&uj{ <  
4-1真空镀膜设备vacuum coating plant: ."JzDs   
(1).真空蒸发镀膜设备vacuum evaporation coating plant: !Q[}s #g  
(2).真空溅射镀膜设备vacuum sputtering coating plant: Oje|bxQ  
4-2连续镀膜设备continuous coating plant: ,OBQv.D3>a  
4-3半连续镀膜设备semi- continuous coating plant )|T`17-  
6.   1.漏孔 1=TSJ2{ 9  
1-1漏孔leaks: +G!v!(Ob+  
1-2通道漏孔channel leak: :Kay$r0+  
1-3薄膜漏孔membrane leak: Ff/Ig]Lb  
1-4分子漏孔molecular leak: q0|Z oP  
1-5粘滞漏孔vixcous leak: <kc]L x  
1-6校准漏孔calibrated leak: oYq,u@oM  
1-7标准漏孔reference leak : ^_w*XV  
1-8虚漏virtual leak: 'jbMTI  
1-9漏率leak rate: y''0PSfb#  
1-10标准空气漏率standard air leak rate: Rrz'(KSDw  
1-11等值标准空气漏率equivalent standard air leak rate: 0}-#b7eR  
1-12探索(示漏)气体: U(A4v0T  
q}Rlo/R  
2.本底 _SF!T6A  
2-1本底background: DB Xm  
2-2探索气体本底search gas background : ||gEs/6-  
2-3漂移drift: 1,u{&%yL"w  
2-4噪声noise: LY1KQuY  
=|# w.(3y  
3.检漏仪 W8uVd zQ   
3-1检漏仪leak detector: (+$ol'i  
3-2高频火花检漏仪H.F. spark leak detector: s;>VeD)*)  
3-3卤素检漏仪halide leak detector: ^^Bm$9  
3-4氦质谱检漏仪helium mass spectrometer leak detector: p[;8  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: P7Z<0Dt\}  
Z]e4pR6!  
4.检漏 Uk"Y/Ddm  
4-1气泡检漏leak detection by bubbles: 5^o3y.J?P  
4-2氨检漏leak detection by ammonia: iiehrK&T !  
4-3升压检漏leak detection of rise pressure: T"A^[ r*  
4-4放射性同位素检漏radioactive isotope leak detection: Z_jn27AC  
4-5荧光检漏fluorescence leak detection !Pe1o-O  
7.   1.一般术语 CMKhS,,o  
1-1真空干燥vacuum drying: L+(C5L93}  
1-2冷冻干燥freeze drying : {SHqW5VX  
1-3物料material: hC|KH}aCR)  
1-4待干燥物料material to be dried: @C<d2f|8  
1-5干燥物料dried material : d"p2Kx'*3  
1-6湿气moisture;humidity: q'fPNQg  
1-7自由湿气free moisture: H&u4v2  
1-8结合湿气bound moisture: S].Ft/+H  
1-9分湿气partial moisture: F42TKPN^uu  
1-10含湿量moisture content: XzlIW&"uC  
1-11初始含湿量initial moisture content: 6BR \iZ  
1-12最终含湿量final residual moisture: &:C{/QnA  
1-13湿度degree of moisture ,degree of humidity : B[Ix?V4yy  
1-14干燥物质dry matter : M@5KoMsB9  
1-15干燥物质含量content of dry matter: xan/ay>  
j& <tdORT  
2.干燥工艺 wFn@\3%l`  
2-1干燥阶段stages of drying : o9~h%&  
(1).预干燥preliminary dry: &s2#1  
(2).一次干燥(广义)primary drying(in general): &l?N:(r  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): Iy6p>z|  
(4).二次干燥secondary drying: }^IwQm*i  
2-2.(1).接触干燥contact drying: #efqG=q  
(2).辐射干燥 drying by radiation : sio)_8tp  
(3).微波干燥microwave drying: X!2.IsIS8  
(4).气相干燥vapor phase drying: =]WW'~  
(5).静态干燥static drying: .wM:YX'[G  
(6).动态干燥dynamic drying: nq),VPJi  
2-3干燥时间drying time: IsWcz+1n  
2-4停留时间length of stay(in the drying chamber): `X3Xz!  
2-5循环时间cycle time: .Kg|f~InO  
2-6干燥率 dessication ratio : y4 dp1<t%  
2-7去湿速率mass flow rate of humidity: ntDRlX  
2-8单位面积去湿速率mass flow rate of humidity per surface area: V^9$t/c &  
2-9干燥速度 drying speed : ^l&nB.  
2-10干燥过程drying process: l@~1CMyN  
2-11加热温度heating temperature: Kp$_0  
2-12干燥温度temperature of the material being dried : :~WPY9i`  
2-13干燥损失loss of material during the drying process : Wk0>1 rlu  
2-14飞尘lift off (particles): &NlS  =  
2-15堆层厚度thickness of the material: wBg<Q{J  
9k(*?!\;  
3.冷冻干燥 _ .-o%6  
3-1冷冻freezing: HKq2Js  
(1).静态冷冻static freezing: *4r s  
(2).动态冷冻dynamic freezing: L`<T'3G  
(3).离心冷冻centrifugal freezing: r'Hy}HWuF  
(4).滚动冷冻shell freezing: Q x9>,e6+  
(5).旋转冷冻spin-freezing: ._8xY$l$  
(6).真空旋转冷冻vacuum spin-freezing: RPz!UMQSD  
(7).喷雾冷冻spray freezing: Ufm(2`FQ  
(8).气流冷冻air blast freezing: 5HWwl.D  
3-2冷冻速率rate of freezing: ^#<: <X6  
3-3冷冻物料frozen material: bE VO<x+  
3-4冰核ice core: j;1~=j])  
3-5干燥物料外壳envelope of dried matter: TBoM{s=.  
3-6升华表面sublimation front: /%N31   
3-7融化位置freezer burn: j;ff } b  
Vy?R/ Uu  
4.真空干燥设备;真空冷冻干燥设备 g;u<[>'I  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: OqEg{o5 a&  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: j|^-1X  
4-3加热表面heating surface: ZXF AuF  
4-4物品装载面shelf : xI/{)I1f  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): _A@fP[C  
4-6单位面积干燥器处理能力throughput per shelf area: $|`t9-EA/  
4-7冰冷凝器ice condenser:  ;'2`M  
4-8冰冷凝器的负载load of the ice condenser: UFzM#  
4-9冰冷凝器的额定负载rated load of the ice condenser x>1iIpBv^  
8.   1.一般术语 2<46jJYL'  
1-1试样sample : ?.rH;:9To  
(1).表面层surface layer: )OW(T^>_'I  
(2).真实表面true surface: 3{2^G@j  
(3).有效表面积effective surface area: Q1O_CC}  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: Dz"u8 f  
(5).表面粒子密度surface particle density: BCj`WF@8l{  
(6).单分子层monolayer: N$=(1`zM=  
(7).表面单分子层粒子密度monolayer density: mkj;PYa  
(8).覆盖系数coverage ratio: I,CAFq  
1-2激发excitation: ~$?y1Yv  
(1).一次粒子primary particle: @);!x41f  
(2).一次粒子通量primary particle flux: Yj^avO=;  
(3).一次粒子通量密度density of primary particle flux: j#Ky0+@V  
(4).一次粒子负荷primary particle load: 1_33;gP  
(5).一次粒子积分负荷integral load of primary particle: Q`@$j,v  
(6).一次粒子的入射能量energy of the incident primary particle: okK/i  
(7).激发体积excited volume: +q`rz  
(8).激发面积excited area: %-1BA *J`|  
(9).激发深度excited death: ~RZJ/%6F  
(10).二次粒子secondary particles: 0i5T] )r  
(11).二次粒子通量secondary particle flux: 6oTbn{=UUq  
(12).二次粒子发射能energy of the emitted secondary particles: CN8@c!mB  
(13).发射体积emitting volume: ^LEmi1L  
(14).发射面积emitting area: Z uFV tW@  
(15).发射深度emitting depth: yKe*<\  
(16).信息深度information depth: :XPC0^4s  
(17).平均信息深度mean information depth: DJD]aI  
1-3入射角angle of incidence: (_i vN  
1-4发射角angle of emission: EL 8N[]RF  
1-5观测角observation: !ho5VA t  
1-6分析表面积analyzed surface area: 0]h8)EW  
1-7产额 yield : $$bTd3N+  
1-8表面层微小损伤分析minimum damage surface analysis: E1{:z"  
1-9表面层无损伤分析non-destructive surface analysis: d0H  
1-10断面深度分析 profile analysis in depth; depth profile analysis : &k_wqV  
1-11可观测面积observable area:  23(E3:.  
1-12可观测立体角observable solid angle : oM18aR&  
1-13接受立体角;观测立体角angle of acceptance: c`$`0}  
1-14角分辨能力angular resolving power: iX>!ju'V  
1-15发光度luminosity: n ]6 0  
1-16二次粒子探测比detection ratio of secondary particles: R+kZLOE  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: }`<>$2b  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 53,,%Ue  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: },Y; (n'  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: ~f]r>jQM  
1-21本底压力base pressure: Qa7S'(  
1-22工作压力working pressure: v]`A_)[  
].<sAmL^  
2.分析方法 QGbD=c7  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: $cJN9|$6  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : '4^V4i  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: yf#%)-7(  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: ]\D6;E8P-~  
2-3离子散射表面分析ion scattering spectroscopy: YPff)0Nh  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: F~Z 0  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: Br ^rK}|l  
2-6离子散射谱仪ion scattering spectrometer: rlO%%Qn`  
2-7俄歇效应Auger process: -t~B@%  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: 4_m /_Z0x  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: Zs5I?R1e8  
2-10光电子谱术photoelectron spectroscopy : @R OY}CZ{/  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: SX?$H~A  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: &TkbnDuYd~  
2-11光电子谱仪photoelectron spectrometer: N>}K+M>  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ap'kxOf"1  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 9+is?Pj  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): kX ,FQG>  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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