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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 ?:StFlie  
--------------------------------------------------- 5>9KW7^L  
真空术语 .II*wK k  
FHztF$Z  
1.标准环境条件 standard ambient condition: t "y[  
2.气体的标准状态 standard reference conditions forgases: sk'< K5~  
3.压力(压强)p pressure: (<M^C>pldf  
4.帕斯卡Pa pascal: }"} z7Xb0  
5.托Torr torr: F; upb5  
6.标准大气压atm standard atmosphere: )"( ojh  
7.毫巴mbar millibar: |gXtP-  
8.分压力 partial pressure: #+VH]7]  
9.全压力 total pressure: 0!4;."S  
10.真空 vacuum: Kmy'z  
11.真空度 degree of vacuum: b5!\"v4c  
12.真空区域 ranges of vacuum: hKkUsY=R  
13.气体 gas: 9NUft8QB  
14.非可凝气体 non-condensable gas: Lj]I7ICNh  
15.蒸汽vapor: +SM&_b  
16.饱和蒸汽压saturation vapor pressure: NxOiT#YH  
17.饱和度degree of saturation: 8]SJ=c"}Xf  
18.饱和蒸汽saturated vapor: GUX! kj  
19.未饱和蒸汽unsaturated vapor: )gX7qQ  
20.分子数密度n,m-3 number density of molecules: @B.;V=8wJ  
21.平均自由程ι、λ,m mean free path: tKr.{#)  
22.碰撞率ψ collision rate: LwPZRE#  
23.体积碰撞率χ volume collision rate: `2WtA_  
24.气体量G quantity of gas:  L#  
25.气体的扩散 diffusion of gas: FI.Ae/(U  
26.扩散系数D diffusion coefficient; diffusivity: wEQ7=Gyx  
27.粘滞流 viscous flow: $x5,Oen  
28.粘滞系数η viscous factor: kzky{0yKk=  
29.泊肖叶流 poiseuille flow: m7~<z>5$  
30.中间流 intermediate flow: ]YQ!i@Y  
31.分子流 molecular flow: w)Rtt 9  
32克努曾数 number of knudsen: ,s=jtK  
33.分子泻流 molecular effusion; effusive flow: It5U=PU  
34.流逸 transpiration: `zRE$O  
35.热流逸 thermal transpiration: ;Avz%2#c`  
36.分子流率qN molecular flow rate; molecular flux: {c 82bFiv  
37.分子流率密度 molecular flow rate density; density of molecular flux: os :/-A_m  
38.质量流率qm mass flow rare: 6}V)\"u&   
39.流量qG throughput of gas: .2K4<UOAbm  
40.体积流率qV volume flow rate: S%NS7$`a  
41.摩尔流率qυ molar flow rate: {|R@\G.1(  
42.麦克斯韦速度分布 maxwellian velocity distribution: ~RdD6V  
43.传输几率Pc transmission probability: UU7E+4O&  
44.分子流导CN,UN molecular conductance: o+NPe36  
45.流导C,U conductance: 7m4gGkX#r  
46.固有流导Ci,Ui intrinsic conductance: E1 | >O  
47.流阻W resistance: i146@<\G{P  
48.吸附 sorption: &1=Je$,  
49.表面吸附 adsorption: Ffv v8x  
50.物理吸附physisorption: ?MW *`U  
51.化学吸附 chemisorption: YsX&]4vzm  
52.吸收absorption: k`j>lhH  
53.适应系数α accommodation factor: Fi7G S;  
54.入射率υ impingement rate: 2s^9q9NS"  
55.凝结率condensation rate: `.MY" g9  
56.粘着率 sticking rate: jY~W*  
57.粘着几率Ps sticking probability:  +*W9*gl  
58.滞留时间τ residence time: S.: m$s  
59.迁移 migration: LnwI 7uvq  
60.解吸 desorption: 2H,^i,  
61.去气 degassing: `[OJ)tHE  
62.放气 outgassing: U{ZE|b. ?b  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: DH@]d0N  
64.蒸发率 evaporation rate: T(GEFnt Y  
65.渗透 permeation: )A@ }mIs"  
66.渗透率φ permeability: Y)Os]<N1  
67.渗透系数P permeability coefficient gI~4A,  
2.   1.真空泵 vacuum pumps @Cnn8Y&'  
1-1.容积真空泵 positive displacement pump: X@["Jjp  
⑴.气镇真空泵 gas ballast vacuum pump: /~8<;N>,+  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump:  (0wQ [(  
⑶.干封真空泵 dry-sealed vacuum pump: A^m]DSFOO  
⑷.往复真空泵 piston vacuum pump: z<3{.e\e  
⑸.液环真空泵 liquid ring vacuum pump: iXF iFsb  
⑹.旋片真空泵 sliding vane rotary vacuum pump: i)@IV]]6yL  
⑺.定片真空泵 rotary piston vacuum pump: fZq_]1(/uP  
⑻.滑阀真空泵 rotary plunger vacuum pump: gv6}GE  
⑼.余摆线真空泵 trochoidal vacuum pump: m'!smS x8  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: _v[yY3=3  
⑾.罗茨真空泵 roots vacuum pump: Kyr3)1#J  
1-2.动量传输泵 kinetic vacuum pump: he vM'"|4  
⑴.牵引分子泵molecular drag pump: $] gwaJ:  
⑵.涡轮分子泵turbo molecular pump: JU6PBY~C'  
⑶.喷射真空泵ejector vacuum pump: )=k8W9i8b  
⑷.液体喷射真空泵liquid jet vacuum pump: n#US4&uT4A  
⑸.气体喷射真空泵gas jet vacuum pump: >V01%fLd  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : Wl29xY}`{!  
⑺.扩散泵diffusion pump : !ek};~(  
⑻.自净化扩散泵self purifying diffusion pump: p{V_}:|=Q  
⑼.分馏扩散泵 fractionating diffusion pump : |v Gb,&3  
⑽.扩散喷射泵diffusion ejector pump :  WR;)  
⑾.离子传输泵ion transfer pump: <FkoWN  
1-3.捕集真空泵 entrapment vacuum pump: 2\b 2W_  
⑴吸附泵adsorption pump: u|G&CV#r  
⑵.吸气剂泵 getter pump: nfldj33*  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : Ej[:!L  
⑷.吸气剂离子泵getter ion pump:  9Kpzj43  
⑸.蒸发离子泵 evaporation ion pump: Mnv2tnU]  
⑹.溅射离子泵sputter ion pump: }k{h^!fV  
⑺.低温泵cryopump: 8et*q3D7`  
,/bSa/x`  
2.真空泵零部件 zXEu3h  
2-1.泵壳 pump case: ( !THd  
2-2.入口 inlet: eG @0:  
2-3.出口outlet: rUz-\H(-  
2-4.旋片(滑片、滑阀)vane; blade : (V06cb*42[  
2-5.排气阀discharge valve: mDCz=pk)  
2-6.气镇阀gas ballast valve: sC< B  
2-7.膨胀室expansion chamber: ytDp 4x<W)  
2-8.压缩室compression chamber: 2 1LJ3rW_  
2-9.真空泵油 vacuum pump oil: u2FD@Xq?  
2-10.泵液 pump fluid: xn &$qLB  
2-11.喷嘴 nozzle: en5sqKqh+  
2-13.喷嘴扩张率nozzle expansion rate: $:4* ?8 K2  
2-14.喷嘴间隙面积 nozzle clearance area : ZaZm$.s n  
2-15.喷嘴间隙nozzle clearance: @[2Go}VF  
2-16.射流jet: +H4H$H  
2-17.扩散器diffuser: _Yms]QEZ  
2-18.扩散器喉部diffuser thoat: `pTCK9  
2-19.蒸汽导管vapor tube(pipe;chimney): O^2@9 w  
2-20.喷嘴组件nozzle assembly: 3j h: K   
2-21.下裙skirt: @[=K`n:n_  
T'K6Q cu  
3.附件 rsGQ :c  
3-1阱trap: iPuX  
⑴.冷阱 cold trap: `"-ln'nw  
⑵.吸附阱sorption trap: MB"TwtW  
⑶.离子阱ion trap: IQm[ ,Fh  
⑷.冷冻升华阱 cryosublimation trap: Il8,g+W]  
3-2.挡板baffle: 'f "KV|  
3-3.油分离器oil separator: L3@upb  
3-4.油净化器oil purifier: c@&`!e  
3-5.冷凝器condenser: f~rq)2V:  
</jzM?i  
4.泵按工作分类 *}@zxFe +  
4-1.主泵main pump: :|5 \XV)>  
4-2.粗抽泵roughing vacuum pump: 2X)n.%4g$;  
4-3.前级真空泵backing vacuum pump: ;Pd nE~  
4-4.粗(低)真空泵 roughing(low)vacuum pump: "J_#6q*  
4-5.维持真空泵holding vacuum pump: `zw^ WbCO{  
4-6.高真空泵high vacuum pump: r2xXS&9!|  
4-7.超高真空泵ultra-high vacuum pump: HO`N]AMw  
4-8.增压真空泵booster vacuum pump: gx55.}  
^{m&2l&87  
5.真空泵特性 2K~<_.S  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: }iE!( l  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 *i)3q+%.  
5-3.起动压力starting pressure: Bokpvd-c7  
5-4.前级压力 backing pressure : Ht,dMt>:  
5-5.临界前级压力 critical backing pressure: -yJ%G1R  
5-6.最大前级压力maximum backing pressure: h't! 1u  
5-7.最大工作压力maximum working pressure: yd>b2 M  
5-8.真空泵的极限压力ultimate pressure of a pump: |ler\"Eu  
5-9.压缩比compression ratio: )/vse5EG+  
5-10.何氏系数Ho coefficient: v"I#.{LiH=  
5-11.抽速系数speed factor: {pR4+g  
5-12.气体的反扩散back-diffusion of gas: O'L9 s>B  
5-13.泵液返流back-streaming of pump fluid: 5X1z^(   
5-14.返流率back-streaming rate EG&97l b  
5-15.返迁移back-migration: 6 *GR_sMm  
5-16.爆腾bumping: >[A7oH  
5-17.水蒸气允许量qm water vapor tolerable load: Xk]:]pl4W  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: t~0!K;nn  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: yOdh?:Imv  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 1!P\x=Nn_  
3.   1.一般术语 P =jRof$  
1-1.压力计pressure gauge: AW')*{/(Ii  
1-2.真空计vacuum gauge: m5'nqy F  
⑴.规头(规管)gauge head: }9FAM@x1K&  
⑵.裸规nude gauge : 4b/>ZHFOF;  
⑶.真空计控制单元gauge control unit : vWh]1G#'p[  
⑷.真空计指示单元gauge indicating unit : ^OZ*Le  
2vLV1v$,q  
2.真空计一般分类 ~ _G W  
2-1.压差式真空计differential vacuum gauge: z,+LPr  
2-2.绝对真空计 absolute vacuum gauge: /qwl;_Jcf  
2-3.全压真空计total pressure vacuum gauge: _t7}ny[  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: )&F]j  
2-5.相对真空计relative vacuum gauge : M!D&a)\  
50='>|b  
3.真空计特性 3X>x`  
3-1.真空计测量范围pressure range of vacuum gauge: u$%;03hJ  
3-2.灵敏度系数sensitivity coefficient: ~^<1k-  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): \ y}!yrQ  
3-5.规管光电流photon current of vacuum gauge head: \nbGdka  
3-6.等效氮压力equivalent nitrogen pressure : dZ6P)R  
3-7.X射线极限值 X-ray limit: :+? w>  
3-8.逆X射线效应anti X-ray effect:  {Yc#XP  
3-9.布利尔斯效应blears effect: |J^}BXW'^)  
D~T;z pS  
4.全压真空计 q?0&&"T}  
4-1.液位压力计liquid level manometer: 0 YA  
4-2.弹性元件真空计elastic element vacuum gauge: ;Im%L=q9GL  
4-3.压缩式真空计compression gauge: 5fjL  
4-4.压力天平pressure balance: AQU^7O  
4-5.粘滞性真空计viscosity gauge : <oKoz0!  
4-6.热传导真空计thermal conductivity vacuum gauge : ~bnyk%S o  
4-7.热分子真空计thermo-molecular gauge: Gzw9E.Hk  
4-8.电离真空计ionization vacuum gauge: G4jyi&]  
4-9.放射性电离真空计radioactive ionization gauge: y{k65dk-  
4-10.冷阴极电离真空计cold cathode ionization gauge: 6cVJu%<V  
4-11.潘宁真空计penning gauge: G 5!J9@Yi  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 'Z}3XVZEN  
4-13.放电管指示器discharge tube indicator: J-U5_>S  
4-14.热阴极电离真空计hot cathode ionization gauge: !l|fzS8g  
4-15.三极管式真空计triode gauge: {W11+L{8  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: A8T75?lL(  
4-17.B-A型电离真空计Bayard-Alpert gauge: '?O_(%3F0  
4-18.调制型电离真空计modulator gauge: \ 3XG8J  
4-19.抑制型电离真空计suppressor gauge: s%/x3anz=  
4-20.分离型电离真空计extractor gauge: YW7Pimks  
4-21.弯注型电离真空计bent beam gauge: 6+LBs.vl}  
4-22.弹道型电离真空计 orbitron gauge : S9kA69O  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: kdW$>Jqb  
oU)Hco"_k  
5.分压真空计(分压分析器) yR$ld.[uf  
5-1.射频质谱仪radio frequency mass spectrometer: X"EZpJ'W  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: X6-;vnlKN  
5-3.单极质谱仪momopole mass spectrometer: #<o=W#[  
5-4.双聚焦质谱仪double focusing mass spectrometer: aESlb H  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ,k |QuOrCh  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: K'f`}y9  
5-7.回旋质谱仪omegatron mass spectrometer: >`=9So_J  
5-8.飞行时间质谱仪time of flight mass spectrometer: cUj^aTpm  
A81'ca/  
6.真空计校准 ,p)Qu%'  
6-1.标准真空计reference gauges: *o}7&Hw#9f  
6-2.校准系统system of calibration: :x[SV^fw[  
6-3.校准系数K calibration coefficient: ]9lR:V sw  
6-4.压缩计法meleod gauge method: c1sVdM}|  
6-5.膨胀法expansion method: }Hy4^2B  
6-6.流导法flow method: :v B9z  
4.   1.真空系统vacuum system Y_= ]w1  
1-1.真空机组pump system: 4o3TW#  
1-2.有油真空机组pump system used oil : ;2}wrX  
1-3.无油真空机组oil free pump system yN{TcX  
1-4.连续处理真空设备continuous treatment vacuum plant: 7fXta|eP0  
1-5.闸门式真空系统vacuum system with an air-lock: =Q~@dP  
1-6.压差真空系统differentially pumped vacuum system: <^(>o  
1-7.进气系统gas admittance system: %?m_;iv  
:y1,OR/k  
2.真空系统特性参量 k@|Go )~  
2-1.抽气装置的抽速volume flow rate of a pumping unit : HB*H%>L{"B  
2-2.抽气装置的抽气量throughput of a pumping unit : V/Q/Ujgg  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: C17$ qdV/  
2-4.真空系统的漏气速率leak throughput of a vacuum system: jT*?Z:U  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: +5"Pm]oRbx  
2-6.极限压力ultimate pressure: _^@>I8ix  
2-7.残余压力residual pressure: 3W3)%[ 5  
2-8.残余气体谱residual gas spectrum: BFswqp:  
2-9.基础压力base pressure: tLzb*U8'1w  
2-10.工作压力working pressure: 2?nEHIUT  
2-11.粗抽时间roughing time: })umg8s  
2-12.抽气时间pump-down time: NCivh&HR  
2-13.真空系统时间常数time constant of a vacuum system: @kWRI*m  
2-14.真空系统进气时间venting time: !,9 ;AMO -  
S+bpWA  
3.真空容器 G]zyx"0Sqb  
3-1.真空容器;真空室vacuum chamber: H (tT8Q5i  
3-2.封离真空装置sealed vacuum device: i\dd  
3-3.真空钟罩vacuum bell jar: 5pH6]$  
3-4.真空容器底板vacuum base plate: V*gh"gZ<  
3-5.真空岐管vacuum manifold: q,T4- E  
3-6.前级真空容器(贮气罐)backing reservoir: 6PT"9vR`)  
3-7.真空保护层outer chamber: 4u= v  
3-8.真空闸室vacuum air lock: opgNt o6$  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: nLY(%):(P  
|ITh2m  
4.真空封接和真空引入线 ihd^P]  
4-1.永久性真空封接permanent seal : 6,~]2H'zq  
4.2.玻璃分级过渡封接graded seal : j:7AVnt  
4-3.压缩玻璃金属封接compression glass-to-metal seal: .`jYrW-k  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: |#ZMZmo{  
4-5.陶瓷金属封接ceramic-to-metal seal: |ZG0E  
4-6.半永久性真空封接semi-permanent seal : H,EGB8E2  
4-7.可拆卸的真空封接demountable joint: ^{a_:r"  
4-8.液体真空封接liquid seal @a (-U.CZ  
4-9.熔融金属真空封接molten metal seal: uj@d {AQ  
4-10.研磨面搭接封接ground and lapped seal: %5!K?,z%  
4-11.真空法兰连接vacuum flange connection: Ch_eK^ g1  
4-12.真空密封垫vacuum-tight gasket: yX.; x 0  
4-13.真空密封圈ring gasket: sAS[wcOQ  
4-14.真空平密封垫flat gasket: l4ru0V8s7  
4-15.真空引入线feedthrough leadthrough: -8yN6 0|  
4-16.真空轴密封shaft seal: L&0aS:  
4-17.真空窗vacuum window: NUFW SL>  
4-18.观察窗viewing window: '"T9y=9]s  
*p0Kw>  
5.真空阀门 .Bojb~zt  
5-1.真空阀门的特性characteristic of vacuum valves: (0["|h32,  
⑴.真空阀门的流导conductance of vacuum valves: ` <u2 N  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: $r)NL  
5-2.真空调节阀regulating valve: %+oqAY m+s  
5-3.微调阀 micro-adjustable valve: kS4YxtvB  
5-4.充气阀charge valve: }$b!/<7FD  
5-5.进气阀gas admittance valve: 5 zz">-Q !  
5-6.真空截止阀break valve: F+!9T  
5-7.前级真空阀backing valve: 8^67,I-c  
5-8.旁通阀 by-pass valve: Aw&0R"{  
5-9.主真空阀main vacuum valve: Nu euCiP  
5-10.低真空阀low vacuum valve: 7^<6|>j4  
5-11.高真空阀high vacuum valve: )E m`kle  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 9Dp0Pi?29  
5-13.手动阀manually operated valve: }#S1!TU  
5-14.气动阀pneumatically operated valve: :LCyxLI  
5-15.电磁阀electromagnetically operated valve: PMT}fg  
5-16.电动阀valve with electrically motorized operation: $HCgawQ  
5-17.挡板阀baffle valve: 1A[(RT]  
5-18.翻板阀flap valve: VaA.J  
5-19.插板阀gate valve: @VQ<X4 Za  
5-20.蝶阀butterfly valve: L{oG'aK4  
<H$!OPV  
6.真空管路 &+3RsIl W  
6-1.粗抽管路roughing line: pj$kSS|m6-  
6-2.前级真空管路backing line: @w;$M]o1  
6-3.旁通管路;By-Pass管路 by-pass line: FKUo^F?z  
6-4.抽气封口接头pumping stem: }WhRJr`a  
6-5.真空限流件limiting conductance:       [Sj"gLj  
6-6.过滤器filter: 0lV;bVa%  
5.   1.一般术语 >+DM TV[O  
1-1真空镀膜vacuum coating: \VWgF)_  
1-2基片substrate: +S WtHj7e  
1-3试验基片testing substrate: L1f=90  
1-4镀膜材料coating material: BkP4.XRI  
1-5蒸发材料evaporation material: nu Vux5:  
1-6溅射材料sputtering material: #8~ygEa}  
1-7膜层材料(膜层材质)film material: 1Vc~Sa  
1-8蒸发速率evaporation rate: USaa#s4'  
1-9溅射速率sputtering rate: *Q#oV}D_  
1-10沉积速率deposition rate: 'bsHoO  
1-11镀膜角度coating angle: DP;:%L}  
f8ZuG !U  
2.工艺 al9( 9)  
2-1真空蒸膜vacuum evaporation coating: UA(4mbz+  
(1).同时蒸发simultaneous evaporation: 5A<}*T  
(2).蒸发场蒸发evaporation field evaporation: efE=5%O  
(3).反应性真空蒸发reactive vacuum evaporation: }=Xlac_U  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ?J-\}X  
(5).直接加热的蒸发direct heating evaporation: TZGk[u^*  
(6).感应加热蒸发induced heating evaporation: "$D'gS oYe  
(7).电子束蒸发electron beam evaporation: /;{L~f=et)  
(8).激光束蒸发laser beam evaporation: 0+u >"7T  
(9).间接加热的蒸发indirect heating evaporation: 5=I"bnIU  
(10).闪蒸flash evaportion: y0-UO+ ;  
2-2真空溅射vacuum sputtering: #c":y5:  
(1).反应性真空溅射 reactive vacuum sputtering: #eX<=H]  
(2).偏压溅射bias sputtering: R.DUfU"gp  
(3).直流二级溅射direct current diode sputtering: 6nR EuT'k  
(4).非对称性交流溅射asymmtric alternate current sputtering: 8_ o~0lb  
(5).高频二极溅射high frequency diode sputtering: Q*M(d\Vs  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ~ch%mI~  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: qHtIjtt[q  
(8).离子束溅射ion beam sputtering: R$66F>Jz^  
(9).辉光放电清洗glow discharge cleaning: z 2jC48~  
2-3物理气相沉积PVD physical vapor deposition: ,p /{!BX  
2-4化学气相沉积CVD chemical vapor deposition: ,LP^v'[V7  
2-5磁控溅射magnetron sputtering: zG8g}FrzG;  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 0S9~db  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: ^b}Wl0Fn  
2-8电弧离子镀arc discharge deposition: h&n1}W+  
xRdx` YYu  
3.专用部件 AJE$Z0{q  
3-1镀膜室coating chamber: y/kB`Z(Yj  
3-2蒸发器装置evaporator device: Pf<yLT]  
3-3蒸发器evaporator: qS"#jxc==+  
3-4直接加热式蒸发器evaporator by direct heat: La3rX  
3-5间接加热式蒸发器evaporator by indirect heat: l5~O}`gfh  
3-7溅射装置sputtering device: }}ic{931  
3-8靶target: 13w(Tf  
3-10时控挡板timing shutter: BFg&@7.X  
3-11掩膜mask: !s?SI=B8  
3-12基片支架substrate holder: bM5o-U#^ C  
3-13夹紧装置clamp: VIN0kRQ#  
3-14换向装置reversing device: >fth iA  
3-15基片加热装置substrate heating device: +GL$[ 5G  
3-16基片冷却装置substrate colding device: 8UXRM :Z"  
XogCq?_m  
4.真空镀膜设备 jwBJG7\  
4-1真空镀膜设备vacuum coating plant: yTh%[k  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: X,#~[%h$-=  
(2).真空溅射镀膜设备vacuum sputtering coating plant: f$n5$hJlQ  
4-2连续镀膜设备continuous coating plant: PHEQG]H S  
4-3半连续镀膜设备semi- continuous coating plant }ijQ*ECdl  
6.   1.漏孔 Jj\lF*B  
1-1漏孔leaks: &6 <a<S  
1-2通道漏孔channel leak: 2H0BNrYM  
1-3薄膜漏孔membrane leak: s;=C&N5g  
1-4分子漏孔molecular leak: V=% ;5/  
1-5粘滞漏孔vixcous leak: al-rgh  
1-6校准漏孔calibrated leak: #p55/54ZI  
1-7标准漏孔reference leak : RPte[tq  
1-8虚漏virtual leak: JAP(J~  
1-9漏率leak rate: s,8zj<dUv  
1-10标准空气漏率standard air leak rate: w= n(2M56C  
1-11等值标准空气漏率equivalent standard air leak rate: AO]cnh C  
1-12探索(示漏)气体: -W<1BJE  
%=Z/Frd  
2.本底 CfSP*g0rW  
2-1本底background: ;b~\ [  
2-2探索气体本底search gas background : rUmP_  
2-3漂移drift: \q4r/SbgW  
2-4噪声noise: noL9@It0  
{jmy:e2  
3.检漏仪 f7][#EL  
3-1检漏仪leak detector: .RJMtmp  
3-2高频火花检漏仪H.F. spark leak detector: 6]d]0TW_  
3-3卤素检漏仪halide leak detector: ..+#~3es#y  
3-4氦质谱检漏仪helium mass spectrometer leak detector: _oCNrjt9  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: x.wDA3ys  
m 8b,_1  
4.检漏 |*UB/8C^/!  
4-1气泡检漏leak detection by bubbles: Ez0zk9  
4-2氨检漏leak detection by ammonia: Z+J4 q9^$  
4-3升压检漏leak detection of rise pressure: h=:/9O{H  
4-4放射性同位素检漏radioactive isotope leak detection: geqP.MR  
4-5荧光检漏fluorescence leak detection h_S>Q  
7.   1.一般术语 D\9-/ p  
1-1真空干燥vacuum drying: &JqaIJh   
1-2冷冻干燥freeze drying : K)~aH  
1-3物料material: gCC7L(1  
1-4待干燥物料material to be dried: \#t)B J2  
1-5干燥物料dried material : Z%:>nDZV  
1-6湿气moisture;humidity: QAp]cE1ew  
1-7自由湿气free moisture: RK &>!^  
1-8结合湿气bound moisture: /*,_\ ;  
1-9分湿气partial moisture: O^row1D_  
1-10含湿量moisture content: rf:H$\yw  
1-11初始含湿量initial moisture content: =3w;<1 ?'  
1-12最终含湿量final residual moisture: Cp"7R&s  
1-13湿度degree of moisture ,degree of humidity : LlO8]b!P-^  
1-14干燥物质dry matter : PC<_1!M]  
1-15干燥物质含量content of dry matter: nWY^?e'S  
BR@m*JGajz  
2.干燥工艺 /B~[,ES@1  
2-1干燥阶段stages of drying : -[ gT}{k!  
(1).预干燥preliminary dry: )3:0TFS}}k  
(2).一次干燥(广义)primary drying(in general): XDPgl=~  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): QO(F%&v++  
(4).二次干燥secondary drying: A8*zB=C  
2-2.(1).接触干燥contact drying: &4S2fWx  
(2).辐射干燥 drying by radiation : v#/Gxk9eX  
(3).微波干燥microwave drying: 62qjU<Z  
(4).气相干燥vapor phase drying: o!":mJy  
(5).静态干燥static drying: pF8 #H~  
(6).动态干燥dynamic drying: 2*V[kmD/3  
2-3干燥时间drying time: 3S7"P$q  
2-4停留时间length of stay(in the drying chamber): UWvVYdy7  
2-5循环时间cycle time: ,_RNZ sa;&  
2-6干燥率 dessication ratio : ?V^7`3F  
2-7去湿速率mass flow rate of humidity: Coe/4! $M  
2-8单位面积去湿速率mass flow rate of humidity per surface area: rFQWgWD  
2-9干燥速度 drying speed : uoI7' :Nv  
2-10干燥过程drying process: @|vH5Pi  
2-11加热温度heating temperature: uI/ wR!  
2-12干燥温度temperature of the material being dried : *??lwvJp  
2-13干燥损失loss of material during the drying process : ?}4,s7PR  
2-14飞尘lift off (particles): }QE*-GVv]  
2-15堆层厚度thickness of the material: X$ ZVY2  
ngl +`|u  
3.冷冻干燥 @i;)`k5b  
3-1冷冻freezing: uwSSrT  
(1).静态冷冻static freezing: ' 1gfXC  
(2).动态冷冻dynamic freezing: HT.*r6Y>g  
(3).离心冷冻centrifugal freezing: 2]]v|Z2M4  
(4).滚动冷冻shell freezing: JN|6+.GG  
(5).旋转冷冻spin-freezing: ^x: lB>  
(6).真空旋转冷冻vacuum spin-freezing: ~ $g:  
(7).喷雾冷冻spray freezing: $3g{9)}  
(8).气流冷冻air blast freezing: \}?X5X>  
3-2冷冻速率rate of freezing: WqCC4R,-  
3-3冷冻物料frozen material: -9i7Ja  
3-4冰核ice core: nm,LKS7  
3-5干燥物料外壳envelope of dried matter: Q7$o&N{  
3-6升华表面sublimation front: {4G/HW28  
3-7融化位置freezer burn: aIV / c  
_y^r==  
4.真空干燥设备;真空冷冻干燥设备  Qw}1q!89  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: rQVX^  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 1 &9|~">{C  
4-3加热表面heating surface: SXm%X(JU  
4-4物品装载面shelf : rTIu'  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): r[a7">n  
4-6单位面积干燥器处理能力throughput per shelf area: 0- )K_JV  
4-7冰冷凝器ice condenser: TQF+aP8[L  
4-8冰冷凝器的负载load of the ice condenser: EJ9hgE  
4-9冰冷凝器的额定负载rated load of the ice condenser :-46"bP.  
8.   1.一般术语 :x*)o+  
1-1试样sample : tTLg;YjN  
(1).表面层surface layer: P9 <U+\z  
(2).真实表面true surface: \xkKgI/  
(3).有效表面积effective surface area: +nDy b  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: vt|R)[,  
(5).表面粒子密度surface particle density: >CqzC8JF  
(6).单分子层monolayer: 'p&,'+x  
(7).表面单分子层粒子密度monolayer density: MYWkEv7  
(8).覆盖系数coverage ratio: vA1Yya B  
1-2激发excitation: $Iwvecn?I  
(1).一次粒子primary particle: ixd sz\<  
(2).一次粒子通量primary particle flux: k2U*dn"9U  
(3).一次粒子通量密度density of primary particle flux: esqmj#G  
(4).一次粒子负荷primary particle load: :}lqu24K  
(5).一次粒子积分负荷integral load of primary particle: "+F'WCJ-(*  
(6).一次粒子的入射能量energy of the incident primary particle: uw}Rr7q  
(7).激发体积excited volume: iAwEnQ3h  
(8).激发面积excited area: +(3_V$|Dv  
(9).激发深度excited death: Rm} ym9  
(10).二次粒子secondary particles: 5`QcPDp{z  
(11).二次粒子通量secondary particle flux: /o;M ?Nt6  
(12).二次粒子发射能energy of the emitted secondary particles: gsk? !D  
(13).发射体积emitting volume: L (Y1ey9x  
(14).发射面积emitting area: 4+RR`I8$Ge  
(15).发射深度emitting depth: `@/)S^jBau  
(16).信息深度information depth: +3)r szb72  
(17).平均信息深度mean information depth: 2*|T)OA`m,  
1-3入射角angle of incidence: hH8&g%{2  
1-4发射角angle of emission: Hc)z:x;Sj  
1-5观测角observation: %;,fI'M  
1-6分析表面积analyzed surface area: lK0ny>RB  
1-7产额 yield : .A2$C|a*  
1-8表面层微小损伤分析minimum damage surface analysis: CJ IuMsZ  
1-9表面层无损伤分析non-destructive surface analysis: @NiuT%#c  
1-10断面深度分析 profile analysis in depth; depth profile analysis : ?h= n5}Y  
1-11可观测面积observable area: 4ba*Nc*Yc  
1-12可观测立体角observable solid angle :  ?Y(  
1-13接受立体角;观测立体角angle of acceptance: k{}> *pCU  
1-14角分辨能力angular resolving power: oJ74Mra  
1-15发光度luminosity: ->sxz/L  
1-16二次粒子探测比detection ratio of secondary particles: 3e_tT8  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: `\kihNkJn3  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: s^wm2/Yw  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: WAa45G  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis:  \i%'M%  
1-21本底压力base pressure: VI0wul~M  
1-22工作压力working pressure: i5VZ,E^E  
D|:'|7l W  
2.分析方法 T6U/}&{O  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: -*C WF|<G  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : x[(6V'  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: (Rw<1q`,  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: X0lPRk53(  
2-3离子散射表面分析ion scattering spectroscopy: p['RV  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: ,i2-  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: 7'G;ijx  
2-6离子散射谱仪ion scattering spectrometer: ".?4`@7F\  
2-7俄歇效应Auger process: 3U[O :  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: m=dNJF  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: QJ|@Y(KV0  
2-10光电子谱术photoelectron spectroscopy : f9.?+.^_  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: NJUKH1lIhR  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: <J/ =$u/  
2-11光电子谱仪photoelectron spectrometer: mq`/nAmt  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: W0qR? jc  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: uzYB`H<  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): m2(>KMbi  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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