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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 {&,p<5o  
--------------------------------------------------- 1`K-f m)  
真空术语 #QoWneZ  
Xx{| [2`  
1.标准环境条件 standard ambient condition: 94+^K=lAX  
2.气体的标准状态 standard reference conditions forgases: ;[}OZt  
3.压力(压强)p pressure: &T,|?0>~=J  
4.帕斯卡Pa pascal: F<,pAxl~@  
5.托Torr torr: Nn[*ox#i  
6.标准大气压atm standard atmosphere: bgi_QB#k\  
7.毫巴mbar millibar: K<e #y!  
8.分压力 partial pressure: v1,#7s AW'  
9.全压力 total pressure: ]&%KU)i?  
10.真空 vacuum: -lhIL}mGf  
11.真空度 degree of vacuum: '#f<wf n  
12.真空区域 ranges of vacuum: 9 8|sWI3 B  
13.气体 gas: X[o+Y@bc  
14.非可凝气体 non-condensable gas: <R]m(  
15.蒸汽vapor: 5v)^4( )  
16.饱和蒸汽压saturation vapor pressure: fEZuv?@  
17.饱和度degree of saturation: L;RE5YrH%6  
18.饱和蒸汽saturated vapor: ~#sD2b` 0  
19.未饱和蒸汽unsaturated vapor: HDH G~<s  
20.分子数密度n,m-3 number density of molecules: [=>=5'-  
21.平均自由程ι、λ,m mean free path: l<+ [l$0#  
22.碰撞率ψ collision rate: teJt.VA7)  
23.体积碰撞率χ volume collision rate: }gkLO TJ/,  
24.气体量G quantity of gas: ]o<]A[<  
25.气体的扩散 diffusion of gas: ipwlP|UjQ5  
26.扩散系数D diffusion coefficient; diffusivity: CT[9=wV)m%  
27.粘滞流 viscous flow: F0<)8{s  
28.粘滞系数η viscous factor: ?XHQdN3e  
29.泊肖叶流 poiseuille flow: [<#j K}g  
30.中间流 intermediate flow: lnyb4d/  
31.分子流 molecular flow: ^v; )6a2  
32克努曾数 number of knudsen: i//H5D3  
33.分子泻流 molecular effusion; effusive flow: ]bY|>q  
34.流逸 transpiration: #hxYB  
35.热流逸 thermal transpiration:  g{Hgs  
36.分子流率qN molecular flow rate; molecular flux: iwK.*07+  
37.分子流率密度 molecular flow rate density; density of molecular flux: ,u `xneOs  
38.质量流率qm mass flow rare: 7[1Lh'u  
39.流量qG throughput of gas: #dZs[R7h  
40.体积流率qV volume flow rate: .^wpfS  
41.摩尔流率qυ molar flow rate: u"HGT=Nl  
42.麦克斯韦速度分布 maxwellian velocity distribution: CVfV    
43.传输几率Pc transmission probability: hTtn /j  
44.分子流导CN,UN molecular conductance: ai_ve[A  
45.流导C,U conductance: zKd@Ab  
46.固有流导Ci,Ui intrinsic conductance: f;{Q ~  
47.流阻W resistance: axnlI*!  
48.吸附 sorption: /pj[c;aO  
49.表面吸附 adsorption: v&d1ACctJ  
50.物理吸附physisorption: \V>5)R n  
51.化学吸附 chemisorption: = QBvU)Ki  
52.吸收absorption: OXEEpoU?V  
53.适应系数α accommodation factor: ^p3 GT6  
54.入射率υ impingement rate: E8!`d}\#  
55.凝结率condensation rate: UGO#o`.G}  
56.粘着率 sticking rate: 8FuxN2  
57.粘着几率Ps sticking probability: d6J/)nl  
58.滞留时间τ residence time: 4CM'I~  
59.迁移 migration: Ixa0;nxj  
60.解吸 desorption: ;QBS0x\f@  
61.去气 degassing: 4qid+ [B  
62.放气 outgassing: 8%9 C<+.R  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: 296}LW  
64.蒸发率 evaporation rate: o !tC{"g  
65.渗透 permeation: JXc.?{LL  
66.渗透率φ permeability: u9!  ?  
67.渗透系数P permeability coefficient ok\-IU?  
2.   1.真空泵 vacuum pumps $XF$ n#ua  
1-1.容积真空泵 positive displacement pump: (7R?T}  
⑴.气镇真空泵 gas ballast vacuum pump: -Uo11'{  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: iXMJ1\!q\|  
⑶.干封真空泵 dry-sealed vacuum pump:  lbHgxZ  
⑷.往复真空泵 piston vacuum pump: yNvAT>H  
⑸.液环真空泵 liquid ring vacuum pump: ,Wlt[T(.;  
⑹.旋片真空泵 sliding vane rotary vacuum pump: )]P(!hW.  
⑺.定片真空泵 rotary piston vacuum pump: 1&MCS%UTL  
⑻.滑阀真空泵 rotary plunger vacuum pump: a}UmD HS-  
⑼.余摆线真空泵 trochoidal vacuum pump: \|,| )  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ,\M77V  
⑾.罗茨真空泵 roots vacuum pump: PJ5}c!o[  
1-2.动量传输泵 kinetic vacuum pump:  (Q8!5s  
⑴.牵引分子泵molecular drag pump: p\&O;48=  
⑵.涡轮分子泵turbo molecular pump: 2^o7 ^S  
⑶.喷射真空泵ejector vacuum pump: =%W:N|k  
⑷.液体喷射真空泵liquid jet vacuum pump: p{w-  
⑸.气体喷射真空泵gas jet vacuum pump: >5FTB e[D  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : k'o[iKlu  
⑺.扩散泵diffusion pump : V%8(zt  
⑻.自净化扩散泵self purifying diffusion pump: #gC [L=01  
⑼.分馏扩散泵 fractionating diffusion pump : J p?XV<3Z  
⑽.扩散喷射泵diffusion ejector pump : ! 6(3Y  
⑾.离子传输泵ion transfer pump: ,6>3aD1w~q  
1-3.捕集真空泵 entrapment vacuum pump: gC1LQ!:;Oi  
⑴吸附泵adsorption pump: -pC'C%Q  
⑵.吸气剂泵 getter pump: ZO<,V  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : OFtaOjsyUa  
⑷.吸气剂离子泵getter ion pump: &ksuk9M  
⑸.蒸发离子泵 evaporation ion pump: >PA*L(Dh%  
⑹.溅射离子泵sputter ion pump: ,U\ s89  
⑺.低温泵cryopump: a}y b~:TC  
`>sOOA  
2.真空泵零部件 =dGp&9K,fw  
2-1.泵壳 pump case: 5MnP6(3$  
2-2.入口 inlet: UePkSz9EU  
2-3.出口outlet: .y s_'F-]0  
2-4.旋片(滑片、滑阀)vane; blade : E f\|3D_  
2-5.排气阀discharge valve: +YvF+E  
2-6.气镇阀gas ballast valve: E;a,].  
2-7.膨胀室expansion chamber: CP7Fe{P  
2-8.压缩室compression chamber: =o 9s?vOJ  
2-9.真空泵油 vacuum pump oil: >?@5>wF  
2-10.泵液 pump fluid: !8G)` '  
2-11.喷嘴 nozzle: uyYV_Q0~;  
2-13.喷嘴扩张率nozzle expansion rate: JR] 2Ray  
2-14.喷嘴间隙面积 nozzle clearance area : => (g_\  
2-15.喷嘴间隙nozzle clearance: e4z~   
2-16.射流jet:  FSMM  
2-17.扩散器diffuser: H\>{<`sD;f  
2-18.扩散器喉部diffuser thoat: <odi>!ViH  
2-19.蒸汽导管vapor tube(pipe;chimney): FOG{dio  
2-20.喷嘴组件nozzle assembly: T1d@=&0"  
2-21.下裙skirt: )V1xL_hx/  
d'';0[W)  
3.附件 LACrg  
3-1阱trap: pbx*Y`v  
⑴.冷阱 cold trap: :`N&BV  
⑵.吸附阱sorption trap: 0Q{lyu  
⑶.离子阱ion trap: (7g"ppf  
⑷.冷冻升华阱 cryosublimation trap: 0 PYYG  
3-2.挡板baffle: '7'/+G'~&  
3-3.油分离器oil separator: {]dxFhe)  
3-4.油净化器oil purifier: 4;YP\{u  
3-5.冷凝器condenser: 5sJ>+Rg  
ZH Q?{"  
4.泵按工作分类 *HD(\;i-$  
4-1.主泵main pump: ??/bI~Sd  
4-2.粗抽泵roughing vacuum pump: *ak0(yLn)  
4-3.前级真空泵backing vacuum pump: ZD&F ,2v  
4-4.粗(低)真空泵 roughing(low)vacuum pump: "p O  
4-5.维持真空泵holding vacuum pump: \Eh5g/,[  
4-6.高真空泵high vacuum pump: p(RF   
4-7.超高真空泵ultra-high vacuum pump: g4^-B  
4-8.增压真空泵booster vacuum pump: V48_aL  
c[-N A  
5.真空泵特性 .s<0}<Aq>  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: je mb/ :E  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 QP'sS*saJ  
5-3.起动压力starting pressure: ] 0R*F30]  
5-4.前级压力 backing pressure : AW r2Bv  
5-5.临界前级压力 critical backing pressure: #2^0z`-\_z  
5-6.最大前级压力maximum backing pressure: p7YYAh@x\  
5-7.最大工作压力maximum working pressure: }n&nuaj  
5-8.真空泵的极限压力ultimate pressure of a pump: (1CP]5W  
5-9.压缩比compression ratio: bD,21,*z  
5-10.何氏系数Ho coefficient: +'m9b7+v  
5-11.抽速系数speed factor: M]o]D;N~l  
5-12.气体的反扩散back-diffusion of gas: HAH\ #WE  
5-13.泵液返流back-streaming of pump fluid: 5X^\AW  
5-14.返流率back-streaming rate PY.HZ/#d  
5-15.返迁移back-migration: Y7S1^'E 3  
5-16.爆腾bumping: YW7w>}aW  
5-17.水蒸气允许量qm water vapor tolerable load: #K^hKx9  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: 5mAb9F8@  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: Q9cSrU[$  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 3N >V sl  
3.   1.一般术语 $'\kK,=  
1-1.压力计pressure gauge: ?eTZ>o.p/  
1-2.真空计vacuum gauge: @]Vcl"t  
⑴.规头(规管)gauge head: ]pm/5|  
⑵.裸规nude gauge : #f(a,,Uu'  
⑶.真空计控制单元gauge control unit : 2(d  
⑷.真空计指示单元gauge indicating unit :  8~T}BC  
|r+ x/,2-  
2.真空计一般分类 R_j.k3r4d  
2-1.压差式真空计differential vacuum gauge: wbWC &X.  
2-2.绝对真空计 absolute vacuum gauge: J;>;K6pW  
2-3.全压真空计total pressure vacuum gauge: UI=v| <'-  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: V~PGmn[V  
2-5.相对真空计relative vacuum gauge : f8-`bb  
YAXd   
3.真空计特性 {eU>E /SQ  
3-1.真空计测量范围pressure range of vacuum gauge: #eYYu2ND  
3-2.灵敏度系数sensitivity coefficient: pq0Z<b;2  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): >C,0}lj  
3-5.规管光电流photon current of vacuum gauge head: Gw) y<h  
3-6.等效氮压力equivalent nitrogen pressure : i?B<&'G  
3-7.X射线极限值 X-ray limit: -$!r+4|q  
3-8.逆X射线效应anti X-ray effect: l8E))oz1T  
3-9.布利尔斯效应blears effect: QV."ZhL5=  
&</)k|.A6\  
4.全压真空计 1a9' *[  
4-1.液位压力计liquid level manometer: pOK=o$1V8  
4-2.弹性元件真空计elastic element vacuum gauge: 3q4VH q  
4-3.压缩式真空计compression gauge: $l)RMP}  
4-4.压力天平pressure balance: PoZ$3V$(Lz  
4-5.粘滞性真空计viscosity gauge : kQU4s)J  
4-6.热传导真空计thermal conductivity vacuum gauge : "`K_5"F  
4-7.热分子真空计thermo-molecular gauge: 'sAkrl8kt  
4-8.电离真空计ionization vacuum gauge: # N3*SE  
4-9.放射性电离真空计radioactive ionization gauge: ]+G\1SN~  
4-10.冷阴极电离真空计cold cathode ionization gauge: #>_t[9;  
4-11.潘宁真空计penning gauge: !ldE9 .  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: H.?`90IQ  
4-13.放电管指示器discharge tube indicator: Hd4 ~v0eS  
4-14.热阴极电离真空计hot cathode ionization gauge: ~7aD#`amU  
4-15.三极管式真空计triode gauge: #HL$`&m  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: &=t~_ Dc  
4-17.B-A型电离真空计Bayard-Alpert gauge: mmwc'-jU:  
4-18.调制型电离真空计modulator gauge: ;|T|*0vY[  
4-19.抑制型电离真空计suppressor gauge: Kez0Bka  
4-20.分离型电离真空计extractor gauge: R)d_0Ng  
4-21.弯注型电离真空计bent beam gauge: \>su97  
4-22.弹道型电离真空计 orbitron gauge : #l>r9Z71  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: `Zp*?  
\Uh/(q7  
5.分压真空计(分压分析器) s j-oaWt  
5-1.射频质谱仪radio frequency mass spectrometer: L7- JK3/E  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: YeJTB}  
5-3.单极质谱仪momopole mass spectrometer: y<gRl/e  
5-4.双聚焦质谱仪double focusing mass spectrometer: 1grcCL q  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: a%y*e+oM  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: D7R;IA-w  
5-7.回旋质谱仪omegatron mass spectrometer: Bph(\= W  
5-8.飞行时间质谱仪time of flight mass spectrometer: ?`vGpi~  
j}lne^ h  
6.真空计校准 tZ) ,Z<  
6-1.标准真空计reference gauges: J%Y-3{TQK  
6-2.校准系统system of calibration: hJFxT8B/  
6-3.校准系数K calibration coefficient: TH>uL;?=  
6-4.压缩计法meleod gauge method: &%3}'&EBv  
6-5.膨胀法expansion method: J}Z\I Y,  
6-6.流导法flow method: Z>`frL  
4.   1.真空系统vacuum system |@rf#,hTDp  
1-1.真空机组pump system: 3#fg 2  
1-2.有油真空机组pump system used oil : l [ m_<1L  
1-3.无油真空机组oil free pump system E0i!|H  
1-4.连续处理真空设备continuous treatment vacuum plant: Qt"jU+Zoy  
1-5.闸门式真空系统vacuum system with an air-lock: ~A/vP-  
1-6.压差真空系统differentially pumped vacuum system: /5 KY6XxR  
1-7.进气系统gas admittance system: n%2c<@p#  
H(?+-72KX  
2.真空系统特性参量 ty;a!yjC  
2-1.抽气装置的抽速volume flow rate of a pumping unit : `j2|aX %Z*  
2-2.抽气装置的抽气量throughput of a pumping unit : CC6]AM(i  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: iMYJVB=  
2-4.真空系统的漏气速率leak throughput of a vacuum system: ) fuAdG  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: z\k 6."e_&  
2-6.极限压力ultimate pressure: 3DjX0Dx/l  
2-7.残余压力residual pressure: &mJm'Ks  
2-8.残余气体谱residual gas spectrum:  (=%0x"'  
2-9.基础压力base pressure: &4t=Y`]SL  
2-10.工作压力working pressure: )WkN 34Q  
2-11.粗抽时间roughing time: !y1qd  
2-12.抽气时间pump-down time: TD;u"  
2-13.真空系统时间常数time constant of a vacuum system: aE]RVyG@L  
2-14.真空系统进气时间venting time: [*vR&4mk  
8N<2RT8W  
3.真空容器 9D5v0Qi  
3-1.真空容器;真空室vacuum chamber: H8Ra!FW@  
3-2.封离真空装置sealed vacuum device: 06af{FXsGb  
3-3.真空钟罩vacuum bell jar: _y[B/C,q  
3-4.真空容器底板vacuum base plate: >U:.5Tch'V  
3-5.真空岐管vacuum manifold: ]o9^?iU]  
3-6.前级真空容器(贮气罐)backing reservoir: WD8F]+2O\  
3-7.真空保护层outer chamber: -<\hcV`&  
3-8.真空闸室vacuum air lock: (^|vN ;  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: KjV1->r#  
gE&83i"  
4.真空封接和真空引入线 ,PWMl [X  
4-1.永久性真空封接permanent seal : 7?Twhs.O  
4.2.玻璃分级过渡封接graded seal : UN6nh T  
4-3.压缩玻璃金属封接compression glass-to-metal seal: {bNKyT  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: *]S&V'Di  
4-5.陶瓷金属封接ceramic-to-metal seal: 2G/CN"  
4-6.半永久性真空封接semi-permanent seal : .A6Jj4`-  
4-7.可拆卸的真空封接demountable joint: Wh?3vZ^  
4-8.液体真空封接liquid seal Gd2t^tc  
4-9.熔融金属真空封接molten metal seal: D<4cpH  
4-10.研磨面搭接封接ground and lapped seal: F PAj}as  
4-11.真空法兰连接vacuum flange connection: DoEN`K\U  
4-12.真空密封垫vacuum-tight gasket: > {h/4T@  
4-13.真空密封圈ring gasket: l\bgp3.+  
4-14.真空平密封垫flat gasket: Eye.#~  
4-15.真空引入线feedthrough leadthrough: dEoW8 M#  
4-16.真空轴密封shaft seal: >s%m\"|oh  
4-17.真空窗vacuum window: >` |sBx  
4-18.观察窗viewing window: O=}jg0k  
|/RZGC4  
5.真空阀门 csv;u'  
5-1.真空阀门的特性characteristic of vacuum valves: /n1H; ~f]  
⑴.真空阀门的流导conductance of vacuum valves: ,h9N,bIQg  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: U'xmn$ O  
5-2.真空调节阀regulating valve: \avgXndI  
5-3.微调阀 micro-adjustable valve: O&PrO+&  
5-4.充气阀charge valve: &(X-b"2  
5-5.进气阀gas admittance valve: s+ ]6X*)  
5-6.真空截止阀break valve: lDtl6r/  
5-7.前级真空阀backing valve: &Ht5!zuW,  
5-8.旁通阀 by-pass valve: ET=-r  
5-9.主真空阀main vacuum valve: ^s3SzB@  
5-10.低真空阀low vacuum valve: fJOA5(  
5-11.高真空阀high vacuum valve: }FAO.  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: Z'\{hL S  
5-13.手动阀manually operated valve: .5YW >PV  
5-14.气动阀pneumatically operated valve: ujoJ6UOG  
5-15.电磁阀electromagnetically operated valve: j !rQa^   
5-16.电动阀valve with electrically motorized operation: K2oyHw<mk  
5-17.挡板阀baffle valve: !L55S 0 3  
5-18.翻板阀flap valve: \Q MRuR.  
5-19.插板阀gate valve: V%'+ ob6  
5-20.蝶阀butterfly valve: :J;*]o:  
,wH]|`w  
6.真空管路 Xp_G9I,+  
6-1.粗抽管路roughing line: MN. $a9m  
6-2.前级真空管路backing line: t8z=R6zX  
6-3.旁通管路;By-Pass管路 by-pass line: L=-v>YL+  
6-4.抽气封口接头pumping stem: $n9Bp'<  
6-5.真空限流件limiting conductance:       `RL n)a  
6-6.过滤器filter: ~g|z7o  
5.   1.一般术语 !I[|\ 4j  
1-1真空镀膜vacuum coating: ~V!gHJ5M  
1-2基片substrate: }>~]q)]  
1-3试验基片testing substrate: nG !6[^D  
1-4镀膜材料coating material: l]__!X  
1-5蒸发材料evaporation material: rh 7%<xb>  
1-6溅射材料sputtering material: x`gsD3C  
1-7膜层材料(膜层材质)film material: D eM/B5qw  
1-8蒸发速率evaporation rate: w4\g]\  
1-9溅射速率sputtering rate: j21nh> d  
1-10沉积速率deposition rate: z!:%Hbh=  
1-11镀膜角度coating angle: J^<}fRw  
nkTu/)or  
2.工艺 ! p|d[  
2-1真空蒸膜vacuum evaporation coating: ;*409 P  
(1).同时蒸发simultaneous evaporation: 72{Ce7J4  
(2).蒸发场蒸发evaporation field evaporation: gOKF%Ej31T  
(3).反应性真空蒸发reactive vacuum evaporation: )l"py9STF  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: X) xeq  
(5).直接加热的蒸发direct heating evaporation: NE2P "mY  
(6).感应加热蒸发induced heating evaporation: d{G*1l(X  
(7).电子束蒸发electron beam evaporation: I<^&~==  
(8).激光束蒸发laser beam evaporation: <vUhJgN2/  
(9).间接加热的蒸发indirect heating evaporation: "jMSF@lr  
(10).闪蒸flash evaportion: gj-MkeI)  
2-2真空溅射vacuum sputtering: S{F'k;x/5  
(1).反应性真空溅射 reactive vacuum sputtering: [BzwQ 4  
(2).偏压溅射bias sputtering: UbSAyf  
(3).直流二级溅射direct current diode sputtering: UKBaGX:v  
(4).非对称性交流溅射asymmtric alternate current sputtering: [,As;a*o  
(5).高频二极溅射high frequency diode sputtering: QFX )Nov];  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ^ woCwW8n  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: l#k&&rI5x.  
(8).离子束溅射ion beam sputtering: ?0k4l8R  
(9).辉光放电清洗glow discharge cleaning: IIIP<nyc  
2-3物理气相沉积PVD physical vapor deposition: )$7-CNWr~  
2-4化学气相沉积CVD chemical vapor deposition: af<wUxM0  
2-5磁控溅射magnetron sputtering: On4tK\l @  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: >,)tRQS  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: urA kV#d#  
2-8电弧离子镀arc discharge deposition: |w w@V<'/#  
@<,YUp,%S  
3.专用部件 +_ZXzzcO<  
3-1镀膜室coating chamber: ud,=O X q  
3-2蒸发器装置evaporator device: , UiA?7k  
3-3蒸发器evaporator: 0s'H(qE,_  
3-4直接加热式蒸发器evaporator by direct heat: @Rp#*{  
3-5间接加热式蒸发器evaporator by indirect heat: MiB}10  
3-7溅射装置sputtering device: Tq*K =^  
3-8靶target: c6_i~0W56  
3-10时控挡板timing shutter: 2{fPQQ;#  
3-11掩膜mask: ~s4o1^6L  
3-12基片支架substrate holder: yTwtGo&  
3-13夹紧装置clamp: {Jn*{5tZ>  
3-14换向装置reversing device: HHcWyu  
3-15基片加热装置substrate heating device: ~|5B   
3-16基片冷却装置substrate colding device: !au%D?w  
7r,h[9~e  
4.真空镀膜设备 Qq*Ks 5   
4-1真空镀膜设备vacuum coating plant: .T|1l$Jn  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 1]% ]"JbV  
(2).真空溅射镀膜设备vacuum sputtering coating plant: Dj(!i1eQNZ  
4-2连续镀膜设备continuous coating plant: $++SF)G1]_  
4-3半连续镀膜设备semi- continuous coating plant ipdGAG  
6.   1.漏孔 eUeOyC  
1-1漏孔leaks: 0JS#{EDh+  
1-2通道漏孔channel leak: Q@w=Jt<  
1-3薄膜漏孔membrane leak: _,{R3k  
1-4分子漏孔molecular leak: h<I C d'!  
1-5粘滞漏孔vixcous leak: jNu`umS  
1-6校准漏孔calibrated leak: Q8>  
1-7标准漏孔reference leak : y$6~&X  
1-8虚漏virtual leak: KKJ)BG?qZ  
1-9漏率leak rate: L j>HZS$F  
1-10标准空气漏率standard air leak rate: |E5\_Z  
1-11等值标准空气漏率equivalent standard air leak rate: ,wPvv(b]a  
1-12探索(示漏)气体: *j"u~ N F  
uEX+j  
2.本底 g r[M-U  
2-1本底background: vE<z0l  
2-2探索气体本底search gas background : )o%sN'U,1  
2-3漂移drift: kK&M>)&o#  
2-4噪声noise: Y `ySNC  
!5zDnv  
3.检漏仪 F\IJim-Rh  
3-1检漏仪leak detector: (`me}8  
3-2高频火花检漏仪H.F. spark leak detector: {$fd?| 9h  
3-3卤素检漏仪halide leak detector: U1;<NUg  
3-4氦质谱检漏仪helium mass spectrometer leak detector: Bt[Wh@  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: rf=ndjrH  
OuuN~yC  
4.检漏 z8-dntkf  
4-1气泡检漏leak detection by bubbles: odaCKhdk  
4-2氨检漏leak detection by ammonia: [B+]F~}@  
4-3升压检漏leak detection of rise pressure: Is1(]^EE*  
4-4放射性同位素检漏radioactive isotope leak detection: FBGe s[,  
4-5荧光检漏fluorescence leak detection )Lb?ZXT3  
7.   1.一般术语 fv+t%,++:  
1-1真空干燥vacuum drying: >pRC$'Usx  
1-2冷冻干燥freeze drying : vtu!* 7m  
1-3物料material: WkUV)/j  
1-4待干燥物料material to be dried: 8o%g2 P9.  
1-5干燥物料dried material : 7*I:cga  
1-6湿气moisture;humidity: 'Tbdo >y  
1-7自由湿气free moisture: %=[xc?  
1-8结合湿气bound moisture: -J' 0qN!  
1-9分湿气partial moisture: CEHtr90P  
1-10含湿量moisture content: QpI\\Zt6  
1-11初始含湿量initial moisture content: %`)lCK)2  
1-12最终含湿量final residual moisture: `%ulorS  
1-13湿度degree of moisture ,degree of humidity : 7I4<Dj  
1-14干燥物质dry matter : KMll8X  
1-15干燥物质含量content of dry matter: %|AXVv7IN>  
M,we9];N  
2.干燥工艺  up==g  
2-1干燥阶段stages of drying : [ @ASAhV^+  
(1).预干燥preliminary dry: V7(-<})8  
(2).一次干燥(广义)primary drying(in general): LTlbrB  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): ;6AanwR6  
(4).二次干燥secondary drying: A!uO7".E  
2-2.(1).接触干燥contact drying: )&vuT q'7'  
(2).辐射干燥 drying by radiation : wT>~7$=L{  
(3).微波干燥microwave drying: Mfinh@K,  
(4).气相干燥vapor phase drying: ;m#_Rj6  
(5).静态干燥static drying: PP&9ORG  
(6).动态干燥dynamic drying: /hp [ +K  
2-3干燥时间drying time: cJLAP%.L  
2-4停留时间length of stay(in the drying chamber): )j\9IdkU;y  
2-5循环时间cycle time: [!ilcHE)  
2-6干燥率 dessication ratio : G(;R+%pu  
2-7去湿速率mass flow rate of humidity: VKMgcfbHr/  
2-8单位面积去湿速率mass flow rate of humidity per surface area: ?A]/ M~3B  
2-9干燥速度 drying speed : 9!?Ywc>0#  
2-10干燥过程drying process: K3xt,g  
2-11加热温度heating temperature: Jt(RF*i  
2-12干燥温度temperature of the material being dried : <i~=-Z(  
2-13干燥损失loss of material during the drying process : d.xT8l}sS  
2-14飞尘lift off (particles): 7Q0vwKC8>  
2-15堆层厚度thickness of the material: T%]@R4z#q  
1A}#j  
3.冷冻干燥 Bg.  
3-1冷冻freezing: 8DGPA  
(1).静态冷冻static freezing: ":!1gC  
(2).动态冷冻dynamic freezing: p)Fi{%bc  
(3).离心冷冻centrifugal freezing: WX4 f3Um  
(4).滚动冷冻shell freezing: jp880}  
(5).旋转冷冻spin-freezing: 3g87ir  
(6).真空旋转冷冻vacuum spin-freezing: /*e6('9s  
(7).喷雾冷冻spray freezing: PS$g *x  
(8).气流冷冻air blast freezing: g&r3 ;  
3-2冷冻速率rate of freezing: i6P'_  
3-3冷冻物料frozen material: '37 <+N  
3-4冰核ice core: 9_x rw:4  
3-5干燥物料外壳envelope of dried matter: e(H{C  
3-6升华表面sublimation front: p}p}!M|  
3-7融化位置freezer burn: js;k,`  
4w#:?Y _\[  
4.真空干燥设备;真空冷冻干燥设备 )(+q~KA}  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: Ij2T h]  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 8lFYk`|g  
4-3加热表面heating surface: I<qG{PA  
4-4物品装载面shelf : cJ#n<Rsz  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): Q9k;PJ`@  
4-6单位面积干燥器处理能力throughput per shelf area: 2(k m]H^  
4-7冰冷凝器ice condenser: z:oi @q  
4-8冰冷凝器的负载load of the ice condenser: m:Fdgu9  
4-9冰冷凝器的额定负载rated load of the ice condenser PIHKSAnq  
8.   1.一般术语 eCjyx|:J  
1-1试样sample : 4m!w<c0NL  
(1).表面层surface layer:  6apK  
(2).真实表面true surface: cq~~a(IS  
(3).有效表面积effective surface area: a y$CUw  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: V3<#_:;  
(5).表面粒子密度surface particle density: C9 j{:&  
(6).单分子层monolayer: g>QN9v})  
(7).表面单分子层粒子密度monolayer density: \Nj#1G  
(8).覆盖系数coverage ratio: qOflvf  
1-2激发excitation: K0|:+s@u  
(1).一次粒子primary particle: @$1jp4c   
(2).一次粒子通量primary particle flux: '.]<lh!  
(3).一次粒子通量密度density of primary particle flux: K=> j+a5$  
(4).一次粒子负荷primary particle load: "dHo6CT,y_  
(5).一次粒子积分负荷integral load of primary particle: 45H9pY w  
(6).一次粒子的入射能量energy of the incident primary particle: ]fSpG\yU  
(7).激发体积excited volume: tA^CuJR  
(8).激发面积excited area: T0N6k acl  
(9).激发深度excited death: )JhB!P(  
(10).二次粒子secondary particles: xy]oj  
(11).二次粒子通量secondary particle flux: _k#!^AJ}x  
(12).二次粒子发射能energy of the emitted secondary particles: Z|xgZG{  
(13).发射体积emitting volume: Z+_xX  
(14).发射面积emitting area: ?8FJMFv;4%  
(15).发射深度emitting depth: vs@u*4.Ut<  
(16).信息深度information depth: vCUbbQz  
(17).平均信息深度mean information depth: y?Pw6;e.  
1-3入射角angle of incidence: XB]>Z)  
1-4发射角angle of emission: a,h]DkD  
1-5观测角observation: y"k %Wa`*  
1-6分析表面积analyzed surface area:  |CAMdU  
1-7产额 yield : /vpwpVHIpG  
1-8表面层微小损伤分析minimum damage surface analysis: =s9*=5r8  
1-9表面层无损伤分析non-destructive surface analysis: xT-`dS0u  
1-10断面深度分析 profile analysis in depth; depth profile analysis : (9b%'@A@m  
1-11可观测面积observable area: thz[h5C?C  
1-12可观测立体角observable solid angle : [x'D+!  
1-13接受立体角;观测立体角angle of acceptance: vy-q<6T}:p  
1-14角分辨能力angular resolving power: rDGrq9  
1-15发光度luminosity: #'n.az=1  
1-16二次粒子探测比detection ratio of secondary particles: v8zOY#?  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: #e1iYFgS  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: 4I#@xm8)  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: |Xt6`~iC  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: j /@<=  
1-21本底压力base pressure: 7rG+)kHG  
1-22工作压力working pressure: ;U#=H9_  
]|u7P{Z"R  
2.分析方法 ~V0 GRPnI  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: 'K\H$<CJ  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : S VypR LVB  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: o#>Mf464I  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: K"ly\$F  
2-3离子散射表面分析ion scattering spectroscopy: ~[=d{M!$W  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: L`(\ud  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: O:ACp<@  
2-6离子散射谱仪ion scattering spectrometer: O$N;a9g  
2-7俄歇效应Auger process: Gl"hn  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: KGc!#C  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: z]D/Qr  
2-10光电子谱术photoelectron spectroscopy : yYrFk^  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: lbPn<  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 5F!i%{XQvm  
2-11光电子谱仪photoelectron spectrometer: )l.AsfW%  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: pfw`<*e'  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: Yj'"Wg  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): 0O>M/ *W  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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