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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 oM&}akPE  
--------------------------------------------------- +ti_?gfx  
真空术语 |bwz  
^*{:;F@  
1.标准环境条件 standard ambient condition: ID-Y*  
2.气体的标准状态 standard reference conditions forgases: `FjU2 O  
3.压力(压强)p pressure: ]Cfjs33H  
4.帕斯卡Pa pascal: m M> L0  
5.托Torr torr: T=EHue$  
6.标准大气压atm standard atmosphere: %[<@$qP  
7.毫巴mbar millibar: 5cv&`h8uo_  
8.分压力 partial pressure: s+@+<QE  
9.全压力 total pressure: ScgaWJ  
10.真空 vacuum: HinPO  
11.真空度 degree of vacuum: 'S_OOzpC  
12.真空区域 ranges of vacuum: +:a#+]g  
13.气体 gas: \; 9log<Z  
14.非可凝气体 non-condensable gas: ~]MACG:'  
15.蒸汽vapor: H%LoI)w  
16.饱和蒸汽压saturation vapor pressure: C#^V<:9  
17.饱和度degree of saturation: vn]e`O>y  
18.饱和蒸汽saturated vapor: e ej:  
19.未饱和蒸汽unsaturated vapor: 78=a^gRB  
20.分子数密度n,m-3 number density of molecules: 4jOq.j  
21.平均自由程ι、λ,m mean free path:  b6`_;Z  
22.碰撞率ψ collision rate: gQ < >S  
23.体积碰撞率χ volume collision rate: |6cz r  
24.气体量G quantity of gas: ;qA(!`h+  
25.气体的扩散 diffusion of gas: -x~4@~  
26.扩散系数D diffusion coefficient; diffusivity: eucacXiZ  
27.粘滞流 viscous flow: eHQS\n  
28.粘滞系数η viscous factor: k10g %K4g  
29.泊肖叶流 poiseuille flow: 88@" +2  
30.中间流 intermediate flow: 6.!aJJLN  
31.分子流 molecular flow: )p$a1\ ~m  
32克努曾数 number of knudsen: BHNcE*U}@?  
33.分子泻流 molecular effusion; effusive flow:  {"RUiL^  
34.流逸 transpiration: n=z=%T6  
35.热流逸 thermal transpiration: pR3@loFQ`o  
36.分子流率qN molecular flow rate; molecular flux: %kHeU=  
37.分子流率密度 molecular flow rate density; density of molecular flux: \aEarIX#*  
38.质量流率qm mass flow rare: $ $=N'Q  
39.流量qG throughput of gas: 'ie+/O@G  
40.体积流率qV volume flow rate: _d[4EY  
41.摩尔流率qυ molar flow rate: A~@u#]]<n  
42.麦克斯韦速度分布 maxwellian velocity distribution: U#qs^f7R  
43.传输几率Pc transmission probability: '%W`:K'  
44.分子流导CN,UN molecular conductance: W Ai91K@  
45.流导C,U conductance: !OCb^y  
46.固有流导Ci,Ui intrinsic conductance: 8\N`2mPt  
47.流阻W resistance: 1edeV48{:  
48.吸附 sorption: U.$7=Zl8t  
49.表面吸附 adsorption: 6UK}?+r~  
50.物理吸附physisorption: P^)J^{r  
51.化学吸附 chemisorption: PnUYL.v  
52.吸收absorption: Rk8oshS+2  
53.适应系数α accommodation factor: _^k9!V jo  
54.入射率υ impingement rate: l_ES $%d  
55.凝结率condensation rate: `W*b?e| H1  
56.粘着率 sticking rate: !.EDQ1k  
57.粘着几率Ps sticking probability: R7 WGc[  
58.滞留时间τ residence time: [X\<C '<  
59.迁移 migration: [ r<0[  
60.解吸 desorption: J"$Y`;  
61.去气 degassing: k"L?("~   
62.放气 outgassing: &gr)U3w  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: xoYaL  
64.蒸发率 evaporation rate: Ec/-f `8  
65.渗透 permeation: !&f>,?wlP  
66.渗透率φ permeability: L'@@ewA  
67.渗透系数P permeability coefficient &^I2NpT  
2.   1.真空泵 vacuum pumps dfa^5`_  
1-1.容积真空泵 positive displacement pump: zz7#g U  
⑴.气镇真空泵 gas ballast vacuum pump: 7rZE7+%]  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: TwT@_~ IM  
⑶.干封真空泵 dry-sealed vacuum pump: ar%!h~  
⑷.往复真空泵 piston vacuum pump: }vXf}2C  
⑸.液环真空泵 liquid ring vacuum pump: 8%,u~ELA  
⑹.旋片真空泵 sliding vane rotary vacuum pump: ?O|CY  
⑺.定片真空泵 rotary piston vacuum pump: EQvZ(-_;4  
⑻.滑阀真空泵 rotary plunger vacuum pump: t*Xo@KA  
⑼.余摆线真空泵 trochoidal vacuum pump: m35$4  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: fJdTVs@  
⑾.罗茨真空泵 roots vacuum pump: "Xz[|Xl  
1-2.动量传输泵 kinetic vacuum pump: 5i eF8F%  
⑴.牵引分子泵molecular drag pump: -Z<V? SFOK  
⑵.涡轮分子泵turbo molecular pump: 3m]8>1e1"  
⑶.喷射真空泵ejector vacuum pump: C}D\^(nLu.  
⑷.液体喷射真空泵liquid jet vacuum pump: AnD#k ]  
⑸.气体喷射真空泵gas jet vacuum pump: )bkJ[ '9  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : +ak<yV1=  
⑺.扩散泵diffusion pump : Es^=&2 ''  
⑻.自净化扩散泵self purifying diffusion pump: 7A6:*  
⑼.分馏扩散泵 fractionating diffusion pump : O~bJ<O=?  
⑽.扩散喷射泵diffusion ejector pump : +W}dO#  
⑾.离子传输泵ion transfer pump: SU$%nK)  
1-3.捕集真空泵 entrapment vacuum pump: 0%b !ARix  
⑴吸附泵adsorption pump: d+iV19#i  
⑵.吸气剂泵 getter pump: }%lk$g';  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : F=9-po  
⑷.吸气剂离子泵getter ion pump: /f Ui2[y  
⑸.蒸发离子泵 evaporation ion pump: >713H!uj  
⑹.溅射离子泵sputter ion pump: )N}.n2Y8W  
⑺.低温泵cryopump: )"sJaHx<  
8n~ o="  
2.真空泵零部件 p8bAz  
2-1.泵壳 pump case: BHrNDpv  
2-2.入口 inlet: }48 o{\  
2-3.出口outlet: 1!"iN~  
2-4.旋片(滑片、滑阀)vane; blade : tg#d.(  
2-5.排气阀discharge valve: xC^|S0B  
2-6.气镇阀gas ballast valve: :3 p&h[M  
2-7.膨胀室expansion chamber: M WHzrqCA  
2-8.压缩室compression chamber: _uQxrB"9  
2-9.真空泵油 vacuum pump oil: \1[v-hvK  
2-10.泵液 pump fluid: 9X ^D(  
2-11.喷嘴 nozzle: *{1]b_<  
2-13.喷嘴扩张率nozzle expansion rate: j@778fvM\t  
2-14.喷嘴间隙面积 nozzle clearance area : *T:gx:Sg/  
2-15.喷嘴间隙nozzle clearance: Hr}pO"%  
2-16.射流jet: v_L?n7c  
2-17.扩散器diffuser: JXKo zy41  
2-18.扩散器喉部diffuser thoat: ~H\1dCW  
2-19.蒸汽导管vapor tube(pipe;chimney): f J$>VN  
2-20.喷嘴组件nozzle assembly: ,Z aPY  
2-21.下裙skirt: 9{Xh wi)z  
<52)  
3.附件 LPK[^  
3-1阱trap: NU |vtD  
⑴.冷阱 cold trap: r;'Vy0?AL  
⑵.吸附阱sorption trap: VU ,tCTXz  
⑶.离子阱ion trap:  FtmI\,  
⑷.冷冻升华阱 cryosublimation trap: s3+6Z~g'B  
3-2.挡板baffle: 68YJ@(iS  
3-3.油分离器oil separator: FTT=h0t  
3-4.油净化器oil purifier: kXY p.IVA  
3-5.冷凝器condenser: l~j{i/>  
;{S7bH'6m  
4.泵按工作分类 OaCp3No  
4-1.主泵main pump: 3lo.YLP^  
4-2.粗抽泵roughing vacuum pump: Zrm!,qs  
4-3.前级真空泵backing vacuum pump: _^Yav.A=  
4-4.粗(低)真空泵 roughing(low)vacuum pump: @$] CC1Y  
4-5.维持真空泵holding vacuum pump: ly)L%hG  
4-6.高真空泵high vacuum pump: b]XDfe  
4-7.超高真空泵ultra-high vacuum pump: Qu6Q)dZ<  
4-8.增压真空泵booster vacuum pump: S1G=hgF_L  
~ s# !\Ye  
5.真空泵特性 C$#X6Q!,  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 0\a;} S'g#  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 3E`poE  
5-3.起动压力starting pressure: y jQpdO  
5-4.前级压力 backing pressure : w/Ej>OS  
5-5.临界前级压力 critical backing pressure: +~cW0z  
5-6.最大前级压力maximum backing pressure: QJKVNOo  
5-7.最大工作压力maximum working pressure: t]PO4GA  
5-8.真空泵的极限压力ultimate pressure of a pump: ^Z~'>J  
5-9.压缩比compression ratio: T*i rCe  
5-10.何氏系数Ho coefficient: ]id5jVY  
5-11.抽速系数speed factor: }Pf7YuUZZ  
5-12.气体的反扩散back-diffusion of gas: hY^-kdQ>M  
5-13.泵液返流back-streaming of pump fluid: .>bvI1  
5-14.返流率back-streaming rate DX)T}V&mP  
5-15.返迁移back-migration: WTZr{)e  
5-16.爆腾bumping: +'fdAc:5',  
5-17.水蒸气允许量qm water vapor tolerable load: 'l`T(_zL\%  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: L.1pO2zPe  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: f[$9k}.  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump j_Z"=  
3.   1.一般术语 I~: AWS9  
1-1.压力计pressure gauge: Ow7}&\;^-  
1-2.真空计vacuum gauge: +(9qAB7  
⑴.规头(规管)gauge head: q9mYhT/Im  
⑵.裸规nude gauge : km+}./@  
⑶.真空计控制单元gauge control unit : \/ 8 V|E  
⑷.真空计指示单元gauge indicating unit : <+2M,fq+  
n^m6m%J)  
2.真空计一般分类 is,r:  
2-1.压差式真空计differential vacuum gauge: v\gCgx=%j  
2-2.绝对真空计 absolute vacuum gauge: Tl ?]K  
2-3.全压真空计total pressure vacuum gauge: SpG^kI #  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: ;q6FdS  
2-5.相对真空计relative vacuum gauge : I%q&4L7pj  
cr_Q,*  
3.真空计特性 -A A='s  
3-1.真空计测量范围pressure range of vacuum gauge: MX.=k>  
3-2.灵敏度系数sensitivity coefficient: USrg,A  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Gj}P6V _  
3-5.规管光电流photon current of vacuum gauge head: Tfba3+V  
3-6.等效氮压力equivalent nitrogen pressure : hiN6]jL|O  
3-7.X射线极限值 X-ray limit: {Noa4i  
3-8.逆X射线效应anti X-ray effect: !SFF 79$c  
3-9.布利尔斯效应blears effect: X(;,-7Jw  
!pNY`sw}  
4.全压真空计 @I '_  
4-1.液位压力计liquid level manometer: XdDy0e4{%<  
4-2.弹性元件真空计elastic element vacuum gauge: T"2D<7frbo  
4-3.压缩式真空计compression gauge: >/DyR+?>4  
4-4.压力天平pressure balance: -$]Tn#`Fb  
4-5.粘滞性真空计viscosity gauge : MOIH%lpe  
4-6.热传导真空计thermal conductivity vacuum gauge : . d;XLS~  
4-7.热分子真空计thermo-molecular gauge: IaU  
4-8.电离真空计ionization vacuum gauge: mt+IB4`  
4-9.放射性电离真空计radioactive ionization gauge: N:y3tpG  
4-10.冷阴极电离真空计cold cathode ionization gauge: #.(6.Li  
4-11.潘宁真空计penning gauge: xM/B"SG2  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: L##lXUl  
4-13.放电管指示器discharge tube indicator: +##b}?S%  
4-14.热阴极电离真空计hot cathode ionization gauge: n~#%>C7  
4-15.三极管式真空计triode gauge: l(T CF  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: C NNyz$  
4-17.B-A型电离真空计Bayard-Alpert gauge: pOCLyM9c  
4-18.调制型电离真空计modulator gauge: /l,V0+p  
4-19.抑制型电离真空计suppressor gauge: y6lle<SIu  
4-20.分离型电离真空计extractor gauge: SY` U]-h  
4-21.弯注型电离真空计bent beam gauge: 62&(+'$n  
4-22.弹道型电离真空计 orbitron gauge : DFz,>DM;  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: =-`}(b2N  
\S)\~>.`y!  
5.分压真空计(分压分析器) u(7PtmV[!  
5-1.射频质谱仪radio frequency mass spectrometer: _M/ckv1q@  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: +oZq~2?*S6  
5-3.单极质谱仪momopole mass spectrometer: 4*4s{twG  
5-4.双聚焦质谱仪double focusing mass spectrometer: m"~^-mJ-  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: z\,g %u41  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: (>x4X@b  
5-7.回旋质谱仪omegatron mass spectrometer: lEBt<  
5-8.飞行时间质谱仪time of flight mass spectrometer: @N,EoSb :  
jB*%nB*x  
6.真空计校准 S=>54!{`x  
6-1.标准真空计reference gauges: ;[]{O5TB  
6-2.校准系统system of calibration: [<Wo7G1s  
6-3.校准系数K calibration coefficient: 4+od N.  
6-4.压缩计法meleod gauge method: vs/.'yD/C  
6-5.膨胀法expansion method: (KDUX t.  
6-6.流导法flow method: 'b#`8k~>  
4.   1.真空系统vacuum system X ?/C9  
1-1.真空机组pump system: G}d-L!YbE'  
1-2.有油真空机组pump system used oil : zo-hH8J:  
1-3.无油真空机组oil free pump system bu[v[U4  
1-4.连续处理真空设备continuous treatment vacuum plant: U5]{`C0H?  
1-5.闸门式真空系统vacuum system with an air-lock: i2SR.{&  
1-6.压差真空系统differentially pumped vacuum system: ~a:0Q{>a  
1-7.进气系统gas admittance system: ')w:`8Tl  
_uuxTNN0x*  
2.真空系统特性参量 Fu0 dYN  
2-1.抽气装置的抽速volume flow rate of a pumping unit : .(OFYK<  
2-2.抽气装置的抽气量throughput of a pumping unit : wRn]  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: `H6-g=C  
2-4.真空系统的漏气速率leak throughput of a vacuum system: Cpu L[|51  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: n*6Oa/JG7  
2-6.极限压力ultimate pressure: C9[Jr)QX  
2-7.残余压力residual pressure: *p}b_A}D  
2-8.残余气体谱residual gas spectrum: 6 eqxwj{S[  
2-9.基础压力base pressure: Ah,X?0+  
2-10.工作压力working pressure: TT3GFP  
2-11.粗抽时间roughing time: 5o 4\Jwt  
2-12.抽气时间pump-down time: :c@v_J6C&  
2-13.真空系统时间常数time constant of a vacuum system: I@a y&NNh  
2-14.真空系统进气时间venting time: i>YD_#w  
?!=yp#  
3.真空容器 !63p?Q=  
3-1.真空容器;真空室vacuum chamber: =&RpW7]  
3-2.封离真空装置sealed vacuum device: S"ZH5O(  
3-3.真空钟罩vacuum bell jar: YIv!\`^ \  
3-4.真空容器底板vacuum base plate: W 86`R  
3-5.真空岐管vacuum manifold: Q H:k5V~  
3-6.前级真空容器(贮气罐)backing reservoir: XdX1GH*C  
3-7.真空保护层outer chamber: hI.@!$~=  
3-8.真空闸室vacuum air lock: S)T]>Ash  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: 6? I,sZW  
8yEN)RqI  
4.真空封接和真空引入线 jnfktDV'  
4-1.永久性真空封接permanent seal : kH'LG!O  
4.2.玻璃分级过渡封接graded seal : (- `h8M  
4-3.压缩玻璃金属封接compression glass-to-metal seal: p|!5G&O,  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: We&~]-b AW  
4-5.陶瓷金属封接ceramic-to-metal seal: [IT*>;b+?  
4-6.半永久性真空封接semi-permanent seal : \vj<9ke&  
4-7.可拆卸的真空封接demountable joint: -`nQa$N-  
4-8.液体真空封接liquid seal .{[+d3+,  
4-9.熔融金属真空封接molten metal seal: -FRMal4Pg0  
4-10.研磨面搭接封接ground and lapped seal: HBHDu;u  
4-11.真空法兰连接vacuum flange connection: .J0s_[  
4-12.真空密封垫vacuum-tight gasket: )Qe<XJH!  
4-13.真空密封圈ring gasket: q1!45a  
4-14.真空平密封垫flat gasket: 7kX;|NA1  
4-15.真空引入线feedthrough leadthrough: Bx9R!u5D  
4-16.真空轴密封shaft seal: )Il) H  
4-17.真空窗vacuum window: w<=?%+n  
4-18.观察窗viewing window: }+/j/es{]  
0c6b_%Rd  
5.真空阀门 8S*3W3HY  
5-1.真空阀门的特性characteristic of vacuum valves: DFDlp  
⑴.真空阀门的流导conductance of vacuum valves: @r7ekyO8)  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: .S ZZT0Z  
5-2.真空调节阀regulating valve: >&pB&'A a  
5-3.微调阀 micro-adjustable valve: &QHZ]2%U  
5-4.充气阀charge valve: D d['e  
5-5.进气阀gas admittance valve: 1dDK(RBbQ  
5-6.真空截止阀break valve: .[mI9dc  
5-7.前级真空阀backing valve: 8@b,>l$  
5-8.旁通阀 by-pass valve: @JB9qT  
5-9.主真空阀main vacuum valve: O5X@'.#rU  
5-10.低真空阀low vacuum valve: fXNl27c-  
5-11.高真空阀high vacuum valve: BwpEIV@b]  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: w[ )97d  
5-13.手动阀manually operated valve: %?<Y&t  
5-14.气动阀pneumatically operated valve: $K& #R-  
5-15.电磁阀electromagnetically operated valve: s{g^K#BoFi  
5-16.电动阀valve with electrically motorized operation: &+0WZ#VI  
5-17.挡板阀baffle valve: jEK{QOq0  
5-18.翻板阀flap valve: >|j8j:S[  
5-19.插板阀gate valve: t UOqF  
5-20.蝶阀butterfly valve: Sq<ds}o'8l  
M3m)uiz  
6.真空管路 [f._w~  
6-1.粗抽管路roughing line: ^@91BY  
6-2.前级真空管路backing line: 'xK ,|U  
6-3.旁通管路;By-Pass管路 by-pass line: eMT}"u8$A  
6-4.抽气封口接头pumping stem: Gl am(V1  
6-5.真空限流件limiting conductance:       ZMp5d4y5  
6-6.过滤器filter: W20qn>{z  
5.   1.一般术语 XC*!=h*  
1-1真空镀膜vacuum coating: Nqy)jfyex  
1-2基片substrate: qoZUX3{  
1-3试验基片testing substrate: FaA'%P@  
1-4镀膜材料coating material: ][D/=-  
1-5蒸发材料evaporation material: G~. bi<(v  
1-6溅射材料sputtering material: :t)<$dtf[  
1-7膜层材料(膜层材质)film material: -F->l5  
1-8蒸发速率evaporation rate: ta;q{3fe  
1-9溅射速率sputtering rate: $u"*n\k>  
1-10沉积速率deposition rate: :,8eM{.Q  
1-11镀膜角度coating angle: 1uwzo9Yg  
%f-Uwq&}Y"  
2.工艺 ]K<mkUpY  
2-1真空蒸膜vacuum evaporation coating: ?z{Z!Bt?=)  
(1).同时蒸发simultaneous evaporation: zn+5pn&?  
(2).蒸发场蒸发evaporation field evaporation: pw, <0UhV  
(3).反应性真空蒸发reactive vacuum evaporation: [}*xxy   
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: .\rJ|HpZ1J  
(5).直接加热的蒸发direct heating evaporation: BN]{o(EB  
(6).感应加热蒸发induced heating evaporation: >Hd Pcsl L  
(7).电子束蒸发electron beam evaporation: AQ<2 "s  
(8).激光束蒸发laser beam evaporation: QKP@+E_U  
(9).间接加热的蒸发indirect heating evaporation: Jf</83RZ  
(10).闪蒸flash evaportion: Au"7w=G`f  
2-2真空溅射vacuum sputtering: !'5t(Zw5  
(1).反应性真空溅射 reactive vacuum sputtering: ^U;r>[T9h  
(2).偏压溅射bias sputtering: IKs2.sj"o  
(3).直流二级溅射direct current diode sputtering: P`$Y73L  
(4).非对称性交流溅射asymmtric alternate current sputtering: fU^6h`t  
(5).高频二极溅射high frequency diode sputtering: >Y)FoHa+/  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: {Gi:W/jJ  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 8GKqPS+  
(8).离子束溅射ion beam sputtering: +)<H,?/  
(9).辉光放电清洗glow discharge cleaning: JI7.:k;  
2-3物理气相沉积PVD physical vapor deposition: )4O* D92  
2-4化学气相沉积CVD chemical vapor deposition: p=jIDM'  
2-5磁控溅射magnetron sputtering: Jc9BZ`~i  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: XEpwk,8*g  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: \L]T|]}(  
2-8电弧离子镀arc discharge deposition: u.!<)VIJx  
R=m9[TgBm  
3.专用部件 nq,P.~l  
3-1镀膜室coating chamber: 0(h'ZV  
3-2蒸发器装置evaporator device: WoSJp5By$  
3-3蒸发器evaporator: r>kDRIHB  
3-4直接加热式蒸发器evaporator by direct heat: uzO3_.4Y  
3-5间接加热式蒸发器evaporator by indirect heat: ] RLEyDB  
3-7溅射装置sputtering device: LVAnZ'h/|  
3-8靶target: sqjv3=}  
3-10时控挡板timing shutter: ~'u %66  
3-11掩膜mask: <&87aDYz  
3-12基片支架substrate holder: R1j)0b6cQ%  
3-13夹紧装置clamp: ptCAtEO72  
3-14换向装置reversing device: Y)KO*40c  
3-15基片加热装置substrate heating device: > Du>vlT Y  
3-16基片冷却装置substrate colding device: \!Fx,#r$7-  
EwuBL6kN  
4.真空镀膜设备 ATq-&1hs  
4-1真空镀膜设备vacuum coating plant: d_!l RQ^N  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: se^(1R k  
(2).真空溅射镀膜设备vacuum sputtering coating plant: #h~v(Z}  
4-2连续镀膜设备continuous coating plant: 38HnW  
4-3半连续镀膜设备semi- continuous coating plant = k|hH~  
6.   1.漏孔 M hJ;)(  
1-1漏孔leaks: $/XR/  
1-2通道漏孔channel leak: ?D]qw4J  
1-3薄膜漏孔membrane leak: lBcRt)_O7  
1-4分子漏孔molecular leak: F3,djZq  
1-5粘滞漏孔vixcous leak: TkjPa};R  
1-6校准漏孔calibrated leak: [R9!Tz  
1-7标准漏孔reference leak : ?[~)D}] j  
1-8虚漏virtual leak: Mz:t[rfs  
1-9漏率leak rate: Ymr\8CG/  
1-10标准空气漏率standard air leak rate: ;DN:AgXP  
1-11等值标准空气漏率equivalent standard air leak rate: -mPrmapb3  
1-12探索(示漏)气体: g$eZT{{W  
O:86*  
2.本底 7J$5dFV2  
2-1本底background: /{7we$+,p  
2-2探索气体本底search gas background : y |0I3n]e  
2-3漂移drift: EHC^ [5  
2-4噪声noise: cQ<* (KU  
GP._C=]?c  
3.检漏仪 k w]m7 T  
3-1检漏仪leak detector: *iW$>Yjb  
3-2高频火花检漏仪H.F. spark leak detector: GP,xGZZ  
3-3卤素检漏仪halide leak detector: AG==A&d>$  
3-4氦质谱检漏仪helium mass spectrometer leak detector: eOI#T'5  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Q`4]\)Dp  
A_\ZY0Xt  
4.检漏 xB&6f")  
4-1气泡检漏leak detection by bubbles: -ip fGb  
4-2氨检漏leak detection by ammonia: ;N/=)m  
4-3升压检漏leak detection of rise pressure: ok+-#~VTn  
4-4放射性同位素检漏radioactive isotope leak detection: eODprFkt}  
4-5荧光检漏fluorescence leak detection B%e#u.'6  
7.   1.一般术语 `+go| 5N2  
1-1真空干燥vacuum drying: %hqhi@q#  
1-2冷冻干燥freeze drying : S.kFs{;1x  
1-3物料material: YvP u%=eF  
1-4待干燥物料material to be dried: [va7+=[1=  
1-5干燥物料dried material : 7L=V{,,v  
1-6湿气moisture;humidity: .Iret :  
1-7自由湿气free moisture: UIl^s8/  
1-8结合湿气bound moisture: :/ yR  
1-9分湿气partial moisture: >5|;8v-r  
1-10含湿量moisture content: 0Q_@2  
1-11初始含湿量initial moisture content: 1q[vNP=g&  
1-12最终含湿量final residual moisture: `Wf)qMb  
1-13湿度degree of moisture ,degree of humidity : 0- 'f1 1S  
1-14干燥物质dry matter : !Ci\Zg  
1-15干燥物质含量content of dry matter: ,UD,)ZPf[  
43?J~}<Vs  
2.干燥工艺 yfD)|lK  
2-1干燥阶段stages of drying : N>A*N,+  
(1).预干燥preliminary dry: h""a#n)q}`  
(2).一次干燥(广义)primary drying(in general): 7 i |_PP_  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying):  9g*MBe:  
(4).二次干燥secondary drying: x_3Zd  
2-2.(1).接触干燥contact drying: VK)K#!O8  
(2).辐射干燥 drying by radiation : |5}~n"R5  
(3).微波干燥microwave drying: y&.[Nt '+  
(4).气相干燥vapor phase drying: Va1 eG]jQ  
(5).静态干燥static drying: t7%!~s=,M  
(6).动态干燥dynamic drying: L|3wG Y9E  
2-3干燥时间drying time: 8'2lc  
2-4停留时间length of stay(in the drying chamber): 3ppY@_1  
2-5循环时间cycle time: BlV k?n  
2-6干燥率 dessication ratio : \c! LC4pE  
2-7去湿速率mass flow rate of humidity: ,cvLvN8  
2-8单位面积去湿速率mass flow rate of humidity per surface area: _faI*OY8  
2-9干燥速度 drying speed : SRN:!-  
2-10干燥过程drying process: "$Wi SR  
2-11加热温度heating temperature: jaAv_=93f  
2-12干燥温度temperature of the material being dried : !8|]R  
2-13干燥损失loss of material during the drying process : 2wWL]`(E  
2-14飞尘lift off (particles): <N%8"o  
2-15堆层厚度thickness of the material: GLe(?\Ug=  
S!GjCog^J  
3.冷冻干燥 H>-?/H  
3-1冷冻freezing: H]. 4~ 8  
(1).静态冷冻static freezing: !P, 9Sg&5)  
(2).动态冷冻dynamic freezing: {.N" 6P  
(3).离心冷冻centrifugal freezing: Qhnz7/a9  
(4).滚动冷冻shell freezing: -ANp88a  
(5).旋转冷冻spin-freezing: ]]s_ 8u 3  
(6).真空旋转冷冻vacuum spin-freezing: b&g9A{t  
(7).喷雾冷冻spray freezing: N b(f  
(8).气流冷冻air blast freezing: E5lC'@Dcz  
3-2冷冻速率rate of freezing: [|2uu."$  
3-3冷冻物料frozen material: eB:obz  
3-4冰核ice core: N1UE u,j  
3-5干燥物料外壳envelope of dried matter: : 5@cj j  
3-6升华表面sublimation front: qFV=P k  
3-7融化位置freezer burn: WT!8.M;Kv  
&50Kn[  
4.真空干燥设备;真空冷冻干燥设备 C"/]X  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: /h0<0b?i  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: (~TP  
4-3加热表面heating surface: $2F*p#l(<Z  
4-4物品装载面shelf : [?BmW {*u.  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): `}F=Zjy  
4-6单位面积干燥器处理能力throughput per shelf area: gU/\'~HG  
4-7冰冷凝器ice condenser: E~zLhJTUL'  
4-8冰冷凝器的负载load of the ice condenser: (J): >\a]  
4-9冰冷凝器的额定负载rated load of the ice condenser Zg7~&vs$  
8.   1.一般术语 c3|;'s  
1-1试样sample : `"m"qUd  
(1).表面层surface layer: _f,q8ZkSr  
(2).真实表面true surface: cW),Y|8  
(3).有效表面积effective surface area: M~7?m/Wj  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: 3vOI=ar=L~  
(5).表面粒子密度surface particle density: J=TbZL4y}4  
(6).单分子层monolayer: IgC)YIhd  
(7).表面单分子层粒子密度monolayer density: =[`wyQe`_  
(8).覆盖系数coverage ratio: <P( K,L?r  
1-2激发excitation: bE^Z;q19  
(1).一次粒子primary particle: KbH#g>.oB  
(2).一次粒子通量primary particle flux: gsc*![N  
(3).一次粒子通量密度density of primary particle flux: ZzI^*Nyg  
(4).一次粒子负荷primary particle load: ;4F[*VF!w  
(5).一次粒子积分负荷integral load of primary particle: P-No;/!B#  
(6).一次粒子的入射能量energy of the incident primary particle: `R8~H7{I6  
(7).激发体积excited volume: f9JD_hhP'  
(8).激发面积excited area: vsoj] R$C  
(9).激发深度excited death: 8ne'x!1 D  
(10).二次粒子secondary particles: %M9^QHyo@  
(11).二次粒子通量secondary particle flux: W1y,.6  
(12).二次粒子发射能energy of the emitted secondary particles: 622mNY  
(13).发射体积emitting volume: v{=-#9-4 &  
(14).发射面积emitting area: )TyL3Z\>(  
(15).发射深度emitting depth: nH% /  
(16).信息深度information depth: guSgTUJ}  
(17).平均信息深度mean information depth: u[s+YGS  
1-3入射角angle of incidence: e7/J:n$  
1-4发射角angle of emission: C-_u; NEu  
1-5观测角observation: oLX6w  
1-6分析表面积analyzed surface area: &)fPz-s  
1-7产额 yield : d&?B/E^  
1-8表面层微小损伤分析minimum damage surface analysis: 43:~kCF[s  
1-9表面层无损伤分析non-destructive surface analysis: Li Qs;$V  
1-10断面深度分析 profile analysis in depth; depth profile analysis : ]$nJn+85@b  
1-11可观测面积observable area: z]P|%  
1-12可观测立体角observable solid angle : MkJL9eG  
1-13接受立体角;观测立体角angle of acceptance: wC=IN   
1-14角分辨能力angular resolving power: v1 oSf  
1-15发光度luminosity: sNX$ =<E  
1-16二次粒子探测比detection ratio of secondary particles: #JuO  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ?e]4HHgU]  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: R) @ k|  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: _BtlO(0&  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: LC[, K  
1-21本底压力base pressure: K]kL?-A#'  
1-22工作压力working pressure: %F&j B  
PU?kQZU~)  
2.分析方法 MQ\:/]a  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: r7ywK9UL  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : *i%!j/QDAP  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: .#j)YG  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 1oX"}YY1  
2-3离子散射表面分析ion scattering spectroscopy: s o~p+]  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 92 Pp.Rh  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ,=6Eju#P  
2-6离子散射谱仪ion scattering spectrometer: Fl*@@jQ8cV  
2-7俄歇效应Auger process: [(btpWxb^  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: Jz%&-e3  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: <hy>NM@$  
2-10光电子谱术photoelectron spectroscopy : ~01r c  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: wM!QU{Lz  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: fRrHWE+  
2-11光电子谱仪photoelectron spectrometer: S8"X7\d{  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 5QS d$J  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: k92X)/ll'  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): /~ V"v"7E  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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