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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 4id3P{aU  
--------------------------------------------------- 13ipaz  
真空术语 t-!Rgg$9  
u=vh Z%A]  
1.标准环境条件 standard ambient condition: UG6M9  
2.气体的标准状态 standard reference conditions forgases: ob0~VEH-  
3.压力(压强)p pressure: {hxW,mmA  
4.帕斯卡Pa pascal: jo_o` j  
5.托Torr torr: nc<qbN  
6.标准大气压atm standard atmosphere: pAEN XC\,  
7.毫巴mbar millibar: HKpD 2M  
8.分压力 partial pressure: EtGH\?d~]  
9.全压力 total pressure: ;)gLjF/F7  
10.真空 vacuum: 0[lS(K  
11.真空度 degree of vacuum: AvZXRN1:'  
12.真空区域 ranges of vacuum: e d_m +NM  
13.气体 gas: (%i!%{!]  
14.非可凝气体 non-condensable gas: !2(.$}E  
15.蒸汽vapor: 1x { XE*%;  
16.饱和蒸汽压saturation vapor pressure: # 2d,U\_  
17.饱和度degree of saturation: >Z}@7$(7!~  
18.饱和蒸汽saturated vapor: i9KTX%s5^  
19.未饱和蒸汽unsaturated vapor: 7 xUE,)?  
20.分子数密度n,m-3 number density of molecules: 0k%hY{  
21.平均自由程ι、λ,m mean free path: 6zuze0ud  
22.碰撞率ψ collision rate: 6Hda]y  
23.体积碰撞率χ volume collision rate: MZ)T0|S_  
24.气体量G quantity of gas: bCzdszvg3  
25.气体的扩散 diffusion of gas: ;:U<ce=  
26.扩散系数D diffusion coefficient; diffusivity: mzu<C)9d,  
27.粘滞流 viscous flow: (oF-O{  
28.粘滞系数η viscous factor: qT$ )Rb&  
29.泊肖叶流 poiseuille flow: n_J5zQJ  
30.中间流 intermediate flow: |<1M&\oaQ'  
31.分子流 molecular flow: vffH  
32克努曾数 number of knudsen: ~U9q-/(J/  
33.分子泻流 molecular effusion; effusive flow: W=3? x  
34.流逸 transpiration: T RDxT  
35.热流逸 thermal transpiration: i$["aP~G  
36.分子流率qN molecular flow rate; molecular flux: /w0w* n H  
37.分子流率密度 molecular flow rate density; density of molecular flux: -n-Z/5~ X  
38.质量流率qm mass flow rare: 3 &Sp@,  
39.流量qG throughput of gas: {U^j&E  
40.体积流率qV volume flow rate: 8A!'I<S1  
41.摩尔流率qυ molar flow rate: /~tP7<7A  
42.麦克斯韦速度分布 maxwellian velocity distribution: 12-EDg/1  
43.传输几率Pc transmission probability: K_Re}\D  
44.分子流导CN,UN molecular conductance: <n\i>A3`,S  
45.流导C,U conductance: Mb1wYh  
46.固有流导Ci,Ui intrinsic conductance: k/@Tr :  
47.流阻W resistance: >e/ r2U  
48.吸附 sorption: \f<z*!,D$  
49.表面吸附 adsorption: [1U{ci&=p  
50.物理吸附physisorption: DLXL!-)z  
51.化学吸附 chemisorption: F )7j@h^  
52.吸收absorption: ] );NnsG  
53.适应系数α accommodation factor: F<gMUDB  
54.入射率υ impingement rate: C bQ4Y  
55.凝结率condensation rate: ^N{k6>;  
56.粘着率 sticking rate: ntZ~m  
57.粘着几率Ps sticking probability: d#8e~  
58.滞留时间τ residence time: AOAO8%|I  
59.迁移 migration: ol}`Wwy  
60.解吸 desorption: QXY}STs  
61.去气 degassing: 7f r>ZY^  
62.放气 outgassing: "koo` J  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: h1-Gp3#  
64.蒸发率 evaporation rate: ^cn@?k((A  
65.渗透 permeation: 4DM*^=9E  
66.渗透率φ permeability: Yv=g^tw  
67.渗透系数P permeability coefficient SBL+e]P  
2.   1.真空泵 vacuum pumps A_F0\ EN*  
1-1.容积真空泵 positive displacement pump: .1{l[[= W  
⑴.气镇真空泵 gas ballast vacuum pump: Qsji0ikG  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: _D JCsK|  
⑶.干封真空泵 dry-sealed vacuum pump: &mdB\Y?^  
⑷.往复真空泵 piston vacuum pump: dm& /K 4c  
⑸.液环真空泵 liquid ring vacuum pump: ;W6-i2?  
⑹.旋片真空泵 sliding vane rotary vacuum pump: t)'dF*L  
⑺.定片真空泵 rotary piston vacuum pump: }AJ L,Q7q  
⑻.滑阀真空泵 rotary plunger vacuum pump: ~#4~_d.=L  
⑼.余摆线真空泵 trochoidal vacuum pump: [zx|eG<&-  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: ^Et ,TF\  
⑾.罗茨真空泵 roots vacuum pump: K"^cq~   
1-2.动量传输泵 kinetic vacuum pump: bBG/gQ  
⑴.牵引分子泵molecular drag pump: j/' g$  
⑵.涡轮分子泵turbo molecular pump: P9s_2KOF  
⑶.喷射真空泵ejector vacuum pump: 6Hl < ,(vn  
⑷.液体喷射真空泵liquid jet vacuum pump: \OA L Or  
⑸.气体喷射真空泵gas jet vacuum pump: 3C#RjA-2[  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : bs P6\'\4  
⑺.扩散泵diffusion pump : 0O[l?e4,8{  
⑻.自净化扩散泵self purifying diffusion pump: cd+^=esSO  
⑼.分馏扩散泵 fractionating diffusion pump : + ~~ Z0.[  
⑽.扩散喷射泵diffusion ejector pump : }_]As}E  
⑾.离子传输泵ion transfer pump: (V)9s\Le_  
1-3.捕集真空泵 entrapment vacuum pump: D$$3fN.iEL  
⑴吸附泵adsorption pump: G:DSWW}  
⑵.吸气剂泵 getter pump: ng 9NE8F  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : 7JS#a=D#  
⑷.吸气剂离子泵getter ion pump: K.%z;( U  
⑸.蒸发离子泵 evaporation ion pump: ?uig04@3  
⑹.溅射离子泵sputter ion pump: *#6|!%?g  
⑺.低温泵cryopump: jceHK l  
ey*,StT5a  
2.真空泵零部件 [NjajA~z>F  
2-1.泵壳 pump case: xY+A]Up|w  
2-2.入口 inlet: aoK4Du{  
2-3.出口outlet: w0aHEvH/  
2-4.旋片(滑片、滑阀)vane; blade : v=>3"!*  
2-5.排气阀discharge valve: 4L!e=>as"1  
2-6.气镇阀gas ballast valve: h~:H?pj3g  
2-7.膨胀室expansion chamber: D"'#one  
2-8.压缩室compression chamber: ;2BPPZ  
2-9.真空泵油 vacuum pump oil: 4 #G3ew  
2-10.泵液 pump fluid: ^&HI +M  
2-11.喷嘴 nozzle: kr6:{\DU:B  
2-13.喷嘴扩张率nozzle expansion rate: m8p4U-*j  
2-14.喷嘴间隙面积 nozzle clearance area : >|(WS.n3C  
2-15.喷嘴间隙nozzle clearance: :ECw \_"0$  
2-16.射流jet: N4tc V\O  
2-17.扩散器diffuser: UX?X]ZYVR  
2-18.扩散器喉部diffuser thoat: RR8U Cv  
2-19.蒸汽导管vapor tube(pipe;chimney): 7~:>WMv9  
2-20.喷嘴组件nozzle assembly: L{zamVQG  
2-21.下裙skirt: -B",&yTV  
dr}O+7_7%-  
3.附件 !P+~ c0DF  
3-1阱trap: P~;<o! f  
⑴.冷阱 cold trap: 'w :tq  
⑵.吸附阱sorption trap: 54bF) <+  
⑶.离子阱ion trap: yZQ1] '^31  
⑷.冷冻升华阱 cryosublimation trap: !Mm+bWn=mB  
3-2.挡板baffle: lrM.RM96  
3-3.油分离器oil separator: + ?[ ACZF  
3-4.油净化器oil purifier:  zgZi  
3-5.冷凝器condenser: x A@|I#  
}S1Z>ZA5  
4.泵按工作分类 1v+JCOy  
4-1.主泵main pump: !]n{l_5r  
4-2.粗抽泵roughing vacuum pump: 7/$nA<qM  
4-3.前级真空泵backing vacuum pump: yL^M~lws  
4-4.粗(低)真空泵 roughing(low)vacuum pump: h'z+8X_t  
4-5.维持真空泵holding vacuum pump: My`josJ`Pb  
4-6.高真空泵high vacuum pump: E,"b*l.  
4-7.超高真空泵ultra-high vacuum pump: [J[ysW})W  
4-8.增压真空泵booster vacuum pump: S}XB |  
!07FsPI#{  
5.真空泵特性 b6rzHnl{  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 7zz(#  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 2 `q^Q  
5-3.起动压力starting pressure: >vNk kxWyQ  
5-4.前级压力 backing pressure : 9OO0Ht4j  
5-5.临界前级压力 critical backing pressure: U>3%!83kF  
5-6.最大前级压力maximum backing pressure: -Ihn<<uE?  
5-7.最大工作压力maximum working pressure: !/=9VD{U!  
5-8.真空泵的极限压力ultimate pressure of a pump: z[$9B#P  
5-9.压缩比compression ratio: * 7zN  
5-10.何氏系数Ho coefficient: VygXhh^7\  
5-11.抽速系数speed factor: Y;%R/OyWY  
5-12.气体的反扩散back-diffusion of gas: gn4g 43  
5-13.泵液返流back-streaming of pump fluid: 80R= r  
5-14.返流率back-streaming rate nFf\tf%8  
5-15.返迁移back-migration: Rzn0-cG  
5-16.爆腾bumping: }y -AoG  
5-17.水蒸气允许量qm water vapor tolerable load: A{n*NxKCX!  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: S3JygN*  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: ^0BF2&Zx  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump ;]O 7^s#v  
3.   1.一般术语 * zJiii  
1-1.压力计pressure gauge: b$$L]$q2  
1-2.真空计vacuum gauge: O}\"$n>  
⑴.规头(规管)gauge head: %]= 'Uv^x  
⑵.裸规nude gauge : _`Yvfz3  
⑶.真空计控制单元gauge control unit : kdueQ(\  
⑷.真空计指示单元gauge indicating unit : '=G<)z@k  
-^nQ^Td=j  
2.真空计一般分类 y0mg}N1  
2-1.压差式真空计differential vacuum gauge: ~?8 x0  
2-2.绝对真空计 absolute vacuum gauge: `'k's]Y  
2-3.全压真空计total pressure vacuum gauge: u3?Pp[tM<  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: }?ac<> u&  
2-5.相对真空计relative vacuum gauge : .qU%SmQ^  
1_E3DXe  
3.真空计特性 ~6kA<(x   
3-1.真空计测量范围pressure range of vacuum gauge: p=5H^E m1  
3-2.灵敏度系数sensitivity coefficient: 6s"bstc{  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): r3bvuq,6$  
3-5.规管光电流photon current of vacuum gauge head: ,9j:h)ks?  
3-6.等效氮压力equivalent nitrogen pressure : +H^V},dBp!  
3-7.X射线极限值 X-ray limit: W;@ae,^  
3-8.逆X射线效应anti X-ray effect: LkbvA  
3-9.布利尔斯效应blears effect: c o%_~xO  
l$~bkVNL  
4.全压真空计 Xs,PT  
4-1.液位压力计liquid level manometer: ,ce^"yG  
4-2.弹性元件真空计elastic element vacuum gauge: `j"G=%e3.  
4-3.压缩式真空计compression gauge: 5 nIlG  
4-4.压力天平pressure balance: /F9lW}pd  
4-5.粘滞性真空计viscosity gauge : Jt, 4@  
4-6.热传导真空计thermal conductivity vacuum gauge : zMqEMx9  
4-7.热分子真空计thermo-molecular gauge: 5Cyjq0+  
4-8.电离真空计ionization vacuum gauge: +&8Ud8Q  
4-9.放射性电离真空计radioactive ionization gauge: T[=cKYp8\  
4-10.冷阴极电离真空计cold cathode ionization gauge: kxf=%<l  
4-11.潘宁真空计penning gauge: (eE}W~Z  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: l5nDt$Ex  
4-13.放电管指示器discharge tube indicator: v23Uh2[@Yy  
4-14.热阴极电离真空计hot cathode ionization gauge: i1 Sc/  
4-15.三极管式真空计triode gauge: (>`SS#(T!  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: . TS=[WGMS  
4-17.B-A型电离真空计Bayard-Alpert gauge: [t) i\ }V  
4-18.调制型电离真空计modulator gauge: 8J U~Q  
4-19.抑制型电离真空计suppressor gauge: z6r/ w  
4-20.分离型电离真空计extractor gauge: eH*b -H[  
4-21.弯注型电离真空计bent beam gauge: s""8V_,;  
4-22.弹道型电离真空计 orbitron gauge : FQ1oqqr  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: U  {!{5l:  
DN0b.*[`3  
5.分压真空计(分压分析器) dph6aN(49  
5-1.射频质谱仪radio frequency mass spectrometer: MCG~{#`  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: 8{ t&8Ql n  
5-3.单极质谱仪momopole mass spectrometer: N,$o' \l  
5-4.双聚焦质谱仪double focusing mass spectrometer: uNBhVsM6<  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Rx-i.EtZ  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 1e} 3L2rC  
5-7.回旋质谱仪omegatron mass spectrometer: %n,bPa>T  
5-8.飞行时间质谱仪time of flight mass spectrometer: 1=.kH[R  
>L4$DKO  
6.真空计校准 _S1uJ~j;E  
6-1.标准真空计reference gauges: RL9BB.  
6-2.校准系统system of calibration: X\RTHlw']  
6-3.校准系数K calibration coefficient: _,~zy9{,  
6-4.压缩计法meleod gauge method: tYa8I/HpT  
6-5.膨胀法expansion method: CU_06A|}  
6-6.流导法flow method: &N;6G`3  
4.   1.真空系统vacuum system a| cD{d  
1-1.真空机组pump system: `I$A;OPK7  
1-2.有油真空机组pump system used oil : JY16|ia  
1-3.无油真空机组oil free pump system t57b)5{FM  
1-4.连续处理真空设备continuous treatment vacuum plant: mNKa~E  
1-5.闸门式真空系统vacuum system with an air-lock: %}:J 9vra  
1-6.压差真空系统differentially pumped vacuum system: $ 1ZY Vw  
1-7.进气系统gas admittance system: bHnQLJ  
oMbCljUC  
2.真空系统特性参量 i|mA/ e3b  
2-1.抽气装置的抽速volume flow rate of a pumping unit : 'CX KphlWs  
2-2.抽气装置的抽气量throughput of a pumping unit : Jt8 v=<@  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: }^q#0`e(y  
2-4.真空系统的漏气速率leak throughput of a vacuum system: u@B"*V~K  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: rpmDr7G  
2-6.极限压力ultimate pressure: |*$_eb  
2-7.残余压力residual pressure: tDo0Q/`  
2-8.残余气体谱residual gas spectrum: |sh  U  
2-9.基础压力base pressure: |.A>0-']M  
2-10.工作压力working pressure: TfPx   
2-11.粗抽时间roughing time: rL=$WxdPU  
2-12.抽气时间pump-down time: YaU A}0cW  
2-13.真空系统时间常数time constant of a vacuum system: 7-DC"`Y8e  
2-14.真空系统进气时间venting time: U VT8TN-T  
jo ^*R'}  
3.真空容器 pP @#|T  
3-1.真空容器;真空室vacuum chamber: _*9Zp1r  
3-2.封离真空装置sealed vacuum device: (`xc3-,  
3-3.真空钟罩vacuum bell jar: 4]bT O  
3-4.真空容器底板vacuum base plate: Dfea<5~^z  
3-5.真空岐管vacuum manifold: kBzzi^cl  
3-6.前级真空容器(贮气罐)backing reservoir: yrjm0BM#  
3-7.真空保护层outer chamber: R|suBF3  
3-8.真空闸室vacuum air lock: j{g{`Qa  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: Hpt)(Nz:  
[Z 0 e$  
4.真空封接和真空引入线 gJ])A7O  
4-1.永久性真空封接permanent seal : F!xK#~e   
4.2.玻璃分级过渡封接graded seal : /dfZ>k8  
4-3.压缩玻璃金属封接compression glass-to-metal seal: ;Y"J j  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: R/#*~tPi8  
4-5.陶瓷金属封接ceramic-to-metal seal: )d(cXN-T  
4-6.半永久性真空封接semi-permanent seal : 3 yElN.=  
4-7.可拆卸的真空封接demountable joint: B;m18LDu  
4-8.液体真空封接liquid seal =vFI4)$-  
4-9.熔融金属真空封接molten metal seal: BWs\'B  
4-10.研磨面搭接封接ground and lapped seal: ?o4&cCFOE  
4-11.真空法兰连接vacuum flange connection: ?d %_o@  
4-12.真空密封垫vacuum-tight gasket: <ESAoY"RPN  
4-13.真空密封圈ring gasket: `drvu?F  
4-14.真空平密封垫flat gasket: K)qmJ-Gub  
4-15.真空引入线feedthrough leadthrough: 1)r1/0  
4-16.真空轴密封shaft seal: 9$_}E`  
4-17.真空窗vacuum window: j.z#fU  
4-18.观察窗viewing window: ~DJ/sY2/  
<W?,n%  
5.真空阀门 &EQov9P7  
5-1.真空阀门的特性characteristic of vacuum valves: +z4NxR   
⑴.真空阀门的流导conductance of vacuum valves: {>z.y1  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: mz#(\p=T  
5-2.真空调节阀regulating valve: j'7FTVmJ  
5-3.微调阀 micro-adjustable valve: H(pOR< `  
5-4.充气阀charge valve: / g&mDYV|  
5-5.进气阀gas admittance valve: I[&!\Me[+w  
5-6.真空截止阀break valve: q)P<lKi  
5-7.前级真空阀backing valve: |m=@;B|  
5-8.旁通阀 by-pass valve: v9<p@GY"\  
5-9.主真空阀main vacuum valve: mV;7SBoT  
5-10.低真空阀low vacuum valve: -du+iOe?  
5-11.高真空阀high vacuum valve: l/TH"z(  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: BFMM6-Ve  
5-13.手动阀manually operated valve: }x%"Oq|2]x  
5-14.气动阀pneumatically operated valve: F`-? 3]\3  
5-15.电磁阀electromagnetically operated valve: 7Fq|Zc`P  
5-16.电动阀valve with electrically motorized operation: 9)=as/o  
5-17.挡板阀baffle valve: XL +kEZ|3  
5-18.翻板阀flap valve: !Zs;m`j&9  
5-19.插板阀gate valve: :cOwTW?Fj  
5-20.蝶阀butterfly valve: #a/lt^}C*  
5B(|!Xq;I  
6.真空管路 v+\E%H  
6-1.粗抽管路roughing line: p1 o?^A&  
6-2.前级真空管路backing line: 1XSqgr"3  
6-3.旁通管路;By-Pass管路 by-pass line: =P5SFMPN  
6-4.抽气封口接头pumping stem: p<jHUG4?'  
6-5.真空限流件limiting conductance:       {xOu*8J  
6-6.过滤器filter: 1Og9VG1^  
5.   1.一般术语 {B[i|(xQx  
1-1真空镀膜vacuum coating: 0m?ul%=  
1-2基片substrate: `RjcJ?r  
1-3试验基片testing substrate: 6k ^vF~  
1-4镀膜材料coating material: ^P]: etld9  
1-5蒸发材料evaporation material: +|o -lb  
1-6溅射材料sputtering material: J,E&Uz95%  
1-7膜层材料(膜层材质)film material: Ad]r )d{  
1-8蒸发速率evaporation rate: 4h(aTbHaQ  
1-9溅射速率sputtering rate: v}iJ :'  
1-10沉积速率deposition rate: 8^M5u>=t;  
1-11镀膜角度coating angle: _msDf2e9  
XLM 9+L  
2.工艺 Wqy8ZgSC  
2-1真空蒸膜vacuum evaporation coating: 2wu 5`Z[E  
(1).同时蒸发simultaneous evaporation: y*zZ }>  
(2).蒸发场蒸发evaporation field evaporation: ,E/vHI8  
(3).反应性真空蒸发reactive vacuum evaporation: o2%"Luf<  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: -'ZP_$sA  
(5).直接加热的蒸发direct heating evaporation: F.AO  
(6).感应加热蒸发induced heating evaporation: ,ll!19y  
(7).电子束蒸发electron beam evaporation: _&yQW&vH#  
(8).激光束蒸发laser beam evaporation: Wlt shZo  
(9).间接加热的蒸发indirect heating evaporation: L@v0C)  
(10).闪蒸flash evaportion: bXtA4O  
2-2真空溅射vacuum sputtering: .%D] z{''  
(1).反应性真空溅射 reactive vacuum sputtering: \*_qP*vq@  
(2).偏压溅射bias sputtering: lJq %me;4m  
(3).直流二级溅射direct current diode sputtering: aIkxN&  
(4).非对称性交流溅射asymmtric alternate current sputtering: ^QXUiXzl  
(5).高频二极溅射high frequency diode sputtering: ]jM D'vg^b  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1OJ:Vy}n  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: g%^Zq"  
(8).离子束溅射ion beam sputtering: {%~Sbcq4F  
(9).辉光放电清洗glow discharge cleaning: M~3(4,  
2-3物理气相沉积PVD physical vapor deposition: qE(`@G  
2-4化学气相沉积CVD chemical vapor deposition: {jr>Z"/q  
2-5磁控溅射magnetron sputtering: OhIUm4=|$  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: \b~zyt6-  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: Y$Fbi2A4  
2-8电弧离子镀arc discharge deposition: <w08p*?  
R?^FO:nM%!  
3.专用部件 vzy/Rq  
3-1镀膜室coating chamber: $D8KEkW  
3-2蒸发器装置evaporator device: vzs6YsA  
3-3蒸发器evaporator: &Gxk~p<  
3-4直接加热式蒸发器evaporator by direct heat: S: b-+w|*  
3-5间接加热式蒸发器evaporator by indirect heat: f&5'1tG  
3-7溅射装置sputtering device: .lbo\v}2W  
3-8靶target: acG4u+[ ]  
3-10时控挡板timing shutter: 6sE%]u<V  
3-11掩膜mask: Z@i"/~B|4\  
3-12基片支架substrate holder: mEh([ZnY  
3-13夹紧装置clamp: >v\t> [9t  
3-14换向装置reversing device: M9*#8>  
3-15基片加热装置substrate heating device: XXwe/>J  
3-16基片冷却装置substrate colding device: A.[~}ywH  
3k U4?D]  
4.真空镀膜设备 +c+i~5B4  
4-1真空镀膜设备vacuum coating plant: S! Z2aFj  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: 4 C7z6VWg  
(2).真空溅射镀膜设备vacuum sputtering coating plant: |:[ [w&R  
4-2连续镀膜设备continuous coating plant: V:Z}cfR.7  
4-3半连续镀膜设备semi- continuous coating plant 4nvi7  
6.   1.漏孔 *{K?JB#W  
1-1漏孔leaks: }={TVs^  
1-2通道漏孔channel leak: h! yI(cY  
1-3薄膜漏孔membrane leak: qL;T^ljP  
1-4分子漏孔molecular leak: Of@ LEEh6  
1-5粘滞漏孔vixcous leak: ;1gWz  
1-6校准漏孔calibrated leak: cT&!_g#g  
1-7标准漏孔reference leak : ZUg ~8VVe  
1-8虚漏virtual leak: d[( }  
1-9漏率leak rate: r9\7I7z  
1-10标准空气漏率standard air leak rate: sFrerv&0  
1-11等值标准空气漏率equivalent standard air leak rate: m,3H]  
1-12探索(示漏)气体: D# Gf.c  
9^4BqAWYrV  
2.本底 :U{$G( <  
2-1本底background: AP:(/@K|  
2-2探索气体本底search gas background : / %9DO  
2-3漂移drift: s+fjQo4  
2-4噪声noise: AJJa<c+j  
/%F}vW(!  
3.检漏仪 9| {t%F=-  
3-1检漏仪leak detector: &%=]lP]  
3-2高频火花检漏仪H.F. spark leak detector: 1*VArr6*6  
3-3卤素检漏仪halide leak detector: 7A=*3  
3-4氦质谱检漏仪helium mass spectrometer leak detector: [t}@>@W|  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: !yQ%^g`  
~'.SmXZs  
4.检漏 j=U^+jAn  
4-1气泡检漏leak detection by bubbles: 0e,U&B<W  
4-2氨检漏leak detection by ammonia: +qiI;C_P\  
4-3升压检漏leak detection of rise pressure: nQm (UN  
4-4放射性同位素检漏radioactive isotope leak detection: UzKB"Q  
4-5荧光检漏fluorescence leak detection W|I<hY\X  
7.   1.一般术语 q L-Ni  
1-1真空干燥vacuum drying: }fqy vI  
1-2冷冻干燥freeze drying : 25H=RTw  
1-3物料material: k;~*8i=%,\  
1-4待干燥物料material to be dried: ]ME2V  
1-5干燥物料dried material : ZQ)vvD<  
1-6湿气moisture;humidity: b+tm[@|,v  
1-7自由湿气free moisture: :< *xG&  
1-8结合湿气bound moisture: p?H2W-  
1-9分湿气partial moisture: 9\S,$A{{*  
1-10含湿量moisture content: }xb?C""q^q  
1-11初始含湿量initial moisture content: IA3m.Vxj ^  
1-12最终含湿量final residual moisture: 0qSf7"3f  
1-13湿度degree of moisture ,degree of humidity : 3;<Vv*a"Dm  
1-14干燥物质dry matter : 6-t:eo9  
1-15干燥物质含量content of dry matter: Gl]z@ZXWIw  
PZYVLUw `  
2.干燥工艺 3[cGSI"+  
2-1干燥阶段stages of drying : dhCrcYn  
(1).预干燥preliminary dry: -E +LA  
(2).一次干燥(广义)primary drying(in general): mhv ;pM6  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): RemjiCE0'  
(4).二次干燥secondary drying: D6vhW:t8?  
2-2.(1).接触干燥contact drying: ["~T)d'  
(2).辐射干燥 drying by radiation : pkEx.R)  
(3).微波干燥microwave drying: >E\U$}WCG  
(4).气相干燥vapor phase drying: Fu\!'\6  
(5).静态干燥static drying: ,(v=ZeI  
(6).动态干燥dynamic drying: '&<saqA  
2-3干燥时间drying time: &,%+rvo}  
2-4停留时间length of stay(in the drying chamber): "Gc\"'^r  
2-5循环时间cycle time: *Q!I^]CR  
2-6干燥率 dessication ratio : z`2Ais@ao  
2-7去湿速率mass flow rate of humidity: kR]AW60OE  
2-8单位面积去湿速率mass flow rate of humidity per surface area: bS&XlgnKi  
2-9干燥速度 drying speed : X 3(CY`HH[  
2-10干燥过程drying process: 7Rl/F1G o}  
2-11加热温度heating temperature: ::k cV'*  
2-12干燥温度temperature of the material being dried : K [R.B!;N  
2-13干燥损失loss of material during the drying process : Gr|IM,5P4  
2-14飞尘lift off (particles): Q4B(NYEu(  
2-15堆层厚度thickness of the material: ;uyQR8  
`^'0__<M  
3.冷冻干燥 aFd87'^  
3-1冷冻freezing: U`kO<ztk  
(1).静态冷冻static freezing: kPezR: 31  
(2).动态冷冻dynamic freezing: ~ea&1+Z[3  
(3).离心冷冻centrifugal freezing:  XM<  
(4).滚动冷冻shell freezing: b.mWB`59  
(5).旋转冷冻spin-freezing: nV>=n,+s"  
(6).真空旋转冷冻vacuum spin-freezing: jU!ibs}R3  
(7).喷雾冷冻spray freezing: ?V$@2vBVX4  
(8).气流冷冻air blast freezing: x%OJ3Qjj=  
3-2冷冻速率rate of freezing: #)z7&nD  
3-3冷冻物料frozen material: |v@ zyOq&b  
3-4冰核ice core: F0tx.]uS  
3-5干燥物料外壳envelope of dried matter: !WNO!S0/j  
3-6升华表面sublimation front: 3Ss)i7  
3-7融化位置freezer burn: H':0  
z2god 1"  
4.真空干燥设备;真空冷冻干燥设备 Azag*M?  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: U~_G *0  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: x_OZdI  
4-3加热表面heating surface: 0s%]%2O N  
4-4物品装载面shelf : Z.3*sp0 yv  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): uV\~2#o$_  
4-6单位面积干燥器处理能力throughput per shelf area: b_GAK  
4-7冰冷凝器ice condenser: b*dEX%H8sf  
4-8冰冷凝器的负载load of the ice condenser: *@[N~:z/  
4-9冰冷凝器的额定负载rated load of the ice condenser aT}?-CUxx  
8.   1.一般术语 QR*{}`+l  
1-1试样sample : rj-Q+rgup  
(1).表面层surface layer: "j%L*J)  
(2).真实表面true surface: "-A@d&5.  
(3).有效表面积effective surface area: S\W&{+3  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: ;1L7+.A  
(5).表面粒子密度surface particle density: L0>w|LpRc  
(6).单分子层monolayer: n_1,-(t  
(7).表面单分子层粒子密度monolayer density: Qm2(Z8Gh  
(8).覆盖系数coverage ratio: T8\%+3e.  
1-2激发excitation: .8/W_iC92  
(1).一次粒子primary particle: i=j4Wg,{J  
(2).一次粒子通量primary particle flux: uW^W/S%'  
(3).一次粒子通量密度density of primary particle flux: gfm aO ]  
(4).一次粒子负荷primary particle load: z+F:_  
(5).一次粒子积分负荷integral load of primary particle: hSfLNvK  
(6).一次粒子的入射能量energy of the incident primary particle: DY!mq91  
(7).激发体积excited volume: )0xEI  
(8).激发面积excited area: Ehf3L |9   
(9).激发深度excited death: .W q"  
(10).二次粒子secondary particles: =OU]<%  
(11).二次粒子通量secondary particle flux: }t9A#GOz  
(12).二次粒子发射能energy of the emitted secondary particles: 8GFA}_(^R  
(13).发射体积emitting volume: }c-tvK1g  
(14).发射面积emitting area: ,Jh('r7  
(15).发射深度emitting depth: @dp1bkU  
(16).信息深度information depth: &+>)H$5  
(17).平均信息深度mean information depth: ~\D H[Mt  
1-3入射角angle of incidence: Hxzdxwz%$  
1-4发射角angle of emission: sT"h)I)]*  
1-5观测角observation: w=S7zzL)  
1-6分析表面积analyzed surface area: WmT(>JBO  
1-7产额 yield : :i_k A'dl&  
1-8表面层微小损伤分析minimum damage surface analysis: hSyA;*)U  
1-9表面层无损伤分析non-destructive surface analysis: IfGQeynj  
1-10断面深度分析 profile analysis in depth; depth profile analysis : ,"!P{c  
1-11可观测面积observable area: ,0R2k `m!  
1-12可观测立体角observable solid angle : `nDgwp:b"  
1-13接受立体角;观测立体角angle of acceptance: >4}2~;  
1-14角分辨能力angular resolving power: 9#AsSbBpf  
1-15发光度luminosity: _Ak?i\  
1-16二次粒子探测比detection ratio of secondary particles: ceu}Lp^%/  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: "wPFQXU  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ]'UO]i/  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: ~4~-^ t  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: ;=.QT  
1-21本底压力base pressure: aQEMCWxZ  
1-22工作压力working pressure: %q@eCN  
43;@m}|7$  
2.分析方法 Pb|'f(  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: !m#cneV  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : AE)<ee%\\  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: .FnO  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: Lw]:/x  
2-3离子散射表面分析ion scattering spectroscopy: .wD>0Ig  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: F%Lniv/N  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: d/GP.d  
2-6离子散射谱仪ion scattering spectrometer: qYW{$K  
2-7俄歇效应Auger process: nr>g0_%m  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: Oifu ?f<r  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: /AR;O4X+  
2-10光电子谱术photoelectron spectroscopy : 0O>8DX  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: .Jz$)R  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: N2VF_[l  
2-11光电子谱仪photoelectron spectrometer: =De%]]>   
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: HlB'yOHv!  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: $;_'5`xs  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): 0C}7=_?  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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