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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 tD> qHR  
--------------------------------------------------- Wx8n)  
真空术语 _g6H&no[  
2C#b-Y 1~N  
1.标准环境条件 standard ambient condition: fnK H<  
2.气体的标准状态 standard reference conditions forgases: 5E}!TL$  
3.压力(压强)p pressure: f9^MLb6)  
4.帕斯卡Pa pascal: U\dLq&=V  
5.托Torr torr: ;upYam"  
6.标准大气压atm standard atmosphere: q m"AatA  
7.毫巴mbar millibar: +HoCG;C{  
8.分压力 partial pressure: @[~j|YH}  
9.全压力 total pressure: 7A{,)Y/w ^  
10.真空 vacuum: $|7;(2k  
11.真空度 degree of vacuum: nBzju?X)I  
12.真空区域 ranges of vacuum: O[z-K K<  
13.气体 gas: o(g}eP,g }  
14.非可凝气体 non-condensable gas: CW?R7A/  
15.蒸汽vapor: B0,C!??5  
16.饱和蒸汽压saturation vapor pressure: IQ5'4zQg=  
17.饱和度degree of saturation: tW%!|T5/  
18.饱和蒸汽saturated vapor: {r:5\  
19.未饱和蒸汽unsaturated vapor: o^+g2;Ro  
20.分子数密度n,m-3 number density of molecules: ~> S? m;  
21.平均自由程ι、λ,m mean free path: E|x t\ *  
22.碰撞率ψ collision rate: i?6#>;f  
23.体积碰撞率χ volume collision rate: wa$Q8/  
24.气体量G quantity of gas: 7&1 dr  
25.气体的扩散 diffusion of gas: Je=k.pO1  
26.扩散系数D diffusion coefficient; diffusivity: XT{ukEvDR  
27.粘滞流 viscous flow: HA~BXxa/  
28.粘滞系数η viscous factor: (~]0)J  
29.泊肖叶流 poiseuille flow: |yi#6!}^  
30.中间流 intermediate flow: M ~5Ja0N~  
31.分子流 molecular flow: j0A9;AP;;C  
32克努曾数 number of knudsen: 3j/~XT  
33.分子泻流 molecular effusion; effusive flow: bjql<x5d  
34.流逸 transpiration: #=czqZw  
35.热流逸 thermal transpiration: sH :_sOV*  
36.分子流率qN molecular flow rate; molecular flux: )uy2,`z  
37.分子流率密度 molecular flow rate density; density of molecular flux: MR.c?P?0Q  
38.质量流率qm mass flow rare: "2hs=^&8  
39.流量qG throughput of gas: )J1xO^tE  
40.体积流率qV volume flow rate: :F?L,I,K  
41.摩尔流率qυ molar flow rate: =&y6mQ  
42.麦克斯韦速度分布 maxwellian velocity distribution: A<[BR*n  
43.传输几率Pc transmission probability: >44,Dp]  
44.分子流导CN,UN molecular conductance: K#[ z5  
45.流导C,U conductance: c<5(c%a  
46.固有流导Ci,Ui intrinsic conductance: im"3n=  
47.流阻W resistance: %D E_kwL  
48.吸附 sorption: A8j$c~  
49.表面吸附 adsorption: .CEl{fofj  
50.物理吸附physisorption: U2*kuP+n  
51.化学吸附 chemisorption: rl:D>t(:.  
52.吸收absorption: Rz=wInFs  
53.适应系数α accommodation factor: PPj%.i)  
54.入射率υ impingement rate: JO&+W^$uY}  
55.凝结率condensation rate: C$^WW}S  
56.粘着率 sticking rate: $mut v=IO  
57.粘着几率Ps sticking probability: [*d<LAnuWP  
58.滞留时间τ residence time: TH? wXd\  
59.迁移 migration: d5qGTT ~a  
60.解吸 desorption: XWBTBL  
61.去气 degassing: mZ#h p}\.  
62.放气 outgassing: O.$OLK;v  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: I0}G, q  
64.蒸发率 evaporation rate: mC./,a[  
65.渗透 permeation: Io]KlR@!T  
66.渗透率φ permeability: 8RU91H8fE  
67.渗透系数P permeability coefficient Aw=GvCo<  
2.   1.真空泵 vacuum pumps 6U%F mE@  
1-1.容积真空泵 positive displacement pump: lh*!f$2 ~  
⑴.气镇真空泵 gas ballast vacuum pump: SVqKG+{My  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: N`NW*~  
⑶.干封真空泵 dry-sealed vacuum pump: #oxP,LR  
⑷.往复真空泵 piston vacuum pump: K# BZ Jcb  
⑸.液环真空泵 liquid ring vacuum pump: YguY5z  
⑹.旋片真空泵 sliding vane rotary vacuum pump: E\*M4n\!  
⑺.定片真空泵 rotary piston vacuum pump: r<EwtO+x  
⑻.滑阀真空泵 rotary plunger vacuum pump: d%Nx/DS)  
⑼.余摆线真空泵 trochoidal vacuum pump: s+6tdBvzs  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump:  ].3@ Dk  
⑾.罗茨真空泵 roots vacuum pump: iB3C.wd-  
1-2.动量传输泵 kinetic vacuum pump: koy0A/\%  
⑴.牵引分子泵molecular drag pump: 3'6by!N,d  
⑵.涡轮分子泵turbo molecular pump: VMJK9|JC[  
⑶.喷射真空泵ejector vacuum pump: |!uC [=  
⑷.液体喷射真空泵liquid jet vacuum pump: |!*abc\`(`  
⑸.气体喷射真空泵gas jet vacuum pump: R|R3Ob.e  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : IZ9* '0Z  
⑺.扩散泵diffusion pump : Zxn>]Z_  
⑻.自净化扩散泵self purifying diffusion pump: lfyij[6q+  
⑼.分馏扩散泵 fractionating diffusion pump : & hv@ &  
⑽.扩散喷射泵diffusion ejector pump : YL9Tsw  
⑾.离子传输泵ion transfer pump: Dj x[3['  
1-3.捕集真空泵 entrapment vacuum pump: x)-n[Fu  
⑴吸附泵adsorption pump: NU.YL1  
⑵.吸气剂泵 getter pump: qWb8"  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : m";?B1%x  
⑷.吸气剂离子泵getter ion pump: Ql? >,FZ  
⑸.蒸发离子泵 evaporation ion pump: *M+CA_I(  
⑹.溅射离子泵sputter ion pump: #gRtCoew  
⑺.低温泵cryopump: RgLkAHA  
xHWD1>  
2.真空泵零部件 E rnGX#@v  
2-1.泵壳 pump case: ts;C:.X  
2-2.入口 inlet: ~uh,R-Q$  
2-3.出口outlet: .5+5ca  
2-4.旋片(滑片、滑阀)vane; blade : tq2Ti Xo%  
2-5.排气阀discharge valve: K"g`,G6S  
2-6.气镇阀gas ballast valve: >3)AO04=;  
2-7.膨胀室expansion chamber: q.v_?X<_  
2-8.压缩室compression chamber: `;z;=A*  
2-9.真空泵油 vacuum pump oil: !E_RD,_  
2-10.泵液 pump fluid: `lN Z|U  
2-11.喷嘴 nozzle: <*5`TE0J  
2-13.喷嘴扩张率nozzle expansion rate: bh UghHT  
2-14.喷嘴间隙面积 nozzle clearance area : i 2n66d  
2-15.喷嘴间隙nozzle clearance: GE |P)VO  
2-16.射流jet: 1 eMaKT_=  
2-17.扩散器diffuser: m9Hdg^L  
2-18.扩散器喉部diffuser thoat: 5g4xhYl70n  
2-19.蒸汽导管vapor tube(pipe;chimney): +3k#M[Bn}  
2-20.喷嘴组件nozzle assembly: +*KDtqZjk  
2-21.下裙skirt: Nj`Miv o  
Mx=L lC)  
3.附件 s]i<D9h  
3-1阱trap: JbW!V Y  
⑴.冷阱 cold trap: l&6+ykQ  
⑵.吸附阱sorption trap: f<P>IE  
⑶.离子阱ion trap: ~A-VgBbU>_  
⑷.冷冻升华阱 cryosublimation trap: *;<>@*  
3-2.挡板baffle: >@L^^ -r  
3-3.油分离器oil separator: L+TM3*a*  
3-4.油净化器oil purifier: $d%NFc&  
3-5.冷凝器condenser: &-4SA j  
yMBFw:/o  
4.泵按工作分类 $/;<~Pzi  
4-1.主泵main pump: CO.e.:h  
4-2.粗抽泵roughing vacuum pump: R4[dh.lf  
4-3.前级真空泵backing vacuum pump: Nzel^~  
4-4.粗(低)真空泵 roughing(low)vacuum pump: 5'"l0EuD  
4-5.维持真空泵holding vacuum pump: )}5f'TK  
4-6.高真空泵high vacuum pump: _dynqF8*  
4-7.超高真空泵ultra-high vacuum pump: N1jJ(}{3  
4-8.增压真空泵booster vacuum pump: 7g&<ZZo  
j!hdi-aTU  
5.真空泵特性 c`4i#R  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: %XK<[BF  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 9$e6?<`(Y  
5-3.起动压力starting pressure: " uHU!)J#z  
5-4.前级压力 backing pressure : s14;\  
5-5.临界前级压力 critical backing pressure: L$s ;tJ   
5-6.最大前级压力maximum backing pressure: -H AUKY@;5  
5-7.最大工作压力maximum working pressure: <[<]+r&*  
5-8.真空泵的极限压力ultimate pressure of a pump: h6C:`0o  
5-9.压缩比compression ratio: -MT.qhx  
5-10.何氏系数Ho coefficient: yZ57uz  
5-11.抽速系数speed factor: p/.[ cH  
5-12.气体的反扩散back-diffusion of gas: g'{hp:  
5-13.泵液返流back-streaming of pump fluid: ">NPp\t>/Z  
5-14.返流率back-streaming rate Hp?uYih0  
5-15.返迁移back-migration: Y#aHGZ$i  
5-16.爆腾bumping: R|O."&CAB  
5-17.水蒸气允许量qm water vapor tolerable load: hNGD `"U  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: X1; ljX  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: )6,Pmq~)  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump Zlf) dDn  
3.   1.一般术语 &?j]L4%  
1-1.压力计pressure gauge: 5W~-|8m  
1-2.真空计vacuum gauge: coFQu ; i  
⑴.规头(规管)gauge head: >)`V $x  
⑵.裸规nude gauge : TNK~ETE4  
⑶.真空计控制单元gauge control unit : CXfPC[o  
⑷.真空计指示单元gauge indicating unit : Zi~-m]9U  
@8s:,Y_  
2.真空计一般分类 k&8&D  
2-1.压差式真空计differential vacuum gauge: 3 tIno!|  
2-2.绝对真空计 absolute vacuum gauge: [^GXHE=  
2-3.全压真空计total pressure vacuum gauge: VN!+r7w'  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: u+/1ryp  
2-5.相对真空计relative vacuum gauge : j,i> 1|J  
gg%9EJpP  
3.真空计特性 r>gU*bs(  
3-1.真空计测量范围pressure range of vacuum gauge: dqo&3^px  
3-2.灵敏度系数sensitivity coefficient: ]@bu%_s"  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): A~7q=-  
3-5.规管光电流photon current of vacuum gauge head: Ci?A4q$.  
3-6.等效氮压力equivalent nitrogen pressure : /QK H30E  
3-7.X射线极限值 X-ray limit: h`:f  
3-8.逆X射线效应anti X-ray effect: " .:b43Z  
3-9.布利尔斯效应blears effect: FR9*WI   
'}eA2Q>BV  
4.全压真空计 G0VbW-`O  
4-1.液位压力计liquid level manometer: E3<~C(APW  
4-2.弹性元件真空计elastic element vacuum gauge: S&`iEwG  
4-3.压缩式真空计compression gauge: 8m poY.E4!  
4-4.压力天平pressure balance: skR I \  
4-5.粘滞性真空计viscosity gauge : n.\|NR'v  
4-6.热传导真空计thermal conductivity vacuum gauge : C=|X]"*:u0  
4-7.热分子真空计thermo-molecular gauge: jVhfpS[  
4-8.电离真空计ionization vacuum gauge: <.qhW^>X  
4-9.放射性电离真空计radioactive ionization gauge: sLh %k  
4-10.冷阴极电离真空计cold cathode ionization gauge: zP$Ef7bB  
4-11.潘宁真空计penning gauge: m^rrbU+HM?  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: qwx{U  
4-13.放电管指示器discharge tube indicator: ]t|-  
4-14.热阴极电离真空计hot cathode ionization gauge: o$FYCz n  
4-15.三极管式真空计triode gauge: +rA:/!b)Y  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: ?}g#Mc  
4-17.B-A型电离真空计Bayard-Alpert gauge: @+`">a8} ,  
4-18.调制型电离真空计modulator gauge: Ivue"_i;!  
4-19.抑制型电离真空计suppressor gauge: ~'aK[3  
4-20.分离型电离真空计extractor gauge: +f- E8q  
4-21.弯注型电离真空计bent beam gauge: HD& Ag  
4-22.弹道型电离真空计 orbitron gauge : UAi]hUq  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ka$oUB)iQ  
A(#4$}!n5  
5.分压真空计(分压分析器) :n t\uwh  
5-1.射频质谱仪radio frequency mass spectrometer: 31@m36? X  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: Mm'q4DV^  
5-3.单极质谱仪momopole mass spectrometer: NDv_@V(D  
5-4.双聚焦质谱仪double focusing mass spectrometer: [C TR8  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: b=-LQkcZhK  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: t/HUG#W{  
5-7.回旋质谱仪omegatron mass spectrometer: hz8Z)xjJ V  
5-8.飞行时间质谱仪time of flight mass spectrometer: HECZZnM  
> l@ o\  
6.真空计校准 9?xc3F2EBD  
6-1.标准真空计reference gauges: W7ffdODb  
6-2.校准系统system of calibration: B1C"F-2d  
6-3.校准系数K calibration coefficient: ==z,vxr  
6-4.压缩计法meleod gauge method: cqyrao3;  
6-5.膨胀法expansion method: %G%D[ i]  
6-6.流导法flow method: gU^2;C  
4.   1.真空系统vacuum system R#QcQx  
1-1.真空机组pump system: VP<_~OLc  
1-2.有油真空机组pump system used oil : |G QFNrNx  
1-3.无油真空机组oil free pump system p*^[ ~}N  
1-4.连续处理真空设备continuous treatment vacuum plant: ,n &e,I  
1-5.闸门式真空系统vacuum system with an air-lock: 1-=zSWmyK  
1-6.压差真空系统differentially pumped vacuum system: />i~No#Xm  
1-7.进气系统gas admittance system: MSMgaw?  
^8#;>+7R  
2.真空系统特性参量 !]-ET7  
2-1.抽气装置的抽速volume flow rate of a pumping unit : z&@Vg`w"  
2-2.抽气装置的抽气量throughput of a pumping unit : l"-F<^ U  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: eT|"6WJ:{  
2-4.真空系统的漏气速率leak throughput of a vacuum system: y s3&$G  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: JTxHM?/G  
2-6.极限压力ultimate pressure: 6UkX?I`>  
2-7.残余压力residual pressure: /4f4H?A -  
2-8.残余气体谱residual gas spectrum: = +=k(*  
2-9.基础压力base pressure: nd 5w|83  
2-10.工作压力working pressure: oq>8  
2-11.粗抽时间roughing time: ?+WSYg0  
2-12.抽气时间pump-down time: ny. YkN2  
2-13.真空系统时间常数time constant of a vacuum system: 6,*o;<k[  
2-14.真空系统进气时间venting time: aNW!Y':*  
@%5$x]^  
3.真空容器 :&/b}b!)AX  
3-1.真空容器;真空室vacuum chamber: Ak\w)!?s  
3-2.封离真空装置sealed vacuum device: A+N%A] 2  
3-3.真空钟罩vacuum bell jar: 'z=QV{ni  
3-4.真空容器底板vacuum base plate: 7Qc 4Oz:t  
3-5.真空岐管vacuum manifold: X8Xw'  
3-6.前级真空容器(贮气罐)backing reservoir: >J \}&!8,  
3-7.真空保护层outer chamber: TZ]D6.mD  
3-8.真空闸室vacuum air lock: O'G,   
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: v$H]=y  
iA^GA8dn  
4.真空封接和真空引入线 .\?)O+J!  
4-1.永久性真空封接permanent seal : wV9[Jl\Z  
4.2.玻璃分级过渡封接graded seal : iYyJq;S   
4-3.压缩玻璃金属封接compression glass-to-metal seal: ~?m vV`30&  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: U#jbii6e  
4-5.陶瓷金属封接ceramic-to-metal seal: wjr1?c  
4-6.半永久性真空封接semi-permanent seal : sKkk+-J4  
4-7.可拆卸的真空封接demountable joint: /puM3ZN  
4-8.液体真空封接liquid seal L)sCc0fv7k  
4-9.熔融金属真空封接molten metal seal: .mse.$TK.^  
4-10.研磨面搭接封接ground and lapped seal: nEZo F  
4-11.真空法兰连接vacuum flange connection: (oYM}#Q  
4-12.真空密封垫vacuum-tight gasket: },2mIit(  
4-13.真空密封圈ring gasket: C>?`1d@  
4-14.真空平密封垫flat gasket: Ier0F7]I  
4-15.真空引入线feedthrough leadthrough: d0`5zd@S  
4-16.真空轴密封shaft seal: >|Hd*pg))  
4-17.真空窗vacuum window: Wa8?o~0"L  
4-18.观察窗viewing window: O=HT3gp&  
1w)#BYc=L  
5.真空阀门 p.gaw16}>  
5-1.真空阀门的特性characteristic of vacuum valves: drJ<&1O  
⑴.真空阀门的流导conductance of vacuum valves: 0V5 RZ`.  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: qw!_/Z3[  
5-2.真空调节阀regulating valve: %D(% lh2  
5-3.微调阀 micro-adjustable valve: +~6gP!  
5-4.充气阀charge valve: B/(]AWi+  
5-5.进气阀gas admittance valve: \&&jzU2  
5-6.真空截止阀break valve: RaS7IL:e  
5-7.前级真空阀backing valve: a-t}L{~  
5-8.旁通阀 by-pass valve: YlZe  
5-9.主真空阀main vacuum valve: QsaaA MGY  
5-10.低真空阀low vacuum valve: Hd1e9Q,:|  
5-11.高真空阀high vacuum valve: $6ZO V/0  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: O6LuFT .  
5-13.手动阀manually operated valve: #gw ys  
5-14.气动阀pneumatically operated valve: -`mHb  
5-15.电磁阀electromagnetically operated valve: uqhNi!;  
5-16.电动阀valve with electrically motorized operation: -NG`mfu  
5-17.挡板阀baffle valve: m17H#!`  
5-18.翻板阀flap valve: F+Qp mVU  
5-19.插板阀gate valve: 9tW=9<E  
5-20.蝶阀butterfly valve: ?#8s=t  
YGBVGpE9  
6.真空管路 DQ{Yr>J  
6-1.粗抽管路roughing line: A=7  [^I2  
6-2.前级真空管路backing line: 7 I/  
6-3.旁通管路;By-Pass管路 by-pass line: -?A,N,nnX  
6-4.抽气封口接头pumping stem: 8+Y+\XZG  
6-5.真空限流件limiting conductance:       IH;+pN  
6-6.过滤器filter: {xm^DT  
5.   1.一般术语 PKoB~wLH  
1-1真空镀膜vacuum coating: r@_`ob RW;  
1-2基片substrate: S C8r.  
1-3试验基片testing substrate: j5*W[M9W  
1-4镀膜材料coating material: .=WsB@+   
1-5蒸发材料evaporation material: 7|A9  
1-6溅射材料sputtering material: HWFI6N  
1-7膜层材料(膜层材质)film material: By|y:  
1-8蒸发速率evaporation rate: OY'490  
1-9溅射速率sputtering rate: @$R[Js%MuO  
1-10沉积速率deposition rate: -r9G5Z!|n  
1-11镀膜角度coating angle: o2cZ  
2Uf}gG)  
2.工艺 C3Mr)  
2-1真空蒸膜vacuum evaporation coating: uTN mt]  
(1).同时蒸发simultaneous evaporation: U"} ml  
(2).蒸发场蒸发evaporation field evaporation: "o +" Jd  
(3).反应性真空蒸发reactive vacuum evaporation: #`tn:cP  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: KGCm@oy  
(5).直接加热的蒸发direct heating evaporation: x)M=_u2 _  
(6).感应加热蒸发induced heating evaporation: K)|#FRPM u  
(7).电子束蒸发electron beam evaporation: %4:tRF  
(8).激光束蒸发laser beam evaporation: s6k,'`.  
(9).间接加热的蒸发indirect heating evaporation: eMPk k=V  
(10).闪蒸flash evaportion: %,u_ `P  
2-2真空溅射vacuum sputtering: YYrXLt:  
(1).反应性真空溅射 reactive vacuum sputtering: ,LjB%f[  
(2).偏压溅射bias sputtering: Is~bA_- ;  
(3).直流二级溅射direct current diode sputtering: @\,WJmW  
(4).非对称性交流溅射asymmtric alternate current sputtering: q' };.tv  
(5).高频二极溅射high frequency diode sputtering: d($f8{~W  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ='1J&w~7  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 4qtjP8Zv[  
(8).离子束溅射ion beam sputtering: RW!D! ~  
(9).辉光放电清洗glow discharge cleaning: -ec ~~95  
2-3物理气相沉积PVD physical vapor deposition: @Oe!*|?mS  
2-4化学气相沉积CVD chemical vapor deposition: JO:40V?op  
2-5磁控溅射magnetron sputtering: OO.. Y  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: U88-K1G  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: ,Mf@I5?  
2-8电弧离子镀arc discharge deposition: !br0s(|  
S$q:hXZ#e  
3.专用部件 g:/l5~b  
3-1镀膜室coating chamber: .aWEXJ  
3-2蒸发器装置evaporator device: sidSY8j  
3-3蒸发器evaporator: _@3?yv~ D  
3-4直接加热式蒸发器evaporator by direct heat: ,^ MA,"8  
3-5间接加热式蒸发器evaporator by indirect heat: B mq7w,L.  
3-7溅射装置sputtering device: L^:+8g  
3-8靶target: PJu)%al  
3-10时控挡板timing shutter: {6YLiQ*_  
3-11掩膜mask: X%7Y\|  
3-12基片支架substrate holder: xX l^\?HC  
3-13夹紧装置clamp: Ug=8:a(U.  
3-14换向装置reversing device: k~WX6rEJ  
3-15基片加热装置substrate heating device: 5?),6o);  
3-16基片冷却装置substrate colding device: riqvv1Nce  
wrq0fHwM  
4.真空镀膜设备 V.Pb AN  
4-1真空镀膜设备vacuum coating plant: M$L1!o1Xf  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: "=I ioY  
(2).真空溅射镀膜设备vacuum sputtering coating plant: '`^<*;w  
4-2连续镀膜设备continuous coating plant: L*tn>AO  
4-3半连续镀膜设备semi- continuous coating plant T_CYSS|fX  
6.   1.漏孔  ]qCAog  
1-1漏孔leaks: :(EU\yCzK  
1-2通道漏孔channel leak: |,F/_    
1-3薄膜漏孔membrane leak: W!g'*L/#L  
1-4分子漏孔molecular leak: L- [<C/`;t  
1-5粘滞漏孔vixcous leak: cCN[c)[c|  
1-6校准漏孔calibrated leak: ckRWVw   
1-7标准漏孔reference leak : Two$wL/  
1-8虚漏virtual leak: 6P;JF%{J  
1-9漏率leak rate: P`wp`HI  
1-10标准空气漏率standard air leak rate: e$|g  
1-11等值标准空气漏率equivalent standard air leak rate: IbAGnl{  
1-12探索(示漏)气体: v|~ yIywf  
Hs<vCL \  
2.本底 b`E'MX_ m  
2-1本底background: az3rK4g  
2-2探索气体本底search gas background : RWf4Wh?d  
2-3漂移drift: n'ft@7>%h  
2-4噪声noise: 5S:#I5Wa  
@qH{;  
3.检漏仪 ;bq_Y/"  
3-1检漏仪leak detector: rgheq<B:  
3-2高频火花检漏仪H.F. spark leak detector: aloP@U/\Sn  
3-3卤素检漏仪halide leak detector: Pb=J4Lvz(d  
3-4氦质谱检漏仪helium mass spectrometer leak detector: Dt\F]\6sd  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: uZ*;%y nQ  
O$+J{@  
4.检漏 jI0gQ [  
4-1气泡检漏leak detection by bubbles: C#X|U2$  
4-2氨检漏leak detection by ammonia: gl-O"%rMcL  
4-3升压检漏leak detection of rise pressure: 'VCF{0{H~  
4-4放射性同位素检漏radioactive isotope leak detection: hh`7b,+ 4  
4-5荧光检漏fluorescence leak detection '~A~gK0  
7.   1.一般术语 NK'awv),pM  
1-1真空干燥vacuum drying: y)?Sn  
1-2冷冻干燥freeze drying : lCg'K(|"  
1-3物料material: ?cf9q@eAH  
1-4待干燥物料material to be dried: rmutw~nHD  
1-5干燥物料dried material : [_ESR/&N  
1-6湿气moisture;humidity: 4)ez0[i$X  
1-7自由湿气free moisture: "#^11o8  
1-8结合湿气bound moisture: ) 2C`;\/:  
1-9分湿气partial moisture: \'6hv>W@  
1-10含湿量moisture content: !]7r>NS>  
1-11初始含湿量initial moisture content: BKe~ y  
1-12最终含湿量final residual moisture: VqLqj$P  
1-13湿度degree of moisture ,degree of humidity : /qA\|'~  
1-14干燥物质dry matter : k2muHKBlk  
1-15干燥物质含量content of dry matter: 37Vs9w  
d4F3!*@(  
2.干燥工艺 :Zl@4}  
2-1干燥阶段stages of drying : _M= \s>;G  
(1).预干燥preliminary dry: a=\r~Z7E  
(2).一次干燥(广义)primary drying(in general): 7*]O]6rP  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): z/aZD\[_  
(4).二次干燥secondary drying: 5Og.:4  
2-2.(1).接触干燥contact drying: oVyOiWo\Z  
(2).辐射干燥 drying by radiation : .<j\"X(  
(3).微波干燥microwave drying: v)>R)bzqe  
(4).气相干燥vapor phase drying: w N9I )hB  
(5).静态干燥static drying: jHq.W95+P  
(6).动态干燥dynamic drying: eS9uKb5n(  
2-3干燥时间drying time: Q1?  !,a  
2-4停留时间length of stay(in the drying chamber): H->J.5~,K  
2-5循环时间cycle time: wB}s>o\  
2-6干燥率 dessication ratio : Vr0-evwfo  
2-7去湿速率mass flow rate of humidity: > !k  
2-8单位面积去湿速率mass flow rate of humidity per surface area: ,cD(s(6+  
2-9干燥速度 drying speed : E$dPu  
2-10干燥过程drying process: 4JSf t t  
2-11加热温度heating temperature: >QV=q`I  
2-12干燥温度temperature of the material being dried :  +T02AS  
2-13干燥损失loss of material during the drying process : #x! h BS!  
2-14飞尘lift off (particles): -t2bHhG  
2-15堆层厚度thickness of the material: S*<+vIo  
={y Mk  
3.冷冻干燥 4`Qu+&4J  
3-1冷冻freezing: W3K?K-  
(1).静态冷冻static freezing: OI</o0Ca  
(2).动态冷冻dynamic freezing: e>\[OwF-x  
(3).离心冷冻centrifugal freezing: V(n7hpS  
(4).滚动冷冻shell freezing: Qvt  
(5).旋转冷冻spin-freezing: +x$GwX  
(6).真空旋转冷冻vacuum spin-freezing: qV2aa9p+  
(7).喷雾冷冻spray freezing: yUcWX bT@  
(8).气流冷冻air blast freezing: eSNi6RvE  
3-2冷冻速率rate of freezing: r=l hYn  
3-3冷冻物料frozen material: v1wMXOR  
3-4冰核ice core: R@Ch3l@  
3-5干燥物料外壳envelope of dried matter: .jW+\mIX  
3-6升华表面sublimation front: IF-g %  
3-7融化位置freezer burn: L5 ~wX  
udYk 6  
4.真空干燥设备;真空冷冻干燥设备 }cuU5WQ?%  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ~ _R 8; b  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: bC{1LY0  
4-3加热表面heating surface:  >sk vg  
4-4物品装载面shelf : C,$$bmS =  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): V*HkF T  
4-6单位面积干燥器处理能力throughput per shelf area: T@0\z1,~S  
4-7冰冷凝器ice condenser: MBZ/Pzl~  
4-8冰冷凝器的负载load of the ice condenser: ]/>(C76  
4-9冰冷凝器的额定负载rated load of the ice condenser DY| s |:d  
8.   1.一般术语 AB92R/  
1-1试样sample : M-Gl".*f  
(1).表面层surface layer: 5{ ?J5  
(2).真实表面true surface: 2 )oT\m  
(3).有效表面积effective surface area: QEo i9@3  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: M{:}.H<a  
(5).表面粒子密度surface particle density: !Wn^B|  
(6).单分子层monolayer: i!5zHn  
(7).表面单分子层粒子密度monolayer density: \!D<u'n  
(8).覆盖系数coverage ratio: ghtvAG  
1-2激发excitation: 6Ap-J~4  
(1).一次粒子primary particle: {akSK  
(2).一次粒子通量primary particle flux: .URCuB\{  
(3).一次粒子通量密度density of primary particle flux: xx[XwN;  
(4).一次粒子负荷primary particle load: ~wtl\-cY  
(5).一次粒子积分负荷integral load of primary particle: JRfG]u6GU  
(6).一次粒子的入射能量energy of the incident primary particle: rt-^?2c?  
(7).激发体积excited volume: -L=aZPW`M  
(8).激发面积excited area: $mf Z{  
(9).激发深度excited death: !>gi9z,  
(10).二次粒子secondary particles: K1i@.`na/$  
(11).二次粒子通量secondary particle flux: a B(_ZX'L  
(12).二次粒子发射能energy of the emitted secondary particles: w<}kY|A"=-  
(13).发射体积emitting volume: Z]U"i1lA  
(14).发射面积emitting area: }.bhsy  
(15).发射深度emitting depth: X6hm,0[  
(16).信息深度information depth: )bCw~'h*  
(17).平均信息深度mean information depth: @K{1O|V  
1-3入射角angle of incidence: NF9fPAF%;  
1-4发射角angle of emission: [1Cs  
1-5观测角observation: BCy# Td  
1-6分析表面积analyzed surface area: xw[KP [(  
1-7产额 yield : ]Dj,8tf`H  
1-8表面层微小损伤分析minimum damage surface analysis: :xqhPr]e  
1-9表面层无损伤分析non-destructive surface analysis: UEkn@^&bg  
1-10断面深度分析 profile analysis in depth; depth profile analysis : K9\p=H^T7  
1-11可观测面积observable area: |%p;4b  
1-12可观测立体角observable solid angle : tb#9TF  
1-13接受立体角;观测立体角angle of acceptance: oll J#i9  
1-14角分辨能力angular resolving power: Tvdg:[V<  
1-15发光度luminosity: # !:u*1  
1-16二次粒子探测比detection ratio of secondary particles: E]T>m!6  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: $hND!T+;  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: T'W)RYnwl  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: e,*E`ol  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: v2Lx4:dzi  
1-21本底压力base pressure: H] i.\2z  
1-22工作压力working pressure: 2L\}  
d2cslD d  
2.分析方法 G)<NzZo  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: e u{  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : (T&rvE  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: >"Tivc5  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: }bkQr)us  
2-3离子散射表面分析ion scattering spectroscopy: h!@t8R  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: mI$<+S1!  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: r .&<~x  
2-6离子散射谱仪ion scattering spectrometer: c4\Nuy  
2-7俄歇效应Auger process: W>^WNo3YQ$  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: WD`z\{hcom  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: no~Yet+<"  
2-10光电子谱术photoelectron spectroscopy : OD;-0Bj  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: E;I'b:U`  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: `1O<UJX  
2-11光电子谱仪photoelectron spectrometer: U"SH fI:  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: `B1r+uTP~  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: DL*/hbG  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): QB3vp4pBg@  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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