首页 -> 登录 -> 注册 -> 回复主题 -> 发表主题
光行天下 -> 光学薄膜设计,工艺与设备 -> 真空术语全集 [点此返回论坛查看本帖完整版本] [打印本页]

cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 2J)74SeH  
--------------------------------------------------- }}s8D>;G~  
真空术语 ckAsGF_B~!  
Pf{`/UlD  
1.标准环境条件 standard ambient condition: Esb ?U|F4  
2.气体的标准状态 standard reference conditions forgases: QTeFR&q8  
3.压力(压强)p pressure: mZ~mf->%  
4.帕斯卡Pa pascal: yV8-  
5.托Torr torr: kAY@^vi  
6.标准大气压atm standard atmosphere: z2.*#xTZn  
7.毫巴mbar millibar: w[e0wh`.  
8.分压力 partial pressure: 9e-*JYF]C  
9.全压力 total pressure: jT{f<P0  
10.真空 vacuum: tK*%8I\s  
11.真空度 degree of vacuum: UBL(Nr  
12.真空区域 ranges of vacuum: >1m)%zt  
13.气体 gas: )-)ss"\+Ju  
14.非可凝气体 non-condensable gas: (LRNU)vD7$  
15.蒸汽vapor: o*-h%Z.  
16.饱和蒸汽压saturation vapor pressure: &|s+KP|d  
17.饱和度degree of saturation: \y[Bu^tk  
18.饱和蒸汽saturated vapor: uXjoGcW  
19.未饱和蒸汽unsaturated vapor: 3Ca \`m)l  
20.分子数密度n,m-3 number density of molecules: +g)_4fV0|  
21.平均自由程ι、λ,m mean free path: wH+FFXGJs  
22.碰撞率ψ collision rate: fE'-.nA+  
23.体积碰撞率χ volume collision rate: Ft)t`E'%j  
24.气体量G quantity of gas: HE*7\"9  
25.气体的扩散 diffusion of gas: @k_Jl>X  
26.扩散系数D diffusion coefficient; diffusivity: } /[_  
27.粘滞流 viscous flow: 7t ZW^dF  
28.粘滞系数η viscous factor: 4[2=L9MIo~  
29.泊肖叶流 poiseuille flow: ?]s%(R,B5  
30.中间流 intermediate flow: -)4uYK*  
31.分子流 molecular flow: U)u\1AV5  
32克努曾数 number of knudsen: ;R/k2^uF  
33.分子泻流 molecular effusion; effusive flow: W\&WS"=~  
34.流逸 transpiration: dVPq%[J2  
35.热流逸 thermal transpiration:  CEbzJ   
36.分子流率qN molecular flow rate; molecular flux: d&NCFx  
37.分子流率密度 molecular flow rate density; density of molecular flux: SAd 97A:  
38.质量流率qm mass flow rare: ;,<r|.6U  
39.流量qG throughput of gas: K5 5} Wi  
40.体积流率qV volume flow rate: wEBtre7  
41.摩尔流率qυ molar flow rate: @YEw^J~  
42.麦克斯韦速度分布 maxwellian velocity distribution: "kcpA#uD|  
43.传输几率Pc transmission probability: u+I3IdU3  
44.分子流导CN,UN molecular conductance: BPwI8\V  
45.流导C,U conductance: f0/jwfL  
46.固有流导Ci,Ui intrinsic conductance: NS7@8 #C  
47.流阻W resistance: +R2^* *<  
48.吸附 sorption: h9w@oRp`~  
49.表面吸附 adsorption: BO?mQu~  
50.物理吸附physisorption: mGt\7&`  
51.化学吸附 chemisorption: 0q:(-z\S4  
52.吸收absorption: !S~,> ,yd  
53.适应系数α accommodation factor: bc `UA  
54.入射率υ impingement rate: hZp=BM"bJ  
55.凝结率condensation rate: <^CYxy  
56.粘着率 sticking rate: m Y$nI -P  
57.粘着几率Ps sticking probability: di8W2cwz  
58.滞留时间τ residence time: ]]\)=F`n77  
59.迁移 migration: L{cK^ ,  
60.解吸 desorption: 8W19#?7>B  
61.去气 degassing: aSn0o_4bD  
62.放气 outgassing: rF Ko E%  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: [ED!J~lg8  
64.蒸发率 evaporation rate: [>b  '}4  
65.渗透 permeation: u&1j>`~qJ  
66.渗透率φ permeability: mgJShn8]  
67.渗透系数P permeability coefficient Am>_4  
2.   1.真空泵 vacuum pumps di-O*ug  
1-1.容积真空泵 positive displacement pump: b}ySZlmy  
⑴.气镇真空泵 gas ballast vacuum pump: w^ixMn~nLF  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: ]NaMZ  
⑶.干封真空泵 dry-sealed vacuum pump: ?R|fS*e2EB  
⑷.往复真空泵 piston vacuum pump: X)`(nj  
⑸.液环真空泵 liquid ring vacuum pump: &/B2)l6a  
⑹.旋片真空泵 sliding vane rotary vacuum pump: Y&?|k'7  
⑺.定片真空泵 rotary piston vacuum pump: mr:kn0  
⑻.滑阀真空泵 rotary plunger vacuum pump: 8vz_~p9%j  
⑼.余摆线真空泵 trochoidal vacuum pump: GOv9 2$e  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: w o-O_uZB  
⑾.罗茨真空泵 roots vacuum pump: pieU|?fQ  
1-2.动量传输泵 kinetic vacuum pump: ke3HK9P;  
⑴.牵引分子泵molecular drag pump: =q_&* '  
⑵.涡轮分子泵turbo molecular pump: n.2E8m/  
⑶.喷射真空泵ejector vacuum pump: iYO wB'z  
⑷.液体喷射真空泵liquid jet vacuum pump: 3R)cbwL  
⑸.气体喷射真空泵gas jet vacuum pump: t 3(%UB  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : N oX_?  
⑺.扩散泵diffusion pump : ?;0nJf  
⑻.自净化扩散泵self purifying diffusion pump: t x:rj6 -z  
⑼.分馏扩散泵 fractionating diffusion pump : /3)YWFZZc  
⑽.扩散喷射泵diffusion ejector pump : ATYQ6E[{MV  
⑾.离子传输泵ion transfer pump: * kX3sG$8  
1-3.捕集真空泵 entrapment vacuum pump: GN htnB  
⑴吸附泵adsorption pump: Ee t+  
⑵.吸气剂泵 getter pump: w5dI k]T  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : n:5O9,umZ  
⑷.吸气剂离子泵getter ion pump: jjS{q,bo  
⑸.蒸发离子泵 evaporation ion pump: m [g< K  
⑹.溅射离子泵sputter ion pump: ~pd1 )  
⑺.低温泵cryopump: jSeA %Te  
}S~ysQwT  
2.真空泵零部件 p|bc=`TD  
2-1.泵壳 pump case: 'k-u9  
2-2.入口 inlet: GL;x:2XA  
2-3.出口outlet: ; McIxvj  
2-4.旋片(滑片、滑阀)vane; blade : <?q&PCAn^  
2-5.排气阀discharge valve: nZ`2Z7!  
2-6.气镇阀gas ballast valve: L}e"nzTE6I  
2-7.膨胀室expansion chamber: 2fj0 I  
2-8.压缩室compression chamber: }5o~R~H  
2-9.真空泵油 vacuum pump oil: j=xtnIq  
2-10.泵液 pump fluid: 3<zTkI  
2-11.喷嘴 nozzle: 'f=)pc#&g  
2-13.喷嘴扩张率nozzle expansion rate: _V_8p)%  
2-14.喷嘴间隙面积 nozzle clearance area : 5UrXVdP  
2-15.喷嘴间隙nozzle clearance: fG8}=xH_&  
2-16.射流jet: 4pfix1F g  
2-17.扩散器diffuser: p:[`%<j0  
2-18.扩散器喉部diffuser thoat: 4! Oa4  
2-19.蒸汽导管vapor tube(pipe;chimney): ;+r)j"W  
2-20.喷嘴组件nozzle assembly: )AnlFO+V  
2-21.下裙skirt: )}k?r5g  
=M/ UHOY  
3.附件  =BqaGXr  
3-1阱trap: !OuTXa,I H  
⑴.冷阱 cold trap: lJ2|jFY9  
⑵.吸附阱sorption trap: O, ``\(P  
⑶.离子阱ion trap: s{"`=dKT  
⑷.冷冻升华阱 cryosublimation trap: 9z| >roNe  
3-2.挡板baffle: i">z8?qF  
3-3.油分离器oil separator: 4PO%qO  
3-4.油净化器oil purifier: ga{25q}"  
3-5.冷凝器condenser: A/$KA'jX  
|7S4;  
4.泵按工作分类 ~q8V<@?  
4-1.主泵main pump: #U!(I#^3  
4-2.粗抽泵roughing vacuum pump: (:fE _H2z  
4-3.前级真空泵backing vacuum pump: Y6;0khp  
4-4.粗(低)真空泵 roughing(low)vacuum pump: A<YZBR_  
4-5.维持真空泵holding vacuum pump: D)O6| DiO  
4-6.高真空泵high vacuum pump: Zeme`/aBb  
4-7.超高真空泵ultra-high vacuum pump: l# !@{ <  
4-8.增压真空泵booster vacuum pump: {x&jh|f`g  
!dbA (  
5.真空泵特性 +]S;U&vQ  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: -h G 9  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 (AM,4)lW,  
5-3.起动压力starting pressure: m mJ)m  
5-4.前级压力 backing pressure : SVg@xu+  
5-5.临界前级压力 critical backing pressure: Z+``/Q]>+  
5-6.最大前级压力maximum backing pressure: g<hv7?"[  
5-7.最大工作压力maximum working pressure: bn*{*=(|  
5-8.真空泵的极限压力ultimate pressure of a pump:  &aevR^f+  
5-9.压缩比compression ratio: f1]AfH#  
5-10.何氏系数Ho coefficient: zNsL^;uT  
5-11.抽速系数speed factor: cT>z  
5-12.气体的反扩散back-diffusion of gas: WfTdD.Xx  
5-13.泵液返流back-streaming of pump fluid: a_pCjG89  
5-14.返流率back-streaming rate F"m}mf  
5-15.返迁移back-migration: F;MT4*4  
5-16.爆腾bumping: 'a-5 U TT  
5-17.水蒸气允许量qm water vapor tolerable load: t0asW5f  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: )HzITsFZKT  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: Pv2nV!X6  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump Z z; <P  
3.   1.一般术语 '#4mDz~  
1-1.压力计pressure gauge: P2 K>|r  
1-2.真空计vacuum gauge: zFdz]z3  
⑴.规头(规管)gauge head: m|ERf2-  
⑵.裸规nude gauge : /H;kYx  
⑶.真空计控制单元gauge control unit : l6`d48U  
⑷.真空计指示单元gauge indicating unit : E!}-qbH^  
}%>$}4 ,  
2.真空计一般分类  +s R *d  
2-1.压差式真空计differential vacuum gauge: >nIcF m  
2-2.绝对真空计 absolute vacuum gauge: 8v)~J}[Bz  
2-3.全压真空计total pressure vacuum gauge: ^pQ;0[9Y0  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: "PX3%II  
2-5.相对真空计relative vacuum gauge : 2GD mZl  
tFST.yT>zg  
3.真空计特性 /<?X-IDz.{  
3-1.真空计测量范围pressure range of vacuum gauge: xZ @O"*{  
3-2.灵敏度系数sensitivity coefficient: 8F\Msx  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): S~a:1 _Wl  
3-5.规管光电流photon current of vacuum gauge head: FvI0 J  
3-6.等效氮压力equivalent nitrogen pressure : HyX4ob[X  
3-7.X射线极限值 X-ray limit: t!=~5YgKs  
3-8.逆X射线效应anti X-ray effect: |7'yk__m  
3-9.布利尔斯效应blears effect: oIL+@}u7  
v/TlXxfil  
4.全压真空计 E=1/  
4-1.液位压力计liquid level manometer: #PLB$$  
4-2.弹性元件真空计elastic element vacuum gauge: D 917[ <$  
4-3.压缩式真空计compression gauge: SE}RP3dF!  
4-4.压力天平pressure balance: \I,Dje/:w  
4-5.粘滞性真空计viscosity gauge : /DG`Hg  
4-6.热传导真空计thermal conductivity vacuum gauge : N13;hB<  
4-7.热分子真空计thermo-molecular gauge: 2wuW5H8w{  
4-8.电离真空计ionization vacuum gauge: jQ\ MB  
4-9.放射性电离真空计radioactive ionization gauge: ]BQWA  
4-10.冷阴极电离真空计cold cathode ionization gauge: ^1Zq0  
4-11.潘宁真空计penning gauge: /glnJ3   
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: E5[]eg~w%{  
4-13.放电管指示器discharge tube indicator: b5 C}K  
4-14.热阴极电离真空计hot cathode ionization gauge: uuK]<h*  
4-15.三极管式真空计triode gauge: io?{ew  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: z.9FDQLp  
4-17.B-A型电离真空计Bayard-Alpert gauge: \PMKmJ X0O  
4-18.调制型电离真空计modulator gauge: M Xt +  
4-19.抑制型电离真空计suppressor gauge: PN^1  
4-20.分离型电离真空计extractor gauge: dZiWVa  
4-21.弯注型电离真空计bent beam gauge: :-W CW);N  
4-22.弹道型电离真空计 orbitron gauge : ZRq}g:  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: CT:eV7<>s  
QGz3id6  
5.分压真空计(分压分析器) M>H^<N}'A  
5-1.射频质谱仪radio frequency mass spectrometer: [U7,\o4w  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ^s2-jkK  
5-3.单极质谱仪momopole mass spectrometer: D%Jc?6/I#3  
5-4.双聚焦质谱仪double focusing mass spectrometer: ,N|R/Vk$+E  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: tG ^?fc  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: yb.|7U?/x  
5-7.回旋质谱仪omegatron mass spectrometer: D*r Zaqy  
5-8.飞行时间质谱仪time of flight mass spectrometer: ![hhPYmV  
79B`w #  
6.真空计校准 t5v)6|  
6-1.标准真空计reference gauges: s1vYZ  
6-2.校准系统system of calibration: *0@; kD=  
6-3.校准系数K calibration coefficient: A8Z?[,Mq!  
6-4.压缩计法meleod gauge method: (kNTXhAr4  
6-5.膨胀法expansion method: BaTOh'52  
6-6.流导法flow method: jc~*#\N  
4.   1.真空系统vacuum system -[7,ph  
1-1.真空机组pump system: -5_xI)i  
1-2.有油真空机组pump system used oil : TN@JPoH  
1-3.无油真空机组oil free pump system pW^ ?g|_}  
1-4.连续处理真空设备continuous treatment vacuum plant: M j%|'dZz  
1-5.闸门式真空系统vacuum system with an air-lock: QDT{Xg* I  
1-6.压差真空系统differentially pumped vacuum system: \C2P{q/m  
1-7.进气系统gas admittance system: x7kg_`\U  
.,K?\WZ  
2.真空系统特性参量 !#gE'(J;c  
2-1.抽气装置的抽速volume flow rate of a pumping unit : kt0{-\ p  
2-2.抽气装置的抽气量throughput of a pumping unit : Y {|~A  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: M"l rwun^  
2-4.真空系统的漏气速率leak throughput of a vacuum system: R^kv!x;h  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: ggsi`Z{j?  
2-6.极限压力ultimate pressure: 4e\`zy  
2-7.残余压力residual pressure: TvG:T{jwy  
2-8.残余气体谱residual gas spectrum: '\E{qlI  
2-9.基础压力base pressure: svRaU7<UDN  
2-10.工作压力working pressure: ,u^0V"hJ  
2-11.粗抽时间roughing time: A*U'SCg(G  
2-12.抽气时间pump-down time: V42*4hskL  
2-13.真空系统时间常数time constant of a vacuum system: eh/OCzWH  
2-14.真空系统进气时间venting time: f4y;K>u7p  
z'D{:q  
3.真空容器 WHLKf  
3-1.真空容器;真空室vacuum chamber: Y[]+C8"O  
3-2.封离真空装置sealed vacuum device: .%b_3s".  
3-3.真空钟罩vacuum bell jar: x,G6`|Hl  
3-4.真空容器底板vacuum base plate: 7-g4S]r<  
3-5.真空岐管vacuum manifold: U7%pOpO!  
3-6.前级真空容器(贮气罐)backing reservoir: GaqG 8% .  
3-7.真空保护层outer chamber: TaO;r=2  
3-8.真空闸室vacuum air lock: vFC=qLz:  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: 207oE O]  
D2 cIVx3:(  
4.真空封接和真空引入线 2(J tD  
4-1.永久性真空封接permanent seal : LP6FSo~K  
4.2.玻璃分级过渡封接graded seal : m`q> _*  
4-3.压缩玻璃金属封接compression glass-to-metal seal: ;/3/R/^g  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: CuO*>g^K[  
4-5.陶瓷金属封接ceramic-to-metal seal: 9<c4y4#y  
4-6.半永久性真空封接semi-permanent seal : v4~Xv5|w^F  
4-7.可拆卸的真空封接demountable joint:  n(xlad  
4-8.液体真空封接liquid seal =usDI<3r  
4-9.熔融金属真空封接molten metal seal: lBZ*G  
4-10.研磨面搭接封接ground and lapped seal: (NN14  
4-11.真空法兰连接vacuum flange connection: U`_vF~el~  
4-12.真空密封垫vacuum-tight gasket: ER0#$yFpM  
4-13.真空密封圈ring gasket: Wc>)/y5$  
4-14.真空平密封垫flat gasket: mg/kyua^  
4-15.真空引入线feedthrough leadthrough: .ehvhMuG|  
4-16.真空轴密封shaft seal: VCRv(Ek  
4-17.真空窗vacuum window: FtDA k?  
4-18.观察窗viewing window: |aJ6363f.  
Ic!83-  
5.真空阀门 Qf(e'e  
5-1.真空阀门的特性characteristic of vacuum valves: 0BE^qe  
⑴.真空阀门的流导conductance of vacuum valves: nKkTnTSa  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: { (,vm}iFL  
5-2.真空调节阀regulating valve: G6VHl:e7z  
5-3.微调阀 micro-adjustable valve: TN aff  
5-4.充气阀charge valve: '[8jm=Q#'  
5-5.进气阀gas admittance valve: =e{KtX.  
5-6.真空截止阀break valve: B4&pBiG&f6  
5-7.前级真空阀backing valve: ''Ec-b6Q-  
5-8.旁通阀 by-pass valve: qk1D#1vl  
5-9.主真空阀main vacuum valve: !Qa7-  
5-10.低真空阀low vacuum valve: |o) _=Fx  
5-11.高真空阀high vacuum valve: 'X<uG x  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: >*xzSd? \  
5-13.手动阀manually operated valve: J c^ozw  
5-14.气动阀pneumatically operated valve: x99 Oq!  
5-15.电磁阀electromagnetically operated valve: Vn;] ''_  
5-16.电动阀valve with electrically motorized operation: *sVxjZvV  
5-17.挡板阀baffle valve: wh+ibH}@!  
5-18.翻板阀flap valve: IOqyqt'  
5-19.插板阀gate valve: pT$AdvI]  
5-20.蝶阀butterfly valve: :#jv4N  
=@XR$Uud6  
6.真空管路 o}Np}PE6  
6-1.粗抽管路roughing line: %$ ?Q%  
6-2.前级真空管路backing line: 1M+!cX  
6-3.旁通管路;By-Pass管路 by-pass line: RUh{^3;~  
6-4.抽气封口接头pumping stem: u5M{s;{11r  
6-5.真空限流件limiting conductance:       J"|$V#  
6-6.过滤器filter: UF&Wgj [  
5.   1.一般术语 |JQKxvjT  
1-1真空镀膜vacuum coating: .e#j#tQp  
1-2基片substrate: ^- Ji]5~  
1-3试验基片testing substrate: L$Z_j()2  
1-4镀膜材料coating material: zZiVBUmE<  
1-5蒸发材料evaporation material: h9nCSj  
1-6溅射材料sputtering material: Av]N.HB$  
1-7膜层材料(膜层材质)film material: x^BBK'  
1-8蒸发速率evaporation rate: I!'(>VlP7  
1-9溅射速率sputtering rate: SX;IUvVE5  
1-10沉积速率deposition rate: !W^II>Y  
1-11镀膜角度coating angle: x%&V!L  
vdzC2T  
2.工艺 }cmL{S  
2-1真空蒸膜vacuum evaporation coating: r:-WfDz.  
(1).同时蒸发simultaneous evaporation: Big-)7?  
(2).蒸发场蒸发evaporation field evaporation: p?nVPTh  
(3).反应性真空蒸发reactive vacuum evaporation: QLl44*@  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: SUhP e+  
(5).直接加热的蒸发direct heating evaporation: P 'k39  
(6).感应加热蒸发induced heating evaporation: i+3b)xtW7  
(7).电子束蒸发electron beam evaporation: o*'3N/D~  
(8).激光束蒸发laser beam evaporation: k{62UaL.  
(9).间接加热的蒸发indirect heating evaporation: ~'iuh>O)  
(10).闪蒸flash evaportion: DLZ63'  
2-2真空溅射vacuum sputtering: 2&#iHv  
(1).反应性真空溅射 reactive vacuum sputtering: g'E^@1{  
(2).偏压溅射bias sputtering: 9x< 8(]\  
(3).直流二级溅射direct current diode sputtering: ElxbHQj6  
(4).非对称性交流溅射asymmtric alternate current sputtering: 2c]O Mtk  
(5).高频二极溅射high frequency diode sputtering: E;0"1 P|S  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 0@;E8^pa  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: c7_b^7h1  
(8).离子束溅射ion beam sputtering: ,3u19>2  
(9).辉光放电清洗glow discharge cleaning: P6rL;_~e  
2-3物理气相沉积PVD physical vapor deposition: 4r$t}t gX  
2-4化学气相沉积CVD chemical vapor deposition: T^t`H p  
2-5磁控溅射magnetron sputtering: F!8425oAw  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: )DMbO"7  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: (aLnbJeJ  
2-8电弧离子镀arc discharge deposition: 2e &Zs%u  
FliN@RNo  
3.专用部件 4 @h6|=  
3-1镀膜室coating chamber: uIBV1Qz  
3-2蒸发器装置evaporator device: S1JB]\  
3-3蒸发器evaporator: V qf}(3K0  
3-4直接加热式蒸发器evaporator by direct heat: M Cz3RZK  
3-5间接加热式蒸发器evaporator by indirect heat: @*dA<N.9  
3-7溅射装置sputtering device: WJWhx4Hk  
3-8靶target: 7 m%|TwJN  
3-10时控挡板timing shutter: i7_BnJJX{B  
3-11掩膜mask: j43HSY7@  
3-12基片支架substrate holder: 0vEa]ljS  
3-13夹紧装置clamp: j*nCIxF  
3-14换向装置reversing device: klKt^h-  
3-15基片加热装置substrate heating device: l8Ox]%F  
3-16基片冷却装置substrate colding device: h2 y@xnn  
@EvnV.  
4.真空镀膜设备 #PGExN3e  
4-1真空镀膜设备vacuum coating plant: EP @=i  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: <JlKtR&nSo  
(2).真空溅射镀膜设备vacuum sputtering coating plant: X$<?:f-  
4-2连续镀膜设备continuous coating plant: $xqphhBg  
4-3半连续镀膜设备semi- continuous coating plant <GC:aG  
6.   1.漏孔 (1R,   
1-1漏孔leaks: zKZ6Qjd8!  
1-2通道漏孔channel leak: WA+v&* ]  
1-3薄膜漏孔membrane leak: (fl2?d5+C  
1-4分子漏孔molecular leak: g6S8@b))|  
1-5粘滞漏孔vixcous leak: 3e"G.0vJ  
1-6校准漏孔calibrated leak: Ty5\zxC|  
1-7标准漏孔reference leak : /<5/gV 1Q  
1-8虚漏virtual leak: @/~41\=e  
1-9漏率leak rate: h&XyMm9C  
1-10标准空气漏率standard air leak rate: N4r`czoj  
1-11等值标准空气漏率equivalent standard air leak rate: !&X}? NK  
1-12探索(示漏)气体: na~ r}7 7o  
`8Gwf;P1  
2.本底 ,PnEDQ|l  
2-1本底background: !#3R<bW`R8  
2-2探索气体本底search gas background : [@(zGb8  
2-3漂移drift: ky*-_  
2-4噪声noise: kZ2+=/DYN  
YVzK$k'3U  
3.检漏仪 H7WKnn@  
3-1检漏仪leak detector: M@.1P<:h  
3-2高频火花检漏仪H.F. spark leak detector: }=++Lr4*  
3-3卤素检漏仪halide leak detector: 5s0H4?S  
3-4氦质谱检漏仪helium mass spectrometer leak detector: edm&,ph]  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: X|b~,X%N  
h/X),aK3  
4.检漏 _)ERi*}x8  
4-1气泡检漏leak detection by bubbles: n1v%S"^  
4-2氨检漏leak detection by ammonia: y|X[NSA  
4-3升压检漏leak detection of rise pressure: %'P58  
4-4放射性同位素检漏radioactive isotope leak detection: ?qdG)jo=  
4-5荧光检漏fluorescence leak detection [scPs,5Y  
7.   1.一般术语 K[sfsWQ.  
1-1真空干燥vacuum drying: h><;TAp  
1-2冷冻干燥freeze drying : \KG{ 11  
1-3物料material: :R _(+EK1  
1-4待干燥物料material to be dried: R+5x:mpHy  
1-5干燥物料dried material : X(/W|RY{@  
1-6湿气moisture;humidity: \jC}>9  
1-7自由湿气free moisture: ~;{)S}U@R  
1-8结合湿气bound moisture: ,cS|fG  
1-9分湿气partial moisture: 0L|A  
1-10含湿量moisture content: g5H+2lSC  
1-11初始含湿量initial moisture content: Lq yY??\@  
1-12最终含湿量final residual moisture: {&3n{XrF(  
1-13湿度degree of moisture ,degree of humidity : kfn5y#6NZ  
1-14干燥物质dry matter : )@Ly{cw   
1-15干燥物质含量content of dry matter: z[vMO%  
Rj-<tR{  
2.干燥工艺 G|.>p<q   
2-1干燥阶段stages of drying : &K}!R$[,:P  
(1).预干燥preliminary dry: 9c<lFZb;  
(2).一次干燥(广义)primary drying(in general): )t =Cj?5  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): ,1od]]>(O  
(4).二次干燥secondary drying: RXh/[t+  
2-2.(1).接触干燥contact drying: 4"0`J  
(2).辐射干燥 drying by radiation : IGVNX2  
(3).微波干燥microwave drying: JVU:`BH  
(4).气相干燥vapor phase drying: 2 rne=L  
(5).静态干燥static drying: .0nL; o  
(6).动态干燥dynamic drying: z!eY=G'  
2-3干燥时间drying time: 0F)Y[{h<  
2-4停留时间length of stay(in the drying chamber): 'Exj|Y&  
2-5循环时间cycle time: Q[S""P.Z|  
2-6干燥率 dessication ratio : 1S<V,9(  
2-7去湿速率mass flow rate of humidity: T0v;8E e  
2-8单位面积去湿速率mass flow rate of humidity per surface area: JhIgq W2  
2-9干燥速度 drying speed : oC"c%e8  
2-10干燥过程drying process: (`xhh  
2-11加热温度heating temperature: we!}"'E;  
2-12干燥温度temperature of the material being dried : Wn<3|`c  
2-13干燥损失loss of material during the drying process : ](:aDHa  
2-14飞尘lift off (particles): MJb!+E+  
2-15堆层厚度thickness of the material: m8fxDepFA  
]k5l]JB  
3.冷冻干燥 Ydh]EO0'  
3-1冷冻freezing: J)6f"{} &  
(1).静态冷冻static freezing: [<7Hy,xr_  
(2).动态冷冻dynamic freezing: |lrLTI^a  
(3).离心冷冻centrifugal freezing: -ZBk^p  
(4).滚动冷冻shell freezing: 8NWvi%g  
(5).旋转冷冻spin-freezing: YeK PoW  
(6).真空旋转冷冻vacuum spin-freezing: # KK>D?.:  
(7).喷雾冷冻spray freezing: +-1t]`9k4  
(8).气流冷冻air blast freezing: Q&rpW:^v  
3-2冷冻速率rate of freezing: t L}i%7  
3-3冷冻物料frozen material: H0_hQ:K   
3-4冰核ice core: kT t;3Ia  
3-5干燥物料外壳envelope of dried matter: dr'#  
3-6升华表面sublimation front: y7txIe!<5  
3-7融化位置freezer burn: 22)2o lU  
UF3WpA  
4.真空干燥设备;真空冷冻干燥设备 "JT R5;`w  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: (%D*S_m'  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: VD#`1g<  
4-3加热表面heating surface: C A VqjT7  
4-4物品装载面shelf : q ;1]M[&  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): xQT`sK+  
4-6单位面积干燥器处理能力throughput per shelf area: TU&gj1  
4-7冰冷凝器ice condenser: T}jryN;J5  
4-8冰冷凝器的负载load of the ice condenser: 615, P/  
4-9冰冷凝器的额定负载rated load of the ice condenser icOh/G=N;  
8.   1.一般术语 VnAJOR7lrx  
1-1试样sample : 3XjM@D  
(1).表面层surface layer: h/W@R_Y  
(2).真实表面true surface: `D6Bw=7  
(3).有效表面积effective surface area: X!Xl  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: UEbRg =6  
(5).表面粒子密度surface particle density: T.]+T[}!  
(6).单分子层monolayer: VQI  
(7).表面单分子层粒子密度monolayer density: OQIQ   
(8).覆盖系数coverage ratio: ~&8ag`  
1-2激发excitation: 6&5p3G{%0  
(1).一次粒子primary particle: TL lR"L5  
(2).一次粒子通量primary particle flux: n.Iu|,?q  
(3).一次粒子通量密度density of primary particle flux: c&vY0/ [  
(4).一次粒子负荷primary particle load: why;1z>V  
(5).一次粒子积分负荷integral load of primary particle: |#fqHON  
(6).一次粒子的入射能量energy of the incident primary particle: HdQd =q(  
(7).激发体积excited volume: SRuNt3wW6  
(8).激发面积excited area: Y; JV9{j  
(9).激发深度excited death: ,{!~rSq-l  
(10).二次粒子secondary particles: Q[O[,Rk  
(11).二次粒子通量secondary particle flux: `uo'w:Q  
(12).二次粒子发射能energy of the emitted secondary particles: #0V$KC*>  
(13).发射体积emitting volume: (P&~PJH  
(14).发射面积emitting area: yu"enA  
(15).发射深度emitting depth: {p@uH<)  
(16).信息深度information depth: [x Xa3W  
(17).平均信息深度mean information depth: ?~s,O$o  
1-3入射角angle of incidence: q'{LTg0kk  
1-4发射角angle of emission: i'aV=E5  
1-5观测角observation: ,R_ KLd  
1-6分析表面积analyzed surface area: /2Q@M>  
1-7产额 yield : !c,=%4Pb  
1-8表面层微小损伤分析minimum damage surface analysis: d#6'dKV$  
1-9表面层无损伤分析non-destructive surface analysis: /ZlPEs)  
1-10断面深度分析 profile analysis in depth; depth profile analysis : AdMA|!|:hc  
1-11可观测面积observable area: MdM^!sk&`  
1-12可观测立体角observable solid angle : oju)8H1o#  
1-13接受立体角;观测立体角angle of acceptance: /<,LM8n  
1-14角分辨能力angular resolving power: uH 1%diL^  
1-15发光度luminosity: #Ux*":  
1-16二次粒子探测比detection ratio of secondary particles: 0EiURVX  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: c]3% wL  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: ~7a(KJgvd"  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: {YnR]|0&  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: S3EM6`q'  
1-21本底压力base pressure: zG)XB*c  
1-22工作压力working pressure: |eH >55 b  
-v"\WmcS  
2.分析方法  mkH {%7n  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: C":i56  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : X-,scm  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: :KY920/,  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: ernZfd{H  
2-3离子散射表面分析ion scattering spectroscopy: {!h|(xqN+  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: evOy Tvc  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: T*YbmI]4  
2-6离子散射谱仪ion scattering spectrometer: >; a_i>[  
2-7俄歇效应Auger process: 1UG5Q-  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: &s m7R i  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: DL0jA/f  
2-10光电子谱术photoelectron spectroscopy : V}<Hx3!  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS:  =d07c  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: 1 ?X(q  
2-11光电子谱仪photoelectron spectrometer: .<ux Z  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: uLFnuK  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: TTB1}j+V6  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): IO/%X;Y_  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
查看本帖完整版本: [-- 真空术语全集 --] [-- top --]

Copyright © 2005-2025 光行天下 蜀ICP备06003254号-1 网站统计