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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 2:/'  
--------------------------------------------------- ZqkP# ]+Y'  
真空术语 bUp%87<*X  
@=b0>^\m  
1.标准环境条件 standard ambient condition: <0R7uH  
2.气体的标准状态 standard reference conditions forgases: FymA_Eq  
3.压力(压强)p pressure: =2)5_/9au  
4.帕斯卡Pa pascal: OcMd'fwO  
5.托Torr torr: #v')iR"  
6.标准大气压atm standard atmosphere: Yq#I# 2RD  
7.毫巴mbar millibar: }vxb, [#  
8.分压力 partial pressure: ~7b '4\  
9.全压力 total pressure: U{LDtn%@h6  
10.真空 vacuum: ]^&DEj{  
11.真空度 degree of vacuum: rr*",a"}m  
12.真空区域 ranges of vacuum: /[GOs*{zB  
13.气体 gas: ,u{d@U^)3@  
14.非可凝气体 non-condensable gas: [={pF q`  
15.蒸汽vapor: nV McHN   
16.饱和蒸汽压saturation vapor pressure: zV4%F"-  
17.饱和度degree of saturation: \h :Rw|  
18.饱和蒸汽saturated vapor: g 6>R yjN  
19.未饱和蒸汽unsaturated vapor: Q9 kKk  
20.分子数密度n,m-3 number density of molecules: + yS"pOT  
21.平均自由程ι、λ,m mean free path: Nt&}T  
22.碰撞率ψ collision rate:  -deY,%  
23.体积碰撞率χ volume collision rate: PFG):i-?  
24.气体量G quantity of gas: /+sn -$/"i  
25.气体的扩散 diffusion of gas: NV*aHci  
26.扩散系数D diffusion coefficient; diffusivity: xh @H@Q\  
27.粘滞流 viscous flow: >?b/_O  
28.粘滞系数η viscous factor: =@binTC4  
29.泊肖叶流 poiseuille flow: )(\5Wk9(  
30.中间流 intermediate flow: E[nWB"pxE  
31.分子流 molecular flow: @p|[7'  
32克努曾数 number of knudsen: 6}x^ T)R  
33.分子泻流 molecular effusion; effusive flow: }^?dK3~q  
34.流逸 transpiration: j"_V+)SD  
35.热流逸 thermal transpiration: 5xLuuKG  
36.分子流率qN molecular flow rate; molecular flux: 7SXi#{  
37.分子流率密度 molecular flow rate density; density of molecular flux: ?O\n!c  
38.质量流率qm mass flow rare: o&;+!Si@T  
39.流量qG throughput of gas: y$*Tbzp  
40.体积流率qV volume flow rate: z.]t_`KuF9  
41.摩尔流率qυ molar flow rate: ?_m;~>C  
42.麦克斯韦速度分布 maxwellian velocity distribution: z mrk`o~  
43.传输几率Pc transmission probability: &]pW##  
44.分子流导CN,UN molecular conductance: uMPJ  
45.流导C,U conductance: Nh]eZ3O  
46.固有流导Ci,Ui intrinsic conductance: (LTm!"Q  
47.流阻W resistance: M)I&^mm39  
48.吸附 sorption: eAu3,qoM  
49.表面吸附 adsorption: = Yh>5A  
50.物理吸附physisorption: HHWB_QaL  
51.化学吸附 chemisorption: ',kYZay  
52.吸收absorption: 3UD_2[aqN(  
53.适应系数α accommodation factor: I@+dE V`Lf  
54.入射率υ impingement rate: 0RYh4'=F  
55.凝结率condensation rate: <|hvH  
56.粘着率 sticking rate: WSi Utf|g  
57.粘着几率Ps sticking probability: ]8d]nftY  
58.滞留时间τ residence time: T9RR. ng  
59.迁移 migration: '"~|L>F%G  
60.解吸 desorption: hKQT,  
61.去气 degassing: K$ #(\-M  
62.放气 outgassing: %OfaBv&  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: o8 q@rwu3  
64.蒸发率 evaporation rate: '<>pz<c  
65.渗透 permeation: B\KvKT|\  
66.渗透率φ permeability: 7AV!v`  
67.渗透系数P permeability coefficient -AD3Pd|Y[  
2.   1.真空泵 vacuum pumps Xy_+L_h^  
1-1.容积真空泵 positive displacement pump: NLoJmOi;L7  
⑴.气镇真空泵 gas ballast vacuum pump: Eae]s8ek9  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: EtcAU}9  
⑶.干封真空泵 dry-sealed vacuum pump: @,i:fY  
⑷.往复真空泵 piston vacuum pump: ~-A5h(  
⑸.液环真空泵 liquid ring vacuum pump: x}AWWmXv  
⑹.旋片真空泵 sliding vane rotary vacuum pump: 6Nj\N oS  
⑺.定片真空泵 rotary piston vacuum pump: /XS}<!)%  
⑻.滑阀真空泵 rotary plunger vacuum pump: 1 q}iUnR  
⑼.余摆线真空泵 trochoidal vacuum pump: jNaK]  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: Q;)[~p  
⑾.罗茨真空泵 roots vacuum pump: \uQ(-ji  
1-2.动量传输泵 kinetic vacuum pump: Pqo"~&Y|~  
⑴.牵引分子泵molecular drag pump: -+Kx^V#'R  
⑵.涡轮分子泵turbo molecular pump: \[B5j0vV,  
⑶.喷射真空泵ejector vacuum pump: vtCt6M  
⑷.液体喷射真空泵liquid jet vacuum pump: [,8@oM#  
⑸.气体喷射真空泵gas jet vacuum pump: -% 5*c61  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : D;.-e  
⑺.扩散泵diffusion pump : ou6yi; l%  
⑻.自净化扩散泵self purifying diffusion pump: XBF#ILJ  
⑼.分馏扩散泵 fractionating diffusion pump : uPr@xff  
⑽.扩散喷射泵diffusion ejector pump : oa}-=hG  
⑾.离子传输泵ion transfer pump: L'H'E,  
1-3.捕集真空泵 entrapment vacuum pump: ucL}fnY1  
⑴吸附泵adsorption pump: U;`N:~|p#  
⑵.吸气剂泵 getter pump: crz )F"  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : (}V.xi  
⑷.吸气剂离子泵getter ion pump: QO[!  
⑸.蒸发离子泵 evaporation ion pump: eL0U5>#  
⑹.溅射离子泵sputter ion pump: vfK^^S  
⑺.低温泵cryopump: SBzJQt@Hs  
ltwX-   
2.真空泵零部件 -,uTAk0+@  
2-1.泵壳 pump case: 4sP0oe[h  
2-2.入口 inlet: i,8h B(M!  
2-3.出口outlet: ;;2XLkWu  
2-4.旋片(滑片、滑阀)vane; blade : ]p\7s  
2-5.排气阀discharge valve: z{]$WVs:^  
2-6.气镇阀gas ballast valve: b" 1a7   
2-7.膨胀室expansion chamber: (]w_}E]N  
2-8.压缩室compression chamber: iyB02\d  
2-9.真空泵油 vacuum pump oil: ~-.}]N+([  
2-10.泵液 pump fluid: dPc*!xrq  
2-11.喷嘴 nozzle: f<=<:+  
2-13.喷嘴扩张率nozzle expansion rate: s+#gH@c  
2-14.喷嘴间隙面积 nozzle clearance area : P6u9Ngay  
2-15.喷嘴间隙nozzle clearance: Y}&//S A  
2-16.射流jet: Y4_/G4C  
2-17.扩散器diffuser: cV\(Z6u  
2-18.扩散器喉部diffuser thoat: ZgP=maQk  
2-19.蒸汽导管vapor tube(pipe;chimney): Aq yR+  
2-20.喷嘴组件nozzle assembly: }%c2u/PQ  
2-21.下裙skirt: MCZTeYnx  
%YkJ A:  
3.附件 f*,jhJ_I  
3-1阱trap: Oh3AbpTT  
⑴.冷阱 cold trap: $5yH(Z[[  
⑵.吸附阱sorption trap: IDQ@h`"B  
⑶.离子阱ion trap: $sTbFY  
⑷.冷冻升华阱 cryosublimation trap: ;PCnEs  
3-2.挡板baffle: JR8 b[Oj.S  
3-3.油分离器oil separator: "1FPe63\*O  
3-4.油净化器oil purifier: {_&'tXL  
3-5.冷凝器condenser: Hbu8gqu  
0x7F~%%2  
4.泵按工作分类 =iW!Mq  
4-1.主泵main pump: 'r~,~A I  
4-2.粗抽泵roughing vacuum pump: X; I:i%-  
4-3.前级真空泵backing vacuum pump: ,pM~Phmp  
4-4.粗(低)真空泵 roughing(low)vacuum pump: ]VtVw^ir  
4-5.维持真空泵holding vacuum pump: 0{^@kxV  
4-6.高真空泵high vacuum pump: DDxbIkt  
4-7.超高真空泵ultra-high vacuum pump: }Qyuy~-&^  
4-8.增压真空泵booster vacuum pump: V T8PV5z  
/j/,@,lw7z  
5.真空泵特性 ,V1/(|[h  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: ZUePHI-dP  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 )hs"P%Zg  
5-3.起动压力starting pressure: K&Ner(/X`6  
5-4.前级压力 backing pressure : }(k#,&Fv`  
5-5.临界前级压力 critical backing pressure: d3-F?i 5d  
5-6.最大前级压力maximum backing pressure: 1/X@~  
5-7.最大工作压力maximum working pressure: =r"-Pm{  
5-8.真空泵的极限压力ultimate pressure of a pump: ,cZhkXd  
5-9.压缩比compression ratio: C))5,aX  
5-10.何氏系数Ho coefficient: q.0Evr:  
5-11.抽速系数speed factor: cq lA"Eof  
5-12.气体的反扩散back-diffusion of gas: K.)ionb  
5-13.泵液返流back-streaming of pump fluid: 5.m&93P  
5-14.返流率back-streaming rate x93h{K f  
5-15.返迁移back-migration: 'NJGez'b ,  
5-16.爆腾bumping: w0qrh\3du  
5-17.水蒸气允许量qm water vapor tolerable load: wJyrF  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: B7 PkCS&X  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: :btb|^C  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump MDV<[${   
3.   1.一般术语 EQe!&;   
1-1.压力计pressure gauge: 9{[I|  
1-2.真空计vacuum gauge: \9"   
⑴.规头(规管)gauge head: g)0>J  
⑵.裸规nude gauge : ?*DM|hzOi  
⑶.真空计控制单元gauge control unit : paKur%2u  
⑷.真空计指示单元gauge indicating unit : x }\x3U  
0lpkG ="&r  
2.真空计一般分类 e&~vO| 3w%  
2-1.压差式真空计differential vacuum gauge: ?,s]5   
2-2.绝对真空计 absolute vacuum gauge: pH&*5=t}  
2-3.全压真空计total pressure vacuum gauge: [|iWLPO1&k  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: R[_Q}W'HG  
2-5.相对真空计relative vacuum gauge : #IJm*_J<  
AWaptw_p*  
3.真空计特性 grD[7;1~:)  
3-1.真空计测量范围pressure range of vacuum gauge: z$g cK>@l  
3-2.灵敏度系数sensitivity coefficient: MB7UI8  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): 7Qdf#DG  
3-5.规管光电流photon current of vacuum gauge head: 8;PS>9<  
3-6.等效氮压力equivalent nitrogen pressure : Cws;6i*=@  
3-7.X射线极限值 X-ray limit: )6+Z99w  
3-8.逆X射线效应anti X-ray effect: /80H.|8O  
3-9.布利尔斯效应blears effect: m(>MP/  
$4>(}  
4.全压真空计 1O#]qZS}]  
4-1.液位压力计liquid level manometer: CdBpz/  
4-2.弹性元件真空计elastic element vacuum gauge: vEy0DHEE  
4-3.压缩式真空计compression gauge: Zv]'9,cbk  
4-4.压力天平pressure balance:  yqH  
4-5.粘滞性真空计viscosity gauge : TWzlF>4N  
4-6.热传导真空计thermal conductivity vacuum gauge : )Ehi 8  
4-7.热分子真空计thermo-molecular gauge: o*MiKgQ&  
4-8.电离真空计ionization vacuum gauge: |>^5G@e  
4-9.放射性电离真空计radioactive ionization gauge: &9Y ^/W  
4-10.冷阴极电离真空计cold cathode ionization gauge: n?KhBJx 4  
4-11.潘宁真空计penning gauge: J#.f%VJ  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: m+UWvUB)  
4-13.放电管指示器discharge tube indicator: ^fiJxU  
4-14.热阴极电离真空计hot cathode ionization gauge: # &,W x  
4-15.三极管式真空计triode gauge: GB%kxtGD;\  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: s5bqS'%  
4-17.B-A型电离真空计Bayard-Alpert gauge: w"`Zf7a{/  
4-18.调制型电离真空计modulator gauge: 6|mHu2qXm  
4-19.抑制型电离真空计suppressor gauge: FR9w0{o  
4-20.分离型电离真空计extractor gauge:  =oE(ur  
4-21.弯注型电离真空计bent beam gauge: ?^whK<"]  
4-22.弹道型电离真空计 orbitron gauge : reQr=OAez  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: QdIx@[+WOq  
K`=9"v'f+  
5.分压真空计(分压分析器) Y/x>wNW  
5-1.射频质谱仪radio frequency mass spectrometer: @T"-%L8PL  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: m?< ^b_a}  
5-3.单极质谱仪momopole mass spectrometer: `uKsFX M  
5-4.双聚焦质谱仪double focusing mass spectrometer:  /!#A'#Z  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: Ypx5:gm|J  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: T_)g/,5>  
5-7.回旋质谱仪omegatron mass spectrometer: 3F?7oMNIh  
5-8.飞行时间质谱仪time of flight mass spectrometer: oF0DprP@  
U{\9mt7b!  
6.真空计校准 ["O_ Phb|  
6-1.标准真空计reference gauges: C66 9:%  
6-2.校准系统system of calibration: lfAiW;giJ  
6-3.校准系数K calibration coefficient: k vpkWD;  
6-4.压缩计法meleod gauge method: E^iShe  
6-5.膨胀法expansion method: wBWqibY|  
6-6.流导法flow method: o;9 G{Xj3@  
4.   1.真空系统vacuum system f,|g|&C  
1-1.真空机组pump system: `h|Y0x  
1-2.有油真空机组pump system used oil : cR{F|0X  
1-3.无油真空机组oil free pump system V3% >TNp  
1-4.连续处理真空设备continuous treatment vacuum plant: CnpQdI  
1-5.闸门式真空系统vacuum system with an air-lock: GlHP`&;UH  
1-6.压差真空系统differentially pumped vacuum system: b'ZzDYN  
1-7.进气系统gas admittance system: 4tEAi4H|`@  
4Q!|fn0Sv  
2.真空系统特性参量 hj=qWGRgI  
2-1.抽气装置的抽速volume flow rate of a pumping unit : dWx@<(`OC  
2-2.抽气装置的抽气量throughput of a pumping unit : d,b]#fj  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: 4@+']vN4  
2-4.真空系统的漏气速率leak throughput of a vacuum system: )oALB vX  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: #bJp)&LO  
2-6.极限压力ultimate pressure: q@G}Hjn  
2-7.残余压力residual pressure: i[?VF\Y(  
2-8.残余气体谱residual gas spectrum: @Di!~e6  
2-9.基础压力base pressure: K'}I?H~P_  
2-10.工作压力working pressure: 4ClSl#X#i  
2-11.粗抽时间roughing time: N%,zME  
2-12.抽气时间pump-down time: 67;6nXG0K  
2-13.真空系统时间常数time constant of a vacuum system: V|hwT^h  
2-14.真空系统进气时间venting time: S n<X   
Bq;GO  
3.真空容器 +1a3^A\  
3-1.真空容器;真空室vacuum chamber: cij8'( "+!  
3-2.封离真空装置sealed vacuum device: ]H aX.Z<  
3-3.真空钟罩vacuum bell jar: g[R4/]K^$  
3-4.真空容器底板vacuum base plate: >=d 5Scix  
3-5.真空岐管vacuum manifold: F [Lg,}  
3-6.前级真空容器(贮气罐)backing reservoir: 52 *ii  
3-7.真空保护层outer chamber: ;[79Ewd#$  
3-8.真空闸室vacuum air lock: .EPv4[2%F8  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: v8WT?%  
Dpwqg3,  
4.真空封接和真空引入线 QI'-I\Co  
4-1.永久性真空封接permanent seal : =]5f\f6  
4.2.玻璃分级过渡封接graded seal : rq^%)tR  
4-3.压缩玻璃金属封接compression glass-to-metal seal: em95ccs'-  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: t-5K dLB  
4-5.陶瓷金属封接ceramic-to-metal seal: c|d,:u#  
4-6.半永久性真空封接semi-permanent seal : ie11syhV"  
4-7.可拆卸的真空封接demountable joint: >S-JAPuO  
4-8.液体真空封接liquid seal Y]=k"]:%  
4-9.熔融金属真空封接molten metal seal: d&+0JI<  
4-10.研磨面搭接封接ground and lapped seal: hj&~Dn(  
4-11.真空法兰连接vacuum flange connection: t`'jr=e,~  
4-12.真空密封垫vacuum-tight gasket: `dD_"Hdt  
4-13.真空密封圈ring gasket: L }3eZ-  
4-14.真空平密封垫flat gasket: \4LTViY]  
4-15.真空引入线feedthrough leadthrough: Q lA?dXQ  
4-16.真空轴密封shaft seal: z(8G=C  
4-17.真空窗vacuum window: e/_QS}OA  
4-18.观察窗viewing window: j74hWz+p4  
"G-h8IN^O  
5.真空阀门 0WfnX>(C7R  
5-1.真空阀门的特性characteristic of vacuum valves: E]8uj8K3]  
⑴.真空阀门的流导conductance of vacuum valves: xmEom  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: eX>*}pI  
5-2.真空调节阀regulating valve: _g fmo  
5-3.微调阀 micro-adjustable valve: {NQCe0S+p  
5-4.充气阀charge valve: `|Hk+V  
5-5.进气阀gas admittance valve: ).IyjHY  
5-6.真空截止阀break valve: ,v 2^Ui  
5-7.前级真空阀backing valve: SB08-G2  
5-8.旁通阀 by-pass valve: ,[T/O\k  
5-9.主真空阀main vacuum valve: dA (n,@{  
5-10.低真空阀low vacuum valve: O@ H.k<zn  
5-11.高真空阀high vacuum valve: c{dabzL y  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: \EU^`o+  
5-13.手动阀manually operated valve: 4;W{#jk  
5-14.气动阀pneumatically operated valve: j#2E Q  
5-15.电磁阀electromagnetically operated valve: q*4U2_^.  
5-16.电动阀valve with electrically motorized operation: w~'}uh  
5-17.挡板阀baffle valve: :s&dn%5N"  
5-18.翻板阀flap valve: _9t1 aP5  
5-19.插板阀gate valve: Cc*R3vHM6  
5-20.蝶阀butterfly valve: 3^nH>f-Y  
#AB5}rPEI  
6.真空管路 rjiHP;-t1  
6-1.粗抽管路roughing line: GB^`A  
6-2.前级真空管路backing line: UgK c2~  
6-3.旁通管路;By-Pass管路 by-pass line: iF MfBg  
6-4.抽气封口接头pumping stem: {l5fKVb\C  
6-5.真空限流件limiting conductance:       \y:48zd  
6-6.过滤器filter: ~@Q ]@8Tv\  
5.   1.一般术语 @{q<"hT  
1-1真空镀膜vacuum coating: 0 }qlZFB  
1-2基片substrate: <K<#)mcv  
1-3试验基片testing substrate: 5-$D<}Z  
1-4镀膜材料coating material: d@1^U9sf  
1-5蒸发材料evaporation material: ^9Cu?!xu0  
1-6溅射材料sputtering material: 'fGKRd|)  
1-7膜层材料(膜层材质)film material: A)3H`L  
1-8蒸发速率evaporation rate: 2_)UHTwsK  
1-9溅射速率sputtering rate: +0z7}u\x  
1-10沉积速率deposition rate: #T2J +  
1-11镀膜角度coating angle: %7}j|eS)G  
TwI s _r:  
2.工艺 YI;iG[T,&  
2-1真空蒸膜vacuum evaporation coating: {+7FBdxVB  
(1).同时蒸发simultaneous evaporation: ls&H oJ7  
(2).蒸发场蒸发evaporation field evaporation: T}=^D=  
(3).反应性真空蒸发reactive vacuum evaporation: <$zhNu~  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: jLt3jN  
(5).直接加热的蒸发direct heating evaporation: ![_0GFbT  
(6).感应加热蒸发induced heating evaporation: Y1I)w^}:  
(7).电子束蒸发electron beam evaporation: *9$SFe|&n:  
(8).激光束蒸发laser beam evaporation: bKGX> %-  
(9).间接加热的蒸发indirect heating evaporation: $C5*@`GM$  
(10).闪蒸flash evaportion: K)mQcB-"?  
2-2真空溅射vacuum sputtering: o h\$u5  
(1).反应性真空溅射 reactive vacuum sputtering: [RN]?,  
(2).偏压溅射bias sputtering: x51R:x(p  
(3).直流二级溅射direct current diode sputtering: <7F-WR/2n  
(4).非对称性交流溅射asymmtric alternate current sputtering: aK - x{  
(5).高频二极溅射high frequency diode sputtering: B+U:=591  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: 1n!:L!,`  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: (@5`beEd  
(8).离子束溅射ion beam sputtering: SU4i'o  
(9).辉光放电清洗glow discharge cleaning: 2;WbXc!#!  
2-3物理气相沉积PVD physical vapor deposition: 65qqs|&w;[  
2-4化学气相沉积CVD chemical vapor deposition: T\bP8D  
2-5磁控溅射magnetron sputtering: e 9RYk:O  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: NT.#U?9c  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: )]FXUz|;  
2-8电弧离子镀arc discharge deposition: k:run2K  
$1|E(d1  
3.专用部件 ;]Q6K9.d8  
3-1镀膜室coating chamber: {FI*oO1A~  
3-2蒸发器装置evaporator device: [ UI>SN  
3-3蒸发器evaporator: #8"oqqYi  
3-4直接加热式蒸发器evaporator by direct heat: "%Y=+  
3-5间接加热式蒸发器evaporator by indirect heat: m","m  
3-7溅射装置sputtering device: Dk^AnMx%_  
3-8靶target: 2I}pX9  
3-10时控挡板timing shutter: A8vd@0  
3-11掩膜mask: S\8v)|Pr  
3-12基片支架substrate holder: k Alx m{  
3-13夹紧装置clamp: Z>g>OPu  
3-14换向装置reversing device: ApeqbD5g&  
3-15基片加热装置substrate heating device: >lUPOc  
3-16基片冷却装置substrate colding device: Ld}?daPj  
\Dq'~ d  
4.真空镀膜设备 +`k30-<P  
4-1真空镀膜设备vacuum coating plant: * &:_Vgu  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: )8W! |  
(2).真空溅射镀膜设备vacuum sputtering coating plant: e7@ m i  
4-2连续镀膜设备continuous coating plant: Zyz#xMmM  
4-3半连续镀膜设备semi- continuous coating plant ==m[t- 9x  
6.   1.漏孔 WSH[*jMA  
1-1漏孔leaks: ?QT6q]|d0+  
1-2通道漏孔channel leak: >pfeP"[(3  
1-3薄膜漏孔membrane leak: K9k!P8Rd  
1-4分子漏孔molecular leak: %o%V4K*  
1-5粘滞漏孔vixcous leak: p  lnH  
1-6校准漏孔calibrated leak: 1$vGQ  
1-7标准漏孔reference leak : 6[A\cs  
1-8虚漏virtual leak: ]E<Z5G1HD  
1-9漏率leak rate: ,7&\jET5^0  
1-10标准空气漏率standard air leak rate: ZgxB7zl//  
1-11等值标准空气漏率equivalent standard air leak rate: >[;@ [4}  
1-12探索(示漏)气体: z:#]P0  
Deh3Dtg/k  
2.本底 +zMPkbP6  
2-1本底background: |z=`Ur@)  
2-2探索气体本底search gas background : J#Hh4Kc  
2-3漂移drift: JfN5#+_i  
2-4噪声noise: H1kI+YJ@  
[G|.  
3.检漏仪 gE2(E0H  
3-1检漏仪leak detector: 5 qfvHQ ~M  
3-2高频火花检漏仪H.F. spark leak detector: Z?'CS|u d  
3-3卤素检漏仪halide leak detector:  Ol }5ry  
3-4氦质谱检漏仪helium mass spectrometer leak detector: ^~[7])}g6  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: 7 <^+)DsS?  
~rBFP)  
4.检漏 Qt+D ,X  
4-1气泡检漏leak detection by bubbles: A{zqr^/h  
4-2氨检漏leak detection by ammonia: rc8HZ  
4-3升压检漏leak detection of rise pressure: Ea@0>_U|  
4-4放射性同位素检漏radioactive isotope leak detection: ZR}v_]l^  
4-5荧光检漏fluorescence leak detection D j9aTO  
7.   1.一般术语 o7!A(Eu  
1-1真空干燥vacuum drying: IEy$2f>Ns  
1-2冷冻干燥freeze drying : _h-agn4[i  
1-3物料material: jV sH  
1-4待干燥物料material to be dried: `}),wBq  
1-5干燥物料dried material : VAL? Z  
1-6湿气moisture;humidity: k2D*`\ D  
1-7自由湿气free moisture: crIF5^3Yby  
1-8结合湿气bound moisture: ':4<[Vk  
1-9分湿气partial moisture: :b44LXKCP  
1-10含湿量moisture content: l[T-Ak  
1-11初始含湿量initial moisture content: vMp=\U-~^  
1-12最终含湿量final residual moisture: caQ1SV^{9  
1-13湿度degree of moisture ,degree of humidity : ^@V*:n^  
1-14干燥物质dry matter : ,zoHmV1Wd+  
1-15干燥物质含量content of dry matter: .z,-ThTH@\  
$vXY"-k  
2.干燥工艺  BjH|E@z  
2-1干燥阶段stages of drying : =T[P  
(1).预干燥preliminary dry: ,"`20.Lv  
(2).一次干燥(广义)primary drying(in general): G!I++M"  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): zq</(5H  
(4).二次干燥secondary drying: &s`)_P[  
2-2.(1).接触干燥contact drying: swj\X ,{  
(2).辐射干燥 drying by radiation : ' bl9fO4v  
(3).微波干燥microwave drying: 1-p#}VX  
(4).气相干燥vapor phase drying: ^s6~*n<fH  
(5).静态干燥static drying: (sKg*G2  
(6).动态干燥dynamic drying: LG,?,%_s  
2-3干燥时间drying time: wMCMrv:  
2-4停留时间length of stay(in the drying chamber): ">Qxb.Y}  
2-5循环时间cycle time: h~#F2#.  
2-6干燥率 dessication ratio : @sn:%/x_  
2-7去湿速率mass flow rate of humidity: ZvF#J_%gE5  
2-8单位面积去湿速率mass flow rate of humidity per surface area: O<s7VHj  
2-9干燥速度 drying speed : W@AHE?s6g  
2-10干燥过程drying process: %_E5B6xi{  
2-11加热温度heating temperature: KJT N"hF   
2-12干燥温度temperature of the material being dried : M]5l-i$  
2-13干燥损失loss of material during the drying process : K7&]| ^M9  
2-14飞尘lift off (particles): fh =R  
2-15堆层厚度thickness of the material: {Ycgq%1>]  
F[\T'{  
3.冷冻干燥 #eKKH]J/  
3-1冷冻freezing: ,.P]5 lE  
(1).静态冷冻static freezing: _W(xO |,M  
(2).动态冷冻dynamic freezing: ;b [>{Q;  
(3).离心冷冻centrifugal freezing: )2).kL>  
(4).滚动冷冻shell freezing: LkJq Bg  
(5).旋转冷冻spin-freezing: TYuP EVEXZ  
(6).真空旋转冷冻vacuum spin-freezing: _(f@b1O~  
(7).喷雾冷冻spray freezing: z\tY A  
(8).气流冷冻air blast freezing: IA0 vSF:  
3-2冷冻速率rate of freezing: ByjfPb#  
3-3冷冻物料frozen material: A/=cGE  
3-4冰核ice core: .K~V DUu  
3-5干燥物料外壳envelope of dried matter: *m "@*O'  
3-6升华表面sublimation front: k`>qb8,  
3-7融化位置freezer burn: M %zf?>])  
',hoe  
4.真空干燥设备;真空冷冻干燥设备 -!+i ^r  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: ,zZH>P  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: Z6gwAvf<  
4-3加热表面heating surface: LF.i0^#J  
4-4物品装载面shelf : 9ls1y=M8J  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): %u%;L+0Q[  
4-6单位面积干燥器处理能力throughput per shelf area: eW.qMx#:od  
4-7冰冷凝器ice condenser: gs1  
4-8冰冷凝器的负载load of the ice condenser: s8(Z&pQ  
4-9冰冷凝器的额定负载rated load of the ice condenser XzV>q~I3|E  
8.   1.一般术语 bzpi7LKN  
1-1试样sample : i/!{k2  
(1).表面层surface layer: '(r?($s  
(2).真实表面true surface: h(q4 B~  
(3).有效表面积effective surface area: >%6j-:S  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: W\<OCD%X  
(5).表面粒子密度surface particle density:  e#5WX  
(6).单分子层monolayer: Onqapm0  
(7).表面单分子层粒子密度monolayer density: ;Uch  
(8).覆盖系数coverage ratio: u^C\aujg  
1-2激发excitation: ,?U(PEO\f  
(1).一次粒子primary particle: 5Zc  
(2).一次粒子通量primary particle flux: o$bQ-_B`  
(3).一次粒子通量密度density of primary particle flux: LL:N/1ysG  
(4).一次粒子负荷primary particle load: 2FL_!;p;2E  
(5).一次粒子积分负荷integral load of primary particle: :6C R~p  
(6).一次粒子的入射能量energy of the incident primary particle: :F5(]g 7  
(7).激发体积excited volume: ce4rhtkV  
(8).激发面积excited area: uF%N`e^S  
(9).激发深度excited death: aU +uPP  
(10).二次粒子secondary particles: 49/2E@G4.  
(11).二次粒子通量secondary particle flux: 7g8\q@',  
(12).二次粒子发射能energy of the emitted secondary particles: hDJ+Rk@  
(13).发射体积emitting volume: hQ%X0X,  
(14).发射面积emitting area: sk5=$My  
(15).发射深度emitting depth: 0*^f EoV  
(16).信息深度information depth: LCRWC`%&  
(17).平均信息深度mean information depth: 1\-lAk!   
1-3入射角angle of incidence: =S^vIo)  
1-4发射角angle of emission: ! pa7]cZ  
1-5观测角observation: ~&0lWa  
1-6分析表面积analyzed surface area: E]{0lG`l  
1-7产额 yield : Yo5ged]i  
1-8表面层微小损伤分析minimum damage surface analysis: !N:w?zsp  
1-9表面层无损伤分析non-destructive surface analysis: $m.'d*e5  
1-10断面深度分析 profile analysis in depth; depth profile analysis : 3Qv9=q|[b  
1-11可观测面积observable area: HE4S%#bH>  
1-12可观测立体角observable solid angle : ,iiI5FR  
1-13接受立体角;观测立体角angle of acceptance: :'H}b*VWx  
1-14角分辨能力angular resolving power: ]w)uo4<^J  
1-15发光度luminosity: 8/"uS;yP  
1-16二次粒子探测比detection ratio of secondary particles: AnsJ3C  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: >&Ye(3w&  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: dg N #"  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: qk&BCkPT  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: Hb!A\;>  
1-21本底压力base pressure: m&*0<N  
1-22工作压力working pressure: Dxr4B<  
00W_XhJ  
2.分析方法  Mv%B#J  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: ~8Ef`zL  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : } F*=+n  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: usugjx^p  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: "g!/^A!!  
2-3离子散射表面分析ion scattering spectroscopy: \<=.J`o{  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 3z 5"Ckzb  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: )]}68}9  
2-6离子散射谱仪ion scattering spectrometer: Q|Pm8{8  
2-7俄歇效应Auger process: a- /p/ I-%  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: ,l)AYu!q4F  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: xNVSWi,  
2-10光电子谱术photoelectron spectroscopy : .fzns20u  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: xUs1-O1i  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: KC\W6|NtGj  
2-11光电子谱仪photoelectron spectrometer: ~r]$(V n  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: U%2{PbL  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: kdm@1x  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): _ZuI x=!  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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