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cswmsc 2007-02-28 23:18

真空术语全集

“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 `1i\8s&O6@  
--------------------------------------------------- #:E^($v  
真空术语 wJg&OQc9  
Zfc{}ius  
1.标准环境条件 standard ambient condition: ow4|GLU^;  
2.气体的标准状态 standard reference conditions forgases: f3SAK!V+s  
3.压力(压强)p pressure: FvyC$vip  
4.帕斯卡Pa pascal: S;}/ql y  
5.托Torr torr: 6 g)X&pZ  
6.标准大气压atm standard atmosphere: }*|aVBvU  
7.毫巴mbar millibar: xgJyG.?  
8.分压力 partial pressure: G7k.YtW  
9.全压力 total pressure: :v%iF!+.P  
10.真空 vacuum: $xK(bc'{  
11.真空度 degree of vacuum: F#Bi*YY  
12.真空区域 ranges of vacuum: +:3p*x%1H  
13.气体 gas: yHnN7&  
14.非可凝气体 non-condensable gas: F>U*Wy  
15.蒸汽vapor: 'e*:eBoyb  
16.饱和蒸汽压saturation vapor pressure: 1>)uI@?Rb  
17.饱和度degree of saturation: &G aI  
18.饱和蒸汽saturated vapor: vpP8'f.  
19.未饱和蒸汽unsaturated vapor: /rnP/X)T  
20.分子数密度n,m-3 number density of molecules: \]qwD m/  
21.平均自由程ι、λ,m mean free path: 1i 7p'  
22.碰撞率ψ collision rate: bJB* w  
23.体积碰撞率χ volume collision rate: oRHWb_$"  
24.气体量G quantity of gas: t]6 4=  
25.气体的扩散 diffusion of gas: kj@m5`G  
26.扩散系数D diffusion coefficient; diffusivity: 6Z!OD(/e  
27.粘滞流 viscous flow: @O| l A  
28.粘滞系数η viscous factor: *]e 9/f  
29.泊肖叶流 poiseuille flow: vqRW^>~-B  
30.中间流 intermediate flow: _))--+cL  
31.分子流 molecular flow: EoOwu-{  
32克努曾数 number of knudsen: |$`I1  
33.分子泻流 molecular effusion; effusive flow: eXQzCm  
34.流逸 transpiration: 7Yly^  
35.热流逸 thermal transpiration: (@cZmU,  
36.分子流率qN molecular flow rate; molecular flux: p2j=73$  
37.分子流率密度 molecular flow rate density; density of molecular flux: ~c|{PZ9U  
38.质量流率qm mass flow rare: aZL FsSY  
39.流量qG throughput of gas: 2@f?yh0  
40.体积流率qV volume flow rate: !z_VwZ#,  
41.摩尔流率qυ molar flow rate: 29k\}m7l<*  
42.麦克斯韦速度分布 maxwellian velocity distribution: A{ Ejk|  
43.传输几率Pc transmission probability: Am)XbN')1  
44.分子流导CN,UN molecular conductance: +$D~?sk  
45.流导C,U conductance: 2@a]x(  
46.固有流导Ci,Ui intrinsic conductance: 0BQ<a  
47.流阻W resistance: ~ MW_=6U  
48.吸附 sorption: /;xmM 2B'  
49.表面吸附 adsorption: nX-%qc"  
50.物理吸附physisorption: LYp=o8JW|  
51.化学吸附 chemisorption: Y 9~z7  
52.吸收absorption: av}pT)]\  
53.适应系数α accommodation factor: gf U!sYZ  
54.入射率υ impingement rate: k?ksv+e\  
55.凝结率condensation rate: 28d=-s=[  
56.粘着率 sticking rate: #AUa'qB t  
57.粘着几率Ps sticking probability: Xw<Nnvz6  
58.滞留时间τ residence time: 5E}~iC&  
59.迁移 migration: m'ykDK\B  
60.解吸 desorption: e"6!0Py#*  
61.去气 degassing: &#qy:  
62.放气 outgassing: &ajpD sz;  
63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: ^FN(wvqb8  
64.蒸发率 evaporation rate: y1+~IjY  
65.渗透 permeation: %SD=3UK6  
66.渗透率φ permeability: Pdw[#X<[`  
67.渗透系数P permeability coefficient <e7  
2.   1.真空泵 vacuum pumps x@480r  
1-1.容积真空泵 positive displacement pump: e$y VV#  
⑴.气镇真空泵 gas ballast vacuum pump: tQrkRg(E:  
⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: &[ 4lP~  
⑶.干封真空泵 dry-sealed vacuum pump: J,]U"+;H  
⑷.往复真空泵 piston vacuum pump: :,BKB*a\  
⑸.液环真空泵 liquid ring vacuum pump: ( mKuFz7  
⑹.旋片真空泵 sliding vane rotary vacuum pump: $r87]y!  
⑺.定片真空泵 rotary piston vacuum pump: A?/(W_Gt^M  
⑻.滑阀真空泵 rotary plunger vacuum pump: I:G4i}mA  
⑼.余摆线真空泵 trochoidal vacuum pump: "=9kX`(1y  
⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: kZ3w2=x3v  
⑾.罗茨真空泵 roots vacuum pump: yZ]u{LJS  
1-2.动量传输泵 kinetic vacuum pump: 5rx;?yvn  
⑴.牵引分子泵molecular drag pump: ]M5w!O!  
⑵.涡轮分子泵turbo molecular pump: ESt@%7.F  
⑶.喷射真空泵ejector vacuum pump: fG*366W  
⑷.液体喷射真空泵liquid jet vacuum pump: QSq0{  
⑸.气体喷射真空泵gas jet vacuum pump: qg#|1J6e  
⑹.蒸汽喷射真空泵vapor jet vacuum pump : _}(ej&'f  
⑺.扩散泵diffusion pump : o7;#B)jWS  
⑻.自净化扩散泵self purifying diffusion pump: 5T4!' 4n  
⑼.分馏扩散泵 fractionating diffusion pump : 1y($h<  
⑽.扩散喷射泵diffusion ejector pump : amH..D7_>  
⑾.离子传输泵ion transfer pump: xf]_@T;  
1-3.捕集真空泵 entrapment vacuum pump:  +*aZ9g  
⑴吸附泵adsorption pump: zs~v6y@  
⑵.吸气剂泵 getter pump: YB1uudW9  
⑶.升华(蒸发)泵 sublimation (evaporation)pump : \tx4bV#  
⑷.吸气剂离子泵getter ion pump: :7-2^7z)  
⑸.蒸发离子泵 evaporation ion pump: b qNM  
⑹.溅射离子泵sputter ion pump: 1fzHmD  
⑺.低温泵cryopump: mE}@}@(  
ij<6gv~ n"  
2.真空泵零部件 $ 'obj  
2-1.泵壳 pump case: }hy, }2(8  
2-2.入口 inlet: fyE#8h_>4  
2-3.出口outlet: z nxAP|  
2-4.旋片(滑片、滑阀)vane; blade : da/Tms`T  
2-5.排气阀discharge valve: H<`<5M8  
2-6.气镇阀gas ballast valve: c/Ykk7T9--  
2-7.膨胀室expansion chamber: <//#0r*  
2-8.压缩室compression chamber: O.% $oV  
2-9.真空泵油 vacuum pump oil: .!pr0/9B  
2-10.泵液 pump fluid: ]F4 .m  
2-11.喷嘴 nozzle: kED1s's  
2-13.喷嘴扩张率nozzle expansion rate: jJK`+J,i}X  
2-14.喷嘴间隙面积 nozzle clearance area : TppuEC>  
2-15.喷嘴间隙nozzle clearance: ,s9gGCA  
2-16.射流jet: yxx'g+D*  
2-17.扩散器diffuser: y]e[fZ`L  
2-18.扩散器喉部diffuser thoat: 2aR<xcSg  
2-19.蒸汽导管vapor tube(pipe;chimney): EDf"1b{PX  
2-20.喷嘴组件nozzle assembly: 88l\8k4r  
2-21.下裙skirt: @z-%:J/$  
NM{/rvM  
3.附件 F?B`rw@xr  
3-1阱trap: 34gC[G=  
⑴.冷阱 cold trap: +-*Ww5Zti  
⑵.吸附阱sorption trap: y9xvGr[l  
⑶.离子阱ion trap: &Q`{ Gk  
⑷.冷冻升华阱 cryosublimation trap: Y%1 94fY$  
3-2.挡板baffle: Glw_<ag[  
3-3.油分离器oil separator: ^.|P&f~  
3-4.油净化器oil purifier: !F|#TETrt  
3-5.冷凝器condenser: zvgy$]y'\  
`UK'IN.il  
4.泵按工作分类 (/a#1Pd&  
4-1.主泵main pump: n,_q6/!  
4-2.粗抽泵roughing vacuum pump: QK`5KB(k'  
4-3.前级真空泵backing vacuum pump:  h/*q +H  
4-4.粗(低)真空泵 roughing(low)vacuum pump: ls*bCe  
4-5.维持真空泵holding vacuum pump: S[ln||{  
4-6.高真空泵high vacuum pump: !w;oVPNg  
4-7.超高真空泵ultra-high vacuum pump: <1%(%KdN[  
4-8.增压真空泵booster vacuum pump: 8%ea(|Wjg  
~EL3I  
5.真空泵特性 A 6IrA/b  
5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: d^(7\lw|  
5-2.真空泵的抽气量Q throughput of vacuum pump:。 fFYfb4o  
5-3.起动压力starting pressure: BtA_1RO  
5-4.前级压力 backing pressure : R9z:K_d,  
5-5.临界前级压力 critical backing pressure: NZoNsNu*C.  
5-6.最大前级压力maximum backing pressure: J{!U;r!6  
5-7.最大工作压力maximum working pressure: }nUq=@ej  
5-8.真空泵的极限压力ultimate pressure of a pump: H _0F:e  
5-9.压缩比compression ratio: xk*&zAt  
5-10.何氏系数Ho coefficient: }B e;YIhG  
5-11.抽速系数speed factor: ! *eDT4a  
5-12.气体的反扩散back-diffusion of gas: b$;qtfJG  
5-13.泵液返流back-streaming of pump fluid: kfV}ta'^S  
5-14.返流率back-streaming rate e=^^TX`I  
5-15.返迁移back-migration: ,` 64t'g  
5-16.爆腾bumping: 5(=5GkE)>  
5-17.水蒸气允许量qm water vapor tolerable load: NHL9qL"qk  
5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: y<g1q"F  
5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: m!K`?P]:N  
5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump TT@ U_^o  
3.   1.一般术语 SNJSRqWL/  
1-1.压力计pressure gauge: &.l^>#  
1-2.真空计vacuum gauge:  mPL0s  
⑴.规头(规管)gauge head: kz\Ss|jl  
⑵.裸规nude gauge : xfa-   
⑶.真空计控制单元gauge control unit : YO'aX  
⑷.真空计指示单元gauge indicating unit : 2O 2HmL  
(QTF+~)  
2.真空计一般分类 K0YQ b&*k  
2-1.压差式真空计differential vacuum gauge: 7tbY>U8  
2-2.绝对真空计 absolute vacuum gauge: b} 0G~oLP  
2-3.全压真空计total pressure vacuum gauge: B[,AR"#b  
2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: w *M&@+3I  
2-5.相对真空计relative vacuum gauge : RY .@_{  
k-Yli21-/|  
3.真空计特性 (^NYC$ZxM=  
3-1.真空计测量范围pressure range of vacuum gauge: xG(xG%J  
3-2.灵敏度系数sensitivity coefficient: 5%%e$o+  
3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): z"97AXu  
3-5.规管光电流photon current of vacuum gauge head: yAiO._U  
3-6.等效氮压力equivalent nitrogen pressure : 4_`(c1oA  
3-7.X射线极限值 X-ray limit: DL*vF>v  
3-8.逆X射线效应anti X-ray effect: L^jjf8_  
3-9.布利尔斯效应blears effect: *4ido?  
Wc Gg  
4.全压真空计 f{.4# C'  
4-1.液位压力计liquid level manometer: zM,r0Z  
4-2.弹性元件真空计elastic element vacuum gauge: njc-=o  
4-3.压缩式真空计compression gauge: b'W.l1]<-  
4-4.压力天平pressure balance: byFO^pce  
4-5.粘滞性真空计viscosity gauge : uGv|!UQw  
4-6.热传导真空计thermal conductivity vacuum gauge : 0|Xz-Y  
4-7.热分子真空计thermo-molecular gauge: 1<tJ3>Xl  
4-8.电离真空计ionization vacuum gauge: g/FZ?Wo  
4-9.放射性电离真空计radioactive ionization gauge: `a%MD>R_Lg  
4-10.冷阴极电离真空计cold cathode ionization gauge: uzI=.j  
4-11.潘宁真空计penning gauge: L#",.x  
4-12.冷阴极磁控管真空计cold cathode magnetron gauge: q;}iW:r&Q  
4-13.放电管指示器discharge tube indicator: Ptc+ypTu  
4-14.热阴极电离真空计hot cathode ionization gauge: Gl@{y (  
4-15.三极管式真空计triode gauge: Pa6pq;4St  
4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: }T0O~c{$i  
4-17.B-A型电离真空计Bayard-Alpert gauge: &+n9T?+b  
4-18.调制型电离真空计modulator gauge: t/}NX[q  
4-19.抑制型电离真空计suppressor gauge: jU $G<G  
4-20.分离型电离真空计extractor gauge: ?j0yT@G  
4-21.弯注型电离真空计bent beam gauge: ?ac4GA(  
4-22.弹道型电离真空计 orbitron gauge : <PVwf`W.  
4-23.热阴极磁控管真空计hot cathode magnetron gauge: ae2Q^yLA  
$~S~pvT  
5.分压真空计(分压分析器) 8IA1@0n&  
5-1.射频质谱仪radio frequency mass spectrometer: 8qqN0"{,  
5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: ,3!$mQL=  
5-3.单极质谱仪momopole mass spectrometer: -72EXO=|  
5-4.双聚焦质谱仪double focusing mass spectrometer: j*5IRzK1%0  
5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ESNI$[`  
5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: 5f{P% x(  
5-7.回旋质谱仪omegatron mass spectrometer: qi B~  
5-8.飞行时间质谱仪time of flight mass spectrometer: 8L,=Eap  
+SR{ FF  
6.真空计校准 ^nK<t?KS  
6-1.标准真空计reference gauges: *5 +GJWKN  
6-2.校准系统system of calibration: A#6zI NK#B  
6-3.校准系数K calibration coefficient: f"KrPx!^b  
6-4.压缩计法meleod gauge method: s-_D,$ |  
6-5.膨胀法expansion method: @zC6`  
6-6.流导法flow method: <)p.GAZ  
4.   1.真空系统vacuum system s/=%kCo  
1-1.真空机组pump system: 3*& Y'/!  
1-2.有油真空机组pump system used oil : vjq2(I)u  
1-3.无油真空机组oil free pump system #]x3(}3W  
1-4.连续处理真空设备continuous treatment vacuum plant: ?+))J~@t  
1-5.闸门式真空系统vacuum system with an air-lock: %rMCiz  
1-6.压差真空系统differentially pumped vacuum system: JwB'B  
1-7.进气系统gas admittance system: K J\kR  
`XhH{*Q"X  
2.真空系统特性参量 c7jmzo  
2-1.抽气装置的抽速volume flow rate of a pumping unit : ZRG Cy5Rk  
2-2.抽气装置的抽气量throughput of a pumping unit : +U2lwd!j  
2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: Rh ^(91d  
2-4.真空系统的漏气速率leak throughput of a vacuum system: Oj;*Gi9E  
2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: | L8 [+_m  
2-6.极限压力ultimate pressure: $uZmIu9Bi+  
2-7.残余压力residual pressure: R>* z8n  
2-8.残余气体谱residual gas spectrum: .P$m?p#  
2-9.基础压力base pressure: dgjK\pH`h  
2-10.工作压力working pressure: TIKkS*$  
2-11.粗抽时间roughing time: 3l~+VBR_  
2-12.抽气时间pump-down time: 7ocUFY0"  
2-13.真空系统时间常数time constant of a vacuum system: V9,<>  
2-14.真空系统进气时间venting time: ?1D!%jfi  
u<Kowt<ci  
3.真空容器 r*+~(83k  
3-1.真空容器;真空室vacuum chamber: y)fMVD"(  
3-2.封离真空装置sealed vacuum device: /@F'f@;  
3-3.真空钟罩vacuum bell jar: lN#j%0MaUo  
3-4.真空容器底板vacuum base plate: 2ZY$/  
3-5.真空岐管vacuum manifold: '9zW#b  
3-6.前级真空容器(贮气罐)backing reservoir: c|k_[8L  
3-7.真空保护层outer chamber: =I`S7oF  
3-8.真空闸室vacuum air lock: |n/;x$Cb  
3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: !?nO0Ao-$  
} Bf@69  
4.真空封接和真空引入线 (dq_ ,LI  
4-1.永久性真空封接permanent seal : sfyLG3$/  
4.2.玻璃分级过渡封接graded seal : ]>1Mq,!  
4-3.压缩玻璃金属封接compression glass-to-metal seal: $6a9<&LP_  
4-4.匹配式玻璃金属封接matched glass-to-metal seal: w'K7$F51  
4-5.陶瓷金属封接ceramic-to-metal seal:  y:RW:D&  
4-6.半永久性真空封接semi-permanent seal : 8>9Mh!t}(I  
4-7.可拆卸的真空封接demountable joint: gx.\H3y  
4-8.液体真空封接liquid seal v>]g="5}8  
4-9.熔融金属真空封接molten metal seal: ?4bYb]8Z  
4-10.研磨面搭接封接ground and lapped seal: ~.: { Ik]  
4-11.真空法兰连接vacuum flange connection: a+E 8s7C/D  
4-12.真空密封垫vacuum-tight gasket: V: D;?$Jl  
4-13.真空密封圈ring gasket: w7Yu} JY^  
4-14.真空平密封垫flat gasket: 8ttJ\m  
4-15.真空引入线feedthrough leadthrough: %J M$]  
4-16.真空轴密封shaft seal: k|/VNV( =0  
4-17.真空窗vacuum window: Rn~'S2`u  
4-18.观察窗viewing window: @Chl>s  
Sb[>R(0:  
5.真空阀门 ,Z~`aHhr  
5-1.真空阀门的特性characteristic of vacuum valves: q[\3,Y  
⑴.真空阀门的流导conductance of vacuum valves: LP"g(D2'n  
⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: O2Qmz=%  
5-2.真空调节阀regulating valve: p(n0(}eVC'  
5-3.微调阀 micro-adjustable valve: 4Hz3 KKu  
5-4.充气阀charge valve: #c:s 2EL  
5-5.进气阀gas admittance valve: \6|y~5Hw{r  
5-6.真空截止阀break valve: Mt4  
5-7.前级真空阀backing valve: R! M'  
5-8.旁通阀 by-pass valve: \p(S4?I7  
5-9.主真空阀main vacuum valve: t`8Jz~G`  
5-10.低真空阀low vacuum valve: $`|h F[tv  
5-11.高真空阀high vacuum valve: ~^2w)-N  
5-12.超高真空阀;UHV阀 ultra-high vacuum valve: f6Y?),`  
5-13.手动阀manually operated valve: @rYZ0`E9  
5-14.气动阀pneumatically operated valve: M2Nh3ijr  
5-15.电磁阀electromagnetically operated valve: GrLxERf  
5-16.电动阀valve with electrically motorized operation: jlBsm'M<m  
5-17.挡板阀baffle valve: }k VC ]+  
5-18.翻板阀flap valve: d~aTjf  
5-19.插板阀gate valve: v@{y}  
5-20.蝶阀butterfly valve: Yh1</C  
! V.]mI  
6.真空管路 wO,qFY  
6-1.粗抽管路roughing line: SSI> +A  
6-2.前级真空管路backing line: mfj{_fR3  
6-3.旁通管路;By-Pass管路 by-pass line: E{Wn&?i>A  
6-4.抽气封口接头pumping stem: BbX$R`f  
6-5.真空限流件limiting conductance:       uU)t_W&-J  
6-6.过滤器filter: ~T@E")uR  
5.   1.一般术语 k M /:n  
1-1真空镀膜vacuum coating: NOTG|\{  
1-2基片substrate: f/sz/KC]~  
1-3试验基片testing substrate: u0wu\  
1-4镀膜材料coating material: /RB%m8@;  
1-5蒸发材料evaporation material: gveGBi  
1-6溅射材料sputtering material: "Erphn  
1-7膜层材料(膜层材质)film material: s]m]b#1!r  
1-8蒸发速率evaporation rate: @wXYza0|d  
1-9溅射速率sputtering rate: ^6 l5@#)w  
1-10沉积速率deposition rate: MEI&]qI  
1-11镀膜角度coating angle: D\G 8p;  
/uWUQ#9  
2.工艺 L"YQji!  
2-1真空蒸膜vacuum evaporation coating: :7(fBf5  
(1).同时蒸发simultaneous evaporation: @lzq`SzM  
(2).蒸发场蒸发evaporation field evaporation: .Yk}iHcW.  
(3).反应性真空蒸发reactive vacuum evaporation: >(2;(TbQm0  
(4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: CZzt=9  
(5).直接加热的蒸发direct heating evaporation: glch06  
(6).感应加热蒸发induced heating evaporation: EZWWv L  
(7).电子束蒸发electron beam evaporation: S8v,' Cc  
(8).激光束蒸发laser beam evaporation: NkUY_rKPb  
(9).间接加热的蒸发indirect heating evaporation: eV_ ",W  
(10).闪蒸flash evaportion: d*u3]&?x&f  
2-2真空溅射vacuum sputtering: n 'ZPB  
(1).反应性真空溅射 reactive vacuum sputtering: t]sk[  
(2).偏压溅射bias sputtering: [ (Y@  
(3).直流二级溅射direct current diode sputtering: VN-0hw/A  
(4).非对称性交流溅射asymmtric alternate current sputtering: jXx~ 5  
(5).高频二极溅射high frequency diode sputtering: T7qp ({v?Q  
(6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering:  \&d1bq  
(7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: iw.F8[})  
(8).离子束溅射ion beam sputtering: Y3|_&\ v6  
(9).辉光放电清洗glow discharge cleaning: *vNAm(\N  
2-3物理气相沉积PVD physical vapor deposition: GB+$ed5@<  
2-4化学气相沉积CVD chemical vapor deposition: 9F3aT'3#!  
2-5磁控溅射magnetron sputtering: ~p+ `pwjY1  
2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: *[>{ 9V  
2-7空心阴极离子镀HCD hollow cathode discharge deposition: Cno[:iom  
2-8电弧离子镀arc discharge deposition: <DqFfrpc  
Urw =a$  
3.专用部件 UChLWf|'  
3-1镀膜室coating chamber: >]B_+r0m^  
3-2蒸发器装置evaporator device: ,wr5DQ  
3-3蒸发器evaporator: rxx VLW  
3-4直接加热式蒸发器evaporator by direct heat: %M_F/O  
3-5间接加热式蒸发器evaporator by indirect heat: f3;[ZS  
3-7溅射装置sputtering device: U7LCd+Z 5X  
3-8靶target: W^W.* ?e`  
3-10时控挡板timing shutter: fda2dY;  
3-11掩膜mask: pw))9~XU  
3-12基片支架substrate holder: >8NUji2I  
3-13夹紧装置clamp: p>U= Jg  
3-14换向装置reversing device: <'T DOYb  
3-15基片加热装置substrate heating device: p*jH5h cy  
3-16基片冷却装置substrate colding device: U*EBH  
.Z`xNp  
4.真空镀膜设备 xJ^B.;>  
4-1真空镀膜设备vacuum coating plant: $LBgBH &z  
(1).真空蒸发镀膜设备vacuum evaporation coating plant: Ct(^nn$A  
(2).真空溅射镀膜设备vacuum sputtering coating plant: -{oZK{a1  
4-2连续镀膜设备continuous coating plant: %f\j)qw  
4-3半连续镀膜设备semi- continuous coating plant OHY|< &*  
6.   1.漏孔 {Zs EYUP  
1-1漏孔leaks: 1Uah IePf  
1-2通道漏孔channel leak: p;%5o0{1  
1-3薄膜漏孔membrane leak: t[HsqnP  
1-4分子漏孔molecular leak: 6EY 0Fjsi  
1-5粘滞漏孔vixcous leak: ^c}kVQ\g3  
1-6校准漏孔calibrated leak: PE_JO(e;Xm  
1-7标准漏孔reference leak : t@2MEo  
1-8虚漏virtual leak: y`z?lmV)xM  
1-9漏率leak rate: \R 3O39[  
1-10标准空气漏率standard air leak rate: =OrVaZ0  
1-11等值标准空气漏率equivalent standard air leak rate: m8l!+8  
1-12探索(示漏)气体: ?>R(;B|ER  
Lm^vS u  
2.本底 e ?Jgk$"  
2-1本底background: >2'A~?%  
2-2探索气体本底search gas background : 6 G ,cc  
2-3漂移drift: U $=Z`^<  
2-4噪声noise: >qMzQw2  
1Si$Q  
3.检漏仪 l?X)]1  
3-1检漏仪leak detector: )|]*"yf:E  
3-2高频火花检漏仪H.F. spark leak detector: |*~SR.[`  
3-3卤素检漏仪halide leak detector: Tj2pEOu  
3-4氦质谱检漏仪helium mass spectrometer leak detector: OJFWmZ(X  
3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: H-% B<7  
 ;t/KF"  
4.检漏 |41~U\  
4-1气泡检漏leak detection by bubbles: ,{'ZP_  
4-2氨检漏leak detection by ammonia: b$/7rVH!  
4-3升压检漏leak detection of rise pressure: -|:mRAe  
4-4放射性同位素检漏radioactive isotope leak detection: d|sf2   
4-5荧光检漏fluorescence leak detection S2 -J1 x2N  
7.   1.一般术语 sZ"(#g;3<  
1-1真空干燥vacuum drying: qnU`Q{  
1-2冷冻干燥freeze drying : T#}"?A|  
1-3物料material: 2H1?f|0>  
1-4待干燥物料material to be dried: bz`rSp8h  
1-5干燥物料dried material : $GD Q1&Z  
1-6湿气moisture;humidity: e[QEOx/-h2  
1-7自由湿气free moisture: B}I9+/|{  
1-8结合湿气bound moisture: iML?`%/vN  
1-9分湿气partial moisture: 94lz?-j  
1-10含湿量moisture content: CE4Kc33OU|  
1-11初始含湿量initial moisture content: ( _MY;S  
1-12最终含湿量final residual moisture: @><8YN^)%  
1-13湿度degree of moisture ,degree of humidity : i2 )$%M&  
1-14干燥物质dry matter : 5',&8  
1-15干燥物质含量content of dry matter: ] $F%  
BWkTQd<t  
2.干燥工艺 ^_=bssaOd  
2-1干燥阶段stages of drying : Rf!$n7& \  
(1).预干燥preliminary dry: \XbCJJP  
(2).一次干燥(广义)primary drying(in general): \mFgjP z  
(3).一次干燥(冷冻干燥)primary drying(freeze-drying): WXa<(\S\V  
(4).二次干燥secondary drying: SS&G<3Ke  
2-2.(1).接触干燥contact drying: dFk$rr>q  
(2).辐射干燥 drying by radiation : DH])Q5  
(3).微波干燥microwave drying: ]_m(q`_  
(4).气相干燥vapor phase drying: 6"2IV  
(5).静态干燥static drying: (Wn^~-`=+  
(6).动态干燥dynamic drying: k P=~L=cK  
2-3干燥时间drying time: QOv@rP/  
2-4停留时间length of stay(in the drying chamber): G4EuW *~  
2-5循环时间cycle time: wYd{X 8$  
2-6干燥率 dessication ratio : (I#3![q  
2-7去湿速率mass flow rate of humidity: K*tomy  
2-8单位面积去湿速率mass flow rate of humidity per surface area: ZkF6AF   
2-9干燥速度 drying speed : |Syulus  
2-10干燥过程drying process: 5~RR _G  
2-11加热温度heating temperature: cE*d(g  
2-12干燥温度temperature of the material being dried : r_Pi)MPc  
2-13干燥损失loss of material during the drying process : dSE"G>l8  
2-14飞尘lift off (particles): fy>~ GFk(  
2-15堆层厚度thickness of the material: N LSJ D  
b%xG^jUXsX  
3.冷冻干燥 m :2A[H+  
3-1冷冻freezing: 3 t+1M  
(1).静态冷冻static freezing: :d|~k  
(2).动态冷冻dynamic freezing: CE|rn8MB  
(3).离心冷冻centrifugal freezing: CS;4ysNf  
(4).滚动冷冻shell freezing: 8)YDUE%VH  
(5).旋转冷冻spin-freezing: Eo0/cln|  
(6).真空旋转冷冻vacuum spin-freezing: 4V'HPD>=V  
(7).喷雾冷冻spray freezing: [I( Yn  
(8).气流冷冻air blast freezing: !{b4+!@p  
3-2冷冻速率rate of freezing: O&@CT])8  
3-3冷冻物料frozen material: |}o3EX  
3-4冰核ice core: ?:i,%]zxC  
3-5干燥物料外壳envelope of dried matter: UYhxgPGsj  
3-6升华表面sublimation front: FlT5R*m  
3-7融化位置freezer burn: ?DKY;:dZF  
C/q!!  
4.真空干燥设备;真空冷冻干燥设备 sV]I]DR  
4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: [G"Va_A8  
4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: [6\b(kS+  
4-3加热表面heating surface: 2u(G:cR  
4-4物品装载面shelf : 9<5S!?JL  
4-5干燥器的处理能力throughput (of the vacuum drying chamber): E^m;Ab=  
4-6单位面积干燥器处理能力throughput per shelf area: +77B656  
4-7冰冷凝器ice condenser: !iW> xo  
4-8冰冷凝器的负载load of the ice condenser: sA oxLI  
4-9冰冷凝器的额定负载rated load of the ice condenser mTLJajE/  
8.   1.一般术语 T_fM\jdI  
1-1试样sample : No*[@D]g  
(1).表面层surface layer: dEZlJo@J  
(2).真实表面true surface: <4582x,G  
(3).有效表面积effective surface area: 'i4L.&  
(4).宏观表面;几何表面macroscopic surface area; geometric surface area: -0P9|;h5  
(5).表面粒子密度surface particle density: !i\ gCLg2_  
(6).单分子层monolayer: XfN(7d0  
(7).表面单分子层粒子密度monolayer density: H^M>(kT#&  
(8).覆盖系数coverage ratio: U+&Eps&NI  
1-2激发excitation: x kdC -S  
(1).一次粒子primary particle: ;*WG9Y(W  
(2).一次粒子通量primary particle flux: I8uFMP  
(3).一次粒子通量密度density of primary particle flux: w YQEm  
(4).一次粒子负荷primary particle load: s%1Z raMvJ  
(5).一次粒子积分负荷integral load of primary particle: <T]ey  
(6).一次粒子的入射能量energy of the incident primary particle: zpZfsn!  
(7).激发体积excited volume: ~yJJ00%  
(8).激发面积excited area: ]`M2Kwp  
(9).激发深度excited death: Q"H/RMo-  
(10).二次粒子secondary particles: <6X*k{  
(11).二次粒子通量secondary particle flux: IL`=r6\  
(12).二次粒子发射能energy of the emitted secondary particles: I moxg+u  
(13).发射体积emitting volume: 8#/y`ul  
(14).发射面积emitting area: -F MonM  
(15).发射深度emitting depth:  s;-AZr)  
(16).信息深度information depth: LL==2KNUo  
(17).平均信息深度mean information depth: `@#rAW D  
1-3入射角angle of incidence: "uFwsjz&B  
1-4发射角angle of emission: UqNUX?(  
1-5观测角observation: }b/P\1#z  
1-6分析表面积analyzed surface area: :aH5=@[!y  
1-7产额 yield : 4iss j$  
1-8表面层微小损伤分析minimum damage surface analysis: o7@C$R_#  
1-9表面层无损伤分析non-destructive surface analysis: bP>Kx-%q  
1-10断面深度分析 profile analysis in depth; depth profile analysis : \>X!n2rLZe  
1-11可观测面积observable area: =}.gU WV  
1-12可观测立体角observable solid angle : ,e$6%R  
1-13接受立体角;观测立体角angle of acceptance: <~uzKs0  
1-14角分辨能力angular resolving power: GxEShSGOE  
1-15发光度luminosity: 6[S IDOp*^  
1-16二次粒子探测比detection ratio of secondary particles: opMnLor  
1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis:  :>U+HQll  
1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: T"<)B^8f  
1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: Xj~%kPe  
1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: wE}Wh5  
1-21本底压力base pressure: MzDosr3:  
1-22工作压力working pressure: @w`wJ*I4,  
9Vo*AK'&U  
2.分析方法 SZ}=~yoD(  
2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: V:vqt@  
(1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : DTSf[zP/  
(2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: ~]q>}/&YLo  
2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: [FLR&=.(  
2-3离子散射表面分析ion scattering spectroscopy: e~d=e3mBp  
2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: is~2{:  
2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ncMzHw  
2-6离子散射谱仪ion scattering spectrometer: [:cvy[}v@  
2-7俄歇效应Auger process: kw E2V+2  
2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: cnI5 G!  
2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: O1bW, n(  
2-10光电子谱术photoelectron spectroscopy : zo8D"  
(1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: ~?FhQd\Q  
(2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: ?{e}ouKYX1  
2-11光电子谱仪photoelectron spectrometer: *UJ4\  
2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 0^sY>N"  
2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: :mW< E  
2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): <fM}Kk  
2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
zuiyuan 2007-03-13 15:13
太好了啊,多谢了啊
zhy980730 2007-03-14 11:39
多谢,了解点.
flyinlove79 2007-03-15 17:43
不错,多谢楼主分享资料 [s:4]
飞花无心 2007-03-26 09:33
很好,谢谢楼主啊
wottlin100 2007-04-02 09:19
呵呵,楼主辛苦啦!如果有定义解释更好!
xingmeng1227 2011-10-29 12:40
呵呵,楼主辛苦啦!
zh9607109 2011-11-03 05:41
呵呵,楼主辛苦啦!
wym87 2011-11-13 23:18
谢谢楼主的分享!Thanks!
douyongming 2012-06-17 17:03
太好了啊,多谢了啊
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