cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 ? :StFlie --------------------------------------------------- 5>9KW7^L 真空术语 .II*wKk FHztF$Z 1.标准环境条件 standard ambient condition: t "y[ 2.气体的标准状态 standard reference conditions forgases: sk'<K5~ 3.压力(压强)p pressure: (<M^C>pldf 4.帕斯卡Pa pascal: }"}
z7Xb0 5.托Torr torr: F;
upb5 6.标准大气压atm standard atmosphere: )"( ojh 7.毫巴mbar millibar:
|gXtP- 8.分压力 partial pressure: #+VH]7] 9.全压力 total pressure: 0!4;."S 10.真空 vacuum: Kmy'z 11.真空度 degree of vacuum: b5!\"v4c 12.真空区域 ranges of vacuum: hKkUsY=R 13.气体 gas: 9NUft8QB 14.非可凝气体 non-condensable gas: Lj]I7ICNh 15.蒸汽vapor: +SM&_b 16.饱和蒸汽压saturation vapor pressure: NxOiT#YH 17.饱和度degree of saturation: 8]SJ=c"}Xf 18.饱和蒸汽saturated vapor: GUX!kj 19.未饱和蒸汽unsaturated vapor: )gX7qQ 20.分子数密度n,m-3 number density of molecules: @B.;V=8wJ 21.平均自由程ι、λ,m mean free path: tKr.{#) 22.碰撞率ψ collision rate: LwPZR E# 23.体积碰撞率χ volume collision rate: `2WtA_ 24.气体量G quantity of gas: L# 25.气体的扩散 diffusion of gas: FI.Ae/(U 26.扩散系数D diffusion coefficient; diffusivity: wEQ7=Gyx 27.粘滞流 viscous flow: $x5,Oe n 28.粘滞系数η viscous factor: kzky{0yKk= 29.泊肖叶流 poiseuille flow: m7~<z>5$ 30.中间流 intermediate flow: ]YQ!i@Y 31.分子流 molecular flow: w)Rtt 9 32克努曾数 number of knudsen: ,s=jtK 33.分子泻流 molecular effusion; effusive flow: It5U=PU 34.流逸 transpiration: `zRE $O 35.热流逸 thermal transpiration: ;Avz%2#c` 36.分子流率qN molecular flow rate; molecular flux: {c
82bFiv 37.分子流率密度 molecular flow rate density; density of molecular flux: os:/-A_m 38.质量流率qm mass flow rare: 6}V)\"u& 39.流量qG throughput of gas: .2K4<UOAbm 40.体积流率qV volume flow rate: S%NS7$`a 41.摩尔流率qυ molar flow rate: {|R@\G.1( 42.麦克斯韦速度分布 maxwellian velocity distribution: ~ RdD6V 43.传输几率Pc transmission probability: UU7E+4O& 44.分子流导CN,UN molecular conductance: o+NPe36 45.流导C,U conductance: 7m4gGkX#r 46.固有流导Ci,Ui intrinsic conductance: E1|> O 47.流阻W resistance: i146@<\G{P 48.吸附 sorption: &1=Je$, 49.表面吸附 adsorption: Ffvv8x 50.物理吸附physisorption: ?MW*`U 51.化学吸附 chemisorption: YsX&]4vzm 52.吸收absorption: k`j>lhH 53.适应系数α accommodation factor: Fi7G S; 54.入射率υ impingement rate: 2s^9q9NS" 55.凝结率condensation rate: `.MY"g9 56.粘着率 sticking rate: jY~W* 57.粘着几率Ps sticking probability: +*W9*gl 58.滞留时间τ residence time: S.: m$s 59.迁移 migration: LnwI 7uvq 60.解吸 desorption: 2H,^i, 61.去气 degassing: `[OJ)tHE 62.放气 outgassing: U{ZE|b.?b 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: DH@]d0N 64.蒸发率 evaporation rate: T(GEFntY 65.渗透 permeation: )A@
}mIs" 66.渗透率φ permeability: Y)Os]<N1 67.渗透系数P permeability coefficient gI~4A, 2. 1.真空泵 vacuum pumps @Cnn8Y&' 1-1.容积真空泵 positive displacement pump: X@["Jjp ⑴.气镇真空泵 gas ballast vacuum pump: /~8<;N>,+ ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: (0wQ [( ⑶.干封真空泵 dry-sealed vacuum pump: A^m]DSFOO ⑷.往复真空泵 piston vacuum pump: z<3{.e\e ⑸.液环真空泵 liquid ring vacuum pump: iXF iFsb ⑹.旋片真空泵 sliding vane rotary vacuum pump: i)@IV]]6yL ⑺.定片真空泵 rotary piston vacuum pump: fZq_]1(/uP ⑻.滑阀真空泵 rotary plunger vacuum pump: gv6}GE ⑼.余摆线真空泵 trochoidal vacuum pump: m'!smSx8 ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: _v[yY3=3 ⑾.罗茨真空泵 roots vacuum pump: Ky r3)1#J 1-2.动量传输泵 kinetic vacuum pump: he
vM'"|4 ⑴.牵引分子泵molecular drag pump: $]
gwaJ: ⑵.涡轮分子泵turbo molecular pump: JU6PBY~C' ⑶.喷射真空泵ejector vacuum pump: )=k8W9i8b ⑷.液体喷射真空泵liquid jet vacuum pump: n#US4&uT4A ⑸.气体喷射真空泵gas jet vacuum pump: >V01%fLd ⑹.蒸汽喷射真空泵vapor jet vacuum pump : Wl29xY}`{! ⑺.扩散泵diffusion pump : !ek};~( ⑻.自净化扩散泵self purifying diffusion pump: p{V_}:|=Q ⑼.分馏扩散泵 fractionating diffusion pump : |vGb,&3 ⑽.扩散喷射泵diffusion ejector pump : WR;) ⑾.离子传输泵ion transfer pump: <FkoWN 1-3.捕集真空泵 entrapment vacuum pump: 2\b 2W_ ⑴吸附泵adsorption pump: u|G&CV#r ⑵.吸气剂泵 getter pump: nfldj33* ⑶.升华(蒸发)泵 sublimation (evaporation)pump : Ej[:!L ⑷.吸气剂离子泵getter ion pump: 9Kpzj43 ⑸.蒸发离子泵 evaporation ion pump: Mnv2tnU] ⑹.溅射离子泵sputter ion pump: }k{h^!fV ⑺.低温泵cryopump: 8et*q3D7` ,/bSa/x` 2.真空泵零部件 zXEu3h 2-1.泵壳 pump case: (
!THd 2-2.入口 inlet: eG@0: 2-3.出口outlet: rUz-\H(- 2-4.旋片(滑片、滑阀)vane; blade : (V06cb*42[ 2-5.排气阀discharge valve: mDCz=pk) 2-6.气镇阀gas ballast valve: sC<
B 2-7.膨胀室expansion chamber: ytDp
4x<W) 2-8.压缩室compression chamber: 21LJ3rW_ 2-9.真空泵油 vacuum pump oil: u2FD@Xq? 2-10.泵液 pump fluid: xn&$qLB 2-11.喷嘴 nozzle: en5sqKqh+ 2-13.喷嘴扩张率nozzle expansion rate: $:4*?8K2 2-14.喷嘴间隙面积 nozzle clearance area : ZaZm$.s n 2-15.喷嘴间隙nozzle clearance: @[2Go}VF 2-16.射流jet: +H4H$H 2-17.扩散器diffuser: _Yms]QEZ 2-18.扩散器喉部diffuser thoat: `pTCK9 2-19.蒸汽导管vapor tube(pipe;chimney): O^2@9
w 2-20.喷嘴组件nozzle assembly: 3jh:
K 2-21.下裙skirt: @[=K`n:n_ T'K6Q cu 3.附件 rsGQ
:c 3-1阱trap: iPuX ⑴.冷阱 cold trap: `"-ln'nw ⑵.吸附阱sorption trap: MB"TwtW ⑶.离子阱ion trap: IQm[,Fh ⑷.冷冻升华阱 cryosublimation trap: Il8,g+W] 3-2.挡板baffle: 'f
"KV| 3-3.油分离器oil separator: L3@upb 3-4.油净化器oil purifier: c@&`!e 3-5.冷凝器condenser: f~rq)2V: </jzM?i 4.泵按工作分类 *}@zxFe+ 4-1.主泵main pump: :|5\XV)> 4-2.粗抽泵roughing vacuum pump: 2X)n.%4g$; 4-3.前级真空泵backing vacuum pump: ;Pd nE~ 4-4.粗(低)真空泵 roughing(low)vacuum pump: "J_#6q* 4-5.维持真空泵holding vacuum pump: `zw^ WbCO{ 4-6.高真空泵high vacuum pump: r2xXS&9!| 4-7.超高真空泵ultra-high vacuum pump: HO`N]AMw 4-8.增压真空泵booster vacuum pump: gx55.} ^{m&2l&87 5.真空泵特性 2K~<_.S 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: }iE!(
l 5-2.真空泵的抽气量Q throughput of vacuum pump:。 *i)3q+%. 5-3.起动压力starting pressure: Bokpvd-c7 5-4.前级压力 backing pressure : Ht,dMt>: 5-5.临界前级压力 critical backing pressure: -yJ%G1R 5-6.最大前级压力maximum backing pressure: h't!1u 5-7.最大工作压力maximum working pressure: yd>b2 M 5-8.真空泵的极限压力ultimate pressure of a pump: |ler\"Eu 5-9.压缩比compression ratio: )/vse5EG+ 5-10.何氏系数Ho coefficient: v"I#.{LiH= 5-11.抽速系数speed factor: {pR4+g 5-12.气体的反扩散back-diffusion of gas: O'L9 s>B 5-13.泵液返流back-streaming of pump fluid: 5X1z^( 5-14.返流率back-streaming rate EG&97lb 5-15.返迁移back-migration: 6 *GR_sMm 5-16.爆腾bumping: >[A7oH 5-17.水蒸气允许量qm water vapor tolerable load: Xk]:]pl4W 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: t~0!K;nn 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: yOdh?:Imv 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump 1!P\x=Nn_ 3. 1.一般术语 P
=jRof$ 1-1.压力计pressure gauge: AW')*{/(Ii 1-2.真空计vacuum gauge: m5'nqy F ⑴.规头(规管)gauge head: }9FAM@x1K& ⑵.裸规nude gauge : 4b/>ZHFOF; ⑶.真空计控制单元gauge control unit : vWh]1G#'p[ ⑷.真空计指示单元gauge indicating unit : ^OZ*L e 2vLV1v$,q 2.真空计一般分类 ~_GW 2-1.压差式真空计differential vacuum gauge: z,+LPr 2-2.绝对真空计 absolute vacuum gauge: /qwl;_Jcf 2-3.全压真空计total pressure vacuum gauge: _t7}ny[ 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: )&F]j 2-5.相对真空计relative vacuum gauge : M!D&a)\ 50='>|b 3.真空计特性 3X>x` 3-1.真空计测量范围pressure range of vacuum gauge: u$%;03hJ 3-2.灵敏度系数sensitivity coefficient: ~^ <1k- 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): \ y}!yrQ 3-5.规管光电流photon current of vacuum gauge head: \nbGdka 3-6.等效氮压力equivalent nitrogen pressure : dZ6P)R 3-7.X射线极限值 X-ray limit: :+?w> 3-8.逆X射线效应anti X-ray effect: {Yc#XP 3-9.布利尔斯效应blears effect: |J^}BXW'^) D~T;z pS 4.全压真空计 q?0&&"T} 4-1.液位压力计liquid level manometer: 0YA 4-2.弹性元件真空计elastic element vacuum gauge: ;Im%L=q9GL 4-3.压缩式真空计compression gauge: 5fjL 4-4.压力天平pressure balance: AQU^7O 4-5.粘滞性真空计viscosity gauge : <oKoz0! 4-6.热传导真空计thermal conductivity vacuum gauge : ~bnyk%S
o 4-7.热分子真空计thermo-molecular gauge: Gzw9E.Hk 4-8.电离真空计ionization vacuum gauge: G4jyi&] 4-9.放射性电离真空计radioactive ionization gauge: y{k65dk- 4-10.冷阴极电离真空计cold cathode ionization gauge: 6cVJu%<V 4-11.潘宁真空计penning gauge: G5!J9@Yi 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: 'Z}3XVZEN 4-13.放电管指示器discharge tube indicator: J-U5_>S 4-14.热阴极电离真空计hot cathode ionization gauge: !l|fzS8g 4-15.三极管式真空计triode gauge: {W11+L{8 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: A8T75?lL( 4-17.B-A型电离真空计Bayard-Alpert gauge: '?O_(%3F0 4-18.调制型电离真空计modulator gauge: \3XG8J 4-19.抑制型电离真空计suppressor gauge: s%/x3anz= 4-20.分离型电离真空计extractor gauge: YW7Pimks 4-21.弯注型电离真空计bent beam gauge: 6+LBs.vl} 4-22.弹道型电离真空计 orbitron gauge : S9kA69O 4-23.热阴极磁控管真空计hot cathode magnetron gauge: kdW$>Jqb oU)Hco "_k 5.分压真空计(分压分析器) yR$ld.[uf 5-1.射频质谱仪radio frequency mass spectrometer: X"EZpJ'W 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: X6-;vnlKN 5-3.单极质谱仪momopole mass spectrometer: #<o=W#[ 5-4.双聚焦质谱仪double focusing mass spectrometer: aESlbH 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ,k |QuOrCh 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: K'f`}y9 5-7.回旋质谱仪omegatron mass spectrometer: >`=9So_J 5-8.飞行时间质谱仪time of flight mass spectrometer: cUj^aT pm A81'ca/ 6.真空计校准 ,p)Qu%' 6-1.标准真空计reference gauges: *o}7&Hw#9f 6-2.校准系统system of calibration: :x[SV^fw[ 6-3.校准系数K calibration coefficient: ]9lR:V
sw 6-4.压缩计法meleod gauge method: c1sVdM}| 6-5.膨胀法expansion method: }Hy4^2B 6-6.流导法flow method: :v B9z 4. 1.真空系统vacuum system Y_=
]w1 1-1.真空机组pump system: 4o3TW# 1-2.有油真空机组pump system used oil : ;2}wrX 1-3.无油真空机组oil free pump system yN{TcX 1-4.连续处理真空设备continuous treatment vacuum plant: 7fXta|eP0 1-5.闸门式真空系统vacuum system with an air-lock: =Q~@dP 1-6.压差真空系统differentially pumped vacuum system: <^(>o 1-7.进气系统gas admittance system: %?m_;iv :y1,OR/k 2.真空系统特性参量 k@|Go)~ 2-1.抽气装置的抽速volume flow rate of a pumping unit : HB*H%>L{"B 2-2.抽气装置的抽气量throughput of a pumping unit : V/Q/Ujgg 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: C17$qdV/ 2-4.真空系统的漏气速率leak throughput of a vacuum system: jT*?Z:U 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: +5"Pm]oRbx 2-6.极限压力ultimate pressure: _^@ >I8ix 2-7.残余压力residual pressure: 3W3)%[ 5 2-8.残余气体谱residual gas spectrum: BFswqp: 2-9.基础压力base pressure: tLzb*U8'1w 2-10.工作压力working pressure: 2?nEHIUT 2-11.粗抽时间roughing time: })umg8s 2-12.抽气时间pump-down time: NCivh&HR 2-13.真空系统时间常数time constant of a vacuum system: @kW RI* m 2-14.真空系统进气时间venting time: !,9;AMO
- S+bpWA 3.真空容器 G]zyx"0Sqb 3-1.真空容器;真空室vacuum chamber: H(tT8Q5i 3-2.封离真空装置sealed vacuum device: i\dd 3-3.真空钟罩vacuum bell jar: 5pH6] $ 3-4.真空容器底板vacuum base plate: V*gh"gZ< 3-5.真空岐管vacuum manifold: q,T4-
E 3-6.前级真空容器(贮气罐)backing reservoir: 6PT"9vR`) 3-7.真空保护层outer chamber: 4 u=v 3-8.真空闸室vacuum air lock: opgNt o6$ 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: nLY(%):(P |ITh2m 4.真空封接和真空引入线 ihd^P] 4-1.永久性真空封接permanent seal : 6,~]2H'zq 4.2.玻璃分级过渡封接graded seal : j:7AVnt 4-3.压缩玻璃金属封接compression glass-to-metal seal: .`jYrW-k 4-4.匹配式玻璃金属封接matched glass-to-metal seal: |#ZMZmo{ 4-5.陶瓷金属封接ceramic-to-metal seal: |ZG0E 4-6.半永久性真空封接semi-permanent seal : H,EGB8E2 4-7.可拆卸的真空封接demountable joint: ^{a_:r" 4-8.液体真空封接liquid seal @a (-U.CZ 4-9.熔融金属真空封接molten metal seal: uj@d {AQ 4-10.研磨面搭接封接ground and lapped seal: %5!K?,z% 4-11.真空法兰连接vacuum flange connection: Ch_eK^ g1 4-12.真空密封垫vacuum-tight gasket: yX.; x 0 4-13.真空密封圈ring gasket: sAS[wcOQ 4-14.真空平密封垫flat gasket: l4ru0V8s7 4-15.真空引入线feedthrough leadthrough: -8yN6
0| 4-16.真空轴密封shaft seal: L&0aS: 4-17.真空窗vacuum window: NUFW
SL> 4-18.观察窗viewing window: '"T9y=9]s *p0Kw> 5.真空阀门 .Bojb~zt 5-1.真空阀门的特性characteristic of vacuum valves: (0["|h32, ⑴.真空阀门的流导conductance of vacuum valves: ` <u2 N ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: $r)NL 5-2.真空调节阀regulating valve: %+oqAYm+s 5-3.微调阀 micro-adjustable valve: kS4YxtvB 5-4.充气阀charge valve: }$b!/<7FD 5-5.进气阀gas admittance valve: 5zz">-Q ! 5-6.真空截止阀break valve: F+!9T 5-7.前级真空阀backing valve: 8^67,I-c 5-8.旁通阀 by-pass valve: Aw&0R" { 5-9.主真空阀main vacuum valve: NueuCiP 5-10.低真空阀low vacuum valve: 7^<6|>j4 5-11.高真空阀high vacuum valve: )Em`kle 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: 9Dp0Pi?29 5-13.手动阀manually operated valve: }#S1!TU 5-14.气动阀pneumatically operated valve: :LCyxLI 5-15.电磁阀electromagnetically operated valve: PMT}fg 5-16.电动阀valve with electrically motorized operation: $HCgawQ 5-17.挡板阀baffle valve: 1A[(R T] 5-18.翻板阀flap valve: Va A.J 5-19.插板阀gate valve: @VQ<X4Za 5-20.蝶阀butterfly valve: L{oG'aK4 <H$!OPV 6.真空管路 &+3RsIlW 6-1.粗抽管路roughing line: pj$kSS|m6- 6-2.前级真空管路backing line: @w;$M]o1 6-3.旁通管路;By-Pass管路 by-pass line: FKUo^F?z 6-4.抽气封口接头pumping stem: }WhRJr`a 6-5.真空限流件limiting conductance: [Sj"gLj 6-6.过滤器filter: 0lV;bVa% 5. 1.一般术语 >+DMTV[O 1-1真空镀膜vacuum coating: \VWgF)_ 1-2基片substrate: +S WtHj7e 1-3试验基片testing substrate: L1f=90 1-4镀膜材料coating material: BkP4.XRI 1-5蒸发材料evaporation material: nuVux5: 1-6溅射材料sputtering material: #8~ygEa} 1-7膜层材料(膜层材质)film material: 1Vc~Sa 1-8蒸发速率evaporation rate: USaa#s4' 1-9溅射速率sputtering rate: *Q#oV}D_ 1-10沉积速率deposition rate: 'bsHoO 1-11镀膜角度coating angle: DP;:%L} f8ZuG !U 2.工艺 a l9(
9) 2-1真空蒸膜vacuum evaporation coating: UA(4mbz+ (1).同时蒸发simultaneous evaporation: 5A<}*T (2).蒸发场蒸发evaporation field evaporation: efE=5%O (3).反应性真空蒸发reactive vacuum evaporation: } =Xlac_U (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: ?J-\}X (5).直接加热的蒸发direct heating evaporation: TZGk[u^* (6).感应加热蒸发induced heating evaporation: "$D'gSoYe (7).电子束蒸发electron beam evaporation: /;{L~f=et) (8).激光束蒸发laser beam evaporation: 0+u>"7T (9).间接加热的蒸发indirect heating evaporation: 5=I"bnIU (10).闪蒸flash evaportion: y0-UO+; 2-2真空溅射vacuum sputtering: #c":y5: (1).反应性真空溅射 reactive vacuum sputtering: #eX<=H] (2).偏压溅射bias sputtering: R.DUfU"gp (3).直流二级溅射direct current diode sputtering: 6nREuT'k (4).非对称性交流溅射asymmtric alternate current sputtering: 8_o~0lb (5).高频二极溅射high frequency diode sputtering: Q*M(d\V s (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: ~ch%mI~ (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: qHtIjtt[q (8).离子束溅射ion beam sputtering: R$66F>Jz^ (9).辉光放电清洗glow discharge cleaning: z 2jC48~ 2-3物理气相沉积PVD physical vapor deposition: ,p /{!BX 2-4化学气相沉积CVD chemical vapor deposition: ,LP^v'[V7 2-5磁控溅射magnetron sputtering: zG8g}FrzG; 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 0S9~db 2-7空心阴极离子镀HCD hollow cathode discharge deposition: ^b}Wl0Fn 2-8电弧离子镀arc discharge deposition: h&n1}W+ xRdx`
YY u 3.专用部件 AJE$Z0{q 3-1镀膜室coating chamber: y/kB`Z(Yj 3-2蒸发器装置evaporator device: Pf<yLT] 3-3蒸发器evaporator: qS"#jxc==+ 3-4直接加热式蒸发器evaporator by direct heat: La3rX 3-5间接加热式蒸发器evaporator by indirect heat: l5~O}`gfh 3-7溅射装置sputtering device: }}ic{931 3-8靶target: 13w(Tf 3-10时控挡板timing shutter: BFg&@7.X 3-11掩膜mask: !s?SI=B8 3-12基片支架substrate holder: bM5o-U#^ C 3-13夹紧装置clamp: VIN0kRQ# 3-14换向装置reversing device: >fth
iA 3-15基片加热装置substrate heating device: +GL$[ 5G 3-16基片冷却装置substrate colding device: 8UXRM :Z" XogCq?_m 4.真空镀膜设备 jwBJG7\ 4-1真空镀膜设备vacuum coating plant: yTh%[k (1).真空蒸发镀膜设备vacuum evaporation coating plant: X,#~[%h$-= (2).真空溅射镀膜设备vacuum sputtering coating plant: f$n5$hJlQ 4-2连续镀膜设备continuous coating plant: PHEQG]H S 4-3半连续镀膜设备semi- continuous coating plant }ijQ*ECdl 6. 1.漏孔 Jj\lF*B 1-1漏孔leaks: &6
<a<S 1-2通道漏孔channel leak: 2H0BNrYM 1-3薄膜漏孔membrane leak: s;=C&N5g 1-4分子漏孔molecular leak: V=% ;5/ 1-5粘滞漏孔vixcous leak: al-rgh 1-6校准漏孔calibrated leak: #p55/54ZI 1-7标准漏孔reference leak : RPte[tq 1-8虚漏virtual leak: JAP(J~ 1-9漏率leak rate: s,8zj<dUv 1-10标准空气漏率standard air leak rate: w=n(2M56C 1-11等值标准空气漏率equivalent standard air leak rate: AO]cnhC 1-12探索(示漏)气体: -W<1BJE %=Z/Frd 2.本底 CfSP*g0rW 2-1本底background: ;b~\[ 2-2探索气体本底search gas background : rUmP_ 2-3漂移drift: \q4r/SbgW 2-4噪声noise: noL9@It0 {jmy:e2 3.检漏仪 f7][#EL 3-1检漏仪leak detector: .RJMtmp 3-2高频火花检漏仪H.F. spark leak detector: 6]d]0TW_ 3-3卤素检漏仪halide leak detector: ..+#~3es#y 3-4氦质谱检漏仪helium mass spectrometer leak detector: _oCNrjt9 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: x.wDA3ys m8b,_1 4.检漏 |*UB/8C^/! 4-1气泡检漏leak detection by bubbles: Ez0zk9 4-2氨检漏leak detection by ammonia: Z+J4q9^$ 4-3升压检漏leak detection of rise pressure: h=:/9O{H 4-4放射性同位素检漏radioactive isotope leak detection: geqP. MR 4-5荧光检漏fluorescence leak detection h_S>Q 7. 1.一般术语 D\9-/p 1-1真空干燥vacuum drying: &JqaIJh
1-2冷冻干燥freeze drying : K)~a H 1-3物料material: gCC7L(1 1-4待干燥物料material to be dried: \#t)B
J2 1-5干燥物料dried material : Z%:>nDZV 1-6湿气moisture;humidity: QAp]cE1ew 1-7自由湿气free moisture: RK &>!^ 1-8结合湿气bound moisture: /*,_\ ; 1-9分湿气partial moisture: O^row1D_ 1-10含湿量moisture content: rf:H$\yw 1-11初始含湿量initial moisture content: =3w;<1 ?'
1-12最终含湿量final residual moisture: Cp"7R&s 1-13湿度degree of moisture ,degree of humidity : LlO8]b!P-^ 1-14干燥物质dry matter : PC<_1!M] 1-15干燥物质含量content of dry matter: nWY^?e'S BR@m*JGajz 2.干燥工艺 /B~[,ES@1 2-1干燥阶段stages of drying : -[
gT}{k! (1).预干燥preliminary dry: )3:0TFS}}k (2).一次干燥(广义)primary drying(in general): XDPgl=~ (3).一次干燥(冷冻干燥)primary drying(freeze-drying): QO(F%&v++ (4).二次干燥secondary drying: A8*zB=C 2-2.(1).接触干燥contact drying: &4S2fWx (2).辐射干燥 drying by radiation : v#/Gxk9eX (3).微波干燥microwave drying: 62qjU<Z (4).气相干燥vapor phase drying: o!":mJy (5).静态干燥static drying: pF8 #H~ (6).动态干燥dynamic drying: 2*V[kmD/3 2-3干燥时间drying time: 3S7"P$q 2-4停留时间length of stay(in the drying chamber): UWvVYdy7 2-5循环时间cycle time: ,_RNZ
sa;& 2-6干燥率 dessication ratio : ?V^7`3F 2-7去湿速率mass flow rate of humidity: Coe/ 4!$M 2-8单位面积去湿速率mass flow rate of humidity per surface area: rFQWgWD 2-9干燥速度 drying speed : uoI7'
:Nv 2-10干燥过程drying process: @|vH5Pi 2-11加热温度heating temperature: uI/
wR! 2-12干燥温度temperature of the material being dried : *??lwvJp 2-13干燥损失loss of material during the drying process : ?}4,s7PR 2-14飞尘lift off (particles): }QE*-GVv] 2-15堆层厚度thickness of the material: X$ZVY2 ngl +`|u 3.冷冻干燥 @i; )`k5b 3-1冷冻freezing: uwSSrT (1).静态冷冻static freezing: '1gfXC (2).动态冷冻dynamic freezing: HT .*r6Y>g (3).离心冷冻centrifugal freezing: 2]]v|Z2M4 (4).滚动冷冻shell freezing: JN|6+.GG (5).旋转冷冻spin-freezing: ^x: lB> (6).真空旋转冷冻vacuum spin-freezing: ~$g: (7).喷雾冷冻spray freezing: $3g{9)} (8).气流冷冻air blast freezing: \}?X5X> 3-2冷冻速率rate of freezing: WqCC4R,- 3-3冷冻物料frozen material:
-9i7Ja 3-4冰核ice core: nm,LKS7 3-5干燥物料外壳envelope of dried matter: Q7$o&N{ 3-6升华表面sublimation front: {4G/HW28 3-7融化位置freezer burn: aIV
/ c _y^r== 4.真空干燥设备;真空冷冻干燥设备 Qw}1q!89 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: rQVX^ 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: 1
&9|~">{C 4-3加热表面heating surface: SXm%X(JU 4-4物品装载面shelf : rTIu' 4-5干燥器的处理能力throughput (of the vacuum drying chamber): r[a7">n 4-6单位面积干燥器处理能力throughput per shelf area: 0- )K_JV
4-7冰冷凝器ice condenser: TQF+aP8[L 4-8冰冷凝器的负载load of the ice condenser: EJ9hgE 4-9冰冷凝器的额定负载rated load of the ice condenser
:-46"bP. 8. 1.一般术语 :x*)o+ 1-1试样sample : tTLg;YjN (1).表面层surface layer: P9
<U+\z (2).真实表面true surface: \xkKgI/ (3).有效表面积effective surface area: +nDy b (4).宏观表面;几何表面macroscopic surface area; geometric surface area: vt|R)[, (5).表面粒子密度surface particle density: >CqzC8JF (6).单分子层monolayer: 'p&,'+x (7).表面单分子层粒子密度monolayer density: MYWkEv7 (8).覆盖系数coverage ratio: vA1YyaB 1-2激发excitation: $Iwvecn?I (1).一次粒子primary particle: ixdsz\< (2).一次粒子通量primary particle flux: k2U*dn"9U (3).一次粒子通量密度density of primary particle flux: esqmj#G (4).一次粒子负荷primary particle load: :}lqu24K (5).一次粒子积分负荷integral load of primary particle: "+F'WCJ-(* (6).一次粒子的入射能量energy of the incident primary particle: uw}Rr7q (7).激发体积excited volume: iAwEnQ3h (8).激发面积excited area: +(3_V$|Dv (9).激发深度excited death: Rm} ym9 (10).二次粒子secondary particles: 5`QcPDp{z (11).二次粒子通量secondary particle flux: /o;M
?Nt6 (12).二次粒子发射能energy of the emitted secondary particles: gsk?
!D (13).发射体积emitting volume: L(Y1ey9x (14).发射面积emitting area: 4+RR`I8$Ge (15).发射深度emitting depth: `@/)S^jBau (16).信息深度information depth: +3)r
szb72 (17).平均信息深度mean information depth: 2*|T)OA`m, 1-3入射角angle of incidence: hH8&g%{2 1-4发射角angle of emission: Hc)z:x;Sj 1-5观测角observation: %;,fI'M 1-6分析表面积analyzed surface area: lK0ny>RB 1-7产额 yield : .A2$C|a* 1-8表面层微小损伤分析minimum damage surface analysis: CJ IuMsZ 1-9表面层无损伤分析non-destructive surface analysis: @NiuT%#c 1-10断面深度分析 profile analysis in depth; depth profile analysis : ?h= n5}Y 1-11可观测面积observable area: 4ba*Nc*Yc 1-12可观测立体角observable solid angle : ?Y( 1-13接受立体角;观测立体角angle of acceptance: k{}> *pCU 1-14角分辨能力angular resolving power: oJ74Mra 1-15发光度luminosity: ->sxz/L 1-16二次粒子探测比detection ratio of secondary particles: 3e_tT8 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: `\kihNkJn3 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: s^wm2/Yw 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: WAa45G 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: \i%'M% 1-21本底压力base pressure: VI0wul~M 1-22工作压力working pressure: i5VZ,E^E D|:'|7l W 2.分析方法 T6U/}&{O 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: -*C
WF|<G (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : x[(6V' (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: (Rw<1q`, 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: X0lPRk53( 2-3离子散射表面分析ion scattering spectroscopy: p['RV 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: ,i2- 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: 7' G;ijx 2-6离子散射谱仪ion scattering spectrometer: ".?4`@7F\ 2-7俄歇效应Auger process: 3U[O : 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: m=dNJF 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: QJ|@Y(KV0 2-10光电子谱术photoelectron spectroscopy : f9.?+.^_ (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: NJUKH1lIhR (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: <J/ =$u/ 2-11光电子谱仪photoelectron spectrometer: mq`/nAmt 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: W0qR?jc 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: uzYB`H< 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): m2(>KMbi 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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