| cswmsc |
2007-02-28 23:18 |
真空术语全集
“真空术语”好像论坛中没有,发一个希望有朋友喜欢。 oM&}akPE --------------------------------------------------- +ti_?gfx 真空术语 |bwz ^ *{:;F@ 1.标准环境条件 standard ambient condition: ID-Y* 2.气体的标准状态 standard reference conditions forgases: `FjU2
O 3.压力(压强)p pressure: ]Cfjs33H 4.帕斯卡Pa pascal: mM> L0 5.托Torr torr: T=EHue$ 6.标准大气压atm standard atmosphere: %[<@$qP 7.毫巴mbar millibar: 5cv&`h8uo_ 8.分压力 partial pressure: s+@+<QE 9.全压力 total pressure: ScgaWJ 10.真空 vacuum: HinPO 11.真空度 degree of vacuum: 'S_OOzpC 12.真空区域 ranges of vacuum: +:a#+]g 13.气体 gas: \; 9log<Z 14.非可凝气体 non-condensable gas: ~]MACG:' 15.蒸汽vapor: H%L oI)w 16.饱和蒸汽压saturation vapor pressure: C#^V<:9 17.饱和度degree of saturation: vn]e`O>y 18.饱和蒸汽saturated vapor: e
ej: 19.未饱和蒸汽unsaturated vapor: 78=a^gRB 20.分子数密度n,m-3 number density of molecules: 4jOq.j 21.平均自由程ι、λ,m mean free path:
b6`_;Z 22.碰撞率ψ collision rate: gQ< >S 23.体积碰撞率χ volume collision rate: |6cz r 24.气体量G quantity of gas: ;qA(!`h+ 25.气体的扩散 diffusion of gas: -x~4@~ 26.扩散系数D diffusion coefficient; diffusivity: eucacXiZ 27.粘滞流 viscous flow: eHQS\n 28.粘滞系数η viscous factor: k10g %K4g 29.泊肖叶流 poiseuille flow: 88@" +2 30.中间流 intermediate flow: 6.!aJJLN 31.分子流 molecular flow: )p$a1\~m 32克努曾数 number of knudsen: BHNcE*U}@? 33.分子泻流 molecular effusion; effusive flow:
{"RUiL^ 34.流逸 transpiration: n=z=%T6 35.热流逸 thermal transpiration: pR3@loFQ`o 36.分子流率qN molecular flow rate; molecular flux: %kHeU= 37.分子流率密度 molecular flow rate density; density of molecular flux: \aEarIX#* 38.质量流率qm mass flow rare: $
$=N'Q 39.流量qG throughput of gas: 'ie+/O@G 40.体积流率qV volume flow rate: _d[4EY 41.摩尔流率qυ molar flow rate: A~@u#]]<n 42.麦克斯韦速度分布 maxwellian velocity distribution: U#qs^f7R 43.传输几率Pc transmission probability: '%W`:K' 44.分子流导CN,UN molecular conductance: W
Ai91K@ 45.流导C,U conductance: !OCb^y 46.固有流导Ci,Ui intrinsic conductance: 8\N`2mPt 47.流阻W resistance: 1edeV48{: 48.吸附 sorption: U.$7=Zl8t 49.表面吸附 adsorption: 6UK}?+r~ 50.物理吸附physisorption: P^)J^{r 51.化学吸附 chemisorption: PnUYL.v 52.吸收absorption: Rk8oshS+2 53.适应系数α accommodation factor: _^k9!Vjo 54.入射率υ impingement rate: l_ES$%d 55.凝结率condensation rate: `W*b?e|H1 56.粘着率 sticking rate: !.EDQ1k 57.粘着几率Ps sticking probability: R7
WGc[ 58.滞留时间τ residence time: [X\<C '< 59.迁移 migration: [ r<0[ 60.解吸 desorption: J"$Y`; 61.去气 degassing: k"L?("~ 62.放气 outgassing: &gr)U3w 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: xoYaL 64.蒸发率 evaporation rate: Ec/-f`8 65.渗透 permeation: !&f>,?wlP 66.渗透率φ permeability: L'@@ewA 67.渗透系数P permeability coefficient &^I2NpT 2. 1.真空泵 vacuum pumps dfa^5`_ 1-1.容积真空泵 positive displacement pump: zz7#gU ⑴.气镇真空泵 gas ballast vacuum pump: 7rZE7+%] ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: TwT@_~IM ⑶.干封真空泵 dry-sealed vacuum pump: ar%!h~ ⑷.往复真空泵 piston vacuum pump: }vXf}2C ⑸.液环真空泵 liquid ring vacuum pump: 8%,u~ELA ⑹.旋片真空泵 sliding vane rotary vacuum pump: ?O| CY ⑺.定片真空泵 rotary piston vacuum pump: EQvZ(-_;4 ⑻.滑阀真空泵 rotary plunger vacuum pump: t*Xo@KA ⑼.余摆线真空泵 trochoidal vacuum pump: m35$4 ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump: fJdTVs@ ⑾.罗茨真空泵 roots vacuum pump: "Xz [|Xl 1-2.动量传输泵 kinetic vacuum pump: 5ieF8F% ⑴.牵引分子泵molecular drag pump: -Z<V?SFOK ⑵.涡轮分子泵turbo molecular pump: 3m]8>1e1" ⑶.喷射真空泵ejector vacuum pump: C}D\^(nLu. ⑷.液体喷射真空泵liquid jet vacuum pump: AnD#k] ⑸.气体喷射真空泵gas jet vacuum pump: )bkJ['9 ⑹.蒸汽喷射真空泵vapor jet vacuum pump : +ak<yV1= ⑺.扩散泵diffusion pump : Es^=&2'' ⑻.自净化扩散泵self purifying diffusion pump: 7A6: * ⑼.分馏扩散泵 fractionating diffusion pump : O~bJ<O=? ⑽.扩散喷射泵diffusion ejector pump : +W}dO# ⑾.离子传输泵ion transfer pump: SU$%nK ) 1-3.捕集真空泵 entrapment vacuum pump: 0%b!ARix ⑴吸附泵adsorption pump: d+iV19 #i ⑵.吸气剂泵 getter pump: }%lk$g'; ⑶.升华(蒸发)泵 sublimation (evaporation)pump : F=9-po ⑷.吸气剂离子泵getter ion pump: /f Ui2[y ⑸.蒸发离子泵 evaporation ion pump: >713H!uj ⑹.溅射离子泵sputter ion pump: )N}.n2Y8W ⑺.低温泵cryopump: )"sJaHx<
8n~ o=" 2.真空泵零部件 p8bAz 2-1.泵壳 pump case: BHrNDpv 2-2.入口 inlet: }48o{\ 2-3.出口outlet: 1!"iN~ 2-4.旋片(滑片、滑阀)vane; blade : tg#d.( 2-5.排气阀discharge valve: xC^| S0B 2-6.气镇阀gas ballast valve: :3p&h[M 2-7.膨胀室expansion chamber: MWHzrqCA 2-8.压缩室compression chamber: _u QxrB"9 2-9.真空泵油 vacuum pump oil: \1[v-hvK 2-10.泵液 pump fluid: 9X ^D( 2-11.喷嘴 nozzle: *{1]b_< 2-13.喷嘴扩张率nozzle expansion rate: j@778fvM\t 2-14.喷嘴间隙面积 nozzle clearance area : *T:gx:Sg/ 2-15.喷嘴间隙nozzle clearance: Hr}pO"% 2-16.射流jet: v_L?n7c 2-17.扩散器diffuser: JXKo zy41 2-18.扩散器喉部diffuser thoat: ~H\1dCW 2-19.蒸汽导管vapor tube(pipe;chimney): f
J$>VN 2-20.喷嘴组件nozzle assembly: ,Z aPY 2-21.下裙skirt: 9{Xh wi)z <52) 3.附件 LPK[^ 3-1阱trap: NU |vtD ⑴.冷阱 cold trap: r;'Vy0?AL ⑵.吸附阱sorption trap: VU ,tCTXz ⑶.离子阱ion trap: FtmI\, ⑷.冷冻升华阱 cryosublimation trap: s3+6Z~g'B 3-2.挡板baffle: 68YJ@(iS 3-3.油分离器oil separator: FTT=h0t 3-4.油净化器oil purifier: kXY p.IVA 3-5.冷凝器condenser: l~j{i/> ;{S7bH'6m 4.泵按工作分类 OaCp3No 4-1.主泵main pump: 3lo.YLP^ 4-2.粗抽泵roughing vacuum pump: Zrm!,qs 4-3.前级真空泵backing vacuum pump: _^Yav.A= 4-4.粗(低)真空泵 roughing(low)vacuum pump: @$]
CC1Y 4-5.维持真空泵holding vacuum pump: ly)L%hG 4-6.高真空泵high vacuum pump: b]XDfe 4-7.超高真空泵ultra-high vacuum pump: Qu6Q)dZ< 4-8.增压真空泵booster vacuum pump: S1G=hgF_L ~ s# !\Ye 5.真空泵特性 C$#X6Q!, 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: 0\a;}
S'g# 5-2.真空泵的抽气量Q throughput of vacuum pump:。 3E`poE 5-3.起动压力starting pressure: y
jQpdO 5-4.前级压力 backing pressure : w/Ej>OS 5-5.临界前级压力 critical backing pressure: +~cW0z 5-6.最大前级压力maximum backing pressure: QJKVNOo 5-7.最大工作压力maximum working pressure: t]PO4GA 5-8.真空泵的极限压力ultimate pressure of a pump: ^ Z~'>J 5-9.压缩比compression ratio: T*ir Ce 5-10.何氏系数Ho coefficient: ]id5jVY 5-11.抽速系数speed factor: }Pf7YuUZZ 5-12.气体的反扩散back-diffusion of gas: hY^-kdQ>M 5-13.泵液返流back-streaming of pump fluid: .>bvI1 5-14.返流率back-streaming rate DX)T}V&mP 5-15.返迁移back-migration: WTZr{)e 5-16.爆腾bumping: +'fdAc:5', 5-17.水蒸气允许量qm water vapor tolerable load: 'l`T(_zL\% 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: L.1pO2zPe 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: f[$9k}. 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump j_Z"= 3. 1.一般术语 I~:
AWS9 1-1.压力计pressure gauge: Ow7}&\;^- 1-2.真空计vacuum gauge: +(9qAB7 ⑴.规头(规管)gauge head: q9mYhT/Im ⑵.裸规nude gauge : km+}./@ ⑶.真空计控制单元gauge control unit : \/
8
V|E ⑷.真空计指示单元gauge indicating unit : <+2M,fq+ n^m6m%J) 2.真空计一般分类 is,r: 2-1.压差式真空计differential vacuum gauge: v\ gCgx=%j 2-2.绝对真空计 absolute vacuum gauge: Tl ?]K 2-3.全压真空计total pressure vacuum gauge: SpG^kI # 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: ;q6FdS 2-5.相对真空计relative vacuum gauge : I%q&4L7pj cr_Q,* 3.真空计特性 -A A='s 3-1.真空计测量范围pressure range of vacuum gauge: MX.=k> 3-2.灵敏度系数sensitivity coefficient: USrg,A 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): Gj}P6V_ 3-5.规管光电流photon current of vacuum gauge head: Tfba3+V 3-6.等效氮压力equivalent nitrogen pressure : hiN6]jL|O 3-7.X射线极限值 X-ray limit: {Noa4i 3-8.逆X射线效应anti X-ray effect: !SFF 79$c 3-9.布利尔斯效应blears effect: X(;,-7Jw !pNY`sw} 4.全压真空计 @I '_ 4-1.液位压力计liquid level manometer: XdDy0e4{%< 4-2.弹性元件真空计elastic element vacuum gauge: T"2D<7frbo 4-3.压缩式真空计compression gauge: >/DyR+?>4 4-4.压力天平pressure balance: -$]Tn#`Fb 4-5.粘滞性真空计viscosity gauge : MOIH%lpe 4-6.热传导真空计thermal conductivity vacuum gauge : .d;XLS~ 4-7.热分子真空计thermo-molecular gauge: IaU 4-8.电离真空计ionization vacuum gauge: mt+IB4` 4-9.放射性电离真空计radioactive ionization gauge: N:y3tpG 4-10.冷阴极电离真空计cold cathode ionization gauge: #.(6.Li 4-11.潘宁真空计penning gauge: xM/B"SG2 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: L##lXUl 4-13.放电管指示器discharge tube indicator: +##b}?S% 4-14.热阴极电离真空计hot cathode ionization gauge: n~#%>C7 4-15.三极管式真空计triode gauge: l(T CF 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: C
NNyz$ 4-17.B-A型电离真空计Bayard-Alpert gauge: pOCLyM9c 4-18.调制型电离真空计modulator gauge: /l,V0+p 4-19.抑制型电离真空计suppressor gauge: y6lle<SIu 4-20.分离型电离真空计extractor gauge: SY`
U]-h 4-21.弯注型电离真空计bent beam gauge: 62&(+'$n 4-22.弹道型电离真空计 orbitron gauge : DFz,>DM; 4-23.热阴极磁控管真空计hot cathode magnetron gauge: =-`}(b2N \S)\~>.`y! 5.分压真空计(分压分析器) u(7PtmV[! 5-1.射频质谱仪radio frequency mass spectrometer: _M/ckv1q@ 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: +oZq~2?*S6 5-3.单极质谱仪momopole mass spectrometer: 4*4s{twG 5-4.双聚焦质谱仪double focusing mass spectrometer: m"~^-mJ- 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: z\,g %u41 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: (>x4X@b 5-7.回旋质谱仪omegatron mass spectrometer: lEBt< 5-8.飞行时间质谱仪time of flight mass spectrometer: @N,EoSb : jB*%nB*x 6.真空计校准 S=>54!{`x 6-1.标准真空计reference gauges: ;[]{O5TB 6-2.校准系统system of calibration: [<Wo7G1s 6-3.校准系数K calibration coefficient: 4+od N. 6-4.压缩计法meleod gauge method: vs/.'yD/C 6-5.膨胀法expansion method: (KDUX
t. 6-6.流导法flow method: 'b#`8k~> 4. 1.真空系统vacuum system X ?/C9 1-1.真空机组pump system: G}d-L!YbE' 1-2.有油真空机组pump system used oil : zo-hH8J: 1-3.无油真空机组oil free pump system bu[v[U4 1-4.连续处理真空设备continuous treatment vacuum plant: U5]{`C0H? 1-5.闸门式真空系统vacuum system with an air-lock: i2SR.{& 1-6.压差真空系统differentially pumped vacuum system: ~a:0Q{>a 1-7.进气系统gas admittance system: ')w:`8Tl _uuxTNN0x* 2.真空系统特性参量 Fu0 dYN 2-1.抽气装置的抽速volume flow rate of a pumping unit : .(OFYK< 2-2.抽气装置的抽气量throughput of a pumping unit : wRn] 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: `H6-g=C 2-4.真空系统的漏气速率leak throughput of a vacuum system: CpuL[|51 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: n*6Oa/JG7 2-6.极限压力ultimate pressure:
C9[Jr)QX 2-7.残余压力residual pressure: *p}b_A}D 2-8.残余气体谱residual gas spectrum: 6eqxwj{S[ 2-9.基础压力base pressure: Ah,X?0+ 2-10.工作压力working pressure: TT3GFP 2-11.粗抽时间roughing time: 5o 4\Jwt 2-12.抽气时间pump-down time: :c@v_J6C& 2-13.真空系统时间常数time constant of a vacuum system: I@a y&NNh 2-14.真空系统进气时间venting time: i>YD_#w ?!=yp# 3.真空容器 !63p?Q= 3-1.真空容器;真空室vacuum chamber: =&RpW7] 3-2.封离真空装置sealed vacuum device: S"ZH5O( 3-3.真空钟罩vacuum bell jar: YIv!\`^ \ 3-4.真空容器底板vacuum base plate: W 86`R 3-5.真空岐管vacuum manifold: QH:k5V~ 3-6.前级真空容器(贮气罐)backing reservoir: XdX1GH*C 3-7.真空保护层outer chamber: hI.@!$~= 3-8.真空闸室vacuum air lock: S)T]>Ash 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: 6?I,sZW 8yEN)RqI 4.真空封接和真空引入线 jnfktDV' 4-1.永久性真空封接permanent seal : kH'LG! O 4.2.玻璃分级过渡封接graded seal : (- `h8M 4-3.压缩玻璃金属封接compression glass-to-metal seal: p|!5G&O, 4-4.匹配式玻璃金属封接matched glass-to-metal seal: We&~]-b AW 4-5.陶瓷金属封接ceramic-to-metal seal: [IT*>;b+? 4-6.半永久性真空封接semi-permanent seal : \ vj<9ke& 4-7.可拆卸的真空封接demountable joint: -`nQa$N- 4-8.液体真空封接liquid seal .{[+d3+, 4-9.熔融金属真空封接molten metal seal: -FRMal4Pg0 4-10.研磨面搭接封接ground and lapped seal: HBHDu;u 4-11.真空法兰连接vacuum flange connection: .J0s_[ 4-12.真空密封垫vacuum-tight gasket: )Qe<XJH! 4-13.真空密封圈ring gasket:
q1!45a 4-14.真空平密封垫flat gasket: 7kX;|NA1 4-15.真空引入线feedthrough leadthrough: Bx9R!u5D 4-16.真空轴密封shaft seal: )Il)
H 4-17.真空窗vacuum window: w<=?%+n 4-18.观察窗viewing window: }+/j /es{] 0c6b_%Rd 5.真空阀门 8S*3W3HY 5-1.真空阀门的特性characteristic of vacuum valves: DFDlp ⑴.真空阀门的流导conductance of vacuum valves: @r7ekyO8) ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: .SZ ZT0Z 5-2.真空调节阀regulating valve: >&pB&'A a 5-3.微调阀 micro-adjustable valve: &QHZ]2%U 5-4.充气阀charge valve: D d['e 5-5.进气阀gas admittance valve: 1dDK(RBbQ 5-6.真空截止阀break valve: .[mI9dc 5-7.前级真空阀backing valve: 8@b,>l$ 5-8.旁通阀 by-pass valve: @JB9qT 5-9.主真空阀main vacuum valve: O5X@'.#rU 5-10.低真空阀low vacuum valve: fXNl27c- 5-11.高真空阀high vacuum valve: BwpEIV@b] 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: w[ )97d 5-13.手动阀manually operated valve: %?<Y&t 5-14.气动阀pneumatically operated valve: $K& #R- 5-15.电磁阀electromagnetically operated valve: s{g^K#BoFi 5-16.电动阀valve with electrically motorized operation: &+0WZ#VI 5-17.挡板阀baffle valve: jEK{QOq0 5-18.翻板阀flap valve: >|j8j:S[ 5-19.插板阀gate valve: tUOqF 5-20.蝶阀butterfly valve: Sq<ds}o'8l M3m)ui z 6.真空管路 [f ._w~ 6-1.粗抽管路roughing line: ^@91BY 6-2.前级真空管路backing line: 'xK ,|U 6-3.旁通管路;By-Pass管路 by-pass line: eMT}"u8$A 6-4.抽气封口接头pumping stem: Gl am(V1 6-5.真空限流件limiting conductance: ZMp5d4y5 6-6.过滤器filter: W20qn>{z 5. 1.一般术语 XC*!=h* 1-1真空镀膜vacuum coating: Nqy)jfyex 1-2基片substrate: qoZUX3{ 1-3试验基片testing substrate: FaA'%P@ 1-4镀膜材料coating material: ][D/=-
1-5蒸发材料evaporation material: G~.bi<(v 1-6溅射材料sputtering material: :t)<$dtf[ 1-7膜层材料(膜层材质)film material: -F->l5 1-8蒸发速率evaporation rate: ta;q{3fe 1-9溅射速率sputtering rate: $u"*n\k> 1-10沉积速率deposition rate: :,8eM{.Q 1-11镀膜角度coating angle: 1uwzo9Yg %f-Uwq&}Y" 2.工艺 ]K<mkUpY 2-1真空蒸膜vacuum evaporation coating: ?z{Z!Bt?=) (1).同时蒸发simultaneous evaporation: zn+5pn&? (2).蒸发场蒸发evaporation field evaporation: pw,
<0UhV (3).反应性真空蒸发reactive vacuum evaporation: [}*xxy (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: .\rJ|HpZ1J (5).直接加热的蒸发direct heating evaporation: BN]{o(EB (6).感应加热蒸发induced heating evaporation: >Hd Pcsl L (7).电子束蒸发electron beam evaporation: AQ<2 "s (8).激光束蒸发laser beam evaporation: QKP@+E_U (9).间接加热的蒸发indirect heating evaporation: Jf</83RZ (10).闪蒸flash evaportion: Au"7w=G`f 2-2真空溅射vacuum sputtering: !'5t(Zw5 (1).反应性真空溅射 reactive vacuum sputtering: ^U;r>[T9h (2).偏压溅射bias sputtering: IKs2.sj"o (3).直流二级溅射direct current diode sputtering: P`$Y73L (4).非对称性交流溅射asymmtric alternate current sputtering: fU^6h`t (5).高频二极溅射high frequency diode sputtering: >Y)FoHa+/ (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: {G i:W/jJ (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: 8GKqPS+
(8).离子束溅射ion beam sputtering: +)<H,?/ (9).辉光放电清洗glow discharge cleaning: JI7.:k; 2-3物理气相沉积PVD physical vapor deposition: )4O* D92 2-4化学气相沉积CVD chemical vapor deposition: p=jIDM' 2-5磁控溅射magnetron sputtering: Jc9BZ`~i 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: XEpwk,8*g 2-7空心阴极离子镀HCD hollow cathode discharge deposition: \L]T|]}( 2-8电弧离子镀arc discharge deposition: u.!<)VIJx R=m9[TgBm 3.专用部件 nq,P.~l 3-1镀膜室coating chamber: 0(h'ZV 3-2蒸发器装置evaporator device: WoSJp5By$ 3-3蒸发器evaporator: r>kDRIHB 3-4直接加热式蒸发器evaporator by direct heat: uzO3 _.4Y 3-5间接加热式蒸发器evaporator by indirect heat: ]
RLEyDB 3-7溅射装置sputtering device: LVAnZ'h/| 3-8靶target: sqjv3=} 3-10时控挡板timing shutter: ~'u %66 3-11掩膜mask: <&87aDYz 3-12基片支架substrate holder: R1j)0b6cQ% 3-13夹紧装置clamp: ptCAtEO72 3-14换向装置reversing device: Y)KO*40c 3-15基片加热装置substrate heating device: > Du>vlTY 3-16基片冷却装置substrate colding device: \!Fx,#r$7- EwuBL6kN 4.真空镀膜设备 ATq-&1hs 4-1真空镀膜设备vacuum coating plant: d_!lRQ^N (1).真空蒸发镀膜设备vacuum evaporation coating plant: se^(1R k (2).真空溅射镀膜设备vacuum sputtering coating plant: #h~v(Z} 4-2连续镀膜设备continuous coating plant: 38 HnW 4-3半连续镀膜设备semi- continuous coating plant =k|hH~ 6. 1.漏孔 M
hJ;)( 1-1漏孔leaks: $/XR/ 1-2通道漏孔channel leak: ?D]qw4 J 1-3薄膜漏孔membrane leak: lBcRt)_O7 1-4分子漏孔molecular leak: F3,djZq 1-5粘滞漏孔vixcous leak: TkjPa};R 1-6校准漏孔calibrated leak: [R9!Tz 1-7标准漏孔reference leak : ?[~)D}] j 1-8虚漏virtual leak: Mz:t[rfs 1-9漏率leak rate: Ymr\8CG/ 1-10标准空气漏率standard air leak rate: ;DN:AgXP 1-11等值标准空气漏率equivalent standard air leak rate: -mPrmapb3 1-12探索(示漏)气体: g$eZT{{W O:86* 2.本底 7J$5dFV2 2-1本底background: /{7we$+,p 2-2探索气体本底search gas background : y|0I3n]e 2-3漂移drift: EHC^ [5 2-4噪声noise: cQ<* (KU GP._C=] ?c 3.检漏仪 k w]m7T 3-1检漏仪leak detector: *iW$>Yjb 3-2高频火花检漏仪H.F. spark leak detector: GP,xGZZ 3-3卤素检漏仪halide leak detector: AG==A&d>$ 3-4氦质谱检漏仪helium mass spectrometer leak detector: eOI#T'5 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: Q`4]\)Dp A_\ZY0Xt 4.检漏 xB&6f") 4-1气泡检漏leak detection by bubbles: -ipfGb 4-2氨检漏leak detection by ammonia: ;N/=)m 4-3升压检漏leak detection of rise pressure: ok+-#~VTn 4-4放射性同位素检漏radioactive isotope leak detection: eODprFkt} 4-5荧光检漏fluorescence leak detection B%e#u.'6 7. 1.一般术语 `+go|
5N2 1-1真空干燥vacuum drying: %hqhi@q# 1-2冷冻干燥freeze drying : S.kFs{;1x 1-3物料material: YvP u%=eF 1-4待干燥物料material to be dried: [va7+=[1= 1-5干燥物料dried material : 7L=V{,,v 1-6湿气moisture;humidity: .Iret: 1-7自由湿气free moisture: UIl^s8/ 1-8结合湿气bound moisture: :/
yR 1-9分湿气partial moisture: >5|;8v-r
1-10含湿量moisture content: 0Q_@2 1-11初始含湿量initial moisture content: 1q[vNP=g& 1-12最终含湿量final residual moisture: `Wf)qMb 1-13湿度degree of moisture ,degree of humidity : 0- 'f1 1S 1-14干燥物质dry matter : !Ci\Zg 1-15干燥物质含量content of dry matter: ,UD,)ZPf[ 43?J~}<Vs 2.干燥工艺 yfD)|lK 2-1干燥阶段stages of drying : N>A*N,+ (1).预干燥preliminary dry: h""a#n)q}` (2).一次干燥(广义)primary drying(in general): 7
i|_PP_ (3).一次干燥(冷冻干燥)primary drying(freeze-drying): 9g*MBe: (4).二次干燥secondary drying: x_3Zd 2-2.(1).接触干燥contact drying: VK)K#!O8 (2).辐射干燥 drying by radiation : |5}~n"R5 (3).微波干燥microwave drying: y&.[Nt '+ (4).气相干燥vapor phase drying: Va1 eG]jQ (5).静态干燥static drying: t7%!~s=,M (6).动态干燥dynamic drying: L|3wGY9E 2-3干燥时间drying time: 8 '2lc 2-4停留时间length of stay(in the drying chamber): 3ppY@_1 2-5循环时间cycle time: BlVk?n 2-6干燥率 dessication ratio : \c! LC4pE 2-7去湿速率mass flow rate of humidity: ,cvLvN8 2-8单位面积去湿速率mass flow rate of humidity per surface area: _faI*OY8 2-9干燥速度 drying speed : SRN:!- 2-10干燥过程drying process: "$Wi SR 2-11加热温度heating temperature: jaAv_=93f 2-12干燥温度temperature of the material being dried : !8|] R 2-13干燥损失loss of material during the drying process : 2wWL]`(E 2-14飞尘lift off (particles): <N %8"o 2-15堆层厚度thickness of the material: GLe(?\Ug= S!GjCog^J 3.冷冻干燥 H>-?/H 3-1冷冻freezing: H].
4~ 8 (1).静态冷冻static freezing: !P, 9Sg&5) (2).动态冷冻dynamic freezing: {. N" 6P (3).离心冷冻centrifugal freezing: Qhnz7/a9 (4).滚动冷冻shell freezing: -ANp88a (5).旋转冷冻spin-freezing: ]]s_ 8u3 (6).真空旋转冷冻vacuum spin-freezing: b&g9A{t (7).喷雾冷冻spray freezing: N
b(f (8).气流冷冻air blast freezing: E5lC'@D cz 3-2冷冻速率rate of freezing: [|2uu."$ 3-3冷冻物料frozen material: eB:obz
3-4冰核ice core:
N1UE u,j 3-5干燥物料外壳envelope of dried matter: :5@cjj 3-6升华表面sublimation front: qFV=Pk 3-7融化位置freezer burn: WT!8.M;Kv &50Kn[ 4.真空干燥设备;真空冷冻干燥设备 C"/]X 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: /h0<0b?i 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: (~TP 4-3加热表面heating surface: $2F*p#l(<Z 4-4物品装载面shelf : [?BmW{*u. 4-5干燥器的处理能力throughput (of the vacuum drying chamber): `}F=Zjy 4-6单位面积干燥器处理能力throughput per shelf area: gU/\'~HG 4-7冰冷凝器ice condenser: E~zLhJTUL' 4-8冰冷凝器的负载load of the ice condenser: (J):
>\a] 4-9冰冷凝器的额定负载rated load of the ice condenser Zg7~&vs$ 8. 1.一般术语 c3|;'s 1-1试样sample : `"m"qUd (1).表面层surface layer: _f,q8ZkSr (2).真实表面true surface: cW),Y|8 (3).有效表面积effective surface area: M~7?m/Wj (4).宏观表面;几何表面macroscopic surface area; geometric surface area: 3vOI=ar=L~ (5).表面粒子密度surface particle density: J=TbZL4y}4 (6).单分子层monolayer: IgC)YIhd (7).表面单分子层粒子密度monolayer density: =[`wyQe`_ (8).覆盖系数coverage ratio: <P( K,L?r 1-2激发excitation: bE^Z;q19 (1).一次粒子primary particle: KbH#g>.oB (2).一次粒子通量primary particle flux: gsc*![N (3).一次粒子通量密度density of primary particle flux: ZzI^*Nyg (4).一次粒子负荷primary particle load: ;4F[*VF!w (5).一次粒子积分负荷integral load of primary particle: P-No;/!B# (6).一次粒子的入射能量energy of the incident primary particle: `R8~H7{I6 (7).激发体积excited volume: f9JD_hhP' (8).激发面积excited area: vsoj] R$C (9).激发深度excited death: 8ne'x!1 D (10).二次粒子secondary particles: %M9^QHyo@ (11).二次粒子通量secondary particle flux:
W1y,.6 (12).二次粒子发射能energy of the emitted secondary particles: 622mNY (13).发射体积emitting volume: v{=-#9-4
& (14).发射面积emitting area: )TyL3Z\>( (15).发射深度emitting depth: nH% / (16).信息深度information depth:
guSgTUJ} (17).平均信息深度mean information depth: u[ s+YGS 1-3入射角angle of incidence: e7/J:n$ 1-4发射角angle of emission: C-_u; NEu 1-5观测角observation: o LX6w 1-6分析表面积analyzed surface area: &)fPz-s 1-7产额 yield : d&?B/E^ 1-8表面层微小损伤分析minimum damage surface analysis: 43:~kCF[s 1-9表面层无损伤分析non-destructive surface analysis: LiQs;$V 1-10断面深度分析 profile analysis in depth; depth profile analysis : ]$nJn+85@b 1-11可观测面积observable area: z]P |% 1-12可观测立体角observable solid angle : MkJL9eG 1-13接受立体角;观测立体角angle of acceptance: wC=IN 1-14角分辨能力angular resolving power: v1 oS f 1-15发光度luminosity: sNX$ =<E 1-16二次粒子探测比detection ratio of secondary particles: # JuO 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ?e]4HHgU] 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: R) @k| 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis:
_BtlO(0& 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: LC[,K 1-21本底压力base pressure: K]kL?-A#' 1-22工作压力working pressure: %F&j B PU?kQZU~) 2.分析方法 MQ\:/]a 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: r7ywK9UL (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : *i%!j/QDAP (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: .# j)YG 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: 1oX"}YY1 2-3离子散射表面分析ion scattering spectroscopy: s o~p+] 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: 92
Pp.Rh 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: ,=6Eju#P 2-6离子散射谱仪ion scattering spectrometer: Fl*@@jQ8cV 2-7俄歇效应Auger process: [(btpWxb^ 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: Jz%&-e3 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus: <hy>NM@$ 2-10光电子谱术photoelectron spectroscopy : ~01rc (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: wM!QU{Lz (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: fRrHWE+ 2-11光电子谱仪photoelectron spectrometer: S8"X7\d{ 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: 5QSd$J 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: k92X)/ll' 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): /~
V"v"7E 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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