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2007-02-28 23:18 |
真空术语全集
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E[\1 --------------------------------------------------- <'N"GLJ 真空术语 $9YAq/#Q
&OQ37(<_ 1.标准环境条件 standard ambient condition: 'i+j;.
2.气体的标准状态 standard reference conditions forgases: q4=Gj`\43 3.压力(压强)p pressure: ', ~ 4.帕斯卡Pa pascal: o 9\J
vJk 5.托Torr torr: 0`UI^Y~Q 6.标准大气压atm standard atmosphere: 3V=wW{;x 7.毫巴mbar millibar: l7 Pn5c 8.分压力 partial pressure:
PgIH( 9.全压力 total pressure: =hFIH\x 10.真空 vacuum: e}>3<Dh 11.真空度 degree of vacuum: "`g5iUHqUl 12.真空区域 ranges of vacuum: 0"}qND 13.气体 gas: #0$fZ 14.非可凝气体 non-condensable gas: ZDny=&># 15.蒸汽vapor: $0 ]xeD0X 16.饱和蒸汽压saturation vapor pressure: PtsQV! 17.饱和度degree of saturation: ^G(U@-0.. 18.饱和蒸汽saturated vapor: =sZ58xA 19.未饱和蒸汽unsaturated vapor: rf?%- X(V 20.分子数密度n,m-3 number density of molecules: v}\4/u 21.平均自由程ι、λ,m mean free path: +2xgMN6B@ 22.碰撞率ψ collision rate: 5tx!LGOK 23.体积碰撞率χ volume collision rate: .w,$ TezGP 24.气体量G quantity of gas: #No3}O;"g 25.气体的扩散 diffusion of gas: W_.WMbT 26.扩散系数D diffusion coefficient; diffusivity: UOIB}ut
V 27.粘滞流 viscous flow: y'L7o
V?L9 28.粘滞系数η viscous factor: V#X#rDfJZ 29.泊肖叶流 poiseuille flow: ,="hI:*< 30.中间流 intermediate flow: A |u-VXQ 31.分子流 molecular flow: )iX2r{ 32克努曾数 number of knudsen: }TQa<;Q 33.分子泻流 molecular effusion; effusive flow: ~aPe?{yIUa 34.流逸 transpiration: "hid3"G 35.热流逸 thermal transpiration: ;gGq\c 36.分子流率qN molecular flow rate; molecular flux: d!{]CZ"@ 37.分子流率密度 molecular flow rate density; density of molecular flux: )_n=it$ 38.质量流率qm mass flow rare: eWWqK9B.- 39.流量qG throughput of gas: JAx0(MZO 40.体积流率qV volume flow rate: rjK]zD9 41.摩尔流率qυ molar flow rate: CS'LW;#[ 42.麦克斯韦速度分布 maxwellian velocity distribution: bog3=Ig- 43.传输几率Pc transmission probability: }#r awVe= 44.分子流导CN,UN molecular conductance: }ChS cY 45.流导C,U conductance: -*A1[Z ? 46.固有流导Ci,Ui intrinsic conductance: P{,A% t 47.流阻W resistance: Upa F>,kM 48.吸附 sorption: ?wP/l 49.表面吸附 adsorption: 2cEvsvw> 50.物理吸附physisorption: %rlMjF'tG 51.化学吸附 chemisorption: 5G2G<[p5oQ 52.吸收absorption: !He_f-eZ 53.适应系数α accommodation factor: v-Tkp
Yn 54.入射率υ impingement rate: U ,NGV0 55.凝结率condensation rate: ''dS{nQs 56.粘着率 sticking rate: *8r^!(Kj 57.粘着几率Ps sticking probability: x(n|zp (" 58.滞留时间τ residence time: %nRgHN> 59.迁移 migration: FI,K 0sO/| 60.解吸 desorption: nW)?cQ
I 61.去气 degassing: ZIN1y;dJ 62.放气 outgassing: J}NMF#w/; 63.解吸或放气或去气速率qGU desorption or outgassing or degassing rate: IwXWtVL 64.蒸发率 evaporation rate: qjObu\r 65.渗透 permeation: !YPwql(
66.渗透率φ permeability: H#i,Ve' 67.渗透系数P permeability coefficient '_b3m2I.G 2. 1.真空泵 vacuum pumps N5c*#lHI 1-1.容积真空泵 positive displacement pump: !2kM ⑴.气镇真空泵 gas ballast vacuum pump: Na$.VT ⑵.油封(液封)真空泵oil sealed (liquid-sealed) vacuum pump: zo1T`"Y ⑶.干封真空泵 dry-sealed vacuum pump: et2;{Tb,5 ⑷.往复真空泵 piston vacuum pump: ;A4qE W ⑸.液环真空泵 liquid ring vacuum pump: wPEK5=\4Ob ⑹.旋片真空泵 sliding vane rotary vacuum pump: Atb`Q'Yrw ⑺.定片真空泵 rotary piston vacuum pump: svx7 ⑻.滑阀真空泵 rotary plunger vacuum pump: hraR:l
D ⑼.余摆线真空泵 trochoidal vacuum pump: 6cd!;Ca ⑽.多室旋片真空泵 multi-chamber sliding vane rotary vacuum pump:
W[I$([ ⑾.罗茨真空泵 roots vacuum pump: E
mg=, 1-2.动量传输泵 kinetic vacuum pump: \q?^DI:` ⑴.牵引分子泵molecular drag pump: ny{S&f ⑵.涡轮分子泵turbo molecular pump: 4#{f8 ⑶.喷射真空泵ejector vacuum pump: vh.-9eD ⑷.液体喷射真空泵liquid jet vacuum pump: *^%+PQ ⑸.气体喷射真空泵gas jet vacuum pump: O=t~.])) ⑹.蒸汽喷射真空泵vapor jet vacuum pump : gg.]\#3g ⑺.扩散泵diffusion pump : 0$ON`Vsu| ⑻.自净化扩散泵self purifying diffusion pump: Mq#m;v$E ⑼.分馏扩散泵 fractionating diffusion pump : g zlxkv-F{ ⑽.扩散喷射泵diffusion ejector pump : aGBd~y@e ⑾.离子传输泵ion transfer pump: RP$h;0EQG 1-3.捕集真空泵 entrapment vacuum pump: #8sy QWlG ⑴吸附泵adsorption pump: =/}Rnl+c ⑵.吸气剂泵 getter pump: W/\pqH ⑶.升华(蒸发)泵 sublimation (evaporation)pump : zJP jsD] ⑷.吸气剂离子泵getter ion pump: !KJA)znx;( ⑸.蒸发离子泵 evaporation ion pump: )u+O~Y95&i ⑹.溅射离子泵sputter ion pump: CuK>1_Dq ⑺.低温泵cryopump: KTt+}-vP^ %X's/;(Lx` 2.真空泵零部件 c&1_lI,tH 2-1.泵壳 pump case: 71@kIJI 2-2.入口 inlet: 5Q
<vS"g 2-3.出口outlet: }-sh 2-4.旋片(滑片、滑阀)vane; blade : a_bZT4 2-5.排气阀discharge valve: Lc?"4 2-6.气镇阀gas ballast valve: %f'=9pit 2-7.膨胀室expansion chamber: p6NPWaBR
2-8.压缩室compression chamber: U#[T!E 2-9.真空泵油 vacuum pump oil: H\V?QDn 2-10.泵液 pump fluid: y{&%]Fq
<5 2-11.喷嘴 nozzle: * #E_KW1RV 2-13.喷嘴扩张率nozzle expansion rate: ZV:df 6S 2-14.喷嘴间隙面积 nozzle clearance area : hxj\ 2-15.喷嘴间隙nozzle clearance: 6\u. [2lE^ 2-16.射流jet: 0<:rp]<, 2-17.扩散器diffuser: Y-Q)sv 2-18.扩散器喉部diffuser thoat: ," 5HJA4 2-19.蒸汽导管vapor tube(pipe;chimney): +,,dsL 2-20.喷嘴组件nozzle assembly: :-#7j}
R& 2-21.下裙skirt: ;zze.kb&F
t\LE\[XM> 3.附件 [L7s(Zs> 3-1阱trap: BriL^] ⑴.冷阱 cold trap: @{#'y4\> ⑵.吸附阱sorption trap: H{yBDxw ⑶.离子阱ion trap: 9(qoME}>= ⑷.冷冻升华阱 cryosublimation trap: Y'jgp Vt 3-2.挡板baffle: yUf`L=C: 3-3.油分离器oil separator: IJKdVb~ 3-4.油净化器oil purifier: g33Y$Xdk 3-5.冷凝器condenser: B_iaty Z2@e~&L 4.泵按工作分类 L~e0^X? 4-1.主泵main pump: Gh.?6kuh 4-2.粗抽泵roughing vacuum pump: @=Pc{xp 4-3.前级真空泵backing vacuum pump: 4YI6& 4-4.粗(低)真空泵 roughing(low)vacuum pump: =SuJ* 4-5.维持真空泵holding vacuum pump: \1&4wzT 4-6.高真空泵high vacuum pump: gx^_bHh 4-7.超高真空泵ultra-high vacuum pump: d&L 4-8.增压真空泵booster vacuum pump: }f_@@#KB? H" A@Q.' 5.真空泵特性 >TM{2b,(p 5-1.真空泵的抽气速率(体积流率)s volume flow rate of a vacuum pump: |A,.mOT 5-2.真空泵的抽气量Q throughput of vacuum pump:。 cUP1Uolvn 5-3.起动压力starting pressure: ]K8G}|Wy6 5-4.前级压力 backing pressure : [_`yy 5-5.临界前级压力 critical backing pressure: sr[[xzL 5-6.最大前级压力maximum backing pressure: -dF (_ %C 5-7.最大工作压力maximum working pressure: h4itXJy52B 5-8.真空泵的极限压力ultimate pressure of a pump: r QNm2h 5-9.压缩比compression ratio: pg!oi?Jn 5-10.何氏系数Ho coefficient: ~|, "w90 5-11.抽速系数speed factor: -IVWkA)7 5-12.气体的反扩散back-diffusion of gas: =bP<cC=3b 5-13.泵液返流back-streaming of pump fluid: qhG2j; 5-14.返流率back-streaming rate Z_dL@\#| 5-15.返迁移back-migration: =`>ei 5-16.爆腾bumping: b@=H$" 5-17.水蒸气允许量qm water vapor tolerable load: As5l36 5-18.最大允许水蒸气入口压力maximum tolerable water vapor inlet pressure: 6 <`e]PT 5-19.蒸汽喷射泵、扩散泵或扩散喷射泵的加热时间warm-up time for a vapor jet pump or a diffusion pump or a diffusion ejector pump: 6Y6t.j0vN. 5-20.蒸汽喷射泵、扩散泵或扩散喷射泵的冷却时间cool-down time for a vapor jet pump or a diffusion pump or a diffusion ejector pump RTbV!I 3. 1.一般术语 >dgq2ok!u 1-1.压力计pressure gauge: _<2{8>EVf 1-2.真空计vacuum gauge: E}F-*go ⑴.规头(规管)gauge head: TG8 U=9qt ⑵.裸规nude gauge : p:$v,3: ⑶.真空计控制单元gauge control unit : {|OXiRm' ⑷.真空计指示单元gauge indicating unit : e2G;_: q9VBK(,X 2.真空计一般分类 q^6#.} 2-1.压差式真空计differential vacuum gauge: i"Hc( lg 2-2.绝对真空计 absolute vacuum gauge: @`nG&U 2-3.全压真空计total pressure vacuum gauge: 9 `bLQd 2-4.分压真空计;分压分析器partial pressure vacuum gauge; partial pressure analyser: wpC.!T 2-5.相对真空计relative vacuum gauge : ts_|7Ev Eb6cL`#N 3.真空计特性 {*g{9` 3-1.真空计测量范围pressure range of vacuum gauge: ]oz >/\! 3-2.灵敏度系数sensitivity coefficient: DnhbMxh8o 3-4. 电离规系数(压力单位倒数)ionization gauge coefficient (in inverse pressure units): ^?\|2H 3-5.规管光电流photon current of vacuum gauge head: }X=c|]6i^ 3-6.等效氮压力equivalent nitrogen pressure : 4bdCbI 3-7.X射线极限值 X-ray limit: _I3"35a 3-8.逆X射线效应anti X-ray effect: yP} |8x 3-9.布利尔斯效应blears effect: X7-[#} T [euR<i*I# 4.全压真空计 Y=_*Ai 4-1.液位压力计liquid level manometer: 2h]CZD4 4-2.弹性元件真空计elastic element vacuum gauge: Ma(Q~G
. 4-3.压缩式真空计compression gauge: iFcSz 4-4.压力天平pressure balance: sredL#]BA 4-5.粘滞性真空计viscosity gauge : -#G>`T~ 4-6.热传导真空计thermal conductivity vacuum gauge :
JV4fL~ 4-7.热分子真空计thermo-molecular gauge: i|,}y`C# 4-8.电离真空计ionization vacuum gauge: U7g,@/Qx 4-9.放射性电离真空计radioactive ionization gauge: 9&Y|,&W 4-10.冷阴极电离真空计cold cathode ionization gauge: #j+cl' 4-11.潘宁真空计penning gauge: ]B~(yh 4-12.冷阴极磁控管真空计cold cathode magnetron gauge: -bSM]86 4-13.放电管指示器discharge tube indicator: \Nf[8n#{ 4-14.热阴极电离真空计hot cathode ionization gauge: 5&_")k3$* 4-15.三极管式真空计triode gauge: iPG:w+G 4-16.高压力电离(中真空)真空计high pressure (medium vacuum) ionization gauge: n_Y7*3/b-o 4-17.B-A型电离真空计Bayard-Alpert gauge: e0ni 4-18.调制型电离真空计modulator gauge: x;} 25A| 4-19.抑制型电离真空计suppressor gauge: R^$EnrY(< 4-20.分离型电离真空计extractor gauge: 8cMX=P 4-21.弯注型电离真空计bent beam gauge: -k2|`t _ 4-22.弹道型电离真空计 orbitron gauge : )Spa
F)N8 4-23.热阴极磁控管真空计hot cathode magnetron gauge: <}c7E3Uc Ly2!(,FB. 5.分压真空计(分压分析器) h#)\K|
qs 5-1.射频质谱仪radio frequency mass spectrometer: FzCXA=m 5-2.四极质谱仪(四级滤质器)quadrupole mass spectrometer;quadrupole mass filer: jA~omX2A 5-3.单极质谱仪momopole mass spectrometer: Bf+~&I#E 5-4.双聚焦质谱仪double focusing mass spectrometer: GiK,+M"d 5-5.磁偏转质谱仪magnetic deflection mass spectrometer: ]:T:cO0_n 5-6.余摆线聚焦质谱仪trochoidal focusing mass spectrometer: d1t_o2 5-7.回旋质谱仪omegatron mass spectrometer: OUO'w6m! 5-8.飞行时间质谱仪time of flight mass spectrometer: w~pe?j_F$ !Z{7X ^ 6.真空计校准 v^p* l0r6: 6-1.标准真空计reference gauges: <pKOFN%m 6-2.校准系统system of calibration: 55] MRv 6-3.校准系数K calibration coefficient: 'gD./|Z0 6-4.压缩计法meleod gauge method: ,VUOsNN4\ 6-5.膨胀法expansion method: usoyH0t!? 6-6.流导法flow method: 4k<U5J 4. 1.真空系统vacuum system 'IVC!uL,% 1-1.真空机组pump system: ]]}iSw' 1-2.有油真空机组pump system used oil : 7
TM-uA$ 1-3.无油真空机组oil free pump system Zn Rj}y 1-4.连续处理真空设备continuous treatment vacuum plant: Ky8,HdAq 1-5.闸门式真空系统vacuum system with an air-lock: 4 CiRh 1-6.压差真空系统differentially pumped vacuum system: U;u4ey 1-7.进气系统gas admittance system: Q[H4l({E K9VP@[zbJ 2.真空系统特性参量 |DVFi2 2-1.抽气装置的抽速volume flow rate of a pumping unit : rTJqw@]#WH 2-2.抽气装置的抽气量throughput of a pumping unit : | "M1+(k7 2-3.真空系统的放气速率degassing(outgassing) throughput of a vacuum system: LtKR15h, 2-4.真空系统的漏气速率leak throughput of a vacuum system: j':<7n/A 2-5.真空容器的升压速率rate of pressure rise of a vacuum chamber: I.~=\%Z{ 2-6.极限压力ultimate pressure: A5 4u} 2-7.残余压力residual pressure: Y<N#{)Q 2-8.残余气体谱residual gas spectrum: 8-kR {9r 2-9.基础压力base pressure: !B9Yw/Ba 2-10.工作压力working pressure: i/!KUbt 2-11.粗抽时间roughing time: #KHj.Vg 2-12.抽气时间pump-down time: opzlh@R
3 2-13.真空系统时间常数time constant of a vacuum system: B(eiRr3 2-14.真空系统进气时间venting time: d}Y#l}!E6 A%&lW9z7 3.真空容器 Su
+<mW 3-1.真空容器;真空室vacuum chamber: ={6vShG)m 3-2.封离真空装置sealed vacuum device: GGZ9DC\{ 3-3.真空钟罩vacuum bell jar: )S#?'gt* 3-4.真空容器底板vacuum base plate: )`gxaT>&l 3-5.真空岐管vacuum manifold: Hxc>? 3-6.前级真空容器(贮气罐)backing reservoir: 2sEG#/Y= 3-7.真空保护层outer chamber: wsAb8U C_ 3-8.真空闸室vacuum air lock: YETGq- 3-9.真空冷凝器;蒸汽冷凝器device for condensing vapor: W>b\O"> vYo~36 4.真空封接和真空引入线 c0X1})q$ 4-1.永久性真空封接permanent seal : Zba<|C 4.2.玻璃分级过渡封接graded seal : @.G;dL.f{ 4-3.压缩玻璃金属封接compression glass-to-metal seal: 'fzJw 4-4.匹配式玻璃金属封接matched glass-to-metal seal: j!0-3YKv 4-5.陶瓷金属封接ceramic-to-metal seal: #0^a-47PA< 4-6.半永久性真空封接semi-permanent seal : ew c:-2Y^ 4-7.可拆卸的真空封接demountable joint: 6vU%Y_n=y] 4-8.液体真空封接liquid seal 1NrNTBI@ 4-9.熔融金属真空封接molten metal seal: ye}86{l 4-10.研磨面搭接封接ground and lapped seal: tv]9n8v 4-11.真空法兰连接vacuum flange connection:
7(o:J 4-12.真空密封垫vacuum-tight gasket: G \$x. 4-13.真空密封圈ring gasket: .H&XPW 4-14.真空平密封垫flat gasket: -y$<fu9
e 4-15.真空引入线feedthrough leadthrough: G%}k_vi&q 4-16.真空轴密封shaft seal: ]4lC/&nm 4-17.真空窗vacuum window: X@A8~kj1 4-18.观察窗viewing window: e%7#e%1s $HRl:KDdP~ 5.真空阀门 ,WoV)L'? 5-1.真空阀门的特性characteristic of vacuum valves: 7o7FW=^ ⑴.真空阀门的流导conductance of vacuum valves: F"23vG>3 ⑵.真空阀门的阀座漏气率leak rate of the vacuum seat: }p8iq 5-2.真空调节阀regulating valve: %qVD-Jln 5-3.微调阀 micro-adjustable valve: yhnPS4DC 5-4.充气阀charge valve: .^ba*qb`{ 5-5.进气阀gas admittance valve: srKEtd" 5-6.真空截止阀break valve: f&Juq8s_0 5-7.前级真空阀backing valve: 25W #mh,' 5-8.旁通阀 by-pass valve: A9GSeW< 5-9.主真空阀main vacuum valve: C_h$$G{S( 5-10.低真空阀low vacuum valve: ;j<#VS-] 5-11.高真空阀high vacuum valve: <e@4;Z(h04 5-12.超高真空阀;UHV阀 ultra-high vacuum valve: I%z,s{9p 5-13.手动阀manually operated valve: Z:,`hW*A6 5-14.气动阀pneumatically operated valve: g/w<T+v 5-15.电磁阀electromagnetically operated valve: I &%
Z*H 5-16.电动阀valve with electrically motorized operation: w,<n5dMv 5-17.挡板阀baffle valve: ow'CwOj$ 5-18.翻板阀flap valve: WZviC_ 5-19.插板阀gate valve: :"K9(XKKU 5-20.蝶阀butterfly valve: dTwYDV}: &hM7y7 6.真空管路 7H,)heA 6-1.粗抽管路roughing line: .W\x{h 6-2.前级真空管路backing line: J7kqyo" 6-3.旁通管路;By-Pass管路 by-pass line: e=[@HVr 6-4.抽气封口接头pumping stem: .kfx\,lgm 6-5.真空限流件limiting conductance: 8rLhOA 6-6.过滤器filter: Fgi;% 5. 1.一般术语 GgtYO4, 1-1真空镀膜vacuum coating: n3\~H9 1-2基片substrate: i
G%R'/* 1-3试验基片testing substrate: kJCeQK:W 1-4镀膜材料coating material: =8Z-ORW51 1-5蒸发材料evaporation material: {_Fh3gjb/ 1-6溅射材料sputtering material: o"p['m*g 1-7膜层材料(膜层材质)film material: 4Q,|7@ 1-8蒸发速率evaporation rate: 1q|iw 1-9溅射速率sputtering rate: J(9{P/ 1-10沉积速率deposition rate: ]L
k- -\ 1-11镀膜角度coating angle: Y3H5}4QD 1%";| 2.工艺 \9R=fA1 8 2-1真空蒸膜vacuum evaporation coating: _C,9c7K4 (1).同时蒸发simultaneous evaporation: 1c*;Lr.K (2).蒸发场蒸发evaporation field evaporation: +$#h6V (3).反应性真空蒸发reactive vacuum evaporation: "EZpTy}Ee (4).蒸发器中的反应性真空蒸发reactive vacuum evaporation in evaporator: 2g5jGe*0 (5).直接加热的蒸发direct heating evaporation: @=BApuer+ (6).感应加热蒸发induced heating evaporation: xiqeKoAD (7).电子束蒸发electron beam evaporation: {f;DhB-jj (8).激光束蒸发laser beam evaporation: @qB>qD~WsD (9).间接加热的蒸发indirect heating evaporation: DbYnd%k*4 (10).闪蒸flash evaportion: xZVZYvC,t 2-2真空溅射vacuum sputtering: i*T
-9IP (1).反应性真空溅射 reactive vacuum sputtering: 60WlC0Y~u (2).偏压溅射bias sputtering: #wsi><7 (3).直流二级溅射direct current diode sputtering: ` ^;J<l (4).非对称性交流溅射asymmtric alternate current sputtering: b&RsxW7 (5).高频二极溅射high frequency diode sputtering: *Xh#W7,< (6).热阴极直流溅射(三极型溅射)hot cathode direct current sputtering: :G&:v (7).热阴极高频溅射(三极型溅射)hot cathode high frequency sputtering: jrX`_Y (8).离子束溅射ion beam sputtering: jI9#OEH_g (9).辉光放电清洗glow discharge cleaning: %Nx,ZD@ 2-3物理气相沉积PVD physical vapor deposition: l9&L$,= 2-4化学气相沉积CVD chemical vapor deposition: Yaz/L)Y;R 2-5磁控溅射magnetron sputtering: 3jHE,5m 2-6等离子体化学气相沉积;PCVD plasma chemistry vapor deposition: 7R,;/3wWjG 2-7空心阴极离子镀HCD hollow cathode discharge deposition: ^4et;
F% 2-8电弧离子镀arc discharge deposition: 9ZuKED 3r[s_Y* 3.专用部件 apnpy\in 3-1镀膜室coating chamber: f*VXg[&\\F 3-2蒸发器装置evaporator device: .9UrWBW\I 3-3蒸发器evaporator: gu&W:FY 3-4直接加热式蒸发器evaporator by direct heat: >'jkL5l 3-5间接加热式蒸发器evaporator by indirect heat: >4os%T 3-7溅射装置sputtering device: Q`Rn,kCVy 3-8靶target: ScmwHid:\ 3-10时控挡板timing shutter: alBnN<UM 3-11掩膜mask: _9?v?mL5; 3-12基片支架substrate holder: {Q@?CT 3-13夹紧装置clamp: }rF4M1+B\ 3-14换向装置reversing device: $9u:Ox
2 3-15基片加热装置substrate heating device: ;j+*}|! 3-16基片冷却装置substrate colding device: qx*N-,M%k( 9WV8ZP 4.真空镀膜设备 d<E2=WVB6 4-1真空镀膜设备vacuum coating plant: VKg9^%#b`[ (1).真空蒸发镀膜设备vacuum evaporation coating plant: <;cch6Z (2).真空溅射镀膜设备vacuum sputtering coating plant: fUZCP*7> 4-2连续镀膜设备continuous coating plant: p&D7&Sb[ 4-3半连续镀膜设备semi- continuous coating plant -#R63f& 6. 1.漏孔 md|I?vk 1-1漏孔leaks: j,z)x[3} 1-2通道漏孔channel leak: ?[%.4i;-h 1-3薄膜漏孔membrane leak: [w)KNl 1-4分子漏孔molecular leak: L@f&71 1-5粘滞漏孔vixcous leak: yV31OBC: 1-6校准漏孔calibrated leak: E )2/Vn2 1-7标准漏孔reference leak : {\|XuCF# 1-8虚漏virtual leak: Hr T@Df 1-9漏率leak rate: <N3~X,ch 1-10标准空气漏率standard air leak rate: wB+F/]]|N 1-11等值标准空气漏率equivalent standard air leak rate: dCLNZq h6 1-12探索(示漏)气体: ngk:q5Tp C:f^&4
3 2.本底 2X(2O':Uc 2-1本底background: IoV"t, 2-2探索气体本底search gas background : @moaa} 1 2-3漂移drift: ;";>7k/} 2-4噪声noise: /AYq^ Bx.hFEL 3.检漏仪 "hZ `^"0b 3-1检漏仪leak detector: MYR\W*B'b 3-2高频火花检漏仪H.F. spark leak detector: h]IoH0/ 3-3卤素检漏仪halide leak detector: UF@. 3-4氦质谱检漏仪helium mass spectrometer leak detector: $U(D*0+o/ 3-5检漏仪的最小可检漏率minimum detectable rate of leak detector: P]L%$!g -^8OjGat 4.检漏 |:u5R% 4-1气泡检漏leak detection by bubbles: 6F%6]n 4-2氨检漏leak detection by ammonia: _^!C4?2! 4-3升压检漏leak detection of rise pressure: ETR7%0$r 4-4放射性同位素检漏radioactive isotope leak detection: <,H/7Ba 4-5荧光检漏fluorescence leak detection ;6?,Yhk$h 7. 1.一般术语 Zjs,R{ 1-1真空干燥vacuum drying: `wSoa#U"@ 1-2冷冻干燥freeze drying : 7
Rc/<,X 1-3物料material: {7v|\6@e3 1-4待干燥物料material to be dried: rxZk!- t)L 1-5干燥物料dried material : gLx?0eBBA 1-6湿气moisture;humidity: u{dkUG1ia 1-7自由湿气free moisture: 5r;)Ppo 1-8结合湿气bound moisture: aD~S~L! 1-9分湿气partial moisture: MR,A{X 1-10含湿量moisture content: .dvs&+I 1-11初始含湿量initial moisture content: CI+li H 1-12最终含湿量final residual moisture: &?gcnMg$,J 1-13湿度degree of moisture ,degree of humidity : "g(q)u > 1-14干燥物质dry matter : KCqz] 1-15干燥物质含量content of dry matter: "kucFf f UY:Be8C A 2.干燥工艺 UA#=K+2 2-1干燥阶段stages of drying : F'_z$,X6 (1).预干燥preliminary dry: 3;!a'[W&p (2).一次干燥(广义)primary drying(in general): -7 EwZRS@9 (3).一次干燥(冷冻干燥)primary drying(freeze-drying): Yt r*"- (4).二次干燥secondary drying: % 5BSXAc 2-2.(1).接触干燥contact drying: >as+#rz1p (2).辐射干燥 drying by radiation : Aiqb*v$ (3).微波干燥microwave drying: [ .3Gb}B (4).气相干燥vapor phase drying: &((04<@e (5).静态干燥static drying: IY?o \vC (6).动态干燥dynamic drying: p%OVl[^jp 2-3干燥时间drying time: E>"SC\#7 2-4停留时间length of stay(in the drying chamber): TJ,?C$3 2-5循环时间cycle time: :rvBx" 2-6干燥率 dessication ratio : B\`${O( 2-7去湿速率mass flow rate of humidity: +ERuZc$3, 2-8单位面积去湿速率mass flow rate of humidity per surface area: YKx+z[A/p 2-9干燥速度 drying speed : >PGsY[N 2-10干燥过程drying process: q z!^<
M 2-11加热温度heating temperature: 26j-1c!NGd 2-12干燥温度temperature of the material being dried : [c99m:*+ 2-13干燥损失loss of material during the drying process : $% W.=a'5 2-14飞尘lift off (particles): rhN"#? 2-15堆层厚度thickness of the material: yT(86#st J/[PA[Rf 3.冷冻干燥 Qk^} 3-1冷冻freezing: 8#Y_]Z?) (1).静态冷冻static freezing: \,`iu=YZv (2).动态冷冻dynamic freezing: \i)@"} (3).离心冷冻centrifugal freezing: Rr\fw' (4).滚动冷冻shell freezing: I#zL-RXT (5).旋转冷冻spin-freezing: Lf8{']3 (6).真空旋转冷冻vacuum spin-freezing: [,|4%Y (7).喷雾冷冻spray freezing: eBe5H
=I@ (8).气流冷冻air blast freezing: CTc#*LJx>j 3-2冷冻速率rate of freezing: 3LVL5y7| 3-3冷冻物料frozen material: f{'NO`G 3-4冰核ice core: y!\q', F 3-5干燥物料外壳envelope of dried matter: 0LP>3"Sm 3-6升华表面sublimation front: o:Tpd 0F 3-7融化位置freezer burn:
<XnxAA JOki4N 4.真空干燥设备;真空冷冻干燥设备 o6r
^ 4-1真空干燥设备和真空冷冻干燥设备vacuum drying plant and vacuum freeze drying plant: |:d_IB@ 4-2真空干燥器和冷冻干燥器vacuum drying chamber and freeze drying chamber: xf{=~j/L 4-3加热表面heating surface: @t8{pb;v 4-4物品装载面shelf : \(1WLP$2U 4-5干燥器的处理能力throughput (of the vacuum drying chamber): ]Vf2Mn=]" 4-6单位面积干燥器处理能力throughput per shelf area: 5eas^Rm 4-7冰冷凝器ice condenser: &Fch{%S> 4-8冰冷凝器的负载load of the ice condenser: 'W[Nr 4-9冰冷凝器的额定负载rated load of the ice condenser ;S+"z;$m 8. 1.一般术语 ?:RWHe.P 1-1试样sample : l{_1`rC' (1).表面层surface layer: By0Zz (2).真实表面true surface: o(xt%'L`t (3).有效表面积effective surface area: .~4DlT (4).宏观表面;几何表面macroscopic surface area; geometric surface area: ?qtL*; (5).表面粒子密度surface particle density: vn96o]n (6).单分子层monolayer: 6^nxw>- (7).表面单分子层粒子密度monolayer density: )"^ )Nk (8).覆盖系数coverage ratio: QWK\6 1-2激发excitation: Dn;$4Dak( (1).一次粒子primary particle: XN'<H(G (2).一次粒子通量primary particle flux: qTnk>g_oS& (3).一次粒子通量密度density of primary particle flux: T-lHlm (4).一次粒子负荷primary particle load: \J{%xW> (5).一次粒子积分负荷integral load of primary particle: l' a<k" (6).一次粒子的入射能量energy of the incident primary particle: w Yr M2X@ (7).激发体积excited volume: ; <|m0>X (8).激发面积excited area: K_BF=C.k (9).激发深度excited death: m?<5-"hz (10).二次粒子secondary particles: 6XGqZ!2 (11).二次粒子通量secondary particle flux: {hKf
'd9E (12).二次粒子发射能energy of the emitted secondary particles: :FI4GR*? (13).发射体积emitting volume: u-~?ylh (14).发射面积emitting area: <(2,@_~@r (15).发射深度emitting depth: +~M`rR* (16).信息深度information depth: %|By ?i (17).平均信息深度mean information depth: >)iCKx 1-3入射角angle of incidence: dn=g!= 1-4发射角angle of emission: }9(:W </} 1-5观测角observation: /%h<^YDBf 1-6分析表面积analyzed surface area: nsV;6^> 1-7产额 yield : =h}IyY@o 1-8表面层微小损伤分析minimum damage surface analysis: ~,P." 1-9表面层无损伤分析non-destructive surface analysis: 4 O~zkg 1-10断面深度分析 profile analysis in depth; depth profile analysis : LXcH<) 1-11可观测面积observable area: WiclG8l 1-12可观测立体角observable solid angle : NxQ+z^o\ 1-13接受立体角;观测立体角angle of acceptance: 5y|/}D> 1-14角分辨能力angular resolving power: {!7 ^w 1-15发光度luminosity: 1\BQq 1-16二次粒子探测比detection ratio of secondary particles: a$'=a09 1-17表面分析仪的探测极限detection limit of an apparatus for surface analysis: ?hwT{h 1-18表面层分析仪灵敏度sensitivity of an apparatus for surface analysis: <YBA
7i 1-19表面层分析仪质量分辨能力mass resolving power of an apparatus for surface analysis: bcZ s+FOPd 1-20表面层分析仪能量分辨能力energy resolving power of an apparatus for surface analysis: :g=z}7!s 1-21本底压力base pressure: vOYG&)Jm 1-22工作压力working pressure: mkOj&Q *%xmCPJ 2.分析方法 Q[N6# C:(4 2-1二次离子质谱术;SIMS secondary ion mass spectroscopy: dzPwlCC%- (1).静态二次离子质谱术;静态SIMS static secondary ion mass spectroscopy : Y;WHjW(K (2).动态二次离子质谱术;动态SIMS dynamic secondary ion mass spectroscopy ;dynamic SIMS: `l8^n0- 2-2二次离子质谱仪;SIMS仪secondary ion mass spectrometer; SIMS apparatus: y9L:2f\ 2-3离子散射表面分析ion scattering spectroscopy: t9B]V 2-4低能离子散射的表面分析;离子散射谱测定ISS low energy ion scattering spectroscopy; ISS: :svRn9_8H 2-5卢瑟福后向散射的表面分析;RBS;卢瑟福离子后向散射的表面分析;RIBS Rutherford backscattering spectroscopy; RBS; Rutherford ion backscattering spectroscopy; RIBS: geRD2`3; 2-6离子散射谱仪ion scattering spectrometer: K\]ey;Bd 2-7俄歇效应Auger process: 6P KH% 2-8俄歇电子谱术;AES仪 Auger electron spectroscopy; AES: bC@9
*/i 2-9俄歇电子能谱仪;AES仪Auger electron spectrometer ;AES apparatus:
W{2(fb 2-10光电子谱术photoelectron spectroscopy : X}$uvB}+> (1).紫外光电子谱术;UPS ultraviolet photoelectron spectroscopy; UPS: vo_m$ /O (2).X射线光电子谱术;X-ray photoelectron spectroscopy ; XPS: LE:nmo 2-11光电子谱仪photoelectron spectrometer: L0HkmaH 2-12低能电子衍射;LEED low energy electron diffraction ;LEED: ~L.)<{? 2-13低能电子衍射仪;LEED仪 apparatus for low energy electron diffraction ; LEED-apparatus: 0*KU"JcXd 2-14电子能损失谱术;ELS(也称EELS) electron energy loss spectroscopy(ELS): "##Ylq( " 2-15电子能损失光谱仪;ELS仪 electron energy loss spectrometer ; ELS apparatus
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