| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 6p m~sD
Curing * <q4S(l
Pre-cure: 100oC for 15 minutes I N_gF_@%
Full cure: 100oC for 1 hour (minimum) gQ+9xT d
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin m[rL\](-
5 0Ad,mn<
Mechanical Data =~J fVozU
1. Tensile strength: 800 psi (min) U|?,N0%Z1
2. Lap shear strength: 250 psi (min) %w:'!X><
3. Elongation: 80% (min) -_|]N/v\
4. Hardness: 50 Shore D HsH <m j
O^N P0E
Thermal and Optical Data: DxfMqH[vs
1. Working temperature range: -40oC – 230oC ZAeQ~ j~
2. Decomposition temperature: onset at 3000C (by TGA) n1 v,#GE
3. No change in modulus with temperature Wj O H/$(
4. CTE ~ 200 ppm/oC Pb4q`!
5. Refractive index: 1.43 t:T?7-XIE
6. Transmittance(%) >90 @260-700nm [%~^kq=|
<4f,G]UH_
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