| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 Di])<V Curing >vxWx[fRu Pre-cure: 100oC for 15 minutes oVreP Full cure: 100oC for 1 hour (minimum) w'XSb.\)_m Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin ~D_rZ& ZR2\dH* Mechanical Data .W-=x,`hY4 1. Tensile strength: 800 psi (min) I*9Gb$]= 2. Lap shear strength: 250 psi (min) 3l+|&q[v 3. Elongation: 80% (min) (I!1sE!?1 4. Hardness: 50 Shore D /rOnm=P+Q C?(y2p`d\ Thermal and Optical Data: F*.
/D~K 1. Working temperature range: -40oC – 230oC 6T]Q.\5BZ 2. Decomposition temperature: onset at 3000C (by TGA) aYR\ <02 3. No change in modulus with temperature 63SVIc~wT 4. CTE ~ 200 ppm/oC n }TTq6B 5. Refractive index: 1.43 nE^wxtY 6. Transmittance(%) >90 @260-700nm T77)Np sq48#5Tc^r 如有类似产品,请与我联系shuliang.li@casix.com 0591-83610148
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