| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 X8?@Y@
Curing -m mQ]'.0
Pre-cure: 100oC for 15 minutes ~l {Qz0&
Full cure: 100oC for 1 hour (minimum) C3~~h|:
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin H{Lt,#
2 tCw{Om*
Mechanical Data W
tHJG5
1. Tensile strength: 800 psi (min) Q~k|lTf
2. Lap shear strength: 250 psi (min) {?EmO+![}
3. Elongation: 80% (min) ZM <UiN
4. Hardness: 50 Shore D @
'N $5
\Y!=O=za]
Thermal and Optical Data: DIWyv-
1. Working temperature range: -40oC – 230oC B,%KvL&xMX
2. Decomposition temperature: onset at 3000C (by TGA) O,
:|
3. No change in modulus with temperature (n jTS+?
4. CTE ~ 200 ppm/oC Q u7ML]e?z
5. Refractive index: 1.43 Qz%q #4Zb
6. Transmittance(%) >90 @260-700nm rd$T6 !I
G \,B*$3
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