| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 6g( 2 O[n.
Curing S'2B
Pre-cure: 100oC for 15 minutes ~ #@sZ0/<
Full cure: 100oC for 1 hour (minimum) ym<G.3%1
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin |=,V,*"
Mg-Kh}U
Mechanical Data i ]xyD '0
1. Tensile strength: 800 psi (min) >/}v8 k 1v
2. Lap shear strength: 250 psi (min) jjEkz 5
3. Elongation: 80% (min) \jZvP`.2
4. Hardness: 50 Shore D zj"J~s;?
j9%=8Dn.<
Thermal and Optical Data: V$ <og
1. Working temperature range: -40oC – 230oC d];E99}
2. Decomposition temperature: onset at 3000C (by TGA) :+m|K C(Z
3. No change in modulus with temperature MS><7lk-
4. CTE ~ 200 ppm/oC [2.pZB
5. Refractive index: 1.43 ]J:?@}\^
6. Transmittance(%) >90 @260-700nm v lOMB
{i`BDOaL
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