| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 { U a19~'>
Curing FJ3Xeo s4|
Pre-cure: 100oC for 15 minutes x\j 6=|
Full cure: 100oC for 1 hour (minimum) 5fS89?/?
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin < Tr_,Ya{9
vv,OBL~{
Mechanical Data 5gWn{[[e)y
1. Tensile strength: 800 psi (min) #;'1aT
2. Lap shear strength: 250 psi (min) Do A4#+RU
3. Elongation: 80% (min) 7SE=otZ>
4. Hardness: 50 Shore D B[ F, D
28M! G~|
Thermal and Optical Data: GeN8_i[
1. Working temperature range: -40oC – 230oC 'j];tO6GfC
2. Decomposition temperature: onset at 3000C (by TGA) v/f&rK* >
3. No change in modulus with temperature t#mW`r GE_
4. CTE ~ 200 ppm/oC %&9tn0B
5. Refractive index: 1.43 8"+Re
[
6. Transmittance(%) >90 @260-700nm ni gp83:
: Vq gmn
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