| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 cO*g4VL"[
Curing ]5c(:T F
Pre-cure: 100oC for 15 minutes #aU!f"SS
Full cure: 100oC for 1 hour (minimum) U:C:ugm
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin NeG` D'
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Mechanical Data !43 !JfD
1. Tensile strength: 800 psi (min) DJL.P6 -W
2. Lap shear strength: 250 psi (min) T5."3 i
3. Elongation: 80% (min) L|T?,^
4. Hardness: 50 Shore D e))L&s
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Thermal and Optical Data: xBVOIc[4(
1. Working temperature range: -40oC – 230oC & Y=0 0
2. Decomposition temperature: onset at 3000C (by TGA) ERV]N:(
3. No change in modulus with temperature )6C+0b*
4. CTE ~ 200 ppm/oC v}6iI}r
5. Refractive index: 1.43 *G>
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6. Transmittance(%) >90 @260-700nm p> `rTaeZg
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