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| 燃烧的灵魂 | 2007-01-23 16:55 |  
| 寻找硅胶。用在投影仪的光学元件上。
参数参考 6p m~sD Curing * <q4S(l
 Pre-cure:     100oC for 15 minutes IN_gF_@%
 Full cure:     100oC for 1 hour (minimum) gQ+9xT d
 Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin m[rL\](-
 50Ad,mn<
 Mechanical Data =~JfVozU
 1. Tensile strength:    800 psi (min) U|?,N0%Z1
 2. Lap shear strength:    250 psi (min) %w:'!X><
 3. Elongation:        80% (min) -_|]N/v\
 4. Hardness:        50 Shore D HsH<m	j
 O^NP0E
 Thermal and Optical Data: DxfMqH[vs
 1.   Working temperature range: -40oC – 230oC ZAeQ~	j~
 2.    Decomposition temperature:    onset at 3000C (by TGA)  n1	v,#GE
 3.    No change in modulus with temperature WjOH/$(
 4.    CTE ~ 200 ppm/oC Pb4q`!
 5.    Refractive index:        1.43 t:T?7-XIE
 6.    Transmittance(%)    >90  @260-700nm [%~^kq=|
 <4f,G]UH_
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