| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 qek[p_7
Curing V&75n.L
Pre-cure: 100oC for 15 minutes >#Obhs|S{C
Full cure: 100oC for 1 hour (minimum) @D3Y}nR:
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin uIO<6p)
('u\rc2 R
Mechanical Data $%3"@$
1. Tensile strength: 800 psi (min) ?^<
E#2a
2. Lap shear strength: 250 psi (min) [1\k'5rp
3. Elongation: 80% (min) \U F/_'=K
4. Hardness: 50 Shore D !&n'1gJ)kd
,+gU^dc|hq
Thermal and Optical Data: 2qF
?%
1. Working temperature range: -40oC – 230oC TI9]v(
2. Decomposition temperature: onset at 3000C (by TGA) yi*2^??`
1
3. No change in modulus with temperature tlnU2TT_f
4. CTE ~ 200 ppm/oC % }nNwuJ
5. Refractive index: 1.43 E W {vF|
6. Transmittance(%) >90 @260-700nm v|&Nh?r
% rmn+L),;
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