| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考
l gC
Curing Nt'5}
Pre-cure: 100oC for 15 minutes n >Ei1
Full cure: 100oC for 1 hour (minimum) }u&JX
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 8a h] D
W1s|7
Mechanical Data <ZiO[dEV
1. Tensile strength: 800 psi (min) _H,Rcpy J
2. Lap shear strength: 250 psi (min) E=E<l?ob
3. Elongation: 80% (min) 4Y2>w
4. Hardness: 50 Shore D ra&C|"~E
m "D Ma
Thermal and Optical Data: #&Ee 5xM=
1. Working temperature range: -40oC – 230oC A3n"zxU
2. Decomposition temperature: onset at 3000C (by TGA) u *<
(B
3. No change in modulus with temperature D8ly8]H
4. CTE ~ 200 ppm/oC +M*a.ra0OF
5. Refractive index: 1.43 :wZZ 1qa
6. Transmittance(%) >90 @260-700nm cG?266{g
8v o}
.JIl
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