| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 tM LiG4
|7
Curing
s( _z1
Pre-cure: 100oC for 15 minutes
R &1>\t
Full cure: 100oC for 1 hour (minimum) s m##owI
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin c :Czu
:{<|,3oNdR
Mechanical Data ] MCH]/
1. Tensile strength: 800 psi (min) gLMb,buqC
2. Lap shear strength: 250 psi (min) ^Zl[#:E FP
3. Elongation: 80% (min) E+y_te^+b
4. Hardness: 50 Shore D Q`i@['?p
1
F:b ExQ
Thermal and Optical Data: 6$#,$a O
1. Working temperature range: -40oC – 230oC #~Xj=M %
2. Decomposition temperature: onset at 3000C (by TGA) d8Vqmrc~
3. No change in modulus with temperature `K VSYC
4. CTE ~ 200 ppm/oC ?z &n I#
5. Refractive index: 1.43 jJ"(O-<)D
6. Transmittance(%) >90 @260-700nm d/GS G%zB
(6c/)M H
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