| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 hgG9m[?K
Curing G[ PtkPSJ
Pre-cure: 100oC for 15 minutes b/K PaNv
Full cure: 100oC for 1 hour (minimum) F e*R
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin VD*6g%p
"S[ 450%
Mechanical Data u,ho7ht3(
1. Tensile strength: 800 psi (min) h,:m~0gmj
2. Lap shear strength: 250 psi (min) 6q\bB
3. Elongation: 80% (min) [>I<#_^~
4. Hardness: 50 Shore D (XTG8W sN
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Thermal and Optical Data: ELoDd& d8
1. Working temperature range: -40oC – 230oC Wu/]MBM
2. Decomposition temperature: onset at 3000C (by TGA) 5vQHhwO50k
3. No change in modulus with temperature RMV/&85?y
4. CTE ~ 200 ppm/oC v4TQX<0s
5. Refractive index: 1.43 C} j "Qi`
6. Transmittance(%) >90 @260-700nm ZDJ`qJ8V
a=_g*OK}D
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