| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 0
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Curing fI9 T zpV
Pre-cure: 100oC for 15 minutes 3xj
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Full cure: 100oC for 1 hour (minimum) 9D#"Ey
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin
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Mechanical Data />=)=CGv;
1. Tensile strength: 800 psi (min) %JF.m$-
2. Lap shear strength: 250 psi (min) 2Z;wU]
3. Elongation: 80% (min) u(iEuF;7
4. Hardness: 50 Shore D }pxMO? h$
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Thermal and Optical Data: ZCsL% (
1. Working temperature range: -40oC – 230oC q1Gc0{+)
2. Decomposition temperature: onset at 3000C (by TGA) r`Y[XzT9
3. No change in modulus with temperature biLx-F c
4. CTE ~ 200 ppm/oC yAz`n[
5. Refractive index: 1.43 1Tz5tU9kR
6. Transmittance(%) >90 @260-700nm XUTI0
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