| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 5Lw{0uLr
Curing #sL/y
Pre-cure: 100oC for 15 minutes {d8^@UL
Full cure: 100oC for 1 hour (minimum) ehU"*9
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin 2mQOj$Lv
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Mechanical Data r9<V%PH v
1. Tensile strength: 800 psi (min) '\@W N]
2. Lap shear strength: 250 psi (min) )q^(T1
3. Elongation: 80% (min) |l$
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4. Hardness: 50 Shore D 9g96 d-
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Thermal and Optical Data: Mg+4huT
1. Working temperature range: -40oC – 230oC N_0pO<<cs
2. Decomposition temperature: onset at 3000C (by TGA) KLW&bJ$|j
3. No change in modulus with temperature ]/a
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4. CTE ~ 200 ppm/oC lz-
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5. Refractive index: 1.43 s_TD4~
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6. Transmittance(%) >90 @260-700nm
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