| 燃烧的灵魂 |
2007-01-23 16:55 |
寻找硅胶。用在投影仪的光学元件上。
参数参考 wh+ibH} @!
Curing Lf M(DK
Pre-cure: 100oC for 15 minutes =JH,RQ
*
Full cure: 100oC for 1 hour (minimum) GFk te
Use clean curing oven with no residue volatile materials containing sulfur, nitrogen and tin EQO7 :vb
*3Z#r
Mechanical Data Y
@&nW
1. Tensile strength: 800 psi (min) x[6 Bc
2. Lap shear strength: 250 psi (min) 8}T3Fig,q
3. Elongation: 80% (min) x:lf=D lA
4. Hardness: 50 Shore D RE$-{i
W78-'c
Thermal and Optical Data: !Sh5o'D28
1. Working temperature range: -40oC – 230oC [_1G\z_iE
2. Decomposition temperature: onset at 3000C (by TGA) dL)5~V8s
3. No change in modulus with temperature 2F7R,rr
4. CTE ~ 200 ppm/oC L-dKZ8Q
5. Refractive index: 1.43 0M -AIQ5
6. Transmittance(%) >90 @260-700nm O0YGjS|d
iO`f{?b
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